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BDA30603 - Heat Transfer: Conduction IV Tutorial

3-103C Does the (a) efficiency and (b) effectiveness of a fin increase or
decrease as the fin length is increased?
Answer: Increasing the length of a fin decreases its efficiency but increases
its effectiveness.
3-104C Two pin fins are identical, except that the diameter of one of them
is twice the diameter of the other. For which fin will the (a) fin effectiveness
and (b) fin efficiency be higher? Explain.
Answer: Increasing the diameter of a fin increases its efficiency but
decreases its effectiveness.
3-105C Two plate fins of constant rectangular cross section are identical,
except that the thickness of one of them is twice the thickness of the other. For
which fin will the (a) fin effectiveness and (b) fin efficiency be higher? Explain.
Answer: The thicker fin has higher efficiency; the thinner one has higher
effectiveness.
3-106C Two finned surfaces are identical, except that the convection heat
transfer coefficient of one of them is twice that of the other. For which fin will
the (a) fin effectiveness and (b) fin efficiency be higher? Explain.
Answer: The fin with the lower heat transfer coefficient has the higher
efficiency and the higher effectiveness.
3-119 Consider a stainless steel spoon (k = 15.1 W/m C) partially
immersed in boiling water at 95C in a kitchen at 25C. The handle of the spoon
has a cross section of 0.2 cm x 1.3 cm, and extends 18 cm in the air from the
free surface of the water. If the heat transfer coefficient at the exposed surfaces
of the spoon handle is 17 W/m
2
C, determine the surfaces of the temperature
difference across the exposed surface of the spoon handle. State your
assumptions.
Answer: The handle of a stainless steel spoon partially immersed in boiling
water extends 18 cm in the air from the free surface of the water. The
temperature difference across the exposed surface of the spoon handle is to be
determined.
Assumptions 1 The temperature of the submerged portion of the spoon is equal
to the water temperature. 2 The temperature in the spoon varies in the axial
direction only (along the spoon), T(x). 3 The heat transfer from the tip of the
spoon is negligible. 4 The heat transfer coefficient is constant and uniform over
the entire spoon surface. 5 The thermal properties of the spoon are constant. 6
The heat transfer coefficient accounts for the effect of radiation from the spoon.
Properties The thermal conductivity of the spoon is given to be k = 15.1
W/mC.
Analysis Noting that the cross-sectional area of the spoon is constant and
measuring x from the free surface of water, the variation of temperature along
the spoon can be expressed as

cosh
) ( cosh ) (
mL
x L m
T T
T x T
b


where
2
m 000026 . 0 ) m 002 . 0 m)( 013 . 0 (
m 03 . 0 ) m 002 . 0 m 013 . 0 ( 2
= =
= + =
c
A
p

1
2
2
m 04 . 36
) m 000026 . 0 )( C W/m. 1 . 15 (
) m 03 . 0 )( C . W/m 17 (

=


= =
c
kA
hp
m
Noting that x = L = 18 cm at the tip and substituting, the tip
temperature of the spoon is determined to be
h, T


D


T
b

1
.
3

c
m
0
.
2

c
m
L=18 cm

C 25.2 =
328
1
) 25 (95 + C 25 =
) 18 . 0 04 . 36 cosh(
0 cosh
) 25 (95 + C 25 =
cosh
) ( cosh
) ( ) (

+ =

mL
L L m
T T T L T
b

Therefore, the temperature difference across the exposed section of the spoon
handle is
C 69.8 = = = A C ) 2 . 25 95 (
tip
T T T
b

