JCUT-C2 Through-Hole machine

Manual

JCUT CNC Equipment CO.LTD

1014 Room,Huoju Building,No.40 Huayuan Road,Jinan Shandong,China
TEL0531-82374613 FAX0531-82374653

The JCUT-C2 laboratory Constant Hole plating equipment which produced by the Jinan JCUT CNC Equipment Co., Ltd is the latest technology combined with the current industrial development hole plating, applied to achieve industry standard for the laboratory through-hole plating process to provide professional solutions.

Accessories
Product name
Plated phosphor bronze ball Titanium basket Electroplating solution (CuSO4) Conductive Adhesive Hairdryer Included: latex gloves, brush, fine sandpaper

specification

quality 16 1 25liters 1 liter 1

notes
Phosphor copper anode

Turn on the auxiliary holes Media

Rapid drying and through-hole

Installation: 1. The titanium basket hooked on both sides of the cathode, the phosphor bronze ball uniformly put in two titanium baskets. 2. CuSO4 Electroplating solution put into a large bath vat.

Flow Chart
Drilling holes on circuit boards

Put conductive adhesive

Through holes and dry

Polish through sandpaper

Put protection water

Water washing

Plating

Water washing

dry

Engraving or milling

Description: 1. After drilling a circuit board, you need to clean the board surface using fine sandpaper, to make it smooth. And holes can not be stopped. Otherwise it will result in incomplete plating. 2. Stained with conductive by plastic brush (shaking before using), tap the hole in the circuit board, so that the conductive adhesive into hole wall; introduce the conductive tape to the hole wall to make the pore walls are covered with conductive gel. At last you need to use a hair dryer to dry it. 3. To ensure the plating quality, we recommend repeat step 2. 4. To polish the surface of circuit board with sandpaper, blow away dust. 5. Placed in water gently shaking for a few minutes, then take out. Its better to use better water. 6. Using the hair dryer to dry the circuit board. 7. Before into the plating bath, clamping the circuit boards with a folder, hanging in the plating bath of copper cathode tube, left. Make sure that circuit board completely immersed in the plating solution. 8 Open the electroplating power, set to constant, not too much current, or will burn plate. Set plating current size according to the size of circuit board, the following recommendations:

The size of PCB board 10 10 cm 15 15 cm

Setting current 0.9A 2A

20 20 cm

3.5A

Electroplatings time takes about 20~45mins

9 Washing it with water or pure water after electroplating, smearing the protective solution after drying or wipe drying in order to prevent surface oxidation. Note: 1. All the solvent non-toxic, low corrosion, but still recommend latex gloves to you, rinse the solvent stick in the skin with water 2. Electroplating solution (CuSO4) havent been used for a long time, back to the container sealed with hand pumping. 3. Conductive adhesive color is black. 4. Conductive adhesive should be placed in a dry place. 5. Must cover the cover after using the Conductive plastic in order to avoid concentration changes caused by solvent evaporation of plating quality. 6. Keep the environment, please submit the full recovery of plating solution by the relevant department to recovery.

Regaular malfunction analysis and resolution:

First, the coating blur or ambiguity: 1, poor pre-plating, the part surface with oil, and clean water or bath with oil; 2, the cathode plate surface is too large,anode too small or short ; 3, too many organic impurities; 4, It might lead to coating blur,once a large number of iron impurities in the bath,. Second, the plating voltage increases: 1, Little more copper sulfate in bath,while less sulfuric acid ; 2, the bath temperature is too low;

3, the anode area is too small 4, over Cl A in the bath Third, the low current density area coating off: 1, linked with poor electrical conductivity; 2, more monovalent copper in bath; 3, the temperature is too high; 4, the sulfuric acid content is low; 5, too much Cl one or organic impurities