Environmental Product Content Specification Rev 2007

TITLE: ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED
MANUFACTURERS

RESPONSIBLE GROUP/OPERATION: Materials
DISTRIBUTION:

ISSUED: February 21, 2007
APPROVAL NAME: TITLE:
SPEC OWNER: J oni Hansen ATGM PSMT Mgr
WORKING GROUP LEADER: Linda Young CPRS, CMC SC Chair
SPONSOR: Dave Musso SMO, CMC SC Sponsor
FUNCTIONAL MANAGER(S):
Yi-Wen Chan CMPO/CSO
Hector Carlo SM
Rick East SMO
Luyin Zhao ATGM
J im J ewett GFM
Terry Richesin SM Q&R Regulatory Mgr.
Steven W. Brown Chemical Use Policy Forum
Kevin Dehmer Packaging MRC Chair
Todd Rallison EHS Legal
EXPIRATION: July 21, 2008

TABLE OF CONTENTS
1.0 PURPOSE & SCOPE:.....................................................................................................................................2
2.0 REQUIREMENTS:.........................................................................................................................................2
3.0 RESTRICTIONS: ...........................................................................................................................................2
3.1 MANUFACTURING RESTRICTIONS............................................................................................................2
3.2 PRODUCT CONTENT RESTRICTIONS:.........................................................................................................3
3.2.1 GENERAL RESTRICTIONS......................................................................................................................3
3.2.2 RESTRICTIONS IN SPECIFIC APPLICATIONS.....................................................................................5
3.3 PACKAGING REQUIREMENTS.................................................................................................................6
3.3.1 PACKAGING CONTENT RESTRICTIONS:......................................................................................6
3.3.1 PACKAGING SUPPLIER DECLARATION FORM:..........................................................................6
3.4 BATTERY CONTENT RESTRICTIONS:.....................................................................................................6
3.5 FUTURE MATERIAL RESTRICTIONS: .....................................................................................................7
3.6 POTENTIAL FUTURE MATERIAL RESTRICTION WATCH LISTS...................................................7
3.7 FUTURE MATERIAL DECLARATION REQUIREMENTS.......................................................................7
4.0 ROLES & RESPONSIBILITIES....................................................................................................................7
5.0 REFERENCE DOCUMENTS:.......................................................................................................................8
6.0 DEFINITIONS:...............................................................................................................................................8
7.0 REVISION HISTORY ....................................................................................................................................9
ATTACHMENT A: CHEMICAL LIST ............................................................................................................10
Attachment B Intel EPC Spec Conformance Form..........................................................................................13
Attachment C Packaging Environmental Regulatory Compliance Form.........................................................14
Attachment D: RoHS Supplier Declaration Form...............................................................................................15
Attachment D-2: IPC 1752 Supplier Declaration Form......................................................................................16
Attachment E - EU RoHS Exemptions (Examples) ............................................................................................17

DOCUMENT NUMBER: BS-MTN-0001 REV.6 1 of 17
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INTEL CORPORATION 5000 W. CHANDLER BLVD CHANDLER, AZ85226
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1.0 PURPOSE & SCOPE:

1.1. PURPOSE: The purpose of this specification is to define environmental requirements for Intel suppliers
and outsourced manufacturers. Intel sets high environmental standards for its products and requires that
its suppliers and outsource manufacturers enable similar environmental performance.
1.2. SCOPE: The scope of this specification includes all raw materials, parts, components or products that are
ultimately incorporated into the product that Intel sells. For outsourced manufacturers, this includes
products produced by the manufacturer on behalf of Intel. This specification also covers packaging
materials.

2.0 REQUIREMENTS:

2.1 Environmental Requirements: In this specification, environmental requirements are defined in section 3
below for the following:
3.1 Manufacturing restrictions
3.2 Product content restrictions
3.3 Packaging requirements
3.4 Battery content restrictions
3.5 Future material restrictions
3.6 Potential future material restriction watch lists

2.2 This document shall be referenced in the contract & the purchasing agreement document.
2.3 All part and/or material suppliers must review this specification & sign the compliance form in Appendix
B. Intel will begin piloting the IPC 1752 industry standard form with selected suppliers during 2007.
Suppliers not selected for the IPC 1752 pilot will be requested to fill out the Intel SDoC form. The signed
form must be returned to the Intel Commodity Manager for submission into the data base.
2.4 All shipping packaging suppliers must review this specification & sign the compliance form in Appendix
C. The signed form must be returned to the Intel Packaging Engineer for submission into the data base.

3.0 RESTRICTIONS:

3.1 MANUFACTURING RESTRICTIONS

The following materials are prohibited for use in the manufacturing of raw materials, parts or products
supplied to Intel.

Material Potential Industry Uses Threshold Reason for Inclusion
Ozone Depleting
Substances Class I

Not expected due to industry
phase-out, but rare cleaning
applications may be found.
0 2037/2000/EC,,
Montreal Protocol; US: Clean Air Act
Amendments Title VI (40 CFR Part 82.106);

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The following materials are prohibited for use in the manufacturing of parts or products on behalf of Intel
(e.g. outsourced manufacturing).

