Technical Handbook 1626 R5 - 0

Alcatel-Lucent 1626LM
1626 LIGHT MANAGER | RELEASE 5.0

MUTIL REACH DWDM PLATFORM
TECHNICAL HANDBOOK
3AL 75131 AAAA

MARCH, 14TH, 2008
EDITION 1
Alcatel, Lucent, Alcatel-Lucent and the Alcatel-Lucent logo are trademarks of Alcatel-Lucent. All other trademarks are the property of their respective owners..
The information presented is subject to change without notice. Alcatel-Lucent assumes no responsibility for inaccuracies contained herein.
Copyright 2007 Alcatel-Lucent. All Rights Reserved.
Contents
About this document
Purpose ....................................................................................................................................................... xv
Intended audience ....................................................................................................................................... xv
Supported systems ...................................................................................................................................... xv
Prerequisite knowledge .............................................................................................................................. xv
Safety information ...................................................................................................................................... xv
How to use this document ......................................................................................................................... xvi
Related documentation .............................................................................................................................. xvi
Related training ......................................................................................................................................... xvi
Technical support ...................................................................................................................................... xvii
How to order ............................................................................................................................................. xvii
How to comment ...................................................................................................................................... xvii
1
Product Configurations & Environment General Overview

Introduction to the equipment ................................................................................................................... 1-1
Equipment Basic Configurations ............................................................................................................... 1-6
50 GHz Grid Supported Configurations
Line Terminal (LT) .................................................................................................................................... 1-9
Line Repeater (LR) .................................................................................................................................. 1-12
Optical Reconfigurable Add & Drop Multiplexer (R-OADM) ............................................................... 1-12
Optical Tunable Add & Drop Multiplexer (T-OADM)- Degree 2 .......................................................... 1-14
Optical Tunable Add & Drop Multiplexer (T-OADM) - Degree 3 or Y node ........................................ 1-16
Optical Add & Drop Multiplexer (OADM) repeater (OR) ..................................................................... 1-19
100 GHz grid supported configurations
Line Terminal .......................................................................................................................................... 1-26
Line Repeater (LR) .................................................................................................................................. 1-28
Optical Add and Drop Multiplexer (OADM) .......................................................................................... 1-28
50 and 100 GHz grid supported configurations
Line Terminal (LT) .................................................................................................................................. 1-30
Line Repeater (LR) .................................................................................................................................. 1-31
Optical Add and Drop Multiplexer (OADM) .......................................................................................... 1-31
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Edition 1 March, 14th, 2008
Contents
............................................................................................................................................................................................................................................................
Multiplexing & Amplification Configurations

MUX/DMUX Configurations ................................................................................................................. 1-33
Amplification Configurations .................................................................................................................. 1-37
Upgrade configurations
Upgrading legacy equipment ................................................................................................................... 1-43
Line Terminal (LT) .................................................................................................................................. 1-43
Network architectures
Point to point links .................................................................................................................................. 1-49
(Multi)point-to-multipoint links .............................................................................................................. 1-49
Linear (multipoint to multipoint) links ................................................................................................... 1-50
Ring (multipoint to multipoint) networks ............................................................................................... 1-50
Meshed networks ..................................................................................................................................... 1-51
Host systems (ADM..) ............................................................................................................................. 1-51
Protection scenario .................................................................................................................................. 1-53
2
Physical configuration
Rack design ............................................................................................................................................... 2-2
1626 LM physical generic shelf configuration
1626 LM generic empty shelf ................................................................................................................... 2-3
1626 LM Compact Shelf ........................................................................................................................... 2-7
I1626 LM main and expansion shelves (recommended) configurations
T-OADM Complete Rack View Example ................................................................................................. 2-8
T-OADM Line Shelf per OTS Example .................................................................................................... 2-9
T-OADM Transponder Shelf per OTS Example ..................................................................................... 2-11
Line Terminal Configuration ................................................................................................................... 2-13
OADM Configuration ............................................................................................................................. 2-19
1626 LM Part list ..................................................................................................................................... 2-24
Equipment connections ........................................................................................................................... 2-36
Units front view
Release 5.0 Board LED ........................................................................................................................... 2-42
Release 5.0 Board Faceplates .................................................................................................................. 2-44
The Legacy Boards .................................................................................................................................. 2-47
Functional Description
Optics
The Optical Signal Process ....................................................................................................................... 3-2
Transmission Rates/Mode and Standard Compliance ............................................................................... 3-4
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Contents
............................................................................................................................................................................................................................................................
The Optical Channels ................................................................................................................................3-5

Optical Supervision .................................................................................................................................3-14
Protection .................................................................................................................................................3-17
Performance Monitoring
Performance Monitoring Points on transmission boards .........................................................................3-20
Transmission Frame
Introduction ..............................................................................................................................................3-28
Wavelength division multiplexing ...........................................................................................................3-28
Optical channel transport unit (OTUk) description .................................................................................3-31
Loopbacks
TRBC & TRBD Loopbacks .....................................................................................................................3-32
2xGBE_FC & ETHC Loopbacks ............................................................................................................3-34
Equipment Control
Equipment Controller function ................................................................................................................3-36
Management buses/interfaces ..................................................................................................................3-37
Example of control interfaces scheme .....................................................................................................3-40
Power supply
Functional description .............................................................................................................................3-41
Operation & Management Services
Housekeeping ...........................................................................................................................................3-44
Rack Alarm Management ........................................................................................................................3-44
Ventilation ................................................................................................................................................3-48
Remote Inventory .....................................................................................................................................3-49
4
Technical specifications
1626 LM system characteristics ................................................................................................................4-1
Safety requirements and mechanism .........................................................................................................4-8
Boards interfaces characteristics ..............................................................................................................4-17
Alarm characteristics ...............................................................................................................................4-54
Power supply characteristics ....................................................................................................................4-57
Mechanical characteristics .......................................................................................................................4-59
Environmental characteristics ..................................................................................................................4-62
Dismantling & recycling

WEEE general information ........................................................................................................................5-1
How to disassembly equipment .................................................................................................................5-2
ECO declaration .......................................................................................................................................5-27
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Contents
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Safety Norms & Equipment Labels

First aid for electric shock ........................................................................................................................ A-2
Safety Rules ............................................................................................................................................. A-4
Labels affixed to the equipment ............................................................................................................. A-15
Part Number and Change Status identification ...................................................................................... A-19
General Maintenance Rules ................................................................................................................... A-29
Abbreviations
............................................................................................................................................................................................................................................................
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List of tables
About this document
1
2-1
Generic Shelf Boards ................................................................................................................... 2-4
2-2
T-OADM Capacity/number of shelves and racks ........................................................................ 2-9
2-3
T-OADM / 10 Gbps Transponder Shelf Organization ............................................................... 2-12
2-4
1626 LM boards and unit list ..................................................................................................... 2-24
2-5
OADC & OCNC LED ................................................................................................................ 2-42
2-6
WMAN LED .............................................................................................................................. 2-42
2-7
TDMX LED ............................................................................................................................... 2-43
2-8
TRBD4312 LED ........................................................................................................................ 2-43
3-1
Optical Signal Process .................................................................................................................. 3-2
3-2
Transponder and Concentrator Transmission Rates/Mode .......................................................... 3-4
3-3
Transponder and Concentrator Standard Compliance ................................................................. 3-4
3-4
Nominal frequencies allocation plan in C-Band for long haul applications (50GHz grid) ......... 3-5
3-5
Frequencies allocation plan in C-Band for Metropolitan applications (100GHz grid) .............. 3-10
3-6
Frequencies plan for Metropolitan applications (50 and 100GHz mixed grid) ......................... 3-12
3-7
Boards and supported Performance Monitoring Points ............................................................. 3-21
3-8
RS counters default threshold data values .................................................................................. 3-27
3-9
OCH counters default threshold data values .............................................................................. 3-27
3-10
Front Panel LEDs severity meaning ........................................................................................... 3-46
4-1
AEL at 980 and 1480 nm for Hazard Levels 1 and 1M ............................................................. 4-11
4-2
ALCT1010 wavelengths list ....................................................................................................... 4-41
4-3
Relation between Alarm severity terminology displayed onC.T./O.S. and alarm severity
terminology used for the ESCT leds and ETSI market racks (TRU). 4-55
4-4
Environmental Operating Conditions[1] .................................................................................... 4-66
4-5
Transportation climatic .............................................................................................................. 4-70
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List of tables
............................................................................................................................................................................................................................................................

5-1
List of hazardous materials and components present in the equipment ..................................... 5-24

A-1
IEC 950 -Table 16: Overtemperature limits ...............................................................................A-12
A-2
Label references .........................................................................................................................A-15
A-3
Example of ANV Part Number + ICS evolution .......................................................................A-19
Abbreviations
............................................................................................................................................................................................................................................................
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List of figures
About this document
1

1-1
Example of 1626 LM configurations in a WDM line .................................................................. 1-4
1-2
Example of WDM line ................................................................................................................. 1-6
1-3
1626 LM Line Terminal configuration, 50 GHz grid ................................................................. 1-10
1-4
Line Terminal - Long Haul - 50 GHz grid ................................................................................. 1-11
1-5
1626 LM Line Repeater configuration ....................................................................................... 1-12
1-6
R-OADM Configuration Example ............................................................................................. 1-13
1-7
T-OADM Degree 2 Configuration Example .............................................................................. 1-15
1-8
T-OADM Degree 3 Configuration Example .............................................................................. 1-18
1-9
1626 LM OADM configuration on a 50 GHz grid .................................................................... 1-20
1-10
Long Haul Optical Add and Drop Multiplexer Repeater, 50 GHz grid ..................................... 1-21
1-11
1626 LM back-to-back terminal configuration .......................................................................... 1-24
1-12
Long Haul Back-to-Back Terminal, 50 GHz Grid ..................................................................... 1-25
1-13
1626 LM line terminal configuration on a 100GHz grid ........................................................... 1-27
1-14
Regional Line Terminal, 100 GHz grid ...................................................................................... 1-28
1-15
1626 LM OADM / back to back configuration on a 100 GHz grid ........................................... 1-29
1-16
Line terminal configuration on a 50 and 100GHz mixed grid + 2 stages amplifier ................... 1-31
1-17
OADM configuration on a 50 and 100GHz mixed grid + 2 stages amplifier ............................ 1-32
1-18
MUX and DMUX functions of an 8 channels Line Terminal .................................................... 1-33
1-19
MUX and DMUX functions of a 12 channels Line Terminal .................................................... 1-34
1-20
MUX and DMUX functions of a 32 channels Line Terminal .................................................... 1-34
1-21
MUX and DMUX functions of an 8 channels OADM .............................................................. 1-35
1-22
MUX and DMUX functions of a 32 channels back-to-back terminal ....................................... 1-36
1-23
Generic unidirectional block scheme of a 2-stage amplifier with interstage access .................. 1-37
1-24
Generic bidirectional block scheme of a 2-stage amplifier ........................................................ 1-38
1-25
Optical amplification in back-to-back / OADM configuration (bidirectional) .......................... 1-39
1-26
Optical amplification in back-to-back / OADM configuration (unidirectional) ........................ 1-40
1-27
Optical amplification in Line Repeater configuration ................................................................ 1-41
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List of figures
............................................................................................................................................................................................................................................................
1-28
Optical amplification in Line Terminal configuration ............................................................... 1-42
1-29
Generic example of LT configuration in point-to-point application .......................................... 1-44
1-30
Upgrade of the 1640 WM based on TCS401 in line terminal configuration ............................. 1-45
1-31
Upgrade of the 1640 WM based on MDX in line terminal configuration ................................. 1-46
1-32
1686 WM system upgrade with 1626 LM transponders in Line Terminal configuration ......... 1-47
1-33
1686 WM system upgrade with the 1626 LM mux/demux scheme in LT configuration .......... 1-48
1-34
The 1626 LM in point-to-point links ......................................................................................... 1-49
1-35
The 1626 LM in linear (multipoint-to-multipoint) links ............................................................ 1-50
1-36
The 1626 LM in ring (multipoint-to-multipoint) networks ....................................................... 1-50
1-37
Connection to host equipment ................................................................................................... 1-52
1-38
Optical channel protection in linear links .................................................................................. 1-54
1-39
Optical SNCP protection scheme: with back-to-back terminals or OADM .............................. 1-55
1-40
Optical protection way of working ............................................................................................ 1-55
2-1
Rack organization ........................................................................................................................ 2-2
2-2
Shelf dimensions and slots numbering ........................................................................................ 2-4
2-3
Compact Shelf Dimensions and Slot numbering ......................................................................... 2-7
2-4
T-OADM Complete Rack Example ............................................................................................. 2-8
2-5
T-OADM Line Shelf for OTS 1 Example .................................................................................. 2-10
2-6
T-OADM Line Shelf for OTS 2 Example .................................................................................. 2-10
2-7
T-OADM Line Shelf for OTS 3 Exampe ................................................................................... 2-10
2-8
T-OADM Transponder Shelf Example (8 first channels) .......................................................... 2-11
2-9
T-OADM Transponder Shelf Example (From 9th to 72nd channel) ......................................... 2-11
2-10
Example of master shelf configuration in Line Terminal application (50GHz grid) ................. 2-13
2-11
Example of a slave/transponder shelf configuration (50GHz grid) ........................................... 2-14
2-12
Example of transponder shelf configuration .............................................................................. 2-15
2-13
Example of transponder shelf with TRBD and ETHC optically connected .............................. 2-16
2-14
Example of tributary shelf with TRBD and ETHC electrically connected ............................... 2-17
2-15
Example of tributary shelf configuration with twelve ETHC .................................................... 2-18
2-16
Example of master shelf in OADM configuration ..................................................................... 2-19
2-17
Example of master shelf in OADM configuration (upgradable to 23 dBm, 50GHz grid) ......... 2-20
2-18
LT on 100GHz grid: master shelf configuration, one LOFA per direction (Unidirectional) ..... 2-21
2-19
LT on 100GHz grid: master shelf configuration, one LOFA (Bidirectional amplifier) ............. 2-22
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List of figures
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2-20
OADM on 100GHz grid: master shelf configuration with vertical amplifiers .......................... 2-23
2-21
OADM on 100GHz grid: master shelf configuration with horizontal amplifiers ...................... 2-24
2-22
Double MU optical connector .................................................................................................... 2-37
2-23
Example of intra-shelf links (10Base-T interface) ..................................................................... 2-39
2-24
Release 5.0 Board Faceplates (1/2) ............................................................................................ 2-45
2-25
Release 5.0 Board Faceplates (2/2) ............................................................................................ 2-46
2-26
TRBD1111, TRBD1121, TRBD1131 boards front panel .......................................................... 2-48
2-27
TRBD1191 board front panel ..................................................................................................... 2-49
2-28
TRBC1111 board front panel ..................................................................................................... 2-50
2-29
2xGE_FC board front panel ....................................................................................................... 2-51
2-30
ETHC1000 board front panel ..................................................................................................... 2-52
2-31
SFP optical module .................................................................................................................... 2-53
2-32
XFP optical module .................................................................................................................... 2-54
2-33
CMDX1010 board front panel ................................................................................................... 2-55
2-34
BMDX1X00 board front panel .................................................................................................. 2-56
2-35
ALCT1010 front panel ............................................................................................................... 2-57
2-36
OMDX8100_L1_X board front panel ........................................................................................ 2-58
2-37
OMDX8100_xx front panel ....................................................................................................... 2-59
2-38
OMDX4100 front panel ............................................................................................................. 2-60
2-39
OCPU2104 front panel ............................................................................................................... 2-61
2-40
LOFA11xx front panel ............................................................................................................... 2-62
2-41
ESCT2000 front panel ................................................................................................................ 2-63
2-42
OSCU1010 front panel ............................................................................................................... 2-64
2-43
OSCU1011 front panel ............................................................................................................... 2-65
2-44
HSKU1000 and HSKU1100 front panel .................................................................................... 2-66
2-45
RAIU1000 front panel ................................................................................................................ 2-67
2-46
USIB1000 front panel ................................................................................................................ 2-68
2-47
PSUP1000 front panel ................................................................................................................ 2-69
2-48
FANS1000 front panel ............................................................................................................... 2-70
3-1
Remote supervision through OSC .............................................................................................. 3-14
3-2
OSCU Implementation in OADM Configuration ...................................................................... 3-15
3-3
OSNCP: supported configurations ............................................................................................. 3-17
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List of figures
............................................................................................................................................................................................................................................................
3-4
Transponder sub-system in O-SNCP configuration ................................................................... 3-17
3-5
O-SNCP: shelf configuration examples ..................................................................................... 3-19
3-6
TRBD, TRBC: example of possible monitored sections ........................................................... 3-23
3-7
2xGE_FC: example of possible monitored sections .................................................................. 3-23
3-8
ETHC1000: example of possible monitored sections ................................................................ 3-23
3-9
Optical Transport Hierarchy (OTH) frame structure ................................................................. 3-30
3-10
Multiplexing of four ODU1 into a ODU2 ................................................................................. 3-30
3-11
G.709/Y.1331 - OTUk frame structure ...................................................................................... 3-31
3-12
TRBD Loop-backs ..................................................................................................................... 3-33
3-13
TRBC1111 Loopbacks ............................................................................................................... 3-34
3-14
Loopbacks configuration of 2xGE_FC ...................................................................................... 3-34
3-15
Loopbacks configuration of ETHC1000 .................................................................................... 3-35
3-16
Controller sub-system ................................................................................................................ 3-39
3-17
Example of control interfaces scheme ....................................................................................... 3-40
3-18
1626 LM - equipment power supply scheme ............................................................................. 3-43
3-19
Electrical links between RAIU cards and TRU ......................................................................... 3-47
3-20
Fan shelf description and Rack partitioning .............................................................................. 3-48
3-21
Remote Inventory sub-system .................................................................................................... 3-50
4-1
AEL for Class 1 between 1500 nm and 1800 nm ...................................................................... 4-10
4-2
AEL for Class 1M between 1500 nm and 1800 nm ................................................................... 4-11
4-3
Example of line failure between two LRs with unidirectional amplifiers ................................. 4-14
4-4
Example of line failure between a LR and a LT with unidirectional amplifiers ........................ 4-15
4-5
Example of line failure between a LR and a LT with bidirectional amplifiers .......................... 4-15
4-6
Climatogram for Class 3.2: Partly temperature controlled locations ......................................... 4-65
4-7
Climatogram for Class 1.2: not temperature controlled storage location .................................. 4-68

5-1
Subrack front and rear view ......................................................................................................... 5-3
5-2
Handle removing and disassembly .............................................................................................. 5-4
5-3
Rear cover removing .................................................................................................................... 5-5
5-4
Back Panel removing ................................................................................................................... 5-6
5-5
Upper and lower guides plane removing ..................................................................................... 5-7
5-6
Side wall removing ...................................................................................................................... 5-8
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List of figures
............................................................................................................................................................................................................................................................
5-7
Optical fiber duct, guides and contact spring removing ............................................................. 5-10
5-8
Side coverplate removal ............................................................................................................. 5-11
5-9
Levers removal ........................................................................................................................... 5-12
5-10
Optical connectors support removal ........................................................................................... 5-13
5-11
Side coverplate and contact spring removal ............................................................................... 5-15
5-12
Internal connectors removal ....................................................................................................... 5-17
5-13
Dissipator removal ..................................................................................................................... 5-18
5-14
Modules removal from dissipator .............................................................................................. 5-19
5-15
Daughter board removal ............................................................................................................. 5-20
5-16
Gold connector removal ............................................................................................................. 5-21
5-17
Internal cables removal .............................................................................................................. 5-22
5-18
Connector metal support removal .............................................................................................. 5-23

A-1
Subrack label ............................................................................................................................. A-17
A-2
Labels on units with standard cover plate, with two extraction handles ................................... A-18
A-3
Internal label for Printed Board Assembly ................................................................................ A-21
A-4
Back panel internal label ........................................................................................................... A-22
A-5
Labels on units with one top extraction handle ......................................................................... A-23
A-6
Labels on units without extraction handle ................................................................................ A-24
A-7
XFP and SFP modules label ...................................................................................................... A-25
A-8
Label identifying Unit, Optical assembly, Shelf, Back panel ................................................... A-26
A-9
External label for unit identification (unit with two ejectors): P/N ........................................... A-26
A-10
External label for unit/shelf identification - unit with ejector(s): CLEI code ........................... A-26
A-11
Label for Optical module XFP extended .................................................................................. A-27
A-12
XFP module label ...................................................................................................................... A-27
A-13
SFP module label ...................................................................................................................... A-28
A-14
CE label ..................................................................................................................................... A-28
A-15
WEEE label ............................................................................................................................... A-28
A-16
China RoHS label ...................................................................................................................... A-29
Abbreviations
............................................................................................................................................................................................................................................................
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List of figures
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About this document
Purpose
The 1626 LM Technical Handbook presents a detailed overview of applications, planning,

and technical specifications for the 1626 LM product.
Intended audience
Network planners, analysts, managers, and engineers comprise the primary audience for
the Technical Handbook. However, the Alcatel-Lucent Account Team as well as anyone
who needs information about the features, applications, operation, and engineering, of the
1626 LM will find this document useful.
Supported systems
This document covers the features of 1626 LM Release 5.0.

Prerequisite knowledge
This document assumes that readers have the following required skills:
Basic principles of optical telecommunication transmission
Common optical telecommunication and system terminology
Telecommunications test set operations
Local operational and functional procedures
Personal computer (PC) operation, common PC terminology, and navigational tasks in

a Windows-style user interface
Safety information
For safety information, please refer to Appendix A in this document.
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3AL 75131 AAAA
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About this document

............................................................................................................................................................................................................................................................
How to use this document
The technical handbook is divided into the following topics as described in the table
below:
About this Document
Contains general information as preliminary

information, safety recommendations,
handbook scope, history, related documents.
Product Configurations & Environment

General Overview
Covers all the equipments general

configurations including its application in the
telecommunication network.
Physical Configuration
Describes equipment components, and provides

part lists with denomination, part numbers. Unit
front view illustrations are also provided.
Gives a general description of the main

functions delivered by the product.
Technical Specifications
Gives the technical characteristics of the

product equipment. Refers to norms and
standard references.
Dismantling & Recycling
Provide information for subrack/units

dismantling and recycling. It also lists
hazardous materials and waste code.
Appendices
Provide general information on safety and

maintenance rules and other identification labels
sticked on the hardware pieces.
Abbreviations
Abbreviations used in this document and their

meanings are listed in this section
Related documentation
Alcatel-Lucent also provides the following documents to help you plan, install, and
operate your 1626 LM equipment:
1626 LM Operator Handbook - 3AL 75131 BAAA
1626 LM/SPLM Operator Handbook - 3AL 75131 FAAA
1626 LM Installation Handbook - 3AL 75131 CAAA
1626 LM Turn-On and Commissioning Handbook - 3AL 75131 DAAA
1626 LM Maintenance and Troubleshooting Handbook - 3AL 75131 EAAA
Related training
Alcatel-Lucent University provides courses to train telecommunication technicians in

installation, operations, and maintenance personnel. Contact Alcatel-Lucent at1-888-5823688 to enroll in training classes.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
xvi
About this document

............................................................................................................................................................................................................................................................
Technical support
For technical support, contact your local customer support team. Reach them via the web
at http://alcatel-lucent.com/support or through the telephone number listed under the
Technical Assistance Center menu at https://support.lucent.com/portal/olcsHome.do.
How to order
To order Alcatel-Lucent documents, use the following website:

https://support.lucent.com/portal/olcsHome.do
How to comment
You can send your feedback to your local Alcatel-Lucent Technical Assistance Center at
https://support.lucent.com/portal/olcsHome.do. Your feedback will be forwarded to the
appropriate documentation team for evaluation and action, as appropriate. Be sure to cite
the relevant information such as product name, document title, document ID, release, issue
number, date, page number, etc. in your feedback.
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3AL 75131 AAAA
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About this document

............................................................................................................................................................................................................................................................
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Product Configurations
& Environment General
Overview
Introduction to the equipment

The Alcatel-Lucent 1626 Light Manager (1626 LM in the following) is the platform of
Dense Wavelength Division Multiplexing (DWDM) Multi Reach systems for Regional,
National, Pan-continental Networks.
The Alcatel-Lucent 1626 LM addresses terrestrial applications from Metro-Core (few
hundreds of kilometers) to Ultra Long-Haul (up to 4500 km) and unrepeatered submarine
applications (400 Km single span), from average capacity for regional networks up to
large capacity for pan-continental networks.
The Alcatel-Lucent 1626 LM is designed to address efficiently green field applications for
new networks and links as well as to upgrade legacy platforms without traffic
interruption. Carriers can keep their installed DWDM base and increase its capacity by
loading new wavelengths from the 1626 LM. This provides to carriers a state-of-art
technology and advanced features without wasting the investment previously granted.
System capacity
The Alcatel-Lucent 1626 LM provides a modular transmission capacity on a single optical
fiber by multiplexing:
up to 96 channels, 10 Gbps rate, 50 GHz grid in the Extended C-band (1530 nm 1568.6 nm)
up to 32 channels, 10 Gbps rate, 100 GHz grid, in the standard C-band ( 1529.55 nm 1561.42 nm).
System structure
The Alcatel-Lucent 1626 LM architecture is based on a standard or a compact shelf that
can be configured in different ways to support a variety of applications. The main building
blocks (interfaces, mux/demux, optical amplifiers, protection boards, ...) can be allocated
in the shelves in a very flexible way. As a result the footprint and the cost of the system
configuration is optimized.
The system structure is based on transponders, mux/demux and optical amplifiers. The
transponders are connected to optical Muxes/Demuxes which generate the main DWDM
signal (combined signal) and launch it in the fibre by means of optical amplifiers.
The Alcatel-Lucent 1626 LM supports the following main categories of 3R transponders:
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3AL 75131 AAAA
1 -1
............................................................................................................................................................................................................................................................
Tributary Direct transponders with 10 Gbps and 40 Gbps line rates, optimized for Very
Long Haul applications, G. 709 compliant
4x2.5Gbps Tributary Concentrator with 10 Gbps line rate, optimized for Very Long
Haul applications, G. 709 compliant
2 x Gbe/FC aggregator with 2.5 Gbps line rate, SFP interface
ETHC concentrator, with 10 Gbps line rate, SFP/XFP interface
In accordance with ITU-T Rec. G.709, UNI signals at 2.488/9.95/10.31/39.813 Gbps are
supported by the client side interface of the transponder platform. Completion of G.709
support is insured via software or firmware upgrades.
Details of supported client rates and types is delivered in Chapter 3, Tributary subsystem on page 3-10 and Chapter 5, Tributaries optical characteristics on page 5-19.
The Alcatel-Lucent 1626 LM Line Terminal or Optical Add Drop NE (Fixed, Tunable and
Reconfigurable configurations consist of modular Mux/Demux architectures.
Three main Mux/Demux architectures are supported depending on the target grid and
application:
50 GHz based architecture supporting up to 96
100 GHz based architecture supporting up to 32 chs
100 GHz and 50 GHz mixed architecture supporting up to 48 chs.
The 50 GHz grid architecture is based on sub-bands that can be equipped with up to 8
channels. The system capacity can be scaled up to a maximum of 12 bands for a total
capacity of 96 channels. Release 5.0 supports Tunable and Reconfigurable OADM
architectures (T and R-OADM). They deliver a fully configurable flexibility to access any
wavelength in any site in point-to-point, ring or meshed networks.
capacity of 32 channels. They deliver the full flexibility to access any wavelength in any
site in point-to-point, ring or meshed networks.
The 100 GHz and 50 GHz mixed architecture is based on sub-bands that can be equipped
with up to 8 channels. Up to 16 channels are supported into the 100 GHz grid sub-bands
and up to further 32 channels can be supported into the 50 GHz sub-bands for a total
capacity of up to 48 channels. They deliver the fully flexibility to access any wavelength in
any site in point-to-point, ring or meshed networks.
Details on system configuration are delivered in Chapter 3, Functional description on
page 3-1.
The Alcatel-Lucent 1626 LM supports Line Optical Fiber Amplifiers (LOFA) in Line
Terminal, OADM (fixed and Tunable/Reconfigurable configurations) and Line Repeater
sites. Line Optical Fiber Amplifiers are based on Erbium Doped Fiber Amplifier (EDFA)
technology and they are designed to amplify the aggregate/line signal, in the extended Cband.
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Band Optical Fiber Amplifiers (BOFA) Band Optical Fiber Amplifiers are designed to
amplify one band (8-ch).
Other main features
G.709/G.798 Optical Layer Management
Future proof platform moving from pre-OTN system to OTN thanks to the G.709
transponders and concentrators
Gradual G.709 feature support through simple SW upgrades
Same Transponder HW delivering UNI B&W interfaces toward the client side
Enhanced FEC algorithm on colored 10 Gbps interface to boost span reach
Ingress and egress PM and TCA based on B1; Ingress and egress J0 non-intrusive
monitoring
L1 and L2 PM on ETHC board, on both client and line sides
L1 PM on TRBC/TRBD and 2xGE_FC, client side
PM and TCA at transmission section level based on FEC corrected/uncorrected errors
Full transparent concentration functionality for TRBC/TRBD boards.
Transparency functionality for ETHC boards with respect to MAC frame integrity.
G.709 maintenance signal
G.709 Generic Communication Channels managed inside the WDM line providing
2Mbps clear channel per 10 Gbps transmitted channel.
In-service upgrade of already installed DWDM links and of legacy DWDM platforms
The Alcatel-Lucent 1626 LM supports optimized configuration to upgrade legacy

platforms (more details in 3AL 94720 AAAA (REL.1.0), 3AL 94799 AAAA, (rel.1.2)
technical handbooks). This allows to provide new features on legacy platforms in an
easy and traffic hitless way. Single shelf configuration hosting different types of
tributaries is supported to optimize the upgrade of the legacy networks.
Multiple configurations and multiple network architectures
The 1626 LM can be configured as

Line terminal (LT)
Line repeater (LR)
Tunable and Reconfigurable Add & Drop Multiplexer (T/R OADM)
Optical Add & Drop Multiplexer (OADM)

These basic configurations address all the different optical network applications. It
covers both point-to-point and point-to-multipoint applications in mesh contexts as
well as in ring scenarios.
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Figure 1-1
Example of 1626 LM configurations in a WDM line
Flexible and scalable architecture

The 1626 LM design allows the customer to begin with a partially equipped
configuration (e.g.: 8 channels) that can be progressively upgraded as the traffic
demand grows, with a 8 or 4 chs channels mux/demux granularity. In particular, from
the initial configuration, the transmission capacity can be increased without
interrupting the existing traffic.
Unsurpassed platform density
Up to 16 x 10Gbps optical channels in a single shelf, up to 48 x 10Gbps optical

channels in a single rack. Up to 96x10Gbps system or up to 352x2.5 Gbps interfaces
are supported in only two racks.
Traffic Flexibility via Optical Add & Drop functionality.
The Alcatel-Lucent 1626 LM provides the add/drop capability by means of

Channel OADM for 50 GHz compatible architecture providing
Add/drop up to 100% of the transported capacity
Independent management of each single channel
Optical pass-thru (no regeneration) of all the channels that are not extracted.
Band OADM for 50 GHz compatible architecture providing
add/drop up to 100% of the traffic
Optimized architecture for improved OADM cascadability
Optical pass thru (no regeneration) of all the bands that are not extracted
Time multiplexing functionality

The Alcatel-Lucent 1626 LM supports fully transparent G.709 compliant multiplexing
of four 2.5Gbps input signals into one 10 Gbps wavelength. Fully transparent
multiplexing is achieved via the G.709 defined mapping of four ODU-1 into one
ODU-2.
Multiplexing functionality of GbE input client rates is also supported by the 1626 LM
as direct mapping of nine GbE input signals into a 10 Gbps signal and of two GbE/FC
inputs into a 2.5Gbps signal.
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Full C band tunable laser
The Alcatel-Lucent 1626 LM supports full C-band tunable laser functionality on 10

and 40 Gbps interfaces. This is delivering not only important cost saving in managing
the spare parts, but also a major reduction of the logistical issues associated to network
upgrade planning.
Raman amplification
Extension of achievable span performances is possible thru Raman amplification. This

is especially useful to mitigate the penalty associated to the presence of very long
spans in a link. Raman amplification is supported thru the interconnection to a
dedicated Raman shelf.
SFP (up to 2.5 Gbps) and XFP (10 Gbps) pluggable optics
They are optical transceivers that enable to customize the transponder user interface in
a very flexible way. The 1626 LM supports pluggable SFP standard compliant optics
for the client interfaces of 4x2.5Gbps Tributary Concentrator and ETHC1000 and for
the client and line interfaces of 2xGE_FC. XFP optics are supported by TRBD1191
(client side) and ETHC1000 (line side).
1+1 Bidirectional Optical Protection.

The 1+1 optical protection provides complete protection of the optical path, including
cable, amplifiers, mux/demux and transponders. High reliability is obtained by
redundancy of the transmission HW. The additional following protection types are
planned in future releases:
1:1 OMS protection, devoted to the protection of both the cable cuts and Line
amplifier failures
Supervision
In order to supervise all the NEs along a WDM path an optional Optical Supervisory
Channel (OSC) is inserted in a 1510nm out-of-band wavelength and added to the
aggregate signal. The OSC channel for Data Communication Channel (DCC) is 2
Mbs.
Multishelf configurations
Multishelf configuration management to support large capacity networks.

Configurations of up to 12 racks with 3 shelves are supported in current release.
Automatic laser control
This feature facilitates the loading of the system with a few number of modulated
channels or to compensate for the loss of some modulated channels
Management Interfaces
The Alcatel-Lucent 1626 LM is fully managed by the Alcatel-Lucent 1350 Network

Management System, common to all members of the optical family for comprehensive
monitoring, supervision and control of the overall network.
The Alcatel-Lucent 1350 network management system comprises the Alcatel-Lucent
1353NM and 1354RM.
User Interfaces for various overhead for data channels and orders wires are provided:
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Equipment Basic Configurations
............................................................................................................................................................................................................................................................
on OSCU
an audio (phone) interface
on USIB
2 x 64 kbps digital channel (E1 west and E1 east),
a phone extension connection (to interconnect two different links)
on TRBD and TRBC
a 2Mbps digital channel, a G.703 interface on RJ45 connector
CPE: two types of CPE configurations can be supported by the 1626 LM
a 8-channels multiplexed subsystem able to perform a first traffic aggregation step in

sites far from the system terminals (in a future release)
a remote tributary shelf delivering up to a maximum of 16 single channel outputs
Firmware download
In-service upgrade providing an automatic firmware update of the slave boards after
each software update. As firmware download may be traffic affecting for some boards,
the operator can decide when this operation is the most convenient.

