BSCMT

Maintenance
Base Station Controller

MMN:BSC
A30808-X3247-L220-2-7620
2 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
!
Important Notice on Product Safety
DANGER - RISK OF ELECTRICAL SHOCK OR DEATH - FOLLOW ALL INSTALLATION
INSTRUCTIONS.
The system complies with the standard EN 60950 / IEC 60950. All equipment connected to the
system must comply with the applicable safety standards.
Hazardous voltages are present at the AC power supply lines in this electrical equipment. Some
components may also have high operating temperatures.
Failure to observe and follow all installation and safety instructions can result in serious
personal injury or property damage.
Therefore, only trained and qualified personnel may install and maintain the system.
The same text in German:
Wichtiger Hinweis zur Produktsicherheit
LEBENSGEFAHR - BEACHTEN SIE ALLE INSTALLATIONSHINWEISE.
Das Systementspricht den Anforderungen der EN60950 / IEC60950. Alle an das Systemangeschlo-
ssenen Gerte mssen die zutreffenden Sicherheitsbestimmungen erfllen.
In diesen Anlagen stehen die Netzversorgungsleitungen unter gefhrlicher Spannung. Einige
Komponenten knnen auch eine hohe Betriebstemperatur aufweisen.
Nichtbeachtung der Installations- und Sicherheitshinweise kann zu schweren Krperverlet-
zungen oder Sachschden fhren.
Deshalb darf nur geschultes und qualifiziertes Personal das System installieren und warten.
Caution:
This equipment has been tested and found to comply with EN 301489. Its class of conformity is
defined in table A30808-X3247-X910-*-7618, which is shipped with each product. This class also
corresponds to the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the
equipment is operated in a commercial environment.
This equipment generates, uses and can radiate radio frequency energy and, if not installed and used
in accordance with the relevant standards referenced in the manual Guide to Documentation, may
cause harmful interference to radio communications.
For system installations it is strictly required to choose all installation sites according to national and
local requirements concerning construction rules and static load capacities of buildings and roofs.
For all sites, in particular in residential areas it is mandatory to observe all respectively applicable
electromagnetic field / force (EMF) limits. Otherwise harmful personal interference is possible.
Trademarks:
All designations used in this document can be trademarks, the use of which by third parties for their own purposes
could violate the rights of their owners.
Copyright (C) Siemens AG 2003.
Issued by the Information and Communication Mobile Group
Hofmannstrae 51
D-81359 Mnchen
Technical modifications possible.
Technical specifications and features are binding only insofar as
they are specifically and expressly agreed upon in a written contract.
A30808-X3247-L220-2-7620 3
Maintenance
MMN:BSC
Issues
Change indications (Ind.):
N = new; G = modied; 0 = deleted;
Document Title Page(s) Issue/Ind.
MMN:BSC . . . . . . . . . . . 1...274 2
4 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
A30808-X3247-L220-2-7620 5
Maintenance
MMN:BSC
Reason for Update
Summary:
Second Edition for Release BR 7.0.
Details:
Chapter / Section Reason for Update
Chapter 4.8.16 New jumpers setting figures for the STLP card
Issue History
Issue Date of Issue Reason for Update
1 07/2003 First Edition for New Release BR 7.0
2 12/2003 Second Edition for Release BR 7.0
6 A30808-X3247-L220-2-7620
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A30808-X3247-L220-2-7620 7
Maintenance
MMN:BSC
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.1 Structure of the Maintenance Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.2 Symbols used . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
1.3 Fault Clearance Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.4 Fault Clearance Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.5 Module Replacement Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
1.6 Fault Management Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1.7 Procedures references . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2 Tasklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
3 Fault Clearance Procedures for Modules and Interfaces . . . . . . . . . . . . . . 43
3.1 Diagnostic Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.2 CPEX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.3 DISK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
3.4 DK40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
3.5 IXLT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
3.6 MEMT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
3.7 MPCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
3.8 NTW Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
3.9 PLLH. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
3.10 PPCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
3.11 PPCU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
3.12 PPLD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
3.13 PPXL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
3.14 PPXU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
3.15 PWRS (PWRD or EPWR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
3.16 Remote Inventory Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
3.17 QTLP/STLP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
3.18 SN16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
3.19 SNAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
3.20 TDPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
3.21 UBEX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
4 Hardware Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
4.1 Rack Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
4.2 Rack Connection for BC120-HC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
4.3 Fuse and Alarm Panel of the C20-X rack . . . . . . . . . . . . . . . . . . . . . . . . . 140
4.4 Lamp Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
4.5 DC-Panel of the BC120-HC (C38-X rack). . . . . . . . . . . . . . . . . . . . . . . . . 143
4.6 Temperature Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
4.7 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
4.8 Jumpers setting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
5 Appendix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
5.1 Alarm Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
5.2 Alarm Reporting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
5.3 Failure Event Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
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5.4 General diagnostic structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
5.5 NACK CAUSES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272
6 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273
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MMN:BSC
Illustrations
Fig. 1.1 Structure of the MMN:BSC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Fig. 1.2 Used Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Fig. 1.3 Fault Clearance Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Fig. 1.4 ESD Symbol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Fig. 1.5 General Maintenance flow chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Fig. 3.1 Delete nob_Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Fig. 3.2 Create nob_Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Fig. 3.3 Edit nob_Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Fig. 3.4 Attach nob_RIU file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Fig. 4.1 Standard BSC rack layout and size (S30861-C20-X) . . . . . . . . . . . . . 128
Fig. 4.2 Standard BSC frame for the GPRS feature . . . . . . . . . . . . . . . . . . . . . 129
Fig. 4.3 Standard BSC rack frame for max GPRS channels configuration . . . 130
Fig. 4.4 Standard BSC rack in fire resistence cabinet version . . . . . . . . . . . . . 131
Fig. 4.5 High Capacity BC120HC rack frame (S30861-C36/C40-X). . . . . . . . . 132
Fig. 4.6 BSC Rack Connection Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Fig. 4.7 RCAP in the BC120 - HC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Fig. 4.8 Alarm LEDs on the BSC Fuse and Alarm Panel . . . . . . . . . . . . . . . . . 140
Fig. 4.9 BSC Fuse and Alarm Panel, Part with Fuses . . . . . . . . . . . . . . . . . . . 142
Fig. 4.10 Lamp Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
Fig. 4.11 Alarm LEDs for BC120 HC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
Fig. 4.12 DC-Panel for BC120 HC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
Fig. 4.13 BSC Power Supply Module Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Fig. 4.14 Jumpers Setting for Module CPEX . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
Fig. 4.15 Jumpers Setting for Module DK40. . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
Fig. 4.16 Jumpers Setting for Module DK40 V2 and V3 . . . . . . . . . . . . . . . . . . . 149
Fig. 4.17 Jumpers Setting for Module IXLT V3 and V4. . . . . . . . . . . . . . . . . . . . 150
Fig. 4.18 Jumpers Setting for Module IXLT V6 and V7. . . . . . . . . . . . . . . . . . . . 151
Fig. 4.19 Jumpers Setting for Module MEMT . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
Fig. 4.20 Jumpers Setting for Module MPCC V7 . . . . . . . . . . . . . . . . . . . . . . . . 153
Fig. 4.21 Front View of MPCC V7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
Fig. 4.22 Jumpers Setting for Module MPCC V8 . . . . . . . . . . . . . . . . . . . . . . . . 156
Fig. 4.23 Front View of MPCC V8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
Fig. 4.24 Jumpers Setting for Module PLLH (75 Ohm). . . . . . . . . . . . . . . . . . . . 159
Fig. 4.25 Jumpers Setting for Module PLLH (120 Ohm). . . . . . . . . . . . . . . . . . . 160
Fig. 4.26 Jumpers Setting for Module PLLH V2 (75 Ohm) . . . . . . . . . . . . . . . . . 161
Fig. 4.27 Jumpers Setting for Module PLLH V2 (120 Ohm) . . . . . . . . . . . . . . . . 162
Fig. 4.28 Jumpers Setting for Module PPCC V2. . . . . . . . . . . . . . . . . . . . . . . . . 163
Fig. 4.29 Jumpers Setting for Module PPCC V3. . . . . . . . . . . . . . . . . . . . . . . . . 164
Fig. 4.30 Jumpers Setting for Module PPCU . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
Fig. 4.31 Jumpers Setting for Module PPLD V2 . . . . . . . . . . . . . . . . . . . . . . . . . 166
Fig. 4.32 Jumper setting for module PPLD V3 . . . . . . . . . . . . . . . . . . . . . . . . . . 167
Fig. 4.33 Jumpers Setting for Module QTLP (120 Ohm) . . . . . . . . . . . . . . . . . . 168
Fig. 4.34 Jumpers Setting for Module QTLP (75 Ohm) . . . . . . . . . . . . . . . . . . . 169
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Fig. 4.35 Jumpers Setting for Module QTLP V2 (75 Ohm) . . . . . . . . . . . . . . . . . 170
Fig. 4.36 Jumpers Setting for Module QTLP V2 (100 Ohm) . . . . . . . . . . . . . . . . 171
Fig. 4.37 Jumpers Setting for Module QTLP V2 (120 Ohm) . . . . . . . . . . . . . . . . 172
Fig. 4.38 PCM Monitoring Points for QTLP and QTLP V2. . . . . . . . . . . . . . . . . . 173
Fig. 4.39 Jumpers Setting for Module SN16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
Fig. 4.40 Jumpers Setting for Module TDPC V6 . . . . . . . . . . . . . . . . . . . . . . . . . 176
Fig. 4.41 Front View of TDPC V6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
Fig. 4.42 Jumpers Setting for Module TDPC V7 . . . . . . . . . . . . . . . . . . . . . . . . . 179
Fig. 4.43 Front View of TDPC V7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
Fig. 4.44 Jumpers Setting for Module UBEX . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
Fig. 4.45 Jumpers Setting for Module SNAP V1 . . . . . . . . . . . . . . . . . . . . . . . . . 183
Fig. 4.46 Jumpers Setting for Module PPXX (fed by EPWR power supply card) 184
Fig. 4.47 Jumpers Setting for Module PPXX (fed by internal power supply module)
185
Fig. 4.48 Jumpers Setting for Module STLP (120 ohm jumpers setting) . . . . . . . 186
Fig. 4.51 Jumpers Setting for Module STLP (75 ohm jumpers setting) . . . . . . . . 189
Fig. 4.52 PCM Monitoring Points for STLP module. . . . . . . . . . . . . . . . . . . . . . . 192
Fig. 5.1 The BSC Maintenance Entity Graph (MEG tree) for BSC Standard
Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
Fig. 5.2 The BSC Maintenance Entity Graph (MEG tree) for BSC High Capacity
(C20 rack) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
Fig. 5.3 The BSC Maintenance Entity Graph (MEG tree) for BSC_120HC
(C36/C40-X rack) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
A30808-X3247-L220-2-7620 11
Maintenance
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Tables
Tab. 1.1 Alarms list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Tab. 2.1 Fuse Electrical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Tab. 3.1 List of nob_RIUs for BSC Standard . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Tab. 3.2 List of nob_RIUs for BSC High Capacity . . . . . . . . . . . . . . . . . . . . . . . 102
Tab. 4.1 Assignment of even and odd PCM Links to SUB-D 37 Connectors . . 136
Tab. 4.2 Cross references for PCM lines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Tab. 4.3 Signal pin connector on SUB D37 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Tab. 4.4 LED-Hardware Correspondence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
Tab. 4.5 Anomaly Conditions identified by LEDs. . . . . . . . . . . . . . . . . . . . . . . . 146
Tab. 4.6 Description of QTLP and QTLP V2 Monitoring Points. . . . . . . . . . . . . 173
Tab. 4.7 STLP Jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
Tab. 4.8 Description of STLP Monitoring Points . . . . . . . . . . . . . . . . . . . . . . . . 192
Tab. 5.1 New Phase Identifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
Tab. 5.2 Error Codes used by PWRS, MPCC, TDPC, MEMT Diagnosis . . . . . 217
Tab. 5.3 Error Codes used by NTW Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . 221
Tab. 5.4 Error Codes used by PPxx Diagnostics. . . . . . . . . . . . . . . . . . . . . . . . 229
Tab. 5.5 Error Codes used by LICD Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . 233
Tab. 5.6 DK40: Test-id Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241
Tab. 5.7 List of phases that are executed in the several conditions . . . . . . . . . 243
Tab. 5.8 IXLT: Test-id Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247
Tab. 5.9 PPCU: Test-id Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257
Tab. 5.10 PPXU: Test-id Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 268
Tab. 5.11 PPXU: Test-id Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271
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A30808-X3247-L220-2-7620 13
Maintenance
MMN:BSC
1 Introduction
1.1 Structure of the Maintenance Manual
The following diagramgives an overviewof the structure of this manual and the purpose
of its chapters.
Fig. 1.1 Structure of the MMN:BSC
Chapter 1
Chapter 2
Chapter 3
Chapter 5
Introduction
Basic information on this manual
Basic information on fault clearance
Guidelines
General replacement Instructions
Preparatory work if relevant
Chapter 6 Abbreviations
Appendix
Basic required knowledge in more detail,
e.g. fault messages
Chapter 4
Fault Clearance Procedures for Modules
and Interfaces
Fault clearance procedures for modules
and interfaces in alphabetical order
Concluding procedure Remote Inventory
Data that some fault clearance
procedures require (if necessary, links are
provided to this concluding procedure)
Tables, Lists and Figures
Information on replaceable modules,
e.g. LEDs, connectors etc.
Overview of the HW architecture as
additional information
(Important information to make your work
efcient and safe)
(Main Part for Fault Clearance Tasks)
(Reference Chapter)
(Reference Chapter)
(General Maintenance)
(Reference Chapter)
Chapter 4
Task List
Information on routine tasks that need to be
carried out
14 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
1.2 Symbols used
The following symbols are used throughout this manual:
Fig. 1.2 Used Symbols
Reference to another step in the procedure or to another procedure
Symbol Meaning
ESD (Electrostatic Sensitive Device) precautions to be taken
Note; important information
Warning; the notes given here are to be followed with care.
b
h
Use LMT to enter commands
Reference to another chapter in the document or to another document

Reference to another procedure. Return after finishing.
i
i
!
Non-observance can lead to personal injury or property damage.
A30808-X3247-L220-2-7620 15
Maintenance
MMN:BSC
1.3 Fault Clearance Principle
The high systemfunctionality of the Siemens base station systemis achieved by means
of system-integrated routine tests. These routine tests continually check the correct
functioning of the base station subsystems including the BSCs.
The fault clearance procedures in this manual are based on these routine tests. In most
cases, the results of these routine tests are sufficient to localize the fault and clear it
immediately at the BSC.
The modular design of the BSC allows you to clear a large percentage of faults in the
system by replacing a defective module.
Sometimes, however, it may happen that faults do not result from defective modules,
but from interface problems in general (for example interrupted cables). In this case,
special trouble shooting procedures for interfaces are provided.
This maintenance concept guarantees a simple and fast fault clearance and leads to
high operational efficiency.
16 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
1.4 Fault Clearance Guidelines
The following diagram gives an overview of the fault clearance procedure (detailed
description below):
Fig. 1.3 Fault Clearance Overview
7.
Y
Y
6.
Another
Probable
Cause?
9. End of Fault Clearance: Faulty Modules are Sent to Repair Depot
Fault and Test
Management at the
OMC via Radio
Commander
N
1. System Integrated Routine Test Detects a Fault
3.
Local Fault
Clearance at the
BSC Neces-
sary?
Y N
2. Fault Message Displayed at Radio Commander:
Information for example on
probable cause
suspected modules(s)/interface(s)
location ...
Local Fault
Clearance
at the BSC
4. Fault Clearance Proce-
dure for the Suspected
Module or Interface
8. Call
TAC
5.
Fault
Clearance
Success-
ful?
Content of this Manual
N
A30808-X3247-L220-2-7620 17
Maintenance
MMN:BSC
Fault Clearance Guidelines
(The numbering refers to the above diagram.)
1. The system integrated routine test detects a fault.
2. A fault message is displayed at the Radio Commander.
3. The fault and test management at the Operation and Maintenance Center (OMC)
must verify whether a local fault clearance at the BSC is required (see Radio
Commander documentation).
4. Interpret the fault message and go to the fault clearance procedure of the suspected
module or interface, localize the fault and clear it according to the corresponding
procedure in chapter "3 Fault Clearance Procedures for Modules and Interfaces".
5. As described in the corresponding procedure, verify whether the fault clearance was
successful:
Was the outcome of the hardware test pass?
Are there any relevant pending alarms?
Do the LEDs signal normal operation?
6. If the fault should still exist and the replaced module was not the fault cause, check
whether there is another probable cause.
7. If there is another probable cause, reinsert the recently replaced original module and
go to the corresponding fault clearance procedure for the next suspected module or
interface.
8. It should be possible to clear most faults that may occur in the BSC by following the
fault clearance procedures described in this manual. However, if the fault should still
exist after considering all probable causes, contact the Technical Assistance Center
(TAC). Here you will obtain help from specially trained troubleshooting experts.
9. End of fault clearance. Pack and tag all faulty modules for transport to a repair depot.
Write a fault report in which the following information is given in detail:
name and code of the site
BSS area, cabinet and slot number
name, code and serial number of the module
description of the system response
description of the fault
name and phone number of the originator
i
For the local fault clearance at the BSC:
Make sure that all spare parts that might be required to clear the fault are available
at the site.
For general module replacement instructions see also "1.5 Module Replacement
Instructions".
18 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
1.5 Module Replacement Instructions
1.5.1 ESD Precautions
Fig. 1.4 ESD Symbol
All modules are to be handled with extreme care as each contains a number of electro-
statically sensitive components.
All integrated modules may contain electrostatically sensitive devices (ESDs). All
modules are marked with the ESD symbol.
The following precautions are to be taken:
Personnel should avoid wearing synthetic clothing and shoes with plastic soles, as
these foster the build-up of electrostatic charges.
Before handling modules, personnel should be freed of electrostatic charge. For this
reason personnel should always put on a grounded wrist strap before changing a
module.
Before touching modules, printed circuits or components, the wrist strap must be
connected to the ground potential of the rack by means of a flexible lead integrating a
high-value discharge resistor. The discharging socket in the holder of the special tool for
changing modules must be used for connecting the wrist strap to the ground potential.
This holder is located on the right vertical strut of the module side of the rack. Note that
the conducting parts of the split pin should not be touched when plugging it in (by-
passing the discharge resistor).
IMPORTANT:
Modules with the ESD symbol are to be handled with extreme care. Static or external
voltage can lead to long-term damage in the modules.
In general, the printed circuits and components of the modules should not be touched.
Modules should be held only by their edges.
Removed modules are to be placed in covers made of conductive plastic (provided) and
then stored or sent off in special transport boxes or cases bearing the ESD symbol.
To prevent further damage, faulty modules are to be treated with as much care as new
ones.
All tools, measuring devices and metal objects that come in contact with removed
modules are to be discharged to the ground potential before being used.
To summarize:
a) ESDs should not be allowed to touch electrostatically charged or chargable objects.
A30808-X3247-L220-2-7620 19
Maintenance
MMN:BSC
b) ESDs should only come in contact with high-value discharging material ("gentle"
discharging), i.e. should not undergo "harsh" discharging with, for example, a metal
plate.
c) ESDs should be set down on grounded surfaces only (exible bases with a
grounding connection for servicing purposes).
d) ESDs should only be transported in authorised packaging. A grounded wrist strap
must be put on before removing ESDs.
e) ESDs should not be brought near strong DC electrical elds, e.g. cathode-ray
tubes/monitors (safety distance at least 10 cm (3.9)).
f) Maintenance personnel should check the discharge resistance of the wrist straps at
regular intervals.
g) Even discharges that are considerably lower than the detection limit can damage or
destroy ESDs!
1.5.2 Removing and Inserting Modules
Individual fault-clearance procedures given for each fault in the relevant manual must
be followed when changing a suspect module.
Check whether the modules contain switches, jumpers or solder straps. If so, their
settings must be checked and corrected if necessary, following the guidelines in the
manual.
Modules are to be changed with extreme care. Inappropriate handling of modules can
destroy contacts or printed circuits.
The conductive wrist strap must be put on before changing a module. It must then be
connected via the flexible lead to the discharging socket in the tool holder.
a) Removing a module
The module can now be pulled by hand from the guide rail in the frame.
b) Inserting a module
Push the replacement module into the guide rails in the frame. Check that the module
has been correctly inserted into the lower rail as well as into the upper.
Push back the module in the guide rails until it encounters some resistance; this is over-
come by lightly pressing by hand. The module's strip connectors (module connectors)
are centered on the blade contact strips in the module frame.
The faceplate of the correctly inserted module must be level with those of the adjacent
modules.
20 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
1.6 Fault Management Procedure
The following list of test equipment is recommended for use in the trouble-shooting
procedures provided in this section. Make sure that equipment needed is on hand and
properly operating.
Local Maintenance Terminal (LMT)
Digital Multimeter - Fluke Model 8062Awith Y8134 test lead kit, or equivalent; used
for precision DC and AC measurement, requiring 4-1/2 digits.
Antistatic wrist strap
Miscellaneous hand tools.
Be aware of the fact that a copy of each suspected faulty module is available on the site.
A30808-X3247-L220-2-7620 21
Maintenance
MMN:BSC
Fig. 1.5 General Maintenance flow chart
22 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
In the following an explanation of the above diagram is given.
1. Test the Alarm Lamp Integrity
Before performing any operation on the BSC rack, check for all alarmlamp integrity.
Use the LAMP TEST switch located on the BSC front panel (see Hardware Equip-
ment section).
2. Verify the Lamp Status
Illuminated lamps should be consistent with the suspected module signalled in the
original fault message.
Therefore:
the lamps on the lamp panel should signal an alarm condition; (see Hardware
Equipment section)
one or more lamps on the alarm panel should be on (see Hardware Equipment
section)
3. Connect the LMT to the BSC
Plug the LMT cable into the corresponding socket.
Perform the LOGON procedure (see OGL:LMT).
The LMT tree is now displayed on the screen.
4. Get the Equipment Alarms
The LMT shows the list of all the modules (possibly faulty modules) which issued an
Equipment Failure Event; for each of them keep track of the related possible cause
of fault.
i
If illuminated lamps are not consistent with the suspected
module signalled in the original fault message, this can depend
on new alarms that occured after the first report. If no lamps are
illuminated and an error condition is still present, the component
ACKT of DK40 copy 0 (or the DK40 itself) which is responsible
for the control of the alarm LEDs may be faulty. In this case,
continue with the procedure described below. Only the equip-
ment alarm lamps are relevant for the maintenance purposes.
See section Hardware Equipment and section AlarmReporting
for details about the meaning of the BSC rack lamps.
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE
Command: GATACTIVEALARMS BSCE
Name: BSCE:<instance>
Attributes: EVTYP = EQUIPMENT_FAILURE_EVENT
Submit
GATACTIVEALARMS
BSCE:NAME=BSCE:<instance>,EVTYP=EQUIPMENT_FAILURE _EVENT;
A30808-X3247-L220-2-7620 23
Maintenance
MMN:BSC
5. Check the Possible Faulty Modules
For all the possible faulty modules (from previous step), do the following from LMT:
GET <Module> STAT:NAME=<Module>:<Instance>
Specify the module type by selecting it from the list. The LMT requests for the copy
number (<instance>) of the selected object. Do this operation for all the copies of the
specied module existing inside the rack (see OMN:BSC).
The LMT shows the state of each specied module. Keep track of the operational
state and the availability status for each module.
6. Find the Suspected module
Keeping in mind the output described above, take into account the modules for
which:
the OPERATIONAL STATE is DISABLED
the PROBABLE CAUSE description includes the word Hardware in the AlarmEvent
List
the AVAILABILITY STATUS is FAILED.
These modules are called suspected modules.
7. Replace the Suspected Modules
The BSC rack is protected by a front cover. This must be removed in order to access
the modules. To do this, remove the screws on the cover.
To remove a module, pull the levers on the module itself - pull up the top levers and
pull down the bottom ones - then extract the module. To restore a removed module
to its site, insert the module then push the levers - push down the top levers and
push up the bottom ones.
If the alarm originates from Line Interface Card (LICD) as QTLP, and the alarm is
LOSS OF SIGNAL or LOSS OF SIGNAL ON LINK A/B, in detail signal absent
(LOS), LFA alarm present, eer alarm present (BER), RAI alarm present, check
the jumpers on the faulty card are conforming the line impedence requirement (see
"4.8 Jumpers setting") ; check also that the cable connector concerning the line
number in failure state is correctly inserted and not damaged (see IMN:BSC
manual).
These alarm conditions are shown by LINE/HWI led in the Lamp Alarm Panel and
on the QTLP front led as the table of Fig. 4.37. If the alarmoriginates fromInterface
IXLT as Communication Failure Event, check the X25 cable connector (W3 on the
top rack) is correctly inserted and not damaged.
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> <Module>
Command: GET <Module> STAT
Name: <Module>:<instance>
Attributes: None
Submit
GET <Module> STAT:NAME=<Module>:<instance>;
24 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
After a check of cables and connectors, proceede with the replace of the suspected
modules following the procedures described in the chapter 3.
1.7 Procedures references
The following table shows the BSC alarms in the first column, the relative severity in the
second column and gives informations how to solve the problem.
FAULT PROBLEM SEV. FIRST CHECK OR STEP REPLACEMENT PROCE-
DURE
Equipment failure
116 MEMT card failure major if the card is not extracted "3.6 MEMT"
143 NTW permanent failure major "3.8 NTW Procedure"
145 PLLH permanent failure major "3.9 PLLH"
151 LICD access problem minor if the card is not extracted "3.17 QTLP/STLP"
related to the line number
117 LICD permanent error minor "3.17 QTLP/STLP"related to
the line number
158 too many UBEX inter-
rupt
warn. "3.21 UBEX"
144 Ubex permanent failure major "3.21 UBEX"
161 permanent comparison
alarm on SN
minor the version of the
PLLH,SN,LICD
"3.1 Diagnostic Procedure"
on PLLH,SN,LICD
163 wrong PCM parity from
LICD
minor "3.17 QTLP/STLP"
otherwise
"3.18 SN16"/"3.19 SNAP","3
.9 PLLH"
155 SN16 permanent failure major "3.18 SN16"
171 DISK not formatted major "3.3 DISK"
172 DISK not aligned major the disk alignement is not in
progress
"3.3 DISK"
119 IXLT card not in frame major if the card is not extracted
120 IXLT SW LMT LINK ER warn. LMT connection
121 IXLT SW OMC LINK
ER
warn. OMC connections
122 IXLT FW not ready major SW reset is not in progress "3.5 IXLT"
186 IXLT SW bad restart warn. "3.5 IXLT"
187 IXLT SWbad command warn. "3.5 IXLT"
207 IXLT card corrupted major "3.5 IXLT"
Tab. 1.1 Alarms list
A30808-X3247-L220-2-7620 25
Maintenance
MMN:BSC
General card
212 HW failure diagnostic
request
major "3.1 Diagnostic Procedure"
213 HW failure major "3.1 Diagnostic Procedure"
214 card reserved for test major Diagnostic procedure is running
215 card diagnostic failed major "3.1 Diagnostic Procedure"
PPLD/PPXU
217 peripheral card failure
diagn.req.
