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LM118 series are precision high speed 2 1 5 M Hz Sma l l Sign a l Ba n dwidth operational amplifiers designed for applications En s ur e d 50V / ms Sl e w Ra te requiring wide bandwidth and high slew rate. They feature a factor of ten increase in speed over general purpose devices without sacrificing DC performance.
LM118 series are precision high speed 2 1 5 M Hz Sma l l Sign a l Ba n dwidth operational amplifiers designed for applications En s ur e d 50V / ms Sl e w Ra te requiring wide bandwidth and high slew rate. They feature a factor of ten increase in speed over general purpose devices without sacrificing DC performance.
LM118 series are precision high speed 2 1 5 M Hz Sma l l Sign a l Ba n dwidth operational amplifiers designed for applications En s ur e d 50V / ms Sl e w Ra te requiring wide bandwidth and high slew rate. They feature a factor of ten increase in speed over general purpose devices without sacrificing DC performance.
L M 1 1 8 - N / l m2 1 8 - N / L M 3 1 8 - N O p e r a tion a l A mp l if ie r s Che ck f or Sa mp l e s : L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N 1 FEA TURES DESCRIPTIO N The LM118 series are precision high speed 2 1 5 M Hz Sma l l Sign a l Ba n dwidth operational amplifiers designed for applications En s ur e d 50V/ s Sl e w Ra te requiring wide bandwidth and high slew rate. They M a ximum Bia s Cur r e n t of 2 50 n A feature a factor of ten increase in speed over general purpose devices without sacrificing DC performance. O p e r a te s f r om Sup p l ie s of 5V to 2 0V In te r n a l Fr e que n cy Comp e n s a tion The LM118 series has internal unity gain frequency compensation. This considerably simplifies its In p ut a n d O utp ut O ve r l oa d Pr ote cte d application since no external components are Pin Comp a tibl e with Ge n e r a l Pur p os e O p necessary for operation. However, unlike most A mp s internally compensated amplifiers, external frequency compensation may be added for optimum performance. For inverting applications, feedforward compensation will boost the slew rate to over 150V/s and almost double the bandwidth. Overcompensation can be used with the amplifier for greater stability when maximum bandwidth is not needed. Further, a single capacitor can be added to reduce the 0.1% settling time to under 1 s. The high speed and fast settling time of these op amps make them useful in A/D converters, oscillators, active filters, sample and hold circuits, or general purpose amplifiers. These devices are easy to apply and offer an order of magnitude better AC performance than industry standards such as the LM709. The LM218-N is identical to the LM118 except that the LM218-N has its performance specified over a 25C to +85C temperature range. The LM318-N is specified from 0C to +70C. Fa s t Vol ta ge Fol l owe r Do not hard-wire as voltage follower (R1 5 k) 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright 19982013, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N SNOSBS8C MARCH 1998REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. A bs ol ute M a ximum Ra tin gs (1 ) (2 ) Supply Voltage 20V Power Dissipation (3) 500 mW Differential Input Current (4) 10 mA Input Voltage (5) 15V Output Short-Circuit Duration Continuous Operating Temperature Range lm118-n 55C to +125C LM218-N 25C to +85C LM318-N 0C to +70C Storage Temperature Range 65C to +150C Lead Temperature (Soldering, 10 sec.) TO-99 Package 300C PDIP Package 260C Soldering Information Dual-In-Line Package Soldering (10 sec.) 260C SOIC Package Vapor Phase (60 sec.) 215C Infrared (15 sec.) 220C ESD Tolerance (6) 2000V (1) Refer to RETS118X for LM118H and LM118J military specifications. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (3) The maximum junction temperature of the lm118-n is 150C, the LM218-N is 110C, and the LM318-N is 110C. For operating at elevated temperatures, devices in the LMC package must be derated based on a thermal resistance of 160C/W, junction to ambient, or 20C/W, junction to case. The thermal resistance of the dual-in-line package is 100C/W, junction to ambient. (4) The inputs are shunted with back-to-back diodes for overvoltage protection. Therefore, excessive current will flow if a differential input voltage in excess of 1V is applied between the inputs unless some limiting resistance is used. (5) For supply voltages less than 15V, the absolute maximum input voltage is equal to the supply voltage. (6) Human body model, 1.5 k in series