Conunulng..

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Manufacture of RIGID Laminate
Formulate resin mix + solvents
Select glass cloth
Coat glass cloth with resin
Remove solvents by drying
Prepreg
B-stage resin
Lay copper foil on prepreg sheet
Press together at 400-700 psi pressure and 180 C
Slowly cool and cut to size
Simple Multilayer Press
!"#$ &'()*+, (-.-'/-
ressure Cauge
Semngs panel
SS laLe 1op
SS laLe 8ouom
Cll coollng
Mululayer press [ CLu1
8lgld LamlnaLes
Core Laminate thicknesses:
0.8mm; 1.6mm; 3.2mm
Copper thicknesses:
8micron; 18um; 35um
So, how is FR4 substrate dielectric prepared?
FR4 is a glass fiber epoxy laminate. It is the most commonly used PCB
material. 0.8mm FR4 grade uses 4 layers of (7628) glass fiber material.

Isn't FR4 green in color?
No, it is usually transparent. The green color comes from the solder mask
in the PCB finished product
Different grades of prepreg:
e.g. 7628 (200g/sqm) is 0.19mm
thick
8 layers of such are used for a
1.6mm FR4 type laminate
Another e.g. 2125 (88gms) is
0.10mm thick

Type

106
1080
2112
2113
2125
2116
7628

Weight [g/
m!]
25
49
70
83
88
108
200

Thickness
[mm]
0.050
0.065
0.090
0.100
0.100
0.115
0.190

8oard labrlcauon rocess
! know Lhe safeLy procedures before enLerlng Lhe lab/ work
spoL
! 8lghL Lo know abouL MaLerlals SafeLy
! 8ead Lhe MaLerlals SafeLy uaLa SheeL
! lollow Clean 8oom work procedures
! Make sure re ghung equlpmenL ls ln place
! Make sure Lhe nearesL healLh cenLre/ securlLy Lelephone
numbers are made avallable Lo all personnel ln Lhe lab/ work
spoL
Worklng ln a clean room envlronmenL- a shorL vldeo
8CA8u 8LA8A1lCn or Su8lACL 8LA8A1lCn
CLu1
8CA8u Su8lACL 8LA8A1lCn- A SPC81 vluLC
lmaglng
Appllcauon of phoLoreslsL, dry or weL lm dependlng on
deslgn requlremenL
llghL sensluve maLerlal, shorL sLorage llfe
cross-llnklng of polymerlc maLerlal, requlres lnluaLor
WeL lm: ulp coaung, Spln coaung, CurLaln coaung, Menlscus
coaung
ury lm: vacuum lamlnaLor
AdvanLages of dry lm over weL lm, vlce-versa
uu onL and Clba among many oLhers
MMA, v based, uC (dlazoqulnones),
Su-8 eLc (epoxy based), novolac
SolvenL: Crganlc or Aqueous based
Lxamples of lmaglng
uslng a phoLoreslsL
!"#$, 0) !(12- 3"(4 56+*1
o use Lhe rlghL comblnauon of negauve or posluve mask along wlLh a negauve
or posluve reslsL as Lhe appllcauon may requlre.
Substrate Copper clad Photoresist coated Cu
Use mask and expose to UV
Pattern protected Etch away unwanted Cu
Photoresist application and Patterning Circuit