Ozone Depleting
Substances Class I

phase-out, but rare cleaning
applications may be found.
0 2037/2000/EC,

Ozone Depleting
Substances Class II
Not expected, but use of HCFCs
as substitute for CFCs in cleaning
operations may be found.
0 Clean Air Act Amendments Title VI (40 CFR
Part 82)
2037/2000/EC
Certain Glycol Ethers

Certain ethylene glycol ethers
were traditionally used as solvent
in semiconductor manufacture.
0 Semiconductor industry voluntarily banned the
use of certain ethylene glycol ethers in
manufacture of semiconductors.

3.2 PRODUCT CONTENT RESTRICTIONS:

The following materials are prohibited for use in raw materials, parts, components, or products above the thresholds
defined below. Restrictions are divided into two categories: General Restrictions and Specific Applications. For the
category of Specific Applications, materials are only restricted for use in those applications list in the table.

3.2.1 GENERAL RESTRICTIONS

The following materials are prohibited in all raw materials, parts, components or products provided to Intel.

Asbestos, Asbestos
Materials
Not expected 100 ppm
(total)
76/769/EEC, Marketing and Use of Dangerous
Substances, and amendments (83/478/EEC;
85/610/EEC; 91/659/EEC); United States
Toxic Substances Control Act (restricts new
uses). Occupational Safety and Health Act (29
CFR 1910.1001-1051)
Lead Solder, alloy in metal 1000 ppm
(0.1%wt)
per
homogenous
material*
(Note 1)
EU Directive 2002/95/EC Restriction of
Hazardous Substances (RoHS) (2003)
China Management Methods on the Prevention
and Control of Pollution Caused by Electronic
Information Products (2006)
Cadmium Stabilizer in plastics, cables and
cords.
Dyes, pigments, paints, enamels
100 ppm
(0.01%wt)
per
homogenous
material*
91/338/EEC. Restrictions in Austria,
Switzerland, Denmark, Netherlands, and
Sweden
2002/95/EC Restriction of Hazardous
Substances (RoHS) (2003), China Management
Methods on the Prevention and Control of
Pollution Caused by Electronic Information
Products (2006)
Hexavalent
Chromium
Plating, metal finishes 1000 ppm
(0.1%wt)
per
homogenous
material*
2002/95/EC Restriction of Hazardous
Products (2006)
Mercury Relays, switches, contacts, guards 1000 ppm 2002/95/EC Restriction of Hazardous
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(0.1%wt)
per
homogenous
material*
Products (2006)

Mercury "Fabricated mercury-added
product" means a product that
consists of a combination of
individual components that
combine to make a single unit,
including, but not limited to,
mercury-added measuring devices,
lamps and switches to which
mercury or a mercury compound is
intentionally added in order to
provide a specific characteristic,
appearance, or quality, or to
perform a specific function or for
any other reason.

"Formulated mercury-added
product" means a product that
includes, but is not limited to,
laboratory chemicals, cleaning
products, cosmetics,
pharmaceuticals and coating
materials that are sold as a
consistent mixture of chemicals to
which mercury or a mercury
compound is intentionally added in
order to provide a specific
characteristic, appearance, or
quality, or to perform a specific
function or for any other reason.
Phase out
schedule:
1/1/2006
Fabricated
1,000
milligrams
Formulated
250 ppm

7/1/2007
Fabricated
100
milligrams
Formulated
50 ppm

7/1/2009
Fabricated
10
milligrams
Formulated
10 ppm
Rhode Island Chapter 268, Mercury Reduction
and Education Act (2005)

Ozone Depleting
Substances Class I
phase-out.
may not be
intentionally
added
3093/94/EEC, Implementing Montreal Protocol
Germany: FCKW Halon Verbots and
CFC/Halon P.O.
Class I Substances currently banned for import
and manufacture. Users must comply with
labeling requirements.
Ozone Depleting
Substances Class II
Not expected, but use of HCFCs as
substitute for CFCs in cleaning
operations may be found.
may not be
intentionally
added
Clean Air Act Amendments Title VI (40 CFR
Part 82)
Class II Substances will be banned for import
and manufacture by 2015.
3093/94/EEC, Implementing Montreal Protocol
Polychlorinated
Biphenyls (PCB)/
Terphenyls (PCT)

