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RAS 300 Power Amplifier

Introduction
This power amplifier was born in November 2008 after the needs of two Turkish
friends Gokhan and Orsoy. Although the amplifier seems very complex at first glance
the design is fairly simple and straight forward.
It was decided to split the amplifier in two halves, the first consisting of the input and
driver while the second half consists of all the output transistors for easy mounting
directly onto a heat sink.

Important Issues
This amplifier is capable of more 1000 watts peak into 4 Ohm (70V supply) and it is
important to note this when calculating fuse and wire size for internal wiring.
Furthermore, a class AB amplifier could dissipate a lot of heat and you need to make
sure that you have adequate heat sink to dissipate this heat.
Rod Eliot has an excellent paper regarding heat sink requirements on his web site and
really worth checking out. http://sound.westhost.com/heatsinks.htm
The other issue is that of power supply, reservoir capacitors and ground wiring. The
better the power supply, the better the sound quality.

Predicted Performance
The characteristic performance of this amplifier has been acquired by means of
simulation only and some graphs illustrating the typical characteristics are available at
the end of this paper. From these graphs we can see the following:
Output power 4
8

372 watt rms


205 watt rms

THD

0.0064% @ 1 kHz into 8 Ohms


0.0008% @ 1 kHz into 4 Ohms

Frequency Response
Phase deviation
Bias Current
Operating Voltage

2Hz to 260 kHz (-3dB)


14 degrees 20 Hz 20 kHz
1.3 Amp
30 70 VDC

Slew Rate

20V/uS

Note all derivatives are at just before the onset of clipping.


Description
The amplifier is a full complimentary symmetry design from beginning to end, this
balancing I have found the most suitable for reproducing music.
The input is shared by two long tail pairs of opposite polarity and it is important to
match them as well as one could

I used a very unique constant current sources that was introduced to me by Alex
Miguel which provided very stable and low constant impedance sources. Each of the
long tail pairs are running at 1.2 mA and optimised.
An offset adjust was provided degeneration resistors as well for in case the transistors
used are not that well matched.
The VAS is a dual complimentary Darlington pair with a bias current of about 11mA.
I simple 1 k multi-turn pot is used to set the gain, which I kept a low value so
accidental over bias will not damage the amp in any way. There is no reason that you
cannot bias this amp into class A, one just need to take not that the dissipation would
about double.
The power transistors are spread over a long PCB and intended to be fitted to a
complete heat sink assembly, this make the amplifier somewhat modular and easy to
work on.
There is nothing of critical nature in this amp so built correctly it should fire up
working the first time round.

Protection
Keep in mind that there is no protection of the amp in anyway. My simpler units have
run for about ten years never giving a problem. If you are concerned with speaker and
output protection there are many articles that you can research.

Completeness
For the sake of completeness I have attached datasheets of the semiconductors used.

300watt power amp.lsp


Ref
Qty
Name
Package
---------------------------------------C15
2
1000u
63V
C16
---------------------------------------C17
3
100n
5_0 mm
C18
C22
---------------------------------------VR2
1
100R 10T
G
---------------------------------------C11
2
100u
16V
C12
---------------------------------------C14
1
10u
35V
---------------------------------------R19
2
120E
250mW
R28
---------------------------------------R36
2
150E
250mW
R37
---------------------------------------R32
1
1K0
250mW
---------------------------------------R29
2
1K2
250mW
R30
---------------------------------------VR1
1
1K 10T
G
---------------------------------------J2
1
2 Way Pin
DSC
---------------------------------------R21
4
22E
250mW
R22
R23
R24
---------------------------------------R38
1
22K
250mW
---------------------------------------R31
1
27K
250mW
---------------------------------------Q9
2
2SA970
TO-92
Q10
---------------------------------------Q11
2
2SC2240
TO-92
Q12
---------------------------------------R1
4
3K3
250mW
R2
R34
R35
---------------------------------------C21
1
470u
16V
---------------------------------------R39
1
560E
250mW
---------------------------------------C2
1
5p6
5_0 mm
---------------------------------------R17
2
68K
250mW
R26
---------------------------------------C19
2
68p
5_0 mm
C20
---------------------------------------R18
2
6K8
250mW
R27
---------------------------------------J1
1
8191-6
DSC
---------------------------------------Page 1

300watt power amp.lsp


Q21
1
MJE340
TO-126
---------------------------------------Q22
1
MJE350
TO-126
---------------------------------------Q16
4
MPSA42
TO-92
Q17
Q18
Q19
---------------------------------------Q13
4
MPSA92
TO-92
Q14
Q15
Q20
----------------------------------------