minor Diagnostic procedure is running "3.1 Diagnostic Proce-
dure"on the PPLD/PPXU
LICD/PPLD/PPXU
218 peripheral card HW
failure
minor "3.17 QTLP/STLP"
"3.12 PPLD","3.14 PPXU"
MPCC
254 ENVA register
mismatch
minor MPCC version "3.7 MPCC"
PPXL/PPXU
320 inter processor commu-
nication problem with TDPC
on PPXL,PPXU
"3.13 PPXL","3.14 PPXU"
PPXL/PPCC,PPCU/PPXU
321 fatal HWerror detected
by TDPC
on PPXL/PPCC,PPCU/PPXU
"3.13 PPXL"/"3.10 PPCC"
"3.11 PPCU"/"3.14 PPXU"
PPXU/PPLD
328 peripheral card inter
processor comm.problem
with TDPC
minor "3.1 Diagnostic Procedure"
on PPLD/PPXU
329 peripheral card fatal
HW detected by TDPC
on PPLD/PPXU
330 peripheral card diag-
nostic failed
on PPLD/PPXU
NTW
334 NTW recovery required major "3.8 NTW Procedure"
UBEX
335 UBEX recovery
required
on UBEX
336 PLLH recovery required major automatic test result on
the"3.1 Diagnostic Procedure"
DURE
26 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
337 SN64 recovery required major automatic test result on
338 SN16 recovery required major automatic test result on
343 SNAP recovery
required
major automatic test result on
Line interface failure
189 loss of signal critical cables,connections
190 loss of signal on link A minor cables,connections
191 loss of signal on link B minor cables,connections
192 AIS alarm major problem in other station equipment(TRAU/BTS) :call TAC
193 AIS alarm on link A minor problem in other station equipment(TRAU/BTS) :call TAC
194 AIS alarm on link B minor problem in other station equipment(TRAU/BTS) :call TAC
257 L1CTS interruption major cables,connections
266 MPCC hot link failed major cables,connections
267 TDPC hot link failed major cables,connections
282 notified Loss of Signal major cables,connections from TRAU
to BSC and LICD card (as
QTLP, in BSC and BSCI in
TRAU) (refer "Diagnostic proce-
dure"chp.3.1 in MMN:TRAU"
and "Diagnostic procedure"
chp.3.4 in MMN:BSC
on LICD card
283 notified AIS alarm major "3.1 Diagnostic Procedure"
on LICD (QTLP) card
291 notified AIS on link A minor "3.1 Diagnostic Procedure"
on LICD card
292 notified AIS on link A minor "3.1 Diagnostic Procedure"
on LICD card
307 notify PDT alignment
lost
warn. cables,connections,configuration between BSC and BTS
Link
68 AP connection failure warn. Call TAC
182 OMAL disconnected major IXLT version "3.5 IXLT"
183 X25 disconnected major IXLT version "3.5 IXLT"
184 CBCL disconnected major IXLT version "3.5 IXLT"
185 CBCL disc.for overload major IXLT version "3.5 IXLT"
DURE
A30808-X3247-L220-2-7620 27
Maintenance
MMN:BSC
269 link down major source code line "3.12 PPLD","3.13 PPXL"
271 NSVC connection
failure
minor line number "3.11 PPCU"/"3.14 PPXU"
Synchronization
139 synchronism of PLLH
error
minor other alarms "3.5 IXLT"
140 sync link error minor
141 PLLH VCXO out of
normal range
minor external syncronization
frequency
"3.9 PLLH" master
142 synchronism failed
measurement
warn. syncronization source require-
ments
"3.9 PLLH" master
152 SYNE without signal minor cable/connector of the synchro-
nization signal
"3.9 PLLH" master
153 PLLH not stable warn. external synchronization source "3.9 PLLH" master
159 PLLH not ready minor wait for PLLH warm up (15 min)
Transceiver problem
66 no call in cell within a
predefined frame
minor problem in BTS : call TAC
70 no call in trx within a
predefined time frame
minor problem in BTS : call TAC
Data base inconsistency
13 TDPC databas not
consistent
warn. SW processing problem : call
TAC
176 LPDL link audit
mismatch
TAC
18 status manager device
handler audit mismatch
TAC
27 database inconsistency
warning
TAC
28 AP circuit pool mismatch warn. SW processing problem : call
TAC
341 database not compat-
ible with ESUSW
TAC
105 uncompatible BSC
configuration
critical HW configuration/version
344 TRAU AMR but pooling
disabled
critical TRAU-HW configuration
DURE
28 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
File system call unsuc-
cessful
4 file system operation
failure
TAC
Input parameter out of
range
25 input parameter out of
range warning
TAC
41 invalid specific problem
in error call
TAC
42 invalid object identifier in
error call
TAC
54 AP A-bis timer fault warn. SW processing problem : call
TAC
56 AP cell overflow warn. SW processing problem : call
TAC
74 AP channel overflow warn. SW processing problem : call
TAC
77 AP connection overflow warn. SW processing problem : call
TAC
79 AP ID2MBIT overflow warn. SW processing problem : call
TAC
87 AP mode overflow warn. SW processing problem : call
TAC
99 AP trx overflow warn. SW processing problem : call
TAC
100 AP terrestrial time slot
overflow
TAC
104 AP HW circuit identity
code overflow
TAC
275 AP BVC overflow warn. SW processing problem : call
TAC
277 AP PCU overflow warn. SW processing problem : call
TAC
279 AP PDT overflow warn. SW processing problem : call
TAC
281 AP PCU timer fault warn. SW processing problem : call
TAC
Invalid pointer
DURE
A30808-X3247-L220-2-7620 29
Maintenance
MMN:BSC
23 invalid pointer warning warn. SW processing problem : call
TAC
24 invalid pointer full initial-
ization
TAC
Message not expected
40 unexpected message
received error
TAC
47 received corrupted
message
TAC
84 AP message length fault warn. SW processing problem : call
TAC
85 AP mandatory element
fault
TAC
86 AP mandatory element
overflow
TAC
88 AP message type fault warn. SW processing problem : call
TAC
94 AP O&M discriminator
fault
TAC
95 AP optional element
overflow
TAC
96 AP optional element fault warn. SW processing problem : call
TAC
98 AP protocol discriminator
fault
TAC
177 invalid asub message warn. SW processing problem : call
TAC
181 invalid abis message warn. SW processing problem : call
TAC
245 AP trace error notifica-
tion invalid parameter
TAC
262 invalid message to
PCUC
TAC
305 ABIC invalid message warn. SW processing problem : call
TAC
26 Message not initialized warn. SW processing problem : call
TAC
32 Message out of
sequence
TAC
DURE
30 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
System call unsuccessful
2 databasa backup failed warn. SW processing problem : call
TAC
3 function call unsuccessful warn. SW processing problem : call
TAC
29 system call unsuc-
cessful warning
TAC
cessful prime task init
TAC
cessful full init
TAC
34 command rejected
warning
TAC
53 inaccessible DUAM error warn. SW processing problem : call
TAC
33 Timeout expired warn. SW processing problem : call
TAC
22 Variable out of range warn. SW processing problem : call
TAC
Cooling system failure see Environmental failure
event
External equipment failure
134 operator defined alarm major operator defined alarms
External power supply
failure
133 main power supply
alarm
major power supply units
Environmental failure event
125 air conditioning equip-
ment alarm
major air temperature/detectors
128 Smoke detected major environment/detectors
18 fire detected critical environment/detectors
22 humidity unacceptable major environment/detectors
129 Intrusion detected major environment/detectors
External transmission
device failure
DURE
A30808-X3247-L220-2-7620 31
Maintenance
MMN:BSC
130 transmission equipment
alarm
major "3.1 Diagnostic Procedure" on
LICD
System resource overload
132 CTR overload warn. Call TAC
188 MSC overload detected critical Call TAC
223 AP trace TDPC over-
load
major Call TAC
243 BTS overload detected critical Call TAC
249 BSC overload detected critical Call TAC
Broadcast channel failure
113 BTS no BCCH available critical Call TAC
167 BCCH outage critical Call TAC
Invalid message received
ABIS/ASUB
warn. Call TAC
109 invalid message from
ABIS/ASUB
warn. Call TAC
263 invalid message from
PCUC
warn. Call TAC
265 invalid reading
message
warn. Call TAC
268 BSSGP invalid
message
warn. Call TAC
Invalid MSU received
106 SCCP invalid MSU
received
warn. wrong parameters received :call
TAC
168 invalid MSU received warn. wrong parameters received :call
TAC
Lapd link protocol failure
174 LPDL link unstable critical cables,connections towards
TRAU
175 LPDL link transition warn. Call TAC
331 BTSM unstable align-
ment
critical cables,connections towards
BTSM
107 Routing failure warn. Call TAC
Remote alarm indicator
DURE
32 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
112 PCM unvailable remote
problems
major Call TAC
204 remote alarm major cables,connections toward BTS
and TRAU
on LICD card
205 remote alarm on link A minor cables,connections of link A
toward BTS and TRAU
on LICD card
206 remote alarm on link B minor cables,connections of link B
toward BTS and TRAU
on LICD card
286 notified remote alarm major cables,connections from TRAU "3.1 Diagnostic Procedure"
on LICD card
297 notified remote alarm
on link A
minor cables,connections of link A
from TRAU
on LICD card
298 notified remote alarm
on link B
minor cables,connections of link B
from TRAU
on LICD card
SS7 Protocol failure
169 SS7 Link activation
failure
warn.
219 unavailable SS7 links
threshold minor
minor SS7 link cables,connector and
interface card (IXLT)
on IXLT card
threshold major
major SS7 link cables,connector and
on IXLT card
threshold critical
critical SS7 link cables,connector and
on IXLT card
252 SS7L failure minor "3.1 Diagnostic Procedure"
on IXLT card
Transmission error
59 remote lower BER
threshold exceeded
warn.
201 higher BER threshold
exceeded
major cables,connections and LICD
from TRAU/BTS
on LICD card
exceeded on link A
minor cables,connections and LICD of
link A from TRAU/BTS
on LICD card
exceeded on link B
link B from TRAU/BTS
on LICD card
210 lower BER threshold
exceeded on link A
link A from TRAU/BTS
on LICD card
211 lower BER threshold
exceeded on link B
link B from TRAU/BTS
on LICD card
DURE
A30808-X3247-L220-2-7620 33
Maintenance
MMN:BSC
287 notified higher BER
threshold exceeded
minor cables,connections and LICD
toward TRAU/BTS
on LICD card
288 notified lower BER
threshold exceeded
minor cables,connections and LICD
toward TRAU/BTS
on LICD card
threshold exceeded ol link A
link A toward TRAU/BTS
on LICD card
threshold exceeded ol link B
link B toward TRAU/BTS
on LICD card
threshold exceeded ol link A
link A toward TRAU/BTS
on LICD card
threshold exceeded ol link B
link B toward TRAU/BTS
on LICD card
ISO probable causes
16 BTSM software version
not defined
warn. call TAC
17 TRAU software version
not defined
warn. call TAC
55 AP BTS Identifier fault warn. call TAC
57 AP cell not configured warn. call TAC
58 AP channel not config-
ured
warn. call TAC
67 AP TRX not configured warn. call TAC
72 AP air timer fault warn. call TAC
73 AP cell global identifica-
tion not present
warn. call TAC
75 AP cell identification not
present
warn. call TAC
81 AP location area code
cell identification not
present
warn. call TAC
82 AP location area code
not present
warn. call TAC
83 AP location area identifi-
cation not present
warn. call TAC
89 AP no adjacent cell warn. call TAC
90 AP no cell present warn. call TAC
93 AP no terrestrial channel call TAC
DURE
34 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
103 AP HW circuit identity
code not configured
warn. call TAC
110 unespected LPDL
established
warn. call TAC
135 AP BTS without all
BBSIG44 CARDS
warn. call TAC
157 Invalid type of SN major SNxx type/version
160 invalid type of PLLH minor PLLL version
162 Invalid type of LICD minor LICD type/version
270 configuration mismatch minor line configuration call TAC
276 AP BVC not configured warn. card not equipped : call TAC
278 AP PCU not configured warn. card not equipped : call TAC
280 AP PDT not configured warn. card not equipped : call TAC
3067 AP routing area code
not present
call TAC
Congestion
43 start throttling error minor error collector on MPCC/TDPC
too busy :call TAC
273 overflow of commands
tables
warn. call TAC
Corrupt data
147 invalid message to RTE warn call TAC
5 check on file contents
failed
warn wrong format file :call TAC
264 invalid access to data warn logical_PPXX table corrupted "3.1 Diagnostic Procedure"
on PPXXD card
304 Invalid message length warn call TAC
308 invalid destination
mailbox
warn call TAC
333 memory buffer
corrupted
warn "3.1 Diagnostic Procedure"
on MEMT card
345 invalid DUAM index warn "3.1 Diagnostic Procedure"
on PPXX,TDPC card
127 Enclosure door open minor door/open sensor
File error
170 error in prepairing file warn call TAC
DURE
A30808-X3247-L220-2-7620 35
Maintenance
MMN:BSC
216 file too long warning warn call TAC
Loss of frame
195 loss of frame alignment minor cables,connections and LICD
196 loss of frame alignment
on link A
minor cables,connections of link A
and LICD
197 loss of frame alignment
on link B
minor cables,connections of link B
and LICD
198 loss of CRC alignment major LICD, PLLH, SNxx
199 loss of CRC alignment
on link A
minor LICD, PLLH, SNxx
200 loss of CRC alignment
on link B
minor LICD, PLLH, SNxx
208 slip alarm on link A minor PLLH, synchronization source in
BTS,BSC,TRAU
209 slip alarm on link B minor PLLH, synchronization source in
BTS,BSC,TRAU
284 notified loss of frame
alignment
major problem in TRAU:call TAC
alignment on link A
minor problem in TRAU:call TAC
alignment on link B
308 notified loss of CRC
alignment
major problem in TRAU:call TAC
alignment on link A
alignment on link B
Out of memory
39 full init requested warn SW processing problem : call
TAC
45 memory not available warn SW processing problem : call
TAC
48 error messages
discarded
minor SW processing problem : call
TAC
60 AP memory message
fault
warn SW processing problem : call
TAC
DURE
36 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
91 AP no memory warn SW processing problem : call
TAC
114 Duam memory overflow major "3.1 Diagnostic Procedure"
on TDPC card
232 dynamic memory pool
overflow uppinit
warn call TAC
311 dynamic memory pool
overflow lowinit
warn call TAC
312 memory overflow
lowinit
warn call TAC
313 memory overflow
uppinit
warn call TAC
Software error
1 command full initialization
required
warn call TAC
9 file transfer aborted by
network element
warn call TAC
10 file transfer failed on
network element
warn call TAC
11 file transfer refused by
network element
warn call TAC
12 status manager data-
base not aligned
warn call TAC
15 generic SW error warn call TAC
19 unable to run test warn call TAC
20 wrong connection
request
warn call TAC
21 connection request
rejected
warn call TAC
35 mailbox not allocated
error
warn call TAC
36 unsuccessful response
from status manager error
warn call TAC
37 spare to prime initializa-
tion
warn call TAC
38 prime to full initialization warn call TAC
46 message discarded warn call TAC
51 deleted current task warn call TAC
DURE
A30808-X3247-L220-2-7620 37
Maintenance
MMN:BSC
52 system restart warn call TAC
69 AP error report warn call TAC
71 AP error indication warn call TAC
76 AP connection not active warn call TAC
78 AP connection status
fault
warn call TAC
80 AP inconsistency warn call TAC
92 AP no radio channel warn call TAC
101 AP not updated warn call TAC
111 AP confusion warn call TAC
115 MEMT semaphore
locked
on PPXX,TDPC card
131 CTR Generic message warn call TAC
PSOS
warn call TAC
137 invalid send message in
RTE
warn call TAC
138 invalid received
message in RTE
warn call TAC
148 PSE error warn call TAC
149 invalid send message warn call TAC
150 invalid stream output warn call TAC
154 invalid close warn call TAC
178 TRAU alignment failed critical call TAC
179 BTSM failed alignment critical call TAC
220 bad software on periph-
eral card
minor PPXL/PPXU/PPCU/PPCC/PPL
D firmware/version
222 AP Trace error notifica-
tion
warn call TAC
229 bring up active
requested
warn restart request
240 report incompleted warn call TAC
248 PPXX device handler
inter processor communica-
tion semaphore locked
on PPXX card
DURE
38 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
250 IMSI trace generic
message
warn call TAC
255 full initialization
occurred
warn call TAC
256 bring up initialization
occurred
warn call TAC
274 PCU alignment failure critical "3.1 Diagnostic Procedure"
on MPCC card
303 notified GBIC configu-
ration mismatch
warn call TAC
309 AP nofree PDT warn call TAC
310 notified GPRS prehem-
tion
warn call TAC
314 deleted current task
lowinit
warn call TAC
315 deleted current task
uppinit
warn call TAC
322 SDSM SM database
not aligned
warn call TAC
323 SDSM database not
aligned
warn call TAC
324 another operation is in
progress
warn call TAC
326 download failed warn call TAC
327 file unusable warn call TAC
332 wrong processor copy warn call TAC
339 file missing minor call TAC
319 invalid status warning warn call TAC
340 buffer not found warn call TAC
SW program abnormally
terminated
14 task aborted by system warn call TAC
238 unable to initialize critical "3.1 Diagnostic Procedure"
on MPCC card
tion abnormal termination
warn call TAC
Storage capacity error
DURE
A30808-X3247-L220-2-7620 39
Maintenance
MMN:BSC
6 intereworking command
table error
warn call TAC
123 Temperature unaccept-
able
major environment/detectors
Underlying resource not
available
warn call TAC
8 file already in use warn call TAC
61 AP no channel present warn call TAC
62 AP no free channels warn call TAC
63 AP no free connections warn call TAC
64 AP no free instance warn call TAC
65 AP no handover refer-
ence
warn call TAC
104 unavailable radio
signalling channels
threshold minor
minor SDCCH channels out of
services: call TAC
signalling channels
threshold major
major call TAC
signalling channels
threshold critical
critical call TAC
164 unavailable abis TCH
threshold minor
minor call TAC
threshold major
major call TAC
threshold critical
critical call TAC
225 unavailable AINTT TCH
threshold minor
minor call TAC
threshold major
major call TAC
threshold critical
critical call TAC
230 MPCC outage critical power supply cards "3.7 MPCC"
231 TDPC outage critical power supply cards "3.20 TDPC"
233 MEMT outage critical power supply cards "3.6 MEMT"
234 DISK outage critical power supply cards "3.3 DISK"
DURE
40 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
235 IXLT outage critical power supply cards "3.5 IXLT"
236 NTW outage critical power supply cards "3.8 NTW Procedure"
241 EPWR outage critical power supply cards "3.15 PWRS (PWRD or
EPWR)"
242 PPCC outage critical power supply cards "3.10 PPCC"
tion unavailability
warn call TAC
247 functionality lost critical BTS object in DISABLE state :
call TAC
251 syne outage critical external synchronisation signal "3.9 PLLH"
253 SS7S failure minor "3.10 PPCC"/"3.13 PPXL"
258 OMAL outage critical power supply cards
259 CBCL outage critical
260 X25 outage critical x25 links "3.5 IXLT"
Version mismatch
7 software not aligned critical SW version
288 IXLT card reset critical SW version
DURE
A30808-X3247-L220-2-7620 41
Maintenance
MMN:BSC
2 Tasklist
2.1 Preventive Maintenance
No preventive maintenance is required for the BSC.
2.2 Cleaning the Rack
Dust and dirt can cause troubles to the hardware. Make sure that the contents of the BSC rack are clean.
Use a dry brush to remove dust.
2.3 Replaceable Fuses
Electrical data of fuses that can be replaced are the following:
Mechanical dimensions are the same for all types of fuses: 5 mm (0.2) (diameter) x 20 mm (0.79)
(length)
DATA TYPE OF FUSE
Rated Current 1 A 10A
Voltage Drop 200 mV 200 mV
Breaking Capacity 35 A/ 250 V / 50 Hz 500 A / 250 V / 50 Hz
Fuse Type quick quick
Rated Voltage 250 Vmax 250 Vmax
Tab. 2.1 Fuse Electrical Data
42 A30808-X3247-L220-2-7620
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A30808-X3247-L220-2-7620 43
Maintenance
MMN:BSC
3 Fault Clearance Procedures for Modules and
Interfaces
44 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
A30808-X3247-L220-2-7620 45
Maintenance
MMN:BSC
3.1 Diagnostic Procedure
The Start Test command (PERFTEST command) activates the diagnostics on the
referred object. As a result, up to four potentially faulty modules are specified. These are
indicated as xxx Module n in the reported test output. The first reported module has a
95 % likelihood originating the fault.
Refer to Appendix for more information about the Diagnostic Test.
1 Lock the module (i.e MPCC module)
bEnter the following command:
System Response:
The command is acknowledged (ACK)
!
Every module, before launching the Test command, must be in LOCKED state
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> MPCC
Command: LOCK MPCC
Name: MPCC:<instance>
Submit
LOCK MPCC:NAME=MPCC:<instance>;
46 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
2 Start the Test
It is possible to perform a test on the single module. The LMT tree is the
following:
For output detailed information h...PROC: General
diagnostic
structure
If the test has been activated on a faulty module h...3
Otherwise h...4
3 System Response 1 - Faulty Module
Go to xxx procedure for all the faulty module,where xxx is the module name
(i.e. CPEX)
If the test pass after the substitution of the faulty module h...5
If the test failed again repeat this test on the other module if there is a falty one
Otherwise call TAC
4 System Response 2 - Working Module
START TEST PASS: Exit to calling
Command: PERFTEST BSCE
Attributes: MORT = <pathname> where path-
name=DISK,DK40,EPWR,IXLT,LICD,LICDS,MEMT,MPCC,NTW,PPCC,PPCU,PPL
D,PPXU,PPXL,PWRD,TDPC
Submit
Perftest BSCE:NAME=<instance>,MORT=<pathname>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> module where
module=DISK,DK40,EPWR,IXLT,LICD,LICDS,MEMT,MPCC,NTW,PPCC,PPCU,PP
LD,PPXU,PPXL,PWRD,TDPC,
Command: PERFTEST module
Name: module:<instance>
Submit
Perftest module:NAME=<module>:<instance>;
i
The Systemoutput depends on the fact that the test is activated on a faulty (Response
1) or working (Response 2) module.
A30808-X3247-L220-2-7620 47
Maintenance
MMN:BSC
5 Record the Reported Additional Info
The Additional Info elds report data useful to the factory to locate the faulty
component on the substituted board.
END
48 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
A30808-X3247-L220-2-7620 49
Maintenance
MMN:BSC
3.2 CPEX
1 Lock the Module before Substitution
System Response:
2 Lock the PWRS (Module Y) Corresponding to the Module to Replace
System Response:
3 Pull down the OFF REQ Switch on the PWRS Module Y
!
If you add one or more cards without EPROM on board, the file containing the
nob_RIU objects must be modified, by means of the IDF Editor Tool, and then down-
loaded by the LMT (see "3.16 Remote Inventory Data").
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> CPEX
Command: LOCK CPEX
Name: CPEX:<instance>
Submit
LOCK CPEX:NAME=CPEX:<instance>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PWRD
Command: LOCK PWRD
Name: PWRD:<Y>
Attributes: None
Submit
LOCK PWRD:<Y>;
i
The modules connected to the PRWS-Y which has been switched off are put into the
"disabled" state.
i
If the PWRS module Y is not in the locked state, it will not switch off.
50 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
System Response:
SYSTEMINFOREPORT:NAME=PWRS:Y
INFORMATION IDENTIFIER=POWER KEYLOCK SWITCH OFF
The red LED on module PWRS is switched on, if power is switched off.
4 Replace the Module
5 Pull up the OFF REQ Switch on PWRS Module Y
System Response:
SYSTEM INFOREPORT:NAME=PWRS:Y
INFORMATIONIDENTIFIER:POWER KEYLOCK SWITCH ON
6 Unlock the PWRS (Module Y) Corresponding to the Module to Replace
System Response:
!
Follow the recommended instructions (see "1.5 Module Replacement
Instructions") and according to the rack structure (see "4 Hardware Equip-
ment")
i
The modules connected to PWRS-Y (which has been switched on) remain in a
"disabled dependency" state because PWRS-Y is LOCKED.
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PWRD
Command: UNLOCK PWRD
Name: PWRD:<instance>
Attributes: None
Submit
UNLOCK PWRD:NAME=<instance>;
i
After the PWRS-instance is unlocked the system puts into an enabled state all
modules connected to the PRWS-Y into an enabled state and executes the crosscopy
of MPCC, TDPC and CPEX and the loading of IXLT.
A30808-X3247-L220-2-7620 51
Maintenance
MMN:BSC
7 Start the Test on CPEX Module
following:
If the start test pass. h... 8
If the test result is FAIL and another module is in alarmed status and not
replaced yet, reinsert the old replaced module, because its possible the fault is
in other part. h... END
8 Unlock the CPEX
System Response:
Attributes: MORT = CPEX:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<CPEX:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> CPEX
Command: PERFTEST CPEX
Submit
Perftest CPEX:NAME=CPEX<copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> CPEX
Command: UNLOCK CPEX
Attributes: None
Submit
UNLOCK CPEX:NAME=CPEX:<instance>;
52 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
9 Update the RI le
Edit the RI-data by the IDF Editor Tool , update the Nob_Riu object le, export
and then download into BSC. h..."3.16 Remote
Inventory Data"
END. Return to the calling procedure.
A30808-X3247-L220-2-7620 53
Maintenance
MMN:BSC
3.3 DISK
System Response:
2 Lock the card related DK40 or MPCC in which the disk takes place
System Response:
!
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> DISK
Command: LOCK DISK
Name: DISK:<instance>
Submit
LOCK DISK:NAME=DISK:<instance>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> DK40/MPCC
Command: LOCK DK40 or
LOCK MPCC
Name: DK40/MPCC:<instance>
Submit
LOCK DK40/MPCC:NAME=DK40/MPCC:<instance>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PWRD/EPWR
Command: LOCK PWRD or
LOCK EPWR
Name: PWRD/EPWR:<Y>
Attributes: None
54 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
System Response:
System Response:
System Response:
Submit
LOCK PWRD/EPWR:<Y>;
i
"disabled" state.
i
!
ment")
i
Command: UNLOCK PWRD or
UNLOCK EPWR
Name: PWRD/EPWR:<instance>
Attributes: None
A30808-X3247-L220-2-7620 55
Maintenance
MMN:BSC
System Response:
8 Start the Test on DISK Module
following:
Submit
UNLOCK PWRD/EPWR:NAME=<instance>;
i
of MPCC, TDPC and DISK and the loading of IXLT (Load from disk).
Attributes: MORT = DISK:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<DISK:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> DISK
Command: PERFTEST DISK
Submit
Perftest DISK:NAME=DISK<copy>;
56 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
9 Start the Test on DK40/MPCC Module
following:
If the start test pass. h...10
in other part. h...END
10 Unlock the DISK
System Response:
Result:
The hard disk is formatted, crosscopied and unlocked automatically by the
system.
Attributes: MORT = DK40/MPCC:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<DK40/MPCC:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> DK40/MPCC
Command: PERFTEST DK40/MPCC
Submit
Perftest DK40/MPCC:NAME=DK40/MPCC<copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> DISK
Command: UNLOCK DISK
Attributes: None
Submit
UNLOCK DISK:NAME=DISK:<instance>;
A30808-X3247-L220-2-7620 57
Maintenance
MMN:BSC
11 Unlock the DK40/MPCC
System Response:
Result:
The hard DK40/MPCC is formatted, crosscopied and unlocked automatically by
the system.
12 Update the RI le
and then download into BSC. h... "3.16 Remote
Inventory Data"
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> DK40/MPCC
Command: UNLOCK DISK
Attributes: None
Submit
UNLOCK DK40/MPCC:NAME=DK40/MPCC:<instance>;
58 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
A30808-X3247-L220-2-7620 59
Maintenance
MMN:BSC
3.4 DK40
This procedure is for the DK40 card without the disc (the disc takes place in MPCC
card).
If the disc is on the DK40 refer to DISK procedure.
System Response:
System Response:
!
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> DK40
Command: LOCK DK40
Name: DK40:<instance>
Submit
LOCK DK40:NAME=DK40:<instance>;
LOCK EPWR
Name: PWRD/EPWR:<Y>
Attributes: None
Submit
LOCK PWRD/EPWR:<Y>;
i
"disabled" state.
60 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
System Response:
System Response:
System Response:
i
!
ment")
i
UNLOCK EPWR
Attributes: None
Submit
i
A30808-X3247-L220-2-7620 61
Maintenance
MMN:BSC
7 Start the Test on DK40 Module
following:
8 Unlock the DK40
System Response:
Result:
The hard disk is formatted, crosscopied and unlocked automatically by the
system.
Attributes: MORT = DK40:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<DK40:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> DK40
Command: PERFTEST DK40
Submit
Perftest DK40:NAME=DK40<copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> DK40
Command: UNLOCK DK40
Attributes: None
Submit
UNLOCK DK40:NAME=DK40:<instance>;
62 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
9 Update the RI le
Inventory Data"
A30808-X3247-L220-2-7620 63
Maintenance
MMN:BSC
3.5 IXLT
1 Check the cables
System Response:
!
!
If the alarm originates from Line Interface Card (LICD) as DTLP or QTLP, and the
alarm is LOSS OF SIGNAL or LOSS OF SIGNAL ON LINK A/B, in detail signal
absent (LOS), LFA alarm present, eer alarm present (BER), RAI alarm present,
check the jumpers on the faulty card are conforming the line impedence requirement
(see "4.8 Jumpers setting") ; check also that the cable connector concerning the line
number in failure state is correctly inserted and not damaged (see IMN:BSC manual).
These alarm conditions are shown by LINE/HWI led in the Lamp Alarm Panel and on
the QTLP front led as the table of Fig. 4.37. If the alarm originates from Interface IXLT
as Communication Failure Event, check the X25 cable connector (W3 on the top
rack) is correctly inserted and not damaged
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> IXLT
Command: LOCK IXLT
Name: IXLT:<instance>
Submit
Lock IXLT:NAME=IXLT:<instance>;
LOCK EPWR
Name: PWRD/EPWR:<Y>
Attributes: None
64 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
System Response:
System Response:
System Response:
Submit
LOCK PWRD/EPWR:<Y>;
i
"disabled" state.
i
!
ment")
i
UNLOCK EPWR
Attributes: None
A30808-X3247-L220-2-7620 65
Maintenance
MMN:BSC
System Response:
8 Start the Test on IXLT Module
following:
Submit
i
Attributes: MORT = IXLT:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<IXLT:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> IXLT
Command: PERFTEST IXLT
Submit
Perftest IXLT:NAME=IXLT<copy>;
66 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
9 Unlock the Module after Substitution
System Response:
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> IXLT
Command: UNLOCK IXLT
Attributes: None
Submit
UNLOCK IXLT:NAME=IXLT:<instance>;
IXLT software upload will take about 3 4 min.
A30808-X3247-L220-2-7620 67
Maintenance
MMN:BSC
3.6 MEMT
System Response:
System Response:
!
If you add one or more cards without EPROM on board, the file containg the nob_RIU
objects must be modified, by means of the IDF Editor Tool, and then downloaded by
the LMT (see "3.16 Remote Inventory Data").
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> MEMT
Command: LOCK MEMT
Name: MEMT:<instance>
Submit
LOCK MEMT:NAME=MEMT:<instance>;
LOCK EPWR
Name: PWRD/EPWR:<Y>
Attributes: None
Submit
LOCK PWRD/EPWR:<Y>;
i
"disabled" state.
i
68 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
System Response:
4 Disconnect the hot link and the hard disk connections between MPCC
copy 0 and copy 1
6 Connect the hot link and the hard disk connections between MPCC copy 0
and copy 1
System Response:
!
ment")
i
UNLOCK EPWR
Attributes: None
Submit
i
A30808-X3247-L220-2-7620 69
Maintenance
MMN:BSC
System Response:
9 Start the Test on MEMT Module
following:
Attributes: MORT = MEMT:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<MEMT:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> MEMT
Command: PERFTEST MEMT
Submit
Perftest MEMT:NAME=MEMT<copy>;
70 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
In this phase, there's an alignment between the two MEMTs that will take about
5 seconds.
