Soldering Tutorial: Types of Soldering & Soldering Process

What is Soldering?
Soldering - a must skill for all electrical and electronic works. Soldering is defined as the
process of joining two pieces of metals using a filler metal, known as solder, having a low
melting point below the melting point of the work piece. It is often confused with welding but
the difference between them is, in soldering the work piece is not melted, they are joined
using a filler metal, but in welding work piece is joined by melting.
History
Soldering was practiced as far back as 5000 years ago in Egypt. Soldering was widely
performed around 4000 years ago when tin was discovered as soldering metal. The process of
soldering was introduced in Mediterranean region, and was followed in the Roman Empire,
Swiss and Hungaria. Soldering has improved a lot from culture to culture and generation to
generation and in todays scenario it is the best method for fabrication and assembly of
microelectronics.

Types of Soldering
Soldering is classified as shown in the image below:

1. Soft soldering
It is a process for joining small intricate parts having low melting points which damages
when soldering process is carried out at high temperature. It uses tin-lead alloy as filler
material. The melting point of the filler material should be below 400
o
C (752
o
F). It uses gas
torch as the heat source.

2. Hard soldering
In this process, hard solder connects two pieces of metals by expanding into the pores of the
work piece opened by high temperature. The filler material possess high temperature above
450
o
C (840
o
F).
It comprises of two parts namely silver soldering and brazing.
2.1 Silver soldering
It is a clean process useful for fabricating small fittings, doing odd repairs and making tools.
It uses an alloy containing silver as filler material. Silver provides free flowing characteristics
but silver solder is not good at gap filling hence, different fluxes are recommended for
precised silver solder.

2.2 Brazing
Brazing is a process of joining two pieces of base metals by creating melted metallic filler
that flows by capillary attraction across the joints and cools to form a solid bond through
atomic attraction and diffusion. It creates an extremely strong joint. It uses brass alloy as
filler material.

SOLDER
It is any of various fusible alloys usually tin or lead used to join metallic parts. It is
symbolized by two numbers which represents the percentage of each metal in a mixture. The
first number refers to the percentage of tin and second to the percentage of lead. It usually
melts at a temperature of about 200
o
C. Since solder has tin content, coating a surface with
solder is called tinning.

Types of solder
60/40 solder- its composition is 60% tin and 40% lead. It melts at 374
o
F. It forms high,
rounded, beaded seams. Because of its low relatively melting point this type of solder is easy
to rework to maintain a smooth finish.
50/50 solder- its composition is 50% tin and 50% lead. Its melting point is 421
o
F. This
type of solder produces a much flatter bead than 60/40. Because of its high melting point this
type of solder is often used on the back of stained glasses, to protect it from melting when
soldering the front.
63/37 solder- its composition is 63% tin and 37% lead. This type of solder is an
excellent solder to bead up the outside rim of copper foiled pieces. It is often referred as
decorated or quick set solder.
Lead free solder- This type of solder performs similar to 50/50 solder. Lead free
solder is a most expensive solder, but when constructing pieces that will contact food or that
are handled frequently, this type of solder is different.

The best size of solder for electronic circuit board is 22swg (SWG=standard wire gauge).
Solder for electronic use contains tiny cores of flux. Without flux most joints would fail
because metals quickly oxidize and the solder itself will not flow properly.
Now the question arises, why solder method is preferred over other bonding methods?
Since low energy is required to solder, it is relatively inexpensive and easy to use. If the
joints are properly soldered they are highly reliable and can last for years decade and
centuries. In addition to this, solder joints are easy to repair.
Process of soldering
The basic soldering operation is performed in the following steps:
Cleaning - Heated metal are prone to oxidize rapidly. That is why oxides, scale and dirt must
be removed by chemical or mechanical actions. Hence, initially, we check the tip of the
soldering iron which should be clean and shiny, suitable for the project to be carried out. If
not, then to fulfill the requirements of the project, small amount of the solder is added on the
tip of the iron.

For effective cleaning of the tip of soldering iron, one should ensure that the sponge used for
the same should be damped. As a dry sponge will not clean the tip effectively, and a wet
sponge will lower the temperature of the tip making for an ineffective solder joint.

Heating- The temperature of the soldering station should be adjusted to a considerable level
of 350
o
C, so as to achieve the required melting conditions of the alloy used for soldering.

