EXECUTIVE SUMMARY

This report is a design teardown analysis of an Ericsson Digital Unit GSM (DUG)
module. The baseband processing "digital Unit" supports GSM/EDGE technologies.
The analysis covers the entire system including the signal processing functions. A
simplified mechanical analysis of the unit along with detailed bill of materials analysis
is presented in this report. The Ericsson product name is DUG20 01. The Ericsson
P/N for this DUG is KDU 137 569/1 R2B.

Active/Passive Component Summary

Total Weight: x kg

Total Active/Passive Components: x [1]

Total Active/Passive Components: x [2]

Total Active Components: x [2]

Total Passive Components: x [2]

Total Other Components: x [3]

[1] Excluding components on hybrid modules and DC/RF cables & connectors
[2] Including components on hybrid modules and excluding DC/RF cables &
connectors
[3] Primarily DC/RF Cables & Connectors
Important Note:

This particular unit was built in Q1 2012, given the date codes present on many
of the semiconductor integrated circuits contained within the unit as well as on the
front panel of the unit. As such, some or many of the components, both active and
passive, have been updated or replaced by more recent part numbers. The majority
of the components contained within the bill of materials analysis are not RoHS
compliant. We believe that the overall system and functionality presented has not
changed dramatically compared to the latest version of this unit.

Where possible, all components, both passive and active, have been identified with
the manufacturers part number within the bill of materials analysis.

This analysis does not include any pricing information or estimated costs on the
mechanical design or for any passive or active components contained within the
system.

All dimensions, unless otherwise specifically stated, are in metric format.
CHAPTER 1: ERICSSON RBS6000 BTS
SYSTEM
Overview of RBS6101/6102/6201/6202/6301/6601 Product
Offering

The current generation RBS6000 BTS product portfolio consists of both
indoor/outdoor macro BTS cabinets (RBS610x/RBS620x) as well as main/RRU
systems (RBS6301/RBS6601). This report will focus on both architectures.

The indoor/outdoor macro BTS cabinets can support up to four DUG units, two per
radio shelf while the RBS6301/RBS6601 main/remote BTS can support two DUG
units.

The digital baseband unit is designated as DU<x> where <x>=:

G for GSM/EDGE
W for W-CDMA
L for LTE
S for Multi-Standard

The RF module unit is called the RU<t> <gg> B<fb>where <t>=:

G for GSM/EDGE
W for W-CDMA
L for LTE
S for Multi-Standard

where <fb> is the frequency band of use.

The RF remote radio module unit is called the RRU<t> <gg> B<fb>where <t>=:

G for GSM/EDGE
W for W-CDMA
L for LTE
S for Multi-Standard

where <fb> is the frequency band of use.

The S version for multi-standard can support 2 simultaneous waveforms of GSM and
W-CDMA or W-CDMA and LTE.

The RF modules and remote radio modules are also specified as a single or dual Tx
function where <gg>=:

01, 02, etc for single Tx and revision
11 for dual Tx for MIMO

CHAPTER 3: BASEBAND PROCESSING
BOARD SUBSYSTEM
The baseband processing subsystem of the DUG consists of one double sided PCB.
Upon removal of the top shield, we find the DUG processor board upside down sitting
on the top of the DUG bottom frame and with 7 large ICs that have individual finned
heat sinks aligned in a front to back direction. The heat sinks are facing the bottom
of the DUG unit. There is one type of heat sink used on this board:

41mm x 41mm with locking pin (7)

Exhibit 1: DUG PCB. Top View

Source: EJL Wireless Research LLC (January 2013)