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V I S H AY I N T E R T E C H N O L O G Y, I N C .
DATA B O O K
w w w. v i s h a y. c o m
SEMICONDUCTORS
RECTIFIERS
RF TRANSISTORS
Bipolar Transistors (AF and RF)
Dual Gate MOSFETs
MOSMICs
SMALL-SIGNAL DIODES
P rod u ct L istings
OPTOELECTRONICS
IR Emitters and Detectors,
and IR Receiver Modules
Optocouplers and Solid-State Relays
Optical Sensors
LEDs and 7-Segment Displays
Infrared Data Transceiver Modules
Custom Products
ICs
MOSFETs
Power MOSFETs
JFETs
Power ICs
Analog Switches
DC/DC Converters
RF Transceivers
ICs for Optoelectronics
Passive Components
RESISTIVE PRODUCTS
CAPACITORS
Foil Resistors
Film Resistors
Metal Film Resistors
Thin Film Resistors
Thick Film Resistors
Metal Oxide Film Resistors
Carbon Film Resistors
Wirewound Resistors
Power Metal Strip Resistors
Chip Fuses
Variable Resistors
Cermet Variable Resistors
Wirewound Variable Resistors
Conductive Plastic Variable Resistors
Networks/Arrays
Non-linear Resistors
NTC Thermistors
PTC Thermistors
Varistors
Tantalum Capacitors
Molded Chip Tantalum Capacitors
Coated Chip Tantalum Capacitors
Solid Through-Hole Tantalum Capacitors
Wet Tantalum Capacitors
Ceramic Capacitors
Multilayer Chip Capacitors
Disc Capacitors
Film Capacitors
Power Capacitors
Heavy-Current Capacitors
Aluminum Capacitors
Silicon RF Capacitors
MAGNETICS
Inductors
Transformers
PhotoStress
Strain Gages
Load Cells
Force Transducers
Instruments
Weighing Systems
IR Transceivers
Databook
NOTICE
Specifications of the products displayed herein are subject to change without notice. Vishay
Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or
inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or
implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except
as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability
whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products
including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement
of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining
applications. Customers using or selling these products for use in such applications do so at their own
risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.
Table of Contents
Vishay Semiconductors
General Information
Infrared Data Communication According to IrDA Standard, Part 1: Physical Layer............................................
Infrared Data Communication According to IrDA Standard, Part 2: Protocol......................................................
Symbols and Terminology .....................................................................................................................................
Data Sheet Structure .............................................................................................................................................
Taping, Labeling, Storage, Packing and Marking..................................................................................................
Environmental Health and Safety Policy ...............................................................................................................
Surface Mount Assembly Instructions ...................................................................................................................
Window Size in Housings ......................................................................................................................................
Sources for Accessories and Testing ....................................................................................................................
Ambient Light and Electromagnetic Interference ..................................................................................................
Eye Safety of Diode Emitters ................................................................................................................................
Remote Control with IrDA Transceivers ..............................................................................................................
Interface Circuits ...................................................................................................................................................
Reference Layouts and Circuit Diagrams..............................................................................................................
Quality and Reliability ............................................................................................................................................
8
21
31
41
42
52
53
58
60
66
68
69
80
87
96
SIR
TFBS4650 .............................................................................................................................................................
TFBS4652 .............................................................................................................................................................
TFBS4710 .............................................................................................................................................................
TFBS4711 .............................................................................................................................................................
TFDU4100 .............................................................................................................................................................
TFDU4101 .............................................................................................................................................................
TFDU4202 .............................................................................................................................................................
TFDU4203 .............................................................................................................................................................
TFDU4300 .............................................................................................................................................................
120
131
142
151
160
171
185
194
204
MIR
TFBS5700 .............................................................................................................................................................
TFBS5711 .............................................................................................................................................................
TFDU5307 .............................................................................................................................................................
218
230
242
FIR
TFBS6711 .............................................................................................................................................................
TFBS6712 .............................................................................................................................................................
TFDU6102 .............................................................................................................................................................
TFDU6103 .............................................................................................................................................................
TFDU6300 .............................................................................................................................................................
TFDU6301 .............................................................................................................................................................
TFBS6614 .............................................................................................................................................................
258
270
282
295
308
321
334
346
VFIR
TFDU8108 .............................................................................................................................................................
360
Emitter/Detector Pair
TFDU2201 .............................................................................................................................................................
384
Endec
TOIM4232 .............................................................................................................................................................
392
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Alphanumeric Index
Vishay Semiconductors
TFBS4650..............................................................................................................................................................
120
TFBS4652..............................................................................................................................................................
131
TFBS4710..............................................................................................................................................................
142
TFBS4711..............................................................................................................................................................
151
TFBS5700..............................................................................................................................................................
218
TFBS5711..............................................................................................................................................................
230
TFBS6614..............................................................................................................................................................
334
TFBS6711..............................................................................................................................................................
258
TFBS6712..............................................................................................................................................................
270
TFDU2201 .............................................................................................................................................................
384
TFDU4100 .............................................................................................................................................................
160
TFDU4101 .............................................................................................................................................................
171
TFDU4202 .............................................................................................................................................................
185
TFDU4203 .............................................................................................................................................................
194
TFDU4300 .............................................................................................................................................................
204
TFDU5307 .............................................................................................................................................................
242
TFDU6102 .............................................................................................................................................................
282
TFDU6103 .............................................................................................................................................................
295
TFDU6300 .............................................................................................................................................................
308
TFDU6301 .............................................................................................................................................................
321
TFDU7100 .............................................................................................................................................................
346
TFDU8108..............................................................................................................................................................
360
TOIM4232..............................................................................................................................................................
392
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Selection Guide
Vishay Semiconductors
Type
Size
Operating
Link Distance
(H x L x W)
Voltage VCC
(m)
(mm x mm x mm)
(V)
Idle Supply
Current
(mA)
Shutdown
Current
(A)
Pins
Pad Pitch
(mm)
0 to t 0.3
2.4 to 3.6
0.08
0.01
0.95
VCC
on
TFBS4652
0 to t 0.3
2.4 to 3.6
0.08
0.01
0.95
t 1.5
on
TFBS4710
0 to t 1.0
2.4 to 5.5
0.07
0.01
1.55
VCC
off
TFBS4711
0 to t 0.5
2.7 to 5.5
0.08
0.01
0.95
VCC
off
TFDU4100
0 to t 1.0
2.7 to 5.5
no SD
VCC
TFDU4101
0 to t 1.0
2.7 to 5.5
0.01
VCC
on
TFDU4202
0 to t 0.7
2.4 to 5.5
0.06
no SD
0.8
VCC
off
TFDU4203
0 to t 0.7
2.4 to 5.5
0.06
0.02
0.8
VCC
off
TFDU4300
0 to t 0.7
2.4 to 5.5
0.08
0.01
0.95
t 1.5
off
0 to t 0.5
2.7 to 3.6
0.55
0.01
0.95
1.8
on
TFBS5711
0 to t 0.5
2.7 to 5.5
0.55
0.1
0.95
VCC
off
TFDU5307
0 to t 0.7
2.7 to 5.5
0.55
0.01
0.95
t 1.5
on
0 to t 0.7
2.7 to 5.5
1.6
0.01
0.95
t 1.5
on
TFBS6711
0 to t 0.5
2.4 to 3.6
1.7
0.01
0.95
VCC
on
TFBS6712
0 to t 0.5
2.4 to 3.6
1.7
0.01
0.95
1.8
on
TFDU6102
0 to t 1.0
2.7 to 5.5
1.6
< 1.0
VCC
on
TFDU6103
0 to t 1.0
2.7 to 5.5
1.6
< 1.0
1.8
on
TFDU6300
0 to t 0.7
2.4 to 3.6
1.7
0.01
0.95
VCC
on
TFDU6301
0 to t 0.7
2.4 to 3.6
1.7
0.01
0.95
1.8
on
Data Rate: SIR 9.6 kbit/s to FIR 4 Mbit/s and 36 kHz to 38 kHz Carrier Remote Control Receiver
TFDU7100
2.7 to 5.5
2 mA
(RC active)
VCC
on
0 to t 0.7
2.7 to 5.5
0.01
t 1.8
on
n.a.
2.4 to 5.5
n.a.
n.a.
0.8
n.a.
yes
n.a.
2.7 to 3.6
16
VCC
n.a.
0 to t 0.5
SIR Encoder/Decoder
TOIM4232
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Vishay Semiconductors
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Contents
Infrared Data Communication
According to IrDA Standard,
Part 1: Physical Layer .............. 8
Infrared Data Communication
According to IrDA Standard,
Part 2: Protocol ........................21
General
Information
Executive Summary
IrDA was established in 1993 to set and support hardware and software standards which create infrared
communications links. The Association's charter is to
create an interoperable, low-cost, low-power, halfduplex, serial data interconnection standard that supports a walk-up, point-to-point user model that is
adaptable to a wide range of applications and
devices. IrDA standards support a broad range of
computing, communications, and consumer devices.
International in scope, IrDA is a non-profit corporation
headquartered in Walnut Creek, California, and led by
a Board of Directors which represents voting membership worldwide. As a leading high technology standards association, IrDA is committed to developing
and promoting infrared standards for the hardware,
software, systems, components, peripherals, communications, and consumer markets.
Industry Overview
Infrared (IR) communications is based on technology
which is similar to the remote control devices such as
TV and entertainment remote controls used in most
homes today. IR offers a convenient, inexpensive and
reliable way to connect computer and peripheral
devices without the use of cables. IrDA connectivity is
being incorporated into most notebook PCs to bring
the most cost-effective and easy to use support available for wireless technologies.
There are few US, European or other international
regulatory constraints.
Manufacturers can ship IrDA-enabled products globally without any constraints, and IrDA functional
devices can be used by international travellers wherever they are, and interference problems are minimal.
Standards for IR communications have been developed by IrDA. In September 1993, IrDA determined
the basis for the IrDA SIR Data Link Standards. In
June 1994, IrDA published the IrDA standards which
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IR output
Pulse shaping
UART16550/ RS232
TOIM4232
Pulse recovery
Transmitter
4000 series
transceiver
Receiver
IR input
17255
Up to 115.2 kbit/s
I/O
Output driver
and IRED
1.152 Mbit/s
0.576 Mbit/s
IR transceiver
module
4.0 Mbit/s
Detector
and receiver
IR output
Active output
interface
Active input
interface
IR output
17256
Figure 2. Block diagram of one end of the link for signaling rates up to 4.0 Mbit/s
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Standard Standard
0.2
0.3
1.0
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UART
Start
Frame
Data Bits
Stop
Bit
Bit
UART
Frame
IR Frame
Start
Data Bit
Stop
Bit
Bit
IR Frame
Bit T ime
17257
Signaling Rate
Modulation
Rate Tolerance
% of Rate
Pulse Duration
Minimum
Pulse Duration
Nominal
Pulse Duration
Maximal
2.4 kbit/s
RZI*)
r 0.87
1.41 s
78.13 s
88.55 s
9.6 kbit/s
RZI*)
r 0.87
1.41 s
19.53 s
22.13 s
19.2 kbit/s
RZI*)
r0.87
1.41 s
9.77 s
11.07 s
38.4 kbit/s
RZI*)
r0.87
1.41 s
4.88 s
5.96 s
57.6 kbit/s
RZI*)
r0.87
1.41 Ps
3.26 s
4.34 s
115.2 kbit/s
RZI*)
r0.87
1.41 s
1.63 s
2.23 s
0.576 Mbit/s
RZI
*)
r0.1
295.2 ns
434.0 ns
520.8 ns
1.152 Mbit/s
RZI*)
r0.1
147.6 ns
217.0 ns
260.4 ns
4.0 Mbit/s
Single pulse
Double pulse
4 PPM
4 PPM
r0.01
r0.01
115.0 ns
240.0 ns
125.0 ns
250.0 ns
135.0 ns
260.0 ns
HHH (1.13)
r0.01
38.3 ns
41.7 ns
45.0 ns
16 Mbit/s
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1.6 s or 3 /16
NRZ
115.2 kbit/s
RZ I - IR
0.576 Mbit/s
1.15 2 Mbit/s
17258
1/ 4 Bit cell
4.0 Mbit/s
One complete
Symbol
chip 1
chip 2
chip 3
chip 4
Ct = 125 ns
Dt = 500 ns
17259
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00
01
10
11
1000
0100
0010
0001
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Type
Minimum
Specification
All
Both
0.85
0.90
All
Std
500*)
Low Power
500*)
Std
40
Low Power
3.6
Std
100
Low Power
All
Both
r 15
r 30
All
Both
See table 2
See table 2
600
40
Pulse duration
Optical overshoot, %
Maximum
19
See table 2
All
Both
See table 2
All
Both
25
Both
r 6.5
Edge Jitter, relative to reference clock, % of nominal duration 0.576 and 1.152 Mbit/s
Both
r 2.9
4.0 Mbit/s
Both
r 4.0
16.0 Mbit/s
Std
r 4.0
550
500
450
400
350
IrDA tolerance field
300
250
200
Typical characteristic
150
100
(V)FIR
50
0
- 90
17260
SIR
- 75
- 60
- 45
- 30
- 15
15
30
45
60
75
90
Angle of emission ()
Figure 3. Tolerance field of angular emission
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Data Rates
Type
Minimum
Maximum
All
Both
500
Low Power
9.0
Std
4.0
Low Power
22.5
Std
10.0
All
Both
15
Std
10
Low Power
0.5
Both
0.10
16.0 Mbit/s
Table 4: Active input specification
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High
State
minimum
- 30
17261
- 15
15
30
Angle (Degrees)
Figure 4. Optical High State Acceptable Range
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107
Ie = 500 mW/sr
Ie = 240 mW/sr
106
Ie = 100 mW/sr
Ie = 40 mW/sr
105
Irradiance (mW/m 2)
104
103
102
101
100
10-1
10-2
0.01
0.1
1
Distance (m)
10
100
17262
Figure 5. IrDA and Remote Control maximum transmission distance. For Remote Control
receivers operating with IrDA transmitters a sensitivity of 0.7 mW/m2 can be assumed.
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19
measurement test circuits and calibration are provided in IrDA Serial Infrared Physical Layer Measurement Guidelines.
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17265
Address Conflict
Resolution
Connect
Information
Transfer
Disconnect
Reset
17266
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IrDA Link Management Protocol, IrLMP, is a mandatory component of IrDA compliant devices and
addresses both the previous needs mentioned.
Connection multiplexing services provided by
IrLMP Multiplexer (LM-MUX).
Location of peer application components supported by IrLMP Information Access Service(LMIAS)
IrLMP Multiplexer (LM-MUX) provides multiplexed
channels on top of an IrLAP connection. Each of
these so called Link Service Access Point or LSAPconnections (distinguished from IrLAP connections)
carries a logical separated information stream. The
multiplexer operates in two modes. In multiplexed
mode, the multiplexer will accept data from any of its
clients (transport entities or directly bound applications). In exclusive mode a single LSAP-connection
claims access to the IR medium.
IrLMP Information Access Service (LM-IAS) is a
direct client of LM-MUX and operates in a sclient
servers manner. Application components that wish to
make themselves accessible to peer components in
other devices "describe" themselves by creating an
object whose attributes carry the essential parameters required to establish a connection between the
two peers. An application component seeking a peer
application component inspects the objects within the
remote LM-IAS information base. Assuming a suitable object exists, the connection parameters and the
mechanism are retrieved, which is accessible at the
top of the LM-IAS.
MUX is used to enumerate the devices available. The
resulting list of devices may be sorted/prioritized on
the basis of the information hints supplied in discovery responses.
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Application
Application
Communication
Segment
Device A
Device B
17267
17268
Device A
with IrDA
(Type 1)
IR
IR
Device B
with IrDA
(Type 2)
Device B
with IrDA
(Type 1)
Wire
Device C
non IrDA
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Signal
Description
Comment
102
Signal
Common
103
Transmitted
Data (TD)
104
Received
Data (RD)
Here are the main attributes of the 3-Wire Raw service class:
Only one non-IAS IrLMP connection can be
open if 3-Wire raw is used - all other connections
must be closed before it can be established, and
others must wait until the raw connection is closed
before they can connect.This is because 3-Wire
raw uses the flow control features of IrLAP, which
can result in a deadlock condition if more than one
non-IAS connection is open.
Minimal Implementation. All the IrCOMM data is
sent directly via IrLMP in IrLMP packets. All data
that follows the IrLMP Mux bytes in an IrLMP
packet is IrCOMM data, (i.e., it is the information
that would travel over the data line(s) of a wired
interface). No control channel is available to comDocument Number: 82504
Rev.1.4, 20-Sep-06
Signal Description
105
106
107
108
109
125
(Command Definition)
Default OBEX
applications
IrCOMM
(RS232Cemulation)
OBEX protocol
Various Transports
(TinyTP, Connectionless)
IAS Services
IrLMP-IAS
Tiny TP
IrLAP
17269
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17270
SCEP establishes a session on IrCOMM and provides a transparent session which notifies an upper
layer of a command. The procedure of SCEP is developed by a lower layer making use of an advantage
that an IrDA protocol is "error free", as a high speed
session layer matching the IrDA protocol.
As is apparent from its name, bFTP provides a service for transferring a binary file. The bFTP assumes
a virtual file system together with a communication
protocol. The bFTP has an aspect which enables it to
be easily implemented, because it assumes such a
simple file system that will allow "a binary file to be
stored with its name".
Moreover, bFTP is characterized by a query function
which allows it to query functions and properties of a
device and the image format available in the theme of
this section, i.e., the image transfer. This query function simplifies the user interface of a digital camera,
Document Number: 82504
Rev.1.4, 20-Sep-06
hardware or software, e.g. in the case where an algorithm of JPEG compression/expansion or the like is
performed by hardware or is fixedly used as firm
ware, it is undesirable to change JPEG itself.
As a further advanced step, UPF is designed so that
additional data on an ambiguous point within the data
of JPEG scheme is arranged in the header part. The
additional data includes factors such as white level,
black level and color-difference signal, necessary for
reproducing an image with correct brightness and
color.
Although the format of a digital camera is being examined by various organizations, a conclusive decision
has not yet been made. In most cases, an arrangement such as a new addition of a tag to JPEG or the
like has been proposed. However, it will take a long
time to reach a conclusion satisfactory to all the companies concerned. The approach of making the best
use of an existing standard, wherein the data necessary for a digital camera is separated and added so as
to assure expendability, is more realistic than the
approach of waiting for a new standard to be defined
and finalized.
Though UPF is defined as an appendix, it is indispensable in order that the IrTran-P standard is able to
support an image format of a UPF scheme. In IrTranP, a sender starts an operation which transfers picture data from a digital camera.
Operation by User
With the use of "selection of a specific picture" and
a "transmission button" the user puts the digital
camera of the sender into a transmission state.
It is assumed that the device of a receiver is
always in a receiving state or put info a picture
data receiving state by a "reception button".
Establishment of Session by SCEP
The digital camera of the sender carries out a discovery procedure using IrDA protocols and performs a connection for the physical to IrCOMM
layers of IrDA protocols in accordance with IrDA
protocols. When an IrDA transmission path is
established, SCEP makes a "session establishment request" from the sender to the receiver of a
digital camera, printer or PC. If the receiver is
implemented with SCEP, it must make a response
of either "session established" or "session establishment rejected".
Query Operation by bFTP (Query function)
When a session by SCEP is established, the digital camera of the sender issues a Query request in
order to recognize the picture processing functions of the receiver. The information mutually
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28
The IrMC Call Control specification enables call control of mobile handsets. The IrMC Audio Specification
enables real time audio transmission respectively.
These two specifications are for communication
between a handset and PC or a handset and car cradle.
Data Transmission
The IrMC framework uses the existing IrDA specifications as much as possible. IrDA connection-oriented
services are used as is, and the connectionless service (Ultra) is further defined to be applicable to IrMC
devices.
Physical Layer Considerations
Because the power consumption requirements of the
IrMC devices are very critical, a low power option for
these devices has been specified already in the
IrPHY version 1.2. This specification defines a lighter
physical layer and allows up to ten times savings in
the LED drive current. It should be noted that this
specification, which only expects the Specifications
for IR Mobile Communications (IrMC) Version 1.1
IrMC devices to be capable of 20 cm link distance
from IrMC device to IrMC device and 30 cm from IrMC
device to a standard IrDA device, is optional and the
original IrDA-SIR values may be used in all IrMC
device implementations. Despite the shorter communication range of some IrMC devices, all devices must
clearly be compatible with the IrDA-SIR in the short
range.
Devices supporting IrCOMM communications with
personal computers should realize that the RF interference shielding of PCs may be imperfect.
For Mobile Communication applications standard
transceivers, fulfilling the IrDA physical layer specification can be applied. However, especially in mobile
phone application the demand for a high EMI immunity must be considered. Vishay Semiconductors supplies devices suited for these applications.
IrSimple (Acronym: IrSC), is one of the latest additions to the upper layer protocols, it does not replace
but enhances most of the other application based protocols by providing a more efficient mechanism to
transfer specific object data formats such as graphic
files that are typically associated with small portable
devices maintaining the lowest usage of memory.
Frequent scenarios are the transmission of pictures
between mobile phones as well as from mobiles to TV
sets. This protocol also relies on the binding Access
and Management protocols.
Because it must maintain a degree of integrity with
other applications protocol that would also allow it to
handle standard bidirectional transmission of small
data files, it makes use of a sequence manager protocol IrSMC for the segmentation and reassembly of
frames (flow control), primarily between the application protocols and the link management protocol
IrLMP. Unlike with other robust and complex data
transfer protocols, IrSC is specifically aimed at visual
(graphical data transfers). It is not mandatory for the
receiving station to maintain a bidirectional link
because successful transmission of data is visually
ackknowledged.
The Infrared Data Association (IrDA) announced the
availability of the IrSimple Protocol and Profile Specifications under the brand name SimpleShotTM. Simple Shot enables mobile devices like Camera Phones
to wireless transmit digital images to similarly enabled
Televisions, Monitors, Projectors and Photo Kiosks.
SimpleShot frees the billions of digital images trapped
in Camera Phones and PDAs, allowing them to be
viewed on large screens or quickly printed. The IrDA
Special Interesting Group (SIG) developed and perfected SimpleShot for fast, wireless communication
between mobile devices and digital home appliances.
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IrLAP
IrLMP
IrPHY
IrTRAN-P
IrCOMM
IrOBEX
Tiny TP
LM-MUX
IrLMP Multiplexer
LM-IAS
SCEP
BFTP
UPF
SIR
Serial Infrared
FIR
Fast Infrared
IrMC
IrFM
IrSC
IrSimple(TM), SimpleShot(TM)
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anode
Anode terminal
A
ampere
SI unit of electrical current
A
radiant sensitive area
That area which is radiant sensitive for a specified range
a
distance
E.g. a distance between the emitter (source)
and the detector
B
base
Base terminal
BER Bit Error Rate
bit/s data rate or signaling rate
1000 bit/s = 1 kbit/s, 106 bit/s = 1 Mbit/s
C
capacitance
Unit: F (farad) = C/V
C
coulomb
C=As
C
cathode, cathode terminal
C
collector, collector terminal
C
degree Celsius
Celsius temperature, symbol t, and is defined
by the quantity equation t = T - T0.
The unit of Celsius temperature is the degree
Celsius, symbol C. The numerical value of a
Celsius temperature t expressed in degrees
Celsius is given by t / C = T / K 273.15
It follows from the definition of t that the degree
Celsius is equal in magnitude to the kelvin,
which in turn implies that the numerical value of
a given temperature difference or temperature
interval whose value is expressed in the unit
degree Celsius (C) is equal to the numerical
value of the same difference or interval when
its value is expressed in the unit kelvin (K)
cd
candela
SI unit of luminous intensity. The candela is the
luminous intensity, in a given direction, of a
source that emits monochromatic radiation of
frequency 540 x 1012 hertz and that has a radiant intensity in that direction of
1/683 watt per steradian. (16th General Conference of Weights and Measures, 1979)
1 cd = 1 lm sr-1
CD
diode capacitance
Total capacitance effective between the diode
terminals due to case, junction and parasitic
capacitances
Document Number: 82512
Rev. 1.4, 06-Oct-06
Cj
junction capacitance
Capacitance due to a pn junction of a diode,
decreases with increasing reverse voltage
d
apparent (or virtual) source size
(of an emitter)
The measured diameter of an optical source
used to calculate the eye safety laser class of
the source. See IEC60825-1 and
EN ISO 11146-1
E
emitter
Emitter terminal (phototransistor)
EA
illumination at standard illuminant A
According to DIN 5033 and IEC 306-1, illumination emitted from a tungsten filament lamp
with a color temperature Tf = 2855.6 K, which
is equivalent to standard illuminant A
Unit: lx (Lux) or klx
EA amb ambient illumination at standard illuminant A
echo - off
Unprecise term to describe the behavior of the
output of IrDA transceivers during transmission. "echo off" means that by blocking the
receiver the output Rxd is quiet during transmission
echo - on
Unprecise term to describe the behavior of the
output of IrDA transceivers during transmission. "echo on" means that the receiver output Rxd is active but often undefined during
transmission. For correct data reception after
transmission the receiver channel must be
cleared during the latency period
Ee, E irradiance (at a point of a surface)
Quotient of the radiant flux d)e incident on an
element of the surface containing the point, by
the area dA of that element. Equivalent definition. Integral, taken over the hemisphere visible
from the given point, of the expression
Le cosT d:, where Le is the radiance at the
given point in the various directions of the incident elementary beams of solid angle d:, and
T is the angle between any of these beams and
the normal to the surface at the given point
Ee
d)
= --------e- =
dA
L e cos T d :
2 S sr
Unit: W m-2
Ev, E illuminance (at a point of a surface)
Quotient of the luminous flux d)v incident on
www.vishay.com
31
2 S sr
F
f
fc, fcd
fs
FIR
Ia
IB
IBM
IC
Ica
ICEO
ICM
idle
Unit: lx = lm m-2
farad
Unit: F = C/V
frequency
Unit: s-1, Hz (Hertz)
cut-off frequency detector devices
The frequency at which, for constant signal
modulation depth of the input radiant power,
the demodulated signal power has decreased
to of its low frequency value. Example: The
incident radiation generates a photocurrent or
a photo voltage 0.707 times the value of radiation at f = 1 kHz
(3 dB signal drop, other references may occur
as e.g. 6 dB or 10 dB)
switching frequency
Fast Infrared, as SIR, data rate 4 Mbit/s
light current
General: Current which flows through a device
due to irradiation/illumination
base current
base peak current
collector current
collector light current
Collector current under irradiation
Collector current which flows at a specified illumination/irradiation
collector dark current, with open base
Collector-emitter dark current
For radiant sensitive devices with open base
and without illumination/radiation
(E = 0)
repetitive peak collector current
Mode of operation where the device (e.g. a
transceiver) is fully operational and expecting
to receive a signal for operation e.g in case of
a transceiver waiting to receive an optical input
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32
lm
lx
m
d)
v
= -------------------------------- ,
dA cos T d :
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33
2Ssr
L e cos T d :
Unit: W m-2
MIR Medium speed IR, as SIR, with the data rate
576 kbit/s to 1152 kbit/s
Mode Electrical input or output port of a transceiver
device to set the receiver bandwidth
N.A. Numerical Aperture
N.A. = sin D/2
Term used for the characteristic of sensitivity or
intensity angles of fiber optics and objectives
NEP Noise Equivalent Power
Ptot total power dissipation
Pv
power dissipation, general
Radiation and Light
visible radiation
Any optical radiation capable of causing a
visual sensation directly.
Note: There are no precise limits for the spectral range of visible radiation since they depend
upon the amount of radiant power reaching the
retina and the responsivity of the observer. The
lower limit is generally taken between 360 nm
and 400 nm and the upper limit between
760 nm and 830 nm
Radiation and Light
optical radiation
Electromagnetic radiation at wavelengths
between the region of transition to X-rays
( O = 1 nm) and the region of transition to radio
waves ( O = 1 mm)
Radiation and Light IR
infrared radiation
Optical radiation for which the wavelengths are
longer than those for visible radiation. Note:
For infrared radiation, the range between
780 nm and 1 mm is commonly sub-divided
into: IR-A 780 nm to 1400 nm
IR-B 1.4 m to 3 m
IR-C 3 m to 1 mm
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34
RD
RF
Ri
Ris
RL
RS
Rsh
dark resistance
feedback resistor
internal resistance
isolation resistance
load resistance
serial resistance
shunt resistance
The shunt resistance of a detector diode is the
dynamic resistance of the diode at zero bias.
Typically it is measured at a voltage of 10 mV
forward or reverse, or peak-to-peak
RthJA thermal resistance, junction to ambient
RthJC thermal resistance, junction to case
RXD electrical data output port of a transceiver
device
s
second
SI unit of time 1 h = 60 min = 3600 s
S
absolute sensitivity
Ratio of the output value Y of a radiant-sensitive device to the input value X of a physical
quantity: S = Y/X
Units: E.g. A/lx, A/W, A/(W/m2)
s(Op) spectral sensitivity at a wavelength Op
s(O) absolute spectral sensitivity at a wavelength O
The ratio of the output quantity y to the radiant
input quantity x in the range of wavelengths
O to O +'O:
s(O) = dy(O)/dx(O).
E.g., the radiant power )e(O) at a specified
wavelength O falls on the radiationsensitive
area of a detector and generates a photocurrent Iph. s(O) is the ratio between the generated
photocurrent Iph and the radiant power )e(O)
which falls on the detector:
s(O) = Iph / )e(O)
Unit: A/W
s(O)rel spectral sensitivity, relative
Ratio of the spectral sensitivity s(O) at any considered wavelength to the spectral sensitivity
s(O0) at a certain wavelength O0 taken as a reference:
s(O)rel = s(O)/s(O0)
s(O0) spectral sensitivity at a reference wavelength O0
SC Electrical input port of a transceiver device to
set the receiver sensitivity
SD Electrical input port of a transceiver device to
shut down the transceiver
shutdown
Mode of operation where a device is switched
to a sleep mode (shut down) by an external signal or after a quiescent period keeping some
Document Number: 82512
Rev. 1.4, 06-Oct-06
t
Tamb
Tamb
TC
TC
Tcase
td
tf
Tj
toff
ton
tp
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35
)v = Km
f d)
eO
V( O d O
0 -------------dO
O
Oc
wavelength, general
centroid wavelength
Centroid wavelength Oc of a spectral distribution, which is calculated as "centre of gravity
wavelength" according to
O2
O2
Oc =
O Sx ( O d O e Sx ( O d O
O1
OD
Op
O1
dominant wavelength
wavelength of peak sensitivity or peak emission
d )e O
where -------------- is the spectral distribution of
dO
the radiant flux and V(O) is the spectral luminous efficiency.
Unit : lm
lm: lumen
Km = 683 lm/W:
Note: For the values of Km (photopic vision)
and K'm (scotopic vision), see IEC60050
(845-01-56).
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37
= 4 sr
= 65.5
= 1.0sr
= 2 arc cos ( 1 / 2 )
= 20.5
= 0.01sr
= 0.1sr
= 6.5
94 8584
Definitions
Databook Nomenclature
The nomenclature and usage of symbols, abbreviations and terms inside the Vishay Semiconductors
IRDC Databook is based on ISO and IEC standards.
The special optoelectronic terms and definitions are
referring to the IEC Multilingual Dictionary (Electricity,
Electronics and Telecommunications), Fourth edition
(2001-01), IEC50 (Now: IEC60050). The references
are taken from the current editions of IEC60050
(845), IEC60747-5-1 and IEC60747-5-2. Measurement conditions are based on IEC and other international standards and especially guided by
IEC60747-5-3.
Editorial notes: Due to typographical limitations variables cannot be printed in an italics format, which is
usually mandatory. Our databook in general is using
American spelling (AE). International standards are
www.vishay.com
38
In general, optical radiation is measured in radiometric units. Luminous (photometric) units are used when
optical radiation is weighted by the sensitivity of the
human eye, correctly spoken, by the CIE standard
photometric observer (Ideal observer having a relative spectral responsivity curve that conforms to the
V(O) function for photopic vision or to the V'(O) function for scotopic vision, and that complies with the
summation law implied in the definition of luminous
flux).
Note: With a given spectral distribution of a radiometric quantity the equivalent photometric quantity can
be evaluated. However, from photometric units without knowing the radiometric spectral distribution in
general one cannot recover the radiometric quantities.
Radiometric Terms, Quantities and Units
Photometric
Term
Equivalent Radiometric
Term
Radiometric Term
Symbol
Unit
Reference
Radiant power,
Radiant flux
)e
IEC50 (845-01-24)
Radiant intensity
Ie
W/sr
IEC50 (845-01-30)
Irradiance
Ee
W/m2
IEC50 (845-01-37)
Radiant Exitance
Me
W/m2
IEC50 (845-01-47)
Radiance
Le
W/(srm2)
IEC50 (845-01-34)
Symbol
Unit
Reference
)v: IEC50 (845-01-25)
Luminous power
or
Luminous flux
Radiant power
or
Radiant flux )e
)v
lm
Luminous intensity
Radiant intensity Ie
Iv
lm/sr = cd
Illuminance
Irradiance Ee
Ev
lm/m2 = lx (Lux)
Luminous exitance
Radiant exitance Me
Mv
lm/m2
IEC50 (845-01-48)
Luminance
Radiance Le
Lv
cd/m2
IEC50 (845-01-35)
9 m2
4
m2
1 m2
1m
2m
3m
18145
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39
Examples
1. Calculate the irradiance with given intensity and
distance r:
Transceivers with specified intensity of
Ie = 100 mW/sr will generate in a distance of 1 m an
irradiance of Ee = 100/12 = 100 mW/m2. In a distance
of 10 m the irradiance would be
Ee = 100/102 = 1 mW/m2.
2. Calculate the range of a system with given intensity
and irradiance threshold.
When the receiver is specified with a sensitivity
threshold irradiance Ee = 20 mW/m2, the transmitter
with an intensity Ie = 120 mW/sr the resulting range
can be calculated as
r =
www.vishay.com
40
Ie
=
-----Ee
120
---------- =
20
6 = 2.45 m
Description
Besides the static (dc) and dynamic (ac) characteristics, a family of curves is given for specified operating
conditions. Here, the typical independence of individual characteristics is shown.
Additional Information
Preliminary specifications
This heading indicates that some information given
here may be subject to changes.
Not for new developments
This heading indicates that the device concerned
should not be used in equipment under development.
The device is, however, available for present production.
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41
e2
e3
Sn
e4
e5
e6
contains Bi
e7
e0, e8, e9
Origin
Machine (CPU) number
QA acceptance seal
Device type
Date code
Lot number
Quantity
Remark: Multi - Date Codes would be marked in the QA field of this label on top of the lead
Terminations
lead (Pb)-free designed
19874
ESD
Totally
lead (Pb)-free designed
19877
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42
Moisture Level
Sticker
BarCode
ESD Sticker
Label
Aluminum bag
Box
19880
Reel
18298
19881
19878
19879
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43
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
LEVEL
Figure 12. 330-mm reel with labels. No labels on the rear. Lead
(Pb)-free information is on the barcode label.
Final Packing
The sealed reel is packed into a cardboard box, which
is 334 x 335 x 40 mm3 in size. A secondary cardboard
box is used for shipping purposes, with the following
sizes, slightly different for different production locations, see the following tables.
Table 2. Secondary boxes Malaysia,
location code 68
Size, Length x Width x Height
mm x mm x mm
Quantity of boxes
360 x 360 x 45
16
26
30
60
Quantity of boxes
11
20
19889
Figure 11. 180-mm reel with labels. No labels on the rear. Lead
(Pb)-free marking is not on the barcode; here an additional lead
(Pb)-free sticker is applied.
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44
ESD Precaution
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices especially when these are removed from the Antistatic
Shielding Bag. ElectroStatic Sensitive Deviceswarning labels (figure 6) are affixed on the packaging.
Order Information, Related Packing Units, Tape and Reel Size and Labeling
In this document the packing and labeling information for IR transceivers is compiled.
Part
Description
Quantity / Reel
Orientation in tape for mounting
pcs
TFBS4650-TR1
Side view
1000
TFBS4650-TR3
Side view
2500
TFBS4652-TR1
Side view
1000
TFBS4652-TR3
Side view
2500
TFBS5700-TR3
Side view
2500
TFBS4711-TR1
Side view
1000
TFBS4711-TR3
Side view
2500
TFBS5711-TR1
Side view
1000
TFBS5711-TR3
Side view
2500
TFBS6711-TR1
Side view
1000
TFBS6711-TR3
Side view
2500
TFBS6712-TR1
Side view
1000
TFBS6712-TR3
Side view
2500
TFDU4300-TR1
Side view
750
TFDU4300-TR3
Side view
2500
TFDU4300-TT1
Top view
750
TFDU4300-TT3
Top view
2500
TFDU5307-TR1
Side view
750
TFDU5307-TR3
Side view
2500
TFDU5307-TT1
Top view
750
TFDU5307-TT3
Top view
2500
TFDU6300-TR3
Side view
2500
TFDU6300-TT3
Top view
2500
TFDU6301-TR3
Side view
2500
TFDU6301-TT3
Top view
2500
TFBS4710-TR1
Side view
1000
TFBS6614-TR3
Side view
2500
TFDU2201-TR1
Side view
750
TFDU2201-TR3
Side view
2250
TFDU4202-TR1
Side view
750
TFDU4202-TR3
Side view
2250
TFDU4203-TR1
Side view
750
TFDU4203-TR3
Side view
2250
TFDU4100-TR3
Side view
1000
TFDU4100-TT3
Top view
1000
TFDU6102-TR3
Side view
1000
TFDU6102-TT3
Top view
1000
TFDU8108-TR3
Side view
1000
TFDU8108-TT3
Top view
1000
TOIM4232
Top view
500
Table1. Transceiver tape drawing and reel size reference according to type order text
Document Number: 82601
Rev. 1.7, 20-Sep-06
Tape
Figure-No
14
14
14
14
14
15
15
15
15
15
15
15
15
16
16
17
17
16
16
17
17
16
17
16
17
18
18
19
19
19
19
19
19
20
21
20
21
20
21
22
Reel
Reel No in Reel Table
1
2
1
2
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
2
2
2
2
2
2
1
2
1
2
1
2
3
3
3
3
3
3
2
www.vishay.com
45
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape
Tape Width
A max.