The 1626 LM design, allows the following basic configurations of the equipment:
line terminal (LT)and line repeater (LR)
Tunable and Reconfigurable Optical Add & Drop Multiplexer (T/R OADM)
Optical Add & Drop Multiplexer (OADM)
Figure 1-2
Example of WDM line
Different configurations are available depending on the addressed application and grid.
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Configurations are reported into three subsections addressing the applicable grid schemes:
50 and 100 GHz mixed grid supported configurations
In the next paragraphs/figures
OMDXn100 stands for Optical Multiplexer and Demultiplexer supporting the 100
GHz grid. It supports up to 8 wavelengths multiplexing and demultiplexing.
Additional upgrades port maybe present depending on the OMDX version (see codes
in Table 2-1, 1626 LM boards and units list1626 LM explanatory notes (p. 2-20) for
more details). The parameter n can be 4 or 8 depending on the number of maximum
multiplexed channels:
OMDX4100 is a 4:1 channel multiplexer & demultiplexer 100 GHz grid compliant
unit
OMDX8100 is a 8:1 channel multiplexer & demultiplexer 100 GHz grid compliant
unit.
CMDX stands for Channel Mux/Demux (8:1/1:8 mux/demux). It supports up to 8

wavelengths multiplexing and demultiplexing in the 50 GHz grid.
BMDX stands for Band Mux/Demux (BMDX1000) in line terminal and back-to-back
terminal configuration or Band OADM (BMDX1100) in OADM configuration
compliant to the 50 GHz grid
the BMDX1000 supports up to 8 wavelengths per band but does not allow the band
pass-thru (in back-to-back configuration) functionality
the BMDX1100 supports up to 7 wavelengths per band and allows the full transparent
pass-thru at band level
LOFA stands for Line Optical Fiber Amplifier, designed to amplify the aggregate
signal (all the extended C-band)
BOFA stands for Band Optical Fiber Amplifier. Provides one or two gain blocks. A
gain block may be used for a single channel amplification or between CMDX and
BMDX.
OSCU stands for Optical Supervisory Channel Unit, allowing the NE management:
OSC is extracted (inside LOFA) from the aggregate signal before entering the preamplifier and then added after the optical amplification of the aggregate signal,
allowing to remotely manage the NE also in case of optical amplifier failure. The
added/dropped signal is coming from/sent to OSCU communicating with ESCT.
OCPU stands for Optical Channel Protection Unit. Contributes to O-SNCP client
signal 1+1 optical protection. Depending on the OCPU model, 1 or 2 channels can be
protected.
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TPD stands for transponders. It includes different categories of supported 3R

interfaces as TRBD, TRBC and 2xGE_FC (with DWDM SFPs). If 2xGE_FC
equipped with B&W SFP, line side, it has to be connected to one of the TRBC clients.
Line side, ETHC1000 can be provided only with a B&W XFP, hence it has to be
connected to a TRBD.
WMAN stands for Wavelenght Manager. It is used in Tunable/Reconfigurable OADM

configurarions, 50 Ghz grid to manage Express and Add & Drop channels. Provides
with up to 3 express ports and up to 4 Add & Drop ports.
TDMX stands for Tunable Demultiplexer. It is used in Tunable OADM configurations,

50 Ghz grid to provide with tuneability for channel demultiplexing. Provides with one
input port and up to 8 output ports.
OADC stands for Optical Add & Drop Coupler. It is used in Tunable and
Reconfigurable OADM configurations to split or combine Add & Drop channels.
OCNC stands for Optical Connectivity Coupler. It is used in Tunable OADM

configurations to split Express and Add & Drop channels and to provide connectivity.
Provides one input port and up to 4 output ports.
In the next block schemes, only Tributary Direct Transponders with one 10Gbps B&W
client signal and one colored 10Gbps signal, are taken into account.
The Tributary Concentrator, TRBC (with 4 x 2.5Gbps B&W client interfaces and a
colored 10Gbps one) and the 2xGE_FC (with 2 x GbE or FC B&W client interfaces and a
colored 2.5 Gbps one) are also available, but they are not shown in the following figures,
for simplicity reasons.
In the following are detailed the various configurations.
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Line Terminal (LT)
............................................................................................................................................................................................................................................................
50 GHz Grid Supported Configurations

In this section the system configuration supporting the 50 GHz grid applications are
detailed.
capacity of 96 channels. Current release supports terminal configuration as well as Band
and Tunable/Reconfigurable OADM architectures.
They deliver a full configurable flexibility to access any wavelength in any site in point-topoint, ring or meshed networks.
Line Terminal (LT)

In Line Terminal configuration (LT), the 1626 LM connects to an optical fibre DWDM
line up to 96 x 10Gbps B&W client signals, using TRBD transponders. For Gigabit
Ethernet or Fiber Channel clients aggregation, combination of ETHC/TRBD or 2
GBE_FC/TRBC can be implemented.
Up to 96 colored WDM signals (12 bands) are multiplexed in the line/aggregate
signal.
The fully equipped LT configuration requires three racks.
In the LT configuration the equipment is placed at both ends of point-to-point links. The
schematic representation of the LT configuration is reported in Figure 1-3, 1626 LM Line
Terminal configuration, 50 GHz grid (p. 1-10) It consists of the following:
line amplifiers (LOFA), with the extraction/insertion of the OSC before/after the
double-stage amplifier
up to twelve CMDX and one BMDX1000 providing the 1626 LM mux/demux scheme
transponders (TPD)
ALCT allowing system loading (optional board)
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Line Terminal (LT)
............................................................................................................................................................................................................................................................
OSCU providing NE(s) supervision
Figure 1-3
1626 LM Line Terminal configuration, 50 GHz grid
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Line Terminal (LT)
............................................................................................................................................................................................................................................................
Example of a Long Haul Line Terminal (50 GHz grid)
Figure 1-4
Line Terminal - Long Haul - 50 GHz grid
In Line Terminal configuration, up to 96 channels on a 50GHz grid, can be sent to the line.
The used BMDX is the BMDX1000 (band mux/demux).
When the Line Terminal is used in links with Band-OADM, up to 7 channels per band are
available. Moreover the BMDX1100 can also be used, instead of the BMDX1000.
ALCT is used to facilitate the loading of the system. The ALCT band is specified
according to the link design (default is B5). Typically one board is used in LT (but a higher
number may be used), in order to substitute the relevant missing CMDX(s). In case of 12
bands installed, no ALCT is needed.
The line terminal also supports a specific configuration for unrepeatered applications,
based on three preamplifiers and one booster.
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Line Repeater (LR)
............................................................................................................................................................................................................................................................
Line Repeater (LR)

The 1626 LM in Line Repeater is a bi-directional NE configuration supporting optical
amplifiers and no transponder nor MUX/DEMUX functionality.
The Line Repeater consists of two optical double-stage in-line amplifiers (LOFA)
providing a bi-directional wide band amplification in order to boost the optical power of
the aggregate WDM signal avoiding any optical to electrical conversion.
In Figure 1-5 a schematic block diagram is representing the Line Repeater configuration.
Figure 1-5
1626 LM Line Repeater configuration
Optical Reconfigurable Add & Drop Multiplexer (R-OADM)

R-OADM is a configuration that brings the capability to add and drop one or more
wavelength to/from the aggregate signal in both directions.
Up to 100% of the traffic may be added/dropped for a total of 96 channels. (88 channels if
ALCT is present).
Each channel of the R-OADM may be in any of the 5 following states:
Express
The channel is transmitted from one line to the other
Add_drop_1
The channel from direction one is dropped and the same channel is added to direction
one.
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Optical Reconfigurable Add & Drop Multiplexer (R-OADM)
............................................................................................................................................................................................................................................................
Add_drop_2
The channel from direction two is dropped and the same channel is added to direction
two.
Add_Drop_1&2
The channel is added and dropped for both directions.
Blocked
The channel is blocked.
At anytime the R-OADM operator is able to modify the state of any channel via a
Graphical User Interface. If the channel is in express state, the operator is able modify its
attenuation in order to perform power gain equalization.
The following figure illustrates a R-OADM configuration.
Figure 1-6
R-OADM Configuration Example
As illustrated in Line Figure 1-6
the R-OADM consists in the following :
Line amplifiers (LOFA)
Extract/insert of the OSC supervision channel before/after the double stage amplifier.
2 OADC 1102 (per direction)
Splits the express and the drop path.
2 WMAN1100 (one for each direction)
Provides reconfigurability.
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Optical Tunable Add & Drop Multiplexer (T-OADM)- Degree

2
............................................................................................................................................................................................................................................................
Up to 22 CMDX1010
11 per direction, 1 band is reserved by ALCT, as default B5.
2 BMDX1000
Transponders
ALCT (optional)
Enables system loading (optional board).
OSCU
Provides supervision.
Optical Tunable Add & Drop Multiplexer (T-OADM)- Degree 2

T-OADM is a configuration that brings the capability to add and drop one or more
wavelength to/from the aggregate signal for both directions.
Up to 72 channels may be added/dropped for a total of 96 channels. (93 if ALCT is
present)
For T-OADM configuration, for each Add & Drop channel, the operator is able to choose
the transponder to perform the Add & Drop. As a consequence, in such configuration all
transponders are able to transmit/receive all of the 96 possible channels.
Each channel of the T-OADM configuration may be in any of the 5 following states:
Express
The channel is transmitted from one line to the other
Add_drop_1
The channel from direction one is dropped and the same channel is added to direction
one.
Add_Drop_2
The channel from direction two is dropped and the same channel is added to direction
two.
Add_Drop_1&2
The channel is added and dropped for both directions.
Blocked
The channel is blocked.

At anytime the T-OADM operator is able to modify the state of any channel via a
Graphical Usier Interface. If the channel is in express state, the operator is able modify its
attenuation in order to perform power gain equalization.
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Optical Tunable Add & Drop Multiplexer (T-OADM)- Degree

2
............................................................................................................................................................................................................................................................
The following figure illustrates a T-OADM configuration.

Figure 1-7
T-OADM Degree 2 Configuration Example
T-OADM configuration consists in the following:
On the drop path:
2 OADC1102 (or OCNC boards)
Split the express and the drop path.
2 OADC1100
Split low cost channels from amplified channels.
2 TDMX1180 (one per direction)
Provide with tuneability forth 8 first low cost channels.

2 OADC1300 (one per direction, optional)
Increase the number of available amplified channels.
Up to 16 LOFA (8 per direction, optional)
Amplify additional channels.
Up to 16 TDMX1180 (8 per direction, optional)
Provide with tuneability for amplified channels.
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Optical Tunable Add & Drop Multiplexer (T-OADM) Degree 3 or Y node
............................................................................................................................................................................................................................................................
On the add path:
2 OADC1750 (one per direction)
Multiplex low cost channels.

Up to 16 OADC1750 (8 per direction, optional)
Multiplex amplified channels.
2 OADC1300 (one more per direction, optional)
4 LOFA (2 per direction, optional)

2 WMAN3174 (one per direction)
Provides with reconfigurability and tuneability.
Add ALC channel.
ALCT
Enables system loading (optional).
Transponders
OSCU
Provides supervision.
Optical Tunable Add & Drop Multiplexer (T-OADM) - Degree 3

or Y node
Contrary to other OADM configurations, the Y node is connected to 3 lines in 3 different
directions. A Y node configuration may be used as connection point in a meshed network.
Up to 72 channels may be added/dropped for a total of 96 channels. (93 if ALCT is
present)
For T-OADM configuration, for each Add & Drop channel, the operator is able to choose
the transponder to perform the Add & Drop. As a consequence, in such configuration all
transponders are able to transmit/receive all of the 96 possible channels.
Y node configuration brings the capability to add and drop one or more wavelengths
to/from the aggregate signal in any of the three directions. It provides the ability to
establish a connection for any wavelength from one to any of the other two directions.
Thus each channel of the Y node configuration may be in one or more of the following
states:
Express_XY
The channel is transmitted from direction X to direction Y (and from direction Y to

direction X)
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Add_drop_X
The channel from direction X is dropped and the same channel is added to direction X.
Blocked_X
The channel from line X is blocked. There is no transmission whatever the channel
state is.
At anytime the Y node operator is able to modify the state of any channel via a Graphical
User Interface. If the channel is in express state, the operator is able modify its attenuation
in order to perform power gain equalization.
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The following figure illustrates a T-OADM configuration.

Figure 1-8
T-OADM Degree 3 Configuration Example
Y node configuration consists in the following:
On the drop path:
3 OCNC (one per direction)
Splits the express and the drop path.
Splits low cost channels from amplified channels.

3 TDMX1180 (one per direction)
Provides with tuneability forth 8 first low cost channels.
Increase the number of available amplified channels.
Up to 24 LOFA (8 per direction, optional)
Up to 24 TDMX1180 (8 per direction, optional)
Provide tuneability for amplified channels.
On the add path:
Multiplex low cost channels.

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Optical Add & Drop Multiplexer (OADM) repeater (OR)
............................................................................................................................................................................................................................................................
Up to 24 OADC1750 (8 per direction, optional)

3 OADC1300 (one more per direction, optional)
6 LOFA (2 per direction, optional)

3 WMAN 3174 (one per direction)
Provide with reconfigurability and tuneability.
Add ALC channel.
ALCT
Enables system loading (optional)
Transponders
2 OSCU
Provide supervision.

The OADM repeater is a NE configuration that brings the capabilities to add and drop one
or more wavelengths to/from the aggregate signal in one or both directions.
The OADM NE configuration is implemented in linear and ring based networks.
Up to 100% of the transit traffic can be added/dropped for a total of a maximum 77
wavelengths (11 bands equipped at 7 channels). All the bands that are not extracted are
transparently transmitted without the need of any optical/electrical regeneration (bands are
in optical pass-through). The fully equipped OADM configuration allowing to add and
drop up to 100% of the transit traffic requires four racks.
The schematic representation of the OADM configuration is reported in Figure 1-9, 1626
LM OADM configuration on a 50 GHz grid (p. 1-20). The OADM consists of the
following:
line amplifiers (LOFA), with the extraction/insertion of the OSC before/after the
double-stage amplifier
up to 22 CMDX (11 per direction, 1 band is reserved by ALCT, as default B5) and 2
BMDX1100 (1 per direction) providing the 1626 LM mux/demux scheme
transponders (TPD)
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OSCU providing NE(s) supervision.
Figure 1-9
1626 LM OADM configuration on a 50 GHz grid
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Example of a Long Haul Optical Add and Drop Multiplexer Repeater, 50 GHz grid
Figure 1-10
Long Haul Optical Add and Drop Multiplexer Repeater, 50 GHz grid
In OADM repeater configuration, up to 11 wavelength bands per direction can be sent to

the line (1 band is occupied by ALCT).
A maximum of 77 channels (11 bands) can be sent/received to/from the line, per each side
(it is mandatory to keep one band for the ALCT in an OADM, to protect the transmission)
A 7-wavelength at 50 GHz granularity per band, is used per band.
These wavelength are: 195900 (1530.33nm); 195500 (1533.46nm); 195100 (1536.61nm);
194700 (1539.76nm); 194300 (1542.93nm); 193900 (1546.12nm); 193500 (1549.31nm);
193100 (1552.52nm); 192700 (1555.74nm); 192300 (1558.98nm); 191900 (1562.23nm);
191500 (1565.49nm).
Up to 100% of the wavelengths can be added/dropped. The non-added/dropped channels
are in complete pass-through and reamplified.
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ALCT is used to ensure a protection of the added/dropped channels against a line failure
affecting the pass-through. It also facilitates the loading of the system. The ALCT band is
specified according to the link design . Typically two boards are used in OADM (but a
higher number may be used), in order to substitute the relevant missing CMDXs (2
ALCTs have always to be plugged in OADM).
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Back to back terminal
When all the DWDM line channels are added and dropped or electrically regenerated, the
1626 LM is a back-to-back terminal or a hub node.
The Back To Back terminal is a particular case of the OADM configuration without any
optical pass thru channels.
The NE configuration is implemented in linear and ring based networks.
Up to 96 channels/wavelengths (12 bands) can be added/dropped or regenerated in a
BTB configuration. A typical fully equipped configuration requires five racks.
The schematic representation of the BTB configuration is reported in Figure 1-11, 1626
LM back-to-back terminal configuration (p. 1-24). It consists of:
line amplifiers (LOFA), with the extraction (resp. insertion) of the OSC before/after
the double-stage amplifier
up to 24 CMDX (12 per direction, 1 band may be reserved by ALCT) and 2

BMDX1100 (1 per direction) providing the 1626 LM mux/demux scheme
transponders (TPD)
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Figure 1-11 1626 LM back-to-back terminal configuration
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Example of a Long Haul Back-to-Back Terminal, 50 GHz Grid
Figure 1-12
Long Haul Back-to-Back Terminal, 50 GHz Grid
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Line Terminal
............................................................................................................................................................................................................................................................

In this section the system configurations supporting the 100 GHz grid applications are
detailed.
The 100 GHz grid architecture is based on sub-bands that can be equipped up to 8
channels.
The system capacity can be scaled up to a maximum of 4 bands (L1, L2, S1, S2) for a total
capacity of 32 channels. Current release supports Line Terminal configuration as well as
OADM (Fixed, Tunable and Reconfigurable) architecture with single wavelength
granularity capability.
They deliver the full flexibility to access any wavelength in any site in point to point, ring
or meshed networks.
Line Terminal
In Line Terminal configuration (LT), the 1626 LM connects up to 32 x 10 B&W client
signals, using TRBD transponders. For Gigabit Ethernet or Fiber Channel clients
aggregation, combination of ETHC/TRBD or 2 GBE_FC/TRBC can be implemented.
Up to 32 colored WDM signals are multiplexed in the line/aggregate signal.
The fully equipped LT configuration requires a single rack.
schematic representation of the LT configuration is reported in Figure 1-13, 1626 LM
line terminal configuration on a 100GHz grid (p. 1-27). It consists of
one or two line amplifier boards (LOFA), with the extraction/insertion of the OSC
before/after the double-stage amplifier
up to 4 OMDX providing the 1626 LM mux/demux scheme
transponders (TPD)
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Line Terminal
............................................................................................................................................................................................................................................................
Figure 1-13
1626 LM line terminal configuration on a 100GHz grid
Example of a Regional Line Terminal, 100 GHz grid
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Line Repeater (LR)
............................................................................................................................................................................................................................................................
Figure 1-14
Regional Line Terminal, 100 GHz grid
Line Repeater (LR)

Refer to Chapter 1, Line Repeater (LR) on page 1-12.
Optical Add and Drop Multiplexer (OADM)

The OADM repeater is a NE configuration that brings the capabilities to add and drop one
or more wavelengths to/from the aggregate signal in one or both directions.
wavelengths. All the wavelengths or bands that are not extracted are transparently
transmitted without the need of any optical/electrical regeneration (wavelengths or bands
are in optical pass-through). The fully equipped OADM configuration allowing to add and
drop up to 100% of the transit traffic requires two racks.
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............................................................................................................................................................................................................................................................
The schematic representation of the OADM configuration is reported in Figure 1-15,

1626 LM OADM / back to back configuration on a 100 GHz grid (p. 1-29)
The OADM consists of
up to four line amplifier boards (LOFA), with the extraction/insertion of the OSC
up to 8 OMDX providing the 1626 LM mux/demux scheme
transponders (TPD)
Figure 1-15
1626 LM OADM / back to back configuration on a 100 GHz grid
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Line Terminal (LT)
............................................................................................................................................................................................................................................................
50 and 100 GHz grid supported

configurations
The 100 GHz and 50 GHz mixed architecture is based on sub-bands that can be equipped
up to 8 channels.
Up to 16 channels are supported into the 100 GHz grid sub-bands and up to further 32
channels can be supported in the 50 GHz sub-bands for a total capacity of up to 48
channels.
Line Terminal configuration as well as OADM architectures are supproted. They deliver
the full flexibility to access any wavelength in any site in point-to-point, ring or meshed
networks.
Line Terminal (LT)

In Line Terminal configuration (LT), the 1626 LM connects to an optical fibre DWDM
line up to 48 x 10 Gbps B&W client signals, using TRBD transponders. For Gigabit
Ethernet or Fiber Channel clients aggregation, combination of ETHC/TRBD or 2
GBE_FC/TRBC can be implemented.
Up to 48 colored WDM signals are multiplexed in the line/aggregate signal.

The fully equipped LT configuration requires two racks.
schematic representation of the LT configuration is reported in Figure 1-3, 1626 LM Line
Terminal configuration, 50 GHz grid (p. 1-10). It consists of:
up to 2 OMDX, up to 4 CMDX and one BMDX1000 providing the 1626 LM

mux/demux scheme
transponders (TPD)
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Line Repeater (LR)
............................................................................................................................................................................................................................................................
Figure 1-16 Line terminal configuration on a 50 and 100GHz mixed grid + 2 stages
amplifier
Line Repeater (LR)

Refer to Chapter 1, Line Repeater (LR) on page 1-12.

The OADM is a NE configuration that brings the capabilities to add and drop one or more
wavelengths to/from the aggregate signal in one or both directions.
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............................................................................................................................................................................................................................................................

wavelengths. All the wavelengths or bands that are not extracted are transparently
transmitted without the need of any optical/electrical regeneration (wavelengths or bands
are in optical pass-through). The fully equipped OADM configuration allowing to add and
drop up to 100% of the transit traffic requires two racks.
The schematic representation of the OADM configuration is reported in Figure 1-17,
OADM configuration on a 50 and 100GHz mixed grid + 2 stages amplifier (p. 1-32).
The OADM consists of:
up to 4 OMDX, up to 8 CMDX and two BMDX providing the mux/demux scheme
transponders (TPD)
OSCU providing NE(s) supervision
Figure 1-17 OADM configuration on a 50 and 100GHz mixed grid + 2 stages

amplifier
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MUX/DMUX Configurations
............................................................................................................................................................................................................................................................
Multiplexing & Amplification Configurations

Example of MUX and DMUX functions
Line Terminal configurations

In a 4 or 8-channels Line Terminal, multiplexing and demultiplexing are performed in one
step. The extra input of the MUX and the extra output of the DMUX are not connected.
Figure 1-18
MUX and DMUX functions of an 8 channels Line Terminal
In a 12 or 16-channel Line Terminal, multiplexing and demultiplexing are performed in

two steps. The example of Figure 1-19, MUX and DMUX functions of a 12 channels
Line Terminal (p. 1-34)shows how to cascade 2 MUXes and 2 DMUXes to obtain a 12channels Line Terminal.
The extra input of the first MUX is not connected. The 4-channel aggregate signal output
of the first MUX is connected to the extra input of the second MUX.
The extra output of the first DMUX is connected to the 4 channels aggregate signal input
of the second DMUX. The extra output of the second DMUX is not connected.
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............................................................................................................................................................................................................................................................
Figure 1-19
MUX and DMUX functions of a 12 channels Line Terminal
In a 24 or 32-channels Line Terminal, multiplexing and demultiplexing are performed in

three steps. The example of Chapter 1, MUX and DMUX functions of a 32 channels Line
Terminal shows how the 2:1 expansion MUX multiplexes the 16-channels in long band
and 16-channels in short band.
Figure 1-20
MUX and DMUX functions of a 32 channels Line Terminal
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............................................................................................................................................................................................................................................................
OADM configurations
The example of Figure 1-21, MUX and DMUX functions of an 8 channels OADM
(p. 1-35) is an 8-channels OADM. 8 channels are dropped and added on both east and
west lines. In this configuration, the extra output of each DMUX is connected to the extra
input of the MUX of the opposite transmission direction. This allows to place the other 24
channels in pass through.
Figure 1-21
MUX and DMUX functions of an 8 channels OADM
The same configuration is available with 1, 2, 4 and 8-channels (n-channels). In this case,
the number of aggregate channels available in pass through is 32 - n.
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............................................................................................................................................................................................................................................................
The example of Chapter 1, MUX and DMUX functions of a 32 channels back-to-back

terminal is a 32-channels back-to-back terminal. In this configuration, there no is pass
through traffic, the 1626LM is like a hub-node.
Figure 1-22
MUX and DMUX functions of a 32 channels back-to-back terminal
Pass-through
Optical pass-through can be performed at the expansion and extra level.

It is also possible to perform non-regenerative optical pass-through at the channel level in
case the design and the performances allow it.
Loading plan for 100 GHz grid mux/demux subsystem
Refer to Chapter 3-1, Table 3-5 Frequencies allocation plan in C-Band for Metropolitan
applications (100GHz grid)on page 3-10 for the frequency allocation plan.
Band sequence (all fiber types)
L1 Band, S2 Band, L2 Band, S1 Band
Channel sequence inside each band
from the most internal channel (i.e. the closest to 1545nm) to the most external
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Amplification Configurations
............................................................................................................................................................................................................................................................
The amplifiers used are LOFA11xx: they are EDFA (Erbium Doped Fiber Amplifier)
aggregate amplifiers able to amplify all the Extended C-band.
Optical Amplifiers are based on a two-stage optical gain block which provides optical
access between the two stages (interstage), used to insert a passive DCU (either DCF or
any other technologies); if no DCU is used, an attenuator may be installed or the VOA
may be tuned to perform the inter-stage loss.
The LOFA serves as
in-line amplifier when it is used in a regenerator capacity
terminal pre-amplifier when it is used as the front-end of an optical receiver
post-amplifier (booster) when it boosts the output signal of a laser transmitter.
LOFA1110 and LOFA1120 provide up to 20 dBm output power without external pump
module.
These two boards also provide connection to an external pump module to increase the
output power up to 23 dBm (future release).
LOFA1111 and LOFA1121 provide up to 17 dBm output power. These boards do not have
a connection for upgrades with an external pump module.
The 1510 nm OSC wavelength is extracted from the aggregate signal at the input of the
first stage of the amplifier and it is added to the aggregate signal at the output of the
second stage.
LOFA contains an internal VOA in order to optimize the gain flatness during the system
lifetime and to avoid non-linear effects in DCF that can fill the interstage.
It is also able to automatically tune its VOA and its 1st stage output power.
LOFAs in unidirectional configuration
Figure 1-23
Generic unidirectional block scheme of a 2-stage amplifier with

interstage access
LOFA11X1 has a floating VOA. By default in unidirectional configuration it is connected

immediately after the first stage as shown in Figure 1-23, Generic unidirectional block
scheme of a 2-stage amplifier with interstage access (p. 1-37)If needed it could also be
connected before the first stage.
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3AL 75131 AAAA
1-37
............................................................................................................................................................................................................................................................
LOFAs in bidirectional configuration
This configuration can be used in LT, Back to Back and Fixed OADM NEs. It is available
only on LOFA1111 and LOFA1121.
Figure 1-24
Generic bidirectional block scheme of a 2-stage amplifier
By default in bidirectional configuration the floating VOA should be connected

immediately before the first stage as shown in Figure 1-24, Generic bidirectional block
scheme of a 2-stage amplifier (p. 1-38).
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............................................................................................................................................................................................................................................................
LOFAs configuration examples
In any configuration allowed the added/dropped OSC channel has to be sent to the
supervision function, performed by the OSCU1010 board.
Figure 1-25
Optical amplification in back-to-back / OADM configuration

(bidirectional)
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3AL 75131 AAAA
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............................................................................................................................................................................................................................................................
Figure 1-26
Optical amplification in back-to-back / OADM configuration

(unidirectional)
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............................................................................................................................................................................................................................................................
See Figure 1-27, Optical amplification in Line Repeater configuration (p. 1-41).
A Line Repeater is made up of two LOFAs in In-Line Amplifier configuration.
If no DCU are used, an attenuator may be installed or the VOA may be tuned to perform
the inter-stage loss.
Figure 1-27
Note:
Optical amplification in Line Repeater configuration
In the curent release LOFA_TR is no longer used.
............................................................................................................................................................................................................................................................
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1-41
............................................................................................................................................................................................................................................................
Figure 1-28
Optical amplification in Line Terminal configuration
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Upgrading legacy equipment
............................................................................................................................................................................................................................................................
Upgrade configurations
Upgrading legacy equipment
The following paragraphs refer to
1640 WM existing links upgrade with 1626 LM mux/demux scheme and/or

transponders
1686 WM existing links upgrade with 1626 LM mux/demux scheme and/or

transponders
Note that
the mux/demux scheme, according to the configuration, can be made up of both the
1626 LM and 1640 WM/1686 WM mux/demux
supervision (OSC) and line amplifiers (booster+preamplifier) belong to the 1640 WM

or 1686 WM.
WLA is the 1686 WM transponder, TRB is the 1640 WM transponder, TPD is the
1626 LM transponder (TRBD, TRBC)
The OSC allows the NE management: it is extracted from the aggregate signal before
entering the pre-amplifier and then added after the optical amplification of the aggregate
signal. This gives the benefit to remotely manage the NE also in case of optical amplifier
failure.
Line Terminal (LT)

In Line Terminal configuration (LT), the 1626 LM connects, according to the system
architecture,
up to 80 x 10Gbps B&W client signals, using TRBD or
320 x 2.5Gbps B&W client signals, using TRBC
to an optical fibre DWDM line. Mixed configuration are allowed.

The LT is placed at the ends of point-to-point links.
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Line Terminal (LT)
............................................................................................................................................................................................................................................................
Figure 1-29 Generic example of LT configuration in point-to-point application

Line terminal equipment built-up of 1626 LM and 1640 WM
In the following is given a brief description of the two different 1640 WM mux/demux
schemes
the TCS scheme is based on 3 mux/demux stages (only the B&W to WDM direction is
described):
the first one is able to multiplex (or de-multiplex because the boards are bi-directional)
up to 8 channels on a 200GHz grid (function supported by the TCS1xx, TCS302 and
TCS401 boards)
the second one can mix up to 5 aggregate signals of 8 channels to reach 40

wavelengths on a 100GHz grid (supported by the TCS302, Off-grid channels, and
TCS401, On grid channels);
the third one combines the two resulting aggregate signals of 40 channels at 100GHz
to have one DWDM signal of 80 channels at 50GHz in C band (function provided by
the TCS401 board).
The MDX multiplexing architecture is based on two mux / demux stages
the first one is able to multiplex (or de-multiplex because the boards are bi-directional)
up to 40 channels on a 100GHz grid; this function is supported by the MDX3x2 (On
grid channels) and MDX3x3 (Off-grid channels).
the second one interleaves the two resulting aggregate signals of 40 channels at
100GHz to have one DWDM signal of 80 channels at 50GHz in C band (by means of
the MDX4x1 board).
Existing 1640 WM links upgrade with 1626 LM boards.
Figure 1-30, Upgrade of the 1640 WM based on TCS401 in line terminal configuration
(p. 1-45) shows the upgrade scheme with the TCS401 mux/demux scheme.
Upgrade of 1640WM with TCS301 is not supported. Replacement of TCS301 with
TCS401 is a precondition to upgrade the configuration with 1626 LM tributaries.
The upgrade is allowed only when only when less than 40 channels of the 1640 WM
system are installed. Whatever the actual number N" of installed channels (v 40), all the
remaining 80-N" channels can be added with 1626 LM transponders (TRBD, TRBC) +
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Line Terminal (LT)
............................................................................................................................................................................................................................................................
Mux/Demux (CMDX, BMDX).

The 1626 LM aggregate signal is connected to the unused input/output port of the 2:1
combiner/1:2 splitter of the TCS401 board.
The upgrade configuration connecting directly the 1626 LM tributaries with the TCS
boards is not allowed.
Figure 1-30
Upgrade of the 1640 WM based on TCS401 in line terminal

configuration
Figure 1-31, Upgrade of the 1640 WM based on MDX in line terminal configuration
(p. 1-46) shows the upgrade scheme with the MDX4x1 mux/demux scheme.
Whatever the actual number N" of installed channels the remaining 80-N" channels can
be filled with 1626 LM transponders directly connected to the MDX3xx boards of the
1640 WM mux/demux scheme.
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3AL 75131 AAAA
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Line Terminal (LT)
............................................................................................................................................................................................................................................................
It is not allowed to upgrade an already installed 1640 WM system (with MDX4x1 and
MDX3x2 boards) with the 1626 LM mux/demux scheme (instead of MDX3x3)
connected to the MDX4x1 board.
Figure 1-31 Upgrade of the 1640 WM based on MDX in line terminal configuration
Line terminal equipment built-up of 1626 LM and 1686 WM
Hereinafter, a brief description of the 1686 WM mux/demux scheme is given.

It is based on two mux/demux stages
the first one is made up of two OMDX boards, able to multiplex (or de-multiplex,
because the boards are bidirectional) up to 16 chs each (one in red band, the other one
in blue band) on a 100GHz grid
the second one multiplexes the two resulting aggregate signals of 16 channels at
100GHz each to have one DWDM signal of 32 channels at 100GHz in C band (by
means of the expansion board).
Existing 1686 WM links upgrade with 1626 LM boards

Two cases of upgrade are allowed:
1626 LM mux-demux connected to 1686 WM EXP board
1626 LM transponders (TRBD, TRBC) directly connected to 1686 WM mux/demux.
Figure 1-32, 1686 WM system upgrade with 1626 LM transponders in Line Terminal
configuration (p. 1-47) shows the upgrade scheme with the 1626 LM transponders
directly connected to the 1686 WM mux/demux.
This configuration allows to multiplex/demultiplex up to 32 channels to/from the DWDM
line.
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Line Terminal (LT)
............................................................................................................................................................................................................................................................
This upgrade is always possible, whatever the actual number N" of installed channels.
The remaining 32-N" channels can be filled with 1626 LM transponders directly
connected to the OMDX16 boards of the 1686 WM mux/demux scheme.
Figure 1-32
1686 WM system upgrade with 1626 LM transponders in Line Terminal

configuration
Figure 1-33, 1686 WM system upgrade with the 1626 LM mux/demux scheme in LT
configuration (p. 1-48) shows the 1686 WM upgrade scheme with the 1626 LM
mux/demux scheme connected to the expansion board of the 1686 WM.
This configuration is possible when only one 1686 WM Mux/Demux is installed (up to 16
chs), allowing the connection of the 1626 LM mux/demux to the unused port of the 1686
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
1-47
Line Terminal (LT)
............................................................................................................................................................................................................................................................
WM EXP board. Hence it is possible to increase the channels number to more than 32
filling the available band with 50GHz spaced chs. The maximum supported configuration
is 52 wavelengths by upgrading the red band with up to 36 x 1626 LM channels.
Figure 1-33 1686 WM system upgrade with the 1626 LM mux/demux scheme in LT
configuration
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Point to point links
............................................................................................................................................................................................................................................................
Network architectures
The following architectures are foreseen:
point-to-point
(multi)point-to-multipoint, both in linear, ring and meshed topologies
Point to point links

Point-to-point links can be performed by means of the following NE configurations
line terminal, located at each end of the link, that multiplexes/de-multiplexes the
tributary signals
line repeater, that amplifies the aggregate signal without the need of optical to
electrical conversion
Figure 1-34
The 1626 LM in point-to-point links
(Multi)point-to-multipoint links
(Multi)point-to-multipoint links can be performed by means of some of the following
configurations
line terminal, located at each end of the link, that multiplexes/de-multiplexes the
tributary signals
line repeater, that amplifies the aggregate signal without the need of optical to
electrical conversion
OADM repeater, able to add/drop a part (up to 100%) of the traffic
Back-to-back terminal, able to add/drop up to 100% of the aggregate signal.
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3AL 75131 AAAA
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Linear (multipoint to multipoint) links
............................................................................................................................................................................................................................................................
Linear (multipoint to multipoint) links

As shown in Figure 1-35 line terminal, line repeater and OADM repeater configuration
can be used to establish linear (multipoint to multipoint) links.
Figure 1-35 The 1626 LM in linear (multipoint-to-multipoint) links
Ring (multipoint to multipoint) networks

Ring networks can be established by means of the back-to-back terminal, OADM repeater
and line repeater configurations.
Figure 1-36 The 1626 LM in ring (multipoint-to-multipoint) networks
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Meshed networks
............................................................................................................................................................................................................................................................
Meshed networks
Meshed networks can be typically implemented via Y or degree 3 nodes.
The following figure illustrates an example of meshed network.
Host systems (ADM..)