with 100 pF. El e ctr ica l Cha r a cte r is tics (1 ) Pa r a me te r Con dition s L M 1 1 8 - N / L M 2 1 8 - N L M 3 1 8 - N Un its M in Typ M a x M in Typ M a x Input Offset Voltage T A = 25C 2 4 4 10 mV Input Offset Current T A = 25C 6 50 30 200 nA Input Bias Current T A = 25C 120 250 150 500 nA Input Resistance T A = 25C 1 3 0.5 3 M Supply Current T A = 25C 5 8 5 10 mA Large Signal Voltage Gain T A = 25C, V S = 15V 50 200 25 200 V/mV V OUT = 10V, R L 2 k Slew Rate T A = 25C, V S = 15V, A V = 1 50 70 50 70 V/s (2) Small Signal Bandwidth T A = 25C, V S = 15V 15 15 MHz Input Offset Voltage 6 15 mV Input Offset Current 100 300 nA (1) These specifications apply for 5V V S 20V and 55C T A +125C (lm118-n), 25C T A +85C (LM218-N), and 0C T A
+70C (LM318-N). Also, power supplies must be bypassed with 0.1 F disc capacitors. (2) Slew rate is tested with V S = 15V. The lm118-n is in a unity-gain non-inverting configuration. V IN is stepped from 7.5V to +7.5V and vice versa. The slew rates between 5.0V and +5.0V and vice versa are tested and specified to exceed 50V/s. 2 Submit Documentation Feedback Copyright 19982013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N www.ti.com SNOSBS8C MARCH 1998REVISED MARCH 2013 El e ctr ica l Cha r a cte r is tics (1 ) (con tin ue d) Pa r a me te r Con dition s L M 1 1 8 - N / L M 2 1 8 - N L M 3 1 8 - N Un its M in Typ M a x M in Typ M a x Input Bias Current 500 750 nA Supply Current T A = 125C 4.5 7 mA Large Signal Voltage Gain V S = 15V, V OUT = 10V 25 20 V/mV R L 2 k Output Voltage Swing V S = 15V, R L = 2 k 12 13 12 13 V Input Voltage Range V S = 15V 11.5 11. V 5 Common-Mode Rejection Ratio 80 100 70 100 dB Supply Voltage Rejection Ratio 70 80 65 80 dB Copyright 19982013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N SNOSBS8C MARCH 1998REVISED MARCH 2013 www.ti.com TYPICA L PERFO RM A N CE CHA RA CTERISTICS LM118-N, LM218-N In p ut Cur r e n t Vol ta ge Ga in Figur e 1 . Figur e 2 . Powe r Sup p l y Re je ction In p ut N ois e Vol ta ge Figur e 3 . Figur e 4. Common M ode Re je ction Sup p l y Cur r e n t Figur e 5. Figur e 6. 4 Submit Documentation Feedback Copyright 19982013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N www.ti.com SNOSBS8C MARCH 1998REVISED MARCH 2013 TYPICA L PERFO RM A N CE CHA RA CTERISTICS (con tin ue d) LM118-N, LM218-N Cl os e d L oop O utp ut Imp e da n ce Cur r e n t L imitin g Figur e 7. Figur e 8 . In p ut Cur r e n t Un ity Ga in Ba n dwidth Figur e 9. Figur e 1 0. Vol ta ge Fol l owe r Sl e w Ra te In ve r te r Se ttl in g Time Figur e 1 1 . Figur e 1 2 . Copyright 19982013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N SNOSBS8C MARCH 1998REVISED MARCH 2013 www.ti.com TYPICA L PERFO RM A N CE CHA RA CTERISTICS (con tin ue d) LM118-N, LM218-N L a r ge Sign a l Fr e que n cy Re s p on s e O p e n L oop Fr e que n cy Re s p on s e Figur e 1 3 . Figur e 1 4. Vol ta ge Fol l owe r Pul s e Re s p on s e L a r ge Sign a l Fr e que n cy Re s p on s e Figur e 1 5. Figur e 1 6. O p e n L oop Fr e que n cy Re s p on s e In ve r te r Pul s e Re s p on s e Figur e 1 7. Figur e 1 8 . 6 Submit Documentation Feedback Copyright 19982013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N www.ti.com SNOSBS8C MARCH 1998REVISED MARCH 2013 Typ ica l Pe r f or ma n ce Cha r a cte r is tics LM318-N In p ut Cur r e n t Vol ta ge Ga in Figur e 1 9. Figur e 2 0. Powe r Sup p l y Re je ction In p ut N ois e Vol ta ge Figur e 2 1 . Figur e 2 2 . Common M ode Re je ction Sup p l y Cur r e n t Figur e 2 3 . Figur e 2 4. Copyright 19982013, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N SNOSBS8C MARCH 1998REVISED MARCH 2013 www.ti.com Typ ica l Pe r f or ma n ce Cha r a cte r is tics (con tin ue d) LM318-N Cl os e d L oop O utp ut Imp e da n ce Cur r e n t L imitin g Figur e 2 5. Figur e 2 6. In p ut Cur r e n t Un ity Ga in Ba n dwidth Figur e 2 7. Figur e 2 8 . Vol ta ge Fol l owe r Sl e w Ra te In ve r te r Se ttl in g Time Figur e 2 9. Figur e 3 0. 