Page 2

RAS 300 Driver Board R02

RAS 300 Driver Board R02

V-NEG

V-POS

RAS350 OUTPUT STAGE

300watt power amp O-P.lsp


Ref
Qty
Name
Package
---------------------------------------R9
12
0E22
2 Watt
R10
R11
R12
R13
R14
R15
R16
R21
R22
R23
R24
---------------------------------------REF1
1
0V
---------------------------------------C24
1
150n
DSC
---------------------------------------D8
2
1N4007
DSC
D9
---------------------------------------Q1
6
2SJ162
TOP-3P
Q2
Q3
Q4
Q9
Q11
---------------------------------------Q5
6
2SK1058
TO-3P
Q6
Q7
Q8
Q10
Q12
---------------------------------------R1
12
470E
500mW
R2
R3
R4
R5
R6
R7
R8
R17
R18
R19
R20
---------------------------------------J1
1
8191-5
DSC
----------------------------------------

Page 1

300W MOSFET AMP.CIR

80.000

40.000

0.000

-40.000

-80.000

-120.000

10
db(v(OUT))

100

1K

10K

100K

1M

10M

100M

100K

1M

10M

100M

F (Hz)
300.000

150.000

0.000

-150.000

-300.000

-450.000

10
100
ph(v(OUT)) (Degrees)

1K

10K
F (Hz)

10K
1K
100
10
1000m
100m
10m
1m
100u
10u
1u

300W MOSFET AMP.CIR

Amplitude of V(OUT) vs Frequency

1.000K
2.000K
HARM(V(OUT))

3.000K

4.000K

5.000K

6.000K

7.000K

8.000K

9.000K

10.000K

F (Hz)
0.00125

Cumulative Percent Distortion of V(OUT) vs Frequency

0.00100
0.00075
0.00050
0.00025
0.00000

1.000K
2.000K
3.000K
THD(HARM(V(OUT)),1000) (%)

4.000K

5.000K

6.000K

7.000K

8.000K

9.000K

10.000K

F (Hz)
75.000

Sampled Waveform V(OUT) vs T

50.000
25.000
0.000
-25.000
-50.000

0.000m
V(OUT) (V)

1.000m

2.000m
T (Secs)

3.000m

4.000m

5.000m

300W MOSFET AMP.CIR

90.000
60.000
30.000

108.907

0.000
-30.000
-60.000

0.000m
v(OUT) (V)

0.200m

0.400m

0.600m

0.800m

1.000m

0.600m

0.800m

1.000m

T (Secs)
600.000
480.000

997.698u,372.713
360.000
240.000
120.000
0.000

0.000m
RMS(v(r52))*RMS(i(R52))

0.200m

0.400m
T (Secs)

20.000
16.000
12.000
8.000

13.621

13.642

4.000
0.000

0.000m
0.200m
0.400m
0.600m
I(R97)+I(R98)+I(R99)+I(R100)+I(R126)+I(R127) I(R101)+I(R102)+I(R103)+I(R104)+I(R128)+I(R129)
T (Secs)

0.800m

1.000m

2SJ160, 2SJ161, 2SJ162


Silicon P-Channel MOS FET

Application
Low frequency power amplifier
Complementary pair with 2SK1056, 2SK1057 and 2SK1058

Features

Good frequency characteristic


High speed switching
Wide area of safe operation
Enhancement-mode
Good complementary characteristics
Equipped with gate protection diodes
Suitable for audio power amplifier

2SJ160, 2SJ161, 2SJ162


Outline

TO-3P

D
1

3
1. Gate
2. Source
(Flange)
3. Drain

Absolute Maximum Ratings (Ta = 25C)


Item
Drain to source voltage

2SJ160

Symbol

Ratings

Unit

VDSX

120

2SJ161

140

2SJ162

160

Gate to source voltage

VGSS

15

Drain current

ID

Body to drain diode reverse drain current

I DR

Channel dissipation

Pch*

100

Channel temperature

Tch

150

Storage temperature

Tstg

55 to +150

Note:

1. Value at TC = 25C

2SJ160, 2SJ161, 2SJ162


Electrical Characteristics (Ta = 25C)
Item

Symbol Min
V(BR)DSX

Typ

Max

Unit

Test conditions

120

I D = 10 mA , VGS = 10 V

Drain to source

2SJ160

breakdown voltage

2SJ161

140

2SJ162

160

Gate to source breakdown


voltage

V(BR)GSS

15

I G = 100 A, VDS = 0

Gate to source cutoff voltage

VGS(off)

0.15

1.45

I D = 100 mA, VDS = 10 V

Drain to source saturation


voltage

VDS(sat)

12

I D = 7 A, VGD = 0*1

Forward transfer admittance

|yfs|

0.7

1.0

1.4

I D = 3 A, VDS = 10 V*1

Input capacitance

Ciss

900

pF

VGS = 5 V, VDS = 10V,

Output capacitance

Coss

400

pF

f = 1 MHz

Reverse transfer capacitance

Crss

40

pF

Turn-on time

t on

230

ns

Turn-off time

t off

110

ns

Note:

VDD = 20 V, ID = 4 A

1. Pulse test

2SJ160, 2SJ161, 2SJ162


Maximum Safe Operation Area

Power vs. Temperature Derating


20

150

10
ms
1

Sh

Sh

ot)

=
(T C

s(

(1

ot

25

1.0

Drain Current ID (A)

tio

(120 V, 0.83 A)

(140 V, 0.71 A)
(160 V, 0.63 A)
2SJ160
2SJ161
2SJ162

0.5

0.2
5

150

Typical Output Characteristics

Typical Transfer Characteristics


1.0

TC = 25C

VDS = 10 V

9
7

6
5

Pch

0W

3
2

= 10

0.8
Drain Current ID (A)

75

10

10 20
50 100 200 500
Drain to Source Voltage VDS (V)

25
C
25

50
100
Case Temperature TC (C)

Drain Current ID (A)

PW

ra

50

e
Op

100

ID max (Continuous)
PW
(14.3 V,
5 7 A)
=
10
0
m

DC

Channel Dissipation Pch (W)

Ta = 25C
10

0.6

0.4

0.2

2
1 V
VGS = 0

10
30
40
20
50
Drain to Source Voltage VDS (V)

0.4
1.2
1.6
2.0
0.8
Gate to Source Voltage VGS (V)

10
5

2
1.0
0.5

75

10

10

25

Drain to Source Saturation Voltage


vs. Drain Current
VGD = 0

25
TC

Input Capacitance vs.


Gate to Source Voltage

VDS = 10 V
f = 1 MHz
4
2
6
8
Gate to Source Voltage VGS (V)

10

3.0
1.0
0.3
0.1
0.03
0.01
0.003
10 k

Drain to Source Voltage VDS (V)


Forward Transfer Admittance yfs (S)

0.2

0.1
0.1 0.2
0.5 1.0 2
Drain Current ID (A)

100

200

500

1,000

Drain to Source Saturation Voltage VDS (sat) (V)


Input Capacitance Ciss (pF)

2SJ160, 2SJ161, 2SJ162


Drain to Source Voltage vs.
Gate to Source Voltage

2
ID = 1 A

10 M

2
6
8
4
10
Gate to Source Voltage VGS (V)

3M

Forward Transfer Admittance


vs. Frequency

TC = 25C
VDS = 10 V
ID = 2 A
30 k 100 k 300 k 1 M
Frequency f (Hz)

2SJ160, 2SJ161, 2SJ162


Switching Time vs. Drain Current

Switching Time ton, toff (ns)

500

200

ton

100
50

toff

20
10
5
0.1 0.2

0.5 1.0 2
Drain Current ID (A)

Switching Time Test Circuit

10

Waveforms

Output
10%

RL
Input

Input
90%
ton

PW = 50 s
duty ratio
= 1%

20 V

toff

90%

50
Output
10%

15.6 0.3

1.5

0.3

19.9 0.2

2.0

14.9 0.2

0.5

1.0

3.2 0.2

5.0 0.3

Unit: mm
4.8 0.2

1.6
2.0

1.4 Max

18.0 0.5

2.8

1.0 0.2

3.6

5.45 0.5

0.6 0.2

0.9
1.0

5.45 0.5
Hitachi Code
JEDEC
EIAJ
Weight (reference value)

TO-3P

Conforms
5.0 g

2SK1056, 2SK1057, 2SK1058


Silicon N-Channel MOS FET

Application
Low frequency power amplifier
Complementary pair with 2SJ160, 2SJ161 and 2SJ162

Features

Good frequency characteristic


High speed switching
Wide area of safe operation
Enhancement-mode
Good complementary characteristics
Equipped with gate protection diodes
Suitable for audio power amplifier

2SK1056, 2SK1057, 2SK1058


Outline

TO-3P

D
1

3
1. Gate
2. Source
(Flange)
3. Drain

Absolute Maximum Ratings (Ta = 25C)


Item
Drain to source voltage

2SK1056

Symbol

Ratings

Unit

VDSX

120

2SK1057

140

2SK1058

160

Gate to source voltage

VGSS

15

Drain current

ID

Body to drain diode reverse drain current

I DR

Channel dissipation

Pch*

100

Channel temperature

Tch

150

Storage temperature

Tstg

55 to +150

Note:

1. Value at TC = 25C

2SK1056, 2SK1057, 2SK1058


Electrical Characteristics (Ta = 25C)
Item

Symbol Min

Drain to source

2SK1056 V(BR)DSX

120

breakdown voltage

2SK1057

140

2SK1058

160

Typ

Max

Unit

Test conditions

I D = 10 mA, VGS = 10 V

Gate to source breakdown


voltage

V(BR)GSS

15

I G = 100 A, VDS = 0

Gate to source cutoff voltage

VGS(off)