Host systems can be all data equipment whose optical output signals have a bit-rate
between 100 Mbps and 10 Gbps. They can be:
SDH/SONET equipment (STM-1/OC-3, STM-4/OC-12, STM-16/OC-48, STM64/OC-192)
IP routers
GbE, FC, 2FC, FICON, ESCON equipment
10GBEthernet WAN, 10 GBEthernet LAN equipment.
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Host systems (ADM..)
............................................................................................................................................................................................................................................................
10Gbps SDH/
Tx
SONET
CLIENT SYSTEM Rx
Tx
10GBE WAN
CLIENT SYSTEM Rx
10Gbps B&W
10Gbps B&W
Tx
10 GBE LAN
CLIENT SYSTEM Rx
Tx1
Rx1
Tx9
Rx9
GbE
CLIENT
SYSTEMS
Tx1
Rx1
Tx2
Rx2
GbE/FC
CLIENT
SYSTEMS
10Gbps B&W
1.25Gbps B&W
1.0625Gbps / 1.25Gbps B&W
Rx TRBD1111 Tx
TRBD1121
Tx TRBD1191 Rx
Rx TRBD1111 Tx
TRBD1121
Tx TRBD1191 Rx
Rx TRBD1131 Tx
Tx TRBD1191 Rx
Rx1
Tx
Tx1
ETHC1000
Rx9
Rx
Tx9
Rx96
10Gbps
COLORED SIGNAL
Rx5
10Gbps
COLORED SIGNAL
Tx5
Rx4
11Gps
COLORED SIGNAL
Rx
Tx
TRBD1191
Tx
Rx
10Gbps B&W
Rx1
Tx
Tx1
2xGE_FC
Rx2
Rx
Tx2
Tx96
Tx4
Rx3
Tx3
10Gps
COLORED
SIGNAL
Rx2
2.5Gps
COLORED SIGNAL
Tx2
Tx
Tx1
GbE/FC
Rx1
CLIENT
Tx2
SYSTEMS Rx2
2.5Gbps
Tx
SDH/SONET
CLIENT SYSTEM Rx
STM1/4, OC3/12,
FC/ESCON/
Tx
GBE/FICON
CLIENT SYSTEM Rx
UP TO FOUR
STM1/4, OC3/12,
FC/ESCON/
Tx
GBE/FICON
CLIENT SYSTEM Rx
STM1/4, OC3/12,
FC/ESCON/
Tx
GBE/FICON
CLIENT SYSTEM Rx
UP TO FOUR
STM1/4, OC3/12, Tx
FC/ESCON/
Rx
GBE/FICON
CLIENT SYSTEM
Rx1
Tx1
2xGE_FC Tx
Rx2
Rx
Tx2
2.5Gbps B&W
Rx
AGGREGATE
MULTIPLEXED
SIGNAL
Rx4
Tx4
(UP TO 96 )
Rx3
2.5Gbps B&W
Tx3
TRBC
Rx4
Tx4
Rx1
Tx
Rx2
4 x ANY Tx
Rx
Rx1
Rx
2.5Gbps B&W
Tx2
10Gbps
COLORED SIGNAL
Tx1
Tx1
1696MS
MUX/
DEMUX
SCHEME
Rx4
Tx4
Tx
4 x ANY Rx
Rx1
2.5Gbps B&W
Tx1
Rx1
Tx1
1626LM
Figure 1-37 Connection to host equipment
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Protection scenario
............................................................................................................................................................................................................................................................
Protection scenario
In 1626 LM the optical protections are managed by means of dedicated protection coupler
boards integrated into the 1626 LM universal shelf. The 1626 LM is able to provide to a
generic host tributary system both linear and ring optical channel (OCh) protections. In
previous releases an additional (1660 OCP) equipment supported this kind of
configuration and 1626 LM in current release is supporting the interworking with 1660
OCP equipment.
Optical Channel (OCh) protection
The channel protection is provided with the Optical SNCP (O-SNCP) performed by means
of the OCPU2104 and transponders (TRBD, TRBC).
The tributary signal is bridged over two different lines (working and protecting line). In
this way the signal is delivered towards two different paths. At the receiver side the
selection between the two diversely routed signals is performed. The protection switching
is triggered by the following switching criteria: LOS, OTU-LOF, OTU-LOM, OTU-TIM,
ODU-AIS, Generic-AIS, FEC uncorrected errors.
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Protection scenario
............................................................................................................................................................................................................................................................
This kind of protection can be used on two different topologies: linear links and ring
topologies, as shown in Figure 1-38 and Figure 1-39, Optical SNCP protection scheme:
with back-to-back terminals or OADM (p. 1-55)respectively.
Figure 1-38 Optical channel protection in linear links
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Protection scenario
............................................................................................................................................................................................................................................................
Figure 1-39
Optical SNCP protection scheme: with back-to-back terminals or OADM
The split and select functions are optically performed, by means of passive optical
couplers and splitters.
The selection is done by shutting-down the user Tx corresponding to the path in failure
and activating the protecting one (see Figure 1-40).
Figure 1-40
Optical protection way of working
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1-55
Protection scenario
............................................................................................................................................................................................................................................................
............................................................................................................................................................................................................................................................
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The 1626 LM has been designed to offer a record size integration to meet the challenging
requirements of the backbone environment.
A fully loaded 1626LM system with 96 channels (Line Terminal configuration on a
50GHz grid) is housed by three standard ETSI racks.
A fully loaded 1626LM system with 32 channels (Line Terminal configuration on a
100GHz grid) is housed by one standard ETSI rack.
The 1626 LM employs a common shelf type for the different network elements.
The NE composition, when the 1626 LM R.1.X is used with 1640 WM or 1686 WM line
sections, is described in release 1.0 and release 1.2 technical handbooks, code 3AL 94720
AAAA and 3AL 94799 AAAA and it will not be considered in this document.
............................................................................................................................................................................................................................................................
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2 -1
Rack design
............................................................................................................................................................................................................................................................
Rack design
The 1626 LM mechanical design allows to put up to three shelves in current release.
Up to six racks are managed.
It is compatible with the following mechanical standard
2200 mm high ETSI rack.
The depth is compliant with the 300 mm deep ETSI racks.
Figure 2-1
Rack organization
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-2
1626 LM generic empty shelf
............................................................................................................................................................................................................................................................
1626 LM physical generic shelf

configuration
The 1626 LM shelf is made up by an empty shelf and the boards and units installed in it.
In current release, the 1626 LM system is composed by
one mandatory master shelf
up to five slave/expansion shelves, according to the configuration type.
The board composition determines the shelf type: master or slave.

The shelf is divided in 41 slots. The logical slot numbers are shown in Figure 2-2, Shelf
dimensions and slots numbering (p. 2-4)
Six different mechanics are available for the 1626 LM boards:
20 mm width, small height; this mechanic fits into slots 21, 22, 39 and 40
20 mm width, medium height; this mechanic fits into slots 1, 2, 19 and 20
25 mm width, small height; this mechanic fits into slots 23 to 38
25 mm width, medium height; this mechanic fits into slots 3 to 18
25 mm width, tall height; this mechanic takes two slots: one 25mm wide, medium
height slot plus one 25mm wide, small height one which is under it. Thus, it fits in
slots 3 plus 23, 4 plus 24 to 18 plus 38. The relevant units use the connector from the
medium height slot to communicate with the SC
double width, tall height; this mechanic takes four slots: two adjacent 25 mm wide,
medium height slots plus the two 25mm wide, small height ones which are under
them. I.e. it can fit in slots 5, 6, 25, 26. The units which have this mechanics use the
connector from the left medium height slot (slot 5 in the above example) to
communicate with the SC.
triple width, tall height; this mechanic takes six slots: three adjacent 25 mm wide,
medium height slots plus the three 25mm wide, small height ones which are under
them. I.e. it can fit in slots 5, 6, 7, 25, 26 27.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-3
............................................................................................................................................................................................................................................................
WIDTH = 532 mm
39 40
21 22
10 11 12 13 14 15 16 17 18 19 20
Logical Slot Numbers
73 mm
265 mm
HEIGHT = 466 mm
338 mm
73 mm
DEPTH = 288 mm
23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
FANS
41
20 mm wide, small height slots (21, 22, 39, 40)

20 mm wide, medium height slot (1, 2, 19, 20)
Logical Slot Numbers
25 mm wide, small height slot (23 to 38)
25 mm wide, medium height slot (3 to 18)
A medium plus a small 25 mm width slots (3+23, 4+24,...,18+38) are required to install a tall height board.
20mm wide units can be fit into 25mm wide slots with the 5mm reductor plate.
Figure 2-2
Shelf dimensions and slots numbering
Generic shelf boards
The following table lists the boards that the generic shelf can host and their related slots.
Table 2-1
Generic Shelf Boards
Slot Numbers
Acceptable boards
ESCT2000
CMDX10xx
OMDX8xxx
OMDX4100
BOFA 1000, BOFA 2000
OADC1750 and OADC 1300
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-4
............................................................................................................................................................................................................................................................
Slot Numbers
Acceptable boards
3-18
19
TRBD11xx
TRBD12xx
ETHC1000
2xGBE_FC
BMDX1xxx
CMDX10xx
OMDX8xxx
OMDX4100
OCPU2104
LOFA11xx
OSCU10xx in master shelf only
WMAN3x74 (Takes 4 slots. As a consequence,
not in slots 16, 17, 18)
TDMX1180 (Takes 4 slots. As a consequence,
not in slots 16, 17, 18)
CMDX10xx
OMDX8xxx
OMDX4100
CMDX10xx
OMDX8xxx
OMDX4100
21
PSUP1000
22
HSKU1000
RAIU1000
20
23-38
39
HSKU1100
USIB1000
RAIU1100
OADC0104, 1100, 1102
OCNC1230 and 1240
LC-OSC in master shelf only
USIB1000 in master shelf only
RAIU1000
HSKU1000
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3AL 75131 AAAA
2-5
............................................................................................................................................................................................................................................................
Slot Numbers
Acceptable boards
40
PSUP1000
41
FANS1000
To discover 1626 LM recommended configurations, refer to I1626 LM main and

expansion shelves (recommended) configurations, 2-8
............................................................................................................................................................................................................................................................
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2-6
1626 LM Compact Shelf
............................................................................................................................................................................................................................................................
1626 LM Compact Shelf

The following figure illustrates the compact shelf dimensions and slot numbering.
Figure 2-3
Compact Shelf Dimensions and Slot numbering
Compact shelf boards
In current release compact shelf is only used for Line Repeater configuration. As a
consequence, it only supports the following boards:
ESCT (slot 1),
LOFA1xx (slots 2 to 5),
OSCU (slots 2 to 5),
FANS 2000 (slot 13).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-7
T-OADM Complete Rack View Example
............................................................................................................................................................................................................................................................
1626 LM main and expansion shelves

(recommended) configurations
I
T-OADM Complete Rack View Example

The complete rack view example illustrates a T-OADM degree 3 (Y node) configuration,
10 Gbps rate, unprotected, which can support up to 72 channels.
In the illustration, one color is used per OTS:
Figure 2-4
The following color symbolizes...
the following direction
Pink
East
Blue
West
Yellow
North
T-OADM Complete Rack Example
Each OTS is represented by one color. As illustrated, it is strongly recommended not to

mix OTS in racks and subracks. This organization brings a clear position of each
function/direction and makes easier the implementation and the operation.
Note:
Channel upgrades are not performed according to the usual way. You will not
proceed by addition of single shelf/rack. In this specific context, will require 3 racks
for 3 shelves at once.
The following table summarizes the capacity of a T-OADM degree 3 (Y node)

configuration, 10 Gbps rate, unprotected, in comparison with shelves/racks number.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-8
T-OADM Line Shelf per OTS Example
............................................................................................................................................................................................................................................................
Table 2-2
T-OADM Capacity/number of shelves and racks
T-OADM Capacity
Number of Shelves and Racks
8 channels
6 shelves / 3 racks
16 channels
9 shelves / 3 racks
40 channels
18 shelves / 6 racks
72 channels
30 shelves / 12 racks

In the illustrations, one color is used per OTS:
The following color
symbolizes...
the following direction...
Pink
East
Blue
West
Yellow
North
The following tables calls your attention on the following:

If board type is...
then
10 Gbps transponder only
40 Gbps transponder only
OADC1300
Slots 15,16,17 & 18 are empty if less than 8 Add & Drop
channels.
Slots 17 & 18 are empty if the number of Add & Drop
channels is 9 to 40.
All slots (15 to 18) are used for more than 40 Add & Drop
channels.
Slots 17 & 18 are empty if the number of Add & Drop
channels is 1 to 32.
All slots (15 to 18) are used for more than 32 Add & Drop
channels.
An OADC1300 is plugged in slot 18 only if one of the 2 1 to

8 coupler is used.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-9
............................................................................................................................................................................................................................................................
Figure 2-5
T-OADM Line Shelf for OTS 1 Example
Figure 2-6
T-OADM Line Shelf for OTS 2 Example
Figure 2-7
T-OADM Line Shelf for OTS 3 Exampe
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3AL 75131 AAAA
2 - 10
T-OADM Transponder Shelf per OTS Example
............................................................................................................................................................................................................................................................

The following illustrates transponder shelves for one OTS of a T-OADM degree 3
configuration.
Figure 2-8
T-OADM Transponder Shelf Example (8 first channels)
Figure 2-9
T-OADM Transponder Shelf Example (From 9th to 72nd channel)
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-11
............................................................................................................................................................................................................................................................
Good To Know
For a 72 channels configuration, 9 transponder shelves are required per direction.
In case of a configuration with 8 channels, the amplifier is optional. It becomes

mandatory as soon as you insert a 9th channel.
The following table summarizes the 10 Gbps transponder shelf organization for T-OADM
degree 3 configuration, depending on the number of channels.
Table 2-3
T-OADM / 10 Gbps Transponder Shelf Organization
Number of channels
Transponder Shelf Organization
From channel 1 to 8
From channel 9 to 72
8 TRBC or TRBD
1 TDMX 1180 for Drop channels
1 OADC1750 for Add channels
8 TRBC or TRBD
1 TDMX 1180 for Drop channels
1 LOFA
1 OADC1750 for Add channels
............................................................................................................................................................................................................................................................
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2 - 12
Line Terminal Configuration
............................................................................................................................................................................................................................................................
Figure 2-10
Example of master shelf configuration in Line Terminal application

(50GHz grid)
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3AL 75131 AAAA
2-13
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Figure 2-11 Example of a slave/transponder shelf configuration (50GHz grid)
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2 - 14
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Figure 2-12
Example of transponder shelf configuration
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3AL 75131 AAAA
2-15
............................................................................................................................................................................................................................................................
Figure 2-13
Example of transponder shelf with TRBD and ETHC optically connected
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 16
............................................................................................................................................................................................................................................................
Figure 2-14
Example of tributary shelf with TRBD and ETHC electrically connected
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-17
............................................................................................................................................................................................................................................................
Figure 2-15 Example of tributary shelf configuration with twelve ETHC
............................................................................................................................................................................................................................................................
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2 - 18
OADM Configuration
............................................................................................................................................................................................................................................................
OADM Configuration
Figure 2-16
Example of master shelf in OADM configuration
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3AL 75131 AAAA
2-19
OADM Configuration
............................................................................................................................................................................................................................................................
Figure 2-17
Example of master shelf in OADM configuration (upgradable to 23 dBm,

50GHz grid)
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3AL 75131 AAAA
2 - 20
OADM Configuration
............................................................................................................................................................................................................................................................
Figure 2-18 LT on 100GHz grid: master shelf configuration, one LOFA per direction
(Unidirectional)
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3AL 75131 AAAA
2-21
OADM Configuration
............................................................................................................................................................................................................................................................
Figure 2-19 LT on 100GHz grid: master shelf configuration, one LOFA

(Bidirectional amplifier)
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2 - 22
OADM Configuration
............................................................................................................................................................................................................................................................
Figure 2-20
OADM on 100GHz grid: master shelf configuration with vertical

amplifiers
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3AL 75131 AAAA
2-23
1626 LM Part list
............................................................................................................................................................................................................................................................
Figure 2-21 OADM on 100GHz grid: master shelf configuration with horizontal
amplifiers
1626 LM Part list

Table 2-4, 1626 LM boards and unit list (p. 2-24) lists hardware and software
component of the 1626 LM.
In this table, you will find the following information:
Item Name
Part numbers
Table 2-4
1626 LM boards and unit list
Board & Unit Name
ANV Part#
Software Package
SWP-1626LM R5.0
8DG16894AAAA
Alcatel Lucent Software Licenses
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 24
1626 LM Part list
............................................................................................................................................................................................................................................................
Board & Unit Name
ANV Part#
SWL-Photonics VERS "B" WDM LP
3AL75119AAAA
SWL-Photonics VERS "B" TDM LP
3AL75120AAAA
SWL-Photonics VERS "B" UPG WDM L
3AL75121AAAA
SWL-Photonics VERS "B" UPG TDM L
3AL75122AAAA
SWL-RCT 1626LM LICENCE FEE
3AL94777AAAA
Old Alcatel Lucent Software Licenses

SWL-1626LM versA WDM LP
3AL94514AAAA
SWL-1626LM vers."A" TDM LP
3AL94518AAAA
Software - Miscelaneous
SWP - RAMAN BOARDS R.1.0 MAINTENANCE
8DG16877AAAA
SWP-Raman boards R.1.0
8DG16938AAAA
Installation Kits
KIT - LINE CABLING KIT REGIONAL
3AG26013ABAA
KIT-OADM LINE CABLING KIT
3AG26014AAAA
CMDX AND OMDX CABLING KIT (16 CABLES)
3AL94756AAAA
CMDX AND OMDX CABLING KIT OSNCP
3AL94756BAAA
BMDX CABLING KIT (3 CABLES)
3AL94757AAAA
KIT-OADM BAND CABLING KIT
3AL94758ABAA
INTER SHELF CABLING 2ND SHELF (4 CABLES)
3AL94759BAAA
INTER SHELF CABLING 3RD SHELF (4 CABLES)
3AL94759CAAA
KIT-1640 UPGRADE SC/SC ADAPT.
3AL94771AAAA
1626LM OPTINEX INSTALLATION KIT
3AL94773AAAA
RACK AND SHELF NUMBER SETTING KIT
3AL94902AAAA
INST. KIT IN ETSI RACK 1640WM
3AL94912AAAA
KIT-ANSI 23" INSTALLAT KIT
8DG16571AAAA
KIT-DCU INSTALLAT KIT for ANSI 2
8DG16572AAAA
KIT - WMAN & PGE CABLING KIT
8DG16581AAAA
OSNCP TRBD CABLING KIT
8DG16693AAAA
OSNCP TRBC CABLING KIT
8DG16693BAAA
RAMAN CABLING KIT
8DG16731AAAA
Installation Equipment
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-25
1626 LM Part list
............................................................................................................................................................................................................................................................
Board & Unit Name
ANV Part#
THINLAN TERMINATION MALE BNC 50 OHM
1AB006420037
T BNC CONNECTOR
1AB006670016
CIRCUIT BREAKER 20 A
1AB162710007
CIRCUIT BREAKER 25 A
1AB162710008
OPTO JUMPER SMF MU/PC-SC/PC L=3M
1AB167540010
JUMPER MPO/MPO RIBBON CABLE 10MT
1AB168060034
1AB168060035
1AB168060036
1AB168060037
1AB168060038
1AB168060039
1AB168060040
JUMPER SMF MU/PC-MU/PC 390MM
1AB182400005
1AB182400010
1AB182400011
1AB182400012
1AB182400013
1AB182400014
1AB182400015
1AB182400016
JUMPER SM MU/MU C.2MM LSZH 490MM
1AB182400040
JUMPER SM MU/MU CABLE 2MM 770MM
1AB182400041
1AB182400043
1AB182400044
1AB182400048
1AB182400049
1AB182400050
OPTO JUMPER SM MU/MU LSZH 2.1M
1AB182400051
JARRETIERE OPTIQUE SM MU/MU 2.5M/20
1AB182400052
JUMPER SM MU/MU 2MM LSZH 220CM
1AB182400054
JUMPER SM MU/MU 2MM LSZH 290CM
1AB182400059
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 26
1626 LM Part list
............................................................................................................................................................................................................................................................
Board & Unit Name
ANV Part#
MU/SPC-LC/SPC,SMF,200CM LENGTH
1AB185770011
JUMPER MU/PC-LC/PC SM L=700MM
1AB185770013
JUMPER MU/PC-LC/PC SM L=950MM
1AB185770014
JUMPER MU/PC-LC/PC SM L=1,4MT
1AB185770015
1AB185770016
1AB185770017
JUMPER MPX - 8SC STRAIGHT FANOUT
1AB204550001
OPTO ATTEN. MU/PC 1DB PLUG TYPE
1AB204800001
1AB204800002
OPTO ATTEN. MU/PC 3DB PLU TYPE
1AB204800003
1AB204800004
5DB MU ATTENUATOR
1AB204800005
1AB204800006
1AB204800007
OPTO ATTEN. MU/PC 8DB PULG TYPE
1AB204800008
1AB204800009
10DB MU ATTENUATOR
1AB204800010
1AB204800011
1AB204800012
1AB204800013
1AB204800014
15DB MU ATTENUATOR
1AB204800015
20DB MU ATTENUATOR
1AB204800016
CONN. BOX 24 PORT MU/UPC-MPO/APC
1AB216900001
LEFT FIBER STORAGE + 8 SC
1AD018570011
RIGHT FIBER STORAGE + 8 SC
1AD018570012
REMOVAL TOOL MU PLUG_IN ATTENUATORS
1AD038600002
TELEPHONE HANDSET
1AF00398AAAA
HOUSEKEEPING CABLE RAMAN
3AL94484AAAA
POWER SUPPLY CABLE RAMAN
3AL94500AAAA
JUMPER 2.1MM E2000 L=30M RAMAN
3AL94504AAAA
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-27
1626 LM Part list
............................................................................................................................................................................................................................................................
Board & Unit Name
ANV Part#
JUMPER 2.1MM E2000 L=100M RAMAN
3AL94504ABAA
AIR FILTER RAMAN
3AL94515AAAA
CHAIN ALARM CABLE
3AL94740AAAA
LAN CABLE
3AL94752AAAA
HSKU1000 CABLE
3AL94768AAAA
HSKU 1100 CABLE
3AL94768ABAA
KIT-CABLE DUCT
3AL94888AAAA
MA-OPTICAL SUPPORT ASSEMBLED
3AL94942AAAA
ESCT2000 RJ45 CONNECTION CABLE
3AL94943AAAA
8 TRBD USER CONNEC./UPPER SHELF
3AL94990AAAA
8 TRBD USER CONNEC./MIDDLE SHELF
3AL94991AAAA
8 TRBD USER CONNEC./BOTTOM SHELF
3AL94992AAAA
8 TRBC USER CONNEC./UPPER SHELF
3AL94993AAAA
8 TRBC USER CONNEC./MIDDLE SHELF
3AL94994AAAA
8 TRBC USER CONNEC./BOTTOM SHELF
3AL94995AAAA
ATTENUATOR MANAGER
3AN44793AAAA
EXTRACTOR
3AN50032AAAA
Multiplexers
OMDX8100_L1_X
3AG26009AAAB
OMDX8100_L1
3AG26009BAAB
OMDX8100_L2
3AG26009BBAB
OMDX8100_S1
3AG26009BCAB
OMDX8100_S2
3AG26009BDAB
OMDX4100_CH30-33
3AG26009CAAB
OMDX4100_CH35-38
3AG26009CBAB
OMDX4100_CH20-23
3AG26009CCAB
OMDX4100_CH25-28
3AG26009CDAB
OMDX4100_CH52-55
3AG26009CEAB
OMDX4100_CH57-60
3AG26009CFAB
OMDX4100_CH42-4
3AG26009CGAB
OMDX4100_CH47-50
3AG26009CHAB
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 28
1626 LM Part list
............................................................................................................................................................................................................................................................
Board & Unit Name
ANV Part#
ALCT1010 B2 1534.65NM
3AL94639ABAB
ALCT1010 B3 1537.80NM
3AL94639ACAB
ALCT1010 B4 1540.95NM
3AL94639ADAB
ALCT1010 B5 1544.13NM
3AL94639AEAB
ALCT1010 B6 1547.32NM
3AL94639AFAB
ALCT1010 B7 1550.52NM
3AL94639AGAB
ALCT1010 B8 1553.74NM
3AL94639AHAB
ALCT1010 B9 1556.96NM
3AL94639ALAB
ALCT1010 B10 1560.20NM
3AL94639AMAB
ALCT1010 B11 1563.46NM
3AL94639ANAB
ALCT1010 B12 1566.73NM
3AL94639APAB
BMDX1000 1:12 OLTE BAND MUX/DEMUX
3AL95504AAAA
BMDX1100 1:12 OADM BAND MUX/DEMUX
3AL95504ABAA
CMDX1010 1:8 B1 CH MUX/DEMUX
3AL95507AAAA
3AL95507ABAA
3AL95507ACAA
3AL95507ADAA
3AL95507AEAA
3AL95507AFAA
3AL95507AGAA
3AL95507AHAA
3AL95507AJAA
3AL95507AKA
3AL95507ALAA
3AL95507AMAA
Optical Compensation Devices

LOW LOSS SMF C + BAND DCM 3 KM - MU
1AB210830001
1AB210830002
1AB210830003
1AB210830004
1AB210830005
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-29
1626 LM Part list
............................................................................................................................................................................................................................................................
Board & Unit Name
ANV Part#
1AB210830006
1AB210830007
1AB210830008
1AB210830009
1AB210830010
1AB210830011
1AB210830012
1AB210830013
1AB210830014
1AB210830015
NEW DCM E-LEAF 25 KM
1AB234480001
1AB234480002
1AB23448000
1AB234480004
1AB234480005
1AB234480006
1AB234480007
1AB234480008
ENHANCED DCM E-LEAF 75 KM
1AB239330001
Optical Amplifiers
LOFA 1111 - OPTICAL AMPLIFIER 22/9 (17DBM)
3AG26018AAAB
LOFA 1121 - OPTICAL AMPLIFIER 28/9 (17DBM)
3AG26019AAAB
LOFA1110 - OPTICAL AMPLIFIER 22/9 (20 DBM)
3AL94211AAAB
LOFA1120 - OPTICAL AMPLIFIER 28/9 (20 DBM)
3AL94212AAAB
RAMAN AMPLIFIER 2 PUMPS - RMPM1200
3AL95800AAAA
RAMAN AMPLIFIER 3 PUMPS - RMPM1300
3AL95801AAAA
Racks
BASIC RACK W TRU
3AL35049AAAA
OPT.RACK TRU&DOOR
3AL37952AAAB
OPT.RACK WITH TRU
3AN44815AAAB
Subracks and Common parts
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 30
1626 LM Part list
............................................................................................................................................................................................................................................................
Board & Unit Name
ANV Part#
8GB FLASH CARD
1AB147830035
PSUP1000 POWER SUPPLY
3AL94247AAAA
NEW ESCT2000 EQUIPMENT AND SHELF

CONTROLLER
3AL94248BAAA
OSCU1010 - OPTICAL SUPERVISORY CHANNEL

(1510NM)
3AL94249AAAB
OSCU1010 - UNREPEATERED APPLICATION
3AL94249ABAA
OSCU1011 - ONE SIDE OPT SUPERV CHANNEL

(1510NM)
3AL94249BAAB
OSCU1010 - OPTICAL SUPERVISORY CHANNEL

(1510NM) - FROM R.3.0A5
3AL94249CAAB
OSCU1010 - UNREPEATERED APPLICATION - FROM

R.3.0A5
3AL94249DBAA
OSCU1011 - ONE SIDE OPT SUPERV CHANNEL

(1510NM) - FROM R.3.0A5
3AL94249EAAB
FANS1000
3AL94251AAAA
USIB1000
3AL94252AAAA
HSKU1000 HOUSEKEEPING UNIT
3AL94253AAAA
HSKU1100 HOUSEKEEPING UNIT - LOWER SLOTS
3AL94253ABAA
ESCT1000 128MB EQUIPMENT AND SHELF

CONTROLLER
3AL94304ABAA
RAIU1000 RACK ALARM INTERFACE UNIT
3AL94305AAAA
RAIU1100 RACK ALARM INTERFACE UNIT
3AL94305ABAA
BLNK 2000 20MM MEDIUM DUMMY
3AL94476AAAA
BLNK1000 - 20MM SMALL DUMMY UPPER ETSI
3AL94478AAAA
BLNK 3100 25MM FULL DUMMY
3AL94480AAAA
1626LM SHELF
3AL94511AAAA
FAN UNIT PROTECTION (ETSI)
3AL94613AAAA
BOARD MECHANICAL ADAPTER 20MM/20MM
3AL94814AAAA
BLNK3100 - 25 MM FULL DUMMY ETSI
3AL94881AAAA
BLNK2000 - 20 MM MEDIUM DUMMY ETSI
3AL94882AAAA
BLNK1000 20MM SMALL DUMMY LOWER
3AL94883AAAA
MA-DUMMY 265_25 W/O HANDLES
3AL94950AAAA
AIR DEFLECTOR WITH NOISE REDUCTION
3AL94984AAAA
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-31
1626 LM Part list
............................................................................................................................................................................................................................................................
Board & Unit Name
ANV Part#
21" D.C.U.ASSEMBLED SUPPORT
3AN44747AAAA
FANS COMPACT SHELF
8DG16494AAAA
1626LM COMPACT SHELF
8DG16495AAAA
NEW AIR DEFLECTOR (EXCEEDING CLASS 3.2 DUST)
8DG16605AAAA
DUST FILTER FOR NEW AIR DEFLECTOR
8DG16694AAAA
DUST FILTER FOR NEW AIR DEFLECTOR
8DG16694ABAA
162XLM FIBER DUCT
8DG16802AAAA
1626LM SHELF COVER WITH NEW COMPANY NAME

AND LOGO
8DG82559AAAA
Reconfigurable DWDM Boards

OADC1300 - 1:8 DROP COUPLER
3AG26009DAAA
OADC1750 - 1:8 DROP COUPLER + 2X1:4 ADD

COUPLER
3AG26009EAAA
WMAN 1100 - BLOCKER
3AL94220ABAB
OADC1102
3AL94736ABAA
OADC1101
3AL94736ACAA
OADC1100 - 1:2 DROP COUPLER
3AL94736ADAA
OADC0104 - ALCT ADD COUPLER
3AL94736AEAA
OCNC1230 - DEGREE 3 CONNECTION COUPLER
3AL94736BAAA
OCNC1240 - DEGREE 4 CONNECTION COUPLER
3AL94736CAAA
WMAN3174 - WSS FOR ADD PORTS
8DG16489AAAA
TDMX1180 - WSS FOR TUNEABLE DEMULTIPLEXER
8DG16816AAAA
SFP/XFP Modules
OPTO TRX 1.25GBE SFP-ZX
1AB187280028
OPTO TRX SFP 1.25GBE LX DDM
1AB187280031
OPTO TRX SFP 1.25GBE SX DDM
1AB187280033
OPTO-TRX SFP FC/2FC MM W/ DDM
1AB187280037
OPTO-TRX SFP FC/2FC SM W/ DDM
1AB187280038
OPTO TRX SFP 1.25GBE ZX DDM
1AB187280042
OPTO TRX SFP L-16.2
1AB196370003
OPTO TRX SFP L-16.1
1AB196370004
OPTO TRX SFP I-16.1 DDM
1AB196370005
............................................................................................................................................................................................................................................................
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2 - 32
1626 LM Part list
............................................................................................................................................................................................................................................................
Board & Unit Name
ANV Part#
OPTO TRX SFP S-16.1 DDM
1AB196370006
OPTO TRX SFP S-16.1 ANYRATE DDM
1AB196370007
OPTO TRX SFP L-16.1 DDM -5/+80
1AB196370008
OPTO TRX SFP L-16.2 DDM -5/+80
1AB196370009
XFP I-64.1/10GBE BASE L
1AB214540001
XFP 10GBE BASE S (UP TO 10.3 GBS)
1AB214540002
XFP S64-2B/10GBE BASE E
1AB217280001
OPTO TRX SFP DWDM CH600
1AB231410003
1AB231410004
1AB231410005
1AB231410006
1AB231410008
1AB231410009
1AB231410010
1AB231410011
1AB231410013
1AB231410014
1AB231410015
1AB231410016
1AB231410018
1AB231410019
1AB231410020
1AB231410021
1AB231410025
1AB231410026
1AB231410027
1AB231410028
1AB231410030
1AB231410031
1AB231410032
1AB231410033
1AB231410035
............................................................................................................................................................................................................................................................
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2-33
1626 LM Part list
............................................................................................................................................................................................................................................................
Board & Unit Name
ANV Part#
1AB231410036
1AB231410037
1AB231410038
1AB231410040
1AB231410041
1AB231410042
1AB231410043
OPTO-BIDI-XCVR*1.31um
1AB350870001
OPTO-BIDI-XCVR*1.49um
1AB350870002
Switching Protection
OCPU1104
3AL94736AAAA
DUAL OCPU 2104 - 1+1 PROTECTION
3AL95529BCAA
Test Services
ACI-1626LM FAT STANDARD
3AL94623AAAA
ACI-1626LM DIR.SHIP.STANDARD
3AL94734AAAA
ACI-1626LM DIR.SHIP.EXTRA TEST
3AL94734ABAA
ACI-1626LM DIR.SHIP.EXTRA TEMP.
3AL94734ACA
ACI-1626LM DIR.SHIP.EXTRA TIME
3AL94734ADAA
Tributaries
12XGBETH (ETHC1000)
3AL94970AAAA
2XGBETH_FC
3AL97800BAAA
Tributaries - Full Band
TRBD1111 /I-64.1 STD
3AL94207ABAC
TRBD1121 /S-64.2 STD
3AL94207ACAC
TRBD1131 /10BASE-LR STD
3AL94207AEAC
TRBD1111 /I-64.1 ENH
3AL94207DBAC
TRBD1121 /S-64.2 ENH
3AL94207DCAC
TRBD1131 /10GBASE-LR ENH
3AL94207DEAC
TRBD1111 /I-64.1
3AL94207EBAC
TRBD1121 /S-64.2
3AL94207ECAC
TRBC1111 4X2.5GB /SFP STD
3AL94452ABAB
TRBC1111 4X2.5GB /SFP ENH
3AL94452DBAB
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 34
1626 LM Part list
............................................................................................................................................................................................................................................................
Board & Unit Name
ANV Part#
TRBC1111 4X2.5GB /SFP
3AL94452EAAB
TRBD4312 - C BAND - PSBT
8DG80616AAAA
TRBD1191 /XFP UNIVERSA
8DG82531AAAA
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-35
Equipment connections
............................................................................................................................................................................................................................................................
The external connections of the 1626 LM may fall into the following categories:
optical
management
maintenance
power supply
user interfaces.
All the equipment connection are detailed in the Installation Handbook.

The next section, Chapter 2, Units front view on page 2-41 presents the front view of all
the cards, where the connection points can be identified.
In the following, some general indication and reference to the relevant front view are
given.
Optical connections
MU/SPC connectors
See Figure 2-22, Double MU optical connector (p. 2-37) The optical connections are
made with double MU/PC connectors on:
TRBD1111, TRBD1121, TRBD1131 either on Client or WDM interface, TRBD1191

on WDM interface, see Figure 2-26, TRBD1111, TRBD1121, TRBD1131 boards
front panel (p. 2-48)
TRBC boards, on WDM interface, see Figure 2-28, TRBC1111 board front panel
(p. 2-50)
CMDX boards, see Figure 2-33, CMDX1010 board front panel (p. 2-55)
BMDX boards, see Figure 2-34, BMDX1X00 board front panel (p. 2-56)
ALCT boards, see Figure 2-35, ALCT1010 front panel (p. 2-57)
OMDX boards, see Figure 2-36, OMDX8100_L1_X board front panel (p. 2-58),
Figure 2-37, OMDX8100_xx front panel (p. 2-59), and Figure 2-38, OMDX4100
front panel (p. 2-60)
LOFA boards, see Figure 2-40, LOFA11xx front panel (p. 2-62).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 36
............................................................................................................................................................................................................................................................
Figure 2-22
Double MU optical connector
The optical connections are made with simple MU/PC connectors on:
OSCU boards, see Figure 2-42, OSCU1010 front panel (p. 2-64) and Figure 2-43,
OSCU1011 front panel (p. 2-65)
OCPU boards, see Figure 2-39, OCPU2104 front panel (p. 2-61)
LC/PC connectors
Refer to Figure 2-31, SFP optical module (p. 2-53) and Figure 2-32, XFP optical
module (p. 2-54).
The optical connections are made with LC/PC connectors on all the SFP modules plugged
on:
TRBC1111 boards, client side, see Figure 2-28, TRBC1111 board front panel
(p. 2-50)
2xGE_FC boards, either on Client or WDM interfaces, see Figure 2-29, 2xGE_FC
board front panel (p. 2-51)
ETHC1000 boards, on Client interfaces, see Figure 2-30, ETHC1000 board front
panel (p. 2-52).
The optical connections are made with LC/PC connectors on all the XFP modules plugged
on:
ETHC1000 boards, on WDM interface, see Figure 2-30, ETHC1000 board front
panel (p. 2-52)
TRBD1191 on client interface, see Figure 2-26, TRBD1111, TRBD1121,

TRBD1131 boards front panel (p. 2-48).
Management and maintenance connections

NMS Interface
It is the Q3 interface toward the Network Management System (NMS). It is a 10 / 100

Mbps Ethernet interface provided by two RJ45 connectors (10/100 Base-T interface),
located on the ESCT front panel.
See Figure 2-41, ESCT2000 front panel (p. 2-63).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-37
............................................................................................................................................................................................................................................................
Craft Terminal Interface
It is the Q3 interface toward the Craft Terminal. It is a 38.4Kbps serial RS232 interface
provided by the 9-pin SUB-D female connector, located on the ESCT front panel.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 38
............................................................................................................................................................................................................................................................
Inter-shelf link
Inter-shelf link (IS-LINK) allow the communication between the EC and all the SCs of the
NE. It is a 100Mbps Ethernet bus, allowing the communication between EC and SCs
located in separate shelves (communication between EC and the local SC is performed on
a local serial bus named ISSB).
The connections can be performed by means of RJ45 connectors, located on the ESCT
front panel.
Using RJ45 connectors (10Base-T interface) each shelf is connected to the adjacent one
(bus topology). Figure 2-23, Example of intra-shelf links (10Base-T interface) (p. 2-39)
shows the topology.
In master shelf only, the above RJ45 connector can be connected to the 1353NM.
Figure 2-41, ESCT2000 front panel (p. 2-63) shows the ESCT front panel.
Figure 2-23
Example of intra-shelf links (10Base-T interface)
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-39
............................................................................................................................................................................................................................................................
Rack Alarm Interface
Two front panel connectors are available on the RAIU1000 board.

These two interfaces are:
a 9 pins SUB-D female connector
in master shelf it provides the interface with the TRU
in slave shelf it can be connected either with the TRU (point-to-point connection) or
with the RJ11 connector of another RAIU1000 board, located in the above shelf (intrashelf or chain connection)
a RJ11 connector, which allows intra-shelf (chain) connection. It has to be connected

with the 9-pin SUB-D connector of the RAIU1000 located in the shelf below.
See Figure 2-45, RAIU1000 front panel (p. 2-67).

