Вы находитесь на странице: 1из 13

User's Guide

SLVU551H October 2011 Revised January 2014

Powering the AM335x with the TPS65217x


This Users Guide is a reference for connectivity between the TPS65217 power management IC and the
AM335x processor. For detailed information about TPS65217 and AM335x, see the respective data
sheets.

TPS65217 Overview
The TPS65217 is an optimized and highly integrated power management solution for the AM335x
processor. Features of the TPS65217 include:
Power path management for Lithium-ion battery, USB, and AC inputs
Linear Battery Charger
3 DC/DC Step-Down Converters
2 LDOs
2 Load Switches (configure as LDOs)
White LED driver capable of driving up to 20 LEDs
There are four versions of the TPS65217:
TPS65217A is used for the AM335x processor in the ZCE package. In this package, the VDD_MPU
and VDD_CORE nodes are shorted together and will only use a single power rail.
TPS65217B is used for the AM335x processor in the ZCZ package. In this package, the VDD_MPU
and VDD_CORE rails are separate and can use separate power rails.
TPS65217C is also targeted at the AM335x processor in the ZCZ package, but the DCDC1 output
voltage is set to 1.5 V to supply DDR3 memory. This version does not support AM335x RTC-only
operation.
TPS65217D is identical to TPS65217C, except DCDC1 is set to 1.35 V to support DDR3L.

PMIC

Processor

Memory

TPS65217A

AM335xZCE

DDR2
DDR2

TPS65217B

AM335xZCZ

TPS65217C

AM335xZCZ

DDR3

TPS65217D

AM335xZCZ

DDR3L

All trademarks are the property of their respective owners.


SLVU551H October 2011 Revised January 2014
Submit Documentation Feedback

Powering the AM335x with the TPS65217x

Copyright 20112014, Texas Instruments Incorporated

Connection Diagram for TPS65217A and AM335x

www.ti.com

Connection Diagram for TPS65217A and AM335x


The block diagram shown in Figure 1 illustrates the connections between TPS65217A and AM335x.
Power rails as well as the digital and analog signals are shown. The power rails may be used to power
additional parts of the system (DCDC1 powers DDR2 memory).
AC

SYS

from AC connector

To system load
4.7F

USB

BAT

Single cell
Li+ Battery

Power Path
and Charger

from USB connector


4.7F

VDDS_PLL_MPU
VDDS_PLL_CORE_LCD
VDDS_SRAM_MPU_BB

INT_LDO
100nF

BYPASS

BAT_SENSE

10F

TS

75k

VDDS_SRAM_CORE_BG
VDDA1P8V_USB0
VDDS_DDR
10k NTC

VDDS

10F

L1

VIN_DCDC1

VDDS_OSC
VDDS_PLL_DDR

22F

DCDC1

VDDSHVx(1.8)

(1.8V)

VDCDC1

VDDA_ADC

10F

DDR2
10F

L2

VIN_DCDC2

DCDC2

(3.3V)

VDCDC2

VDDSHVx(3.3)

10F

VDDA3P3V_USB0

10F

SYS

L3

VIN_DCDC3

DCDC3

(1.1V)

VDCDC3

VDD_CORE

10F

VDD_MPU

10F

VIN_LDO

VLDO1

LDO1

(1.8V)

VDDS_RTC

2.2uF
4.7F

AGND

VLDO2

LDO2

(3.3V)
2.2uF

PGND

LS1_IN

LS1_OUT

LS1/LDO3

SYS or VDCDCx

10uF

LS2_IN

LS2_OUT

LS2/LDO4

SYS or VDCDCx

10uF

MUX_IN

(0..3.3V)

VBAT
VSYS
VICHARGE
VTS

Any system
power needs

Any system
power needs

MUX_OUT

AIN4

MUX
100nF

Any system voltage

Always-on
supply

Always-on
supply

100k

100k

PB_IN

nRESET
4.7k

VDDSHV6

4.7k

VDDSHV6

No Connect

SCL

VIO
VLDO1

Any system
power needs

I2C0_SCL

SDA

18uH

L4

I2C0_SDA

PWR_EN

PMIC_PWR_EN

SYS

PGOOD

FB_WLED

PWRONRSTN

LDO_PGOOD
4.7F

WLED
Driver

10k

VDDSHV6

100k

VLDO1

RTC_PWRONRSTN

nINT

EXTINTn

nWAKEUP

ISINK1

EXT_WAKEUP

ISINK2
ISET1
ISET2
Power Pad (TM)