W1 min.
W2 max.
W3 min.
Reel
mm
mm
mm
mm.
mm
mm
W3 max.
mm
#1
16
180
60
16.4
22.4
15.9
19.4
#2
16
330
50
16.4
22.4
15.9
19.4
#3
24
330
60
24.4
30.4
23.9
27.4
Leader
devices
no devices
End
Start
min. 200
min. 400
Trailer
Leader
96 11818
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46
19867
Drawing-No.: 9.700-5296.01-4
Issue: 1; 08.12.04
Figure 14. Tape for 1.6 - mm package side view oriented
19868
Drawing-No.: 9.700-5294.01-4
Issue: 1; 08.12.04
Figure 15. Tape for 1.9 - mm package side view oriented
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47
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
Figure 16. Tape for 2.5 - mm package side view oriented
19855
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
Figure 17. Tape for 2.5 - mm package top view oriented
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48
19869
Drawing-No.: 9.700-5299.01-4
Issue: 1; 18.08.05
Figure 18. Tape for 2.74 - mm package side view oriented
19870
Drawing-No.: 9.700-5227.01-4
Issue: 3; 03.09.99
Figure 19. Tape for 2.75 - mm package side view oriented
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49
19871
Drawing-No.: 9.700-5297.01-4
Issue: 1; 08.04.05
Figure 20. Tape for 4.0 - mm package side view oriented
19872
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Figure 21. Tape for 4.0 - mm package top view oriented
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50
19876
Drawing-No.: 9.700-5284.01-4
Issue: 1; 24.07.03
Figure 22. Tape for SO - 16 package top view oriented
Package
2: no specific
Selection Vishay Year
Type
4: 115 kbit/s, SIR
Work week
Manufacturing
5: 1 Mbit/s, MIR
location
0:
Standard,
SMD
6: 4 Mbit/s, FIR
3:
DIL,
Through
Hole
7: RC - Receiver added
Note: V and XX are optional and
8: 16 Mbit/s, VFIR
can be omitted when the space
for marking is limited
1: 4 mm (leadframe)
2: 2.75 mm (leadframe)
Example:
3: 2.5 mm (leadframe)
The marking 4650V61268
6: PCB-based
identifies a
7:
PCB-based,
6
pin
17273-1
TFBS4650, produced by Vishay
in week 12 of year 2006 at the
location 68 (Krubong, Malaysia)
www.vishay.com
51
www.vishay.com
52
18052 1
18053_1
Table 1
Characteristics
Optical Properties
IC Mold Compound
Light Blocking
Transparent
High
Low (brittle)
Hardness
Coefficient of thermal expansion
Glass transition temperature
High
High (160 C)
Thermal conductivity
High
Low
Moisture ingress
Low
High
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53
Reflow Soldering
Vishay Semiconductor transceivers are surface
mount devices and are designed to be assembled to
printed circuit boards (PCB) using reflow soldering.
State of the art for reflow soldering is the use of a
so-called convection reflow oven.
Recommendations for reflow conditions can only be
given in general terms since each PCB should be
considered individually depending on the size and
distribution of components. Because IrDA transceivwww.vishay.com
54
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab
use. However, for a production process it cannot be
recommended because the risk of damage is quite
highly depending on the experience of the operator.
Nevertheless, we added a chapter, describing manual soldering and desoldering. Before soldering or
desoldering be sure that the devices (or boards) are
correctly dried corresponding to given MSL-condition. See the equivalent standard JEDEC J-STD033A, "Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices".
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4 if not otherwise specified in the data
sheet.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
275
T 255 C for 10 s....30 s
250
225
Tpeak = 260 C
Temperature/C
200
175
150
30 s max.
125
90 s...120 s
100
70 s max.
2 C...4 C/s
75
2 C...3 C/s
50
25
0
0
50
100
150
200
250
300
350
Time/s
19693
260
240
220
Temperature/C
< 4 C/s
160
1.3 C/s
140
120
200
180
100
80
60
40
20
0
0
50
100
19694
150
200
250
300
Time/s
www.vishay.com
55
18272
18270
Step 1:
Start with one pad only and get some solder on it.
18271
Step 2:
Place the transceiver at its appropriate position
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56
Step 3:
Solder the lead to lead pad prepared in step 1
18273
Step 4:
Solder quickly and skillfully the remaining leads
18274
18276
18275
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57
w
(mm)
h
(mm)
9.7
4.0
8.5
2.5
6.2
2.0
7.0
1.7
5.7
2.7
Window
15
d2
x
15
18062-1
15
15
Window
d1
x
18063-1
Window
15
15
15
Window
d2
d1
x
18061-1
15
18064-1
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58
Recessed window
avoiding scratches
Recessed transceiver
is recommended to
shield against ambient
(sun)light
15
Figure 5.
15 810
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59
Software
Microsoft Corporation
IrDA is supported by Windows 95 Windows 98,
Windows NT, Win CEWindows 2000,
Windows XPand Palm PCplatforms.
IrDA device drivers are either already included in the
software package or can be downloaded from the
Microsoft website.
One Microsoft Way, 5/2153
Redmond, WA 980526399, USA
http://www.microsoft.com
www.vishay.com
60
ACTiSYS
ACTiSYS Corp has been a leading supplier of Infrared wireless IrDA and ASKIR protocol software and
adapters for 115.2 kbit/s and 4 Mbit/s since 1990.
ACTiSYS also provides test software and hardware
for IRDA compatibility testing.
ACTiSYS
48511 Warm Springs Blvd., Suite #206
Fremont, CA 94539
USA
Phone: +1 510-490-8024
http://www.actisys.com
Laplink Software
Laplink Software Inc.
10210 NE Points Drive, Suite 400
Kirkland, WA 98033, USA
Phone: +1 425 952-6000
Fax: +1 425 952-6002
http://www.travsoft.com/
Korea
In our products we use polycarbonate (PC) and polymethylmethacrylate (PMMA) for optical window and
as filter material. Therefore we recommend these
materials and list some sources.
www.bayer.co.kr
Polycarbonate (PC)
PC is available under many different trade names and
supplied by many manufacturers and distributors. A
comprehensive list can be found at
http://www.matweb.com/reference/polycarbonate
mfr.asp
Some product names of PC material
Product
Calibre
Durolon
Enduran
Jupilon
Lexan
Lupoy
Makrolon
Wonderlite
Manufacturer
DOW
Policarbonatos do Brasil
GE
Mitsubishi
GE
LG Chemical
Bayer
Chi Mei
GERMANY
Bayer MaterialScience AG
RSC EMEA
Leverkusen, Deutschland
www.bayerplastics.com
www.vishay.com
61
Manufacturer
Cyro
Chi Mei
Chi Mei
Atoglas
Degussa-Rhm
Lucite
Arkema (Atoglas)
Degussa-Rhm
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62
Cyro Industries
Cyro is the North American arm of the Rhm/Degussa
group
Technical Service
Orange, Conn. 06477
Phone: +1 203 799-4066
www.cyro.com
For Europe see
www.degussa.com
Polycast Technology Corporation
70 Carlisle PI Ste 1
Stamford, CT 06902-7630
Phone: +1 203 327 6010
Distributors (USA)
Calsak Corporation
200 W. Artesia Blvd.
Compton, CA 90220
Phone: (800) 743-2595
+1 310 637-2000
Fax: +1 310 637-3696
E-mail: calsak@calsak.com
www.calsakpolymers.com
Plastic Sales Incorporated
849 W. 18th St.
Costa Mesa, Calif. 92627
Phone: +1 714 645-6860
Regal Plastics
Southern Region
2356 Merrell Road
Dallas, TX 75229
Phone: +1 972 484-0741 or (800) 441-1553
Fax: +1 972 484-0746
Specialty Manufacturing Inc.
6790 Nancy Ridge Dr.
San Diego, CA 92121-2230
Phone: +1 858 450-1591
Phone: 800 491-1652
Fax: +1 858 450-0400
European Headquarters
National Semiconductor Corporation
Livry-Gargan-Str. 10
82256 Frstenfeldbruck
Germany
+49 (0) 81 41 35-0
europe.support@nsc.com
Deutsch: +49 (0) 69 9508 6208
English: +44 (0) 870 240 21 71
Francais: +33 (0) 141 91 87 90
www.vishay.com
63
AMD
One AMD Place
P. O. Box 3453
Sunnyvale, CA 940883453, USA
Phone: +1 408 7494000
www.amd.com
Motorola
Motorola manufactures a wide variety of microprocessors suitable for embedded and hosted applications
that contain builtin support for IrDA. Many of their
microprocessors can be connected to industry typical
IrDA transceivers directly, without any interface support electronics. In support of the processors, Motorola provides IrDA software implementing the full IrDA
stack.
Motorola
6501 William Cannon Drive West
Austin, Texas 78735, USA
http://www.mot.com
Philips Semiconductors
Philips Semiconductors provides the TwoChipPICTM
and TwoChipPIC PlusTM, dual 32-bit enhanced
MIPS RISC chipsets which provide integrated solutions for Personal Digital Assistants (PDAs), Personal
Intelligent Communicators (PICs), and Handheld PCs
(H/PCs) for WindowsCETM.
www.philips.com
www.vishay.com
64
ACTiSYS Corp.
48511 Warm Springs Blvd., Suite 206,
Fremont, CA 94539, USA
Tel: (510)490-8024
Fax: (510)623-7268
www.actisys.com
Contact: Dr. Keming Yeh at kyeh@actisys.com
Testing Type: IrReady
ACTiSYS (Asia) Corp.
3rd Floor, #12, Prosperity 2nd Rd.,
Science Park, Hsin-Chu City, Taiwan
Tel: +886-3-578-5161
Fax: +886-3-578-5164
Contact:
Lawrence Yang at lawrence.yang@actisys.com.tw
Testing Type: IrReady
Couleur Communication Ecriture CCE, France
Immeuble Grenat,
3 av. Doyen Louis Weil,
38000 Grenoble, France
Tel: +33 4 76 48 86 30
Fax: +33 4 76 96 41 79
Web: www.affixcce.com
Contact:
Mr. Serge Veyres, Director at contact@affixcce.com
Testing Type: IrReady
OPEN INTERFACE, INC.
2-15-12 Shinyokohama Kouhoku-ku,
Yokohama-city,
Kanagawa, 222-0033 Japan
Tel: +81-45-476-3900
Fax: +81-45-476-3689
Web: www.oii.co.jp
Contact:
Mr.Tatsuo Iwasaki,
Director of Technical Dept. 1 at tiwasaki@oii.co.jp
Ms.Kayoko Yamanashi,
Groupe Manager of IrDA
Groupe Testing Solution Center at
kyamanashi@oii.co.jp
Testing Type: IrReady, IrFM
www.vishay.com
65
www.vishay.com
66
www.vishay.com
67
Diode Emitters: Semiconductor devices with diode characteristic emitting radiation such as LDs(laser diodes), IREDs or LEDs
IRED: Infrared Emitting Diode. It is common but not correct to use the term LED also for Infrared Emitting Diodes
LED: Light Emitting Diode, this term is used also for IR emitting diodes
4)
Copyright 2000 Health Physics Society. Copies are available from the Internet at: http://www.icnirp.org/documents/led.pdf
5) Copies are available from the Internet at: http://www.fda.gov/cdrh/comp/guidance/1346.html
2)
3)
www.vishay.com
68
70
70
Transmit Distance...............................................................................................................................
71
Test Results.........................................................................................................................................
75
76
77
Application Examples.........................................................................................................................
78
www.vishay.com
69
Teaching
18802
Figure 1.
R2 = 2.7
(optional)
Vcc
Transceiver
LEDA (1)
LEDC (2)
IRTXD/UART/GPIO
TXD (3)
IRRXD/GPIO
RXD (4)
GPIO[X]
SD (5)
Vcc (6)
R1 = 22
GND
C = 200 nF
Transmit Distance
Factors Influencing Transmit Distance
This section provides a detailed description of factors
influencing transmit distance:
Wavelength of emitter and detector
Optical intensity of the emitter
Receiver Sensitivity
Frequency of the emitter and detector.
Operating Range
The primary factors in the theoretical distance calculation are radiant intensity of the emitter (Ie in mW/sr)
and sensitivity of the receiver (given as minimum or
threshold irradiance Eemin in mW/m). Calculating
transmission distance in the simplest case assumes a
square-law relationship between distance d and irradiance Eemin on the receiver. Shown below is the calculation using a receiver sensitivity of
Eemin = 0.4 m W/m2 and an intensity of Ie = 40 mW/sr.
The distance d is resulting as
Vlogic (7)
GND (8)
d =
18803
Intensity
--------------------------- =
Sensitivity
Ie
-------------- =
E emin
40
-------- = 10 m
0.4
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
750
800
850
900
950
Wavelenght (nm)
1000
1050
1100
17225
Ie
E emin = ----2
d
d =
Ie
-------------E emin
1
E emin IrDA = E emin CIR u ----Rf
Ie
E emin CIR = --------------------2
d CIR
E emin IrDA
1
Rf
e
= E emin CIR u ----- = ----------------------2
d IrDA
Rf
e
u ------------------------------- =
d IrDA
Rf
u d CIR
E emin CIR
d IrDA
Rf
u d CIR
E.g. in Figure 6,
R f = 0.79 ,
www.vishay.com
72
Rf =
0.79 = 0.89
Vishay Semiconductors
1.2
1.0
0.8
0.6
0.4
0.2
0
750
850
950
1050
Wavelength (nm)
17229
1150
80
60
40
20
0
600
700
17232
800
Wavelength (nm)
1.2
1.0
0.8
250
0.6
200
0.4
0.2
0
750
17230
850
950
1050
Wavelength (nm)
1150
Intensity (mW/sr)
Relative Sensitivity S (% )
100
Optical Intensity
As already described, remote control transmit distance is a function of emitter intensity. Transmit distance increases as the intensity of the emitter diode
increases. Vishay lab results indicate that to transmit
over a distance of 10 meters, the minimum intensity of
the 880-nm emitter should be 70 mW/sr. Most lowpower IrDA transceivers have a LED intensity of less
than 9 mW/sr, woefully inadequate to be used for
remote control function.
The intensity of the emitter depends on its peak current and efficiency. The peak current can be controlled by using a serial, current-limiting resistor. By
reducing the value of the resistor, the LED peak current will increase which increases the intensity. Each
IrDA transceiver, however, has a limit or maximum
intensity. For example, the TFDU6102, the worlds
leading FIR transceiver, has a peak current of typically 550 mA and typical intensity of 170 mW/sr (max.
350 mW/sr). Similarly, the TFDU4300 peak current
and resulting intensity are typically 300 mA and
65 mW/sr.
While the TFDU6102 does not require a current limiting resistor, figure 6 shows the dependence of intensity on the value of the serial resistor for randomly
selected transceivers. The serial resistor may be
used to reduce the internal power dissipation or to
reduce the current consumption with resulting lower
intensity. Note that these curves are for a few transceivers only. Single devices may deviate from average or normal behavior due to device parameter
tolerances.
150
100
50
0
18807
Rled (Ohm)
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73
Battery Charge
A weakly charged battery causes a drop in the
strength of the emitted signal, particularly the beginning of the signal. In the following two diagrams (see
figure 8 and 9) the effect of charging state of the battery is shown. This drop at the beginning of the signal
may reduce the efficiency of the gain control of the
receiver, requiring longer response times or repeating
of the signal. Note that this is not RC-5 code. This
code provides a long header to allow the receiver to
adjust gain but with a weak battery the header is
dropped.
1.0
0.8
18808
0.6
0.4
0.2
f = f0 5 %
f ( 3 dB ) = f0/10
0.0
0.7
94 8143
0.8
0.9
1.0
1.1
1.2
1.3
18809
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74
Remote Control
IrDA Transceivers
Emitter
Part Number
MIR
FIR
Vishay
Vishay
Vishay
Vishay
Vishay
TSAL6400
TFDU4100
TFDU4300
TFDU5307
TFDU6614
100
100
300
420
550
Intensity (mW/sr)
41
48
145
235
110
940
886
886
886
886
RC Receivers
Vishay TSOP1238
19
11
20
25
17
Panasonic PNA4612
11
13
17
11
Vishay TSOP4838
25
22
39
> 42
34
The signal was generated using a Philips remote control transmitter, Figure 10 and Figure 11 and Philips
RC5 code with a modified carrier frequency of
38 kHz with a pulse width of 9 s.
+3V
200 F
DUT
Button Array
Philips
Remote
Control
DUT
17226
17227
Since carrier frequency has no influence on the optical matching of transmitter to receiver, the collected
data can be transferred to any other carrier frequency
system. This remote control transmitter generated a
digital signal. The signal is fed to an IRED driver transistor. When testing IrDA transceivers with internal
current controllers, the signal from the remote control
was directly fed to the TXD input of the transceiver.
For transceivers without internal current controllers, a
serial resistor was used to generate constant current
signal during the pulse. The transmitter supply voltage was set to 3 V.
With the different receivers listed in the tables a Philips decoder SAA3049 was used, see the circuit diagram in Figure 12.
Document Number 82606
Rev. 1.6, 20-Sep-06
+5V
100
Data
10 F
Adress
Toggle
Remote
Control
Receiver
17228
SAA3049 5 V
4 MHz
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75
Table 1: Expected Minimum RC Range under Standardized IrDA Conditions (Wavelength > 880 nm)
Wavelength > 880 nm
Min Intensity
Ie
RC Range
[mW/sr]
[m]
VFIR/FIR/MIR Standard
100
12.0
50
8.5
25
6.0
VFIR/FIR/MIR LowPower
3.6
SIR Standard
40
7.6
20
5.3
10
3.8
SIR LowPower
3.6
2.3
RC Range [m]
Remark
TFDU4100
14.1
TFDU6102
20.0
at 550 mA
TFDU8108
20.0
at 550 mA
TFBS4710
12.5
TFBS6614
18.2
at 3.3 V, R = 0 Ohm
TFDU5307
18.1
TFDU4300
10.5
TFBS4711
9.3
TFBS6711
12.8
TFBS5700
9.3
TFBS4650/4652
9.3
TFBS4650/4652
3.8
TFDU4202
14.6
TFDU4203
14.6
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76
114 ms
Data
24.9 ms
Bit length 1.78 ms
Example
of a data word
2 start
bit
1
toggle
bit
5
address
bit
6 data
bit
27.8 s
Burst
(half bit)
The RC5 - code has an instruction set of 2048 different instructions and is divided into 32 addresses
(5 bits) of each 64 instructions or commands (6 bits).
Each remote controlled device has its own address,
making it possible to change the volume of the TV
without changing the volume of the CD player. The
transmitted code is a data word that consists of 14 bits
and is defined as:
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77
19896
The pin numbers are related to the VISHAY transceiver TFDU4300. Depending on the demand also
TFBS4650, TFBS4652, or other SIR transceivers can
be used, the pin numbering may be different in that
case.
19897
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78
19898
Name
Description
00
GP47
01
TXD
10
ICP_TXD
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79
Interface Circuits
Vishay Semiconductors
Interface Circuits
Interfacing SIR transceivers to an RS232
port
A quite common method of adding the IrDA capability
to a desktop computer is the usage of a so-called dongle connected to the COM - port (RS232 - port). This
connectivity is currently available at any desktop or
laptop computer but in future will be replaced by the
USB port.
For interfacing the SIR frontend transceivers (4000
series) as for other SIR transceivers an Encoder/
Decoder device (TOIM4232) is necessary to provide
the NRZ to RZI conversion. This device also provides
the clock generator and can be programmed by a set
of (8 bit-) commands. Drivers for the RS232 connector with TOIM4232 are provided by Microsoft (R) with
the Operating Systems. The block diagram of a dongle connection to RS232 is shown in figure 1.
RS232 9 pin
connector
Level
converter
SIR
transceiver
TOIM4232
Pin4, DTR
RESET
Pin7, RTS
BR/D
VCC_SD
TD_IR
TxD
Pin3, TxD
TD_UART
RD_IR
RxD
Pin2, RxD
RD_UART
X1
18046-1
VCC
X2
3.6842 MHz
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80
Interface Circuits
Vishay Semiconductors
Interfacing MIR and FIR transceivers with
SMSC Infrared Controllers
Standard Microsystems Corporation SMC has developed a variety of new Advance and Ultra I/Os. Typical
representatives of the new controllers are the
FDC37C669FR and the FDC37C93XFR. Application
notes describing how to use the Vishay Semiconduc-
Application Examples
16506
C3
VCC
R2
2 :
R1
50 :
6.8 PF
VCC
IRRX1
38
NSC87108
IRED
Cathode
IRSLO
IRTX
Rxd
Txd
37
TFDU6102
39
Vcc2, IRED
Anode
Vcc1
SD
GND
Mode
5
7
GND
GND
C1
C2
470 nF
6.8 PF
Recommended Values
Vishay Part #
R1
50 :
CRCW120650R00FRT1
R2
2:
CRCW12062R00FRT1
C1
470 nF
VJ1206Y474JXXMT
C2, C3
6.8 PF
293D685X9016B2T
16507
VCC
R2
2:
R1
50 :
VCC
IRRX1
67
PC87338VLJ
IRSLO
4
68
IRED
Cathode
65
TXD
RXD
TFDU6102
IRTX
Vcc2,IRED
Anode
Vcc1
SD
GND
Mode
5
7
GND
GND
C1
C2
470 nF
6.8 PF
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81
Interface Circuits
Vishay Semiconductors
Comp.#
Recommended Values
Vishay Part #
R1
50 :
CRCW120650R00FRT1
R2
2:
CRCW12062R00FRT1
C1
470 nF
VJ1206Y474JXXMT
C2
6.8 F
293D685X9016B2T
MAX3232CSE
1
C+
+ C3
3
4
VCC
TOIMx232
16
1
U1
C1-
V+
C2+
V-
C5
+
C7
+
2
3
C6
+ C4
4
+
C2-
GND
15
5
6
11
10
12
9
T1IN
T2IN
R1OUT
R2OUT
T1OUT
T2OUT
R1IN
R2IN
14
7
13
8
7
8
Reset
Vcc
U2
BR/Data
RD IR
RD 232
TD IR
TD 232
S2
V CC SD
S1
X1
NC
X2
RD LED
GND
TD LED
C10
16
2
+
15
R4
R6
TFDU4100
C11
14
13
IRED
Cathode
RXD
VCC1
IRED
Anode
U4
GND
TXD
NC
SC
1
3
5
7
12
11
10
9
J1
1
6
2
7
3
8
4
9
5
RXD
RTS (BR/D)
TXD
R1
DTR (Reset)
VCC
Y1
Z2
CON9
ext.
input max
3.3 V DC
J2
1
2
C1
R2
+ C2
C8
CON2
C9
16527
Figure 4. Application circuit using TFDU4300 with an integrated level shifter MAX3232E.
When used directly with 3 V logic, this one can be omitted
For the component list see the TOIM4232 data sheet.
Power
STIR4230
Host Controller
Control Signals
24.00 MHz
crystal
TFDU8108
SPI
Transceiver
19817
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82
RESET_B
INT
SPI_SSn
SPI_MOSI
SPI_MISO
SPI_SCK
3.3V_Supply
BATT
1.8V_Supply
VDD
VDDIO
V_IR
R1
47K
GND
16
15
VDD
VSS1
INT
C1
22pF
STIR4230N
GND
C2
22pF
IR_RX
IR_SCLK
VDDIO
VSS2
D1
LED
R4
220 Ohm
VDDIO
24.000MHz
Y1
SPI_SSn
GND
C3
0.1uF
VDD
14
13
U1
12
SPI_MOSI
GND
GND
C4
0.1uF
VDDIO
V_IR
GND
C5
10uF
GND
C6
0.1uF
C7
0.1uF
Date:
Size
B
Page
Title
GND
IRED Anode
TOP VIEW
8
7
6
5
4
3
2
1
TFDU8108
Sheet
of
STIR4230 - Battery IR
Rev
B
GND
GND
C8
4.7uF
SigmaTel, Inc.
U2
TFDU8108
IRED Cathode
Txd
Rxd
SCLK
R2
10 Ohm
R3
4.7 Ohm
VDDIO
6
VCC
XTAL_OUT
2
XTAL_IN
1
11
SPI_MISO
10
SPI_SCK
9
LED_OUT
IR_TX
4
RESET_B
3
7
Vlogic
VDD
Interface Circuits
Vishay Semiconductors
19818
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83
Interface Circuits
Vishay Semiconductors
Remarks to the circuit shown in figure 6, STIR4230 16-Pin 4 x 4 mm QFN Reference design.
1) VDD is the core supply for the 4230. Connect to the host systems 1.8 V supply.
2) VDDIO is the I/O supply for the 4230 and must be connected to the I/O supply used by the host processor
and IR transceiver to ensure proper logic levels.
VDDIO can be either 3.3 V or 1.8 V.
3) The integrity of the SPI_MOSI, SPI_MISO, and SPI_SCK signals are critical to the proper operation of the
4230. Use proper high speed layout techniques for these signals. Use signal paths that are as short and clean
as possible. Introducing a delay of even a few nanoseconds can be enough to prevent full speed operation of
the SPI bus and must be avoided.
4) While transmitting, the IR transceiver will consume large amounts of power and cause large current spikes
on the supply and ground planes. Peak currents of over 500 mA are common for devices that transmit 1 m.
Attention must be paid to power and ground layout as well as supply bypassing to prevent issues related to
excessive ground bounce or power supply ripple. In some circumstances R2, C5 and C6 can be used to help
isolate the transmit diode from the rest of the system. The optimum values for R2 and C5 depend on several
factors and will be unique to each design.
5) The supply used for the transmit diode (V_IR) must be above 2.7 V. The transmit diode does not require a
regulated supply, and for systems with battery voltages that are between 2.7 V and 5.5 V, can be powered from
the battery. If the supply voltage is above 4 V, a series resistor may be needed to limit the amount of power
dissipated inside the IR transceiver.
6) Place bypassing caps as close as possible to the ICs power and ground pins. For U1, place C3 close to
pins 15 and 16 and C4 close to pins 7 and 8. For U2, place C7 as close as possible to pins 6 and 7.
7) Place Y1 close to the STIR430.
8) The DAP (die attachpad) is not needed either electrically or thermally and attaching it to the PC board is not
required. However, attaching the DAP provides additional mechanical support and may improve self allignment.
www.vishay.com
84
Interface Circuits
Vishay Semiconductors
List of some I/O Controllers and Interfaces Supporting IR
(Remark: This list is not complete, there are other
suppliers such as IBM, ITC, VLSI, or Phoenix)
SC14428 Baseband Processor NSC
ADSP-BF531, 532 & 533 Embedded Processor
ANALOG DEVICES
ADSP-BF537 & 536 Embedded Processor
ANALOG DEVICES
ADSP-BF561 Embedded Processor
ANALOG DEVICES
Elan SC400 Microprocessor AMD
Elan SC520 Microprocessor AMD
Alchemy AU1000 & 1100 Microprocessor AMD
Geode SC Family Microprocessor AMD
Geode GX533 & GX500 Microprocessor AMD
Vr4100 Processor Family NEC
WV8307 VolP Chipset Agere Systems
BCM2121 GPRS/GSM Baseband Processor
BROADCOM
BCM2132 EDGE/GPRS/GSM Single-Chip
Multimedia BROADCOM
BCM2140 WCDMA (UTMS) FDD Baseband
Coprocessor BROADCOM
ML2011 GSM Single-Chip Baseband Processor
BROADCOM
BCM2702 Mobile Multimedia Processor
BROADCOM
AT76C713 Microcontroller ATMEL
EP9312 Embedded ARM Processor (Industrial
Applications) Cirrus Logic
EP7309 Embedded ARM Processor (Portable
Devices) Cirrus Logic
EP7311 Embedded ARM Processor (Industrial,
Mediacal) Cirrus Logic
EP9302 Embedded ARM Processor (Industrial &
Consumer) Cirrus Logic
EP7312 Embedded ARM Processor (Portables &
Handheld) Cirrus Logic
EP9315 Embedded ARM Processor (Industrial &
Consumer) Cirrus Logic
EP9301 Embedded ARM Processor (Industrial &
Consumer) Cirrus Logic
EP9307 Embedded ARM Processor (Portables &
Handheld) Cirrus Logic
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85
Interface Circuits
Vishay Semiconductors
STn88xx Multimedia Processor Product family
STMicroelectronics
USB2230 & USB2229 USB-IrDA Controller 4 Mbit/s
SMSC
MPC47N207 Super I/O UART SMSC
SIO1036 & SIO 1000 I/O UART SMSC
LPC47M10x & 47B272 Super I/O Controller
(consumer appl.) SMSC
LPC47M112 Enhanced Super I/O UART SMSC
LPC47M172 & 182 Advance I/O Controller SMSC
LPC47S45x Advance I/O Controller X-Bus SMSC
LPC47S42x Enhanced Super I/O Server Appl. SMSC
SCH5017 Super I/O SMSC
SCH3116, 3114 & 3112 Super I/O SMSC
SIO10N268 Advance Notebook I/O (ISA/LPC) SMSC
FDC37N3869 Super I/O Controller (Portable Applications) SMSC
FDC37M81x Enhanced Super I/O SMSC
FDC37M707 Super I/O SMSC
FDC37B72x & 78x Super I/O SMSC
FDC37C665GT & 66GT Super I/O SMSC
KBC1100 & KBC1100L Embedded Controller
(Mobile) SMSC
Note: The list of controllers is based on our research in the public literature. We dont claim that this list covers all available controllers. We
cannot guarantee the functionality of these controllers with transceivers. This must be verified for any special case.
www.vishay.com
86
JP1
1
IRED Anode
R2
Vlogic
Vlogic
V cc1
GND
V cc
R1
C1
C4
Ground
SD
SD
TXD
TXD
RXD
RXD
I R T ra ns c e ive r
V cc2
C1
R1
6
8
10
9
5
R2
C2
GND
GND
19706
R3
VCC
GND
RXD
GND
C3
GND
C4
GND
C5
Vlog. Mode or NC
SD
IRED
Cathode
IRED
Anode
RXD
TXD
Transceiver
VCC1
SD
GND
Vlog.
Mode
or NC
1
3
5
7
C6
R4 opt.
TXD
19707
Circuit description
The test board is using only one power supply voltage
VCC (at pin 1 of connector JP1, figure 2) for the transmitter and receiver. Another supply voltage is available for different logic voltages Vlog at JP1, pin 3
connected to pin 7 of the transceiver. The analog supply voltage VCC1 at pin 6 of the transceiver is connected to VCC via a low pass filter given by R1 and C3/C4.
Also C1/C2 contribute to smoothing and stabilizing
the voltage at pin 6, VCC1. The IRED anode is connected to the power supply via R2/R3 (two parallel
resistors for increased power dissipation). These re1
Note: This is an example for the 8 pin devices with 1-mm pitch. For other devices with different pitch and less pins equivalent boards are
also available.
www.vishay.com
87
Component
TFDU4300
Low Power mode
TFDU4100
Test board
C8P_5102
acc. figure 2
Application
acc. figure 1
C8P_5102
acc. figure 2
Application
acc. figure 1
U8-P_5002
acc. figure 2
R1
47 :
47 :
47 :
47 :
47 :
47 :
R2
0:
56 :
56 :
10 :
4.7 :
R3
open
open
R2/R3
0:
56 :
10 :
R4
0:
0:
5:
C1
10 F
10 F
10 F
C2
470 nF
470 nF
470 nF
C3
6.8 F
6.8 F
C4
470 nF
C5
C6
100 nF
Application
acc. figure 1
470 nF
100 nF
6.8 F
4.7 F
470 nF
100 nF
-
Remark: For component values in application circuits for volume production and other SIR transeivers see the relevant data sheets.
TFBS6614
TFDU6102
TFDU8108
Test board
C8P_5102
acc. figure 2
Application
acc. figure 1
C8P_5102
acc. figure 2
Application
acc. figure 1
U8-P_5002
acc. figure 2
Application
acc. figure 1
R1
10 : to 47 :
10 :
10 : to 47 :
10 :
4.7 :
4.7 :
R2
0:
0:
0:
0:
0:
0:
R3
R2/R3
0:
0:
0:
R4
0:
0:
0:
C1
10 F
10 F
10 F
C2
470 nF
470 nF
470 nF
C3
6.8 F
6.8 F
C4
470 nF
100 nF
470 nF
6.8 F
100 nF
220 nF
220 nF
C5
C6
470 nF
470 nF
470 nF
Function
Pin
Signal
Pin / Color
SD
9 / Blue
RX
7 / Green
www.vishay.com
88
TX
5 / Yellow
3 / Orange
VCC
1 / Red
GND
2, 4, 6, 8, 10 / White
VCC (opt.)
VCC (opt.)
GND
19711
19708
19709
19712
19710
19713
www.vishay.com
89
pin #2
pin #3
pin #4
pin #5
pin #6
pin #7
pin #8
IR Emitter
Annode
IR Emitter
Cathode
Transmitter
Input
Receiver
Output
Shutdown
Analog
Supply
Voltage
Digital
Supply
Voltage
Ground
IREDA
IREDC
TXD
RXD
SD
VCC
Vlogic
GND
IR Emitter
Annode
IR Emitter
Cathode
Transmitter
Input
Receiver
Output
Shutdown
Analog
Supply
Voltage
Mode Input
Ground
IREDA
IREDC
TXD
RXD
SD
VCC
Mode
GND
IR Emitter
Annode
IR Emitter
Cathode
Transmitter
Input
Receiver
Output
Serial Clock
Analog
Supply
Voltage
Mode Input
Ground
IREDA
IREDC
TXD
RXD
SD
VCC
Mode
GND
Function
7-pin device
TFBS4650
IR Emitter
Anode
IR Emitter
Cathode
Transmitter
Input
Receiver
Output
Shutdown
Analog
Supply
Voltage
Ground
Symbol
IREDA
IREDC
TXD
RXD
SD
VCC
GND
Function
7-pin device
TFBS4652
IR Emitter
Anode
Receiver
Output
Transmitter
Input
Shutdown
Digital
Supply
Voltage
Analog
Supply
Voltage
Ground
Symbol
IREDA
RXD
TXD
SD
Vlogic
VCC
GND
Function
6-pin device
as e.g.
TFBS4711
TFBS6711
TFBS6712
IR Emitter
Anode
Transmitter
Input
Receiver
Output
Shutdown
Analog
Supply
Voltage
Ground
Symbol
IREDA
TXD
RXD
SD
VCC
GND
Function
8-pin device
as e.g.
TFBS6614
Symbol
Function
8-pin device
as e.g.
TFBS6102
Symbol
Function
8-pin device
as e.g.
TFBS8108
Symbol
The recommended board layouts are Vishay references for testing the transceivers. Identical boards
are used for all speeds from SIR to VFIR. The layout
has an influence on the rise/fall times of the signals,
especially of the optical output pulse due to the quite
high drive current through the LED. The circuit is also
identical for all transceivers apart from the different
use of pin 5 (SD or not connected as e.g. in case of
TFDU4100, which has no SD function), pin 7 (Mode,
Vlogic, or NC), and the device dependent current limiting resistors R2 for controlling the current through
the IR emitter.
As already described, the given layout is nearly
identical for all Vishay transceivers because the pin
order is identical for all devices. For different lead
pitch different boards are available.
www.vishay.com
90
400
350
300
250
200
150
100
Rs = 3.3 Ohm
50
0
2.3
2.5
2.7
2.9
3.1
3.3
3.5
3.7
19714
www.vishay.com
91
400
350
300
250
200
150
100
50
0
10
100
Series Resistor Rs ()
19722
Figure 10. Resulting current depending on the series resistor for limiting the LED drive current, VCC1 = VCC2 = 3.3 V
350
100
Intensity le (mW/sr)
300
250
200
150
100
50
60
40
20
0
0
2
19723
80
19725
V cc1
R1
C1
GND
IRED Anode
V cc2
Vlogic
Vlogic
V cc
C4
Ground
SD
SD
TXD
TXD
RXD
RXD
R2
IRED Anode
Vlogic
V cc
R1
V cc1
C1
GND
C4
Ground
SD
SD
TXD
TXD
RXD
RXD
IR Transceiver
R2
I R T ra ns c e ive r
V cc2
Vlogic
Si1012R/X
TXD_RC
IRED Cathode
IRED Cathode
R2
19727
19726
Figure 13.
Figure 14.
V(TXI)_1:1
V
7
6
5
4
3
2
1
0
-1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0e-3
s
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0e-3
s
1.0
1.2
1.4
1.6
1.8
IVIC
1.5e-5
1.0
0.5
0.0
-0.5
-1.0
-1.5
0.0
IDDadd
e-4
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
VDD = 3.0 V
0.0
0.2
0.4
0.6
0.8
19731
2.0e-3
s
www.vishay.com
93
Pin #5 SD Shutdown
Shutdown With a few exemptions as TFDU4100 and
TFDU4202 all Vishay Semiconductors IrDA-compliant transceivers feature a shutdown input. When set
active the devices go into a shutdown mode with the
RXD output floating with a weak pull-up. To shut
down TFDU4100 and TFDU4202 see the special data
sheets.
