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5
Lanes 0 & 1
Ports 14
5
1
Global clock
buffer
Fig. 2.19 Router and on-die
network power management
2 On-Chip Networks for Multicore Systems 65
impact. The global clock buffer feeding the router is nally gated at the tile level
based on port activity.
2.5.8 Experimental Results
The TeraFLOPS processor is fabricated in a 65 nm process technology with eight
layers of copper interconnect [2]. The 275 mm
2
fully custom design contains 100
million transistors. Each 3 mm
2
tile contains 1.2 million transistors with the pro-
cessing engine accounting for 1 million (83%) and the router 17% of the total tile
device count. The functional blocks of the tile and router are identied in the die
photographs in Fig. 2.20. The tiled nature of the physical implementation is easily
visible. The ve router ports within each lane are stacked vertically, and the two
lanes sandwich the crossbar switch. Note the locations of the inbound FIFOs and
their relative area compared to the routing channel in the crossbar.
Silicon chip measurements at 80
C
The pie-chart in Fig. 2.21b shows the estimated on-die network power breakdown
obtained at 4 GHz, 1.2 V supply, and at 110