Insertion- Further, the components which are to be soldered, are inserted in the holes of the
circuit board by bending the lead using fine pliers, so that they can slide easily in the holes
provided on the printed circuit pad. Then the leads protruding from the bottom of the circuit
board, is bend at an angle of approx 45
o
.
Cut off the leads of the component which are close to the outer edge of the solder pad.

Soldering - the lead and the pad are heated simultaneously, holding the soldering iron at an
angle of 45
o
and keeping the solder wire in contact to the space between the iron tip and lead.
As the solder melts around the joints, the soldering wire should be kept still for good results.
And remove the solder tip first and the solder wire next.
After soldering the joint, instead of blowing off the solder joint, allow it to cool naturally.

Removal of residue- Using isopropyl alcohol, and a bristle brush the printed circuit board
should be cleaned thoroughly after the soldering of the components is completed. This
process removes the flux residue and the unwanted contaminations present on the circuit
board. If any of the flux remains, itll continue to react with the solder, causing oxidation.
Therefore, this step is very important.

Finishing - finishing wax is used after cleaning process for enhancing the color of the patina
making it either rich black or shinny copper and to keep it looking its best. Apply the patina
to the solder lines using a cotton swab.

Types of Soldering Processes

Wave Soldering
It is one of the primary techniques of soldering in which electronic components are soldered
to a printed circuit boards. A solder wave is created by a pump located at the bottom of the
solder pot. Components are inserted into the holes and the loaded PCB is placed onto a
conveyer, which brings it into the contact with the wave surface. The solder wets the metallic
area on the board, creating electrical and mechanical connections. The wave soldering
technique encompasses a sequence of process, all of which are contained in same apparatus.
First of all, the surface is coated with flux. After the flux is applied, the substrate is passed
through a preheating stage which promotes the activation of flux, evaporates the volatiles of
flux and reduces the thermal shock to the substrate and devices when it passes onto the solder
wave. After this, surface board passes from the solder wave and leads to formation of joints.
After passing the solder wave, the board cools through natural heat loss.

Reflow Soldering
Reflow soldering is a widely spread technology of soldering of surface mount semiconductor
packages. The reflow process consist of applying a eutectic solder paste to a circuit board,
placing devices onto the plate, and then conveying the board through a reflow oven or under
an infrared lamp or by using hot air pencil, with successive heating elements of varying
temperature. When the entire assembly is subjected to controlled heat, solder melts and the
joint is permanently connected. Learn more about soldering iron with in-depth detail through
exclusive images at the Insight about Soldering iron.

FLUX
Soldering flux is formulated to remove a film of oxides from the metal and make the solder
and the metal more able to dissolve in each other. Flux must be able to deoxidize metal
surfaces at high temperatures without decomposing. The flux material simultaneously reduce
the surface tension of the flowing solder and in this way, brings about better wetting
characteristics and a more favorable flowing property.

Rosin flux
It is the oldest, most popular and still the most effective soldering flux. Rosin, which is the
base of this type of flux, is extracted from pine trees. The active agents in rosin flux are
abeitic acid and plicatic acid; it is the reaction between these acids and the metallic oxides on
the joint materials that provides the cleaning required for wetting the joint. After soldering,
rosin based flux leaves behind the residue which is non-corrosive, non conducting, moisture
and fungus resistant but it must be cleaned from the surface before carrying any further
process to minimize fuss and irritation in eyes and skin caused by combustion.

Water soluble fluxes
These are the fluxes that wash away when the board is washed with the ordinary water
mainly hot water. Occasionally, all the water soluble flux leaves behind residues. These are
carboxylic acids and detergent which produces irritating fumes. Hence, in addition to hot
water saponifier is added to help the cleaning process. Saponifiers are alkaline and may be
corrosive; they react with acid residue on board to form soap and glycerin, which is relatively
easy to wash with hot water. If adequate cleaning of the residues is not carried then they may
cause sustained corrosion and induces electrical problems.