Not expected, but historically used
in transformers, capacitors
50 ppm
(total)
76/769/EEC, Marketing and Use of Dangerous
Substances, and amendments (82/828/EEC;
85/467/EEC; 89/677/EEC); United States
TSCA (1977)
Polybrominated
Biphenyls (PBB) and
their ethers/oxides
(PBDE)
Not expected. Some PBDE
compounds may be in use as flame
retardants. OBDPO may be used in
ABS and other thermoplastics.
1000 ppm
(0.1%wt)
per
homogenous
* 2002/95/EC Restriction of Hazardous
Substances (RoHS) (2003),
* China Management Methods on the
Prevention and Control of Pollution Caused by
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DBDPO may be used in HIPS and
other thermoplastics. PeBDPO is
currently used almost exclusively
to enhance the ignition resistance
of flexible polyurethane foams.
material* Electronic Information Products (2006)
* Procurement activities of some governments
and large corporations also prohibit use of PBB
and PBDE in electronic products.
* California - Flame Retardants Restrictions:
Cal. Health & Safety Code 108920-109823
* Maine Revised Statues Title 38, Section 1609
* NYS Envtl. Cons. Law 37-0111(1)(A).
Polychlorinated
Naphthalene (PCN)
Historically used as an additive to
rubber, lubricants and paints
may not be
intentionally
added
J apan Law Concerning the Examination and
Regulation of the Manufacture of Chemical
Substances (Class 1)
Radioactive
Substances
optical properties (thorium)

may not be
intentionally
added
Laws for the Regulation of Nuclear Source
Material, Nuclear Fuel Material, and Reactors,
1986 (J apanese law)
Short Chain
Chlorinated Paraffins
(C10-13, Cl >50%)
Historically used as flame
retardants in PWBs and plastics
may not be
intentionally
added
Oslo and Paris Conventions for the Prevention
of Marine Pollution (Decision 95/1)
Use prohibited by eco-labels (Blue Angel, etc)
Tributyl tin (TBT)
and, Triphenyl tin
(TPT) compounds
Historically used in inks, paints,
preservatives and fungicides
may not be
intentionally
added
J apan Law Concerning the Examination and
Regulation of the Manufacture of Chemical
Substances (Class 1, Class 2)

* See definition 6.1 for homogenous material. Restrictions apply unless an approved, valid exemption exists.
See Appendix D for exemption examples. Please refer to the official EU Commission web site for the latest
list of exemptions.

Note 1. Lead limitation does not apply to suppliers of pure lead for use in exempt manufacturing processes
(eg. Flip Chip).

3.2.2 RESTRICTIONS IN SPECIFIC APPLICATIONS

The following materials may not be used in the SPECIFIC APPLICATION listed below.

Material Restricted Application Threshold Reason for Inclusion
Azo colorants Pigments in parts or products that
have direct contact with human
skin (e.g. headsets, straps, belts)
30 ppm 76/769/EEC, Marketing and Use of Dangerous
Substances and amendments: (2002/61/EC;
2003/03/EEC).
Brominated Flame
Retardants (Other
than PBB and PBDE
compounds in section
3.2.1)
Individual plastic parts >25 g.
Examples include: bezels, ducts,
fans, and covers.
This restriction does not apply to
printed circuit boards, substrates,
epoxies, mold compounds,
underfill materials or cables.
1000 ppm,
may not be
intentionally
added
Customer requirements, eco-labeling
requirements including Germanys Blue Angel
and Swedens TCO label.
Lead and its
compounds

Paints

may not be
intentionally
added
89/677/EEC, adds lead to 76/769/EEC,
Marketing and Use of Dangerous Substances
Lead and its
compounds
Cables, cords and wires 300 ppm California Proposition 65 Settlement
Mercury Relays & Switches (unless
Vermont exemption obtained).
Applies to products sold in
Vermont only.
Banned-not
present
USA Vermont, Comprehensive Mercury
Management 10 Vt. Stat. Ann. 7101-7115

Nickel and its
compounds
Metallic nickel or nickel alloy
exempt in all
applications except external
chassis/case parts likely to
result in prolonged skin exposure.
No exemptions for
organo-nickel compounds.
1000 ppm 94/27/EEC; J oint Industry Guide (J IG) Level B
substance
Poly Vinyl Chloride
Polymer (PVC)
Plastic parts except cables,
connectors, electronic components,
magnetic tape, chassis plastic parts
less than 25 grams
1000 ppm
(reporting
threshold
only)
J oint Industry Guide (J IG) Level B substance

3.3 PACKAGING REQUIREMENTS
3.3.1 PACKAGING CONTENT RESTRICTIONS:

The following materials are prohibited for use in product packaging materials used for transport, etc. (e.g.
trays, reels, tubes, boxes, foam materials, etc)

Material Restricted Application Threshold Reason for Inclusion
Lead, Mercury,
Cadmium, Chromium
(VI), Noxious and
other Hazardous
substances
Packaging/Packaging
Labels/Packaging Inks
100 ppm
(total)
94/62/EEC, Packaging and Packaging Waste

3.3.1 PACKAGING SUPPLIER DECLARATION FORM:
Refer to Attachment C for Packaging specific Supplier Declaration of Conformance Form. Note that an
actual signature is required. Please send an electronic copy of the completed and signed formto the
responsible Intel Packaging Engineer.

3.4 BATTERY CONTENT RESTRICTIONS:

The following materials are prohibited for use in batteries:

Material Applicable Batteries Threshold Reason for Inclusion
Mercury All except button cell
Button cell
5 ppm
2% (by weight)
EU Battery Directive 91/157/EEC and
98/101/EEC amendments
Cadmium Alkaline-manganese and zinc-
carbon
0.001 % (by
weight) (10
ppm)
Lead This requirement does not apply to
sealed lead acid batteries such as
those used in Uninterruptible
Power Supply (UPS) systems
0.4% wt (4,000
ppm)

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3.5 FUTURE MATERIAL RESTRICTIONS:

The following materials will eventually be phased out of all raw materials, parts, components, and
subassemblies supplied to Intel.

