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Selector Guide

Plastic-Encapsulated
Transistors

GreenLine Portfolio
Devices

Small-Signal Field-Effect
Transistors and MOSFETs

Small-Signal Tuning
and Switching Diodes

Tape and Reel Specifications


and Packaging Specifications

Surface Mount
Information

Package Outline
Dimensions

Reliability and
Quality Assurance

Replacement
Devices

10

Alphanumeric Index

11

Motorola Small-Signal Transistors, FETs and Diodes Device Data

TMOS is a registered trademark of Motorola Inc.


HDTMOS and GreenLine are trademarks of Motorola Inc.
Thermal Clad is a trademark of the Bergquist Company.

Motorola Small-Signal Transistors, FETs and Diodes Device Data

SMALLSIGNAL TRANSISTORS,
FETs AND DIODES
This publication presents technical information for the several product families that comprise the Motorola
smallsignal semiconductor line. The families include bipolar transistors, fieldeffect transistors, and diodes. These
are available in a variety of through hole and surface mount packages. Complete device specifications and typical
performance curves are given on individual data sheets, which are grouped by the various families.
A quick comparison of performance characteristics is presented in the easytouse selector guide in the first
section. The tables will assist in the selection of the proper device for a specific application.
Seperate sections are included to describe package outline drawings and footprints and product reliability and
quality considerations.
The information in this book has been carefully checked and is believed to be accurate; however, no responsibility
is assumed for inaccuracies. Furthermore, this information does not convey to the purchaser of semiconductor
devices any license under the patent rights to the manufacturer.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no
warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does
Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims
any and all liability, including without limitation consequential or incidental damages. Typical parameters which may
be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including Typicals must be validated for each customer
application by customers technical experts. Motorola does not convey any license under its patent rights nor the
rights of others. Motorola products are not designed, intended, or authorized for use as components in systems
intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other
application in which the failure of the Motorola product could create a situation where personal injury or death may
occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer
shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges
that Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered
trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

Motorola, Inc. 1997


Previous Edition 1994
Printed in U.S.A.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

All Rights Reserved

About This Revision


To accomodate the increasing requirements for surface mount components, this publication adds a variety of
device types in several choices of surface mount packages.
An expanded MOSFET portfolio to include new lower RDS(on) HDTMOS devices in the TSOP6 package.
Dual transistors and diodes in the SC70 multilead package.
A Family of transistors and diodes in the smaller SC90 package.
It should be noted that Metal Can Transistors previously listed in this data book have been removed for this revision.
Replacement devices for these parts can be found in Chapter 10.

ii

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Motorola Device Classifications


In an effort to provide current information to the customer regarding the status of any given device, Motorola has
classified all devices into three categories: Preferred devices, Current product and Not Recommended for New
Design products.
A Preferred device is a device which is recommended as a first choice for future use. These devices are preferred
by virtue of their performance, price functionality, or combination of attributes which offer the overall best value to
the customer. This category contains both advanced and mature devices which will remain available for the
foreseeable future (generally 3 to 5 years).
Device types identified as current are not a first choice product for new designs, but will continue to be available
because of the popularity and/or standardization or volume usage in current production designs. These products can
be acceptable for new designs but the preferred types are considered better alternatives for long term usage.
Any device that has not been identified as a preferred device is a current device.

Products designated as Not Recommended for New Design may become obsolete as dictated by poor market
acceptance, or a technology or package that is reaching the end of its life cycle. Devices in this category have an
uncertain future and do not represent a good selection for new device designs or long term usage.
All Not Recommended for New Design devices have been removed from the data book. In the event the
device you need is no longer found within an appropriate section of the data book, refer to the Replacement
Devices index at the back of the book to see if there is a Replacement Part for the device in question.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

iii

Table of Contents
Selector Guide . . . . . . . . . . . . . . . . . . . . . 11
Bipolar Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
PlasticEncapsulated Transistors . . . . . . . . . . . . . . . . 12
PlasticEncapsulated Multiple Transistors . . . . . . . . . 18
PlasticEncapsulated Surface Mount
Transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
FieldEffect Transistors . . . . . . . . . . . . . . . . . . . . . . . . . . 118
JFETs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
TMOS FETs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Surface Mount FETs . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Tuning and Switching Diodes . . . . . . . . . . . . . . . . . . . . . 123
Tuning Diodes Abrupt Junction . . . . . . . . . . . . . . . 123
Tuning Diodes HyperAbrupt Junction . . . . . . . . 126
Schottky Diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Switching Diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Multiple Switching Diodes . . . . . . . . . . . . . . . . . . . . . . 135
GreenLine Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
Small Signal MultiIntegrated Devices . . . . . . . . . . . 138

PlasticEncapsulated Transistors . . . 21
Embossed Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . .
Radial Tape in Fan Fold Box or Reel . . . . . . . . . . . . . . . .
Device Markings/Date Code Characters . . . . . . . . . . . . .
Data Sheets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

22
22
22
23

GreenLine Portfolio . . . . . . . . . . . . . . . 31
Data Sheets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

SmallSignal FieldEffect
Transistors and MOSFETs . . . . . . . . . . . . 41
Embossed Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . .
Radial Tape in Fan Fold Box or Reel . . . . . . . . . . . . . . . .
Device Markings/Date Code Characters . . . . . . . . . . . . .
Data Sheets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

iv

42
42
42
43

SmallSignal Tuning and


Switching Diodes . . . . . . . . . . . . . . . . . . 51
Embossed Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . .
Radial Tape in Fan Fold Box or Reel . . . . . . . . . . . . . . . .
Device Markings/Date Code Characters . . . . . . . . . . . . .
Data Sheets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

52
52
52
53

Tape and Reel Specifications and


Packaging Specifications . . . . . . . . . . . . 61
Tape and Reel Specifications . . . . . . . . . . . . . . . . . . . . . . 62
Packaging Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 65

Surface Mount Information . . . . . . . . . 71


Information for Using Surface Mount Packages . . . . . . . 72
Footprints for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

Package Outline Dimensions . . . . . . . 81


Package Outline Dimensions . . . . . . . . . . . . . . . . . . . . . . . 82

Reliability and Quality Assurance . . . 91


Outgoing Quality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reliability Data Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Air Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Activation Energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reliability Stress Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Statistical Process Control . . . . . . . . . . . . . . . . . . . . . . . . .

92
92
94
94
94
95
97

Replacement Devices . . . . . . . . . . . . . 101


Alphanumeric Index . . . . . . . . . . . . . . . 111

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Section 1
Selector Guide

In Brief . . .
This selector guide highlights semiconductors that are the
most popular and have a history of high usage for the most
applications.
A large selection of encapsulated plastic transistors, FETs
and diodes are available for surface mount and insertion
assembly technology. Plastic packages include TO-92
(TO226AA), 1-Watt TO-92 (TO226AE), SOT-23,
SC-70/SOT-323, SC90/SOT416, SC-59, SOD-123,
SOT223, SOT363, and TSOP6. Plastic multiples are
available in 14pin and 16pin dualinline packages for
insertion applications: SO14 and SO16 for surface mount
applications.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
11

Bipolar Transistors

PlasticEncapsulated
Transistors

23

CASE 2905
TO226AE
1WATT (TO92)

Motorolas Small Signal TO226 plastic transistors


encompass hundreds of devices with a wide variety of
characteristics for generalpurpose, amplifier and switching
applications. The popular highvolume package combines
proven reliability, performance, economy and convenience to
provide the perfect solution for industrial and consumer design
problems. All devices are laser marked for ease of
identification and shipped in antistatic containers, as part of
Motorolas ongoing practice of maintaining the highest
standards of quality and reliability.

23

CASE 2904
TO226AA
(TO92)

Table 1. PlasticEncapsulated GeneralPurpose Transistors


These generalpurpose transistors are designed for smallsignal amplification from dc to low ratio frequencies. They are
also useful as oscillators and generalpurpose switches. Complementary devices shown where available (Tables 14).

NPN

PNP

V(BR)CEO
Volts
Min

fT @ IC
MHz
Min

hFE @ IC

mA

IC
mA
Max

Min

Max

10
10
10
10
10
10
50
10
10
10
10
10
10
10
5.0
20
20
20
50
10
10
10
10
10
10
10
10
10

500
500
250
100
100
500
600
100
100
800
100
100
100
100
100
600
600
600
1000
200
200
100
100
100
100
200
200
800

100
100
60
120
180
100
100
120
200
100
120
120
180
380
40
100
100
50
50
50
100
110
120
200
420
50
120
100

300

400
450
450

300
500
460
630
800
220
450
800
400
300
300
150

150
300
800
220
450
800
150
360
630

mA

NF
dB
Max

Style

1.0
100
10
2.0
2.0
100
150
2.0
2.0
100
2.0
2.0
2.0
2.0
5.0
150
150
150
500
10
10
2.0
2.0
2.0
2.0
2.0
2.0
100

10
10

10
10

10
10
10
10

6.0
5.0
10
10
10
10
6.0
4.0

1
1
1
17
17
1
1
14
17
17
17
17
17
17
1
1
1
1
1
1
1
17
17
17
17
1
1
17

Case 2904 TO226AA (TO92)


MPS8099
MPSA06
2N4410
BC546
BC546B
MPSA05

BC182
BC237B
BC337
BC547
BC547A
BC547B
BC547C
MPSA20
MPS2222A
2N4401
2N4400
MPS6602
2N3903
2N3904
BC548
BC548A
BC548B
BC548C
2N4123
2N4124
BC338

MPS8599
MPSA56

BC556
BC556B
MPSA55
MPS2907A
BC212
BC307B
BC327
BC557
BC557A
BC557B
BC557C
MPSA70

2N4403
2N4402
MPS6652
2N3905
2N3906

BC558B

2N4125

BC328

80
80
80
65
65
60
60
50
45
45
45
45
45
45
40
40
40
40
40
40
40
30
30
30
30
30
25
25

150
100
60
150
150
100
200
200(1)
150
210(1)
150
150
150
150
125
300
200
150
100
200
250
300(1)
300(1)
300(1)
300
200
250
210(1)

(1) Typical

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
12

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PlasticEncapsulated Transistors (continued)


Table 1. PlasticEncapsulated GeneralPurpose Transistors (continued)

NPN

PNP

V(BR)CEO
Volts
Min

fT @ IC
MHz
Min

hFE @ IC

VCE(sat) @ IC @ IB

mA

IC
A
Max

Min

Max

mA

Volts
Max

mA

mA

Style

200
200
200
200

0.5
0.5
0.5
0.5

40
40
80
80

400
400

100
100
50
50

0.7
0.7
0.5
0.4

1000
1000
250
250

100
100
10
10

14
1
1
1

Case 2905 TO226AE (1WATT TO92)


BDC01D
BDB01C
MPS6717
MPSW06

BDB02C

MPSW56

100
80
80
80

50
50
50
50

Table 2. PlasticEncapsulated LowNoise and Good hFE Linearity


These devices are designed to use on applications where good hFE linearity and lownoise characteristics are required:
Instrumentation, hifi preamplifier.
hFE @ IC

NPN

PNP

V(BR)CEO
Volts

Min

Max

mA

250
250
120
180
380
500
100
250
200
380
350
450
300

800
650
800
450
800

300

450
800

600

0.1
0.1
2.0
2.0
2.0
1.0
10
10
2.0
2.0
1.0
1.0
2.0

VT(4)
mV
Typ

NF(5)
dB
Max

fT
MHz
Typ

7.0(7)
9.5

6.5(1)

2.0
3.5(8)
2.0(1)
2.5
2.5

5.0
2.0
2.5
2.5
3.0
2.0
3.0

40(2)
100(2)
280
250
250
160
200(2)

Style

Case 2904 TO226AA (TO92)

MPS6428
BC239
BC550B
BC550C
MPSA18
MPS3904

BC549B
BC549C
2N5088
2N5089(6)

MPS6521
(1)
(2)
(4)
(5)
(7)
(8)

2N5087

BC560C

MPS3906
MPS4250
BC559B
BC559C

MPS6523

50
50
45
45
45
45
40
40
30
30
30
25
25

250
250
50
50

1
1
17
17
17
1
1
1
17
17
1
1
1

Typical
Min
VT : Total Input Noise Voltage (see BC413/BC414 and BC415/BC416 Data Sheets) at RS = 2.0 k , IC = 200 A, VCE = 5.0 Volts.
NF: Noise Figure at RS = 2.0 k, IC = 200 A, VCE = 5.0 Volts. f = 30 Hz to 15 kHz.
RS = 10 k , BW = 1.0 Hz, f = 100 MHz
RS = 500 , BW = 1.0 Hz, f = 10 MHz

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
13

PlasticEncapsulated Transistors (continued)


Table 3. PlasticEncapsulated Darlington Transistors
Darlington amplifiers are cascade transistors used in applications requiring very highgain and input impedance. These
devices have monolithic construction.
hFE @ IC
NPN

PNP

V(BR)CEO
Volts

VCE(sat) @ IC & IB

f T @ IC

Min

Max

mA

Volts
Max

mA

mA

Min

mA

Style

1000
1000

25K
20K

150K

200
100

1.5
1.5

1000
100

2.0
0.1

100
125

200
10

1
1

500
1000
500
1000
500
500
500
500
500
1000

10K
10K
10K
10K
10K
20K
30K
20K
10K
30K

160K

50K

200K
300K

100
100
100
200
100
100
100
100
100
20

1.5
1.1
1.5
1.1
1.5
1.5
1.5
1.5
1.5
1.0

100
250
100
200
100
500
500
100
100
100

0.1
0.25
0.1
0.2
0.1
0.5
0.5
0.1
0.1
0.1

125
100

150

125
125
125
200(1)

10
100

500

10
10
10
10

1
1
1
17
1
1
1
1
1
17

IC
Max

Case 2905 TO226AE (1WATT TO92)


MPSW45A

MPSW64

50
30

Case 2904 TO226AA (TO92)


MPSA29
BC373
MPSA27
BC618

2N6427
2N6426
MPSA14
MPSA13
BC517

MPSA77

MPSA75

MPSA64
MPSA63

100
80
60
55
40
40
40
30
30
30

Table 4. PlasticEncapsulated HighCurrent Transistors


The following table is a listing of devices that are capable of handling a higher current range for smallsignal transistors.

NPN

PNP

V(BR)CEO
Volts
Min

fT @ IC

hFE @ IC

mA

IC
mA
Max

Min

Max

50

50

1000
1000

50
50

200/150(1)
60
75
75
65

50
10
50
50
10

1000
500
2000
2000
1000

60
40
75
75
60

MHz
Min

VCE(sat) @ IC & IB
mA

Volts
Max

mA

mA

Style

1000
1000

0.5
0.5/0.7

1000
1000

100
100

1
1

400
160

100
150
1000
1000
1000

0.3/0.5
0.5
0.5
0.5
0.5

1000
500
2000
2000
1000

100
50
200
200
100

17
14
1
1
1

Case 2905 TO226AE (1WATT TO92)


MPS6715
MPSW01A

MPS6727
MPSW51A

40
40

Case 2904 TO226AA (TO92)


BC489
BC639
MPS651
MPS650
BC368

BC490
BC640
MPS751
MPS750
BC369

80
80
60
40
20

(1) Typical

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
14

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PlasticEncapsulated Transistors (continued)


Table 5. PlasticEncapsulated HighVoltage Amplifier Transistors
These highvoltage transistors are designed for driving neon bulbs and indicator tubes, for direct line operation, and for
other applications requiring highvoltage capability at relatively low collector current. These devices are listed in order of
decreasing breakdown voltage (V(BR)CEO).
Device
Type

V(BR)CEO
Volts
Min

hFE @ IC

IC
Amp
Max

Min

VCE(sat) @ IC & IB

f T @ IC

Volts
Max

mA

mA

MHz
Min

mA

Style

0.5

20

2.0

50

10

30

0.5

20

2.0

50

10

10
100
30
10
10
10

0.5
0.75
0.3
0.2
0.5
0.15

10
50
10
20
20
10

1.0
5.0
1.0
2.0
2.0
1.0

40
50
50
100

10
10
10
10

1
1
1
1
1
1

10
30
10
30
10

20
0.3
0.5
0.3
0.2

20
10
20
10
10

2.0
1.0
2.0
1.0
1.0

50
40
50
40
100

10
10
10
10
10

1
1
1
1
1

mA

Case 2905 TO226AE (1WATT TO92) NPN


MPSW42

300

0.5

40

30

Case 2905 TO226AE (1WATT TO92) PNP


MPSW92

300

0.5

25

Case 2904 TO226AA (TO92) NPN


BF844
MPSA44
2N6517
BF393
MPSA42
2N5551

400
400
350
300
300
160

0.3
0.3
0.5
0.5
0.5
0.6

50
40
30
40
40
80

Case 2904 TO226AA (TO92) PNP


BF493S
2N6520
MPSA92
2N6519
2N5401

350
350
300
300
150

0.5
0.5
0.5
0.5
0.6

40
30
40
45
60

Case 2904 TO226AA (TO92)

NPN
BF420
BF422

PNP
BF421
BF423

hFE @ IC

VCE(sat) @ IC & IB

f T @ IC

V(BR)CEO
Volts
Min

IC
Amp
Cont

Min

mA

Volts
Max

mA

mA

MHz
Min

mA

Style

300
250

0.5
0.5

50
50

25
25

2.0
2.0

20
20

2.0
2.0

60
60

10
10

14
14

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
15

PlasticEncapsulated Transistors (continued)


Table 6. PlasticEncapsulated RF Transistors
The RF transistors are designed for smallsignal amplification from RF to VHF/UHF frequencies. They are also used as
mixers and oscillators in the same frequency ranges.

Device
Type

V(BR)CEO
Volts
Min

hFE @ IC

IC
mA
Max

Min

fT
MHz
Typ

CRE/CRB
pF
Max

NF
dB
Typ

f
MHz

Style

2.5

2.5
3.0
6.0(3)
6.0(3)
5.0(3)
6.0(3)

100

35
200
200
60
200
60

21
2
2
21
21
2
1
1
1

mA

VCE
V

7.0
4.0
4.0
7.0
20
5.0
8.0
3.0
8.0

10
10
10
10
10
10
10
1.0
10

600
650(2)
650(2)
750
600(2)
800(2)
600(2)
2000(3)
800

0.28
0.9
0.65
0.35
0.65
0.9
1.7

1.7

5.0

10

600(2)

0.85

Case 2904 TO226AA (TO92) NPN


BF224
MPSH11
MPSH10
BF199
BF959
MPSH17
MPS918
MPS5179
MPS3563

30
25
25
25
20
15
15
12
12

50

100
100

50
50
50

30
60
60
40
40
25
20
25
20

Case 2904 TO266AA (TO92) PNP


MPSH81

20

50

60

Table 7. PlasticEncapsulated HighSpeed Saturated Switching Transistors


ton & toff @ IC
Device
Type

ns
Max

ns
Max

mA

V(BR)CEO
Volts
Min

hFE @ IC

VCE(sat) @ IC & IB

fT @ IC

Min

mA

Volts
Max

mA

mA

MHz
Min

mA

Style

40
30
40

10
30
10

0.22
0.2
0.2

10
30
10

1.0
3.0
1.0

300
350

10
30

1
1
1

Case 2904 TO226AA (TO92) NPN


2N4264
MPS3646
MPS2369A

25
18
12

35
28
18

10
300
10

15
15
15

(2) Min
(3) Max
(9) AGC Capable

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
16

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PlasticEncapsulated Transistors (continued)


Table 8. PlasticEncapsulated Choppers
Devices are listed in decreasing V(BR)EBO.
Device
Type

V(BR)EBO
Volts
Min

IC
Amp(1)
Max

hFE @ IC
Min

VCE(sat) @ IC & IB

f T @ IC

mA

Volts
Max

mA

mA

MHz
Min

mA

Style

5.0

0.25

10

1.0

80

5.0

12

0.2

24

1.0

Case 2904 TO226AA (TO92) NPN


MPSA17

15

100

200

Case 2904 TO266AA (TO92) PNP


MPS404A

25

150

30

Table 9. PlasticEncapsulated Telecom Transistors


These devices are special product ranges intended for use in telecom applications.

Device
Type

V(BR)CEO
Volts

PD mW
25C
Amb

hFE @ IC @ VCE

fT

IC
mA
Cont

Min

Max

mA

Volts

MHz
Min

Style

600

75

10

10

300

17

600

100

10

10

200

17

Case 2904 TO226AA (TO92) NPN


P2N2222A

40

625

Case 2904 TO226AA (TO92) PNP


P2N2907A

60

625

(1) Typical

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
17

PlasticEncapsulated
Multiple Transistors
The manufacturing trend has been toward printed circuit
board design with requirements for smaller packages with
more functions. In the case of discrete components the use
of the multiple device package helps to reduce board space
requirements and assembly costs.
Many of the most popular devices are offered in the standard plastic DIP and surface mount IC packages. This includes smallsignal NPN and PNP bipolar transistors,
Nchannel and Pchannel FETs, as well as diode arrays.

14
1
CASE 64606
(TO116)
STYLE 1

16
1
CASE 751B05
SO16
STYLE 4

Specification Tables
The following short form specifications include Quad and Dual transistors listed in alphanumeric order. Some columns
denote two different types of data indicated by either bold or italic typeface. See key and headings for proper identification.
This applies to Table 10 and 11 of this section only.

KEY

TYPE NO.

ID

Alphanumeric listing
type numbers
Identification Code
First Letter: Polarity
C both types in multiple device
N NPN
P PNP
Second Letter: Use
A General Purpose Amplifier
E Low Noise Audio Amplifier
F Low Noise RF Amplifier
G General Purpose Amplifier
and Switch
H Tuned RF/IF Amplifier
M Differential Amplifier
S High Speed Switch
D Darlington

Power Dissipation specified at 25C. Single


die rating.
Ref. Point: A Ambient Temperature
C Case Temperature

Selector Guide
18

hFE2

ton
ns
Max

toff
ns
Max

Unit

Subscript

PD
Watts
One
Die
Only

VBE
mV
Max

hFE1

Ref. Point

VCE
Volts

IC
Amp
Max

hFE @ IC
Min

fT
MHz
Min

Commonemitter
DC Current Gain.
Units for test Current:
A ampere
m mA
u A

CurrentGainBandwidth
Product

Continuous (DC) Collector Current

Rated Minimum CollectorEmitter Voltage


Subscript letter identifies base termination
listed below in order of preference.
SUBSCRIPT:
0 VCEO, open

Cob
pF
Max

Gp
dB
Min

VCE @
(sat)
Volts
Max

NF @
dB
Max

IC

& IC
Unit

IB

Gp Power Gain
NF Noise Figure
f Test Frequency
AUD 1015 kHz
Frequency Units:
H Hertz M MHz
K kHz
G GHz
VCE(sat) CollectorEmitter
Saturation Voltage
IC Test Current
Current Units: u A
m mA
A Amp
hFE1/hFE2 Current Gain Ratio
VBE Differential Base Voltage |VBE1 VBE2|.
Differential Amplifiers
ton turnon time
toff turnoff time

Output Capacitance, commonbase. Shown without distinction:


Ccb CollectorBase Capacitance
Cre CommonEmitter Reverse Transfer Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PlasticEncapsulated Multiple Transistors (continued)


Table 10. PlasticEncapsulated Multiple Transistors Quad
The following table is a listing of the most popular multiple devices available in the plastic DIP package. These devices are
available in NPN, PNP, and NPN/PNP configurations. (See note.)

hFE2

VBE
mV
Max

ton
ns
Max

toff
ns
Max

8.0
4.0

35(1)
9.0(1)

285(1)
15(1)

0.3
0.25

10
10
3.0(1)
2.0(1)

8.0
25
10
15
4.0
4.0
4.0
4.5
8.0
8.0
4.0
8.0
8.0
4.0
4.5
4.5
5.0
5.0
6.0
5.0

45(1)
40
35
50

180(1)
90
60
120

0.4
0.5
0.45
0.55

10
10
10
10
3.0(1)
2.0(1)

37(1)
43(1)
30(1)
30(1)

136(1)
155(1)
225(1)
225(1)

0.2
0.25
0.4
0.4

10
10
10
10
4.0(1)

30(1)
0.8

225(1)
20

45

150

1.5
0.4
0.25
0.25
0.15
0.5
0.5
0.7
0.5

10
10
10
10
10
10
10
10
10

hFE1

Device

ID

PD
Watts
One
Die
Only

VCEO
Volts

0.65
0.5
0.625
0.625
0.65
0.75
1.0
0.75
0.625
0.625
0.5
0.5
0.65
0.65
0.5
0.5
0.65
0.5
0.5
0.75
0.75
0.75
0.75
0.75

40
15
40
40
60
40
40
40
40
60
40
40
30
30
45
30
30
45
40
40
250
200
150
250

IC
Amp
Max

hFE @ IC
Min

fT
MHz
Min

Cob
pF
Max

NF @
dB
Max
Typ(1)

Gp
dB
Min
VCE
(sat)
Volts
Max

IC
IC

IB

Case 64606 TO116


MPQ2222A
MPQ2369
MPQ2483
MPQ2484
MPQ2907A
MPQ3467
MPQ3725
MPQ3762
MPQ3798
MPQ3799
MPQ3904
MPQ3906
MPQ6001
MPQ6002
MPQ6100A
MPQ6426
MPQ6502
MPQ6600A1
MPQ6700
MPQ6842
MPQ7043
MPQ7042
MPQ7051
MPQ7093

NA
NS
NA
NA
PA
PS
NS
PS
PA
PA
NG
PG
CG
CG
CA
ND
CG
CA
CA
CA
NA
NA
CG
PA

0.5
0.5
0.05
0.05
0.6
1.0
1.0
1.5
0.05
0.05
0.2
0.2
0.5
0.5
0.05
0.5
0.5
0.05
0.2
0.5
0.5
0.5
0.5
0.5

100
40
150
300
100
20
25
35
150
300
75
75
40
100
150
10K
100
150
70
70
25
25
25
25

150 m
10 m
1.0 m
1.0 m
150 m
500 m
500 m
150 m
0.1 m
0.1 m
10 m
10 m
150 m
150 m
1.0 m
100 m
150 m
1.0 m
10 m
10 m
1.0 m
1.0 m
1.0 m
1.0 m

200
450
50
50
200
125
250
150
60
60
250
200
200
200
50
125
200
50
200
300
50
50
50
50

150 m
10 m
AUD
AUD
150 m
500 m
500 m
500 m
AUD
AUD
10 m
10 m
150 m
150 m
AUD
100 m
150 m
1.0 m
1.0 m
0.5 m
20 m
20 m
20 m
20 m

Table 11. PlasticEncapsulated Multiple Transistors Quad Surface Mount


The following table is a listing of the most popular multiple devices available in the plastic SOIC surface mount package.
These devices are available in NPN, PNP, and NPN/PNP configurations.
hFE @ IC
Device

fT @ IC

V(BR)CEO

V(BR)CBO

Min

mA

MHz Min

mA

40
15
50
40
40
40
40
40

75
40
60
40
60
60
40
40

40
20
50
20
25
75
75
70

500
100
500
500
500
10
10
10

200
450
200
125
250
250
200
200

20
10
50
50
50
10
10
10

Case 751B05 SO16


MMPQ2222A
MMPQ2369
MMPQ2907A
MMPQ3467
MMPQ3725
MMPQ3904
MMPQ3906
MMPQ6700 (12)

(1) Typical
(12) NPN/PNP
NOTE: Some columns show 2 different types of data indicated by either bold or italic typefaces. See key and headings.

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
19

PlasticEncapsulated
Surface Mount Transistors
1

This section of the selector guide lists the smallsignal plastic


devices that are available for surface mount applications.
These devices are encapsulated with the latest
stateoftheart mold compounds that enhance reliability and
exhibit excellent performance in high temperature and high
humidity environments. This package offers higher power
dissipation capability for smallsignal applications.

CASE 31808
TO236AB
SOT23

CASE 318D04
SC59

3
1

1
2
CASE 41902
SC70/SOT323

CASE 318E04
SOT223

3
4

3
CASE 419B01
SOT363

CASE 46301
SOT416/SC90

Table 12. PlasticEncapsulated Surface Mount GeneralPurpose Transistors


The following tables are a listing of smallsignal generalpurpose transistors in the SOT23, SC59, SOT223, SC70,
SC90, and SOT363 surface mount packages. These devices are intended for smallsignal amplification for DC, audio,
and lower RF frequencies. They also have applications as oscillators and generalpurpose, low voltage switches.
Pinout: 1Base, 2Emitter, 3Collector
Devices are listed in order of descending breakdown voltage.
hFE @ IC
Device

Marking

V(BR)CEO

Min

Max

mA

fT
MHz Min

110
200
100
160
250
110
200
420
100
100
100
110
200
420

220
450
250
400
600
220
450
800
300
300
300
220
450
800

2.0
2.0
100
100
100
2.0
2.0
2.0
150
10
150
2.0
2.0
2.0

100
100
200
200
200
100
100
100
200
300
250
100
100
100

125
220
100
100
160
250
125
220
100
100
125
220
420

250
475
300
250
400
600
250
475
300
300
250
475
800

2.0
2.0
150
100
100
100
2.0
2.0
10
150
2.0
2.0
2.0

100
100
200
200
200
200
100
100
250
200
100
100
100

Case 31808 TO236AB (SOT23) NPN


BC846ALT1
BC846BLT1
BC81716LT1
BC81725LT1
BC81740LT1
BC847ALT1
BC847BLT1
BC847CLT1
MMBT2222ALT1
MMBT3904LT1
MMBT4401LT1
BC848ALT1
BC848BLT1
BC848CLT1

1A
1B
6A
6B
6C
1E
1F
1G
1P
1AM
2X
1J
1K
1L

65
65
45
45
45
45
45
45
40
40
40
30
30
30

Case 31808 TO236AB (SOT23) PNP


BC856ALT1
BC856BLT1
MMBT2907ALT1
BC80716LT1
BC80725LT1
BC80740LT1
BC857ALT1
BC857BLT1
MMBT3906LT1
MMBT4403LT1
BC858ALT1
BC858BLT1
BC858CLT1

3A
3B
2F
5A
5B
5C
3E
3F
2A
2T
3J
3K
3L

65
65
60
45
45
45
45
45
40
40
30
30
30

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
110

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PlasticEncapsulated Surface Mount Transistors (continued)


Table 12. PlasticEncapsulated Surface Mount GeneralPurpose Transistors (continued)
Pinout: 1Base, 2Emitter, 3Collector
Devices are listed in order of descending breakdown voltage.
hFE @ IC
Device

Marking

V(BR)CEO

Min

Max

mA

fT
MHz Min

25
25
25
20

210
290
120
200

340
460
240
350

2.0
2.0
150
500

150(1)
150(1)
200(1)
200(1)

25
25

210
120

340
240

2.0
150

100(1)
200(1)

45
45
45
65
65
45
45
45
30
30
30
40
40
20
50

100
160
250
110
200
110
200
420
110
200
420
100
100
70
210

600
400
600
220
450
220
450
800
220
450
800
300
300
140
340

100
100
100
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
150
10
1.0
2.0

100
100
100
100
100
100
100
100
300
300
150

45
45
65
65
45
45
30
30
30
60
40
45

160
250
125
220
125
220
110
200
420
100
100
210

400
600
250
475
250
475
220
450
800
300
300
340

100
100
2.0
2.0
2.0
2.0
2.0
2.0
2.0
150
10
2.0

100
100
100
100
100
100
100
200
250

40
40

100
100

300
300

10
10

300
300

40
40

100
100

300
300

10
10

250
250

Case 318D04 SC59 NPN


MSD601RT1
MSD601ST1
MSD602RT1
MSD1328RT1

YR
YS
WR
1DR

Case 318D04 SC59 PNP


MSB709RT1
MSB710RT1

AR
CR

Case 41902 SC70/SOT323 NPN


BC818WT1
BC81825WT1
BC81840WT1
BC846AWT1
BC846BWT1
BC847AWT1
BC847BWT1
BC847CWT1
BC848AWT1
BC848BWT1
BC848CWT1
MMBT2222AWT1
MMBT3904WT1
MSC3930BT1
MSD1819ART1

6I
6F
6G
1A
1B
1E
1F
1G
1J
1K
1L
1P
AM
VB
ZR

Case 41902 SC70/SOT323 PNP


BC80825WT1
BC80840WT1
BC856AWT1
BC856BWT1
BC857AWT1
BC857BWT1
BC858AWT1
BC858BWT1
BC858CWT1
MMBT2907AWT1
MMBT3906WT1
MSB1218ART1

5F
6F
3A
3B
3E
3F
3J
3K
3L
20
2A
BR

Case 419B01 SOT363 Dual NPN


MBT3904DW1T1
MBT3904DW9T1

MA
MB

Case 419B01 SOT363 Dual PNP


MBT3906DW1T1
MBT3906DW9T1

A2
A3

(1) Typical

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
111

C
(OUT)
R1

B
(IN)

PlasticEncapsulated Surface Mount Transistors (continued)

R2

E
(GND)

Table 12. PlasticEncapsulated Surface Mount GeneralPurpose Transistors (continued)


Pinout: 1Base, 2Emitter, 3Collector
Devices are listed in order of descending breakdown voltage.
hFE @ IC
Device

Marking

V(BR)CEO

Min

Max

mA

fT
MHz Min

Case 419B01 SOT363 Dual Combination NPN and PNP


MBT3946DW1T1

46

40

100

300

10

250

50

120

560

1.0

180

50

120

560

1.0

140

Case 46301 SOT416/SC90 NPN


2SC4617

B9

Case 46301 SOT416/SC90 PNP


2SA1774

F9

Table 13. PlasticEncapsulated Surface Mount Bias Resistor Transistors


Table 13. for General Purpose Applications
Pinout: 1Base, 2Emitter, 3Collector
These devices include bias resistors on the semiconductor chip with the transistor. See the BRT diagram for orientation
of resistors.

NPN

NPN

PNP

8A
8B
8C
8D
8E
8F
8G
8H
8J
8K
8L

6A
6B
6C
6D
6E
6F
6G
6H
6J
6K
6L

50
50
50
50
50
50
50
50
50
50
50

35
60
80
80
160
160
3.0
8.0
15
80
80

5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0

100
100
100
100
100
100
100
100
100
100
100

10K
22K
47K
10K
10K
4.7K
1.0K
2.2K
4.7K
4.7K
22K

10K
22K
47K
47K

1.0K
2.2K
4.7K
47K
47K

A6A
A6B
A6C
A6D
A6E
A6F
A6G
A6H
A6J
A6K
A6L

50
50
50
50
50
50
50
50
50
50
50

35
60
80
80
160
160
3.0
8.0
15
80
80

5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0

100
100
100
100
100
100
100
100
100
100
100

10K
22K
47K
10K
10K
4.7K
1.0K
2.2K
4.7K
4.7K
22K

10K
22K
47K
47K

1.0K
2.2K
4.7K
47K
47K

Marking
PNP

hFE@ IC

V(BR)CEO
Volts
(Min)

Device

Min

mA

IC
mA
Max

R1
Ohm

R2
Ohm

Case 318D04 SC59


MUN2211T1
MUN2212T1
MUN2213T1
MUN2214T1
MUN2215T1
MUN2216T1
MUN2230T1
MUN2231T1
MUN2232T1
MUN2233T1
MUN2234T1

MUN2111T1
MUN2112T1
MUN2113T1
MUN2114T1
MUN2115T1
MUN2116T1
MUN2130T1
MUN2131T1
MUN2132T1
MUN2133T1
MUN2134T1

Case 31808 TO236AB (SOT23)


MMUN2211LT1
MMUN2212LT1
MMUN2213LT1
MMUN2214LT1
MMUN2215LT1
MMUN2216LT1
MMUN2230LT1
MMUN2231LT1
MMUN2232LT1
MMUN2233LT1
MMUN2234LT1

MMUN2111LT1
MMUN2112LT1
MMUN2113LT1
MMUN2114LT1
MMUN2115LT1
MMUN2116LT1
MMUN2130LT1
MMUN2131LT1
MMUN2132LT1
MMUN2133LT1
MMUN2134LT1

A8A
A8B
A8C
A8D
A8E
A8F
A8G
A8H
A8J
A8K
A8L

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
112

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PlasticEncapsulated Surface Mount Transistors (continued)


Table 13. PlasticEncapsulated Surface Mount Bias Resistor Transistors
for General Purpose Applications (continued)
Pinout: 1Base, 2Emitter, 3Collector

NPN

NPN

PNP

8A
8B
8C
8D
8E
8F
8G
8H
8J
8K
8L

6A
6B
6C
6D
6E
6F
6G
6H
6J
6K
6L

50
50
50
50
50
50
50
50
50
50
50

35
60
80
80
160
160
3.0
8.0
15
80
80

5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0

50
50
50
50
50
50
50
50
50
50
50

10K
22K
47K
10K
10K
4.7K
1.0K
2.2K
4.7K
4.7K
22K

10K
22K
47K
47K

1.0K
2.2K
4.7K
47K
47K

7A
7B
7C
7D
7E
7F
7G
7H
7J
7K
7L
7M

8A
8B
8C
8D
8E
8F
8G
8H
8J
8K
8L
8M

50
50
50
50
50
50
50
50
50
50
50
50

35
60
80
80
160
160
3.0
8.0
15
80
80
80

5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0

100
100
100
100
100
100
100
100
100
100
100
100

10K
22K
47K
10K
10K
4.7K
1.0K
2.2K
4.7K
4.7K
22K
2.2K

10K
22K
47K
47K

1.0K
2.2K
4.7K
47K
47K
47K

Marking
PNP

hFE@ IC

V(BR)CEO
Volts
(Min)

Device

Min

mA

IC
mA
Max

R1
Ohm

R2
Ohm

Case 41902 SC70/SOT323


MUN5211T1
MUN5212T1
MUN5213T1
MUN5214T1
MUN5215T1
MUN5216T1
MUN5230T1
MUN5231T1
MUN5232T1
MUN5233T1
MUN5234T1

MUN5111T1
MUN5112T1
MUN5113T1
MUN5114T1
MUN5115T1
MUN5116T1
MUN5130T1
MUN5131T1
MUN5132T1
MUN5133T1
MUN5134T1

Case 419B01 SOT363 Duals


MUN5211DW1T1
MUN5212DW1T1
MUN5213DW1T1
MUN5214DW1T1
MUN5215DW1T1
MUN5216DW1T1
MUN5230DW1T1
MUN5231DW1T1
MUN5232DW1T1
MUN5233DW1T1
MUN5234DW1T1
MUN5235DW1T1

MUN5111DW1T1
MUN5112DW1T1
MUN5113DW1T1
MUN5114DW1T1
MUN5115DW1T1
MUN5116DW1T1
MUN5130DW1T1
MUN5131DW1T1
MUN5132DW1T1
MUN5133DW1T1
MUN5134DW1T1
MUN5135DW1T1

hFE @ IC
Device

Marking

V(BR)CEO

Min

mA

IC
mA
Max

R1
Ohm

R2
Ohm

5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0

100
100
100
100
100
100
100
100
100
100
100
100

10K
22K
47K
10K
10K
4.7K
1.0K
2.2K
4.7K
4.7K
22K
2.2K

10K
22K
47K
47K

1.0K
2.2K
4.7K
47K
47K
47K

Case 419B01 SOT363 Dual Combination NPN and PNP


MUN5311DW1T1
MUN5312DW1T1
MUN5313DW1T1
MUN5314DW1T1
MUN5315DW1T1
MUN5316DW1T1
MUN5330DW1T1
MUN5331DW1T1
MUN5332DW1T1
MUN5333DW1T1
MUN5334DW1T1
MUN5335DW1T1

11
12
13
14
15
16
3X
31
32
33
34
35

50
50
50
50
50
50
50
50
50
50
50
50

NPN

PNP

V(BR)CEO
Volts
(Min)

94
69

59
43

50
50
50

Device
NPN

35
60
80
80
160
160
3.0
8.0
15
80
80
80

Marking
PNP

hFE@ IC
Min

100
80
15

mA

IC
mA
Max

R1
Ohm

R2
Ohm

1.0
5.0
5.0

100
100
100

10K
10K
4.7K

47K
4.7K

Case 46301 SOT416/SC90


DTC114TE
DTC114YE

DTA114YE
DTA143EE

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
113

PlasticEncapsulated Surface Mount Transistors (continued)


Table 14. PlasticEncapsulated Surface Mount Switching Transistors
The following tables are a listing of devices intended for highspeed, low saturation voltage, switching applications. These
devices have very fast switching times and low output capacitance for optimized switching performance.
Pinout: 1Base, 2Emitter, 3Collector
hFE@ IC

Switching Time (ns)


Device

Marking

ton

toff

V(BR)CEO

Min

Max

mA

fT
MHz Min

18
18
18

15
15
12

20
20
40

120

100
100
10

400

35

12

20

50

500

Case 31808 TO236AB (SOT23) NPN


MMBT2369LT1
MMBT2369ALT1
BSV52LT1

M1J
1JA
B2

12
12
12

Case 31808 TO236AB (SOT23) PNP


MMBT3640LT1

2J

25

Table 15. PlasticEncapsulated Surface Mount VHF/UHF Amplifiers, Mixers, Oscillators


The following table is a listing of devices intended for smallsignal RF amplifier applications to VHF/UHF frequencies. These
devices may also be used as VHF/UHF oscillators and mixers.
Pinout: 1Base, 2Emitter, 3Collector
Device

Marking

f T @ IC

V(BR)CEO

Ccb((13))
pF Max

GHz Min

mA

25
15
30

0.7
1.7(14)
0.45

0.65
0.6
0.4

4.0
4.0
8.0

20
15

0.85
0.35(13)

0.6
2.0

5.0
10

20
20
10

1.5(13)
1.5(13)

0.15
0.15
1.4

1.0
1.0
5.0

20

2.0(13)

0.15

1.0

Case 31808 TO236AB (SOT23) NPN


MMBTH10LT1
MMBT918LT1
MMBTH24LT1

3EM
M3B
M3A

Case 31808 TO236AB (SOT23) PNP


MMBTH81LT1
MMBTH69LT1

3D
M3J

Pinout: 1Emitter, 2Base, 3Collector


Case 318D04 SC59 NPN
MSC2295BT1
MSC2295CT1
MSC3130T1

VB
VC
1S

Case 318D04 SC59 PNP


MSA1022CT1

EC

(13) C
re
(14) C
ob

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
114

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PlasticEncapsulated Surface Mount Transistors (continued)


Table 16. PlasticEncapsulated Surface Mount Choppers
The following table is a listing of smallsignal devices intended for chopper applications where a higher than normal
V(BR)CEO is required in the circuit application.
Pinout: 1Base, 2Emitter, 3Collector
hFE @ IC
Device

Marking

V(BR)CEO

V(BR)EBO

Min

Max

mA

25

30

400

12

Case 31808 TO236AB (SOT23) PNP


MMBT404ALT1

2N

35

Table 17. PlasticEncapsulated Surface Mount Darlingtons


The following table is a listing of smallsignal devices that have very high hFE and input impedance characteristics. These
devices utilize monolithic, cascade transistor construction.
Pinout: 1Base, 2Emitter, 3Collector
Devices are listed in order of descending hFE.

Device

Marking

V(BR)CES

hFE @ IC

VCE(sat)
Volts Max

Min

Max

mA

1.5
1.5

20K
10K

100
100

1.5

20K

100

Case 31808 TO236AB (SOT23) NPN


MMBTA14LT1
MMBTA13LT1

1N
1M

30
30

Case 31808 TO236AB (SOT23) PNP


MMBTA64LT1

2V

30

Table 18. PlasticEncapsulated Surface Mount LowNoise Transistors


The following table is a listing of smallsignal devices intended for low noise applications in the audio range. These devices
exhibit good linearity and are candidates for hifi and instrumentation equipment.
Pinout: 1Base, 2Emitter, 3Collector
Devices are listed in order of ascending NF.

Device

Marking

NF
dB Typ

hFE@ IC
V(BR)CEO

Min

Max

mA

fT
MHz Min

25
60
50
45

400

250
500

800

10
10
10
10

50

100
100

50

250

10

40

Case 31808 TO236AB (SOT23) NPN


MMBT5089LT1
MMBT2484LT1
MMBT6428LT1
MMBT6429LT1

1R
1U
1KM
1L

2.0(15)
3.0(15)
3.0
3.0

Case 31808 TO236AB (SOT23) PNP


MMBT5087LT1

2Q

2.0(15)

(15) Max

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
115

PlasticEncapsulated Surface Mount Transistors (continued)


Table 19. PlasticEncapsulated Surface Mount HighVoltage Transistors
The following table is a listing of smallsignal highvoltage devices designed for direct line operation requiring high voltage
breakdown and relatively low current capability.
Pinout: 1Base, 2Emitter, 3Collector
Devices are listed in order of descending breakdown voltage.
hFE@ IC
Device

Marking

V(BR)CEO

Min

Max

mA

fT
MHz Min

15
40
30

100
30
50

40
50
100

15
25
50

100
30
50

40
50
100

Case 31808 TO236AB (SOT23) NPN


MMBT6517LT1
MMBTA42LT1
MMBT5551LT1

1Z
1D
G1

350
300
160

Case 31808 TO236AB (SOT23) PNP


MMBT6520LT1
MMBTA92LT1
MMBT5401LT1

2Z
2D
2L

350
300
150

Table 20. PlasticEncapsulated Surface Mount Drivers


The following is a listing of smallsignal devices intended for medium voltage driver applications at fairly high current levels.
Pinout: 1Base, 2Emitter, 3Collector
hFE@ IC
Device

Marking

V(BR)CEO

VCE(sat)

VBE(sat)

Min

Max

mA

0.25
0.15

100
20

100
10

0.25
0.25

0.90

30
100

25
100

Case 31808 TO236AB (SOT23) NPN


MMBTA06LT1
BSS64LT1

1GM
AM

80
80

Case 31808 TO236AB (SOT23) PNP


BSS63LT1
MMBTA56LT1

T1
2GM

100
80

The following devices are designed to conserve energy. They offer ultralow collector saturation voltage.
Case 31808 TO236AB (SOT23) PNP
MMBT1010LT1

GLP

15

0.1

1.1

300

600

100

15

0.1

1.1

300

600

100

Case 31803 SC59 PNP


MSD1010T1

GLP

Table 21. PlasticEncapsulated Surface Mount General Purpose Amplifiers


Pinout: 1Base, 2Collector, 3Emitter, 4Collector
hFE@ IC
Device

Marking

V(BR)CEO

Min

Max

mA

BH

80

40

250

150

80

40

25

150

Case 318E04 SOT223 NPN


BCP56T1

Case 318E04 SOT223 PNP


Pinout: 1Gate, 2Drain, 3Source, 4Drain
BCP53T1

AH

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
116

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PlasticEncapsulated Surface Mount Transistors (continued)


Table 22. PlasticEncapsulated Surface Mount Switching Transistors
Pinout: 1Base, 2Collector, 3Emitter, 4Collector
hFE
Device

Marking

ton

toff

35

285

45

100

V(BR)CEO

fT

Min

Max

@ IC (mA)

Min (MHz)

40

100

300

20

300

60

100

300

50

200

Case 318E04 SOT223 NPN


PZT2222AT1

P1F

Case 318E04 SOT223 PNP


PZT2907AT1

P2F

Table 23. PlasticEncapsulated Surface Mount Darlingtons


Pinout: 1Base, 2Collector, 3Emitter, 4Collector

Device

hFE

Marking

V(BR)CER

VCE(sat)
Max (V)

Min

Max

@ IC (mA)

AS3
P1N

80
30

1.3
1.5

2000
20k

500
100

BS3
P2V

90
30

1.3
1.5

2000
20k

500
100

Case 318E04 SOT223 NPN


BSP52T1
PZTA14T1

Case 318E04 SOT223 PNP


BSP62T1
PZTA64T1

Table 24. PlasticEncapsulated Surface Mount HighVoltage Transistors


Pinout: 1Base, 2Collector, 3Emitter, 4Collector
hFE
Device

fT

Marking

V(BR)CEO

Min

Max

@ IC (mA)

Min (MHz)

SP19A
P1D
BF720

350
300
250

40
40
50

20
10
10

70
50
60

ZTA96
P2D
BSP16
BF721

450
300
300
250

50
40
30
50

150

150

10
10
10
10

50
50
15
60

Case 318E04 SOT223 NPN


BSP19AT1
PZTA42T1
BF720T1

Case 318E04 SOT223 PNP


PZTA96T1
PZTA92T1
BSP16T1
BF721T1

Table 25. PlasticEncapsulated Surface Mount High Current Transistors


Pinout: 1Base, 2Collector, 3Emitter, 4Collector
Device

hFE@ IC

Marking

V(BR)CEO

VCE(sat)
Volts

651
CA

60
20

0.5
0.5

75
60

1000
1000

ZT751
CE

60
20

0.5
0.5

75
60

1000
1000

Min

Max

mA

Case 318E04 SOT223 NPN


PZT651T1
BCP68T1

Case 318E04 SOT223 PNP


PZT751T1
BCP69T1

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
117

FieldEffect Transistors
JFETs
JFETs operate in the depletion mode. They are available in
both P and Nchannel and are offered in both Throughhole
and Surface Mount packages. Applications include general
purpose amplifiers, switches and choppers, and RF amplifiers
and mixers. These devices are economical and very
rugged. The drain and source are interchangeable on many
typical FETs.

CASE 2904
TO226AA
(TO92)

23

Table 26. JFET LowFrequency/LowNoise


The following table is a listing of smallsignal JFETs intended for lownoise applications in the audio range. These devices
exhibit good linearity and are candidates for hifi and instrumentation equipment.
Re Yfs

mmho
Min

Device

@f

Re Yos @ f

mho
Max

kHz

kHz

IDSS
mA

VGS(off)
Volts

Crss
pF
Max

V(BR)GSS
V(BR)GDO
Volts
Min

Min

Max

Min

Max

Style

7.0
7.0

3.0
3.0

40
25
25

0.8
0.5
1.0

4.0
6.0
7.0

0.9
1.0
2.0

4.5
5.0
9.0

5
5
5

7.0
7.0
7.0

2.0
2.0
2.0

40
40
40

0.75
1.0
1.8

6.0
7.5
9.0

1.0
2.0
4.0

5.0
9.0
16

7
7
7

Ciss
pF
Max

Case 2904 TO226AA (TO92) NChannel


J202
2N5457
2N5458

1.0
1.5

1.0
1.0

50
50

1.0
1.0

Case 2904 TO226AA (TO92) PChannel


2N5460
2N5461
2N5462

1.0
1.5
2.0

1.0
1.0
1.0

75
75
75

1.0
1.0
1.0

Table 27. JFET HighFrequency Amplifiers


The following is a listing of smallsignal JFETs that are intended for hifrequency applications. These are candidates for
VHF/UHF oscillators, mixers and frontend amplifiers.
Re Yfs @ f

Device

mmho
Min

MHz

Re Yos @ f

mho
Max

MHz

Ciss
pF
Max

Crss
pF
Max

dB
Max

f
MHz

V(BR)GSS
V(BR)GDO
Volts
Min

3.0
4.0
4.0
1.5(1)
1.5(1)
1.5(1)

100
400
400
100
100
100

25
25
25
25
25
25
25

NF @ RG = 1K

VGS(off)
Volts

IDSS
mA

Min

Max

Min

Max

Style

0.3
0.5
2.0
1.0
1.0
2.0

8.0
3.0
4.0
6.0
6.5
4.0
6.5

2.0
1.0
4.0
8.0
12
12
24

20
5.0
10
20
60
30
60

5
5
5
5
5
5
5

Case 2904 TO226AA (TO92) NChannel


MPF102
2N5484
2N5485
2N5486
J308
J309
J310

1.6
2.5
3.0
3.5
12(1)
12(1)
12(1)

100
100
400
400
100
100
100

200
75
100
100
250(1)
250(1)
250(1)

100
100
400
400
100
100
100

7.0
5.0
5.0
5.0
7.5
7.5
7.5

3.0
1.0
1.0
1.0
2.5
2.5
2.5

(1) Typical

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
118

Motorola SmallSignal Transistors, FETs and Diodes Device Data

JFETs (continued)
Table 28. JFET Switches and Choppers
The following is a listing of JFETs intended for switching and chopper applications.
RDS(on) @ ID
Device

Max

mA

VGS(off)
Volts
Min

Max

IDSS
mA
Min

Max

V(BR)GSS
V(BR)GDO
Volts
Min

5.0
25
25
5.0
5.0
15
10

75

30

35
30
30
30
30
25
25

Ciss
pF
Max

Crss
pF
Max

ton
ns
Max

toff
ns
Max

Style

28
10
10
10
10
5.0

5.0
3.5
4.0
3.5
4.0
1.2

15

15
18
10

35

55
45
25

5
5
5
5
5
5
5

Case 2904 TO226AA (TO92) NChannel


J112
MPF4392
2N5639
MPF4393
2N5640
2N5555
J110

50
60
60
100
100
150
18

1.0

1.0

1.0

0.5

5.0

(8.0)(1)
(12)(1)
(6.0)(1)
1.0(16)
4.0

(1) Typical
(16) V
GS(f)

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
119

CASE 2905
TO226AE
1WATT (TO92)

TMOS FETs
1

3
D

CASE 2904
TO226AA
(TO92)

2 3

G
S

Table 29. TMOS Switches and Choppers


The following is a listing of smallsignal TMOS devices that are intended for switching and chopper applications. These
devices offer low RDS(on) characteristics.
VGS(th)
Volts

RDS(on) @ ID
Device

Max

Min

Max

V(BR)DSS
Volts
Min

Ciss
pF
Max

Crss
pF
Max

ton
ns
Max

toff
ns
Max

Style

15
15
5.0
15
5.0
5.0

10

22
22
22
22
22
22
22
22

30
10
10
10
23
15
20
10
23
15

22
22
30
22
22
30
22
22
22
30

Case 2905 TO226AE (1WATT TO92) NChannel


MPF930
MPF960
MPF6659
MPF990
MPF6660
MPF6661
MPF910
VN10LM

1.4
1.7
1.8
2.0
3.0
4.0
5.0
5.0

1.0
1.0
1.0
1.0
1.0
1.0
0.5
0.5

1.0
1.0
0.8
1.0
0.8
0.8
0.3
0.8

3.5
3.5
2.0
3.5
2.0
2.0
2.5
2.5

35
60
35
90
60
90
60
60

70(1)
70(1)
30(1)
70(1)
30(1)
30(1)

20(1)
20(1)
4(1)
20(1)
4(1)
4(1)

60

5.0

15
15
5.0
15
5.0
5.0

10

2.5
3.0
3.0
2.5
2.0
3.0
2.5
2.5
2.0
3.0

60
60
60
60
240
200
60
60
240
200

100
60
25(1)
60
125
60(1)
50
60
125
60(1)

25
5.0
3.0(1)
5.0
20
6.0(1)
5.0
5.0
20
6.0(1)

30
10
10
10
8.0
15
20
10
8.0
15

Case 2904 TO226AA (TO92) NChannel


VN0300L
2N7000
BS170
VN0610LL
VN2406L
BS107A
2N7008
VN2222LL
VN2410L
BS107

1.2
5.0
5.0
5.0
6.0
6.4
7.5
7.5
10
14

1.0
0.5
0.2
0.5
0.5
0.25
0.5
0.5
0.5
0.2

0.8
0.8
0.8
0.8
0.8
1.0
1.0
0.6
0.8
1.0

(1) Typical

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
120

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Surface Mount FETs

This section contains the FET plastic packages available for


surface mount applications. Most of these devices are the
most popular metalcan and insertion type parts carried over
to the new surface mount packages.

CASE 31808
TO236AB
SOT23

1
2

CASE 41902
SC70/SOT323

4
4

3
CASE 419B01
SOT363

1
CASE 318E04
SOT223

Table 30. Surface Mount RF JFETs


The following is a list of surface mount FETs which are intended for VHF/UHF RF amplifier applications.
Pinout: 1Drain, 2Source, 3Gate
NF
Device

Marking

dB
Typ

Yfs @ VDS
f
MHz

mmhos
Min

mmhos
Max

Volts

V(BR)GSS

Style

450
450
450
100
100

10
8.0
10
4.5
3.0

20
18
18
7.5
6.0

10
10
10
15
15

25
25
25
30
25

10
10
10
10
10

100

4.5

7.5

15

30

Case 31808 TO236AB (SOT23) NChannel


MMBFJ309LT1
MMBFJ310LT1
MMBFU310LT1
MMBF4416LT1
MMBF5484LT1

6U
6T
M6C
M6A
M6B

1.5
1.5
1.5
2(3)
2.0

Case 419B01 SOT363 Dual NChannel


MBF4416DW1T1

M6

2.0

(3) Max

Table 31. Surface Mount GeneralPurpose JFETs


The following table is a listing of surface mount smallsignal general purpose FETs. These devices are intended for
smallsignal amplification for DC, audio, and lower RF frequencies. They also have applications as oscillators and
generalpurpose, lowvoltage switches.
Pinout: 1Drain, 2Source, 3Gate
Yfs @ VDS
Device

Marking

V(BR)GSS

mmhos
Min

IDSS

mmhos
Max

Volts

mA
Min

mA
Max

Style

5.0

15

1.0

5.0

10

1.0

4.0

15

1.0

5.0

10

1.0

5.0

15

1.0

5.0

Case 31808 TO236AB (SOT23) NChannel


MMBF5457LT1

6D

25

1.0

Case 31808 TO236AB (SOT23) PChannel


MMBF5460LT1

M6E

40

Case 419B01 SOT363 Dual NChannel


MBF5457DW1T1

6D

25

(3) Max

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
121

Surface Mount FETs (continued)


Table 32. Surface Mount Choppers/Switches JFETs
The following is a listing of smallsignal surface mount JFET devices intended for switching and chopper applications.
Pinout: 1Drain, 2Source, 3Gate

Device

Marking

RDS(on)
Ohms
Max

toff
ns
Max

VGS(off)

IDSS

V(BR)GSS

Volts
Min

Volts
Max

mA
Min

mA
Max

Style

30
30
30

4.0
2.0
0.5

10
5.0
3.0

50
25
5.0

150
75
30

10
10
10

30
30

3.0
0.8

6.0
2.5

7.0
1.5

60
20

10
10

Case 31808 TO236AB (SOT23) NChannel


MMBF4391LT1
MMBF4392LT1
MMBF4393LT1

6J
6K
6G

30
60
100

20
35
50

Case 31808 TO236AB (SOT23) PChannel


MMBFJ175LT1
MMBFJ177LT1

6W
6Y

125
300

Table 33. TMOS FETs


The following is a listing of smallsignal surface mount TMOS FETs which exhibit low RDS(on) characteristics.
Pinout: 1Gate, 2Source, 3Drain
RDS(on) @ ID
Device

Marking

Ohm

mA

VGS(th)

Switching Time

VDSS

Volts
Min

Volts
Max

ton ns

toff ns

Style

60
100
50
60
20
20
30

0.8
0.8
0.5
1.0
1.0
1.0
1.0

3.0
2.8
1.5
2.5
2.4
2.4
2.4

10
20
20
20
2.5
2.5
2.5

10
40
20
20
15
16
16

21
21
21
21
21
21
21

50
20
20
20

1.0
1.0
1.0
0.7

2.4
2.0
2.4
1.2

2.5
2.5
2.5
2.5

16
16
16
15

21
21
21
21

Case 31808 TO236AB (SOT23) NChannel


MMBF170LT1
BSS123LT1
BSS138LT1
2N7002LT1
MMBF0201NLT1
MGSF1N02LT1
MGSF1N03LT1

6Z
SA
J1
702
N1
N2
N3

5.0
6.0
3.5
7.5
1.0
0.085
0.09

200
100
200
500
300
1200
1200

Case 31808 TO236 (SOT23) PChannel


BSS84LT1
MMBF0202PLT1
MGSF1P02LT1
MGSF1P02ELT1

PD
P3
PC
PE

6.0
1.4
0.35
0.16

100
200
1500
1500

Pinout: 1Gate, 2Drain, 3Source, 4Drain


RDS(on)
Device

Marking

Ohm

VGS(th)

Switching Time

mA

VDSS

Volts
Min

Volts
Max

ton ns

toff ns

Style

1000
1000
200
200

60
90
240
200

1.0
0.8
0.8
1.0

3.5
2.0
2.0
3.0

15
5.0

15

15
5.0

15

3
3
3
3

20

1.0

2.4

2.5

15

20

1.0

2.4

2.5

16

Case 318E04 SOT223 NChannel


MMFT960T1
MMFT6661T1
MMFT2406T1
MMFT107T1

FT960
T6661
T2406
FT107

1.7
4.0
10
14

Case 41902 SC70/SOT323 NChannel


MMBF2201NT1

N1

1.0

300

Case 41902 SC70/SOT323 PChannel


MMBF2202PT1

P3

2.2

200

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
122

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Tuning and Switching Diodes


CASE 2904
TO226AA
(TO92)

Tuning Diodes
Abrupt Junction

Motorola supplies voltagevariable capacitance diodes serving


the entire range of frequencies from HF through UHF. Used in RF
receivers and transmitters, they have a variety of applications,
including:
Phaselocked loop tuning systems
Local oscillator tuning
Tuned RF preselectors
RF filters
RF phase shifters
RF amplifiers
Automatic frequency control
Video filters and delay lines
Harmonic generators
FM modulators
Two families of devices are available: Abrupt Junction and Hyper
Abrupt Junction. The Abrupt Junction family includes devices
suitable for virtually all tunedcircuit and narrowrange tuning
applications throughout the spectrum.

3
2
STYLE 15

23

CASE 5102
DO204AA
(DO7)

2
STYLE 1

CASE 18202
TO226AC
(TO92)

2
Cathode

CASE 31808
TO236AB
SOT23

3
Cathode

1
Anode
STYLE 1

1
2
3
1

1
Anode
STYLE 8

3
1

1
CASE 46301
SOT416/SC90

Typical Characteristics

STYLE 9

Diode Capacitance versus Reverse Voltage


100

1000

50

C T , DIODE CAPACITANCE (pF)

C T , DIODE CAPACITANCE (pF)

70
1N5148

30
20
10
7
TA = 25C
f = 1 MHz

MV1638

1N5456A
MV1650

100
(See Tables 34
Thru 36)
10
MV1628

3
2

0.6

2
4 6
10
20
VR, REVERSE VOLTAGE (VOLTS)

40

60

MV2109
MMBV2109LT1

MV2115

100

10
MV2101
MMBV2101LT1
1

1
10
VR, REVERSE VOLTAGE (VOLTS)

100

100
C T , DIODE CAPACITANCE (pF)

C T , DIODE CAPACITANCE (pF)

1000

0.1

0.1

MV2105
MMBV2105LT1

1
10
VR, REVERSE VOLTAGE (VOLTS)

100

70

40

20

MMBV432LT1
MV104

TA = 25C
f = 1 MHz
EACH DIODE

10
0.3

(See Tables 37 and 38)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.5

1
2
3
5
10
VR, REVERSE VOLTAGE (VOLTS)

20

30

(See Table 39)

Selector Guide
123

Tuning Diodes Abrupt Junction (continued)


Table 34. GeneralPurpose Glass Abrupt Tuning Diodes
High Q Capacitance Ratio @ 4.0 Volts/60 Volts
The following is a listing of axial leaded, generalpurpose, abrupt tuning diodes. These devices exhibit high Q characteristics.
CT @ VR = 4.0 V, 1.0 MHz
Device(19)

pF
Min

pF
Nominal

pF
Max

V(BR)R
Volts

Cap Ratio
C4/C60
Min

Q
4.0 V, 50 MHz
Min

42.3

47

51.7

60

3.2

200

Case 5102 DO204AA (DO7)


1N5148

Table 35. GeneralPurpose Glass Abrupt Tuning Diodes


High Q Capacitance Ratio @ 2.0 Volts/30 Volts
The following is a listing of axial leaded, generalpurpose, abrupt tuning diodes. These devices exhibit very high Q
characteristics.
CT @ VR = 4.0 V, 1.0 MHz
Device(20)

pF
Min

pF
Nominal

pF
Max

VR(BR)R
Volts

Cap Ratio
C2/C30
Min

Q
4.0 V, 50 MHz
Min

16.2
19.8
90

18
22
100

19.8
24.2
110

30
30
30

2.6
2.6
2.7

350
350
175

Case 5102 DO204AA (DO7)


1N5446ARL
1N5448ARL
1N5456A
(19)Suffix A = 10.0%
(20)Suffix B = 5.0%

Table 36. GeneralPurpose Glass Abrupt Tuning Diodes


Capacitance Ratio @ 2.0 Volts/20 Volts
The following is a listing of axial leaded, generalpurpose, abrupt tuning diodes. These devices exhibit high Q characteristics.
CT @ VR = 4.0 V, 1.0 MHz
Device

pF
Min

pF
Nominal

pF
Max

V(BR)R
Volts

Cap Ratio
C2/C20
Min

Q
4.0 V, 50 MHz
Typ

10.8
13.5
16.2
19.8
29.7
73.8
90

12
15
18
22
33
82
100

13.2
16.5
19.8
24.2
36.3
90.2
110

20
20
20
20
20
20
20

2.0
2.0
2.0
2.0
2.0
2.0
2.0

300
250
250
250
200
150
150

Case 5102 DO204AA (DO7)


MV1626
MV1628
MV1630
MV1634
MV1638
MV1648
MV1650

Table 37. GeneralPurpose Plastic Abrupt Tuning Diodes


Capacitance Ratio @ 2.0 Volts/30 Volts
The following is a listing of plastic package, generalpurpose, abrupt tuning diodes. These devices exhibit high Q
characteristics.
CT @ VR = 4.0 V, 1.0 MHz
Device

pF
Min

pF
Nominal

pF
Max

VR(BR)R
Volts

Cap Ratio
C4/C30
Min

Q
4.0 V, 50 MHz
Typ

6.8
12
15
27
33
47
100

7.5
13.2
16.5
29.7
36.3
51.7
110

30
30
30
30
30
30
30

2.5
2.5
2.5
2.5
2.5
2.5
2.6

400
350
350
250
200
150
100

Case 18202 TO226AC (TO92) 2Lead


MV2101
MV2104
MV2105
MV2108
MV2109
MV2111
MV2115

Selector Guide
124

6.1
10.8
13.5
24.3
29.7
42.3
90

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Tuning Diodes Abrupt Junction (continued)


Table 38. Surface Mount Abrupt Tuning Diodes
Capacitance Ratio @ 2.0 Volts/30 Volts
The following is a listing of surface mount abrupt junction tuning diodes intended for generalpurpose variable capacitance
circuit applications.
CT @ VR = 4.0 V, 1.0 MHz
Device

pF

pF

pF

Min

Nominal

Max

VR(BR)R
Volts

6.1
9.0
13.5
19.8
24.3
29.7

6.8
10
15
22
27
33

7.5
11
16.5
24.2
29.7
36.3

30
30
30
30
30
30

Cap Ratio
C2/C30

4.0 V, 50 MHz

Min

Typ

2.5
2.5
2.5
2.5
2.5
2.5

400
350
350
300
250
200

Case 31808 DO236AB (SOT23)


MMBV2101LT1
MMBV2103LT1
MMBV2105LT1
MMBV2107LT1
MMBV2108LT1
MMBV2109LT1

Table 39. Abrupt Tuning Diodes for FM Radio Dual


The following is a listing of abrupt tuning diodes that are available as dual units in a single package.
CT @ VR(22)
Device

pF
Min

pF
Max

42

Volts

Cap Ratio
C3/C30
Min

Q
3.0 V, 50 MHz
Min

V(BR)R
Volts

Device
Marking

Style

3.0

2.5

100

32

15

2.0

1.5(21)

100

14

M4B

Case 2904 TO226AA (TO92)


MV104

37

Case 31808 TO236AB (SOT23)


MMBV432LT1

43

48.1

(21)C2/C8
(22)Each Diode

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
125

Tuning Diodes
HyperAbrupt Junction

The HyperAbrupt family exhibits higher capacitance, and a


much larger capacitance ratio. It is particularly well suited for
widerrange applications such as AM/FM radio and TV tuning.

CASE 5102
DO204AA
(DO7)

1
Cathode

CASE 18202
TO226AC
(TO92)

2
Anode

CASE 31808
TO236AB
SOT23

3
Cathode

2
Anode
STYLE 1

1
Cathode
STYLE 1

3
1

1
Anode
STYLE 8

4
CASE 318E04
SOT223

1
2

2, 4

STYLE 2

Typical Characteristics
Diode Capacitance versus Reverse Voltage
40
36

16
14

C T , CAPACITANCE (pF)

C T , DIODE CAPACITANCE (pF)

20
18
MMBV105GLT1

12
10
8

TA = 25C
f = 1 MHz

6
4
2
0

32
28

MMBV109LT1
MV209

24
20
16
12
8
4

0.3

0.5

10

20

30

10

30

VR, REVERSE VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Diode Capacitance

Figure 2. Diode Capacitance

Selector Guide
126

100

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Tuning Diodes HyperAbrupt Junction (continued)


10
9
C T , DIODE CAPACITANCE (pF)

C T , DIODE CAPACITANCE (pF)

40
32
MMBV409LT1
MV409

24
16
8
0
1

10
20
VR, REVERSE VOLTAGE (VOLTS)

8
7
6
MMBV809LT1

5
4
3
2
1
0

0.5 1

Figure 3. Diode Capacitance

Figure 4. Diode Capacitance

50

36
32
28

C T , DIODE CAPACITANCE (pF)

C T , DIODE CAPACITANCE (pF)

40

MMBV3102LT1

24
20
16
12

TA = 25C
f = 1 MHz

8
4
0
0.3

3 4 5
8 10
15
VR, REVERSE VOLTAGE (VOLTS)

0.5

10

20

40
f = 1 MHz
30
20
10

30

MMBV609LT1

10

20

VR, REVERSE VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 5. Diode Capacitance

Figure 6. Diode Capacitance


Each Die

30

40

MV7005T1
1000

500
C T , DIODE CAPACITANCE (pF)

C T , CAPACITANCE (pF)

500

100
50

10

100
MV1405

50
30
20

MV1403

10

MV1404
1

VR, REVERSE VOLTAGE (VOLTS)

Figure 7. Capacitance versus Reverse Voltage

TA = 25C
f = 1 MHz

300
200

MV7404T1
3
4

10

VR, REVERSE VOLTAGE (VOLTS)

Figure 8. Diode Capacitance versus Reverse Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
127

Tuning Diodes HyperAbrupt Junction (continued)


Table 40. HyperAbrupt Tuning Diodes for Telecommunications Single
The following is a listing of hyperabrupt tuning diodes intended for high frequency, FM radio, and TV tuner applications.
CT @ VR (f = 1.0 MHz)
Device

pF
Min

pF
Max

Cap Ratio @ VR

Q
50 MHz
Max

V(BR)R
Volts

Device
Marking

Case
Style

CV
Curve
Fig

Volts

Min

Max

Volts

3.0 V
Min

3.0
3.0

5.0
1.5

6.5
2.0

3/25
3/8

200
200

30
20

1
1

2
3

25
3.0
3.0
2.0
3.0

4.0
5.0
1.5
1.8
4.5

6.5
6.5
1.9
2.6

3/25
3/25
3/8
2/8
3/25

200
200
200
300
200

30
30
20
20
30

M4E
M4A
X5
5K
M4C

8
8
8
8
8

1
2
3
4
5

3.0

5.0

6.5

3/25

200

30

M4A

50 MHz
Max

V(BR)R
Volts

Device
Marking

Case
Style

CV
Curve
Fig

20

5L

Case 18202 TO226AC (TO92)


MV209
MV409

26
26

32
32

Case 31808 TO236AB (SOT23)


MMBV105GLT1
MMBV109LT1
MMBV409LT1
MMBV809LT1
MMBV3102LT1

1.5
26
26
4.5
20

2.8
32
32
6.1
25

Case 41902 SC70/SOT323


MBV109T1

26

32

Table 41. HyperAbrupt Tuning Diodes for Communications Dual


CT @ VR (f = 1.0 MHz)
Device

pF
Min

pF
Max

Cap Ratio @ VR

Volts

Min

Max

Volts

3.0 V
Min

3.0

1.8

2.4

3/8

250

Case 31808 TO236AB (SOT23)


MMBV609LT1

26

32

Table 42. HyperAbrupt High Capacitance Voltage Variable Diode Surface Mount
The following are high capacitance voltage variable diodes intended for low frequency applications and circuits requiring
large tuning capacitance.
CT @ f = 1.0 MHz
Device

V(BR)R
Volts

IR
nA

Min
pF

Max
pF

Cap Ratio
Min

Q
Min

Style

CV
Curve
Figure

400
96

520
144

12(26)
10(27)

150(28)
200(29)

2
2

8
11

Case 318E04 SOT223


Pinout: 1Anode, 2, 4Cathode, 3NC
MV7005T1
MV7404T1

15
12

100
100

Table 43. HyperAbrupt High Capacitance Tuning Diodes Axial Lead Glass Package
CT @ VR
Device

pF
Min

pF
Max

144
210
300

Volts

Cap Ratio
C2/C10
Min

Q
2.0 V, 1.0 MHz
Min

V(BR)R
Volts

Style

CV
Curve
Figure

2.0
2.0
2.0

10
10
10

200
200
200

12
12
12

1
1
1

11
11
11

Case 5102 DO204AA (DO7)


MV1404
MV1403
MV1405

96
140
200

(26) V = 1.0 V/V = 9.0 V


R
R
(27) V = 2.0 V/V = 10 V
R
R
(28) V = 1.0 V, f = 1.0 MHz
R
(29) V = 2.0 V, f = 1.0 MHz
R

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
128

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Schottky Diodes

CASE 18202
TO226AC
(TO92)

Schottky diodes are ideal for VHF and UHF mixer and detector
applications as well as many higher frequency applications.
They provide stable electrical characteristics by eliminating
the pointcontact diode presently used in many applications.

CASE 42504
SOD123
STYLE 1

STYLE 1
2

2
Cathode

1
Cathode

1
Anode

CASE 41902
SC70/SOT323
1

Single
3

2
Anode

CASE 419B01,
STYLE 6
SOT363

CASE 31808
TO236AB
SOT23

1
2

STYLE 8

STYLE 9

STYLE 11

3 1

21

Single

Series
3
Common Cathode

STYLE 19

STYLE 12
Cathode
1

Anode
3

2
Series
3

2
Cathode

Typical Characteristics
Capacitance versus Reverse Voltage
2.8
TA = 25C

MBD101
MMBD101LT1
MMBD352LT1*
MMBD353LT1*
MMBD354LT1*

0.9

TA = 25C

2.4
C T , CAPACITANCE (pF)

C T , CAPACITANCE (pF)

0.8

0.7

2
MBD301,
MMBD301LT1

1.6
1.2
0.8
0.4

0.6

MBD701, MMBD701LT1

0
0

VR, REVERSE VOLTAGE (VOLTS)

* EACH DIODE

10

15

20

25

30

35

40

45

50

VR, REVERSE VOLTAGE (VOLTS)

(See Table 44)

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
129

Schottky Diodes (continued)


Table 44. Schottky Diodes
The following is a listing of Schottky diodes that exhibit low forward voltage drop for improved circuit efficiency.
V(BR)R
Volts

Device

CT @ VR
pF
Max

VF @ 10 mA
Volts
Max

IR @ VR
nA
Max

Minority
Lifetime
pS (TYP)

Device
Marking

Style

1.0 @ 20 V
1.5 @ 15 V
1.0 @ 0 V

1.0
0.6
0.6

200 @ 35 V
200 @ 25 V
250 @ 3.0 V

15
15

1
1
1

0.5 @ 30 mA
0.5 @ 30 mA
0.75
0.4
0.4
0.4
1.0
0.6
0.6

1000 @ 25 V
1000 @ 25 V
100 @ 50 V
2000 @ 25 V
2000 @ 25 V
2000 @ 25 V
200 @ 35 V
200 @ 25 V
250 @ 3.0 V

15
15
15

B1

BE

LV3
LD3
5H
4T
4M

8
12
8
12
8
11
8
8
8

Case 18202 TO226AC (TO92)


MBD701
MBD301
MBD101

70
30
7.0

Case 31808 TO236AB (SOT23) Single


BAS40LT1
BAS4004LT1
BAS70LT1
BAT54ALT1
BAT54LT1
BAT54SLT1
MMBD701LT1
MMBD301LT1
MMBD101LT1

40
40
70
30
30
30
70
30
7.0

5.0 @ 1.0 V
5.0 @ 1.0 V
2.0 @ 0 V
10 @ 1.0 V
10 @ 1.0 V
10 @ 1.0 V
1.0 @ 20 V
1.5 @ 15 V
1.0 @ 0 V

Case 31808 TO236AB (SOT23) Dual


BAS4006LT1
BAS7004LT1(23)
MMBD352LT1
MMBD353LT1
MMBD354LT1
MMBD355LT1
MMBD452LT1

40
70
7.0
7.0
7.0
7.0
30

5.0 @ 1.0 V
2.0 @ 0 V
1.0 @ 0 V
1.0 @ 0 V
1.0 @ 0 V
1.0 @ 0 V
1.5 @ 1.5 V

0.5 @ 30 mA
0.75
0.6
0.6
0.6
0.6
0.6

1000 @ 25 V
100 @ 50 V
250 @ 3.0 V
250 @ 3.0 V
250 @ 3.0 V
250 @ 3.0 V
200 @ 25 V

15
15
15
15
15

M5G
M4F
M6H
MJ1
5N

11
12
11
19
9
12
11

30
70
30
4

10 @ 1.0 V
1.0 @ 20 V
1.5 @ 15 V
1.0 @ 0 V

0.4
1.2
0.6
0.6

2000 @ 25 V
0.2 @ 35 V
0.2 @ 25 V
0.25 @ 3 V

15
15
15

5H
4T
4M

1
1
1
1

0.4
0.6
1.0

2000 @ 25 V
0.2 @ 25 V
0.2 @ 35 V

4T
5H

2
2
2

0.4
0.6
0.37 @ 1 mA

2000 @ 25 V
250 @ 3.0 V
0.2 @ 10 V

M5
B3

9
9
2

Case 42504 (SOD123)


BAT54T1
MMSD701T1
MMSD301T1
MMSD101T1

Case 41902 (SC70/SOT323) Single


BAT54WT1
MMBD330T1
MMBD770T1

30
30
70

10 @ 1.0 V
1.5 @ 15 V
1.0 @ 20 V

Case 41902 (SC70/SOT323) Dual


BAT54SWT1
MMBD352WT1
MMBD717LT1(23)

30
7.0
20

10 @ 1.0 V
1.0 @ 0 V
2.5 @ 1.0 V

(23) Common Anode

Case 419B01 SOT363 Duals


V(BR)R
Device

IR

VF

Marking

Min
Volts

@ IBR
(A)

Max
(A)

@ VR
Volts

Min
Volts

Max
Volts

@ IF
(mA)

CT((30))
Max
(pF)

trr
Max
(ns)

Case
Style

BL
M4
T4
H5

30
7.0
30
70

10
10
10
10

2.0
200
200
200

25
25
25
25

0.32
0.6
0.4
0.5

1.0
1.0
1.0
1.0

1.0
1.0
1.5
1.0

5.0

6
6
6
6

MBD54DWT1
MBD110DWT1
MBD330DWT1
MBD770DWT1
(30) V = 0 V, f = 1.0 MHz
R

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
130

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Switching
Diodes
Smallsignal switching diodes are intended for low current
switching and steering applications. HotCarrier, PIN and
generalpurpose diodes allow a wide selection for specific
application requirements.

CASE 2904
TO226AA
(TO92)
2

CASE 18202
TO226AC
(TO92)

1
2

3
STYLE 3

Typical Characteristics

Capacitance versus Reverse Voltage

STYLE 1
3

C T , DIODE CAPACITANCE (pF)

10

2
Cathode

STYLE 4

TA = 25C
f = 1 MHz

1
Anode

2
3

MPN3404

CASE 31808
TO236AB
SOT23

1
1

0.5
0.3
0.2

MMBV3401LT1
20 V MAX VR

12

18

MPN3700
MMBV3700LT1
24

30

36

42

STYLE 8

48

54

STYLE 12
3

SINGLE

VR, REVERSE VOLTAGE (VOLTS)

3
COMMON ANODE

(See Table 45)


STYLE 1

STYLE 18

STYLE 9

1
Cathode

2
Anode

3
COMMON CATHODE

CASE 42504
SOD123

STYLE 11
ANODE
3

3
SINGLE

CATHODE
3

STYLE 19

3
SERIES

3
SERIES

CASE 46301
SOT416/SC90

3
1

CATHODE
STYLE 4

CASE 318D04
SC59

2
ANODE
STYLE 5

2
1

STYLE 2
3

STYLE 2
1

SINGLE

2
3
COMMON CATHODE

SINGLE

SINGLE

STYLE 3

STYLE 5

2
STYLE 4

STYLE 5
1

CASE 41902
SC70/SOT323

STYLE 4

2
3
COMMON ANODE

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2
3
COMMON CATHODE

2
3
COMMON ANODE

Selector Guide
131

Switching Diodes (continued)


Table 45. PIN Switching Diodes
The following PIN diodes are designed for VHF band switching and generalpurpose low current switching applications.
CT @ VR @ 1.0 MHz

V(BR)R
Volts
Min

Device

Series
Resistance
Ohm
Max

Device
Marking

Style

pF
Max

Volts

IR @ VR
A
Max

1.0
2.0

20
15

0.1 @ 150
0.1 @ 25 V

1.0 @ 10 mA
0.85 @ 10 mA

1
1

1.0
1.0

20
20

0.1 @ 150
0.1 @ 25 V

1.0 @ 10 mA
0.7 @ 10 mA

4R
4D

8
8

Case 18202 TO226AC (TO92)


MPN3700
MPN3404

200
20

Case 31808 TO236AB (SOT23)


MMBV3700LT1
MMBV3401LT1

200
35

Table 46. GeneralPurpose Signal and Switching Diodes Single


The following is a listing of smallsignal switching diodes in surface mount packages. These diodes are intended for low
current switching and signal steering applications.
V(BR)R
Device

Marking

Min
Volts

@ IBR
(A)

IR

VF

CT(30)

trr

Max
(A)

@ VR
Volts

Min
Volts

Max
Volts

@ IF
(mA)

Max
(pF)

Max
(ns)

Case
Style

Case 31808 TO236AB (SOT23)


BAS21LT1
MMBD914LT1
BAS16LT1
MMBD6050LT1
BAL99LT1

JS
5D
A6
5A
JF

250
100
75
70
70

100
100
100
100
100

0.1
5.0
1.0
0.1
2.5

200
75
75
50
70

0.85

1.0
1.0
1.0
1.1
1.0

100
10
50
100
50

5.0
4.0
2.0
2.5
1.5

50
4.0
6.0
4.0
6.0

8
8
8
8
18

40
40

100
100

0.1
0.1

35
35

1.2
1.2

100
100

2.0
2.0

3.0
3.0

4
2

75
40
80
100

1.0
100
100
100

0.02
0.1
0.1
5.0

20
35
75
75

1.25
1.2
1.2
1.0

150
100
100
10

2.0
2.0
2.0
4.0

6.0
3.0
3.0
4.0

2
2
2
2

100

100

5.0
0.5

75
80

1.0
1.2

10
100

4.0
2.0

4.0
4.0

1
1

Case 318D04 SC59


M1MA151AT1
M1MA151KT1

MA
MH

Case 41902 SC70/SOT323


BAS16WT1
M1MA141KT1
M1MA142KT1
M1MA174T1

A6
MH
MI
J6

Case 42504 SOD123


MMSD914T1
MMSD71RKT1

5D
6S

(30) V = 0 V, f = 1.0 MHz


R

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
132

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Switching Diodes (continued)


Table 47. GeneralPurpose Signal and Switching Diodes Dual
The following is a listing of smallsignal switching diodes in surface mount packages. These diodes are intended for low
current switching and signal steering applications.
V(BR)R
Device

Marking

Min
Volts

@ IBR
(A)

IR

VF

CT(30)

trr

Max
(A)

@ VR
Volts

Min
Volts

Max
Volts

@ IF
(mA)

Max
(pF)

Max
(ns)

Case
Style

Case 31808 TO236AB (SOT23)


MMBD7000LT1
MMBD2836LT1
MMBD2838LT1
BAV70LT1
BAV99LT1
BAW56LT1
MMBD6100LT1
BAV74LT1
MMBD2835LT1
MMBD2837LT1

M5C
A2
A6
A4
A7
A1
5BM
JA
A3
A5

100
75
75
70
70
70
70
50
35
35

100
100
100
100
100
100
100
5.0
100
100

1.0
0.1
0.1
5.0
2.5
2.5
0.1
0.1
0.1
0.1

50
50
50
70
70
70
50
50
30
30

0.75

0.85

1.1
1.0
1.0
1.0
1.0
1.0
1.1
1.0
1.0
1.0

100
10
10
50
50
50
100
100
10
10

1.5
4.0
4.0
1.5
1.5
2.0
2.5
2.0
4.0
4.0

4.0
4.0
4.0
6.0
4.0
6.0
4.0
4.0
4.0
4.0

11
12
9
9
11
12
9
9
12
9

40
40

100
100

0.1
0.1

35
35

1.2
1.2

100
100

15
2.0

10
3.0

5
3

100
100
100
100
100
100
100
100

0.1
0.1
2.5
5.0
2.5
2.5
0.1
0.1

75
75
70
70
70
70
35
35

1.2
1.2
1.0
1.0
1.0
1.0
1.2
1.2

100
100
50
50
50
50
100
100

2.0
15
2.0
1.5
1.5
1.5
2.0
15

3.0
10
6.0
6.0
6.0
6.0
3.0
10

5
4
4
5
9
10
5
4

70

1.2

100

3.5

4.0

70

1.2

100

3.5

4.0

CT(30)

trr

Case 318D04 SC59


M1MA151WAT1
M1MA151WKT1

MN
MT

Case 41902 SC70/SOT323


M1MA142WKT1
M1MA142WAT1
BAW56WT1
BAV70WT1
BAV99WT1
BAV99RWT1
M1MA141WKT1
M1MA141WAT1

MU
MO
A1
A4
A7
F7
MT
MN

80
80
70
70
70
70
40
40

Case 46301 SOT416/SC90 (Common Anode)


DAP222

P9

80

100

100

Case 46301 SOT416/SC90 (Common Cathode)


DAN222

N9

80

100

100

Table 48. LowLeakage Medium Speed Switching Diodes Single


V(BR)R
Device

Marking

Min
Volts

@ IBR
(A)

IR

VF

Max
(nA)

@ VR
Volts

Min
Volts

Max
Volts

@ IF
(mA)

Max
(pF)

Max
(ns)

Case
Style

100
100

5.0
0.5

75
30

1.0
0.95

10
10

2.0
2.0

3000
3000

8
6

30

100

0.5

30

0.95

10

2.0

3000

30

100

0.5

30

0.95

10

2.0

3000

30

100

0.5

30

0.95

10

2.0

3000

Case 31808 TO236AB (SOT23)


BAS116LT1
MMBD1000LT1

JV
AY

75
30

Case 41902 (SOT323)/(SC70)


MMBD2000T1

DH

Case 318D04 (SC59)


MMBD3000T1

XP

Case 42504 (SOD123)


MMSD1000T1

4K

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
133

Switching Diodes (continued)


Table 49. LowLeakage Medium Speed Switching Diodes Dual
V(BR)R
Device

Marking

Min
Volts

@ IBR
(A)

IR

VF

CT(30)

trr

Max
(nA)

@ VR
Volts

Min
Volts

Max
Volts

@ IF
(mA)

Max
(pF)

Max
(ns)

Case
Style

5.0
5.0
5.0
0.5
0.5

70
70
70
30
30

1.0
1.0
1.0
0.95
0.95

10
10
10
10
10

2.0
2.0
2.0
2.0
2.0

3000
3000
3000
3000
3000

9
11
12
12
9

100
100

0.5
0.5

30
30

0.95
0.95

10
10

2.0
2.0

3000
3000

4
5

100
100

0.5
0.5

30
30

0.95
0.95

10
10

2.0
2.0

3000
3000

5
3

Case 31808 TO236AB (SOT23)


BAV170LT1
BAV199LT1
BAW156LT1
MMBD1005LT1
MMBD1010LT1

JX
JY
JZ
A3
A5

70
70
70
30
30

100
100
100
100
100

Case 41902 (SOT323)/(SC70) DUAL


MMBD2005T1
MMBD2010T1

DI
DP

30
30

Case 318D04 (SC59) DUAL


MMBD3005T1
MMBD3010T1

XQ
XS

30
30

(30) V = 0 V, f = 1.0 MHz


R

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
134

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Multiple
Switching Diodes
Multiple diode configurations utilize monolithic structures fabricated by the planar process. They are designed to satisfy fast
switching requirements as in core driver and encoding/decoding applications where their monolithic configurations offer lower cost,
higher reliability and space savings.

14

16
1

CASE 751A03
SO14
PLASTIC

CASE 751B05
SO16
PLASTIC

Diode Array Diagrams


1

11

Dual 10
Diode
Array

3
8

10 13 14

12

7
2

11 12

11 12

14

Dual 8
Diode
Array

11 12

10 11 12 13 14

10
7

NC Pin 6, 13

6
1

14

8
2

14
2

5
1

NC Pin 4,6,10,13

8 Diode
Array
(Common
Cathode)

Isolated
7 Diode
Array

NC Pin 1, 4, 6, 10, 13

2
1

16
Diode
Array

14

8 Diode
Array
(Common
Anode)

11 12

NC Pin 1, 4, 6, 10, 13

Isolated
8 Diode
Array

16 15 14 13 12 11 12

Table 50. Diode Arrays


Case 751A03 SO14
MMAD130
MMAD1103
MMAD1105
MMAD1106
MMAD1107
MMAD1109

Dual 10 Diode Array


16 Diode Array
8 Diode Common Cathode Array
8 Diode Common Anode Array
Dual 8 Diode Array
7 Isolated Diode Array

1
2
3
4
5
7

8 Isolated Diode Array

Case 751B05 SO16


MMAD1108

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
135

CASE 31808
TO236AB
SOT23

6
1

Energy. Its something Motorola is putting a lot of energy


into helping save. Thats why were introducing our GreenLine portfolio of devices, featuring energyconserving traits
superior to those of our existing line of standard parts for the
same usage. GreenLine devices can actually help reduce
the power demands of your products.

PlasticEncapsulated
Surface Mount Devices

CASE 318D04
SC59

CASE 318E04
SOT223

3
4
2

CASE 318G02
TSOP6

CASE 41902
SC70/SOT323

CASE 42504
SOD123

Small Signal HDTMOS: These devices provide our


lowest ever drainsource resistance versus package size.
Lower rDS(on) means less wasted energy through dissipation
loss, making them especially effective for lowcurrent
applications where energy conservation is crucial, such as low
current switchmode power supplies, uninterruptable power
supplies (UPS), power management systems, and bias
switching. This makes them ideal for portable computertype
products or any system where the combination of power
management and energy conservation is key.

Wide Range of Applications


Currently, our portfolio consists of three families.
LowLeakage Switching Diodes: With reverse leakage
specifications guaranteed to 500 pA, they help extend battery
life, making them ideal for small batteryoperated systems in
which standby power is essential. Applications include ESD
protection, reverse voltage protection, and steering logic.

Save Energy Save Money


In an increasingly powerhungry world, Motorolas GreenLine portfolio makes powerful sense. So much sense that we
plan to continue adding devices to the portfolio. Chances
are, there are Motorola GreenLine devices applicable to one
or more of your products ones that can help save energy,
dollars and the environment.

Bipolar Output Driver Transistors: Offering ultralow


collector saturation voltage, they deliver more energy to the
intended load with less power wasted through dissipation loss.
They are especially effective in todays lower voltage
batterypowered applications, and prolong battery life in
portable and handheld communications and personal digital
equipment.

Table 51. Bipolar Driver Transistor PNP


These offer ultralow collector saturation voltage.
Pinout: 1Base, 2Emitter, 3Collector
hFE@ IC
Device Type

MMBT1010LT1
MSD1010T1

Selector Guide
136

Marking

Case

V(BR)CEO

VCE(sat)

VBE(sat)

Min

Max

mA

GLP
GLP

SOT23
SC59

15
15

0.1
0.1

1.1
1.1

300
300

600
600

100
100

Motorola SmallSignal Transistors, FETs and Diodes Device Data

GreenLine (continued)
Table 52. Low Leakage Switching Diodes
These offer reverse leakage specifications guaranteed to 500 pA. Versions available in single and dual.
IR

V(BR)R
Marking

Case

Style

Min
Volts

@ IBR
(A)

Max
(nA)

@ VR
Volts

MMBD1000LT1
MMBD1005LT1
MMBD1010LT1

AY
A3
A5

SOT23
SOT23
SOT23

Single
Dual Anode
Dual Cathode

30
30
30

100
100
100

0.5
0.5
0.5

30
30
30

MMBD2000T1
MMBD2005T1
MMBD2010T1

DH
DI
DP

SC70
SC70
SC70

Single
Dual Anode
Dual Cathode

30
30
30

100
100
100

0.5
0.5
0.5

30
30
30

MMBD3000T1
MMBD3005T1
MMBD3010T1

XP
XQ
XS

SC59
SC59
SC59

Single
Dual Anode
Dual Cathode

30
30
30

100
100
100

0.5
0.5
0.5

30
30
30

MMSD1000T1

4K

SOD123

Single

30

100

0.5

30

Device Type

Table 53. Small Signal HDTMOS MOSFETs


These provide the lowest drainsource resistance versus package size.
RDS(on) Max
Device Type

Marking

Channel

@Vgs1
(10 V)

@Vgs2
(4.5 V)

VGS(th)

@Vgs3
(2.5 V)

VDSS

Switching Time

Volts
Min

Volts
Max

t(on)
ns

t(off)
ns

Style

Case 31808 TO236AB (SOT23) PChannel and NChannel


2N7002LT1
BSS84LT1
BSS123LT1
BSS138LT1
MMBF0201NLT1
MMBF0202PLT1
MGSF1N02LT1
MGSF1N03LT1
MGSF1P02LT1
MGSF1P02ELT1

702
PD
SA
J1
N1
P3

N
P
N
N
N
P
N
N
P
P

7.5

6.0

1.0
1.4
0.085
0.10
3.5
0.16

10

3.5
1.4
3.5
0.125
0.145
0.5
0.21

60
50
100
50
20
20
20
30
20
20

1.0
0.8
0.8
0.5
1.0
1.0
1.0
1.0
1.0
0.7

2.5
2.0
2.8
1.5
2.4
2.4
2.4
2.4
2.4
1.2

2.5
20
20
2.5
2.5
2.5
2.5
2.5
2.5

16
40
20
15
16
16
16
16
15

21
21
21
21
21
21
21
21
21
21

Case 318G02 TSOP6 PChannel and NChannel


MGSF3441VT1
MGSF3441XT1
MGSF3442VT1
MGSF3442XT1
MGSF3454VT1
MGSF3454XT1
MGSF3455VT1
MGSF3455XT1

P
P
N
N
N
N
P
P

0.065
0.065
0.10
0.10

0.10
0.10
0.07
0.07
0.095
0.095
0.19
0.19

0.135
0.135
0.095
0.095

20
20
20
20
30
30
30
30

0.45
0.45
0.6
0.6
1.0
1.0
1.0
1.0

27
27
8.0
8.0
10
10
10
10

52
52
36
36
20
20
20
20

1
1
1
1
1
1
1
1

2.2
1.0

3.5
1.4

20
20

1.0
1.0

2.4
2.4

2.5
2.5

16
15

7
7

Case 41902 SC70/SOT323


MMBF2202PT1
MMBF2201NT1

P3
N1

P
N

Devices listed in bold, italic are Motorola preferred devices.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Selector Guide
137

Small Signal
Multiintegrated Devices

4
1

3
CASE 419B01
SOT363

CASE 31808
SOT23

VCC (4)

Vout

(3)

Vin 1.0 k

R1

6.8 V

Q1

(1)

33 k

R2
GND
Vref (6)

R3
Q2
VENBL
(5)

(2)

MDC3105LT1

Iout (1)

R4

R5

Q4
R6

GND (2) and (3)


MDC5001T1

INTERNAL CIRCUIT DIAGRAMS


Table 54. Low Voltage Bias Stabilizer
A silicon SMALLBLOCK integrated circuit which maintains stable bias current in various discrete bipolar junction and field
effect transistors.
VCC (Volts)
Device Type

Marking

Min

Max

ICC
A

Vref
Volts

Vref
Volts

10

200

2.1

50

Case 419B01 SOT363


MDC5001T1

E6

1.8

Table 55. Integrated Relay/Solenoid Driver


Monolithic circuit block to switch 3.0 V to 5.0 V relays. It is intended to replace an array of three to six discrete components.
VCC (Volts)
Device Type

Vin (Volts)

Min

Max

Min

Max

Vsat
(Volts)

Iin
(mA)

IC(on)
(mA)

2.0

5.5

2.0

5.5

0.4

2.5

250

Case 31808 SOT23


MDC3105LT1

Devices listed in bold, italic are Motorola preferred devices.

Selector Guide
138

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Section 2
Plastic-Encapsulated
Transistors

In Brief . . .
Motorolas plastic transistors and diodes encompass
hundreds of devices spanning the gamut from
general-purpose amplifiers and switches with a wide variety
of characteristics to dedicated special-purpose devices for
the most demanding applications. The popular TO-92,
1-Watt TO-92 and TO-116 combine proven reliability
performance and economy for through-the-hole
manufacturing, while the SOT-23, SC-59, SC-70/SOT-323,
SC90/SOT416, SOT-223, and SO-16 offer the same
solutions for surface mount manufacturing.
As an additional service to our customers Motorola will,
upon request, supply many of these devices in tape and reel
for automatic insertion.
Contact your Motorola representative for ordering information.
This section contains both single and multiple plasticencapsulated transistors.

CASE 29-04
(TO-226AA)
TO-92

CASE 29-05
(TO-226AE)
1 WATT TO-92

3
3
1

4
1

2
2

CASE 318-08
(TO-236AB)
SOT-23

NOTE: All SOT-23 package devices have had a T1 suffix


NOTE: added to the device title.

CASE 318D-04
SC-59

CASE 318E-04
(TO-261AA)
SOT-223

CASE 419-02
SC-70/SOT-323

CASE 463-01
SC-90/SOT-416

16
14

1
1

CASE 646-06
(TO-116)

CASE 751B-05
SO-16
Not to Scale

Motorola SmallSignal Transistors, FETs and Diodes Device Data

21

EMBOSSED TAPE AND REEL


SOT-23, SC-59, SC-70/SOT-323, SC90/SOT416, SOT-223 and SO-16 packages are available only in
Tape and Reel. Use the appropriate suffix indicated below to order any of the SOT-23, SC-59,
SC-70/SOT-323, SOT-223 and SO-16 packages. (See Section 6 on Packaging for additional information).
SOT-23:

available in 8 mm Tape and Reel


Use the device title (which already includes the T1 suffix) to order the 7 inch/3000 unit reel.
Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/10,000 unit reel.

SC-59:

available in 8 mm Tape and Reel


Use the device title (which already includes the T1 suffix) to order the 7 inch/3000 unit reel.
Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/10,000 unit reel.

SC-70/
SOT-323:

available in 8 mm Tape and Reel


Use the device title (which already includes the T1 suffix) to order the 7 inch/3000 unit reel.
Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/10,000 unit reel.

SOT-223:

available in 12 mm Tape and Reel


Use the device title (which already includes the T1 suffix) to order the 7 inch/1000 unit reel.
Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/4000 unit reel.

SO-16:

available in 16 mm Tape and Reel


Add an R1 suffix to the device title to order the 7 inch/500 unit reel.
Add an R2 suffix to the device title to order the 13 inch/2500 unit reel.

RADIAL TAPE IN FAN FOLD BOX OR REEL


TO-92 packages are available in both bulk shipments and in Radial Tape in Fan Fold Boxes or Reels.
Fan Fold Boxes and Radial Tape Reel are the best methods for capturing devices for automatic insertion in
printed circuit boards.
TO-92:

available in Fan Fold Box


Add an RLR suffix and the appropriate Style code* to the device title to order the Fan Fold box.
available in 365 mm Radial Tape Reel
Add an RLR suffix and the appropriate Style code* to the device title to order the Radial Tape
Reel.

*Refer to Section 6 on Packaging for Style code characters and additional information on ordering
*requirements.

DEVICE MARKINGS/DATE CODE CHARACTERS


SOT-23, SC-59, SC-70/SOT-323, and the SC90/SOT416 packages have a device marking and a date
code etched on the device. The generic example below depicts both the device marking and a representation of the date code that appears on the SC-70/SOT-323, SC-59 and SOT-23 packages.

ABC D
The D represents a smaller alpha digit Date Code. The Date Code indicates the actual month in which the
part was manufactured.

22

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors

2N3903
2N3904*

NPN Silicon

*Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

200

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS(1)
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage (2)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

6.0

Vdc

Base Cutoff Current


(VCE = 30 Vdc, VEB = 3.0 Vdc)

IBL

50

nAdc

Collector Cutoff Current


(VCE = 30 Vdc, VEB = 3.0 Vdc)

ICEX

50

nAdc

Characteristic

OFF CHARACTERISTICS

1. Indicates Data in addition to JEDEC Requirements.


2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

23

2N3903 2N3904
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

2N3903
2N3904

20
40

(IC = 1.0 mAdc, VCE = 1.0 Vdc)

2N3903
2N3904

35
70

(IC = 10 mAdc, VCE = 1.0 Vdc)

2N3903
2N3904

50
100

150
300

(IC = 50 mAdc, VCE = 1.0 Vdc)

2N3903
2N3904

30
60

(IC = 100 mAdc, VCE = 1.0 Vdc)

2N3903
2N3904

15
30

0.2
0.3

0.65

0.85
0.95

250
300

Unit

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 0.1 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage(1)


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc

VCE(sat)

Base Emitter Saturation Voltage(1)


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT
2N3903
2N3904

MHz

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

4.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

8.0

pF

1.0
1.0

8.0
10

0.1
0.5

5.0
8.0

50
100

200
400

1.0

40

6.0
5.0

td

35

ns

tr

35

ns

ts

175
200

ns

tf

50

ns

Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
Voltage Feedback Ratio
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
SmallSignal Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

X 10 4

hre
2N3903
2N3904
hfe
2N3903
2N3904

Output Admittance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
Noise Figure
(IC = 100 mAdc, VCE = 5.0 Vdc, RS = 1.0 k , f = 1.0 kHz)

hie
2N3903
2N3904

hoe

NF
2N3903
2N3904

mmhos
dB

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time

((VCC = 3.0 Vdc, VBE = 0.5 Vdc,


IC = 10 mAdc, IB1 = 1.0 mAdc)
(VCC = 3.0 Vdc, IC = 10 mAdc,
IB1 = IB2 = 1.0 mAdc)

Fall Time
1. Pulse Test: Pulse Width

24

v 300 ms; Duty Cycle v 2.0%.

2N3903
2N3904

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N3903 2N3904
DUTY CYCLE = 2%
300 ns

+3 V
+10.9 V

10 < t1 < 500 ms


275

t1

DUTY CYCLE = 2%

+3 V
+10.9 V
275

10 k

10 k
0

0.5 V

CS < 4 pF*

< 1 ns

CS < 4 pF*

1N916
9.1 V

< 1 ns

* Total shunt capacitance of test jig and connectors

Figure 1. Delay and Rise Time


Equivalent Test Circuit

Figure 2. Storage and Fall Time


Equivalent Test Circuit

TYPICAL TRANSIENT CHARACTERISTICS

TJ = 25C
TJ = 125C
10

5000
2000

5.0

Q, CHARGE (pC)

CAPACITANCE (pF)

VCC = 40 V
IC/IB = 10

3000

7.0

Cibo
3.0
Cobo

2.0

1000
700
500
QT

300
200

QA

1.0
0.1

0.2 0.3

0.5 0.7 1.0

2.0 3.0

5.0 7.0 10

20 30 40

100
70
50

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

REVERSE BIAS VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 3. Capacitance

Figure 4. Charge Data

Motorola SmallSignal Transistors, FETs and Diodes Device Data

200

25

2N3903 2N3904
500

500
IC/IB = 10

100
70

tr @ VCC = 3.0 V

50
30
20

VCC = 40 V
IC/IB = 10

300
200
t r, RISE TIME (ns)

TIME (ns)

300
200

40 V

100
70
50
30
20

15 V
10
7
5

10
2.0 V

td @ VOB = 0 V
1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

Figure 5. Turn On Time

Figure 6. Rise Time

IC/IB = 10

200

500

ts = ts 1/8 tf
IB1 = IB2

VCC = 40 V
IB1 = IB2

300
200
IC/IB = 20
t f , FALL TIME (ns)

t s , STORAGE TIME (ns)

IC/IB = 20

200

IC, COLLECTOR CURRENT (mA)

500
300
200

7
5

100
70
IC/IB = 20

50

IC/IB = 10

30
20

100
70
50

10

10

7
5

7
5

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

200

IC/IB = 10

30
20

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 7. Storage Time

Figure 8. Fall Time

200

TYPICAL AUDIO SMALL SIGNAL CHARACTERISTICS


NOISE FIGURE VARIATIONS
(VCE = 5.0 Vdc, TA = 25C, Bandwidth = 1.0 Hz)

SOURCE RESISTANCE = 200


IC = 1.0 mA

NF, NOISE FIGURE (dB)

10

f = 1.0 kHz

SOURCE RESISTANCE = 1.0 k


IC = 50 A

0
0.1

SOURCE RESISTANCE = 500


IC = 100 A

0.2

0.4

1.0

2.0

IC = 1.0 mA

12

SOURCE RESISTANCE = 200


IC = 0.5 mA

26

14

W
NF, NOISE FIGURE (dB)

12

IC = 0.5 mA

10

IC = 50 mA

8
IC = 100 mA

6
4
2

4.0

10

20

40

100

0.1

0.2

0.4

1.0

2.0

4.0

10

20

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (k OHMS)

Figure 9.

Figure 10.

40

100

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N3903 2N3904
h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25C)
100
hoe, OUTPUT ADMITTANCE (m mhos)

h fe , CURRENT GAIN

300

200

100
70
50

30

0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

50

20
10
5

2
1

10

0.1

0.2

Figure 11. Current Gain

h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

h ie , INPUT IMPEDANCE (k OHMS)

10
5.0

2.0
1.0
0.5

0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

10

5.0

10

Figure 12. Output Admittance

20

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

10
7.0
5.0
3.0
2.0

1.0
0.7
0.5

10

0.1

Figure 13. Input Impedance

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

Figure 14. Voltage Feedback Ratio

h FE, DC CURRENT GAIN (NORMALIZED)

TYPICAL STATIC CHARACTERISTICS


2.0
TJ = +125C

VCE = 1.0 V

+25C

1.0
0.7

55C

0.5
0.3
0.2

0.1
0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

20

30

50

70

100

200

IC, COLLECTOR CURRENT (mA)

Figure 15. DC Current Gain

Motorola SmallSignal Transistors, FETs and Diodes Device Data

27

VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

2N3903 2N3904
1.0
TJ = 25C
0.8

IC = 1.0 mA

10 mA

30 mA

100 mA

0.6

0.4

0.2

0
0.01

0.02

0.03

0.05

0.07

0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

IB, BASE CURRENT (mA)

Figure 16. Collector Saturation Region

1.0

1.2
TJ = 25C
VBE(sat) @ IC/IB =10

0.8
VBE @ VCE =1.0 V
0.6
0.4
VCE(sat) @ IC/IB =10

28

qVC FOR VCE(sat)


0

55C TO +25C

0.5
55C TO +25C
1.0
+25C TO +125C

qVB FOR VBE(sat)

1.5

0.2
0

+25C TO +125C

0.5
COEFFICIENT (mV/ C)

V, VOLTAGE (VOLTS)

1.0

1.0

2.0

5.0

10

20

50

100

200

2.0

20

40

60

80

100

120

140

160

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 17. ON Voltages

Figure 18. Temperature Coefficients

180 200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors

2N3905
2N3906*

PNP Silicon

*Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER
1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

200

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Power Dissipation @ TA = 60C

PD

250

mW

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS(1)
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage (2)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Base Cutoff Current


(VCE = 30 Vdc, VEB = 3.0 Vdc)

IBL

50

nAdc

Collector Cutoff Current


(VCE = 30 Vdc, VEB = 3.0 Vdc)

ICEX

50

nAdc

Characteristic

OFF CHARACTERISTICS

1. Indicates Data in addition to JEDEC Requirements.


2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

29

2N3905 2N3906
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

2N3905
2N3906

30
60

(IC = 1.0 mAdc, VCE = 1.0 Vdc)

2N3905
2N3906

40
80

(IC = 10 mAdc, VCE = 1.0 Vdc)

2N3905
2N3906

50
100

150
300

(IC = 50 mAdc, VCE = 1.0 Vdc)

2N3905
2N3906

30
60

(IC = 100 mAdc, VCE = 1.0 Vdc)

2N3905
2N3906

15
30

0.25
0.4

0.65

0.85
0.95

200
250

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT
2N3905
2N3906

MHz

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

4.5

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

10.0

pF

0.5
2.0

8.0
12

0.1
0.1

5.0
10

50
100

200
400

1.0
3.0

40
60

5.0
4.0

td

35

ns

tr

35

ns

2N3905
2N3906

ts

200
225

ns

2N3905
2N3906

tf

60
75

ns

Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
Voltage Feedback Ratio
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
SmallSignal Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
Output Admittance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
Noise Figure
(IC = 100 mAdc, VCE = 5.0 Vdc, RS = 1.0 k , f = 1.0 kHz)

hie
2N3905
2N3906

X 10 4

hre
2N3905
2N3906
hfe
2N3905
2N3906

mmhos

hoe
2N3905
2N3906
NF
2N3905
2N3906

dB

SWITCHING CHARACTERISTICS
Delay Time
Rise Time

((VCC = 3.0 Vdc, VBE = 0.5 Vdc,


IC = 10 mAdc, IB1 = 1.0 mAdc)

Storage Time

Fall Time

1. Pulse Test: Pulse Width

210

3 0 Vdc,
Vdc IC = 10 mAdc
(VCC = 3.0
mAdc,
IB1 = IB2 = 1.0 mAd

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N3905 2N3906
3V

3V
< 1 ns

+9.1 V
275

275

< 1 ns
10 k

+0.5 V

10 k
0
CS < 4 pF*

10.6 V

10 < t1 < 500 ms

300 ns
DUTY CYCLE = 2%

CS < 4 pF*

1N916

DUTY CYCLE = 2%

t1

10.9 V

* Total shunt capacitance of test jig and connectors

Figure 1. Delay and Rise Time


Equivalent Test Circuit

Figure 2. Storage and Fall Time


Equivalent Test Circuit

TYPICAL TRANSIENT CHARACTERISTICS

10

5000

7.0

3000
2000
Cobo

5.0

Q, CHARGE (pC)

CAPACITANCE (pF)

TJ = 25C
TJ = 125C

Cibo
3.0
2.0

VCC = 40 V
IC/IB = 10

1000
700
500
300
200

QT
QA

1.0
0.1

0.2 0.3

0.5 0.7 1.0


2.0 3.0 5.0 7.0 10
REVERSE BIAS (VOLTS)

100
70
50

20 30 40

1.0

2.0 3.0

Figure 3. Capacitance

5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)

200

Figure 4. Charge Data

500

500
IC/IB = 10

300
200

VCC = 40 V
IB1 = IB2

300
200

tr @ VCC = 3.0 V
15 V

30
20

t f , FALL TIME (ns)

TIME (ns)

IC/IB = 20
100
70
50

100
70
50
30
20

IC/IB = 10

40 V
10
7
5

2.0 V
td @ VOB = 0 V
1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

200

10
7
5

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. Turn On Time

Figure 6. Fall Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

200

211

2N3905 2N3906
TYPICAL AUDIO SMALL SIGNAL CHARACTERISTICS
NOISE FIGURE VARIATIONS
(VCE = 5.0 Vdc, TA = 25C, Bandwidth = 1.0 Hz)

NF, NOISE FIGURE (dB)

SOURCE RESISTANCE = 200


IC = 1.0 mA

12

f = 1.0 kHz

4.0
SOURCE RESISTANCE = 200
IC = 0.5 mA
3.0

SOURCE RESISTANCE = 2.0 k


IC = 50 A

2.0
SOURCE RESISTANCE = 2.0 k
IC = 100 A

1.0

0
0.1

0.2

0.4

IC = 1.0 mA

10
NF, NOISE FIGURE (dB)

5.0

IC = 0.5 mA
8
6
IC = 50 mA

IC = 100 mA

1.0 2.0 4.0


10
f, FREQUENCY (kHz)

20

40

100

0.1

0.2

0.4
1.0 2.0
4.0
10
20
Rg, SOURCE RESISTANCE (k OHMS)

Figure 7.

40

100

Figure 8.

h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25C)
100

hoe, OUTPUT ADMITTANCE ( mhos)

h fe , DC CURRENT GAIN

300

200

100
70
50

70
50
30
20

10
7

30

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

0.1

0.2

Figure 9. Current Gain


h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

h ie , INPUT IMPEDANCE (k OHMS)

10
7.0
5.0
3.0
2.0
1.0
0.7
0.5

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

Figure 11. Input Impedance

212

5.0 7.0 10

Figure 10. Output Admittance

20

0.3
0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

10
7.0
5.0
3.0
2.0

1.0
0.7
0.5

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

Figure 12. Voltage Feedback Ratio

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N3905 2N3906

h FE, DC CURRENT GAIN (NORMALIZED)

TYPICAL STATIC CHARACTERISTICS


2.0
TJ = +125C

VCE = 1.0 V

+25C

1.0
0.7

55C

0.5
0.3
0.2

0.1
0.1

0.2

0.3

0.5

0.7

1.0

2.0
3.0
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

20

30

70

50

100

200

VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

Figure 13. DC Current Gain


1.0
TJ = 25C
0.8

IC = 1.0 mA

10 mA

30 mA

100 mA

0.6

0.4

0.2

0
0.01

0.02

0.03

0.05

0.07

0.1

0.2
0.3
0.5
IB, BASE CURRENT (mA)

0.7

1.0

2.0

3.0

5.0

7.0

10

Figure 14. Collector Saturation Region

TJ = 25C

V, VOLTAGE (VOLTS)

0.8

q V , TEMPERATURE COEFFICIENTS (mV/ C)

1.0
VBE(sat) @ IC/IB = 10
VBE @ VCE = 1.0 V

0.6

0.4
VCE(sat) @ IC/IB = 10

0.2

1.0

2.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

100

200

Figure 15. ON Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0
0.5

qVC FOR VCE(sat)

+25C TO +125C

55C TO +25C

0.5
+25C TO +125C
1.0
55C TO +25C

qVB FOR VBE(sat)

1.5
2.0

20

40

60
80 100 120 140
IC, COLLECTOR CURRENT (mA)

160

180 200

Figure 16. Temperature Coefficients

213

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors

2N4123
2N4124

NPN Silicon

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

2N4123

2N4124

Unit

Collector Emitter Voltage

VCEO

30

25

Vdc

Collector Base Voltage

VCBO

40

30

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

200

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

30
25

40
30

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)

ICBO

50

nAdc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

50

nAdc

Characteristic

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IE = 0)
Collector Base Breakdown Voltage
(IC = 10 mAdc, IE = 0)
Emitter Base Breakdown Voltage
(IE = 10 mAdc, IC = 0)

V(BR)CEO
2N4123
2N4124

Vdc

V(BR)CBO
2N4123
2N4124

Vdc

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.

214

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N4123 2N4124
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

2N4123
2N4124

50
120

150
360

2N4123
2N4124

25
60

Unit

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 2.0 mAdc, VCE = 1.0 Vdc)

hFE

(IC = 50 mAdc, VCE = 1.0 Vdc)

Collector Emitter Saturation Voltage(1)


(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

0.3

Vdc

Base Emitter Saturation Voltage(1)


(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

0.95

Vdc

250
300

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT

MHz

2N4123
2N4124

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

8.0

pF

CollectorBase Capacitance
(IE = 0, VCB = 5.0 V, f = 1.0 MHz)

Ccb

4.0

pF

50
120

200
480

2N4123
2N4124

2.5
3.0

2N4123
2N4124

50
120

200
480

6.0
5.0

SmallSignal Current Gain


(IC = 2.0 mAdc, VCE = 10 Vdc, RS = 10 k ohm, f = 1.0 kHz)
Current Gain High Frequency
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

hfe
2N4123
2N4124

|hfe|

(IC = 2.0 mAdc, VCE = 10 V, f = 1.0 kHz)


(IC = 2.0 mAdc, VCE = 10 V, f = 1.0 kHz)
Noise Figure
(IC = 100 Adc, VCE = 5.0 Vdc, RS = 1.0 k ohm,
f = 1.0 kHz)

NF

dB

2N4123
2N4124

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.

200

10

100

5.0
TIME (ns)

CAPACITANCE (pF)

7.0

Cibo

3.0

ts

70
50

td

30

tf

Cobo

2.0

VCC = 3 V
IC/IB = 10
VEB(off) = 0.5 V

10.0
7.0
1.0
0.1

tr

20

0.2 0.3

0.5 0.7 1.0


2.0 3.0 5.0 7.0 10
REVERSE BIAS VOLTAGE (VOLTS)

20 30 40

Figure 1. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5.0

1.0

2.0 3.0

5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)

200

Figure 2. Switching Times

215

2N4123 2N4124
AUDIO SMALLSIGNAL CHARACTERISTICS
NOISE FIGURE
(VCE = 5 Vdc, TA = 25C)
Bandwidth = 1.0 Hz
SOURCE RESISTANCE = 200
IC = 1 mA

NF, NOISE FIGURE (dB)

10

SOURCE RESISTANCE = 200


IC = 0.5 mA

8
6

14

f = 1 kHz

SOURCE RESISTANCE = 1 k
IC = 50 A

4
2

SOURCE RESISTANCE = 500


IC = 100 A

0
0.1

0.2

0.4

IC = 1 mA

12
NF, NOISE FIGURE (dB)

12

1
2
4
10
f, FREQUENCY (kHz)

IC = 0.5 mA

10

IC = 50 mA

IC = 100 mA

6
4
2

20

40

0
0.1

100

0.2

0.4

Figure 3. Frequency Variations

40

1.0 2.0
4.0
10
20
RS, SOURCE RESISTANCE (k)

100

Figure 4. Source Resistance

h PARAMETERS
(VCE = 10 V, f = 1 kHz, TA = 25C)
100
50

hoe, OUTPUT ADMITTANCE ( mhos)

hfe , CURRENT GAIN

300

200

100
70
50

20
10
5

2
1

30
0.1

0.2

0.5
1.0
2.0
IC, COLLECTOR CURRENT (mA)

5.0

10

0.1

0.2

Figure 5. Current Gain

h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

hie , INPUT IMPEDANCE (k )

10

5.0

10

10

10
5.0
2.0
1.0
0.5

7.0
5.0
3.0
2.0

1.0
0.7
0.5

0.1

0.2

0.5
1.0
2.0
IC, COLLECTOR CURRENT (mA)

Figure 7. Input Impedance

216

5.0

Figure 6. Output Admittance

20

0.2

0.5
1.0
2.0
IC, COLLECTOR CURRENT (mA)

5.0

10

0.1

0.2

0.5
1.0
2.0
IC, COLLECTOR CURRENT (mA)

Figure 8. Voltage Feedback Ratio

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N4123 2N4124
STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN (NORMALIZED)

2.0
TJ = +125C
1.0

VCE = 1 V

+25C

0.7
55C

0.5
0.3
0.2

0.1
0.1

0.2

0.3

0.5

0.7

1.0

2.0
3.0
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

20

30

50

70

100

200

VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

Figure 9. DC Current Gain

1.0
TJ = 25C
0.8
IC = 1 mA

10 mA

30 mA

100 mA

0.6

0.4

0.2

0
0.01

0.02

0.03

0.05

0.07

0.1

0.2
0.3
0.5
IB, BASE CURRENT (mA)

0.7

1.0

2.0

3.0

5.0

7.0

10

Figure 10. Collector Saturation Region

V, TEMPERATURE COEFFICIENTS (mV/C)

1.2
TJ = 25C
VBE(sat) @ IC/IB = 10

V, VOLTAGE (VOLTS)

1.0
0.8

VBE @ VCE = 1 V
0.6
0.4
VCE(sat) @ IC/IB = 10
0.2
0
1.0

2.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

100

200

Figure 11. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0
0.5

+25C to +125C

qVC for VCE(sat)

55C to +25C

0.5
55C to +25C

1.0

+25C to +125C

qVB for VBE(sat)

1.5
2.0

20

40

60
80 100 120 140 160
IC, COLLECTOR CURRENT (mA)

180 200

Figure 12. Temperature Coefficients

217

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistor

2N4125

PNP Silicon

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

30

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

Collector Current Continuous

IC

200

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

30

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

30

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

4.0

Vdc

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)

ICBO

50

nAdc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

50

nAdc

Characteristic

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width 300 ms, Duty Cycle = 2.0%.

REV 2

218

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N4125
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

50
25

150

0.4

0.95

200

10

4.5

50

200

2.0

5.0

Unit

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 2.0 mAdc, VCE = 1.0 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage(1)


(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage(1)


(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

CollectorBase Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Ccb

SmallSignal Current Gain


(IC = 2.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hfe

Current Gain High Frequency


(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

|hfe|

Noise Figure
(IC = 100 Adc, VCE = 5.0 Vdc, RS = 1.0 k ohm, f = 1.0 kHz)

NF

MHz
pF
pF

dB

1. Pulse Test: Pulse Width 300 ms, Duty Cycle = 2.0%.

200

10

ts

7.0
5.0

Cibo

3.0

td

70

Cobo
TIME (ns)

CAPACITANCE (pF)

100
50

tr
tf

30
20

2.0
VCC = 3.0 V
IC/IB = 10
VBE(off) = 0.5 V

10.0
7.0
1.0
0.1

0.2 0.3

0.5

1.0
2.0 3.0 5.0
REVERSE BIAS (VOLTS)

10

20 30 50

Figure 1. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5.0

1.0

2.0 3.0

5.0
10
20 30
50
IC, COLLECTOR CURRENT (mA)

100

200

Figure 2. Switching Times

219

2N4125
AUDIO SMALLSIGNAL CHARACTERISTICS
NOISE FIGURE
VCE = 5.0 Vdc, TA = 25C
Bandwidth = 1.0 Hz
SOURCE RESISTANCE = 200
IC = 1 mA

NF, NOISE FIGURE (dB)

4.0

12

f = 1 kHz

SOURCE RESISTANCE = 200


IC = 0.5 mA

3.0
SOURCE RESISTANCE = 2 k
IC = 50 A

2.0

SOURCE RESISTANCE = 2 k
IC = 100 A

1.0

0
0.1

0.2

0.4

1.0 2.0 4.0


10
f, FREQUENCY (kHz)

IC = 1 mA

10
NF, NOISE FIGURE (dB)

5.0

20

40

IC = 0.5 mA
8.0
6.0
4.0

IC = 50 mA

2.0

IC = 100 mA

0
0.1

100

0.2

0.4

Figure 3. Frequency Variations

40

1.0 2.0
4.0
10
20
RS, SOURCE RESISTANCE (k)

100

Figure 4. Source Resistance

h PARAMETERS
VCE = 10 V, f = 1 kHz, TA = 25C
300

hoe, OUTPUT ADMITTANCE ( mhos)

100

hfe , CURRENT GAIN

200

100
70
50

30

70
50
30
20

10
7.0
5.0

0.1

0.2

0.5
1.0
2.0
IC, COLLECTOR CURRENT (mA)

5.0

10

0.1

0.2

Figure 5. Current Gain

h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

h ie , INPUT IMPEDANCE (k )

10

5.0

10

10

10
5.0
2.0
1.0
0.5

0.1

0.2

0.5
1.0
2.0
IC, COLLECTOR CURRENT (mA)

Figure 7. Input Impedance

220

5.0

Figure 6. Output Admittance

20

0.2

0.5
1.0
2.0
IC, COLLECTOR CURRENT (mA)

5.0

10

7.0
5.0
3.0
2.0

1.0
0.7
0.5
0.1

0.2

0.5
1.0
2.0
IC, COLLECTOR CURRENT (mA)

Figure 8. Voltage Feedback Ratio

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N4125
STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN (NORMALIZED)

2.0
TJ = +125C

VCE = 1 V

+25C

1.0
0.7

55C

0.5
0.3
0.2

0.1
0.1

0.2

0.3

0.5

0.7

1.0

2.0
3.0
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

20

30

50

70

100

200

VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

Figure 9. DC Current Gain

1.0
TJ = 25C
0.8
IC = 1 mA

10 mA

30 mA

100 mA

0.6

0.4

0.2

0
0.01

0.02

0.03

0.05

0.07

0.1

0.2
0.3
0.5
IB, BASE CURRENT (mA)

0.7

1.0

2.0

3.0

5.0

7.0

10

Figure 10. Collector Saturation Region

TJ = 25C

V, VOLTAGE (VOLTS)

0.8

V, TEMPERATURE COEFFICIENTS (mV/C)

1.0
VBE(sat) @ IC/IB = 10
VBE @ VCE = 1 V

0.6

0.4

0.2

VCE(sat) @ IC/IB = 10

0
1.0

2.0

50
5.0 10
20
IC, COLLECTOR CURRENT (mA)

100

200

Figure 11. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0
0.5

qVC for VCE(sat)

+25C to +125C
55C to +25C

0
0.5

+25C to +125C

qVS for VBE(sat)

1.0

55C to +25C

1.5
2.0

20

40

60
80 100 120 140 160
IC, COLLECTOR CURRENT (mA)

180 200

Figure 12. Temperature Coefficients

221

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistor

2N4264

NPN Silicon

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

15

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

200

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

357

C/W

Thermal Resistance, Junction to Case

RqJC

125

C/W

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

15

30

6.0

0.1
10

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

Base Cutoff Current


(VCE = 12 Vdc, VEB(off) = 0.25 Vdc)
(VCE = 12 Vdc, VEB(off) = 0.25 Vdc, TA = 100C)

IBEV

Collector Cutoff Current


(VCE = 12 Vdc, VEB(off) = 0.25 Vdc)

ICEX

Vdc
Vdc
Vdc
Adc

nAdc

REV 2

222

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N4264
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

25
40
20
40
30
20

160

0.22
0.35

0.65
0.75

0.8
0.95

fT

300

MHz

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

8.0

pF

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz, IE = 0)

Cobo

4.0

pF

( CC = 10 Vdc, VEB(off) = 2.0 Vdc,


(V
IC = 100 mAdc, IB1 = 10 mAdc) (Fig. 1, Test Condition C)

td

8.0

ns

tr

15

ns

VCC = 10 Vdc, (IC = 10 mAdc, for ts)


(IC = 100 mA for tf)
(IB1 = 10 mA) (IB2 = 10 mA) (Fig. 1, Test Condition C)

ts

20

ns

tf

15

ns

TurnOn Time

(VCC = 3.0 Vdc, VEB(off) = 1.5 Vdc,


IC = 10 mAdc, IB1 = 3.0 mAdc) (Fig. 1, Test Condition A)

ton

25

ns

TurnOff Time

(VCC = 3.0 Vdc, IC = 10 mAdc,


IB1 = 3.0 mAdc, IB2 = 1.5 mAdc) (Fig. 1, Test Condition A)

toff

35

ns

Storage Time

(VCC = 10 Vdc, IC = 10 mA,


IB1 = IB2 = 10 mAdc) (Fig. 1, Test Condition B)

ts

20

ns

Total Control Charge

(VCC = 3.0 Vdc, IC = 10 mAdc, IB = mAdc)


(Fig. 3, Test Condition A)

QT

80

pC

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc, TA = 55C)
(IC = 30 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)(1)
(IC = 200 mAdc, VCE = 1.0 Vdc)(1)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 100 mAdc, IB = 10 mAdc)(1)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 100 mAdc, IB = 10 mAdc)(1)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.

Figure 1. Switching Time Equivalent Test Circuit


Test
Condition IC

VCC

RS

mA

10

10

100

RC CS(max) VBE(off)

pF

3300 270

1.5

10

560 960

10

560

12

2.0

96

V1

V2

V3

10.55 4.15 10.70

4.65 6.55

6.35 4.65 6.55

Motorola SmallSignal Transistors, FETs and Diodes Device Data

V1

ton
t1

V3
0
V2

0
VEB(off)
< 2 ns

toff
t1

VCC
RC
RB
CS
< 2 ns

PULSE WIDTH (t1) = 300 ns DUTY CYCLE = 2%

223

2N4264
CURRENT GAIN CHARACTERISTICS
100
2N4264
VCE = 1 V

h FE, DC CURRENT GAIN

70
TJ = 125C

50

25C
15C

30

55C
20

10
1.0

2.0

3.0

5.0

7.0

10
20
IC, COLLECTOR CURRENT (mA)

30

50

70

100

200

Figure 2. Minimum Current Gain

270
t1

3V
8 pF

+10 V
V
0

C < COPT
CS < 4 pF

<1 ns 9.2 k
PULSE WIDTH (t1) = 5 s

DUTY CYCLE = 2%

C=0

COPT
TIME

Figure 3. QT Test Circuit

Figure 4. TurnOff Waveform


NOTE 1

When a transistor is held in a conductive state by a base current, IB,


a charge, QS, is developed or stored in the transistor. QS may be
written: QS = Q1 + QV + QX.
Q1 is the charge required to develop the required collector current.
This charge is primarily a function of alpha cutoff frequency. QV is the
charge required to charge the collectorbase feedback capacity. QX is
excess charge resulting from overdrive, i.e., operation in saturation.
The charge required to turn a transistor on to the edge of saturation
is the sum of Q1 and QV which is defined as the active region charge,
QA. QA = IB1tr when the transistor is driven by a constant current step
IC
.
(IB1) and IB1 < <
hFE

224

If IB were suddenly removed, the transistor would continue to


conduct until QS is removed from the active regions through an
external path or through internal recombination. Since the internal
recombination time is long compared to the ultimate capability of a
transistor, a charge, QT, of opposite polarity, equal in magnitude, can
be stored on an external capacitor, C, to neutralize the internal charge
and considerably reduce the turnoff time of the transistor. Figure 3
shows the test circuit and Figure 4 the turnoff waveform. Given QT
from Figure 13, the external C for worstcase turnoff in any circuit is:
C = QT/V, where V is defined in Figure 3.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N4264
ON CONDITION CHARACTERISTICS

VCE, MAXIMUM COLLECTOREMITTER


VOLTAGE (VOLTS)

1.0
2N4264
TJ = 25C

0.8
IC = 10 mA

50 mA

200 mA

100 mA

0.6

0.4

0.2

0.1

0.2

0.3

0.5

0.7

1.0

2.0
3.0
IB, BASE CURRENT (mA)

5.0

7.0

10

20

30

50

Figure 5. Collector Saturation Region

1.0

IC/IB = 10
TJ = 25C

V, TEMPERATURE COEFFICIENTS (mV/C)

Vsat , SATURATION VOLTAGE (VOLTS)

1.2
MAX VBE(sat)
MIN VBE(sat)

0.8
0.6

MAX VCE(sat)

0.4
0.2
0
1.0

2.0 3.0

50 70 100
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

200

Figure 6. Saturation Voltage Limits

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0
0.5

qVC for VCE(sat)

(25C to 125C)
( 55C to 25C)

0
0.5

(25C to 125C)
1.0

qVB for VBE

( 55C to 25C)

1.5
2.0

40

80
120
160
IC, COLLECTOR CURRENT (mA)

200

Figure 7. Temperature Coefficients

225

2N4264
DYNAMIC CHARACTERISTICS
200

200
VCC = 10 V
TJ = 25C

100
70

70
t r , RISE TIME (ns)

t d, DELAY TIME (ns)

100

IC/IB = 10
TJ = 25C
TJ = 125C

td @ VEB(off) = 3 V

50
30

2V

20
0V

10

VCC = 10 V

50
30
20

VCC = 3 V

10
7.0

7.0

5.0

5.0
1.0

2.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

100

200

1.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

2.0

Figure 8. Delay Time

200

IC/IB = 10

20

10
ts

VCC = 10 V
TJ = 25C
TJ = 125C

100
t f , FALL TIME (ns)

t s , STORAGE TIME (ns)

IC/IB = 20

30

TJ = 25C
TJ = 125C

7.0

^ ts 1/8 tf

70
50
30

IC/IB = 20

20
IC/IB = 10

10

IB1 = IB2

7.0

5.0

5.0
1.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

2.0

100

200

1.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

2.0

Figure 10. Storage Time

100

200

5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)

200

Figure 11. Fall Time

10

1000
MAX
TYP

7.0

IC/IB = 10
TJ = 25C
TJ = 125C

700
500

Cibo
Q, CHARGE (pC)

CAPACITANCE (pF)

200

Figure 9. Rise Time

50

5.0

Cobo

3.0

300
200
QT
100

VCC = 3 V

70
50

VCC = 10 V

30
2.0
0.1

0.2

0.5
1.0
2.0
REVERSE BIAS (Vdc)

5.0

Figure 12. Junction Capacitance

226

100

10

20

QA

VCC = 3 V
1.0

2.0 3.0

Figure 13. Maximum Charge Data

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors

2N4400
2N4401*

NPN Silicon

*Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

600

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 0.1 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 0.1 mAdc, IC = 0)

V(BR)EBO

6.0

Vdc

Base Cutoff Current


(VCE = 35 Vdc, VEB = 0.4 Vdc)

IBEV

0.1

Adc

Collector Cutoff Current


(VCE = 35 Vdc, VEB = 0.4 Vdc)

ICEX

0.1

Adc

Characteristic

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

227

2N4400 2N4401
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)

2N4401

hFE
20

(IC = 1.0 mAdc, VCE = 1.0 Vdc)

2N4400
2N4401

20
40

(IC = 10 mAdc, VCE = 1.0 Vdc)

2N4400
2N4401

40
80

(IC = 150 mAdc, VCE = 1.0 Vdc)

2N4400
2N4401

50
100

150
300

(IC = 500 mAdc, VCE = 2.0 Vdc)

2N4400
2N4401

20
40

Collector Emitter Saturation Voltage (IC = 150 mAdc, IB = 15 mAdc)


Collector Emitter Saturation Voltage (IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

0.4
0.75

Vdc

Base Emitter Saturation Voltage (IC = 150 mAdc, IB = 15 mAdc)


Base Emitter Saturation Voltage (IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

0.75

0.95
1.2

Vdc

200
250

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 20 mAdc, VCE = 10 Vdc, f = 100 MHz)

fT
2N4400
2N4401

MHz

CollectorBase Capacitance (VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Ccb

6.5

pF

EmitterBase Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Ceb

30

pF

0.5
1.0

7.5
15

0.1

8.0

20
40

250
500

hoe

1.0

30

mhos

( CC = 30 Vdc, VBE = 2.0 Vdc,


(V
IC = 150 mAdc, IB1 = 15 mAdc)

td

15

ns

tr

20

ns

( CC = 30 Vdc, IC = 150 mAdc,


(V
IB1 = IB2 = 15 mAdc)

ts

225

ns

tf

30

ns

Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hie
2N4400
2N4401

Voltage Feedback Ratio (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
SmallSignal Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hre

k ohms

X 104

hfe
2N4400
2N4401

Output Admittance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time

1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

SWITCHING TIME EQUIVALENT TEST CIRCUITS


+ 30 V

+ 30 V
+16 V
0
2.0 V

1.0 to 100 s,
DUTY CYCLE 2.0%

200

+16 V

1.0 to 100 s,
DUTY CYCLE 2.0%

200

0
1.0 k
< 2.0 ns

CS* < 10 pF

1.0 k

14 V
< 20 ns

CS* < 10 pF

4.0 V
Scope rise time < 4.0 ns
*Total shunt capacitance of test jig connectors, and oscilloscope

Figure 1. TurnOn Time

228

Figure 2. TurnOff Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N4400 2N4401
TRANSIENT CHARACTERISTICS
25C

100C
10
7.0
5.0

30

10
7.0
5.0

QT

2.0
1.0
0.7
0.5
0.3
0.2

Ccb
3.0
2.0
0.1

VCC = 30 V
IC/IB = 10

3.0

Cobo

Q, CHARGE (nC)

CAPACITANCE (pF)

20

QA

0.1
0.2 0.3 0.5

2.0 3.0 5.0


10
1.0
REVERSE VOLTAGE (VOLTS)

20 30

50

10

200
50 70 100
30
IC, COLLECTOR CURRENT (mA)

20

Figure 3. Capacitances

100
IC/IB = 10

70

VCC = 30 V
IC/IB = 10

70
tr

50

50
tr @ VCC = 30 V
tr @ VCC = 10 V
td @ VEB = 2.0 V
td @ VEB = 0

30
20

t, TIME (ns)

t, TIME (ns)

500

Figure 4. Charge Data

100

tf

30
20

10

10

7.0

7.0

5.0

5.0
10

20

30

50

70

200

100

300

500

10

20

30

50

70

100

200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. TurnOn Time

Figure 6. Rise and Fall Times

300

300

500

100
ts = ts 1/8 tf
IB1 = IB2
IC/IB = 10 to 20

VCC = 30 V
IB1 = IB2

70
50
t f , FALL TIME (ns)

200
t s, STORAGE TIME (ns)

300

100
70

IC/IB = 20

30
20

IC/IB = 10

10

50

7.0
30

5.0
10

20

30

50

70

100

200

300

500

10

20

30

50

70

100

200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 7. Storage Time

Figure 8. Fall Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

300

500

229

2N4400 2N4401
SMALLSIGNAL CHARACTERISTICS
NOISE FIGURE
VCE = 10 Vdc, TA = 25C
Bandwidth = 1.0 Hz
10

10
IC = 1.0 mA, RS = 150
IC = 500 A, RS = 200
IC = 100 A, RS = 2.0 k
IC = 50 A, RS = 4.0 k

8.0
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

8.0

f = 1.0 kHz
RS = OPTIMUM
RS = SOURCE
RS = RESISTANCE

6.0

4.0

2.0

IC = 50 A
IC = 100 A
IC = 500 A
IC = 1.0 mA

6.0

4.0

2.0

0
0.01 0.02 0.05 0.1 0.2

0
0.5 1.0 2.0 5.0

10

20

50

100

50

100 200

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (OHMS)

Figure 9. Frequency Effects

Figure 10. Source Resistance Effects

h PARAMETERS
VCE = 10 Vdc, f = 1.0 kHz, TA = 25C
This group of graphs illustrates the relationship between
selected from both the 2N4400 and 2N4401 lines, and the
hfe and other h parameters for this series of transistors. To
same units were used to develop the correspondingly numobtain these curves, a highgain and a lowgain unit were
bered curves on each graph.
50 k

hfe , CURRENT GAIN

200

100
70
2N4401 UNIT 1
2N4401 UNIT 2
2N4400 UNIT 1
2N4400 UNIT 2

50
30
20
0.1

0.2

0.3

0.5 0.7 1.0

2.0

3.0

hie , INPUT IMPEDANCE (OHMS)

300

2.0 k
1.0 k

0.1

0.2

0.3

0.5 0.7

1.0

2.0

3.0

Figure 11. Current Gain

Figure 12. Input Impedance

5.0 7.0 10

100
hoe, OUTPUT ADMITTANCE (m mhos)

h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

5.0 k

IC, COLLECTOR CURRENT (mA)

10

2N4401 UNIT 1
2N4401 UNIT 2
2N4400 UNIT 1
2N4400 UNIT 2

3.0
2.0
1.0
0.7
0.5
0.3

230

10 k

IC, COLLECTOR CURRENT (mA)

7.0
5.0

0.2
0.1

20 k

500

5.0 7.0 10

2N4401 UNIT 1
2N4401 UNIT 2
2N4400 UNIT 1
2N4400 UNIT 2

0.2

0.3

0.5 0.7 1.0

2.0

3.0

5.0 7.0 10

50

20
10
5.0

2N4401 UNIT 1
2N4401 UNIT 2
2N4400 UNIT 1
2N4400 UNIT 2

2.0
1.0
0.1

0.2

0.3

0.5 0.7 1.0

2.0 3.0

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 13. Voltage Feedback Ratio

Figure 14. Output Admittance

5.0 7.0 10

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N4400 2N4401
STATIC CHARACTERISTICS

h FE, NORMALIZED CURRENT GAIN

3.0
VCE = 1.0 V
VCE = 10 V

2.0

TJ = 125C
1.0
25C
0.7
0.5

55C

0.3
0.2
0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mA)

30

50

70

100

200

300

500

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 15. DC Current Gain

1.0
TJ = 25C

0.8

0.6

IC = 1.0 mA

10 mA

100 mA

500 mA

0.4

0.2

0
0.01

0.02 0.03

0.2

0.05 0.07 0.1

0.3

0.5 0.7 1.0


IB, BASE CURRENT (mA)

2.0

3.0

5.0 7.0

10

20

30

50

Figure 16. Collector Saturation Region

1.0

+ 0.5
TJ = 25C
VBE(sat) @ IC/IB = 10

0.6

VBE @ VCE = 10 V

0.4

0.2

VCE(sat) @ IC/IB = 10

0.5

50
1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

0.5
1.0
1.5

qVB for VBE

2.0

0
0.1 0.2

qVC for VCE(sat)

0
COEFFICIENT (mV/ C)

VOLTAGE (VOLTS)

0.8

100 200

500

Figure 17. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2.5
0.1 0.2

0.5

50
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

100 200

500

Figure 18. Temperature Coefficients

231

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors

2N4402
2N4403*

PNP Silicon

*Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

600

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 0.1 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 0.1 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Base Cutoff Current


(VCE = 35 Vdc, VEB = 0.4 Vdc)

IBEV

0.1

Adc

Collector Cutoff Current


(VCE = 35 Vdc, VEB = 0.4 Vdc)

ICEX

0.1

Adc

Characteristic

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

232

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N4402 2N4403
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)

2N4403

hFE
30

(IC = 1.0 mAdc, VCE = 1.0 Vdc)

2N4402
2N4403

30
60

(IC = 10 mAdc, VCE = 1.0 Vdc)

2N4402
2N4403

50
100

(IC = 150 mAdc, VCE = 2.0 Vdc)(1)

2N4402
2N4403

50
100

150
300

Both

20

0.4
0.75

0.75

0.95
1.3

150
200

(IC = 500 mAdc, VCE = 2.0 Vdc)(1)


Collector Emitter Saturation Voltage(1)
(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)
Base Emitter Saturation Voltage(1)
(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

Vdc

VBE(sat)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 20 mAdc, VCE = 10 Vdc, f = 100 MHz)

fT
2N4402
2N4403

MHz

CollectorBase Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Ccb

8.5

EmitterBase Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Ceb

30

Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hie
2N4402
2N4403

pF
pF
ohms

750
1.5 k

7.5 k
15 k

0.1

8.0

30
60

250
500

hoe

1.0

100

mhos

( CC = 30 Vdc, VBE = + 2.0 Vdc,


(V
IC = 150 mAdc, IB1 = 15 mAdc)

td

15

ns

tr

20

ns

( CC = 30 Vdc, IC = 150 mAdc,


(V
IB1 = 15 mA, IB2 = 15 mA)

ts

225

ns

tf

30

ns

Voltage Feedback Ratio (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
SmallSignal Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hre

X 104

hfe
2N4402
2N4403

Output Admittance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time

1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

SWITCHING TIME EQUIVALENT TEST CIRCUIT


30 V

30 V
200

< 2 ns
+2 V

+14 V
0

0
1.0 k
16 V

200

< 20 ns

10 to 100 s,
DUTY CYCLE = 2%

CS* < 10 pF

1.0 k
16 V

CS* < 10 pF

1.0 to 100 s,
DUTY CYCLE = 2%

+ 4.0 V
Scope rise time < 4.0 ns
*Total shunt capacitance of test jig connectors, and oscilloscope

Figure 1. TurnOn Time


Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 2. TurnOff Time


233

2N4402 2N4403
TRANSIENT CHARACTERISTICS
25C

100C
10
7.0
5.0

30

VCC = 30 V
IC/IB = 10

Ceb
3.0
Q, CHARGE (nC)

CAPACITANCE (pF)

20

10
7.0
Ccb

5.0

2.0
1.0
0.7
0.5

QT

0.3

QA

0.2
2.0
0.1

0.1
0.2 0.3

20

2.0 3.0 5.0 7.0 10


0.5 0.7 1.0
REVERSE VOLTAGE (VOLTS)

30

10

20

Figure 3. Capacitances

300

500

Figure 4. Charge Data

100

100
IC/IB = 10

70

70

VCC = 30 V
IC/IB = 10

50

50
tr @ VCC = 30 V
tr @ VCC = 10 V
td @ VBE(off) = 2 V
td @ VBE(off) = 0

30
20

t r , RISE TIME (ns)

t, TIME (ns)

200
30
50 70 100
IC, COLLECTOR CURRENT (mA)

30
20

10

10

7.0

7.0

5.0

5.0
10

20

30

50

70

200

100

300

500

10

20

30

50

70

100

200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. TurnOn Time

Figure 6. Rise Time

300

500

200

t s, STORAGE TIME (ns)

IC/IB = 10
100
IC/IB = 20

70
50
IB1 = IB2
ts = ts 1/8 tf
30
20

10

20

30

50

70

100

200

300

500

IC, COLLECTOR CURRENT (mA)

Figure 7. Storage Time

234

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N4402 2N4403
SMALLSIGNAL CHARACTERISTICS
NOISE FIGURE
VCE = 10 Vdc, TA = 25C
Bandwidth = 1.0 Hz
10

10

f = 1 kHz
8
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

8
IC = 1.0 mA, RS = 430
IC = 500 A, RS = 560
IC = 50 A, RS = 2.7 k
IC = 100 A, RS = 1.6 k

RS = OPTIMUM SOURCE RESISTANCE

0
0.01 0.02 0.05 0.1 0.2

IC = 50 A
100 A
500 A
1.0 mA

0
0.5 1.0 2.0 5.0

10

20

50

100

50

100

200

500

1k

2k

5k

10 k 20 k

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (OHMS)

Figure 8. Frequency Effects

Figure 9. Source Resistance Effects

50 k

h PARAMETERS
VCE = 10 Vdc, f = 1.0 kHz, TA = 25C
This group of graphs illustrates the relationship between
selected from both the 2N4402 and 2N4403 lines, and the
hfe and other h parameters for this series of transistors. To
same units were used to develop the correspondingly
obtain these curves, a highgain and a lowgain unit were
numbered curves on each graph.
100 k

700

50 k

hfe , CURRENT GAIN

500
300
200
2N4403 UNIT 1
2N4403 UNIT 2
2N4402 UNIT 1
2N4402 UNIT 2

100
70
50

hie , INPUT IMPEDANCE (OHMS)

1000

2N4403 UNIT 1
2N4403 UNIT 2
2N4402 UNIT 1
2N4402 UNIT 2

20 k
10 k
5k
2k
1k
500
200

30
0.1

0.2

0.3

0.5 0.7 1.0

2.0

3.0

100

5.0 7.0 10

0.3

0.5 0.7 1.0

2.0

3.0

Figure 10. Current Gain

Figure 11. Input Impedance

5.0 7.0

10

500

10

hoe, OUTPUT ADMITTANCE (m mhos)

h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

0.2

IC, COLLECTOR CURRENT (mAdc)

20
2N4403 UNIT 1
2N4403 UNIT 2
2N4402 UNIT 1
2N4402 UNIT 2

5.0
2.0
1.0
0.5
0.2
0.1
0.1

0.1

IC, COLLECTOR CURRENT (mAdc)

0.2

0.3

0.5 0.7 1.0

2.0

3.0

5.0 7.0 10

100
50
20
10

2N4403 UNIT 1
2N4403 UNIT 2
2N4402 UNIT 1
2N4402 UNIT 2

5.0
2.0
1.0
0.1

0.2

0.3

0.5 0.7 1.0

2.0

3.0

IC, COLLECTOR CURRENT (mAdc)

IC, COLLECTOR CURRENT (mAdc)

Figure 12. Voltage Feedback Ratio

Figure 13. Output Admittance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5.0 7.0 10

235

2N4402 2N4403
STATIC CHARACTERISTICS
3.0
VCE = 1.0 V
VCE = 10 V

h FE, NORMALIZED CURRENT GAIN

2.0

TJ = 125C
25C

1.0
55C

0.7
0.5
0.3
0.2
0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mA)

30

70

50

100

200

300

500

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 14. DC Current Gain

1.0
0.8

0.6
IC = 1.0 mA

10 mA

100 mA

500 mA

0.4

0.2

0
0.005

0.01

0.02

0.03

0.05 0.07 0.1

0.2

0.3
0.5 0.7 1.0
IB, BASE CURRENT (mA)

2.0

3.0

5.0

7.0

10

20

30

50

Figure 15. Collector Saturation Region

0.5

TJ = 25C

0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(sat) @ VCE = 10 V

COEFFICIENT (mV/ C)

VOLTAGE (VOLTS)

1.0

0.4

0.2

qVC for VCE(sat)

0.5
1.0
1.5

qVS for VBE

2.0
VCE(sat) @ IC/IB = 10

0
0.1 0.2

0.5

50 100 200
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

Figure 16. On Voltages

236

500

2.5
0.1 0.2

0.5

50 100 200
1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

500

Figure 17. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistor
NPN Silicon

2N4410
COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

80

Vdc

Collector Base Voltage

VCBO

120

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

250

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

80

Vdc

Collector Emitter Breakdown Voltage


(IC = 500 Adc, VBE = 5.0 Vdc, RBE = 8.2 k ohms)

V(BR)CEX

120

Vdc

Collector Base Breakdown Voltage


(IC = 10 Adc, IE = 0)

V(BR)CBO

120

Vdc

Emitter Base Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

0.01
1.0

0.1

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 100 Vdc, IE = 0)
(VCB = 100 Vdc, IE = 0, TA = 100C)

ICBO

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

Adc

Adc

1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

237

2N4410
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

60
60

400

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 1.0 mAdc, IB = 0.1 mAdc)

VCE(sat)

0.2

Vdc

Base Emitter Saturation Voltage


(IC = 1.0 mAdc, IB = 0.1 mAdc)

VBE(sat)

0.8

Vdc

Base Emitter On Voltage


(IC = 1.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

0.8

Vdc

fT

60

300

MHz

CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz, emitter guarded)

Ccb

12

pF

EmitterBase Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz, collector guarded)

Ceb

50

pF

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(2)
(IC = 10 mAdc, VCE = 10 Vdc, f = 20 MHz)

2. fT = |hfe| ftest.
500
300
h FE, DC CURRENT GAIN

200

VCE = 1.0 V
VCE = 5.0 V

TJ = 125C
25C

100
55C
50
30
20
10
7.0
5.0
0.1

0.2

0.3

0.5

0.7

1.0

3.0
2.0
5.0
7.0
IC, COLLECTOR CURRENT (mA)

10

20

30

50

70

100

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

1.0
0.9
0.8
0.7
0.6

IC = 1.0 mA

10 mA

100 mA

30 mA

0.5
0.4
0.3
0.2
0.1
0
0.005

0.01

0.02

0.05

0.1

0.2
0.5
1.0
IB, BASE CURRENT (mA)

2.0

5.0

10

20

50

Figure 2. Collector Saturation Region

238

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N4410
101
IC, COLLECTOR CURRENT ( A)

VCE = 30 V
100
TJ = 125C

101
102

75C

103

REVERSE

FORWARD

25C

104
105
0.4

IC = ICES

0.2
0
0.1
0.2
0.3
0.4
0.1
VBE, BASEEMITTER VOLTAGE (VOLTS)

0.3

0.5

0.6

Figure 3. Collector CutOff Region

1.0

2.5
V, TEMPERATURE COEFFICIENT (mV/ C)

TJ = 25C

V, VOLTAGE (VOLTS)

0.8
VBE(sat) @ IC/IB = 10
0.6

0.4

0.2
VCE(sat) @ IC/IB = 10
0
0.1

0.2 0.3 0.5


1.0 2.0 3.0 5.0 10 20 30
IC, COLLECTOR CURRENT (mA)

50

2.0

1.0

qVC for VCE(sat)

0.5
0
0.5
1.0

qVB for VBE(sat)

1.5
2.0
2.5
0.1

100

TJ = 55C to +135C

1.5

0.2 0.3 0.5 1.0 2.0 3.0 5.0


10 20 30
IC, COLLECTOR CURRENT (mA)

Figure 4. On Voltages

100
10 s
INPUT PULSE

tr, tf 10 ns
DUTY CYCLE = 1.0%

0.25 F

3.0 k

RC

RB

Vout

5.1 k
Vin

100

1N914

Values Shown are for IC @ 10 mA

Figure 6. Switching Time Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

TJ = 25C

30
C, CAPACITANCE (pF)

VCC
30 V

VBB
8.8 V

Vin

100

Figure 5. Temperature Coefficients

100
70
50
10.2 V

50

20
10
Cibo

7.0
5.0

Cobo

3.0
2.0
1.0
0.2

0.3

0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

VR, REVERSE VOLTAGE (VOLTS)

Figure 7. Capacitances

239

2N4410
1000

5000
IC/IB = 10
TJ = 25C

500

1000

tr @ VCC = 30 V

100
50

td @ VEB(off) = 1.0 V

30

VCC = 120 V

300

ts @ VCC = 120 V

100

1.0

20 30
2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA)

Figure 8. TurnOn Time

240

500

200

20
10
0.2 0.3 0.5

IC/IB = 10
TJ = 25C

tf @ VCC = 30 V
t, TIME (ns)

t, TIME (ns)

200

2000

tr @ VCC = 120 V

300

tf @ VCC = 120 V

3000

50

100

200

50
0.2 0.3 0.5

20 30 50
1.0 2.0 3.0 5.0
10
IC, COLLECTOR CURRENT (mA)

100

200

Figure 9. TurnOff Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistor

2N5087

PNP Silicon

COLLECTOR
3

Motorola Preferred Device

2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

50

Vdc

Collector Base Voltage

VCBO

50

Vdc

Emitter Base Voltage

VEBO

3.0

Vdc

Collector Current Continuous

IC

50

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

50

Vdc

Collector Base Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

50

Vdc

Collector Cutoff Current


(VCB = 35 Vdc, IE = 0)

ICBO

50

nAdc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

50

nAdc

Characteristic

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

(Replaces 2N5086/D)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

241

2N5087
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

250
250
250

800

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 Adc, VCE = 5.0 Vdc)
(IC = 1.0 mAdc, VCE = 5.0 Vdc)
(IC = 10 mAdc, VCE = 5.0 Vdc)(1)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.3

Vdc

Base Emitter On Voltage


(IC = 1.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

0.85

Vdc

fT

40

MHz

CollectorBase Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Ccb

4.0

pF

SmallSignal Current Gain


(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

hfe
250

900

Noise Figure
(IC = 20 Adc, VCE = 5.0 Vdc, RS = 1.0 k, f = 1.0 kHz)
(IC = 100 Adc, VCE = 5.0 Vdc, RS = 3.0 k, f = 1.0 kHz)

NF

2.0
2.0

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 500 Adc, VCE = 5.0 Vdc, f = 20 MHz)

dB

1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

242

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5087
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
10
7.0
IC = 10 A

5.0

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

1.0
7.0
5.0

BANDWIDTH = 1.0 Hz
RS 0

30 A
3.0

100 A
300 A

1.0 mA

2.0

BANDWIDTH = 1.0 Hz
RS
IC = 1.0 mA

3.0
2.0

300 A

1.0
0.7
0.5

100 A
30 A

0.3
0.2

1.0

10 A

0.1
10

20

50

100 200
500 1.0 k
f, FREQUENCY (Hz)

2.0 k

5.0 k

10

10 k

20

50

Figure 1. Noise Voltage

100 200
500 1.0 k 2.0 k
f, FREQUENCY (Hz)

5.0 k

10 k

Figure 2. Noise Current

NOISE FIGURE CONTOURS

1.0 M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100

RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

(VCE = 5.0 Vdc, TA = 25C)

5.0 dB
10

20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

1.0 M
500 k

20 k
10 k

RS , SOURCE RESISTANCE (OHMS)

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100

500 700 1.0 k

5.0 dB
10

Figure 3. Narrow Band, 100 Hz

1.0 M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k

20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700 1.0 k

Figure 4. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is Defined as:

20 k
10 k

NF
0.5 dB

5.0 k
2.0 k
1.0 k
500

1.0 dB
2.0 dB
3.0 dB
5.0 dB

200
100
10

20

30

50 70 100

200 300

2 2 12
S ) In RS
+ 20 log10 en2 ) 4KTR
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

500 700 1.0 k

IC, COLLECTOR CURRENT (A)

Figure 5. Wideband
Motorola SmallSignal Transistors, FETs and Diodes Device Data

243

2N5087
TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C
25C

200

55C
100
80
60

VCE = 1.0 V
VCE = 10 V

40
0.003 0.005

0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3 0.5 0.7 1.0


2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0

10

20

30

50 70 100

100

1.0
TA = 25C
IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. DC Current Gain

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%
300 A

200 A
150 A

40

100 A
50 A

20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
0.8
VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.5 1.0
2.0
5.0
10
20
IC, COLLECTOR CURRENT (mA)

Figure 9. On Voltages

244

40

Figure 8. Collector Characteristics

1.4

0.2

250 A

60

Figure 7. Collector Saturation Region

0.1

IB = 400 A
350 A

50

100

1.6
*APPLIES for IC/IB hFE/2
0.8
*qVC for VCE(sat)

25C to 125C

0
55C to 25C
0.8
25C to 125C
1.6

2.4
0.1

qVB for VBE


0.2

55C to 25C

0.5
1.0 2.0
5.0
10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 10. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5087
TYPICAL DYNAMIC CHARACTERISTICS
500
300
200

200

100
70
50
30
tr

20
10
7.0
5.0
1.0

100
70
50

tf

30

td @ VBE(off) = 0.5 V

20

2.0

3.0

50 70

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 12. TurnOff Time

500

10
TJ = 25C

TJ = 25C

7.0
VCE = 20 V

300

Cib
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 11. TurnOn Time

5.0 V
200

100

5.0

3.0
2.0

Cob

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.1

0.2

0.5

1.0

2.0

5.0

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 13. CurrentGain Bandwidth Product

Figure 14. Capacitance

7.0
5.0
3.0
2.0
1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

10

0.2
0.1

10

20

50

200

20
hie , INPUT IMPEDANCE (k )

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

ts

300
t, TIME (ns)

t, TIME (ns)

1000
700
500

VCC = 3.0 V
IC/IB = 10
TJ = 25C

100
70
50

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

30
20
10
7.0
5.0
3.0

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 15. Input Impedance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 16. Output Admittance

245

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

2N5087
1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

1.0

t2
2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 17. Thermal Response

IC, COLLECTOR CURRENT (mA)

400
200

100 s

100

TC = 25C
dc

60

1.0 s

TA = 25C

40

dc

20

TJ = 150C

10

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

6.0
4.0

10 s

1.0 ms

2.0

4.0
6.0 8.0 10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 18 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 17. At high case or ambient temperatures, thermal
limitations will reduce the power than can be handled to values less
than the limitations imposed by second breakdown.

40

Figure 18. ActiveRegion Safe Operating Area

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 V
103
ICEO

102
101

ICBO
AND
ICEX @ VBE(off) = 3.0 V

100
101
102
40 20

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

A train of periodical power pulses can be represented by the model


as shown in Figure 19. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 17 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 17 by the
steady state value RJA.
Example:
The 2N5087 is dissipating 2.0 watts peak under the following
conditions:
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
Using Figure 17 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
The peak rise in junction temperature is therefore
T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.
For more information, see AN569.

Figure 19. Typical Collector Leakage Current

246

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

2N5088
2N5089

NPN Silicon

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

2N5088

2N5089

Unit

Collector Emitter Voltage

VCEO

30

25

Vdc

Collector Base Voltage

VCBO

35

30

Vdc

Emitter Base Voltage

VEBO

3.0

Vdc

Collector Current Continuous

IC

50

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case

Max

Unit

RqJA(1)

200

C/W

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Characteristic

Min

Max

30
25

35
30

50
50

50
100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(2)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)
Collector Cutoff Current
(VCB = 20 Vdc, IE = 0)
(VCB = 15 Vdc, IE = 0)

V(BR)CEO
2N5088
2N5089

Vdc

V(BR)CBO
2N5088
2N5089

Vdc

ICBO
2N5088
2N5089

Emitter Cutoff Current


(VEB(off) = 3.0 Vdc, IC = 0)
(VEB(off) = 4.5 Vdc, IC = 0)

nAdc

IEBO

nAdc

1. RJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

247

2N5088 2N5089
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

2N5088
2N5089

300
400

900
1200

(IC = 1.0 mAdc, VCE = 5.0 Vdc)

2N5088
2N5089

350
450

(IC = 10 mAdc, VCE = 5.0 Vdc)(2)

2N5088
2N5089

300
400

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 Adc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.5

Vdc

Base Emitter On Voltage


(IC = 10 mAdc, VCE = 5.0 Vdc)(2)

VBE(on)

0.8

Vdc

fT

50

MHz

CollectorBase Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Ccb

4.0

pF

EmitterBase Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Ceb

10

pF

350
450

1400
1800

3.0
2.0

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 500 Adc, VCE = 5.0 Vdc, f = 20 MHz)

SmallSignal Current Gain


(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

hfe
2N5088
2N5089

Noise Figure
(IC = 100 Adc, VCE = 5.0 Vdc, RS = 1.0 k,
f = 1.0 kHz)

NF
2N5088
2N5089

dB

2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

RS

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

248

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5088 2N5089
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
NOISE VOLTAGE
30

30
BANDWIDTH = 1.0 Hz

BANDWIDTH = 1.0 Hz
20

RS 0

IC = 10 mA

en , NOISE VOLTAGE (nV)

en , NOISE VOLTAGE (nV)

20

3.0 mA

10

1.0 mA

7.0
5.0

RS 0
f = 10 Hz
10

100 Hz

7.0
10 kHz

1.0 kHz

5.0

300 A
3.0
10

20

50 100 200

3.0
0.01 0.02

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

Figure 2. Effects of Frequency

IC = 10 mA
3.0 mA
1.0 mA
300 A
100 A

0.3
0.2
RS 0

0.1
10

20

10 A
50 100 200

10

16

3.0

1.0
0.7
0.5

5.0

20

BANDWIDTH = 1.0 Hz

2.0

0.05 0.1 0.2


0.5 1.0
2.0
IC, COLLECTOR CURRENT (mA)

Figure 3. Effects of Collector Current

NF, NOISE FIGURE (dB)

In, NOISE CURRENT (pA)

10
7.0
5.0

100 kHz

BANDWIDTH = 10 Hz to 15.7 kHz


12
500 A

8.0

IC = 1.0 mA

100 A
10 A

4.0

30 A
0
10

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

20

Figure 4. Noise Current

50 100 200 500 1 k 2 k


5 k 10 k 20 k 50 k 100 k
RS, SOURCE RESISTANCE (OHMS)

Figure 5. Wideband Noise Figure


100 Hz NOISE DATA
20

BANDWIDTH = 1.0 Hz

IC = 10 mA
16

100 A

100
70
50

3.0 mA
1.0 mA

30

300 A

20
10
7.0
5.0

30 A
10 A

NF, NOISE FIGURE (dB)

VT, TOTAL NOISE VOLTAGE (nV)

300
200

IC = 10 mA

3.0 mA
1.0 mA

12

300 A
8.0
100 A
30 A

4.0

10 A

BANDWIDTH = 1.0 Hz
0

3.0
10

20

50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k


RS, SOURCE RESISTANCE (OHMS)

Figure 6. Total Noise Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k


RS, SOURCE RESISTANCE (OHMS)

Figure 7. Noise Figure

249

h FE, DC CURRENT GAIN (NORMALIZED)

2N5088 2N5089
4.0
3.0
VCE = 5.0 V
2.0

TA = 125C
25C

1.0
55C

0.7
0.5
0.4
0.3
0.2
0.01

0.02

0.03

0.05

0.1

0.2
0.3
0.5
IC, COLLECTOR CURRENT (mA)

1.0

2.0

3.0

5.0

10

Figure 8. DC Current Gain

0.4
RVBE, BASEEMITTER
TEMPERATURE COEFFICIENT (mV/ C)

1.0
TJ = 25C
V, VOLTAGE (VOLTS)

0.8

0.6

VBE @ VCE = 5.0 V

0.4

0.2

0.8

1.2

TJ = 25C to 125C

1.6

2.0
55C to 25C

VCE(sat) @ IC/IB = 10
0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

2.4
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10
IC, COLLECTOR CURRENT (mA)

100

8.0

C, CAPACITANCE (pF)

6.0

TJ = 25C
Cob

4.0
3.0

Ceb

Cib

Ccb

2.0

1.0
0.8
0.1

0.2

1.0
2.0
5.0
0.5
10
20
VR, REVERSE VOLTAGE (VOLTS)

Figure 11. Capacitance

250

50 100

Figure 10. Temperature Coefficients

50

100

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 9. On Voltages

20

500

300
200

100
VCE = 5.0 V
TJ = 25C

70
50
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 12. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

2N5209
2N5210

NPN Silicon

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

50

Vdc

Collector Base Voltage

VCBO

50

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

Collector Current Continuous

IC

50

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

50

Vdc

Collector Base Breakdown Voltage


(IC = 0.1 mAdc, IE = 0)

V(BR)CBO

50

Vdc

Collector Cutoff Current


(VCB = 35 Vdc, IE = 0)

ICBO

50

nAdc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

50

nAdc

Characteristic

OFF CHARACTERISTICS

Motorola SmallSignal Transistors, FETs and Diodes Device Data

251

2N5209 2N5210
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

2N5209
2N5210

100
200

300
600

(IC = 1.0 mAdc, VCE = 5.0 Vdc)

2N5209
2N5210

150
250

(IC = 10 mAdc, VCE = 5.0 Vdc)(1)

2N5209
2N5210

150
250

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 Adc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.7

Vdc

Base Emitter On Voltage


(IC = 1.0 mAdc, VCE = 5.0 mAdc)

VBE(on)

0.85

Vdc

fT

30

MHz

Ccb

4.0

pF

150
250

600
900

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 500 Adc, VCE = 5.0 Vdc, f = 20 MHz)
CollectorBase Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)
SmallSignal Current Gain
(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

hfe
2N5209
2N5210

Noise Figure
(IC = 20 Adc, VCE = 5.0 Vdc, RS = 22 k,
f = 1.0 kHz)

2N5209
2N5210

NF

3.0
2.0

dB

(IC = 20 Adc, VCE = 5.0 Vdc, RS = 10 k,


f = 1.0 kHz)

2N5209
2N5210

4.0
3.0

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.

RS

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

252

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5209 2N5210
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
NOISE VOLTAGE
30

30
BANDWIDTH = 1.0 Hz

BANDWIDTH = 1.0 Hz
20

RS 0

IC = 10 mA

en , NOISE VOLTAGE (nV)

en , NOISE VOLTAGE (nV)

20

3.0 mA

10

1.0 mA

7.0
5.0

RS 0
f = 10 Hz
10

100 Hz

7.0
10 kHz

1.0 kHz

5.0

300 A
3.0
10

20

50 100 200

3.0
0.01 0.02

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

Figure 2. Effects of Frequency

IC = 10 mA
3.0 mA
1.0 mA
300 A
100 A

0.3
0.2
RS 0

0.1
10

20

10 A
50 100 200

10

16

3.0

1.0
0.7
0.5

5.0

20

BANDWIDTH = 1.0 Hz

2.0

0.05 0.1 0.2


0.5 1.0
2.0
IC, COLLECTOR CURRENT (mA)

Figure 3. Effects of Collector Current

NF, NOISE FIGURE (dB)

In, NOISE CURRENT (pA)

10
7.0
5.0

100 kHz

BANDWIDTH = 10 Hz to 15.7 kHz


12
500 A

8.0

IC = 1.0 mA

100 A
10 A

4.0

30 A
0
10

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

20

Figure 4. Noise Current

50 100 200 500 1 k 2 k


5 k 10 k 20 k 50 k 100 k
RS, SOURCE RESISTANCE (OHMS)

Figure 5. Wideband Noise Figure


100 Hz NOISE DATA
20

BANDWIDTH = 1.0 Hz

IC = 10 mA
16

100 A

100
70
50

3.0 mA
1.0 mA

30

300 A

20
10
7.0
5.0

30 A
10 A

NF, NOISE FIGURE (dB)

VT, TOTAL NOISE VOLTAGE (nV)

300
200

IC = 10 mA

3.0 mA
1.0 mA

12

300 A
8.0
100 A
30 A

4.0

10 A

BANDWIDTH = 1.0 Hz
0

3.0
10

20

50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k


RS, SOURCE RESISTANCE (OHMS)

Figure 6. Total Noise Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k


RS, SOURCE RESISTANCE (OHMS)

Figure 7. Noise Figure

253

h FE, DC CURRENT GAIN (NORMALIZED)

2N5209 2N5210
4.0
3.0
VCE = 5.0 V
2.0

TA = 125C
25C

1.0
55C

0.7
0.5
0.4
0.3
0.2
0.01

0.02

0.03

0.05

0.1

0.2
0.3
0.5
IC, COLLECTOR CURRENT (mA)

1.0

2.0

3.0

5.0

10

Figure 8. DC Current Gain

0.4
RVBE, BASEEMITTER
TEMPERATURE COEFFICIENT (mV/ C)

1.0
TJ = 25C
V, VOLTAGE (VOLTS)

0.8

0.6

VBE @ VCE = 5.0 V

0.4

0.2

0.8

1.2

TJ = 25C to 125C

1.6

2.0
55C to 25C

VCE(sat) @ IC/IB = 10
0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

2.4
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10
IC, COLLECTOR CURRENT (mA)

100

8.0

C, CAPACITANCE (pF)

6.0

TJ = 25C
Cob

4.0
3.0

Ceb

Cib

Ccb

2.0

1.0
0.8
0.1

0.2

1.0
2.0
5.0
0.5
10
20
VR, REVERSE VOLTAGE (VOLTS)

Figure 11. Capacitance

254

50 100

Figure 10. Temperature Coefficients

50

100

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 9. On Voltages

20

500

300
200

100
VCE = 5.0 V
TJ = 25C

70
50
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 12. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

2N5400
2N5401*

PNP Silicon

*Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER
1
2

MAXIMUM RATINGS
Symbol

2N5400

2N5401

Unit

Collector Emitter Voltage

Rating

VCEO

120

150

Vdc

Collector Base Voltage

VCBO

130

160

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

600

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Characteristic

Min

Max

Unit

120
150

130
160

5.0

Vdc

100
50
100
50

nAdc

50

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
2N5400
2N5401
V(BR)CBO
2N5400
2N5401

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 100 Vdc, IE = 0)
(VCB = 120 Vdc, IE = 0)
(VCB = 100 Vdc, IE = 0, TA = 100C)
(VCB = 120 Vdc, IE = 0, TA = 100C)

Vdc

V(BR)EBO

Vdc

ICBO
2N5400
2N5401
2N5400
2N5401

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

Adc
nAdc

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.


Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

255

2N5400 2N5401
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

2N5400
2N5401

30
50

(IC = 10 mAdc, VCE = 5.0 Vdc)

2N5400
2N5401

40
60

180
240

(IC = 50 mAdc, VCE = 5.0 Vdc)

2N5400
2N5401

40
50

0.2
0.5

1.0
1.0

100
100

400
300

6.0

30
40

200
200

8.0

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 1.0 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)

fT
2N5400
2N5401

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
SmallSignal Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
Noise Figure
(IC = 250 Adc, VCE = 5.0 Vdc, RS = 1.0 k, f = 1.0 kHz)

Cobo

MHz

hfe
2N5400
2N5401
NF

pF

dB

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.

256

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5400 2N5401
200
150
h FE, CURRENT GAIN

TJ = 125C
100
25C

70
50

55C
VCE = 1.0 V
VCE = 5.0 V

30
20
0.1

0.2

0.3

0.5

1.0

2.0
3.0
5.0
IC, COLLECTOR CURRENT (mA)

20

10

30

50

100

10

20

50

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

1.0
0.9
0.8
0.7
0.6
IC = 1.0 mA

0.5

10 mA

30 mA

100 mA

0.4
0.3
0.2
0.1
0
0.005

0.01

0.02

0.05

0.1

0.2

0.5
1.0
IB, BASE CURRENT (mA)

2.0

5.0

Figure 2. Collector Saturation Region

IC, COLLECTOR CURRENT ( A)

103
102

VCE = 30 V
IC = ICES

101
TJ = 125C
100
75C
101
102

REVERSE
25C

103
0.3

0.2

FORWARD

0.1
0
0.1
0.2 0.3 0.4 0.5
VBE, BASEEMITTER VOLTAGE (VOLTS)

0.6

0.7

Figure 3. Collector CutOff Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

257

2N5400 2N5401
1.0

V, TEMPERATURE COEFFICIENT (mV/ C)

TJ = 25C

0.9
V, VOLTAGE (VOLTS)

0.8
0.7
VBE(sat) @ IC/IB = 10

0.6
0.5
0.4
0.3
0.2

VCE(sat) @ IC/IB = 10

0.1
0
0.1

0.2 0.3 0.5

1.0 2.0 3.0 5.0


10
20 30
IC, COLLECTOR CURRENT (mA)

50

2.5
1.5
1.0
0.5

VC for VCE(sat)

0
0.5
1.0
1.5

VB for VBE(sat)

2.0
2.5
0.1

100

TJ = 55C to 135C

2.0

0.2 0.3 0.5 1.0 2.0 3.0 5.0


10
20 30
IC, COLLECTOR CURRENT (mA)

Figure 4. On Voltages

10.2 V

10 s
INPUT PULSE
tr, tf 10 ns
DUTY CYCLE = 1.0%

0.25 F

3.0 k

RC
Vout

RB
5.1 k

Vin

100

C, CAPACITANCE (pF)

100
70
50

VCC
30 V

100

TJ = 25C

30
Cibo

20
10
7.0
5.0

Cobo

3.0

1N914

2.0
1.0
0.2

Values Shown are for IC @ 10 mA

0.3

2.0 3.0
5.0 7.0
0.5 0.7 1.0
VR, REVERSE VOLTAGE (VOLTS)

Figure 6. Switching Time Test Circuit

1000
700
500

20

Figure 7. Capacitances

tr @ VCC = 120 V

1000
700
500

tr @ VCC = 30 V

200

t, TIME (ns)

t, TIME (ns)

10

2000
IC/IB = 10
TJ = 25C

300

100
70
50
td @ VBE(off) = 1.0 V
VCC = 120 V

20
10
0.2 0.3 0.5

1.0

2.0 3.0 5.0

10

20 30

50

300

IC/IB = 10
TJ = 25C

tf @ VCC = 120 V

tf @ VCC = 30 V

200

ts @ VCC = 120 V

100
70
50

30

258

100

Figure 5. Temperature Coefficients

VBB
+ 8.8 V
Vin

50

30
100

200

20
0.2 0.3 0.5

1.0

2.0 3.0 5.0

10

20 30

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 8. TurnOn Time

Figure 9. TurnOff Time

50

100

200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

2N5550
2N5551*

NPN Silicon

COLLECTOR
3

*Motorola Preferred Device

2
BASE
1
EMITTER

MAXIMUM RATINGS

Rating

Symbol

2N5550

2N5551

Unit

Collector Emitter Voltage

VCEO

140

160

Vdc

Collector Base Voltage

VCBO

160

180

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

600

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Characteristic

Min

Max

Unit

140
160

160
180

6.0

Vdc

100
50
100
50

nAdc

50

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 Adc, IE = 0 )

V(BR)CEO
2N5550
2N5551
V(BR)CBO
2N5550
2N5551

Emitter Base Breakdown Voltage


(IE = 10 Adc, IC = 0)
Collector Cutoff Current
(VCB = 100 Vdc, IE = 0)
(VCB = 120 Vdc, IE = 0)
(VCB = 100 Vdc, IE = 0, TA = 100C)
(VCB = 120 Vdc, IE = 0, TA = 100C)

Vdc

V(BR)EBO

Vdc

ICBO
2N5550
2N5551
2N5550
2N5551

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

Adc
nAdc

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.


Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

259

2N5550 2N5551
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

2N5550
2N5551

60
80

(IC = 10 mAdc, VCE = 5.0 Vdc)

2N5550
2N5551

60
80

250
250

(IC = 50 mAdc, VCE = 5.0 Vdc)

2N5550
2N5551

20
30

Both Types

0.15

2N5550
2N5551

0.25
0.20

Both Types

1.0

2N5550
2N5551

1.2
1.0

fT

100

300

MHz

Cobo

6.0

pF

30
20

50

200

10
8.0

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 1.0 mAdc, VCE = 5.0 Vdc)

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)
Base Emitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

hFE

VCE(sat)

Vdc

VBE(sat)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo
2N5550
2N5551

SmallSignal Current Gain


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
Noise Figure
(IC = 250 Adc, VCE = 5.0 Vdc, RS = 1.0 k,
f = 1.0 kHz)

hfe

pF

NF
2N5550
2N5551

dB

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.

260

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5550 2N5551
500
300
h FE, DC CURRENT GAIN

200

VCE = 1.0 V
VCE = 5.0 V

TJ = 125C
25C

100
55C
50
30
20
10
7.0
5.0
0.1

0.2

0.3

0.5

0.7

1.0

3.0
2.0
5.0
7.0
IC, COLLECTOR CURRENT (mA)

10

20

30

50

70

100

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

1.0
0.9
0.8
0.7
0.6

IC = 1.0 mA

10 mA

100 mA

30 mA

0.5
0.4
0.3
0.2
0.1
0
0.005

0.01

0.02

0.05

0.1

0.2
0.5
1.0
IB, BASE CURRENT (mA)

2.0

5.0

10

20

50

Figure 2. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

261

2N5550 2N5551
101
IC, COLLECTOR CURRENT ( A)

VCE = 30 V
100
TJ = 125C

101
102

75C

103

REVERSE

FORWARD

25C

104
105
0.4

IC = ICES

0.2
0
0.1
0.2
0.3
0.4
0.1
VBE, BASEEMITTER VOLTAGE (VOLTS)

0.3

0.5

0.6

Figure 3. Collector CutOff Region

1.0

2.5
V, TEMPERATURE COEFFICIENT (mV/ C)

TJ = 25C

V, VOLTAGE (VOLTS)

0.8
VBE(sat) @ IC/IB = 10
0.6

0.4

0.2
VCE(sat) @ IC/IB = 10
0
0.1

0.2 0.3 0.5


1.0 2.0 3.0 5.0 10 20 30
IC, COLLECTOR CURRENT (mA)

50

2.0

1.0

qVC for VCE(sat)

0.5
0
0.5
1.0

qVB for VBE(sat)

1.5
2.0
2.5
0.1

100

TJ = 55C to +135C

1.5

0.2 0.3 0.5 1.0 2.0 3.0 5.0


10 20 30
IC, COLLECTOR CURRENT (mA)

Figure 4. On Voltages

100
10 s
INPUT PULSE

tr, tf 10 ns
DUTY CYCLE = 1.0%

0.25 F

3.0 k

RC

RB

Vout

5.1 k
Vin

100

1N914

Values Shown are for IC @ 10 mA

Figure 6. Switching Time Test Circuit

262

TJ = 25C

30
C, CAPACITANCE (pF)

VCC
30 V

VBB
8.8 V

Vin

100

Figure 5. Temperature Coefficients

100
70
50
10.2 V

50

20
10
Cibo

7.0
5.0

Cobo

3.0
2.0
1.0
0.2

0.3

0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

VR, REVERSE VOLTAGE (VOLTS)

Figure 7. Capacitances

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5550 2N5551
1000

5000
IC/IB = 10
TJ = 25C

500

1000

tr @ VCC = 30 V

100
50

td @ VEB(off) = 1.0 V

30

VCC = 120 V

500
300

ts @ VCC = 120 V

200

20
10
0.2 0.3 0.5

IC/IB = 10
TJ = 25C

tf @ VCC = 30 V
t, TIME (ns)

t, TIME (ns)

200

2000

tr @ VCC = 120 V

300

tf @ VCC = 120 V

3000

100

1.0

20 30
2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA)

50

100

200

Figure 8. TurnOn Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

50
0.2 0.3 0.5

20 30 50
1.0 2.0 3.0 5.0
10
IC, COLLECTOR CURRENT (mA)

100

200

Figure 9. TurnOff Time

263

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Darlington Transistors

2N6426*
2N6427

NPN Silicon

*Motorola Preferred Device

COLLECTOR 3
BASE
2

EMITTER 1

1
2

MAXIMUM RATINGS
Symbol

Value

Unit

Collector Emitter Voltage

Rating

VCEO

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

12

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage (1)


(IC = 10 mAdc, VBE = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

12

Vdc

Collector Cutoff Current


(VCE = 25 Vdc, IB = 0)

ICES

1.0

mAdc

Collector Cutoff Current


(VCB= 30 Vdc, IE = 0)

ICBO

50

nAdc

Emitter Cutoff Current


(VEB= 10 Vdc, IC = 0)

IEBO

50

nAdc

Characteristic

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

264

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N6426 2N6427
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Typ

Max

2N6426
2N6427

20,000
10,000

200,000
100,000

(IC = 100 mAdc, VCE = 5.0 Vdc)

2N6426
2N6427

30,000
20,000

300,000
200,000

(IC = 500 mAdc, VCE = 5.0 Vdc)

2N6426
2N6427

20,000
14,000

200,000
140,000

0.71
0.9

1.2
1.5

Characteristic

Unit

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 10 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 50 mAdc, IB = 0.5 mAdc)
(IC = 500 mAdc, IB = 0.5 mAdc

VCE(sat)

Vdc

Base Emitter Saturation Voltage


(IC = 500 mAdc, IB = 0.5 mAdc)

VBE(sat)

1.52

2.0

Vdc

Base Emitter On Voltage


(IC = 50 mAdc, VCE = 5.0 Vdc)

VBE(on)

1.24

1.75

Vdc

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

5.4

7.0

pF

Input Capacitance
(VEB = 1.0 Vdc, IC = 0, f = 1.0 MHz)

Cibo

10

15

pF

100
50

2000
1000

20,000
10,000

1.5
1.3

2.4
2.4

SMALL SIGNAL CHARACTERISTICS

Input Impedance
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

hie
2N6426
2N6427

SmallSignal Current Gain


(IC = 10 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

hfe
2N6426
2N6427

Current Gain High Frequency


(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

|hfe|
2N6426
2N6427

Output Admittance
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

hoe

1000

mmhos

Noise Figure
(IC = 1.0 mAdc, VCE = 5.0 Vdc, RS = 100 k, f = 1.0 kHz)

NF

3.0

10

dB

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.


RS

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

Motorola SmallSignal Transistors, FETs and Diodes Device Data

265

2N6426 2N6427
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
500

2.0
BANDWIDTH = 1.0 Hz
RS 0
i n, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

200

BANDWIDTH = 1.0 Hz

100
10 A
50
100 A
20
IC = 1.0 mA
10

1.0
0.7
0.5

IC = 1.0 mA

0.3
0.2
100 A

0.1
0.07
0.05

10 A

0.03
0.02
10 20

5.0
10 20

50 100 200

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

50 k 100 k

50 100 200

50 k 100 k

Figure 3. Noise Current

14

200

BANDWIDTH = 10 Hz TO 15.7 kHz


12
BANDWIDTH = 10 Hz TO 15.7 kHz

100

NF, NOISE FIGURE (dB)

VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)

Figure 2. Noise Voltage

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

IC = 10 A

70
50

100 A

30
20

1.0 mA
10

1.0

2.0

10 A
8.0
100 A

6.0
4.0

IC = 1.0 mA

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

Figure 4. Total Wideband Noise Voltage

266

10

100
0

0
1.0

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

100
0

Figure 5. Wideband Noise Figure

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N6426 2N6427
SMALLSIGNALCHARACTERISTICS
20
|h fe |, SMALLSIGNAL CURRENT GAIN

4.0
TJ = 25C

C, CAPACITANCE (pF)

10
7.0

Cibo
Cobo

5.0

3.0

2.0
0.04

0.1

0.2
0.4
1.0 2.0 4.0
10
VR, REVERSE VOLTAGE (VOLTS)

20

2.0

1.0
0.8
0.6
0.4

0.2
0.5

40

200 k

hFE, DC CURRENT GAIN

TJ = 125C

25C

30 k
20 k
10 k
7.0 k
5.0 k

55C
VCE = 5.0 V

3.0 k
2.0 k
5.0 7.0

10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

RV, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.4
VBE(sat) @ IC/IB = 1000
1.2
VBE(on) @ VCE = 5.0 V
1.0

0.8
VCE(sat) @ IC/IB = 1000
0.6
20 30
50 70 100 200 300
IC, COLLECTOR CURRENT (mA)

0.5 10 20
50
100 200
IC, COLLECTOR CURRENT (mA)

500

TJ = 25C
2.5
IC = 10 mA

50 mA

250 mA

500 mA

2.0

1.5

1.0

0.5
0.1 0.2

0.5 1.0 2.0 5.0 10 20 50 100 200


IB, BASE CURRENT (A)

500 1000

Figure 9. Collector Saturation Region

1.6

10

2.0

3.0

Figure 8. DC Current Gain

5.0 7.0

1.0

Figure 7. High Frequency Current Gain

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. Capacitance

100 k
70 k
50 k

VCE = 5.0 V
f = 100 MHz
TJ = 25C

500

Figure 10. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0

2.0

*APPLIES FOR IC/IB hFE/3.0

25C TO 125C

*RqVC FOR VCE(sat)


55C TO 25C

3.0
25C TO 125C
4.0

qVB FOR VBE


5.0

55C TO 25C

6.0
5.0 7.0 10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

Figure 11. Temperature Coefficients

267

2N6426 2N6427

r(t), TRANSIENT THERMAL


RESISTANCE (NORMALIZED)

1.0
0.7
0.5

D = 0.5
0.2

0.3
0.2
0.1

0.05

SINGLE PULSE

0.1
0.07
0.05

SINGLE PULSE
ZJC(t) = r(t) RJC TJ(pk) TC = P(pk) ZJC(t)
ZJA(t) = r(t) RJA TJ(pk) TA = P(pk) ZJA(t)

0.03
0.02
0.01
0.1

0.2

0.5

1.0

2.0

10

5.0

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 12. Thermal Response

IC, COLLECTOR CURRENT (mA)

1.0 k
700
500
300
200

tP
TA = 25C

TC = 25C

100 s

PP

1.0 s

100
70
50

PP

t1

30

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

20
10
0.4 0.6

1/f
DUTY CYCLE

1.0
2.0
4.0 6.0
10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 13. Active Region Safe Operating Area

268

FIGURE A

1.0 ms

40

+ t1 f + ttP1

PEAK PULSE POWER = PP

Design Note: Use of Transient Thermal Resistance Data

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistors

NPN
2N6515
2N6517
PNP
2N6519
2N6520

COLLECTOR
3

COLLECTOR
3
2
BASE

2
BASE
NPN

PNP
1
EMITTER

1
EMITTER

MAXIMUM RATINGS
Symbol

2N6515

2N6519

2N6517
2N6520

Unit

Collector Emitter Voltage

VCEO

250

300

350

Vdc

Collector Base Voltage

VCBO

250

300

350

Vdc

Emitter Base Voltage


2N6515, 2N6516, 2N6517
2N6519, 2N6520

VEBO

Rating

Vdc
6.0
5.0

Base Current

IB

250

mAdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

Voltage and current are negative


for PNP transistors

1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Characteristic

Min

Max

250
300
350

250
300
350

6.0
5.0

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IB = 0)

Collector Base Breakdown Voltage


(IC = 100 Adc, IE = 0 )

Emitter Base Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)CEO
2N6515
2N6519
2N6517, 2N6520

Vdc

V(BR)CBO
2N6515
2N6519
2N6517, 2N6520

Vdc

V(BR)EBO
2N6515, 2N6517
2N6519, 2N6520

Vdc

1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

269

NPN 2N6515 2N6517 PNP 2N6519 2N6520


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

50
50
50

50
50

2N6515
2N6519
2N6517, 2N6520

35
30
20

(IC = 10 mAdc, VCE = 10 Vdc)

2N6515
2N6519
2N6517, 2N6520

50
45
30

(IC = 30 mAdc, VCE = 10 Vdc)

2N6515
2N6519
2N6517, 2N6520

50
45
30

300
270
200

(IC = 50 mAdc, VCE = 10 Vdc)

2N6515
2N6519
2N6517, 2N6520

45
40
20

220
200
200

(IC = 100 mAdc, VCE = 10 Vdc)

2N6515
2N6519
2N6517, 2N6520

25
20
15

0.30
0.35
0.50
1.0

0.75
0.85
0.90

Unit

OFF CHARACTERISTICS (Continued)


Collector Cutoff Current
(VCB = 150 Vdc, IE = 0)
(VCB = 200 Vdc, IE = 0)
(VCB = 250 Vdc, IE = 0)

2N6515
2N6519
2N6517, 2N6520

ICBO

Emitter Cutoff Current


(VEB = 5.0 Vdc, IC = 0)
(VEB = 4.0 Vdc, IC = 0)

2N6515, 2N6517
2N6519, 2N6520

nAdc

IEBO

nAdc

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 20 mAdc, IB = 2.0 mAdc)
(IC = 30 mAdc, IB = 3.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Vdc

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 20 mAdc, IB = 2.0 mAdc)
(IC = 30 mAdc, IB = 3.0 mAdc)

VBE(sat)

BaseEmitter On Voltage
(IC = 100 mAdc, VCE = 10 Vdc)

VBE(on)

2.0

Vdc

fT

40

200

MHz

Ccb

6.0

pF

80
100

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(1)
(IC = 10 mAdc, VCE = 20 Vdc, f = 20 MHz)
CollectorBase Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)
EmitterBase Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Ceb
2N6515, 2N6517
2N6519, 2N6520

pF

SWITCHING CHARACTERISTICS
TurnOn Time
(VCC = 100 Vdc, VBE(off) = 2.0 Vdc, IC = 50 mAdc, IB1 = 10 mAdc)

ton

200

TurnOff Time
(VCC = 100 Vdc, IC = 50 mAdc, IB1 = IB2 = 10 mAdc)

toff

3.5

1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

270

Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN 2N6515 2N6517 PNP 2N6519 2N6520


NPN

PNP

2N6515

2N6519
200

VCE = 10 V

TJ = 125C

100

hFE, DC CURRENT GAIN

hFE, DC CURRENT GAIN

200

25C

70
55C
50

30
20
1.0

VCE = 10 V

TJ = 125C
25C

100
70

55C

50

30

2.0

3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

20
1.0

70 100

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 1. DC Current Gain

2N6517

2N6520
200

200
TJ = 125C

VCE = 10 V

100

hFE , DC CURRENT GAIN

hFE , DC CURRENT GAIN

VCE = 10 V

25C

70
50

55C
30
20

10
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

100

25C

70
55C
50
30
20

10
1.0

50 70 100

TJ = 125C

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

2N6515, 2N6517
100
70
50
TJ = 25C
VCE = 20 V
f = 20 MHz

30
20

10
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50 70

100

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 2. DC Current Gain

2N6519, 2N6520
100
70
50
TJ = 25C
VCE = 20 V
f = 20 MHz

30
20

10
1.0

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 3. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

271

NPN 2N6515 2N6517 PNP 2N6519 2N6520


NPN

PNP

2N6515, 2N6517

2N6519, 2N6520

1.4

1.4
TJ = 25C

1.2

1.2

0.8

V, VOLTAGE (VOLTS)

V, VOLTAGE (VOLTS)

1.0
VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 10 V

0.4
0.2
0
1.0

3.0

1.0
0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 10 V

0.4
0.2

VCE(sat) @ IC/IB = 10
2.0

TJ = 25C

VCE(sat) @ IC/IB = 5.0


5.0 7.0 10
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

VCE(sat) @ IC/IB = 10
VCE(sat) @ IC/IB = 5.0
2.0 3.0 5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)

0
1.0

Figure 4. On Voltages

IC
IB

2.0
1.5

+ 10
25C to 125C

1.0
0.5
0

2N6519, 2N6520
RV, TEMPERATURE COEFFICIENTS (mV/C)

RV, TEMPERATURE COEFFICIENTS (mV/C)

2N6515, 2N6517
2.5

RVC for VCE(sat)


55C to 25C

0.5
1.0
1.5
2.0
2.5
1.0

55C to 125C
RVB for VBE

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70

100

2.5
IC
IB

2.0
1.5

+ 10
25C to 125C

1.0
0.5

RVB for VBE

55C to 25C

0
0.5
1.0
1.5

RVC for VCE(sat)

55C to 125C

2.0
2.5
1.0

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 5. Temperature Coefficients

2N6515, 2N6517

2N6519, 2N6520
100
70
50

TJ = 25C
Ceb

30

C, CAPACITANCE (pF)

C, CAPACITANCE (pF)

100
70
50

20
10
7.0
5.0

Ccb

20
10
7.0
5.0
3.0

2.0

2.0

0.5

1.0 2.0
5.0
10
20
VR, REVERSE VOLTAGE (VOLTS)

50 100 200

TJ = 25C

30

3.0

1.0
0.2

Ceb

1.0
0.2

Ccb

0.5 1.0 2.0


5.0 10 20
50 100 200
VR, REVERSE VOLTAGE (VOLTS)

Figure 6. Capacitance

272

Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN 2N6515 2N6517 PNP 2N6519 2N6520


NPN

PNP

2N6515, 2N6517
1.0 k
700
500

2N6519, 2N6520
1.0 k
700
500

VCE(off) = 100 V
IC/IB = 5.0
TJ = 25C

td @ VBE(off) = 2.0 V

300

300
200
t, TIME (ns)

t, TIME (ns)

200
tr
100
70
50
30

30
20

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

tr

100
70
50

20
10
1.0

VCE(off) = 100 V
IC/IB = 5.0
TJ = 25C

td @ VBE(off) = 2.0 V

10
1.0

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 7. TurnOn Time

2N6515, 2N6517
10 k
7.0 k
5.0 k

2N6519, 2N6520
2.0 k
ts

ts

1.0 k
700

3.0 k

500

t, TIME (ns)

2.0 k
1.0 k
700
500

tf

300

VCE(off) = 100 V
IC/IB = 5.0
IB1 = IB2
TJ = 25C

200

tf

VCE(off) = 100 V
IC/IB = 5.0
IB1 = IB2
TJ = 25C

100
70
50

300
200

30
100
1.0

2.0 3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

20
1.0

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 8. TurnOff Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

273

NPN 2N6515 2N6517 PNP 2N6519 2N6520


+VCC
VCC ADJUSTED
FOR VCE(off) = 100 V

+10.8 V

2.2 k

20 k

50 SAMPLING SCOPE

1.0 k
50
1/2MSD7000

9.2 V
PULSE WIDTH 100 s
tr, tf 5.0 ns
DUTY CYCLE 1.0%
FOR PNP TEST CIRCUIT,
REVERSE ALL VOLTAGE POLARITIES

APPROXIMATELY
1.35 V

(ADJUST FOR V(BE)off = 2.0 V)

r(t), TRANSIENT THERMAL


RESISTANCE (NORMALIZED)

Figure 9. Switching Time Test Circuit

1.0
0.7
0.5

D = 0.5
0.2

0.3
0.2

SINGLE PULSE

0.05

0.1
0.1
0.07
0.05

SINGLE PULSE
ZJC(t) = r(t) RJC TJ(pk) TC = P(pk) ZJC(t)
ZJA(t) = r(t) RJA TJ(pk) TA = P(pk) ZJA(t)

0.03
0.02
0.01
0.1

0.2

0.5

1.0

2.0

5.0

10

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 10. Thermal Response

IC, COLLECTOR CURRENT (mA)

500
TA = 25C

200
100

tP

1.0 ms

TC = 25C

50

FIGURE A

10 s

100 s

PP

PP

100 ms

20
CURRENT LIMIT
THERMAL LIMIT
(PULSE CURVES @ TC = 25C)
SECOND BREAKDOWN LIMIT

10
5.0
2.0

CURVES APPLY
BELOW RATED VCEO

1.0
0.5
0.5

1.0

2N6515
2N6519
2N6517, 2N6520

2.0
5.0
10
20
50 100 200
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 11. Active Region Safe Operating Area

274

t1
1/f
DUTY CYCLE
500

+ t1 f + ttP1

PEAK PULSE POWER = PP

Design Note: Use of Transient Thermal Resistance Data

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

PNP Silicon General Purpose


Amplifier Transistor

2SA1774

This PNP transistor is designed for general purpose amplifier applications. This
device is housed in the SOT416/SC90 package which is designed for low power
surface mount applications, where board space is at a premium.