Note: Any IrDA receiver must be able to handle 1.6 s input signals
www.vishay.com
94
Optical Windows
Optical windows should be designed not to truncate
the beam shape of transceivers. On the other hand
the window design also can be used to minimize interference with background light and other disturbances. For type related window design and general
information regarding windows materials and suppliers see the application note Window Size in Housings. Supplier references are in the note Sources for
Accessories.
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95
Quality Information
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96
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97
2008
In te g ra te d M a n a g e m e n t S y s te m s
E C - D ir e c tiv e E L V , R o H S , W E E E fu lfille d
IS O /T S 1 6 9 4 9 - A u to m o tiv e S ta n d a r d
IS O 9 0 0 1 :2 0 0 0 P r o c e s s O r ie n te d B u s in e s s
2000
IS O 1 4 0 0 1
Q S 9 0 0 0 / V D A 6 .1
E F Q M A p p ro a c h
1995
M e a s u r e m e n t C u s t o m e r S a t is f a c t io n
C o r p o r a te C u s to m e r S e r v ic e P o lic y
IS O 9 0 0 0
A d v a n c e d Q u a lity T o o ls
S u p p lie r P a r tn e r s h ip
C o s t o f Q u a l i ty
1990
E m p o w e re d Im p ro v e m e n t T e a m s
19593
Quality System
Quality Program
At the heart of the quality process is the Vishay worldwide quality program. This program, which has been
in place since the early 90's, is specifically designed
to meet rapidly increasing customer quality demands
now and in the future.
Vishay Corporate Quality implements the Quality Policy and translates its requirements for use throughout
the worldwide organization.
Vishay Quality has defined a roadmap with specific
targets along the way. The major target is to achieve
world-class excellence throughout Vishay worldwide
by 2008.
The Vishay Corporate Quality defines and implements the Vishay quality policy at a corporate level. It
acts to harmonize the quality systems of the constituent divisions and to implement Total Quality Management throughout the company worldwide.
www.vishay.com
98
Inputs from:
from:
rIntetability
un
aco
QM
re
ultu
C-C
Di r ec t i v es f r o m :
tegy
Stra
K ey f u n c t i o n s :
Forecast
Mar k et i n g
Order
R& D, En g i n eer i n g
Products
Tr an s ac t i o n o f Or d er s
Data Base
New Products
>3years
VM, Cu s tom er Ac c.
Cycle Time
Sales/ASP
Turns
Inventorries
Promisses
Turns
Response Time
Returns
A OQ
Raw Material
AOQ, Returns
C o m p l a i nt s
Q-Costs
GGOOAALLSS
Qu al i t y
Cu s t o m er Qu al i t y
En v i r o n m en t
Su p p o r t ed b y :
Con
trolli
ng
Standards
Laws
K ey Parameter
V M , RTM
Product Sampl es
Proj ect M gmt
Y i el d
Pr o d u c t i o n
ManProject
age men
t
Other
Agreements
Pu r c h as i n g
Sale
s
Customer
Qualitiy
Dev el o p m en t o f New Pr o d u c t s
F G
MaS
R
rco,H
m,L,ACC
OG .
,IT
Customer
Requests
Process Outputs
K ey Pr oc es s es :
Pl an n i ng
Division
Co n t i n u o u s Im p r o v ement
(PDCA - Cy c le)
le)
19594
The procedures used are based upon these standards and laid down in an approved and controlled
Quality Manual.
RESUL TS
People related
People related
Results
Results
Politicy and
Politicy and
Strateg y
Strategy
Processes
Processes
Leadership
Leadership
People
People
Partnerships and
Partnerships and
Resources
Resources
Customer related
Customer related
Results
Results
Society related
Society related
Results
Results
Key Performance
Key Performance
Results
Results
ENA BL ERS
19595
www.vishay.com
100
Quality Service
Vishay believes that quality of service is equally as
important as the technical ability of its products to
meet their required performance and reliability.
Our objectives therefore include:
On-time delivery
Short response time to customers requests
Rapid and informed technical support
Fast handling of complaints
A partnership with our customers
18351
18352
Customer Complaints
Complaints fall mainly into two categories:
Logistical
Technical
www.vishay.com
101
18353
No
Entitled to
return/replacement
products
Yes
www.vishay.com
102
Sales Ref.No:
Sales Office:
Incoming Date:
Customer Ref.-No:
Cust. Contact
Person:
E-Mail:
Phone:
Fax:
Sales Contact
Person:
E-Mail:
Phone:
Fax:
Plant Code:
Failure description
Point of Failure:
Qualification
Reliability
Others
Incoming
Assembly
Field Failure
Application:
(please specify)
Return Request
Device:
Date Code:
Inv. No.:
Commercial Return
Technical Return
RMA-No. :
( mandatory )
CAR-No.
of 8D - Report:
QM Vishay
Issue: 02.10.2000
19596
www.vishay.com
103
CAR Number:
Page: 1
Report Date:
Originator
Vishay Location:
Plant code:
Customer:
Date Code:
Customer Location:
Device Type:
Lot size:
Value:
Sample Qty:
Tolerance:
Failure rate:
RMA Number:
Analysis Code:
Package Type:
8D APPROACH Disciplines 1, 2, and 4 below must be completed for ALL requests.
DISCIPLINE 1: ESTABLISH TEAMS
Revised by:
Approved by:
Rev.:
Date:
Date:
Date Closed:
MANUFACTURER OF ONE OF THE WORLDS BROADEST LINE OF DISCRETE SEMICONDUCTORS AND PASSIVE COMPONENTS
Confidential Information
19598
Vishay 8D form
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104
Ship-to-Stock/Ship-to-Line (STS/STL)
Many customers now require devices to be shipped
direct to stock or to the production line by omitting any
goods inwards inspection. Vishay welcomes such
agreements as part of its customer partnership program, which promises an open approach in every
aspect of its business. A product will only be supplied
as STS or STL if there is a valid agreement in place
between the two companies. Such an agreement
details the quality level targets agreed upon between
the companies and the methods to be used in case of
problems.
AOQ Program
Before leaving the factory, all products are sampled
after 100% testing to ensure that they meet a minimum quality level and to measure the level of defects.
The results are accumulated and expressed in ppm
(parts per million). They are the measure of the average number of potentially failed parts in deliveries
over a period of time. The sample size used is determined by AQL or LTPD tables depending upon the
product. No rejects are allowed in the sample.
The AOQ value is calculated monthly using the
method defined in standard JEDEC 16:
6
18357
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105
Qualificationprocedure
procedure
Qualification
Waferprocess
process
Wafer
Package
Package
DeviceType
Type
Device
qualification
qualification
qualification
qualification
qualification
qualification
Monitoring
Monitoring
Processchange
change
Process
qualification
qualification
18358
18358
www.vishay.com
106
TFDU
TFDU 6102
6102 // TFDU
TFDU 6108
6108
Low
Low Profile
Profile Transceiver
Transceiver Module
Module
18359
18359
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107
Reliability Principles
The monitoring program consists of short-term monitoring to provide fast feedback on a regular basis in
case of a reduction in reliability and to measure the
Early-life Failure Rate (EFR). At the same time, Longterm monitoring is used to determinate the Long-term
steady-state Failure Rate (LFR). The tests used are a
subset from those used for qualification and consist
of:
Life tests
Humidity tests
Temperature-cycling tests
Solderability tests
Resistance-to-solder-heat test
The actual tests used depend on the product
tested.
Depending on the assembly volume a yearly monitoring and wear out test plan is created.
Wear Out data are very important in Opto electronic
device. Out of that data degradation curves can be
made. These curves show the long time behavior of
the different devices.
Some typical curves are attached in this report.
failure
failure
rate
rate
Early-life
Early-life
failures
failures
(EFR)
(EFR)
Operating
Operatinglife
lifefailures
failures
(LFR)
(LFR)
Wear-out
Wear-out
failures
failures
18374
18374
18353
The failure rate (l) during the constant (random) failure period is determined from life-test data. The failure rate is calculated from the formula:
r
r
O = ------------------------------------------- = ---6 Fi ti + N t
C
where
www.vishay.com
108
hours
-1
F e 2
O pop = -----------------C
Confidence Level
60 %
90 %
0.92
2.31
2.02
3.89
3.08
5.30
4.17
6.70
5.24
8.00
6.25
9.25
7.27
10.55
pop
3.08
= ----------------------------- = 3085 FIT
5
9.985 10
O T2 = O T1 u e
EA
1
-------- u ------ 1-
T1 -----k
T2
where
k
= Boltzmann's constant 8.63 x 10-5 eV/K
EA
= Activation energy (eV)
T1
= Operation temperature (K)
= Stress temperature (K)
T2
OT1 = Operation failure rate
OT2 = Stress-test failure rate
Using this equation, it is possible from the stress test
results to predict what would happen in use at the normal temperature of operation.
Activation Energy
Provided the stress testing does not introduce a failure mode, which would not occur in practice, this
method gives an acceptable method for predicting
reliability using short test periods compared to the life
of the device. It is necessary to know the activation
www.vishay.com
109
Acceleration factor
Failure mechanism
Activation Energy
0.3 0.4
0.3 0.4
Oxide defects
0.3 0.4
0.5
Electro migration
0.4 1.2
0.8 eV
Electrolytic corrosion
0.8 1.0
0.7 eV
Gold-aluminum intermetallics
0.8 2.0
0.6 eV
Gold-aluminum bond
degradation
1.0 2.2
Ionic contamination
1.02
Alloy pitting
1.77
1000
100
0.5 eV
10
1
55
75
95
120
115
150
135
155
Temperature (C)
18361
18362
www.vishay.com
110
328K
O
423K
3080
= ---------------------- = ------------258
258
= 12 FIT
(at 55 C with a confidence of 60 %)
This figure can be re-calculated for any
operating/junction temperature using this
method.
CoffinManson exponent M
3.5
4.0
5.1
7.1
For instance:
'T use = 15 C/ 60 C = 45 C
'T stress = 25 C/ 60 C = 125 C
125 C 3
A F = ------------------ | 21
45 C
AF
0, 8
1
1
------------------------------ ---------- ----------
5 313 358
3
8,617
x
10
85
%
RH
= ------------------------ e
92 % RH
A F | 33
This example shows how to transform test conditions
into environmental or into another test conditions.
This equation is applicable for devices subjected to
temperature humidity bias (THB) testing.
Using these acceleration factors the useful lifetime
can be calculated. Applying the acceleration factor
once more, useful lifetime for the moisture effect
model for parts subjected to THB can be estimated by
the following equation:
A F test hours
Useful life Years = ------------------------------------hours per year
www.vishay.com
111
This means that operation in 40 C / 60 % RH environment is good for around 13 years, calculated out
of the 85 C/ 85 % RH 1000h humidity stress test.
18370
www.vishay.com
112
Life
Level
Conditions
Time
Time (hours)
Soak Requirements
Conditions
d30 C / 90 % RH
Unlimited
85 C / 85 % RH
d30 C / 60 % RH
1 year
2a
d30 C / 60 % RH
4 Weeks
168
168
696hrs
85 C / 60 % RH
30 C / 60 % RH
d30 C / 60 % RH
168 h.
24
168
192
30 C / 60 % RH
d30 C / 60 % RH
72 h.
24
72
96
30 C / 60 % RH
d30 C / 60 % RH
24 / 48 h.
24
24 / 48
48 / 72
30 C / 60 % RH
d30 C / 60 % RH
6 h.
30 C / 60 % RH
www.vishay.com
113
Y
Z
= Default value of semiconductor manufacturers exposure time (MET) between bake and
bag plus the maximum time allowed out of the
bag at the distributors facility. The actual times
may be used rather than the default times, but
they must be used if they exceed the default
times.
= Floor life of package after it is removed from
dry pack bag (level 8 after completion of bake).
= Total soak time for evaluation (X + Y).
www.vishay.com
114
2
1
pfd (x) = ------------- e
V 2S
www.vishay.com
117
Abbreviations
AQL
CAR
DIP
ECAP
EMC
EMI
EOS
ESD
FAR
FIT
FMEA
FTA
h (t)
LTPD
MOS
MRB
MTBF
MTTF
MTTR
PPM
PRST
QA
QC
QPL
RPM
SCA
SEM
TW
Z (t)
O
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118
Contents
TFBS4650..............................120
TFBS4652..............................131
TFBS4710..............................142
TFBS4711..............................151
SIR
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3
TFBS4650
Vishay Semiconductors
Infrared Transceiver
9.6 kbit/s to 115.2 kbit/s (SIR)
Description
The TFBS4650 is one of the smallest IrDA compliant
transceivers available. It supports data rates up to
115 kbit/s. The transceiver consists of a PIN photodiode, infrared emitter, and control IC in a single package.
20206
Features
Compliant with the IrDA physical layer
IrPHY 1.4 (low power specification,
9.6 kbit/s to 115.2 kbit/s)
e4
Link distance: 30 cm/20 cm full 15 cone
with standard or low power IrDA, respectively. Emission intensity can be set by an external
resistor to increase the range for extended low
power spec to > 50 cm
Typical transmission distance to standard device:
50 cm
Small package L 6.8 mm x W 2.8 mm x H 1.6 mm
Low current consumption
75 A idle at 3.6 V
Applications
Mobile phone
PDAs
Parts Table
Part
Description
Qty / Reel
TFBS4650-TR1
1000 pcs
TFBS4650-TR3
2500 pcs
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120
TFBS4650
Vishay Semiconductors
Functional Block Diagram
VCC
Tri-State
Driver
PD
Amplifier
RXD
Comparator
IREDA
SD
Mode
Control
IRED Driver
TXD
IRED
IREDC
ASIC
GND
19283
Pin Description
Pin Number
Function
Description
IREDA
I/O
Active
IREDC
TXD
Transmitter Data Input. Setting this input above the threshold turns on the
transmitter.
This input switches the IRED with the maximum transmit pulse width of
about 50 s.
HIGH
RXD
Receiver Output. Normally high, goes low for a defined pulse duration with
the rising edge of the optical input signal. Output is a CMOS tri-state driver,
which swings between ground and Vcc. Receiver echoes transmitter output.
LOW
SD
Shut Down. Logic Low at this input enables the receiver, enables the
transmitter, and un-tri-states the receiver output. It must be driven high for
shutting down the transceiver.
HIGH
VCC
Power Supply, 2.4 V to 3.6 V. This pin provides power for the receiver and
transmitter drive section. Connect VCC1 via an optional filter.
GND
Ground
Pinout
TFBS4650, bottom view
weight 0.05 g
19284
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121
TFBS4650
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin, GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
Typ.
6.0
VCC2
- 0.5
6.0
Voltage at RXD
All states
Vin
- 0.5
VCC + 0.5
Vin
- 0.5
6.0
Input currents
- 40
40
mA
PD
Junction temperature
125
- 25
+ 85
Tstg
- 40
+ 100
C
C
IIRED (RP)
500
mA
IIRED (DC)
100
mA
IEC60825-1 or
EN60825-1,
edition Jan. 2001
Ie
*)
mA
mW
Tamb
TJ
20
250
0.8
mm
*)
mW/sr
(500)**)
**)
***) Sn/Pb-free
soldering. The product passed VISHAYs standard convection reflow profile soldering test.
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhY 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhY 1.1, followed by IrPhY 1.2, adding the SIR Low Power Standard. IrPhY 1.3 extended the Low
Power Option to MIR and FIR and VFIR was added with IrPhY 1.4. A new version of the standard in any case obsoletes the former version.
www.vishay.com
122
TFBS4650
Vishay Semiconductors
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
130
ICC
90
ICC
75
Ee < 4 mW/m2
- 25 C dT d+ 85 C
Idle, dark ambient
Ee < 4 mW/m2
T = + 25 C
3
mA
ISD
0.1
ISD
1.0
Iccpk
SD = High
(> VCC - 0.5 V),
T = 25 C, Ee = 0 klx
SD = High
(> VCC - 0.5 V),
- 25 C dT d+ 85 C
TA
- 25
+ 85
VIL
- 0.5
0.5
VIH
VCC - 0.5
6.0
1.8
VOL
- 0.5
VCC x 0.15
VOH
VCC x 0.8
VCC + 0.5
SD = VCC
VCC = 2.4 V to 5 V
RRXD
Input capacitance
(TXD, SD)
0.9
CI
1.35
500
k:
6
pF
www.vishay.com
123
TFBS4650
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Min
Sensitivity:
Minimum irradiance Ee in
angular range *)**)
Ee
Maximum irradiance Ee in
angular range ***)
O = 850 nm to 900 nm
Ee
5
(500)
Ee
4
(0.4)
Typ.
Max
Unit
40
(4.0)
81
(8.1)
mW/m2
(W/cm2)
kW/m2
(mW/cm2)
mW/m2
(W/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
20
100
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
20
100
ns
tPW
1.7
2.9
Power on delay
Latency
tL
2.0
100
150
50
200
*)
This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent
lamps
**) IrDA sensitivity definition: Minimum Irradiance E In Angular Range, power per unit area. The receiver must meet the BER specification
e
while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length
***) Maximum Irradiance E In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the maxe
imum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors. If
placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification.
****)
RXD output is edge triggered by the rising edge of the optical input signal. The output pulse duration is independent of the input pulse
duration.
For more definitions see the document Symbols and Terminology on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
www.vishay.com
124
TFBS4650
Vishay Semiconductors
Transmitter
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Min
Max
Unit
ID
200
400
mA
150
mW/sr
Tamb = 85C
Ie
Ie
VCC1 = 5.0 V, D = 0, 15
TXD = Low or SD = High
(Receiver is inactive as long as
SD = High)
Ie
VCC = 3.0 V, If = 50 mA
IIRED
25
mW/sr
0.04
VCEsat
Typ.
mW/sr
0.4
Op
880
tropt,
tfopt
20
886
900
nm
100
ns
topt
topt
30
t
50
300
s
s
topt
1.45
1.61
2.2
20
Optical overshoot
*)
The radiant intensity can be adjusted by the external current limiting resistor to adapt the intensity to the desired value. The given value
is for minimum current consumption. This transceiver can be adapted to > 50 cm operation by increasing the current to > 200 mA, e.g.
operating the transceiver without current control resistor (i.e. R1 = 0 :and using the internal current control.
Table 1.
Truth table
Inputs
Outputs
SD
TXD
RXD
Transmitter
high
0
Ie
low
high
low
high
low
low
<4
high
low
low
low (active)
low
low
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125
TFBS4650
Vishay Semiconductors
Recommended Circuit Diagram
Operated at a clean low impedance power supply the
TFBS4650 needs only one additional external component when the IRED drive current should be minimized for minimum current consumption according
the low power IrDA standard. When combined operation in IrDA and Remote Control is intended no current limiting resistor is recommended.
However, depending on the entire system design and
board layout, additional components may be required
(see figure 1). When long wires are used for bench
tests, the capacitors are mandatory for testing rise/fall
time correctly.
VCC2
IRED Anode
R1
IRED Cathode
VCC1
GND
Table 2.
Recommended Application Circuit Components
VCC
R2
C1
C2
Ground
SD
SD
Component
Recommended Value
Txd
Txd
C1, C2
Rxd
Rxd
R1
See table 3
R2
47 :, 0.125 W (VCC1 = 3 V)
19286
Table 3.
Recommended resistor R1 [:]
Figure 1. Recommended Application Circuit
VCC2
[V]
2.7
24
3.0
30
3.3
36
TFBS4650
Vishay Semiconductors
Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
260
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
10 s max. at 230 C
240 C max.
240
220
2...4 C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
280
T 255 C for 20 s max
260
240
T 217 C for 50 s max
220
200
180
Temperature/C
Temperature/C
160 C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 C...4 C/s
80
60
2 C...4 C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
www.vishay.com
127
TFBS4650
Vishay Semiconductors
Package Dimensions
19322
Figure 4. TFBS4650 mechanical dimensions, tolerance 0.2 mm, if not otherwise mentioned
19729
Figure 5. TFBS4650 soldering footprint, tolerance 0.2 mm, if not otherwise mentioned
www.vishay.com
128
TFBS4650
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
W3 max.
www.vishay.com
129
TFBS4650
Vishay Semiconductors
Tape Dimensions in mm
www.vishay.com
130
TFBS4652
Vishay Semiconductors
Infrared Transceiver
9.6 kbit/s to 115.2 kbit/s (SIR)
Description
The TFBS4652 is one of the smallest IrDA compliant
transceivers available. It supports data rates up to
115 kbit/s. The transceiver consists of a PIN photodiode, infrared emitter, and control IC in a single package.
Features
20206
Split power supply, emitter can be driven by a separate power supply not loading the regulated. U.S.
Pat. No. 6,157,476
Adjustable to logic I/O voltage swing from 1.5 V to
5.5 V
Lead (Pb)-free device
Qualified for lead (Pb)-free and Sn/Pb processing
(MSL4)
Device in accordance with RoHS 2002/95/EC and
WEEE 2002/96/EC
Applications
Mobile phone
PDAs
Parts Table
Part
Description
Qty / Reel
TFBS4652-TR1
1000 pcs
TFBS4652-TR3
2500 pcs
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131
TFBS4652
Vishay Semiconductors
Functional Block Diagram
VCC
Vlog
Tri-State
Driver
PD
Amplifier
RXD
Comparator
IREDA
SD
Mode
Control
IRED Driver
IRED
TXD
ASIC
GND
19288
Pin Description
Pin Number
Function
Description
I/O
Active
IREDA
RXD
Receiver Output. Normally high, goes low for a defined pulse duration with
the rising edge of the optical input signal. Output is a CMOS tri-state driver,
which swings between ground and Vlogic. Receiver echoes transmitter
output.
LOW
TXD
Transmitter Data Input. Setting this input above the threshold turns on the
transmitter.
This input switches the IRED with the maximum transmit pulse width of
about 50 s.
HIGH
SD
Shut Down. Logic Low at this input enables the receiver, enables the
transmitter, and un-tri-states the receiver output. It must be driven high for
shutting down the transceiver.
HIGH
Vlogic
Reference for the logic swing of the output and the input logic levels.
VCC
Power Supply, 2.4 V to 3.6 V. This pin provides power for the receiver and
transmitter drive section. Connect Vcc1 via an optional filter.
GND
Ground
Pinout
Definitions:
Low Power Option to MIR and FIR and VFIR was added with IrPhY
1.4. A new version of the standard in any case obsoletes the former
version.
www.vishay.com
132
TFBS4652
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin, GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
Typ.
6.0
VCC2
- 0.5
6.0
Vlogic
- 0.5
6.0
Voltage at RXD
All states
Vin
- 0.5
Vlogic + 0.5
Vin
- 0.5
6.0
Input currents
- 40
40
mA
PD
Junction temperature
TJ
mA
mW
125
Tamb
- 25
+ 85
Tstg
- 40
+ 100
C
C
IIRED (RP)
500
mA
IIRED (DC)
100
mA
IEC60825-1 or
EN60825-1,
edition Jan. 2001
Ie
*)
20
250
0.8
mm
mW/sr
*)
(500)**)
**) IrDA
***)
Sn/Pb-free soldering. The product passed VISHAYs standard convection reflow profile soldering test.
www.vishay.com
133
TFBS4652
Vishay Semiconductors
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
130
ICC
90
ICC
75
Iccpk
Ee < 4 mW/m2
- 25 C dT d+ 85 C
Idle, dark ambient
Ee < 4 mW/m2
T = + 25 C
Peak supply current during
transmission
mA
Ilogic
Ee < 4 mW/m2
Shutdown supply current
Dark ambient
SD = High
(> Vlogic - 0.5 V),
T = 25 C, Ee = 0 klx
ISD
0.1
SD = High
(> Vlogic - 0.5 V),
T = 70 C, Ee = 0 klx
ISD
2.0
SD = High
(> Vlogic - 0.5 V),
T = 85 C, Ee = 0 klx
ISD
3.0
+ 85
VOL
VOH
SD = VCC,
VCC = 2.4 V to 5 V
RRXD
TA
V CC = 2.4 V to 3.6 V
Input capacitance
(TXD, SD)
www.vishay.com
134
- 25
0.3
Vlogic - 0.5
Vlogic
500
k:
VIL
- 0.5
0.5
VIH
Vlogic - 0.5
Vlogic + 0.5
0.9
CI
V
pF
TFBS4652
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Min
Sensitivity:
Minimum irradiance Ee in
angular range *)**)
Ee
Maximum irradiance Ee in
angular range ***)
O = 850 nm to 900 nm
Ee
5
(500)
Ee
4
(0.4)
Typ.
Max
Unit
40
(4.0)
81
(8.1)
mW/m2
(W/cm2)
kW/m2
(mW/cm2)
mW/m2
(W/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
20
100
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
20
100
ns
tPW
1.7
2.9
Power on delay
tL
30
Latency
100
150
50
100
*)
This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent
lamps.
**) IrDA sensitivity definition: Minimum Irradiance E In Angular Range, power per unit area. The receiver must meet the BER specificae
tion while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length.
***) Maximum Irradiance E In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the
e
maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors.
If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification.
****) RXD output is edge triggered by the rising edge of the optical input signal. The output pulse duration is independent of the input pulse
duration.
For more definitions see the document Symbols and Terminology on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
www.vishay.com
135
TFBS4652
Vishay Semiconductors
Transmitter
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Min
Max
Unit
ID
200
400
mA
150
mW/sr
Tamb = 85C
Ie
Ie
VCC1 = 5.0 V, D = 0, 15
TXD = Low or SD = High
(Receiver is inactive as long as
SD = High)
Ie
VCC = 3.0 V, If = 50 mA
IIRED
25
mW/sr
0.04
VCEsat
Typ.
mW/sr
0.4
Op
880
tropt,
tfopt
20
886
900
nm
100
ns
topt
topt
30
t
50
300
s
s
t opt
1.45
1.61
2.2
20
Optical overshoot
*)
The radiant intensity can be adjusted by the external current limiting resistor to adapt the intensity to the desired value. The given value
is for minimum current consumption. This transceiver can be adapted to > 50 cm operation by increasing the current to > 200 mA, e.g.
operating the transceiver without current control resistor (i.e. R1 = 0 :) and using the internal current control.
Table 1.
Truth table
Inputs
TXD
RXD
Transmitter
high
0
Ie
low
high
low
high
low
low
<2
high
low
low
low (active)
low
low
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136
Outputs
SD
TFBS4652
Vishay Semiconductors
Recommended Circuit Diagram
Operated at a clean low impedance power supply the
TFBS4652 needs only one additional external component when the IRED drive current should be minimized for minimum current consumption according
the low power IrDA standard. When combined operation in IrDA and Remote Control is intended no current limiting resistor is recommended. When long
wires are used for bench tests, the capacitors are
mandatory for testing rise/fall time correctly.
VCC2
IRED Anode
R1
Vlogic
VCC1
Vlogic
VCC
R2
C1
GND
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
19289
Table 2.
Recommended Application Circuit Components
Component
Recommended Value
C1, C2
R1
See table 3
R2
47 :, 0.125 W (VCC1 = 3 V)
Table 3.
Recommended resistor R1 [:]
VCC2
[V]
2.7
24
3.0
30
3.3
36
www.vishay.com
137
TFBS4652
Vishay Semiconductors
Recommended Solder Profiles
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
260
10 s max. at 230 C
240 C max.
240
220
2...4 C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
280
T 255 C for 20 s max
260
240
T 217 C for 50 s max
220
200
180
Temperature/C
Temperature/C
160 C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 C...4 C/s
80
60
2 C...4 C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
www.vishay.com
138
TFBS4652
Vishay Semiconductors
Package Dimensions in mm
19322
Figure 4. TFBS4652 mechanical dimensions, tolerance 0.2 mm, if not otherwise mentioned
19729
Figure 5. TFBS4652 soldering footprint, tolerance 0.2 mm, if not otherwise mentioned
www.vishay.com
139
TFBS4652
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
www.vishay.com
140
W3 max.
TFBS4652
Vishay Semiconductors
Tape Dimensions in mm
19286
www.vishay.com
141
TFBS4710
Vishay Semiconductors
18071
Features
Compliant with the latest IrDA physical
layer
specification (9.6 kbit/s to 115.2 kbit/s)
e4
Small package:
H 2.74 mm x D 3.33 mm x L 8.96 mm
Typical Link distance 1 m
Drop in replacement for IRM5000D/ IRMT5000
Battery & Power Management Features:
> Idle Current - 75 A Typical
> Shutdown Current - 10 nA Typical
> Operates from 2.4 V - 5.0 V within specification
over full temperature range from - 25 C to + 85 C
Remote Control - transmit distance up to 8 meters
Tri-State Receiver Output, floating in shutdown
with a weak pull-up
Applications
Data Loggers
External Infrared Adapters (Dongles)
Diagnostics Systems
Medical and Industrial Data Collection Devices
Kiosks, POS, Point and Pay Devices
GPS
Access Control
Field Programming Devices
Parts Table
Part
Description
Qty / Reel
TFBS4710-TR1
1000 pcs
TFBS4710-TT1
1000 pcs
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142
TFBS4710
Vishay Semiconductors
Functional Block Diagram
VCC1
Push-Pull
Driver
Amplifier
Comparator
RXD
VCC2
Logic
&
SD
TXD
Controlled Driver
Control
RED C
GND
18282
Pinout
Definitions:
TFBS4710
weight 100 mg
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4.
A new version of the standard in any case obsoletes the former ver-
18511
sion.
With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version
IrPhy 1.4 (in Oct. 2002).
Pin Description
Pin Number
Function
Description
IRED
Anode
IRED Anode is connected to a power supply. The LED current can be decreased
by adding a resistor in series between the power supply and IRED Anode. A
separate unregulated power supply can be used at this pin.
I/O
Active
TXD
HIGH
RXD
Received Data Output, normally stays high but goes low for a fixed duration
during received pulses. It is capable of driving a standard CMOS or TTL load.
LOW
SD
Shutdown. Setting this pin active for more than 1.5 ms switches the device into
shutdown mode
HIGH
VCC
GND
Ground
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143
TFBS4710
Vishay Semiconductors
Absolute Maximum Ratings
Reference Point Ground, Pin 6 unless otherwise noted.
Parameter
Test Conditions
Symbol
Min
VCC
- 0.3
Typ.
ICC
20 % duty cycle
Unit
V
10.0
mA
25.0
mA
IIRED (DC)
60
mA
IIRED (RP)
300
mA
V
VIREDA
- 0.5
+ 6.0
VIN
- 0.5
+ 6.0
200
mW
Junction temperature
Ambient temperature range
(operating)
Max
+ 6.0
125
Tamb
- 30
+ 85
Tstg
- 40
+ 100
260
Max
Unit
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC = VIREDA = 2.4 V to 5.5 V unless otherwise noted.
Parameter
Test Conditions
Symbol
Min
VCC
2.4
Typ.
5.5
130
SD = Low, Ee = 1 klx*),
Tamb = - 25 C to + 85 C,
VCC1 = VCC2 = 2.7 V to 5.5 V
ICC1
90
SD = Low, Ee = 1 klx*),
Tamb = 25 C,
VCC1 = VCC2 = 2.7 V to 5.5 V
ICC1
75
Receive current
VCC = 2.7 V
ICC
280
Shutdown current
SD = High, T = 25 C, Ee = 0 klx
ISD
SD = High, T = 85 C
ISD
TA
- 25
+ 85
IOL = 1 mA
VOL
- 0.5
0.15 x VCC
IOH = - 500 A
VOH
0.8 x VCC
VCC + 0.5
IOH = - 250 A
VOH
0.9 x VCC
VCC + 0.5
RRXD
400
600
k:
www.vishay.com
144
500
VIL
- 0.5
0.5
VIH
VCC - 0.5
6.0
IICH
-2
IIRTx
IIRTx
CIN
-1
+2
+ 150
pF
TFBS4710
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC = 2.4 V to 5.5 V unless otherwise noted
Symbol
Min
Typ.
Max
Unit
Parameter
Test Conditions
Ee
10
(1.0)
25
(2.5)
40
(4)
mW/m2
O = 850 nm - 900 nm
Ee
Maximum no detection
threshold irradiance
(W/cm2)
5
(500)
Ee
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(W/cm2)
10 % to 90 %, CL = 15 pF
tr(RXD)
10
100
90 % to 10 %, CL = 15 pF
tf(RXD)
10
100
ns
tPW
1.65
3.0
250
ns
150
Power-on delay
150
Latency
2.0
tL
ns
Transmitter
Tamb = 25 C, VCC = 2.4 V to 5.5 V unless otherwise noted.
Parameter
Test Conditions
Symbol
Min
Typ.
Max
Unit
ID
250
300
350
mA
Vf
1.4
1.8
1.9
IIRED
-1
40
350
mW/sr
0.04
mW/sr
Ir = 300 mA
Ie
Ie
70
24
Peak-emission wavelength
Op
Spectral bandwidth
'O
tropt
10
100
tfopt
10
100
ns
topt
1.46
1.8
topt
tTXD
t + 0.15
topt
50
25
Optical overshoot
880
900
45
1.63
nm
nm
ns
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145
TFBS4710
Vishay Semiconductors
Recommended Solder Profiles
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
260
10 s max. at 230 C
240 C max.
240
220
2...4 C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
280
T 255 C for 20 s max
260
240
T 217 C for 50 s max
220
200
180
Temperature/C
Temperature/C
160 C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 C...4 C/s
80
60
2 C...4 C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
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146
TFBS4710
Vishay Semiconductors
Recommended Circuit Diagram
Table 1.
High Operating Temperature > 70 C
V CC
IR Controller
Vdd
Rled
TFBS4710
IREDA (1)
IRTX
IRRX
IRMODE
R1= 47:
TXD
(2)
RXD
(3)
SD
(4)
Vcc
(5)
GND
(6)
GND
C4
C2
C3
C1
4.7 F 0.1F 4.7 F 0.1 F
18281
Rled (:)
Rled (:)
VLED
(V)
2.7
50
3.3
> 50
5.0
18
> 60
Table 2.
Recommended Application Circuit Components
Component
Recommended Value
C1, C3
4.7 F, 16 V
C2, C4
0.1 F, Ceramic
R1
47 :, 0.125 W
CRCW-1206-47R0-F-RT1
Rled
See Table 1
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147
TFBS4710
Vishay Semiconductors
Table 3.
Truth table
Inputs
SD
TXD
Outputs
Remark
RXD
Transmitt
er
Operation
Shutdown
mW/m2
high
> 1 ms
weakly pulled
(500 :) to VCC1
low
high
high inactive
Ie
Transmitting
high
> s
low
high inactive
Protection is active
<4
high inactive
low
low (active)
low
undefined
Package Dimensions
18086
Drawing-No.: 6.550-5256.01-4
Issue: 1; 24.06.03
Figure 4. Package drawing TFBS4710
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148
TFBS4710
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
W3 max.
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149
TFBS4710
Vishay Semiconductors
Tape Dimensions
19611
Drawing-No.: 9.700-5299.01-4
Issue: 1; 18.08.05
Figure 5. Tape drawing for TFBS4710 for side view mounting
www.vishay.com
150
TFBS4711
Vishay Semiconductors
20208
Features
Compliant with the latest IrDA physical
layer low power specification
( 9.6 kbit/s to 115.2 kbit/s)
Small package:
e4
H 1.9 mm x D 3.1 mm x L 6.0 mm
Industries smallest footprint
- 6.0 mm length
- 1.9 mm height
Typical Link distance on-axis up to 1 m
Battery & power management features:
> Idle Current - 75 A Typical
> Shutdown current - 10 nA typical
> Operates from 2.4 V - 5.5 V within specification
over full temperature range from - 25 C to + 85 C
Remote Control - transmit distance up to 8 meters
Applications
Data loggers
External infrared adapters (Dongles)
Diagnostics systems
Medical and industrial data collection devices
Kiosks, POS, Point and Pay devices
GPS
Access control
Field programming devices
Parts Table
Part
Description
Qty / Reel
TFBS4711-TR1
1000 pcs
TFBS4711-TR3
2500 pcs
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151
TFBS4711
Vishay Semiconductors
Functional Block Diagram
V CC
Amp
Comp
RXD
Driver
IRED A
Power
SD
Driver
Control
TXD
18280
GND
Pinout
Definitions:
TFBS4711
weight 50 mg
PIN 1
19428
Pin Description
Pin Number
Function
Description
IRED
Anode
IRED Anode is directly connected to a power supply. The LED current can be
decreased by adding a resistor in series between the power supply and IRED
Anode. A separate unregulated power supply can be used at this pin.
I/O
Active
TXD
This Input is used to turn on IRED transmitter when SD is low. An on-chip protection
circuit disables the LED driver if the TXD pin is asserted for longer than 80 Ps
HIGH
RXD
Received Data Output, normally stays high but goes low for a fixed duration during
received pulses. It is capable of driving a standard CMOS or TTL load.
LOW
4
5
6
SD
VCC
Shutdown. Setting this pin active switches the device into shutdown mode
Supply Voltage
Ground
HIGH
GND
Test Conditions
Symbol
Min
VCC
- 0.5
ICC
20 % duty cycle
Typ.
Max
Unit
+ 6.0
10.0
mA
25.0
mA
IIRED (DC)
80
mA
IIRED (RP)
400
mA
V
VIREDA
- 0.5
+ 6.0
VIN
- 0.5
+ 6.0
Tamb
- 30
+ 85
Tstg
- 40
+ 100
260
TFBS4711
Vishay Semiconductors
Eye safety information
Symbol
Min
Typ.
Parameter
Test Conditions
1.3
1.5
IEC60825-1 or EN60825-1,
edition Jan. 2001, operating
below the absolute maximum
ratings
Ie
Max
Unit
mm
mW/sr
*)
(500)**)
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC = VIREDA = 2.4 V to 5.5 V unless otherwise noted.
