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NX3 High Performance

Analog Switches
Hello and welcome to the NXP Semiconductor training module for High
Performance Analog Switches.
Introduction
Purpose:
To introduce NXPs high performance analog switch offering.
Objectives
Review analog switches configurations & critical electrical parameters.
Review NXP portfolio & nomenclature.
Review package offering & trends.
Review of 3 simple application examples.
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The purpose of this module is to introduce you to NXPs analog switch
offering.
It will first cover analog switch basics: what are the different types of
switches out there, what are the critical parameters and what they mean
for a particular application.
In a second time, we will go over the NXP analog switch portfolio and
nomenclature.
Then we will look at the latest packaging trends in leadless packages.
We will conclude with 3 simple applications examples using low ohmic
analog switches.
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3
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Switches Configuration by Function
SPDT
SPST
(NO)
SPST
(NC)
SPST 2x
(NC)
SPST 2x
(NO)
66
dual 66
384
dual 384
3157
4684
2267
4357
DPDT
DPDT
2x
dual 2467
53
SPDT
Enable
SPDT
2x
2467
SP3T
Enable
Analog switches are typically offered in one of the following configurations:
Single-pole single-throw, single-pole multiple-throw, and multiple-pole
multiple-throw, or multiplexers.
The number of poles denotes the number of common terminals (or
movable contacts) while the number of throws indicates the number of
alternate terminals the common side can connect to.
The switches can be available in single, dual, or multiple switches (usually
an even number) per package.
The switches can be activated independently or all at the same time.
The NXP high performance analog switch portfolio carries devices in each
of these configurations.
The NX3 family is offered in all standard configurations SPST, SPDTin
single dual, quad
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4
SPDT
SPST
(NO)
SPST
(NC)
SPST 2x
(NC)
SPST 2x
(NO)
NX3L1G66
NX3L2G66
NX3L1G384
NX3L2G384
NX3L1G3157
NX3L4684
NX3L2267
NX3L4357
DPDT
DPDT
2x
NX3L2467
NX3L1G53
SPDT
Enable
SPDT
2x
NX3L2467
SP3T
Enable
NX3 Family Switches by Function
The following chart adds the high performance analog switches part
numbers corresponding to each function.
5
5
The T (translator/level shifter) function
included in many switches
3.6 V
ASIC
1.8 V 3.6 V
1T34
ASIC NX3L1G3157 74AUP1T34
The T feature:
Reduces part count
Saves space
Lowers cost
Simplifies overall design
ASIC
ASIC
1.8 V 3.6 V
T
NX3L1T3157
In some applications, analog switches are at the interface between a low
voltage ASIC and a higher supply voltage component. In order for the
switch to be activated properly, a voltage translator (or level shifter) is
typically used on the select pin to insure the minimum activation threshold
is met.
NXP analog switches offer a complete family of devices that integrate the
translator function, thus saving part count, PCB space, and lowering
overall system cost.
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SPDT
SPST
(NO)
SPST
(NC)
SPST 2x
(NC)
SPST 2x
(NO)
NX3L1G66
NX3L2G66
NX3L1G384
NX3L2G384
NX3L1G3157
NX3L4684
NX3L2267
NX3L4357
DPDT
DPDT
2x
NX3L2467
NX3L1G53
SPDT
Enable
NX3L1T66 NX3L1T384 NX3L1T3157 NX3L1T53
NX3L2T66 NX3L2T384
SPDT
2x
SP3T
Enable
NX3L2467
NX3 Family Switches by Function
The T in the part number distinguishes analog switches with the
integrated translator function. Some part numbers are highlighted in this
slide for the low ohmic NX3 family of switches. The G parts do not
include the translator function.
Critical Parameters what they mean
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Switch configuration (SPST, SPDT, DPDT) pick the right configuration
and control pin option for the application.
Supply voltage (V
CC
) is the biasing voltage required to power the switch.
Lower V
CC
means less head room to pass a signal. Some applications like
audio, may require negative voltage capability to maintain signal integrity.
ON resistance (R
ON
) is the resistance from input to output when the switch is
closed. The lower the R
ON
, the less the signal passing through the switch will
be attenuated. R
ON
will vary with voltage, temperature, and load current. A
measure of this variation is delta R
ON
(R
ON
). Selecting a low R
ON
device will
minimize signal distortion.
Bandwidth (f
-3dB
) is the frequency at which the signal is attenuated by -3 dB
from its dc level. It represents the upper cutoff frequency of the switch. The
higher the bandwidth, the higher the data rate it can support and the larger the
amount of information it can handle.
Particular attention should be given to the following parameters when
selecting a switch.
Switch configuration this is the first step in selecting a switch. Choose
the right configuration (SPST, SPDT, DPDT) for the application. Insure
to use the correct control pin option to toggle switches independently or all
together.
Supply voltage (V
CC
). is the biasing voltage required to power up the
switch. A lower V
CC
means there is less head room to pass a signal.
Some applications like audio, may require negative voltage capability to
maintain signal integrity as some audio signals have a negative
component.