PNP GENERAL
PURPOSE AMPLIFIER
TRANSISTORS
SURFACE MOUNT

Reduces Board Space


High hFE, 210 460 (typical)
Low VCE(sat), < 0.5 V
Available in 8 mm, 7inch/3000 Unit Tape and Reel

MAXIMUM RATINGS (TA = 25C)

2
1

Symbol

Value

Unit

CollectorBase Voltage

V(BR)CBO

60

Vdc

CollectorEmitter Voltage

V(BR)CEO

50

Vdc

EmitterBase Voltage

V(BR)EBO

6.0

Vdc

IC

100

mAdc

Symbol

Max

Unit

PD

150

mW

TJ

150

Tstg

55 ~ + 150

Rating

Collector Current Continuous

CASE 46301, STYLE 1


SOT416/SC90

COLLECTOR
3

DEVICE MARKING
2SA1774 = F9

THERMAL CHARACTERISTICS
Rating
Power Dissipation(1)
Junction Temperature
Storage Temperature Range

1
BASE

2
EMITTER

ELECTRICAL CHARACTERISTICS (TA = 25C)


Symbol

Min

Typ

Max

Unit

CollectorBase Breakdown Voltage (IC = 50 Adc, IE = 0)

V(BR)CBO

60

Vdc

CollectorEmitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)

V(BR)CEO

50

Vdc

EmitterBase Breakdown Voltage (IE = 50 Adc, IE = 0)

Characteristic

V(BR)EBO

6.0

Vdc

CollectorBase Cutoff Current (VCB = 30 Vdc, IE = 0)

ICBO

0.5

nA

EmitterBase Cutoff Current (VEB = 5.0 Vdc, IB = 0)

IEBO

0.5

0.5

120

560

140

3.5

CollectorEmitter Saturation Voltage(2)


(IC = 50 mAdc, IB = 5.0 mAdc)
DC Current Gain(2)
(VCE = 6.0 Vdc, IC = 1.0 mAdc)

VCE(sat)
hFE

Transition Frequency
(VCE = 12 Vdc, IC = 2.0 mAdc, f = 30 MHz)
Output Capacitance (VCB = 12 Vdc, IE = 0 Adc, f = 1 MHz)

Vdc

fT
COB

MHz
pF

1. Device mounted on a FR4 glass epoxy printed circuit board using the minimum recommended footprint.
2. Pulse Test: Pulse Width 300 s, D.C. 2%.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

275

2SA1774
TYPICAL ELECTRICAL CHARACTERISTICS
1000
VCE = 10 V

90

300 A
250
200

60

150
IB = 50 A
0

12

10
0.1

15

10

100

IC, COLLECTOR CURRENT (mA)

Figure 1. IC VCE

Figure 2. DC Current Gain


900
TA = 25C

800
COLLECTOR VOLTAGE (mV)

VCE , COLLECTOR-EMITTER VOLTAGE (V)

VCE, COLLECTOR VOLTAGE (V)

1.5

0.5

700
600
500
400
300
TA = 25C
VCE = 5 V

200
100

0
0.01

0.1

10

0
0.2

100

10

20

40

60

80

Figure 3. Collector Saturation Region

Figure 4. On Voltage
14

12

12

11
10
9
8
7

100

150 200

10
8
6
4
2

2
VEB (V)

Figure 5. Capacitance

276

IC, COLLECTOR CURRENT (mA)

13

0.5

IB, BASE CURRENT (mA)

Cob, CAPACITANCE (pF)

Cib, INPUT CAPACITANCE (pF)

TA = 25C
100

100

30
0

TA = 25C

TA = 75C
DC CURRENT GAIN

IC, COLLECTOR CURRENT (mA)

TA = 25C
120

10

20

30

40

VCB (V)

Figure 6. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

2SC4617

Preliminary Information

NPN Silicon General Purpose


Amplifier Transistor

NPN GENERAL
PURPOSE AMPLIFIER
TRANSISTORS
SURFACE MOUNT

This NPN transistor is designed for general purpose amplifier applications.


This device is housed in the SOT-416/SC90 package which is designed for
low power surface mount applications, where board space is at a premium.
Reduces Board Space
High hFE, 210 460 (typical)
Low VCE(sat), < 0.5 V
Available in 8 mm, 7-inch/3000 Unit Tape and Reel

3
2

MAXIMUM RATINGS (TA = 25C)

Symbol

Value

Unit

Collector-Base Voltage

V(BR)CBO

50

Vdc

Collector-Emitter Voltage

V(BR)CEO

50

Vdc

Emitter-Base Voltage

V(BR)EBO

5.0

Vdc

IC

100

mAdc

Symbol

Max

Unit

Power Dissipation(1)

PD

125

mW

Junction Temperature

TJ

150

Tstg

55 ~ + 150

Rating

Collector Current Continuous

CASE 46301, STYLE 1


SOT416/SC90

COLLECTOR
3

DEVICE MARKING
2SC4617 = B9

THERMAL CHARACTERISTICS
Rating

Storage Temperature Range

1
BASE

2
EMITTER

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector-Base Breakdown Voltage (IC = 50 Adc, IE = 0)

V(BR)CBO

50

Vdc

Collector-Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)

V(BR)CEO

50

Vdc

Emitter-Base Breakdown Voltage (IE = 50 Adc, IE = 0)

V(BR)EBO

5.0

Vdc

Collector-Base Cutoff Current (VCB = 30 Vdc, IE = 0)

ICBO

0.5

Emitter-Base Cutoff Current (VEB = 4.0 Vdc, IB = 0)

IEBO

0.5

0.4

120

560

fT

180

MHz

COB

2.0

pF

Collector-Emitter Saturation Voltage(2)


(IC = 60 mAdc, IB = 5.0 mAdc)

VCE(sat)

DC Current Gain(2)
(VCE = 6.0 Vdc, IC = 1.0 mAdc)
Transition Frequency (VCE = 12 Vdc, IC = 2.0 mAdc, f = 30 MHz)
Output Capacitance (VCB = 12 Vdc, IC = 0 Adc, f = 1 MHz)

Vdc

hFE

1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. Pulse Test: Pulse Width 300 s, D.C. 2%.

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

277

2SC4617
TYPICAL ELECTRICAL CHARACTERISTICS
60

1000
160 A

50

140 A

40

120 A
100 A

30

80 A
60 A

20

40 A
10
0

TA = 25C
100

IB = 20 A
0

2
4
6
VCE, COLLECTOR VOLTAGE (V)

10
0.1

1
10
100
IC, COLLECTOR CURRENT (mA)

Figure 1. IC VCE

Figure 2. DC Current Gain


900
TA = 25C

800
COLLECTOR VOLTAGE (mV)

VCE , COLLECTOR-EMITTER VOLTAGE (V)

1.5

0.5

700
600
500
400
TA = 25C
VCE = 5 V

300
200
100

0
0.01

0.1

1
IB, BASE CURRENT (mA)

10

0
0.2

100

10

20

40

60

80

100

150 200

7
6
Cob, CAPACITANCE (pF)

18

16

14

12

278

Figure 4. On Voltage

20

10

0.5

IC, COLLECTOR CURRENT (mA)

Figure 3. Collector Saturation Region

Cib, INPUT CAPACITANCE (pF)

VCE = 10 V

TA = 25C
TA = 75C
DC CURRENT GAIN

IC, COLLECTOR CURRENT (mA)

TA = 25C

5
4
3
2

10

20

VEB (V)

VCB (V)

Figure 5. Capacitance

Figure 6. Capacitance

30

40

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

BC182,A,B

NPN Silicon

BC183
BC184
COLLECTOR
1
2
BASE
3
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

BC182

BC183

BC184

Unit

Collector Emitter Voltage

VCEO

50

30

30

Vdc

Collector Base Voltage

VCBO

60

45

45

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

357

C/W

Thermal Resistance, Junction to Case

RqJC

125

C/W

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

50
30
30

60
45
45

6.0

0.2
0.2
0.2

15
15
15

15

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 2.0 mA, IB = 0)

Collector Base Breakdown Voltage


(IC = 10 mA, IE = 0)

V(BR)CEO
BC182
BC183
BC184
V(BR)CBO
BC182
BC183
BC184

Emitter Base Breakdown Voltage


(IE = 100 mA, IC = 0)
Collector Cutoff Current
(VCB = 50 V, VBE = 0)
(VCB = 30 V, VBE = 0)

V(BR)EBO

ICBO
BC182
BC183
BC184

EmitterBase Leakage Current


(VEB = 4.0 V, IC = 0)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

IEBO

V
nA

nA

279

BC182,A,B BC183 BC184

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Characteristic

Symbol

Min

Typ

Max

BC182
BC183
BC184

40
40
100

(IC = 2.0 mA, VCE = 5.0 V)

BC182
BC183
BC184

120
120
250

500
800
800

(IC = 100 mA, VCE = 5.0 V)

BC182
BC183
BC184

80
80
130

0.07
0.2

0.25
0.6

1.2

0.55

0.5
0.62
0.83

0.7

BC182
BC183
BC184

100
120
140

BC182
BC183
BC184

150
150
150

200
240
280

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 A, VCE = 5.0 V)

hFE

Collector Emitter On Voltage


(IC = 10 mA, IB = 0.5 mA)
(IC = 100 mA, IB = 5.0 mA)(1)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 100 mA, IB = 5.0 mA)(1)

VBE(sat)

BaseEmitter On Voltage
(IC = 100 A, VCE = 5.0 V)
(IC = 2.0 mA, VCE = 5.0 V)
(IC = 100 mA, VCE = 5.0 V)(1)

VBE(on)

V
V

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 0.5 mA, VCE = 3.0 V, f = 100 MHz)

(IC = 10 mA, VCE = 5.0 V, f = 100 MHz)

fT

MHz

Common Base Output Capacitance


(VCB = 10 V, IC = 0, f = 1.0 MHz)

Cob

5.0

pF

Common Base Input Capacitance


(VEB = 0.5 V, IC = 0, f = 1.0 MHz)

Cib

8.0

pF

125
125
240
125
240

500
900
900
260
500

SmallSignal Current Gain


(IC = 2.0 mA, VCE = 5.0 V, f = 1.0 kHz)

Noise Figure
(IC = 0.2 mA, VCE = 5.0 V, RS = 2.0 k,
f = 1.0 kHz)
(IC = 0.2 mA, VCE = 5.0 V, RS = 2.0 k,
f = 1.0 kHz, f = 200 Hz)

hfe
BC182
BC183
BC184
BC182A
BC182B

NF

BC184
BC182
BC183
BC184

dB

2.0
2.0
2.0
2.0

4.0
10
10
4.0

1. Pulse Test: Tp 300 s, Duty Cycle 2.0%.

280

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC182,A,B BC183 BC184

1.0
VCE = 10 V
TA = 25C

1.5

0.9
0.8
V, VOLTAGE (VOLTS)

hFE, NORMALIZED DC CURRENT GAIN

2.0

1.0
0.8
0.6
0.4

0.7

VBE(sat) @ IC/IB = 10
VBE(on) @ VCE = 10 V

0.6
0.5
0.4
0.3
0.2

0.3

VCE(sat) @ IC/IB = 10

0.1
0.2
0.2

0.5

1.0
2.0
5.0
10
20
50
IC, COLLECTOR CURRENT (mAdc)

100

0
0.1

200

Figure 1. Normalized DC Current Gain

0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mAdc)

50 70 100

Figure 2. Saturation and On Voltages

10

400
300

7.0
200
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

TA = 25C

VCE = 10 V
TA = 25C

100
80
60

TA = 25C

Cib

5.0

3.0
Cob
2.0

40
30
20
0.5 0.7

1.0

2.0 3.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mAdc)

30

50

1.0
0.4

0.6 0.8 1.0

r b, BASE SPREADING RESISTANCE (OHMS)

Figure 3. CurrentGain Bandwidth Product

2.0
4.0 6.0 8.0 10
VR, REVERSE VOLTAGE (VOLTS)

20

40

Figure 4. Capacitances

170
160

150
VCE = 10 V
f = 1.0 kHz
TA = 25C

140

130

120
0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mAdc)

5.0

10

Figure 5. Base Spreading Resistance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

281

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

BC212,B

PNP Silicon

BC213
BC214

COLLECTOR
3
2
BASE
1
EMITTER

MAXIMUM RATINGS

Rating

Symbol

BC212

BC213

BC214

Unit

Collector Emitter Voltage

VCEO

50

30

30

Vdc

Collector Base Voltage

VCBO

60

45

45

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

357

C/W

Thermal Resistance, Junction to Case

RqJC

125

C/W

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 2.0 mAdc, IB = 0)

BC212
BC213
BC214

V(BR)CEO

50
30
30

Vdc

Collector Base Breakdown Voltage


(IC = 10 mA, IE = 0)

BC212
BC213
BC214

V(BR)CBO

60
45
45

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

BC212
BC213
BC214

V(BR)EBO

5
5
5

Vdc

CollectorEmitter Leakage Current


(VCB = 30 V)

BC212
BC213
BC214

ICBO

15
15
15

nAdc

EmitterBase Leakage Current


(VEB = 4.0 V, IC = 0)

BC212
BC213
BC214

IEBO

15
15
15

nAdc

282

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC212,B BC213 BC214

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Characteristic

Symbol

Min

Typ

Max

BC212
BC213
BC214

40
40
100

(IC = 2.0 mAdc, VCE = 5.0 Vdc)

BC212
BC213
BC214

60
80
140

600

(IC = 100 mAdc, VCE = 5.0 Vdc)(1)

BC212, BC214
BC213

120
140

0.10
0.25

0.6

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 Adc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 100 mAdc, IB = 5.0 mAdc)(1)

VCE(sat)

Vdc

Base Emitter Saturation Voltage


(IC = 100 mAdc, IB = 5.0 mAdc)

VBE(sat)

1.0

1.4

Vdc

BaseEmitter On Voltage
(IC = 2.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

0.6

0.62

0.72

Vdc

280
320
360

6.0

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

fT
BC212
BC214
BC213

CommonBase Output Capacitance


(VCB = 10 Vdc, IC = 0, f = 1.0 MHz)

Cob

Noise Figure
(IC = 0.2 mAdc, VCE = 5.0 Vdc,
RS = 2.0 k , f = 1.0 kHz)
(IC = 0.2 mAdc, VCE = 5.0 Vdc,
RS = 2.0 k, f = 1.0 kHz, f = 200 Hz)

NF

SmallSignal Current Gain


(IC = 2.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

MHz

dB

BC214

BC212, BC213

10

60
80
140
200

400

hfe
BC212
BC213
BC214
BC212B

pF

1. Pulse Test: Tp 300 s, Duty Cycle 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

283

BC212,B BC213 BC214

1.0
VCE = 10 V
TA = 25C

1.5

0.9

1.0
0.7
0.5

0.7

VBE(on) @ VCE = 10 V

0.6
0.5
0.4
0.3
VCE(sat) @ IC/IB = 10

0.1
0
0.1 0.2

0.5 1.0 2.0


5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mAdc)

Figure 1. Normalized DC Current Gain

0.5 1.0 2.0


5.0 10 20
IC, COLLECTOR CURRENT (mAdc)

50 100

Figure 2. Saturation and On Voltages

10

400
300

Cib
7.0

200
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

VBE(sat) @ IC/IB = 10

0.2

0.3
0.2
0.2

VCE = 10 V
TA = 25C

150
100
80
60

5.0

TA = 25C

3.0
Cob
2.0

40
30
20
0.5

1.0

2.0 3.0 5.0


10
20 30
IC, COLLECTOR CURRENT (mAdc)

1.0
0.4 0.6

50

Figure 3. CurrentGain Bandwidth Product

0.5
0.3

VCE = 10 V
f = 1.0 kHz
TA = 25C

0.1
0.05
0.03

0.01
0.1

0.2

0.5
1.0
2.0
IC, COLLECTOR CURRENT (mAdc)

Figure 5. Output Admittance

284

5.0

10

1.0

2.0
4.0 6.0 10
VR, REVERSE VOLTAGE (VOLTS)

20 30 40

Figure 4. Capacitances

r b, BASE SPREADING RESISTANCE (OHMS)

1.0
hob, OUTPUT ADMITTANCE (OHMS)

TA = 25C

0.8
V, VOLTAGE (VOLTS)

hFE, NORMALIZED DC CURRENT GAIN

2.0

150
140

130

VCE = 10 V
f = 1.0 kHz
TA = 25C

120

110

100
0.1

0.2 0.3 0.5


1.0
2.0 3.0
IC, COLLECTOR CURRENT (mAdc)

5.0

10

Figure 6. Base Spreading Resistance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

BC237,A,B,C

NPN Silicon

BC238B,C
BC239,C
COLLECTOR
1
2
BASE
3
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

BC237

BC238

BC239

Unit

Collector Emitter Voltage

VCEO

45

25

25

Vdc

Collector Emitter Voltage

VCES

50

30

30

Vdc

Emitter Base Voltage

VEBO

6.0

5.0

5.0

CASE 2904, STYLE 17


TO92 (TO226AA)

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

357

C/W

Thermal Resistance, Junction to Case

RqJC

125

C/W

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 2.0 mA, IB = 0)

BC237
BC238
BC239

V(BR)CEO

45
25
25

Emitter Base Breakdown Voltage


(IE = 100 mA, IC = 0)

BC237
BC238
BC239

V(BR)EBO

6.0
5.0
5.0

BC238
BC239

0.2
0.2

15
15

nA

(VCE = 50 V, VBE = 0)

BC237

0.2

15

(VCE = 30 V, VBE = 0) TA = 125C

BC238
BC239

0.2
0.2

4.0
4.0

(VCE = 50 V, VBE = 0) TA = 125C

BC237

0.2

4.0

Collector Cutoff Current


(VCE = 30 V, VBE = 0)

ICES

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

285

BC237,A,B,C BC238B,C BC239,C

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Characteristic

Symbol

Min

Typ

Max

BC237A
BC237B/238B
BC237C/238C/239C

90
150
270

(IC = 2.0 mA, VCE = 5.0 V)

BC237
BC239
BC237A
BC237B/238B
BC237C/238C/239C

120
120
120
200
380

170
290
500

800
800
220
460
800

(IC = 100 mA, VCE = 5.0 V)

BC237A
BC237B/238B
BC237C/238C/239C

120
180
300

0.07
0.2

0.2
0.6
0.8

0.6

0.83
1.05

0.55

0.5
0.62
0.83

0.7

BC237
BC238
BC239

100
120
140

BC237
BC238
BC239

150
150
150

200
240
280

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 A, VCE = 5.0 V)

Collector Emitter On Voltage


(IC = 10 mA, IB = 0.5 mA)
(IC = 100 mA, IB = 5.0 mA)

hFE

VCE(sat)
BC237/BC238/BC239
BC237/BC239
BC238

Base Emitter Saturation Voltage


(IC = 10 mA, IB = 0.5 mA)
(IC = 100 mA, IB = 5.0 mA)

VBE(sat)

BaseEmitter On Voltage
(IC = 100 A, VCE = 5.0 V)
(IC = 2.0 mA, VCE = 5.0 V)
(IC = 100 mA, VCE = 5.0 V)

VBE(on)

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 0.5 mA, VCE = 3.0 V, f = 100 MHz)

(IC = 10 mA, VCE = 5.0 V, f = 100 MHz)

fT

MHz

CollectorBase Capacitance
(VCB = 10 V, IC = 0, f = 1.0 MHz)

Cobo

4.5

pF

EmitterBase Capacitance
(VEB = 0.5 V, IC = 0, f = 1.0 MHz)

Cibo

8.0

pF

Noise Figure
(IC = 0.2 mA, VCE = 5.0 V, RS = 2.0 k,
f = 1.0 kHz)
(IC = 0.2 mA, VCE = 5.0 V, RS = 2.0 k,
f = 1.0 kHz, f = 200 Hz)

286

NF

dB

BC239

BC237
BC238
BC239

2.0

4.0

2.0
2.0
2.0

10
10
4.0

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC237,A,B,C BC238B,C BC239,C

1.0
VCE = 10 V
TA = 25C

1.5

0.9
0.8
V, VOLTAGE (VOLTS)

hFE, NORMALIZED DC CURRENT GAIN

2.0

1.0
0.8
0.6
0.4

0.7

VBE(sat) @ IC/IB = 10
VBE(on) @ VCE = 10 V

0.6
0.5
0.4
0.3
0.2

0.3

VCE(sat) @ IC/IB = 10

0.1
0.2
0.2

0.5

1.0
2.0
5.0
10
20
50
IC, COLLECTOR CURRENT (mAdc)

100

0
0.1

200

Figure 1. Normalized DC Current Gain

0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mAdc)

50 70 100

Figure 2. Saturation and On Voltages

10

400
300

7.0
200
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

TA = 25C

VCE = 10 V
TA = 25C

100
80
60

TA = 25C

Cib

5.0

3.0
Cob
2.0

40
30
20
0.5 0.7

1.0

2.0 3.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mAdc)

30

50

1.0
0.4

0.6 0.8 1.0

r b, BASE SPREADING RESISTANCE (OHMS)

Figure 3. CurrentGain Bandwidth Product

2.0
4.0 6.0 8.0 10
VR, REVERSE VOLTAGE (VOLTS)

20

40

Figure 4. Capacitances

170
160

150
VCE = 10 V
f = 1.0 kHz
TA = 25C

140

130

120
0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mAdc)

5.0

10

Figure 5. Base Spreading Resistance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

287

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

BC307
BC307B
BC307C
BC308C

PNP Silicon

COLLECTOR
1
2
BASE
3
EMITTER

1
2

CASE 2904, STYLE 17


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

BC307, B, C

BC308C

Unit

Collector Emitter Voltage

VCEO

45

25

Vdc

Collector Base Voltage

VCBO

50

30

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

357

C/W

Thermal Resistance, Junction to Case

RqJC

125

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 2.0 mAdc, IB = 0)

BC307,B,C
BC308C

V(BR)CEO

45
25

Vdc

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

BC307,B,C
BC308C

V(BR)EBO

5.0
5.0

Vdc

CollectorEmitter Leakage Current


(VCES = 50 V, VBE = 0)
(VCES = 30 V, VBE = 0)
(VCES = 50 V, VBE = 0) TA = 125C
(VCES = 30 V, VBE = 0) TA = 125C

BC307,B,C
BC308C
BC307,B,C
BC308C

0.2
0.2
0.2
0.2

15
15
4.0
4.0

nAdc

ICES
A

REV 1

288

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC307 BC307B BC307C BC308C


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

BC307B
BC307C/308C

150
270

(IC = 2.0 mAdc, VCE = 5.0 Vdc)

BC307
BC307B/308B
BC307C/308C

120
200
420

290
500

800
460
800

(IC = 100 mAdc, VCE = 5.0 Vdc)

BC307B
BC307C/308C

180
300

0.10
0.30
0.25

0.3
0.6

0.7
1.0

0.55

0.62

0.7

280
320

6.0

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 Adc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 10 mAdc, IB = see Note 1)
(IC = 100 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 100 mAdc, IB = 5.0 mAdc)

VBE(sat)

BaseEmitter On Voltage
(IC = 2.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

Vdc

Vdc

Vdc

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

fT
BC307,B,C
BC308C

Common Base Capacitance


(VCB = 10 Vdc, IC = 0, f = 1.0 MHz)
Noise Figure
(IC = 0.2 mAdc, VCE = 5.0 Vdc, RS = 2.0 k,
f = 1.0 kHz)
(IC = 0.2 mAdc, VCE = 5.0 Vdc, RS = 2.0 k,
f = 1.0 kHz, f = 200 Hz)

Ccbo

MHz

NF

pF
dB

BC307,B,C

2.0

10

BC308C

2.0

10

1. IC = 10 mAdc on the constant base current characteristic, which yields the point IC = 11 mAdc, VCE = 1.0 V.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

289

BC307 BC307B BC307C BC308C


TYPICAL CHARACTERISTICS
1.0
VCE = 10 V
TA = 25C

1.5

0.9

1.0
0.7
0.5

0.7

VBE(on) @ VCE = 10 V

0.6
0.5
0.4
0.3
VCE(sat) @ IC/IB = 10

0.1
0
0.1 0.2

0.5 1.0 2.0


5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mAdc)

Figure 1. Normalized DC Current Gain

0.5 1.0 2.0


5.0 10 20
IC, COLLECTOR CURRENT (mAdc)

50 100

Figure 2. Saturation and On Voltages

10

400
300

Cib
7.0

200
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

VBE(sat) @ IC/IB = 10

0.2

0.3
0.2
0.2

VCE = 10 V
TA = 25C

150
100
80
60

5.0

TA = 25C

3.0
Cob
2.0

40
30
20
0.5

1.0

2.0 3.0 5.0


10
20 30
IC, COLLECTOR CURRENT (mAdc)

1.0
0.4 0.6

50

Figure 3. CurrentGain Bandwidth Product

0.5
0.3

VCE = 10 V
f = 1.0 kHz
TA = 25C

0.1
0.05
0.03

0.01
0.1

0.2

0.5
1.0
2.0
IC, COLLECTOR CURRENT (mAdc)

Figure 5. Output Admittance

290

5.0

10

1.0

2.0
4.0 6.0 10
VR, REVERSE VOLTAGE (VOLTS)

20 30 40

Figure 4. Capacitances

r b, BASE SPREADING RESISTANCE (OHMS)

1.0
hob, OUTPUT ADMITTANCE (OHMS)

TA = 25C

0.8
V, VOLTAGE (VOLTS)

hFE, NORMALIZED DC CURRENT GAIN

2.0

150
140

130

VCE = 10 V
f = 1.0 kHz
TA = 25C

120

110

100
0.1

0.2 0.3 0.5


1.0
2.0 3.0
IC, COLLECTOR CURRENT (mAdc)

5.0

10

Figure 6. Base Spreading Resistance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

PNP Silicon

BC327,-16,-25
BC328,-16,-25

COLLECTOR
1
2
BASE
3
EMITTER

MAXIMUM RATINGS

Rating

Symbol

BC327

BC328

Unit

Collector Emitter Voltage

VCEO

45

25

Vdc

Collector Base Voltage

VCBO

50

30

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

800

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

45
25

50
30

5.0

100
100

100
100

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 10 mA, IB = 0)
Collector Emitter Breakdown Voltage
(IC = 100 A, IE = 0)

V(BR)CEO
BC327
BC328

Vdc

V(BR)CES
BC327
BC328

Emitter Base Breakdown Voltage


(IE = 10 mA, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 30 V, IE = 0)
(VCB = 20 V, IE = 0)

BC327
BC328

Collector Cutoff Current


(VCE = 45 V, VBE = 0)
(VCE = 25 V, VBE = 0)

BC327
BC328

Vdc

ICBO

nAdc

ICES

Emitter Cutoff Current


(VEB = 4.0 V, IC = 0)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

IEBO

Vdc

nAdc

nAdc

291

BC327,-16,-25 BC328,-16,-25

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Characteristic

Symbol

Min

Typ

Max

100
100
160
40

630
250
400

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 mA, VCE = 1.0 V)

hFE

BC327/BC328
BC32716/BC32816
BC32725/BC32825

(IC = 300 mA, VCE = 1.0 V)


BaseEmitter On Voltage
(IC = 300 mA, VCE = 1.0 V)

VBE(on)

1.2

Vdc

Collector Emitter Saturation Voltage


(IC = 500 mA, IB = 50 mA)

VCE(sat)

0.7

Vdc

Cob

11

pF

fT

260

MHz

SMALLSIGNAL CHARACTERISTICS
Output Capacitance
(VCB = 10 V, IE = 0, f = 1.0 MHz)

r(t), NORMALIZED EFFECTIVE TRANSIENT


THERMAL RESISTANCE

Current Gain Bandwidth Product


(IC = 10 mA, VCE = 5.0 V, f = 100 MHz)

1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2

0.1

0.1 0.05
0.07 0.02
0.05

P(pk)
SINGLE PULSE
0.01

0.03

t1
t2
DUTY CYCLE, D = t1/t2

SINGLE PULSE

0.02
0.01
0.001

JC(t) = (t) JC
JC = 100C/W MAX
JA(t) = r(t) JA
JA = 375C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) TC = P(pk) JC(t)

0.002

0.005

0.01

0.02

0.05

0.1

0.2
0.5
t, TIME (SECONDS)

1.0

2.0

5.0

10

20

50

100

Figure 1. Thermal Response

1.0 s

1.0 ms

1000
TJ = 135C
100 s

dc
TC = 25C
dc
TA = 25C

100

10
1.0

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
(APPLIES BELOW RATED VCEO)
3.0
10
30
VCE, COLLECTOREMITTER VOLTAGE

100

Figure 2. Active Region Safe Operating Area

292

VCE = 1.0 V
TA = 25C
hFE, DC CURRENT GAIN

IC, COLLECTOR CURRENT (mA)

1000

100

10
0.1

1.0
10
100
IC, COLLECTOR CURRENT (mA)

1000

Figure 3. DC Current Gain

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0

1.0
TA = 25C

TJ = 25C
0.8

0.8
V, VOLTAGE (VOLTS)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

BC327,-16,-25 BC328,-16,-25

IC =
500 mA

0.6

0.4
IC = 300 mA
0.2

1.0
10
IB, BASE CURRENT (mA)

0.4

VCE(sat) @ IC/IB = 10

IC = 10 mA
0.1

VBE(on) @ VCE = 1.0 V


0.6

0.2

IC = 100 mA

0
0.01

0
1.0

100

1000

100

+1.0
VC for VCE(sat)
0

1.0

1.0

10
100
IC, COLLECTOR CURRENT (mA)

Figure 5. On Voltages

C, CAPACITANCE (pF)

V, TEMPERATURE COEFFICIENTS (mV/C)

Figure 4. Saturation Region

2.0

VBE(sat) @ IC/IB = 10

VB for VBE

10
100
IC, COLLECTOR CURRENT

1000

Figure 6. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Cib
10

Cob

1.0
0.1

1.0
10
VR, REVERSE VOLTAGE (VOLTS)

100

Figure 7. Capacitances

293

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

NPN Silicon

BC337,-16,-25,-40
BC338,-16,-25,-40
COLLECTOR
1
2
BASE
3
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

BC337

BC338

Unit

Collector Emitter Voltage

VCEO

45

25

Vdc

Collector Base Voltage

VCBO

50

30

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

800

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

45
25

50
30

5.0

100
100

100
100

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 10 mA, IB = 0)
Collector Emitter Breakdown Voltage
(IC = 100 A, IE = 0)

V(BR)CEO
BC337
BC338
V(BR)CES
BC337
BC338

Emitter Base Breakdown Voltage


(IE = 10 mA, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 30 V, IE = 0)
(VCB = 20 V, IE = 0)

BC337
BC338

Collector Cutoff Current


(VCE = 45 V, VBE = 0)
(VCE = 25 V, VBE = 0)

BC337
BC338

Emitter Cutoff Current


(VEB = 4.0 V, IC = 0)

294

Vdc

Vdc

ICBO

nAdc

ICES

IEBO

Vdc

nAdc

nAdc

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC337,-16,-25,-40 BC338,-16,-25,-40

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Characteristic

Symbol

Min

Typ

Max

100
100
160
250
60

630
250
400
630

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 mA, VCE = 1.0 V)

hFE

BC337/BC338
BC33716/BC33816
BC33725/BC33825
BC33740/BC33840

(IC = 300 mA, VCE = 1.0 V)


BaseEmitter On Voltage
(IC = 300 mA, VCE = 1.0 V)

VBE(on)

1.2

Vdc

Collector Emitter Saturation Voltage


(IC = 500 mA, IB = 50 mA)

VCE(sat)

0.7

Vdc

Cob

15

pF

fT

210

MHz

SMALLSIGNAL CHARACTERISTICS
Output Capacitance
(VCB = 10 V, IE = 0, f = 1.0 MHz)

r(t), NORMALIZED EFFECTIVE TRANSIENT


THERMAL RESISTANCE

Current Gain Bandwidth Product


(IC = 10 mA, VCE = 5.0 V, f = 100 MHz)

1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2

0.1

0.1 0.05
0.07 0.02
0.05

SINGLE PULSE
0.01

0.03

t1
t2
DUTY CYCLE, D = t1/t2

SINGLE PULSE

0.02
0.01
0.001

JC(t) = (t) JC
JC = 100C/W MAX
JA(t) = r(t) JA
JA = 375C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) TC = P(pk) JC(t)

P(pk)

0.002

0.005

0.01

0.02

0.05

0.1

0.2
0.5
t, TIME (SECONDS)

1.0

2.0

5.0

10

20

50

100

Figure 1. Thermal Response

1.0 s

1.0 ms

1000
TJ = 135C
100 s

hFE, DC CURRENT GAIN

IC, COLLECTOR CURRENT (mA)

1000

dc
TC = 25C
dc
TA = 25C

100

10
1.0

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
(APPLIES BELOW RATED VCEO)
3.0
10
30
VCE, COLLECTOREMITTER VOLTAGE

100

Figure 2. Active Region Safe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

VCE = 1 V
TJ = 25C

100

10
0.1

1.0
10
100
IC, COLLECTOR CURRENT (AMP)

1000

Figure 3. DC Current Gain

295

1.0

1.0
TJ = 25C

TA = 25C

0.6
IC = 10 mA

0.4

100 mA

300 mA

500 mA

VBE(on) @ VCE = 1 V
0.6

0.4

0.2

0.2

VCE(sat) @ IC/IB = 10
0
0.01

0
0.1

1
IB, BASE CURRENT (mA)

10

100

Figure 4. Saturation Region

10
100
IC, COLLECTOR CURRENT (mA)

1000

Figure 5. On Voltages

100

+1
VC for VCE(sat)
C, CAPACITANCE (pF)

V, TEMPERATURE COEFFICIENTS (mV/C)

VBE(sat) @ IC/IB = 10

0.8

0.8
V, VOLTAGE (VOLTS)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

BC337,-16,-25,-40 BC338,-16,-25,-40

VB for VBE

10
100
IC, COLLECTOR CURRENT (mA)

Figure 6. Temperature Coefficients

296

1000

Cib
10

Cob

1
0.1

1
10
VR, REVERSE VOLTAGE (VOLTS)

100

Figure 7. Capacitances

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

NPN
BC368
PNP
BC369

COLLECTOR
2

COLLECTOR
2

3
BASE

3
BASE
NPN

PNP
1
EMITTER

1
EMITTER

Voltage and current are negative


for PNP transistors

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

20

Vdc

Collector Emitter Voltage

VCES

25

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

1.0

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

Operating and Storage Junction


Temperature Range

1
2

CASE 2904, STYLE 14


TO92 (TO226AA)

THERMAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 10 mA, IB = 0)

V(BR)CEO

20

Vdc

Collector Base Breakdown Voltage


(IC = 100 A, IE = 0 )

V(BR)CBO

25

Vdc

Emitter Base Breakdown Voltage


(IE = 100 A, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCB = 25 V, IE = 0)
(VCB = 25 V, IE = 0, TJ = 150C)

ICBO

10
1.0

Adc
mAdc

Emitter Cutoff Current


(VEB = 5.0 V, IC = 0)

IEBO

10

Adc

50
85
60

375

fT

65

MHz

CollectorEmitter Saturation Voltage (IC = 1.0 A, IB = 100 mA)

VCE(sat)

0.5

BaseEmitter On Voltage (IC = 1.0 A, VCE = 1.0 V)

VBE(on)

1.0

Characteristic

OFF CHARACTERISTICS

ON CHARACTERISTICS
DC Current Gain
(VCE = 10 V, IC = 5.0 mA)
(VCE = 1.0 V, IC = 0.5 A)
(VCE = 1.0 V, IC = 1.0 A)
Bandwidth Product (IC = 10 mA, VCE = 5.0 V, f = 20 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

hFE

297

NPN BC368 PNP BC369


1.0
VCE , COLLECTOR VOLTAGE (VOLTS)

hFE, CURRENT GAIN

200

100
70
50

VCE = 1.0 V
TJ = 25C

20
10

20

50
100
200
IC, COLLECTOR CURRENT (mA)

500

1000

TJ = 25C
0.8

0.6
50 mA

1000 mA
0.2

250 mA
20

50 100

Figure 2. Collector Saturation Region

0.8
TJ = 25C

VB , TEMPERATURE COEFFICIENT (mV/ C)

1.0
VBE(sat) @ IC/IB = 10

0.8
V, VOLTAGE (VOLTS)

500 mA

IC = 10 mA
0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10
IB, BASE CURRENT (mA)

Figure 1. DC Current Gain

VBE(on) @ VCE = 1.0 V


0.6

0.4

0.2
VCE(sat) @ IC/IB = 10
0
1.0 2.0

5.0 10 20
50 100 200 500 1000
IC, COLLECTOR CURRENT (mA)

1.2

1.6

2.0

VB for VBE

2.4

2.8
1.0 2.0

5.0 10 20
50 100 200 500 1000
IC, COLLECTOR CURRENT (mA)

Figure 4. Temperature Coefficient

Figure 3. On Voltages

300

160
TJ = 25C

200
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

100 mA

0.4

100
70
VCE = 10 V
TJ = 25C
f = 20 MHz

50

30

298

10

20

50

120

80
Cibo
40
Cobo

100

200

500

1000

0
Cobo
Cibo

5.0
1.0

10
2.0

15
3.0

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 5. CurrentGain Bandwidth Product

Figure 6. Capacitance

20
4.0

25
5.0

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage
Darlington Transistors

BC372
BC373

NPN Silicon

COLLECTOR 3
BASE
2
1
2

EMITTER 1

CASE 2904, STYLE 1


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

BC372

BC373

Unit

Collector Emitter Voltage

VCES

100

80

Vdc

Collector Base Voltage

VCBO

100

80

Vdc

Emitter Base Voltage

VEBO

12

Vdc

Collector Current Continuous

IC

1.0

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

100
80

100
80

12

100
100

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 100 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CES
BC372
BC373
V(BR)CBO
BC372
BC373

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 80 Vdc, IE = 0)
(VCB = 60 Vdc, IE = 0)

Vdc

V(BR)EBO

Vdc

ICBO
BC372
BC373

Emitter Cutoff Current


(VEB = 10 V, IC = 0)

IEBO

Vdc
nAdc

nAdc

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

299

BC372 BC373
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

8.0
10

160

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 250 mAdc, VCE = 5.0 Vdc)
(IC = 100 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 250 mAdc, IB = 0.25 mAdc)

VCE(sat)

1.0

1.1

Vdc

Base Emitter Saturation Voltage


(IC = 250 mAdc, IB = 0.25 mAdc)

VBE(sat)

1.4

2.0

Vdc

fT

100

200

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cob

10

25

pF

Noise Figure
(IC = 1.0 mAdc, VCE = 5.0 Vdc, Rg = 100 k ohm, f = 1.0 kHz)

NF

2.0

dB

DYNAMIC CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 100 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.

100 K

1.6
VBE(sat) @ IC/IB = 100

VCE = 5 V

1.4
1.2

25C

VOLTAGE (V)

hFE, DC CURRENT GAIN

TA = 125C

55C

10 K

VBE(on) @ VCE = 5 V

1
0.8
VCE(sat) @ IC/IB = 100

0.6
0.4
0.2
0

1K
10
100
IC, COLLECTOR CURRENT (mA)

1000

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 1. DC Current Gain

10

100
IC, COLLECTOR CURRENT (mA)

500

Figure 2. Saturation and On Voltages

100

1000

C, CAPACITANCE (pF)

VCE = 5 V
TJ = 25C

100

10
0.6 1

10
100
IC, COLLECTOR CURRENT (mA)

Figure 3. CurrentGain Bandwidth Product

2100

600

Cib

10

1
0.1

Cob

10
VR, REVERSE VOLTAGE (VOLTS)

100

Figure 4. Capacitances

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Current Transistors

NPN Silicon

BC489,A,B
COLLECTOR
1
2
BASE
3
EMITTER

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

80

Vdc

Collector Base Voltage

VCBO

80

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

0.5

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

80

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

80

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

ICBO

100

nAdc

40
60
100
160
15

160
260

400
250
400

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 60 Vdc, IE = 0)

ON CHARACTERISTICS*
DC Current Gain
(IC = 10 mAdc, VCE = 2.0 Vdc)
(IC = 100 mAdc, VCE = 2.0 Vdc)

hFE
BC489
BC489A
BC489B

(IC = 1.0 Adc, VCE = 5.0 Vdc)*

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2101

BC489,A,B

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Characteristic

Symbol

Min

Typ

Max

Unit

0.2
0.3

0.5

0.85
0.9

1.2

fT

200

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cob

7.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cib

50

pF

ON CHARACTERISTICS* (Continued)
Collector Emitter Saturation Voltage
(IC = 500 mAdc, IB = 50 mAdc)
(IC = 1.0 Adc, IB = 100 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)
(IC = 1.0 Adc, IB = 100 mAdc)(1)

VBE(sat)

Vdc

Vdc

DYNAMIC CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 50 mAdc, VCE = 2.0 Vdc, f = 100 MHz)

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.

TURNON TIME

100
+10 V

RB

Vin

0
tr = 3.0 ns

5.0 F

+VBB

VCC
+40 V

1.0 V

5.0 s

TURNOFF TIME

100

VCC
+40 V

100

RL
OUTPUT

RB

Vin
5.0 F

*CS < 6.0 pF

100

RL
OUTPUT

*CS < 6.0 pF

5.0 s
tr = 3.0 ns
* Total Shunt Capacitance of Test Jig and Connectors
For PNP Test Circuits, Reverse All Voltage Polarities

Figure 1. Switching Time Test Circuits

2102

Motorola SmallSignal Transistors, FETs and Diodes Device Data

300

80
VCE = 2.0 V
TJ = 25C

200

TJ = 25C

60
40
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

BC489,A,B

100
70
50

Cibo

20

10
8.0
6.0

30
2.0

3.0

5.0 7.0 10
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

4.0
0.1

200

Cobo
0.2

0.5 1.0 2.0


5.0 10
20
VR, REVERSE VOLTAGE (VOLTS)

Figure 2. CurrentGain Bandwidth Product

50

100

Figure 3. Capacitance

1.0 k
700
500

ts

300
t, TIME (ns)

200
100
70
50
30
20

tf
VCC = 40 V
IC/IB = 10
IB1 = IB2
TJ = 25C

10
5.0 7.0

10

tr
td @ VBE(off) = 0.5 V
20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

Figure 4. Switching Time

1.0
0.7
0.5

D = 0.5
0.2
0.1

0.3
0.2

P(pk)
t1

0.02

0.1
0.07
0.05

t2
DUTY CYCLE, D = t1/t2
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN469)
TJ(pk) TC = P(pk) ZJC(t)
TJ(pk) TA = P(pk) ZJA(t)

0.01
SINGLE PULSE

0.03

SINGLE PULSE

ZJC(t) = r(t) RJC


ZJA(t) = r(t) RJA

0.02
0.01
1.0

2.0

5.0

10

20

50

100

200
500
t, TIME (ms)

1.0 k

2.0 k

5.0 k

10 k

20 k

50 k

100 k

Figure 5. Thermal Response

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2103

IC, COLLECTOR CURRENT (mA)

BC489,A,B

1.0 k
700
500

100 s
1.0 ms

1.0 s

300
200

TC = 25C

TA = 25C

100
70
50

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

30
20

BC489
10
1.0

20 30
50
2.0 3.0
5.0 7.0 10
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

70

100

Figure 6. Active Region Safe Operating Area

400

hFE , DC CURRENT GAIN

TJ =125C

VCE = 1.0 V

200
25C
55C
100
80
60
40
0.5

0.7

1.0

2.0

3.0

5.0

7.0
10
20
30
IC, COLLECTOR CURRENT (mA)

50

70

100

200

300

500

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. DC Current Gain

1.0
TJ = 25C
V, VOLTAGE (VOLTS)

0.8
VBE(sat) @ IC/IB = 10
0.6

VBE(on) @ VCE = 1.0 V

0.4

0.2
VCE(sat) @ IC/IB = 10
0
0.5

1.0

2.0

5.0
10
50
100
20
IC, COLLECTOR CURRENT (mA)

Figure 8. On Voltages

2104

200

500

1.0
TJ = 25C
0.8

0.6

50
IC = 10 mA
mA

100 mA

250 mA

500 mA

0.4

0.2

0
0.05

0.1

0.2

0.5
2.0
5.0
1.0
10
IC, COLLECTOR CURRENT (mA)

20

50

Figure 9. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.8

1.0

1.2

0.8

TJ = 25C
V, VOLTAGE (VOLTS)

RVB, TEMPERATURE COEFFICIENT (mV/C)

BC489,A,B

1.6
RVB for VBE

2.0

2.4

VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4

0.2
VCE(sat) @ IC/IB = 10

2.8
0.5

1.0

2.0

5.0
20
50
10
100
IC, COLLECTOR CURRENT (mA)

200

0
0.5

500

1.0

2.0

1.0
TJ = 25C
0.8

0.6

0.4
IC = 10 mA

50 mA 100 mA

250 mA 500 mA

0.2

0
0.05 0.1 0.2

0.5 1.0 2.0


5.0
IB, BASE CURRENT (mA)

10

20

500

Figure 11. On Voltages

RVB, TEMPERATURE COEFFICIENT (mV/C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 10. BaseEmitter Temperature Coefficient

5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mA)

50

Figure 12. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.8

1.2

1.6
RVB for VBE

2.0

2.4

2.8
0.5

1.0

2.0

5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mA)

500

Figure 13. BaseEmitter Temperature Coefficient

2105

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Current Transistors

PNP Silicon

BC490,A
COLLECTOR
1
2
BASE
3
EMITTER

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

80

Vdc

Collector Base Voltage

VCBO

80

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

Collector Current Continuous

IC

0.5

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

80

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

80

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

4.0

Vdc

ICBO

100

nAdc

40
60
100
15

140

400
250

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 60 Vdc, IE = 0)

ON CHARACTERISTICS*
DC Current Gain
(IC = 10 mAdc, VCE = 2.0 Vdc)
(IC = 100 mAdc, VCE = 2.0 Vdc)

hFE
BC490
BC490A

(IC = 1.0 Adc, VCE = 5.0 Vdc)

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2%.

2106

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC490,A

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Characteristic

Symbol

Min

Min

Max

Unit

0.25
0.5

0.5

0.9
1.0

1.2

fT

150

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cob

9.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cib

110

pF

ON CHARACTERISTICS(1) (Continued)
Collector Emitter Saturation Voltage
(IC = 500 mAdc, IB = 50 mAdc)
(IC = 1.0 Adc, IB = 100 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)
(IC = 1.0 Adc, IB = 100 mAdc)

VBE(sat)

Vdc

Vdc

DYNAMIC CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 50 mAdc, VCE = 2.0 Vdc, f = 100 MHz)

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2%.

TURNON TIME

100
+10 V

RB

Vin

0
tr = 3.0 ns

5.0 F

+VBB

VCC
+40 V

1.0 V

5.0 s

TURNOFF TIME

100

VCC
+40 V

100

RL
OUTPUT

RB

Vin
5.0 F

*CS < 6.0 pF

100

RL
OUTPUT

*CS < 6.0 pF

5.0 s
tr = 3.0 ns
* Total Shunt Capacitance of Test Jig and Connectors
For PNP Test Circuits, Reverse All Voltage Polarities

Figure 1. Switching Time Test Circuits

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2107

200

100
VCE = 2.0 V
TJ = 25C

70

TJ = 25C

Cibo

50
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

BC490,A

100
70
50

30
20

10

Cobo

30
7.0
20
2.0 3.0

5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)

200

5.0
0.1

0.2

0.5 1.0 2.0


5.0 10 20
VR, REVERSE VOLTAGE (VOLTS)

Figure 2. CurrentGain Bandwidth Product

50 100

Figure 3. Capacitance

1.0 k
700
500
ts

300
t, TIME (ns)

200
100
70
50
30
20

td @ VBE(off) = 0.5 V

tf

VCC = 40 V
IC/IB = 10
IB1 = IB2
TJ = 25C

tr
10
5.0 7.0 10 20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

Figure 4. Switching Time

1.0
0.7
0.5

D = 0.5
0.2
0.1

0.3
0.2

P(pk)
t1

0.02

0.1
0.07
0.05

t2
DUTY CYCLE, D = t1/t2
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN469)
TJ(pk) TC = P(pk) ZJC(t)
TJ(pk) TA = P(pk) ZJA(t)

0.01
SINGLE PULSE

0.03

SINGLE PULSE

ZJC(t) = r(t) RJC


ZJA(t) = r(t) RJA

0.02
0.01
1.0

2.0

5.0

10

20

50

100

200
500
t, TIME (ms)

1.0 k

2.0 k

5.0 k

10 k

20 k

50 k

100 k

Figure 5. Thermal Response

2108

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC490,A

1.0

100 s

TJ = 25C

500

0.8

300

1.0 s

200

V, VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

1.0 k
700

1.0 ms
TC = 25C

TA = 25C
100
70
50

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

30
20

0.6

VBE(on) @ VCE = 1.0 V

0.4

0.2
VCE(sat) @ IC/IB = 10

BC490
2.0 3.0 5.0 7.0 10
20 30 50 70 100
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

10
1.0

VBE(sat) @ IC/IB = 10

0
0.5

1.0

2.0

TJ = 25C
0.8
50
mA

100 mA

250 mA

500 mA

0.4

0.2

0
0.05

0.1

0.2

1.0 2.0
10
0.5
5.0
IC, COLLECTOR CURRENT (mA)

20

RVB, TEMPERATURE COEFFICIENT (mV/C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

1.0

IC = 10 mA

200

500

200

500

Figure 7. On Voltages

Figure 6. Active Region, Safe Operating Area

0.6

5.0
10
50
100
20
IC, COLLECTOR CURRENT (mA)

50

Figure 8. Collector Saturation Region

0.8
1.2

1.6

2.0
RVB for VBE
2.4

2.8
0.5

1.0

2.0

5.0
20
50
10
100
IC, COLLECTOR CURRENT (mA)

Figure 9. BaseEmitter Temperature Coefficient

400

hFE , DC CURRENT GAIN

TJ = 125C

VCE = 1.0 V

200
25C
55C
100
80
60
40
0.5

0.7

1.0

2.0

3.0

5.0

7.0
10
20
30
IC, COLLECTOR CURRENT (mA)

50

70

100

200

300

500

Figure 10. DC Current Gain

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2109

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

BC490,A

1.0
TJ = 25C
V, VOLTAGE (VOLTS)

0.8
VBE(sat) @ IC/IB = 10
0.6

VBE(on) @ VCE = 1.0 V

0.4

0.2
VCE(sat) @ IC/IB = 10
0
0.5 1.0

2.0

5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mA)

500

RVB, TEMPERATURE COEFFICIENT (mV/C)

Figure 11. On Voltages

1.0
TJ = 25C
0.8

0.6
IC = 10 mA

50
mA

100 mA

250 mA

500 mA

0.4

0.2

0
0.05 0.1

0.2

0.5 1.0 2.0


5.0
IB, BASE CURRENT (mA)

10

20

50

Figure 12. Collector Saturation Region

0.8
1.2

1.6
RVB for VBE

2.0

2.4

2.8
0.5

1.0

2.0

5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mA)

500

Figure 13. BaseEmitter Temperature Coefficient

2110

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Darlington Transistors
NPN Silicon

BC517

COLLECTOR 1
BASE
2

EMITTER 3

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

VCES

30

Vdc

Collector Base Voltage

VCB

40

Vdc

Emitter Base Voltage

VEB

10

Vdc

Collector Emitter Voltage

Collector Current Continuous

IC

1.0

Adc

Total Power Dissipation @ TA = 25C


Derate above 25C

PD

625
12

mW
mW/C

Total Power Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 2.0 mAdc, VBE = 0)

V(BR)CES

30

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 100 nAdc, IC = 0)

V(BR)EBO

10

Vdc

Collector Cutoff Current


(VCE = 30 Vdc)

ICES

500

nAdc

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

100

nAdc

OFF CHARACTERISTICS

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2111

BC517
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Typ

Max

Unit

hFE

30,000

Collector Emitter Saturation Voltage


(IC = 100 mAdc, IB = 0.1 mAdc)

VCE(sat)

1.0

Vdc

Base Emitter On Voltage


(IC = 10 mAdc, VCE = 5.0 Vdc)

VBE(on)

1.4

Vdc

fT

200

MHz

Characteristic

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 20 mAdc, VCE = 2.0 Vdc)

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(2)
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
1. Pulse Test: Pulse Width
2. fT = |hfe| ftest

v 2.0%.

RS

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

2112

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC517
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
500

2.0
BANDWIDTH = 1.0 Hz
RS 0
i n, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

200

BANDWIDTH = 1.0 Hz

100
10 A
50
100 A
20
IC = 1.0 mA
10

1.0
0.7
0.5

IC = 1.0 mA

0.3
0.2
100 A

0.1
0.07
0.05

10 A

0.03
0.02
10 20

5.0
10 20

50 100 200

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

50 k 100 k

50 100 200

50 k 100 k

Figure 3. Noise Current

14

200

BANDWIDTH = 10 Hz TO 15.7 kHz


12
BANDWIDTH = 10 Hz TO 15.7 kHz

100

NF, NOISE FIGURE (dB)

VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)

Figure 2. Noise Voltage

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

IC = 10 A

70
50

100 A

30
20

1.0 mA
10

1.0

2.0

10
10 A
8.0
100 A

6.0
4.0

IC = 1.0 mA

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

100
0

Figure 4. Total Wideband Noise Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0
1.0

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

100
0

Figure 5. Wideband Noise Figure

2113

BC517
SMALLSIGNAL CHARACTERISTICS
20
|h fe |, SMALLSIGNAL CURRENT GAIN

4.0
TJ = 25C

C, CAPACITANCE (pF)

10
7.0

Cibo
Cobo

5.0

3.0

2.0
0.04

0.1

0.2
0.4
1.0 2.0 4.0
10
VR, REVERSE VOLTAGE (VOLTS)

20

2.0

1.0
0.8
0.6
0.4

0.2
0.5

40

200 k

hFE, DC CURRENT GAIN

TJ = 125C

25C

30 k
20 k
10 k
7.0 k
5.0 k

55C
VCE = 5.0 V

3.0 k
2.0 k
5.0 7.0

10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

RV, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.4
VBE(sat) @ IC/IB = 1000
1.2
VBE(on) @ VCE = 5.0 V
1.0

0.8
VCE(sat) @ IC/IB = 1000
0.6
20 30
50 70 100 200 300
IC, COLLECTOR CURRENT (mA)

Figure 10. On Voltages

2114

0.5 10 20
50
100 200
IC, COLLECTOR CURRENT (mA)

500

TJ = 25C
2.5
IC = 10 mA

50 mA

250 mA

500 mA

2.0

1.5

1.0

0.5
0.1 0.2

0.5 1.0 2.0 5.0 10 20 50 100 200


IB, BASE CURRENT (A)

500 1000

Figure 9. Collector Saturation Region

1.6

10

2.0

3.0

Figure 8. DC Current Gain

5.0 7.0

1.0

Figure 7. High Frequency Current Gain

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. Capacitance

100 k
70 k
50 k

VCE = 5.0 V
f = 100 MHz
TJ = 25C

500

1.0

2.0

*APPLIES FOR IC/IB hFE/3.0

25C TO 125C

*RqVC FOR VCE(sat)


55C TO 25C

3.0
25C TO 125C
4.0

qVB FOR VBE


5.0

55C TO 25C

6.0
5.0 7.0 10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

Figure 11. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC517

r(t), TRANSIENT THERMAL


RESISTANCE (NORMALIZED)

1.0
0.7
0.5

D = 0.5
0.2

0.3
0.2
0.1

0.05

SINGLE PULSE

0.1
0.07
0.05

SINGLE PULSE
ZJC(t) = r(t) RJC TJ(pk) TC = P(pk) ZJC(t)
ZJA(t) = r(t) RJA TJ(pk) TA = P(pk) ZJA(t)

0.03
0.02
0.01
0.1

0.2

0.5

1.0

2.0

10

5.0

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 12. Thermal Response

IC, COLLECTOR CURRENT (mA)

1.0 k
700
500
300
200

FIGURE A

1.0 ms

tP
TA = 25C

TC = 25C

100 s

PP

1.0 s

100
70
50

PP

t1

30

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

20
10
0.4 0.6

1/f
DUTY CYCLE

1.0
2.0
4.0 6.0
10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 13. Active Region Safe Operating Area

40

+ t1 f + ttP1

PEAK PULSE POWER = PP

Design Note: Use of Transient Thermal Resistance Data

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2115

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

BC546, B

NPN Silicon

BC547, A, B, C
BC548, A, B, C
COLLECTOR
1
2
BASE
3
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

BC546

BC547

BC548

Unit

Collector Emitter Voltage

VCEO

65

45

30

Vdc

Collector Base Voltage

VCBO

80

50

30

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mA, IB = 0)

BC546
BC547
BC548

V(BR)CEO

65
45
30

Collector Base Breakdown Voltage


(IC = 100 Adc)

BC546
BC547
BC548

V(BR)CBO

80
50
30

Emitter Base Breakdown Voltage


(IE = 10 mA, IC = 0)

BC546
BC547
BC548

V(BR)EBO

6.0
6.0
6.0

Collector Cutoff Current


(VCE = 70 V, VBE = 0)
(VCE = 50 V, VBE = 0)
(VCE = 35 V, VBE = 0)
(VCE = 30 V, TA = 125C)

BC546
BC547
BC548
BC546/547/548

0.2
0.2
0.2

15
15
15
4.0

nA

ICES

REV 1

2116

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC546, B BC547, A, B, C BC548, A, B, C

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Characteristic

Symbol

Min

Typ

Max

BC547A/548A
BC546B/547B/548B
BC548C

90
150
270

(IC = 2.0 mA, VCE = 5.0 V)

BC546
BC547
BC548
BC547A/548A
BC546B/547B/548B
BC547C/BC548C

110
110
110
110
200
420

180
290
520

450
800
800
220
450
800

(IC = 100 mA, VCE = 5.0 V)

BC547A/548A
BC546B/547B/548B
BC548C

120
180
300

0.09
0.2
0.3

0.25
0.6
0.6

0.7

0.55

0.7
0.77

150
150
150

300
300
300

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 A, VCE = 5.0 V)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mA, IB = 0.5 mA)
(IC = 100 mA, IB = 5.0 mA)
(IC = 10 mA, IB = See Note 1)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mA, IB = 0.5 mA)

VBE(sat)

BaseEmitter On Voltage
(IC = 2.0 mA, VCE = 5.0 V)
(IC = 10 mA, VCE = 5.0 V)

VBE(on)

V
V

SMALLSIGNAL CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 10 mA, VCE = 5.0 V, f = 100 MHz)

fT
BC546
BC547
BC548

MHz

Output Capacitance
(VCB = 10 V, IC = 0, f = 1.0 MHz)

Cobo

1.7

4.5

pF

Input Capacitance
(VEB = 0.5 V, IC = 0, f = 1.0 MHz)

Cibo

10

pF

125
125
125
240
450

220
330
600

500
900
260
500
900

2.0
2.0
2.0

10
10
10

SmallSignal Current Gain


(IC = 2.0 mA, VCE = 5.0 V, f = 1.0 kHz)

Noise Figure
(IC = 0.2 mA, VCE = 5.0 V, RS = 2 k ,
f = 1.0 kHz, f = 200 Hz)

hfe
BC546
BC547/548
BC547A/548A
BC546B/547B/548B
BC547C/548C

NF
BC546
BC547
BC548

dB

Note 1: IB is value for which IC = 11 mA at VCE = 1.0 V.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2117

BC546, B BC547, A, B, C BC548, A, B, C

1.0
VCE = 10 V
TA = 25C

1.5

0.8

1.0
0.8
0.6
0.4

VBE(sat) @ IC/IB = 10

0.7
VBE(on) @ VCE = 10 V

0.6
0.5
0.4
0.3
0.2

0.3

VCE(sat) @ IC/IB = 10

0.1
0.2

0.2

0.5

50
1.0
20
2.0
5.0 10
IC, COLLECTOR CURRENT (mAdc)

100

0
0.1

200

Figure 1. Normalized DC Current Gain

50 70 100

1.0
VB, TEMPERATURE COEFFICIENT (mV/ C)

TA = 25C
1.6
IC = 200 mA
1.2
IC = IC = IC = 50 mA
10 mA 20 mA

IC = 100 mA

0.8

0.4

0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30


IC, COLLECTOR CURRENT (mAdc)

Figure 2. Saturation and On Voltages

2.0
VCE , COLLECTOREMITTER VOLTAGE (V)

TA = 25C

0.9
V, VOLTAGE (VOLTS)

hFE , NORMALIZED DC CURRENT GAIN

2.0

0.02

10

0.1
1.0
IB, BASE CURRENT (mA)

55C to +125C
1.2
1.6
2.0
2.4
2.8

20

10
1.0
IC, COLLECTOR CURRENT (mA)

0.2

Figure 3. Collector Saturation Region

100

Figure 4. BaseEmitter Temperature Coefficient

10

C, CAPACITANCE (pF)

7.0

TA = 25C

5.0

Cib

3.0
Cob
2.0

1.0

0.4 0.6 0.8 1.0

2.0
4.0 6.0 8.0 10
VR, REVERSE VOLTAGE (VOLTS)

Figure 5. Capacitances

2118

20

40

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

BC547/BC548
400
300
200

VCE = 10 V
TA = 25C

100
80
60
40
30
20
0.5 0.7

1.0

2.0 3.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mAdc)

30

50

Figure 6. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC546, B BC547, A, B, C BC548, A, B, C

BC547/BC548

TA = 25C

VCE = 5 V
TA = 25C

0.8
V, VOLTAGE (VOLTS)

hFE , DC CURRENT GAIN (NORMALIZED)

1.0

2.0
1.0
0.5

VBE(sat) @ IC/IB = 10
0.6
VBE @ VCE = 5.0 V
0.4

0.2
0.2
VCE(sat) @ IC/IB = 10
0

10
100
1.0
IC, COLLECTOR CURRENT (mA)

0.1 0.2

0.2

0.5

1.0

2.0

100

200

50

100

200

1.0
TA = 25C

1.6
20 mA

50 mA

100 mA

200 mA

1.2
IC =
10 mA

0.8

0.4

50

Figure 8. On Voltage

VB, TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. DC Current Gain

10 20
2.0
5.0
IC, COLLECTOR CURRENT (mA)

0.02

0.05

0.1

0.2
0.5
1.0 2.0
IB, BASE CURRENT (mA)

5.0

10

1.4

1.8
VB for VBE
55C to 125C

2.2

2.6

3.0

20

0.2

Figure 9. Collector Saturation Region

0.5

10 20
5.0
1.0 2.0
IC, COLLECTOR CURRENT (mA)

Figure 10. BaseEmitter Temperature Coefficient

BC546
f T, CURRENTGAIN BANDWIDTH PRODUCT

40

C, CAPACITANCE (pF)

TA = 25C
20
Cib
10
6.0
Cob

4.0

2.0

0.1

0.2

1.0 2.0
10 20
0.5
5.0
VR, REVERSE VOLTAGE (VOLTS)

50

100

Figure 11. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

500

VCE = 5 V
TA = 25C

200
100
50

20

1.0
5.0 10
50 100
IC, COLLECTOR CURRENT (mA)

Figure 12. CurrentGain Bandwidth Product

2119

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Low Noise Transistors


BC549B,C

NPN Silicon

BC550B,C
COLLECTOR
1
2
BASE
3
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

BC549

BC550

Unit

Collector Emitter Voltage

VCEO

30

45

Vdc

Collector Base Voltage

VCBO

30

50

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

30
45

30
50

5.0

Vdc

15
5.0

nAdc
Adc

15

nAdc

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 10 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 10 Adc, IE = 0)
Emitter Base Breakdown Voltage
(IE = 10 mAdc, IC = 0)

V(BR)CEO
BC549B,C
BC550B,C
V(BR)CBO
BC549B,C
BC550B,C
V(BR)EBO

Collector Cutoff Current


(VCB = 30 V, IE = 0)
(VCB = 30 V, IE = 0, TA = +125C)

ICBO

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

2120

Vdc

Vdc

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC549B,C BC550B,C

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Characteristic

Symbol

Min

Typ

Max

Unit

100
100
200
420

150
270
290
500

450
800

0.075
0.3
0.25

0.25
0.6
0.6

1.1

0.55

0.52
0.55
0.62

0.7

fT

250

MHz

Ccbo

2.5

pF

240
450

330
600

500
900

0.6

2.5
10

ON CHARACTERISTICS
DC Current Gain
(IC = 10 Adc, VCE = 5.0 Vdc)

hFE
BC549B/550B
BC549C/550C
BC549B/550B
BC549C/550C

(IC = 2.0 mAdc, VCE = 5.0 Vdc)


Collector Emitter Saturation Voltage
(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 10 mAdc, IB = see note 1)
(IC = 100 mAdc, IB = 5.0 mAdc, see note 2)

VCE(sat)

BaseEmitter Saturation Voltage


(IC = 100 mAdc, IB = 5.0 mAdc)

VBE(sat)

BaseEmitter On Voltage
(IC = 10 Adc, VCE = 5.0 Vdc)
(IC = 100 Adc, VCE = 5.0 Vdc)
(IC = 2.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

Vdc

Vdc
Vdc

SMALLSIGNAL CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
SmallSignal Current Gain
(IC = 2.0 mAdc, VCE = 5.0 V, f = 1.0 kHz)

hfe
BC549B/BC550B
BC549C/BC550C

Noise Figure
(IC = 200 Adc, VCE = 5.0 Vdc, RS = 2.0 k, f = 1.0 kHz)
(IC = 200 Adc, VCE = 5.0 Vdc, RS = 100 k, f = 1.0 kHz)

dB
NF1
NF2

NOTES:
1. IB is value for which IC = 11 mA at VCE = 1.0 V.
2. Pulse test = 300 s Duty cycle = 2%.

RS

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2121

BC549B,C BC550B,C

1.0
VCE = 10 V
TA = 25C

1.5

0.9

1.0
0.8
0.6
0.4

VBE(sat) @ IC/IB = 10

0.7

VBE(on) @ VCE = 10 V

0.6
0.5
0.4
0.3
0.2

0.3

VCE(sat) @ IC/IB = 10

0.1
0.2
0.2

0.5

1.0 2.0
5.0
10
20
50
IC, COLLECTOR CURRENT (mAdc)

0
0.1

100 200

Figure 2. Normalized DC Current Gain

0.2

0.5
1.0 2.0
5.0 10
20
IC, COLLECTOR CURRENT (mAdc)

50

100

Figure 3. Saturation and On Voltages

10

400
300

7.0

200
100
80
60

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

TA = 25C

0.8
V, VOLTAGE (VOLTS)

hFE, NORMALIZED DC CURRENT GAIN

2.0

VCE = 10 V
TA = 25C

40
30

TA = 25C

Cib

5.0

3.0
Cob
2.0

20

0.5 0.7

1.0

2.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mAdc)

1.0
0.4

50

0.6

1.0

r b, BASE SPREADING RESISTANCE (OHMS)

Figure 4. CurrentGain Bandwidth Product

2.0
4.0
10
VR, REVERSE VOLTAGE (VOLTS)

20

40

Figure 5. Capacitance

170
160

150
VCE = 10 V
f = 1.0 kHz
TA = 25C

140

130

120
0.1

0.2

0.5
1.0
2.0
IC, COLLECTOR CURRENT (mAdc)

5.0

10

Figure 6. Base Spreading Resistance

2122

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

BC556,B

PNP Silicon

BC557,A,B,C
BC558B

COLLECTOR
1
2
BASE
3
EMITTER

MAXIMUM RATINGS

Rating

Symbol

BC556

BC557

BC558

Unit

Collector Emitter Voltage

VCEO

65

45

30

Vdc

Collector Base Voltage

VCBO

80

50

30

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

65
45
30

80
50
30

5.0
5.0
5.0

2.0
2.0
2.0

100
100
100
4.0
4.0
4.0

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 2.0 mAdc, IB = 0)

Collector Base Breakdown Voltage


(IC = 100 Adc)

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

CollectorEmitter Leakage Current


(VCES = 40 V)
(VCES = 20 V)
(VCES = 20 V, TA = 125C)

V(BR)CEO
BC556
BC557
BC558

V(BR)CBO
BC556
BC557
BC558

V(BR)EBO
BC556
BC557
BC558

ICES
BC556
BC557
BC558
BC556
BC557
BC558

Motorola SmallSignal Transistors, FETs and Diodes Device Data

nA

2123

BC556,B BC557,A,B,C BC558B

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Characteristic

Symbol

Min

Typ

Max

120
120
120
120
180
420

90
150
270

170
290
500
120
180
300

500
800
800
220
460
800

0.075
0.3
0.25

0.3
0.6
0.65

0.7
1.0

0.55

0.62
0.7

0.7
0.82

280
320
360

3.0

6.0

2.0
2.0
2.0

10
10
10

125
125
125
240
450

220
330
600

500
900
260
500
900

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 Adc, VCE = 5.0 V)

(IC = 2.0 mAdc, VCE = 5.0 V)

(IC = 100 mAdc, VCE = 5.0 V)

hFE
BC557A
BC556B/557B/558B
BC557C
BC556
BC557
BC558
BC557A
BC556B/557B/558B
BC557C
BC557A
BC556B/557B/558B
BC557C

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 10 mAdc, IB = see Note 1)
(IC = 100 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 100 mAdc, IB = 5.0 mAdc)

VBE(sat)

BaseEmitter On Voltage
(IC = 2.0 mAdc, VCE = 5.0 Vdc)
(IC = 10 mAdc, VCE = 5.0 Vdc)

VBE(on)

SMALLSIGNAL CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 10 mA, VCE = 5.0 V, f = 100 MHz)

fT
BC556
BC557
BC558

Output Capacitance
(VCB = 10 V, IC = 0, f = 1.0 MHz)
Noise Figure
(IC = 0.2 mAdc, VCE = 5.0 V,
RS = 2.0 k , f = 1.0 kHz, f = 200 Hz)

SmallSignal Current Gain


(IC = 2.0 mAdc, VCE = 5.0 V, f = 1.0 kHz)

Cob

MHz

NF
BC556
BC557
BC558

dB

hfe
BC556
BC557/558
BC557A
BC556B/557B/558B
BC557C

pF

Note 1: IC = 10 mAdc on the constant base current characteristics, which yields the point IC = 11 mAdc, VCE = 1.0 V.

2124

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC556,B BC557,A,B,C BC558B

BC557/BC558

1.5

1.0
TA = 25C

0.9

VCE = 10 V
TA = 25C

VBE(sat) @ IC/IB = 10

0.8
V, VOLTAGE (VOLTS)

hFE , NORMALIZED DC CURRENT GAIN

2.0

1.0
0.7
0.5

0.7
VBE(on) @ VCE = 10 V

0.6
0.5
0.4
0.3
0.2

0.3

VCE(sat) @ IC/IB = 10

0.1
0.2
0.2

0.5 1.0 2.0


5.0 10 20
50
IC, COLLECTOR CURRENT (mAdc)

0
0.1 0.2

100 200

Figure 1. Normalized DC Current Gain

1.2
IC =
10 mA

IC = 50 mA

IC = 200 mA
IC = 100 mA

IC = 20 mA

0.4

0.02

VB , TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (V)

TA = 25C

55C to +125C
1.2
1.6
2.0
2.4
2.8

10 20

0.1
1.0
IB, BASE CURRENT (mA)

0.2

10
Cib

7.0

TA = 25C
5.0
Cob

3.0
2.0

1.0
0.4 0.6

1.0

2.0

4.0 6.0

10

20 30 40

10
1.0
IC, COLLECTOR CURRENT (mA)

100

Figure 4. BaseEmitter Temperature Coefficient


f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 3. Collector Saturation Region

C, CAPACITANCE (pF)

100

1.0

1.6

50

Figure 2. Saturation and On Voltages

2.0

0.8

0.5 1.0 2.0


5.0 10 20
IC, COLLECTOR CURRENT (mAdc)

400
300
200
150

VCE = 10 V
TA = 25C

100
80
60
40
30
20
0.5

1.0

2.0 3.0

5.0

10

20

30

50

VR, REVERSE VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mAdc)

Figure 5. Capacitances

Figure 6. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2125

BC556,B BC557,A,B,C BC558B

BC556

TJ = 25C

VCE = 5.0 V
TA = 25C

0.8
V, VOLTAGE (VOLTS)

hFE , DC CURRENT GAIN (NORMALIZED)

1.0

2.0
1.0
0.5

VBE(sat) @ IC/IB = 10
0.6
VBE @ VCE = 5.0 V
0.4

0.2
0.2

VCE(sat) @ IC/IB = 10
0
0.2

1.0 2.0 5.0 10 20 50 100 200


IC, COLLECTOR CURRENT (AMP)

0.1 0.2

0.5

50 100 200
5.0 10 20
1.0 2.0
IC, COLLECTOR CURRENT (mA)

Figure 8. On Voltage

2.0

1.0

1.6

1.2

IC =
10 mA

20 mA

50 mA

100 mA 200 mA

0.8

0.4
TJ = 25C
0
0.02

0.05 0.1 0.2


0.5 1.0 2.0
IB, BASE CURRENT (mA)

5.0

10

VB, TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. DC Current Gain

20

1.4

1.8

2.6

3.0
0.2

20

Cib

10
8.0
6.0

Cob

4.0
2.0
0.1 0.2

0.5 1.0 2.0


5.0 10 20
VR, REVERSE VOLTAGE (VOLTS)

Figure 11. Capacitance

2126

50 100

0.5 1.0

50
2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

100 200

Figure 10. BaseEmitter Temperature Coefficient

f T, CURRENTGAIN BANDWIDTH PRODUCT

C, CAPACITANCE (pF)

TJ = 25C

55C to 125C

2.2

Figure 9. Collector Saturation Region

40

VB for VBE

500

VCE = 5.0 V

200
100
50

20

100
1.0
10
IC, COLLECTOR CURRENT (mA)

Figure 12. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

r(t), TRANSIENT THERMAL


RESISTANCE (NORMALIZED)

BC556,B BC557,A,B,C BC558B

1.0
0.7
0.5

D = 0.5
0.2

0.3
0.2
0.1

0.05

SINGLE PULSE

0.1
0.07
0.05

SINGLE PULSE

t1
t2
DUTY CYCLE, D = t1/t2

0.03
0.02
0.01
0.1

ZJC(t) = (t) RJC


RJC = 83.3C/W MAX
ZJA(t) = r(t) RJA
RJA = 200C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) TC = P(pk) RJC(t)

P(pk)

0.2

0.5

1.0

2.0

10

5.0

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 13. Thermal Response

200
IC, COLLECTOR CURRENT (mA)

1s

3 ms

100
TA = 25C

50

TJ = 25C

BC558
BC557
BC556

10
5.0

2.0
1.0

BONDING WIRE LIMIT


THERMAL LIMIT
SECOND BREAKDOWN LIMIT

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 14 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 13. At high case or ambient temperatures, thermal
limitations will reduce the power than can be handled to values less
than the limitations imposed by second breakdown.

5.0
10
30 45 65 100
VCE, COLLECTOREMITTER VOLTAGE (V)

Figure 14. Active Region Safe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2127

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Low Noise Transistors

BC559B
BC559C
BC560C

PNP Silicon

COLLECTOR
1
2
BASE
3
EMITTER

MAXIMUM RATINGS

Rating

Symbol

BC559x

BC560C

Unit

Collector Emitter Voltage

VCEO

30

45

Vdc

Collector Base Voltage

VCBO

30

50

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

30
45

30
50

5.0

Vdc

15
5.0

nAdc
Adc

15

nAdc

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 10 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 10 Adc, IE = 0)
Emitter Base Breakdown Voltage
(IE = 10 mAdc, IC = 0)

V(BR)CEO
BC559B, C
BC560C

Vdc

V(BR)CBO
BC559B, C
BC560C
V(BR)EBO

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)
(VCB = 30 Vdc, IE = 0, TA = +125C)

ICBO

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

Vdc

replaces BC559/D

2128

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC559B BC559C BC560C


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

100
100
180
380

150
270
290
500

460
800

0.075
0.3
0.25

0.25
0.6

1.1

0.55

0.52
0.55
0.62

0.7

fT

250

MHz

Ccbo

2.5

pF

240
450

330
600

500
900

0.5

2.0
10

ON CHARACTERISTICS
DC Current Gain
(IC = 10 Adc, VCE = 5.0 Vdc)
(IC = 2.0 mAdc, VCE = 5.0 Vdc)

hFE
BC559B
BC559C/560C
BC559B
BC559C/560C

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 10 mAdc, IB = see note 1)
(IC = 100 mAdc, IB = 5.0 mAdc, see note 2)

VCE(sat)

BaseEmitter Saturation Voltage


(IC = 100 mAdc, IB = 5.0 mAdc)

VBE(sat)

BaseEmitter On Voltage
(IC = 10 Adc, VCE = 5.0 Vdc)
(IC = 100 Adc, VCE = 5.0 Vdc)
(IC = 2.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

Vdc

Vdc
Vdc

SMALLSIGNAL CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
SmallSignal Current Gain
(IC = 2.0 mAdc, VCE = 5.0 V, f = 1.0 kHz)

hfe
BC559B
BC559C/BC560C

Noise Figure
(IC = 200 Adc, VCE = 5.0 Vdc, RS = 2.0 k, f = 1.0 kHz)
(IC = 200 Adc, VCE = 5.0 Vdc, RS = 100 k, f = 1.0 kHz, f = 200 kHz)

dB
NF1
NF2

NOTES:
1. IB is value for which IC = 11 mA at VCE = 1.0 V.
2. Pulse test = 300 s Duty cycle = 2%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2129

BC559B BC559C BC560C


1.0
VCE = 10 V
TA = 25C

1.5

0.9

1.0
0.8
0.6
0.4

VBE(sat) @ IC/IB = 10

0.7

VBE(on) @ VCE = 10 V

0.6
0.5
0.4
0.3
0.2

0.3

VCE(sat) @ IC/IB = 10

0.1
0.2
0.2

0.5

0
0.1

1.0 2.0
5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mAdc)

Figure 1. Normalized DC Current Gain

0.2

0.5 1.0 2.0


5.0 10 20
IC, COLLECTOR CURRENT (mAdc)

50

100

Figure 2. Saturation and On Voltages

10

400
300

7.0

200
100
80
60

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

TA = 25C

0.8
V, VOLTAGE (VOLTS)

hFE, NORMALIZED DC CURRENT GAIN

2.0

VCE = 10 V
TA = 25C

40
30

TA = 25C

Cib

5.0

3.0
Cob
2.0

20

0.5 0.7 1.0

2.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mAdc)

1.0
0.4 0.6

50

1.0

r b, BASE SPREADING RESISTANCE (OHMS)

Figure 3. CurrentGain Bandwidth Product

2.0
4.0
10
VR, REVERSE VOLTAGE (VOLTS)

20

40

Figure 4. Capacitance

170
160

150
VCE = 10 V
f = 1.0 kHz
TA = 25C

140

130

120
0.1

0.2

0.5
1.0
2.0
IC, COLLECTOR CURRENT (mAdc)

5.0

10

Figure 5. Base Spreading Resistance

2130

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Darlington Transistors

BC618

NPN Silicon

COLLECTOR 1
BASE
2

EMITTER 3
1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

55

Vdc

Collector Base Voltage

VCBO

80

Vdc

Emitter Base Voltage

VEBO

12

Vdc

Collector Current Continuous

IC

1.0

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 10 mAdc, VBE = 0)

V(BR)CEO

55

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

80

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

12

Vdc

Collector Cutoff Current


(VCE = 60 Vdc, VBE = 0)

ICES

50

nAdc

Collector Cutoff Current


(VCB = 60 Vdc, IE = 0)

ICBO

50

nAdc

Emitter Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

50

nAdc

Characteristic

OFF CHARACTERISTICS

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2131

BC618
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Typ

Max

Unit

Collector Emitter Saturation Voltage


(IC = 200 mA, IB = 0.2 mA)

VCE(sat)

1.1

Vdc

Base Emitter Saturation Voltage


(IC = 200 mA, IB = 0.2 mA)

VBE(sat)

1.6

Vdc

DC Current Gain
(IC = 100 A, VCE = 5.0 Vdc)
(IC = 10 mA, VCE = 5.0 Vdc)
(IC = 200 mA, VCE = 5.0 Vdc)
(IC = 1.0 A, VCE = 5.0 Vdc)

hFE
2000
4000
10000
4000

50000

fT

150

MHz

Output Capacitance
(VCB = 10 V, IE = 0, f = 1.0 MHz)

Cob

4.5

7.0

pF

Input Capacitance
(VEB = 5.0 V, IE = 0, f = 1.0 MHz)

Cib

5.0

9.0

pF

Characteristic

ON CHARACTERISTICS

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 500 mA, VCE = 5.0 Vdc, P = 100 MHz)

RS

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

2132

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC618
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
500

2.0
BANDWIDTH = 1.0 Hz
RS 0
i n, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

200

BANDWIDTH = 1.0 Hz

100
10 A
50
100 A
20
IC = 1.0 mA
10

1.0
0.7
0.5

IC = 1.0 mA

0.3
0.2
100 A

0.1
0.07
0.05

10 A

0.03
0.02
10 20

5.0
10 20

50 100 200

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

50 k 100 k

50 100 200

50 k 100 k

Figure 3. Noise Current

14

200

BANDWIDTH = 10 Hz TO 15.7 kHz


12
BANDWIDTH = 10 Hz TO 15.7 kHz

100

NF, NOISE FIGURE (dB)

VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)

Figure 2. Noise Voltage

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

IC = 10 A

70
50

100 A

30
20

1.0 mA
10

1.0

2.0

10
10 A
8.0
100 A

6.0
4.0

IC = 1.0 mA

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

100
0

Figure 4. Total Wideband Noise Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0
1.0

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

100
0

Figure 5. Wideband Noise Figure

2133

BC618
SMALLSIGNAL CHARACTERISTICS
20
|h fe |, SMALLSIGNAL CURRENT GAIN

4.0
TJ = 25C

C, CAPACITANCE (pF)

10
7.0

Cibo
Cobo

5.0

3.0

2.0
0.04

0.1

0.2
0.4
1.0 2.0 4.0
10
VR, REVERSE VOLTAGE (VOLTS)

20

2.0

1.0
0.8
0.6
0.4

0.2
0.5

40

200 k

hFE, DC CURRENT GAIN

TJ = 125C

25C

30 k
20 k
10 k
7.0 k
5.0 k

55C
VCE = 5.0 V

3.0 k
2.0 k
5.0 7.0

10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

RV, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.4
VBE(sat) @ IC/IB = 1000
1.2
VBE(on) @ VCE = 5.0 V
1.0

0.8
VCE(sat) @ IC/IB = 1000
0.6
20 30
50 70 100 200 300
IC, COLLECTOR CURRENT (mA)

Figure 10. On Voltages

2134

0.5 10 20
50
100 200
IC, COLLECTOR CURRENT (mA)

500

TJ = 25C
2.5
IC = 10 mA

50 mA

250 mA

500 mA

2.0

1.5

1.0

0.5
0.1 0.2

0.5 1.0 2.0 5.0 10 20 50 100 200


IB, BASE CURRENT (A)

500 1000

Figure 9. Collector Saturation Region

1.6

10

2.0

3.0

Figure 8. DC Current Gain

5.0 7.0

1.0

Figure 7. High Frequency Current Gain

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. Capacitance

100 k
70 k
50 k

VCE = 5.0 V
f = 100 MHz
TJ = 25C

500

1.0

2.0

*APPLIES FOR IC/IB hFE/3.0

25C TO 125C

*RqVC FOR VCE(sat)


55C TO 25C

3.0
25C TO 125C
4.0

qVB FOR VBE


5.0

55C TO 25C

6.0
5.0 7.0 10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

Figure 11. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC618

r(t), TRANSIENT THERMAL


RESISTANCE (NORMALIZED)

1.0
0.7
0.5

D = 0.5
0.2

0.3
0.2
0.1

0.05

SINGLE PULSE

0.1
0.07
0.05

SINGLE PULSE
ZJC(t) = r(t) RJC TJ(pk) TC = P(pk) ZJC(t)
ZJA(t) = r(t) RJA TJ(pk) TA = P(pk) ZJA(t)

0.03
0.02
0.01
0.1

0.2

0.5

1.0

2.0

10

5.0

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 12. Thermal Response

IC, COLLECTOR CURRENT (mA)

1.0 k
700
500
300
200

FIGURE A

1.0 ms

tP
TA = 25C

TC = 25C

100 s

PP

1.0 s

100
70
50

PP

t1

30

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

20
10
0.4 0.6

1/f
DUTY CYCLE

1.0
2.0
4.0 6.0
10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 13. Active Region Safe Operating Area

40

+ t1 f + ttP1

PEAK PULSE POWER = PP

Design Note: Use of Transient Thermal Resistance Data

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2135

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Current Transistors

BC635
BC637
BC639

NPN Silicon

COLLECTOR
2
3
BASE
1
EMITTER

MAXIMUM RATINGS

Rating

Symbol

BC635

BC637

BC639

Unit

Collector Emitter Voltage

VCEO

45

60

80

Vdc

Collector Base Voltage

VCBO

45

60

80

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

0.5

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 14


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

45
60
80

45
60
80

5.0

Vdc

100
10

nAdc
Adc

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 10 mAdc, IB = 0)

Collector Base Breakdown Voltage


(IC = 100 Adc, IE = 0)

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 30 Vdc, IE = 0)
(VCB = 30 Vdc, IE = 0, TA = 125C)

V(BR)CEO
BC635
BC637
BC639

Vdc

V(BR)CBO
BC635
BC637
BC639
V(BR)EBO

Vdc

ICBO

1. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

2136

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC635 BC637 BC639


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

25
40
40
40
25

250
160
160

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 5.0 mAdc, VCE = 2.0 Vdc)
(IC = 150 mAdc, VCE = 2.0 Vdc)

hFE
BC635
BC637
BC639

(IC = 500 mA, VCE = 2.0 V)

Collector Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

0.5

Vdc

BaseEmitter On Voltage
(IC = 500 mAdc, VCE = 2.0 Vdc)

VBE(on)

1.0

Vdc

fT

200

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cob

7.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cib

50

pF

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 50 mAdc, VCE = 2.0 Vdc, f = 100 MHz)

1. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2137

BC635 BC637 BC639


500

1000

VCE = 2 V

SOA = 1S

200

PD TA 25C

hFE, DC CURRENT GAIN

IC, COLLECTOR CURRENT (mA)

500

100
50

PD TC 25C

20
10
5

100

BC635
BC637
BC639

PD TA 25C
PD TC 25C

200

2
3 4 5
7 10
20 30 40 50 70
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

50

20

100

10
30 50 100
IC, COLLECTOR CURRENT (mA)

300 500

1000

Figure 2. DC Current Gain

500

300

0.8
V, VOLTAGE (VOLTS)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 1. Active Region Safe Operating Area

VCE = 2 V

100

50

VBE(sat) @ IC/IB = 10
VBE(on) @ VCE = 2 V

0.6

0.4

0.2
VCE(sat) @ IC/IB = 10
20

10
100
IC, COLLECTOR CURRENT (mA)

1000

V, TEMPERATURE COEFFICIENTS (mV/C)

Figure 3. CurrentGain Bandwidth Product

10
100
IC, COLLECTOR CURRENT (mA)

1000

Figure 4. Saturation and On Voltages

0.2

1.0
VCE = 2 VOLTS
T = 0C to +100C
1.6
V for VBE
2.2
1

10
30 50
100
IC, COLLECTOR CURRENT (mA)

300 500

1000

Figure 5. Temperature Coefficients

2138

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Current Transistors

BC636
BC638
BC640

PNP Silicon

COLLECTOR
2
3
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

BC636

BC638

BC640

Unit

Collector Emitter Voltage

VCEO

45

60

80

Vdc

Collector Base Voltage

VCBO

45

60

80

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

0.5

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 14


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

45
60
80

45
60
80

5.0

Vdc

100
10

nAdc
Adc

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage*
(IC = 10 mAdc, IB = 0)

Collector Base Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CEO
BC636
BC638
BC640

Vdc

V(BR)CBO
BC636
BC638
BC640

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 30 Vdc, IE = 0)
(VCB = 30 Vdc, IE = 0, TA = 125C)

V(BR)EBO

Vdc

ICBO

1. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2139

BC636 BC638 BC640


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

25
40
40
40
25

250
160
160

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 5.0 mAdc, VCE = 2.0 Vdc)
(IC = 150 mAdc, VCE = 2.0 Vdc)

hFE
BC636
BC638
BC640

(IC = 500 mA, VCE = 2.0 V)

Collector Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

0.25
0.5

0.5

Vdc

BaseEmitter On Voltage
(IC = 500 mAdc, VCE = 2.0 Vdc)

VBE(on)

1.0

Vdc

fT

150

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cob

9.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cib

110

pF

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 50 mAdc, VCE = 2.0 Vdc, f = 100 MHz)

1. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

2140

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC636 BC638 BC640


500

1000

200

VCE = 2 V

SOA = 1S

PD TA 25C

hFE, DC CURRENT GAIN

IC, COLLECTOR CURRENT (mA)

500

100
50

PD TC 25C

20
10
5
2
1
1

200
A

50

BC636
BC638
BC640

PD TA 25C
PD TC 25C

100

20

2 3 4 5 7 10
20 3040 50 70 100
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

10
30 50 100
IC, COLLECTOR CURRENT (mA)

300 500 1000

Figure 2. DC Current Gain

500

300

0.8
V, VOLTAGE (VOLTS)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 1. Active Region Safe Operating Area

VCE = 2 V

100

50

VBE(sat) @ IC/IB = 10
VBE(on) @ VCE = 2 V

0.6

0.4

0.2
VCE(sat) @ IC/IB = 10
20
1

10
100
IC, COLLECTOR CURRENT (mA)

1000

V, TEMPERATURE COEFFICIENTS (mV/C)

Figure 3. Current Gain Bandwidth Product

100
10
IC, COLLECTOR CURRENT (mA)

1000

Figure 4. Saturation and On Voltages

0.2

1.0
VCE = 2 VOLTS
T = 0C to +100C
1.6
V for VBE
2.2
1

10
30 50 100
IC, COLLECTOR CURRENT (mA)

300 500 1000

Figure 5. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2141

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors


PNP Silicon

COLLECTOR
3

BC807-16LT1
BC807-25LT1
BC807-40LT1

2
BASE
1
EMITTER

3
1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

45

Collector Base Voltage

VCBO

50

Emitter Base Voltage

VEBO

5.0

IC

500

mAdc

Symbol

Max

Unit

225
1.8

mW
mW/C

556

C/W

300
2.4

mW
mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR 5 Board, (1)
TA = 25C
Derate above 25C

PD

Thermal Resistance, Junction to Ambient

RqJA

Total Device Dissipation


Alumina Substrate, (2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

PD

DEVICE MARKING
BC80716LT1 = 5A; BC80725LT1 = 5B; BC80740LT1 = 5C

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted.)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 10 mA)

V(BR)CEO

45

Collector Emitter Breakdown Voltage


(VEB = 0, IC = 10 A)

V(BR)CES

50

Emitter Base Breakdown Voltage


(IE = 1.0 mA)

V(BR)EBO

5.0

100
5.0

nA
A

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 20 V)
(VCB = 20 V, TJ = 150C)

ICBO

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.

REV 1

2142

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC807-16LT1 BC807-25LT1 BC807-40LT1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

100
160
250
40

250
400
600

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 mA, VCE = 1.0 V)

hFE
BC80716
BC80725
BC80740

(IC = 500 mA, VCE = 1.0 V)

Collector Emitter Saturation Voltage


(IC = 500 mA, IB = 50 mA)

VCE(sat)

0.7

Base Emitter On Voltage


(IC = 500 mA, IB = 1.0 V)

VBE(on)

1.2

fT

100

MHz

Cobo

10

pF

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mA, VCE = 5.0 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 V, f = 1.0 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2143

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors


NPN Silicon

COLLECTOR
3

BC817-16LT1
BC817-25LT1
BC817-40LT1

1
BASE
2
EMITTER

3
1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

45

Collector Base Voltage

VCBO

50

Emitter Base Voltage

VEBO

5.0

IC

500

mAdc

Symbol

Max

Unit

225
1.8

mW
mW/C

556

C/W

300
2.4

mW
mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR 5 Board, (1)
TA = 25C
Derate above 25C

PD

Thermal Resistance, Junction to Ambient

RqJA

Total Device Dissipation


Alumina Substrate, (2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

PD

DEVICE MARKING
BC81716LT1 = 6A; BC81725LT1 = 6B; BC81740LT1 = 6C

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 10 mA)

V(BR)CEO

45

Collector Emitter Breakdown Voltage


(VEB = 0, IC = 10 A)

V(BR)CES

50

Emitter Base Breakdown Voltage


(IE = 1.0 mA)

V(BR)EBO

5.0

100
5.0

nA
A

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 20 V)
(VCB = 20 V, TA = 150C)

ICBO

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.

REV 2

2144

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC817-16LT1 BC817-25LT1 BC817-40LT1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

100
160
250
40

250
400
600

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 mA, VCE = 1.0 V)

hFE
BC81716
BC81725
BC81740

(IC = 500 mA, VCE = 1.0 V)

Collector Emitter Saturation Voltage


(IC = 500 mA, IB = 50 mA)

VCE(sat)

0.7

Base Emitter On Voltage


(IC = 500 mA, VCE = 1.0 V)

VBE(on)

1.2

fT

100

MHz

Cobo

10

pF

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mA, VCE = 5.0 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 V, f = 1.0 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2145

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors


COLLECTOR
3

NPN Silicon

BC846ALT1,BLT1
BC847ALT1,
BLT1,CLT1 thru

1
BASE

BC850BLT1,CLT1
2
EMITTER

BC846, BC847 and BC848 are


Motorola Preferred Devices

MAXIMUM RATINGS
Symbol

BC846

BC847
BC850

BC848
BC849

Unit

Collector Emitter Voltage

VCEO

65

45

30

Collector Base Voltage

VCBO

80

50

30

Emitter Base Voltage

VEBO

6.0

6.0

5.0

IC

100

100

100

mAdc

Rating

Collector Current Continuous

3
1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

225
1.8

mW
mW/C

556

C/W

300
2.4

mW
mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation FR 5 Board, (1)


TA = 25C
Derate above 25C

PD

Thermal Resistance, Junction to Ambient

RqJA

Total Device Dissipation


Alumina Substrate, (2) TA = 25C
Derate above 25C

PD

Thermal Resistance, Junction to Ambient


Junction and Storage Temperature

DEVICE MARKING
BC846ALT1 = 1A; BC846BLT1 = 1B; BC847ALT1 = 1E; BC847BLT1 = 1F;
BC847CLT1 = 1G; BC848ALT1 = 1J; BC848BLT1 = 1K; BC848CLT1 = 1L

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage BC846A,B


(IC = 10 mA)
BC847A,B,C, BC850B,C
BC848A,B,C, BC849B,C

V(BR)CEO

65
45
30

Collector Emitter Breakdown Voltage BC846A,B


(IC = 10 A, VEB = 0)
BC847A,B,C, BC850B,C
BC848A,B,C, BC849B,C

V(BR)CES

80
50
30

Collector Base Breakdown Voltage


(IC = 10 mA)

BC846A,B
BC847A,B,C, BC850B,C
BC848A,B,C, BC849B,C

V(BR)CBO

80
50
30

Emitter Base Breakdown Voltage


(IE = 1.0 mA)

BC846A,B
BC847A,B,C
BC848A,B,C, BC849B,C, BC850B,C

V(BR)EBO

6.0
6.0
5.0

ICBO

15
5.0

nA
A

OFF CHARACTERISTICS

Collector Cutoff Current (VCB = 30 V)


(VCB = 30 V, TA = 150C)
1. FR5 = 1.0 x 0.75 x 0.062 in

2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2146

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC846ALT1,BLT1 BC847ALT1, BLT1,CLT1 thru BC850BLT1,CLT1

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Characteristic

Symbol

Min

Typ

Max

Unit

hFE

90
150
270

110
200
420

180
290
520

220
450
800

ON CHARACTERISTICS
DC Current Gain
(IC = 10 A, VCE = 5.0 V)

(IC = 2.0 mA, VCE = 5.0 V)

BC846A, BC847A, BC848A


BC846B, BC847B, BC848B
BC847C, BC848C
BC846A, BC847A, BC848A
BC846B, BC847B, BC848B, BC849B, BC850B
BC847C, BC848C, BC849C, BC850C

Collector Emitter Saturation Voltage (IC = 10 mA, IB = 0.5 mA)


Collector Emitter Saturation Voltage (IC = 100 mA, IB = 5.0 mA)

VCE(sat)

0.25
0.6

Base Emitter Saturation Voltage (IC = 10 mA, IB = 0.5 mA)


Base Emitter Saturation Voltage (IC = 100 mA, IB = 5.0 mA)

VBE(sat)

0.7
0.9

Base Emitter Voltage (IC = 2.0 mA, VCE = 5.0 V)


Base Emitter Voltage (IC = 10 mA, VCE = 5.0 V)

VBE(on)

580

660

700
770

mV

fT

100

MHz

Cobo

4.5

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mA, VCE = 5.0 Vdc, f = 100 MHz)
Output Capacitance (VCB = 10 V, f = 1.0 MHz)
Noise Figure (IC = 0.2 mA,
VCE = 5.0 Vdc, RS = 2.0 k,
f = 1.0 kHz, BW = 200 Hz)

BC846A, BC847A, BC848A


BC846B, BC847B, BC848B
BC847C, BC848C
BC849B,C, BC850B,C

0.8
V, VOLTAGE (VOLTS)

hFE , NORMALIZED DC CURRENT GAIN

10
4.0

TA = 25C

0.9

1.0
0.8
0.6
0.4

VBE(sat) @ IC/IB = 10

0.7
VBE(on) @ VCE = 10 V

0.6
0.5
0.4
0.3
0.2

0.3

VCE(sat) @ IC/IB = 10

0.1
0.2

0.5

50
1.0
20
2.0
5.0 10
IC, COLLECTOR CURRENT (mAdc)

100

0
0.1

200

Figure 1. Normalized DC Current Gain

0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30


IC, COLLECTOR CURRENT (mAdc)

50 70 100

Figure 2. Saturation and On Voltages

2.0

1.0
VB, TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (V)

1.0
VCE = 10 V
TA = 25C

1.5

TA = 25C
1.6
IC = 200 mA
1.2
IC = IC = IC = 50 mA
10 mA 20 mA

IC = 100 mA

0.8

0.4

dB

2.0

0.2

pF

NF

0.02

0.1
1.0
IB, BASE CURRENT (mA)

10

20

Figure 3. Collector Saturation Region


Motorola SmallSignal Transistors, FETs and Diodes Device Data

55C to +125C
1.2
1.6
2.0
2.4
2.8

0.2

10
1.0
IC, COLLECTOR CURRENT (mA)

100

Figure 4. BaseEmitter Temperature Coefficient


2147

BC846ALT1,BLT1 BC847ALT1, BLT1,CLT1 thru BC850BLT1,CLT1

10

C, CAPACITANCE (pF)

7.0

TA = 25C

5.0

Cib

3.0
Cob
2.0

1.0

0.4 0.6 0.8 1.0

4.0 6.0 8.0 10


2.0
VR, REVERSE VOLTAGE (VOLTS)

40

20

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

BC847/BC848
400
300
200

VCE = 10 V
TA = 25C

100
80
60
40
30
20
0.5 0.7

Figure 5. Capacitances

1.0

2.0 3.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mAdc)

30

50

Figure 6. CurrentGain Bandwidth Product

TA = 25C

VCE = 5 V
TA = 25C

0.8
V, VOLTAGE (VOLTS)

hFE , DC CURRENT GAIN (NORMALIZED)

1.0

2.0
1.0
0.5

VBE(sat) @ IC/IB = 10
0.6
VBE @ VCE = 5.0 V
0.4

0.2
0.2
VCE(sat) @ IC/IB = 10
0

10
100
1.0
IC, COLLECTOR CURRENT (mA)

0.1 0.2

0.2

0.5

2.0

50

100

200

50

100

200

1.0
TA = 25C

1.6
20 mA

50 mA

100 mA

200 mA

1.2
IC =
10 mA

0.8

0.4

10 20
2.0
5.0
IC, COLLECTOR CURRENT (mA)

Figure 8. On Voltage

VB, TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. DC Current Gain

1.0

0.02

0.05

0.1

0.2
0.5
1.0 2.0
IB, BASE CURRENT (mA)

5.0

10

Figure 9. Collector Saturation Region

2148

20

1.4

1.8
VB for VBE
55C to 125C

2.2

2.6

3.0
0.2

0.5

10 20
1.0 2.0
5.0
IC, COLLECTOR CURRENT (mA)

Figure 10. BaseEmitter Temperature Coefficient

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC846ALT1,BLT1 BC847ALT1, BLT1,CLT1 thru BC850BLT1,CLT1

BC846

f T, CURRENTGAIN BANDWIDTH PRODUCT

40

C, CAPACITANCE (pF)

TA = 25C
20
Cib
10
6.0
Cob

4.0

2.0

0.1

0.2

0.5
5.0
1.0 2.0
10 20
VR, REVERSE VOLTAGE (VOLTS)

50

100

Figure 11. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

500

VCE = 5 V
TA = 25C

200
100
50

20

1.0
5.0 10
50 100
IC, COLLECTOR CURRENT (mA)

Figure 12. CurrentGain Bandwidth Product

2149

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors

BC846AWT1,BWT1

NPN Silicon

BC847AWT1,BWT1,

These transistors are designed for general purpose amplifier


applications. They are housed in the SOT323/SC70 which is
designed for low power surface mount applications.

COLLECTOR
3

CWT1
BC848AWT1,BWT1,
CWT1

1
BASE
2
EMITTER

MAXIMUM RATINGS
Rating

Symbol

BC846

BC847

BC848

Unit

Collector Emitter Voltage

VCEO

65

45

30

Collector Base Voltage

VCBO

80

50

30

Emitter Base Voltage

VEBO

6.0

6.0

5.0

IC

100

100

100

mAdc

Collector Current Continuous

1
2

CASE 41902, STYLE 3


SOT323/SC70

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board, (1)


TA = 25C

PD

150

mW

Thermal Resistance, Junction to Ambient

RqJA

833

C/W

PD

2.4

mW/C

TJ, Tstg

55 to +150

Total Device Dissipation


Junction and Storage Temperature

DEVICE MARKING
BC846AWT1 = 1A; BC846BWT1 = 1B; BC847AWT1 = 1E; BC847BWT1 = 1F;
BC847CWT1 = 1G; BC848AWT1 = 1J; BC848BWT1 = 1K; BC848CWT1 = 1L

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 10 mA)

BC846 Series
BC847 Series
BC848 Series

V(BR)CEO

65
45
30

Collector Emitter Breakdown Voltage


(IC = 10 A, VEB = 0)

BC846 Series
BC847 Series
BC848 Series

V(BR)CES

80
50
30

Collector Base Breakdown Voltage


(IC = 10 mA)

BC846 Series
BC847 Series
BC848 Series

V(BR)CBO

80
50
30

Emitter Base Breakdown Voltage


(IE = 1.0 mA)

BC846 Series
BC847 Series
BC848 Series

V(BR)EBO

6.0
6.0
5.0

ICBO

15
5.0

nA
A

Collector Cutoff Current (VCB = 30 V)


(VCB = 30 V, TA = 150C)
1. FR5 = 1.0 x 0.75 x 0.062 in

2150

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC846AWT1,BWT1 BC847AWT1,BWT1,CWT1 BC848AWT1,BWT1,CWT1

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Characteristic

Symbol

Min

Typ

Max

Unit

hFE

90
150
270

110
200
420

180
290
520

220
450
800

ON CHARACTERISTICS
DC Current Gain
(IC = 10 A, VCE = 5.0 V)

(IC = 2.0 mA, VCE = 5.0 V)

BC846A, BC847A, BC848A


BC846B, BC847B, BC848B
BC847C, BC848C
BC846A, BC847A, BC848A
BC846B, BC847B, BC848B
BC847C, BC848C

Collector Emitter Saturation Voltage (IC = 10 mA, IB = 0.5 mA)


Collector Emitter Saturation Voltage (IC = 100 mA, IB = 5.0 mA)

VCE(sat)

0.25
0.6

Base Emitter Saturation Voltage (IC = 10 mA, IB = 0.5 mA)


Base Emitter Saturation Voltage (IC = 100 mA, IB = 5.0 mA)

VBE(sat)

0.7
0.9

Base Emitter Voltage (IC = 2.0 mA, VCE = 5.0 V)


Base Emitter Voltage (IC = 10 mA, VCE = 5.0 V)

VBE(on)

580

660

700
770

mV

fT

100

MHz

Cobo

4.5

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mA, VCE = 5.0 Vdc, f = 100 MHz)
Output Capacitance (VCB = 10 V, f = 1.0 MHz)
Noise Figure (IC = 0.2 mA,
VCE = 5.0 Vdc, RS = 2.0 k,
f = 1.0 kHz, BW = 200 Hz)

BC846A, BC847A, BC848A


BC846B, BC847B, BC848B
BC847C, BC848C

0.8
V, VOLTAGE (VOLTS)

hFE , NORMALIZED DC CURRENT GAIN

10
4.0

TA = 25C

0.9

1.0
0.8
0.6
0.4

VBE(sat) @ IC/IB = 10

0.7
VBE(on) @ VCE = 10 V

0.6
0.5
0.4
0.3
0.2

0.3

VCE(sat) @ IC/IB = 10

0.1
0.2

0.5

50
2.0
5.0 10
1.0
20
IC, COLLECTOR CURRENT (mAdc)

100

0
0.1

200

Figure 1. Normalized DC Current Gain

0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30


IC, COLLECTOR CURRENT (mAdc)

50 70 100

Figure 2. Saturation and On Voltages

2.0

1.0
VB, TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (V)

1.0
VCE = 10 V
TA = 25C

1.5

TA = 25C
1.6
IC = 200 mA
1.2
IC = IC = IC = 50 mA
10 mA 20 mA

IC = 100 mA

0.8

0.4

dB

2.0

0.2

pF

NF

0.02

0.1
1.0
IB, BASE CURRENT (mA)

10

20

Figure 3. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

55C to +125C
1.2
1.6
2.0
2.4
2.8

0.2

10
1.0
IC, COLLECTOR CURRENT (mA)

100

Figure 4. BaseEmitter Temperature Coefficient

2151

BC846AWT1,BWT1 BC847AWT1,BWT1,CWT1 BC848AWT1,BWT1,CWT1

10

C, CAPACITANCE (pF)

7.0

TA = 25C

5.0

Cib

3.0
Cob
2.0

1.0

0.4 0.6 0.8 1.0

4.0 6.0 8.0 10


2.0
VR, REVERSE VOLTAGE (VOLTS)

40

20

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

BC847/BC848
400
300
200

VCE = 10 V
TA = 25C

100
80
60
40
30
20
0.5 0.7

Figure 5. Capacitances

1.0

2.0 3.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mAdc)

30

50

Figure 6. CurrentGain Bandwidth Product

TA = 25C

VCE = 5 V
TA = 25C

0.8
V, VOLTAGE (VOLTS)

hFE , DC CURRENT GAIN (NORMALIZED)

1.0

2.0
1.0
0.5

VBE(sat) @ IC/IB = 10
0.6
VBE @ VCE = 5.0 V
0.4

0.2
0.2
VCE(sat) @ IC/IB = 10
0

10
100
1.0
IC, COLLECTOR CURRENT (mA)

0.1 0.2

0.2

0.5

2.0

50

100

200

50

100

200

1.0
TA = 25C

1.6
20 mA

50 mA

100 mA

200 mA

1.2
IC =
10 mA

0.8

0.4

10 20
2.0
5.0
IC, COLLECTOR CURRENT (mA)

Figure 8. On Voltage

VB, TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. DC Current Gain

1.0

0.02

0.05

0.1

0.2
0.5
1.0 2.0
IB, BASE CURRENT (mA)

5.0

10

Figure 9. Collector Saturation Region

2152

20

1.4

1.8
VB for VBE
55C to 125C

2.2

2.6

3.0
0.2

0.5

10 20
1.0 2.0
5.0
IC, COLLECTOR CURRENT (mA)

Figure 10. BaseEmitter Temperature Coefficient

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC846AWT1,BWT1 BC847AWT1,BWT1,CWT1 BC848AWT1,BWT1,CWT1

BC846

f T, CURRENTGAIN BANDWIDTH PRODUCT

40

C, CAPACITANCE (pF)

TA = 25C
20
Cib
10
6.0
Cob

4.0

2.0

0.1

0.2

0.5
5.0
1.0 2.0
10 20
VR, REVERSE VOLTAGE (VOLTS)

50

100

Figure 11. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

500

VCE = 5 V
TA = 25C

200
100
50

20

1.0
5.0 10
50 100
IC, COLLECTOR CURRENT (mA)

Figure 12. CurrentGain Bandwidth Product

2153

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors

PNP Silicon

BC856ALT1,BLT1
COLLECTOR
3

BC857ALT1,BLT1
BC858ALT1,BLT1,
CLT1

1
BASE

Motorola Preferred Devices

2
EMITTER

MAXIMUM RATINGS
Rating

Symbol

BC856

BC857

BC858

Unit

Collector Emitter Voltage

VCEO

65

45

30

Collector Base Voltage

VCBO

80

50

30

Emitter Base Voltage

VEBO

5.0

5.0

5.0

IC

100

100

100

mAdc

Collector Current Continuous

3
1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

225
1.8

mW
mW/C

556

C/W

300
2.4

mW
mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation FR 5 Board, (1)


TA = 25C
Derate above 25C

PD

Thermal Resistance, Junction to Ambient

RqJA

Total Device Dissipation


Alumina Substrate, (2) TA = 25C
Derate above 25C

PD

Thermal Resistance, Junction to Ambient


Junction and Storage Temperature

DEVICE MARKING
BC856ALT1 = 3A; BC856BLT1 = 3B; BC857ALT1 = 3E; BC857BLT1 = 3F;
BC858ALT1 = 3J; BC858BLT1 = 3K; BC858CLT1 = 3L

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 10 mA)

BC856 Series
BC857 Series
BC858 Series

V(BR)CEO

65
45
30

Collector Emitter Breakdown Voltage


(IC = 10 A, VEB = 0)

BC856 Series
BC857 Series
BC858 Series

V(BR)CES

80
50
30

Collector Base Breakdown Voltage


(IC = 10 mA)

BC856 Series
BC857 Series
BC858 Series

V(BR)CBO

80
50
30

Emitter Base Breakdown Voltage


(IE = 1.0 mA)

BC856 Series
BC857 Series
BC858 Series

V(BR)EBO

5.0
5.0
5.0

ICBO

15
4.0

nA
A

Collector Cutoff Current (VCB = 30 V)


Collector Cutoff Current (VCB = 30 V, TA = 150C)
1. FR5 = 1.0 x 0.75 x 0.062 in

2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2154

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC856ALT1,BLT1 BC857ALT1,BLT1 BC858ALT1,BLT1,CLT1

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Symbol

Min

Typ

Max

Unit

hFE

90
150
270

125
220
420

180
290
520

250
475
800

0.3
0.65

0.7
0.9

0.6

0.75
0.82

fT

100

MHz

Output Capacitance
(VCB = 10 V, f = 1.0 MHz)

Cob

4.5

pF

Noise Figure
(IC = 0.2 mA, VCE = 5.0 Vdc, RS = 2.0 k, f = 1.0 kHz, BW = 200 Hz)

NF

10

dB

Characteristic

ON CHARACTERISTICS
DC Current Gain
(IC = 10 A, VCE = 5.0 V)

(IC = 2.0 mA, VCE = 5.0 V)

BC856A, BC857A, BC585A


BC856A, BC857A, BC858A
BC858C
BC856A, BC857A, BC858A
BC856B, BC857B, BC858B
BC858C

Collector Emitter Saturation Voltage


(IC = 10 mA, IB = 0.5 mA)
(IC = 100 mA, IB = 5.0 mA)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mA, IB = 0.5 mA)
(IC = 100 mA, IB = 5.0 mA)

VBE(sat)

Base Emitter On Voltage


(IC = 2.0 mA, VCE = 5.0 V)
(IC = 10 mA, VCE = 5.0 V)

VBE(on)

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mA, VCE = 5.0 Vdc, f = 100 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2155

BC856ALT1,BLT1 BC857ALT1,BLT1 BC858ALT1,BLT1,CLT1

BC857/BC858

1.5

1.0
TA = 25C

0.9

VCE = 10 V
TA = 25C

VBE(sat) @ IC/IB = 10

0.8
V, VOLTAGE (VOLTS)

hFE , NORMALIZED DC CURRENT GAIN

2.0

1.0
0.7
0.5

0.7
VBE(on) @ VCE = 10 V

0.6
0.5
0.4
0.3
0.2

0.3

VCE(sat) @ IC/IB = 10

0.1
0.2
0.2

0.5 1.0 2.0


5.0 10 20
50
IC, COLLECTOR CURRENT (mAdc)

0
0.1 0.2

100 200

Figure 1. Normalized DC Current Gain

1.2
IC =
10 mA

IC = 50 mA

IC = 200 mA
IC = 100 mA

IC = 20 mA

0.4

0.02

VB , TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (V)

TA = 25C

55C to +125C
1.2
1.6
2.0
2.4
2.8

10 20

0.1
1.0
IB, BASE CURRENT (mA)

0.2

10
Cib

7.0
C, CAPACITANCE (pF)

TA = 25C
5.0
Cob

3.0
2.0

1.0
0.4 0.6

1.0

2.0

4.0 6.0

10

20 30 40

10
1.0
IC, COLLECTOR CURRENT (mA)

100

Figure 4. BaseEmitter Temperature Coefficient


f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 3. Collector Saturation Region

2156

100

1.0

1.6

50

Figure 2. Saturation and On Voltages

2.0

0.8

0.5 1.0 2.0


5.0 10 20
IC, COLLECTOR CURRENT (mAdc)

400
300
200
150

VCE = 10 V
TA = 25C

100
80
60
40
30
20
0.5

1.0

2.0 3.0

5.0

10

20

30

50

VR, REVERSE VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mAdc)

Figure 5. Capacitances

Figure 6. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC856ALT1,BLT1 BC857ALT1,BLT1 BC858ALT1,BLT1,CLT1

BC856

TJ = 25C

VCE = 5.0 V
TA = 25C

0.8
V, VOLTAGE (VOLTS)

hFE , DC CURRENT GAIN (NORMALIZED)

1.0

2.0
1.0
0.5

VBE(sat) @ IC/IB = 10
0.6
VBE @ VCE = 5.0 V
0.4

0.2
0.2

VCE(sat) @ IC/IB = 10
0
0.2

1.0 2.0 5.0 10 20 50 100 200


IC, COLLECTOR CURRENT (AMP)

0.1 0.2

0.5

50 100 200
5.0 10 20
1.0 2.0
IC, COLLECTOR CURRENT (mA)

Figure 8. On Voltage

2.0

1.0

1.6

1.2

IC =
10 mA

20 mA

50 mA

100 mA 200 mA

0.8

0.4
TJ = 25C
0
0.02

0.05 0.1 0.2


0.5 1.0 2.0
IB, BASE CURRENT (mA)

5.0

10

VB, TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. DC Current Gain

20

1.4

1.8

2.6

3.0
0.2

20

Cib

10
8.0
6.0

Cob

4.0
2.0
0.1 0.2

0.5 1.0 2.0


5.0 10 20
VR, REVERSE VOLTAGE (VOLTS)

0.5 1.0

50
2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

100 200

Figure 10. BaseEmitter Temperature Coefficient

f T, CURRENTGAIN BANDWIDTH PRODUCT

C, CAPACITANCE (pF)

TJ = 25C

55C to 125C

2.2

Figure 9. Collector Saturation Region

40

VB for VBE

50 100

Figure 11. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

500

VCE = 5.0 V

200
100
50

20

100
1.0
10
IC, COLLECTOR CURRENT (mA)

Figure 12. CurrentGain Bandwidth Product

2157

r(t), TRANSIENT THERMAL


RESISTANCE (NORMALIZED)

BC856ALT1,BLT1 BC857ALT1,BLT1 BC858ALT1,BLT1,CLT1

1.0
0.7
0.5

D = 0.5
0.2

0.3
0.2
0.1

0.05

SINGLE PULSE

0.1
0.07
0.05

SINGLE PULSE

t1
t2
DUTY CYCLE, D = t1/t2

0.03
0.02
0.01
0.1

ZJC(t) = r(t) RJC


RJC = 83.3C/W MAX
ZJA(t) = r(t) RJA
RJA = 200C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) TC = P(pk) RJC(t)

P(pk)

0.2

0.5

1.0

2.0

10

5.0

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 13. Thermal Response

200
IC, COLLECTOR CURRENT (mA)

1s

3 ms

100
50

10
5.0

2.0
1.0

TA = 25C

TJ = 25C

BC558
BC557
BC556
BONDING WIRE LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 14 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 13. At high case or ambient temperatures, thermal
limitations will reduce the power that can be handled to values less
than the limitations imposed by the secondary breakdown.

5.0
10
30 45 65 100
VCE, COLLECTOREMITTER VOLTAGE (V)

Figure 14. Active Region Safe Operating Area

2158

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors

BC856AWT1,BWT1

PNP Silicon

BC857AWT1,BWT1
BC858AWT1,BWT1,

These transistors are designed for general purpose amplifier


applications. They are housed in the SOT323/SC70 which is
designed for low power surface mount applications.

CWT1
COLLECTOR
3

Motorola Preferred Devices

1
BASE
3

2
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

BC856

BC857

BC858

Unit

Collector Emitter Voltage

VCEO

65

45

30

Collector Base Voltage

VCBO

80

50

30

Emitter Base Voltage

VEBO

5.0

5.0

5.0

IC

100

100

100

mAdc

Collector Current Continuous

CASE 41902, STYLE 3


SOT323/SC70

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board, (1)


TA = 25C

PD

150

mW

Thermal Resistance, Junction to Ambient

RqJA

833

C/W

TJ, Tstg

55 to +150

Junction and Storage Temperature

DEVICE MARKING
BC856AWT1 = 3A; BC856BWT1 = 3B; BC857AWT1 = 3E; BC857BWT1 = 3F;
BC858AWT1 = 3J; BC858BWT1 = 3K; BC858CWT1 = 3L

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 10 mA)

BC856 Series
BC857 Series
BC858 Series

V(BR)CEO

65
45
30

Collector Emitter Breakdown Voltage


(IC = 10 A, VEB = 0)

BC856 Series
BC857 Series
BC858 Series

V(BR)CES

80
50
30

Collector Base Breakdown Voltage


(IC = 10 mA)

BC856 Series
BC857 Series
BC858 Series

V(BR)CBO

80
50
30

Emitter Base Breakdown Voltage


(IE = 1.0 mA)

BC856 Series
BC857 Series
BC858 Series

V(BR)EBO

5.0
5.0
5.0

ICBO

15
4.0

nA
A

Collector Cutoff Current (VCB = 30 V)


Collector Cutoff Current (VCB = 30 V, TA = 150C)
1. FR5 = 1.0 x 0.75 x 0.062 in
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2159

BC856AWT1,BWT1 BC857AWT1,BWT1 BC858AWT1,BWT1,CWT1

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)


Symbol

Min

Typ

Max

Unit

hFE

90
150
270

125
220
420

180
290
520

250
475
800

0.3
0.65

0.7
0.9

0.6

0.75
0.82

fT

100

MHz

Output Capacitance
(VCB = 10 V, f = 1.0 MHz)

Cob

4.5

pF

Noise Figure
(IC = 0.2 mA, VCE = 5.0 Vdc, RS = 2.0 k,
f = 1.0 kHz, BW = 200 Hz)

NF

10

dB

Characteristic

ON CHARACTERISTICS
DC Current Gain
(IC = 10 A, VCE = 5.0 V)

(IC = 2.0 mA, VCE = 5.0 V)

BC856A, BC857A, BC585A


BC856A, BC857A, BC858A
BC858C
BC856A, BC857A, BC858A
BC856B, BC857B, BC858B
BC858C

Collector Emitter Saturation Voltage


(IC = 10 mA, IB = 0.5 mA)
(IC = 100 mA, IB = 5.0 mA)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mA, IB = 0.5 mA)
(IC = 100 mA, IB = 5.0 mA)

VBE(sat)

Base Emitter On Voltage


(IC = 2.0 mA, VCE = 5.0 V)
(IC = 10 mA, VCE = 5.0 V)

VBE(on)

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mA, VCE = 5.0 Vdc, f = 100 MHz)

2160

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BC856AWT1,BWT1 BC857AWT1,BWT1 BC858AWT1,BWT1,CWT1

BC857/BC858

1.5

1.0
TA = 25C

0.9

VCE = 10 V
TA = 25C

VBE(sat) @ IC/IB = 10

0.8
V, VOLTAGE (VOLTS)

hFE , NORMALIZED DC CURRENT GAIN

2.0

1.0
0.7
0.5

0.7
VBE(on) @ VCE = 10 V

0.6
0.5
0.4
0.3
0.2

0.3

VCE(sat) @ IC/IB = 10

0.1
0.2
0.2

0.5 1.0 2.0


5.0 10 20
50
IC, COLLECTOR CURRENT (mAdc)

0
0.1 0.2

100 200

Figure 1. Normalized DC Current Gain

1.2
IC =
10 mA

IC = 50 mA

IC = 200 mA
IC = 100 mA

IC = 20 mA

0.4

0.02

VB , TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (V)

TA = 25C

55C to +125C
1.2
1.6
2.0
2.4
2.8

10 20

0.1
1.0
IB, BASE CURRENT (mA)

0.2

10
Cib

7.0

TA = 25C
5.0
Cob

3.0
2.0

1.0
0.4 0.6

1.0

2.0

4.0 6.0

10

20 30 40

10
1.0
IC, COLLECTOR CURRENT (mA)

100

Figure 4. BaseEmitter Temperature Coefficient


f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 3. Collector Saturation Region

C, CAPACITANCE (pF)

100

1.0

1.6

50

Figure 2. Saturation and On Voltages

2.0

0.8

0.5 1.0 2.0


5.0 10 20
IC, COLLECTOR CURRENT (mAdc)

400
300
200
150

VCE = 10 V
TA = 25C

100
80
60
40
30
20
0.5

1.0

2.0 3.0

5.0

10

20

30

50

VR, REVERSE VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mAdc)

Figure 5. Capacitances

Figure 6. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2161

BC856AWT1,BWT1 BC857AWT1,BWT1 BC858AWT1,BWT1,CWT1

BC856

TJ = 25C

VCE = 5.0 V
TA = 25C

0.8
V, VOLTAGE (VOLTS)

hFE , DC CURRENT GAIN (NORMALIZED)

1.0

2.0
1.0
0.5

VBE(sat) @ IC/IB = 10
0.6
VBE @ VCE = 5.0 V
0.4

0.2
0.2

VCE(sat) @ IC/IB = 10
0
0.2

1.0 2.0 5.0 10 20 50 100 200


IC, COLLECTOR CURRENT (AMP)

0.1 0.2

0.5

50 100 200
5.0 10 20
1.0 2.0
IC, COLLECTOR CURRENT (mA)

Figure 8. On Voltage

2.0

1.0

1.6

1.2

IC =
10 mA

20 mA

50 mA

100 mA 200 mA

0.8

0.4
TJ = 25C
0
0.02

0.05 0.1 0.2


0.5 1.0 2.0
IB, BASE CURRENT (mA)

5.0

10

VB, TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. DC Current Gain

20

1.4

1.8

2.6

3.0
0.2

20

Cib

10
8.0
6.0

Cob

4.0
2.0
0.1 0.2

0.5 1.0 2.0


5.0 10 20
VR, REVERSE VOLTAGE (VOLTS)

Figure 11. Capacitance

2162

50 100

0.5 1.0

50
2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

100 200

Figure 10. BaseEmitter Temperature Coefficient

f T, CURRENTGAIN BANDWIDTH PRODUCT

C, CAPACITANCE (pF)

TJ = 25C

55C to 125C

2.2

Figure 9. Collector Saturation Region

40

VB for VBE

500

VCE = 5.0 V

200
100
50

20

100
1.0
10
IC, COLLECTOR CURRENT (mA)

Figure 12. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

r(t), TRANSIENT THERMAL


RESISTANCE (NORMALIZED)

BC856AWT1,BWT1 BC857AWT1,BWT1 BC858AWT1,BWT1,CWT1

1.0
0.7
0.5

D = 0.5
0.2

0.3
0.2
0.1

0.05

SINGLE PULSE

0.1
0.07
0.05

SINGLE PULSE

t1
t2
DUTY CYCLE, D = t1/t2

0.03
0.02
0.01
0.1

ZJC(t) = r(t) RJC


RJC = 83.3C/W MAX
ZJA(t) = r(t) RJA
RJA = 200C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) TC = P(pk) RJC(t)

P(pk)

0.2

0.5

1.0

2.0

10

5.0

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 13. Thermal Response

200
IC, COLLECTOR CURRENT (mA)

1s

3 ms

100
50

10
5.0

2.0
1.0

TA = 25C

TJ = 25C

BC558
BC557
BC556
BONDING WIRE LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 14 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 13. At high case or ambient temperatures, thermal
limitations will reduce the power that can be handled to values less
than the limitations imposed by the secondary breakdown.

5.0
10
30 45 65 100
VCE, COLLECTOREMITTER VOLTAGE (V)

Figure 14. Active Region Safe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2163

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BCP53T1

PNP Silicon
Epitaxial Transistor

Motorola Preferred Device

This PNP Silicon Epitaxial transistor is designed for use in audio amplifier
applications. The device is housed in the SOT-223 package which is designed for
medium power surface mount applications.

MEDIUM POWER
PNP SILICON
HIGH CURRENT
TRANSISTOR
SURFACE MOUNT

High Current: 1.5 Amps


NPN Complement is BCP56
The SOT-223 Package can be soldered using wave or reflow. The formed leads
absorb thermal stress during soldering, eliminating the possibility of damage to
the die
Available in 12 mm Tape and Reel
Use BCP53T1 to order the 7 inch/1000 unit reel.
Use BCP53T3 to order the 13 inch/4000 unit reel.

COLLECTOR 2,4
1

BASE
1

2
3

EMITTER 3

CASE 318E-04, STYLE 1


TO-261AA

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Symbol

Value

Unit

Collector-Emitter Voltage

VCEO

80

Vdc

Collector-Base Voltage

VCBO

100

Vdc

Emitter-Base Voltage

VEBO

5.0

Vdc

Collector Current

IC

1.5

Adc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

65 to 150

Symbol

Max

Unit

RJA

83.3

C/W

TL

260
10

C
Sec

Rating

Operating and Storage Temperature Range

DEVICE MARKING
AH

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance Junction-to-Ambient (surface mounted)
Lead Temperature for Soldering, 0.0625 from case
Time in Solder Bath

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2164

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCP53T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristics

Symbol

Min

Typ

Max

Unit

Collector-Base Breakdown Voltage (IC = 100 Adc, IE = 0)

V(BR)CBO

100

Vdc

Collector-Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)

V(BR)CEO

80

Vdc

Collector-Emitter Breakdown Voltage (IC = 100 Adc, RBE = 1.0 kohm)

V(BR)CER

100

Vdc

Emitter-Base Breakdown Voltage (IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector-Base Cutoff Current (VCB = 30 Vdc, IE = 0)

ICBO

100

nAdc

Emitter-Base Cutoff Current (VEB = 5.0 Vdc, IC = 0)

IEBO

10

Adc

25
40
25

250

OFF CHARACTERISTICS

ON CHARACTERISTICS
DC Current Gain
(IC = 5.0 mAdc, VCE = 2.0 Vdc)
(IC = 150 mAdc, VCE = 2.0 Vdc)
(IC = 500 mAdc, VCE = 2.0 Vdc)

hFE

Collector-Emitter Saturation Voltage (IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

0.5

Vdc

Base-Emitter On Voltage (IC = 500 mAdc, VCE = 2.0 Vdc)

VBE(on)

1.0

Vdc

fT

50

MHz

DYNAMIC CHARACTERISTICS
Current-Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 35 MHz)

500

hFE , DC CURRENT GAIN

VCE = 2 V

200

100

50

20

10
30 50 100
IC, COLLECTOR CURRENT (mA)

300 500

1000

f T , CURRENT GAIN BANDWIDTH PRODUCT (MHz)

TYPICAL ELECTRICAL CHARACTERISTICS


500
300

VCE = 2 V
100
50

20

Figure 1. DC Current Gain

Figure 2. Current Gain Bandwidth Product

V(BE)sat @ IC/IB = 10

C, CAPACITANCE (pF)

V, VOLTAGE (VOLTS)

0.8

V(BE)on @ VCE = 2 V

0.6

0.4

0.2
V(CE)sat @ IC/IB = 10
0

10

100

1000

10
100
IC, COLLECTOR CURRENT (mA)

1000

120
110
100
90
80
70
60

Cib

50
40
30
20
10
0

Cob
0

10

12

14

IC, COLLECTOR CURRENT (mA)

V, VOLTAGE (VOLTS)

Figure 3. Saturation and ON Voltages

Figure 4. Capacitances

Motorola SmallSignal Transistors, FETs and Diodes Device Data

16

18

20

2165

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BCP56T1
SERIES

NPN Silicon
Epitaxial Transistor

Motorola Preferred Device

These NPN Silicon Epitaxial transistors are designed for use in audio amplifier
applications. The device is housed in the SOT-223 package, which is designed for
medium power surface mount applications.

MEDIUM POWER
NPN SILICON
HIGH CURRENT
TRANSISTOR
SURFACE MOUNT

High Current: 1.0 Amp


The SOT-223 package can be soldered using wave or reflow. The formed leads
absorb thermal stress during soldering, eliminating the possibility of damage to
the die
Available in 12 mm Tape and Reel
Use BCP56T1 to order the 7 inch/1000 unit reel
Use BCP56T3 to order the 13 inch/4000 unit reel

COLLECTOR 2,4

PNP Complement is BCP53T1

2
3

BASE
1

CASE 318E-04, STYLE 1


TO-261AA
EMITTER 3

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Symbol

Value

Unit

Collector-Emitter Voltage

VCEO

80

Vdc

Collector-Base Voltage

VCBO

100

Vdc

Emitter-Base Voltage

VEBO

Vdc

Rating

Collector Current

IC

Adc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

65 to 150

Symbol

Max

Unit

RJA

83.3

C/W

TL

260
10

C
Sec

Operating and Storage Temperature Range

DEVICE MARKING
BCP56T1 = BH
BCP56-10T1 = BK
BCP56-16T1 = BL

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
Junction-to-Ambient (surface mounted)
Maximum Temperature for Soldering Purposes
Time in Solder Bath

1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2166

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCP56T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristics

Symbol

Min

Typ

Max

Unit

Collector-Base Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

100

Vdc

Collector-Emitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

80

Vdc

Emitter-Base Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector-Base Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

100

nAdc

Emitter-Base Cutoff Current


(VEB = 5.0 Vdc, IC = 0)

IEBO

10

Adc

25
40
63
100
25

250
160
250

OFF CHARACTERISTICS

ON CHARACTERISTICS (2)
DC Current Gain
(IC = 5.0 mA, VCE = 2.0 V)
(IC = 150 mA, VCE = 2.0 V)

(IC = 500 mA, VCE = 2.0 V)

hFE
All Part Types
BCP56T1
BCP56-10T1
BCP56-16T1
All Types

Collector-Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

0.5

Vdc

Base-Emitter On Voltage
(IC = 500 mAdc, VCE = 2.0 Vdc)

VBE(on)

1.0

Vdc

fT

130

MHz

DYNAMIC CHARACTERISTICS
Current-Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 35 MHz)
2. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2167

BCP56T1 SERIES
TYPICAL ELECTRICAL CHARACTERISTICS

hFE, DC CURRENT GAIN

1000

TJ = 125C
TJ = 25C
100

10

TJ = 55C

10

100

1000

IC, COLLECTOR CURRENT (mA)

1000

80
60
TJ = 25C
C, CAPACITANCE (pF)

f T, CURRENT-GAIN BANDWIDTH PRODUCT (MHz)

Figure 1. DC Current Gain

100

40

Cibo

20

10
8.0
6.0

10
1.0

10
100
IC, COLLECTOR CURRENT (mA)

Cobo

4.0
0.1

1000

0.2

0.5
1.0 2.0
5.0 10
20
VR, REVERSE VOLTAGE (VOLTS)

1.0
TJ = 25C
V, VOLTAGE (VOLTS)

0.8
VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4

0.2
VCE(sat) @ IC/IB = 10
0
0.5

1.0

2.0

100
5.0
10
20
50
IC, COLLECTOR CURRENT (mA)

Figure 4. On Voltages

2168

200

100

Figure 3. Capacitance

VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)

Figure 2. Current-Gain Bandwidth Product

50

500

1.0
TJ = 25C
0.8

0.6

IC = 10 mA

50
mA

100 mA

250 mA

500 mA

0.4

0.2
0
0.05

0.1

0.2

0.5
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

20

50

Figure 5. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BCP68T1

NPN Silicon
Epitaxial Transistor

Motorola Preferred Device

This NPN Silicon Epitaxial Transistor is designed for use in low voltage, high current
applications. The device is housed in the SOT-223 package, which is designed for
medium power surface mount applications.

MEDIUM POWER
NPN SILICON
HIGH CURRENT
TRANSISTOR
SURFACE MOUNT

High Current: IC = 1.0 Amp


The SOT-223 Package can be soldered using wave or reflow.
SOT-223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed leads
absorb thermal stress during soldering, eliminating the possibility of damage to
the die
Available in 12 mm Tape and Reel
Use BCP68T1 to order the 7 inch/1000 unit reel.
Use BCP68T3 to order the 13 inch/4000 unit reel.
The PNP Complement is BCP69T1

COLLECTOR 2,4

2
3

CASE 318E-04, STYLE 1


TO-261AA

BASE
1
EMITTER 3

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Symbol

Value

Unit

Collector-Emitter Voltage

VCEO

25

Vdc

Collector-Base Voltage

VCBO

20

Vdc

Emitter-Base Voltage

VEBO

Vdc

Collector Current

IC

Adc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

65 to 150

Symbol

Max

Unit

RJA

83.3

C/W

TL

260
10

C
Sec

Rating

Operating and Storage Temperature Range

DEVICE MARKING
CA

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance Junction-to-Ambient (surface mounted)
Maximum Temperature for Soldering Purposes
Time in Solder Bath

1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2169

BCP68T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristics

Symbol

Min

Typ

Max

Unit

Collector-Emitter Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CES

25

Vdc

Collector-Emitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

20

Vdc

Emitter-Base Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector-Base Cutoff Current


(VCB = 25 Vdc, IE = 0)

ICBO

10

Adc

Emitter-Base Cutoff Current


(VEB = 5.0 Vdc, IC = 0)

IEBO

10

Adc

50
85
60

375

OFF CHARACTERISTICS

ON CHARACTERISTICS (2)
DC Current Gain
(IC = 5.0 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 Adc, VCE = 1.0 Vdc)

hFE

Collector-Emitter Saturation Voltage


(IC = 1.0 Adc, IB = 100 mAdc)

VCE(sat)

0.5

Vdc

Base-Emitter On Voltage
(IC = 1.0 Adc, VCE = 1.0 Vdc)

VBE(on)

1.0

Vdc

fT

60

MHz

DYNAMIC CHARACTERISTICS
Current-Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc)
2. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%

300
200

TJ = 125C
= 25C

100
= 55C

VCE = 1.0 V
10
1.0

10
100
IC, COLLECTOR CURRENT (mA)

Figure 1. DC Current Gain

2170

1000

f T, CURRENT-GAIN-BANDWIDTH PRODUCT (MHz)

hFE, DC CURRENT GAIN

TYPICAL ELECTRICAL CHARACTERISTICS


300
200

100
70

VCE = 10 V
TJ = 25C
f = 30 MHz

50

30

10

100
200
IC, COLLECTOR CURRENT (mA)

1000

Figure 2. Current-Gain-Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCP68T1
TYPICAL ELECTRICAL CHARACTERISTICS
80

TJ = 25C

TJ = 25C

0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 1.0 V

70
Cib, CAPACITANCE (pF)

V, VOLTAGE (VOLTS)

1.0

0.4

0.2

50

40

VCE(sat) @ IC/IB = 10
1.0

60

30

10
100
1000
IC, COLLECTOR CURRENT (mA)

1.0

2.0
3.0
4.0
VR, REVERSE VOLTAGE (VOLTS)

Figure 3. On Voltage

Figure 4. Capacitance

RVB, TEMPERATURE COEFFICIENT (mV/C)

25

Cob, CAPACITANCE (pF)

TJ = 25C
20

15

10

5.0

5.0

5.0
10
15
VR, REVERSE VOLTAGE (VOLTS)

20

0.8

1.2

1.6
RVB for VBE
2.0

2.4

2.8
1.0

Figure 5. Capacitance

10
100
IC, COLLECTOR CURRENT (mA)

1000

Figure 6. Base-Emitter Temperature Coefficient

1.0
VCE , COLLECTOR VOLTAGE (V)

TJ = 25C
0.8

0.6

0.4

= 1000 mA
I C = 10 mA

= 50 mA

= 100 mA

0.2

0
0.01

= 500 mA

0.1

1.0
10
IB, BASE CURRENT (mA)

100

Figure 7. Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2171

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BCP69T1

PNP Silicon
Epitaxial Transistor

Motorola Preferred Device

This PNP Silicon Epitaxial Transistor is designed for use in low voltage, high current
applications. The device is housed in the SOT-223 package, which is designed for
medium power surface mount applications.

MEDIUM POWER
PNP SILICON
HIGH CURRENT
TRANSISTOR
SURFACE MOUNT

High Current: IC = 1.0 Amp


The SOT-223 Package can be soldered using wave or reflow.
SOT-223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed leads
absorb thermal stress during soldering, eliminating the possibility of damage to
the die.
Available in 12 mm Tape and Reel
Use BCP69T1 to order the 7 inch/1000 unit reel.
Use BCP69T3 to order the 13 inch/4000 unit reel.
NPN Complement is BCP68

COLLECTOR 2,4

2
3

BASE
1

CASE 318E-04, STYLE 1


TO-261AA
EMITTER 3

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Symbol

Value

Unit

Collector-Emitter Voltage

VCEO

25

Vdc

Collector-Base Voltage

VCBO

20

Vdc

Emitter-Base Voltage

VEBO

5.0

Vdc

Collector Current

IC

1.0

Adc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

65 to 150

Symbol

Max

Unit

RJA

83.3

C/W

TL

260
10

C
Sec

Rating

Operating and Storage Temperature Range

DEVICE MARKING
CE

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance Junction-to-Ambient (surface mounted)
Lead Temperature for Soldering, 0.0625 from case
Time in Solder Bath

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2172

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCP69T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristics

Symbol

Min

Typ

Max

Unit

Collector-Emitter Breakdown Voltage (IC = 100 Adc, IE = 0)

V(BR)CES

25

Vdc

Collector-Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)

V(BR)CEO

20

Vdc

Emitter-Base Breakdown Voltage (IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector-Base Cutoff Current (VCB = 25 Vdc, IE = 0)

ICBO

10

Adc

Emitter-Base Cutoff Current (VEB = 5.0 Vdc, IC = 0)

IEBO

10

Adc

50
85
60

375

OFF CHARACTERISTICS

ON CHARACTERISTICS
DC Current Gain
(IC = 5.0 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 Adc, VCE = 1.0 Vdc)

hFE

Collector-Emitter Saturation Voltage (IC = 1.0 Adc, IB = 100 mAdc)

VCE(sat)

0.5

Vdc

Base-Emitter On Voltage (IC = 1.0 Adc, VCE = 1.0 Vdc)

VBE(on)

1.0

Vdc

fT

60

MHz

DYNAMIC CHARACTERISTICS
Current-Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc)

hFE , CURRENT GAIN

200

100
70
50

VCE = 1.0 V
TJ = 25C

20
10

100
IC, COLLECTOR CURRENT (mA)

1000

f T , CURRENT GAIN BANDWIDTH PRODUCT (MHz)

TYPICAL ELECTRICAL CHARACTERISTICS


300
200

100
70

VCE = 10 V
TJ = 25C
f = 30 MHz

50

30
10

Figure 1. DC Current Gain

100
IC, COLLECTOR CURRENT (mA)

1000

Figure 2. Current Gain Bandwidth Product


160

1.0
TJ = 25C

TJ = 25C

0.6

V(BE)sat @ IC/IB = 10

V(BE)on @ VCE = 1.0 V

0.4

0.2

0
1.0

C, CAPACITANCE (pF)

V, VOLTAGE (VOLTS)

0.8

120

80
Cib
40

V(CE)sat @ IC/IB = 10
10
100
1000
IC, COLLECTOR CURRENT (mA)

Figure 3. Saturation and ON Voltages

Cob
0
Cob
Cib

5.0
1.0

1.0
2.0

1.5
3.0

2.0
4.0

2.5
5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitances
Motorola SmallSignal Transistors, FETs and Diodes Device Data

2173

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors


PNP Silicon

BCW29LT1
BCW30LT1

COLLECTOR
3
1
BASE

2
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

32

Vdc

CollectorBase Voltage

VCBO

32

Vdc

EmitterBase Voltage

VEBO

5.0

Vdc

IC

100

mAdc

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR-5 Board (1)
TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate, (2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

Symbol

Max

Unit

PD

225

mW

1.8

mW/C

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

DEVICE MARKING
BCW29LT1 = C1; BCW30LT1 = C2

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage


(IC = 2.0 mAdc, IE = 0)

V(BR)CEO

32

Vdc

CollectorEmitter Breakdown Voltage


(IC = 100 Adc, VEB = 0)

V(BR)CES

32

Vdc

CollectorBase Breakdown Voltage


(IC = 10 Adc, IC = 0)

V(BR)CBO

32

Vdc

EmitterBase Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

100
10

nAdc
Adc

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 32 Vdc, IE = 0)
(VCB = 32 Vdc, IE = 0, TA = 100C)

 0.062 in.
  0.024 in. 99.5% alumina.

ICBO

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

2174

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW29LT1 BCW30LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Max

Unit

120
215

260
500

0.3

0.6

0.75

7.0

10

ON CHARACTERISTICS
DC Current Gain
(IC = 2.0 mAdc, VCE = 5.0 Vdc)

hFE
BCW29
BCW30

CollectorEmitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)

VCE(sat)

BaseEmitter On Voltage
(IC = 2.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

Vdc
Vdc

SMALLSIGNAL CHARACTERISTICS
Output Capacitance
(IE = 0, VCB = 10 Vdc, f = 1.0 MHz)
Noise Figure
(IC = 0.2 mAdc, VCE = 5.0 Vdc, RS = 2.0 k, f = 1.0 kHz, BW = 200 Hz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Cobo

pF

NF

dB

2175

BCW29LT1 BCW30LT1
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
10
7.0
IC = 10 A

5.0

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

1.0
7.0
5.0

BANDWIDTH = 1.0 Hz
RS 0

30 A
3.0

100 A
300 A

1.0 mA

2.0

BANDWIDTH = 1.0 Hz
RS
IC = 1.0 mA

3.0
2.0

300 A

1.0
0.7
0.5

100 A
30 A

0.3
0.2

1.0

10 A

0.1
10

20

50

100 200
500 1.0 k
f, FREQUENCY (Hz)

2.0 k

5.0 k

10

10 k

20

50

Figure 1. Noise Voltage

100 200
500 1.0 k 2.0 k
f, FREQUENCY (Hz)

5.0 k

10 k

Figure 2. Noise Current

NOISE FIGURE CONTOURS

1.0 M
500 k

BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

(VCE = 5.0 Vdc, TA = 25C)

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100
20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100

5.0 dB
10

1.0 M
500 k

500 700 1.0 k

5.0 dB
10

20

RS , SOURCE RESISTANCE (OHMS)

Figure 3. Narrow Band, 100 Hz

1.0 M
500 k

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700 1.0 k

Figure 4. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is Defined as:

20 k
10 k

NF
0.5 dB
1.0 dB
2.0 dB
3.0 dB
5.0 dB

200
100
10

20

30

50 70 100

200 300

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

5.0 k
2.0 k
1.0 k
500

+ 20 log10

500 700 1.0 k

IC, COLLECTOR CURRENT (A)

Figure 5. Wideband
2176

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW29LT1 BCW30LT1
TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C
25C

200

55C
100
80
BCW29LT1
VCE = 1.0 V
VCE = 10 V

60
40
0.003 0.005

0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3 0.5 0.7 1.0


2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0

10

20

30

50 70 100

100

1.0
TA = 25C
BCW29LT1

IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. DC Current Gain

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%
300 A

200 A
150 A

40

100 A
50 A

20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
0.8
VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.5 1.0
2.0
5.0
10
20
IC, COLLECTOR CURRENT (mA)

40

Figure 8. Collector Characteristics

1.4

0.2

250 A

60

Figure 7. Collector Saturation Region

0.1

IB = 400 A
350 A

50

100

Figure 9. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6
*APPLIES for IC/IB hFE/2
0.8
*qVC for VCE(sat)

25C to 125C

0
55C to 25C
0.8
25C to 125C
1.6

2.4
0.1

qVB for VBE


0.2

55C to 25C

0.5
1.0 2.0
5.0
10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 10. Temperature Coefficients

2177

BCW29LT1 BCW30LT1
TYPICAL DYNAMIC CHARACTERISTICS
500
300
200

200

100
70
50
30
tr

20
10
7.0
5.0
1.0

100
70
50

tf

30

td @ VBE(off) = 0.5 V

20

2.0

3.0

50 70

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 12. TurnOff Time

500

10
TJ = 25C

TJ = 25C

7.0
VCE = 20 V

300

Cib
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 11. TurnOn Time

5.0 V
200

100

5.0

3.0
2.0

Cob

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.2

0.5

1.0

2.0

5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 13. CurrentGain Bandwidth Product

Figure 14. Capacitance

3.0

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

2.0
1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

BCW29LT1
hfe 200
@ IC = 1.0 mA

7.0
5.0

0.2
0.1

10

20

50

200

10

100
70
50
30
20

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C
BCW29LT1
hfe 200
@ IC = 1.0 mA

10
7.0
5.0
3.0

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

Figure 15. Input Impedance

2178

0.1

IC, COLLECTOR CURRENT (mA)

20
hie , INPUT IMPEDANCE (k )

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

ts

300
t, TIME (ns)

t, TIME (ns)

1000
700
500

VCC = 3.0 V
IC/IB = 10
TJ = 25C

50

100

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 16. Output Admittance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

BCW29LT1 BCW30LT1
1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

1.0

t2
2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 17. Thermal Response

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 V
103
ICEO

102
101

ICBO
AND
ICEX @ VBE(off) = 3.0 V

100
101
102

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

A train of periodical power pulses can be represented by the model


as shown in Figure 19. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 17 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 17 by the
steady state value RJA.
Example:
The BCW29LT1 is dissipating 2.0 watts peak under the following
conditions:
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
Using Figure 17 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
The peak rise in junction temperature is therefore
T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.
For more information, see AN569.

Figure 18. Typical Collector Leakage Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2179

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistor


NPN Silicon

BCW33LT1
COLLECTOR
3

1
BASE

3
1

2
EMITTER

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

20

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

100

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BCW33LT1 = D3

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 2.0 mAdc, IB = 0)

V(BR)CEO

32

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IB = 0)

V(BR)CBO

32

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

100
10

nAdc
Adc

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 32 Vdc, IE = 0)
(VCB = 32 Vdc, IE = 0, TA = 100C)

 0.062 in.
  0.024 in. 99.5% alumina.

ICBO

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

2180

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW33LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

420

800

0.25

0.55

0.70

Cobo

4.0

pF

NF

10

dB

ON CHARACTERISTICS
DC Current Gain
(IC = 2.0 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)

VCE(sat)

Base Emitter On Voltage


(IC = 2.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Noise Figure
(VCE = 5.0 Vdc, IC = 0.2 mAdc, RS = 2.0 k, f = 1.0 kHz, BW = 200 Hz)

EQUIVALENT SWITCHING TIME TEST CIRCUITS


+ 3.0 V
300 ns
DUTY CYCLE = 2%

275

+10.9 V

+ 3.0 V

10 < t1 < 500 s


DUTY CYCLE = 2%

t1

+10.9 V

10 k

0.5 V
<1.0 ns

275
10 k

0
CS < 4.0 pF*

9.1 V

< 1.0 ns

1N916

CS < 4.0 pF*

*Total shunt capacitance of test jig and connectors

Figure 1. TurnOn Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 2. TurnOff Time

2181

BCW33LT1
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
20

100
BANDWIDTH = 1.0 Hz
RS = 0

50

300 A

10

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

IC = 1.0 mA

100 A

7.0
5.0
10 A
3.0

20

300 A
100 A

10
5.0
2.0
1.0
30 A

0.5

30 A

BANDWIDTH = 1.0 Hz
RS

IC = 1.0 mA

10 A

0.2
2.0

0.1
10

20

50

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

10

20

50

Figure 3. Noise Voltage

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

Figure 4. Noise Current

NOISE FIGURE CONTOURS


(VCE = 5.0 Vdc, TA = 25C)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k

RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

500 k

20 k
10 k
5k

2.0 dB

2k
1k
500

3.0 dB 4.0 dB
6.0 dB

10 dB

200
100
50

1M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

1.0 dB

5k

2.0 dB

2k
1k
500

5.0 dB

200
100
10

20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

8.0 dB
10

20

Figure 5. Narrow Band, 100 Hz

500 k
RS , SOURCE RESISTANCE (OHMS)

3.0 dB

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

Figure 6. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is defined as:

20 k
10 k
5k

NF
1.0 dB

2k
1k
500

3.0 dB
5.0 dB
8.0 dB
10

20

30

50 70 100

200 300

500 700

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

2.0 dB

200
100
50

+ 20 log10

1k

IC, COLLECTOR CURRENT (A)

Figure 7. Wideband
2182

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW33LT1

1.0

100
BCW33LT1
TJ = 25C

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

TYPICAL STATIC CHARACTERISTICS

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%

300 A
200 A
40
100 A
20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
VBE(sat) @ IC/IB = 10

0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.2

0.5 1.0
2.0
5.0
10
20
IC, COLLECTOR CURRENT (mA)

40

Figure 9. Collector Characteristics

1.4

0.1

400 A

60

Figure 8. Collector Saturation Region

0.8

IB = 500 A

50

100

Figure 10. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6

*APPLIES for IC/IB hFE/2

0.8
25C to 125C
0

*qVC for VCE(sat)


55C to 25C

0.8
25C to 125C
1.6

qVB for VBE


2.4
0.1

0.2

55C to 25C

0.5
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 11. Temperature Coefficients

2183

BCW33LT1
TYPICAL DYNAMIC CHARACTERISTICS
1000
VCC = 3.0 V
IC/IB = 10
TJ = 25C

100
70
50

700
500

ts

300
200
t, TIME (ns)

t, TIME (ns)

300
200

tr

30
20
td @ VBE(off) = 0.5 Vdc

10
7.0
5.0

100
70
50

tf

30

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

20

3.0
1.0

2.0

50 70

20 30
5.0 7.0 10
3.0
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0

3.0

50

70 100

Figure 13. TurnOff Time

500

10
TJ = 25C
f = 100 MHz

TJ = 25C
f = 1.0 MHz

7.0

300
200

C, CAPACITANCE (pF)

VCE = 20 V
5.0 V

100

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 12. TurnOn Time

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

Cib

5.0

Cob
3.0
2.0

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

50

1.0
0.05

0.1

0.2

0.5

1.0

2.0

5.0

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 14. CurrentGain Bandwidth Product

Figure 15. Capacitance

1.0
0.7
0.5

10

20

50

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19A

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

1.0

t2
2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 16. Thermal Response

2184

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW33LT1
104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 Vdc
103
102

ICEO

101
ICBO
AND
ICEX @ VBE(off) = 3.0 Vdc

100
101
102

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

A train of periodical power pulses can be represented by the model


as shown in Figure 16A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 16 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 16 by the
steady state value RJA.
Example:
The MPS3904 is dissipating 2.0 watts peak under the following
conditions:
t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
Using Figure 16 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
The peak rise in junction temperature is therefore
T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.
For more information, see AN569.

Figure 16A.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2185

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BCW60ALT1
BCW60BLT1
BCW60DLT1

General Purpose Transistors


NPN Silicon

COLLECTOR
3
1
BASE

2
EMITTER

1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

32

Vdc

Collector Base Voltage

VCBO

32

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

100

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BCW60ALT1 = AA, BCW60BLT1 = AB, BCW60DLT1 = AD

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 2.0 mAdc, IE = 0)

V(BR)CEO

32

Vdc

Emitter Base Breakdown Voltage


(IE = 1.0 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

20
20

nAdc
Adc

20

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current


(VCE = 32 Vdc)
(VCE = 32 Vdc, TA = 150C)

ICES

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

nAdc

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

2186

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW60ALT1 BCW60BLT1 BCW60DLT1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

BCW60A
BCW60B
BCW60D

20
30
100

(IC = 2.0 mAdc, VCE = 5.0 Vdc)

BCW60A
BCW60B
BCW60D

120
175
380

220
310
630

(IC = 50 mAdc, VCE = 1.0 Vdc)

BCW60A
BCW60B
BCW60D

60
70
100

125
175
350

250
350
700

0.55
0.35

0.7
0.6

1.05
0.85

0.6

0.75

125

4.5

6.0

150

800

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 Adc, VCE = 5.0 Vdc)

hFE

AC Current Gain
(VCE = 5.0 Vdc, IC = 2.0 mAdc, f = 1.0 kHz)

hfe
BCW60A
BCW60B
BCW60D

Collector Emitter Saturation Voltage


(IC = 50 mAdc, IB = 1.25 mAdc)
(IC = 10 mAdc, IB = 0.25 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 50 mAdc, IB = 1.25 mAdc)
(IC = 50 mAdc, IB = 0.25 mAdc)

VBE(sat)

Base Emitter On Voltage


(IC = 2.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

Vdc

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

fT

Output Capacitance
(VCE = 10 Vdc, IC = 0, f = 1.0 MHz)

MHz

Cobo

Noise Figure
(VCE = 5.0 Vdc, IC = 0.2 mAdc, RS = 2.0 k, f = 1.0 kHz, BW = 200 Hz)

pF

NF

dB

SWITCHING CHARACTERISTICS
TurnOn Time
(IC = 10 mAdc, IB1 = 1.0 mAdc)

ton

TurnOff Time
(IB2 = 1.0 mAdc, VBB = 3.6 Vdc, R1 = R2 = 5.0 k, RL = 990 )

toff

ns
ns

EQUIVALENT SWITCHING TIME TEST CIRCUITS


+ 3.0 V
300 ns
DUTY CYCLE = 2%

275

+10.9 V

+ 3.0 V

10 < t1 < 500 s


DUTY CYCLE = 2%

t1

+10.9 V

10 k

0.5 V
<1.0 ns

275
10 k

0
CS < 4.0 pF*

9.1 V

< 1.0 ns

1N916

CS < 4.0 pF*

*Total shunt capacitance of test jig and connectors

Figure 1. TurnOn Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 2. TurnOff Time

2187

BCW60ALT1 BCW60BLT1 BCW60DLT1


TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
20

100
BANDWIDTH = 1.0 Hz
RS = 0

50

300 A

10

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

IC = 1.0 mA

100 A

7.0
5.0
10 A
3.0

20

300 A
100 A

10
5.0
2.0
1.0
30 A

0.5

30 A

BANDWIDTH = 1.0 Hz
RS

IC = 1.0 mA

10 A

0.2
2.0

0.1
10

20

50

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

10

20

50

Figure 3. Noise Voltage

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

Figure 4. Noise Current

NOISE FIGURE CONTOURS


(VCE = 5.0 Vdc, TA = 25C)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k

RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

500 k

20 k
10 k
5k

2.0 dB

2k
1k
500

3.0 dB 4.0 dB
6.0 dB

10 dB

200
100
50

1M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

1.0 dB

5k

2.0 dB

2k
1k
500

5.0 dB

200
100
10

20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

8.0 dB
10

20

Figure 5. Narrow Band, 100 Hz

500 k
RS , SOURCE RESISTANCE (OHMS)

3.0 dB

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

Figure 6. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is defined as:

20 k
10 k
5k

NF
1.0 dB

2k
1k
500

3.0 dB
5.0 dB
8.0 dB
10

20

30

50 70 100

200 300

500 700

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

2.0 dB

200
100
50

+ 20 log10

1k

IC, COLLECTOR CURRENT (A)

Figure 7. Wideband
2188

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW60ALT1 BCW60BLT1 BCW60DLT1


TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C

25C

200

55C
100
80
60

VCE = 1.0 V
VCE = 10 V

40
0.004 0.006 0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3
0.5 0.7 1.0
2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0 10

20

30

50

70 100

100

1.0
TJ = 25C
IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 8. DC Current Gain

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%

300 A
200 A
40
100 A
20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
VBE(sat) @ IC/IB = 10

0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.2

2.0
5.0
10
20
0.5 1.0
IC, COLLECTOR CURRENT (mA)

40

Figure 10. Collector Characteristics

1.4

0.1

400 A

60

Figure 9. Collector Saturation Region

0.8

IB = 500 A

50

100

Figure 11. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6

*APPLIES for IC/IB hFE/2

0.8
25C to 125C
0

*qVC for VCE(sat)


55C to 25C

0.8
25C to 125C
1.6

qVB for VBE


2.4
0.1

0.2

55C to 25C

0.5
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 12. Temperature Coefficients

2189

BCW60ALT1 BCW60BLT1 BCW60DLT1


TYPICAL DYNAMIC CHARACTERISTICS
1000
VCC = 3.0 V
IC/IB = 10
TJ = 25C

100
70
50

700
500

ts

300
200
t, TIME (ns)

t, TIME (ns)

300
200

tr

30
20
td @ VBE(off) = 0.5 Vdc

10
7.0
5.0

100
70
50

tf

30

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

20

3.0
1.0

2.0

50 70

20 30
5.0 7.0 10
3.0
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0

3.0

500

70 100

10
TJ = 25C
f = 100 MHz

TJ = 25C
f = 1.0 MHz

7.0

300
VCE = 20 V
200

5.0 V

100

Cib

5.0

Cob
3.0
2.0

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.2

0.5

1.0

2.0

5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 15. CurrentGain Bandwidth Product

Figure 16. Capacitance

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

3.0
2.0
1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

hfe 200 @ IC = 1.0 mA

7.0
5.0

0.2
0.1

10

20

50

200

10

100
70
50

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C
hfe 200 @ IC = 1.0 mA

30
20
10
7.0
5.0
3.0

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

Figure 17. Input Impedance

2190

0.1

IC, COLLECTOR CURRENT (mA)

20
hie , INPUT IMPEDANCE (k )

50

Figure 14. TurnOff Time

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 13. TurnOn Time

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

50

100

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 18. Output Admittance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

BCW60ALT1 BCW60BLT1 BCW60DLT1


1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19A

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

t2

1.0

2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 19. Thermal Response

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 Vdc

A train of periodical power pulses can be represented by the model


as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 19 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 19 by the
steady state value RJA.

103
102

ICEO

101

Example:
The MPS3904 is dissipating 2.0 watts peak under the following
conditions:
t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.

ICBO
AND
ICEX @ VBE(off) = 3.0 Vdc

100
101
102

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

The peak rise in junction temperature is therefore


T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.
For more information, see AN569.

Figure 19A.

IC, COLLECTOR CURRENT (mA)

400
1.0 ms

200
100
60
40

TC = 25C

dc
dc
TJ = 150C

10

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

6.0
2.0

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 20 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.

10 s
1.0 s

TA = 25C

20

4.0

100 s

4.0
6.0 8.0 10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

40

Figure 20.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2191

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BCW61BLT1
BCW61CLT1
BCW61DLT1

General Purpose Transistors


PNP Silicon

COLLECTOR
3
1
BASE

2
EMITTER

1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

32

Vdc

Collector Base Voltage

VCBO

32

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

100

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BCW61BLT1 = BB, BCW61CLT1 = BC, BCW61DLT1 = BD

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 2.0 mAdc, IB = 0)

V(BR)CEO

32

Vdc

Emitter Base Breakdown Voltage


(IE = 1.0 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

20
20

nAdc
Adc

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current


(VCE = 32 Vdc)
(VCE = 32 Vdc, TA = 150C)

 0.062 in.
  0.024 in. 99.5% alumina.

ICES

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

2192

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW61BLT1 BCW61CLT1 BCW61DLT1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

BCW61B
BCW61C
BCW61D

30
40
100

(IC = 2.0 mAdc, VCE = 5.0 Vdc)

BCW61B
BCW61C
BCW61D

140
250
380

310
460
630

(IC = 50 mAdc, VCE = 1.0 Vdc)

BCW61B
BCW61C
BCW61D

80
100
100

175
250
350

350
500
700

0.55
0.25

0.68
0.6

1.05
0.85

0.6

0.75

6.0

6.0

150

800

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 Adc, VCE = 5.0 Vdc)

AC Current Gain
(VCE = 5.0 Vdc, IC = 2.0 mAdc, f = 1.0 kHz)

hFE

hfe
BCW61B
BCW61C
BCW61D

Collector Emitter Saturation Voltage


(IC = 50 mAdc, IB = 1.25 mAdc)
(IC = 10 mAdc, IB = 0.25 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 50 mAdc, IB = 1.25 mAdc)
(IC = 10 mAdc, IB = 0.25 mAdc)

VBE(sat)

Base Emitter On Voltage


(IC = 2.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

Vdc

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Output Capacitance
(VCE = 10 Vdc, IC = 0, f = 1.0 MHz)
Noise Figure
(VCE = 5.0 Vdc, IC = 0.2 mAdc, RS = 2.0 k, f = 1.0 kHz, BW = 200 Hz)

Cobo

pF

NF

dB

SWITCHING CHARACTERISTICS
TurnOn Time
(IC = 10 mAdc, IB1 = 1.0 mAdc)

ton

TurnOff Time
(IB2 = 1.0 mAdc, VBB = 3.6 Vdc, R1 = R2 = 5.0 k, RL = 990 )

toff

Motorola SmallSignal Transistors, FETs and Diodes Device Data

ns
ns

2193

BCW61BLT1 BCW61CLT1 BCW61DLT1


TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
10
7.0
IC = 10 A

5.0

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

1.0
7.0
5.0

BANDWIDTH = 1.0 Hz
RS 0

30 A
3.0

100 A
300 A

1.0 mA

2.0

BANDWIDTH = 1.0 Hz
RS
IC = 1.0 mA

3.0
2.0

300 A

1.0
0.7
0.5

100 A
30 A

0.3
0.2

1.0

10 A

0.1
10

20

50

100 200
500 1.0 k
f, FREQUENCY (Hz)

2.0 k

5.0 k

10

10 k

20

50

Figure 1. Noise Voltage

100 200
500 1.0 k 2.0 k
f, FREQUENCY (Hz)

5.0 k

10 k

Figure 2. Noise Current

NOISE FIGURE CONTOURS

1.0 M
500 k

BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

(VCE = 5.0 Vdc, TA = 25C)

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100
20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100

5.0 dB
10

1.0 M
500 k

500 700 1.0 k

5.0 dB
10

20

RS , SOURCE RESISTANCE (OHMS)

Figure 3. Narrow Band, 100 Hz

1.0 M
500 k

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700 1.0 k

Figure 4. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is Defined as:

20 k
10 k

NF
0.5 dB
1.0 dB
2.0 dB
3.0 dB
5.0 dB

200
100
10

20

30

50 70 100

200 300

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

5.0 k
2.0 k
1.0 k
500

+ 20 log10

500 700 1.0 k

IC, COLLECTOR CURRENT (A)

Figure 5. Wideband
2194

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW61BLT1 BCW61CLT1 BCW61DLT1

1.0

100
TA = 25C
BCW61

IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

TYPICAL STATIC CHARACTERISTICS

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%
300 A

150 A
40

100 A
50 A

20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
0.8
VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.5 1.0
2.0
5.0
10
20
IC, COLLECTOR CURRENT (mA)

40

Figure 7. Collector Characteristics

1.4

0.2

250 A
200 A

60

Figure 6. Collector Saturation Region

0.1

IB = 400 A
350 A

50

100

Figure 8. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6
*APPLIES for IC/IB hFE/2
0.8
*qVC for VCE(sat)

25C to 125C

0
55C to 25C
0.8
25C to 125C
1.6

2.4
0.1

qVB for VBE


0.2

55C to 25C

0.5
1.0 2.0
5.0
10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 9. Temperature Coefficients

2195

BCW61BLT1 BCW61CLT1 BCW61DLT1


TYPICAL DYNAMIC CHARACTERISTICS
500
300
200

200

100
70
50
30
tr

20

100
70
50

10
7.0
5.0
1.0

tf

30

td @ VBE(off) = 0.5 V

20

2.0

3.0

50 70

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 11. TurnOff Time

500

10
TJ = 25C

TJ = 25C

7.0
VCE = 20 V

300

Cib
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 10. TurnOn Time

5.0 V
200

100

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

ts

300
t, TIME (ns)

t, TIME (ns)

1000
700
500

VCC = 3.0 V
IC/IB = 10
TJ = 25C

5.0

3.0
2.0

Cob

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

50

1.0
0.05

0.1

0.2

0.5

1.0

2.0

5.0

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 12. CurrentGain Bandwidth Product

Figure 13. Capacitance

1.0
0.7
0.5

10

20

50

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

1.0

t2
2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 14. Thermal Response

2196

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW61BLT1 BCW61CLT1 BCW61DLT1


104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 V
103
ICEO

102
101

ICBO
AND
ICEX @ VBE(off) = 3.0 V

100
101
102

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

A train of periodical power pulses can be represented by the model


as shown in Figure 15. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 14 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 14 by the
steady state value RJA.
Example:
The MPS3905 is dissipating 2.0 watts peak under the following
conditions:
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
Using Figure 14 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
The peak rise in junction temperature is therefore
T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.
For more information, see AN569.

Figure 15. Typical Collector Leakage Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2197

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistor


NPN Silicon

BCW65ALT1
COLLECTOR
3

1
BASE

3
1

2
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

32

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

800

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BCW65ALT1 = EA

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 10 mAdc, IB = 0)

V(BR)CEO

32

Vdc

Collector Emitter Breakdown Voltage


(IC = 10 mAdc, VEB = 0)

V(BR)CES

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

20
20

nAdc
Adc

20

nAdc

OFF CHARACTERISTICS

Collector Cutoff Current


(VCE = 32 Vdc, IE = 0)
(VCE = 32 Vdc, IE = 0, TA = 150C)

ICES

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

2198

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW65ALT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

35
75
100
35

220
250

0.7
0.3

2.0

fT

100

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

12

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

80

pF

NF

10

dB

TurnOn Time
(IB1 = IB2 = 15 mAdc)

ton

100

ns

TurnOff Time
(IC = 150 mAdc, RL = 150 )

toff

400

ns

ON CHARACTERISTICS
DC Current Gain
(IC = 100 Adc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 500 mAdc, VCE = 2.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)
(IC = 100 mAdc, IB = 10 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 20 mAdc, VCE = 10 Vdc, f = 100 MHz)

Noise Figure
(VCE = 5.0 Vdc, IC = 0.2 mAdc, RS = 1.0 k, f = 1.0 kHz, BW = 200 Hz)

SWITCHING CHARACTERISTICS

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2199

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistor


PNP Silicon

BCW68GLT1
COLLECTOR
3

1
BASE

3
1

2
EMITTER

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

45

Vdc

CollectorBase Voltage

VCBO

60

Vdc

EmitterBase Voltage

VEBO

5.0

Vdc

IC

800

mAdc

Collector Current Continuous

DEVICE MARKING
BCW68GLT1 = DH

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

PD

225

mW

1.8

mW/C

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation FR-5 Board (1)


TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate, (2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)CEO

45

Vdc

OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage (IC = 10 mAdc, IB = 0)
CollectorEmitter Breakdown Voltage (IC = 10 Adc, VEB = 0)

V(BR)CES

60

Vdc

EmitterBase Breakdown Voltage (IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

20
10

nAdc
Adc

20

nAdc

Collector Cutoff Current


(VCE= 45 Vdc, IE = 0)
(VCE= 45 Vdc, IB = 0, TA = 150C)

ICES

Emitter Cutoff Current (VEB = 4.0 Vdc, IC = 0)

IEBO

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina

2200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW68GLT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

120
160
60

400

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 300 mAdc, VCE = 1.0 Vdc)

hFE

CollectorEmitter Saturation Voltage (IC = 300 mAdc, IB = 30 mAdc)

VCE(sat)

1.5

Vdc

BaseEmitter Saturation Voltage (IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

2.0

Vdc

fT

100

MHz

Output Capacitance
(VCB= 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

18

pF

Input Capacitance
(VEB= 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

105

pF

NF

10

dB

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 20 mAdc, VCE = 10 Vdc, f = 100 MHz)

Noise Figure
(IC= 0.2 mAdc, VCE = 5.0 Vdc, RS = 1.0 k, f = 1.0 kHz,
BW = 200 Hz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2201

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors

BCW69LT1
BCW70LT1

PNP Silicon

COLLECTOR
3
1
BASE

3
1

2
EMITTER

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

45

Vdc

EmitterBase Voltage

VEBO

5.0

Vdc

IC

100

mAdc

Collector Current Continuous

DEVICE MARKING
BCW69LT1 = H1; BCW70LT1 = H2

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR-5 Board (1)
TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate, (2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

Symbol

Max

Unit

PD

225

mW

1.8

mW/C

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage (IC = 2.0 mAdc, IB = 0)

V(BR)CEO

45

Vdc

CollectorEmitter Breakdown Voltage (IC = 100 Adc, VEB = 0)

V(BR)CES

50

Vdc

EmitterBase Breakdown Voltage (IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

100
10

nAdc
Adc

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)
(VCB = 20 Vdc, IE = 0, TA = 100C)

ICBO

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina

2202

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW69LT1 BCW70LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

120
215

260
500

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 2.0 mAdc, VCE = 5.0 Vdc)

hFE
BCW69
BCW70

CollectorEmitter Saturation Voltage (IC = 10 mAdc, IB = 0.5 mAdc)

VCE(sat)

0.3

Vdc

BaseEmitter On Voltage (IC = 2.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

0.6

0.75

Vdc

Cobo

7.0

pF

NF

10

dB

SMALLSIGNAL CHARACTERISTICS
Output Capacitance
(IE = 0, VCB = 10 Vdc, f = 1.0 MHz)
Noise Figure
(IC = 0.2 mAdc, VCE = 5.0 Vdc, RS = 2.0 k, f = 1.0 kHz, BW = 200 Hz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2203

BCW69LT1 BCW70LT1
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
10
7.0
IC = 10 A

5.0

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

1.0
7.0
5.0

BANDWIDTH = 1.0 Hz
RS 0

30 A
3.0

100 A
300 A

1.0 mA

2.0

BANDWIDTH = 1.0 Hz
RS
IC = 1.0 mA

3.0
2.0

300 A

1.0
0.7
0.5

100 A
30 A

0.3
0.2

1.0

10 A

0.1
10

20

50

100 200
500 1.0 k
f, FREQUENCY (Hz)

2.0 k

5.0 k

10

10 k

20

50

Figure 1. Noise Voltage

100 200
500 1.0 k 2.0 k
f, FREQUENCY (Hz)

5.0 k

10 k

Figure 2. Noise Current

NOISE FIGURE CONTOURS

1.0 M
500 k

BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

(VCE = 5.0 Vdc, TA = 25C)

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100
20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100

5.0 dB
10

1.0 M
500 k

500 700 1.0 k

5.0 dB
10

20

RS , SOURCE RESISTANCE (OHMS)

Figure 3. Narrow Band, 100 Hz

1.0 M
500 k

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700 1.0 k

Figure 4. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is Defined as:

20 k
10 k

NF
0.5 dB
1.0 dB
2.0 dB
3.0 dB
5.0 dB

200
100
10

20

30

50 70 100

200 300

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

5.0 k
2.0 k
1.0 k
500

+ 20 log10

500 700 1.0 k

IC, COLLECTOR CURRENT (A)

Figure 5. Wideband
2204

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW69LT1 BCW70LT1

1.0

100
TA = 25C
IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

TYPICAL STATIC CHARACTERISTICS

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%
300 A

150 A
40

100 A
50 A

20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
0.8
VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.5 1.0
2.0
5.0
10
20
IC, COLLECTOR CURRENT (mA)

40

Figure 7. Collector Characteristics

1.4

0.2

250 A
200 A

60

Figure 6. Collector Saturation Region

0.1

IB = 400 A
350 A

50

100

Figure 8. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6
*APPLIES for IC/IB hFE/2
0.8
*qVC for VCE(sat)

25C to 125C

0
55C to 25C
0.8
25C to 125C
1.6

2.4
0.1

qVB for VBE


0.2

55C to 25C

0.5
1.0 2.0
5.0
10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 9. Temperature Coefficients

2205

BCW69LT1 BCW70LT1
TYPICAL DYNAMIC CHARACTERISTICS
500
300
200

200

100
70
50
30
tr

20

100
70
50

10
7.0
5.0
1.0

tf

30

td @ VBE(off) = 0.5 V

20

2.0

3.0

50 70

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 11. TurnOff Time

500

10
TJ = 25C

TJ = 25C

7.0
VCE = 20 V

300

Cib
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 10. TurnOn Time

5.0 V
200

100

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

ts

300
t, TIME (ns)

t, TIME (ns)

1000
700
500

VCC = 3.0 V
IC/IB = 10
TJ = 25C

5.0

3.0
2.0

Cob

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

50

1.0
0.05

0.1

0.2

0.5

1.0

2.0

5.0

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 12. CurrentGain Bandwidth Product

Figure 13. Capacitance

1.0
0.7
0.5

10

20

50

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 16

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

1.0

t2
2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 14. Thermal Response

2206

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW69LT1 BCW70LT1
104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 V

101

A train of periodical power pulses can be represented by the model


as shown in Figure 16. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 14 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 14 by the
steady state value RJA.
Example:
Dissipating 2.0 watts peak under the following conditions:
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
Using Figure 14 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.

102

The peak rise in junction temperature is therefore


T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.

103
ICEO

102
101

ICBO
AND
ICEX @ VBE(off) = 3.0 V

100

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

For more information, see AN569.

Figure 15. Typical Collector Leakage Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2207

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistor

BCW72LT1

NPN Silicon

COLLECTOR
3
1
BASE

3
1

2
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

45

Vdc

Collector Base Voltage

VCBO

50

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

100

mAdc

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BCW72LT1 = K2

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 2.0 mAdc, VEB = 0)

V(BR)CEO

45

Vdc

Collector Emitter Breakdown Voltage


(IC = 2.0 mAdc, VEB = 0)

V(BR)CES

45

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

50

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

100
10

nAdc
mAdc

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)
(VCB = 20 Vdc, IE = 0, TA = 100C)

 0.062 in.
  0.024 in. 99.5% alumina.

ICBO

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

2208

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW72LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

200

450

0.21

0.25

0.85

0.6

0.75

fT

300

MHz

Output Capacitance
(IE = 0, VCB = 10 Vdc, f = 1.0 MHz)

Cobo

4.0

pF

Input Capacitance
(IE = 0, VCB = 10 Vdc, f = 1.0 MHz)

Cibo

9.0

pF

NF

10

dB

ON CHARACTERISTICS
DC Current Gain
(IC = 2.0 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 50 mAdc, IB = 2.5 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 50 mAdc, IB = 2.5 mAdc)

VBE(sat)

Base Emitter On Voltage


(IC = 2.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

Vdc

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

Noise Figure
(IC = 0.2 mAdc, VCE = 5.0 Vdc, RS = 2.0 k, f = 1.0 kHz,
BW = 200 Hz)

EQUIVALENT SWITCHING TIME TEST CIRCUITS


+ 3.0 V
300 ns
DUTY CYCLE = 2%

+10.9 V

+ 3.0 V

10 < t1 < 500 s


DUTY CYCLE = 2%

275

t1

+10.9 V

10 k

275
10 k

0.5 V
<1.0 ns

CS < 4.0 pF*

9.1 V

< 1.0 ns

CS < 4.0 pF*

1N916

*Total shunt capacitance of test jig and connectors

Figure 1. TurnOn Time

Figure 2. TurnOff Time

TYPICAL NOISE CHARACTERISTICS


(VCE = 5.0 Vdc, TA = 25C)
20

100
BANDWIDTH = 1.0 Hz
RS = 0

50

300 A

10

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

IC = 1.0 mA

100 A

7.0
5.0
10 A
3.0

20

300 A
100 A

10
5.0
2.0
1.0
30 A

0.5

30 A

10 A

0.2
2.0

BANDWIDTH = 1.0 Hz
RS

IC = 1.0 mA

0.1
10

20

50

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

Figure 3. Noise Voltage


Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

50

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

Figure 4. Noise Current


2209

BCW72LT1
NOISE FIGURE CONTOURS
(VCE = 5.0 Vdc, TA = 25C)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k

RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

500 k

20 k
10 k
5k

2.0 dB

2k
1k
500

3.0 dB 4.0 dB
6.0 dB

10 dB

200
100
50

1M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

1.0 dB

5k

2.0 dB

2k
1k
500

5.0 dB

200
100
10

20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

8.0 dB
10

20

Figure 5. Narrow Band, 100 Hz

500 k
RS , SOURCE RESISTANCE (OHMS)

3.0 dB

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

Figure 6. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is defined as:

20 k
10 k
5k

NF
1.0 dB

2k
1k
500

3.0 dB
5.0 dB
8.0 dB
10

20

30

50 70 100

200 300

500 700

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

2.0 dB

200
100
50

+ 20 log10

1k

IC, COLLECTOR CURRENT (A)

Figure 7. Wideband

2210

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCW72LT1
TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C

25C

200

55C
100
80
60

VCE = 1.0 V
VCE = 10 V

40
0.004 0.006 0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3
0.5 0.7 1.0
2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0 10

20

30

50

70 100

100

1.0
TJ = 25C
IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 8. DC Current Gain

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%

300 A
200 A
40
100 A
20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
VBE(sat) @ IC/IB = 10

0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.2

2.0
5.0
10
20
0.5 1.0
IC, COLLECTOR CURRENT (mA)

40

Figure 10. Collector Characteristics

1.4

0.1

400 A

60

Figure 9. Collector Saturation Region

0.8

IB = 500 A

50

100

Figure 11. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6

*APPLIES for IC/IB hFE/2

0.8
25C to 125C
0

*qVC for VCE(sat)


55C to 25C

0.8
25C to 125C
1.6

qVB for VBE


2.4
0.1

0.2

55C to 25C

0.5
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 12. Temperature Coefficients

2211

BCW72LT1
TYPICAL DYNAMIC CHARACTERISTICS
1000
VCC = 3.0 V
IC/IB = 10
TJ = 25C

100
70
50

700
500

ts

300
200
t, TIME (ns)

t, TIME (ns)

300
200

tr

30
20
td @ VBE(off) = 0.5 Vdc

10
7.0
5.0

100
70
50

tf

30

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

20

3.0
1.0

2.0

50 70

20 30
5.0 7.0 10
3.0
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0

3.0

500

70 100

10
TJ = 25C
f = 100 MHz

TJ = 25C
f = 1.0 MHz

7.0

300
VCE = 20 V
200

5.0 V

100

Cib

5.0

Cob
3.0
2.0

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.2

0.5

1.0

2.0

5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 15. CurrentGain Bandwidth Product

Figure 16. Capacitance

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

3.0
2.0
1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

hfe 200 @ IC = 1.0 mA

7.0
5.0

0.2
0.1

10

20

50

200

10

100
70
50

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C
hfe 200 @ IC = 1.0 mA

30
20
10
7.0
5.0
3.0

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

Figure 17. Input Impedance

2212

0.1

IC, COLLECTOR CURRENT (mA)

20
hie , INPUT IMPEDANCE (k )

50

Figure 14. TurnOff Time

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 13. TurnOn Time

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

50

100

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 18. Output Admittance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

BCW72LT1
1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19A

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

t2

1.0

2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 19. Thermal Response

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 Vdc

A train of periodical power pulses can be represented by the model


as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 19 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 19 by the
steady state value RJA.

103
102

ICEO

101

Example:
The MPS3904 is dissipating 2.0 watts peak under the following
conditions:
t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.

ICBO
AND
ICEX @ VBE(off) = 3.0 Vdc

100
101
102

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

The peak rise in junction temperature is therefore


T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.
For more information, see AN569.

Figure 19A.

IC, COLLECTOR CURRENT (mA)

400
1.0 ms

200
100
60
40

TC = 25C

dc
dc
TJ = 150C

10

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

6.0
2.0

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 20 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.

10 s
1.0 s

TA = 25C

20

4.0

100 s

4.0
6.0 8.0 10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

40

Figure 20.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2213

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA


COLLECTOR 3

General Purpose
Transistors

1
BASE
2 EMITTER

COLLECTOR 3
1
BASE

PNP
BCX17LT1
BCX18LT1
NPN
BCX19LT1
BCX20LT1
Voltage and current are negative
for PNP transistors

2 EMITTER

3
1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Value
Symbol

BCX17LT1
BCX19LT1

BCX18LT1
BCX20LT1

Unit

CollectorEmitter Voltage

VCEO

45

25

Vdc

CollectorBase Voltage

VCBO

50

30

Vdc

EmitterBase Voltage

VEBO

5.0

Vdc

IC

500

mAdc

Rating

Collector Current Continuous

DEVICE MARKING
BCX17LT1 = T1; BCX18LT1 = T2; BCX19LT1 = U1; BCX20LT1 = U2

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR-5 Board (1)
TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate, (2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

Symbol

Max

Unit

PD

225

mW

1.8

mW/C

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina

2214

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PNP BCX17LT1 BCX18LT1 NPN BCX19LT1 BCX20LT1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

45
25

50
30

100
5.0

nAdc
Adc

10

Adc

100
70
40

600

OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage
(IC = 10 mAdc, IB = 0)
CollectorEmitter Breakdown Voltage
(IC = 10 Adc, IC = 0)

V(BR)CEO
BCX17, 19
BCX18, 20

Vdc

V(BR)CES
BCX17, 19
BCX18, 20

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)
(VCB = 20 Vdc, IE = 0, TA = 150C)

ICBO

Emitter Cutoff Current


(VEB = 5.0 Vdc, IC = 0)

IEBO

Vdc

ON CHARACTERISTICS
DC Current Gain
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 300 mAdc, VCE = 1.0 Vdc)
(IC = 500 mAdc, VCE = 1.0 Vdc)

hFE

CollectorEmitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

0.62

Vdc

BaseEmitter On Voltage
(IC = 500 mAdc, VCE = 1.0 Vdc)

VBE(on)

1.2

Vdc

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2215

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BCX70GLT1
BCX70JLT1
BCX70KLT1

General Purpose Transistors


NPN Silicon

COLLECTOR
3
1
BASE
2
EMITTER

3
1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

45

Vdc

Collector Base Voltage

VCBO

45

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

200

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BCX70GLT1 = AG; BCX70JLT1 = AJ; BCX70KLT1 = AK

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 2.0 mAdc, IE= 0)

V(BR)CEO

45

Vdc

Emitter Base Breakdown Voltage


(IE = 1.0 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

20
20

nAdc
mAdc

20

nAdc

OFF CHARACTERISTICS

Collector Cutoff Current


(VCE = 32 Vdc)
(VCE = 32 Vdc, TA = 150C)

ICES

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

2216

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCX70GLT1 BCX70JLT1 BCX70KLT1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

BCX70G
BCX70J
BCX70K

40
100

(IC = 2.0 mAdc, VCE = 5.0 Vdc)

BCX70G
BCX70J
BCX70K

120
250
380

220
460
630

(IC = 50 mAdc, VCE = 1.0 Vdc)

BCX70G
BCX70J
BCX70K

60
90
100

0.55
0.35

0.7
0.6

1.05
0.85

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 50 mAdc, IB = 1.25 mAdc)
(IC = 10 mAdc, IB = 0.25 mAdc)

VCE(sat)

Vdc

Base Emitter Saturation Voltage


(IC = 50 mAdc, IB = 1.25 mAdc)
(IC = 50 mAdc, IB = 0.25 mAdc)

VBE(sat)

Base Emitter On Voltage


(IC = 2.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

0.55

0.75

Vdc

fT

125

MHz

Cobo

4.5

pF

125
250
350

250
500
700

NF

6.0

dB

TurnOn Time
(IC = 10 mAdc, IB1 = 1.0 mAdc)

ton

150

ns

TurnOff Time
(IB2 = 1.0 mAdc, VBB = 3.6 Vdc, R1 = R2 = 5.0 k, RL = 990)

toff

800

ns

Vdc

SMALL SIGNAL CHARACTERISTICS


CurrentGain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 Vdc, IC = 0, f = 1.0 MHz)
Small Signal Current Gain
(IC = 2.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

hfe
BCX70G
BCX70J
BCX70K

Noise Figure
(IC = 0.2 mAdc, VCE = 5.0 Vdc, RS = 2.0 k, f = 1.0 kHz, BW = 200 Hz)

SWITCHING CHARACTERISTICS

EQUIVALENT SWITCHING TIME TEST CIRCUITS


+ 3.0 V
300 ns
DUTY CYCLE = 2%

275

+10.9 V

+ 3.0 V

10 < t1 < 500 s


DUTY CYCLE = 2%

t1

+10.9 V

10 k

0.5 V
<1.0 ns

275
10 k

0
CS < 4.0 pF*

9.1 V

< 1.0 ns

1N916

CS < 4.0 pF*

*Total shunt capacitance of test jig and connectors

Figure 1. TurnOn Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 2. TurnOff Time

2217

BCX70GLT1 BCX70JLT1 BCX70KLT1


TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
20

100
BANDWIDTH = 1.0 Hz
RS = 0

50

300 A

10

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

IC = 1.0 mA

100 A

7.0
5.0
10 A
3.0

20

300 A
100 A

10
5.0
2.0
1.0
30 A

0.5

30 A

BANDWIDTH = 1.0 Hz
RS

IC = 1.0 mA

10 A

0.2
2.0

0.1
10

20

50

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

10

20

50

Figure 3. Noise Voltage

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

Figure 4. Noise Current

NOISE FIGURE CONTOURS


(VCE = 5.0 Vdc, TA = 25C)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k

RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

500 k

20 k
10 k
5k

2.0 dB

2k
1k
500

3.0 dB 4.0 dB
6.0 dB

10 dB

200
100
50

1M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

1.0 dB

5k

2.0 dB

2k
1k
500

5.0 dB

200
100
10

20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

8.0 dB
10

20

Figure 5. Narrow Band, 100 Hz

500 k
RS , SOURCE RESISTANCE (OHMS)

3.0 dB

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

Figure 6. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is defined as:

20 k
10 k
5k

NF
1.0 dB

2k
1k
500

3.0 dB
5.0 dB
8.0 dB
10

20

30

50 70 100

200 300

500 700

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

2.0 dB

200
100
50

+ 20 log10

1k

IC, COLLECTOR CURRENT (A)

Figure 7. Wideband
2218

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BCX70GLT1 BCX70JLT1 BCX70KLT1


TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C

25C

200

55C
100
80
60

VCE = 1.0 V
VCE = 10 V

40
0.004 0.006 0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3
0.5 0.7 1.0
2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0 10

20

30

50

70 100

100

1.0
TJ = 25C
IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 8. DC Current Gain

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%

300 A
200 A
40
100 A
20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
VBE(sat) @ IC/IB = 10

0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.2

2.0
5.0
10
20
0.5 1.0
IC, COLLECTOR CURRENT (mA)

40

Figure 10. Collector Characteristics

1.4

0.1

400 A

60

Figure 9. Collector Saturation Region

0.8

IB = 500 A

50

100

Figure 11. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6

*APPLIES for IC/IB hFE/2

0.8
25C to 125C
0

*qVC for VCE(sat)


55C to 25C

0.8
25C to 125C
1.6

qVB for VBE


2.4
0.1

0.2

55C to 25C

0.5
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 12. Temperature Coefficients

2219

BCX70GLT1 BCX70JLT1 BCX70KLT1


TYPICAL DYNAMIC CHARACTERISTICS
1000
VCC = 3.0 V
IC/IB = 10
TJ = 25C

100
70
50

700
500

ts

300
200
t, TIME (ns)

t, TIME (ns)

300
200

tr

30
20
td @ VBE(off) = 0.5 Vdc

10
7.0
5.0

100
70
50

tf

30

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

20

3.0
1.0

2.0

50 70

20 30
5.0 7.0 10
3.0
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0

3.0

500

70 100

10
TJ = 25C
f = 100 MHz

TJ = 25C
f = 1.0 MHz

7.0

300
VCE = 20 V
200

5.0 V

100

Cib

5.0

Cob
3.0
2.0

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.2

0.5

1.0

2.0

5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 15. CurrentGain Bandwidth Product

Figure 16. Capacitance

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

3.0
2.0
1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

hfe 200 @ IC = 1.0 mA

7.0
5.0

0.2
0.1

10

20

50

200

10

100
70
50

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C
hfe 200 @ IC = 1.0 mA

30
20
10
7.0
5.0
3.0

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

Figure 17. Input Impedance

2220

0.1

IC, COLLECTOR CURRENT (mA)

20
hie , INPUT IMPEDANCE (k )

50

Figure 14. TurnOff Time

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 13. TurnOn Time

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

50

100

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 18. Output Admittance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

BCX70GLT1 BCX70JLT1 BCX70KLT1


1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19A

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

t2

1.0

2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 19. Thermal Response

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 Vdc

A train of periodical power pulses can be represented by the model


as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 19 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 19 by the
steady state value RJA.

103
102

ICEO

101

Example:
The MPS3904 is dissipating 2.0 watts peak under the following
conditions:
t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.

ICBO
AND
ICEX @ VBE(off) = 3.0 Vdc

100
101
102

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

The peak rise in junction temperature is therefore


T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.
For more information, see AN569.

Figure 19A.

IC, COLLECTOR CURRENT (mA)

400
1.0 ms

200
100
60
40

TC = 25C

dc
dc
TJ = 150C

10

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

6.0
2.0

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 20 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.

