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INFRARED ASSISTED ELECTRONIC

INFRARED ASSISTED ELECTRONIC
INFRARED ASSISTED ELECTRONIC
INFRARED ASSISTED ELECTRONIC
 

097

SUBASSEMBLY REWORK

APPLICATION NOTE

Introduction

Advanced electronic and optoelectronic systems require high density, low cost assemblies in order to meet the present market demand. Rework of such assemblies has proven to be difficult using conven-tional hot air reflow due to the space limitation and potential lifting of the thin copper trace from the fine pitch device pads. Rework is particularly difficult for full area array devices using hot air reflow due to the non-uniform heating of the area.

INFRARED ASSISTED ELECTRONIC 097 SUBASSEMBLY REWORK APPLICATION NOTE <a href=Don Roy, Application Development Manager, EXFO Photonic Solutions Inc. Joyce Koo, Senior Research Engineer, EXFO Photonic Solutions Inc. Introduction Advanced electronic and optoelectronic systems require high density, low cost assemblies in order to meet the present market demand. Rework of such assemblies has proven to be difficult using conven-tional hot air reflow due to the space limitation and potential lifting of the thin copper trace from the fine pitch device pads. Rework is particularly difficult for full area array devices using hot air reflow due to the non-uniform heating of the area. An emergent rework technique is local area reflow using focused Infrared radiation (IR) assisted heating. The focused IR technology does not require compo-nent specific nozzles as is the case with hot air rework equipment. The IR method provides uniform heating via irradiation and conduction through the reworking device. The IR method provides local-ized heating area in the rework zone only and provides for the effective heating at the device location only for a short duration above the eutectic soldering temperature >195 °C (383 °F), meanwhile keeping the rest of the assembly at the pre-heat temperature <130 °C (266 °F). The EXFO Novacure IR Spot Curing System can provide such capability for small area rework at relatively modest cost. The unit can also be used for other applications such as IR assisted encapsulation gelation for chip encapsulation. This application note outlines the components rework methodology using an EXFO Novacure IR system. Figure 1: Preheating to 120 °C-130 °C (248 °F-266 °F) minimizes the potential for component damage. Rework Methodology The major advantage for using IR rework is to provide a source of localized heating. The focused IR from the Novacure IR equipment provides a spot of heat of approximately 1 cm (0.4 in) directly on top of the part requiring rework. Minimal heat is delivered outside this area that could effect the surrounding components. The spot size can be changed with adjustable optics or using masks to accommodate multiple sizes of components that require rework. The Novacure IR equipment is particularly suited for reworking HDI assemblies, such as the single sided assembly for automotive mounting parts (sensors, controllers), cell phone assemblies, Microelectronic Mechanical System (MEMS), multi- chip-module (MCM) and Optoelectronic assemblies. www.exfo.com Telecommunications Test and Measurement " id="pdf-obj-0-34" src="pdf-obj-0-34.jpg">

An emergent rework technique is local area reflow using focused Infrared radiation (IR) assisted heating. The focused IR technology does not require compo-nent specific nozzles as is the case with hot air rework equipment. The IR method provides uniform heating via irradiation and conduction through the reworking device. The IR method provides local-ized heating area in the rework zone only and provides for the effective heating at the device location only for a short duration above the eutectic soldering temperature >195 °C (383 °F), meanwhile keeping the rest of the assembly at the pre-heat temperature <130 °C (266 °F). The EXFO Novacure ® IR Spot Curing System can provide such capability for small area rework at relatively modest cost. The unit can also be used for other applications such as IR assisted encapsulation gelation for chip encapsulation. This application note outlines the components rework methodology using an EXFO Novacure IR system.