Housekeeping
The housekeeping alarm signals are available on the front panel connector of the
HSKU1x00 board. It is a 25 pin SUB-D Female connector.
See Figure 2-44, HSKU1000 and HSKU1100 front panel (p. 2-66).
DBG interface connector
It is the interface toward debug tool, available for each EC and SC. It is a 38.4Kbps
interface with a 8-pin RJ45 connectors, on the front-panel of the ESCT2000 board (factory
tests).
DL interface
It is the Direct Link, to connect USB key or disk, available on the front panel of the
ESCT2000.
Power supply connections
Power supply voltage is distributed to the shelves on a 3 pin SUB-D connector, located on
the front panel of each PSUP1000.
See Figure 2-47, PSUP1000 front panel (p. 2-69).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 40
Overview
............................................................................................................................................................................................................................................................
Units front view

Overview
Purpose
This chapter describes the faceplates and related LED of all boards involved in 1626 LM
configurations.
Refer to this chapter if you want to know how to understand the behavior of a board when
you perform a visual checking
Contents
This chapter covers the following:

Release 5.0 Board LED
2-47
The Legacy Boards
2-47
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-41
............................................................................................................................................................................................................................................................

The following tables describe the LED for each release 5.0 board.
Table 2-5
OADC & OCNC LED
OADC LED
Description
Table 2-6
LED off: the board is plugged, but not

configured.
LED is green: the board is plugged, configured
and without any failure.
LED is red: HW failure, power supply failure or
communication failure.
LED is yellow: Firmware download on
progress. Do not extract the board.
WMAN LED
WMAN LED
Description
PWR
ABI
LED is green: the board is power supplied.

LED is red: one of the internal 48V power
supply is failed or switched off (board is starting
up or is not configured).
Yellow LED is on when there is a signal failure at

TDMX input.
ABB
Yellow LED is on when channel configuration is not

consistent or when power attenuation is not
adequate.
ABM
Yellow LED is on when there is a monitoring

problem.

configured.
............................................................................................................................................................................................................................................................
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2 - 42
............................................................................................................................................................................................................................................................
Table 2-7
TDMX LED
TDMX and WMAN LED

PWR
Description
INI
LED is yellow blinking: the board is not ready for

operation. Do not perform any action on the
board.
Table 2-8


configured.
TRBD4312 LED
TRBD4312 LED
Description
PWR
RxA

Led is yellow:at least one of the following alarms

is detected in the egress direction (WDM->B&W):
LOS, OTU2_LOM, Generic-AIS.
TxA
Led is yellow:at least one of the following alarms

is detected in the ingress direction (B&W->WDM):
LOS , Wavelength Deviation, Output Power
Degraded.
OOS
Led is yellow:the board is in transition state. This

is typically the case when board initialisation is on
progress.

configured.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-43
Release 5.0 Board Faceplates
............................................................................................................................................................................................................................................................

The following figure illustrates the release 5.0 board faceplates.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 44
............................................................................................................................................................................................................................................................
Figure 2-24
Release 5.0 Board Faceplates (1/2)
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-45
............................................................................................................................................................................................................................................................
Figure 2-25
Release 5.0 Board Faceplates (2/2)
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 46
The Legacy Boards
............................................................................................................................................................................................................................................................
The Legacy Boards

Overview
Purpose
This section gives an illustration of all the faceplates of boards which have been released
prior release 5.0.
Contents
This section covers the following:

Figure 2-26
TRBD1111, TRBD1121, TRBD1131 boards front panel
2-48
Figure 2-27
TRBD1191 board front panel
2-49
Figure 2-28
TRBC1111 board front panel
2-50
Figure 2-29
2xGE_FC board front panel
2-51
Figure 2-30
ETHC1000 board front panel
2-52
Figure 2-31
SFP optical module
2-53
Figure 2-32
XFP optical module
2-54
Figure 2-33
CMDX1010 board front panel
2-55
Figure 2-34
BMDX1X00 board front panel
2-56
Figure 2-35
ALCT1010 front panel
2-57
Figure 2-36
OMDX8100_L1_X board front panel
2-58
Figure 2-37
OMDX8100_xx front panel
2-59
Figure 2-38
OMDX4100 front panel
2-60
Figure 2-39
OCPU2104 front panel
2-61
Figure 2-40
LOFA11xx front panel
2-62
Figure 2-41
ESCT2000 front panel
2-63
Figure 2-42
OSCU1010 front panel
2-64
Figure 2-43
2-65
Figure 2-44
HSKU1000 and HSKU1100 front panel
2-66
Figure 2-45
RAIU1000 front panel
2-67
Figure 2-46
USIB1000 front panel
2-68
Figure 2-47
PSUP1000 front panel
2-69
Figure 2-48
FANS1000 front panel
2-70
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-47
Overview
............................................................................................................................................................................................................................................................
Figure 2-26 TRBD1111, TRBD1121, TRBD1131 boards front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 48
Overview
............................................................................................................................................................................................................................................................
Figure 2-27
TRBD1191 board front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-49
Overview
............................................................................................................................................................................................................................................................
Figure 2-28 TRBC1111 board front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 50
Overview
............................................................................................................................................................................................................................................................
Figure 2-29
2xGE_FC board front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-51
Overview
............................................................................................................................................................................................................................................................
Figure 2-30 ETHC1000 board front panel
............................................................................................................................................................................................................................................................
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2 - 52
Overview
............................................................................................................................................................................................................................................................
Figure 2-31
SFP optical module
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-53
Overview
............................................................................................................................................................................................................................................................
Figure 2-32 XFP optical module
............................................................................................................................................................................................................................................................
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2 - 54
Overview
............................................................................................................................................................................................................................................................
Figure 2-33
CMDX1010 board front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-55
Overview
............................................................................................................................................................................................................................................................
Figure 2-34 BMDX1X00 board front panel
............................................................................................................................................................................................................................................................
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2 - 56
Overview
............................................................................................................................................................................................................................................................
Figure 2-35
ALCT1010 front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-57
Overview
............................................................................................................................................................................................................................................................
Figure 2-36 OMDX8100_L1_X board front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 58
Overview
............................................................................................................................................................................................................................................................
Figure 2-37
OMDX8100_xx front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-59
Overview
............................................................................................................................................................................................................................................................
Figure 2-38 OMDX4100 front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 60
Overview
............................................................................................................................................................................................................................................................
Figure 2-39
OCPU2104 front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-61
Overview
............................................................................................................................................................................................................................................................
Figure 2-40 LOFA11xx front panel
............................................................................................................................................................................................................................................................
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2 - 62
Overview
............................................................................................................................................................................................................................................................
Figure 2-41
ESCT2000 front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-63
Overview
............................................................................................................................................................................................................................................................
Figure 2-42 OSCU1010 front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 64
Overview
............................................................................................................................................................................................................................................................
Figure 2-43
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-65
Overview
............................................................................................................................................................................................................................................................
Figure 2-44 HSKU1000 and HSKU1100 front panel
............................................................................................................................................................................................................................................................
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2 - 66
Overview
............................................................................................................................................................................................................................................................
Figure 2-45
RAIU1000 front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-67
Overview
............................................................................................................................................................................................................................................................
Figure 2-46 USIB1000 front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 68
Overview
............................................................................................................................................................................................................................................................
Figure 2-47
PSUP1000 front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2-69
Overview
............................................................................................................................................................................................................................................................
Figure 2-48 FANS1000 front panel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
2 - 70
Overview
Purpose
This chapter describes the main function delivered by the 1626 LM.
Contents
This chapter covers the following functions:
Optics
3-2
Optical Supervision
3-14
Protection
3-17
3-20
Transmission Frame
3-28
Loopbacks
3-32
Equipment Control
3-36
Power supply
3-41
3-44
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3 -1
The Optical Signal Process
............................................................................................................................................................................................................................................................
Optics
This section describes:
the main characteristics of the entities involved in:

the optical signal process,
the 1626 LM operation management services.
the optical channels used for the various application.

The optical signal is processed according to a bidirectional communication mode as
described in the following table.
Table 3-1
Optical Signal Process
Step
Process / Function
Boards involved
Comments
User/Client signal conversion

into WDM signal
Concentrators (if required):
TRBC and TRBD provides with

enhanced FEC.
ETHC1000
2xGE_FC
Transponders:
Optical Multiplexing
TRBC
TRBD
CMDX
BMDX
OMDX
The 50 Ghz grid

multiplexer/demultiplexer is
based on OMDX combined with
BMDX (up to 12:1 input/output).
The 100 Ghz grid
multiplexer/demultiplexer is
based on OMDX (OMDX4100
and 8100) to address the regional
applications.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-2
............................................................................................................................................................................................................................................................
Step
Process / Function
Boards involved
Comments
Amplification
LOFA
WDM Transmission
Optical Demultiplexing
Refer to step 2
The amplification takes place

after step 2 before signal
transmission along the optical
fiber.
If required, DCU module
(Dispersion Compensation Unit)
can be inserted in LOFA midstage or between cascaded LOFA
toprovide long distance
transmission without signal
penalty.
Optical Supervisory Channel
(OSC) provided by OSCU board
is added at the LOFA
input/output. It enables to
supervise all the NE along the
WDM path. OSCU interfaces
with the controller board via back
panel connection. OSCU delivers
a voice digital channel at 64 kbps.
Note: TDMX implements

Tunable demultiplexing for
Tunable OADM
configuration.
WDM signal conversion into

User/Client signal
Note:
Refer to step 1
For Tunable and Reconfigurable OADM configurations, WMAN carries out
channel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-3
Transmission Rates/Mode and Standard Compliance
............................................................................................................................................................................................................................................................
Transmission Rates/Mode and Standard Compliance

Table 3-2
Transponder and Concentrator Transmission Rates/Mode
Transponders /
Concentrators
User/Client
Bit Rate (Gbps)
WDM Line
Bit rate (Gbps)
Transmision Mode
TRBD1xyz
9.953
(STM-64 / OC-192 /
10 GbE WAN)
10.709 (G.709)
UNI
10.709 (G.709)
10.709 (G.709)
NNI
10.31 (10 GbE WAN)
11.0957
Proprietary UNI
10.519 (10 Gb FC)
11.317
Proprietary UNI
TRBD4312
39.813
43.018
UNI
TRBC
Up to 4x2.48
(STM-16 / OC-64)
10.709
UNI / NNI
Up to 4x2.66 (G.709)
10.709
Up to 2x1.256
(GbE LAN)
2.48
(STM-16 / OC-48)
GFP-T mapping
Up to 2x1.0625
(Gb FC)
2.48
(STM-16 / OC-48)
GFP-T mapping
Up to 9x1.25 (GbE)
9.953
(10 GbE WAN)
2xGBE_FC
ETHC
Table 3-3
Transponder and Concentrator Standard Compliance
Transponders / Concentrators
Standard Compliance
TRBC / TRBD (User/Client Signal)
ITU-T G.691, I-64.1 (VSR signals)

ITU-T G.693, VSR2000-2R1 (VSR signals)
Bellcore GR253-CORE SR1 (VSR signals)
ITU-T G.691 (S-64.2b signals)
ITU-T G.957 (STM-16 / OC-48)
ITU-T G.959.1 ((L-64.2 signals)
IEE 802.3ac-2002 (10 GbE WAN / LAN)
TRBC / TRBD (WDM Signal)
ITU-T 694.1
2xGbE (User/Client Signals)
IEE 802.3
2xGbE (WDM Signals)
ITU-T G.957-c for STM-16

ITU-T G.704 for GFP-T
ETHC (User/Client Signals)
IEE 802.3
ETHC (WDM Signals)
IEE 802.3ac-2002 (10 GbE WAN)
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-4
The Optical Channels
............................................................................................................................................................................................................................................................

Depending on the mux/demux scheme used, the 1626 LM transmits:
up to 96 channels on a 50GHz grid, in the Extended C-band
up to 32 channels on a 100GHz grid, in the C-band.
up to 48 channels on a mixed 50 and 100GHz grid, in the C-band.
The following tables gives the nominal ferquency allocation plan for each transmission
type.
Table 3-4 Nominal frequencies allocation plan in C-Band for long haul applications
(50GHz grid)
Band
Central frequency
(THz)
Channel
Number
Central wavelength (nm)
Band 1
195.900
195900
1530,33
195.850
195850
1530,72
195.800
195800
1531,11
195.750
195750
1531,50
195.700
195700
1531,90
195.650
195650
1532,29
195.600
195600
1532,68
195,550
195550
1533,07
195.500
195500
1533,46
195.450
195450
1533,86
195.400
195400
1534,25
195.350
195350
1534,64
195.300
195300
1535,03
195.250
195250
1535,43
195.200
195200
1535,82
195,150
195150
1536,21
Band 2
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-5
............................................................................................................................................................................................................................................................
Band
Central frequency
(THz)
Channel
Number
Band 3
195.100
195100
1536,61
195.050
195050
1537,00
195.000
195000
1537,39
194.950
194950
1537,79
194.900
194900
1538,18
194.850
194850
1538,58
194.800
194800
1538,97
194.750
194750
1539,37
194.700
194700
1539,76
194.650
194650
1540,16
194.600
194600
1540,55
194.550
194550
1540,95
194.500
194500
1541,35
194.450
194450
1541,74
194.400
194400
1542,14
194.350
194350
1542,54
194.300
194300
1542,93
194.250
194250
1543,33
194.200
194200
1543,73
194.150
194150
1544,13
194.100
194100
1544,52
194.050
194050
1544,92
194.000
194000
1545,32
193.950
193950
1545,72
Band 4
Band 5
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-6
............................................................................................................................................................................................................................................................
Band
Central frequency
(THz)
Channel
Number
Band 6
193.900
193900
1546,12
193.850
193850
1546,52
193.800
193800
1546,91
193.750
193750
1547,31
193.700
193700
1547,71
193.650
193650
1548,11
193.600
193600
1548,51
193.550
193550
1548,91
193.500
193500
1549,31
193.450
193450
1549,71
193.400
193400
1550,11
193.350
193350
1550,51
193.300
193300
1550,92
193.250
193250
1551,32
193.200
193200
1551,72
193.150
193150
1552,12
193.100
193100
1552,52
193.050
193050
1552,92
193.000
193000
1553,33
192.950
192950
1553,73
192.900
192900
1554,13
192.850
192850
1554,53
192.800
192800
1554,94
192.750
192750
1555,34
Band 7
Band 8
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-7
............................................................................................................................................................................................................................................................
Band
Central frequency
(THz)
Channel
Number
Band 9
192.700
192700
1555,74
192.650
192650
1556,15
192.600
192600
1556,55
192.550
192550
1556,96
192.500
192500
1557,36
192.450
192450
1557,77
192.400
192400
1558,17
192.350
192350
1558,58
192.300
192300
1558,98
192.250
192250
1559,39
192.200
192200
1559,79
192.150
192150
1560,20
192.100
192100
1560,60
192.050
192050
1561,01
192.000
192000
1561,42
191.950
191950
1561,82
191.900
191900
1562,23
191.850
191850
1562,64
191.800
191800
1563,04
191.750
191750
1563,45
191.700
191700
1563,86
191.650
196550
1554,27
191.600
191600
1564,68
191.550
191550
1565,08
Band 10
Band 11
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-8
............................................................................................................................................................................................................................................................
Band
Central frequency
(THz)
Channel
Number
Band 12
191.500
191500
1565,49
191.450
191450
1565,39
191.400
191400
1566,31
191.350
191350
1566,72
191.300
191300
1567,13
191.250
191250
1567,54
191.200
191200
1567,95
191.150
191150
1568,36
Note
Band sequence (both G.652 and G.655 fiber)
Band 6, Band 7, Band 8, Band 4, Band 9, Band 3, Band 2, Band 10, Band 5, Band 1,
Band 11, Band 12
ALC in B5 until the band is loaded, then turned off.
Channel sequence inside each band
G.652: from the most internal channel (i.e. the closest to 1546nm) to the most external,
with 50GHz spacing
G.655, designed for 100GHz spacing: from the most internal to the most external, with
100GHz spacing
G.655, designed for 50GHz spacing: from the most internal to the most external,
starting with 100GHz spacing, then passing to 50GHz spacing (after loading at
100GHz is complete).
Links without OADMs
ALC can be turned off after 32 channels (100GHz loading) or 64 (50GHz loading).
Links with OADMs
ALC cannot be removed if the traffic add/dropped at an OADM needs to be protected:

Band 5 is generally reserved for ALCT insertion
Maximum number of channels: 7 x 11bands = 77.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-9
............................................................................................................................................................................................................................................................
Table 3-5
Frequencies allocation plan in C-Band for Metropolitan applications

(100GHz grid)
Band
Central frequency
(THz)
Channel
Number
S1 Band
196.000
196900
1529.55
195.900
195900
1530,33
195.800
195800
1531,11
195.700
195700
1531,90
195.500
195500
1533,46
195.400
195400
1534,25
195.300
195300
1535,03
195.200
195200
1535,82
195.000
195000
1537,39
194.900
194900
1538,18
194.800
194800
1538,97
194.700
194700
1539,76
194.500
194500
1541,35
194.400
194400
1542,14
194.300
194300
1542,93
194.200
194200
1543,73
193.800
193800
1546,91
193.700
193700
1547,71
193.600
193600
1548,51
193.500
193500
1549,31
193.300
193300
1550,92
193.200
193200
1551,72
193.100
193100
1552,52
193.000
193000
1553,33
S2 Band
L1 Band
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3 - 10
............................................................................................................................................................................................................................................................
Band
Central frequency
(THz)
Channel
Number
L2 Band
192.800
192800
1554,94
192.700
192700
1555,74
192.600
192600
1556,55
192.500
192500
1557,36
192.300
192300
1558,98
192.200
192200
1559,79
192.100
192100
1560,60
192.000
192000
1561,42
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-11
............................................................................................................................................................................................................................................................
Table 3-6
Frequencies plan for Metropolitan applications (50 and 100GHz mixed

grid)
Band
Central frequency
(THz)
Channel
Number
Band 1
195.900
195900
1530,33
195.850
195850
1530,72
195.800
195800
1531,11
195.750
195750
1531,50
195.700
195700
1531,90
195.650
195650
1532,29
195.600
195600
1532,68
195,550
195550
1533,07
195.500
195500
1533,46
195.450
195450
1533,86
195.400
195400
1534,25
195.350
195350
1534,64
195.300
195300
1535,03
195.250
195250
1535,43
195.200
195200
1535,82
195,150
195150
1536,21
195.100
195100
1536,61
195.050
195050
1537,00
195.000
195000
1537,39
194.950
194950
1537,79
194.900
194900
1538,18
194.850
194850
1538,58
194.800
194800
1538,97
194.750
194750
1539,37
Band 2
Band 3
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3 - 12
............................................................................................................................................................................................................................................................
Band
Central frequency
(THz)
Channel
Number
Band 4
194.700
194700
1539,76
194.650
194650
1540,16
194.600
194600
1540,55
194.550
194550
1540,95
194.500
194500
1541,35
194.450
194450
1541,74
194.400
194400
1542,14
194.350
194350
1542,54
193.800
193800
1546,91
193.700
193700
1547,71
193.600
193600
1548,51
193.500
193500
1549,31
193.300
193300
1550,92
193.200
193200
1551,72
193.100
193100
1552,52
193.000
193000
1553,33
192.800
192800
1554,94
192.700
192700
1555,74
192.600
192600
1556,55
192.500
192500
1557,36
192.300
192300
1558,98
192.200
192200
1559,79
192.100
192100
1560,60
192.000
192000
1561,42
L1 Band
L2 Band
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-13
Optical Supervision
............................................................................................................................................................................................................................................................
Optical Supervision
The optional out-of-band Optical Supervisory Channel allows the supervision of all the
NEs along the WDM path; moreover it gives some order-wires (data channel and voice
channel) to the users.
From current release this function is managed by 1626 LM equipment, by means of
the OSCU1010 supervision unit. This board provides two optical transmitters and two
optical receivers to enable to supervise two directions.
Remotely, from a Craft Terminal or 1353 SH, it is possible to access the status of a distant
NE and send commands to it by means of the OSC.
12 D-channels are extracted from the OSC to build a communication stream at 64 kbps per
D-channel.
It is added/dropped in each NE along the transmission line, providing a communication
link within the system. In this way the external DCN, necessary to connect the WDM
system to the NMS, can reach any NE, receiving the supervision information concerning
the whole transmission path through the OSC.
CT/N
Figure 3-1
NE
NE
OSC
generation
OSC
generation
Remote supervision through OSC
The OSC is transported over a 1510 nm extra-band wavelength with a 4.864 bit rate being
the result of the multiplexing of two 2.048 Mbps streams: the 2 Mbps supervision frame
for embedded DCC and an additional 2 Mbps Data Channel reserved for future use (not
available in current release).
The supervision channel is
added to the aggregate optical signal at the output of the terminal equipment, after the
booster (input of the WDM line),
terminated in each OADM, back-to-back terminal or repeater (extracted before the

preamplifier/1st stage amplifier, from the optical signal received from the line, and
added after the booster/2nd stage amplifier, to the optical signal transmitted to the line)
dropped from the received optical signal at the input of the terminal, before the
preamplifier (output of the WDM line).
The optical supervisory channel conveys a supervision frame that contains all the
information for
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3 - 14
Optical Supervision
............................................................................................................................................................................................................................................................
distant NE management (Line Terminal, Fixed and Tunable/Reconfigurable OADM,

back-to-back or Line Repeater)
remote user-access from any site to all other sites,
auxiliary channels for data transmission (64 kbps Engineering Order Wire)
voice phone channels.
Two kinds of calls can be placed on the voice phone channel: point-to-point call and
conference call.
The following figure illustrates the OSCU implementation in an OADM configuration.
Figure 3-2
OSCU Implementation in OADM Configuration
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-15
Optical Supervision
............................................................................................................................................................................................................................................................
At first, the 4Mbps signal on a 1510 nm wavelength, is extracted from the optical
aggregate signal with an optical filter, in amplifier or mux/demux board. Then it is
received by the OSCU board and electrically demultiplexed in two 2 Mbps streams: the 2
Mbps OSC stream and the additional 2 Mbps stream.
The additional 2 Mbps stream is sent to the USIB board through back panel links to be
dropped to the client.
The 64 Kbps E2 byte carrying the voice channel, is dropped towards the board front panel
on which a telephone handset is plugged.
The DCCs are sent with the entire 32 bytes frame through back panel TDM links to the
ESCT board located in slot #1. The FPGA extracts the DCC bytes and stores them in
registers. All the processing are performed by the microprocessor.
In the reverse way, the microprocessor generates the information to be sent, gives it to the
FPGA that builds the 32 bytes frame. This frame is sent to the OSCU board through TDM
links.
The OSCU board fills the 64 kb/s E2 voice channel.
It fills the 2Mbps with the stream coming from the USIB. Then it multiplexes the 2 Mbps
supervisory channel with the additional 2 Mbps stream. The laser emits the 4 Mbps OSC
frame that is multiplexed through an optical filter in an amplifier board (LOFA) or
Mux/Demux (BMDX).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3 - 16
Protection
............................................................................................................................................................................................................................................................
Protection
In the 1626 LM, the optical protection (channel protection) is provided with the Optical
SNCP (O-SNCP) performed by means of a dedicated protection coupler (OCPU2104) and
transponders (TRBD and TRBC, in current release).
OCPU2104 provides O-SNCP for TRBD and TRBC clients. 2 clients are 1+1 protected,
by means of 2 optical couplers and splitters, as shown in Figure 3-3, OSNCP: supported
configurations (p. 3-17). It is a medium height board.
.
Figure 3-3
OSNCP: supported configurations
Figure 3-4
Transponder sub-system in O-SNCP configuration
The tributary signal is bridged over two different lines (working and protecting line). In
this way the signal is delivered towards two different paths. At the receiver side the
selection between the two diversely routed signals is performed. The protection switching
is triggered by the following switching criteria: LOS, OTU-LOF, OTU-LOM, OTU-TIM,
ODU-AIS, Generic-AIS, FEC uncorrected errors.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-17
Protection
............................................................................................................................................................................................................................................................
The split and select functions are optically performed, by means of passive optical
couplers and splitters, hosted in the OCPUx104 board).
The selection is done by shutting-down the user Tx corresponding to the path in failure
thus activating the protecting one (an example is given in Figure 1-22, Optical protection
way of working (p. 1-30)).
This kind of protection can be used on two different topologies: linear links and ring
topologies, as shown in Figure 1-20, Optical channel protection in linear links (p. 1-29)
and Figure 1-21, Optical SNCP protection scheme: with back-to-back terminals or
OADM (p. 1-30), respectively.
In the following is detailed the O-SNCP way of working:
two transponders/boards (main and protecting) exchange information, via dedicated

backplane links, on the quality of the signal that they have to deliver at the client B&W
interface
the two transponders arbitrate between them with the target of choosing the best
signal, and decide the transponder that has to shutdown the BW laser, and the one that
has to activate it
the inputs of the two B&W interfaces of the transponders are connected (via optical
cables) to the outputs of a 50/50 splitter
the outputs of the two B&W interfaces of the transponders are connected (via optical
cables) to the inputs of a coupler; since only one B&W laser is active at a given time, a
switch is in fact realized by shutting down the current active laser and activating the
current inactive laser
the working and the protecting transponder must be allocated in adjacent twin slots
(slots 3-4, 5-6, ..but not 4-5) to perform the protection switch. Figure 3-5, O-SNCP:
shelf configuration examples (p. 3-19) shows slot relationship between OCPU2104
and TRBD/C.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3 - 18
Protection
............................................................................................................................................................................................................................................................
Figure 3-5
O-SNCP: shelf configuration examples
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-19
Performance Monitoring Points on transmission boards
............................................................................................................................................................................................................................................................
Performance Monitoring is a function which provides the operator with the ability to
constantly monitor the quality of the signal flowing through his WDM network. This
function is available at selected Performance Monitoring Points, it is performed through
an accumulation of information during fixed time windows (granularity periods: 15min or
24h) and it provides consistent information to the management interface (end-to-end
monitoring).
When PM is activated, for each PM Point, the following processes are automatically
performed
Continuous monitoring by transmission boards of the quality of the signal flowing

through the PM Point and generation of raw PM information, known as 1s PM
primitives (1s stands for 1 second)
Correlation between 1s PM primitives by the system, with periodic collection of 1s

PM primitives and accumulation of corresponding PM counters (PM events) during
the current monitoring period.
N.B. PM primitives are raw information, internally used, but not made available at
NMS; PM counters are the significant values resulting of correlations between PM
primitives. These values are made available to the NMS.
Generation of PM current data related to the current monitoring period (15min / 24h),
based on PM counters accumulated during the current monitoring period
Comparison of PM counters of the current monitoring period with related PM

Threshold profile (TCA)
Generation of PM history data, with storing of PM information related to past 15min /

24h periods
From the management interface, it is possible to manage PM data (clear PM counters,

activate or deactivate Performance Monitoring...) and PM Thresholds (profile
assignment/modification...).The latter is used to generate Threshold Crossed Alarms
(TCA).

PM Points are characterized by the following parameters:
monitored side, which can be:
Egress if monitoring is performed on information received from WDM side (WDM -> BW)
Ingress if monitoring is performed on information received from B&W side (B&W -->
WDM)
monitored end, which can be:
Near End if monitoring is related to the quality of the received signal
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3 - 20
............................................................................................................................................................................................................................................................
monitored layer, which can be:
on TRBD
FEC at 10/40 Gbps based on FEC decoder info (Corrected Errors, Uncorrected
Blocks)
SDH10G/SDH40G based on information (B1 byte) contained in SDH Regenerator

Section 10G overhead and specific ETSI processing
on TRBC
FEC at 10Gbps based on FEC decoder info (Corrected Errors, Uncorrected

Blocks)
SDH2.5G based on information (B1 byte) contained in SDH Regenerator Section

2.5G overhead and specific ETSI processing
on 2xGE_FC
Layer 1 GbE PM (client side), based on 8B/10B coding (either on GbE or FC

signals)
SDH2.5G based on information (B1 byte) contained in SDH Regenerator Section

overhead and specific ETSI processing
on ETHC1000
Layer 1 GbE PM (client side), based on 8B/10B coding
Layer 2 (User/Client and WDM line sides)
SDH10G based on information (B1 byte) contained in SDH Regenerator Section

overhead and specific ETSI processing
For each PM Point it is possible to activate monitoring with 15min or 24h (or both at the
same time) granularity. The following table summarizes the combination of monitored
side/end/layer, supported in current release.
Table 3-7
Boards and supported Performance Monitoring Points
PM Point
1626 LM ETSI
Near end egress FEC PM at 10 Gbps
TRBC and TRBD
Near end egress FEC PM at 10 Gbps
TRBD4312
Near end egress B1 PM at 10 Gbps (STM-64)
TRBD, ETHC1000
Near end egress B1 PM at 40 Gbps (STM-256
TRBD4312
Near end ingress B1 PM at 10 Gbps (STM64)
TRBD, ETHC1000
Near end ingress B1 PM at 40 Gbps (STM64)
TRBD4312
Near end egress B1 PM at 2.5 Gbps (STM16)
TRBC and 2xGE_FC
Near end ingress B1 PM at 2.5 Gbps (STM16)
TRBC and 2xGE_FC
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-21
............................................................................................................................................................................................................................................................
PM Point
1626 LM ETSI
Near end egress Layer 1 10 GbE PM
TRBD1191, only if 10GbE

LAN
Near end ingress Layer 1 10 GbE PM
TRBD1191, only if 10GbE

LAN
Near end ingress Layer 1 GbE PM
2xGE_FC and ETHC1000
Near end egress Layer 2
ETHC1000
1626 LM PM working mode
The Performance Monitoring sub-system performs the end-to-end quality-of-service

monitoring of each individual wavelength, all along its path. Performance monitoring is
available:
CLIENT side, at the User Rx access in order to monitor the client incoming (near end)
signal; in this case
for TRBD and TRBC: PM (SDH type) is based on B1 and Threshold Crossing Alarm
based on B1 errors count
for 2xGE_FC, ETHC1000: PM (GbE type) is based on Layer 1 counters (8B/10B)
for TRBD1191 (if 10 GbE LAN only): PM (10 GbE type) is based on Layer 1 counters
(64B/66B)
for ETHC1000: PM (GbE type) is based on Layer 1 counters
Line/WDM side, at the WDM Rx access in order to monitor the Line/WDM incoming
(near end) signal and its transmission through the WDM network; in this case PM and
Threshold Crossing Alarm are based on
for TRBD and TRBC: FEC corrected/uncorrected errors
for 2xGE_FC and ETHC1000: Layer 1 PM based on code violations (using SDH
counters).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3 - 22
............................................................................................................................................................................................................................................................
Figure 3-6
TRBD, TRBC: example of possible monitored sections
Figure 3-7
2xGE_FC: example of possible monitored sections
Figure 3-8
ETHC1000: example of possible monitored sections
As already stated, the system monitors 1s PM primitives and then generates PM counters,
briefly described in the following.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-23
............................................................................................................................................................................................................................................................
PM counters (PM events) accumulation by the Shelf Controller for 15min/24h granularity
period
Starting from 1s PM primitives collected with the polling mechanism, SC evaluates
corresponding PM counters (also known in standards as PM events) increments, that are
accumulated over the current monitoring period to which they are related (15min or
24hours) for PM purposes (Current Data generation).
The performance monitoring is supported at the following layers:
SDH Regenerator Section (RS) layer, both for STM-16 (2.5 Gbps) and STM-64/10
GbE WAN signals
FEC layer, for 10 Gbps signals
layer 1 PM, for 1.250 Gbps (GbE) and 1.0625 Gbps (FC) signals
For the SDH-RS layer, the following performance counters are supported:
ES (Erroneous Second): Count of seconds with at least one B1 code violation or with
at least one RS defect
SES (Severely Erroneous Second): Count of seconds which contains more than 2400
(approximately > 30%) B1 code violation, or at least one RS defect. A SES is also
counted as an ES
BBE (Background Block Error): Count of B1 code violations which occur outside a
SES.
For the FEC layer at 10Gbps, the following performance counters are supported:
BEC (Background Error Corrected): count of FEC corrected errors that occurred
outside a SCS (result is divided by 512 for display reasons)
SCS (Severely Corrected Seconds): count of seconds with a FEC layer defect or at
least one FEC uncorrected block or more than 33 538 048 FEC corrected errors (this
corresponds to a rate of FEC corrected errors per second higher than approximately
3E-3)
BBU (Background Block Uncorrected): count of FEC uncorrected blocks that

occurred outside a SUS
SUS (Severely Uncorrected Seconds): count of te number of seconds of presence of

FEC/OCH layer defects in the system.
CS (Corrected Seconds): counter not used; fixed value = 0.
US (Uncorrected Seconds): counter not used; fixed value = 0.
For the Ethernet layer 1 at 1.25Gbps (GbE) or 1.0625Gbps (Fiber Channel), the
following performance counters are supported (per each port):
based on 8B/10B coding structure of the Ethernet frame, two types of errors are
detected:
RDE (Running Disparity Error)
IW (Invalid Word)
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3 - 24
............................................................................................................................................................................................................................................................
these RDE and IW errors occurring in 1s are accumulated in a 16 bits counter, called
ICG (Invalid Code Group)
based on ICG and LOS/LOF detection, the following performance counters are
supported
ES: at least one ICG or one LOS or LOF or unit missing within the second
SES: at least 10000 ICG (corresponds to a BER <10-5) or one LOS or LOF or unit
missing
BBE: ICG occurring outside a SES
For the Ethernet Layer 2 (1 and 10 Gbps), the following performance counters are
supported (per each port):
TRCF: Total Received Correct Frames

TRCF counts the number of valid frames received by each Ethernet port.
TRCF sums the number of received unicast, multicast and broadcast frames.
TRCO: Total Received Correct Octets

TRCO counts the number of valid bytes received by each Ethernet port.
TRSEF: Total Received Service Errored Frames

TRSEF counts the number of errored frames received by each Ethernet port.
TTF: Total Transmitted Frames

TTF counts the number of frames transmitted by each Ethernet port.
TTF sums the number of transmitted unicast, multicast and broadcast frames.
TTO: Total Transmitted Octets

TTO counts the number of bytes transmitted by each Ethernet port.
TDF: Total Dropped Frames

TDF counts the number of frames dropped by each Ethernet port.
Unavailable Time
A period of unavailable time (UAT) shall begin when 10 consecutive SES (or SUS) events
have been detected. These 10 seconds are considered to be part of the available time.
The UAS counter shall accumulate over the monitoring period (it shall be reset at the end
of the monitoring period) the number of seconds of unavailable time.
Performance monitoring event counting for ES, SES, BBE shall be inhibited during
unavailable time.
An alarm UAT shall be raised at the detection of a period of unavailable time and cleared
at the detection of a new period of available time, whatever the monitoring period.
PM current data management
Performance Monitoring on a given PM Point can be activated on either 15-minute or 24hour (or both at the same time) granularity.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3-25
............................................................................................................................................................................................................................................................
During a monitoring period, PM information (counters, elapsed time, etc.) is continuously

updated and can be managed from management interface. At the end of the monitoring
period, the content of PM current data (counters, elapsed time, etc.) is stored into history
data, the current data is reset and a new monitoring period begins. Up to sixteen 15min and
one 24h history data are stored in the NE.
Threshold Crossing Alarms (TCA)
15min and 24h PM counters are compared to provisionable thresholds, in order to

generate TCA.
TCA on 15min PM counters are raised/cleared according to a Dual Level Threshold
Crossing mechanism while TCA on 24h PM counters are raised according to a Single
Level Threshold Crossing mechanism:
Single Level Threshold Crossing: a threshold level is associated to each counter of an

activated PM point; TCA is raised each time the threshold is crossed by any counter,
during an accumulation period (a single level TCA is implicitly cleared at the
beginning of each monitored period)
Dual Level Threshold Crossing: two threshold levels are associated to each counter of
an activated PM point: the Set and the Reset ones. TCA is generated each time the Set
(high) threshold is crossed during an accumulation period. TCA is reset (clear) at the
end of a subsequent accumulation period in which the counter that generated TCA is
lower than or equal to the Reset (low) value.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
3 - 26
............................................................................................................................................................................................................................................................
Default thresholds for QoS alarms
The default values of set and reset thresholds are given in the following tables.
Table 3-8
RS counters default threshold data values
15 min Set
Threshold
15min Reset
Threshold
Threshold Data Id
BBE
ES
SES
BBE
ES
SES
3 RS Counters 15min
24000
50
10
200
24 hours Threshold
Threshold Data Id
BBE
ES
SES
2 - RS Counters 24h
36000
150
15
Table 3-9
OCH counters default threshold data values
15 min Set Threshold