3-122 and 3-123 A 0.3 cm thick, 12 cm high, and 18 cm long circuit board
houses 80 closely spaced logic chips on one side, each dissipating 0.04 W. The
board is impregnated with copper fillings and has an effective thermal
conductivity of 20 W/m C. All the heat generated in the chips is conducted
across the circuit board and is dissipated from the back side of the board to a
medium at 40C, with a heat transfer coefficient of 50 W/m
2
C.
(a) Determine the temperatures on the two sides of the circuit board
(b) Now a 0.2 cm thick, 12 cm high, and 18 cm long aluminum plate (k = 237
W/m C) with 864 2 cm long aluminum pin fins of diameter 0.25 cm is
attached to the back side of the circuit board with a 0.02 cm thick epoxy
adhesive (k = 1.8 W/m C). Determine the new temperatures on the two
sides of the circuit board.
3-122 Answer: A circuit board houses 80 logic chips on one side,
dissipating 0.04 W each through the back side of the board to the surrounding
medium. The temperatures on the two sides of the circuit board are to be
determined for the cases of no fins and 864 aluminum pin fins on the back
surface.
Assumptions 1 Steady operating conditions exist. 2 The temperature in the
board and along the fins varies in one direction only (normal to the board). 3 All
the heat generated in the chips is conducted across the circuit board, and is
dissipated from the back side of the board. 4 Heat transfer from the fin tips is
negligible. 5 The heat transfer coefficient is constant and uniform over the
entire fin surface. 6 The thermal properties of the fins are constant. 7 The heat
transfer coefficient accounts for the effect of radiation from the fins.
Properties The thermal conductivities are given to be k = 30 W/mC for the
circuit board, k = 237 W/mC for the aluminum plate and fins, and k = 1.8
W/mC for the epoxy adhesive.
Analysis (a) The total rate of heat transfer dissipated by the chips is
W 2 . 3 W) 04 . 0 ( 80 = = Q


The individual resistances are

2
m 0216 . 0 m) 18 . 0 ( m) 12 . 0 ( = = A

C/W 89031 . 0
) m 0216 . 0 ( C) . W/m 52 (
1 1
C/W 00617 . 0
) m 0216 . 0 ( C) W/m. 30 (
m 004 . 0
2 2
conv
2
board
=

= =
=

= =
hA
R
kA
L
R

C/W 8965 . 0 89031 . 0 00617 . 0
conv board total
= + = + = R R R
The temperatures on the two sides of the circuit board are
C 42.9
C 42.9
~ = = =

=
~ = + = + =

C 85 . 42 C/W) 00617 . 0 )( W 2 . 3 ( C 87 . 42
C 87 . 42 C/W) 8965 . 0 )( W 2 . 3 ( C 40
board 1 2
board
2 1
total 2 1
total
2 1
R Q T T
R
T T
Q
R Q T T
R
T T
Q



Therefore, the board is nearly isothermal.
(b) Noting that the cross-sectional areas of the fins are constant, the efficiency
of the circular fins can be determined to be
2 cm
R
board
T
1

R
Aluminum
R
conv
T
2

R
epoxy
T
2


1 -
2
2
m 74 . 18
) m 0025 . 0 )( C W/m. 237 (
) C . W/m 52 ( 4 4
4 /
=


= = = =
kD
h
D k
D h
kA
hp
m
c
t
t

956 . 0
m 02 . 0 m 74 . 18
) m 02 . 0 m 74 . 18 tanh( tanh
1 -
-1
fin
=


= =
mL
mL
q
The fins can be assumed to be at base temperature provided that the fin area is
modified by multiplying it by 0.956. Then the various thermal resistances are
C/W 00514 . 0
) m 0216 . 0 ( C) W/m. 8 . 1 (
m 0002 . 0
2
epoxy
=

= =
kA
L
R
C/W 00039 . 0
) m 0216 . 0 ( C) W/m. 237 (
m 002 . 0
2
Al
=

= =
kA
L
R

2
unfinned finned fins with total,
2
2 2
unfinned
2
fin finned
m 1471 . 0 0174 . 0 1297 . 0
m 0174 . 0
4
) 0025 . 0 (
864 0216 . 0
4
864 0216 . 0
m 1297 . 0 m) 02 . 0 ( m) 0025 . 0 ( 864 956 . 0
= + = + =
= = =
= = =
A A A
D
A
DL n A
t t
t t q
C/W 1307 . 0
) m 1471 . 0 ( C) . W/m 52 (
1 1
2 2
fins with total,
conv
=

= =
hA
R
C/W 1424 . 0 1307 . 0 00039 . 0 00514 . 0 00617 . 0
conv aluminum epoxy board total
= + + + = + + + = R R R R R
Then the temperatures on the two sides of the circuit board becomes
C 40.4
C 40.5
~ = = =

=
~ = + = + =

44 . 40 C/W) 00617 . 0 )( W 2 . 3 ( C 46 . 40
C 40.46 C/W) 1424 . 0 )( W 2 . 3 ( C 40
board 1 2
board
2 1
total 2 1
total
2 1
R Q T T
R
T T
Q
R Q T T
R
T T
Q