Parameter
Test Conditions
Symbol
Min
VCC
2.4
Typ.
SD = Low, Ee = 1 klx ,
Tamb = - 25 C to + 85 C,
VCC = 2.7 V to 5.5 V
ICC1
SD = Low, Ee = 1 klx*),
Tamb = 25 C,
VCC = 2.7 V to 5.5 V
ICC1
Receive current
VCC = 2.7 V
ICC
80
Shutdown current
SD = High, T = 25 C, Ee = 0 klx
ISD
< 0.1
SD = High, T = 85 C
ISD
*)
Max
Unit
5.5
130
75
A
2
TA
- 25
+ 85
IOL = 1 mA
VOL
- 0.5
0.15 x VCC
IOH = - 500 A
VOH
0.8 x VCC
VCC + 0.5
IOH = - 250 A
VOH
0.9 x VCC
VCC + 0.5
RRXD
400
600
k:
500
VIL
- 0.5
0.5
VIH
VCC - 0.5
6.0
IICH
-2
IIRTx
IIRTx
Input capacitance
CIN
-1
+2
+ 150
pF
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153
TFBS4711
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC = 2.4 V to 5.5 V unless otherwise noted
Parameter
Test Conditions
Symbol
Minimum irradiance Ee in
angular range **)
Ee
Maximum irradiance Ee in
angular range***)
O = 850 nm - 900 nm
Ee
Maximum no detection
irradiance
Ee
Min
Typ.
Max
Unit
35
(3.5)
80
(8)
mW/m2
5
(500)
(W/cm2)
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(W/cm2)
10 % to 90 %, CL = 15 pF
tr(RXD)
10
100
ns
90 % to 10 %, CL = 15 pF
tf(RXD)
10
100
ns
tPW
1.7
3.0
250
ns
150
150
Latency
2.0
tL
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length.
***) Maximum Irradiance E In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the
e
maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors.
If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER).
For more definitions see the document Symbols and Terminology on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
Transmitter
Tamb = 25 C, VCC = 2.4 V to 5.5 V unless otherwise noted.
Symbol
Min
Typ.
Max
Parameter
Tamb = - 25 C to + 85 C
Test Conditions
ID
200
300
400
ICC
0.57
Unit
mA
mA
IIRED
-1
Ie
45
60
300
mW/sr
D = 0 , 15 , TXD = High, SD =
Low, R = 0 :, VLED = 2.4 V
Ie
25
35
300
mW/sr
Ie
0.04
mW/sr
22
Peak-emission wavelength
Op
Spectral bandwidth
'O
tropt
10
100
tfopt
10
100
ns
topt
1.41
2.23
topt
tTXD
topt
Optical overshoot
www.vishay.com
154
880
900
45
1.63
nm
nm
ns
tTXD +
300
25
TFBS4711
Vishay Semiconductors
Recommended Solder Profiles
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
260
10 s max. at 230 C
240 C max.
240
220
2...4 C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
280
T 255 C for 20 s max
260
240
T 217 C for 50 s max
220
200
180
Temperature/C
Temperature/C
160 C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 C...4 C/s
80
60
2 C...4 C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
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155
TFBS4711
Vishay Semiconductors
Recommended Circuit Diagram
V CC
IR Controller
Vdd
TFBS4711
Rled
IREDA (1)
TXD
IRTX
IRRX
IRMODE
R1= 47:
(2)
RXD
(3)
SD
(4)
Vcc
(5)
GND
(6)
GND
C4
C2
C3
C1
4.7 PF 0.1PF 4.7 PF 0.1 PF
18510
Table 1.
Recommended Application Circuit Components
Component
Recommended Value
C1, C3
4.7 F, 16 V
C2, C4
0.1 F, Ceramic
R1
47 :, 0.125 W
CRCW-1206-47R0-F-RT1
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156
TFBS4711
Vishay Semiconductors
Table 2.
Truth table
SD
TXD
RXD
Transmitter
Operation
mW/m2
Inputs
Inputs
Inputs
Outputs
Outputs
Remark
high
weakly pulled
(500 :) to VCC1
Shutdown
low
high
high inactive
Ie
Transmitting
low
high
> 300 s
high inactive
Protection is active
low
low
<4
high inactive
low
low
low (active)
Response to an IrDA
compliant optical input signal
low
low
undefined
Package Dimensions in mm
19612
Figure 4. Package drawing of TFBS4711, tolerance of height is + 0.1mm, - 0.2 mm, other tolerances 0.2 mm
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157
TFBS4711
Vishay Semiconductors
19728
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
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158
W3 max.
TFBS4711
Vishay Semiconductors
Tape Dimensions in mm
19613
www.vishay.com
159
TFDU4100
Vishay Semiconductors
20110
Features
Compliant to the IrDA physical layer
specification (Up to 115.2 kbit/s),
HP-SIR and TV Remote Control
e3
2.7 V to 5.5 V wide operating
voltage range
Low Power Consumption (1.3 mA Supply Current)
Surface mount package
- universal (L 9.7 mm W 4.7 mm H 4.0 mm)
Open collector receiver output, with 20 k:
internal pull-up.
BabyFace (Universal) package capable of surface
mount solderability to side and to view
orientation
Directly interfaces with various Super I/O and controller devices and Vishay Semiconductorss
TOIM4232 I/O
Applications
Printers, fax machines, photocopiers,
screen projectors
Telecommunication products
(cellular phones, pagers)
Internet TV boxes, video conferencing systems
Medical and industrial data collection devices
Parts Table
Part
Description
Qty / Reel
TFDU4100-TR3
1000 pcs
TFDU4100-TT3
1000 pcs
TFDU4100
Vishay Semiconductors
Functional Block Diagram
VCC1
VCC2
Driver
RXD
Comparator
Amplifier
IRED Anode
AGC
Logic
SC
R1
IRED Cathode
TXD
Open Collector Driver
14876
GND
Pin Description
Pin Number
Function
Description
IRED
Anode
IRED
Cathode
I/O
Active
TXD
HIGH
RXD
LOW
NC
No internal connection
VCC1
Supply Voltage
SC
Sensitivity control
HIGH
GND
Ground
Pinout
Definitions:
TFDU4100
weight 200 mg
IRED
Detector
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy
1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the
1
17087
2 3 4 5 6
7 8
Low Power Option to MIR and FIR and VFIR was added with IrPhy
1.4.A new version of the standard in any case obsoletes the former
version.
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161
TFDU4100
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Ground (pin 8) unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Supply voltage range
Input current
Symbol
Min
Max
Unit
0 V d VCC2 d 6 V
Test Conditions
VCC1
- 0.5
Typ.
+6
0 V d VCC1 d 6 V
VCC2
- 0.5
+6
10
mA
Junction temperature
TJ
mA
mW
125
- 25
+ 85
Tstg
- 25
+ 85
IIRED(DC)
t < 90 s, ton < 20 %
25
200
Tamb
PD
IIRED(RP)
260
100
mA
500
mA
VIREDA
- 0.5
+6
VTXD
- 0.5
VCC1 + 0.5
V RXD
- 0.5
VCC1 + 0.5
Max
Unit
Min
Typ.
Parameter
2.5
2.8
Ie
*)
Test Conditions
mm
mW/sr
(500)*) **)
**)
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
base band
Supply voltage
receive mode
transmit mode, R2 = 47 :
(see recommended application
circuit)
Symbol
Min
Max
Unit
2.4
Typ.
115.2
kbit/s
VCC1
2.7
5.5
VCC2
2.0
5.5
VCC1 = 5.5 V
ICC1(Rx)
1.3
2.5
mA
VCC1 = 2.7 V
ICC1(Rx)
1.0
1.5
mA
ICC1(Tx)
5.0
5.5
mA
ICC1(Tx)
3.5
4.5
mA
IL(IREDA)
0.005
0.5
50
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162
TPON
TFDU4100
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Minimum detection threshold
irradiance
Test Conditions
Symbol
Min
Typ.
Max
Unit
Ee
20
35
mW/m2
Ee
10
15
mW/m2
Ee
3.3
Ee
15
Ee
VOL
non-active,
C = 15 pF, R = 2.2 k:
VOH
kW/m2
kW/m2
mW/m2
0.5
0.8
VCC1 - 0.5
active to inactive
C = 15 pF, R = 2.2 k: to VCC1
tr(RXD)
20
200
ns
active to inactive
C = 15 pF, internal load only
tr(RXD)
20
1400
ns
inactive to active
C = 15 pF, R = 2.2 k: to VCC1
tf(RXD)
20
200
ns
inactive to active
C = 15 pF, internal load only
tf(RXD)
20
200
ns
tPW
1.63
4.3
500
Latency
IOL
V
4
ti
100
tL
mA
Transmitter
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
IRED operating current
Test Conditions
IRED operating current can be
adjusted by variation of R1.
Current limiting resistor is in
series to IRED:
R1 = 14 :, VCC2 = 5.0 V
Symbol
Min
Id
Typ.
Max
Unit
0.2
0.28
VIL(TXD)
0.8
VIH(TXD)
2.4
VCC1 + 0.5
Ie
45
200
mW/sr
Ie
0.04
mW/sr
900
nm
Op
140
24
880
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163
TFDU4100
Vishay Semiconductors
Parameter
Test Conditions
Symbol
Min
Typ.
Max
tropt, tfopt
nm
200
600
Optical overshoot
Rising edge peak-to-peak jitter
of optical output pulse
Unit
45
tj
ns
25
0.2
500
Vcc = 5.25 V,
max. efficiency, center,
min. VF, min. VCEsat
450
400
350
Intensity (mW/sr)
300
250
200
Vcc = 4.75 V, min. efficiency,
15q off axis, max. VF, max. VCEsat
150
100
50
0
VCC2
6
R1
VCC1
14377
IRED
Cathode
R2
RXD
8
10
12
14
Current Control Resistor ( : )
16
IRED
Anode
RXD
Figure 2. Ie vs. R1
TXD
TFDx4x00
C1
GND
C2
VCC1/SD
SC
GND
NC
18092
Intensity (mW/sr)
SC
TXD
14378
760
720
VCC = 3.3 V, max. intensity on
680
axis, min. VF , min VCEsat
640
600
560
520
480
440
400
360
320
280
240 VCC = 2.7 V, min. intensity
200
15q off axis, max. VF ,
160
max. VCEsat
120
80
40
0
0
1
2
3
4
5
6
7
8
Current Control Resistor ( : )
Figure 3. Ie vs. R1
TFDU4100
Vishay Semiconductors
Table 1.
Recommended Application Circuit Components
Component
Recommended Value
C1
4.7 F, Tantalum
C2
0.1 F, Ceramic
R1
CRCW-1206-7R00-F-RT1
R2
47 :, 0.125 W
CRCW-1206-47R0-F-RT1
Shutdown
The internal switch for the IRED in Vishay Semiconductors SIR transceivers is designed to be operated
like an open collector driver. Thus, the VCC2 source
can be an unregulated power supply while only a well
regulated power source with a supply current of 1.3
mA connected to VCC1/SD is needed to provide power
to the remainder of the transceiver circuitry in receive
mode. The term VCC1/SD is used here for the power
supply pin to indicate that VCC1 can be switched off
independently to shut down the transceiver. It is
allowed to keep the power supply connected to the
IRED Anode. In transmit mode, the current at VCC1 is
slightly higher (approximately 4 mA average at 3 V
supply current) and the voltage is not required to be
kept as stable as in receive mode. A voltage drop of
VCC1 is acceptable down to about 2.0 V when buffering the voltage directly from the Pin VCC1 to GND see
figure 1). This configuration minimizes the influence
of high current surges from the IRED on the internal
analog control circuitry of the transceiver and the
application circuit. Also board space and cost savings
can be achieved by eliminating the additional linear
regulator normally needed for the IREDs high current
requirements. The transceiver can be very efficiently
shutdown by keeping the IRED connected to the
power supply VCC2 but switching off VCC1/SD. The
power source to VCC1/SD can be provided directly
from a microcontroller (see figure 4). In shutdown,
current loss is realized only as leakage current
through the current limiting resistor to the IRED (typiDocument Number 82514
Rev. 1.6, 03-Jul-06
IIRED
Power
Supply
+
Regulated Power Supply
50 mA
R1
IRED
Anode
Microcontroller or
Microprocessor
20 mA
IS
VCC1/SD
14878
Figure 4.
IIRED
Power
Supply
+
Regulated Power Supply
50 mA
R1
IRED
Anode
Microcontroller or
Microprocessor
20 mA
IS
VCC1/SD
14879
Figure 5.
www.vishay.com
165
TFDU4100
Vishay Semiconductors
Recommended Solder Profiles
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
10 s max. at 230 C
240 C max.
2...4 C/s
160 C max.
120 s...180 s
90 s max.
275
2...4 C/s
250
225
Tpeak = 260 C
200
0
50
19535
100
150
200
250
300
350
Time/s
Temperature/C
260
240
220
200
180
160
140
120
100
80
60
40
20
0
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
2 C...3 C/s
50
25
0
0
50
100
150
200
Time/s
19532
250
300
350
260
240
220
200
180
Temperature/C
Temperature (C)
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
500
400
300
200
100
0
- 40 - 20
14880
TFDU4100
Vishay Semiconductors
Package Dimensions
7x1=7
0.6
2.5
1
8
1
18470
Figure 10. Package drawing and solder footprint TFDU4100, dimensions in mm, tolerance 0.2 mm if not otherwise mentioned
www.vishay.com
167
TFDU4100
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
24
330
60
24.4
30.4
23.9
27.4
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168
W3 max.
TFDU4100
Vishay Semiconductors
Tape Dimensions
19824
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Figure 11. Tape drawing, TFDU4100 for top view mounting, tolerance 0.1 mm
www.vishay.com
169
TFDU4100
Vishay Semiconductors
19875
Drawing-No.: 9.700-5297.01-4
Issue: 1; 08.04.05
Figure 12. Tape drawing, TFDU4100 for side view mounting, tolerance 0.1 mm
www.vishay.com
170
TFDU4101
Vishay Semiconductors
20110
Features
Operates from 2.4 V to 3.6 V within
specification over full temperature range
from - 30 C to + 85 C
e3
Split power supply, transmitter and
receiver can be operated from two power
supplies with relaxed requirements saving costs,
US - Patent No. 6,157,476
Low power consumption (< 0.12 mA supply current in receive mode, no signal)
Power shutdown mode (< 4 A shutdown current
in full temperature range, up to 85 C, < 10 nA at
25 C)
Surface mount 4-mm package
L 9.7 mm W 4.7 mm H 4.0 mm
Applications
Printers, fax machines, photocopiers, screen projectors
Internet TV boxes, video conferencing systems
Medical data collection
Diagnostic systems
Notebook computers, desktop PCs, Palmtop
computers (Win CE, Palm PC), PDAs
Parts Table
Part
Description
Qty / Reel
TFDU4101-TR3
1000 pcs
TFDU4101-TT3
1000 pcs
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171
TFDU4101
Vishay Semiconductors
Functional Block Diagram
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
Logic
&
SD
Controlled
Driver
Control
TXD
IRED C
GND
18468
Pin Description
Pin Number
1
Function
Description
I/O
Active
VCC2
IRED anode to be externally connected to VCC2. An external resistor is only
IRED Anode necessary for controlling the IRED current when a current reduction below
300 mA is intended to operate in IrDA low power mode.
This pin is allowed to be supplied from an uncontrolled power supply
separated from the controlled VCC1 - supply.
IRED
Cathode
TXD
HIGH
RXD
LOW
HIGH
SD
Shutdown
VCC1
Supply Voltage
NC
No internal connection
GND
Ground
Pinout
TFDU4101
weight 200 mg
"U" Option BabyFace
(Universal)
IRED
2 3 4 5 6
Detector
7 8
17087
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172
TFDU4101
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin, GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
6.0
VCC2
- 0.5
6.0
Voltage at RXD
VRXD
- 0.5
VCC1
+ 0.5
Vin
- 0.5
6.0
10
mA
Typ.
Junction temperature
TJ
25
mA
250
mW
125
Tamb
- 30
+ 85
Tstg
- 30
+ 85
260
IIRED (DC)
80
mA
IIRED (RP)
400
mA
Max
Unit
PD
Min
Parameter
2.6
IEC60825-1 or
EN60825-1, edition Jan. 2001
operating below the absolute
maximum ratings
Ie
*) Due
**)
Test Conditions
Typ.
mm
*)
(500)**)
mW/sr
to the internal limitation measures the device is a "class1" device under all conditions
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy: 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with the physical layer standard IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard.
IrPhy 1.3 extended the Low Power Option to MIR and FIR and VFIR was added with IrPhy 1.4. A new version of the standard in any case
obsoletes the former version.
Note: We apologize to use sometimes in our documentation the abbreviation LED and the word Light Emitting Diode instead of Infrared
Emitting Diode (IRED) for IR-emitters. That is by definition wrong; we are here following just a bad trend.
Typical values are for design aid only, not guaranteed nor subject to production testing and may vary with time.
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173
TFDU4101
Vishay Semiconductors
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions/Pins
Supply voltage
Symbol
Min
VCC1
2.4
Typ.
Max
Unit
5.5
130
SD = Low, Ee = 1 klx*),
Tamb = - 25 C to + 85 C
VCC1 = VCC2 = 2.4 V to 5.5 V
ICC1
90
SD = Low, Ee = 1 klx*),
Tamb = 25 C
VCC1 = VCC2 = 2.4 V to 5.5 V
ICC1
75
ICC
0.65
mA
SD = High, T = 25 C, Ee = 0 klx
No signal, no resistive load
ISD
0.1
SD = High, T = 70 C
No signal, no resistive load
ISD
SD = High, T = 85 C
No signal, no resistive load
ISD
TA
- 30
+ 85
Cload = 15 pF
VOL
- 0.5
0.15 x
VCC1
VOH
0.8 x VCC1
VCC1 + 0.5
VOH
0.9 x VCC1
VCC1 + 0.5
RRXD
400
600
k:
500
VIL
- 0.5
0.5
VIH
0.8 x VCC1
VIH
VCC1 - 0.5
IICH
-2
+2
IIrTX
+ 150
1
A
A
pF
-1
CI
Standard Illuminant A
**)
The typical threshold level is 0.5 x VCC1. It is recommended to use the specified min/max values to avoid increased operating current.
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174
TFDU4101
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Minimum irradiance Ee in
angular range**) SIR mode
Minimum irradiance Ee in
angular range
O = 850 nm to 900 nm
Symbol
Min
Typ.
Max
Unit
Ee
4
(0.4)
20
(2)
35*)
(3.5)
mW/m2
(W/cm2)
Ee
5
(500)
kW/m2
(W/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
20
100
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
20
100
ns
t PW
1.65
3.0
250
ns
500
150
Latency
*)
tL
2.2
100
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical power delivered to the detector by a source operating at
the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link
errors. If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification.
For more definitions see the document Symbols and Terminology on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
www.vishay.com
175
TFDU4101
Vishay Semiconductors
Optoelectronic Characteristics, continued
Transmitter
Tamb = 25 C, VCC1 =VCC2 = 2.4 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
IRED operating current,
switched current limiter
Test Conditions
No external resistor for current
Symbol
Min
Typ.
Max
Unit
ID
250
300
350
mA
1.8
1.9
limitation*)
Vf
1.4
IIRED
-1
48
D = 0, 15
TXD = High, SD = Low
Ie
VCC1 = 5.0 V, D = 0, 15
TXD = Low or SD = High (Receiver is
inactive as long as SD = High)
Ie
Op
Spectral bandwidth
'O
24
880
mW/sr
deg
900
45
nm
nm
tropt,
tfopt
10
300
ns
tTXD
- 0.15
tTXD
+ 0.15
300
25
topt
topt
Optical overshoot
mW/sr
0.04
65
20
*)
Using an external current limiting resistor is allowed and recommended to reduce IRED intensity and operating current when current
reduction is intended to operate at the IrDA low power conditions.
E.g. for VCC2 = 3.3 V a current limiting resistor of Rs = 56 : will allow a power minimized operation at IrDA low power conditions.
**)
Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for the
standard Remote Control applications with codes as e. g. Philips RC5/RC6 or RECS 80.
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176
TFDU4101
Vishay Semiconductors
Recommended Circuit Diagram
Operated with a clean low impedance power supply
the TFDU4101 needs no additional external components. However, depending on the entire system
design and board layout, additional components may
be required (see figure 1). That is especially the case
when separate power supplies are used for bench
tests. When using compact wiring and regulated supplies as e. g. in phone applications in most cases no
external components are necessary.
VIRED
R1 *)
VCC
R2
C1
GND
VCC2 , IRED A
VCC1
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
IRED C
20037
Table 1.
Recommended Tests and Application Circuit Components
Component
Recommended Value
C1
4.7 F, 16 V
C2
0.1 F, Ceramic
R1
depends on current to be adjusted, e. g. with VCC2 = 3.3 V 56 : is an option for minimum low power operation
R2
47 :, 0.125 W
CRCW-1206-47R0-F-RT1
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177
TFDU4101
Vishay Semiconductors
Figure 2 shows an example of a typical application
with a separate supply voltage VS and using the
transceiver with the IRED Anode connected to the
unregulated battery Vbatt. This method reduces the
peak load of the regulated power supply and saves
therefore costs. Alternatively all supplies can also be
tied to only one voltage source. R1 and C1 are not
used in this case and are depending on the circuit
design in most cases not necessary.
In figure 2 an option is shown to operate the transmitter at two different power levels to switch for long
range to low power mode for e.g. saving power for
IrDA application but use the full range specification for
Remote Control. The additional components are
marked in the figure.
For operating at RS232 ports TOIM4232 is recommended as ENDEC.
Vbatt | 3 V
Hi/Low
C1
R1
Vs = 2.8 V
Vdd
IRTX
IRRX
IR MODE
R2
C2
GND (8)
20038
90
85
80
75
70
65
60
55
50
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
18097
Table 2.
Truth table
Inputs
Remark
TXD
RXD
Transmitter
high
> 1 ms
weakly pulled
(500 k:) to VCC1
Shutdown
low
high < 50 s
low active
Ie
Transmitting
high > 50 s
high inactive
Protection is active
low
<4
high inactive
low
low (active)
Response to an IrDA
compliant optical input signal
low
undefined
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178
Outputs
SD
Operation
TFDU4101
Vishay Semiconductors
Recommended Solder Profiles
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 C
240 C max.
2...4 C/s
160 C max.
120 s...180 s
90 s max.
2...4 C/s
275
T 255 C for 10 s....30 s
250
225
0
50
100
19535
150
200
250
300
350
Tpeak = 260 C
200
Time/s
Temperature/C
Temperature (C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
260
240
220
200
180
Temperature/C
2 C...3 C/s
50
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Document Number 81288
Rev. 1.0, 26-Sep-06
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179
TFDU4101
Vishay Semiconductors
Package Dimensions in mm
7x1=7
0.6
2.5
1
8
1
18470
Figure 7. Package drawing TFDU6103, dimensions in mm, tolerance 0.2 mm if not otherwise mentioned
www.vishay.com
180
TFDU4101
Vishay Semiconductors
20035
Figure 8. Recommended footprint for side view applications and solderpaste mask
20036
Figure 9. Recommended footprint for top view applications and solderpaste mask
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181
TFDU4101
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
24
330
60
24.4
30.4
23.9
27.4
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182
W3 max.
TFDU4101
Vishay Semiconductors
Tape Dimensions
19824
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Figure 10. Tape drawing, TFDU6103 for top view mounting, tolerance 0.1 mm
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183
TFDU4101
Vishay Semiconductors
Tape Dimensions
19875
Drawing-No.: 9.700-5297.01-4
Issue: 1; 04.08.05
Figure 11. Tape drawing, TFDU6103 for side view mounting, tolerance 0.1 mm
www.vishay.com
184
TFDU4202
Vishay Semiconductors
18170
Features
Package dimension:
L 7.1 mm x W 4.7 mm x H 2.8 mm
Compatible to latest IrDA IrPHY standard
e3
CIR Remote Control operation:
Typical transmission range 8 m using standard
RC-receivers. Receives RC-commands with
typical specified sensitivity.
SMD Side View
Lowest power consumption 65 A, receive mode,
0.01 A Shutdown
Built-in current limitation
Output intensity adjustable by external resistor
Wide supply voltage range (2.4 V to 5.5 V)
Split power supply
Operational down to 2.0 V
Fewest external components
Applications
Mobile Phones
Pagers
Personal Digital Assistants (PDA)
Handheld Battery Operated Equipment
Parts Table
Part
Description
Qty / Reel
TFDU4202-TR1
750 pcs
TFDU4202-TR3
2250 pcs
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185
TFDU4202
Vishay Semiconductors
Functional Block Diagram
Tri-State-Driver
RXD
Comparator
Amplifier
Control
Logic
Vccp
TXD
Control
Controlled Driver
18190
VCC
GND
Pin Description
Pin Number
Function
Description
1
2
3
4
5
6
7
8
IRED GND
IRED GND
RXD
VCCP
GND
GND
TXD
VCC
I/O
Active
low
I
I
high
high
Pinout
TFDU4202
weight 100 mg
18228
Test Conditions
2.4 V dVCC d 6 V
all pins
Min
VCC
Vccp
- 0.5
- 0.5
Max
Unit
6
6
10
25
200
125
85
V
V
mA
mA
mW
C
C
Ptot
TJ
Tamb
- 25
Tstg
- 40
100
260
C
C
IIRED(DC)
125
mA
IIRED(RP)
500
mA
Symbol
Typ.
VTXD
- 0.5
V RXD
- 0.5
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186
TFDU4202
Vishay Semiconductors
Eye safety information
Parameter
Virtual source size
Test Conditions
Method: (1 - 1/e) encircled
energy
Symbol
Min
Typ.
Max
Unit
mm
Compatible to Class 1 operation of IEC 60825 or EN60825 with worst case IrDA SIR pulse pattern, 115.2 kbit/s
Electrical Characteristics
Transceiver
Tested for the following parameters (VCC = 2.4 V to 5.5 V, - 25 C to + 85 C, unless otherwise stated).
Parameter
Supported data rates
Test Conditions
Symbol
base band
Min
Typ.
9.6
VCC
Max
Unit
115.2
kbit/s
5.5
Supply current
IS
65
100
IS
70
100
IS
ISshdown
0.02
Ie = 40 mW/sr, no external
resistor, Vccp = 2.7 V,
SIR standard
2.4
IStr
mA
360
mA
ms
Optoelectronic Characteristics
Receiver
Tested for the following parameters (VCC = 2.4 V to 5.5 V, - 25 C to + 85 C, unless otherwise stated).
Parameter
Test Conditions
Symbol
| D | d 15 ,
VCC = 2.4 V to 5.5 V
2.0 V, 25 C tested
Ee, min
| D | d 90 , VCC = 5 V
Ee, max
| D | d 90 , VCC = 3 V
Logic low receiver input
irradiance
Min
Ee, min
Ee, max
Typ.
Max
Unit
25
(2.5)
50
(5)
mW/m2
50
100
3300
(330)
5000
(500)
8000
(800)
15000
(1500)
Ee, max,low
W/m2
W/m2
(mW/cm2)
4
(0.4)
VOL
non active, C = 15 pF
VOH
VCC - 0.5
C = 15 pF, R = 2.2 k:
tr
mW/m2
(W/cm2)
W/m2
active, C = 15 pF
mW/m2
(mW/cm2)
Ee, max,low
Output voltage RXD
(W/cm2)
20
0.5
mA
70
ns
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187
TFDU4202
Vishay Semiconductors
Symbol
Min
Parameter
C = 15 pF, R = 2.2 k:
Test Conditions
tf
20
Typ.
70
ns
tp
1.41
20
tp
1.41
4.5
output level =
tdl
tj
400
ns
tdt
6.5
0.1
ms
100
200
Max
Unit
tL
Transmitter
Symbol
Min
Max
Unit
Parameter
Test Conditions
VIL(TXD)
- 0.5
0.15 x VCC
VIH(TXD)
0.8 x VCC
Ie
45
Op
850
Typ.
mW/sr
900
1.5
1.6
Overshoot, optical
Rising edge peak to peak jitter
nm
60
tj
nm
200
ns
1.7
25
0.04
W/sr
25
0.2
Truth table
Inputs
TXD
RXD
low
low
high
high
high
Ie
Transmitter
high t 25 s
high
low
<4
high
low
low
undefined
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188
Outputs
VCC
TFDU4202
Vishay Semiconductors
Application Hints
The TFDU4202 does not need any external component when operated with a "clean" power supply. In a
more noisy ambient it is recommended to add a
capacitor C1 and a resistor R1 for noise suppression.
A combination of a tantalum with a ceramics capacitor
will be efficient to attenuate both, RF and LF. The
power supply Vccp must be able to source up to
550 mA current with a fast rise time. If that cannot be
guaranteed an additional capacitor near pin 4 (Vccp)
should be included. The value is depending on the
power supply quality. A good choice is between
4.7 F and 10 F.
Latency
The receiver is in specified conditions after the
defined latency.
In a UART related application after that time after the
last transmitted signal (IrDA specifies 500 s maximum for low power applications and 10 ms maximum
for standard) the receiver buffer of the UART must be
R1
C1
VCC
VCC
GND
5, 6 GND
RXD
RXD
TXD
TXD
VCCP
Vccp
R2
1, 2 IRED Cathode
18187
Table
Recommended Application Circuit Components
Component
Recommended Value
C1
4.7 F, 16 V
R1
5 : ( 2 : to 47 :)
This is a recommendation for a combination to start with to exclude power supply effects.
Optimum, from a costs point of view, to work without both.
90
85
80
75
70
65
60
55
50
2.0
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
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189
TFDU4202
Vishay Semiconductors
Recommended Solder Profiles
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 C
240 C max.
2...4 C/s
160 C max.
120 s...180 s
90 s max.
2...4 C/s
275
T 255 C for 10 s....30 s
250
225
0
50
19535
100
150
200
250
300
350
Tpeak = 260 C
200
Time/s
Temperature/C
Temperature (C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
260
240
220
200
180
Temperature/C
2 C...3 C/s
50
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
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190
TFDU4202
Vishay Semiconductors
Package Dimensions
19821
Drawing-No.: 6.550-5185.01-4
Issue: 5; 02.09.05
Figure 5. Package drawing, TFDU4202
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191
TFDU4202
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
mm
mm
mm
mm
mm
mm
mm
Tape Width
A max.
W1 min.
W2 max.
W3 min.
W3 max.
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
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192
TFDU4202
Vishay Semiconductors
Tape Dimensions
19820
Drawing-No.: 9.700-5227.01-4
Issue: 3; 03.09.99
Figure 6. Tape drawing, TFDU4202 for side view mounting
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193
TFDU4203
Vishay Semiconductors
18170
Features
Package dimension:
L 7.1 mm x W 4.7 mm x H 2.8 mm
Compatible to the latest IrDA IrPHY
e3
standard
CIR Remote Control operation:
Typical transmission range 8 m using standard
RC-receivers. Receives RC-commands
with typical specified sensitivity.
SMD side view
Lowest power consumption 65 A,
Receive Mode, 0.01 A shutdown current
Built-in current limitation
Output intensity adjustable beyond
IrDA Low Power
Supply voltage range 2.4 V to 5.5 V
Operational down to 2.0 V
Applications
Mobile phones
Pagers
Personal digital assistants (PDA)
Hand-held battery operated equipment
Parts Table
Part
Description
Qty / Reel
TFDU4203-TR1
750 pcs
TFDU4203-TR3
2250 pcs
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194
TFDU4203
Vishay Semiconductors
Functional Block Diagram
Vcc
Tri-State-Driver
RXD
Comparator
Amplifier
Control
&
Logic
TXD
Control
SD
Controlled Driver
19019
GND
Pin Description
Pin Number
Function
Description
1
2
IRED GND
IRED GND
3
4
5
6
7
8
RXD
VCC
GND
GND
TXD
SD
I/O
Active
Low
I
I
High
High
Pinout
TFDU4203
weight 100 mg
18228
Test Conditions
Min
VCC
- 0.5
Ptot
TJ
Tamb
- 25
Tstg
- 40
all pins
Symbol
IIRED(DC)
IIRED(RP)
VTXD
V RXD
- 0.5
- 0.5
Typ.
Max
Unit
+6
10
25
200
125
85
V
mA
mA
mW
C
C
100
260
125
500
6
6
mA
mA
V
V
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195
TFDU4203
Vishay Semiconductors
Eye safety information
Parameter
Virtual source size
(TFDU4203 only)
Test Conditions
Method: (1 - 1/e) encircled
energy
Symbol
Min
Typ.
Max
Unit
mm
Compatible to Class 1 operation of IEC 60825 or EN60825 with worst case IrDA SIR pulse pattern, 115.2 kbit/s
Electrical Characteristics
Transceiver
Parameter
Supported data rates
Test Conditions
Symbol
base band
Min
Typ.
9.6
Unit
kbit/s
5.5
Supply current
IS
65
100
IS
70
100
IS
ISshdown
0.02
VCC = 5.5 V, 20 C
ISshdown
10
nA
IStr
360
mA
ms
Ie = 40 mW/sr,
no external resistor
VCCP = 2.7 V, equivalent to SIR
standard
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196
VCC
Max
115.2
2.4
mA
TFDU4203
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tested for the following parameters (VCC = 2.4 V to 5.5 V, - 25 C to + 85 C, unless otherwise stated).
Parameter
Test Conditions
Symbol
| D | d 15 ,
VCC = 2.0 V to 5.5 V
2.0 V, 25 C tested
Ee, min
| D | d 90 , VCC = 5 V
Ee, max
| D | d 90 , VCC = 3 V
Logic low receiver input
irradiance
Output voltage RXD
Output current RXD
Min
Ee, min
Ee, max
Typ.
Max
Unit
25
(2.5)
50
(5)
mW/m2
50
100
3300
(330)
5000
(500)
8000
(800)
15000
(1500)
Ee, max,low
(W/cm2)
mW/m2
W/cm2
(W/cm2)
W/cm2
(W/cm2)
4
(0.4)
active, C = 15 pF
VOL
non active, C = 15 pF
VOH
VCC - 0.5
mW/m2
(W/cm2)
0.5
mA
ns
C = 15 pF, R = 2.2 k:
tr
20
70
C = 15 pF, R = 2.2 k:
tf
20
70
ns
tp
1.41
20
tp
1.41
4.5
output level =
tdl
tj
400
ns
tdt
6.5
0.1
ms
100
200
tL
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197
TFDU4203
Vishay Semiconductors
Transmitter
Parameter
Test Conditions
Symbol
Min
Max
Unit
VIL(TXD)
- 0.5
Typ.
0.15 x VCC
VIH(TXD)
0.8 x VCC
VIL(TXD)
0.5
0.81 x VCC
VIH(TXD)
0.8 x VCC
Ie
45
Op
880
voltage*)
Logic high shutdown input
voltage*)
Logic low transmitter input
voltage*)
Logic high transmitter input
voltage*)
Optical output radiant intensity
mW/sr
900
*)
nm
200
1.5
1.6
Overshoot, optical
Rising edge peak to peak jitter
nm
40
tj
ns
1.7
0.04
W/sr
25
0.2
Recommended logic levels for minimum shutdown current. The CMOS decision level is 0.5 x VCC.
**) Add external resistor for VCC > 4 V to prevent thermal overload, see Fig. 3.
Truth table
Inputs
Outputs
SD
TXD
RXD
Transmitter
high
low
low
low
low
low
x
high
high t 25 s
low
low
low
x
x
x
<4
> Min. Detection Threshold Irradiance
> Max. Detection Threshold Irradiance
floating
high
high
high
x
x
0
Ie
0
0
0
0
Application Hints
Latency
The TFDU4203 does not need any external components when operated with a "clean" power supply. In
a more noisy ambient it is recommended to add a
capacitor C1 (4.7 F Tantalum) and a resistor R1
(d 3 :) for noise suppression. In addition the capacitor is needed to prevent a pulse distortion when the
power supply is not able to generate the peak currents or inductive wiring is used. A combination of a
tantalum with a ceramics capacitor will be efficient to
attenuate both, RF and LF if RF noise is present. The
value is dependent on the power supply quality. A
good choice is between 4.7 F and 10 F.
Shut down
To shut down the TFDU4203 into a standby mode the
SD pin has to be set active.
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198
TFDU4203
Vishay Semiconductors
Recommended Circuit Diagram
SD
SD
GND
5, 6 GND
RXD
RXD
TXD
TXD
VCC
R1
Vcc
C1
1, 2 IRED Cathode
R2
18199
Recommended Value
C1
R1
4.7 F, 16 V
5 : max
This is a recommendation for a combination to start with to exclude power supply effects.
Optimum, from a costs point of view, to work without both.
90
85
80
75
70
65
60
55
50
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
18097
The temperature derating diagram shows the maximum operating temperature when the device is operated without external current limiting resistor. A power
dissipating resistor of 2 : is recommended from the
cathode of the IRED to Ground for supply voltages
above 4 V. In that case the device can be operated up
to 85 C, too.
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199
TFDU4203
Vishay Semiconductors
Recommended Solder Profiles
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 C
240 C max.
2...4 C/s
160 C max.
120 s...180 s
90 s max.
2...4 C/s
275
T 255 C for 10 s....30 s
250
225
0
50
19535
100
150
200
250
300
350
Tpeak = 260 C
200
Time/s
Temperature/C
Temperature (C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
260
240
220
200
180
Temperature/C
2 C...3 C/s
50
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
50
100
150
200
250
300
Time/s
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
www.vishay.com
200
TFDU4203
Vishay Semiconductors
Package Dimensions
19821
Drawing-No.: 6.550-5185.01-4
Issue: 5; 02.09.05
Figure 5. Package drawing, TFDU4203
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201
TFDU4203
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
mm
mm
mm
mm
mm
mm
mm
Tape Width
A max.