Threshold Data
Id
BB
U
BE
C
US
9 - OCH Counters
15min
213
15 min Reset Threshold
CS
SU
S
SCS
BB
U
BEC
US
CS
SUS
SCS
10
10
24 hours Threshold
Threshold Data
Id
BB
U
BE
C
US
CS
SU
S
SCS
8 - OCH Counters
24h
218
300
300
Alarms
For TCA, the ASAP mechanism to set the alarm severity is not used. In order to set the
alarm severity the reference object is Threshold Data, in which the alarm severity can be
configured setting the severity Indication field of the counter Threshold Attribute List
attribute. The default severity is Warning for all the TCA.
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Introduction
............................................................................................................................................................................................................................................................
Transmission Frame
The G.709 standard offers a considerable quantity of service channels in the OverHead
(OH) bytes of the frame. These bytes are used for section maintenance (frame alignment,
network management operations, auxiliary communications,..).
For reader's convenience, the structure of some WDM frames is shown in the following
pages; in particular will be further detailed the structure to the digital domain structures.
Reference specifications: G.709.
Introduction
In the following is briefly described the G.709 frame construction (Optical Transport
Hierarchy - OTH), in client to WDM direction.
This paragraph is mainly dedicated to the adaptation of the 10 Gbps B&W client signals
(SDH/SONET...), into the WDM colored signals. A brief description of the 2.5 Gbps
B&W client signals is also given, in particular on the multiplexing structure to have the
10Gbps WDM signal.
The UNI interface is thus considered, client side.
In case of NNI, the input signals to the system is OTUk; thus, this is the starting level in
the structure (no OPUk and ODUk adaptation has to be performed).
Refer to Figure 3-9, Optical Transport Hierarchy (OTH) frame structure (p. 3-30). The
client signal or an Optical channel Data unit / Tributary Unit Group is mapped into the
OPUk. The OPUk is mapped into an ODUk and the ODUk is mapped into an OTUk. The
OTUk is mapped into an Optical Channel (OCh). In the next paragraph, an explanation of
these mapping will be provided.
The OCh is an information structure consisting of the OCh payload with a certain
bandwidth and non-associated overhead for the optical channel management. The OCh
transports a digital client signal between 3R regeneration points.
The OCh is then modulated onto an Optical Channel Carrier (OCC), representing a
tributary slot within the OTM. The OCC consists of the OCC Payload, assigned to a
wavelength/frequency of the WDM group, and OCC Overhead, that is transported within
the OTM Overhead Signal (OOS) structure.
Wavelength division multiplexing

Up to n OCCs are multiplexed into the Optical Multiplex Section (OMS) using
wavelength division multiplexing. The characteristic information of the OMS consists of
OMS payload and OMS overhead. The OMS overhead is transported within the OOS
structure.
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............................................................................................................................................................................................................................................................
The Optical Physical Section of order n (OPSn) is a network layer providing functionality
for transmission of a multi-wavelength optical signal on optical media of various types
(e.g. G.652, G.653 and G.655 fibre).
It combines the transport functionality of the OMS and OTS layer networks without their
supervisory information.
The characteristic information of the Optical Transmission Section (OTS) consists of OTS
payload and OTS overhead. The OTS OverHead is added to the payload to create an OTM;
It includes information for maintenance and operational functions to support OTS. The
OTS overhead information is contained within the OOS structure and it is terminated
where the OTM is assembled and disassembled.
The Optical Transport Module (OTMn) is the information structure that is transported
across the Optical Network. The OTM consists of up to n multiplexed optical channels and
an OTM overhead signal (OOS) to support the non-associated overhead. It is the structure
used to support OTS layer connections in the OTN.
The Optical Supervisory Channel (OSC) is the physical carrier outside the amplifier band
providing the transport of the OTM overhead signal; it is multiplexed into the OTM using
wavelength division multiplexing.
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............................................................................................................................................................................................................................................................
Figure 3-9
Optical Transport Hierarchy (OTH) frame structure
Refer to Figure 3-10, Multiplexing of four ODU1 into a ODU2 (p. 3-30) where is
mainly presented the multiplexing of four ODU1 signals into the OPU2 signal. The
multiplexing structure is compliant to the ITU-T G.709/Y.1331 recommendation.
Each (of four) B&W client signal is mapped into the OPU1. The OPU1 is mapped into an
ODU1.
An ODU1 signal is extended with frame alignment overhead and asynchronously mapped
into the Optical channel Data Tributary Unit 1 into 2 (ODTU12), using the justification
overhead (JOH).
The four ODTU12 signals are time division multiplexed (bit interleaving) into the Optical
channel Data unit Tributary Unit Group 2 (ODTUG2), after which this signal is mapped
into the OPU2.
The OPU2 is then mapped into an ODU2 and the ODU2 is mapped into an OTU2.
The four incoming signals can be fully asynchronous. The stuffing overheads are inserted
in order that the client signal (e.g. STM16) is fully transparently transmitted.
Figure 3-10
Multiplexing of four ODU1 into a ODU2
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Optical channel transport unit (OTUk) description
............................................................................................................................................................................................................................................................
Optical channel transport unit (OTUk) description

The OTUk conditions the ODUk for transport over an optical channel network connection.
The OTUk frame structure is completely standardized.
The OTUk (k = 1,2,3) frame structure is based on the ODUk frame structure and extends it
with a forward error correction (FEC) as shown in Figure 3-11, G.709/Y.1331 - OTUk
frame structure (p. 3-31).
256 columns are added to the ODUk frame for the FEC and the reserved overhead bytes in
row 1.
Columns 1 to 7 are dedicated to the Frame Alignment overhead.
Columns 8 to 14 of the ODUk overhead are used for OTUk specific overhead, resulting in
an octet-based block frame structure with four rows and 4080 columns. The MSB in each
byte is bit 1, the LSB is bit 8. The bit rates of the OTUk signals are defined below:
OTU1 = 2.666 057 Gbps
OTU2 = 10.709 225 316 Gbps
OTU3 = 43.018 413 559 Gbps
The OTUk forward error correction (FEC) contains the FEC codes (RS or Enhanced FEC
or BCH).
If no FEC is used, fixed stuffing bytes (all-0s pattern) are to be used.
The transmission order of the bits in the OTUk frame is left to right, top to bottom, and
MSB to LSB.
Figure 3-11
G.709/Y.1331 - OTUk frame structure
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TRBC & TRBD Loopbacks
............................................................................................................................................................................................................................................................
Loopbacks
Loopbacks are performed for troubleshooting purposes to identify faults in the
transmission path with the help of an external test device. The external test device is used
to compare the outgoing and returning signals. The result of the loopback is shown on the
external test device.
You can create a loopback and continue test at the user interface of ETHC, 2xGBE_FC
or TRBC/TRBD boards.
Important!
You cannot create a loopback on both user and line sides at the same
time.

Loopbacks are available at the user interface on all TRBDs and TRBC111.
The following loop-back functions shall be available:
B&W line loop & continue: the client signal received on the B&W interface is copied
and sent back through the B&W emitter. This signal is also transmitted as usual to the
WDM interface.
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............................................................................................................................................................................................................................................................
WDM line loop & continue: the signal received on the WDM interface is copied and
sent back through the WDM emitter. It is also transmitted to the B&W interface.
Figure 3-12
TRBD Loop-backs
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2xGBE_FC & ETHC Loopbacks
............................................................................................................................................................................................................................................................
Figure 3-13
TRBC1111 Loopbacks

For 2xGBE_FC boards, the following loopbacks are available:
on user side, loop-and-continue
on line side, loop-and-continue.
Figure 3-14
Loopbacks configuration of 2xGE_FC
For ETHC boards, the following loopbacks are available:
on user side, loop-and-cut: it performs a loop at PCS level
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............................................................................................................................................................................................................................................................
on line side, loop-and-continue: it performs a line loop after the PCS block.
Figure 3-15
Loopbacks configuration of ETHC1000
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Equipment Controller function
............................................................................................................................................................................................................................................................
Equipment Control
Equipment Controller manages Shelf Controllers.
There is one active Equipment Controller in each node and one active Shelf Controller in
each shelf.
The ESCT2000 (Equipment and Shelf Controller) is the hardware platform designed to
support the Equipment Controller (EC) function and the Shelf Controller (SC) function.
The ESCT2000 board is in charge of the internal management of the node. It dispatches
controls received by management system to the appropriate board, check consistency
between expected configuration and the actual one and finally reports alarms, performance
counters and measurements.
When the ESCT2000 board is located in the master shelf:
both functionalities are operational and active,
a flash memory hosts the node software and the configuration database.
When the ESCT 2000 board is located in secondary shelves:
only the SC functionality is provided,
the flash memory is not required.
Note
To work properly, the control function needs to know some mandatory information that
XTID1000 (eXTended ID 1000) is able to provide. There is one eXTended ID unit per
1626 LM shelf in slot 27..
The eXTended ID1000 unit is an hardware extension of the back panel. Its configuration
must be done before the system starts up and cannot be modified without a user manual
intervention.
The following parameters are provided by the XTID1000:
EQUIPMENT_TYPE (1626 LM)
SHELF_ID, which locates the shelf in the NE configuration

(For master shelf, SHELF_ID = X0000001)
Equipment Controller function

The EC supports the Q3 Network Management agent.
It provides the HW resources (physical interfaces) and the SW functionalities (protocol
stack) required for the communication between NE and Management system (OS, craft
terminal, etc.).
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Management buses/interfaces
............................................................................................................................................................................................................................................................
The EC function can be split into several domains, corresponding to the main functions
performed:
equipment - equipment type, release, address, authorized NMS addresses, rack

description
Fault Management - Alarm Severity Assignment Profiles (ASAP), Alarms correlations
Performance Monitoring - history storage of 15 Minutes and 24hour PM data

(provided by SC) in order to provide them to Network Management
Software - software version management, software activation, software download
Support - Filtering, logging and forwarding of events and alarms received by SCs
Routing and Addressing - OSI/IP routing capability configuration
Security - access control.
The Database which contains the NE configuration is saved in the pluggable hard disk.
SC provides the resources to support the SW functions related to the physical machine
control and management and configuration provisioning.
In a shelf all the boards are connected to the SC via the SPI or ISPB (for PM collection on
ETHC1000 board) bus allowing the SC processor to collect the control information of the
boards (e.g.: alarms collection, remote inventory and data EEPROM reading).
The SC function can be split into several domains, corresponding to the main tasks
Equipment - Detection of card presence with direct hardware link, Collection of

remote inventory, Check that card present in slots are the expected ones, Check
firmware version of the boards, Dispatching of provisioning requests received by EC
to boards
Performance Monitoring - Collection of one-second primitives used for elaboration of

PM counters (15Min and 24 hours) which are then sent to EC, Collection of analog
measurements (if any)
Fault Management - Monitoring of faults: local SC faults, boards faults (equipment,

communication, transmission), threshold crossing alarms
Software - firmware download (via HW config bus on ETHC1000).
F interface: available from the EC function, CT is Q3/TL1 (supported in future release)
interface for the connection to a local Craft Terminal. It is a 38.4 kbit/s serial RS232
interface with a DB9 connector.
NMS Interface: available from the EC function, NMS is the Q3/TL1 (supported in future
release) interface toward Network Management System (NMS). It is a 10 / 100 Mbps
Ethernet interface (10 Base-T) with RJ45 connectors.
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............................................................................................................................................................................................................................................................
IS-LINK is inter-shelf link, used to realize the communication between the EC and all the
SCs. It is a 100 Mbps Ethernet bus (10BaseT interface) between EC and SCs located in
separated shelves
In master shelf, front panel IS-LINK port is connected to EC processor (EC data to local
SC are carried over ISSB bus).
In each slave shelf, front panel IS-LINK is connected to SC processor.
ISSB: it is a local serial bus allowing communication between EC and the local SC (future
use).
Push Buttons interface, used to
test LEDs: pushing this button on ESCT supporting EC functionality lights the LEDs
of all the units of all the shelves of the NE but not on Top Rack Unit. All the possible
colors of a LED are lit on whatever the previous state of the LED when this button is
pressed.
Nothing happens if ESCT only supports SC functionality (since this button is managed
by EC)
reset ESCT board
cut off the alarms.
RA (Remote Alarms) interface: it is dedicated to send commands toward the rack to light
up the relevant lamps.
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............................................................................................................................................................................................................................................................
HK (HouseKeeping) interface: it allows the user to manage some electrical relays and
opto-couplers through CT/NMS (1353 NM) in order to remotely command some devices
external to the 1626 LM NE.
Figure 3-16
Controller sub-system
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Example of control interfaces scheme
............................................................................................................................................................................................................................................................
Example of control interfaces scheme
Figure 3-17 Example of control interfaces scheme
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Functional description
............................................................................................................................................................................................................................................................
Power supply
The powering architecture is distributed: two PSUP1000 (Power SUPply unit) cards are in
charge of feeding, in 1+1 protection mode, all the other cards hosted in the shelf. Each
card is able to provide from the main powering, by means an internal DC/DC converter,
the required power supply.
The main purposes are:
Supply and distribute -48V/-60V filtered and protected voltage to all the boards
housed in each 1626 LM shelf
Supply and distribute +3.7V and +5.4V protected voltages to SPIDER circuitry in all
the boards
Give alarms on fault battery and voltages loss.
Each Subrack receives powering from two DC supplies compliant with ETSI standard
ETS 300 132-2, for nominal -48V or -60V supplies. Each of the two DC supplies is
protected at the top of the rack by appropriate circuit breakers prior to being fed to each
subrack within the rack.
Each of the two supplies (-48V_A and -48V_B) feed one of the two PSUP1000 plugged in
each subrack.
The PSUP1000 units provide the necessary filtering and surge suppression of the -48V or
-60V input DC supply, prior to distributing the power supply to the units within the
subrack.
The filtered -48V/-60V supply is fed from each power supply unit to the backplane, the
power rails are then combined using sharing diodes on each card supplied with the -48V/60V power supply.
Under normal operating conditions the load required by the unit from the -48V/-60V
supply is shared approximately equally between the two PSUP1000 inputs.
At the -48V/-60V input interface of each unit, appropriate fuses shall be used to protect
the card.
The normal input voltage range of the power supply module is either:
- 40,5 V t - 48 V t - 57,0 V
- 50,0 V t - 60 V t - 72,0 V.
A battery return path to each of the two -48V/-60V supplies from the units to the power
supplies is provided.
On each PSUP1000 unit, a 3.7V (V3A & V3B) power rail and a 5.4V (V5A & V5B)
power rail are derived from its filtered -48V/-60V power supply and from the filtered 48V/-60V of the other PSUP1000. The 3.7V and 5.4V power rails are then distributed to
............................................................................................................................................................................................................................................................
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............................................................................................................................................................................................................................................................
all cards in slots 1 to 41 of the subrack.

The 3.7V power rails (V3A & V3B) are combined (using diodes) in the unit to provide a
single 3.3V power supply, that will be fused within the unit. This is to prevent a fault
condition of this power rail within the unit from causing a fault condition on the backplane
V3A/B power supply rail to the other units.
The same occurs for the 5.4V power rails (V5A & V5B), providing a 5.0V power supply.
Figure 3-18, 1626 LM - equipment power supply scheme (p. 3-43) shows the equipment
power supply scheme.
Abnormal service range
The 1626 LM equipment operating at -48 V is not damaged if subjected to the following
voltage range: 0 V to -40,5 V and -57 V to -60 V.
When the equipment operates at -60 V, is not damaged if subjected to the following
voltage range: 0 V to -50 V and -72 V to -75 V.
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............................................................................................................................................................................................................................................................
Therefore, the equipment accepting either a -48V or -60V power supply input is able to
operate within specification over the voltage range of -40.5 to -72.0V and will not suffer
any damage when subjected to an input voltage in the range of 0V to -40.5V and -72.0V to
-75.0V.
Figure 3-18
1626 LM - equipment power supply scheme
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Housekeeping
............................................................................................................................................................................................................................................................

Housekeeping
The 1626 LM system is able to interface with user's environment and/or another 1626 LM
system to build up maintenance operations by means of the HSKU (House Keeping unit).
Its main purpose is to send and receive data from/to master cards via SPI bus, and from/to
the user or another 1626 LM system throughout protected I/O interface.
The HSKU1000 allows the user to manage some electrical relays and opto-couplers
through the Craft/SH in order to command remotely some devices external to the 1626
LM. The user is thus able to
be informed of the status of the input opto-couplers
remotely change the state of the output relays.
Each HSKU1000 board provides 8 output relays and 8 input opto-couplers.

The status of the OUT relays can be managed (Open/Close) through the SW separately for
each relay. The IN opto-couplers status can be raised by the board to the SW separately for
each opto-coupler.
As regards the opto-couplers, the Shelf Controller poll them (IN1 to IN8) regularly, and
then this information is immediately transferred to the Equipment Controller and notified
to the management interface.
Rack Alarm Management

The Rack Alarm Interface Unit (RAIU) monitors the rack alarms to light On or Off the
lamps of the top rack unit.
Each shelf of all the racks (master and secondary shelf) is equipped with one RAIU1000
board which collects information on the alarms raised in the shelf.
This unit exchanges the alarm signals between the ESCT or the Alarm Bus (FANS and
PSUP alarms) and the Top Rack Unit (TRU).
These alarms are analyzed either by the ESCT board or directly by the Alarm card
(RAIU1000). Depending on the emergency of these alarms, the ESCT generates signals to
turn on LEDs on the or TRU and so to alert users.
The RAIU of the slave shelf only takes into account:
the alarms raised by the fan modules or by the power supply units of the shelf via the
ALARM bus
the information sent by the RAIU board of the below shelf when present.
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............................................................................................................................................................................................................................................................
The RAIU board of the master shelf collects signals:
from the ESCT via the SPI bus
from the EC via the URG, NURG and UP signals
directly from the fan modules and from the power supply units of the shelf via the
ALARM bus
from the RAIU board of the shelf below.
The RAIU board located in master rack is connected to the top rack unit, as shown on
Figure 3-19, Electrical links between RAIU cards and TRU (p. 3-47). Inter shelf
communication between RAIU boards is managed via an external cable on the front panel.
Main RAIU1000 functionalities:
management of four output alarm signals to be sent to the TRU: CRI_AL, MAJ_AL,
MIN_AL and RACK_AL;
back panel connection to/from the ESCT board via the SPI bus for alarm commands
(CMD_CRI, CMD_MAJ, CMD_MIN, CMD_RACK) or inhibition (INH_CRI,
INH_MAJ, INH_MIN, INH_RACK);
back panel connection from the ESCT board via the URG/NURG/UP wires;
back panel connection from the 3 FAN modules and the 2 PSUP slots via the ALARM
bus (1 more wire reserved for future used).
two connectors are located on the front plate of the RAIU1000 with the following
target
DB9 connector has to be connected either with the TRU or another RAIU board (on
RJ11)
RJ11 connector has to be connected with another RAIU board (on DB9).
Note that the alarms of the URG/NURG/UP wires and of the ALARM bus (FANS and
PSUP) are made available on the SPIDER, so that the SC can read them by the SPI bus
and take them into account in its alarm synthesis to raise the appropriate command
(CMD_CRI, CMD_MAJ, CMD_MIN, CMD_RACK).
It is possible to stop (inhibit) an alarm, sending the appropriated INH data to the Alarm
card. So only the related commanded LED is turned off. If another alarm is detected by the
ESCT, the appropriated signal can be sent to the Alarm card which could command the
linked LED excepted if it was inhibited LED.
Alarm management
The back panel wires (URG / NURG / UP and the ALARM bus) are sent to a first logic
sub-unit whose four output signals are connected to an OR logic module, which uses also
as input signals four signals from the SPIDER to determine the status of each one of the
four relays used to command the rack lamps
URG / NURG / ATTD, with TRU using.
If the RAIU boards of a rack are linked together, the four signals coming from another
RAIU are also taken into account.
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............................................................................................................................................................................................................................................................
The four alarm signals sent to pilot the relays, are based on the following logics:
CRI_AL On, if CMD_CRI or URG
MAJ_AL On, if CMD_MAJ or UP or at least 2 FANs in failure
MIN_AL On, if CMD_MIN or NURG or 1 FAN in failure
RACK_AL On, if CMD_RACK or PRM_AL or SEC_AL (or FAN_AL, not managed

in 1626 LM).
Generally speaking, a critical, major or urgent alarm is traffic affecting.
Table 3-10
Severity
CRITICAL
URGENT
Front Panel LEDs severity meaning
LED color
Meaning
RED
Critical/urgent alarm: immediate corrective action is

required
MAJOR
Major/urgent alarm: urgent corrective action is required
MINOR
NOT
URGENT
RED
Minor/not urgent alarm: corrective action should be

planned in order to prevent more serious fault.
ATTENDED
WARNING
YELLOW
Rack Alarm: Indication of an existing fault.

Further diagnosis should be made.
Interconnection with TRU
In current release, the 1626 LM is used with
the Top Rack Unit (TRU), in ETSI market
The RAIU board interfaces the TRU.

Three types of cables are defined to be used with the RAIU:
to interconnect with another RAIU, a DB9 - RJ11 cable is needed
to interconnect with the TRU, a DB9 - DB25 cable is needed.
Interworking with the TRU

The RAIU boards can be chained as described previously, or can be directly connected to
the TRU which has four DB25 connectors, as shown in Figure 3-19, Electrical links
between RAIU cards and TRU (p. 3-47).
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............................................................................................................................................................................................................................................................
The RAIU board manages the three leds of a TRU: URG (urgent) alarm, NURG (non
urgent) alarm and ATTD (attended) alarm.
N.B. The TRU does not send information to the RAIU board.
Figure 3-19
Electrical links between RAIU cards and TRU
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Ventilation
............................................................................................................................................................................................................................................................
Ventilation
Fans are located at the bottom of each shelf (slot 41) of a rack with in addition an air filter
just below, as shown in Figure 3-20, Fan shelf description and Rack partitioning
(p. 3-48).
The FANS are monitored via the SPI bus and some direct wires are sent to the HSKU and
the RAIU boards to monitor a possible failure of the cooling system.
The maximum power dissipation per shelf is 640 W.
Figure 3-20
Fan shelf description and Rack partitioning
The main target of the FANS1000 drawer is to avoid overheating and possible board
damages.
For each FAN module, some HW parameters are monitored to raise board alarms such as
the 48V power supply failure, the fuse or the rotation speed.
They are then collected by the Alarms Logic to raise an HW failure of the FANS1000 unit
to the SPIDER and also an individual alarm for each FAN module on a dedicated back
panel wire (BUS_AL#i), used by the RAIU or the HSKU to monitor a failure of the
cooling system.
The TEMP_W_x_y (where x_y can be 1_7 or 8_13 or 14_20) represents the external
control of each FAN module rotation speed, by the boards associated to this module. In
fact, the boards of a group share the same back panel wire to control the rotation speed of
the corresponding FAN module: if the temperature of one of the boards exceeds a given
threshold, the board sends a command to the FAN module to increase its rotation speed.
POWER SUPPLY. Two +48V power supplies are generated by DC/DC converters from 2
external batteries, providing supply redundancy.
The 2 batteries from back-panel can vary from 36V to 72V. On the board the two 48V
voltages (48V_A, 48V_B) are coupled together by a diode and the battery with the
maximum voltage is selected.
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Remote Inventory
............................................................................................................................................................................................................................................................
The card includes fuses in the 48V supply.

The 48V voltages are then filtered on the Power Supply part of the board and then
forwarded to DC/DC converters to provide 2 regulated voltages 48V_1 and 48V_2. Two
voltages are generated for security.
The output of each DC/DC converter is connected to a comparator on the Monitoring
Block which generates an alarm (sent to the SPIDER) if the voltage is under 43V.
All components on the card are powered from the 48V supply, with the exception of the
SPIDER device which is supplied via the external backplane 3.3V supply.
Remote Inventory
See Figure 3-21, Remote Inventory sub-system (p. 3-50). The Remote Inventory
function permits the operator to retrieve information about any card present on the
equipment.
The available information is: construction date, code number, maker name, board
identification, etc.
The Remote Inventory information is stored within a dedicated EEPROM present on all
boards.
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Remote Inventory
............................................................................................................................................................................................................................................................
Figure 3-21
Remote Inventory sub-system
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1626 LM system characteristics

Main system characteristics
General
Optical bit rate, client side
(B&W)
9.9532 Gbps (UNI) - TRBD1111, TRBD1121, TRBD1191

10.3125 Gbps (UNI) - TRBD1131, TRBD1191
39.813 Gbps (UNI) - TRBD4312
2.488 Gbps (UNI) - TRBC1111
2.488 Gbps (STM-16) - 2xGE_FC
1.250 Gbps (GbE) - 2xGE_FC, ETHC1000
1.0625 Gbps (FC) - 2xGE_FC
Optical bit rate, WDM side
10.709 Gbps for TRBD1111, TRBD1121, TRBD1191,

TRBC1111
11.095728 Gbps for TRBD1131 and TRBD1191
43.018 Gbps for TRBD4312
2.488 Gbps for 2xGE_FC
Type of optical fiber
G.652, G.655, G.652 for tight links
Central frequencies and

wavelengths
see Table 3-1, Frequencies plan for Metropolitan applications

(50 and 100GHz mixed grid) (p. 3-16) for Metropolitan
applications
see Table 3-2, Nominal frequencies allocation plan in C-Band
for long haul applications (50GHz grid) (p. 3-23) for Long Haul
applications (50 GHz grid)
see Table 3-3, Frequencies allocation plan in C-Band for
Metropolitan applications (100GHz grid) (p. 3-33) for Regional
applications (100 GHz grid)
Application types
Line Terminal (LT), Line Repeater (LR), Regenerative Back-toBack Terminal (BT), T-OADM, R-OADM, T/R-OADM
............................................................................................................................................................................................................................................................
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4 -1
............................................................................................................................................................................................................................................................
Interfaces types
Electrical interfaces: Analog audio interf. G.712, 64Kbps G.703

(EOW), 2Mbps G.703 (user channels), RS-232 at 38.4 Kbps (CT
interface), USB 1.1 (CT interface, for future release), Ethernet
10Base-T at 100 Mbps (NMS interface), Ethernet 10Base-T at
100 Mbps (IS-LINK interface), RS-232 at 38.4 Kbps (debugger
interface)
Optical interfaces: all the client and WDM interfaces above
listed
System dimensions
Maximum number of racks in
Line
12
Add-Drop features
Connectivity
0-100% add-drop capability
............................................................................................................................................................................................................................................................
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4-2
............................................................................................................................................................................................................................................................
Protections
Network protections
Optical SNCP, performed via OCPU2104
Equipment optical protections
1+1TRBD and TRBC, performed via OCPU2104
Powering protections
1+1Power Supply Card
Management interfaces
Functions provided
Q3 interface with PC (CT/Remote CT), 1353NM and 1354RM

NMS (on terminal)
Station alarms
Equipment Alarm status (indicated by the front cover LEDs)
Visual indications for card fail.
Management interfaces
supported:
Q3 to connect a Local or Remote Equipment Craft Terminal (RS

232 interface at 38.4Kbps and, for future release, USB1.1)
Q3 to connect the OS 1353NM (100 Mbps 10Base-T Ethernet
Interface)
Local interface:
Craft Interface (PC)
RS232 SUB-D 9pin, PC compatible at 38.4

Kbps. Mini USB 1.1 for future release
Remote interface:
Craft Interface (PC)
RS232 SUB-D 9pin, PC compatible at 38.4

Kbps and mini USB 1.1 for future release. It
handles up to 32 NEs via DCC
Remote interface:
Transmission
Management Network
(TMN) interface
ITU-T G.773 10Base-T
Protocol
Stack/Information
Model messages
Q3
Operation processes (management interfaces functions)

Configuration and
provisioning
Equipment, Units, Add-Drop, Alarms status, Maintenance memory

for all the equipment events
Software download
It is made locally as well as remotely on non volatile memories

without traffic interruption
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3AL 75131 AAAA
4-3
............................................................................................................................................................................................................................................................
Performance monitoring
TRBD/C client side, 2xGE_FC and ETHC, line side: based on B1

and Threshold Crossing Alarm based on B1 errors count, ingress and
egress (SDH/SONET), according to G.806, G.8201, G.709.
TRBD/C, WDM side: based on FEC corrected/uncorrected errors.
2xGE_FC and ETHC, client side: Layer 1 Ethernet PM, based on the
8B/10B coding structure of the Ethernet frame, according to Tables
36-1 and 36-2 of the 802.3 standard (2005 ed. section 3).
Remote Inventory
At rack, subrack and board level
Unit and equipment

acknowledgement
Through Remote Inventory: Company id, Unit type, Unit part

number, Software part number, CLEI code, Manufacturing Plant,
Date Identifier, Date of construction... For details, refer to the
operator's handbook
Security
Password, operator profile, back up for programs and data
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-4
............................................................................................................................................................................................................................................................
Housekeeping (HSKU)
Number of housekeeping
accesses
9 inputs and 9 outputs
Connector
SUB-D 25 pins
Output HSKU signals
By electronic relay contacts connected to the common out
Max. guaranteed current

through IN relay with closed
condition
100 mA
Voltage between OUTn and

common OUT with closed
condition
<2.5 V
Resistance of the closed relay

with closed condition
<300 mOhms
Voltage between OUT and

common with open condition
<72 V
Input HSKU signals
By opto-couplers connected to the common GND (GNDP)
maximum forward current
30 mA
maximum voltage applied

between INn and GNDP
3 V (without resistor)
N.B. If the user wants to connect -48V power supply, he has to put a resistor of a value higher than
1500
Ohms, 1.5 W to have a current equal to 30mA.
Optical Supervisory Channel (OSC) characteristics
See Optical Supervisory
Channel Unit (OSCU101x)
optical characteristics
(p. 4-53).
Clock characteristics
External clock is not required
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3AL 75131 AAAA
4-5
............................................................................................................................................................................................................................................................
Applicable standards
ITU-T G.709
Interfaces for the Optical Transport Network (OTN)
ITU-T G.798
Characteristics of optical transport network hierarchy equipment

functional blocks
ITU-T G.691
Optical interfaces for single channel STM-64, STM-256 systems and

other SDH systems with optical amplifiers
ITU-T G.692
Optical interfaces for multichannel systems with optical amplifiers
ITU-T G.693
Optical interfaces for intra-office systems
ITU-T G.694.1
Spectral grids for WDM applications: DWDM wavelength grid
ITU-T G.872
Architecture of optical transport networks
ITU-T G.957
Optical interfaces for equipment and systems relating to the

synchronous digital hierarchy
ITU-T G.959.1
Optical transport network physical layer interfaces
G.7710
Common equipment management function requirements
G874.1
Optical Transport Network (OTN) protocol-neutral management

information model for the network element view
ITU-T G.664
Optical safety procedures and requirements for optical transport

systems
ITU-T G.825
The control of jitter and wander within digital networks which are
based on the synchronous digital hierarchy (SDH)
ITU-T G.8251
The control of jitter and wander within the optical transport network
(OTN)
IEEE 802.3
Ethernet standard
IEEE. 802.1Q (Annex D)
VLAN bridge
G7041/Y13013
GFP
IEC60825-1 and IEC60825-2
Optical safety
The nominal frequencies allocation plan in Extended C-Band is shown in
Table 3-1, Frequencies plan for Metropolitan applications (50 and 100GHz mixed
grid) (p. 3-16) for Metropolitan applications (50 and 100GHz mixed grid)
Table 3-2, Nominal frequencies allocation plan in C-Band for long haul applications
(50GHz grid) (p. 3-23) for Long Haul applications on a 50 GHz grid
Table 3-3, Frequencies allocation plan in C-Band for Metropolitan applications

(100GHz grid) (p. 3-33) for Regional applications on a 100 GHz grid
The loading plan for Long Haul applications is shown in Loading plan for 50 GHz grid
mux/demux subsystem (p. 3-22).
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4-6
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The loading plan for Regional applications is shown in Loading plan for 100 GHz grid
mux/demux subsystem (p. 3-32).
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3AL 75131 AAAA
4-7
Safety requirements and mechanism
............................................................................................................................................................................................................................................................

Electrical safety
Safety status of the connections with

other equipment
TNV (Telecommunication Network Voltage) for Remote alarms,

Housekeeping, Rack lamps (RM) and tributary connections if
K20 protected.
SELV (Safety Extra Low Voltage) for all the other.
Electrical Safety compliance with standardized Norms
Compliancy to Safety Norms is declared in that the equipment satisfies standardized

Norms:
IEC 60950-1 ed. 2001
EN 60950-1 ed. 2001
Electrical Safety Labelling
The labels reproduced in Electrical Safety: Labelling (p. A-5) are affixed during factory
settings.
Electrical Safety instructions
The safety instructions for proper assembly, maintenance and safe use including clear
warning concerning precautions to avoid possible exposure to hazardous voltages, are
reported in Safety Rules (p. A-3) and more specifically in Electrical safety: general
rules (p. A-5).
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3AL 75131 AAAA
4-8
............................................................................................................................................................................................................................................................
Optical safety
Optical Safety compliance with European Norms
Compliancy to Optical Safety Norms is declared in that the equipment satisfies

standardized Norms:
EN 60825-1 ed.1994 + A11 ed.1996 + A2 ed.2001
IEC 60825-1 ed.1993 + A2 ed. 2001 (1999)
EN 60825-2 ed.2000
IEC 60825-2 ed.2000
Hazard Level classification and standards
The classification refers to the IEC 60825 Standard (with amendments 1 & 2).
This recommendation defines 4 HAZARD LEVELs for optical fiber applications in third
window (1500 - 1800 nm):
HAZARD LEVEL 1, for optical power below +10mW (10dBm)
HAZARD LEVEL 1M, for optical power in [10mW; 136mW] (10dBm to 21,3dBm)
HAZARD LEVEL 3B, for optical power in [136mW; 500mW] (21,3dBm to 27dBm)
HAZARD LEVEL 4, for optical power higher than 500mW (>27dBm).
G.664 standard defines the optical safety mechanisms:
Automatic Laser Shutdown (ALS): Procedure to automatically shutdown the output

power of laser transmitters and to avoid exposure to hazardous levels
Automatic Power ShutDown (APSD): Procedure to automatically shutdown the output

power of optical amplifiers to avoid exposure to hazardous levels.
This recommendation defines also the following areas for laser application installation
Unrestricted Area (location where access to the transmission equipment is accessible

to the public). APSD mandatory if accessible optical power could exceed hazard level
1 AEL (Accessible Emission Limit)
Restricted Area (location that is normally inaccessible by the general public but that
is accessible to personnel that may not have laser safety training).
APSD mandatory if accessible optical power could exceed hazard level 1M AEL
(Accessible Emission Limit) or if optical power can exceed class1 from connector
Controlled Area (location that is inaccessible except to authorized personnel with

appropriate laser safety training).
APSD mandatory if accessible optical power could exceed hazard level 1M from
connector and hazard level 3B AEL (Accessible Emission Limit) from a failed fiber.
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3AL 75131 AAAA
4-9
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In any case of failure, the overall FIT rate of all the mechanisms inside the system that are
involved in the APSD procedure which is triggered by this failure, does not exceed 500
FITs.
In normal operating conditions (no failure), the system matches HAZARD LEVEL 1M
criteria.
During the restart mechanism, the system matches HAZARD LEVEL 1M criteria.
So according to IEC 60825 recommendation, the 1626 LM equipment is classified as
HAZARD LEVEL 1M
The OSC alone is classified as
HAZARD LEVEL 1
The following figures give the AELs of class 1 and class 1M. In other words, it gives the
maximum power that can be reached to remain in Class 1 or in Class 1M ; the integration
duration is 100 sec.
Figure 4-1
AEL for Class 1 between 1500 nm and 1800 nm
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4 - 10
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Figure 4-2 AEL for Class 1M between 1500 nm and 1800 nm
Table 4-1
AEL at 980 and 1480 nm for Hazard Levels 1 and 1M
Wavelength
Hazard Level1 Accessible

Emission Limit
Hazard Level1M Accessible Emission

Limit
980 nm
1.42 mW or 1.52 dBm
2.66 mW or 4.25 dBm
1480 nm
10 mW or 10 dBm
115 mW or 20.6 dBm
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-11
............................................................................................................................................................................................................................................................
Optical safety labelling
The labelling of the optical sources is compliant with the requirements of the IEC 60825
Standard.
The labels reported below are put during factory settings. The labels are affixed on all
front covers that protect optical connectors located on the front side plate of all the units
involved in optical transmission.
In the following, some examples of labelling are reported.
The optical interfaces which have HAZARD LEVEL 1, carry the following explanatory
label
The following label indicates the presence of a LASER beam.

If the laser is a Hazard Level 1 product, this label is not compulsory.
If the laser is a Hazard Level 1M product or upper, this label is compulsory.
Example of EXPLANATORY label.