INFRARED ASSISTED ELECTRONIC 097 SUBASSEMBLY REWORK APPLICATION NOTE <a href=Don Roy, Application Development Manager, EXFO Photonic Solutions Inc. Joyce Koo, Senior Research Engineer, EXFO Photonic Solutions Inc. Introduction Advanced electronic and optoelectronic systems require high density, low cost assemblies in order to meet the present market demand. Rework of such assemblies has proven to be difficult using conven-tional hot air reflow due to the space limitation and potential lifting of the thin copper trace from the fine pitch device pads. Rework is particularly difficult for full area array devices using hot air reflow due to the non-uniform heating of the area. An emergent rework technique is local area reflow using focused Infrared radiation (IR) assisted heating. The focused IR technology does not require compo-nent specific nozzles as is the case with hot air rework equipment. The IR method provides uniform heating via irradiation and conduction through the reworking device. The IR method provides local-ized heating area in the rework zone only and provides for the effective heating at the device location only for a short duration above the eutectic soldering temperature >195 °C (383 °F), meanwhile keeping the rest of the assembly at the pre-heat temperature <130 °C (266 °F). The EXFO Novacure IR Spot Curing System can provide such capability for small area rework at relatively modest cost. The unit can also be used for other applications such as IR assisted encapsulation gelation for chip encapsulation. This application note outlines the components rework methodology using an EXFO Novacure IR system. Figure 1: Preheating to 120 °C-130 °C (248 °F-266 °F) minimizes the potential for component damage. Rework Methodology The major advantage for using IR rework is to provide a source of localized heating. The focused IR from the Novacure IR equipment provides a spot of heat of approximately 1 cm (0.4 in) directly on top of the part requiring rework. Minimal heat is delivered outside this area that could effect the surrounding components. The spot size can be changed with adjustable optics or using masks to accommodate multiple sizes of components that require rework. The Novacure IR equipment is particularly suited for reworking HDI assemblies, such as the single sided assembly for automotive mounting parts (sensors, controllers), cell phone assemblies, Microelectronic Mechanical System (MEMS), multi- chip-module (MCM) and Optoelectronic assemblies. www.exfo.com Telecommunications Test and Measurement " id="pdf-obj-0-40" src="pdf-obj-0-40.jpg">

Figure 1: Preheating to 120 °C-130 °C (248 °F-266 °F) minimizes the potential for component damage.

Rework Methodology

The major advantage for using IR rework is to provide a source of localized heating. The focused IR from the Novacure IR equipment provides a spot of heat of approximately 1 cm (0.4 in) directly on top of the part requiring rework. Minimal heat is delivered outside this area that could effect the surrounding components. The spot size can be changed with adjustable optics or using masks to accommodate multiple sizes of components that require rework. The Novacure IR equipment is particularly suited for reworking HDI assemblies, such as the single sided assembly for automotive mounting parts (sensors, controllers), cell phone assemblies, Microelectronic Mechanical System (MEMS), multi- chip-module (MCM) and Optoelectronic assemblies.

www.exfo.com

Telecommunications Test and Measurement

INFRARED ASSISTED ELECTRONIC 097 SUBASSEMBLY REWORK APPLICATION NOTE <a href=Don Roy, Application Development Manager, EXFO Photonic Solutions Inc. Joyce Koo, Senior Research Engineer, EXFO Photonic Solutions Inc. Introduction Advanced electronic and optoelectronic systems require high density, low cost assemblies in order to meet the present market demand. Rework of such assemblies has proven to be difficult using conven-tional hot air reflow due to the space limitation and potential lifting of the thin copper trace from the fine pitch device pads. Rework is particularly difficult for full area array devices using hot air reflow due to the non-uniform heating of the area. An emergent rework technique is local area reflow using focused Infrared radiation (IR) assisted heating. The focused IR technology does not require compo-nent specific nozzles as is the case with hot air rework equipment. The IR method provides uniform heating via irradiation and conduction through the reworking device. The IR method provides local-ized heating area in the rework zone only and provides for the effective heating at the device location only for a short duration above the eutectic soldering temperature >195 °C (383 °F), meanwhile keeping the rest of the assembly at the pre-heat temperature <130 °C (266 °F). The EXFO Novacure IR Spot Curing System can provide such capability for small area rework at relatively modest cost. The unit can also be used for other applications such as IR assisted encapsulation gelation for chip encapsulation. This application note outlines the components rework methodology using an EXFO Novacure IR system. Figure 1: Preheating to 120 °C-130 °C (248 °F-266 °F) minimizes the potential for component damage. Rework Methodology The major advantage for using IR rework is to provide a source of localized heating. The focused IR from the Novacure IR equipment provides a spot of heat of approximately 1 cm (0.4 in) directly on top of the part requiring rework. Minimal heat is delivered outside this area that could effect the surrounding components. The spot size can be changed with adjustable optics or using masks to accommodate multiple sizes of components that require rework. The Novacure IR equipment is particularly suited for reworking HDI assemblies, such as the single sided assembly for automotive mounting parts (sensors, controllers), cell phone assemblies, Microelectronic Mechanical System (MEMS), multi- chip-module (MCM) and Optoelectronic assemblies. www.exfo.com Telecommunications Test and Measurement " id="pdf-obj-0-52" src="pdf-obj-0-52.jpg">
Application Note 097
Application Note 097