W1 min.
W2 max.
W3 min.
W3 max.
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
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202
TFDU4203
Vishay Semiconductors
Tape Dimensions
19820
Drawing-No.: 9.700-5227.01-4
Issue: 3; 03.09.99
Figure 6. Tape drawing, TFDU4203 for side view mounting
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203
TFDU4300
Vishay Semiconductors
20101
Features
Compliant to the latest IrDA physical
layer specification (9.6 kbit/s to
115.2 kbit/s) and TV Remote Control,
bi-directional operation included.
e3
Operates from 2.4 V to 5.5 V within
specification over full temperature range from 30 C to + 85 C
Logic voltage 1.5 V to 5.5 V is independent of
IRED driver and analog supply voltage
Split power supply, transmitter and receiver can be
operated from two power supplies with relaxed
requirements saving costs, US Patent No.
6,157,476
Extended IrDA Low Power range to about 70 cm
Typical Remote Control range 12 m
Low power consumption
(< 0.12 mA supply current)
Power shutdown mode (< 5 A shutdown current
in full temperature range, up to 85 C)
Applications
Ideal for battery operated applications
Telecommunication products
(cellular phones, pagers)
Digital still and video cameras
Printers, fax machines, photocopiers, screen
projectors
Medical and industrial data collection
Diagnostic systems
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204
TFDU4300
Vishay Semiconductors
Parts Table
Part
Description
TFDU4300-TR1
Qty / Reel
750 pcs
TFDU4300-TR3
2500 pcs
TFDU4300-TT1
750 pcs
TFDU4300-TT3
2500 pcs
VCC1
Push-Pull
Driver
Amplifier
Comparator
RXD
VCC2
SD
TXD
Logic
&
Controlled Driver
Control
RED C
GND
18282
Pin Description
Pin Number
Function
Description
VCC2
IRED Anode
I/O
Active
IRED Cathode
TXD
HIGH
RXD
LOW
SD
HIGH
VCC1
Supply Voltage
Vlogic
Vlogic defines the logic voltage level of the I/O ports to adap the logic
voltage swing to the IR controller. The RXD output range is from 0
V to Vlogic, for optimum noise suppression the inputs- logic decision
level is 0.5 x Vlogic
GND
Ground
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205
TFDU4300
Vishay Semiconductors
Pinout
Definitions:
TFDU4300
weight 75 mg
18101
5
6
1
2
3
4
8
7
IRED A IRED C TXD RXD SD Vcc Vlog GND
version.
With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
+ 6.0
VCC2
- 0.5
+ 6.0
Vlogic
- 0.5
+ 6.0
VRXD
- 0.5
Vlogic + 0.5
VIN
- 0.5
+ 6.0
10
mA
Input current
Junction temperature
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206
mA
mW
125
- 30
+ 85
Tstg
- 40
+ 100
260
IIRED(DC)
125
mA
IIRED(RP)
600
mA
25
250
Tamb
TJ
PD
Typ.
TFDU4300
Vishay Semiconductors
Eye safety information
Symbol
Min
Typ.
Parameter
1.3
1.8
Ie
*)
Test Conditions
Max
Unit
*)
mW/sr
mm
(500)**)
Due to the internal limitation measures the device is a "class 1" device under all conditions.
**)
Note: We apologize to use sometimes in our documentation the abbreviation LED and the word Light Emitting Diode instead of Infrared
Emitting Diode (IRED) for IR-emitters. That is by definition wrong; we are here following just a bad trend.
Typical values are for design aid only, not guaranteed nor subject to production testing and may vary with time.
Electrical Characteristics
Transceiver
Tested at Tamb = 25 C, VCC1 = VCC2 = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Supply voltage
Parameter
Test Conditions
VCC1
2.4
Typ.
Max
Unit
5.5
SD = Low, Ee = 1 klx*),
Tamb = - 25 C to + 85 C,
VCC1 = VCC2 = 2.7 V to 5.5 V
ICC1
90
130
SD = Low, Ee = 1 klx*),
Tamb = 25 C,
VCC1 = VCC2 = 2.7 V to 5.5 V
ICC1
75
Ilog
ICC1
0.65
mA
SD = High, T = 25 C, Ee = 0 klx
SD = High, T = 70 C
SD = High, T = 85 C
no signal, no load
- 30
- 0.5
0.1
2
3
1
+ 85
0.15 x
Vlogic
A
A
A
A
C
V
V
CLoad = 15 pF
ISD
ISD
ISD
I log
TA
VOL
IOH = - 500 A
VOH
0.8 x Vlogic
Vlogic + 0.5
VOH
0.9 x Vlogic
Vlogic + 0.5
RRXD
400
600
k:
VIL
VIH
- 0.5
Vlogic - 0.5
0.5
6
V
V
500
VIH
0.8 x Vlogic
IICH
IIRTx
-2
+2
+ 150
A
A
IIRTx
-1
pF
CIN
Standard illuminant A
**)
To provide an improved immunity with increasing Vlogic the typical threshold level is increasing with Vlogic and set to 0.5 x Vlogic. It is
recommended to use the specified min/max values to avoid increased operating current.
Document Number 82614
Rev. 1.5, 03-Jul-06
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207
TFDU4300
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tested at Tamb = 25 C, VCC1 = VCC2 = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Typ.
Max
Unit
Ee
40
(4)
80
(8)
mW/m2
(W/cm2)
O = 850 nm - 900 nm
Ee
5
(500)
O = 850 nm - 900 nm
tr, tf < 40 ns,
tpo = 1.6 s at f = 115 kHz,
no output signal allowed
Ee
10 % to 90 %, CL = 15 pF
tr(RXD)
20
100
90 % to 10 %, CL = 15 pF
tf(RXD)
20
100
ns
tPW
1.65
3.0
Minimum irradiance Ee in
angular range **)
Maximum Irradiance Ee In
Angular Range ***)
Maximum no detection
irradiance
Test Conditions
RXD pulse width of output signal input pulse length > 1.2 s
Symbol
Min
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(W/cm2)
2.0
ns
250
ns
150
150
Latency
*)
tL
100
Equivalent to IrDA Background Light and Electromagnetic Field Test: Fluorescent Lighting Immunity.
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angular range at the maximum Link
Length.
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the
maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible ralated link errors.
If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER). For more definitions see the document Symbols and Terminology on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
Transmitter
Tested at Tamb = 25 C, VCC1 = VCC2 = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
ID
Vf
IIRED
Ie
Op
Max
Unit
300
1.8
350
1.9
1
mA
V
A
mW/sr
0.04
mW/sr
900
nm
65
24
880
'O
Spectral bandwidth
Optical overshoot
Typ.
Ie
Min
250
1.4
-1
30
45
tropt, tfopt
input pulse width 1.6 < tTXD < 20 s
topt
topt
nm
100
tTXD-0.15
20
ns
tTXD +
300
25
*)
Using an external current limiting resistor is allowed and recommended to reduce IRED intensity and operating current when current
reduction is intended to operate at the IrDA low power conditions. E.g. for VCC2 = 3.3 V a current limiting resistor of RS = 56 :
will allow a power minimized operation at IrDA low power conditions.
**)
Note: Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for
the standard Remote Control applications with codes as e.g. Phillips RC5/RC6 or RECS 80.
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208
TFDU4300
Vishay Semiconductors
Recommended Circuit Diagram
Operated with a clean low impedance power supply
the TFDU4300 needs no additional external components. However, depending on the entire system
design and board layout, additional components may
be required (see figure 1).
VIRED
R1 *)
VCC2, IRED A
VCC
R2
VCC1
C1
GND
C2
Ground
Vlogic
Vlogic
SD
SD
TXD
TXD
RXD
RXD
IRED C
19295
Table 1.
Recommended Application Circuit Components
Compo
nent
Recommended Value
C1
4.7 F, 16 V
C2
0.1 F, Ceramic
R1
depends on current to be
adjusted
R2
47 :, 0.125 W
CRCW-1206-47R0-F-RT1
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209
TFDU4300
Vishay Semiconductors
19296
90
85
80
75
70
65
60
55
50
2.0
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Outputs
Remark
SD
TXD
RXD
Transmitter
Operation
high
> 1 ms
weakly pulled
(500 k:) to VCC1
Shutdown
low
high
high inactive
Ie
Transmitting
low
high
> 50 s
high inactive
Protection is active
low
low
<4
high inactive
low
low
low (active)
low
low
undefined
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210
TFDU4300
Vishay Semiconductors
Recommended Solder Profiles
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 C
240 C max.
2...4 C/s
160 C max.
120 s...180 s
90 s max.
2...4 C/s
275
T 255 C for 10 s....30 s
250
225
0
50
100
19535
150
200
250
300
350
Tpeak = 260 C
200
Time/s
Temperature/C
Temperature (C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
260
240
220
200
180
Temperature/C
2 C...3 C/s
50
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
50
100
150
200
250
300
Time/s
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Document Number 82614
Rev. 1.5, 03-Jul-06
www.vishay.com
211
TFDU4300
Vishay Semiconductors
Package Dimensions in mm
19700
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212
TFDU4300
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
W3 max.
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213
TFDU4300
Vishay Semiconductors
Tape Dimensions in mm
19855
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
Figure 7. Tape drawing, TFDU4300 for top view mounting
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214
TFDU4300
Vishay Semiconductors
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
Figure 8. Tape drawing, TFDU4300 for side view mounting
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215
Vishay Semiconductors
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216
Contents
TFBS5700..............................218
TFBS5711..............................230
TFDU5307 ............................. 242
MIR
(9.6 kbit/s to 1.15 Mbit/s)
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217
TFBS5700
Vishay Semiconductors
20207
Features
IrDA IrPHY 1.4 compliant
9.6 kbit/s to 1.152 Mbit/s
range > 50 cm, exceeding the low
e4
power standard
Wide operating voltage range 2.4 V
to 3.6 V
I/O compatible to 1.8 V logic voltage
Low power consumption
Supply current in receive mode, Idle: 550 A
Small package L 6.8 mm x W 2.8 mm x H 1.6 mm
Applications
Mobile phone
Smart phone
PDAs
POS Terminals/Vending
Battery Operated IrDA applications
Parts Table
Part
TFBS5700-TR3
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218
Description
Qty/Reel
2500 pcs
TFBS5700
Vishay Semiconductors
Functional Block Diagram
VCC
Tri-state
Driver
PD
Amplifier
Comparator
RXD
IRED
SD
Mode
Control
IREDA
IRED Driver
TXD
ASIC
GND
19291
Pin Description
Pin Number
Function
Description
IRED A
I/O
Active
TXD
HIGH
RXD
LOW
SD
Shutdown. Also used for setting the output pulse duration. Setting this pin
active for more than 1.5 ms places the module into shutdown mode. Before
that (t < 0.7 ms) on the falling edge of this signal, the state of the TXD pin
is sampled and used to set the receiver output to long pulse duration (2 s)
or to short pulse duration (0.4 s) mode. The input threshold voltage adapts
to and follows the internal logic voltage reference of 1.8 V
HIGH
VCC
Power Supply. Receives power supply 2.4 V to 3.6 V. This pin provides
power for the receiver and transmitter drive section.
GND
Ground
Pinout
Definitions:
19290
Low Power Option to MIR and FIR and VFIR was added with IrPhY
1.4. A new version of the standard in any case obsoletes the former
version.
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219
TFBS5700
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin, GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
VCC2
- 0.5
6.5
- 0.5
Typ.
5.5
Power dissipation
PD
350
mW
Junction temperature
TJ
125
Tamb
- 30
+ 85
Tstg
- 40
+ 100
260
IIRED (DC)
125
mA
IIRED (RP)
500
Method:
(1-1/e) encircled energy
IEC60825-1 or
EN60825-1,
edition Jan. 2001
Ie
0.8
mA
mm
*)
mW/sr
(500)**)
ESD protection
ESD protection on all pins
Latch up
*)
kV
| 100|
mA
**)
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220
TFBS5700
Vishay Semiconductors
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
ICC
550
Receiving
SD = Low, 1 Mbit/s,
ICC
0.75
ISD
ISD
VOL
VOH
IOH = 0 A, Cload = 15 pF
VOH
RRXD
400
VIL
- 0.5
VIH
1.3
IS-SD,
IIN-SD
- 1.1
tSDPW
0.2
900
A
mA
Ee = 100 mW/m2
Dark ambient
Shutdown supply current at
maximum operating
temperature
Operating temperature range
0.01
TA
CI
- 25
1.0
5.0
PA
+ 85
0.4
1.44
V
1.98
800
k:
0.5
1.8
2.2
10
300
pF
500
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221
TFBS5700
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Minimum irradiance Ee in
angular range **)
SIR mode
Ee
Minimum irradiance Ee in
angular range **)
MIR mode
1.152 Mbit/s
O = 850 nm to 900 nm
Ee
Maximum irradiance Ee in
angular range ***)
O = 850 nm to 900 nm
Ee
Ee
Min
Typ.
Max
Unit
50
(5)
81
(8.1)
mW/m2
50
(5)
140
(14)
5
(500)
(W/cm2)
mW/m2
(W/cm2)
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(W/cm2)
300
400
500
ns
10 % to 90 %, CL = 15 pF
tr (RXD)
10
27
60
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
10
17
60
ns
tPW
1.7
2.0
2.9
70
ns
350
ns
Standby/shutdown delay
1.5
ms
Shutdown active time window for During this time the pulse
programming
duration of the output can be
programmed to the application
mode. see chapter
Programming
600
250
200
0.6
Latency
tL
50
Note: All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header.
The data given here are valid 5 s after starting the preamble.
*)
This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent
lamps
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length.
***) Maximum Irradiance E In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the
e
maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors.
If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification.
For more definitions see the document Symbols and Terminology on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
1)
Some ENDECs are not able to decode short pulses as valid SIR pulses. Therefore this additional mode was added in TFBS5700.
TFBS5700 is set to the "short output pulse" as default after power on, also after recovering from the shutdown mode (SD must have been
longer active than 1.5 ms). For mode changing see the chapter "Programming".
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222
TFBS5700
Vishay Semiconductors
Transmitter
Tamb = 25 C, VCC = 2.4 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
TXD = 0 V, Tamb = 25 C
TXD = 0 V, Tamb = 85 C
Symbol
Typ.
Max
Unit
ID
200
600
mA
IIRED
200
1
pA
A
500
mW/sr
0.04
mW/sr
Ie
Ie
Op
'O
Min
25
60
880
900
nm
45
tropt,
tfopt
10
topt
180
topt
topt
217
Optical overshoot
nm
40
ns
240
ns
tTXD
85
s
s
25
*) Note: Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for
the standard Remote Control applications with codes as e.g. Philips RC5/RC6 or RECS 80. When operated under IrDA full range conditions (> 120 mW/sr) the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control receivers
are used.
**) Typ. conditions for If = 200 mA, VCC2 = 2.9 V, Rs = 4.7 :
Table 1.
Truth table
Inputs
Outputs
Remark
SD
TXD
RXD
Transmitter
Operation
high
< 600 s
weakly pulled
(500 k:) to VCC1
high
> 1.5 ms
weakly pulled
(500 k:) to VCC1
Shutdown
low
high
low (active)
Ie
Transmitting
low
high inactive
Protection is active
low
low
<4
high inactive
low
low
low (active)
Response to an
IrDA compliant
optical input signal
low
low
undefined
Overload conditions
can cause
unexpected outputs
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223
TFBS5700
Vishay Semiconductors
Recommended Circuit Diagram
Operated at a clean low impedance power supply the
TFBS5700 needs only one additional external component for setting the IRED drive current. However,
depending on the entire system design and board layout, additional components may be required (see
figure 1).
V cc2
R1
V cc1
R2
C1
GND
IRED Anode
V cc
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
19297
Table 2.
Recommended Application Circuit Components
Component
Recommended Value
C1, C2
0.1 F, Ceramic
Vishay part# VJ 1206 Y 104 J XXMT
R1
R2
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224
TFBS5700
Vishay Semiconductors
I/O and Software
Simplified Method
In the description, already different I/Os are mentioned. Different combinations are tested and the
function verified with the special drivers available
from the I/O suppliers. In special cases refer to the
I/O manual, the Vishay application notes, or contact
directly Vishay Sales, Marketing or Application.
50 %
SD
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
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225
TFBS5700
Vishay Semiconductors
Recommended Solder Profiles
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
260
10 s max. at 230 C
240 C max.
240
220
2...4 C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
280
T 255 C for 20 s max
260
240
T 217 C for 50 s max
220
200
180
Temperature/C
Temperature/C
160 C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 C...4 C/s
80
60
2 C...4 C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
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226
TFBS5700
Vishay Semiconductors
Package Dimensions in mm
19325_1
19294
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227
TFBS5700
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
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228
W3 max.
TFBS5700
Vishay Semiconductors
Tape Dimensions in mm
19286
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229
TFBS5711
Vishay Semiconductors
20208
component required in implementing a complete solution. TFBS5711 has a tri-state output and is floating in
shut-down mode with a weak pull-up.
Features
Compliant to the latest IrDA physical
layer low power specification (up to
1.152 Mbit/s) and TV Remote Control
e4
Operates from
2.7 V to 5.5 V within specification
Industries smallest footprint
- 6.0 mm length
- 1.9 mm height
Low Power Consumption (typ. 0.55 mA
Supply Current in receive mode, no signal)
Power Shutdown Mode (< 5 PA Shutdown Current
in Full Temperature Range, up to 85 C)
Surface Mount Package, low profile (1.9 mm)
Universal (L 6.0 mm x W 3.1 mm x H 1.9 mm)
Applications
Telecommunication Products
(Cellular Phones, Pagers)
Digital Still and Video Cameras
Printers, Fax Machines, Photocopiers,
Screen Projectors
Medical and Industrial Data Collection
Parts Table
Part
Description
Qty / Reel
TFBS5711-TR1
1000 pcs
TFBS5711-TR3
2500 pcs
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230
TFBS5711
Vishay Semiconductors
Functional Block Diagram
VCC1
Tri-State
Driver
Amplifier
Comparator
RXD
VCC2
Controlled
Driver
Logic
&
SD
TXD
Control
GND
18512
Pinout
TFBS5711
weight 50 mg
PIN 1
19428
Function
Description
VCC2
IRED Anode
I/O
Active
TXD
HIGH
RXD
LOW
SD
Shutdown, also used for setting the output pulse duration. Setting
this pin active for more than 1.5 ms places the module into
shutdown mode. Before that (t < 0.7 ms) on the falling edge of this
signal, the state of the TXD pin is sampled and used to set the
receiver output to long pulse duration (2 s) or to short pulse
duration (0.4 s) mode
HIGH
VCC1
Supply Voltage
GND
Ground
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231
TFBS5711
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Ground (Pin 6) unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.3
Typ.
+ 6.0
VCC2
- 0.3
+ 6.5
Input currents
10
mA
PD
125
- 25
+ 85
Tstg
- 25
+ 85
240
IIRED(DC)
125
mA
IIRED(RP)
600
mA
V
TJ
mA
mW
Tamb
Junction temperature
Ambient temperature range
(operating)
25
500
VIREDA
- 0.5
+ 6.5
Vin
- 0.5
+ 5.5
50
pF
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the Low
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4.A new version of the standard in any case obsoletes the former version.
With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version IrPhy 1.4
(in Oct. 2002).
Min
Typ.
Parameter
1.3
1.5
IEC60825-1 or EN60825-1,
edition Jan. 2001, operating
below the absolute maximum
ratings
Ie
*)
Test Conditions
Max
Unit
mm
mW/sr
*)
(500)**)
Due to the internal limitation measures the device is a "class 1" device.
**)
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232
TFBS5711
Vishay Semiconductors
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC1 = VCC2 = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC1
2.7
Typ.
Max
Unit
5.5
SD = Low, Ee = 1 klx
ICC
550
900
ICC
1100
1500
SD = High, T = 25 C, Ee = 0 klx
ISD
SD = High, T = 25 C,
ISD
2.5
SD = High, T = 85 C, not
ambient light sensitive
ISD
+ 85
VOL
0.4
IOH = - 500 A
VOH
0.8 x VCC1
VOH
0.9 x VCC1
RRXD
400
Ee = 1 klx*)
TA
- 25
V
V
500
600
k:
V
VIL
- 0.5
0.5
VIH
VCC1 - 0.5
VCC1 + 0.5
IICH
-2
+2
IIRTx
+ 150
IIRTx
pF
CMOS level**)
-1
CIN
*)
Standard illuminant A
**)
The typical threshold level is 0.5 x VCC1. It is recommended to use the specified min/max values to avoid increased operating current
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC1 = VCC2 = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Typ.
Max
Unit
Parameter
Test Conditions
Ee
100
(10)
150
(15)
mW/m2
O = 850 nm - 900 nm
Ee
5
(500)
Symbol
Ee
Min
(W/cm2)
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(W/cm2)
10 % to 90 %, CL = 15 pF
tr(RXD)
20
60
90 % to 10 %, CL = 15 pF
tf(RXD)
20
60
ns
tPW
300
400
500
ns
tPW
1.7
2.0
2.9
ns
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233
TFBS5711
Vishay Semiconductors
Parameter
Stochastic jitter, leading edge
Max
Unit
Test Conditions
Symbol
Min
Typ.
80
ns
350
ns
1.5
ms
600
300
200
Latency
0.6
tL
*)
Some ENDECs are not able to decode short pulses as valid SIR pulses. Therefore this additional mode was added in TFDU5307.
TFDU5307 is set to the "short output pulse" as default after power on, also after recovering from the shutdown mode (SD must have been
longer active than 1.5 ms). For mode changing see the chapter "Programming"
Transmitter
Tamb = 25 C, VCC1 = VCC2 = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Min
IIRED
-1
IF = 250 mA, D = 0 ,
D = 15 , VCC2 = 2.7 V,
TXD = High, SD = Low
Ie
10
VCC1 = 5.0 V, D = 0 , 15
TXD = Low or SD = High
(Receiver is inactive as long as
SD = High)
Ie
ID
Op
Spectral bandwidth
'O
Optical overshoot
Max
Unit
400
500
mA
25
mW/sr
0.04
Typ.
24
880
mW/sr
900
45
nm
nm
tropt, tfopt
10
topt
200
topt
20
tTXD
topt
20
85
25
217
40
ns
240
ns
*)
Note: Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for
the standard Remote Control applications with codes as e.g. Phillips RC5/RC6 or RECS 80. With the typical specified intensity an RC
operating range of about 4 m can be expected.
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234
TFBS5711
Vishay Semiconductors
Recommended Circuit Diagram for
IrDA and Remote Control Operation
In general Vishay transceivers are using the identical
circuit for IrDA and Remote Control operation. For
using the IrDA transceiver as an RC transmitter no
change of the operating circuit is necessary. Used
with a clean low impedance power supply the
TFBS5711 only needs an external series current limiting resistor. However, depending on the entire system design and board layout, additional external
components may be required (see figure 1).
V2
R1
V1
R2
VCC1
C1
C3
C2
GND
Ground
SD
SD
Txd
Txd
Rxd
Rxd
18560
Table 1.
Recommended Application Circuit Components
Component
Recommended Value
C1
4.7 F, 16 V
C2
0.1 F, Ceramic
R1
R2
47 :, 0.125 W
CRCW-1206-47R0-F-RT1
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235
TFBS5711
Vishay Semiconductors
I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the
function verified with the special drivers available
from the I/O suppliers. In special cases refer to the I/
O manual, the Vishay application notes, or contact
directly Vishay Sales, Marketing or Application.
Programming
Pulse duration Switching
After Power-on the TFBS5711 is in the default short
RXD pulse duration mode.
Some ENDECs are not able to decode short pulses
as valid SIR pulses. Therefore an additional mode
with extended pulse duration (same as in standard
SIR transceivers) is added in TFBS5711. TFBS5711
is set to the "short output pulse" as default after power
on, and after recovering from the shutdown mode (SD
being active longer than 1.5 ms).
To switch the transceivers from the short RXD pulse
duration mode to the long pulse duration mode and
vice versa, follow the procedure described below.
SD
50 %
ts
th
High:
TXD 50 %
400 ns
50 %
Low:
2 s
18150
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236
Simplified Method
Setting the device to the long pulse duration is simply
applying a short active (less than 600 Ps) pulse to SD
(TXD = Low). In any case a short SD pulse will force
the device to leave the default mode and go the compatibility mode. Vice versa applying a 1.5 ms (minimum) pulse at SD will cause the device to go back to
the default mode by activating a power-on-reset and
setting the device to the default short pulse mode.
This simplified method takes more time but may be
easier to handle.
TFBS5711
Vishay Semiconductors
Table 2.
Truth table
Inputs
Outputs
Remark
SD
TXD
RXD
Transmitter
Operation
high
< 600 Ps
weakly pulled
(500 k:) to VCC1
high
> 1.5 ms
weakly pulled
(500 k:) to VCC1
Shutdown
low
high
low (active)
Ie
Transmitting
high
> 80 Ps
high inactive
Protection is active
low
<4
high inactive
low
low (active)
low
undefined
Dry packing
Aluminum bag
Moisture Level
Sticker
BarCode
ESD Sticker
Label
LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
Box
0
Reel
18298
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237
TFBS5711
Vishay Semiconductors
Recommended Solder Profiles
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
260
10 s max. at 230 C
240 C max.
240
220
2...4 C/s
200
180
Temperature/C
160 C max.
160
140
120 s...180 s
120
90 s max.
100
80
280
2...4 C/s
60
260
40
240
20
220
200
0
50
100
150
200
250
300
350
Time/s
19431
180
Temperature/C
160
20 s
140
120
90 s...120 s
100
50 s max.
2 C...4 C/s
80
60
2 C...4 C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
90
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
85
80
75
70
65
60
55
50
2.0
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
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238
TFBS5711
Vishay Semiconductors
Package Dimensions in mm (Inches)
19612
Figure 6. Package drawing of TFBS5711, tolerance of height is + 0.1mm, - 0.2 mm, other tolerances 0.2 mm
19728
www.vishay.com
239
TFBS5711
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
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240
W3 max.
TFBS5711
Vishay Semiconductors
Tape Dimensions in mm
19613
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241
TFDU5307
Vishay Semiconductors
20101
Features
Compliant to the latest IrDA physical
layer specification (up to 1.152 Mbit/s)
and TV Remote Control, bi-directional
operation included.
e3
Sensitivity covers full IrDA range.
Recommended operating range is from nose to
nose to 70 cm
Operates from
2.7 V to 5.5 V within specification
Low power consumption (typ. 0.55 mA
Supply current in receive mode, no signal)
Power shutdown mode (< 5 A Shutdown Current
in Full Temperature Range, up to 85 C)
Surface mount package, low profile
universal (L 8.5 mm x W 2.9 mm x H 2.5 mm)
Capable of surface mount soldering to side and
top view orientation
Backward pin compatible to Vishay
Semiconductors SIR and MIR infrared
transceivers
Applications
Telecommunication products (cellular phones,
pagers)
Digital still and video cameras
Printers, fax machines, photocopiers, screen projectors
Low power consumption (typ. 0.55 mA
Supply current in receive mode, no signal)
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242
TFDU5307
Vishay Semiconductors
Parts Table
Part
Description
TFDU5307-TR1
Qty / Reel
750 pcs
TFDU5307-TR3
2500 pcs
TFDU5307-TT1
750 pcs
TFDU5307-TT3
2500 pcs
Vlogic
VCC1
Tri-State
Driver
Amplifier
SD
TXD
Comparator
Logic
&
VCC2
RXD
IRED Driver
Control
IRED C
GND
18509
Pin Description
Pin Number
Function
Description
IRED
Anode
Connect IRED anode to the VCC2 power supply through an external current
limiting resistor. A separate unregulated power supply can be used at this pin.
I/O
Active
IRED
Cathode
TXD
This Schmitt-Trigger input is used to transmit serial data when SD is low. An onchip protection circuit disables the LED driver if the TXD pin is asserted for longer
than 80 Ps. When used in conjunction with the SD pin, this pin is also used to
control receiver output pulse duration. The input threshold voltage adapts to and
follows the logic voltage reference applied to the Vlogic pin (pin 7).
HIGH
RXD
Received Data Output, push-pull CMOS driver output capable of driving standard
CMOS or TTL loads. No external pull-up or pull-down resistor is required. Floating
with a weak pull-up of 500 k: (typ.) in shutdown mode. The voltage swing is
defined by the applied Vlogic voltage
LOW
SD
Shutdown. Also used for setting the output pulse duration. Setting this pin active
for more than 1.5 ms places the module into shutdown mode. Before that (t < 0.7
ms) on the falling edge of this signal, the state of the TXD pin is sampled and used
to set the receiver output to long pulse duration (2 s) or to short pulse duration
(0.4 Ps) mode. The input threshold voltage adapts to and follows the logic voltage
reference applied to the Vlogic pin (pin 7).
HIGH
VCC1
Supply Voltage
Vlogic
Vlogic defines the logic voltage levels for input and output. The RXD output range
is from 0 V to Vlogic, for optimum noise suppression the inputs logic decision level
is 0.5 x Vlogic
GND
Ground
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243
TFDU5307
Vishay Semiconductors
Pinout
Definitions:
TFDU5307
weight 75 mg
18101
5
6
1
2
3
4
8
7
IRED A IRED C TXD RXD SD Vcc Vlog GND
version.
With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version
IrPhy 1.4 (in Oct. 2002).
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.3
+ 6.0
VCC2
- 0.3
+ 6.5
Vlogic
- 0.3
+ 5.5
Input current
10
mA
Junction temperature
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244
mA
mW
125
- 25
+ 85
Tstg
- 25
+ 85
260
IIRED(DC)
125
mA
IIRED(RP)
600
mA
V
25
500
Tamb
TJ
PD
Typ.
VIREDA
- 0.5
+ 6.5
Vin
- 0.5
+ 5.5
50
pF
TFDU5307
Vishay Semiconductors
Eye safety information
Symbol
Min
Typ.
Parameter
1.8
2.0
IEC60825-1 or EN60825-1,
edition Jan. 2001, operating
below the absolute maximum
ratings
Ie
*)
Test Conditions
Max
Unit
mm
(500)*) **)
mW/sr
Max
Unit
Due to the internal limitation measures the device is a "class 1" device.
**)
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC1 = VCC2 = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC1
2.7
Typ.
5.5
SD = Low, Ee = 1 klx
ICC1
550
900
ICC
1100
1500
SD = High, T = 25 C, Ee = 0 klx
ISD
SD = High, T = 25 C,
ISD
2.5
SD = High, T = 85 C, not
ambient light sensitive
ISD
+ 85
VOL
0.4
IOH = - 500 A
VOH
0.8 x Vlogic
VOH
0.9 x Vlogic
RRXD
400
Ee = 1 klx*)
Standby supply current
Operating temperature range
TA
CMOS level**)
- 25
V
V
500
600
k:
V
VIL
- 0.5
0.5
VIH
Vlogic - 0.5
Vlogic + 0.5
IICH
-2
+2
+ 150
pF
IIRTx
IIRTx
CIN
-1
Standard illuminant A
**)
The typical threshold level is 0.5 x Vlogic. It is recommended to use the specified min/max values to avoid increased operating current.
The inputs in low state are actively loaded for noise protection. See for that the "Controlled pull down current" spec. Equivalently a pull up
current stabilizes the state when the inputs are in high state.
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245
TFDU5307
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Min
Typ.
Max
Unit
40
(4)
90
(9)
mW/m2
Ee
O = 850 nm - 900 nm
Ee
Ee
10 % to 90 %, CL = 15 pF,
Vlogic = VCC
tr(RXD)
20
60
ns
90 % to 10 %, CL = 15 pF,
Vlogic = VCC
tf(RXD)
20
60
ns
tPW
300
400
500
ns
tPW
1.7
2.0
2.9
80
ns
350
ns
1.5
ms
5
(500)
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(W/cm2)
600
300
200
Latency
0.6
(W/cm2)
tL
*)
Some ENDECs are not able to decode short pulses as valid SIR pulses. Therefore this additional mode was added in TFDU5307.
TFDU5307 is set to the "short output pulse" as default after power on, also after recovering from the shutdown mode (SD must have been
longer active than 1.5 ms). For mode changing see the chapter "Programming"
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246
TFDU5307
Vishay Semiconductors
Transmitter
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
D = 0 , If =420 mA
Symbol
Min
ID
Typ.
Max
Unit
450
500
mA
IIRED
-1
Ie
110
500
mW/sr
Ie
70
500
mW/sr
0.04
mW/sr
120
VCC1 = 5.0 V, D = 0 , 15
TXD = Low or SD = High
(Receiver is inactive as long as
SD = High)
Ie
Op
Spectral bandwidth
'O
24
880
900
nm
45
nm
tropt, tfopt
topt
190
(147.6)
topt
20
tTXD
topt
20
85
25
Optical overshoot
217
40
ns
240
(260)
ns
ns
*)
Note: Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for
the standard Remote Control applications with codes as e.g. Philips RC5/RC6 or RECS 80. When operated under IrDA full range conditions (>120 mW/sr) the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control receivers
are used.
**)
Typ. conditions for If = 420 mA, VCC2 = 3.3 V, Rs = 2.3 :, VCC2 = 5.0 V, Rs = 6.4 :
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247
TFDU5307
Vishay Semiconductors
Recommended Circuit Diagram
Used with a clean low impedance power supply the
TFDU5307 only needs an external series current limiting resistor. However, depending on the entire system design and board layout, additional components
may be required (see figure 1).
V IRED
R1
VCC
R2
C1
GND
IRED Anode
VCC
C2
Ground
Vlogic
Vlogic
SD
SD
TXD
TXD
RXD
RXD
IRED Cathode
18147
Table 1.
Recommended Application Circuit Components
Component
Recommended Value
C1
4.7 F, 16 V, Tantalum
C2
0.1 F, Ceramic
R1
R2
47 :, 0.125 W
CRCW-1206-47R0-F-RT1
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248
TFDU5307
Vishay Semiconductors
I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the
function verified with the special drivers available
from the I/O suppliers. In special cases refer to the I/
O manual, the Vishay application notes, or contact
directly Vishay Sales, Marketing or Application.
Programming
Pulse duration Switching
After Power-on the TFDU5307 is in the default short
RXD pulse duration mode.
Some ENDECs are not able to decode short pulses
as valid SIR pulses. Therefore an additional mode
with extended pulse duration (same as in standard
SIR transceivers) is added in TFDU5307. TFDU5307
is set to the "short output pulse" as default after power
on, and after recovering from the shutdown mode (SD
being active longer than 1.5 ms).
To switch the transceivers from the short RXD pulse
duration mode to the long pulse duration mode and
vice versa, follow the procedure described below.
SD
50 %
ts
th
High:
TXD 50 %
Low:
400 ns
50 %
2 s
18150
Simplified Method
Setting the device to the long pulse duration is simply
applying a short active (less than 600 s) pulse to
SD. In any case a short SD pulse will force the device
to leave the default mode and go the compatibility
mode. Vice versa applying a 1.5 ms (minimum) pulse
at SD will cause the device to go back to the default
mode by activating a power-on-reset and setting the
device to the default short pulse mode. This simplified
method takes more time but may be easier to handle.
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249
TFDU5307
Vishay Semiconductors
Table 2.
Truth table
Inputs
Outputs
Remark
SD
TXD
RXD
Transmitter
Operation
high
< 600 s
weakly pulled
(500 k:) to VCC1
high
> 1.5 ms
weakly pulled
(500 k:) to VCC1
Shutdown
low
high
low (active)
Ie
Transmitting
high
> 80 ms
high inactive
Protection is active
low
<4
high inactive
low
low (active)
low
undefined
Temperature (C)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 C
240 C max.
2...4 C/s
160 C max.
120 s...180 s
90 s max.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
2...4 C/s
50
19535
100
150
200
250
300
350
Time/s
www.vishay.com
250
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
TFDU5307
Vishay Semiconductors
Current Derating Diagram
275
T 255 C for 10 s....30 s
250
225
Tpeak = 260 C
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
90
2 C...3 C/s
50
25
0
0
50
100
150
200
Time/s
19532
250
300
350
Temperature/C
200
85
80
75
70
65
60
55
280
50
2.0
260
240
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
220
200
Temperature/C
180
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
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251
TFDU5307
Vishay Semiconductors
TFDU5307 - TinyFace (Universal) Package (Dimensions in mm)
(Mechanical Dimensions)
18100
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252
TFDU5307
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
W3 max.
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253
TFDU5307
Vishay Semiconductors
Tape Dimensions in mm
19855
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
Figure 7. Tape drawing, TFDU5307 for top view mounting
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254
TFDU5307
Vishay Semiconductors
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
Figure 8. Tape drawing, TFDU5307 for side view mounting
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255
Vishay Semiconductors
www.vishay.com
256
Contents
TFBS6711..............................258
TFBS6712..............................270
TFDU6102 ............................. 282
TFDU6103 ............................. 295
FIR
www.vishay.com
257
TFBS6711
Vishay Semiconductors
20208
related to the supply voltage while TFBS6712 supports low voltage logic of 1.8 V allowing direct connection to a microcontrollers I/Os operating at 1.8 V.