The optical interfaces which have HAZARD LEVEL 1M according to IEC 60825-1
(2001), IEC 60825-2 (2000) and ITU-T Rec. G.664 standards and operate at 3rd window,
carry the following explanatory label
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4 - 12
............................................................................................................................................................................................................................................................
Aperture and fiber connectors
The locations of apertures and fibre connectors are reported on topographical drawings of
units front view and access cards front view in paragraph Units front view (p. 2-49).
Engineering design features
In normal operating conditions, unless intentional handling, the laser radiation is never
accessible.
The laser beam is launched in optical fibre through an appropriate connector that totally
shuts up the laser radiation. Moreover a plastic cover is fitted upon optical connectors by
means of screws.
Optical Safety instructions
The safety instructions for proper assembly, maintenance and safe use including clear
warning concerning precautions to avoid possible exposure to hazardous laser radiation,
are reported on Safety Rules (p. A-3) and more specifically in Harmful Optical
Signals (p. A-6).
APSD procedure
The APSD complies with IEC 60825 1 and 2 and ITU-T G.664 recommendations.
Additional shutdown procedure
A specific CT (USM) command allows to shutdown the LOFA1 gain blocks.
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3AL 75131 AAAA
4-13
............................................................................................................................................................................................................................................................
Generic APSD rules
The purpose of the following rules is to comply with the requirements of eye safety and to
protect equipment against overshooting.
The proposed implementation complies with safety standards subject to the
Terminal if housed in a Restricted Area
APSD example: line failure between two LRs with unidirectional amplifiers
Figure 4-3
Example of line failure between two LRs with unidirectional amplifiers
Let us consider the right NE (the same actions occur in the left NE as soon as it detects the
LOS consecutive to the APSD procedure in the right NE)
1. The top right amplifier detects a LOS
2. It shuts down its first stage (overshoots protection)
3. The previous amplifier exists but is located in an other NE so the top right amplifier
has to shut down the other amplifier of the right NE: the top right amplifier writes a SD
command on its APSD back panel link.
4. As software knows how amplifiers are connected, it has configured (during installation
phase) the down right amplifier to read the APSD back panel link written by the top
right amplifier. As a consequence, the down right amplifier receives the SD command
sent by the top right amplifier.
5. The down right amplifier shuts down.
6. The low amplifier of the left NE detects a LOS, the same procedure as the one already
described for the right NE applies.
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APSD example: line failure between a LR and a LT with unidirectional amplifiers
Figure 4-4 Example of line failure between a LR and a LT with unidirectional

amplifiers
The APSD procedure is the same of the one described in previous section APSD
example: line failure between two LRs with unidirectional amplifiers (p. 4-14).
APSD example: line failure between two LTs with bidirectional amplifiers
Figure 4-5 Example of line failure between a LR and a LT with bidirectional

amplifiers
Let us consider the right NE (the same actions occur in the left NE as soon as it detects the
LOS consecutive to the APSD procedure in the right NE)
7. The top amplifier (Stage 1) detects a LOS
8. The previous amplifier exists but is located in an other NE so the Stage 1 amplifier has
to shut down the Stage 2 of the right NE: the Stage 1 amplifier writes a SD command
on its APSD back panel link.
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3AL 75131 AAAA
4-15
............................................................................................................................................................................................................................................................
9. As software knows how amplifiers are connected, it has configured (during installation
phase) the down amplifier (Stage 2) to read the APSD back panel link written by the
top amplifier (Stage 1). As a consequence, the down amplifier receives the SD
command sent by the top amplifier.
10. The down amplifier shuts down.
11. The low amplifier (Stage 1) of the left NE detects a LOS, the same procedure as the
one already described for the right NE applies.
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Boards interfaces characteristics
............................................................................................................................................................................................................................................................

TDMX1180 optical characteristics
Optical Characteristics of the TDMX1180 Unit

Common Specifications
96 channels, 50 GHz grid in C+ Band
One input port
Up to 8 output port with one single tunable channel per output port
Fiber Type
Single-Mode (SMF)
Connector Type
MU/SPC
Return Loss
45 dB (40 dB Min.)
Channel Parameters
Input Port to Output Port
Blocked Channel
Bandwidth@-0.5 dB
+/- 12.5 GHz
+/- 12.5 GHz
Bandwidth@-3.0 dB
+/- 15.0 GHz
+/- 15.0 GHz
6.7 dB (7.0 dB Max.)
Attenuation Accuracy
+/- 0.50 dB
Attenuation Stability over 24 hrs
+/- 0.30 dB
Riple
0.20 dB
PDL
0.35 dB
Rejection
40.0 dB
40 dB
3 sec. Max. response time
3 sec. Max. response time
Insertion Loss at Minimum

Attenuation
Extinction Ratio
Channel Transition
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-17
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WMAN3174 Optical Characteristics
Optical Characteristics of the WMAN3174 Unit

Common Specifications
96 channels, 50 GHz grid in C+ Band
Up to 3 Express ports
Up to 4 Add ports
Fiber Type
Single-Mode (SMF)
Connector Type
MU/SPC
Return Loss
45 dB (40 dB Min.)
Channel Parameters
Express Channels
Add Channels
Blocked Channels
Bandwidth@-0.5 dB
+/- 12.5 GHz for 50 GHz channels
Bandwidth@-3.0 dB
+/- 15 GHz for 50 GHz channels
Insertion Loss at Minimum

Attenuation
7.7 dB
(8.1 dB Max)
7.1 dB
(7.5 db Max.)
Attenuation Accuracy
+/- 0.5 dB
+/- 0.5 dB
Attenuation Stability over 24 hrs
+/- 0.3 dB
+/- 0.3 dB
Riple
0.20 dB
0.20 dB
PDL
0.35 dB
0.35 dB
Rejection
40.0 dB
40.0 dB
40.0 dB
Extinction Ratio
Channel Transition
3 sec Max. response time
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Tributaries optical characteristics

TRibutary Direct Transponder TRBD4312
Optical Characteristics of the Client / B&W Interface of the TRBD4312 Unit

Common Specification of the Client / B&W Interfaces
Client / B&W Interface Bit Rate
39.813 Gbps - UNI
Client / B&W
STM-256, OC-768 and other 39.813 Gbps signals
User Interface Standards
ITUT G.693 ; VSR2000-3R2 ; VSR2000-3R3 ; VSR20003R5
Wavelength Range
Compliant with User Interface standards
Fiber Type
Single-Mode (SMF)
Connector Type
MU/LC/SPC
Client / B&W Interface. - Transmitter Specification

Wavelength Peak
0 < Output Power < 3 dBm (EOL)
Spectral Bandwidth (-3 dB)
Not specified
1 nm
Side Mode Suppression Ratio

(SMSR)
30 dB Min.
Client / B&W Interface - Receiver Specification

Min. Sensitivity @ BER = 10-12
-8 dBm (BOL)
Min. Overload @ BER = 10-12
+4 dBm (BOL)
Signal Clock Deviation without

Errors
+/- 100 ppm
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3AL 75131 AAAA
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Optical Characteristics of the WDM Interface of the TRBD4312 Unit

Common Specification of the WDM Interfaces
Wavelength Specification
ITU-T G.694-1, 50 GHz grid
Modulation Format
PSBT
Modulator Type
LiNb03 Mach-Zehnder
Wavelength Frequency Range
191.15 THz to 195.9 THz, 50 GHz grid
Wavelength Tunability
Over the whole Extended C Band
Wavelength Stability
+/- 2.5 GHz (EOL) / (Power and Frequency)
WDM Interface Bit Rate
43.018 Gbps
Fiber Type
SMF
Connector Type
MU/SPC
WDM Interface. - Transmitter Specification

Wavelength Peak
Average Output Power < -2 dBm (EOL after VOA)
22 GHz Max.
Not specified

(SMSR)
40 dB Min.
WDM Interface - Receiver Specification

Input Power
-17 dBm < Input Power < 5 dBm
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TRiButary Direct transponders TRBD11x1 characteristics (x=1, 2, 3)
Optical characteristics of the Client/B&W interface of the TRBD11x1 units (x=1, 2, 3)

Common specification of the Client optical interfaces
Client (B&W) interface bit rate
(IN/OUT)
9.9532 Gbps 20 ppm - UNI
Client signals (UNI)
10 GB Ethernet LAN for TRBD1131
10.3125 Gbps 100 ppm - UNI (10 GBE LAN)
STM-64 (SDH), OC-192 (SONET), 10 GB Ethernet WAN,

other 9.9532 Gbps signals (e.g. PRBS) for the other TRBDs
Wavelength range
1290 -> 1330 nm for TRBD1111

1530 -> 1568 nm for TRBD1121
1260 -> 1355 nm for TRBD1131
User interface type
ITUT G.691 I-64.1; ITUT G.693 VSR 2000 for

TRBD1111
ITUT G.691 S-64.2b for TRBD1121
IEE 802.3 10GBASE-LR for TRBD1131
Fiber type
Single-mode (SMF)
Connector type
MU/SPC
B&W interf. - Transmitter

specification
I-64.1
(TRBD1111)
S-64.2b
(TRBD1121)
10GBASE-LR
(TRBD1131)
Mean output power
-6 dBm -> -1 dBm
-1 dBm -> +2
dBm
+0.5dBm
Minimum extinction ratio
min: 6 dB
min.: 8.2 dB
min: 3.5 dB
Maximum -20dBm width
1 nm
Side mode suppression ratio
30 dB
B&W interface - Receiver

specification
I-64.1
S-64.2b
10GBASE-LR
Sensitivity @ BER = 10-12
min: -11 dBm
min: -14 dBm
Sensitivity under stressed conditions
min: -10.3 dBm
Overload @ BER = 10-12
min: -1 dBm
min: -1 dBm
+ 0.5 dB
Dispersion accommodation
max: 6.6 ps/nm
max: 800 ps/nm
Receiver reflectance
max: - 27 dB
max: - 27 dB
max: - 12 dB
Supported optical path penalty
max: 1 dB
max: 2 dB
Optical characteristics of the WDM interface of the TRBD11x1 units (x=1, 2, 3)

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............................................................................................................................................................................................................................................................
WDM interface - Common specification

Wavelength specification
ITU-T G.694.1, 50 GHz channel spacing
Modulation format
NRZ
Wavelength tunability
over the whole extended C-band for all TRBDs
Wavelength range
1530,33 nm -> 1568,36 nm
Frequency range
195,900 THz -> 191,150 THz ( 1.5 GHz)
WDM interface bit rate (IN/OUT)
11.095728 Gbps 20 ppm for TRBD1131

10.709225 Gbps 20 ppm for the other
TRBDs
Fiber type
Single-mode (SMF)
Connector type
MU/SPC
WDM interface - Transmitter specification
TRBD1111, TRBD1121, TRBD1131
Output power
-24 dBm -> +1.0 dBm
13 dB
Output power step, over the above specified

range
0.5 dB
Output power setting accuracy
-0.25dB -> +0.25 dB
Output power stability over life and temperature
-0.5dB -> +0.5dB
Output power when the frequency is not locked

or the board is not in service
max -42 dBm
WDM interface - Receiver specification
TRBD1111, TRBD1121, TRBD1131
Input optical power
-21.2 dBm -> +2.0 dBm
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TRiButary Direct transponders TRBD1191 characteristics
Optical characteristics of the Client/B&W interface of the TRBD1191 unit

Fiber type
9/125 m Single-mode (SMF)

50/125 m Multi-mode (MMF)
62.5/125 m Multi-mode (MMF)
Connector type
LC/PC on XFP module; the client interface is an XFP

module
Bit rate, client side (according to the

B&W XFP module plugged on user
side)
9.9532 Gbps 20ppm - UNI: STM-64/OC-192/10GBE

WAN
User interface type (according to the

B&W XFP module plugged on user
side)
ITUT G.691 I-64.1; ITUT G.693 VSR 2000
10.3125 Gbps 100ppm - UNI: 10 GBE LAN
ITUT G.691 S-64.2b

ITUT G.959.1 L-64.2
IEE 802.3 10GBASE-SR, 10GBASE-SW
IEE 802.3 10GBASE-LR, 10GBASE-LW
IEE 802.3 10GBASE-ER, 10GBASE-EW
Wavelength range
1st window for 10GBASE-S

2nd window for I-64.1 and 10GBASE-L
3rd window for S-64.2b, P1L1-2D2 (L-64.2), 10GBASEE
Refer to B&W XFP modules optical characteristics
(p. 4-32) for XFP details
Other user interface characteristics
Refer to B&W XFP modules optical characteristics

(p. 4-32).
Optical characteristics of the WDM interface of the TRBD1191 unit

The same of the other TRBDs, refer to TRiButary Direct transponders TRBD11x1 characteristics
(x=1, 2, 3) (p. 4-21).
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3AL 75131 AAAA
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TRiButary Concentrator (TRBC1111) characteristics
Optical characteristics of the Client/B&W interfaces of the TRBC1111 unit

Common specification of the Client optical interfaces
Client (B&W) interface bit rate (IN/OUT),
2.488 Gbps 20 ppm - UNI
on SFP module
Client signals (UNI)
STM-16 (SDH)
OC-48 (SONET)
User interface type (on SFP module)
I-16.1
S-16.1
L-16.1
L-16.2
Wavelength range
2nd window for I-16.1, S-16.1 and L-16.1
(Refer to B&W SFP modules optical

characteristics (p. 4-28) for details.)
3rd window for L-16.2.
Fiber type
9/125 m Single-mode (SMF)
Connector type
LC/SPC on SFP module
Other user interface characteristics
Refer to B&W SFP modules optical

characteristics (p. 4-28).
Optical characteristics of the WDM interface of the TRBC1111 unit

WDM interface - Common specification
Wavelength specification
ITU-T G.694.1, 50 GHz channel spacing
Modulation format
NRZ
Wavelength tunability
over the whole C-Band
Wavelength range
1530.33 nm -> 1568,36 nm nm
Frequency range
195.900 THz -> 191.950 THz ( 1.5 GHz)
WDM interface bit rate (IN/OUT)
10.709225 Gbps 20 ppm
Fiber type
Single-mode (SMF)
Connector type
MU/SPC
WDM interface - Transmitter specification

Output power
-24 dBm -> +1 dBm
13 dB
Output power step, over the above specified

range
0.5 dB
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 24
............................................................................................................................................................................................................................................................
Output power drift accuracy
min: -0.25 dB; max : +0.25 dB
Output power stability over life and temperature
min:-0.5dB;
Output power when the frequency is not locked

or the board is not in service
max -42 dBm
max:+0.5dB
WDM interface - Receiver specification

Input optical power
-21.2 dBm -> +2.0 dBm
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-25
............................................................................................................................................................................................................................................................
2xGE_FC characteristics
Optical characteristics of the interfaces of the 2GE_FC unit

Common specification, for both User and Line sides
Fiber type
9/125 m SMF
50/125 m MMF
62.5/125 m MMF
Connector type
LC/PC on SFP modules. All the interfaces (either

client or line) are SFP modules
Wavelength range
(For details refer to B&W SFP modules
optical characteristics (p. 4-28) and Table ,
DWDM SFP modules optical characteristics
(p. 4-31)).
1st window for GbE-SX

3rd window for L-16.2
3rd window for DWDM (1529.55 -> 1561.42 nm),
according to ITU-T G.694.1, 100GHz channel
spacing
2nd window for all the others B&W SFPs
Optical interface specification, User side

Bit rate, client side
all the bit rates are 3R;

1.250 Gbps: Gigabit Ethernet
1.0625 Gbps: Fiber Channel
Interface type
optical characteristics (p. 4-28)).
GbE-SX, GbE-LX, FC-LX
Other Interfaces characteristics
See B&W SFP modules optical characteristics

(p. 4-28).
Optical interface specification, Line side

Bit rate, Line/aggregate side

2.488320 Gbps: STM-16/OC-48
Interface type
optical characteristics (p. 4-28) and DWDM
SFP modules optical characteristics
(p. 4-31)).
I-16.1, S-16.1, L-16.2
Other Interfaces characteristics

(p. 4-28) and DWDM SFP modules optical
characteristics (p. 4-31).
DWDM interface for long haul (APD detector):

DWAxxx
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 26
............................................................................................................................................................................................................................................................
ETHC1000 characteristics
Optical interfaces specification

Common specification, for both User and Line sides
Fiber type
9/125 m SMF
50/125 m MMF
62.5/125 m MMF
Connector type
LC/PC (on SFP and XFP modules).

Client interfaces are SFP modules
Line interfaces are XFP modules
Wavelength range
(For details refer to B&W SFP modules optical
characteristics (p. 4-28), DWDM SFP
modules optical characteristics (p. 4-31), and
B&W XFP modules optical characteristics
(p. 4-32)).
1st window for GbE-SX

3rd window for 10GbE Base-E
2nd window for all the others B&W SFP/XFP
Optical interface specification, User side

Bit rate, client side

1.250 Gbps: Gigabit Ethernet
Interface type
(For details refer to B&W SFP modules optical
characteristics (p. 4-28)).
GbE-SX, GbE-LX
Other Interfaces characteristics (SFPs)

(p. 4-28).
Optical interface specification, Line side

Bit rate, Line side

9.9532 Gbps: 10 GbE WAN
Interface type
(For details refer to B&W XFP modules optical
characteristics (p. 4-32)).
I-64.1, 10GBE BASE-LW
Other Interfaces characteristics (XFP)
See B&W XFP modules optical characteristics

(p. 4-32).
S-64.2b, 10GBE BASE-EW
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-27
............................................................................................................................................................................................................................................................
B&W SFP modules optical characteristics
STM-16 SFP module type
I-16.1
S-16.1
Unit
Addressed wavelength
1270 -> 1360
1270 -> 1360
nm
Min. launched power
-10
-5
dBm
Max launched power
-3
dBm
Allowed bit rates
2.48832
2.125 ; 2.48832
Gbp
s
Min. extinction ratio
8.2
8.2
dB
Spectr
al
width
Max -20dB
bandwidth
NA
nm
Max. RMS width
NA
nm
Minimum SMSR
NA
30
dB
Max chromatic disp.
-12 -> +12
-100 -> +100
ps/n
m
Min sensitivity, @BER=1E-10
-18
-18
dBm
Minimum overload
-3
dBm
Max optic. path penalty
dB
Max receiver reflect.
27
27
dB
Optical connector / Fiber type
LC / SMF
LC / SMF
Acronym / interface type
I-16.1DDM / I-16.1
S-16.1DDM / S-16.1
Equipped on
TRBC1111 / 2xGE_FC
TRBC1111 / 2xGE_FC
STM-16 SFP module type
L-16.1
L-16.2
Unit
1280 -> 1335
1500 -> 1580
nm
Min. launched power
-2
-2
dBm
Max launched power
+3
+3
dBm
Allowed bit rates
2.48832
2.48832
Gbp
s
8.2
8.2
dB
Spectral
width
Max. -20dB
bandwidth
nm
Max. RMS width
NA
NA
nm
30
30
dB
Minimum SMSR
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 28
............................................................................................................................................................................................................................................................
Max chromatic disp. (ps/nm)
-250 -> +250
+1600
ps/n
m
Minimum sensitivity, @ BER=1E-10
-27
-28
dBm
Minimum overload
-8
-8
dBm
dB
27
27
dB
Optical connector (Tx/Rx) / Fiber

type
LC / SMF
LC / SMF
L-16.1DDM / L-16.1
L-16.2DDM / L-16.2
Equipped on
TRBC1111
TRBC1111 / 2xGE_FC
1.25 GbE SFP module type
1000BASE-SX
1000BASE-LX/LH
1000BASE-ZX
Unit
820 -> 860
1270 -> 1355
1540->1570
nm
Min. launched power
-9.5
-11
dBm
Max launched power
-4
-3
+5
dBm
Allowed bit rates
1.25
1.25
1.25
Gbps
dB
Spectra
l width
Max. -20dB
bandwidth
NA
NA
nm
Max. RMS width
0.85
NA
nm
Minimum SMSR
NA
NA
30
dB
Max chromatic dispersion
1200
ps/n
m
Min sensitivity, @BER=1E-12
-17
-19
-24
dBm
Minimum overload
-3
dB
dB
12
12
12
LC / MMF
LC / SMF
LC / SMF
Acronym / Interface type
1GbESXDDM /
1000BASE-S
1GbELXDDM /
1000BASE-L
1GbEZXDDM
/ 1000BASE-Z
Equipped on
2xGE_FC /
ETHC1000
2xGE_FC /
ETHC1000
2xGE_FC /
ETHC1000
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-29
............................................................................................................................................................................................................................................................
FC SFP module type
1FC, 2FC 850 nm
1FC, 2FC 1310 nm
Unit
830 > 860
1265 -> 1370
nm
Min. launched power
-10
-9.5
dBm
Max launched power
-3
-3
dBm
Allowed bit rates
1.0625 Gbps; 2.125 Gbps
dB
Spectra
l width
Max. -20dB
bandwidth
NA
NA
nm
Max. RMS width
0.85
see NOTE 1
nm
Minimum SMSR
NA
NA
dB
Max chromatic disp.
ps/n
m
Minimum sensitivity with

fiber, @ BER=1E-12
1.0625 Gbps = 17
-20
dBm
Minimum overload
-3
dBm
dB
12
12
dB
LC / SMF
LC / SMF
FC/2FCmm / FC/2FCmm
FC/2FCsm / FC/2FCsm
Equipped on
2xGE_FC
2xGE_FC
Gbps
2.125 Gbps = 15
Note: See figure 18 and figure 19 of the Physical interfaces FC-PI-2 Rev. 30, 2002" (FC/2FC
standard)
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 30
............................................................................................................................................................................................................................................................
DWDM SFP modules optical characteristics
DWDM SFP module type
APD DWDM
Unit
1527,99 -> 1563,86
nm
Min. launched power
dBm
Max launched power
+4
dBm
Maximum wavelength deviation

EOL
+/- 100
pm
Allowed bit rates
0.1 -> 2.666
Gbp
s
8.2
dB
Max -20dB bandwidth
0.5
nm
Minimum SMSR
30
dB
Max chromatic disp.
1800 / 2400 (see Note 1)
ps/n
m
Min. sensitivity, @BER=1E-10
-28
dBm
Minimum sensitivity @ 1310nm
-20
dBm
Minimum overload
-8
dBm
2 / 3 depending on dispersion (See Note

1)
dB
27
dB
LC / SMF
DWA200 -> DWA600 / APD DWDM
Equipped on
2xGE_FC
Note:
2 dB path penalty corresponds to a dispersion of 1800 ps/nm/km, 3 dB to 2400 ps/nm/km.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-31
............................................................................................................................................................................................................................................................
B&W XFP modules optical characteristics
10 Gbps XFP module type
I-64.1/10GbE Base-L
S-642b/10GbE Base-E
Unit
XFP P/N
1AB214540001
1AB217280001
1290 -> 1330
1530 -> 1565
nm
Min. launched power
-6
-1
dBm
Max launched power
-1
+2
dBm
Allowed bit rates
9.95328 ; 10.3125 ; 10.709
8.2
dB
Spectral width: max. -20dB

bandwidth
0.25
nm
Minimum SMSR
30
30
dB
Max chromatic disp.
60
800
ps/n
m
Minimum sensitivity @
BER=1E-12
-11
-14
dBm
Minimum overload
0.5
-1
dBm
dB
14
27
dB
Optical connector (Tx/Rx)
LC
LC
Fiber type
SMF
SMF
XI641 / I-64.1/10GBASEL
XS642 / S-64.2b/10GBASEE
Equipped on
TRBD1191/ETHC1000
TRBD1191/ETHC1000
10 Gbps XFP module type
10GbE Base-S
P1L1-2D2 (L-64.2)
XFP P/N
1AB214540002
1AB217280002
840 -> 860
1530 -> 1565
nm
Min. launched power
-7.3
dBm
Max launched power
-1.0
+4.0
dBm
Allowed bit rates
9.95328 ; 10.3125
9.95328 ; 10.3125 ; 10.709
Gbps
3.0
9.0
dB
Spectral width: max. -20dB

bandwidth
see table 52.8 of IEEE

802.3 standard
0.25
nm
Minimum SMSR
30
dB
Gbps
Unit
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 32
............................................................................................................................................................................................................................................................
Max chromatic disp.
1600
ps/n
m
Minimum sensitivity @
BER=1E-12
-9.9
-24
dBm
Stressed sensitivity
-7.5
dBm
Minimum overload
-2.0
-7
dBm
dB
12
27
dB
Optical connector (Tx/Rx)
LC
LC
Fiber type
50/125 m MMF
SMF
62.5/125 m MMF
X10GBASES /
10GBASE-S
XP1L12D2/P1L1-2D2 (L64.2)
Equipped on
TRBD1191
TRBD1191
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-33
............................................................................................................................................................................................................................................................
Multiplexers / demultiplexers optical characteristics

8:1 and 1:8 Channel Mux / DemultipleXer (CMDX1010) optical characteristics
CMDX1010 optical interfaces specification

CMDX Common
specification
Comments
Application type
Long Haul, on a 50 GHz grid
Nominal Channel
Centre frequencies
See wavelength allocation table (Table 3-2,

Nominal frequencies allocation plan in C-Band
for long haul applications (50GHz grid)
(p. 3-23))
Fiber type
Single-mode (SMF)
Connector type
MU/SPC
CMX parameters
(multiplexing side)
minimum
Channel Passband
44
Insertion loss
5.0
CMX input power
typical
maximum
units
Comments
44
GHz
Centered on the
frequencies specified in
Table 3-2, Nominal
frequencies allocation plan
in C-Band for long haul
applications (50GHz
grid) (p. 3-23)
8.2
dB
Across all channel centres
-27
15
dBm
At one input
CMX output power
-32
19
dBm
At combined output
CDX parameters
(demultiplexing side)
minimum
maximum
units
Comments
Channel Passband
20
20
GHz
Centered on the frequencies

specified in Table 3-2, Nominal
frequencies allocation plan in CBand for long haul applications
(50GHz grid) (p. 3-23)
Insertion loss
5.0
7.3
dB
Across all channel centres
CDX input power
-5
15
dBm
6.8
typical
6.4
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 34
............................................................................................................................................................................................................................................................
12:1 and 1:12 Band Multiplexer/ DemultipleXer (BMDX1000) optical characteristics
BMDX1000 optical interfaces specification

BMDX1000 Common specification
Comments
Application type
Fiber type
Single-mode (SMF)
Connector type
MU/SPC
Muxed/Demuxed channels
see Table 3-2, Nominal

frequencies allocation plan in
C-Band for long haul
applications (50GHz grid)
(p. 3-23)
BMDX1000 parameters
mini
mum
typi
cal
maxi
mu
m
unit
s
Comments
Nominal centre frequencies (

nom)
192.3125; 191.7125;
192.1125; 192.5125;
192.9125; 193.3125;
193.7125; 194.1125;
194.5125; 194.9125;
195.3125; 195.7125;
THz
See also Table 4-3,

Multiplexed/demultiplexed
channels by BMDX1000 (50GHz)
and band centre frequency
(p. 4-35)
Clear Passband
212.5
GHz
With respect to the band nominal

centre frequency
212.5
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-35
............................................................................................................................................................................................................................................................
12:1 and 1:12 Band Mux/DemuX for Band OADM (BMDX1100) optical characteristics
BMDX1100 optical interfaces specification

BMDX1100 Common specification
Comments
Application type
Fiber type
Single-mode (SMF)
Connector type
MU/SPC
BMDX1100 parameters
minimum
Nominal centre frequencies (

nom)
maximum
units
Comments
191.3; 191.7; 192.1;

192.5; 192.9; 193.3;
193.7; 194.1; 194.5;
194.9; 195.3; 195.7
THz
See also Table 4-4,

Multiplexed/demultiplexed
channels by BMDX1000
(50GHz) and band centre
frequency (p. 4-38)
Clear Passband
-160
GHz
With respect to the band

nominal centre frequency (
nom)
Muxed/Demuxed channels
Refer to Table 3-2, Nominal frequencies allocation plan in

C-Band for long haul applications (50GHz grid) (p. 3-23)
for the channel/wavelength/frequency relationship
Band 1
195850; 195800; 195750; 195700; 195650; 195600; 195550
Band 2
195450; 195400; 195350; 195300; 195250; 195200; 195150
Band 3
195050; 195000; 194950; 194900; 194850; 194800; 194750
Band 4
194650; 194600; 194550; 194500; 194450; 194400; 194350
Band 5
194250; 194200; 194150; 194100; 194050; 194000; 193950
Band 6
193850; 193800; 193750; 193700; 193650; 193600; 193550
Band 7
193450; 193400; 193350; 193300; 193250; 193200; 193150
Band 8
193050; 193000; 192950; 192900; 192850; 192800; 192750
Band 9
192650; 192600; 192550; 192500; 192450; 192400; 192350
Band 10
192250; 192200; 192150; 192100; 192050; 192000; 191950
Band 11
191850; 191800; 191750; 191700; 191650; 191600; 191550
Band 12
191450; 191400; 191350; 191300; 191250; 191200; 191150
+160
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 36
............................................................................................................................................................................................................................................................
OADC Family Optical Characteristics
Optical characteristics of OADC units

OADC0104
OADC1100
OADC1102
OADC1300
OADC1750
General Specifications
Application
10/90 Optical
Add Coupler
for ALC
channel in TOADM nodes
50/50
Add&Drop
Coupler for
Metropolitan
R-OADM and
TR-OADM
nodes
70/30
Add&Drop
Coupler for
Long-Haul ROADM nodes
8:1 Optical
Add Coupler
and 1:8 Drop
Splitter for
Long-Haul TOADM nodes
Two 4:1
Optical Add
Coupler and
one 1:8 Drop
Splitter for
Long-Haul TOADM nodes
Fiber Type
SMF
SMF
SMF
SMF
SMF
Connector Type
MU
MU
MU
MU
MU
Express Channel / From RX IN (Pre-ampli) to RX OUT (Express)

Insertion Loss at
Min. Attenuation
3.9 dB
4.4 db Max.
6.3 dB
7 dB Max.
Attenuation
Accuracy
+/- 0.3 dB
+/- 0.5 dB
Attenuation Stability
over 24 hrs
+/- 0.2 dB
+/- 0.3 dB
Riple
0.2 dB
0.2 dB
PDL
0.2 dB
0.35 dB
Express Channel / From TX IN to TX OUT (Booster)

Insertion Loss at
Min. Attenuation
1.8 dB
2.3 dB Max.
3.0 dB
4.4 dB Max.
6.5 dB
7.4 db Max.
0.2 dB
+/- 0.3 dB
+/- 0.5 dB
+/- 0.3 dB
+/- 0.2 dB
+/- 0.3 dB
Riple
0.2 dB
0.2 dB
0.2 dB
PDL
0.2 dB
0.2 dB
0.35 dB
Attenuation
Accuracy
over 24 hrs
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-37
............................................................................................................................................................................................................................................................
Optical characteristics of OADC units (Cont...)

OADC0104
OADC1100
OADC1102
Add Channel / From TX IN (Add) to TX OUT (Booster)
Insertion Loss at
Min. Attenuation
OADC1300
OADC1750
Add Channel
from
Transponders
(4x1 side)
Add Channel
from
Transponders
(8x1 side)
10.8 dB
1.9 dB Max.
3.9 dB
4.4 dB Max.
3.0 dB
3.6 dB Max.
10.6 dB
11.2 db Max.
7.3 dB
8.0 dB Max.
Attenuation
Accuracy
+/- 0.8 dB
+/- 0.3 dB
+/- 0.5 dB
over 24 hrs
+/- 0.4 dB
+/- 0.2 dB
+/- 0.3 dB
+/- 0.5 dB
+/- 0.3 dB
Riple
0.3 dB
0.2 dB
0.2 dB
0.4 dB
0.3 dB
PDL
0.4 dB
0.2 dB
0.35 dB
0.2 dB
0.15 dB
Dropped Channel / From RX IN to RX OUT (Drop)

Insertion Loss at
Min. Attenuation
3.0 dB
4.4 dB Max.
2.7 dB
3.3 dB Max.
10.6 dB
11.2 db Max.
10.6 dB
11.2 db Max.
Attenuation
Accuracy
+/- 0.3 dB
+/- 0.5 dB
over 24 hrs
+/- 0.2 dB
+/- 0.3 dB
+/- 0.5 dB
+/- 0.5 dB
Riple
0.2 dB
0.2 dB
0.4 dB
0.4 dB
PDL
0.2 dB
0.35 dB
0.2 dB
0.2 dB
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 38
............................................................................................................................................................................................................................................................
OCNC Optical characteristics
Optical characteristics of OCNC units

OCNC 1230
OCNC 1240
General Specifications
Application
30/70 Optical Coupler

followed by a 50/50 Optical
Coupler for Y nodes
30/70 Optical Coupler

followed by a 1/3 Optical
Coupler for X nodes
Fiber Type
SMF
SMF
Connector Type
MU
MU
C+ Band
C+ Band
Bandwidth
Dropped Channel / From RX IN to RX OUT (Drop)

Insertion Loss at
Min. Attenuation
2.8 dB
3.4 dB Max.
2.8 dB
3.4 dB Max.
Attenuation
Accuracy
+/- 0.3 dB
+/- 0.3 dB
over 24 hrs
+/- 0.2 dB
+/- 0.2 dB
Riple
0.2 dB
0.2 dB
PDL
0.2 dB
0.2 dB
Transmitted Channel / From RX IN to RX OUT

Insertion Loss at
Min. Attenuation
9.4 dB
10.2 dB Max.
11.2 dB
12.1 dB Max.
Attenuation
Accuracy
+/- 0.6 dB
+/- 0.6 dB
over 24 hrs
+/- 0.3 dB
+/- 0.3 dB
Riple
+/- 0.4 dB
+/- 0.4 dB
PDL
+/- 0.3 dB
+/- 0.3 dB
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-39
............................................................................................................................................................................................................................................................
Optical characteristics of OCNC units (Cont...)