Material Applications Threshold Reason for Inclusion
Halogen Flame retardants Not intentionally
added; not
present
Customer Requirements

3.6 POTENTIAL FUTURE MATERIAL RESTRICTION WATCH LISTS

Intel has also developed a Screen Tool that identifies chemicals that are considered by Intel to be High Risk of
regulatory action at some point in the future. These chemicals are not restricted for use today, but may be restricted
in the future. Intel encourages its suppliers to look for alternatives to these chemicals.

The screen tool is available for download at: http://supplier2.intel.com/ehs/environmental.htm

3.7 FUTURE MATERIAL DECLARATION REQUIREMENTS

To encourage industry alignment with the J oint Industry Guide: Material Composition Declaration for Electronic
Products (J IG-101), suppliers can be requested to disclose J IG Level B list of substances (shown below). It is
important to note that these substances are not currently banned or restricted in any application, however, disclosure
on their use will enable companies to meet future demands for product content disclosure requirements.
Material Examples of Use Reporting
Threshold
Reason for Inclusion
Antimony and its
compounds
Pigment, paint, catalyst, lead free solder,
stabilizer, n-type dopant, flame retardant
1000 ppm J oint Industry Guide (J IG) Level B
substance
Beryllium and its
compounds
Ceramics, metal alloy, copper-beryllium
alloy, catalyst, precipitation hardening
alloy, copper-beryllium alloy for spring,
solder
substance
Bismuth and its
compounds
Lead free solder, solder 1000 ppm J oint Industry Guide (J IG) Level B
substance
Phthalates Plasticizer, dye, pigment, paint, ink,
adhesive, lubricant
substance
Selenium and its
compounds
Photoreceptor, pigment, ink, catalyst,
oxidizer, semiconductor material, light
receiving element, photocell
substance

4.0 ROLES & RESPONSIBILITIES

4.1 It is the role of the supplier and contract manufacturer to review this specification and sign and return
the form in Attachment B for conformance to this specification.
4.2 It is the role of the supplier and contract manufacturer to review this specification and sign and return
the form in Attachment D for compliance with the EU RoHS Directive for materials/parts supplied to
or on behalf of Intel.
4.3 It is the role of the commodity manager to ensure that the suppliers & contract manufacturers have
been provided this information & responded with a signature on the appropriate form(s) in Attachment
B & D. In 2007, Intel will pilot the IPC 1752 material declaration form with selected suppliers.
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4.4 It is the role of the Packaging Engineer to ensure that the Intel AML (Approved Manufacturers List)
suppliers have been provided with this information & responded with a signature on the form in
Attachment C.
4.5 It is the role of the Corporate Products Regulations & Standards (CPRS) group to provide the
restricted materials information to the specification owner.

5.0 REFERENCE DOCUMENTS:
5.1 Chemical Restrictions Screen Tool: https://supplier2.intel.com/ehs/environmental.htm
5.2 Chemical Selection Guidelines: https://supplier2.intel.com/ehs/environmental.htm
5.3 CAS #s of specific chemicals covered: http://supplier2.intel.com/ehs/chemlistposted.xls

6.0 DEFINITIONS:
6.1 Homogeneous Material : Per European Union Frequently Asked Question (FAQ) Guidance
Document on RoHS and WEEE, homogenous material means a material that can not be mechanically
disjointed into different materials. The term "homogeneous" means "of uniform composition
throughout". Examples of "homogeneous materials" are individual types of: plastics, ceramics, glass,
metals, alloys, paper, board, resins, coatings. The term mechanically disjointed: means that materials
can, in principle, be separated by mechanical actions such as: unscrewing, cutting, crushing, grinding
and abrasive processes.

Further clarification from the EU guidance document includes the following examples:

A plastic cover is a "homogeneous material" if it consists of one type of plastic that is not coated
with or has attached to it or inside it any other kinds of materials. In this case the limit values of
the directive would apply to the plastic.
An electric cable that consists of metal wires surrounded by non-metallic insulation materials is an
example of a "non homogeneous material" because the different materials could be separated by
mechanical processes. In this case the limit values of the directive would apply to each of the
separated materials individually.
A semi-conductor package contains many homogeneous materials which include; plastic
moulding material, tin-electroplating coatings on the lead frame, the lead frame alloy and gold-
bonding wires.
Appendix E contains a list of example EU RoHS exemptions that are currently approved by the EU Technical
Advisory Committee (TAC).
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7.0 REVISION HISTORY