No clean fluxes
These fluxes leave minimal residues which need not be removed after soldering from finished
electronic assemblies. They vanish under the influence of heat. Many no-clean fluxes are
organically based, usually on an alcohol, and have a low solid content. Some water based no-
clean fluxes have been developed but these must be handled with care to avoid severe skin
irritation. No-clean fluxes have been found to be even more irritating than rosin fluxes.
Fluxes must react with the pad material to be effective and enhance wetting; the acids in these
fluxes do that, but chemical reactions with the metals in the pads and the plastic substrate
produce very harsh gases.
Desoldering
The reverse process of soldering is desoldering. It is a process of removal of solder and
components mounted on circuit boards for repair purpose.

What if a soldering is not done properly? How to resolve this problem? Simply, the soldered
joint is removed by the process of desoldering. For this purpose a vacuum pump is activated
to remove solder from the plated through holes. The lead over which the desoldering tip was
placed is moved in a circular motion for rounded leads and back and forth for flat leads. A
profound knowledge about desoldering can be reached at the Insight about desoldering pump.

Applications
Soldering has the most common use in plumbing and in the field of electronics where it is
used to mount electronic components on printed circuit boards. In addition to this, soldering
has its application in jewellary making, cooking wares, tools, stained glass work and many
more. It can also be used to repair a leakage in containers.













Soldering Iron
Soldering iron is quite popular hand tool commonly used to solder components with each
other. It works on a very basic principle. When we pass current through a high resistant
material, heat is generated. We use this heat to melt down a conductor metal also called
soldering wire and putting it between two components in order to connect them electrically.

A general soldering iron consists of a heating region and an insulated handle. On supplying
electrical current to the soldering iron, the heating tip gets heated and with the help of a
soldering wire it joins two components.
Heating Tip:

Heating tip of a soldering iron is shown in the image above.

Some categories of Soldering Iron also have an LED to indicate if soldering iron is on or not.
A resistance connected in series to limit the current to passing through the LED.

Electrical Terminal

Three terminals of the iron that are connected with heating region are live, neutral and
earthing.

This is the resistive element which directly gets the electric current and heated up. Material
used to make it are generally copper, nickel, etc. have low emissivity i.e. these materials have
a low tendency to release heat in surroundings. Read more what is soldering and types of
soldering.
How Desoldering Pump works
DESOLDERI NG is the process of removing soldered components from a circuit made on
PCB. Desoldering pump along with the soldering iron is used for this purpose. A desoldering
pump also known as solder sucker is a small mechanical device which sucks the
liquid/molten solder from the joint where the components are mounted. In order to desolder a
component from the PCB, we first heat up the solder joint with the soldering iron till the
solder liquefies/melts. At the same moment we actuate the soldering pump by pressing the
trigger lever and bring the tip over the molten metal and pull the trigger back by pressing a
button shown in the below image. At this instant the lever is pulled back and the tip of the
pump sucks the molten solder. This process is repeated until all the residue solder is sucked
by the pump and the hole on the PCB is clear to solder a fresh component.

Above image shows a desoldering pump - head, trigger and button of the soldering pump are
marked. To actuate the pump the lever is pressed until there is a click sound which indicates
that the lever will remain locked in the same position.


The desoldering pumps bottom head contains a hole through which the molten solder is
sucked when the pump is triggered. The head is designed such that the extracted solder does
not solidify and block it, consequently the sucked metal can be removed and discarded easily.

Removing the outer case reveals its major components spring, spring lever, a mechanical
lock and a piston to draw the solder.

The desoldering head has the structure and working similar to a syringe. The piston draws the
molten solder when it is pulled back by the spring.

When desoldering pump is operated, the spring gets compressed as shown in the above
image. At this moment if the button is pressed the mechanical lock will be opened and spring
will extend back to the normal position pulling the piston towards the lever.

Working of the mechanical lock is shown in the image. If the lever is pressed a special
shaped edging on the lever is wedged with mechanical lock. As we press the yellow button
the lock will be slightly moved away clearing the way for lever to move back. Another small
spring is used to keep the lock in a fixed position.

The mechanical lock is more clearly shown in the above image.

Structure of the piston is shown in the image. When pump is triggered, the piston creates a
vacuum in the front desoldering head and allows entering the air only from the hole on the
tip. As the piston moves speedily, the sudden vacuum draws the air next to the tip and with
the air the molten solder is also drawn. The sucked solder is discarded by pressing the lever.
The same process is practiced few times to remove the old solder completely.