OCNC 1230
OCNC 1240
Monitoring Channel / From RX IN to RX OUT (Monitoring)

Insertion Loss at
Min. Attenuation
21 dB
22 dB Max.
21 dB
22 dB Max.
Attenuation
Accuracy
+/- 0.6 dB
+/- 0.6 dB
over 24 hrs
+/- 0.5 dB
+/- 0.5 dB
Riple
0.4 dB
0.4 dB
PDL
0.4 dB
0.4 dB
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 40
............................................................................................................................................................................................................................................................
Automatic Laser Control (ALCT1010) optical characteristics
ALCT1010 optical interfaces specification

Fiber type
Single-mode (SMF)
Connector type
MU/SPC
Maximum optical output power
11 dBm (as min. value)
Minimum optical output power
-14 dBm (as max. value)
Table 4-2
ALCT1010 wavelengths list
BAND #
ALCT frequency
195.35 THz
194.95 THz
194.55 THz
194.15 THz
193.75 THz
193.35 THz
192.95 THz
192.55 THz
10
192.15 THz
11
191.75 THz
12
191.35 THz
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-41
............................................................................................................................................................................................................................................................
OMDX8100_L1_X optical characteristics
OMDX8100_L1_X optical interfaces specification

Common specification
Comments
Application type
Regional, on a 100 GHz grid
Fiber type
Single-mode (SMF)
Connector type
MU/SPC
Tributary channels frequencies

and wavelengths
refer to Table 3-3,

Frequencies allocation plan in
C-Band for Metropolitan
(p. 3-33), as regards the L1
band
The OMDX8100_L1_X is
composed of:
one 8 channels L1 band

DWDM optical MUX,
one LB and SB aggregate
signals expansion MUX,
one 8 channels L1 band
DWDM optical DEMUX ,
one LB and SB aggregate
signals expansion DEMUX.
Expansion port isolation
15 dB max
Polarization dependent loss
0.25 dB max
within the channel passband
Polarization mode dispersion
0.15 ps max
Return Loss
45 dB min
including connectors, ports

terminated
MUX parameters
Comments
Insertion Loss:
Single channel
5.3 dB max
Extra Band
3.0 dB max
Expansion
2.2 dB max
Net bandwidth @ -0.5 dB
0.25 nm
with respect to the band nominal

centre frequency ( nom)
0.3 nm

Adjacent channel isolation
15 dB

Non-Adjacent channel
isolation
30 dB

DEMUX parameters
across all channel centres
Comments
Insertion Loss:
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 42
............................................................................................................................................................................................................................................................
Single channel
4.75 dB max
Extra Band
3.0 dB max
Expansion
1.7 dB max
0.25 nm

0.3 nm

25 dB

isolation
35 dB

Directivity
50 dB
including connectors
Input power
-42 -> +25 dBm
Channel insertion loss ripple
1 dB
within nominal centre frequency

@1dB
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-43
............................................................................................................................................................................................................................................................
OMDX8100_XX (XX = L1 / L2 / S1 / S2) optical characteristics
OMDX8100_XX optical interfaces specification

Comments
Application type
Fiber type
Single-mode (SMF)
Connector type
MU/SPC

and wavelengths
Refer to Description
(p. 4-45) and Table 3-3,
Frequencies allocation plan in
C-Band for Metropolitan
(p. 3-33)
The OMDX8100 is composed

of:
one 8 channels DWDM

optical MUX,
one 8 channels DWDM
optical DEMUX.
Four boards are available,

covering the 32 channels
available on the 100 GHz grid
End-to-end single channel
insertion loss
7.65 dB max
0.30 dB max
0.30 ps max
Return Loss
40 dB min

terminated
MUX parameters
Comments
Insertion Loss:
Single channel
4.7 dB max
Extra Band
2.4 dB max
45 GHz

72 GHz

Channel passband
44 GHz
Input power
-27 -> +15 dB
at one tributary input
Output power
-32 -> +19 dB
at multiplexed output
DEMUX parameters
Comments
Insertion Loss:
Single channel
4.15 dB max
............................................................................................................................................................................................................................................................
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............................................................................................................................................................................................................................................................
Extra Band
2.4 dB max
20 GHz

34 GHz

23 dB

isolation
30 dB

Directivity
40 dB
including connectors
Input power
-25-> +15 dB
............................................................................................................................................................................................................................................................
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............................................................................................................................................................................................................................................................
OMDX4100_chXX-XX optical characteristics
OMDX4100_chXX-XX optical interfaces specification (XX-SAX = from 20-23 to 57-60)

Comments
Application type
Fiber type
Single-mode (SMF)
Connector type
MU/SPC

and wavelengths
Refer to. Description

(p. 4-48) and Table 3-3,
Frequencies allocation plan
in C-Band for Metropolitan
(p. 3-33)
The OMDX4100 is composed of:
one 4 channels DWDM

optical MUX,
one 4 channels DWDM
optical DEMUX.
Eight boards are available,

covering the 32 channels
available on the 100 GHz grid
End-to-end single channel

insertion loss
7.4 dB max
0.30 dB max
0.30 ps max
Return Loss
40 dB min

terminated
MUX parameters
Comments
Insertion Loss:
Single channel
4.45 dB max
Extra Band
2 dB max
45 GHz

72 GHz

Channel passband
44 GHz
Input power
-27 -> +15 dB
Output power
-32 -> +19 dB
at multiplexed output
DEMUX parameters
Comments
Insertion Loss:
Single channel
3.65 dB max
Extra Band
1.4 dB max
............................................................................................................................................................................................................................................................
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............................................................................................................................................................................................................................................................
20 GHz

34 GHz

23 dB

isolation
30 dB

Input power
-25-> +15 dB
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-47
............................................................................................................................................................................................................................................................
BOFA1000 & 2000 optical characteristics
BOFA1000, BOFA2000 optical interfaces specification

BOFA Common specification
Fiber type
Single-mode (SMF)
Connector type
MU/SPC
Wavelength range
1530.33 -> 1568.57 nm
BOFA optical ports
minimum
maximum
unit
s
gain block input power
-30
+6
dBm
gain block output power
+5
+15
dBm
gain block input power monitoring
-46
-10
dBm
gain block output power monitoring
-32
-8
dBm
............................................................................................................................................................................................................................................................
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............................................................................................................................................................................................................................................................
LOFA11x0 optical characteristics
LOFA1110, LOFA1120 optical interfaces specification

LOFA Common specification
Fiber type
Single-mode (SMF)
Connector type
MU/SPC
Wavelength range
1530.33 -> 1568.57 nm
Wavelength range - OSC port
1500 -> 1520 nm
LOFA11x0 optical ports
minimum
maximum
unit
s
first stage input power
-40
+5
dBm
first stage output power
+1
+17
dBm
second stage input power
-20
+18
dBm
second stage output power
+6
+23
dBm
OSC output (extraction) level
-50
-6
dBm
OSC input (insertion) level
+2
+4
dBm
first stage input power monitoring
-51
-14
dBm
first stage output power monitoring
-23
-4
dBm
second stage input power monitoring
-23
+4
dBm
second stage output power monitoring
-17
dBm
Tuning step
0.5
Absolute tuning accuracy
-0.45
+0.45
dB
Relative tuning accuracy
-0.3
+0.3
dB
+20
dBm
Maximum EOL output power without EMPM
dB
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-49
............................................................................................................................................................................................................................................................
LOFA11x1 optical characteristics
LOFA1111, LOFA1121 optical interfaces specification

Fiber type
Single-mode (SMF)
Connector type
MU/SPC
Wavelength range
1529.1 -> 1561.8 nm
Wavelength range - OSC port
1500 -> 1520 nm
LOFA11x1 optical ports

Floating VOA input
-38 -> +17 dBm
Floating VOA output
-39 -> +17 dBm
1st stage input power
-38 -> +5 dBm
1st stage output power
-2 -> +12 dBm
2nd stage input power
-20 -> +18 dBm
2nd stage output power
+2 -> +17 dBm
OSC output (extraction) level
-50 -> -6 dBm
OSC input (insertion) level
+2 -> +4 dBm
1st stage input power monitoring
-51 -> -14 dBm
1st stage output power monitoring
-23 -> -4 dBm
2nd stage input power monitoring
-23 -> +4 dBm
2nd stage output power monitoring
-17 -> 0 dBm
Unidirectional
Bidirectional
(stage 1 only)
Bidirection
al (stage 2
only)
17 dBm
12 dBm
17 dBm
-4.5 dBm
-4.5 dBm
+3.0 dBm
-10.5 dBm
-10.5 dBm
+3.0 dBm
+12 dBm
NA
NA
LOFA11
11
2.2 dBm (w/ a 9

dB midstage)
4.5 dBm
2.0 dBm
LOFA11
21
2.2 dBm (w/ a 9

dB midstage)
5.0 dBm
2.0 dBm
Output power (LOFA11x1)

Input power
LOFA11
11
LOFA11
21
1st stage Output power (LOFA11x1)

Delta G
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 50
............................................................................................................................................................................................................................................................
Noise figure
LOFA11
11
LOFA11
21
7.3 @[Pin 6;Pin]
5.5 @[Pin 6;Pin]
8.0
@[Pin;Pin+3]
6.0
@[Pin;Pin+6]
6.5 @[Pin 6;Pin]
5.5 @[Pin 6;Pin]
7.0
@[Pin;Pin+3]
6.0
@[Pin;Pin+6]
8.5 @Pin
8.5 @Pin
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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............................................................................................................................................................................................................................................................
OCPU2104 optical characteristics
Optical characteristics of the Client/B&W interfaces of the OCPU2104 unit

Parameter / Function
Comment
Application type
Operating wavelength range 1
1290 -> 1330 nm (2nd window), ITU-T G.691 S-64.2b
Operating wavelength range 2
1530 -> 1565 nm (3rd window), ITU-T G.693 VSR2000

2R1
Fiber type
Single-mode (SMF)
Connector type
MU/SPC
Insertion Loss 50%
2.7 -> 3.9 dB
Including connectors
Insertion Loss 50%
2.7 -> 3.9 dB
Including connectors
Input Return Loss
30 dB
Client #1 input to splitter #1
client receive levels
Splitter #1 output to Main trib #1
min. = input level - 3.9 dB
Splitter #1 output to Spare trib #1
Client #2 input to splitter #2
client receive levels
Splitter #2 output to Main trib #2
Splitter #2 output to Spare trib #2
Coupler #1 input from Main trib #1
client transmit levels
Coupler #1 input from Spare trib #1
Coupler #1 output to Client #1
Coupler #2 input from Main trib #2
Coupler #2 input from Spare trib #2
Coupler #2 output to Client #2
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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............................................................................................................................................................................................................................................................
Optical Supervisory Channel Unit (OSCU101x) optical characteristics
OSCU101x optical characteristics

Number of OSC (SPV) ports
OSCU1010 = 2, for Line Terminal and OADM

applications
OSCU1011 = 1, for Line Terminal applications
Nominal bit rate
4 864 kbps (default configuration) =>

2Mbps for LAPD (OSC) + 2 Mbps for user channels
(UDC)
Fiber type
Single-mode (SMF)
Connector type
MU/SPC
Wavelength
1510 5 nm
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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Alarm characteristics
............................................................................................................................................................................................................................................................
Units Alarms:
Each port card or access card of the equipment is provided with a bicolor (green/red) or
three-color (green/yellow/red) LED on the front coverplate.
This LED indicates:
when red, internal failure
when green, in service unit
when yellow, board in firmware download state.
Centralized Equipment Alarms:

All the alarms detected on the units are collected by the ESCT2000 unit which will
deliver centralized optical indications (by means of LEDs on its front coverplate).
Specifically:
Red LED URG: detection of an URGENT (MAJOR OR CRITICAL) alarm
Red LED "NUR": detection of a NOT URGENT (MINOR) alarm
Yellow LED "ATD": alarm condition ATTENDED
Refer to Units front view (p. 2-49), where the front view of each unit and the LED
locations are illustrated.
Note:
On the Craft Terminal (C.T.) and on the Operation System (O.S.) application
the URGENT (URG), NOT URGENT (NURG) and WARNING alarms are named in a
different way; the relation between this two terminology is explained in Table 4-3,
Relation between Alarm severity terminology displayed onC.T./O.S. and alarm
severity terminology used for the ESCT leds and ETSI market racks (TRU). (p. 4-55).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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............................................................................................................................................................................................................................................................
Table 4-3
Relation between Alarm severity terminology displayed onC.T./O.S. and

alarm severity terminology used for the ESCT leds and ETSI market
racks (TRU).
Alarm severity terminology on C.T. and

O.S.
Alarm severity terminology used for ESCT

leds and for TRU in the rack
CRITICAL or MAJOR
URG
MINOR
NURG
ATTENDED
ATTD
Rack Alarms:
Some equipment alarms are carried to a connector and used to light-up alarm rack-lamps.
Rack alarms are physically available on the RAIU board connectors.
TRU Front Panel LEDs (ETSI)

Marking
Description
Led color
URG
Urgent alarm input from one of the shelves in the rack

ON if the RAIU raises the Critical or the Major alarm
RED
NURG
Non urgent alarm input from one of the shelves in the rack
ON if the RAIU raises the Minor alarm.
RED
ATTD
Attended: acknowledged URG/NURG alarms after an alarm cut off

by the operator (ACO push button on the ESCT front panel).
YELLOW
SIG PRES
Signal presence (power ON)
GREEN
The TRU has four front panel leds: Urgent, Non Urgent, Attended, Signal Presence. Those
leds are managed by the RAIU boards of a rack, except for the last one which indicates
that the power is ON. The TRU has four DB25 connectors so that the RAIU boards of a
rack can be either linked together or directly connected to the TRU.
In NEs composed of more than one rack, the TRU of the master rack shows both the HW
alarms of the rack and the summary of the NE alarms. The TRU LEDs in secondary racks
only show the HW failures of the rack (from the FANS or the power supplies).
HouseKeeping Alarms/Commands:
A set of housekeeping contacts are available, located on the 25-pole connector of the
housekeeping board.
Alarm Attending:
The detected units alarm condition can be stored through the ACO (Alarms Cut Off) pushbutton on the ESCT unit (Attended).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-55
............................................................................................................................................................................................................................................................
This operation will turn OFF the general red LED URG" and will light up the ATD"
yellow LED on the ESCT unit (Attended); the attended command is also sent to the rack
lamps (if present) through the RAIU board.
Trouble-shooting:
This equipment has been designed to dialog with a Personal Computer (PC) for service,
activation and trouble-shooting purpose.
Trouble-shooting procedure for the equipment and details of the alarms for each card and
relevant indications are described in the Operator's Handbook.
Connection with the PC is achieved through the 9-pole connector (F interface) on the
ESCT board.
The unit can be connected to an Operation System associated to the Transmission
Management Network in order to execute operations similar to those carried out by the
PC.
Characteristics of the cited rack alarms and Housekeeping contacts interface (EM type)
are included in 1626 LM system characteristics (p. 4-1).
............................................................................................................................................................................................................................................................
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Power supply characteristics
............................................................................................................................................................................................................................................................

Input Voltage range (from station batteries)
- 40,5 V < - 48 V < - 57,0 V

- 57,0 V < - 60 V < - 72,0 V
Power supply output voltages towards units
48/60 V filtered
+ 3.7 V (by DC/DC conv)
+ 5.4 V (by DC/DC conv)
The PSUP takes a 48V/60V battery supply and filters it before making it available on the backplane.
It then uses the redundant (filtered) 48V supplies to power the on board 3.7V and 5.4V supplies. The
unit also uses the 3.7V supply (either from the on board converter, or if failed from the backplane) to
power its SPIder. The maximum current drawn from these power rails shall not exceed the following
requirement
Power supply interface
according to ETS EN 300132-2
Power consumption
This product is designed for low power consumption. Developing new components with
very high integration density and low voltage supply leads to a significant reduction of
power consumption.
Depending on the number and type of I/F ports, the power consumption may vary in a
wide range.
Estimated max 1626 LM shelf power

consumption
900W - a fully equipped expansion shelf with 16

transponders
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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............................................................................................................................................................................................................................................................
Maximum power consumption of the boards and units
Unit
Maximum power consumption [W]
TRBD4312
76
TRBD1111, TRBD1131, ETHC1000
35
TRBD1121
38
TRBD1191
48
TRBC1111
39
2xGE_FC
14
BMDX1x00
CMDX1010
22
ALCT1010
10
OMDX8100
OMDX4100
WMAN3174
24
TDMX1180
20
OADC/OCNC
LOFA11x0
20
LOFA1111
20
LOFA1121
13
BOFA1000 & 2000
12 and 15
OCPU2104
ESCT2000
20
OSCU1010
15
OSCU1011
11
RAIU1100, HSKU1x00, USIB1000
PSUP1000
10
FANS1000
55
(when the three FAN modules are at high
rotation speed)
FANS2000
24
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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Mechanical characteristics
............................................................................................................................................................................................................................................................
Rack mechanical compatibility
ETSI ETS/E3, Optinex compatible
1626 LM subrack size
466 mm H x 532 mm W x 288 mm D (w/ front panel)
Board size
there are four types of board:

338 mm Height x 213 mm Depth x 25 mm Width
Rack size
1626MS Subrack weight
14 Kg for an empty shelf and

47 Kg for a fully populated expansion shelf with 16 TRBDs,
2 CMDXs, 2 PSUPs, 1 ESCT and 1 RAIU
Cooling
Fans located at the bottom of the shelf
Rack cabling
Vertical between rack and subrack front access
Electrical Connectors
SUB-D 3-pole connector: power supply

SUB-D 25-pole connector: housekeeping interface
SUB-D 9-pole connector: F and RAIU interfaces
mini USB connector: F interface
RJ45 (2x): Q interface for NMS connection
RJ45 (2x): 10Base-T interface for intra-shelf connection
RJ45: RS-232 debugger interface
RJ45: 2Mbps user interface on TRBD/TRBC
RJ45: 2x64Kbps user interface on USIB1000
RJ11: analog audio interface on USIB1000
RJ11: RAIU interface
Back-to-back installation
Yes
Boards dimension
TRBD11X1, TRBC1111,
ETHC1000, BMDX1x00
338mm Height x 213mm Depth x 25mm Width
WMAN and TDMX
338mm Height x 213 mm Depth x 100 mm Width
TRBD4312
338mm Height x 213 mm Depth x 75 mm Width
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-59
............................................................................................................................................................................................................................................................
2xGE_FC, ALCT1010,
CMDX1010, LOFA11xx,
ESCT2000, OSCU101x,
OMDXxxxx, OCPU2104
RAIU1100, HSKU1100,
PSUP1000, USIB1000
HSKU1000
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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............................................................................................................................................................................................................................................................
Boards weight
TRBD11x1
1.85 Kg max.
TRBC1111
1.6 Kg
TRBD4312
3.9 Kg
2xGE_FC
0.85 Kg
ETHC1000
1.05 Kg
WMAN3174
5.280 Kg
TDMX1180
4.840 Kg
CMDX1010
0.9 Kg
BMDX1x00
1.2 Kg
ALCT1010
0.9 Kg
OMDX8100
1.01 Kg
OMDX4100
1.01 Kg
LOFA11x0
1.2 Kg
OCPU2104
0.28 Kg
ESCT2000
1.03 Kg
OSCU101x
0.97 Kg
OADC0104
0.260 Kg
OADC1100
0.260 Kg
OADC1300
0.910Kg
OADC1750
0.920 Kg
OCNC1230
0.260 Kg
RAIU1000
0.14 Kg
HSKU1x00
0.15 Kg
USIB1000
0,17 Kg
PSUP1000
0.3 Kg
FANS1000
3.360 Kg
FANS2000
0.580 Kg
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-61
Environmental characteristics
............................................................................................................................................................................................................................................................
Main environmental aspects of Alcatel-Lucent products are:
energy consumption during manufacturing and use,
materials harmfulness and recycleability,
emissions to air, water or soil related to the manufacturing and the use of the product,
electromagnetic (EM) emissions,
value recovery at the product end of life.
The 1626 LM is designed to be compliant to ETSI standards.

The technical data of this chapter are referred to ITU-T Recommendations and ETSI
Standards.
Electromagnetic Compatibility (EMC)
The CE markings printed on the product denote compliancy with the following Directives:
89/336/EEC of May 3rd, 1989 (EMC Directives), amended
by the 92/31/EEC Directive issued on April 28th, 1992
by the 93/68/EEC Directive issued on July 22nd, 1993
Compliancy to the above Directives is declared, when the equipment is installed as for the
manufacturer handbooks, according to the following European Norms:
EN 300 386 (V1.3.2), environment Telecommunication center"
WARNING
This is a class A product of EN 55022. In domestic, residential and light industry
environments, this product may cause radio interference in which case the user may be
required to take adequate measures.
Electromagnetic Compatibility (EMC) requirements
All units when mounted in the appropriate subrack meet the EMC requirements as
outlined in the ETSI specification EN 300 386 (V1.3.2 - required for CE marking) which
covers equipment used within the telecommunication centre environment.
The units when mounted in subracks, meet the requirements for enclosure, signal lines,
DC power ports and radiated magnetic field emission.
The units, however, are not required to meet these requirements when not mounted in a
subrack.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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............................................................................................................................................................................................................................................................
In addition to the requirements of EN 300 386 specification, the equipment meets the
additional requirements of ES 201 468 ("Additional Electro Magnetic Compatibility
(EMC) requirements for Telecommunications Equipment for Enhanced Availability of
Service in Specific Conditions).
EMI/EMC condition are described in Electromagnetic Compatibility (EMC condition)
(p. A-10).
Waste from Electrical and Electronic Equipment (WEEE)
The marking printed on the subrack (refer to Figure A-1, Subrack label (p. A-15) on and
Table A-2, Label references (p. A-13)) denotes compliancy with the Directive
2002/96/EC On Waste of Electrical and Electronic Equipment.
The general principle is the producer responsibility in the management of the products he
puts on the market when discarded by the owner. The producer responsibility now covers
the end of life of the products sold.
The European directive is effective in a country once transposed. The starting date for the
producer responsibility for the European text is 13th August 2005.
All Alcatel-Lucent products fall under in Category 3 of Annex 1A of the WEEE directive
(Directive 2002/96/ EC) i.e. "IT and Telecommunication equipment" under item "other
products transmitting sound, images or other information by telecommunications."
Alcatel-Lucent products fall under WEEE directive name: "Other product or equipment
of transmitting sound, images or other information by telecommunications" in Annex 1B.
This mark will not cause any responsibility as all responsibilities will be defined by
contract.
Acoustical noise
The acoustical noise level of the product complies with:
ETS 300 753, environment Telecommunication equipment rooms unattended"
The measurements have been performed according to the standard ISO 3745.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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............................................................................................................................................................................................................................................................
Climatic for operating conditions
The Equipment meets the requirements of ETSI Stand. with use of fans housed in an
external subrack.
The functionality of the 1626 LM Equipment, Vs. Temperature, is in compliance with:
ETS 300 019-1-3 :1992 , class 3.2.
Class 3.2 :
Partly temperature-controlled locations.
(see climatogram on Figure 4-6, Climatogram for Class 3.2: Partly temperature
controlled locations (p. 4-65))
Class 3.2: partly Temperature controlled locations
This applies to locations:
where installed equipment may be exposed to solar radiation and heat radiation. They
may also be exposed to movements of the surrounding air due to draughts in buildings,
e.g. through open windows. They may be subjected to condensed water and to water
from sources other than rain and icing. They are not subjected to precipitation;
where mould growth or attacks by animals, except termites, may occur;
with normal levels of contaminants experienced in urban areas with industrial

activities scattered over the whole area and/or with heavy traffic;
In close proximity to sources of sand or dust;
with vibration of low significance, e.g. for products fastened to light supporting
structures subjected to negligible vibrations.
The conditions of this class may be found in:
entrances and staircases of buildings;
garages;
cellars;
certain workshops;
buildings in factories and industrial process plants;
unattended equipment stations;
certain telecommunication buildings;
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 64
............................................................................................................................................................................................................................................................
ordinary storage rooms for frost resistant products and farm buildings, etc.
29
95
Figure 4-6 Climatogram for Class 3.2: Partly temperature controlled locations
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-65
............................................................................................................................................................................................................................................................
The equipment operates within its specified performance limits over the range specified in
the climatogram for this environmental class (Figure 4-6, Climatogram for Class 3.2:
Partly temperature controlled locations (p. 4-65)).
The equipment thus also operates within its specified performance limits over the
temperature and humidity range. Thus an increase in the specified upper temperature limit
to +50 C from +45 C as specified in EN 300 019-1-3 for Class 3.2.
The applicable extreme external operating conditions are summarized in Table 4-4,
Environmental Operating Conditions[1] (p. 4-66). A description of the applicable
operating conditions for both the ETSI requirements are described below.
Table 4-4 Environmental Operating Conditions[1]
Parameter
Operational Limits
Low Air Temperature
-5 C [2]
High Air Temperature
+50 C [2]
Low Relative Humidity
5% RH
High Relative Humidity
95% RH
Rate of Change of Temperature
0.5 C/min.
Air Temperature Rise Over Unit Operational

max [3]
TBD
[1]
Temperatures specified are ambient temperatures external to the equipment, air

temperature rises across the subracks within the rack may result in component surface
temperatures being 20 C above the external air temperature.
[2]
Temperature range extended to +50C to cover the requirements of EN 300 019-1-3
Class 3.2.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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............................................................................................................................................................................................................................................................
Storage
The units are un-powered and packed in a ready to ship condition prior to being
subjected to the following storage conditions. The packaging procedures and materials
used have to be representative of those used for the final delivered product. The delivered
product is: equipped racks, equipped subracks and individual units, unit design is
compatible with all of these.
The 1626 LM equipment meets the following requirements Vs. Storage:
ETS 300 019-1-1: 1992, class 1.2
Class 1.2: weather protected, not temper. controlled storage location.
This class applies to weather protected storage having neither temperature nor humidity
control. The location may have openings directly to the open air, i.e., it may be only partly
weatherproofed. The climatogram is shown on Figure 4-7, Climatogram for Class 1.2:
not temperature controlled storage location (p. 4-68).
This class applies to storage locations:
where equipment may be exposed to solar radiation and temporarily to heat radiation:
They may also be exposed to movements of the surrounding air due to draughts, e.g.
through doors, windows or other openings. They may be subjected to condensed
water, dripping water and to icing. They may also be subjected to limited wind-driven
precipitation including snow;
where mould growth or attacks by animals, except termites, may occur;
with normal levels of contaminants experienced in urban areas with industrial

activities scattered over the whole area, ad/or with heavy traffic;
in areas with sources of sand or dust, including urban areas;
with vibration of low significance and insignificant shock.
The conditions of this class may occur in:
unattended buildings;
some entrances of buildings;
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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............................................................................................................................................................................................................................................................
some garages and shacks.
29
Figure 4-7
Climatogram for Class 1.2: not temperature controlled storage location
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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............................................................................................................................................................................................................................................................
Transportation
The units are un-powered and packed in a ready to ship condition prior to being
subjected to the following transportation conditions. The packaging procedures and
materials used have to be representative of those used for the final delivered product. The
delivered product is: equipped racks, equipped subracks and individual units, unit design
is compatible with all of these.
The 1626 LM equipment meets the following requirements Vs. transportation:
ETS 300 019-1-2: 1992, class 2.2
Class 2.2: Careful transportation (see Table 4-5, Transportation climatic
(p. 4-70)).
This class applies to transportation where special cars has been taken e.g. with respect to
low temperature and handling.
Class 2.2 covers the condition of class 2.1. In addition class 2.2 includes transportation in
all types of lorries and trailers in areas with well-developed road system.
It also includes transportation by ship and by train specially designed, shock-reducing
buffers. Manual loading and unloading of to 20 Kg is included.
Extension of extreme low temperature during transportation is permitted for the 1626 LM
equipment in its standard packing:
AT -40 C for 72 Hours maximum
without damaging the Optical interfaces.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
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............................................................................................................................................................................................................................................................
Table 4-5 Transportation climatic
Environmental parameter
Unit
2.1 and 2.2
2.3
(A)
low temperature air
- 25
- 40
(B)
high temperature, air in unventilated

enclosures (NOTE 1)
+ 70
+ 70
(C)
high temperature, air in ventilated enclosures

or outdoor air (NOTE 2)
+ 40
+ 40
(D)
change of temperature air/air
-25 / +30
-40 / +30
(E)
change of temperature air/water
+40 / +5
+40 / +5
(F)
relative humidity, not combined with rapid

temperature changes
95
95
+40
+45
relative humidity, combined with rapid

temperature changes air/air, at high relative
humidity (NOTE 3, 6)
95
95
-25 / +30
-40 / +30
absolute humidity, combined with rapid

temperature changes: air/air at high water
content (NOTE 4)
g/m3
60
60
+70 / +15
+70 / +15
(I)
low air pressure
KPa
70
70
(J)
change of air pressure
KPa/min
no
no
(K)
movement of the surrounding medium, air
m/s
20
20
(L)
precipitation rain
mm/min
6 (NOTE 7)
(M)
radiation, solar
W/m2
1120
1120
(N)
radiation, heat
W/m2
600
600
(O)
water from sources other than rain

5)
m/s
1 (NOTE 7)
(P)
wetness
none
conditions of wet surfaces
(G)
(H)
(NOTE 3)
(NOTE 3)
(NOTE
Notes to Table 4-5:

1. The high temperature of the surfaces of a product may be influenced by both the surrounding
air temperature, given here, and the solar radiation through a window or another opening.
2. The high temperature of the surface of a product is influenced by the surrounding air
temperature, given here, and the solar radiation defined below.
3. A direct transfer of the product between the two given temperature is presumed.
4. The product is assumed to be subjected to a rapid decrease of temperature only (no rapid
increase). The figures of water content apply to temperatures down to the dew-point; at lower
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 70
............................................................................................................................................................................................................................................................
temperatures the relative humidity is assumed to be approximately 100%.

5. The figure indicates the velocity of water and not the height of water accumulated.
6. Occurrence of condensation.
7. For short duration only.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4-71
............................................................................................................................................................................................................................................................
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
4 - 72
WEEE general information

According to the European directive (2002/96/EC) Waste Electric and Electronic
Equipment, from August 13th 2005 the "producer" of the equipment being sold, unless
otherwise specified in the contract with the Customer, is responsible for collecting and
treating Electrical and Electronic Equipment.
Equipment put on the market after August 13th 2005 have a label (refer to Table A-2,
Label references (p. A-13)) affixed on the product. The presence of the black label
indicates the product has been put on the market after August 13th 2005.
The use of the crossed-out wheeled bin symbol indicates that this product is
subject to separate collection and is not to be treated as general household
waste.
The separate collection of this equipment at the end of its lifetime is organized and
managed by the producer. Please contact the producer or his authorized representative for
information concerning the disposal of your equipment.
The separate collection and recycling of waste equipment at the time of disposal
contribute to avoid possible negative effects on the environment and on human health.
In next paragraphs is given a description example of how to disassemble an equipment; the

same principle can be applied to all the subracks and units composing the equipment.
The unit chosen for disassembly is one of the most complex.
The section on How to disassembly equipment (p. 5-2) describes the equipment
disassembly; in detail:
Tools necessary for disassembly (p. 5-2) lists the tools necessary for disassembly
Subrack disassembly (p. 5-2) describes the subrack disassembly
Unit disassembly (p. 5-11) describes the unit disassembly
Hazardous materials and components (p. 5-24) describes the procedure to apply
in order to manage Hazardous materials and components (example battery)
ECO declaration (p. 5-27) reports the ECO declaration info.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5 -1
How to disassembly equipment
............................................................................................................................................................................................................................................................

This equipment is designed for easy disassembly, by using screws and rivets for
mechanical assembly of subracks and modules. The variety of screw types is minimized.
Tools necessary for subrack and units disassembly are reported in Tools necessary for
disassembly (p. 5-2).
The disassembly process depends on the respective recycling methods and can be derived
from the delivered assembly instructions of the product.
These guidelines are not mandatory.
They are given in order to optimize the disassembling process and material recovery as
whole.
Tools necessary for disassembly
The following tools are necessary for unit disassembly:
# T9 TORX screw driver
# T20 TORX screw driver
Cross-head screwdriver
Wrench #
Scissors
Protection gloves
Subrack disassembly
Figure 5-1, Subrack front and rear view (p. 5-3) shows an example of subrack.
The same rules can be applied to the specific equipment to be dismantled.
In order to disassemble the subrack first remove the boards eventually present, included
termination bus.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-2
............................................................................................................................................................................................................................................................
SUBRACK FRONT VIEW
SUBRACK REAR VIEW
Figure 5-1 Subrack front and rear view
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-3
............................................................................................................................................................................................................................................................
Procedure:
Remove the two screws (A) in order to disassemble the handle as reported in
Figure 5-2, Handle removing and disassembly (p. 5-4).
Repeat the same procedure on the other handle.
Separate the two plastic blocks of the handle as reported in Figure 5-2, Handle
removing and disassembly (p. 5-4).
plastic block
plastic block
Figure 5-2
Handle removing and disassembly
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-4
............................................................................................................................................................................................................................................................
Unscrew all the screws present on rear cover as shown in Figure 5-3, Rear cover
removing (p. 5-5) (dashed lines).
Remove the rear cover in order to access the subrack Back Panel.
Figure 5-3 Rear cover removing

............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-5
............................................................................................................................................................................................................................................................
Unscrew all the screws fastening the Back Panel to the mechanical structure of the
subrack as indicated in Figure 5-4, Back Panel removing (p. 5-6) (dashed line).
Remove the Back Panel from the subrack mechanical structure.
Figure 5-4
Back Panel removing
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-6
............................................................................................................................................................................................................................................................
Remove the upper and lower guides from the subrack access area by unscrewing the
relevant screws as indicated in Figure 5-5, Upper and lower guides plane removing
(p. 5-7).
BASIC AREA
ACCESS AREA
Upper and Lower guides
Figure 5-5 Upper and lower guides plane removing
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-7
............................................................................................................................................................................................................................................................
Remove the side wall by unscrewing the relevant screw as indicated in Figure 5-6,
Side wall removing (p. 5-8).
Remove the two contact springs from the side wall as indicated in Figure 5-7, Optical
fiber duct, guides and contact spring removing (p. 5-10) (refer to Hazardous
materials and components (p. 5-24) for info about hazardous parts dismantling).
Figure 5-6
Side wall removing
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-8
............................................................................................................................................................................................................................................................
Remove the two guides of the basic area" and the two optical fiber ducts by pulling
them out as indicated in Figure 5-7, Optical fiber duct, guides and contact spring
removing (p. 5-10).
Unscrew all the screws present on the other side wall" in order to complete the
subrack disassembly.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-9
............................................................................................................................................................................................................................................................
Optical fiber duct

Optical fiber duct
guides
guides
contact spring
contact spring
Figure 5-7
Optical fiber duct, guides and contact spring removing
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5 - 10
............................................................................................................................................................................................................................................................
Unit disassembly
Procedure:
Remove the two screws (A) from the side coverplate as indicated in Figure 5-8, Side
coverplate removal (p. 5-11).
Figure 5-8 Side coverplate removal
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-11
............................................................................................................................................................................................................................................................
Remove the screws (B) that fix the two levers and subsequently pull out them from the
front plate as indicated in Figure 5-9, Levers removal (p. 5-12).
Figure 5-9
Levers removal
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5 - 12
............................................................................................................................................................................................................................................................
Unscrew and extract the two optical connectors (C) as indicated Figure 5-10, Optical
connectors support removal (p. 5-13).
Remove the screw (D) fixing the connectors support as indicated in Figure 5-10,
Optical connectors support removal (p. 5-13).
Rotate the connectors support (E) and pull it sideways to remove as indicated
Figure 5-10, Optical connectors support removal (p. 5-13).
D
C
E
Figure 5-10
Optical connectors support removal
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-13
............................................................................................................................................................................................................................................................
Remove the two screws (F) from the side coverplate as indicated in Figure 5-11, Side
coverplate and contact spring removal (p. 5-15).
Extract from the top the contact spring (G) as indicated in Figure 5-11, Side
coverplate and contact spring removal (p. 5-15) (refer to Hazardous materials and
components (p. 5-24) for info about hazardous parts dismantling).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5 - 14
............................................................................................................................................................................................................................................................
Extract the fibers from the cavity (H) as indicated in Figure 5-11, Side coverplate and
contact spring removal (p. 5-15).
Figure 5-11
Side coverplate and contact spring removal
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-15
............................................................................................................................................................................................................................................................
Disconnect the two flat cables (M) as indicated in Figure 5-12, Internal connectors
removal (p. 5-17).
Unscrew (L) connectors with the aid of a wrench as indicated Figure 5-12, Internal
connectors removal (p. 5-17).
Remove the fibers (N) from supports pulling them out Figure 5-12, Internal
connectors removal (p. 5-17).
Remove the two screws (O) on the other side of the board that fixes the dissipator to
the Printed Circuit Board (PCB) as indicated in Figure 5-13, Dissipator removal
(p. 5-18).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5 - 16
............................................................................................................................................................................................................................................................
The dissipator can now be removed (refer to Figure 5-14, Modules removal from
dissipator (p. 5-19)).
N
N
Figure 5-12
Internal connectors removal
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-17
............................................................................................................................................................................................................................................................
Figure 5-13 Dissipator removal
Remove the screws (P) from dissipator as indicated in Figure 5-14, Modules removal
from dissipator (p. 5-19).
Now the two modules on the other side of the dissipator are free to be removed (refer
to Figure 5-16, Gold connector removal (p. 5-21));
Pay attention during modules removal because of white conductive paste (refer
to Hazardous materials and components (p. 5-24) for info about hazardous
parts dismantling).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5 - 18
............................................................................................................................................................................................................................................................
Remove the plastic part (X) in Figure 5-15, Daughter board removal (p. 5-20) by
unscrewing the screw present on the rear side of the dissipator.
P
P
P
P
P
P
P
Figure 5-14
Modules removal from dissipator
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-19
............................................................................................................................................................................................................................................................
Remove the screws (Q) and (R) that fix the daughter board and pull it out from the
mother board (refer to Figure 5-15, Daughter board removal (p. 5-20)).
MOTHER BOARD
DAUGHTER BOARD
Q
Q
Figure 5-15 Daughter board removal
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5 - 20
............................................................................................................................................................................................................................................................
Cut away gold connector (S) from daughter board (refer to Figure 5-16, Gold
connector removal (p. 5-21))
Figure 5-16
Gold connector removal
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-21
............................................................................................................................................................................................................................................................
Remove all internal cables as indicated in Figure 5-17, Internal cables removal
(p. 5-22). To remove cables it is enough to pull them out from their support.
Figure 5-17 Internal cables removal
Remove screws (T) that fix the metal support to the mother board as indicated in
Figure 5-18, Connector metal support removal (p. 5-23).
Remove the metal support.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5 - 22
............................................................................................................................................................................................................................................................
Cut away the gold connector (U) from mother board.
Metal support
Figure 5-18
Connector metal support removal
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-23
............................................................................................................................................................................................................................................................
Hazardous materials and components
Table 5-1, List of hazardous materials and components present in the equipment
(p. 5-24) lists the presence or not of hazardous substance/components.
Note: The system cabling is designed for reduced halogen content. All the traffic cabling
is fully PVC free.
Table 5-1 List of hazardous materials and components present in the equipment
Materials/substances
Presence
Where
Materials or substances of interest for Dismantling & Recycling

(end of life information for treatment facilities)
Batteries
NO
---
Parts containing Mercury

(if above specified level)
NO
---
Parts containing Cadmium

(if above specified level)
NO
---
Capacitors with PCB's
NO
---
Capacitors with substances of concern +

height > 25 mm, diameter > 25 mm or
proportionately similar volume
NO
---
Gas discharge lamps
NO
---
Mercury containing Backlighting lamps
NO
---
Plastic containing brominated flame

retardants other than in Printed Circuit
Assemblies
NO
---
Liquid Crystal Displays with a surface

greater than 100 cm2
NO
---
Asbestos
NO
---
Refractory ceramic fibres
NO
---
Batteries
NO
---
(Mercury/NiCad/Lithium/Other)
(Mercury/NiCad/Lithium/Other)
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5 - 24
............................................................................................................................................................................................................................................................
Presence
Where

Thermal conductive paste
YES
In all units where dissipators are present

a withe thermal conductive paste is used
in between mechanical parts.
An example is depicted in Figure 5-15,
Daughter board removal (p. 5-20).
Note: protective plastic gloves must be
used in order to avoid contact between
hands and thermal conductive paste.
Pay attention to avoid contact of thermal
conductive paste with eyes.
Radio-active substances
NO
Beryllium Oxide
NO
Other forms of Beryllium
YES
Refer to Figure 5-7, Optical fiber duct,

guides and contact spring removing
(p. 5-10) and Figure 5-11, Side
coverplate and contact spring removal
(p. 5-15) point G.
Note: Copper-beryllium contact spring
must be separated from other material
and must be fused in a specific regulated
environment.
Parts containing elements under pressure
NO
---
Parts containing Liquids
NO
---
Parts containing Gas
NO
---
Mechanical springs (springs used for

fixation of mechanical parts under force)
NO
---
Gasses which fall under specific

regulation (CFCs, HCFCs, ....)
NO
---
Polychlorinated biphenyls (PCB),

polychlorinated terphenyls (PCT) or
PCN
NO
---
Ago colorants
NO
---
Short chain Chloroparaffins
NO
---
Lead or lead compounds
NO
---
Hexavalent chromium compounds
NO
---
Other materials or substances
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-25
............................................................................................................................................................................................................................................................
Presence
Where

TBT and TBTO
NO
---
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5 - 26
ECO declaration
............................................................................................................................................................................................................................................................
ECO declaration
The Alcatel-Lucent 1626 Light Manager is a global 3rd generation DWDM transmission
platform addressing Long Haul (LH) and Ultra Long Haul (ULH) terrestrial applications
and unrepeatered submarine systems.
This product complements and extends Alcatel-Lucent's highly successful range of
Regional and Long Haul DWDM products to achieve lower costs and superior system
performance.
The 1626 Light Manager helps service providers lower the overall transmission cost per
bit in the core of the network by minimizing CAPEX and optimizing OPEX.
Key features
Best-in-class footprint
Lower power consumption
Greater span performance
Seamless upgrade using the Optical Network Extender Shelf to grow the network
Cost optimized transponders
Ease of use with new channel balancing feature
Integrated submarine and terrestrial platform
Fully managed by the Alcatel-Lucent 1350 management suite
Moreover refer to Chapter 5, 1626 LM system characteristics on page 5-1.
Weight and Dimensional Characteristics

Refer to Chapter 5, Mechanical characteristics on page 5-58.
EXTENSION OF SYSTEM LIFETIME

The product is designed to ensure an outstanding quality of service through very high
traffic transmission, connection and protection performances and minimum service
interruption.
The life utility is at least 5 years. This means that maintenance will be assured for at least
5 years.
The system architecture facilitates future extendability and upgradability:
On-site configuration changes as e.g. extension of the node traffic capacity without
recabling of interconnections
Implementation of new features and functionalities by remote Software download
The terms and conditions of warranty, service availability and spare parts availability are
individually agreed between Alcatel-Lucent and the Customer and are part of the relevant
contractual commitments.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-27
ECO declaration
............................................................................................................................................................................................................................................................
POWER CONSUMPTION
Refer to Chapter 5, Power supply characteristics on page 5-56.
RADIO FREQUENCY EMISSION

Regarding compliance with radio frequency emission requirements refer to Chapter 5,
Electromagnetic Compatibility (EMC) on page 5-60.
ACOUSTICAL NOISE
Refer to Chapter 5, Acoustical noise on page 5-61.
MATERIALS
Refer to List of hazardous materials and components present in the equipment (p. 5-24)
for details.
DISASSEMBLY
Refer to paragraph How to disassembly equipment (p. 5-2).
BATTERIES
The product requires no backup batteries.
PACKAGING
The packaging of this Alcatel-Lucent equipment complies with the directive 94/62/EEC
concerning packaging and packaging waste. Depending on the means of transportation the
racks are packed in a cardboard or wooden box, which can easily be recycled after use.
Environmentally harmful materials are not used for packaging. The packaging materials
are marked according to ISO 11 469. If required by the Customer and agreed by both
parties, Alcatel-Lucent can take care of the proper disposal of all packaging materials.
For details refer to the Installation Handbook".
TAKE BACK INFORMATION

On request of customers, Alcatel-Lucent can take care of the take back of depreciated
equipment and of the ecological safe and appropriate disposal under conditions to be
agreed.
For that purpose, Alcatel-Lucent co-operates with qualified companies.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5 - 28
ECO declaration
............................................................................................................................................................................................................................................................
DOCUMENTATION
In order to reduce paper consumption for Customer Documentation, Alcatel-Lucent
delivers the Generic Customer Documentation on a CD-ROM. The CD-ROM contains
interactive HW Descriptions, SW Descriptions, Functional Descriptions, Maintenance
Manuals and User Guides. This allows the operator to put the documentation on a server
accessible by all relevant people in the organization without any additional paper copies.
Additionally more specific documentations as e.g. information about products and
solutions, services and support, training events etc. will be provided by means of AlcatelLucent website accessible by all customers. This will allow distribution of up-to-date
information very quickly and without wasting natural resources.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5-29
ECO declaration
............................................................................................................................................................................................................................................................
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
5 - 30
Safety Norms &

Equipment Labels
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A -1
For Approval March, 11th, 2008
First aid for electric shock
............................................................................................................................................................................................................................................................