10 s
1.0 s

TA = 25C

20

4.0

100 s

4.0
6.0 8.0 10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

40

Figure 20.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2221

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt Amplifier Transistor

BDB01C

NPN Silicon

COLLECTOR
3
2
BASE
1

1
EMITTER

CASE 2905, STYLE 1


TO92 (TO226AE)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

80

Vdc

Collector Base Voltage

VCES

80

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

0.5

Adc

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

1.0
8.0

Watt
mW/C

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

2.5
20

Watt
mW/C

TJ, Tstg

55 to
+150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

80

0.01

100

Unit

OFF CHARACTERISTICS
Collector Emitter Voltage
(IC = 10 mA, IB = 0)

V(BR)CEO

Collector Cutoff Current


(VCB = 80 V, IE = 0)

ICBO

Emitter Cutoff Current


(IC = 0, VEB = 5.0 V)

IEBO

Vdc

mAdc
nAdc

REV 1

2222

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BDB01C
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

40
25

400

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 mA, VCE = 1.0 V)
(IC = 500 mA, VCE = 2.0 V)

hFE

Collector Emitter Saturation Voltage(1)


(IC = 1000 mA, IB = 100 mA)

VCE(sat)

0.7

Vdc

Collector Emitter On Voltage(1)


(IC = 1000 mA, VCE = 1.0 V)

VBE(on)

1.2

Vdc

fT

50

MHz

Cob

30

pF

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 200 mA, VCE = 5.0 V, f = 20 MHz)
Output Capacitance
(VCB = 10 V, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle 2.0%.

400

hFE , DC CURRENT GAIN

TJ = 125C

VCE = 1.0 V

200
25C
55C
100
80
60
40
0.5

0.7

1.0

2.0

3.0

5.0

7.0
10
20
30
IC, COLLECTOR CURRENT (mA)

50

70

100

200

300

500

1.0

1.0
TJ = 25C

TJ = 25C

0.8

0.6

0.8
IC = 10 mA

50
mA

100 mA

250 mA

V, VOLTAGE (VOLTS)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

500 mA

0.4

0.2

VBE(sat) @ IC/IB = 10
0.6

VBE(on) @ VCE = 1.0 V

0.4

0.2
VCE(sat) @ IC/IB = 10

0
0.05

0.1

0.2

1.0
0.5
2.0
5.0
IB, BASE CURRENT (mA)

10

20

50

Figure 2. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0
0.5

1.0

2.0

20
5.0
10
50
100
IC, COLLECTOR CURRENT (mA)

200

500

Figure 3. On Voltages

2223

80

0.8
1.2

40

1.6
VB for VBE

2.0

2.4

Cibo

20

10
8.0
6.0

2.8
0.5

1.0

2.0

5.0
20
50
10
100
IC, COLLECTOR CURRENT (mA)

200

4.0
0.1

500

Figure 4. BaseEmitter Temperature Coefficient

Cobo
0.2

0.5 1.0 2.0


5.0 10
20
VR, REVERSE VOLTAGE (VOLTS)

50

100

Figure 5. Capacitance

300
200

VCE = 2.0 V
TJ = 25C

IC, COLLECTOR CURRENT (mA)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

TJ = 25C

60
C, CAPACITANCE (pF)

VB, TEMPERATURE COEFFICIENT (mV/C)

BDB01C

100
70
50

DUTY CYCLE 10%


2k

3.0

5.0 7.0 10
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

Figure 6. CurrentGain Bandwidth Product

2224

200

100 s

500
200
100
50
20

30
2.0

1.0 ms

1k

10
1.0

TA = 25C

TC = 25C

1.0 s

dc
dc
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN
BDB01C
LIMIT
2.0
5.0
10
20
45 60 80 100
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. Active RegionSafe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt Amplifier Transistors

BDB02C

PNP Silicon

COLLECTOR
3
2
BASE
1
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

80

Vdc

Collector Base Voltage

VCES

80

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

0.5

Adc

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

1.0
8.0

Watt
mW/C

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

2.5
20

Watt
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

CASE 2905, STYLE 1


TO92 (TO226AE)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

80

0.1

100

40
25

400

Unit

OFF CHARACTERISTICS
Collector Emitter Voltage
(IC = 10 mA, IB = 0)

V(BR)CEO

Collector Cutoff Current


(VCB = 80 V, IE = 0)

ICBO

Emitter Cutoff Current (IC = 0, VEB = 5.0 V)

IEBO

Vdc

mAdc
nAdc

ON CHARACTERISTICS
DC Current Gain
(IC = 100 mA, VCE = 1.0 V)
(IC = 500 mA, VCE = 2.0 V)

hFE

Collector Emitter Saturation Voltage(1) (IC = 1000 mA, IB = 100 mA)

VCE(sat)

0.7

Vdc

Collector Emitter On Voltage(1) (IC = 1000 mA, VCE = 1.0 V)

VBE(on)

1.2

Vdc

fT

50

MHz

Cob

30

pF

DYNAMIC CHARACTERISTICS
CurrentGain Bandwidth Product (IC = 200 mA, VCE = 5.0 V, f = 20 MHz)
Output Capacitance (VCB = 10 V, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle 2.0%.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2225

BDB02C
400

hFE, DC CURRENT GAIN

TJ = 125C

VCE = 1.0 V

200
25C
55C
100
80
60
40
0.5 0.7

1.0

2.0

3.0

5.0

7.0 10
20
30
IC, COLLECTOR CURRENT (mA)

50

70

100

200

300

500

1.0

1.0
TJ = 25C

TJ = 25C
0.8

0.8

0.6
IC = 10 mA

50
mA

100 mA

250 mA

V, VOLTAGE (VOLTS)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

500 mA

0.4

0.2

VBE(sat) @ IC/IB = 10
0.6

VBE(on) @ VCE = 1.0 V

0.4

0.2
VCE(sat) @ IC/IB = 10

0
0.05 0.1

0.2

0.5 1.0 2.0


5.0
IB, BASE CURRENT (mA)

10

20

0
0.5 1.0

50

5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mA)

500

Figure 3. On Voltages

100

0.8

70
1.2

Cibo

TJ = 25C

50
C, CAPACITANCE (pF)

VB, TEMPERATURE COEFFICIENT (mV/C)

Figure 2. Collector Saturation Region

2.0

1.6
VB for VBE

2.0

30
20

10

2.4

Cobo

7.0
2.8
0.5

1.0

2.0

5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mA)

500

Figure 4. BaseEmitter Temperature Coefficient

2226

5.0
0.1

0.2

0.5 1.0 2.0


5.0 10 20
VR, REVERSE VOLTAGE (VOLTS)

50 100

Figure 5. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

300
200

VCE = 2.0 V
TJ = 25C

IC, COLLECTOR CURRENT (mA)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz

BDB02C

100
70
50

DUTY CYCLE 10%


2 k

1.0 ms

1 k

100 s

500
TA = 25C

200

TC = 25C

dc
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

100
50

10 s
dc

20
30
2.0 3.0

5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)

200

Figure 6. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10
1.0

BDB02C
2.0
5.0
10
20
45 60 80 100
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. Active Region Safe Operating Area

2227

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt Amplifier Transistor

BDC01D

NPN Silicon

COLLECTOR
2
3
BASE
1

1
EMITTER

CASE 2905, STYLE 14


TO92 (TO226AE)

MAXIMUM RATINGS
Rating

Symbol

BDC01D

Unit

Collector Emitter Voltage

VCEO

100

Vdc

Collector Base Voltage

VCBO

100

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

0.5

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)CEO

100

Vdc

Collector Cutoff Current


(VCB = 100 V, IE = 0)

ICBO

0.1

mAdc

Emitter Cutoff Current


(IC = 0, VEB = 5.0 V)

IEBO

100

nAdc

OFF CHARACTERISTICS
Collector Emitter Voltage
(IC = 10 mA, IB = 0)

2228

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BDC01D
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

40
25

400

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 mA, VCE = 1.0 V)
(IC = 500 mA, VCE = 2.0 V)

hFE

Collector Emitter Saturation Voltage(1)


(IC = 1000 mA, IB = 100 mA)

VCE(sat)

0.7

Vdc

Collector Emitter On Voltage(1)


(IC = 1000 mA, VCE = 1.0 V)

VBE(on)

1.2

Vdc

fT

50

MHz

Cob

30

pF

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 200 mA, VCE = 5.0 V, f = 20 MHz)
Output Capacitance
(VCB = 10 V, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle 2.0%.

400

hFE , DC CURRENT GAIN

TJ = 125C

VCE = 1.0 V

200
25C
55C
100
80
60
40
0.5

0.7

1.0

2.0

3.0

5.0

7.0
10
20
30
IC, COLLECTOR CURRENT (mA)

50

70

100

200

300

500

1.0

1.0
TJ = 25C

TJ = 25C

0.8

0.6

0.8
IC = 10 mA

50
mA

100 mA

250 mA

V, VOLTAGE (VOLTS)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

500 mA

0.4

0.2

VBE(sat) @ IC/IB = 10
0.6

VBE(on) @ VCE = 1.0 V

0.4

0.2
VCE(sat) @ IC/IB = 10

0
0.05

0.1

0.2

0.5
1.0
2.0
5.0
IB, BASE CURRENT (mA)

10

20

50

Figure 2. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0
0.5

1.0

2.0

20
5.0
10
50
100
IC, COLLECTOR CURRENT (mA)

200

500

Figure 3. On Voltages

2229

80

0.8

TJ = 25C

60
1.2

40
C, CAPACITANCE (pF)

VB, TEMPERATURE COEFFICIENT (mV/C)

BDC01D

1.6
VB for VBE

2.0

2.4

Cibo

20

10
8.0
6.0

2.8
0.5

1.0

2.0

5.0
20
50
10
100
IC, COLLECTOR CURRENT (mA)

200

Cobo

4.0
0.1

500

0.2

0.5 1.0 2.0


5.0 10
20
VR, REVERSE VOLTAGE (VOLTS)

100

Figure 5. Capacitance

300
200

VCE = 2.0 V
TJ = 25C

IC, COLLECTOR CURRENT (mA)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 4. BaseEmitter Temperature Coefficient

50

100
70
50

DUTY CYCLE 10%


2k

1.0 ms

1k

100 s

500
TA = 25C

200
100
50
20

30
2.0

3.0

5.0 7.0 10
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

Figure 6. CurrentGain Bandwidth Product

2230

200

10
1.0

TC = 25C

1.0 s

dc
dc
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
MPSW05
MPSW06
10
20
60 80 100
2.0
5.0
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. Active Region Safe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

RF Transistor
NPN Silicon

BF199

COLLECTOR
1
3
BASE
2
EMITTER

1
2

CASE 2904, STYLE 21


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

25

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

357

C/W

Thermal Resistance, Junction to Case

RqJC

125

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

25

40

4.0

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Vdc
Vdc
Vdc

ICBO

nAdc

2231

BF199
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

40

85

770

900

400

750

0.25

0.35

2.5

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 7.0 mAdc, VCE = 10 Vdc)

hFE

BaseEmitter On Voltage
(IC = 7.0 mAdc, VCE = 10 Vdc)

VBE(on)

mVdc

SMALLSIGNAL CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 5.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
Common Emitter Feedback Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Noise Figure
(IC = 4.0 mAdc, VCE = 10 Vdc, RS = 50 , f = 35 MHz)

2232

fT

MHz

Cre

pF

Nf

dB

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1000
700
500

10

BF199

VCE = 10 V
TA = 25C

300

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

BF199

200
100

2
Cib
1
0.7
0.5
0.4
0.3

20

Cob

Cre @ IE = 0

0.2

10

0.2 0.3 0.5 0.7 1


3 5
10
20
IC, COLLECTOR CURRENT (mA)

100

0.1

0.2

0.5
1
3 5
10
20
VR, REVERSE VOLTAGE (VOLTS)

Figure 1. CurrentGain Bandwidth Product

Figure 2. Capacitances

100
VCE = 10 V
50
100 MHz

20

200
100
70
50

BF199

mmhos

hFE, DC CURRENT GAIN

VCE = 10 V
TA = 25C

10
5

45 MHz

30
20

10.7 MHz

10
0.1

0.2 0.3 0.5 0.7 1


2 3 5 7 10
20
IC, COLLECTOR CURRENT (mA)

Figure 3. DC Current Gain

100

b11e 470 kHz < 0.2 mmhos


4
5
6
7
8
IC, COLLECTOR CURRENT (mA)

Figure 4. b11e

2000
100 MHz

VCE = 10 V
50

100 MHz

1000

10

10.7 MHz

45 MHz

200
100

10.7 MHz

50

2
1

500

45 MHz

20

mhos

mmhos

VCE = 10 V

b21e, at 470 kHz < 0.5 mmhos


4
5
6
7
8
IC, COLLECTOR CURRENT (mA)

Figure 5. b21e

Motorola SmallSignal Transistors, FETs and Diodes Device Data

20

470 kHz
1

3
4
5
IC, COLLECTOR CURRENT (mA)

Figure 6. b22e (boe)

2233

BF199
10
VCE = 10 V

200

100 MHz

5
45 MHz
10.7 MHz
470 kHz

f = 0.47 to 45 MHz

50
mmhos

mmhos

2
1

20
10

0.5

0.2
0.1

VCE = 10 V

100

4
5
6
IC, COLLECTOR CURRENT (mA)

3
4
5
IC, COLLECTOR CURRENT (mA)

Figure 7. g11e (gie)

Figure 8. g21e (Yfe)

200
VCE = 10 V

100 MHz

100
50

45 MHz

mhos

10.7 MHz
470 kHz

20
10
5

3
4
5
IC, COLLECTOR CURRENT (mA)

Figure 9. g22e (goe)

2234

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

RF Transistor
NPN Silicon

BF224

COLLECTOR
1
3
BASE
2
EMITTER

1
2

CASE 2904, STYLE 21


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

30

Vdc

Collector Base Voltage

VCBO

45

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

Collector Current Continuous

IC

50

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

357

C/W

Thermal Resistance, Junction to Case

RqJC

125

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

30

45

4.0

100

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)

ICBO

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Vdc
Vdc
Vdc
nAdc
nAdc

2235

BF224
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

30

0.77

0.9

0.15

300

600
850

0.28

2.5
3.5

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 7.0 mAdc, VCE = 10 Vdc)

hFE

BaseEmitter On Voltage
(IC = 7.0 mAdc, VCE = 10 Vdc)

VBE(on)

CollectorEmitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

mVdc
Vdc

SMALLSIGNAL CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 1.5 mAdc, VCE = 10 Vdc, f = 100 MHz)
(IC = 7.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
Common Emitter Feedback Capacitance
(VCE = 10 Vdc, IE = 0, f = 1.0 MHz)
Noise Figure
(IC = 1.0 mAdc, VCE = 10 Vdc, RS = 50 , f = 100 MHz)
(IC = 1.0 mAdc, VCE = 10 Vdc, RS = 50 , f = 200 MHz)

2236

fT

MHz

Cre

pF

Nf

dB

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1000
700
500

10

BF224

VCE = 10 V
TA = 25C

300

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

BF224

200
100

2
Cib
1
0.7
0.5
0.4
0.3

20

Cob

Cre @ IE = 0

0.2

10

0.2 0.3 0.5 0.7 1


3 5
10
20
IC, COLLECTOR CURRENT (mA)

100

0.1

0.2

0.5
1
3 5
10
20
VR, REVERSE VOLTAGE (VOLTS)

Figure 1. CurrentGain Bandwidth Product

Figure 2. Capacitances

100
VCE = 10 V
50
100 MHz

20

200
100
70
50

BF224

mmhos

hFE, DC CURRENT GAIN

VCE = 10 V
TA = 25C

10
5

45 MHz

30
20

10.7 MHz

10
0.1

0.2 0.3 0.5 0.7 1


2 3 5 7 10
20
IC, COLLECTOR CURRENT (mA)

Figure 3. DC Current Gain

100

b11e 470 kHz < 0.2 mmhos


4
5
6
7
8
IC, COLLECTOR CURRENT (mA)

Figure 4. b11e

2000
100 MHz

VCE = 10 V
50

100 MHz

1000

10

10.7 MHz

45 MHz

200
100

10.7 MHz

50

2
1

500

45 MHz

20

mhos

mmhos

VCE = 10 V

b21e, at 470 kHz < 0.5 mmhos


4
5
6
7
8
IC, COLLECTOR CURRENT (mA)

Figure 5. b21e

Motorola SmallSignal Transistors, FETs and Diodes Device Data

20

470 kHz
1

3
4
5
IC, COLLECTOR CURRENT (mA)

Figure 6. b22e (boe)

2237

BF224
10
VCE = 10 V

200

100 MHz

5
45 MHz
10.7 MHz
470 kHz

f = 0.47 to 45 MHz

50
mmhos

mmhos

2
1

20
10

0.5

0.2
0.1

VCE = 10 V

100

4
5
6
IC, COLLECTOR CURRENT (mA)

3
4
5
IC, COLLECTOR CURRENT (mA)

Figure 7. g11e (gie)

Figure 8. g21e (Yfe)

200
VCE = 10 V

100 MHz

100
50

45 MHz

mhos

10.7 MHz
470 kHz

20
10
5

3
4
5
IC, COLLECTOR CURRENT (mA)

Figure 9. g22e (goe)

2238

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA


AM/FM Transistor

BF240

NPN Silicon
COLLECTOR
1
3
BASE

2
EMITTER

CASE 2904, STYLE 21


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

Collector Current Continuous

IC

25

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.0
8.0

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

357

C/W

Thermal Resistance, Junction to Case

RqJC

125

C/W

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

CollectorBase Breakdown Voltage (IC = 100 Adc, IE = 0)

V(BR)CBO

40

Vdc

EmitterBase Breakdown Voltage (IE = 10 Adc, IC = 0)

V(BR)EBO

4.0

Vdc

ICBO

100

nAdc

hFE

65

220

VBE(on)

0.65

0.7

0.74

Vdc

fT

600

MHz

Cre

0.28

0.34

pF

OFF CHARACTERISTICS

Collector Cutoff Current (VCB = 20 Vdc, IE = 0)

ON CHARACTERISTICS
DC Current Gain (IC = 1.0 mAdc, VCE = 10 Vdc)
BaseEmitter On Voltage (IC = 1.0 mAdc, VCE = 10 Vdc)

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
Common Emitter Feedback Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2239

1000
700
500

10

BF240

VCE = 10 V
TA = 25C

300

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

BF240

200
100

2
Cib
1
0.7
0.5
0.4
0.3

20

Cob

Cre @ IE = 0

0.2

10

0.2 0.3 0.5 0.7 1


3 5
10
20
IC, COLLECTOR CURRENT (mA)

100

0.1

0.2

0.5
1
3 5
10
20
VR, REVERSE VOLTAGE (VOLTS)

Figure 1. CurrentGain Bandwidth Product

Figure 2. Capacitances

100
VCE = 10 V
50
100 MHz

20

200
100
70
50

BF240

mmhos

hFE, DC CURRENT GAIN

VCE = 10 V
TA = 25C

10
5

45 MHz

30
20

10.7 MHz

10
0.1

0.2 0.3 0.5 0.7 1


2 3 5 7 10
20
IC, COLLECTOR CURRENT (mA)

Figure 3. DC Current Gain

100

b11e 470 kHz < 0.2 mmhos


4
5
6
7
8
IC, COLLECTOR CURRENT (mA)

Figure 4. b11e

2000
100 MHz

VCE = 10 V
50

100 MHz

1000

10

10.7 MHz

10.7 MHz

50

b21e, at 470 kHz < 0.5 mmhos


4
5
6
7
8
IC, COLLECTOR CURRENT (mA)

Figure 5. b21e

2240

45 MHz

200
100

2
1

500

45 MHz

20

mhos

mmhos

VCE = 10 V

20

470 kHz
1

3
4
5
IC, COLLECTOR CURRENT (mA)

Figure 6. b22e (boe)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BF240
10
VCE = 10 V

200

100 MHz

5
45 MHz
10.7 MHz
470 kHz

f = 0.47 to 45 MHz

50
mmhos

mmhos

2
1

20
10

0.5

0.2
0.1

VCE = 10 V

100

4
5
6
IC, COLLECTOR CURRENT (mA)

3
4
5
IC, COLLECTOR CURRENT (mA)

Figure 7. g11e (gie)

Figure 8. g21e (Yfe)

200
VCE = 10 V

100 MHz

100
50

45 MHz

mhos

10.7 MHz
470 kHz

20
10
5

3
4
5
IC, COLLECTOR CURRENT (mA)

Figure 9. g22e (goe)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2241

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistor


NPN Silicon

BF393

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

300

Vdc

Collector Base Voltage

VCBO

300

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to


Ambient

Characteristic

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

300

300

6.0

0.1

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IB =0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 200 Vdc, IE = 0)

ICBO

Emitter Cutoff Current


(VEB = 6.0 Vdc, IC = 0)

IEBO

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Vdc
Vdc
Vdc
Adc
Adc

(Replaces BF392/D)

2242

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BF393
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

25
40

2.0

2.0

50

2.0

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VBE(sat)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 20 MHz)
Common Emitter Feedback Capacitance
(VCB = 60 Vdc, IE = 0, f = 1.0 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

fT

MHz

Cre

pF

2243

BF393
200

hFE, DC CURRENT GAIN

VCE = 10 Vdc
TJ = +125C

100

25C
50
55C
30
20
1.0

2.0

3.0

5.0

7.0
10
IC, COLLECTOR CURRENT (mA)

20

30

50

100

70

100

C, CAPACITANCE (pF)

50
Ceb

20
10
5.0

Ccb

2.0
1.0
0.2

0.5

1.0 2.0
5.0 10
20
50
VR, REVERSE VOLTAGE (VOLTS)

100

200

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 1. DC Current Gain

100
70
50

30
20

10
1.0

Figure 2. Capacitances

IC, COLLECTOR CURRENT (mA)

V, VOLTAGE (VOLTS)

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

500
TJ = 25C

1.2
1.0
0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 10 V

0.4
0.2

VCE(sat) @ IC/IB = 10
2.0

3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

Figure 4. On Voltages

2244

2.0

Figure 3. CurrentGain Bandwidth Product

1.4

0
1.0

TJ = 25C
VCE = 20 V
f = 20 MHz

50

70 100

200
100

10 s

100 s

TA = 25C

1.0 ms

TC = 25C

50

100 ms

20
CURRENT LIMIT
THERMAL LIMIT
(PULSE CURVES @ TC = 25C)
SECOND BREAKDOWN LIMIT

10
5.0
2.0
1.0

CURVES APPLY
BELOW RATED VCEO

0.5
0.5

1.0

2.0

5.0

10

20

MPSA43
MPSA42
50
100

200

500

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 5. Maximum Forward Bias


Safe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistors


NPN Silicon

BF420
BF422

COLLECTOR
2
3
BASE
1
EMITTER

MAXIMUM RATINGS

Rating

Symbol

BF420

BF422

Unit

Collector Emitter Voltage

VCEO

300

250

Vdc

Collector Base Voltage

VCBO

300

250

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 14


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

300
250

300
250

5.0
5.0

0.01

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)
Emitter Base Breakdown Voltage
(IE = 100 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 200 Vdc, IE = 0)
Emitter Cutoff Current
(VEB = 5.0 Vdc, IC = 0)
1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

V(BR)CEO
BF420
BF422

Vdc

V(BR)CBO
BF420
BF422

Vdc

V(BR)EBO
BF420
BF422

Vdc

Adc

ICBO
BF420
BF422
IEBO
BF420
BF422

nAdc

2245

BF420 BF422
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

50
50

0.5

2.0

60

1.6

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 25 mAdc, VCE = 20 Vdc)

hFE
BF420
BF422

Collector Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VBE(sat)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 20 MHz)
Common Emitter Feedback Capacitance
(VCB = 30 Vdc, IE = 0, f = 1.0 MHz)

2246

fT

MHz

Cre

pF

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BF420 BF422
200

hFE, DC CURRENT GAIN

VCE = 10 Vdc
TJ = +125C

100

25C
50
55C
30
20
1.0

2.0

3.0

5.0

7.0
10
IC, COLLECTOR CURRENT (mA)

20

30

50

100

70

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 1. DC Current Gain

100

C, CAPACITANCE (pF)

50
Ceb

20
10
5.0

Ccb

2.0
1.0
0.2

0.5

1.0 2.0
5.0 10
20
50
VR, REVERSE VOLTAGE (VOLTS)

100

200

100
70
50

30
20

10
1.0

Figure 2. Capacitances

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

500
IC, COLLECTOR CURRENT (mA)

TJ = 25C

1.2
V, VOLTAGE (VOLTS)

2.0

Figure 3. CurrentGain Bandwidth Product

1.4

1.0
0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 10 V

0.4
0.2
0
1.0

TJ = 25C
VCE = 20 V
f = 20 MHz

VCE(sat) @ IC/IB = 10
2.0

3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

Figure 4. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

200
100

10 s

100 s

TA = 25C

1.0 ms

TC = 25C

50

100 ms

20
CURRENT LIMIT
THERMAL LIMIT
(PULSE CURVES @ TC = 25C)
SECOND BREAKDOWN LIMIT

10
5.0
2.0
1.0

CURVES APPLY
BELOW RATED VCEO

0.5
0.5

1.0

2.0

5.0

10

20

MPSA43
MPSA42
50
100

200

500

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 5. Maximum Forward Bias


Safe Operating Area

2247

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistors

BF421
BF423

PNP Silicon

COLLECTOR
2
3
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

BF421

BF423

Unit

Collector Emitter Voltage

VCEO

300

250

Vdc

Collector Base Voltage

VCBO

300

250

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 14


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Characteristic

Min

Max

300
250

300
250

5.0
5.0

0.01

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage (1)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)
Emitter Base Breakdown Voltage
(IE = 100 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 200 Vdc, IE = 0)
Emitter Cutoff Current
(VEB = 5.0 Vdc, IC = 0)
1. Pulse Test: Pulse Width

2248

v 300 ms; Duty Cycle v 2.0%.

V(BR)CEO
BF421
BF423

Vdc

V(BR)CBO
BF421
BF423

Vdc

V(BR)EBO
BF421
BF423

Vdc

mAdc

ICBO
BF421
BF423
IEBO
BF421
BF423

nAdc

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BF421 BF423
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

50
50

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 25 mA, VCE = 20 Vdc)

hFE
BF421
BF423

Collector Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VCE(sat)

0.5

Vdc

Base Emitter Saturation Voltage


(IC = 20 mA, IB = 2.0 mA)

VBE(sat)

2.0

Vdc

fT

60

MHz

Cre

2.8

pF

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 20 MHz)
Common Emitter Feedback Capacitance
(VCB = 30 Vdc, IE = 0, f = 1.0 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2249

BF421 BF423
150

TJ = +125C

VCE = 10 Vdc

hFE, DC CURRENT GAIN

100
+25C
70
55C

50

30
20
15
1.0

2.0

3.0

5.0

7.0

10

20

30

50

80

100

IC, COLLECTOR CURRENT (mA)

100
50
C, CAPACITANCE (pF)

Cib
20
10
5.0

2.0
Ccb
1.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100200 500 1000
VR, REVERSE VOLTAGE (VOLTS)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 1. DC Current Gain

100
TJ = 25C
VCE = 20 Vdc

80
60
40
30
20

0
1.0

Figure 2. Capacitances

2.0

5.0
10
20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 3. CurrentGain Bandwidth Product

1.0

500

100 s

IC, COLLECTOR CURRENT (mA)

1.0 ms

V, VOLTAGE (VOLTS)

0.8
VBE @ VCE = 10 V
0.6

0.4

0.2

0
1.0

VCE(sat) @ IC/IB = 10 mA

2.0

5.0
10
20
IC, COLLECTOR CURRENT (mA)

Figure 4. On Voltages

2250

50

100

1.0 s

200
100

BF423
50

20

1.5 WATT THERMAL


LIMITATION @ TC = 25C
625 mW THERMAL
LIMITATION @ TA = 25C

10
5.0
3.0

BF421

BONDING WIRE LIMITATION


SECOND BREAKDOWN
LIMITATION TJ = 150C
100
200 300
5.0
10
20 30
50
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 5. Active Region Safe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistor

BF493S

PNP Silicon

COLLECTOR
3
2
BASE
1
EMITTER

1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

350

Vdc

Collector Base Voltage

VCBO

350

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

Watts
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage (1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

350

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

350

Vdc

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

6.0

Vdc

Collector Cutoff Current


(VCE = 250 Vdc)

ICES

10

nAdc

Emitter Cutoff Current


(VEB = 6.0 Vdc, IC = 0)

IEBO

0.1

mAdc

Collector Cutoff Current


(VCB = 250 Vdc, IE = 0, TA = 25C)
(VCB = 250 Vdc, IE = 0, TA = 100C)

ICBO

0.005
1.0

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

mAdc

2251

BF493S
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

25
40

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VCE(sat)

2.0

Vdc

Base Emitter On Voltage


(IC = 20 mA, IB = 2.0 mA)

VBE(sat)

2.0

Vdc

fT

50

MHz

Cre

1.6

pF

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 20 MHz)
CommonEmitter Feedback Capacitance
(VCB = 100 Vdc, IE = 0, f = 1.0 MHz)

2252

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BF493S
150

TJ = +125C

VCE = 10 Vdc

hFE, DC CURRENT GAIN

100
+25C
70
55C

50

30
20
15
1.0

2.0

3.0

5.0

7.0

10

20

30

50

80

100

IC, COLLECTOR CURRENT (mA)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 1. DC Current Gain

100
50
C, CAPACITANCE (pF)

Cib
20
10
5.0

2.0
Ccb
1.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100200 500 1000
VR, REVERSE VOLTAGE (VOLTS)

100
TJ = 25C
VCE = 20 Vdc

80
60
40
30
20

0
1.0

Figure 2. Capacitances

2.0

5.0
10
20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 3. CurrentGain Bandwidth Product

1.0

500

100 s

IC, COLLECTOR CURRENT (mA)

1.0 ms

V, VOLTAGE (VOLTS)

0.8
VBE @ VCE = 10 V
0.6

0.4

0.2

0
1.0

VCE(sat) @ IC/IB = 10 mA

2.0

5.0
10
20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 4. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0 s

200
100

MPSA93
50

20

1.5 WATT THERMAL


LIMITATION @ TC = 25C
625 mW THERMAL
LIMITATION @ TA = 25C

10
5.0
3.0

MPSA92

BONDING WIRE LIMITATION


SECOND BREAKDOWN
LIMITATION TJ = 150C
100
200 300
5.0
10
20 30
50
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 5. Active Region Safe Operating Area

2253

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN Silicon Transistor

BF720T1
Motorola Preferred Device

COLLECTOR 2,4

BASE
1

NPN SILICON
TRANSISTOR
SURFACE MOUNT
EMITTER 3

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector-Emitter Voltage

VCEO

300

Vdc

Collector-Base Voltage

VCBO

300

Vdc

Collector-Emitter Voltage

VCER

300

Vdc

Emitter-Base Voltage

VEBO

5.0

Vdc

Collector Current

IC

100

mAdc

Total Power Dissipation up to TA = 25C

PD

1.5

Watts

Storage Temperature Range

Tstg

65 to +150

TJ

150

Symbol

Max

Unit

RJA

83.3

C/W

Junction Temperature

2
3

CASE 318E-04, STYLE 1


SOT223 (TO-261AA)

DEVICE MARKING
DC

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
from Junction-to-Ambient(1)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector-Emitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

300

Vdc

Collector-Base Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

300

Vdc

Collector-Emitter Breakdown Voltage


(IC = 100 Adc, RBE = 2.7 k)

V(BR)CER

300

Vdc

Emitter-Base Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector-Base Cutoff Current


(VCB = 200 Vdc, IE = 0)

ICBO

10

nAdc

CollectorEmitter Cutoff Current


(VCE = 250 Vdc, RBE = 2.7 k)
(VCE = 200 Vdc, RBE = 2.7 k, TJ = 150C)

ICER

50
10

nAdc
Adc

Characteristics

OFF CHARACTERISTICS

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 in2.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2254

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BF720T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

hFE

50

VCE(sat)

0.6

Vdc

fT

60

MHz

Cre

1.6

pF

ON CHARACTERISTICS
DC Current Gain
(IC = 25 mAdc, VCE = 20 Vdc)
Collector-Emitter Saturation Voltage
(IC = 30 mAdc, IB = 5.0 mAdc)

DYNAMIC CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 35 MHz)
Feedback Capacitance
(VCE = 30 Vdc, IC = 0, f = 1.0 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2255

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BF721T1

PNP Silicon Transistor

Motorola Preferred Device

COLLECTOR 2,4

PNP SILICON
TRANSISTOR
SURFACE MOUNT

BASE
1
EMITTER 3

MAXIMUM RATINGS

Symbol

Value

Unit

Collector-Emitter Voltage

Rating

VCEO

300

Vdc

Collector-Base Voltage

VCBO

300

Vdc

Collector-Emitter Voltage

VCER

300

Vdc

Emitter-Base Voltage

VEBO

5.0

Vdc

Collector Current

IC

100

mAdc

Total Power Dissipation up to


TA = 25C(1)

PD

1.5

Watts

Storage Temperature Range

Tstg

65 to +150

TJ

150

Symbol

Max

Unit

RJA

83.3

C/W

Junction Temperature

2
3

CASE 318E-04, STYLE 1


SOT223 (TO-261AA)

DEVICE MARKING
DF

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance from Junction to
Ambient(1)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector-Emitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

300

Vdc

Collector-Base Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

300

Vdc

Collector-Emitter Breakdown Voltage


(IC = 100 Adc, RBE = 2.7 k)

V(BR)CER

300

Vdc

Emitter-Base Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector-Base Cutoff Current


(VCB = 200 Vdc, IE = 0)

ICBO

10

nAdc

CollectorEmitter Cutoff Current


(VCE = 250 Vdc, RBE = 2.7 k)
(VCE = 200 Vdc, RBE = 2.7 k, TJ = 150C)

ICER

50
10

nAdc
Adc

OFF CHARACTERISTICS

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 in2.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

2256

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BF721T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

hFE

50

VCE(sat)

0.8

Vdc

fT

60

MHz

Cre

1.6

pF

ON CHARACTERISTICS
DC Current Gain
(VCE = 25 mAdc, VCE = 20 Vdc)
Collector-Emitter Saturation Voltage
(IC = 30 mAdc, IB = 5.0 mAdc)

DYNAMIC CHARACTERISTICS
Current-Gain Bandwidth Product
(VCE = 10 Vdc, IC = 10 mAdc, f = 35 MHz)
Feedback Capacitance
(VCE = 30 Vdc, IC = 0, f = 1.0 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2257

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistor

BF844

NPN Silicon

COLLECTOR
3
2
BASE
1
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

400

Vdc

Collector Base Voltage

VCBO

450

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

300

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

400

Vdc

Collector Emitter Breakdown Voltage


(IC = 100 Adc, VBE = 0)

V(BR)CES

450

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

450

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

6.0

Vdc

Collector Cutoff Current


(VCB = 400 Vdc, IE = 0)

ICBO

0.1

Adc

Collector Cutoff Current


(VCE = 400 Vdc, VBE = 0)

ICES

500

nAdc

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

0.1

Adc

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

2258

v 300 ms, Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BF844
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

40
50
45
20

200

0.4
0.5
0.75

Unit

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 50 mAdc, VCE = 10 Vdc)
(IC = 100 mAdc, VCE = 10 Vdc)

hFE

Collector Emitter Saturation Voltage(1)


(IC = 1.0 mAdc, IB = 0.1 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

0.75

High Frequency Current Gain


(IC = 10 mAdc, VCE = 10 Vdc, f = 20 MHz)

|hfe|

1.0

CollectorBase Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)

Cob

6.0

pF

EmitterBase Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cib

110

pF

TurnOn Time
(VCC = 150 Vdc, VBE(off) = 4.0 V, IC = 30 mAdc, IB1 = 3.0 mAdc)

ton

0.6

TurnOff Time
(VCC = 150 Vdc, IC = 30 mAdc, IB1 = IB2 = 3.0 mAdc)

toff

10

Vdc

Vdc

DYNAMIC CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2259

160
TA = 125C

hFE, DC CURRENT GAIN

140
120

VCE = 10 V

100
25C

80
60
40

55C
20
1.0

100
5.0
10
20
50
IC, COLLECTOR CURRENT (mA)

2.0

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

BF844

200 300

0.5

0.4

IC = 1.0 mA

IC = 10 mA

0.3
TA = 25C
0.2

0.1

0
10

Figure 1. DC Current Gain

30

100

IC, COLLECTOR CURRENT (mA)

1.0 ms
VBE(sat) @ IC/IB = 10

0.8
V, VOLTAGE (VOLTS)

10 k

50 k

1000
TA = 25C

0.6

VBE(on) @ VCE = 10 V

0.4

VCE(sat) @ IC/IB = 10

0.2

300
200
100

30
3.0
10
1.0
IC, COLLECTOR CURRENT (mA)

0.3

100

10

1.0
1.0

300

Figure 3. On Voltages

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
VALID FOR DUTY CYCLE 10%
2.0

20
50
10
100
5.0
VCE, COLLECTOR VOLTAGE (VOLTS)

200

500

10
|h fe |, SMALLSIGNAL CURRENT GAIN

Cib

50
20

Cob

5.0
TA = 25C
f = 1.0 MHz

2.0
1.0
0.3 0.5

1.0 s

Figure 4. Active Region Safe Operating Area

100

10

TC = 25C

TA = 25C

100 s

20

2.0
0
0.1

C, CAPACITANCE (pF)

300
1.0 k 3.0 k
IB, BASE CURRENT (A)

Figure 2. Collector Saturation Region

1.0

1.0

3.0
10
30
REVERSE BIAS (VOLTS)

Figure 5. Capacitance

2260

IC = 50 mA

100

300

3.0

VCE = 10 V
f = 10 MHz
TA = 25C

2.0
1.5
1.0
0.1

0.2 0.3

1.0
3.0
10
IC, COLLECTOR CURRENT (mA)

30

100

Figure 6. High Frequency Current Gain

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BF844
10

Vin
+9.7 V

t, TIME ( s)

5.0

PW = 50 s
DUTY CYCLE = 2.0%

2.0
0

1.0

4.0 V

0.5

0.2
0.1
1.0

VCC = 150 V
IC/IB = 10
TA = 25C
VBE(off) = 4.0 Vdc

VCC

tr

RL

td

3.0
10
30
IC, COLLECTOR CURRENT (mA)

50

Vout

100
Vin

RB
CS 4.0 pF*

Figure 7. TurnOn Switching Times and Test Circuit

10

Vin

5.0

+10.7 V

t, TIME ( s)

ts

PW = 50 s
DUTY CYCLE = 2.0%

2.0
1.0
0.5

0.2

tf

VCC = 150 V
IC/IB = 10
TA = 25C

11.4 V
VCC
RL

0.1
1.0

3.0

10
30
IC, COLLECTOR CURRENT (mA)

50

100

Vout
Vin

RB
CS 4.0 pF*

Figure 8. TurnOff Switching Times and Test Circuit


* Total Shunt Capacitance or Test Jig and Connectors.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2261

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

VHF Transistor
NPN Silicon

BF959

COLLECTOR
1
3
BASE
2
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

20

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

3.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

1
2

CASE 2904, STYLE 21


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)

V(BR)CEO

20

Vdc

Collector Base Breakdown Voltage (IC = 10 mAdc, IE = 0)

V(BR)CBO

30

Vdc

Emitter Base Breakdown Voltage (IE = 10 mAdc, IC = 0)

V(BR)EBO

3.0

Vdc

ICBO

100

nAdc

35
40

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current (VCB = 20 Vdc, IE = 0)

ON CHARACTERISTICS
DC Current Gain
(IC = 5.0 mAdc, VCE = 10 Vdc)
(IC = 20 mAdc, VCE = 10 Vdc)

hFE

Collector Emitter Saturation Voltage (IC = 30 mAdc, IB = 2.0 mAdc)

VCE(sat)

1.0

Vdc

Base Emitter Saturation Voltage (IC = 30 mAdc, IB = 2.0 mAdc)

VBE(sat)

1.0

Vdc

700
600

Cre

0.65

pF

Nf

3.0

dB

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 20 mAdc, VCE = 10 Vdc, f = 100 MHz)
(IC = 30 mAdc, VCE = 10 Vdc, f = 100 MHz)
Common Emitter Feedback Capacitance
(VCB = 10 Vdc, Pf = 0, f = 10 MHz)
Noise Figure (IC = 4.0 mA, VCE = 10 V, RS = 50 , f = 200 MHz)

2262

fT

MHz

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BF959
500

1000

200
200
100
mV

hFE , DC CURRENT GAIN

500

100

50
40
30

50
40
30

20

20

4 5

10

20

30

50

10

100

4 5

10

20

IC, COLLECTOR CURRENT (mA)

Figure 1. hFE at 10 V

Figure 2. VCE(sat) at IC/IB = 10

2.0

1.8

1.8

1.6

1.6

1.4

1.4
1.2
1
0.8
2V

0.6
0.4

IC, COLLECTOR CURRENT (mA)

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (GHz)

10

10 V
5V

30

50

50

100

1.2
Cib

1
0.8

Cob

0.6
Cre

0.4
0.2

4 5

10

20

30 40 50

100

4 5

10

20

30

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. CurrentGain Bandwidth Product

Figure 4. Capacitances

10

500
b22e
300

g11e

5
4
3

200

g22e

VCE = 10 V

VCE = 10 V
Y22e ( s)

Y11e (ms)

2
b11e

1
0.5
0.4
0.3

50
40
30
20

0.2
0.1

100

10
1

4 5

10

20

30

50

100

4 5

10

20

30

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. Input Impedance at 30 MHz

Figure 6. Output Impedance at 30 MHz

Motorola SmallSignal Transistors, FETs and Diodes Device Data

50

2263

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BSP16T1

SOT-223 Package
High Voltage Transistor
PNP Silicon

Motorola Preferred Device

COLLECTOR 2,4

SOT223 PACKAGE
PNP SILICON
HIGH VOLTAGE
TRANSISTOR
SURFACE MOUNT

BASE
1
EMITTER 3

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

300

Vdc

Collector Base Voltage

VCBO

350

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current

IC

1000

mAdc

Base Current

IB

500

mAdc

Total Device Dissipation, TA = 25C (1)

PD

1.5

Watts

Storage Temperature Range

Tstg

65 to +150

TJ

150

Symbol

Max

Unit

RqJA

83.3

C/W

Junction Temperature

2
3

CASE 318E-04, STYLE 1


TO-261AA

DEVICE MARKING
BT2

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

300

300

50

1.0

20

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 50 mAdc, IB = 0, L = 25 mH)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

CollectorEmitter Cutoff Current


(VCE = 250 Vdc, IB = 0)

ICES

CollectorBase Cutoff Current


(VCB = 280 Vdc, IE = 0)

ICBO

EmitterBase Cutoff Current


(VEB = 6.0 Vdc, IC = 0)

IEBO

Vdc
Vdc
Adc
Adc
Adc

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2264

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BSP16T1
ELECTRICAL CHARACTERISTICS (continued) (TA = 25C unless otherwise noted)
Characteristics

Symbol

Min

Max

30

120

2.0

15

15

Unit

ON CHARACTERISTICS
DC Current Gain
(VCE = 10 Vdc, IC = 50 mAdc)

hFE

Collector-Emitter Saturation Voltage


(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Vdc

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(VCE = 10 Vdc, IC = 10 mAdc, f = 30 MHz)
CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

fT

MHz

Cobo

pF

2265

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN Silicon
Epitaxial Transistor

BSP19AT1
Motorola Preferred Device

This family of NPN Silicon Epitaxial transistors is designed for use as a general
purpose amplifier and in switching applications. The device is housed in the SOT-223
package which is designed for medium power surface mount applications.

SOT223 PACKAGE
NPN SILICON
HIGH VOLTAGE
TRANSISTOR
SURFACE MOUNT

High Voltage: V(BR)CEO of 250 and 350 Volts.


The SOT-223 package can be soldered using wave or reflow.
SOT-223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering, eliminating the possibility of
damage to the die
Available in 12 mm Tape and Reel
T1 Configuration 7 inch/1000 unit reel
T3 Configuration 13 inch/4000 unit reel
PNP Complement is BSP16T1

COLLECTOR 2,4

BASE
1

2
3

CASE 318E-04, STYLE 1


TO-261AA

EMITTER 3

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Symbol

Value

Unit

Collector-Emitter Voltage (Open Base)

VCEO

350

Vdc

Collector-Base Voltage (Open Emitter)

VCBO

400

Vdc

Emitter-Base Voltage (Open Collector)

VEBO

5.0

Vdc

Collector Current (DC)

IC

1000

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

0.8
6.4

Watts
mW/C

Storage Temperature Range

Tstg

65 to 150

TJ

150

Rating

Junction Temperature

DEVICE MARKING
SP19A

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance from Junction-to-Ambient

Characteristic

RJA

156

C/W

Maximum Temperature for Soldering Purposes


Time in Solder Bath

TL

260
10

C
Sec

1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2266

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BSP19AT1
ELECTRICAL CHARACTERISTICS (continued) (TA = 25C unless otherwise noted)
Characteristics

Symbol

Min

Max

350

20

10

40

70

0.5

1.3

Unit

OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

Collector-Base Cutoff Current


(VCB = 400 Vdc, IE = 0)

ICBO

Emitter-Base Cutoff Current


(VEB = 5.0 Vdc, IC = 0)

IEBO

Vdc
nAdc
Adc

ON CHARACTERISTICS (2)
DC Current Gain
(IC = 20 mAdc, VCE = 10 Vdc)
Current-Gain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 5.0 MHz)

hFE

fT

Collector-Emitter Saturation Voltage


(IC = 50 mAdc, IB = 4.0 mAdc)

VCE(sat)

Base-Emitter Saturation Voltage


(IC = 50 mAdc, IB = 4.0 mAdc)

VBE(sat)

MHz
Vdc
Vdc

2. Pulse Test: Pulse Width 300 s, Duty Cycle = 2.0%

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2267

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN Small-Signal
Darlington Transistor

BSP52T1
Motorola Preferred Device

This NPN small signal darlington transistor is designed for use in switching
applications, such as print hammer, relay, solenoid and lamp drivers. The device is
housed in the SOT-223 package, which is designed for medium power surface mount
applications.

MEDIUM POWER
NPN SILICON
DARLINGTON
TRANSISTOR
SURFACE MOUNT

The SOT-223 Package can be soldered using wave or reflow. The formed
leads absorb thermal stress during soldering, eliminating the possibility of
damage to the die
Available in 12 mm Tape and Reel
Use BSP52T1 to order the 7 inch/1000 unit reel
Use BSP52T3 to order the 13 inch/4000 unit reel
PNP Complement is BSP62T1

COLLECTOR 2,4
BASE
1

2
3

CASE 318E-04, STYLE 1


TO-261AA

EMITTER 3

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

Collector-Emitter Voltage

VCES

80

Vdc

Collector-Base Voltage

VCBO

90

Vdc

Emitter-Base Voltage

VEBO

5.0

Vdc

Collector Current

IC

500

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

0.8
6.4

Watts
mW/C

TJ, Tstg

65 to 150

Symbol

Max

Unit

RJA

156

C/W

TL

260
10

C
Sec

Operating and Storage Temperature Range

DEVICE MARKING
AS3

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance Junction-to-Ambient (surface mounted)
Maximum Temperature for Soldering Purposes
Time in Solder Bath

1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2268

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BSP52T1
ELECTRICAL CHARACTERISTICS (continued) (TA = 25C unless otherwise noted)
Characteristics

Symbol

Min

Max

90

5.0

10

10

1000
2000

1.3

1.9

Unit

OFF CHARACTERISTICS
Collector-Base Breakdown Voltage
(IC = 100 Adc, IE = 0)

V(BR)CBO

Emitter-Base Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

Collector-Emitter Cutoff Current


(VCE = 80 Vdc, VBE = 0)

ICES

Emitter-Base Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

Vdc
Vdc
Adc
Adc

ON CHARACTERISTICS (2)
DC Current Gain
(IC = 150 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 10 Vdc)

hFE

Collector-Emitter Saturation Voltage


(IC = 500 mAdc, IB = 0.5 mAdc)

VCE(sat)

Base-Emitter On Voltage
(IC = 500 mAdc, IB = 0.5 mAdc)

VBE(on)

Vdc
Vdc

2. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2269

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BSP62T1

PNP Small-Signal
Darlington Transistor

Motorola Preferred Device

This PNP small signal darlington transistor is designed for use in switching
applications, such as print hammer, relay, solenoid and lamp drivers. The device is
housed in the SOT-223 package which is designed for medium power surface mount
applications.
The SOT-223 Package can be soldered using wave or reflow. The formed
leads absorb thermal stress during soldering, eliminating the possibility of
damage to the die
Available in 12 mm Tape and Reel
Use BSP62T1 to order the 7 inch/1000 unit reel.
Use BSP62T3 to order the 13 inch/4000 unit reel.
NPN Complement is BSP52T1

MEDIUM POWER
PNP SILICON
DARLINGTON
TRANSISTOR
SURFACE MOUNT

COLLECTOR 2,4
1

BASE
1

2
3

CASE 318E-04, STYLE 1


TO-261AA

EMITTER 3

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

Collector-Emitter Voltage

VCES

80

Vdc

Collector-Base Voltage

VCBO

90

Vdc

Emitter-Base Voltage

VEBO

5.0

Vdc

Collector Current

IC

500

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

65 to 150

Symbol

Max

Unit

RJA

83.3

C/W

TL

260
10

C
Sec

Operating and Storage Temperature Range

DEVICE MARKING
BS3

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance Junction-to-Ambient (surface mounted)
Maximum Temperature for Soldering Purposes
Time in Solder Bath

1. Device mounted on a FR4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2270

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BSP62T1
ELECTRICAL CHARACTERISTICS (continued) (TA = 25C unless otherwise noted)
Characteristics

Symbol

Min

Max

90

5.0

10

10

1000
2000

1.3

1.9

Unit

OFF CHARACTERISTICS
Collector-Base Breakdown Voltage
(IC = 100 Adc, IE = 0)

V(BR)CBO

Emitter-Base Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

Collector-Emitter Cutoff Current


(VCE = 80 Vdc, VBE = 0)

ICBO

Emitter-Base Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

Vdc
Vdc
Adc
Adc

ON CHARACTERISTICS (2)
DC Current Gain
(IC = 150 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 10 Vdc)

hFE

Collector-Emitter Saturation Voltage


(IC = 500 mAdc, IB = 0.5 mAdc)

VCE(sat)

Base-Emitter On Voltage
(IC = 500 mAdc, IB = 0.5 mAdc)

VBE(on)

Vdc
Vdc

2. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2271

BSP62T1
hFE, DC CURRENT GAIN (X1.0 K)

200
100

TA = 125C

70
50
10 V

30

25C
VCE = 2.0 V

20

5.0 V
10
7.0
5.0

55C

3.0
2.0
0.3

0.5

0.7

1.0

2.0

3.0

5.0
7.0
10
20
IC, COLLECTOR CURRENT (mA)

30

50

70

100

200

300

Figure 1. DC Current Gain

4.0
3.0

2.0
VCE = 5.0 V
f = 100 MHz
TA = 25C

2.0
1.0

0.4

VBE(sat) @ IC/IB = 100

1.2
VBE(on) @ VCE = 5.0 V
0.8

VCE(sat) @ IC/IB = 1000


IC/IB = 100

0.4

0.2

2.0

5.0

10

20

50

100

200

500

0
0.3 0.5

1K

1.0

2.0 3.0 5.0

10

20 30

50

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 2. High Frequency Current Gain

Figure 3. On Voltage

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

0.1
1.0

TA = 25C

1.6
V, VOLTAGE (VOLTS)

|h FE |, HIGH FREQUENCY CURRENT GAIN

10

100

200 300

2.0
TA = 25C

1.8
1.6
IC = 10 mA

50 mA 100 mA

175 mA

300 mA

1.4
1.2
1.0
0.8
0.6
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1K 2K 5K 10K
IB, BASE CURRENT (A)

Figure 4. Collector Saturation Region

2272

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistor

BSS63LT1

COLLECTOR
3

PNP Silicon

1
BASE
2
EMITTER

MAXIMUM RATINGS

3
1

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

100

Vdc

Collector Emitter Voltage


RBE = 10 k

VCER

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

Vdc
110

Collector Current Continuous

IC

100

mAdc

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BSS63LT1 = T1

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

100

110

110

6.0

100

10

200

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 100 Adc)

V(BR)CEO

Collector Emitter Breakdown Voltage


(IC = 10 Adc, IE = 0, RBE = 10 k)

V(BR)CER

Collector Base Breakdown Voltage


(IE = 10 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 10 mAdc)

V(BR)EBO

Collector Cutoff Current


(VCB = 90 Vdc, IE = 0)

ICBO

Collector Cutoff Current


(VCE = 110 Vdc, RBE = 10 k)

ICER

Emitter Cutoff Current


(VEB = 6.0 Vdc, IC = 0)

IEBO

Vdc
Vdc
Vdc
Vdc
nAdc
Adc
nAdc

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2273

BSS63LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

30
30

250

900

50

95

20

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 25 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 25 mAdc, IB = 2.5 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 25 mAdc, IB = 2.5 mAdc)

VBE(sat)

mVdc
mVdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 25 mAdc, VCE = 5.0 Vdc, f = 20 MHz)

fT

Case Capacitance
(IE = IC = 0, VCB = 10 Vdc, f = 1.0 MHz)

CC

2274

MHz
pF

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Driver Transistor

BSS64LT1

COLLECTOR
3

NPN Silicon

1
BASE
2
EMITTER

3
1

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

80

Vdc

Collector Base Voltage

VCBO

120

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

100

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BSS64LT1 = AM

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

80

120

5.0

0.1
500

200

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 4.0 mAdc)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 100 mAdc)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 100 mAdc)

V(BR)EBO

Collector Cutoff Current


(VCE = 90 Vdc)
(TA = 150C)

ICBO

Emitter Cutoff Current


(VEB = 4.0 Vdc)

IEBO

Vdc
Vdc
Vdc
Adc

nAdc

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2275

BSS64LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

20

0.15
0.2

60

20

Unit

ON CHARACTERISTICS
DC Current Gain
(VCE = 1.0 Vdc, IC = 10 mAdc)

HFE

Collector Emitter Saturation Voltage


(IC = 4.0 mAdc, IB = 400 Adc)
(IC = 50 mAdc, IB = 15 mAdc)

VCE(sat)

Forward Base Emitter Voltage

VBE(sat)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 4.0 mAdc, VCE = 10 Vdc, f = 20 MHz)
Output Capacitance
(VCB = 10 Vdc, f = 1.0 MHz)

2276

fT

MHz

Cob

pF

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Transistor

BSV52LT1

COLLECTOR
3

NPN Silicon

1
BASE
2
EMITTER

3
1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

12

Vdc

Collector Base Voltage

VCBO

20

Vdc

IC

100

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BSV52LT1 = B2

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

12

100
5.0

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mAdc)

V(BR)CEO

Collector Cutoff Current


(VCB = 10 Vdc, IE = 0)
(VCB = 10 Vdc, IE = 0, TA = 125C)

ICBO

 0.062 in.
  0.024 in. 99.5% alumina.

Vdc

nAdc
Adc

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2277

BSV52LT1
ELECTRICAL CHARACTERISTICS (continued) (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Max

25
40
25

120

300
250
400

700

850
1200

400

4.0

4.5

13

12

18

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)

HFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 300 Adc)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

mVdc

mVdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)

fT

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

Input Capacitance
(VEB = 1.0 Vdc, IC = 0, f = 1.0 MHz)

Cibo

MHz
pF
pF

SWITCHING CHARACTERISTICS
Storage Time
(IC = IB1 = IB2 = 10 mAdc)

ts

TurnOn Time
(VBE = 1.5 Vdc, IC = 10 mAdc, IB = 3.0 mAdc)

ton

TurnOff Time
(IC = 10 mAdc, IB = 3.0 mAdc)

toff

2278

ns
ns
ns

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

DTA114YE

Preliminary Data Sheet

Bias Resistor Transistor

PNP Silicon Surface Mount Transistor with


Monolithic Bias Resistor Network

3
2

The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic
bias network consisting of two resistors; a series base resistor and a baseemitter
resistor. These digital transistors are designed to replace a single device and its
external resistor bias network. The BRT eliminates these individual components by
i n t e g r a t i n g t h e m i n t o a s i n g l e d e v i c e . T h e D TA 11 4 Y E i s h o u s e d i n t h e
SOT416/SC90 package which is ideal for lowpower surface mount applications
where board space is at a premium.

CASE 46301, STYLE 1


SOT416/SC90

Simplifies Circuit Design


Reduces Board Space

OUT (3)

R1

IN (1)

Reduces Component Count

R2

Available in 8 mm, 7 inch/3000 Unit Tape and Reel.

GND (2)

R1 = 10 k
R2 = 47 k

MAXIMUM RATINGS (TA = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

Output Voltage

VO

50

Vdc

Input Voltage

VI

40

Vdc

Output Current

IO

100

mAdc

PD

*125

mW

TJ, Tstg

55 to +150

TJ

150

DEVICE MARKING
DTA114YE = 59

THERMAL CHARACTERISTICS
Power Dissipation @ TA = 25C(1)
Operating and Storage Temperature Range
Junction Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C)


Symbol

Min

Typ

Max

Unit

Input Off Voltage (VO = 5.0 Vdc, IO = 100 Adc)

VI(off)

0.3

Vdc

Input On Voltage (VO = 0.3 Vdc, IO = 1.0 mAdc)

VI(on)

1.4

Vdc

Output On Voltage (IO = 5.0 mAdc, II = 0.25 mAdc)

VO(on)

0.3

Vdc

II

0.88

mAdc

IO(off)

500

nAdc

Characteristic

Input Current (VI = 5.0 Vdc)


Output Cutoff Current (VO = 50 Vdc)
DC Current Gain (VO = 5.0 Vdc, IO = 5.0 mAdc)

GI

68

Input Resistance

R1

7.0

10

13

kOhms

Resistance Ratio

R1/R2

0.17

0.21

0.25

1. Device mounted on a FR4 glass epoxy printed circuit board using the minimum recommended footprint.

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2279

DTA114YE
TYPICAL ELECTRICAL CHARACTERISTICS

1
VO(on), OUTPUT VOLTAGE (V)

IO/II = 10

G I , DC CURRENT GAIN (NORMALIZED)

180
TA = 25C
25C

0.1

75C

0.01

0.001

20

40
60
IO, OUTPUT CURRENT (mA)

25C
140
25C

120
100
80
60
40
20
0

80

Figure 1. VO(on) versus IO

8 10 15 20 40 50 60 70
IO, OUTPUT CURRENT (mA)

80 90 100

Figure 2. GI, DC Current Gain

10

100
TA = 75C

VO = 0.2 V

25C
V I , INPUT VOLTAGE (VOLTS)

IO, OUTPUT CURRENT (mA)

TA = 75C

VO(on) = 10 V

160

25C
10

25C
TA = 25C
75C

VO = 5 V
1

4
6
VI, INPUT VOLTAGE (V)

0.1

10

Figure 3. Output Current versus Input Voltage

10

20
30
IO, OUTPUT CURRENT (mA)

50

Figure 4. Input Voltage versus Output Current

+12 V

4.5
f = 1 MHz
lE = 0 V
TA = 25C

4
Cob , CAPACITANCE (pF)

40

3.5

Typical Application
for PNP BRTs

3
2.5
2
1.5
1

LOAD

0.5
0

6 8 10 15 20 25 30 35 40
VR, REVERSE BIAS VOLTAGE (VOLTS)

Figure 5. Output Capacitance

2280

45

50

Figure 6. Inexpensive, Unregulated Current Source

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

DTA143EE

Preliminary Data Sheet

Bias Resistor Transistor

PNP Silicon Surface Mount Transistor with


Monolithic Bias Resistor Network

3
2

The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic
bias network consisting of two resistors; a series base resistor and a baseemitter
resistor. These digital transistors are designed to replace a single device and its
external resistor bias network. The BRT eliminates these individual components by
i n t e g r a t i n g t h e m i n t o a s i n g l e d e v i c e . T h e D TA 1 4 3 E E i s h o u s e d i n t h e
SOT416/SC90 package which is ideal for lowpower surface mount applications
where board space is at a premium.

CASE 46301, STYLE 1


SOT416/SC90

Simplifies Circuit Design


Reduces Board Space

OUT (3)

R1

IN (1)

Reduces Component Count

R2

Available in 8 mm, 7 inch/3000 Unit Tape and Reel.

GND (2)

R1 = 4.7 k
R2 = 4.7 k

MAXIMUM RATINGS (TA = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

Output Voltage

VO

50

Vdc

Input Voltage

VI

30

Vdc

Output Current

IO

100

mAdc

PD

*125

mW

TJ, Tstg

55 to +150

TJ

150

DEVICE MARKING
DTA143EE = 43

THERMAL CHARACTERISTICS
Power Dissipation @ TA = 25C(1)
Operating and Storage Temperature Range
Junction Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C)


Symbol

Min

Typ

Max

Unit

Input Off Voltage (VO = 5.0 Vdc, IO = 100 Adc)

VI(off)

0.5

Vdc

Input On Voltage (VO = 0.3 Vdc, IO = 20 mAdc)

VI(on)

3.0

Vdc

Output On Voltage (IO = 10 mAdc, II = 0.5 mAdc)

VO(on)

0.3

Vdc

II

1.8

mAdc

IO(off)

500

nAdc

Characteristic

Input Current (VI = 5.0 Vdc)


Output Cutoff Current (VO = 50 Vdc)
DC Current Gain (VO = 5.0 Vdc, IO = 10 mAdc)

GI

20

Input Resistance

R1

3.3

4.7

6.1

kOhms

Resistance Ratio

R1/R2

0.8

1.0

1.2

1. Device mounted on a FR4 glass epoxy printed circuit board using the minimum recommended footprint.
* Typical electrical characteristic curves are not available at this time.

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2281

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Preliminary Data Sheet

DTC114TE

Bias Resistor Transistor

NPN Silicon Surface Mount Transistor with


Monolithic Bias Resistor Network

The BRT (Bias Resistor Transistor) contains a single transistor with a


monolithic bias network consisting of two resistors; a series base resistor and a
baseemitter resistor. These digital transistors are designed to replace a single
device and its external resistor bias network. The BRT eliminates these
individual components by integrating them into a single device. The DTC114TE
is housed in the SOT416/SC90 package which is ideal for low power surface
mount applications where board space is at a premium.

2
1

CASE 46301, STYLE 1


SOT416/SC90

Simplifies Circuit Design


Reduces Board Space
Reduces Component Count
Available in 8 mm, 7 inch/3000 Unit Tape and Reel.

OUT (3)

R1

IN (1)

GND (2)

R1 = 10 k

MAXIMUM RATINGS (TA = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

CollectorBase Voltage

VCBO

50

Vdc

CollectorEmitter Voltage

VCEO

50

Vdc

IC

100

mAdc

PD

*125

mW

TJ, Tstg

55 to +150

TJ

150

Collector Current

DEVICE MARKING
DTC114TE = 94

THERMAL CHARACTERISTICS
Power Dissipation @ TA = 25C(1)
Operating and Storage Temperature Range
Junction Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic

Symbol

Min

Typ

Max

Unit

CollectorBase Breakdown Voltage (IC = 50 Adc)

V(BR)CBO

50

Vdc

CollectorEmitter Breakdown Voltage (IC = 1.0 mAdc)

V(BR)CEO

50

Vdc

EmitterBase Breakdown Voltage (IE = 50 Adc)

V(BR)EBO

5.0

Vdc

CollectorBase Cutoff Current (VCB = 50 Vdc)

ICBO

500

nAdc

EmitterBase Cutoff Current (VEB = 4.0 Vdc)

IEBO

500

nAdc

DC Current Gain (IC = 1.0 mAdc, VCE = 5 Vdc)

hFE

100

300

600

VCE(sat)

0.3

Vdc

R1

7.0

10

13

kOhms

CollectorEmitter Saturation Voltage (IC = 10 mAdc, IB = 1.0 mAdc)


Input Resistance

1. Device mounted on a FR4 glass epoxy printed circuit board using the minimum recommended footprint.
* Typical electrical characteristic curves are not available at this time.
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.

2282

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Preliminary Data Sheet

DTC114YE

Bias Resistor Transistor

NPN Silicon Surface Mount Transistor with


Monolithic Bias Resistor Network

The BRT (Bias Resistor Transistor) contains a single transistor with a


monolithic bias network consisting of two resistors; a series base resistor and a
baseemitter resistor. These digital transistors are designed to replace a single
device and its external resistor bias network. The BRT eliminates these
individual components by integrating them into a single device. The DTC114YE
is housed in the SOT416/SC90 package which is ideal for low power surface
mount applications where board space is at a premium.

2
1

CASE 46301, STYLE 1


SOT416/SC90

Simplifies Circuit Design


Reduces Board Space
Reduces Component Count

IN (1)

Available in 8 mm, 7 inch/3000 Unit Tape and Reel.

OUT (3)

R1
R2

GND (2)

R1 = 10 k
R2 = 47 k

MAXIMUM RATINGS (TA = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

Output Voltage

VO

50

Vdc

Input Voltage

VI

40

Vdc

Output Current

IO

100

mAdc

PD

*125

mW

TJ, Tstg

55 to +150

TJ

150

DEVICE MARKING
DTC114YE = 69

THERMAL CHARACTERISTICS
Power Dissipation @ TA = 25C(1)
Operating and Storage Temperature Range
Junction Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic

Symbol

Min

Typ

Max

Unit

Input Off Voltage (VO = 5.0 Vdc, IO = 100 Adc)

VI(off)

0.3

Vdc

Input On Voltage (VO = 0.3 Vdc, IO = 1.0 mAdc)

VI(on)

1.4

Vdc

Output On Voltage (IO = 5.0 mAdc, II = 0.25 mAdc)

VO(on)

0.3

Vdc

Input Current (VI = 5.0 Vdc)

II

0.88

mAdc

IO(off)

500

nAdc

DC Current Gain (VO = 5.0 Vdc, IO = 5.0 mAdc)

GI

68

Input Resistance

R1

7.0

10

13

kOhms

Resistance Ratio

R1/R2

0.17

0.21

0.25

Output Cutoff Current (VO = 50 Vdc)

1. Device mounted on a FR4 glass epoxy printed circuit board using the minimum recommended footprint.

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2283

DTC114YE
TYPICAL ELECTRICAL CHARACTERISTICS
300
IO/II = 10

G I , DC CURRENT GAIN (NORMALIZED)

VO(on), OUTPUT VOLTAGE (V)

1
TA = 25C
25C
0.1
75C

0.01

0.001

20

40
60
IO, OUTPUT CURRENT (mA)

25C
200
25C
150
100
50
0

80

Figure 1. VO(on) versus IO

8 10 15 20 40 50 60 70 80
IO, OUTPUT CURRENT (mA)

90 100

10
TA = 75C

VO = 0.2 V

25C
V I , INPUT VOLTAGE (VOLTS)

IO, OUTPUT CURRENT (mA)

Figure 2. GI, DC Current Gain

100

25C
10

VO = 5 V
1

TA = 75C

VO(on) = 10

250

4
6
VI, INPUT VOLTAGE (V)

10

Figure 3. Output Current versus Input Voltage

TA = 25C

25C
75C

0.1

10

20
30
IO, OUTPUT CURRENT (mA)

40

50

Figure 4. Input Voltage versus Output Current

4
f = 1 MHz
lE = 0 V
TA = 25C

Cob , CAPACITANCE (pF)

3.5
3
2.5
2
1.5
1
0.5
0

6 8 10 15 20 25 30 35
VR, REVERSE BIAS VOLTAGE (VOLTS)

40

45

50

Figure 5. Output Capacitance

2284

Motorola SmallSignal Transistors, FETs and Diodes Device Data

DTC114YE
TYPICAL APPLICATIONS FOR NPN BRTs
+12 V

ISOLATED
LOAD

FROM P OR
OTHER LOGIC

Figure 6. Level Shifter: Connects 12 or 24 Volt Circuits to Logic

+12 V

VCC

OUT
IN
LOAD

Figure 7. Open Collector Inverter: Inverts the Input Signal

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 8. Inexpensive, Unregulated Current Source

2285

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual General Purpose Transistors


The MBT3904DW1T1, MBT3906DW1T1, and MBT3946DW1T1 devices are
spinoffs of our popular SOT23/SOT323 threeleaded devices. They are designed
for general purpose amplifier applications and are housed in the SOT363 sixleaded
surface mount package. By putting two discrete devices in one package, these
devices are ideal for lowpower surface mount applications where board space is at
a premium.

MBT3904DW1T1
MBT3906DW1T1
MBT3946DW1T1
MBT3904DW1T1
MBT3906DW1T1
MBT3946DW1T1

hFE, 100300
Low VCE(sat), 0.4 V

6 5

Simplifies Circuit Design


Reduces Board Space

Reduces Component Count


Available in 8 mm, 7inch/3,000 Unit Tape and Reel

CASE 419B01, STYLE 1

MBT3904DW1T1
(3)

(2)

(1)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

VCEO

40
40

Vdc

Collector Base Voltage

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

VCBO

60
40

Vdc

Emitter Base Voltage

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

VEBO

6.0
5.0

Vdc

Collector Current Continuous


MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

IC

Q1

(4)

Q2

(5)

(6)

MBT3906DW1T1
(3)

(2)

(1)

mAdc
200
200

Q1

Q2

THERMAL CHARACTERISTICS
Characteristic
Total Package Dissipation(1)
TA = 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

Symbol

Max

Unit

PD

150

mW

RqJA

833

C/W

TJ, Tstg

55 to
+150

(5)

(6)

MBT3946DW1T1*

1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
1. recommended footprint.

DEVICE MARKING

(4)

(3)

(2)

Q1

(4)

(1)

Q2

(5)

(6)

MBT3904DW1T1 = MA MBT3946DW1T1 = 46
MBT3906DW1T1 = A2
*Q1 same as MBT3906DW1T1
Q2 same as MBT3904DW1T1

2286

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MBT3904DW1T1 MBT3906DW1T1 MBT3946DW1T1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Symbol

Min

Max

40
40

60
40

6.0
5.0

50
50

50
50

MBT3904DW1T1 (NPN)

40
70
100
60
30

300

MBT3906DW1T1 (PNP)

60
80
100
60
30

300

MBT3904DW1T1 (NPN)

0.2
0.3

MBT3906DW1T1 (PNP)

0.25
0.4

MBT3904DW1T1 (NPN)

0.65

0.85
0.95

MBT3906DW1T1 (PNP)

0.65

0.85
0.95

300
250

4.0
4.5

8.0
10.0

Characteristic

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(2)
(IC = 1.0 mAdc, IB = 0)
(IC = 1.0 mAdc, IB = 0)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)
(IC = 10 mAdc, IE = 0)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)
(IE = 10 mAdc, IC = 0)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

Base Cutoff Current


(VCE = 30 Vdc, VEB = 3.0 Vdc)
(VCE = 30 Vdc, VEB = 3.0 Vdc)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

Collector Cutoff Current


(VCE = 30 Vdc, VEB = 3.0 Vdc)
(VCE = 30 Vdc, VEB = 3.0 Vdc)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

V(BR)CEO

Vdc

V(BR)CBO

Vdc

V(BR)EBO

Vdc

IBL

nAdc

ICEX

nAdc

ON CHARACTERISTICS (2)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
Collector Emitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)
Base Emitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

hFE

VCE(sat)

Vdc

VBE(sat)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

fT

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

MHz

Cobo

pF

Cibo

pF

2. Pulse Test: Pulse Width 300 s; Duty Cycle 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2287

MBT3904DW1T1 MBT3906DW1T1 MBT3946DW1T1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Characteristic
Input Impedance
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

Voltage Feedback Ratio


(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

Small Signal Current Gain


(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

Output Admittance
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

Min

Max

1.0
2.0

10
12

0.5
0.1

8.0
10

100
100

400
400

1.0
3.0

40
60

5.0
4.0

hie

X 10 4

hre

hfe

mmhos

hoe

Noise Figure
(VCE = 5.0 Vdc, IC = 100 mAdc, RS = 1.0 k , f = 1.0 kHz)
MBT3904DW1T1 (NPN)
(VCE = 5.0 Vdc, IC = 100 mAdc, RS = 1.0 k , f = 1.0 kHz) MBT3906DW1T1 (PNP)

Unit

NF

dB

SWITCHING CHARACTERISTICS
Delay Time

(VCC = 3.0 Vdc, VBE = 0.5 Vdc)


(VCC = 3.0 Vdc, VBE = 0.5 Vdc)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

td

35
35

Rise Time

(IC = 10 mAdc, IB1 = 1.0 mAdc)


(IC = 10 mAdc, IB1 = 1.0 mAdc)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

tr

35
35

Storage Time

(VCC = 3.0 Vdc, IC = 10 mAdc)


(VCC = 3.0 Vdc, IC = 10 mAdc)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

ts

200
225

Fall Time

(IB1 = IB2 = 1.0 mAdc)


(IB1 = IB2 = 1.0 mAdc)

MBT3904DW1T1 (NPN)
MBT3906DW1T1 (PNP)

tf

50
75

2288

ns

ns

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MBT3904DW1T1 MBT3906DW1T1 MBT3946DW1T1


MBT3904DW1T1 (NPN)

DUTY CYCLE = 2%
300 ns

+3 V
+10.9 V

10 < t1 < 500 ms


275

+3 V

t1

+10.9 V

DUTY CYCLE = 2%

275

10 k

10 k
0

0.5 V

Cs < 4 pF*

< 1 ns

Cs < 4 pF*

1N916
9.1 V

< 1 ns

* Total shunt capacitance of test jig and connectors

Figure 1. Delay and Rise Time


Equivalent Test Circuit

Figure 2. Storage and Fall Time


Equivalent Test Circuit

TYPICAL TRANSIENT CHARACTERISTICS


TJ = 25C
TJ = 125C
10

5000
MBT3904DW1T1 (NPN)

5.0
Cibo
3.0
Cobo

2.0

MBT3904DW1T1 (NPN)

VCC = 40 V
IC/IB = 10

2000
Q, CHARGE (pC)

CAPACITANCE (pF)

7.0

3000

1000
700
500
QT

300
200

QA

1.0
0.1

0.2 0.3

0.5 0.7 1.0

2.0 3.0

5.0 7.0 10

20 30 40

100
70
50

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

REVERSE BIAS VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 3. Capacitance

Figure 4. Charge Data

Motorola SmallSignal Transistors, FETs and Diodes Device Data

200

2289

MBT3904DW1T1 MBT3906DW1T1 MBT3946DW1T1


MBT3904DW1T1 (NPN)
500

500
IC/IB = 10

100
70

tr @ VCC = 3.0 V

50
30
20

VCC = 40 V
IC/IB = 10

300
200
t r, RISE TIME (ns)

TIME (ns)

300
200

40 V

100
70
50
30
20

15 V
10
7
5

10

MBT3904DW1T1 (NPN)

2.0 V

td @ VOB = 0 V
1.0

2.0 3.0

5.0 7.0 10

20

50 70 100

30

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

Figure 5. Turn On Time

Figure 6. Rise Time

IC/IB = 10

200

500

ts = ts 1/8 tf
IB1 = IB2

VCC = 40 V
IB1 = IB2

300
200
IC/IB = 20
t f , FALL TIME (ns)

t s , STORAGE TIME (ns)

IC/IB = 20

200

MBT3904DW1T1 (NPN)

IC, COLLECTOR CURRENT (mA)

500
300
200

7
5

100
70
IC/IB = 20

50

IC/IB = 10

30
20
10
7
5

2.0 3.0

IC/IB = 10

30
20
10

MBT3904DW1T1 (NPN)
1.0

100
70
50

5.0 7.0 10

20

50 70 100

30

7
5

200

MBT3904DW1T1 (NPN)
1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 7. Storage Time

Figure 8. Fall Time

200

TYPICAL AUDIO SMALL SIGNAL CHARACTERISTICS


NOISE FIGURE VARIATIONS
(VCE = 5.0 Vdc, TA = 25C, Bandwidth = 1.0 Hz)

SOURCE RESISTANCE = 200


IC = 1.0 mA

NF, NOISE FIGURE (dB)

10

14

f = 1.0 kHz

SOURCE RESISTANCE = 200


IC = 0.5 mA

8
6

SOURCE RESISTANCE = 1.0 k


IC = 50 A

4
2
0
0.1

2290

SOURCE RESISTANCE = 500


IC = 100 A

0.2

0.4

1.0

2.0

MBT3904DW1T1 (NPN)
4.0

IC = 1.0 mA

12
NF, NOISE FIGURE (dB)

12

10

20

40

100

IC = 0.5 mA

10

IC = 50 mA

8
IC = 100 mA

6
4
2
0

MBT3904DW1T1 (NPN)
0.1

0.2

0.4

1.0

2.0

4.0

10

20

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (k OHMS)

Figure 9. Noise Figure

Figure 10. Noise Figure

40

100

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MBT3904DW1T1 MBT3906DW1T1 MBT3946DW1T1


MBT3904DW1T1 (NPN)
h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25C)
100
hoe, OUTPUT ADMITTANCE (m mhos)

300

h fe , CURRENT GAIN

MBT3904DW1T1 (NPN)
200

100
70
50

30

0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

20
10
5

2
1

10

MBT3904DW1T1 (NPN)

50

0.1

0.2

MBT3904DW1T1 (NPN)

5.0

2.0
1.0
0.5

0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

10

hre , VOLTAGE FEEDBACK RATIO (x 10 4)

h ie , INPUT IMPEDANCE (k OHMS)

20

0.2

5.0

10

Figure 12. Output Admittance

Figure 11. Current Gain

10

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

Figure 13. Input Impedance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10
7.0

MBT3904DW1T1 (NPN)

5.0
3.0
2.0

1.0
0.7
0.5

0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

10

Figure 14. Voltage Feedback Ratio

2291

MBT3904DW1T1 MBT3906DW1T1 MBT3946DW1T1


MBT3904DW1T1 (NPN)

h FE, DC CURRENT GAIN (NORMALIZED)

TYPICAL STATIC CHARACTERISTICS


2.0
TJ = +125C

VCE = 1.0 V

MBT3904DW1T1 (NPN)

+25C

1.0
0.7

55C

0.5
0.3
0.2

0.1
0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

20

30

50

70

100

200

IC, COLLECTOR CURRENT (mA)

VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

Figure 15. DC Current Gain


1.0
TJ = 25C

MBT3904DW1T1 (NPN)
0.8

IC = 1.0 mA

10 mA

30 mA

100 mA

0.6

0.4

0.2

0
0.01

0.02

0.03

0.05

0.07

0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

IB, BASE CURRENT (mA)

Figure 16. Collector Saturation Region

1.0

1.2
TJ = 25C

MBT3904DW1T1 (NPN)

0.8
VBE @ VCE =1.0 V
0.6
0.4
VCE(sat) @ IC/IB =10

qVC FOR VCE(sat)


0

55C TO +25C

0.5
55C TO +25C
1.0
+25C TO +125C

qVB FOR VBE(sat)

1.5

0.2
0

+25C TO +125C

0.5
COEFFICIENT (mV/ C)

1.0
V, VOLTAGE (VOLTS)

MBT3904DW1T1 (NPN)

VBE(sat) @ IC/IB =10

1.0

2292

2.0

5.0

10

20

50

100

200

2.0

20

40

60

80

100

120

140

160

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 17. ON Voltages

Figure 18. Temperature Coefficients

180 200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MBT3904DW1T1 MBT3906DW1T1 MBT3946DW1T1


MBT3906DW1T1 (PNP)

3V

3V
< 1 ns

+9.1 V
275

275

< 1 ns
10 k

+0.5 V

10 k
0
Cs < 4 pF*

10.6 V

10 < t1 < 500 ms

300 ns
DUTY CYCLE = 2%

Cs < 4 pF*

1N916

DUTY CYCLE = 2%

t1

10.9 V

* Total shunt capacitance of test jig and connectors

Figure 19. Delay and Rise Time


Equivalent Test Circuit

Figure 20. Storage and Fall Time


Equivalent Test Circuit

TYPICAL TRANSIENT CHARACTERISTICS


TJ = 25C
TJ = 125C
5000

10
MBT3906DW1T1 (PNP)
Cobo

5.0

Q, CHARGE (pC)

CAPACITANCE (pF)

7.0

VCC = 40 V
IC/IB = 10

3000
2000

Cibo
3.0
2.0

MBT3906DW1T1 (PNP)

1000
700
500
300
200

QT
QA

1.0
0.1

0.2 0.3

0.5 0.7 1.0


2.0 3.0 5.0 7.0 10
REVERSE BIAS (VOLTS)

100
70
50

20 30 40

1.0

2.0 3.0

Figure 21. Capacitance

5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)

200

Figure 22. Charge Data

500

500
IC/IB = 10

MBT3906DW1T1 (PNP)

300
200

MBT3906DW1T1 (PNP)

300
200

VCC = 40 V
IB1 = IB2

100
70
50

tr @ VCC = 3.0 V
15 V

30
20

t f , FALL TIME (ns)

TIME (ns)

IC/IB = 20
100
70
50
30
20

IC/IB = 10

40 V
10
7
5

2.0 V
td @ VOB = 0 V
1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

200

10
7
5

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 23. Turn On Time

Figure 24. Fall Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

200

2293

MBT3904DW1T1 MBT3906DW1T1 MBT3946DW1T1


MBT3906DW1T1 (PNP)
TYPICAL AUDIO SMALL SIGNAL CHARACTERISTICS
NOISE FIGURE VARIATIONS
(VCE = 5.0 Vdc, TA = 25C, Bandwidth = 1.0 Hz)

NF, NOISE FIGURE (dB)

SOURCE RESISTANCE = 200


IC = 1.0 mA

12

f = 1.0 kHz

4.0
SOURCE RESISTANCE = 200
IC = 0.5 mA
3.0

SOURCE RESISTANCE = 2.0 k


IC = 50 A

2.0
SOURCE RESISTANCE = 2.0 k
IC = 100 A

1.0

0
0.1

0.2

0.4

IC = 1.0 mA

10
NF, NOISE FIGURE (dB)

5.0

IC = 0.5 mA
8
6
IC = 50 mA

IC = 100 mA

2
MBT3906DW1T1 (PNP)

1.0 2.0 4.0


10
f, FREQUENCY (kHz)

20

40

MBT3906DW1T1 (PNP)
0

100

0.1

0.2

40

0.4
1.0 2.0
4.0
10
20
Rg, SOURCE RESISTANCE (k OHMS)

Figure 25.

100

Figure 26.

h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25C)
100

h fe , DC CURRENT GAIN

MBT3906DW1T1 (PNP)

hoe, OUTPUT ADMITTANCE ( mhos)

300

200

100
70
50

MBT3906DW1T1 (PNP)

70
50
30
20

10
7

30

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

0.1

0.2

h ie , INPUT IMPEDANCE (k OHMS)

20
MBT3906DW1T1 (PNP)

10
7.0
5.0
3.0
2.0
1.0
0.7
0.5
0.3
0.2

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

Figure 29. Input Impedance


2294

5.0 7.0 10

Figure 28. Output Admittance

5.0 7.0 10

hre , VOLTAGE FEEDBACK RATIO (x 10 4)

Figure 27. Current Gain

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

10
7.0

MBT3906DW1T1 (PNP)

5.0
3.0
2.0

1.0
0.7
0.5

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

Figure 30. Voltage Feedback Ratio


Motorola SmallSignal Transistors, FETs and Diodes Device Data

MBT3904DW1T1 MBT3906DW1T1 MBT3946DW1T1


MBT3906DW1T1 (PNP)

h FE, DC CURRENT GAIN (NORMALIZED)

TYPICAL STATIC CHARACTERISTICS


2.0
TJ = +125C

VCE = 1.0 V

+25C

1.0
0.7

55C

0.5
0.3
MBT3906DW1T1 (PNP)
0.2

0.1
0.1

0.2

0.3

0.5

0.7

1.0

2.0
3.0
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

20

30

70

50

100

200

VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

Figure 31. DC Current Gain


1.0
TJ = 25C

MBT3906DW1T1 (PNP)
0.8

IC = 1.0 mA

10 mA

30 mA

100 mA

0.6

0.4

0.2

0
0.01

0.02

0.03

0.05

0.07

0.1

0.2
0.3
0.5
IB, BASE CURRENT (mA)

0.7

1.0

2.0

3.0

5.0

7.0

10

Figure 32. Collector Saturation Region

TJ = 25C

VBE(sat) @ IC/IB = 10

0.8
V, VOLTAGE (VOLTS)

q V , TEMPERATURE COEFFICIENTS (mV/ C)

1.0

VBE @ VCE = 1.0 V

0.6
MBT3906DW1T1 (PNP)
0.4
VCE(sat) @ IC/IB = 10

0.2

1.0

2.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

100

200

Figure 33. ON Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0
0.5

qVC FOR VCE(sat)

+25C TO +125C

55C TO +25C
MBT3906DW1T1 (PNP)

0.5

+25C TO +125C
1.0
55C TO +25C

qVB FOR VBE(sat)

1.5
2.0

20

40

60
80 100 120 140
IC, COLLECTOR CURRENT (mA)

160

180 200

Figure 34. Temperature Coefficients

2295

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Chopper Transistor

MMBT404ALT1

PNP Silicon

COLLECTOR
3

Motorola Preferred Device

1
BASE
3

2
EMITTER

1
2

MAXIMUM RATINGS
Rating

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

35

Vdc

CollectorBase Voltage

VCBO

40

Vdc

EmitterBase Voltage

VEBO

25

Vdc

IC

150

mAdc

Collector Current Continuous

DEVICE MARKING
MMBT404ALT1 = 2N

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

PD

225

mW

1.8

mW/C

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation FR-5 Board,*


TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate,** TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature
* FR5 = 1.0 x 0.75 x 0.062 in.
** Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

CollectorEmitter Breakdown Voltage


(IC = 10 mAdc, IB = 0)

V(BR)CEO

35

Vdc

CollectorEmitter Breakdown Voltage


(IC = 10 Adc, IE = 0)

V(BR)CBO

40

Vdc

EmitterBase Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

25

Vdc

Collector Cutoff Current


(VCB = 10 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

100

nAdc

Characteristic

OFF CHARACTERISTICS

Preferred devices are Motorola recommended choices for future use and best overall value.

2296

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT404ALT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

DC Current Gain
(IC = 12 mAdc, VCE = 0.15 Vdc)

hFE

100

400

CollectorEmitter Saturation Voltage


(IC = 12 mAdc, IB = 0.4 mAdc)
(IC = 24 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.15
0.2

BaseEmitter Saturation Voltage


(IC = 12 mAdc, IB = 0.4 mAdc)
(IC = 24 mAdc, IB = 1.0 mAdc)

VBE(sat)

0.85
1.0

Cobo

20

pF

Delay time
(VCC = 10 Vdc, IC = 10 mAdc) (Figure 1)

td

43

ns

Rise Time
(IB1 = 1.0 mAdc, VBE(off) = 14 Vdc)

tr

180

ns

Storage Time
(VCC = 10 Vdc, IC = 10 mAdc)

ts

675

ns

Fall Time
(IB1 = IB2 = 1.0 mAdc) (Figure 1)

tf

160

ns

ON CHARACTERISTICS

Vdc

Vdc

SMALLSIGNAL CHARACTERISTICS
Output Capacitance
(VCB = 6.0 Vdc, IE = 0, f = 1.0 MHz)

SWITCHING CHARACTERISTICS

VCC = 10 V

VBB
RBB
1.0 k
0.1 F
Vin

1.0 k
TO SCOPE

RB
10 k

51

Vin
(Volts)
ton, td, tr
toff, ts and tf

VBB
(Volts)

12

+1.4

+20.6

11.6

Voltages and resistor values shown are


for IC = 10 mA, IC/IB = 10 and IB1 = IB2

Figure 1. Switching Time Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2297

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

VHF/UHF Transistor

MMBT918LT1

NPN Silicon

COLLECTOR
3
1
BASE
3

2
EMITTER

MAXIMUM RATINGS

1
2

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

15

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

3.0

Vdc

IC

50

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board,(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT918LT1 = M3B

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 3.0 mAdc, IB = 0)

V(BR)CEO

15

Vdc

Collector Base Breakdown Voltage


(IC = 1.0 mAdc, IE = 0)

V(BR)CBO

30

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

3.0

Vdc

ICBO

50

nAdc

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 15 Vdc, IE = 0)
1. FR5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.

2298

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT918LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

hFE

20

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.4

Vdc

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

1.0

Vdc

fT

600

MHz

3.0
1.7

ON CHARACTERISTICS
DC Current Gain
(IC = 3.0 mAdc, VCE = 1.0 Vdc)

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 4.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 0 Vdc, IE = 0, f = 1.0 MHz)
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

2.0

pF

NF

6.0

dB

Power Output
(IC = 8.0 mAdc, VCB = 15 Vdc, f = 500 MHz)

Pout

30

mW

CommonEmitter Amplifier Power Gain


(IC = 6.0 mAdc, VCB = 12 Vdc, f = 200 MHz)

Gpe

11

dB

Noise Figure
(IC = 1.0 mAdc, VCE = 6.0 Vdc, RS = 50 , f = 60 MHz) (Figure 1)

pF

VCC

VBB
EXTERNAL

1000 pF BYPASS

100 k

0.018 F
C

0.018 F
3

50
G

RF
VM

0.018 F

0.018 F
NF TEST CONDITIONS
IC = 1.0 mA
VCE = 6.0 VOLTS
RS = 50
f = 60 MHz
Gpe TEST CONDITIONS
IC = 6.0 mA
VCE = 12 VOLTS
f = 200 MHz

Figure 1. NF, Gpe Measurement Circuit 20200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2299

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBT1010LT1
MSD1010T1

Low Saturation Voltage


PNP Silicon Driver Transistors

Motorola Preferred Devices

Part of the GreenLine Portfolio of devices with energyconserving traits.


PNP GENERAL
PURPOSE DRIVER
TRANSISTORS
SURFACE MOUNT

This PNP Silicon Epitaxial Planar Transistor is designed to conserve energy


in general purpose driver applications. This device is housed in the SOT-23 and
SC59 packages which are designed for low power surface mount
applications.
Low VCE(sat), < 0.1 V at 50 mA
Applications

LCD Backlight Driver


Annunciator Driver

General Output Device Driver

MAXIMUM RATINGS (TA = 25C)


Symbol

Value

Unit

Collector-Base Voltage

V(BR)CBO

45

Vdc

Collector-Emitter Voltage

V(BR)CEO

15

Vdc

Emitter-Base Voltage

V(BR)EBO

5.0

Vdc

IC

100

mAdc

Rating

Collector Current Continuous

CASE 31808, STYLE 6


SOT-23

3
2
1

DEVICE MARKING
MMBT1010LT1 = GLP
MSD1010T1 = GLP

CASE 318D04, STYLE 1


SC-59

THERMAL CHARACTERISTICS
Rating

Symbol

Max

Unit

Power Dissipation
TA = 25C
Derate above 25C

PD(1)

250

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RJA

556

C/W

TJ

150

Tstg

55 ~ + 150

Junction Temperature
Storage Temperature Range

COLLECTOR

BASE

EMITTER

ELECTRICAL CHARACTERISTICS
Symbol

Condition

Min

Max

Unit

Collector-Emitter Breakdown Voltage

Characteristic

V(BR)CEO

IC = 10 mA, IB = 0

15

Vdc

Emitter-Base Breakdown Voltage

V(BR)EBO

IE = 10 A, IE = 0

5.0

Vdc

ICBO

VCB = 20 V, IE = 0

0.1

ICEO
hFE1(2)

VCE = 10 V, IB = 0

100

Collector-Base Cutoff Current


Collector-Emitter Cutoff Current
DC Current Gain

VCE = 5 V, IC = 100 mA

300

600

Collector-Emitter Saturation Voltage

VCE(sat)(2)

IC = 10 mA, IB = 1.0 mA
IC = 50 mA, IB = 5.0 mA
IC = 100 mA, IB = 10 mA

0.1
0.1
0.19

Vdc

Base-Emitter Saturation Voltage

VBE(sat)(2)

IC = 100 mA, IB = 10 mA

1.1

Vdc

(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
(2) Pulse Test: Pulse Width 300 s, D.C. 2%.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2300

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA


Preliminary Information

General Purpose Transistor

MMBT2222AWT1

NPN Silicon

Motorola Preferred Device

These transistors are designed for general purpose amplifier applications. They are housed in the SOT323/SC70 package which is
designed for low power surface mount applications.
COLLECTOR
3
3

1
BASE

1
2

2
EMITTER

CASE 419 02, STYLE 3


SOT 323/SC 70

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

75

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

IC

600

mAdc

Symbol

Max

Unit

PD

150

mW

RqJA

833

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR 5 Board
TA = 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT2222AWT1 = 1P

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

75

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

6.0

Vdc

Base Cutoff Current


(VCE = 60 Vdc, VEB = 3.0 Vdc)

IBL

20

nAdc

Collector Cutoff Current


(VCE = 60 Vdc, VEB = 3.0 Vdc)

ICEX

10

nAdc

Characteristic

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2301

MMBT2222AWT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

35
50
75
100
40

0.3
1.0

0.6

1.2
2.0

fT

300

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

8.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

30

pF

Input Impedance
(VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz)

hie

0.25

1.25

k ohms

Voltage Feedback Ratio


(VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz)

hre

4.0

X 10 4

Small Signal Current Gain


(VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz)

hfe

75

375

Output Admittance
(VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz)

hoe

25

200

mmhos

Noise Figure
(VCE = 10 Vdc, IC = 100 mAdc, RS = 1.0 k ohms, f = 1.0 kHz)

NF

4.0

dB

((VCC = 3.0 Vdc, VBE = 0.5 Vdc,


IC = 150 mAdc, IB1 = 15 mAdc)

td

10

tr

25

((VCC = 30 Vdc, IC = 150 mAdc,


IB1 = IB2 = 15 mAdc)

ts

225

tf

60

ON CHARACTERISTICS(1)
DC Current Gain (1)
(IC = 0.1 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 150 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 10 Vdc)

HFE

Collector Emitter Saturation Voltage(1)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

Base Emitter Saturation Voltage(1)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
1. Pulse Test: Pulse Width

2302

v 300 ms, Duty Cycle v 2.0%.

ns

ns

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors


NPN Silicon

MMBT2222LT1
MMBT2222ALT1*

COLLECTOR
3

*Motorola Preferred Device

1
BASE
2
EMITTER

MAXIMUM RATINGS

3
1

Rating

Symbol

2222

2222A

Unit

Collector Emitter Voltage

VCEO

30

40

Vdc

Collector Base Voltage

VCBO

60

75

Vdc

Emitter Base Voltage

VEBO

5.0

Collector Current Continuous

6.0

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

Vdc

IC

600

mAdc

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT2222LT1 = M1B; MMBT2222ALT1 = 1P

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0)

MMBT2222
MMBT2222A

V(BR)CEO

30
40

Vdc

Collector Base Breakdown Voltage (IC = 10 mAdc, IE = 0)

MMBT2222
MMBT2222A

V(BR)CBO

60
75

Vdc

Emitter Base Breakdown Voltage (IE = 10 mAdc, IC = 0)

MMBT2222
MMBT2222A

V(BR)EBO

5.0
6.0

Vdc

Collector Cutoff Current (VCE = 60 Vdc, VEB(off) = 3.0 Vdc)

MMBT2222A

ICEX

10

nAdc

Collector Cutoff Current (VCB = 50 Vdc, IE = 0)


(VCB = 60 Vdc, IE = 0)
(VCB = 50 Vdc, IE = 0, TA = 125C)
(VCB = 60 Vdc, IE = 0, TA = 125C)

MMBT2222
MMBT2222A
MMBT2222
MMBT2222A

ICBO

0.01
0.01
10
10

Adc

Emitter Cutoff Current (VEB = 3.0 Vdc, IC = 0)

MMBT2222A

IEBO

100

nAdc

Base Cutoff Current (VCE = 60 Vdc, VEB(off) = 3.0 Vdc)

MMBT2222A

IBL

20

nAdc

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2303

MMBT2222LT1 MMBT2222ALT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

35
50
75
35
100
50
30
40

300

MMBT2222
MMBT2222A

0.4
0.3

MMBT2222
MMBT2222A

1.6
1.0

MMBT2222
MMBT2222A

0.6

1.3
1.2

MMBT2222
MMBT2222A

2.6
2.0

250
300

8.0

30
25

2.0
0.25

8.0
1.25

8.0
4.0

50
75

300
375

5.0
25

35
200

150

4.0

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc, TA = 55C)
(IC = 150 mAdc, VCE = 10 Vdc) (3)
(IC = 150 mAdc, VCE = 1.0 Vdc) (3)
(IC = 500 mAdc, VCE = 10 Vdc) (3)

hFE

MMBT2222A only

MMBT2222
MMBT2222A

Collector Emitter Saturation Voltage (3)


(IC = 150 mAdc, IB = 15 mAdc)

VCE(sat)

(IC = 500 mAdc, IB = 50 mAdc)


Base Emitter Saturation Voltage (3)
(IC = 150 mAdc, IB = 15 mAdc)

Vdc

VBE(sat)

(IC = 500 mAdc, IB = 50 mAdc)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product (4)
(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT
MMBT2222
MMBT2222A

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

MHz

Cobo

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

pF

Cibo
MMBT2222
MMBT2222A

Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

MMBT2222A
MMBT2222A

Voltage Feedback Ratio


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

MMBT2222A
MMBT2222A

Small Signal Current Gain


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

MMBT2222A
MMBT2222A

Output Admittance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

MMBT2222A
MMBT2222A

Collector Base Time Constant


(IE = 20 mAdc, VCB = 20 Vdc, f = 31.8 MHz)

MMBT2222A

Noise Figure
(IC = 100 mAdc, VCE = 10 Vdc, RS = 1.0 k, f = 1.0 kHz)

MMBT2222A

pF

hie

X 10 4

hre

hfe

mmhos

hoe

rb, Cc

ps

NF

dB

SWITCHING CHARACTERISTICS (MMBT2222A only)


Delay Time
Rise Time
Storage Time
Fall Time

((VCC = 30 Vdc, VBE(off) = 0.5 Vdc,


IC = 150 mAdc, IB1 = 15 mAdc)

td

10

tr

25

((VCC = 30 Vdc, IC = 150 mAdc,


IB1 = IB2 = 15 mAdc)

ts

225

tf

60

ns

ns

3. Pulse Test: Pulse Width


300 ms, Duty Cycle
2.0%.
4. fT is defined as the frequency at which |hfe| extrapolates to unity.

2304

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT2222LT1 MMBT2222ALT1
SWITCHING TIME EQUIVALENT TEST CIRCUITS
+ 30 V

+ 30 V
1.0 to 100 s,
DUTY CYCLE 2.0%

+16 V
0
2 V

200

+16 V

1.0 to 100 s,
DUTY CYCLE 2.0%

200

0
1 k

CS* < 10 pF

< 2 ns

1k

14 V
< 20 ns

CS* < 10 pF

1N914

4 V
Scope rise time < 4 ns
*Total shunt capacitance of test jig, connectors, and oscilloscope.

Figure 1. TurnOn Time

Figure 2. TurnOff Time

hFE , DC CURRENT GAIN

1000
700
500
300
200
100
70
50
30
20
10
0.1

0.2

0.3

0.5 0.7

1.0

2.0

3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70

100

200

5.0

10

300

500 700 1.0 k

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 3. DC Current Gain

1.0
0.8

0.6

0.4

0.2

0
0.005

0.01

0.02 0.03

0.05

0.1

0.2

0.3
0.5
1.0
IB, BASE CURRENT (mA)

2.0

3.0

20

30

50

Figure 4. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2305

MMBT2222LT1 MMBT2222ALT1
200

500
IC/IB = 10
TJ = 25C
tr @ VCC = 30 V
td @ VEB(off) = 2.0 V
td @ VEB(off) = 0

30
20
10
7.0
5.0

200

ts = ts 1/8 tf

100
70
50

tf

30
20
10
7.0
5.0

3.0
2.0
5.0 7.0

10

200 300
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

500

20 30
50 70 100
200
IC, COLLECTOR CURRENT (mA)

Figure 5. Turn On Time

IC = 1.0 mA, RS = 150


500 A, RS = 200
100 A, RS = 2.0 k
50 A, RS = 4.0 k

6.0

f = 1.0 kHz
8.0
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

RS = OPTIMUM
RS = SOURCE
RS = RESISTANCE

4.0

2.0

IC = 50 A
100 A
500 A
1.0 mA

6.0

4.0

2.0

0
0.01 0.02 0.05 0.1 0.2

0.5 1.0 2.0

5.0 10

20

100 200

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

RS, SOURCE RESISTANCE (OHMS)

Figure 7. Frequency Effects

Figure 8. Source Resistance Effects

Ceb
10
7.0
5.0
Ccb
3.0

0.5 0.7 1.0


2.0 3.0 5.0 7.0 10
REVERSE VOLTAGE (VOLTS)

Figure 9. Capacitances

20 30

50

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

f, FREQUENCY (kHz)

20

0.2 0.3

0
50

50 100

30

CAPACITANCE (pF)

500

10

8.0

2306

300

Figure 6. Turn Off Time

10

2.0
0.1

VCC = 30 V
IC/IB = 10
IB1 = IB2
TJ = 25C

300

t, TIME (ns)

t, TIME (ns)

100
70
50

500
VCE = 20 V
TJ = 25C

300
200

100
70
50
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

Figure 10. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT2222LT1 MMBT2222ALT1
1.0

+0.5
TJ = 25C
0
COEFFICIENT (mV/ C)

V, VOLTAGE (VOLTS)

0.8
VBE(sat) @ IC/IB = 10
1.0 V

0.6
VBE(on) @ VCE = 10 V
0.4

0.2

RqVC for VCE(sat)

0.5
1.0
1.5
RqVB for VBE

2.0
VCE(sat) @ IC/IB = 10

2.5
0.1 0.2

50 100 200
0.5 1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

500 1.0 k

Figure 11. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.1 0.2

0.5

1.0 2.0
5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mA)

500

Figure 12. Temperature Coefficients

2307

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Transistors

MMBT2369LT1
MMBT2369ALT1*

COLLECTOR
3

NPN Silicon

1
BASE

*Motorola Preferred Device

2
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

15

Vdc

Collector Emitter Voltage

VCES

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

4.5

Vdc

IC

200

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

3
1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT2369LT1 = M1J; MMBT2369ALT1 = 1JA

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

15

40

40

4.5

0.4
30

0.4

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage (3)
(IC = 10 mAdc, IB = 0)

V(BR)CEO

Collector Emitter Breakdown Voltage


(IC = 10 Adc, VBE = 0)

V(BR)CES

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)
(VCB = 20 Vdc, IE = 0, TA = 150C)
Collector Cutoff Current
(VCE = 20 Vdc, VBE = 0)


 

Vdc
Vdc
Vdc
Vdc
Adc

ICBO

Adc

ICES
MMBT2369A

1. FR 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.

2308

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT2369LT1 MMBT2369ALT1
ELECTRICAL CHARACTERISTICS (continued) (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

40

40
20
30
20
20

120
120

0.25
0.20
0.30
0.25
0.50

0.7

0.85
1.02
1.15
1.60

4.0

5.0

5.0

13

8.0

12

10

18

Unit

ON CHARACTERISTICS
DC Current Gain (3)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 0.35 Vdc)
(IC = 10 mAdc, VCE = 0.35 Vdc, TA = 55C)
(IC = 30 mAdc, VCE = 0.4 Vdc)
(IC = 100 mAdc, VCE = 2.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)

MMBT2369
MMBT2369A
MMBT2369A
MMBT2369A
MMBT2369A
MMBT2369
MMBT2369A

hFE

Collector Emitter Saturation Voltage (3)


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc, TA = +125C)
(IC = 30 mAdc, IB = 3.0 mAdc)
(IC = 100 mAdc, IB = 10 mAdc)

MMBT2369
MMBT2369A
MMBT2369A
MMBT2369A
MMBT2369A

Base Emitter Saturation Voltage (3)


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc, TA = 55C)
(IC = 30 mAdc, IB = 3.0 mAdc)
(IC = 100 mAdc, IB = 10 mAdc)

MMBT2369A
MMBT2369A
MMBT2369A
MMBT2369A

VCE(sat)

Vdc

VBE(sat)

Vdc

SMALL SIGNAL CHARACTERISTICS


Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)
Small Signal Current Gain
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)

Cobo

pF

hfe

SWITCHING CHARACTERISTICS
Storage Time
(IB1 = IB2 = IC = 10 mAdc)

ts

TurnOn Time
(VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc)

ton

TurnOff Time
(VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc, IB2 = 1.5 mAdc)

toff

3. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

ns
ns
ns

2309

MMBT2369LT1 MMBT2369ALT1
SWITCHING TIME EQUIVALENT TEST CIRCUITS FOR 2N2369, 2N3227
t1

+10.6 V
0
1.5 V

3V

< 1 ns

270

3.3 k

0
9.15 V

Cs* < 4 pF

Figure 1. ton Circuit 10 mA

t1

2 V

10 V

95
+11.4 V

1k

Cs* < 4 pF

Figure 3. toff Circuit 10 mA

t1

10 V

0
8.6 V

0
< 1 ns

3.3 k

< 1 ns
PULSE WIDTH (t1) = 300 ns
DUTY CYCLE = 2%

PULSE WIDTH (t1) = 300 ns


DUTY CYCLE = 2%

+10.8 V

270

t1

+10.75 V

Cs* < 12 pF

1k

< 1 ns
PULSE WIDTH (t1) BETWEEN
10 AND 500 s
DUTY CYCLE = 2%

PULSE WIDTH (t1) = 300 ns


DUTY CYCLE = 2%

Figure 2. ton Circuit 100 mA

95

Cs* < 12 pF
1N916

Figure 4. toff Circuit 100 mA

* Total shunt capacitance of test jig and connectors.


TO OSCILLOSCOPE
INPUT IMPEDANCE = 50
RISE TIME = 1 ns

TURNON WAVEFORMS
Vin
0
ton

Vout
90%

0.1 F

220

10%

Vout

3.3 k

Vin

50

PULSE GENERATOR
Vin RISE TIME < 1 ns
SOURCE IMPEDANCE = 50
PW 300 ns
DUTY CYCLE < 2%

50

3.3 k
0.0023 F
0.005 F

0.0023 F
0.005 F

0.1 F

0.1 F

VBB +

TURNOFF WAVEFORMS
0

10%

Vin

90%

Vout
+V =3V
CC

toff

VBB = +12 V
Vin = 15 V

Figure 5. TurnOn and TurnOff Time Test Circuit

100
TJ = 25C

LIMIT
TYPICAL

Cib

SWITCHING TIMES (nsec)

CAPACITANCE (pF)

4
3

Cob

1
0.1

tr (VCC = 3 V)

20

tf
tr

VCC = 10 V

10
5

ts

td

2
0.2

0.5
1.0
2.0
REVERSE BIAS (VOLTS)

5.0

Figure 6. Junction Capacitance Variations

2310

F = 10
VCC = 10 V
VOB = 2 V

50

10

5
10
20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 7. Typical Switching Times

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT2369LT1 MMBT2369ALT1
500

200
CHARGE (pC)

QT, F = 10

VCC = 10 V
25C
100C

QT, F = 40

t1

+5 V

3V
10 pF MAX

100
0
50

< 1 ns

PULSE WIDTH (t1) = 5 s


DUTY CYCLE = 2%

QA, VCC = 10 V
QA, VCC = 3 V

20

VALUES REFER TO
IC = 10 mA TEST

270

Cs* < 4 pF

4.3 k

Figure 9. QT Test Circuit

10
2

5
10
20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 8. Maximum Charge Data

C < COPT
C

C=0

10 V

980

0
4 V

COPT

500

< 1 ns

Cs* < 3 pF

PULSE WIDTH (t1) = 300 ns


DUTY CYCLE = 2%

TIME

Figure 10. TurnOff Waveform


VCE , MAXIMUM COLLECTOREMITTER VOLTAGE (VOLTS)

t1

+6 V

Figure 11. Storage Time Equivalent Test Circuit

1.0
TJ = 25C

0.8
IC = 3 mA

IC = 10 mA

IC = 30 mA

IC = 50 mA

IC = 100 mA

0.6

0.4

0.2
0.02

0.05

0.1

0.2

0.5
1
IB, BASE CURRENT (mA)

10

20

Figure 12. Maximum Collector Saturation Voltage Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2311

MMBT2369LT1 MMBT2369ALT1
hFE , MINIMUM DC CURRENT GAIN

200
TJ = 125C
VCE = 1 V

75C
25C

100

TJ = 25C and 75C


15C
50
55C

20
1

10
IC, COLLECTOR CURRENT (mA)

20

50

100

Figure 13. Minimum Current Gain Characteristics

1.0
F = 10
TJ = 25C

1.2

0.5
MAX VBE(sat)

1.0

COEFFICIENT (mV/ C)

V(sat) , SATURATION VOLTAGE (VOLTS)

1.4

MIN VBE(sat)

0.8
0.6

APPROXIMATE DEVIATION
FROM NOMINAL

0.5
VC
VB

1.0

55C to +25C
0.15 mV/C

25C to 125C
0.15 mV/C

0.4 mV/C

0.3 mV/C

(25C to 125C)
(55C to +25C)

(55C to +25C)
(25C to 125C)

1.5
VB for VBE(sat)

0.4
0.2

VC for VCE(sat)

MAX VCE(sat)
1

5
10
20
IC, COLLECTOR CURRENT (mA)

2.0
50

Figure 14. Saturation Voltage Limits

2312

100

2.5

10

20

30
40
50
60
70
IC, COLLECTOR CURRENT (mA)

80

90

100

Figure 15. Typical Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Low Noise Transistor

MMBT2484LT1

COLLECTOR
3

NPN Silicon

1
BASE
2
EMITTER

MAXIMUM RATINGS

3
1

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

60

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

IC

50

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT2484LT1 = 1U

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

60

60

5.0

10
10

10

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 10 mAdc, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 45 Vdc, IE = 0)
(VCB = 45 Vdc, IE = 0, TA = 150C)

ICBO

Emitter Cutoff Current


(VEB = 5.0 Vdc, IC = 0)

IEBO

 0.062 in.
  0.024 in. 99.5% alumina.

Vdc
Vdc
Vdc

nAdc
Adc
nAdc

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2313

MMBT2484LT1
ELECTRICAL CHARACTERISTICS (continued) (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Max

250

800

0.35

0.95

6.0

6.0

3.0

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 5.0 Vdc)
(IC = 10 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 1.0 mAdc, IB = 0.1 mAdc)

VCE(sat)

Base Emitter On Voltage


(IC = 1.0 mAdc, VCE = 5.0 mAdc)

VBE(on)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

Noise Figure
(IC = 10 mAdc, VCE = 5.0 Vdc, RS = 10 k, f = 1.0 kHz, BW = 200 Hz)

RS

pF
pF

NF

dB

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

2314

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT2484LT1
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
NOISE VOLTAGE
30

30
BANDWIDTH = 1.0 Hz

BANDWIDTH = 1.0 Hz
20

RS 0

IC = 10 mA

en , NOISE VOLTAGE (nV)

en , NOISE VOLTAGE (nV)

20

3.0 mA

10

1.0 mA

7.0
5.0

RS 0
f = 10 Hz
10

100 Hz

7.0
10 kHz

1.0 kHz

5.0

300 A
3.0
10

20

50 100 200

3.0
0.01 0.02

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

Figure 2. Effects of Frequency

IC = 10 mA
3.0 mA
1.0 mA
300 A
100 A

0.3
0.2
RS 0

0.1
10

20

10 A
50 100 200

10

16

3.0

1.0
0.7
0.5

5.0

20

BANDWIDTH = 1.0 Hz

2.0

0.05 0.1 0.2


0.5 1.0
2.0
IC, COLLECTOR CURRENT (mA)

Figure 3. Effects of Collector Current

NF, NOISE FIGURE (dB)

In, NOISE CURRENT (pA)

10
7.0
5.0

100 kHz

BANDWIDTH = 10 Hz to 15.7 kHz


12
500 A

8.0

IC = 1.0 mA

100 A
10 A

4.0

30 A
0
10

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

20

Figure 4. Noise Current

50 100 200 500 1 k 2 k


5 k 10 k 20 k 50 k 100 k
RS, SOURCE RESISTANCE (OHMS)

Figure 5. Wideband Noise Figure


100 Hz NOISE DATA
20

BANDWIDTH = 1.0 Hz

IC = 10 mA
16

100 A

100
70
50

3.0 mA
1.0 mA

30

300 A

20
10
7.0
5.0

30 A
10 A

NF, NOISE FIGURE (dB)

VT, TOTAL NOISE VOLTAGE (nV)

300
200

IC = 10 mA

3.0 mA
1.0 mA

12

300 A
8.0
100 A
30 A

4.0

10 A

BANDWIDTH = 1.0 Hz
0

3.0
10

20

50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k


RS, SOURCE RESISTANCE (OHMS)

Figure 6. Total Noise Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k


RS, SOURCE RESISTANCE (OHMS)

Figure 7. Noise Figure

2315

h FE, DC CURRENT GAIN (NORMALIZED)

MMBT2484LT1
4.0
3.0
VCE = 5.0 V
2.0

TA = 125C
25C

1.0
55C

0.7
0.5
0.4
0.3
0.2
0.01

0.02

0.03

0.05

0.1

0.2
0.3
0.5
IC, COLLECTOR CURRENT (mA)

1.0

2.0

3.0

5.0

10

Figure 8. DC Current Gain

0.4
RVBE, BASEEMITTER
TEMPERATURE COEFFICIENT (mV/ C)

1.0
TJ = 25C
V, VOLTAGE (VOLTS)

0.8

0.6

VBE @ VCE = 5.0 V

0.4

0.2

0.8

1.2

TJ = 25C to 125C

1.6

2.0
55C to 25C

VCE(sat) @ IC/IB = 10
0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

2.4
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10
IC, COLLECTOR CURRENT (mA)

100

8.0

C, CAPACITANCE (pF)

6.0

TJ = 25C
Cob

4.0
3.0

Ceb

Cib

Ccb

2.0

1.0
0.8
0.1

0.2

1.0
2.0
5.0
0.5
10
20
VR, REVERSE VOLTAGE (VOLTS)

Figure 11. Capacitance

2316

50 100

Figure 10. Temperature Coefficients

50

100

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 9. On Voltages

20

500

300
200

100
VCE = 5.0 V
TJ = 25C

70
50
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 12. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA


Preliminary Information

General Purpose Transistor

MMBT2907AWT1

PNP Silicon

Motorola Preferred Device

These transistors are designed for general purpose amplifier


applications. They are housed in the SOT323/SC70 package
which is designed for low power surface mount applications.

COLLECTOR
3
3

1
BASE

1
2

2
EMITTER

CASE 419 02, STYLE 3


SOT 323/SC 70

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

60

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

600

mAdc

Symbol

Max

Unit

PD

150

mW

RqJA

833

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR 5 Board(1)
TA = 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT2907AWT1 = 2F

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(2)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

60

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Base Cutoff Current


(VCE = 30 Vdc, VEB(off) = 0.5 Vdc)

IBL

50

nAdc

Collector Cutoff Current


(VCE = 30 Vdc, VEB(off) = 0.5 Vdc)

ICEX

50

nAdc

Characteristic

OFF CHARACTERISTICS

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Pulse Test: Pulse Width
300 ms, Duty Cycle

v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2317

MMBT2907AWT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

75
100
100
100
50

0.4
1.6

1.3
2.6

fT

200

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

8.0

pF

Input Capacitance
(VEB = 2.0 Vdc, IC = 0, f = 1.0 MHz)

Cibo

30

pF

ton

45

td

10

Rise Time

tr

40

Storage Time

ts

80

tf

30

toff

100

ON CHARACTERISTICS(1)
DC Current Gain (1)
(IC = 0.1 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 150 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 10 Vdc)

HFE

Collector Emitter Saturation Voltage(1)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

Base Emitter Saturation Voltage(1)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 50 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS
TurnOn Time
Delay Time

Fall Time
TurnOff Time
1. Pulse Test: Pulse Width

2318

(VCC = 30
30 Vd
Vdc,
IC = 150
150 mAdc, IB1 = 15
15 mAdc)

(VCC = 6.0
6 0 Vd
Vdc, IC = 150
150 mAdc,
Ad
IB1 = IB2 = 15 mAdc)

v 300 ms, Duty Cycle v 2.0%.

ns

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors

MMBT2907LT1
MMBT2907ALT1*

COLLECTOR
3

PNP Silicon

*Motorola Preferred Device

1
BASE
2
EMITTER

MAXIMUM RATINGS

3
1

Rating

Symbol

2907

2907A

Unit

Collector Emitter Voltage

VCEO

40

60

Vdc

Collector Base Voltage

VCBO

Emitter Base Voltage

VEBO

5.0

Vdc

IC

600

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

60

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

Vdc

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT2907LT1 = M2B; MMBT2907ALT1 = 2F

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

40
60

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(3)
(IC = 10 mAdc, IB = 0)

V(BR)CEO
MMBT2907
MMBT2907A

Vdc

Collector Base Breakdown Voltage (IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage (IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

ICEX

50

nAdc

MMBT2907
MMBT2907A

0.020
0.010

MMBT2907
MMBT2907A

20
10

50

Collector Cutoff Current (VCE = 30 Vdc, VBE(off) = 0.5 Vdc)


Collector Cutoff Current
(VCB = 50 Vdc, IE = 0)

(VCB = 50 Vdc, IE = 0, TA = 125C)


Base Current (VCE = 30 Vdc, VEB(off) = 0.5 Vdc)


 

Adc

ICBO

IB

nAdc

1. FR 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width
300 ms, Duty Cycle
2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2319

MMBT2907LT1 MMBT2907ALT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

MMBT2907
MMBT2907A

35
75

(IC = 1.0 mAdc, VCE = 10 Vdc)

MMBT2907
MMBT2907A

50
100

(IC = 10 mAdc, VCE = 10 Vdc)

MMBT2907
MMBT2907A

75
100

(IC = 150 mAdc, VCE = 10 Vdc) (3)

MMBT2907
MMBT2907A

100

300

(IC = 500 mAdc, VCE = 10 Vdc) (3)

MMBT2907
MMBT2907A

30
50

0.4
1.6

1.3
2.6

200

8.0

30

ton

45

td

10

tr

40

toff

100

ts

80

tf

30

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 10 Vdc)

hFE

Collector Emitter Saturation Voltage (3)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

Base Emitter Saturation Voltage (3)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product (3),(4)
(IC = 50 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

Input Capacitance
(VEB = 2.0 Vdc, IC = 0, f = 1.0 MHz)

Cibo

MHz
pF
pF

SWITCHING CHARACTERISTICS
TurnOn Time
(VCC = 30
30 Vdc,
Vd IC = 150
150 mAdc,
Ad
IB1 = 15
15 mAdc)

Delay Time
Rise Time
TurnOff Time

(VCC = 6.0
6 0 Vd
Vdc, IC = 150
150 mAdc,
Ad
IB1 = IB2 = 15
15 mAdc)

Storage Time
Fall Time

ns

ns

3. Pulse Test: Pulse Width


300 ms, Duty Cycle
2.0%.
4. fT is defined as the frequency at which |hfe| extrapolates to unity.
INPUT
Zo = 50
PRF = 150 PPS
RISE TIME 2.0 ns
P.W. < 200 ns

30 V
200
1.0 k

TO OSCILLOSCOPE
RISE TIME 5.0 ns

50

16 V
200 ns

Figure 1. Delay and Rise Time Test Circuit

2320

INPUT
Zo = 50
PRF = 150 PPS
RISE TIME 2.0 ns
P.W. < 200 ns

+15 V

6.0 V

1.0 k
1.0 k

0
30 V

50

37
TO OSCILLOSCOPE
RISE TIME 5.0 ns

1N916

200 ns

Figure 2. Storage and Fall Time Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT2907LT1 MMBT2907ALT1
TYPICAL CHARACTERISTICS

hFE , NORMALIZED CURRENT GAIN

3.0
VCE = 1.0 V
VCE = 10 V

2.0

TJ = 125C
25C

1.0
55C

0.7
0.5
0.3
0.2
0.1

0.2 0.3

0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

50 70 100

200 300

500

IC, COLLECTOR CURRENT (mA)

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 3. DC Current Gain

1.0

0.8
IC = 1.0 mA

10 mA

100 mA

500 mA

0.6

0.4

0.2

0
0.005

0.01

0.02 0.03 0.05 0.07 0.1

0.2

0.3 0.5 0.7 1.0


IB, BASE CURRENT (mA)

3.0

2.0

5.0 7.0 10

20 30

50

Figure 4. Collector Saturation Region

500

tr

100
70
50

300

VCC = 30 V
IC/IB = 10
TJ = 25C

30
20
td @ VBE(off) = 0 V

tf

3.0
5.0 7.0 10

2.0 V
20 30
50 70 100
IC, COLLECTOR CURRENT

100
70
50
30

ts = ts 1/8 tf

20

10
7.0
5.0

VCC = 30 V
IC/IB = 10
IB1 = IB2
TJ = 25C

200

t, TIME (ns)

t, TIME (ns)

300
200

200 300 500

Figure 5. TurnOn Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10
7.0
5.0
5.0 7.0 10

20 30
50 70 100
200 300 500
IC, COLLECTOR CURRENT (mA)

Figure 6. TurnOff Time

2321

MMBT2907LT1 MMBT2907ALT1
TYPICAL SMALL SIGNAL CHARACTERISTICS
NOISE FIGURE
VCE = 10 Vdc, TA = 25C
10

10

8.0

8.0
NF, NOISE FIGURE (dB)

IC = 1.0 mA, Rs = 430


500 A, Rs = 560
50 A, Rs = 2.7 k
100 A, Rs = 1.6 k

6.0

4.0

Rs = OPTIMUM SOURCE RESISTANCE

2.0

0
0.01 0.02 0.05 0.1 0.2

0.5 1.0 2.0

5.0 10

20

50

C, CAPACITANCE (pF)

50

100

200

500 1.0 k 2.0 k

20 k

Rs, SOURCE RESISTANCE (OHMS)

Figure 7. Frequency Effects

Figure 8. Source Resistance Effects

Ceb

10
7.0
5.0

Ccb

3.0

0.2 0.3 0.5

1.0

2.0 3.0 5.0

10

20 30

50 k

400
300
200

100
80

VCE = 20 V
TJ = 25C

60
40
30
20
1.0 2.0

5.0

10

20

50

100 200

500 1000

REVERSE VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 9. Capacitances

Figure 10. CurrentGain Bandwidth Product

+0.5

1.0
TJ = 25C

0.6

VBE(sat) @ IC/IB = 10
COEFFICIENT (mV/ C)

0.8

VBE(on) @ VCE = 10 V

0.4

0.2

RqVC for VCE(sat)


0.5
1.0
1.5
RqVB for VBE

2.0
VCE(sat) @ IC/IB = 10

0
0.1 0.2

2322

5.0 k 10 k

f, FREQUENCY (kHz)

20

V, VOLTAGE (VOLTS)

IC = 50 A
100 A
500 A
1.0 mA

4.0

100

30

2.0
0.1

6.0

2.0

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

NF, NOISE FIGURE (dB)

f = 1.0 kHz

0.5 1.0 2.0 5.0 10 20

50 100 200

500

2.5
0.1 0.2 0.5 1.0 2.0

5.0 10 20

50 100 200 500

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 11. On Voltage

Figure 12. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Transistor

MMBT3640LT1

COLLECTOR
3

PNP Silicon

Motorola Preferred Device

1
BASE
2
EMITTER

MAXIMUM RATINGS

3
1

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

12

Vdc

Collector Base Voltage

VCBO

12

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

IC

80

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT3640LT1 = 2J

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage (IC = 100 Adc, VBE = 0)

V(BR)CES

12

Vdc

Collector Emitter Sustaining Voltage(1) (IC = 10 mAdc, IB = 0)

VCEO(sus)

12

Vdc

Collector Base Breakdown Voltage (IC = 100 mAdc, IE = 0)

V(BR)CBO

12

Vdc

Emitter Base Breakdown Voltage (IE = 100 mAdc, IC = 0)

V(BR)EBO

4.0

Vdc

0.01
1.0

10

OFF CHARACTERISTICS

Collector Cutoff Current


(VCE = 6.0 Vdc, VBE = 0)
(VCE = 6.0 Vdc, VBE = 0, TA = 65C)
Base Cutoff Current (VCE = 6.0 Vdc, VEB = 0)

 0.062 in.
  0.024 in. 99.5% alumina.

Adc

ICES

IB

nAdc

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2323

MMBT3640LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

30
20

120

0.2
0.6
0.25

0.75
0.8

0.95
1.0
1.5

500

3.5

3.5

Unit

ON CHARACTERISTICS(3)
DC Current Gain
(IC = 10 mAdc, VCE = 0.3 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc, TA = 65C)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

fT

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

MHz
pF
pF

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time

((VCC = 6.0 Vdc, IC = 50 mAdc,


VEB(off) = 1.9 Vdc, IB1 = 5.0 mAdc)

td

10

tr

30

((VCC = 6.0 Vdc, IC = 50 mAdc,


IB1 = IB2 = 5.0 mAdc)

ts

20

tf

12

25
60

35
75

TurnOn Time
(VCC = 6.0 Vdc, IC = 50 mAdc, VEB(off) = 1.9 Vdc, IB1 = 5.0 mAdc)
(VCC = 1.5 Vdc, IC = 10 mAdc, IB1 = 0.5 mAdc)

ton

TurnOff Time
(VCC = 6.0 Vdc, IC = 50 mAdc, VEB(off) = 1.9 Vdc, IB1 = IB2 = 5.0 mAdc)
(VCC = 1.5 Vdc, IC = 10 mAdc, IB1 = IB2 = 0.5 mAdc)

toff

3. Pulse Test: Pulse Width

ns
ns

ns

v 300 ms, Duty Cycle v 2.0%.

VBB = +1.9 V VCC = 6.0 V


1.0 k
0

ns

0.1 F

680

VBB = 6.0 V

110

VCC = 1.5 V

5.0 k
Vout

5.0 V

0.1 F

5.0 k

130
Vout

Vin
6.8 V
TO SAMPLING SCOPE
PULSE SOURCE
51
INPUT Z 100 k
RISE TIME 1.0 ns
RISE TIME 1.0 ns
PULSE WIDTH 100 ns
Zin = 50 OHMS
NOTES: Collector Current = 50 mA,
FALL TIME 1.0 ns
NOTES: TurnOn and TurnOff Time
NOTES: Base Currents = 5.0 mA.

Vin
0
TO SAMPLING SCOPE
PULSE SOURCE
51
INPUT Z 100 k
RISE TIME 1.0 ns
RISE TIME 1.0 ns
PULSE WIDTH 200 ns
Zin = 50 OHMS
NOTES: Collector Current = 10 mA,
FALL TIME 1.0 ns
NOTES: TurnOn and TurnOff Time
NOTES: Base Currents = 0.5 mA.

Figure 1.

Figure 2.

2324

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT3640LT1
200

1.4
1.2

TJ = 125C

100

25C

70
50

V, VOLTAGE (VOLTS)

hFE, DC CURRENT GAIN

VCE = 1.0 V

55C

30

TJ = 25C
VBE(sat) @ IC/IB = 10

1.0
0.8

VBE(on) @ VCE = 1.0 V


0.6
0.4

20
VCE(sat) @ IC/IB = 10

0.2
10
0.1 0.2

5.0 10 20
0.5 1.0 2.0
IC, COLLECTOR CURRENT (mA)

50

0
0.1 0.2

100

+0.5

1.0
TJ = 25C
0.8
IC = 1.0 mA

5.0 mA

20 mA

80 mA

0.6

0.4

0.2

0
0.01 0.02

0.05 0.1 0.2


0.5 1.0
IB, BASE CURRENT (mA)

2.0

5.0

*APPLIES FOR IC/IB hFE/4

100

55C to 25C
0.5

1.0
25C to 125C

1.5

55C to 25C

RVB for VBE


2.0
0.1 0.2

10

25C to 125C

RVC for VCE(sat)

Figure 5. Collector Saturation Region

0.5 1.0 2.0


5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 6. Temperature Coefficients

5.0

2000
TJ = 25C
f = 100 MHz

TJ = 25C

VCE = 10 V

3.0
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

50

Figure 4. On Voltages

V, TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 3. DC Current Gain

0.5 1.0 2.0 5.0 10 20


IC, COLLECTOR CURRENT (mA)

1000
1.0 V

800
600
400

2.0
Cobo
Cibo
1.0
0.7

200
1.0

2.0 3.0

5.0 7.0 10

20 30

50 70 100

0.5
0.2 0.3

0.5 0.7 1.0

2.0 3.0

5.0 7.0 10

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 7. CurrentGain Bandwidth Product

Figure 8. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

20

2325

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistor


NPN Silicon

MMBT3904LT1
COLLECTOR
3

Motorola Preferred Device

1
BASE
3

2
EMITTER

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

IC

200

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT3904LT1 = 1AM

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage (3)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

6.0

Vdc

Base Cutoff Current


(VCE = 30 Vdc, VEB = 3.0 Vdc)

IBL

50

nAdc

Collector Cutoff Current


(VCE = 30 Vdc, VEB = 3.0 Vdc)

ICEX

50

nAdc

Characteristic

OFF CHARACTERISTICS


 

1. FR 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width
300 ms, Duty Cycle
2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2326

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT3904LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

40
70
100
60
30

300

0.2
0.3

0.65

0.85
0.95

fT

300

MHz

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

4.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

8.0

pF

Input Impedance
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

hie

1.0

10

k ohms

Voltage Feedback Ratio


(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

hre

0.5

8.0

X 10 4

Small Signal Current Gain


(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

hfe

100

400

Output Admittance
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

hoe

1.0

40

mmhos

Noise Figure
(VCE = 5.0 Vdc, IC = 100 mAdc, RS = 1.0 k ohms, f = 1.0 kHz)

NF

5.0

dB

((VCC = 3.0 Vdc, VBE = 0.5 Vdc,


IC = 10 mAdc, IB1 = 1.0 mAdc)

td

35

tr

35

((VCC = 3.0 Vdc,


IC = 10 mAdc, IB1 = IB2 = 1.0 mAdc)

ts

200

tf

50

ON CHARACTERISTICS(3)
DC Current Gain (1)
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)

HFE

Collector Emitter Saturation Voltage (3)


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage (3)


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
3. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

ns

ns

2327

MMBT3904LT1
DUTY CYCLE = 2%
300 ns

+3 V
+10.9 V

10 < t1 < 500 ms


275

t1

DUTY CYCLE = 2%

+3 V
+10.9 V
275

10 k

10 k
0

0.5 V

CS < 4 pF*

< 1 ns

CS < 4 pF*

1N916
9.1 V

< 1 ns

* Total shunt capacitance of test jig and connectors

Figure 1. Delay and Rise Time


Equivalent Test Circuit

Figure 2. Storage and Fall Time


Equivalent Test Circuit

TYPICAL TRANSIENT CHARACTERISTICS

TJ = 25C
TJ = 125C
10

5000
2000

5.0

Q, CHARGE (pC)

CAPACITANCE (pF)

VCC = 40 V
IC/IB = 10

3000

7.0

Cibo
3.0
Cobo

2.0

1000
700
500
QT

300
200

QA

1.0
0.1

2328

0.2 0.3

0.5 0.7 1.0

2.0 3.0

5.0 7.0 10

20 30 40

100
70
50

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

REVERSE BIAS VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 3. Capacitance

Figure 4. Charge Data

200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT3904LT1
500

500
IC/IB = 10

100
70

tr @ VCC = 3.0 V

50
30
20

VCC = 40 V
IC/IB = 10

300
200
t r, RISE TIME (ns)

TIME (ns)

300
200

40 V

100
70
50
30
20

15 V
10
7
5

10
2.0 V

td @ VOB = 0 V
1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

Figure 5. Turn On Time

Figure 6. Rise Time

IC/IB = 10

200

500

ts = ts 1/8 tf
IB1 = IB2

VCC = 40 V
IB1 = IB2

300
200
IC/IB = 20
t f , FALL TIME (ns)

t s , STORAGE TIME (ns)

IC/IB = 20

200

IC, COLLECTOR CURRENT (mA)

500
300
200

7
5

100
70
IC/IB = 20

50

IC/IB = 10

30
20

100
70
50

10

10

7
5

7
5

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

200

IC/IB = 10

30
20

1.0

2.0 3.0

5.0 7.0 10

20

30

200

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 7. Storage Time

Figure 8. Fall Time

TYPICAL AUDIO SMALL SIGNAL CHARACTERISTICS


NOISE FIGURE VARIATIONS
(VCE = 5.0 Vdc, TA = 25C, Bandwidth = 1.0 Hz)

SOURCE RESISTANCE = 200


IC = 1.0 mA

NF, NOISE FIGURE (dB)

10

14

f = 1.0 kHz

SOURCE RESISTANCE = 200


IC = 0.5 mA

8
6

SOURCE RESISTANCE = 1.0 k


IC = 50 A

4
2
0
0.1

SOURCE RESISTANCE = 500


IC = 100 A

0.2

0.4

1.0

2.0

IC = 1.0 mA

12
NF, NOISE FIGURE (dB)

12

IC = 0.5 mA

10

IC = 50 mA

8
IC = 100 mA

6
4
2

4.0

10

20

40

100

0.1

0.2

0.4

1.0

2.0

4.0

10

20

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (k OHMS)

Figure 9.

Figure 10.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

40

100

2329

MMBT3904LT1
h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25C)
100
hoe, OUTPUT ADMITTANCE (m mhos)

h fe , CURRENT GAIN

300

200

100
70
50

30

0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

50

20
10
5

2
1

10

0.1

0.2

Figure 11. Current Gain

h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

h ie , INPUT IMPEDANCE (k OHMS)

10
5.0

2.0
1.0
0.5

0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

10

5.0

10

Figure 12. Output Admittance

20

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

10
7.0
5.0
3.0
2.0

1.0
0.7
0.5

10

0.1

Figure 13. Input Impedance

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

Figure 14. Voltage Feedback Ratio

h FE, DC CURRENT GAIN (NORMALIZED)

TYPICAL STATIC CHARACTERISTICS


2.0
TJ = +125C

VCE = 1.0 V

+25C

1.0
0.7

55C

0.5
0.3
0.2

0.1
0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

20

30

50

70

100

200

IC, COLLECTOR CURRENT (mA)

Figure 15. DC Current Gain

2330

Motorola SmallSignal Transistors, FETs and Diodes Device Data

VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

MMBT3904LT1
1.0
TJ = 25C
0.8

IC = 1.0 mA

10 mA

30 mA

100 mA

0.6

0.4

0.2

0
0.01

0.02

0.03

0.05

0.07

0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

IB, BASE CURRENT (mA)

Figure 16. Collector Saturation Region

1.0

1.2
TJ = 25C
VBE(sat) @ IC/IB =10

0.8
VBE @ VCE =1.0 V
0.6
0.4
VCE(sat) @ IC/IB =10

qVC FOR VCE(sat)


0

55C TO +25C

0.5
55C TO +25C
1.0
+25C TO +125C

qVB FOR VBE(sat)

1.5

0.2
0

+25C TO +125C

0.5
COEFFICIENT (mV/ C)

V, VOLTAGE (VOLTS)

1.0

1.0

2.0

5.0

10

20

50

100

200

2.0

20

40

60

80

100

120

140

160

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 17. ON Voltages

Figure 18. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

180 200

2331

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN
MMBT3904WT1
PNP
MMBT3906WT1

General Purpose Transistors


NPN and PNP Silicon

These transistors are designed for general purpose amplifier applications. They are
housed in the SOT323/SC70 which is designed for low power surface mount
applications.

MAXIMUM RATINGS
Symbol

Value

Unit

Collector Emitter Voltage

Rating
MMBT3904WT1
MMBT3906WT1

VCEO

40
40

Vdc

Collector Base Voltage

MMBT3904WT1
MMBT3906WT1

VCBO

60
40

Vdc

Emitter Base Voltage

MMBT3904WT1
MMBT3906WT1

VEBO

6.0
5.0

Vdc

IC

200
200

mAdc

GENERAL PURPOSE
AMPLIFIER TRANSISTORS
SURFACE MOUNT

Collector Current Continuous MMBT3904WT1


MMBT3906WT1

THERMAL CHARACTERISTICS

Characteristic
Total Device Dissipation(1)
TA = 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

Symbol

Max

Unit

PD

150

mW

RqJA

833

C/W

TJ, Tstg

55 to +150

CASE 41902, STYLE 3


SOT323/SC70

DEVICE MARKING
MMBT3904WT1 = AM
MMBT3906WT1 = 2A

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Characteristic

Min

Max

40
40

60
40

6.0
5.0

50
50

50
50

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(2)
(IC = 1.0 mAdc, IB = 0)
(IC = 1.0 mAdc, IB = 0)

MMBT3904WT1
MMBT3906WT1

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)
(IC = 10 mAdc, IE = 0)

MMBT3904WT1
MMBT3906WT1

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)
(IE = 10 mAdc, IC = 0)

MMBT3904WT1
MMBT3906WT1

Base Cutoff Current


(VCE = 30 Vdc, VEB = 3.0 Vdc)
(VCE = 30 Vdc, VEB = 3.0 Vdc)

MMBT3904WT1
MMBT3906WT1

Collector Cutoff Current


(VCE = 30 Vdc, VEB = 3.0 Vdc)
(VCE = 30 Vdc, VEB = 3.0 Vdc)

MMBT3904WT1
MMBT3906WT1

V(BR)CEO

Vdc

V(BR)CBO

Vdc

V(BR)EBO

Vdc

IBL

nAdc

ICEX

nAdc

1. Device mounted on FR4 glass epoxy printed circuit board using the minimum recommended footprint.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

2332

Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN MMBT3904WT1 PNP MMBT3906WT1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Max

MMBT3904WT1

40
70
100
60
30

300

MMBT3906WT1

60
80
100
60
30

300

MMBT3904WT1

0.2
0.3

MMBT3906WT1

0.25
0.4

MMBT3904WT1

0.65

0.85
0.95

MMBT3906WT1

0.65

0.85
0.95

300
250

4.0
4.5

8.0
10.0

1.0
2.0

10
12

0.5
0.1

8.0
10

100
100

400
400

1.0
3.0

40
60

5.0
4.0

Characteristic

Unit

ON CHARACTERISTICS(2)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
Collector Emitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)
Base Emitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

hFE

VCE(sat)

Vdc

VBE(sat)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

MMBT3904WT1
MMBT3906WT1

fT

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

MMBT3904WT1
MMBT3906WT1

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

MMBT3904WT1
MMBT3906WT1

Input Impedance
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

MMBT3904WT1
MMBT3906WT1

Voltage Feedback Ratio


(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

MMBT3904WT1
MMBT3906WT1

Small Signal Current Gain


(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

MMBT3904WT1
MMBT3906WT1

Output Admittance
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

MMBT3904WT1
MMBT3906WT1

Noise Figure
(VCE = 5.0 Vdc, IC = 100 mAdc, RS = 1.0 k , f = 1.0 kHz)
(VCE = 5.0 Vdc, IC = 100 mAdc, RS = 1.0 k , f = 1.0 kHz)

MMBT3904WT1
MMBT3906WT1

MHz

Cobo

pF

Cibo

pF

hie

X 10 4

hre

hfe

mmhos

hoe

NF

dB

SWITCHING CHARACTERISTICS
Delay Time

(VCC = 3.0 Vdc, VBE = 0.5 Vdc)


(VCC = 3.0 Vdc, VBE = 0.5 Vdc)

MMBT3904WT1
MMBT3906WT1

td

35
35

Rise Time

(IC = 10 mAdc, IB1 = 1.0 mAdc)


(IC = 10 mAdc, IB1 = 1.0 mAdc)

MMBT3904WT1
MMBT3906WT1

tr

35
35

Storage Time

(VCC = 3.0 Vdc, IC = 10 mAdc)


(VCC = 3.0 Vdc, IC = 10 mAdc)

MMBT3904WT1
MMBT3906WT1

ts

200
225

Fall Time

(IB1 = IB2 = 1.0 mAdc)


(IB1 = IB2 = 1.0 mAdc)

MMBT3904WT1
MMBT3906WT1

tf

50
75

2. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

ns

ns

2333

NPN MMBT3904WT1 PNP MMBT3906WT1


MMBT3904WT1

DUTY CYCLE = 2%
300 ns

+3 V
+10.9 V

10 < t1 < 500 ms

t1

DUTY CYCLE = 2%

275

+3 V
+10.9 V
275

10 k

10 k
0

0.5 V

CS < 4 pF*

< 1 ns

CS < 4 pF*

1N916
9.1 V

< 1 ns

* Total shunt capacitance of test jig and connectors

Figure 1. Delay and Rise Time


Equivalent Test Circuit

Figure 2. Storage and Fall Time


Equivalent Test Circuit

TYPICAL TRANSIENT CHARACTERISTICS

TJ = 25C
TJ = 125C
10

5000
MMBT3904WT1

2000

5.0

Q, CHARGE (pC)

CAPACITANCE (pF)

VCC = 40 V
IC/IB = 10

3000

7.0

Cibo
3.0
Cobo

2.0

MMBT3904WT1

1000
700
500
QT

300
200

QA

1.0
0.1

2334

0.2 0.3

0.5 0.7 1.0

2.0 3.0

5.0 7.0 10

20 30 40

100
70
50

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

REVERSE BIAS VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 3. Capacitance

Figure 4. Charge Data

200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN MMBT3904WT1 PNP MMBT3906WT1


MMBT3904WT1
500

500
IC/IB = 10

200

100
70
50

tr @ VCC = 3.0 V

30
20

40 V

10
7
5

15 V

MMBT3904WT1
td @ VOB = 0 V
1.0

5.0 7.0 10

2.0 3.0

20

50 70 100

30

100
70
50
30
20
10
7
5

2.0 V
200

MMBT3904WT1
1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. Turn On Time

Figure 6. Rise Time

200

500

500
300
200

IC/IB = 20

ts = ts 1/8 tf
IB1 = IB2

IC/IB = 10

VCC = 40 V
IB1 = IB2

300
200
IC/IB = 20

100
70
50

t f , FALL TIME (ns)

t s , STORAGE TIME (ns)

VCC = 40 V
IC/IB = 10

300

t r, RISE TIME (ns)

TIME (ns)

300
200

IC/IB = 20
IC/IB = 10

30
20
10
7
5

2.0 3.0

IC/IB = 10

30
20
10
7
5

MMBT3904WT1
1.0

100
70
50

5.0 7.0 10

20

50 70 100

30

200

MMBT3904WT1
1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 7. Storage Time

Figure 8. Fall Time

200

TYPICAL AUDIO SMALL SIGNAL CHARACTERISTICS


NOISE FIGURE VARIATIONS
(VCE = 5.0 Vdc, TA = 25C, Bandwidth = 1.0 Hz)

SOURCE RESISTANCE = 200


IC = 1.0 mA

NF, NOISE FIGURE (dB)

10

14

f = 1.0 kHz

SOURCE RESISTANCE = 200


IC = 0.5 mA

8
6

SOURCE RESISTANCE = 1.0 k


IC = 50 A

4
2
0
0.1

SOURCE RESISTANCE = 500


IC = 100 A

0.2

0.4

1.0

2.0

IC = 1.0 mA

12
NF, NOISE FIGURE (dB)

12

IC = 0.5 mA

10

IC = 50 mA

IC = 100 mA

6
4
2

MMBT3904WT1
4.0

10

20

40

MMBT3904WT1
100

0
0.1

0.2

0.4

1.0

2.0

4.0

10

20

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (k OHMS)

Figure 9. Noise Figure

Figure 10. Noise Figure

Motorola SmallSignal Transistors, FETs and Diodes Device Data

40

100

2335

NPN MMBT3904WT1 PNP MMBT3906WT1


MMBT3904WT1
h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25C)
100
hoe, OUTPUT ADMITTANCE (m mhos)

300
MMBT3904WT1
h fe , CURRENT GAIN

200

100
70
50

MMBT3904WT1

50

20
10
5

2
1

30
0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

10

0.1

0.2

Figure 11. Current Gain

10

5.0

10

10

10

h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

h ie , INPUT IMPEDANCE (k OHMS)

5.0

Figure 12. Output Admittance

20
MMBT3904WT1

5.0

2.0
1.0
0.5

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

7.0

MMBT3904WT1

5.0
3.0
2.0

1.0
0.7
0.5

0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

Figure 13. Input Impedance

2336

5.0

10

0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

Figure 14. Voltage Feedback Ratio

Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN MMBT3904WT1 PNP MMBT3906WT1


MMBT3904WT1

h FE, DC CURRENT GAIN (NORMALIZED)

TYPICAL STATIC CHARACTERISTICS


2.0
TJ = +125C

VCE = 1.0 V

MMBT3904WT1

+25C

1.0
0.7

55C

0.5
0.3
0.2

0.1
0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

20

30

50

70

100

200

IC, COLLECTOR CURRENT (mA)

VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

Figure 15. DC Current Gain


1.0
TJ = 25C

MMBT3904WT1
0.8

IC = 1.0 mA

10 mA

30 mA

100 mA

0.6

0.4

0.2

0
0.01

0.02

0.03

0.05

0.07

0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

IB, BASE CURRENT (mA)

Figure 16. Collector Saturation Region

1.0

1.2
TJ = 25C

MMBT3904WT1

MMBT3904WT1
VBE(sat) @ IC/IB =10

0.8
VBE @ VCE =1.0 V
0.6
0.4
VCE(sat) @ IC/IB =10

qVC FOR VCE(sat)


0

55C TO +25C

0.5
55C TO +25C
1.0
+25C TO +125C

qVB FOR VBE(sat)

1.5

0.2
0

+25C TO +125C

0.5
COEFFICIENT (mV/ C)

V, VOLTAGE (VOLTS)

1.0

1.0

2.0

5.0

10

20

50

100

200

2.0

20

40

60

80

100

120

140

160

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 17. ON Voltages

Figure 18. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

180 200

2337

NPN MMBT3904WT1 PNP MMBT3906WT1


MMBT3906WT1
3V

3V
< 1 ns

+ 9.1 V
275

275

< 1 ns
10 k

10 k

0
CS < 4 pF*

+10.6 V

300 ns

10 < t1 < 500 ms


DUTY CYCLE = 2%

DUTY CYCLE = 2%

CS < 4 pF*

1N916
t1

10.9 V

* Total shunt capacitance of test jig and connectors

Figure 19. Delay and Rise Time


Equivalent Test Circuit

Figure 20. Storage and Fall Time


Equivalent Test Circuit

TYPICAL TRANSIENT CHARACTERISTICS


TJ = 25C
TJ = 125C
10

5000
MMBT3906WT1

5.0

MMBT3906WT1

VCC = 40 V
IC/IB = 10

3000
2000

QT

Cobo

Q, CHARGE (pC)

CAPACITANCE (pF)

7.0

Cibo
3.0
2.0

1000
700
500
300
200
QA
100

1.0
0.1

0.2 0.3

0.5 0.7 1.0

2.0 3.0

5.0 7.0 10

70
50

20 30 40

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

REVERSE BIAS VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 21. Capacitance

Figure 22. Charge Data

200

500

500
300
200

IC/IB = 10

MMBT3906WT1

MMBT3906WT1

300
200

VCC = 40 V
IB1 = IB2

t f , FALL TIME (ns)

IC/IB = 20

TIME (ns)

100
70
50

tr @ VCC = 3.0 V

30
20
10
7
5

15 V
40 V
2.0 V
td @ VOB = 0 V
1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

Figure 23. Turn On Time


2338

200

100
70
50
IC/IB = 10

30
20
10
7
5

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

200

IC, COLLECTOR CURRENT (mA)

Figure 24. Fall Time


Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN MMBT3904WT1 PNP MMBT3906WT1


MMBT3906WT1
TYPICAL AUDIO SMALL SIGNAL CHARACTERISTICS
NOISE FIGURE VARIATIONS
(VCE = 5.0 Vdc, TA = 25C, Bandwidth = 1.0 Hz)
SOURCE RESISTANCE = 200
IC = 1.0 mA

NF, NOISE FIGURE (dB)

4.0

12

f = 1.0 kHz

SOURCE RESISTANCE = 200


IC = 0.5 mA

3.0

SOURCE RESISTANCE = 2.0 k


IC = 50 A

2.0

SOURCE RESISTANCE = 2.0 k


IC = 100 A

1.0

0
0.1

0.2

0.4

IC = 1.0 mA

10
NF, NOISE FIGURE (dB)

5.0

IC = 0.5 mA
8.0
6.0
4.0

IC = 50 mA

2.0

IC = 100 mA

MMBT3906WT1

1.0 2.0 4.0


10
f, FREQUENCY (kHz)

20

40

MMBT3906WT1
0
0.1

100

0.2

0.4

Figure 25.

1.0 2.0
4.0
10
20
RS, SOURCE RESISTANCE (k)

40

100

Figure 26.

h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25C)
100
hoe, OUTPUT ADMITTANCE ( mhos)

300

MMBT3906WT1

hfe , CURRENT GAIN

200

100
70
50

30

70

MMBT3906WT1

50
30
20

10
7.0
5.0

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

0.1

0.2

Figure 27. Current Gain

10

10
h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

MMBT3906WT1
10
h ie , INPUT IMPEDANCE (k )

5.0 7.0

Figure 28. Output Admittance

20

7.0
5.0
3.0
2.0
1.0
0.7
0.5
0.3
0.2

0.5 0.7 1.0


2.0 3.0
0.3
IC, COLLECTOR CURRENT (mA)

0.1

0.2 0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0

10

Figure 29. Input Impedance


Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT3906WT1

7.0
5.0
3.0
2.0

1.0
0.7
0.5
0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0

10

Figure 30. Voltage Feedback Ratio


2339

NPN MMBT3904WT1 PNP MMBT3906WT1


MMBT3906WT1
STATIC CHARACTERISTICS
h FE, DC CURRENT GAIN (NORMALIZED)

2.0
TJ = +125C

VCE = 1.0 V

+25C

1.0
0.7

55C

0.5
0.3
MMBT3906WT1
0.2

0.1
0.1

0.2

0.3

0.5

0.7

1.0

2.0
3.0
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

20

30

50

70

100

200

VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

Figure 31. DC Current Gain

1.0
TJ = 25C

MMBT3906WT1
0.8
IC = 1.0 mA

10 mA

30 mA

100 mA

0.6

0.4

0.2

0
0.01

0.02

0.03

0.05

0.07

0.1

0.2
0.3
0.5
IB, BASE CURRENT (mA)

0.7

1.0

2.0

3.0

5.0

7.0

10

1.0
VBE(sat) @ IC/IB = 10

TJ = 25C

V, VOLTAGE (VOLTS)

0.8

VBE @ VCE = 1.0 V

0.6
MMBT3906WT1
0.4

0.2

VCE(sat) @ IC/IB = 10

0
1.0

2.0

50
5.0 10
20
IC, COLLECTOR CURRENT (mA)

Figure 33. ON Voltages

2340

100

200

V, TEMPERATURE COEFFICIENTS (mV/C)

Figure 32. Collector Saturation Region

1.0
0.5

qVC FOR VCE(sat)

+25C TO +125C
55C TO +25C

0
0.5

MMBT3906WT1
+25C TO +125C

1.0

qVS FOR VBE(sat)

55C TO +25C

1.5
2.0

20

40

60
80 100 120 140 160
IC, COLLECTOR CURRENT (mA)

180 200

Figure 34. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistor


PNP Silicon

MMBT3906LT1

COLLECTOR
3

Motorola Preferred Device

1
BASE
2
EMITTER

MAXIMUM RATINGS

3
1

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

200

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT3906LT1 = 2A

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

40

40

5.0

50

50

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(3)
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

Base Cutoff Current


(VCE = 30 Vdc, VEB = 3.0 Vdc)

IBL

Collector Cutoff Current


(VCE = 30 Vdc, VEB = 3.0 Vdc)

ICEX

Vdc
Vdc
Vdc
nAdc
nAdc


 

1. FR 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
3. Pulse Width 300 s, Duty Cycle 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2341

MMBT3906LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

60
80
100
60
30

300

0.25
0.4

0.65

0.85
0.95

250

4.5

10

2.0

12

0.1

10

100

400

3.0

60

4.0

Unit

ON CHARACTERISTICS(3)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)

HFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hie

Voltage Feedback Ratio


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hre

Small Signal Current Gain


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hfe

Output Admittance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hoe

Noise Figure
(IC = 100 mAdc, VCE = 5.0 Vdc, RS = 1.0 k, f = 1.0 kHz)

NF

MHz
pF
pF
k
X 10 4

mmhos
dB

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
3. Pulse Test: Pulse Width

((VCC = 3.0 Vdc, VBE = 0.5 Vdc,


IC = 10 mAdc, IB1 = 1.0 mAdc)

td

35

tr

35

((VCC = 3.0 Vdc, IC = 10 mAdc,


IB1 = IB2 = 1.0 mAdc)

ts

225

tf

75

v 300 ms, Duty Cycle v 2.0%.

ns

ns

3V

3V
< 1 ns

+9.1 V
275

275

< 1 ns
+0.5 V

10 k

10 k
0
CS < 4 pF*

10.6 V

1N916
10 < t1 < 500 ms

300 ns
DUTY CYCLE = 2%

DUTY CYCLE = 2%

t1

CS < 4 pF*

10.9 V

* Total shunt capacitance of test jig and connectors

Figure 1. Delay and Rise Time


Equivalent Test Circuit

2342

Figure 2. Storage and Fall Time


Equivalent Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT3906LT1
TYPICAL TRANSIENT CHARACTERISTICS

10

5000

7.0

3000
2000
Cobo

5.0

Q, CHARGE (pC)

CAPACITANCE (pF)

TJ = 25C
TJ = 125C

Cibo
3.0
2.0

VCC = 40 V
IC/IB = 10

1000
700
500
300
200

QT
QA

1.0
0.1

0.2 0.3

0.5 0.7 1.0


2.0 3.0 5.0 7.0 10
REVERSE BIAS (VOLTS)

100
70
50

20 30 40

1.0

2.0 3.0

Figure 3. Capacitance

5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)

200

Figure 4. Charge Data

500

500
IC/IB = 10

300
200

VCC = 40 V
IB1 = IB2

300
200

tr @ VCC = 3.0 V
15 V

30
20

t f , FALL TIME (ns)

TIME (ns)

IC/IB = 20
100
70
50

100
70
50
30
20

IC/IB = 10

40 V
10
7
5

2.0 V
td @ VOB = 0 V
1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

200

10
7
5

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. Turn On Time

Figure 6. Fall Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

200

2343

MMBT3906LT1
TYPICAL AUDIO SMALL SIGNAL CHARACTERISTICS
NOISE FIGURE VARIATIONS
(VCE = 5.0 Vdc, TA = 25C, Bandwidth = 1.0 Hz)

NF, NOISE FIGURE (dB)

SOURCE RESISTANCE = 200


IC = 1.0 mA

12

f = 1.0 kHz

4.0
SOURCE RESISTANCE = 200
IC = 0.5 mA
3.0

SOURCE RESISTANCE = 2.0 k


IC = 50 A

2.0
SOURCE RESISTANCE = 2.0 k
IC = 100 A

1.0

0
0.1

0.2

0.4

IC = 1.0 mA

10
NF, NOISE FIGURE (dB)

5.0

IC = 0.5 mA
8
6
IC = 50 mA

IC = 100 mA

1.0 2.0 4.0


10
f, FREQUENCY (kHz)

20

40

100

0.1

0.2

0.4
1.0 2.0
4.0
10
20
Rg, SOURCE RESISTANCE (k OHMS)

Figure 7.

40

100

Figure 8.

h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25C)
100

hoe, OUTPUT ADMITTANCE ( mhos)

h fe , DC CURRENT GAIN

300

200

100
70
50

70
50
30
20

10
7

30

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

0.1

0.2

Figure 9. Current Gain


h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

h ie , INPUT IMPEDANCE (k OHMS)

10
7.0
5.0
3.0
2.0
1.0
0.7
0.5

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

Figure 11. Input Impedance

2344

5.0 7.0 10

Figure 10. Output Admittance

20

0.3
0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

10
7.0
5.0
3.0
2.0

1.0
0.7
0.5

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

Figure 12. Voltage Feedback Ratio

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT3906LT1

h FE, DC CURRENT GAIN (NORMALIZED)

TYPICAL STATIC CHARACTERISTICS


2.0
TJ = +125C

VCE = 1.0 V

+25C

1.0
0.7

55C

0.5
0.3
0.2

0.1
0.1

0.2

0.3

0.5

0.7

1.0

2.0
3.0
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

20

30

70

50

100

200

VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

Figure 13. DC Current Gain


1.0
TJ = 25C
0.8

IC = 1.0 mA

10 mA

30 mA

100 mA

0.6

0.4

0.2

0
0.01

0.02

0.03

0.05

0.07

0.1

0.2
0.3
0.5
IB, BASE CURRENT (mA)

0.7

1.0

2.0

3.0

5.0

7.0

10

Figure 14. Collector Saturation Region

TJ = 25C

V, VOLTAGE (VOLTS)

0.8

q V , TEMPERATURE COEFFICIENTS (mV/ C)

1.0
VBE(sat) @ IC/IB = 10
VBE @ VCE = 1.0 V

0.6

0.4
VCE(sat) @ IC/IB = 10

0.2

1.0

2.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

100

200

Figure 15. ON Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0
0.5

qVC FOR VCE(sat)

+25C TO +125C

55C TO +25C

0.5
+25C TO +125C
1.0
55C TO +25C

qVB FOR VBE(sat)

1.5
2.0

20

40

60
80 100 120 140
IC, COLLECTOR CURRENT (mA)

160

180 200

Figure 16. Temperature Coefficients

2345

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Transistor

MMBT4401LT1

NPN Silicon

COLLECTOR
3

Motorola Preferred Device

1
BASE
3

2
EMITTER

MAXIMUM RATINGS

1
2

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

IC

600

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT4401LT1 = 2X

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

40

60

6.0

0.1

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(3)
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 0.1 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 0.1 mAdc, IC = 0)

V(BR)EBO

Base Cutoff Current


(VCE = 35 Vdc, VEB = 0.4 Vdc)

IBEV

Collector Cutoff Current


(VCE = 35 Vdc, VEB = 0.4 Vdc)

ICEX


 

Vdc
Vdc
Vdc
Adc
Adc

1. FR 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

2346

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT4401LT1
ELECTRICAL CHARACTERISTICS (continued) (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Max

20
40
80
100
40

300

0.4
0.75

0.75

0.95
1.2

250

6.5

30

1.0

15

0.1

8.0

40

500

1.0

30

Unit

ON CHARACTERISTICS(3)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 150 mAdc, VCE = 1.0 Vdc)
(IC = 500 mAdc, VCE = 2.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 20 mAdc, VCE = 10 Vdc, f = 100 MHz)

fT

CollectorBase Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Ccb

EmitterBase Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Ceb

Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hie

Voltage Feedback Ratio


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hre

Small Signal Current Gain


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hfe

Output Admittance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hoe

MHz
pF
pF
k
X 10 4

mmhos

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
3. Pulse Test: Pulse Width

((VCC = 30 Vdc, VEB = 2.0 Vdc,


IC = 150 mAdc, IB1 = 15 mAdc)

td

15

tr

20

((VCC = 30 Vdc, IC = 150 mAdc,


IB1 = IB2 = 15 mAdc)

ts

225

tf

30

v 300 ms, Duty Cycle v 2.0%.

ns

ns

SWITCHING TIME EQUIVALENT TEST CIRCUITS


+ 30 V

+ 30 V
+16 V
0
2.0 V

1.0 to 100 s,
DUTY CYCLE 2.0%

200

+16 V

1.0 to 100 s,
DUTY CYCLE 2.0%

200

0
1.0 k
< 2.0 ns

CS* < 10 pF

1.0 k

14 V
< 20 ns

CS* < 10 pF

4.0 V
Scope rise time < 4.0 ns
*Total shunt capacitance of test jig connectors, and oscilloscope

Figure 1. TurnOn Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 2. TurnOff Time

2347

MMBT4401LT1
TRANSIENT CHARACTERISTICS
25C

100C

30

10
7.0
5.0

10
7.0
5.0

QT

2.0
1.0
0.7
0.5
0.3
0.2

Ccb
3.0
2.0
0.1

VCC = 30 V
IC/IB = 10

3.0

Cobo

Q, CHARGE (nC)

CAPACITANCE (pF)

20

QA

0.1
0.2 0.3 0.5

2.0 3.0 5.0


10
1.0
REVERSE VOLTAGE (VOLTS)

20 30

50

10

200
50 70 100
30
IC, COLLECTOR CURRENT (mA)

20

Figure 3. Capacitances

100
IC/IB = 10

70

VCC = 30 V
IC/IB = 10

70
tr
50

50
tr @ VCC = 30 V
tr @ VCC = 10 V
td @ VEB = 2.0 V
td @ VEB = 0

30
20

t, TIME (ns)

t, TIME (ns)

500

Figure 4. Charge Data

100

30

tf

20

10

10

7.0

7.0
5.0

5.0
10

20

30

50

70

200

100

300

500

10

20

30

50

70

100

200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. TurnOn Time

Figure 6. Rise and Fall Times

300

300

500

100
ts = ts 1/8 tf
IB1 = IB2
IC/IB = 10 to 20

VCC = 30 V
IB1 = IB2

70
50
t f , FALL TIME (ns)

200
t s, STORAGE TIME (ns)

300

100
70

IC/IB = 20

30
20

IC/IB = 10

10

50

7.0
30

5.0
10

2348

20

30

50

70

100

200

300

500

10

20

30

50

70

100

200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 7. Storage Time

Figure 8. Fall Time

300

500

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT4401LT1
SMALLSIGNAL CHARACTERISTICS
NOISE FIGURE
VCE = 10 Vdc, TA = 25C
Bandwidth = 1.0 Hz
10

10
IC = 1.0 mA, RS = 150
IC = 500 A, RS = 200
IC = 100 A, RS = 2.0 k
IC = 50 A, RS = 4.0 k

8.0
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

8.0

f = 1.0 kHz
RS = OPTIMUM
RS = SOURCE
RS = RESISTANCE

6.0

4.0

2.0

IC = 50 A
IC = 100 A
IC = 500 A
IC = 1.0 mA

6.0

4.0

2.0

0
0.01 0.02 0.05 0.1 0.2

0
0.5 1.0 2.0 5.0

10

20

50

100

50

100 200

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (OHMS)

Figure 9. Frequency Effects

Figure 10. Source Resistance Effects

h PARAMETERS
VCE = 10 Vdc, f = 1.0 kHz, TA = 25C
selected from the MMBT4401LT1 lines, and the same units
This group of graphs illustrates the relationship between
were used to develop the correspondingly numbered curves
hfe and other h parameters for this series of transistors. To
on each graph.
obtain these curves, a highgain and a lowgain unit were
50 k

hfe , CURRENT GAIN

200

100
MMBT4401LT1 UNIT 1
MMBT4401LT1 UNIT 2

70
50
30
20
0.1

0.2

0.3

0.5 0.7 1.0

2.0

3.0

hie , INPUT IMPEDANCE (OHMS)

300

2.0 k
1.0 k

0.1

0.2

0.3

0.5 0.7

1.0

2.0

3.0

IC, COLLECTOR CURRENT (mA)

Figure 11. Current Gain

Figure 12. Input Impedance

5.0 7.0 10

100

MMBT4401LT1 UNIT 1
MMBT4401LT1 UNIT 2

3.0
2.0
1.0
0.7
0.5
0.3
0.2

0.3

0.5 0.7 1.0

2.0

3.0

hoe, OUTPUT ADMITTANCE (m mhos)

10
h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

5.0 k

IC, COLLECTOR CURRENT (mA)

7.0
5.0

0.2
0.1

10 k

500

5.0 7.0 10

MMBT4401LT1 UNIT 1
MMBT4401LT1 UNIT 2

20 k

5.0 7.0 10

50

20
10
MMBT4401LT1 UNIT 1
MMBT4401LT1 UNIT 2

5.0
2.0
1.0
0.1

0.2

0.3

0.5 0.7 1.0

2.0 3.0

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 13. Voltage Feedback Ratio

Figure 14. Output Admittance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5.0 7.0 10

2349

MMBT4401LT1
STATIC CHARACTERISTICS

h FE, NORMALIZED CURRENT GAIN

3.0
VCE = 1.0 V
VCE = 10 V

2.0

TJ = 125C
1.0
25C
0.7
0.5

55C

0.3
0.2
0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mA)

30

50

70

100

200

300

500

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 15. DC Current Gain

1.0
TJ = 25C

0.8

0.6

IC = 1.0 mA

10 mA

100 mA

500 mA

0.4

0.2

0
0.01

0.02 0.03

0.2

0.05 0.07 0.1

0.3

0.5 0.7 1.0


IB, BASE CURRENT (mA)

2.0

3.0

5.0 7.0

10

20

30

50

Figure 16. Collector Saturation Region

1.0

+ 0.5
TJ = 25C
VBE(sat) @ IC/IB = 10

0.6

VBE @ VCE = 10 V

0.4

0.2

VCE(sat) @ IC/IB = 10

0.5

50
1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

Figure 17. On Voltages

2350

0.5
1.0
1.5

qVB for VBE

2.0

0
0.1 0.2

qVC for VCE(sat)

0
COEFFICIENT (mV/ C)

VOLTAGE (VOLTS)

0.8

100 200

500

2.5
0.1 0.2

0.5

50
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

100 200

500

Figure 18. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Transistor

MMBT4403LT1

COLLECTOR
3

PNP Silicon

Motorola Preferred Device

1
BASE
2
EMITTER

MAXIMUM RATINGS

3
1

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

600

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT4403LT1 = 2T

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

40

40

5.0

0.1

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(3)
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 0.1 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 0.1 mAdc, IC = 0)

V(BR)EBO

Base Cutoff Current


(VCE = 35 Vdc, VEB = 0.4 Vdc)

IBEV

Collector Cutoff Current


(VCE = 35 Vdc, VEB = 0.4 Vdc)

ICEX


 

Vdc
Vdc
Vdc
Adc
Adc

1. FR 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width
300 ms, Duty Cycle
2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2351

MMBT4403LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

30
60
100
100
20

300

0.4
0.75

0.75

0.95
1.3

200

8.5

30

1.5

15

0.1

8.0

60

500

1.0

100

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 150 mAdc, VCE = 2.0 Vdc)(3)
(IC = 500 mAdc, VCE = 2.0 Vdc)(3)

hFE

Collector Emitter Saturation Voltage(3)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

Base Emitter Saturation Voltage (3)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 20 mAdc, VCE = 10 Vdc, f = 100 MHz)

fT

CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Ccb

EmitterBase Capacitance
(VBE = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Ceb

Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hie

Voltage Feedback Ratio


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hre

Small Signal Current Gain


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hfe

Output Admittance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hoe

MHz
pF
pF
k
X 10 4

mmhos

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
3. Pulse Test: Pulse Width

((VCC = 30 Vdc, VEB = 2.0 Vdc,


IC = 150 mAdc, IB1 = 15 mAdc)

td

15

tr

20

((VCC = 30 Vdc, IC = 150 mAdc,


IB1 = IB2 = 15 mAdc)

ts

225

tf

30

v 300 ms, Duty Cycle v 2.0%.

ns

ns

SWITCHING TIME EQUIVALENT TEST CIRCUIT


30 V

30 V
200

< 2 ns
+2 V

+14 V
0

0
1.0 k
16 V

10 to 100 s,
DUTY CYCLE = 2%

Figure 1. TurnOn Time

2352

200

< 20 ns

CS* < 10 pF

1.0 k

CS* < 10 pF

16 V

1.0 to 100 s,
DUTY CYCLE = 2%
+ 4.0 V
Scope rise time < 4.0 ns
*Total shunt capacitance of test jig connectors, and oscilloscope

Figure 2. TurnOff Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT4403LT1
TRANSIENT CHARACTERISTICS
25C

100C

30

10
7.0
5.0

VCC = 30 V
IC/IB = 10

Ceb
3.0
Q, CHARGE (nC)

CAPACITANCE (pF)

20

10
7.0
Ccb

5.0

2.0
1.0
0.7
0.5

QT

0.3

QA

0.2
2.0
0.1

0.1
0.2 0.3

20

2.0 3.0 5.0 7.0 10


0.5 0.7 1.0
REVERSE VOLTAGE (VOLTS)

30

10

20

Figure 3. Capacitances

300

500

Figure 4. Charge Data

100

100
IC/IB = 10

70

70

VCC = 30 V
IC/IB = 10

50

50
tr @ VCC = 30 V
tr @ VCC = 10 V
td @ VBE(off) = 2 V
td @ VBE(off) = 0

30
20

t r , RISE TIME (ns)

t, TIME (ns)

200
30
50 70 100
IC, COLLECTOR CURRENT (mA)

30
20

10

10

7.0

7.0
5.0

5.0
10

20

30

50

70

200

100

300

500

10

20

30

50

70

100

200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. TurnOn Time

Figure 6. Rise Time

300

500

200

t s, STORAGE TIME (ns)

IC/IB = 10
100
IC/IB = 20

70
50
IB1 = IB2
ts = ts 1/8 tf
30
20

10

20

30

50

70

100

200

300

500

IC, COLLECTOR CURRENT (mA)

Figure 7. Storage Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2353

MMBT4403LT1
SMALLSIGNAL CHARACTERISTICS
NOISE FIGURE
VCE = 10 Vdc, TA = 25C
Bandwidth = 1.0 Hz
10

10

f = 1 kHz
8
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

8
IC = 1.0 mA, RS = 430
IC = 500 A, RS = 560
IC = 50 A, RS = 2.7 k
IC = 100 A, RS = 1.6 k

RS = OPTIMUM SOURCE RESISTANCE

0
0.01 0.02 0.05 0.1 0.2

IC = 50 A
100 A
500 A
1.0 mA

0
0.5 1.0 2.0 5.0

10

20

50

100

50

100

200

500

1k

2k

5k

10 k 20 k

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (OHMS)

Figure 8. Frequency Effects

Figure 9. Source Resistance Effects

50 k

h PARAMETERS
VCE = 10 Vdc, f = 1.0 kHz, TA = 25C
selected from the MMBT4403LT1 lines, and the same units
This group of graphs illustrates the relationship between
were used to develop the correspondinglynumbered curves
hfe and other h parameters for this series of transistors. To
on each graph.
obtain these curves, a highgain and a lowgain unit were
100 k

700

50 k

hfe , CURRENT GAIN

500
300
200
MMBT4403LT1 UNIT 1
MMBT4403LT1 UNIT 2

100
70
50

hie , INPUT IMPEDANCE (OHMS)

1000

MMBT4403LT1 UNIT 1
MMBT4403LT1 UNIT 2

20 k
10 k
5k
2k
1k
500
200

30
0.1

0.2

0.3

0.5 0.7 1.0

2.0

3.0

100

5.0 7.0 10

0.5 0.7 1.0

2.0

3.0

Figure 11. Input Impedance

5.0 7.0

10

500
MMBT4403LT1 UNIT 1
MMBT4403LT1 UNIT 2

5.0
2.0
1.0
0.5
0.2
0.2

0.3

0.5 0.7 1.0

2.0

3.0

5.0 7.0 10

hoe, OUTPUT ADMITTANCE (m mhos)

h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

0.3

Figure 10. Current Gain

10

2354

0.2

IC, COLLECTOR CURRENT (mAdc)

20

0.1
0.1

0.1

IC, COLLECTOR CURRENT (mAdc)

100
50
20
MMBT4403LT1 UNIT 1
MMBT4403LT1 UNIT 2

10
5.0
2.0
1.0
0.1

0.2

0.3

0.5 0.7 1.0

2.0

3.0

IC, COLLECTOR CURRENT (mAdc)

IC, COLLECTOR CURRENT (mAdc)

Figure 12. Voltage Feedback Ratio

Figure 13. Output Admittance

5.0 7.0 10

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT4403LT1
STATIC CHARACTERISTICS

h FE, NORMALIZED CURRENT GAIN

3.0
VCE = 1.0 V
VCE = 10 V

2.0

TJ = 125C
25C

1.0
55C

0.7
0.5
0.3
0.2
0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mA)

30

70

50

100

200

300

500

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 14. DC Current Gain

1.0
0.8

0.6
IC = 1.0 mA

10 mA

100 mA

500 mA

0.4

0.2

0
0.005

0.01

0.02

0.03

0.05 0.07 0.1

0.2

0.3
0.5 0.7 1.0
IB, BASE CURRENT (mA)

2.0

3.0

5.0

7.0

10

20

30

50

Figure 15. Collector Saturation Region

0.5

TJ = 25C

0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(sat) @ VCE = 10 V

COEFFICIENT (mV/ C)

VOLTAGE (VOLTS)

1.0

0.4

0.2

qVC for VCE(sat)

0.5
1.0
1.5

qVS for VBE

2.0
VCE(sat) @ IC/IB = 10

0
0.1 0.2

0.5

50 100 200
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

500

Figure 16. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2.5
0.1 0.2

0.5

50 100 200
1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

500

Figure 17. Temperature Coefficients

2355

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Low Noise Transistor

MMBT5087LT1

PNP Silicon

Motorola Preferred Device

COLLECTOR
3
1
BASE

2
EMITTER

1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

50

Vdc

CollectorBase Voltage

VCBO

50

Vdc

EmitterBase Voltage

VEBO

3.0

Vdc

IC

50

mAdc

Collector Current Continuous

DEVICE MARKING
MMBT5087LT1 = 2Q

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR-5 Board (1)
TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate, (2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

Symbol

Max

Unit

PD

225

mW

1.8

mW/C

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

50

Vdc

CollectorBase Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

50

Vdc

10
50

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 10 Vdc, IE = 0)
(VCB = 35 Vdc, IE = 0)

ICBO

nAdc

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina

Preferred devices are Motorola recommended choices for future use and best overall value.

2356

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT5087LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

250
250
250

800

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 Adc, VCE = 5.0 Vdc)
(IC = 1.0 mAdc, VCE = 5.0 Vdc)
(IC = 10 mAdc, VCE = 5.0 Vdc)

hFE

CollectorEmitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.3

Vdc

BaseEmitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

0.85

Vdc

fT

40

MHz

Cobo

4.0

pF

SmallSignal Current Gain


(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

hfe

250

900

Noise Figure
(IC = 20 mAdc, VCE = 5.0 Vdc, RS = 10 k, f = 1.0 kHz)
(IC = 100 Adc, VCE = 5.0 Vdc, RS = 3.0 k, f = 1.0 kHz)

NF

2.0
2.0

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 500 Adc, VCE = 5.0 Vdc, f = 20 MHz)
Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

dB

2357

MMBT5087LT1
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
10
7.0
IC = 10 A

5.0

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

1.0
7.0
5.0

BANDWIDTH = 1.0 Hz
RS 0

30 A
3.0

100 A
300 A

1.0 mA

2.0

BANDWIDTH = 1.0 Hz
RS
IC = 1.0 mA

3.0
2.0

300 A

1.0
0.7
0.5

100 A
30 A

0.3
0.2

1.0

10 A

0.1
10

20

50

100 200
500 1.0 k
f, FREQUENCY (Hz)

2.0 k

5.0 k

10

10 k

20

50

Figure 1. Noise Voltage

100 200
500 1.0 k 2.0 k
f, FREQUENCY (Hz)

5.0 k

10 k

Figure 2. Noise Current

NOISE FIGURE CONTOURS

1.0 M
500 k

BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

(VCE = 5.0 Vdc, TA = 25C)

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100
20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100

5.0 dB
10

1.0 M
500 k

500 700 1.0 k

5.0 dB
10

20

RS , SOURCE RESISTANCE (OHMS)

Figure 3. Narrow Band, 100 Hz

1.0 M
500 k

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700 1.0 k

Figure 4. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is Defined as:

20 k
10 k

NF
0.5 dB
1.0 dB
2.0 dB
3.0 dB
5.0 dB

200
100
10

20

30

50 70 100

200 300

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

5.0 k
2.0 k
1.0 k
500

+ 20 log10

500 700 1.0 k

IC, COLLECTOR CURRENT (A)

Figure 5. Wideband
2358

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT5087LT1

1.0

100
TA = 25C
IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

TYPICAL STATIC CHARACTERISTICS

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%
300 A

150 A
40

100 A
50 A

20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
0.8
VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.5 1.0
2.0
5.0
10
20
IC, COLLECTOR CURRENT (mA)

40

Figure 7. Collector Characteristics

1.4

0.2

250 A
200 A

60

Figure 6. Collector Saturation Region

0.1

IB = 400 A
350 A

50

100

Figure 8. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6
*APPLIES for IC/IB hFE/2
0.8
*qVC for VCE(sat)

25C to 125C

0
55C to 25C
0.8
25C to 125C
1.6

2.4
0.1

qVB for VBE


0.2

55C to 25C

0.5
1.0 2.0
5.0
10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 9. Temperature Coefficients

2359

MMBT5087LT1
TYPICAL DYNAMIC CHARACTERISTICS
500
300
200

200

100
70
50
30
tr

20

100
70
50

10
7.0
5.0
1.0

tf

30

td @ VBE(off) = 0.5 V

20

2.0

3.0

50 70

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 11. TurnOff Time

500

10
TJ = 25C

TJ = 25C

7.0
VCE = 20 V

300

Cib
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 10. TurnOn Time

5.0 V
200

100

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

ts

300
t, TIME (ns)

t, TIME (ns)

1000
700
500

VCC = 3.0 V
IC/IB = 10
TJ = 25C

5.0

3.0
2.0

Cob

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

50

1.0
0.05

0.1

0.2

0.5

1.0

2.0

5.0

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 12. CurrentGain Bandwidth Product

Figure 13. Capacitance

1.0
0.7
0.5

10

20

50

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 16

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

1.0

t2
2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 14. Thermal Response

2360

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT5087LT1
104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 V

101

A train of periodical power pulses can be represented by the model


as shown in Figure 16. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 14 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 14 by the
steady state value RJA.
Example:
Dissipating 2.0 watts peak under the following conditions:
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
Using Figure 14 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.

102

The peak rise in junction temperature is therefore


T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.

103
ICEO

102
101

ICBO
AND
ICEX @ VBE(off) = 3.0 V

100

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

For more information, see AN569.

Figure 15. Typical Collector Leakage Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2361

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Low Noise Transistors

MMBT5088LT1
MMBT5089LT1*

COLLECTOR
3

NPN Silicon

*Motorola Preferred Device

1
BASE
2
EMITTER

MAXIMUM RATINGS

3
1

Rating

Symbol

5088LT1

5089LT1

Unit

Collector Emitter Voltage

VCEO

30

25

Vdc

Collector Base Voltage

VCBO

35

30

Vdc

Emitter Base Voltage

VEBO

4.5

Vdc

IC

50

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT5088LT1 = 1Q; MMBT5089LT1 = 1R

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

30
25

35
30

50
50

50
100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
MMBT5088
MMBT5089
V(BR)CBO
MMBT5088
MMBT5089

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)
(VCB = 15 Vdc, IE = 0)

MMBT5088
MMBT5089

Emitter Cutoff Current


(VEB(off) = 3.0 Vdc, IC = 0)
(VEB(off) = 4.5 Vdc, IC = 0)

MMBT5088
MMBT5089

 0.062 in.
  0.024 in. 99.5% alumina.

Vdc

Vdc

ICBO

nAdc

IEBO

nAdc

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

2362

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT5088LT1 MMBT5089LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

MMBT5088
MMBT5089

300
400

900
1200

(IC = 1.0 mAdc, VCE = 5.0 Vdc)

MMBT5088
MMBT5089

350
450

(IC = 10 mAdc, VCE = 5.0 Vdc)

MMBT5088
MMBT5089

300
400

0.5

0.8

50

4.0

10

350
450

1400
1800

3.0
2.0

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 Adc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 500 Adc, VCE = 5.0 Vdc, f = 20 MHz)

fT

CollectorBase Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz emitter guarded)

Ccb

EmitterBase Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz collector guarded)

Ceb

Small Signal Current Gain


(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

MHz
pF
pF

hfe
MMBT5088
MMBT5089

Noise Figure
(IC = 100 mAdc, VCE = 5.0 Vdc, RS = 10 k, f = 1.0 kHz)

RS

NF
MMBT5088
MMBT5089

dB

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2363

MMBT5088LT1 MMBT5089LT1
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
NOISE VOLTAGE
30

30
BANDWIDTH = 1.0 Hz

BANDWIDTH = 1.0 Hz
20

RS 0

IC = 10 mA

en , NOISE VOLTAGE (nV)

en , NOISE VOLTAGE (nV)

20

3.0 mA

10

1.0 mA

7.0
5.0

RS 0
f = 10 Hz
10

100 Hz

7.0
10 kHz

1.0 kHz

5.0

300 A
3.0
10

20

50 100 200

3.0
0.01 0.02

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

Figure 2. Effects of Frequency

IC = 10 mA
3.0 mA
1.0 mA
300 A
100 A

0.3
0.2
RS 0

0.1
10

20

10 A
50 100 200

10

16

3.0

1.0
0.7
0.5

5.0

20

BANDWIDTH = 1.0 Hz

2.0

0.05 0.1 0.2


0.5 1.0
2.0
IC, COLLECTOR CURRENT (mA)

Figure 3. Effects of Collector Current

NF, NOISE FIGURE (dB)

In, NOISE CURRENT (pA)

10
7.0
5.0

100 kHz

BANDWIDTH = 10 Hz to 15.7 kHz


12
500 A

8.0

IC = 1.0 mA

100 A
10 A

4.0

30 A
0
10

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

20

Figure 4. Noise Current

50 100 200 500 1 k 2 k


5 k 10 k 20 k 50 k 100 k
RS, SOURCE RESISTANCE (OHMS)

Figure 5. Wideband Noise Figure


100 Hz NOISE DATA
20

BANDWIDTH = 1.0 Hz

IC = 10 mA
16

100 A

100
70
50

3.0 mA
1.0 mA

30

300 A

20
10
7.0
5.0

30 A
10 A

NF, NOISE FIGURE (dB)

VT, TOTAL NOISE VOLTAGE (nV)

300
200

IC = 10 mA

3.0 mA
1.0 mA

12

300 A
8.0
100 A
30 A

4.0

10 A

BANDWIDTH = 1.0 Hz
0

3.0
10

20

50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k


RS, SOURCE RESISTANCE (OHMS)

Figure 6. Total Noise Voltage

2364

10

20

50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k


RS, SOURCE RESISTANCE (OHMS)

Figure 7. Noise Figure

Motorola SmallSignal Transistors, FETs and Diodes Device Data

h FE, DC CURRENT GAIN (NORMALIZED)

MMBT5088LT1 MMBT5089LT1
4.0
3.0
VCE = 5.0 V
2.0

TA = 125C
25C

1.0
55C

0.7
0.5
0.4
0.3
0.2
0.01

0.02

0.03

0.05

0.1

0.2
0.3
0.5
IC, COLLECTOR CURRENT (mA)

1.0

2.0

3.0

5.0

10

Figure 8. DC Current Gain

0.4
RVBE, BASEEMITTER
TEMPERATURE COEFFICIENT (mV/ C)

1.0
TJ = 25C
V, VOLTAGE (VOLTS)

0.8

0.6

VBE @ VCE = 5.0 V

0.4

0.2

0.8

1.2

TJ = 25C to 125C

1.6

2.0
55C to 25C

VCE(sat) @ IC/IB = 10
0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

2.4
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10
IC, COLLECTOR CURRENT (mA)

100

8.0

C, CAPACITANCE (pF)

6.0

TJ = 25C
Cob

4.0
3.0

Ceb

Cib

Ccb

2.0

1.0
0.8
0.1

0.2

1.0
2.0
5.0
0.5
10
20
VR, REVERSE VOLTAGE (VOLTS)

50 100

Figure 10. Temperature Coefficients

50

100

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 9. On Voltages

20

Figure 11. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

500

300
200

100
VCE = 5.0 V
TJ = 25C

70
50
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 12. CurrentGain Bandwidth Product

2365

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistor

MMBT5401LT1

COLLECTOR
3

PNP Silicon

Motorola Preferred Device

1
BASE
2
EMITTER

3
1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

150

Vdc

Collector Base Voltage

VCBO

160

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT5401LT1 = 2L

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

150

160

5.0

50
50

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 120 Vdc, IE = 0)
(VCB = 120 Vdc, IE = 0, TA = 100C)

Vdc
Vdc
Vdc

ICES

 0.062 in.
  0.024 in. 99.5% alumina.

nAdc
Adc

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

2366

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT5401LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

50
60
50

240

0.2
0.5

1.0
1.0

100

300

6.0

40

200

8.0

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 5.0 Vdc)
(IC = 10 mAdc, VCE = 5.0 Vdc)
(IC = 50 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

fT
Cobo

Small Signal Current Gain


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hfe

Noise Figure
(IC = 200 Adc, VCE = 5.0 Vdc, RS = 10 , f = 1.0 kHz)

NF

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MHz
pF

dB

2367

MMBT5401LT1
200
150
h FE, CURRENT GAIN

TJ = 125C
100
25C

70
50

55C
VCE = 1.0 V
VCE = 5.0 V

30
20
0.1

0.2

0.3

0.5

1.0

2.0
3.0
5.0
IC, COLLECTOR CURRENT (mA)

10

20

30

50

100

10

20

50

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

1.0
0.9
0.8
0.7
0.6
IC = 1.0 mA

0.5

10 mA

30 mA

100 mA

0.4
0.3
0.2
0.1
0
0.005

0.01

0.02

0.05

0.1

0.2

0.5
1.0
IB, BASE CURRENT (mA)

2.0

5.0

Figure 2. Collector Saturation Region

IC, COLLECTOR CURRENT ( A)

103
102

VCE = 30 V
IC = ICES

101
TJ = 125C
100
75C
101
102

REVERSE
25C

103
0.3

0.2

FORWARD

0.1
0
0.1
0.2 0.3 0.4 0.5
VBE, BASEEMITTER VOLTAGE (VOLTS)

0.6

0.7

Figure 3. Collector CutOff Region

2368

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT5401LT1
1.0

V, TEMPERATURE COEFFICIENT (mV/ C)

TJ = 25C

0.9
V, VOLTAGE (VOLTS)

0.8
0.7
VBE(sat) @ IC/IB = 10

0.6
0.5
0.4
0.3
0.2

VCE(sat) @ IC/IB = 10

0.1
0
0.1

0.2 0.3 0.5

1.0 2.0 3.0 5.0


10
20 30
IC, COLLECTOR CURRENT (mA)

50

2.5
1.5
1.0
0.5

VC for VCE(sat)

0
0.5
1.0
1.5

VB for VBE(sat)

2.0
2.5
0.1

100

TJ = 55C to 135C

2.0

0.2 0.3 0.5 1.0 2.0 3.0 5.0


10
20 30
IC, COLLECTOR CURRENT (mA)

Figure 4. On Voltages

10.2 V

10 s
INPUT PULSE
tr, tf 10 ns
DUTY CYCLE = 1.0%

0.25 F

3.0 k

RC
Vout

RB
5.1 k

Vin

100

C, CAPACITANCE (pF)

100
70
50

VCC
30 V

100

TJ = 25C

30
Cibo

20
10
7.0
5.0

Cobo

3.0

1N914

2.0
1.0
0.2

Values Shown are for IC @ 10 mA

0.3

2.0 3.0
5.0 7.0
0.5 0.7 1.0
VR, REVERSE VOLTAGE (VOLTS)

Figure 6. Switching Time Test Circuit

1000
700
500

10

20

Figure 7. Capacitances

2000
IC/IB = 10
TJ = 25C

tr @ VCC = 120 V

300

1000
700
500

tr @ VCC = 30 V

200

t, TIME (ns)

t, TIME (ns)

100

Figure 5. Temperature Coefficients

VBB
+ 8.8 V
Vin

50

100
70
50

10
0.2 0.3 0.5

td @ VBE(off) = 1.0 V
VCC = 120 V
1.0

2.0 3.0 5.0

10

20 30

50

tf @ VCC = 120 V

tf @ VCC = 30 V

200

ts @ VCC = 120 V

100
70
50

30
20

300

IC/IB = 10
TJ = 25C

30
100

200

20
0.2 0.3 0.5

1.0

2.0 3.0 5.0

10

20 30

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 8. TurnOn Time

Figure 9. TurnOff Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

50

100

200

2369

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistors

MMBT5550LT1
MMBT5551LT1*

COLLECTOR
3

NPN Silicon

*Motorola Preferred Device

1
BASE
2
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

140

Vdc

Collector Base Voltage

VCBO

160

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

IC

600

mAdc

Collector Current Continuous

3
1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT5550LT1 = M1F; MMBT5551LT1 = G1

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

140
160

160
180

6.0

100
50
100
50

50

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(3)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
MMBT5550
MMBT5551
V(BR)CBO
MMBT5550
MMBT5551

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 100 Vdc, IE = 0)
(VCB = 120 Vdc, IE = 0)
(VCB = 100 Vdc, IE = 0, TA = 100C)
(VCB = 120 Vdc, IE = 0, TA = 100C)

Vdc

V(BR)EBO

Vdc

ICBO
MMBT5550
MMBT5551
MMBT5550
MMBT5551

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

Vdc

IEBO


 

nAdc
Adc
nAdc

1. FR 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.

2370

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT5550LT1 MMBT5551LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

MMBT5550
MMBT5551

60
80

(IC = 10 mAdc, VCE = 5.0 Vdc)

MMBT5550
MMBT5551

60
80

250
250

(IC = 50 mAdc, VCE = 5.0 Vdc)

MMBT5550
MMBT5551

20
30

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

Both Types

0.15

(IC = 50 mAdc, IB = 5.0 mAdc)

MMBT5550
MMBT5551

0.25
0.20

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

Both Types

1.0

(IC = 50 mAdc, IB = 5.0 mAdc)

MMBT5550
MMBT5551

1.2
1.0

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 5.0 Vdc)

hFE

VCE(sat)

Vdc

VBE(sat)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Vdc

2371

MMBT5550LT1 MMBT5551LT1
500
300
h FE, DC CURRENT GAIN

200

VCE = 1.0 V
VCE = 5.0 V

TJ = 125C
25C

100
55C
50
30
20
10
7.0
5.0
0.1

0.2

0.3

0.5

0.7

1.0

3.0
2.0
5.0
7.0
IC, COLLECTOR CURRENT (mA)

10

20

30

50

70

100

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

1.0
0.9
0.8
0.7
0.6

IC = 1.0 mA

10 mA

100 mA

30 mA

0.5
0.4
0.3
0.2
0.1
0
0.005

0.01

0.02

0.05

0.1

0.2
0.5
1.0
IB, BASE CURRENT (mA)

2.0

5.0

10

20

50

Figure 2. Collector Saturation Region

101

1.0

TJ = 25C

100
101

0.8
TJ = 125C

102

IC = ICES

75C

103

REVERSE

FORWARD

25C

104
105
0.4

VBE(sat) @ IC/IB = 10
0.6

0.4

0.2
VCE(sat) @ IC/IB = 10
0

0.3

0.2 0.1
0
0.1
0.2 0.3
0.4
VBE, BASEEMITTER VOLTAGE (VOLTS)

Figure 3. Collector CutOff Region

2372

V, VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT ( A)

VCE = 30 V

0.5

0.6

0.1

0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30


IC, COLLECTOR CURRENT (mA)

50

100

Figure 4. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT5550LT1 MMBT5551LT1
V, TEMPERATURE COEFFICIENT (mV/ C)

2.5
2.0

TJ = 55C to +135C

1.5
1.0

Vin

tr, tf 10 ns
DUTY CYCLE = 1.0%

2.0
0.2 0.3 0.5 1.0 2.0 3.0 5.0
10 20 30
IC, COLLECTOR CURRENT (mA)

50

100

RC

RB

Vout

5.1 k
Vin

100

1N914

Figure 6. Switching Time Test Circuit

1000
TJ = 25C

20

200

t, TIME (ns)

300

10
Cibo

7.0
5.0

tr @ VCC = 120 V
tr @ VCC = 30 V

100

Cobo

3.0

IC/IB = 10
TJ = 25C

500

30

50

td @ VEB(off) = 1.0 V

30

VCC = 120 V

20

2.0
1.0
0.2

3.0 k

Values Shown are for IC @ 10 mA

Figure 5. Temperature Coefficients

100
70
50

0.25 F

10 s
INPUT PULSE

qVB for VBE(sat)

1.5

2.5
0.1

C, CAPACITANCE (pF)

100

0.5
1.0

VCC
30 V

VBB
8.8 V

10.2 V

qVC for VCE(sat)

0.5

0.3

0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

10
0.2 0.3 0.5

20

VR, REVERSE VOLTAGE (VOLTS)

20 30
2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA)

Figure 7. Capacitances

Figure 8. TurnOn Time

1.0

50

100

200

5000
tf @ VCC = 120 V

3000
2000

IC/IB = 10
TJ = 25C

tf @ VCC = 30 V
t, TIME (ns)

1000
500
300

ts @ VCC = 120 V

200
100
50
0.2 0.3 0.5

20 30 50
1.0 2.0 3.0 5.0
10
IC, COLLECTOR CURRENT (mA)

100

200

Figure 9. TurnOff Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2373

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Darlington Transistor

MMBT6427LT1

NPN Silicon

COLLECTOR 3
Motorola Preferred Device

BASE
1

EMITTER 2
1

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

12

Vdc

IC

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT6427LT1 = 1V

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

40

40

12

1.0

50

50

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 10 mAdc, VBE = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IC = 10 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCE = 25 Vdc, IB = 0)

ICES

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

Emitter Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

 0.062 in.
  0.024 in. 99.5% alumina.