0.15

1.45

I D = 100 mA, VDS = 10 V

Drain to source saturation


voltage

VDS(sat)

12

I D = 7 A, VGD = 0 *1

Forward transfer admittance

|yfs|

0.7

1.0

1.4

I D = 3 A, VDS = 10 V *1

Input capacitance

Ciss

600

pF

VGS = 5 V, VDS = 10 V,

Output capacitance

Coss

350

pF

f = 1 MHz

Reverse transfer capacitance

Crss

10

pF

Turn-on time

t on

180

ns

Turn-off time

t off

60

ns

Note:

VDD = 20 V, ID = 4 A,

1. Pulse test

2SK1056, 2SK1057, 2SK1058


Maximum Safe Operation Area

Power vs. Temperature Derating


20

Ta = 25C

100

tio

ra

pe

(T C

)
C

25

50

ID max (Continuous)
P PW
5
PW W = = 1
10 0 m
=
0 s
1
m 1
s
s sh
1
2
1 ot
sh
sh
ot
ot
1.0
O

Drain Current ID (A)

10

C
D

0.5
2SK1056
0

50
100
Case Temperature TC (C)

0.2
5

150

Typical Output Characteristics


1.0
TC = 25C

7
6

5
4

Pch =

100 W

VDS = 10 V

C=

0.8

VGS = 10 V
9
8

Drain Current ID (A)

Drain Current ID (A)

500
10
20
50 100 200
Drain to Source Voltage VDS (V)

Typical Transfer Characteristics

10

2SK1057
2SK1058

2
5C
25
75

Channel Dissipation Pch (W)

150

0.6

0.4

0.2
2
1
0

10
20
40
50
30
Drain to Source Voltage VDS (V)

0.4
0.8
1.6
2.0
1.2
Gate to Source Voltage VGS (V)

2SK1056, 2SK1057, 2SK1058


Drain to Source Voltage vs.
Gate to Source Voltage

Drain to Source Saturation


Voltage vs. Drain Current

VGD = 0

25

75

10

TC

25

Drain to Source Voltage VDS (V)

Drain to Source Saturation Voltage


VDS (on) (V)

10

2
1.0
0.5

0.2
0.1
0.1

0.2

0.5 1.0
2
Drain Current ID (A)

6
5A
4

10

Input Capacitance vs. Gate


Source Voltage

500

200
VDS = 10 V
f = 1 MHz
100
0

2
4
6
8
10
Gate to Source Voltage VGS (V)

2A
ID = 1 A
6
2
4
8
10
Gate to Source Voltage VGS (V)

Forward Transfer Admittance


vs. Frequency
Forward Transfer Admittance yfs (S)

Input Capacitance Ciss (pF)

1000

TC = 25C

3.0
1.0
0.3
0.1
0.03
0.01
0.003
10 k

TC = 25C
VDS = 10 V
ID = 2 A

30 k 100 k 300 k 1 M 3 M
Frequency f (Hz)

10 M

2SK1056, 2SK1057, 2SK1058


Switching Time vs. Drain Current

Switching Time ton,toff (ns)

500
t on

200
100
50

t off
20
10
5
0.1

0.2

0.5 1.0
2
Drain Current ID (A)

10

Switching Time Test Circuit


Output
RL= 2
Input

PW = 50s
duty ratio
=1%

20 V

50

Waveforms
90 %
Input
10 %
t on

t off
10 %

Output

90 %

15.6 0.3

1.5

0.3

19.9 0.2

2.0

14.9 0.2

0.5

1.0

3.2 0.2

5.0 0.3

Unit: mm
4.8 0.2

1.6
2.0

1.4 Max

18.0 0.5

2.8

1.0 0.2

3.6

5.45 0.5

0.6 0.2

0.9
1.0

5.45 0.5
Hitachi Code
JEDEC
EIAJ
Weight (reference value)

TO-3P

Conforms
5.0 g

2SA970
TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT process)

2SA970
Low Noise Audio Amplifier Applications

Unit: mm

Low noise : NF = 3dB (typ.) RG = 100 , VCE = 6 V, IC = 100 A,


f = 1 kHz
: NF = 0.5dB (typ.) RG = 1 k, VCE = 6 V, IC = 100 A,
f = 1 kHz

High DC current gain: hFE = 200~700

High breakdown voltage: VCEO = 120 V

Low pulse noise. Low 1/f noise

Maximum Ratings (Ta = 25C)


Characteristics

Symbol

Rating

Unit

Collector-base voltage

VCBO

-120

Collector-emitter voltage

VCEO

-120

Emitter-base voltage

VEBO

-5

Collector current

IC

-100

mA

Base current

IB

-20

mA

JEDEC

TO-92

Collector power dissipation

PC

300

mW

JEITA

SC-43

Junction temperature

Tj

125

TOSHIBA

2-5F1B

Tstg

-55~125

Weight: 0.21 g (typ.)