Do not touch the patient with bare hands until the circuit has been opened.
Open the circuit by switching off the line switches. If that is not possible, protect yourself
with dry material and free the patient from the conductor.
ARTIFICIAL RESPIRATION
It is important to start mouth to mouth resuscitation at once and seek medical help
immediately.
TREATMENT OF BURNS
This treatment should be used after the patient has regained consciousness. It can also be
employed while the artificial respiration is being applied (in this case there should be at
least two persons present).
CAUTION:
Do not attempt to remove his clothing from the burnt parts;
Apply dry gauze on the burns;
Do not apply ointments or other oily substances.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-2
............................................................................................................................................................................................................................................................
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-3
Safety Rules
............................................................................................................................................................................................................................................................
Safety Rules
General Safety Rule 1
When the equipment is in service, nobody is authorized to access to the components

protected with cover plate shields.
In case of absolute necessity, only Service Personnel or Technical Assistance is authorized

to access the components of an equipment in service.
It is meant by Service Personnel or Technical Assistance, any personnel which has
adequate technical knowledge and necessary experience:
to be aware of the danger that he might find in carrying out an operation,
to take the necessary actions to reduce danger to minimum for him and for others.
The Service Personnel can only replace the faulty units with spare parts.
The Service Personnel is not allowed to repair, therefore the access to unspecified parts is
not permitted.
The required keys and/or tools to access dangerous high voltage areas must be restricted to
Service personnel only.
Do not use any inflammable substance or substances which could alter markings and
inscriptions when cleaning the external parts of the equipment.
It is recommended to use a slightly damp cloth.
Before to work on optical connections, carefully observe the faceplate warning labels.
If necessary, switch off the power station units.
Do not touch the pins of an unplugged cable for the R/M interface connector. A TNV2 (battery) voltage can be present.
Remove rings, watches, and other metal jewelry before to work with primary circuits.
Be extremely careful to avoid shorting power input terminals.
DANGER: Possibility of personal injury. Short circuiting, low

voltage, dc circuits can cause severe arcing that can result in
burns and/or eye damage.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-4
Safety Rules
............................................................................................................................................................................................................................................................
If the safety protection features fail, SWITCH THE POWER OFF.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-5
Safety Rules
............................................................................................................................................................................................................................................................
Labels Indicating Danger, Forbiddance, Command
It is of utmost importance to follow the instructions printed on the labels affixed to the
units and assemblies.
The labels are fully compliant with International Norms ISO 3846-1984. The symbols or
statements are enclosed in geometric shapes: ISO 3864-1984.
CONTAINS A SYMBOL STATEMENT.

INDICATES PROHIBITION: WHITE BACKGROUND WITH
RED RIM, BLACK SYMBOL OR STATEMENT.
CONTAINS A SYMBOL.
INDICATES WARNING OR DANGER: BLUE BACKGROUND,
WHITE SYMBOL OR STATEMENT
CONTAINS INFORMATION OR INSTRUCTION STATEMENT.

YELLOW BACKGROUND, BLACK RIM AND STATEMENT
The labels have been affixed to indicate a dangerous condition. They may contain any
standard-known symbol or any statement necessary to safeguard users and service
personnel against the most common ones, specifically:
dangerous electrical voltages
harmful optical signals
risk of explosion
moving mechanical parts
heat-radiating mechanical parts
Pay attention to the information stated in the following, and proceed as instructed
The symbols presented in Appendix A, Dangerous Electrical Voltages
through Appendix A, Heat-radiating Mechanical Parts: labelling and safety
instructions are all the possible symbols that could be present on AlcatelLucent equipment, but are not all necessarily present on the equipment this handbook
refers to.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-6
Safety Rules
............................................................................................................................................................................................................................................................
Dangerous Electrical Voltages

Electrical Safety: Labelling
The following warning label is affixed next to dangerous voltages (>42.4 Vp; >60 Vdc).
If it is a Class 1 equipment connected to mains, then the label associated to it will state that
the equipment will have to be grounded before connecting it to the power supply voltage,
e.g.:
WARNING!
Ground protect the equipment

before connecting it to mains
Make sure that power has been cut
off before disconnecting ground
protection.
Electrical safety: general rules
DANGER! Possibility of personal injury: carefully observe the specific

procedures for installation / turn-up and commissioning / maintenance of equipment parts
where a.c. or d.c. power is present, described in the relevant installation / turn-up and
commissioning / maintenance documents and the following general rules:
1. Personal injury can be caused by -48 V dc (or by 220 V ac if envisaged in the
equipment). Avoid touching powered terminals with any exposed part of your body.
2. Short-circuiting, lowvoltage, lowimpedance, dc circuits can cause severe arcing that
can result in burns and/or eye damage. Remove rings, watches, and other metal jewelry
before working with primary circuits. Exercise caution to avoid shorting power input
terminals.
Electrical safety: equipment specific data
Refer to Chapter 5, Electrical safety on page 5-8.

............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-7
Safety Rules
............................................................................................................................................................................................................................................................
Harmful Optical Signals

Optical Safety: Labelling
If the assembly or unit is fitted with a LASER, the labels must comply with the IEC
60825-1 and -2 International Norms.
The symbol indicates the presence of a LASER beam. Danger level is stated within a
rectangular label:
If the laser is a Hazard Level 1 product, the label depicting the symbol within a triangle is
not compulsory.
The rectangular shaped label bears all the information needed, i.e.:
LASER class
Power emitted
Wave length
Ref. Norm
Precautionary measures taken depend on LASER class
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-8
Safety Rules
............................................................................................................................................................................................................................................................
Indications given on openings, panels and safety interlockers
Optical safety: general rules
On handling optical equipment or units or cables always check that laser labels are
properly affixed and that the system complies with applicable optical standards.
DANGER! Possibility of eyes damage: invisible infrared radiations emitted

by the fiber optic transmitters can cause eyes damages. Carefully observe the specific
procedures for installation / turn-up and commissioning / maintenance of units containing
laser devices or cables transporting optical signals, described in the relevant installation /
turn-up and commissioning / maintenance documents and the following general rules:
1. Laser radiation is not visible by the naked eye or with laser safety glasses. Although it
cannot be seen, laser radiation may be present.
2. Never look directly into an unterminated fiber optic connector or into a broken optical
fiber cable, unless it is absolutely known that no laser radiation is present.
3. Never look at an optical fiber splice, cable or connector, unless it is absolutely known
that no laser radiation is present.
4. All optical connectors, terminating either fibers and transmitters/receivers, are
provided with protective covers that must always be used, as soon as possible, when
any optical link is disconnected for installation/test/maintenance purposes or whatever
operation.
5. Never look directly into an unterminated fiber optic connector or into a broken optical
fiber cable by means of magnifiers/microscopes, unless it is absolutely known that no
laser radiation is present. A magnifier/microscope greatly increases the damage hazard
to the eyes.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-9
Safety Rules
............................................................................................................................................................................................................................................................
6. Never point an unterminated optical fiber splice, cable or connector to other persons,
unless it is absolutely known that no laser radiation is present.
7. Always remove electrical power from near and far optical transmitters before
disconnecting optical links between the transmitter and the receiver.
8. Wearing of laser safety goggles or eyes shields is recommended for every person
working on optical devices, whenever the above listed rules cannot be followed.
Optical safety: equipment specific data
Refer to paragraph Chapter 5, Optical Safety compliance with European Norms on page
5-9.
Risks of Explosions: labelling and safety instructions
This risk is present when batteries are used, and it is signalled by the following label:
Therefore, slits or apertures are made to let air circulate freely and allow dangerous gasses
to downflow (battery-emitted hydrogen). A 417-IEC-5641 Norm. compliant label is
affixed next to it indicating that the openings must not be covered up.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A - 10
Safety Rules
............................................................................................................................................................................................................................................................
Moving Mechanical Parts: labelling and safety instructions
The following warning label is affixed next to fans or other moving mechanical parts:
Before carrying out any maintenance operation see that all the moving mechanical parts
have been stopped.
Heat-radiating Mechanical Parts: labelling and safety instructions
The presence of heat-radiating mechanical parts is indicated by the following warning

label in compliancy with IEC 417 Norm, Fig.5041:
As stated by IEC 950 Norm, mechanical parts which carry the above pictured label and
that could be touched, have maximum overtemperature as described in the following table.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-11
Safety Rules
............................................................................................................................................................................................................................................................
Table A-1
IEC 950 -Table 16: Overtemperature limits
Operator-accessible parts
Maximum overtemperature (C )
Metal
Glass,
porcelain
Plastic,
rubber
Handle knob, etc., held or touched

for short periods
35
45
60
Handles, knobs, etc., regularly held
30
40
50
Outer surface of the equipment that

can be touched
45
55
70
Inner surface of the equipment that

can be touched
45
55
70
DANGER! Possibility of personal injury: carefully observe the specific

procedures for installation / turn-up and commissioning / maintenance of equipment parts
where heat-radiating mechanical parts are present, described in the relevant installation /
turn-up and commissioning / maintenance documents and the following general rule:
9. Personal injury can be caused by heat. Avoid touching powered terminals with any
exposed part of your body.
Electromagnetic Compatibility (EMC condition)
The equipment's EMC norms depend on the type of installation being carried out (cable
termination, grounding etc.,) and on the operating conditions (equipment, setting options
of the electrical/electronic units, presence of dummy covers, etc.).
Before starting any installation, turn-up & commissioning, operation and maintenance
work refer to the relevant Handbook and chapters.
The norms set down to guarantee EMC compatibility, are distinguished inside this
handbook by the symbol and term:
ATTENTION
EMC NORMS:
For EMC norms refer to Chapter 5, Electromagnetic Compatibility (EMC) on page 560.
General Norms - Installation
All connections (towards the external source of the equipment) made with shielded
cables use only cables and connectors suggested in this Handbook or in the relevant
Plant Documentation, or those specified in the Customer's "Installation Norms." (or
similar documents)
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A - 12
Safety Rules
............................................................................................................................................................................................................................................................
Shielded cables must be suitably terminated
Install filters outside the equipment as required
Ground connect the equipment utilizing a conductor with proper dia. and impedance
Mount shields (if utilized), previously positioned during the installation phase, but not
before having cleaned and degreased it.
Before inserting the shielded unit proceed to clean and degrease all peripheral surfaces
(contact springs and connection points, etc.)
Screw fasten the units to the subrack.
To correctly install EMC compatible equipment follow the instructions given.
General Norms - Turn-up & Commissioning, Operation
Preset the electrical units as required to guarantee EMC compatibility
Check that the equipment is operating with all the shields properly positioned (dummy
covers, ESD connector protections, etc.)
To properly use EMC compatible equipment observe the information given
General Norms - Maintenance
Before inserting the shielded unit, which will replace the faulty or modified unit,
proceed to clean and degrease all peripheral surfaces (contact springs and connection
points, etc.)
Clean the dummy covers of the spare units as well.
Screw fasten the units to the subrack.
Electrostatic Dischargers (ESD)
Before removing the ESD protections from the monitors, connectors etc., observe the
precautionary measures stated. Make sure that the ESD protections have been replaced
and after having terminated the maintenance and monitoring operations.
Most electronic devices are sensitive to electrostatic dischargers, to this concern the
following warning labels have been affixed.
Observe the precautionary measures stated when having to touch the electronic parts
during the installation/maintenance phases.
Workers are supplied with antistatic protection devices consisting of:
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-13
Safety Rules
............................................................................................................................................................................................................................................................
ELASTICIZED BAND
COILED CORD
an elasticized band worn around the wrist
a coiled cord connected to the elasticized band and to the stud on the subrack.
Suggestions, notes and cautions
Suggestions and special notes are marked by the following symbol:

Suggestion or note....
Cautions to avoid possible equipment damage are marked by the following
symbol:
TITLE...
(caution to avoid equipment damage)
statement....
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A - 14
Labels affixed to the equipment
............................................................................................................................................................................................................................................................

This chapter indicates the positions and the information contained on the identification
and serial labels affixed to the equipment.
Figure A-1, Subrack label (p. A-17) through Figure A-7, XFP and SFP modules label
(p. A-25) illustrate the most common positions of the labels on the units, modules and
subracks.
Figure A-8, Label identifying Unit, Optical assembly, Shelf, Back panel (p. A-26)
through Figure A-16, China RoHS label (p. A-29) illustrate the information (e.g.,
identification and serial No.) printed on the labels.
The table below relates the ref. numbers stated on the figures to the labels used.
Labelling depicted hereafter is for indicative purposes and could be changed
without any notice.
Table A-2 Label references
Ref. No.
Name of Label
Label identifying PBA (Printed Board Assembly) - Internal labelling.

Refer to Figure A-3, Internal label for Printed Board Assembly (p. A-21)
Label identifying Unit, Optical assembly, Shelf, back panel.

Refer to Figure A-8, Label identifying Unit, Optical assembly, Shelf, Back
panel (p. A-26)
External label for unit identification - units with two ejectors: part number.
Refer to Figure A-9, External label for unit identification (unit with two
ejectors): P/N (p. A-26)
External label for unit and shelf identification - units with ejector(s): CLEI code.
Refer to Figure A-10, External label for unit/shelf identification - unit with
ejector(s): CLEI code (p. A-26)
Labelling for units with one top ejector.

Refer to Figure A-5, Labels on units with one top extraction handle (p. A-23)
and Figure A-10, External label for unit/shelf identification - unit with
ejector(s): CLEI code (p. A-26)
Labelling for units without ejector.

Refer to Figure A-6, Labels on units without extraction handle (p. A-24)
XFP EXTENDED optical module label. Refer to Figure A-11, Label for Optical
module XFP extended (p. A-27)
XFP optical module label. Refer to Figure A-12, XFP module label (p. A-27)
SFP Optical module label. Refer to Figure A-13, SFP module label (p. A-28)
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-15
............................................................................................................................................................................................................................................................
Ref. No.
Name of Label
Label identifying compliancy with CE, WEEE and China RoHS Directives.
Refer to Figure A-14, Figure A-15 and Figure A-16 on page A-28
On contract basis, customized labels can be affixed to the equipment.

Standard labels can be affixed to any position on the equipment, as required by the
Customer.
Note, however, specific customer agreements ultimately influence label placement.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A - 16
............................................................................................................................................................................................................................................................
NOTE: The above reference numbers are detailed on Table A-2, Label references
(p. A-15).
Figure A-1 Subrack label
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-17
............................................................................................................................................................................................................................................................
xxxxxxxxx
xxxxxx
ABC
xxxxxxxxx
xxxxxx
(p. A-15).
Figure A-2 Labels on units with standard cover plate, with two extraction handles
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A - 18
Part Number and Change Status identification
............................................................................................................................................................................................................................................................

Each unit or sub-unit is distinguished by:
a Part Number: ANV P/N (xxx.xxxxx xxyy) (NOTE)
The last two ANVP/N letters (yy, in the following stated as 'suffix') stand for a
"feasible alternative", they might differentiate two units even though still functionally
compatible.
For example: the units having P/Ns "3AL-34065-AAAA" and "3AL-34065-AABA"
are functionally compatible and, as regards the hardware settings, the hardware
settings paragraph (described hereafter) is applicable for both.
a design & production series (change status): ICS,
The following table shows an example of evolution of "ANV P/N + ICS"
Table A-3 Example of ANV Part Number + ICS evolution
ANV CODE
P/N
ICS
3AL 34422 AA AA
01
3AL 34422 AA AB
01
3AL 34422 AA AC
01
Note:
The P/Ns used in this example have no correspondence with those of the
actual equipment part list!
In this example you can see that the production series is identified by the 'suffix + ICS'
in the ANV code.
Some of the possible positions of the labels indicating the unit's P/Ns and CS-ICS are
illustrated in Appendix A, Labels affixed to the equipment on page A-13.
As the Customer may have to manage many units of the same type (same Part Number)
but with different ICS, each hardware settings paragraph describes with possible different
parts the different setting options, according to all the possible P/N + ICSs. For this
purpose, when more than one setting versions are present, a table at the beginning of
the paragraph indicates the part to be used according to the corresponding 'suffix + ICS',
taking into account that:
a change of the production series does not necessarily imply a change in the setting
options;
a change of the ANV P/N suffix does not imply a handbook change;
the SUFFIX and ICS must be meant as:
from specified SUFFIX or ICS (included)
to next SUFFIX or ICS (excluded) if listed
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-19
............................................................................................................................................................................................................................................................
EXAMPLE
Note:
The P/Ns used in this example have no correspondence with those of the
actual equipment part list!
Taking into account the same unit of Table A-3, Example of ANV Part Number + ICS
evolution (p. A-19):
Supposing that the setting options valid for CS=01 are equal to those for CS=02, but
change for CS=03, the table at the beginning of the document 3AL 34422 AAAA
MSZZQ will be:
Part in the paragraph
ANV P/N
FROM SUFFIX
FROM ICS
--AA
01
--AC
01
If you have the unit identified by one of this identification data:
ANV CODE
P/N
ICS
3AL 34422 AAAA
01
3AL 34422 AAAB
01
you will use the Part 1 of the paragraph for 3AL 34422 AAAA
If you have the unit identified by one of this identification data:
ANV CODE
P/N
ICS
3AL 34422 AAAC
01
3AL 34422 AAAD
01
you will use Part 2 of the paragraph for 3AL 34422 AAAA
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A - 20
............................................................................................................................................................................................................................................................
NB.1 = The label is present on the p.b.a. component side

(p. A-15).
Figure A-3 Internal label for Printed Board Assembly
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-21
............................................................................................................................................................................................................................................................
NB. 1 = The label is present on p.b.a. components side or rear side on the empty spaces.
(p. A-15).
Figure A-4 Back panel internal label
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A - 22
............................................................................................................................................................................................................................................................
The commercial code (10 digits) is silk-screened printing on the front panel label.
The position and size is defined in design phase.
(p. A-15).
Figure A-5 Labels on units with one top extraction handle
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-23
............................................................................................................................................................................................................................................................
The commercial code (10 digits) is silk-screened printing on the front panel label.
The position and size is defined in design phase.
(p. A-15).
Figure A-6 Labels on units without extraction handle
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A - 24
............................................................................................................................................................................................................................................................
(p. A-15).
Figure A-7 XFP and SFP modules label
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-25
............................................................................................................................................................................................................................................................
Figure A-8 Label identifying Unit, Optical assembly, Shelf, Back panel
Figure A-9 External label for unit identification (unit with two ejectors): P/N
Figure A-10
External label for unit/shelf identification - unit with ejector(s): CLEI

code
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A - 26
............................................................................................................................................................................................................................................................
Figure A-11 Label for Optical module XFP extended
Figure A-12 XFP module label
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-27
............................................................................................................................................................................................................................................................
Figure A-13
SFP module label
Figure A-14
CE label
Figure A-15
WEEE label
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A - 28
General Maintenance Rules
............................................................................................................................................................................................................................................................
Figure A-16 China RoHS label
WARNING
CE, WEEE and China RoHS symbols can be in the same label or in different position of
the equipment.

General Maintenance Safety Rule 1
Clean and degrease all peripheral surfaces (contact springs and connection points, etc.)
of shielded unit before insertion for replacement.
Clean the dummy covers of the spare units as well.
Use the elasticized band (around the wrist) and the coiled cord joined connected with the
ground rack when you manipulate the equipment. This will reduce the risk of damage for
the electrostatic sensitive devices.
Screw bolt the units to the subrack.
Check that the equipment shields are positioned properly (dummy covers, ESD
connector protections, etc.).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A-29
............................................................................................................................................................................................................................................................
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
A - 30
Abbreviations
ABBREVIATION
MEANING
A/D
Add and Drop functionality
AFI
Authority and Format Identifier
AIS
Alarm Indication Signal
ALS
Automatic Laser Shutdown
AMS
proprietary Alcatel Maintenance Signal; there are

two types of AMS: AMSs (for legacy submarine
equipment) and AMSt (for legacy terrestrial
equipment)
APA
Automatic Pre-emphasis Adjustment
APD
Avalanche Photo Detector (photodiode

technology)
APS
Automatic Protection switching
APSD
Automatic Power ShutDown
AS
Alarm Surveillance
ASAP
Alarm Severity Assignment Profile
ASIC
Application Specific Integrated Circuit
ATTD
ATTendeD (Alarm storing)
BER
Bit Error Rate
B&W
Black and White
BOL
Beginning of Life
CBR
Constant Bit Rate
CDR
Clock and Data Recovery CD-ROM Compact

Disk Read Only Memory
Ch
Channel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
B -1
Abbreviations
............................................................................................................................................................................................................................................................
CID
Card IDentifier
CLEI
Common Language Equipment Identification
Client-AIS
proprietary Alcatel Maintenance Signal, defined

as a G.709 frame with all-ones in the OPUPayload and 0x8F code in the OPU payload-type
CLNP
Connection Less Network Protocol
CPE
Costumer Premises Equipment
CT
Craft Terminal
DC_DC
DC/DC Converter
DCC
Data Communication Channel
DCN
Data Communication network
DCU
Dispersion Compensating Unit
DDM
Digital Diagnostic Monitoring
DEMUX
Demultiplexing
DTMF
Dual Tone Modulation Frequency
DTV
Decision Threshold voltage
DV
Digital Video
DWDM
Dense Wavelength Division Multiplex
EAM
Electro Absorption Modulator
EC
Equipment Controller
ECC
Embedded Channel Communication
ECID
Enhanced Card IDentifier
ECMA
Standardizing information and communication

system (Formerly "European Computer
Manufacturers Association")
ECT
Equipment Craft Terminal
ECID
Extended Card IDentity
EDFA
Erbium Doped Fiber Amplifier
EEPROM
Electrically Erasable Programmable Read Only

Memory
EMC
Electromagnetic compatibility
EMI
Electromagnetic Interference
EML
Equipment Management Layer
EOL
End Of Life
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
B-2
Abbreviations
............................................................................................................................................................................................................................................................
EOW
Engineering Order Wire
ESC
Equipment and Shelf Controller
ESD
Electrostatic Discharges
ETSI
European Telecommunication Standard Institute
EXP
Expansion
FC
Fiber Channel
FDI
Forward Defect Indication
FEC
Forward Error Correction
FPGA
Field Programmable Gate Array
GbE
Gigabit Ethernet
GCC
Generic Communication Channel
HDLC
High Level Data Link Control
HK
House Keeping
HW
Hardware
HWF
Hardware Failure
IEC
International Electrotechnical Commission
I/F
Interface
ILM
Integrated Laser Modulator
ILOS
Input Loss Of Signal
IND
INDeterminate
I/O
Input/Output
IP
Internet Protocol
IS-IS
Intermediate System-to-Intermediate System
ISO
International Standard Organization
ISPB
Intra Shelf Parallel Bus
ISSB
Intra Shelf Serial Bus
ITU_T
International Telecommunication Union Telecommunication
LAN
Local Area Network
LAPD
Link Access Protocol D
LH
Long Haul
LOF
Loss Of Frame
LOS
Loss Of Signal
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
B-3
Abbreviations
............................................................................................................................................................................................................................................................
LED
Light Emitting Diode
LM
Light Manager
LR
Line Repeater
LSD
Laser ShutDown
LT
Line Terminal
MAC
Medium Access Control
MMF
Multi Mode Fiber
MS
Multiplex Section
MZ
Mach-Zehnder
NE
Network Element
NDC
Negative Dispersion Chromatic
NES
Network Element Synthesis
NML
Network Management Layer
NMS
Network Management System
NNI
Node Network Interface
NSAP
Network Service Access Point
NTP
Network Time Protocol
NURG
Not URGent
OAC
Optical Amplifier Card
OADC
Optical Add & Drop Coupler
OADM
Optical Add and Drop Multiplexer
OBC
On Board Controller
OCH
Optical Channel
OH
OverHead
OCHA
Optical Channel Adaptation
OCNC
Optical Connectivity Coupler
ODU
Optical channel Data Unit
OGPI
Optical Generic Physical Interface
OMS
Optical Multiplex Section
OMSA
Optical Multiplex Section Adaptation
OPC
Optical Protection Card
OS
Operation System
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
B-4
Abbreviations
............................................................................................................................................................................................................................................................
OSC
Optical Supervisory Channel
OSMC
Optical Spectrum Monitoring Control
O-SNCP
Optical Sub-Network Connection Protection
OSNR
Optical Signal Noise Ratio
OSPI
Optical Generic Physical Interface
OTN
Optical Transport Network
OTS
Optical Transmission Section
OTU
Optical channel Transport Unit
PDH
Plesiochronous Digital Hierarchy
PDU
Power Distribution Unit
PGE
Programmable Gain Equalization
PIN
Positive - Intrinsic - Negative (photodiode

technology)
PM
PMA
Physical Medium Attachment
PMD
Physical Medium Dependent
PVID
Port Virtual IDentifier
Q3
Interface with Q3 Protocol
QECC
interface with Q protocol for Embedded Control

Channel
QoS
Quality of Service
RAM
Random Access Memory
RDI
Remote Defect Indication
RECT
REmote Craft Terminal
RI
Remote Inventory
RMGII
Reduced Gigabit Media Independent Interface
R-OADM
Reconfigurable Optical Add and Drop

Multiplexer
RPO
Receiver Parameter Optimization
RS
Regenerator Section
RS-AIS
proprietary Alcatel Maintenance Signal, defined

as a SDH RS frame, with all ones except Frame
Alignment Word and B1 parity
RSOH
Regenerator Section Overhead
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
B-5
Abbreviations
............................................................................................................................................................................................................................................................
RUM
Replaceable Unit Missing
RUP
Replaceable Unit Problem
RUTM
Replaceable Unit Type Mismatch
RX
Receiver
SAPI
Source Dress Point Identifier
SBS
Stimulated Brillouin Scattering
SLTE
Submarine Line Terminal Equipment
SCP
Serial Communication Problem
SD
ShutDown
SDH
Synchronous Digital Hierarchy
SFP
Small Form Factor Pluggable
SMF
Single Mode Fiber
SMSR
SNCP
Sub-Network Connection Protection
SPI
Serial Peripheral Interface
SPV
SuPerVision
SSF
Server Signal Failure
SW
Software
SWDL
Software DownLoad
TCA
Threshold Crossed Alarm
TCP
Transmission Control Protocol
TCP/IP
Transmission Control Protocol/Internet Protocol
TDM
Time Division Multiplexing
TDMX
Tunable Demultiplexer
TDF
Total Dropped Frames
TIM
Trace Identifier Mismatch
TimActDis
TIM consequent actions disabled
TMN
Telecommunication Management Network
TPD
Transponder
TRCF
Total Received Correct Frame
TRCO
Total Received Correct Octet
TRSEF
Total Received Service Errored Frames

(=CRC+alignment errors+undersize+oversize)
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
B-6
Abbreviations
............................................................................................................................................................................................................................................................
TRU
Top Rack Unit
TTF
Total Transmitted Frames
TTO
Total Transmitted Octets
TX
Transmitter
UDC
User Data Channel
UIC
User Interface Card
ULH
Ultra Long Haul
UNI
User Node Interface
UR
Unrepeatered Systems
URG
URGent
USM
User Service Manager
VHM
Virtual Hardware Machine
VLAN
Virtual Local Area Network
VLH
Very Long Haul
VOA
Variable Optical Attenuator
VSR
Very Short Reach
WAN
Wide Area Network
WIS
Wan Interface Sublayer
WDM
Wavelength Division Multiplexing
WMAN
Wavelength Manager
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
B-7
Abbreviations
............................................................................................................................................................................................................................................................
............................................................................................................................................................................................................................................................
3AL 75131 AAAA
B-8

Technical Handbook 1626 R5 - 0

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Alcatel-Lucent 1626LM

1626 LIGHT MANAGER | RELEASE 5.0

3AL 75131 AAAA

Product Configurations & Environment General Overview

Multiplexing & Amplification Configurations

The Optical Channels ................................................................................................................................3-5

Dismantling & recycling

Safety Norms & Equipment Labels

Product Configurations & Environment General Overview

Generic Shelf Boards ................................................................................................................... 2-4

T-OADM Capacity/number of shelves and racks ........................................................................ 2-9

T-OADM / 10 Gbps Transponder Shelf Organization ............................................................... 2-12

1626 LM boards and unit list ..................................................................................................... 2-24

OADC & OCNC LED ................................................................................................................ 2-42

WMAN LED .............................................................................................................................. 2-42

TDMX LED ............................................................................................................................... 2-43

TRBD4312 LED ........................................................................................................................ 2-43

Optical Signal Process .................................................................................................................. 3-2

Transponder and Concentrator Transmission Rates/Mode .......................................................... 3-4

Transponder and Concentrator Standard Compliance ................................................................. 3-4

Boards and supported Performance Monitoring Points ............................................................. 3-21

RS counters default threshold data values .................................................................................. 3-27

OCH counters default threshold data values .............................................................................. 3-27

Front Panel LEDs severity meaning ........................................................................................... 3-46

ALCT1010 wavelengths list ....................................................................................................... 4-41

Environmental Operating Conditions[1] .................................................................................... 4-66

Transportation climatic .............................................................................................................. 4-70

Dismantling & recycling

Safety Norms & Equipment Labels

IEC 950 -Table 16: Overtemperature limits ...............................................................................A-12

Label references .........................................................................................................................A-15

Example of ANV Part Number + ICS evolution .......................................................................A-19

Product Configurations & Environment General Overview

Example of 1626 LM configurations in a WDM line .................................................................. 1-4

Example of WDM line ................................................................................................................. 1-6

1626 LM Line Terminal configuration, 50 GHz grid ................................................................. 1-10

Line Terminal - Long Haul - 50 GHz grid ................................................................................. 1-11

1626 LM Line Repeater configuration ....................................................................................... 1-12

R-OADM Configuration Example ............................................................................................. 1-13

T-OADM Degree 2 Configuration Example .............................................................................. 1-15

T-OADM Degree 3 Configuration Example .............................................................................. 1-18

1626 LM OADM configuration on a 50 GHz grid .................................................................... 1-20

1626 LM back-to-back terminal configuration .......................................................................... 1-24

Long Haul Back-to-Back Terminal, 50 GHz Grid ..................................................................... 1-25

1626 LM line terminal configuration on a 100GHz grid ........................................................... 1-27

Regional Line Terminal, 100 GHz grid ...................................................................................... 1-28

MUX and DMUX functions of an 8 channels Line Terminal .................................................... 1-33

MUX and DMUX functions of a 12 channels Line Terminal .................................................... 1-34

MUX and DMUX functions of a 32 channels Line Terminal .................................................... 1-34

MUX and DMUX functions of an 8 channels OADM .............................................................. 1-35

MUX and DMUX functions of a 32 channels back-to-back terminal ....................................... 1-36

Generic bidirectional block scheme of a 2-stage amplifier ........................................................ 1-38

Optical amplification in back-to-back / OADM configuration (bidirectional) .......................... 1-39

Optical amplification in back-to-back / OADM configuration (unidirectional) ........................ 1-40

Optical amplification in Line Repeater configuration ................................................................ 1-41

Optical amplification in Line Terminal configuration ............................................................... 1-42

Generic example of LT configuration in point-to-point application .......................................... 1-44

The 1626 LM in point-to-point links ......................................................................................... 1-49

The 1626 LM in linear (multipoint-to-multipoint) links ............................................................ 1-50

The 1626 LM in ring (multipoint-to-multipoint) networks ....................................................... 1-50

Connection to host equipment ................................................................................................... 1-52

Optical channel protection in linear links .................................................................................. 1-54