Vdc
Vdc
Vdc
Adc
nAdc
nAdc

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

2374

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT6427LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 mAdc, VCE = 5.0 Vdc)
(IC = 100 mAdc, VCE = 5.0 Vdc)
(IC = 500 mAdc, VCE = 5.0 Vdc)

hFE

10,000
20,000
14,000

100,000
200,000
140,000

1.2
1.5

2.0

1.75

VCE(sat)(3)

Collector Emitter Saturation Voltage


(IC = 50 mAdc, IB = 0.5 mAdc)
(IC = 500 mAdc, IB = 0.5 mAdc)
Base Emitter Saturation Voltage
(IC = 500 mAdc, IB = 0.5 mAdc)

VBE(sat)

Base Emitter On Voltage


(IC = 50 mAdc, VCE = 5.0 Vdc)

VBE(on)

Vdc

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

Current Gain High Frequency


(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

|hfe|

Noise Figure
(IC = 1.0 mAdc, VCE = 5.0 Vdc, RS = 100 k, f = 1.0 kHz)

NF

pF

7.0

15

1.3

10

pF
Vdc
dB

3. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.

RS

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2375

MMBT6427LT1
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
500

2.0
BANDWIDTH = 1.0 Hz
RS 0
i n, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

200

BANDWIDTH = 1.0 Hz

100
10 A
50
100 A
20
IC = 1.0 mA
10

1.0
0.7
0.5

IC = 1.0 mA

0.3
0.2
100 A

0.1
0.07
0.05

10 A

0.03
0.02
10 20

5.0
10 20

50 100 200

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

50 k 100 k

50 100 200

50 k 100 k

Figure 3. Noise Current

14

200

BANDWIDTH = 10 Hz TO 15.7 kHz


12
BANDWIDTH = 10 Hz TO 15.7 kHz

100

NF, NOISE FIGURE (dB)

VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)

Figure 2. Noise Voltage

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

IC = 10 A

70
50

100 A

30
20

1.0 mA
10

1.0

2.0

10 A
8.0
100 A

6.0
4.0

IC = 1.0 mA

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

Figure 4. Total Wideband Noise Voltage

2376

10

100
0

0
1.0

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

100
0

Figure 5. Wideband Noise Figure

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT6427LT1
SMALLSIGNAL CHARACTERISTICS
20
|h fe |, SMALLSIGNAL CURRENT GAIN

4.0
TJ = 25C

C, CAPACITANCE (pF)

10
7.0

Cibo
Cobo

5.0

3.0

2.0
0.04

0.1

0.2
0.4
1.0 2.0 4.0
10
VR, REVERSE VOLTAGE (VOLTS)

20

2.0

1.0
0.8
0.6
0.4

0.2
0.5

40

200 k

hFE, DC CURRENT GAIN

TJ = 125C

25C

30 k
20 k
10 k
7.0 k
5.0 k

55C
VCE = 5.0 V

3.0 k
2.0 k
5.0 7.0

10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

RV, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.4
VBE(sat) @ IC/IB = 1000
1.2
VBE(on) @ VCE = 5.0 V
1.0

0.8
VCE(sat) @ IC/IB = 1000
0.6
20 30
50 70 100 200 300
IC, COLLECTOR CURRENT (mA)

0.5 10 20
50
100 200
IC, COLLECTOR CURRENT (mA)

500

TJ = 25C
2.5
IC = 10 mA

50 mA

250 mA

500 mA

2.0

1.5

1.0

0.5
0.1 0.2

0.5 1.0 2.0 5.0 10 20 50 100 200


IB, BASE CURRENT (A)

500 1000

Figure 9. Collector Saturation Region

1.6

10

2.0

3.0

Figure 8. DC Current Gain

5.0 7.0

1.0

Figure 7. High Frequency Current Gain

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. Capacitance

100 k
70 k
50 k

VCE = 5.0 V
f = 100 MHz
TJ = 25C

500

Figure 10. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0

2.0

*APPLIES FOR IC/IB hFE/3.0

25C TO 125C

*RqVC FOR VCE(sat)


55C TO 25C

3.0
25C TO 125C
4.0

qVB FOR VBE


5.0

55C TO 25C

6.0
5.0 7.0 10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

Figure 11. Temperature Coefficients

2377

r(t), TRANSIENT THERMAL


RESISTANCE (NORMALIZED)

MMBT6427LT1
1.0
0.7
0.5

D = 0.5
0.2

0.3
0.2
0.1

0.05

SINGLE PULSE

0.1
0.07
0.05

SINGLE PULSE
ZJC(t) = r(t) RJC TJ(pk) TC = P(pk) ZJC(t)
ZJA(t) = r(t) RJA TJ(pk) TA = P(pk) ZJA(t)

0.03
0.02
0.01
0.1

0.2

0.5

1.0

2.0

5.0

10

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 12. Thermal Response

FIGURE A
tP
PP

PP

t1
1/f
DUTY CYCLE

+ t1 f + ttP1

PEAK PULSE POWER = PP

Design Note: Use of Transient Thermal Resistance Data

2378

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

MMBT6428LT1
MMBT6429LT1

COLLECTOR
3

NPN Silicon

1
BASE
2
EMITTER

3
1
2

MAXIMUM RATINGS
Rating

Symbol

6428LT1

6429LT1

Unit

Collector Emitter Voltage

VCEO

50

45

Vdc

Collector Base Voltage

VCBO

60

55

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

IC

200

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT6428LT1 = 1KM; MMBT6429LT1 = 1L

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

50
45

60
55

0.1

0.01

0.01

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)
(IC = 1.0 mAdc, IB = 0)

MMBT6428
MMBT6429

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 0.1 mAdc, IE = 0)
(IC = 0.1 mAdc, IE = 0)

MMBT6428
MMBT6429

V(BR)CBO

Collector Cutoff Current


(VCE = 30 Vdc)

ICES

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

Emitter Cutoff Current


(VEB = 5.0 Vdc, IC = 0)

IEBO

 0.062 in.
  0.024 in. 99.5% alumina.

Vdc

Vdc

Adc
Adc
Adc

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2379

MMBT6428LT1 MMBT6429LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

MMBT6428
MMBT6429

250
500

(IC = 0.1 mAdc, VCE = 5.0 Vdc)

MMBT6428
MMBT6429

250
500

650
1250

(IC = 1.0 mAdc, VCE = 5.0 Vdc)

MMBT6428
MMBT6429

250
500

(IC = 10 mAdc, VCE = 5.0 Vdc)

MMBT6428
MMBT6429

250
500

0.2
0.6

0.56

0.66

100

700

3.0

8.0

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 0.01 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 100 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter On Voltage


(IC = 1.0 mAdc, VCE = 5.0 mAdc)

VBE(on)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

fT

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

RS

MHz
pF
pF

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

2380

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT6428LT1 MMBT6429LT1
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
NOISE VOLTAGE
30

30
BANDWIDTH = 1.0 Hz

BANDWIDTH = 1.0 Hz
20

RS 0

IC = 10 mA

en , NOISE VOLTAGE (nV)

en , NOISE VOLTAGE (nV)

20

3.0 mA

10

1.0 mA

7.0
5.0

RS 0
f = 10 Hz
10

100 Hz

7.0
10 kHz

1.0 kHz

5.0

300 A
3.0
10

20

50 100 200

3.0
0.01 0.02

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

Figure 2. Effects of Frequency

IC = 10 mA
3.0 mA
1.0 mA
300 A
100 A

0.3
0.2
RS 0

0.1
10

20

10 A
50 100 200

10

16

3.0

1.0
0.7
0.5

5.0

20

BANDWIDTH = 1.0 Hz

2.0

0.05 0.1 0.2


0.5 1.0
2.0
IC, COLLECTOR CURRENT (mA)

Figure 3. Effects of Collector Current

NF, NOISE FIGURE (dB)

In, NOISE CURRENT (pA)

10
7.0
5.0

100 kHz

BANDWIDTH = 10 Hz to 15.7 kHz


12
500 A

8.0

IC = 1.0 mA

100 A
10 A

4.0

30 A
0
10

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

20

Figure 4. Noise Current

50 100 200 500 1 k 2 k


5 k 10 k 20 k 50 k 100 k
RS, SOURCE RESISTANCE (OHMS)

Figure 5. Wideband Noise Figure


100 Hz NOISE DATA
20

BANDWIDTH = 1.0 Hz

IC = 10 mA
16

100 A

100
70
50

3.0 mA
1.0 mA

30

300 A

20
10
7.0
5.0

30 A
10 A

NF, NOISE FIGURE (dB)

VT, TOTAL NOISE VOLTAGE (nV)

300
200

IC = 10 mA

3.0 mA
1.0 mA

12

300 A
8.0
100 A
30 A

4.0

10 A

BANDWIDTH = 1.0 Hz
0

3.0
10

20

50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k


RS, SOURCE RESISTANCE (OHMS)

Figure 6. Total Noise Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k


RS, SOURCE RESISTANCE (OHMS)

Figure 7. Noise Figure

2381

h FE, DC CURRENT GAIN (NORMALIZED)

MMBT6428LT1 MMBT6429LT1
4.0
3.0
VCE = 5.0 V
2.0

TA = 125C
25C

1.0
55C

0.7
0.5
0.4
0.3
0.2
0.01

0.02

0.03

0.05

0.1

0.2
0.3
0.5
IC, COLLECTOR CURRENT (mA)

1.0

2.0

3.0

5.0

10

Figure 8. DC Current Gain

0.4
RVBE, BASEEMITTER
TEMPERATURE COEFFICIENT (mV/ C)

1.0
TJ = 25C
V, VOLTAGE (VOLTS)

0.8

0.6

VBE @ VCE = 5.0 V

0.4

0.2

0.8

1.2

TJ = 25C to 125C

1.6

2.0
55C to 25C

VCE(sat) @ IC/IB = 10
0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

2.4
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10
IC, COLLECTOR CURRENT (mA)

100

8.0

C, CAPACITANCE (pF)

6.0

TJ = 25C
Cob

4.0
3.0

Ceb

Cib

Ccb

2.0

1.0
0.8
0.1

0.2

1.0
2.0
5.0
0.5
10
20
VR, REVERSE VOLTAGE (VOLTS)

Figure 11. Capacitance

2382

50 100

Figure 10. Temperature Coefficients

50

100

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 9. On Voltages

20

500

300
200

100
VCE = 5.0 V
TJ = 25C

70
50
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 12. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistor

MMBT6517LT1

NPN Silicon

COLLECTOR
3

Motorola Preferred Device

1
BASE
3

2
EMITTER

MAXIMUM RATINGS

1
2

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

350

Vdc

Collector Base Voltage

VCBO

350

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Base Current

IB

250

mAdc

Collector Current Continuous

IC

500

mAdc

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBT6517LT1 = 1Z

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

350

350

6.0

50

50

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mAdc)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 100 mAdc)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 10 mAdc)

V(BR)EBO

Collector Cutoff Current


(VCB = 250 Vdc)

ICBO

Emitter Cutoff Current


(VEB = 5.0 Vdc)

IEBO

 0.062 in.
  0.024 in. 99.5% alumina.

Vdc
Vdc
Vdc
nAdc
nAdc

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2383

MMBT6517LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

20
30
30
20
15

200
200

0.30
0.35
0.50
1.0

0.75
0.85
0.90

2.0

40

200

6.0

80

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)
(IC = 50 mAdc, VCE = 10 Vdc)
(IC = 100 mAdc, VCE = 10 Vdc)

hFE

Collector Emitter Saturation Voltage (3)


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 20 mAdc, IB = 2.0 mAdc)
(IC = 30 mAdc, IB = 3.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 20 mAdc, IB = 2.0 mAdc)
(IC = 30 mAdc, IB = 3.0 mAdc)

VBE(sat)

Base Emitter On Voltage


(IC = 100 mAdc, VCE = 10 Vdc)

VBE(on)

Vdc

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 20 MHz)

fT

CollectorBase Capacitance
(VCB = 20 Vdc, f = 1.0 MHz)

Ccb

EmitterBase Capacitance
(VEB = 0.5 Vdc, f = 1.0 MHz)

Ceb

MHz
pF
pF

3. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.

2384

Motorola SmallSignal Transistors, FETs and Diodes Device Data

200

hFE , DC CURRENT GAIN

VCE = 10 V

TJ = 125C

100
25C

70
50

55C
30
20

10
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

MMBT6517LT1
100
70
50
TJ = 25C
VCE = 20 V
f = 20 MHz

30
20

10
1.0

Figure 1. DC Current Gain

V, VOLTAGE (VOLTS)

1.0
VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 10 V

2.5
IC
IB

2.0

50 70

100

1.5

+ 10
25C to 125C

1.0
0.5

RVC for VCE(sat)

55C to 25C

0.5

0.4

1.0
55C to 125C

1.5

0.2
0
1.0

RV, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C

0.8

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

Figure 2. CurrentGain Bandwidth Product

1.4
1.2

2.0

VCE(sat) @ IC/IB = 10
2.0

VCE(sat) @ IC/IB = 5.0


3.0
5.0 7.0 10
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

RVB for VBE

2.0
2.5
1.0

Figure 3. On Voltages

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70

100

Figure 4. Temperature Coefficients

100
70
50
C, CAPACITANCE (pF)

2.0

TJ = 25C
Ceb

30
20
10
7.0
5.0

Ccb

3.0
2.0
1.0
0.2

0.5

1.0 2.0
5.0
10
20
VR, REVERSE VOLTAGE (VOLTS)

50 100 200

Figure 5. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2385

MMBT6517LT1
1.0 k
700
500

10 k
7.0 k
5.0 k

VCE(off) = 100 V
IC/IB = 5.0
TJ = 25C

td @ VBE(off) = 2.0 V

300

2.0 k
t, TIME (ns)

200
t, TIME (ns)

ts

3.0 k

tr
100
70
50

1.0 k
700
500

30

300

20

200

10
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

100
1.0

70 100

VCE(off) = 100 V
IC/IB = 5.0
IB1 = IB2
TJ = 25C

tf

2.0 3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

Figure 7. TurnOff Time

Figure 6. TurnOn Time

+VCC
VCC ADJUSTED
FOR VCE(off) = 100 V

+10.8 V

2.2 k

20 k

50 SAMPLING SCOPE

1.0 k
50
1/2MSD7000

9.2 V
PULSE WIDTH 100 s
tr, tf 5.0 ns
DUTY CYCLE 1.0%
FOR PNP TEST CIRCUIT,
REVERSE ALL VOLTAGE POLARITIES

APPROXIMATELY
1.35 V

(ADJUST FOR V(BE)off = 2.0 V)

RESISTANCE (NORMALIZED)

Figure 8. Switching Time Test Circuit

1.0
0.7
0.5
0.3

D = 0.5
0.2

0.2
0.1
0.1
0.07
0.05

SINGLE PULSE

0.05

SINGLE PULSE
ZJC(t) = r(t) RJC TJ(pk) TC = P(pk) ZJC(t)
ZJA(t) = r(t) RJA TJ(pk) TA = P(pk) ZJA(t)

0.03
0.02
0.01
0.1

0.2

0.5

1.0

2.0

5.0

10

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 9. Thermal Response

2386

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT6517LT1
FIGURE A
tP
PP

PP

t1
1/f
DUTY CYCLE

+ t1 f + ttP1

PEAK PULSE POWER = PP

Design Note: Use of Transient Thermal Resistance Data

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2387

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistor

MMBT6520LT1

PNP Silicon

COLLECTOR
3

Motorola Preferred Device

1
BASE
3

2
EMITTER

1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

350

Vdc

CollectorBase Voltage

VCBO

350

Vdc

EmitterBase Voltage

VEBO

5.0

Vdc

Base Current

IB

250

mA

Collector Current Continuous

IC

500

mAdc

DEVICE MARKING
MMBT6520LT1 = 2Z

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR-5 Board (1)
TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate, (2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

Symbol

Max

Unit

PD

225

mW

1.8

mW/C

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage (IC = 1.0 mA)

V(BR)CEO

350

Vdc

CollectorBase Breakdown Voltage (IC = 100 A)

V(BR)CBO

350

Vdc

EmitterBase Breakdown Voltage (IE = 10 A)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current (VCB = 250 V)

ICBO

50

nA

Emitter Cutoff Current (VEB = 4.0 V)

IEBO

50

nA

OFF CHARACTERISTICS

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina

Preferred devices are Motorola recommended choices for future use and best overall value.

2388

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT6520LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

20
30
30
20
15

200
200

0.30
0.35
0.50
1.0

0.75
0.85
0.90

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mA, VCE = 10 V)
(IC = 10 mA, VCE = 10 V)
(IC = 30 mA, VCE = 10 V)
(IC = 50 mA, VCE = 10 V)
(IC = 100 mA, VCE = 10 V)

hFE

CollectorEmitter Saturation Voltage


(IC = 10 mA, IB = 1.0 mA)
(IC = 20 mA, IB = 2.0 mA)
(IC = 30 mA, IB = 3.0 mA)
(IC = 50 mA, IB = 5.0 mA)

VCE(sat)

Vdc

BaseEmitter Saturation Voltage


(IC = 10 mA, IB = 1.0 mA)
(IC = 20 mA, IB = 2.0 mA)
(IC = 30 mA, IB = 3.0 mA)

VBE(sat)

BaseEmitter On Voltage
(IC = 100 mA, VCE = 10 V)

VBE(on)

2.0

Vdc

fT

40

200

MHz

CollectorBase Capacitance
(VCB= 20 V, f = 1.0 MHz)

Ccb

6.0

pF

EmitterBase Capacitance
(VEB= 0.5 V, f = 1.0 MHz)

Ceb

100

pF

Vdc

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 10 mA, VCE = 20 V, f = 20 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2389

hFE, DC CURRENT GAIN

200

VCE = 10 V

TJ = 125C

100

25C

70
55C
50

30
20
1.0

2.0

3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

MMBT6520LT1
100
70
50

20

10
1.0

1.4
TJ = 25C

V, VOLTAGE (VOLTS)

1.0
0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 10 V

2.5
1.5

100

+ 10
25C to 125C

1.0
0.5
0

1.5

VCE(sat) @ IC/IB = 10
2.0

VCE(sat) @ IC/IB = 5.0


3.0
5.0 7.0 10
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

100
70
50

2.0
2.5
1.0

RVC for VCE(sat)


55C to 25C

2.0

1.0 k
700
500

TJ = 25C
Ceb

30

55C to 125C
RVB for VBE

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70

100

Figure 4. Temperature Coefficients

td @ VBE(off) = 2.0 V

300

VCE(off) = 100 V
IC/IB = 5.0
TJ = 25C

200

20
t, TIME (ns)

C, CAPACITANCE (pF)

IC
IB

2.0

Figure 3. On Voltages

10
7.0
5.0

Ccb

tr
100
70
50

3.0

30

2.0

20

0.5

1.0 2.0
5.0
10
20
VR, REVERSE VOLTAGE (VOLTS)

Figure 5. Capacitance

2390

50 70

1.0

0.2

1.0
0.2

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

0.5

0.4

0
1.0

2.0

Figure 2. CurrentGain Bandwidth Product

RV, TEMPERATURE COEFFICIENTS (mV/C)

Figure 1. DC Current Gain

1.2

TJ = 25C
VCE = 20 V
f = 20 MHz

30

50 100 200

10
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

Figure 6. TurnOn Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBT6520LT1
10 k
7.0 k
5.0 k

ts

3.0 k
t, TIME (ns)

2.0 k
1.0 k
700
500

VCE(off) = 100 V
IC/IB = 5.0
IB1 = IB2
TJ = 25C

tf

300
200
100
1.0

2.0 3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

Figure 7. TurnOff Time

+VCC
VCC ADJUSTED
FOR VCE(off) = 100 V

+10.8 V

2.2 k

20 k

50 SAMPLING SCOPE

1.0 k
50
1/2MSD7000

9.2 V
PULSE WIDTH 100 s
tr, tf 5.0 ns
DUTY CYCLE 1.0%
FOR PNP TEST CIRCUIT,
REVERSE ALL VOLTAGE POLARITIES

APPROXIMATELY
1.35 V

(ADJUST FOR V(BE)off = 2.0 V)

r(t), TRANSIENT THERMAL


RESISTANCE (NORMALIZED)

Figure 8. Switching Time Test Circuit

1.0
0.7
0.5
0.3

D = 0.5
0.2

0.2
0.1
0.1
0.07
0.05

SINGLE PULSE

0.05

SINGLE PULSE
ZJC(t) = r(t) RJC TJ(pk) TC = P(pk) ZJC(t)
ZJA(t) = r(t) RJA TJ(pk) TA = P(pk) ZJA(t)

0.03
0.02
0.01
0.1

0.2

0.5

1.0

2.0

5.0

10

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 9. Thermal Response

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2391

MMBT6520LT1
FIGURE A
tP
PP

PP

t1
1/f
DUTY CYCLE

+ t1 f + ttP1

PEAK PULSE POWER = PP

Design Note: Use of Transient Thermal Resistance Data

2392

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBTA05LT1
MMBTA06LT1*

Driver Transistors
NPN Silicon

COLLECTOR
3

*Motorola Preferred Device

1
BASE
3

2
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

MMBTA05

MMBTA06

Unit

Collector Emitter Voltage

VCEO

60

80

Vdc

Collector Base Voltage

VCBO

60

80

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

IC

500

mAdc

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBTA05LT1 = 1H; MMBTA06LT1 = 1GM

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

60
80

V(BR)EBO

4.0

Vdc

ICES

0.1

mAdc

0.1
0.1

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage (3)
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO
MMBTA05
MMBTA06

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)
Collector Cutoff Current
(VCE = 60 Vdc, IB = 0)
Collector Cutoff Current
(VCB = 60 Vdc, IE = 0)
(VCB = 80 Vdc, IE = 0)


 

Vdc

mAdc

ICBO
MMBTA05
MMBTA06

1. FR 5 = 1.0
0.75 0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width
300 ms, Duty Cycle
2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2393

MMBTA05LT1 MMBTA06LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

100
100

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 100 mAdc, IB = 10 mAdc)

VCE(sat)

0.25

Vdc

Base Emitter On Voltage


(IC = 100 mAdc, VCE = 1.0 Vdc)

VBE(on)

1.2

Vdc

fT

100

MHz

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(4)
(IC = 10 mA, VCE = 2.0 V, f = 100 MHz)
4. fT is defined as the frequency at which |hfe| extrapolates to unity.

2394

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBTA13LT1
MMBTA14LT1*

Darlington Amplifier Transistors


NPN Silicon

*Motorola Preferred Device

COLLECTOR 3
BASE
1

3
1

EMITTER 2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCES

30

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

10

Vdc

IC

300

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBTA13LT1 = 1M; MMBTA14LT1 = 1N

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)CES

30

Vdc

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

100

nAdc

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 100 mAdc, VBE = 0)

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2395

MMBTA13LT1 MMBTA14LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

MMBTA13
MMBTA14

5000
10,000

MMBTA13
MMBTA14

10,000
20,000

VCE(sat)

1.5

Vdc

VBE

2.0

Vdc

fT

125

MHz

ON CHARACTERISTICS(3)
DC Current Gain
(IC = 10 mAdc, VCE = 5.0 Vdc)

hFE

(IC = 100 mAdc, VCE = 5.0 Vdc)


Collector Emitter Saturation Voltage
(IC = 100 mAdc, IB = 0.1 mAdc)
Base Emitter On Voltage
(IC = 100 mAdc, VCE = 5.0 Vdc)

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(4)
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
3. Pulse Test: Pulse Width
4. fT = |hfe| ftest.

v 300 ms, Duty Cycle v 2.0%.

RS

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

2396

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBTA13LT1 MMBTA14LT1
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)

500

2.0
BANDWIDTH = 1.0 Hz
RS 0
i n, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

200

BANDWIDTH = 1.0 Hz

100
10 A
50
100 A
20
IC = 1.0 mA
10

1.0
0.7
0.5

IC = 1.0 mA

0.3
0.2
100 A

0.1
0.07
0.05

10 A

0.03
0.02
10 20

5.0
10 20

50 100 200

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

50 k 100 k

50 100 200

50 k 100 k

Figure 3. Noise Current

200

14
BANDWIDTH = 10 Hz TO 15.7 kHz
12
BANDWIDTH = 10 Hz TO 15.7 kHz

100

NF, NOISE FIGURE (dB)

VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)

Figure 2. Noise Voltage

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

IC = 10 A

70
50

100 A

30
20

1.0 mA
10

1.0

2.0

10
10 A
8.0
100 A

6.0
4.0

IC = 1.0 mA

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

100
0

Figure 4. Total Wideband Noise Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0
1.0

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

100
0

Figure 5. Wideband Noise Figure

2397

MMBTA13LT1 MMBTA14LT1
SMALLSIGNAL CHARACTERISTICS

20
|h fe |, SMALLSIGNAL CURRENT GAIN

4.0
TJ = 25C

C, CAPACITANCE (pF)

10
7.0

Cibo
Cobo

5.0

3.0

2.0
0.04

0.1

0.2
0.4
1.0 2.0 4.0
10
VR, REVERSE VOLTAGE (VOLTS)

20

2.0

1.0
0.8
0.6
0.4

0.2
0.5

40

200 k

hFE, DC CURRENT GAIN

TJ = 125C

25C

30 k
20 k
10 k
7.0 k
5.0 k

55C
VCE = 5.0 V

3.0 k
2.0 k
5.0 7.0

10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

RV, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.4
VBE(sat) @ IC/IB = 1000
1.2
VBE(on) @ VCE = 5.0 V
1.0

0.8
VCE(sat) @ IC/IB = 1000
0.6
20 30
50 70 100 200 300
IC, COLLECTOR CURRENT (mA)

Figure 10. On Voltages

2398

0.5 10 20
50
100 200
IC, COLLECTOR CURRENT (mA)

500

TJ = 25C
2.5
IC = 10 mA

50 mA

250 mA

500 mA

2.0

1.5

1.0

0.5
0.1 0.2

0.5 1.0 2.0 5.0 10 20 50 100 200


IB, BASE CURRENT (A)

500 1000

Figure 9. Collector Saturation Region

1.6

10

2.0

3.0

Figure 8. DC Current Gain

5.0 7.0

1.0

Figure 7. High Frequency Current Gain

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. Capacitance

100 k
70 k
50 k

VCE = 5.0 V
f = 100 MHz
TJ = 25C

500

1.0

2.0

*APPLIES FOR IC/IB hFE/3.0

25C TO 125C

*RqVC FOR VCE(sat)


55C TO 25C

3.0
25C TO 125C
4.0

qVB FOR VBE


5.0

55C TO 25C

6.0
5.0 7.0 10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

Figure 11. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBTA13LT1 MMBTA14LT1

r(t), TRANSIENT THERMAL


RESISTANCE (NORMALIZED)

1.0
0.7
0.5

D = 0.5
0.2

0.3
0.2
0.1

0.05

SINGLE PULSE

0.1
0.07
0.05

SINGLE PULSE
ZJC(t) = r(t) RJC TJ(pk) TC = P(pk) ZJC(t)
ZJA(t) = r(t) RJA TJ(pk) TA = P(pk) ZJA(t)

0.03
0.02
0.01
0.1

0.2

0.5

1.0

2.0

10

5.0

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 12. Thermal Response

IC, COLLECTOR CURRENT (mA)

1.0 k
700
500
300
200

FIGURE A

1.0 ms

tP
TA = 25C

TC = 25C

100 s

PP

1.0 s

100
70
50

PP

t1

30

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

20
10
0.4 0.6

1/f
DUTY CYCLE

1.0
2.0
4.0 6.0
10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 13. Active Region Safe Operating Area

40

+ t1 f + ttP1

PEAK PULSE POWER = PP

Design Note: Use of Transient Thermal Resistance Data

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2399

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Amplifier


NPN Silicon

MMBTA20LT1
COLLECTOR
3

1
BASE

3
1

2
EMITTER

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

IC

100

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Collector Current Continuous

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBTA20LT1 = 1C

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

4.0

Vdc

ICBO

100

nAdc

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

2400

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBTA20LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

hFE

40

400

VCE(sat)

0.25

Vdc

fT

125

MHz

Cobo

4.0

pF

ON CHARACTERISTICS
DC Current Gain
(IC = 5.0 mAdc, VCE = 10 Vdc)
Collector Emitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 5.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

EQUIVALENT SWITCHING TIME TEST CIRCUITS


+ 3.0 V
300 ns
DUTY CYCLE = 2%

275

+10.9 V

+ 3.0 V

10 < t1 < 500 s


DUTY CYCLE = 2%

t1

+10.9 V

10 k

0.5 V
<1.0 ns

275
10 k

0
CS < 4.0 pF*

9.1 V

< 1.0 ns

1N916

CS < 4.0 pF*

*Total shunt capacitance of test jig and connectors

Figure 1. TurnOn Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 2. TurnOff Time

2401

MMBTA20LT1
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
20

100
BANDWIDTH = 1.0 Hz
RS = 0

50

300 A

10

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

IC = 1.0 mA

100 A

7.0
5.0
10 A
3.0

20

300 A
100 A

10
5.0
2.0
1.0
30 A

0.5

30 A

BANDWIDTH = 1.0 Hz
RS

IC = 1.0 mA

10 A

0.2
2.0

0.1
10

20

50

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

10

20

50

Figure 3. Noise Voltage

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

Figure 4. Noise Current

NOISE FIGURE CONTOURS


(VCE = 5.0 Vdc, TA = 25C)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k

RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

500 k

20 k
10 k
5k

2.0 dB

2k
1k
500

3.0 dB 4.0 dB
6.0 dB

10 dB

200
100
50

1M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

1.0 dB

5k

2.0 dB

2k
1k
500

5.0 dB

200
100
10

20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

8.0 dB
10

20

Figure 5. Narrow Band, 100 Hz

500 k
RS , SOURCE RESISTANCE (OHMS)

3.0 dB

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

Figure 6. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is defined as:

20 k
10 k
5k

NF
1.0 dB

2k
1k
500

3.0 dB
5.0 dB
8.0 dB
10

20

30

50 70 100

200 300

500 700

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

2.0 dB

200
100
50

+ 20 log10

1k

IC, COLLECTOR CURRENT (A)

Figure 7. Wideband
2402

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBTA20LT1
TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C

25C

200

55C
100
80
MPS390
VCE
4 = 1.0 V
VCE = 10 V

60
40
0.004 0.006 0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3
0.5 0.7 1.0
2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0 10

20

30

50

70 100

100

1.0
MPS3904
TJ = 25C

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 8. DC Current Gain

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%

300 A
200 A
40
100 A
20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
VBE(sat) @ IC/IB = 10

0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.2

2.0
5.0
10
20
0.5 1.0
IC, COLLECTOR CURRENT (mA)

40

Figure 10. Collector Characteristics

1.4

0.1

400 A

60

Figure 9. Collector Saturation Region

0.8

IB = 500 A

50

100

Figure 11. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6

*APPLIES for IC/IB hFE/2

0.8
25C to 125C
0

*qVC for VCE(sat)


55C to 25C

0.8
25C to 125C
1.6

qVB for VBE


2.4
0.1

0.2

55C to 25C

0.5
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 12. Temperature Coefficients

2403

MMBTA20LT1
TYPICAL DYNAMIC CHARACTERISTICS
1000
VCC = 3.0 V
IC/IB = 10
TJ = 25C

100
70
50

700
500

ts

300
200
t, TIME (ns)

t, TIME (ns)

300
200

tr

30
20
td @ VBE(off) = 0.5 Vdc

10
7.0
5.0

100
70
50

tf

30

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

20

3.0
1.0

2.0

50 70

20 30
5.0 7.0 10
3.0
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0

3.0

500

70 100

10
TJ = 25C
f = 100 MHz

TJ = 25C
f = 1.0 MHz

7.0

300
VCE = 20 V
200

5.0 V

100

Cib

5.0

Cob
3.0
2.0

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.2

0.5

1.0

2.0

5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 15. CurrentGain Bandwidth Product

Figure 16. Capacitance

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

3.0
2.0
1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

MPS3904
hfe 200 @ IC = 1.0 mA

7.0
5.0

0.2
0.1

10

20

50

200

10

100
70
50

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C
MPS3904
hfe 200 @ IC = 1.0 mA

30
20
10
7.0
5.0
3.0

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

Figure 17. Input Impedance

2404

0.1

IC, COLLECTOR CURRENT (mA)

20
hie , INPUT IMPEDANCE (k )

50

Figure 14. TurnOff Time

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 13. TurnOn Time

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

50

100

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 18. Output Admittance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

MMBTA20LT1
1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19A

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

t2

1.0

2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 19. Thermal Response

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 Vdc

A train of periodical power pulses can be represented by the model


as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 19 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 19 by the
steady state value RJA.

103
102

ICEO

101

Example:
The MPS3904 is dissipating 2.0 watts peak under the following
conditions:
t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.

ICBO
AND
ICEX @ VBE(off) = 3.0 Vdc

100
101
102

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

The peak rise in junction temperature is therefore


T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.
For more information, see AN569.

Figure 19A.

IC, COLLECTOR CURRENT (mA)

400
1.0 ms

200
100
60
40

TC = 25C

dc
dc
TJ = 150C

10

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

6.0
2.0

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 20 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.

10 s
1.0 s

TA = 25C

20

4.0

100 s

4.0
6.0 8.0 10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

40

Figure 20.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2405

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistors


NPN Silicon

MMBTA42LT1*
MMBTA43LT1

COLLECTOR
3

*Motorola Preferred Device

1
BASE
2
EMITTER

MAXIMUM RATINGS
Rating

Symbol

MMBTA42

MMBTA43

Unit

Collector Emitter Voltage

VCEO

300

200

Vdc

Collector Base Voltage

VCBO

300

200

Vdc

Emitter Base Voltage

VEBO

6.0

6.0

Vdc

Collector Current Continuous

IC

500

3
1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

mAdc

DEVICE MARKING
MMBTA42LT1 = 1D; MMBTA43LT1 = M1E

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR5 Board,(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

300
200

300
200

6.0

0.1
0.1

0.1
0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(3)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
MMBTA42
MMBTA43

Vdc

V(BR)CBO
MMBTA42
MMBTA43

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 200 Vdc, IE = 0)
(VCB = 160 Vdc, IE = 0)

MMBTA42
MMBTA43

Emitter Cutoff Current


(VEB = 6.0 Vdc, IC = 0)
(VEB = 4.0 Vdc, IC = 0)

MMBTA42
MMBTA43

Vdc

Vdc
Adc

ICBO

Adc

IEBO

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.

2406

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBTA42LT1 MMBTA43LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

Both Types
Both Types

25
40

MMBTA42
MMBTA43

40
40

0.5
0.5

VBE(sat)

0.9

Vdc

fT

50

MHz

3.0
4.0

ON CHARACTERISTICS(3)
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)
Collector Emitter Saturation Voltage
(IC = 20 mAdc, IB = 2.0 mAdc)

hFE

VCE(sat)
MMBTA42
MMBTA43

BaseEmitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)
3. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Ccb
MMBTA42
MMBTA43

Motorola SmallSignal Transistors, FETs and Diodes Device Data

pF

2407

MMBTA42LT1 MMBTA43LT1
200

hFE, DC CURRENT GAIN

VCE = 10 Vdc
TJ = +125C

100

25C
50
55C
30
20
1.0

2.0

3.0

5.0

7.0
10
IC, COLLECTOR CURRENT (mA)

20

30

50

70

100

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 1. DC Current Gain

100

C, CAPACITANCE (pF)

50
Ceb

20
10
5.0

Ccb

2.0
1.0
0.2

0.5

1.0 2.0
5.0 10
20
50
VR, REVERSE VOLTAGE (VOLTS)

100

200

Figure 2. Capacitances

100
70
50
TJ = 25C
VCE = 20 V
f = 20 MHz

30
20

10
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

Figure 3. CurrentGain Bandwidth Product

1.4
TJ = 25C

V, VOLTAGE (VOLTS)

1.2
1.0
0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 10 V

0.4
5.0
0.2
0
1.0

VCE(sat) @ IC/IB = 10
2.0

3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

Figure 4. On Voltages

2408

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Driver Transistors

MMBTA55LT1
MMBTA56LT1*

COLLECTOR
3

PNP Silicon

1
BASE

*Motorola Preferred Device

2
EMITTER

MAXIMUM RATINGS
Rating

Symbol

MMBTA55

MMBTA56

Unit

VCEO
VCBO

60

80

Vdc

60

80

Vdc

Collector Emitter Voltage


Collector Base Voltage
Emitter Base Voltage

VEBO
IC

Collector Current Continuous

3
1
2

4.0

Vdc

500

mAdc

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

DEVICE MARKING
MMBTA55LT1 = 2H; MMBTA56LT1 = 2GM

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Total Device Dissipation FR5 Board,(1)


TA = 25C
Derate above 25C

Characteristic

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

417

C/W

55 to +150

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C

RqJA
TJ, Tstg

Thermal Resistance, Junction to Ambient


Junction and Storage Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)CEO

60
80

Vdc

V(BR)EBO

4.0

Vdc

ICES

0.1

Adc

ICBO

0.1
0.1

Adc

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(3)
(IC = 1.0 mAdc, IB = 0)

MMBTA55
MMBTA56

Emitter Base Breakdown Voltage (IE = 100 mAdc, IC = 0)


Collector Cutoff Current (VCE = 60 Vdc, IB = 0)
Collector Cutoff Current (VCB = 60 Vdc, IE = 0)
Collector Cutoff Current (VCB = 80 Vdc, IE = 0)

MMBTA55
MMBTA56

ON CHARACTERISTICS
DC Current Gain (IC = 10 mAdc, VCE = 1.0 Vdc)
DC Current Gain (IC = 100 mAdc, VCE = 1.0 Vdc)

hFE

100
100

Collector Emitter Saturation Voltage (IC = 100 mAdc, IB = 10 mAdc)

VCE(sat)

0.25

Vdc

BaseEmitter On Voltage (IC = 100 mAdc, VCE = 1.0 Vdc)

VBE(on)

1.2

Vdc

fT

50

MHz

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(4)
(IC = 100 mAdc, VCE = 1.0 Vdc, f = 100 MHz)
1.
2.
3.
4.

FR5 = 1.0 x 0.75 x 0.062 in.


Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.
fT is defined as the frequency at which |hfe| extrapolates to unity.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2409

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Darlington Transistors
PNP Silicon

MMBTA63LT1
MMBTA64LT1*

COLLECTOR 3
BASE
1

*Motorola Preferred Device

EMITTER 2
3

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCES

30

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

10

Vdc

IC

500

mAdc

Collector Current Continuous

1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

DEVICE MARKING
MMBTA63LT1 = 2U; MMBTA64LT1 = 2V

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR5 Board,(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)CEO

30

Vdc

Collector Cutoff Current (VCB = 30 Vdc)

ICBO

100

nAdc

Emitter Cutoff Current (VEB = 10 Vdc)

IEBO

100

nAdc

5,000
10,000
10,000
20,000

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage (IC = 100 Adc)

ON CHARACTERISTICS
DC Current Gain(3)
(IC = 10 mAdc, VCE = 5.0 Vdc)
(IC = 10 mAdc, VCE = 5.0 Vdc)
(IC = 100 mAdc, VCE = 5.0 Vdc)
(IC = 100 mAdc, VCE = 5.0 Vdc)

hFE
MMBTA63
MMBTA64
MMBTA63
MMBTA64

Collector Emitter Saturation Voltage (IC = 100 mAdc, IB = 0.1 mAdc)

VCE(sat)

1.5

Vdc

BaseEmitter On Voltage (IC = 100 mAdc, VCE = 5.0 Vdc)

VBE(on)

2.0

Vdc

fT

125

MHz

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product (IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
1. FR5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.

2410

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBTA63LT1 MMBTA64LT1
hFE , DC CURRENT GAIN (X1.0 K)

200
TA = 125C

100
70
50

10 V

30

25C
VCE = 2.0 V
5.0 V

20
10
7.0
5.0

55C

3.0
2.0
0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

20

30

50

70

100

200

300

IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

2.0
TA = 25C
VBE(sat) @ IC/IB = 100

V, VOLTAGE (VOLTS)

1.6

1.2
VBE(on) @ VCE = 5.0 V
0.8

VCE(sat) @ IC/IB = 1000


IC/IB = 100

0.4

0
0.3 0.5

1.0

2 3 5
10 20 30 50
IC, COLLECTOR CURRENT (mA)

100 200 300

2.0
TA = 25C
1.8
1.6
1.4

IC = 10 mA 50 mA 100 mA 175 mA

300 mA

1.2
1.0
0.8
0.6
0.10.2 0.5 1 2

Figure 2. On Voltage

5 10 20 50 100200500 1K2K 5K10K


IB, BASE CURRENT (A)

Figure 3. Collector Saturation Region

|h FE |, HIGH FREQUENCY CURRENT GAIN

10

4.0
3.0
2.0

VCE = 5.0 V
f = 100 MHz
TA = 25C

1.0
0.4
0.2
0.1
1.0 2.0

5.0

10

20

50

100 200

500

1K

IC, COLLECTOR CURRENT (mA)

Figure 4. High Frequency Current Gain

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2411

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistor


PNP Silicon

MMBTA70LT1

COLLECTOR
3

1
BASE
2
EMITTER

MAXIMUM RATINGS

3
1

Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

40

Vdc

EmitterBase Voltage

VEBO

4.0

Vdc

IC

100

mAdc

Collector Current Continuous

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

DEVICE MARKING
MMBTA70LT1 = M2C

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR-5 Board,(1)
TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

Symbol

Max

Unit

PD

225

mW

1.8

mW/C

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

EmitterBase Breakdown Voltage


(IE = 100 Adc, IC = 0)

V(BR)EBO

4.0

Vdc

ICBO

100

nAdc

DC Current Gain
(IC = 5.0 mAdc, VCE = 10 Vdc)

hFE

40

400

CollectorEmitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.25

Vdc

fT

125

MHz

Cobo

4.0

pF

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ON CHARACTERISTICS

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 5.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
1. FR5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.

2412

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBTA70LT1
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
10
7.0
IC = 10 A

5.0

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

1.0
7.0
5.0

BANDWIDTH = 1.0 Hz
RS 0

30 A
3.0

100 A
300 A

1.0 mA

2.0

BANDWIDTH = 1.0 Hz
RS
IC = 1.0 mA

3.0
2.0

300 A

1.0
0.7
0.5

100 A
30 A

0.3
0.2

1.0

10 A

0.1
10

20

50

100 200
500 1.0 k
f, FREQUENCY (Hz)

2.0 k

5.0 k

10

10 k

20

50

Figure 1. Noise Voltage

100 200
500 1.0 k 2.0 k
f, FREQUENCY (Hz)

5.0 k

10 k

Figure 2. Noise Current

NOISE FIGURE CONTOURS

1.0 M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100

RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

(VCE = 5.0 Vdc, TA = 25C)

5.0 dB
10

20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

1.0 M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100

500 700 1.0 k

5.0 dB
10

20

RS , SOURCE RESISTANCE (OHMS)

Figure 3. Narrow Band, 100 Hz

1.0 M
500 k

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700 1.0 k

Figure 4. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is Defined as:

20 k
10 k

NF
0.5 dB

5.0 k
2.0 k
1.0 k
500

1.0 dB
2.0 dB
3.0 dB
5.0 dB

200
100
10

20

30

50 70 100

200 300

+ 20 log10

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

500 700 1.0 k

IC, COLLECTOR CURRENT (A)

Figure 5. Wideband
Motorola SmallSignal Transistors, FETs and Diodes Device Data

2413

MMBTA70LT1
TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C
25C

200

55C
100
80
60

VCE = 1.0 V
VCE = 10 V

40
0.003 0.005

0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3 0.5 0.7 1.0


2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0

10

20

30

50 70 100

100

1.0
TA = 25C
IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. DC Current Gain

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%
300 A

200 A
150 A

40

100 A
50 A

20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
0.8
VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.5 1.0
2.0
5.0
10
20
IC, COLLECTOR CURRENT (mA)

Figure 9. On Voltages

2414

40

Figure 8. Collector Characteristics

1.4

0.2

250 A

60

Figure 7. Collector Saturation Region

0.1

IB = 400 A
350 A

50

100

1.6
*APPLIES for IC/IB hFE/2
0.8
*qVC for VCE(sat)

25C to 125C

0
55C to 25C
0.8
25C to 125C
1.6

2.4
0.1

qVB for VBE


0.2

55C to 25C

0.5
1.0 2.0
5.0
10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 10. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBTA70LT1
TYPICAL DYNAMIC CHARACTERISTICS
500
300
200

200

100
70
50
30
tr

20
10
7.0
5.0
1.0

100
70
50

tf

30

td @ VBE(off) = 0.5 V

20

2.0

3.0

50 70

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 12. TurnOff Time

500

10
TJ = 25C

TJ = 25C

7.0
VCE = 20 V

300

Cib
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 11. TurnOn Time

5.0 V
200

100

5.0

3.0
2.0

Cob

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.1

0.2

0.5

1.0

2.0

5.0

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 13. CurrentGain Bandwidth Product

Figure 14. Capacitance

hfe 200
@ IC = 1.0 mA

7.0
5.0

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

3.0
2.0
1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

10

0.2
0.1

10

20

50

200

20
hie , INPUT IMPEDANCE (k )

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

ts

300
t, TIME (ns)

t, TIME (ns)

1000
700
500

VCC = 3.0 V
IC/IB = 10
TJ = 25C

100
70
50
30
20

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C
hfe 200
@ IC = 1.0 mA

10
7.0
5.0
3.0

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 15. Input Impedance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 16. Output Admittance

2415

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

MMBTA70LT1
1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

1.0

t2
2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 17. Thermal Response

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 V
103
ICEO

102
101

ICBO
AND
ICEX @ VBE(off) = 3.0 V

A train of periodical power pulses can be represented by the model


as shown in Figure 19. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 17 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 17 by the
steady state value RJA.

101

Example:
Dissipating 2.0 watts peak under the following conditions:
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
Using Figure 17 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.

102

The peak rise in junction temperature is therefore


T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.

100

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

For more information, see AN569.

Figure 18. Typical Collector Leakage Current

2416

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistors

MMBTA92LT1*
MMBTA93LT1

COLLECTOR
3

PNP Silicon

*Motorola Preferred Device

1
BASE
2
EMITTER

MAXIMUM RATINGS
Rating

Symbol

MMBTA92

MMBTA93

Unit

Collector Emitter Voltage

VCEO

300

200

Vdc

Collector Base Voltage

VCBO

300

200

Vdc

Emitter Base Voltage

VEBO

5.0

5.0

Vdc

Collector Current Continuous

IC

500

1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

mAdc

DEVICE MARKING
MMBTA92LT1 = 2D; MMBTA93LT1 = 2E

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR5 Board,(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

300
200

300
200

5.0

0.25
0.25

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(3)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
MMBTA92
MMBTA93
V(BR)CBO
MMBTA92
MMBTA93

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 200 Vdc, IE = 0)
(VCB = 160 Vdc, IE = 0)

Vdc

V(BR)EBO

Vdc

Adc

ICBO
MMBTA92
MMBTA93

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

Vdc

Adc

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2417

MMBTA92LT1 MMBTA93LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

Both Types
Both Types

25
40

MMBTA92
MMBTA93

25
25

0.5
0.5

VBE(sat)

0.9

Vdc

fT

50

MHz

6.0
8.0

ON CHARACTERISTICS(3)
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)
Collector Emitter Saturation Voltage
(IC = 20 mAdc, IB = 2.0 mAdc)

hFE

VCE(sat)
MMBTA92
MMBTA93

BaseEmitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)
3. Pulse Test: Pulse Width

2418

v 300 ms, Duty Cycle v 2.0%.

Ccb
MMBTA92
MMBTA93

pF

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBTA92LT1 MMBTA93LT1
150

TJ = +125C

VCE = 10 Vdc

hFE, DC CURRENT GAIN

100
+25C
70
50

55C

30
20
15
1.0

2.0

3.0

5.0

7.0

10

20

30

50

80

100

IC, COLLECTOR CURRENT (mA)

100
50
C, CAPACITANCE (pF)

Cib
20
10
5.0

2.0
Ccb
1.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100200 500 1000
VR, REVERSE VOLTAGE (VOLTS)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 1. DC Current Gain

100
TJ = 25C
VCE = 20 Vdc

80
60
40
30
20

0
1.0

Figure 2. Capacitances

2.0

5.0
10
20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 3. CurrentGain Bandwidth Product

1.0

V, VOLTAGE (VOLTS)

0.8
VBE @ VCE = 10 V
0.6

0.4

0.2

0
1.0

VCE(sat) @ IC/IB = 10 mA

2.0

5.0
10
20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 4. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2419

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBTH10LT1

VHF/UHF Transistor

NPN Silicon

COLLECTOR
3

Motorola Preferred Device

1
BASE
3

2
EMITTER

1
2

CASE 318-08, STYLE 6


SOT-23 (TO-236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

25

Vdc

CollectorBase Voltage

VCBO

30

Vdc

EmitterBase Voltage

VEBO

3.0

Vdc

DEVICE MARKING
MMBTH10LT1 = 3EM

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR-5 Board (1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate, (2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

CollectorEmitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)

V(BR)CEO

25

Vdc

CollectorBase Breakdown Voltage (IC = 100 Adc, IE = 0)

V(BR)CBO

30

Vdc

EmitterBase Breakdown Voltage (IE = 10 Adc, IC = 0)

OFF CHARACTERISTICS

V(BR)EBO

3.0

Vdc

Collector Cutoff Current (VCB = 25 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current (VEB = 2.0 Vdc, IC = 0)

IEBO

100

nAdc

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina

Preferred devices are Motorola recommended choices for future use and best overall value.

2420

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBTH10LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

hFE

60

VCE(sat)

0.5

Vdc

VBE

0.95

Vdc

fT

650

MHz

CollectorBase Capacitance
(VCB= 10 Vdc, IE = 0, f = 1.0 MHz)

Ccb

0.7

pF

CommonBase Feedback Capacitance


(VCB= 10 Vdc, IE = 0, f = 1.0 MHz)

Crb

0.65

pF

rbCc

9.0

ps

ON CHARACTERISTICS
DC Current Gain (IC = 4.0 mAdc, VCE = 10 Vdc)
CollectorEmitter Saturation Voltage (IC = 4.0 mAdc, IB = 0.4 mAdc)
BaseEmitter On Voltage (IC = 4.0 mAdc, VCE = 10 Vdc)
SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 4.0 mAdc, VCE = 10 Vdc, f = 100 MHz)

Collector Base Time Constant


(IC= 4.0 mAdc, VCB = 10 Vdc, f = 31.8 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2421

MMBTH10LT1
TYPICAL CHARACTERISTICS

COMMONBASE y PARAMETERS versus FREQUENCY


(VCB = 10 Vdc, IC = 4.0 mAdc, TA = 25C)
yib, INPUT ADMITTANCE
0

70

gib

10

60
20

50

jb ib (mmhos)

y ib , INPUT ADMITTANCE (mmhos)

80

bib

40
30

1000 MHz
30
700

40

20

400

10
0

200

50

100

200
300
400 500
f, FREQUENCY (MHz)

700

60

1000

20

10

Figure 1. Rectangular Form

30

40
50
gib (mmhos)

60

100

70

80

Figure 2. Polar Form

70

60
bfb

60

400

200
50

50

600

100

40

700

gfb

30

jb fb (mmhos)

y ib , FORWARD TRANSFER ADMITTANCE (mmhos)

yfb, FORWARD TRANSFER ADMITTANCE

20
10

40

30
1000 MHz

0
10

20

20
30

10
100

200
300
400 500
f, FREQUENCY (MHz)

Figure 3. Rectangular Form

2422

700

1000

70

60

50

40

10
30
20
gfb (mmhos)

10

20 30

Figure 4. Polar Form

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBTH10LT1
TYPICAL CHARACTERISTICS

COMMONBASE y PARAMETERS versus FREQUENCY


(VCB = 10 Vdc, IC = 4.0 mAdc, TA = 25C)

5.0

4.0

1.0

100
MPS H11

200

jb rb (mmhos)

y rb , REVERSE TRANSFER ADMITTANCE (mmhos)

yrb, REVERSE TRANSFER ADMITTANCE

3.0

400

2.0

brb
brb

2.0

3.0
700

MPS H10

1.0

4.0
grb

100

200
300
400 500
f, FREQUENCY (MHz)

1000 MHz
700

1000

5.0
2.0 1.8 1.2 0.8

Figure 5. Rectangular Form

0.4
0
0.4
grb (mmhos)

0.8

1.2

1.6

2.0

Figure 6. Polar Form

yob, OUTPUT ADMITTANCE


10
1000 MHz
8.0

8.0
7.0

700
jb ob(mmhos)

yob, OUTPUT ADMITTANCE (mmhos)

10
9.0

6.0
5.0

bob

4.0

6.0

4.0

400

3.0

200

2.0

2.0
gob

1.0

100

0
100

200
300
400 500
f, FREQUENCY (MHz)

700

1000

Figure 7. Rectangular Form

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2.0

4.0
6.0
gob (mmhos)

8.0

10

Figure 8. Polar Form

2423

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBTH24LT1

VHF Mixer Transistor


NPN Silicon

Motorola Preferred Device

COLLECTOR
3

Designed for
fT = 400 MHz Min @ 8 mA

1
BASE
3

2
EMITTER

1
2

CASE 318-08, STYLE 6


SOT-23 (TO-236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

30

Vdc

CollectorBase Voltage

VCBO

40

Vdc

EmitterBase Voltage

VEBO

4.0

Vdc

IC

50

mAdc

Collector Current Continuous

DEVICE MARKING
MMBTH24LT1 = M3A

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR-5 Board (1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate, (2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

CollectorEmitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)

V(BR)CEO

30

Vdc

CollectorBase Breakdown Voltage (IC = 100 Adc, IE = 0)

V(BR)CBO

40

Vdc

EmitterBase Breakdown Voltage (IE = 10 Adc, IC = 0)

V(BR)EBO

4.0

Vdc

ICBO

50

nAdc

OFF CHARACTERISTICS

Collector Cutoff Current (VCB = 15 Vdc, IE = 0)


1. FR5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina

Preferred devices are Motorola recommended choices for future use and best overall value.

2424

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBTH24LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

hFE

30

fT

400

620

MHz

Ccb

0.25

0.45

pF

dB

19

24

24

20

ON CHARACTERISTICS
DC Current Gain (IC = 8.0 mAdc, VCE = 10 Vdc)
SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product(3)
(IC = 8.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB= 10 Vdc, IE = 0, f = 1.0 MHz)
Conversion Gain
(213 MHz to 45 MHz)
(IC= 8.0 mAdc, VCC = 20 Vdc, Oscillator Injection = 150 mVrms)
(60 MHz to 45 MHz)
(IC = 8.0 mAdc, VCC = 20 Vdc, Oscillator Injection = 150 mVrms)

CG

3. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2425

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

UHF/VHF Transistor

MMBTH69LT1

COLLECTOR
3

PNP Silicon

Motorola Preferred Device

Designed for UHF/VHF Amplifier Applications

1
BASE

High Current Gain Bandwidth Product


fT = 2000 MHz Min @ 10 mA

2
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

15

Vdc

CollectorBase Voltage

VCBO

15

Vdc

EmitterBase Voltage

VEBO

4.0

Vdc

1
2

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

DEVICE MARKING
MMBTH69LT1 = M3J

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR-5 Board (1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate, (2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

CollectorEmitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)

V(BR)CEO

15

Vdc

CollectorBase Breakdown Voltage (IC = 10 Adc, IE = 0)

V(BR)CBO

15

Vdc

EmitterBase Breakdown Voltage (IE = 10 Adc, IC = 0)

V(BR)EBO

4.0

Vdc

ICBO

100

nAdc

hFE

30

300

fT

2000

MHz

Crb

0.35

pF

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current (VCB = 10 Vdc, IE = 0)

ON CHARACTERISTICS
DC Current Gain (IC = 10 mAdc, VCE = 10 Vdc)

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCE = 10 Vdc, IE = 0, f = 1.0 MHz)
1. FR5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina
Preferred devices are Motorola recommended choices for future use and best overall value.

2426

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

UHF/VHF Transistor

MMBTH81LT1

COLLECTOR
3

PNP Silicon

Motorola Preferred Device

1
BASE
2
EMITTER

MAXIMUM RATINGS

3
1

Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

20

Vdc

CollectorBase Voltage

VCBO

20

Vdc

EmitterBase Voltage

VEBO

3.0

Vdc

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

DEVICE MARKING
MMBTH81LT1 = 3D

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

PD

225

mW

1.8

mW/C

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation FR-5 Board,(1)


TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

CollectorEmitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)

V(BR)CEO

20

Vdc

CollectorBase Breakdown Voltage (IC = 10 Adc, IE = 0)

V(BR)CBO

20

Vdc

EmitterBase Breakdown Voltage (IE = 10 Adc, IC = 0)

V(BR)EBO

3.0

Vdc

Collector Cutoff Current (VCB = 10 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current (VEB = 2.0 Vdc, IC = 0)

IEBO

100

nAdc

hFE

60

CollectorEmitter Saturation Voltage (IC = 5.0 mAdc, IB = 0.5 mAdc)

VCE(sat)

0.5

Vdc

BaseEmitter On Voltage (IC = 5.0 mAdc, VCE = 10 Vdc)

VBE(on)

0.9

Vdc

fT

600

MHz

CollectorBase Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Ccb

0.85

pF

CollectorEmitter Capacitance (IB = 0, VCB = 10 Vdc, f = 1.0 MHz)

Cce

0.65

pF

OFF CHARACTERISTICS

ON CHARACTERISTICS
DC Current Gain (IC = 5.0 mAdc, VCE = 10 Vdc)

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 5.0 mAdc, VCE = 10 Vdc, f = 100 MHz)

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2427

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad General Purpose


Transistors
NPN Silicon

16

15

14

13

12

11

10

MMPQ2222
MMPQ2222A*
*Motorola Preferred Device

16

MAXIMUM RATINGS

Rating

Symbol

MMPQ2222

MMPQ2222A

Unit

VCEO

30

40

Vdc

Collector Base Voltage

VCB

60

75

Vdc

Emitter Base Voltage

VEB

5.0

Vdc

IC

500

mAdc

Collector Emitter Voltage

Collector Current Continuous

Total Power Dissipation


@ TA = 25C
Derate above 25C

PD

Total Power Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage


Junction Temperature Range

Each
Transistor

Four
Transistors
Equal Power

0.52
4.2

1.0
8.0

0.8
6.4

2.4
19.2

CASE 751B05, STYLE 4


SO16

Watts
mW/C
Watts

TJ, Tstg

mW/C
C

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 10 mAdc, IB = 0)

MMPQ2222
MMPQ2222A

V(BR)CEO

30
40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

MMPQ2222
MMPQ2222A

V(BR)CBO

60
75

Vdc

V(BR)EBO

5.0

Vdc

50
10

100

Emitter Base Breakdown Voltage


(IB = 10 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 50 Vdc, IE = 0)
(VCB = 60 Vdc, IE = 0)

ICBO
MMPQ2222
MMPQ2222A

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)
1. Pulse Test: Pulse Width

IEBO

nAdc

nAdc

v 300 ms; Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2428

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMPQ2222 MMPQ2222A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Typ

Max

35
50
75
75
100
100
30
40
50

300

0.4
0.3
1.6
1.0

1.3
1.2
2.6
2.0

fT

200

350

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cob

4.5

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cib

17

pF

TurnOn Time
(VCC = 30 Vdc, VBE(off) = 0.5 Vdc, IC = 150 mAdc,
IB1 = 15 mAdc)

ton

25

ns

TurnOff Time
(VCC = 30 Vdc, IC = 150 mAdc, IB1 = IB2 = 15 mAdc)

toff

250

ns

Characteristic

Unit

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 100 mA, VCE = 10 V)
(IC = 1.0 mA, VCE = 10 V)
(IC = 10 mA, VCE = 10 V)
(IC = 150 mA, VCE = 10 V)
(IC = 300 mA, VCE = 10 V)
(IC = 500 mA, VCE = 10 V)
(IC = 150 mA, VCE = 1.0 V)
Collector Emitter Saturation Voltage(1)
(IC = 150 mAdc, IB = 15 mAdc)
(IC = 300 mAdc, IB = 30 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)
Base Emitter Saturation Voltage(1)
(IC = 150 mAdc, IB = 15 mAdc)
(IC = 300 mAdc, IB = 30 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

hFE
MMPQ2222A
MMPQ2222A
MMPQ2222
MMPQ2222A
MMPQ2222
MMPQ2222A
MMPQ2222
MMPQ2222A
MMPQ2222A

VCE(sat)
MMPQ2222
MMPQ2222A
MMPQ2222
MMPQ2222A

Vdc

VBE(sat)
MMPQ2222
MMPQ2222A
MMPQ2222
MMPQ2222A

Vdc

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product(1)
(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2429

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Switching
Transistor

MMPQ2369

NPN Silicon

16

15

14

13

12

11

10

Motorola Preferred Device

16
1

CASE 751B05, STYLE 4


SO16

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VCEO

15

Vdc

Collector Base Voltage

VCB

40

Vdc

Emitter Base Voltage

VEB

4.5

Vdc

IC

500

mAdc

Collector Emitter Voltage

Collector Current Continuous

Total Power Dissipation


@ TA = 25C
Derate above 25C

PD

Total Power Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage


Junction Temperature Range

Each
Transistor

Four
Transistors
Equal Power

0.4
3.2

0.72
6.4

0.66
5.3

1.92
15.4

Watts
mW/C
Watts

TJ, Tstg

mW/C
C

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

15

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

4.5

Vdc

ICBO

0.4

mAdc

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)
1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

2430

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMPQ2369
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

40
20

Unit

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 2.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.25

Vdc

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

0.9

Vdc

fT

450

550

MHz

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cob

2.5

4.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cib

3.0

5.0

pF

TurnOn Time
(VCC = 3.0 Vdc, VEB(off) = 1.5 Vdc, IC = 10 mAdc,
IB1 = 3.0 mAdc)

ton

9.0

ns

TurnOff Time
(VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc, IB2 = 1.5 mAdc)

toff

15

ns

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2431

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad General Purpose


Transistors

MMPQ2907
MMPQ2907A

PNP Silicon

16

15

14

13

12

11

10

16
1

CASE 751B05, STYLE 4


SO16

MAXIMUM RATINGS
Rating
Collector Emitter Voltage

Symbol

MMPQ2907

MMPQ2907A

Unit

VCEO

40

60

Vdc

Collector Base Voltage

VCB

Emitter Base Voltage

VEB

5.0

Vdc

IC

600

mAdc

Collector Current Continuous

60

Vdc

Each
Transistor

Four
Transistors
Equal Power

Total Power Dissipation @ TA = 25C


Derate above 25C

PD

0.52
4.2

1.0
8.0

Watts
mW/C

Total Power Dissipation @ TC = 25C


Derate above 25C

PD

0.8
6.4

2.4
19.2

Watts
mW/C

Operating and Storage Junction


Temperature Range

TJ, Tstg

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)CEO

40
60

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

50
10

50

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 10 mAdc, IB = 0)

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)
(VCB = 50 Vdc, IE = 0)
Emitter Cutoff Current
(VEB = 3.0 Vdc, IC = 0)
1. Pulse Test: Pulse Width

MMPQ2907
MMPQ2907A

ICBO
MMPQ2907
MMPQ2907A
IEBO

nAdc

nAdc

v 300 ms, Duty Cycle = 2.0%.

REV 1

2432

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMPQ2907 MMPQ2907A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Typ

Max

75
100
75/100
100
30/50
50

300

0.4
1.6
1.6

1.3
2.6
2.6

fT

200

350

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cob

6.0

pF

Input Capacitance
(VEB = 2.0 Vdc, IC = 0, f = 1.0 MHz)

Cib

20

pF

TurnOn Time
(VCC = 30 Vdc, IC = 150 mAdc, IB1 = 15 mAdc)

ton

30

ns

TurnOff Time
(VCC = 6.0 Vdc, IC = 150 mAdc, IB1 = IB2 = 15 mAdc)

toff

100

ns

Characteristic

Unit

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 100 Adc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 150 mAdc, VCE = 10 Vdc)
(IC = 300 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 10 Vdc)

MMPQ2907A
MMPQ2907A
MMPQ2907/2907A
MMPQ2907/2907A
MMPQ2907/2907A
MMPQ2907/2907A

Collector Emitter Saturation Voltage(1)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 300 mAdc, IB = 30 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

MMPQ2907
MMPQ2907
MMPQ2907

Base Emitter Saturation Voltage(1)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 300 mAdc, IB = 30 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

MMPQ2907
MMPQ2907
MMPQ2907A

hFE

VCE(sat)

Vdc

VBE(sat)

Vdc

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product(1)
(IC = 50 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle = 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2433

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Memory Driver


Transistor

MMPQ3467

PNP Silicon

16

15

14

13

12

11

10

Motorola Preferred Device

16
1

CASE 751B05, STYLE 4


SO16

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VCEO

40

Vdc

Collector Base Voltage

VCB

40

Vdc

Emitter Base Voltage

VEB

5.0

Vdc

IC

1.0

Adc

Collector Emitter Voltage

Collector Current Continuous

Each
Transistor

Four
Transistors
Equal Power

Power Dissipation @ TA = 25C


Derate above 25C

PD

0.52
4.2

1.2
9.6

Watts
mW/C

Power Dissipation @ TC = 25C


Derate above 25C

PD

1.0
8.0

2.5
20

Watts
mW/C

Operating and Storage Junction


Temperature Range

TJ, Tstg

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

200

nAdc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

200

nAdc

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2434

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMPQ3467
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Typ

Max

Unit

hFE

20

VCE(sat)

0.23

0.5

Vdc

VBE(sat)

0.9

1.2

Vdc

fT

190

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cob

10

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cib

55

pF

TurnOn Time
(IC = 500 mAdc, IB1 = 50 mAdc)

ton

20

ns

TurnOff Time
(IC = 500 mAdc, IB1 = IB2 = 50 mAdc)

toff

60

ns

Characteristic

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 500 mAdc, VCE = 1.0 Vdc)
Collector Emitter Saturation Voltage(1)
(IC = 500 mAdc, IB = 50 mAdc)
Base Emitter Saturation Voltage(1)
(IC = 500 mAdc, IB = 50 mAdc)

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 50 mAdc, VCE = 10 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2435

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Core Driver


Transistor

MMPQ3725

NPN Silicon

16

15

14

13

12

11

10

Motorola Preferred Device

16
1

CASE 751B05, STYLE 4


SO16

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Emitter Voltage

VCES

60

Vdc

Emitter Base Voltage

VEB

5.0

Vdc

Collector Current Continuous

IC

1.0

Adc

Operating and Storage Junction


Temperature Range

TJ, Tstg

55 to +150

Each
Transistor

Four
Transistors
Equal Power

Total Power Dissipation @ TA = 25C


Derate above 25C

PD

0.6
4.8

1.4
11.2

Watts
mW/C

Power Dissipation @ TC = 25C


Derate above 25C

PD

1.0
8.0

2.5
2.0

Watts
mW/C

Operating and Storage Junction


Temperature Range

TJ, Tstg

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, VBE = 0)

V(BR)CES

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

ICBO

0.5

mAdc

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 40 Vdc, IE = 0)
1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2436

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMPQ3725
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

35
25

75
45

200

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 500 mAdc, VCE = 2.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

0.32

0.45

Vdc

Base Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

0.8

0.9

1.1

Vdc

fT

275

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cob

5.1

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cib

62

pF

TurnOn Time
(IC = 500 mAdc, IB1 = 50 mAdc, VBE(off) = 3.8 Vdc)

ton

20

ns

TurnOff Time
(IC = 500 mAdc, IB1 = IB2 = 50 mAdc)

toff

50

ns

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 50 mAdc, VCE = 10 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2437

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA


Quad Amplifier/Switch
Transistor

MMPQ3904

NPN Silicon

16

15

14

13

12

11

10

Motorola Preferred Device

16
1

CASE 751B05, STYLE 4


SO16

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VCEO

40

Vdc

Collector Base Voltage

VCB

60

Vdc

Emitter Base Voltage

VEB

6.0

Vdc

IC

200

mAdc

Collector Emitter Voltage

Collector Current Continuous

Total Power Dissipation


@ TA = 25C
Derate above 25C

PD

Total Power Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage


Junction Temperature Range

Each
Transistor

Four
Transistors
Equal Power

0.4
3.2

800
6.4

0.66
5.3

1.92
15.4

mW
mW/C
Watts

TJ, Tstg

mW/C
C

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

6.0

Vdc

Collector Cutoff Current


(VCB = 40 Vdc, IE = 0)

ICBO

50

nAdc

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

50

nAdc

Characteristic

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2438

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMPQ3904
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

30
50
75

90
160
200

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.1

0.2

Vdc

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

0.65

0.85

Vdc

fT

250

300

MHz

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cob

2.0

4.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cib

4.0

8.0

pF

TurnOn Time
(IC = 10 Vdc, VBE(off) = 0.5 Vdc, IB1 = 1.0 mAdc)

ton

37

ns

TurnOff Time
(IC = 10 mAdc, IB1 = IB2 = 1.0 mAdc)

toff

136

ns

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2439

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA


Quad Amplifier/Switch
Transistor

MMPQ3906

PNP Silicon

16

15

14

13

12

11

10

Motorola Preferred Device

16
1

CASE 751B05, STYLE 4


SO16

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VCEO

40

Vdc

Collector Base Voltage

VCB

40

Vdc

Emitter Base Voltage

VEB

5.0

Vdc

IC

200

mAdc

Collector Emitter Voltage

Collector Current Continuous

Each
Transistor

Four
Transistors
Equal Power

Power Dissipation @ TA = 25C


Derate above 25C

PD

0.4
3.2

800
6.4

mW
mW/C

Power Dissipation @ TC = 25C


Derate above 25C

PD

0.66
5.3

1.92
15.4

Watts
mW/C

Operating and Storage Junction


Temperature Range

TJ, Tstg

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

50

nAdc

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

50

nAdc

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2440

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMPQ3906
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

40
60
75

160
180
200

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.1

0.25

Vdc

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

0.65

0.85

Vdc

fT

200

250

MHz

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cob

3.3

4.5

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cib

4.8

10

pF

TurnOn Time
(IC = 10 mAdc, VBE(off) = 0.5 Vdc, IB1 = 1.0 mAdc)

ton

43

ns

TurnOff Time
(IC = 10 mAdc, IB1 = IB2 = 1.0 mAdc)

toff

155

ns

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2441

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Complementary Pair


Transistor
PNP/NPN Silicon

16

15

14

13

12

11

10

MMPQ6700
Voltage and current are negative
for PNP transistors

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VCEO

40

Vdc

Collector Base Voltage

VCB

40

Vdc

Emitter Base Voltage

VEB

5.0

Vdc

IC

200

mAdc

Collector Emitter Voltage

Collector Current Continuous

Each
Transistor

Four
Transistors
Equal Power

Total Power Dissipation @ TA = 25C


Derate above 25C

PD

0.4
3.2

0.72
6.4

Watts
mW/C

Total Power Dissipation @ TC = 25C


Derate above 25C

PD

0.66
5.3

1.92
15.4

Watts
mW/C

Operating and Storage Junction


Temperature Range

TJ, Tstg

55 to +150

16
1

CASE 751B05, STYLE 4


SO16

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage (IC = 10 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage (IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current (VCB = 30 Vdc, IE = 0)

ICBO

50

nAdc

Emitter Cutoff Current (VEB = 4.0 Vdc, IC = 0)

IEBO

50

nAdc

35
50
70

Characteristic

OFF CHARACTERISTICS

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage (IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.25

Vdc

Base Emitter Saturation Voltage (IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

0.9

Vdc

fT

200

MHz

Cob

4.5

pF

10
8.0

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product(1)
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

2442

Cib
PNP
NPN

v 300 ms, Duty Cycle v 2.0%.

pF

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad MPU Clock Buffer


Transistor
NPN/PNP Silicon

16

15

14

13

12

11

10

MMPQ6842
Voltage and current are negative
for PNP transistors

16
1

CASE 751B05, STYLE 4


SO16

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VCEO

30

Vdc

Collector Base Voltage

VCB

30

Vdc

Emitter Base Voltage

VEB

4.0

Vdc

IC

200

mAdc

Collector Emitter Voltage

Collector Current Continuous

Total Power Dissipation


@ TA = 25C
Derate above 25C

PD

Total Power Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage


Junction Temperature Range

Each
Transistor

Four
Transistors
Equal Power

0.4
3.2

0.72
6.4

0.66
5.3

1.92
15.4

Watts
mW/C
Watts

TJ, Tstg

mW/C
C

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

30

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

30

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

4.0

Vdc

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)

ICBO

50

nAdc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

50

nAdc

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2443

MMPQ6842
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Typ

Max

30
50
70

VCE(sat)

0.05

0.15

Vdc

VBE(sat)

0.65

0.9

Vdc

fT

200

350

MHz

Cob

3.0

4.5

pF

5.0
4.0

10
8.0

tPLH
tPHL

15
6.0

25
15

Rise Time
(0.3 V to 4.7 V, TP3 or TP4)

tr

5.0

25

35

ns

Fall Time
(4.7 V to 0.3 V, TP3 or TP4)

tf

5.0

10

20

ns

Characteristic

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 0.5 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
Collector Emitter Saturation Voltage
(IC = 0.5 mAdc, IB = 0.05 mAdc, 0C

hFE

v T v 70C)

Base Emitter Saturation Voltage


(IC = 0.5 mAdc, IB = 0.05 mAdc)

DYNAMIC CHARACTERISTICS
Current Gain Bandwidth Product(1)
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cib
PNP
NPN

pF

SWITCHING CHARACTERISTICS (TA = 25C, VCC = 5.0 Vdc)


Propagation Delay Time
(50% Points TP1 to TP3)
(50% Points TP2 to TP4)

1. Pulse Test: Pulse Width

2444

ns

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Bias Resistor Transistor

MMUN2111LT1
SERIES

PNP Silicon Surface Mount Transistor with


Monolithic Bias Resistor Network

Motorola Preferred Devices

This new series of digital transistors is designed to replace a single device and its
external resistor bias network. The BRT (Bias Resistor Transistor) contains a single
transistor with a monolithic bias network consisting of two resistors; a series base
resistor and a base-emitter resistor. The BRT eliminates these individual components
by integrating them into a single device. The use of a BRT can reduce both system
cost and board space. The device is housed in the SOT-23 package which is
designed for low power surface mount applications.

PNP SILICON
BIAS RESISTOR
TRANSISTOR

Simplifies Circuit Design


PIN 3
COLLECTOR
(OUTPUT)

Reduces Board Space


Reduces Component Count
The SOT-23 package can be soldered using wave or
reflow. The modified gull-winged leads absorb thermal
stress during soldering eliminating the possibility of
PIN 1
damage to the die.
BASE

R1
1

R2

Available in 8 mm embossed tape and reel. Use the (INPUT)


Device Number to order the 7 inch/3000 unit reel.
Replace T1 with T3 in the Device Number to order
the 13 inch/10,000 unit reel.

CASE 318-08, STYLE 6


SOT-23 (TO-236AB)

PIN 2
EMITTER
(GROUND)

MAXIMUM RATINGS (TA = 25C unless otherwise noted)


Symbol

Value

Unit

Collector-Base Voltage

VCBO

50

Vdc

Collector-Emitter Voltage

VCEO

50

Vdc

Collector Current

IC

100

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

*200
1.6

mW
mW/C

Symbol

Value

Unit

RJA

625

C/W

TJ, Tstg

65 to +150

TL

260
10

C
Sec

Rating

THERMAL CHARACTERISTICS
Rating
Thermal Resistance Junction-to-Ambient (surface mounted)
Operating and Storage Temperature Range
Maximum Temperature for Soldering Purposes,
Time in Solder Bath

DEVICE MARKING AND RESISTOR VALUES


Device

Marking

R1 (K)

R2 (K)

MMUN2111LT1
MMUN2112LT1
MMUN2113LT1
MMUN2114LT1
MMUN2115LT1(2)

A6A
A6B
A6C
A6D
A6E

10
22
47
10
10

10
22
47
47

1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.

Preferred devices are Motorola recommended choices for future use and best overall value.

(Replaces MMUN2111T1/D)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2445

MMUN2111LT1 SERIES
DEVICE MARKING AND RESISTOR VALUES (Continued)
Device

Marking

R1 (K)

R2 (K)

MMUN2116LT1(2)
MMUN2130LT1(2)
MMUN2131LT1(2)
MMUN2132LT1(2)
MMUN2133LT1(2)
MMUN2134LT1(2)

A6F
A6G
A6H
A6J
A6K
A6L

4.7
1.0
2.2
4.7
4.7
22

1.0
2.2
4.7
47
47

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector-Base Cutoff Current (VCB = 50 V, IE = 0)

ICBO

100

nAdc

Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0)

ICEO

500

nAdc

Emitter-Base Cutoff Current


(VEB = 6.0 V, IC = 0)

IEBO

0.5
0.2
0.1
0.2
0.9
1.9
4.3
2.3
1.5
0.18
0.13

mAdc

Collector-Base Breakdown Voltage (IC = 10 A, IE = 0)

V(BR)CBO

50

Vdc

Collector-Emitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0)

V(BR)CEO

50

Vdc

hFE

35
60
80
80
160
160
3.0
8.0
15
80
80

60
100
140
140
250
250
5.0
15
27
140
130

VCE(sat)

0.25

0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2

OFF CHARACTERISTICS

MMUN2111LT1
MMUN2112LT1
MMUN2113LT1
MMUN2114LT1
MMUN2115LT1
MMUN2116LT1
MMUN2130LT1
MMUN2131LT1
MMUN2132LT1
MMUN2133LT1
MMUN2134LT1

ON CHARACTERISTICS(3)
DC Current Gain
(VCE = 10 V, IC = 5.0 mA)

MMUN2111LT1
MMUN2112LT1
MMUN2113LT1
MMUN2114LT1
MMUN2115LT1
MMUN2116LT1
MMUN2130LT1
MMUN2131LT1
MMUN2132LT1
MMUN2133LT1
MMUN2134LT1

Collector-Emitter Saturation Voltage (IC = 10 mA, IE = 0.3 mA)


(IC = 10 mA, IB = 5 mA) MMUN2130LT1/MMUN2131LT1
(IC = 10 mA, IB = 1 mA) MMUN2115LT1/MMUN2116LT1/
MMUN2132LT1/MMUN2133LT1/MMUN2134LT1
Output Voltage (on)
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k)

(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 k)

VOL
MMUN2111LT1
MMUN2112LT1
MMUN2114LT1
MMUN2115LT1
MMUN2116LT1
MMUN2130LT1
MMUN2131LT1
MMUN2132LT1
MMUN2133LT1
MMUN2134LT1
MMUN2113LT1

Vdc

Vdc

2. New devices. Updated curves to follow in subsequent data sheets.


3. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%

2446

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMUN2111LT1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k)


(VCC = 5.0 V, VB = 0.25 V, RL = 1.0 k) MMUN2115LT1
MMUN2116LT1
MMUN2131LT1
MMUN2132LT1
(VCC = 5.0 V, VB = 0.050 V, RL = 1.0 k) MMUN2130LT1

VOH

4.9

Vdc

R1

7.0
15.4
32.9
7.0
7.0
3.3
0.7
1.5
3.3
3.3
15.4

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22

13
28.6
61.1
13
13
6.1
1.3
2.9
6.1
6.1
28.6

R1/R2

0.8
0.17

0.8
0.055

1.0
0.21

1.0
0.1

1.2
0.25

1.2
0.185

Input Resistor

MMUN2111LT1
MMUN2112LT1
MMUN2113LT1
MMUN2114LT1
MMUN2115LT1
MMUN2116LT1
MMUN2130LT1
MMUN2131LT1
MMUN2132LT1
MMUN2133LT1
MMUN2134LT1

Resistor Ratio MMUN2111LT1/MMUN2112LT1/MMUN2113LT1


MMUN2114LT1
MMUN2115LT1/MMUN2116LT1
MMUN2130LT1/MMUN2131LT1/MMUN2132LT1
MMUN2133LT1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2447

MMUN2111LT1 SERIES

PD , POWER DISSIPATION (MILLIWATTS)

250

200

150

100
RJA = 625C/W

50

0
50

50

100

150

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS


MMUN2111LT1

1
IC/IB = 10
TA = 25C
75C
0.1

0.01
20

TA, AMBIENT TEMPERATURE (C)

60

Cob , CAPACITANCE (pF)

VCE = 10 V

TA = 75C
25C
25C

100

10

10
IC, COLLECTOR CURRENT (mA)

100

f = 1 MHz
lE = 0 V
TA = 25C

Figure 3. DC Current Gain

100
75C

VO = 0.2 V
Vin, INPUT VOLTAGE (VOLTS)

0.1

0.001

50

100

25C

0.01

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

Figure 4. Output Capacitance

TA = 25C

10

TA = 25C

10

25C
75C
1

VO = 5 V
0

3
4
5
6
7
Vin, INPUT VOLTAGE (VOLTS)

Figure 5. Output Current versus Input Voltage

2448

80

Figure 2. VCE(sat) versus IC

1000
h FE, DC CURRENT GAIN (NORMALIZED)

40

IC, COLLECTOR CURRENT (mA)

Figure 1. Derating Curve

IC , COLLECTOR CURRENT (mA)

25C

10

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 6. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMUN2111LT1 SERIES

1000

10
h FE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS


MMUN2112LT1

IC/IB = 10
TA = 25C
25C
1

75C

0.1

0.01

VCE = 10 V

TA = 75C
25C
25C

100

10
0

20
40
60
IC, COLLECTOR CURRENT (mA)

80

10

Figure 7. VCE(sat) versus IC

Figure 8. DC Current Gain

100
f = 1 MHz
lE = 0 V
TA = 25C

IC , COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

100

IC, COLLECTOR CURRENT (mA)

25C
TA = 25C

10

0.1
VO = 5 V

0.01

0.001

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

75C

10

Vin, INPUT VOLTAGE (VOLTS)

Figure 9. Output Capacitance

Figure 10. Output Current versus Input Voltage

100
Vin, INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C
25C

10
75C

0.1

10

20

30

40

50

IC, COLLECTOR CURRENT (mA)

Figure 11. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2449

MMUN2111LT1 SERIES

1000
IC/IB = 10

TA = 25C

h FE , CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS


MMUN2113LT1

25C

75C
0.1

0.01

10
20
30
IC, COLLECTOR CURRENT (mA)

TA = 75C
25C
25C
100

10

40

10
IC, COLLECTOR CURRENT (mA)

Figure 12. VCE(sat) versus IC

Figure 13. DC Current Gain

100

Cob , CAPACITANCE (pF)

I C , COLLECTOR CURRENT (mA)

f = 1 MHz
lE = 0 V
TA = 25C

0.8

100

0.6

0.4

0.2

TA = 75C

25C
25C

10
1

0.1

0.01
VO = 5 V

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

50

0.001

10

Vin, INPUT VOLTAGE (VOLTS)

Figure 14. Output Capacitance

Figure 15. Output Current versus Input Voltage

100

Vin , INPUT VOLTAGE (VOLTS)

VO = 2 V
TA = 25C

25C
75C

10

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 16. Input Voltage versus Output Current

2450

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMUN2111LT1 SERIES

180
IC/IB = 10

hFE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS


MMUN2114LT1

TA = 25C
25C

0.1

75C

0.01

0.001

20
40
60
IC, COLLECTOR CURRENT (mA)

25C
140
25C

120
100
80
60
40
20
0

80

TA = 75C

VCE = 10 V

160

Figure 17. VCE(sat) versus IC

90 100

100

TA = 75C

f = 1 MHz
lE = 0 V
TA = 25C

3.5

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

80

Figure 18. DC Current Gain

4.5

3
2.5
2
1.5
1
0.5
0

8 10 15 20 40 50 60 70
IC, COLLECTOR CURRENT (mA)

6 8 10 15 20 25 30 35 40
VR, REVERSE BIAS VOLTAGE (VOLTS)

45

50

Figure 19. Output Capacitance

25C
25C

10

VO = 5 V
1

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 20. Output Current versus Input Voltage

+12 V

10
VO = 0.2 V

TA = 25C

V in , INPUT VOLTAGE (VOLTS)

25C

Typical Application
for PNP BRTs

75C
1

LOAD
0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 21. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 22. Inexpensive, Unregulated Current Source

2451

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Bias Resistor Transistor

MMUN2211LT1
SERIES

NPN Silicon Surface Mount Transistor with


Monolithic Bias Resistor Network

Motorola Preferred Devices

This new series of digital transistors is designed to replace a single device and its
external resistor bias network. The BRT (Bias Resistor Transistor) contains a single
transistor with a monolithic bias network consisting of two resistors; a series base
resistor and a base-emitter resistor. The BRT eliminates these individual components
by integrating them into a single device. The use of a BRT can reduce both system
cost and board space. The device is housed in the SOT-23 package which is
designed for low power surface mount applications.

NPN SILICON
BIAS RESISTOR
TRANSISTOR

Simplifies Circuit Design


PIN 3
COLLECTOR
(OUTPUT)

Reduces Board Space


Reduces Component Count
The SOT-23 package can be soldered using wave or
reflow. The modified gull-winged leads absorb thermal
stress during soldering eliminating the possibility of
damage to the die.
Available in 8 mm embossed tape and reel. Use the
Device Number to order the 7 inch/3000 unit reel.
Replace T1 with T3 in the Device Number to order
the13 inch/10,000 unit reel.

R1
1

PIN 1 R2
BASE
(INPUT)

PIN 2
EMITTER
(GROUND)

CASE 318-08, STYLE 6


SOT-23 (TO-236AB)

MAXIMUM RATINGS (TA = 25C unless otherwise noted)


Symbol

Value

Unit

Collector-Base Voltage

VCBO

50

Vdc

Collector-Emitter Voltage

VCEO

50

Vdc

Collector Current

IC

100

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

*200
1.6

mW
mW/C

RJA

625

C/W

TJ, Tstg

65 to +150

TL

260
10

C
Sec

Rating

THERMAL CHARACTERISTICS
Thermal Resistance Junction-to-Ambient (surface mounted)
Operating and Storage Temperature Range
Maximum Temperature for Soldering Purposes,
Time in Solder Bath

DEVICE MARKING AND RESISTOR VALUES


Device

Marking

R1 (K)

R2 (K)

MMUN2211LT1
MMUN2212LT1
MMUN2213LT1
MMUN2214LT1
MMUN2215LT1(2)
MMUN2216LT1(2)
MMUN2230LT1(2)
MMUN2231LT1(2)
MMUN2232LT1(2)
MMUN2233LT1(2)
MMUN2234LT1(2)

A8A
A8B
A8C
A8D
A8E
A8F
A8G
A8H
A8J
A8K
A8L

10
22
47
10
10
4.7
1
22
2.2
4.7
4.7
22

10
22
47
47

1
22
2.2
4.7
47
47

1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.

(Replaces MMUN2211T1/D)

2452

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMUN2211LT1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

Collector-Base Cutoff Current (VCB = 50 V, IE = 0)

ICBO

100

nAdc

Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0)

ICEO

500

nAdc

IEBO

0.5
0.2
0.1
0.2
0.9
1.9
4.3
2.3
1.5
0.18
0.13

mAdc

Collector-Base Breakdown Voltage (IC = 10 A, IE = 0)

V(BR)CBO

50

Vdc

Collector-Emitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0)

V(BR)CEO

50

Vdc

hFE

35
60
80
80
160
160
3.0
8.0
15
80
80

60
100
140
140
350
350
5.0
15
30
200
150

VCE(sat)

0.25

0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2

4.9

OFF CHARACTERISTICS

Emitter-Base Cutoff Current


(VEB = 6.0 V, IC = 0)

MMUN2211LT1
MMUN2212LT1
MMUN2213LT1
MMUN2214LT1
MMUN2215LT1
MMUN2216LT1
MMUN2230LT1
MMUN2231LT1
MMUN2232LT1
MMUN2233LT1
MMUN2234LT1

ON CHARACTERISTICS(3)
DC Current Gain
(VCE = 10 V, IC = 5.0 mA)

MMUN2211LT1
MMUN2212LT1
MMUN2213LT1
MMUN2214LT1
MMUN2215LT1
MMUN2216LT1
MMUN2230LT1
MMUN2231LT1
MMUN2232LT1
MMUN2233LT1
MMUN2234LT1

Collector-Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA)


(IC = 10 mA, IB = 5 mA) MMUN2230LT1/MMUN2231LT1
(IC = 10 mA, IB = 1 mA) MMUN2215LT1/MMUN2216LT1
MMUN2232LT1/MMUN2233LT1/MMUN2234LT1
Output Voltage (on)
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k )

(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 k )

VOL
MMUN2211LT1
MMUN2212LT1
MMUN2214LT1
MMUN2215LT1
MMUN2216LT1
MMUN2230LT1
MMUN2231LT1
MMUN2232LT1
MMUN2233LT1
MMUN2234LT1
MMUN2213LT1

Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k )


(VCC = 5.0 V, VB = 0.050 V, RL = 1.0 k )
MMUN2230LT1
(VCC = 5.0 V, VB = 0.25 V, RL = 1.0 k )
MMUN2215LT1
MMUN2216LT1
MMUN2233LT1

VOH

Vdc

Vdc

Vdc

3. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2453

MMUN2211LT1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

R1

7.0
15.4
32.9
7.0
7.0
3.3
0.7
1.5
3.3
3.3
15.4

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22

13
28.6
61.1
13
13
6.1
1.3
2.9
6.1
6.1
28.6

R1/R2

0.8
0.17

0.8
0.055
0.38

1.0
0.21

1.0
0.1
0.47

1.2
0.25

1.2
0.185
0.56

ON CHARACTERISTICS(3)
Input Resistor

MMUN2211LT1
MMUN2212LT1
MMUN2213LT1
MMUN2214LT1
MMUN2215LT1
MMUN2216LT1
MMUN2230LT1
MMUN2231LT1
MMUN2232LT1
MMUN2233LT1
MMUN2234LT1

Resistor Ratio

MMUN2211LT1/MMUN2212LT1/MMUN2213LT1
MMUN2214LT1
MMUN2215LT1/MMUN2216LT1
MMUN2230LT1/MMUN2231LT1/MMUN2232LT1
MMUN2233LT1
MMUN2234LT1

3. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%.

2454

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMUN2211LT1 SERIES

PD , POWER DISSIPATION (MILLIWATTS)

250

200

150

100
RJA = 625C/W

50

50

0
50
100
TA, AMBIENT TEMPERATURE (C)

150

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS


MMUN2211LT1
1
IC/IB = 10
TA = 25C
25C
75C

0.1

0.01

0.001

20
40
60
IC, COLLECTOR CURRENT (mA)

Figure 1. Derating Curve

Figure 2. VCE(sat) versus IC

4
VCE = 10 V
TA = 75C
25C
25C

Cob , CAPACITANCE (pF)

h FE, DC CURRENT GAIN (NORMALIZED)

1000

100

10

10
IC, COLLECTOR CURRENT (mA)

100

f = 1 MHz
lE = 0 V
TA = 25C

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

100

10

25C
TA = 25C

Vin, INPUT VOLTAGE (VOLTS)

IC , COLLECTOR CURRENT (mA)

TA = 25C

VO = 0.2 V

75C
10

50

Figure 4. Output Capacitance

Figure 3. DC Current Gain

0.1

0.01

0.001

80

25C
75C
1

VO = 5 V
0

5
6
7
3
4
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 5. VCE(sat) versus IC

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.1

10

20
30
40
IC, COLLECTOR CURRENT (mA)

50

Figure 6. VCE(sat) versus IC

2455

MMUN2211LT1 SERIES

1000

1
IC/IB = 10

h FE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS


MMUN2212LT1

TA = 25C
25C
75C

0.1

0.01

VCE = 10 V
TA = 75C
25C
25C
100

10

0.001
0

20
40
60
IC, COLLECTOR CURRENT (mA)

80

10
IC, COLLECTOR CURRENT (mA)

Figure 7. VCE(sat) versus IC

Figure 8. DC Current Gain

100
f = 1 MHz
lE = 0 V
TA = 25C

IC , COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

10

20

30

100

50

40

75C

25C
TA = 25C

10

0.1

0.01
VO = 5 V

0.001

10

VR, REVERSE BIAS VOLTAGE (VOLTS)

Vin, INPUT VOLTAGE (VOLTS)

Figure 9. Output Capacitance

Figure 10. Output Current versus Input Voltage

100

Vin , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C
10
75C

25C

0.1

10

20

30

40

50

IC, COLLECTOR CURRENT (mA)

Figure 11. Input Voltage versus Output Current

2456

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMUN2211LT1 SERIES

1000

10
IC/IB = 10

TA = 25C
25C

h FE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS


MMUN2213LT1

75C

0.1

0.01
0

20
40
60
IC, COLLECTOR CURRENT (mA)

VCE = 10 V
TA = 75C
25C
25C
100

10

80

10

IC, COLLECTOR CURRENT (mA)

Figure 12. VCE(sat) versus IC

Figure 13. DC Current Gain

100
I C , COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

25C

75C

f = 1 MHz
lE = 0 V
TA = 25C

0.8

100

0.6

0.4

0.2

10

TA = 25C

0.1

0.01
VO = 5 V

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

0.001
0

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 15. Output Current versus Input Voltage

Figure 14. Output Capacitance

100
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)

TA = 25C
10

25C
75C

0.1
0

10

20
30
40
IC, COLLECTOR CURRENT (mA)

50

Figure 16. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2457

MMUN2211LT1 SERIES

300
TA = 25C

IC/IB = 10

hFE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS

TYPICAL ELECTRICAL CHARACTERISTICS


MMUN2214LT1

25C
0.1
75C

0.01

0.001

20
40
60
IC, COLLECTOR CURRENT (mA)

25C
200
25C
150
100
50
0

80

TA = 75C

VCE = 10

250

Figure 17. VCE(sat) versus IC

100
75C

IC, COLLECTOR CURRENT (mA)

f = 1 MHz
lE = 0 V
TA = 25C

3.5
Cob , CAPACITANCE (pF)

80 90 100

Figure 18. DC Current Gain

2.5
2
1.5
1
0.5
0

8 10 15 20 40 50 60 70
IC, COLLECTOR CURRENT (mA)

6 8 10 15 20 25 30 35 40
VR, REVERSE BIAS VOLTAGE (VOLTS)

Figure 19. Output Capacitance

45

50

25C

TA = 25C
10

VO = 5 V
1

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 20. Output Current versus Input Voltage

10
TA = 25C

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

25C
75C
1

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 21. Input Voltage versus Output Current

2458

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMUN2211LT1 SERIES
TYPICAL APPLICATIONS FOR NPN BRTs

+12 V

ISOLATED
LOAD

FROM P OR
OTHER LOGIC

Figure 22. Level Shifter: Connects 12 or 24 Volt Circuits to Logic

+12 V

VCC

OUT
IN
LOAD

Figure 23. Open Collector Inverter: Inverts


the Input Signal

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 24. Inexpensive, Unregulated Current Source

2459

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad General Purpose


Transistors
NPN Silicon

14

13

12

11

10

*Motorola Preferred Device

NPN

MPQ2222
MPQ2222A*

14
1

MAXIMUM RATINGS
Rating

Symbol

MPQ2222

MPQ2222A

Unit

Collector Emitter Voltage

VCEO

30

40

Vdc

Collector Base Voltage

VCBO

Emitter Base Voltage

VEBO

5.0

Vdc

IC

500

mAdc

Collector Current Continuous

Total Device Dissipation @ TA = 25C


Derate above 25C
Operating and Storage Junction
Temperature Range

60

Vdc

Each
Transistor

Total
Device

0.65
5.2

1.9
15.2

PD
TJ, Tstg

CASE 64606, STYLE 1


TO116

55 to +150

Watts
mW/C
C

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

Symbol

Max

Unit

RqJA

66

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

40
40

60
75

5.0
6.0

50
10

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 10 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 10 mAdc, IE = 0)
Emitter Base Breakdown Voltage
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 50 Vdc, IE = 0)
(VCB = 60 Vdc, IE = 0)

V(BR)CEO
MPQ2222
MPQ2222A
V(BR)CBO
MPQ2222
MPQ2222A

Vdc

V(BR)EBO
MPQ2222
MPQ2222A

Vdc

ICBO
MPQ2222
MPQ2222A

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)
1. Pulse Test: Pulse Width

Vdc

IEBO

nAdc

nAdc

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

(Replaces MPQ2221/D)

2460

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ2222 MPQ2222A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Max

35
50
75
100
30
40

300

0.4
0.3
1.6
1.0

0.6

1.3
1.2
2.6
2.0

fT

200

MHz

Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

8.0

pF

Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

30

pF

ton

35

ns

toff

285

ns

Characteristic

Unit

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 100 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 150 mAdc, VCE = 10 Vdc)
(IC = 300 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 10 Vdc)

hFE

MPQ2222A
MPQ2222A
MPQ2222,A
MPQ2222,A
MPQ2222
MPQ2222A

Collector Emitter Saturation Voltage


(IC = 150 mAdc, IB = 15 mAdc)

VCE(sat)
MPQ2222
MPQ2222A
MPQ2222
MPQ2222A

(IC = 300 mAdc, IB = 30 mAdc)


(IC = 500 mA, IB = 50 mA)
Base Emitter Saturation Voltage
(IC = 150 mAdc, IB = 15 mAdc)

Vdc

VBE(sat)
MPQ2222
MPQ2222A
MPQ2222
MPQ2222A

(IC = 300 mAdc, IB = 30 mAdc)


(IC = 500 mA, IB = 50 mA)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(1)
(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS
TurnOn Time
(VCC = 30 Vdc, VBE(off) = 0.5 Vdc,
IC = 150 mAdc, IB1 = 15 mAdc)

MPQ2222A

TurnOff Time
(VCC = 30 Vdc, IC = 150 mAdc,
IB1 = IB2 = 15 mAdc)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

GENERATOR RISE TIME 2.0 ns


PW 200 ns
DUTY CYCLE = 2.0%

DUTY CYCLE = 2.0%


+30 V

200

+16.2 V

619

9.9 V

+30 V

100 ms
< 5.0 ns

200

MPQ2222A

1.0 k
0
1N916

0.5 V

SCOPE
Rin > 100 k ohms
Cin 12 pF
RISE TIME 5.0 ns

500 ms

Figure 1. Delay and Rise Time


Equivalent Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

13.8 V
3.0 V

SCOPE
Rin > 100 k ohms
Cin 12 pF
RISE TIME 5.0 ns

Figure 2. Storage Time and Fall Time


Equivalent Test Circuit

2461

MPQ2222 MPQ2222A
h FE, DC CURRENT GAIN (NORMALIZED)

4.0
3.0

VCE = 1.0 V
VCE = 10 V

TJ = 175C

2.0
25C
1.0
0.7

55C

0.5
0.3
0.2
0.5

0.7

1.0

2.0

3.0

7.0

5.0

10

20

50

30

70

100

300

200

500

IC, COLLECTOR CURRENT (mA)

Figure 3. Normalized DC Current Gain

qV , TEMPERATURE COEFFICIENT (mV/ C)

1.4
TJ = 25C

V, VOLTAGE (VOLTS)

1.2
1.0
0.8

VBE(sat) @ IC/IB = 10

0.6

VBE @ VCE = 1.0 V

0.4
0.2
0
0.5

VCE(sat) @ IC/IB = 10

+1.6

+0.8

25C TO 175C

qVC FOR VCE(sat)


0

55C TO 25C

0.8

qVB FOR VBE

1.6

2.4
1.0

5.0

2.0

10

20

50

100

200

0.5

500

1.0

5.0

2.0

10

20

50

100

200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 4. ON Voltages

Figure 5. Temperature Coefficients

500

NOISE FIGURE
(VCE = 10 Vdc, TA = 25C)
6.0

10

f = 1.0 kHz

4.0

IC = 10 A
RS = 4.3 k

3.0

m
W

2.0

IC = 100 A
RS = 1.0 k

2462

10 A
6.0

4.0

2.0

1.0
0
0.1

100 A

IC = 1.0 mA

8.0
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

5.0

0
0.2

0.5

1.0

2.0

5.0

10

20

50

100

0.1

0.2

0.5

1.0

2.0

5.0

10

20

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (k OHMS)

Figure 6. Frequency Effects

Figure 7. Source Resistance Effects

50

100

Motorola SmallSignal Transistors, FETs and Diodes Device Data

30

500

TJ = 25C

VCE = 20 V
TJ = 25C
f = 100 MHz

300
200

20
C, CAPACITANCE (pF)

f T , CURRENTGAIN BANDWIDTH PRODUCT (MHz)

MPQ2222 MPQ2222A

100
70
50
30

7.0

Cob

5.0

20
10

Cib
10

0.1

0.2 0.3

0.5

1.0

2.0 3.0

5.0

10

3.0
0.1

20 30

0.2 0.3

0.5

1.0

2.0 3.0

5.0

IC, COLLECTOR CURRENT (mAdc)

VR, REVERSE VOLTAGE (VOLTS)

Figure 8. CurrentGain Bandwidth Product

Figure 9. Capacitances

10

20

SWITCHING TIME CHARACTERISTICS


200

10 k
TJ = 25C
IC/IB = 10

tr

2k
VCC = 30 V
UNLESS NOTED

CHARGE (pC)

t, TIME (ns)

100

50
30
td @ VEB(off) = 0
20

tr @ 5 V

10
3.0

td @ VEB(off) = 2 V
5.0

10

QT, TOTAL CONTROL


CHARGE
HIGH GAIN TYPES

500
200

VCC = 30 V

100

QA, ACTIVE REGION


CHARGE

LOW GAIN TYPES


ALL TYPES

20
30

20

50

100

200 300

3.0

5.0 7.0 10

20

50 70 100

30

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 10. TurnOn Time

Figure 11. Charge Data

300

300

200

200

ts
IC/IB = 10

100
70
IC/IB = 20

50
tf

IC/IB = 10
30
LOW GAIN TYPES
TJ = 25C

20

VCC = 5 V
UNLESS NOTED

1k

50

t s ,t f , STORAGE AND FALL TIME (ns)

t s ,t f , STORAGE AND FALL TIME (ns)

TJ = 25C
IC/IB = 10

5k

200 300

ts
IC/IB = 10

100
IC/IB = 20

70
IC/IB = 10

50

tf
30
HIGH GAIN TYPES
TJ = 25C

20

10

10
10

20

30

50

70

100

200

300

10

20

30

50

70

100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 12. TurnOff Behavior

Figure 13. TurnOff Behavior

Motorola SmallSignal Transistors, FETs and Diodes Device Data

200

300

2463

MPQ2222 MPQ2222A
GENERATOR RISE TIME 2.0 ns
PW 200 ns
+30 V
DUTY CYCLE = 2.0%

+30 V

RISE TIME 3.0%


DUTY CYCLE = 2.0%

200

9.9 V

619

200
SCOPE
Rin > 100 k ohms
Cin 12 pF
RISE TIME 5.0 ns

+16.2 V

0
> 200 ns

SCOPE
Rin > 100 k ohms
Cin 12 pF
RISE TIME 5.0 ns

1.0 k

13.8 V

1N916

3.0 V

Figure 14. Delay and Rise Time


Equivalent Test Circuit

2464

Figure 15. Storage Time and Fall Time


Equivalent Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Switching
Transistor

MPQ2369

NPN Silicon

Motorola Preferred Device


14

13

12

11

10

NPN

14
1

CASE 64606, STYLE 1


TO116

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

15

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

4.5

Vdc

IC

500

mAdc

Collector Current Continuous

Total Device Dissipation @ TA = 25C


Derate above 25C
Operating and Storage Junction
Temperature Range

Each
Transistor

Total
Device

0.5
5.0

1.5
15

PD
TJ, Tstg

Watts
mW/C
C

55 to +125

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

Symbol

Max

Unit

RqJA

83

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

15

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

4.5

Vdc

ICBO

0.4

mAdc

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)
1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2465

MPQ2369
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Characteristic

Min

Typ

Max

40
20

Unit

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 2.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.25

Vdc

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

0.9

Vdc

fT

450

550

MHz

Output Capacitance (VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

2.5

4.0

pF

Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

3.0

5.0

pF

TurnOn Time
(VCC = 3.0 Vdc, VBE = 1.5 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc)

ton

9.0

ns

TurnOff Time
(VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc, IB2 = 1.5 mAdc)

toff

15

ns

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

1. Pulse Test: Pulse Width

2466

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ2369
+10 V
980
SCOPE
+6.0 V

500

CS 3.0 pF

4.0 V
PULSE WIDTH = 300 ns
tf 1.0 ns
DUTY CYCLE 2.0%

Figure 1. Storage Time Test Circuit

200

200
IC/IB = 10
TJ = 25C

100

70
50
t, TIME (ns)

t, TIME (ns)

70
50
30
20

VCC = 10 V
IC/IB = 10
TJ = 25C

100

tr @ VCC = 10 V

tr @ VCC = 3.0 V

10
7.0
5.0

30
20

tf

10
7.0
5.0
td @ VBE(off) = 1.5 V

3.0
2.0
1.0

2.0

3.0

5.0 7.0 10

20

30

ts

3.0
2.0
50 70 100

1.0

2.0

3.0

30

IC, COLLECTOR CURRENT (mA)

Figure 2. TurnOn Time

Figure 3. TurnOff Time

VCC = 3.0 V

VCC = 3.0 V

270

270
SCOPE

50 70 100

SCOPE

+10.75 V

3.3 k
1.5 V

20

IC, COLLECTOR CURRENT (mA)

+10.75 V
0

5.0 7.0 10

3.3 k
CS < 4.0 pF

PULSE WIDTH = 300 ns


tr < 1.0 ns
DUTY CYCLE 2.0%

Figure 4. TurnOn Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

CS < 4.0 pF
4.15 V
PULSE WIDTH = 300 ns
tf 1.0 ns
DUTY CYCLE 2.0%

Figure 5. TurnOff Test Circuit

2467

5.0
TJ = 25C
Cib

C, CAPACITANCE (pF)

3.0
2.0

Cob

1.0
0.7
0.5
0.05

0.1

0.5

0.2

1.0

2.0

5.0

10

20

50

f T , CURRENTGAIN BANDWIDTH PRODUCT (MHz)

MPQ2369
2.0 k
VCE = 10 V
f = 100 MHz
1.0 k
700
500

300
200
1.0

2.0

3.0

20

5.0 7.0 10

30

50

70 100

VR, REVERSE VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 6. Capacitance

Figure 7. CurrentGain Bandwidth Product

1.4

500
300

TJ = 25C

TJ = 150C

1.2

25C

1.0

V, VOLTAGE (VOLTS)

100
70
50

55C

30
20
VCE = 1.0 V
VCE = 5.0 V

10

V CE , COLLECTOREMITTER VOLTAGE (VOLTS)

7.0
5.0
0.2

0.5

1.0

2.0

5.0

10

20

50

100

VCE(SAT) @ IC/IB = 10

0.5

1.0

2.0

5.0

10

20

50

IC, COLLECTOR CURRENT (mA)

Figure 8. DC Current Gain

Figure 9. ON Voltages

100

200

+2.0

0.8
30 mA

100 mA

200 mA

0.6

0.4

2468

0.4

IC, COLLECTOR CURRENT (mA)

TJ = 25C

0
0.05

VBE(ON) @ VCE = 1.0 V


0.6

0
0.2

200

1.0

0.2

VBE(SAT) @ IC/IB = 10

0.8

0.2

q V , TEMPERATURE COEFFICIENT (mV/ C)

h FE , DC CURRENT GAIN

200

IC = 10 mA
0.1

0.2

0.5

1.0

2.0

5.0

10

20

50

*APPLIES FOR IC/IB hFE/3.0


+1.0

25C TO 150C

*qVC FOR VCE(SAT)


0

55C TO 25C
1.0

25C TO 150C

qVB FOR VBE


2.0
55C TO 25C
3.0
0.2

0.5

1.0

2.0

5.0

10

20

50

IB, BASE CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 10. Collector Saturation Region

Figure 11. Temperature Coefficients

100

200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Amplifier Transistors

MPQ2483
MPQ2484*

NPN Silicon

14

13

12

11

10

*Motorola Preferred Device

NPN

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

IC

50

mAdc

Collector Current Continuous

Total Device Dissipation


@ TA = 25C(1)
Derate above 25C

PD

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range

TJ, Tstg

Each
Transistor

Four
Transistors
Equal Power

500
4.0

900
7.2

mW
mW/C

0.825
6.7

2.4
19.2

Watts
mW/C

14
1

CASE 64606, STYLE 1


TO116

55 to +150

THERMAL CHARACTERISTICS
Characteristic

Junction
to Case

Junction
to Ambient

Unit

Thermal Resistance

Each Die
Effective, 4 Die

151
52

250
134

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

34
2.0

70
26

%
%

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(2)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

6.0

Vdc

Collector Cutoff Current


(VCB = 45 Vdc, IE = 0)

ICBO

20

nAdc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

20

nAdc

Characteristic

OFF CHARACTERISTICS

1. Second Breakdown occurs at power levels greater than 3 times the power dissipation rating.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2469

MPQ2483 MPQ2484
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Typ

Max

MPQ2483
MPQ2484

100
200

(IC = 1.0 mAdc, VCE = 5.0 Vdc)

MPQ2483
MPQ2484

150
300

(IC = 10 mAdc, VCE = 5.0 Vdc)

MPQ2483
MPQ2484

150
300

0.13
0.15

0.35
0.5

0.58
0.70

0.7
0.8

fT

50

100

MHz

Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

4.0

8.0

pF

CollectorBase Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Ccb

1.8

6.0

pF

3.0
2.0

Characteristic

Unit

ON CHARACTERISTICS
DC Current Gain(2)
(IC = 0.1 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 1.0 mAdc, IB = 0.1 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage(2)


(IC = 100 mAdc, VCE = 5.0 Vdc)
(IC = 10 mAdc, VCE = 5.0 Vdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 500 mAdc, VCE = 5.0 Vdc, f = 20 MHz)

Noise Figure
(IC = 10 mAdc, VCE = 5.0 Vdc, RS = 10 k ohms,
f = 1.0 kHz, BW = 10 kHz)
2. Pulse Test: Pulse Width

2470

v 300 ms; Duty Cycle v 2.0%.

NF
MPQ2483
MPQ2484

dB

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Complementary Pair


Transistors
NPN/PNP Silicon

14

13

12

11

10

MPQ6100A
TYPE A
14

13

12

11

10

MPQ6100A
MPQ6600A1*
Voltage and Current are negative
for PNP Transistors
*Motorola Preferred Device

COMPLEMENTARY

MPQ6600A1
TYPE B
14
1

CASE 64606, STYLE 1


TO116

MAXIMUM RATINGS
Symbol

MPQ6100A
MPQ6600A1

Unit

Collector Emitter Voltage

VCEO

45

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

50

mAdc

Rating

Collector Current Continuous

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range

TJ, Tstg

Each
Transistor

Four
Transistors
Equal Power

500
4.0

900
7.2

mW
mW/C

0.825
6.7

2.4
19.2

Watts
mW/C

55 to +150

THERMAL CHARACTERISTICS
Characteristic

Junction to
Case

Junction to
Ambient

Unit

Thermal Resistance(1)

Each Die
Effective, 4 Die

151
52

250
139

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

34
2.0

70
26

%
%

1. RJA is measured with the device soldered into a typical printed circuit board.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2471

MPQ6100A MPQ6600A1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

45

60

5.0

10

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(2)
(IC = 10 mAdc, IB = 0)

V(BR)CEO
MPQ6100A, 6600A1

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 50 Vdc, IE = 0)

Vdc
Vdc
Vdc

ICBO

nAdc

ON CHARACTERISTICS(2)
DC Current Gain
(IC = 100 mAdc, VCE = 5.0 Vdc)
(IC = 500 Adc, VCE = 5.0 Vdc)
(IC = 1.0 mAdc, VCE = 5.0 Vdc)
(IC = 10 mAdc, VCE = 5.0 Vdc)

hFE

100
150
150
125

0.25

0.8

50

1.2
1.8

4.0
4.0

8.0
8.0

NF

4.0

dB

DC Current Gain Ratio


(IC = 100 Adc, VCE = 5.0 Vdc)

hFE1/hFE2

0.8

1.0

BaseEmitter Voltage Differential


(IC = 100 Adc, VCE = 5.0 Vdc)

|VBE1VBE2|

20

mVdc

MPQ6100A, 6600A1
MPQ6100A, 6600A1
MPQ6100A, 6600A1
MPQ6100A, 6600A1

Collector Emitter Saturation Voltage


(IC = 1.0 mAdc, IB = 100 Adc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 1.0 mAdc, IB = 100 Adc)

VBE(sat)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 500 Adc, VCE = 5.0 Vdc, f = 20 MHz)
Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f =1.0 MHz)
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

fT
Cobo
PNP
NPN

pF

Cibo
PNP
NPN

Noise Figure
(IC = 100 Adc, VCE = 5.0 Vdc, RS = 10 k,
f = 1.0 kHz, BW = 10 kHz)

MHz

pF

MATCHING CHARACTERISTICS (MPQ6600A1 ONLY)

2. Pulse Test: Pulse Width

2472

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ6100A MPQ6600A1
SPOT NOISE FIGURE
(VCE = 10 Vdc, TA = 25C)

12

10

NOISE FIGURE (dB)

NOISE FIGURE (dB)

12
1 mA

8
6
4
100 A

2
0

100 A

8
6

10 A

4
2

10 A
1.0 k
10 k
Rs, SOURCE RESISTANCE (OHMS)

1 mA

10

100 k

1.0 k
10 k
Rs, SOURCE RESISTANCE (OHMS)

Figure 1. Source Resistance Effects, f = 1.0 kHz


Rs SOURCE RESISTANCE

10

Figure 2. Source Resistance Effects, f = 10 Hz

VCE = 5.0 Vdc

IC = 100 A, RS = 30 k
800

IC = 10 A, RS = 100 k

hFE, DC CURRENT GAIN

NOISE FIGURE (dB)

12

IC = 1.0 mA, RS = 1.0 k


8

IC = 10 A, RS = 10 k

IC = 100 A, RS = 3.0 k

100 k

TA = 125C
600
TA = 25C
400
TA = 55C
200

2
0

1.0 k
10 k
f, FREQUENCY (Hz)

100 k

Figure 3. Frequency Effects

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.01
0.1
1.0
IC, COLLECTOR CURRENT (mAdc)

10

Figure 4. Typical Current


Gain Characteristics

2473

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad General Purpose


Transistors
PNP Silicon

14

13

12

11

10

PNP

MPQ2906
MPQ2907
MPQ2907A*
*Motorola Preferred Device

14

MAXIMUM RATINGS

Symbol

MPQ2906
MPQ2907

Collector Emitter Voltage

VCEO

40

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

600

mAdc

Rating

Collector Current Continuous

Total Device Dissipation @ TA = 25C


Derate above 25C
Operating and Storage Junction
Temperature Range

MPQ2907A

Unit

60

Vdc

Each
Transistor

Total
Device

0.65
6.5

1.9
19

PD
TJ, Tstg

55 to +125

CASE 64606, STYLE 1


TO116

Watts
mW/C
C

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

Symbol

Max

Unit

RqJA

66

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

40
60

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 10 mAdc, IB = 0)

V(BR)CEO
MPQ2906, MPQ2907
MPQ2907A

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

ICBO

50

nAdc

IEBO

50

nAdc

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)
(VCB = 50 Vdc, IE = 0)

MPQ2906, MPQ2907
MPQ2907A

Emitter Cutoff Current


(VEB = 3.0 Vdc, IE = 0)

MPQ2906,7 Only

1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

2474

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ2906 MPQ2907 MPQ2907A


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Max

75
100
35
75
100
100
40
100
20
30
50

300

0.4
1.6
1.6

1.3
2.6
2.6

fT

200

MHz

Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

8.0

pF

Input Capacitance (VEB = 2.0 Vdc, IC = 0, f = 1.0 MHz)

Cibo

30

pF

ton

45

ns

toff

180

ns

Characteristic

Unit

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 100 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)

hFE

MPQ2907A
MPQ2907A
MPQ2906
MPQ2907
MPQ2907A
MPQ2907A
MPQ2906
MPQ2907
MPQ2906
MPQ2907
MPQ2907A

(IC = 10 mAdc, VCE = 10 Vdc)


(IC = 150 mAdc, VCE = 10 Vdc)
(IC = 150 mAdc, VCE = 10 Vdc)
(IC = 300 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 10 Vdc)
Collector Emitter Saturation Voltage(1)
(IC = 150 mAdc, IB = 15 mAdc)
(IC = 300 mAdc, IB = 30 mAdc)
(IC = 500 mA, IB = 500 mA)
Base Emitter Saturation Voltage(1)
(IC = 150 mAdc, IB = 15 mAdc)
(IC = 300 mAdc, IB = 30 mAdc)
(IC = 500 mA, IB = 50 mA)

VCE(sat)

Vdc

MPQ2906, MPQ2907
MPQ2907A
VBE(sat)

Vdc

MPQ2906, MPQ2907
MPQ2906, MPQ2907
MPQ2907A

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 50 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS
TurnOn Time
(VCC = 30 Vdc, IC = 150 mAdc, IB1 = 15 mAdc)
TurnOff Time
(VCC = 6.0 Vdc, IC = 150 mAdc,
IB1 = IB2 = 15 mAdc)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

MPQ2907A Only

MPQ2907A Only

30
INPUT
Zo = 50
PRF = 150 PPS
RISE TIME 2.0 ns

INPUT
Zo = 50
PRF = 150 PPS
RISE TIME 2.0 s

200

1.0 k
0
16 V

+15 V

TO OSCILLOSCOPE
RISE TIME 5.0 ns

50

1.0 k

200 ns

Figure 1. Delay and Rise Time


Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

50

37

TO OSCILLOSCOPE
RISE TIME 5.0 ns

1.0 k
0
30 V

6.0

1N916

200 ns

Figure 2. Storage and Fall Time


Test Circuit

2475

MPQ2906 MPQ2907 MPQ2907A


h FE, DC CURRENT GAIN (NORMALIZED)

2.0
TJ = +175C

+25C

1.0
0.7
0.5

55C
VCE = 10 V
VCE = 1.0 V

0.3
0.2
0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

30

20

70

50

100

200

300

500

IC, COLLECTOR CURRENT (mA)

Figure 3. DC Current Gain


2.0

+2.0
TJ = 25C

qVC FOR VCE(sat)

+1.0
COEFFICIENT (mV/ C)

ON VOLTAGE (VOLTS)

1.6
VBE(sat) @ IC/IB = 10

1.2

0.8
VBE @ VCE = 1.0 V

55C TO +25C
0

+25C TO +175C

qVB FOR VBE

1.0

+25C TO +175C
2.0

0.4
VCE(sat) @ IC/IB = 10
0
0.5

55C TO +25C
3.0

1.0

5.0

2.0

10

20

100

50

200

0.5

500

1.0

5.0

2.0

10

20

50

100

200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 4. ON Voltages

Figure 5. Temperature Coefficients

500

NOISE FIGURE
(VCE = 10 V, TA = 25C)
6.0

4.0

IC = 10 A
RS = 4.7 k

3.0

IC = 1.0 mA
RS = 0.7 k

2.0

2476

IC = 100 A
RS = 1.2 k
0.2

0.5

1.0

2.0

5.0

10

20

50

100 A

6.0

4.0

2.0

m
W

1.0
0
0.1

f = 1.0 kHz

IC = 10 A

8.0
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

5.0

10
VCE = 10 Vdc
TA = 25C

1.0 mA

VCE = 10 Vdc
TA = 25C

0
100

0.1

0.2

0.5

1.0

2.0

5.0

10

20

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (k OHMS)

Figure 6. Frequency Effects

Figure 7. Source Resistance Effects

50

100

Motorola SmallSignal Transistors, FETs and Diodes Device Data

30

600
400

VCE = 20 Vdc
f = 100 MHz
TJ = 25C

200

100

Cob

10
7.0
5.0

60

3.0
0.5 0.7 1.0

2.0

3.0

5.0

10

20

30

50

0.2

2.0

3.0

5.0 7.0

Figure 8. CurrentGain Bandwidth Product

Figure 9. Capacitance

10

20

5000
VCC = 30 V, VBE(off) = 2.0 V
VCC = 10 V, VBE(off) = 0 V

3000

VCC = 30 V
TJ = 25C

2000
IC/IB = 10
TJ = 25C

tr

Q, CHARGE (pC)

100
70

td

50

QT, TOTAL CONTROL CHARGE


1000
700
500

30

300

20

200

10
5.0 7.0

10

20

30

50

70 100

200 300

20

30

50

70 100

200 300

IC, COLLECTOR CURRENT (mA)

Figure 10. TurnOn Time

Figure 11. Charge Data

300

300
ts ts 1/8 tf

100

IB1 = IB2
TJ = 25C

70
IC/IB = 10

30

500

VCC = 30 V
IB1 = IB2
TJ = 25C

200
t f , FALL TIME (ns)

200

IC/IB = 20
100
70

IC/IB = 10

50
30
20

IC/IB = 20

10

10

IC, COLLECTOR CURRENT (mA)

500

10
5.0 7.0

QA, ACTIVE REGION CHARGE

100
5.0 7.0

500

500

20

0.5 0.7 1.0

VR, REVERSE VOLTAGE (VOLTS)

200

50

0.3

IC, COLLECTOR CURRENT (mA)

300

t, TIME (ns)

Cib

80

500

t s , STORAGE TIME (ns)

TJ = 25C
f = 100 kHz

20
C, CAPACITANCE (pF)

f T , CURRENTGAIN BANDWIDTH PRODUCT (MHz)

MPQ2906 MPQ2907 MPQ2907A

20

30

50

70 100

200 300

500

10
5.0 7.0

10

20

30

50

70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 12. Storage Time

Figure 13. Fall Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

200 300

500

2477

MPQ2906 MPQ2907 MPQ2907A

30 V

P.W. 200 ns
tr 2.0 ns
DUTY CYCLE 2.0%

30 V

P.W. 1.0 ms
tr 2.0 ns
DUTY CYCLE 2.0%

200

200

+13.8 V
1.0 k
0

SCOPE

SCOPE

1.0 k
0

16 V

16.2 V

1N916

3.0 V

Figure 14. Delay and Rise Time


Test Circuit

2478

Figure 15. Storage and Fall Time


Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Memory Driver


Transistor

MPQ3467

PNP Silicon

Motorola Preferred Device


14

13

12

11

10

PNP

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

1.0

Adc

Collector Current Continuous

Total Device Dissipation


@ TA = 25C(1)
Derate above 25C

PD

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range

TJ, Tstg

Each
Transistor

Four
Transistors
Equal Power

650
5.2

1500
12

mW
mW/C

1.25
10

3.2
25.6

Watts
mW/C

14
1

CASE 64606, STYLE 1


TO116

55 to +150

THERMAL CHARACTERISTICS

Characteristic

RqJC
Junction
to Case

RqJA
Junction
to Ambient

Unit

Thermal Resistance

Each Die
Effective, 4 Die

100
39

193
83.2

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

45
5.0

55
10

%
%

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(2)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

200

nAdc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

200

nAdc

Characteristic

OFF CHARACTERISTICS

1. Second Breakdown occurs at power levels greater than 2 times the power dissipation rating.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2479

MPQ3467
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Typ

Max

Unit

hFE

20

VCE(sat)

0.23

0.5

Vdc

VBE(sat)

0.90

1.2

Vdc

fT

125

190

MHz

Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

10

25

pF

Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

55

80

pF

TurnOn Time
(IC = 500 mAdc, IB1 = 50 mAdc)

ton

40

ns

TurnOff Time
(IC = 500 mAdc, IB1 = IB2 = 50 mAdc)

toff

90

ns

Characteristic

ON CHARACTERISTICS
DC Current Gain(2)
(IC = 500 mAdc, VCE = 1.0 Vdc)
Collector Emitter Saturation Voltage(2)
(IC = 500 mAdc, IB = 50 mAdc)
Base Emitter Saturation Voltage(2)
(IC = 500 mAdc, IB = 50 mAdc)

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 50 mAdc, VCE = 10 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

2. Pulse Test: Pulse Width

2480

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ3467
1.6

100

IC = 10 IB1 = 10 IB2
VCC = 30 V
TJ = 25C
TJ = 125C

70

F = 10, 20
F = 10

50

F = 20

30
ts ts 1/8 tf
20
50

70

V(sat) , SATURATION VOLTAGE (VOLTS)

t sv, STORAGE TIME (ns)

200

100
200 300
500 700 1000
IC, COLLECTOR CURRENT (mA)

Figure 1. Storage Time Variation


with Temperature

hFE , MINIMUM CURRENT GAIN

70

1.4
F = 10
TJ = 25C

1.2

MAX

1.0
VBE(sat)
0.8

MIN

0.6
MAX VCE(sat)

0.4
0.2
0
50

70

100

200
300
500 700 1000
IC, COLLECTOR CURRENT (mA)

Figure 2. Limits of Saturation Voltage

TJ = 125C

50

VCE = 1.0 V
VCE = 2.0 V

TJ = 25C

30

TJ = 55C

20

10
50

70

100

200
300
IC, COLLECTOR CURRENT (mA)

500

700

1000

Figure 3. Minimum Current Gain Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2481

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Core Driver Transistor

MPQ3725

NPN Silicon

14

13

12

11

10

Motorola Preferred Device

NPN

MAXIMUM RATINGS

14

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Emitter Voltage

VCES

60

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

1.0

Adc

Collector Current Continuous

Total Device Dissipation


@ TA = 25C
Derate above 25C

One
Transistor

Four
Transistors
Equal Power

1.0
8.0

2.5
20

CASE 64606, STYLE 1


TO116

PD

Operating and Storage Junction


Temperature Range

TJ, Tstg

Watts
mW/C
C

55 to +150

THERMAL CHARACTERISTICS
Characteristic

Symbol

RqJA

Thermal Resistance,
Junction to Ambient(1)

Max

Unit

One
Transistor

Effective
For Four
Transistors

125

50

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(2)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Emitter Breakdown Voltage


(IC = 100 mAdc, VBE = 0)

V(BR)CES

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

ICBO

0.5

mAdc

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 40 Vdc, IE = 0)
1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

2482

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ3725
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Characteristic

Min

Typ

Max

35
25

75
45

200

Unit

ON CHARACTERISTICS(2)
DC Current Gain
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 500 mAdc, VCE = 2.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

0.32

0.45

Vdc

Base Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

0.8

0.9

1.1

Vdc

fT

250

275

MHz

Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

5.1

10

pF

Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

62

80

pF

TurnOn Time
(IC = 500 mAdc, IB1 = 50 mAdc
VBE(off) = 3.8 Vdc)

ton

20

35

ns

TurnOff Time
(IC = 500 mAdc, IB1 = IB2 = 50 mAdc)

toff

50

60

ns

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 50 mAdc, VCE = 10 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

2. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.


3.8 V

+30 V
15

1.0 k
43
+9.7 V

1.0 F

100

1.0 F
TO
SAMPLING
OSCILLOSCOPE
Zin 100 k
tr < 1.0 ns

0
PULSE GENERATOR
tr, tf 1.0 ns
PW 1.0 s
Zin = 50
DUTY CYCLE 2.0%

m
W

62

Figure 1. Switching Times Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2483

MPQ3725
IC , COLLECTOR CURRENT (AMP)

2.0
1.0

10 ms

0.5

dc

0.3
0.2
TJ = 200C
0.1
SECOND BREAKDOWN LIMITED
THERMAL LIMITATION @ TC = 25C
PULSE DUTY CYCLE 10%
APPLICABLE TO RATED BVCEO

0.05
0.03
0.02
3.0

4.0

6.0

8.0 10

20

30

40

60

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 2. ActiveRegion Safe Operating Area

TYPICAL DC CHARACTERISTICS
400

1.4
1.2

200
V, VOLTAGE (VOLTS)

h FE , DC CURRENT GAIN

TJ = 25C

VCE = 1.0 V

TJ = 125C
25C
100
80

55C

60
40

1.0
0.8
0.6

VBE(sat) @ IC/IB = 10

0.4
0.2

20

50

100

200

500

10

1000

100

200

Figure 3. DC Current Gain

Figure 4. ON Voltages

500

1000

+2.5
TJ = 25C

0.8

0.6

1000 mA

0.4

0
0.5

50

IC, COLLECTOR CURRENT (mA)

1.0

0.2

20

IC, COLLECTOR CURRENT (mA)

qV, TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

10

2484

VCE(sat) @ IC/IB = 10

20

800 mA
500 mA
IC = 100 mA

300 mA

*APPLIES FOR IC/IB < hFE/2

+2.0
+1.5
+1.0
*qVC FOR VCE(sat)

+0.5
0
0.5
1.0

qVB FOR VBE

1.5
2.0
2.5

1.0

2.0

5.0

10

20

50

100

200

500

10

20

30

50

100

200 300

500

IB, BASE CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. Collector Saturation Region

Figure 6. Temperature Coefficients

1000

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ3725
500

100
VCE = 10 Vdc
f = 100 MHz
TJ = 25C

300

TJ = 25C

70
Cib

50
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

TYPICAL DYNAMIC CHARACTERISTICS

200

100

30
20
Cob

10
7.0

70

5.0

50
4.0

6.0

10

20

40

60

100

200

3.0
0.1

400

0.2

0.5

1.0

5.0

20

10

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 7. CurrentGain Bandwidth Product

Figure 8. Capacitance

200

50

100

200
IC /IB = 10
TJ = 25C

100

tr @ VCC = 10 Vdc
tr @ VCC = 30 Vdc

10

3.0
2.0
10

20

30

50

ts @ IC/IB = 20

50

ts @ IC/IB = 10

30
20

td @ VBE(off) = 0 V
VBE(off) = 3.8 Vdc
VCC = 30 Vdc

5.0

tf @ IC/IB = 20

70
t, TIME (ns)

30
20

VCC = 10 Vdc
TJ = 25C

tf @ IC/IB = 10
100

50
t, TIME (ns)

2.0

10
200 300

100

500

10

1000

20

30

50

100

200 300

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 9. TurnOn Time

Figure 10. TurnOff Time

500

1000

I CES , COLLECTOR CUTOFF CURRENT ( m A)

1000

100
VCE = 60
VCE = 30
VCE = 10

10

1.0

0.1

0.01
0

20

40

60

80

100

120

140

160

180

200

TJ, JUNCTION TEMPERATURE (C)

Figure 11. Collector Cutoff Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2485

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Memory Driver


Transistor
PNP Silicon

14

13

12

11

10

MPQ3762

PNP

14

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

1.5

Adc

Collector Current Continuous

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range

Each
Transistor

Four
Transistors
Equal Power

750
5.98

1700
13.6

mW
mW/C

1.25
10

3.2
25.6

Watts
mW/C

TJ, Tstg

CASE 64606, STYLE 1


TO116

55 to +150

THERMAL CHARACTERISTICS
Characteristic

Junction
to Case

Junction
to Ambient

Unit

Thermal Resistance(1)

Each Die
Effective, 4 Die

100
39

167
73.5

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

46
5.0

56
10

%
%

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(2)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

100

nAdc

Characteristic

OFF CHARACTERISTICS

1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

2486

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ3762
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Min

Typ

Max

35
30
20

70
65
35

0.3
0.6

0.55
0.9

0.9
1.0

1.25
1.4

fT

150

275

MHz

Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

9.0

15

pF

Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

55

80

pF

TurnOn Time
(VCC = 30 Vdc, IC = 1.0 Adc, IB1 = 100 mAdc, VBE(off) = 2.0 Vdc)

ton

50

ns

TurnOff Time
(VCC = 30 Vdc, IC = 1.0 Adc, IB1 = IB2 = 100 mAdc)

toff

120

ns

Characteristic

Symbol

Unit

ON CHARACTERISTICS(2)
DC Current Gain
(IC = 150 mAdc, VCE = 1.0 Vdc)
(IC = 500 mAdc, VCE = 2.0 Vdc)
(IC = 1.0 Adc, VCE = 2.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)
(IC = 1.0 Adc, IB = 100 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)
(IC = 1.0 Adc, IB = 100 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(2)
(IC = 50 mAdc, VCE = 10 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

2. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2487

MPQ3762
1.6

100

IC = 10 IB1 = 10 IB2
VCC = 30 V
TJ = 25C
TJ = 125C

70

F = 10, 20

V(sat) , SATURATION VOLTAGE (VOLTS)

t sv, STORAGE TIME (ns)

200

F = 10

50

F = 20

30
ts ts 1/8 tf
20
50

70

hFE , MINIMUM CURRENT GAIN

F = 10
TJ = 25C

1.2

MAX

1.0
VBE(sat)
0.8

MIN

0.6
MAX VCE(sat)

0.4
0.2
0
50

100
200 300
500 700 1000
IC, COLLECTOR CURRENT (mA)

Figure 1. Storage Time Variation


with Temperature

70

1.4

70

100

200
300
500 700 1000
IC, COLLECTOR CURRENT (mA)

Figure 2. Limits of Saturation Voltage

TJ = 125C

50

VCE = 1.0 V
VCE = 2.0 V

TJ = 25C

30

TJ = 55C

20

10
50

70

100

200
300
IC, COLLECTOR CURRENT (mA)

500

700

1000

Figure 3. Minimum Current Gain Characteristics

2488

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Amplifier Transistors

MPQ3798
MPQ3799*

PNP Silicon

14

13

12

11

10

*Motorola Preferred Device

PNP

MAXIMUM RATINGS
Rating

Symbol

MPQ3798

Collector Emitter Voltage

VCEO

40

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

50

mAdc

Collector Current Continuous

Total Device Dissipation


@ TA = 25C(1)
Derate above 25C

PD

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range

MPQ3799

Unit

60

Vdc
14
1

Each
Transistor

Four
Transistors
Equal Power

0.5
4.0

0.9
7.2

Watts
mW/C

0.825
6.7

2.4
19.2

Watts
m/C

TJ, Tstg

CASE 64606, STYLE 1


TO116

55 to +150

THERMAL CHARACTERISTICS

Characteristic

RqJC
Junction
to Case

RqJA
Junction
to Ambient

Unit

Thermal Resistance

Each Die
Effective, 4 Die

151
52

250
139

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

34
2.0

70
26

%
%

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

40
60

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(2)
(IC = 10 mAdc, IB = 0)

V(BR)CEO
MPQ3798
MPQ3799

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCB = 50 Vdc, IE = 0)

ICBO

10

nAdc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

20

nAdc

1. Second breakdown occurs at power levels greater than 3 times the power dissipation rating.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2489

MPQ3798 MPQ3799
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Typ

Max

MPQ3798
MPQ3799

100
225

(IC = 100 mAdc, VCE = 5.0 Vdc)

MPQ3798
MPQ3799

150
300

(IC = 500 mAdc, VCE = 5.0 Vdc)

MPQ3798
MPQ3799

150
300

(IC = 10 mAdc, VCE = 5.0 Vdc)

MPQ3798
MPQ3799

125
250

0.12
0.07

0.2
0.25

0.62
0.68

0.7
0.8

fT

60

250

MHz

Output Capacitance (VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

2.1

4.0

pF

Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

5.5

8.0

pF

2.5
1.5

Characteristic

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 100 mAdc, IB = 10 mAdc)
(IC = 1.0 mAdc, IB = 100 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 100 mAdc, IB = 10 mAdc)
(IC = 1.0 mAdc, IB = 100 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

Noise Figure
(IC = 100 mAdc, VCE = 10 Vdc, RS = 3.0 k ohms,
f = 1.0 kHz)

2490

NF
MPQ3798
MPQ3799

dB

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1000

1000

500

500
h FE , CURRENT GAIN

h FE , CURRENT GAIN

MPQ3798 MPQ3799

200
100

10

100

10
0.01

0.1

1.0

10

100

0.01

1.0

10

IC, COLLECTOR CURRENT (mA)

Figure 1. DC Current Gain versus


Collector Current

Figure 2. DC Current Gain versus


Collector Current

1.0

1.0

0.8

0.8
VBE(sat) @ IC/IB = 10

0.6

0.4

0.2

100

VBE(sat) @ IC/IB = 10
0.6

0.4

0.2
VCE(sat) @ IC/IB = 10

VCE(sat) @ IC/IB = 10
0
0.01

0.1

IC, COLLECTOR CURRENT (mA)

V, VOLTAGE (VOLTS)

V, VOLTAGE (VOLTS)

200

0.1

1.0

10

100

0
0.01

0.1

1.0

10

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 3. ON Voltages

Figure 4. ON Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

100

2491

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Amplifier Switching


Transistor

MPQ3904

NPN Silicon

Motorola Preferred Device


14

13

12

11

10

NPN

MAXIMUM RATINGS

14

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

IC

200

mAdc

Collector Current Continuous

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range

Each
Transistor

Four
Transistors
Equal Power

500
4.0

900
7.2

mW
mW/C

825
6.7

2.4
19.2

Watts
mW/C

TJ, Tstg

CASE 64606, STYLE 1


TO116

55 to +150

THERMAL CHARACTERISTICS
Characteristic

Junction
to Case

Junction
to Ambient

Unit

Thermal Resistance

Each Die
Effective, 4 Die

151
52

250
139

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

34
2.0

70
26

%
%

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

6.0

Vdc

Collector Cutoff Current


(VCB = 40 Vdc, IE = 0)

ICBO

50

nAdc

Emitter Cutoff Current


(VEB = 40 Vdc, IC = 0)

IEBO

50

nAdc

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

2492

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ3904
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

30
50
75

90
160
200

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.1

0.2

Vdc

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

0.65

0.85

Vdc

fT

250

300

MHz

Output Capacitance (VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

2.0

4.0

pF

Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

4.0

8.0

pF

TurnOn Time
(IC = 10 mAdc, VBE(off) = 0.5 Vdc, IB1 = 1.0 mAdc)

ton

37

ns

TurnOff Time
(IC = 10 mAdc, IB1 = IB2 = 1.0 mAdc)

toff

136

ns

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2493

MPQ3904
DUTY CYCLE = 2%
300 ns

+3 V
+10.9 V

10 < t1 < 500 ms


275

t1

DUTY CYCLE = 2%

+3 V
+10.9 V
275

10 k

10 k
0

0.5 V

CS < 4 pF*

< 1 ns

CS < 4 pF*

1N916
9.1 V

< 1 ns

* Total shunt capacitance of test jig and connectors

Figure 1. Delay and Rise Time


Equivalent Test Circuit

Figure 2. Storage and Fall Time


Equivalent Test Circuit

TYPICAL TRANSIENT CHARACTERISTICS

TJ = 25C
TJ = 125C
10

5000
2000

5.0

Q, CHARGE (pC)

CAPACITANCE (pF)

VCC = 40 V
IC/IB = 10

3000

7.0

Cibo
3.0
Cobo

2.0

1000
700
500
QT

300
200

QA

1.0
0.1

2494

0.2 0.3

0.5 0.7 1.0

2.0 3.0

5.0 7.0 10

20 30 40

100
70
50

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

REVERSE BIAS VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 3. Capacitance

Figure 4. Charge Data

200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ3904
500

500
IC/IB = 10

100
70

tr @ VCC = 3.0 V

50
30
20

VCC = 40 V
IC/IB = 10

300
200
t r, RISE TIME (ns)

TIME (ns)

300
200

40 V

100
70
50
30
20

15 V
10
7
5

10
2.0 V

td @ VOB = 0 V
1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

Figure 5. Turn On Time

Figure 6. Rise Time

IC/IB = 10

200

500

ts = ts 1/8 tf
IB1 = IB2

VCC = 40 V
IB1 = IB2

300
200
IC/IB = 20
t f , FALL TIME (ns)

t s , STORAGE TIME (ns)

IC/IB = 20

200

IC, COLLECTOR CURRENT (mA)

500
300
200

7
5

100
70
IC/IB = 20

50

IC/IB = 10

30
20

100
70
50

10

10

7
5

7
5

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

200

IC/IB = 10

30
20

1.0

2.0 3.0

5.0 7.0 10

20

30

200

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 7. Storage Time

Figure 8. Fall Time

TYPICAL AUDIO SMALL SIGNAL CHARACTERISTICS


NOISE FIGURE VARIATIONS
(VCE = 5.0 Vdc, TA = 25C, Bandwidth = 1.0 Hz)

SOURCE RESISTANCE = 200


IC = 1.0 mA

NF, NOISE FIGURE (dB)

10

14

f = 1.0 kHz

SOURCE RESISTANCE = 200


IC = 0.5 mA

8
6

SOURCE RESISTANCE = 1.0 k


IC = 50 A

4
2
0
0.1

SOURCE RESISTANCE = 500


IC = 100 A

0.2

0.4

1.0

2.0

IC = 1.0 mA

12
NF, NOISE FIGURE (dB)

12

IC = 0.5 mA

10

IC = 50 mA

8
IC = 100 mA

6
4
2

4.0

10

20

40

100

0.1

0.2

0.4

1.0

2.0

4.0

10

20

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (k OHMS)

Figure 9.

Figure 10.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

40

100

2495

MPQ3904
h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25C)
100
hoe, OUTPUT ADMITTANCE (m mhos)

h fe , CURRENT GAIN

300

200

100
70
50

30

0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

50

20
10
5

2
1

10

0.1

0.2

Figure 11. Current Gain

h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

h ie , INPUT IMPEDANCE (k OHMS)

10
5.0

2.0
1.0
0.5

0.1

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

10

5.0

10

Figure 12. Output Admittance

20

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0

10
7.0
5.0
3.0
2.0

1.0
0.7
0.5

10

0.1

Figure 13. Input Impedance

0.2

0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

Figure 14. Voltage Feedback Ratio

h FE, DC CURRENT GAIN (NORMALIZED)

TYPICAL STATIC CHARACTERISTICS


2.0
TJ = +125C

VCE = 1.0 V

+25C

1.0
0.7

55C

0.5
0.3
0.2

0.1
0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

20

30

50

70

100

200

IC, COLLECTOR CURRENT (mA)

Figure 15. DC Current Gain

2496

Motorola SmallSignal Transistors, FETs and Diodes Device Data

VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

MPQ3904
1.0
TJ = 25C
0.8

IC = 1.0 mA

10 mA

30 mA

100 mA

0.6

0.4

0.2

0
0.01

0.02

0.03

0.05

0.07

0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

IB, BASE CURRENT (mA)

Figure 16. Collector Saturation Region

1.0

1.2
TJ = 25C
VBE(sat) @ IC/IB =10

0.8
VBE @ VCE =1.0 V
0.6
0.4
VCE(sat) @ IC/IB =10

qVC FOR VCE(sat)


0

55C TO +25C

0.5
55C TO +25C
1.0
+25C TO +125C

qVB FOR VBE(sat)

1.5

0.2
0

+25C TO +125C

0.5
COEFFICIENT (mV/ C)

V, VOLTAGE (VOLTS)

1.0

1.0

2.0

5.0

10

20

50

100

200

2.0

20

40

60

80

100

120

140

160

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 17. ON Voltages

Figure 18. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

180 200

2497

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Amplifier Switching


Transistor

MPQ3906

PNP Silicon

Motorola Preferred Device


14

13

12

11

10

PNP

MAXIMUM RATINGS

14

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

200

mAdc

Collector Current Continuous

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range

Each
Transistor

Four
Transistors
Equal Power

500
4.0

900
7.2

mW
mW/C

825
6.7

2.4
19.2

Watts
mW/C

TJ, Tstg

CASE 64606, STYLE 1


TO116

55 to +150

THERMAL CHARACTERISTICS
Characteristic

Junction
to Case

Junction
to Ambient

Unit

Thermal Resistance

Each Die
Effective, 4 Die

151
52

250
139

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

34
2.0

70
26

%
%

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

50

nAdc

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

50

nAdc

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

2498

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ3906
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Characteristic

Min

Typ

Max

40
60
75

160
180
200

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.1

0.25

Vdc

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

0.65

0.85

Vdc

fT

200

250

MHz

Output Capacitance (VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

3.3

4.5

pF

Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

4.8

10

pF

TurnOn Time
(IC = 10 mAdc, VBE(off) = 0.5 Vdc, IB1 = 1.0 mAdc)

ton

43

ns

TurnOff Time
(IC = 10 mAdc, IB1 = IB2 = 1.0 mAdc)

toff

155

ns

+9.1 V

< 1 ns

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

3V

3V
275

275

< 1 ns
+0.5 V

10 k

10 k
0
CS < 4 pF*

10.6 V

1N916
10 < t1 < 500 ms

300 ns
DUTY CYCLE = 2%

DUTY CYCLE = 2%

t1

CS < 4 pF*

10.9 V

* Total shunt capacitance of test jig and connectors

Figure 1. Delay and Rise Time


Equivalent Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 2. Storage and Fall Time


Equivalent Test Circuit

2499

MPQ3906
TYPICAL TRANSIENT CHARACTERISTICS

10

5000

7.0

3000
2000
Cobo

5.0

Q, CHARGE (pC)

CAPACITANCE (pF)

TJ = 25C
TJ = 125C

Cibo
3.0
2.0

VCC = 40 V
IC/IB = 10

1000
700
500
300
200

QT
QA

1.0
0.1

0.2 0.3

0.5 0.7 1.0


2.0 3.0 5.0 7.0 10
REVERSE BIAS (VOLTS)

100
70
50

20 30 40

1.0

2.0 3.0

Figure 3. Capacitance

5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)

200

Figure 4. Charge Data

500

500
IC/IB = 10

300
200

VCC = 40 V
IB1 = IB2

300
200

tr @ VCC = 3.0 V
15 V

30
20

t f , FALL TIME (ns)

TIME (ns)

IC/IB = 20
100
70
50

100
70
50
30
20

IC/IB = 10

40 V
10
7
5

2.0 V
td @ VOB = 0 V
1.0

2500

2.0 3.0

5.0 7.0 10

20

30

50 70 100

200

10
7
5

1.0

2.0 3.0

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. Turn On Time

Figure 6. Fall Time

200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ3906
TYPICAL AUDIO SMALL SIGNAL CHARACTERISTICS
NOISE FIGURE VARIATIONS
(VCE = 5.0 Vdc, TA = 25C, Bandwidth = 1.0 Hz)

NF, NOISE FIGURE (dB)

SOURCE RESISTANCE = 200


IC = 1.0 mA

12

f = 1.0 kHz

4.0
SOURCE RESISTANCE = 200
IC = 0.5 mA
3.0

SOURCE RESISTANCE = 2.0 k


IC = 50 A

2.0
SOURCE RESISTANCE = 2.0 k
IC = 100 A

1.0

0
0.1

0.2

0.4

IC = 1.0 mA

10
NF, NOISE FIGURE (dB)

5.0

IC = 0.5 mA
8
6
IC = 50 mA

IC = 100 mA

1.0 2.0 4.0


10
f, FREQUENCY (kHz)

20

40

100

0.1

0.2

0.4
1.0 2.0
4.0
10
20
Rg, SOURCE RESISTANCE (k OHMS)

Figure 7.

40

100

Figure 8.

h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25C)
100

hoe, OUTPUT ADMITTANCE ( mhos)

h fe , DC CURRENT GAIN

300

200

100
70
50

70
50
30
20

10
7

30

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

0.1

0.2

Figure 9. Current Gain


h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

h ie , INPUT IMPEDANCE (k OHMS)

10
7.0
5.0
3.0
2.0
1.0
0.7
0.5

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

Figure 10. Output Admittance

20

0.3
0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

Figure 11. Input Impedance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10
7.0
5.0
3.0
2.0

1.0
0.7
0.5

0.1

0.2

0.3
0.5 0.7 1.0
2.0 3.0
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

Figure 12. Voltage Feedback Ratio

2501

MPQ3906

h FE, DC CURRENT GAIN (NORMALIZED)

TYPICAL STATIC CHARACTERISTICS


2.0
TJ = +125C

VCE = 1.0 V

+25C

1.0
0.7

55C

0.5
0.3
0.2

0.1
0.1

0.2

0.3

0.5

0.7

1.0

2.0
3.0
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

20

30

70

50

100

200

VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

Figure 13. DC Current Gain


1.0
TJ = 25C
0.8

IC = 1.0 mA

10 mA

30 mA

100 mA

0.6

0.4

0.2

0
0.01

0.02

0.03

0.05

0.07

0.1

0.2
0.3
0.5
IB, BASE CURRENT (mA)

0.7

1.0

2.0

3.0

5.0

7.0

10

Figure 14. Collector Saturation Region

TJ = 25C

V, VOLTAGE (VOLTS)

0.8

q V , TEMPERATURE COEFFICIENTS (mV/ C)

1.0
VBE(sat) @ IC/IB = 10
VBE @ VCE = 1.0 V

0.6

0.4
VCE(sat) @ IC/IB = 10

0.2

1.0

2.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

Figure 15. ON Voltages

2502

100

200

1.0
0.5

qVC FOR VCE(sat)

+25C TO +125C

55C TO +25C

0.5
+25C TO +125C
1.0
55C TO +25C

qVB FOR VBE(sat)

1.5
2.0

20

40

60
80 100 120 140
IC, COLLECTOR CURRENT (mA)

160

180 200

Figure 16. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Complementary Pair


Transistors
NPN/PNP Silicon

14

13

12

11

10

MPQ6001, MPQ6002
TYPE A
14

13

12

11

10

MPQ6001
MPQ6002
MPQ6502
Voltage and current are negative
for PNP transistors

COMPLEMENTARY

MPQ6502
TYPE B

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

30

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

500

mAdc

Collector Current Continuous

Each
Transistor
Total Device Dissipation
@ TA = 25C(1)
MPQ6001, MPQ6002,
MPQ6502
Derate above 25C
MPQ6001, MPQ6002,
MPQ6502

PD

Total Device Dissipation


@ TC = 25C
MPQ6001, MPQ6002,
MPQ6502
Derate above 25C
MPQ6001, MPQ6002,
MPQ6502

PD

14
1

CASE 64606, STYLE 1


TO116

Four
Transistors
Equal Power
Watts

0.65

1.25
mW/C

5.18

10
Watts

1.0

3.0
mW/C

8.0

Operating and Storage Junction


Temperature Range

TJ, Tstg

24
55 to +150

THERMAL CHARACTERISTICS
Characteristic

Junction to
Case

Junction to
Ambient

Unit
C/W

Thermal Resistance
Each Die
Effective, 4 Die

MPQ6001, MPQ6002, MPQ6502


MPQ6001, MPQ6002, MPQ6502

125
41.6

193
100

Coupling Factors
Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

MPQ6001, MPQ6002, MPQ6502


MPQ6001, MPQ6002, MPQ6502

30
20

60
24

1. Voltage and Current are negative for PNP devices.

REV 3

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2503

MPQ6001 MPQ6002 MPQ6502


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(2)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

30

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCB = 50 Vdc, IE = 0)

ICBO

30

nAdc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

30

nAdc

MPQ6001
MPQ6002, MPQ6502

25
50

(IC = 10 mAdc, VCE = 10 Vdc)

MPQ6001
MPQ6002, MPQ6502

35
75

(IC = 150 mAdc, VCE = 10 Vdc)

MPQ6001
MPQ6002, MPQ6502

40
100

(IC = 300 mAdc, VCE = 10 Vdc)

MPQ6001
MPQ6002, MPQ6502

20
30

0.4
1.4

1.3
2.0

200

350

6.0
4.5

8.0
8.0

20
17

30
30

OFF CHARACTERISTICS

ON CHARACTERISTICS
DC Current Gain(2)
(IC = 1.0 mAdc, VCE = 10 Vdc)

hFE

Collector Emitter Saturation Voltage(2)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 300 mAdc, IB = 30 mAdc)

VCE(sat)

Base Emitter Saturation Voltage(2)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 300 mAdc, IB = 30 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(2)
(IC = 50 mAdc, VCE = 20 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance
(VEB = 2.0 Vdc, IC = 0, f = 1.0 MHz)

fT
Cobo
PNP
NPN

pF

Cibo
PNP
NPN

MHz

pF

SWITCHING CHARACTERISTICS
TurnOn Time
(VCC = 30 Vdc, VEB = 0.5 Vdc, IC = 150 mAdc,
IB1 = 15 mAdc, Figure 1)

ton

30

ns

TurnOff Time
(VCC = 30 Vdc, IC = 150 mAdc,
IB1 = IB2 = 15 mAdc)

toff

225

ns

2. Pulse Test: Pulse Width

2504

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ6001 MPQ6002 MPQ6502


NPN DATA

h FE, DC CURRENT GAIN (NORMALIZED)

4.0
3.0

VCE = 1.0 V
VCE = 10 V

TJ = 150C

2.0
+25C
1.0
0.7

55C

0.5
0.3
0.2
0.5

0.7

1.0

2.0

3.0

7.0

5.0

10

20

50

30

100

70

300

200

500

IC, COLLECTOR CURRENT (mA)

Figure 1. Normalized DC Current Gain


1.4

+1.6

q V , TEMPERATURE COEFFICIENT (mV/ C)

TJ = 25C

V, VOLTAGE (VOLTS)

1.2
1.0
VBE(sat) @ IC/IB = 10

0.8
0.6

VBE @ VCE = 1.0 V

0.4
0.2
0
0.5

VCE(sat) @ IC/IB = 10
1.0

5.0

2.0

10

20

100

50

200

+25C TO +150C
+0.8

qVC FOR VCE(sat)


55C TO +25C

0.8

qVB FOR VBE

1.6

2.4
0.5

500

1.0

5.0

2.0

10

20

50

100

200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 2. ON Voltages

Figure 3. Temperature Coefficients

500

NOISE FIGURE
(VCE = 10 Vdc, TA = 25C)
6.0

10

f = 1.0 kHz

4.0

IC = 10 A
RS = 4.3 k

3.0

m
W

2.0

IC = 100 A
RS = 1.0 k

1.0
0
0.1

100 A
IC = 1.0 mA

8.0
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

5.0

10 A

6.0

4.0

2.0

0
0.2

0.5

1.0

2.0

5.0

10

20

50

100

0.1

0.2

0.5

1.0

2.0

5.0

10

20

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (k OHMS)

Figure 4. Frequency Effects

Figure 5. Source Resistance Effects

Motorola SmallSignal Transistors, FETs and Diodes Device Data

50

100

2505

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Darlington
Transistor

MPQ6426

NPN Silicon

14

13

12

11

10

NPN

MAXIMUM RATINGS

14

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

30

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

12

Vdc

IC

500

mAdc

Collector Current Continuous

Each Die

Four Die
Equal
Power

CASE 64606, STYLE 1


TO116

Total Device Dissipation @ TA = 25C(1)


Derate above 25C

PD

500
4.0

900
7.2

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

825
6.7

2400
19.2

mW
mW/C

Operating and Storage Junction


Temperature Range

TJ, Tstg

55 to +150

THERMAL CHARACTERISTICS
Characteristic

Junction to
Case

Junction to
Ambient

Unit

Thermal Resistance

Each Die
Effective, 4 Die

151
52

250
139

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

34
2.0

70
26

%
%

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

30

40

12

100

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(2)
(IC = 10 mAdc, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

Emitter Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

Vdc
Vdc
Vdc
nAdc
nAdc

1. Second Breakdown occurs at power levels greater than 3 times the power dissipation rating.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

2506

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ6426
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

5000
10,000

1.5

2.0

125

8.0

15

Unit

ON CHARACTERISTICS(2)
DC Current Gain
(IC = 10 mAdc, VCE = 5.0 Vdc)
(IC = 100 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 100 mAdc, IB = 0.1 mAdc)

VCE(sat)

Base Emitter On Voltage


(IC = 100 mAdc, VCE = 5.0 Vdc)

VBE(on)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

fT

Output Capacitance
(VCB = 10 Vdc, IE = 0, f =1.0 MHz)

Cobo

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

2. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MHz
pF
pF

2507

MPQ6426
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
500

2.0

100

i n , NOISE CURRENT (pA)

200
e n , NOISE VOLTAGE (nV)

BANDWIDTH = 1.0 Hz

BANDWIDTH = 1.0 Hz
RS 0

10 A
50

100 A
20

IC = 1.0 mA

10

IC = 1.0 mA

0.3
0.2

100 A

0.1
0.07
0.05

10 A

0.03
0.02

5.0
50 100 200

10 20

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k

10 20

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

Figure 1. Noise Voltage

Figure 2. Noise Current

14

200

IC = 10 A

70

BANDWIDTH = 10 Hz TO 15.7 kHz

12

BANDWIDTH = 10 Hz TO 15.7 kHz


100

50
30

50 100 200

f, FREQUENCY (Hz)

NF, NOISE FIGURE (dB)

V T , TOTAL WIDEBAND NOISE VOLTAGE (nV)

1.0
0.7
0.5

100 A

10

10 A
8.0

100 A
6.0
IC = 1.0 mA

4.0

20
1.0 mA
10
1.0

2.0
0

2.0

5.0

10

20

50

100

200

1.0

500 1000

5.0

2.0

10

20

50

100

200

500 1000

RS, SOURCE RESISTANCE (k )

RS, SOURCE RESISTANCE (k )

Figure 3. Total Wideband Noise Voltage

Figure 4. Wideband Noise Figure

DYNAMIC CHARACTERISTICS
4.0
h fe , SMALLSIGNAL CURRENT GAIN

20

C, CAPACITANCE (pF)

TJ = 25C
10
Cib

7.0

Cob

5.0

3.0
2.0
0.04

2508

VCE = 5.0 V
f = 100 MHz
TJ = 25C

2.0

1.0
0.8
0.6
0.4
0.2

0.1

0.2

0.4

1.0

2.0

4.0

10

20

40

0.5

1.0

2.0

5.0

10

20

50

100

200

VR, REVERSE VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 5. Capacitance

Figure 6. High Frequency Current Gain

500

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Complementary Pair


Transistor

MPQ6700

NPN/PNP Silicon

14

13

12

11

10

MPQ6502
For Specifications,
See MPQ6001 Data

COMPLEMENTARY

MPQ6600A1

TYPE B

For Specifications,
See MPQ6100A Data

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

200

mAdc

Collector Current Continuous

Total Device Dissipation


@ TA = 25C(1)
Derate above 25C

PD

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range

Voltage and current are


negative for PNP transistors

Motorola Preferred Device

Each
Transistor

Four
Transistors
Equal Power

500
4.0

900
7.2

mW
mW/C

825
6.7

2400
19.2

mW
mW/C

TJ, Tstg

14
1

CASE 64606, STYLE 1


TO116
TYPE B

55 to +150

THERMAL CHARACTERISTICS
Characteristic

Junction to
Case

Junction to
Ambient

Unit

Thermal Resistance

Each Die
Effective, 4 Die

151
52

250
139

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

34
2.0

70
26

%
%

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

40

40

5.0

50

50

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(2)
(IC = 10 mAdc, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

Vdc
Vdc
Vdc
nAdc
nAdc

1. Second Breakdown occurs at power levels greater than 3 times the power dissipation rating.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2509

MPQ6700
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Characteristic

Min

Max

30
50
70

0.25

0.9

200

4.5

10
8.0

Unit

ON CHARACTERISTICS(2)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(2)
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f =1.0 MHz)
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
2. Pulse Test: Pulse Width

2510

v 300 ms; Duty Cycle v 2.0%.

MHz

Cobo

pF

Cibo
PNP
NPN

pF

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ6700
500

500

300

300
TJ = 125C

200
h FE, DC CURRENT GAIN

h FE, DC CURRENT GAIN

200

25C

100
70
50

55C

30
20
10
7.0
5.0
0.2

VCE = 1.0 V
VCE = 5.0 V
0.5

1.0

2.0

5.0

10

20

50

100

200

30
20
VCE = 1.0 V
VCE = 5.0 V
0.5

1.0 2.0

5.0

10

50 100 200

20

Figure 1. DC Current Gain

Figure 2. DC Current Gain

1.0
TJ = 25C

VBE(sat) @ IC/IB = 10
0.8
V, VOLTAGE (VOLTS)

V, VOLTAGE (VOLTS)

55C

IC, COLLECTOR CURRENT (mA)

0.8
VBE(on) @ VCE = 1.0 V
0.6

0.4

0.2

0.5

1.0

2.0

5.0

10

20

50

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 1.0 V

0.4

0.2

VCE(sat) @ IC/IB = 10

VCE(sat) @ IC/IB = 10
100

0
0.2

200

0.5

1.0

2.0

5.0

10

20

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 3. ON Voltage

Figure 4. ON Voltage

50 100 200

+2.0

q V , TEMPERATURE COEFFICIENT (mV/C)

+2.0

q V , TEMPERATURE COEFFICIENT (mV/C)

25C

IC, COLLECTOR CURRENT (mA)

TJ = 25C

* APPLIES FOR IC/IB hFE/2.0


+1.0
25C TO 125C

*qVC FOR VCE(sat)


0

55C TO 25C
25C TO 125C

1.0

qVB FOR VBE

55C TO 25C

2.0

3.0
0.2

100
70
50

10
7.0
5.0
0.2

1.0

0
0.2

TJ = 125C

0.5

1.0

2.0

5.0

10

20

50

100

200

* APPLIES FOR IC/IB hFE/2.0


+1.0

25C TO 125C

*qVC FOR VCE(sat)


0

55C TO 25C

1.0

2.0

3.0
0.2

25C TO 125C

qVB FOR VBE

0.5

1.0

55C TO 25C

2.0

5.0

10

20

50 100 200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. Temperature Coefficients

Figure 6. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2511

1.0

VCE , COLLECTOR EMITTER VOLTAGE (VOLTS)

VCE , COLLECTOR EMITTER VOLTAGE (VOLTS)

MPQ6700

TJ = 25C
0.8

0.6

IC = 1.0 mA

10 mA

50 mA

100 mA

0.4

0.2

0
0.01 0.02 0.05 0.1 0.2

0.5 1.0 2.0

5.0

10 20

50 100

IC = 1.0 mA

50 mA

100 mA

0.4

0.2
0
0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20

50

500
IC/IB = 10
TJ = 25C

100
70
50

300
200

tr @ VCC = 3.0 V

30

40 V

VBE(off) = 0
20

30

50 70 100

100
70
50
30
Tr @ VCC = 3.0 V
10
7.0
5.0
2.0 3.0 5.0 7.0 10

2.0 V

5.0 7.0 10

IC/IB = 10
TJ = 25C

tr @ VCC = 40 V

20

200

2.0 V
td @ VBE(off) = 0
20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 9. TurnOn Time

Figure 10. TurnOn Time

200

500

500
ts = ts = 1/8 tf
VCC = 3.0 V
IB1 = IB2
TJ = 25C

300
200

300
200

IC/IB = 10

20

t, TIME (ns)

100
70
50

IC/IB = 20
tf @ IC/IB = 10

30
20

10
7.0
5.0
2.0 3.0

10
7.0
5.0
2.0 3.0

5.0 7.0 10

20

30

50 70 100

200

ts = ts 1/8 tf
VCC = 40 V
IB1 = IB2

IC/IB = 20

IC/IB = 10

100
70
50

20

2512

10 mA

Figure 8. Collector Saturation Region

t, TIME (ns)

t, TIME (ns)

0.6

Figure 7. Collector Saturation Region

20

t, TIME (ns)

0.8

IB, BASE CURRENT (mA)

300
200

30

TJ = 25C

IB, BASE CURRENT (mA)

500

10
7.0
5.0
2.0 3.0

1.0

IC/IB = 20
tf @ IC/IB = 10

5.0 7.0 10

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 11. TurnOff Time

Figure 12. TurnOff Time

200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

500
TJ = 25C
VCE = 20 V
f = 100 MHz

300
200
150
100
70
50
0.3

0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

MPQ6700

TJ = 25C
VCE = 20 V
f = 100 MHz

500

300
200

100
70
0.3 0.5 0.7 1.0

2.0 3.0

5.0 7.0 10

20 30

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 13. CurrentGain Bandwidth Product

Figure 14. CurrentGain Bandwidth Product

7.0

10

C, CAPACITANCE (pF)

3.0

Cib

2.0
1.5

5.0
Cib
3.0
2.0
Cob

Cob

1.0
0.7
0.06 0.1

TJ = 25C

7.0

TJ = 25C

5.0
C, CAPACITANCE (pF)

700

0.2

0.4 0.6 1.0

2.0

4.0 6.0 10

20

40 60

1.0
0.04

0.1 0.2 0.4

1.0 2.0

4.0

VR, REVERSE VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 15. Capacitance

Figure 16. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

40

2513

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Complementary Pair


Transistor

MPQ6842

NPN/PNP Silicon

14

13

12

11

10

Voltage and current are


negative for PNP transistors

COMPLEMENTARY

TYPE B

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

30

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

IC

200

mAdc

Collector Current Continuous

Total Device Dissipation


@ TA = 25C(1)
Derate above 25C

PD

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range

Each
Transistor

Four
Transistors
Equal Power

500
4.0

900
7.2

mW
mW/C

825
6.7

2400
19.2

mW
mW/C

TJ, Tstg

14
1

CASE 64606, STYLE 1


TO116
TYPE B

55 to +150

THERMAL CHARACTERISTICS
Characteristic

Junction to
Case

Junction to
Ambient

Unit

Thermal Resistance

Each Die
Effective, 4 Die

151
52

250
139

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

34
2.0

70
26

%
%

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

30

30

4.0

50

50

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(2)
(IC = 10 mAdc, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)

ICBO

Emitter Cutoff Current


(VEB = 3.0 Vdc, IE = 0)

IEBO

Vdc
Vdc
Vdc
nAdc
nAdc

1. Second Breakdown occurs at power levels greater than 3 times the power dissipation rating.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

2514

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ6842
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Characteristic

Min

Typ

Max

30
50
70

0.05

0.15

0.65

0.9

200

350

3.0

4.5

5.0
4.0

10
8.0

15
6.0

25
15

5.0

25

35

5.0

10

20

Unit

ON CHARACTERISTICS(2)
DC Current Gain
(IC = 0.5 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 0.5 mAdc, IB = 0.05 mAdc, 0C T 70C)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 0.5 mAdc, IB = 0.05 mAdc)

VBE(sat)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(2)
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f =1.0 MHz)
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

MHz

Cobo

pF

Cibo
PNP
NPN

pF

SWITCHING CHARACTERISTICS (TA = 25C, VCC = 5.0 Vdc)


Propagation Delay Time
(50% Points TP1 to TP3)
(50% Points TP2 to TP4)

ns
tPLH
tPHL

Rise Time
(0.3 V to 4.7 V, TP3 or TP4)

tr

Fall Time
(4.7 V to 0.3 V, TP3 or TP4)

tf

2. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

ns
ns

2515

MPQ6842
500

500

300

300
TJ = 125C

200
h FE, DC CURRENT GAIN

h FE, DC CURRENT GAIN

200

25C

100
70
50

55C

30
20
10
7.0
5.0
0.2

VCE = 1.0 V
VCE = 5.0 V
0.5

1.0

2.0

5.0

10

20

50

100

200

VCE = 1.0 V
VCE = 5.0 V
0.5

1.0 2.0

5.0

10

50 100 200

20

Figure 2. DC Current Gain

1.0
TJ = 25C

VBE(sat) @ IC/IB = 10
0.8
V, VOLTAGE (VOLTS)

V, VOLTAGE (VOLTS)

30
20

Figure 1. DC Current Gain

VBE(on) @ VCE = 1.0 V


0.6

0.4

0.2

0.5

1.0

2.0

5.0

10

20

50

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 1.0 V

0.4

0.2

VCE(sat) @ IC/IB = 10

VCE(sat) @ IC/IB = 10
100

0
0.2

200

0.5

1.0

2.0

4.0

10

20

40

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 3. ON Voltage

Figure 4. ON Voltage

100

+2.0

q V , TEMPERATURE COEFFICIENT (mV/C)

+2.0

q V , TEMPERATURE COEFFICIENT (mV/C)

55C

IC, COLLECTOR CURRENT (mA)

0.8

* APPLIES FOR IC/IB hFE/2.0


+1.0
25C TO 125C

*qVC FOR VCE(sat)


0

55C TO 25C
25C TO 125C

1.0

qVB FOR VBE

55C TO 25C

2.0

2516

25C

IC, COLLECTOR CURRENT (mA)

TJ = 25C

3.0
0.2

100
70
50

10
7.0
5.0
0.2

1.0

0
0.2

TJ = 125C

0.5

1.0

2.0

5.0

10

20

50

100

200

* APPLIES FOR IC/IB hFE/2.0


+1.0

25C TO 125C

*qVC FOR VCE(sat)


0

55C TO 25C

1.0

2.0

3.0
0.2

25C TO 125C

qVB FOR VBE

0.5

1.0

55C TO 25C

2.0

5.0

10

20

50 100 200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. Temperature Coefficients

Figure 6. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0

VCE , COLLECTOR EMITTER VOLTAGE (VOLTS)

VCE , COLLECTOR EMITTER VOLTAGE (VOLTS)

MPQ6842

TJ = 25C
0.8

0.6

IC = 1.0 mA

10 mA

50 mA

100 mA

0.4

0.2

0
0.01 0.02 0.05 0.1 0.2

0.5 1.0 2.0

5.0

10 20

1.0
TJ = 25C
0.8

0.6

IC = 1.0 mA

10 mA

50 mA

100 mA

0.4

0.2

50 100

0
0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20

IB, BASE CURRENT (mA)

IB, BASE CURRENT (mA)

Figure 7. Collector Saturation Region

Figure 8. Collector Saturation Region

50

VCC
+5 V

33 pF
1k

6
4.7 k

0.1 mF CERAMIC

1/4 MC3001 (74H08)

22
TP3
68 pF

10
160 pF

TP1
1

10 k

PULSE
GENERATOR
0 TO 5 V
51
tr, tf 2 ns
PW 200 ns
PERIOD 1000 ns

33 pF

VCC
+5 V
1 k 10

NOTES:
1. Unless otherwise noted, all resistors carbon composition
1/ W 5%, all capacitors dipped mica 2%.
4
2. Use short interconnect wiring with good power and
ground buses.
3. TP1 thru TP4 are coaxial connectors to accept scope
probe tip and provide a good ground.
4. Device under test is MPQ6842.
5. 160 pF load does not include stray or scope probe
capacitance.
6. Scope probe resistance > 5 k .
Scope probe capacitance < 10 pF.

0.1 mF CERAMIC

9
4.7 k

8
TP1 OR TP2

1/4 MC3000 (74H00)

50%

22
TP4
68 pF

TP2

10

13

tPLH

160 pF
14

10 k

tPHL

12

4.7 V
TP3 OR TP4
tf

50%
0.3 V
tr

Figure 9. Switching Times Test Circuit and Waveforms

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2517

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MPQ7041
MPQ7042
MPQ7043*

Quad Amplifier
Transistors
NPN Silicon

14

13

12

11

10

COMPLEMENTARY

*Motorola Preferred Device


6

TYPE B

MAXIMUM RATINGS
Rating

Symbol

MPQ7041

MPQ7042

MPQ7043

Unit

Collector Emitter Voltage

VCEO

150

200

250

Vdc

Collector Base Voltage

VCBO

150

200

250

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

500

mAdc

Collector CurrentContinuous

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range

14

Each Die

Four Die
Equal Power

750
5.98

1700
13.6

mW
mW/C

1.25
10

3.2
25.6

Watts
mW/C

TJ, Tstg

CASE 64606, STYLE 1


TO116

55 to +150

THERMAL CHARACTERISTICS
Characteristic

Junction to
Case

Junction to
Ambient

Unit

Thermal Resistance

Each Die
Effective, 4 Die

100
39

167
73.5

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

46
5.0

56
10

%
%

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

150
200
250

150
200
250

5.0

100
100
100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CEO
MPQ7041
MPQ7042
MPQ7043
V(BR)CBO
MPQ7041
MPQ7042
MPQ7043

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 120 Vdc, IE = 0)
(VCB = 150 Vdc, IE = 0)
(VCB = 180 Vdc, IE = 0)

Vdc

Vdc

V(BR)EBO

Vdc

ICBO
MPQ7041
MPQ7042
MPQ7043

nAdc

Preferred devices are Motorola recommended choices for future use and best overall value.

2518

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ7041 MPQ7042 MPQ7043


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Characteristic

Min

Max

Max

25
40
40

45
60
80

0.3

0.5

0.7

0.9

50

80

2.5

5.0

40

50

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VBE(sat)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT

MHz

Output Capacitance
(VCB = 20 Vdc, IE = 0, f =1.0 MHz)

Cobo

Input Capacitance
(VEB = 3.0 Vdc, IC = 0, f = 1.0 MHz)

Cibo

pF
pF

DC CHARACTERISTICS
1.4

200
VCE = 10 V

TJ = 125C

TJ = 25C

V, VOLTAGE (VOLTS)

h FE, DC CURRENT GAIN

1.2
25C

100
70

55C
50

30
20
1.0

1.0
0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ IC/IB = 10 V

0.4
0.2

VCE(sat) @ IC/IB = 10

5.0

0
2.0

3.0

5.0 7.0 10

20

30

50 70 100

5.0 7.0 10

2.0 3.0

1.0

20

30

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 1. DC Current Gain

Figure 2. ON Voltages

50 70 100

q V , TEMPERATURE COEFFICIENT (mV/C)

2.5
IC/IB = 10

2.0
1.5
1.0

25C TO 125C

qVC FOR VCE(sat)

0.5
0

55C TO 25C

0.5
1.0

55C TO 125C

qVB FOR VBE

1.5
2.0
2.5
1.0

2.0 3.0

5.0 7.0

10

20

30

50

70

100

IC, COLLECTOR CURRENT (mA)

Figure 3. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2519

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Complementary Pair


Transistor
NPN/PNP Silicon

14

13

12

11

10

COMPLEMENTARY

MPQ7051
Voltage and current are
negative for PNP transistors

TYPE B

Motorola Preferred Device

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

150

Vdc

Collector Base Voltage

VCBO

150

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

IC

500

mAdc

Collector Current Continuous

Each Die

Four Die
Equal
Power

14
1

CASE 64606, STYLE 1


TO116
TYPE B

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

750
5.98

1700
13.6

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.25
10

3.2
25.6

Watts
mW/C

Operating and Storage Junction


Temperature Range

TJ, Tstg

55 to +150

THERMAL CHARACTERISTICS
Characteristic

Junction to
Case

Junction to
Ambient

Unit

Thermal Resistance

Each Die
Effective, 4 Die

100
39

167
73.5

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

46
5.0

56
10

%
%

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

150

150

5.0

250

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 120 Vdc, IE = 0)

ICBO

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

Vdc
Vdc
Vdc
nAdc
nAdc

Preferred devices are Motorola recommended choices for future use and best overall value.

2520

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPQ7051
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Characteristic

Min

Max

25
35
25

0.7

0.9

50

6.0

50
75

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


IC = 20 mAdc, IB = 2.0 mAdc)

VBE(sat)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT

Output Capacitance
(VCB = 20 Vdc, IC = 0, f =1.0 MHz)
Input Capacitance
(VEB = 3.0 Vdc, IC = 0, f = 1.0 MHz)

MHz

Cobo

pF

Cibo
NPN
PNP

Motorola SmallSignal Transistors, FETs and Diodes Device Data

pF

2521

MPQ7051
DC CHARACTERISTICS

200

200
TJ = 125C

VCE = 10 V
h FE, DC CURRENT GAIN

h FE, DC CURRENT GAIN

VCE = 10 V

25C

100
70

55C
50

30

TJ = 125C
25C

100

55C

70
50

30

20
1.0

2.0

3.0

5.0 7.0 10

20

30

20
1.0

50 70 100

2.0 3.0

5.0 7.0 10

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 1. DC Current Gain

Figure 2. DC Current Gain

TJ = 25C

TJ = 25C
1.2
V, VOLTAGE (VOLTS)

V, VOLTAGE (VOLTS)

1.2
1.0
0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ IC/IB = 10 V

0.4
0.2
1.0

2.0 3.0

5.0 7.0 10

20

1.0
0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 10 V

0.4
5.0

VCE(sat) @ IC/IB = 10

0.2

VCE(sat) @ IC/IB = 10

5.0

0
30

0
1.0

50 70 100

2.0 3.0

5.0 7.0 10

20 30

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 3. ON Voltages

Figure 4. ON Voltages

50 70 100

2.5

q V , TEMPERATURE COEFFICIENT (mV/C)

2.5

q V , TEMPERATURE COEFFICIENT (mV/C)

50 70 100

1.4

1.4

IC/IB = 10

2.0
1.5
1.0

25C TO 125C

qVC FOR VCE(sat)

0.5
0

55C TO 25C

0.5
1.0

55C TO 125C

qVB FOR VBE

1.5
2.0
2.5
1.0

2522

20 30

2.0 3.0

5.0 7.0

10

20

30

50

70

100

IC/IB = 10

2.0
1.5

25C TO 125C

1.0
0.5

qVC FOR VCE(sat)


55C TO 25C

0
0.5
1.0
1.5

55C TO 125C

qVB FOR VBE

2.0
2.5
1.0

2.0 3.0

5.0 7.0 10

20 30

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. Temperature Coefficients

Figure 6. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Quad Amplifier
Transistors
PNP Silicon

14

13

12

11

10

MPQ7091
MPQ7093*

COMPLEMENTARY

*Motorola Preferred Device


1

TYPE B

MAXIMUM RATINGS
Rating

Symbol

MPQ7091

MPQ7093

Unit

Collector Emitter Voltage

VCEO

150

250

Vdc

Collector Base Voltage

VCBO

150

250

Vdc

Emitter Base Voltage

VEBO

5.0

IC

500

Collector Current Continuous

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range

Vdc
mAdc

Each Die

Four Die
Equal
Power

750
5.98

1700
13.6

mW
mW/C

1.25
10

3.2
25.6

Watts
mW/C

TJ, Tstg

14

55 to +150

CASE 64606, STYLE 1


TO116

THERMAL CHARACTERISTICS
Characteristic

Junction to
Case

Junction to
Ambient

Unit

Thermal Resistance

Each Die
Effective, 4 Die

100
39

167
73.5

C/W
C/W

Coupling Factors

Q1Q4 or Q2Q3
Q1Q2 or Q3Q4

46
5.0

56
10

%
%

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

150
250

150
250

5.0

250
250

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
MPQ7091
MPQ7093
V(BR)CBO
MPQ7091
MPQ7093

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 120 Vdc, IE = 0)

Vdc

Vdc

V(BR)EBO

Vdc

ICBO
MPQ7091
MPQ7093

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

nAdc

IEBO

nAdc

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2523

MPQ7091 MPQ7093
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Characteristic

Min

Max

Max

25
35
25

40
55
50

0.3

0.5

0.7

0.9

50

70

3.0

5.0

60

75

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VBE(sat)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT

Output Capacitance
(VCB = 20 Vdc, IE = 0, f =1.0 MHz)

Cobo

Input Capacitance
(VEB = 3.0 Vdc, IC = 0, f = 1.0 MHz)

Cibo

MHz
pF
pF

DC CHARACTERISTICS
1.4

200
VCE = 10 V

TJ = 125C

TJ = 25C

25C

100

V, VOLTAGE (VOLTS)

h FE, DC CURRENT GAIN

1.2

55C

70
50

30
20
1.0

1.0
0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 10 V

0.4

2.0 3.0

20 30

5.0 7.0 10

0
1.0

50 70 100

5.0

VCE(sat) @ IC/IB = 10

0.2
2.0 3.0

5.0 7.0 10

20 30

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 1. DC Current Gain

Figure 2. ON Voltages

50 70 100

q V , TEMPERATURE COEFFICIENT (mV/C)

2.5
IC/IB = 10

2.0
1.5

25C TO 125C

1.0
0.5

qVC FOR VCE(sat)


55C TO 25C

0
0.5
1.0
1.5

55C TO 125C

qVB FOR VBE

2.0
2.5
1.0

2.0 3.0

5.0 7.0 10

20 30

50 70 100

IC, COLLECTOR CURRENT (mA)

Figure 3. Temperature Coefficients

2524

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Chopper Transistor

MPS404A

PNP Silicon

COLLECTOR
3

Motorola Preferred Device

2
BASE
1
EMITTER

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

35

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

25

Vdc

Collector Current Continuous

IC

150

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case

Max

Unit

RqJA(1)

200

C/W

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(2)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

35

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

25

Vdc

Collector Cutoff Current


(VCB = 10 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current


(VBE = 10 Vdc, IC = 0)

IEBO

100

nAdc

OFF CHARACTERISTICS

2. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2525

MPS404A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

DC Current Gain
(IC = 12 mAdc, VCE = 0.15 Vdc)

hFE

30

400

Collector Emitter Saturation Voltage


(IC = 12 mAdc, IB = 0.4 mAdc)
(IC = 24 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.15
0.2

Base Emitter Saturation Voltage


(IC = 12 mAdc, IB = 0.4 mAdc)
(IC = 24 mAdc, IB = 1.0 mAdc)

VBE(sat)

0.85
1.0

fob

4.0

MHz

Cobo

20

pF

NORMAL MODE
INVERTED MODE

TJ = 25C

ON CHARACTERISTICS

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


CommonBase Cutoff Frequency
(IC = 1.0 mAdc, VCB = 6.0 Vdc)
Output Capacitance
(VCB = 6.0 Vdc, IE = 0, f = 1.0 MHz)

VBC, BASECOLLECTOR VOLTAGE (VOLTS)


VBE, BASEEMITTER VOLTAGE (VOLTS)

VEC , EMITTERCOLLECTOR VOLTAGE (mV)


VCE , COLLECTOREMITTER VOLTAGE (mV)

100
NORMAL MODE
INVERTED MODE

80

TJ = 25C

60
VCE(sat) @ IC/IB = 10

40
IC/IB = 2.0

20

0
1.0

VEC(sat) @ IE/IB = 2.0

2.0 3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)
IE, EMITTER CURRENT (mA)

50 70 100

Figure 1. CollectorEmitter Voltage

2526

0.9

0.82

0.74

0.66

VBE(sat) @ IC/IB = 2
VBC(sat) @ IE/IB = 2

VBE(on) @ VCE = 1.0 V

0.58

0.50
1.0

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)
IE, EMITTER CURRENT (mA)

50 70 100

Figure 2. Base On Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS404A
NORMAL MODE

INVERTED MODE
10

200

TJ = 125C

25C

100
80

hFE , DC CURRENT GAIN

hFE , DC CURRENT GAIN

7.0

60
55C
40
30
20

5.0

25C

55C

3.0
2.0
1.5

10
1.0

2.0 3.0

5.0 7.0 10

20 30

1.0
1.0

50 70 100

5.0 7.0 10

20 30

50 70 100

IE, EMITTER CURRENT (mA)

Figure 3. DC Current Gain @ VCE = 0.15 Vdc

Figure 4. DC Current Gain @ VEC = 0.15 Vdc

600

10

400

TJ = 125C

7.0
TJ = 125C

300
200

hFE , DC CURRENT GAIN

hFE , DC CURRENT GAIN

2.0 3.0

IC, COLLECTOR CURRENT (mA)

25C

100
80

55C

60

25C

5.0
55C
3.0
2.0

40
30
1.0

2.0 3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

1.0
1.0

50 70 100

0.5
TJ = 25C
0.4

0.3

5.0 7.0 10
20 30
IE, EMITTER CURRENT (mA)

50 70 100

Figure 6. DC Current Gain @ VEC = 1.0 Vdc


VEC , EMITTERCOLLECTOR VOLTAGE (VOLTS)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 5. DC Current Gain @ VCE = 1.0 Vdc

2.0 3.0

0.5

TJ = 25C

0.4

IC = 2.0 mA

10 mA

50 mA

0.3

IE = 0.5 mA 2.0 mA

50 mA

10 mA

0.2

0.2

0.1

0.1

0
0.005 0.01 0.02

0.05 0.1 0.2


0.5
IB, BASE CURRENT (mA)

1.0

2.0

5.0

Figure 7. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0
0.05 0.1

0.2

0.5 1.0 2.0


5.0
IB, BASE CURRENT (mA)

10

20

50

Figure 8. Emitter Saturation Region

2527

MPS404A
70
50

20
NOTE: The dynamic resistance between the emitter and
NOTE: collector is measured with the device operated in
NOTE: the Inverted Mode.

TJ = 25C
C, CAPACITANCE (pF)

rec(on), EMITTERCOLLECTOR ON
RESISTANCE (OHMS)

100

Ie = 100 A RMS
f = 1.0 kHz
TJ = 25C
IE = 0

30
20

7.0

Cob

5.0
Cib

10
3.0
7.0
5.0
0.1

0.2 0.3

0.5 0.7 1.0

2.0 3.0

2.0
0.05 0.1

5.0 7.0 10

0.2

0.5

1.0 2.0

5.0

10

IB, BASE CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 9. EmitterCollector On Resistance

Figure 10. Capacitance

2.0 k

20

50

1.0 k
VCC = 10 V
IC/IB = 0
TJ = 25C

1.0 k
700
500

VCC = 10 V
IC/IB = 0
IB1 = IB2
TJ = 25C

700
ts
500

300
200

t, TIME (ns)

t, TIME (ns)

10

tr

100
70
50

tf

300
200

td @ VBE(off) = 1.4 V

30
20
1.0

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 11. TurnOn Time

RBB
1.0 k

Vin

50 70 100

Figure 12. TurnOff Time

VCC
(6.0 V)

1.0 k
TO SCOPE

RC (560 )
C1

RB

(0250 pF)

10 k

RB*
(5.6 k)

INPUT Vin

51

Vin
(Volts)

VBB
(Volts)

ton, td and tr

12

+1.4

toff, ts and tf

+20.6

11.6

Voltages and resistor values shown


are for IC = 10 mA. IC/IB = 10 and IB1
= IB2. Resistor values changed to obtain curves in Figures 11 and 12.

Figure 13. Switching Time Test Circuit

2528

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

VCC = 10 V

VBB

0.1 F

100
1.0

MEASUREMENT PROCEDURE
C1 is increased until the toff time of
the output waveform is decreased to
0.2 s, QS is then calculated by
QS = C1 Vin.
QS3 or QS7 by BLine Electronics
or equivalent may also be used.

OUTPUT

VOLTAGE WAVEFORMS
0
6.0 V
Vout
6.0 V

>5.0 s
Vin

tr, tf < 15 ns
10%
toff

Figure 14. Stored Base Charge Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN
MPS650
MPS651 *
PNP
MPS750
MPS751 *

Amplifier Transistors
COLLECTOR
3

COLLECTOR
3
2
BASE

2
BASE
NPN

PNP

Voltage and current are


negative for PNP transistors

1
EMITTER

1
EMITTER

*Motorola Preferred Devices

MAXIMUM RATINGS
Symbol

MPS650
MPS750

MPS651
MPS751

Unit

Collector Emitter Voltage

VCE

40

60

Vdc

Collector Base Voltage

VCB

60

80

Vdc

Emitter Base Voltage

Rating

VEB

5.0

Vdc

Collector Current Continuous

IC

2.0

Adc

Total Power Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Power Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watt
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

40
60

60
80

5.0

0.1
0.1

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 10 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 Adc, IE = 0 )

V(BR)CEO
MPS650, MPS750
MPS651, MPS751
V(BR)CBO
MPS650, MPS750
MPS651, MPS751

Emitter Base Breakdown Voltage


(IC = 0, IE = 10 Adc)
Collector Cutoff Current
(VCB = 60 Vdc, IE = 0)
(VCB = 80 Vdc, IE = 0)

Vdc

V(BR)EBO

Vdc

Adc

ICBO
MPS650, MPS750
MPS651, MPS751

Emitter Cutoff Current


(VEB = 4.0 V, IC = 0)

IEBO

Vdc

Adc

1. Pulse Test: Pulse Width 300 ms, Duty Cycle = 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2529

NPN MPS650 MPS651 PNP MPS750 MPS751


ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

75
75
75
40

0.5
0.3

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 50 mA, VCE = 2.0 V)
(IC = 500 mA, VCE = 2.0 V)
(IC = 1.0 A, VCE = 2.0 V)
(IC = 2.0 A, VCE = 2.0 V)

hFE

Collector Emitter Saturation Voltage


(IC = 2.0 A, IB = 200 mA)
(IC = 1.0 A, IB = 100 mA)

VCE(sat)

Vdc

BaseEmitter On Voltage (IC = 1.0 A, VCE = 2.0 V)

VBE(on)

1.0

Vdc

Base Emitter Saturation Voltage (IC = 1.0 A, IB = 100 mA)

VBE(sat)

1.2

Vdc

fT

75

MHz

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(2)
(IC = 50 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
1. Pulse Test: Pulse Width 300 ms, Duty Cycle = 2.0%.
2. fT is defined as the frequency at which |hfe| extrapolates to unity.

NPN

PNP

300

250

270
TJ = 125C

210
180

25C

150
120
55C

90

125
100

55C

75

30

25
50

25C

150

50

20

0
10 20

100 200
500 1.0 A 2.0 A 4.0 A
IC, COLLECTOR CURRENT (mA)

Figure 1. MPS650, MPS651


Typical DC Current Gain

PNP
2.0

1.8

1.8

1.6

1.6
V, VOLTAGE (VOLTS)

V, VOLTAGE (VOLTS)

NPN

1.4
1.2
1.0

VBE(sat) @ IC/IB = 10

0.8
VBE(on) @ VCE = 2.0 V

0.6

50 10 200 500 1.0 A 2.0 A 4.0 A


0
IC, COLLECTOR
CURRENT (mA)

Figure 2. MPS750, MPS751


Typical DC Current Gain

2.0

0.4

1.4
1.2
VBE(sat) @ IC/IB = 10

1.0
0.8

VBE(on) @ VCE = 2.0 V

0.6
0.4

VCE(sat) @ IC/IB = 10

0.2

VCE(sat) @ IC/IB = 10

0.2

0
50

100

200
500
1.0 A
IC, COLLECTOR CURRENT (mA)

Figure 3. MPS650, MPS651


On Voltages

2530

VCE = 2.0 V

175

60

0
10

TJ = 125C

200
hFE, DC CURRENT GAIN

hFE, DC CURRENT GAIN

240

225

VCE = 2.0 V

2.0 A

4.0 A

50

10
20
50
1.0 A
0 IC, COLLECTOR
0
0
CURRENT
(mA)

2.0 A

4.0 A

Figure 4. MPS750, MPS751


On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

NPN MPS650 MPS651 PNP MPS750 MPS751


1.0
0.9
0.8

TJ = 25C

0.7
0.6
0.5
0.4
0.3

IC = 10 mA IC = 100 mA IC = 500 mA

IC = 2.0 A

0.2
0.1
0
0.05 0.1 0.2

0.5 1.0 2.0 5.0 10 20


IB, BASE CURRENT (mA)

50 100 200 500

PNP
1.0
0.9
TJ = 25C

0.8
0.7
0.6
0.5
0.4
IC = 500 mA

0.3
0.2
0.1

IC = 10 mA

NPN

PNP
10

IC, COLLECTOR CURRENT

4.0

4.0

2.0

1.0 ms

1.0
0.5

0.05
0.02
0.01
1.0

50 100 200 500

Figure 6. MPS750, MPS751


Collector Saturation Region

10

0.1

IC = 100 mA

0
0.0 0.1 0.2 0.5 1.0 2.0 5.0 10 20
5
IB, BASE CURRENT (mA)

Figure 5. MPS650, MPS651


Collector Saturation Region

0.2

IC = 2.0 A

TA = 25C

100 s

1.0 ms

1.0

MPS65
0
MPS65
1
TC = 25C

0.5
0.2
0.1
0.05

WIRE LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
2.0
5.0
10
20
50
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

100 s

2.0

0.02
100

Figure 7. MPS650, MPS651 SOA,


Safe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.01
1.0

TA = 25C

MPS75
0
MPS75
1
TC = 25C

WIRE LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
2.0
5.0
10
20
50
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

100

Figure 8. MPS750, MPS751 SOA,


Safe Operating Area

2531

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

MPS918*
MPS3563

NPN Silicon

*Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

MPS918

MPS3563

Unit

Collector Emitter Voltage

VCEO

15

12

Vdc

Collector Base Voltage

VCBO

30

30

Vdc

Emitter Base Voltage

VEBO

3.0

2.0

CASE 2904, STYLE 1


TO92 (TO226AA)

Vdc

Collector Current Continuous

IC

50

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

0.85
6.8

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case

Symbol

Max

Unit

RqJA(1)

357

C/W

RqJC

147

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

15
12

30
30

3.0
2.0

10
50

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(2)
(IC = 3.0 mAdc, IB = 0)

V(BR)CEO
MPS918
MPS3563

Collector Base Breakdown Voltage


(IC = 1.0 mAdc, IE = 0)
(IC = 100 mAdc, IE = 0)

Vdc

V(BR)CBO
MPS918
MPS3563

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

Vdc

V(BR)EBO
MPS918
MPS3563

Collector Cutoff Current


(VCB = 15 Vdc, IE = 0)

Vdc

ICBO
MPS918
MPS3563

nAdc

1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
1.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

2532

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS918 MPS3563
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

20
20

200

VCE(sat)

0.4

Vdc

VBE(sat)

1.0

Vdc

600
600

1500

3.0
1.7
1.7

Cibo

2.0

pF

hfe

20

250

NF

6.0

dB

15
14

Pout

30

mW

25

ON CHARACTERISTICS
DC Current Gain(2)
(IC = 3.0 mAdc, VCE = 1.0 Vdc)
(IC = 8.0 mAdc, VCE = 10 Vdc)

MPS918
MPS3563

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

MPS918

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

MPS918

hFE

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(2)
(IC = 4.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
(IC = 8.0 mAdc, VCE = 10 Vdc, f = 100 MHz)

MPS918
MPS3563

Output Capacitance
(VCB = 0 Vdc, IE = 0, f = 1.0 MHz)
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

MPS918
MPS918
MPS3563

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

MPS918

SmallSignal Current Gain


(IC = 8.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

MPS3563

Noise Figure
(IC = 1.0 mAdc, VCE = 6.0 Vdc, RS = 400 k, f = 60 MHz)

MPS918

fT

MHz

Cobo

pF

FUNCTIONAL TEST
CommonEmitter Amplifier Power Gain
(IC = 6.0 mAdc, VCB = 12 Vdc, f = 200 MHz)
(IC = 8.0 mAdc, VCE = 10 Vdc, f = 200 MHz)
(Gfd + Gre
20 dB)

MPS918
MPS3563

Power Output
(IC = 8.0 mAdc, VCB = 15 Vdc, f = 500 MHz)

MPS918

Oscillator Collector Efficiency


(IC = 8.0 mAdc, VCB = 15 Vdc, Pout = 30 mW, f = 500 MHz)

MPS918

2. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 1.0%.