Features
Applications
High-speed data transfer using infrared
wireless communication
Mobile phones
Camera phones
PDAs
MP3 Players
Digital Cameras
IrDA Adapters or Dongles
Package Options
Ordering Information
Part Number
TFBS6711-TR1
1000 pcs
TFBS6711-TR3
2500 pcs
Note: A version oriented in the carrier tape for top view mounting is available on request
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258
TFBS6711
Vishay Semiconductors
Functional Block Diagram
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
SD
Logic
&
Controlled
Driver
Control
TXD
GND
19298
Pin Description
Pin Number
Function
Description
VCC2, IRED
Anode
I/O
Active
TXD
HIGH
RXD
LOW
SD
HIGH
VCC1
Supply voltage
GND
Ground
TFBS6711
Weight: 50 mg
PIN 1
19428
Figure 2. Pinning
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259
TFBS6711
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin, GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
Typ.
VCC2
- 0.5
6.5
Input currents
10
mA
PD
25
mA
500
mW
125
Tamb
- 25
+ 85
Tstg
- 25
+ 85
Junction temperature
TJ
Soldering temperature
Average output current
Repetitive pulse output current
IIRED (DC)
< 90 s, ton < 20 %
IIRED (RP)
260
125
mA
600
mA
IIREDA
- 0.5
6.5
Vin
- 0.5
5.5
1.5
V
mm
internal
limitation
to class 1
500
mW/sr
Due to the internal limitation measures the device is a class 1 device. It will not exceed the IrDA
intensity limit of 500 mW/sr
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhY 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
IrDA, the Infrared Data Association, implemented MIR and FIR with IrPHY 1.1, followed by IrPhY 1.2, adding the SIR Low Power Standard. IrPhY 1.3 extended the Low Power Option to MIR and FIR and VFIR was added with IrPhY 1.4. A new version of the standard in any
case obsoletes the former version.
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260
TFBS6711
Vishay Semiconductors
Electrical Characteristics
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameters
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
Transceiver
Supply voltage
Dynamic supply current
ICC
1.7
mA
ICC
1.9
3.3
mA
SD = High
T = 25 C, not ambient light
sensitive, detector is disabled in
shutdown mode
ISD
1
SD = High
T = 85 C, not ambient light
sensitive
ISD
+ 85
IOL = 1 mA
CLOAD = 15 pF
VOL
0.4
IOH = - 250 A
CLOAD = 15 pF
VOH
TA
- 25
0.9 x VCC
RRXD
400
600
k:
VIL
- 0.5
0.5
V IH
VCC - 0.5
VCC + 0.5
IICH
-1
+1
pF
Input capacitance
(TXD, SD)
*)
CI
500
0.05
Standard illuminant A
**)
The typical threshold level is 0.5 x VCC (VCC = 3 V). It is recommended to use the specified min/max values to avoid increased operating/
shutdown currents.
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261
TFBS6711
Vishay Semiconductors
Optoelectronic Characteristics
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Minimum irradiance Ee in
angular range **)
Ee
Minimum irradiance Ee in
angular range
MIR mode
1.152 Mbit/s
O = 850 nm - 900 nm, VCC = 2.4 V
Ee
Minimum irradiance Ee in
angular range
FIR mode
4 Mbit/s
O = 850 nm - 900 nm, VCC = 2.4 V
Ee
Maximum irradiance Ee in
angular range ***)
O = 850 nm - 900 nm
Ee
Min
Typ.
Max
Unit
Receiver
Ee
50
80
mW/m2
(5)
(8)
(W/cm2)
100
mW/m2
(10)
(W/cm2)
120
200
mW/m2
(12)
(20)
(W/cm2)
kW/m2
(500)
(mW/cm2)
mW/m2
(0.4)
(W/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
10
50
90 % to 10 %, CL = 15 pF
tf (RXD)
10
50
ns
tPW
1.4
1.8
2.6
tPW
110
250
270
ns
tPW
110
140
ns
tPW
225
275
ns
20
ns
40
ns
350
ns
500
100
Latency
tL
ns
Note: All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header. The data given here are valid 5 s
after starting the preamble.
**) IrDA sensitivity definition: Minimum Irradiance E In Angular Range, power per unit area. The receiver must meet the BER specie
fication while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link
Length
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the
maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors.
If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification.
For more definitions see the document Symbols and Terminology on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
www.vishay.com
262
TFBS6711
Vishay Semiconductors
Optoelectronic Characteristics, continued
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Typ.
Max
Unit
Parameter
Test Conditions
ID
330
440
600
mA
IIRED
-1
Ie
45
115
300
mW/sr
Ie
25
75
300
mW/sr
VCC1 = 3.6 V, D = 0, 15
TXD = Low or SD = High
(Receiver is inactive as long as
SD = High)
Ie
0.04
mW/sr
r24
Op
880
900
nm
tropt,
tfopt
10
40
ns
topt
200
217
230
ns
topt
116
125
134
ns
topt
241
250
259
ns
topt
topt
85
s
s
25
Optical overshoot
t
20
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263
TFBS6711
Vishay Semiconductors
Recommended Circuit Diagram
Operated at a clean low impedance power supply the
TFBS6711 needs no additional external components.
However, depending on the entire system design and
board layout, additional components may be required
(see figure 3).
V CC2
V CC1
GND
IRED Anode
R1
R2
C1
V CC
C3
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
19299
Recommended Value
C1
4.7 F, 16 V
Vishay part#:
293D 475X9 016B
C2
0.1 F, Ceramic
Vishay part#:
VJ1206 Y 104 J XXMT
R1
R2
4.7 :, 0.125 W
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264
TFBS6711
Vishay Semiconductors
Mode Switching
The TFBS6711 is in the SIR mode after power on as
a default mode, therefore the FIR data transfer rate
has to be set by a programming sequence using the
TXD and SD inputs as described below. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the
high frequency mode. Lower frequency data can also
be received in the high frequency mode but with
reduced sensitivity. To switch the transceivers from
low frequency mode to the high frequency mode and
vice versa, the programming sequences described
below are required.
50 %
SD
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
Truth table
Inputs
Outputs
SD
TXD
RXD
Transmitter
high
weakly pulled
(500 k:)
high
Ie
low
high
high
low
high
low
low
<4
high
low
low
low (active)
low
low
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265
TFBS6711
Vishay Semiconductors
Recommended Solder Profiles
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
260
10 s max. at 230 C
240 C max.
240
220
2...4 C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
280
T 255 C for 20 s max
260
240
T 217 C for 50 s max
220
200
180
Temperature/C
Temperature/C
160 C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 C...4 C/s
80
60
2 C...4 C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
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266
TFBS6711
Vishay Semiconductors
TFBS4711, TFBS5711, TFBS6711, and TFBS6712 Package
(Mechanical Dimensions)
19612
Figure 7. Package drawing, tolerances: Height + 0.1, - 0.2 mm, otherwise 0.2 mm if not indicated
19301
19728
www.vishay.com
267
TFBS6711
Vishay Semiconductors
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
W3 max.
mm
16
330
50
16.4
22.4
15.9
19.4
19303
Drawing-No.: 9.700-5294.01-4
Issue: prel. copy; 24.11.04
Figure 10. Tape dimensions [mm] TFBS6711-TT3
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268
TFBS6711
Vishay Semiconductors
19304
Drawing-No.: 9.700-5295.01-4
Issue: prel. copy; 24.11.04
Figure 11. Tape dimensions [mm] TFBS6711-TR3
www.vishay.com
269
TFBS6712
Vishay Semiconductors
20208
work with a low logic I/O voltage of 1.8 V. For operation with VCC as logic voltage base TFBS6711 is available with otherwise same performance.
Features
Applications
High-speed data transfer using infrared
wireless communication
Mobile phones
Camera phones
PDAs
MP3 Players
Digital Cameras
IrDA Adapters or Dongles
Package Options
Ordering Information
Part Number
TFBS6712-TR1
1000 pcs
TFBS6712-TR3
2500 pcs
Note: A version oriented in the carrier tape for top view mounting is available on request
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270
TFBS6712
Vishay Semiconductors
Functional Block Diagram
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
SD
Logic
&
Controlled
Driver
Control
TXD
GND
19298
Pin Description
Pin Number
Function
Description
VCC2, IRED
Anode
I/O
Active
TXD
HIGH
RXD
LOW
SD
HIGH
VCC1
Supply voltage
GND
Ground
TFBS6712
Weight: 50 mg
PIN 1
19428
Figure 2. Pinning
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271
TFBS6712
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin, GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
Typ.
VCC2
- 0.5
6.5
Input currents
10
mA
PD
25
mA
500
mW
125
Tamb
- 25
+ 85
Tstg
- 25
+ 85
Junction temperature
TJ
Soldering temperature
Average output current
Repetitive pulse output current
IIRED (DC)
< 90 Ps, ton < 20 %
IIRED (RP)
260
125
mA
600
mA
VIREDA
- 0.5
6.5
Vin
- 0.5
5.5
1.5
V
mm
internal
limitation
to class 1
500
mW/sr
Due to the internal limitation measures the device is a class 1 device. It will not exceed the IrDA
intensity limit of 500 mW/sr
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhY 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
IrDA, the Infrared Data Association, implemented MIR and FIR with IrPHY 1.1, followed by IrPhY 1.2, adding the SIR Low Power Standard. IrPhY 1.3 extended the Low Power Option to MIR and FIR and VFIR was added with IrPhY 1.4. A new version of the standard in any
case obsoletes the former version.
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272
TFBS6712
Vishay Semiconductors
Electrical Characteristics
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
Transceiver
Supply voltage range
Dynamic supply current
ICC
1.7
mA
ICC
1.9
3.3
mA
SD = High
T = 25 C, not ambient light
sensitive, detector is disabled in
shutdown mode
ISD
SD = High
T = 85 C, not ambient light
sensitive
ISD
+ 85
IOL = 1 mA
CLOAD = 15 pF
VOL
0.4
IOH = - 250 A
CLOAD = 15 pF
VOH
600
k:
0.5
TA
- 25
1.6
1.8
500
RRXD
400
VIL
- 0.5
VIH
1.5
1.8
2.1
IICH
-1
0.05
+1
pF
CI
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273
TFBS6712
Vishay Semiconductors
Optoelectronic Characteristics
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Minimum irradiance Ee in
angular range**)
Ee
Minimum irradiance Ee in
angular range
MIR mode
1.152 Mbit/s
O = 850 nm to 900 nm, Vcc = 2.4 V
Ee
Minimum irradiance Ee in
angular range
FIR mode
4 Mbit/s
O = 850 nm to 900 nm, Vcc = 2.4 V
Ee
Maximum irradiance Ee in
angular range***)
O = 850 nm to 900 nm
Ee
Min
Typ.
Max
Unit
Receiver
Ee
50
80
mW/m2
(5)
(8)
(W/cm2)
100
mW/m2
(10)
(W/cm2)
120
200
mW/m2
(12)
(20)
(W/cm2)
kW/m2
(500)
(mW/cm2)
mW/m2
(0.4)
(W/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
10
50
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
10
50
ns
tPW
1.4
1.8
2.6
tPW
110
250
270
ns
tPW
110
140
ns
tPW
225
275
ns
20
40
350
ns
ns
ns
500
100
Latency
tL
Note: All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header. The data given here are valid 5 s
after starting the preamble.
**) IrDA sensitivity definition: Minimum Irradiance E In Angular Range, power per unit area. The receiver must meet the BER specie
fication while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link
Length
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical power delivered to the detector by a source operating
at the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link
errors. If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification.
For more definitions see the document Symbols and Terminology on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
www.vishay.com
274
TFBS6712
Vishay Semiconductors
Optoelectronic Characteristics, continued
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Min
Typ.
Max
Unit
440
600
mA
Transmitter
IRED operating current, switched
current control
ID
330
IIRED
-1
Ie
45
115
300
mW/sr
Ie
25
75
300
mW/sr
VCC = 3.6 V, D = 0, 15
TXD = Low or SD = High
(Receiver is inactive as long as
SD = High)
Ie
0.04
mW/sr
r24
Op
880
900
nm
tropt,
tfopt
10
40
ns
topt
200
217
230
ns
topt
116
125
134
ns
topt
241
250
259
ns
topt
topt
85
s
s
25
Optical overshoot
t
20
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275
TFBS6712
Vishay Semiconductors
Recommended Circuit Diagram
Operated at a clean low impedance power supply the
TFBS6712 needs no additional external components.
However, depending on the entire system design and
board layout, additional components may be required
(see figure 3).
VCC2
VCC1
GND
R1
R2
C1
IRED Anode
VCC
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
19430
www.vishay.com
276
Recommended Value
C1
4.7 F, 16 V
Vishay part#:
293D 475X9 016B
C2
0.1 F, Ceramic
Vishay part#:
VJ1 206 Y 104 J XXMT
R1
R2
4.7 :, 0.125 W
TFBS6712
Vishay Semiconductors
Mode Switching
The TFBS6712 is in the SIR mode after power on as
a default mode, therefore the FIR data transfer rate
has to be set by a programming sequence using the
TXD and SD inputs as described below. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the
high frequency mode. Lower frequency data can also
be received in the high frequency mode but with
reduced sensitivity. To switch the transceivers from
low frequency mode to the high frequency mode and
vice versa, the programming sequences described
below are required.
50 %
SD
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
Truth table
Inputs
Outputs
SD
TXD
RXD
Transmitter
high
weakly pulled
(500 k:)
high
Ie
low
high
high
low
high
low
low
<4
high
low
low
low (active)
low
low
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277
TFBS6712
Vishay Semiconductors
Recommended Solder Profiles
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
260
10 s max. at 230 C
240 C max.
240
220
2...4 C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
280
T 255 C for 20 s max
260
240
T 217 C for 50 s max
220
200
180
Temperature/C
Temperature/C
160 C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 C...4 C/s
80
60
2 C...4 C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
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278
TFBS6712
Vishay Semiconductors
TFBS4711, TFBS5711, TFBS6711, and TFBS6712 Package
(Mechanical Dimensions)
19612
Figure 7. Package drawing, tolerances: Height + 0.1, - 0.2 mm, otherwise 0.2 mm if not indicated
19301
19728
www.vishay.com
279
TFBS6712
Vishay Semiconductors
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
W3 max.
mm
16
330
50
16.4
22.4
15.9
19.4
19303
Drawing-No.: 9.700-5294.01-4
Issue: prel. copy; 24.11.04
Figure 10. Tape dimensions [mm] TFBS6712-TT3
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280
TFBS6712
Vishay Semiconductors
19304
Drawing-No.: 9.700-5295.01-4
Issue: prel. copy; 24.11.04
Figure 11. Tape dimensions [mm] TFBS6712-TR3
www.vishay.com
281
TFDU6102
Vishay Semiconductors
20110
Features
Supply voltage 2.7 V to 5.5 V, operating
idle current (receive mode) < 3 mA,
shutdown current < 5 A over full
temperature range
e3
Surface mount package, top and side
view, 9.7 mm x 4.7 mm x 4.0 mm
Operating temperature - 25 C to 85 C
Storage temperature - 40 C to 100 C
Transmitter wavelength typ. 886 nm, supporting
IrDA and Remote Control
IrDA compliant, link distance > 1 m, 15, window
losses are allowed to still be inside the IrDA spec.
Remote Control range > 8 m, typ. 22 m
ESD > 4000 V (HBM)
Applications
Notebook computers, desktop PCs, Palmtop
computers (Win CE, Palm PC), PDAs
Digital still and video cameras
Printers, fax machines, photocopiers,
screen projectors
Telecommunication products
(cellular phones, pagers)
Internet TV Boxes, video conferencing systems
External infrared adapters (dongles)
Medical an industrial data collection
Parts Table
Part
Description
Qty / Reel
TFDU6102-TR3
1000 pcs
TFDU6102-TT3
1000 pcs
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282
TFDU6102
Vishay Semiconductors
Functional Block Diagram
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
Logic
&
SD
Controlled
Driver
Control
TXD
IRED C
GND
18468
Pinout
Definitions:
TFDU6102
weight 200 mg
IRED
Detector
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy
1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the
Low Power Option to MIR and FIR and VFIR was added with IrPhy
1.4.A new version of the standard in any case obsoletes the former
version.
2 3 4 5 6
7 8
17087
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283
TFDU6102
Vishay Semiconductors
Pin Description
Pin Number
Function
Description
VCC2
IRED Anode
Connect IRED anode directly to V CC2. For voltages higher than 3.6 V an
external resistor might be necessary for reducing the internal power
dissipation.
An unregulated separate power supply can be used at this pin.
I/O
Active
IRED
Cathode
TXD
HIGH
RXD
LOW
SD
Shutdown, also used for dynamic mode switching. Setting this pin active
places the module into shutdown mode. On the falling edge of this signal,
the state of the TXD pin is sampled and used to set receiver low bandwidth
(TXD = Low, SIR) or high bandwidth
(TXD = High, MIR and FIR) mode. Will be overwritten by the mode pin input,
which must float, when dynamic programming is used.
HIGH
VCC1
Supply Voltage
Mode
HIGH: High speed mode, MIR and FIR; LOW: Low speed mode, SIR only
(see chapter "Mode Switching"). Must float, when dynamic programming is
used.
Mode
The mode pin can also be used to indicate the dynamically programmed
mode. The maximum load is limited to 50 pF. High indicates FIR/MIR-, low
indicates SIR-mode
GND
Ground
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
+6
VCC2
- 0.5
+ 6.5
Input currents
10
mA
Junction temperature
TJ
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284
25
mA
500
mW
125
Tamb
- 25
+ 85
Tstg
- 25
+ 85
260
IIRED (DC)
125
mA
IIRED (RP)
600
mA
PD
Typ.
VIREDA
VIN
- 0.5
+ 6.5
5.5
50
pF
TFDU6102
Vishay Semiconductors
Eye safety information
Reference point Pin: GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Typ.
Parameter
2.5
2.8
IEC60825-1 or
EN60825-1,
edition Jan. 2001
Ie
*)
Test Conditions
Max
Unit
mm
*)
(500)**)
mW/sr
Max
Unit
**)
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC
2.7
Typ.
5.5
mA
SD = Low, Ee = 0 klx
ICC
ICC
mA
ISD
2.0
ISD
2.5
SD = High, T = 85 C,
Mode = Floating, not ambient
light sensitive
ISD
+ 85
VOL
0.4
VOH
0.8 x VCC
VOH
0.9 x VCC
Ee = 1 klx **)
TA
- 25
V
V
Short to Ground
20
mA
Short to VCC1
20
mA
SD = High
RRXD
400
600
k:
VIL
- 0.5
0.5
VIH
VCC - 0.5
VCC + 0.5
IL
- 10
+ 10
IICH
-2
+2
Input capacitance
(TXD, SD, Mode)
CIN
pF
500
*)
**)
Standard Illuminant A.
***)
The typical threshold level is 0.5 x VCC2. It is recommended to use the specified min/max values to avoid increased operating current.
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285
TFDU6102
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Typ.
Max
Unit
Minimum irradiance Ee in
angular range **) SIR mode
Parameter
Test Conditions
Symbol
Ee
Min
25
(2.5)
35
(3.5)
mW/m2
Minimum irradiance Ee in
angular range, MIR mode
1.152 Mbit/s
O = 850 nm to 900 nm
Ee
65
(6.5)
Minimum irradiance Ee
inangular range, FIR mode
4.0 Mbit/s
O = 850 nm to 900 nm
Ee
Maximum irradiance Ee in
angular range ***)
O = 850 nm to 900 nm
Ee
Maximum no detection
irradiance
*)
80
(8.0)
(W/cm2)
mW/m2
(W/cm2)
90
(9.0)
5
(500)
mW/m2
(W/cm2)
kW/m2
(mW/cm2)
Ee
4
(0.4)
10 % to 90 %, 15 pF
tr (RXD)
10
40
90 % to 10 %, 15 pF
tf (RXD)
10
40
tPW
tPW
1.5
1.8
2.6
250
270
ns
mW/m2
(W/cm2)
2.1
ns
ns
s
tPW
110
tPW
100
140
ns
tPW
225
275
ns
20
ns
40
ns
80
ns
350
ns
500
300
Latency
tL
170
Note: All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header.
The data given here are valid 5 s after starting the preamble.
*)
This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent
lamps
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors. If
placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER). For more definitions
see the document Symbols and Terminology on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
****)
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286
TFDU6102
Vishay Semiconductors
Transmitter
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
IRED operating current,
switched current limiter
Test Conditions
See derating curve (fig. 5). For
3.3 V operations no external
resistor needed. For 5 V
application that might be
necessary depending on
operating temperature range.
Symbol
Min
Typ.
Max
Unit
ID
500
550
600
mA
170
350
mW/sr
0.04
mW/sr
IIRED
-1
D = 0, 15
TXD = High, SD = Low,
VCC1 = VCC2 = 3.3 V
Internally current-controlled, no
external resistor
Ie
120
VCC1 = 5.0 V, D = 0, 15
TXD = Low or SD = High,
(Receiver is inactive as long as
SD = High)
Ie
Op
Spectral bandwidth
'O
24
880
900
40
nm
nm
tropt, tfopt
10
40
ns
topt
207
217
227
ns
topt
117
125
133
ns
topt
242
250
258
ns
topt
tTXD
topt
23
100
25
*)
Typically the output pulse duration will follow the input pulse duration t and will be identical in length t.
However, at pulse duration larger than 100 s the optical output pulse duration is limited to 100 s. This pulse duration limitation can already start at 23 s.
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287
TFDU6102
Vishay Semiconductors
Recommended Circuit Diagram
Vishay Semiconductors transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout.
The use of thin, long, resistive and inductive wiring
should be avoided. The inputs (TXD, SD, Mode) and
the output RXD should be directly (DC) coupled to the
I/O circuit.
VCC2
R1
VCC1
R2
C1
C3
IRED Anode
VCC
C2
GND
Ground
Mode
Mode
SD
SD
TXD
TXD
RXD
RXD
IRED Cathode
18469
Table 1.
Recommended Application Circuit Components
Component
Recommended Value
C1, C3
4.7 F, 16 V
C2
0.1 F, Ceramic
R1
e.g. 2 x CRCW-1206-1R0-F-RT1
R2
10 :, 0.125 W
CRCW-1206-10R0-F-RT1
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288
TFDU6102
Vishay Semiconductors
I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the
function verified with the special drivers available
from the I/O suppliers. In special cases refer to the I/
O manual, the Vishay application notes, or contact
directly Vishay Sales, Marketing or Application.
Mode Switching
The TFDU6102 is in the SIR mode after power on as
a default mode, therefore the FIR data transfer rate
has to be set by a programming sequence using the
TXD and SD inputs as described below or selected by
setting the Mode Pin. The Mode Pin can be used to
statically set the mode (Mode Pin: LOW: SIR, HIGH:
0.576 Mbit/s to 4.0 Mbit/s). If not used or in standby
mode, the mode input should float or should not be
loaded with more than 50 pF. The low frequency
mode covers speeds up to 115.2 kbit/s. Signals with
higher data rates should be detected in the high frequency mode. Lower frequency data can also be
received in the high frequency mode but with reduced
sensitivity.
To switch the transceivers from low frequency mode
to the high frequency mode and vice versa, the programming sequences described below are required.
50 %
SD
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
Table 2.
Truth table
Inputs
Outputs
SD
TXD
RXD
Transmitter
high
weakly pulled
(500 k:) to VCC1
low
high
low (active)
Ie
high > 80 s
high
low
<4
high
low
low (active)
low
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289
TFDU6102
Vishay Semiconductors
Recommended Solder Profiles for TFDU6102
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 C
240 C max.
2...4 C/s
160 C max.
120 s...180 s
90 s max.
2...4 C/s
275
T 255 C for 10 s....30 s
250
225
0
50
19535
100
150
200
250
300
350
Tpeak = 260 C
200
Time/s
Temperature/C
Temperature (C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
260
240
220
200
180
Temperature/C
2 C...3 C/s
50
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
www.vishay.com
290
TFDU6102
Vishay Semiconductors
Current Derating Diagram
90
85
80
75
70
65
60
55
50
2.0
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Package Dimensions
Figure 7. Package drawing TFDU6102, dimensions in mm, tolerance 0.2 mm if not otherwise mentioned
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291
TFDU6102
Vishay Semiconductors
Solder Footprint
20111
Figure 8. Solder footprint for top and side view mounting TFDU6102, dimensions in mm, tolerance 0.2 mm if not otherwise mentioned
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
W3 max.
mm
24
330
60
24.4
30.4
23.9
27.4
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292
TFDU6102
Vishay Semiconductors
Tape Dimensions
19824
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Figure 10. Tape drawing, TFDU6102 for top view mounting, tolerance 0.1 mm
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293
TFDU6102
Vishay Semiconductors
19875
Drawing-No.: 9.700-5297.01-4
Issue: 1; 04.08.05
Figure 11. Tape drawing, TFDU6102 for side view mounting, tolerance 0.1 mm
www.vishay.com
294
TFDU6103
Vishay Semiconductors
20110
modulation/
demodulation
function,
including
National Semiconductors PC87338, PC87108 and
PC87109, SMCs FDC37C669, FDC37N769 and
CAM35C44, and Hitachis SH3. TFDU6103 has a tristate output and is floating in shut-down mode with a
weak pull-up.
Features
Supply voltage 2.4 V to 5.5 V, operating
idle current (receive mode) < 3.3 mA,
shutdown current < 1 A over full
temperature range
e3
Surface mount package, top and side
view, 9.7 mm x 4.7 mm x 4.0 mm
Operating temperature - 25 C to 85 C
Transmitter wavelength typ. 886 nm, supporting
IrDA and Remote Control
IrDA compliant, link distance > 1 m, 15, window losses are allowed to still be inside the IrDA
spec.
Remote Control range > 8 m, typ. 22 m
ESD > 1 kV
Latchup > 100 mA
Applications
Notebook computers, desktop PCs, Palmtop
computers (Win CE, Palm PC), PDAs
Digital still and video cameras
Printers, fax machines, photocopiers,
screen projectors
Telecommunication products
(cellular phones, pagers)
Internet TV Boxes, video conferencing systems
External infrared adapters (dongles)
Medical an industrial data collection
Parts Table
Part
Description
Qty / Reel
TFDU6103-TR3
1000 pcs
TFDU6103-TT3
1000 pcs
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295
TFDU6103
Vishay Semiconductors
Functional Block Diagram
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
Logic
&
SD
Controlled
Driver
Control
TXD
IRED C
GND
18468
Pinout
Definitions:
TFDU6103
weight 200 mg
IRED
Detector
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy
1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the
Low Power Option to MIR and FIR and VFIR was added with IrPhy
1.4.A new version of the standard in any case obsoletes the former
version.
1
17087
2 3 4 5 6
7 8
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296
TFDU6103
Vishay Semiconductors
Pin Description
Pin Number
Function
Description
VCC2
IRED
Anode
Connect IRED anode directly to VCC2. For voltages higher than 3.6 V an external
resistor might be necessary for reducing the internal power dissipation.
An unregulated separate power supply can be used at this pin.
I/O
Active
IRED
Cathode
TXD
This input is used to transmit serial data when SD is low. An on-chip protection circuit
disables the LED driver if the TXD pin is asserted for longer than 100 s. When used
in conjunction with the SD pin, this pin is also used to receiver speed mode.
HIGH
RXD
Received Data Output, push-pull CMOS driver output capable of driving a standard
CMOS or TTL load. No external pull-up or pull-down resistor is required. Floating with
a weak pull-up of 500 k: (typ.) in shutdown mode.
LOW
SD
Shutdown, also used for dynamic mode switching. Setting this pin active places the
module into shutdown mode. On the falling edge of this signal, the state of the TXD pin
is sampled and used to set receiver low bandwidth (TXD = Low, SIR) or high bandwidth
(TXD = High, MIR and FIR) mode. Will be overwritten by the mode pin input, which must
float, when dynamic programming is used.
HIGH
VCC1
Supply Voltage
NC
GND
Ground
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
Typ.
+6
VCC2
- 0.5
+ 6.5
Input currents
10
mA
Junction temperature
TJ
mA
mW
125
- 25
+ 85
Tstg
- 25
+ 85
260
IIRED (DC)
125
mA
IIRED (RP)
600
mA
+ 6.5
VIREDA
25
500
Tamb
PD
- 0.5
VIN
5.5
50
pF
Max
Unit
Min
Typ.
Parameter
Test Conditions
2.5
2.8
IEC60825-1 or
EN60825-1, edition Jan. 2001
Ie
mm
*)
(500)**)
mW/sr
*) Due
**)
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297
TFDU6103
Vishay Semiconductors
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Supply voltage
Dynamic supply current
Symbol
Min
VCC
2.4
Typ.
Max
Unit
5.5
ICC
1.8
3.0
mA
MIR/FIR mode
ICC
2.0
3.3
mA
SD = High
T = 25 C, not ambient light
sensitive, detector is disabled in
shutdown mode
ISD
0.01
ISD
TA
- 25
+ 85
VIL
- 0.5
0.5
CMOS level *)
VIH
VCC - 0.3
IICH
-1
+1
CI
pF
VOL
0.4
VOH
Short to Ground
Short to VCC1
Activating shutdown
All modes
0.9 x VCC1
V
20
20
30
RRXD
400
tSDPW
200
500
mA
mA
600
k:
ns
*)
The typical threshold level is 0.5 x VCC1 (VCC1 = 3 V) . It is recommended to use the specified min/ max values to avoid increased operating current
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298
TFDU6103
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC = 2.4 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Typ.
Max
Unit
Minimum irradiance Ee in
angular range **) SIR mode
Parameter
Test Conditions
Symbol
Ee
Min
25
(2.5)
35
(3.5)
mW/m2
(W/cm2)
Minimum irradiance Ee in
angular range, MIR mode
1.152 Mbit/s
O = 850 nm to 900 nm
Ee
65
(6.5)
Minimum irradiance Ee
inangular range, FIR mode
4.0 Mbit/s
O = 850 nm to 900 nm
Ee
80
(8.0)
Maximum irradiance Ee in
angular range ***)
O = 850 nm to 900 nm
Ee
5
(500)
Maximum no detection
irradiance
*)
Ee
4
(0.4)
mW/m2
(W/cm2)
90
(9.0)
mW/m2
(W/cm2)
kW/m2
(mW/cm2)
mW/m2
(W/cm2)
10 % to 90 %, 15 pF
tr (RXD)
10
40
90 % to 10 %, 15 pF
tf (RXD)
10
40
tPW
tPW
1.5
1.8
2.6
250
270
ns
2.1
ns
ns
s
tPW
110
tPW
100
140
ns
tPW
225
275
ns
20
ns
40
ns
80
ns
350
ns
250
100
Latency
tL
40
Note: All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header.
The data given here are valid 5 Ps after starting the preamble.
*)
This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent
lamps
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors. If
placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER). For more definitions
see the document Symbols and Terminology on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
****)
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299
TFDU6103
Vishay Semiconductors
Transmitter
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
IRED operating current,
switched current limiter
Test Conditions
Symbol
Min
Typ.
Max
Unit
ID
330
440
600
mA
IIRED
-1
Ie
110
170
500*)
mW/sr
Ie
100
130
500*)
mW/sr
VCC1 = 3.3 V, D = 0, 15
TXD = Low or SD = High
(Receiver is inactive as long as
SD = High)
Ie
0.04
mW/sr
Op
Spectral bandwidth
'O
Optical overshoot
24
875
886
900
45
tropt ,
tfopt
10
topt
207
topt
nm
nm
40
ns
217
227
ns
117
125
133
ns
topt
242
250
258
ns
topt
topt
20
100
s
s
25
*)
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300
TFDU6103
Vishay Semiconductors
Recommended Circuit Diagram
Vishay Semiconductors transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout.
The use of thin, long, resistive and inductive wiring
should be avoided. The inputs (TXD, SD, Mode) and
the output RXD should be directly (DC) coupled to the
I/O circuit.
V cc2
R1
V cc1
R2
C1
C3
GND
IRED Anode
V cc
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
IRED Cathode
19789
Table 1.
Recommended Application Circuit Components
Component
Recommended Value
C1, C3
4.7 F, 16 V
C2
0.1 F, Ceramic
R1
e.g. 2 x CRCW-1206-1R0-F-RT1
R2
10 :, 0.125 W
CRCW-1206-10R0-F-RT1
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301
TFDU6103
Vishay Semiconductors
I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the
function verified with the special drivers available
from the I/O suppliers. In special cases refer to the I/
O manual, the Vishay application notes, or contact
directly Vishay Sales, Marketing or Application.
Mode Switching
The TFDU6103 is in the SIR mode after power on as
a default mode, therefore the FIR data transfer rate
has to be set by a programming sequence using the
TXD and SD inputs as described below. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the
high frequency mode. Lower frequency data can also
be received in the high frequency mode but with
reduced sensitivity.
To switch the transceivers from low frequency mode
to the high frequency mode and vice versa, the programming sequences described below are required.
SD
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
Table 2.
Truth table
Inputs
TXD
RXD
Transmitter
high
weakly pulled
(500 k:) to VCC1
0
Ie
low
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302
Outputs
SD
high
low (active)
high
low
<4
high
low
low (active)
low
TFDU6103
Vishay Semiconductors
Recommended Solder Profiles
260
240
220
200
180
160
140
120
100
80
60
40
20
0
275
10 s max. at 230 C
240 C max.
250
225
2...4 C/s
Tpeak = 260 C
200
160 C max.
120 s...180 s
Temperature/C
Temperature (C)
90 s max.
2...4 C/s
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
2 C...3 C/s
50
25
50
100
19535
150
200
250
300
350
Time/s
50
100
150
200
Time/s
19532
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
Document Number 81211
Rev. 1.0, 31-Jul-06
300
350
280
260
240
220
200
Temperature/C
180
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
250
85
80
75
70
65
60
55
50
2.0
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
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303
TFDU6103
Vishay Semiconductors
Package Dimensions in mm
20111
Figure 7. Package drawing and solder footprints for top and side view mounting TFDU6103, dimensions in mm, tolerance 0.2 mm if not
otherwise mentioned
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304
TFDU6103
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
24
330
60
24.4
30.4
23.9
27.4
W3 max.
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305
TFDU6103
Vishay Semiconductors
Tape Dimensions
19824
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Figure 8. Tape drawing, TFDU6103 for top view mounting, tolerance 0.1 mm
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306
TFDU6103
Vishay Semiconductors
Tape Dimensions
19875
Drawing-No.: 9.700-5297.01-4
Issue: 1; 04.08.05
Figure 9. Tape drawing, TFDU6103 for side view mounting, tolerance 0.1 mm
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307
TFDU6300
Vishay Semiconductors
20101
Features
Compliant to the latest IrDA physical
layer specification (up to 4 Mbit/s) with an
extended low power range of > 70 cm
e3
(typ. 1 m) and TV Remote Control (> 9 m)
Operates from 2.4 V to 3.6 V within
specification
Low power consumption (1.8 mA typ. supply
current)
Power shutdown mode (0.01 A typ. shutdown
current)
Surface mount package
- Universal (L 8.5 mm x H 2.5 mm x W 3.1 mm)
Tri-state-receiver output, floating in shut down with
a weak pull-up
Applications
Notebook computers, desktop PCs, Palmtop
computers (Win CE, Palm PC), PDAs
Digital cameras and video cameras
Printers, fax machines, photocopiers, screen
projectors
Parts Table
Part
Description
TFDU6300-TR3
2500 pcs
TFDU6300-TT3
2500 pcs
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308
TFDU6300
Vishay Semiconductors
Functional Block Diagram
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
SD
Logic
&
Controlled
Driver
Control
TXD
GND
18468_1
Pin Description
Pin Number
1
Function
Description
I/O
Active
VCC2
IRED anode to be externally connected to Vcc2 (VIRED). For higher voltages
IRED Anode than 3.6 V an external resistor might be necessary for reducing the internal
power dissipation. This pin is allowed to be supplied from an uncontrolled
power supply separated from the controlled Vcc1 - supply.
IRED
Cathode
TXD
HIGH
RXD
LOW
SD
Shutdown, also used for dynamic mode switching. Setting this pin active
places the module into shutdown mode. On the falling edge of this signal,
the state of the TXD pin is sampled and used to set receiver low bandwidth
(TXD = Low: SIR) or high bandwidth (TXD = High: MIR and FIR) mode.
HIGH
VCC1
Supply voltage
NC
GND
Ground
TFDU6301
weight 0.075 g
19531
Figure 2. Pinning
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309
TFDU6300
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin: GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
VCC2
- 0.5
6.5
Input currents
Typ.
- 0.5
PD
Junction temperature
25
mA
500
mW
125
- 25
+ 85
Tstg
- 25
+ 85
260
IIRED (DC)
150
mA
IIRED (RP)
700
mA
V
mA
Tamb
TJ
6
10
ESD protection
IEC60825-1 or EN60825-1,
edition Jan. 2001
Ie
1
1.8
kV
2.0
mm
*)
mW/sr
(500)**)
*) Due to the internal limitation measures and the IrDA defined transmission protocol the device is a "class 1" device when operated inside
the absolute maximum ratings
**) IrDA specifies the maximum intensity with 500 mW/sr
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the Low
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4. A new version of the standard in any case obsoletes the former version.
With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version IrPhy 1.4
(in Oct. 2002).
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310
TFDU6300
Vishay Semiconductors
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Supply voltage
Dynamic Supply current
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
ICC
1.8
3.0
mA
MIR/FIR mode
ICC
2.0
3.3
mA
SD = High
T= 25 C, not ambient light
sensitive, detector is disabled in
shutdown mode
ISD
0.01
ISD
TA
- 25
+ 85
VIL
- 0.5
0.5
VIH
VCC - 0.3
IICH
-1
CMOS level*)
IOL = 500 A
Cload = 15 pF
IOH = - 250 A
Cload = 15 pF
Short to Ground
Short to VCC1
Activating shutdown
All modes
+1
CI
pF
VOL
0.4
VOH
0.9 x VCC1
20
20
30
RRXD
400
tSDPW
200
500
mA
mA
600
k:
ns
*)
The typical threshold level is 0.5 x VCC1 (VCC1 = 3 V). It is recommended to use the specified min/max values to avoid increased operating
current.
