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2SK2926(L), 2SK2926(S)

Silicon N Channel MOS FET


High Speed Power Switching
ADE-208-535
1st. Edition
Features
Low on-resistance
R
DS(on)
= 0.042 typ.
4V gate drive devices.
High speed switching
Outline
1
2
3
4
4
1
2
3
1. Gate
2. Drain
3. Source
4. Drain
DPAK2
D
G
S
2SK2926(L), 2SK2926(S)
2
Absolute Maximum Ratings (Ta = 25C)
Item Symbol Ratings Unit
Drain to source voltage V
DSS
60 V
Gate to source voltage V
GSS
20 V
Drain current I
D
15 A
Drain peak current I
D(pulse)
*
1
60 A
Body to drain diode reverse drain current I
DR
15 A
Avalanche current I
AP
*
3
15 A
Avalanche energy E
AR
*
3
19 mJ
Channel dissipation Pch*
2
25 W
Channel temperature Tch 150 C
Storage temperature Tstg 55 to +150 C
Notes: 1. PW 10s, duty cycle 1 %
2. Value at Ta = 25C
3. Value at Ta = 25C, Rg 50
2SK2926(L), 2SK2926(S)
3
Electrical Characteristics (Ta = 25C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
voltage
V
(BR)DSS
60 V I
D
= 10mA, V
GS
= 0
Gate to source breakdown
voltage
V
(BR)GSS
20 V I
G
= 100A, V
DS
= 0
Zero gate voltege drain
current
I
DSS
10 A V
DS
= 60 V, V
GS
= 0
Gate to source leak current I
GSS
10 A V
GS
= 16V, V
DS
= 0
Gate to source cutoff voltage V
GS(off)
1.5 2.5 V I
D
= 1mA, V
DS
= 10V
Static drain to source on state R
DS(on)
0.042 0.055 I
D
= 8A, V
GS
= 10V*
1
resistance R
DS(on)
0.065 0.11 I
D
= 8A, V
GS
= 4V*
1
Forward transfer admittance |y
fs
| 7 11 S I
D
= 8A, V
DS
= 10V*
1
Input capacitance Ciss 500 pF V
DS
= 10V
Output capacitance Coss 260 pF V
GS
= 0
Reverse transfer capacitance Crss 110 pF f = 1MHz
Turn-on delay time t
d(on)
10 ns V
GS
= 10V, I
D
= 8A
Rise time t
r
80 ns R
L
= 3.75
Turn-off delay time t
d(off)
100 ns
Fall time t
f
110 ns
Body to drain diode forward
voltage
V
DF
1.0 V I
F
= 15A, V
GS
= 0
Body to drain diode reverse
recovery time
t
rr
55 ns I
F
= 15A, V
GS
= 0
diF/ dt = 50A/s
Note: 1. Pulse test
2SK2926(L), 2SK2926(S)
4
Main Characteristics
40
30
20
10
0
50 100 150 200
1000
300
100
30
3
10
0.1 0.3 1 3 10 30 100
20
16
12
8
4
0
2 4 6 8 10
20
16
12
8
4
0
1 2 3 4 5
0.3
0.1
1
1
0

s
1

m
s
P
W

=

1
0

m
s

(
1
s
h
o
t
)
Ta = 25C
1
0
0

s
10 V
C
h
a
n
n
e
l

D
i
s
s
i
p
a
t
i
o
n




P
c
h


(
W
)
Case Temperature Tc (C)
Power vs. Temperature Derating
Drain to Source Voltage V (V)
DS
D
r
a
i
n

C
u
r
r
e
n
t




I






(
A
)
D
Maximum Safe Operation Area
Drain to Source Voltage V (V)
DS
D
r
a
i
n

C
u
r
r
e
n
t




I






(
A
)
D
Typical Output Characteristics
Gate to Source Voltage V (V) GS
D
r
a
i
n

C
u
r
r
e
n
t




I








(
A
)
D
Typical Transfer Characteristics
Operation in
this area is
limited by R
DS(on)
D
C

O
p
e
r
a
t
i
o
n

(
T
c

=

2
5

C
)
6 V 5 V
3.5 V
4 V
3 V
V = 2.5 V
GS
Pulse Test
4 .5 V
Tc = 75C
25C
25C
V = 10 V
Pulse Test
DS
2SK2926(L), 2SK2926(S)
5
2.0
1.6
1.2
0.8
0.4
0 4 8 12 16 20 5 20 100 1 10 50 2
0.20
0.16
0.12
0.08
0.04
40 0 40 80 120 160
0
0.1 0.2 1 5 20
20
2
5
1
0.5
1.0
0.2
0.5
0.1
0.02
0.01
0.05
0.5 2
Gate to Source Voltage V (V)
GS
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
V













(
V
)
D
S
(
o
n
)
D
r
a
i
n

t
o

S
o
u
r
c
e

S
a
t
u
r
a
t
i
o
n

V
o
l
t
a
g
e
Drain Current I (A)
D
D
r
a
i
n

t
o

S
o
u
r
c
e

O
n

S
t
a
t
e

R
e
s
i
s
t
a
n
c
e
R















(




)

D
S
(
o
n
)
Static Drain to Source on State Resistance
vs. Drain Current
Case Temperature Tc (C)
R