System Response:
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> MEMT
Command: UNLOCK MEMT
Attributes: None
Submit
UNLOCK MEMT:NAME=MEMT:<instance>;
A30808-X3247-L220-2-7620 71
Maintenance
MMN:BSC
3.7 MPCC
This procedure is for the MPCC card without the disc (the disc takes place in DK40
card).
If the disc is on the MPCC refer to DISK procedure.
System Response:
The command is acknowledged (ACK)>
System Response:
!
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> MPCC
Command: LOCK MPCC
Submit
LOCK MPCC:NAME=MPCC:<instance>;
LOCK EPWR
Name: PWRD/EPWR:<Y>
Attributes: None
Submit
LOCK PWRD/EPWR:<Y>;
i
"disabled" state.
72 A30808-X3247-L220-2-7620
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System Response:
Before extracting the module, the hot link cable must be unplagged and tucked
out of the way.
System Response:
i
!
ment")
i
UNLOCK EPWR
Attributes: None
Submit
i
A30808-X3247-L220-2-7620 73
Maintenance
MMN:BSC
System Response:
7 Start the Test on MPCC Module
following:
Attributes: MORT = MPCC:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<MPCC:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> MPCC
Command: PERFTEST MPCC
Submit
Perftest MPCC:NAME=MPCC<copy>;
74 A30808-X3247-L220-2-7620
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After the unlock command has been executed the system starts the MPCC
crosscopy (it will take about 5 min). In case of system fault after the crosscopy,
try to repeat Step 5.
System Response:
9 Update the RI le
Inventory Data"
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> MPCC
Command: UNLOCK MPCC
Attributes: None
Submit
UNLOCK MPCC:NAME=MPCC:<instance>;
A30808-X3247-L220-2-7620 75
Maintenance
MMN:BSC
3.8 NTW Procedure
(This procedure is called by several of the xxx procedures).
NTW element is a logical object including the following modules:
PLLH
UBEX
SN16 or SNAP
If one of these modules is faulty, the whole NTW element is alarmed. Further troubles
on any of the above modules (same copy) are not notified, since the NTWelement oper-
ates as a unit from the maintenance point of view. Perform the following steps.
1 Lock the NTW
System Response:
2 Start the Test on NTW Module
following:
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> NTW
Command: LOCK NTW
Name: NTW:<instance>
Submit
LOCK NTW:NAME=NTW:<instance>;
Attributes: MORT = NTW:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<NTW:copy>;
Command: PERFTEST NTW
76 A30808-X3247-L220-2-7620
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3 Result of Diagnostic
If the suspected module is PLLH h...PROC: PLLH
If the suspected module is UBEX h...PROC: UBEX
If the suspected module is SN16 h...PROC: SN16
If the suspected module is SNAP h...PROC: SNAP
END of NTW Procedure
Submit
Perftest NTW:NAME=NTW<copy>;
A30808-X3247-L220-2-7620 77
Maintenance
MMN:BSC
3.9 PLLH
This procedure requires execution of the NTW Procedure as a preliminary step.
Otherwise enter a lock NTW command before replacing the module.
System Response:
System Response:
!
LOCK EPWR
Name: PWRD/EPWR:<Y>
Attributes: None
Submit
LOCK PWRD/EPWR:<Y>;
i
"disabled" state.
i
!
Follow the recommended instructions (see "1.5 Module Replacement Instructions") and
according to the rack structure (see "4 Hardware Equipment")
78 A30808-X3247-L220-2-7620
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System Response:
System Response:
6 Wait at least 15 minutes (warming-up period) before going to next step.
The same precaution must be taken in the event of recovery after a power
supply failure.
i
UNLOCK EPWR
Attributes: None
Submit
i
A30808-X3247-L220-2-7620 79
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following:
h... PROC: NTW
Procedure
Submit
Submit
i
If the test result is FAIL repeat the following step:
- power off the PWRS module
- reinsert the old replaced module
- power on the PWRS module
- go to step 3 of the NTW Procedure
80 A30808-X3247-L220-2-7620
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8 Unlock the NTW
System Response:
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> NTW
Command: UNLOCK NTW
Attributes: None
Submit
UNLOCK NTW:NAME=NTW:<instance>;
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3.10 PPCC
1 Lock the SS7L Link before locking the Module
System Response:
System Response:
!
LMT tree: MANAGED-ELEMENT--> BSS-FUNCTIONAL--> BSC--> SS7L
Command: LOCK SS7L
Name: SS7L:<instance>
Submit
LOCK SS7L:NAME=SS7L:<instance>;
i
If PPCC is disabled, this step is not necessary since the link is already out of service.
Before entering the command, use the LMT command GETSUBO to verify that the
SS7L is subordinate to the PPCC.
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPCC
Command: LOCK PPCC
Name: PPCC:<instance>
Submit
LOCK PPCC:NAME=PPCC:<instance>;
!
ment")
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4 Start the Test on PPCC Module
following:
PPCC software upload will take about 30 sec.
System Response:
The command is acknowledged (ACK)>
Attributes: MORT = PPCC:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<PPCC:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> PPCC
Command: PERFTEST PPCC
Submit
Perftest PPCC:NAME=PPCC<copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPCC
Command: UNLOCK PPCC
Attributes: None
Submit
UNLOCK PPCC:NAME=PPCC:<instance>;
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MMN:BSC
6 If the SS7L has been locked, unlock it
System Response:
7 Update the RI le
Inventory Data"
LMT tree: MANAGED-ELEMENT--> BSS-FUNCTIONAL--> BSC--> SS7L
Command: UNLOCK SS7L
Name: SS7L:<instance>
Attributes: None
Submit
UNLOCK SS7L:NAME=SS7L:<instance>;
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3.11 PPCU
1 Lock the Module before Subsitution
System Response:
!
If you add one or more cards without EPROMon board, the file containing the nob-RIU
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPCU
Command: LOCK PPCU
Name: PPCU:<instance>
Submit
LOCK PPCU:NAME=PPCU:<instance>;
!
ment")
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3 Start the Test on PPCU Module
following:
PPCU FWself-test will take about 10 seconds; the software load will take about
2 minutes.
System Response:
Attributes: MORT = PPCU:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<PPCU:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> PPCU
Command: PERFTEST PPCU
Submit
Perftest PPCU:NAME=PPCU<copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPCU
Command: UNLOCK PPCU
Attributes: None
Submit
UNLOCK PPCC:NAME=PPCC:<instance>;
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3.12 PPLD
System Response:
!
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPLD
Command: LOCK PPLD
Name: PPLD:<instance>
Submit
LOCK PPLD:NAME=PPLD:<instance>;
!
ment")
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3 Start the Test on PPLD Module
following:
The PPLD software upload will take about 30 sec.
System Response:
Attributes: MORT = PPLD:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<PPLD:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> PPLD
Command: PERFTEST PPLD
Submit
Perftest PPLD:NAME=PPLD:<copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPLD
Command: UNLOCK PPLD
Attributes: None
Submit
UNLOCK PPLD:NAME=PPLD:<instance>;
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5 Update the RI le
Inventory Data"
90 A30808-X3247-L220-2-7620
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3.13 PPXL
System Response:
!
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPXL
Command: LOCK PPXL
Name: PPXL:<instance>
Submit
LOCK PPLD:NAME=PPXL:<instance>;
!
ment")
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3 Start the Test on PPXL Module
following:
System Response:
Attributes: MORT = PPXL:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<PPXL:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> PPXL
Command: PERFTEST PPXL
Submit
Perftest PPXL:NAME=PPXL<copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPXL
Command: UNLOCK PPXL
Attributes: None
Submit
UNLOCK PPXL:NAME=PPXL:<instance>;
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3.14 PPXU
System Response:
!
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPXU
Command: LOCK PPXU
Name: PPXU:<instance>
Submit
LOCK PPXU:NAME=PPXU:<instance>;
!
ment")
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3 Start the Test on PPXU Module
following:
System Response:
Attributes: MORT = PPXU:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<PPXU:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> PPXU
Command: PERFTEST PPXU
Submit
Perftest PPXU:NAME=PPXU:<copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPXU
Command: UNLOCK PPXU
Attributes: None
Submit
UNLOCK PPXU:NAME=PPXU:<instance>;
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3.15 PWRS (PWRD or EPWR)
Notes:
PWRS refers to the Power Supply module to be replaced; Froma hardware point of
view, the four power suppliers in the BSC Rack are referred to as PWRS modules.
Froma software point of view (LMT interface), the power suppliers in the BSC Rack
are called:
PWRD 0..1 (PWRS modules for the Base Rack)
EPWR 0..1 (PWRS modules for the Extension Rack)
it can be either a PWRD or a EPWR module, depending on the rack area - Base or
Extended that it belongs to.
If an EPWR is alarmed, rst check whether the opposite IXLT is working (the HW
sense points supervising the EPWR are residing on the opposite IXLT copy). If the
IXLT copy is inaccessible, the opposite copy of EPWR cannot be initialized after a
FULL INIT.
If the IXLT copy is inaccessible and the opposite EPWR is powered down, it is not
recognized by the systembecause the sense points on the IXLT cannot be read and
the EPWR remains in the enabled state even though it is powered off. Avoid
powering off an EPWR when the opposite IXLT is faulty.
System Response:
!
LOCK EPWR
Name: PWRD/EPWR:<Y>
Attributes: None
Submit
LOCK PWRD/EPWR:<Y>;
i
"disabled" state.
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System Response:
3 Switch off the PWRS Module by pressing the red button. Use a pointed
tool such as a pencil
System Response:
1. All the lamps on the module switch off.
5 Switch on the PWRS module by pressing the black "OI" switch
System Response:
The red lamp on the module switches on.
System Response:
i
!
ment")
i
UNLOCK EPWR
Attributes: None
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MMN:BSC
System Response:
8 Update the RI le
Inventory Data"
Submit
i
98 A30808-X3247-L220-2-7620
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3.16 Remote Inventory Data
For every rack, the RLC provides one floppy disk which includes an inventory data file
that contains all the inventory objects belonging to the rack.
The file name is composed of the serial number of the rack (where / is replaced by _)
with the extension IDF.
In case of a nob_RIU, the inventory data can be directly managed by the Operator using
the IDF Editor and performing the following action:
Delete nob_RIU record (see Fig. 3.1)
Create nob_RIU record (see Fig. 3.2)
Edit nob_RIU record (see Fig. 3.3)
Attach a nob_RIU le (see Fig. 3.4)
Fig. 3.1 Delete nob_Record
i
In case of a new ob_RIU object installation, the system automatically provides the
inventory data after the physical recovery of the module. No inventory data administra-
tion is reguired. Upload the latest version of the IDF for backup purposes.
100 A30808-X3247-L220-2-7620
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Fig. 3.2 Create nob_Record
Fig. 3.3 Edit nob_Record
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Fig. 3.4 Attach nob_RIU file
The nob_RIU available for BSC are listed in the following table:
Functional
Address
Functional
Address Type
BSC-FRAME-0 F:BSCB
BSC-FRAME-1 F:BSCEB
BSC-RACK R:BSC
DK40-0 M:DK40
EARTHQUAKE-0 MK:EQ4
EPWR-0 M:PWRS
EPWR-1 M:PWRS
FIREPROT-0 MK:FG
MKNEWBSC-0 MK:NEWBSC
MKOLDBSC-0 MK:OLDBSC
MPCC-0 M:MPCC
MPCC-1 M:MPCC
PPCC-0 M:PPCC
PPCC-1 M:PPCC
PPLD-0 M:PPLD
Tab. 3.1 List of nob_RIUs for BSC Standard
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PPLD-1 M:PPLD
PPLD-10 M:PPLD
PPLD-11 M:PPLD
PPLD-12 M:PPLD
PPLD-13 M:PPLD
PPLD-14 M:PPLD
PPLD-2 M:PPLD
PPLD-3 M:PPLD
PPLD-4 M:PPLD
PPLD-5 M:PPLD
PPLD-6 M:PPLD
PPLD-7 M:PPLD
PPLD-8 M:PPLD
PPLD-9 M:PPLD
PWRS-0 M:PWRS
PWRS-1 M:PWRS
Functional
Address
Functional
Address Type
Tab. 3.1 List of nob_RIUs for BSC Standard
Functional
Address
Functional
Address Type
BSC-FRAME-0 F:BSCL
BSC-FRAME-1 F:BSCU
BSC-RACK R:BSC
EARTHQUAKE-0 MK:EQ4
FANB FANB
MKCABMP-0 MK:CABMP
MKNEWBSC-0 MK:NEWBSC
ADC-0/0 M:ADC
ADC-0/1 M:ADC
ADC-0/2 M:ADC
ADC-0/3 M:ADC
ADC-0/4 M:ADC
ADC-0/5 M:ADC
Tab. 3.2 List of nob_RIUs for BSC High Capacity
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MMN:BSC
ADC-0/6 M:ADC
ADC-0/7 M:ADC
ADC-0/8 M:ADC
ADC-0/9 M:ADC
ADC-0/10 M:ADC
ADC-0/11 M:ADC
ADC-0/12 M:ADC
ADC-0/13 M:ADC
ADC-0/14 M:ADC
ADC-0/15 M:ADC
ADC-0/16 M:ADC
ADC-0/17 M:ADC
ADC-0/18 M:ADC
ADC-0/19 M:ADC
PLADS PLADS
ETHCAB-0 ETHCAB
ETHCAB-1 ETHCAB
PWRS-0 M:PWRS
PWRS-1 M:PWRS
Functional
Address
Functional
Address Type
Tab. 3.2 List of nob_RIUs for BSC High Capacity
104 A30808-X3247-L220-2-7620
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1 Upload local IDT from the BSC
The user must enter the "Upload local idf le" command in order to create a
local copy of the le on the local LMT.
2 Open IDT File
Start the IDF Editor from the LMT window and open the uploaded IDT le by
selecting "File --> Open" men.
To delete a nob_Record h...3
To create a new nob_Record h...4
To attach a nob_RIU le h...5
To edit the RI-data from the replaced Unit h...6
3 Delete a nob_Record
Select the S-Record, open the "Delete" dialog box by clicking the right mouse
button to delete the S-Record.
......Fig. 3.1
If no additional modications are necessary h...7
LMT tree: MANAGED-ELEMENT--> BSS EQUIPMENT--> REMINV
Command: LOCK REMINV
Name REMINV=<instance>
Submit
UPLLIDF REMINV:NAME=<instance>
LMT tree: MANAGED-ELEMENT--> BSS EQUIPMENT--> REMINV
Command: UPLLIDF REMINV
Name REMINV=<instance>
Attributes: DESTDIR = <..\idf\upload>
FILE ="bsc.idt"
OVERWRITE = <overwrite>
Submit
UPLLIDF REMINV:NAME=<instance>DESTDIR=<destdir>,FILE=bsc.idt,OVERWRITE=YES;
A30808-X3247-L220-2-7620 105
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MMN:BSC
4 Create a new nob_Record
Select the N-Record, open the "Create" dialog box by clicking the right mouse
button and create a new nob_RIU object.
...... Fig. 3.2
If no additional modications are necessary h... 7
5 Attach nob_RIU le to actually loaded IDF or IDT
bTo create a new nob_RIU le coming from the RLC disk, enter the following
command:
The nob_RIU records are shown in bold letters. ...... Fig. 3.4
6 Edit the RI-data from the replaced Unit
Start the IDF-Editor and open the uploaded IDT le by selecting <File: Open>.
The following window appears, and all the RI-records are displayed. The
nob_RIU records are shown in bold letters.
Move the mouse cursor to the I-record to be updated and press the right mouse-
button. The edit functionality is activated.
...... Fig. 3.3
7 Remove all redundant nob_RIUs
After importing IDFs coming from the RLC or after replacing a card originally a
nob_RIU against another card, now having inventory data on board, the same
board would be reported twice.
This command can be applied only for IDFs with inventory of only one BSC. It
cannot be used for central IDFs.
Command: <File: Attach>
Input: <NOB file to be attached>
Result: The inventory objects of the <NOB file to be attached> are
attached to the actually loaded IDF or IDT. The number of
attached objects is displayed after command execution.
Command: <File: Remove nob_RIUs>
Input: <none>
106 A30808-X3247-L220-2-7620
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8 Export nob_RIU le
A copy of this NOB le is saved in the C:\LMT_root\..\idf\download directory,
where it can be accessed only by the LMT during execution of the "Download
nob_RIU" command.
The command is only applicable for IDFs with an inventory of one NE. It cannot
be applied to central IDFs. The lename is BSCNRIU for the BSC.
9 Download of the nob_RIU le
This step must be executed to transfer the le modied on the local LMT to the
BSC.
END
Command: <Export: NOB>
Input: <new filename>
(default filename is retained from the "SalesUniqueName" field of
the IDF)
Result: nob_RIU part of the modified IDF/IDT is saved for further
processing
LMT tree: MANAGED-ELEMENT--> BSS EQUIPMENT--> BSCE --> REMINV
Command: DNLIDFD REMINV
Name: REMINV=<instance>
Attributes: SRCDIR = <..\idf\download>
Submit
DNLIDFD REMINV:NAME=REMINV:<instance>,SRCDIR=<..\idf\download>;
A30808-X3247-L220-2-7620 107
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3.17 QTLP/STLP
1 Check the cables
System Response:
!
!
If the alarmoriginates fromLine Interface Card (LICD) as QTLP/STLP, and the alarmis
LOSS OF SIGNAL or LOSS OF SIGNAL ON LINK A/B, in detail signal absent
(LOS), LFA alarm present, eer alarm present (BER), RAI alarm present, check the
jumpers on the faulty card are conforming the line impedence requirement (see
"4.8 Jumpers setting") ; check also that the cable connector concerning the line
number in failure state is correctly inserted and not damaged (see IMN:BSC manual).
These alarm conditions are shown by LINE/HWI led in the Lamp Alarm Panel and on
the QTLP/STLP front led as the table of Fig. 4.37. If the alarmoriginates fromInterface
IXLT as Communication Failure Event, check the X25 cable connector (W3 on the top
rack) is correctly inserted and not damaged
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> LICD
Command: LOCK LICD
Name: LICD:<instance>
Submit
LOCK LICD:NAME=LICD:<instance>;
!
ment")
108 A30808-X3247-L220-2-7620
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4 Start the Test on LICD Module
following:
System Response:
Attributes: MORT = LICD:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<LICD:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> LICD
Command: PERFTEST LICD
Submit
Perftest LICD:NAME=LICD<copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> LICD
Command: UNLOCK LICD
Attributes: None
Submit
UNLOCK LICD:NAME=LICD:<instance>;
A30808-X3247-L220-2-7620 109
Maintenance
MMN:BSC
6 Update the RI le
Inventory Data"
110 A30808-X3247-L220-2-7620
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A30808-X3247-L220-2-7620 111
Maintenance
MMN:BSC
3.18 SN16
Otherwise add a lock NTW command before replacing the module.
System Response:
System Response:
!
If you add one or more cards without EPROM on board, the file containig the nob_RIU
LOCK EPWR
Name: PWRD/EPWR:<Y>
Attributes: None
Submit
LOCK PWRD/EPWR:<Y>;
i
"disabled" state.
i
!
ment")
112 A30808-X3247-L220-2-7620
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System Response:
System Response:
i
UNLOCK EPWR
Attributes: None
Submit
i
A30808-X3247-L220-2-7620 113
Maintenance
MMN:BSC
following:
h... PROC: NTW
Procedure
7 Unlock the NTW
System Response:
Submit
Submit
i
Command: UNLOCK NTW
Attributes: None
Submit
114 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
8 Update the RI le
Inventory Data"
A30808-X3247-L220-2-7620 115
Maintenance
MMN:BSC
3.19 SNAP
Otherwise enter the lock NTW command before replacing the module.
System Response:
System Response:
!
LOCK EPWR
Name: PWRD/EPWR:<Y>
Attributes: None
Submit
LOCK PWRD/EPWR:<Y>;
i
"disabled" state.
i
!
ment")
116 A30808-X3247-L220-2-7620
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4 Disconnect the hot link and the hard disk connections between TDPC
copy 0 and copy 1
System Response:
System Response:
7 Connect the hot link and the hard disk connections between TDPC copy 0
and copy 1
i
UNLOCK EPWR
Attributes: None
Submit
i
A30808-X3247-L220-2-7620 117
Maintenance
MMN:BSC
following:
h... PROC: NTW
Procedure
Submit
Submit
i
118 A30808-X3247-L220-2-7620
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9 Unlock the NTW
System Response:
Command: UNLOCK NTW
Attributes: None
Submit
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Maintenance
MMN:BSC
3.20 TDPC
System Response:
System Response:
i
At least one MEMT copy must be enabled; therefore, activation might be necessary
prior to starting this procedure. For the second TDPC, the usual procedure can be
applied, see below.
!
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> TDPC
Command: LOCK TDPC
Name: TDPC:<instance>
Submit
LOCK TDPC:NAME=TDPC:<instance>;
LOCK EPWR
Name: PWRD/EPWR:<Y>
Attributes: None
Submit
LOCK PWRD/EPWR:<Y>;
i
"disabled" state.
120 A30808-X3247-L220-2-7620
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System Response:
4 Replace the module
Before extracting the module the hot link cable must be unplugged and tucked
out of the way.
5 Pull up the OFF REQ Switch on PWRS (Module Y) Corresponding to the
Module to Replace
System Response:
6 Unlock the PWRS module Y
i
!
ment")
i
UNLOCK EPWR
Attributes: None
Submit
i
A30808-X3247-L220-2-7620 121
Maintenance
MMN:BSC
System Response:
7 Start the Test on TDPC Module
following:
Attributes: MORT = TDPC:copy
Submit
Perftest BSCE:NAME=<instance>,MORT=<TDPC:copy>;
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> TDPC
Command: PERFTEST TDPC
Submit
Perftest TDPC:NAME=TDPC:<copy>;
122 A30808-X3247-L220-2-7620
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After the unlock command has been executed, the system starts the TDPC
crosscopy (it will take about 5 min). In the event of system fault after the cross-
copy, repeat Step 5.
System Response:
LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> TDPC
Command: UNLOCK TDPC
Attributes: None
Submit
UNLOCK TDPC:NAME=TDPC:<instance>;
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Maintenance
MMN:BSC
3.21 UBEX
Otherwise, enter the lock NTW command before replacing the module.
System Response:
System Response:
!
LOCK EPWR
Name: PWRD/EPWR:<Y>
Attributes: None
Submit
LOCK PWRD/EPWR:<Y>;
i
"disabled" state.
i
!
ment")
124 A30808-X3247-L220-2-7620
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System Response:
System Response:
i
UNLOCK EPWR
Attributes: None
Submit
i
A30808-X3247-L220-2-7620 125
Maintenance
MMN:BSC
following:
h... PROC: NTW
Procedure
Submit
Submit
i
126 A30808-X3247-L220-2-7620
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7 Unlock the NTW
System Response:
Command: UNLOCK NTW
Attributes: None
Submit
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MMN:BSC
4 Hardware Equipment
BSC rack layout
The BSC is available in the following configuration:
base subrack (BSCB) and expansion subrack (BSCE).
Fig. 4.1 identifies the Standard BSC rack frame, both for the base and the extension
subracks.
Fig. 4.2 identifies the Standard BSC rack for the GPRS feature.
Fig. 4.3 identifies the Standard BSC rack frame for maximum GPRS channels configu-
ration.
Fig. 4.4 identifies the Standard BSC rack image in fire resistence version.
Fig. 4.5 identifies the High Capacity BSC - 120 channels rack frame.
The expansion subrack are shown in the maximum configuration.
128 A30808-X3247-L220-2-7620
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Fig. 4.1 Standard BSC rack layout and size (S30861-C20-X)
18 23 27 42 46 50 54 58 62
P
P
L
D
1
4
P
P
L
D
1
3
P
P
L
D
1
2
P
P
L
D
1
1
P
P
L
D
1
0
P
P
L
D
9
18 23 27 42 46 50 54 58 62
P
P
L
D
7
P
P
L
D
6
P
P
L
D
5
P
P
L
D
4
P
P
L
D
3
P
W
R
S
0
P
W
R
S
1
3 31 35 71
18
P
P
L
H
25 29 43 48 53 58 63 71
0
12
I
X
L
T
17 25 3944 54586368
0
U
B
E
X
0
P
W
R
S
0
2 3034 71
D
K
4
0
0
P
W
R
S
1
P
P
C
C
38 33 3
1
0
P
P
C
C
0
P
P
L
D
2
P
P
L
D
1
P
P
L
D
0
P
L
L
H
1
S
N
X
X
0
T
D
P
C
0
M
E
M
T
0
M
P
C
C
0
M
P
C
C
1
M
E
M
T
1
T
D
P
C
1
S
N
X
X
1
U
B
E
X
1
I
X
L
T
1
20 49
2000
600
Rack dimensions:
Width
Volume
=
300
mm
mm
mm
Card dimensions:
220 x 278 mm
Weight = 128 Kg
Notes:
s= spare, for N+1 redundancy
SNXX = SN16
Height
Depth
=
=
=
0,260 m
3
=
QTLP
T
A
B
C
E
D
G
LP
BSCE
BFAP
BSCB
O
F
A
F
OPDS
L
I
C
D
8
L
I
C
D
7
L
I
C
D
6
L
I
C
D
5
L
I
C
D
4
L
I
C
D
3
L
I
C
D
2
L
I
C
D
P
P
L
D
8
L
I
C
D
1
L
I
C
D
0
L
I
C
D
S
S
1
LICD
A30808-X3247-L220-2-7620 129
Maintenance
MMN:BSC
Fig. 4.2 Standard BSC frame for the GPRS feature
18 23 27 42 46 50 54 58 62
P
P
C
U
1
18 23 27 42 46 50 54 58 62
P
P
L
D
6
P
P
L
D
5
P
P
L
D
4
P
P
L
D
3
P
W
R
S
0
P
W
R
S
1
3 31 35 71
18
P
L
L
H
25 29 43 48 53 58 63 71
0
12
I
X
L
T
17 25 3944 54586368
0
U
B
E
X
0
P
W
R
S
0
2 3034 71
D
K
4
0
0
P
W
R
S
1
P
P
C
C
38 33 3
1
P
P
C
C
0
P
P
L
D
2
P
P
L
D
1
P
P
L
D
0
P
L
L
H
1
S
N
X
X
0
T
D
P
C
0
M
E
M
T
0
M
P
C
C
0
M
P
C
C
1
M
E
M
T
1
T
D
P
C
1
S
N
X
X
1
U
B
E
X
1
I
X
L
T
1
20 49
38
P
P
C
U
0
18 23 27 42 46 50 54 58 62
P
P
C
U
1
P
P
C
U
3
18 23 27 42 46 50 54 58 62
P
P
C
U
2
P
P
L
D
6
P
P
L
D
5
P
P
L
D
4
P
P
L
D
3
P
W
R
S
0
P
W
R
S
1
3 31 35 71
18
P
L
L
H
25 29 43 48 53 58 63 71
0
12
I
X
L
T
17 25 3944 54586368
0
U
B
E
X
0
P
W
R
S
0
2 3034 71
D
K
4
0
0
P
W
R
S
1
P
P
C
C
38 33 3
1
P
P
C
C
0
P
P
L
D
2
P
P
L
D
1
P
P
L
D
0
P
L
L
H
1
S
N
X
X
0
T
D
P
C
0
M
E
M
T
0
M
P
C
C
0
M
P
C
C
1
M
E
M
T
1
T
D
P
C
1
S
N
X
X
1
U
B
E
X
1
I
X
L
T
1
20 49
38
P
P
C
U
0
P
P
L
D
8
P
P
L
D
7
P
P
L
D
10
P
P
L
D
9
OPDS OPDS
L
I
C
D
8
L
I
C
D
7
L
I
C
D
6
L
I
C
D
5
L
I
C
D
4
L
I
C
D
3
L
I
C
D
2
L
I
C
D
S
1
L
I
C
D
1
L
I
C
D
0
L
I
C
D
S
0
L
I
C
D
1
L
I
C
D
0
L
I
C
D
S
0
L
I
C
D
5
L
I
C
D
4
L
I
C
D
3
L
I
C
D
2
L
I
C
D
S
1
L
I
C
D
8
L
I
C
D
7
L
I
C
D
6
130 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
Fig. 4.3 Standard BSC rack frame for max GPRS channels configuration
18
Q
T
L
P
23 27 42 46 50 54 58 62
8
Q
T
L
P
7
Q
T
L
P
6
18
Q
T
L
P
23 27 42 46 50 54 58 62
5
Q
T
L
P
4
Q
T
L
P
3
Q
T
L
P
2
Q
T
L
P
S
1
P
W
R
S
0
P
W
R
S
1
3 31 35 71
18
P
L
L
H
25 29 43 48 53 58 63 71
0
12
I
X
L
T
17 25 3944 54586368
0
U
B
E
X
0
P
W
R
S
0
2 3034 71
D
K
4
0
0
P
W
R
S
1
P
P
X
L
Q
T
L
P
S
38 33 3
1
0
Q
T
L
P
0
Q
T
L
P
1
P
P
X
L
0
P
L
L
H
1
S
N
A
P
0
T
D
P
C
0
M
E
M
T
0
M
P
C
C
0
M
P
C
C
1
M
E
M
T
1
T
D
P
C
1
S
N
A
P
1
U
B
E
X
1
I
X
L
T
1
20 49
38
P
P
X
U
0
P
P
X
U
1
P
P
X
U
2
P
P
X
U
3
P
P
X
U
5
P
P
X
U
4
T
A
B
C
E
G
LP
BSCE
BFAP
BSCB
O
F
A
F
D
H
OPDS
A30808-X3247-L220-2-7620 131
Maintenance
MMN:BSC
Fig. 4.4 Standard BSC rack in fire resistence cabinet version
18
Q
T
L
P
23 27 42 46 50 54 58 62
8
Q
T
L
P
7
Q
T
L
P
6
18
Q
T
L
P
23 27 42 46 50 54 58 62
5
Q
T
L
P
4
Q
T
L
P
3
Q
T
L
P
2
Q
T
L
P
S
1
P
W
R
S
0
P
W
R
S
1
3 31 35 71
18
P
L
L
H
25 29 43 48 53 58 63 71
0
12
I
X
L
T
17 25 3944 54586368
0
U
B
E
X
0
P
W
R
S
0
2 3034 71
D
K
4
0
0
P
W
R
S
1
P
P
X
L
Q
T
L
P
S
38 33 3
1
0
Q
T
L
P
0
Q
T
L
P
1
P
P
X
L
0
P
L
L
H
1
S
N
A
P
0
T
D
P
C
0
M
E
M
T
0
M
P
C
C
0
M
P
C
C
1
M
E
M
T
1
T
D
P
C
1
S
N
A
P
1
U
B
E
X
1
I
X
L
T
1
20 49
38
P
P
X
U
0
P
P
X
U
1
P
P
X
U
2
P
P
X
U
3
P
P
X
U
5
P
P
X
U
4
T
A
B
C
E
G
LP
BSCE
BFAP
BSCB
O
F
A
F
D
H
OPDS
132 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
Fig. 4.5 High Capacity BC120HC rack frame (S30861-C36/C40-X)
T
L
P
7
S
T
L
P
5
S
T
L
P
4
S
T
L
P
3
S
T
L
P
S
1
P
L
L
H
0
I
X
L
T
0
U
B
E
X
0
P
W
R
D
0
P
W
R
D
1
P
P
X
L
S
T
L
P
S 1
0
S
T
L
P
0
S
T
L
P
1
P
P
X
L
0
P
L
L
H
1
S
N
A
P
0
T
D
P
C
0
M
E
M
T
0
M
P
C
C
0
M
P
C
C
1
M
E
M
T
1
T
D
P
C
1
S
N
A
P
1
U
B
E
X
1
I
X
L
T
1
P
P
X
U
1
P
P
X
U
3
P
P
X
U
5
P
P
X
U
6
P
P
X
U
1
P
P
X
U
8
T
A
B
C
E
G
LP
BSCEB
BFAP
BSCB
F
D
S
T
L
P
8
S
T
L
P
9
S
T
L
P
6
S P
P
X
U
1
P
P
X
U
9
P
P
X
U
7
0 1
P
P
X
U
2
P
P
X
U
4
P
P
X
U
0
S
T
L
P
2
H
BC120 HC
C
P
E
X
0
C
P
E
X
1
A30808-X3247-L220-2-7620 133
Maintenance
MMN:BSC
!