TPS65217A

AM335x

Figure 1. Connection Diagram for TPS65217A and AM335x

Powering the AM335x with the TPS65217x

SLVU551H October 2011 Revised January 2014


Submit Documentation Feedback

Copyright 20112014, Texas Instruments Incorporated

Power Rails for TPS65217A and AM335x

www.ti.com

Power Rails for TPS65217A and AM335x


Table 1 matches the AM335x power terminals with the appropriate power rail from the TPS65217A.
Table 1. Power Rails for TPS65217A and AM335x
TPS65217A

Voltage (V)

AM335x
VDDS_DDR
VDDS
VDDSHVx(1.8 V)
VDDS_SRAM_CORE_BG
VDDS_SRAM_MPU_BB

DCDC1

1.8

VDD_PLL_DDR
VDDS_PLL_CORE_LCD
VDDS_PLL_MPU
VDDS_OSC
VDDA1P8V_USB0/1
VDDA_ADC
VDDSHVx(3.3 V)

DCDC2

3.3

DCDC3

Defaults to 1.1 V. Controlled by I2C.

LDO1

1.8

VDDS_RTC

VDDA3P3V_USB0/1
VDD_CORE
VDD_MPU

LDO2

3.3

n/a

LDO3/LS1

Load Switch

n/a

LDO4/LS2

Load Switch

n/a

Each output voltage may be changed dynamically while the TPS65217 is in active mode. This requires
use of I2C commands to the TPS65217.

SLVU551H October 2011 Revised January 2014


Submit Documentation Feedback

Powering the AM335x with the TPS65217x

Copyright 20112014, Texas Instruments Incorporated

Power-Up Sequence for TPS65217A

www.ti.com

Power-Up Sequence for TPS65217A


Figure 2 and Table 2 describe the power-up sequence of the TPS65217A. This sequence is optimized
specifically for the AM335x processor.
NOTE: The power-down sequence follows the reverse of the power-up sequence.
STROBE 15

STROBE 1

STROBE 2

DLY 1
5ms

STROBE 3

DLY 2
1ms

STROBE 4

DLY 3
1ms

VSYS
WAKEUP

(1)

PWR_EN (DG) (2)


(3)

LDO1
LDO2
DCDC1
DCDC2
DCDC3
LS1
LS2
PGDLY 20 ms

PGOOD
(1)

Wakeup events are PB_IN or AC or USB

(2)

DG = Deglitched

(3)

LDO1 turns on as soon as VSYS is present

LDO_PGOOD 20 ms after LDO1

Figure 2. Power-Up Sequence Timing Diagram, TPS65217A


Table 2. TPS65217A, Power-Up Sequence
STROBE 15
STROBE 1
STROBE 2

LDO1
DCDC1
LS1
DCDC2
LDO2

STROBE 3

DCDC3

STROBE 4

LS2

Powering the AM335x with the TPS65217x

SLVU551H October 2011 Revised January 2014


Submit Documentation Feedback

Copyright 20112014, Texas Instruments Incorporated

Connections Diagram for TPS65217B and AM335x

www.ti.com

Connections Diagram for TPS65217B and AM335x


The block diagram shown in Figure 3 illustrates the connections between TPS65217B and AM335x.
Power rails as well as the digital and analog signals are shown. The power rails may be used to power
additional parts of the system (DCDC1 powers DDR2 memory).
AC

SYS

USB

BAT

from AC connector

To system load
4.7F
Single cell
Li+ Battery

Power Path
and Charger

from USB connector


4.7F

VDDS_PLL_MPU
VDDS_PLL_CORE_LCD
VDDS_SRAM_MPU_BB

INT_LDO
100nF

BYPASS

BAT_SENSE

10F

TS

75k

VDDS_SRAM_CORE_BG
VDDA1P8V_USB0
VDDS_DDR
10k NTC

VDDS

10F

DCDC1

VDDSHVx(1.8)

(1.8V)

L1

VIN_DCDC1

VDDS_OSC
VDDS_PLL_DDR

22F

VDCDC1

VDDA_ADC

10F

DDR2
10F

L2

VIN_DCDC2

DCDC2

(1.1V)

VDCDC2

VDD_MPU

10F

10F

SYS

L3

VIN_DCDC3

DCDC3

(1.1V)

VDCDC3

VDD_CORE

10F

10F

VIN_LDO

(1.8V)

VLDO1

LDO1

VDDS_RTC

2.2uF
4.7F

AGND

VLDO2

LDO2

(3.3V)
2.2uF

PGND

LS1_IN

(3.3V)

LS1_OUT

LS1/LDO3

SYS

VDDSHVx(3.3)