Storage temperature range

Electrical Characteristics (Ta = 25C)


Characteristics

Symbol

Test Condition

Min

Typ.

Max

Unit

Collector cut-off current

ICBO

VCB = -120 V, IE = 0

-0.1

mA

Emitter cut-off current

IEBO

VEB = -5 V, IC = 0

-0.1

mA

V (BR) CEO

IC = -1 mA, IB = 0

-120

VCE = -6 V, IC = -2 mA

200

700

VCE (sat)

IC = -10 mA, IB = -1 mA

-0.3

Base-emitter voltage

VBE

VCE = -6 V, IC = -2 mA

0.65

Transition frequency

fT

VCE = -6 V, IC = -1 mA

100

MHz

VCB = -10 V, IE = 0, f = 1 MHz

4.0

pF

VCE = -6 V, IC = -0.1 mA, f = 10 Hz,


RG = 10 kW

VCE = -6 V, IC = -0.1 mA, f = 1 kHz,


RG = 10 kW

VCE = -6 V, IC = -0.1 mA, f = 1 kHz,


RG = 100 W

Collector-emitter breakdown voltage

hFE

DC current gain

(Note)
Collector-emitter saturation voltage

Collector output capacitance

Noise figure

Note: hFE classification

Cob

NF

dB

GR: 200~400, BL: 350~700

2003-03-24

2SA970

2003-03-24

2SA970

2003-03-24

 

Order this document


by MJE340/D

SEMICONDUCTOR TECHNICAL DATA



  


 

0.5 AMPERE
POWER TRANSISTOR
NPN SILICON
300 VOLTS
20 WATTS

. . . useful for highvoltage general purpose applications.


Suitable for Transformerless, LineOperated Equipment
Thermopad Construction Provides High Power Dissipation Rating for High
Reliability

CASE 7708
TO225AA TYPE

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

VCEO

300

Vdc

VEB

3.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Power Dissipation @ TC = 25_C


Derate above 25_C

PD

20
0.16

Watts
W/_C

TJ, Tstg

65 to + 150

_C

Symbol

Max

Unit

JC

6.25

_C/W

CollectorEmitter Voltage
EmitterBase Voltage

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS

Characteristic

Thermal Resistance, Junction to Case

ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

VCEO(sus)

300

Vdc

Collector Cutoff Current


(VCB = 300 Vdc, IE = 0)

ICBO

100

Adc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

100

Adc

hFE

30

240

OFF CHARACTERISTICS

CollectorEmitter Sustaining Voltage


(IC = 1.0 mAdc, IB = 0)

ON CHARACTERISTICS

DC Current Gain
(IC = 50 mAdc, VCE = 10 Vdc)

REV 7

Motorola, Inc. 1995


Motorola Bipolar Power Transistor Device Data

MJE340
32

1.0

PD, POWER DISSIPATION (WATTS)

28

TJ = 25C

0.8
V, VOLTAGE (VOLTS)

24
20
16
12

VBE @ VCE = 10 V

0.6

0.4
VCE(sat) @ IC/IB = 10

MJE340

8.0

0.2

4.0
0

VBE(sat) @ IC/IB = 10

IC/IB = 5.0
20

40

80

60

100

120

0
10

160

140

20

TC, CASE TEMPERATURE (C)

30
50
100
200
IC, COLLECTOR CURRENT (mA)

300

500

Figure 2. On Voltages

Figure 1. Power Temperature Derating

ACTIVEREGION SAFE OPERATING AREA

IC, COLLECTOR CURRENT (AMP)

1.0
10 s

0.5
0.3

500 s

TJ = 150C
dc

0.2

1.0 ms

0.1
0.05

SECOND BREAKDOWN LIMIT


BONDING WIRE LIMIT
THERMAL LIMIT TC = 25C
SINGLE PULSE

0.03
0.02
0.01
10

50
70 100
200
20
30
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

300

Figure 3. MJE340
There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown.
Safe operating area curves indicate IC VCE limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate.
The data of Figure 3 is based on T J(pk) = 150_C; TC is variable depending on conditions. Second breakdown pulse limits are
valid for duty cycles to 10% provided T J(pk)
150_C. At high case temperatures, thermal limitations will reduce the power that
can be handled to values less than the limitations imposed by second breakdown.