Gpe

Motorola SmallSignal Transistors, FETs and Diodes Device Data

dB

2533

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors

MPS2222
MPS2222A*

NPN Silicon

COLLECTOR
3

*Motorola Preferred Device

2
BASE
1
EMITTER

MAXIMUM RATINGS
Rating

Symbol

MPS2222

MPS2222A

Unit

Collector Emitter Voltage

VCEO

30

40

Vdc

Collector Base Voltage

VCBO

60

75

Vdc

Emitter Base Voltage

VEBO

5.0

6.0

Vdc

Collector Current Continuous

IC

600

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 10 mAdc, IB = 0)

MPS2222
MPS2222A

V(BR)CEO

30
40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

MPS2222
MPS2222A

V(BR)CBO

60
75

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

MPS2222
MPS2222A

V(BR)EBO

5.0
6.0

Vdc

Collector Cutoff Current


(VCE = 60 Vdc, VEB(off) = 3.0 Vdc)

ICEX

10

nAdc

MPS2222A

Collector Cutoff Current


(VCB = 50 Vdc, IE = 0)
(VCB = 60 Vdc, IE = 0)
(VCB = 50 Vdc, IE = 0, TA = 125C)
(VCB = 50 Vdc, IE = 0, TA = 125C)

MPS2222
MPS2222A
MPS2222
MPS2222A

0.01
0.01
10
10

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

100

nAdc

MPS2222A

Base Cutoff Current


(VCE = 60 Vdc, VEB(off) = 3.0 Vdc)

IBL

20

nAdc

MPS2222A

Adc

ICBO

Preferred devices are Motorola recommended choices for future use and best overall value.

2534

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS2222 MPS2222A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

35
50
75
35
100
50
30
40

300

MPS2222
MPS2222A

0.4
0.3

MPS2222
MPS2222A

1.6
1.0

MPS2222
MPS2222A

0.6

1.3
1.2

MPS2222
MPS2222A

2.6
2.0

250
300

8.0

30
25

2.0
0.25

8.0
1.25

8.0
4.0

50
75

300
375

5.0
25

35
200

rbCc

150

ps

NF

4.0

dB

( CC = 30 Vdc, VBE(off) = 0.5 Vdc,


(V
IC = 150 mAdc, IB1 = 15 mAdc) (Figure 1)

td

10

ns

tr

25

ns

( CC = 30 Vdc, IC = 150 mAdc,


(V
IB1 = IB2 = 15 mAdc) (Figure 2)

ts

225

ns

tf

60

ns

ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc, TA = 55C)
(IC = 150 mAdc, VCE = 10 Vdc)(1)
(IC = 150 mAdc, VCE = 1.0 Vdc)(1)
(IC = 500 mAdc, VCE = 10 Vdc)(1)

hFE

MPS2222A only

MPS2222
MPS2222A

Collector Emitter Saturation Voltage(1)


(IC = 150 mAdc, IB = 15 mAdc)

VCE(sat)

(IC = 500 mAdc, IB = 50 mAdc)


Base Emitter Saturation Voltage(1)
(IC = 150 mAdc, IB = 15 mAdc)

Vdc

VBE(sat)

(IC = 500 mAdc, IB = 50 mAdc)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(2)
(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT
MPS2222
MPS2222A

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo
MPS2222
MPS2222A

Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

MPS2222A
MPS2222A

Voltage Feedback Ratio


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

MPS2222A
MPS2222A

SmallSignal Current Gain


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

MPS2222A
MPS2222A

Output Admittance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

MPS2222A
MPS2222A

Collector Base Time Constant


(IE = 20 mAdc, VCB = 20 Vdc, f = 31.8 MHz)

MPS2222A

Noise Figure
(IC = 100 mAdc, VCE = 10 Vdc, RS = 1.0 k, f = 1.0 kHz)

MPS2222A

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time

MHz

pF
pF

hie

X 10 4

hre

hfe

mmhos

hoe

MPS2222A only

1. Pulse Test: Pulse Width


300 ms, Duty Cycle
2.0%.
2. fT is defined as the frequency at which |hfe| extrapolates to unity.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2535

MPS2222 MPS2222A
SWITCHING TIME EQUIVALENT TEST CIRCUITS
+ 30 V

+ 30 V
1.0 to 100 s,
DUTY CYCLE 2.0%

+16 V
0
2 V

200

1.0 to 100 s,
DUTY CYCLE 2.0%

+16 V

200

0
1 k
< 2 ns

1k

14 V

CS* < 10 pF

< 20 ns

CS* < 10 pF

1N914

4 V
Scope rise time < 4 ns
*Total shunt capacitance of test jig, connectors, and oscilloscope.

Figure 1. TurnOn Time

Figure 2. TurnOff Time

hFE , DC CURRENT GAIN

1000
700
500

TJ = 125C

300
200
25C
100
70
50

55C

30

VCE = 1.0 V
VCE = 10 V

20
10
0.1

0.2

0.3

0.5 0.7

1.0

2.0

3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70

100

200

300

500 700 1.0 k

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 3. DC Current Gain

1.0
TJ = 25C
0.8

0.6

IC = 1.0 mA

10 mA

150 mA

500 mA

0.4

0.2

0
0.005

0.01

0.02 0.03

0.05

0.1

0.2

0.3
0.5
1.0
IB, BASE CURRENT (mA)

2.0

3.0

5.0

10

20

30

50

Figure 4. Collector Saturation Region

2536

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS2222 MPS2222A
200

500
IC/IB = 10
TJ = 25C
tr @ VCC = 30 V
td @ VEB(off) = 2.0 V
td @ VEB(off) = 0

30
20
10
7.0
5.0

200

ts = ts 1/8 tf

100
70
50

tf

30
20
10
7.0
5.0

3.0
2.0
5.0 7.0

10

200 300
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

500

20 30
50 70 100
200
IC, COLLECTOR CURRENT (mA)

Figure 5. Turn On Time

RS = OPTIMUM
RS = SOURCE
RS = RESISTANCE

IC = 1.0 mA, RS = 150


500 A, RS = 200
100 A, RS = 2.0 k
50 A, RS = 4.0 k

6.0

f = 1.0 kHz
8.0
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

500

10

8.0

4.0

2.0

IC = 50 A
100 A
500 A
1.0 mA

6.0

4.0

2.0

0
0.01 0.02 0.05 0.1 0.2

0.5 1.0 2.0

5.0 10

20

100 200

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

RS, SOURCE RESISTANCE (OHMS)

Figure 7. Frequency Effects

Figure 8. Source Resistance Effects

Ceb
10
7.0
5.0
Ccb
3.0

0.5 0.7 1.0


2.0 3.0 5.0 7.0 10
REVERSE VOLTAGE (VOLTS)

20 30

50

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

f, FREQUENCY (kHz)

20

0.2 0.3

0
50

50 100

30

CAPACITANCE (pF)

300

Figure 6. Turn Off Time

10

2.0
0.1

VCC = 30 V
IC/IB = 10
IB1 = IB2
TJ = 25C

300

t, TIME (ns)

t, TIME (ns)

100
70
50

Figure 9. Capacitances

Motorola SmallSignal Transistors, FETs and Diodes Device Data

500
VCE = 20 V
TJ = 25C

300
200

100
70
50
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

Figure 10. CurrentGain Bandwidth Product

2537

MPS2222 MPS2222A
1.0

+0.5
TJ = 25C
0
COEFFICIENT (mV/ C)

V, VOLTAGE (VOLTS)

0.8
VBE(sat) @ IC/IB = 10
1.0 V

0.6
VBE(on) @ VCE = 10 V
0.4

0.2

RqVC for VCE(sat)

0.5
1.0
1.5
RqVB for VBE

2.0
VCE(sat) @ IC/IB = 10

2.5
0.1 0.2

50 100 200
0.5 1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

Figure 11. On Voltages

2538

500 1.0 k

0.1 0.2

0.5

1.0 2.0
5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mA)

500

Figure 12. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Transistors

MPS2369
MPS2369A*

NPN Silicon

COLLECTOR
3

*Motorola Preferred Device

2
BASE
1
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

15

Vdc

Collector Emitter Voltage

VCES

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

4.5

Vdc

Collector Current Continuous

IC

200

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

RqJA

200

C/W

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)CEO

15

Vdc

V(BR)CES

40

Vdc

V(BR)CBO

40

Vdc

V(BR)EBO

4.5

Vdc

0.4
30

0.4

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 10 mAdc, IB = 0)

MPS2369A

Collector Emitter Breakdown Voltage


(IC = 10 Adc, VBE = 0)

MPS2369,A

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

MPS2369,A

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

MPS2369,A

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)
(VCB = 20 Vdc, IE = 0, TA = 125C)

MPS2369,A

Collector Cutoff Current


(VCE = 20 Vdc, VBE = 0)

MPS2369,A

1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Adc

ICBO

ICES

Adc

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2539

MPS2369 MPS2369A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

20
40
40
20
30
20
20

120

120

0.25
0.20
0.30
0.25
0.50

0.7
0.5

0.85

1.02
1.15
1.60

Cobo

4.0

pF

hfe

5.0

ts

5.0

13

ns

ton

8.0

12

ns

toff

10

18

ns

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc, TA = 55C)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 0.35 Vdc)
(IC = 10 mAdc, VCE = 0.35 Vdc, TA = 55C)
(IC = 30 mAdc, VCE = 0.4 Vdc)
(IC = 100 mAdc, VCE = 2.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
Collector Emitter Saturation Voltage(1)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc, TA = +125C)
(IC = 30 mAdc, IB = 3.0 mAdc)
(IC = 100 mAdc, IB = 10 mAdc)
Base Emitter Saturation Voltage(1)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc, TA = +125C)
(IC = 10 mAdc, IB = 1.0 mAdc, TA = 55C)
(IC = 30 mAdc, IB = 3.0 mAdc)
(IC = 100 mAdc, IB = 10 mAdc)

hFE
MPS2369A
MPS2369
MPS2369
MPS2369A
MPS2369A
MPS2369A
MPS2369
MPS2369A

VCE(sat)
MPS2369
MPS2369A
MPS2369A
MPS2369A
MPS2369A

Vdc

VBE(sat)
MPS2369
MPS2369A
MPS2369A
MPS2369A
MPS2369A

Vdc

SMALL SIGNAL CHARACTERISTICS


Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

MPS2369,A

SmallSignal Current Gain


(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)

MPS2369,A

SWITCHING CHARACTERISTICS
Storage Time
(IB1 = IB2 = IC = 10 mAdc) (Figure 3)
TurnOn Time
(VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc)
(Figure 1)
TurnOff Time
(VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc,
IB2 = 1.5 mAdc) (Figure 2)
1. Pulse Test: Pulse Width

2540

v 300 ms, Duty Cycle v 2.0%.

MPS2369,A

MPS2369,A

MPS2369,A

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS2369 MPS2369A
3.0 V

t1

+10.6 V
0
1.5 V

270

3.3 k

< 1.0 ns

CS* < 4.0 pF

PULSE WIDTH (t1) = 300 ns


DUTY CYCLE = 2.0%

Figure 1. ton Circuit

+10.75 V

t1

3.0 V
270

0
4.15 V
< 1.0 ns

3.3 k

PULSE WIDTH (t1) = 300 ns


DUTY CYCLE = 2.0%

CS* < 4.0 pF

Figure 2. toff Circuit

+6.0 V

t1

10 V
980

0
4.0 V
< 1.0 ns
PULSE WIDTH (t1) = 300 ns
DUTY CYCLE = 2.0%

500

CS* < 3.0 pF

Figure 3. Storage Test Circuit

* Total shunt capacitance of test jig and connectors.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2541

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistors

MPS2907
MPS2907A*

PNP Silicon

COLLECTOR
3

*Motorola Preferred Device

2
BASE
1
EMITTER

MAXIMUM RATINGS

Rating

Symbol

MPS2907

MPS2907A

Unit

Collector Emitter Voltage

VCEO

40

60

Vdc

Collector Base Voltage

VCBO

Emitter Base Voltage

60

VEBO

5.0

Vdc

IC

600

mAdc

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD
625
5.0

mW
mW/C

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD
1.5
12

Watts
mW/C

500 to +150

TJ, Tstg

CASE 2904, STYLE 1


TO92 (TO226AA)

Vdc

Collector Current Continuous

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

V(BR)CEO

40
60

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

ICEX

50

nAdc

0.02
0.01
20
10

50

Characteristic

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 10 mAdc, IB = 0)

MPS2907
MPS2907A

Collector Cutoff Current


(VCE = 30 Vdc, VEB(off) = 0.5 Vdc)
Collector Cutoff Current
(VCB = 50 Vdc, IE = 0)
(VCB = 50 Vdc, IE = 0, TA = 150C)
Base Current
(VCE = 30 Vdc, VEB(off) = 0.5 Vdc)
1. Pulse Test: Pulse Width

Adc

ICBO
MPS2907
MPS2907A
MPS2907
MPS2907A
IB

nAdc

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

2542

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS2907 MPS2907A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

35
75
50
100
75
100
100
30
50

300

0.4
1.6

1.3
2.6

fT

200

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

8.0

pF

Input Capacitance
(VEB = 2.0 Vdc, IC = 0, f = 1.0 MHz)

Cibo

30

pF

ton

45

ns

td

10

ns

tr

40

ns

toff

100

ns

ts

80

ns

tf

30

ns

ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 10 Vdc)

hFE

MPS2907
MPS2907A
MPS2907
MPS2907A
MPS2907
MPS2907A
MPS2907, MPS2907A
MPS2907
MPS2907A

(IC = 1.0 mAdc, VCE = 10 Vdc)


(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 150 mAdc, VCE = 10 Vdc)(1)
(IC = 500 mAdc, VCE = 10 Vdc)(1)
Collector Emitter Saturation Voltage(1)
(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

Base Emitter Saturation Voltage(1)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(1), (2)
(IC = 50 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS
TurnOn Time
Delay Time

(VCC = 30 Vdc, IC = 150 mAdc,


IB1 = 15
15 mAdc)
Ad ) (Figures
(Fi
1 and
d 5)

Rise Time
TurnOff Time
Storage Time
Fall Time

(VCC = 6.0 Vdc, IC = 150 mAdc,


Ad ) (Fi
IB1 = IB2 = 15 mAdc)
(Figure 2)

1. Pulse Test: Pulse Width


300 ms, Duty Cycle
2.0%.
2. fT is defined as the frequency at which |hfe| extrapolates to unity.

INPUT
Zo = 50
PRF = 150 PPS
RISE TIME 2.0 ns
P.W. < 200 ns

30 V
200
1.0 k

TO OSCILLOSCOPE
RISE TIME 5.0 ns

50

16 V

INPUT
Zo = 50
PRF = 150 PPS
RISE TIME 2.0 ns
P.W. < 200 ns

200 ns

Figure 1. Delay and Rise Time Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

+15 V

6.0 V

1.0 k
1.0 k

0
30 V

50

37
TO OSCILLOSCOPE
RISE TIME 5.0 ns

1N916

200 ns

Figure 2. Storage and Fall Time Test Circuit

2543

MPS2907 MPS2907A
TYPICAL CHARACTERISTICS

hFE , NORMALIZED CURRENT GAIN

3.0
VCE = 1.0 V
VCE = 10 V

2.0

TJ = 125C
25C

1.0
55C

0.7
0.5
0.3
0.2
0.1

0.2 0.3

0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

50 70 100

200 300

500

IC, COLLECTOR CURRENT (mA)

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 3. DC Current Gain

1.0

0.8
IC = 1.0 mA

10 mA

100 mA

500 mA

0.6

0.4

0.2

0
0.005

0.01

0.02 0.03 0.05 0.07 0.1

0.2

0.3 0.5 0.7 1.0


IB, BASE CURRENT (mA)

3.0

2.0

5.0 7.0 10

20 30

50

Figure 4. Collector Saturation Region

500

tr

100
70
50
30
20

td @ VBE(off) = 0 V
7.0
5.0
3.0
5.0 7.0 10

2.0 V
20 30
50 70 100
IC, COLLECTOR CURRENT

Figure 5. TurnOn Time

VCC = 30 V
IC/IB = 10
IB1 = IB2
TJ = 25C

200
tf
100
70
50
30

ts = ts 1/8 tf

20

10

2544

300

VCC = 30 V
IC/IB = 10
TJ = 25C
t, TIME (ns)

t, TIME (ns)

300
200

200 300 500

10
7.0
5.0
5.0 7.0 10

20 30
50 70 100
200 300 500
IC, COLLECTOR CURRENT (mA)

Figure 6. TurnOff Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS2907 MPS2907A
TYPICAL SMALL SIGNAL CHARACTERISTICS
NOISE FIGURE
VCE = 10 Vdc, TA = 25C
10

10

8.0

8.0
NF, NOISE FIGURE (dB)

IC = 1.0 mA, Rs = 430


500 A, Rs = 560
50 A, Rs = 2.7 k
100 A, Rs = 1.6 k

6.0

4.0

Rs = OPTIMUM SOURCE RESISTANCE

2.0

0
0.01 0.02 0.05 0.1 0.2

0.5 1.0 2.0

5.0 10

20

50

C, CAPACITANCE (pF)

50

100

200

500 1.0 k 2.0 k

5.0 k 10 k

20 k

f, FREQUENCY (kHz)

Rs, SOURCE RESISTANCE (OHMS)

Figure 7. Frequency Effects

Figure 8. Source Resistance Effects

20

Ceb

10
7.0
5.0

Ccb

3.0

0.2 0.3 0.5

1.0

2.0 3.0 5.0

10

20 30

50 k

400
300
200

100
80

VCE = 20 V
TJ = 25C

60
40
30
20
1.0 2.0

5.0

10

20

50

100 200

500 1000

REVERSE VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 9. Capacitances

Figure 10. CurrentGain Bandwidth Product

+0.5

1.0
TJ = 25C

0.6

VBE(sat) @ IC/IB = 10
COEFFICIENT (mV/ C)

0.8
V, VOLTAGE (VOLTS)

IC = 50 A
100 A
500 A
1.0 mA

4.0

100

30

2.0
0.1

6.0

2.0

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

NF, NOISE FIGURE (dB)

f = 1.0 kHz

VBE(on) @ VCE = 10 V

0.4

0.2

RqVC for VCE(sat)


0.5
1.0
1.5
RqVB for VBE

2.0
VCE(sat) @ IC/IB = 10

0
0.1 0.2

0.5 1.0 2.0 5.0 10 20

50 100 200

500

2.5
0.1 0.2 0.5 1.0 2.0

5.0 10 20

50 100 200 500

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 11. On Voltage

Figure 12. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2545

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Transistor
PNP Silicon

MPS3638A

COLLECTOR
3
2
BASE
1
EMITTER

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

25

Vdc

Collector Emitter Voltage

VCES

25

Vdc

Collector Base Voltage

VCBO

25

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case

Symbol

Max

Unit

RqJA(1)

200

C/W

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 100 mAdc, VBE = 0)

V(BR)CES

25

Vdc

Collector Emitter Sustaining Voltage(2)


(IC = 10 mAdc, IB = 0)

VCEO(sus)

25

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

25

Vdc

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

4.0

Vdc

0.035
2.0

OFF CHARACTERISTICS

mAdc

Collector Cutoff Current


(VCE = 15 Vdc, VBE = 0)
(VCE = 15 Vdc, VBE = 0, TA = 65C)

ICES

Emitter Cutoff Current


(VEB = 3.0 V, IC = 0)

IEBO

35

nA

IB

0.035

mAdc

Base Current
(VCE = 15 Vdc, VBE = 0)
1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

(Replaces MPS3638/D)

2546

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS3638A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

80
100
100
20

0.25
1.0

0.80

1.1
2.0

150

10

25

2000

15

100

1.2

td

20

ns

tr

70

ns

ts

140

ns

Fall Time

( CC = 10 Vdc, IC = 300 mAdc,


(V
IB1 = 30 mAdc, IB2 = 30 mAdc)

tf

70

ns

TurnOn Time

(IC = 300 mAdc, IB1 = 30 mAdc)

ton

75

ns

TurnOff Time

(IC = 300 mAdc, IB1 = 30 mAdc, IB2 = 30 mAdc)

toff

170

ns

ON CHARACTERISTICS(2)
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 300 mAdc, VCE = 2.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 50 mAdc, IB = 2.5 mAdc)
(IC = 300 mAdc, IB = 30 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 50 mAdc, IB = 2.5 mAdc)
(IC = 300 mAdc, IB = 30 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(VCE = 3.0 Vdc, IC = 50 mAdc, f = 100 MHz)

fT

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

Input Impedance
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hie

Voltage Feedback Ratio


(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hre

SmallSignal Current Gain


(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hfe

Output Admittance
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hoe

MHz
pF
pF
k
X 10 4

mmhos

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time

(VCC = 10 Vdc
Vdc, IC = 300 mAdc
mAdc, IB1 = 30 mAdc)

2. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2547

MPS3638A
SWITCHING TIME EQUIVALENT TEST CIRCUIT
30 V

30 V
200

< 2 ns

200

< 20 ns

+2 V

+14 V
0

0
1.0 k
16 V

1.0 k

CS* < 10 pF

10 to 100 s,
DUTY CYCLE = 2%

16 V

CS* < 10 pF

1.0 to 100 s,
DUTY CYCLE = 2%

+ 4.0 V
Scope rise time < 4.0 ns
*Total shunt capacitance of test jig connectors, and oscilloscope

Figure 1. TurnOn Time

Figure 2. TurnOff Time

TRANSIENT CHARACTERISTICS
25C

100C

30

10
7.0
5.0

VCC = 30 V
IC/IB = 10

Ceb
3.0
Q, CHARGE (nC)

CAPACITANCE (pF)

20

10
7.0
Ccb

5.0

2.0
1.0
0.7
0.5

QT

0.3

QA

0.2
2.0
0.1

0.2 0.3

2.0 3.0 5.0 7.0 10


0.5 0.7 1.0
REVERSE VOLTAGE (VOLTS)

Figure 3. Capacitances

2548

20

30

0.1
10

20

200
30
50 70 100
IC, COLLECTOR CURRENT (mA)

300

500

Figure 4. Charge Data

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS3638A
TRANSIENT CHARACTERISTICS (Continued)
100C

25C

100

100
IC/IB = 10

70

70

50
tr @ VCC = 30 V
tr @ VCC = 10 V
td @ VBE(off) = 2 V
td @ VBE(off) = 0

30
20

t r , RISE TIME (ns)

t, TIME (ns)

VCC = 30 V
IC/IB = 10

50
30
20

10

10

7.0

7.0
5.0

5.0
10

20

30

50

70

200

100

300

500

10

20

30

50

70

100

200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 5. TurnOn Time

Figure 6. Rise Time

300

500

200

t s, STORAGE TIME (ns)

IC/IB = 10
100
IC/IB = 20

70
50
IB1 = IB2
ts = ts 1/8 tf
30
20

10

20

30

50

70

100

200

300

500

IC, COLLECTOR CURRENT (mA)

Figure 7. Storage Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2549

MPS3638A
SMALLSIGNAL CHARACTERISTICS
NOISE FIGURE
VCE = 10 Vdc, TA = 25C
Bandwidth = 1.0 Hz
10

10

f = 1 kHz
8
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

8
IC = 1.0 mA, RS = 430
IC = 500 A, RS = 560
IC = 50 A, RS = 2.7 k
IC = 100 A, RS = 1.6 k

RS = OPTIMUM SOURCE RESISTANCE

0
0.01 0.02 0.05 0.1 0.2

IC = 50 A
100 A
500 A
1.0 mA

0
0.5 1.0 2.0 5.0

10

20

50

100

50

100

200

500

1k

2k

5k

10 k 20 k

f, FREQUENCY (kHz)

RS, SOURCE RESISTANCE (OHMS)

Figure 8. Frequency Effects

Figure 9. Source Resistance Effects

50 k

h PARAMETERS
VCE = 10 Vdc, f = 1.0 kHz, TA = 25C
selected from the 2N4402 line, and the same units were
This group of graphs illustrates the relationship between
used to develop the correspondinglynumbered curves on
hfe and other h parameters for this series of transistors. To
each graph.
obtain these curves, a highgain and a lowgain unit were
100 k

700

50 k

hfe , CURRENT GAIN

500
300
200

100

2N4402 UNIT 1
2N4402 UNIT 2

70
50

hie , INPUT IMPEDANCE (OHMS)

1000

2N4402 UNIT 1
2N4402 UNIT 2

20 k
10 k
5k
2k
1k
500
200

30
0.1

0.2

0.3

0.5 0.7 1.0

2.0

3.0

100

5.0 7.0 10

0.5 0.7 1.0

2.0

3.0

Figure 11. Input Impedance

5.0 7.0

10

500
hoe, OUTPUT ADMITTANCE (m mhos)

h re , VOLTAGE FEEDBACK RATIO (X 10 4 )

0.3

Figure 10. Current Gain

10
5.0

2N4402 UNIT 1
2N4402 UNIT 2

2.0
1.0
0.5
0.2

2550

0.2

IC, COLLECTOR CURRENT (mAdc)

20

0.1
0.1

0.1

IC, COLLECTOR CURRENT (mAdc)

0.2

0.3

0.5 0.7 1.0

2.0

3.0

5.0 7.0 10

100
50
20
10
5.0
2N4402 UNIT 1
2N4402 UNIT 2

2.0
1.0
0.1

0.2

0.3

0.5 0.7 1.0

2.0

3.0

IC, COLLECTOR CURRENT (mAdc)

IC, COLLECTOR CURRENT (mAdc)

Figure 12. Voltage Feedback Ratio

Figure 13. Output Admittance

5.0 7.0 10

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS3638A
STATIC CHARACTERISTICS

h FE, NORMALIZED CURRENT GAIN

3.0
VCE = 1.0 V
VCE = 10 V

2.0

TJ = 125C
25C

1.0
55C

0.7
0.5
0.3
0.2
0.1

0.2

0.3

0.5

0.7

1.0

2.0

3.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mA)

30

70

50

100

200

300

500

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 14. DC Current Gain

1.0
0.8

0.6
IC = 1.0 mA

10 mA

100 mA

500 mA

0.4

0.2

0
0.005

0.01

0.02

0.03

0.05 0.07 0.1

0.2

0.3
0.5 0.7 1.0
IB, BASE CURRENT (mA)

2.0

3.0

5.0

7.0

10

20

30

50

Figure 15. Collector Saturation Region

0.5

TJ = 25C

0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(sat) @ VCE = 10 V

COEFFICIENT (mV/ C)

VOLTAGE (VOLTS)

1.0

0.4

0.2

qVC for VCE(sat)

0.5
1.0
1.5

qVS for VBE

2.0
VCE(sat) @ IC/IB = 10

0
0.1 0.2

0.5

50 100 200
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

500

Figure 16. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2.5
0.1 0.2

0.5

50 100 200
1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

500

Figure 17. Temperature Coefficients

2551

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Transistor

MPS3640

PNP Silicon

COLLECTOR
3
2
BASE
1
EMITTER

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

12

Vdc

Collector Base Voltage

VCBO

12

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

Collector Current Continuous

IC

80

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)CES

12

Vdc

VCEO(sus)

12

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

12

Vdc

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

4.0

Vdc

0.01
1.0

10

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 100 Adc, VBE = 0)
Collector Emitter Sustaining Voltage(1)
(IC = 10 mAdc, IB = 0)

Collector Cutoff Current


(VCE = 6.0 Vdc, VBE = 0)
(VCE = 6.0 Vdc, VBE = 0, TA = 65C)
Base Current
(VCE = 6.0 Vdc, VEB = 0)
1. Pulse Test: Pulse Width

2552

Adc

ICES

IB

nAdc

v 300 ms, Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS3640
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

30
20

120

0.2
0.6
0.25

0.75
0.75

0.95
1.0
1.5

fT

500

MHz

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

3.5

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

3.5

pF

td

10

ns

Rise Time

(VCC = 6.0 Vdc, IC = 50 mAdc, VBE(off) = 1.9 Vdc,


IB1 = 5.0
5 0 mAdc)
Ad )

tr

30

ns

Storage Time

(VCC = 6.0 Vdc, IC = 50 mAdc, IB1 = IB2 = 5.0 mAdc)

ts

20

ns

tf

12

ns

25
60

35
75

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 10 mAdc, VCE = 0.3 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc, TA = 65C)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS
Delay Time

Fall Time
TurnOn Time
(VCC = 6.0 Vdc, IC = 50 mAdc, IB1 = 5.0 mAdc)
(VCC = 1.5 Vdc, IC = 10 mAdc, IB1 = 0.5 mAdc)

ton

TurnOff Time
(VCC = 6.0 Vdc, IC = 50 mAdc, IB1 = IB2 = 5.0 mAdc)
(VCC = 1.5 Vdc, IC = 10 mAdc, IB1 = IB2 = 0.5 mAdc)

toff

1. Pulse Test: Pulse Width

ns

v 300 ms, Duty Cycle v 2.0%.

VBB = +1.9 V VCC = 6.0 V


1.0 k
0

ns

0.1 F

680

VBB = 6.0 V

110

VCC = 1.5 V

5.0 k
Vout

5.0 V

0.1 F

5.0 k

130
Vout

Vin
6.8 V
TO SAMPLING SCOPE
PULSE SOURCE
51
INPUT Z 100 k
RISE TIME 1.0 ns
RISE TIME 1.0 ns
PULSE WIDTH 100 ns
Zin = 50 OHMS
NOTES: Collector Current = 50 mA,
FALL TIME 1.0 ns
NOTES: TurnOn and TurnOff Time
NOTES: Base Currents = 5.0 mA.

Vin
0
TO SAMPLING SCOPE
PULSE SOURCE
51
INPUT Z 100 k
RISE TIME 1.0 ns
RISE TIME 1.0 ns
PULSE WIDTH 200 ns
Zin = 50 OHMS
NOTES: Collector Current = 10 mA,
FALL TIME 1.0 ns
NOTES: TurnOn and TurnOff Time
NOTES: Base Currents = 0.5 mA.

Figure 1.

Figure 2.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2553

MPS3640
200

1.4
1.2

TJ = 125C

100

25C

70
50

V, VOLTAGE (VOLTS)

hFE, DC CURRENT GAIN

VCE = 1.0 V

55C

30

TJ = 25C
VBE(sat) @ IC/IB = 10

1.0
0.8

VBE(on) @ VCE = 1.0 V


0.6
0.4

20
VCE(sat) @ IC/IB = 10

0.2
10
0.1 0.2

5.0 10 20
0.5 1.0 2.0
IC, COLLECTOR CURRENT (mA)

50

0
0.1 0.2

100

+0.5

1.0
TJ = 25C
0.8
IC = 1.0 mA

5.0 mA

20 mA

80 mA

0.6

0.4

0.2

0
0.01 0.02

0.05 0.1 0.2


0.5 1.0
IB, BASE CURRENT (mA)

2.0

5.0

*APPLIES FOR IC/IB hFE/4

100

55C to 25C
0.5

1.0
25C to 125C

1.5

55C to 25C

RVB for VBE


2.0
0.1 0.2

10

25C to 125C

RVC for VCE(sat)

Figure 5. Collector Saturation Region

0.5 1.0 2.0


5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 6. Temperature Coefficients

5.0

2000
TJ = 25C
f = 100 MHz

TJ = 25C

VCE = 10 V

3.0
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

50

Figure 4. On Voltages

V, TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 3. DC Current Gain

0.5 1.0 2.0 5.0 10 20


IC, COLLECTOR CURRENT (mA)

1000
1.0 V

800
600
400

2.0
Cobo
Cibo
1.0
0.7

200
1.0

2554

2.0 3.0

5.0 7.0 10

20 30

50 70 100

0.5
0.2 0.3

0.5 0.7 1.0

2.0 3.0

5.0 7.0 10

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 7. CurrentGain Bandwidth Product

Figure 8. Capacitance

20

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Transistor

MPS3646

NPN Silicon

Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

15

Vdc

Collector Emitter Voltage

VCES

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous


10 ms Pulse

IC

300
500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 100 mAdc, VBE = 0)

V(BR)CES

40

Vdc

Collector Emitter Sustaining Voltage(1)


(IC = 10 mAdc, IB = 0)

VCEO(sus)

15

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

0.5
3.0

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current


(VCE = 20 Vdc, VBE = 0)
(VCE = 20 Vdc, VBE = 0, TA = 65C)
1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

mAdc

ICES

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2555

MPS3646
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

hFE

30
25
15

120

ON CHARACTERISTICS(1)
DC Current Gain

(IC = 30 mAdc, VCE = 0.4 Vdc)


(IC = 100 mAdc, VCE = 0.5 Vdc)
(IC = 300 mA, VCE = 1.0 Vdc)

Collector Emitter Saturation Voltage

(IC = 30 mAdc, IB = 3.0 mAdc)


(IC = 100 mAdc, IB = 10 mAdc)
(IC = 300 mAdc, IB = 30 mAdc)
(IC = 30 mA, IB = 3.0 mA, TA = 65C)

VCE(sat)

0.2
0.28
0.5
0.3

Vdc

Base Emitter Saturation Voltage

(IC = 30 mAdc, IB = 3.0 mAdc)


(IC = 100 mAdc, IB = 10 mAdc)
(IC = 300 mAdc, IB = 30 mA)

VBE(sat)

0.73

0.95
1.2
1.7

Vdc

fT

350

MHz

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

5.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

9.0

pF

ton

18

ns

td

10

ns

tr

15

ns

toff

28

ns

tf

15

ns

ts

18

ns

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 30 mAdc, VCE = 10 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS
TurnOn Time
(VCC = 10 Vdc,
Vd IC = 300 mAdc,
Ad IB1 = 30 mAdc)
Ad )
(Figure 1)

Delay Time
Rise Time
TurnOff Time

((VCC = 10 Vdc, IC = 300 mAdc, IB1 = IB2 = 30 mAdc))


(Figure 1)

Fall Time

Storage Time
(VCC = 10 Vdc, IC = 10 mAdc, IB1 = IB2 = 10 mAdc) (Figure 2)
1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Figure 1. Switching Time Equivalent Test Circuit


Test
Condition IC

VCC

RS

mA

10

10

100

2556

RC CS(max) VBE(off)

pF

1.5

10

330 270
0 960
560

10

560

12

2.0

96

V1

V2

V3

10.55 4.15 10.70

4.65 6.55

6.35 4.65 6.55

V1

ton
t1

V3
0
V2

0
VEB(off)
< 2 ns

toff
t1

VCC
RC
RB
CS
< 2 ns

PULSE WIDTH (t1) = 300 ns DUTY CYCLE = 2%

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS3646
CURRENT GAIN CHARACTERISTICS
100
MPS3646
VCE = 1 V

h FE, DC CURRENT GAIN

70
TJ = 125C

50

25C
15C

30

55C
20

10
1.0

2.0

3.0

5.0

7.0

10
20
IC, COLLECTOR CURRENT (mA)

30

50

70

100

200

200
MPS3646
VCE = 1 V

h FE, DC CURRENT GAIN

TJ = 125C
25C

100

15C

70

55C

50

30
20
1.0

2.0

3.0

5.0

7.0

10
20
IC, COLLECTOR CURRENT (mA)

30

50

70

100

200

Figure 2. Minimum Current Gain

270
t1

3V
8 pF

+10 V
V
0

C < COPT
CS < 4 pF

<1 ns 9.2 k
PULSE WIDTH (t1) = 5 s

DUTY CYCLE = 2%

C=0

COPT
TIME

Figure 3. QT Test Circuit

Figure 4. TurnOff Waveform


NOTE 1

When a transistor is held in a conductive state by a base current, IB,


a charge, QS, is developed or stored in the transistor. QS may be
written: QS = Q1 + QV + QX.
Q1 is the charge required to develop the required collector current.
This charge is primarily a function of alpha cutoff frequency. QV is the
charge required to charge the collectorbase feedback capacity. QX is
excess charge resulting from overdrive, i.e., operation in saturation.
The charge required to turn a transistor on to the edge of saturation
is the sum of Q1 and QV which is defined as the active region charge,
QA. QA = IB1tr when the transistor is driven by a constant current step
IC
.
(IB1) and IB1 < <
hFE

If IB were suddenly removed, the transistor would continue to


conduct until QS is removed from the active regions through an
external path or through internal recombination. Since the internal
recombination time is long compared to the ultimate capability of a
transistor, a charge, QT, of opposite polarity, equal in magnitude, can
be stored on an external capacitor, C, to neutralize the internal charge
and considerably reduce the turnoff time of the transistor. Figure 3
shows the test circuit and Figure 4 the turnoff waveform. Given QT
from Figure 13, the external C for worstcase turnoff in any circuit is:
C = QT/V, where V is defined in Figure 3.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2557

MPS3646
ON CONDITION CHARACTERISTICS

VCE, MAXIMUM COLLECTOREMITTER


VOLTAGE (VOLTS)

1.0
MPS3646
TJ = 25C

0.8
IC = 10 mA

50 mA

200 mA

100 mA

0.6

0.4

0.2

0.1

0.2

0.3

0.5

0.7

1.0

2.0
3.0
IB, BASE CURRENT (mA)

5.0

7.0

10

20

30

50

VCE, MAXIMUM COLLECTOREMITTER


VOLTAGE (VOLTS)

1.0
MPS3646
TJ = 25C

0.8
50 mA

IC = 10 mA

100 mA

200 mA

0.6

0.4

0.2

0.1

0.2

0.3

0.5

0.7

1.0

2.0
3.0
IB, BASE CURRENT (mA)

5.0

7.0

10

20

30

50

Figure 5. Collector Saturation Region

IC/IB = 10
TJ = 25C

1.0

V, TEMPERATURE COEFFICIENTS (mV/C)

Vsat , SATURATION VOLTAGE (VOLTS)

1.2
MAX VBE(sat)
MIN VBE(sat)

0.8
0.6

MAX VCE(sat)

0.4
0.2
0
1.0

2.0 3.0

50 70 100
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

Figure 6. Saturation Voltage Limits

2558

200

1.0
0.5

qVC for VCE(sat)

(25C to 125C)
( 55C to 25C)

0
0.5

(25C to 125C)
1.0

qVB for VBE

( 55C to 25C)

1.5
2.0

40

80
120
160
IC, COLLECTOR CURRENT (mA)

200

Figure 7. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS3646
DYNAMIC CHARACTERISTICS
200

200
VCC = 10 V
TJ = 25C

100
70

70
t r , RISE TIME (ns)

t d, DELAY TIME (ns)

100

IC/IB = 10
TJ = 25C
TJ = 125C

td @ VEB(off) = 3 V

50
30

2V

20
0V

10

VCC = 10 V

50
30
20

VCC = 3 V

10
7.0

7.0

5.0

5.0
1.0

2.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

100

200

1.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

2.0

Figure 8. Delay Time

200

IC/IB = 20

30

TJ = 25C
TJ = 125C
IC/IB = 10

20

10
ts

7.0

VCC = 10 V
TJ = 25C
TJ = 125C

100
t f , FALL TIME (ns)

t s , STORAGE TIME (ns)

200

Figure 9. Rise Time

50

^ ts 1/8 tf

70
50
30

IC/IB = 20

20
IC/IB = 10

10

IB1 = IB2

7.0

5.0

5.0
1.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

2.0

100

200

1.0

50
5.0
10
20
IC, COLLECTOR CURRENT (mA)

2.0

Figure 10. Storage Time

100

200

5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)

200

Figure 11. Fall Time

10

1000
MAX
TYP

7.0

IC/IB = 10
TJ = 25C
TJ = 125C

700
500

Cibo
Q, CHARGE (pC)

CAPACITANCE (pF)

100

5.0

Cobo

3.0

300
200
QT
100

VCC = 3 V

70
50

VCC = 10 V

30
2.0
0.1

0.2

0.5
1.0
2.0
REVERSE BIAS (Vdc)

5.0

10

Figure 12. Junction Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

20

QA

VCC = 3 V
1.0

2.0 3.0

Figure 13. Maximum Charge Data

2559

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistor

MPS3904

NPN Silicon

COLLECTOR
3
2
BASE
1
EMITTER

MAXIMUM RATINGS

1
2

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Power Dissipation @ TA = 60C

PD

450

mW

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 Adc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

6.0

Vdc

Collector Cutoff Current


(VCE = 30 Vdc, VEB(off) = 3.0 Vdc)

ICEX

50

nAdc

Base Cutoff Current


(VCE = 30 Vdc, VEB(off) = 3.0 Vdc)

IBL

50

nAdc

Characteristic

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

REV 1

2560

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS3904
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

40
70
100
60
30

300

0.2
0.3

0.65

0.85
1.1

fT

300

MHz

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

4.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

8.0

pF

Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hie

1.0

10

Voltage Feedback Ratio


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hre

0.5

8.0

X 104

SmallSignal Current Gain


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hfe

100

400

Output Admittance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hoe

1.0

40

mhos

Noise Figure
(IC = 100 Adc, VCE = 5.0 Vdc, RS = 1.0 k, f = 1.0 kHz)

NF

5.0

dB

( CC = 3.0 Vdc, VBE(off) = 0.5 Vdc,


(V
IC = 10 mAdc, IB1 = 1.0 mAdc)

td

35

ns

tr

50

ns

( CC = 3.0 Vdc, IC = 10 mAdc,


(V
IB1 = IB2 = 1.0 mAdc)

ts

900

ns

tf

90

ns

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time

1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

EQUIVALENT SWITCHING TIME TEST CIRCUITS


+ 3.0 V
300 ns
DUTY CYCLE = 2%

275

+10.9 V

+ 3.0 V

10 < t1 < 500 s


DUTY CYCLE = 2%

t1

+10.9 V

10 k

0.5 V
<1.0 ns

275
10 k

0
CS < 4.0 pF*

9.1 V

< 1.0 ns

1N916

CS < 4.0 pF*

*Total shunt capacitance of test jig and connectors

Figure 1. TurnOn Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 2. TurnOff Time

2561

MPS3904
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
20

100
BANDWIDTH = 1.0 Hz
RS = 0

50

300 A

10

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

IC = 1.0 mA

100 A

7.0
5.0
10 A
3.0

20

300 A
100 A

10
5.0
2.0
1.0
30 A

0.5

30 A

BANDWIDTH = 1.0 Hz
RS

IC = 1.0 mA

10 A

0.2
2.0

0.1
10

20

50

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

10

20

50

Figure 3. Noise Voltage

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

Figure 4. Noise Current

NOISE FIGURE CONTOURS


(VCE = 5.0 Vdc, TA = 25C)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k

RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

500 k

20 k
10 k
5k

2.0 dB

2k
1k
500

3.0 dB 4.0 dB
6.0 dB

10 dB

200
100
50

1M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

1.0 dB

5k

2.0 dB

2k
1k
500

5.0 dB

200
100
10

20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

8.0 dB
10

20

Figure 5. Narrow Band, 100 Hz

500 k
RS , SOURCE RESISTANCE (OHMS)

3.0 dB

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

Figure 6. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is defined as:

20 k
10 k
5k

NF

2.0 dB
3.0 dB
5.0 dB

200
100
50

8.0 dB
10

20

30

50 70 100

200 300

500 700

en2

) 4KTRS ) In 2RS2 12

4KTRS
en = Noise Voltage of the Transistor referred to the input. (Figure 3)
In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

1.0 dB

2k
1k
500

+ 20 log10

1k

IC, COLLECTOR CURRENT (A)

Figure 7. Wideband
2562

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS3904
TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C

25C

200

55C
100
80
MPS3904
VCE = 1.0 V
VCE = 10 V

60
40
0.004 0.006 0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3
0.5 0.7 1.0
2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0 10

20

30

50

70 100

100

1.0
MPS3904
TJ = 25C

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 8. DC Current Gain

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%

300 A
200 A
40
100 A
20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
VBE(sat) @ IC/IB = 10

0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.2

0.5 1.0
2.0
5.0
10
20
IC, COLLECTOR CURRENT (mA)

40

Figure 10. Collector Characteristics

1.4

0.1

400 A

60

Figure 9. Collector Saturation Region

0.8

IB = 500 A

50

100

Figure 11. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6

*APPLIES for IC/IB hFE/2

0.8
25C to 125C
0

*qVC for VCE(sat)


55C to 25C

0.8
25C to 125C
1.6

qVB for VBE


2.4
0.1

0.2

55C to 25C

0.5
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 12. Temperature Coefficients

2563

MPS3904
TYPICAL DYNAMIC CHARACTERISTICS
1000
VCC = 3.0 V
IC/IB = 10
TJ = 25C

100
70
50

700
500

ts

300
200
t, TIME (ns)

t, TIME (ns)

300
200

tr

30
20
td @ VBE(off) = 0.5 Vdc

10
7.0
5.0

100
70
50

tf

30

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

20

3.0
1.0

2.0

50 70

20 30
5.0 7.0 10
3.0
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0

3.0

500

70 100

10
TJ = 25C
f = 100 MHz

TJ = 25C
f = 1.0 MHz

7.0

300
VCE = 20 V
200

5.0 V

100

Cib

5.0

Cob
3.0
2.0

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.2

0.5

1.0

2.0

5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 15. CurrentGain Bandwidth Product

Figure 16. Capacitance

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

3.0
2.0
1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

MPS3904
hfe 200 @ IC = 1.0 mA

7.0
5.0

0.2
0.1

10

20

50

200

10

100
70
50

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C
MPS3904
hfe 200 @ IC = 1.0 mA

30
20
10
7.0
5.0
3.0

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

Figure 17. Input Impedance

2564

0.1

IC, COLLECTOR CURRENT (mA)

20
hie , INPUT IMPEDANCE (k )

50

Figure 14. TurnOff Time

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 13. TurnOn Time

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

50

100

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 18. Output Admittance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

MPS3904
1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19A

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

t2

1.0

2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 19. Thermal Response

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 Vdc

A train of periodical power pulses can be represented by the model


as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 19 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 19 by the
steady state value RJA.

103
102

ICEO

101

Example:
The MPS3904 is dissipating 2.0 watts peak under the following
conditions:
t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.

ICBO
AND
ICEX @ VBE(off) = 3.0 Vdc

100
101
102
40 20

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

The peak rise in junction temperature is therefore


T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.
For more information, see AN569.

Figure 19A.

IC, COLLECTOR CURRENT (mA)

400
1.0 ms

200
100
60
40

TC = 25C

dc
dc
TJ = 150C

10

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

6.0
2.0

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 20 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.

10 s
1.0 s

TA = 25C

20

4.0

100 s

4.0
6.0 8.0 10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

40

Figure 20.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2565

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

General Purpose Transistor

MPS3906

PNP Silicon

COLLECTOR
3
2
BASE
1
EMITTER

1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

200

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCE = 30 Vdc, VEB(off) = 3.0 Vdc)

ICEX

50

nAdc

Base Cutoff Current


(VCE = 30 Vdc, VEB(off) = 3.0 Vdc)

IBL

50

nAdc

Characteristic

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width = 300 ms; Duty Cycle = 2.0%.

REV 1

2566

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS3906
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

60
80
100
60
30

300

0.25
0.4

0.65

0.85
0.95

fT

250

MHz

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

4.5

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

10

pF

Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hie

2.0

12

Voltage Feedback Ratio


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hre

1.0

10

X 10 4

SmallSignal Current Gain


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hfe

100

400

Output Admittance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hoe

3.0

60

mmhos

Noise Figure
(IC = 100 mAdc, VCE = 5.0 Vdc, RS = 1.0 k , f = 1.0 kHz)

NF

4.0

dB

((VCC = 3.0 Vdc, VBE(off) = + 0.5 Vdc,


IC = 10 mAdc, IB1 = 1.0 mAdc)

td

35

ns

tr

50

ns

(VCC = 3.0 Vdc, IC = 10 mAdc,


IB1 = IB2 = 1.0
1 0 mAdc)
Ad )

ts

600

ns

tf

90

ns

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 V, f = 100 MHz)

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time

1. Pulse Test: Pulse Width = 300 ms; Duty Cycle = 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2567

MPS3906
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
10
7.0
IC = 10 A

5.0

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

1.0
7.0
5.0

BANDWIDTH = 1.0 Hz
RS 0

30 A
3.0

100 A
300 A

1.0 mA

2.0

BANDWIDTH = 1.0 Hz
RS
IC = 1.0 mA

3.0
2.0

300 A

1.0
0.7
0.5

100 A
30 A

0.3
0.2

1.0

10 A

0.1
10

20

50

100 200
500 1.0 k
f, FREQUENCY (Hz)

2.0 k

5.0 k

10

10 k

20

50

Figure 1. Noise Voltage

100 200
500 1.0 k 2.0 k
f, FREQUENCY (Hz)

5.0 k

10 k

Figure 2. Noise Current

NOISE FIGURE CONTOURS

1.0 M
500 k

BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

(VCE = 5.0 Vdc, TA = 25C)

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100
20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100

5.0 dB
10

1.0 M
500 k

500 700 1.0 k

5.0 dB
10

20

RS , SOURCE RESISTANCE (OHMS)

Figure 3. Narrow Band, 100 Hz

1.0 M
500 k

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700 1.0 k

Figure 4. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is Defined as:

20 k
10 k

NF
0.5 dB
1.0 dB
2.0 dB
3.0 dB
5.0 dB

200
100
10

20

30

50 70 100

200 300

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

5.0 k
2.0 k
1.0 k
500

+ 20 log10

500 700 1.0 k

IC, COLLECTOR CURRENT (A)

Figure 5. Wideband
2568

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS3906
TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C
25C

200

55C
100
80
60

VCE = 1.0 V
VCE = 10 V

40
0.003 0.005

0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3 0.5 0.7 1.0


2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0

10

20

30

50 70 100

100

1.0
TA = 25C
IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. DC Current Gain

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%
300 A

200 A
150 A

40

100 A
50 A

20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
0.8
VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.5 1.0
2.0
5.0
10
20
IC, COLLECTOR CURRENT (mA)

40

Figure 8. Collector Characteristics

1.4

0.2

250 A

60

Figure 7. Collector Saturation Region

0.1

IB = 400 A
350 A

50

100

Figure 9. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6
*APPLIES for IC/IB hFE/2
0.8
*qVC for VCE(sat)

25C to 125C

0
55C to 25C
0.8
25C to 125C
1.6

2.4
0.1

qVB for VBE


0.2

55C to 25C

0.5
1.0 2.0
5.0
10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 10. Temperature Coefficients

2569

MPS3906
TYPICAL DYNAMIC CHARACTERISTICS
500
300
200

200

100
70
50
30
tr

20
10
7.0
5.0
1.0

100
70
50

tf

30

td @ VBE(off) = 0.5 V

20

2.0

3.0

50 70

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 12. TurnOff Time

500

10
TJ = 25C

TJ = 25C

7.0
VCE = 20 V

300

Cib
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 11. TurnOn Time

5.0 V
200

100

5.0

3.0
2.0

Cob

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.2

0.5

1.0

2.0

5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 13. CurrentGain Bandwidth Product

Figure 14. Capacitance

3.0

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

2.0
1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

MPS3906
hfe 200
@ IC = 1.0 mA

7.0
5.0

0.2
0.1

10

20

50

200

10

100
70
50
30
20

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C
MPS3906
hfe 200
@ IC = 1.0 mA

10
7.0
5.0
3.0

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

Figure 15. Input Impedance

2570

0.1

IC, COLLECTOR CURRENT (mA)

20
hie , INPUT IMPEDANCE (k )

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

ts

300
t, TIME (ns)

t, TIME (ns)

1000
700
500

VCC = 3.0 V
IC/IB = 10
TJ = 25C

50

100

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 16. Output Admittance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

MPS3906
1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

1.0

t2
2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 17. Thermal Response

IC, COLLECTOR CURRENT (mA)

400
200

100 s

100

TC = 25C
dc

60

1.0 s

TA = 25C

40

dc

20

TJ = 150C

10

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

6.0
4.0

10 s

1.0 ms

4.0
6.0 8.0 10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

2.0

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 18 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 17. At high case or ambient temperatures, thermal
limitations will reduce the power than can be handled to values less
than the limitations imposed by second breakdown.

40

Figure 18. ActiveRegion Safe Operating Area

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 V

101

A train of periodical power pulses can be represented by the model


as shown in Figure 19. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 17 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 17 by the
steady state value RJA.
Example:
Dissipating 2.0 watts peak under the following conditions:
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
Using Figure 17 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.

102

The peak rise in junction temperature is therefore


T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.

103
ICEO

102
101

ICBO
AND
ICEX @ VBE(off) = 3.0 V

100

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

For more information, see AN569.

Figure 19. Typical Collector Leakage Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2571

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistor

MPS4124

NPN Silicon

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCE

25

Vdc

Collector Base Voltage

VCB

30

Vdc

Emitter Base Voltage

VEB

5.0

Vdc

Collector Current Continuous

IC

200

mAdc

Total Power Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Power Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

W
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

25

30

5.0

50

50

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mA, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 10 mA, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IC = 0, IE = 10 mA)

V(BR)EBO

Collector Cutoff Current


(VCB = 20 V, IE = 0)

ICBO

Emitter Cutoff Current


(VEB = 3.0 V, IC = 0)

IEBO

Vdc
Vdc
Vdc
nAdc
nAdc

(Replaces MPS4123/D)

2572

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS4124
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

120
60

360

0.3

0.95

170

4.0

13.5

120

480

5.0

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 2.0 mA, VCE = 1.0 V)
(IC = 50 mA, VCE = 1.0 V)

hFE

Collector Emitter Saturation Voltage


(IC = 50 mA, IB = 5.0 mA)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 50 mA, IB = 5.0 mA)

VBE(sat)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mA, VCE = 20 V, f = 100 MHz)

fT

Output Capacitance
(VCB = 5.0 V, IE = 0, f = 1.0 MHz)

Cob

Input Capacitance
(VEB = 0.5 V, IC = 0, f = 1.0 MHz)

Cib

SmallSignal Current Gain


(IC = 2.0 mA, VCE = 1.0 V, f = 1.0 kHz)

hfe

Noise Figure
(IC = 100 mA, VCE = 5.0 V, RS = 1.0 k, f = 1.0 kHz)

NF

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MHz
pF
pF

dB

2573

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistor

MPS4126

PNP Silicon

COLLECTOR
3
2
BASE
1
EMITTER
1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCE

25

Vdc

Collector Base Voltage

VCB

25

Vdc

Emitter Base Voltage

VEB

4.0

Vdc

Collector Current Continuous

IC

200

mAdc

Total Power Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Power Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

W
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

25

25

4.0

50

50

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mA, IB = 0)

V(BR)CEO

Collector Base Breakdown Voltage


(IC = 10 mA, IE = 0)

V(BR)CBO

Emitter Base Breakdown Voltage


(IC = 0, IE = 10 mA)

V(BR)EBO

Collector Cutoff Current


(VCB = 20 V, IE = 0)

ICBO

Emitter Cutoff Current


(VEB = 3.0 V, IC = 0)

IEBO

Vdc
Vdc
Vdc
nAdc
nAdc

(Replaces MPS4125/D)

2574

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS4126
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

120
60

360

0.4

0.95

170

4.5

11.5

120

480

4.0

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 2.0 mA, VCE = 1.0 V)
(IC = 50 mA, VCE = 1.0 V)

hFE

Collector Emitter Saturation Voltage


(IC = 50 mA, IB = 5.0 mA)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 50 mA, IB = 5.0 mA)

VBE(sat)

Vdc
Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mA, VCE = 20 V, f = 100 MHz)

fT

Output Capacitance
(VCB = 5.0 V, IE = 0, f = 1.0 MHz)

Cob

Input Capacitance
(VEB = 0.5 V, IC = 0, f = 1.0 MHz)

Cib

SmallSignal Current Gain


(IC = 2.0 mA, VCE = 1.0 V, f = 1.0 kHz)

hfe

Noise Figure
(IC = 100 mA, VCE = 5.0 V, RS = 1.0 k, f = 1.0 kHz)

NF

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MHz
pF
pF

dB

2575

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Transistor

MPS4250

PNP Silicon

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

CASE 2904, STYLE 1


TO92 (TO226AA)

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Emitter Voltage

VCES

40

Vdc

Collector Base Voltage

VCBO

40

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

mW
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

V(BR)CES

40

Vdc

V(BR)CEO(sus)

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mA)

V(BR)CBO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mA)

V(BR)EBO

5.0

Vdc

10
3.0

nA
mA

20

nA

Characteristic

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 5.0 mA)
Collector Emitter Sustaining Voltage(1)
(IC = 5.0)

Collector Cutoff Current


(VCB = 50 V)
(VCB = 40 V, TA = 65C)

ICBO

Emitter Cutoff Current


(VEB = 3.0 V)

IEBO

1. Pulse Test: Pulse Width = 300 ms; Duty Cycle = 2.0%.

2576

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS4250
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

250
250

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mA, VCE = 5.0 V)
(IC = 10 mA, VCE = 5.0 V)

hFE

Collector Emitter Saturation Voltage(1)


(IC = 10 mA, IB = 0.5 mA)

VCE(sat)

0.25

Vdc

Base Emitter Saturation Voltage(1)


(IC = 10 mA, IB = 0.5 mA)

VBE(sat)

0.9

Vdc

Output Capacitance
(VCB = 5.0 V, f = 1.0 MHz)

Cobo

6.0

pF

Input Capacitance
(VEB = 0.5 V, f = 1.0 MHz)

Cibo

16

pF

250
2.0

800

2.0
2.0

SMALL SIGNAL CHARACTERISTICS

SmallSignal Current Gain


(IC = 1.0 mA, VCE = 5.0 V, f = 1.0 kHz)
(IC = 0.5 mA, VCE = 5.0 V, f = 20 MHz)

hfe

Noise Figure
(IC = 20 mA, VCE = 5.0 V, RS = 10 k, f = 1.0 kHz, PBW = 150 Hz)
(IC = 250 mA, VCE = 5.0 V, RS = 1.0 k, f = 1.0 kHz, PBW = 150 Hz)

NF

dB

1. Pulse Test: Pulse Width = 300 ms; Duty Cycle = 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2577

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Frequency Transistor

MPS5179

NPN Silicon

Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

12

Vdc

Collector Base Voltage

VCBO

20

Vdc

Emitter Base Voltage

VEBO

2.5

Vdc

Collector Current Continuous

IC

50

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

200
1.14

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

300
1.71

mW
mW/C

Storage Temperature Range

Tstg

55 to +150

CASE 2904, STYLE 1


TO92 (TO226AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Sustaining Voltage


(IC = 3.0 mAdc, IB = 0)

VCEO(sus)

12

Vdc

Collector Base Breakdown Voltage


(IC = 0.001 mAdc, IE = 0)

V(BR)CBO

20

Vdc

Emitter Base Breakdown Voltage


(IE = 0.01 mAdc, IC = 0)

V(BR)EBO

2.5

Vdc

0.02
1.0

hFE

25

250

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.4

Vdc

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

1.0

Vdc

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 15 Vdc, IE = 0)
(VCB = 15 Vdc, IE = 0, TA = 150C)

Adc

ICBO

ON CHARACTERISTICS
DC Current Gain
(IC = 3.0 mAdc, VCE = 1.0 Vdc)

Preferred devices are Motorola recommended choices for future use and best overall value.

2578

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS5179
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

fT

900

2000

MHz

CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 0.1 to 1.0 MHz)

Ccb

1.0

pF

Small Signal Current Gain


(IC = 2.0 mAdc, VCE = 6.0 Vdc, f = 1.0 kHz)

hfe

25

300

rbCc

3.0

14

ps

Noise Figure (See Figure 1)


(IC = 1.5 mAdc, VCE = 6.0 Vdc, RS = 50 ohms, f = 200 MHz)

NF

5.0

dB

CommonEmitter Amplifier Power Gain (See Figure 1)


(VCE = 6.0 Vdc, IC = 5.0 mAdc, f = 200 MHz)

Gpe

15

dB

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(1)
(IC = 5.0 mAdc, VCE = 6.0 Vdc, f = 100 MHz)

Collector Base Time Constant


(IE = 2.0 mAdc, VCB = 6.0 Vdc, f = 31.9 MHz)

1. fT is defined as the frequency at which |hfe| extrapolates to unity.

TYPE
1N3195

DC
COMMON

TYPE
1N3195
L3
1200

FROM 50
SOURCE 0.02 F
Cin
3.0 35

2.0 10
C7

1.0 5.0
91
Q

L1

EXTERNAL
SHIELD

C2
2.0 10
10 k

VEE
1200

TO 50
LOAD

2.0 10
C6

L2
0.1 F
0.001 F

RFC
1.0 H
0.1 F

+VCC
1200

L1 13/4 Turns, #18 AWG, 0.5 L, 0.5 Diameter


L2 2 Turns, #16 AWG, 0.5 L, 0.5 Diameter
L3 2 Turns, #13 AWG, 0.25 L, 0.5 Diameter (Position 1/4 from L2)

Figure 1. 200 MHz Amplifier Power Gain


and Noise Figure Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2579

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistor

MPS6428

NPN Silicon

COLLECTOR
3
2
BASE
1

1
EMITTER

CASE 2904, STYLE 1


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

50

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

200

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

50

Vdc

Collector Base Breakdown Voltage


(IC = 0.1 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Collector Cutoff Current


(VCE = 30 Vdc)

ICES

0.025

mA

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

0.01

mA

Emitter Cutoff Current


(VEB = 5.0 Vdc, IC = 0)

IEBO

0.01

mA

OFF CHARACTERISTICS

2580

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS6428
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

250
250
250
250

650

0.2
0.6

Unit

ON CHARACTERISTICS
DC Current Gain
(VCE = 5.0 Vdc, IC = 0.01 mAdc)
(VCE = 5.0 Vdc, IC = 0.1 mAdc)
(VCE = 5.0 Vdc, IC = 1.0 mAdc)
(VCE = 5.0 Vdc, IC = 10 mAdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 100 mAdc, IB = 5.0 mAdc)

VCE(sat)

Vdc

Base Emitter On Voltage


(IC = 1.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

0.56

0.66

Vdc

fT

100

700

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

3.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

8.0

pF

Input Impedance
(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

hie

3.0

30

Voltage Feedback Ratio


(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

hre

2.0

20

X 10 4

SmallSignal Current Gain


(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

hfe

200

800

Output Admittance
(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz)

hoe

5.0

50

mmhos

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 1.0 mAdc, VCE = 5.0 V, f = 100 MHz)

NOISE FIGURE/TOTAL NOISE VOLTAGE CHARACTERISTICS

Noise Figure/Voltage
(VCE = 5.0 V, IC = 0.1 mA, TA = 25C)

NF
VT
Max (1)

NF
VT
Max (2)

NF
VT
Max (3)

7.0

6.0

3.5

18.1

5700

4.3

Unit
dB

nV

1. RS = 10 k, BW = 1.0 Hz, f = 100 Hz


2. RS = 50 k, BW = 15.7 kHz, f = 10 Hz10 kHz
3. RS = 500 , BW = 1.0 Hz, f = 10 Hz

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2581

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistor

MPS6507

COLLECTOR
3

NPN Silicon

2
BASE
1
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

20

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

3.0

Vdc

Collector Current Continuous

IC

50

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

RqJA(1)

200

C/W

RqJC

83.3

C/W

Operating and Storage Junction


Temperature Range

1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage (2)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

20

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

30

Vdc

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

3.0

Vdc

50
1.0

nAdc
mAdc

hFE

25

75

fT

700

800

MHz

Cobo

1.25

2.5

pF

hfe

20

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 15 Vdc, IE = 0)
(VCB = 15 Vdc, IE = 0, TA = 60C)

ICBO

ON CHARACTERISTICS
DC Current Gain(2)
(IC = 2.0 mAdc, VCE = 10 Vdc)

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
SmallSignal Current Gain
(IC = 2.0 mAdc, VCE = 10 Vdc, f = 20 MHz)
1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

2582

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

COLLECTOR 3

NPN
MPS6521*
PNP
MPS6523

2
BASE

1 EMITTER

COLLECTOR 3
Voltage and current are negative
for PNP transistors

2
BASE

*Motorola Preferred Device

1 EMITTER

MAXIMUM RATINGS
Rating

Symbol

Collector Emitter Voltage

NPN

PNP

25

25

40

25

Unit

VCEO
MPS6521
MPS6523

Collector Base Voltage

Vdc

VCBO
MPS6521
MPS6523

Emitter Base Voltage

Vdc

VEBO

4.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

1
3

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient


(Printed Circuit Board Mounting)

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 0.5 mAdc, IB = 0)

V(BR)CEO

25

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

4.0

Vdc

0.05
0.05

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)
(VCB = 20 Vdc, IE = 0)

mAdc

ICBO
MPS6521
MPS6523

Preferred devices are Motorola recommended choices for future use and best overall value.

(Replaces MPS6520/D)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2583

NPN MPS6521 PNP MPS6523


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 mAdc, VCE = 10 Vdc)

MPS6521

hFE
150

(IC = 2.0 mAdc, VCE = 10 Vdc)

MPS6521

300

600

(IC = 100 mAdc, VCE = 10 Vdc)

MPS6523

150

(IC = 2.0 mAdc, VCE = 10 Vdc)

MPS6523

300

600

VCE(sat)

0.5

Vdc

Cobo

3.5

pF

NF

3.0

dB

Collector Emitter Saturation Voltage


(IC = 50 mAdc, IB = 5.0 mAdc)

SMALL SIGNAL CHARACTERISTICS


Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Noise Figure
(IC = 10 mAdc, VCE = 5.0 Vdc, RS = 10 k ,
Power Bandwidth = 15.7 kHz, 3.0 dB points @ 10 Hz and 10 kHz)

2584

Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN MPS6521 PNP MPS6523


NPN
MPS6521

EQUIVALENT SWITCHING TIME TEST CIRCUITS

+ 3.0 V
300 ns
DUTY CYCLE = 2%

275

+10.9 V

+ 3.0 V

10 < t1 < 500 s


DUTY CYCLE = 2%

t1

+10.9 V

10 k

275
10 k

0.5 V
<1.0 ns

CS < 4.0 pF*

9.1 V

< 1.0 ns

CS < 4.0 pF*

1N916

*Total shunt capacitance of test jig and connectors

Figure 1. TurnOn Time

Figure 2. TurnOff Time

TYPICAL NOISE CHARACTERISTICS


(VCE = 5.0 Vdc, TA = 25C)
20

100
BANDWIDTH = 1.0 Hz
RS = 0

50

300 A

10

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

IC = 1.0 mA

100 A

7.0
5.0
10 A
3.0

20

300 A
100 A

10
5.0
2.0
1.0
30 A

0.5

30 A

10 A

0.2
2.0

BANDWIDTH = 1.0 Hz
RS

IC = 1.0 mA

0.1
10

20

50

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

Figure 3. Noise Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

50

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

Figure 4. Noise Current

2585

NPN MPS6521 PNP MPS6523


NPN
MPS6521

NOISE FIGURE CONTOURS


(VCE = 5.0 Vdc, TA = 25C)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k

RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

500 k

20 k
10 k
5k

2.0 dB

2k
1k
500

3.0 dB 4.0 dB
6.0 dB

10 dB

200
100
50

1M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

1.0 dB

5k

2.0 dB

2k
1k
500

5.0 dB

200
100
10

20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

8.0 dB
10

20

Figure 5. Narrow Band, 100 Hz

500 k
RS , SOURCE RESISTANCE (OHMS)

3.0 dB

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

Figure 6. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is defined as:

20 k
10 k
5k

NF
1.0 dB

2k
1k
500

3.0 dB
5.0 dB
8.0 dB
10

20

30

50 70 100

200 300

500 700

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

2.0 dB

200
100
50

+ 20 log10

1k

IC, COLLECTOR CURRENT (A)

Figure 7. Wideband

2586

Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN MPS6521 PNP MPS6523


NPN
MPS6521

TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C

25C

200

55C
100
80
60

VCE = 1.0 V
VCE = 10 V

40
0.004 0.006 0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3
0.5 0.7 1.0
2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0 10

20

30

50

70 100

100

1.0
TJ = 25C
IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 8. DC Current Gain

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%

300 A
200 A
40
100 A
20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
VBE(sat) @ IC/IB = 10

0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.2

0.5 1.0
2.0
5.0
10
20
IC, COLLECTOR CURRENT (mA)

40

Figure 10. Collector Characteristics

1.4

0.1

400 A

60

Figure 9. Collector Saturation Region

0.8

IB = 500 A

50

100

Figure 11. On Voltages


Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6

*APPLIES for IC/IB hFE/2

0.8
25C to 125C
0

*qVC for VCE(sat)


55C to 25C

0.8
25C to 125C
1.6

qVB for VBE


2.4
0.1

0.2

55C to 25C

0.5
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 12. Temperature Coefficients


2587

NPN MPS6521 PNP MPS6523


NPN
MPS6521

TYPICAL DYNAMIC CHARACTERISTICS


1000
VCC = 3.0 V
IC/IB = 10
TJ = 25C

100
70
50

700
500

ts

300
200
t, TIME (ns)

t, TIME (ns)

300
200

tr

30
20
td @ VBE(off) = 0.5 Vdc

10
7.0
5.0

100
70
50

tf

30

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

20

3.0
1.0

2.0

50 70

20 30
3.0
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0

3.0

500

70 100

10
TJ = 25C
f = 100 MHz

TJ = 25C
f = 1.0 MHz

7.0

300
VCE = 20 V
200

5.0 V

100

Cib

5.0

Cob
3.0
2.0

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.2

0.5

1.0

2.0

5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 15. CurrentGain Bandwidth Product

Figure 16. Capacitance

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

3.0
2.0
1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

hfe 200 @ IC = 1.0 mA

7.0
5.0

0.2
0.1

10

20

50

200

10

100
70
50

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C
hfe 200 @ IC = 1.0 mA

30
20
10
7.0
5.0
3.0

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

Figure 17. Input Impedance


2588

0.1

IC, COLLECTOR CURRENT (mA)

20
hie , INPUT IMPEDANCE (k )

50

Figure 14. TurnOff Time

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 13. TurnOn Time

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

50

100

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 18. Output Admittance


Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN MPS6521 PNP MPS6523

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

NPN
MPS6521

1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19A

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

t2

1.0

2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 19. Thermal Response

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 Vdc

A train of periodical power pulses can be represented by the model


as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 19 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 19 by the
steady state value RJA.
Example:
The MPS6521 is dissipating 2.0 watts peak under the following
conditions:
t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.

103
102

ICEO

101
ICBO
AND
ICEX @ VBE(off) = 3.0 Vdc

100
101
102

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

The peak rise in junction temperature is therefore


T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.
For more information, see AN569.

Figure 19A.

IC, COLLECTOR CURRENT (mA)

400
1.0 ms

200
100
60
40

TC = 25C
dc

10

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

2.0

10 s
1.0 s
dc

TJ = 150C

4.0

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 20 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.

TA = 25C

20

6.0

100 s

4.0
6.0 8.0 10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

40

Figure 20.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2589

NPN MPS6521 PNP MPS6523


PNP
MPS6523
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
10
7.0
IC = 10 A

5.0

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

1.0
7.0
5.0

BANDWIDTH = 1.0 Hz
RS 0

30 A
3.0

100 A
300 A

1.0 mA

2.0

BANDWIDTH = 1.0 Hz
RS
IC = 1.0 mA

3.0
2.0

300 A

1.0
0.7
0.5

100 A
30 A

0.3
0.2

1.0

10 A

0.1
10

20

50

100 200
500 1.0 k
f, FREQUENCY (Hz)

2.0 k

5.0 k

10

10 k

20

50

Figure 21. Noise Voltage

100 200
500 1.0 k 2.0 k
f, FREQUENCY (Hz)

5.0 k

10 k

Figure 22. Noise Current

NOISE FIGURE CONTOURS

1.0 M
500 k

BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

(VCE = 5.0 Vdc, TA = 25C)

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100
20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

20 k
10 k

RS , SOURCE RESISTANCE (OHMS)

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

500 700 1.0 k

2.0 dB
3.0 dB
5.0 dB
10

Figure 23. Narrow Band, 100 Hz


1.0 M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k

200
100

5.0 dB
10

1.0 M
500 k

20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700 1.0 k

Figure 24. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is Defined as:


NF

20 k
10 k

1.0 dB
2.0 dB
3.0 dB
5.0 dB

200
100
10

20

30

50 70 100

200 300

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

0.5 dB

5.0 k
2.0 k
1.0 k
500

+ 20 log10

500 700 1.0 k

IC, COLLECTOR CURRENT (A)

Figure 25. Wideband


2590

Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN MPS6521 PNP MPS6523


PNP
MPS6523

TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C
25C

200

55C
100
80
60

VCE = 1.0 V
VCE = 10 V

40
0.003 0.005

0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3 0.5 0.7 1.0


2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0

10

20

30

50 70 100

100

1.0
TA = 25C
IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 26. DC Current Gain

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%
300 A

200 A
150 A

40

100 A
50 A

20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
0.8
VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.5 1.0
2.0
5.0
10
20
IC, COLLECTOR CURRENT (mA)

50

40

Figure 28. Collector Characteristics

1.4

0.2

250 A

60

Figure 27. Collector Saturation Region

0.1

IB = 400 A
350 A

100

Figure 29. On Voltages


Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6
*APPLIES for IC/IB hFE/2
0.8
*qVC for VCE(sat)

25C to 125C

0
55C to 25C
0.8
25C to 125C
1.6

2.4
0.1

qVB for VBE


0.2

55C to 25C

0.5
1.0 2.0
5.0
10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 30. Temperature Coefficients


2591

NPN MPS6521 PNP MPS6523


PNP
MPS6523

TYPICAL DYNAMIC CHARACTERISTICS


500
300
200

200

100
70
50
30
tr

20
10
7.0
5.0
1.0

100
70
50

tf

30

td @ VBE(off) = 0.5 V

20

2.0

3.0

50 70

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 32. TurnOff Time

500

10
TJ = 25C

TJ = 25C

7.0
VCE = 20 V

300

Cib
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 31. TurnOn Time

5.0 V
200

100

5.0

3.0
2.0

Cob

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.2

0.5

1.0

2.0

5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 33. CurrentGain Bandwidth Product

Figure 34. Capacitance

3.0
2.0

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

MPS6523
hfe 100
@ IC = 1.0 mA

1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

MPS6521
hfe 200
@ IC = 1.0 mA

7.0
5.0

0.2
0.1

10

20

50

200

10

100
70
50
30
20

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C
MPS6521
hfe 200
@ IC = 1.0 mA

10
7.0
5.0

MPS6523
hfe 100
@ IC = 1.0 mA

3.0
0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

Figure 35. Input Impedance


2592

0.1

IC, COLLECTOR CURRENT (mA)

20
hie , INPUT IMPEDANCE (k )

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

ts

300
t, TIME (ns)

t, TIME (ns)

1000
700
500

VCC = 3.0 V
IC/IB = 10
TJ = 25C

50

100

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 36. Output Admittance


Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN MPS6521 PNP MPS6523


PNP
MPS6523

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

TYPICAL DYNAMIC CHARACTERISTICS


1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

1.0

t2
2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 37. Thermal Response

IC, COLLECTOR CURRENT (mA)

400

100 s

100

TC = 25C
dc

60

1.0 s

TA = 25C

40

dc

20

TJ = 150C

10

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

6.0
4.0

10 s

1.0 ms

200

4.0
6.0 8.0 10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

2.0

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 18 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 17. At high case or ambient temperatures, thermal
limitations will reduce the power than can be handled to values less
than the limitations imposed by second breakdown.

40

Figure 38. ActiveRegion Safe Operating Area

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 V
103
ICEO

102
101

ICBO
AND
ICEX @ VBE(off) = 3.0 V

100
101
102

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

A train of periodical power pulses can be represented by the model


as shown in Figure 19. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 17 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 17 by the
steady state value RJA.
Example:
The MPS6523 is dissipating 2.0 watts peak under the following
conditions:
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
Using Figure 17 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.
The peak rise in junction temperature is therefore
T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.
For more information, see AN569.

Figure 39. Typical Collector Leakage Current


Motorola SmallSignal Transistors, FETs and Diodes Device Data

2593

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Audio Transistor

MPS6560

NPN Silicon

COLLECTOR
3
2
BASE
1
2

1
EMITTER

CASE 2904, STYLE 1


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

25

Vdc

Collector Base Voltage

VCBO

25

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case

Max

Unit

RqJA(1)

200

C/mW

RqJC

83.3

C/mW

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(2)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

25

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

25

Vdc

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCE = 25 Vdc, IB = 0)

ICES

100

nAdc

Collector Cutoff Current


(VCB = 20 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current


(VEB(off) = 4.0 Vdc, IC = 0)

IEBO

100

nAdc

OFF CHARACTERISTICS

1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width
300 ms; Duty Cycle
2.0%.

REV 1

2594

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS6560
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

35
50
50

200

Unit

ON CHARACTERISTICS(2)
DC Current Gain
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 500 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

0.5

Vdc

Base Emitter On Voltage


(IC = 500 mAdc, VCE = 1.0 Vdc)

VBE(on)

1.2

Vdc

fT

60

MHz

Cobo

30

pF

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 20 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
2. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2595

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

NPN
MPS6601
MPS6602*
PNP
MPS6651
MPS6652*

COLLECTOR
3

COLLECTOR
3
2
BASE

2
BASE
NPN

PNP
1
EMITTER

1
EMITTER

Voltage and current are negative


for PNP transistors

MAXIMUM RATINGS
Rating

Symbol

Collector Emitter Voltage

Value

VCEO
MPS6601/6651
MPS6602/6652

Collector Base Voltage

Vdc

VCBO

Vdc
25
30

VEBO

4.0

Vdc

Collector Current Continuous

IC

1000

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

RqJA(1)

200

C/W

RqJC

83.3

C/W

Operating and Storage Junction


Temperature Range

*Motorola Preferred Device

25
40

MPS6601/6651
MPS6602/6652
Emitter Base Voltage

Unit

1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Characteristic

Min

Max

25
40

25
40

4.0

0.1
0.1

0.1
0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 Adc, IE = 0)

V(BR)CEO
MPS6601/6651
MPS6602/6652

Vdc

V(BR)CBO
MPS6601/6651
MPS6602/6652

Emitter Base Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCE = 25 Vdc, IB = 0)
(VCE = 30 Vdc, IB = 0)

MPS6601/6651
MPS6602/6652

Collector Cutoff Current


(VCB = 25 Vdc, IE = 0)
(VCB = 30 Vdc, IE = 0)

MPS6601/6651
MPS6602/6652

Vdc

Vdc
Adc

ICES

Adc

ICBO

1. RqJA is measured with the device soldered into a typical printed circuit board.
Preferred devices are Motorola recommended choices for future use and best overall value.

2596

Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN MPS6601 MPS6602 PNP MPS6651 MPS6652


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

50
50
30

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 500 mAdc, VCE = 1.0 Vdc)
(IC = 1000 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 1000 mAdc, IB = 100 mAdc)

VCE(sat)

0.6

Vdc

BaseEmitter On Voltage
(IC = 500 mAdc, VCE = 1.0 Vdc)

VBE(on)

1.2

Vdc

fT

100

MHz

Cobo

30

pF

td

25

ns

tr

30

ns

ts

250

ns

tf

50

ns

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 50 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

SWITCHING CHARACTERISTICS
Delay Time
(VCC = 40 Vdc, IC = 500 mAdc,
IB1 = 50 mAdc
mAdc,
tp
300 ns Duty Cycle)

Rise Time

Storage Time
Fall Time

TURNON TIME

TURNOFF TIME

VCC

1.0 V

VCC

+VBB
+40
V

5.0 ms

100

+40
V

RL

100
OUTPUT

+10
V

Vin
tr = 3.0 ns

OUTPUT
Vin

RB

0
* CS

5.0 mF

RL

t 6.0 pF

RB
* CS

5.0 mF

t 6.0 pF

100

100
5.0 ms
tr = 3.0 ns
* Total Shunt Capacitance of Test Jig and Connectors
For PNP Test Circuits, Reverse All Voltage Polarities

Figure 1. Switching Time Test Circuits

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2597

NPN MPS6601 MPS6602 PNP MPS6651 MPS6652


300

200

h FE , CURRENT GAIN

h FE , CURRENT GAIN

200

100
70
VCE = 1.0 V
TJ = 25C

50

30
100

VCE = 10 V
TJ = 25C
f = 30 MHz

30
10

100

200

1000

200

100
70
50

VCE = 10 V
TJ = 25C
f = 30 MHz

30
10

100

200

1000

IC, COLLECTOR CURRENT (mA)

Figure 4. Current Gain Bandwidth Product

Figure 5. Current Gain Bandwidth Product

1.0

TJ = 25C

VBE(SAT) @ IC/IB = 10
0.8
V, VOLTAGE (VOLTS)

V, VOLTAGE (VOLTS)

300

IC, COLLECTOR CURRENT (mA)

0.8

VBE(ON) @ VCE = 1.0 V

0.6

0.4

2598

1000

Figure 3. MPS6651/6652 DC Current Gain

70

0
1.0

100

Figure 2. MPS6601/6602 DC Current Gain

100

0.2

VCE = 1.0 V
TJ = 25C

IC, COLLECTOR CURRENT (mA)

200

1.0

50

IC, COLLECTOR CURRENT (mA)

300

50

70

20
10

1000

f T , CURRENT GAIN BANDWIDTH PRODUCT (MHz)

f T , CURRENT GAIN BANDWIDTH PRODUCT (MHz)

10

100

100

1000

VBE(SAT) @ IC/IB = 10

VBE(ON) @ VCE = 1.0 V

0.4

0.2

VCE(SAT) @ IC/IB = 10

10

0.6

TJ = 25C

0
1.0

VCE(SAT) @ IC/IB = 10

10

100

1000

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 6. On Voltages

Figure 7. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN MPS6601 MPS6602 PNP MPS6651 MPS6652


160

80

TJ = 25C

60

40

C, CAPACITANCE (pF)

C, CAPACITANCE (pF)

TJ = 25C

Cib

20
Cob

0
Cob
Cib

5.0
1.0

10
15
20
2.0
3.0
4.0
VR, REVERSE VOLTAGE (VOLTS)

120

80
Cib
40
Cob

0
25
5.0

Cob
Cib

5.0
1.0

Figure 8. Capacitance

8.0

6.0

NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

10
VCE = 5.0 V
f = 1.0 kHz
TA = 25C
IC = 100 mA

4.0

2.0

VCE = 5.0 V
f = 1.0 kHz
TA = 25C

8.0

6.0
IC = 100 mA

4.0

2.0

0
10

100

1k

10 k

10

1k

100

10 k

Rs, SOURCE RESISTANCE (OHMS)

Rs, SOURCE RESISTANCE (OHMS)

Figure 10. MPS6601/6602 Noise Figure

Figure 11. MPS6651/6652 Noise Figure

10 k

10 k
td @ VBE(off) = 0.5 V
VCC = 40 V
IC/IB = 10
IB1 = IB2
TJ = 25C

1k

td @ VBE(off) = 0.5 V
VCC = 40 V
IC/IB = 10
IB1 = IB2
TJ = 25C

5k
3k
1k
t, TIME (NS)

5k
3k

t, TIME (NS)

25
5.0

Figure 9. Capacitance

10

500
ts
200

500
ts

200
100

100
50

tf

20

tr

10

10
15
20
2.0
3.0
4.0
VR, REVERSE VOLTAGE (VOLTS)

10

20

50

100

200

tf

50

500

tr
td

20

td
1000

10
10

20

50

100

200

1000

500

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 12. MPS6601/6602 Switching Times

Figure 13. MPS6651/6652 Switching Times

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2599

0.8

R qVB , TEMPERATURE COEFFICIENT (mV/C)

R qVB , TEMPERATURE COEFFICIENT (mV/ C)

NPN MPS6601 MPS6602 PNP MPS6651 MPS6652

1.2

1.6

RqVB for VBE

2.0

2.4
2.8
1.0

10

100

1000

RqVB for VBE


2.0

2.4
2.8
1.0

10

100

1000

IC, COLLECTOR CURRENT (mA)

Figure 14. BaseEmitter Temperature


Coefficient

Figure 15. BaseEmitter Temperature


Coefficient

1.0 MS

500
TC = 25C

200

1.0 MS

500

I C , COLLECTOR CURRENT (mA)

I C , COLLECTOR CURRENT (mA)

1.6

1 k

TC = 25C

200

1.0 s

100

1.0 s

100

50

MPS6601
MPS6602

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

20
10
1.0

MPS6651

50

MPS6652
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

20
10

2.0

5.0

10

40

20

1.0

2.0

5.0

10

20

40

VCE, COLLECTOREMITTER VOLTAGE

VCE, COLLECTOREMITTER VOLTAGE

Figure 16. Safe Operating Area

Figure 17. Safe Operating Area

1.0

1.0
TJ = 25C

VCE , COLLECTOR VOLTAGE (VOLTS)

VCE , COLLECTOR VOLTAGE (VOLTS)

1.2

IC, COLLECTOR CURRENT (mA)

1k

0.8

0.6
IC =
1000 mA
0.4
IC =
50 mA

0.2
IC =
10 mA

IC =
100 mA

IC =
500 mA
IC =
250 mA

0
0.01

2600

0.8

0.1

1.0

10

100

TJ = 25C
0.8

0.6
IC =
1000 mA
0.4

0.2

0
0.01

IC =
10 mA

IC =
50 mA

0.1

IC =
100 mA

IC =
500 mA
IC =
250 mA

1.0

10

IB, BASE CURRENT (mA)

IB, BASE CURRENT (mA)

Figure 18. MPS6601/6602 Saturation Region

Figure 19. MPS6651/6652 Saturation Region

100

Motorola SmallSignal Transistors, FETs and Diodes Device Data

r(t), NORMALIZED EFFECTIVE TRANSIENT


THERMAL RESISTANCE

NPN MPS6601 MPS6602 PNP MPS6651 MPS6652


1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2

0.1

0.1 0.05
0.07 0.02
0.05

P(pk)
SINGLE PULSE
t1

0.01
SINGLE PULSE

0.03

t2

0.02
0.01
0.001

RJC(t) = (t) JC
RJC = 100C/W MAX
RJA(t)d = r(t) JA
RJA = 357C/W MAX
D CURVES APPLY FOR
POWER PULSE TRAIN
SHOWN READ TIME AT t1
TJ(pk) TC = P(pk) JC(t)

DUTY CYCLE, D = t1/t2


0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1.0

2.0

5.0

10

20

50

100

t, TIME (SECONDS)

Figure 20. Thermal Response

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2601

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt Amplifier Transistors


NPN Silicon

MPS6714
MPS6715

COLLECTOR
3
2
BASE
1
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Collector Emitter Voltage

Value

Unit

VCEO
MPS6714
MPS6715

Collector Base Voltage

Vdc

VCBO
MPS6714
MPS6715

Emitter Base Voltage

5.0

Collector Current Continuous

IC

1.0

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

CASE 2905, STYLE 1


TO92 (TO226AE)

Vdc
40
50

VEBO

Operating and Storage Junction


Temperature Range

30
40

Vdc

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Characteristic

Min

Max

30
40

40
50

5.0

0.1
0.1

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 10 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
MPS6714
MPS6715
V(BR)CBO
MPS6714
MPS6715

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 40 Vdc, IE = 0)
(VCB = 50 Vdc, IE = 0)

2602

V(BR)EBO

Vdc

IEBO

Vdc
Adc

ICBO
MPS6714
MPS6715

Emitter Cutoff Current


(VEB = 5.0 Vdc, IC = 0)
1. Pulse Test: Pulse Width

Vdc

Adc

v 30 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS6714 MPS6715
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

60
50

250

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 1000 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 1000 mAdc, IB = 100 mAdc)

VCE(sat)

0.5

Vdc

Base Emitter On Voltage


(IC = 1000 mAdc, VCE = 1.0 Vdc)

VBE(on)

1.2

Vdc

CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Ccb

30

pF

SmallSignal Current Gain


(IC = 50 mAdc, VCE = 10 Vdc, f = 20 MHz)

hfe

2.5

25

SMALL SIGNAL CHARACTERISTICS

1. Pulse Test: Pulse Width

v 30 ms; Duty Cycle v 2.0%.


1.0
VCE , COLLECTOR VOLTAGE (VOLTS)

300

h FE , CURRENT GAIN

200

100
70
VCE = 1.0 V
TJ = 25C

50

V, VOLTAGE (VOLTS)

20

50

100

200

0.6
IC =
1000 mA

0.4
IC =
10 mA

0.2

IC =
50 mA

IC =
100 mA

IC =
IC = 500 mA
250 mA

0.5 1.0 2.0

5.0

10 20

Figure 1. DC Current Gain

Figure 2. Collector Saturation Region

VBE(on) @ VCE = 1.0 V

0.4

VCE(sat) @ IC/IB = 10

0
1.0 2.0

0.01 0.02 0.05 0.1 0.2

IB, BASE CURRENT (mA)

VBE(sat) @ IC/IB = 10

0.2

1000

IC, COLLECTOR CURRENT (mA)

TJ = 25C

0.6

500

5.0 10 20

qVB , TEMPERATURE COEFFICIENT (mV/C)

10

0.8

0.8

30

1.0

TJ = 25C

50 100 200 500 1000

0.8

1.2

1.6

qVB FOR VBE


2.0

2.4

2.8
1.0 2.0

5.0 10 20

50 100 200 500 1000

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 3. ON Voltages

Figure 4. Temperature Coefficient

Motorola SmallSignal Transistors, FETs and Diodes Device Data

50 100

2603

80

300

TJ = 25C
200
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

MPS6714 MPS6715

100
70
VCE = 10 V
TJ = 25C
f = 20 MHz

50

60

40

Cibo

20
Cobo

30
10

20

100

50

200

Cobo
Cibo

1000

IC, COLLECTOR CURRENT (mA)

5.0
1.0

10
2.0

15
3.0

20
4.0

25
5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 5. Current Gain Bandwidth Product

Figure 6. Capacitance

IC , COLLECTOR CURRENT (mA)

1k
1.0 s
500

1.0 ms 100 ms

200
TA = 25C
100

DUTY CYCLE 10%


CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

50

20
10
1.0

TC = 25C

MPS6714
MPS6715
2.0

5.0

10

20

30 40

VCE, COLLECTOREMITTER VOLTAGE (V)

Figure 7. Active Region Safe Operating


Area

2604

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt Amplifier Transistor


NPN Silicon

MPS6717

COLLECTOR
3
2
BASE
1
EMITTER

1
2

CASE 2905, STYLE 1


TO92 (TO226AE)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

80

Vdc

Collector Base Voltage

VCBO

80

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

80

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

80

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCB = 60 Vdc, IE = 0)

ICBO

0.1

Adc

Emitter Cutoff Current


(VEB = 5.0 Vdc, IC = 0)

IEBO

10

Adc

Characteristic

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2605

MPS6717
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

80
50

250

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 250 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 250 mAdc, IB = 10 mAdc)

VCE(sat)

0.5

Vdc

Base Emitter On Voltage


(IC = 250 mAdc, VCE = 1.0 Vdc)

VBE(on)

1.2

Vdc

CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Ccb

30

pF

SmallSignal Current Gain


(IC = 200 mAdc, VCE = 5.0 Vdc, f = 20 MHz)

hfe

2.5

25

SMALL SIGNAL CHARACTERISTICS

400

hFE , DC CURRENT GAIN

TJ = 125C

VCE = 1.0 V

200
25C
55C
100
80
60
40
0.5

0.7

1.0

2.0

3.0

5.0

7.0
10
20
30
IC, COLLECTOR CURRENT (mA)

50

70

100

200

300

500

1.0

1.0
TJ = 25C

TJ = 25C

0.8

0.6

0.8
IC = 10 mA

50
mA

100 mA

250 mA

V, VOLTAGE (VOLTS)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

500 mA

0.4

0.2

VBE(sat) @ IC/IB = 10
0.6

VBE(on) @ VCE = 1.0 V

0.4

0.2
VCE(sat) @ IC/IB = 10

0
0.05

0.1

0.2

1.0
0.5
2.0
5.0
IB, BASE CURRENT (mA)

10

20

Figure 2. Collector Saturation Region

2606

50

0
0.5

1.0

2.0

20
5.0
10
50
100
IC, COLLECTOR CURRENT (mA)

200

500

Figure 3. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

80

0.8

TJ = 25C

60
1.2

40
C, CAPACITANCE (pF)

VB, TEMPERATURE COEFFICIENT (mV/C)

MPS6717

1.6
VB for VBE

2.0

2.4

Cibo

20

10
8.0
6.0

2.8
0.5

1.0

2.0

5.0
20
50
10
100
IC, COLLECTOR CURRENT (mA)

200

Cobo

4.0
0.1

500

0.2

0.5 1.0 2.0


5.0 10
20
VR, REVERSE VOLTAGE (VOLTS)

100

Figure 5. Capacitance

300
200

VCE = 2.0 V
TJ = 25C

IC, COLLECTOR CURRENT (mA)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 4. BaseEmitter Temperature Coefficient

50

100
70
50

DUTY CYCLE 10%


2k

1.0 ms

1k

100 s

500
TA = 25C

200

TC = 25C

dc
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

100
50

1.0 s
dc

20
30
2.0

3.0

5.0 7.0 10
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

200

Figure 6. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10
1.0

MPS6717
2.0
5.0
10
20
60 80 100
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. Active Region Safe Operating Area

2607

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt Darlington Transistors


NPN Silicon

MPS6724
MPS6725

COLLECTOR 3
BASE
2

EMITTER 1

MAXIMUM RATINGS
Rating

Symbol

MPS6724

MPS6725

Unit

Collector Emitter Voltage

VCES

40

50

Vdc

Collector Base Voltage

VCBO

50

60

Vdc

Emitter Base Voltage

VEBO

12

Vdc

Collector Current Continuous

IC

1000

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

1
3

CASE 2905, STYLE 1


TO92 (TO226AE)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

40
50

50
60

12

100
100

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage (1)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 1.0 mAdc, IE = 0)

V(BR)CES
MPS6724
MPS6725
V(BR)CBO
MPS6724
MPS6725

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 30 Vdc, IE = 0)
(VCB = 40 Vdc, IE = 0)
Emitter Cutoff Current
(VEB = 10 Vdc, IC = 0)
1. Pulse Test: Pulse Width

Vdc

V(BR)EBO

Vdc

ICBO
MPS6724
MPS6725
IEBO

Vdc
nAdc

nAdc

v 300 ms; Duty Cycle v 2.0%.

REV 1

2608

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPS6724 MPS6725
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

25,000
4,000

40,000

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 200 mAdc, VCE = 5.0 Vdc)
(IC = 1000 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 1000 mAdc, IB = 2.0 mAdc)

VCE(sat)

1.5

Vdc

Base Emitter On Voltage


(IC = 1000 mAdc, VCE = 5.0 Vdc)

VBE(on)

2.0

Vdc

fT

100

1000

MHz

Ccb

10

pF

SMALL SIGNAL CHARACTERISTICS


CurrentGain Bandwidth Product
(IC = 200 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.


TYPICAL CHARACTERISTICS
CURRENT LIMIT
DUTY CYCLE 10%
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

I C , COLLECTOR CURRENT (mA)

3.0 k
2.0 k

100 ms
1.0 ms

1.0 k
1.0 s
500
TA = 25C
200
1.5

TC = 25C

2.0

5.0

10

20

30

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. Active Region Safe Operating


Area

VCE , COLLECTOR EMITTER VOLTAGE (VOLTS)

200 k

h FE , DC CURRENT GAIN

TJ = 125C
100 k
70 k
50 k

25C

30 k
20 k
10 k
7.0 k
5.0 k

55C

3.0 k
2.0 k
5.0 7.0 10

VCE = 5.0 V

20

30

50 70 100

200 300

500

IC, COLLECTOR CURRENT (mA)

Figure 2. DC Current Gain

Motorola SmallSignal Transistors, FETs and Diodes Device Data

3.0
TJ = 25C
IC =
10 mA

2.5

IC =
50 mA

IC =
500 mA

IC =
250 mA

2.0

1.5

1.0

0.5
0.1

0.2

0.5 1.0 2.0

5.0

10

20

50

100 200

500 1000

IB, BASE CURRENT (mA)

Figure 3. Collector Saturation Region

2609

MPS6724 MPS6725
q V , TEMPERATURE COEFFICIENTS (mV/ C)

1.6
TJ = 25C

V, VOLTAGE (VOLTS)

1.4
VBE(sat) @ IC/IB = 1000
1.2
VBE(on) @ VCE = 5.0 V
1.0

0.8

0.6

VCE(sat) @ IC/IB = 1000


5.0 7.0 10

20

30

50

70 100

200 300

1.0

2.0

*APPLIES FOR IC/IB hFE/3.0

55C TO 25C
3.0
25C TO 125C
4.0

qVB FOR VBE


5.0

55C TO 25C

6.0

500

5.0 7.0 10

20

Figure 4. ON Voltages

200 300

500

20
TJ = 25C
C, CAPACITANCE (pF)

h FE , SMALLSIGNAL CURRENT GAIN

70 100

VCE = 5.0 V
TJ = 25C
f = 100 MHz

1.0
0.8
0.6
0.4

2610

50

Figure 5. Temperature Coefficients

4.0

0.2
0.5

30

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

2.0

25C TO 125C

*qVC FOR VCE(sat)

10
7.0

Cibo

5.0
Cobo
3.0
2.0

1.0

2.0

5.0

10

20

50

100

200

500

0.04

0.1

0.2

0.4

1.0

2.0

4.0

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 6. High Frequency Current Gain

Figure 7. Capacitance

10

20

40

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt Amplifier Transistor


PNP Silicon

MPS6726
MPS6727

COLLECTOR
3
2
BASE
1
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Collector Emitter Voltage

Value

Unit

VCEO
MPS6726
MPS6727

Collector Base Voltage

Vdc

VCBO
MPS6726
MPS6727

Emitter Base Voltage

5.0

Collector Current Continuous

IC

1.0

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

CASE 2905, STYLE 1


TO92 (TO226AE)

Vdc
40
50

VEBO

Operating and Storage Junction


Temperature Range

30
40

Vdc

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Characteristic

Min

Max

30
40

40
50

5.0

0.1
0.1

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 10 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
MPS6726
MPS6727
V(BR)CBO
MPS6726
MPS6727

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 40 Vdc, IE = 0)
(VCB = 50 Vdc, IE = 0)
Emitter Cutoff Current
(VEB = 5.0 Vdc, IC = 0)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Vdc

V(BR)EBO

Vdc

Adc

ICBO
MPS6726
MPS6727
IEBO

Vdc

Adc

2611

MPS6726 MPS6727
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

60
50

250

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 1000 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 1000 mAdc, IB = 100 mAdc)

VCE(sat)

0.5

Vdc

Base Emitter On Voltage


(IC = 1000 mAdc, VCE = 1.0 Vdc)

VBE(on)

1.2

Vdc

CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Ccb

30

pF

SmallSignal Current Gain


(IC = 50 mAdc, VCE = 10 Vdc, f = 20 MHz)

hfe

2.5

25

SMALL SIGNAL CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.


1.0
VCE , COLLECTOR VOLTAGE (VOLTS)

h FE , CURRENT GAIN

200

100
70
VCE = 1.0 V
TJ = 25C

50

20
10

20

50

100

200

500

1000

0.6

0.4

0.2

50 100

Figure 2. Collector Saturation Region

qV B, TEMPERATURE COEFFICIENT (mV/ C)

V, VOLTAGE (VOLTS)

2612

IC =
IC =
IC =
250 500 mA 1000 mA
mA

Figure 1. DC Current Gain

VBE(SAT) @ IC/IB = 10

VBE(ON) @ VCE = 1.0 V

VCE(SAT) @ IC/IB = 10

0
1.0 2.0

IC =
100
mA

IB, BASE CURRENT (mA)

0.4

0.2

IC =
50 mA

IC, COLLECTOR CURRENT (mA)

TJ = 25C

0.6

IC =
10 mA

TJ = 25C
0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20

1.0

0.8

0.8

5.0

10

20

50 100 200

500 1000

0.8

1.2

1.6

qVB for VBE


2.0

2.4

2.8
1.0 2.0

5.0

10

20

50 100 200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 3. ON Voltages

Figure 4. Temperature Coefficient

500 1000

Motorola SmallSignal Transistors, FETs and Diodes Device Data

300

160
TJ = 25C

200
C, CAPACITANCE (pF)

f T , CURRENTGAIN BANDWIDTH PRODUCT (MHz)

MPS6726 MPS6727

VCE = 10 V
TJ = 25C
f = 20 MHz

100
70
50

120

80
Cibo
40
Cobo

30
10

0
20

50

100

200

500

1000

Cobo
Cibo

IC, COLLECTOR CURRENT (mA)

5.0
1.0

10
15
20
2.0
3.0
4.0
VR, REVERSE VOLTAGE (VOLTS)

Figure 5. Current Gain Bandwidth Product

Figure 6. Capacitance

1.0 k
I C , COLLECTOR CURRENT (mA)

1.0 s
500

1.0 ms

100 ms

TA = 25C
TC = 25C

200
100

25
5.0

DUTY CYCLE 10%


MPS6726
MPS6727

50

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

20
10
1.0

2.0

5.0

10

20 30 40

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. Active Region Safe Operating


Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2613

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

NPN
MPS8098
MPS8099*
PNP
MPS8598
MPS8599*

COLLECTOR
3

COLLECTOR
3
2
BASE

2
BASE
NPN

PNP
1
EMITTER

1
EMITTER

MAXIMUM RATINGS
Symbol

MPS8098
MPS8598

MPS8099
MPS8599

Unit

Collector Emitter Voltage

VCEO

60

80

Vdc

Collector Base Voltage

VCBO

60

80

Vdc

MPS8099

MPS8598
MPS8599

6.0

5.0

Rating

Emitter Base Voltage

VEBO

Voltage and current are negative


for PNP transistors
*Motorola Preferred Device

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Characteristic

Min

Max

60
80

60
80

6.0
5.0

0.1

0.1
0.1

0.1
0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 10 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 Adc, IE = 0)
Emitter Base Breakdown Voltage
(IE = 10 Adc, IC = 0)

V(BR)CEO
MPS8098, MPS8598
MPS8099, MPS8599
V(BR)CBO
MPS8098, MPS8598
MPS8099, MPS8599

Vdc

V(BR)EBO
MPS8098, MPS8099
MPS8598, MPS8599

Collector Cutoff Current


(VCE = 60 Vdc, IB = 0)

ICES

Collector Cutoff Current


(VCB = 60 Vdc, IE = 0)
(VCB = 80 Vdc, IE = 0)

MPS8098, MPS8598
MPS8099, MPS8599

Emitter Cutoff Current


(VEB = 6.0 Vdc, IC = 0)
(VEB = 4.0 Vdc, IC = 0)

MPS8098, MPS8099
MPS8598, MPS8599

1. Pulse Test: Pulse Width

Vdc

Vdc

Adc

ICBO

v 300 ms, Duty Cycle = 2.0%.

Adc

Adc

IEBO

Preferred devices are Motorola recommended choices for future use and best overall value.

2614

Motorola SmallSignal Transistors, FETs and Diodes Device Data

NPN MPS8098 MPS8099 PNP MPS8598 MPS8599


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

100
100
75

300

0.4
0.3

0.5
0.6

0.7
0.8

150

6.0
8.0

25
30

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 1.0 mAdc, VCE = 5.0 Vdc)
(IC = 10 mAdc, VCE = 5.0 Vdc)
(IC = 100 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 100 mAdc, IB = 5.0 mAdc)
(IC = 100 mAdc, IB = 10 mAdc)

VCE(sat)

BaseEmitter On Voltage
(IC = 1.0 mAdc, VCE = 5.0 Vdc)
(IC = 10 mAdc, VCE = 5.0 Vdc)

Vdc

VBE(on)

Vdc

MPS8098, MPS8598
MPS8099, MPS8599

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

fT

Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Cobo

Cibo

pF

MPS8098, MPS8099
MPS8598, MPS8599

v 300 ms, Duty Cycle = 2.0%.

TURNON TIME

TURNOFF TIME

VCC

1.0 V

pF

MPS8098, MPS8099
MPS8598, MPS8599

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

VCC
+40 V

+VBB
+40 V

5.0 ms

100

RL

100
OUTPUT

+10 V
Vin

* CS

5.0 mF

RL
OUTPUT

Vin

RB

0
tr = 3.0 ns

MHz

t 6.0 pF

RB
* CS

5.0 mF

t 6.0 pF

100

100
5.0 ms
tr = 3.0 ns
* Total Shunt Capacitance of Test Jig and Connectors
For PNP Test Circuits, Reverse All Voltage Polarities

Figure 1. Switching Time Test Circuits

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2615

300
TJ = 25C
200
5.0 V
VCE = 1.0 V
100
70
50

30
1.0

2.0

3.0

5.0 7.0 10

20

30

50 70 100

f T , CURRENTGAIN BANDWIDTH PRODUCT (MHz)

f T , CURRENTGAIN BANDWIDTH PRODUCT (MHz)

NPN MPS8098 MPS8099 PNP MPS8598 MPS8599


300
TJ = 25C
200
5.0 V
VCE = 1.0 V
100
70
50

30
1.0

2.0 3.0

5.0 7.0 10

20 30

50 70 100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 2. MPS8098/99 CurrentGain


Bandwidth Product

Figure 3. MPS8598/99 CurrentGain


Bandwidth Product

40

40

25C
TTJJ==25C

TJ = 25C
20
C, CAPACITANCE (pF)

C, CAPACITANCE (pF)

20
Cibo
10
8.0
6.0

Cibo
10
8.0
6.0
Cobo
4.0

4.0
Cobo
2.0
0.1

1.0 k
700
500

0.5

1.0

2.0

5.0

20

10

50

5.0

50 100

10 20

Figure 5. MPS8598/99 Capacitance

1.0 k
700
500

ts

t, TIME (ns)

30

200
tf

100
70
50

tr

30

20

20

20

tr

td @ VBE(off) = 0.5 V

10
30

50

70

100

VCC = 40 V
IC/IB = 10
IB1 = IB2
TJ = 25C

ts

300

tf

10

2.0

Figure 4. MPS8098/99 Capacitance

100
70
50

2616

0.5 1.0

VR, REVERSE VOLTAGE (VOLTS)

200

10

2.0
0.1 0.2

100

VR, REVERSE VOLTAGE (VOLTS)

VCC = 40 V
IC/IB = 10
IB1 = IB2
TJ = 25C

300
t, TIME (ns)

0.2

200

td @ VBE(off) = 0.5 V
10

20

30

50

70

100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 6. MPS8098/99 Switching Times

Figure 7. MPS8598/99 Switching Times

200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0 k
700
500

1.0 k
700
500

I C , COLLECTOR CURRENT (mA)

I C , COLLECTOR CURRENT (mA)

NPN MPS8098 MPS8099 PNP MPS8598 MPS8599

300

300

200

200

100
70
50

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

30
20

MPS8098
MPS8099

DUTY CYCLE 10%


10
1.0

100
70
50

2.0

3.0

5.0 7.0 10

20

30
20
10

50

30

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
MPS8598
DUTY CYCLE 10%
MPS8599

70 100

1.0

2.0 3.0

5.0 7.0 10

20 30

50 70 100

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 8. MPS8098/99 ActiveRegion Safe


Operating Area

Figure 9. MPS8598/99 ActiveRegion Safe


Operating Area

400

300
TJ = 125C

h FE, DC CURRENT GAIN

25C

200

55C

100
VCE = 5.0 V

80
60
40
0.2 0.3 0.5

1.0

1.0

2.0 3.0 5.0

10

20 30

50

25C

100
70

VCE = 5.0 V
50

30
0.2

100 200

55C

0.5

1.0 2.0

10

20

50 100 200

IC, COLLECTOR CURRENT (mA)

Figure 10. MPS8098/99 DC Current Gain

Figure 11. MPS8598/99 DC Current Gain

1.0

TJ = 25C

TJ = 25C

0.8

VBE(sat) @ IC/IB = 10

0.6

VBE @ VCE = 5.0 V

0.4

0.2

VBE(sat) @ IC/IB = 10

0.6

VBE @ VCE = 5.0 V

0.4

0.2
VCE(sat) @ IC/IB = 10

VCE(sat) @ IC/IB = 10
0
0.2

5.0

IC, COLLECTOR CURRENT (mA)

0.8
V, VOLTAGE (VOLTS)

200

V, VOLTAGE (VOLTS)

h FE , DC CURRENT GAIN

TJ = 125C

0.5

1.0

2.0

5.0

10

20

50

100

200

0
0.2

0.5

1.0

2.0

5.0

10

20

50

100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 12. MPS8098/99 ON Voltages

Figure 13. MPS8598/99 ON Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

200

2617

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

2.0

TJ = 25C
IC =
50 mA

IC =
20 mA

1.6

IC =
200 mA

IC =
100 mA

1.2

0.8

0.4
IC =
10 mA
0
0.02

0.05

0.1

0.2

0.5

1.0

2.0

5.0

10

20

RqVB FOR VBE


55C TO 125C

2.2

2.6
3.0
0.2

r(t), NORMALIZED TRANSIENT


THERMAL RESISTANCE

IC =
100 mA

IC =
200 mA

1.2

0.8

0.4
TJ = 25C
0
0.05 0.1
0.02

0.2

0.5

1.0

2.0

10

5.0

Figure 15. MPS8598/99 Collector Saturation


Region

1.8

0.5

1.0

2.0

5.0

10

20

50

100

200

20

1.0

1.4

1.8

RqVB FOR VBE


55C TO 125C

2.2

2.6
3.0
0.2

0.5

1.0

2.0

5.0

10

20

50

100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 16. MPS8098/99 BaseEmitter


Temperature Coefficient

Figure 17. MPS8598/99 BaseEmitter


Temperature Coefficient

200

D = 0.5
0.2

0.3

0.1
0.07
0.05

IC =
50 mA

IC =
20 mA

Figure 14. MPS8098/99 Collector Saturation


Region

1.4

0.2

IC =
10 mA

1.6

IB, BASE CURRENT (mA)

1.0

1.0
0.7
0.5

2.0

IB, BASE CURRENT (mA)

R qVB , TEMPERATURE COEFFICIENT (mV/C)

R qVB , TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

NPN MPS8098 MPS8099 PNP MPS8598 MPS8599

0.1
0.05
0.02

SINGLE PULSE

ZJC(t) = r(t) RJC


TJ(pk) TC = P(pk) ZJC(t)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)
D CURVES APPLY FOR
POWER PULSE TRAIN
SHOWN READ TIME AT t1
(SEE AN469)

P(pk)

0.01

t1
SINGLE PULSE

0.03

t2

0.02

DUTY CYCLE, D = t1/t2

0.01
1.0

2.0

5.0

10

20

50

100

200

500

1.0 k

2.0 k

5.0 k

10 k

20 k

50 k

100 k

t, TIME (ms)

Figure 18. MPS8098, MPS8099, MPS8598 and MPS8599 Thermal Response

2618

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

NPN
MPSA05
MPSA06*
PNP
MPSA55
MPSA56*

COLLECTOR
3

COLLECTOR
3
2
BASE

2
BASE
NPN

PNP
1
EMITTER

1
EMITTER

Voltage and current are negative


for PNP transistors

MAXIMUM RATINGS
Symbol

MPSA05
MPSA55

MPSA06
MPSA56

Unit

Collector Emitter Voltage

VCEO

60

80

Vdc

Collector Base Voltage

VCBO

60

80

Vdc

Emitter Base Voltage

Rating

*Motorola Preferred Device

VEBO

4.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case

Symbol

Max

Unit

RqJA(1)

200

C/W

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

60
80

V(BR)EBO

4.0

Vdc

ICES

0.1

Adc

0.1
0.1

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(2)
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO
MPSA05, MPSA55
MPSA06, MPSA56

Emitter Base Breakdown Voltage


(IE = 100 Adc, IC = 0)
Collector Cutoff Current
(VCE = 60 Vdc, IB = 0)
Collector Cutoff Current
(VCB = 60 Vdc, IE = 0)
(VCB = 80 Vdc, IE = 0)

Vdc

Adc

ICBO
MPSA05, MPSA55
MPSA06, MPSA56

1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width
300 ms, Duty Cycle
2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2619

NPN MPSA05 MPSA06 PNP MPSA55 MPSA56


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

100
100

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 100 mAdc, IB = 10 mAdc)

VCE(sat)

0.25

Vdc

BaseEmitter On Voltage
(IC = 100 mAdc, VCE = 1.0 Vdc)

VBE(on)

1.2

Vdc

MPSA05
MPSA06

100

MPSA55
MPSA56

50

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(3)
(IC = 10 mA, VCE = 2.0 V, f = 100 MHz)

fT

(IC = 100 mAdc, VCE = 1.0 Vdc, f = 100 MHz)

MHz

3. fT is defined as the frequency at which |hfe| extrapolates to unity.

TURNON TIME

TURNOFF TIME

VCC

1.0 V

VCC
+40 V

+VBB
+40 V

5.0 ms

100

RL

100
OUTPUT

+10 V
Vin
tr = 3.0 ns

OUTPUT
Vin

RB

0
* CS

5.0 mF

RL

t 6.0 pF

RB
* CS

5.0 mF

t 6.0 pF

100

100
5.0 ms
tr = 3.0 ns
* Total Shunt Capacitance of Test Jig and Connectors
For PNP Test Circuits, Reverse All Voltage Polarities

Figure 1. Switching Time Test Circuits

2620

Motorola SmallSignal Transistors, FETs and Diodes Device Data

300
VCE = 2.0 V
TJ = 25C

200

100
70
50

30
2.0

3.0

5.0 7.0 10

20

30

50

70 100

200

f T , CURRENTGAIN BANDWIDTH PRODUCT (MHz)

f T , CURRENTGAIN BANDWIDTH PRODUCT (MHz)

NPN MPSA05 MPSA06 PNP MPSA55 MPSA56

30
20
2.0 3.0

5.0 7.0 10

20 30

50 70 100

200

100
TJ = 25C

TJ = 25C

70

C, CAPACITANCE (pF)

50
Cibo

20

10
8.0
Cobo

4.0
0.1

0.2

0.5

1.0

2.0

5.0

10

50

20

Cibo

30
20

Cobo

10
7.0
5.0
0.1 0.2

100

0.5 1.0

2.0

5.0

10 20

50 100

VR, REVERSE VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. MPSA05/06 Capacitance

Figure 5. MPSA55/56 Capacitance

1.0 k
700
500

1.0 k
700
500

ts

300
200
100
70
50

tf
VCC = 40 V
IC/IB = 10
IB1 = IB2
TJ = 25C
5.0 7.0 10

200
100
70
50
30

tr

20
td @ VBE(off) = 0.5 V
20

30

50

70 100

200 300

ts

300
t, TIME (ns)

C, CAPACITANCE (pF)

50

Figure 3. MPSA55/56 CurrentGain


Bandwidth Product

6.0

t, TIME (ns)

70

Figure 2. MPSA05/06 CurrentGain


Bandwidth Product

40

10

100

IC, COLLECTOR CURRENT (mA)

60

20

VCE = 2.0 V
TJ = 25C

IC, COLLECTOR CURRENT (mA)

80

30

200

500

tf
VCC = 40 V
IC/IB = 10
IB1 = IB2
TJ = 25C

10
5.0 7.0 10

td @ VBE(off) = 0.5 V
20 30

50 70 100

tr
200 300

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 6. MPSA05/06 Switching Time

Figure 7. MPSA55/56 Switching Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

500

2621

1.0 k
700
500

1.0 k
700
500

100 ms
1.0 ms

300

I C , COLLECTOR CURRENT (mA)

I C , COLLECTOR CURRENT (mA)

NPN MPSA05 MPSA06 PNP MPSA55 MPSA56

300

1.0 s
TC = 25C

200

20
MPSA05
10
1.0

2.0

3.0

5.0 7.0 10

TA = 25C

100
70
50

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

30

1.0 s
TC = 25C

200

TA = 25C
100
70
50

100 ms
1.0 ms

MPSA06
20

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

30
20

MPSA55

10
50

30

70 100

1.0

2.0 3.0

5.0 7.0 10

MPSA56
20 30

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 8. MPSA05/06 ActiveRegion Safe


Operating Area

Figure 9. MPSA55/56 ActiveRegion Safe


Operating Area

400

400
TJ = 125C

TJ = 125C

VCE = 1.0 V

25C
55C
100
80
60

1.0

1.0

2.0 3.0 5.0

10

20 30

50

100

200
25C
55C
100
80
60
40
0.5 1.0 2.0

200 300 500

50

100 200

Figure 10. MPSA05/06 DC Current Gain

Figure 11. MPSA55/56 DC Current Gain

1.0

TJ = 25C

VBE(on) @ VCE = 1.0 V

0.2

500

TJ = 25C

0.8

VBE(sat) @ IC/IB = 10

0.4

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 1.0 V

0.4

0.2
VCE(sat) @ IC/IB = 10

2622

20

IC, COLLECTOR CURRENT (mA)

0.6

0
0.5

5.0 10

IC, COLLECTOR CURRENT (mA)

0.8
V, VOLTAGE (VOLTS)

h FE, DC CURRENT GAIN

200

V, VOLTAGE (VOLTS)

h FE , DC CURRENT GAIN

VCE = 1.0 V

40
0.5

50 70 100

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

1.0

2.0

5.0

VCE(sat) @ IC/IB = 10
10

20

50

100

200

500

0
0.5

1.0 2.0

5.0

10

20

50

100 200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 12. MPSA05/06 ON Voltages

Figure 13. MPSA55/56 ON Voltages

500

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0
TJ = 25C
0.8
IC =
250 mA

IC =
100 mA

IC =
50 mA

IC =
500 mA

0.6

0.4
IC =
10 mA

0.2
0

0.05

0.1

0.2

0.5

2.0

1.0

5.0

10

20

50

1.0
TJ = 25C
0.8
IC =
250 mA

IC =
100 mA

IC =
50 mA
0.6

0.4
IC =
10 mA

0.2

0
0.05 0.1 0.2

0.5

1.0

2.0

5.0

10

20

50

IB, BASE CURRENT (mA)

Figure 14. MPSA05/06 Collector Saturation


Region

Figure 15. MPSA55/56 Collector Saturation


Region

R qVB , TEMPERATURE COEFFICIENT (mV/C)

1.2

1.6
RqVB for VBE

2.0

2.4
2.8
0.5

1.0

2.0

5.0

10

20

50

100

200

500

0.8

1.2

1.6
RqVB for VBE

2.0

2.4
2.8
0.5 1.0 2.0

5.0

10

20

50

100 200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 16. MPSA05/06 BaseEmitter


Temperature Coefficient

Figure 17. MPSA55/56 BaseEmitter


Temperature Coefficient

1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2 0.1
0.05
0.1
0.07
0.05

IC =
500 mA

IB, BASE CURRENT (mA)

0.8

r(t), NORMALIZED TRANSIENT


THERMAL RESISTANCE

R qVB , TEMPERATURE COEFFICIENT (mV/ C)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

NPN MPSA05 MPSA06 PNP MPSA55 MPSA56

0.02

SINGLE PULSE

ZJC(t) = r(t) RJC


TJ(pk) TC = P(pk) ZJC(t)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)
D CURVES APPLY FOR
POWER PULSE TRAIN
SHOWN READ TIME AT t1
(SEE AN469)

P(pk)

0.01

t1
SINGLE PULSE

0.03

t2

0.02

500

DUTY CYCLE, D = t1/t2

0.01
1.0

2.0

5.0

10

20

50

100

200

500

1.0 k

2.0 k

5.0 k

10 k

20 k

50 k

100 k

t, TIME (ms)

Figure 18. MPSA05, MPSA06, MPSA55 and MPSA56 Thermal Response

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2623

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Darlington Transistors

MPSA13
MPSA14 *

NPN Silicon

COLLECTOR 3

*Motorola Preferred Device

BASE
2

EMITTER 1

1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCES

30

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

10

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

V(BR)CES

30

Vdc

Collector Cutoff Current


(VCB= 30 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current


(VEB= 10 Vdc, IC = 0)

IEBO

100

nAdc

Characteristic

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 100 Adc, IB = 0)

Preferred devices are Motorola recommended choices for future use and best overall value.

2624

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA13 MPSA14
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Max

MPSA13
MPSA14

5,000
10,000

MPSA13
MPSA14

10,000
20,000

Characteristic

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 10 mAdc, VCE = 5.0 Vdc)

hFE

(IC = 100 mAdc, VCE = 5.0 Vdc)

Collector Emitter Saturation Voltage


(IC = 100 mAdc, IB = 0.1 mAdc)

VCE(sat)

1.5

Vdc

Base Emitter On Voltage


(IC = 100 mAdc, VCE = 5.0 Vdc)

VBE(on)

2.0

Vdc

fT

125

MHz

SMALL SIGNAL CHARACTERISTICS


CurrentGain Bandwidth Product(2)
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
1. Pulse Test: Pulse Width
2. fT = |hfe| S ftest.

v 300 ms; Duty Cycle v 2.0%.

RS

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2625

MPSA13 MPSA14
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
500

2.0
BANDWIDTH = 1.0 Hz
RS 0
i n, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

200

BANDWIDTH = 1.0 Hz

100
10 A
50
100 A
20
IC = 1.0 mA
10

1.0
0.7
0.5

IC = 1.0 mA

0.3
0.2
100 A

0.1
0.07
0.05

10 A

0.03
0.02
10 20

5.0
10 20

50 100 200

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

50 k 100 k

50 100 200

50 k 100 k

Figure 3. Noise Current

14

200

BANDWIDTH = 10 Hz TO 15.7 kHz


12
BANDWIDTH = 10 Hz TO 15.7 kHz

100

NF, NOISE FIGURE (dB)

VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)

Figure 2. Noise Voltage

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

IC = 10 A

70
50

100 A

30
20

1.0 mA
10

1.0

2.0

10 A
8.0
100 A

6.0
4.0

IC = 1.0 mA

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

Figure 4. Total Wideband Noise Voltage

2626

10

100
0

0
1.0

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

100
0

Figure 5. Wideband Noise Figure

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA13 MPSA14
SMALLSIGNAL CHARACTERISTICS
20
|h fe |, SMALLSIGNAL CURRENT GAIN

4.0
TJ = 25C

C, CAPACITANCE (pF)

10
7.0

Cibo
Cobo

5.0

3.0

2.0
0.04

0.1

0.2
0.4
1.0 2.0 4.0
10
VR, REVERSE VOLTAGE (VOLTS)

20

2.0

1.0
0.8
0.6
0.4

0.2
0.5

40

200 k

hFE, DC CURRENT GAIN

TJ = 125C

25C

30 k
20 k
10 k
7.0 k
5.0 k

55C
VCE = 5.0 V

3.0 k
2.0 k
5.0 7.0

10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

RV, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.4
VBE(sat) @ IC/IB = 1000
1.2
VBE(on) @ VCE = 5.0 V
1.0

0.8
VCE(sat) @ IC/IB = 1000
0.6
20 30
50 70 100 200 300
IC, COLLECTOR CURRENT (mA)

0.5 10 20
50
100 200
IC, COLLECTOR CURRENT (mA)

500

TJ = 25C
2.5
IC = 10 mA

50 mA

250 mA

500 mA

2.0

1.5

1.0

0.5
0.1 0.2

0.5 1.0 2.0 5.0 10 20 50 100 200


IB, BASE CURRENT (A)

500 1000

Figure 9. Collector Saturation Region

1.6

10

2.0

3.0

Figure 8. DC Current Gain

5.0 7.0

1.0

Figure 7. High Frequency Current Gain

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. Capacitance

100 k
70 k
50 k

VCE = 5.0 V
f = 100 MHz
TJ = 25C

500

Figure 10. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.0

2.0

*APPLIES FOR IC/IB hFE/3.0

25C TO 125C

*RqVC FOR VCE(sat)


55C TO 25C

3.0
25C TO 125C
4.0

qVB FOR VBE


5.0

55C TO 25C

6.0
5.0 7.0 10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

Figure 11. Temperature Coefficients

2627

MPSA13 MPSA14

r(t), TRANSIENT THERMAL


RESISTANCE (NORMALIZED)

1.0
0.7
0.5

D = 0.5
0.2

0.3
0.2
0.1

0.05

SINGLE PULSE

0.1
0.07
0.05

SINGLE PULSE
ZJC(t) = r(t) RJC TJ(pk) TC = P(pk) ZJC(t)
ZJA(t) = r(t) RJA TJ(pk) TA = P(pk) ZJA(t)

0.03
0.02
0.01
0.1

0.2

0.5

1.0

2.0

10

5.0

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 12. Thermal Response

IC, COLLECTOR CURRENT (mA)

1.0 k
700
500
300
200

FIGURE A

1.0 ms

tP
TA = 25C

TC = 25C

100 s

PP

1.0 s

100
70
50

t1

30

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

20
10
0.4 0.6

1/f
DUTY CYCLE

1.0
2.0
4.0 6.0
10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 13. Active Region Safe Operating Area

2628

PP

40

+ t1 f + ttP1

PEAK PULSE POWER = PP

Design Note: Use of Transient Thermal Resistance Data

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Chopper Transistor

MPSA17

NPN Silicon

Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Emitter Base Voltage

VEBO

15

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

357

C/W

Thermal Resistance, Junction to Case

RqJC

125

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 0.1 mAdc, IC = 0)

V(BR)EBO

15

Vdc

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

100

nAdc

Characteristic

OFF CHARACTERISTICS

Preferred devices are Motorola recommended choices for future use and best overall value.

(Replaces MPSA16/D)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2629

MPSA17
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

hFE

200

600

VCE(sat)

0.25

Vdc

fT

80

MHz

Cobo

4.0

pF

ON CHARACTERISTICS
DC Current Gain
(IC = 5.0 mAdc, VCE = 10 Vdc)
Collector Emitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 5.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

2630

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA17

h fe , DC CURRENT GAIN

500
TA = 25C
VCE = 10 Vdc

300
200

100
70
50
0.05

0.1

0.2

0.5

1.0

2.0

5.0

10

20

50

IC, COLLECTOR CURRENT (mA)

Figure 1. DC Current Gain

500

1.8
1.6
V, VOLTAGE (VOLTS)

700

400
300
200

1.4
1.2
1.0
0.8

VBE(on)

0.6
0.4
0.2

100
0.1

f T , CURRENTGAIN BANDWIDTH PRODUCT (MHz)

2.0
f = 1.0 kHz
TA = 25C
VCE = 5.0 Vdc

0.3

0.5 0.7 1.0

3.0

0
1.0

5.0 7.0 10

2.0 3.0

5.0

10

20

30

50

IC, COLLECTOR CURRENT (mA)

Figure 2. Small Signal Current Gain

Figure 3. Saturation and On Voltages

10

200

100
70
50
TA = 25C
VCE = 10 Vdc
30
20
0.2

VCE (SAT) @ IC/IB = 10

IC, COLLECTOR CURRENT (mA)

Cob , OUTPUT CAPACITANCE (pF)

h fe , SMALL SIGNAL CURRENT GAIN

1000

100

TA = 25C

7.0

4.0

2.0

1.0
0.5

1.0

2.0

5.0

10

20

0.4

0.7 1.0

2.0

4.0

7.0

10

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. CurrentGain Bandwidth Product

Figure 5. Output Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

20

40

2631

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Low Noise Transistor

MPSA18

NPN Silicon

Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

45

Vdc

Collector Base Voltage

VCBO

45

Vdc

Emitter Base Voltage

VEBO

6.5

Vdc

Collector Current Continuous

IC

200

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case

Max

Unit

RqJA(1)

200

C/W

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage(2)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

45

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

45

Vdc

EmitterBase Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

6.5

Vdc

ICBO

1.0

50

nAdc

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)
1. RJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

2632

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA18
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

400
500
500
500

580
850
1100
1150

1500

0.08

0.2
0.3

Unit

ON CHARACTERISTICS(2)
DC Current Gain
(IC = 10 Adc, VCE = 5.0 Vdc)
(IC = 100 Adc, VCE = 5.0 Vdc)
(IC = 1.0 mAdc, VCE = 5.0 Vdc)
(IC = 10 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.5 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Vdc

Base Emitter On Voltage


(IC = 1.0 mAdc, VCE = 5.0 Vdc)

VBE(on)

0.6

0.7

Vdc

fT

100

160

MHz

CollectorBase Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)

Ccb

1.7

3.0

pF

EmitterBase Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Ceb

5.6

6.5

pF

Noise Figure
(IC = 100 Adc, VCE = 5.0 Vdc, RS = 10 k, f = 1.0 kHz)
(IC = 100 Adc, VCE = 5.0 Vdc, RS = 1.0 k, f = 100 Hz)

NF

0.5
4.0

1.5

Equivalent Short Circuit Noise Voltage


(IC = 100 Adc, VCE = 5.0 Vdc, RS = 1.0 k, f = 100 Hz)

VT

6.5

SMALL SIGNAL CHARACTERISTICS


CurrentGain Bandwidth Product
(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

dB

nV Hz

2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

RS

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2633

MPSA18
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
NOISE VOLTAGE
30

30
BANDWIDTH = 1.0 Hz

BANDWIDTH = 1.0 Hz
20

RS 0

IC = 10 mA

en , NOISE VOLTAGE (nV)

en , NOISE VOLTAGE (nV)

20

3.0 mA

10

1.0 mA

7.0
5.0

RS 0
f = 10 Hz
10

100 Hz

7.0
10 kHz

1.0 kHz

5.0

300 A
3.0
10

20

50 100 200

3.0
0.01 0.02

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

Figure 2. Effects of Frequency

IC = 10 mA
3.0 mA
1.0 mA
300 A
100 A

0.3
0.2
RS 0

0.1
10

20

10 A
50 100 200

10

16

3.0

1.0
0.7
0.5

5.0

20

BANDWIDTH = 1.0 Hz

2.0

0.05 0.1 0.2


0.5 1.0
2.0
IC, COLLECTOR CURRENT (mA)

Figure 3. Effects of Collector Current

NF, NOISE FIGURE (dB)

In, NOISE CURRENT (pA)

10
7.0
5.0

100 kHz

BANDWIDTH = 10 Hz to 15.7 kHz


12
500 A

8.0

IC = 1.0 mA

100 A
10 A

4.0

30 A
0
10

500 1 k 2 k 5 k 10 k 20 k 50 k 100 k
f, FREQUENCY (Hz)

20

Figure 4. Noise Current

50 100 200 500 1 k 2 k


5 k 10 k 20 k 50 k 100 k
RS, SOURCE RESISTANCE (OHMS)

Figure 5. Wideband Noise Figure


100 Hz NOISE DATA
20

BANDWIDTH = 1.0 Hz

IC = 10 mA
16

100 A

100
70
50

3.0 mA
1.0 mA

30

300 A

20
10
7.0
5.0

30 A
10 A

NF, NOISE FIGURE (dB)

VT, TOTAL NOISE VOLTAGE (nV)

300
200

IC = 10 mA

3.0 mA
1.0 mA

12

300 A
8.0
100 A
30 A

4.0

10 A

BANDWIDTH = 1.0 Hz
0

3.0
10

20

50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k


RS, SOURCE RESISTANCE (OHMS)

Figure 6. Total Noise Voltage

2634

10

20

50 100 200 500 1 k 2 k 5 k 10 k 20 k 50 k 100 k


RS, SOURCE RESISTANCE (OHMS)

Figure 7. Noise Figure

Motorola SmallSignal Transistors, FETs and Diodes Device Data

h FE, DC CURRENT GAIN (NORMALIZED)

MPSA18
4.0
3.0
VCE = 5.0 V
2.0

TA = 125C
25C

1.0
55C

0.7
0.5
0.4
0.3
0.2
0.01

0.02

0.03

0.05

0.1

0.2
0.3
0.5
IC, COLLECTOR CURRENT (mA)

1.0

2.0

3.0

5.0

10

Figure 8. DC Current Gain

0.4
RVBE, BASEEMITTER
TEMPERATURE COEFFICIENT (mV/ C)

1.0
TJ = 25C
V, VOLTAGE (VOLTS)

0.8

0.6

VBE @ VCE = 5.0 V

0.4

0.2

0.8

1.2

TJ = 25C to 125C

1.6

2.0
55C to 25C

VCE(sat) @ IC/IB = 10
0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

2.4
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10
IC, COLLECTOR CURRENT (mA)

100

8.0

C, CAPACITANCE (pF)

6.0

TJ = 25C
Cob

4.0
3.0

Ceb

Cib

Ccb

2.0

1.0
0.8
0.1

0.2

1.0
2.0
5.0
0.5
10
20
VR, REVERSE VOLTAGE (VOLTS)

50 100

Figure 10. Temperature Coefficients

50

100

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 9. On Voltages

20

Figure 11. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

500

300
200

100
VCE = 5.0 V
TJ = 25C

70
50
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 12. CurrentGain Bandwidth Product

2635

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistor

MPSA20

NPN Silicon

COLLECTOR
3
2
BASE

1
2

1
EMITTER

CASE 2904, STYLE 1


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

4.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

RqJA(1)

200

C/W

RqJC

83.3

C/W

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(2)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 100 Adc, IC = 0)

V(BR)EBO

4.0

Vdc

ICBO

100

nAdc

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)
1. RqJA is measured with the device soldered into a typical printed circuit board.
2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

2636

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA20
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

hFE

40

400

VCE(sat)

0.25

Vdc

fT

125

MHz

Cobo

4.0

pF

ON CHARACTERISTICS
DC Current Gain(2)
(IC = 5.0 mAdc, VCE = 10 Vdc)
Collector Emitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(2)
(IC = 5.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

EQUIVALENT SWITCHING TIME TEST CIRCUITS


+ 3.0 V
300 ns
DUTY CYCLE = 2%

275

+10.9 V

+ 3.0 V

10 < t1 < 500 s


DUTY CYCLE = 2%

t1

+10.9 V

10 k

0.5 V
<1.0 ns

275
10 k

0
CS < 4.0 pF*

9.1 V

< 1.0 ns

1N916

CS < 4.0 pF*

*Total shunt capacitance of test jig and connectors

Figure 1. TurnOn Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 2. TurnOff Time

2637

MPSA20
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
20

100
BANDWIDTH = 1.0 Hz
RS = 0

50

300 A

10

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

IC = 1.0 mA

100 A

7.0
5.0
10 A
3.0

20

300 A
100 A

10
5.0
2.0
1.0
30 A

0.5

30 A

BANDWIDTH = 1.0 Hz
RS

IC = 1.0 mA

10 A

0.2
2.0

0.1
10

20

50

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

10

20

50

Figure 3. Noise Voltage

100 200
500 1 k
f, FREQUENCY (Hz)

2k

5k

10 k

Figure 4. Noise Current

NOISE FIGURE CONTOURS


(VCE = 5.0 Vdc, TA = 25C)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k

RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

500 k

20 k
10 k
5k

2.0 dB

2k
1k
500

3.0 dB 4.0 dB
6.0 dB

10 dB

200
100
50

1M
500 k

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

1.0 dB

5k

2.0 dB

2k
1k
500

5.0 dB

200
100
10

20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

8.0 dB
10

20

Figure 5. Narrow Band, 100 Hz

500 k
RS , SOURCE RESISTANCE (OHMS)

3.0 dB

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700

1k

Figure 6. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is defined as:

20 k
10 k
5k

NF
1.0 dB

2k
1k
500

3.0 dB
5.0 dB
8.0 dB
10

20

30

50 70 100

200 300

500 700

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

2.0 dB

200
100
50

+ 20 log10

1k

IC, COLLECTOR CURRENT (A)

Figure 7. Wideband
2638

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA20
TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C

25C

200

55C
100
80
MPSA20
VCE = 1.0 V
VCE = 10 V

60
40
0.004 0.006 0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3
0.5 0.7 1.0
2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0 10

20

30

50

70 100

100

1.0
MPSA20
TJ = 25C

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 8. DC Current Gain

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%

300 A
200 A
40
100 A
20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
VBE(sat) @ IC/IB = 10

0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.2

2.0
5.0
10
20
0.5 1.0
IC, COLLECTOR CURRENT (mA)

40

Figure 10. Collector Characteristics

1.4

0.1

400 A

60

Figure 9. Collector Saturation Region

0.8

IB = 500 A

50

100

Figure 11. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6

*APPLIES for IC/IB hFE/2

0.8
25C to 125C
0

*qVC for VCE(sat)


55C to 25C

0.8
25C to 125C
1.6

qVB for VBE


2.4
0.1

0.2

55C to 25C

0.5
1.0 2.0
5.0 10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 12. Temperature Coefficients

2639

MPSA20
TYPICAL DYNAMIC CHARACTERISTICS
1000
VCC = 3.0 V
IC/IB = 10
TJ = 25C

100
70
50

700
500

ts

300
200
t, TIME (ns)

t, TIME (ns)

300
200

tr

30
20
td @ VBE(off) = 0.5 Vdc

10
7.0
5.0

100
70
50

tf

30

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

20

3.0
1.0

2.0

50 70

20 30
5.0 7.0 10
3.0
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0

3.0

500

70 100

10
TJ = 25C
f = 100 MHz

TJ = 25C
f = 1.0 MHz

7.0

300
VCE = 20 V
200

5.0 V

100

Cib

5.0

Cob
3.0
2.0

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.2

0.5

1.0

2.0

5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 15. CurrentGain Bandwidth Product

Figure 16. Capacitance

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

3.0
2.0
1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

MPSA20
hfe 200 @ IC = 1.0 mA

7.0
5.0

0.2
0.1

10

20

50

200

10

100
70
50

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C
MPSA20
hfe 200 @ IC = 1.0 mA

30
20
10
7.0
5.0
3.0

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

Figure 17. Input Impedance

2640

0.1

IC, COLLECTOR CURRENT (mA)

20
hie , INPUT IMPEDANCE (k )

50

Figure 14. TurnOff Time

C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 13. TurnOn Time

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

50

100

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 18. Output Admittance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

MPSA20
1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19A

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

t2

1.0

2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 19. Thermal Response

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 Vdc

A train of periodical power pulses can be represented by the model


as shown in Figure 19A. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 19 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 19 by the
steady state value RJA.

103
102

ICEO

101

Example:
Dissipating 2.0 watts peak under the following conditions:
t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.

ICBO
AND
ICEX @ VBE(off) = 3.0 Vdc

100
101
102

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

The peak rise in junction temperature is therefore


T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.
For more information, see AN569.

Figure 19A.

IC, COLLECTOR CURRENT (mA)

400
1.0 ms

200
100
60
40

TC = 25C

dc
dc
TJ = 150C

10

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

6.0
2.0

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 20 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 19. At high case or ambient temperatures, thermal
limitations will reduce the power that can be handled to values less
than the limitations imposed by second breakdown.

10 s
1.0 s

TA = 25C

20

4.0

100 s

4.0
6.0 8.0 10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

40

Figure 20.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2641

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Darlington Transistor

MPSA27

NPN Silicon

COLLECTOR 3
BASE
2

EMITTER 1
1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

MPSA27

Unit

Collector Emitter Voltage

VCES

60

Vdc

Emitter Base Voltage

VEBO

10

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

625
5.0

mW
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

RqJA

200

C/W

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 100 Adc, VBE = 0)

V(BR)CES

60

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Collector Cutoff Current


(VCB = 30 V, IE = 0)
(VCB = 40 V, IE = 0)
(VCB = 50 V, IE = 0)

ICBO

100

nAdc

Collector Cutoff Current


(VCE = 30 V, VBE = 0)
(VCE = 40 V, VBE = 0)
(VCE = 50 V, VBE = 0)

ICES

500

nAdc

Emitter Cutoff Current


(VEB = 10 Vdc)

IEBO

100

nAdc

Characteristic

OFF CHARACTERISTICS

2642

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA27
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

10,000
10,000

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 10 mA, VCE = 5.0 V)
(IC = 100 mA, VCE = 5.0 V)

hFE

Collector Emitter Saturation Voltage


(IC = 100 mA, IB = 0.1 mAdc)

VCE(sat)

1.5

Vdc

Base Emitter On Voltage


(IC = 100 mA, VCE = 5.0 Vdc)

VBE(on)

2.0

Vdc

hfe

1.25

2.4

SMALL SIGNAL CHARACTERISTICS


Small Signal Current Gain
(IC = 10 mA, VCE = 5.0 V, f = 100 MHz)
1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2643

MPSA27
VCE = 5.0 V

TA = 25C

40

VBE(S) @ IC/IB = 1.0 k

1.4
1.2

VBE(ON) @ VCE = 5.0 V

1.0
0.8

20

TA = 55C

0
1.0

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

V, VOLTAGE (VOLTS)

80
60

TA = 25C

1.6

TA = 125C

100

2.0 3.0

10

100

20 30

200

500

1k

10

20 30

100

200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 1. DC Current Gain

Figure 2. ON Voltages

500

1k

4.0

1.5
TA = 25C

1.3
1.2
IC = 500 mA

1.1
1.0
0.9

2.0 3.0

1.0

1.6

1.4

VCE(S) @ IC/IB = 1.0 k

0.6

hfe , SMALLSIGNAL CURRENT GAIN

h FE , DC CURRENT GAIN (k)

120

IC = 250 mA

IC = 100 mA
IC = 10 mA

0.8
0.7

VCE = 5.0 V
f = 100 MHz
TA = 25C

2.0

1.0
0.8
0.6
0.4
0.2

0.1 0.2

0.5 1.0 2.0

5.0 10

20

50 100 200

500 1 k

0.5

1.0

5.0

2.0

10

20

50

100

200

IB, BASE CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 3. Collector Saturation Region

Figure 4. High Frequency Current Gain

I C , COLLECTOR CURRENT (mA)

1k

500

100 ms

1.0 ms

500
1.0 s
200
TC = 25C

TA = 25C
100
50

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

20
10
1.0

2.0

4.0

6.0

10

20

40 50 60

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 5. Active Region Safe Operating Area

2644

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Darlington Transistors

MPSA28
MPSA29*

NPN Silicon

COLLECTOR 3

*Motorola Preferred Device

BASE
2

EMITTER 1

MAXIMUM RATINGS
Rating

Symbol

MPSA28

MPSA29

Unit

Collector Emitter Voltage

VCES

80

100

Vdc

Collector Base Voltage

VCBO

80

100

Vdc

Emitter Base Voltage

VEBO

12

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

80
100

80
100

12

100
100

500
500

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 100 Adc, VBE = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CES
MPSA28
MPSA29

Vdc

V(BR)CBO
MPSA28
MPSA29

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 60 Vdc, IE = 0)
(VCB = 80 Vdc, IE = 0)

MPSA28
MPSA29

Collector Cutoff Current


(VCE = 60 Vdc, VBE = 0)
(VCE = 80 Vdc, VBE = 0)

MPSA28
MPSA29

Vdc

ICBO

nAdc

ICES

Emitter Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

Vdc

nAdc

nAdc

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2645

MPSA28 MPSA29
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

10,000
10,000

0.7
0.8

1.2
1.5

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 10 mAdc, VCE = 5.0 Vdc)
(IC = 100 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.01 mAdc)
(IC = 100 mAdc, IB = 0.1 mAdc)

VCE(sat)

Vdc

Base Emitter On Voltage


(IC = 100 mAdc, VCE = 5.0 Vdc)

VBE(on)

1.4

2.0

Vdc

fT

125

200

MHz

Cobo

5.0

8.0

pF

SMALL SIGNAL CHARACTERISTICS


CurrentGain Bandwidth Product(2)
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width
2. fT = hfe S ftest.

2646

v 300 ms, Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA28 MPSA29

200

1.8
VBE(S) @ IC/IB = 1.0 k

TA = 125C

V, VOLTAGE (VOLTS)

h FE , DC CURRENT GAIN (k)

VCE = 5.0 V

100
50

TA = 25C

20

TA = 55C

10
5.0

2.0

5.0

10

20

100

50

200

500

10

20

100

50

200

1k

500

2.4
VCE , COLLECTOR VOLTAGE (VOLTS)

qV, TEMPERATURE COEFFICIENT (mV/ C)

5.0

Figure 2. ON Voltages

55C to 25C

2.0

3.0

25C to 125C
55C to 25C

4.0

qVB for VBE

TA = 25C
2.0
IC = 500 mA
1.6

1.2

IC = 100 mA

IC = 10 mA

IC = 250 mA

0.8

0.4
2.0

5.0

10

20

100

50

200

0.2

500

1.0 2.0

10

20

100 200

1 k 1.5 k

IC, COLLECTOR CURRENT (mA)

IB, BASE CURRENT (mA)

Figure 3. Temperature Coefficients

Figure 4. Collector Saturation Region

1k

10

500

1.0 ms

h fe , HIGH FREQUENCY CURRENT GAIN

I C , COLLECTOR CURRENT (mA)

2.0

Figure 1. DC Current Gain

qVC for VCE(S)

100 ms

1.0 s

200

TC = 25C

TA = 25C
100

10
1.0

VCE(S) @ IC/IB = 1.0 k

IC, COLLECTOR CURRENT (mA)

1.0

20

1.0

IC, COLLECTOR CURRENT (mA)

25C to 125C

50

VBE(ON) @ VCE = 5.0 V

1.2

0.6
1.0

1k

5.0
1.0

TA = 25C
1.4

0.8

2.0
1.0
1.0

1.6

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
MPSA28
VALID FOR DUTY CYCLE 10%
MPSA29

2.0

5.0

10

20

5.0
VCE = 5.0 V
TA = 25C
f = 100 MHz

2.0
1.0
0.5

0.2
0.1

50

100

0.3 0.5

1.0

2.0

5.0

10

20

50

100

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 5. Active Region Safe Operating


Area

Figure 6. High Frequency Current Gain

Motorola SmallSignal Transistors, FETs and Diodes Device Data

200 300

2647

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistors

MPSA42*
MPSA43

NPN Silicon

*Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER

MAXIMUM RATINGS

Rating

Symbol

MPSA42

MPSA43

Unit

Collector Emitter Voltage

VCEO

300

200

Vdc

Collector Base Voltage

VCBO

300

200

Vdc

Emitter Base Voltage

VEBO

6.0

6.0

CASE 2904, STYLE 1


TO92 (TO226AA)

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/mW

Thermal Resistance, Junction to Case

RqJC

83.3

C/mW

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

300
200

300
200

6.0

0.1
0.1

0.1
0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
MPSA42
MPSA43
V(BR)CBO
MPSA42
MPSA43

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCB = 200 Vdc, IE = 0)
(VCB = 160 Vdc, IE = 0)

MPSA42
MPSA43

Emitter Cutoff Current


(VEB = 6.0 Vdc, IC = 0)
(VEB = 4.0 Vdc, IC = 0)

MPSA42
MPSA43

1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Vdc

Vdc

Vdc
Adc

ICBO

Adc

IEBO

Preferred devices are Motorola recommended choices for future use and best overall value.

2648

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA42 MPSA43
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

25
40
40

0.5
0.4

VBE(sat)

0.9

Vdc

fT

50

MHz

3.0
4.0

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)
Collector Emitter Saturation Voltage
(IC = 20 mAdc, IB = 2.0 mAdc)

hFE

VCE(sat)
MPSA42
MPSA43

BaseEmitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Ccb
MPSA42
MPSA43

pF

2649

MPSA42 MPSA43
200

hFE, DC CURRENT GAIN

VCE = 10 Vdc
TJ = +125C

100

25C
50
55C
30
20
1.0

2.0

3.0

5.0

7.0
10
IC, COLLECTOR CURRENT (mA)

20

30

50

100

70

100

C, CAPACITANCE (pF)

50
Ceb

20
10
5.0

Ccb

2.0
1.0
0.2

0.5

1.0 2.0
5.0 10
20
50
VR, REVERSE VOLTAGE (VOLTS)

100

200

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 1. DC Current Gain

100
70
50

30
20

10
1.0

Figure 2. Capacitances

IC, COLLECTOR CURRENT (mA)

V, VOLTAGE (VOLTS)

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

500
TJ = 25C

1.2
1.0
0.8

VBE(sat) @ IC/IB = 10

0.6

VBE(on) @ VCE = 10 V

0.4
0.2

VCE(sat) @ IC/IB = 10
2.0

3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

Figure 4. On Voltages

2650

2.0

Figure 3. CurrentGain Bandwidth Product

1.4

0
1.0

TJ = 25C
VCE = 20 V
f = 20 MHz

50

70 100

200
100

10 s

100 s

TA = 25C

1.0 ms

TC = 25C

50

100 ms

20
CURRENT LIMIT
THERMAL LIMIT
(PULSE CURVES @ TC = 25C)
SECOND BREAKDOWN LIMIT

10
5.0
2.0
1.0

CURVES APPLY
BELOW RATED VCEO

0.5
0.5

1.0

2.0

5.0

10

20

MPSA43
MPSA42
50
100

200

500

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 5. Maximum Forward Bias


Safe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistor

MPSA44

NPN Silicon

Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

400

Vdc

Collector Base Voltage

VCBO

500

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

300

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

400

Vdc

Collector Emitter Breakdown Voltage


(IC = 100 Adc, VBE = 0)

V(BR)CES

500

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

500

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

6.0

Vdc

Collector Cutoff Current


(VCB = 400 Vdc, IE = 0)

ICBO

0.1

Adc

Collector Cutoff Current


(VCE = 400 Vdc, VBE = 0)

ICES

500

nAdc

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

0.1

Adc

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2651

MPSA44
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

40
50
45
40

200

0.4
0.5
0.75

Unit

ON CHARACTERISTICS(1)
DC Current Gain(1)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 50 mAdc, VCE = 10 Vdc)
(IC = 100 mAdc, VCE = 10 Vdc)

hFE

Collector Emitter Saturation Voltage(1)


(IC = 1.0 mAdc, IB = 0.1 mAdc)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VBE(sat)

0.75

Vdc

Output Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)

Cobo

7.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

130

pF

hfe

1.0

Vdc

SMALL SIGNAL CHARACTERISTICS

SmallSignal Current Gain


(IC = 10 mAdc, VCE = 10 Vdc, f = 20 MHz)
1. Pulse Test: Pulse Width

2652

v 300 ms, Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

160
TA = 125C

hFE, DC CURRENT GAIN

140
120

VCE = 10 V

100
25C

80
60
40

55C
20
1.0

100
5.0
10
20
50
IC, COLLECTOR CURRENT (mA)

2.0

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

MPSA44

200 300

0.5

0.4

IC = 1.0 mA

IC = 10 mA

0.3
TA = 25C
0.2

0.1

0
10

Figure 1. DC Current Gain

30

100

10 k

50 k

1000
TA = 25C
IC, COLLECTOR CURRENT (mA)

1.0 ms
VBE(sat) @ IC/IB = 10

0.8
V, VOLTAGE (VOLTS)

300
1.0 k 3.0 k
IB, BASE CURRENT (A)

Figure 2. Collector Saturation Region

1.0

0.6

VBE(on) @ VCE = 10 V

0.4

VCE(sat) @ IC/IB = 10

0.2

300
200

30
3.0
10
1.0
IC, COLLECTOR CURRENT (mA)

0.3

100

10

Figure 3. On Voltages

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
VALID FOR DUTY CYCLE 10%
2.0

MPSA44

20
50
10
100
5.0
VCE, COLLECTOR VOLTAGE (VOLTS)

200

500

10
|h fe |, SMALLSIGNAL CURRENT GAIN

Cib

50
20

Cob

5.0
TA = 25C
f = 1.0 MHz

2.0
1.0
0.3 0.5

1.0 s

Figure 4. Active Region Safe Operating Area

100

10

100 s

20

1.0
1.0

300

TC = 25C

TA = 25C

100

2.0
0
0.1

C, CAPACITANCE (pF)

IC = 50 mA

1.0

3.0
10
30
REVERSE BIAS (VOLTS)

100

300

Figure 5. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

3.0

VCE = 10 V
f = 10 MHz
TA = 25C

2.0
1.5
1.0
0.1

0.2 0.3

1.0
3.0
10
IC, COLLECTOR CURRENT (mA)

30

100

Figure 6. High Frequency Current Gain

2653

MPSA44
10

Vin
+9.7 V

t, TIME ( s)

5.0

PW = 50 S
DUTY CYCLE = 2.0%

2.0
0

1.0

4.0 V

0.5

0.2
0.1
1.0

VCC = 150 V
IC/IB = 10
TA = 25C
VBE(off) = 4.0 Vdc

VCC

tr

RL

td

3.0
10
30
IC, COLLECTOR CURRENT (mA)

50

Vout

100
Vin

RB
CS 4.0 pF*

Figure 7. TurnOn Switching Times and Test Circuit

10

Vin

5.0

+10.7 V

t, TIME ( s)

ts

PW = 50 S
DUTY CYCLE = 2.0%

2.0
1.0
0.5

0.2

tf

VCC = 150 V
IC/IB = 10
TA = 25C

11.4 V
VCC
RL

0.1
1.0

3.0

10
30
IC, COLLECTOR CURRENT (mA)

50

100

Vout
Vin

RB
CS 4.0 pF*

Figure 8. TurnOff Switching Times and Test Circuit


* Total Shunt Capacitance or Test Jig and Connectors.

2654

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Darlington Transistors

MPSA62
MPSA63
MPSA64 *

PNP Silicon

COLLECTOR 3

MPSA55, MPSA56

BASE
2

For Specifications,
See MPSA05, MPSA06 Data

*Motorola Preferred Device

EMITTER 1

MAXIMUM RATINGS
Symbol

MPSA62

MPSA63
MPSA64

Unit

Collector Emitter Voltage

VCES

20

30

Vdc

Collector Base Voltage

VCBO

20

30

Vdc

Emitter Base Voltage

VEBO

10

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

Rating

Operating and Storage Junction


Temperature Range

1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

20
30

100
100

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 100 Adc, VBE = 0)
Collector Cutoff Current
(VCB= 15 Vdc, IE = 0)
(VCB = 30 Vdc, IE = 0)

V(BR)CES
MPSA62
MPSA63, MPSA64

Vdc

ICBO
MPSA62
MPSA63, MPSA64

Emitter Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

nAdc

nAdc

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2655

MPSA62 MPSA63 MPSA64


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

MPSA63
MPSA64
MPSA62

5,000
10,000
20,000

MPSA63
MPSA64

10,000
20,000

1.0
1.5

1.4
2.0

125

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 10 mAdc, VCE = 5.0 Vdc)

(IC = 100 mAdc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 0.01 mAdc)
(IC = 100 mAdc, IB = 0.1 mAdc)

MPSA62
MPSA63, MPSA64

Base Emitter On Voltage


(IC = 10 mAdc, VCE = 5.0 Vdc)
(IC = 100 mAdc, VCE = 5.0 Vdc)

MPSA62
MPSA63, MPSA64

VCE(sat)

Vdc

VBE(on)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(2)
(IC = 100 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
1. Pulse Test: Pulse Width
2. fT = |hfe| S ftest.

2656

v 300 ms; Duty Cycle v 2.0%.

fT

MHz

MPSA63, MPSA64

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA62 MPSA63 MPSA64


hFE , DC CURRENT GAIN (X1.0 K)

200
TA = 125C

100
70
50

10 V

30

25C
VCE = 2.0 V
5.0 V

20
10
7.0
5.0

55C

3.0
2.0
0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

20

30

50

70

100

200

300

IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

2.0
TA = 25C
VBE(sat) @ IC/IB = 100

V, VOLTAGE (VOLTS)

1.6

1.2
VBE(on) @ VCE = 5.0 V
0.8

VCE(sat) @ IC/IB = 1000


IC/IB = 100

0.4

0
0.3 0.5

1.0

2 3 5
10 20 30 50
IC, COLLECTOR CURRENT (mA)

100 200 300

2.0
TA = 25C
1.8
1.6
1.4

IC = 10 mA 50 mA 100 mA 175 mA

1.2
1.0
0.8
0.6
0.10.2 0.5 1 2

Figure 2. On Voltage

1000
VCE = 5.0 V
f = 100 MHz
TA = 25C

IC, COLLECTOR CURRENT (mA)

|h FE |, HIGH FREQUENCY CURRENT GAIN

5 10 20 50 100200500 1K2K 5K10K


IB, BASE CURRENT (A)

Figure 3. Collector Saturation Region

10

4.0
3.0
2.0

300 mA

1.0
0.4
0.2
0.1
1.0 2.0

5.0

10

20

50

100 200

500

1K

100 s

1.0 ms
300
200
100
50
20
10
1.0

TA = 25C

1.0 s

TC = 25C
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
(DUTY CYCLE 10%) MPSA62
MPSA63
2.0

4.0 6.0

10

20

40 60

IC, COLLECTOR CURRENT (mA)

VCE, COLLECTOR VOLTAGE (VOLTS)

Figure 4. High Frequency Current Gain

Figure 5. Active Region, Safe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2657

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistor

MPSA70

PNP Silicon

COLLECTOR
3
2
BASE
1
EMITTER
1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

Collector Current Continuous

IC

100

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Emitter Base Breakdown Voltage


(IE = 100 Adc, IC = 0)

V(BR)EBO

4.0

Vdc

ICBO

100

nAdc

Characteristic

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)
1. Pulse Test: Pulse Width

2658

v 300 ms; Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA70
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

DC Current Gain
(IC = 5.0 mAdc, VCE = 10 Vdc)

hFE

40

400

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)

VCE(sat)

0.25

Vdc

fT

125

MHz

Cobo

4.0

pF

ON CHARACTERISTICS

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 5.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2659

MPSA70
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
10
7.0
IC = 10 A

5.0

In, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

1.0
7.0
5.0

BANDWIDTH = 1.0 Hz
RS 0

30 A
3.0

100 A
300 A

1.0 mA

2.0

BANDWIDTH = 1.0 Hz
RS
IC = 1.0 mA

3.0
2.0

300 A

1.0
0.7
0.5

100 A
30 A

0.3
0.2

1.0

10 A

0.1
10

20

50

100 200
500 1.0 k
f, FREQUENCY (Hz)

2.0 k

5.0 k

10

10 k

20

50

Figure 1. Noise Voltage

100 200
500 1.0 k 2.0 k
f, FREQUENCY (Hz)

5.0 k

10 k

Figure 2. Noise Current

NOISE FIGURE CONTOURS

1.0 M
500 k

BANDWIDTH = 1.0 Hz
RS , SOURCE RESISTANCE (OHMS)

RS , SOURCE RESISTANCE (OHMS)

(VCE = 5.0 Vdc, TA = 25C)

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100
20

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

BANDWIDTH = 1.0 Hz

200 k
100 k
50 k
20 k
10 k

0.5 dB

5.0 k

1.0 dB

2.0 k
1.0 k
500

2.0 dB
3.0 dB

200
100

5.0 dB
10

1.0 M
500 k

500 700 1.0 k

5.0 dB
10

20

RS , SOURCE RESISTANCE (OHMS)

Figure 3. Narrow Band, 100 Hz

1.0 M
500 k

30

50 70 100
200 300
IC, COLLECTOR CURRENT (A)

500 700 1.0 k

Figure 4. Narrow Band, 1.0 kHz

10 Hz to 15.7 kHz

200 k
100 k
50 k

Noise Figure is Defined as:

20 k
10 k

NF
0.5 dB
1.0 dB
2.0 dB
3.0 dB
5.0 dB

200
100
10

20

30

50 70 100

200 300

en2

) 4KTRS ) In 2RS2 12
4KTRS

en = Noise Voltage of the Transistor referred to the input. (Figure 3)


In = Noise Current of the Transistor referred to the input. (Figure 4)
K = Boltzmans Constant (1.38 x 1023 j/K)
T = Temperature of the Source Resistance (K)
RS = Source Resistance (Ohms)

5.0 k
2.0 k
1.0 k
500

+ 20 log10

500 700 1.0 k

IC, COLLECTOR CURRENT (A)

Figure 5. Wideband
2660

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA70
TYPICAL STATIC CHARACTERISTICS

h FE, DC CURRENT GAIN

400

TJ = 125C
25C

200

55C
100
80
MPSA70
VCE = 1.0 V
VCE = 10 V

60
40
0.003 0.005

0.01

0.02 0.03

0.05 0.07 0.1

0.2 0.3 0.5 0.7 1.0


2.0
IC, COLLECTOR CURRENT (mA)

3.0

5.0 7.0

10

20

30

50 70 100

100

1.0
TA = 25C
MPSA70

IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. DC Current Gain

0.8
IC = 1.0 mA

0.6

10 mA

50 mA

100 mA

0.4

0.2

0
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
IB, BASE CURRENT (mA)

TA = 25C
PULSE WIDTH = 300 s
80 DUTY CYCLE 2.0%
300 A

200 A
150 A

40

100 A
50 A

20

0
5.0 10

20

5.0
10
15
20
25
30
35
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

V, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.2
1.0
0.8
VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.5 1.0
2.0
5.0
10
20
IC, COLLECTOR CURRENT (mA)

40

Figure 8. Collector Characteristics

1.4

0.2

250 A

60

Figure 7. Collector Saturation Region

0.1

IB = 400 A
350 A

50

100

Figure 9. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.6
*APPLIES for IC/IB hFE/2
0.8
*qVC for VCE(sat)

25C to 125C

0
55C to 25C
0.8
25C to 125C
1.6

2.4
0.1

qVB for VBE


0.2

55C to 25C

0.5
1.0 2.0
5.0
10 20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 10. Temperature Coefficients

2661

MPSA70
TYPICAL DYNAMIC CHARACTERISTICS
500
300
200

200

100
70
50
30
tr

20
10
7.0
5.0
1.0

100
70
50

tf

30

td @ VBE(off) = 0.5 V

20

2.0

3.0

50 70

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

10
1.0

100

2.0 3.0 5.0 7.0 10


20 30
IC, COLLECTOR CURRENT (mA)

50 70 100

Figure 12. TurnOff Time

500

10
TJ = 25C

TJ = 25C

7.0
VCE = 20 V

300

Cib
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 11. TurnOn Time

5.0 V
200

100

5.0

3.0
2.0

Cob

70
50
0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

1.0
0.05

50

0.2

0.5

1.0

2.0

5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 13. CurrentGain Bandwidth Product

Figure 14. Capacitance

3.0

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C

2.0
1.0
0.7
0.5
0.3

hoe, OUTPUT ADMITTANCE (m mhos)

MPSA70
hfe 200
@ IC = 1.0 mA

7.0
5.0

0.2
0.1

10

20

50

200

10

100
70
50
30
20

VCE = 10 Vdc
f = 1.0 kHz
TA = 25C
MPSA70
hfe 200
@ IC = 1.0 mA

10
7.0
5.0
3.0

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

Figure 15. Input Impedance

2662

0.1

IC, COLLECTOR CURRENT (mA)

20
hie , INPUT IMPEDANCE (k )

VCC = 3.0 V
IC/IB = 10
IB1 = IB2
TJ = 25C

ts

300
t, TIME (ns)

t, TIME (ns)

1000
700
500

VCC = 3.0 V
IC/IB = 10
TJ = 25C

50

100

2.0
0.1

0.2

0.5

20
1.0 2.0
5.0
10
IC, COLLECTOR CURRENT (mA)

50

100

Figure 16. Output Admittance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

r(t) TRANSIENT THERMAL RESISTANCE


(NORMALIZED)

MPSA70
1.0
0.7
0.5

D = 0.5

0.3

0.2

0.2
0.1

0.1
0.07
0.05

FIGURE 19

0.05
P(pk)

0.02
0.03
0.02

t1

0.01

0.01
0.01 0.02

SINGLE PULSE

0.05

0.1

0.2

0.5

1.0

t2
2.0

5.0

10

20
50
t, TIME (ms)

100 200

DUTY CYCLE, D = t1/t2


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN569)
ZJA(t) = r(t) RJA
TJ(pk) TA = P(pk) ZJA(t)

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

Figure 17. Thermal Response

IC, COLLECTOR CURRENT (mA)

400
200

100 s

100

TC = 25C
dc

60

1.0 s

TA = 25C

40

dc

20

TJ = 150C

10

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

6.0
4.0

10 s

1.0 ms

4.0
6.0 8.0 10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

2.0

The safe operating area curves indicate ICVCE limits of the


transistor that must be observed for reliable operation. Collector load
lines for specific circuits must fall below the limits indicated by the
applicable curve.
The data of Figure 18 is based upon TJ(pk) = 150C; TC or TA is
variable depending upon conditions. Pulse curves are valid for duty
cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from
the data in Figure 17. At high case or ambient temperatures, thermal
limitations will reduce the power than can be handled to values less
than the limitations imposed by second breakdown.

40

Figure 18. ActiveRegion Safe Operating Area

104

DESIGN NOTE: USE OF THERMAL RESPONSE DATA

IC, COLLECTOR CURRENT (nA)

VCC = 30 V

101

A train of periodical power pulses can be represented by the model


as shown in Figure 19. Using the model and the device thermal
response the normalized effective transient thermal resistance of
Figure 17 was calculated for various duty cycles.
To find ZJA(t), multiply the value obtained from Figure 17 by the
steady state value RJA.
Example:
Dissipating 2.0 watts peak under the following conditions:
t1 = 1.0 ms, t2 = 5.0 ms (D = 0.2)
Using Figure 17 at a pulse width of 1.0 ms and D = 0.2, the reading of
r(t) is 0.22.

102

The peak rise in junction temperature is therefore


T = r(t) x P(pk) x RJA = 0.22 x 2.0 x 200 = 88C.

103
ICEO

102
101

ICBO
AND
ICEX @ VBE(off) = 3.0 V

100

4
0

2
0

+ 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160


TJ, JUNCTION TEMPERATURE (C)

For more information, see AN569.

Figure 19. Typical Collector Leakage Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2663

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Darlington Transistors

MPSA75
MPSA77

PNP Silicon

COLLECTOR 3
BASE
2

EMITTER 1

MAXIMUM RATINGS

Rating

Symbol

MPSA75

MPSA77

Unit

Collector Emitter Voltage

VCES

40

60

Vdc

Emitter Base Voltage

VEBO

10

Collector Current Continuous

IC

500

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

TJ, Tstg

55 to +150

Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

Vdc

THERMAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 100 Adc, VBE = 0)

MPSA75
MPSA77

V(BR)CES

40
60

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

MPSA75
MPSA77

V(BR)CBO

40
60

Vdc

Collector Cutoff Current


(VCB= 30 V, IE = 0)
(VCB = 50 V, IE = 0)

MPSA75
MPSA77

100
100

Collector Cutoff Current


(VCE = 30 V, VBE = 0)
(VCE = 50 V, VBE = 0)

MPSA75
MPSA77

500
500

100

10,000
10,000

VCE(sat)

1.5

Vdc

VBE

2.0

Vdc

|hfe|

1.25

2.4

ICBO

nAdc

ICES

Emitter Cutoff Current (VEB = 10 Vdc)

IEBO

nAdc

nAdc

ON CHARACTERISTICS
DC Current Gain
(IC = 10 mA, VCE = 5.0 V)
(IC = 100 mA, VCE = 5.0 V)

hFE

Collector Emitter Saturation Voltage (IC = 100 mA, IB = 0.1 mAdc)


Base Emitter On Voltage (IC = 100 mA, VCE = 5.0 Vdc)

SMALL SIGNAL CHARACTERISTICS


Current Gain High Frequency (IC = 10 mA, VCE = 5.0 V, f = 100 MHz)

2664

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA75 MPSA77
hFE , DC CURRENT GAIN (X1.0 K)

200
TA = 125C

100
70
50

10 V

30

25C
VCE = 2.0 V
5.0 V

20
10
7.0
5.0

55C

3.0
2.0
0.3

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

20

30

50

70

100

200

300

IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

2.0
TA = 25C
VBE(sat) @ IC/IB = 100

V, VOLTAGE (VOLTS)

1.6

1.2
VBE(on) @ VCE = 5.0 V
0.8

VCE(sat) @ IC/IB = 1000


IC/IB = 100

0.4

0
0.3 0.5

1.0

2 3 5
10 20 30 50
IC, COLLECTOR CURRENT (mA)

100 200 300

2.0
TA = 25C
1.8
1.6
1.4

IC = 10 mA 50 mA 100 mA 175 mA

1.2
1.0
0.8
0.6
0.10.2 0.5 1 2

Figure 2. On Voltage

1000
VCE = 5.0 V
f = 100 MHz
TA = 25C

IC, COLLECTOR CURRENT (mA)

|h FE |, HIGH FREQUENCY CURRENT GAIN

5 10 20 50 100200500 1K2K 5K10K


IB, BASE CURRENT (A)

Figure 3. Collector Saturation Region

10

4.0
3.0
2.0

300 mA

1.0
0.4
0.2
0.1
1.0 2.0

5.0

10

20

50

100 200

500

1K

100 s

1.0 ms
300
200
100
50
20
10
1.0

TA = 25C

1.0 s

TC = 25C
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
(DUTY CYCLE 10%) MPSA75
MPSA77
2.0

4.0 6.0

10

20

40 60

IC, COLLECTOR CURRENT (mA)

VCE, COLLECTOR VOLTAGE (VOLTS)

Figure 4. High Frequency Current Gain

Figure 5. Active Region, Safe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2665

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistors

MPSA92*
MPSA93

PNP Silicon

COLLECTOR
3

*Motorola Preferred Device

2
BASE
1
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

MPSA92

MPSA93

Unit

Collector Emitter Voltage

VCEO

300

200

Vdc

Collector Base Voltage

VCBO

300

200

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 1


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

300
200

300
200

5.0

0.25
0.25

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
MPSA92
MPSA93
V(BR)CBO
MPSA92
MPSA93

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 200 Vdc, IE = 0)
(VCB = 160 Vdc, IE = 0)

V(BR)EBO

Vdc

IEBO

Vdc
Adc

ICBO
MPSA92
MPSA93

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)
1. Pulse Test: Pulse Width

Vdc

Adc

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

2666

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSA92 MPSA93
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

Both Types
Both Types

25
40

MPSA92
MPSA93

25
25

0.5
0.4

VBE(sat)

0.9

Vdc

fT

50

MHz

6.0
8.0

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)
Collector Emitter Saturation Voltage
(IC = 20 mAdc, IB = 2.0 mAdc)

hFE

VCE(sat)
MPSA92
MPSA93

BaseEmitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Ccb
MPSA92
MPSA93

Motorola SmallSignal Transistors, FETs and Diodes Device Data

pF

2667

MPSA92 MPSA93
150

TJ = +125C

VCE = 10 Vdc

hFE, DC CURRENT GAIN

100
+25C
70
55C

50

30
20
15
1.0

2.0

3.0

5.0

7.0

10

20

30

50

80

100

IC, COLLECTOR CURRENT (mA)

100
50
C, CAPACITANCE (pF)

Cib
20
10
5.0

2.0
Ccb
1.0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100200 500 1000
VR, REVERSE VOLTAGE (VOLTS)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 1. DC Current Gain

100
TJ = 25C
VCE = 20 Vdc

80
60
40
30
20

0
1.0

Figure 2. Capacitances

2.0

5.0
10
20
IC, COLLECTOR CURRENT (mA)

50

100

Figure 3. CurrentGain Bandwidth Product

1.0

500

100 s

IC, COLLECTOR CURRENT (mA)

1.0 ms

V, VOLTAGE (VOLTS)

0.8
VBE @ VCE = 10 V
0.6

0.4

0.2

0
1.0

VCE(sat) @ IC/IB = 10 mA

2.0

5.0
10
20
IC, COLLECTOR CURRENT (mA)

Figure 4. On Voltages

2668

50

100

1.0 s

200
100

MPSA93
50

20

1.5 WATT THERMAL


LIMITATION @ TC = 25C
625 mW THERMAL
LIMITATION @ TA = 25C

10
5.0
3.0

MPSA92

BONDING WIRE LIMITATION


SECOND BREAKDOWN
LIMITATION TJ = 150C
100
200 300
5.0
10
20 30
50
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 5. Active Region Safe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA


VHF/UHF Transistors
MPSH10

NPN Silicon

MPSH11

COLLECTOR
3

Motorola Preferred Devices

1
BASE
2
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

25

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

3.0

Vdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

357

C/W

Thermal Resistance, Junction to Case

RqJC

125

C/W

Operating and Storage Junction


Temperature Range

CASE 2904, STYLE 2


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

25

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

30

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

3.0

Vdc

Collector Cutoff Current


(VCB = 25 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current


(VEB = 2.0 Vdc, IC = 0)

IEBO

100

nAdc

OFF CHARACTERISTICS

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2669

MPSH10 MPSH11
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

hFE

60

Collector Emitter Saturation Voltage


(IC = 4.0 mAdc, IB = 0.4 mAdc)

VCE(sat)

0.5

Vdc

Base Emitter On Voltage


(IC = 4.0 mAdc, VCE = 10 Vdc)

VBE(on)

0.95

Vdc

fT

650

MHz

Ccb

0.7

pF

0.35
0.6

0.65
0.9

9.0

ON CHARACTERISTICS
DC Current Gain
(IC = 4.0 mAdc, VCE = 10 Vdc)

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 4.0 mAdc, VCE = 10 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
CommonBase Feedback Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Collector Base Time Constant
(IC = 4.0 mAdc, VCB = 10 Vdc, f = 31.8 MHz)

2670

Crb
MPSH10
MPSH11
rbCc

pF

ps

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

CATV Transistor

MPSH17

NPN Silicon

COLLECTOR
3

Motorola Preferred Device

1
BASE
2
EMITTER

1
2

CASE 2904, STYLE 2


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

15

Vdc

Collector Base Voltage

VCBO

20

Vdc

Emitter Base Voltage

VEBO

3.0

Vdc

PD

350
2.81

mW
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

RqJA

357

C/W

Total Device Dissipation @ TA = 25C


Derate above 25C
Operating and Storage Junction
Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
(Printed Circuit Board Mounting)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

15

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

20

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

3.0

Vdc

ICBO

100

nAdc

OFF CHARACTERISTICS

Collector Cutoff Current


(VCB = 15 Vdc, IE = 0)

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2671

MPSH17
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

hFE

25

250

VCE(sat)

0.5

fT

800

MHz

CollectorBase Capacitance
(VCB = 10 Vdc, f = 1.0 MHz)

Ccb

0.3

0.9

pF

SmallSignal Current Gain


(IC = 5.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hfe

30

Noise Figure
(IC = 5.0 mAdc, VCC = 12 Vdc, RS = 50 ohms, f = 200 MHz)

NF

6.0

dB

Gpe

24

dB

ON CHARACTERISTICS
DC Current Gain
(IC = 5.0 mAdc, VCE = 10 Vdc)
CollectorEmitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 5.0 mAdc, VCE = 10 Vdc, f = 100 MHz)

FUNCTIONAL TEST
Amplifier Power Gain
(IC = 5.0 mAdc, VCC = 12 Vdc, RS = 50 ohms, f = 200 MHz)

2672

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

RF Amplifier Transistor

MPSH81

PNP Silicon

COLLECTOR
3

Motorola Preferred Device

1
BASE
2
EMITTER
1
2

CASE 2904, STYLE 2


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

20

Vdc

Collector Base Voltage

VCBO

20

Vdc

Emitter Base Voltage

VEBO

3.0

Vdc

PD

350
2.81

mW
mW/C

TJ, Tstg

55 to +150

Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

357

C/W

Total Device Dissipation @ TA = 25C


Derate above 25C
Operating and Storage Junction
Temperature Range

THERMAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

20

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

20

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

3.0

Vdc

Collector Cutoff Current


(VCB = 10 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current


(VEB = 2.0 Vdc, IC = 0)

IEBO

100

nAdc

OFF CHARACTERISTICS

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2673

MPSH81
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

DC Current Gain
(IC = 5.0 mAdc, VCE = 10 Vdc)

hFE

60

Collector Emitter Saturation Voltage


(IC = 5.0 mAdc, IB = 0.5 mAdc)

VCE(sat)

0.5

Vdc

Base Emitter On Voltage


(IC = 5.0 mAdc, VCE = 10 Vdc)

VBE(on)

0.9

Vdc

fT

600

MHz

CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Ccb

0.85

pF

CollectorEmitter Capacitance
(IB = 0, VCB = 10 Vdc, f = 1.0 MHz)

Cce

0.65

pF

ON CHARACTERISTICS

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 5.0 mAdc, VCE = 10 Vdc, f = 100 MHz)

2674

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSH81
TYPICAL COMMONBASE yPARAMETERS
(VCB = 10 Vdc, TA = 25C, Frequency Points in MHz)
30
40

0
100 MHz

450 MHz

930
MHz

1.0

IC = 4.0 mA

50

250

2.0
450
brb , (mmhos)

b ib , (mmhos)

250 MHz
60
100 MHz

8.0 mA
70
80
90

3.0
4.0
IC = 12 mA

8.0 mA

6.0

930

12 mA
100
110
20

120

7.0
8.0
0

20

40

60

80

100

120

140

2.4

2.1

1.8

1.5

1.2

0.9

0.6

0.3

gib, (mmhos)

grb, (mmhos)

Figure 1. Input Admittance

Figure 2. Reverse Transfer Admittance

12
250

12 mA

90

8.0 mA

80

450

70
60

930
IC = 4.0 mA

50

8.0 mA

930

10
bob , (mmhos)

100

14

100 MHz

110

bfb , (mmhos)

4.0 mA

5.0

IC = 4.0 mA

8.0

12 mA

6.0
4.0

450
250
100 MHz

2.0

40
0

30
20
120 100

80

60

20

40

20

2.0

40

0.5

1.0

0.5

1.5

2.0

2.5

gob, (mmhos)

Figure 3. Forward Transfer Admittance

Figure 4. Output Admittance

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

gfb, (mmhos)

3.0

3.5

1000
900
800
700
600
500
400
300

VCE = 10 V
f = 100 MHz

200
100
0
0

2.0

4.0 6.0 8.0

10

12

14

16

18

20

IC, COLLECTOR CURRENT (mA)

Figure 5. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2675

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistor

MPSL01

NPN Silicon

COLLECTOR
3
2
BASE
1
EMITTER
1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

120

Vdc

Collector Base Voltage

VCBO

140

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

150

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

120

Vdc

Collector Base Breakdown Voltage


(IC = 100 Adc, IE = 0 )

V(BR)CBO

140

Vdc

Emitter Base Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCB = 75 Vdc, IE = 0)

ICBO

1.0

Adc

Emitter Cutoff Current


(VEB = 4.0 Vdc, IC = 0)

IEBO

100

nAdc

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.

2676

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSL01
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

hFE

50

300

0.20
0.30

1.2
1.4

fT

60

MHz

CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Ccb

8.0

pF

SmallSignal Current Gain


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hfe

30

ON CHARACTERISTICS
DC Current Gain(1)
(IC = 10 mAdc, VCE = 5.0 Vdc)
Collector Emitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)(1)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(1)
(IC = 10 mAdc, VCE = 10 Vdc, f = 20 MHz)

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2677

MPSL01
500
300
h FE, DC CURRENT GAIN

200

VCE = 1.0 V
VCE = 5.0 V

TJ = 125C
25C

100
55C
50
30
20
10
7.0
5.0
0.1

0.2

0.3

0.5

0.7

1.0

3.0
2.0
5.0
7.0
IC, COLLECTOR CURRENT (mA)

10

20

30

50

70

100

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

1.0
0.9
0.8
0.7
0.6

IC = 1.0 mA

10 mA

100 mA

30 mA

0.5
0.4
0.3
0.2
0.1
0
0.005

0.01

0.02

0.05

0.1

0.2
0.5
1.0
IB, BASE CURRENT (mA)

2.0

5.0

10

20

50

Figure 2. Collector Saturation Region

101
IC, COLLECTOR CURRENT ( A)

VCE = 30 V
100
101

TJ = 125C

102

75C

103

REVERSE

FORWARD

25C

104
105
0.4

IC = ICES

0.3

0.1
0.2
0
0.1
0.2
0.3
0.4
VBE, BASEEMITTER VOLTAGE (VOLTS)

0.5

0.6

Figure 3. Collector CutOff Region

2678

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSL01
1.0

2.5
V, TEMPERATURE COEFFICIENT (mV/ C)

TJ = 25C

V, VOLTAGE (VOLTS)

0.8
VBE(sat) @ IC/IB = 10
0.6

0.4

0.2
VCE(sat) @ IC/IB = 10
0
0.1

1.0 2.0 3.0 5.0 10 20 30


0.2 0.3 0.5
IC, COLLECTOR CURRENT (mA)

50

2.0

1.0

qVC for VCE(sat)

0.5
0
0.5
1.0

qVB for VBE(sat)

1.5
2.0
2.5
0.1

100

TJ = 55C to +135C

1.5

0.2 0.3 0.5 1.0 2.0 3.0 5.0


10 20 30
IC, COLLECTOR CURRENT (mA)

Figure 4. On Voltages

tr, tf 10 ns
DUTY CYCLE = 1.0%

3.0 k

RC

RB

Vout

5.1 k
Vin

100

C, CAPACITANCE (pF)

100
0.25 F

10 s
INPUT PULSE

TJ = 25C

30

VCC
30 V

VBB
8.8 V

Vin

1N914

20
10
Cibo

7.0
5.0

Cobo

3.0
2.0
1.0
0.2

Values Shown are for IC @ 10 mA

0.3

2.0

3.0

5.0 7.0

10

20

Figure 7. Capacitances

5000

1000
IC/IB = 10
TJ = 25C

500

2000
tf @ VCC = 30 V
t, TIME (ns)

100
td @ VEB(off) = 1.0 V

30

VCC = 120 V

500
300

ts @ VCC = 120 V

200

20
10
0.2 0.3 0.5

IC/IB = 10
TJ = 25C

1000

tr @ VCC = 30 V

50

tf @ VCC = 120 V

3000

tr @ VCC = 120 V

300
t, TIME (ns)

0.5 0.7 1.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 6. Switching Time Test Circuit

200

100

Figure 5. Temperature Coefficients

100
70
50
10.2 V

50

100

1.0

20 30
2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA)

50

100

200

Figure 8. TurnOn Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

50
0.2 0.3 0.5

20 30 50
1.0 2.0 3.0 5.0
10
IC, COLLECTOR CURRENT (mA)

100

200

Figure 9. TurnOff Time

2679

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistor

MPSL51

PNP Silicon

COLLECTOR
3
2
BASE
1
EMITTER
1
2

CASE 2904, STYLE 1


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

100

Vdc

Collector Base Voltage

VCBO

100

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

Collector Current Continuous

IC

600

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

100

Vdc

Collector Base Breakdown Voltage


(IC = 100 mAdc, IE = 0)

V(BR)CBO

100

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

4.0

Vdc

Collector Cutoff Current


(VCB = 50 Vdc, IE = 0)

ICBO

1.0

Adc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

100

nAdc

Characteristic

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.

2680

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSL51
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

DC Current Gain(1)
(IC = 50 mAdc, VCE = 5.0 Vdc)

hFE

40

250

Collector Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat)

0.25
0.30

Base Emitter Saturation Voltage


(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat)

1.2
1.2

fT

60

MHz

Cobo

8.0

pF

hfe

20

ON CHARACTERISTICS(1)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 20 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
SmallSignal Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2681

MPSL51
200
150
h FE, CURRENT GAIN

TJ = 125C
100
25C

70
50

55C
VCE = 1.0 V
VCE = 5.0 V

30
20
0.1

0.2

0.3

0.5

1.0

2.0
3.0
5.0
IC, COLLECTOR CURRENT (mA)

10

20

30

50

100

10

20

50

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

1.0
0.9
0.8
0.7
0.6
IC = 1.0 mA

0.5

10 mA

30 mA

100 mA

0.4
0.3
0.2
0.1
0
0.005

0.01

0.02

0.05

0.1

0.2

0.5
1.0
IB, BASE CURRENT (mA)

2.0

5.0

Figure 2. Collector Saturation Region

IC, COLLECTOR CURRENT ( A)

103
102

VCE = 30 V
IC = ICES

101
TJ = 125C
100
75C
101
102

REVERSE
25C

103
0.3

0.2

FORWARD

0.1
0
0.1
0.2 0.3 0.4 0.5
VBE, BASEEMITTER VOLTAGE (VOLTS)

0.6

0.7

Figure 3. Collector CutOff Region

2682

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSL51
1.0

V, TEMPERATURE COEFFICIENT (mV/ C)

TJ = 25C

0.9
V, VOLTAGE (VOLTS)

0.8
0.7
VBE(sat) @ IC/IB = 10

0.6
0.5
0.4
0.3
0.2

VCE(sat) @ IC/IB = 10

0.1
0
0.1

0.2 0.3 0.5

1.0 2.0 3.0 5.0


10
20 30
IC, COLLECTOR CURRENT (mA)

50

2.5
1.5
1.0
0.5

VC for VCE(sat)

0
0.5
1.0
1.5

VB for VBE(sat)

2.0
2.5
0.1

100

TJ = 55C to 135C

2.0

0.2 0.3 0.5 1.0 2.0 3.0 5.0


10
20 30
IC, COLLECTOR CURRENT (mA)

Figure 4. On Voltages

10.2 V

10 s
INPUT PULSE
tr, tf 10 ns
DUTY CYCLE = 1.0%

0.25 F

3.0 k

RC
Vout

RB
5.1 k

Vin

100

C, CAPACITANCE (pF)

100
70
50

VCC
30 V

100

TJ = 25C

30
Cibo

20
10
7.0
5.0

Cobo

3.0

1N914

2.0
1.0
0.2

Values Shown are for IC @ 10 mA

0.3

2.0 3.0
5.0 7.0
0.5 0.7 1.0
VR, REVERSE VOLTAGE (VOLTS)

Figure 6. Switching Time Test Circuit

1000
700
500

10

20

Figure 7. Capacitances

2000
IC/IB = 10
TJ = 25C

tr @ VCC = 120 V

300

1000
700
500

tr @ VCC = 30 V

200

t, TIME (ns)

t, TIME (ns)

100

Figure 5. Temperature Coefficients

VBB
+ 8.8 V
Vin

50

100
70
50

10
0.2 0.3 0.5

td @ VBE(off) = 1.0 V
VCC = 120 V
1.0

2.0 3.0 5.0

10

20 30

50

tf @ VCC = 120 V

tf @ VCC = 30 V

200

ts @ VCC = 120 V

100
70
50

30
20

300

IC/IB = 10
TJ = 25C

30
100

200

20
0.2 0.3 0.5

1.0

2.0 3.0 5.0

10

20 30

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 8. TurnOn Time

Figure 9. TurnOff Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

50

100

200

2683

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt High Current Transistors

MPSW01
MPSW01A*

NPN Silicon

COLLECTOR
3

*Motorola Preferred Device

2
BASE
1
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Collector Emitter Voltage


MPSW01
MPSW01A

VCEO

Collector Base Voltage

VCBO

Unit

CASE 2905, STYLE 1


TO92 (TO226AE)

Vdc
40
50

VEBO

5.0

Vdc

Collector Current Continuous

IC

1000

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

Operating and Storage Junction


Temperature Range

Vdc
30
40

MPSW01
MPSW01A
Emitter Base Voltage

Value

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

30
40

40
50

5.0

0.1
0.1

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 10 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 Adc, IE = 0)

V(BR)CEO
MPSW01
MPSW01A
V(BR)CBO
MPSW01
MPSW01A

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 30 Vdc, IE = 0)
(VCB = 40 Vdc, IE = 0)

V(BR)EBO

Vdc

IEBO

Vdc
Adc

ICBO
MPSW01
MPSW01A

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)
1. Pulse Test: Pulse Width

Vdc

Adc

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

2684

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSW01 MPSW01A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

55
60
50

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 1000 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 1000 mAdc, IB = 100 mAdc)

VCE(sat)

0.5

Vdc

BaseEmitter On Voltage
(IC = 1000 mAdc, VCE = 1.0 Vdc)

VBE(on)

1.2

Vdc

fT

50

MHz

Cobo

20

pF

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 50 mAdc, VCE = 10 Vdc, f = 20 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.


1.0
VCE , COLLECTOR VOLTAGE (VOLTS)

300

h FE , CURRENT GAIN

200

100
70
VCE = 1.0 V
TJ = 25C

50

V, VOLTAGE (VOLTS)

20

50

100

200

0.6
IC =
1000 mA

0.4
IC =
10 mA

0.2

IC =
IC = 500 mA
IC =
250 mA
100 mA

IC =
50 mA

0.5 1.0 2.0

5.0

10 20

Figure 1. DC Current Gain

Figure 2. Collector Saturation Region

VBE(on) @ VCE = 1.0 V

0.4

VCE(sat) @ IC/IB = 10

0
1.0 2.0

0.01 0.02 0.05 0.1 0.2

IB, BASE CURRENT (mA)

VBE(sat) @ IC/IB = 10

0.2

1000

IC, COLLECTOR CURRENT (mA)

TJ = 25C

0.6

500

5.0 10 20

qVB , TEMPERATURE COEFFICIENT (mV/C)

10

0.8

0.8

30

1.0

TJ = 25C

50 100 200 500 1000

0.8

1.2

1.6

qVB FOR VBE


2.0

2.4

2.8
1.0 2.0

5.0 10 20

50 100 200 500 1000

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 3. ON Voltages

Figure 4. Temperature Coefficient

Motorola SmallSignal Transistors, FETs and Diodes Device Data

50 100

2685

80

300

TJ = 25C
200
C, CAPACITANCE (pF)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

MPSW01 MPSW01A

100
70
VCE = 10 V
TJ = 25C
f = 20 MHz

50

60

40

Cibo

20
Cobo

30
10

20

100

50

200

Cobo
Cibo

1000

IC, COLLECTOR CURRENT (mA)

5.0
1.0

10
2.0

15
3.0

20
4.0

25
5.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 5. Current Gain Bandwidth Product

Figure 6. Capacitance

IC , COLLECTOR CURRENT (mA)

1k
1.0 ms 100 ms

1.0 s
500

200
TA = 25C
100

DUTY CYCLE 10%


CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

50

20
10
1.0

TC = 25C

MPSW01
MPSW01A
2.0

5.0

10

20

30 40

VCE, COLLECTOREMITTER VOLTAGE (V)

Figure 7. Active Region Safe Operating


Area

2686

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt Amplifier Transistors

MPSW05
MPSW06*

NPN Silicon

*Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER

1
2

MAXIMUM RATINGS
Rating

Symbol

MPSW05

MPSW06

Unit

Collector Emitter Voltage

VCEO

60

80

Vdc

Collector Base Voltage

VCBO

60

80

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watt
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

CASE 2905, STYLE 1


TO92 (TO226AE)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

60
80

4.0

0.5
0.5

0.1
0.1

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO
MPSW05
MPSW06

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCE = 40 Vdc, IB = 0)
(VCE = 60 Vdc, IB = 0)

MPSW05
MPSW06

Collector Cutoff Current


(VCB = 40 Vdc, IE = 0)
(VCB = 60 Vdc, IE = 0)

MPSW05
MPSW06

Adc

ICBO

IEBO

Vdc
Adc

ICES

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)
1. Pulse Test: Pulse Width

Vdc

Adc

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2687

MPSW05 MPSW06
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

80
60

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 250 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 250 mAdc, IB = 10 mAdc)

VCE(sat)

0.4

Vdc

BaseEmitter Saturation Voltage


(IC = 250 mAdc, VCE = 5.0 Vdc)

VBE(sat)

1.2

Vdc

fT

50

MHz

Cobo

12

pF

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 200 mAdc, VCE = 5.0 Vdc, f = 20 MHz)
Output Capacitance
(VCB = 10 V, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

400

hFE , DC CURRENT GAIN

TJ = 125C

VCE = 1.0 V

200
25C
55C
100
80
60
40
0.5

0.7

1.0

2.0

3.0

5.0

7.0
10
20
30
IC, COLLECTOR CURRENT (mA)

50

70

100

200

300

500

1.0

1.0
TJ = 25C

TJ = 25C

0.8

0.6

0.8
IC = 10 mA

50
mA

100 mA

250 mA

V, VOLTAGE (VOLTS)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

500 mA

0.4

0.2

VBE(sat) @ IC/IB = 10
0.6

VBE(on) @ VCE = 1.0 V

0.4

0.2
VCE(sat) @ IC/IB = 10

0
0.05

0.1

0.2

0.5
1.0
2.0
5.0
IB, BASE CURRENT (mA)

10

20

Figure 2. Collector Saturation Region

2688

50

0
0.5

1.0

2.0

20
5.0
10
50
100
IC, COLLECTOR CURRENT (mA)

200

500

Figure 3. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

80

0.8

TJ = 25C

60
1.2

40
C, CAPACITANCE (pF)

VB, TEMPERATURE COEFFICIENT (mV/C)

MPSW05 MPSW06

1.6
VB for VBE

2.0

2.4

Cibo

20

10
8.0
6.0

2.8
0.5

1.0

2.0

5.0
20
50
10
100
IC, COLLECTOR CURRENT (mA)

200

Cobo

4.0
0.1

500

0.2

0.5 1.0 2.0


5.0 10
20
VR, REVERSE VOLTAGE (VOLTS)

100

Figure 5. Capacitance

300
200

VCE = 2.0 V
TJ = 25C

IC, COLLECTOR CURRENT (mA)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

Figure 4. BaseEmitter Temperature Coefficient

50

100
70
50

DUTY CYCLE 10%


2k

1.0 ms

1k

100 s

500
TA = 25C

200
100
50
20

30
2.0

3.0

5.0 7.0 10
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

200

Figure 6. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10
1.0

TC = 25C

1.0 s

dc
dc
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
MPSW05
MPSW06
10
20
60 80 100
2.0
5.0
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. Active Region Safe Operating Area

2689

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt High Voltage Transistor

MPSW10

NPN Silicon

COLLECTOR
3
2
BASE
1
EMITTER
1

CASE 2905, STYLE 1


TO92 (TO226AE)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

300

Vdc

Collector Base Voltage

VCBO

300

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watt
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

300

Vdc

CollectorBase Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

300

Vdc

EmitterBase Breakdown Voltage


(IE = 100 Adc, IC = 0)

V(BR)EBO

6.0

Vdc

Collector Cutoff Current


(VCB = 200 Vdc, IE = 0)

ICBO

0.2

Adc

Emitter Cutoff Current


(VEB = 6.0 Vdc, IC = 0)

IEBO

0.1

Adc

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

2690

v 300 ms, Duty Cycle v 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSW10
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

25
40
40

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)

hFE

CollectorEmitter Saturation Voltage


(IC = 30 mAdc, IB = 3.0 mAdc)

VCE(sat)

0.75

Vdc

BaseEmitter On Voltage
(IC = 30 mAdc, VCE = 10 Vdc)

VBE(on)

0.85

Vdc

fT

45

MHz

Ccb

3.0

pF

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 20 MHz)
CollectorBase Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)

v 300 ms, Duty Cycle v 2.0%.


VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

1. Pulse Test: Pulse Width

200

hFE, DC CURRENT GAIN

VCE = 10 V

TJ = 125C

100

25C

70
55C

50

30
20
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

0.6
0.5
0.4
IC = 30 mA
0.3

0.1
0
0.1

V, VOLTAGE (VOLTS)

1.0
VBE(sat) @ IC/IB = 10
VBE(on) @ VCE = 10 V

0.4
5.0
0.2
0
1.0

VCE(sat) @ IC/IB = 10
2.0

3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

RV, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C

0.6

IC = 10 mA

0.2

0.5

2.0
5.0
1.0
10
IB, BASE CURRENT (mA)

20 30

Figure 2. Collector Saturation Region

1.4

0.8

IC = 20 mA

0.2

Figure 1. DC Current Gain

1.2

TJ = 25C

70 100

Figure 3. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2.5
2.0

IC
IB

1.5

+ 10
25C to 125C

1.0
0.5

RVC for VCE(sat)

0
55C to 25C

0.5
1.0
1.5

55C to 125C
RVB for VBE

2.0
2.5
1.0

2.0

3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70

100

Figure 4. Temperature Coefficients

2691

C, CAPACITANCE (pF)

100
70
50

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

MPSW10
TJ = 25C
Ceb

30
20
10
7.0
5.0

Ccb

3.0
2.0
1.0
0.2

0.5

1.0 2.0
5.0
10 20
50
VR, REVERSE VOLTAGE (VOLTS)

100

200

Figure 5. Capacitance

100
70
50
TJ = 25C
VCE = 20 V
f = 20 MHz

30
20

10
1.0

2.0 3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

Figure 6. CurrentGain Bandwidth Product

IC, COLLECTOR CURRENT (mA)

1k
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN
LIMIT

500

1.0 ms

200
1.0 s

100 s

100
50
TA = 25C

20

DUTY CYCLE 10%

10
10

20
50
100
200 300
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. Active Region Safe Operating Area

2692

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt Darlington Transistors

MPSW13
MPSW14

NPN Silicon

COLLECTOR 3

BASE
2

EMITTER 1
1

CASE 2905, STYLE 1


TO92 (TO226AE)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCES

30

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

10

Vdc

Collector Current Continuous

IC

1.0

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

V(BR)CES

30

Vdc

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

100

nAdc

Characteristic

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 100 Adc, VBE = 0)

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2693

MPSW13 MPSW14
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

MPSW13
MPSW14

5,000
10,000

MPSW13
MPSW14

10,000
20,000

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 10 mAdc, VCE = 5.0 Vdc)

hFE

(IC = 100 mAdc, VCE = 5.0 Vdc)

CollectorEmitter Saturation Voltage


(IC = 100 mAdc, IB = 0.1 mAdc)

VCE(sat)

1.5

Vdc

BaseEmitter On Voltage
(IC = 100 mAdc, VCE = 5.0 Vdc)

VBE(on)

2.0

Vdc

fT

125

MHz

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product(2)
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
1. Pulse Test: Pulse Width
2. fT = |hfe| ftest.

v 300 ms, Duty Cycle v 2.0%.


CURRENT LIMIT
DUTY CYCLE 10%
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

I C , COLLECTOR CURRENT (mA)

3.0 k
2.0 k

100 ms
1.0 ms

1.0 k
1.0 s
500
TA = 25C
200
1.5

TC = 25C

2.0

5.0

10

20

30

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. Active Region Safe Operating


Area

VCE , COLLECTOR EMITTER VOLTAGE (VOLTS)

200 k

h FE , DC CURRENT GAIN

TJ = 125C
100 k
70 k
50 k

25C

30 k
20 k
10 k
7.0 k
5.0 k

55C

3.0 k
2.0 k
5.0 7.0 10

VCE = 5.0 V

20

30

50 70 100

IC, COLLECTOR CURRENT (mA)

Figure 2. DC Current Gain

2694

200 300

500

3.0
TJ = 25C
IC =
10 mA

2.5

IC =
50 mA

IC =
500 mA

IC =
250 mA

2.0

1.5

1.0

0.5
0.1

0.2

0.5 1.0 2.0

5.0

10

20

50

100 200

500 1000

IB, BASE CURRENT (mA)

Figure 3. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSW13 MPSW14
q V , TEMPERATURE COEFFICIENTS (mV/ C)

1.6
TJ = 25C

V, VOLTAGE (VOLTS)

1.4
VBE(sat) @ IC/IB = 1000
1.2
VBE(on) @ VCE = 5.0 V
1.0

0.8

0.6

VCE(sat) @ IC/IB = 1000


5.0 7.0 10

20

30

50

70 100

200 300

1.0

2.0

*APPLIES FOR IC/IB hFE/3.0

55C TO 25C
3.0
25C TO 125C
4.0

qVB FOR VBE


5.0

55C TO 25C

6.0

500

5.0 7.0 10

20

Figure 4. ON Voltages

70 100

200 300

500

20
VCE = 5.0 V
TJ = 25C
f = 100 MHz

TJ = 25C
C, CAPACITANCE (pF)

h FE , SMALLSIGNAL CURRENT GAIN

50

Figure 5. Temperature Coefficients

4.0

1.0
0.8
0.6
0.4
0.2
0.5

30

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

2.0

25C TO 125C

*qVC FOR VCE(sat)

10
7.0

Cibo

5.0
Cobo
3.0
2.0

1.0

2.0

5.0

10

20

50

100

200

500

0.04

0.1

0.2

0.4

1.0

2.0

4.0

IC, COLLECTOR CURRENT (mA)

VR, REVERSE VOLTAGE (VOLTS)

Figure 6. High Frequency Current Gain

Figure 7. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

40

2695

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt High Voltage Transistor

MPSW42

NPN Silicon

Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER

CASE 2905, STYLE 1


TO92 (TO226AE)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

300

Vdc

Collector Base Voltage

VCBO

300

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watt
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

300

Vdc

CollectorBase Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

300

Vdc

EmitterBase Breakdown Voltage


(IE = 100 Adc, IC = 0)

V(BR)EBO

6.0

Vdc

Collector Cutoff Current


(VCB = 200 Vdc, IE = 0)

ICBO

0.1

Adc

Emitter Cutoff Current


(VEB = 6.0 Vdc, IC = 0)

IEBO

0.1

Adc

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

2696

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSW42
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

25
40
40

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)

hFE

CollectorEmitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VCE(sat)

0.5

Vdc

BaseEmitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VBE(sat)

0.9

Vdc

fT

50

MHz

Ccb

3.0

pF

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 20 MHz)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Collector Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)

200

hFE, DC CURRENT GAIN

VCE = 10 V

TJ = 125C

100

25C

70
55C

50

30
20
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

0.6
0.5
0.4
IC = 30 mA
0.3

0.1
0
0.1

V, VOLTAGE (VOLTS)

1.0
VBE(sat) @ IC/IB = 10
VBE(on) @ VCE = 10 V

0.4
5.0
0.2
0
1.0

VCE(sat) @ IC/IB = 10
2.0

3.0

20 30
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)

50

RV, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C

0.6

IC = 10 mA

0.2

0.5

1.0
10
2.0
5.0
IB, BASE CURRENT (mA)

20 30

Figure 2. Collector Saturation Region

1.4

0.8

IC = 20 mA

0.2

Figure 1. DC Current Gain

1.2

TJ = 25C

70 100

Figure 3. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2.5
2.0

IC
IB

1.5

+ 10
25C to 125C

1.0
0.5

RVC for VCE(sat)

0
55C to 25C

0.5
1.0
1.5

55C to 125C
RVB for VBE

2.0
2.5
1.0

2.0

3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70

100

Figure 4. Temperature Coefficients

2697

C, CAPACITANCE (pF)

100
70
50

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

MPSW42
TJ = 25C
Ceb

30
20
10
7.0
5.0

Ccb

3.0
2.0
1.0
0.2

0.5

1.0 2.0
5.0
10 20
50
VR, REVERSE VOLTAGE (VOLTS)

100

200

Figure 5. Capacitance

100
70
50
TJ = 25C
VCE = 20 V
f = 20 MHz

30
20

10
1.0

2.0 3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

Figure 6. CurrentGain Bandwidth Product

IC, COLLECTOR CURRENT (mA)

1k
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN
LIMIT

500

1.0 ms

200
1.0 s

100 s

100
50
TA = 25C

20

DUTY CYCLE 10%

10
10

20
50
100
200 300
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. Active Region Safe Operating Area

2698

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt Darlington Transistors


NPN Silicon

MPSW45
MPSW45A*

COLLECTOR 3
BASE
2

*Motorola Preferred Device

EMITTER 1

MAXIMUM RATINGS

Rating

Symbol

MPSW45

MPSW45A

Unit

Collector Emitter Voltage

VCES

40

50

Vdc

Collector Base Voltage

VCBO

50

60

Vdc

Emitter Base Voltage

VEBO

12

12

Vdc

Collector Current Continuous

IC

1.0

1.0

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

CASE 2905, STYLE 1


TO92 (TO226AE)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Characteristic

Min

Max

40
50

50
60

12

100
100

100

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 100 Adc, VBE = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CES
MPSW45
MPSW45A
V(BR)CBO
MPSW45
MPSW45A

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 30 Vdc, IE = 0)
(VCB = 40 Vdc, IE = 0)

Vdc

V(BR)EBO

Vdc

ICBO
MPSW45
MPSW45A

Emitter Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

Vdc
nAdc

nAdc

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2699

MPSW45 MPSW45A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

25,000
15,000
4,000

150,000

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 200 mAdc, VCE = 5.0 Vdc)
(IC = 500 mAdc, VCE = 5.0 Vdc)
(IC = 1.0 Adc, VCE = 5.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 1.0 Adc, IB = 2.0 mAdc)

VCE(sat)

1.5

Vdc

Base Emitter Saturation Voltage


(IC = 1.0 Adc, IB = 2.0 mAdc)

VBE(sat)

2.0

Vdc

Base Emitter On Voltage


(IC = 1.0 Adc, VCE = 5.0 Vdc)

VBE(on)

2.0

Vdc

fT

100

MHz

Ccb

6.0

pF

SMALL SIGNAL CHARACTERISTICS


CurrentGain Bandwidth Product
(IC = 200 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms; Duty Cycle v 2.0%.

RS

in
en

IDEAL
TRANSISTOR

Figure 1. Transistor Noise Model

2700

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSW45 MPSW45A
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
500

2.0
BANDWIDTH = 1.0 Hz
RS 0
i n, NOISE CURRENT (pA)

en, NOISE VOLTAGE (nV)

200

BANDWIDTH = 1.0 Hz

100
10 A
50
100 A
20
IC = 1.0 mA
10

1.0
0.7
0.5

IC = 1.0 mA

0.3
0.2
100 A

0.1
0.07
0.05

10 A

0.03
0.02
10 20

5.0
10 20

50 100 200

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

50 k 100 k

50 100 200

50 k 100 k

Figure 3. Noise Current

14

200

BANDWIDTH = 10 Hz TO 15.7 kHz


12
BANDWIDTH = 10 Hz TO 15.7 kHz

100

NF, NOISE FIGURE (dB)

VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)

Figure 2. Noise Voltage

500 1 k 2 k 5 k 10 k 20 k
f, FREQUENCY (Hz)

IC = 10 A

70
50

100 A

30
20

1.0 mA
10

1.0

2.0

10
10 A
8.0
100 A

6.0
4.0

IC = 1.0 mA

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

100
0

Figure 4. Total Wideband Noise Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0
1.0

2.0

5.0

10
20
50 100 200
RS, SOURCE RESISTANCE (k)

500

100
0

Figure 5. Wideband Noise Figure

2701

MPSW45 MPSW45A
SMALLSIGNAL CHARACTERISTICS
20
|h fe |, SMALLSIGNAL CURRENT GAIN

4.0
TJ = 25C

C, CAPACITANCE (pF)

10
7.0

Cibo
Cobo

5.0

3.0

2.0
0.04

0.1

0.2
0.4
1.0 2.0 4.0
10
VR, REVERSE VOLTAGE (VOLTS)

20

2.0

1.0
0.8
0.6
0.4

0.2
0.5

40

200 k

hFE, DC CURRENT GAIN

TJ = 125C

25C

30 k
20 k
10 k
7.0 k
5.0 k

55C
VCE = 5.0 V

3.0 k
2.0 k
5.0 7.0

10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

RV, TEMPERATURE COEFFICIENTS (mV/C)

TJ = 25C
V, VOLTAGE (VOLTS)

1.4
VBE(sat) @ IC/IB = 1000
1.2
VBE(on) @ VCE = 5.0 V
1.0

0.8
VCE(sat) @ IC/IB = 1000
0.6
20 30
50 70 100 200 300
IC, COLLECTOR CURRENT (mA)

Figure 10. On Voltages

2702

0.5 10 20
50
100 200
IC, COLLECTOR CURRENT (mA)

500

TJ = 25C
2.5
IC = 10 mA

50 mA

250 mA

500 mA

2.0

1.5

1.0

0.5
0.1 0.2

0.5 1.0 2.0 5.0 10 20 50 100 200


IB, BASE CURRENT (A)

500 1000

Figure 9. Collector Saturation Region

1.6

10

2.0

3.0

Figure 8. DC Current Gain

5.0 7.0

1.0

Figure 7. High Frequency Current Gain

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. Capacitance

100 k
70 k
50 k

VCE = 5.0 V
f = 100 MHz
TJ = 25C

500

1.0

2.0

*APPLIES FOR IC/IB hFE/3.0

25C TO 125C

*RqVC FOR VCE(sat)


55C TO 25C

3.0
25C TO 125C
4.0

qVB FOR VBE


5.0

55C TO 25C

6.0
5.0 7.0 10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

500

Figure 11. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSW45 MPSW45A

r(t), TRANSIENT THERMAL


RESISTANCE (NORMALIZED)

1.0
0.7
0.5

D = 0.5
0.2

0.3
0.2
0.1

0.05

SINGLE PULSE

0.1
0.07
0.05

SINGLE PULSE
ZJC(t) = r(t) RJC TJ(pk) TC = P(pk) ZJC(t)
ZJA(t) = r(t) RJA TJ(pk) TA = P(pk) ZJA(t)

0.03
0.02
0.01
0.1

0.2

0.5

1.0

2.0

10

5.0

20
50
t, TIME (ms)

100

200

500

1.0 k

2.0 k

5.0 k

10 k

Figure 12. Thermal Response

IC, COLLECTOR CURRENT (mA)

1.0 k
700
500
300
200

FIGURE A

1.0 ms

tP
TA = 25C

TC = 25C

100 s

PP

1.0 s

100
70
50

PP

t1

30

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

20
10
0.4 0.6

1/f
DUTY CYCLE

1.0
2.0
4.0 6.0
10
20
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 13. Active Region Safe Operating Area

40

+ t1 f + ttP1

PEAK PULSE POWER = PP

Design Note: Use of Transient Thermal Resistance Data

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2703

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt High Current Transistors


PNP Silicon

MPSW51
MPSW51A*

COLLECTOR
3

*Motorola Preferred Device

2
BASE
1
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

MPSW51
MPSW51A

VCEO

30
40

Vdc

MPSW51
MPSW51A

VCBO

40
50

Vdc

VEBO

5.0

Vdc

Collector Current Continuous

IC

1000

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watts
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

Collector Emitter Voltage


Collector Base Voltage
Emitter Base Voltage

Operating and Storage Junction


Temperature Range

1
2

CASE 2905, STYLE 1


TO92 (TO226AE)

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

30
40

40
50

5.0

0.1
0.1

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage
(IC = 100 mAdc, IE = 0)

V(BR)CEO
MPSW51
MPSW51A
V(BR)CBO
MPSW51
MPSW51A

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 30 Vdc, IE = 0)
(VCB = 40 Vdc, IE = 0)

V(BR)EBO

Vdc

IEBO

Vdc
Adc

ICBO
MPSW51
MPSW51A

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)
1. Pulse Test: Pulse Width

Vdc

Adc

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

2704

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSW51 MPSW51A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

55
60
50

Unit

ON CHARACTERISTICS
DC Current Gain
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
(IC = 1000 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 1000 mAdc, IB = 100 mAdc)

VCE(sat)

0.7

Vdc

Base Emitter On Voltage


(IC = 1000 mAdc, VCE = 1.0 Vdc)

VBE(on)

1.2

Vdc

fT

50

MHz

Cobo

30

pF

SMALL SIGNAL CHARACTERISTICS


CurrentGain Bandwidth Product
(IC = 50 mAdc, VCE = 10 Vdc, f = 20 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

1.0
VCE , COLLECTOR VOLTAGE (VOLTS)

h FE , CURRENT GAIN

200

100
70
VCE = 1.0 V
TJ = 25C

50

20
10

20

50

100

200

500

1000

0.4

0.2

50 100

Figure 2. Collector Saturation Region

qV B, TEMPERATURE COEFFICIENT (mV/ C)

V, VOLTAGE (VOLTS)

0.6

Figure 1. DC Current Gain

VBE(SAT) @ IC/IB = 10

VBE(ON) @ VCE = 1.0 V

VCE(SAT) @ IC/IB = 10

0
1.0 2.0

IC = IC =
IC =
IC =
100 250 500 mA 1000 mA
mA mA

IB, BASE CURRENT (mA)

0.4

0.2

IC =
50 mA

IC, COLLECTOR CURRENT (mA)

TJ = 25C

0.6

IC =
10 mA

TJ = 25C
0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20

1.0

0.8

0.8

5.0

10

20

50 100 200

500 1000

0.8

1.2

1.6

qVB for VBE


2.0

2.4

2.8
1.0 2.0

5.0

10

20

50 100 200

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 3. ON Voltages

Figure 4. Temperature Coefficient

Motorola SmallSignal Transistors, FETs and Diodes Device Data

500 1000

2705

300

160
TJ = 25C

200
C, CAPACITANCE (pF)

f T , CURRENTGAIN BANDWIDTH PRODUCT (MHz)

MPSW51 MPSW51A

VCE = 10 V
TJ = 25C
f = 20 MHz

100
70
50

120

80
Cibo
40
Cobo

30
10

0
20

50

100

200

500

1000

Cobo
Cibo

IC, COLLECTOR CURRENT (mA)

5.0
1.0

10
15
20
2.0
3.0
4.0
VR, REVERSE VOLTAGE (VOLTS)

Figure 5. Current Gain Bandwidth Product

Figure 6. Capacitance

1.0 k
I C , COLLECTOR CURRENT (mA)

1.0 ms
500

1.0 ms

100 ms

TA = 25C
TC = 25C

200
100

25
5.0

DUTY CYCLE 10%


MPSW51
MPSW51A

50

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

20
10
1.0

2.0

5.0

10

20 30 40

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. Active Region Safe Operating


Area

2706

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt Amplifier Transistors

MPSW55
MPSW56*

PNP Silicon

COLLECTOR
3

*Motorola Preferred Device

2
BASE
1
EMITTER
1

MAXIMUM RATINGS

Rating

Symbol

MPSW55

MPSW56

Unit

Collector Emitter Voltage

VCEO

60

80

Vdc

Collector Base Voltage

VCBO

60

80

Vdc

Emitter Base Voltage

VEBO

4.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watt
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

Operating and Storage Junction


Temperature Range

CASE 2905, STYLE 1


TO92 (TO226AE)

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

60
80

4.0

0.5
0.5

0.1
0.1

0.1

Unit

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(1)
(IC = 1.0 mAdc, IB = 0)

V(BR)CEO
MPSW55
MPSW56

Emitter Base Breakdown Voltage


(IE = 100 mAdc, IC = 0)

V(BR)EBO

Collector Cutoff Current


(VCE = 40 Vdc, IB = 0)
(VCE = 60 Vdc, IB = 0)

MPSW55
MPSW56

Collector Cutoff Current


(VCB = 40 Vdc, IE = 0)
(VCB = 60 Vdc, IE = 0)

MPSW55
MPSW56

Adc

ICBO

IEBO

Vdc
Adc

ICES

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)
1. Pulse Test: Pulse Width

Vdc

Adc

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2707

MPSW55 MPSW56
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

100
50

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 250 mAdc, VCE = 1.0 Vdc)

hFE

Collector Emitter Saturation Voltage


(IC = 250 mAdc, IB = 10 mAdc)

VCE(sat)

0.5

Vdc

BaseEmitter On Voltage
(IC = 250 mAdc, VCE = 5.0 Vdc)

VBE(on)

1.2

Vdc

fT

50

MHz

Cobo

15

pF

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product
(IC = 250 mAdc, VCE = 5.0 Vdc, f = 20 MHz)
Output Capacitance
(VCB = 10 Vdc, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

400

hFE, DC CURRENT GAIN

TJ = 125C

VCE = 1.0 V

200
25C
55C
100
80
60
40
0.5 0.7

1.0

2.0

3.0

5.0

7.0 10
20
30
IC, COLLECTOR CURRENT (mA)

50

70

100

200

300

500

1.0

1.0
TJ = 25C

TJ = 25C
0.8

0.8

0.6
IC = 10 mA

50
mA

100 mA

250 mA

V, VOLTAGE (VOLTS)

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 1. DC Current Gain

500 mA

0.4

0.2

VBE(sat) @ IC/IB = 10
0.6

VBE(on) @ VCE = 1.0 V

0.4

0.2
VCE(sat) @ IC/IB = 10

0
0.05 0.1

0.2

0.5 1.0 2.0


5.0
IB, BASE CURRENT (mA)

10

20

Figure 2. Collector Saturation Region

2708

50

0
0.5 1.0

2.0

5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mA)

500

Figure 3. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

100

0.8

70
1.2

1.6
VB for VBE

2.0

30
20

10

2.4

Cobo

7.0
2.8
0.5

1.0

2.0

5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mA)

5.0
0.1

500

Figure 4. BaseEmitter Temperature Coefficient

0.2

0.5 1.0 2.0


5.0 10 20
VR, REVERSE VOLTAGE (VOLTS)

50 100

Figure 5. Capacitance

200
VCE = 2.0 V
TJ = 25C

IC, COLLECTOR CURRENT (mA)

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

TJ = 25C

Cibo

50
C, CAPACITANCE (pF)

VB, TEMPERATURE COEFFICIENT (mV/C)

MPSW55 MPSW56

100
70
50

30

DUTY CYCLE 10%


2 k

5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)

200

Figure 6. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

100 s

500
200
100
50
20

20
2.0 3.0

1.0 ms

1 k

10
1.0

1.0 s
TA = 25C
TC = 25C

dc
dc

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
MPSW55
MPSW56
2.0
5.0
10
20
60 80 100
VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. Active Region Safe Operating


Area

2709

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt Darlington Transistors

MPSW63
MPSW64 *

PNP Silicon

COLLECTOR 3

*Motorola Preferred Device

BASE
2

EMITTER 1
1

CASE 2905, STYLE 1


TO92 (TO226AE)

MAXIMUM RATINGS
Symbol

MPSW63
MPSW64

Unit

Collector Emitter Voltage

VCES

30

Vdc

Collector Base Voltage

VCBO

30

Vdc

Emitter Base Voltage

VEBO

10

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watt
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

Rating

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)CES

30

Vdc

Collector Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

100

nAdc

Emitter Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

100

nAdc

OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage
(IC = 100 Adc, VBE = 0)

Preferred devices are Motorola recommended choices for future use and best overall value.

2710

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSW63 MPSW64
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

MPSW63
MPSW64

5,000
10,000

MPSW63
MPSW64

10,000
20,000

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 10 mAdc, VCE = 5.0 Vdc)

hFE

(IC = 100 mAdc, VCE = 5.0 Vdc)

CollectorEmitter Saturation Voltage


(IC = 100 mAdc, IB = 0.1 mAdc)

VCE(sat)

1.5

Vdc

BaseEmitter On Voltage
(IC = 100 mAdc, VCE = 5.0 Vdc)

VBE(on)

2.0

Vdc

fT

125

MHz

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product(2)
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
1. Pulse Test: Pulse Width
2. fT = |hfe| ftest.

v 300 ms, Duty Cycle v 2.0%.


TYPICAL ELECTRICAL CHARACTERISTICS

h FE, DC CURRENT GAIN (X1.0 k)

200
TJ = 125C
100
70
50

10 V

25C

30

VCE = 2.0 V

20

5.0 V

10
7.0
5.0
3.0
2.0
0.3

55C

0.5

0.7

1.0

2.0

3.0

5.0

7.0

10

20

30

50

70

100

200

300

IC, COLLECTOR CURRENT (mA)

Figure 1. DC Current Gain


VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

2.0
TJ = 25C
V, VOLTAGE (VOLTS)

1.6

VBE(sat) @ IC/IB = 100

1.2

0.8

VBE(on) @ VCE = 5.0 V


VCE(sat) @ IC/IB = 1000
IC/IB = 100

0.4
0
0.3 0.5 1.0

3.0 5.0

10

30 50 100

300

2.0
TJ = 25C
1.8
1.6
50 mA 100 mA 175 mA

300 mA

1.4
1.2
1.0
0.8

IC = 10 mA

0.6
0.1 0.3

1.0 3.0

10

30

100 300 1 k 3 k 10 k

IC, COLLECTOR CURRENT (mA)

IB, BASE CURRENT (mA)

Figure 2. ON Voltage

Figure 3. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2711

+5.0
+4.0

*APPLIES FOR IC/IB hFE/100

+3.0
+25C TO +125C

+2.0
+1.0

50C TO +25C

0
1.0
2.0

*RqVC FOR VCE(sat)

3.0

50C TO +25C

4.0
RqVB FOR VBE
5.0
0.3 0.5 1.0 2.0

20

+25C TO +125C
5.0

10

50 100

20

10 V

60

5.0 V

40
30
20
0.3 0.5 1.0 2.0

2 k
IC , COLLECTOR CURRENT (mA)

C, CAPACITANCE (pF)

100

5.0 10

20

50 100

300

Figure 5. CurrentGain Bandwidth Product

7.0
TJ = 25C
f = 1.0 MHz

3.0

2712

VCE = 20 V

200

Figure 4. Temperature Coefficients

Cibo

2.0
0.1 0.2

TJ = 25C

400
300

IC, COLLECTOR CURRENT (mA)

Cobo

5.0

600

IC, COLLECTOR CURRENT (mA)

15
10

300

f T , CURRENTGAIN BANDWIDTH PRODUCT (MHz)

R qV , TEMPERATURE COEFFICIENT (mV/ C)

MPSW63 MPSW64

0.5

1.0

2.0

5.0

10

20 30

CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT

1 k

100 ms

1.0 mS
500
1.0 s
TC = 25C

TA = 25C
200
DUTY CYCLE 10%
100
1.5 2.0

5.0

10

20

VR, REVERSE VOLTAGE (VOLTS)

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 6. Capacitance

Figure 7. Active Region, Safe Operating Area

30

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

One Watt High Voltage Transistor

MPSW92

PNP Silicon

Motorola Preferred Device

COLLECTOR
3
2
BASE
1
EMITTER

CASE 2905, STYLE 1


TO92 (TO226AE)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

300

Vdc

Collector Base Voltage

VCBO

300

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

500

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

1.0
8.0

Watt
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

2.5
20

Watts
mW/C

TJ, Tstg

55 to +150

Operating and Storage Junction


Temperature Range

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

Characteristic

RqJA

125

C/W

Thermal Resistance, Junction to Case

RqJC

50

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

300

Vdc

CollectorBase Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

300

Vdc

EmitterBase Breakdown Voltage


(IE = 100 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCB = 200 Vdc, IE = 0)

ICBO

0.25

Adc

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

0.1

Adc

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2713

MPSW92
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

25
40
25

Unit

ON CHARACTERISTICS(1)
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)

hFE

CollectorEmitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VCE(sat)

0.5

Vdc

BaseEmitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VBE(sat)

0.9

Vdc

fT

50

MHz

Ccb

6.0

pF

SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 20 MHz)
CollectorBase Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

TJ = 125C

VCE = 10 V
h FE, DC CURRENT GAIN

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

200

25C

100

55C

70
50

30
20
1.0

2714

2.0 3.0

5.0 7.0 10

20 30

50 70 100

0.7
TJ = 25C

IC = 20 mA

0.6

IC = 30 mA

0.5
0.4
0.3
IC = 10 mA
0.2
0.1
0
0.1 0.2

0.5

1.0 2.0

5.0

10

20 30

IC, COLLECTOR CURRENT (mA)

IB, BASE CURRENT (mA)

Figure 1. DC Current Gain

Figure 2. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPSW92
R qV, TEMPERATURE COEFFICIENTS (mV/ C)

1.4
1.2
1.0
0.8
0.6

VBE(sat) @ IC/IB = 10
VBE(on) @ VCE = 10 V

0.4
0.2
0
1.0

2.0 3.0

5.0 7.0 10

VCE(sat) @ IC/IB = 5.0


20 30
50 70 100

25C TO 125C

1.5
1.0
RqVC FOR VCE(sat)

0.5

55C TO 25C

0
0.5
1.0

55C TO 125C

1.5

RqVB FOR VBE

2.0
2.5
1.0

2.0 3.0

5.0 7.0 10

20 30

50 70 100

IC, COLLECTOR CURRENT (mA)

Figure 3. ON Voltages

Figure 4. Temperature Coefficients

Ceb

TJ = 25C

30
20
10
7.0
5.0

Ccb

3.0
2.0
1.0
0.2

IC/IB = 10

2.0

IC, COLLECTOR CURRENT (mA)

100
70
50
C, CAPACITANCE (pF)

5.0

VCE(sat) @ IC/IB = 10

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

V, VOLTAGE (VOLTS)

TJ = 25C

2.5

0.5 1.0

2.0

5.0 10

20

50 100 200

100
70
50
TJ = 25C
VCE = 20 V
f = 20 MHz

30
20

10
1.0

2.0 3.0

5.0 7.0 10

20 30

50 70 100

VR, REVERSE VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 5. Capacitance

Figure 6. CurrentGain Bandwidth Product

IC , COLLECTOR CURRENT (mA)

1 k
500
100 ms
200
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN
LIMIT

1.0 s
100
1.0 ms
50

20

TA = 25C

MPSW92

TC = 25C

DUTY CYCLE 10%


10
10

20

50

100

200 300

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 7. Active Region Safe Operating Area

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2715

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

PNP RF Amplifier Transistor


Surface Mount

MSA1022-CT1
Motorola Preferred Device

COLLECTOR
3

3
2
1

2
BASE

1
EMITTER

MAXIMUM RATINGS (TA = 25C)


Rating

Symbol

Value

Unit

CollectorBase Voltage

VCBO

30

Vdc

CollectorEmitter Voltage

VCEO

20

Vdc

EmitterBase Voltage

VEBO

5.0

Vdc

IC

30

mAdc

Collector Current Continuous

CASE 318D03, STYLE 1


SC59

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Power Dissipation

Characteristic

PD

200

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ +150

ELECTRICAL CHARACTERISTICS (TA = 25C)


Symbol

Min

Max

Unit

Collector Cutoff Current


(VCB = 10 Vdc, IE = 0)

ICBO

0.1

Adc

CollectorEmitter Breakdown Voltage


(VCE = 20 Vdc, IB = 0)

ICEO

100

Adc

EmitterBase Breakdown Voltage


(VEB = 5.0 Vdc, IC = 0)

IEBO

10

Adc

DC Current Gain(1)
(VCE = 10 Vdc, IC = 1.0 mAdc)

hFE

110

220

CurrentGain Bandwidth Product


(VCB = 10 Vdc, IE = 1.0 mAdc)

fT

150

MHz

Characteristic

1. Pulse Test: Pulse Width 300 s, D.C. 2%.

DEVICE MARKING

Marking Symbol

ECX

The X represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.

(Replaces MSA1022BT1/D)

2716

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

PNP General Purpose Amplifier


Transistor Surface Mount

MSB709-RT1
Motorola Preferred Device

COLLECTOR
3

3
2
1

2
BASE

1
EMITTER

MAXIMUM RATINGS (TA = 25C)


Rating

Symbol

Value

Unit

CollectorBase Voltage

V(BR)CBO

60

Vdc

CollectorEmitter Voltage

V(BR)CEO

45

Vdc

EmitterBase Voltage

V(BR)EBO

7.0

Vdc

IC

100

mAdc

IC(P)

200

mAdc

Symbol

Max

Unit

Power Dissipation

PD

200

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ +150

Collector Current Continuous


Collector Current Peak

CASE 318D03, STYLE 1


SC59

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C)


Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage (IC = 2.0 mAdc, IB = 0)

V(BR)CEO

45

Vdc

CollectorBase Breakdown Voltage (IC = 10 Adc, IE = 0)

V(BR)CBO

60

Vdc

EmitterBase Breakdown Voltage (IE = 10 Adc, IE = 0)

V(BR)EBO

7.0

Vdc

CollectorBase Cutoff Current (VCB = 45 Vdc, IE = 0)

ICBO

0.1

Adc

CollectorEmitter Cutoff Current (VCE = 10 Vdc, IB = 0)

ICEO

100

nAdc

DC Current Gain(1)
(VCE = 10 Vdc, IC = 2.0 mAdc)

hFE1

210

340

CollectorEmitter Saturation Voltage


(IC = 100 mAdc, IB = 10 mAdc)

VCE(sat)

0.5

Vdc

Characteristic

1. Pulse Test: Pulse Width 300 s, D.C. 2%.

DEVICE MARKING

Marking Symbol

ARX

The X represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2717

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

PNP General Purpose Amplifier


Transistor Surface Mount

MSB710-RT1

COLLECTOR
3

Motorola Preferred Device

2
BASE

1
EMITTER

2
1

CASE 318D04, STYLE 1


SC59

MAXIMUM RATINGS (TA = 25C)


Symbol

Value

Unit

CollectorBase Voltage

V(BR)CBO

60

Vdc

CollectorEmitter Voltage

V(BR)CEO

50

Vdc

EmitterBase Voltage

V(BR)EBO

7.0

Vdc

IC

500

mAdc

IC(P)

1.0

Adc

Symbol

Max

Unit

Power Dissipation

PD

200

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ +150

Rating

Collector Current Continuous


Collector Current Peak

THERMAL CHARACTERISTICS
Characteristic

DEVICE MARKING

CRX
The X represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.

Preferred devices are Motorola recommended choices for future use and best overall value.

replaces MSB710QT1/D

2718

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MSB710-RT1
ELECTRICAL CHARACTERISTICS (TA = 25C)
Characteristic

Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage


(IC = 10 mAdc, IB = 0)

V(BR)CEO

50

Vdc

CollectorBase Breakdown Voltage


(IC = 10 Adc, IE = 0)

V(BR)CBO

60

Vdc

EmitterBase Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

7.0

Vdc

ICBO

0.1

Adc

hFE1
hFE2

120
40

240

CollectorEmitter Saturation Voltage


(IC = 300 mAdc, IB = 30 mAdc)

VCE(sat)

0.6

Vdc

CollectorBase Saturation Voltage


(IC = 300 mAdc, IB = 30 mAdc)

VBE(sat)

1.5

Vdc

Cob

15

pF

CollectorBase Cutoff Current


(VCB = 20 Vdc, IE = 0)
DC Current Gain(1)
(VCE = 10 Vdc, IC = 150 mAdc)
(VCE = 10 Vdc, IC = 500 mAdc)

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

1. Pulse Test: Pulse Width 300 s, D.C. 2%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2719

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

PNP Silicon General Purpose


Amplifier Transistor

MSB1218A-RT1
Motorola Preferred Devices

This PNP Silicon Epitaxial Planar Transistor is designed for general purpose
amplifier applications. This device is housed in the SC70/SOT323 package
which is designed for low power surface mount applications.

PNP GENERAL
PURPOSE AMPLIFIER
TRANSISTORS
SURFACE MOUNT

High hFE, 210 460


Low VCE(sat), < 0.5 V
Available in 8 mm, 7inch/3000 Unit Tape and Reel

1
2

CASE 41902, STYLE 3


SC70/SOT323

MAXIMUM RATINGS (TA = 25C)


Symbol

Value

Unit

CollectorBase Voltage

V(BR)CBO

45

Vdc

CollectorEmitter Voltage

V(BR)CEO

45

Vdc

EmitterBase Voltage

V(BR)EBO

7.0

Vdc

IC

100

mAdc

IC(P)

200

mAdc

Rating

Collector Current Continuous


Collector Current Peak

COLLECTOR
3

DEVICE MARKING
MSB1218ART1 = BR

1
BASE

THERMAL CHARACTERISTICS
Rating

Symbol

Max

Unit

Power Dissipation(1)

PD

150

mW

Junction Temperature

TJ

150

Tstg

55 ~ + 150

Storage Temperature Range

2
EMITTER

ELECTRICAL CHARACTERISTICS
Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage (IC = 2.0 mAdc, IB = 0)

Characteristic

V(BR)CEO

45

Vdc

CollectorBase Breakdown Voltage (IC = 10 Adc, IE = 0)

V(BR)CBO

45

Vdc

EmitterBase Breakdown Voltage (IE = 10 Adc, IE = 0)

V(BR)EBO

7.0

Vdc

CollectorBase Cutoff Current (VCB = 20 Vdc, IE = 0)

ICBO

0.1

CollectorEmitter Cutoff Current (VCE = 10 Vdc, IB = 0)

ICEO

100

hFE1

210

340

VCE(sat)

0.5

Vdc

DC Current Gain(2) (VCE = 10 Vdc, IC = 2.0 mAdc)


CollectorEmitter Saturation Voltage(2) (IC = 100 mAdc, IB = 10 mAdc)

1. Device mounted on a FR4 glass epoxy printed circuit board using the minimum recommended footprint.
2. Pulse Test: Pulse Width 300 s, D.C. 2%.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2720

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MSB1218A-RT1
TA = 25C
IC, COLLECTOR CURRENT (mA)

PD , POWER DISSIPATION (MILLIWATTS)

250

200

150

100
RJA = 833C/W

50

0
50

50

100

300 A
250
200

60

150
100

30

IB = 50 A
0

12

TA, AMBIENT TEMPERATURE (C)

VCE, COLLECTOR VOLTAGE (V)

Figure 1. Derating Curve

Figure 2. IC VCE

15

VCE , COLLECTOR-EMITTER VOLTAGE (V)

2
VCE = 10 V
TA = 25C

TA = 75C
DC CURRENT GAIN

90

150

1000

TA = 25C
100

10
0.1

120

10

TA = 25C
1.5

0.5

0
0.01

100

0.1

10

IC, COLLECTOR CURRENT (mA)

IB, BASE CURRENT (mA)

Figure 3. DC Current Gain

Figure 4. Collector Saturation Region

100

900

COLLECTOR VOLTAGE (mV)

800
700
600
500
400
300
TA = 25C
VCE = 5 V

200
100
0
0.2

0.5

10

20

40

60

80

100

150 200

IC, COLLECTOR CURRENT (mA)

Figure 5. On Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2721

13

14

12

12
Cob, CAPACITANCE (pF)

Cib, INPUT CAPACITANCE (pF)

MSB1218A-RT1

11
10
9
8
7
6

10
8
6
4
2

2
VEB (V)

Figure 6. Capacitance

2722

10

20

30

40

VCB (V)

Figure 7. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN RF Amplifier Transistors


Surface Mount

COLLECTOR
3

MSC2295-BT1
MSC2295-CT1
Motorola Preferred Devices

2
BASE

1
EMITTER

2
1

MAXIMUM RATINGS (TA = 25C)


Rating

Symbol

Value

Unit

CollectorBase Voltage

V(BR)CBO

30

Vdc

CollectorEmitter Voltage

V(BR)CEO

20

Vdc

EmitterBase Voltage

V(BR)EBO

5.0

Vdc

IC

30

mAdc

Symbol

Max

Unit

Power Dissipation

PD

200

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ +150

Collector Current Continuous

CASE 318D03, STYLE 1


SC59

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic
CollectorBase Cutoff Current
(VCB = 10 Vdc, IE = 0)
DC Current Gain(1)
(VCB = 10 Vdc, IC = 1.0 mAdc)

Symbol

Min

Max

Unit

ICBO

0.1

Adc

70
110

140
220

fT

150

MHz

Cre

1.5

pF

hFE
MSC2295BT1
MSC2295CT1

CollectorGain Bandwidth Product


(VCB = 10 Vdc, IE = 1.0 mAdc)
Reverse Transistor Capacitance
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 10.7 MHz)

1. Pulse Test: Pulse Width 300 s, D.C. 2%.

DEVICE MARKING
Marking Symbol

VBX

VCX

MSC2295BT1

MSC2295CT1

The X represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2723

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN RF Amplifier Transistor


Surface Mount

MSC3130T1
Motorola Preferred Device

COLLECTOR
3

3
2
1

2
BASE

1
EMITTER

MAXIMUM RATINGS (TA = 25C)


Rating

Symbol

Value

Unit

CollectorBase Voltage

VCBO

15

Vdc

CollectorEmitter Voltage

VCEO

10

Vdc

EmitterBase Voltage

VEBO

3.0

Vdc

IC

50

mAdc

Collector Current Continuous

CASE 318D03, STYLE 1


SC59

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Power Dissipation

Characteristic

PD

200

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ +150

ELECTRICAL CHARACTERISTICS (TA = 25C)


Symbol

Min

Max

Unit

Collector Cutoff Current


(VCB = 10 Vdc, IE = 0)

ICBO

1.0

Adc

CollectorEmitter Breakdown Voltage


(IC = 2.0 mAdc, IB = 0)

VCEO

10

Vdc

EmitterBase Breakdown Voltage


(IE = 10 Adc, IC = 0)

VEBO

3.0

Vdc

DC Current Gain(1)
(VCE = 4.0 Vdc, IC = 5.0 mAdc)

hFE

75

400

CollectorEmitter Saturation Voltage


(IC = 20 mAdc, IB = 4.0 mAdc)

VCE(sat)

0.5

Vdc

CurrentGain Bandwidth Product


(VCB = 4.0 Vdc, IE = 5.0 mAdc)

fT

1.4

2.5

GHz

Characteristic

1. Pulse Test: Pulse Width 300 s, D.C. 2%.

DEVICE MARKING

Marking Symbol

1SX

The X represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.

2724

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN General Purpose Amplifier


Transistors Surface Mount

MSD601-RT1*
MSD601-ST1

COLLECTOR
3

2
BASE

MAXIMUM RATINGS (TA = 25C)

1
EMITTER

2
1

Symbol

Value

Unit

CollectorBase Voltage

V(BR)CBO

60

Vdc

CollectorEmitter Voltage

V(BR)CEO

50

Vdc

EmitterBase Voltage

V(BR)EBO

7.0

Vdc

IC

100

mAdc

IC(P)

200

mAdc

Symbol

Max

Unit

Power Dissipation

PD

200

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ +150

Rating

*Motorola Preferred Device

Collector Current Continuous


Collector Current Peak

CASE 318D03, STYLE 1


SC59

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic

Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage (IC = 2.0 mAdc, IB = 0)

V(BR)CEO

50

Vdc

CollectorBase Breakdown Voltage (IC = 10 Adc, IE = 0)

V(BR)CBO

60

Vdc

EmitterBase Breakdown Voltage (IE = 10 Adc, IC = 0)

V(BR)EBO

7.0

Vdc

CollectorBase Cutoff Current (VCB = 45 Vdc, IE = 0)

ICBO

0.1

Adc

CollectorEmitter Cutoff Current (VCE = 10 Vdc, IB = 0)

ICEO

100

nAdc

DC Current Gain(1)
(VCE = 10 Vdc, IC = 2.0 mAdc)

hFE1
hFE2

210
290
90

340
460

VCE(sat)

0.5

MSD601RT1
MSD601ST1

(VCE = 2.0 Vdc, IC = 100 mAdc)


CollectorEmitter Saturation Voltage (IC = 100 mAdc, IB = 10 mAdc)

Vdc

1. Pulse Test: Pulse Width 300 s, D.C. 2%.

DEVICE MARKING
Marking Symbol

YRX

YSX

MSD601RT1

MSD601ST1

The X represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2725

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN General Purpose Amplifier


Transistor Surface Mount

MSD602-RT1
Motorola Preferred Device

COLLECTOR
3

3
2

2
BASE

MAXIMUM RATINGS (TA = 25C)


Symbol

Value

Unit

CollectorBase Voltage

V(BR)CBO

60

Vdc

CollectorEmitter Voltage

V(BR)CEO

50

Vdc

EmitterBase Voltage

V(BR)EBO

7.0

Vdc

IC

500

mAdc

IC(P)

1.0

Adc

Symbol

Max

Unit

Power Dissipation

PD

200

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ +150

Rating

Collector Current Continuous


Collector Current Peak

1
EMITTER

CASE 318D03, STYLE 1


SC59

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C)


Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage (IC = 10 mAdc, IB = 0)

V(BR)CEO

50

Vdc

CollectorBase Breakdown Voltage (IC = 10 Adc, IE = 0)

V(BR)CBO

60

Vdc

EmitterBase Breakdown Voltage (IE = 10 Adc, IC = 0)

Characteristic

V(BR)EBO

7.0

Vdc

CollectorBase Cutoff Current (VCB = 20 Vdc, IE = 0)

ICBO

0.1

Adc

DC Current Gain(1)
(VCE = 10 Vdc, IC = 150 mAdc)
(VCE = 10 Vdc, IC = 500 mAdc)

hFE1
hFE2

120
40

240

VCE(sat)

0.6

Vdc

Cob

15

pF

CollectorEmitter Saturation Voltage (IC = 300 mAdc, IB = 30 mAdc)


Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
1. Pulse Test: Pulse Width 300 s, D.C. 2%.

DEVICE MARKING

Marking Symbol

WRX

The X represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2726

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN Low Voltage Output


Amplifier Surface Mount

MSD1328-RT1
Motorola Preferred Device

COLLECTOR
3

3
2
1

2
BASE

1
EMITTER

MAXIMUM RATINGS (TA = 25C)


Rating

Symbol

Value

Unit

CollectorBase Voltage

V(BR)CBO

25

Vdc

CollectorEmitter Voltage

V(BR)CEO

20

Vdc

EmitterBase Voltage

V(BR)EBO

12

Vdc

IC

500

mAdc

IC(P)

1000

mAdc

Symbol

Max

Unit

Power Dissipation

PD

200

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ +150

Collector Current Continuous


Collector Current Peak

CASE 318D03, STYLE 1


SC59

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C)


Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

20

Vdc

CollectorBase Breakdown Voltage


(IC = 10 Adc, IE = 0)

V(BR)CBO

25

Vdc

EmitterBase Breakdown Voltage


(IE = 10 Adc, IE = 0)

V(BR)EBO

12

Vdc

CollectorBase Cutoff Current


(VCB = 25 Vdc, IE = 0)
DC Current Gain(1)
(VCE = 2.0 Vdc, IC = 500 mAdc)

ICBO

0.1

Adc

hFE

200

350

CollectorEmitter Saturation Voltage (IC = 500 mAdc, IB = 20 mAdc)

VCE(sat)

0.4

Vdc

BaseEmitter Saturation Voltage (IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

1.2

Vdc

Characteristic

1. Pulse Test: Pulse Width 300 s, D.C. 2%.

DEVICE MARKING

Marking Symbol

1DRX

The X represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2727

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN Silicon General Purpose


Amplifier Transistor

MSD1819A-RT1
Motorola Preferred Devices

This NPN Silicon Epitaxial Planar Transistor is designed for general purpose
amplifier applications. This device is housed in the SC-70/SOT-323 package
which is designed for low power surface mount applications.

NPN GENERAL
PURPOSE AMPLIFIER
TRANSISTORS
SURFACE MOUNT

High hFE, 210 460


Low VCE(sat), < 0.5 V
Available in 8 mm, 7-inch/3000 Unit Tape and Reel

MAXIMUM RATINGS (TA = 25C)


Rating

Symbol

Value

Unit

Collector-Base Voltage

V(BR)CBO

60

Vdc

Collector-Emitter Voltage

V(BR)CEO

50

Vdc

Emitter-Base Voltage

V(BR)EBO

7.0

Vdc

IC

100

mAdc

IC(P)

200

mAdc

Collector Current Continuous


Collector Current Peak

1
2

CASE 41902, STYLE 3


SC70/SOT323

COLLECTOR
3

DEVICE MARKING
MSD1819A-RT1 = ZR

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Power Dissipation(1)

Rating

PD

150

mW

Junction Temperature

TJ

150

Tstg

55 ~ + 150

Storage Temperature Range

1
BASE

2
EMITTER

ELECTRICAL CHARACTERISTICS
Characteristic

Symbol

Min

Max

Unit

Collector-Emitter Breakdown Voltage (IC = 2.0 mAdc, IB = 0)

V(BR)CEO

50

Vdc

Collector-Base Breakdown Voltage (IC = 10 Adc, IE = 0)

V(BR)CBO

60

Vdc

Emitter-Base Breakdown Voltage (IE = 10 Adc, IE = 0)

V(BR)EBO

7.0

Vdc

Collector-Base Cutoff Current (VCB = 20 Vdc, IE = 0)

ICBO

0.1

Collector-Emitter Cutoff Current (VCE = 10 Vdc, IB = 0)

ICEO

100

DC Current Gain(2)
(VCE = 10 Vdc, IC = 2.0 mAdc)
(VCE = 2.0 Vdc, IC = 100 mAdc)

hFE1
hFE2

210
90

340

VCE(sat)

0.5

Collector-Emitter Saturation Voltage(2)


(IC = 100 mAdc, IB = 10 mAdc)

Vdc

1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. Pulse Test: Pulse Width 300 s, D.C. 2%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2728

Motorola SmallSignal Transistors, FETs and Diodes Device Data

250

60
160 A

TA = 25C
IC, COLLECTOR CURRENT (mA)

PD , POWER DISSIPATION (MILLIWATTS)

MSD1819A-RT1

200

150

100

50

0
50

RJA = 833C/W

0
50
100
TA, AMBIENT TEMPERATURE (C)

50

140 A

40

120 A
100 A

30

60 A

20

40 A
10
0

150

80 A

IB = 20 A
0

2
4
6
VCE, COLLECTOR VOLTAGE (V)

Figure 1. Derating Curve

Figure 2. IC VCE

2
VCE , COLLECTOR-EMITTER VOLTAGE (V)

1000
VCE = 10 V

TA = 25C
DC CURRENT GAIN

TA = 75C

TA = 25C
100

10
0.1

TA = 25C
1.5

0.5

0
0.01

1
10
100
IC, COLLECTOR CURRENT (mA)

0.1

Figure 3. DC Current Gain

1
IB, BASE CURRENT (mA)

10

100

Figure 4. Collector Saturation Region

900

COLLECTOR VOLTAGE (mV)

800
700
600
500
400
TA = 25C
VCE = 5 V

300
200
100
0
0.2

0.5

10

20

40

60

80

100

150 200

IC, COLLECTOR CURRENT (mA)

Figure 5. On Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2729

MSD1819A-RT1
7
6

18
Cob, CAPACITANCE (pF)

Cib, INPUT CAPACITANCE (pF)

20

16

14

12

10

5
4
3
2

2730

10

20

VEB (V)

VCB (V)

Figure 6. Capacitance

Figure 7. Capacitance

30

40

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Bias Resistor Transistor

MUN2111T1
SERIES

PNP Silicon Surface Mount Transistor with


Monolithic Bias Resistor Network

Motorola Preferred Devices

This new series of digital transistors is designed to replace a single device and its
external resistor bias network. The BRT (Bias Resistor Transistor) contains a single
transistor with a monolithic bias network consisting of two resistors; a series base
resistor and a baseemitter resistor. The BRT eliminates these individual components
by integrating them into a single device. The use of a BRT can reduce both system
cost and board space. The device is housed in the SC59 package which is designed
for low power surface mount applications.
Simplifies Circuit Design

PNP SILICON
BIAS RESISTOR
TRANSISTOR

PIN3
COLLECTOR
(OUTPUT)

Reduces Board Space


Reduces Component Count

R1

The SC59 package can be soldered using wave or reflow.


PIN2
The modified gullwinged leads absorb thermal stress duringBASE R2
soldering eliminating the possibility of damage to the die.
(INPUT)
Available in 8 mm embossed tape and reel
Use the Device Number to order the 7 inch/3000 unit reel.

3
2
1

PIN1
EMITTER
(GROUND)

CASE 318D03, STYLE 1


(SC59)

MAXIMUM RATINGS (TA = 25C unless otherwise noted)


Symbol

Value

Unit

CollectorBase Voltage

Rating

VCBO

50

Vdc

CollectorEmitter Voltage

VCEO

50

Vdc

Collector Current

IC

100

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

*200
1.6

mW
mW/C

RJA

625

C/W

TJ, Tstg

65 to +150

TL

260
10

C
Sec

THERMAL CHARACTERISTICS
Thermal Resistance JunctiontoAmbient (surface mounted)
Operating and Storage Temperature Range
Maximum Temperature for Soldering Purposes,
Time in Solder Bath

DEVICE MARKING AND RESISTOR VALUES


Device

Marking

R1 (K)

R2 (K)

MUN2111T1
MUN2112T1
MUN2113T1
MUN2114T1
MUN2115T1(2)
MUN2116T1(2)
MUN2130T1(2)
MUN2131T1(2)
MUN2132T1(2)
MUN2133T1(2)
MUN2134T1(2)

6A
6B
6C
6D
6E
6F
6G
6H
6J
6K
6L

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22

10
22
47
47

1.0
2.2
4.7
47
47

1. Device mounted on a FR4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 5

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2731

MUN2111T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Symbol

Min

Typ

Max

Unit

CollectorBase Cutoff Current (VCB = 50 V, IE = 0)

ICBO

100

nAdc

CollectorEmitter Cutoff Current (VCE = 50 V, IB = 0)

ICEO

500

nAdc

EmitterBase Cutoff Current


(VEB = 6.0 V, IC = 0)

IEBO

0.5
0.2
0.1
0.2
0.9
1.9
4.3
2.3
1.5
0.18
0.13

mAdc

CollectorBase Breakdown Voltage (IC = 10 A, IE = 0)

V(BR)CBO

50

Vdc

CollectorEmitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0)

V(BR)CEO

50

Vdc

hFE

35
60
80
80
160
160
3.0
8.0
15
80
80

60
100
140
140
250
250
5.0
15
27
140
130

MUN2111T1
MUN2112T1
MUN2113T1
MUN2114T1
MUN2115T1
MUN2130T1

0.25
0.25
0.25
0.25
0.25
0.25

MUN2131T1

0.25

MUN2116T1
MUN2132T1
MUN2134T1

0.25
0.25
0.25

0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2

Characteristic

OFF CHARACTERISTICS

MUN2111T1
MUN2112T1
MUN2113T1
MUN2114T1
MUN2115T1
MUN2116T1
MUN2130T1
MUN2131T1
MUN2132T1
MUN2133T1
MUN2134T1

ON CHARACTERISTICS(3)
DC Current Gain
(VCE = 10 V, IC = 5.0 mA)

CollectorEmitter Saturation Voltage


(IC = 10 mA, IB = 0.3 mA)

(IC = 10 mA, IB = 5.0 mA)


(IC = 10 mA, IB = 1.0 mA)

Output Voltage (on)


(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k)

(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 k)

MUN2111T1
MUN2112T1
MUN2113T1
MUN2114T1
MUN2115T1
MUN2116T1
MUN2130T1
MUN2131T1
MUN2132T1
MUN2133T1
MUN2134T1

VCE(sat)

Vdc

VOL
MUN2111T1
MUN2112T1
MUN2114T1
MUN2115T1
MUN2116T1
MUN2130T1
MUN2131T1
MUN2132T1
MUN2133T1
MUN2134T1
MUN2113T1

Vdc

3. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%

2732

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN2111T1 SERIES
ELECTRICAL CHARACTERISTICS (Continued) (TA = 25C unless otherwise noted)
Characteristic
Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k)
(VCC = 5.0 V, VB = 0.050 V, RL = 1.0 k) MUN2130T1
(VCC = 5.0 V, VB = 0.25 V, RL = 1.0 k) MUN2115T1
MUN2116T1
MUN2131T1
MUN2132T1
Input Resistor

Resistor Ratio

Symbol

Min

Typ

Max

Unit

VOH

4.9

Vdc

R1

7.0
15.4
32.9
7.0
7.0
3.3
0.7
1.5
3.3
3.3
15.4

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22

13
28.6
61.1
13
13
6.1
1.3
2.9
6.1
6.1
28.6

R1/R2

0.8
0.17

0.8
0.055
0.38

1.0
0.21

1.0
0.1
0.47

1.2
0.25

1.2
0.185
0.56

MUN2111T1
MUN2112T1
MUN2113T1
MUN2114T1
MUN2115T1
MUN2116T1
MUN2130T1
MUN2131T1
MUN2132T1
MUN2133T1
MUN2134T1
MUN2111T1/MUN2112T1/MUN2113T1
MUN2114T1
MUN2115T1/MUN2116T1
MUN2130T1/MUN2131T1/MUN2132T1
MUN2133T1
MUN2134T1

PD , POWER DISSIPATION (MILLIWATTS)

250

200

150

100

50

0
50

RJA = 625C/W

0
50
100
TA, AMBIENT TEMPERATURE (C)

150

Figure 1. Derating Curve

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2733

MUN2111T1 SERIES

1000

1
hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN2111T1

IC/IB = 10
TA = 25C

25C
75C

0.1

0.01
0

20

40
60
IC, COLLECTOR CURRENT (mA)

VCE = 10 V

TA = 75C
25C
100

10

80

25C

10
IC, COLLECTOR CURRENT (mA)

Figure 2. VCE(sat) versus IC

Figure 3. DC Current Gain

100

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

Figure 4. Output Capacitance

25C

75C

f = 1 MHz
lE = 0 V
TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

100

TA = 25C

10

0.1

0.01
0.001

VO = 5 V
0

6
7
3
4
5
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 5. Output Current versus Input Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C

10

25C
75C
1

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 6. Input Voltage versus Output Current

2734

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN2111T1 SERIES

1000

10
hFE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN2112T1

IC/IB = 10
TA = 25C
25C
1

75C

0.1

0.01

VCE = 10 V

TA = 75C
25C
25C

100

10
0

20
40
60
IC, COLLECTOR CURRENT (mA)

10

80

Figure 7. VCE(sat) versus IC

Figure 8. DC Current Gain

100

25C

75C

f = 1 MHz
lE = 0 V
TA = 25C

TA = 25C
IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

100

IC, COLLECTOR CURRENT (mA)

10

0.1

0.01
VO = 5 V

0.001

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

Figure 9. Output Capacitance

3
4
5
6
7
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 10. Output Current versus Input Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C
10

25C

75C

0.1

10

20

30

40

50

IC, COLLECTOR CURRENT (mA)

Figure 11. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2735

MUN2111T1 SERIES

1000
IC/IB = 10

TA = 25C

hFE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN2113T1

25C

75C
0.1

0.01

10
20
30
IC, COLLECTOR CURRENT (mA)

TA = 75C
25C
25C
100

10

40

10
IC, COLLECTOR CURRENT (mA)

Figure 12. VCE(sat) versus IC

Figure 13. DC Current Gain

100

Cob , CAPACITANCE (pF)

IC, COLLECTOR CURRENT (mA)

f = 1 MHz
lE = 0 V
TA = 25C

0.8

0.6

0.4

0.2

100

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

25C

TA = 75C

25C

10
1

0.1

0.01

0.001

Figure 14. Output Capacitance

VO = 5 V
0

3
4
5
6
7
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 15. Output Current versus Input Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C

25C
75C

10

0.1

10

20
30
40
IC, COLLECTOR CURRENT (mA)

50

Figure 16. Input Voltage versus Output Current

2736

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN2111T1 SERIES

180

1
IC/IB = 10

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN2114T1

TA = 25C
25C

0.1

75C

0.01

0.001

20
40
60
IC, COLLECTOR CURRENT (mA)

25C
140
25C

120
100
80
60
40
20
0

80

TA = 75C

VCE = 10 V

160

Figure 17. VCE(sat) versus IC

100
f = 1 MHz
lE = 0 V
TA = 25C

3.5

TA = 75C
IC, COLLECTOR CURRENT (mA)

4
Cob , CAPACITANCE (pF)

90 100

Figure 18. DC Current Gain

4.5

3
2.5
2
1.5
1
0.5
0

8 10 15 20 40 50 60 70 80
IC, COLLECTOR CURRENT (mA)

6 8 10 15 20 25 30 35
VR, REVERSE BIAS VOLTAGE (VOLTS)

40

45

50

Figure 19. Output Capacitance

25C
25C

10

VO = 5 V
1

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 20. Output Current versus Input Voltage

+12 V

10
VO = 0.2 V

TA = 25C

V in , INPUT VOLTAGE (VOLTS)

25C

Typical Application
for PNP BRTs

75C
1

LOAD
0.1

10

20
30
40
IC, COLLECTOR CURRENT (mA)

50

Figure 21. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 22. Inexpensive, Unregulated Current Source

2737

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Bias Resistor Transistor

MUN2211T1
SERIES

NPN Silicon Surface Mount Transistor with


Monolithic Bias Resistor Network

Motorola Preferred Devices

This new series of digital transistors is designed to replace a single device and its
external resistor bias network. The BRT (Bias Resistor Transistor) contains a single
transistor with a monolithic bias network consisting of two resistors; a series base
resistor and a baseemitter resistor. The BRT eliminates these individual components
by integrating them into a single device. The use of a BRT can reduce both system
cost and board space. The device is housed in the SC59 package which is designed
for low power surface mount applications.

NPN SILICON
BIAS RESISTOR
TRANSISTOR

Simplifies Circuit Design


Reduces Board Space
Reduces Component Count

PIN3
COLLECTOR
(OUTPUT)

The SC59 package can be soldered using wave or reflow.


The modified gullwinged leads absorb thermal stress during
soldering eliminating the possibility of damage to the die.
Available in 8 mm embossed tape and reel
Use the Device Number to order the 7 inch/3000 unit reel.

R1
2

PIN2 R2
BASE
(INPUT)

CASE 318D03, STYLE 1


(SC59)

PIN1
EMITTER
(GROUND)

MAXIMUM RATINGS (TA = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

CollectorBase Voltage

VCBO

50

Vdc

CollectorEmitter Voltage

VCEO

50

Vdc

Collector Current

IC

100

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

*200
1.6

mW
mW/C

RJA

625

C/W

TJ, Tstg

65 to +150

TL

260
10

C
Sec

THERMAL CHARACTERISTICS
Thermal Resistance JunctiontoAmbient (surface mounted)
Operating and Storage Temperature Range
Maximum Temperature for Soldering Purposes,
Time in Solder Bath

DEVICE MARKING AND RESISTOR VALUES


Device

Marking

R1 (K)

R2 (K)

MUN2211T1
MUN2212T1
MUN2213T1
MUN2214T1
MUN2215T1(2)
MUN2216T1(2)
MUN2230T1(2)
MUN2231T1(2)
MUN2232T1(2)
MUN2233T1(2)
MUN2234T1(2)

8A
8B
8C
8D
8E
8F
8G
8H
8J
8K
8L

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22

10
22
47
47

1.0
2.2
4.7
47
47

1. Device mounted on a FR4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 4

2738

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN2211T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Symbol

Min

Typ

Max

Unit

CollectorBase Cutoff Current (VCB = 50 V, IE = 0)

ICBO

100

nAdc

CollectorEmitter Cutoff Current (VCE = 50 V, IB = 0)

ICEO

500

nAdc

EmitterBase Cutoff Current


(VEB = 6.0 V, IC = 0)

IEBO

0.5
0.2
0.1
0.2
0.9
1.9
4.3
2.3
1.5
0.18
0.13

mAdc

CollectorBase Breakdown Voltage (IC = 10 A, IE = 0)

V(BR)CBO

50

Vdc

CollectorEmitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0)

V(BR)CEO

50

Vdc

hFE

35
60
80
80
160
160
3.0
8.0
15
80
80

60
100
140
140
350
350
5.0
15
30
200
150

VCE(sat)

0.25

0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2

Characteristic

OFF CHARACTERISTICS

MUN2211T1
MUN2212T1
MUN2213T1
MUN2214T1
MUN2215T1
MUN2216T1
MUN2230T1
MUN2231T1
MUN2232T1
MUN2233T1
MUN2234T1

ON CHARACTERISTICS(3)
DC Current Gain
(VCE = 10 V, IC = 5.0 mA)

MUN2211T1
MUN2212T1
MUN2213T1
MUN2214T1
MUN2215T1
MUN2216T1
MUN2230T1
MUN2231T1
MUN2232T1
MUN2233T1
MUN2234T1

CollectorEmitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA)


(IC = 10 mA, IB = 5 mA) MUN2230T1/MUN2231T1
(IC = 10 mA, IB = 1 mA) MUN2215T1/MUN2216T1/
MUN2232T1/MUN2233T1/MUN2234T1
Output Voltage (on)
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k)

(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 k)

VOL
MUN2211T1
MUN2212T1
MUN2214T1
MUN2215T1
MUN2216T1
MUN2230T1
MUN2231T1
MUN2232T1
MUN2233T1
MUN2234T1
MUN2213T1

Vdc

Vdc

Vdc

3. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2739

MUN2211T1 SERIES
ELECTRICAL CHARACTERISTICS (Continued) (TA = 25C unless otherwise noted)
Characteristic
Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k)
(VCC = 5.0 V, VB = 0.050 V, RL = 1.0 k) MUN2230T1
(VCC = 5.0 V, VB = 0.25 V, RL = 1.0 k) MUN2215T1
MUN2216T1
MUN2233T1
Input Resistor

MUN2211T1
MUN2212T1
MUN2213T1
MUN2214T1
MUN2215T1
MUN2216T1
MUN2230T1
MUN2231T1
MUN2232T1
MUN2233T1
MUN2234T1

Resistor Ratio

MUN2211T1/MUN2212T1/MUN2213T1
MUN2214T1
MUN2215T1/MUN2216T1
MUN2230T1/MUN2231T1/MUN2232T1
MUN2233T1
MUN2234T1

Symbol

Min

Typ

Max

Unit

VOH

4.9

Vdc

R1

7.0
15.4
32.9
7.0
7.0
3.3
0.7
1.5
3.3
3.3
15.4

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22

13
28.6
61.1
13
13
6.1
1.3
2.9
6.1
6.1
28.6

R1/R2

0.8
0.17

0.8
0.055
0.38

1.0
0.21

1.0
0.1
0.47

1.2
0.25

1.2
0.185
0.56

PD , POWER DISSIPATION (MILLIWATTS)

250

200

150

100
RJA = 625C/W
50

0
50

0
50
100
TA, AMBIENT TEMPERATURE (C)

150

Figure 1. Derating Curve

2740

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN2211T1 SERIES

1000
hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN2211T1

IC/IB = 10
TA = 25C
25C
75C

0.1

0.01

0.001

20
40
60
IC, COLLECTOR CURRENT (mA)

VCE = 10 V
TA = 75C
25C
25C
100

10

80

10
IC, COLLECTOR CURRENT (mA)

Figure 2. VCE(sat) versus IC

Figure 3. DC Current Gain

100

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

25C
75C

f = 1 MHz
IE = 0 V
TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

100

Figure 4. Output Capacitance

TA = 25C

10

0.1

0.01

0.001

VO = 5 V
0

5
6
7
3
4
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 5. Output Current versus Input Voltage

10
TA = 25C

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

25C
75C

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 6. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2741

MUN2211T1 SERIES

1000

1
IC/IB = 10

hFE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN2212T1

TA = 25C
25C
75C

0.1

0.01

VCE = 10 V
TA = 75C
25C
25C
100

10

0.001
0

20
40
60
IC, COLLECTOR CURRENT (mA)

80

IC, COLLECTOR CURRENT (mA)

Figure 7. VCE(sat) versus IC

Figure 8. DC Current Gain

100
f = 1 MHz
IE = 0 V
TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

100

10

75C

25C
TA = 25C

10

0.1

0.01
VO = 5 V

10

20

30

40

50

0.001

10

VR, REVERSE BIAS VOLTAGE (VOLTS)

Vin, INPUT VOLTAGE (VOLTS)

Figure 9. Output Capacitance

Figure 10. Output Current versus Input Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C
10
75C

25C

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 11. Input Voltage versus Output Current

2742

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN2211T1 SERIES

10
IC/IB = 10

1000

TA = 25C
25C

hFE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN2213T1

75C

0.1

0.01
0

20
40
60
IC, COLLECTOR CURRENT (mA)

VCE = 10 V
TA = 75C
25C
25C
100

10

80

10

Figure 12. VCE(sat) versus IC

Figure 13. DC Current Gain

100

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

0.6

0.4

TA = 25C

10

0.1

0.01

0.2

25C

75C

f = 1 MHz
IE = 0 V
TA = 25C

0.8

100

IC, COLLECTOR CURRENT (mA)

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

VO = 5 V

0.001

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 15. Output Current versus Input Voltage

Figure 14. Output Capacitance

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C
10

25C
75C

0.1
0

10

20
30
40
IC, COLLECTOR CURRENT (mA)

50

Figure 16. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2743

MUN2211T1 SERIES

300

1
TA = 25C

IC/IB = 10

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN2214T1

25C
0.1
75C

0.01

0.001

20
40
60
IC, COLLECTOR CURRENT (mA)

25C
200
25C
150
100
50
0

80

TA = 75C

VCE = 10

250

Figure 17. VCE(sat) versus IC

100
75C

IC, COLLECTOR CURRENT (mA)

f = 1 MHz
lE = 0 V
TA = 25C

3.5
Cob , CAPACITANCE (pF)

90 100

Figure 18. DC Current Gain

2.5
2
1.5
1
0.5
0

8 10 15 20 40 50 60 70 80
IC, COLLECTOR CURRENT (mA)

6 8 10 15 20 25 30 35 40
VR, REVERSE BIAS VOLTAGE (VOLTS)

Figure 19. Output Capacitance

45

50

25C

TA = 25C
10

VO = 5 V
1

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 20. Output Current versus Input Voltage

10

V in , INPUT VOLTAGE (VOLTS)

VO= 0.2 V

TA = 25C

25C
75C
1

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 21. Input Voltage versus Output Current

2744

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN2211T1 SERIES
TYPICAL APPLICATIONS FOR NPN BRTs
+12 V

ISOLATED
LOAD

FROM P OR
OTHER LOGIC

Figure 22. Level Shifter: Connects 12 or 24 Volt Circuits to Logic

+12 V

VCC

OUT
IN
LOAD

Figure 23. Open Collector Inverter: Inverts the Input Signal

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 24. Inexpensive, Unregulated Current Source

2745

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MUN5111DW1T1
SERIES

Dual Bias Resistor Transistors


PNP Silicon Surface Mount Transistors with
Monolithic Bias Resistor Network

Motorola Preferred Devices

The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic
bias network consisting of two resistors; a series base resistor and a baseemitter
resistor. These digital transistors are designed to replace a single device and its
external resistor bias network. The BRT eliminates these individual components by
integrating them into a single device. In the MUN5111DW1T1 series, two BRT devices
are housed in the SOT363 package which is ideal for lowpower surface mount
applications where board space is at a premium.

5
4

CASE 419B01, STYLE 1


SOT363

Simplifies Circuit Design


Reduces Board Space
Reduces Component Count

(3)

Available in 8 mm, 7 inch/3000 Unit Tape and Reel.

(2)
R1

(1)
R2

Q1
Q2
R2
(4)

R1
(5)

(6)

MAXIMUM RATINGS (TA = 25C unless otherwise noted, common for Q1 and Q2)
Symbol

Value

Unit

CollectorBase Voltage

VCBO

50

Vdc

CollectorEmitter Voltage

VCEO

50

Vdc

IC

100

mAdc

RJA

833

C/W

Operating and Storage Temperature Range

TJ, Tstg

65 to +150

Total Package Dissipation @ TA = 25C(1)

PD

*150

mW

Rating

Collector Current

THERMAL CHARACTERISTICS
Thermal Resistance JunctiontoAmbient (surface mounted)

DEVICE MARKING AND RESISTOR VALUES: MUN5111DW1T1 SERIES


Device
MUN5111DW1T1
MUN5112DW1T1
MUN5113DW1T1
MUN5114DW1T1
MUN5115DW1T1(2)
MUN5116DW1T1(2)
MUN5130DW1T1(2)
MUN5131DW1T1(2)
MUN5132DW1T1(2)
MUN5133DW1T1(2)
MUN5134DW1T1(2)
MUN5135DW1T1(2)

Marking

R1 (K)

R2 (K)

0A
0B
0C
0D
0E
0F
0G
0H
0J
0K
0L
0M

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22
2.2

10
22
47
47

1.0
2.2
4.7
47
47
47

1. Device mounted on a FR4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New resistor combinations. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2746

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5111DW1T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, common for Q1 and Q2)
Characteristic

Symbol

Min

Typ

Max

Unit

CollectorBase Cutoff Current (VCB = 50 V, IE = 0)

ICBO

100

nAdc

CollectorEmitter Cutoff Current (VCE = 50 V, IB = 0)

ICEO

500

nAdc

EmitterBase Cutoff Current


(VEB = 6.0 V, IC = 0)

IEBO

0.5
0.2
0.1
0.2
0.9
1.9
4.3
2.3
1.5
0.18
0.13
0.2

mAdc

CollectorBase Breakdown Voltage (IC = 10 A, IE = 0)

V(BR)CBO

50

Vdc

CollectorEmitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0)

V(BR)CEO

50

Vdc

hFE

35
60
80
80
160
160
3.0
8.0
15
80
80
80

60
100
140
140
250
250
5.0
15
27
140
130
140

VCE(sat)

0.25

0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2

OFF CHARACTERISTICS

MUN5111DW1T1
MUN5112DW1T1
MUN5113DW1T1
MUN5114DW1T1
MUN5115DW1T1
MUN5116DW1T1
MUN5130DW1T1
MUN5131DW1T1
MUN5132DW1T1
MUN5133DW1T1
MUN5134DW1T1
MUN5135DW1T1

ON CHARACTERISTICS(3)
DC Current Gain
(VCE = 10 V, IC = 5.0 mA)

MUN5111DW1T1
MUN5112DW1T1
MUN5113DW1T1
MUN5114DW1T1
MUN5115DW1T1
MUN5116DW1T1
MUN5130DW1T1
MUN5131DW1T1
MUN5132DW1T1
MUN5133DW1T1
MUN5134DW1T1
MUN5135DW1T1

CollectorEmitter Saturation Voltage (IC = 10 mA, IE = 0.3 mA)


(IC = 10 mA, IB = 5 mA) MUN5130DW1T1/MUN5131DW1T1
(IC = 10 mA, IB = 1 mA) MUN5115DW1T1/MUN5116DW1T1/
MUN5132DW1T1/MUN5133DW1T1/MUN5134DW1T1
Output Voltage (on)
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k) MUN5111DW1T1
MUN5112DW1T1
MUN5114DW1T1
MUN5115DW1T1
MUN5116DW1T1
MUN5130DW1T1
MUN5131DW1T1
MUN5132DW1T1
MUN5133DW1T1
MUN5134DW1T1
MUN5135DW1T1
(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 k) MUN5113DW1T1

VOL

Vdc

Vdc

3. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2747

MUN5111DW1T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, common for Q1 and Q2) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

VOH

4.9

Vdc

R1

7.0
15.4
32.9
7.0
7.0
3.3
0.7
1.5
3.3
3.3
15.4
1.54

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22
2.2

13
28.6
61.1
13
13
6.1
1.3
2.9
6.1
6.1
28.6
2.86

R1/R2

0.8
0.17

0.8
0.055
0.38
0.038

1.0
0.21

1.0
0.1
0.47
0.047

1.2
0.25

1.2
0.185
0.56
0.056

Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k)


(VCC = 5.0 V, VB = 0.050 V, RL = 1.0 k) MUN5130DW1T1
(VCC = 5.0 V, VB = 0.25 V, RL = 1.0 k) MUN5115DW1T1
MUN5116DW1T1
MUN5131DW1T1
MUN5132DW1T1
Input Resistor

MUN5111DW1T1
MUN5112DW1T1
MUN5113DW1T1
MUN5114DW1T1
MUN5115DW1T1
MUN5116DW1T1
MUN5130DW1T1
MUN5131DW1T1
MUN5132DW1T1
MUN5133DW1T1
MUN5134DW1T1
MUN5135DW1T1

Resistor Ratio MUN5111DW1T1/MUN5112DW1T1/MUN5113DW1T1


MUN5114DW1T1
MUN5115DW1T1/MUN5116DW1T1
MUN5130DW1T1/MUN5131DW1T1/MUN5132DW1T1
MUN5133DW1T1
MUN5134DW1T1
MUN5135DW1T1

PD , POWER DISSIPATION (MILLIWATTS)

250

200

150

100

50

0
50

RJA = 833C/W

0
50
100
TA, AMBIENT TEMPERATURE (C)

150

Figure 1. Derating Curve

2748

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5111DW1T1 SERIES

1000

1
hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5111DW1T1

IC/IB = 10

TA = 25C
0.1
25C
75C

0.01
0

20

100

25C

IC, COLLECTOR CURRENT (mA)

10
IC, COLLECTOR CURRENT (mA)

Figure 2. VCE(sat) versus IC

Figure 3. DC Current Gain

50

100

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

Figure 4. Output Capacitance

100

25C

75C

f = 1 MHz
lE = 0 V
TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

TA = 75C
25C

10

40

VCE = 10 V

TA = 25C

10

0.1

0.01
0.001

VO = 5 V
0

6
7
3
4
5
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 5. Output Current versus Input Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C

10

25C
75C

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 6. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2749

MUN5111DW1T1 SERIES

1000

10
IC/IB = 10

25C
TA = 25C
75C

0.1

0.01

VCE = 10 V

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5112DW1T1

TA = 75C
25C
25C

100

10
0

20
IC, COLLECTOR CURRENT (mA)

40

50

10

Figure 7. VCE(sat) versus IC

Figure 8. DC Current Gain

100

25C

75C

f = 1 MHz
lE = 0 V
TA = 25C

TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

100

IC, COLLECTOR CURRENT (mA)

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

10

0.1

0.01
0.001

Figure 9. Output Capacitance

VO = 5 V
0

3
4
5
6
7
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 10. Output Current versus Input Voltage

100
V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C
10

25C
75C

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 11. Input Voltage versus Output Current

2750

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5111DW1T1 SERIES

1000
IC/IB = 10

TA = 25C

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5113DW1T1

25C

75C
0.1

0.01

10
20
30
IC, COLLECTOR CURRENT (mA)

TA = 75C
25C
25C

100

10

40

10
IC, COLLECTOR CURRENT (mA)

Figure 12. VCE(sat) versus IC

Figure 13. DC Current Gain

100

Cob , CAPACITANCE (pF)

IC, COLLECTOR CURRENT (mA)

f = 1 MHz
lE = 0 V
TA = 25C

0.8

0.6

0.4

0.2

100

25C

10
1

0.1

0.01

0.001

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

25C

TA = 75C

Figure 14. Output Capacitance

VO = 5 V
0

3
4
5
6
7
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 15. Output Current versus Input Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C

25C
75C

10

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 16. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2751

MUN5111DW1T1 SERIES

180
IC/IB = 10

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5114DW1T1

TA = 25C
25C

0.1

75C

0.01

0.001

20
40
60
IC, COLLECTOR CURRENT (mA)

25C
140
25C

120
100
80
60
40
20
0

80

TA = 75C

VCE = 10 V

160

Figure 17. VCE(sat) versus IC

100
TA = 75C

3.5

IC, COLLECTOR CURRENT (mA)

f = 1 MHz
lE = 0 V
TA = 25C

4
Cob , CAPACITANCE (pF)

80 90 100

Figure 18. DC Current Gain

4.5

3
2.5
2
1.5
1
0.5
0

8 10 15 20 40 50 60 70
IC, COLLECTOR CURRENT (mA)

6 8 10 15 20 25 30 35 40
VR, REVERSE BIAS VOLTAGE (VOLTS)

45

25C
10

VO = 5 V
1

50

Figure 19. Output Capacitance

25C

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 20. Output Current versus Input Voltage

10

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

25C
TA = 25C
75C

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 21. Input Voltage versus Output Current

2752

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5111DW1T1 SERIES
TYPICAL ELECTRICAL CHARACTERISTICS MUN5115DW1T1

HFE, DC CURRENT GAIN (NORMALIZED)

1000
TA = 25C

VCE = 10 V

VCE = 5.0 V

100
1.0

10
IC, COLLECTOR CURRENT (mA)

100

Figure 22. DC Current Gain

TYPICAL ELECTRICAL CHARACTERISTICS MUN5116DW1T1

HFE, DC CURRENT GAIN (NORMALIZED)

1000
TA = 25C

VCE = 10 V

VCE = 5.0 V
100
1.0

10
IC, COLLECTOR CURRENT (mA)

100

Figure 23. DC Current Gain

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2753

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Bias Resistor Transistor

MUN5111T1
SERIES

PNP Silicon Surface Mount Transistor with


Monolithic Bias Resistor Network

Motorola Preferred Devices

This new series of digital transistors is designed to replace a single device and its
external resistor bias network. The BRT (Bias Resistor Transistor) contains a single
transistor with a monolithic bias network consisting of two resistors; a series base
resistor and a baseemitter resistor. The BRT eliminates these individual components
by integrating them into a single device. The use of a BRT can reduce both system
cost and board space. The device is housed in the SC70/SOT323 package which
is designed for low power surface mount applications.

PNP SILICON
BIAS RESISTOR
TRANSISTOR

Simplifies Circuit Design


Reduces Board Space
Reduces Component Count
The SC70/SOT323 package can be soldered using
wave or reflow. The modified gullwinged leads absorb
thermal stress during soldering eliminating the possibility
of damage to the die.
Available in 8 mm embossed tape and reel
Use the Device Number to order the 7 inch/3000 unit reel.
Replace T1 with T3 in the Device Number to order
the 13 inch/10,000 unit reel.

PIN3
COLLECTOR
(OUTPUT)
3

R1
PIN1 R2
BASE
(INPUT)

1
2
PIN2
EMITTER
(GROUND)

CASE 41902, STYLE 3


SC70/SOT323

MAXIMUM RATINGS (TA = 25C unless otherwise noted)


Symbol

Value

Unit

CollectorBase Voltage

VCBO

50

Vdc

CollectorEmitter Voltage

VCEO

50

Vdc

Collector Current

IC

100

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

*150
1.2

mW
mW/C

Rating

THERMAL CHARACTERISTICS
Thermal Resistance JunctiontoAmbient (surface mounted)
Operating and Storage Temperature Range
Maximum Temperature for Soldering Purposes,
Time in Solder Bath

RJA

833

C/W

TJ, Tstg

65 to +150

TL

260
10

C
Sec

DEVICE MARKING AND RESISTOR VALUES


Device
MUN5111T1
MUN5112T1
MUN5113T1
MUN5114T1
MUN5115T1(2)
MUN5116T1(2)
MUN5130T1(2)
MUN5131T1(2)
MUN5132T1(2)
MUN5133T1(2)
MUN5134T1(2)

Marking

R1 (K)

R2 (K)

6A
6B
6C
6D
6E
6F
6G
6H
6J
6K
6L

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22

10
22
47
47

1.0
2.2
4.7
47
47

1. Device mounted on a FR4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2754

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5111T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

CollectorBase Cutoff Current (VCB = 50 V, IE = 0)

ICBO

100

nAdc

CollectorEmitter Cutoff Current (VCE = 50 V, IB = 0)

ICEO

500

nAdc

EmitterBase Cutoff Current


(VEB = 6.0 V, IC = 0)

IEBO

0.5
0.2
0.1
0.2
0.9
1.9
4.3
2.3
1.5
0.18
0.13

mAdc

CollectorBase Breakdown Voltage (IC = 10 A, IE = 0)

V(BR)CBO

50

Vdc

CollectorEmitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0)

V(BR)CEO

50

Vdc

hFE

35
60
80
80
160
160
3.0
8.0
15
80
80

60
100
140
140
250
250
5.0
15
27
140
130

VCE(sat)

0.25

0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2

OFF CHARACTERISTICS

MUN5111T1
MUN5112T1
MUN5113T1
MUN5114T1
MUN5115T1
MUN5116T1
MUN5130T1
MUN5131T1
MUN5132T1
MUN5133T1
MUN5134T1

ON CHARACTERISTICS(3)
DC Current Gain
(VCE = 10 V, IC = 5.0 mA)

MUN5111T1
MUN5112T1
MUN5113T1
MUN5114T1
MUN5115T1
MUN5116T1
MUN5130T1
MUN5131T1
MUN5132T1
MUN5133T1
MUN5134T1

CollectorEmitter Saturation Voltage (IC = 10 mA, IE = 0.3 mA)


(IC = 10 mA, IB = 5 mA) MUN5130T1/MUN5131T1
(IC = 10 mA, IB = 1 mA) MUN5115T1/MUN5116T1/
MUN5132T1/MUN5133T1/MUN5134T1
Output Voltage (on)
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k)

(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 k)

VOL
MUN5111T1
MUN5112T1
MUN5114T1
MUN5115T1
MUN5116T1
MUN5130T1
MUN5131T1
MUN5132T1
MUN5133T1
MUN5134T1
MUN5113T1

Vdc

Vdc

3. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2755

MUN5111T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k)


(VCC = 5.0 V, VB = 0.050 V, RL = 1.0 k) MUN5130T1
(VCC = 5.0 V, VB = 0.25 V, RL = 1.0 k)
MUN5115T1
MUN5116T1
MUN5131T1
MUN5132T1

VOH

4.9

Vdc

R1

7.0
15.4
32.9
7.0
7.0
3.3
0.7
1.5
3.3
3.3
15.4

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22

13
28.6
61.1
13
13
6.1
1.3
2.9
6.1
6.1
28.6

R1/R2

0.8
0.17

0.8
0.055
0.38

1.0
0.21

1.0
0.1
0.47

1.2
0.25

1.2
0.185
0.56

Input Resistor

MUN5111T1
MUN5112T1
MUN5113T1
MUN5114T1
MUN5115T1
MUN5116T1
MUN5130T1
MUN5131T1
MUN5132T1
MUN5133T1
MUN5134T1

Resistor Ratio

MUN5111T1/MUN5112T1/MUN5113T1
MUN5114T1
MUN5115T1/MUN5116T1
MUN5130T1/MUN5131T1/MUN5132T1
MUN5133T1
MUN5134T1

PD , POWER DISSIPATION (MILLIWATTS)

250

200

150

100

50

0
50

RJA = 833C/W

0
50
100
TA, AMBIENT TEMPERATURE (C)

150

Figure 1. Derating Curve

2756

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5111T1 SERIES

1000

1
hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5111T1

IC/IB = 10

TA = 25C
0.1
25C
75C

0.01
0

20

100

25C

IC, COLLECTOR CURRENT (mA)

10
IC, COLLECTOR CURRENT (mA)

Figure 2. VCE(sat) versus IC

Figure 3. DC Current Gain

50

100

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

Figure 4. Output Capacitance

100

25C

75C

f = 1 MHz
lE = 0 V
TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

TA = 75C
25C

10

40

VCE = 10 V

TA = 25C

10

0.1

0.01
0.001

VO = 5 V
0

6
7
3
4
5
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 5. Output Current versus Input Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C

10

25C
75C

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 6. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2757

MUN5111T1 SERIES

1000

10
IC/IB = 10

25C
TA = 25C
75C

0.1

0.01

VCE = 10 V

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5112T1

TA = 75C
25C
25C

100

10
0

20
IC, COLLECTOR CURRENT (mA)

40

50

10

Figure 7. VCE(sat) versus IC

Figure 8. DC Current Gain

100

25C

75C

f = 1 MHz
lE = 0 V
TA = 25C

TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

100

IC, COLLECTOR CURRENT (mA)

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

10

0.1

0.01
0.001

Figure 9. Output Capacitance

VO = 5 V
0

3
4
5
6
7
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 10. Output Current versus Input Voltage

100
V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C
10

25C
75C

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 11. Input Voltage versus Output Current

2758

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5111T1 SERIES

1000
IC/IB = 10

TA = 25C

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5113T1

25C

75C
0.1

0.01

10
20
30
IC, COLLECTOR CURRENT (mA)

TA = 75C
25C
25C

100

10

40

10
IC, COLLECTOR CURRENT (mA)

Figure 12. VCE(sat) versus IC

Figure 13. DC Current Gain

100

Cob , CAPACITANCE (pF)

IC, COLLECTOR CURRENT (mA)

f = 1 MHz
lE = 0 V
TA = 25C

0.8

0.6

0.4

0.2

100

25C

10
1

0.1

0.01

0.001

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

25C

TA = 75C

Figure 14. Output Capacitance

VO = 5 V
0

3
4
5
6
7
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 15. Output Current versus Input Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C

25C
75C

10

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 16. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2759

MUN5111T1 SERIES

180
IC/IB = 10

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5114T1

TA = 25C
25C

0.1

75C

0.01

0.001

20
40
60
IC, COLLECTOR CURRENT (mA)

25C
140
25C

120
100
80
60
40
20
0

80

TA = 75C

VCE = 10 V

160

Figure 17. VCE(sat) versus IC

100

3.5

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

TA = 75C

f = 1 MHz
lE = 0 V
TA = 25C

3
2.5
2
1.5
1
0.5
0

6 8 10 15 20 25 30 35 40
VR, REVERSE BIAS VOLTAGE (VOLTS)

45

25C

25C
10

VO = 5 V
1

50

Figure 19. Output Capacitance

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 20. Output Current versus Input Voltage

+12 V

10
VO = 0.2 V
V in , INPUT VOLTAGE (VOLTS)

80 90 100

Figure 18. DC Current Gain

4.5

8 10 15 20 40 50 60 70
IC, COLLECTOR CURRENT (mA)

25C
TA = 25C
75C

Typical Application
for PNP BRTs

LOAD
0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 21. Input Voltage versus Output Current

2760

Figure 22. Inexpensive, Unregulated Current Source

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Bias Resistor Transistors

MUN5211DW1T1
SERIES

NPN Silicon Surface Mount Transistors with


Monolithic Bias Resistor Network

Motorola Preferred Devices

The BRT (Bias Resistor Transistor) contains a single transistor with a


monolithic bias network consisting of two resistors; a series base resistor and a
baseemitter resistor. These digital transistors are designed to replace a single
device and its external resistor bias network. The BRT eliminates these
individual components by integrating them into a single device. In the
MUN5211DW1T1 series, two BRT devices are housed in the SOT363
package which is ideal for low power surface mount applications where board
space is at a premium.

5
4

CASE 419B01, STYLE 1


SOT363

Simplifies Circuit Design


Reduces Board Space
(3)

Reduces Component Count

(2)

Available in 8 mm, 7 inch/3000 Unit Tape and Reel.

R1

(1)
R2

Q1
Q2
R2
(4)

R1
(5)

(6)

MAXIMUM RATINGS (TA = 25C unless otherwise noted, common for Q1 and Q2)
Rating
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current

Symbol

Value

Unit

VCBO
VCEO

50

Vdc

50

Vdc

IC

100

mAdc

RJA

833

C/W

TJ, Tstg
PD

65 to +150

*150

mW

THERMAL CHARACTERISTICS
Thermal Resistance Junction-to-Ambient (surface mounted)
Operating and Storage Temperature Range
Total Package Dissipation @ TA = 25C(1)

DEVICE MARKING AND RESISTOR VALUES: MUN5211DW1T1 SERIES


Device
MUN5211DW1T1
MUN5212DW1T1
MUN5213DW1T1
MUN5214DW1T1
MUN5215DW1T1(2)
MUN5216DW1T1(2)
MUN5230DW1T1(2)
MUN5231DW1T1(2)
MUN5232DW1T1(2)
MUN5233DW1T1(2)
MUN5234DW1T1(2)
MUN5235DW1T1(2)

Marking

R1 (K)

R2 (K)

7A
7B
7C
7D
7E
7F
7G
7H
7J
7K
7L
7M

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22
2.2

10
22
47
47

1.0
2.2
4.7
47
47
47

1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New resistor combinations. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2761

MUN5211DW1T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, common for Q1 and Q2)
Characteristic

Symbol

Min

Typ

Max

Unit

Collector-Base Cutoff Current (VCB = 50 V, IE = 0)

ICBO

100

nAdc

Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0)

ICEO

500

nAdc

Emitter-Base Cutoff Current


(VEB = 6.0 V, IC = 0)

IEBO

0.5
0.2
0.1
0.2
0.9
1.9
4.3
2.3
1.5
0.18
0.13
0.2

mAdc

Collector-Base Breakdown Voltage (IC = 10 A, IE = 0)

V(BR)CBO

50

Vdc

Collector-Emitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0)

V(BR)CEO

50

Vdc

hFE

35
60
80
80
160
160
3.0
8.0
15
80
80
80

60
100
140
140
350
350
5.0
15
30
200
150
140

VCE(sat)

0.25

0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2

OFF CHARACTERISTICS

MUN5211DW1T1
MUN5212DW1T1
MUN5213DW1T1
MUN5214DW1T1
MUN5215DW1T1
MUN5216DW1T1
MUN5230DW1T1
MUN5231DW1T1
MUN5232DW1T1
MUN5233DW1T1
MUN5234DW1T1
MUN5235DW1T1

ON CHARACTERISTICS(3)
DC Current Gain
(VCE = 10 V, IC = 5.0 mA)

MUN5211DW1T1
MUN5212DW1T1
MUN5213DW1T1
MUN5214DW1T1
MUN5215DW1T1
MUN5216DW1T1
MUN5230DW1T1
MUN5231DW1T1
MUN5232DW1T1
MUN5233DW1T1
MUN5234DW1T1
MUN5235DW1T1

Collector-Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA)


(IC = 10 mA, IB = 5 mA) MUN5230DW1T1/MUN5231DW1T1
(IC = 10 mA, IB = 1 mA) MUN5215DW1T1/MUN5216DW1T1
MUN5232DW1T1/MUN5233DW1T1/MUN5234DW1T1
Output Voltage (on)
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k)

(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 k)

VOL
MUN5211lDW1T1
MUN5212DW1T1
MUN5214DW1T1
MUN5215DW1T1
MUN5216DW1T1
MUN5230DW1T1
MUN5231DW1T1
MUN5232DW1T1
MUN5233DW1T1
MUN5234DW1T1
MUN5235DW1T1
MUN5213DW1T1

Vdc

Vdc

3. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%

2762

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5211DW1T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, common for Q1 and Q2) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

VOH

4.9

Vdc

R1

7.0
15.4
32.9
7.0
7.0
3.3
0.7
1.5
3.3
3.3
15.4
1.54

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22
2.2

13
28.6
61.1
13
13
6.1
1.3
2.9
6.1
6.1
28.6
2.86

R1/R2

0.8
0.17

0.8
0.055
0.38
0.038

1.0
0.21

1.0
0.1
0.47
0.047

1.2
0.25

1.2
0.185
0.56
0.056

Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k)


(VCC = 5.0 V, VB = 0.050 V, RL = 1.0 k)
MUN5230DW1T1
(VCC = 5.0 V, VB = 0.25 V, RL = 1.0 k)
MUN5215DW1T1
MUN5216DW1T1
MUN5233DW1T1
Input Resistor

MUN5211DW1T1
MUN5212DW1T1
MUN5213DW1T1
MUN5214DW1T1
MUN5215DW1T1
MUN5216DW1T1
MUN5230DW1T1
MUN5231DW1T1
MUN5232DW1T1
MUN5233DW1T1
MUN5234DW1T1
MUN5235DW1T1

Resistor Ratio MUN5211DW1T1/MUN5212DW1T1/MUN5213DW1T1


MUN5214DW1T1
MUN5215DW1T1/MUN5216DW1T1
MUN5230DW1T1/MUN5231DW1T1/MUN5232DW1T1
MUN5233DW1T1
MUN5234DW1T1
MUN5235DW1T1

PD , POWER DISSIPATION (MILLIWATTS)

250

200

150

100

50

0
50

RJA = 833C/W

0
50
100
TA, AMBIENT TEMPERATURE (C)

150

Figure 1. Derating Curve

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2763

MUN5211DW1T1 SERIES

1000
IC/IB = 10

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5211DW1T1

TA = 25C
25C

0.1
75C

0.01

0.001

20
40
IC, COLLECTOR CURRENT (mA)

VCE = 10 V
TA = 75C
25C
25C
100

10

50

10
IC, COLLECTOR CURRENT (mA)

Figure 2. VCE(sat) versus IC

Figure 3. DC Current Gain

100

25C
75C

f = 1 MHz
IE = 0 V
TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

100

TA = 25C

10

0.1

0.01

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

50

VO = 5 V

0.001

3
4
5
6
7
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 5. Output Current versus Input Voltage

Figure 4. Output Capacitance

10

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C
25C
75C

0.1

10

40
20
30
IC, COLLECTOR CURRENT (mA)

50

Figure 6. Input Voltage versus Output Current

2764

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5211DW1T1 SERIES

1000

1
hFE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5212DW1T1

IC/IB = 10
25C
TA = 25C

0.1

75C

0.01

TA = 75C
25C
25C
100

10

0.001
0

20

40

50

100

10

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 7. VCE(sat) versus IC

Figure 8. DC Current Gain

100
f = 1 MHz
IE = 0 V
TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

VCE = 10 V

75C

25C
TA = 25C

10

0.1

0.01
VO = 5 V

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

50

0.001

Figure 9. Output Capacitance

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 10. Output Current versus Input Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C
10
25C

75C

0.1

10

20

30

40

50

IC, COLLECTOR CURRENT (mA)

Figure 11. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2765

MUN5211DW1T1 SERIES

10

1000
hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5213DW1T1

IC/IB = 10

1
25C

TA = 25C

75C

0.1

0.01
0

TA = 75C
25C
25C
100

10

50

20
40
IC, COLLECTOR CURRENT (mA)

VCE = 10 V

10
IC, COLLECTOR CURRENT (mA)

Figure 12. VCE(sat) versus IC

Figure 13. DC Current Gain

100
f = 1 MHz
IE = 0 V
TA = 25C

0.6

0.4

TA = 25C

10

0.1

0.01

0.2

25C

75C
IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

0.8

100

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

VO = 5 V

0.001

50

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 15. Output Current versus Input Voltage

Figure 14. Output Capacitance

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C
10

25C
75C

0.1
0

10

20

30

40

50

IC, COLLECTOR CURRENT (mA)

Figure 16. Input Voltage versus Output Current

2766

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5211DW1T1 SERIES

300

1
IC/IB = 10

hFE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5214DW1T1

TA = 25C
25C

0.1
75C

0.01

0.001

20
40
60
IC, COLLECTOR CURRENT (mA)

25C
200
25C
150
100
50
0

80

TA = 75C

VCE = 10

250

Figure 17. VCE(sat) versus IC

100
f = 1 MHz
lE = 0 V
TA = 25C

TA = 75C
IC, COLLECTOR CURRENT (mA)

3.5
Cob , CAPACITANCE (pF)

90 100

Figure 18. DC Current Gain

2.5
2
1.5
1
0.5
0

8 10 15 20 40 50 60 70 80
IC, COLLECTOR CURRENT (mA)

6 8 10 15 20 25 30 35
VR, REVERSE BIAS VOLTAGE (VOLTS)

40

45

50

Figure 19. Output Capacitance

25C

25C
10

VO = 5 V
1

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 20. Output Current versus Input Voltage

10

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C

25C
75C

0.1

10

20
30
40
IC, COLLECTOR CURRENT (mA)

50

Figure 21. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2767

MUN5211DW1T1 SERIES
TYPICAL ELECTRICAL CHARACTERISTICS MUN5215DW1T1

HFE, DC CURRENT GAIN (NORMALIZED)

1000
TA = 25C

VCE = 10 V

VCE = 5.0 V

100
1.0

10
IC, COLLECTOR CURRENT (mA)

100

Figure 22. DC Current Gain

TYPICAL ELECTRICAL CHARACTERISTICS MUN5216DW1T1

HFE, DC CURRENT GAIN (NORMALIZED)

1000
TA = 25C

VCE = 10 V

VCE = 5.0 V

100
1.0

10
IC, COLLECTOR CURRENT (mA)

100

Figure 23. DC Current Gain

2768

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Bias Resistor Transistor

MUN5211T1
SERIES

NPN Silicon Surface Mount Transistor with


Monolithic Bias Resistor Network

Motorola Preferred Devices

This new series of digital transistors is designed to replace a single device


and its external resistor bias network. The BRT (Bias Resistor Transistor)
contains a single transistor with a monolithic bias network consisting of two
resistors; a series base resistor and a base-emitter resistor. The BRT eliminates
these individual components by integrating them into a single device. The use
of a BRT can reduce both system cost and board space. The device is housed
in the SC-70/SOT-323 package which is designed for low power surface mount
applications.

NPN SILICON
BIAS RESISTOR
TRANSISTORS

Simplifies Circuit Design


Reduces Board Space

PIN3
COLLECTOR
(OUTPUT)

Reduces Component Count


The SC-70/SOT-323 package can be soldered using
wave or reflow. The modified gull-winged leads absorb
thermal stress during soldering eliminating the possibility
of damage to the die.

R1
PIN1 R2
BASE
(INPUT)

Available in 8 mm embossed tape and reel


Use the Device Number to order the 7 inch/3000 unit reel.
Replace T1 with T3 in the Device Number to order the
13 inch/10,000 unit reel.

1
2
PIN2
EMITTER
(GROUND)

CASE 419-02, STYLE 3


SC-70/SOT-323

MAXIMUM RATINGS (TA = 25C unless otherwise noted)


Rating
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current
Total Power Dissipation @ TA = 25C(1)
Derate above 25C

Symbol

Value

Unit

VCBO
VCEO

50

Vdc

50

Vdc

IC
PD

100

mAdc

*150
1.2

mW
mW/C

THERMAL CHARACTERISTICS
Thermal Resistance Junction-to-Ambient (surface mounted)
Operating and Storage Temperature Range
Maximum Temperature for Soldering Purposes,
Time in Solder Bath

RJA
TJ, Tstg
TL

833

C/W

65 to +150

260
10

C
Sec

DEVICE MARKING AND RESISTOR VALUES


Device
MUN5211T1
MUN5212T1
MUN5213T1
MUN5214T1
MUN5215T1(2)
MUN5216T1(2)
MUN5230T1(2)
MUN5231T1(2)
MUN5232T1(2)
MUN5233T1(2)
MUN5234T1(2)

Marking

R1 (K)

R2 (K)

8A
8B
8C
8D
8E
8F
8G
8H
8J
8K
8L

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22

10
22
47
47

1.0
2.2
4.7
47
47

1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2769

MUN5211T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

Collector-Base Cutoff Current (VCB = 50 V, IE = 0)

ICBO

100

nAdc

Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0)

ICEO

500

nAdc

Emitter-Base Cutoff Current


(VEB = 6.0 V, IC = 0)

IEBO

0.5
0.2
0.1
0.2
0.9
1.9
4.3
2.3
1.5
0.18
0.13

mAdc

Collector-Base Breakdown Voltage (IC = 10 A, IE = 0)

V(BR)CBO

50

Vdc

Collector-Emitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0)

V(BR)CEO

50

Vdc

hFE

35
60
80
80
160
160
3.0
8.0
15
80
80

60
100
140
140
350
350
5.0
15
30
200
150

VCE(sat)

0.25

0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2

OFF CHARACTERISTICS

MUN5211T1
MUN5212T1
MUN5213T1
MUN5214T1
MUN5215T1
MUN5216T1
MUN5230T1
MUN5231T1
MUN5232T1
MUN5233T1
MUN5234T1

ON CHARACTERISTICS(3)
DC Current Gain
(VCE = 10 V, IC = 5.0 mA)

MUN5211T1
MUN5212T1
MUN5213T1
MUN5214T1
MUN5215T1
MUN5216T1
MUN5230T1
MUN5231T1
MUN5232T1
MUN5233T1
MUN5234T1

Collector-Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA)


(IC = 10 mA, IB = 5 mA) MUN5230T1/MUN5231T1
(IC = 10 mA, IB = 1 mA) MUN5215T1/MUN5216T1
MUN5232T1/MUN5233T1/MUN5234T1
Output Voltage (on)
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k)

(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 k)

VOL
MUN5211lT1
MUN5212T1
MUN5214T1
MUN5215T1
MUN5216T1
MUN5230T1
MUN5231T1
MUN5232T1
MUN5233T1
MUN5234T1
MUN5213T1

Vdc

Vdc

3. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%

2770

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5211T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k)


(VCC = 5.0 V, VB = 0.050 V, RL = 1.0 k)
MUN5230T1
(VCC = 5.0 V, VB = 0.25 V, RL = 1.0 k)
MUN5215T1
MUN5216T1
MUN5233T1

VOH

4.9

Vdc

R1

7.0
15.4
32.9
7.0
7.0
3.3
0.7
1.5
3.3
3.3
15.4

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22

13
28.6
61.1
13
13
6.1
1.3
2.9
6.1
6.1
28.6

R1/R2

0.8
0.17

0.8
0.055
0.38

1.0
0.21

1.0
0.1
0.47

1.2
0.25

1.2
0.185
0.56

Input Resistor

MUN5211T1
MUN5212T1
MUN5213T1
MUN5214T1
MUN5215T1
MUN5216T1
MUN5230T1
MUN5231T1
MUN5232T1
MUN5233T1
MUN5234T1

Resistor Ratio

MUN5211T1/MUN5212T1/MUN5213T1
MUN5214T1
MUN5215T1/MUN5216T1
MUN5230T1/MUN5231T1/MUN5232T1
MUN5233T1
MUN5234T1

PD , POWER DISSIPATION (MILLIWATTS)

250

200

150

100

50

0
50

RJA = 833C/W

0
50
100
TA, AMBIENT TEMPERATURE (C)

150

Figure 1. Derating Curve

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2771

MUN5211T1 SERIES

1000
IC/IB = 10

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5211T1

TA = 25C
25C

0.1
75C

0.01

0.001

20
40
IC, COLLECTOR CURRENT (mA)

VCE = 10 V
TA = 75C
25C
25C
100

10

50

10
IC, COLLECTOR CURRENT (mA)

Figure 2. VCE(sat) versus IC

Figure 3. DC Current Gain

100

25C
75C

f = 1 MHz
IE = 0 V
TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

100

TA = 25C

10

0.1

0.01

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

50

VO = 5 V

0.001

3
4
5
6
7
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 5. Output Current versus Input Voltage

Figure 4. Output Capacitance

10

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C
25C
75C

0.1

10

40
20
30
IC, COLLECTOR CURRENT (mA)

50

Figure 6. Input Voltage versus Output Current

2772

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5211T1 SERIES

1000

1
hFE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5212T1

IC/IB = 10
25C
TA = 25C

0.1

75C

0.01

TA = 75C
25C
25C
100

10

0.001
0

20

40

50

100

10

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 7. VCE(sat) versus IC

Figure 8. DC Current Gain

100
f = 1 MHz
IE = 0 V
TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

VCE = 10 V

75C

25C
TA = 25C

10

0.1

0.01
VO = 5 V

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

50

0.001

Figure 9. Output Capacitance

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 10. Output Current versus Input Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C
10
25C

75C

0.1

10

20

30

40

50

IC, COLLECTOR CURRENT (mA)

Figure 11. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2773

MUN5211T1 SERIES

10

1000
hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5213T1

IC/IB = 10

1
25C

TA = 25C

75C

0.1

0.01
0

TA = 75C
25C
25C
100

10

50

20
40
IC, COLLECTOR CURRENT (mA)

VCE = 10 V

10
IC, COLLECTOR CURRENT (mA)

Figure 12. VCE(sat) versus IC

Figure 13. DC Current Gain

100
f = 1 MHz
IE = 0 V
TA = 25C

0.6

0.4

TA = 25C

10

0.1

0.01

0.2

25C

75C
IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

0.8

100

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

VO = 5 V

0.001

50

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 15. Output Current versus Input Voltage

Figure 14. Output Capacitance

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C
10

25C
75C

0.1
0

10

20

30

40

50

IC, COLLECTOR CURRENT (mA)

Figure 16. Input Voltage versus Output Current

2774

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5211T1 SERIES

300

1
IC/IB = 10

hFE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5214T1

TA = 25C
25C

0.1
75C

0.01

0.001

20
40
60
IC, COLLECTOR CURRENT (mA)

25C
200
25C
150
100
50
0

80

TA = 75C

VCE = 10

250

Figure 17. VCE(sat) versus IC

100
f = 1 MHz
lE = 0 V
TA = 25C

TA = 75C
IC, COLLECTOR CURRENT (mA)

3.5
Cob , CAPACITANCE (pF)

90 100

Figure 18. DC Current Gain

2.5
2
1.5
1
0.5
0

8 10 15 20 40 50 60 70 80
IC, COLLECTOR CURRENT (mA)

6 8 10 15 20 25 30 35
VR, REVERSE BIAS VOLTAGE (VOLTS)

40

45

50

Figure 19. Output Capacitance

25C

25C
10

VO = 5 V
1

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 20. Output Current versus Input Voltage

10

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C

25C
75C

0.1

10

20
30
40
IC, COLLECTOR CURRENT (mA)

50

Figure 21. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2775

MUN5211T1 SERIES
TYPICAL APPLICATIONS FOR NPN BRTs
+12 V

ISOLATED
LOAD

FROM P OR
OTHER LOGIC

Figure 22. Level Shifter: Connects 12 or 24 Volt Circuits to Logic

+12 V

VCC

OUT
IN
LOAD

Figure 23. Open Collector Inverter: Inverts the Input Signal

2776

Figure 24. Inexpensive, Unregulated Current Source

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Bias Resistor Transistors

NPN and PNP Silicon Surface Mount Transistors


with Monolithic Bias Resistor Network

MUN5311DW1T1
SERIES
Motorola Preferred Devices

The BRT (Bias Resistor Transistor) contains a single transistor with a


monolithic bias network consisting of two resistors; a series base resistor and a
baseemitter resistor. These digital transistors are designed to replace a single
device and its external resistor bias network. The BRT eliminates these
individual components by integrating them into a single device. In the
MUN5311DW1T1 series, two complementary BRT devices are housed in the
SOT363 package which is ideal for low power surface mount applications
where board space is at a premium.

5
4

CASE 419B01, STYLE 1


SOT363

Simplifies Circuit Design


Reduces Board Space
Reduces Component Count

(3)

(2)

Available in 8 mm, 7 inch/3000 Unit Tape and Reel.

R1

(1)
R2

Q1
Q2
R2
(4)

R1
(5)

(6)

MAXIMUM RATINGS (TA = 25C unless otherwise noted, common for Q1 and Q2, minus sign for Q2 (PNP) omitted)
Rating
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current

Symbol

Value

Unit

VCBO
VCEO

50

Vdc

50

Vdc

IC

100

mAdc

RJA

833

C/W

TJ, Tstg
PD

65 to +150

*150

mW

THERMAL CHARACTERISTICS
Thermal Resistance Junction-to-Ambient (surface mounted)
Operating and Storage Temperature Range
Total Package Dissipation @ TA = 25C(1)

DEVICE MARKING AND RESISTOR VALUES: MUN5311DW1T1 SERIES


Device
MUN5311DW1T1
MUN5312DW1T1
MUN5313DW1T1
MUN5314DW1T1
MUN5315DW1T1(2)
MUN5316DW1T1(2)
MUN5330DW1T1(2)
MUN5331DW1T1(2)
MUN5332DW1T1(2)
MUN5333DW1T1(2)
MUN5334DW1T1(2)
MUN5335DW1T1(2)

Marking

R1 (K)

R2 (K)

11
12
13
14
15
16
30
31
32
33
34
35

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22
2.2

10
22
47
47

1.0
2.2
4.7
47
47
47

1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New resistor combinations. Updated curves to follow in subsequent data sheets.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 4

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2777

MUN5311DW1T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, common for Q1 and Q2, minus sign for Q2 (PNP) omitted)
Characteristic

Symbol

Min

Typ

Max

Unit

Collector-Base Cutoff Current (VCB = 50 V, IE = 0)

ICBO

100

nAdc

Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0)

ICEO

500

nAdc

Emitter-Base Cutoff Current


(VEB = 6.0 V, IC = 0)

IEBO

0.5
0.2
0.1
0.2
0.9
1.9
4.3
2.3
1.5
0.18
0.13
0.2

mAdc

Collector-Base Breakdown Voltage (IC = 10 A, IE = 0)

V(BR)CBO

50

Vdc

Collector-Emitter Breakdown Voltage(3) (IC = 2.0 mA, IB = 0)

V(BR)CEO

50

Vdc

hFE

35
60
80
80
160
160
3.0
8.0
15
80
80
80

60
100
140
140
350
350
5.0
15
30
200
150
140

VCE(sat)

0.25

0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2

OFF CHARACTERISTICS

MUN5311DW1T1
MUN5312DW1T1
MUN5313DW1T1
MUN5314DW1T1
MUN5315DW1T1
MUN5316DW1T1
MUN5330DW1T1
MUN5331DW1T1
MUN5332DW1T1
MUN5333DW1T1
MUN5334DW1T1
MUN5335DW1T1

ON CHARACTERISTICS(3)
DC Current Gain
(VCE = 10 V, IC = 5.0 mA)

MUN5311DW1T1
MUN5312DW1T1
MUN5313DW1T1
MUN5314DW1T1
MUN5315DW1T1
MUN5316DW1T1
MUN5330DW1T1
MUN5331DW1T1
MUN5332DW1T1
MUN5333DW1T1
MUN5334DW1T1
MUN5335DW1T1

Collector-Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA)


(IC = 10 mA, IB = 5 mA) MUN5330DW1T1/MUN5331DW1T1
(IC = 10 mA, IB = 1 mA) MUN5315DW1T1/MUN5316DW1T1
MUN5332DW1T1/MUN5333DW1T1/MUN5334DW1T1
Output Voltage (on)
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k)

(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 k)

VOL
MUN5311lDW1T1
MUN5312DW1T1
MUN5314DW1T1
MUN5315DW1T1
MUN5316DW1T1
MUN5330DW1T1
MUN5331DW1T1
MUN5332DW1T1
MUN5333DW1T1
MUN5334DW1T1
MUN5335DW1T1
MUN5313DW1T1

Vdc

Vdc

3. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%

2778

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5311DW1T1 SERIES
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, common for Q1 and Q2, minus sign for Q2 (PNP) omitted)
(Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

VOH

4.9

Vdc

R1

7.0
15.4
32.9
7.0
7.0
3.3
0.7
1.5
3.3
3.3
15.4
1.54

10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22
2.2

13
28.6
61.1
13
13
6.1
1.3
2.9
6.1
6.1
28.6
2.86

R1/R2

0.8
0.17

0.8
0.055
0.38
0.038

1.0
0.21

1.0
0.1
0.47
0.047

1.2
0.25

1.2
0.185
0.56
0.056

Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k)


(VCC = 5.0 V, VB = 0.050 V, RL = 1.0 k)
MUN5330DW1T1
(VCC = 5.0 V, VB = 0.25 V, RL = 1.0 k)
MUN5315DW1T1
MUN5316DW1T1
MUN5333DW1T1
Input Resistor

MUN5311DW1T1
MUN5312DW1T1
MUN5313DW1T1
MUN5314DW1T1
MUN5315DW1T1
MUN5316DW1T1
MUN5330DW1T1
MUN5331DW1T1
MUN5332DW1T1
MUN5333DW1T1
MUN5334DW1T1
MUN5335DW1T1

Resistor Ratio MUN5311DW1T1/MUN5312DW1T1/MUN5313DW1T1


MUN5314DW1T1
MUN5315DW1T1/MUN5316DW1T1
MUN5330DW1T1/MUN5331DW1T1/MUN5332DW1T1
MUN5333DW1T1
MUN5334DW1T1
MUN5335DW1T1

PD , POWER DISSIPATION (MILLIWATTS)

250

200

150

100

50

0
50

RJA = 833C/W

0
50
100
TA, AMBIENT TEMPERATURE (C)

150

Figure 1. Derating Curve

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2779

MUN5311DW1T1 SERIES

1000
IC/IB = 10

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5311DW1T1 NPN TRANSISTOR

TA = 25C
25C

0.1
75C

0.01

0.001

20
40
IC, COLLECTOR CURRENT (mA)

VCE = 10 V
TA = 75C
25C
25C
100

10

50

10
IC, COLLECTOR CURRENT (mA)

Figure 2. VCE(sat) versus IC

Figure 3. DC Current Gain

100

25C
75C

f = 1 MHz
IE = 0 V
TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

100

TA = 25C

10

0.1

0.01

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

50

VO = 5 V

0.001

3
4
5
6
7
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 5. Output Current versus Input Voltage

Figure 4. Output Capacitance

10

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C
25C
75C

0.1

10

40
20
30
IC, COLLECTOR CURRENT (mA)

50

Figure 6. Input Voltage versus Output Current

2780

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5311DW1T1 SERIES

1000

1
hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5311DW1T1 PNP TRANSISTOR

IC/IB = 10

TA = 25C
0.1
25C
75C

0.01
0

20

100

25C

IC, COLLECTOR CURRENT (mA)

10
IC, COLLECTOR CURRENT (mA)

Figure 7. VCE(sat) versus IC

Figure 8. DC Current Gain

50

100

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

Figure 9. Output Capacitance

100

25C

75C

f = 1 MHz
lE = 0 V
TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

TA = 75C
25C

10

40

VCE = 10 V

TA = 25C

10

0.1

0.01
0.001

VO = 5 V
0

6
7
3
4
5
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 10. Output Current versus Input


Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C

10

25C
75C

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 11. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2781

MUN5311DW1T1 SERIES

1000

1
hFE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5312DW1T1 NPN TRANSISTOR

IC/IB = 10
25C
TA = 25C

0.1

75C

0.01

TA = 75C
25C
25C
100

10

0.001
0

20

40

50

100

10

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 12. VCE(sat) versus IC

Figure 13. DC Current Gain

100
f = 1 MHz
IE = 0 V
TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

VCE = 10 V

75C

25C
TA = 25C

10

0.1

0.01
VO = 5 V

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

50

0.001

Figure 14. Output Capacitance

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 15. Output Current versus Input Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C
10
25C

75C

0.1

10

20

30

40

50

IC, COLLECTOR CURRENT (mA)

Figure 16. Input Voltage versus Output


Current

2782

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5311DW1T1 SERIES

1000

10
IC/IB = 10

25C
TA = 25C
75C

0.1

0.01

VCE = 10 V

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5312DW1T1 PNP TRANSISTOR

TA = 75C
25C
25C

100

10
0

20
IC, COLLECTOR CURRENT (mA)

40

50

10

Figure 17. VCE(sat) versus IC

Figure 18. DC Current Gain

100

25C

75C

f = 1 MHz
lE = 0 V
TA = 25C

TA = 25C

IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

100

IC, COLLECTOR CURRENT (mA)

0.1

0.01
0.001

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

10

Figure 19. Output Capacitance

VO = 5 V
0

3
4
5
6
7
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 20. Output Current versus Input Voltage

100
V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C
10

25C
75C

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 21. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2783

MUN5311DW1T1 SERIES

10

1000
hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5313DW1T1 NPN TRANSISTOR

IC/IB = 10

1
25C

TA = 25C

75C

0.1

0.01
0

TA = 75C
25C
25C
100

10

50

20
40
IC, COLLECTOR CURRENT (mA)

VCE = 10 V

10
IC, COLLECTOR CURRENT (mA)

Figure 22. VCE(sat) versus IC

Figure 23. DC Current Gain

100
f = 1 MHz
IE = 0 V
TA = 25C

0.6

0.4

TA = 25C

10

0.1

0.01

0.2

25C

75C
IC, COLLECTOR CURRENT (mA)

Cob , CAPACITANCE (pF)

0.8

100

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

VO = 5 V

0.001

50

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 25. Output Current versus Input Voltage

Figure 24. Output Capacitance

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C
10

25C
75C

0.1
0

10

20

30

40

50

IC, COLLECTOR CURRENT (mA)

Figure 26. Input Voltage versus Output Current

2784

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5311DW1T1 SERIES

1000
IC/IB = 10

TA = 25C

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5313DW1T1 PNP TRANSISTOR

25C

75C
0.1

0.01

10
20
30
IC, COLLECTOR CURRENT (mA)

TA = 75C
25C
25C

100

10

40

10
IC, COLLECTOR CURRENT (mA)

Figure 27. VCE(sat) versus IC

Figure 28. DC Current Gain

100

Cob , CAPACITANCE (pF)

IC, COLLECTOR CURRENT (mA)

f = 1 MHz
lE = 0 V
TA = 25C

0.8

0.6

0.4

0.2

100

25C

10
1

0.1

0.01

0.001

50

10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)

25C

TA = 75C

Figure 29. Output Capacitance

VO = 5 V
0

3
4
5
6
7
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 30. Output Current versus Input Voltage

100

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V
TA = 25C

25C
75C

10

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 31. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2785

MUN5311DW1T1 SERIES

300

1
IC/IB = 10

hFE, DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5314DW1T1 NPN TRANSISTOR

TA = 25C
25C

0.1
75C

0.01

0.001

20
40
60
IC, COLLECTOR CURRENT (mA)

25C
200
25C
150
100
50
0

80

TA = 75C

VCE = 10

250

Figure 32. VCE(sat) versus IC

100
f = 1 MHz
lE = 0 V
TA = 25C

TA = 75C
IC, COLLECTOR CURRENT (mA)

3.5
Cob , CAPACITANCE (pF)

90 100

Figure 33. DC Current Gain

2.5
2
1.5
1
0.5
0

8 10 15 20 40 50 60 70 80
IC, COLLECTOR CURRENT (mA)

6 8 10 15 20 25 30 35
VR, REVERSE BIAS VOLTAGE (VOLTS)

40

Figure 34. Output Capacitance

45

50

25C

25C
10

VO = 5 V
1

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 35. Output Current versus Input Voltage

10

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

TA = 25C

25C
75C

0.1

10

20
30
40
IC, COLLECTOR CURRENT (mA)

50

Figure 36. Input Voltage versus Output Current

2786

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MUN5311DW1T1 SERIES

180
IC/IB = 10

hFE , DC CURRENT GAIN (NORMALIZED)

VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)

TYPICAL ELECTRICAL CHARACTERISTICS MUN5314DW1T1 PNP TRANSISTOR

TA = 25C
25C

0.1

75C

0.01

0.001

20
40
60
IC, COLLECTOR CURRENT (mA)

25C
140
25C

120
100
80
60
40
20
0

80

TA = 75C

VCE = 10 V

160

Figure 37. VCE(sat) versus IC

100
TA = 75C

3.5

IC, COLLECTOR CURRENT (mA)

f = 1 MHz
lE = 0 V
TA = 25C

4
Cob , CAPACITANCE (pF)

80 90 100

Figure 38. DC Current Gain

4.5

3
2.5
2
1.5
1
0.5
0

8 10 15 20 40 50 60 70
IC, COLLECTOR CURRENT (mA)

6 8 10 15 20 25 30 35 40
VR, REVERSE BIAS VOLTAGE (VOLTS)

45

50

Figure 39. Output Capacitance

25C

25C
10

VO = 5 V
1

4
6
Vin, INPUT VOLTAGE (VOLTS)

10

Figure 40. Output Current versus Input Voltage

10

V in , INPUT VOLTAGE (VOLTS)

VO = 0.2 V

25C
TA = 25C
75C

0.1

10

20
30
IC, COLLECTOR CURRENT (mA)

40

50

Figure 41. Input Voltage versus Output Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2787

MUN5311DW1T1 SERIES
TYPICAL ELECTRICAL CHARACTERISTICS MUN5315DW1T1

HFE, DC CURRENT GAIN (NORMALIZED)

1000

HFE, DC CURRENT GAIN (NORMALIZED)

1000
TA = 25C

VCE = 10 V

VCE = 5.0 V

100

TA = 25C

VCE = 10 V

VCE = 5.0 V

100
1.0

10
IC, COLLECTOR CURRENT (mA)

100

1.0

Figure 42. DC Current Gain PNP

10
IC, COLLECTOR CURRENT (mA)

100

Figure 43. DC Current Gain NPN

TYPICAL ELECTRICAL CHARACTERISTICS MUN5316DW1T1

HFE, DC CURRENT GAIN (NORMALIZED)

1000

HFE, DC CURRENT GAIN (NORMALIZED)

1000
TA = 25C

VCE = 10 V

VCE = 5.0 V

100

VCE = 10 V

VCE = 5.0 V

100
1.0

10
IC, COLLECTOR CURRENT (mA)

Figure 44. DC Current Gain PNP

2788

TA = 25C

100

1.0

10
IC, COLLECTOR CURRENT (mA)

100

Figure 45. DC Current Gain NPN

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistors

P2N2222A

NPN Silicon

COLLECTOR
1
2
BASE
3
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

40

Vdc

Collector Base Voltage

VCBO

75

Vdc

Emitter Base Voltage

VEBO

6.0

Vdc

Collector Current Continuous

IC

600

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

1
2

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage


(IC = 10 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

75

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

6.0

Vdc

Collector Cutoff Current


(VCE = 60 Vdc, VEB(off) = 3.0 Vdc)

ICEX

10

nAdc

Collector Cutoff Current


(VCB = 60 Vdc, IE = 0)
(VCB = 60 Vdc, IE = 0, TA = 150C)

ICBO

0.01
10

Emitter Cutoff Current


(VEB = 3.0 Vdc, IC = 0)

IEBO

10

nAdc

Collector Cutoff Current


(VCE = 10 V)

ICEO

10

nAdc

Base Cutoff Current


(VCE = 60 Vdc, VEB(off) = 3.0 Vdc)

IBEX

20

nAdc

Characteristic

OFF CHARACTERISTICS

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Adc

2789

P2N2222A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

35
50
75
35
100
50
40

300

0.3
1.0

0.6

1.2
2.0

fT

300

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

8.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Cibo

25

pF

2.0
0.25

8.0
1.25

8.0
4.0

50
75

300
375

5.0
25

35
200

ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc, TA = 55C)
(IC = 150 mAdc, VCE = 10 Vdc)(1)
(IC = 150 mAdc, VCE = 1.0 Vdc)(1)
(IC = 500 mAdc, VCE = 10 Vdc)(1)

hFE

Collector Emitter Saturation Voltage(1)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

Base Emitter Saturation Voltage(1)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(2)
(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)

Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hie

Voltage Feedback Ratio


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hre

SmallSignal Current Gain


(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hfe

Output Admittance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

hoe

Collector Base Time Constant


(IE = 20 mAdc, VCB = 20 Vdc, f = 31.8 MHz)

rbCc

150

ps

NF

4.0

dB

( CC = 30 Vdc, VBE(off) = 2.0 Vdc,


(V
IC = 150 mAdc, IB1 = 15 mAdc) (Figure 1)

td

10

ns

tr

25

ns

(VCC = 30 Vdc, IC = 150 mAdc,


IB1 = IB2 = 15 mAdc)
Ad ) (Fi
(Figure 2)

ts

225

ns

tf

60

ns

Noise Figure
(IC = 100 mAdc, VCE = 10 Vdc, RS = 1.0 k, f = 1.0 kHz)

X 10 4

mmhos

SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time

1. Pulse Test: Pulse Width


300 ms, Duty Cycle
2.0%.
2. fT is defined as the frequency at which |hfe| extrapolates to unity.

2790

Motorola SmallSignal Transistors, FETs and Diodes Device Data

P2N2222A
SWITCHING TIME EQUIVALENT TEST CIRCUITS
+ 30 V

+ 30 V
1.0 to 100 s,
DUTY CYCLE 2.0%

+16 V
0
2 V

200

1.0 to 100 s,
DUTY CYCLE 2.0%

+16 V
0

1 k
< 2 ns

1k

14 V

CS* < 10 pF

< 20 ns

Figure 1. TurnOn Time

CS* < 10 pF

1N914

Scope rise time < 4 ns


*Total shunt capacitance of test jig,
connectors, and oscilloscope.

4 V

Figure 2. TurnOff Time

1000
700
500
hFE , DC CURRENT GAIN

200

TJ = 125C

300
200
25C
100
70
50

55C

30

VCE = 1.0 V
VCE = 10 V

20
10
0.1

0.2

0.3

0.5 0.7

1.0

2.0

3.0

5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70

100

200

300

500 700 1.0 k

VCE , COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 3. DC Current Gain

1.0
TJ = 25C
0.8

0.6

IC = 1.0 mA

10 mA

150 mA

500 mA

0.4

0.2

0
0.005

0.01

0.02 0.03

0.05

0.1

0.2

0.3
0.5
1.0
IB, BASE CURRENT (mA)

2.0

3.0

5.0

10

20

30

50

Figure 4. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2791

P2N2222A
200

500
IC/IB = 10
TJ = 25C
tr @ VCC = 30 V
td @ VEB(off) = 2.0 V
td @ VEB(off) = 0

30
20
10
7.0
5.0

200

ts = ts 1/8 tf

100
70
50

tf

30
20
10
7.0
5.0

3.0
2.0
5.0 7.0

10

200 300
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

5.0 7.0 10

500

20 30
50 70 100
200
IC, COLLECTOR CURRENT (mA)

Figure 5. Turn On Time

IC = 1.0 mA, RS = 150


500 A, RS = 200
100 A, RS = 2.0 k
50 A, RS = 4.0 k

6.0

f = 1.0 kHz
8.0
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

RS = OPTIMUM
RS = SOURCE
RS = RESISTANCE

4.0

2.0

IC = 50 A
100 A
500 A
1.0 mA

6.0

4.0

2.0

0
0.01 0.02 0.05 0.1 0.2

0.5 1.0 2.0

5.0 10

20

100 200

500 1.0 k 2.0 k

5.0 k 10 k 20 k

50 k 100 k

RS, SOURCE RESISTANCE (OHMS)

Figure 7. Frequency Effects

Figure 8. Source Resistance Effects

Ceb
10
7.0
5.0
Ccb
3.0

0.5 0.7 1.0


2.0 3.0 5.0 7.0 10
REVERSE VOLTAGE (VOLTS)

Figure 9. Capacitances

20 30

50

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

f, FREQUENCY (kHz)

20

0.2 0.3

0
50

50 100

30

CAPACITANCE (pF)

500

10

8.0

2792

300

Figure 6. Turn Off Time

10

2.0
0.1

VCC = 30 V
IC/IB = 10
IB1 = IB2
TJ = 25C

300

t, TIME (ns)

t, TIME (ns)

100
70
50

500
VCE = 20 V
TJ = 25C

300
200

100
70
50
1.0

2.0

3.0
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)

50

70 100

Figure 10. CurrentGain Bandwidth Product

Motorola SmallSignal Transistors, FETs and Diodes Device Data

P2N2222A
1.0

+0.5
TJ = 25C
0
COEFFICIENT (mV/ C)

V, VOLTAGE (VOLTS)

0.8
VBE(sat) @ IC/IB = 10
1.0 V

0.6
VBE(on) @ VCE = 10 V
0.4

0.2

RqVC for VCE(sat)

0.5
1.0
1.5
RqVB for VBE

2.0
VCE(sat) @ IC/IB = 10

2.5
0.1 0.2

50 100 200
0.5 1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)

500 1.0 k

Figure 11. On Voltages

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.1 0.2

0.5

1.0 2.0
5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mA)

500

Figure 12. Temperature Coefficients

2793

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Amplifier Transistor

P2N2907A

PNP Silicon

COLLECTOR
1
2
BASE
3
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector Emitter Voltage

VCEO

60

Vdc

Collector Base Voltage

VCBO

60

Vdc

Emitter Base Voltage

VEBO

5.0

Vdc

Collector Current Continuous

IC

600

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

625
5.0

mW
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

Operating and Storage Junction


Temperature Range

1
2

CASE 2904, STYLE 17


TO92 (TO226AA)

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient

RqJA

200

C/W

Thermal Resistance, Junction to Case

RqJC

83.3

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector Emitter Breakdown Voltage(1)


(IC = 10 mAdc, IB = 0)

V(BR)CEO

60

Vdc

Collector Base Breakdown Voltage


(IC = 10 mAdc, IE = 0)

V(BR)CBO

60

Vdc

Emitter Base Breakdown Voltage


(IE = 10 mAdc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector Cutoff Current


(VCE = 30 Vdc, VEB(off) = 0.5 Vdc)

ICEX

50

nAdc

Collector Cutoff Current


(VCB = 50 Vdc, IE = 0)
(VCB = 50 Vdc, IE = 0, TA = 150C)

ICBO

0.01
10

Emitter Cutoff Current


(VEB = 3.0 Vdc)

IEBO

10

nAdc

Collector Cutoff Current


(VCE = 10 V)

ICEO

10

nAdc

Base Cutoff Current


(VCE = 30 Vdc, VEB(off) = 0.5 Vdc)

IBEX

50

nAdc

Characteristic

OFF CHARACTERISTICS

1. Pulse Test: Pulse Width

2794

Adc

v 300 ms, Duty Cycle v 2.0%.


Motorola SmallSignal Transistors, FETs and Diodes Device Data

P2N2907A
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

75
100
100
100
50

300

0.4
1.6

1.3
2.6

fT

200

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cobo

8.0

pF

Input Capacitance
(VEB = 2.0 Vdc, IC = 0, f = 1.0 MHz)

Cibo

30

pF

ton

50

ns

td

10

ns

tr

40

ns

toff

110

ns

ts

80

ns

tf

30

ns

ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 150 mAdc, VCE = 10 Vdc)(1)
(IC = 500 mAdc, VCE = 10 Vdc)(1)

hFE

Collector Emitter Saturation Voltage(1)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

Base Emitter Saturation Voltage(1)


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

Vdc

Vdc

SMALL SIGNAL CHARACTERISTICS


Current Gain Bandwidth Product(1), (2)
(IC = 50 mAdc, VCE = 20 Vdc, f = 100 MHz)

SWITCHING CHARACTERISTICS
TurnOn Time
Delay Time

(VCC = 30
30 Vdc,
Vd IC = 150
150 mAdc,
Ad
IB1 = 15
15 mAdc) (Figures 1 and 5)

Rise Time
TurnOff Time
Storage Time
Fall Time

(VCC = 6.0
6 0 Vd
Vdc, IC = 150
150 mAdc,
Ad
IB1 = IB2 = 15
15 mAdc) (Figure 2)

1. Pulse Test: Pulse Width


300 ms, Duty Cycle
2.0%.
2. fT is defined as the frequency at which |hfe| extrapolates to unity.
INPUT
Zo = 50
PRF = 150 PPS
RISE TIME 2.0 ns
P.W. < 200 ns

30 V
200
1.0 k

TO OSCILLOSCOPE
RISE TIME 5.0 ns

50

16 V

INPUT
Zo = 50
PRF = 150 PPS
RISE TIME 2.0 ns
P.W. < 200 ns

200 ns

Figure 1. Delay and Rise Time Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

+15 V

6.0 V

1.0 k
1.0 k

0
30 V

50

37
TO OSCILLOSCOPE
RISE TIME 5.0 ns

1N916

200 ns

Figure 2. Storage and Fall Time Test Circuit

2795

P2N2907A
TYPICAL CHARACTERISTICS

hFE , NORMALIZED CURRENT GAIN

3.0
VCE = 1.0 V
VCE = 10 V

2.0

TJ = 125C
25C

1.0
55C

0.7
0.5
0.3
0.2
0.1

0.2 0.3

0.5 0.7 1.0

2.0

3.0

5.0 7.0

10

20

30

50 70 100

200 300

500

IC, COLLECTOR CURRENT (mA)

VCE, COLLECTOREMITTER VOLTAGE (VOLTS)

Figure 3. DC Current Gain

1.0

0.8
IC = 1.0 mA

10 mA

100 mA

500 mA

0.6

0.4

0.2

0
0.005

0.01

0.02 0.03 0.05 0.07 0.1

0.2

0.3 0.5 0.7 1.0


IB, BASE CURRENT (mA)

3.0

2.0

5.0 7.0 10

20 30

50

Figure 4. Collector Saturation Region

500

tr

100
70
50
30
20

td @ VBE(off) = 0 V
7.0
5.0
3.0
5.0 7.0 10

2.0 V
20 30
50 70 100
IC, COLLECTOR CURRENT

Figure 5. TurnOn Time

VCC = 30 V
IC/IB = 10
IB1 = IB2
TJ = 25C

200
tf
100
70
50
30

ts = ts 1/8 tf

20

10

2796

300

VCC = 30 V
IC/IB = 10
TJ = 25C
t, TIME (ns)

t, TIME (ns)

300
200

200 300 500

10
7.0
5.0
5.0 7.0 10

20 30
50 70 100
200 300 500
IC, COLLECTOR CURRENT (mA)

Figure 6. TurnOff Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

P2N2907A
TYPICAL SMALL SIGNAL CHARACTERISTICS
NOISE FIGURE
VCE = 10 Vdc, TA = 25C
10

10

8.0

8.0
NF, NOISE FIGURE (dB)

IC = 1.0 mA, Rs = 430


500 A, Rs = 560
50 A, Rs = 2.7 k
100 A, Rs = 1.6 k

6.0

4.0

Rs = OPTIMUM SOURCE RESISTANCE

2.0

0
0.01 0.02 0.05 0.1 0.2

0.5 1.0 2.0

5.0 10

20

50

C, CAPACITANCE (pF)

50

100

200

500 1.0 k 2.0 k

5.0 k 10 k

20 k

f, FREQUENCY (kHz)

Rs, SOURCE RESISTANCE (OHMS)

Figure 7. Frequency Effects

Figure 8. Source Resistance Effects

20

Ceb

10
7.0
5.0

Ccb

3.0

0.2 0.3 0.5

1.0

2.0 3.0 5.0

10

20 30

50 k

400
300
200

100
80

VCE = 20 V
TJ = 25C

60
40
30
20
1.0 2.0

5.0

10

20

50

100 200

500 1000

REVERSE VOLTAGE (VOLTS)

IC, COLLECTOR CURRENT (mA)

Figure 9. Capacitances

Figure 10. CurrentGain Bandwidth Product

+0.5

1.0
TJ = 25C

0.6

VBE(sat) @ IC/IB = 10
COEFFICIENT (mV/ C)

0.8
V, VOLTAGE (VOLTS)

IC = 50 A
100 A
500 A
1.0 mA

4.0

100

30

2.0
0.1

6.0

2.0

f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)

NF, NOISE FIGURE (dB)

f = 1.0 kHz

VBE(on) @ VCE = 10 V

0.4

0.2

RqVC for VCE(sat)


0.5
1.0
1.5
RqVB for VBE

2.0
VCE(sat) @ IC/IB = 10

0
0.1 0.2

0.5 1.0 2.0 5.0 10 20

50 100 200

500

2.5
0.1 0.2 0.5 1.0 2.0

5.0 10 20

50 100 200 500

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 11. On Voltage

Figure 12. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2797

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN Silicon Planar


Epitaxial Transistor

PZT651T1
Motorola Preferred Device

This NPN Silicon Epitaxial transistor is designed for use in industrial and consumer
applications. The device is housed in the SOT223 package which is designed for
medium power surface mount applications.

SOT223 PACKAGE
HIGH CURRENT
NPN SILICON
TRANSISTOR
SURFACE MOUNT

High Current: 2.0 Amp


The SOT223 package can be soldered using wave or reflow.
SOT223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering, eliminating the possibility
of damage to the die.
Available in 12 mm Tape and Reel
Use PZT651T1 to order the 7 inch/1000 unit reel
Use PZT651T3 to order the 13 inch/4000 unit reel
PNP Complement is PZT751T1

COLLECTOR 2,4
1

2
3

BASE
1

CASE 318E04, STYLE 1


TO261AA
EMITTER 3

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

60

Vdc

CollectorBase Voltage

VCBO

80

Vdc

EmitterBase Voltage

VEBO

5.0

Vdc

Collector Current

IC

2.0

Adc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

0.8
6.4

Watts
mW/C

Storage Temperature Range

Tstg

65 to 150

TJ

150

Symbol

Max

Unit

RJA

156

C/W

TL

260
10

C
Sec

Rating

Junction Temperature

DEVICE MARKING
651

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance from JunctiontoAmbient in Free Air
Maximum Temperature for Soldering Purposes
Time in Solder Bath

1. Device mounted on a FR4 glass epoxy printed circuit board using minimum recommended footprint.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2798

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PZT651T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristics

Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage


(IC = 10 mAdc, IB = 0)

V(BR)CEO

60

Vdc

CollectorEmitter Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

80

Vdc

EmitterBase Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

BaseEmitter Cutoff Current


(VEB = 4.0 Vdc)

IEBO

0.1

Adc

CollectorBase Cutoff Current


(VCB = 80 Vdc, IE = 0)

ICBO

100

nAdc

75
75
75
40

0.5
0.3

OFF CHARACTERISTICS

ON CHARACTERISTICS (2)
DC Current Gain
(IC = 50 mAdc, VCE = 2.0 Vdc)
(IC = 500 mAdc, VCE = 2.0 Vdc)
(IC = 1.0 Adc, VCE = 2.0 Vdc)
(IC = 2.0 Adc, VCE = 2.0 Vdc)

hFE

CollectorEmitter Saturation Voltages


(IC = 2.0 Adc, IB = 200 mAdc)
(IC = 1.0 Adc, IB = 100 mAdc)

VCE(sat)

BaseEmitter Voltages
(IC = 1.0 Adc, VCE = 2.0 Vdc)

VBE(on)

1.0

Vdc

BaseEmitter Saturation Voltage


(IC = 1.0 Adc, IB = 100 mAdc)

VBE(sat)

1.2

Vdc

fT

75

MHz

CurrentGain Bandwidth
(IC = 50 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

Vdc

2. Pulse Test: Pulse Width 300 s, Duty Cycle = 2.0%

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2799

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

PZT751T1

PNP Silicon Planar


Epitaxial Transistor

Motorola Preferred Device

This PNP Silicon Epitaxial transistor is designed for use in industrial and consumer
applications. The device is housed in the SOT223 package which is designed for
medium power surface mount applications.
High Current: 2.0 Amp
The SOT223 Package can be soldered using wave or reflow.

SOT223 PACKAGE
HIGH CURRENT
PNP SILICON
TRANSISTOR
SURFACE MOUNT

SOT223 package ensures level mounting, resulting in improved thermal


conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering, eliminating the possibility of
damage to the die

COLLECTOR 2, 4

Available in 12 mm Tape and Reel


Use PZT751T1 to order the 7 inch/1000 unit reel.
Use PZT751T3 to order the 13 inch/4000 unit reel.

BASE
1

NPN Complement is PZT651T1

2
3

CASE 318E-04, STYLE 1


TO-261AA
EMITTER 3

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

60

Vdc

CollectorBase Voltage

VCBO

80

Vdc

EmitterBase Voltage

VEBO

5.0

Vdc

Collector Current

IC

2.0

Adc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

0.8
6.4

Watts
mW/C

Storage Temperature Range

Tstg

65 to 150

TJ

150

RJA

156

C/W

TL

260
10

C
Sec

Junction Temperature

DEVICE MARKING
ZT751

THERMAL CHARACTERISTICS
Thermal Resistance from JunctiontoAmbient in Free Air
Maximum Temperature for Soldering Purposes
Time in Solder Bath

1. Device mounted on a FR4 glass epoxy printed circuit board using minimum recommended footprint.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2800

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PZT751T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage


(IC = 10 mAdc, IB = 0)

V(BR)CEO

60

Vdc

CollectorEmitter Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

80

Vdc

EmitterBase Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

BaseEmitter Cutoff Current


(VEB = 4.0 Vdc)

IEBO

0.1

Adc

CollectorBase Cutoff Current


(VCB = 80 Vdc, IE = 0)

ICBO

100

nAdc

75
75
75
40

0.5
0.3

Characteristics

OFF CHARACTERISTICS

ON CHARACTERISTICS (2)
DC Current Gain
(IC = 50 mAdc, VCE = 2.0 Vdc)
(IC = 500 mAdc, VCE = 2.0 Vdc)
(IC = 1.0 Adc, VCE = 2.0 Vdc)
(IC = 2.0 Adc, VCE = 2.0 Vdc)

hFE

CollectorEmitter Saturation Voltages


(IC = 2.0 Adc, IB = 200 mAdc)
(IC = 1.0 Adc, IB = 100 mAdc)

VCE(sat)

BaseEmitter Voltages
(IC = 1.0 Adc, VCE = 2.0 Vdc)

VBE(on)

1.0

Vdc

BaseEmitter Saturation Voltage


(IC = 1.0 Adc, IB = 100 mAdc)

VBE(sat)

1.2

Vdc

fT

75

MHz

CurrentGainBandwidth
(IC = 50 mAdc, VCE = 5.0 Vdc, f = 100 MHz)

Vdc

2. Pulse Test: Pulse Width 300 s, Duty Cycle = 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2801

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

NPN Silicon Planar


Epitaxial Transistor

PZT2222AT1
Motorola Preferred Device

This NPN Silicon Epitaxial transistor is designed for use in linear and switching
applications. The device is housed in the SOT-223 package which is designed for
medium power surface mount applications.

SOT-223 PACKAGE
NPN SILICON
TRANSISTOR
SURFACE MOUNT

PNP Complement is PZT2907AT1


The SOT-223 package can be soldered using wave or reflow.
SOT-223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering, eliminating the possibility of
damage to the die.
Available in 12 mm tape and reel
Use PZT2222AT1 to order the 7 inch/1000 unit reel.
Use PZT2222AT3 to order the 13 inch/4000 unit reel.

COLLECTOR
2, 4

BASE
1

2
3

CASE 318E-04, STYLE 1


TO-261AA

3
EMITTER

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector-Emitter Voltage

VCEO

40

Vdc

Collector-Base Voltage

VCBO

75

Vdc

Emitter-Base Voltage (Open Collector)

VEBO

6.0

Vdc

Collector Current

IC

600

mAdc

Total Power Dissipation up to TA = 25C(1)

PD

1.5

Watts

Storage Temperature Range

Tstg

65 to +150

TJ

150

RJA

83.3

C/W

TL

260
10

C
Sec

Junction Temperature

THERMAL CHARACTERISTICS
Thermal Resistance from Junction to Ambient
Lead Temperature for Soldering, 0.0625 from case
Time in Solder Bath

DEVICE MARKING
P1F

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Collector-Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0)

V(BR)CEO

40

Vdc

Collector-Base Breakdown Voltage (IC = 10 Adc, IE = 0)

V(BR)CBO

75

Vdc

Emitter-Base Breakdown Voltage (IE = 10 Adc, IC = 0)

OFF CHARACTERISTICS

V(BR)EBO

6.0

Vdc

Base-Emitter Cutoff Current (VCE = 60 Vdc, VBE = 3.0 Vdc)

IBEX

20

nAdc

Collector-Emitter Cutoff Current (VCE = 60 Vdc, VBE = 3.0 Vdc)

ICEX

10

nAdc

Emitter-Base Cutoff Current (VEB = 3.0 Vdc, IC = 0)

IEBO

100

nAdc

1. Device mounted on an epoxy printed circuit board 1.575 inches x 1.575 inches x 0.059 inches; mounting pad for the collector lead min. 0.93 inches2.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2802

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PZT2222AT1
ELECTRICAL CHARACTERISTICS continued (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Max

Unit

10
10

nAdc
Adc

35
50
70
35
100
50
40

300

0.3
1.0

0.6

1.2
2.0

2.0
0.25

8.0
1.25

8.0x10-4
4.0x10-4

50
75

300
375

5.0
25

35
200

4.0

dB

Current-Gain Bandwidth Product


(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT

300

MHz

Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cc

8.0

pF

Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

Ce

25

pF

(VCC = 30 Vdc, IC = 150 mAdc,


IB(on)
mAdc, VEB(off)
0.5
5 Vdc)
B( ) = 15 mAdc
EB( ff) = 0
Figure 1

td

10

ns

tr

25

(VCC = 30 Vdc, IC = 150 mAdc,


IB(on)
B( ) = IB(
B(off)
ff) = 15 mAdc)
Figure 2

ts

225

tf

60

OFF CHARACTERISTICS (continued)


Collector-Base Cutoff Current
(VCB = 60 Vdc, IE = 0)
(VCB = 60 Vdc, IE = 0, TA = 125C)

ICBO

ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc, TA = 55C)
(IC = 150 mAdc, VCE = 10 Vdc)
(IC = 150 mAdc, VCE = 1.0 Vdc)
(IC = 500 mAdc, VCE = 10 Vdc)

hFE

Collector-Emitter Saturation Voltages


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

Base-Emitter Saturation Voltages


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

Input Impedance
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)
(VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz)

hie

Voltage Feedback Ratio


(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)
(VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz)

hre

Small-Signal Current Gain


(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)
(VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz)
Output Admittance
(VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz)
(VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz)
Noise Figure (VCE = 10 Vdc, IC = 100 Adc, f = 1.0 kHz)

hfe

Vdc

Vdc

hoe

mhos

DYNAMIC CHARACTERISTICS

SWITCHING TIMES (TA = 25C)


Delay Time
Rise Time
Storage Time
Fall Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

ns

2803

PZT2222AT1
VCC

Vi
R2

90%

Vo

R1
10%

0
tr

Vi

D.U.T.

tp

Figure 1. Input Waveform and Test Circuit for Determining Delay Time and Rise Time
Vi = 0.5 V to +9.9 V, VCC = +30 V, R1 = 619 , R2 = 200 .
PULSE GENERATOR:
PULSE DURATION
RISE TIME
DUTY FACTOR

tp
tr
=

200 ns
2 ns
0.02

OSCILLOSCOPE:
INPUT IMPEDANCE
INPUT CAPACITANCE
RISE TIME

Zi
Ci
tr

> 100 k
<
12 pF
<
5 ns

VCC

Vi
+16.2 V

R2

R1
0

TIME

D.U.T.
R3

Vi

Vo
OSCILLOSCOPE

D1
R4

13.8 V
tf

100 s
VBB

Figure 2. Input Waveform and Test Circuit for Determining Storage Time and Fall Time

2804

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

PNP Silicon
Epitaxial Transistor

PZT2907AT1
Motorola Preferred Device

This PNP Silicon Epitaxial transistor is designed for use in linear and
switching applications. The device is housed in the SOT-223 package which is
designed for medium power surface mount applications.

SOT-223 PACKAGE
PNP SILICON
TRANSISTOR
SURFACE MOUNT

NPN Complement is PZT2222AT1


The SOT-223 package can be soldered using wave or reflow
SOT-223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering eliminating the possibility of
damage to the die.
COLLECTOR
Available in 12 mm tape and reel
Use PZT2907AT1 to order the 7 inch/1000 unit reel.
Use PZT2907AT3 to order the 13 inch/4000 unit reel.

2,4

4
1

BASE 1

2
3

CASE 318E-04, STYLE 1


TO-261AA

3
EMITTER

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

Collector-Emitter Voltage

VCEO

60

Vdc

Collector-Base Voltage

VCBO

60

Vdc

Emitter-Base Voltage

VEBO

5.0

Vdc

Collector Current

IC

600

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

65 to 150

RJA

83.3

C/W

TL

260
10

C
Sec

Operating and Storage Temperature Range

THERMAL CHARACTERISTICS
Thermal Resistance Junction-to-Ambient (surface mounted)
Lead Temperature for Soldering, 0.0625 from case
Time in Solder Bath

DEVICE MARKING
P2F

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Collector-Base Breakdown Voltage (IC = 10 Adc, IE = 0)

V(BR)CBO

60

Vdc

Collector-Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0)

V(BR)CEO

60

Vdc

Emitter-Base Breakdown Voltage (IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

Collector-Base Cutoff Current (VCB = 50 Vdc, IE = 0)

ICBO

10

nAdc

Collector-Emitter Cutoff Current (VCE = 30 Vdc, VBE = 0.5 Vdc)

ICEX

50

nAdc

Base-Emitter Cutoff Current (VCE = 30 Vdc, VBE = 0.5 Vdc)

IBEX

50

nAdc

Characteristic

OFF CHARACTERISTICS

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 4

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2805

PZT2907AT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

75
100
100
100
50

300

0.4
1.6

1.3
2.6

Unit

ON CHARACTERISTICS(2)
DC Current Gain
(IC = 0.1 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 150 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 10 Vdc)

hFE

Collector-Emitter Saturation Voltages


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VCE(sat)

Base-Emitter Saturation Voltages


(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)

VBE(sat)

Vdc

Vdc

DYNAMIC CHARACTERISTICS
Current-Gain Bandwidth Product (IC = 50 mAdc, VCE = 20 Vdc, f = 100 MHz)

fT

200

MHz

Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

Cc

8.0

pF

Input Capacitance (VEB = 2.0 Vdc, IC = 0, f = 1.0 MHz)

Ce

30

pF

ton

45

ns

td

10

tr

40

toff

100

ts

80

tf

30

SWITCHING TIMES
Turn-On Time
Vd IC = 150
150 mAdc,
Ad
(VCC = 30 Vdc,
IB1 = 15
15 mAdc)

Delay Time
Rise Time
Turn-Off Time

(VCC = 6.0
6 0 Vdc,
Vd IC = 150
150 mAdc,
Ad
IB1 = IB2 = 15
15 mAdc)

Storage Time
Fall Time

ns

2. Pulse Test: Pulse Width 300 s, Duty Cycle = 2.0%.

30 V
INPUT
Zo = 50
PRF = 150 Hz
RISE TIME 2.0 ns

1.0 k

50
200 ns

TO OSCILLOSCOPE
RISE TIME 5.0 ns

6.0 V

1.0 k

37

TO OSCILLOSCOPE
RISE TIME 5.0 ns

1.0 k

0
30 V
50

1N916

200 ns

Figure 1. Delay and Rise


Time Test Circuit

2806

INPUT
Zo = 50
PRF = 150 Hz
RISE TIME 2.0 ns

200

0
16 V

+15 V

Figure 2. Storage and Fall


Time Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PZT2907AT1

1000

hFE, CURRENT GAIN

TJ = 125C
TJ = 25C
100
TJ = 55C

10
0.1

1.0
10
100
IC, COLLECTOR CURRENT (mA)

1000

f T, CURRENT-GAIN BANDWIDTH PRODUCT (MHz)

TYPICAL ELECTRICAL CHARACTERISTICS

1000

100

VCE = 20 V
TJ = 25C
10
1.0

Figure 3. DC Current Gain

10
100
IC, COLLECTOR CURRENT (mA)

1000

Figure 4. Current Gain Bandwidth Product

1.0

30
TJ = 25C

0.6

20

VBE(sat) @ IC/IB = 10

Ceb
CAPACITANCE (pF)

VOLTAGE (VOLTS)

0.8

VBE(on) @ VCE = 10 V

0.4

0.2

7.0
Ccb

5.0

3.0

VCE(sat) @ IC/IB = 10
0
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200
IC, COLLECTOR CURRENT (mA)

10

500

Figure 5. ON Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2.0
0.1

0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30


REVERSE VOLTAGE (VOLTS)

Figure 6. Capacitances

2807

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

PZTA14T1

NPN SmallSignal
Darlington Transistor

Motorola Preferred Device

This NPN small signal darlington transistor is designed for use in switching
applications, such as print hammer, relay, solenoid and lamp drivers. The
device is housed in the SOT-223 package, which is designed for medium power
surface mount applications.

SOT223 PACKAGE
MEDIUM POWER
NPN SILICON
DARLINGTON
TRANSISTOR
SURFACE MOUNT

High fT : 125 MHz Minimum


The SOT-223 Package can be soldered using wave or reflow.
SOT-223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering, eliminating the possibility of
damage to the die.

COLLECTOR 2, 4

Available in 12 mm Tape and Reel


Use PZTA14T1 to order the 7 inch/1000 unit reel
Use PZTA14T3 to order the 13 inch/4000 unit reel

1
2

BASE
1

The PNP Complement is PZTA64T1

EMITTER 3

CASE 318E-04, STYLE 1


TO-261AA

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

Collector-Emitter Voltage

VCES

30

Vdc

Collector-Emitter Voltage

VCEO

30

Vdc

Emitter-Base Voltage

VEBO

10

Vdc

IC

300

mAdc

Collector Current
Total Power Dissipation @ TA = 25C(1)
Operating and Storage Temperature Range

PD

1.5

Watts

TJ, Tstg

65 to 150

RJA

83.3

C/W

TL

260
10

C
Sec

DEVICE MARKING
P1N

THERMAL CHARACTERISTICS
Thermal Resistance
Junction-to-Ambient (surface mounted)
Maximum Temperature for Soldering Purposes
Time in Solder Bath

1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

2808

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PZTA14T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Symbol

Min

Typ

Max

Unit

Collector-Base Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

30

Vdc

Collector-Emitter Breakdown Voltage


(IC = 100 Adc, IB = 0)

V(BR)CES

30

Vdc

Emitter-Base Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

10

Vdc

Collector-Base Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

0.1

Adc

Emitter-Base Cutoff Current


(VEB = 10 Vdc, IC = 0)

IEBO

0.1

Adc

10,000
20,000

Characteristics

OFF CHARACTERISTICS

ON CHARACTERISTICS (2)
DC Current Gain
(IC = 10 mAdc, VCE = 5.0 Vdc)
(IC = 100 mAdc, VCE = 5.0 Vdc)

hFE

Collector-Emitter Saturation Voltage


(IC = 100 mAdc, IB = 0.1 mAdc)

VCE(sat)

1.5

Vdc

Base-Emitter On Voltage
(IC = 100 mAdc, VCE = 5.0 Vdc)

VBE(on)

2.0

Vdc

fT

125

MHz

DYNAMIC CHARACTERISTICS
Current-Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc)
2. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2809

PZTA14T1
TYPICAL ELECTRICAL CHARACTERISTICS

hFE, DC CURRENT GAIN

100 k
70 k
50 k

4.0
|h FE|, SMALL-SIGNAL CURRENT GAIN

200 k
TJ = 125C

25C

30 k
20 k
10 k
7.0 k
5.0 k

55C

3.0 k
2.0 k
5.0 7.0

10

VCE = 5.0 V
20 30
50 70 100
200
IC, COLLECTOR CURRENT (mA)

300

VCE = 5.0 V
f = 100 MHz
TJ = 25C

2.0

1.0
0.8
0.6
0.4

0.2
0.5

500

1.0

Figure 1. DC Current Gain

1.6

2.0

0.5
10
20
50
100
IC, COLLECTOR CURRENT (mA)

200

500

Figure 2. High Frequency Current Gain

20

TJ = 25C

TJ = 25C

VBE(sat) @ IC/IB = 1000

C, CAPACITANCE (pF)

V, VOLTAGE (VOLTS)

1.4

1.2
VBE(on) @ VCE = 5.0 V
1.0

0.8

10

7.0

Cibo
Cobo

5.0

3.0

VCE(sat) @ IC/IB = 1000

0.6
5.0 7.0

10

20 30
50 70 100
200 300
IC, COLLECTOR CURRENT (mA)

2.0
0.04

500

0.1

RV, TEMPERATURE COEFFICIENT (mV/C)

VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)

TJ = 25C
2.5
500 mA

2.0

1.5

1.0

0.5
0.1 0.2

0.5 1.0 2.0 5.0 10 20


50 100 200
IB, BASE CURRENT (A)

Figure 5. Collector Saturation Region

2810

1.0

2.0

4.0

10

20

40

Figure 4. Capacitance

3.0

250 mA

0.4

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. On Voltages

IC = 10 mA 50 mA

0.2

500 1000

1.0

2.0

*APPLIES FOR IC/IB hFE/3.0


*RVC for VCE(sat)

25C to 125C

55C to 25C
3.0

4.0

VB for VBE

5.0
6.0
5.0 7.0

25C to 125C

55C to 25C

10

20 30
50 70 100
IC, COLLECTOR CURRENT (mA)

200 300

500

Figure 6. Temperature Coefficients

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistor


Surface Mount

PZTA42T1
Motorola Preferred Device

NPN Silicon

COLLECTOR 2,4

SOT223 PACKAGE
NPN SILICON
HIGH VOLTAGE
TRANSISTOR
SURFACE MOUNT

BASE
1
EMITTER 3

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector-Emitter Voltage (Open Base)

VCEO

300

Vdc

Collector-Base Voltage (Open Emitter)

VCBO

300

Vdc

Emitter-Base Voltage (Open Collector)

VEBO

6.0

Vdc

Collector Current (DC)

IC

500

mAdc

Total Power Dissipation @ TA = 25C(1)

PD

1.5

Watts

Storage Temperature Range

Tstg

65 to +150

TJ

150

Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction-to-Ambient(1)

RJA

83.3

C/W

Junction Temperature

2
3

CASE 318E-04, STYLE 1


TO-261AA

DEVICE MARKING
P1D

THERMAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Collector-Emitter Breakdown Voltage(2)


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

300

Vdc

Collector-Base Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

300

Vdc

Emitter-Base Breakdown Voltage


(IE = 100 Adc, IC = 0)

V(BR)EBO

6.0

Vdc

Collector-Base Cutoff Current


(VCB = 200 Vdc, IE = 0)

ICBO

0.1

Adc

Emitter-Base Cutoff Current


(VBE = 6.0 Vdc, IC = 0)

IEBO

0.1

Adc

Characteristics

OFF CHARACTERISTICS

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min 0.93 in2.
2. Pulse Test Conditions, tp = 300 s, = 0.02.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2811

PZTA42T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)

hFE

25
40
40

fT

50

MHz

Cre

3.0

pF

Collector-Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VCE(sat)

0.5

Vdc

Base-Emitter Saturation Voltage


(IC = 20 mAdc, IB = 2.0 mAdc)

VBE(sat)

0.9

Vdc

DYNAMIC CHARACTERISTICS
Current-Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
Feedback Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)

2812

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

PZTA64T1

PNP SmallSignal
Darlington Transistor

Motorola Preferred Device

This PNP small-signal darlington transistor is designed for use in preamplifiers


input applications or wherever it is necessary to have a high input impedance.
The device is housed in the SOT-223 package which is designed for medium
power surface mount applications.

SOT-223 PACKAGE
PNP SILICON
DARLINGTON
TRANSISTOR
SURFACE MOUNT

High fT : 125 MHz Minimum


The SOT-223 Package can be soldered using wave or reflow.
SOT-223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering eliminating the possibility of
damage to the die.
Available in 12 mm Tape and Reel
Use PZTA64T1 to order the 7 inch/1000 unit reel.
Use PZTA64T3 to order the 13 inch/4000 unit reel.
NPN Complement is PZTA14T1

COLLECTOR 2, 4
1
2

BASE
1

EMITTER 3

CASE 318E-04, STYLE 1


TO-261AA

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

Collector-Emitter Voltage

VCES

30

Vdc

Collector-Base Voltage

VCBO

30

Vdc

Emitter-Base Voltage

VEBO

10

Vdc

PD

1.5

Watts

Total Power Dissipation @ TA = 25C(1)


Collector Current
Operating and Storage Temperature Range

IC

500

mAdc

TJ, Tstg

65 to +150

RJA

83.3

C/W

TL

260
10

C
Sec

DEVICE MARKING
P2V

THERMAL CHARACTERISTICS
Thermal Resistance from Junction to Ambient (surface mounted)
Maximum Temperature for Soldering Purposes
Time in Solder Bath

1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 4

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2813

PZTA64T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Symbol

Min

Max

Unit

Collector-Emitter Breakdown Voltage


(IC = 100 Adc, VBE = 0)

V(BR)CES

30

Vdc

Collector-Base Breakdown Voltage


(IC = 100 A, IE = 0)

V(BR)CBO

30

Vdc

Emitter-Base Breakdown Voltage


(IE = 100 A, IC = 0)

V(BR)EBO

10

Vdc

Emitter-Base Cutoff Current


(VBE = 10 Vdc, IC = 0)

IEBO

0.1

Adc

Collector-Base Cutoff Current


(VCB = 30 Vdc, IE = 0)

ICBO

0.1

Adc

10,000
20,000

Characteristic

OFF CHARACTERISTICS

ON CHARACTERISTICS(2)
DC Current Gain
(IC = 10 mAdc, VCE = 5.0 Vdc)
(IC = 100 mAdc, VCE = 5.0 Vdc)

hFE

Collector-Emitter Saturation Voltage


(IC = 100 mAdc, IB = 0.1 mAdc)

VCE(sat)

1.5

Vdc

Base-Emitter On-Voltage
(VCE = 5.0 Vdc, IC = 100 mAdc)

VBE(on)

2.0

Vdc

fT

125

MHz

DYNAMIC CHARACTERISTICS
Current-Gain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
2. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

2814

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PZTA64T1
hFE, DC CURRENT GAIN (X1.0 K)

200
TA = 125C

100
70
50

10 V
25C

30

VCE = 2.0 V
5.0 V

20
10
7.0
5.0

55C

3.0
2.0
0.3

0.5

0.7

1.0

2.0

3.0

5.0
7.0
10
20
IC, COLLECTOR CURRENT (mA)

30

50

70

100

200

300

10

4.0
3.0

2.0
VCE = 5.0 V
f = 100 MHz
TA = 25C

1.6
V, VOLTAGE (VOLTS)

|h FE |, HIGH FREQUENCY CURRENT GAIN

Figure 1. DC Current Gain

2.0
1.0

0.4

VBE(sat) @ IC/IB = 100

1.2
VBE(on) @ VCE = 5.0 V
0.8 VCE(sat) @ IC/IB = 1000
IC/IB = 100
0.4

0.2
0.1
1.0

TA = 25C

2.0

5.0

10
20
50
100 200
IC, COLLECTOR CURRENT (mA)

500

0
0.3 0.5

1K

1.0

2.0 3.0 5.0 10


20 30
50 100
IC, COLLECTOR CURRENT (mA)

VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)

Figure 2. High Frequency Current Gain

200 300

Figure 3. On Voltage

2.0
TA = 25C

1.8
1.6

IC = 10 mA 50 mA 100 mA

175 mA

300 mA

1.4
1.2
1.0
0.8
0.6
0.1 0.2 0.5

1.0 2.0 5.0 10 20 50 100 200 500 1K 2K


IB, BASE CURRENT (A)

5K 10K

Figure 4. Collector Saturation Region

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2815

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistor

PZTA92T1

PNP Silicon

COLLECTOR 2,4

BASE
1
EMITTER 3

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

300

Vdc

CollectorBase Voltage

VCBO

300

Vdc

EmitterBase Voltage

VEBO

5.0

Vdc

Collector Current

IC

500

mAdc

Total Power Dissipation up to TA = 25C(1)

PD

1.5

Watts

Storage Temperature Range

Tstg

65 to +150

TJ

150

Characteristic

Symbol

Max

Unit

Thermal Resistance from Junction to Ambient(1)

RJA

83.3

C/W

Junction Temperature

Motorola Preferred Device

SOT223 PACKAGE
PNP SILICON
HIGH VOLTAGE TRANSISTOR
SURFACE MOUNT

2
3

CASE 318E04, STYLE 1


TO261AA

DEVICE MARKING
P2D

THERMAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)

V(BR)CEO

300

Vdc

CollectorBase Breakdown Voltage (IC = 100 Adc, IE = 0)

V(BR)CBO

300

Vdc

EmitterBase Breakdown Voltage (IE = 100 Adc, IC = 0)

OFF CHARACTERISTICS

V(BR)EBO

5.0

Vdc

CollectorBase Cutoff Current (VCB = 200 Vdc, IE = 0)

ICBO

0.25

Adc

EmitterBase Cutoff Current (VBE = 3.0 Vdc, IC = 0)

IEBO

0.1

Adc

25
40
25

VCE(sat)
VBE(sat)

0.5
0.9

Ccb

6.0

pF

fT

50

MHz

ON CHARACTERISTICS
DC Current Gain(2)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 30 mAdc, VCE = 10 Vdc)

hFE

Saturation Voltages
(IC = 20 mAdc, IB = 2.0 mAdc)
(IC = 20 mAdc, IB = 2.0 mAdc)

Vdc

DYNAMIC CHARACTERISTICS
CollectorBase Capacitance @ f = 1.0 MHz (VCB = 20 Vdc, IE = 0)
CurrentGain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 in2.
2. Pulse Test: Pulse Width 300 s; Duty Cycle = 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

2816

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Transistor

PZTA96T1

PNP Silicon

COLLECTOR 2,4

BASE
1
EMITTER 3

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

CollectorEmitter Voltage

VCEO

450

Vdc

CollectorBase Voltage

VCBO

450

Vdc

EmitterBase Voltage

VEBO

5.0

Vdc

Collector Current

IC

500

mAdc

Total Power Dissipation up to TA = 25C(1)

PD

1.5

Watts

Storage Temperature Range

Tstg

65 to +150

TJ

150

Characteristic

Symbol

Max

Unit

Thermal Resistance from Junction to Ambient(1)

RJA

83.3

Junction Temperature

Motorola Preferred Device

SOT223 PACKAGE
PNP SILICON
HIGH VOLTAGE TRANSISTOR
SURFACE MOUNT

2
3

CASE 318E04, STYLE 1


TO261AA

DEVICE MARKING
ZTA96

THERMAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

CollectorEmitter Breakdown Voltage


(IC = 1.0 mAdc, IB = 0)

V(BR)CEO

450

Vdc

CollectorEmitter Breakdown Voltage


(IC = 100 Adc, IE = 0)

V(BR)CBO

450

Vdc

EmitterBase Breakdown Voltage


(IE = 10 Adc, IC = 0)

V(BR)EBO

5.0

Vdc

CollectorBase Cutoff Current


(VCB = 400 Vdc, IE = 0)

ICBO

0.1

Adc

EmitterBase Cutoff Current


(VBE = 4.0 Vdc, IC = 0)

IEBO

0.1

Adc

hFE

50

150

VCE(sat)
VBE(sat)

0.6
1.0

OFF CHARACTERISTICS

ON CHARACTERISTICS
DC Current Gain(2)
(IC = 10 mAdc, VCE = 10 Vdc)
Saturation Voltages
(IC = 20 mAdc, IB = 2.0 mAdc)
(IC = 20 mAdc, IB = 2.0 mAdc)

Vdc

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 in2.
2. Pulse Test: Pulse Width 300 s; Duty Cycle = 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2817

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Advance Information

MDC3105LT1
Motorola Preferred Device

Integrated Relay/Solenoid Driver


Optimized to Switch 3 V to 5 V Relays from a 5 V Rail
Compatible with TX and TQ Series Telecom Relays Rated up to
300 mW at 3 V to 5 V

RELAY/SOLENOID DRIVER
SILICON MONOLITHIC
CIRCUIT BLOCK

Features Low Input Drive Current


Internal Zener Clamp Routes Induced Current to Ground Rather Than Back
to Supply
Guaranteed Off State with No Input Connection
Supports Large Systems with Minimal OffState Leakage

ESD Resistant in Accordance with the 2000 V Human Body Model


1

Provides a Robust Driver Interface Between Relay Coil and Sensitive


Logic Circuits

CASE 31808, STYLE 6


SOT23 (TO236AB)

Applications include:
Telecom Line Cards and Telephony
Industrial Controls
Security Systems

INTERNAL CIRCUIT DIAGRAM

Appliances and White Goods

Vout

(3)

Automated Test Equipment


Vin 1.0 k

Automotive Controls

6.8 V

This device is intended to replace an array of three to six discrete


components with an integrated SMT part. It is available in a SOT23
package. It can be used to switch other 3 to 5 Vdc Inductive Loads such
as solenoids and small DC motors.

(1)

33 k
GND

(2)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Power Supply Voltage

VCC

6.0

Vdc

Recommended Operating Supply Voltage

VCC

2.05.5

Vdc

Input Voltage

Vin(fwd)

6.0

Vdc

Reverse Input Voltage

Vin(rev)

0.5

Vdc

Output Sink Current Continuous

IO

300

mA

Junction Temperature

TJ

150

TA

40 to +85

Tstg

65 to +150

Symbol

Max

Unit

PD

225

mW

RqJA

556

C/W

Operating Ambient Temperature Range


Storage Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation(1)
Derate above 25C
Thermal Resistance Junction to Ambient
1. FR5 PCB of 1 x 0.75 x 0.062, TA = 25C
Preferred devices are Motorola recommended choices for future use and best overall value.
This document contains information on a new product. Specifications and information herein are subject to change without notice.

2818

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MDC3105LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BRout)
V(BRout)

6.4

6.8
0.7

7.2

5.0
30

2.5

0.2

0.4

250

OFF CHARACTERISTICS
Output Zener Breakdown Voltage
(@ IT = 10 mA Pulse)
Output Leakage Current @ 0 Input Voltage
(Vout = 5.5 Vdc, Vin = O.C., TA = 25C)
(Vout = 5.5 Vdc, Vin = O.C., TA = 85C)

IOO

ON CHARACTERISTICS
Input Bias Current @ Vin = 4.0 Vdc
(IO = 250 mA, Vout = 0.4 Vdc, TA = 40C)
(correlated to a measurement @ 25C)

Iin

mAdc

Output Saturation Voltage


(IO = 250 mA, Vin = 4.0 Vdc, TA = 40C)
(correlated to a measurement @ 25C)

Vdc

Output Sink Current Continuous


(TA = 40C, VCE = 0.4 Vdc, Vin = 4.0 Vdc )
(correlated to a measurement @ 25C)

IC(on)

mA

TYPICAL APPLICATIONDEPENDENT SWITCHING PERFORMANCE


SWITCHING CHARACTERISTICS
Symbol

VCC

Min

Typ

Max

Propagation Delay Times:


High to Low Propagation Delay; Figures 1, 2 (5.0 V 74HC04)
Low to High Propagation Delay; Figures 1, 2 (5.0 V 74HC04)

Characteristic

tPHL
tPLH

5.5
5.5

55
430

High to Low Propagation Delay; Figures 1, 3 (3.0 V 74HC04)


Low to High Propagation Delay; Figures 1, 3 (3.0 V 74HC04)

tPHL
tPLH

5.5
5.5

85
315

High to Low Propagation Delay; Figures 1, 4 (5.0 V 74LS04)


Low to High Propagation Delay; Figures 1, 4 (5.0 V 74LS04)

tPHL
tPLH

5.5
5.5

55
2385

Transition Times:
Fall Time; Figures 1, 2 (5.0 V 74HC04)
Rise Time; Figures 1, 2 (5.0 V 74HC04)

tf
tr

5.5
5.5

45
160

Fall Time; Figures 1, 3 (3.0 V 74HC04)


Rise Time; Figures 1, 3 (3.0 V 74HC04)

tf
tr

5.5
5.5

70
195

Fall Time; Figures 1, 4 (5.0 V 74LS04)


Rise Time; Figures 1, 4 (5.0 V 74LS04)

tf
tr

5.5
5.5

45
2400

V/t in

5.5

TBD

Units
ns

ns

Input Slew Rate(1)

V/ms

1. Minimum input slew rate must be followed to avoid overdissipating the device.

tf

Vin

tr
VCC

90%
50%
10%

GND
tPLH

tPHL

90%
50%
10%

Vout
tTHL

VZ
VCC
GND

tTLH

Figure 1. Switching Waveforms

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2819

MDC3105LT1
+4.5 VCC +5.5 Vdc

+ +
AROMAT
TX2L23 V

Vout (3)

Vout (3)

MDC3105LT1

74HC04 OR
EQUIVALENT

Vin (1)

MDC3105LT1

1k

1k
6.8 V

Vin (1)

6.8 V

33 k

74HC04 OR
EQUIVALENT

33 k

GND (2)

GND (2)

Figure 2. A 3.0V, 200mW Dual Coil Latching Relay Application


with 5.0 VHCMOS Interface

+3.0 VDD +3.75 Vdc


+4.5 VCC +5.5 Vdc

+ +
AROMAT
TX2L23 V

Vout (3)

Vout (3)

MDC3105LT1

74HC04 OR
EQUIVALENT

Vin (1)

MDC3105LT1

1k

1k
6.8 V

Vin (1)

6.8 V

33 k

74HC04 OR
EQUIVALENT

33 k

GND (2)

GND (2)

Figure 3. A 3.0V, 200mW Dual Coil Latching Relay Application


with 3.0 VHCMOS Interface
2820

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MDC3105LT1
+4.5 VCC +5.5 Vdc

+ +
AROMAT
TX2L23 V

Vout (3)

Vout (3)

MDC3105LT1

74LS04

BAL99LT1

MDC3105LT1

1k

1k
6.8 V

BAL99LT1

6.8 V

33 k

74LS04

33 k

Vin (1)

Vin (1)

GND (2)

GND (2)

Figure 4. A 3.0V, 200mW Dual Coil Latching Relay Application


with TTL Interface

+4.5 TO +5.5 Vdc

+
AROMAT
R1
TX25 V

+
R2

AROMAT
TX25 V

Max Continuous Current Calculation


R1 = R2 = 178 Nominal @ TA = 25C
Vout (3)

74HC04 OR
EQUIVALENT

Assuming 10% Make Tolerance,


R1 = R2 = (178 ) (0.9) = 160 Min @ TA = 25C
TC for Annealed Copper Wire is 0.4%/C
R1 = R2 = (160 ) [1+(0.004) (4025)] = 118
Min @ 40C

Vin (1)

R1 in Parallel with R2 = 59 Min @ 40C


Io

0.4 V + 86 mA Max
+ 5.5 V59Max
W Min

86 mA 300 mA Max Io spec.


GND (2)

Figure 5. Typical 5.0 V, 140 mW Coil Dual Relay Application

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2821

MDC3105LT1
TYPICAL OPERATING WAVEFORMS

4.5

225

3.5

175
IC (mA)

V in (VOLTS)

(Circuit of Figure 5)

2.5

125

1.5

75

500M

25
10

30

50
TIME (ms)

70

90

10

172

132
IZ (mA)

Vout (VOLTS)

52

12
50
TIME (ms)

70

90

10

Figure 8. 20 Hz Square Wave Response

30

50
TIME (ms)

70

90

1
TJ = 125C

Vo = 1.0 V
Vo = 0.25 V

0.8

400

TJ = 85C

300

TJ = 25C

200

TJ = 25C

OUTPUT VOLTAGE (V)

500

hFE

90

Figure 9. 20 Hz Square Wave Response

600

TJ = 40C

175

0.6
1

10

50

125

250
IC = 350 mA

0.4

0.2

100
0
1

10
100
Io, OUTPUT SINK CURRENT (mA)

Figure 10. Pulsed Current Gain


2822

70

92

30

50
TIME (ms)

Figure 7. 20 Hz Square Wave Response

Figure 6. 20 Hz Square Wave Input

10

30

1000

0
1E5

1E4
1E3
INPUT CURRENT

1E2

Figure 11. Collector Saturation Region


Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MDC5001T1

Low Voltage Bias Stabilizer


with Enable
Maintains Stable Bias Current in NType Discrete Bipolar Junction and Field
Effect Transistors
Provides Stable Bias Using a Single Component Without Use of Emitter Ballast
and Bypass Components

SILICON
SMALLBLOCK
INTEGRATED CIRCUIT

Operates Over a Wide Range of Supply Voltages Down to 1.8 Vdc


Reduces Bias Current Variation Due to Temperature and UnittoUnit Parametric
Changes
Consumes

t 0.5 mW at VCC = 2.75 V

Active High Enable is CMOS Compatible

5
4

This device provides a reference voltage and acts as a DC feedback element


around an external discrete, NPN BJT or NChannel FET. It allows the external
transistor to have its emitter/source directly grounded and still operate with a stable
collector/drain DC current. It is primarily intended to stabilize the bias of discrete RF
stages operating from a low voltage regulated supply, but can also be used to stabilize
the bias current of any linear stage in order to eliminate emitter/source bypassing and
achieve tighter bias regulation over temperature and unit variations. The ENABLE
polarity nulls internal current, Enable current, and RF transistor current in STANDBY.
This device is intended to replace a circuit of three to six discrete components.
The combination of low supply voltage, low quiescent current drain, and small
package make the MDC5001T1 ideal for portable communications applications such
as:

CASE 419B01, Style 19


SOT363

INTERNAL CIRCUIT DIAGRAM


VCC (4)

R1

Cellular Telephones

Q1

Pagers

R2

PCN/PCS Portables
GPS Receivers

Vref (6)

R3

PCMCIA RF Modems
Cordless Phones

Q2

Broadband and Multiband Transceivers and Other Portable Wireless Products

VENBL
(5)

R5

MAXIMUM RATINGS
Rating
Power Supply Voltage
Ambient Operating Temperature Range
Storage Temperature Range
Junction Temperature

Iout (1)

R4
Q4

Symbol

Value

Unit

VCC

15

Vdc

TA

40 to +85

Tstg

65 to +150

TJ

150

Collector Emitter Voltage (Q2)

VCEO

15

Enable Voltage (Pin 5)

VENBL

VCC

Symbol

Max

Unit

R6

GND (2) and (3)

THERMAL CHARACTERISTICS
Characteristic
Total Device Power Dissipation
(FR5 PCB of 1 0.75 0.062, TA = 25C)
Derate above 25C
Thermal Resistance, Junction to Ambient

PD

RJA

mW
150
1.2

mW/C

833

C/W

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2823

MDC5001T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

Recommended Operating Supply Voltage

VCC

1.8

2.75

10

Volts

Power Supply Current (VCC = 2.75 V)


Vref, Iout are unterminated
See Figure 8

ICC

130

200

V(BR)CEO2

15

Q2 Collector Emitter Breakdown Voltage


(IC2 = 10 A, IB2 = 0)
Reference Voltage (VENBL = VCC = 2.75 V, Vout = 0.7 V)
(Iout = 30 A)
(Iout = 150 A)
See Figure 1

Volts

Vref

Volts
2.050
2.110

2.075
2.135

2.100
2.160

5.0
15
25

10
30
50

DVref

Reference Voltage (VENBL = VCC = 2.75 V, Vout = 0.7 V,


40C TA +85C)
VCC Pulse Width = 10 mS, Duty Cycle = 1%
(Iout = 10 A)
(Iout = 30 A)
(Iout = 100 A)
See Figures 2 and 11

mV

The following SPICE models are provided as a convenience to the user and every effort has been made to insure their accuracy.
However, no responsibility for their accuracy is assumed by Motorola.

.MODEL Q4 NPN
BF = 136
BR = 0.2
CJC = 318.6 f
CJE = 569.2 f
CJS = 1.9 p
EG = 1.215
FC = 0.5
IKF = 24.41 m
IKR = 0.25
IRB = 0.0004
IS = 256E18
ISC = 1 f
ISE = 500E18
ITF = 0.9018
MJC = 0.2161
MJE = 0.3373
MJS = 0.13
NC = 1.09

2824

NE = 1.6
NF = 1.005
RB = 140
RBM = 70
RC = 180
RE = 1.6
TF = 553.6 p
TR = 10 n
VAF = 267.6
VAR = 12
VJC = 0.4172
VJE = 0.7245
VJS = 0.39
VTF = 10
XTB = 1.5
XTF = 2.077
XTI = 3

.MODEL Q1, Q2 PNP


BF = 87
BR = 0.6
CJC = 800E15
CJE = 46E15
EG = 1.215
FC = 0.5
IKF = 3.8E04
IKR = 2.0
IRB = 0.9E3
IS = 1.027E15
ISC = 10E18
ISE = 1.8E15
ITF = 2E3
MJC = 0.2161
MJE = 0.2161
NC = 0.8
NE = 1.38
NF = 1.015

NK = 0.5
NR = 1.0
RB = 720
RBM = 470
RC = 180
RE = 26
TF = 15E9
TR = 50E09
VAF = 54.93
VAR = 20
VAR = 20
VJC = 0.4172
VJE = 0.4172
VTF = 10
XTB = 1.5
XTF = 2.0
XTI = 3

RESISTOR VALUES
R1 = 12 K
R2 = 6 K
R3 = 3.4 K
R4 = 12 K
R5 = 20 K
R6 = 40 K

These models can be retrieved


electronically by accessing the
Motorola Web page at
http://designnet.sps.mot.com/models
and searching the section on
SMALLBLOCK models

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MDC5001T1

V CC , SUPPLY VOLTAGE (Vdc)

TJ = 25C

V ENBL = VCC

Iout
Iout
Iout
Iout

= 1000 m A
= 500 mA
= 100 mA
= 10 mA

10

TYPICAL OPEN LOOP CHARACTERISTICS

Vref (Vdc)

Figure 1. Vref versus VCC @ Iout

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2825

MDC5001T1
TYPICAL OPEN LOOP CHARACTERISTICS
(Refer to Circuits of Figures 10 through 15)
50
VCC = 2.75 Vdc
VENBL = VCC

Iout = 30 mA

20
V ref (mV)

800

Iout = 100 mA

ICC , SUPPLY CURRENT ( m Adc)

40
30

900
Iout = 500 mA

10
0

Iout = 10 mA

10
20
30

VENBL = VCC

600

TJ = 25C

500
TJ = 85C

400
300
200
100

40
50
45 35 25 15 5 5 15 25 35 45 55
TJ, JUNCTION TEMPERATURE (C)

65

85

75

10

160
TJ = 40C
TJ = 25C
TJ = 85C

500
300

TJ = 40C

VCC = 2.75 Vdc


Iref = 30 mA

140

TJ = 25C

120
IENABLE (m Adc)

H FE , Q2 DC CURRENT GAIN

3
4
5
6
7
VCC, SUPPLY VOLTAGE (Vdc)

Figure 3. ICC versus VCC @ TJ

1000

200
100
50

100

TJ = 85C

80
60
40

30

10
10

Figure 2. DVref versus TJ @ Iout

20

TJ = 40C

700

VCE2 = Vout Vref = 1.5 Vdc

20
0

20

30
50
100
200 300
Iout, DC OUTPUT CURRENT (mAdc)

500

1000

0.5

Figure 4. Q2 Current Gain versus


Output Current @ TJ

1.0

1.5
2.0
VENABLE (Vdc)

2.5

3.0

Figure 5. Ienable versus Venable

6.0
Iout = 500 mA
Iout = 30 mA

VCC = 5.0 Vdc


5.0

Vref , (Vdc)

4.0
3.3 Vdc
3.0

2.75 Vdc

2.0

1.8 Vdc
TJ = 25C

1.0
MIN VENBL FOR STABLE Vref @ VCC
0
0

0.5

1.0

1.5

2.0 2.5 3.0


Venable (Vdc)

3.5

4.0

4.5

5.0

Figure 6. Vref versus Venable @ VCC and Iout

2826

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MDC5001T1
TYPICAL CLOSED LOOP PERFORMANCE
(Refer to Circuits of Figures 16 & 17)

1.5

DIC 3 (%)

0.5
0

IC3 = 15 mA

2.0

IC3 = 10 mA
IC3 = 3 mA

0.5

1.0
0
1.0

1.0
1.5

IC3 = 15 mA
IC3 = 10 mA
IC3 = 3 mA
IC3 = 1 mA

3.0

V ref (%)

1.0

4.0
VCC = 2.75 Vdc
VENBL = VCC

VCC = 2.75 Vdc


VENBL = VCC
TA = 25C

IC3 = 1 mA
2.0

2.0
45 35 25 15 5 5 15 25 35 45 55
TA, AMBIENT TEMPERATURE (C)

3.0
65 75

85

Figure 7. DIC3 versus TA @ IC3

50

100
150
200
250
EXTERNAL TRANSISTOR DC BETA @ IC3

300

Figure 8. DVref versus External Transistor


DC Beta @ IC3

10
VCC = 2.75 Vdc
VENBL = VCC
TA = 25C

D I C 3 (%)

5.0

5.0
IC3 = 15 mA
IC3 = 10 mA
IC3 = 3 mA
IC3 = 1 mA

10
15
0

50

250
100
150
200
HFE, EXTERNAL TRANSISTOR DC BETA

300

Figure 9. DIC3 versus External Transistor


DC Beta @ IC3

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2827

MDC5001T1
OPEN LOOP TEST CIRCUITS
ICC
ICC

VCC (4)

VCC (4)

Q1
Q1

ENABLE
(5)

ENABLE
(5)

Vref (6)

Vref (6)
Q2

Iout (1)

Q2
Iout (1)

Iout

MDC5001

MDC5001

Q4
VCC

+
VBE3 = 0.7 V

GND (2) & (3)


GND (2) & (3)

Figure 11. Vref versus VCC Test Circuit

VCC (4)

VCC (4)

Q1

MDC5001

Q1

IB
ENABLE
(5)

Vref (6)
Q2

Iout (1)

Vref (6)
Q2

Iref

Iout

GND (2) & (3)

VBE3 = 0.7 V

Iout

Q4

V Vref

Iout

Iout (1)

MDC5001

Q4

VCC =
2.75 V

See NOTE 1

Figure 10. ICC versus VCC Test Circuit

V Vref

Iout

VCC

ENABLE
(5)

Iref

Q4

A Iout

A
GND (2) & (3)
1.5 V

See NOTE 1

Figure 12. Vref versus TJ Test Circuit

Figure 13. HFE versus Iout Test Circuit

VCC (4)

VCC (4)
+
+
VCC =
2.75 V

Q1

Q1
VCC

ENABLE
(5)
IENBL A

Vref (6)
Q2
MDC5001
Q4

Iout (1)
Iout

Vref (6)

ENABLE
(5)
Iref = 30 mA

Q2
MDC5001

+
GND (2) & (3)

VBE3 = 0.7 V

GND (2) & (3)

Iref

Iout
Vref +
V

Q4
VENBL

VENBL

Iout (1)

Iout A
+
VBE3 = 0.7 V

See NOTE 1

Figure 14. IENBL versus VENBL Test Circuit

Figure 15. Vref versus VENBL Test Circuit

NOTE 1: VBE3 is used to simulate actual operating conditions that reduce VCE2 & HFE2, and increase IB2 & Vref.

2828

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MDC5001T1
CLOSED LOOP TEST CIRCUITS
VCC (4)
A
IC3

Q1

Vref (6)
ENABLE (5)

Q2

Iout (1)
A

MDC5001
+

VBE3

Q3

Iout

Q4

VCC =
2.75 V

Vref

GND (2) & (3)

Figure 16. Vref and RF Stage IC3 versus HFE3 Test Circuit

VCC (4)
A
IC3

Q1

Vref (6)
ENABLE (5)

Q2

Iout (1)

1K

VBE3

MDC5001
+

Q4
VCC =
2.75 V

Q3
MRF941
HFE = 113

51

51
0.1 mF

100 pF

100 pF
0.018 mF

0.018 mF

GND (2) & (3)


NOTE: External RCs used to Maintain Broadband Stability of MRF941

Figure 17. RF Stage IC3 versus TA Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2829

MDC5001T1
APPLICATION CIRCUITS
REGULATED VCC = 2.75 Vdc

VCC (4)

IC3 = 3 mAdc
Q1

ENABLE
(5)

Q2

VENBL

Iout (1)

470 pF

30 nH

180

MDC5001

R5
240

Vref = 2.025 Vdc

Vref (6)

1K

Q4
Iout

8.0 nH

470 pF

VCC = 2.75 V

18 nH

RF OUT

Q3
MRF9411
Typ

RF IN
9 pF

GND (2) & (3)

5STEP DESIGN PROCEDURE


Step 1:
Step 2:
Step 3:
Step 4:
Step 5:

Choose VCC (1.8 V Min to 10 V Max)


Insure that Min VENBL is minimum indicated in Figures 5 and 6.
Choose bias current, IC3, and calculate needed Iout from typ HFE3
From Figure 1, read Vref for VCC and Iout calculated.
Calculate Nominal R5 = (VCC Vref)
(IC3 + Iout). Tweak as desired.

Figure 18. Class A Biasing of a Typical 900 MHz


BJT Amplifier Application
REGULATED VCC = 2.75 Vdc

VCC (4)

ID = 15 mAdc
R5
43 W

Q1

RFC
Vref (6)

ENABLE
(5)

Q2

VENBL

Vref = 2.085 Vdc

Iout (1)

1000 pF
6.8 nH

MDC5001

2.7 pF
RF OUT

1K

Q4
Iout

VCC =
2.75 V

12.5 nH
1000 pF

R6
22 K

RF IN
GND (2) & (3)

6.1 pF

Q3
MRF9811
Typ

EGS
5 Vdc

7STEP DESIGN PROCEDURE


Step 1:
Step 2:
Step 3:
Step 4:

Choose VCC (1.8 V Min to 10 V Max)


Insure that Min VENBL is minimum indicated in Figures 5 and 6.
Choose bias current, ID, and determine needed gatesource voltage, VGS.
Choose Iout keeping in mind that too large an Iout can impair MDC5000 DVref/DTJ
performance (Figure 2) but too large an R6 can cause IDGO & IGSO to bias on the FET.
Step 5: Calculate R6 = (VGS + EGS)
Iout
Step 6: From Figure 1, read Vref for VCC & Iout chosen
Step 7: Calculate Nominal R5 = (VCC Vref)
(ID + Iout). Tweak as desired.