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311
TFDU6300
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Typ.
Max
Unit
Ee
50
(5)
80
(8)
mW/m2
(W/cm2)
1.152 Mbit/s
O = 850 nm to 900 nm,
VCC = 2.4 V
Ee
100
(10)
4 Mbit/s
O = 850 nm to 900 nm,
VCC = 2.4 V
Ee
130
(13)
O = 850 nm to 900 nm
Ee
5
(500)
Minimum irradiance Ee in
angular range, MIR mode
Minimum irradiance Ee
inangular range, FIR mode
Maximum irradiance Ee in
angular range***)
Symbol
Min
mW/m2
(W/cm2)
200
(20)
mW/m2
(W/cm2)
kW/m2
(mW/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
10
40
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
10
40
ns
tPW
1.6
2.2
tPW
105
250
275
ns
tPW
105
125
145
ns
tPW
225
250
275
ns
25
80
350
ns
ns
ns
250
100
Latency
tL
40
Note: All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header. The data given here are valid 5 s
after starting the preamble.
*)
IrDA low power specification is 90 mW/m2. Specification takes into account a window loss of 10 %.
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312
TFDU6300
Vishay Semiconductors
Transmitter
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
IRED operating current, switched
current limiter
Test Conditions
Note: No external resistor
current limiting resistor is
needed
Symbol
Min
Typ.
Max
Unit
ID
330
440
600
mA
IIRED
-1
Ie
65
180
500*)
mW/sr
Ie
50
125
500*)
mW/sr
VCC1 = 3.3 V, D = 0, 15
TXD = Low or SD = High
(Receiver is inactive as long as
SD = High)
Ie
0.04
mW/sr
r24
Op
Spectral bandwidth
'O
875
886
deg
900
45
tropt,
tfopt
10
nm
nm
40
ns
topt
207
217
227
ns
topt
117
125
133
ns
topt
242
250
258
ns
topt
topt
20
100
s
s
25
Optical overshoot
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313
TFDU6300
Vishay Semiconductors
Recommended Circuit Diagram
Operated at a clean low impedance power supply the
TFDU6300 needs no additional external components.
However, depending on the entire system design and
board layout, additional components may be required
(see figure 3).
VCC2
R1
VCC1
R2
C1
GND
IRED Anode
V CC
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
IRED Cathode
19307
Table 1.
Recommended Application Circuit Components
Component
Recommended Value
C1
4.7 F, 16 V
C2
0.1 F, Ceramic
R1
R2
10 :, 0.125 W
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314
CRCW-1206-10R0-F-RT1
TFDU6300
Vishay Semiconductors
I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the
function verified with the special drivers available
from the I/O suppliers. In special cases refer to the
I/O manual, the Vishay application notes, or contact
directly Vishay Sales, Marketing or Application.
Mode Switching
The TFDU6300 is in the SIR mode after power on as
a default mode, therefore the FIR data transfer rate
has to be set by a programming sequence using the
TXD and SD inputs as described below. The low
frequency mode covers speeds up to 115.2 kbit/s.
Signals with higher data rates should be detected in
the high frequency mode. Lower frequency data can
also be received in the high frequency mode but with
reduced sensitivity. To switch the transceivers from
low frequency mode to the high frequency mode and
vice versa, the programming sequences described
below are required.
50 %
SD
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
Table 2.
Truth table
Inputs
Outputs
SD
TXD
RXD
Transmitter
high
weakly pulled
(500 k:) to VCC1
0
Ie
low
high
high
low
high
low
low
<4
high
low
low
low (active)
low
low
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315
TFDU6300
Vishay Semiconductors
Recommended Solder Profiles
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
90 s max.
2...4 C/s
275
T 255 C for 10 s....30 s
250
225
0
50
19535
100
150
200
250
300
350
Tpeak = 260 C
200
Time/s
Temperature/C
Temperature (C)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
260
240
220
200
180
Temperature/C
2 C...3 C/s
50
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
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316
TFDU6300
Vishay Semiconductors
Package Dimensions
TFDU6300 (Universal) Package
19533
www.vishay.com
317
TFDU6300
Vishay Semiconductors
Tape and Reel Information
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
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318
W3 max.
TFDU6300
Vishay Semiconductors
Tape Dimensions
19855
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
Figure 10. Tape drawing, TFDU6300 for top view mounting
www.vishay.com
319
TFDU6300
Vishay Semiconductors
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
Figure 11. Tape drawing, TFDU6300 for side view mounting
www.vishay.com
320
TFDU6301
Vishay Semiconductors
20101
Features
Compliant to the latest IrDA physical layer
specification (up to 4 Mbit/s) with an
extended low power range of > 70 cm (typ.
1 m) and TV Remote Control (> 9 m)
e3
Operates from 2.4 V to 3.6 V within
specification
Low power consumption (1.8 mA typ. supply current)
Power shutdown mode (0.01 A typ. shutdown
current)
Surface mount package
- Universal (L 8.5 mm x H 2.5 mm x W 3.1 mm)
Tri-state-receiver output, floating in shut down with
a weak pull-up
Applications
Notebook computers, desktop PCs, Palmtop computers (Win CE, Palm PC), PDAs
Digital cameras and video cameras
Printers, fax machines, photocopiers, screen projectors
Parts Table
Part
Description
TFDU6301-TR3
2500 pcs
TFDU6301-TT3
2500 pcs
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321
TFDU6301
Vishay Semiconductors
Functional Block Diagram
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
SD
Logic
&
Controlled
Driver
Control
TXD
GND
18468_1
Pin Description
Pin Number
1
Function
Description
I/O
Active
VCC2
IRED anode to be externally connected to Vcc2 (VIRED). For higher voltages
IRED Anode than 3.6 V an external resistor might be necessary for reducing the internal
power dissipation. This pin is allowed to be supplied from an uncontrolled
power supply separated from the controlled Vcc1 - supply.
IRED
Cathode
TXD
HIGH
RXD
LOW
SD
Shutdown, also used for dynamic mode switching. Setting this pin active
places the module into shutdown mode. On the falling edge of this signal,
the state of the TXD pin is sampled and used to set receiver low bandwidth
(TXD = Low: SIR) or high bandwidth (TXD = High: MIR and FIR) mode.
HIGH
VCC1
Supply voltage
NC
GND
Ground
TFDU6301
weight 0.075 g
19531
Figure 2. Pinning
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322
TFDU6301
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin: GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
VCC2
- 0.5
6.5
Input currents
Typ.
- 0.5
PD
Junction temperature
TJ
V
mA
25
mA
500
mW
125
Tamb
- 25
+ 85
Tstg
- 25
+ 85
260
IIRED (DC)
150
mA
IIRED (RP)
700
mA
6
10
ESD protection
IEC60825-1 or EN60825-1,
edition Jan. 2001
Ie
1
1.8
kV
2.0
mm
mW/sr
*)
(500)**)
*) Due to the internal limitation measures and the IrDA defined transmission protocol the device is a "class 1" device when operated inside
the absolute maximum ratings
**) IrDA specifies the maximum intensity with 500 mW/sr
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the Low
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4. A new version of the standard in any case obsoletes the former version.
With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version IrPhy 1.4
(in Oct. 2002).
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323
TFDU6301
Vishay Semiconductors
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Supply voltage
Dynamic Supply current
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
ICC
1.8
3.0
mA
MIR/FIR mode
ICC
2.0
3.3
mA
SD = High
T= 25 C, not ambient light
sensitive, detector is disabled in
shutdown mode
ISD
0.01
ISD
TA
- 25
Internally generated
Vdd
1.62
VIL
- 0.5
VIH
1.5
IICH
-1
IOL = 500 A
Cload = 15 pF
IOH = - 250 A
Cload = 15 pF
Short to Ground
Short to VCC1
Activating shutdown
All modes
PA
+ 85
1.98
0.5
+1
CI
pF
VOL
0.4
VOH
1.8
1.8
0.8 x Vdd
20
20
30
RRXD
400
tSDPW
200
500
mA
mA
600
k:
ns
The typical threshold level is 0.5 x Vdd. It is recommended to use the specified min/max values to avoid increased operating current.
www.vishay.com
324
TFDU6301
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Symbol
Ee
Minimum irradiance Ee in
angular range, MIR mode
1.152 Mbit/s
O = 850 nm to 900 nm,
VCC = 2.4 V
Ee
Minimum irradiance Ee
inangular range, FIR mode
4 Mbit/s
O = 850 nm to 900 nm,
VCC = 2.4 V
Ee
Maximum irradiance Ee in
angular range***)
O = 850 nm to 900 nm
Ee
Min
Typ.
Max
Unit
50
(5)
80
(8)
mW/m2
(W/cm2)
100
(10)
130
(13)
mW/m2
(W/cm2)
200
(20)
5
(500)
mW/m2
(W/cm2)
kW/m2
(mW/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
10
40
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
10
40
ns
tPW
1.6
2.2
tPW
105
250
275
ns
tPW
105
125
145
ns
tPW
225
250
275
ns
25
80
350
ns
ns
ns
250
100
Latency
tL
40
Note: All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header. The data given here are valid 5 s
after starting the preamble.
*)
IrDA low power specification is 90 mW/m2. Specification takes into account a window loss of 10 %.
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325
TFDU6301
Vishay Semiconductors
Transmitter
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
IRED operating current,
switched current limiter
Test Conditions
Note: No external resistor
current limiting resistor is
needed
Symbol
Min
Typ.
Max
Unit
ID
330
440
600
mA
IIRED
-1
Ie
65
180
500*)
mW/sr
Ie
50
125
500*)
mW/sr
VCC1 = 3.3 V, D = 0, 15
TXD = Low or SD = High
(Receiver is inactive as long as
SD = High)
Ie
0.04
mW/sr
r24
Op
Spectral bandwidth
'O
875
886
900
45
tropt,
tfopt
10
nm
nm
40
ns
topt
207
217
227
ns
topt
117
125
133
ns
topt
242
250
258
ns
topt
topt
20
100
s
s
25
Optical overshoot
www.vishay.com
326
TFDU6301
Vishay Semiconductors
Recommended Circuit Diagram
Operated at a clean low impedance power supply the
TFDU6300 needs no additional external components.
However, depending on the entire system design and
board layout, additional components may be required
(see figure 3).
VCC2
R1
VCC1
R2
C1
GND
IRED Anode
V CC
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
IRED Cathode
19307
Table 1.
Recommended Application Circuit Components
Component
Recommended Value
C1
4.7 F, 16 V
C2
0.1 F, Ceramic
R1
R2
10 :, 0.125 W
CRCW-1206-10R0-F-RT1
www.vishay.com
327
TFDU6301
Vishay Semiconductors
I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the
function verified with the special drivers available
from the I/O suppliers. In special cases refer to the I/O
manual, the Vishay application notes, or contact
directly Vishay Sales, Marketing or Application.
Mode Switching
The TFDU6300 is in the SIR mode after power on as
a default mode, therefore the FIR data transfer rate
has to be set by a programming sequence using the
TXD and SD inputs as described below. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the
high frequency mode. Lower frequency data can also
be received in the high frequency mode but with
reduced sensitivity. To switch the transceivers from
low frequency mode to the high frequency mode and
vice versa, the programming sequences described
below are required.
50 %
SD
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
Table 2.
Truth table
Inputs
TXD
RXD
Transmitter
high
weakly pulled
(500 k:) to VCC1
low
high
high
Ie
low
high
low
low
<4
high
low
low
low (active)
low
low
www.vishay.com
328
Outputs
SD
TFDU6301
Vishay Semiconductors
Recommended Solder Profiles
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 C
240 C max.
2...4 C/s
160 C max.
120 s...180 s
90 s max.
2...4 C/s
275
T 255 C for 10 s....30 s
250
225
0
50
100
19535
150
200
250
300
350
Tpeak = 260 C
200
Time/s
Temperature/C
Temperature (C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
260
240
220
200
180
Temperature/C
2 C...3 C/s
50
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Document Number 84668
Rev. 1.2, 21-Jun-06
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329
TFDU6301
Vishay Semiconductors
Package Dimensions in mm
TFDU6301 (Universal) Package
19533
www.vishay.com
330
TFDU6301
Vishay Semiconductors
Tape and Reel Information
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
W3 max.
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331
TFDU6301
Vishay Semiconductors
Tape Dimensions in mm
19855
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
Figure 10. Tape drawing, TFDU6301 for top view mounting
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332
TFDU6301
Vishay Semiconductors
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
Figure 11. Tape drawing, TFDU6301 for side view mounting
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333
TFBS6614
Vishay Semiconductors
18088
Features
Small size:
H 2.7 mm x W 3.33 mm x L 7.98 mm
Typical 1.0 m link distance, typ. RC range
e4
20 m
Battery and power management features:
> Receive - 2 mA typical
> Shutdown - 10 nA typical
> Independent LED anode power supply
> Wide voltage range 2.6 V - 5.5 V
> High VCC noise rejection > 100 mVPP
The TXD-echo function is enabled
Vlogic (1.5 V - 5.5 V) - Independent digital supply
voltage
Applications
PDAs
Mobile phones
Notebook computers, desktop PCs
Digital photo and video cameras
External infrared adapters (Dongles)
Diagnostics systems
Medical and industrial data collection
GPS
Ordering Information
Part Number
TFBS6614-TR3
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334
Description
Oriented in carrier tape for side view surface mounting
Quantity / Reel
2500 pcs
TFBS6614
Vishay Semiconductors
Functional Block Diagram
VCC1
Amplifier
Comparator
Tri-state driver
RXD
IRED
IRED A
VCC2
Current
control
SD
Mode
control
IRED C
TXD
GND
Pinout
TFBS6614, side view
Weight 80 mg
Emitter
19906
Detector
Pin Description
Pin Number
Function
IRED Anode
IRED Cathode
TXD
RXD
5
SD
Description
high
low
high
VCC1
Vlogic
Supply Voltage, digital part, I/O reference voltage for inputs and
outputs.
GND
Ground
Active
I/O
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335
TFBS6614
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin: GND unless otherwise noted
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Supply voltage range,
transceiver
Test Conditions
0 V < VCC2 < 6 V
Symbol
Min
Max
Unit
VCC1
- 0.5
Typ.
+ 6.0
VCC2
- 0.5
+ 6.5
Vlogic
- 0.5
+ 6.0
Input current
10.0
mA
PD
Junction temperature
125
qC
- 25
+ 85
qC
Tstg
- 25
+ 85
qC
260
qC
IIRED(DC)
125
mA
IIRED(RP)
600
mA
vin
Method:
(1-1/e) encircled energy
mA
mW
Tamb
TJ
25
500
5.5
1.5
2.1
V
mm
internal
limitation
to class 1
500
mW/sr
Due to the internal limitation measures the device is a class 1 device under the specified conditions. It will not exceed the IrDA intensity
limit of 500mW/sr
*) Sn/Pb and lead (Pb)-free soldering. The product passed VISHAYs standard convection reflow profile soldering test.
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the Low
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4.A new version of the standard in any case obsoletes the former version.
Note: We apologize to use sometimes in our documentation the abbreviation LED and the word Light Emitting Diode instead of Infrared
Emitting Diode (IRED) for IR -emitters. That is by definition wrong; we are here following just a bad trend.
www.vishay.com
336
TFBS6614
Vishay Semiconductors
Optoelectronic Characteristics
Transceiver
Tamb = 25 qC, VCC = 2.6 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC
2.6
Typ.
Max
Unit
5.5
mA
SD = Low, Ee = 0 klx
ICC
ICC
mA
ICC
10
mA
ISD
2.0
PA
ISD
2.5
PA
ISD
PA
+ 85
qC
VOL
VOH
0.8 x Vlogic
VOH
0.9 x Vlogic
Short to ground
20
mA
Short to Vlogic
20
mA
SD = High
600
k:
TA
- 25
0.4
V
V
V
RRXD
400
VIL
- 0.5
500
0.5
Vlogic - 0.5
Vlogic + 0.5
VIH
Shutdown current
Vlogic = 3.3 V
Vin(SD) = 2.5 V
ISD
PA
Shutdown supply
Vlogic = 3.15 V
Vin(SD) = 2.5 V
ISD
0.5
PA
VIH
2.4
- 25 qC to 85 qC
IL
- 10
CIN
V
+ 10
PA
pF
*) Receive
mode only.
In transmit mode, add additional 85 mA (typ) for IRED current. Add RXD output current depending on RXD load.
**) Standard
Illuminant A.
***)
The typical threshold level between 0.5 x Vlogic (Vlogicd 3 V) and 0.4 x Vlogic(Vlogic = 5.5 V). It is recommended to use the specified
min/max values to avoid increased operating/shutdown current.
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337
TFBS6614
Vishay Semiconductors
Receiver
Tamb = 25 qC, VCC = 2.6 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Minimum detection threshold
Test Conditions
Symbol
Min
Typ.
Ee
40
(4)
4.0 Mbit/s
O= 850 nm to 900 nm
Ee
100
(10)
O = 850 nm to 900 nm
Ee
irradiance 2)
Max
Unit
mW/m2
(PW/m2)
150
(15)
5
(500)
mW/m2
(PW/m2)
mW/m2
(mW/m2)
*)
10 % to 90 %, 15 pF
tr(RXD)
10
40
90 % to 10 %, 15 pF
tf(RXD)
10
40
tPW
tPW
1.5
1.8
2.6
Ps
tPW
110
250
270
ns
tPW
100
140
ns
tPW
225
275
ns
Ee
4
(0.4)
mW/m2
(PW/m2)
ns
ns
Ps
2.1
20
ns
40
ns
80
ns
ns
350
500
300
Latency
tL
170
Note: All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header. The data given here are valid 5s
after starting the preamble.
This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent
lamps
Retriggering during applied optical pulse may occur
1) 2)
1) Minimum
Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is
operating at the Minimum Intensity in Angular Range into the minimum Half-Angular Range at the maximum Link Length
2)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical power delivered to the detector by a source operating at
the Maximum Intensity In Angular Range at Minimum Link Length must not cause receiver overdrive distortion and possible related link
errors. If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER)
specification.
For more definitions see the document Symbols and Terminology on the Vishay Website
http://www.vishay.com/docs/82512/82512.pdf
www.vishay.com
338
TFBS6614
Vishay Semiconductors
Transmitter
Tamb = 25 qC, VCC = 2.6 V to 5.5V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
IRED operating current,
switched current limiter
Test Conditions
Symbol
Min
Typ.
Max
Unit
ID
500
550
650
mA
PA
110
400
mW/sr
0.04
mW/sr
IIRED
-1
D = 0 q, 15 q
TXD = High, SD = Low,
VCC1 = VCC2 = 3.3 V
Internally current-controlled, no
external resistor
Ie
90
Ie
Op
Spectral bandwidth
'O
r24
880
886
q
900
40
nm
nm
tropt, tfopt
10
40
ns
topt
207
217
227
ns
topt
117
125
133
ns
topt
242
250
258
ns
topt
topt
20
100
s
s
25
Optical overshoot
Mode Switching
The TFBS6614 is in the SIR mode after power on as
a default mode, therefore the FIR data transfer rate
has to be set by programming sequence using the
TXD and SD inputs as described below. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the
high frequency mode. Lower frequency data can also
be received in the high frequency mode but with
reduced sensitivity. To switch the transceivers from
low frequency mode to the high frequency mode and
vice versa, the programming sequences described
below are required.
www.vishay.com
339
TFBS6614
Vishay Semiconductors
Setting to the Lower Bandwidth Mode
(2.4 kbit/s to 115.2 kbit/s)
1. Set SD/ Mode input to logic "High".
2. Set TXD input to logic "Low". Wait ts t200 ns.
3. Set SD/ Mode to logic "Low" (the negative edge
latches state of TXD, which determines speed setting).
4. TXD must be held for th t 200 ns.
TXD is now enabled as normal TXD input for the
lower bandwidth mode.
SD
50%
ts
th
High: FIR
TXD 50%
50%
Low: SIR
Truth table
Inputs
TXD
RXD
Transmitter
high
low
high
low (active)
Ie
low
high
> 80 s
high
low
low
<4
high
low
low
low (active)
low
low
www.vishay.com
340
Outputs
SD
TFBS6614
Vishay Semiconductors
Recommended Circuit Diagram
Operated at a clean low impedance power supply the
TFBS6614 needs no additional external components
when the internal current control is used. For reducing
the IRED drive current for low power applications with
reduced range an additional resistor can be used to
connect the IRED to the separate power supply.
Depending on the entire system design and board
layout, additional components may be required. (see
figure 3).
Worst-case conditions are test set-ups with long
cables to power supplies. In such a case capacitors
are necessary to compensate the effect of the cable
inductance. In case of small applications as e.g.
mobile phones where the power supply is close to the
transceiver big capacitors are normally not necessary.
The TFBS6614 is designed to operate in system with
logical I/O level independent of the supply voltage. It
can interface to IR controllers with low voltage logic
from 1.5 V upwards to TTL (5 V). The reference voltage is to be connected to the Vlogic input.
VCC2
R1
VCC
R2
C1
IRED Anode
VCC
C2
GND
Ground
SD
SD
TXD
TXD
RXD
RXD
Table 1.
Recommended Application Circuit Components
Component
Recommended Value
C1, C2
R1
R2
10 :, 0.125 W
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341
TFBS6614
Vishay Semiconductors
Recommended Solder Profiles
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
260
10 s max. at 230 C
240 C max.
240
220
2...4 C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
280
T 255 C for 20 s max
260
240
T 217 C for 50 s max
220
200
180
Temperature/C
Temperature/C
160 C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 C...4 C/s
80
60
2 C...4 C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
www.vishay.com
342
TFBS6614
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
W3 max.
www.vishay.com
343
TFBS6614
Vishay Semiconductors
Tape Dimensions in mm
19616
Drawing-No.: 9.700-5299.01-4
Issue: 1; 18.08.05
Figure 6. Tape drawing, TFBS6614 for side view mounting
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344
Contents
TFDU7100 ............................. 346
FIR
with RC
Receiver
www.vishay.com
3
TFDU7100
Vishay Semiconductors
Features
Compliant to the latest IrDA physical
layer specification (9.6 kbit/s to 4 Mbit/s)
TV Remote Control receiver with 18 m
e3
receive range
Remote Control carrier frequency 36 kHz
to 38 kHz
Operates from 2.7 V to 5.5 V within specification
over full temperature range from - 25 C to + 85 C
Surface Mount Package, low profile
(L 9.9 mm x 4.1 mm x 4 mm)
Compliant with IrDA Background Light Specification
Applications
Remote control and IrDA communication in
Multimedia
Notebook computers, Desktop PCs, Internet TV
Boxes, Video Conferencing Systems
Digital Still and Video Cameras
Printers, fax machines, Photocopiers, Screen
Projectors
Parts Table
Part
Description
Qty / Reel
TFDU7100-TR3
1000 pcs
TFDU7100-TT3
1000 pcs
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346
TFDU7100
Vishay Semiconductors
Functional Block Diagram
Open Collector
Output
Amplifier
Envelope
Generator
RC - Rxd
Push-Pull
Driver
Amplifier
Comparator
VCC2
Rxd
SD
Logic
&
Controlled Driver
Control
TXD
VCC1
GND
19597
Pin Description
Pin Number
Function
Description
VCC2
IRED Anode
I/O
Active
IRED Cathode
TXD
HIGH
RXD
LOW
SD
HIGH
VCC1
Supply Voltage
RC-Rxd
LOW
GND
Ground
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347
TFDU7100
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin: GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
+ 6.0
VCC2
- 0.5
+ 6.0
Voltage at RXD
VRXD
- 0.5
VCC1 + 0.5
Vin
- 0.5
+ 6.0
10
mA
Typ.
Junction temperature
TJ
PD
125
- 30
+ 85
Tstg
- 40
+ 100
260
IIRED (DC)
125
mA
IIRED (RP)
700
mA
IEC60825-1 or
EN60825-1,
edition Jan. 2001, operating
below the absolute maximum
ratings
Ie
*)
mA
mW
Tamb
25
250
2.5
2.8
mm
*)
(500)**)
mW/sr
Due to the internal limitation measures the device is a "class1" device under all conditions.
**)
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the Low Power
Option to MIR and FIR and VFIR was added with IrPhy 1.4. A new version of the standard in any case obsoletes the former version. With
introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version IrPhy 1.4 (in
Oct. 2002).
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348
TFDU7100
Vishay Semiconductors
Electrical Characteristics
Transceiver
Tested at Tamb = 25 C, VCC1 = VCC2 = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC1
2.7
Typ.
Max
Unit
5.5
ICC1
mA
ICC
6.5
mA
SD = High, T = 25 C, Ee = 0 klx
ISD
mA
TA
- 30
+ 85
Cload = 15 pF
VOL
- 0.5
0.15 x
VCC1
IOH = - 500 A
IOH = - 250 A, Cload = 15 pF
VOH
0.8 x VCC1
0.9 x VCC1
VCC1 + 0.5
V
V
RRxd
400
600
k:
VIL
- 0.5
0.5
VIH
VCC1 - 0.5
-2
+2
+ 150
pF
IICH
IIrTX
IIrTX
Input capacitance
(TXD, SD)
*)
-1
500
CI
The Remote Control receiver is always on. The shutdown function is used for disabling the IrDA channel, only
**)
Standard Illuminant A
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349
TFDU7100
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tested at Tamb = 25 C, VCC1 = vCC2 = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Minimum detection threshold
irradiance, SIR mode*)**)
Test Conditions
Symbol
Ee
Ee
O = 850 nm - 900 nm
Ee
Min
O = 850 nm - 900 nm
tr, tf < 40 ns, tpo = 1.6 s at
f = 115 kHz, no output signal
allowed
Ee
Max
Unit
45
(4.5)
81
(8.1)
mW/m2
100
(10)
190
(19)
5
(500)
range***)
Logic LOEW receiver input
irradiance
Typ.
(W/cm2)
mW/m2
(W/cm2)
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(W/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
40
90 % to 10 %, CL = 15 pF
tf (RXD)
40
tPW
tPW
1.5
1.8
2.6
tPW
110
250
270
ns
tPW
100
140
ns
tPW
225
275
ns
tPW
225
*)
2.1
ns
ns
s
275
ns
Ee = 200 mW/m2,
4 Mbit/s
20
ns
Ee = 200 mW/m2,
1.152 kbit/s
40
ns
80
ns
Ee = 200 mW/m2,
d 115.2 kbit/s
350
ns
500
IrDA low power specification is 90 mW/m2. Spec takes a window loss 10 % into account.
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link
Length.
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the
maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors.
If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification
For more definitions see the document Symbols and Terminology on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
www.vishay.com
350
TFDU7100
Vishay Semiconductors
Remote Control Receiver*)
Tested at Tamb = 25 C, VCC1 = vCC2 = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing
Test Conditions
Symbol
Parameter
O = 950 nm
D = 0 , 15 , RC5/RC6, 36 kHz
EeRC
0.4
(0.04)
O = 950 nm
D = 0 , 15 , 36 kHz to 38 kHz
EeRC
0.4
(0.04)
mW/m2
(W/cm2)
O = 850 nm - 970 nm
EeRC
0.4
(0.04)
mW/m2
(W/cm2)
O = 850 nm - 900 nm
EeRCmax
30
- 0.5
CLoad = 15 pF, RL = 10 k:
VOLRC
CLoad = 15 pF, RL = 10 k:
VHLRC
*)
Min
Typ.
Max
Unit
mW/m2
(W/cm2)
W/m2
0.15 x VCC1
VCC1
V
V
**)
The RCRXD output is an open collector output, therefore a load resistor is mandatory.
Optoelectronic Characteristics
Transmitter
Tested at Tamb = 25 C, VCC1 = vCC2 = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing
Symbol
Min
Typ.
Max
Unit
Parameter
Test Conditions
ID
450
550
650
mA
VCC2 = 3.3 V, RS = 18 :
Ie 10 t mW/sr
ID
90
mA
IIRED
-1
Ie
50
70
300
mW/sr
D=0
TXD = High, SD = Low, no external
resistor for current limitation*)
Ie
80
200
400
mW/sr
VCC1 = 5.0 V, D = 0 , 15
TXD = Low or SD = High (Receiver is
inactive as long as SD = High)
Ie
0.04
mW/sr
Op
Spectral bandwidth
'O
Optical overshoot
880
900
45
nm
nm
tropt, tfopt
10
40
ns
topt
1.6
1.63
1.75
topt
207
217
227
ns
topt
117
125
133
ns
topt
242
250
258
ns
topt
topt
tTXD
tTXD
s
100
25
*)
Using an external current limiting resistor is allowed and recommended to reduce IRED intensity and operating current when current
reduction is intended to operate at the IrDA low power conditions.
E.g. for VCC2 = 3.3 V a current limiting resistor of Rs = 56 : will allow a power minimized operation at IrDA low power conditions.
**)
Note: Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for
the standard Remote Control applications with codes as e.g. Philips RC5/RC6 or RECS 80.
www.vishay.com
351
TFDU7100
Vishay Semiconductors
Recommended Circuit Diagram
Operated at a clean low impedance power supply the
TFDU7100 needs no additional external components
beside a resistor at the open collector RCRXD-output.
However, depending on the entire system design and
board layout, additional components may be required
(see figure 2).
VIRED
R1
VCC
R2
C1
IRED Anode
VCC1
C2
GND
R3
Ground
RCRXD
RC Rxd
SD
SD
TXD
Txd
RXD
Rxd
IRED Cathode
19600
Recommended Value
C1
4.7 PF, 16 V
C2
R1
R2
47 :, 0.125 W
CRCW-0805-47R
R3
10 k:, 0.125 W
CRCW-0805-10K
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352
TFDU7100
Vishay Semiconductors
I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the
function verified with the special drivers available
from the I/O suppliers. In special cases refer to the I/
O manual, the Vishay application notes, or contact
directly Vishay Sales, Marketing or Application.
Mode Switching
The TFDU7100 is in the SIR mode after power on as
a default mode, therefore the FIR data transfer rate
has to be set by a programming sequence using the
TXD and SD inputs as described below. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the
high frequency mode. Lower frequency data can also
be received in the high frequency mode but with
reduced sensitivity.
To switch the transceivers from low frequency mode
to the high frequency mode and vice versa, the programming sequences described below are required.
The SD-pulse duration for programming should be
limited to a maximum of 5 Ps avoiding that the transceiver goes into sleep mode.
50 %
SD
ts
High : FIR
50 %
TXD
th
50 %
Low : SIR
14873
Table 2.
Truth table
Inputs
Outputs
Remark
SD
TXD
RXD
Transmitter
RC-RXD
high
weakly pulled
(500 k: to VCC1)
low
high
Ie
low
high
> 100 Ps
high
low
low
low
<4
high
low
low
low (active)
low
low
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353
TFDU7100
Vishay Semiconductors
Recommended Solder Profiles
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 C
240 C max.
275
2...4 C/s
250
160 C max.
225
90 s max.
2...4 C/s
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
0
50
19535
100
150
200
250
300
350
2 C...3 C/s
50
Time/s
25
0
0
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
www.vishay.com
50
100
150
200
Time/s
19532
250
300
350
260
240
220
200
Temperature/C
180
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
354
Tpeak = 260 C
200
120 s...180 s
Temperature/C
Temperature (C)
85
80
75
70
65
60
55
50
2.0
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
TFDU7100
Vishay Semiconductors
Optical Window
For the design of the optical windows see application
note Window Size in Housings
19586
Figure 8. Package drawing TFDU7100, dimensions in mm, tolerance 0.2 if not otherwise mentioned
7x1=7
0.6
2.5
1
8
1
19587
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355
TFDU7100
Vishay Semiconductors
Tape and Reel
Reel dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Figure 10. Reel dimensions, tolerance 0.2 mm, if not otherwise mentioned
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
24
330
60
24.4
30.4
23.9
27.4
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356
W3 max.
TFDU7100
Vishay Semiconductors
Tape Dimensions
19819
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Figure 11. Tape dimensions, tolerance r0.2 mm, if not otherwise mentioned
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357
Vishay Semiconductors
www.vishay.com
358
Contents
TFDU8108 ............................. 360
VFIR
(9.6 kbit/s to 16 Mbit/s)
www.vishay.com
359
TFDU8108
Vishay Semiconductors
20110
Features
Compliant to the latest IrDA physical
layer standard (up to 16 Mbit/s), HP-SIR,
Sharp ASK and TV Remote Control
e3
Compliant to the IrDA "Serial Interface
Specification for Transceivers"
Surface mount Soldering to side and top view orientation
Surface Mount package 9.7 x 4.7 x 4.0 mm3
for side view and top view applications
Operating supply voltage from 2.7 V to 5.5 V
Compliant to all logic levels between 1.8 V and 5 V
TV Remote Control support
Low Power consumption (4.2 mA supply current)
Power Shutdown mode (1 A shutdown current)
Tri-State-receiver output, weak pull-up when in
output is disabled
Applications
Notebook Computers, Desktop PCs, Palmtop
computers (Win CE, Palm PC), PDAs
Digital still and video cameras
Printers, fax machines, photocopiers,
screen projectors
MP3 players
Package
TFDU8108
Baby Face
(Universal)
weight 200 mg
19497
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360
TFDU8108
Vishay Semiconductors
Ordering Information
Part Number
Description
Qty / Reel
TFDU8108-TR3
1000 pcs
TFDU8108-TT3
1000 pcs
TFDU8108
In tube
50 pcs
ASIC
Vlogic
RXD
+
Driver
Vcc2
Logic
IRKAT
AGC
SCLK
Serial Interface
TXD
GND
GND
19493
Definitions:
In the Vishay transceiver data sheets the following nomenclature is
VFIR: 16 Mbit/s
MIR and FIR were implement with IrPhy 1.1, followed by IrPhy 1.2,
adding the SIR Low Power Standard. IrPhy 1.3 extended the Low
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4.
A new version of the standard in any case obsoletes the former ver-
sion.
FIR: 4 Mbit/s
Pin Description
Pin Number
Function
Description
IRED Anode
IRED Cathode
TXD
RXD
SCLK
VCC
Supply Voltage
Vlogic
Supply voltage for digital part, 1.8 V to 5.5 V, defines logic swing for
TXD, SCLK, and RXD
GND
Ground
I/O
Active
HIGH
LOW
HIGH
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361
TFDU8108
Vishay Semiconductors
BabyFace (Universal)
"U" Option BabyFace
(Universal)
IRED
Detector
2 3 4 5 6
7 8
17087
Figure 2. Pinning
Min
Max
Unit
Parameter
Test Conditions
VCC1
- 0.5
VCC2
- 0.5
Vlogic
- 0.5
VIREDA
- 0.5
VTXD
- 0.5
Vlogic + 0.5
V RXD
- 0.5
Vlogic + 0.5
10
mA
Typ.
Junction temperature
mA
mW
125
- 25
+ 85
Tstg
- 40
+ 100
260
IIRED (DC)
130
mA
IIRED (RP)
600
25
350
Tamb
TJ
PD
2.5
2.8
mA
mm
Internal
limitation to
class 1
500
mW/sr
Due to the internal limitation measures the device is a "class1" device. It will not exceed the IrDA intensity limit of 500 mW/sr.
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362
TFDU8108
Vishay Semiconductors
Electrical Characteristics
Transceiver
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Max
Unit
Parameter
Test Conditions
VCC1
2.7
Typ
5.5
Vlogic
1.8
5.5
Receive mode only. In transmit mode, add the averaged programmed current of IRED current as ICC2
ICC1
0.8
2.5
mA
ICC1
10
mA
Ilogic
Ilogic
mA
2
2
A
A
+ 85
0.4
ISD
ISD
TA
Cload = 15 pF,
Vlogic = 3 V, IOLO < + 500 A
VOLO
Cload = 15 pF,
Vlogic = 5 V, IOHI < - 250 A
VOHI
- 25
0.8 x Vlogic
V IL
- 0.5
V IH
Vlogic - 0.3
VIL
IL
Input capacitance
CI
V
0.5
6
0.5 x Vlogic
- 10
V
V
+ 10
pF
*) Standard illuminant A.
**) In shutdown condition the device is not ambient light sensitive.
***) The device will work with less tight levels than specified min/max values of the logic input voltage. It is recommended to use the specified min/max values to minimize operating/standby supply currents.
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Optoelectronic Characteristics
Receiver
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Typ.
Max
Unit
Parameter
Test Conditions
Ee
25
40
mW/m2
Ee
65
90
mW/m2
4 Mbit/s, FIR
O = 850 nm to 900 nm
Ee
85
90
mW/m2
16 Mbit/s, VFIR
O = 850 nm to 900 nm
Ee
140
200
mW/m2
O = 850 nm to 900 nm
Ee
Ee
Symbol
Min
10
kW/m2
mW/m2
tPW
1.3
2.6
tPW
1.3
2.6
tPW
200
260
ns
tPW
105
145
ns
tPW
225
285
ns
tPW
32
42
52
ns
20 % to 80%, CL = 15 pF
tr (RXD)
15
ns
20 % to 80%, CL = 15 pF
tr (RXD)
15
ns
90 % to 10%, CL = 15 pF
tr (RXD)
125
30
ns
350
ns
40
ns
20
ns
ns
tRXDdel
Latency
tLAT
55
100
tPOR
100
500
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TFDU8108
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Transmitter
Tamb = 25 C, VCC = 2.7 V to 5.5 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Test Conditions
Symbol
Parameter
ID
8
16
32
64
128
256
512
Ie
0.3
VCC = 5.0 V, D = 0 , 15
Txd = Low, programmed to
shutdown mode
Ie
tPW
tPW
20
60
tPW
240
260
ns
t PW
115
260
ns
tPW
115
135
ns
tPW
38.3
45.0
ns
Op
Spectral bandwidth
Optical rise time, fall time
Optical overshoot
Min
Typ.