PWRS V4 is considered mandatory inside the BSC Expansion Rack in case of upgrade
to High Capacity or in case of a new BSC HC field installation.
!
For PCM24 system its mandatory to use the QTLP V2 in conjunction with PPLHV2
i
Check on the Installation Manual the TDPC-MPCC compatibility versions.
134 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
A30808-X3247-L220-2-7620 135
Maintenance
MMN:BSC
4.1 Rack Connections
Fig. 4.6 identifies the rack connection blocks.
Fig. 4.6 BSC Rack Connection Blocks
Tab. 4.1 identifies the correspondence between the connector pins for the PCM line
(120 Ohm) and the PCM line wires, identified by the number of the line within a QTLP
board, receiving or transmitting side, wire A or B.
Y0
Y1
Y3
Y2
W40 W26
to GND
-48 + -48 +
to GND
W2
W3
PP0 PP1
Y4
Y5
Y6
Y7
RAS
PM2
RGB
PM3
W20
W10
Temp. Sensors
GND bold
136 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
* Pins not used into connectors Y1 and Y0.
Nr. PIN
SUB-D37
EVEN PCM link ODD PCM link
1/20 PCM0 Input Link A/B PCM1 Input Link A/B
2/21 PCM0 Output Link A/B PCM1 Output Link A/B
3 Ground Ground
26 Ground Ground
10 Ground Ground
11/29* PCM0 Input Link A/B PCM1 Input Link A/B
12/30* PCM0 Output Link A/B PCM1 Output Link A/B
33 Ground Ground
17 Ground Ground
Tab. 4.1 Assignment of even and odd PCM Links to SUB-D 37 Connectors
i
the even PCM link is assigned to SUB-D 37 connnectors W20, Y7, Y5, Y2, Y1
the odd PCM link is assigned to SUB-D37 connectors W10, Y6, Y4, Y3, Y0
A30808-X3247-L220-2-7620 137
Maintenance
MMN:BSC
4.2 Rack Connection for BC120-HC
The Fig. 4.7 shows the rack connection blocks for the BC120-HC.
10A 10A
+ +
W10B
W200B
W20B
Y3B
Y4B
W10A
W20A
W200A
Y4A
Y5A
Y5B
Y6B
Y7B
Y9B
Y6A
Y9A
PP0
48V
GND GND
R
C
A
P

D
E
X
R
C
A
P

S
I
N
W3
W26
W40
RAS
PM2
PM3
W2
Y7A
Y8A Y8B
PP1
Y3A
48V
138 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
Fig. 4.7 RCAP in the BC120 - HC
SHELF CARD Top rack connectors
Rx/Tx PCM lines 0...5
Top rack connectors
Rx/Tx PCM lines 6...11
LOW STLP0 W10B W10A
STLP1 W20B W20A
STLP2 W200B W200A
UPPER STLP3 Y3B Y3A
STLP4 Y4B Y4A
STLP5 Y5B Y5A
STLP6 Y6B Y6A
STLP7 Y7B Y7A
STLP8 Y8B Y8A
STLP9 Y9B Y9A
Tab. 4.2 Cross references for PCM lines
Pin Signal PCM line on type B
connectors
side PCMline ontype A
connectors
side
1
20
LIA0
LIR0
PCM 0 Input Rx PCM 6 Input Rx
2
21
LOA0
LOR0
PCM 0 Output Tx PCM 6 Output Tx
3 GND
4
22
LIA1
LIR1
5
23
LOA1
LOR1
PCM 1 Output Tx PCM7 0 Output Tx
17 GND
6
24
LIA2
LIR2
7
25
LOA2
LOR2
26 GND
8
27
LIA3
LIR3
9
28
LOA3
LOR3
10 GND
Tab. 4.3 Signal pin connector on SUB D37
A30808-X3247-L220-2-7620 139
Maintenance
MMN:BSC
11
29
LIA4
LIR4
12
30
LOA4
LOR4
13
31
LIA5
LIR5
PCM 5Input Rx PCM 11 Input Rx
14
32
LOA5
LOR5
33 GND
Pin Signal PCM line on type B
connectors
side PCMline ontype A
connectors
side
Tab. 4.3 Signal pin connector on SUB D37
140 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
4.3 Fuse and Alarm Panel of the C20-X rack
Fig. 4.8 and Fig. 4.9 showthe complete layout of the fuse and alarmpanel. Three Leds
are located on each power supply panel and 24 on the fuse and alarmpanel; relays are
associated to 8 of them.
Fig. 4.8 shows only the LED alarmpanel while Fig. 4.9 shows the fuse and the connec-
tion with the LMT.
Fig. 4.8 Alarm LEDs on the BSC Fuse and Alarm Panel
On the alarm panel, LEDs are colored as follows:
green LEDs are used for localizing equipment status;
yellow LEDs are used to signal minor severity alarms;
red LEDs are used to signal major and critical severity alarms.
The rack is enclosed by front doors: therefore, the alarm panel is not visible during
normal operation; however, three summary LEDs also extend (in parallel) to lamps
located outside the rack. These external lamps illuminate when a critical, major or minor
alarm (all BSC alarms OR-ed) is present.
Three LEDs perform this display function on the alarm panel: one red LED for critical
alarms, one orange LED for major alarms and one yellow LED for minor alarms.
LEDs located on the fuse and alarm panel can be subdivided in the following groups:
GLOBAL ALARM:
illuminated red LED for CRITICAL alarm
illuminated orange LED for MAJOR alarm
illuminated yellow LED for MINOR alarm
SYSTEM ALARM:
illuminated red LED and not ashing for MAJOR alarm
red LED ashing for CRITICAL alarm
illuminated yellow LED for MINOR alarm
ENV
SAI
PAI
MINOR
ALARM
S/W
RUN
NEW
OLD
EQUIPMENT STATUS
MPCC TDPC PPXX
LINE NTW CLOCK
TRAU BTS DISK HWI OMC
COMMUNICATION
GLOBAL
ALARM
MIN
E
Q
P
C
O
M
Q
O
S
SYSTEM ALARM
CRT
MJR
A30808-X3247-L220-2-7620 141
Maintenance
MMN:BSC
EQUIPMENT STATUS - COMMUNICATION:
green illuminated LED for no alarm
green LED ashing for alarm
Tab. 4.4 describes the correspondence between the LEDs on the fuse and alarmpanel
and the related objects in the Equipment and Communication areas. The first column
reports the LEDs; the second column contains the list of the physical objects that will
switch on in the event of fault.
S/W RUN (NEW and OLD):
S/W RUN LEDs are normally switched off. They illuminate only during the change
version procedure.
When a LED is illuminated, it indicates which software version is currently running.
These LEDs switch off when the operator enters the appropriate command (end of
change version).
MINOR ALARM:
SAI PAI
alarm related to PCMS lines
alarm related to PCMB lines
ENV
illuminated and not ashing indicates a MINOR alarm;
slow ashing indicates a MAJOR alarm;
fast ashing indicates a CRITICAL alarm.
ENVLEDswitches on when there's an enviromental alarmsuch as smoke, intrusion, fire
or temperature.
LED - Localization
Queue
Corresponding modules/objects
MPCC MPCC, PWRD
TDPC TDPC, MEMT
PPXX PPLD, PPCC, PPCU, PPXL, PPXU
LINE PCMA, SS7L, TSLA
NTW SN16, UBEX, PLLH, SNAP
CLOCK SYNC, SYNE
OMC OMAL, X25A, X25D, CBCL
HWI IXLT, LICD, LICDS, EPWR
DISK DK40, DISK
BTS BTSM, BTS, TRX, CHAN
TRAU TRAU
Tab. 4.4 LED-Hardware Correspondence
142 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
Fig. 4.9 BSC Fuse and Alarm Panel, Part with Fuses
4.4 Lamp Panel
The lamp panel shown in Fig. 4.10 is mounted on the highest part of BSC rack; each
lamp is the ORof BSCalarms with the related severity regardless of the event type. This
means that the rack alarm lamp is switched on when the first failure with the related
severity is issued; each alarm lamp is switched off when the last failure event with
related severity is cleared.
Fig. 4.10 Lamp Panel
ALARM PANEL
1 A
F
EXPANSION MODULE
POWER 0 POWER 1
10 A
F
LAMP
TEST
BASE MODULE
COPY 0 COPY 1
10 A
F
LOCAL
TERMINAL
CRITICAL
ALARM
MAJOR
ALARM
MINOR
ALARM
A30808-X3247-L220-2-7620 143
Maintenance
MMN:BSC
4.5 DC-Panel of the BC120-HC (C38-X rack)
Fig. 4.11 and Fig. 4.12 show the complete layout of the alarm panel and DC-Panel for
the BC120 High Capacity.
The philosophy of the lamp panel is the same of the BSC standard (4.3).
Fig. 4.11 Alarm LEDs for BC120 HC
Fig. 4.12 DC-Panel for BC120 HC
SAI
PAI
MINOR
ALARM
S/W
RUN
NEW
OLD
EQUIPMENT STATUS
MPCC TDPC PPXX
LINE NTW CLOCK
TRAU STS DISK HWI OMC
COMMUNICATION
GLOBAL
ALARM
MIN
E
Q
P
C
O
M
Q
O
S
SYSTEM ALARM
CRT
MJR
LAMP
TEST
LOCAL
TERMINAL
BSC BASE BSC EXP FAN BOX ALARM
PANEL
144 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
4.6 Temperature Sensors
Two Temperature sensors are mounted on the top of the rack (see Fig. 4.6): each one
of them controls a copy of the Power Suppliers.
When the temperature increases, the temperature sensor contact closes and the rele-
vant supplier goes out of service (OFF).
If during normal operating status, the equipment internal temperature reaches the 72C
threshold, Copy 0 temperature sensor contacts close and the suppliers of the relevant
copy go out of service (OFF).
Copy 0 will restore (opening of TS contacts and suppliers returning in service (ON))
when the temperature returns to 63C threshold.
If the temperature keeps increasing and reaches a 78C threshold, Copy 1 temperature
sensor contacts close and the suppliers of the relevant copy go out of service (OFF).
At this point there is no power supply in the whole equipment and Copy 0 and Copy 1
will restore (operning of TS contacts and soppliers returning in service (ON)) when the
temperature returns to 63C threshold.
Each Temperature Sensor is tested singularly by means of a heating board adjusted to:
A tester can be used to verify whether the contact is open or closed.
Copy 0 TS 72C close Suppliers OFF
Copy 1 TS 78C close Suppliers OFF
72C for Copy 0 power suppliers
78C for Copy 1 power suppliers
63C the contact reopens
A30808-X3247-L220-2-7620 145
Maintenance
MMN:BSC
4.7 Power Supply
On the power panel three LEDs, a switch and two keys (red and black) are provided
(Fig. 4.13, pos. 1 and pos. 2).
Fig. 4.13 BSC Power Supply Module Panel
The LEDs indicate the following:
The IS green LED is on whenever the power supply is on and the provided voltage
is correct;
The OS AL red LED will switch on in the event of an "out of service" or anomaly in
the power supplied;
The ON green LED is on whenever the power supply is on.
The OFF REQ switch controls the on/off status of the regulated output voltages, and it
must be in the upper position in order to allow the system to work.
IS
OS
AL
ON
OFF
REQ
1
M1+12,3
M2 + 5,3
M3 PPW
ON
RED
BLACK
2
3
146 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
The buttons indicate the following (Fig. 4.13, pos 2):
The red button controls the magnetothermic switch, and must be pressed to interrupt
the primary power supply; to avoid undesiderable manual interruptions, the user
must use a pointed device to switch the red button.
The black button must be pressed to switch on the primary power.
Normal power (secondary power) control (emergency breaker in ON position (black
button pushed)):.
Primary and secondary power control:
To switch on the power supply:
1. Press the black button. The OS AL LED will switch on.
2. Set the OFF REQ key in the upper position. The IS and ON LEDs will switch on and
the OS AL LED will switch off.
To switch off the power supply:
1. Set the OFF REQ key in down position. The OS AL LED will switch on, and the IS
and ON LEDs will switch off:
2. Press the red switch. The OS AL LED will switch off.
Tab. 4.5 summarizes the anomaly conditions notified by the LED settings.
See Switch-off and Switch-on Procedures for powering OFF and ON.
To switch on the power supply:
1. Set the OFF REQ key in the upper position. The IS and ON LEDs will switch on
and OS AL LED will switch off.
To switch off the power supply:
1. Set the OFF REQ key in down position. The OS AL LED will switch on, and the IS
and the ON LEDs will switch off.
MEANING LEDS CONDITIONS
IS ALL/OS ON
Out of service (manual off request), or
Out range of the input battery, or
Output below the nominal voltage, or
Output over the nominal voltage
OFF ON OFF
Emergency break in off condition
(manual or automatic)
OFF OFF OFF
Output overload or short circuit OFF ON ON
Tab. 4.5 Anomaly Conditions identied by LEDs
A30808-X3247-L220-2-7620 147
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4.8 Jumpers setting
4.8.1 Module CPEX
Fig. 4.14 Jumpers Setting for Module CPEX
E1
148 A30808-X3247-L220-2-7620
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4.8.2 Module DK40
Fig. 4.15 Jumpers Setting for Module DK40
3
2
1
SEZ5
3
2
1
S
E
Z
0
S
E
Z
0
S
E
Z
0
S
E
Z
0
SEZ07
SEZ09
2 3 1 4
SEZ08
SEZ11
SEZ06
SEZ10
i
The configuration of jumpers SEZ01..SEZ04 is relevant to the RS232 interface. For the
V11 interface, these jumpers must be set in the position 2-3.
A30808-X3247-L220-2-7620 149
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Fig. 4.16 Jumpers Setting for Module DK40 V2 and V3
SZ04
TR1
TR6
1
2
3
TR4
1
2
3
SZ01
1
2
3
TR7
SZ03
1
2
3
TR5
3
2
1
SZ02
1
2
3
TR2 3
2
1
TR3
TR12
1
2
3
TR11
3
2
TR8
1
2
1
3
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4.8.3 Module IXLT
Fig. 4.17 Jumpers Setting for Module IXLT V3 and V4
TR22
TR20
TR3
1
2
3
TR8
TR18
TR28
1
2
3
TR19
TR26
3 2 1
TR24
1 2 3
TR25
1 2 3
TR1
TR21
TR4
TR5
TR7
TR6
TR27
1 2 3
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Fig. 4.18 Jumpers Setting for Module IXLT V6 and V7
TR18
TR19
TR28
3 2 1
TR4
TR22
3 2 1
TR7
1
2
3
TR6
1
2
3
TR9
1
2
3
TR8
1
2
3
TR23
TR16 TR15
3 2 1
TR5
TR3
3
2
1
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4.8.4 Module MEMT
Fig. 4.19 Jumpers Setting for Module MEMT
TR1 TR2
A30808-X3247-L220-2-7620 153
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4.8.5 Module MPCC
Fig. 4.20 Jumpers Setting for Module MPCC V7
TR16
TRWDT
3
2
1
TRBF2
TR1
TRMMX
TR_FW
TR_BIST
TR_FLASH
154 A30808-X3247-L220-2-7620
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Fig. 4.21 Front View of MPCC V7
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M
P
C
C
V
7
A
B
C
D
E
F
G
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Y
G
H
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A30808-X3247-L220-2-7620 155
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A Serial EPROM signals interface J11 connector.
B USB0 connector.
C Pentium emulator J5 connector.
D USB1 connector.
E RS232 link signals J10 connector.
F LEDs (1)
G JHOT_LINK High speed link interface control.(2)
H JHOT_COM High speed link auxiliary link control.(2)
I J_HTF Hard disk connector.(2)
i
(1) The Red LED is illuminated for the following reasons: the fuse of card is broken,
WDT alarm active or forced from the software by an ESCC2 control point.
The Yellow LED indicates the operation of the hard disk.
The Green LED is under the software control by a control point and is used to point out
the closing of the file system.
(2) The hot link connectors (G and H) and the hard-disk connector (I) of the MPCCV7
copy 0 must be connected with the same connectors of the MPCC V7 copy 1 with the
appropriate cables:
- (G) V7442-C32-R2
- (H) V7441-A33-R12
- (I) V7440-B37-R1
156 A30808-X3247-L220-2-7620
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Fig. 4.22 Jumpers Setting for Module MPCC V8
E1
E4
E5
E6
E5001
E5003
A30808-X3247-L220-2-7620 157
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Fig. 4.23 Front View of MPCC V8
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M
P
C
C
V
8
A
E
F
G
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F
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L
158 A30808-X3247-L220-2-7620
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For the cable connections refer BSCIS System Cabling chapter.
A Serial EPROM signals interface J11 connector (X5042).
E RS232 link signals J10 connector (X63).
F LEDs (1)
G JHOT_LINK High speed link interface control (X5048/X5049).(2)
H JHOT_COM High speed link auxiliary link control (X5041).(2)
I J_HTF Hard disk connector (X64).(2)
L Ethernet connector (X5047).
i
(1) The upper Red LED is illuminated for the following reasons: the fuse of card is
broken, WDT alarm active or forced from the software by an control point.
The lower Green LED is under the software control by a control point.
(2) The hot link connectors (G and H) and the hard-disk connector (I) of the MPCCV7
copy 0 must be connected with the same connectors of the MPCC V7 copy 1 with the
appropriate cables.
i
The MPCCV8 is mandatory for the high capacity features and BC120HC rack.
A30808-X3247-L220-2-7620 159
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4.8.6 Module PLLH
Fig. 4.24 Jumpers Setting for Module PLLH (75 Ohm)
SZ4
T118
1
2
3
3
V051
1
2
F098
SZ10
D012
1
2
3
SZ6
SZ15
K086
1
2
3
SZ3
SZ1
SZ2
SZ16
3 2 1
H038
3 2 1
SZ7
SZ05
SZ08 SZ11
1
Q009
3
2
1
R009
3
2
SZ13
SZ12
1
P009
3
2
3
M009
1
2
160 A30808-X3247-L220-2-7620
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Fig. 4.25 Jumpers Setting for Module PLLH (120 Ohm)
SZ4
T118
1
2
3
3
V051
1
2
F098
SZ10
D012
1
2
3
SZ6
SZ15
K086
1
2
3
SZ3
SZ1
SZ2
SZ16
3 2 1
H038
3 2 1
SZ7
SZ05
SZ08 SZ11
1
Q009
3
2
1
R009
3
2
SZ13
SZ12
1
P009
3
2
3
M009
1
2
i
The PLLH local tuning must be done after any replacement of the PLLH module. This
operation can be carried out only if a syncronization source signal fromthe MSCis avail-
able and the PLLH module has been powered for at least 12 hours.
A30808-X3247-L220-2-7620 161
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Fig. 4.26 Jumpers Setting for Module PLLH V2 (75 Ohm)
SZ4
T118
1
2
3
3
V051
1
2
SZ10
D012
1
2
3
SZ6
SZ15
K086
1
2
3
SZ3
SZ1
SZ2
SZ16
H038
3 2 1
SZ7
SZ05
SZ08 SZ11
1
Q009
3
2
1
R009
3
2
SZ13
SZ12
1
P009
3
2
3
M009
1
2
162 A30808-X3247-L220-2-7620
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Fig. 4.27 Jumpers Setting for Module PLLH V2 (120 Ohm)
SZ4
T118
1
2
3
3
V051
1
2
SZ10
D012
1
2
3
SZ6
SZ15
K086
1
2
3
SZ3
SZ1
SZ2
SZ16
H038
3 2 1
SZ7
SZ05
SZ08 SZ11
1
Q009
3
2
1
R009
3
2
SZ13
SZ12
1
P009
3
2
3
M009
1
2
i
The PLLH local tuning must be done after any replacement of PLLH module. This oper-
ation can be carried out only if a syncronization source signal fromthe MSC is available
and the PLLH module has been powered for at least 12 hours.
i
The PLLH V2 is mandatory for the USA. When used in the US, the Jumpers setting is
the one provided by default from the factory (120 Ohm).
A30808-X3247-L220-2-7620 163
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4.8.7 Module PPCC
Fig. 4.28 Jumpers Setting for Module PPCC V2
SZ3
TR1
1
2
3
3
TR3
1
2
SZ2
TR4
3
2
1
SZ05
SZ6
1
TR2
3
2
SZ1
i
Close to TR4, SZ4 could be found as in the PPLD module. However the presence or
absence of the correspondig jumper is not relevant.
164 A30808-X3247-L220-2-7620
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Fig. 4.29 Jumpers Setting for Module PPCC V3
SZ8
SZ4
SZ06
SZ5
3
TR2
1
2
SZ1
SZ7
SZ9
i
The presence or absence of SZ9 is issue dependent.
i
The PPCC V3 is mandatory for the USA.
A30808-X3247-L220-2-7620 165
Maintenance
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4.8.8 Module PPCU
Fig. 4.30 Jumpers Setting for Module PPCU
P14
3
2
1
P18
P16
P12 P13
P17
P15
P10
P9
166 A30808-X3247-L220-2-7620
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4.8.9 Module PPLD
Fig. 4.31 Jumpers Setting for Module PPLD V2
SZ3
TR1
1
2
3
3
TR3
1
2
SZ2
TR4
3
2
1
SZ05
SZ6
1
TR2
3
2
SZ1
Z4
A30808-X3247-L220-2-7620 167
Maintenance
MMN:BSC
Fig. 4.32 Jumper setting for module PPLD V3
i
The presence or absence of SZ9 is issue dependent.
i
The PPLD V3 is mandatory for the USA.
TR2
3
1
2
SZ4
SZ5
SZ1
SZ6
SZ8 SZ7
SZ9
168 A30808-X3247-L220-2-7620
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4.8.10 Module QTLP
Fig. 4.33 Jumpers Setting for Module QTLP (120 Ohm)
SZ35
SZ3
SZ4
SZ34
SZ1
SZ2
SZ36
SZ5
SZ6
SZ37
SZ8
SZ7
SZ52
SZ39
SZ11
SZ12
SZ38
SZ9
SZ10
SZ13
SZ14
SZ40
SZ41
SZ15
SZ16
SZ43
SZ19
SZ20
SZ42
SZ18
SZ17
SZ44
SZ21
SZ22
SZ23
SZ24
SZ45
SZ27
SZ28
SZ25
SZ46
SZ47
SZ26
SZ48
SZ29
SZ30
SZ49
SZ31
SZ32
SZ54
SZ53
SZ50
SZ33
SZ51
A30808-X3247-L220-2-7620 169
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Fig. 4.34 Jumpers Setting for Module QTLP (75 Ohm)
SZ35
SZ3
SZ4
SZ34
SZ1
SZ2
SZ36
SZ5
SZ6
SZ37
SZ8
SZ7
SZ52
SZ39
SZ11
SZ12
SZ38
SZ9
SZ10
SZ13
SZ14
SZ40
SZ41
SZ15
SZ16
SZ43
SZ19
SZ20
SZ42
SZ18
SZ17
SZ44
SZ21
SZ22
SZ23
SZ24
SZ45
SZ27
SZ28
SZ25
SZ46
SZ47
SZ26
SZ48
SZ29
SZ30
SZ49
SZ31
SZ32
SZ54
SZ53
SZ50
SZ33
SZ51
170 A30808-X3247-L220-2-7620
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Fig. 4.35 Jumpers Setting for Module QTLP V2 (75 Ohm)
SZ19
SZ20
SZ50
SZ2
SZ1
SZ4
SZ3
SZ6
SZ5
SZ8
SZ7
SZ10
SZ9
SZ13
SZ11
SZ15
SZ12
SZ14
SZ17
SZ18
SZ24
SZ22
SZ21
SZ23
SZ28
SZ26
SZ25
SZ27
SZ32
SZ31
SZ29
SZ30
SZ36
SZ34
SZ33
SZ35
SZ40
SZ39
SZ37
SZ38
SZ44
SZ42
SZ41
SZ43
SZ48
SZ47
SZ45
SZ46
3
2
1
TR4
3
2
1
TR5
3
2
1
TR6
3
2
1
TR7
3
2
1
TR8
3
2
1
TR9
3
2
1
TR10
3
2
1
TR11
3
2
1
TR1
SZ51
SZ16
A30808-X3247-L220-2-7620 171
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SZ19
SZ20
SZ50
SZ2
SZ1
SZ4
SZ3
SZ6
SZ5
SZ8
SZ7
SZ10
SZ9
SZ13
SZ11
SZ15
SZ12
SZ14
SZ17
SZ18
SZ24
SZ22
SZ21
SZ23
SZ28
SZ26
SZ25
SZ27
SZ32
SZ31
SZ29
SZ30
SZ36
SZ34
SZ33
SZ35
SZ40
SZ39
SZ37
SZ38
SZ44
SZ42
SZ41
SZ43
SZ48
SZ47
SZ45
SZ46
3
2
1
TR4
3
2
1
TR5
3
2
1
TR6
3
2
1
TR7
3
2
1
TR8
3
2
1
TR9
3
2
1
TR10
3
2
1
TR11
3
2
1
TR1
SZ51
SZ16
i
The QTLP V2 is mandatory for the USA.
172 A30808-X3247-L220-2-7620
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On the QTLP module front there are eight plugs to monitor the 2Mbit/s PCM lines (see
Fig. 4.38). Each line has a monitoring point on both the transmitting side and the
receiving side (see Tab. 4.6)
SZ19
SZ20
SZ50
SZ2
SZ1
SZ4
SZ3
SZ6
SZ5
SZ8
SZ7
SZ10
SZ9
SZ13
SZ11
SZ15
SZ12
SZ14
SZ17
SZ18
SZ24
SZ22
SZ21
SZ23
SZ28
SZ26
SZ25
SZ27
SZ32
SZ31
SZ29
SZ30
SZ36
SZ34
SZ33
SZ35
SZ40
SZ39
SZ37
SZ38
SZ44
SZ42
SZ41
SZ43
SZ48
SZ47
SZ45
SZ46
3
2
1
TR4
3
2
1
TR5
3
2
1
TR6
3
2
1
TR7
3
2
1
TR8
3
2
1
TR9
3
2
1
TR10
3
2
1
TR11
3
2
1
TR1
SZ51
SZ16
A30808-X3247-L220-2-7620 173
Maintenance
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Fig. 4.38 PCM Monitoring Points for QTLP and QTLP V2
Two LEDs (yellow and red) are equipped for each PCM line on the QTLP V2 module .
A single red LED represents the board status. The function of these LEDs is shown in
the following table:
Q
T
L
P
A
B
TX
RX
TX
RX
C
D
TX
RX
TX
RX
E
F
TX
RX
TX
RX
G
H
TX
RX
TX
RX
Q
T
L
P
A
B
TX
RX
TX
RX
C
D
TX
RX
TX
RX
E
F
TX
RX
TX
RX
G
H
TX
RX
TX
RX
V
2
LED Functions Yellow LED Red LED
LOS (loss of signal) off on
LFA or MFA (loss of frame/multiframe) off on
BER Upper Threshold Exceeded off on
AIS (alarm indication signal) blink blink
RAI (remote alarm indication) on off
faulty module single red LED on
A Line 0, Port A
B Line 0, Port B
C Line 1, Port A
Tab. 4.6 Description of QTLP and QTLP V2 Monitoring Points
174 A30808-X3247-L220-2-7620
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D Line 1, Port B
E Line 2, Port A
F Line 2, Port B
G Line 3, Port A
H Line 3, Port B
Tab. 4.6 Description of QTLP and QTLP V2 Monitoring Points
A30808-X3247-L220-2-7620 175
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4.8.11 Module SN16
Fig. 4.39 Jumpers Setting for Module SN16
TR2
TR4
TR1
TR3
176 A30808-X3247-L220-2-7620
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4.8.12 Module TDPC
Fig. 4.40 Jumpers Setting for Module TDPC V6
TR16
TRWDT
1
2
3
TRBF2
TR1
TRMMX
TR_FLASH
TR_FW
TR_BIST
A30808-X3247-L220-2-7620 177
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Fig. 4.41 Front View of TDPC V6
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T
D
P
C
V
6
A
B
C
D
E
F
G
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H
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178 A30808-X3247-L220-2-7620
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A Serial EEPROM signals interface J11 connector.