(



)
D
S
(
o
n
)
S
t
a
t
i
c

D
r
a
i
n

t
o

S
o
u
r
c
e

o
n

S
t
a
t
e

R
e
s
i
s
t
a
n
c
e

Static Drain to Source on State Resistance


vs. Temperature
Drain Current I (A)
D
F
o
r
w
a
r
d

T
r
a
n
s
f
e
r

A
d
m
i
t
t
a
n
c
e


|
y




|

(
S
)
f
s
Forward Transfer Admittance vs.
Drain Current
Pulse Test
10 A
5 A
I = 20 A D
V = 4 V
GS
Pulse Test
10 V
I = 10 A D
V = 4 V
GS
10 V
5 A
Pulse Test
5 A 20 A 10 A
10
10
V = 10 V
Pulse Test
DS
25 C
Tc = 25 C
75 C
2SK2926(L), 2SK2926(S)
6
0.1 0.5 1 2 10 0.2 5 0 10 20 30 40 50
1000
200
500
100
10
20
50
100
80
60
40
20
0
20
16
12
8
4
8 16 24 32 400
0
1000
300
100
30
10
0.1 0.2 1 5 10
V = 10 V
25 V
50 V
DD
V = 50 V
25 V
10 V
DD
500
200
100
20
50
10
5
2000
V = 0
f = 1 MHz
GS
Ciss
Coss
Crss
I = 15A
D
V
GS
V
DS
3
1
0.5 2
Reverse Drain Current I (A)
DR
R
e
v
e
r
s
e

R
e
c
o
v
e
r
y

T
i
m
e



t
r
r


(
n
s
)
Body to Drain Diode Reverse
Recovery Time
C
a
p
a
c
i
t
a
n
c
e



C


(
p
F
)
Drain to Source Voltage V (V)
DS
Typical Capacitance vs.
Drain to Source Voltage
Gate Charge Qg (nc)
D
r
a
i
n

t
o

S
o
u
r
c
e

V
o
l
t
a
g
e




V








(
V
)
D
S
G
a
t
e

t
o

S
o
u
r
c
e

V
o
l
t
a
g
e




V








(
V
)
G
S
Dynamic Input Characteristics
Drain Current I (A)
D
S
w
i
t
c
h
i
n
g

T
i
m
e



t


(
n
s
)
Switching Characteristics
20
20
r
t
V = 10 V, V = 30 V
PW = 5 s, duty < 1 %
GS DD
t
f
d(on)
t
d(off)
t
di / dt = 50 A / s
V = 0, Ta = 25 C
GS
2SK2926(L), 2SK2926(S)
7
50
40
30
20
10
0
0.4 0.8 1.2 1.6 2.0
V = 0, 5 V
GS
10 V
5 V
200
160
120
80
40
25 50 75 100 125 150
0
Channel Temperature Tch (C)
R
e
p
e
t
i
v
e

A
v
a
l
a
n
c
h
e

E
n
e
r
g
y



E







(
m
J
)
A
R
Maximum Avalanche Energy vs.
Channel Temperature Derating
D. U. T
Rg
I
Monitor
AP
V
Monitor
DS
V
DD
50
Vin
15 V
0
I
D
V
DS
I
AP
V
(BR)DSS
L
V
DD
E = L I
2
1
V
V V
AR
AP
DSS
DSS DD
2
Avalanche Test Circuit Avalanche Waveform
Source to Drain Voltage V (V)
SD
R
e
v
e
r
s
e

D
r
a
i
n

C
u
r
r
e
n
t



I








(
A
)
D
R
Reverse Drain Current vs.
Source to Drain Voltage
Pulse Test
I = 40 A
V = 25 V
duty < 1 %
Rg > 50
AP
DD

2SK2926(L), 2SK2926(S)
8
Vin Monitor
D.U.T.
Vin
10 V
R
L
V
= 30 V
DD
tr
td(on)
Vin
90%
90%
10%
10%
Vout
td(off)
Vout
Monitor
50
90%
10%
t
f
Switching Time Test Circuit Switching Time Waveform
3
1
0.3
0.1
0.03
0.01
10 100 1 m 10 m 100 m 1 10
DM
P
PW
T
D =
PW
T
ch c(t) = s (t) ch c
ch c = 5 C/W, Tc = 25 C

D = 1
0.5
0.2
0
.
0
1
0
.
0
2
0.1
0
.0
5
1

s
h
o
t

P
u
l
s
e
Tc = 25C
Pulse Width PW (S)
N
o
r
m
a
l
i
z
e
d

T
r
a
n
s
i
e
n
t

T
h
e
r
m
a
l

I
m
p
e
d
a
n
c
e
s



(
t
)

Normalized Transient Thermal Impedance vs. Pulse Width


2SK2926(L), 2SK2926(S)
9
Package Dimensions
Unit: mm
6.5 0.5
5.4 0.5
1.15 0.1
2.3 0.2
0.55 0.1
2.29 0.5
0.55 0.1 1.2 typ
1
.
7


0
.
5
5
.
5


0
.
5
3
.
1


0
.
5
1
6
.
2


0
.
5
2.29 0.5
6.5 0.5
5.4 0.5
1.15 0.1
0.8 0.1
2.3 0.5
0.55 0.1
1
.
7


0
.
5
5
.
5


0
.
5
9
.
5


0
.
5
2
.
5


0
.
5
2.29 0.5 2.29 0.5
1
.
2

M
a
x
0.55 0.1
0 ~ 0.25
0.8 0.1
type L S type
4
.
7


0
.
5
Hitachi
EIAJ ( L type)
EIAJ ( S type)
JEDEC
DPAK2
SC63
SC64

Cautions
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachis sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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7. Contact Hitachis sales office for any questions regarding this document or Hitachi semiconductor
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