3-123 Answer: A circuit board houses 80 logic chips on one side,
dissipating 0.04 W each through the back side of the board to the surrounding
medium. The temperatures on the two sides of the circuit board are to be
determined for the cases of no fins and 864 copper pin fins on the back surface.
Assumptions 1 Steady operating conditions exist. 2 The temperature in the
board and along the fins varies in one direction only (normal to the board). 3 All
the heat generated in the chips is conducted across the circuit board, and is
dissipated from the back side of the board. 4 Heat transfer from the fin tips is
negligible. 5 The heat transfer coefficient is constant and uniform over the
entire fin surface. 6 The thermal properties of the fins are constant. 7 The heat
transfer coefficient accounts for the effect of radiation from the fins.
Properties The thermal conductivities are given to be k = 20 W/mC for the
circuit board, k = 386 W/mC for the copper plate and fins, and k = 1.8 W/mC
for the epoxy adhesive.
Analysis (a) The total rate of heat transfer dissipated by the chips is
W 2 . 3 W) 04 . 0 ( 80 = = Q


The individual resistances are

2
m 0216 . 0 m) 18 . 0 ( m) 12 . 0 ( = = A

C/W 89031 . 0
) m 0216 . 0 ( C) . W/m 52 (
1 1
C/W 00617 . 0
) m 0216 . 0 ( C) W/m. 30 (
m 004 . 0
2 2
conv
2
board
=

= =
=

= =
hA
R
kA
L
R

C/W 8965 . 0 89031 . 0 00617 . 0
conv board total
= + = + = R R R
The temperatures on the two sides of the circuit board are
C 42.9
C 42.9
~ = = =

=
~ = + = + =

C 85 . 42 C/W) 00617 . 0 )( W 2 . 3 ( C 87 . 42
C 87 . 42 C/W) 8965 . 0 )( W 2 . 3 ( C 40
board 1 2
board
2 1
total 2 1
total
2 1
R Q T T
R
T T
Q
R Q T T
R
T T
Q



Therefore, the board is nearly isothermal.
2 cm
R
board
T
1

R
Aluminum
R
conv
T
2

R
epoxy
T
2

(b) Noting that the cross-sectional areas of the fins are constant, the efficiency
of the circular fins can be determined to be

1 -
2
2
m 74 . 18
) m 0025 . 0 )( C W/m. 237 (
) C . W/m 52 ( 4 4
4 /
=


= = = =
kD
h
D k
D h
kA
hp
m
c
t
t

956 . 0
m 02 . 0 m 74 . 18
) m 02 . 0 m 74 . 18 tanh( tanh
1 -
-1
fin
=


= =
mL
mL
q
The fins can be assumed to be at base temperature provided that the fin area is
modified by multiplying it by 0.956. Then the various thermal resistances are
C/W 00514 . 0
) m 0216 . 0 ( C) W/m. 8 . 1 (
m 0002 . 0
2
epoxy
=

= =
kA
L
R
C/W 00024 . 0
) m 0216 . 0 ( C) W/m. 386 (
m 002 . 0
2
Al
=

= =
kA
L
R

2
unfinned finned fins with total,
2
2 2
unfinned
2
fin finned
m 1471 . 0 0174 . 0 1297 . 0
m 0174 . 0
4
) 0025 . 0 (
864 0216 . 0
4
864 0216 . 0
m 1297 . 0 m) 02 . 0 ( m) 0025 . 0 ( 864 956 . 0
= + = + =
= = =
= = =
A A A
D
A
DL n A
t t
t t q
C/W 1307 . 0
) m 1471 . 0 ( C) . W/m 52 (
1 1
2 2
fins with total,
conv
=

= =
hA
R
C/W 1423 . 0 1307 . 0 00024 . 0 00514 . 0 00617 . 0
conv aluminum epoxy board total
= + + + = + + + = R R R R R
Then the temperatures on the two sides of the circuit board becomes
C 40.4
C 40.5
~ = = =

=
~ = + = + =

44 . 40 C/W) 00617 . 0 )( W 2 . 3 ( C 46 . 40
C 40.46 C/W) 1423 . 0 )( W 2 . 3 ( C 40
board 1 2
board
2 1
total 2 1
total
2 1
R Q T T
R
T T
Q
R Q T T
R
T T
Q

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