B USB0 connector.
C Pentium emulator J5 connector.
D USB1 connector.
E RS232 link signals J10 connector.
F LED (1)
G JHOT_LINK High speed link interface control.(2)
H JHOT_COM High speed link auxiliary link control.(2)
i
(1) A major hardware alarm is sent from the TDPC toward the MPCC by the MEMT
every time deteced a processor fault is detected (NMI interrupt not cleared) or when at
the start-up the self test process of the card fails.
(2) The hot link connectors of the TDPCV6 copy 0 must be connected with the same
connectors of the TDPC V6 copy 1 with the appropriate cables:
- (G) V7442-C32-R1
- (H) V7441-A33-R13
A30808-X3247-L220-2-7620 179
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Fig. 4.42 Jumpers Setting for Module TDPC V7
E4
E5
E1
E6
E5001
E5003
E5002
180 A30808-X3247-L220-2-7620
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Fig. 4.43 Front View of TDPC V7
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:
T
C
V
8
A
E
G
:

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H
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.
F
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.
L
D
P
:

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:

:

:
A30808-X3247-L220-2-7620 181
Maintenance
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For the cable connections between TDPC and MPCC boards refer BSCIS System
Cabling chapter.
A Serial EEPROM signals interface J11 connector (X52).
E RS232 link signals J10 connector (X53).
F LED (1)
G JHOT_LINK High speed link interface control (X5045/X5046).(2)
H JHOT_COM High speed link auxiliary link control (H5040).(2)
L Ethernet connector (X5047)
i
(1) A major hardware alarm is sent from the TDPC toward the MPCC by the MEMT
every time deteced a processor fault is detected (NMI interrupt not cleared) or when at
the start-up the self test process of the card fails.
(2) The hot link connectors of the TDPC copy 0 must be connected with the same
connectors of the TDPC copy 1 with the appropriate cables.
i
The TDPCV7 is mandatory for the high capacity features and BC120HC rack.
182 A30808-X3247-L220-2-7620
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4.8.13 Module UBEX
Fig. 4.44 Jumpers Setting for Module UBEX
TR1
A30808-X3247-L220-2-7620 183
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4.8.14 Module SNAP (for BSC High capacity)
Fig. 4.45 Jumpers Setting for Module SNAP V1
TR2
184 A30808-X3247-L220-2-7620
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4.8.15 Module PPXX (for BSC High capacity)
Fig. 4.46 Jumpers Setting for Module PPXX (fed by EPWR power supply card)
P34
P35
JJ3
JJ2
P
1
3
P P
3 5
0
P
4
1
P
4
0
P
4
2
P
1
4
P
4
P
3
8
P36
P37
P39
A30808-X3247-L220-2-7620 185
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Fig. 4.47 Jumpers Setting for Module PPXX (fed by internal power supply module)
P34
P35
JJ3
JJ2
P
1
3
P P
3 5
0
P
4
1
P
4
0
P
4
2
P
1
4
P
4
P
3
8
P36
P37
P39
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4.8.16 Module STLP (for BSC High capacity)
Fig. 4.48 Jumpers Setting for Module STLP (120 ohm jumpers setting)
SZ6
SZ5
SZ8
SZ7
SZ10
SZ9
SZ11
SZ12
SZ18
SZ17
SZ20
SZ19
SZ22
SZ21
SZ24
SZ23
SZ30
SZ29
SZ32
SZ31
SZ34
SZ33
SZ36
SZ35
SZ60
SZ4
TR12
TR7
TR8
SZ13
TR21
TR13
TR14
SZ16
TR24
TR19
TR20
SZ25
TR33
TR25
TR26
SZ27
TR35
TR29
TR30
SZ1
TR9
TR1
TR2 SZ2
TR10
TR3
TR4
SZ3
TR11
TR5
TR6
SZ14
TR22
TR15
TR16
SZ15
TR23
TR17
TR18
SZ26
TR34
TR27
TR28
SZ28
TR36
TR31
TR32
SZ41
SZ45
SZ40
SZ52 SZ51
SZ50
SZ44
SZ37
SZ38
SZ39
3
1
2
A30808-X3247-L220-2-7620 187
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MMN:BSC
SZ6
SZ5
SZ8
SZ7
SZ10
SZ9
SZ11
SZ12
SZ18
SZ17
SZ20
SZ19
SZ22
SZ21
SZ24
SZ23
SZ30
SZ29
SZ32
SZ31
SZ34
SZ33
SZ36
SZ35
SZ60
SZ13
TR21
TR13
TR14
SZ16
TR24
TR19
TR20
SZ25
TR33
TR25
TR26
SZ27
TR35
TR29
TR30
SZ1
TR9
TR1
TR2 SZ2
TR10
TR3
TR4
SZ14
TR22
TR15
TR16
SZ15
TR23
TR17
TR18
SZ26
TR34
TR27
TR28
SZ28
TR36
TR31
TR32
SZ41
SZ45
SZ40
SZ52 SZ51
SZ50
SZ44
SZ37
SZ38
SZ39
3
1
2
SZ4
TR12
TR7
TR8 SZ3
TR11
TR5
TR6
188 A30808-X3247-L220-2-7620
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SZ6
SZ5
SZ8
SZ7
SZ10
SZ9
SZ11
SZ12
SZ18
SZ17
SZ20
SZ19
SZ22
SZ21
SZ24
SZ23
SZ30
SZ29
SZ32
SZ31
SZ34
SZ33
SZ36
SZ35
SZ60
SZ13
TR21
TR13
TR14
SZ16
TR24
TR19
TR20
SZ25
TR33
TR25
TR26
SZ27
TR35
TR29
TR30
SZ1
TR9
TR1
TR2 SZ2
TR10
TR3
TR4
SZ14
TR22
TR15
TR16
SZ15
TR23
TR17
TR18
SZ26
TR34
TR27
TR28
SZ28
TR36
TR31
TR32
SZ41
SZ45
SZ40
SZ52 SZ51
SZ50
SZ44
SZ37
SZ38
SZ39
3
1
2
SZ4
TR12
TR7
TR8 SZ3
TR11
TR5
TR6
A30808-X3247-L220-2-7620 189
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SZ6
SZ5
SZ8
SZ7
SZ10
SZ9
SZ11
SZ12
SZ18
SZ17
SZ20
SZ19
SZ22
SZ21
SZ24
SZ23
SZ30
SZ29
SZ32
SZ31
SZ34
SZ33
SZ36
SZ35
SZ60
SZ13
TR21
TR13
TR14
SZ16
TR24
TR19
TR20
SZ25
TR33
TR25
TR26
SZ27
TR35
TR29
TR30
SZ1
TR9
TR1
TR2 SZ2
TR10
TR3
TR4
SZ14
TR22
TR15
TR16
SZ15
TR23
TR17
TR18
SZ26
TR34
TR27
TR28
SZ28
TR36
TR31
TR32
SZ41
SZ45
SZ40
SZ52 SZ51
SZ50
SZ44
SZ37
SZ38
SZ39
3
1
2
SZ4
TR12
TR7
TR8 SZ3
TR11
TR5
TR6
190 A30808-X3247-L220-2-7620
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75 Ohm 100 Ohm 110 Ohm 120 Ohm
SZ1 OPEN
TR9 1:2
SZ6 CLOSE
TR1 1:2
TR2 1:2
SZ5 CLOSE
SZ1 OPEN
TR9 2:3
SZ6 OPEN
TR1 2:3
TR2 2:3
SZ5 OPEN
SZ1 CLOSED
TR9 OPEN
SZ6 OPEN
TR1 2:3
TR2 2:3
SZ5 OPEN
SZ1 OPEN
TR9 OPEN
SZ6 OPEN
TR1 1:2
TR2 1:2
SZ5 OPEN
SZ2 OPEN
TR10 1:2
SZ8 CLOSE
TR3 1:2
TR4 1:2
SZ7 CLOSE
SZ2 OPEN
TR10 2:3
SZ8 OPEN
TR3 2:3
TR4 2:3
SZ7 OPEN
SZ2 CLOSED
TR10 OPEN
SZ8 OPEN
TR3 2:3
TR4 2:3
SZ7 OPEN
SZ2 OPEN
TR10 OPEN
SZ8 OPEN
TR3 1:2
TR4 1:2
SZ7 OPEN
SZ3 OPEN
TR11 1:2
SZ10 CLOSE
TR5 1:2
TR6 1:2
SZ9 CLOSE
SZ3 OPEN
TR11 2:3
SZ10 OPEN
TR5 2:3
TR6 2:3
SZ9 OPEN
SZ3 CLOSED
TR11 OPEN
SZ10 OPEN
TR5 2:3
TR6 2:3
SZ9 OPEN
SZ3 OPEN
TR11 OPEN
SZ10 OPEN
TR5 1:2
TR6 1:2
SZ9 OPEN
SZ4 OPEN
TR12 1:2
SZ12 CLOSE
TR7 1:2
TR8 1:2
SZ11 CLOSE
SZ4 OPEN
TR12 2:3
SZ12 OPEN
TR7 2:3
TR8 2:3
SZ11 OPEN
SZ4 CLOSED
TR12 OPEN
SZ12 OPEN
TR7 2:3
TR8 2:3
SZ11 OPEN
SZ4 OPEN
TR12 OPEN
SZ12 OPEN
TR7 1:2
TR8 1:2
SZ11 OPEN
SZ13 OPEN
TR21 1:2
SZ18 CLOSE
TR13 1:2
TR14 1:2
SZ17 CLOSE
SZ13 OPEN
TR21 2:3
SZ18 OPEN
TR13 2:3
TR14 2:3
SZ17 OPEN
SZ13 CLOSED
TR21 OPEN
SZ18 OPEN
TR13 2:3
TR14 2:3
SZ17 OPEN
SZ13 OPEN
TR21 OPEN
SZ18 OPEN
TR13 1:2
TR141:2
SZ17 OPEN
SZ14 OPEN
TR22 1:2
SZ20 CLOSE
TR15 1:2
TR16 1:2
SZ19 CLOSE
SZ14 OPEN
TR22 2:3
SZ20 OPEN
TR15 2:3
TR16 2:3
SZ19 OPEN
SZ14 CLOSED
TR22 OPEN
SZ20 OPEN
TR15 2:3
TR16 2:3
SZ19 OPEN
SZ14 OPEN
TR22 OPEN
SZ20 OPEN
TR15 1:2
TR16 1:2
SZ19 OPEN
SZ15 OPEN
TR23 1:2
SZ22 CLOSE
TR17 1:2
TR18 1:2
SZ21 CLOSE
SZ15 OPEN
TR23 2:3
SZ22 OPEN
TR17 2:3
TR18 2:3
SZ21 OPEN
SZ15 CLOSED
TR23 OPEN
SZ22 OPEN
TR17 2:3
TR18 2:3
SZ21 OPEN
SZ15 OPEN
TR23 OPEN
SZ22 OPEN
TR17 1:2
TR18 1:2
SZ21 OPEN
Tab. 4.7 STLP Jumpers
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On the front of the STLP card there are twelve plugs to monitor the 2Mbit/s PCM lines
(see Fig. 4.52). Each line has a monitoring point on both the transmitting side and the
receiving side (see Tab. 4.8)
SZ16 OPEN
TR24 1:2
SZ24 CLOSE
TR19 1:2
TR20 1:2
SZ23 CLOSE
SZ16 OPEN
TR24 2:3
SZ24 OPEN
TR19 2:3
TR20 2:3
SZ23 OPEN
SZ16CLOSED
TR24 OPEN
SZ24 OPEN
TR19 2:3
TR20 2:3
SZ23 OPEN
SZ16 OPEN
TR24 OPEN
SZ24 OPEN
TR19 1:2
TR20 1:2
SZ23 OPEN
SZ25 OPEN
TR33 1:2
SZ30 CLOSE
TR25 1:2
TR26 1:2
SZ29 CLOSE
SZ25 OPEN
TR33 2:3
SZ30 OPEN
TR25 2:3
TR26 2:3
SZ29 OPEN
SZ25 CLOSED
TR33 OPEN
SZ30 OPEN
TR25 2:3
TR26 2:3
SZ29 OPEN
SZ25 OPEN
TR33 OPEN
SZ30 OPEN
TR25 1:2
TR26 1:2
SZ29 OPEN
SZ26 OPEN
TR34 1:2
SZ32 CLOSE
TR27 1:2
TR28 1:2
SZ31 CLOSE
SZ26 OPEN
TR34 2:3
SZ32 OPEN
TR27 2:3
TR28 2:3
SZ31 OPEN
SZ26 CLOSED
TR34 OPEN
SZ32 OPEN
TR27 2:3
TR28 2:3
SZ31 OPEN
SZ26 OPEN
TR34 OPEN
SZ32 OPEN
TR27 1:2
TR28 1:2
SZ31 OPEN
SZ27 OPEN
TR35 1:2
SZ34 CLOSE
TR29 1:2
TR30 1:2
SZ33 CLOSE
SZ27 OPEN
TR35 2:3
SZ34 OPEN
TR29 2:3
TR30 2:3
SZ33 OPEN
SZ27 CLOSED
TR35 OPEN
SZ34 OPEN
TR29 2:3
TR30 2:3
SZ33 OPEN
SZ27 OPEN
TR35 OPEN
SZ34 OPEN
TR29 1:2
TR30 1:2
SZ33 OPEN
SZ28 OPEN
TR36 1:2
SZ36 CLOSE
TR31 1:2
TR32 1:2
SZ35 CLOSE
SZ28 OPEN
TR36 2:3
SZ36 OPEN
TR31 2:3
TR32 2:3
SZ35 OPEN
SZ28 CLOSED
TR36 OPEN
SZ36 OPEN
TR31 2:3
TR32 2:3
SZ35 OPEN
SZ28 OPEN
TR36 OPEN
SZ36 OPEN
TR31 1:2
TR32 1:2
SZ35 OPEN
SZ37 CLOSE
SZ38 CLOSE
SZ39 CLOSE
SZ40 OPEN
SZ41 CLOSE
SZ45 OPEN
SZ60 OPEN
SZ51 OPEN
SZ52 OPEN
SZ44 OPEN
SZ50 OPEN
75 Ohm 100 Ohm 110 Ohm 120 Ohm
Tab. 4.7 STLP Jumpers
192 A30808-X3247-L220-2-7620
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Fig. 4.52 PCM Monitoring Points for STLP module.
Two LEDs are equipped on the STLP module: the red LED on represents the reset
status and the green LED blinks in normal operation condition.
A PCM LINE 0 Line 0, Port A
B PCM LINE 1 Line 0, Port B
C PCM LINE 2 Line 1, Port A
D PCM LINE 3 Line 1, Port B
E PCM LINE 4 Line 2, Port A
F PCM LINE 5 Line 2, Port B
G PCM LINE 6 Line 3, Port A
Tab. 4.8 Description of STLP Monitoring Points
A
B
TX
RX
TX
RX
C
D
TX
RX
TX
RX
E
F
TX
RX
TX
RX
G
H
TX
RX
TX
RX
TX
RX
TX
RX
TX
RX
TX
RX
I
L
M
N
S
T
L
P
A30808-X3247-L220-2-7620 193
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H PCM LINE 7 Line 3, Port B
I PCM LINE 8 Line 4, Port A
L PCM LINE 9 Line 4, Port B
M PCM LINE 10 Line 5, Port A
N PCM LINE 11 Line 5, Port B
Tab. 4.8 Description of STLP Monitoring Points
194 A30808-X3247-L220-2-7620
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5 Appendix
5.1 Alarm Handling
An alarm notifies the Operation and Maintenance Center (OMC) of fault conditions.
Alarms can occur at any point in the BSC subsystem provided with a hardware (hard-
ware) or software (SW) detector to recognize the fault, and with an event-generating
software.
Following the general alarm philosophy, alarm reports specify:
the fault severity level;
the anomaly type.
Fault Severity Levels
The BSC subsystem provides five different severity levels:
Critical;
Major;
Minor;
Warning;
Cleared.
The Critical level is reached when the subsystem is out of order.
The Major level specifies the presence in the subsystem of a fault that makes the
subsystemitself drop significantly. The immediate intervention of an operator is required
to clear the fault and resume the service.
The Minor level specifies that the fault in the subsystem does not lower its functionality
(for instance, the backup unit is not working). In other words, a section of the subsystem
is lowered, but it is still able to work without effects on the service. Operator intervention
is required, but it is not urgent, either because the quality of the service is still acceptable
or because an automatic reconfiguration has been made.
The Warning level specifies the presence within the subsystemof an error that does not
cause traffic or hardware failure.
The Cleared level specifies that a previous error condition is now cleared.
Anomaly Types
Five types of anomalies are defined, depending on the functional part of the subsystem
that is actually damaged:
Quality of Service
Communication
Equipment
Processing
Environment
A Quality of Service alarm refers to a service downgrading. Such an alarm is gener-
ated, for instance, from the level 3 radio when the quality of the service provided to the
mobile user drops to the attention threshold.
196 A30808-X3247-L220-2-7620
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Communication alarms refer to the procedures/processes that are devoted to the
communication exchange between subsystem elements. Generally speaking, the
following failures are taken into account:
system link (SS7, LAPD, X.25) faults;
faults of the connection network that do not originate from the hardware;
level 3 radio anomalies.
Equipment alarms refer to hardware failures. Alarms of this kind are notified and anal-
ized by the maintenance procedures in order to clear them by means of the provided
redundancy. In this case, the alarmdisplay reports the generating function together with
the related severity.
With each of these types of anomolies, software tails (SystemTails) are associated that
contain a brief outline description of various error messages relating to the error
concerned.
Processing alarms refer to software faults; they could be just warning messages when
they do not cause failure, otherwise they can generate a reload of the software on the
board.
Environment alarms are associated with environmental events such as fire, water and
so on.
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5.2 Alarm Reporting
Every systemof the PLMN network reports any malfunction occurring in its operation to
a local operator and to a remote control center (OMC) . These malfunctions include a
large variety of types, from hardware faults to recurrent software errors and from air
condition faults to back-up battery faults.
The BSC system is a network element of the PLMN and can be remotely controlled via
the OMC, therefore the Alarm Reporting activity, by means of which the BSC keeps
OMC informed on its own malfunction-related events, plays a key role. In the BSC, the
Alarm Reporting function has been developed taking into account the specific peculiar-
ities of this equipment.
The SBS BSC Alarm Reporting feature handles two different event types: fault detec-
tion and fault ceased detection.
The fault detector detects a fault and sends:
1. The related alarm message to alarm reporting.
This task extracts information from the centralized data base, sends the "Output
Message" to OMT/LMT and, if needed, sends a message to the status handler to
request a state change of the object generating the alarm and an alarm panel
update.
2. The related alarm ceased message to alarm reporting.
As in the previous case, this block forwards the message to OMC/LMT, activates the
status handler if needed and deletes the ceased alarm from the internal queue.
The State used on the SBS-BSCsystemis derived fromthe one proposed by GSMstan-
dards. The model used includes three fields as follow:
ADMINISTRATIVE STATE: is the only state that the operator can alter by using
maintenance commands.
LOCKED: the object is not allowed to perform its functions without
the intervention of the operator.
UNLOCKED: the object can freely perform all of its functions.
SHUTTING_DOWN: the object is graduaully changing its administrative state
from UNLOCKED to LOCKED.
OPERATIONAL STATE: is used to indicate whether an object is able to work or
not. It specifies the object's operability.
ENABLED: the object is in service. It may be used or not, depending
on system needs.
DISABLED: the object is out of service. It cannot be used to perform
its operations.
USAGE STATE: is used to describe the objects current use. It may be
split into the following three groups of logically indepen-
dent values.
IDLE: In this state, the object is not currently in use.
BUSY: In this state, the object is completely used.
ACTIVE: In this state,the object is partially used.
198 A30808-X3247-L220-2-7620
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The BSC systemis logically structured as a tree (see Fig. 5.2 and Fig. 5.1). The nodes
indicate the objects (logical and physical) in which the system itself is sub-divided. The
structure in particular indicates the functional and operational dependency of several
objects (sub-ordinate objects) from others (for example, with reference to Fig. 5.2 and
Fig. 5.1, the TDPC telephone processor depends on the MEMT module on which it is
installed and the PWRD object which represents the power supply of the system).
The autodiagnostic procedures of the BSC system are able to identify the defective
module and the possible malfunctioning objects. The same procedures can place the
objects into the operational DISABLE state. As a consequence of this action, the sub-
ordinate objects are also placed in the DISABLE state. This allows for the illumination of
the appropriate LED on the alarmpanel. The operator must pay attention to this, and by
means of the procedure shown in the following chapter, look at the MEG tree in order to
identify the source of the error.
BSC's MAINTENANCE ENTITY GRAPH (MEG) is shown in Fig. 5.2. and Fig. 5.1.
Performing a service removal command (LOCK or DISABLE) the Status Manager first
removes from service leaf objects, then level by level all the superordinates. The
command ends when, at least, the target object is put out of service.
The command STATE CHANGED EVENT REPORT is sent only if the object's state is
really changed.
Exceptions to this rule are due to the dynamic management of most 1+1 redundant
objects (MPCC, MEMT, TDPC, IXLT, NTW, CPEX, EPWR), n+1 redundant objects
(LICD) and n+m redundant objects (PPLD)
1+1 redundant objects subordinates are DISABLED for DEPENDENCY only in the
event of the superordinate outage.
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Fig. 5.1 The BSC Maintenance Entity Graph (MEG tree) for BSC Standard Capacity
When an LICD is put out of service the PCM lines created on the above circuits are
DISABLED only if the associated spare module (LICDS-0 for LICD-0 and LICD-1,
LICDS-1 for the others LICD) is out of service or is already providing service.
The Fig. 5.2 shown the MEG for BSC high capacity.
PWRD
MPCC MEMT DK40 IXLT NTW
PPCC
TDPC
PPLD
DISK
EPWR
LICDS
PCMB
LPDLR
LPDLM LPDLS
TRAU BTSM
PCMA BTS SYNC
TSLA
TRX
CHAN
LICD
OMAL
ONLY IF IN EXTENDED RACK
SS7L
X25D X25A
CBCL
NUC
PPCU
PCMG
PCMS
PTPPKF
FRL
NSVC
PCU
ONLY IF TCH or TCHSD
SS7S
BSC
CTRCO
CTRSCHED
ENVA TRACE
BSCESUSW
GPRS
TRX
BSCESUDB NEYESUSW RSUSWLH
SYNE
RSUEXE
RSUPCH RSUDB REMIN
SCA
SCAN_BSC SCAN_BTS SCAN_BTSLHDO SCAN_BTSOHDOINT SCAN_BTSOHDONGH SCAN_SS7L SCAN_BTSM
CHAN
200 A30808-X3247-L220-2-7620
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Fig. 5.2 The BSC Maintenance Entity Graph (MEG tree) for BSC High Capacity (C20 rack)
A30808-X3247-L220-2-7620 201
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Fig. 5.3 The BSC Maintenance Entity Graph (MEG tree) for BSC_120HC (C36/C40-X rack)
202 A30808-X3247-L220-2-7620
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5.3 Failure Event Message
This type of message is sent to the I/O device (OMT and/or LMT), if any exist, when an
error occurs. The message is formatted taking information, partly from the message
received from the error collector and partly from the protected database of the Error
Task. More specifically, the failure event message to be sent to the I/O module (in other
words to the OMT and/or to the LMT) will include the following information:
Date/Time
NAME
Event Type
Event Time
Probable Cause
Specific Problems
Severity
Trend Indication
Notification Identifier
Correlated Notification
Identifier
Related MO
Proposed Repair Actions
Additional Text
Originator
Additional Words
Software Version
Here is a description of the above information.
NAME: <object mnemonic+object address>
This field identifies the object. Note that the mnemonic is
followed by a structured numbering (address) that univocally
identifies an object in the BSC.
- Event Type: this parameter categorizes the alarm. Five basic categories of
alarm are specified:
Communication Failure Event (COM LED): a failure event of this type
concerns the procedure and/or processes that are used to transport informa-
tion from one point to another. In principle, the following communication
failure event is communicated: malfunctions related to all links of the BSC
system (SS7, LAPD and X.25); problems resulting in blocking the switching
network (not due to hardware causes); and malfunctions resulting in blocking
of at least one level 3 radio function. These malfunctions are generated by
the protocols of their respective links whenever they detect a problem, by the
level 3 radio function and/or by the function controlling the network connec-
tions whenever a block is detected in call establishment.
According to this definition, for example, the objects of the protocol links and
the level 3 radio manager object are objects generating this failure event.
A30808-X3247-L220-2-7620 203
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Quality of Service Events (QOS LED): a failure event of this type concerns
the degradation of the quality of service in the BSC. Such a failure event will
be generated by level 3 radio whenever the quality of service offered to the
mobile user drops below the preset warning threshold. It is not easy to iden-
tify the objects that could generate such a failure event, because they don't
make reference to any specific physical object.
For example, the process that manages level 3 radio could be regarded as
the object that can generate this type of event. Together with the event, the
status of the function that experienced the abormal situation could also be
specified.
Equipment Failure Events (EQP LED): an event of this type is associated
with hardware faults and is the most traditional form. It appears in the formof
hardware malfunctions that are reported and analyzed by the maintenance
procedures in order to take the necessary remedies based on the redundan-
cies which the BSC system is equipped with. As far as the local display is
concerned, for these failure events information on their severity are given as
well as information enabling the location of the faulty unit that generated
them.
For example, there is a lamp to indicate a network unit (the NTW LED) and
another one to indicate an LICD line module unit (the LINE LED), and
another to indicate the processing units. All of these failures are equipment
failure events and, for every unit, the object shall select the related lamp.
Processing Failure Event: this category of failure events includes all soft-
ware-type errors. These errors are due to programming errors. These failure
events and the information reported by them are necessary to remove the
error.
Environmental Failure Events (ENV LED): this type of failure event is
associated with environmental problems on the site where the BSC is
located. The BSC has the capabilty of detecting these causes via a number
of sense points connected to environmental sensors.
Event Time: This attribute identifies the time of detection of the fault.
Probable
Cause:
This parameter defines further qualifications as to the probable
cause of the alarm.
Specific
Problem:
This Failure Event attribute provides further refinement to the
Probable Cause attribute.
Severity: this parameter defines five severity levels. The five levels, from
the least to most severe, are:
Cleared: this severity level indicates the clearing of one or more previously
reported alarms. This alarm clears all alarms for this managed object that
have the same Alarm Type and Probable Cause. It is reported as an "Error
Ceased Message".
Warning: this level indicates that the object has reported a potential or
pending "error" that has not yet affected the functionality of the BSC. It is just
a prompt to take the necessary actions to diagnose and correct the problem
as soon as possible before it becomes more severe. For a failure event of
such a low severity, an end-of-alarm event might be unnecessary; in any
case, neither the status nor the instance having generated it are retained (it
could not be polled by OMC), nor will it be displayed by any visual indicator
(i.e., LEDs).
204 A30808-X3247-L220-2-7620
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Quality of Service Events (QOS LED): a failure event of this type concerns
the degradation of the quality of service in the BSC. Such a failure event will
be generated by level 3 radio whenever the quality of service offered to the
mobile user drops below the preset warning threshold. It is not easy to iden-
tify the objects that could generate such a failure event, because they don't
make reference to any specific physical object.
For example, the process that manages level 3 radio could be regarded as
the object that can generate this type of event. Together with the event, the
status of the function that experienced the abormal situation could also be
specified.
Equipment Failure Events (EQP LED): an event of this type is associated
with hardware faults and is the most traditional form. It appears in the formof
hardware malfunctions that are reported and analyzed by the maintenance
procedures in order to take the necessary remedies based on the redundan-
cies which the BSC system is equipped with. As far as the local display is
concerned, for these failure events information on their severity are given as
well as information enabling the location of the faulty unit that generated
them.
For example, there is a lamp to indicate a network unit (the NTW LED) and
another one to indicate an LICD line module unit (the LINE LED), and
another to indicate the processing units. All of these failures are equipment
failure events and, for every unit, the object shall select the related lamp.
Processing Failure Event: this category of failure events includes all soft-
ware-type errors. These errors are due to programming errors. These failure
events and the information reported by them are necessary to remove the
error.
Environmental Failure Events (ENV LED): this type of failure event is
associated with environmental problems on the site where the BSC is
located. The BSC has the capabilty of detecting these causes via a number
of sense points connected to environmental sensors.
Event Time: This attribute identifies the time of detection of the fault.
Probable
Cause:
This parameter defines further qualifications as to the probable
cause of the alarm.
Specific
Problem:
This Failure Event attribute provides further refinement to the
Probable Cause attribute.
Severity: this parameter defines five severity levels. The five levels, from
the least to most severe, are:
Cleared: this severity level indicates the clearing of one or more previously
reported alarms. This alarm clears all alarms for this managed object that
have the same Alarm Type and Probable Cause. It is reported as an "Error
Ceased Message".