300

hFE , DC CURRENT GAIN

200

VCE = 10 V
VCE = 2.0 V
TJ = 150C

100
70

+100C

50
+ 25C
30
20

10

55C

1.0

2.0

3.0

5.0

7.0

10

20
30
50
IC, COLLECTOR CURRENT (mAdc)

70

100

200

300

500

Figure 4. DC Current Gain


2

Motorola Bipolar Power Transistor Device Data

MJE340
PACKAGE DIMENSIONS

B
U

Q
A

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

C
M

1 2 3

V
G
S

R
0.25 (0.010)

D 2 PL
0.25 (0.010)

DIM
A
B
C
D
F
G
H
J
K
M
Q
R
S
U
V

INCHES
MIN
MAX
0.425
0.435
0.295
0.305
0.095
0.105
0.020
0.026
0.115
0.130
0.094 BSC
0.050
0.095
0.015
0.025
0.575
0.655
5 _ TYP
0.148
0.158
0.045
0.055
0.025
0.035
0.145
0.155
0.040

MILLIMETERS
MIN
MAX
10.80
11.04
7.50
7.74
2.42
2.66
0.51
0.66
2.93
3.30
2.39 BSC
1.27
2.41
0.39
0.63
14.61
16.63
5 _ TYP
3.76
4.01
1.15
1.39
0.64
0.88
3.69
3.93
1.02

STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. BASE

CASE 7708
TO225AA TYPE
ISSUE V

Motorola Bipolar Power Transistor Device Data

ON Semiconductor 

MJE350

Plastic Medium Power PNP


Silicon Transistor
. . . designed for use in lineoperated applications such as low
power, lineoperated series pass and switching regulators requiring
PNP capability.

0.5 AMPERE
POWER TRANSISTOR
PNP SILICON
300 VOLTS
20 WATTS

High CollectorEmitter Sustaining Voltage

VCEO(sus) = 300 Vdc @ IC


= 1.0 mAdc
Excellent DC Current Gain
hFE = 30240 @ IC
= 50 mAdc
Plastic Thermopad Package

STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. BASE

3 2
1

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

VCEO

300

Vdc

VEB

3.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Power Dissipation @ TC = 25C


Derate above 25C

PD

20
0.16

Watts
W/C

TJ, Tstg

65 to +150

C

Symbol

Max

Unit

JC

6.25

C/W

CollectorEmitter Voltage
EmitterBase Voltage

Operating and Storage Junction Temperature


Range

CASE 7709
TO225AA TYPE

THERMAL CHARACTERISTICS
Characteristic

Thermal Resistance, Junction to Case

ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

VCEO(sus)

300

Vdc

Collector Cutoff Current


(VCB = 300 Vdc, IE = 0)

ICBO

100

Adc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

100

Adc

hFE

30

240

OFF CHARACTERISTICS

CollectorEmitter Sustaining Voltage


(IC = 1.0 mAdc, IB = 0)

ON CHARACTERISTICS

DC Current Gain
(IC = 50 mAdc, VCE = 10 Vdc)

Semiconductor Components Industries, LLC, 2002

April, 2002 Rev. 12

Publication Order Number:


MJE350/D

MJE350

hFE , DC CURRENT GAIN

100

1.0

TJ = 150C

TJ = 25C
0.8

25C

V, VOLTAGE (VOLTS)

200

70
50

-55C

30
20

VCE = 2.0 V
VCC = 10 V

10
5.0 7.0 10

VBE(sat) @ IC/IB = 10

0.6

VBE @ VCE = 10 V

0.4

IC/IB = 10

0.2
VCE(sat)

200
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

300

500

5.0 7.0

10

IC, COLLECTOR CURRENT (mA)

1000
700
500
300

100s
dc

200
100
70
50
30
20
10
20

20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

200 300

500

Figure 2. On Voltages

1.0ms
500s
TJ = 150C
BONDING WIRE LIMITED
THERMALLY LIMITED @ TC = 25C
SECOND BREAKDOWN LIMITED

V, TEMPERATURE COEFFICIENTS (mV/C)

Figure 1. DC Current Gain

IC/IB = 5.0

50
100
200
30
70
300 400
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)

+1.2
+0.8

*APPLIES FOR IC/IB < hFE/4

+0.4
0

*VC for VCE(sat)

-0.4
-0.8

+100C to +150C
+25C to +100C

-55C to +25C
+25C to +150C

-1.2
-1.6

VB for VBE

-2.0

-55C to +25C

-2.4
-2.8
5.0 7.0

Figure 3. ActiveRegion Safe Operating Area

10

20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

200 300

500

Figure 4. Temperature Coefficients

20
PD, POWER DISSIPATION (WATTS)

There are two limitations on the power handling ability of


a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate IC VCE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 3 is based on T J(pk) = 150C; TC is
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided T J(pk)
 150C. At high case temperatures, thermal limitations
will reduce the power that can be handled to values less than
the limitations imposed by second breakdown.