1.45
Max
mA
600
mW/sr/mA
0.04
mW/sr
2.20
tTXD
125
24
870
900
40
tropt, tfopt
Unit
nm
nm
19
ns
15
*) Programmable using the"serial interface programming sequence, see Appendix A for implementation guidance and Appendix B for intensity values and range.
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TFDU8108
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Recommended Circuit Diagram
Operated with a low impedance power supply the
TFDU8108 series devices need no external components. However, depending on the entire system
design and board layout, additional components may
be required (see figure 3).
VCC2
R1
Recommended Value
C1
4.7 F, 16 V
C2
0.1 F, Ceramic
R1
R2
< 10 :, 0.125 W
VCC1
IRED
Cathode
R2
Rxd
C1
GND
C2
IRED
Anode
Rxd
Txd
Vcc
SCLK
GND
Vlogic
Vlogic
SCLK
Txd
17089
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Recommended Solder Profiles
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 C
240 C max.
2...4 C/s
160 C max.
275
90 s max.
225
50
Tpeak = 260 C
200
2...4 C/s
250
120 s...180 s
100
19535
150
200
250
300
350
Time/s
Temperature/C
Temperature (C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
2 C...3 C/s
50
25
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
Document Number 82558
Rev. 1.7, 19-Jan-06
0
0
50
100
150
200
Time/s
19532
250
300
350
260
240
220
200
Temperature/C
180
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
500
400
300
200
100
0
- 40 - 20
14875
Temperature (C)
Figure 7. Current Derating Diagram
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TFDU8108 - BabyFace (Universal) Package
(Mechanical Dimensions)
18473-1
Figure 8. Mechanical drawing, dimensions in mm, tolerance 0.2 mm if not otherwise shown
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TFDU8108
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Recommended SMD Pad Layout
7x1=7
0.6 ( 0.7)
2.5 ( 2.0)
1
8
1
16524-1
Figure 9. Mechanical drawing, dimensions in mm, tolerance 0.2 mm if not otherwise shown
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
24
330
60
24.4
30.4
23.9
27.4
W3 max.
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TFDU8108
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Tape Dimensions
19822
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Figure 11. Tape drawing,TFDU8108 for top view mounting, tolerance 0.1 mm
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TFDU8108
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19875
Drawing-No.: 9.700-5297.01-4
Issue: 1; 04.08.05
Figure 12. Tape drawing, TFDU8108 for side view mounting
after mounting, tolerance 0.1 mm
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TFDU8108
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Tube drawing
19496
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TFDU8108
Vishay Semiconductors
Appendix A
Serial Interface Implementation
Basics of the IrDA Definitions
The data lines are multiplexed with the transmitter
and receiver signals and separate clocks are used
since the transceivers respond to the same address.
When no infrared communication is in progress and
the serial bus is idle, the IRTX line is kept low and
IRRX is kept high.
OFE A
IRTX/SWDAT
TX/SWDAT
IRRX/SRDAT
Infrared
Controller
RX/SRDAT
SCLK1
Optical
Transceiver
SCLK
SCLK2
VCC
OFE B
TX/SWDAT
RX/SRDAT
Optical
Transceiver
SCLK
17092
Connector
Infrared
Controller
IRTX+/SWDAT+
IRTX-/SWDATIRRX+/SRDAT+
IRRX-/SRDATSCLK+
SCLK-
Shielded Cable
VCC
GND
VCC
LVDS
Transceiver
GND
TX/SWDAT
RX/SRDAT
SCLK
Optical
Transceiver
A_SL
GND
17093
Functional description
The serial interface is designed to interconnect two or
more devices. One of the devices is always in control
of the serial interface and is responsible for starting
every transaction. This device functions as the bus
master and is always the infrared controller. The infrared transceivers act as bus slaves and only respond
to transactions initiated by the master. A bus transaction is made up of one or two phases. The first phase
is the Command Phase and is present in every transaction. The second phase is the Response Phase
and is present only in those transactions in which data
must be returned from the slave. If the operation
involves a data transfer from the slave, there will be a
Response Phase following the Command Phase in
which the slave will output the data.
The Response Phase, if present, must begin 4 clock
cycles after the last bit of the Command Phase, as
shown in figures 9 and 10, otherwise it is assumed
that there will be no response phase and the master
can terminate the transaction.
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A series resistor (approx. 200 :) should be placed on
the receiver output from each transceiver to prevent
large currents in case a conflict occurs due to a programming error.
Note: Generally the abbreviations IRTX/IRRX and TXD/RXD are
used for the data transmission lines for the optical communication.
IRTX/IRRX is mostly used at the controller, TXD/RXD at the transceiver
19505
SCLK
IRTX/
SWDAT
IRRX/
SRDAT
19506
START
DATA
SCLK
IRTX/
SWDAT
19507
IRRX/
SRDAT
19503
IRTX/SWDAT line high after sending the address and index byte
Figure 17. Write Data Waveform
(or bytes). It will then set it low two clock cycles before the end of
the transaction. It is strongly recommended that optical transceiv-
Note: If the APEN bit in control register 0 is set to 1, the internal sig-
nal from the receiver photo diode is disconnected and the IRRX/
detect the end of the read transaction. This will always guarantee
SRDAT line is pulsed low for one clock cycle at the end of a write
or special command.
SCLK
IRTX/
SWDAT
IRRX/
SRDAT
19504
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Switching Characteristics
Maximum capacitive load = 20 pF*)
Parameters
Test Conditions
Min.
Max.
Unit
tCKp
Symbol
250
infinity
ns
tCKh
60
ns
tCKI
80
ns
tDOtv
tDOth
tDOrv
40
ns
tDOrh
40
ns
40
0
ns
ns
tDOrf
tDIs
10
ns
tDIh
ns
60
ns
*)
Maximum capacitive load = 20 pF. That is is different from "Serial interface - specification". For the bus protocol see "RECOMMENDED
SERIAL INTERFACE FOR TRANSCEIVER CONTROL, Draft Version 1.0a, March 29, 2000, IrDA". In Appendix B the transceiver related
data are given.
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Appendix B
Application Guideline
In the following some guideline is given for handling
the TFDU8108 in an application ambient, especially
for testing. It is also a guideline for interfacing with a
controller. We recommend to use for first evaluation
the Vishay IRM1802 controller. For more information
see the special data sheet. Driver software is available on request. Contact irdc@vishay.com.
Power-on
After power on the transceiver is in the default mode
shown in table B1.
Addressing
The transceiver is addressable by three address bits.
There are individual and common addresses with the
values shown in table B2.
Registers
The register content is listed in the tables B4 to B7.
Data Acknowledgment
Data acknowledgement generated by the slave is
available if the APEN bit is set to 1 in the common
control register, see the "main_ctrl_0" register values
table B4. In IrDA default state this functionality is disabled. It is recommended to enable this function.
sleep
RXD (Receive)
disable
APEN (Acknowledgment)
disable
SIR
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Table B2: Addressing
Description
Individual address
010
111
Mode
write/read
Actions
Register Name
0h
W/R
Common control
main-ctrl-0 register
[4:0]
00h
1h
W/R
Infrared mode
main-ctrl-1 register
[7:0]
00h
2h
W/R
main-ctrl-2 register
[7:4]
70h
3h - Bh
Not used
Ch
Not used
Dh
Reset transceiver,
Only one byte!
Not used
Eh
Not used
Fh
Not used
Extended indexing
Data Bits
Data
TFDU8108
default
Note: The main_ctrl_1 register is written software dependent on the offset value stored in ext_ctrl_7 and ext_ctrl_8 registers.
The main_ctrl_1 register can be set to the following values, shown in the table.
bit 0
INDEX [3:0], 0h
bit 1
bit 2
bit 0
ADDR [0:2]
bit 1
bit 2
bit 4
DATA [7:0]
Function
bit 0
shutdown
Default
bit 1
disabled
bit 2
disabled
enabled
bit 3
not used
bit 4
APEN*)
disabled
not used
dont acknowledge
acknowledge
disabled
*)
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Table B5: Register main-ctrl-1
Command structure:
C
bit 0
INDEX [3:0], 1h
bit 1
bit 2
bit 0
bit 1
bit 2
bit 3
ADDR [0:2]
bit 4
bit 5
bit 6
bit 7
DATA [7:0]
Function
00h
SIR (default)
01h
MIR
02h
FIR
03h
05h
VFIR - 16
08h
20h
IrDA CIR
Depending on the values of "ext_ctrl_7" and "ext_ctrl_8" check for correct main_ctrl_1. In case of an error, the transceiver will load 00h
into the main_ctrl_1 register and will not give an acknowledgement.
bit 0
INDEX [3:0], 1h
bit 1
bit 2
bit 0
bit 1
bit 2
bit 3
ADDR [0:2]
bit 4
bit 5
bit 6
bit 7
DATA [7:0]
bit
7
bit
6
bit
5
bit
4
bit
3
bit
2
bit
1
bit
0
le [mW/sr]
15
(typ. on axis)
Recommended for
8xhFxh
512
140 (240)
VFIR/FIR standard
7xh*)
256
> 70 (120) *)
SIR >1 m
FIR > 0.7 m, VFIR > 0.5 m
6xh
128
35 (60)
Extended FIR
Low Power
5xh
64
16 (30)
4xh
(48)
3xh
32
8 (19)
2xh
16
40 (10)
1xh
(5)
0xh
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IRED current If
[mA]
Intensity Ie
[mW/sr]
d[m] at Ee =
d[m] at Ee =
d[m] at Ee =
d[m] at Ee =
100 mW/m2
40 mW/m2
90 mW/m2
225 mW/m2
512
240
1.55
2.45
1.63
1.03
256
120
1.10
1.73
1.15
0.73
128
60
0.77
1.22
0.82
0.52
0.37
64
30
0.55
0.87
0.58
48
22.5
0.47
0.75
0.50
0.32
32
15
0.39
0.61
0.41
0.26
16
7.5
0.27
0.43
0.29
0.18
3.75
0.19
0.31
0.20
0.13
Note: Calculated expected range in dependence of IRED drive current for the case that the receiver sensitivity is not limiting the range, on
axis, for information only.
IRED current If
[mA]
Intensity Ie
[mW/sr]
d[m] at Ee =
d[m] at Ee =
d[m] at Ee =
d[m] at Ee =
100 mW/m2
40 mW/m2
90 mW/m2
225 mW/m2
512
140.0
256
70.0
1.18
1.87
1.25
0.79
0.15
0.23
1.16
128
35.0
0.10
0.59
0.94
0.62
64
0.39
17.5
0.42
0.66
0.44
0.28
48
13.1
0.36
0.57
0.38
0.24
32
8.8
0.30
0.47
0.31
0.20
16
4.4
0.21
0.33
0.22
0.14
2.2
0.15
0.23
0.16
0.10
Note: Calculated expected range in dependence of IRED drive current for the case that the receiver sensitivity is not limiting the range;
15 off-axis, for information only.
bit 0
INDEX [3:0], Fh
bit 1
bit 2
bit 0
bit 1
bit 2
ADDR [0:2]
bit 3
bit 4
bit 5
bit 6
bit 7
E_INDEX [0:7]
Response:
bit 0
bit 1
bit 2
bit 3
bit 4
bit 5
bit 6
bit 7
DATA [0:7]
E_INDEX [7:0]
Register name
DATA [7:0]
in TFDU8108
Definition default
in the TFDU8108
Manufacture ID
00h
ext_ctrl_0
0Bh
Chip information
(Factory reserved)
01h
ext_ctrl_1
C6h
Device ID
04h
ext_ctrl_4
23h
100s to 500s
Receiver Stabilization
05h
ext_ctrl_5
30h
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Action
E_INDEX [7:0]
Register name
DATA [7:0]
in TFDU8108
Definition default
in the TFDU8108
4 MHz
06h
ext_ctrl_6
03h
07h
ext_ctrl_7
2Fh
08h
ext_ctrl_8
01h
Sharp IR
F0h
ext_ctrl_240
0Ah
Chip information
(Factory reserved)
Reset
Master Command
no reaction
No acknowledgement generating
independent of the value of APEN
no reaction
No acknowledgement generating
independent of the value of APEN
No acknowledgement generating
independent of the value of APEN
no reaction
No reaction means that the slave does not start the respond phase.
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Appendix C
SCLK
TX
125 ns < Tclk
18496
Tsetup > 10 ns
Thold > 10 ns
Protocol Specifications
The serial interface protocol is a command-based
communication standard and allows for the communication between controller and transceiver by way of
serial programming sequences on the clock (SCLK),
transmit (TXD), and receive (RXD) lines. The SCLK
line is used as a clocking signal and the transmit/
receive lines are used to write/read data information.
The protocol requires all transceivers to implement
the write commands, but does not require the readportion of the protocol to be implemented (though all
transceivers must at least follow the various commands, even if they perform no internal action as a
result). This serial interface follows but does not support all read/ write commands or extended commands, supporting only the special commands and
basic write/read commands. Write commands to the
transceiver take place on the SCLK and TXD lines
and may use the RXD line for acknowledgment. A
command may be directed to a single transceiver on
the SCLK, TXD and RXD bus by specifying a unique
three-bit transceiver address, or a command may be
directed to all transceivers on the bus by way of a special three-bit broadcast address code. The Vishay
VFIR transceiver TFDU8108 will respond to transceiver address 010 and the broadcast address 111
only; it ignores all other transceiver addresses.
All commands have a common "header" or series of
leading bits, which take the form shown below.
first bit sent to transceiver
0
0/1
Sync.
Bits
R/W
0/1
I0
I1
I3
Commands Index
A0
A1
A2
...
...
Transceiver
Address
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One-byte Special Commands
One-byte special commands are used for time-critical
transceiver commands, such as full transceiver reset.
A total of six special commands are possible, although only one command is available on the
TFDU8108.
0
I0
Sync.
Bits
Special Command
Code
I1
I2
I3
A0
A1
A2
Transceiver
Address
Stop
Bits
Command
Programming Sequence
(Binary)
RESET
(Set all registers to default
value)
Sync.
Bits
I0
I1
I2
Commands
Index
I3
A0 A1 A2 A3 D0..07
Transceiver
Address
8 Data
Bits
Stop
Bits
programming
0Fh
Shutdown
00h
Receiver Mode
main_ctrl_1
DATA
SIR
00h
MIR
01h
FIR
02h
Apple Talk
03h
VFIR
05h
Sharp-IR
08h
LED Intensity
main_ctrl_2
DATA
8 mA
1xh
16 mA
2xh
32 mA
3xh
64 mA
5xh
128 mA
6xh
256 mA
7xh
512 mA
Fxh
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382
Common Ctrl
main_ctrl_0
Contents
TFDU2201 ............................. 384
Emitter/
Detector
pair
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18170
Features
Package dimension:
L 7.3 mm x W 4.55 mm x H 2.75 mm
SMD side view
e3
Fast PIN Photodiode for SIR and
FIR applications
Detector with high efficiency and high speed at low
bias voltage
Only 30 mA IRED peak current during transmission for IrDA SIR low power standard
Lead (Pb)-free device
Qualified for lead (Pb)-free and Sn/Pb processing
(MSL4)
Device in accordance with RoHS 2002/95/EC and
WEEE 2002/96/EC
Applications
Mobile Phones, Pagers, Personal Digital Assistants (PDA)
Handheld battery operated equipment
Parts Table
Part
Description
Qty / Reel
TFDU2201-TR1
750 pcs.
TFDU2201-TR3
2250 pcs.
Pin Description
Pin Number
Function
Description
IRED GND
IRED GND
IRED Anode
NC
The pins 4, 5, 6 are internally not connected. No modulated sources or voltages > 5 V
should be applied to these pins. It is recommended to ground these pins. In this case the
lead frame structure will work as an internal EMI shield.
5
6
7
Danode
Detector Anode
Dcathode
Detector Cathode
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Pinout
TFDU2201
weight 100 mg
18228
Test Conditions
Symbol
Min
Vr
- 0.3
Typ.
10
mA
IIRED(DC)
100
mA
IIRED(RP)
550
mA
VrIRED
Power dissipation
See Figure 3
- 0.3
Ptot
Juntion temperature
Storage temperature range
Soldering temperature
200
mW
125
Tamb
- 25
+ 85
Tstg
- 40
+ 85
260
TJ
Unit
12
Max
mm
Compatible to Class 1 opration of IEC 60825 or EN60825 with worst case IrDA SIR pulse pattern, 115.2 kbit/s
Electrical Characteristics
Transceiver
Tested for the following parameters (T = 25 C, unless otherwise stated)
Parameter
Supported data rates
Test Conditions
Symbol
Min
Base band
Typ.
9.6
Max
Unit
4000
kbit/s
Optoelectronic Characteristics
Receiver
Tested for the following parameters (T = 25 :C, unless otherwise stated)
Parameter
Spectral sensitivity
Test Conditions
| D | d 15 , Vr = 2 V,
O = 875 nm
Symbol
Min
Typ.
Max
Unit
SO
1.0
1.2
1.8
nA/(mW/m2)
12
VRev
0.2
Spectral bandwith
Max. operating irradiance
| D | d 90 C, VCC = 2 V
Vr = 2 V, O = 875 nm
Vr = 2 V, O = 875 nm
800
Ee, max
8000
V
nA
950
nm
15000
W/m2
tr
40
ns
tr
40
ns
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Transmitter
Tested for the following parameters (T = 25 C, unless otherwise stated)
Test Conditions
Symbol
Parameter
Ie = 4 to 28 mW/sr in | D | d 15
IF1
| D | d 15 , IF1 = 35 mA, 25 %
duty cycle
Ie
Ie
35
Forward voltage
If = 50 mA
Min
Typ.
Unit
mA
14
mW/sr
mW/sr
Vf
1.2
1.45
Op
880
900
nm
Max
30
45
nm
38
ns
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
2...4 C/s
160 C max.
120 s...180 s
90 s max.
2...4 C/s
50
19535
100
150
200
250
300
350
Time/s
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386
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
275
T 255 C for 10 s....30 s
250
225
Tpeak = 260 C
200
Temperature/C
Temperature (C)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
2 C...3 C/s
50
25
0
0
19532
50
100
150
200
Time/s
250
300
350
TFDU2201
Vishay Semiconductors
Current Derating Diagram
280
260
240
600
220
Temperature/C
180
200
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
500
400
300
Current derating as a function of
the maximum forward current of
IRED. Maximum duty cycle: 25 %.
200
100
0
0
50
100
150
200
250
300
0
- 40 - 20
Time/s
14875
Package Dimensions
19821
Drawing-No.: 6.550-5185.01-4
Issue: 5; 02.09.05
Figure 5. Package drawing, TFDU2201
Document Number 82539
Rev. 1.3, 21-Mar-06
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387
TFDU2201
Vishay Semiconductors
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
24
330
60
24.4
30.4
23.9
27.4
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388
W3 max.
TFDU2201
Vishay Semiconductors
Tape Dimensions
19820
Drawing-No.: 9.700-5227.01-4
Issue: 3; 03.09.99
Figure 6. Tape drawing, TFDU2201 for side view mounting
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389
Vishay Semiconductors
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390
Contents
TOIM4232 ..............................392
Endec
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391
TOIM4232
Vishay Semiconductors
18080
Features
Pulse shaping function (shortening
and stretching) used in SIR IrDA
applications
e3
Directly interfaces the SIR transceiver
TFD..- and TFB..- series to an RS232 port
Programmable baud clock generator (1200 Hz to
115.2 kHz), 13 baud rates
3/16 bit pulse duration or 1.627 s pulse selectable
SO16 - package
2.7 V to 3.6 V operation voltage, 5 V tolerant inputs
Low operating current
Lead (Pb)-free device
Qualified for lead (Pb)-free and Sn/Pb processing
(MSL4)
Device in accordance with RoHS 2002/95/EC and
WEEE 2002/96EC
Ordering Information
Part Number
TOIM4232-TR1
Qty / Reel
500 pcs
Block Diagram
Vcc
TD_IR
TD_232
Endec
RD_232
RD_IR
TD_LED
Baud
Generator
BR/D
RD_LED
S1
S2
Logic
RESET
Vcc_SD
Osci llator
GND
X1
X2
18079
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392
TOIM4232
Vishay Semiconductors
Pin Assignment and Description
Pin Number
Symbol
Description
RESET
Resets all internal registers. Initially must be HIGH ("1") to reset internal
registers. When HIGH, the TOIM4232 sets the IrDA default bit rate of
9600 bit/s, sets pulse width to 1.627 s. The VCC_SD output is simply an
inverted reset signal which allows to shut down of a TFDx4x00 transceiver
when applying the reset signal to the TOIM4232. When using devices with
external SD like TFDU4203, the reset line can be used directly as shut
down signal. RESET pin can be controlled by either the RTS or DTR line
through RS232 level converter. Minimum hold time for resetting is 1 s.
Disables the oscillator when active.
I/O
Active
BR/ D
RD_232
Received signal data output of stretched signal to the RS232 RXD line
(using level converter).
HIGH
TD_232
Input of the signal to be transmitted from the RS232 port TXD line (passing
the level converter).
HIGH
VCC_SD
Outputs an inverted RESET signal. Can be used to shut down the power
supply of a 4000 series transceiver (e.g., TFDU4100). VCC shutdown
output function. This pin can be used to shut down a transceiver (e.g.,
TFDx4xxx). Output polarity: Inverted RESET input.
LOW
X1
Crystal input clock, 3.6864 MHz nominal. Input for external clock *)
X2
Crystal *)
HIGH
GND
Ground in common with the RS232 port and IrDA transceiver ground
TD_LED
Transmit LED indicator driver. Use 180 : current limiting resistor in series
to LED to connect to VCC. (VCC = 3.3 V)
LOW
10
RD_LED
Receive LED indicator driver. Use 180 : current limiting resistor in series
to LED to connect to VCC. (VCC = 3.3 V)
LOW
11
NC
No connection
12
S1
User Programmable Bit. Can be used to turn ON/ OFF a front-end infrared
transceiver (e.g., an infrared module at the adapter front)
LOW
13
S2
User Programmable Bit. Can be used to turn ON/ OFF a front-end infrared
transceiver (e.g., an infrared module at the adapter back)
LOW
14
TD_IR
HIGH
15
RD_IR
Data input from the infrared transceiver, min. pulse duration 1.63 s **)
LOW
16
VCC
Supply voltage
*) Crystal should be connected as shown in figure 2. In addition connect a 100 k: resistor from Pin 6 to Pin 7 and from Pin 6 and Pin 7 a
22 pF capacitor to ground, respectively. When an external clock is available connect it to Pin 6 leaving Pin 7 open. The external resistor
of 100 k: is used to accelerate the start of oscillation after reset or power - on. The value depends on the "Q" of the resonator. With low
Q resonators it is not necessary. The start - up time of the oscillator is between 30 s (with piezo resonators) and above 2 ms with high Q
quartzes.
**) All Vishay Semiconductor SIR transceivers fulfill this condition
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393
TOIM4232
Vishay Semiconductors
Block diagram of application circuit
RESET VCC_SD
DTR
VCC
RTS
BR/D
TD_IR
TXD
TXD
TD_232
RD_IR
RXD
RD_232
RXD
RS232 9 pin
connector
TOIM4232
Level
converter
X1
R1
X2
100 k
TFDU4100
TFDU420x
TFDU4300
3.6864 MHz
C1
C2
2 x 22 pF
18081
Table 1.
Recommended Application Circuit Components
Component
Recommended Value
C1
C2
R1
Quartz Crystal
22 pF
22 pF
100 k:
3.686400 MHz
Test Conditions
Supply voltage
Input voltage
Symbol
Min
VCC
- 0.5
3.6
- 0.5
5.5
- 0.5
VCC + 0.5
mA
All pins
Output voltage
All pins
All pins
Typ.
IO
TJ
Ambient temperature
(operating)
Tamb
- 25
Storage temperature
Tstg
- 25
Soldering temperature
Tsldr
Max
Unit
125
85
85
260
DC Characteristics
Parameter
Test Conditions
Symbol
Min
Typ.
Max
Unit
VCC
2.7
3.3
3.6
Test Conditions
Symbol
Min
Typ.
Max
Unit
VIH
2.0
Operating voltage
VCC = 3.3 V 5 %, operating temperature = - 55 C to + 125 C
Parameter
Input HIGH voltage
VIL
0.8
Vhyst
0.6
V
V
PA
IL
- 10
IOH = - 2.0 mA
VOH
2.0
IOH = - 0.5 mA
VOH
2.4
IOL = + 2.0 mA
VOL
0.4
ISB
ICC
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394
10
V
V
mA
TOIM4232
Vishay Semiconductors
Operation Description
Figure 2 shows a typical example of an RS232 port
interface. The TOIM4232 connects to an RS232 level
converter on one side, and an infrared transceiver on
the other. The internal TOIM4232 baud rate generator
can be software controlled.
When BR/D = 0, the TOIM4232 interprets the channels TD_232 to TD_IR and RD_IR to RD_232 as data
channels.
On the other hand, whenever BR/D = 1, the
TOIM4232 interprets TD_232 as Control Word for
setting the Baud rate. The Baud rate can be programmed to operate from 1200 bit/s to 115.2 kbit/s.
As RS232 level converter, EIA232 or MAX232 or
equivalent are recommended.
When using the TOIM4232 directly connected to an
UART it is compatible to 5 V TTL and 3.3 V CMOS
logic.
Typical external resistors and capacitors are needed
as shown in the TFDx4xxx references.
The output pulse duration can also be programmed,
see chapter "Operation Description". It is strongly recommended using 1.627 s output pulses to save battery power. As frequency determining component a
Vishay XT49M Crystal is recommended, when no
external clock is available.
We strongly recommend not to use this 3/16 mode
because 3/16 pulse length at lower bit rates consumes more power than the shorter pulse. At a
data rate of 9600 bit/s, the ratio of power consumption of both modes is a factor of 12 (!).
S1
Second Character
S0
B3
B2
B1
B0
LSB
X: Do not care
S1, S2: User programmable bit to program the outputs S1 and S2
S0: Irda pulse select
S0 = (1): 1.627 s pulses
S0 = (0): 3/16 bit time pulses, not recommended
B0 .. B3: Baud rate select words
Example:
To set TOIM4232 at COM2 port (2F8) to 9600 bit/s
with 3/16 bit time pulse duration send to the
TOIM4232 in programming mode in e.g. "Basic"
OUT &H2F8, (&H6)
For same port, 9600 bit/s and 1.627 s pulse duration
send
OUT &H2F8, (&H16)
For additionally activating S1 send
OUT &H2F8, (&H36)
S2
B2
B1
B0
2nd
Char
Baud Rate
115.2 k
57.6 k
38.4 k
19.2 k
14.4 k
12.8 k
9.6 k
7.2 k
4.8 k
3.6 k
2.4 k
1.8 k
1.2 k
forbidden
forbidden
forbidden
Note: IrDA standard only supports 2.4 kbit/s, 9.6 kbit/s, 19.2 kbit/s, 57.6 kbit/s, and 115.2 kbit/s.
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395
TOIM4232
Vishay Semiconductors
Software for the TOIM4232
UART Programming
For proper operation, the RS232 must be programmed (using 8 bit, 1 stop, no parity) to send a two character control word, YZ. The control
word YZ is composed of two characters, written in hexadecimal, in format: YZ. The transfer rate for programming must be identical with
the formerly programmed data rate, or after resetting the TOIM4232, the default rate of 9600 bit/s is used.
Step.
RESET
BR/ D
TD_UART
RD_UART
RD_IR
TD_IR
High
Low
Low
High
Low
High
YZ
with Y = 1
for 1.627 s
Y=0
3/16 bit
length
Low
Low
DATA
DATA
DATA
DATA
*) For programming the UART, refer to e.g., National Semiconductors data sheet of PC 16550 UART
V CC
R3
MAX3232CSE
1
C+
+ C3
3
4
VCC
TOIMx232
16
1
U1
C1-
V+
C2+
V-
C5
+
C7
+
2
3
C6
+ C4
4
+
GND
C2-
15
5
6
11
10
12
9
T1IN
T2IN
R1OUT
R2OUT
T1OUT
T2OUT
R1IN
R2IN
14
7
13
8
7
8
Reset
U2
Vcc
BR/Data
RD IR
RD 232
TD IR
TD 232
S2
V CC SD
S1
X1
NC
X2
RD LED
GND
TD LED
C10
16
2
+
15
R4
R6
TFDU4100
C11
14
13
IRED
Cathode
RXD
VCC1
GND
IRED
Anode
U4
TXD
NC
SC
1
3
5
7
12
11
10
9
J1
1
6
2
7
3
8
4
9
5
RXD
RTS (BR/D)
TXD
R1
DTR (Reset)
VCC
Y1
Z2
CON9
ext.
input max
3.3 V DC
J2
1
2
CON2
C1
R2
+ C2
C8
C9
16527
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396
TOIM4232
Vishay Semiconductors
Table 1.
Recommended Application Circuit Components
Component
Recommended Value
C1
100 nF
C2
10 F, 16 V
293D106X9016B2T
C3
100 nF
C4
100 nF
C5
100 nF
C6
100 nF
C7
1 F. 16 V
293D105X9016A2T
C8
22 pF
C9
22 pF
10
C10
6.8 F, 16 V
11
C11
100 nF
12
Z2
3.6 V
BZT55C3V6
13
R1
5.6 :
CRCW-1206-5601-F-RT1
14
R2
CRCW-1206-1003-F-RT1
15
R3
47 :
CRCW-1206-47R0-F-RT1
16
R4
20 :
CRCW-1206-20R0-F-RT1
17
R6
20 :
CRCW-1206-20R0-F-RT1
XT49S - 20 - 3.686400M
18
Y1
3.686400 MHz
19
U1
20
U2
TOIM4232
21
U3
TFDU4100
22
J1
9 Pin - D - Sub
23
J2
Power connector
Cannon
24
PCB
VISHAY Dongle_4
R3
TOIMx232
MAX3232CSE
1
16
C+
+ C3
V
CC
1
U1
16
Reset
C1-
V+
C2+
V-
C5
+
C7
+
U2
Vcc
15
BR/Data
RD IR
RD 232
TD IR
C6
+ C4
5
15
C2-
S2
VCC SD
S1
GND
T1OUT
T2OUT
R1IN
R2IN
Anode
3
U4
TXD
5
SD
7
GND
Vlog
11
X1
14
7
13
8
1
Cathode
12
6
T1IN
T2IN
R1OUT
R2OUT
2
+
VCC1
13
TD 232
C10
RXD
14
4
+
11
10
12
9
R4
opt.
TFDU4300
C11
NC
10
X2
RD LED
GND
TD LED
J1
1
6
2
7
3
8
4
9
5
RXD
DTS (BR/D)
TXD
R1
DTS (Reset)
VCC
Y1
Z2
CON9
J2
ext.
input max
3,6V DC
1
2
C1
CON2
R2
+ C2
C8
C9
18240
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397
TOIM4232
Vishay Semiconductors
Table 2.
Recommended Application Circuit Components
Component
Recommended Value
C1
100 nF
C2
10 F, 16 V
293D106X9016B2T
C3
100 nF
C4
100 nF
C5
100 nF
C6
100 nF
C7
1 F, 16 V
293D105X9016A2T
C8
22 pF
C9
22 pF
10
C10
6.8 F, 16 V
11
C11
100 nF
12
Z2
3.6 V
BZT55C3V6
13
R1
5.6 k:
CRCW-1206-5601-F-RT1
14
R2
CRCW-1206-1003-F-RT1
15
R3
47 :
CRCW-1206-47R0-F-RT1
16
R4
20 :
CRCW-1206-20R0-F-RT1
17
Y1
3.686400 MHz
XT49S - 20 - 3.686400M
18
U1
19
U2
TOIM4232
20
U3
TFDU4300
21
J1
9 Pin - D-Sub
22
J2
Power connector
23
PCB
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398
Cannon
VISHAY Dongle_4
TOIM4232
Vishay Semiconductors
VCC
3
C1
R13
+3,3V
2
Q4
Q2
+ C2
R2
R6
RXD
RTS
1
3
Q1
D5
D6
VB1
TXD
3
Q3
1
D4
D7
R5
R1
R3
1
6
2
7
3
8
4
9
5
D1
D2
RXD
RTS
TXD
DTR
R20
SUB-D 9
3
R9
Reset
1
Q1
2
D3
+3.3 V
VCC
R12/1
R11
TOIM4232
1
2
3
4
5
QZ1
R10
7
8
C3
Reset
R12/2
IRED1
U1
VCC
BR/Data
RD IR
RD 232
TD IR
TD 232
S2
VCC SD
S1
X1
NC
X2
RD LED
GND
TD LED
16
15
14
13
12
11
10
C4
IRED cathode
IRED anode
RXD
TXD
VCC
NC
Gnd
SC
U2
1
3
5
7
TFDU4100
Jumper
C5
C6
18082
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399
TOIM4232
Vishay Semiconductors
Table 3.
Recommended Application Circuit Components
Component
Recommended Value
C1
22 F, 16 V
C2
47 F, 16 V
C3
22 pF
C4
22 pF
C5
100 nF
C6
6.8 F, 16 V
D1
D2
1N4148
D4
BZT55C4V7
10
D5
1N4148
11
D6
1N4145
12
D7
BZT55C3V9
13
IRED1
TSHF5400
14
Jumper
CRCW-1206-000-F-RT1
15
LED1
TLLY4401
16
LED2
TLLG4401
17
Q1
BC817-25
18
Q2
VP 0610 0T
19
Q3
BC817-25
20
Q4
21
QZ1
3.686400 MHz
XT49S - 20 - 3.686400M
22
R1
22 k:
CRCW-1206-2202-F-RT1
23
R2
10 k:
CRCW-1206-1002-F-RT1
24
R3
22 k:
CRCW-1206-2202-F-RT1
25
R5
1 k:
CRCW-1206-1001-F-RT1
BC817-25
26
R6
47 k:
CRCW-1206-4702-F-RT1
27
R9
5.6 k:
CRCW-1206-5601-F-RT1
28
R10
100 k:
CRCW-1206-1003-F-RT1
29
R11
100 :
CRCW-1206-1000-F-RT1
30
R12
20 :
CRCW-1206-20R0-F-RT1
21
R13
1 k:
CRCW-1206-1001-F-RT1
32
R17
750 :
CRCW-1206-7500-F-RT1
CRCW-1206-750-F-RT1
33
R18
750 :
34
VB1
9 Pin - D- Sub
35
PCB
Cannon
VISHAY Dongle_3
36
U1
TOIM4232
37
U2
TFDU4100
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400
1N4148
TOIM4232
Vishay Semiconductors
Recommended Solder Profiles
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 C
240 C max.
2...4 C/s
160 C max.
120 s...180 s
90 s max.
2...4 C/s
275
T 255 C for 10 s....30 s
250
225
0
50
100
19535
150
200
250
300
350
Tpeak = 260 C
200
Time/s
Temperature/C
Temperature (C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 C...4 C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
260
240
220
200
180
Temperature/C
2 C...3 C/s
50
< 4 C/s
160
1.3 C/s
140
120
100
80
< 2 C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Document Number 82546
Rev. 1.5, 06-Jun-06
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401
TOIM4232
Vishay Semiconductors
Package Dimensions in mm
Package SO16L
10.5
10.1
9.25
8.75
7.5
7.3
2.45
2.25
1.27
0.25
0.10
0.49
0.35
8.89
16
0.3
0.2
10.56
10.15
technical drawings
according to DIN
specifications
13011
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
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402
W3 max.
TOIM4232
Vishay Semiconductors
Tape Dimensions in mm
18241
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403
Notes
Vishay Semiconductors
www.vishay.com
404
Online Information
For product information and current list of sales offices,
representatives and distributors, visit our website:
www.vishay.com
The Americas
EUROPE
United States
Vishay Americas
One Greenwich Place
Shelton, CT 06484
United States
Ph: +1-402-563-6866
Fax: +1-402-563-6296
Germany
Vishay EUROPE SALES GmbH
Geheimrat-Rosenthal-Str. 100
95100 Selb
Germany
Ph: +49-9287-71-0
Fax: +49-9287-70435
Asia
France
Vishay S.A.
199, BLVD DE LA MADELEINE
06003 NICE, CEDEX 1
France
Ph: +33-4-9337-2920
Fax: +33-4-9337-2997
Singapore
Vishay intertechnology
Asia Pte Ltd.
25 Tampines Street 92
Keppel Building #02-00
Singapore 528877
Ph: +65-6788-6668
Fax: +65-6788-0988
P.R.C.
Vishay Trading (Shanghai) Co., Ltd.
(SHANGHAI REPRESENTATIVE OFFICE)
ROOM D, 15F, SUN TONG INFOPORT PLAZA
55 HUAI HAI WEST ROAD
200030 SHANGHAI
P.R.C.
PH: +86-21-5258-5000
FAX: +86-21-5258-7979
Netherlands
Vishay BCCOMPONENTS B.V.
HURKESTRAAT 31
P.O. BOX 8766
5652 AH EINDHOVEN
NETHERLANDS
Ph: +31-40-2590-700
Fax: +31-40-2590-777
Japan
vishay japan CO., LTD.
Shibuya 3-chome Square Building 3F
3-5-16 Shibuya
Shibuya-Ku
Tokyo 150-0002
Japan
Ph: +81-3-5464-6411
fax: +81-3-5464-6433
Manufacturers
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Malvern, PA 19355-2143
Manufacturers
United States
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World Headquarters
w w w. v i s h a y. c o m
VSE-DB2802-0610