ON Resistance (R
ON
) is the resistance from input to output when the
switch is closed. The lower the line resistance, the less the signal passing
through the switch will be attenuated. R
ON
will vary with voltage,
temperature, and load current. A measure of this variation is delta R
ON
.
Selecting a low R
ON
device will minimize signal distortion.
Bandwidth (f
-3dB
) is the frequency at which the signal is attenuated by -3
dB from its DC level. In other words, it represents the upper cutoff
frequency of the switch. It is directly related to data rate. The higher the
bandwidth, the higher the data rate it can support and the larger the
amount of information it can handle. This is particularly important when
dealing with fast signal applications like video or USB. A good rule of
thumb is to select a switch with 3 times the bandwidth of the signal
frequency to maintain good signal integrity.
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Critical Parameters what they mean (continued)
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ON state capacitance (C
S(ON)
) is the equivalent capacitance of the switch
while closed. This capacitive loading of the line will affect overall bandwidth and
drive current. A lower C
S(ON)
helps minimize negative effects to the signal.
Input voltage range (V
I
) is the maximum voltage that can be applied at the
control pin, that is between the control pin to ground.
Switch voltage (V
SW
) is the maximum voltage that can be applied at an input
pin with respect to ground.
Enable / disable time (t
en
/ t
dis
) is the take it takes for the switch to change
state from the time the select pin has been triggered.
Select/control pin threshold levels (TTL vs. CMOS) - Switches can be
triggered at different threshold levels. TTL trigger levels are typically at 0.7
and1.4V. CMOS levels are at 30 and 70% of the supply voltage.
Package size - multiple packages and pin configurations available. Select the
proper package option to ease PCB layout.
ON state capacitance (C
S(ON)
) is the equivalent capacitance of the
switch while closed. The capacitance will induce capacitive loading on
the line and affect overall bandwidth and drive current. A lower C
S(ON)
is
typically desired to minimize negative effects to the signal.
Input voltage range (V
I
) is the maximum voltage that can be applied at
the control pin, that is between the control pin to ground. In some
situation, an external component may be required to level shift the input
to the right voltage level if the switch cannot meet the proper input level
for the application.
Switch voltage (V
SW
) is the maximum voltage that can be applied at the
input pin with respect to ground.
Enable / disable time (t
en
/ t
dis
) is the time it takes for the switch to
change state from the time the select pin has been triggered.
Select or control pin threshold level (TTL vs. CMOS). Switches can be
triggered at different threshold levels. As an approximation, TTL
threshold levels are at 0.7 and 1.4V. CMOS levels are typically at 30%
and 70% of the supply voltage. One has to be careful to select the right
switch to guarantee the select signal used can correctly trigger the
switch.
Package selection is important. There are multiple package and pin
configurations available. Be sure to select the proper package option to
ease the layout of the PCB.
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NX3 Offering Summary Table
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No / NC = switch is normally opened or normally closed
NXP has already introduced over 47 part numbers in the low ohmic NX3
analog switch family. These switches target applications where low ON
resistance is critical. They exhibit a resistance of less than 1 Ohm for the
L series, and less than 0.5 Ohm for the V series. They also offer -90
dB isolation and crosstalk for superior signal integrity, and a low current
consumption for higher power savings. They are available in the Picogate
and the tiny leadless MicroPak packages, 0.35 mm pitch GF and GS, and
the newest 0.3 mm pitch GN package. The table in this slide summarizes
the critical parameters for each switch type of this family. This first portion
is for single switches in SPDT and SPST configurations.
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This is the continuation of the selection table showing the multiple
switches in SPST, SPDT, DPDT, SP3T configurations.
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NX3Lxxx Switches Nomenclature
This table summarizes the nomenclature for the NX3 family of switches,
easing the selection process. The first 2 letters indicate the switch family.
The 3
rd
digit represent the supply voltage capability of the device. A NX3
device for example is rated for 3V. A NX5 device will be rated for 5V
applications. The on resistance, the 4
th
digit, is denoted by an C, L, or V.
A C for greater than 1 ohm resistance, L for less than 1 ohm, and V for
less than 0.5 ohm. The 5
th
character represent the number of switches
integrated in the device. The next letter indicate if the translation function
is integrated on the select pin. A T meaning it is integrated, a G meaning
there is not translation on the select pin. The next 4 digits indicate the
function type. If the devices integrates a special function, such as shunt
resistors, negative swing or an enable pin, it will be indicated in this
section. Finally the last 2 letters indicate the package type. So an
NX3L1G3157GW is a Single SPDT analog switch with 3 volt V
CC
capability, 1 ohm or lower R
ON
, in a SOT886 package.