16
12

8.0
4.0
0

20

40
60
80
100
120
TC, CASE TEMPERATURE (C)

Figure 5. Power Derating

http://onsemi.com
2

140

160

MJE350
PACKAGE DIMENSIONS

TO225
CASE 7709
ISSUE W
B
U

Q
A

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

C
M

1 2 3

V
G
S

R
0.25 (0.010)

D 2 PL
0.25 (0.010)

STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. BASE

http://onsemi.com
3

DIM
A
B
C
D
F
G
H
J
K
M
Q
R
S
U
V

INCHES
MIN
MAX
0.425
0.435
0.295
0.305
0.095
0.105
0.020
0.026
0.115
0.130
0.094 BSC
0.050
0.095
0.015
0.025
0.575
0.655
5  TYP
0.148
0.158
0.045
0.065
0.025
0.035
0.145
0.155
0.040
---

MILLIMETERS
MIN
MAX
10.80
11.04
7.50
7.74
2.42
2.66
0.51
0.66
2.93
3.30
2.39 BSC
1.27
2.41
0.39
0.63
14.61
16.63
5  TYP
3.76
4.01
1.15
1.65
0.64
0.88
3.69
3.93
1.02
---






Order this document


by MPSA42/D

SEMICONDUCTOR TECHNICAL DATA

  




NPN Silicon

*Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER

MAXIMUM RATINGS

Rating

Symbol

MPSA42

MPSA43

Unit

Collector Emitter Voltage

VCEO

300

200

Vdc

Collector Base Voltage

VCBO

300

200

Vdc

Emitter Base Voltage

VEBO

6.0

6.0

CASE 2911, STYLE 1


TO92 (TO226AA)

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/mW

Thermal Resistance, Junction to Case

RqJC

83.3

C/mW

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

300
200

300
200

6.0

0.1
0.1

0.1
0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
MPSA42
MPSA43
V(BR)CBO
MPSA42
MPSA43

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 200 Vdc, IE = 0)
(VCB = 160 Vdc, IE = 0)

MPSA42
MPSA43

Emitter Cutoff Current


(VEB = 6.0 Vdc, IC = 0)
(VEB = 4.0 Vdc, IC = 0)

MPSA42
MPSA43

1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Vdc

Vdc

Vdc
Adc

ICBO

Adc

IEBO

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data


Motorola, Inc. 1998

 
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

25
40
40

0.5
0.4

VBE(sat)

0.9

Vdc

fT

50

MHz

3.0
4.0

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)
Collector Emitter Saturation Voltage
(IC = 20 mAdc, IB = 2.0 mAdc)

hFE

VCE(sat)
MPSA42
MPSA43

BaseEmitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Ccb
MPSA42
MPSA43

pF

Motorola SmallSignal Transistors, FETs and Diodes Device Data

 
120

hFE , DC CURRENT GAIN

VCE = 10 Vdc

TJ = +125C

100
80

25C

60
40

55C
20
0
0.1

1.0

10

100

IC, COLLECTOR CURRENT (mA)

Figure 1. DC Current Gain

100
f T, CURRENTGAIN BANDWIDTH (MHz)

80

C, CAPACITANCE (pF)

Ceb @ 1MHz

10

1.0

0.1
0.1

Ccb @ 1MHz

1.0
10
100
VR, REVERSE VOLTAGE (VOLTS)

1000

Figure 2. Capacitance

70
60
50
40
30

TJ = 25C
VCE = 20 V
f = 20 MHz

20
10
1.0

2.0 3.0

5.0 7.0 10
20
30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 3. CurrentGain Bandwidth

1.4

V, VOLTAGE (VOLTS)

1.2

VCE(sat) @ 25C, IC/IB = 10


VCE(sat) @ 125C, IC/IB = 10
VCE(sat) @ 55C, IC/IB = 10
VBE(sat) @ 25C, IC/IB = 10

1.0
0.8

VBE(sat) @ 125C, IC/IB = 10


VBE(sat) @ 55C, IC/IB = 10
VBE(on) @ 25C, VCE = 10 V
VBE(on) @ 125C, VCE = 10 V
VBE(on) @ 55C, VCE = 10 V

0.6
0.4
0.2
0.0
0.1

1.0
10
IC, COLLECTOR CURRENT (mA)

100

Figure 4. ON Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

 
PACKAGE DIMENSIONS

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.