8 Submit Documentation Feedback Copyright 19982013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N www.ti.com SNOSBS8C MARCH 1998REVISED MARCH 2013 Typ ica l Pe r f or ma n ce Cha r a cte r is tics (con tin ue d) LM318-N L a r ge Sign a l Fr e que n cy Re s p on s e O p e n L oop Fr e que n cy Re s p on s e Figur e 3 1 . Figur e 3 2 . Vol ta ge Fol l owe r Pul s e Re s p on s e L a r ge Sign a l Fr e que n cy Re s p on s e Figur e 3 3 . Figur e 3 4. O p e n L oop Fr e que n cy Re s p on s e In ve r te r Pul s e Re s p on s e Figur e 3 5. Figur e 3 6. Copyright 19982013, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N SNOSBS8C MARCH 1998REVISED MARCH 2013 www.ti.com A UXIL IA RY CIRCUITS Figur e 3 9. O f f s e t Ba l a n cin g *Balance circuit necessary for increased slew. Slew rate typically 150V/s. Figur e 3 7. Fe e df or wa r d Comp e n s a tion f or Gr e a te r In ve r tin g Sl e w Ra te Figur e 40. Is ol a tin g L a r ge Ca p a citive L oa ds Figur e 41 . O ve r comp e n s a tion Slew and settling time to 0.1% for a 10V step change is 800 ns. Figur e 3 8 . Comp e n s a tion f or M in imum Se ttl in g Time 10 Submit Documentation Feedback Copyright 19982013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N www.ti.com SNOSBS8C MARCH 1998REVISED MARCH 2013 TYPICA L A PPL ICA TIO N S Do not hard-wire as voltage follower (R1 5 k) Figur e 42 . Fa s t Vol ta ge Fol l owe r C F = Large (C F 50 pF) *Do not hard-wire as integrator or slow inverter; insert a 10k-5 pF network in series with the input, to prevent oscillation. Do not hard-wire as voltage follower (R1 5 k) Figur e 43 . Figur e 45. Dif f e r e n tia l A mp l if ie Figur e 44. Fa s t Summin g A mp l if ie r Copyright 19982013, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N SNOSBS8C MARCH 1998REVISED MARCH 2013 www.ti.com Figur e 46. Fa s t Sa mp l e a n d Hol d *OptionalReduces settling time. Figur e 47. D/ A Con ve r te r Us in g L a dde r N e twor k 12 Submit Documentation Feedback Copyright 19982013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N www.ti.com SNOSBS8C MARCH 1998REVISED MARCH 2013 Output zero. *Y zero +X zero Full scale adjust. Figur e 48 . Four Qua dr a n t M ul tip l ie r *OptionalReduces settling time. Figur e 49. D/ A Con ve r te r Us in g Bin a r y We ighte d N e twor k Copyright 19982013, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N SNOSBS8C MARCH 1998REVISED MARCH 2013 www.ti.com Figur e 50. Fa s t Summin g A mp l if ie r with L ow In p ut Cur r e n t Figur e 51 . We in Br idge Sin e Wa ve O s cil l a tor Figur e 52 . In s tr ume n ta tion A mp l if ie r 14 Submit Documentation Feedback Copyright 19982013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N www.ti.com SNOSBS8C MARCH 1998REVISED MARCH 2013 Sche ma tic Dia gr a m Copyright 19982013, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N SNOSBS8C MARCH 1998REVISED MARCH 2013 www.ti.com Pin Dia gr a m Available per JM38510/10107. Available per JM38510/10107. Dua l - In - L in e Pa cka ge (Top Vie w) Dua l - In - L in e Pa cka ge Se e Pa cka ge N umbe r J (R- GDIP- T1 4) (Top Vie w) Se e Pa cka ge N umbe r N A B008 A , D (R- PDSO - G8 ), or P (R- PDIP- T8 ) Pin connections shown on schematic diagram and typical applications are for TO-99 package. TO - 99 Pa cka ge (Top Vie w) Se e Pa cka ge N umbe r L M C (O - M BCY- W8 ) 16 Submit Documentation Feedback Copyright 19982013, Texas Instruments Incorporated Product Folder Links: LM118-N LM218-N LM318-N L M 1 1 8 - N , L M 2 1 8 - N , L M 3 1 8 - N www.ti.com SNOSBS8C MARCH 1998REVISED MARCH 2013 REVISIO N HISTO RY Cha n ge s f r om Re vis ion B (M a r ch 2 01 3 ) to Re vis ion C Pa ge Changed layout of National Data Sheet to TI format .......................................................................................................... 16 Copyright 19982013, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Links: LM118-N LM218-N LM318-N PACKAGE OPTION ADDENDUM www.ti.com 12-Jul-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (C) Device Marking (4/5) Samples LM118H ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 LM118H LM118H/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM118H LM318M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM 318M LM318M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 318M LM318MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 318M LM318N LIFEBUY PDIP P 8 40 TBD Call TI Call TI 0 to 70 LM 318N LM318N/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM 318N
(1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM www.ti.com 12-Jul-2014 Addendum-Page 2 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
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TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant LM318MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM318MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per J ESD46, latest issue, and to discontinue any product or service per J ESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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