10uF

LS2_IN

VDDA3P3V_USB0

(3.3V)

LS2_OUT

LS2/LDO4

SYS

VDDSHVx(3.3)

10uF

MUX_IN

(0..3.3V)

VBAT
VSYS
VICHARGE
VTS

MUX_OUT

AIN4

MUX
100nF

Any system voltage

Always-on
supply

Always-on
supply

100k

100k

PB_IN

nRESET
4.7k

VDDSHV6

4.7k

VDDSHV6

No Connect

SCL

VIO
VLDO1

Any system
power needs

I2C0_SCL

SDA

18uH

L4

I2C0_SDA

PWR_EN

PMIC_PWR_EN

SYS

PGOOD

FB_WLED

PWRONRSTN

LDO_PGOOD
4.7F

WLED
Driver

10k

VDDSHV6

100k

VLDO1

RTC_PWRONRSTN

nINT

EXTINTn

nWAKEUP

ISINK1

EXT_WAKEUP

ISINK2
ISET1
ISET2
Power Pad (TM)

TPS65217B

AM335x

Figure 3. Connection Diagram for TPS65217B and AM335x

SLVU551H October 2011 Revised January 2014


Submit Documentation Feedback

Powering the AM335x with the TPS65217x

Copyright 20112014, Texas Instruments Incorporated

Power Rails Connections for TPS65217B and AM335x

www.ti.com

Power Rails Connections for TPS65217B and AM335x


Table 3 matches the AM335x power terminals with the appropriate power rail from the TPS65217B.
Table 3. Power Rails for TPS65217B and AM335x
TPS65217B

Voltage (V)

AM335x
VDDS_DDR
VDDS
VDDSHVx(1.8 V)
VDDS_SRAM_CORE_BG
VDDS_SRAM_MPU_BB

DCDC1

1.8

VDD_PLL_DDR
VDDS_PLL_CORE_LCD
VDDS_PLL_MPU
VDDS_OSC
VDDA1P8V_USB0/1
VDDA_ADC
2

DCDC2

Defaults to 1.1 V. Controlled by I C.

VDD_MPU

DCDC3

Defaults to 1.1 V. Controlled by I2C.

VDD_CORE

LDO1

1.8

VDDS_RTC

LDO2

3.3

LDO3/LS1

3.3 (LDO)

LDO4/LS2

3.3 (LDO)

n/a
VDDSHVx(3.3 V)
VDDA3P3V_USB0/1
VDDSHVx(3.3 V)

Each output voltage may be changed dynamically while the TPS65217 is in active mode. This requires
use of I2C commands to the TPS65217.

Powering the AM335x with the TPS65217x

SLVU551H October 2011 Revised January 2014


Submit Documentation Feedback

Copyright 20112014, Texas Instruments Incorporated

Power-Up Sequence for TPS65217B

www.ti.com

Power-Up Sequence for TPS65217B


Figure 4 and Table 4 describe the power-up sequence of the TPS65217B. This sequence is optimized
specifically for the AM335x processor.
NOTE: The power-down sequence follows the reverse of the power-up sequence.
STROBE 15

STROBE 1

STROBE 2

DLY 1
5ms

STROBE 3

DLY 2
1ms

STROBE 4

DLY 3
1ms

STROBE 5

DLY 4
1ms

VSYS
WAKEUP (1)
PWR_EN (DG) (2)
LDO1 (3)
LDO2
DCDC1
DCDC2
DCDC3
LDO3
LDO4
PGDLY

PGOOD

20 ms

(1)

Wakeup events are PB_IN or AC or USB

(2)

DG = Deglitched

(3)

LDO1 turns on as soon as VSYS is present

LDO_PGOOD 20 ms after LDO1

Figure 4. Power-Up Sequence Timing Diagram, TPS65217B


Table 4. TPS65217B Power-Up Sequence
STROBE 15

LDO1

STROBE 1

DCDC1

STROBE 2

LDO2

STROBE 3

LDO3

STROBE 4
STROBE 5

SLVU551H October 2011 Revised January 2014


Submit Documentation Feedback

LDO4
DCDC2
DCDC3

Powering the AM335x with the TPS65217x

Copyright 20112014, Texas Instruments Incorporated

Connections Diagram for TPS65217C and AM335x

www.ti.com

Connections Diagram for TPS65217C and AM335x


The block diagram shown in Figure 5 illustrates the connections between TPS65217C and AM335x.
Power rails as well as the digital and analog signals are shown. The power rails may be used to power
additional parts of the system (DCDC1 powers DDR3 memory).
AC