Warning: this level indicates that the object has reported a potential or
pending "error" that has not yet affected the functionality of the BSC. It is just
a prompt to take the necessary actions to diagnose and correct the problem
as soon as possible before it becomes more severe. For a failure event of
such a low severity, an end-of-alarm event might be unnecessary; in any
case, neither the status nor the instance having generated it are retained (it
could not be polled by OMC), nor will it be displayed by any visual indicator
(i.e., LEDs).
A30808-X3247-L220-2-7620 205
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Minor: this level indicates that the object has reported an error that does not
degrade functionality (for example, its backup has been switched into
service) or, better, indicates that a functional part of the BSC is degraded,
but is still in a position to perform its functions without significantly affecting
the service.
Major: this level indicates that the object has reported such an error as to
render it severly degraded or, better, indicates that a functional part of the
BSC system is severly degraded.
Critical: this level indicates that the object reported such an error as to put it
totally out of service or, better, indicates that a functional part of the BSC is
completely unavailable.
- Trend Indica-
tion:
this parameter indicates how the degradation of the features of
a component part of the system is evolving, following the
malfunction just reported. Its value can be the followings:
the Not Applicable trend indication is printed if the associated
severity for the object in question is INDETERMINATE or
WARNING.
the NoChange trend indication is printed if the associated
severity for the object in question isnt changed from the
severity of those associated to previously reported Failure
Event relevant the same object and still active (i.e. no related
error ceased message was generated).
the LessSevere trend indication is printed if the associated
severity for the object in question is less severe of the severity
of those associated to previously reported Failure Events rele-
vant the same object and still active (i.e. no related error ceased
message was generated).
the LessSevere-noChange trend indication is printed if the
associated severity for the object in question is less severe or of
equal severity of those associated to previously reported Failure
Events relevant the same object and still active (i.e. no related
error ceased message was generated).
the MoreSevere trend indication is printed if the associated
severity for the object in question is more severe of those asso-
ciated to previously reported Failure Events relevant the same
object and still active (i.e. no related error ceased message was
generated).
- Notification
Identifier:
this attribute identifies unambiguously the Failure Event.
Correlated
Notification:
this attribute identifies the notification to which this Failure Event
is considered to be correlated. Since the failure Event Reports
are father event for the Notification Identifier correlations, the
Correlated Notification information are shown only for the
Failure Enet Report output during an AlarmAlignment (OMC) or
a Get Pending Alarm Command (LMT)
Proposed
Repair
Actions:
this attribute identifies the repair action suggested to the oper-
ator for the fault resolution.
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Additional
Text:
For the alarms generated by the ENVA objects, the operator
shall be able to define his own alarm text and also to define
the severity associated to each ENVA objects instance
indipendent from the alarm text. The Additional Text string
defined by the operator represents a description of the environ-
mental event. This field is always present in a Failure Event
Report, but is meaningful only for the ENVIRONMENTAL
Failure Events: in all other type of failure events is output as
Null String.
Originator: It is an integer number that identifies the software module origi-
nating the Failure Event.
- Additional
Words:
aaaa-oooo are hex values that are helpful for a detailed descrip-
tion of the error. This part is of particular usefulness for the soft-
ware designer to analyse the error cause and so take proper
actions to solve the problem.
- Software
Version:
Its the BSC software version files (if we are on BSC Local
Terminal).
The following is a real example of error message:
ALARM REPORTING --> SYSTEM BROADCAST
16:00:03 17/02/2000
21:34:24 17/02/2000
*** INFORMATION ***
FAILURE EVENT REPORT:
NAME=DISK:1
Event Type = Equipment Failure Event
Event Time = 17/02/2000 16:00:03
Probable Cause: Disk Problem
Specific Problems = 181-DISK not Aligned
Severity: Major
Trend Indication: More Severe
Notification Identifier = 05
Proposed Repair Actions = 1 NoAction
Additional Text = Null String
Originator: 4305
Additional Words =
H003c H0335 H0000 H0000 H0000
H0000 H0000 H0000 H0000 H0000
H0000 H0000 H0000 H0000 H0000
Additional Info:
Software Version: 02-06-01-01-00-00_10-05-00
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5.4 General diagnostic structure
When the operator enters an asyncronous test command from Local Maintenance
Terminal or O&M Center, or the system itself automatically diagnoses a device, two
activities are performed: a "status consistency check" and a "phase controller activa-
tion". The former involves the initial conditions control, while the latter is involved in
monitoring the execution of the diagnosis sections called "phases".
A diagnostic is subdivided into phases: the single phase is a test on hardware section
functionality. It can be executed individually and can provide an indication of what the
problem is as precisely as possible.
The result of the phase considers both the particular hardware components inspected
by the phase and the general interface of the diagnostic tests.
Some phases will be always present and common to all diagnostics:
The other hardware diagnostic phases are referred to as "working phases". They are
containers for the group of test routines forcing the single function, the single alarmor a
particular internal hardware interface.
The soft termination, contrary to the abort termination, has an operator origin, and can
have two managements: if the diagnosis is still waiting for activation, an immediate
cancellation of the asynchronous test request is enough, while if the diagnosis is already
active, the current working phase is completed and the end phase is executed.
The target units considered as maintenance objects on BSCfor a generic diagnostic test
are as follows:
PWRS (power supplies)
MPCC (microprocessor control complex)
TDPC (telephonic and distributor processor circuit)
MEMT (memory of TDPC and DUAL PORT Memory between MPCC and TDPC)
NTW (cross connection network, composed of three elements: PLLH, SN and
UBEX)
PPLD (peripheral processors for LAPD protocols)
PPCC (peripheral processors for CCS#7 protocols)
PPCU (peripheral packet Control Unit)
LICD (line card)
LICDS (line card spare)
DK40 (led alarm panel control)
DISK (physical disk)
PPXL (peripheral processor LAPD/SS7
PPXU (peripheral processor used at PPCU evolution)
IXLT (interface X25 and bcal terminal)
start phase to correctly set the card to support the rest of diagnostic tests;
end phase: to restore working conditions of the hardware to the previously
executed phase.
it will be always performed as the last phase, unless an abort
occurred, and if the termination is induced by an operator.
abort phase: resets the hardware without depending on what was currently
executed. Its actions depend on the running phase.
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Froma maintenance point of view, the primary advantage of the diagnosis feature is the
capability to provide a list of the suspected modules at once. Up to four modules can be
listed as the possible origin of any fault. This is important in the event of fault of the
network (NTW) object. This is the only case in which the correspondence between the
logical and the physical objects involved is not immediately clear. Another aspect
concerns the capability of the diagnosis to provide information about the specific compo-
nents on the module responsible for the fault. Although this information is not immedi-
ately readable, it is contained in the additional info field reported by the test output.
5.4.1 Hardware Diagnostics
Introduction
Diagnostics are provided to check the functionality of hardware units and to locate hard-
ware faults.
They achieve this by:
a) applying inputs to a hardware device;
b) comparing resulting outputs with expected outputs;
c) using the failing phase as the basis for fault resolution;
A diagnostic can be triggered by the following events:
a) manual request to test a particular device (typically during the repair or installation
procedure);
b) systemrequest in case the systemwants to start a diagnostics on a device declared
faulty: if the diagnostic passes, the device is carried back in service; if it fails, the
device is left out of service.
Every diagnostic is structured in the same way: it is divided into PHASES and each
phase into TESTS.
A TEST is a software routine that verifies the functionality of a specific hardware circuit.
A PHASE is a stand alone set of test routines, executed in a sequential manner, that
verify the same hardware device.
Every diagnostics must have:
a "start phase" to correctly initialize the device to be tested;
an "end phase" to re-establish the conditions in which the device was before the
diagnostic;
an "abort phase" to clean up the systemconguration in case of an abort of the diag-
nostics;
a variable number of "working phases" (the core of any diagnostic); each working
phase has been designed to point out a least replaceable unit (LRU).
As general rule:
each diagnostics is destructive (the object has to be locked before starting a test)
with the exception of the PWRS;
the diagnostics of a specic board is incompatible with the diagnostics of the same
type of board (i.e., the diagnostics of LICD-0 is incompatible with the diagnostics of
LICD-1);
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the operator can request to performseveral diagnostics on different hardware units;
the maximumnumber of diagnostics that can run in parallel are 8, moreover they can
be executed only if compatible with the ones in progress. If the requested diagnostic
is incompatible or 8 different diagnostics are already running, a queuing procedure
is implemented and it will be executed when possible. Otherwise it is activated at
once. The incompatible diagnostics are indicates in the following table:
Each type of hardware unit has its specific diagnostics. The results of a diagnostic of a
certain phase are different for every kind of diagnostics: normally for each test there is
a bit which indicates if the test passed or failed and the meaning of the bits depend on
the hardware device under test.
If the diagnostics runs successfully in output will be indicated just the list of the phases
which has been executed.
If the diagnostics fails in the output will indicate such and list the executed phases and,
for each failed phase 8 words which detail the type of failure.
The failure of a phase can have different degrees of severity. In particular, it may happen
that the prohibits any further diagnostic test on the device (for instance if the object or
some part of it is not accessible, or if the processor on board does not answer). In this
case, all the remaining phases (except for the end phase) will be skipped. In other failure
cases, the diagnosis will continue in spite of the bad test result. In both cases, the test
outcome will be fail. The termination of the diagnosis when a phase fails is decided
at run time by the hardware diagnostic.
If the test starts on an object in enable state, the object will turn back enable if the
executed phases passed, otherwise the object will remain in disable state. If the test
starts on an object in disable state, the object will remain disable even if all executed
phases passed.
Unit Incompatible with
MPCC MPCC TDPC MEMT
DK40 DK40
TDPC TDPC MPCC MEMT
MEMT MEMT MPCC TDPC
NTW NTW PPCC PPLD PPCU
IXLT IXLT
PPCC PPCC PPLD NTW PPCU
PPLD PPLD PPCC NTW PPCU
LICD LICD
LICDS LICDS
PWRD PWRD EPWR
EPWR EPWR PWRD
PPCU PPCU PPCC PPLD NTW
DISK DISK MPCC
PPXU PPXL PPXU NTW
PPXL PPXU PPXL NTW
CPEX CPEX
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5.4.2 Phase Identifier
In order to provide a better interpretable information, the following table shows at the
Operator, in the formof character strings, new Phase Identifiers that are specific for the
hardware object under test. The Phase Identifier are defined starting from the current
Working Phase.
In general, when a phase fails the next ones are skipped. In some cases, depending on
the hardware architecture of the board under test, a phase can be carried on even if the
previous one has failed. The phases that have this characteristic are marked with an *.
MOT New Phase Identier Old Phase
PPCC Preliminary Tests Start Phase
Memory Test* WP1
LCS7 Test* WP2
Loopback Test* WP3
R/W Loopback Register test* WP4
Force Alarm test* WP5
Alarm Test (TDPC side)* WP6
End Test End Phase
PPLD Preliminary Tests Start Phase
Memory Test* WP1
HSCX Test* WP2
Loopback Test* WP3
R/W Loopback Register test* WP4
Force Alarm Test* WP5
Alarm Test (TDPC side)* WP6
End Test End Phase
PPCU Preliminary Tests Start Phase
MPCC and TDPC DUAM Test* WP1
ABIC Test* WP2
GBIC software Test* WP3
End Test End Phase
IXLT Accessibility Tests Start Phase
Address Bus Test* WP1
Alarm Register Test* WP2
DUAM Test* WP3
firmware Internal Test* WP4
Tab. 5.1 New Phase Identiers
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End Test End Phase
PWRD Power on Test Start Phase
Basic Maintenance Test WP1
Full Maintenance Test WP2
End Test End Phase
EPWR Power on Test Start Phase
Basic Maintenance Test WP1
Full Maintenance Test WP2
End Test End Phase
DISK Preliminary Tests Start Phase
Accessibility Test WP1
Autodiagnostic Test WP2
Remote Accessibility WP3
Remote Autodiagnostic WP4
File system check WP5
End Test End Phase
DK40 Accessibility Test Start Phase
Force Alarm Test WP1
DUAM Test WP2
Firmware RAM/DPR/SCC Tests WP3
Firmware Hard Disk Test WP4
Alarm Panel Test WP5
End Test End Phase
MPCC Accessibility Test Start Phase
ESSC2 & Alarm Test WP1
Firmware card & hot link Test WP2
MPCC firmware update WP3
End Test End Phase
MEMT Accessibility Test Start Phase
DUAM Test (MPCC side) WP1
DUAM Test (TDPC side) WP2
End Test End Phase
TDPC Accessibility Test Start Phase
Test MEMT availability WP1
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Test Alarm circuit via MEMT WP2
Test Alarm circuit via TDPC WP3
End Test End Phase
NTW Accessibility Tests* Start Phase
UBEX Force Alarm Test WP1
PLLH Force Alarm Test WP2
PLLH Firmware Self Test WP3
SN Force Alarm Test WP4
SN Speech RAM Address Parity Test WP7
SN Speech RAM Data Parity Test WP8
SN Control RAM Data Parity Test WP9
SN channel loop-test WP10
End Test End Phase
LICD Accessibility Test and card reset Start Phase
Firmware protocol and processor Test WP1
Firmware Self Test* WP2
Check Alarm Status WP3
End Test End Phase
PPXL Board reset and FW self-test Start Phase
MPCC and TDPC DUAM tests WP1
Internal circuit testAccess test WP2
End Test End Phase
PPXU Board reset and FW self-test Start Phase
MPCC and TDPC DUAM tests WP1
Internal circuit testAccess test WP2
ABIC Test WP3
End Test End Phase
CPEX Accessibility Test and card force Start Phase
Fan alarm force WP1
ENVA alarm force WP2
End test End Phase
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5.4.3 PWRS Diagnostics
From a hardware point of view the four power supplies in the BSC Rack are named
PWRS modules. Froma software point of view(LMT interface) the power supplies in the
BSC Rack are named:
PWRD 0..1 (PWRS modules for the Base Rack)
EPWR 0..1 (PWRS modules for the Extension Rack)
The BSC power supply provides two regulated power voltages (+5,3V and +12,3V) with
line regulation of about 2%; the DC input voltage can be an unregulated office battery
ranging from -36V to -72V.
The PWRS diagnostics have been implemented with two working phases (see para-
graph 5.4.2).
a) PWRS diag start phase
This phase veries that Power is on (meaningful only for PWRD card).
OUTPUT if start phase fails:
No additional info (if this phase fails, PWRD is not powered on).
b) PWRS diag phase 1
This phase veries if the IXLT card controlling the PWRD/EPWR is working and
performs a basic hardware maintenance test (register test).
OUTPUT if phase 1 fails:
c) PWRS diag phase 2
This phase performs the maintenance test on PWRD/EPWR.
d) PWRS diag end phase
This phase is meaningless for PWRS diagnostics.
5.4.4 MPCC Diagnostics
The MPCC is the main controller of the BSC and provides the following functions:
Implements a microprocessor circuit based on a CPU Intel Pentium
.
Provides a total of 64 Mbytes of SDRAM and 512 Kbytes of Flash EPROM.
word[0] Line in the code where the diag failure is issued
word[1] Software item where the failure has been detected
word[2] Software line in the code where the error has been detected
word[3] Type of the detected error
(1)
(see Tab. 5.2)
word[2] Softwareline in the code where the error has been detected
(1)
(see Tab. 5.2)
word[4] IXLT card alarm register
word[5] IXLT card sense point register
word[6] IXLT card loopback register
word[7] IXLT card control point register
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Provides two programmable serial communication channels.
Provides a high speed serial link.
Allows the handling of 12 sources of interrupts by two programmable interrupt
controller.
Provides maintenance circuitry for fault detection of microprocessor device and
associated circuits.
Allows the handling of the external alarms coming from the peripheral boards.
Houses the conguration control logic that selects the active copy of MPCC board.
MPCC diagnostics have been implemented with 3 working phases (see paragraph
5.4.2).
a) MPCC diag start phase
This phase consists of the check of the power supplier card.
b) MPCC diag phase 1
This phase consists of check of the alarm circuit of the card and its subsequent
reset.
c) MPCC diag phase 2
This phase consists of rmware card and hot link diagnostics.
d) MPCC diag phase 3
This phase consists of verifying if the rmware must be updated. The third phase is
executed only if the card has a rmware version to be updated; the decision is taken
by the Processor Complex Device Handler by querying the software Handling. Its to
be noticed that, in the negative event that the rmware does not work well, the
MPCC diagnostic is considered failed and the additional information reported to the
operator will highlight the cause. At this point, the operator must replace the card put
out of service for rmware problems. A subsequent diagnostic does not recover the
situation: it immediately will not succeed because the rmware test will not pass at
the second phase.
word[0] Line in the code where the diag failure is issued.
(1)
(see Tab. 5.2)
word[0] Software line in the code where the error has been reported
(1)
(see Tab. 5.2)
word[4] The signal subtype used to invoke the firmware
word[5] The firmware response
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e) MPCC diag end phase
This phase is meaningless.
5.4.5 TDPC Diagnostics
The TDPC is responsible for exchanging messages with the other network entities via
the LAPD and the SS7 processors. It handles all signalling functions above MTP layer
2 and all application processes related to call control, radio resource management and
mobility management.
The TDPC card is implemented with a 1+1 redundancy (active and stand-by copy).
The TDPC board provides the following functions:
Implements a microprocessor circuit based on a CPUIntel Pentium
.
Provides a total of 64 Mbytes of SDRAM and 512 Kbytes of Flash EPROM.
Provides two programmable serial communication channels.
Provides a high speed serial link.
Allows the handling of 12 sources of interrupts by two programmable interrupt
controller.
Provides maintenance circuitry for fault detection of microprocessor device and
associated circuits.
Provides a double interface toward the MEMT, PPXL boards by means of duplicated
address, data and control busses.
Allows the handling of the external alarms coming from MEMT, PPXL boards.
Allows the handling of two external reset and interrupt sources coming from MPCC.
Provides the or-function for sixteen external interrupts coming from PPXL boards.
Provides eighteen programmable selection board signals used for the PPXL boards.
TDPC diagnostics have been implemented with 3 working phases (see paragraph
5.4.2).
a) TDPC diag start phase
This phase consists in the check of the power supplier of the card.
b) TDPC diag phase 1
This phase checks that at least one MEMT copy is available to perform the diag-
nostic.
word[0] Software line in the code where the error has been reported
(1)
.(see Tab. 5.2)
ERR_firmware_STATE
ERR_firmware_TMOUT
ERR_firmware_CODE
word[4] The Operating System response
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c) TDPC diag phase 2
This phase consists in the check of the alarm circuit of the card and its subsequent
reset.
See previous phase.
d) TDPC diag phase 3
This phase consists of the check of the alarm circuit of the card by means of a card
reset and subsequent result of the autotest by the TDPC rmware (phase meaning-
less in the event of TDPC outage).
e) TDPC diag end phase
5.4.6 MEMT Diagnostics
The MEMT cards are used only as a communication vehicle between the MPCCand the
TDPC cards (DUAM functionality).
The MEMT implements:
4kx16 semaphored Dual Port Ram (DPMT) which implements the communications
between the TDPC and the MPCC;
two sixteen bit registers for a fast communication (interrupt handled) between MPCC
and TDPC.
The selection of the active copy of the TDPC is under control of the MPCC.
MEMT diagnostics have been implemented with 2 working phases (see paragraph
5.4.2).
a) MEMT diag start phase
This phase consists on the check of the power supplier of the card.
b) MEMT diag phase 1
Full check of the address/data buses from/to the MPCC card, read/write access
check (DUAM only), alarm forcing test.
(1)
(see Tab. 5.2)
word[4] Command sent to the TDPC firmware that failed
(2)
(see Tab. 5.2)
word[5] Debug data from TDPC firmware
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c) MEMT diag phase 2
Full check of the address/data buses from/to the TDPC, read/write access check
(DUAM only), alarm forcing test.
d) MEMT diag end phase
(1)
(see Tab. 5.2)
(1)
(see Tab. 5.2)
LEGEND
(1)
error code management
MEANING ERR. CODE
ERR_PRNMI 0x0A
ERR_PRLOOP 0x0B
ERR_NMIINT 0x0C
ERR_MOUTAGE 0x0D
ERR_INVCONF 0x0E
ERR_IPLOOP 0x10
ERR_AFORCE 0x11
ERR_PCSMT 0x14
ERR_INVCONT 0x15
ERR_PATTERN 0x17
ERR_INVCFG 0x18
ERR_INCONSIST 0x19
ERR_LOCKSEM 0x1A
ERR_DIFF_SENSE 0x1C
ERR_TMOUT 0x1D
ERR_TDPC_MEM 0x1F
ERR_FW_STATE 0x20
Tab. 5.2 Error Codes used by PWRS, MPCC, TDPC, MEMT Diagnosis
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5.4.7 NTW Diagnostics
The NTW object refers to three different cards:
UBEX: Universal Bus EXtender. It allows the MPCCto access the peripheral boards
and collects the interrupt signals coming from them;
PLLH: Phase Lock Looped High performance board. It delivers clock and synchro-
nization signals to all BSC devices. It can work in free-running or synchronized from
an external source (SYNC or SYNE).
SNxx: Switching Matrix at 64/16/8 Kbit/s. It performs, under the MPCC control, the
switching functionality among the channel from/to the line interface cards (LICD) and
peripheral processor boards (PPXX).
NTWdiagnostics has been implemented with 10 working phases (see paragraph 5.4.2).
a) NTW diag start phase
This phase performs a basic init of UBEX, PLLH, SN.
ERR_FW_TMOUT 0x21
ERR_FW_CODE 0x22
ERR_TDPC_STALL 0x23
ERR_HW_RESET 0x24
ERR_INV_ADDR 0x25
ERR_INV_ACC 0x26
ERR_MULTI_NMI 0x27
ERR_INV_CODE 0x28
ERR_INV_LEN 0x29
ERR_TINIT_REQ 0x2A
ERR_RTE 0x2B
ERR_MPCC_RESP 0x2D
ERR_TDPC_STATUS 0x2E
ERR_PR_BIST 0x2F
(2) failure of the TDPC FW
T81_FW_40_PROTOCOL_MODE 12
T81_FW_CLEAR_INT_MEMORY 13
T81_FW_START_FULL_DIAG 10
LEGEND
Tab. 5.2 Error Codes used by PWRS, MPCC, TDPC, MEMT Diagnosis
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b) NTW diag phase 1
This phase, after repetition of basic init of the UBEX, forces all of the UBEX alarms
to see that they arise correctly.
c) NTW diag phase 2
This phase, after repetition of basic init of the PLLH, forces all the PLLH alarms to
see that they arise correctly. Finally, it checks if there are not timing alarms on the
SN introduced by the PLLH.
OUTPUT if phase2 fails:
d) NTW diag phase 3
This phase schedules the self-diagnostic test executed by the residing rmware of
PLLH.
The same of phase 2.
e) NTW diag phase 4
This phase, after repetition of basic init of SN, forces all the alarms of SN to see if
they arise correctly.
For SN16
word[0] Internal error code(1).
word[1] Code for faulted device(2).
word[2] UBEX alarm register (3).
word[3] PLLH alarm register (4).
word[4] Cause of PLLH interrupt (12).
word[5] control alarm register of SN16(6) or SNAP(6).
word[6] input alarm register of SN16(8) or SNAP(13).
word[7] output alarm register of SN16(10) or SNAP(14).
word[2] UBEX alarm register(3).
word[2] PLLH alarm register(3).
word[3] Cause of PLLH interrupt(12).
word[1] SNxx global alarm register(2).
word[2] Mask of the parity alarm of the incoming PCM lines at 8Mb/s n 16...23
word[3] Mask of the parity alarm of the incoming PCM lines at 8Mb/s n 0...15
word[4] Mask of the parity alarm of the incoming PCM lines at 2Mb/s n 0..3
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FOR SNAP
f) NTW diag phase 5 and phase 6: these two phases are skipped because they are
reserved to an hardware not supported.
g) NTW diag phase 7
SN16/SNAP: writes for diagnostics an address with a wrong parity, one by one, in
each location of the speech RAM, and checks that the alarmis detected by the gate
array.
For SN16
For SNAP (if SNAP drivers failed).
h) NTW diag phase 8
SN16/SNAP: writes for diagnostic a datum with a wrong parity, one by one, in each
location of the speech RAM, and checks that the alarmis detected by the gate array.
word[5] Mask of the comparision alarm of the outgoing PCM lines at 8Mb/s
n16...23
word[6] Mask of the comparision alarm of the outgoing PCM lines at 8Mb/s
n0...15
word[7] Bit mask of the other SNxx alarms(11).
word[0] Internal error code(1)
word[1] Snap Control Block Alarm register.
word[2] Snap Input Block Alarm register.
word[3] Ubex Address Bus register (bit 8...15).UBEX data bus register (bit 0...7)
word[4] Input alarm register of SN16(8) or SNAP(13)
word[5] Bank of Speech RAM Alarmed - Trapped Control RAM Address for
Speech RAM Data error(15).
word[6] Bank of Speech RAM Alarmed - Trapped Control RAM Address for
Speech RAM Address error(15).
word[7] Bank of Control RAM Alarmed - Trapped Control RAM Address for
Control RAM Data error(15).
word[1] Line number of the module where error occurred.
word[2] Name of the module where error occurred.
word[3] FF
word[4] FF
word[5] FF
word[6] FF
word[7] FF
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i) NTW diag phase 9
SN16/SNAP: a wrong parity is written one by one in all the locations of the control
RAM to see if the alarm is detected by the gate array.
j) NTW diag phase 10
SNAP: it performs a loop-test for all the channels, with pattern insertion at input and
verication that the same pattern is transmitted in output.
If test fails
If Snap drivers fails
k) NTW diag end phase
word[0] iSNAP Control Block Alarm Register.
word[1] SNAP Input Block Alarm Register.
word[2] SNAP Output Block Alarm Register.
word[3] Trapped value on 8Mb/s input line, before pattern insertion-Pattern
inserted on 8 Mb/s input line-Trapped value on 8 Mb/s output line.
word[4] Number of physical input line.
word[5] Number of time slot at 8 Kb/s on physical input line.
word[6] Number of physical output line.
word[7] Number of time slot at 8 Kb/s on physical output line.
word[1] Line number of the module where error occurred.
word[2] Name of the module where error occurred.
word[3] FF
word[4] FF
word[5] FF
word[6] FF
word[7] FF
LEGEND
(1) The possible error codes issued by NTW diagnostic are listed
ERR. CODE MEANING
1 loop back test failed
2 parity error on UBEX bus
3 an unexpected alarm is found active
Tab. 5.3 Error Codes used by NTW Diagnostics
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5 forcing an alarm has no effect
6 (only PLLH) CRC error in the firmware protocol
7 (only PLLH) state inconsistency of the firmware
protocol
8 time out occurred in the hardware/firmware oper-
ation
17 the hardware has been found in unexpected state
(typical for PLLH: it is found master when
expected slave)
18 a connection in SNxx has been performed incor-
rectly by the hardware
19 (only SNxx): an unexpected value, different from
a test pattern previously inserted, has been
trapped in an incoming PCM channel
20 (only SNxx): an unexpected value, different from
a test pattern previously inserted, has been
trapped in an outgoing PCM channel
21 (only SNxx): interference between the values
transmitted on outgoing channels
22 (only SNxx): interference between the data
written in 2 different locations of the control
memory, after performing connections for test
purposes
23 (only PLLH): failure of a firmware auto-diagnose
26 (only SNxx): the type of switching matrix is
different from the one required by the BSC data
base
30 an unexpected NMI has arisen while accessing to
the hardware
(2) Code indicating the faulted device. Generally it should be consistent with the card
indicated in the proposed repair action
1 error on UBEX
2 error on PLLH
4 error on SN16
5 error on SNAP
(3) UBEX alarm register
Bit n Meaning
LEGEND
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7 If 1, there is an alarm forcing in progress
6 0
5 0
4 0
3 0
2 Chip select error
1 Data parity error
0 Address parity error
(4) PLLH alarm register
Bit n Meaning
7 WDT alarm of local CPU
6 UBEX bus data parity error
5 UBEX bus address parity error
4 PLLH 0 and 1 not synchronization (it is normal if
the other PLLH is failed)
3 Lack of the signal on the maintenance selector (it
is normal, if no synch. Source is under test)
2 Lack of outgoing signal
1 Lack of external synchronism (it is normal if the
PLLH is not synchronized master)
0 If 1, PLLH outputs its signal, otherwise the signals
of other PLLH
(6) SN16/SNAP control alarm register
Bit n Meaning
7 Lack of synchronism to the control gate array
6 Lack of clock to the control gate array
5 Generic internal alarm of the control gate array
4 Wrong parity in some control RAM location
3 FIFO error
2 PLL alarm
LEGEND
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(8) SN16 input alarm register
Bit n Meaning
7 Lack of synchronization to the input gate array
6 Lack of clock to the input gate array
5 Generic internal alarm of the input gate array
3 PCM parity error on some line from LICD
2 PCM parity error on some line from PPXX
(10) SN16 output alarm register
Bit n Meaning
7 Lack of synchronization to the input gate array
6 Lack of clock to the input gate array
5 Output block general alarm
3 Comparison alarm
2 PCM parity error on the internal parallel bus
(11) Summarization of some important alarms
Bit n Meaning
7 0
6 0
5 0
4 0
3 Unspecified internal alarm
2 SN: cyclic test alarm
1 UBEX data or address parity error
0 Timing problems
LEGEND
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(12) PLLH alarm register description
0x0008 checksum failed
0x0009 fault on DAC or ADC
0x000a phase comparator fault
0x000c generic protocol error
(13) SNAP input alarm register
7 0
6 0
5 Internal timing error/Reroute in matrix error
4 Logic OR of the CRAM data and address parity
error
3 0
2 Parity alarm on one or more of 8Mb PCM input
lines
1 0
0 0
(14) SNAP output alarm register
7 0
6 0
5 Output block general alarm
3 Comparison alarm
2 Parity alarm on the internal parallel bus
1 0
0 0
(15) Meaning of output diagnostics for SNAP card, in case of failure of phase n.4
4 Bit 0-15: Address that occured when a parity
address or data alarm was detected on UBEX
bus. This word contains a valid data as long as bit
0 or bit 1 of word [0] are set.