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5 pins 6 pins 8 pins 10 pins 16 pins 20 pins
0.65
mm
pitch
0.5
mm
pitch
0.4
mm
pitch
0.35
mm
pitch
0.3
mm
pitch
GF (SOT891)
1.0 x 1.0 x 0.5
GS (SOT1202)
1.0 x 1.0 x 0.35
GN (SOT1115)
1.0 x 0.90 x 0.35
GN (SOT1116)
1.0 x 1.20 x 0.35
GS (SOT1203)
1.0 x 1.35 x 0.35
GW (SOT353)
2.0 x 2.0 x 1.0
GW (SOT363)
2.0 x 2.0 x 1.0
GD (SOT996)
2.0 x 3.0 x 0.5
HR (SOT1039)
3.0 x 3.0 x 0.5
TK (SOT650)
3.0 x 3.0 x 0.85
BX (SOT1045)
2.5 x 4.5 x 0.5
GF(SOT1081)
1.7 x 1.0 x 0.4
GM (SOT1049)
2.0 x 1.55 x 0.5
GU (SOT1161)
1.8 x 2.6 x 0.5
GU (SOT1160)
1.4 x 1.8 x 0.5
GF (SOT1089)
1.0 x 1.35 x 0.5
NXP Common Switch Packages
GM - SOT886
1.0 x 1.6 x 0.5
Dimensions: Width x Length x Height
NXP carries one of the most extensive array of leadless packages on the
market and offers the lowest 0.3 mm pitch package solution currently
available for switches. Most switches are offered in 5, 6, 8, 10, 16, and 20
pin packages, with pitch ranging from 0.65 mm, all the way down to 0.3
mm. Most leaded and WCSP packages can be replaced by a leadless
package. There are multiple advantages in going to a leadless solution as
we will see in the next slide.
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Same die used as in larger packages, all functions available.
Operating temp range 40
o
C to 125
o
C.
Automotive qualified; JEDEC-STD-20C and Q100.
Pad spacing: 0.5, 0.4, 0.35 and 0.30 mm.
Lowest profile height (down to 0.35mm) packages.
Stronger contact with PCB compared to WCSP packages.
Drop-in replacement for most leaded/WCSP packages.
Pb-free, RoHS and Dark Green compliant.
Eliminated risk of whisker growth (NiPdAu).
Unlimited out of bag floor life at 30C/85% RH
Benefits of Leadless Packages
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Going to a leadless package allows to fit a larger die inside the same
footprint as a leaded package, therefore better performance can be
achieved for the same footprint. As an alternative, a smaller solution can
also be provided with the same electrical characteristics.
NXP leadless packages are characterized over an extended temperature
range of -40 to 125 degrees celcius, typical devices only go up to 85
degree celcius. This make them suitable for high stress environment such
as automotive and military applications. Reliability is also superior to
WCSP and leaded packages, offering better adhesion to the PCB and
being more impervious to chipping around the edges, these packages
yield far less failures during assembly and the overall life of the end
product. The leads are coated with Nickel Paladium Gold to prevent
oxidation. This allows an unlimited life time storage while out of the bag
and negligible loss of inventory. All leadless packages are Pb-free, RoHS
and Dark Green compliant.
Application Example #1
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This is an application for a multiband phone. The audio line is routed to 2
different baseband chipsets, depending on which network the phone is
operating. Using an analog switch avoids having to duplicate the audio
circuit, saving cost and pcb space. The low on resistance is critical to
good sound quality making the NX3 family a very good fit for this type of
application.
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Application Example #2
This is another audio application. Here the baseband has two different
audio sources. One from the handset itself, the other from a bluetooth
headset. The switch allows to route the audio signals to the internal
speaker and microphone, or to those of the headset. Again, this type of
setup allows part savings and PCB space savings.
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Test mode implementation
prior to product release
By using two SPDT switches,
GPIO1 and 2 can be extended to
test an external circuit, when
required, without modifying the
design.
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Application Example #3
This last application example shows an NX3L1T3157 analog switch used
to route data signals. It is common for electronic devices to require testing
at the assembly site to ensure proper functioning. This is done by
connecting externally through GPIO ports to activate a test routine. Prior
to the product being released to the market, the test ports need to be
disabled to insure that no wrong user operation could damage the device.
A simple way to do this is through the use of analog switches. While in
production, the switch allows connection from the GPIO connectors to the
internal test circuit. The switches are then toggled to prevent access,
while allowing reuse of the GPIOs for everydays use without risk to the
device.
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3
Brochure
Sample kit
17 http://ics.nxp.com/products/switches/
For further information on NXP analog switches, please visit our dedicated
website at http://ics.nxp.com/products/switches/
You can also download data sheets and order brochures and sample kits
online.
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Summary
While selecting analog switches, it is important to pay attention to the
key parameters (Configuration, R
ON
, V
CC
, f
-3dB
, C
S(ON)
, V
I
, package) to
meet the application requirements.
NXP provides high performance analog switches in all common
configurations tailored to answer specific application needs and ease
design effort.
The NX3 family of switches offers very low on resistance and is
available in a wide variety of leadless packages to meet todays
stringent board space constraints and reliability requirements.
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In Summary, while selecting analog switches, it is important to pay
attention to the key parameters such as, switch configuration, on
resistance, supply voltage, bandwidth, on resistance, input voltage and
package. This will insure the switch meets the applications requirements.
NXP provides high performance analog switches in all common
configurations tailored to answer specific application needs and ease
design effort.
The NX3 family of switches is offers very low on resistance and is
available in a wide variety of leadless packages to meet todays stringent
board space constraints and reliability requirements.
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