Rev Date Description Initiator
1 7/12/03 Spec Written J oni Hansen & Todd
Brady
2 8/25/04 Additional restricted materials added; general edits Todd Brady
3 10/4/04 Additional RoHS restrictions and exemptions added Bobby Britton
4 2/11/05 Added Supplier DoC and RoHS definitions Bobby Britton
5 2/13/06 Additional restricted materials added per J oint Industry Guide
(J IG); Added J IG B list of reporting substances. EU RoHS
Materials/Parts Supplier SDoC exemptions and certification
language updated; added EU Packaging Directive SdoC;
general edits
Linda Young
6 2/21/07 Added US State Mercury & US State flame retardant
restrictions to section 3.2.1, Separated Intel Environmental
Product Content Spec (EPC) affirmation statement from EU
RoHS SDoC form; updated Intel EU ROHS SDOC form to
include new exemptions and moved to Appendix D, updated
Packaging Directive SDOC form, added IPC 1752 material
data exchange form (pilot) to Appendix D; moved EU RoHS
exemption list to Appendix E.
Linda Young
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ATTACHMENT A: CHEMICAL LIST

Asbestos/Asbestos Materials CAS Numbers
Asbestos and Asbestos Materials 1332-21-4
Actinolite 77536-66-4
Amosite (Grunerite) 12172-73-5
Anthophyllite 77536-67-5
Chrysotile 12001-29-5
Crocidolite 12001-28-4
Tremolite 77536-68-6
Polychlorinated Biphenyls (PCBs)
and Terphenyls (PCTs) CAS
Number
Polychlorinated Biphenyls 1336-36-3
Aroclor 12767-79-2
Chlorodiphenyl (Aroclor 1260) 11096-82-5
Kanechlor 500 27323-18-8
Aroclor 1254 11097-69-1
Terphenyls 26140-60-3
Azo Colorants CAS Numbers
4-Aminobiphenyl 92-67-1
Benzidine 92-87-5
4-Chloro-o-toluidine 95-69-2
2-Naphthylamine 91-59-8
o-Aminoazotoluene 97-56-3
5-Nitro-o-toluidine 99-55-8
p-Chloroaniline 106-47-8
4-Methoxy-m-phenylenediamine 615-05-4
4,4-Methylenedianiline 101-77-9
3,3-Dichlorobenzidine 91-94-1
3,3-Dimethoxybenzidine 119-90-4
4,4Methylenedi-o-toluidine 838-88-0
6-Methoxy-m-toluidine 120-71-8
4,4-Methylenebis(2-chloroaniline 101-14-4
4,4-Oxydianiline 101-80-4
4,4-Thiodianiline 139-65-1
o-Toluidine 95-53-4
4-Methyl-m-phenylenediamine 95-80-7
2,4,5-Trimethylaniline 137-17-7
o-anisidine 90-04-0
4-amino azobenzene 60-09-3
3,3-dimethylbenzidine 119-93-7
Pigment Red 8 6410-30-6

Polychlorinated CAS
Naphthalene (PCN) Numbers
Trichloronaphthalene 1321-65-9
Tetrachloronaphthalene 1335-88-2
Pentachloronaphthalene 1321-64-8
Octachloronaphthalene 2234-13-1

Certain Glycol Ethers CAS Numbers
2-Ethoxyethanol 110-80-5
2-Ethoxyethyl acetate 111-15-9
2-Methoxyethanol 109-86-4
2-Methoxyethyl acetate 110-49-6
Diethylene glycol dimethyl ether 111-96-6

Cadmium and CAS
its Compounds Numbers
Cadmium 7440-43-9
Examples of Common Cadmium Compounds
Cadmiumoxide 1306-19-0
Cadmiumsulfide 1306-23-6

Chromium VI CAS
and its Compounds Numbers
Chromium 7440-47-3
Examples of Common Chromium Compounds
Bariumchromate 10294-40-3
Calciumchromate 13765-19-0
Chromic acetate 1066-30-4
Chromiumtrioxide 1333-82-0
Lead chromate 7758-97-6
Sodiumchromate 7775-11-3
Sodiumdichromate 10588-01-9
Strontiumchromate 7789-06-2
Zinc chromate 13530-65-9
Tributyl tin (TBT) and
Triphenyl tin (TPT) CAS
Compounds Number
Examples of Common TBT and TPT compounds
Tributyl tin bromide 1461-23-0
Tributyl tin oxide 56-35-9
Tributyl tin acetate 56-36-0
Tributyl tin laurate 3090-36-6
Tributyl tin fluoride 1983-10-4
Triphenyl tin 668-34-8
Triphenyl tin chloride 639-58-7
Triphenyl tin hydroxide 76-87-9
Triphenyl tin acetate 900-95-8
Triphenyl tin fluoride 1983-10-4
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Lead and CAS
its Compounds Numbers
Lead 7439-92-1
Examples of Common Lead Compounds
Lead sulfate 7446-14-2
Lead carbonate 598-63-0
Lead hydrocarbonate 1319-46-6
Lead acetate 301-04-2
Lead (II) acetate, trihydrate 6080-56-4
Lead phosphate 7446-27-7
Lead selenide 12069-00-0
Mercury CAS
and its Compounds Numbers
Mercury 7439-97-6
Examples of Common Mercury Compounds
Mercuric chloride 33631-63-9
Mercury bichloride 7487-94-7
Mercuric sulfate 7783-35-9
Mercuric nitrate 10045-94-0
Mercuric oxide 21908-53-2
Mercuric sulfide 1344-48-5

