BGA Help

1)To ensure that both sides of the circuit board preheat zone without fusible explosive flammable
components,like:Plastic,Display,Phone camera,LED,Electrolytic capacitors.
2)Ensure that no combustible fusible explosive components in Infrared light can shine on the area, If
you can not avoid,Must use reflective paper keep out that. like:Plastic,Display,Phone
camera,LED,Electrolytic capacitors.

Apply solder paste to the IC before the desoldering,also you can early preheat then Apply solder
paste,Especially BGA package IC,should be early preheat then apply solder paste,the can make
solder paste penetrate into the bottom of the IC.
5. Wear heat protective gloves and goggles. Place the visor, good shading measures to protect the
eyes.
6. Turn on the Infrared light power,Set the temperature to about 280C.Make the appropriate
adjustments based on the size of the IC and circuit board. IC by infrared light irradiation will be rapidly
warming (generally 1 to 3 minutes) .

High Temperature Tape for BGA Rework

Inquire this products email us sales08@scotle.com
Products Description
High temperature tape can prevent arrounding components from
damage during reworking process.

Gold high temperature tape is thin and can experience temperature from
260-280 Celsius
The LF-4300-TF is a medium viscosity water-washable, no-clean flux designed for tin-
lead and lead-free alloys. LF-4300-TF is ideal for BGA, PGA and CSP sphere or pin
attachment. Can be dot dispensed or screen printed. LF-4300-TF can be used with either
tin-lead or lead-free alloys.
Package available:100g/bottle 30cc/cyringe 10cc/cyringeRMA-223-TPF(UV)
NC-559-ASM-UV(TPF)



3 Common Issues & 6 Common
Resolutions for BGA Rework
September 11, 2013Scotle BGA Rework Stationbga rework stations
Scotle BGA is one of the most challenging & professional procedures performed at assembly facilities
and Reballing depots. We often meet 3 common issues in bga reballing as below:
1. Excessive solder joint voiding
This is often due to incorrect solder paste selection or process parameters and can compromise the
integrity of the attachment and require additional rework, or result in rejection if the voiding is over
25%.
2. BGA Pad damage during the BGA removal process
This is sometimes an unavoidable hazard, and its made worse when conformal coatings and underfill
are used. Repairing damaged BGA pads is a time-consuming major headache worth avoiding.
3. Incorrect BGA orientation or joint bridging.
This means additional rework thermal cycles, and the increased risk of damage with each successive
application of heat.
Above problems are preventable. Let us read 6 common resolutions for them:
1. Inadequate Operator Training
We cant emphasize this enough! BGA rework technicians must be fully trained, their skills practiced
and developed. They must understand the materials theyre working with, the tools, the process
steps, and the interrelationship of all factors.
They must have the skills to evaluate and size up a BGA rework situation knowledgeably and
skillfully before commencing rework. And they must be able to recognize the subtle, tell-tale signs
indicating the process is off-track. I
2. Inappropriate Equipment Selection
Its an old saying, but true, you need the right tools to do the job properly. For BGA rework, the
equipment used must have the sophistication, the flexibility, and the capability to sustain a controlled,
predictable and repeatable process.
This includes closed-loop thermal sensing and control, the robustness to be able to deliver heat as
the process requires, and product handling capabilities for removal and replacement. Use the most
capable equipment available. This is not an area to cut corners. Actually, if you are a new starter,
select an easy operate and cheap BGA rework station is very important, such as achi ir6500, scotle
ir6000 , or scotle hr6000 will be a good choices.
3. Poor Profile Development
The BGA rework profile is as important as the assembly reflow profile, and in most cases duplicates it.
Without it, you wont achieve a successful and repeatable BGA rework process.
A poorly-developed thermal profile can result in damage to the assembly or BGA component requiring
additional rework cycles to the same site, and damage or reflow of adjacent components. Good
profiles must be carefully developed using correct thermocouple placement and analysis of the data
that they provide.
4. Improper Preparation
A professional painter knows that a good, lasting paint job is 90% preparation. Similarly, before the
first heat cycle is applied to a BGA rework site, theres a lot of preparation needed if the process is
going to be done right.
This includes baking out moisture from the BGA device and the board assembly to prevent pop-
corning and other problems and removal or protection of nearby heat sensitive components to avoid
damage or inadvertent reflow.
The right decisions need to be made in advance, such as whether or not to use solder paste,
choosing the right solder paste stencil, and choosing the right chemistries and alloys.
Theres plenty of preparation to do, and do right, before the actual rework cycle begins. This includes
an accurate assessment of such things as solder ball size; device and ball co-planarity; solder mask
damage and missing or contaminated pads at the PCB site.
5. Collateral Heat Damage
Reflow of adjacent component solder station connections results in oxidation, de-wetting, pad and
lead damage, wicking, starved joints, component damage, and other issues that can create a host of
new rework problems.
The technician must be constantly aware of the effect of heat not only on the target BGA device, but
also how it is affecting other components adjacent to it, on both sides of the assembly. The goal is to
minimize heat migration beyond the BGA component being reworked, and this is a function of a well-
developed profile and tight process control.
6. Insufficient Post-Placement Inspection
The world beneath a BGA component is a hidden mysterious place, but not from todays X-ray
inspection machines. Problems such as excessive voiding and poor placement or alignment are
immediately detectable with X-ray inspection. But just like a Radar operator, an X-ray system user
needs proper training to correctly interpret and understand the image that the machine is providing.
The complexity of the BGA component and the different variations in the X-ray image demand it if
maximum benefit is to be obtained from this significant and indispensable equipment investment.
Avoiding the 6 Most Common Mistakes in BGA rework is the best way to ensure a successful, robust,
and repeatable process with fewer headaches, higher yields, and reduced costs for a better bottom
line.