LEGEND
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5.4.8 PPLD/PPCC Diagnostics
The PPLD is responsible for handling the layer 2 of LAPD protocol. The card is based
on an INTEL CPU 80C186 running at 20 MHZ. The card architecture allows the down-
load of the code.
The MPCC controls, for operating and maintenance purposes, the PPLD via the UBEX;
the TDPC exchanges messages with the PPLD through a 8Mbyte dual port RAM; the
selection of the active copy of the TDPC is under the control of the MPCC.
The LAPD circuit interfaces the switching matrix by means of a duplicated 2Mbit/s link;
up to 8 physical channels can be interfaced both at 64kbit/s and 16kbit/s. An
"n+m"redundancy concept is used for the cards that implement this function.
The PPCC board is responsible for handling the MTP layer 1 and 2 of the Common
Channel Signalling System#7 (CCSS#7) protocol used for signalling on the A interface.
The hardware implementation of the PPCC is the same of the PPLD.
PPXX diagnostics has been implemented with 6 working phases (see paragraph 5.4.2).
a) PPXX diag start phase
This phase checks on NTW outage and TDPC outage, loopback test, CPU reset,
rmware autodiagnose, alarm-forcing test, software load.
5 Bit 0-13: Control RAM address location at which
occured a parity alarm on the Speech RAM data
bus
Bit 14-15: Bank of the Speech RAM memory
alarmed. Data contained in this word are valid
only if the bit in position 2 of word [2] is set to 1.
6 Bit 0-13: Control RAM address location at which
occured a parity alarm on the Speech RAM
address bus
Bit 14-15: Bank of the Speech RAM memory
alarmed. Data contained in this word are valid
only if the bit in position 2 of word [2] is set to 1.
7 Bit 0-13: Control RAM address in case the output
gate array detects a data parity alarm on the data
bus of the control RAM itself.
Data contained in this word are valid only if the bit
in position 4 of word [2] is set to 1.
LEGEND
word[0] source item(1)
word[1] source code line
word[2] error code(2)
word[3] additional information(3)
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b) PPXX diag phase 1
This phase executes memory tests (RAM, TDPC-PPXX DUAM, checksum verica-
tion of EPROM content).
OUTPUT if phase 1 fails for hardware/rmware problems in diagnostic
command execuion:
OUTPUT if phase 1 fails because of unsuccessful answer coming from
PPLD/PPCC software:
c) PPXX diag phase 2
This phase checks the HSCX (PPLD) and the LCS7 (PPCC) channels.
See previous phase. As relating to the correspondence between the PPLD/PPCC
software internal phases and the diagnostic phases managed by the PPxx hardware
diagnostic routines: hardware diag phase 2 consists of internal phase 3 having the
meaning of checking correct LCS7 (on PPCC) or HSCX (on PPLD) programming.
word[7] additional information(7).
word[0] error source item (1)
word[1] error line inside source code
word[2] error code (2)
word[3] meaningless (0x0)
word[0] error code (2)
word[1] first byte coming from card software (0x13 if OK)
word[2] second byte coming from card software (0x80 if diag failed)
word[3] third byte coming fromcard software (bit mask of failed internal software
phases belonging to range 0-7). The correspondence between the
PPLD/PPCC software internal phases and the diagnostic phases
managed by PPxx hardware diagnostics routines is:
hardware diagnostics phase 1 consists of internal phases 0,1,2 having
the following meaning:
0 --> RAM test
1 --> PPxx_TDPC DUAM test
2 --> EPROM checksum test
word[4] fourth byte coming from card software (bit mask of failed internal soft-
ware phases belonging to range 8-15)
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d) PPXX diag phase 3
This phase performs loopback tests inside EXPI, HCSX test for PPLD or LCS7 test
for PPCC.
See diag phase 1. As relating to the correspondence between the PPLD/PPCC soft-
ware internal phases and the diagnostic phases managed by the PPxx hardware
diagnostic routines: hardware diag phase 3 consists of internal phases 4 and 5
having the following meaning:
4 --> HSCX (on PPLD) or LCS7 (on PPCC) loopback test
5 --> EXPI (Gate Array) loopback test
e) PPXX diag phase 4
This phase performs the W test on the EXPI loopback register.
ware internal phases and diagnostic phases managed by the PPxx hardware diag-
nostics routines: hardware diag phase 4 consists of internal phase 6 having the
following meaning:
6 --> R/W test on EXPI loopback register
f) PPXX diag phase 5
This phase performs parity alarmforcing, EPROMcompatibility, WDT alarmarising
in the event of missing reset operation, the missing clock alarm forcing and internal
loopback test (checking FIFO queues inside the LCS7 or the HSCX).
OUTPUT if phase 5 fails
ware internal phases and diagnostic phases managed by the PPxx hardware diag-
nostics routines: hardware diag phase 5 consists of internal phases 7, 8, 10 having
the following meaning:
7 ----> hardware alarms forcing
8 ----> card/EPROM compatibility
10 --> HSCX internal loopback test
If one or more tests fail, bit mask with notication of unsuccessful internal phases is
inside word [3] for phase 7 and inside word [4] for phases 8 and 10.
g) PPXX diag phase 6
This phase checks on the TDPC side (PPCC/PPLD DUAM) concerning NMI (Non
Maskable Interrupts) and card access test (routine activated by MPCC message).
OUTPUT if phase 6 fails
word[0] 0 - if phase result is good or DUAM problems are detected.
error code if an operating system or tasks communication problem took
place
error code - if an operating system or tasks communication problem
took place
word[1] source code item identifier (see Start Phase) in case of card problem
detected on DUAM side
word[2] source line number
word[3] error code(2) showing PPLD/PPCC fault
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h) PPXX diag end phase
LEGEND
(1) identifier of source item where problem took place
1 DHXXDCCH
2 DHXXDCDE
3 DHXXDCEH
4 DHXXDCSA
5 DHXXDCSM
6 DHXXDCTH
7 DHXXDDDI
8 DHXXDDHD
9 DHXXGSUT
10 DHXXININ
11 DGHDXXDP
(2) error code description
NTW_outage_test 0001h
TDPC_outage_test 0002h
loop_test 00e3h (access to loopback reg.)
00e4h (NMI)
FW_diagnose_test 00e2h (firmware self test failed)
008ah (firmware time out)
alarm_test 00a1h (forcing failed)
00a0h (alarm persists)
SW_load_test 000ch (load failed)
0014h (file system problem)
operating system problems 000ah (mailbox creation failed, null DH answer)
tasks interface problems 000bh (PPxx DH-time-out during load function)
software start 0080h (sw nack answer) or 008ah (sw time out)
Tab. 5.4 Error Codes used by PPxx Diagnostics
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forcing Out Of Service Idle status 008ch (software nack answer) or 008ah (sw time
out)
alarm raising during card access 008ch (time-out expired in command sending)
00a0h (alarm detected during reading operation
of software answer)
problems during command to
card
00a3h (writing error on MPCC-PPXX interface)
0082h (negative software answer, different from
Diag Executed)
0090h (Diag Failed answer inside software
second byte)
loopback test 00e4h if NMI problem
00e3h if card access problem
(3) additional information; in details:
NTW/TDPC outage, operating
system problem, software time-
out, firmware diagnosis failure,
software start/Force
If card access for report is successful:
high byte=parity alarm cause (if any)
low byte=mask of alarms not causing interrupts
OOS failure, load failure If card access for report fails: source code item
(1)
other causes mask of alarms causing interrupts (high byte);
mask of alarms not causing interrupts (low byte)
software start/Force OOS failure,
load failure
high byte = mask of alarms causing interrupts
low byte = circuits enabled to transmit (to NTW) if
card access (for report) fails: source line number
other causes trapped PCM channel address (parity error) (high
byte); control mask of alarms towards UBEX (low
byte)
load failure
high byte = first card control register
low byte = second card control register. If card
access (for report) fails: error code (2)
other causes trapped PCM channel data
LEGEND
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5.4.9 LICD Diagnostics
The LICD is an object that represents the QTLP or STLP line interface boards.
The LICD realizes the interconnection with the PCM30/PCM24 links on the Asub and
Abis interfaces. Submultiplexed time slots coming fromthe BTS and the TRAU must be
extracted and rate adapted to the rate of the switching network and vice versa for
outgoing time slots. An "n+1"redundancy concept is used for the cards that implement
this function.
LICD diagnostics has been implemented with 3 working phases (see paragraph 5.4.2).
a) LICD diag start phase
This phase checks the compatibility of the LICD with the database, executes a test
on PDALARM forcing and some LOOPBACK tests on the card.
load failure
high byte = card reset register (0011h no reset in
progress 00efh reset in progress)
low byte = semaphore PPxx -> DH on MPCC
firmware diagnosis failure,
software Start/Force OOS failure
Negative firmware autodiagnostic result soft-
ware/firmware negative answer
Unsuccessful software load: Load failure nack cause:
3=Failed
11=No File Found
16=Card Problem
19=Load In Progress
out
no add info
other causes trapped PCM channel data (parity error)
LEGEND
word[1..6] 0
word[7] LICD type required by DBA (low byte); physical LICD type really
present (high byte).
1=QTLP V1;
2=QTLP V2
3=STLP
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b) LICD diag phase 1
This phase executes twice the cardcheck rmware command to verify that the card
is working properly.
The same as start phase.
c) LICD diag phase 2
This phase performs the card reset, test network copy programming and executes
diagnostic checks on the specied card.
d) LICD diag phase 3
This phase performs card reset, test network copy programming and executes diag-
nostic check on specied card.
e) LICD diag end phase
OUTPUT if end phase fails:
word[1] firmware diagnose report(2)
word[4..6] 0
word[7] LICD type required by DBA (low byte);
physical LICD type actually present
(high byte).
1=QTLP V1;
2=QTLP V2
3=STLP
word[0] = error code(1); word[1-6] = 0 if card access fails OR
word[0-3]=FW diagnose repord; word[4-6] = 0
word[7] = as word[7] of phase 0
word[0] error code(1) ALARM REPORT(3)
word[1..6] 0 ALARM REPORT(3)
word[7] 0 ALARM REPORT(3)
word[0] = error code(1) ; word[1-7] = 0 if access card fails OR
word[0-7]= ALARM REPORT(3)
The same as start phase.
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LEGEND
(1) The possible error codes issued by the LICD diagnostic are listed
ERROR CODE MEANING
FFFD parity data alarm is raised
FFFC NMI has occurred
FFFB inconsistent firmware response
FFFA timeout for card response has expired
FFF9 request incompatible with previous set
FFF8 firmware mismatched the command
FFF7 wrong data read from DUAM
FFF6 a reset has occurred
FFF5 card not inserted or fuse burned
FFF4 diagnostic has started
FFF3 stack overflow
FFF2 command not correctly understood
FFF1 queue buffer is full
FFF0 relay fuse burned
FFEF requested reset has not performed
FFED DUAM write/read loop error
FFD8 loopback test failed
FFD7 parity err force not working
(2) Firmware diagnose report
QTLP V1 (bit coded)
word[0] xxxxxxxxxxxxxxxxxy y = 1 means board diagnose failed
word[1] xxxxxxxxxxxxxxxcba a = 1 means RAM1 failed
b = 1 means RAM2 failed
c = 1 means timer0 interrupt problem
word[2] xxxxxxxxxkhqrsvgp p = 1 means diagnose DTIOM0 failed
g = 1 means diagnose DTIOM1 failed
v = 1 means diagnose DTIOM2 failed
s = 1 means diagnose DTIOM3 failed
Tab. 5.5 Error Codes used by LICD Diagnostics
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r = 1 means diagnose DTIOM4 failed
q = 1 means diagnose DTIOM5 failed
h = 1 means diagnose DTIOM6 failed
k = 1 means diagnose DTIOM7 failed
word[3] xxxxxxxxxxxxxxxnm m = 1 diagnostic parity checker
n = 1 diagnostic multiplexer
QTLP V2 (bit coded)
word[0] xxxxxxxxxxxxxxxxxy y = 1 means board diagnose failed
word[1] xxxxxxxxxxedcbxxxa a = 1 means RAM1 failed
b = Internal alarm simulation test
c = MPCC Dual port RAM test
d = Flash EPROM checksum test
e = FPGA (Field Programmable Gate Array)
loopback test
word[2] xxxxxxxxxkhqrsvgp p = 1 line alarm n0 simulation test failed
g = 1 line alarm n1 simulation test failed
v = 1 line alarm n2 simulation test failed
s = 1 line alarm n3 simulation test failed
r = 1 line alarm n4 simulation test failed
q = 1 line alarm n5 simulation test failed
h = 1 line alarm n6 simulation test failed
k = 1 line alarm n7 simulation test failed
word[3] xxxxxxxxxxxxonmxx m = 1 ESCC2 channel n0 test failed
n = 1 ESCC2 channel n1 test failed
o = 1 Watch Dog Timer simulation test failed
STLP (bit coded)
word[0] xxxxxxxxxxxxxxxxxy y = 0 means board ok
y = 1 means board diagnose failed
word[1] xxxxxxxxxxedcbxxxa a = 1 means RAM1 failed
b = Internal alarm simulation(INA) test failed
c = MPCC Dual port RAM test (MDP) failed
d = Flash EPROM checksum test (CKS) failed
e = FPGA (Field Programmable Gate Array)
loopback test failed
LEGEND
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word[2] xxxxxxxxxkhqrsvgp p = 1 line alarm n0 simulation test failed
g = 1 line alarm n1 simulation test failed
v = 1 line alarm n2 simulation test failed
s = 1 line alarm n3 simulation test failed
r = 1 line alarm n4 simulation test failed
q = 1 line alarm n5 simulation test failed
h = 1 line alarm n6 simulation test failed
k = 1 line alarm n7 simulation test failed
word[3] xxxxlkji00f0 f = 1 line simulation test failed (line 8)
i = 1 Watch Dog Timer simulation test failed
j = 1 line simulation test failed (line 9)
k = 1 line simulation test failed (line 10)
l = 1 line simulation test failed (line 11)
k = 1 line simulation test failed (line 10)
l = 1 line simulation test failed (line 11)
(3) ALARM REPORT
word[0] xxxxxxxxxxxxxxxxxa a = 1 at least one internal alarm is active
word[1] xxxxxxlkjihgfedcba ab = 0: no alarm;
ab = 2: transient alarm on SN interface;
ab = 3: permanent alarm on SN interface
c = 1 relay power supply off
d = 1 detected parity alarm in read cycle
e = 1 multiplexer alarmed (QTLP V1, V2 only)
h = 1 Queue buffer full (QTLP V1 only)
i = 1 board reset alarm (QTLP V1, V2 only)
j = 1 stack overflow (QTLP V1 only)
k = 1 data parity alarm upon read access on
mpcc dual port (QTLP V1 only)
l = 1 data parity alarm of the FPGA control
memory (QTLP V2 only)
word[2] xxxxxxxxxhgfedcba a-h = alarmed state of lines 0-7
word[3] Not meaningful
LEGEND
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5.4.10 DK40 Diagnostics
The copy 0 of DK40 device is used for the change version procedure from BR5.5 to
BR6.0. It provides the following functions:
MPCC interface: it receives the addresses and data busses from the second copy
of the MPCC and selects the signals relevant to the active copy; maintenance
circuitry for fault detection is provided.
Clock processor: it is implemented by a 80C186 microprocessor which acts as co-
processor of the MPCC as fas as it concerns the disk le system functions.
4K words dual port RAM: it provides the intercommunications between the MPCC
and the disk processor.
Winchester Embedded Disk: it implements the mass storage memory.
Synchronous data link for cross-wired connection to opposite copy: it is provided for
maintenance purposes.
The copy 0 of DK40 unit also implements the control of the Alarm Panel circuit (ACKT).
DK40 diagnostic have been implemented with 5 working phases; phase 4 tests of the
DK40 disk (see paragraph 5.4.2).
a) DK40 diag start phase
This phase is defined in order to initialize the hardware. It executes the following
tests:
check of the power on of the card;
verify if the card is in the rack;
test the loop back register;
reset the local microprocessor.
word[0] 0x0001 POWER_ON_TEST
word[1] 0x8004 card_not_powered
word[2] MPCC_sense_point_register
word[0] 0x0002 INSERTION_TEST
word[1] 0x8005 card_not_inserted
word[0] 0x0002 INSERTION_TEST
word[1] 0x8006 NMI_1st_access
word[0] 0x0003 ACCESS_DETECTOR_TEST
word[1] 0xf000 nmi_after_alarm_reset
word[1] 0xf002 nmi_after_sem_lock
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word[1] 0xf003 sem_not_locked
word[2] maintenance_semaphore_lock_result +
alarm_semaphore_lock_result
word[1] 0x8007 nmi_wr_word1
word[1] 0x8008 w1_comp_failed
word[2] value written to the PCS loopback
register
word[1] 0x8009 nmi_wr_word0
word[1] 0x800a w0_comp_failed
word[2] value written to the PCS loopback
register
word[1] 0xf004 sem_not_released
word[2] nmi_after_micro_reset
word[0] 0x0004 MICRO_RESET_TEST
word[2] nmi_after_micro_reset
word[1] 0x800b nmi_after_micro_reset
word[1] 0x800c unsuccessful_micro_reset
word[2] DPR location 03CEh content
word[3] DPR location 03D0h content
word[4] DPR location 03D2h content
word[1] 0x800d polling_interrupted
word[2] nmi_after_alarm_reset
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b) DK40 diag phase 1
This phase tests the DK40 internal alarm register to verify that the data and the
addressing parity alarm is correctly recognized.
c) DK40 diag phase 2
This phase tests the Dual Port RAM.
word[1] 0x800e disk_not_available
word[2] DPR location 03DCh content
word[1] 0x800f timeout_expired
word[2] DPR location 03DCh content
word[0] 0x0005 ALARM_REGISTER_TEST
word[1] 0xf000 nmi_after_alarm_reset
word[1] 0x8010 no_nmi_after_al_forcing
word[1] 0xf001 alarm_not_reset
word[2] DK40 internal alarm register
word[1] 0x8011 alarm_not_forced
word[0] 0x0006 DPR_TEST
word[1] 0xf002 nmi_after_sem_lock
word[3] not locked semaphore index
word[1] 0x8012 nmi_wr_idx0
word[3] DPR offset
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d) DK40 diag phase 3
This phase consists of calling to the internal diagnostics provided by the rmware in
order to test the RAM, the DPR, the SCC and the parity check circuit.
e) DK40 diag phase 4
This phase consists of calling the internal diagnostics provided by the rmware in
order to test the hard disk.
word[1] 0x8014 nmi_wr_idx1
word[3] DPR offset
word[1] 0x8016 nmi_clear_dpr
word[3] DPR offset
word[1] 0x8013 i0_comp_failed
word[2] DPR offset
word[3] pattern read back from DPR
word[1] 0x8015 i1_comp_failed
word[2] DPR offset
word[1] 0x8017 clear_dpr_failed
word[2] DPR offset
word[0] 0x0007 FW_TEST
word[1] xxxxxxxxxxxxxxxxxxdcba a = 1 means RAM fault
b = 2means DPR fault
c = 3means SCC fault
d = 4means parity check ckt fault
word[2] DK40 internal alarm
register
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f) DK40 diag phase 5
This phase is dened in order to diagnose the alarm panel interface: it consists of
testing the lamp numbered 8..23 and the lamp numbered 0..7 corresponding to the
relay drivers.
g) DK40 diag end phase
This phase is meaningless in the DK40 diagnostics.
word[0] 0x0008 DISK_TEST
word[1] xxxxxxxxxxxxxxxxbxxxxa a = 1 means disk fault
b = 1 means disk not ready
word[2] DK40 internal alarm
register
word[0] 0x0009 ALARM_PANEL_TEST
word[1] 0x8018 lamps_not_turned_off
0x8019 set_lamp_failed
0x801a get_lamp_failed
word[3] not working lamp state (high byte) + not
working lamp number
word[4] RELAY_DRIVERS_LAMP_TEST
word[5] 0x8018 lamps_not_turned_off
0x8019 set_lamp_failed
0x801a get_lamp_failed
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LEGEND
TEST-ID VALUE
POWER_ON_TEST 0x0001
INSERTION_TEST 0x0002
ACCESS_DETECTOR_TEST 0x0003
MICRO_RESET_TEST 0x0004
ALARM_REGISTER_TEST 0x0005
DPR_TEST 0x0006
FW_TEST 0x0007
DISK_TEST 0x0008
ALARM_PANEL_TEST 0x0009
RELAY DRIVERS_LAMP_TEST 0x000a
Defines for each phase/test results
card_not_powered 0x8004
card_not_inserted 0x8005
NMI_1st_access 0x8006
nmi_wr_word1 0x8007
w1_comp_failed 0x8008
nmi_wr_word0 0x8009
w0_comp_failed 0x800a
nmi_after_micro_reset 0x800b
unsuccessfull_micro_reset 0x800c
polling_interrupted 0x800d
disk_not_available 0x800e
timeout_expired 0x800f
no_nmi_after_al_forcing 0x8010
alarm_not_forced 0x8011
nmi_wr_idx0 0x8012
i0_comp_failed 0x8013
nmi_wr_idx1 0x8014
i1_comp_failed 0x8015
Tab. 5.6 DK40: Test-id Values
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5.4.11 DISK on MPCC Diagnostics
The disk device realizes the mass storage of the SBS. The disks are housed on and
accessible from the MPCC cards. It is possible, through a flat cable that connects the
two MPCC cards, to access from an MPCC to the disk of the other MPCC.
DISK diagnostic has been implemented with 5 working phases (see paragraph 5.4.2).
a) DISK diag start phase
b) DISK diag phase 1
This phase veries the disk accessibility. It performs an hardware reset to the disk
unit and waits the result.
c) DISK diag phase 2
This phase issues to the disk the command that performs the internal diagnostic
tests implemented by the disk itself.
d) DISK diag phase 3
This phase veries the disk accessibility through the at cable. It performs an hard-
ware reset to the disk unit and waits the result.
nmi_clear_dpr 0x8016
clear_dpr_failed 0x8017
lamps_not_turned_off 0x8018
set_lamp_failed 0x8019
get_lamp_failed 0x801a
nmi_after_alarm_reset 0xf000
alarm_not_reset 0xf001
nmi_after_sem_lock 0xf002
sem_not_locked 0xf003
sem_not_released 0xf004
LEGEND
Tab. 5.6 DK40: Test-id Values
word[0] Disk status register
word[1] Disk error register
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e) DISK diag phase 4
This phase issues to the disk (through the at cable) the command that performs the
internal diagnostic tests implemented by the disk itself.
f) DISK diag phase 5
This phase veries the consistency of the system structures of the File System. If
any inconsistences are found during the check, they will will be removed and the
structures rebuilt.
g) DISK diag end phase
During the execution of a disk test, it never occurs that all the above phases are
performed. It depends on MPCC status and if the request diag is for the local or remote
disk. The table below shows in detail which phases are executed in the several condi-
tions.
5.4.12 IXLT Diagnostics
IXLT (Interface X.25 and Local Terminal) allows the MPCC to be connected to the OMC
(by a X.25 protocol) and to the LMT via a proprietary HDLC protocol with V.11 interface.
It implements the following functions:
MPCC interface: it receives the addresses and data busses from the second copy
of the MPCC and select the signals relevant to the active one;
word[2] Error counter
LOCAL DISK REMOTE DISK,
MPCC HOT_STBY
REMOTE DISK, MPCC in Firmware
Start Start Start
WP 1 WP 1 WP 3
WP 2 WP 2 WP 4
WP 5 WP 3 WP 5
End WP 5 End
End
Tab. 5.7 List of phases that are executed in the several conditions
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8 Kbytes Dual Port Ram: it implements the intercommunications path between the
MPCC and the IXLT;
Two link controllers: they provide level 1 and level 2 both for the OMC and for the
LMT;
The IXLT processor is built around a 386 SX microprocessor, running at 16MHZ, with
3/4/6 Mbyte (depending on the card version) of RAM and 256 kbyte of EPROM (boot-
strap); it is able to handle the full OSI stack.
With BR 5.0 the last version IXLTV6 can be used. It has the following features:
Implements a microprocessor circuit based on CPUIntel 486SXLC-40 running at 20
MHz.
Provides a total of 6 MByte of static ram memory, parity protected, and 512 KByte
of EPROM.
Receives the address and data busses from the second copy of the administrative
processors (MPCC) and selects the signals relevant to the active copy.
Provides a 6 K or 8 K word Dual Port Ram, parity protected, that implements the
intercommunications path between IXLTV6 and the administrative processor
(MPCC).
Allows the administrative processor to reset directly the IXLTV6 processor and
control the V.11 interfaces.
Provides three programmable 16 bit timers.
Allows to handle 8 source of INTR interrupt by a programmable interrupt controller.
Provides 128x16 bit word of serial EPROM to store card identication data.
It implements the following interfaces via two ESCC2:
a 64 Kbit/s embedded in a 2 Mbit line torward the OMC via the MSC
a V.11-X.21 (DTE) link toward OMC via PSPDN
a V.11 (DCE) toward LMT
a V.28 toward a debugger terminal
IXLT diagnostics has been implemented with 4 working phases (see paragraph 5.4.2).
a) IXLT diag start phase
This phase is defined in order to check the card availability. It executes the following
tests:
verify if the card is powered
control if the card is in the rack
b) IXLT diag phase 1
This phase tests the address bus with the walking one method and reset of the local
microprocessor.
word[0] 0x0001 TEST_ID _POWER_ON
word[1] 0x8003 CARD_NOT_POWERED
OR
word[0] 0x0002 TEST_ID _INSERTION
word[1] 0x8004 CARD_ACCESS_FAILED
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c) IXLT diag phase 2
This phase tests the internal alarmregister to verify that the data and the addressing
parity alarms are recognized correctly .
d) IXLT diag phase 3
This phase tests the entire DPR.
e) IXLT diag phase 4
This phase call to the internal diagnostic provided by the rmware.
word[0] 0x0003 TEST_ID_ACCESS_DETECTOR
word[1] 0x8004 CARD_ACCESS_FAILED
OR
word[0] 0x0003 TEST_ID_ACCESS_DETECTOR
word[1] 0x8009 ALARM_NOT_RESET
OR
word[0] 0x0004 TEST_ID_MICRO_RESET
word[1] 0x8005 UNSUCCESSFUL_MICRO_RESET
OR
word[1] 0x8007 UNSUCCESSFUL_FW_READY
word[2] IXLT alarm register
word[3] IXLT sense point register
word[4] IXLT loopback register
word[5] IXLT control point register
word[6] IXLT DUAM interrupt register
OR
word[1] 0x8006 UNSUCCESSFUL_DUAM_INIT
word[0] 0x0006 TEST_ID_ALARM_REGISTER
word[1] 0x8008 ALARM_NOT_FORCED
word[2] ERR_ALRM
ERR_NONMI
ERR_FORCE
word[0] 0x0005 TEST_ID_DPR
word[1] 0x800a UNSUCCESSFUL_DPR_TEST
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f) IXLT diag end phase
This phase gives a reset to the microprocessor to delete card settings.
word[0] 0x0007 TEST_ID_FW
word[1] 0x800b MBX_ERROR
0x800c MSG_ERROR
0x800d TIMER_ERROR
0x800e TIMEOUT_ERROR
0x800f FW_READY_OK
0x8010 FW_READY_NOK
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LEGEND
TEST-ID VALUE
MDGHD_IXLT 0x0000
TEST_ID_POWER_ON 0x0001
TEST_ID_INSERTION 0x0002
TEST_ID_ACCESS_DETECTOR 0x0003
TEST_ID_MICRO_RESET 0x0004
TEST_ID_DPR 0x0005
TEST_ID_ALARM_REGISTER 0x0006
TEST_ID_FW 0x0007
Defines for each phase/test results
INVALID_CARD_MNEMONIC 0x8000
COPY_OUT_OF_RANGE 0x8001
INVALID_PHASE_NUMBER 0x8002
CARD_NOT_POWERED 0x8003
CARD_ACCESS_FAILED 0x8004
UNSUCCESSFUL_MICRO_RESET 0x8005
UNSUCCESSFUL_DUAM_INIT 0x8006
UNSUCCESSFUL_FW_READY 0x8007
ALARM_NOT_FORCED 0x8008
ALARM_NOT_RESET 0x8009
UNSUCCESSFUL_DPR_TEST 0x800a
MBX_ERROR 0x800b
MSG_ERROR 0x800c
TIMER_ERROR 0x800d
TIMEOUT_ERROR 0x800e
FW_READY_OK 0x800f
FW_READY_NOK 0x8010
Tab. 5.8 IXLT: Test-id Values
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5.4.13 PPCU Diagnostics
The PPCU card is a peripheral processing board which allows the GPRS feature in the
SBS. Its basic functions are channel resource allocation and protocol conversion
between the Abis and the Gb interface.
One BSCcan be equipped with 4 PPCUboard. The boards are subdivided into two pairs
with redundancy 1+1. Each pair of redundant PPCUs identifies a PCU serving an inde-
pendent GPRS area.
The perform-test command is addressed to a PPCU x, where x is the absolute number
of the PPCU: the first two copies refer to the first PCU, the last two to the second one.
The MPCC controls the PPCU via the UBEX, for operating and maintenance purposes;
the TDPC exchanges messages with the PPCU through a 8 Kbyte dual port RAM; the
selection of the active copy of the TDPC is under the control of the MPCC.