Class I
Ozone Depleting Substances CAS
/Isomers* Numbers
Trichlorofluoromethane (CFC 11) 75-69-4
Dichlorodifluoromethane (CFC12) 75-71-8
Chlorotrifluoromethane (CFC 13) 75-72-9
Pentachlorofluoroethane (CFC 111) 354-56-3
Tetrachlorodifluoroethane (CFC 112) 76-12-0
Trichlorotrifluoroethane (CFC 113)
1,1,2 Trichlorotrifluoroethane
354-58-5
76-13-1
Dichlorotetrafluoroethane (CFC 114) 76-14-2
Monochloropentafluoroethane (CFC 115) 76-15-3
Heptachlorofluoropropane (CFC 211) 422-78-6
135401-87-5
Hexachlorodifluoropropane (CFC 212) 3182-26-1
Pentachlorotrifluoropropane (CFC 213) 2354-06-5
134237-31-3
Tetrachlorotetrafluoropropane (CFC 214)
1,1,1,3-Tetrachlorotetrafluoropropane
29255-31-0
2268-46-4
Trichloropentafluoropropane (CFC 215)
1,1,1-Trichloropentafluoropropane
1,2,3-Trichloropentafluoropropane
1599-41-3
4259-43-2
76-17-5
Dichlorohexafluoropropane (CFC 216) 661-97-2
Monochloroheptafluoropropane (CFC 217) 422-86-6
Bromochlorodifluoromethane (Halon 1211) 353-59-3
Bromotrifluoromethane (Halon 1301) 75-63-8
Dibromotetrafluoroethane (Halon 2402) 124-73-2
Carbon Tetrachloride (Tetrachloromethane) 56-23-5
1,1,1, - Trichloroethane (methyl chloroform)
and its isomers except 1,1,2-trichloroethane
71-55-6
Bromomethane (Methyl Bromide) 74-83-9
Bromodifluoromethane and isomers (HBFCs) 1511-62-2
*Please note: These materials may contain isomers that are not
listed here. Isomers with CAS numbers have been included
when available.

Polybrominated Biphenyls (PBBs)
and their Ethers/Oxides CAS Numbers
Bromobiphenyl and its ethers

2052-07-5 (2-
Bromobiphenyl)
2113-57-7 (3-
Bromobiphenyl
92-66-0 (4-
Bromobiphenyl)
101-55-3 (ether)
Decabromobiphenyl and its ethers

13654-09-6
1163-19-5 (ether)
Dibromobiphenyl and its ethers

92-86-4
2050-47-7 (ether)
Heptabromobiphenylether 68928-80-3
Hexabromobiphenyl and its ethers

59080-40-9
36355-01-8
(hexabromo-1,1-
biphenyl)
67774-32-7
(Firemaster FF-1)
36483-60-0 (ether)
Nonabromobiphenylether 63936-56-1
Octabromobiphenyl and its ethers

61288-13-9
32536-52-0 (ether)
Pentabromobidphenyl ether (note:
Commercially available PeBDPO is a
complex reaction mixture containing a
variety of brominated diphenyloxides.
32534-81-9 (CAS
number used for
commercial grades of
PeBDPO)
Polybrominated Biphenyls 59536-65-1
Tetrabromobiphenyl and its ethers

40088-45-7
40088-47-9 (ether)
Tribromobiphenyl ether 49690-94-0

CONTROLLED COPY

Class II
Hydrochlorofluorocarbons CAS
/Isomers* Numbers
Dichlorofluoromethane (HCFC 21) 75-43-4
Chlorodifluoromethane (HCFC 22) 75-45-6
Chlorofluoromethane (HCFC 31) 593-70-4
Tetrachlorofluoroethane (HCFC 121)
1,1,1,2-tetrachloro-2-fluoroethane
(HCFC 121a)
1,1,2,2-tetracloro-1-fluoroethane
134237-32-4
354-11-0

354-14-3
Trichlorodifluoroethane (HCFC 122)
1,2,2-trichloro-1,1-difluoroethane
41834-16-6
354-21-2
Dichlorotrifluoroethane(HCFC 123)
Dichloro-1,1,2-trifluoroethane
2,2-dichloro-1,1,1-trifluroethane
1,2-dichloro-1,1,2-trifluroethane (HCFC-123a)
1,1-dichloro-1,2,2-trifluroethane (HCFC-123b)
2,2-dichloro-1,1,2-trifluroethane (HCFC-123b)
34077-87-7
90454-18-5
306-83-2
354-23-4
812-04-4
812-04-4
Chlorotetrafluoroethane (HCFC 124)
2-chloro-1,1,1,2-tetrafluoroethane
1-chloro-1,1,2,2-tetrafluoroethane (HCFC 124a)
63938-10-3
2837-89-0
354-25-6
Trichlorofluoroethane (HCFC 131)