Figure 19. Class A Biasing of a Typical 890 MHz


Depletion Mode GaAs FET Amplifier
2830

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Section 3
GreenLine Portfolio

In Brief . . .
New in this revision is Motorolas GreenLine portfolio of
devices. These devices feature energyconserving traits
superior to those of our existing line of standard parts for the
same usage. GreenLine devices can actually help reduce
the power demands of your products. In an increasingly
powerhungry world, Motorolas GreenLine portfolio
makes powerful sense. So much sense that we plan to
continue adding devices to the portfolio. Chances are, there
are Motorola GreenLine devices applicable to one or more
of your products ones that can help save energy, dollars
and the environment.
Currently, our portfolio consists of three families:
LowLeakage Switching Diodes: Reverse leakage
specifications guaranteed to 500 pA. They help extend battery life and are ideal for small battery powered systems in
which standby power is essential. Applications include ESD
protection, reverse voltage protection, and steering logic.
Bipolar Output Driver Transistors: Ultralow collector
saturation voltage. They deliver more energy to the intended
load with less power wasted through dissipation loss. Especially effective in lower voltage battery powered applications
and prolong battery life in portable and handheld communications and personal digital equipment. Applications include low voltage display light drivers and general output
drivers.
Small Signal HDTMOS: Lowest ever drainsource resistance versus package size. Lower rDS(on) means less
wasted energy through dissipation loss. Especially effective
for lowcurrent applications where energy conservation is
crucial. These small MOSFETs are ideal for spacesensitive
power management circuitry. Applications include low current switchmode power supplies, uninterruptable power supplies (UPS), power management systems, and bias
switching.
This chapter exclusively highlights the GreenLine devices,
which are also listed in their respective Transistor, Diode and
MOSFET chapters.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

3
3
1

2
2

CASE 318-08
(TO-236AB)
SOT-23

CASE 318D-04
SC59

6
4
1

1
3

CASE 318G-02
TSOP6

CASE 318E-04
(TO-261AA)
SOT-223

3
1

2
1

CASE 419-02
SC70/SOT323

CASE 425-04
SOD123

31

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BSS84LT1

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors
Part of the Greenline Portfolio of devices with energyconserving traits.
These miniature surface mount MOSFETs utilize Motorolas High
Cell Density, HDTMOS process. Reduced power loss conserves
energy, making this device ideal for use in small power management circuitry. Typical applications are dcdc converters, load
switching, power management in portable and batterypowered
products such as computers, printers, cellular and cordless
telephones.
1

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET

3 DRAIN
3
1
2

CASE 31808, Style 21


SOT23 (TO236AB)

GATE

Energy Efficient

Motorola Preferred Device

Miniature SOT23 Surface Mount Package Saves Board Space


2 SOURCE

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

50

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

130
520

mA

DraintoSource Voltage

Total Power Dissipation @ TA = 25C

PD

225

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

556

C/W

TL

260

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

DEVICE MARKING
BSS84LT1 = PD

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

BSS84LT1

8mm embossed tape

3000

BSS84LT3

13

8mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

32

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BSS84LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

50

Vdc

0.1
15
60

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 250 Adc)

Adc

Zero Gate Voltage Drain Current


(VDS = 25 Vdc, VGS = 0 Vdc)
(VDS = 50 Vdc, VGS = 0 Vdc)
(VDS = 50 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc)

IGSS

60

Adc

GateSource Threaded Voltage


(VDS = VGS, ID = 1.0 mAdc)

VGS(th)

0.8

2.0

Vdc

Static DraintoSource OnResistance


(VGS = 5.0 Vdc, ID = 100 mAdc)

rDS(on)

5.0

10

Ohms

|yfs|

50

mS

(VDS = 5.0 Vdc)

Ciss

30

pF

Output Capacitance

(VDS = 5.0 Vdc)

Coss

10

Transfer Capacitance

(VDG = 5.0 Vdc)

Crss

5.0

td(on)

2.5

tr

1.0

td(off)

16

ON CHARACTERISTICS(1)

Transfer Admittance
(VDS = 25 Vdc, ID = 100 mAdc, f = 1.0 kHz)
DYNAMIC CHARACTERISTICS
Input Capacitance

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

((VDD = 15 Vdc, ID = 2.5 Adc,


RL = 50 )

Fall Time

ns

tf

8.0

QT

6000

pC

IS

0.130

Pulsed Current

ISM

0.520

Forward Voltage(2)

VSD

2.5

Gate Charge
SOURCEDRAIN DIODE CHARACTERISTICS
Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

TYPICAL ELECTRICAL CHARACTERISTICS


0.6

0.5
25C
55C

150C

VGS = 3.5 V

TJ = 25C

0.45

0.5

I D , DRAIN CURRENT (AMPS)

I D , DRAIN CURRENT (AMPS)

VDS = 10 V

3.25 V

0.4

0.35

0.4

0.3

3.0 V

0.25

0.3
0.2

0.2

2.75 V

0.15

0.1

2.5 V

0.1

2.25 V

0.05
0

1.5
2
2.5
3
3.5
VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 1. Transfer Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 2. OnRegion Characteristics

33

9
VGS = 4.5 V
8

150C

7
6
25C

5
4

55C

3
2
0

0.1

0.2

0.3

0.4

0.5

0.6

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

BSS84LT1
7
150C

VGS = 10 V

6.5
6
5.5
5
4.5
4

25C

3.5
3
55C

2.5
2
0

0.2

0.1

VGS, GATETOSOURCE VOLTAGE (VOLTS)

RDS(on) , DRAINTOSOURCE RESISTANCE


(NORMALIZED)

2
VGS = 10 V
ID = 0.52 A

1.6
1.4
VGS = 4.5 V
ID = 0.13 A

1.2
1
0.8
0.6
55

45

0.4

0.6

0.5

Figure 4. OnResistance versus Drain Current

Figure 3. OnResistance versus Drain Current

1.8

0.3

ID, DRAIN CURRENT (AMPS)

ID, DRAIN CURRENT (AMPS)

95

6
5
4
ID = 0.5 A

3
2
1
0

145

VDS = 40 V
TJ = 25C

1000

500

TJ, JUNCTION TEMPERATURE (C)

1500

2000

QT, TOTAL GATE CHARGE (pC)

Figure 6. Gate Charge

Figure 5. OnResistance Variation with Temperature

I D , DIODE CURRENT (AMPS)

TJ = 150C

0.1

25C

55C

0.01

0.001

0.5

1.0

1.5

2.0

2.5

3.0

VSD, DIODE FORWARD VOLTAGE (VOLTS)

Figure 7. Body Diode Forward Voltage

34

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BSS138LT1
Motorola Preferred Device

N-Channel Enhancement Mode


Logic Level SOT-23 MOSFET

NCHANNEL
LOGIC LEVEL
TMOS FET
TRANSISTOR

Typical applications are dcdc converters, power management in


portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.
Low Threshold Voltage (VGS(th): 0.5V...1.5V) makes it ideal for
low voltage applications

Miniature SOT23 Surface Mount Package saves board space


3 DRAIN

1
2

CASE 31808, Style 21


SOT23 (TO236A)
1
GATE

2 SOURCE

MAXIMUM RATINGS (TA = 25C unless otherwise noted)


Symbol

Rating
DraintoSource Voltage

Value

Unit

VDSS

50

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

200
800

mA

Total Power Dissipation @ TA = 25C

PD

225

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

556

C/W

TL

260

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

DEVICE MARKING
BSS138LT1 = J1

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

BSS138LT1

8mm embossed tape

3000

BSS138LT3

13

8mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

35

BSS138LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

50

Vdc

0.1
0.5

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 250 Adc)

Adc

Zero Gate Voltage Drain Current


(VDS = 25 Vdc, VGS = 0 Vdc)
(VDS = 50 Vdc, VGS = 0 Vdc)

IDSS

GateSource Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc)

IGSS

0.1

Adc

GateSource Threshold Voltage


(VDS = VGS, ID = 1.0 mAdc)

VGS(th)

0.5

1.5

Vdc

Static DraintoSource OnResistance


(VGS = 2.75 Vdc, ID < 200 mAdc, TA = 40C to +85C)
(VGS = 5.0 Vdc, ID = 200 mAdc)

rDS(on)

5.6

10
3.5

gfs

100

mmhos

(VDS = 25 Vdc, VGS = 0, f = 1 MHz)

Ciss

40

50

pF

Output Capacitance

(VDS = 25 Vdc, VGS = 0, f = 1 MHz)

Coss

12

25

Transfer Capacitance

(VDG = 25 Vdc, VGS = 0, f = 1 MHz)

Crss

3.5

5.0

td(on)

20

td(off)

20

ON CHARACTERISTICS(1)

Forward Transconductance
(VDS = 25 Vdc, ID = 200 mAdc, f = 1.0 kHz)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
TurnOff Delay Time

(VDD = 30 Vdc,
Vdc ID = 0.2
0 2 Adc,)
Adc )

ns

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

36

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BSS138LT1
TYPICAL ELECTRICAL CHARACTERISTICS
0.8

0.9

VGS = 3.5 V

TJ = 25C

I D , DRAIN CURRENT (AMPS)

I D , DRAIN CURRENT (AMPS)

VGS = 3.25 V

0.6

VGS = 3.0 V

0.5

VGS = 2.75 V

0.4

VGS = 2.5 V

0.3
0.2

150C
0.6
0.5
0.4
0.3
0.2
0.1
0

10

0.5

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

1.5

2.5

3.5

4.5

VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 2. Transfer Characteristics

Figure 1. OnRegion Characteristics


2.2

1.25
ID = 1.0 mA

2
VGS = 10 V
ID = 0.8 A

1.8

Vgs(th) , VARIANCE (VOLTS)

RDS(on) , DRAINTOSOURCE RESISTANCE


(NORMALIZED)

25C
55C

0.7

0.1
0

VDS = 10 V

0.8

0.7

1.6
VGS = 4.5 V
ID = 0.5 A

1.4
1.2
1

1.125

0.875

0.8
5

45

95

0.75
55

145

30

20

45

70

95

120

TJ, JUNCTION TEMPERATURE (C)

TJ, JUNCTION TEMPERATURE (C)

Figure 3. OnResistance Variation with


Temperature

Figure 4. Threshold Voltage Variation


with Temperature

VGS, GATETOSOURCE VOLTAGE (VOLTS)

0.6
55

145

10
VDS = 40 V
TJ = 25C
8

4
ID = 200 mA
2

0
0

500

1000

1500

2000

2500

3000

QT, TOTAL GATE CHARGE (pC)

Figure 5. Gate Charge

Motorola SmallSignal Transistors, FETs and Diodes Device Data

37

10
VGS = 2.5 V

9
8

150C
7
6
5

25C

4
55C

3
2
1
0.05

0.15

0.1

0.25

0.2

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

BSS138LT1
8
VGS = 2.75 V
7

150C

6
5
4
25C

3
2

55C

1
0

150C

5
4.5
4
3.5
3

25C

2.5
2

55C

1.5
1
0.1

0.15

0.2

0.25

0.3

0.35

0.4

0.45

0.5

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

VGS = 4.5 V

0.05

0.25

Figure 7. OnResistance versus Drain Current

0.2

0.15

ID, DRAIN CURRENT (AMPS)

Figure 6. OnResistance versus Drain Current

5.5

0.1

0.05

ID, DRAIN CURRENT (AMPS)

4.5
VGS = 10 V

150C

4
3.5
3
2.5

25C

2
55C

1.5
1
0

0.05

0.1

ID, DRAIN CURRENT (AMPS)

0.15

0.2

0.25

0.3

0.35

0.4

0.45

0.5

ID, DRAIN CURRENT (AMPS)

Figure 9. OnResistance versus Drain Current

Figure 8. OnResistance versus Drain Current

120

I D , DIODE CURRENT (AMPS)

100
TJ = 150C

0.1

25C

55C
80
60
Ciss

0.01

40
Coss

20
0.001

Crss
0

0.2

0.4

0.6

0.8

1.0

1.2

10

15

20

25

VSD, DIODE FORWARD VOLTAGE (VOLTS)

Figure 10. Body Diode Forward Voltage

38

Figure 11. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF1N02LT1
Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energy
conserving traits.

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in space sensitive power management circuitry.
Typical applications are dcdc converters and power management in portable and batterypowered products such as
computers, printers, PCMCIA cards, cellular and cordless
telephones.

3 DRAIN
1
2

CASE 31808, Style 21


SOT23 (TO236AB)

1
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery


Life

2 SOURCE

Miniature SOT23 Surface Mount Package Saves Board


Space

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

750
2000

mA

Total Power Dissipation @ TA = 25C

PD

400

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

300

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
Device Marking: NZ

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF1N02LT1

8mm embossed tape

3000

MGSF1N02LT3

13

8mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

39

MGSF1N02LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 Adc)

Adc

Zero Gate Voltage Drain Current


(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 1.2 Adc)
(VGS = 4.5 Vdc, ID = 1.0 Adc)

rDS(on)

0.075
0.115

0.090
0.130

ON CHARACTERISTICS(1)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 Vdc)

Ciss

125

Output Capacitance

(VDS = 5.0 Vdc)

Coss

120

pF

Transfer Capacitance

(VDG = 5.0 Vdc)

Crss

45

td(on)

2.5

tr

1.0

td(off)

16

tf

8.0

QT

6000

pC

IS

0.6

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

0.8

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

((VDD = 15 Vdc, ID = 1.0 Adc,


RL = 50 )

Fall Time
Gate Charge (See Figure 6)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

TYPICAL ELECTRICAL CHARACTERISTICS


2.5

3
4V
I D , DRAIN CURRENT (AMPS)

I D , DRAIN CURRENT (AMPS)

VDS = 10 V
2
55C

1.5

TJ = 150C

0.5

1.5
2
2.5
3
VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 1. Transfer Characteristics

310

3.25 V

3.5 V

2
VGS = 3.0 V
1.5
2.75 V

2.5 V

0.5

25C
0

2.5

2.25 V
3.5

10

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 2. OnRegion Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.2
150C
0.18
0.16

VGS = 4.5 V

0.14

25C

0.12
55C

0.1
0.08
0.06
0.04
0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

MGSF1N02LT1
0.14
0.13

150C

0.12
VGS = 10 V

0.11
0.1
0.09

25C

0.08
0.07

55C

0.06
0.05
0.04
0

0.2

0.4

0.6

VGS, GATETOSOURCE VOLTAGE (VOLTS)

RDS(on) , DRAINTOSOURCE RESISTANCE


(NORMALIZED)

1.6
VGS = 10 V
ID = 2 A

1.4
1.3

VGS = 4.5 V
ID = 1 A

1.2
1.1
1
0.9
0.8
0.7

1.2

1.6

1.4

1.8

10
VDS = 16 V
TJ = 25C
8

4
ID = 2.0 A

2
0

0.6
55

45

95

145

2000

1000

TJ, JUNCTION TEMPERATURE (C)

3000

4000

5000

6000

QT, TOTAL GATE CHARGE (pC)

Figure 6. Gate Charge

Figure 5. OnResistance Variation with Temperature

1000

TJ = 150C

0.1

25C

55C

C, CAPACITANCE (pF)

I D , DIODE CURRENT (AMPS)

Figure 4. OnResistance versus Drain Current

Figure 3. OnResistance versus Drain Current

1.5

0.8

ID, DRAIN CURRENT (AMPS)

ID, DRAIN CURRENT (AMPS)

0.01

VGS = 0 V
f = 1 MHz
TJ = 25C
Ciss
100
Coss
Crss

0.001
0

0.2

0.4

0.6

0.8

VSD, DIODE FORWARD VOLTAGE (VOLTS)

Figure 7. Body Diode Forward Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

10

15

20

VDS, DRAINTOSOURCE VOLTAGE (Volts)

Figure 8. Capacitance

311

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF1N03LT1
Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energy
conserving traits.

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in space sensitive power management circuitry.
Typical applications are dcdc converters and power management in portable and batterypowered products such as
computers, printers, PCMCIA cards, cellular and cordless
telephones.
Low rDS(on) Provides Higher Efficiency and Extends Battery
Life

3 DRAIN
1
2

CASE 31808, Style 21


SOT23 (TO236AB)
1
GATE
2 SOURCE

Miniature SOT23 Surface Mount Package Saves Board


Space

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

30

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

750
2000

mA

Total Power Dissipation @ TA = 25C

PD

400

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

300

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
Device Marking: N3

ORDERING INFORMATION
Reel Size

Tape Width

Quantity

MGSF1N03LT1

Device

8mm embossed tape

3000

MGSF1N03LT3

13

8mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 4

312

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF1N03LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

30

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 Adc)

Adc

Zero Gate Voltage Drain Current


(VDS = 30 Vdc, VGS = 0 Vdc)
(VDS = 30 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 1.2 Adc)
(VGS = 4.5 Vdc, ID = 1.0 Adc)

rDS(on)

0.08
0.125

0.10
0.145

ON CHARACTERISTICS(1)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 Vdc)

Ciss

140

Output Capacitance

(VDS = 5.0 Vdc)

Coss

100

pF

Transfer Capacitance

(VDG = 5.0 Vdc)

Crss

40

td(on)

2.5

tr

1.0

td(off)

16

tf

8.0

QT

6000

pC

IS

0.6

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

0.8

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time

((VDD = 15 Vdc, ID = 1.0 Adc,


RL = 50 )

TurnOff Delay Time


Fall Time
Gate Charge (See Figure 6)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

TYPICAL ELECTRICAL CHARACTERISTICS


2.5

2.5

VGS = 3.75 V
3.5 V

I D , DRAIN CURRENT (AMPS)

I D , DRAIN CURRENT (AMPS)

VDS = 10 V
2

1.5
55C

TJ = 150C
0.5

1.5

3.25 V

1
3.0 V
0.5

2.75 V

25C
0

1.5
2
2.5
3
VGS, GATETOSOURCE VOLTAGE (VOLTS)

2.5 V
3.5

Figure 1. Transfer Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 2. OnRegion Characteristics

313

R DS(on) , DRAINTOSOURCE RESISTANCE (OHMS

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS

MGSF1N03LT1
0.24
150C

0.19

VGS = 4.5 V
25C

0.14

55C
0.09

0.04
0

0.1

0.2

0.3

0.4

0.5

0.6

0.8

0.7

0.9

0.16
150C

0.14
VGS = 10 V

0.12
0.1

25C

0.08
55C
0.06
0.04
0

0.2

0.4

ID, DRAIN CURRENT (AMPS)

VGS, GATETOSOURCE VOLTAGE (VOLTS)

RDS(on) , DRAINTOSOURCE RESISTANCE


(NORMALIZED)

VGS = 10 V
ID = 2 A

1.2

VGS = 4.5 V
ID = 1 A

1
0.8
0.6
0.4
0.2
0
55

1.2

1.4

1.6

1.8

10
VDS = 24 V
TJ = 25C
8

4
ID = 2.0 A

2
0

25

50

25

75

100

125

150

2000

1000

TJ, JUNCTION TEMPERATURE (C)

3000

4000

5000

6000

QT, TOTAL GATE CHARGE (pC)

Figure 6. Gate Charge

Figure 5. OnResistance Variation with Temperature

350
VGS = 0 V
f = 1 MHz
TJ = 25C

300
TJ = 150C

0.1

25C

55C

C, CAPACITANCE (pF)

I D , DIODE CURRENT (AMPS)

Figure 4. OnResistance versus Drain Current

1.8

1.4

0.8

ID, DRAIN CURRENT (AMPS)

Figure 3. OnResistance versus Drain Current

1.6

0.6

0.01

250
200
150

Ciss

100
Coss
50

0.001

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

VSD, DIODE FORWARD VOLTAGE (VOLTS)

Figure 7. Body Diode Forward Voltage

314

0.9

Crss
0

12

16

20

VDS, DRAINTOSOURCE VOLTAGE (Volts)

Figure 8. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF1P02ELT1
Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energy
conserving traits.

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in space sensitive power management circuitry.
Typical applications are dcdc converters and power management in portable and batterypowered products such as
computers, printers, PCMCIA cards, cellular and cordless
telephones.

3 DRAIN
1
2

CASE 31808, Style 21


SOT23 (TO236AB)
1
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery


Life

Miniature SOT23 Surface Mount Package Saves Board Space

2 SOURCE

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

8.0

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

750
2000

mA

Rating
DraintoSource Voltage

Total Power Dissipation @ TA = 25C

PD

400

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

300

C/W

TL

260

Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
Device Marking: PC

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF1P02ELT1

8mm embossed tape

3000

MGSF1P02ELT3

13

8mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

315

MGSF1P02ELT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 250 Adc)

Adc

Zero Gate Voltage Drain Current


(VDS = 16 Vdc, VGS = 0 Vdc)
(VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 8.0 Vdc, VDS = 0 Vdc)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

0.7

0.85

1.2

Vdc

Static DraintoSource OnResistance


(VGS = 4.5 Vdc, ID = 0.75 Adc)
(VGS = 2.5 Vdc, ID = 0.5 Adc)

rDS(on)

0.20
0.32

0.26
0.50

ON CHARACTERISTICS(1)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 Vdc)

Ciss

130

Output Capacitance

(VDS = 5.0 Vdc)

Coss

120

pF

Transfer Capacitance

(VDG = 5.0 Vdc)

Crss

60

td(on)

2.5

tr

1.0

td(off)

16

tf

8.0

QT

6000

pC

IS

0.6

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

1.5

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

((VDD = 15 Vdc, ID = 1.0 Adc,


RL = 50 )

Fall Time
Gate Charge (See Figure 6)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

316

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF1P02LT1
Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energy
conserving traits.

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in space sensitive power management circuitry.
Typical applications are dcdc converters and power management in portable and batterypowered products such as
computers, printers, PCMCIA cards, cellular and cordless
telephones.

3 DRAIN
1
2

CASE 31808, Style 21


SOT23 (TO236AB)
1
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery


Life

Miniature SOT23 Surface Mount Package Saves Board Space

2 SOURCE

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

750
2000

mA

DraintoSource Voltage

Total Power Dissipation @ TA = 25C

PD

400

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

300

C/W

TL

260

Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
Device Marking: PC

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF1P02LT1

8mm embossed tape

3000

MGSF1P02LT3

13

8mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

317

MGSF1P02LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 Adc)

Adc

Zero Gate Voltage Drain Current


(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 1.5 Adc)
(VGS = 4.5 Vdc, ID = 0.75 Adc)

rDS(on)

0.235
0.375

0.350
0.500

ON CHARACTERISTICS(1)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 Vdc)

Ciss

130

Output Capacitance

(VDS = 5.0 Vdc)

Coss

120

pF

Transfer Capacitance

(VDG = 5.0 Vdc)

Crss

60

td(on)

2.5

tr

1.0

td(off)

16

tf

8.0

QT

6000

pC

IS

0.6

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

1.5

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time

((VDD = 15 Vdc, ID = 1.0 Adc,


RL = 50 )

TurnOff Delay Time


Fall Time
Gate Charge (See Figure 6)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

TYPICAL ELECTRICAL CHARACTERISTICS


1.5

1.5

VGS = 3.5 V

1.25

3.25 V

1.25

I D , DRAIN CURRENT (AMPS)

I D , DRAIN CURRENT (AMPS)

VDS = 10 V

1
3.0 V

0.75

0.75
55C

0.5

TJ = 150C

25C

0.25

2.75 V

0.5

2.5 V

0.25

2.25 V
0

1.5
2
2.5
3
VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 1. Transfer Characteristics

318

3.5

10

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 2. OnRegion Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.55

150C
0.5

VGS = 4.5 V

0.45
25C
0.4
55C
0.35
0

0.1

0.3

0.2

0.5

0.4

0.6

0.7

0.8

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

MGSF1P02LT1
0.4
0.38
0.36
VGS = 10 V

0.34

150C

0.32
0.3
0.28

25C

0.26
0.24

55C

0.22
0.2
0

0.4

0.2

VGS, GATETOSOURCE VOLTAGE (VOLTS)

RDS(on) , DRAINTOSOURCE RESISTANCE


(NORMALIZED)

1.25
VGS = 10 V
ID = 1.5 A

1.15
1.1

VGS = 4.5 V
ID = .75 A

1.05
1
0.95
0.9
0.85

1.6

1.4

10
VDS = 16 V
TJ = 25C
8

4
ID = 1.5 A
2

45

95

145

2000

1000

TJ, JUNCTION TEMPERATURE (C)

4000

3000

5000

6000

QT, TOTAL GATE CHARGE (pC)

Figure 6. Gate Charge

Figure 5. OnResistance Variation with Temperature

1000

TJ = 150C

0.1

25C

55C

C, CAPACITANCE (pF)

I D , DIODE CURRENT (AMPS)

1.2

0.8
55

0.01

0.001

Figure 4. OnResistance versus Drain Current

Figure 3. OnResistance versus Drain Current

1.2

0.8

0.6

ID, DRAIN CURRENT (AMPS)

ID, DRAIN CURRENT (AMPS)

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

VSD, DIODE FORWARD VOLTAGE (VOLTS)

Figure 7. Body Diode Forward Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

VGS = 0 V
f = 1 MHz
TJ = 25C
Ciss
100

Coss
Crss

10

10

VDS, DRAINTOSOURCE VOLTAGE (Volts)

Figure 8. Capacitance

319

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3441VT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energy
conserving traits.
These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 78 m (TYP)

1 2 5 6
DRAIN

Visit our Web Site at http://www.motsps.com/ospd

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

8.0

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

3.3
20

PD

2.0

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

128

C/W

TL

260

DraintoSource Voltage

Total Power Dissipation @ TA = 25C Mounted on FR4 t

 5 sec

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3441VT1

8 mm embossed tape

3000

MGSF3441VT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

320

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3441VT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

20

1.0
4.0

100

0.45

0.078
0.110

0.090
0.135

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 8.0 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 4.5 Vdc, ID = 3.3 A)
(VGS = 2.5 Vdc, ID = 2.9 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

27

50

tr

17

30

td(off)

52

80

tf

45

70

QT

3000

pC

IS

1.0

Pulsed Current

ISM

20

Forward Voltage(2)

VSD

0.80

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 15 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

321

MGSF3441VT1
TYPICAL ELECTRICAL CHARACTERISTICS
20
VGS = 4.5 V

20

4.0 V

TC = 55C

3.5 V

125C

16
3.0 V

ID , DRAIN CURRENT (A)

ID, DRAIN CURRENT (A)

16

12
2.5 V
8.0
2.0 V
4.0

25C
12

8.0

4.0
1.5 V
0

0
0

1.0

2.0

3.0

4.0

5.0

3.0

4.0

VGS, GATETOSOURCE VOLTAGE (V)

Figure 1. Output Characteristics

Figure 2. Transfer Characteristics

1400
1200

0.24
VGS = 2.5 V

C, CAPACITANCE (pF)

R DS(on) , ONRESISTANCE ( )

2.0

VDS, DRAINTOSOURCE VOLTAGE (V)

0.30

0.18

0.12

VGS = 4.5 V

1000
800
600

Ciss

400
Coss

0.06
200

4.0

8.0

12

16

12

8.0

16

VDS, DRAINTOSOURCE VOLTAGE (V)

Figure 3. OnResistance versus Drain Current

Figure 4. Capacitance

R DS(on) , ONRESISTANCE ( ) (NORMALIZED)

3.0

2.0

1.0
0
0

4.0

ID, DRAIN CURRENT (A)

VDS = 10 V
ID = 3.3 A

4.0

20

5.0

322

Crss

VGS , GATETOSOURCE VOLTAGE (V)

1.0

2.0

4.0

6.0

8.0

10

20

1.8
1.6

VGS = 4.5 V
ID = 3.3 A

1.4
1.2
1.0
0.8
0.6
50

25

25

50

75

100

125

Qg, TOTAL GATE CHARGE (nC)

TJ, JUNCTION TEMPERATURE (C)

Figure 5. Gate Charge

Figure 6. OnResistance versus Junction


Temperature

150

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3441VT1
TYPICAL ELECTRICAL CHARACTERISTICS
20

0.30
ID = 3.3 A

R DS(on) , ONRESISTANCE ( )

IS , SOURCE CURRENT (A)

TJ = 150C
10
TJ = 25C

0.18

0.12

0.06
0

1.0
0.25

0.50

0.75

1.00

1.25

1.50

2.0

4.0

6.0

8.0

VSD, SOURCETODRAIN VOLTAGE (V)

VGS, GATETOSOURCE VOLTAGE (V)

Figure 7. SourceDrain Diode Forward Voltage

Figure 8. OnResistance versus


GatetoSource Voltage

0.4

20

0.3
V GS(th) , VARIANCE (V)

0.24

16

0.1

POWER (W)

0.2

ID = 250 A

12

8.0

0
4.0

0.1
0.2
50

0
25

25

50

75

100

125

150

0.01

0.1

1.0

10

TJ, TEMPERATURE (C)

TIME (sec)

Figure 9. Threshold Voltage

Figure 10. Single Pulse Power

NORMALIZED EFFECTIVE TRANSIENT


THERMAL IMPEDANCE

2.0
1.0
DUTY CYCLE = 0.5
0.2
0.1

NOTES:
PDM

0.1

1. DUTY CYCLE, D = t1/t2


2. PER UNIT BASE =
2. RthJA = 62.5C/W
3. TJM TA = PDMZthJA(t)
4. SURFACE MOUNTED

0.05
0.02

t1

SINGLE PULSE

t2

0.01
0.0001

0.001

0.01

0.1

1.0

10

30

SQUARE WAVE PULSE DURATION (sec)

Figure 11. Normalized Thermal Transient Impedance, JunctiontoAmbient

Motorola SmallSignal Transistors, FETs and Diodes Device Data

323

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3441XT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors

Part of the GreenLine Portfolio of devices with energy


conserving traits.
These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 78 m (TYP)

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

8.0

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

1.5
20

Total Power Dissipation @ TA = 25C

PD

950

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

132

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3441XT1

8 mm embossed tape

3000

MGSF3441XT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

324

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3441XT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

20

1.0
4.0

100

0.45

0.078
0.110

0.100
0.135

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 8.0 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 4.5 Vdc, ID = 1.5 A)
(VGS = 2.5 Vdc, ID = 1.2 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

27

50

tr

17

30

td(off)

52

80

tf

45

70

QT

3000

pC

IS

1.0

Pulsed Current

ISM

20

Forward Voltage(2)

VSD

0.80

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 15 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

325

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3442VT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors

Part of the GreenLine Portfolio of devices with energy


conserving traits.
These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 58 m (TYP)

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

8.0

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

4.0
20

PD

2.0

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

62.5

C/W

TL

260

DraintoSource Voltage

Total Power Dissipation @ TA = 25C Mounted on FR4 t

 5 sec

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3442VT1

8 mm embossed tape

3000

MGSF3442VT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

326

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3442VT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

20

1.0
5.0

100

0.6

0.058
0.072

0.070
0.095

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 8.0 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 4.5 Vdc, ID = 4.0 A)
(VGS = 2.5 Vdc, ID = 3.4 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

8.0

20

tr

24

40

td(off)

36

60

tf

10

20

QT

nC

IS

1.0

Pulsed Current

ISM

5.0

Forward Voltage(2)

VSD

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 10 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

327

MGSF3442VT1
TYPICAL ELECTRICAL CHARACTERISTICS
20

TC = 55C

2.5 V
16
ID , DRAIN CURRENT (A)

ID, DRAIN CURRENT (A)

16

20

3.0 V

VGS = 4.5 V
4.0 V
3.5 V

12
2.0 V
8.0

4.0

125C

12

25C

8.0

4.0
1.5 V
0

0
0

1.0

3.0

2.0

4.0

5.0

2.5

Figure 1. Output Characteristics

Figure 2. Transfer Characteristics

3.0

1200

0.12

1000

VGS = 2.5 V
0.10
0.08

C, CAPACITANCE (pF)

R DS(on) , ONRESISTANCE ( )

2.0

VGS, GATETOSOURCE VOLTAGE (V)

VGS = 4.5 V

0.06
0.04

800
600

Ciss

400

Coss

200

0.02

Crss

0
0

4.0

8.0

12

16

20

16

Figure 3. OnResistance versus Drain Current

Figure 4. Capacitance

R DS(on) , ONRESISTANCE ( ) (NORMALIZED)

3.0

2.0

1.0
0
0

12

8.0

4.0

VDS, DRAINTOSOURCE VOLTAGE (V)

VDS = 10 V
ID = 4.0 A

4.0

ID, DRAIN CURRENT (A)

5.0
VGS , GATETOSOURCE VOLTAGE (V)

1.5

1.0

VDS, DRAINTOSOURCE VOLTAGE (V)

0.14

328

0.5

2.0

4.0

6.0

8.0

20

1.8
1.6

VGS = 4.5 V
ID = 4.0 A

1.4
1.2
1.0
0.8
0.6
50

25

25

50

75

100

125

Qg, TOTAL GATE CHARGE (nC)

TJ, JUNCTION TEMPERATURE (C)

Figure 5. Gate Charge

Figure 6. OnResistance versus Junction


Temperature

150

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3442VT1
TYPICAL ELECTRICAL CHARACTERISTICS
20

0.20
TJ = 150C

ID = 4.0 A

R DS(on) , ONRESISTANCE ( )

IS , SOURCE CURRENT (A)

TJ = 25C
10

0.12

0.08

0.04
0

1.0
0.25

0.50

0.75

1.00

1.25

1.50

2.0

4.0

6.0

8.0

VSD, SOURCETODRAIN VOLTAGE (V)

VGS, GATETOSOURCE VOLTAGE (V)

Figure 7. SourceDrain Diode Forward Voltage

Figure 8. OnResistance versus


GatetoSource Voltage

0.2

20

0.1

16

POWER (W)

V GS(th) , VARIANCE (V)

0.16

ID = 250 A
0.1

12

8.0

0.2
4.0

0.3
0.4
50

0
25

25

50

75

100

125

150

0.01

0.1

1.0

10

TJ, TEMPERATURE (C)

TIME (sec)

Figure 9. Threshold Voltage

Figure 10. Single Pulse Power

NORMALIZED EFFECTIVE TRANSIENT


THERMAL IMPEDANCE

2.0
1.0
DUTY CYCLE = 0.5
0.2
0.1

NOTES:
PDM

0.1

1. DUTY CYCLE, D = t1/t2


2. PER UNIT BASE =
2. RthJA = 62.5C/W
3. TJM TA = PDMZthJA(t)
4. SURFACE MOUNTED

0.05
0.02

t1

SINGLE PULSE

t2

0.01
0.0001

0.001

0.01

0.1

1.0

10

30

SQUARE WAVE PULSE DURATION (sec)

Figure 11. Normalized Thermal Transient Impedance, JunctiontoAmbient

Motorola SmallSignal Transistors, FETs and Diodes Device Data

329

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3442XT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors

Part of the GreenLine Portfolio of devices with energy


conserving traits.
These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 58 m (TYP)

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

8.0

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

1.7
20

Total Power Dissipation @ TA = 25C

PD

400

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

300

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3442XT1

8 mm embossed tape

3000

MGSF3442XT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

330

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3442XT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

20

1.0
5.0

100

0.6

0.058
0.072

0.070
0.095

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 8.0 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 4.5 Vdc, ID = 1.7 A)
(VGS = 2.5 Vdc, ID = 1.3 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

8.0

20

tr

24

40

td(off)

36

60

tf

10

20

QT

nC

IS

1.0

Pulsed Current

ISM

5.0

Forward Voltage(2)

VSD

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 10 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

331

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3454VT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors

Part of the GreenLine Portfolio of devices with energy


conserving traits.
These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 50 m (TYP)

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

30

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

4.2
20

PD

2.0

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

62.5

C/W

TL

260

DraintoSource Voltage

Total Power Dissipation @ TA = 25C Mounted on FR4 t

 5 sec

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3454VT1

8 mm embossed tape

3000

MGSF3454VT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

332

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3454VT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

30

1.0
25

100

1.0

0.05
0.07

0.065
0.095

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 30 Vdc, VGS = 0 Vdc)
(VDS = 30 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 4.2 A)
(VGS = 4.5 Vdc, ID = 3.4 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

10

20

tr

15

30

td(off)

20

35

tf

10

20

QT

15

nC

IS

1.0

Pulsed Current

ISM

5.0

Forward Voltage(2)

VSD

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 10 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

333

MGSF3454VT1
TYPICAL ELECTRICAL CHARACTERISTICS
20

20
VGS = 10, 9, 8, 7, 6V
16

I D , DRAIN CURRENT (A)

I D , DRAIN CURRENT (A)

TJ = 55C

5V

12
4V

25C

16

125C

12

4
3V
0

Figure 2. Transfer Characteristics

560
480
C, CAPACITANCE (pF)

0.12
VGS = 4.5 V

0.08

VGS = 10 V

Ciss

400
320
Coss

240
160

0.04

Crss

80
0
0

8
12
ID, DRAIN CURRENT (A)

16

20

12

18

24

30

VDS DRAINTOSOURCE VOLTAGE (V)

Figure 3. OnResistance vs. Drain Current

Figure 4. Capacitance

1.75

10
RDS(on) , ONRESISTANCE (OHMS)
(NORMALIZED)

VDS = 15 V
ID = 4.2 A

2
0
0

1.5

3.0

4.5

6.0

Qg, TOTAL GATE CHARGE (nC)

Figure 5. Gate Charge

334

Figure 1. Output Characteristics

0.16

VGS, GATETOSOURCE VOLTAGE (V)

VGS, GATETOSOURCE VOLTAGE (V)

0.20
R DS(on) , ONRESISTANCE (OHMS)

VDS, DRAINTOSOURCE VOLTAGE (V)

7.5

9.0

VGS = 10 V
ID = 4.2 A
1.50

1.25

1.00

0.75
50

25

0
25
50
75
100
TJ, JUNCTION TEMPERATURE (C)

125

150

Figure 6. OnResistance vs. Junction Temperature

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3454VT1
TYPICAL ELECTRICAL CHARACTERISTICS
0.20

10

RDS(on) , ONRESISTANCE (OHMS)

I S , SOURCE CURRENT (A)

40

TJ = 150C
TJ = 25C

1
0

0.25

0.50

0.75

1.00

1.25

1.5

0.16

0.12

0.08

0.04

1.75

ID = 4.2 A

2
4
6
8
VGS GATETOSOURCE VOLTAGE (V)

VSD, SOURCETODRAIN VOLTAGE (V)

Figure 7. SourceDrain Diode Forward Voltage

Figure 8. OnResistance vs. GatetoSource Voltage

0.4

30

0.2

24

0.0

ID = 250 A

POWER (W)

V GS(th) , VARIANCE (V)

10

0.2

18

12

0.4
6

0.6
0.8
50

25

25

50

75

100

125

150

0
0.01

0.10

TJ, TEMPERATURE (C)

Figure 9. Threshold Voltage

1.00
TIME (sec)

10.00

Figure 10. Single Pulse Power

NORMALIZED EFFECTIVE
TRANSIENT THERMAL IMPEDANCE

2
1

Duty Cycle = 0.5

0.2
0.1

0.1

P(pk)

0.05
t1

0.02

0.01
1.0E04

t2
DUTY CYCLE, D = t1/t2

SINGLE PULSE
1.0E03

1.0E02

1.0E01

RJC(t) = r(t) RJC


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) TC = P(pk) RJC(t)
1.0E+00

1.0E+01

Square Wave Pulse Duration (sec)

Figure 11. Normalized Thermal Transient Impedance, JunctiontoAmbient

Motorola SmallSignal Transistors, FETs and Diodes Device Data

335

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3454XT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors

Part of the GreenLine Portfolio of devices with energy


conserving traits.
These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 50 m (TYP)

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

30

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

1.75
20

Total Power Dissipation @ TA = 25C

PD

950

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

250

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, for 10 seconds


Device Marking = 3G

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3454XT1

8 mm embossed tape

3000

MGSF3454XT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

336

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3454XT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

30

1.0
25

100

1.0

0.05
0.07

0.065
0.095

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 30 Vdc, VGS = 0 Vdc)
(VDS = 30 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 1.75 A)
(VGS = 4.5 Vdc, ID = 1.5 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

345

Output Capacitance

(VDS = 5.0 V)

Coss

215

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

140

td(on)

10

tr

15

td(off)

20

tf

10

QT

15

nC

IS

1.0

Pulsed Current

ISM

5.0

Forward Voltage(2)

VSD

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time

( DD = 10 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

TurnOff Delay Time


Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

TYPICAL ELECTRICAL CHARACTERISTICS


7.0

0.12

R DS(on) , ONRESISTANCE ( )

VGS = 4.5 V
ID , DRAIN CURRENT (AMPS)

6.0
4.0 V

5.0
4.0

3.5 V
3.0
2.0

3.0 V

1.0

2.5 V
2.25 V

TJ = 150C

0.10
VGS = 10 V
0.08

25C
0.06
55C
0.04

0
0

1.0

2.0

3.0

4.0

5.0

6.0

7.0

8.0

0.02
9.0

10

1.0

2.0

3.0

4.0

5.0

6.0

7.0

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

ID, DRAIN CURRENT (AMPS)

Figure 1. Output Characteristics

Figure 2. OnResistance versus Drain Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

337

MGSF3454XT1
TYPICAL ELECTRICAL CHARACTERISTICS
1000

0.14

TJ = 150C
C, CAPACITANCE (pF)

R DS(on) , ONRESISTANCE ( )

0.16

0.12
VGS = 4.5 V
0.10

25C

0.08
55C

Ciss
Coss
Crss

100

VGS = 0 V
f = 1.0 MHz
TJ = 25C

0.06
0.04

10
0.5

1.0

1.5

2.5

2.0

3.0

12

16

20

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 3. OnResistance versus Drain Current

Figure 4. Capacitance

24

1.4
VDS = 24 V
TJ = 25C
ID = 10 A

8.0

6.0

4.0

2.0
0
0

2.0

4.0

6.0

8.0

1.3
ID = 1.5 A
VGS = 4.5 V

1.2
1.1
1.0
0.9
0.8
0.7
0.6

10

5.0

55

45

95

145

QG, TOTAL GATE CHARGE (nC)

TJ, JUNCTION TEMPERATURE (C)

Figure 5. Gate Charge

Figure 6. OnResistance versus Junction


Temperature

1.6

10
ID = 6.4 A
VGS = 10 V

1.5
1.4

IS, SOURCE CURRENT (AMPS)

R DS(on) , ONRESISTANCE (NORMALIZED)

8.0

ID, DRAIN CURRENT (AMPS)

10

1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6

1.0

TJ = 150C

25C 55C

0.1

0.01

0.001
55

338

4.0

R DS(on) , ONRESISTANCE (NORMALIZED)

VGS , GATETOSOURCE VOLTAGE (VOLTS)

5.0

45

95

145

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

TJ, JUNCTION TEMPERATURE (C)

VSD, SOURCETODRAIN VOLTAGE (VOLTS)

Figure 7. OnResistance versus Junction


Temperature

Figure 8. SourceDrain Diode Forward Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3454XT1
TYPICAL ELECTRICAL CHARACTERISTICS
2.0

R DS(on) , ONRESISTANCE ( )

0.5

1.8
0.4
V GS(th) (VOLTS)

1.6
0.3

0.2
ID = 1.75 A

ID = 250 A
1.4
1.2
1.0

0.1
0.8
0

0.6
0

1.0

2.0

3.0

4.0

6.0

5.0

7.0

8.0

9.0

10

25

50

25

50

75

100

VGS, GATETOSOURCE VOLTAGE (VOLTS)

TJ, JUNCTION TEMPERATURE (C)

Figure 9. OnResistance versus


GatetoSource Voltage

Figure 10. Threshold Voltage

125

150

20

POWER (WATTS)

16

12

8.0

4.0
0
0.1

0.01

1.0

10

100

TIME (sec)

Figure 11. Single Pulse Power

NORMALIZED EFFECTIVE
TRANSIENT THERMAL IMPEDANCE

1.0
DUTY CYCLE = 0.5
0.2
0.1
0.1

P(pk)

0.05
0.02

t1

t2
DUTY CYCLE, D = t1/t2

0.01
SINGLE PULSE

RJA(t) = r(t) RJA


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) TA = P(pk) RJA(t)

0.01
0.0001

0.001

0.01

0.1

1.0

10

100

1.0 k

SQUARE WAVE PULSE DURATION (sec)

Figure 12. Normalized Thermal Transient Impedance, JunctiontoAmbient

Motorola SmallSignal Transistors, FETs and Diodes Device Data

339

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3455VT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors

Part of the GreenLine Portfolio of devices with energy


conserving traits.
These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 80 m (TYP)

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

30

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

3.5
20

PD

2.0

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

62.5

C/W

TL

260

DraintoSource Voltage

Total Power Dissipation @ TA = 25C Mounted on FR4 t

 5 sec

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3455VT1

8 mm embossed tape

3000

MGSF3455VT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

340

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3455VT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

30

1.0
5.0

100

1.0

0.080
0.134

0.100
0.190

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 30 Vdc, VGS = 0 Vdc)
(VDS = 30 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 3.5 A)
(VGS = 4.5 Vdc, ID = 2.5 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

10

20

tr

15

30

td(off)

20

35

tf

10

20

QT

3000

pC

IS

1.0

Pulsed Current

ISM

5.0

Forward Voltage(2)

VSD

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 15 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

341

MGSF3455VT1
TYPICAL ELECTRICAL CHARACTERISTICS
20

20

TJ = 55C

6V

16

I D , DRAIN CURRENT (A)

I D , DRAIN CURRENT (A)

VGS = 10, 9, 8, 7 V

5V
12

4V

25C

16

125C
12

4
3V
0

580
Ciss

C, CAPACITANCE (pF)

0.18
VGS = 4.5 V
0.12

VGS = 10 V

420
340
260

Coss

180

0.06

Crss

100
20
0

8
12
ID, DRAIN CURRENT (A)

16

20

12

18

24

30

VDS DRAINTOSOURCE VOLTAGE (V)

Figure 3. OnResistance vs. Drain Current

Figure 4. Capacitance

1.60

10
VDS = 15 V
ID = 3.5 A

RDS(on) , ONRESISTANCE (OHMS)


(NORMALIZED)

VGS, GATETOSOURCE VOLTAGE (V)

Figure 2. Transfer Characteristics

500

2
0
0

1.5

3.0

4.5

Qg, TOTAL GATE CHARGE (nC)

Figure 5. Gate Charge

342

Figure 1. Output Characteristics

0.24

VGS, GATETOSOURCE VOLTAGE (V)

0.30
R DS(on) , ONRESISTANCE (OHMS)

VDS, DRAINTOSOURCE VOLTAGE (V)

6.0

1.45

VGS = 10 V
ID = 3.5 A

1.30
1.15
1.00
0.85
0.7
50

25

0
25
50
75
100
TJ, JUNCTION TEMPERATURE (C)

125

150

Figure 6. OnResistance vs. Junction Temperature

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3455VT1
TYPICAL ELECTRICAL CHARACTERISTICS
0.40
RDS(on) , ONRESISTANCE (OHMS)

I S , SOURCE CURRENT (A)

20

10
TJ = 150C

TJ = 25C

0.32

0.24

0.16

0.08
0

1
0

0.25

0.50

0.75

1.00

1.25

1.5

ID = 3.5 A

1.75

Figure 7. SourceDrain Diode Forward Voltage

10

Figure 8. OnResistance vs. GatetoSource Voltage

0.60

30

0.45

24
ID = 250 A

0.30

POWER (W)

V GS(th) , VARIANCE (V)

VGS GATETOSOURCE VOLTAGE (V)

VSD, SOURCETODRAIN VOLTAGE (V)

0.15

18

12

0.0
6

0.15
0.3
50

25

25
50
75
100
TJ, TEMPERATURE (C)

125

150

0
0.01

0.10

1.00

10.00

TIME (sec)

Figure 9. Threshold Voltage

Figure 10. Single Pulse Power

NORMALIZED EFFECTIVE
TRANSIENT THERMAL IMPEDANCE

2
1

Duty Cycle = 0.5

0.2
0.1

0.1

P(pk)

0.05
t1

0.02

0.01
1.0E04

t2
DUTY CYCLE, D = t1/t2

SINGLE PULSE
1.0E03

1.0E02

1.0E01

RJC(t) = r(t) RJC


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) TC = P(pk) RJC(t)
1.0E+00

1.0E+01

Square Wave Pulse Duration (sec)

Figure 11. Normalized Thermal Transient Impedance, JunctiontoAmbient

Motorola SmallSignal Transistors, FETs and Diodes Device Data

343

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3455XT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors

Part of the GreenLine Portfolio of devices with energy


conserving traits.
These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 80 m (TYP)

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

30

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

1.45
10

Total Power Dissipation @ TA = 25C

PD

400

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

300

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3455XT1

8 mm embossed tape

3000

MGSF3455XT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

344

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3455XT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

30

1.0
5.0

100

1.0

0.080
0.134

0.100
0.190

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 30 Vdc, VGS = 0 Vdc)
(VDS = 30 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 1.45 A)
(VGS = 4.5 Vdc, ID = 1.2 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

10

20

tr

15

30

td(off)

20

35

tf

10

20

QT

3000

pC

IS

1.0

Pulsed Current

ISM

5.0

Forward Voltage(2)

VSD

0.85

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 15 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

345

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBD1000LT1
MMBD2000T1
MMBD3000T1
MMSD1000T1

Switching Diode
Part of the GreenLine Portfolio of devices with energyconserving traits.
This switching diode has the following features:
Very Low Leakage ( 500 pA) promotes extended battery life by decreasing energy waste

Motorola Preferred Devices

Offered in four Surface Mount package types


Available in 8 mm Tape and Reel in quantities of 3,000
Applications

MMBD1000LT1

ESD Protection

Reverse Polarity Protection


Steering Logic

1
2

MediumSpeed Switching

CASE 318-08, STYLE 8


SOT-23 (TO-236AB)
3
CATHODE

1
ANODE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Continuous Reverse Voltage

VR

30

Vdc

Peak Forward Current

IF

200

mAdc

IFM
(surge)

500

mA

Peak Forward Surge Current

MMBD2000T1
3
1
2

CASE 419-02, STYLE 2


SC70/SOT323

DEVICE MARKING

3
CATHODE

MMBD1000LT1 = AY
MMBD2000T1 = DH
MMBD3000T1 = XP
MMSD1000T1 = 4K

MMBD3000T1

THERMAL CHARACTERISTICS
Characteristic

Symbol

Total Device Dissipation FR-4 Board (1)


TA = 25C
MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1
Derate above 25C MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1

PD

Thermal Resistance Junction to Ambient


MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1

RJA

Junction and Storage Temperature

1
ANODE

Max

Unit
mW

2
1

225
150
1.8

CASE 318D-04, STYLE 2


SC59
mW/C

1.2

3
CATHODE

2
ANODE

C/W
556

MMSD1000T1

833
TJ, Tstg

55 to +150

(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.

Preferred devices are Motorola recommended choices for future use and best overall value.

C
1

CASE 425-04, STYLE 1


SOD123
1
CATHODE

2
ANODE

REV 1

346

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBD1000LT1 MMBD2000T1 MMBD3000T1 MMSD1000T1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Max

Unit

V(BR)

30

Reverse Voltage Leakage Current (VR = 75 V)

IR

500

pA

Forward Voltage (IF = 1.0 mA)


Forward Voltage (IF = 10 mA)

VF

850
950

mV

Diode Capacitance (VR = 0 V, f = 1.0 MHz)

CD

2.0

pF

Reverse Recovery Time (IF = IR = 10 mA) (Figure 1)

trr

3.0

OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100 A)

820
+10 V

2k
100 H

0.1 F

tr

IF

0.1 F

tp

IF
trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR
INPUT SIGNAL

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

347

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBD1005LT1
MMBD2005T1
MMBD3005T1

Switching Diode
Part of the GreenLine Portfolio of devices with energyconserving traits.
This switching diode has the following features:
Very Low Leakage ( 500 pA) promotes extended battery life by decreasing energy waste. Guaranteed leakage limit is for each diode in the pair
contingent upon the other diode being in a nonforwardbiased condition.

Motorola Preferred Devices

Offered in four Surface Mount package types

MMBD1005LT1

Available in 8 mm Tape and Reel in quantities of 3,000


Applications
ESD Protection

ANODE
3

Reverse Polarity Protection

CATHODE
1
2
CATHODE

Steering Logic
MediumSpeed Switching

3
1
2

CASE 318-08, STYLE 12


SOT-23 (TO-236AB)

MMBD2005T1
3

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Continuous Reverse Voltage

VR

30

Vdc

Peak Forward Current

IF

200

mAdc

IFM
(surge)

500

mA

Peak Forward Surge Current

1
2

CASE 419-02, STYLE 4


SC70/SOT323

DEVICE MARKING
MMBD3005T1

MMBD1005LT1 = A3
MMBD2005T1 = DI
MMBD3005T1 = XQ

THERMAL CHARACTERISTICS
Characteristic

Symbol

Total Device Dissipation FR-4 Board (1)


TA = 25C
MMBD1005LT1, MMBD3005T1
MMBD2005T1
Derate above 25C MMBD1005LT1, MMBD3005T1
MMBD2005T1

PD

Thermal Resistance Junction to Ambient


MMBD1005LT1, MMBD3005T1
MMBD2005T1

RJA

Junction and Storage Temperature

Max

2
1

mW
225
150
1.8
1.2

TJ, Tstg

Unit

CASE 318D-04, STYLE 5


SC59
mW/C
C/W

556
833
55 to +150

(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

348

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBD1005LT1 MMBD2005T1 MMBD3005T1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Max

Unit

OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100 A)

V(BR)

30

Reverse Voltage Leakage Current (VR = 75 V)(2)

IR

500

pA

Forward Voltage (IF = 1.0 mA)


Forward Voltage (IF = 10 mA)

VF

850
950

mV

Diode Capacitance (VR = 0 V, f = 1.0 MHz)

CD

2.0

pF

Reverse Recovery Time (IF = IR = 10 mA) (Figure 1)

trr

3.0

(2) Guaranteed leakage limit is for each diode in the pair contingent upon the other diode being
in a nonforwardbiased condition.

820
+10 V

2k
100 H

0.1 F

tr

IF

0.1 F

tp

IF
trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR
INPUT SIGNAL

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

349

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBD1010LT1
MMBD2010T1
MMBD3010T1

Switching Diode
Part of the GreenLine Portfolio of devices with energyconserving traits.
This switching diode has the following features:
Very Low Leakage ( 500 pA) promotes extended battery life by decreasing energy waste. Guaranteed leakage limit is for each diode in the pair
contingent upon the other diode being in a nonforwardbiased condition.

Motorola Preferred Devices

Offered in four Surface Mount package types

MMBD1010LT1

Available in 8 mm Tape and Reel in quantities of 3,000


Applications

ANODE
1

ESD Protection
Reverse Polarity Protection

3
CATHODE

Steering Logic
MediumSpeed Switching

2
ANODE

Symbol

Value

CASE 318-08, STYLE 9


SOT-23 (TO-236AB)

Unit

Continuous Reverse Voltage

VR

30

Vdc

Peak Forward Current

IF

200

mAdc

IFM
(surge)

500

mA

Peak Forward Surge Current

MMBD2010T1

MAXIMUM RATINGS
Rating

3
1
2

CASE 419-02, STYLE 5


SC70/SOT323

DEVICE MARKING
MMBD1010LT1 = A5
MMBD2010T1 = DP
MMBD3010T1 = XS

MMBD3010T1

THERMAL CHARACTERISTICS
Characteristic

Symbol

Total Device Dissipation FR-4 Board (1)


TA = 25C
MMBD1010LT1, MMBD3010T1
MMBD2010T1
Derate above 25C MMBD1010LT1, MMBD3010T1
MMBD2010T1

PD

Thermal Resistance Junction to Ambient


MMBD1010LT1, MMBD3010T1
MMBD2010T1

RJA

Junction and Storage Temperature

Max

mW
225
150
1.8
1.2

TJ, Tstg

Unit
2
1

mW/C

CASE 318D-04, STYLE 3


SC59

C/W
556
833
55 to +150

(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

350

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBD1010LT1 MMBD2010T1 MMBD3010T1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Max

Unit

OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100 A)

V(BR)

30

Reverse Voltage Leakage Current (VR = 75 V)(2)

IR

500

pA

Forward Voltage (IF = 1.0 mA)


Forward Voltage (IF = 10 mA)

VF

850
950

mV

Diode Capacitance (VR = 0 V, f = 1.0 MHz)

CD

2.0

pF

Reverse Recovery Time (IF = IR = 10 mA) (Figure 1)

trr

3.0

(2) Guaranteed leakage limit is for each diode in the pair contingent upon the other diode being
in a nonforwardbiased condition.

820
+10 V

2k
100 H

0.1 F

tr

IF

0.1 F

tp

IF
trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR
INPUT SIGNAL

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

351

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energyconserving traits.

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

MMBF0201NLT1
Motorola Preferred Device

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 1.0 OHM

3 DRAIN
3
1
2

1
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery


Life
Miniature SOT23 Surface Mount Package Saves Board Space

CASE 31808, Style 21


SOT23 (TO236AB)
2 SOURCE

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

DraintoSource Voltage

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Continuous @ TA = 70C
Drain Current Pulsed Drain Current (tp 10 s)
Total Power Dissipation @ TA = 25C(1)

ID
ID
IDM

300
240
750

mAdc

PD

225

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

556

C/W

TL

260

Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds

DEVICE MARKING
N1
(1) Mounted on G10/FR4 glass epoxy board using minimum recommended footprint.

ORDERING INFORMATION
Reel Size

Tape Width

Quantity

MMBF0201NLT1

Device

12 mm embossed tape

3000

MMBF0201NLT3

13

12 mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

352

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF0201NLT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

Adc

Zero Gate Voltage Drain Current


(VDS = 16 Vdc, VGS = 0 Vdc)
(VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 300 mAdc)
(VGS = 4.5 Vdc, ID = 100 mAdc)

rDS(on)

0.75
1.0

1.0
1.4

gFS

450

mMhos

pF

ON CHARACTERISTICS(1)

Forward Transconductance (VDS = 10 Vdc, ID = 200 mAdc)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

45

Output Capacitance

(VDS = 5.0 V)

Coss

25

Transfer Capacitance

(VDG = 5.0 V)

Crss

5.0

td(on)

2.5

tr

2.5

td(off)

15

tf

0.8

QT

1400

pC

IS

0.3

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

0.85

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

((VDD = 15 Vdc, ID = 300 mAdc,


RL = 50 )

Fall Time
Gate Charge (See Figure 5)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

353

MMBF0201NLT1
TYPICAL ELECTRICAL CHARACTERISTICS

1.0

1.0
I D , DRAIN CURRENT (AMPS)

0.8

0.6

0.4

125C

0.2

55C

25C

ONRESISTANCE (OHMS)

VGS = 4 V

0.6

VGS = 10, 9, 8, 7, 6 V

0.4

0.2

VGS = 3 V

0.3

0.9

Figure 1. Transfer Characteristics

Figure 2. OnRegion Characteristics

1.2

0.9

VGS = 4.5 V

0.6
VGS = 10 V

0
0.2

0.4
0.6
ID, DRAIN CURRENT (AMPS)

0.8

2.0

1.5

1.0

0.5

5
10
15
VGS, GATETOSOURCE VOLTAGE (VOLTS)

1.10

14

1.05
ID = 250 A

354

VGS(th) , NORMALIZED

1.00
VDS = 16 V
ID = 300 mA

10

20

Figure 4. OnResistance versus


GatetoSource Voltage

16

12

1.4

2.4

Figure 3. OnResistance versus Drain Current

8
6
4

0.95
0.90
0.85
0.80
0.75
0.70

2
0
0

1.2

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

0.3

VGS, GATETOSOURCE VOLTAGE (VOLTS)

0.6

VGS, GATETOSOURCE VOLTAGE (VOLTS)

1.5

0.8

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

I D , DRAIN CURRENT (AMPS)

VGS = 5 V

0.65
160

450

2000

3400

0.60
25

25

50

75

100

125

Qg, TOTAL GATE CHARGE (pC)

TEMPERATURE (C)

Figure 5. Gate Charge

Figure 6. Threshold Voltage Variance


Over Temperature

150

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF0201NLT1
TYPICAL ELECTRICAL CHARACTERISTICS

100

1.6

VGS = 10 V @ 300 mA

80
C, CAPACITANCE (pF)

RDS(on) , NORMALIZED (OHMS)

1.8

1.4
1.2

VGS = 4.5 V @ 100 mA

1.0

60
Ciss

40

Coss

20

0.8

Crss
0.6
50

25

25

50

75

100

125

150

10

15

TJ, JUNCTION TEMPERATURE (C)

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 7. OnResistance versus


Junction Temperature

Figure 8. Capacitance

20

SOURCE CURRENT (AMPS)

10

1.0

0.1
125C

25C

55C

0.01

0.001

0.3
0.6
0.9
1.2
SOURCETODRAIN FORWARD VOLTAGE (VOLTS)

1.4

Figure 9. SourcetoDrain Forward Voltage


versus Continuous Current (IS)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

355

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energyconserving traits.
These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.
Low rDS(on) Provides Higher Efficiency and Extends Battery
Life

MMBF0202PLT1
Motorola Preferred Device

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 1.4 OHM

3 DRAIN
3
1
2

1
GATE

Miniature SOT23 Surface Mount Package Saves Board Space

CASE 31808, Style 21


SOT23 (TO236AB)
2 SOURCE

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Continuous @ TA = 70C
Drain Current Pulsed Drain Current (tp 10 s)
Total Power Dissipation @ TA = 25C(1)

ID
ID
IDM

300
240
750

mAdc

PD

225

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

625

C/W

TL

260

Rating
DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds

DEVICE MARKING
P3
(1) Mounted on G10/FR4 glass epoxy board using minimum recommended footprint.

ORDERING INFORMATION
Reel Size

Tape Width

Quantity

MMBF0202PLT1

Device

12 mm embossed tape

3000

MMBF0202PLT3

13

12 mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

(Replaces MMBF0202P/D)
356

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF0202PLT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

Adc

Zero Gate Voltage Drain Current


(VDS = 16 Vdc, VGS = 0 Vdc)
(VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 200 mAdc)
(VGS = 4.5 Vdc, ID = 50 mAdc)

rDS(on)

0.9
2.0

1.4
3.5

gFS

600

mMhos

pF

ON CHARACTERISTICS(1)

Forward Transconductance (VDS = 10 Vdc, ID = 200 mAdc)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

50

Output Capacitance

(VDS = 5.0 V)

Coss

45

Transfer Capacitance

(VDG = 5.0 V)

Crss

20

td(on)

2.5

tr

1.0

td(off)

16

tf

8.0

QT

2700

pC

IS

0.3

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

1.5

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

(VDD = 15 Vdc,
RL = 75 ,
ID = 200 mAdc,
mAdc
VGEN = 10 V, RG = 6.0 )

Fall Time
Gate Charge (See Figure 5)

(VDS = 16 V, VGS = 10 V,
ID = 200 mA)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

357

MMBF0202PLT1
TYPICAL ELECTRICAL CHARACTERISTICS

1.0

1.0
5V

0.8

I D , DRAIN CURRENT (AMPS)

25C
125C

0.6

0.4

0.2

ONRESISTANCE (OHMS)

0.6

0.4
3V
0.2

VGS = 4.5 V
1
VGS = 10 V
0
100

200
300
ID, DRAIN CURRENT (AMPS)

500

400

4
200 mA
3

2
50 mA
1

0
0

5
10
15
VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 3. OnResistance versus Drain Current

20

Figure 4. OnResistance versus


GatetoSource Voltage

16

1.20
1.15

14
ID = 200 mA
VGS(th) , NORMALIZED

VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 2. OnRegion Characteristics

2160

10
8

VDS = 10 V
VDS = 16 V

6
590
4

ID = 250 A

1.10
1.05
1.00
0.95
0.90
0.85

2
230

690

2270

Qg, TOTAL GATE CHARGE (pC)

Figure 5. Gate Charge

358

Figure 1. Transfer Characteristics

0
0

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

12

4V

VGS, GATETOSOURCE VOLTAGE (VOLTS)

VGS = 10, 9, 8, 7, 6 V

0.8

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

I D , DRAIN CURRENT (AMPS)

TC = 55C

3500

0.80
50

25

50
75
25
TEMPERATURE (C)

100

125

150

Figure 6. Threshold Voltage Variance


Over Temperature

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF0202PLT1
TYPICAL ELECTRICAL CHARACTERISTICS

1.30

140
120
VGS = 4.5 V @ 50 mA
C, CAPACITANCE (pF)

RDS(on) , NORMALIZED (OHMS)

1.25
1.20
1.15
1.10
1.05

VGS = 10 V @ 200 mA

1.00
0.95

100
80
60
Ciss

40

Coss

0.90
20

0.85
0.80
50

Crss

0
25

25

50

75

100

125

150

10

15

TJ, JUNCTION TEMPERATURE (C)

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 7. OnResistance versus


Junction Temperature

Figure 8. Capacitance

20

SOURCE CURRENT (AMPS)

10

1.0
TJ = 150C

55C

0.1
25C
0.01

0.001
0

3
4
1
2
SOURCETODRAIN FORWARD VOLTAGE (VOLTS)

4.5

Figure 9. SourcetoDrain Forward Voltage


versus Continuous Current (IS)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

359

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBF2201NT1
Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors

Part of the GreenLine Portfolio of devices with energyconserving traits.


These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

N CHANNEL
ENHANCEMENT MODE
TMOS MOSFET
rDS(on) = 1.0 OHM

3 DRAIN

CASE 41902, Style 7


SC70/SOT323

1
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery


Life

2 SOURCE

Miniature SC70 / SOT 323 Surface Mount Package Saves


Board Space

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Continuous @ TA = 70C
Drain Current Pulsed Drain Current (tp 10 s)

ID
ID
IDM

300
240
750

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

150
1.2

mW
mW/C

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

833

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

DEVICE MARKING
N1
(1) Mounted on G10/FR4 glass epoxy board using minimum recommended footprint.

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MMBF2201NT1

8 mm embossed tape

3000

MMBF2201NT3

13

8 mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

360

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF2201NT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

Adc

Zero Gate Voltage Drain Current


(VDS = 16 Vdc, VGS = 0 Vdc)
(VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 300 mAdc)
(VGS = 4.5 Vdc, ID = 100 mAdc)

rDS(on)

0.75
1.0

1.0
1.4

gFS

450

mMhos

pF

ON CHARACTERISTICS(1)

Forward Transconductance (VDS = 10 Vdc, ID = 200 mAdc)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

45

Output Capacitance

(VDS = 5.0 V)

Coss

25

Transfer Capacitance

(VDG = 5.0 V)

Crss

5.0

td(on)

2.5

tr

2.5

td(off)

15

tf

0.8

QT

1400

pC

IS

0.3

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

0.85

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

((VDD = 15 Vdc, ID = 300 mAdc,


RL = 50 )

Fall Time
Gate Charge (See Figure 5)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

TYPICAL CHARACTERISTICS
1.6

1.0

1.4

VGS = 4 V

0.8

RDS , ON RESISTANCE (OHMS)

ID , DRAIN CURRENT (AMPS)

0.9

0.7
0.6
VGS = 3.5 V

0.5
0.4

VGS = 3 V

0.3
0.2

VGS = 2.5 V

0.1
1

4
7
8
2
3
5
6
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

VGS = 4.5 V
1.0
ID = 100 mA
0.8

VGS = 10 V

0.6

ID = 300 mA

0.4
0.2

0
0

1.2

10

Figure 1. Typical Drain Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0
60 40 20

20 40 60 80
TEMPERATURE (C)

100 120 140 160

Figure 2. On Resistance versus Temperature

361

MMBF2201NT1
TYPICAL CHARACTERISTICS
1.2
RDS , ON RESISTANCE (OHMS)

RDS , ON RESISTANCE (OHMS)

10

ID = 300 mA

VGS = 4.5 V

1.0
0.8
0.6

VGS = 10 V

0.4
0.2
0

0
0

3
4
5
6
7
8
GATE SOURCE VOLTAGE (VOLTS)

10

Figure 3. On Resistance versus Gate Source


Voltage

0.1

0.2

0.5
0.3
0.4
0.6
ID, DRAIN CURRENT (AMPS)

0.8

Figure 4. On Resistance versus Drain Current

45

1.0

VGS = 0 V
F = 1 mHz

40
35
C, CAPACITANCE (pF)

I S , SOURCE CURRENT (AMPS)

0.7

0.1

0.01

30
25
20

Ciss

15
Coss

10

Crss

5
0

0.001
0

0.1
0.2 0.3 0.4
0.5 0.6
0.7 0.8 0.9
VSD, SOURCE DRAIN FORWARD VOLTAGE (VOLTS)

1.0

4
8
12
16
6
10
14
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

Figure 5. Source Drain Forward Voltage

18

20

Figure 6. Capacitance Variation

1.0

I D , DRAIN CURRENT (AMPS)

0.9
0.8
55

0.7

25
150

0.6
0.5
0.4
0.3
0.2
0.1
0
0

0.5

1.0
1.5
2.0
2.5
3.0
3.5
VGS, GATE SOURCE VOLTAGE (VOLTS)

4.0

4.5

Figure 7. Transfer Characteristics

362

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBF2202PT1

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energyconserving traits.
These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

Motorola Preferred Device

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 2.2 OHM

3 DRAIN

1
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery


Life
Miniature SC70/SOT323 Surface Mount Package Saves
Board Space

CASE 41902, STYLE 7


SC70/SOT323

2 SOURCE

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Continuous @ TA = 70C
Drain Current Pulsed Drain Current (tp 10 s)

ID
ID
IDM

300
240
750

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

150
1.2

mW
mW/C

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

833

C/W

TL

260

Rating
DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

DEVICE MARKING
P3
(1) Mounted on G10/FR4 glass epoxy board using minimum recommended footprint.

ORDERING INFORMATION
Reel Size

Tape Width

Quantity

MMBF2202PT1

Device

8 mm embossed tape

3000

MMBF2202PT3

13

8 mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

363

MMBF2202PT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

Adc

Zero Gate Voltage Drain Current


(VDS = 16 Vdc, VGS = 0 Vdc)
(VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 200 mAdc)
(VGS = 4.5 Vdc, ID = 50 mAdc)

rDS(on)

1.5
2.0

2.2
3.5

gFS

600

mMhos

pF

ON CHARACTERISTICS(1)

Forward Transconductance (VDS = 10 Vdc, ID = 200 mAdc)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

50

Output Capacitance

(VDS = 5.0 V)

Coss

45

Transfer Capacitance

(VDG = 5.0 V)

Crss

20

td(on)

2.5

tr

1.0

td(off)

16

tf

8.0

QT

2700

pC

IS

0.3

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

1.5

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

(VDD = 15 Vdc,
RL = 75 ,
ID = 200 mAdc,
mAdc
VGEN = 10 V, RG = 6.0 )

Fall Time
Gate Charge (See Figure 5)

(VDS = 16 V, VGS = 10 V,
ID = 200 mA)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

364

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF2202PT1
TYPICAL CHARACTERISTICS

4.0

rDS(on) , ON RESISTANCE (OHMS)

rDS(on) , ON RESISTANCE (OHMS)

10

ID = 200 mA

10

3.5

VGS = 4.5 V
ID = 50 mA

3.0
2.5
2.0

VGS = 10 V
ID = 200 mA

1.5
1.0
0.5
0

40

20

20

40

60

80

100 120

140

160

VGS, GATESOURCE VOLTAGE (VOLTS)

TEMPERATURE (C)

Figure 1. On Resistance versus GateSource Voltage

Figure 2. On Resistance versus Temperature

Motorola SmallSignal Transistors, FETs and Diodes Device Data

365

MMBF2202PT1
1.0
0.9
5
4

I D, DRAIN CURRENT (AMPS)

rDS(on) , ON RESISTANCE (OHMS)

VGS = 4.5 V

3
VGS = 10 V

2
1

0.8
0.7
55

0.6
0.5

150

25

0.4
0.3
0.2
0.1

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.5

1.0

1.5

2.0 2.5

3.0

3.5 4.0

Figure 3. On Resistance versus Drain Current

Figure 4. Transfer Characteristics

5.5

6.0

10

ID(on), DRAIN CURRENT (AMPS)

0.8

25
0.1
150

0.01

VGS = 5 V

0.7
0.6

VGS = 4.5 V

0.5
VGS = 4 V

0.4
0.3

VGS = 3.5 V
0.2
VGS = 3 V

0.1
0.001

4.5 5.0

VGS, GATESOURCE VOLTAGE (VOLTS)

1
IS , SOURCE CURRENT (AMPS)

ID, DRAIN CURRENT (AMPS)

0.5

1.0

1.5

2.0

2.5

VSD, SOURCEDRAIN FORWARD VOLTAGE (VOLTS)

VDS, DRAINSOURCE VOLTAGE (VOLTS)

Figure 5. SourceDrain Forward Voltage

Figure 6. On Region Characteristics

50
45

VGS = 0 V
f = 1 MHz

C, CAPACITANCE (pF)

40
35
30
25
20

Ciss

15
Coss

10
5
0

Crss
0

10

12

14

16

18

20

VDS, DRAINSOURCE VOLTAGE (VOLTS)

Figure 7. Capacitance Variation

366

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBT1010LT1
MSD1010T1

Low Saturation Voltage


PNP Silicon Driver Transistors

Motorola Preferred Devices

Part of the GreenLine Portfolio of devices with energyconserving traits.


PNP GENERAL
PURPOSE DRIVER
TRANSISTORS
SURFACE MOUNT

This PNP Silicon Epitaxial Planar Transistor is designed to conserve energy


in general purpose driver applications. This device is housed in the SOT-23 and
SC59 packages which are designed for low power surface mount
applications.
Low VCE(sat), < 0.1 V at 50 mA
Applications

LCD Backlight Driver


Annunciator Driver

General Output Device Driver

MAXIMUM RATINGS (TA = 25C)


Symbol

Value

Unit

Collector-Base Voltage

V(BR)CBO

45

Vdc

Collector-Emitter Voltage

V(BR)CEO

15

Vdc

Emitter-Base Voltage

V(BR)EBO

5.0

Vdc

IC

100

mAdc

Rating

Collector Current Continuous

CASE 31808, STYLE 6


SOT-23

3
2
1

DEVICE MARKING
MMBT1010LT1 = GLP
MSD1010T1 = GLP

CASE 318D04, STYLE 1


SC-59

THERMAL CHARACTERISTICS
Rating

Symbol

Max

Unit

Power Dissipation
TA = 25C
Derate above 25C

PD(1)

250

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RJA

556

C/W

TJ

150

Tstg

55 ~ + 150

Junction Temperature
Storage Temperature Range

COLLECTOR

BASE

EMITTER

ELECTRICAL CHARACTERISTICS
Symbol

Condition

Min

Max

Unit

Collector-Emitter Breakdown Voltage

Characteristic

V(BR)CEO

IC = 10 mA, IB = 0

15

Vdc

Emitter-Base Breakdown Voltage

V(BR)EBO

IE = 10 A, IE = 0

5.0

Vdc

ICBO

VCB = 20 V, IE = 0

0.1

ICEO
hFE1(2)

VCE = 10 V, IB = 0

100

Collector-Base Cutoff Current


Collector-Emitter Cutoff Current
DC Current Gain

VCE = 5 V, IC = 100 mA

300

600

Collector-Emitter Saturation Voltage

VCE(sat)(2)

IC = 10 mA, IB = 1.0 mA
IC = 50 mA, IB = 5.0 mA
IC = 100 mA, IB = 10 mA

0.1
0.1
0.19

Vdc

Base-Emitter Saturation Voltage

VBE(sat)(2)

IC = 100 mA, IB = 10 mA

1.1

Vdc

(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
(2) Pulse Test: Pulse Width 300 s, D.C. 2%.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

367

368

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Section 4
SmallSignal FieldEffect
Transistors and MOSFETs

In Brief . . .
The data sheets on the following pages are designed to
emphasize those FETs that by virtue of widespread industry
use, ease of manufacture, and low relative cost, merit first
consideration for new equipment design.
CAUTION:
Static electricity is a surface phenomenon which most
commonly occurs when two dissimilar materials come into
contact and then separate. Electro Static Discharge (ESD)
damage of semiconductor components by operating personnel is quickly becoming a very prominent and significant
problem. From simple bipolar designs to sensitive MOSFET
structures, ESD has its unforgiving effect of degradation or
destruction.
Motorola believes it is important to extend any emphasizing note of cautiousness when handling and testing ANY
FET product. Precautions include, but are not limited to, the
implementation of static safe workstations and proper handling techniques. Additionally, it is very important to keep
FET devices in their antistatic shipping containers and away
from staticgenerating materials.
NOTE: All SOT-23 package devices have had a T1 suffix
NOTE: added to the device title.

CASE 29-05
(TO-226AE)
1 WATT TO-92

CASE 29-04
(TO-226AA)
TO-92

3
3
1

2
2

CASE 318-08
(TO-236AB)
SOT-23

CASE 318D-04
SC59

6
4
1

1
3

CASE 318G-02
TSOP6

CASE 318E-04
(TO-261AA)
SOT-223

3
1

2
1

CASE 419-02
SC70/SOT323

Motorola SmallSignal Transistors, FETs and Diodes Device Data

CASE 425-04
SOD123

41

EMBOSSED TAPE AND REEL


SOT-23 and SOT-223 packages are available only in Tape and Reel. Use the appropriate suffix indicated
below to order any of the SOT-23 and SOT-223 packages. (See Section 6 on Packaging for additional
information).
SOT-23:

available in 8 mm Tape and Reel


Use the device title (which already includes the T1 suffix) to order the 7 inch/3000 unit reel.
Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/10,000 unit reel.

SOT-223:

available in 12 mm Tape and Reel


Use the device title (which already includes the T1 suffix) to order the 7 inch/1000 unit reel.
Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/4000 unit reel.

RADIAL TAPE IN FAN FOLD BOX OR REEL


TO-92 packages are available in both bulk shipments and in Radial Tape in Fan Fold Boxes or Reels.
Fan Fold Boxes and Radial Tape Reel are the best methods for capturing devices for automatic insertion in
printed circuit boards.
TO-92:

available in Fan Fold Box


Add an RLR suffix and the appropriate Style code* to the device title to order the Fan Fold box.
available in 365 mm Radial Tape Reel
Add an RLR suffix and the appropriate Style code* to the device title to order the Radial Tape
Reel.

*Refer to Section 6 on Packaging for Style code characters and additional information on ordering
*requirements.

DEVICE MARKINGS/DATE CODE CHARACTERS


The SOT-23 package has a device marking and a date code etched on the device. The generic
example below depicts both the device marking and a representation of the date code that appears on the
SOT-23 package.

ABC D
The D represents a smaller alpha digit Date Code. The Date Code indicates the actual month in which the
part was manufactured.

42

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS FET Transistor

2N7000

NChannel Enhancement

Motorola Preferred Device

3 DRAIN

2
GATE
1 SOURCE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Source Voltage

VDSS

60

Vdc

DrainGate Voltage (RGS = 1.0 M)

VDGR

60

Vdc

GateSource Voltage
Continuous
Nonrepetitive (tp 50 s)

VGS
VGSM

20
40

Vdc
Vpk

ID
IDM

200
500

PD

350
2.8

mW
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

RJA

357

C/W

TL

300

Drain Current
Continuous
Pulsed

1
2

CASE 2904, STYLE 22


TO92 (TO226AA)

mAdc

Total Power Dissipation @ TC = 25C


Derate above 25C
Operating and Storage Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
Maximum Lead Temperature for
Soldering Purposes, 1/16 from case
for 10 seconds

ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)


Symbol

Min

Max

Unit

V(BR)DSS

60

Vdc

1.0
1.0

Adc
mAdc

IGSSF

10

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mAdc)

VGS(th)

0.8

3.0

Vdc

Static DrainSource OnResistance


(VGS = 10 Vdc, ID = 0.5 Adc)
(VGS = 4.5 Vdc, ID = 75 mAdc)

rDS(on)

5.0
6.0

DrainSource OnVoltage
(VGS = 10 Vdc, ID = 0.5 Adc)
(VGS = 4.5 Vdc, ID = 75 mAdc)

VDS(on)

2.5
0.45

Characteristic

OFF CHARACTERISTICS
DrainSource Breakdown Voltage
(VGS = 0, ID = 10 Adc)
Zero Gate Voltage Drain Current
(VDS = 48 Vdc, VGS = 0)
(VDS = 48 Vdc, VGS = 0, TJ = 125C)
GateBody Leakage Current, Forward
(VGSF = 15 Vdc, VDS = 0)

IDSS

ON CHARACTERISTICS(1)

Ohm

Vdc

1. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.


Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

Motorola SmallSignal Transistors, FETs and Diodes Device Data

43

2N7000
ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted) (Continued)
Symbol

Min

Max

Unit

OnState Drain Current


(VGS = 4.5 Vdc, VDS = 10 Vdc)

Id(on)

75

mAdc

Forward Transconductance
(VDS = 10 Vdc, ID = 200 mAdc)

gfs

100

mhos

pF

Characteristic

ON CHARACTERISTICS(1) (continued)

DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 25 V
V, VGS = 0,
0
f = 1.0 MHz)

Output Capacitance
Reverse Transfer Capacitance

Ciss

60

Coss

25

Crss

5.0

ton

10

toff

10

SWITCHING CHARACTERISTICS(1)
TurnOn Delay Time
TurnOff Delay Time

((VDD = 15 V, ID = 500 mA,


Rgen = 25 ohms, RL = 25 ohms)

ns

1. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

2.0

1.0
VDS = 10 V

TA = 25C

1.6

VGS = 10 V

1.4

9V

1.2

I D, DRAIN CURRENT (AMPS)

I D, DRAIN CURRENT (AMPS)

1.8

8V

1.0
7V

0.8

6V

0.6
0.4

5V

0.2

4V
3V

1.0

2.0 3.0 4.0 5.0


6.0
7.0 8.0
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

9.0

0.8

125C

0.6

0.4

0.2

10

2.4
2.2

1.8

VGS = 10 V
ID = 200 mA

1.6
1.4
1.2
1.0
0.8
0.6
0.4
60

20

+ 20
+ 60
T, TEMPERATURE (C)

+ 100

Figure 3. Temperature versus Static


DrainSource OnResistance

44

1.0

2.0 3.0 4.0


5.0
6.0
7.0 8.0
VGS, GATE SOURCE VOLTAGE (VOLTS)

9.0

10

Figure 2. Transfer Characteristics

VGS(th) , THRESHOLD VOLTAGE (NORMALIZED)

r DS(on) , STATIC DRAINSOURCE ONRESISTANCE


(NORMALIZED)

Figure 1. Ohmic Region

2.0

25C

55C

+ 140

1.2
1.05
VDS = VGS
ID = 1.0 mA

1.1
1.10
1.0
0.95
0.9
0.85
0.8
0.75
0.7
60

20

+ 20
+ 60
T, TEMPERATURE (C)

+ 100

+ 140

Figure 4. Temperature versus Gate


Threshold Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS FET Transistor


NChannel Enhancement

2N7002LT1

3 DRAIN

Motorola Preferred Device

1
GATE
3

2 SOURCE
1

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

DrainSource Voltage

VDSS

60

Vdc

DrainGate Voltage (RGS = 1.0 M)

VDGR

60

Vdc

ID
ID
IDM

115
75
800

mAdc

VGS
VGSM

20
40

Vdc
Vpk

Drain Current Continuous TC = 25C(1)


Drain Current Continuous TC = 100C(1)
Drain Current Pulsed(2)
GateSource Voltage
Continuous
Nonrepetitive (tp 50 s)

CASE 318 08, STYLE 21


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR5 Board,(3) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate,(4) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

Symbol

Max

Unit

PD

225
1.8

mW
mW/C

RJA

556

C/W

PD

300

mW

2.4

mW/C

RJA

417

C/W

TJ, Tstg

55 to +150

DEVICE MARKING
2N7002LT1 = 702

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

V(BR)DSS

60

Vdc

IDSS

1.0
500

Adc

GateBody Leakage Current, Forward


(VGS = 20 Vdc)

IGSSF

100

nAdc

GateBody Leakage Current, Reverse


(VGS = 20 Vdc)

IGSSR

100

nAdc

Characteristic

OFF CHARACTERISTICS
DrainSource Breakdown Voltage
(VGS = 0, ID = 10 Adc)
Zero Gate Voltage Drain Current
(VGS = 0, VDS = 60 Vdc)

1.
2.
3.
4.

TJ = 25C
TJ = 125C

The Power Dissipation of the package may result in a lower continuous drain current.
Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.
FR5 = 1.0 x 0.75 x 0.062 in.
Alumina = 0.4 x 0.3 x 0.025 in 99.5% alumina.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

45

2N7002LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Symbol

Min

Typ

Max

Unit

VGS(th)

1.0

2.5

Vdc

OnState Drain Current


(VDS 2.0 VDS(on), VGS = 10 Vdc)

ID(on)

500

mA

Static DrainSource OnState Voltage


(VGS = 10 Vdc, ID = 500 mAdc)
(VGS = 5.0 Vdc, ID = 50 mAdc)

VDS(on)

3.75
0.375

Static DrainSource OnState Resistance


(VGS = 10 V, ID = 500 mAdc)
TC = 25C
TC = 125C
(VGS = 5.0 Vdc, ID = 50 mAdc) TC = 25C
TC = 125C

rDS(on)

7.5
13.5
7.5
13.5

gFS

80

mmhos

Input Capacitance
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

50

pF

Output Capacitance
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Coss

25

pF

Reverse Transfer Capacitance


(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Crss

5.0

pF

td(on)

30

ns

td(off)

40

ns

VSD

1.5

Vdc

IS

115

mAdc

ISM

800

mAdc

Characteristic

ON CHARACTERISTICS(2)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

Forward Transconductance
(VDS 2.0 VDS(on), ID = 200 mAdc)

Vdc

Ohms

DYNAMIC CHARACTERISTICS

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
TurnOff Delay Time

( DD = 25 Vdc, ID
(V
500 mAdc,
RG = 25 , RL = 50 )

BODYDRAIN DIODE RATINGS


Diode Forward OnVoltage
(IS = 11.5 mAdc, VGS = 0 V)
Source Current Continuous
(Body Diode)
Source Current Pulsed
2. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

46

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N7002LT1
2.0

1.0
VDS = 10 V

TA = 25C

1.6

VGS = 10 V

1.4

9V

1.2

I D, DRAIN CURRENT (AMPS)

I D, DRAIN CURRENT (AMPS)

1.8

8V

1.0
7V

0.8

6V

0.6
0.4

5V

0.2

4V
3V

1.0

2.0 3.0 4.0 5.0


6.0
7.0 8.0
VDS, DRAN SOURCE VOLTAGE (VOLTS)

9.0

0.8

125C

0.6

0.4

0.2

10

2.4
2.2

1.8

VGS = 10 V
ID = 200 mA

1.6
1.4
1.2
1.0
0.8
0.6
0.4
60

20

+ 20
+ 60
T, TEMPERATURE (C)

1.0

2.0 3.0 4.0


5.0
6.0
7.0 8.0
VGS, GATE SOURCE VOLTAGE (VOLTS)

9.0

10

Figure 2. Transfer Characteristics

VGS(th) , THRESHOLD VOLTAGE (NORMALIZED)

r DS(on) , STATIC DRAINSOURCE ONRESISTANCE


(NORMALIZED)

Figure 1. Ohmic Region

2.0

25C

55C

+ 100

+ 140

Figure 3. Temperature versus Static


DrainSource OnResistance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.2
1.05
VDS = VGS
ID = 1.0 mA

1.1
1.10
1.0
0.95
0.9
0.85
0.8
0.75
0.7
60

20

+ 20
+ 60
T, TEMPERATURE (C)

+ 100

+ 140

Figure 4. Temperature versus Gate


Threshold Voltage

47

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS Switching

NChannel Enhancement

BS107
BS107A

1 DRAIN

2
GATE

3 SOURCE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VDS

200

Vdc

VGS
VGSM

20
30

ID
IDM

250
500

PD

350

mW

TJ, Tstg

55 to 150

Drain Source Voltage


GateSource Voltage
Continuous
Nonrepetitive (tp 50 s)
Drain Current
Continuous(1)
Pulsed(2)

1
2

Vdc
Vpk

CASE 2904, STYLE 30


TO92 (TO226AA)

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C
Operating and Storage Junction
Temperature Range

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

ZeroGateVoltage Drain Current (VDS = 130 Vdc, VGS = 0)

IDSS

30

nAdc

DrainSource Breakdown Voltage (VGS = 0, ID = 100 Adc)

V(BR)DSX

200

Vdc

IGSS

0.01

10

nAdc

Gate Threshold Voltage (ID = 1.0 mAdc, VDS = VGS)

VGS(Th)

1.0

3.0

Static DrainSource On Resistance


BS107 (VGS = 2.6 Vdc, ID = 20 mAdc)
(VGS = 10 Vdc, ID = 200 mAdc)
BS107A (VGS = 10 Vdc)
(ID = 100 mAdc)
(ID = 250 mAdc)

rDS(on)

OFF CHARACTERISTICS

Gate Reverse Current (VGS = 15 Vdc, VDS = 0)

ON CHARACTERISTICS(2)
Vdc
Ohms

28
14

4.5
4.8

6.0
6.4

SMALL SIGNAL CHARACTERISTICS


Input Capacitance
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

60

pF

Reverse Transfer Capacitance


(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Crss

6.0

pF

Output Capacitance
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Coss

30

pF

gfs

200

400

mmhos

TurnOn Time

ton

6.0

15

ns

TurnOff Time

toff

12

15

ns

Forward Transconductance
(VDS = 25 Vdc, ID = 250 mAdc)

SWITCHING CHARACTERISTICS

1. The Power Dissipation of the package may result in a lower continuous drain current.
2. Pulse Test: Pulse Width
300 s, Duty Cycle
2.0%.

REV 1

48

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BS107 BS107A
RESISTIVE SWITCHING
+25 V
TO SAMPLING SCOPE
50 INPUT
Vout

23
PULSE GENERATOR

20 dB
50 ATTENUATOR

Vin
40 pF

INPUT Vin

50%

PULSE WIDTH

50%

10%

200

10

180

VGS = 0 V

160

5.0
VGS = 10 V

C, CAPACITANCE (pF)

VDS , DRAINSOURCE VOLTAGE (VOLTS)

90%

Figure 2. Switching Waveforms

Figure 1. Switching Test Circuit

250 mA

2.0
1.0
100 mA
0.5

140
120
100
Ciss

80
60
40

0.2

20
0.1
55

35

85 105
45
15 +5.0 25
65
TJ, JUNCTION TEMPERATURE (C)

125

145

Coss

Crss

40
10
20
30
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

Figure 3. On Voltage versus Temperature

0.8

0.7

0.7

0.6

10 V
VGS = 10 V

0.6
0.5
0.4
0.3
0.2
0.1
0

1.0

5.0 6.0 7.0 8.0


2.0 3.0 4.0
VGS, GATE SOURCE VOLTAGE (VOLTS)

9.0

50

Figure 4. Capacitance Variation

I D(on) , DRAIN CURRENT (AMPS)

ID(on) , DRAIN CURRENT (AMPS)

90%
10%

OUTPUT Vout
INVERTED

1M

10 V

toff
90%

50
50

ton

10

Figure 5. Transfer Characteristic

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5.0 V

0.5
0.4
0.3

4.0 V

0.2
0.1

3.0 V
0

2.0

10
4.0
6.0 8.0
12
14
16
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

18

20

Figure 6. Output Characteristic

49

BS107 BS107A
ID(on), DRAIN CURRENT (AMPS)

0.7
10 V

0.6
0.5

5.0 V

0.4
0.3

4.0 V

0.2
0.1

3.0 V
1.0

2.0

3.0

4.0

5.0

VDS, DRAIN SOURCE VOLTAGE (VOLTS)

Figure 7. Saturation Characteristic

410

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS FET Switching

BS170

NChannel Enhancement

1 DRAIN

2
GATE
3 SOURCE

MAXIMUM RATINGS

Rating
Drain Source Voltage
GateSource Voltage
Continuous
Nonrepetitive (tp 50 s)
Drain Current(1)

Symbol

Value

Unit

VDS

60

Vdc

VGS
VGSM

20
40

Vdc
Vpk

ID

0.5

Adc

PD

350

mW

TJ, Tstg

55 to +150

Total Device Dissipation @ TA = 25C


Operating and Storage Junction
Temperature Range

CASE 2904, STYLE 30


TO92 (TO226AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

IGSS

0.01

10

nAdc

V(BR)DSS

60

90

Vdc

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mAdc)

VGS(Th)

0.8

2.0

3.0

Vdc

Static DrainSource On Resistance


(VGS = 10 Vdc, ID = 200 mAdc)

rDS(on)

1.8

5.0

ID(off)

0.5

gfs

200

mmhos

Ciss

60

pF

TurnOn Time
(ID = 0.2 Adc) See Figure 1

ton

4.0

10

ns

TurnOff Time
(ID = 0.2 Adc) See Figure 1

toff

4.0

10

ns

OFF CHARACTERISTICS
Gate Reverse Current
(VGS = 15 Vdc, VDS = 0)
DrainSource Breakdown Voltage
(VGS = 0, ID = 100 Adc)

ON CHARACTERISTICS(2)

Drain Cutoff Current


(VDS = 25 Vdc, VGS = 0 Vdc)
Forward Transconductance
(VDS = 10 Vdc, ID = 250 mAdc)

SMALL SIGNAL CHARACTERISTICS


Input Capacitance
(VDS = 10 Vdc, VGS = 0, f = 1.0 MHz)

SWITCHING CHARACTERISTICS

1. The Power Dissipation of the package may result in a lower continuous drain current.
2. Pulse Test: Pulse Width
300 s, Duty Cycle
2.0%.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

411

BS170
RESISTIVE SWITCHING
+25 V
ton

Vin
PULSE GENERATOR
50

125
20 dB
50 ATTENUATOR

40 pF
50

1.0 M

TO SAMPLING SCOPE
50 INPUT
Vout
OUTPUT
V
INVERTED out

toff

90%
10%
90%
50%

10%
INPUT

Vin

(Vin Amplititude 10 Volts)

Figure 2. Switching Waveforms

Figure 1. Switching Test Circuit

2.0
VDS = VGS
ID = 1.0 mA

I D(on) , DRAIN CURRENT (AMPS)

VGS(th), THRESHOLD VOLTAGE

2.0

1.6

PULSE
WIDTH

1.2

0.8

0.4

VGS = 10 V
1.6

9.0 V
8.0 V

1.2

7.0 V
6.0 V

0.8

5.0 V
0.4
4.0 V

0
50

100
0
50
TJ, JUNCTION TEMPERATURE (C)

150

Figure 3. VGS(th) Normalized versus Temperature

100

VGS = 10 V
9.0 V

1.6

VGS = 0 V

80

8.0 V
1.2
7.0 V
0.8
6.0 V
0.4

4.0

Figure 4. OnRegion Characteristics

C, CAPACITANCE (pF)

I D(on) , DRAIN CURRENT (AMPS)

2.0

1.0
2.0
3.0
VDS, DRAIN TOSOURCE VOLTAGE (VOLTS)

60

40
Ciss
20

5.0 V

Coss

4.0 V

Crss
0

20
10
30
VDS, DRAIN TOSOURCE VOLTAGE (VOLTS)

Figure 5. Output Characteristics

412

40

10
20
30
40
50
60
VDS, DRAIN TOSOURCE VOLTAGE (VOLTS)

Figure 6. Capacitance versus


DrainToSource Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BSS84LT1

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors
Part of the Greenline Portfolio of devices with energyconserving traits.
These miniature surface mount MOSFETs utilize Motorolas High
Cell Density, HDTMOS process. Reduced power loss conserves
energy, making this device ideal for use in small power management circuitry. Typical applications are dcdc converters, load
switching, power management in portable and batterypowered
products such as computers, printers, cellular and cordless
telephones.
1

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET

3 DRAIN
3
1
2

CASE 31808, Style 21


SOT23 (TO236AB)

GATE

Energy Efficient

Motorola Preferred Device

Miniature SOT23 Surface Mount Package Saves Board Space


2 SOURCE

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

50

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

130
520

mA

DraintoSource Voltage

Total Power Dissipation @ TA = 25C

PD

225

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

556

C/W

TL

260

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

DEVICE MARKING
BSS84LT1 = PD

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

BSS84LT1

8mm embossed tape

3000

BSS84LT3

13

8mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

413

BSS84LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

50

Vdc

0.1
15
60

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 250 Adc)

Adc

Zero Gate Voltage Drain Current


(VDS = 25 Vdc, VGS = 0 Vdc)
(VDS = 50 Vdc, VGS = 0 Vdc)
(VDS = 50 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc)

IGSS

60

Adc

GateSource Threaded Voltage


(VDS = VGS, ID = 1.0 mAdc)

VGS(th)

0.8

2.0

Vdc

Static DraintoSource OnResistance


(VGS = 5.0 Vdc, ID = 100 mAdc)

rDS(on)

5.0

10

Ohms

|yfs|

50

mS

(VDS = 5.0 Vdc)

Ciss

30

pF

Output Capacitance

(VDS = 5.0 Vdc)

Coss

10

Transfer Capacitance

(VDG = 5.0 Vdc)

Crss

5.0

td(on)

2.5

tr

1.0

td(off)

16

ON CHARACTERISTICS(1)

Transfer Admittance
(VDS = 25 Vdc, ID = 100 mAdc, f = 1.0 kHz)
DYNAMIC CHARACTERISTICS
Input Capacitance

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

((VDD = 15 Vdc, ID = 2.5 Adc,


RL = 50 )

Fall Time

ns

tf

8.0

QT

6000

pC

IS

0.130

Pulsed Current

ISM

0.520

Forward Voltage(2)

VSD

2.5

Gate Charge
SOURCEDRAIN DIODE CHARACTERISTICS
Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

TYPICAL ELECTRICAL CHARACTERISTICS


0.6

0.5
25C
55C

150C

VGS = 3.5 V

TJ = 25C

0.45

0.5

I D , DRAIN CURRENT (AMPS)

I D , DRAIN CURRENT (AMPS)

VDS = 10 V

3.25 V

0.4

0.35

0.4

0.3

3.0 V

0.25

0.3
0.2

0.2

2.75 V

0.15

0.1

2.5 V

0.1

2.25 V

0.05
0

1.5
2
2.5
3
3.5
VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 1. Transfer Characteristics

414

10

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 2. OnRegion Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

9
VGS = 4.5 V
8

150C

7
6
25C

5
4

55C

3
2
0

0.1

0.2

0.3

0.4

0.5

0.6

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

BSS84LT1
7
150C

VGS = 10 V

6.5
6
5.5
5
4.5
4

25C

3.5
3
55C

2.5
2
0

0.2

0.1

VGS, GATETOSOURCE VOLTAGE (VOLTS)

RDS(on) , DRAINTOSOURCE RESISTANCE


(NORMALIZED)

2
VGS = 10 V
ID = 0.52 A

1.6
1.4
VGS = 4.5 V
ID = 0.13 A

1.2
1
0.8
0.6
55

45

0.4

0.6

0.5

Figure 4. OnResistance versus Drain Current

Figure 3. OnResistance versus Drain Current

1.8

0.3

ID, DRAIN CURRENT (AMPS)

ID, DRAIN CURRENT (AMPS)

95

6
5
4
ID = 0.5 A

3
2
1
0

145

VDS = 40 V
TJ = 25C

1000

500

TJ, JUNCTION TEMPERATURE (C)

1500

2000

QT, TOTAL GATE CHARGE (pC)

Figure 6. Gate Charge

Figure 5. OnResistance Variation with Temperature

I D , DIODE CURRENT (AMPS)

TJ = 150C

0.1

25C

55C

0.01

0.001

0.5

1.0

1.5

2.0

2.5

3.0

VSD, DIODE FORWARD VOLTAGE (VOLTS)

Figure 7. Body Diode Forward Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

415

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS FET Transistor

BSS123LT1

NChannel

3 DRAIN

Motorola Preferred Device

1
GATE

2 SOURCE
1

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

DrainSource Voltage

VDSS

100

Vdc

GateSource Voltage
Continuous
Nonrepetitive (tp 50 s)

VGS
VGSM

20
40

Vdc
Vpk

ID
IDM

0.17
0.68

Drain Current
Continuous(1)
Pulsed(2)

CASE 318 08, STYLE 21


SOT 23 (TO 236AB)

Adc

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Total Device Dissipation FR 5 Board(3)


TA = 25C
Derate above 25C

Characteristic

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

TJ, Tstg

55 to +150

Junction and Storage Temperature

DEVICE MARKING
BSS123LT1 = SA

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

100

Vdc

15
60

OFF CHARACTERISTICS
DrainSource Breakdown Voltage
(VGS = 0, ID = 250 Adc)

Adc

Zero Gate Voltage Drain Current


(VGS = 0, VDS = 100 Vdc) TJ = 25C
TJ = 125C

IDSS

GateBody Leakage Current


(VGS = 20 Vdc, VDS = 0)

IGSS

50

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mAdc)

VGS(th)

0.8

2.8

Vdc

Static DrainSource OnResistance


(VGS = 10 Vdc, ID = 100 mAdc)

rDS(on)

5.0

6.0

gfs

80

mmhos

ON CHARACTERISTICS(4)

Forward Transconductance
(VDS = 25 Vdc, ID = 100 mAdc)
1.
2.
3.
4.

The Power Dissipation of the package may result in a lower continuous drain current.
Pulse Width
300 ms, Duty Cycle
2.0%.
FR 5 = 1.0
0.75 0.062 in.
Pulse Test: Pulse Width
300 ms, Duty Cycle
2.0%.

v


Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

416

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BSS123LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

Input Capacitance
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

20

pF

Output Capacitance
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Coss

9.0

pF

Reverse Transfer Capacitance


(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Crss

4.0

pF

td(on)

20

ns

td(off)

40

ns

VSD

1.3

DYNAMIC CHARACTERISTICS

SWITCHING CHARACTERISTICS(4)
TurnOn Delay Time

( CC = 30 Vdc, IC = 0.28 Adc,


(V
VGS = 10 Vdc, RGS = 50 )

TurnOff Delay Time

REVERSE DIODE
Diode Forward OnVoltage
(ID = 0.34 Adc, VGS = 0 Vdc)
4. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

2.0

1.0
VDS = 10 V

TA = 25C

1.6

VGS = 10 V

1.4

9V

1.2

I D, DRAIN CURRENT (AMPS)

I D, DRAIN CURRENT (AMPS)

1.8

8V

1.0
7V

0.8

6V

0.6
0.4

5V

0.2

4V
3V

1.0

2.0 3.0 4.0 5.0


6.0
7.0 8.0
VDS, DRAN SOURCE VOLTAGE (VOLTS)

9.0

0.8

125C

0.6

0.4

0.2

10

2.4
2.2

1.8

VGS = 10 V
ID = 200 mA

1.6
1.4
1.2
1.0
0.8
0.6
0.4
60

20

+ 20
+ 60
T, TEMPERATURE (C)

1.0

2.0 3.0 4.0


5.0
6.0
7.0 8.0
VGS, GATE SOURCE VOLTAGE (VOLTS)

9.0

10

Figure 2. Transfer Characteristics

VGS(th) , THRESHOLD VOLTAGE (NORMALIZED)

r DS(on) , STATIC DRAINSOURCE ONRESISTANCE


(NORMALIZED)

Figure 1. Ohmic Region

2.0

25C

55C

+ 100

+ 140

Figure 3. Temperature versus Static


DrainSource OnResistance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.2
1.05
VDS = VGS
ID = 1.0 mA

1.1
1.10
1.0
0.95
0.9
0.85
0.8
0.75
0.7
60

20

+ 20
+ 60
T, TEMPERATURE (C)

+ 100

+ 140

Figure 4. Temperature versus Gate


Threshold Voltage

417

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BSS138LT1
Motorola Preferred Device

N-Channel Enhancement Mode


Logic Level SOT-23 MOSFET

NCHANNEL
LOGIC LEVEL
TMOS FET
TRANSISTOR

Typical applications are dcdc converters, power management in


portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.
Low Threshold Voltage (VGS(th): 0.5V...1.5V) makes it ideal for
low voltage applications

Miniature SOT23 Surface Mount Package saves board space


3 DRAIN

1
2

CASE 31808, Style 21


SOT23 (TO236A)
1
GATE

2 SOURCE

MAXIMUM RATINGS (TA = 25C unless otherwise noted)


Symbol

Rating
DraintoSource Voltage

Value

Unit

VDSS

50

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

200
800

mA

Total Power Dissipation @ TA = 25C

PD

225

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

556

C/W

TL

260

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

DEVICE MARKING
BSS138LT1 = J1

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

BSS138LT1

8mm embossed tape

3000

BSS138LT3

13

8mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

418

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BSS138LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

50

Vdc

0.1
0.5

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 250 Adc)

Adc

Zero Gate Voltage Drain Current


(VDS = 25 Vdc, VGS = 0 Vdc)
(VDS = 50 Vdc, VGS = 0 Vdc)

IDSS

GateSource Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc)

IGSS

0.1

Adc

GateSource Threshold Voltage


(VDS = VGS, ID = 1.0 mAdc)

VGS(th)

0.5

1.5

Vdc

Static DraintoSource OnResistance


(VGS = 2.75 Vdc, ID < 200 mAdc, TA = 40C to +85C)
(VGS = 5.0 Vdc, ID = 200 mAdc)

rDS(on)

5.6

10
3.5

gfs

100

mmhos

(VDS = 25 Vdc, VGS = 0, f = 1 MHz)

Ciss

40

50

pF

Output Capacitance

(VDS = 25 Vdc, VGS = 0, f = 1 MHz)

Coss

12

25

Transfer Capacitance

(VDG = 25 Vdc, VGS = 0, f = 1 MHz)

Crss

3.5

5.0

td(on)

20

td(off)

20

ON CHARACTERISTICS(1)

Forward Transconductance
(VDS = 25 Vdc, ID = 200 mAdc, f = 1.0 kHz)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
TurnOff Delay Time

(VDD = 30 Vdc,
Vdc ID = 0.2
0 2 Adc,)
Adc )

ns

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

419

BSS138LT1
TYPICAL ELECTRICAL CHARACTERISTICS
0.8

0.9

VGS = 3.5 V

TJ = 25C

I D , DRAIN CURRENT (AMPS)

I D , DRAIN CURRENT (AMPS)

VGS = 3.25 V

0.6

VGS = 3.0 V

0.5

VGS = 2.75 V

0.4

VGS = 2.5 V

0.3
0.2

150C
0.6
0.5
0.4
0.3
0.2
0.1
0

10

0.5

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

1.5

2.5

3.5

4.5

VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 2. Transfer Characteristics

Figure 1. OnRegion Characteristics


2.2

1.25
ID = 1.0 mA

2
VGS = 10 V
ID = 0.8 A

1.8

Vgs(th) , VARIANCE (VOLTS)

RDS(on) , DRAINTOSOURCE RESISTANCE


(NORMALIZED)

25C
55C

0.7

0.1
0

VDS = 10 V

0.8

0.7

1.6
VGS = 4.5 V
ID = 0.5 A

1.4
1.2
1

1.125

0.875

0.8
5

45

95

145

0.75
55

30

20

45

70

95

120

TJ, JUNCTION TEMPERATURE (C)

TJ, JUNCTION TEMPERATURE (C)

Figure 3. OnResistance Variation with


Temperature

Figure 4. Threshold Voltage Variation


with Temperature

VGS, GATETOSOURCE VOLTAGE (VOLTS)

0.6
55

145

10
VDS = 40 V
TJ = 25C
8

4
ID = 200 mA
2

0
0

500

1000

1500

2000

2500

3000

QT, TOTAL GATE CHARGE (pC)

Figure 5. Gate Charge

420

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10
VGS = 2.5 V

9
8

150C
7
6
5

25C

4
55C

3
2
1
0.05

0.15

0.1

0.25

0.2

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

BSS138LT1
8
VGS = 2.75 V
7

150C

6
5
4
25C

3
2

55C

1
0

150C

5
4.5
4
3.5
3

25C

2.5
2

55C

1.5
1
0.1

0.15

0.2

0.25

0.3

0.35

0.4

0.45

0.5

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

VGS = 4.5 V

0.05

4.5
VGS = 10 V

150C

4
3.5
3
2.5

25C

2
55C

1.5
1
0

0.05

0.1

ID, DRAIN CURRENT (AMPS)

0.15

0.2

0.25

0.3

0.35

0.4

0.45

0.5

ID, DRAIN CURRENT (AMPS)

Figure 9. OnResistance versus Drain Current

Figure 8. OnResistance versus Drain Current

1
I D , DIODE CURRENT (AMPS)

0.25

Figure 7. OnResistance versus Drain Current

0.2

0.15

ID, DRAIN CURRENT (AMPS)

Figure 6. OnResistance versus Drain Current

5.5

0.1

0.05

ID, DRAIN CURRENT (AMPS)

120
100
TJ = 150C

0.1

25C

55C
80
60
Ciss

0.01

40
Coss

20
0.001

Crss
0

0.2

0.4

0.6

0.8

1.0

1.2

10

15

20

25

VSD, DIODE FORWARD VOLTAGE (VOLTS)

Figure 10. Body Diode Forward Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Figure 11. Capacitance

421

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF1N02LT1
Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energy
conserving traits.

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in space sensitive power management circuitry.
Typical applications are dcdc converters and power management in portable and batterypowered products such as
computers, printers, PCMCIA cards, cellular and cordless
telephones.

3 DRAIN
1
2

CASE 31808, Style 21


SOT23 (TO236AB)

1
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery


Life

2 SOURCE

Miniature SOT23 Surface Mount Package Saves Board


Space

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

750
2000

mA

Total Power Dissipation @ TA = 25C

PD

400

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

300

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
Device Marking: NZ

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF1N02LT1

8mm embossed tape

3000

MGSF1N02LT3

13

8mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

422

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF1N02LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 Adc)

Adc

Zero Gate Voltage Drain Current


(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 1.2 Adc)
(VGS = 4.5 Vdc, ID = 1.0 Adc)

rDS(on)

0.075
0.115

0.090
0.130

ON CHARACTERISTICS(1)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 Vdc)

Ciss

125

Output Capacitance

(VDS = 5.0 Vdc)

Coss

120

pF

Transfer Capacitance

(VDG = 5.0 Vdc)

Crss

45

td(on)

2.5

tr

1.0

td(off)

16

tf

8.0

QT

6000

pC

IS

0.6

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

0.8

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

((VDD = 15 Vdc, ID = 1.0 Adc,


RL = 50 )

Fall Time
Gate Charge (See Figure 6)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

TYPICAL ELECTRICAL CHARACTERISTICS


2.5

3
4V
I D , DRAIN CURRENT (AMPS)

I D , DRAIN CURRENT (AMPS)

VDS = 10 V
2
55C

1.5

TJ = 150C

0.5

1.5
2
2.5
3
VGS, GATETOSOURCE VOLTAGE (VOLTS)

3.25 V

3.5 V

2
VGS = 3.0 V
1.5
2.75 V

2.5 V

0.5

25C
0

2.5

2.25 V
3.5

Figure 1. Transfer Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 2. OnRegion Characteristics

423

0.2
150C
0.18
0.16

VGS = 4.5 V

0.14

25C

0.12
55C

0.1
0.08
0.06
0.04
0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

MGSF1N02LT1
0.14
0.13

150C

0.12
VGS = 10 V

0.11
0.1
0.09

25C

0.08
0.07

55C

0.06
0.05
0.04
0

0.2

0.4

0.6

VGS, GATETOSOURCE VOLTAGE (VOLTS)

RDS(on) , DRAINTOSOURCE RESISTANCE


(NORMALIZED)

1.6
VGS = 10 V
ID = 2 A

1.4
1.3

VGS = 4.5 V
ID = 1 A

1.2
1.1
1
0.9
0.8
0.7

1.2

1.6

1.4

1.8

10
VDS = 16 V
TJ = 25C
8

4
ID = 2.0 A

2
0

0.6
55

45

95

145

2000

1000

TJ, JUNCTION TEMPERATURE (C)

3000

4000

5000

6000

QT, TOTAL GATE CHARGE (pC)

Figure 6. Gate Charge

Figure 5. OnResistance Variation with Temperature

1000

TJ = 150C

0.1

25C

55C

C, CAPACITANCE (pF)

I D , DIODE CURRENT (AMPS)

Figure 4. OnResistance versus Drain Current

Figure 3. OnResistance versus Drain Current

1.5

0.8

ID, DRAIN CURRENT (AMPS)

ID, DRAIN CURRENT (AMPS)

0.01

VGS = 0 V
f = 1 MHz
TJ = 25C
Ciss
100
Coss
Crss

0.001
0

0.2

0.4

0.6

0.8

VSD, DIODE FORWARD VOLTAGE (VOLTS)

Figure 7. Body Diode Forward Voltage

424

10

10

15

20

VDS, DRAINTOSOURCE VOLTAGE (Volts)

Figure 8. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF1N03LT1
Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energy
conserving traits.

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in space sensitive power management circuitry.
Typical applications are dcdc converters and power management in portable and batterypowered products such as
computers, printers, PCMCIA cards, cellular and cordless
telephones.

3 DRAIN
1
2

CASE 31808, Style 21


SOT23 (TO236AB)
1
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery


Life

2 SOURCE

Miniature SOT23 Surface Mount Package Saves Board


Space

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

30

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

750
2000

mA

Total Power Dissipation @ TA = 25C

PD

400

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

300

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
Device Marking: N3

ORDERING INFORMATION
Reel Size

Tape Width

Quantity

MGSF1N03LT1

Device

8mm embossed tape

3000

MGSF1N03LT3

13

8mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 4

Motorola SmallSignal Transistors, FETs and Diodes Device Data

425

MGSF1N03LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

30

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 Adc)

Adc

Zero Gate Voltage Drain Current


(VDS = 30 Vdc, VGS = 0 Vdc)
(VDS = 30 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 1.2 Adc)
(VGS = 4.5 Vdc, ID = 1.0 Adc)

rDS(on)

0.08
0.125

0.10
0.145

ON CHARACTERISTICS(1)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 Vdc)

Ciss

140

Output Capacitance

(VDS = 5.0 Vdc)

Coss

100

pF

Transfer Capacitance

(VDG = 5.0 Vdc)

Crss

40

td(on)

2.5

tr

1.0

td(off)

16

tf

8.0

QT

6000

pC

IS

0.6

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

0.8

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time

((VDD = 15 Vdc, ID = 1.0 Adc,


RL = 50 )

TurnOff Delay Time


Fall Time
Gate Charge (See Figure 6)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

TYPICAL ELECTRICAL CHARACTERISTICS


2.5

2.5

VGS = 3.75 V
3.5 V

I D , DRAIN CURRENT (AMPS)

I D , DRAIN CURRENT (AMPS)

VDS = 10 V
2

1.5
55C

TJ = 150C
0.5

1.5

3.25 V

1
3.0 V
0.5

2.75 V

25C
0

1.5
2
2.5
3
VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 1. Transfer Characteristics

426

2.5 V
3.5

10

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 2. OnRegion Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.24
150C

0.19

VGS = 4.5 V
25C

0.14

55C
0.09

0.04
0

0.1

0.2

0.3

0.4

0.5

0.6

0.8

0.7

0.9

R DS(on) , DRAINTOSOURCE RESISTANCE (OHMS

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS

MGSF1N03LT1
0.16
150C

0.14
VGS = 10 V

0.12
0.1

25C

0.08
55C
0.06
0.04
0

0.2

0.4

ID, DRAIN CURRENT (AMPS)

VGS, GATETOSOURCE VOLTAGE (VOLTS)

RDS(on) , DRAINTOSOURCE RESISTANCE


(NORMALIZED)

VGS = 10 V
ID = 2 A

1.2

VGS = 4.5 V
ID = 1 A

1
0.8
0.6
0.4
0.2
0
55

1.2

1.4

1.6

1.8

10
VDS = 24 V
TJ = 25C
8

4
ID = 2.0 A

2
0

25

50

25

75

100

125

150

2000

1000

TJ, JUNCTION TEMPERATURE (C)

3000

4000

5000

6000

QT, TOTAL GATE CHARGE (pC)

Figure 6. Gate Charge

Figure 5. OnResistance Variation with Temperature

350
VGS = 0 V
f = 1 MHz
TJ = 25C

300
TJ = 150C

0.1

25C

55C

C, CAPACITANCE (pF)

I D , DIODE CURRENT (AMPS)

Figure 4. OnResistance versus Drain Current

1.8

1.4

0.8

ID, DRAIN CURRENT (AMPS)

Figure 3. OnResistance versus Drain Current

1.6

0.6

0.01

250
200
150

Ciss

100
Coss
50

0.001

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

VSD, DIODE FORWARD VOLTAGE (VOLTS)

Figure 7. Body Diode Forward Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Crss
0

12

16

20

VDS, DRAINTOSOURCE VOLTAGE (Volts)

Figure 8. Capacitance

427

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF1P02ELT1
Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energy
conserving traits.

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in space sensitive power management circuitry.
Typical applications are dcdc converters and power management in portable and batterypowered products such as
computers, printers, PCMCIA cards, cellular and cordless
telephones.
Low rDS(on) Provides Higher Efficiency and Extends Battery
Life

3 DRAIN
1
2

CASE 31808, Style 21


SOT23 (TO236AB)
1
GATE

Miniature SOT23 Surface Mount Package Saves Board Space

2 SOURCE

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

8.0

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

750
2000

mA

Rating
DraintoSource Voltage

Total Power Dissipation @ TA = 25C

PD

400

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

300

C/W

TL

260

Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
Device Marking: PC

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF1P02ELT1

8mm embossed tape

3000

MGSF1P02ELT3

13

8mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

428

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF1P02ELT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 250 Adc)

Adc

Zero Gate Voltage Drain Current


(VDS = 16 Vdc, VGS = 0 Vdc)
(VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 8.0 Vdc, VDS = 0 Vdc)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

0.7

0.85

1.2

Vdc

Static DraintoSource OnResistance


(VGS = 4.5 Vdc, ID = 0.75 Adc)
(VGS = 2.5 Vdc, ID = 0.5 Adc)

rDS(on)

0.20
0.32

0.26
0.50

ON CHARACTERISTICS(1)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 Vdc)

Ciss

130

Output Capacitance

(VDS = 5.0 Vdc)

Coss

120

pF

Transfer Capacitance

(VDG = 5.0 Vdc)

Crss

60

td(on)

2.5

tr

1.0

td(off)

16

tf

8.0

QT

6000

pC

IS

0.6

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

1.5

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

((VDD = 15 Vdc, ID = 1.0 Adc,


RL = 50 )

Fall Time
Gate Charge (See Figure 6)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

429

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF1P02LT1
Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energy
conserving traits.

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in space sensitive power management circuitry.
Typical applications are dcdc converters and power management in portable and batterypowered products such as
computers, printers, PCMCIA cards, cellular and cordless
telephones.
Low rDS(on) Provides Higher Efficiency and Extends Battery
Life

3 DRAIN
1
2

CASE 31808, Style 21


SOT23 (TO236AB)
1
GATE

Miniature SOT23 Surface Mount Package Saves Board Space

2 SOURCE

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

750
2000

mA

DraintoSource Voltage

Total Power Dissipation @ TA = 25C

PD

400

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

300

C/W

TL

260

Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
Device Marking: PC

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF1P02LT1

8mm embossed tape

3000

MGSF1P02LT3

13

8mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

430

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF1P02LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 Adc)

Adc

Zero Gate Voltage Drain Current


(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 1.5 Adc)
(VGS = 4.5 Vdc, ID = 0.75 Adc)

rDS(on)

0.235
0.375

0.350
0.500

ON CHARACTERISTICS(1)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 Vdc)

Ciss

130

Output Capacitance

(VDS = 5.0 Vdc)

Coss

120

pF

Transfer Capacitance

(VDG = 5.0 Vdc)

Crss

60

td(on)

2.5

tr

1.0

td(off)

16

tf

8.0

QT

6000

pC

IS

0.6

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

1.5

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time

((VDD = 15 Vdc, ID = 1.0 Adc,


RL = 50 )

TurnOff Delay Time


Fall Time
Gate Charge (See Figure 6)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

TYPICAL ELECTRICAL CHARACTERISTICS


1.5

1.5

VGS = 3.5 V

1.25

3.25 V

1.25

I D , DRAIN CURRENT (AMPS)

I D , DRAIN CURRENT (AMPS)

VDS = 10 V

1
3.0 V

0.75

0.75
55C

0.5

TJ = 150C

25C

0.25

2.75 V

0.5

2.5 V

0.25

2.25 V
0

1.5
2
2.5
3
VGS, GATETOSOURCE VOLTAGE (VOLTS)

3.5

Figure 1. Transfer Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 2. OnRegion Characteristics

431

0.55

150C
0.5

VGS = 4.5 V

0.45
25C
0.4
55C
0.35
0

0.1

0.3

0.2

0.5

0.4

0.6

0.7

0.8

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

MGSF1P02LT1
0.4
0.38
0.36
VGS = 10 V

0.34

150C

0.32
0.3
0.28

25C

0.26
0.24

55C

0.22
0.2
0

0.4

0.2

VGS, GATETOSOURCE VOLTAGE (VOLTS)

RDS(on) , DRAINTOSOURCE RESISTANCE


(NORMALIZED)

1.25
VGS = 10 V
ID = 1.5 A

1.15
1.1

VGS = 4.5 V
ID = .75 A

1.05
1
0.95
0.9
0.85

VDS = 16 V
TJ = 25C
8

4
ID = 1.5 A
2

45

95

145

2000

1000

4000

3000

5000

6000

QT, TOTAL GATE CHARGE (pC)

Figure 6. Gate Charge

Figure 5. OnResistance Variation with Temperature

1000

TJ = 150C

0.1

25C

55C

C, CAPACITANCE (pF)

I D , DIODE CURRENT (AMPS)

1.6

1.4

10

TJ, JUNCTION TEMPERATURE (C)

0.01

0.2

0.4

0.6

0.8

1.2

1.4

1.6

VSD, DIODE FORWARD VOLTAGE (VOLTS)

Figure 7. Body Diode Forward Voltage

432

1.2

0.8
55

0.001

Figure 4. OnResistance versus Drain Current

Figure 3. OnResistance versus Drain Current

1.2

0.8

0.6

ID, DRAIN CURRENT (AMPS)

ID, DRAIN CURRENT (AMPS)

1.8

VGS = 0 V
f = 1 MHz
TJ = 25C
Ciss
100

Coss
Crss

10

10

VDS, DRAINTOSOURCE VOLTAGE (Volts)

Figure 8. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3441VT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energy
conserving traits.

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 78 m (TYP)

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

1 2 5 6
DRAIN

Visit our Web Site at http://www.motsps.com/ospd

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

8.0

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

3.3
20

PD

2.0

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

128

C/W

TL

260

DraintoSource Voltage

Total Power Dissipation @ TA = 25C Mounted on FR4 t

 5 sec

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3441VT1

8 mm embossed tape

3000

MGSF3441VT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

433

MGSF3441VT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

20

1.0
4.0

100

0.45

0.078
0.110

0.090
0.135

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 8.0 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 4.5 Vdc, ID = 3.3 A)
(VGS = 2.5 Vdc, ID = 2.9 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

27

50

tr

17

30

td(off)

52

80

tf

45

70

QT

3000

pC

IS

1.0

Pulsed Current

ISM

20

Forward Voltage(2)

VSD

0.80

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 15 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

434

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3441VT1
TYPICAL ELECTRICAL CHARACTERISTICS
20
VGS = 4.5 V

20

4.0 V

TC = 55C

3.5 V

125C

16
3.0 V

ID , DRAIN CURRENT (A)

ID, DRAIN CURRENT (A)

16

12
2.5 V
8.0
2.0 V
4.0

25C
12

8.0

4.0
1.5 V
0

0
0

1.0

2.0

3.0

4.0

5.0

3.0

4.0

VGS, GATETOSOURCE VOLTAGE (V)

Figure 1. Output Characteristics

Figure 2. Transfer Characteristics

1400
1200

0.24
VGS = 2.5 V

C, CAPACITANCE (pF)

R DS(on) , ONRESISTANCE ( )

2.0

VDS, DRAINTOSOURCE VOLTAGE (V)

0.30

0.18

0.12

VGS = 4.5 V

1000
800
600

Ciss

400
Coss

0.06
200

Crss

0
0

4.0

8.0

12

16

12

8.0

16

VDS, DRAINTOSOURCE VOLTAGE (V)

Figure 3. OnResistance versus Drain Current

Figure 4. Capacitance

R DS(on) , ONRESISTANCE ( ) (NORMALIZED)

3.0

2.0

1.0
0
0

4.0

ID, DRAIN CURRENT (A)

VDS = 10 V
ID = 3.3 A

4.0

20

5.0
VGS , GATETOSOURCE VOLTAGE (V)

1.0

2.0

4.0

6.0

8.0

10

20

1.8
1.6

VGS = 4.5 V
ID = 3.3 A

1.4
1.2
1.0
0.8
0.6
50

25

25

50

75

100

125

Qg, TOTAL GATE CHARGE (nC)

TJ, JUNCTION TEMPERATURE (C)

Figure 5. Gate Charge

Figure 6. OnResistance versus Junction


Temperature

Motorola SmallSignal Transistors, FETs and Diodes Device Data

150

435

MGSF3441VT1
TYPICAL ELECTRICAL CHARACTERISTICS
20

0.30
ID = 3.3 A

R DS(on) , ONRESISTANCE ( )

IS , SOURCE CURRENT (A)

TJ = 150C
10
TJ = 25C

0.18

0.12

0.06
0

1.0
0.25

0.50

0.75

1.00

1.25

1.50

2.0

4.0

6.0

8.0

VSD, SOURCETODRAIN VOLTAGE (V)

VGS, GATETOSOURCE VOLTAGE (V)

Figure 7. SourceDrain Diode Forward Voltage

Figure 8. OnResistance versus


GatetoSource Voltage

0.4

20

0.3
V GS(th) , VARIANCE (V)

0.24

16

0.1

POWER (W)

0.2

ID = 250 A

12

8.0

0
4.0

0.1
0.2
50

0
25

25

50

75

100

125

150

0.01

0.1

1.0

10

TJ, TEMPERATURE (C)

TIME (sec)

Figure 9. Threshold Voltage

Figure 10. Single Pulse Power

NORMALIZED EFFECTIVE TRANSIENT


THERMAL IMPEDANCE

2.0
1.0
DUTY CYCLE = 0.5
0.2
0.1

NOTES:
PDM

0.1

1. DUTY CYCLE, D = t1/t2


2. PER UNIT BASE =
2. RthJA = 62.5C/W
3. TJM TA = PDMZthJA(t)
4. SURFACE MOUNTED

0.05
0.02

t1

SINGLE PULSE

t2

0.01
0.0001

0.001

0.01

0.1

1.0

10

30

SQUARE WAVE PULSE DURATION (sec)

Figure 11. Normalized Thermal Transient Impedance, JunctiontoAmbient

436

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3441XT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 78 m (TYP)

Part of the GreenLine Portfolio of devices with energy


conserving traits.

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

8.0

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

1.5
20

Total Power Dissipation @ TA = 25C

PD

950

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

132

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3441XT1

8 mm embossed tape

3000

MGSF3441XT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

437

MGSF3441XT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

20

1.0
4.0

100

0.45

0.078
0.110

0.100
0.135

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 8.0 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 4.5 Vdc, ID = 1.5 A)
(VGS = 2.5 Vdc, ID = 1.2 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

27

50

tr

17

30

td(off)

52

80

tf

45

70

QT

3000

pC

IS

1.0

Pulsed Current

ISM

20

Forward Voltage(2)

VSD

0.80

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 15 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

438

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3442VT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 58 m (TYP)

Part of the GreenLine Portfolio of devices with energy


conserving traits.

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

8.0

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

4.0
20

PD

2.0

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

62.5

C/W

TL

260

DraintoSource Voltage

Total Power Dissipation @ TA = 25C Mounted on FR4 t

 5 sec

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3442VT1

8 mm embossed tape

3000

MGSF3442VT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

439

MGSF3442VT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

20

1.0
5.0

100

0.6

0.058
0.072

0.070
0.095

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 8.0 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 4.5 Vdc, ID = 4.0 A)
(VGS = 2.5 Vdc, ID = 3.4 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

8.0

20

tr

24

40

td(off)

36

60

tf

10

20

QT

nC

IS

1.0

Pulsed Current

ISM

5.0

Forward Voltage(2)

VSD

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 10 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

440

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3442VT1
TYPICAL ELECTRICAL CHARACTERISTICS
20

TC = 55C

2.5 V
16
ID , DRAIN CURRENT (A)

ID, DRAIN CURRENT (A)

16

20

3.0 V

VGS = 4.5 V
4.0 V
3.5 V

12
2.0 V
8.0

4.0

125C

12

25C

8.0

4.0
1.5 V
0

0
0

1.0

3.0

2.0

4.0

5.0

2.0

2.5

VGS, GATETOSOURCE VOLTAGE (V)

Figure 1. Output Characteristics

Figure 2. Transfer Characteristics

3.0

1200

0.12

1000

VGS = 2.5 V
0.10
0.08

C, CAPACITANCE (pF)

R DS(on) , ONRESISTANCE ( )

1.5

1.0

VDS, DRAINTOSOURCE VOLTAGE (V)

0.14

VGS = 4.5 V

0.06
0.04

800
600

Ciss

400

Coss

200

0.02

Crss

0
0

4.0

8.0

12

16

20

16

Figure 3. OnResistance versus Drain Current

Figure 4. Capacitance

R DS(on) , ONRESISTANCE ( ) (NORMALIZED)

3.0

2.0

1.0
0
0

12

8.0

4.0

VDS, DRAINTOSOURCE VOLTAGE (V)

VDS = 10 V
ID = 4.0 A

4.0

ID, DRAIN CURRENT (A)

5.0
VGS , GATETOSOURCE VOLTAGE (V)

0.5

2.0

4.0

6.0

8.0

20

1.8
1.6

VGS = 4.5 V
ID = 4.0 A

1.4
1.2
1.0
0.8
0.6
50

25

25

50

75

100

125

Qg, TOTAL GATE CHARGE (nC)

TJ, JUNCTION TEMPERATURE (C)

Figure 5. Gate Charge

Figure 6. OnResistance versus Junction


Temperature

Motorola SmallSignal Transistors, FETs and Diodes Device Data

150

441

MGSF3442VT1
TYPICAL ELECTRICAL CHARACTERISTICS
20

0.20
TJ = 150C

ID = 4.0 A

R DS(on) , ONRESISTANCE ( )

IS , SOURCE CURRENT (A)

TJ = 25C
10

0.12

0.08

0.04
0

1.0
0.25

0.50

0.75

1.00

1.25

1.50

2.0

4.0

6.0

8.0

VSD, SOURCETODRAIN VOLTAGE (V)

VGS, GATETOSOURCE VOLTAGE (V)

Figure 7. SourceDrain Diode Forward Voltage

Figure 8. OnResistance versus


GatetoSource Voltage

0.2

20

0.1

16

POWER (W)

V GS(th) , VARIANCE (V)

0.16

ID = 250 A
0.1

12

8.0

0.2
4.0

0.3
0.4
50

0
25

25

50

75

100

125

150

0.01

0.1

1.0

10

TJ, TEMPERATURE (C)

TIME (sec)

Figure 9. Threshold Voltage

Figure 10. Single Pulse Power

NORMALIZED EFFECTIVE TRANSIENT


THERMAL IMPEDANCE

2.0
1.0
DUTY CYCLE = 0.5
0.2
0.1

NOTES:
PDM

0.1

1. DUTY CYCLE, D = t1/t2


2. PER UNIT BASE =
2. RthJA = 62.5C/W
3. TJM TA = PDMZthJA(t)
4. SURFACE MOUNTED

0.05
0.02

t1

SINGLE PULSE

t2

0.01
0.0001

0.001

0.01

0.1

1.0

10

30

SQUARE WAVE PULSE DURATION (sec)

Figure 11. Normalized Thermal Transient Impedance, JunctiontoAmbient

442

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3442XT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 58 m (TYP)

Part of the GreenLine Portfolio of devices with energy


conserving traits.

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

8.0

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

1.7
20

Total Power Dissipation @ TA = 25C

PD

400

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

300

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3442XT1

8 mm embossed tape

3000

MGSF3442XT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

443

MGSF3442XT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

20

1.0
5.0

100

0.6

0.058
0.072

0.070
0.095

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 8.0 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 4.5 Vdc, ID = 1.7 A)
(VGS = 2.5 Vdc, ID = 1.3 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

8.0

20

tr

24

40

td(off)

36

60

tf

10

20

QT

nC

IS

1.0

Pulsed Current

ISM

5.0

Forward Voltage(2)

VSD

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 10 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

444

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3454VT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 50 m (TYP)

Part of the GreenLine Portfolio of devices with energy


conserving traits.

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

30

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

4.2
20

PD

2.0

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

62.5

C/W

TL

260

DraintoSource Voltage

Total Power Dissipation @ TA = 25C Mounted on FR4 t

 5 sec

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3454VT1

8 mm embossed tape

3000

MGSF3454VT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

445

MGSF3454VT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

30

1.0
25

100

1.0

0.05
0.07

0.065
0.095

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 30 Vdc, VGS = 0 Vdc)
(VDS = 30 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 4.2 A)
(VGS = 4.5 Vdc, ID = 3.4 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

10

20

tr

15

30

td(off)

20

35

tf

10

20

QT

15

nC

IS

1.0

Pulsed Current

ISM

5.0

Forward Voltage(2)

VSD

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 10 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

446

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3454VT1
TYPICAL ELECTRICAL CHARACTERISTICS
20

20
VGS = 10, 9, 8, 7, 6V
16

I D , DRAIN CURRENT (A)

I D , DRAIN CURRENT (A)

TJ = 55C

5V

12
4V

25C

16

125C

12

4
3V
0

Figure 1. Output Characteristics

Figure 2. Transfer Characteristics

560
480

Ciss

C, CAPACITANCE (pF)

0.16

0.12
VGS = 4.5 V

0.08

VGS = 10 V

400
320
Coss

240
160

0.04

Crss

80
0

0
0

8
12
ID, DRAIN CURRENT (A)

16

20

12

18

24

30

VDS DRAINTOSOURCE VOLTAGE (V)

Figure 3. OnResistance vs. Drain Current

Figure 4. Capacitance

1.75

10
VDS = 15 V
ID = 4.2 A

RDS(on) , ONRESISTANCE (OHMS)


(NORMALIZED)

VGS, GATETOSOURCE VOLTAGE (V)

VGS, GATETOSOURCE VOLTAGE (V)

0.20
R DS(on) , ONRESISTANCE (OHMS)

VDS, DRAINTOSOURCE VOLTAGE (V)

2
0
0

1.5

3.0

4.5

6.0

7.5

9.0

Qg, TOTAL GATE CHARGE (nC)

Figure 5. Gate Charge

Motorola SmallSignal Transistors, FETs and Diodes Device Data

VGS = 10 V
ID = 4.2 A
1.50

1.25

1.00

0.75
50

25

0
25
50
75
100
TJ, JUNCTION TEMPERATURE (C)

125

150

Figure 6. OnResistance vs. Junction Temperature

447

MGSF3454VT1
TYPICAL ELECTRICAL CHARACTERISTICS
0.20

10

RDS(on) , ONRESISTANCE (OHMS)

I S , SOURCE CURRENT (A)

40

TJ = 150C
TJ = 25C

1
0

0.25

0.50

0.75

1.00

1.25

1.5

0.16

0.12

0.08

0.04

1.75

ID = 4.2 A

2
4
6
8
VGS GATETOSOURCE VOLTAGE (V)

VSD, SOURCETODRAIN VOLTAGE (V)

Figure 7. SourceDrain Diode Forward Voltage

Figure 8. OnResistance vs. GatetoSource Voltage

0.4

30

0.2

24

0.0

ID = 250 A

POWER (W)

V GS(th) , VARIANCE (V)

10

0.2

18

12

0.4
6

0.6
0.8
50

25

25

50

75

100

125

150

0
0.01

0.10

TJ, TEMPERATURE (C)

Figure 9. Threshold Voltage

1.00
TIME (sec)

10.00

Figure 10. Single Pulse Power

NORMALIZED EFFECTIVE
TRANSIENT THERMAL IMPEDANCE

2
1

Duty Cycle = 0.5

0.2
0.1

0.1

P(pk)

0.05
t1

0.02

0.01
1.0E04

t2
DUTY CYCLE, D = t1/t2

SINGLE PULSE
1.0E03

1.0E02

1.0E01

RJC(t) = r(t) RJC


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) TC = P(pk) RJC(t)
1.0E+00

1.0E+01

Square Wave Pulse Duration (sec)

Figure 11. Normalized Thermal Transient Impedance, JunctiontoAmbient

448

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3454XT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 50 m (TYP)

Part of the GreenLine Portfolio of devices with energy


conserving traits.

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

30

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

1.75
20

Total Power Dissipation @ TA = 25C

PD

950

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

250

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, for 10 seconds


Device Marking = 3G

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3454XT1

8 mm embossed tape

3000

MGSF3454XT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

449

MGSF3454XT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

30

1.0
25

100

1.0

0.05
0.07

0.065
0.095

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 30 Vdc, VGS = 0 Vdc)
(VDS = 30 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 1.75 A)
(VGS = 4.5 Vdc, ID = 1.5 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

345

Output Capacitance

(VDS = 5.0 V)

Coss

215

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

140

td(on)

10

tr

15

td(off)

20

tf

10

QT

15

nC

IS

1.0

Pulsed Current

ISM

5.0

Forward Voltage(2)

VSD

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time

( DD = 10 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

TurnOff Delay Time


Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

TYPICAL ELECTRICAL CHARACTERISTICS


7.0

0.12

R DS(on) , ONRESISTANCE ( )

VGS = 4.5 V
ID , DRAIN CURRENT (AMPS)

6.0
4.0 V

5.0
4.0

3.5 V
3.0
2.0

3.0 V

1.0

2.5 V
2.25 V

VGS = 10 V
0.08
25C
0.06
55C
0.04

0
0

450

TJ = 150C

0.10

1.0

2.0

3.0

4.0

5.0

6.0

7.0

8.0

0.02
9.0

10

1.0

2.0

3.0

4.0

5.0

6.0

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

ID, DRAIN CURRENT (AMPS)

Figure 1. Output Characteristics

Figure 2. OnResistance versus Drain Current

7.0

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3454XT1
TYPICAL ELECTRICAL CHARACTERISTICS
1000

0.14

TJ = 150C
C, CAPACITANCE (pF)

R DS(on) , ONRESISTANCE ( )

0.16

0.12
VGS = 4.5 V
0.10

25C

0.08
55C

Ciss
Coss
Crss

100

VGS = 0 V
f = 1.0 MHz
TJ = 25C

0.06
0.04

10
0.5

1.0

1.5

2.5

2.0

3.0

8.0

12

16

20

ID, DRAIN CURRENT (AMPS)

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 3. OnResistance versus Drain Current

Figure 4. Capacitance

10

24

1.4
VDS = 24 V
TJ = 25C
ID = 10 A

8.0

6.0

4.0

2.0
0
0

2.0

4.0

6.0

8.0

1.3
ID = 1.5 A
VGS = 4.5 V

1.2
1.1
1.0
0.9
0.8
0.7
0.6

10

5.0

55

45

95

145

QG, TOTAL GATE CHARGE (nC)

TJ, JUNCTION TEMPERATURE (C)

Figure 5. Gate Charge

Figure 6. OnResistance versus Junction


Temperature

1.6

10
ID = 6.4 A
VGS = 10 V

1.5
1.4

IS, SOURCE CURRENT (AMPS)

R DS(on) , ONRESISTANCE (NORMALIZED)

4.0

R DS(on) , ONRESISTANCE (NORMALIZED)

VGS , GATETOSOURCE VOLTAGE (VOLTS)

1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6

1.0

TJ = 150C

25C 55C

0.1

0.01

0.001
55

5.0

45

95

145

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

TJ, JUNCTION TEMPERATURE (C)

VSD, SOURCETODRAIN VOLTAGE (VOLTS)

Figure 7. OnResistance versus Junction


Temperature

Figure 8. SourceDrain Diode Forward Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

451

MGSF3454XT1
TYPICAL ELECTRICAL CHARACTERISTICS
2.0

R DS(on) , ONRESISTANCE ( )

0.5

1.8
0.4
V GS(th) (VOLTS)

1.6
0.3

0.2
ID = 1.75 A

ID = 250 mA

1.4
1.2
1.0

0.1
0.8
0

0.6
0

1.0

2.0

3.0

4.0

6.0

5.0

7.0

8.0

9.0

10

25

50

25

50

75

100

VGS, GATETOSOURCE VOLTAGE (VOLTS)

TJ, JUNCTION TEMPERATURE (C)

Figure 9. OnResistance versus


GatetoSource Voltage

Figure 10. Threshold Voltage

125

150

20

POWER (WATTS)

16

12

8.0

4.0
0
0.1

0.01

1.0

10

100

TIME (sec)

Figure 11. Single Pulse Power

1.0
NORMALIZED EFFECTIVE
TRANSIENT THERMAL IMPEDANCE

DUTY CYCLE = 0.5


0.2
0.1
0.1

P(pk)

0.05
0.02

t1

t2
DUTY CYCLE, D = t1/t2

0.01
SINGLE PULSE

RJA(t) = r(t) RJA


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) TA = P(pk) RJA(t)

0.01
0.0001

0.001

0.01

0.1

1.0

10

100

1.0 k

SQUARE WAVE PULSE DURATION (sec)

Figure 12. Normalized Thermal Transient Impedance, JunctiontoAmbient

452

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3455VT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 80 m (TYP)

Part of the GreenLine Portfolio of devices with energy


conserving traits.

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

30

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

3.5
20

PD

2.0

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

62.5

C/W

TL

260

DraintoSource Voltage

Total Power Dissipation @ TA = 25C Mounted on FR4 t

 5 sec

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3455VT1

8 mm embossed tape

3000

MGSF3455VT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

453

MGSF3455VT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

30

1.0
5.0

100

1.0

0.080
0.134

0.100
0.190

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 30 Vdc, VGS = 0 Vdc)
(VDS = 30 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 3.5 A)
(VGS = 4.5 Vdc, ID = 2.5 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

10

20

tr

15

30

td(off)

20

35

tf

10

20

QT

3000

pC

IS

1.0

Pulsed Current

ISM

5.0

Forward Voltage(2)

VSD

1.2

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 15 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

454

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MGSF3455VT1
TYPICAL ELECTRICAL CHARACTERISTICS
20

20

TJ = 55C

6V

16

I D , DRAIN CURRENT (A)

I D , DRAIN CURRENT (A)

VGS = 10, 9, 8, 7 V

5V
12

4V

25C

16

125C
12

4
3V
0

Figure 2. Transfer Characteristics

580
Ciss

500
C, CAPACITANCE (pF)

0.18
VGS = 4.5 V
0.12

VGS = 10 V

420
340
260

Coss

180

0.06

Crss

100
20
0

8
12
ID, DRAIN CURRENT (A)

16

20

12

18

24

30

VDS DRAINTOSOURCE VOLTAGE (V)

Figure 3. OnResistance vs. Drain Current

Figure 4. Capacitance

1.60

10
VDS = 15 V
ID = 3.5 A

RDS(on) , ONRESISTANCE (OHMS)


(NORMALIZED)

VGS, GATETOSOURCE VOLTAGE (V)

Figure 1. Output Characteristics

0.24

VGS, GATETOSOURCE VOLTAGE (V)

0.30
R DS(on) , ONRESISTANCE (OHMS)

VDS, DRAINTOSOURCE VOLTAGE (V)

2
0
0

1.5

3.0

4.5

6.0

Qg, TOTAL GATE CHARGE (nC)

Figure 5. Gate Charge

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.45

VGS = 10 V
ID = 3.5 A

1.30
1.15
1.00
0.85
0.7
50

25

0
25
50
75
100
TJ, JUNCTION TEMPERATURE (C)

125

150

Figure 6. OnResistance vs. Junction Temperature

455

MGSF3455VT1
TYPICAL ELECTRICAL CHARACTERISTICS
0.40
RDS(on) , ONRESISTANCE (OHMS)

I S , SOURCE CURRENT (A)

20

10
TJ = 150C

TJ = 25C

0.32

0.24

0.16

0.08
0

1
0

0.25

0.50

0.75

1.00

1.25

1.5

ID = 3.5 A

1.75

Figure 7. SourceDrain Diode Forward Voltage

10

Figure 8. OnResistance vs. GatetoSource Voltage

0.60

30

0.45

24
ID = 250 A

0.30

POWER (W)

V GS(th) , VARIANCE (V)

VGS GATETOSOURCE VOLTAGE (V)

VSD, SOURCETODRAIN VOLTAGE (V)

0.15

18

12

0.0
6

0.15
0.3
50

25

25
50
75
100
TJ, TEMPERATURE (C)

125

150

0
0.01

0.10

1.00

10.00

TIME (sec)

Figure 9. Threshold Voltage

Figure 10. Single Pulse Power

NORMALIZED EFFECTIVE
TRANSIENT THERMAL IMPEDANCE

2
1

Duty Cycle = 0.5

0.2
0.1

0.1

P(pk)

0.05
t1

0.02

0.01
1.0E04

t2
DUTY CYCLE, D = t1/t2

SINGLE PULSE
1.0E03

1.0E02

1.0E01

RJC(t) = r(t) RJC


D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) TC = P(pk) RJC(t)
1.0E+00

1.0E+01

Square Wave Pulse Duration (sec)

Figure 11. Normalized Thermal Transient Impedance, JunctiontoAmbient

456

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MGSF3455XT1

Preliminary Information

Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 80 m (TYP)

Part of the GreenLine Portfolio of devices with energy


conserving traits.

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

1 2 5 6
DRAIN

CASE 318G02, Style 1


TSOP 6 PLASTIC

3
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery Life


Miniature TSOP 6 Surface Mount Package Saves Board Space

SOURCE
4

Visit our Web Site at http://www.motsps.com/ospd

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

30

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Pulsed Drain Current (tp 10 s)

ID
IDM

1.45
10

Total Power Dissipation @ TA = 25C

PD

400

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

300

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MGSF3455XT1

8 mm embossed tape

3000

MGSF3455XT3

13

8 mm embossed tape

10,000

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

457

MGSF3455XT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

30

1.0
5.0

100

1.0

0.080
0.134

0.100
0.190

Unit

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

V(BR)DSS

Zero Gate Voltage Drain Current


(VDS = 30 Vdc, VGS = 0 Vdc)
(VDS = 30 Vdc, VGS = 0 Vdc, TJ = 70C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

Vdc
Adc

nAdc

ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)

VGS(th)

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 1.45 A)
(VGS = 4.5 Vdc, ID = 1.2 A)

rDS(on)

Vdc
Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

90

Output Capacitance

(VDS = 5.0 V)

Coss

50

pF

Transfer Capacitance

(VDG = 5.0 V)

Crss

10

td(on)

10

20

tr

15

30

td(off)

20

35

tf

10

20

QT

3000

pC

IS

1.0

Pulsed Current

ISM

5.0

Forward Voltage(2)

VSD

0.85

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

( DD = 15 Vdc, ID = 1.0 A,
(V
VGEN = 10 V, RL = 10 )

Fall Time
Gate Charge

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

458

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS FET Transistor

MMBF170LT1

DRAIN
3

NChannel

1
GATE
3

2
SOURCE
1

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

DrainSource Voltage

VDSS

60

Vdc

DrainGate Voltage

VDGS

60

Vdc

GateSource Voltage
Continuous
Nonrepetitive (tp 50 ms)

VGS
VGSM

20
40

Vdc
Vpk

ID
IDM

0.5
0.8

Adc

Symbol

Max

Unit

PD

225

mW

1.8

mW/C

R JA

556

C/W

TJ, Tstg

55 to +150

Drain Current Continuous


Pulsed

CASE 318 08, STYLE 21


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR 5 Board(1)
TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBF170LT1 = 6Z

ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)DSS

60

Vdc

IGSS

10

nAdc

Gate Threshold Voltage (VDS = VGS, ID = 1.0 mA)

VGS(th)

0.8

3.0

Vdc

Static DrainSource OnResistance (VGS = 10 Vdc, ID = 200 mA)

rDS(on)

5.0

ID(off)

0.5

W
mA

Ciss

60

pF

td(on)

10

ns

td(off)

10

OFF CHARACTERISTICS

DrainSource Breakdown Voltage (VGS = 0, ID = 100 A)


GateBody Leakage Current, Forward (VGSF = 15 Vdc, VDS = 0)

ON CHARACTERISTICS (2)

OnState Drain Current (VDS = 25 Vdc, VGS = 0)

DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 10 Vdc, VGS = 0 V, f = 1.0 MHz)

SWITCHING CHARACTERISTICS (2)


TurnOn Delay Time
TurnOff Delay Time

((VDD = 25 Vdc, ID = 500 mA, Rgen = 50


Figure 1

1. FR 5 = 1.0
0.75 0.062 in.
2. Pulse Test: Pulse Width
300 s, Duty Cycle

W)

v 2.0%.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

459

MMBF170LT1
+25 V

125
PULSE
GENERATOR
50

Vin

ton
td(on)

W
W

20 dB 50
ATTENUATOR

40 pF

TO SAMPLING
SCOPE
50 INPUT
Vout

OUTPUT
INVERTED
Vout

tr
90%

td(off)
90%

10%

INPUT

90%
50%

50%
50

Vin

1M

toff
tf

10%
PULSE WIDTH

(Vin AMPLITUDE 10 VOLTS)

Figure 1. Switching Test Circuit

Figure 2. Switching Waveform

2.0

1.0
VDS = 10 V

TA = 25C

1.6

VGS = 10 V

1.4

9V

1.2

I D, DRAIN CURRENT (AMPS)

I D, DRAIN CURRENT (AMPS)

1.8

8V

1.0
7V

0.8

6V

0.6
0.4

5V

0.2

4V
3V

1.0

2.0 3.0 4.0 5.0


6.0
7.0 8.0
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

9.0

0.8

125C

0.6

0.4

0.2

10

2.4
2.2

1.8

VGS = 10 V
ID = 200 mA

1.6
1.4
1.2
1.0
0.8
0.6
0.4
60

20

+ 20
+ 60
T, TEMPERATURE (C)

+ 100

Figure 5. Temperature versus Static


DrainSource OnResistance

460

1.0

2.0 3.0 4.0


5.0
6.0
7.0 8.0
VGS, GATE SOURCE VOLTAGE (VOLTS)

9.0

10

Figure 4. Transfer Characteristics

VGS(th) , THRESHOLD VOLTAGE (NORMALIZED)

r DS(on) , STATIC DRAINSOURCE ONRESISTANCE


(NORMALIZED)

Figure 3. Ohmic Region

2.0

25C

55C

+ 140

1.2
1.05
VDS = VGS
ID = 1.0 mA

1.1
1.10
1.0
0.95
0.9
0.85
0.8
0.75
0.7
60

20

+ 20
+ 60
T, TEMPERATURE (C)

+ 100

+ 140

Figure 6. Temperature versus Gate


Threshold Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energyconserving traits.

These miniature surface mount MOSFETs utilize Motorolas


High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

MMBF0201NLT1
Motorola Preferred Device

NCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 1.0 OHM

3 DRAIN
3
1
2

1
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery


Life
Miniature SOT23 Surface Mount Package Saves Board Space

CASE 31808, Style 21


SOT23 (TO236AB)
2 SOURCE

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

DraintoSource Voltage

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Continuous @ TA = 70C
Drain Current Pulsed Drain Current (tp 10 s)
Total Power Dissipation @ TA = 25C(1)

ID
ID
IDM

300
240
750

mAdc

PD

225

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

556

C/W

TL

260

Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds

DEVICE MARKING
N1
(1) Mounted on G10/FR4 glass epoxy board using minimum recommended footprint.

ORDERING INFORMATION
Reel Size

Tape Width

Quantity

MMBF0201NLT1

Device

12 mm embossed tape

3000

MMBF0201NLT3

13

12 mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

461

MMBF0201NLT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

Adc

Zero Gate Voltage Drain Current


(VDS = 16 Vdc, VGS = 0 Vdc)
(VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 300 mAdc)
(VGS = 4.5 Vdc, ID = 100 mAdc)

rDS(on)

0.75
1.0

1.0
1.4

gFS

450

mMhos

pF

ON CHARACTERISTICS(1)

Forward Transconductance (VDS = 10 Vdc, ID = 200 mAdc)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

45

Output Capacitance

(VDS = 5.0 V)

Coss

25

Transfer Capacitance

(VDG = 5.0 V)

Crss

5.0

td(on)

2.5

tr

2.5

td(off)

15

tf

0.8

QT

1400

pC

IS

0.3

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

0.85

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

((VDD = 15 Vdc, ID = 300 mAdc,


RL = 50 )

Fall Time
Gate Charge (See Figure 5)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

462

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF0201NLT1
TYPICAL ELECTRICAL CHARACTERISTICS

1.0

1.0
I D , DRAIN CURRENT (AMPS)

0.8

0.6

0.4

125C

0.2

55C

25C

ONRESISTANCE (OHMS)

VGS = 4 V

0.6

VGS = 10, 9, 8, 7, 6 V

0.4

0.2

VGS = 3 V

0.3

0.9

Figure 1. Transfer Characteristics

Figure 2. OnRegion Characteristics

1.2

0.9

VGS = 4.5 V

0.6
VGS = 10 V

0
0.2

0.4
0.6
ID, DRAIN CURRENT (AMPS)

0.8

2.0

1.5

1.0

0.5

5
10
15
VGS, GATETOSOURCE VOLTAGE (VOLTS)

1.10

14

1.05
ID = 250 A

VGS(th) , NORMALIZED

1.00
VDS = 16 V
ID = 300 mA

10
8
6
4

20

Figure 4. OnResistance versus


GatetoSource Voltage

16

12

1.4

2.4

Figure 3. OnResistance versus Drain Current

0.95
0.90
0.85
0.80
0.75
0.70

2
0
0

1.2

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

0.3

VGS, GATETOSOURCE VOLTAGE (VOLTS)

0.6

VGS, GATETOSOURCE VOLTAGE (VOLTS)

1.5

0.8

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

I D , DRAIN CURRENT (AMPS)

VGS = 5 V

0.65
160

450

2000

3400

0.60
25

25

50

75

100

125

Qg, TOTAL GATE CHARGE (pC)

TEMPERATURE (C)

Figure 5. Gate Charge

Figure 6. Threshold Voltage Variance


Over Temperature

Motorola SmallSignal Transistors, FETs and Diodes Device Data

150

463

MMBF0201NLT1
TYPICAL ELECTRICAL CHARACTERISTICS

100

1.6

VGS = 10 V @ 300 mA

80
C, CAPACITANCE (pF)

RDS(on) , NORMALIZED (OHMS)

1.8

1.4
1.2

VGS = 4.5 V @ 100 mA

1.0

60
Ciss

40

Coss

20

0.8

Crss
0.6
50

25

25

50

75

100

125

150

10

15

TJ, JUNCTION TEMPERATURE (C)

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 7. OnResistance versus


Junction Temperature

Figure 8. Capacitance

20

SOURCE CURRENT (AMPS)

10

1.0

0.1
125C

25C

55C

0.01

0.001

0.3
0.6
0.9
1.2
SOURCETODRAIN FORWARD VOLTAGE (VOLTS)

1.4

Figure 9. SourcetoDrain Forward Voltage


versus Continuous Current (IS)

464

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energyconserving traits.
These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

MMBF0202PLT1
Motorola Preferred Device

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 1.4 OHM

3 DRAIN
3
1
2

1
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery


Life

Miniature SOT23 Surface Mount Package Saves Board Space

CASE 31808, Style 21


SOT23 (TO236AB)
2 SOURCE

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Continuous @ TA = 70C
Drain Current Pulsed Drain Current (tp 10 s)
Total Power Dissipation @ TA = 25C(1)

ID
ID
IDM

300
240
750

mAdc

PD

225

mW

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

625

C/W

TL

260

Rating
DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds

DEVICE MARKING
P3
(1) Mounted on G10/FR4 glass epoxy board using minimum recommended footprint.

ORDERING INFORMATION
Reel Size

Tape Width

Quantity

MMBF0202PLT1

Device

12 mm embossed tape

3000

MMBF0202PLT3

13

12 mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

(Replaces MMBF0202P/D)
Motorola SmallSignal Transistors, FETs and Diodes Device Data

465

MMBF0202PLT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

Adc

Zero Gate Voltage Drain Current


(VDS = 16 Vdc, VGS = 0 Vdc)
(VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 200 mAdc)
(VGS = 4.5 Vdc, ID = 50 mAdc)

rDS(on)

0.9
2.0

1.4
3.5

gFS

600

mMhos

pF

ON CHARACTERISTICS(1)

Forward Transconductance (VDS = 10 Vdc, ID = 200 mAdc)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

50

Output Capacitance

(VDS = 5.0 V)

Coss

45

Transfer Capacitance

(VDG = 5.0 V)

Crss

20

td(on)

2.5

tr

1.0

td(off)

16

tf

8.0

QT

2700

pC

IS

0.3

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

1.5

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

(VDD = 15 Vdc,
RL = 75 ,
ID = 200 mAdc,
mAdc
VGEN = 10 V, RG = 6.0 )

Fall Time
Gate Charge (See Figure 5)

(VDS = 16 V, VGS = 10 V,
ID = 200 mA)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

466

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF0202PLT1
TYPICAL ELECTRICAL CHARACTERISTICS

1.0

1.0
5V

0.8

I D , DRAIN CURRENT (AMPS)

25C
125C

0.6

0.4

0.2

ONRESISTANCE (OHMS)

0.6

0.4
3V
0.2

Figure 2. OnRegion Characteristics

2
VGS = 4.5 V
1
VGS = 10 V
0
100

200
300
ID, DRAIN CURRENT (AMPS)

500

400

4
200 mA
3

2
50 mA
1

0
0

5
10
15
VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 3. OnResistance versus Drain Current

20

Figure 4. OnResistance versus


GatetoSource Voltage

16

1.20
1.15

14
ID = 200 mA
VGS(th) , NORMALIZED

VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 1. Transfer Characteristics

2160

10
8

VDS = 10 V
VDS = 16 V

6
590
4

ID = 250 A

1.10
1.05
1.00
0.95
0.90
0.85

2
0
0

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

12

4V

VGS, GATETOSOURCE VOLTAGE (VOLTS)

VGS = 10, 9, 8, 7, 6 V

0.8

RDS(on) , DRAINTOSOURCE RESISTANCE (OHMS)

I D , DRAIN CURRENT (AMPS)

TC = 55C

230

690

2270

3500

Qg, TOTAL GATE CHARGE (pC)

Figure 5. Gate Charge

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.80
50

25

50
75
25
TEMPERATURE (C)

100

125

150

Figure 6. Threshold Voltage Variance


Over Temperature

467

MMBF0202PLT1
TYPICAL ELECTRICAL CHARACTERISTICS

1.30

140
120
VGS = 4.5 V @ 50 mA
C, CAPACITANCE (pF)

RDS(on) , NORMALIZED (OHMS)

1.25
1.20
1.15
1.10
1.05

VGS = 10 V @ 200 mA

1.00
0.95

100
80
60
Ciss

40

Coss

0.90
20

0.85
0.80
50

Crss

0
25

25

50

75

100

125

150

10

15

TJ, JUNCTION TEMPERATURE (C)

VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 7. OnResistance versus


Junction Temperature

Figure 8. Capacitance

20

SOURCE CURRENT (AMPS)

10

1.0
TJ = 150C

55C

0.1
25C
0.01

0.001
0

3
4
1
2
SOURCETODRAIN FORWARD VOLTAGE (VOLTS)

4.5

Figure 9. SourcetoDrain Forward Voltage


versus Continuous Current (IS)

468

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBF2201NT1
Motorola Preferred Device

Low rDS(on) Small-Signal MOSFETs


TMOS Single N-Channel
Field Effect Transistors

Part of the GreenLine Portfolio of devices with energyconserving traits.


These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.

N CHANNEL
ENHANCEMENT MODE
TMOS MOSFET
rDS(on) = 1.0 OHM

3 DRAIN

CASE 41902, Style 7


SC70/SOT323

1
GATE

Low rDS(on) Provides Higher Efficiency and Extends Battery


Life

2 SOURCE

Miniature SC70 / SOT 323 Surface Mount Package Saves


Board Space

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Continuous @ TA = 70C
Drain Current Pulsed Drain Current (tp 10 s)

ID
ID
IDM

300
240
750

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

150
1.2

mW
mW/C

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

833

C/W

TL

260

DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

DEVICE MARKING
N1
(1) Mounted on G10/FR4 glass epoxy board using minimum recommended footprint.

ORDERING INFORMATION
Device

Reel Size

Tape Width

Quantity

MMBF2201NT1

8 mm embossed tape

3000

MMBF2201NT3

13

8 mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

469

MMBF2201NT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

Adc

Zero Gate Voltage Drain Current


(VDS = 16 Vdc, VGS = 0 Vdc)
(VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 300 mAdc)
(VGS = 4.5 Vdc, ID = 100 mAdc)

rDS(on)

0.75
1.0

1.0
1.4

gFS

450

mMhos

pF

ON CHARACTERISTICS(1)

Forward Transconductance (VDS = 10 Vdc, ID = 200 mAdc)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

45

Output Capacitance

(VDS = 5.0 V)

Coss

25

Transfer Capacitance

(VDG = 5.0 V)

Crss

5.0

td(on)

2.5

tr

2.5

td(off)

15

tf

0.8

QT

1400

pC

IS

0.3

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

0.85

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

((VDD = 15 Vdc, ID = 300 mAdc,


RL = 50 )

Fall Time
Gate Charge (See Figure 5)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

TYPICAL CHARACTERISTICS
1.6

1.0

1.4

VGS = 4 V

0.8

RDS , ON RESISTANCE (OHMS)

ID , DRAIN CURRENT (AMPS)

0.9

0.7
0.6
VGS = 3.5 V

0.5
0.4

VGS = 3 V

0.3
0.2

VGS = 2.5 V

0.1
1

4
7
8
2
3
5
6
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

Figure 1. Typical Drain Characteristics

470

VGS = 4.5 V
1.0
ID = 100 mA
0.8

VGS = 10 V

0.6

ID = 300 mA

0.4
0.2

0
0

1.2

10

0
60 40 20

20 40 60 80
TEMPERATURE (C)

100 120 140 160

Figure 2. On Resistance versus Temperature

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF2201NT1
TYPICAL CHARACTERISTICS
1.2
RDS , ON RESISTANCE (OHMS)

RDS , ON RESISTANCE (OHMS)

10

ID = 300 mA

VGS = 4.5 V

1.0
0.8
0.6

VGS = 10 V

0.4
0.2
0

0
0

3
4
5
6
7
8
GATE SOURCE VOLTAGE (VOLTS)

10

Figure 3. On Resistance versus Gate Source


Voltage

0.1

0.2

0.5
0.3
0.4
0.6
ID, DRAIN CURRENT (AMPS)

0.8

Figure 4. On Resistance versus Drain Current

45

1.0

VGS = 0 V
F = 1 mHz

40
35
C, CAPACITANCE (pF)

I S , SOURCE CURRENT (AMPS)

0.7

0.1

0.01

30
25
20

Ciss

15
Coss

10

Crss

5
0

0.001
0

0.1
0.2 0.3 0.4
0.5 0.6
0.7 0.8 0.9
VSD, SOURCE DRAIN FORWARD VOLTAGE (VOLTS)

1.0

4
8
12
16
6
10
14
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

Figure 5. Source Drain Forward Voltage

18

20

Figure 6. Capacitance Variation

1.0

I D , DRAIN CURRENT (AMPS)

0.9
0.8
55

0.7

25
150

0.6
0.5
0.4
0.3
0.2
0.1
0
0

0.5

1.0
1.5
2.0
2.5
3.0
3.5
VGS, GATE SOURCE VOLTAGE (VOLTS)

4.0

4.5

Figure 7. Transfer Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

471

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBF2202PT1

Low rDS(on) Small-Signal MOSFETs


TMOS Single P-Channel
Field Effect Transistors
Part of the GreenLine Portfolio of devices with energyconserving traits.
These miniature surface mount MOSFETs utilize Motorolas
High Cell Density, HDTMOS process. Low rDS(on) assures
minimal power loss and conserves energy, making this device
ideal for use in small power management circuitry. Typical
applications are dcdc converters, power management in
portable and batterypowered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.
Low rDS(on) Provides Higher Efficiency and Extends Battery
Life

Motorola Preferred Device

PCHANNEL
ENHANCEMENTMODE
TMOS MOSFET
rDS(on) = 2.2 OHM

3 DRAIN

1
GATE

Miniature SC70/SOT323 Surface Mount Package Saves


Board Space

CASE 41902, STYLE 7


SC70/SOT323

2 SOURCE

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)


Symbol

Value

Unit

VDSS

20

Vdc

GatetoSource Voltage Continuous

VGS

20

Vdc

Drain Current Continuous @ TA = 25C


Drain Current Continuous @ TA = 70C
Drain Current Pulsed Drain Current (tp 10 s)

ID
ID
IDM

300
240
750

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

150
1.2

mW
mW/C

Operating and Storage Temperature Range

TJ, Tstg

55 to 150

Thermal Resistance JunctiontoAmbient

RJA

833

C/W

TL

260

Rating
DraintoSource Voltage

Maximum Lead Temperature for Soldering Purposes, for 10 seconds

DEVICE MARKING
P3
(1) Mounted on G10/FR4 glass epoxy board using minimum recommended footprint.

ORDERING INFORMATION
Reel Size

Tape Width

Quantity

MMBF2202PT1

Device

8 mm embossed tape

3000

MMBF2202PT3

13

8 mm embossed tape

10,000

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

472

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF2202PT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

20

Vdc

1.0
10

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0 Vdc, ID = 10 A)

Adc

Zero Gate Voltage Drain Current


(VDS = 16 Vdc, VGS = 0 Vdc)
(VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C)

IDSS

GateBody Leakage Current (VGS = 20 Vdc, VDS = 0)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 250 Adc)

VGS(th)

1.0

1.7

2.4

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 200 mAdc)
(VGS = 4.5 Vdc, ID = 50 mAdc)

rDS(on)

1.5
2.0

2.2
3.5

gFS

600

mMhos

pF

ON CHARACTERISTICS(1)

Forward Transconductance (VDS = 10 Vdc, ID = 200 mAdc)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance

(VDS = 5.0 V)

Ciss

50

Output Capacitance

(VDS = 5.0 V)

Coss

45

Transfer Capacitance

(VDG = 5.0 V)

Crss

20

td(on)

2.5

tr

1.0

td(off)

16

tf

8.0

QT

2700

pC

IS

0.3

Pulsed Current

ISM

0.75

Forward Voltage(2)

VSD

1.5

SWITCHING CHARACTERISTICS(2)
TurnOn Delay Time
Rise Time
TurnOff Delay Time

(VDD = 15 Vdc,
RL = 75 ,
ID = 200 mAdc,
mAdc
VGEN = 10 V, RG = 6.0 )

Fall Time
Gate Charge (See Figure 5)

(VDS = 16 V, VGS = 10 V,
ID = 200 mA)

ns

SOURCEDRAIN DIODE CHARACTERISTICS


Continuous Current

(1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%.


(2) Switching characteristics are independent of operating junction temperature.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

473

MMBF2202PT1
TYPICAL CHARACTERISTICS

4.0

rDS(on) , ON RESISTANCE (OHMS)

rDS(on) , ON RESISTANCE (OHMS)

10

ID = 200 mA

10

3.5

VGS = 4.5 V
ID = 50 mA

3.0
2.5
2.0

VGS = 10 V
ID = 200 mA

1.5
1.0
0.5
0

40

20

20

40

60

80

100 120

140

VGS, GATESOURCE VOLTAGE (VOLTS)

TEMPERATURE (C)

Figure 1. On Resistance versus GateSource Voltage

Figure 2. On Resistance versus Temperature

474

160

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF2202PT1
1.0
0.9
5
4

I D, DRAIN CURRENT (AMPS)

rDS(on) , ON RESISTANCE (OHMS)

VGS = 4.5 V

3
VGS = 10 V

2
1

0.8
0.7
55

0.6
0.5

150

25

0.4
0.3
0.2
0.1

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.5

1.0

1.5

2.0 2.5

3.0

3.5 4.0

Figure 3. On Resistance versus Drain Current

Figure 4. Transfer Characteristics

5.5

6.0

10

ID(on), DRAIN CURRENT (AMPS)

0.8

25
0.1
150

0.01

VGS = 5 V

0.7
0.6

VGS = 4.5 V

0.5
VGS = 4 V

0.4
0.3

VGS = 3.5 V
0.2
VGS = 3 V

0.1
0.001

4.5 5.0

VGS, GATESOURCE VOLTAGE (VOLTS)

1
IS , SOURCE CURRENT (AMPS)

ID, DRAIN CURRENT (AMPS)

0.5

1.0

1.5

2.0

2.5

VSD, SOURCEDRAIN FORWARD VOLTAGE (VOLTS)

VDS, DRAINSOURCE VOLTAGE (VOLTS)

Figure 5. SourceDrain Forward Voltage

Figure 6. On Region Characteristics

50
45

VGS = 0 V
f = 1 MHz

C, CAPACITANCE (pF)

40
35
30
25
20

Ciss

15
Coss

10
5
0

Crss
0

10

12

14

16

18

20

VDS, DRAINSOURCE VOLTAGE (VOLTS)

Figure 7. Capacitance Variation

Motorola SmallSignal Transistors, FETs and Diodes Device Data

475

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMFT107T1

Medium Power Field Effect


Transistor

Motorola Preferred Device

NChannel EnhancementMode
Silicon Gate TMOS
SOT223 for Surface Mount

This TMOS medium power field effect transistor is designed for


high speed, low loss power switching applications such as
switching regulators, dcdc converters, solenoid and relay drivers.
The device is housed in the SOT223 package which is designed
for medium power surface mount applications.
Silicon Gate for Fast Switching Speeds

MEDIUM POWER
TMOS FET
250 mA, 200 VOLTS
RDS(on) = 14 OHM MAX

RDS(on) = 14 Ohm Max


2,4 DRAIN

Low Drive Requirement

2
3

The SOT223 Package can be soldered using wave or reflow.


The formed leads absorb thermal stress during soldering
eliminating the possibility of damage to the die.
Available in 12 mm Tape and Reel
Use MMFT107T1 to order the 7 inch/1000 unit reel
Use MMFT107T3 to order the 13 inch/4000 unit reel

CASE 318E04, STYLE 3


TO261AA
1
GATE
3 SOURCE

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Rating
DraintoSource Voltage

Symbol

Value

Unit

VDSS

200

Volts

VGS

20

Volts

Drain Current

ID

250

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

0.8
6.4

Watts
mW/C

TJ, Tstg

65 to 150

RJA

156

C/W

TL

260
10

C
Sec

GatetoSource Voltage NonRepetitive

Operating and Storage Temperature Range

DEVICE MARKING
FT107

THERMAL CHARACTERISTICS
Thermal Resistance JunctiontoAmbient
Maximum Temperature for Soldering Purposes
Time in Solder Bath

1. Device mounted on FR4 glass epoxy printed circuit using minimum recommended footprint.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

476

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMFT107T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

200

Vdc

Zero Gate Voltage Drain Current


(VDS = 130 V, VGS = 0)

IDSS

30

nAdc

GateBody Leakage Current Reverse


(VGS = 15 Vdc, VDS = 0)

IGSS

10

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mAdc)

VGS(th)

1.0

3.0

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 200 mA)

RDS(on)

14

Ohms

DraintoSource OnVoltage
(VGS = 10 V, ID = 200 mA)

VDS(on)

2.8

Vdc

Forward Transconductance
(VDS = 25 V, ID = 250 mA)

gfs

300

mmhos

Ciss

60

pF

Coss

30

Crss

6.0

VF

0.8

IS

250

mA

ISM

500

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0, ID = 10 A)

ON CHARACTERISTICS(1)

DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance

(VDS = 25 V
V, VGS = 0,
0
f = 1.0 MHz)

Transfer Capacitance

SOURCE DRAIN DIODE CHARACTERISTICS


Diode Forward Voltage
Continuous Source Current, Body
Diode

(VGS = 0,
IS = 250 mA)

Pulsed Source Current, Body Diode


1. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

TYPICAL ELECTRICAL CHARACTERISTICS


2.5

500

1.5

VDS = 10 V
VGS = 10 V

I D, DRAIN CURRENT (mA)

I D, DRAIN CURRENT (AMPS)

TJ = 25C

5V

6V
4V

1
3V

0.5

4
6
8
VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

300

200

100

0
0

400

10

Figure 1. OnRegion Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

TJ = 125C

25C
55C

2
3
4
VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 2. Transfer Characteristics

477

MMFT107T1

RDS(on) , DRAINSOURCE RESISTANCE (NORMALIZED)

RDS(on) , DRAINSOURCE RESISTANCE (OHMS)

TYPICAL ELECTRICAL CHARACTERISTICS

10
VGS = 10 V
8
TJ = 125C

4
25C
2
55C
0

100

200
300
ID, DRAIN CURRENT (AMPS)

400

500

Figure 3. OnResistance versus Drain Current

ID = 1 A
VGS = 10 V

0.1
75

50

25
0
25
50
75
100
TJ, JUNCTION TEMPERATURE (C)

125

150

Figure 4. OnResistance Variation with Temperature

250
VGS = 0 V
f = 1 MHz
TJ = 25C

200
C, CAPACITANCE (pF)

I D, DRAIN CURRENT (AMPS)

10

0.1

TJ = 125C

150

100

Ciss

50

25C

Coss
Crss

0.01

0.3
0.6
0.9
1.2
1.5
VSD, SOURCEDRAIN DIODE FORWARD VOLTAGE (VOLTS)

10
15
20
25
VDS, DRAINSOURCE VOLTAGE (VOLTS)

30

Figure 6. Capacitance Variation

10

2
ID = 200 mA

gFS, TRANSCONDUCTANCE (mhos)

VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 5. SourceDrain Diode Forward Voltage

8
7
VDS = 100 V

6
5
4

160 V

3
2

VDS = 10 V
1.5

1
TJ = 55C
0.5

25C
125C

1
0

0.5

1.5
2
2.5
3
3.5
Qg, TOTAL GATE CHARGE (nC)

4.5

Figure 7. Gate Charge versus GatetoSource Voltage

478

100

200
300
ID, DRAIN CURRENT (AMPS)

400

500

Figure 8. Transconductance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMFT960T1

Medium Power Field Effect


Transistor

Motorola Preferred Device

NChannel EnhancementMode
Silicon Gate TMOS
SOT223 for Surface Mount

This TMOS medium power field effect transistor is designed for


high speed, low loss power switching applications such as
switching regulators, dcdc converters, solenoid and relay drivers.
The device is housed in the SOT223 package which is designed
for medium power surface mount applications.
Silicon Gate for Fast Switching Speeds

MEDIUM POWER
TMOS FET
300 mA
60 VOLTS
RDS(on) = 1.7 OHM MAX

RDS(on) = 1.7 Ohm Max


2,4 DRAIN

Low Drive Requirement

2
3

The SOT223 Package can be soldered using wave or reflow.


The formed leads absorb thermal stress during soldering
eliminating the possibility of damage to the die.
Available in 12 mm Tape and Reel
Use MMFT960T1 to order the 7 inch/1000 unit reel
Use MMFT960T3 to order the 13 inch/4000 unit reel

CASE 318E04, STYLE 3


TO261AA
1
GATE
3 SOURCE

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

DraintoSource Voltage

VDS

60

Volts

GatetoSource Voltage NonRepetitive

VGS

30

Volts

Drain Current

ID

300

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

0.8
6.4

Watts
mW/C

TJ, Tstg

65 to 150

RJA

156

C/W

TL

260
10

C
Sec

Operating and Storage Temperature Range

DEVICE MARKING
FT960

THERMAL CHARACTERISTICS
Thermal Resistance JunctiontoAmbient
Maximum Temperature for Soldering Purposes
Time in Solder Bath

1. Device mounted on a FR4 glass epoxy printed circuit board using minimum recommended footprint.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

Motorola SmallSignal Transistors, FETs and Diodes Device Data

479

MMFT960T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

60

Vdc

Zero Gate Voltage Drain Current


(VDS = 60 V, VGS = 0)

IDSS

10

Adc

GateBody Leakage Current


(VGS = 15 Vdc, VDS = 0)

IGSS

50

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mAdc)

VGS(th)

1.0

3.5

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 1.0 A)

RDS(on)

1.7

Ohms

DraintoSource OnVoltage
(VGS = 10 V, ID = 0.5 A)
(VGS = 10 V, ID = 1.0 A)

VDS(on)

0.8
1.7

gfs

600

mmhos

Ciss

65

pF

Coss

33

Crss

7.0

Qg

3.2

Qgs

1.2

Qgd

2.0

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0, ID = 10 A)

ON CHARACTERISTICS(1)

Forward Transconductance
(VDS = 25 V, ID = 0.5 A)

Vdc

DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 25 V
V, VGS = 0,
0
f = 1.0 MHz)

Output Capacitance
Transfer Capacitance
Total Gate Charge

(VGS = 10 V,
V ID = 1.0
1 0 A,
A
VDS = 48 V)

GateSource Charge
GateDrain Charge

nC

1. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

TYPICAL ELECTRICAL CHARACTERISTICS


5

1
TJ = 25C

I D, DRAIN CURRENT (AMPS)

I D, DRAIN CURRENT (AMPS)

TJ = 25C
VGS = 10 V
8V

7V
2

6V
5V

TJ = 55C

0.8

TJ = 125C
0.6

0.4
VDS = 10 V
0.2

4V
0
0

4
6
8
VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

Figure 1. OnRegion Characteristics

480

10

2
4
6
8
VGS, GATETOSOURCE VOLTAGE (VOLTS)

10

Figure 2. Transfer Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMFT960T1

5
VGS = 10 V
4

3
TJ = 125C
2
25C
1
55C
0

0.5

1
1.5
2
ID, DRAIN CURRENT (AMPS)

2.5

RDS(on) , DRAINSOURCE RESISTANCE (NORMALIZED)

RDS(on) , DRAINSOURCE RESISTANCE (OHMS)

TYPICAL ELECTRICAL CHARACTERISTICS

Figure 3. OnResistance versus Drain Current

10
ID = 1 A
VGS = 10 V

0.1
75

50

25
0
25
50
75
100
TJ, JUNCTION TEMPERATURE (C)

125

150

Figure 4. OnResistance Variation with Temperature

250
VGS = 0 V
f = 1 MHz
TJ = 25C

200
C, CAPACITANCE (pF)

I D, DRAIN CURRENT (AMPS)

225

TJ = 125C

TJ = 25C

0.1

175
150
125
100
Ciss

75
Coss

50
Crss

25
0

0.3
0.6
0.9
1.2
1.5
VSD, SOURCEDRAIN DIODE FORWARD VOLTAGE (VOLTS)

10

30

9
ID = 1 A
TJ = 25C

8
7
6

VDS = 30 V
VDS = 48 V

5
4
3
2
1
0

10
15
20
25
VDS, DRAINSOURCE VOLTAGE (VOLTS)

Figure 6. Capacitance Variation

gFS , TRANSCONDUCTANCE (mhos)

VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 5. SourceDrain Diode Forward Voltage

0.5

1.5
2
2.5
3
Qg, TOTAL GATE CHARGE (nC)

3.5

Figure 7. Gate Charge versus GatetoSource Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

VDS = 10 V
1.5

1
TJ = 55C
25C

0.5
125C
0

0.5

1
1.5
ID, DRAIN CURRENT (AMPS)

2.5

Figure 8. Transconductance

481

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMFT2406T1

Medium Power Field Effect


Transistor

Motorola Preferred Device

NChannel Enhancement Mode


Silicon Gate TMOS EFET
SOT223 for Surface Mount

MEDIUM POWER
TMOS FET
700 mA
240 VOLTS
RDS(on) = 6.0 OHM

This TMOS medium power field effect transistor is designed for


high speed, low loss power switching applications such as
switching regulators, converters, solenoid and relay drivers. The
device is housed in the SOT223 package which is designed for
medium power surface mount applications.

Silicon Gate for Fast Switching Speeds

High Voltage 240 Vdc


1

Low Drive Requirement


The SOT223 Package can be soldered using wave or reflow.
The formed leads absorb thermal stress during soldering,
eliminating the possibility of damage to the die.
Available in 12 mm Tape and Reel
Use MMFT2406T1 to order the 7 inch/1000 unit reel.
Use MMFT2406T3 to order the 13 inch/4000 unit reel.

2
3

CASE 318E04, STYLE 3


TO261AA

G
S

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Symbol

Value

Unit

DraintoSource Voltage

VDS

240

Vdc

GatetoSource Voltage Continuous

Rating

VGS

20

Vdc

Drain Current

ID

700

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

1.5
12

Watts
mW/C

TJ, Tstg

65 to 150

RJA

83.3

C/W

TL

260
10

C
Sec

Operating and Storage Temperature Range

DEVICE MARKING
T2406

THERMAL CHARACTERISTICS
Thermal Resistance JunctiontoAmbient (surface mounted)(1)
Lead Temperature for Soldering Purposes, 1/16 from case
Time in Solder Bath

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

482

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMFT2406T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristics

Symbol

Min

Max

Unit

V(BR)DSS

240

Vdc

Zero Gate Voltage Drain Current


(VDS = 120 V, VGS = 0)

IDSS

10

Adc

GateBody Leakage Current


(VGS = 15 Vdc, VDS = 0)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mAdc)

VGS(th)

0.8

2.0

Vdc

Static DraintoSource OnResistance


(VGS = 2.5 Vdc, ID = 0.1 Adc)
(VGS = 10 Vdc, ID = 0.5 Adc)

RDS(on)

10
6.0

DraintoSource OnVoltage
(VGS = 10 V, ID = 0.5 A)

VDS(on)

3.0

Vdc

gFS

300

mmhos

Ciss

125

pF

Coss

50

Crss

20

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0, ID = 100 A)

ON CHARACTERISTICS(2)

Forward Transconductance
(VDS = 6.0 V, ID = 0.5 A)

Ohms

DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance

(VDS = 25 V
V, VGS = 0,
0
f = 1.0 MHz)

Transfer Capacitance
2. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

483

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMFT6661T1

Medium Power Field Effect


Transistor

Motorola Preferred Device

NChannel EnhancementMode
Silicon Gate TMOS
SOT223 for Surface Mount

This TMOS medium power field effect transistor is designed for


high speed, low loss power switching applications such as
switching regulators, dcdc converters, solenoid and relay drivers.
The device is housed in the SOT223 package which is designed
for medium power surface mount applications.
Silicon Gate for Fast Switching Speeds

MEDIUM POWER
TMOS FET
500 mA
90 VOLTS
RDS(on) = 4.0 OHM MAX

RDS(on) = 4.0 Ohm Max


2,4 DRAIN

Low Drive Requirement, VGS = 2.0 Volts Max

2
3

The SOT223 Package can be soldered using wave or reflow.


The formed leads absorb thermal stress during soldering
eliminating the possibility of damage to the die.
Available in 12 mm Tape and Reel
Use MMFT6661T1 to order the 7 inch/1000 unit reel
Use MMFT6661T3 to order the 13 inch/4000 unit reel

CASE 318E04, STYLE 3


TO261AA
1
GATE
3 SOURCE

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

DraintoSource Voltage

VDS

90

Vdc

GatetoSource Voltage NonRepetitive

VGS

30

Vdc

Drain Current

ID

500

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

0.8
6.4

Watts
mW/C

TJ, Tstg

65 to 150

RJA

156

C/W

TL

260
10

C
Sec

Operating and Storage Temperature Range

DEVICE MARKING
T6661

THERMAL CHARACTERISTICS
Thermal Resistance JunctiontoAmbient
Maximum Temperature for Soldering Purposes
Time in Solder Bath

1. Device mounted on FR4 glass epoxy printed circuit board using minimum recommended footprint.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 4

484

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMFT6661T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)DSS

90

Vdc

Zero Gate Voltage Drain Current


(VDS = 90 V, VGS = 0)

IDSS

10

Adc

GateBody Leakage Current


(VGS = 15 Vdc, VDS = 0)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mAdc)

VGS(th)

0.8

2.0

Vdc

Static DraintoSource OnResistance


(VGS = 10 Vdc, ID = 1.0 Adc)

RDS(on)

4.0

Ohms

DraintoSource OnVoltage
(VGS = 10 V, ID = 1.0 A)
(VGS = 5.0 V, ID = 0.3 A)

VDS(on)

4.0
1.6

gFS

200

mmhos

Ciss

36

pF

Coss

16

Crss

6.0

Qg

1.7

Qgs

0.34

Qgd

0.23

OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
(VGS = 0, ID = 10 A)

ON CHARACTERISTICS(2)

Forward Transconductance
(VDS = 25 V, ID = 0.5 A)

Vdc

DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 25 V
V, VGS = 0,
0
f = 1.0 MHz)

Output Capacitance
Transfer Capacitance
Total Gate Charge

(VGS = 10 V,
V ID = 1.0
1 0 A,
A
VDS = 72 V)

GateSource Charge
GateDrain Charge

nC

2. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%

TYPICAL ELECTRICAL CHARACTERISTICS


1.5
VDS = 10 V

TJ = 25C

2.5

7V

I D, DRAIN CURRENT (AMPS)

I D, DRAIN CURRENT (AMPS)

8V

VGS = 10 V

6V

1.5

5V
1
4V
0.5
0
0

4
6
8
VDS, DRAINTOSOURCE VOLTAGE (VOLTS)

10

Figure 1. OnRegion Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

TJ = 55C

25C
125C

1.2

0.9

0.6

0.3

2
4
6
VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 2. Transfer Characteristics

485

MMFT6661T1

RDS(on) , DRAINSOURCE RESISTANCE (NORMALIZED)

RDS(on) , DRAINSOURCE RESISTANCE (OHMS)

TYPICAL ELECTRICAL CHARACTERISTICS

7
VGS = 10 V

TJ = 125C

25C
2
55C
0

0.3

0.6
0.9
ID, DRAIN CURRENT (AMPS)

1.2

1.5

Figure 3. OnResistance versus Drain Current

10
ID = 1 A
VGS = 10 V

0.1
75

50

25
0
25
50
75
100
TJ, JUNCTION TEMPERATURE (C)

100
VGS = 0 V
f = 1 MHz
TJ = 25C

80
C, CAPACITANCE (pF)

I D, DRAIN CURRENT (AMPS)

90

TJ = 125C

TJ = 25C

0.1

70
60
50
Ciss

40
30

Coss

20
Crss

10
0

0.5
1
1.5
VSD, SOURCEDRAIN DIODE FORWARD VOLTAGE (VOLTS)

10

10
15
20
25
VDS, DRAINSOURCE VOLTAGE (VOLTS)

30

1
ID = 1 A
TJ = 25C

VDS = 72 V
6

0.2

0.4

0.6 0.8
1
1.2 1.4
Qg, TOTAL GATE CHARGE (nC)

1.6

1.8

VDS = 10 V
0.8

0.6
TJ = 55C
25C

0.4

125C
0.2

Figure 7. Gate Charge versus GatetoSource Voltage

486

Figure 6. Capacitance versus DrainSource Voltage

gFS , TRANSCONDUCTANCE (mhos)

VGS, GATETOSOURCE VOLTAGE (VOLTS)

Figure 5. SourceDrain Diode Forward Voltage

150

Figure 4. OnResistance Variation with Temperature

10

0.01

125

0.3

0.6
0.9
ID, DRAIN CURRENT (AMPS)

1.2

1.5

Figure 8. Transconductance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS Switching

MPF910

NChannel Enhancement

3 DRAIN

2
GATE

1 SOURCE
1

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

VDS

60

Vdc

VGS
VGSM

20
40

Vdc
Vpk

ID
IDM

0.5
1.0

Adc

Total Device Dissipation @ TA = 25C


Derate above 25C
MPF910

PD

1.0
8.0

Watts
mW/C

Total Device Dissipation @ TC = 25C


Derate above 25C
MFE910

PD

6.25
50

Watts
mW/C

TJ, Tstg

65 to +150

Drain Source Voltage


GateSource Voltage
Continuous
Nonrepetitive (tp 50 s)
Drain Current Continuous(1)
Pulsed(2)

Operating and Storage Junction


Temperature Range

CASE 2905, STYLE 22


TO92 (TO226AE)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

ZeroGateVoltage Drain Current


(VDS = 40 V, VGS = 0)

IDSS

0.1

10

Adc

Gate Reverse Current


(VGS = 10 V, VDS = 0)

IGSS

0.01

10

nAdc

V(BR)DSS

60

90

Vdc

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mA)

VGS(th)

0.3

1.5

2.5

Vdc

DrainSource OnVoltage
(VGS = 10 V, ID = 500 mA)

VDS(on)

2.5

Vdc

OnState Drain Current


(VDS = 25 V, VGS = 10 V)

ID(on)

500

mA

Forward Transconductance
(VDS = 15 V, ID = 500 mA)

gfs

100

mmhos

OFF CHARACTERISTICS

DrainSource Breakdown Voltage


(VGS = 0, ID = 100 A)

ON CHARACTERISTICS

1. The Power Dissipation of the package may result in a lower continuous drain current.
2. Pulse Test: Pulse Width
300 s, Duty Cycle
2.0%.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

487

MPF910
RESISTIVE SWITCHING

+25 V
To Sampling Scope
50 Input

23
20 dB
50 Attenuator

Vin
40 pF

Pulse Generator

50

Vout

50 1.0 M

Figure 1. Switching Test Circuit

toff

ton

90%

90%

10%

Output Vout
Inverted
50%
Input Vin

10%

90%
50%

Pulse
Width

10 v

Figure 2. Switching Waveforms

1.6

2.0
I D(on), DRAIN CURRENT (AMPS)

V GS(th) , THRESHOLD VOLTAGE

2.0
VDS = VGS
ID = 1.0 mA

1.2
0.8
0.4
0
50

100
0
50
TJ, JUNCTION TEMPERATURE

150 (C)

Figure 3. VGS(th) Normalized versus Temperature

488

VGS = 10 V

1.6

9.0 V

1.2

7.0 V

8.0 V

6.0 V

0.8

5.0 V

0.4
4.0 V

1.0
2.0
3.0
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

4.0

Figure 4. OnRegion Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPF910
100

VGS = 10 V
9.0 V

1.6

C, CAPACITANCE (pF)

I D(on), DRAIN CURRENT (AMPS)

2.0

8.0 V

1.2
7.0 V

0.8

6.0 V
5.0 V

0.4

80

VGS = 10 V

60
40
Ciss

20

Coss

4.0 V

Crss

20
10
30
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

40

V DS , DRAINSOURCE VOLTAGE (VOLTS)

40
50
60
10
20
30
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

Figure 6. Capacitance versus


DraintoSource Voltage

Figure 5. Output Characteristics

10

ID = 1.5 A
1.0 A

VGS = 10 V

5.0

0.5 A

1.0
0.5
0.4
0.3
0.2
0.1
50

30 10

10 30 50 70 90 110 130 150


TJ, JUNCTION TEMPERATURE

Figure 7. On Voltage versus Temperature

Motorola SmallSignal Transistors, FETs and Diodes Device Data

489

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS Switching

NChannel Enhancement

MPF930
MPF960
MPF990

3 DRAIN

2
GATE

1 SOURCE

MAXIMUM RATINGS
Rating

Symbol

MPF930

MPF960

MPF990

Unit

Drain Source Voltage

VDS

35

60

90

Vdc

Drain Gate Voltage

VDG

35

60

90

Vdc

GateSource Voltage
Continuous
Nonrepetitive (tp 50 s)
Drain Current
Continuous(1)
Pulsed(2)

1
2

VGS
VGSM

20
40

ID
IDM

2.0
3.0

Vdc
Vpk

CASE 2905, STYLE 22


TO92 (TO226AE)

Adc

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range
Thermal Resistance

1.0
8.0

Watts
mW/C

TJ, Tstg

55 to 150

JA

125

C/W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

35
60
90

IGSS

50

nAdc

IDSS

10

Adc

VGS(Th)

1.0

3.5

Vdc

MPF930
MPF960
MPF990

0.4
0.6
0.6

0.7
0.8
1.2

(ID = 1.0 Adc)

MPF930
MPF960
MPF990

0.9
1.2
1.2

1.4
1.7
2.4

(ID = 2.0 Adc)

MPF930
MPF960
MPF990

2.2
2.8
2.8

3.0
3.5
4.8

OFF CHARACTERISTICS
DrainSource Breakdown Voltage
(VGS = 0, ID = 10 Adc)

V(BR)DSX
MPF930
MPF960
MPF990

Gate Reverse Current (VGS = 15 Vdc, VDS = 0)

Vdc

ON CHARACTERISTICS(2)
ZeroGateVoltage Drain Current
(VDS = Maximum Rating, VGS = 0)
Gate Threshold Voltage
(ID = 1.0 mAdc, VDS = VGS)
DrainSource OnVoltage (VGS = 10 Vdc)
(ID = 0.5 Adc)

VDS(on)

Vdc

1. The Power Dissipation of the package may result in a lower continuous drain current.
2. Pulse Test: Pulse Width
300 s, Duty Cycle
2.0%.

REV 2

490

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPF930 MPF960 MPF990


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

0.9
1.2
1.2

1.4
1.7
2.0

ID(on)

1.0

2.0

Amps

Input Capacitance
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

70

pF

Reverse Transfer Capacitance


(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Crss

20

pF

Output Capacitance
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Coss

49

pF

gfs

200

380

mmhos

TurnOn Time

ton

7.0

15

ns

TurnOff Time

toff

7.0

15

ns

ON CHARACTERISTICS(2) (Continued)
Static DrainSource On Resistance
(VGS = 10 Vdc, ID = 1.0 Adc)

rDS(on)
MPF930
MPF960
MPF990

OnState Drain Current


(VDS = 25 Vdc, VGS = 10 Vdc)

SMALL SIGNAL CHARACTERISTICS

Forward Transconductance
(VDS = 25 Vdc, ID = 0.5 Adc)

SWITCHING CHARACTERISTICS

2. Pulse Test: Pulse Width

v 300 s, Duty Cycle v 2.0%.