Application Note 097

Application Note 097

In order to rework a part successfully by removing the defective part/assembly, specific attention is required as follows:

  • (a) Good pre-heat practices will reduce the required IR energy for rework and minimize the potential for damage of the device or assembly during the rework process.

  • (b) Protect the device (module/chip, etc.) by limiting the time and heat upon rework. The profile shall be set within the device manufacturer’s specified range. Consult device manufacturer’s recommendations. For example, Intel’s packaging handbook provides both solder reflow recommendation and moisture sensitivity handling guideline.

  • (c) Protect the surrounding components by isolating the heat source (minimize the heat impact) to the repair area. Ensuring the uniformity of the pre-heat conditions is necessary to minimize stress gradients during the rework process.

  • (d) Protect the device by using ESD safe tooling for device handling upon rework (proper ESD grounded tooling should be used for dislodge the rework part at peak temperature).

The Novacure IR System offers the following key features:

Aiming and focusing the device using 3 visible lasers (red laser at 660 nm)

Reduced IR lamp heating element of 150 Watt to prevent damage of the device and assembly (compared to the standard 600 W used by other IR rework stations).

High efficiency, constant power output control with user set time to minimize device over heating.

Programmable, multiple rework heating profile (recommend 4000-8000 mW/ for standard Pb/Sn eutectic solder) for different devices. The system is capable of three preprogrammed IR power/time profiles.

Small working area of 1 cm (0.4 in) with standard working distance 2.5 cm to 3.8 cm (0.98 in to 1.5 in)(measured from the targeting ring, or 5.1 cm (2 in) from the lens).

Application Note 097 In order to rework a part successfully by removing the defective part/assembly, specific

Figure 2: The target device is located using the three visible laser diodes.

The Novacure IR utilizes focused IR radiation for rework of high density SMT assemblies. The focus area is approximately 1 cm (0.4 in) in diameter; positioned vertically using visible laser guided “focus heat zone locator”. The board is pre-heated to 120 °C-130 °C (248 °F-266 °F) using a thermal heating pad or heat plate prior to IR irradiation.

www.exfo.com

Telecommunications Test and Measurement

Application Note 097 In order to rework a part successfully by removing the defective part/assembly, specific
Application Note 097
Application Note 097

Application Note 097

Application Note 097

Typical rework conditions are listed below:

Step

Condition

Observation

Preheat*

Preheat using thermal pad/hot plate

120 °C-130 °C* (248 °F-266 °F*)

(figure 1)

to 120 °C-130 °C (248 °F-266 °F) for at least 2 minutes to ensure uniform heating of the rework area.

measured at surface of the substrate close to the rework area.

Locate the defective device (figure 2)

Using 3 laser target finder (when the 3 laser overlap on top of the device, it is focused). Flux the area with proper rework flux.

Push “laser on” and locate the rework area. The depth of the over lapped laser spot indicate the maximum heat location.

IR rework**

Apply IR radiation < 30 seconds**

10-15 seconds normally is sufficient

(figure 3)

and remove the device with ESD proofed tooling as soon as reflow occurs.

using 6000-8000 mW from the Novacure IR equipment.

Turn off the IR and remove the assembly from the heating element.

Remove the assembly after IR rework and examining the substrate pad.

Clean the rework flux if it is required. If pad lifting is observed due to insufficient reflow, increase pre-heat time or IR energy.

Table I. Typical IR Rework Conditions (based on standard Pb/Sn eutectic solder assembly)

*

Pre-heat time is dependant upon the thermal mass of the target assembly. Air gap between the pre-heat element and the assembly may

**

result insufficient heating. Maximum reflow of standard module is 30 seconds at T>183 °C (362 °F). Typical 10-20 seconds is sufficient for DIP, 10-15 seconds for QFP or small BGA without heat sink. Consult device manufacture recommended profile (maximum reflow temperature and time) before proceeding with the rework.