1-Fluoro-1,2,2-trichloroethane
1,1,1-trichloro-2-fluoroethane (HCFC131b)
27154-33-2
(134237-34-6)
359-28-4
811-95-0
Dichlorodifluoroethane (HCFC 132)
1,2-dichloro-1,1-difluoroethane (HCFC 132b)
1,1-dichloro-1,2-difluoroethane (HFCF 132c)
1,1-dichloro-2,2-difluoroethane
1,2-dichloro-1,2-difluoroethane
25915-78-0
1649-08-7
1842-05-3
471-43-2
431-06-1
Chlorotrifluoroethane (HCFC 133)
1-chloro-1,2,2-trifluoroethane
2-chloro-1,1,1-trifluoroethane (HCFC-133a)
1330-45-6
1330-45-6
75-88-7
Dichlorofluoroethane(HCFC 141)

1,1-dichloro-1-fluoroethane (HCFC-141b)
1,2-dichloro-1-fluoroethane
1717-00-6;
(25167-88-8)
1717-00-6
430-57-9
Chlorodifluoroethane (HCFC 142)
1-chloro-1,1-difluoroethane (HCFC142b)
1-chloro-1,2-difluoroethane (HCFC142a)
25497-29-4
75-68-3
25497-29-4
Hexachlorofluoropropane (HCFC 221) 134237-35-7
Pentachlorodifluoropropane (HCFC 222) 134237-36-8
Tetrachlorotrifluropropane (HCFC 223) 134237-37-9
Trichlorotetrafluoropropane (HCFC 224) 134237-38-0
Class II (Continuted)
Hydrochlorofluorocarbons CAS
/Isomers* Numbers
Dichloropentafluoropropane, (Ethyne, fluoro-)
(HCFC 225)
2,2-Dichloro-1,1,1,3,3-pentafluoropropane
(HCFC 225aa)
(HCFC 225ba)
(HCFC 225bb)
(HCFC 225ca)
(HCFC 225cb)
(HCFC 225cc)
(HCFC 225da)
(HCFC 225ea)
(HCFC 225eb)
127564-92-5;
(2713-09-9)

128903-21-9

422-48-0

422-44-6

422-56-0

507-55-1

13474-88-9

431-86-7

136013-79-1

111512-56-2
Chlorohexafluoropropane (HCFC 226) 134308-72-8
Pentachlorofluoropropane (HCFC 231) 134190-48-0
Tetrachlorodifluoropropane (HCFC 232) 134237-39-1
Trichlorotrifluoropropane (HCFC 233)
1,1,1-Trichloro-3,3,3-trifluoropropane
134237-40-4
7125-83-9
Dichlorotetrafluoropropane (HCFC 234) 127564-83-4
Chloropentafluoropropane (HCFC 235)
1-Chloro-1,1,3,3,3-pentafluoropropane
134237-41-5
460-92-4
Tetrachlorofluoropropane (HCFC 241) 134190-49-1
Trichlorodifluoropropane (HCFC 242) 134237-42-6
Dichlorotrifluoropropane (HCFC 243)
1,1-dichloro-1,2,2-trifluoropropane
2,3-dichloro-1,1,1-trifluoropropane
3,3-Dichloro-1,1,1-trifluoropropane
134237-43-7
7125-99-7
338-75-0
460-69-5
Chlorotetrafluoropropane (HCFC 244)
3-chloro-1,1,2,2-tetrafluoropropane
134190-50-4
679-85-6
Trichlorofluoropropane (HCFC 251)
1,1,3-trichloro-1-fluoropropane
134190-51-5
818-99-5
Dichlorodifluoropropane (HCFC 252) 134190-52-6
Chlorotrifluoropropane (HCFC 253)
3-chloro-1,1,1-trifluoropropane (HCFC 253fb)
134237-44-8
460-35-5
Dichlorofluoropropane (HCFC 261)
1,1-dichloro-1-fluoropropane
134237-45-9
7799-56-6
Chlorodifluoropropane (HCFC 262)
2-chloro-1,3-difluoropropane
134190-53-7
102738-79-4
Chlorofluoropropane (HCFC 271)
2-chloro-2-fluoropropane
134190-54-8
420-44-0
*Pleasenote: Thesematerials may contain isomers that arenot listed here.
Isomers with CAS numbers have been included when available
CONTROLLED COPY
Attachment B Intel EPC Spec Conformance Form - EXAMPLE

STATEMENT of CONFORMANCE TO
ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR INTEL
SUPPLIERS & OUTSOURCED MANUFACTURERS

An authorized signature below confirms the supplier mentioned has read, understands and is in conformance to
Intel's ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED
MANUFACTURERS, including conformance to the European Union Directive on the Restriction on the Use of
Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS), 2002/95/EC.

SUPPLIER Information

Supplier Name

Contact Name
1

Title

Contact Phone

Contact Email

1
Company Representative responsible for EHS Compliance

Compliance to Environmental Product Content Specification

All raw materials, parts or products supplied to Intel meet the Intel Environmental Product Content
Specification for Suppliers and Outsourced Manufacturers.