SYS

from AC connector

To System Load
2.2 :F

4.7 :F

USB

BAT

Single-cell
Li+ Battery

Power Path
and Charger

from USB connector


4.7 :F

10 :F

BAT_SENSE

INT_LDO
100 nF

TS

BYPASS

75 kS
10 kS
NTC

10 :F

L1

VIN_DCDC1

DCDC1

(1.5 V)

VDCDC1

VDDS_DDR

10 :F

DDR3

10 :F

L2

VIN_DCDC2

(1.1 V)

DCDC2

VDCDC2

L3
VDCDC3

(1.1 V)

DCDC3

VLDO1

(1.8 V)

VDD_CORE

10 :F

10 :F

SYS

VIN_DCDC3

VDD_MPU

10 :F

10 :F

VIN
_ LDO

LDO1

VDDS
VDDS_RTC

2.2 :F

4.7 :F

(3.3 V)

VLDO2

LDO2

AGND

2.2 :F

Any system
power needs

LS1_IN

(1.8 V)

LS1_OUT

LS1/LDO3

VDDS_PLL_DDR
VDDS_PLL_MPU
VDDS_PLL_CORE_LCD
VDDS_SRAM_MPU_BB

PGND

SYS

VDDA_ADC
VDDS_OSC

VDDS_SRAM_CORE_BG
VDDA1P8V_USB0

10 :F

VDDSHVx(1.8)

LS2_IN

(3.3 V)

LS2_OUT

LS2/LDO4

SYS

VDDSHVx(3.3)

10 :F

(0_3.3 V)

MUX_IN

VBAT
VSYS
VICHARGE
VTS

VDDA3P3V_USB0

MUX_OUT

AIN4

MUX
100 nF

Always-on
supply

Any system voltage

Always-on
supply

100 kS

100 kS

PB_IN

nRESET
4.7 kS VDCDC1

VDCDC1

No Connect

SCL

VIO

UART1_TXD

4.7 kS VDCDC1

SDA

18 :H

L4

UART1_RXD

PWR_EN

PMIC_PWR_EN

SYS

PGOOD

FB_WLED

PWRONRSTN

LDO_PGOOD
4.7 :F

WLED
Driver

RTC_PWRONRSTN

10 kS VDCDC1

nINT

GPMC_WEN

100 kS VLDO1

nWAKEUP

ISINK1

EXT_WAKEUP

ISINK2
ISET1
ISET2
Power Pad

TM

TPS65217C

AM335x

Figure 5. Connection Diagram for TPS65217C and AM335x

Powering the AM335x with the TPS65217x

SLVU551H October 2011 Revised January 2014


Submit Documentation Feedback

Copyright 20112014, Texas Instruments Incorporated

Power Rails Connections for TPS65217C and AM335x

www.ti.com

Power Rails Connections for TPS65217C and AM335x


Table 5 matches the AM335x power terminals with the appropriate power rail from the TPS65217C.
Table 5. Power Rails for TPS65217C and AM335x
TPS65217C

Voltage (V)

AM335x

DCDC1

1.5

VDDS_DDR

DCDC2

Defaults to 1.1 V. Controlled by I2C.

VDD_MPU

DCDC3

Defaults to 1.1 V. Controlled by I2C.

VDD_CORE

LDO1

1.8

VDDS_RTC

LDO2

3.3

n/a

LDO3/LS1

1.8

VDDSHVx(1.8 V)

VDDS

VDDS_SRAM_CORE_BG
VDDS_SRAM_MPU_BB
VDDS_PLL_DDR
VDDS_PLL_CORE_LCD
VDDS_OSC
VDDA1P8V_USB0/1
VDDA_ADC
LDO4/LS2

3.3

VDDSHVx(3.3 V)
VDDA3P3V_USV0/1

Each output voltage may be changed dynamically while the TPS65217 is in active mode. This requires
use of I2C commands to the TPS65217.

SLVU551H October 2011 Revised January 2014


Submit Documentation Feedback

Powering the AM335x with the TPS65217x

Copyright 20112014, Texas Instruments Incorporated

Power-Up Sequence for TPS65217C

10

www.ti.com

Power-Up Sequence for TPS65217C


Figure 6 and Table 6 describe the power-up sequence of the TPS65217C. This sequence is optimized
specifically for the AM335x processor.
NOTE: The power-down sequence follows the reverse of the power-up sequence.
STROBE 15

STROBE 1

STROBE 2

DLY 1
1ms

STROBE 3

DLY 2
5ms

STROBE 4

DLY 3
1ms

STROBE 5

DLY 4
1ms

VSYS
WAKEUP (1)
PWR_EN (DG) (2)
LDO1 (3)
LDO2
DCDC1
DCDC2
DCDC3
LDO3
LDO4
PGDLY

PGOOD

20ms

(1)