Note:

Table I provides typical rework conditions. Adjustment may be required due to the different thermal mass of individual assemblies. Do not expose the assembly to excessive IR radiation. Over heating and discoloration of PWB may occur if excessive IR radiation is used.

Application Note 097 Typical rework conditions are listed below: Step Condition Observation Preheat* Preheat using thermal

Figure 3: Infrared energy triggers reflow of the eutectic solder.

www.exfo.com

Telecommunications Test and Measurement

Application Note 097 Typical rework conditions are listed below: Step Condition Observation Preheat* Preheat using thermal
Application Note 097
Application Note 097

Application Note 097

Application Note 097

Specifications

Lamp:

150-watt quartz halogen gold-coated parabolic reflector

Lamp Life:

> 500 hours

Output Spectrum:

0.7– 4.5 microns (Standard), 1.1– 4.5 microns (Optional)

Spot Size:

10 mm

Temperature

Up to 600°C, (1112°F), dependent on substrate materials, thermal mass

Range:

and fixturing

Power Supply:

High efficiency, switch mode, constant power output, auto range selection 90–132 and 180–264 VAC, 47–63 Hz

Microprocessor

User friendly menu driven software prompts for and accepts application parameters

5-button, flush-mounted, tactile with protective overlay

Controls:

and ensures correct values are maintained (also allows user to select feedback mode,

Keypad:

as well as calibrate and regulate output)

Display:

Backlit LCD

Size

(H x W x D) 15 cm x 28.06 cm x 29.51 cm (5 15 /16 in x 11 5 /8 in x 11 1 /16 in)

(Control Unit):

(Weight) 5.48 kg (12.05 lbs)

Size:

Light Delivery Module

(Length) 22.12 cm (8 11 /16 in)

Laser Targeting Ring

(Diameter) 8.64 cm (3 3 /8 in) (Weight) 2.05 kg (4.5 lbs) (Height) 3.1 cm (1 3 /16 in) (Diameter) 13.28 cm (5 1 /4 in) (Weight) 0.5 kg (1.1 lbs)

Includes:

Light delivery module, standard cold mirror filter (0.7– 4.5 microns), grounded and shielded power cord, foot pedal, spare I/O connector, radiometer calibration certificate, control unit and User Guide

Options:

Laser targeting ring

Warranty:

1 year, parts and labor (excluding lamp)

Application Note 097 Specifications Lamp: 150-watt quartz halogen gold-coated parabolic reflector Lamp Life: > 500 hours

Corporate Headquarters > 400 Godin Avenue, Vanier (Quebec) G1M 2K2 CANADA

Tel.: 1 418 683-0211

Fax: 1 418 683-2170

info@exfo.com

 
 

Toll-free: 1 800 663-3936 (USA and Canada)

www.exfo.com

EXFO America

4275 Kellway Circle, Suite 122

Addison, TX 75001 USA

 

Tel.: 1 800 663-3936

Fax: 1 972 836-0164

EXFO Europe

Le Dynasteur, 10/12 rue Andras Beck

92366 Meudon la Forêt Cedex FRANCE

Tel.: +33.1.40.83.85.85

Fax: +33.1.40.83.04.42

EXFO Asia-Pacific

151 Chin Swee Road, #03-29 Manhattan House

SINGAPORE 169876

 

Tel.: +65 6333 8241

Fax: +65 6333 8242

EXFO China

Beijing New Century Hotel Office Tower Room 1754-1755 No. 6 Southem Capital Gym Road

Beijing 100044 P. R. CHINA

 

Tel.: +86 (10) 6849 2738

Fax: +86 (10) 6849 2662

Appnote097.2AN

© 2005 EXFO Electro-Optical Engineering Inc. All rights reserved.

Appnote097.2AN © 2005 EXFO Electro-Optical Engineering Inc. All rights reserved. Printed in Canada 05/05
Appnote097.2AN © 2005 EXFO Electro-Optical Engineering Inc. All rights reserved. Printed in Canada 05/05
Appnote097.2AN © 2005 EXFO Electro-Optical Engineering Inc. All rights reserved. Printed in Canada 05/05

Printed in Canada 05/05

Appnote097.2AN © 2005 EXFO Electro-Optical Engineering Inc. All rights reserved. Printed in Canada 05/05