R
P
L
SEATING
PLANE

DIM
A
B
C
D
G
H
J
K
L
N
P
R
V

X X
G

H
V

C
SECTION XX

INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.021
0.045
0.055
0.095
0.105
0.015
0.020
0.500

0.250

0.080
0.105

0.100
0.115

0.135

MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.407
0.533
1.15
1.39
2.42
2.66
0.39
0.50
12.70

6.35

2.04
2.66

2.54
2.93

3.43

CASE 02911
(TO226AA)
ISSUE AJ

STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals
must be validated for each customer application by customers technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
How to reach us:
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P.O. Box 5405, Denver, Colorado 80217. 13036752140 or 18004412447

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Customer Focus Center: 18005216274


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MPSA42/D
Motorola SmallSignal Transistors, FETs and Diodes Device
Data






Order this document


by MPSA92/D

SEMICONDUCTOR TECHNICAL DATA

  




PNP Silicon

COLLECTOR
3

*Motorola Preferred Device

2
BASE
1
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

MPSA92

MPSA93

Unit

Collector Emitter Voltage

VCEO

300

200

Vdc

Collector Base Voltage

VCBO

300

200

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2911, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

300
200

300
200

5.0

0.25
0.25

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
MPSA92
MPSA93
V(BR)CBO
MPSA92
MPSA93

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 200 Vdc, IE = 0)
(VCB = 160 Vdc, IE = 0)

V(BR)EBO

Vdc

IEBO

Vdc
Adc

ICBO
MPSA92
MPSA93

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)
1. Pulse Test: Pulse Width

Vdc

Adc

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data


Motorola, Inc. 1998

 
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

Both Types
Both Types

25
40

MPSA92
MPSA93

25
25

0.5
0.4

VBE(sat)

0.9

Vdc

fT

50

MHz

6.0
8.0

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)
Collector Emitter Saturation Voltage
(IC = 20 mAdc, IB = 2.0 mAdc)

hFE

VCE(sat)
MPSA92
MPSA93

BaseEmitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Ccb
MPSA92
MPSA93

pF

Motorola SmallSignal Transistors, FETs and Diodes Device Data

 
300

hFE , DC CURRENT GAIN

VCE = 10 Vdc

TJ = +125C

250
200

25C
150
55C
100
50
0
0.1

1.0

10

100

IC, COLLECTOR CURRENT (mA)

Figure 1. DC Current Gain

f T, CURRENTGAIN BANDWIDTH (MHz)

100

C, CAPACITANCE (pF)

Cib @ 1MHz

10
Ccb @ 1MHz

1.0

0.1
0.1

1.0
10
100
VR, REVERSE VOLTAGE (VOLTS)

1000

Figure 2. Capacitance

150
130
110
90
70
50

TJ = 25C
VCE = 20 Vdc
F = 20 MHz

30
10
1

11
13
15
7
9
IC, COLLECTOR CURRENT (mA)

17

19

21

Figure 3. CurrentGain Bandwidth

1.4

V, VOLTAGE (VOLTS)

1.2

VCE(sat) @ 25C, IC/IB = 10


VCE(sat) @ 125C, IC/IB = 10
VCE(sat) @ 55C, IC/IB = 10
VBE(sat) @ 25C, IC/IB = 10

1.0
0.8

VBE(sat) @ 125C, IC/IB = 10


VBE(sat) @ 55C, IC/IB = 10
VBE(on) @ 25C, VCE = 10 V
VBE(on) @ 125C, VCE = 10 V
VBE(on) @ 55C, VCE = 10 V

0.6
0.4
0.2
0.0
0.1

1.0
10
IC, COLLECTOR CURRENT (mA)

100

Figure 4. ON Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

 
PACKAGE DIMENSIONS

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.

R
P
L
SEATING
PLANE

DIM
A
B
C
D
G
H
J
K
L
N
P
R
V

X X
G

H
V

C
SECTION XX

INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.021
0.045
0.055
0.095
0.105
0.015
0.020
0.500

0.250

0.080
0.105

0.100
0.115

0.135

MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.407
0.533
1.15
1.39
2.42
2.66
0.39
0.50
12.70

6.35

2.04
2.66

2.54
2.93

3.43

CASE 02911
(TO226AA)
ISSUE AJ

STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals
must be validated for each customer application by customers technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
How to reach us:
USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;
P.O. Box 5405, Denver, Colorado 80217. 13036752140 or 18004412447

JAPAN: Nippon Motorola Ltd.; SPD, Strategic Planning Office, 141,


4321 NishiGotanda, Shinagawaku, Tokyo, Japan. 81354878488

Customer Focus Center: 18005216274


Mfax: RMFAX0@email.sps.mot.com TOUCHTONE 16022446609
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
Motorola Fax Back System
US & Canada ONLY 18007741848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 85226629298
http://sps.motorola.com/mfax/
HOME PAGE: http://motorola.com/sps/

MPSA92/D
Motorola SmallSignal Transistors, FETs and Diodes Device
Data

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