Wakeup events are PB_IN or AC or USB

(2)

DG = Deglitched

(3)

LDO1 turns on as soon as VSYS is present

LDO_PGOOD 20 ms after LDO1

Figure 6. Power-Up Sequence Timing Diagram, TPS65217C


Table 6. TPS65217C Power-Up Sequence
STROBE 15

LDO1

STROBE 1

DCDC1

STROBE 2

LDO3

STROBE 3

LDO2

STROBE 4

LDO4

STROBE 5

10

Powering the AM335x with the TPS65217x

DCDC2
DCDC3

SLVU551H October 2011 Revised January 2014


Submit Documentation Feedback

Copyright 20112014, Texas Instruments Incorporated

PGOOD and LDO_PGOOD Outputs

www.ti.com

11

PGOOD and LDO_PGOOD Outputs


PGOOD and LDO_PGOOD are push-pull outputs. These outputs are supplied by the VIO pin. During
TPS65217 SLEEP mode, all power rails are typically turned off except for LDO1. In order for
LDO_PGOOD to remain high during SLEEP mode, connect the VIO pin to LDO1. This allows the
LDO_PGOOD signal to be valid even during SLEEP mode. With VIO connected to LDO1, PGOOD and
LDO_PGOOD have an output high level of 1.8 V. This level meets the requirements of the PWRONRSTN
and RTC_PWRONRSTN input signals of the AM335x processor.

12

MUX_OUT Scaling
The AINx ADC input of the AM335x processor is powered by VDDA_ADC. Therefore the maximum
voltage input to the ADC should be 1.8 V. If the output voltage of MUX_OUT will be higher than 1.8 V in
your application, then add a resistor divider inbetween MUX_OUT and AINx, such that the voltage at AINx
does not exceed 1.8 V. The resistor values must be large enough such that the load on MUX_OUT is low.
However, the resistors should not be so large as to impact the performance of the ADC.
TPS65217x
MUX_OUT

20 k

AM335x
AINx

60 k

Figure 7. MUX_OUT Scaling Example

13

Pull-Up Resistors
There are four pull-up resistors on the connection diagrams; Figure 1, Figure 3, and Figure 5. nWAKEUP
should be pulled up to VLDO1 so that the pull-up source is present even during SLEEP mode. A 100-k
pull-up resistor should be used for nWAKEUP to minimize the current load on LDO1. nINT, SCL, and SDA
should be pulled up to the same supply that is connected to VDDSHV6. If VDDSHV6 is 1.8 V, then the
1.8-V supply should be used. If VDDSHV6 is 3.3 V, then the 3.3-V supply should be used. SCL and SDA
use lower value pull-up resistors in order to decrease rise time of these nodes during I2C communication.

SLVU551H October 2011 Revised January 2014


Submit Documentation Feedback

Powering the AM335x with the TPS65217x

Copyright 20112014, Texas Instruments Incorporated

11

www.ti.com

Changes from G Revision (March 2013) to H Revision .................................................................................................. Page

Changed connection diagram for TPS65217C and AM335x. ...................................................................... 8


Changed table contents in Power Rails for TPS65217C and AM335x. ........................................................... 9

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

12

Revision History

SLVU551H October 2011 Revised January 2014


Submit Documentation Feedback
Copyright 20112014, Texas Instruments Incorporated

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products

Applications

Audio

www.ti.com/audio

Automotive and Transportation

www.ti.com/automotive

Amplifiers

amplifier.ti.com

Communications and Telecom

www.ti.com/communications

Data Converters

dataconverter.ti.com

Computers and Peripherals

www.ti.com/computers

DLP Products

www.dlp.com

Consumer Electronics

www.ti.com/consumer-apps

DSP

dsp.ti.com

Energy and Lighting

www.ti.com/energy

Clocks and Timers

www.ti.com/clocks

Industrial

www.ti.com/industrial

Interface

interface.ti.com

Medical

www.ti.com/medical

Logic

logic.ti.com

Security

www.ti.com/security

Power Mgmt

power.ti.com

Space, Avionics and Defense

www.ti.com/space-avionics-defense

Microcontrollers

microcontroller.ti.com

Video and Imaging

www.ti.com/video

RFID

www.ti-rfid.com

OMAP Applications Processors

www.ti.com/omap

TI E2E Community

e2e.ti.com

Wireless Connectivity

www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2014, Texas Instruments Incorporated

Вам также может понравиться