Yes/No

If "No", list substance(s) which violate the Intel Environmental Product Content Specification below and contact
Intel Commodity Management.

Substance Location in Product Phase Out Date

The person signing below certifies that the above-named Supplier duly authorized them to sign on behalf of the
above-named Supplier.

Signature

Printed Name

Title

Date

Intel Document BS-MTN-001 Revision 2-21-07

Attachment C Packaging Environmental Regulatory Compliance Form
Manufacturing Site (if applicable)
1
Company Representative responsible for EHS Compliance
Intel's Packaging Workmanship Standards, Item 3
The Packaging Essential Requirements are:
Signature:
Title:
Date:
Rev. 02_2007
Packaging must be recoverable by recycling, energy recovery or biodegradation. (Refer to EU Directive on Packaging and
Packaging Waste [94/62/EC]
Fields in GREEN are required EXAMPLE - YOUR ANSWER/INFORMATION
Compliance has been verified via internal design controls, supplier declarations, and/or analytical test data. Intel considers this
declaration a modification to any and all purchase agreement(s) and contracts between the above-named supplier and Intel.
All supplier-provided warranties and indemnities otherwise applicable to products listed in this declaration supplied under such
agreement(s) shall also apply to this declaration of conformance.
The person undersigned above certifies that: (1) they are duly-authorized to sign on behalf of the above-named supplier, (2) all
information provided in this declaration is true and correct to the best of their knowledge, and (3) they possess and will
maintain the complete technical documentation relating to this declaration of compliance and are willing and able to furnish this
documentation to Intel upon request within 14 days of Intel requesting it.
Printed Name:
If " No" , list packaging part numbers which violate the Packaging Essential Requirements
Substance or Requirement Packaging Part number Phase-Out Date
Contact Email:
All packaging parts or complete packaging items supplied to
Intel meet Intel's Packaging Workmanship Standards Item 3 for
Suppliers and Outsourced Manufacturers. (Answer Yes/No)
Packaging materials (including printing inks on packaging) must not contain heavy metals (Lead, Cadmium, Mercury,
Hexavalent Chromium) where the sum of the concentration levels exceed 100 ppm (parts per million) by weight.
(Click here to view EU Directive on Packaging and Packaging Waste [94/62/EC]
The use of Noxious and other Hazardous substances must be minimized. If present in packaging, these substances must be
identified when concentration levels exceed 1000 ppm. (Methodology is explained in CEN/TR 13695-2:2004).
Title:
Contact Phone:
Supplier Name:
Contact Name
1
:
PACKAGING ENVIRONMENTAL REGULATORY COMPLIANCE FORM FOR INTEL
SUPPLIERS & OUTSOURCED MANUFACTURERS
The purpose of this document is to assess supplier conformance to Item 3 of Intel's Packaging Workmanship Standards,
relating to the European Union Packaging and Packaging Waste (Essential Requirements) Directive (94/62/EC)
The scope of this specification includes all packaging provided to Intel or on behalf of Intel. For outsourced manufacturers, this
includes packaging around products produced by the manufacturer on behalf of Intel.
Supplier Information

CONTROLLED COPY
Attachment D: RoHS Supplier Declaration Form

CONTROLLED COPY

Attachment D-2: IPC 1752 Supplier Declaration Form
(PILOT ONLY in 2007 with Selected Suppliers)

CONTROLLED COPY
CONTROLLED COPY
Attachment E - EU RoHS Exemptions (Examples)

RoHS Compliance: Intel defines RoHS compliant as follows: Lead and other materials banned in RoHS Directive
are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved exemption
applies.

The following exemptions have been granted by the EU in the RoHS directive and are allowed by Intel under this
specification;
1. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
2. Lead as an alloying element in steel containing up to 0.35 % lead by weight.
3. Lead as an alloying element in aluminum containing up to 0.4 % lead by weight. .
4. Lead as an alloying element in copper containing up to 4 % lead by weight.
5. Lead in high melting temperature type solders (i.e. lead based alloys containing 85 % by weight or more lead).
6. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching,
signaling, transmission as well as network management for telecommunications.
7. Lead in electronic ceramic parts (e.g. piezoelectronic devices).
8. Lead used in compliant pin connector systems.
9. Lead as a coating material for the thermal conduction module c-ring.
10. Lead in optical and filter glass.
11. Lead in solders consisting of more than two parts for the connection between the pins and the package of
microprocessors with a lead content of more than 80% and less than 85% by weight.
12. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within
integrated circuit Flip Chip packages.
13. Cadmium in optical and filter glass.
14. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under
Directive 91/338/EEC (*) amending Directive 76/769/EEC (**) relating to restrictions on the marketing and use
of certain dangerous substances and preparations.
15. Lead in bronze bearing shells and bushes.
16. Lead and cadmium in printing inks for application of enamels on borosilicate glass
17. Lead in Finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead
frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with
copper lead frames
18. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic capacitors
19. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in
structural elements: notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the
address electrode, the barrier ribs, the seal frit, and frit ring as well as in print pastes.

END OF DOCUMENT

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