One PCU(a couple of 1+1 redounded PPCU) has access to a whole 2 Mb/s flux towards
SN16. This bandwidth, composed of 32 time slots at 64 Kb/s, is shared by the four DSPs
of the ABIC processor (which work on 16 Kb/s time slots connected to the BTS) and by
the GbIC (connected via frame relays at 64 Kb/s to the SGSN). The PPCU under test,
however, and in general the PPCU that is not providing service, is disconnected from
the SN.
PPCU diagnostics have been implemented with 5 working phases (see paragraph
5.4.2). The phases 1, 2, 3 are in effect performed by the PCUC software, but are
requested by the MPCC software via a unique command (MPCC DUAM). The output
result towards MPCC (about 230 bytes) contains the information regarding all these 3
phases. The MPCC diagnostic software splits this information up and formats it for the
output result.
a) PPCU diag start phase
This phase checks NTW outages and TDPC outages, loopback tests, CPU resets,
rmware auto-diagnosis, software loads.
word[0] Source item (1)
word[1] Source code line
word[2] Error code (2)
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word[3] Cases:
a) Firmware autodiagnostics failure
(meaning of possible bit values):
0 = test failure of Pentium RAM (64 MB);
1 = test failure of DSP 0 internal RAM (64KB);
2 = test failure of DSP 1 internal RAM (64KB);
3 = test failure of DSP 2 internal RAM (64 KB);
4 = test failure of DSP 2 internal RAM (64 KB);
5 = test failure concerning RAM on Motorola (2MB);
6 = test failure of TDPC-PPCU DUAM)
b) Unsuccessful Start / Force Out of Service Command to
PCUC:
Low byte -> Byte 0 of PCUC answer = 0x36 (Start/Force Out
of Service Code);
High byte -> Byte 1 = 0x2 (unsuccessful)
c) Unsuccessful software executable load: cause of failure
(possible nack causes:
3 = Failed
11 = No File Found
16 = Card Problem
19 = Load In Progress)
d) Unsuccessful patches load: list of possible nack causes:
3 = Failed (patch file probably corrupted)
19 = Another Load In Progress
21 = File System failure
23 = Load Aborted
e) Time out during a MPCC - PCUC command, TDPC
outage and all other causes of error:
UBEX Register "mirror" (stored copy of last written values)
(low byte)
Saved bit mask of PPCU last alarms read on UBEX register (if
any) (high byte)
word[4] Cases: firmware diagnostics failure, unsuccessful Start /
Force Out Of Service command to PCUC:
Byte 2 of PCUC answer (low byte);
Byte 3 of PCUC answer (high byte)
In case of time out during a MPCC - PCUC command, TDPC
software semaphore (MPCC -> PCUC) on MPCC-PCUC
DUAM (low byte)
First byte of PPCU DH command to PPCU Agent on PCUC
(high byte)
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b) PPCU diag phase 1
This phase tests the hardware circuitry that can be interfaced by the PCUC. It
performs a read/write check on the TDPC and MPCC DUAM (checks for parity
alarms). It performs a fast access test of the Qspan, (checks for access alarms).
Notice that the phase 3, which checks the GbIC, indirectly performs a test of the
Qspan. The Qspan is the Bus Bridge which allows communication between the
PCUC and the GbIC.
Byte 5 (high byte)
Second byte of PPCU DH command to PPCU Agent on
PCUC (low byte);
Third byte of PPCU DH command to PPCU Agent on PCUC
(high byte)
Byte 7 (high byte)
software semaphore (PCUC -> MPCC) on MPCC-PCUC
DUAM (low byte);
first byte of PPCU Agent answer to PPCU DH on MPCC (high
byte)
Byte 9 (high byte)
Second byte of PPCU Agent answer to PPCU DH on MPCC
(low byte)
Third byte of PPCU Agent answer to PPCU DH on MPCC
(high byte)
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word[0] If a problem was detected by diagnostic test:
Bit mask showing problem area:
00000100 means MPCC DUAM failure;
00001000 means TDPC DUAM failure.
If a fault was detected during MPCC-PCUC interface
(concerning hardware or firmware or TDPC-PPCU DUAM):
Source item (high byte) and error code (low byte).
word[1 If a problem was detected by diagnostic test:
Stored copy of last value written on UBEX register (low byte)
and stored copy of last alarms (if any) read on UBEX register
(high byte)
Source code line
DUAM (low byte)
(high byte)
(high byte)
PCUC (low byte);
third byte of PPCU DH command to PPCU Agent on PCUC
(high byte)
DUAM (low byte)
(high byte)
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c) PPCU diag phase 2
This diagnostic phase checks the AbIC, verifying whether all the DSPs are correctly
sending the communication interrupt to the PCUC.
DUAM (low byte);
byte)
PCUC (low byte);
(high byte)
(low byte)
(high byte)
DUAM (low byte);
byte)
Fourth byte of PPCU Agent answer to PPCU DH on MPCC
(low byte)
Fifth byte of PPCU Agent answer to PPCU DH on MPCC (high
byte)
(low byte)
(high byte)
word[7] If a fault was detected during MPCC-PCUC interface
(low byte)
byte)
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00000001 means AbIC failure.
0x0020 means loop test on AbIS interface of DSP processors
failed: more in details, one or more AbIC received some
uncorrect PCU Frames from PLD closed in loop mode.
a) if AbIS loop test failed: Bit mask of failed DSP (for example,
0x0005 means DSP-0 (0X01) and DSP-2 (0x04)).
b) otherwise: stored copy of last value written on UBEX
register (low byte) and stored copy of last alarms (if any) read
on UBEX register (high byte)
Source code line
a) if AbIS loop test failed: Bit mask of PDT channels involved
in failure (AbIC-0 -->PDT 0-15)
b) otherwise: software semaphore (MPCC -> PCUC) on
MPCC-PCUC DUAM (low byte)
(high byte)
(high byte)
in failure (AbIC-1 -->PDT 16-31)
b) otherwise: second byte of PPCU DH command to PPCU
Agent on PCUC (low byte);
(high byte)
DUAM (low byte)
(high byte).
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in failure (AbIC-2 --> PDT 32-47).
b) otherwise: software semaphore (PCUC -> MPCC) on
MPCC-PCUC DUAM (low byte);
byte)
PCUC (low byte);
(high byte)
in failure (AbIC-3 --> PDT 48-63).
b) otherwise: second byte of PPCU Agent answer to PPCU
DH on MPCC (low byte)
(high byte)
DUAM (low byte);
byte)
a) if AbIS loop test failed: word not used
b) otherwise:
(low byte)
byte)
(low byte)
(high byte)
word[7] a) if AbIS loop test failed: word not used
b) otherwise: If a fault was detected during MPCC-PCUC
interface (concerning hardware or firmware or TDPC-PPCU
DUAM):
(low byte)
byte)
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d) PPCU diag phase 3
This phase tests the performance of the GbIC software and obtains the result of the
self-tests that are done by the GbIC software after it has been started by the PCUC.
00000010 means GBIC failure;
00010000 means QSPAN failure.
stored copy of last value written on UBEX register (low byte)
(high byte)
Source code line
DUAM (low byte)
(high byte)
(high byte)
PCUC (low byte);
(high byte)
DUAM (low byte)
(high byte)
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e) PPCU diag end phase
The only role of this phase is to put the PPCU in the off-line state. It does not contain
any diagnostic information.
(1) identier of source item where problem took place:
word[4] If a problem was detected by diagnostic test
DUAM (low byte);
byte)
PCUC (low byte);
(high byte)
(low byte)
(high byte)
DUAM (low byte);
byte)
(low byte)
byte)
(low byte)
(high byte)
word[7] If a fault was detected during MPCC-PCUC interface
(low byte)
byte)
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LEGEND
(1) Identifier of source item where problem occurred
1 DHXXDCCH
2 DHXXDCDE
3 DHXXDCEH
4 DHXXDCSA
5 DHXXDCSM
6 DHXXDCTH
7 DHXXDDDI
8 DHXXDDHD
9 DHXXGSUT
10 DHXXININ
11 DGHDXXDP
12 DHXXDDPU
(2) Error code description
NTW_outage_test: 0001h
TDPC_outage_test: 0002h
Loop_test: 00e3h (access to loopback reg.)
00e4h (NMI)
FW_diagnose_test: 00e2h (diagnosis failed)
008ah (firmware time out)
SW_load_test: 000ch (load failed)
0014h (file system problem)
Operating system problems: 000ah (mailbox creation failed, null DH answer)
Tasks interface problems: 000bh (PPxx DH time-out during load function)
Software start: 0080h (software nack answer) or 008ah (software
time out)
Forcing Out Of Service idle
status:
0081h (software nack answer) or 008ah (software
time out)
Alarm raising during card
access:
008ch (time-out expired in command sending)
00a0h (alarm detected during reading operation of
software answer)
Tab. 5.9 PPCU: Test-id Values
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5.4.14 PPXL Diagnostics (for BSC High Capacity)
The PPXL card is a peripheral processing board, introduced in the BSC to handle all
SS7 and LAPD links. A unique PPXL is able to handle up to 256 links: then one board
can handle all the LAPD (240) and SS7L (8) links. The redundancy approach chosen is
to spread signalling links on both boards having both in service. When both PPXLs are
in service, each of them brings half of the configured LAPDs and SS7Ls.
The PPXL is realised with a standard Intel Pentium processor architecture. The host
processor used is the Mobile PentiumIII feature on-die 256 kbyte L2 cache and the host
bus runs at 100Mhz. The equipment of Pentium III includes the Intel 440BX AGPset,
which consists of the 82443BX Host Bridge Controller (BX) and the 82371AB PCI ISA
IDE Accelerator (PIIX4E). At On the PCI bus is located an HDLC controller (from
CONEXANT) that handles L2 protocol handling manages the LAPD/SS7 links. The
HDLC controller has the capability to handle up to 256 physical channels; up to 240
LAPD can be handled (e.g. 78 channels at 64 kbit/s and 162 channels at 16 kbit/s + 8
SS7 channels). The same bandwidth can be used with a smaller number of channels
but at higher bit rate; the super-channeling is supported in hardware by the HDLC
controller itself, for the LAPD/SS7 application the device is always connected to the
SNAP.
From the MPCC point of view, the hardware/software interface is structured by several
register accessible by PPXL Device Drivers.
Control points:
Active TDPC selection
Active SNAP/PLLH selection
Connection/Disconnection of PCM output from SNAP
Alarm reset
CPU reset
Sense points:
Timing alarm (missing clock from PLLH)
Address parity alarm on UBEX bus
Data parity alarm on UBEX bus
Wrong parity from SNAP
The rest of the 256 byte MPCC DUAM is used for message exchange between the
MPCC software and the PPXL software.
PPXL diagnose has been implemented with 4 working phases (see paragraph 5.4.2).
a) PPXL diag start phase
This phase resets the card checking the result asks the System Download Task to
load it, then verifies that the software answers correctly, check the alarm presence.
Word
number
Byte Possible
values
Meaning
word[0] Item
word[1] Line
word[2] Error Code
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b) PPXL diag phase 1
MPCC-PPXU DUAM (the test reads and rewrites each MPCC duam location to
x memory parity errors).
TDPC-PPXU DUAM(the test reads and rewrites each TDPC duamlocation to x
memory parity errors)
c) PPXL diag phase 2
FPGA loopback
MUSYCC tests
MUSYCC loop
MUSYCC alarms
word[3] Register 4&7 Dump.
If ErrorCode=0xC, this word contains the
error_cause, defined in sdbaincl (CSD_)
word[4] Register 8&11 Dump
Word
number
Byte Possible
values
Meaning
word
number
byte possible
values
meaning
word[0] low 0x03 MPCC DUAM check failure(writing/reading)
word[0] high
word[0] low 0x05 NMI during MPCC DUAM access
word[0] high bit mask:
0001 0000
0010 0000
0100 0000
1000 0000
Source of NMI:
Transmission conflicts towards SNAP
(DSP/MUSYCC)
Watch dog
Data parity error in read operation from DUAM
Parity error on PCI bus
word[0] low 0x04 TDPC DUAM check failure
word[0] high
word[0] low 0x07 Lack of PCU power (1.8 V)
word[0] high
word[0] low 0x06 NMI during TDPC DUAM access
word[0] high bit mask:
0001 0000
0000 0010
0000 0100
0000 1000
Data parity alarm on bits 0-7(reading operation)
Data parity alarm on bits 8-15
word[1...7] low/high not used not used
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d) PPXL diag end phase
The only role of this phase is to put the PPXL in service.
5.4.15 PPXU Diagnostics
The PPXU card is a peripheral processing board, introduced in the BSC high capacity
to allow the GPRS feature. Its basic functions are channel resource allocation and
protocol conversion between Abis and Gb interface. The redundancy scheme chosen is
load balancing in order to have all boards in service.The perform-test command is
addressed to a PPXU x, where x is the absolute number of PPXU.
The PPXU board is composed of several parts:
The PCUC (PCU Control Processor): it is realised with a standard Intel Pentium
processor architecture. The host processor used is the Mobile PentiumIII running at
either 400 MHz or 500 MHz, depending on the equipped component. The Mobile
Pentium III feature on-die 256 Kbyte L2 cache and the host bus runs at 100 MHz.
The equipment of PentiumIII includes the Intel 440BX AGPset, which consists of the
82443BX Host Bridge Controller (BX) and the 82371AB PCI ISA IDE Accelerator
(PIIX4E). At On the PCI bus is located an HDLC controller that has the capability to
handle up to 256 physical channels but, in GPRS application, a reduced number is
required (max 127; 64 to Abis interface and 63 to Gb interface for each board). The
same bandwidth can be used with a smaller number of channels but at higher bit
rate; the super-channeling is supported in hardware by the HDLC controller itself.
The device, for the GPRS application, is connected to the SNAP.
The ABIC (Abis interface controller): it is composed of 4 DSPs TMS320C5410 from
Texas Instruments, each one with its three integrated serial communication control-
lers. They internally run with a 100 MHz clock, and work together exchanging
packets on Abis. They operate via a DSP controller (PLD UART - Universal Asyn-
chronous Receiver/Transceiver) on ISA bus that on its turn, through the PIIX4
Bridge, can communicate with the PCI bus.
External Telephony and Administration Bus interface: it includes 2 Dual Port RAMs
one with size 8 Kb by 18 bits for data exchange with TDPC, and the other with size
256 bytes by 9 bits for data exchange with MPCC.
word
number
byte possible
values
meaning
word[0] low 0x01 Failure of FPGA loopback access test
word[0] high
word[0] low 0x08 MUSYCC initialization problem
word[0] high S
word[0] low 0x09 Problem during MUSYCCinternal loop
(pattern sending/receiving)
word[0] high
word[0] low 0x0A Presence of SERR alarm
(address parity error) on MUSYCC
word[0] high
word[1...7] low/high not used not used
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The integrated PCI bus interface: it is clocked at 33.3 or 30 MHz and allows commu-
nication among PIIX4, QSpan and MTXC
PPXU diagnose has been implemented with 5 working phases (see paragraph 5.4.2).
a) PPXU diag start phase
This phase resets the card checking the result asks the System Download Task to
load it, then verifies that the software answers correctly, check the alarm presence.
b) PPXU diag phase 1
CPU power (the test veries 1.8 V voltage)
MPCC-PPXU DUAM (the test reads and rewrites each MPCC duam location to
x memory parity errors).
TDPC-PPXU DUAM(the test reads and rewrites each TDPC duamlocation to x
memory parity errors).
Word
number
Byte Possible
values
Meaning
word[0] Item
word[1] Line
word[2] Error Code
word[3] Register 4&7 Dump.
If ErrorCode=0xC, this word contains the
error_cause, defined in sdbaincl (CSD_)
Word
number
Byte Possible
values
Meaning
0 low 0x07 CPU power lack (1.8V)
0 high -
0 low 0x03 MPCC DUAM check failure (writing/reading)
0 high -
0 low 0x05 NMI during MPCC DUAM access
0 high bit mask:
0001 0000
0010 0000
0100 0000
1000 0000
sources of NMI
Transmission conflicts towards SNAP
(DSP/MUSYCC)
Watch Dog
data parity error in read operation from DUAM
parity error on PCI Bus
0 low 0x04 TDPC DUAM check failure
0 high -
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possible specic problems (rst add info in test report); see Tab. 5.10.
c) PPXU diag phase 2
FPGA loopback
MUSYCC tests
MUSYCC loop
MUSYCC alarms
d) PPXU diag phase 3
MUNICH internal loop
MUNICH - DSP loop
MUNICH - FPGA loop
0 low 0x06 NMI during TDPC DUAM access
0 high bit mask:
0000 0001
0000 0010
0000 0100
0000 1000
Data parity alarm on bits 0-7 (reading operation)
Data parity alarm on bits 8-15 (reading)
1..7 low /
high
Not used Not used
Word
number
Byte Possible
values
Meaning
Word
number
Byte Possible
values
Meaning
0 low 0x01 Failure pf FPGA loopback access test
0 high -
0 low 0x08 MUSYCC Initialization problem
0 high -
0 low 0x09 Problem during MUSYCC internal loop
(patterns sending/receiving)
0 high -
0 low 0x0A Presence of SERR alarm (address parity error)
on MUSYCC
0 high -
1..7 low /
high
Not used Not used
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Maintenance
MMN:BSC
Word
number
Byte Possible values Meaning
0 low 0x20 MUNICH Initialization problem during
internal MUNICH loop or MUNICH-DSP
loop
1 high/
low
Range 0x000 -
0xFFFF
Number of source code line
2 low 0x00
0x01
0x02
0x03
Uncorrect input argument of MUNICH Init
routine
MUNICH reset failure
Port configuration failure
Channel Init failure
0 low 0x23 Failure during MUNICH internal loop
test
0 high - Number of faulted channels
1 low - -
1 high - -
2 low - -
2 l high - -
3 low - -
3 high - -
4 low Bit mask 0000 0001--> problem on channel 0
0000 0010 --> problem on channel 1
................................
4 high Bit mask 0000 0001--> problem on channel 8
................................
5 low Bit mask 0000 0001--> problem on channel 16
0000 0100 --> problem on channelel 18
................................
5 high Bit mask 0000 0001--> problem on channel 24
................................
6 low bit mask 0000 0001--> problem on channel 32
................................
264 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
6 high bit mask 0000 0001--> problem on channel 40
................................
7 low bit mask 0000 0001--> problem on channel 48
................................
7 high bit mask 0000 0001--> problem on channel 56
................................
NOTE:
Other information (if any) about channels
problems are reported inside System Info
report issued by PPXU Device Handler
on MPCC (info id=... and originator=...)
0 low 0x25 Failure of DSP setting to MUNICH-DSP
loop mode (case a) or: failure of
MUNICH-DSP loop test (case b)
0 high Case a:
2->DSP
address=0x8002
4->DSP
address=0x8004
Case a: Location where an uncorrect
value was read
Case b: 0xFF (meaningless)
1 High/
low
Range 0x000xFFFF Cases a, b: number of source code line
2 low Case a: bit mask
0000 0001 DSP-0
0000 0010 DSP-1
0000 0100 DSP-2
0000 1000 DSP-3
Case b:
range 1-256
Case a: Faulty DSP during loop setting
Case b: number of faulty channels
2 high not used not used
Word
number
A30808-X3247-L220-2-7620 265
Maintenance
MMN:BSC
3 low bit mask:
0000 0001 AbIC-0
0000 0010 AbIC-1
0000 0100 AbIC-2
0000 1000 AbIC-3
0001 0000 AbIC-4
0010 0000 AbIC-5
0100 0000 AbIC-6
1000 0000 AbIC-7
Case a: Faulty AbIC (DSP cores) during
loop setting
Case b: not used
3 high bit mask:
0000 0001 AbIC-8
0000 0010 AbIC-9
0000 0100 AbIC-10
0000 1000 AbIC-11
0001 0000 AbIC-12
0010 0000 AbIC-13
0100 0000 AbIC-14
1000 0000 AbIC-15
4 high/
low
Case a: value read on AbIC-0
Case b: bit mask of faulty channels (0-15)
5 high/
low
Case b: bit mask of faulty channels (16-
31)
6 high/
low
47)
7 high/
low
63)
NOTE:
Report issued by PPXU Device Handler
0 low 0x26 Failure of DSP setting to MUNICH-
FPGA loop mode (case a) or:
failure of MUNICH-FPGA loop test
(case b)
0 high Case a:
2--> DSP
address=0x8002
4--> DSP
address=0x8004
Case a: Location where an uncorrect
value was read
Case b: 0xFF (meaningless)
1 low /
high
Range 0x00-0xFFF Cases a,b:Number of souce code line
Word
number
266 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
2 low Case a:
Bit mask:
0000 0001 DSP-0
0000 0010 DSP-1
0000 0100 DSP-2
0000 1000 DSP-3
Case b:
range 1-256
Case a: Faulty DSP during loop setting
Case b: number of fauty channels
2 high not used not used
3 low Bit mask:
0000 0001 AbIC-0
0000 0010 AbIC-1
0000 0100 AbIC-2
0000 1000 AbIC-3
0001 0000 AbIC-4
0010 0000 AbIC-5
0100 0000 AbIC-6
1000 0000 AbIC-7
loop setting
Case b: not used
3 high Bit mask:
0000 0001 AbIC-8
0000 0010 AbIC-9
0000 0100 AbIC-10
0000 1000 AbIC-11
0001 0000 AbIC-12
0010 0000 AbIC-13
0100 0000 AbIC-14
1000 0000 AbIC-15
loop setting
Case b: not used
4 low /
high
Case a: Value read on AbIC-0
Case b: bit mask of faulty channels (0-15)
5 low /
high
31)
6 low /
high
47)
7 low /
high
63)
NOTE:
Report issued by PPXU Device Handler
Word
number
A30808-X3247-L220-2-7620 267
Maintenance
MMN:BSC
e) PPXU diag end phase
The only role of this phase is to put the PPXU in service.
268 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
5.4.16 CPEX Diagnostics
The CPEX card replaces DK40 (LEDalarmpanel handling board) in the BSC_120 chan-
nels rack. The disk functionality is on the MPCC board since BR 6.0.
The CPEX (Control Panel and External alarms device) is redundant 1+1.
The diagnostic has two phases, which performs respectively the alarm-forcing test for
all fault detectors of the CPEX card, fan and the ENVA. Beside thiese, the start phase
(i.e. the phase 0)tests the accessibility of the CPEX and the absence of card alarms.
a) CPEX diag start phase
This phase checks the card presence and the loop back register and force the CPEX
card alarm registers.
LEGEND
(1) Possible specific problems
PPXUAGDC_NMI_MPCC_DUAM_ERR 0x05 (NMI during access to DUAM)
PPXUAGDC_MPCC_DUAM_ERR 0x03 (error in writing/reading DUAM)
PPXUAGDC_NMI_TDPC_DUAM_ERR_
DUAM
0x06 (NMI during access to TDPC-PPXU)
PPXUAGDC_TDPC_DUAM_ERR 0x04 (error in writing/reading DUAM)
PPXUAGDC_FPGA_LOOPB_ERR 0x01
PPXUAGDC_MUSYCC_LOOP_ERR 0x09
PPXUAGDC_MUSYCC_ALARM_ERR 0x0A
PPXUAGDC_MUNICH_INIT_ERR 0x20 (MUNICH Init problems)
PPXUAGDC_MUNICH_DIAG_ERR 0x23 (internal loop problems)
PPXUAGDC_MUNICH_INIT_ERR 0x20
PPXUAGDC_DSP_LOOP_ERR 0x25 (loop problems)
PPXUAGDC_DSP_FPGA_LOOP_ERR 0x26
PPXUAGDC_CPU_POWER_ERR 0X07 (CPU power lack)
PPXUAGDC_MUSYCC_INT_ERR 0x08 (MUSYCC Init problems)
Tab. 5.10 PPXU: Test-id Values
A30808-X3247-L220-2-7620 269
Maintenance
MMN:BSC
b) CPEX diag phase 1 (WP1)
Fan alarm register test
c) CPEX diag phase 2 (WP2)
ANVA alarm register.
Word
number
word[0] 0001h CPEX access test
word[1] axxxxxxx a=0
a=1
loop test failed
Card_Alarm_Regis
ter
word[2] abcdefgh a=data parity alarm 0-7 1=on
b=fixed to 0
c=address parity alarm lines 0-7 1=on
d=address parity alarm lines 8-15 1=on
e=global alarm of the MPCC 0=on
f=data parity alarm 8-15 1=on
g=CLK 2m alarm 1=on
h=voltage sense monitor 0=on
this word is mean-
ingful only if word 0
is 1
Word
number
word[0] 0002h Fan_Force_Alarm
_Test
word[1] abxcxxxxx a=major fan alarm
b=minor fan alarm
c=fan box presence
lFan_Alarm_
Register dump
b=fixed to 0
g=CLK 2m alarm 1=on
this word is
meaningful only if
word 0 is 1
270 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
d) CPEX diag end phase
Word
number
word[0] 0003h ENVA_
Force_
Alarm_
Test
word[1] abcdefghijklmnop a=expansion alarm 0
b=expansion alarm 1
c=expansion alarm 2
d=expansion alarm 3
e=expansion alarm 4
f=expansion alarm 5
g=expansion alarm 6
h=expansion alarm 7
i=expansion alarm 8
j=expansion alarm 9
k=expansion alarm 10
l=expansion alarm 11
l=expansion alarm 12
m=expansion alarm 13
n=expansion alarm14
o=expansion alarm 15
lENVA_
Alarm_
Register
dump
b=fixed to 0
g=CLK 2m alarm 1=on
this word is
meaningful
only if word
0 is 1
A30808-X3247-L220-2-7620 271
Maintenance
MMN:BSC
LEGEND
(1) Possible specific problems
PPXUAGDC_NMI_MPCC_DU
AM_ERR
0x05 (NMI during access to DUAM)
PPXUAGDC_MPCC_DUAM_E
RR
0x03 (error in writing/reading DUAM)
PPXUAGDC_NMI_TDPC_DU
AM_ERR_DUAM
0x06 (NMI during access to TDPC-PPXU)
PPXUAGDC_TDPC_DUAM_E
RR
0x04 (error in writing/reading DUAM)
PPXUAGDC_FPGA_LOOPB_
ERR
0x01
PPXUAGDC_MUSYCC_LOOP
_ERR
0x09
PPXUAGDC_MUSYCC_ALAR
M_ERR
0x0A
PPXUAGDC_MUNICH_INIT_E
RR
0x20 (MUNICH Init problems)
PPXUAGDC_MUNICH_DIAG_
ERR
0x23 (internal loop problems)
PPXUAGDC_MUNICH_INIT_E
RR
0x20
PPXUAGDC_DSP_LOOP_ER
R
0x25 (loop problems)
PPXUAGDC_DSP_FPGA_LO
OP_ERR
0x26
PPXUAGDC_CPU_POWER_E
RR
0X07 (CPU power lack)
PPXUAGDC_MUSYCC_INT_E
RR
0x08 (MUSYCC Init problems)
Tab. 5.11 PPXU: Test-id Values
272 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
5.5 NACK CAUSES
- unsuccessful wrong meid the objects addressed are not correct.
- object not equipped the MOT is not created.
- other tests running maximumnumber of tests are already queued
or running. No more tests are acceptable.
- MOTS_NOT_LOCKED the MOT is not locked.
The following are the nack causes directly reported by DH:
- T_Resource_Currently_Busy
- T_Invalid_Command_Parms
- Unsuccessful_Ntv_Outage
- Unsuccessful_Object_Notequipped
- Unsuccessful_Invalid_Status
- Unsuccessful_Power_Off
- Unsuccessful_Other_Copy_Powered_Down
A30808-X3247-L220-2-7620 273
Maintenance
MMN:BSC
6 Abbreviations
ACTM ACT for the Base Rack/Shelter
BSS Base Station System
BTS Base Transceiver Station ,
BTSE Base Transceiver Station Equipment
CPEX Control Panel and External alarms device
CPEX Control Panel Expansion
DH Device Handler
DISK physic disk
DK40 Led Alarm Panel Control
DUKIT Duplex Combiner Kit
EMI Electro Magnetic Interference
ESD Electrostatic Sensitive Device
GSM Global Systemfor Mobile Communications
HMOI Hardware Managed Object
HW Hard Ware
HW Hardware
ITMN Installation & Test Manual
IXLT Interface X.25 and Local Terminal Interface
,
LAPD Link Access Procedure on the D-Channel
LED Light Emitting Diode
LICD Line Card
LICDS Line Card Spare
LMT Local Maintenance Terminal
MEMT Memory of Telephone Processor
MOT Managed Object Under Test
MPCC Main Processor Control Circuit
N No
nob-RIU Not On Board Remote Inventory Unit , , , ,
, , , , , , , , , , , ,
NTW Network
ob_RIU On Board Remote Inventory Unit
OMC Operation and Maintenance Center ,
OS Operating System
PCM Pulse Code Modulation
PLLH Phase Locked Loop Oscillator High Perfor-
mance
PLMN Public Land Mobile Network
PPCC Peripheral Processor Common Channel
PPCU Peripheral packet Control Unit
274 A30808-X3247-L220-2-7620
MMN:BSC Maintenance
PPLD Peripheral Processor LAPD
PPXL Peripheral processor LAPD/SS7
PPXU Peripheral processor used at PPCU evolu-
tion
PPXX Peripheral Processor (general purpose)
PWRD Power Distributor
QTLP Quad Trunk Line Peripheral
RC Radio Commander
SBS Siemens Base Station
SN16 Switching Network at 16 Kbit/s
SNAPSwitching Network Advanced Performance
SS7 CCITT Common Channel Signalling No.7
STLP Super Trunk Line Peripheral
SW Software
SYNC Synchronization Source
SYNE External Synchronization Source
TAC Technical Assistance Center
TDPC Telephony and Distributor Processor Circuit
TRAU Transcoder and Rate Adaption Unit
UBEX Universal Bus Extender
Y Yes

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