RESISTIVE SWITCHING
+25 V
TO SAMPLING SCOPE
50 INPUT

23
PULSE GENERATOR

20 dB
50 ATTENUATOR

Vin
40 pF

50
50

1.0 M

ton

Vout

toff
90%

90%

OUTPUT
V
INVERTED out

10%
90%

10 V
INPUT

Figure 1. Switching Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Vin

50%
10%

PULSE
WIDTH

50%

Figure 2. Switching Waveforms

491

200

10

180

5.0

VGS = 0 V

160

VGS = 10 V

C, CAPACITANCE (pF)

V DS , DRAINSOURCE VOLTAGE (VOLTS)

MPF930 MPF960 MPF990

2.0
1.0
0.5

140
Coss

120
100
80

Ciss

60
40

0.2

Crss

20
0.1
55

35

15

85 105
+5.0 25
45 65
TJ, JUNCTION TEMPERATURE (C)

125

145

5.0

Figure 3. On Voltage versus Temperature

10
20
30
40
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

50

Figure 4. Capacitance Variation

2.4

2.8
ID(on), DRAIN CURRENT (AMPS)

ID(on), DRAIN CURRENT (AMPS)

VGS = 10 V
2.1
VDS = 10 V

1.8
1.5
1.2
0.9
0.6

2.4
9.0 V
2.0
1.6
7.0 V
1.2
6.0 V
0.8
5.0 V

0.3

0.4

1.0

6.0 7.0 8.0


2.0 3.0 4.0 5.0
VGS, GATE SOURCE VOLTAGE (VOLTS)

9.0

10

8.0 V

4.0 V
0

5.0

Figure 5. Transfer Characteristic

ID(on), DRAIN CURRENT (AMPS)

2.8

10
20
30
40
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

50

Figure 6. Output Characteristic

VGS = 10 V

2.4

9.0 V

2.0

8.0 V

1.6
7.0 V
1.2
6.0 V
0.8
5.0 V
0.4
0.2

4.0 V
3.0 V
0

0.5

1.0
2.0
3.0
4.0
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

5.0

Figure 7. Saturation Characteristic

492

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS FET Transistors


NChannel Enhancement

MPF6659
MPF6660
MPF6661

3 DRAIN

2
GATE
1 SOURCE

MAXIMUM RATINGS
Rating

Symbol

MPF6659

MPF6660

MPF6661

Unit

Drain Source Voltage

VDS

35

60

90

Vdc

Drain Gate Voltage

VDG

35

60

90

Vdc

GateSource Voltage
Continuous
Nonrepetitive (tp 50 s)
Drain Current
Continuous(1)
Pulsed(2)

1
2

VGS
VGSM

20
40

ID
IDM

2.0
3.0

Vdc
Vpk

CASE 2905, STYLE 22


TO92 (TO226AE)

Adc

Total Device Dissipation


@ TC = 25C
Derate above 25C

PD

Total Device Dissipation


@ TA = 25C
Derate above 25C

PD

Operating and Storage Junction


Temperature Range

TJ, Tstg

2.5
20

Watts
mW/C

1.0
8.0

Watts
mW/C

55 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

ZeroGateVoltage Drain Current


(VDS = Maximum Rating, VGS = 0)

IDSS

10

Adc

GateBody Leakage Current


(VGS = 15 Vdc, VDS = 0)

IGSS

100

nAdc

35
60
90

0.8

1.4

2.0

MPF6659
MPF6660
MPF6661

1.8
3.0
4.0

MPF6659
MPF6660
MPF6661

0.8
0.9
0.9

1.5
1.5
1.6

OFF CHARACTERISTICS

DrainSource Breakdown Voltage


(VGS = 0, ID = 10 Adc)

V(BR)DSX
MPF6659
MPF6660
MPF6661

Vdc

ON CHARACTERISTICS(2)
Gate Threshold Voltage
(VDS = VGS, ID = 1.0 mAdc)

VGS(Th)

DrainSource OnVoltage
(VGS = 10 Vdc, ID = 1.0 Adc)

VDS(on)

(VGS = 5.0 Vdc, ID = 0.3 Adc)

Vdc
Vdc

1. The Power Dissipation of the package may result in a lower continuous drain current.
2. Pulse Test: Pulse Width
300 s, Duty Cycle
2.0%.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

493

MPF6659 MPF6660 MPF6661


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

1.8
3.0
4.0

ID(on)

1.0

2.0

Amps

Input Capacitance
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

30

pF

Reverse Transfer Capacitance


(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Crss

3.6

pF

Output Capacitance
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)

Coss

20

pF

gfs

170

mmhos

Rise Time

tr

5.0

ns

Fall Time

tf

5.0

ns

TurnOn Time

ton

5.0

ns

TurnOff Time

toff

5.0

ns

ON CHARACTERISTICS(2) (Continued)
Static DrainSource On Resistance
(VGS = 10 Vdc, ID = 1.0 Adc)

rDS(on)
MPF6659
MPF6660
MPF6661

OnState Drain Current


(VDS = 25 Vdc, VGS = 10 Vdc)

SMALL SIGNAL CHARACTERISTICS

Forward Transconductance
(VDS = 25 Vdc, ID = 0.5 Adc)

SWITCHING CHARACTERISTICS(2)

2. Pulse Test: Pulse Width

v 300 s, Duty Cycle v 2.0%.

RESISTIVE SWITCHING
+25 V
TO SAMPLING SCOPE
50 INPUT

23
PULSE GENERATOR

20 dB
50 ATTENUATOR

Vin
40 pF

50

50

1.0 M

ton

Vout

toff
90%

90%

OUTPUT
V
INVERTED out

10%
90%
50%

INPUT

Figure 1. Switching Test Circuit

494

Vin

10%

PULSE
WIDTH

50%

10 V

Figure 2. Switching Waveforms

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPF6659 MPF6660 MPF6661


2.0
I D(on) , DRAIN CURRENT (AMPS)

V GS(th), THRESHOLD VOLTAGE

2.0
1.6
VDS = VGS
ID = 1.0 mA

1.2

0.8

0.4

VGS = 10 V
1.6

9.0 V
8.0 V

1.2

7.0 V
6.0 V

0.8

5.0 V
0.4
4.0 V

0
50

100
50
TJ, JUNCTION TEMPERATURE

150C

Figure 3. VGS(th) Normalized versus Temperature

100

VGS = 10 V
9.0 V

1.6

80

8.0 V
1.2
7.0 V
0.8
6.0 V
0.4

4.0

Figure 4. OnRegion Characteristics

C, CAPACITANCE (pF)

I D(on) , DRAIN CURRENT (AMPS)

2.0

1.0
2.0
3.0
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

VGS = 0 V

60

40
Ciss
20

5.0 V

Coss

4.0 V

Crss
0

20
10
30
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

40

V DS , DRAINSOURCE VOLTAGE (VOLTS)

Figure 5. Output Characteristics

10

40
50
60
20
30
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

Figure 6. Capacitance versus


DrainToSource Voltage

10
5.0

ID = 1.5 A
1.0 A

VGS = 10 V

0.5 A
1.0
0.5
0.4
0.3
0.2
0.1
50

30

10

90
110
10
30
50
70
TJ, JUNCTION TEMPERATURE (C)

130

150

Figure 7. OnVoltage versus Temperature

Motorola SmallSignal Transistors, FETs and Diodes Device Data

495

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS FET Transistor


NChannel Enhancement

VN0300L

3 DRAIN

Motorola Preferred Device

2
GATE

1 SOURCE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Source Voltage

VDSS

60

Drain Gate Voltage

VDGR

60

Gate Source Voltage


Continuous
Nonrepetitive (tp 50 s)

VGS
VGSM

20
40

Vdc
Vpk

Continuous Drain Current

1
2

CASE 2904, STYLE 22


TO92 (TO226AA)

ID

200

mA

Pulsed Drain Current

IDM

500

mA

Power Dissipation @ TC = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

TJ, Tstg

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RJA

312.5

C/W

Maximum Lead Temperature for Soldering


Purposes, 1/16 from case for 10
seconds

TL

300

Operating and Storage Temperature

THERMAL CHARACTERISTICS
Characteristics

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)DSS

30

10
500

STATIC CHARACTERISTICS
Drain Source Breakdown Voltage
(VDS = 0, ID = 10 A)

Zero Gate Voltage Drain Current


(VDS = 48 Vdc, VGS = 0)
(VDS = 48 Vdc, VGS = 0, TA = 125C)

IDSS

GateBody Leakage
(VDS = 0, VGS = 30 V)

IGSS

100

nA

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mA)
OnState Drain Current(1)
(VDS = VGS, ID = 1.0 mA)

VGS(th)

0.8

2.5

ID(on)

1.0

DrainSource On Resistance(1)
(VGS = 5.0 V, ID = 0.3 A)
(VGS = 10 V, ID = 1.0 A)
Forward Transconductance(1)
(VDS = 10 V, ID = 0.5 A)

rDS(on)

3.3
1.2

200

1. Pulse Test; Pulse Width < 300 ms, Duty Cycle

gfs

mS

v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

496

Motorola SmallSignal Transistors, FETs and Diodes Device Data

VN0300L
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

Ciss

100

pF

Coss

95

pF

Crss

25

pF

ton

30

ns

toff

30

ns

DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance

(VDS = 15 Vdc,
Vd VGS = 0,
0
f = 1.0 MHz)

Reverse Transfer Capacitance

SWITCHING CHARACTERISTICS
TurnOn Time
TurnOff Time

((VDD = 25 Vdc, ID = 1.0 A,


RL = 24 , RG = 25 )

Motorola SmallSignal Transistors, FETs and Diodes Device Data

497

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS FET Transistor


NChannel Enhancement

VN0610LL

3 DRAIN

2
GATE

1 SOURCE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Source Voltage

VDSS

60

Vdc

Drain Gate Voltage (RGS = 1 M)

VDGR

60

Vdc

Gate Source Voltage


Continuous
Nonrepetitive (tp 50 s)

VGS
VGSM

20
40

ID
IDM

190
1000

PD

400
3.2

mW
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

RJA

312.5

C/W

TL

300

Drain Current
Continuous
Pulsed

1
2

Vdc
Vpk

CASE 2904, STYLE 22


TO92 (TO226AA)

mAdc

Total Power Dissipation @ TA = 25C


Derate above 25C
Operating and Storage Temperature Range

THERMAL CHARACTERISTICS
Characteristics
Thermal Resistance, Junction to Ambient
Maximum Lead Temperature for Soldering
Purposes, 1/16 from case for 10 seconds

ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)


Symbol

Min

Max

Unit

V(BR)DSS

60

Vdc

10
500

IGSSF

100

nAdc

Gate Threshold Voltage (VDS = VGS, ID = 1.0 mA)

VGS(th)

0.8

2.5

Vdc

Static DrainSource OnResistance


(VGS = 10 V, ID = 500 mA)
(VGS = 10 V, ID = 500 mA, TC = 125C)

rDS(on)

5.0
9.0

DrainSource OnVoltage
(VGS = 5.0 V, ID = 200 mA)
(VGS = 10 V, ID = 500 mA)

VDS(on)

1.5
2.5

ID(on)

750

mAdc

gfs

100

mhos

Characteristic

OFF CHARACTERISTICS
Drain Source Breakdown Voltage
(VGS = 0, ID = 100 A)
Zero Gate Voltage Drain Current
(VDS = 48 Vdc, VGS = 0)
(VDS = 48 Vdc, VGS = 0, TJ = 125C)
GateBody Leakage Current, Forward
(VGSF = 30 V, VDS = 0)

Adc

IDSS

ON CHARACTERISTICS(1)

OnState Drain Current (VGS = 10 V, VDS 2.0 VDS(on))


Forward Transconductance (VDS 2.0 VDS(on), ID = 500 mA)
1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 2.0%.

Vdc

REV 1

498

Motorola SmallSignal Transistors, FETs and Diodes Device Data

VN0610LL
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

Ciss

60

pF

Coss

25

Crss

5.0

ton

10

toff

10

DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 25 Vdc,
Vd VGS = 0,
0
f = 1.0 MHz)

Output Capacitance
Reverse Transfer Capacitance

SWITCHING CHARACTERISTICS(1)
TurnOn Delay Time
TurnOff Delay Time
1. Pulse Test: Pulse Width

((VDD = 15 Vdc, ID = 600 mA,


Rgen = 25 , RL = 23 )

v 300 ms, Duty Cycle v 10%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

ns

499

VN0610LL
RESISTIVE SWITCHING
+25 V
ton

Vin
PULSE GENERATOR
50

125
20 dB
50 ATTENUATOR

40 pF
50

1.0 M

TO SAMPLING SCOPE
50 INPUT
Vout
OUTPUT
V
INVERTED out

toff

90%
10%
90%
50%

10%
INPUT

Vin

(Vin Amplititude 10 Volts)

Figure 2. Switching Waveforms

Figure 1. Switching Test Circuit

2.0
VDS = VGS
ID = 1.0 mA

I D(on) , DRAIN CURRENT (AMPS)

VGS(th), THRESHOLD VOLTAGE

2.0

1.6

PULSE
WIDTH

1.2

0.8

0.4

VGS = 10 V
1.6

9.0 V
8.0 V

1.2

7.0 V
6.0 V

0.8

5.0 V
0.4
4.0 V

0
50

100
0
50
TJ, JUNCTION TEMPERATURE (C)

150

Figure 3. VGS(th) Normalized versus Temperature

100

VGS = 10 V
9.0 V

1.6

VGS = 0 V

80

8.0 V
1.2
7.0 V
0.8
6.0 V
0.4

4.0

Figure 4. OnRegion Characteristics

C, CAPACITANCE (pF)

I D(on) , DRAIN CURRENT (AMPS)

2.0

1.0
2.0
3.0
VDS, DRAIN TOSOURCE VOLTAGE (VOLTS)

60

40
Ciss
20

5.0 V

Coss

4.0 V

Crss
0

20
10
30
VDS, DRAIN TOSOURCE VOLTAGE (VOLTS)

Figure 5. Output Characteristics

4100

40

10
20
30
40
50
60
VDS, DRAIN TOSOURCE VOLTAGE (VOLTS)

Figure 6. Capacitance versus


DrainToSource Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS FET Transistor

VN10LM

NChannel Enhancement

3 DRAIN

2
GATE

1 SOURCE
1
2

CASE 2905, STYLE 22


TO92 (TO226AE)

MAXIMUM RATINGS
Rating
Drain Source Voltage
GateSource Voltage
Continuous
Nonrepetitive (tp 50 s)
Drain Current Continuous(1)
Pulsed(2)
Total Device Dissipation @ TA = 25C
Derate above 25C
Operating and Storage
Temperature Range

Symbol

Value

Unit

VDSS

60

Vdc

VGS
VGSM

20
40

Vdc
Vpk

ID
IDM

0.3
1.0

Adc

PD

1.0
8.0

Watts
mW/C

TJ, Tstg

40 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

DrainSource Breakdown Voltage


(VGS = 0, ID = 100 A)

V(BR)DSS

60

Vdc

ZeroGateVoltage Drain Current


(VDS = 45 V, VGS = 0)

IDSS

0.1

10

Adc

GateBody Leakage Current


(VGS = 15 V, VDS = 0)

IGSS1

100

nAdc

GateBody Leakage Current


(VGS = 15 V, VDS = 0)

IGSS2

100

nAdc

OFF CHARACTERISTICS

1. The Power Dissipation of the package may result in a lower continuous drain current.
2. Pulse Width
300 s, Duty Cycle.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4101

VN10LM
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mA)

VGS(th)

0.8

2.5

Vdc

OnState Drain Current


(VDS = 15 V, VGS = 10 V)

ID(on)

750

mA

Forward Transconductance
(VDS = 15 V, ID = 500 mA)

gfs

200

mmhos

DrainSource OnVoltage
(VGS = 5.0 V, ID = 200 mA)

VDS(on)1

1.5

Vdc

DrainSource OnVoltage
(VGS = 10 V, ID = 500 mA)

VDS(on)2

2.5

Vdc

DrainSource OnResistance
(VGS = 5.0 V, ID = 200 mA)

rDS(on)1

7.5

DrainSource OnResistance
(VGS = 10 V, ID = 500 mA)

rDS(on)2

5.0

Input Capacitance
(VDS = 25 V, VGS = 0, f = 1.0 MHz)

Ciss

60

pF

Output Capacitance
(VDS = 25 V, VGS = 0, f = 1.0 MHz)

Coss

25

pF

Reverse Transfer Capacitance


(VDS = 25 V, VGS = 0, f = 1.0 MHz)

Crss

5.0

pF

TurnOn Time
(VDS = 15 V, RL = 23 , RG = 50 , Vin = 20 V)

ton

10

ns

TurnOff Time
(VDS = 15 V, RL = 23 , RG = 50 , Vin = 20 V)

toff

10

ns

ON CHARACTERISTICS

4102

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS FET Transistor


NChannel Enhancement

VN2222LL

3 DRAIN

Motorola Preferred Device

2
GATE

1 SOURCE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Source Voltage

VDSS

60

Vdc

DrainGate Voltage (RGS = 1.0 M)

VDGR

60

Vdc

GateSource Voltage
Continuous
Nonrepetitive (tp 50 s)

VGS
VGSM

20
40

Vdc
Vpk

ID
IDM

150
1000

PD

400
3.2

mW
mW/C

TJ, Tstg

55 to +150

Symbol

Max

Unit

RJA

312.5

C/W

TL

300

Drain Current
Continuous
Pulsed

1
2

CASE 2904, STYLE 22


TO92 (TO226AA)

mAdc

Total Power Dissipation @ TA = 25C


Derate above 25C
Operating and Storage
Temperature Range

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
Maximum Lead Temperature for
Soldering Purposes, 1/16 from case
for 10 seconds

ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)DSS

60

Vdc

10
500

IGSSF

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mAdc)

VGS(th)

0.6

2.5

Vdc

Static DrainSource OnResistance


(VGS = 10 Vdc, ID = 0.5 Adc)
(VGS = 10 Vdc, ID = 0.5 Vdc, TC = 125C)

rDS(on)

7.5
13.5

OFF CHARACTERISTICS
DrainSource Breakdown Voltage
(VGS = 0, ID = 100 Adc)
Zero Gate Voltage Drain Current
(VDS = 48 Vdc, VGS = 0)
(VDS = 48 Vdc, VGS = 0, TJ = 125C)
GateBody Leakage Current, Forward
(VGSF = 30 Vdc, VDS = 0)

Adc

IDSS

ON CHARACTERISTICS(1)

1. Pulse Test: Pulse Width

v 300 s, Duty Cycle v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4103

VN2222LL
ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

1.5
3.75

ID(on)

750

mA

gfs

100

mhos

Ciss

60

pF

Coss

25

Crss

5.0

ton

10

toff

10

ON CHARACTERISTICS(1) (Continued)
DrainSource OnVoltage
(VGS = 5.0 Vdc, ID = 200 mAdc)
(VGS = 10 Vdc, ID = 500 mAdc)

VDS(on)

OnState Drain Current


(VGS = 10 Vdc, VDS 2.0 VDS(on))
Forward Transconductance
(VDS = 10 Vdc, ID = 500 mAdc)

Vdc

DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 25 Vdc,
Vd VGS = 0,
0
f = 1.0 MHz)

Output Capacitance
Reverse Transfer Capacitance

SWITCHING CHARACTERISTICS(1)
TurnOn Delay Time
TurnOff Delay Time
1. Pulse Test: Pulse Width

4104

((VDD = 15 Vdc, ID = 600 mA,


Rgen = 25 , RL = 23 )

v 300 s, Duty Cycle v 2.0%.

ns

Motorola SmallSignal Transistors, FETs and Diodes Device Data

VN2222LL
1

2
I D, DRAIN CURRENT (AMPS)

1.6

I D, DRAIN CURRENT (AMPS)

TA = 25C

1.8

VGS = 10 V
9V

1.4
1.2

8V

1
7V

0.8
0.6

6V

0.4

5V

0.2

4V

25C

VDS = 10 V

0.8

55C
125C

0.6
0.4

0.2

3V
1

Figure 2. Transfer Characteristics

VGS = 10 V
ID = 200 mA

1.6
1.4
1.2
1
0.8
0.6
0.4
60

Figure 1. Ohmic Region

2.2

1.8

VGS, GATE SOURCE VOLTAGE (VOLTS)

2.4
2

10

VDS, DRAIN SOURCE VOLTAGE (VOLTS)

20

+20
+60
T, TEMPERATURE (C)

+100

+140

VGS(th) , THRESHOLD VOLTAGE (NORMALIZED)

r DS(on) , STATIC DRAINSOURCE ONRESISTANCE


(NORMALIZED)

Figure 3. Temperature versus Static


DrainSource OnResistance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

1.2
1.15
VDS = VGS
ID = 1 mA

1.1
1.05
1
0.95
0.9
0.85
0.8
0.75
0.7
60

20

+20
+60
T, TEMPERATURE (C)

+100

+140

Figure 4. Temperature versus Gate


Threshold Voltage

4105

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS FET Transistor


NChannel Enhancement

VN2406L

3 DRAIN

Motorola Preferred Device

2
GATE

1 SOURCE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Source Voltage

VDSS

240

Vdc

Drain Gate Voltage

VDGR

60

Vdc

Gate Source Voltage


Continuous
Nonrepetitive (tp 50 s)

VGS
VGSM

20
40

Vdc
Vpk

Continuous Drain Current

1
2

CASE 2904, STYLE 22


TO92 (TO226AA)

ID

200

mAdc

Pulsed Drain Current

IDM

500

mAdc

Power Dissipation @ TC = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

TJ, Tstg

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RJA

312.5

C/W

Maximum Lead Temperature for Soldering


Purposes, 1/16 from case for 10
seconds

TL

300

Operating and Storage Temperature

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)DSS

240

Vdc

10
500

STATIC CHARACTERISTICS
Drain Source Breakdown Voltage
(VGS = 0, ID = 100 A)

Adc

Zero Gate Voltage Drain Current


(VDS = 120 Vdc, VGS = 0)
(VDS = 120 Vdc, VGS = 0, TA = 125C)

IDSS

Gate Body Leakage


(VDS = 0, VGS = 15 V)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mA)
OnState Drain Current(1)
(VGS = 10 V, VDS 2.0 VDS(on))

VGS(th)

0.8

2.0

Vdc

ID(on)

1.0

Adc

DrainSource On Resistance(1)
(VGS = 2.5 V, ID = 0.1 A)
(VGS = 10 V, ID = 0.5 A)
Forward Transconductance(1)
(VDS = 10 V, ID = 0.5 A)

rDS(on)

10
6.0

300

1. Pulse Test; Pulse Width < 300 s, Duty Cycle

gfs

mS

v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

4106

Motorola SmallSignal Transistors, FETs and Diodes Device Data

VN2406L
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

Ciss

125

pF

Coss

50

pF

Crss

20

pF

t(on)

8.0

ns

t(r)

8.0

ns

t(off)

23

ns

t(f)

34

ns

DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance

(VDS = 25 Vdc,
Vd VGS = 0,
0
f = 1.0 MHz)

Reverse Transfer Capacitance

SWITCHING CHARACTERISTICS
TurnOn Time
(VDD = 60 Vdc,
Vd ID = 0.4
0 4 A,
A
RL = 150 , RG = 25 )
TurnOff Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4107

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

TMOS FET Transistor


NChannel Enhancement

VN2410L

3 DRAIN

2
GATE

1 SOURCE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Source Voltage

VDSS

240

Vdc

Drain Gate Voltage

VDGR

60

Vdc

Gate Source Voltage


Continuous
Nonrepetitive (tp 50 s)

VGS
VGSM

20
40

Vdc
Vpk

Continuous Drain Current

1
2

CASE 2904, STYLE 22


TO92 (TO226AA)

ID

200

mAdc

Pulsed Drain Current

IDM

500

mAdc

Power Dissipation @ TC = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

TJ, Tstg

Symbol

Max

Unit

Thermal Resistance, Junction to Ambient

RJA

312.5

C/W

Maximum Lead Temperature for Soldering


Purposes, 1/16 from case for 10
seconds

TL

300

Operating and Storage Temperature

THERMAL CHARACTERISTICS
Characteristic

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)DSS

240

Vdc

10
500

STATIC CHARACTERISTICS
Drain Source Breakdown Voltage
(VGS = 0, ID = 100 A)

Adc

Zero Gate Voltage Drain Current


(VDS = 120 Vdc, VGS = 0)
(VDS = 120 Vdc, VGS = 0, TA = 125C)

IDSS

Gate Body Leakage


(VDS = 0, VGS = 15 V)

IGSS

100

nAdc

Gate Threshold Voltage


(VDS = VGS, ID = 1.0 mA)
OnState Drain Current(1)
(VGS = 10 V, VDS 2.0 VDS(on))

VGS(th)

0.8

2.0

Vdc

ID(on)

1.0

Adc

DrainSource On Resistance(1)
(VGS = 2.5 V, ID = 0.1 A)
(VGS = 10 V, ID = 0.5 A)
Forward Transconductance(1)
(VDS = 10 V, ID = 0.5 A)

rDS(on)

10
10

300

1. Pulse Test; Pulse Width < 300 s, Duty Cycle

gfs

mS

v 2.0%.

REV 1

4108

Motorola SmallSignal Transistors, FETs and Diodes Device Data

VN2410L
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

Ciss

125

pF

Coss

50

pF

Crss

20

pF

t(on)

8.0

ns

t(r)

8.0

ns

t(off)

23

ns

t(f)

34

ns

DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance

(VDS = 25 Vdc,
Vd VGS = 0,
0
f = 1.0 MHz)

Reverse Transfer Capacitance

SWITCHING CHARACTERISTICS
TurnOn Time
(VDD = 60 Vdc,
Vd ID = 0.4
0 4 A,
A
RL = 150 , RG = 25 )
TurnOff Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4109

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFETs General Purpose


NChannel Depletion

2N5457

1 DRAIN

*Motorola Preferred Device

3
GATE

2 SOURCE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Source Voltage

VDS

25

Vdc

Drain Gate Voltage

VDG

25

Vdc

VGSR

25

Vdc

Gate Current

IG

10

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

310
2.82

mW
mW/C

Junction Temperature Range

TJ

125

Tstg

65 to +150

Reverse Gate Source Voltage

Storage Channel Temperature Range

1
2

CASE 2904, STYLE 5


TO92 (TO226AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)GSS

25

Vdc

1.0
200

OFF CHARACTERISTICS
Gate Source Breakdown Voltage
(IG = 10 Adc, VDS = 0)
Gate Reverse Current
(VGS = 15 Vdc, VDS = 0)
(VGS = 15 Vdc, VDS = 0, TA = 100C)

IGSS

nAdc

Gate Source Cutoff Voltage


(VDS = 15 Vdc, ID = 10 nAdc)

VGS(off)

0.5

6.0

Vdc

Gate Source Voltage


(VDS = 15 Vdc, ID = 100 mAdc)

VGS

2.5

Vdc

IDSS

1.0

3.0

5.0

mAdc

Forward Transfer Admittance Common Source (1)


(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

yfs

1000

5000

mmhos

Output Admittance Common Source (1)


(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

yos

10

50

mmhos

Input Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

4.5

7.0

pF

Reverse Transfer Capacitance


(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Crss

1.5

3.0

pF

ON CHARACTERISTICS
Zero Gate Voltage Drain Current (1)
(VDS = 15 Vdc, VGS = 0)

SMALL SIGNAL CHARACTERISTICS

1. Pulse Test; Pulse Width

v 630 ms, Duty Cycle v 10%.

Preferred devices are Motorola recommended choices for future use and best overall value.

4110

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5457
TYPICAL CHARACTERISTICS

14
VDS = 15 V
VGS = 0
RS = 1 M

VDS = 15 V
VGS = 0
f = 1 kHz

12

NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

10
8
6
4

1
2
0

0.1

0.01

1.0
f, FREQUENCY (kHz)

100

10

0.001

Figure 1. Noise Figure versus Frequency

1.2
VGS(off)

^ 1.2 V

1.2
VGS(off)

VGS = 0 V

^ 1.2 V

1.0
I D , DRAIN CURRENT (mA)

I D , DRAIN CURRENT (mA)

10

Figure 2. Noise Figure versus Source


Resistance

1.0
0.2 V

0.8
0.6

0.4 V

0.4

0.6 V

10
15
20
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

0.8
VDS = 15 V
0.6
0.4
0.2

0.8 V
1.0 V

0.2
0

0.01
0.1
1.0
RS, SOURCE RESISTANCE (Megohms)

25

Figure 3. Typical Drain Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0
1.2

0.8
0.4
VGS, GATE SOURCE VOLTAGE (VOLTS)

Figure 4. Common Source Transfer


Characteristics

4111

2N5457
TYPICAL CHARACTERISTICS

4
VGS(off)

VGS(off)

^ 3.5 V

I D , DRAIN CURRENT (mA)

I D , DRAIN CURRENT (mA)

VGS = 0 V

1 V

2
2 V

^ 3.5 V

3
VDS = 15 V
2

3 V
0

10
15
20
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

0
5

25

Figure 5. Typical Drain Characteristics

^ 5.8 V

VGS = 0 V
I D , DRAIN CURRENT (mA)

I D , DRAIN CURRENT (mA)

10

VGS(off)

1 V
6
2 V
4
3 V
2

Figure 6. Common Source Transfer


Characteristics

10

3
2
1
4
VGS, GATE SOURCE VOLTAGE (VOLTS)

4 V

VGS(off)

^ 5.8 V

6
VDS = 15 V
4

5 V
0
0

10
15
20
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

Figure 7. Typical Drain Characteristics

25

0
7

5
4
3
2
1
VGS, GATE SOURCE VOLTAGE (VOLTS)

Figure 8. Common Source Transfer


Characteristics

Note: Graphical data is presented for dc conditions. Tabular


data is given for pulsed conditions (Pulse Width = 630
ms, Duty Cycle = 10%). Under dc conditions, self heating in higher IDSS units reduces IDSS.

4112

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET Amplifiers

PChannel Depletion

2N5460
2N5461
2N5462

2 DRAIN

3
GATE

1 SOURCE

MAXIMUM RATINGS
Rating
Drain Gate Voltage

Symbol

Value

Unit

VDG

40

Vdc

VGSR

40

Vdc

IG(f)

10

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Junction Temperature Range

TJ

65 to +135

Tstg

65 to +150

Reverse Gate Source Voltage


Forward Gate Current

Storage Channel Temperature Range

1
2

CASE 2904, STYLE 7


TO92 (TO226AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)GSS

40

Vdc

2N5460, 2N5461, 2N5462

5.0

nAdc

2N5460, 2N5461, 2N5462

1.0

Adc

0.75
1.0
1.8

6.0
7.5
9.0

Vdc

0.5
0.8
1.5

4.0
4.5
6.0

OFF CHARACTERISTICS
Gate Source Breakdown Voltage
(IG = 10 Adc, VDS = 0)
Gate Reverse Current
(VGS = 20 Vdc, VDS = 0)
(VGS = 30 Vdc, VDS = 0)
(VGS = 20 Vdc, VDS = 0, TA = 100C)
(VGS = 30 Vdc, VDS = 0, TA = 100C)

2N5460, 2N5461, 2N5462


IGSS

Gate Source Cutoff Voltage


(VDS = 15 Vdc, ID = 1.0 Adc)

2N5460
2N5461
2N5462

Gate Source Voltage


(VDS = 15 Vdc, ID = 0.1 mAdc)
(VDS = 15 Vdc, ID = 0.2 mAdc)
(VDS = 15 Vdc, ID = 0.4 mAdc)

2N5460
2N5461
2N5462

VGS(off)

VGS

Vdc

ON CHARACTERISTICS
Zero Gate Voltage Drain Current
(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

2N5460
2N5461
2N5462

IDSS

1.0
2.0
4.0

5.0
9.0
16

mAdc

2N5460
2N5461
2N5462

yfs

1000
1500
2000

4000
5000
6000

mmhos

Output Admittance (VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

yos

75

mmhos

Input Capacitance (VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

5.0

7.0

pF

Reverse Transfer Capacitance (VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Crss

1.0

2.0

pF

Noise Figure
(VDS = 15 Vdc, VGS = 0, RG = 1.0 Megohm, f = 100 Hz, BW = 1.0 Hz)

NF

1.0

2.5

dB

Equivalent ShortCircuit Input Noise Voltage


(VDS = 15 Vdc, VGS = 0, f = 100 Hz, BW = 1.0 Hz)

en

60

115

nV Hz

SMALL SIGNAL CHARACTERISTICS


Forward Transfer Admittance
(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

FUNCTIONAL CHARACTERISTICS

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4113

2N5460 2N5461 2N5462


FORWARD TRANSFER ADMITTANCE
versus DRAIN CURRENT

4.0
VDS = 15 V

I D, DRAIN CURRENT (mA)

3.5
3.0
2.5
TA = 55C

2.0

25C

1.5

125C
1.0
0.5
0
0

0.2

0.4 0.6 0.8


1.0
1.2 1.4
1.6
VGS, GATESOURCE VOLTAGE (VOLTS)

1.8

2.0

Yfs FORWARD TRANSFER ADMITTANCE (m mhos)

DRAIN CURRENT versus GATE


SOURCE VOLTAGE
4000
3000
2000

1000
700
500
VDS = 15 V
f = 1.0 kHz

300
200
0.2

0.3

10

I D, DRAIN CURRENT (mA)

VDS = 15 V

8.0
TA = 55C

7.0
6.0

25C
125C

5.0
4.0
3.0
2.0
1.0

4.0

0.5

1.5
2.0
2.5
3.0
1.0
VGS, GATESOURCE VOLTAGE (VOLTS)

3.5

4.0

7000
5000
3000
2000

1000
VDS = 15 V
f = 1.0 kHz

700
500
0.5

0.7

1.0

2.0
3.0
ID, DRAIN CURRENT (mA)

5.0

7.0

Figure 5. VGS(off) = 4.0 Volts

16

Yfs FORWARD TRANSFER ADMITTANCE (m mhos)

Figure 2. VGS(off) = 4.0 Volts

10000

VDS = 15 V

14
I D, DRAIN CURRENT (mA)

3.0

10000

9.0

2.0

Figure 4. VGS(off) = 2.0 Volts


Yfs FORWARD TRANSFER ADMITTANCE (m mhos)

Figure 1. VGS(off) = 2.0 Volts

0.5
0.7
1.0
ID, DRAIN CURRENT (mA)

12
TA = 55C

10
8.0

25C
125C

6.0
4.0
2.0
0
0

1.0

2.0
3.0
4.0
5.0
6.0
VGS, GATESOURCE VOLTAGE (VOLTS)

Figure 3. VGS(off) = 5.0 Volts

4114

7.0

8.0

7000
5000
3000
2000

1000
VDS = 15 V
f = 1.0 kHz

700
500
0.5

0.7

1.0

2.0
3.0
ID, DRAIN CURRENT (mA)

5.0

7.0

10

Figure 6. VGS(off) = 5.0 Volts

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5460 2N5461 2N5462


10
VDS = 15 V
f = 1.0 kHz

8.0

300
200
IDSS = 3.0 mA
100
70
50

6.0 mA
10 mA

30

7.0
6.0

Ciss

5.0
4.0
3.0
2.0

20
10
0.1

f = 1.0 MHz
VGS = 0

9.0
C, CAPACITANCE (pF)

r oss , OUTPUT RESISTANCE (k ohms)

1000
700
500

Coss

1.0

Crss

0
0.5
1.0
2.0
ID, DRAIN CURRENT (mA)

0.2

5.0

10

Figure 7. Output Resistance


versus Drain Current

40

Figure 8. Capacitance versus


DrainSource Voltage

5.0

10
VDS = 15 V
VGS = 0
RG = 1.0 Megohm

4.0

3.0

2.0

9.0
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

10
20
30
VDS, DRAINSOURCE VOLTAGE (VOLTS)

1.0

VDS = 15 V
VGS = 0
f = 100 Hz

8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0

0
10

20 30 50

100 200 300 500 1000 2000 3000


f, FREQUENCY (Hz)

0
1.0

10,000

Figure 9. Noise Figure versus Frequency

10
100
1000
RS, SOURCE RESISTANCE (k Ohms)

Figure 10. Noise Figure versus


Source Resistance

COMMON SOURCE
y PARAMETERS FOR FREQUENCIES
BELOW 30 MHz

vi
Crss
Ciss

10,000

ross

Coss

| yfs | vi

yis = j Ciss
yos = j Cosp * + 1/ross
yfs = yfs |
yrs = j Crss

* Cosp is Coss in parallel with Series Combination of Ciss and Crss.

NOTE:
1. Graphical data is presented for dc conditions. Tabular
data is given for pulsed conditions (Pulse Width = 630 ms,
Duty Cycle = 10%).

Figure 11. Equivalent Low Frequency Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4115

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA


JFET VHF/UHF Amplifiers

NChannel Depletion

2N5484

1 DRAIN

2N5486
3
GATE

2 SOURCE

MAXIMUM RATINGS
Rating
Drain Gate Voltage
Reverse Gate Source Voltage
Drain Current
Forward Gate Current
Total Device Dissipation @ TC = 25C
Derate above 25C
Operating and Storage Junction
Temperature Range

Symbol

Value

Unit

VDG

25

Vdc

VGSR

25

Vdc

ID

30

mAdc

IG(f)

10

mAdc

PD

350
2.8

mW
mW/C

TJ, Tstg

65 to +150

1
2

CASE 2904, STYLE 5


TO92 (TO226AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)GSS

25

Vdc

1.0
0.2

nAdc
Adc

0.3
2.0

3.0
6.0

1.0
8.0

5.0
20

3000
4000

6000
8000

100
1000

50
75

75
100

2500
3500

OFF CHARACTERISTICS
Gate Source Breakdown Voltage
(IG = 1.0 Adc, VDS = 0)
Gate Reverse Current
(VGS = 20 Vdc, VDS = 0)
(VGS = 20 Vdc, VDS = 0, TA = 100C)
Gate Source Cutoff Voltage
(VDS = 15 Vdc, ID = 10 nAdc)

IGSS

VGS(off)
2N5484
2N5486

Vdc

ON CHARACTERISTICS
Zero Gate Voltage Drain Current
(VDS = 15 Vdc, VGS = 0)

2N5484
2N5486

IDSS

mAdc

SMALL SIGNAL CHARACTERISTICS


Forward Transfer Admittance
(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)
Input Admittance
(VDS = 15 Vdc, VGS = 0, f = 100 MHz)
(VDS = 15 Vdc, VGS = 0, f = 400 MHz)
Output Admittance
(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

mmhos

Re(yis)
2N5484
2N5486

mmhos

yos
2N5484
2N5486

Output Conductance
(VDS = 15 Vdc, VGS = 0, f = 100 MHz)
(VDS = 15 Vdc, VGS = 0, f = 400 MHz)

2N5484
2N5486

Forward Transconductance
(VDS = 15 Vdc, VGS = 0, f = 100 MHz)
(VDS = 15 Vdc, VGS = 0, f = 400 MHz)

2N5484
2N5486

4116

mmhos

yfs
2N5484
2N5486

mmhos

Re(yos)

mmhos

Re(yfs)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5484 2N5486
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

Input Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

5.0

pF

Reverse Transfer Capacitance


(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Crss

1.0

pF

Output Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Coss

2.0

pF

4.0

2.5
3.0

2.0
4.0

16

18
10

14

25

30
20

SMALL SIGNAL CHARACTERISTICS (continued)

FUNCTIONAL CHARACTERISTICS
Noise Figure
(VDS = 15 Vdc, VGS = 0, RG = 1.0 Megohm, f = 1.0 kHz)
(VDS = 15 Vdc, ID = 1.0 mAdc, RG 1.0 k, f = 100 MHz)
(VDS = 15 Vdc, ID = 1.0 mAdc, RG 1.0 k, f = 200 MHz)
(VDS = 15 Vdc, ID = 4.0 mAdc, RG 1.0 k, f = 100 MHz)
(VDS = 15 Vdc, ID = 4.0 mAdc, RG 1.0 k, f = 400 MHz)

NF
2N5484
2N5484
2N5486
2N5486

Common Source Power Gain


(VDS = 15 Vdc, ID = 1.0 mAdc, f = 100 MHz)
(VDS = 15 Vdc, ID = 1.0 mAdc, f = 200 MHz)
(VDS = 15 Vdc, ID = 4.0 mAdc, f = 100 MHz)
(VDS = 15 Vdc, ID = 4.0 mAdc, f = 400 MHz)

2N5484
2N5484
2N5486
2N5486

dB

Gps

dB

POWER GAIN
24
f = 100 MHz

PG , POWER GAIN (dB)

20

16

12

400 MHz
Tchannel = 25C
VDS = 15 Vdc
VGS = 0 V

8.0
4.0
0

2.0

4.0
6.0
8.0
10
ID, DRAIN CURRENT (mA)

12

14

Figure 1. Effects of Drain Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4117

2N5484 2N5486
NEUTRALIZING
COIL
INPUT
TO 50
SOURCE

C2

L1

C4
C5
Rg

*L2
*L3

7.0 pF

1.8 pF

C2

1000 pF

17 pF

TO 500
LOAD

L2

C6

C7
COMMON
VDS
+15 V

VGS

*L1

400 MHz

C1

CASE

L3

NOTE:

Adjust VGS for


ID = 50 mA
VGS < 0 Volts

100 MHz

C3

C1

ID = 5.0 mA

The noise source is a hotcold body


(AIL type 70 or equivalent) with a
test receiver (AIL type 136 or equivalent).
**L1

17 turns, (approx. depends upon circuit layout) AWG #28


enameled copper wire, close wound on 9/32 ceramic coil
form. Tuning provided by a powdered iron slug.
41/2 turns, AWG #18 enameled copper wire, 5/16 long,
3/8 I.D. (AIR CORE).
31/2 turns, AWG #18 enameled copper wire, 1/4 long,
3/8 I.D. (AIR CORE).

**L2
**L3

VALUE

Reference
Designation

C3

3.0 pF

1.0 pF

C4

112 pF

0.88.0 pF

C5

112 pF

0.88.0 pF

C6

0.0015 F

0.001 F

C7

0.0015 F

0.001 F

L1

3.0 H*

0.2 H**

L2

0.15 H*

0.03 H**

L3

0.14 H*

0.022 H**

6 turns, (approx. depends upon circuit layout) AWG #24


enameled copper wire, close wound on 7/32 ceramic coil
form. Tuning provided by an aluminum slug.
1 turn, AWG #16 enameled copper wire, 3/8 I.D.
(AIR CORE).
1/2 turn, AWG #16 enameled copper wire, 1/4 I.D.
(AIR CORE).

Figure 2. 100 MHz and 400 MHz Neutralized Test Circuit

NOISE FIGURE
(Tchannel = 25C)
6.5

10
ID = 5.0 mA
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

VDS = 15 V
VGS = 0 V

5.5

8.0

6.0
f = 400 MHz
4.0

2.0

4.5
f = 400 MHz
3.5

2.5

100 MHz

100 MHz

1.5

0
0

2.0

16
4.0 6.0 8.0
10
12
14
VDS, DRAINSOURCE VOLTAGE (VOLTS)

18

20

2.0

Figure 3. Effects of DrainSource Voltage

4.0
6.0
8.0
10
ID, DRAIN CURRENT (mA)

12

14

Figure 4. Effects of Drain Current

INTERMODULATION CHARACTERISTICS
Pout , OUTPUT POWER PER TONE (dB)

+ 40
3RD ORDER INTERCEPT

+ 20
VDS = 15 Vdc
f1 = 399 MHz
f2 = 400 MHz

0
20
40
60
80
100

FUNDAMENTAL
OUTPUT @ IDSS,
0.25 IDSS

120
140
160
120

100

3RD ORDER IMD


OUTPUT @ IDSS,
0.25 IDSS

80
60
40
20
Pin, INPUT POWER PER TONE (dB)

+ 20

Figure 5. Third Order Intermodulation Distortion

4118

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5484 2N5486
COMMON SOURCE CHARACTERISTICS

30
20
bis @ IDSS

10
7.0
5.0
3.0

gis @ IDSS

2.0
gis @ 0.25 IDSS
1.0
0.7
0.5
0.3
10

bis @ 0.25 IDSS


20

30

50 70 100
200 300
f, FREQUENCY (MHz)

grs , REVERSE TRANSADMITTANCE (mmhos)


brs , REVERSE SUSCEPTANCE (mmhos)

gis, INPUT CONDUCTANCE (mmhos)


bis, INPUT SUSCEPTANCE (mmhos)

ADMITTANCE PARAMETERS
(VDS = 15 Vdc, Tchannel = 25C)

500 700 1000

5.0
3.0
2.0
brs @ IDSS
1.0
0.7
0.5

0.25 IDSS

0.3
0.2
0.1
0.07
0.05

grs @ IDSS, 0.25 IDSS


10

20

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

10

10
7.0
5.0

gfs @ IDSS
gfs @ 0.25 IDSS

3.0
2.0
1.0
0.7
0.5
0.3
0.2
10

30

Figure 7. Reverse Transfer Admittance (yrs)

|bfs| @ IDSS
|bfs| @ 0.25 IDSS

gos, OUTPUT ADMITTANCE (mhos)


bos, OUTPUT SUSCEPTANCE (mhos)

gfs, FORWARD TRANSCONDUCTANCE (mmhos)


|b fs|, FORWARD SUSCEPTANCE (mmhos)

Figure 6. Input Admittance (yis)

20

5.0
bos @ IDSS and 0.25 IDSS

2.0
1.0
0.5
0.2

gos @ IDSS

0.1
0.05
gos @ 0.25 IDSS

0.02
0.01
20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 8. Forward Transadmittance (yfs)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 9. Output Admittance (yos)

4119

2N5484 2N5486
COMMON SOURCE CHARACTERISTICS
SPARAMETERS
(VDS = 15 Vdc, Tchannel = 25C, Data Points in MHz)
30

20

10

0
1.0

40

350
100

340

330
320

40

310

50

20

10

340

330

0.4

320

0.3
400

310

ID = IDSS, 0.25 IDSS

300
0.8

900

500

ID = IDSS

60

800
300

400

60

500

0.7

600
0.6

300
0.1

500

70

290

400

700
800

700
800

290

0.2
700

600

600

80

350

300

200

50

70

200

100
0.9

30

ID = 0.25 IDSS

280

80

300

280

0.0

200

900

270

90

100

260

100

260

110

250

110

250

120

240

120

240

130

230

130

230

140

220

140

220

90

900

150

160

170

180

190

200

210

150

160

Figure 10. S11s


30

20

10

350

170

340

330

30

20

10

80
90

700

500

0.3
ID = 0.25 IDSS
500

0
350
340
330
100 200
ID = 0.25 IDSS
300
1.0
400
100 200
500
300
600
400
700
0.9
500
800
600
ID = IDSS
700
900
800
900
0.8

310

50

300

60

290

70

280

80

270

90

270

260

100

260

250

110

250

240

120

240

230

130

230

220

140

220

320

310

300
0.7

290

0.3

280

0.6

100

400

400

110

0.4

800

600
100

210

900
700

600

200

40

0.5
60
900

190

320

0.6
50

800

180

Figure 11. S12s

40

70

270

100

300

200

0.4

100

0.5

300
120

ID = IDSS

200

130
0.6

140
150

160

170

180

190

Figure 12. S21s


4120

200

210

150

160

170

180

190

200

210

Figure 13. S22s


Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5484 2N5486
COMMON GATE CHARACTERISTICS
ADMITTANCE PARAMETERS
(VDG = 15 Vdc, Tchannel = 25C)

10
7.0
5.0

grg , REVERSE TRANSADMITTANCE (mmhos)


brg , REVERSE SUSCEPTANCE (mmhos)

gig, INPUT CONDUCTANCE (mmhos)


big, INPUT SUSCEPTANCE (mmhos)

20

gig @ IDSS
grg @ 0.25 IDSS

3.0
2.0
1.0
0.7
0.5

big @ IDSS
big @ 0.25 IDSS

0.3
0.2

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

0.5
0.3

0.1
0.07
0.05
0.25 IDSS

0.03
0.02
0.01

0.007
0.005

500 700 1000

brg @ IDSS

0.2

gig @ IDSS, 0.25 IDSS


10

10
7.0
5.0

gfg @ IDSS

3.0

gfg @ 0.25 IDSS

2.0
1.0
0.7
0.5
bfg @ IDSS

0.3

brg @ 0.25 IDSS

0.2

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 15. Reverse Transfer Admittance (yrg)

gog, OUTPUT ADMITTANCE (mmhos)


bog, OUTPUT SUSCEPTANCE (mmhos)

gfg , FORWARD TRANSCONDUCTANCE (mmhos)


bfg , FORWARD SUSCEPTANCE (mmhos)

Figure 14. Input Admittance (yig)

20

1.0
0.7
0.5

bog @ IDSS, 0.25 IDSS

0.3
0.2
0.1
0.07
0.05

gog @ IDSS

0.03
0.02
gog @ 0.25 IDSS

0.1

0.01
10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 16. Forward Transfer Admittance (yfg)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 17. Output Admittance (yog)

4121

2N5484 2N5486
COMMON GATE CHARACTERISTICS
SPARAMETERS
(VDS = 15 Vdc, Tchannel = 25C, Data Points in MHz)
30

20

10

350

340

330

30

0.7

40

100

310

50

300

60

290

70

280

80

350

340

330
320

0.04

200

300

0.03

400

100

500
200

0.5

ID = IDSS
0.4

310

600

300

60
70

40

10

ID = 0.25 IDSS

0.6
50

320

20

0.02

700

400
500

300

800

600
900

0.01

290

700
80

800

0.3

900

90

270

100

260

90

250

270

500
600

100
ID = IDSS

110

280

0.0
100

110

700

600
700

260

ID = 0.25 IDSS

250

0.01

800
240

120

120

240

800
0.02
900

230

130

230

130
900

220

140
150

160

170

180

190

200

140

210

20

10

350

150

160

170

180

190

200

210

340

330

Figure 19. S12g

340

330

30

0.5

40

220

0.04

Figure 18. S11g

30

0.03

320

20

10

40

0
1.5
1.0
100

100
0.4
ID = IDSS

350
300
200

500

320

400

700
600
800

0.9

900

310

50

300

60

290

70

280

80

270

90

270

100

260

100

260

110

250

110

250

120

240

120

240

130

230

130

230

140

220

140

220

50

100

ID = IDSS, 0.25 IDSS

0.3

0.8

60
0.2

70

310

ID = 0.25 IDSS

80
0.1

300
0.7

290
280

0.6

900

90
900

150

160

170

180

190

Figure 20. S21g


4122

200

210

150

160

170

180

190

200

210

Figure 21. S22g


Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET Switching

NChannel Depletion

2N5555

1 DRAIN

3
GATE

2 SOURCE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Source Voltage

VDS

25

Vdc

Drain Gate Voltage

VDG

25

Vdc

Gate Source Voltage

VGS

25

Vdc

Forward Gate Current

IGF

10

mAdc

Total Device Dissipation @ TC = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Junction Temperature Range

TJ

65 to +150

Storage Temperature Range

Tstg

65 to +150

1
2

CASE 2904, STYLE 5


TO92 (TO226AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

V(BR)GSS

25

Vdc

Gate Reverse Current (VGS = 15 Vdc, VDS = 0)

IGSS

1.0

nAdc

Drain Cutoff Current (VDS = 12 Vdc, VGS = 10 V)


Drain Cutoff Current (VDS = 12 Vdc, VGS = 10 V, TA = 100C)

ID(off)

10
2.0

nAdc
Adc

IDSS

15

mAdc

VGS(f)

1.0

Vdc

DrainSource OnVoltage
(ID = 7.0 mAdc, VGS = 0)

VDS(on)

1.5

Vdc

Static DrainSource On Resistance


(ID = 0.1 mAdc, VGS = 0)

rDS(on)

150

Ohms

rds(on)

150

Ohms

Input Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

5.0

pF

Reverse Transfer Capacitance


(VDS = 0, VGS = 10 Vdc, f = 1.0 MHz)

Crss

1.2

pF

(VDD = 10 Vdc, ID(on)


( ) = 7.0 mAdc,
VGS(on) = 0
0, VGS(off) = 10
10 Vdc)
Vd ) (See
(S Figure
Fi
1)

td(on)

5.0

ns

tr

5.0

ns

(VDD = 10 Vdc, ID(on)


( ) = 7.0 mAdc,
VGS(on) = 0
0, VGS(off) = 10
10 Vdc)
Vd ) (See
(S Figure
Fi
1)

td(off)

15

ns

tf

10

ns

Characteristic

OFF CHARACTERISTICS
Gate Source Breakdown Voltage (IG = 10 Adc, VDS = 0)

ON CHARACTERISTICS
Zero Gate Voltage Drain Current(1)
(VDS = 15 Vdc, VGS = 0)
GateSource Forward Voltage
(IG(f) = 1.0 mAdc, VDS = 0)

SMALL SIGNAL CHARACTERISTICS


SmallSignal DrainSource ON Resistance
(VGS = 0, ID = 0, f = 1.0 kHz)

SWITCHING CHARACTERISTICS
TurnOn Delay Time
Rise Time
TurnOff Delay Time
Fall Time

1. Pulse Test: Pulse Width < 300 s, Duty Cycle < 3.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4123

2N5555
PULSE WIDTH
90%

VDD
TEKTRONIX
567
SAMPLING
SCOPE

50 OHM
COAXIAL
CABLE

1.0 k
10 k
PULSE
GENERATOR
(50 OHMS)

INPUT

50%
10%

INPUT PULSE
RISE TIME

50 OHM COAXIAL CABLE


1.0 k

VGS(on)

90%

50%
10%

VGS(off)

INPUT PULSE
FALL TIME

Rin =
50 OHMS

50

td(on)
OUTPUT

td(off)
10%

INPUT PULSE
RISE TIME < 1.0 ns
FALL TIME < 1.0 ns
NOMINAL VALUE OF ON PULSE WIDTH = 400 ns
DUTY CYCLE 1.0%
GENERATOR SOURCE IMPEDANCE = 50 OHMS

10%
90%

90%

tr

tf

Figure 1. Switching Times Test Circuit

POWER GAIN
24
f = 100 MHz

PG , POWER GAIN (dB)

20

16

12

400 MHz
Tchannel = 25C
VDS = 15 Vdc
VGS = 0 V

8.0
4.0
0

4.0
6.0
8.0
10
ID, DRAIN CURRENT (mA)

2.0

12

14

Figure 2. Effects of Drain Current

NEUTRALIZING
COIL
INPUT
TO 50
SOURCE

C2

L1

C1

C4
C5
Rg

Adjust VGS for


ID = 50 mA
VGS < 0 Volts

*L2
*L3

TO 500
LOAD

L2

CASE

L3
C6

C7
VGS

*L1

C3

NOTE:

COMMON
VDS
+15 V

ID = 5.0 mA

The noise source is a hotcold body


(AIL type 70 or equivalent) with a
test receiver (AIL type 136 or equivalent).

17 turns, (approx. depends upon circuit layout) AWG #28


enameled copper wire, close wound on 9/32 ceramic coil
form. Tuning provided by a powdered iron slug.
41/2 turns, AWG #18 enameled copper wire, 5/16 long,
3/8 I.D. (AIR CORE).
31/2 turns, AWG #18 enameled copper wire, 1/4 long,
3/8 I.D. (AIR CORE).

**L1

**L2
**L3

VALUE

Reference
Designation

100 MHz

400 MHz

C1

7.0 pF

1.8 pF

C2

1000 pF

17 pF

C3

3.0 pF

1.0 pF

C4

112 pF

0.88.0 pF

C5

112 pF

0.88.0 pF

C6

0.0015 F

0.001 F

C7

0.0015 F

0.001 F

L1

3.0 H*

0.2 H**

L2

0.15 H*

0.03 H**

L3

0.14 H*

0.022 H**

6 turns, (approx. depends upon circuit layout) AWG #24


enameled copper wire, close wound on 7/32 ceramic coil
form. Tuning provided by an aluminum slug.
1 turn, AWG #16 enameled copper wire, 3/8 I.D.
(AIR CORE).
1/2 turn, AWG #16 enameled copper wire, 1/4 I.D.
(AIR CORE).

Figure 3. 100 MHz and 400 MHz Neutralized Test Circuit

4124

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5555
NOISE FIGURE
(Tchannel = 25C)
10

6.5
ID = 5.0 mA

VDS = 15 V
VGS = 0 V

5.5
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

8.0

6.0
f = 400 MHz
4.0

2.0

4.5
f = 400 MHz
3.5

2.5

100 MHz

100 MHz

1.5
0

2.0

4.0 6.0 8.0


10
12
14
16
VDS, DRAINSOURCE VOLTAGE (VOLTS)

18

20

2.0

Figure 4. Effects of DrainSource Voltage

4.0
6.0
8.0
10
ID, DRAIN CURRENT (mA)

12

14

Figure 5. Effects of Drain Current

INTERMODULATION CHARACTERISTICS
Pout , OUTPUT POWER PER TONE (dB)

+ 40
3RD ORDER INTERCEPT

+ 20
VDS = 15 Vdc
f1 = 399 MHz
f2 = 400 MHz

0
20
40
60
80
100

FUNDAMENTAL
OUTPUT @ IDSS,
0.25 IDSS

120
140
160
120

100

3RD ORDER IMD


OUTPUT @ IDSS,
0.25 IDSS

80
60
40
20
Pin, INPUT POWER PER TONE (dB)

+ 20

Figure 6. Third Order Intermodulation Distortion

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4125

2N5555
COMMON SOURCE CHARACTERISTICS

30
20

grs , REVERSE TRANSADMITTANCE (mmhos)


brs , REVERSE SUSCEPTANCE (mmhos)

gis, INPUT CONDUCTANCE (mmhos)


bis, INPUT SUSCEPTANCE (mmhos)

ADMITTANCE PARAMETERS
(VDS = 15 Vdc, Tchannel = 25C)

bis @ IDSS

10
7.0
5.0
3.0

gis @ IDSS

2.0
gis @ 0.25 IDSS
1.0
0.7
0.5
0.3
10

bis @ 0.25 IDSS


20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

5.0
3.0
2.0
brs @ IDSS
1.0
0.7
0.5

0.25 IDSS

0.3
0.2
0.1
0.07
0.05

grs @ IDSS, 0.25 IDSS


10

20

gfs @ IDSS
gfs @ 0.25 IDSS

3.0
2.0
1.0
0.7
0.5

|bfs| @ IDSS
|bfs| @ 0.25 IDSS

500 700 1000

5.0
bos @ IDSS and 0.25 IDSS

2.0
1.0
0.5
0.2

gos @ IDSS

0.1
0.05
gos @ 0.25 IDSS

0.02
0.01
20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 9. Forward Transadmittance (yfs)

4126

50 70 100
200 300
f, FREQUENCY (MHz)

10

10
7.0
5.0

0.3
0.2
10

30

Figure 8. Reverse Transfer Admittance (yrs)

gos, OUTPUT ADMITTANCE (mhos)


bos, OUTPUT SUSCEPTANCE (mhos)

gfs, FORWARD TRANSCONDUCTANCE (mmhos)


|b fs|, FORWARD SUSCEPTANCE (mmhos)

Figure 7. Input Admittance (yis)

20

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 10. Output Admittance (yos)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5555
COMMON SOURCE CHARACTERISTICS
SPARAMETERS
(VDS = 15 Vdc, Tchannel = 25C, Data Points in MHz)
30

20

10

0
1.0

40

350
100

340

330
320

40

310

50

20

10

340

330

0.4

320

0.3
400

310

ID = IDSS, 0.25 IDSS

300
0.8

900

500

ID = IDSS

60

800
300

400

60

500

0.7

600
0.6

300
0.1

500

70

290

400

700
800

700
800

290

0.2
700

600

600

80

350

300

200

50

70

200

100
0.9

30

ID = 0.25 IDSS

280

80

300

280

0.0

200

900

270

90

100

260

100

260

110

250

110

250

120

240

120

240

130

230

130

230

140

220

140

220

90

900

150

160

170

180

190

200

210

150

160

Figure 11. S11s


30

20

10

350

170

340

330

30

20

10

80
90

700

110

0.4

800

600
100

210

0
350
340
330
100 200
ID = 0.25 IDSS
300
1.0
400
100 200
500
300
600
400
700
0.9
500
800
600
ID = IDSS
700
900
800
900
0.8

310

50

300

60

290

70

280

80

270

90

270

260

100

260

250

110

250

240

120

240

230

130

230

220

140

220

320

310

300
0.7

290

900
700

600

200

40

0.5
60
900

190

320

0.6
50

800

180

Figure 12. S12s

40

70

270

100

500

0.3
ID = 0.25 IDSS
500

0.3
100

400

400

280

0.6

300

200

0.4

100

0.5

300
120

ID = IDSS

200

130
0.6

140
150

160

170

180

190

200

210

Figure 13. S21s


Motorola SmallSignal Transistors, FETs and Diodes Device Data

150

160

170

180

190

200

210

Figure 14. S22s


4127

2N5555
COMMON GATE CHARACTERISTICS
ADMITTANCE PARAMETERS
(VDG = 15 Vdc, Tchannel = 25C)

10
7.0
5.0

grg , REVERSE TRANSADMITTANCE (mmhos)


brg , REVERSE SUSCEPTANCE (mmhos)

gig, INPUT CONDUCTANCE (mmhos)


big, INPUT SUSCEPTANCE (mmhos)

20

gig @ IDSS
grg @ 0.25 IDSS

3.0
2.0
1.0
0.7
0.5

big @ IDSS
big @ 0.25 IDSS

0.3
0.2

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

0.5
0.3
brg @ IDSS

0.2
0.1
0.07
0.05

0.25 IDSS

0.03
0.02
0.01

0.007
0.005

gig @ IDSS, 0.25 IDSS


10

10
7.0
5.0

gfg @ IDSS

3.0

gfg @ 0.25 IDSS

2.0
1.0
0.7
0.5
bfg @ IDSS

0.3

brg @ 0.25 IDSS

0.2

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 16. Reverse Transfer Admittance (yrg)

gog, OUTPUT ADMITTANCE (mmhos)


bog, OUTPUT SUSCEPTANCE (mmhos)

gfg , FORWARD TRANSCONDUCTANCE (mmhos)


bfg , FORWARD SUSCEPTANCE (mmhos)

Figure 15. Input Admittance (yig)

20

1.0
0.7
0.5

bog @ IDSS, 0.25 IDSS

0.3
0.2
0.1
0.07
0.05

gog @ IDSS

0.03
0.02
gog @ 0.25 IDSS

0.1

0.01
10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 17. Forward Transfer Admittance (yfg)

4128

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 18. Output Admittance (yog)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5555
COMMON GATE CHARACTERISTICS
SPARAMETERS
(VDS = 15 Vdc, Tchannel = 25C, Data Points in MHz)
30

20

10

350

340

330

30

0.7

40

100

310

50

300

60

290

70

280

80

350

340

330
320

0.04

200

300

0.03

400

100

500
200

0.5

ID = IDSS
0.4

310

600

300

60
70

40

10

ID = 0.25 IDSS

0.6
50

320

20

0.02

700

400
500

300

800

600
900

0.01

290

700
80

800

0.3

900

90

270

100

260

90

250

270

500
600

100
ID = IDSS

110

280

0.0
100

110

700

600
700

260

ID = 0.25 IDSS

250

0.01

800
240

120

120

240

800
0.02
900

230

130

230

130
900

220

140
150

160

170

180

190

200

140

210

20

10

350

150

160

170

180

190

200

210

340

330

Figure 20. S12g

340

330

30

0.5

40

220

0.04

Figure 19. S11g

30

0.03

320

20

10

40

0
1.5
1.0
100

100
0.4
ID = IDSS

350
300
200

500

320

400

700
600
800

0.9

900

310

50

300

60

290

70

280

80

270

90

270

100

260

100

260

110

250

110

250

120

240

120

240

130

230

130

230

140

220

140

220

50

100

ID = IDSS, 0.25 IDSS

0.3

0.8

60
0.2

70

310

ID = 0.25 IDSS

80
0.1

300
0.7

290
280

0.6

900

90
900

150

160

170

180

190

200

210

Figure 21. S21g


Motorola SmallSignal Transistors, FETs and Diodes Device Data

150

160

170

180

190

200

210

Figure 22. S22g


4129

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFETs Switching

2N5640

NChannel Depletion

1 DRAIN

3
GATE

1
2

2 SOURCE

Rating

Symbol

Value

Unit

VDS

30

Vdc

DrainSource Voltage
DrainGate Voltage

VDG

30

Vdc

VGSR

30

Vdc

Forward Gate Current

IGF

10

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Reverse GateSource Voltage

RqJA

357

C/W

Junction Temperature Range

TJ

65 to +150

Storage Temperature Range

Tstg

65 to +150

Thermal Resistance, Junction to Ambient

CASE 2904, STYLE 5


TO92 (TO226AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)GSS

30

Vdc

1.0
1.0

nAdc
Adc

1.0
1.0

nAdc
Adc

IDSS

5.0

mAdc

DrainSource OnVoltage
(ID = 3.0 mAdc, VGS = 0)

VDS(on)

0.5

Vdc

Static DrainSource On Resistance


(ID = 1.0 mAdc, VGS = 0)

rDS(on)

100

Ohms

OFF CHARACTERISTICS
GateSource Breakdown Voltage (IG = 10 Adc, VDS = 0)
Gate Reverse Current
(VGS = 15 Vdc, VDS = 0)
(VGS = 15 Vdc, VDS = 0, TA = 100C)

IGSS

Drain Cutoff Current


(VDS = 15 Vdc, VGS = 6.0 Vdc)
(VDS = 15 Vdc, VGS = 6.0 Vdc, TA = 100C)

ID(off)

ON CHARACTERISTICS
ZeroGateVoltage Drain Current(1)
(VDS = 20 Vdc, VGS = 0)

1. Pulse Test: Pulse Width

v 300 ms, Duty Cycle v 3.0%.

REV 1

4130

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2N5640
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

rds(on)

100

Ohms

Input Capacitance
(VDS = 0, VGS = 12 Vdc, f = 1.0 MHz)

Ciss

10

pF

Reverse Transfer Capacitance


(VDS = 0, VGS = 12 Vdc, f = 1.0 MHz)

Crss

4.0

pF

ID(on) = 3.0 mAdc

td(on)

8.0

ns

ID(on) = 3.0 mAdc

tr

10

ns

ID(on) = 3.0 mAdc

td(off)

15

ns

ID(on) = 3.0 mAdc

tf

30

ns

SMALLSIGNAL CHARACTERISTICS
Static DrainSource ON Resistance
(VGS = 0, ID = 0, f = 1.0 kHz)

SWITCHING CHARACTERISTICS
TurnOn Delay Time
Rise Time
TurnOff Delay Time
Fall Time

VDD = 10 Vdc
Vdc,
VGS(on) = 0,
VGS(off) = 10 Vdc,
RG = 50

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4131

2N5640
TYPICAL SWITCHING CHARACTERISTICS
1000

TJ = 25C
VGS(off) = 12 V

500
200

200

RK = RD

100
50
20
10
5.0

TJ = 25C
VGS(off) = 12 V

500

t r , RISE TIME (ns)

t d(on), TURNON DELAY TIME (ns)

1000

100

RK = RD

50
20
10

RK = 0

5.0

RK = 0

2.0

2.0

1.0
0.5 0.7 1.0

2.0 3.0
5.0 7.0 10
ID, DRAIN CURRENT (mA)

20

30

1.0
0.5 0.7 1.0

50

2.0 3.0
5.0 7.0 10
ID, DRAIN CURRENT (mA)

Figure 1. TurnOn Delay Time

30

50

30

50

Figure 2. Rise Time

1000

1000
TJ = 25C
VGS(off) = 12 V

500

500

200

TJ = 25C
VGS(off) = 12 V

RK = RD

200

100

t f , FALL TIME (ns)

t d(off) , TURNOFF DELAY TIME (ns)

20

RK = RD

50
20
10

RK = 0

5.0

100
50
20

RK = 0

10
5.0

2.0

2.0

1.0
0.5 0.7 1.0

2.0 3.0
5.0 7.0 10
ID, DRAIN CURRENT (mA)

20

30

1.0
0.5 0.7 1.0

50

Figure 3. TurnOff Delay Time

2.0 3.0
5.0 7.0 10
ID, DRAIN CURRENT (mA)

20

Figure 4. Fall Time

NOTE 1
+VDD
RD
SET VDS(off) = 10 V
INPUT

RK

RT

RGEN
50

OUTPUT
RGG

50
VGEN

INPUT PULSE
tr 0.25 ns
tf 0.5 ns
PULSE WIDTH = 2.0 s
DUTY CYCLE 2.0%

50

VGG

RGG

& RK

+ RRDD)(RTRT))50)50

RD

Figure 5. Switching Time Test Circuit

4132

The switching characteristics shown above were measured using a


test circuit similar to Figure 5. At the beginning of the switching
interval, the gate voltage is at Gate Supply Voltage (VGG). The
DrainSource Voltage (VDS) is slightly lower than Drain Supply
Voltage (VDD) due to the voltage divider. Thus Reverse Transfer
Capacitance (Crss) or GateDrain Capacitance (Cgd) is charged to
VGG + VDS.
During the turnon interval, GateSource Capacitance (C gs)
discharges through the series combination of RGen and RK. Cgd
must discharge to VDS(on) through RG and RK in series with the
parallel combination of effective load impedance (R D ) and
DrainSource Resistance (rds). During the turnoff, this charge flow
is reversed.
Predicting turnon time is somewhat difficult as the channel
resistance rds is a function of the gatesource voltage. While Cgs
discharges, VGS approaches zero and rds decreases. Since Cgd
discharges through rds, turnon time is nonlinear. During turnoff,
the situation is reversed with rds increasing as Cgd charges.
The above switching curves show two impedance conditions;
1) RK is equal to RD, which simulates the switching behavior of
cascaded stages where the driving source impedance is normally
the load impedance of the previous stage, and 2) RK = 0 (low
impedance) the driving source impedance is that of the generator.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

20

15
10
C, CAPACITANCE (pF)

y fs, FORWARD TRANSFER ADMITTANCE (mmhos)

2N5640

10
7.0
5.0

Tchannel = 25C
VDS = 15 V

3.0

Cgs
7.0
5.0

Cgd

3.0
2.0

Tchannel = 25C
(Cds IS NEGLIGIBLE)

1.5
2.0
0.5 0.7

1.0

2.0 3.0
5.0 7.0 10
ID, DRAIN CURRENT (mA)

20

30

1.0
0.03 0.05 0.1

50

Figure 6. Typical Forward Transfer Admittance

IDSS
= 10
160 mA

25
mA

50 mA

75 mA 100 mA

80

Tchannel = 25C

1.0

2.0
3.0
4.0
5.0
6.0
VGS, GATESOURCE VOLTAGE (VOLTS)

7.0

9.0
8.0
7.0

rDS(on) @ VGS = 0

60
50

1.6
1.4
1.2
1.0
0.8
0.6
40

10
20
50
80
110
Tchannel, CHANNEL TEMPERATURE (C)

140

170

10

Tchannel = 25C

80
70

ID = 1.0 mA
VGS = 0

Figure 9. Effect of Temperature On


DrainSource OnState Resistance

6.0
VGS(off)

5.0

40

4.0

30

3.0

20

2.0

10

1.0

VGS, GATESOURCE VOLTAGE (VOLTS)

rds(on), DRAINSOURCE ONSTATE


RESISTANCE (OHMS)

90

1.8

0.4
70

8.0

Figure 8. Effect of GateSource Voltage


On DrainSource Resistance

100

30

2.0

125 mA

120

40

10

Figure 7. Typical Capacitance

rds(on), DRAINSOURCE ONSTATE


RESISTANCE (NORMALIZED)

rds(on), DRAINSOURCE ONSTATE


RESISTANCE (OHMS)

200

0.3 0.5
1.0
3.0 5.0
VR, REVERSE VOLTAGE (VOLTS)

NOTE 2
The ZeroGateVoltage Drain Current (IDSS), is the principle
determinant of other J-FET characteristics. Figure 10 shows
the relationship of GateSource Off Voltage (VGS(off) and
DrainSource On Resistance (rds(on)) to IDSS. Most of the
devices will be within 10% of the values shown in Figure 10.
This data will be useful in predicting the characteristic
variations for a given part number.

0
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
IDSS, ZEROGATEVOLTAGE DRAIN CURRENT (mA)

Figure 10. Effect of IDSS On DrainSource


Resistance and GateSource Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4133

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET Amplifiers

BFR30LT1
BFR31LT1

NChannel

2 SOURCE
3

3
GATE
1
2

1 DRAIN

CASE 318 08, STYLE 10


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Source Voltage

VDS

25

Vdc

Gate Source Voltage

VGS

25

Vdc

Symbol

Max

Unit

PD

225

mW

1.8

mW/C

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation(1)
TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Total Device Dissipation
Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BFR30LT1 = M1; BFR31LT1 = M2

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

IGSS

0.2

nAdc

OFF CHARACTERISTICS
Gate Reverse Current

(VGS = 10 Vdc, VDS = 0)

Gate Source Cutoff Voltage

(ID = 0.5 nAdc, VDS = 10 Vdc)

BFR30
BFR31

VGS(OFF)

5.0
2.5

Vdc

Gate Source Voltage

(ID = 1.0 mAdc, VDS = 10 Vdc)

BFR30
BFR31
BFR30
BFR31

VGS

0.7

3.0
1.3
4.0
2.0

Vdc

(ID = 50 mAdc, VDS = 10 Vdc)

1. Device mounted on FR4 glass epoxy printed circuit board using the recommended footprint.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.

4134

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BFR30LT1 BFR31LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

IDSS

4.0
1.0

10
5.0

mAdc

1.0
1.5
0.5
0.75

4.0
4.5

40
20

25
15

ON CHARACTERISTICS
Zero Gate Voltage Drain Current

(VDS = 10 Vdc, VGS = 0)

BFR30
BFR31

SMALL SIGNAL CHARACTERISTICS


Forward Transconductance
(ID = 1.0 mAdc, VDS = 10 Vdc, f = 1.0 kHz)
(ID = 200 mAdc, VDS = 10 Vdc, f = 1.0 kHz)
Output Admittance
(ID = 1.0 mAdc, VDS = 10 Vdc, f = 1.0 kHz)
(ID = 200 mAdc, VDS = 10 Vdc)

yfs

mAdc

BFR30
BFR31
BFR30
BFR31

yos

mAdc

BFR30
BFR31

Input Capacitance

(ID = 1.0 mAdc, VDS = 10 Vdc, f = 1.0 MHz)


(ID = 200 mAdc, VDS = 10 Vdc, f = 1.0 MHz)

Ciss

5.0
4.0

pF

Reverse Transfer Capacitance

(ID = 1.0 mAdc, VDS = 10 Vdc, f = 1.0 MHz)


(ID = 200 mAdc, VDS = 10 Vdc, f = 1.0 MHz)

Crss

1.5
1.5

pF

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4135

BFR30LT1 BFR31LT1
TYPICAL CHARACTERISTICS

14
VDS = 15 V
VGS = 0
RS = 1 M

VDS = 15 V
VGS = 0
f = 1 kHz

12

NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

10
8
6
4

1
2
0

0.1

0.01

1.0
f, FREQUENCY (kHz)

100

10

0.001

Figure 1. Noise Figure versus Frequency

1.2
VGS(off)

^ 1.2 V

1.2
VGS(off)

VGS = 0 V
I D , DRAIN CURRENT (mA)

I D , DRAIN CURRENT (mA)

^ 1.2 V

1.0
0.2 V

0.8
0.6

0.4 V

0.4

0.6 V

10
15
20
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

Figure 3. Typical Drain Characteristics

0.8
VDS = 15 V
0.6
0.4
0.2

0.8 V
1.0 V

0.2

4136

10

Figure 2. Noise Figure versus Source


Resistance

1.0

0.01
0.1
1.0
RS, SOURCE RESISTANCE (Megohms)

25

0
1.2

0.8
0.4
VGS, GATE SOURCE VOLTAGE (VOLTS)

Figure 4. Common Source Transfer


Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BFR30LT1 BFR31LT1
TYPICAL CHARACTERISTICS

4
VGS(off)

VGS(off)

^ 3.5 V

I D , DRAIN CURRENT (mA)

I D , DRAIN CURRENT (mA)

VGS = 0 V

1 V

2
2 V

^ 3.5 V

3
VDS = 15 V
2

3 V
0

10
15
20
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

0
5

25

Figure 5. Typical Drain Characteristics

^ 5.8 V

VGS = 0 V
I D , DRAIN CURRENT (mA)

I D , DRAIN CURRENT (mA)

10

VGS(off)

1 V
6
2 V
4
3 V
2

Figure 6. Common Source Transfer


Characteristics

10

3
2
1
4
VGS, GATE SOURCE VOLTAGE (VOLTS)

4 V

VGS(off)

^ 5.8 V

6
VDS = 15 V
4

5 V
0
0

10
15
20
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

25

Figure 7. Typical Drain Characteristics

0
7

5
4
3
2
1
VGS, GATE SOURCE VOLTAGE (VOLTS)

Figure 8. Common Source Transfer


Characteristics

Note: Graphical data is presented for dc conditions. Tabular


data is given for pulsed conditions (Pulse Width = 630
ms, Duty Cycle = 10%). Under dc conditions, self heating in higher IDSS units reduces IDSS.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4137

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET Chopper Transistor


NChannel Depletion

J112

1 DRAIN

3
GATE

2 SOURCE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Gate Voltage

VDG

35

Vdc

Gate Source Voltage

VGS

35

Vdc

Gate Current

IG

50

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

TL

300

TJ, Tstg

65 to +150

Lead Temperature
Operating and Storage Junction
Temperature Range

1
2

CASE 2904, STYLE 5


TO92 (TO226AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)GSS

35

Vdc

IGSS

1.0

nAdc

VGS(off)

1.0

5.0

Vdc

ID(off)

1.0

nAdc

ZeroGateVoltage Drain Current(1)


(VDS = 15 Vdc)

IDSS

5.0

mAdc

Static DrainSource On Resistance


(VDS = 0.1 Vdc)

rDS(on)

50

Drain Gate and Source Gate OnCapacitance


(VDS = VGS = 0, f = 1.0 MHz)

Cdg(on)
+
Csg(on)

28

pF

Drain Gate OffCapacitance


(VGS = 10 Vdc, f = 1.0 MHz)

Cdg(off)

5.0

pF

Source Gate OffCapacitance


(VGS = 10 Vdc, f = 1.0 MHz)

Csg(off)

5.0

pF

OFF CHARACTERISTICS
Gate Source Breakdown Voltage
(IG = 1.0 Adc)
Gate Reverse Current
(VGS = 15 Vdc)
Gate Source Cutoff Voltage
(VDS = 5.0 Vdc, ID = 1.0 Adc)
DrainCutoff Current
(VDS = 5.0 Vdc, VGS = 10 Vdc)

ON CHARACTERISTICS

1. Pulse Width = 300 s, Duty Cycle = 3.0%.

(Replaces J111/D)

4138

Motorola SmallSignal Transistors, FETs and Diodes Device Data

J112
TYPICAL SWITCHING CHARACTERISTICS
1000

500

TJ = 25C

200

VGS(off) = 7.0 V

200

RK = RD

100

TJ = 25C

500

t r , RISE TIME (ns)

t d(on), TURNON DELAY TIME (ns)

1000

50
20
10
5.0

100
50
20
10
5.0

RK = 0
2.0

RK = 0

2.0

1.0
0.5 0.7 1.0

2.0 3.0
5.0 7.0 10
ID, DRAIN CURRENT (mA)

20

30

1.0
0.5 0.7 1.0

50

2.0 3.0
5.0 7.0 10
ID, DRAIN CURRENT (mA)

Figure 1. TurnOn Delay Time

1000

1000

TJ = 25C

500

200

100
RK = RD

50
20
10

RK = 0

20

2.0
30

50

Figure 3. TurnOff Delay Time

RK = 0

10

2.0
20

VGS(off) = 7.0 V

RK = RD

50

5.0

2.0 3.0
5.0 7.0 10
ID, DRAIN CURRENT (mA)

50

100

5.0

1.0
0.5 0.7 1.0

30

TJ = 25C

500

VGS(off) = 7.0 V

200

20

Figure 2. Rise Time

t f , FALL TIME (ns)

t d(off) , TURNOFF DELAY TIME (ns)

VGS(off) = 7.0 V

RK = RD

1.0
0.5 0.7 1.0

2.0 3.0
5.0 7.0 10
ID, DRAIN CURRENT (mA)

20

30

50

Figure 4. Fall Time


NOTE 1

+VDD
RD
SET VDS(off) = 10 V
INPUT

RK

RT

RGEN
50

OUTPUT
RGG

50
VGEN

INPUT PULSE
tr 0.25 ns
tf 0.5 ns
PULSE WIDTH = 2.0 s
DUTY CYCLE 2.0%

50

VGG

RGG

& RK

+ RRDD)(RTRT))50)50

RD

Figure 5. Switching Time Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

The switching characteristics shown above were measured using a


test circuit similar to Figure 5. At the beginning of the switching
interval, the gate voltage is at Gate Supply Voltage (VGG). The
DrainSource Voltage (VDS) is slightly lower than Drain Supply
Voltage (VDD) due to the voltage divider. Thus Reverse Transfer
Capacitance (Crss) or GateDrain Capacitance (Cgd) is charged to
VGG + VDS.
During the turnon interval, GateSource Capacitance (C gs)
discharges through the series combination of RGen and RK. Cgd
must discharge to VDS(on) through RG and RK in series with the
parallel combination of effective load impedance (R D ) and
DrainSource Resistance (rds). During the turnoff, this charge flow
is reversed.
Predicting turnon time is somewhat difficult as the channel
resistance rds is a function of the gatesource voltage. While Cgs
discharges, VGS approaches zero and rds decreases. Since Cgd
discharges through rds, turnon time is nonlinear. During turnoff,
the situation is reversed with rds increasing as Cgd charges.
The above switching curves show two impedance conditions;
1) RK is equal to RD, which simulates the switching behavior of
cascaded stages where the driving source impedance is normally
the load impedance of the previous stage, and 2) RK = 0 (low
impedance) the driving source impedance is that of the generator.

4139

20

15
10
C, CAPACITANCE (pF)

y fs, FORWARD TRANSFER ADMITTANCE (mmhos)

J112

10
7.0
5.0

Tchannel = 25C
VDS = 15 V

3.0

Cgs
7.0
5.0

Cgd

3.0
2.0

Tchannel = 25C
(Cds IS NEGLIGIBLE)

1.5
2.0
0.5 0.7

1.0

2.0 3.0
5.0 7.0 10
ID, DRAIN CURRENT (mA)

20

30

1.0
0.03 0.05 0.1

50

Figure 6. Typical Forward Transfer Admittance

IDSS
= 10
160 mA

25
mA

50 mA

75 mA 100 mA

80

Tchannel = 25C

1.0

2.0
3.0
4.0
5.0
6.0
VGS, GATESOURCE VOLTAGE (VOLTS)

7.0

9.0
8.0
7.0

rDS(on) @ VGS = 0

60
50

1.6
1.4
1.2
1.0
0.8
0.6
40

10
20
50
80
110
Tchannel, CHANNEL TEMPERATURE (C)

140

170

10

Tchannel = 25C

80
70

ID = 1.0 mA
VGS = 0

Figure 9. Effect of Temperature On


DrainSource OnState Resistance

6.0
VGS(off)

5.0

40

4.0

30

3.0

20

2.0

10

1.0

0
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
IDSS, ZEROGATEVOLTAGE DRAIN CURRENT (mA)

VGS, GATESOURCE VOLTAGE (VOLTS)

rds(on), DRAINSOURCE ONSTATE


RESISTANCE (OHMS)

90

1.8

0.4
70

8.0

Figure 8. Effect of GateSource Voltage


On DrainSource Resistance

100

30

2.0

125 mA

120

40

10

Figure 7. Typical Capacitance

rds(on), DRAINSOURCE ONSTATE


RESISTANCE (NORMALIZED)

rds(on), DRAINSOURCE ONSTATE


RESISTANCE (OHMS)

200

0.3 0.5
1.0
3.0 5.0
VR, REVERSE VOLTAGE (VOLTS)

NOTE 2
The ZeroGateVoltage Drain Current (IDSS), is the principle
determinant of other J-FET characteristics. Figure 10 shows
the relationship of GateSource Off Voltage (VGS(off) and
DrainSource On Resistance (rds(on)) to IDSS. Most of the
devices will be within 10% of the values shown in Figure 10.
This data will be useful in predicting the characteristic
variations for a given part number.
For example:
Unknown
rds(on) and VGS range for an J112
The electrical characteristics table indicates that an J112
has an IDSS range of 25 to 75 mA. Figure 10, shows rds(on) =
52 Ohms for IDSS = 25 mA and 30 Ohms for IDSS = 75 mA.
The corresponding VGS values are 2.2 volts and 4.8 volts.

Figure 10. Effect of IDSS On DrainSource


Resistance and GateSource Voltage

4140

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA


JFETs Low Frequency/
Low Noise

J202

NChannel Depletion

1 DRAIN

3
GATE

2 SOURCE
1
2

CASE 2904, STYLE 5


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Source Voltage

VDS

40

Vdc

Drain Gate Voltage

VDG

40

Vdc

Gate Source Voltage

VGS

40

Vdc

Gate Current

IG

50

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

310
2.82

mW
mW/C

Storage Temperature Range

Tstg

65 to +150

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)GSS

40

Vdc

IGSS

100

pA

VGS(off)

0.8

4.0

Vdc

IDSS

0.9

4.5

mAdc

yfs

1000

mmhos

OFF CHARACTERISTICS
Gate Source Breakdown Voltage
(IG = 1.0 Adc)
Gate Reverse Current
(VGS = 20 Vdc)
Gate Source Cutoff Voltage
(VDS = 20 Vdc, ID = 10 nAdc)

ON CHARACTERISTICS
Zero Gate Voltage Drain Current(1)
(VDS = 20 Vdc)

SMALL SIGNAL CHARACTERISTICS


Forward Transfer Admittance(1)
(VDS = 20 Vdc, f = 1.0 kHz)
1. Pulse Width

v 2.0 ms.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4141

J202
TYPICAL CHARACTERISTICS

14
VDS = 15 V
VGS = 0
RS = 1 M

VDS = 15 V
VGS = 0
f = 1 kHz

12

NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

10
8
6
4

1
2
0

0.1

0.01

1.0
f, FREQUENCY (kHz)

100

10

0.001

Figure 1. Noise Figure versus Frequency

1.2
VGS(off)

^ 1.2 V

1.2
VGS(off)

VGS = 0 V
I D , DRAIN CURRENT (mA)

I D , DRAIN CURRENT (mA)

^ 1.2 V

1.0
0.2 V

0.8
0.6

0.4 V

0.4

0.6 V

10
15
20
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

Figure 3. Typical Drain Characteristics

0.8
VDS = 15 V
0.6
0.4
0.2

0.8 V
1.0 V

0.2

4142

10

Figure 2. Noise Figure versus Source


Resistance

1.0

0.01
0.1
1.0
RS, SOURCE RESISTANCE (Megohms)

25

0
1.2

0.8
0.4
VGS, GATE SOURCE VOLTAGE (VOLTS)

Figure 4. Common Source Transfer


Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

J202
TYPICAL CHARACTERISTICS

4
VGS(off)

VGS(off)

^ 3.5 V

I D , DRAIN CURRENT (mA)

I D , DRAIN CURRENT (mA)

VGS = 0 V

1 V

2
2 V

^ 3.5 V

3
VDS = 15 V
2

3 V
0

10
15
20
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

0
5

25

Figure 5. Typical Drain Characteristics

^ 5.8 V

VGS = 0 V
I D , DRAIN CURRENT (mA)

I D , DRAIN CURRENT (mA)

10

VGS(off)

1 V
6
2 V
4
3 V
2

Figure 6. Common Source Transfer


Characteristics

10

3
2
1
4
VGS, GATE SOURCE VOLTAGE (VOLTS)

4 V

VGS(off)

^ 5.8 V

6
VDS = 15 V
4

5 V
0
0

10
15
20
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

25

Figure 7. Typical Drain Characteristics

0
7

5
4
3
2
1
VGS, GATE SOURCE VOLTAGE (VOLTS)

Figure 8. Common Source Transfer


Characteristics

Note: Graphical data is presented for dc conditions. Tabular


data is given for pulsed conditions (Pulse Width = 630
ms, Duty Cycle = 10%). Under dc conditions, self heating in higher IDSS units reduces IDSS.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4143

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET High Frequency Amplifier


NChannel Depletion

J304

1 DRAIN

3
GATE

2 SOURCE

1
2

CASE 2904, STYLE 5


TO92 (TO226AA)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Gate Voltage

VDG

30

Vdc

GateSource Voltage

VGS

30

Vdc

Gate Current

IG

10

mA

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Lead Temperature
(1/16 from Case for 10 Seconds)

TL

300

TJ, Tstg

65 to +150

Operating and Storage Junction


Temperature Range

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)GSS

30

Vdc

IGSS

100

pA

2.0

6.0

5.0

15

50

4500

7500

OFF CHARACTERISTICS
Gate Source Breakdown Voltage
(IG = 1.0 Adc, VDS = 0)
Gate Reverse Current
(VGS = 20 Vdc, VDS = 0)
Gate Source Cutoff Voltage
(VDS = 15 Vdc, ID = 1.0 nAdc)

VGS(off)

Vdc

ON CHARACTERISTICS
ZeroGateVoltage Drain Current
(VDS = 15 Vdc, VGS = 0)

IDSS

mA

SMALL SIGNAL CHARACTERISTICS


Output Admittance
(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

yos

Forward Transconductance
(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

Re(yfs)

mmhos
mmhos

REV 1

4144

Motorola SmallSignal Transistors, FETs and Diodes Device Data

J304
POWER GAIN
24
f = 100 MHz

PG , POWER GAIN (dB)

20

16

12

400 MHz
Tchannel = 25C
VDS = 15 Vdc
VGS = 0 V

8.0
4.0
0

4.0
6.0
8.0
10
ID, DRAIN CURRENT (mA)

2.0

12

14

Figure 1. Effects of Drain Current

Reference
Designation
NEUTRALIZING
COIL
INPUT
TO 50
SOURCE

C2

L1

C1

C4
C5
Rg

Adjust VGS for


ID = 50 mA
VGS < 0 Volts

*L2
*L3

TO 500
LOAD

L2

CASE

L3
C6

C7
VGS

*L1

C3

NOTE:

COMMON
VDS
+15 V

ID = 5.0 mA

The noise source is a hotcold body


(AIL type 70 or equivalent) with a
test receiver (AIL type 136 or equivalent).

17 turns, (approx. depends upon circuit layout) AWG #28


enameled copper wire, close wound on 9/32 ceramic coil
form. Tuning provided by a powdered iron slug.
41/2 turns, AWG #18 enameled copper wire, 5/16 long,
3/8 I.D. (AIR CORE).
31/2 turns, AWG #18 enameled copper wire, 1/4 long,
3/8 I.D. (AIR CORE).

**L1

**L2
**L3

VALUE
100 MHz

400 MHz

C1

7.0 pF

1.8 pF

C2

1000 pF

17 pF

C3

3.0 pF

1.0 pF

C4

112 pF

0.88.0 pF

C5

112 pF

0.88.0 pF

C6

0.0015 F

0.001 F

C7

0.0015 F

0.001 F

L1

3.0 H*

0.2 H**

L2

0.15 H*

0.03 H**

L3

0.14 H*

0.022 H**

6 turns, (approx. depends upon circuit layout) AWG #24


enameled copper wire, close wound on 7/32 ceramic coil
form. Tuning provided by an aluminum slug.
1 turn, AWG #16 enameled copper wire, 3/8 I.D.
(AIR CORE).
1/2 turn, AWG #16 enameled copper wire, 1/4 I.D.
(AIR CORE).

Figure 2. 100 MHz and 400 MHz Neutralized Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4145

J304
NOISE FIGURE
(Tchannel = 25C)
10

6.5
ID = 5.0 mA

VDS = 15 V
VGS = 0 V

5.5
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

8.0

6.0
f = 400 MHz
4.0

2.0

4.5
f = 400 MHz
3.5

2.5

100 MHz

100 MHz

1.5
0

2.0

4.0 6.0 8.0


10
12
14
16
VDS, DRAINSOURCE VOLTAGE (VOLTS)

18

20

2.0

Figure 3. Effects of DrainSource Voltage

4.0
6.0
8.0
10
ID, DRAIN CURRENT (mA)

12

14

Figure 4. Effects of Drain Current

INTERMODULATION CHARACTERISTICS
Pout , OUTPUT POWER PER TONE (dB)

+ 40
3RD ORDER INTERCEPT

+ 20
VDS = 15 Vdc
f1 = 399 MHz
f2 = 400 MHz

0
20
40
60
80
100

FUNDAMENTAL
OUTPUT @ IDSS,
0.25 IDSS

120
140
160
120

100

3RD ORDER IMD


OUTPUT @ IDSS,
0.25 IDSS

80
60
40
20
Pin, INPUT POWER PER TONE (dB)

+ 20

Figure 5. Third Order Intermodulation Distortion

4146

Motorola SmallSignal Transistors, FETs and Diodes Device Data

J304
COMMON SOURCE CHARACTERISTICS

30
20
bis @ IDSS

10
7.0
5.0
3.0

gis @ IDSS

2.0
gis @ 0.25 IDSS
1.0
0.7
0.5
0.3
10

bis @ 0.25 IDSS


20

30

50 70 100
200 300
f, FREQUENCY (MHz)

grs , REVERSE TRANSADMITTANCE (mmhos)


brs , REVERSE SUSCEPTANCE (mmhos)

gis, INPUT CONDUCTANCE (mmhos)


bis, INPUT SUSCEPTANCE (mmhos)

ADMITTANCE PARAMETERS
(VDS = 15 Vdc, Tchannel = 25C)

500 700 1000

5.0
3.0
2.0
brs @ IDSS
1.0
0.7
0.5

0.25 IDSS

0.3
0.2
0.1
0.07
0.05

grs @ IDSS, 0.25 IDSS


10

20

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

10

10
7.0
5.0

gfs @ IDSS
gfs @ 0.25 IDSS

3.0
2.0
1.0
0.7
0.5
0.3
0.2
10

30

Figure 7. Reverse Transfer Admittance (yrs)

|bfs| @ IDSS
|bfs| @ 0.25 IDSS

gos, OUTPUT ADMITTANCE (mhos)


bos, OUTPUT SUSCEPTANCE (mhos)

gfs, FORWARD TRANSCONDUCTANCE (mmhos)


|b fs|, FORWARD SUSCEPTANCE (mmhos)

Figure 6. Input Admittance (yis)

20

5.0
bos @ IDSS and 0.25 IDSS

2.0
1.0
0.5
0.2

gos @ IDSS

0.1
0.05
gos @ 0.25 IDSS

0.02
0.01
20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 8. Forward Transadmittance (yfs)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 9. Output Admittance (yos)

4147

J304
COMMON SOURCE CHARACTERISTICS
SPARAMETERS
(VDS = 15 Vdc, Tchannel = 25C, Data Points in MHz)
30

20

10

0
1.0

40

350
100

340

330
320

40

310

50

20

10

340

330

0.4

320

0.3
400

310

ID = IDSS, 0.25 IDSS

300
0.8

900

500

ID = IDSS

60

800
300

400

60

500

0.7

600
0.6

300
0.1

500

70

290

400

700
800

700
800

290

0.2
700

600

600

80

350

300

200

50

70

200

100
0.9

30

ID = 0.25 IDSS

280

80

300

280

0.0

200

900

270

90

100

260

100

260

110

250

110

250

120

240

120

240

130

230

130

230

140

220

140

220

90

900

150

160

170

180

190

200

210

150

160

Figure 10. S11s


30

20

10

350

170

340

330

30

20

10

80
90

700

500

0.3
ID = 0.25 IDSS
500

0
350
340
330
100 200
ID = 0.25 IDSS
300
1.0
400
100 200
500
300
600
400
700
0.9
500
800
600
ID = IDSS
700
900
800
900
0.8

310

50

300

60

290

70

280

80

270

90

270

260

100

260

250

110

250

240

120

240

230

130

230

220

140

220

320

310

300
0.7

290

0.3

280

0.6

100

400

400

110

0.4

800

600
100

210

900
700

600

200

40

0.5
60
900

190

320

0.6
50

800

180

Figure 11. S12s

40

70

270

100

300

200

0.4

100

0.5

300
120

ID = IDSS

200

130
0.6

140
150

160

170

180

190

Figure 12. S21s


4148

200

210

150

160

170

180

190

200

210

Figure 13. S22s


Motorola SmallSignal Transistors, FETs and Diodes Device Data

J304
COMMON GATE CHARACTERISTICS
ADMITTANCE PARAMETERS
(VDG = 15 Vdc, Tchannel = 25C)

10
7.0
5.0

grg , REVERSE TRANSADMITTANCE (mmhos)


brg , REVERSE SUSCEPTANCE (mmhos)

gig, INPUT CONDUCTANCE (mmhos)


big, INPUT SUSCEPTANCE (mmhos)

20

gig @ IDSS
grg @ 0.25 IDSS

3.0
2.0
1.0
0.7
0.5

big @ IDSS
big @ 0.25 IDSS

0.3
0.2

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

0.5
0.3

0.1
0.07
0.05
0.25 IDSS

0.03
0.02
0.01

0.007
0.005

500 700 1000

brg @ IDSS

0.2

gig @ IDSS, 0.25 IDSS


10

10
7.0
5.0

gfg @ IDSS

3.0

gfg @ 0.25 IDSS

2.0
1.0
0.7
0.5
bfg @ IDSS

0.3

brg @ 0.25 IDSS

0.2

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 15. Reverse Transfer Admittance (yrg)

gog, OUTPUT ADMITTANCE (mmhos)


bog, OUTPUT SUSCEPTANCE (mmhos)

gfg , FORWARD TRANSCONDUCTANCE (mmhos)


bfg , FORWARD SUSCEPTANCE (mmhos)

Figure 14. Input Admittance (yig)

20

1.0
0.7
0.5

bog @ IDSS, 0.25 IDSS

0.3
0.2
0.1
0.07
0.05

gog @ IDSS

0.03
0.02
gog @ 0.25 IDSS

0.1

0.01
10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 16. Forward Transfer Admittance (yfg)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 17. Output Admittance (yog)

4149

J304
COMMON GATE CHARACTERISTICS
SPARAMETERS
(VDS = 15 Vdc, Tchannel = 25C, Data Points in MHz)
30

20

10

350

340

330

30

0.7

40

100

310

50

300

60

290

70

280

80

350

340

330
320

0.04

200

300

0.03

400

100

500
200

0.5

ID = IDSS
0.4

310

600

300

60
70

40

10

ID = 0.25 IDSS

0.6
50

320

20

0.02

700

400
500

300

800

600
900

0.01

290

700
80

800

0.3

900

90

270

100

260

90

250

270

500
600

100
ID = IDSS

110

280

0.0
100

110

700

600
700

260

ID = 0.25 IDSS

250

0.01

800
240

120

120

240

800
0.02
900

230

130

230

130
900

220

140
150

160

170

180

190

200

140

210

20

10

350

150

160

170

180

190

200

210

340

330

Figure 19. S12g

340

330

30

0.5

40

220

0.04

Figure 18. S11g

30

0.03

320

20

10

40

0
1.5
1.0
100

100
0.4
ID = IDSS

350
300
200

500

320

400

700
600
800

0.9

900

310

50

300

60

290

70

280

80

270

90

270

100

260

100

260

110

250

110

250

120

240

120

240

130

230

130

230

140

220

140

220

50

100

ID = IDSS, 0.25 IDSS

0.3

0.8

60
0.2

70

310

ID = 0.25 IDSS

80
0.1

300
0.7

290
280

0.6

900

90
900

150

160

170

180

190

Figure 20. S21g


4150

200

210

150

160

170

180

190

200

210

Figure 21. S22g


Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA


JFET VHF/UHF Amplifiers

NChannel Depletion

J308
J309

1 DRAIN

J310
3
GATE

Motorola Preferred Devices

2 SOURCE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Source Voltage

VDS

25

Vdc

GateSource Voltage

VGS

25

Vdc

Forward Gate Current

IGF

10

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Junction Temperature Range

TJ

65 to +125

Storage Temperature Range

Tstg

65 to +150

1
2

CASE 2904, STYLE 5


TO92 (TO226AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)GSS

25

Vdc

1.0
1.0

nAdc
Adc

1.0
1.0
2.0

6.5
4.0
6.5

12
12
24

60
30
60

1.0

0.7
0.7
0.5

OFF CHARACTERISTICS
Gate Source Breakdown Voltage
(IG = 1.0 Adc, VDS = 0)
Gate Reverse Current
(VGS = 15 Vdc, VDS = 0, TA = 25C)
(VGS = 15 Vdc, VDS = 0, TA = +125C)
Gate Source Cutoff Voltage
(VDS = 10 Vdc, ID = 1.0 nAdc)

IGSS

VGS(off)
J308
J309
J310

Vdc

ON CHARACTERISTICS
Zero Gate Voltage Drain Current(1)
(VDS = 10 Vdc, VGS = 0)

IDSS
J308
J309
J310

GateSource Forward Voltage


(VDS = 0, IG = 1.0 mAdc)

VGS(f)

mAdc

Vdc

SMALL SIGNAL CHARACTERISTICS


CommonSource Input Conductance
(VDS = 10 Vdc, ID = 10 mAdc, f = 100 MHz)

Re(yis)
J308
J309
J310

mmhos

CommonSource Output Conductance


(VDS = 10 Vdc, ID = 10 mAdc, f = 100 MHz)

Re(yos)

0.25

mmhos

CommonGate Power Gain


(VDS = 10 Vdc, ID = 10 mAdc, f = 100 MHz)

Gpg

16

dB

1. Pulse Test: Pulse Width

v 300 s, Duty Cycle v 3.0%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4151

J308 J309 J310


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

CommonSource Forward Transconductance


(VDS = 10 Vdc, ID = 10 mAdc, f = 100 MHz)

Re(yfs)

12

mmhos

CommonGate Input Conductance


(VDS = 10 Vdc, ID = 10 mAdc, f = 100 MHz)

Re(yig)

12

mmhos

8000
10000
8000

20000
20000
18000

250

13000
13000
12000

150
100
150

SMALL SIGNAL CHARACTERISTICS (continued)

CommonSource Forward Transconductance


(VDS = 10 Vdc, ID = 10 mAdc, f = 1.0 kHz)

CommonSource Output Conductance


(VDS = 10 Vdc, ID = 10 mAdc, f = 1.0 kHz)
CommonGate Forward Transconductance
(VDS = 10 Vdc, ID = 10 mAdc, f = 1.0 kHz)

CommonGate Output Conductance


(VDS = 10 Vdc, ID = 10 mAdc, f = 1.0 kHz)

mhos

gfs
J308
J309
J310
gos

mhos

gfg
J308
J309
J310

mhos

gog
J308
J309
J310

mhos

GateDrain Capacitance
(VDS = 0, VGS = 10 Vdc, f = 1.0 MHz)

Cgd

1.8

2.5

pF

GateSource Capacitance
(VDS = 0, VGS = 10 Vdc, f = 1.0 MHz)

Cgs

4.3

5.0

pF

Noise Figure
(VDS = 10 Vdc, ID = 10 mAdc, f = 450 MHz)

NF

1.5

dB

Equivalent ShortCircuit Input Noise Voltage


(VDS = 10 Vdc, ID = 10 mAdc, f = 100 Hz)

en

10

nV Hz

FUNCTIONAL CHARACTERISTICS

4152

Motorola SmallSignal Transistors, FETs and Diodes Device Data

J308 J309 J310


50
SOURCE

50
LOAD

U310
C3

L2P
L1

L2S

C2

C1

C4
C6

C5
C7
1.0 k

RFC
+VDD

C1 = C2 = 0.8 10 pF, JFD #MVM010W.


C3 = C4 = 8.35 pF Erie #539002D.
C5 = C6 = 5000 pF Erie (2443000).
C7 = 1000 pF, Allen Bradley #FA5C.
RFC = 0.33 H Miller #923030.
L1 = One Turn #16 Cu, 1/4 I.D. (Air Core).
L2P = One Turn #16 Cu, 1/4 I.D. (Air Core).
L2S = One Turn #16 Cu, 1/4 I.D. (Air Core).

60
VDS = 10 V

TA = 55C
50

50
+ 25C

IDSS
+ 25C

40

40

30

30

+150C

20

20

+ 25C
55C

10
5.0

+150C 10
0
0

1.0
4.0
3.0
2.0
ID VGS, GATESOURCE VOLTAGE (VOLTS)
IDSS VGS, GATESOURCE CUTOFF VOLTAGE (VOLTS)

35
30

20
+150C

15

+ 25C
55C

10

+150C

5.0
0

5.0

4.0

Yos

VGS(off) = 2.3 V =
VGS(off) = 5.7 V =

10

10

120
RDS

CAPACITANCE (pF)

Yos, OUTPUT ADMITTANCE ( mhos)

Yfs , FORWARD TRANSCONDUCTANCE (mhos)

100

1.0 k

1.0

2.0

Figure 3. Forward Transconductance


versus GateSource Voltage

Yfs

10 k

3.0

VGS, GATESOURCE VOLTAGE (VOLTS)

1.0 k

Yfs

+ 25C

25

Figure 2. Drain Current and Transfer


Characteristics versus GateSource Voltage

100 k

TA = 55C

VDS = 10 V
f = 1.0 MHz

96

7.0
72
Cgs
4.0

48

24

Cgd

R DS , ON RESISTANCE (OHMS)

I D , DRAIN CURRENT (mA)

60

IDSS, SATURATION DRAIN CURRENT (mA)

70

70

Yfs , FORWARD TRANSCONDUCTANCE (mmhos)

Figure 1. 450 MHz CommonGate Amplifier Test Circuit

1.0
100
0.01

1.0
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100
ID, DRAIN CURRENT (mA)

Figure 4. CommonSource Output


Admittance and Forward Transconductance
versus Drain Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0
10

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

1.0

0
0

VGS, GATE SOURCE VOLTAGE (VOLTS)

Figure 5. On Resistance and Junction


Capacitance versus GateSource Voltage

4153

J308 J309 J310


|S21|, |S11|
0.85 0.45

2.4

0.79 0.39

|S12|, |S22|
0.060 1.00
S22

VDS = 10 V
ID = 10 mA
TA = 25C

24

3.0

0.048 0.98
S21

Y11

18

1.8

Y21

12

1.2

0.73 0.33

VDS = 10 V
ID = 10 mA
TA = 25C

0.67 0.27

0.024 0.94

0.61 0.21

0.6

0.012 0.92
S12

Y12
0
100

200
300
500
f, FREQUENCY (MHz)

700

0.55 0.15
100

1000

Figure 6. CommonGate Y Parameter


Magnitude versus Frequency

22

160

40

200
300
500
f, FREQUENCY (MHz)

11, 12
20 120

40

0.90

86

40 100

85

60

80

120 84

80

60

100

40

120

20
100

21, 22
0

11

20

21

700 1000

Figure 7. CommonGate S Parameter


Magnitude versus Frequency

12, 22
20 87

21, 11
180 50

170

0.036 0.96

S11

Y22

6.0

Y12 (mmhos)

|Y11|, |Y21 |, |Y22 | (mmhos)

30

21

22

20

60
80

30

40

100
20

140

10

12
11

130

0
100

140
VDS = 10 V
ID = 10 mA
TA = 25C

200
300
500
f, FREQUENCY (MHz)

180
200 82
1000

Figure 8. CommonGate Y Parameter


PhaseAngle versus Frequency

8.0

24

7.0

21

6.0

18

5.0

15
Gpg

4.0

12
NF

3.0

9.0

2.0

6.0

1.0

3.0

0
4.0

6.0

8.0

10 12
14 16
18
ID, DRAIN CURRENT (mA)

20

Figure 10. Noise Figure and


Power Gain versus Drain Current

4154

11

200
300
500
f, FREQUENCY (MHz)

700

80

100
1000

26

VDD = 20 V
f = 450 MHz
BW 10 MHz
CIRCUIT IN FIGURE 1

22

0
24

NF, NOISE FIGURE (dB)

6.0

VDS = 10 V
ID = 10 mA
TA = 25C

Figure 9. S Parameter PhaseAngle


versus Frequency

G pg , POWER GAIN (dB)

NF, NOISE FIGURE (dB)

7.0

60

12

160 83

700

21

22
5.0
4.0
3.0
2.0

18

Gpg
VDS = 10 V
ID = 10 mA
TA = 25C
CIRCUIT IN FIGURE 1

14
10
NF

G pg , POWER GAIN (dB)

150

6.0
1.0
2.0
0

50
100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 11. Noise Figure and Power Gain


versus Frequency

Motorola SmallSignal Transistors, FETs and Diodes Device Data

J308 J309 J310


C1

C6

U310
S

D
G

C3

L1
INPUT
RS = 50

C4

L3

OUTPUT
RL = 50

C5

C2
L2

L4

VS

C1 = 110 pF Johanson Air variable trimmer.


C2, C5 = 100 pF feed thru button capacitor.
C3, C4, C6 = 0.56 pF Johanson Air variable
trimmer.
L1 = 1/8 x 1/32 x 15/8 copper bar.
L2, L4 = Ferroxcube Vk200 choke.
L3 = 1/8 x 1/32 x 17/8 copper bar.

VD

SHIELD

BW (3 dB) 36.5 MHz


ID 10 mAdc
VDS 20 Vdc
Device case grounded
IM test tones f1 = 449.5 MHz, f2 = 450.5 MHz

Figure 12. 450 MHz IMD Evaluation Amplifier


Amplifier power gain and IMD products are a function of the load impedance. For the amplifier design shown above with C4 and
C6 adjusted to reflect a load to the drain resulting in a nominal power gain of 9 dB, the 3rd order intercept point (IP) value is
29 dBm. Adjusting C4, C6 to provide larger load values will result in higher gain, smaller bandwidth and lower IP values. For
example, a nominal gain of 13 dB can be achieved with an intercept point of 19 dBm.

OUTPUT POWER PER TONE (dBm)

+40
+20
0
20
40

U310 JFET
VDS = 20 Vdc
ID = 10 mAdc
F1 = 449.5 MHz
F2 = 450.5 MHz

3RD ORDER INTERCEPT POINT

FUNDAMENTAL OUTPUT
Example of intercept point plot use:
Assume two inband signals of 20 dBm at the amplifier input.
They will result in a 3rd order IMD signal at the output of
90 dBm. Also, each signal level at the output will be
11 dBm, showing an amplifier gain of 9.0 dB and an
intermodulation ratio (IMR) capability of 79 dB. The gain and
IMR values apply only for signal levels below comparison.

60
80
3RD ORDER IMD OUTPUT

100
120
120

100

60
40
20
80
INPUT POWER PER TONE (dBm)

+20

Figure 13. Two Tone 3rd Order Intercept Point

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4155

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBF4391LT1
MMBF4392LT1
MMBF4393LT1

JFET Switching Transistors


NChannel

2 SOURCE

3
GATE

1 DRAIN

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

DrainSource Voltage

VDS

30

Vdc

DrainGate Voltage

VDG

30

Vdc

GateSource Voltage

VGS

30

Vdc

Forward Gate Current

IG(f)

50

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

TJ, Tstg

55 to +150

CASE 318 08, STYLE 10


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Junction and Storage Temperature

DEVICE MARKING
MMBF4391LT1 = 6J; MMBF4392LT1 = 6K; MMBF4393LT1 = 6G

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)GSS

30

Vdc

1.0
0.20

nAdc
Adc

4.0
2.0
0.5

10
5.0
3.0

1.0
1.0

OFF CHARACTERISTICS
GateSource Breakdown Voltage
(IG = 1.0 Adc, VDS = 0)
Gate Reverse Current
(VGS = 15 Vdc, VDS = 0, TA = 25C)
(VGS = 15 Vdc, VDS = 0, TA = 100C)
GateSource Cutoff Voltage
(VDS = 15 Vdc, ID = 10 nAdc)

OffState Drain Current


(VDS = 15 Vdc, VGS = 12 Vdc)
(VDS = 15 Vdc, VGS = 12 Vdc, TA = 100C)
1. FR 5 = 1.0

4156

 0.75  0.062 in.

IGSS

VGS(off)
MMBF4391LT1
MMBF4392LT1
MMBF4393LT1

Vdc

ID(off)
nAdc
Adc

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF4391LT1 MMBF4392LT1 MMBF4393LT1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

50
25
5.0

150
75
30

0.4
0.4
0.4

30
60
100

Unit

ON CHARACTERISTICS
ZeroGateVoltage Drain Current
(VDS = 15 Vdc, VGS = 0)

IDSS
MMBF4391LT1
MMBF4392LT1
MMBF4393LT1

DrainSource OnVoltage
(ID = 12 mAdc, VGS = 0)
(ID = 6.0 mAdc, VGS = 0)
(ID = 3.0 mAdc, VGS = 0)

mAdc

VDS(on)
MMBF4391LT1
MMBF4392LT1
MMBF4393LT1

Static DrainSource OnResistance


(ID = 1.0 mAdc, VGS = 0)

Vdc

rDS(on)
MMBF4391LT1
MMBF4392LT1
MMBF4393LT1

SMALL SIGNAL CHARACTERISTICS


Input Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

14

pF

Reverse Transfer Capacitance


(VDS = 0, VGS = 12 Vdc, f = 1.0 MHz)

Crss

3.5

pF

TYPICAL CHARACTERISTICS
1000
TJ = 25C

500

MMBF4391 VGS(off) = 12 V
MMBF4392
= 7.0 V
MMBF4393
= 5.0 V

RK = RD

200

500

100
50
20
10
RK = 0

5.0
2.0
1.0
0.5 0.7 1.0

2.0 3.0 5.0 7.0 10


ID, DRAIN CURRENT (mA)

20

30

RK = RD

200
t r , RISE TIME (ns)

t d(on) , TURNON DELAY TIME (ns)

1000

100
50
20
10
5.0
2.0
1.0
0.5 0.7 1.0

50

RK = 0

2.0 3.0 5.0 7.0 10


ID, DRAIN CURRENT (mA)

Figure 1. TurnOn Delay Time

1000
500

TJ = 25C
MMBF4391 VGS(off) = 12 V
= 7.0 V
MMBF4392
= 5.0 V
MMBF4393

200
100
RK = RD

50
20
10
5.0

RK = 0

2.0
1.0
0.5 0.7 1.0

2.0 3.0 5.0 7.0 10


ID, DRAIN CURRENT (mA)

20

30

50

Figure 2. Rise Time

t f , FALL TIME (ns)

t d(off) , TURNOFF DELAY TIME (ns)

1000
500

TJ = 25C
MMBF4391 VGS(off) = 12 V
MMBF4392
= 7.0 V
MMBF4393
= 5.0 V

20

30

50

Figure 3. TurnOff Delay Time

Motorola SmallSignal Transistors, FETs and Diodes Device Data

RK = RD

200
100

TJ = 25C
MMBF4391 VGS(off) = 12 V
MMBF4392
= 7.0 V
MMBF4393
= 5.0 V

50
20

RK = 0

10
5.0
2.0
1.0
0.5 0.7 1.0

2.0 3.0 5.0 7.0 10


20
ID, DRAIN CURRENT (mA)

30

50

Figure 4. Fall Time

4157

MMBF4391LT1 MMBF4392LT1 MMBF4393LT1


NOTE 1
VDD
RD
SET VDS(off) = 10 V
INPUT

RK

RT
OUTPUT

RGEN
50

RGG
50

INPUT PULSE
tr 0.25 ns
tf 0.5 ns
PULSE WIDTH = 2.0 s
DUTY CYCLE 2.0%

50

VGG

VGEN

RGG > RK
RD = RD(RT + 50)
RD + RT + 50

15

20
MMBF4392

10

MMBF4391

C, CAPACITANCE (pF)

V fs , FORWARD TRANSFER ADMITTANCE (mmhos)

Figure 5. Switching Time Test Circuit

The switching characteristics shown above were measured using a test


circuit similar to Figure 5. At the beginning of the switching interval, the
gate voltage is at Gate Supply Voltage (VGG). The DrainSource Voltage
(VDS) is slightly lower than Drain Supply Voltage (VDD) due to the voltage
divider. Thus Reverse Transfer Capacitance (Crss) of GateDrain Capacitance (Cgd) is charged to VGG + VDS.
During the turnon interval, GateSource Capacitance (Cgs) discharges
through the series combination of RGen and RK. Cgd must discharge to
VDS(on) through RG and RK in series with the parallel combination of effective load impedance (RD) and DrainSource Resistance (rDS). During the
turnoff, this charge flow is reversed.
Predicting turnon time is somewhat difficult as the channel resistance
rDS is a function of the gatesource voltage. While Cgs discharges, VGS
approaches zero and rDS decreases. Since Cgd discharges through rDS,
turnon time is nonlinear. During turnoff, the situation is reversed with
rDS increasing as Cgd charges.
The above switching curves show two impedance conditions; 1) RK is
equal to RD which simulates the switching behavior of cascaded stages
where the driving source impedance is normally the load impedance of the
previous stage, and 2) RK = 0 (low impedance) the driving source impedance is that of the generator.

10
MMBF4393

7.0
Tchannel = 25C
VDS = 15 V

5.0
3.0
2.0
0.5 0.7 1.0

2.0 3.0

5.0 7.0 10

20

30

50

Cgs

7.0
Cgd

5.0
3.0
2.0
1.5

Tchannel = 25C
(Cds is negligible

1.0
0.03 0.05 0.1

ID, DRAIN CURRENT (mA)

200

IDSS 25 mA
= 10
160 mA

50 mA

75 mA 100 mA

125 mA

120
80
40
Tchannel = 25C

1.0

2.0
3.0
5.0
4.0
6.0
7.0
VGS, GATESOURCE VOLTAGE (VOLTS)

Figure 8. Effect of GateSource Voltage


on DrainSource Resistance

4158

30

Figure 7. Typical Capacitance

r DS(on), DRAINSOURCE ONSTATE


RESISTANCE (NORMALIZED)

r DS(on), DRAINSOURCE ONSTATE


RESISTANCE (OHMS)

Figure 6. Typical Forward Transfer Admittance

0.3 0.5 1.0


3.0 5.0 10
VR, REVERSE VOLTAGE (VOLTS)

8.0

2.0
1.8

ID = 1.0 mA
VGS = 0

1.6
1.4
1.2
1.0
0.8
0.6
0.4
70

40

10

20

50

80

110

140

170

Tchannel, CHANNEL TEMPERATURE (C)


Figure 9. Effect of Temperature on DrainSource
OnState Resistance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

100
90
80
70
60
50
40
30
20
10
0

10

Tchannel = 25C

9.0
8.0
7.0

rDS(on) @ VGS = 0

6.0
VGS(off)

5.0
4.0

3.0
2.0
1.0
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
IDSS, ZEROGATE VOLTAGE DRAIN CURRENT (mA)

V GS , GATESOURCE VOLTAGE
(VOLTS)

r DS(on) , DRAINSOURCE ONSTATE


RESISTANCE (OHMS)

MMBF4391LT1 MMBF4392LT1 MMBF4393LT1

NOTE 2
The ZeroGateVoltage Drain Current (IDSS) is the principle determinant of other JFET characteristics. Figure 10 shows the relationship
of GateSource Off Voltage (VGS(off)) and DrainSource On Resistance (rDS(on)) to IDSS. Most of the devices will be within 10% of the
values shown in Figure 10. This data will be useful in predicting the
characteristic variations for a given part number.
For example:
Unknown
rDS(on) and VGS range for an MMBF4392
The electrical characteristics table indicates that an MMBF4392
has an IDSS range of 25 to 75 mA. Figure 10 shows rDS(on) = 52
Ohms for IDSS = 25 mA and 30 Ohms for IDSS = 75 mA. The corresponding VGS values are 2.2 volts and 4.8 volts.

Figure 10. Effect of IDSS on DrainSource


Resistance and GateSource Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4159

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET
MMBF4416LT1

VHF/UHF Amplifier Transistor

NChannel

Motorola Preferred Device

2 SOURCE

3
GATE
3

1 DRAIN
1

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

DrainSource Voltage

VDS

30

Vdc

DrainGate Voltage

VDG

30

Vdc

GateSource Voltage

VGS

30

Vdc

IG

10

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

TJ, Tstg

55 to +150

Gate Current

CASE 318 08, STYLE 10


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Junction and Storage Temperature

DEVICE MARKING
MMBF4416LT1 = M6A

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)GSS

30

Vdc

1.0
200

OFF CHARACTERISTICS
GateSource Breakdown Voltage
(IG = 1.0 Adc, VDS = 0)
Gate Reverse Current
(VGS = 20 Vdc, VDS = 0)
(VGS = 20 Vdc, VDS = 0, TA = 150C)

IGSS

nAdc

Gate Source Cutoff Voltage


(ID = 1.0 nAdc, VDS = 15 Vdc)

VGS(off)

6.0

Vdc

Gate Source Voltage


(ID = 0.5 mAdc, VDS = 15 Vdc)

VGS

1.0

5.5

Vdc

IDSS

5.0

15

mAdc

VGS(f)

1.0

Vdc

ON CHARACTERISTICS
ZeroGateVoltage Drain Current
(VGS = 15 Vdc, VGS = 0)
GateSource Forward Voltage
(IG = 1.0 mAdc, VDS = 0)
1. FR 5 = 1.0

 0.75  0.062 in.

Preferred devices are Motorola recommended choices for future use and best overall value.

4160

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF4416LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

Forward Transfer Admittance


(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

|Yfs|

4500

7500

mhos

Output Admittance
(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

|yos|

50

mhos

Input Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

4.0

pF

Reverse Transfer Capacitance


(VDS = 15 Vdc, VGS = 0, f = 10 MHz)

Crss

0.8

pF

Output Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Coss

2.0

pF

2.0
4.0

18
10

SMALL SIGNAL CHARACTERISTICS

FUNCTIONAL CHARACTERISTICS
Noise Figure
(VDS = 15 Vdc, ID = 5.0 mAdc, Rg 1000 , f = 100 MHz)
(VDS = 15 Vdc, ID = 5.0 mAdc, Rg 1000 , f = 400 MHz)

NF

Common Source Power Gain


(VDS = 15 Vdc, ID = 5.0 mAdc, f = 100 MHz)
(VDS = 15 Vdc, ID = 5.0 mAdc, f = 400 MHz)

Gps

dB

dB

POWER GAIN
24
f = 100 MHz

PG , POWER GAIN (dB)

20

16

12

400 MHz
Tchannel = 25C
VDS = 15 Vdc
VGS = 0 V

8.0
4.0
0

2.0

4.0
6.0
8.0
10
ID, DRAIN CURRENT (mA)

12

14

Figure 1. Effects of Drain Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4161

MMBF4416LT1
NEUTRALIZING
COIL
INPUT
TO 50
SOURCE

C2

L1

C4
C5
Rg

*L2
*L3

7.0 pF

1.8 pF

C2

1000 pF

17 pF

TO 500
LOAD

L2

C6

C7
COMMON
VDS
+15 V

VGS

*L1

400 MHz

C1

CASE

L3

NOTE:

Adjust VGS for


ID = 50 mA
VGS < 0 Volts

100 MHz

C3

C1

ID = 5.0 mA

The noise source is a hotcold body


(AIL type 70 or equivalent) with a
test receiver (AIL type 136 or equivalent).
**L1

17 turns, (approx. depends upon circuit layout) AWG #28


enameled copper wire, close wound on 9/32 ceramic coil
form. Tuning provided by a powdered iron slug.
41/2 turns, AWG #18 enameled copper wire, 5/16 long,
3/8 I.D. (AIR CORE).
31/2 turns, AWG #18 enameled copper wire, 1/4 long,
3/8 I.D. (AIR CORE).

**L2
**L3

VALUE

Reference
Designation

C3

3.0 pF

1.0 pF

C4

112 pF

0.88.0 pF

C5

112 pF

0.88.0 pF

C6

0.0015 F

0.001 F

C7

0.0015 F

0.001 F

L1

3.0 H*

0.2 H**

L2

0.15 H*

0.03 H**

L3

0.14 H*

0.022 H**

6 turns, (approx. depends upon circuit layout) AWG #24


enameled copper wire, close wound on 7/32 ceramic coil
form. Tuning provided by an aluminum slug.
1 turn, AWG #16 enameled copper wire, 3/8 I.D.
(AIR CORE).
1/2 turn, AWG #16 enameled copper wire, 1/4 I.D.
(AIR CORE).

Figure 2. 100 MHz and 400 MHz Neutralized Test Circuit

NOISE FIGURE
(Tchannel = 25C)
6.5

10
ID = 5.0 mA
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

VDS = 15 V
VGS = 0 V

5.5

8.0

6.0
f = 400 MHz
4.0

2.0

4.5
f = 400 MHz
3.5

2.5

100 MHz

100 MHz

1.5

0
0

2.0

16
4.0 6.0 8.0
10
12
14
VDS, DRAINSOURCE VOLTAGE (VOLTS)

18

20

2.0

Figure 3. Effects of DrainSource Voltage

4.0
6.0
8.0
10
ID, DRAIN CURRENT (mA)

12

14

Figure 4. Effects of Drain Current

INTERMODULATION CHARACTERISTICS
Pout , OUTPUT POWER PER TONE (dB)

+ 40
3RD ORDER INTERCEPT

+ 20
VDS = 15 Vdc
f1 = 399 MHz
f2 = 400 MHz

0
20
40
60
80
100

FUNDAMENTAL
OUTPUT @ IDSS,
0.25 IDSS

120
140
160
120

100

3RD ORDER IMD


OUTPUT @ IDSS,
0.25 IDSS

80
60
40
20
Pin, INPUT POWER PER TONE (dB)

+ 20

Figure 5. Third Order Intermodulation Distortion

4162

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF4416LT1
COMMON SOURCE CHARACTERISTICS

30
20
bis @ IDSS

10
7.0
5.0
3.0

gis @ IDSS

2.0
gis @ 0.25 IDSS
1.0
0.7
0.5
0.3
10

bis @ 0.25 IDSS


20

30

50 70 100
200 300
f, FREQUENCY (MHz)

grs , REVERSE TRANSADMITTANCE (mmhos)


brs , REVERSE SUSCEPTANCE (mmhos)

gis, INPUT CONDUCTANCE (mmhos)


bis, INPUT SUSCEPTANCE (mmhos)

ADMITTANCE PARAMETERS
(VDS = 15 Vdc, Tchannel = 25C)

500 700 1000

5.0
3.0
2.0
brs @ IDSS
1.0
0.7
0.5

0.25 IDSS

0.3
0.2
0.1
0.07
0.05

grs @ IDSS, 0.25 IDSS


10

20

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

10

10
7.0
5.0

gfs @ IDSS
gfs @ 0.25 IDSS

3.0
2.0
1.0
0.7
0.5
0.3
0.2
10

30

Figure 7. Reverse Transfer Admittance (yrs)

|bfs| @ IDSS
|bfs| @ 0.25 IDSS

gos, OUTPUT ADMITTANCE (mhos)


bos, OUTPUT SUSCEPTANCE (mhos)

gfs, FORWARD TRANSCONDUCTANCE (mmhos)


|b fs|, FORWARD SUSCEPTANCE (mmhos)

Figure 6. Input Admittance (yis)

20

5.0
bos @ IDSS and 0.25 IDSS

2.0
1.0
0.5
0.2

gos @ IDSS

0.1
0.05
gos @ 0.25 IDSS

0.02
0.01
20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 8. Forward Transadmittance (yfs)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 9. Output Admittance (yos)

4163

MMBF4416LT1
COMMON SOURCE CHARACTERISTICS
SPARAMETERS
(VDS = 15 Vdc, Tchannel = 25C, Data Points in MHz)
30

20

10

0
1.0

40

350
100

340

330
320

40

310

50

20

10

340

330

0.4

320

0.3
400

310

ID = IDSS, 0.25 IDSS

300
0.8

900

500

ID = IDSS

60

800
300

400

60

500

0.7

600
0.6

300
0.1

500

70

290

400

700
800

700
800

290

0.2
700

600

600

80

350

300

200

50

70

200

100
0.9

30

ID = 0.25 IDSS

280

80

300

280

0.0

200

900

270

90

100

260

100

260

110

250

110

250

120

240

120

240

130

230

130

230

140

220

140

220

90

900

150

160

170

180

190

200

210

150

160

Figure 10. S11s


30

20

10

350

170

340

330

30

20

10

80
90

700

500

0.3
ID = 0.25 IDSS
500

0
350
340
330
100 200
ID = 0.25 IDSS
300
1.0
400
100 200
500
300
600
400
700
0.9
500
800
600
ID = IDSS
700
900
800
900
0.8

310

50

300

60

290

70

280

80

270

90

270

260

100

260

250

110

250

240

120

240

230

130

230

220

140

220

320

310

300
0.7

290

0.3

280

0.6

100

400

400

110

0.4

800

600
100

210

900
700

600

200

40

0.5
60
900

190

320

0.6
50

800

180

Figure 11. S12s

40

70

270

100

300

200

0.4

100

0.5

300
120

ID = IDSS

200

130
0.6

140
150

160

170

180

190

Figure 12. S21s


4164

200

210

150

160

170

180

190

200

210

Figure 13. S22s


Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF4416LT1
COMMON GATE CHARACTERISTICS
ADMITTANCE PARAMETERS
(VDG = 15 Vdc, Tchannel = 25C)

10
7.0
5.0

grg , REVERSE TRANSADMITTANCE (mmhos)


brg , REVERSE SUSCEPTANCE (mmhos)

gig, INPUT CONDUCTANCE (mmhos)


big, INPUT SUSCEPTANCE (mmhos)

20

gig @ IDSS
grg @ 0.25 IDSS

3.0
2.0
1.0
0.7
0.5

big @ IDSS
big @ 0.25 IDSS

0.3
0.2

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

0.5
0.3

0.1
0.07
0.05
0.25 IDSS

0.03
0.02
0.01

0.007
0.005

500 700 1000

brg @ IDSS

0.2

gig @ IDSS, 0.25 IDSS


10

10
7.0
5.0

gfg @ IDSS

3.0

gfg @ 0.25 IDSS

2.0
1.0
0.7
0.5
bfg @ IDSS

0.3

brg @ 0.25 IDSS

0.2

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 15. Reverse Transfer Admittance (yrg)

gog, OUTPUT ADMITTANCE (mmhos)


bog, OUTPUT SUSCEPTANCE (mmhos)

gfg , FORWARD TRANSCONDUCTANCE (mmhos)


bfg , FORWARD SUSCEPTANCE (mmhos)

Figure 14. Input Admittance (yig)

20

1.0
0.7
0.5

bog @ IDSS, 0.25 IDSS

0.3
0.2
0.1
0.07
0.05

gog @ IDSS

0.03
0.02
gog @ 0.25 IDSS

0.1

0.01
10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 16. Forward Transfer Admittance (yfg)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 17. Output Admittance (yog)

4165

MMBF4416LT1
COMMON GATE CHARACTERISTICS
SPARAMETERS
(VDS = 15 Vdc, Tchannel = 25C, Data Points in MHz)
30

20

10

350

340

330

30

0.7

40

100

310

50

300

60

290

70

280

80

350

340

330
320

0.04

200

300

0.03

400

100

500
200

0.5

ID = IDSS
0.4

310

600

300

60
70

40

10

ID = 0.25 IDSS

0.6
50

320

20

0.02

700

400
500

300

800

600
900

0.01

290

700
80

800

0.3

900

90

270

100

260

90

250

270

500
600

100
ID = IDSS

110

280

0.0
100

110

700

600
700

260

ID = 0.25 IDSS

250

0.01

800
240

120

120

240

800
0.02
900

230

130

230

130
900

220

140
150

160

170

180

190

200

140

210

20

10

350

150

160

170

180

190

200

210

340

330

Figure 19. S12g

340

330

30

0.5

40

220

0.04

Figure 18. S11g

30

0.03

320

20

10

40

0
1.5
1.0
100

100
0.4
ID = IDSS

350
300
200

500

320

400

700
600
800

0.9

900

310

50

300

60

290

70

280

80

270

90

270

100

260

100

260

110

250

110

250

120

240

120

240

130

230

130

230

140

220

140

220

50

100

ID = IDSS, 0.25 IDSS

0.3

0.8

60
0.2

70

310

ID = 0.25 IDSS

80
0.1

300
0.7

290
280

0.6

900

90
900

150

160

170

180

190

Figure 20. S21g


4166

200

210

150

160

170

180

190

200

210

Figure 21. S22g


Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET General Purpose


Transistor

MMBF5457LT1

NChannel

2 SOURCE

3
GATE
3

1 DRAIN
1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

DrainSource Voltage

VDS

25

Vdc

DrainGate Voltage

VDG

25

Vdc

VGS(r)

25

Vdc

IG

10

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

TJ, Tstg

55 to +150

Reverse GateSource Voltage


Gate Current

CASE 318 08, STYLE 10


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Junction and Storage Temperature

DEVICE MARKING
MMBF5457LT1 = 6D

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)GSS

25

Vdc

1.0
200

OFF CHARACTERISTICS
GateSource Breakdown Voltage
(IG = 10 Adc, VDS = 0)
Gate Reverse Current
(VGS = 15 Vdc, VDS = 0)
(VGS = 15 Vdc, VDS = 0, TA = 100C)

IGSS

nAdc

Gate Source Cutoff Voltage


(VDS = 15 Vdc, ID = 10 nAdc)

VGS(off)

0.5

6.0

Vdc

Gate Source Voltage


(VDS = 15 Vdc, ID = 100 Adc)

VGS

2.5

Vdc

IDSS

1.0

5.0

mAdc

ON CHARACTERISTICS
ZeroGateVoltage Drain Current(2)
(VDS = 15 Vdc, VGS = 0)

1. FR 5 = 1.0
0.75 0.062 in.
2. Pulse Test: Pulse Width 630 ms, Duty Cycle 10%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4167

MMBF5457LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

Unit

Forward Transfer Admittance(2)


(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

|Yfs|

1000

5000

mhos

Reverse Transfer Admittance


(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

|yrs|

10

50

mhos

Input Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

4.5

7.0

pF

Reverse Transfer Capacitance


(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Crss

1.5

3.0

pF

SMALLSIGNAL CHARACTERISTICS

2. Pulse Test: Pulse Width 630 ms, Duty Cycle 10%.

TYPICAL CHARACTERISTICS
14
VDS = 15 V
VGS = 0
RS = 1 M

VDS = 15 V
VGS = 0
f = 1 kHz

12

NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

10
8
6
4

1
2
0

0.1

0.01

1.0
f, FREQUENCY (kHz)

100

10

0.001

Figure 1. Noise Figure versus Frequency

1.2
VGS(off)

^ 1.2 V

1.2
VGS(off)

VGS = 0 V
I D , DRAIN CURRENT (mA)

I D , DRAIN CURRENT (mA)

^ 1.2 V

1.0
0.2 V

0.8
0.6

0.4 V

0.4

0.6 V

10
15
20
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

Figure 3. Typical Drain Characteristics

0.8
VDS = 15 V
0.6
0.4
0.2

0.8 V
1.0 V

0.2

4168

10

Figure 2. Noise Figure versus Source


Resistance

1.0

0.01
0.1
1.0
RS, SOURCE RESISTANCE (Megohms)

25

0
1.2

0.8
0.4
VGS, GATE SOURCE VOLTAGE (VOLTS)

Figure 4. Common Source Transfer


Characteristics

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF5457LT1
TYPICAL CHARACTERISTICS

4
VGS(off)

VGS(off)

^ 3.5 V

I D , DRAIN CURRENT (mA)

I D , DRAIN CURRENT (mA)

VGS = 0 V

1 V

2
2 V

^ 3.5 V

3
VDS = 15 V
2

3 V
0

10
15
20
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

0
5

25

Figure 5. Typical Drain Characteristics

^ 5.8 V

VGS = 0 V
I D , DRAIN CURRENT (mA)

I D , DRAIN CURRENT (mA)

10

VGS(off)

1 V
6
2 V
4
3 V
2

Figure 6. Common Source Transfer


Characteristics

10

3
2
1
4
VGS, GATE SOURCE VOLTAGE (VOLTS)

4 V

VGS(off)

^ 5.8 V

6
VDS = 15 V
4

5 V
0
0

10
15
20
VDS, DRAIN SOURCE VOLTAGE (VOLTS)

25

Figure 7. Typical Drain Characteristics

0
7

5
4
3
2
1
VGS, GATE SOURCE VOLTAGE (VOLTS)

Figure 8. Common Source Transfer


Characteristics

Note: Graphical data is presented for dc conditions. Tabular


data is given for pulsed conditions (Pulse Width = 630
ms, Duty Cycle = 10%). Under dc conditions, self heating in higher IDSS units reduces IDSS.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4169

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET General Purpose Transistor


PChannel

MMBF5460LT1

2 SOURCE

3
GATE

1 DRAIN

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VDG

40

Vdc

VGSR

40

Vdc

IGF

10

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

TJ, Tstg

55 to +150

DrainGate Voltage
Reverse GateSource Voltage
Forward Gate Current

1
2

CASE 318 08, STYLE 10


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Junction and Storage Temperature

DEVICE MARKING
MMBF5460LT1 = 6E

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)GSS

40

Vdc

5.0
1.0

nAdc
Adc

VGS(off)

0.75

6.0

Vdc

VGS

0.5

4.0

Vdc

IDSS

1.0

5.0

mAdc

Forward Transfer Admittance (VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

|Yfs|

1000

4000

mhos

Output Admittance (VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

|yos|

75

mhos

Input Capacitance (VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

5.0

7.0

pF

Reverse Transfer Capacitance (VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Crss

1.0

2.0

pF

en

20

nV Hz

OFF CHARACTERISTICS
GateSource Breakdown Voltage (IG = 10 Adc, VDS = 0)
Gate Reverse Current
(VGS = 20 Vdc, VDS = 0)
(VGS = 20 Vdc, VDS = 0, TA = 100C)

IGSS

Gate Source Cutoff Voltage (VDS = 15 Vdc, ID = 1.0 Adc)


Gate Source Voltage (VDS = 15 Vdc, ID = 0.1 mAdc)

ON CHARACTERISTICS
ZeroGateVoltage Drain Current (VDS = 15 Vdc, VGS = 0)

SMALLSIGNAL CHARACTERISTICS

Equivalent ShortCircuit Input Noise Voltage


(VDS = 15 Vdc, VGS = 0, RG = 1.0 M,
f = 100 Hz, BW = 1.0 Hz)
1. FR 5 = 1.0

4170

 0.75  0.062 in.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF5460LT1
FORWARD TRANSFER ADMITTANCE
versus DRAIN CURRENT

4.0
VDS = 15 V

I D, DRAIN CURRENT (mA)

3.5
3.0
2.5
TA = 55C

2.0

25C

1.5

125C
1.0
0.5
0
0

0.2

0.4 0.6 0.8


1.0
1.2 1.4
1.6
VGS, GATESOURCE VOLTAGE (VOLTS)

1.8

2.0

Yfs FORWARD TRANSFER ADMITTANCE (m mhos)

DRAIN CURRENT versus GATE


SOURCE VOLTAGE
4000
3000
2000

1000
700
500
VDS = 15 V
f = 1.0 kHz

300
200
0.2

0.3

10

I D, DRAIN CURRENT (mA)

VDS = 15 V

8.0
TA = 55C

7.0
6.0

25C
125C

5.0
4.0
3.0
2.0
1.0

4.0

0.5

1.5
2.0
2.5
3.0
1.0
VGS, GATESOURCE VOLTAGE (VOLTS)

3.5

4.0

7000
5000
3000
2000

1000
VDS = 15 V
f = 1.0 kHz

700
500
0.5

0.7

1.0

2.0
3.0
ID, DRAIN CURRENT (mA)

5.0

7.0

Figure 5. VGS(off) = 4.0 Volts

16

Yfs FORWARD TRANSFER ADMITTANCE (m mhos)

Figure 2. VGS(off) = 4.0 Volts

10000

VDS = 15 V

14
I D, DRAIN CURRENT (mA)

3.0

10000

9.0

2.0

Figure 4. VGS(off) = 2.0 Volts


Yfs FORWARD TRANSFER ADMITTANCE (m mhos)

Figure 1. VGS(off) = 2.0 Volts

0.5
0.7
1.0
ID, DRAIN CURRENT (mA)

12
TA = 55C

10
8.0

25C
125C

6.0
4.0
2.0
0
0

1.0

2.0
3.0
4.0
5.0
6.0
VGS, GATESOURCE VOLTAGE (VOLTS)

7.0

8.0

Figure 3. VGS(off) = 5.0 Volts

Motorola SmallSignal Transistors, FETs and Diodes Device Data

7000
5000
3000
2000

1000
VDS = 15 V
f = 1.0 kHz

700
500
0.5

0.7

1.0

2.0
3.0
ID, DRAIN CURRENT (mA)

5.0

7.0

10

Figure 6. VGS(off) = 5.0 Volts

4171

MMBF5460LT1
10
VDS = 15 V
f = 1.0 kHz

8.0

300
200
IDSS = 3.0 mA
100
70
50

6.0 mA
10 mA

30

7.0
6.0

Ciss

5.0
4.0
3.0
2.0

20
10
0.1

f = 1.0 MHz
VGS = 0

9.0
C, CAPACITANCE (pF)

r oss , OUTPUT RESISTANCE (k ohms)

1000
700
500

Coss

1.0

Crss

0
0.5
1.0
2.0
ID, DRAIN CURRENT (mA)

0.2

5.0

10

Figure 7. Output Resistance


versus Drain Current

40

Figure 8. Capacitance versus


DrainSource Voltage

5.0

10
VDS = 15 V
VGS = 0
RG = 1.0 Megohm

4.0

3.0

2.0

9.0
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

10
20
30
VDS, DRAINSOURCE VOLTAGE (VOLTS)

1.0

VDS = 15 V
VGS = 0
f = 100 Hz

8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0

0
10

20 30 50

100 200 300 500 1000 2000 3000


f, FREQUENCY (Hz)

0
1.0

10,000

Figure 9. Noise Figure versus Frequency

10
100
1000
RS, SOURCE RESISTANCE (k Ohms)

Figure 10. Noise Figure versus


Source Resistance

COMMON SOURCE
y PARAMETERS FOR FREQUENCIES
BELOW 30 MHz

vi
Crss
Ciss

10,000

ross

Coss

| yfs | vi

yis = j Ciss
yos = j Cosp * + 1/ross
yfs = yfs |
yrs = j Crss

* Cosp is Coss in parallel with Series Combination of Ciss and Crss.

NOTE:
1. Graphical data is presented for dc conditions. Tabular
data is given for pulsed conditions (Pulse Width = 630 ms,
Duty Cycle = 10%).

Figure 11. Equivalent Low Frequency Circuit

4172

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET Transistor
NChannel

2 SOURCE

MMBF5484LT1
Motorola Preferred Device

3
GATE

1 DRAIN

MAXIMUM RATINGS
Rating
DrainGate Voltage
Reverse GateSource Voltage
Forward Gate Current

Symbol

Value

Unit

VDG

25

Vdc

VGS(r)

25

Vdc

IG(f)

10

mAdc

200
2.8

mW
mW/C

Continuous Device Dissipation at or Below


TC = 25C
Linear Derating Factor

PD

Storage Channel Temperature Range

Tstg

65 to +150

CASE 318 08, STYLE 10


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

TJ, Tstg

55 to +150

Junction and Storage Temperature

DEVICE MARKING
MMBF5484LT1 = 6B

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)GSS

25

Vdc

1.0
0.2

nAdc
Adc

VGS(off)

0.3

3.0

Vdc

IDSS

1.0

5.0

mAdc

Forward Transfer Admittance


(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

|Yfs|

3000

6000

mhos

Output Admittance
(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)

|yos|

50

mhos

OFF CHARACTERISTICS
GateSource Breakdown Voltage
(IG = 1.0 Adc, VDS = 0)
Gate Reverse Current
(VGS = 20 Vdc, VDS = 0)
(VGS = 20 Vdc, VDS = 0, TA = 100C)
Gate Source Cutoff Voltage
(VDS = 15 Vdc, ID = 10 nAdc)

IGSS

ON CHARACTERISTICS
ZeroGateVoltage Drain Current
(VDS = 15 Vdc, VGS = 0)

SMALL SIGNAL CHARACTERISTICS

1. FR 5 = 1.0

 0.75  0.062 in.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4173

MMBF5484LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Max

Unit

Input Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

5.0

pF

Reverse Transfer Capacitance


(VDS = 15 Vdc, VGS = 0, f = 10 MHz)

Crss

1.0

pF

Output Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Coss

2.0

pF

SMALL SIGNAL CHARACTERISTICS (Continued)

FUNCTIONAL CHARACTERISTICS
Noise Figure
(VDS = 15 Vdc, ID = 1.0 mAdc, YG = 1.0 mmhos)
(RG = 1.0 k, f = 100 MHz)
(VDS = 15 Vdc, VGS = 0, YG = 1.0 mhos)
(RG = 1.0 M, f = 1.0 kHz)

NF

Common Source Power Gain


(VDS = 15 Vdc, ID = 1.0 mAdc, f = 100 MHz)

Gps

dB

3.0

2.5

16

25

dB

POWER GAIN
24
f = 100 MHz

PG , POWER GAIN (dB)

20

16

12

400 MHz
Tchannel = 25C
VDS = 15 Vdc
VGS = 0 V

8.0
4.0
0

2.0

4.0
6.0
8.0
10
ID, DRAIN CURRENT (mA)

12

14

Figure 1. Effects of Drain Current

4174

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF5484LT1
NEUTRALIZING
COIL
INPUT
TO 50
SOURCE

C2

L1

C4
C5
Rg

*L2
*L3

7.0 pF

1.8 pF

C2

1000 pF

17 pF

TO 500
LOAD

L2

C6

C7
COMMON
VDS
+15 V

VGS

*L1

400 MHz

C1

CASE

L3

NOTE:

Adjust VGS for


ID = 50 mA
VGS < 0 Volts

100 MHz

C3

C1

ID = 5.0 mA

The noise source is a hotcold body


(AIL type 70 or equivalent) with a
test receiver (AIL type 136 or equivalent).
**L1

17 turns, (approx. depends upon circuit layout) AWG #28


enameled copper wire, close wound on 9/32 ceramic coil
form. Tuning provided by a powdered iron slug.
41/2 turns, AWG #18 enameled copper wire, 5/16 long,
3/8 I.D. (AIR CORE).
31/2 turns, AWG #18 enameled copper wire, 1/4 long,
3/8 I.D. (AIR CORE).

**L2
**L3

VALUE

Reference
Designation

C3

3.0 pF

1.0 pF

C4

112 pF

0.88.0 pF

C5

112 pF

0.88.0 pF

C6

0.0015 F

0.001 F

C7

0.0015 F

0.001 F

L1

3.0 H*

0.2 H**

L2

0.15 H*

0.03 H**

L3

0.14 H*

0.022 H**

6 turns, (approx. depends upon circuit layout) AWG #24


enameled copper wire, close wound on 7/32 ceramic coil
form. Tuning provided by an aluminum slug.
1 turn, AWG #16 enameled copper wire, 3/8 I.D.
(AIR CORE).
1/2 turn, AWG #16 enameled copper wire, 1/4 I.D.
(AIR CORE).

Figure 2. 100 MHz and 400 MHz Neutralized Test Circuit

NOISE FIGURE
(Tchannel = 25C)
6.5

10
ID = 5.0 mA
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

VDS = 15 V
VGS = 0 V

5.5

8.0

6.0
f = 400 MHz
4.0

2.0

4.5
f = 400 MHz
3.5

2.5

100 MHz

100 MHz

1.5

0
0

2.0

16
4.0 6.0 8.0
10
12
14
VDS, DRAINSOURCE VOLTAGE (VOLTS)

18

20

2.0

Figure 3. Effects of DrainSource Voltage

4.0
6.0
8.0
10
ID, DRAIN CURRENT (mA)

12

14

Figure 4. Effects of Drain Current

INTERMODULATION CHARACTERISTICS
Pout , OUTPUT POWER PER TONE (dB)

+ 40
3RD ORDER INTERCEPT

+ 20
VDS = 15 Vdc
f1 = 399 MHz
f2 = 400 MHz

0
20
40
60
80
100

FUNDAMENTAL
OUTPUT @ IDSS,
0.25 IDSS

120
140
160
120

100

3RD ORDER IMD


OUTPUT @ IDSS,
0.25 IDSS

80
60
40
20
Pin, INPUT POWER PER TONE (dB)

+ 20

Figure 5. Third Order Intermodulation Distortion

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4175

MMBF5484LT1
COMMON SOURCE CHARACTERISTICS

30
20

grs , REVERSE TRANSADMITTANCE (mmhos)


brs , REVERSE SUSCEPTANCE (mmhos)

gis, INPUT CONDUCTANCE (mmhos)


bis, INPUT SUSCEPTANCE (mmhos)

ADMITTANCE PARAMETERS
(VDS = 15 Vdc, Tchannel = 25C)

bis @ IDSS

10
7.0
5.0
3.0

gis @ IDSS

2.0
gis @ 0.25 IDSS
1.0
0.7
0.5
0.3
10

bis @ 0.25 IDSS


20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

5.0
3.0
2.0
brs @ IDSS
1.0
0.7
0.5

0.25 IDSS

0.3
0.2
0.1
0.07
0.05

grs @ IDSS, 0.25 IDSS


10

20

gfs @ IDSS
gfs @ 0.25 IDSS

3.0
2.0
1.0
0.7
0.5

|bfs| @ IDSS
|bfs| @ 0.25 IDSS

500 700 1000

5.0
bos @ IDSS and 0.25 IDSS

2.0
1.0
0.5
0.2

gos @ IDSS

0.1
0.05
gos @ 0.25 IDSS

0.02
0.01
20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 8. Forward Transadmittance (yfs)

4176

50 70 100
200 300
f, FREQUENCY (MHz)

10

10
7.0
5.0

0.3
0.2
10

30

Figure 7. Reverse Transfer Admittance (yrs)

gos, OUTPUT ADMITTANCE (mhos)


bos, OUTPUT SUSCEPTANCE (mhos)

gfs, FORWARD TRANSCONDUCTANCE (mmhos)


|b fs|, FORWARD SUSCEPTANCE (mmhos)

Figure 6. Input Admittance (yis)

20

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 9. Output Admittance (yos)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF5484LT1
COMMON SOURCE CHARACTERISTICS
SPARAMETERS
(VDS = 15 Vdc, Tchannel = 25C, Data Points in MHz)
30

20

10

0
1.0

40

350
100

340

330
320

40

310

50

20

10

340

330

0.4

320

0.3
400

310

ID = IDSS, 0.25 IDSS

300
0.8

900

500

ID = IDSS

60

800
300

400

60

500

0.7

600
0.6

300
0.1

500

70

290

400

700
800

700
800

290

0.2
700

600

600

80

350

300

200

50

70

200

100
0.9

30

ID = 0.25 IDSS

280

80

300

280

0.0

200

900

270

90

100

260

100

260

110

250

110

250

120

240

120

240

130

230

130

230

140

220

140

220

90

900

150

160

170

180

190

200

210

150

160

Figure 10. S11s


30

20

10

350

170

340

330

30

20

10

80
90

700

110

0.4

800

600
100

210

0
350
340
330
100 200
ID = 0.25 IDSS
300
1.0
400
100 200
500
300
600
400
700
0.9
500
800
600
ID = IDSS
700
900
800
900
0.8

310

50

300

60

290

70

280

80

270

90

270

260

100

260

250

110

250

240

120

240

230

130

230

220

140

220

320

310

300
0.7

290

900
700

600

200

40

0.5
60
900

190

320

0.6
50

800

180

Figure 11. S12s

40

70

270

100

500

0.3
ID = 0.25 IDSS
500

0.3
100

400

400

280

0.6

300

200

0.4

100

0.5

300
120

ID = IDSS

200

130
0.6

140
150

160

170

180

190

200

210

Figure 12. S21s


Motorola SmallSignal Transistors, FETs and Diodes Device Data

150

160

170

180

190

200

210

Figure 13. S22s


4177

MMBF5484LT1
COMMON GATE CHARACTERISTICS
ADMITTANCE PARAMETERS
(VDG = 15 Vdc, Tchannel = 25C)

10
7.0
5.0

grg , REVERSE TRANSADMITTANCE (mmhos)


brg , REVERSE SUSCEPTANCE (mmhos)

gig, INPUT CONDUCTANCE (mmhos)


big, INPUT SUSCEPTANCE (mmhos)

20

gig @ IDSS
grg @ 0.25 IDSS

3.0
2.0
1.0
0.7
0.5

big @ IDSS
big @ 0.25 IDSS

0.3
0.2

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

0.5
0.3
brg @ IDSS

0.2
0.1
0.07
0.05

0.25 IDSS

0.03
0.02
0.01

0.007
0.005

gig @ IDSS, 0.25 IDSS


10

10
7.0
5.0

gfg @ IDSS

3.0

gfg @ 0.25 IDSS

2.0
1.0
0.7
0.5
bfg @ IDSS

0.3

brg @ 0.25 IDSS

0.2

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 15. Reverse Transfer Admittance (yrg)

gog, OUTPUT ADMITTANCE (mmhos)


bog, OUTPUT SUSCEPTANCE (mmhos)

gfg , FORWARD TRANSCONDUCTANCE (mmhos)


bfg , FORWARD SUSCEPTANCE (mmhos)

Figure 14. Input Admittance (yig)

20

1.0
0.7
0.5

bog @ IDSS, 0.25 IDSS

0.3
0.2
0.1
0.07
0.05

gog @ IDSS

0.03
0.02
gog @ 0.25 IDSS

0.1

0.01
10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 16. Forward Transfer Admittance (yfg)

4178

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 17. Output Admittance (yog)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBF5484LT1
COMMON GATE CHARACTERISTICS
SPARAMETERS
(VDS = 15 Vdc, Tchannel = 25C, Data Points in MHz)
30

20

10

350

340

330

30

0.7

40

100

310

50

300

60

290

70

280

80

350

340

330
320

0.04

200

300

0.03

400

100

500
200

0.5

ID = IDSS
0.4

310

600

300

60
70

40

10

ID = 0.25 IDSS

0.6
50

320

20

0.02

700

400
500

300

800

600
900

0.01

290

700
80

800

0.3

900

90

270

100

260

90

250

270

500
600

100
ID = IDSS

110

280

0.0
100

110

700

600
700

260

ID = 0.25 IDSS

250

0.01

800
240

120

120

240

800
0.02
900

230

130

230

130
900

220

140
150

160

170

180

190

200

140

210

20

10

350

150

160

170

180

190

200

210

340

330

Figure 19. S12g

340

330

30

0.5

40

220

0.04

Figure 18. S11g

30

0.03

320

20

10

40

0
1.5
1.0
100

100
0.4
ID = IDSS

350
300
200

500

320

400

700
600
800

0.9

900

310

50

300

60

290

70

280

80

270

90

270

100

260

100

260

110

250

110

250

120

240

120

240

130

230

130

230

140

220

140

220

50

100

ID = IDSS, 0.25 IDSS

0.3

0.8

60
0.2

70

310

ID = 0.25 IDSS

80
0.1

300
0.7

290
280

0.6

900

90
900

150

160

170

180

190

200

210

Figure 20. S21g


Motorola SmallSignal Transistors, FETs and Diodes Device Data

150

160

170

180

190

200

210

Figure 21. S22g


4179

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET Chopper

MMBFJ175LT1

PChannel Depletion

Motorola Preferred Device

2 SOURCE
3
GATE

1 DRAIN
1
2

MAXIMUM RATINGS
Rating
Drain Gate Voltage
Reverse Gate Source Voltage

Symbol

Value

Unit

VDG

25

VGS(r)

25

CASE 318 08, STYLE 10


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

Characteristic

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RqJA

556

C/W

TJ, Tstg

55 to +150

Junction and Storage Temperature

DEVICE MARKING
MMBFJ175LT1 = 6W

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

V(BR)GSS

30

Gate Reverse Current


(VDS = 0 V, VGS = 20 V)

IGSS

1.0

nA

Gate Source Cutoff Voltage


(VDS = 15, ID = 10 nA)

VGS(OFF)

3.0

6.0

Zero Gate Voltage Drain Current (2)


(VGS = 0, VDS = 15 V)

IDSS

7.0

60

mA

Drain Cutoff Current


(VDS = 15 V, VGS = 10 V)

ID(off)

1.0

nA

Drain Source On Resistance


(ID = 500 A)

rDS(on)

125

Ciss

11

Crss

5.5

Characteristic

OFF CHARACTERISTICS
Gate Source Breakdown Voltage
(VDS = 0, ID = 1.0 A)

ON CHARACTERISTICS

Input Capacitance

VDS = 0, VGS = 10 V
f = 1.0 MHz

Reverse Transfer Capacitance


1. FR5 = 1.0 x 0.75 x 0.062 in.
2. Pulse Test: Pulse Width
300 s, Duty Cycle

pF
F

v 2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

4180

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET Chopper

PChannel Depletion

2 SOURCE

MMBFJ177LT1

3
GATE

1 DRAIN

3
1

MAXIMUM RATINGS
Rating
DrainGate Voltage
Reverse GateSource Voltage

Symbol

Value

Unit

VDG

25

Vdc

VGS(r)

25

Vdc

CASE 318 08, STYLE 10


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

Characteristic

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

TJ, Tstg

55 to +150

Junction and Storage Temperature

DEVICE MARKING
MMBFJ177LT1 = 6Y

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

GateSource Breakdown Voltage


(VDS = 0, ID = 1.0 Adc)

V(BR)GSS

30

Vdc

Gate Reverse Current


(VDS = 0 Vdc, VGS = 20 Vdc)

IGSS

1.0

nAdc

Gate Source Cutoff Voltage


(VDS = 15 Vdc, ID = 10 nAdc)

VGS(off)

0.8

2.5

Vdc

ZeroGateVoltage Drain Current(2)


(VGS = 0, VDS = 15 Vdc)

IDSS

1.5

20

mAdc

Drain Cutoff Current


(VDS = 15 Vdc, VGS = 10 Vdc)

ID(off)

1.0

nAdc

rDS(on)

300

Ciss

11

pF

Crss

5.5

OFF CHARACTERISTICS

ON CHARACTERISTICS

Drain Source On Resistance


(ID = 500 Adc)
Input Capacitance
Reverse Transfer Capacitance

VDS = 0, VGS = 10 Vdc


f = 1.0 MHz

1. FR 5 = 1.0
0.75 0.062 in.
2. Pulse Test: Pulse Width < 300 s, Duty Cycle 2%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4181

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET VHF/UHF Amplifier Transistor

NChannel

MMBFJ309LT1
MMBFJ310LT1

2 SOURCE

3
GATE

1 DRAIN

3
1

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

DrainSource Voltage

VDS

25

Vdc

GateSource Voltage

VGS

25

Vdc

IG

10

mAdc

Gate Current

CASE 318 08, STYLE 10


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

TJ, Tstg

55 to +150

Junction and Storage Temperature

DEVICE MARKING
MMBFJ309LT1 = 6U; MMBFJ310LT1 = 6T

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)GSS

25

Vdc

IGSS

1.0
1.0

nAdc
Adc

MMBFJ309
MMBFJ310

VGS(off)

1.0
2.0

4.0
6.5

Vdc

MMBFJ309
MMBFJ310

IDSS

12
24

30
60

mAdc

VGS(f)

1.0

Vdc

Forward Transfer Admittance (VDS = 10 Vdc, ID = 10 mAdc, f = 1.0 kHz)

|Yfs|

8.0

18

mmhos

Output Admittance (VDS = 10 Vdc, ID = 10 mAdc, f = 1.0 kHz)

|yos|

250

mhos

Input Capacitance (VGS = 10 Vdc, VDS = 0 Vdc, f = 1.0 MHz)

Ciss

5.0

pF

Reverse Transfer Capacitance (VGS = 10 Vdc, VDS = 0 Vdc, f = 1.0 MHz)

Crss

2.5

pF

en

10

nV Hz

OFF CHARACTERISTICS
GateSource Breakdown Voltage (IG = 1.0 Adc, VDS = 0)
Gate Reverse Current (VGS = 15 Vdc)
Gate Reverse Current (VGS = 15 Vdc, TA = 125C)
Gate Source Cutoff Voltage
(VDS = 10 Vdc, ID = 1.0 nAdc)

ON CHARACTERISTICS
ZeroGateVoltage Drain Current
(VDS = 10 Vdc, VGS = 0)
GateSource Forward Voltage (IG = 1.0 mAdc, VDS = 0)

SMALLSIGNAL CHARACTERISTICS

Equivalent ShortCircuit Input Noise Voltage


(VDS = 10 Vdc, ID = 10 mAdc, f = 100 Hz)
1. FR 5 = 1.0

4182

 0.75  0.062 in.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBFJ309LT1 MMBFJ310LT1
50
SOURCE

50
LOAD

U310
C3

L2P
L1

L2S

C2

C1

C4
C6

C5
C7
1.0 k

RFC
+VDD

C1 = C2 = 0.8 10 pF, JFD #MVM010W.


C3 = C4 = 8.35 pF Erie #539002D.
C5 = C6 = 5000 pF Erie (2443000).
C7 = 1000 pF, Allen Bradley #FA5C.
RFC = 0.33 H Miller #923030.
L1 = One Turn #16 Cu, 1/4 I.D. (Air Core).
L2P = One Turn #16 Cu, 1/4 I.D. (Air Core).
L2S = One Turn #16 Cu, 1/4 I.D. (Air Core).

60
VDS = 10 V

TA = 55C
50

50
+ 25C

IDSS
+ 25C

40

40

30

30

+150C

20

20

+ 25C
55C

10
5.0

+150C 10
0
0

1.0
4.0
3.0
2.0
ID VGS, GATESOURCE VOLTAGE (VOLTS)
IDSS VGS, GATESOURCE CUTOFF VOLTAGE (VOLTS)

35
30

20
+150C

15

+ 25C
55C

10

+150C

5.0
0

5.0

4.0

Yos

VGS(off) = 2.3 V =
VGS(off) = 5.7 V =

10

10

120
RDS

CAPACITANCE (pF)

Yos, OUTPUT ADMITTANCE ( mhos)

Yfs , FORWARD TRANSCONDUCTANCE (mhos)

100

1.0 k

1.0

2.0

Figure 3. Forward Transconductance


versus GateSource Voltage

Yfs

10 k

3.0

VGS, GATESOURCE VOLTAGE (VOLTS)

1.0 k

Yfs

+ 25C

25

Figure 2. Drain Current and Transfer


Characteristics versus GateSource Voltage

100 k

TA = 55C

VDS = 10 V
f = 1.0 MHz

96

7.0
72
Cgs
4.0

48

24

Cgd

R DS , ON RESISTANCE (OHMS)

I D , DRAIN CURRENT (mA)

60

IDSS, SATURATION DRAIN CURRENT (mA)

70

70

Yfs , FORWARD TRANSCONDUCTANCE (mmhos)

Figure 1. 450 MHz CommonGate Amplifier Test Circuit

1.0
100
0.01

1.0
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100
ID, DRAIN CURRENT (mA)

Figure 4. CommonSource Output


Admittance and Forward Transconductance
versus Drain Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0
10

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

1.0

0
0

VGS, GATE SOURCE VOLTAGE (VOLTS)

Figure 5. On Resistance and Junction


Capacitance versus GateSource Voltage

4183

MMBFJ309LT1 MMBFJ310LT1
|S21|, |S11|
0.85 0.45

2.4

0.79 0.39

|S12|, |S22|
0.060 1.00
S22

VDS = 10 V
ID = 10 mA
TA = 25C

24

3.0

0.048 0.98
S21

Y11

18

1.8

Y21

12

1.2

0.73 0.33

VDS = 10 V
ID = 10 mA
TA = 25C

0.67 0.27

0.024 0.94

0.61 0.21

0.6

0.012 0.92
S12

Y12
0
100

200
300
500
f, FREQUENCY (MHz)

700

0.55 0.15
100

1000

Figure 6. CommonGate Y Parameter


Magnitude versus Frequency

22

160

40

200
300
500
f, FREQUENCY (MHz)

11, 12
20 120

40

0.90

86

40 100

85

60

80

120 84

80

60

100

40

120

20
100

21, 22
0

11

20

21

700 1000

Figure 7. CommonGate S Parameter


Magnitude versus Frequency

12, 22
20 87

21, 11
180 50

170

0.036 0.96

S11

Y22

6.0

Y12 (mmhos)

|Y11|, |Y21 |, |Y22 | (mmhos)

30

21

22

20

60
80

30

40

100
20

140

10

12
11

130

0
100

140
VDS = 10 V
ID = 10 mA
TA = 25C

200
300
500
f, FREQUENCY (MHz)

180
200 82
1000

Figure 8. CommonGate Y Parameter


PhaseAngle versus Frequency

8.0

24

7.0

21

6.0

18

5.0

15
Gpg

4.0

12
NF

3.0

9.0

2.0

6.0

1.0

3.0

0
4.0

6.0

8.0

10 12
14 16
18
ID, DRAIN CURRENT (mA)

20

Figure 10. Noise Figure and


Power Gain versus Drain Current

4184

11

200
300
500
f, FREQUENCY (MHz)

700

80

100
1000

26

VDD = 20 V
f = 450 MHz
BW 10 MHz
CIRCUIT IN FIGURE 1

22

0
24

NF, NOISE FIGURE (dB)

6.0

VDS = 10 V
ID = 10 mA
TA = 25C

Figure 9. S Parameter PhaseAngle


versus Frequency

G pg , POWER GAIN (dB)

NF, NOISE FIGURE (dB)

7.0

60

12

160 83

700

21

22
5.0
4.0
3.0
2.0

18

Gpg
VDS = 10 V
ID = 10 mA
TA = 25C
CIRCUIT IN FIGURE 1

14
10
NF

G pg , POWER GAIN (dB)

150

6.0
1.0
2.0
0

50
100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 11. Noise Figure and Power Gain


versus Frequency

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBFJ309LT1 MMBFJ310LT1
C1

C6

U310
S

D
G

C3

L1
INPUT
RS = 50

C4

L3

OUTPUT
RL = 50

C5

C2
L2

L4

VS

C1 = 110 pF Johanson Air variable trimmer.


C2, C5 = 100 pF feed thru button capacitor.
C3, C4, C6 = 0.56 pF Johanson Air variable
trimmer.
L1 = 1/8 x 1/32 x 15/8 copper bar.
L2, L4 = Ferroxcube Vk200 choke.
L3 = 1/8 x 1/32 x 17/8 copper bar.

VD

SHIELD

BW (3 dB) 36.5 MHz


ID 10 mAdc
VDS 20 Vdc
Device case grounded
IM test tones f1 = 449.5 MHz, f2 = 450.5 MHz

Figure 12. 450 MHz IMD Evaluation Amplifier


Amplifier power gain and IMD products are a function of the load impedance. For the amplifier design shown above with C4 and
C6 adjusted to reflect a load to the drain resulting in a nominal power gain of 9 dB, the 3rd order intercept point (IP) value is
29 dBm. Adjusting C4, C6 to provide larger load values will result in higher gain, smaller bandwidth and lower IP values. For
example, a nominal gain of 13 dB can be achieved with an intercept point of 19 dBm.

OUTPUT POWER PER TONE (dBm)

+40
+20
0
20
40

U310 JFET
VDS = 20 Vdc
ID = 10 mAdc
F1 = 449.5 MHz
F2 = 450.5 MHz

3RD ORDER INTERCEPT POINT

FUNDAMENTAL OUTPUT
Example of intercept point plot use:
Assume two inband signals of 20 dBm at the amplifier input.
They will result in a 3rd order IMD signal at the output of
90 dBm. Also, each signal level at the output will be
11 dBm, showing an amplifier gain of 9.0 dB and an
intermodulation ratio (IMR) capability of 79 dB. The gain and
IMR values apply only for signal levels below comparison.

60
80
3RD ORDER IMD OUTPUT

100
120
120

100

60
40
20
80
INPUT POWER PER TONE (dBm)

+20

Figure 13. Two Tone 3rd Order Intercept Point

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4185

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET Transistor
NChannel

2 SOURCE

MMBFU310LT1
Motorola Preferred Device

3
GATE

1 DRAIN

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

DrainSource Voltage

VDS

25

Vdc

GateSource Voltage

VGS

25

Vdc

IG

10

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

TJ, Tstg

55 to +150

Gate Current

CASE 318 08, STYLE 10


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Junction and Storage Temperature

DEVICE MARKING
MMBFU310LT1 = 6C

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)GSS

25

Vdc

Gate 1 Leakage Current (VGS = 15 Vdc, VDS = 0)

IG1SS

150

pA

Gate 2 Leakage Current (VGS = 15 Vdc, VDS = 0, TA = 125C)

IG2SS

150

nAdc

VGS(off)

2.5

6.0

Vdc

IDSS

24

60

mAdc

VGS(f)

1.0

Vdc

Forward Transfer Admittance


(VDS = 10 Vdc, ID = 10 mAdc, f = 1.0 kHz)

|Yfs|

10

18

mmhos

Output Admittance
(VDS = 10 Vdc, ID = 10 mAdc, f = 1.0 kHz)

|yos|

250

mhos

Input Capacitance
(VGS = 10 Vdc, VDS = 0 Vdc, f = 1.0 MHz)

Ciss

5.0

pF

Reverse Transfer Capacitance


(VGS = 10 Vdc, VDS = 0 Vdc, f = 1.0 MHz)

Crss

2.5

pF

OFF CHARACTERISTICS
GateSource Breakdown Voltage (IG = 1.0 Adc, VDS = 0)

Gate Source Cutoff Voltage (VDS = 10 Vdc, ID = 1.0 nAdc)

ON CHARACTERISTICS
ZeroGateVoltage Drain Current (VDS = 10 Vdc, VGS = 0)
GateSource Forward Voltage (IG = 10 mAdc, VDS = 0)

SMALLSIGNAL CHARACTERISTICS

1. FR 5 = 1.0

 0.75  0.062 in.

Preferred devices are Motorola recommended choices for future use and best overall value.

4186

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBFU310LT1
50
SOURCE

50
LOAD

U310
C3

L2P
L1

L2S

C2

C1

C4
C6

C5
C7
1.0 k

RFC
+VDD

C1 = C2 = 0.8 10 pF, JFD #MVM010W.


C3 = C4 = 8.35 pF Erie #539002D.
C5 = C6 = 5000 pF Erie (2443000).
C7 = 1000 pF, Allen Bradley #FA5C.
RFC = 0.33 H Miller #923030.
L1 = One Turn #16 Cu, 1/4 I.D. (Air Core).
L2P = One Turn #16 Cu, 1/4 I.D. (Air Core).
L2S = One Turn #16 Cu, 1/4 I.D. (Air Core).

60
VDS = 10 V

TA = 55C
50

50
+ 25C

IDSS
+ 25C

40

40

30

30

+150C

20

20

+ 25C
55C

10
5.0

+150C 10
0
0

1.0
4.0
3.0
2.0
ID VGS, GATESOURCE VOLTAGE (VOLTS)
IDSS VGS, GATESOURCE CUTOFF VOLTAGE (VOLTS)

35
30

20
+150C

15

+ 25C
55C

10

+150C

5.0
0

5.0

4.0

Yos

VGS(off) = 2.3 V =
VGS(off) = 5.7 V =

10

10

120
RDS

CAPACITANCE (pF)

Yos, OUTPUT ADMITTANCE ( mhos)

Yfs , FORWARD TRANSCONDUCTANCE (mhos)

100

1.0 k

1.0

2.0

Figure 3. Forward Transconductance


versus GateSource Voltage

Yfs

10 k

3.0

VGS, GATESOURCE VOLTAGE (VOLTS)

1.0 k

Yfs

+ 25C

25

Figure 2. Drain Current and Transfer


Characteristics versus GateSource Voltage

100 k

TA = 55C

VDS = 10 V
f = 1.0 MHz

96

7.0
72
Cgs
4.0

48

24

Cgd

R DS , ON RESISTANCE (OHMS)

I D , DRAIN CURRENT (mA)

60

IDSS, SATURATION DRAIN CURRENT (mA)

70

70

Yfs , FORWARD TRANSCONDUCTANCE (mmhos)

Figure 1. 450 MHz CommonGate Amplifier Test Circuit

1.0
100
0.01

1.0
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100
ID, DRAIN CURRENT (mA)

Figure 4. CommonSource Output


Admittance and Forward Transconductance
versus Drain Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0
10

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

1.0

0
0

VGS, GATE SOURCE VOLTAGE (VOLTS)

Figure 5. On Resistance and Junction


Capacitance versus GateSource Voltage

4187

MMBFU310LT1
|S21|, |S11|
0.85 0.45

2.4

0.79 0.39

|S12|, |S22|
0.060 1.00
S22

VDS = 10 V
ID = 10 mA
TA = 25C

24

3.0

0.048 0.98
S21

Y11

18

1.8

Y21

12

1.2

0.73 0.33

VDS = 10 V
ID = 10 mA
TA = 25C

0.67 0.27

0.024 0.94

0.61 0.21

0.6

0.012 0.92
S12

Y12
0
100

200
300
500
f, FREQUENCY (MHz)

700

0.55 0.15
100

1000

Figure 6. CommonGate Y Parameter


Magnitude versus Frequency

22

160

40

200
300
500
f, FREQUENCY (MHz)

11, 12
20 120

40

0.90

86

40 100

85

60

80

120 84

80

60

100

40

120

20
100

21, 22
0

11

20

21

700 1000

Figure 7. CommonGate S Parameter


Magnitude versus Frequency

12, 22
20 87

21, 11
180 50

170

0.036 0.96

S11

Y22

6.0

Y12 (mmhos)

|Y11|, |Y21 |, |Y22 | (mmhos)

30

21

22

20

60
80

30

40

100
20

140

10

12
11

130

0
100

140
VDS = 10 V
ID = 10 mA
TA = 25C

200
300
500
f, FREQUENCY (MHz)

180
200 82
1000

Figure 8. CommonGate Y Parameter


PhaseAngle versus Frequency

8.0

24

7.0

21

6.0

18

5.0

15
Gpg

4.0

12
NF

3.0

9.0

2.0

6.0

1.0

3.0

0
4.0

6.0

8.0

10 12
14 16
18
ID, DRAIN CURRENT (mA)

20

Figure 10. Noise Figure and


Power Gain versus Drain Current

4188

11

200
300
500
f, FREQUENCY (MHz)

700

80

100
1000

26

VDD = 20 V
f = 450 MHz
BW 10 MHz
CIRCUIT IN FIGURE 1

22

0
24

NF, NOISE FIGURE (dB)

6.0

VDS = 10 V
ID = 10 mA
TA = 25C

Figure 9. S Parameter PhaseAngle


versus Frequency

G pg , POWER GAIN (dB)

NF, NOISE FIGURE (dB)

7.0

60

12

160 83

700

21

22
5.0
4.0
3.0
2.0

18

Gpg
VDS = 10 V
ID = 10 mA
TA = 25C
CIRCUIT IN FIGURE 1

14
10
NF

G pg , POWER GAIN (dB)

150

6.0
1.0
2.0
0

50
100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 11. Noise Figure and Power Gain


versus Frequency

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBFU310LT1
C1

C6

U310
S

D
G

C3

L1
INPUT
RS = 50

C4

L3

OUTPUT
RL = 50

C5

C2
L2

L4

VS

C1 = 110 pF Johanson Air variable trimmer.


C2, C5 = 100 pF feed thru button capacitor.
C3, C4, C6 = 0.56 pF Johanson Air variable
trimmer.
L1 = 1/8 x 1/32 x 15/8 copper bar.
L2, L4 = Ferroxcube Vk200 choke.
L3 = 1/8 x 1/32 x 17/8 copper bar.

VD

SHIELD

BW (3 dB) 36.5 MHz


ID 10 mAdc
VDS 20 Vdc
Device case grounded
IM test tones f1 = 449.5 MHz, f2 = 450.5 MHz

Figure 12. 450 MHz IMD Evaluation Amplifier


Amplifier power gain and IMD products are a function of the load impedance. For the amplifier design shown above with C4 and
C6 adjusted to reflect a load to the drain resulting in a nominal power gain of 9 dB, the 3rd order intercept point (IP) value is
29 dBm. Adjusting C4, C6 to provide larger load values will result in higher gain, smaller bandwidth and lower IP values. For
example, a nominal gain of 13 dB can be achieved with an intercept point of 19 dBm.

OUTPUT POWER PER TONE (dBm)

+40
+20
0
20
40

U310 JFET
VDS = 20 Vdc
ID = 10 mAdc
F1 = 449.5 MHz
F2 = 450.5 MHz

3RD ORDER INTERCEPT POINT

FUNDAMENTAL OUTPUT
Example of intercept point plot use:
Assume two inband signals of 20 dBm at the amplifier input.
They will result in a 3rd order IMD signal at the output of
90 dBm. Also, each signal level at the output will be
11 dBm, showing an amplifier gain of 9.0 dB and an
intermodulation ratio (IMR) capability of 79 dB. The gain and
IMR values apply only for signal levels below comparison.

60
80
3RD ORDER IMD OUTPUT

100
120
120

100

60
40
20
80
INPUT POWER PER TONE (dBm)

+20

Figure 13. Two Tone 3rd Order Intercept Point

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4189

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFET VHF Amplifier


NChannel Depletion

MPF102

1 DRAIN

3
GATE

2 SOURCE

MAXIMUM RATINGS
Symbol

Value

Unit

Drain Source Voltage

Rating

VDS

25

Vdc

Drain Gate Voltage

VDG

25

Vdc

Gate Source Voltage

VGS

25

Vdc

Gate Current

IG

10

mAdc

Total Device Dissipation @ TA = 25C


Derate above 25C

PD

350
2.8

mW
mW/C

Junction Temperature Range

TJ

125

Storage Temperature Range

Tstg

65 to +150

1
2

CASE 2904, STYLE 5


TO92 (TO226AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)GSS

25

Vdc

2.0
2.0

nAdc
Adc

OFF CHARACTERISTICS
Gate Source Breakdown Voltage
(IG = 10 Adc, VDS = 0)
Gate Reverse Current
(VGS = 15 Vdc, VDS = 0)
(VGS = 15 Vdc, VDS = 0, TA = 100C)

IGSS

Gate Source Cutoff Voltage


(VDS = 15 Vdc, ID = 2.0 nAdc)

VGS(off)

8.0

Vdc

Gate Source Voltage


(VDS = 15 Vdc, ID = 0.2 mAdc)

VGS

0.5

7.5

Vdc

IDSS

2.0

20

mAdc

2000
1600

7500

ON CHARACTERISTICS
Zero Gate Voltage Drain Current(1)
(VDS = 15 Vdc, VGS = 0 Vdc)

SMALL SIGNAL CHARACTERISTICS


mmhos

Forward Transfer Admittance(1)


(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz)
(VDS = 15 Vdc, VGS = 0, f = 100 MHz)

yfs

Input Admittance
(VDS = 15 Vdc, VGS = 0, f = 100 MHz)

Re(yis)

800

mmhos

Output Conductance
(VDS = 15 Vdc, VGS = 0, f = 100 MHz)

Re(yos)

200

mmhos

Input Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Ciss

7.0

pF

Reverse Transfer Capacitance


(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz)

Crss

3.0

pF

1. Pulse Test; Pulse Width

4190

v 630 ms, Duty Cycle v 10%.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPF102
POWER GAIN
24
f = 100 MHz

PG , POWER GAIN (dB)

20

16

12

400 MHz
Tchannel = 25C
VDS = 15 Vdc
VGS = 0 V

8.0
4.0
0

4.0
6.0
8.0
10
ID, DRAIN CURRENT (mA)

2.0

12

14

Figure 1. Effects of Drain Current

Reference
Designation
NEUTRALIZING
COIL
INPUT
TO 50
SOURCE

C2

L1

C4
C5
Rg

Adjust VGS for


ID = 50 mA
VGS < 0 Volts

*L2
*L3

TO 500
LOAD

L2

CASE

L3

C7

C6
VGS

*L1

C3

C1

NOTE:

COMMON
VDS
+15 V

ID = 5.0 mA

The noise source is a hotcold body


(AIL type 70 or equivalent) with a
test receiver (AIL type 136 or equivalent).

17 turns, (approx. depends upon circuit layout) AWG #28


enameled copper wire, close wound on 9/32 ceramic coil
form. Tuning provided by a powdered iron slug.
41/2 turns, AWG #18 enameled copper wire, 5/16 long,
3/8 I.D. (AIR CORE).
31/2 turns, AWG #18 enameled copper wire, 1/4 long,
3/8 I.D. (AIR CORE).

**L1

**L2
**L3

VALUE
100 MHz

400 MHz

C1

7.0 pF

1.8 pF

C2

1000 pF

17 pF

C3

3.0 pF

1.0 pF

C4

112 pF

0.88.0 pF

C5

112 pF

0.88.0 pF

C6

0.0015 F

0.001 F

C7

0.0015 F

0.001 F

L1

3.0 H*

0.2 H**

L2

0.15 H*

0.03 H**

L3

0.14 H*

0.022 H**

6 turns, (approx. depends upon circuit layout) AWG #24


enameled copper wire, close wound on 7/32 ceramic coil
form. Tuning provided by an aluminum slug.
1 turn, AWG #16 enameled copper wire, 3/8 I.D.
(AIR CORE).
1/2 turn, AWG #16 enameled copper wire, 1/4 I.D.
(AIR CORE).

Figure 2. 100 MHz and 400 MHz Neutralized Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4191

MPF102
NOISE FIGURE
(Tchannel = 25C)
10

6.5
ID = 5.0 mA

VDS = 15 V
VGS = 0 V

5.5
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

8.0

6.0
f = 400 MHz
4.0

2.0

4.5
f = 400 MHz
3.5

2.5

100 MHz

100 MHz

1.5
0

2.0

4.0 6.0 8.0


10
12
14
16
VDS, DRAINSOURCE VOLTAGE (VOLTS)

18

20

2.0

Figure 3. Effects of DrainSource Voltage

4.0
6.0
8.0
10
ID, DRAIN CURRENT (mA)

12

14

Figure 4. Effects of Drain Current

INTERMODULATION CHARACTERISTICS
Pout , OUTPUT POWER PER TONE (dB)

+ 40
3RD ORDER INTERCEPT

+ 20
VDS = 15 Vdc
f1 = 399 MHz
f2 = 400 MHz

0
20
40
60
80
100

FUNDAMENTAL
OUTPUT @ IDSS,
0.25 IDSS

120
140
160
120

100

3RD ORDER IMD


OUTPUT @ IDSS,
0.25 IDSS

80
60
40
20
Pin, INPUT POWER PER TONE (dB)

+ 20

Figure 5. Third Order Intermodulation Distortion

4192

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPF102
COMMON SOURCE CHARACTERISTICS

30
20
bis @ IDSS

10
7.0
5.0
3.0

gis @ IDSS

2.0
gis @ 0.25 IDSS
1.0
0.7
0.5
0.3
10

bis @ 0.25 IDSS


20

30

50 70 100
200 300
f, FREQUENCY (MHz)

grs , REVERSE TRANSADMITTANCE (mmhos)


brs , REVERSE SUSCEPTANCE (mmhos)

gis, INPUT CONDUCTANCE (mmhos)


bis, INPUT SUSCEPTANCE (mmhos)

ADMITTANCE PARAMETERS
(VDS = 15 Vdc, Tchannel = 25C)

500 700 1000

5.0
3.0
2.0
brs @ IDSS
1.0
0.7
0.5

0.25 IDSS

0.3
0.2
0.1
0.07
0.05

grs @ IDSS, 0.25 IDSS


10

20

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

10

10
7.0
5.0

gfs @ IDSS
gfs @ 0.25 IDSS

3.0
2.0
1.0
0.7
0.5
0.3
0.2
10

30

Figure 7. Reverse Transfer Admittance (yrs)

|bfs| @ IDSS
|bfs| @ 0.25 IDSS

gos, OUTPUT ADMITTANCE (mhos)


bos, OUTPUT SUSCEPTANCE (mhos)

gfs, FORWARD TRANSCONDUCTANCE (mmhos)


|b fs|, FORWARD SUSCEPTANCE (mmhos)

Figure 6. Input Admittance (yis)

20

5.0
bos @ IDSS and 0.25 IDSS

2.0
1.0
0.5
0.2

gos @ IDSS

0.1
0.05
gos @ 0.25 IDSS

0.02
0.01
20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 8. Forward Transadmittance (yfs)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 9. Output Admittance (yos)

4193

MPF102
COMMON SOURCE CHARACTERISTICS
SPARAMETERS
(VDS = 15 Vdc, Tchannel = 25C, Data Points in MHz)
30

20

10

0
1.0

40

350
100

340

330
320

40

310

50

20

10

340

330

0.4

320

0.3
400

310

ID = IDSS, 0.25 IDSS

300
0.8

900

500

ID = IDSS

60

800
300

400

60

500

0.7

600
0.6

300
0.1

500

70

290

400

700
800

700
800

290

0.2
700

600

600

80

350

300

200

50

70

200

100
0.9

30

ID = 0.25 IDSS

280

80

300

280

0.0

200

900

270

90

100

260

100

260

110

250

110

250

120

240

120

240

130

230

130

230

140

220

140

220

90

900

150

160

170

180

190

200

210

150

160

Figure 10. S11s


30

20

10

350

170

340

330

30

20

10

80
90

700

500

0.3
ID = 0.25 IDSS
500

0
350
340
330
100 200
ID = 0.25 IDSS
300
1.0
400
100 200
500
300
600
400
700
0.9
500
800
600
ID = IDSS
700
900
800
900
0.8

310

50

300

60

290

70

280

80

270

90

270

260

100

260

250

110

250

240

120

240

230

130

230

220

140

220

320

310

300
0.7

290

0.3

280

0.6

100

400

400

110

0.4

800

600
100

210

900
700

600

200

40

0.5
60
900

190

320

0.6
50

800

180

Figure 11. S12s

40

70

270

100

300

200

0.4

100

0.5

300
120

ID = IDSS

200

130
0.6

140
150

160

170

180

190

Figure 12. S21s


4194

200

210

150

160

170

180

190

200

210

Figure 13. S22s


Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPF102
COMMON GATE CHARACTERISTICS
ADMITTANCE PARAMETERS
(VDG = 15 Vdc, Tchannel = 25C)

10
7.0
5.0

grg , REVERSE TRANSADMITTANCE (mmhos)


brg , REVERSE SUSCEPTANCE (mmhos)

gig, INPUT CONDUCTANCE (mmhos)


big, INPUT SUSCEPTANCE (mmhos)

20

gig @ IDSS
grg @ 0.25 IDSS

3.0
2.0
1.0
0.7
0.5

big @ IDSS
big @ 0.25 IDSS

0.3
0.2

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

0.5
0.3

0.1
0.07
0.05
0.25 IDSS

0.03
0.02
0.01

0.007
0.005

500 700 1000

brg @ IDSS

0.2

gig @ IDSS, 0.25 IDSS


10

10
7.0
5.0

gfg @ IDSS

3.0

gfg @ 0.25 IDSS

2.0
1.0
0.7
0.5
bfg @ IDSS

0.3

brg @ 0.25 IDSS

0.2

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 15. Reverse Transfer Admittance (yrg)

gog, OUTPUT ADMITTANCE (mmhos)


bog, OUTPUT SUSCEPTANCE (mmhos)

gfg , FORWARD TRANSCONDUCTANCE (mmhos)


bfg , FORWARD SUSCEPTANCE (mmhos)

Figure 14. Input Admittance (yig)

20

1.0
0.7
0.5

bog @ IDSS, 0.25 IDSS

0.3
0.2
0.1
0.07
0.05

gog @ IDSS

0.03
0.02
gog @ 0.25 IDSS

0.1

0.01
10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 16. Forward Transfer Admittance (yfg)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

10

20

30

50 70 100
200 300
f, FREQUENCY (MHz)

500 700 1000

Figure 17. Output Admittance (yog)

4195

MPF102
COMMON GATE CHARACTERISTICS
SPARAMETERS
(VDS = 15 Vdc, Tchannel = 25C, Data Points in MHz)
30

20

10

350

340

330

30

0.7

40

100

310

50

300

60

290

70

280

80

350

340

330
320

0.04

200

300

0.03

400

100

500
200

0.5

ID = IDSS
0.4

310

600

300

60
70

40

10

ID = 0.25 IDSS

0.6
50

320

20

0.02

700

400
500

300

800

600
900

0.01

290

700
80

800

0.3

900

90

270

100

260

90

250

270

500
600

100
ID = IDSS

110

280

0.0
100

110

700

600
700

260

ID = 0.25 IDSS

250

0.01

800
240

120

120

240

800
0.02
900

230

130

230

130
900

220

140
150

160

170

180

190

200

140

210

20

10

350

150

160

170

180

190

200

210

340

330

Figure 19. S12g

340

330

30

0.5

40

220

0.04

Figure 18. S11g

30

0.03

320

20

10

40

0
1.5
1.0
100

100
0.4
ID = IDSS

350
300
200

500

320

400

700
600
800

0.9

900

310

50

300

60

290

70

280

80

270

90

270

100

260

100

260

110

250

110

250

120

240

120

240

130

230

130

230

140

220

140

220

50

100

ID = IDSS, 0.25 IDSS

0.3

0.8

60
0.2

70

310

ID = 0.25 IDSS

80
0.1

300
0.7

290
280

0.6

900

90
900

150

160

170

180

190

Figure 20. S21g


4196

200

210

150

160

170

180

190

200

210

Figure 21. S22g


Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

JFETs Switching

MPF4392
MPF4393

1 DRAIN

NChannel Depletion

3
GATE

Motorola Preferred Devices

2 SOURCE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Drain Source Voltage

VDS

30

Vdc

Drain Gate Voltage

VDG

30

Vdc

GateSource Voltage

VGS

30

Vdc

Forward Gate Current

IG(f)

50

mAdc

PD

350
2.8

mW
mW/C

Tchannel,
Tstg

65 to +150

Total Device Dissipation @ TA = 25C


Derate above 25C
Operating and Storage Channel
Temperature Range

1
2

CASE 2904, STYLE 5


TO92 (TO226AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)GSS

30

Vdc

1.0
0.2

nAdc
Adc

1.0
0.1

nAdc
Adc

2.0
0.5

5.0
3.0

25
5.0

75
30

0.4
0.4

60
100

17
12

OFF CHARACTERISTICS
Gate Source Breakdown Voltage
(IG = 1.0 Adc, VDS = 0)
Gate Reverse Current
(VGS = 15 Vdc, VDS = 0)
(VGS = 15 Vdc, VDS = 0, TA = 100C)

IGSS

DrainCutoff Current
(VDS = 15 Vdc, VGS = 12 Vdc)
(VDS = 15 Vdc, VGS = 12 Vdc, TA = 100C)

ID(off)

Gate Source Voltage


(VDS = 15 Vdc, ID = 10 nAdc)

VGS
MPF4392
MPF4393

Vdc

ON CHARACTERISTICS
Zero Gate Voltage Drain Current(1)
(VDS = 15 Vdc, VGS = 0)
DrainSource OnVoltage
(ID = 6.0 mAdc, VGS = 0)
(ID = 3.0 mAdc, VGS = 0)
Static DrainSource On Resistance
(ID = 1.0 mAdc, VGS = 0)

IDSS
MPF4392
MPF4393

mAdc

VDS(on)
MPF4392
MPF4393

Vdc

rDS(on)
MPF4392
MPF4393

SMALL SIGNAL CHARACTERISTICS


Forward Transfer Admittance
(VDS = 15 Vdc, ID = 25 mAdc, f = 1.0 kHz)
(VDS = 15 Vdc, ID = 5.0 mAdc, f = 1.0 kHz)
1. Pulse Test: Pulse Width

v 300 s, Duty Cycle v 3.0%.

|yfs|
MPF4392
MPF4393

mmhos

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

4197

MPF4392 MPF4393
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)
Characteristic

Symbol

Min

Typ

Max

60
100

6.0

10

2.5
3.2

3.5

2.0
2.5

5.0
5.0

15
29

20
35

4.0
6.5

15
15

20
37

35
55

Unit

SMALL SIGNAL CHARACTERISTICS (continued)


DrainSource ON Resistance
(VGS = 0, ID = 0, f = 1.0 kHz)

rds(on)
MPF4392
MPF4393

Input Capacitance (VGS = 15 Vdc, VDS = 0, f = 1.0 MHz)

Ciss

Reverse Transfer Capacitance


(VGS = 12 Vdc, VDS = 0, f = 1.0 MHz)
(VDS = 15 Vdc, ID = 10 mAdc, f = 1.0 MHz)

Crss

pF
pF

SWITCHING CHARACTERISTICS
Rise Time (See Figure 2)
(ID(on) = 6.0 mAdc)
(ID(on) = 3.0 mAdc)

MPF4392
MPF4393

tr

Fall Time (See Figure 4)


(VGS(off) = 7.0 Vdc)
(VGS(off) = 5.0 Vdc)

MPF4392
MPF4393

TurnOn Time (See Figures 1 and 2)


(ID(on) = 6.0 mAdc)
(ID(on) = 3.0 mAdc)

MPF4392
MPF4393

TurnOff Time (See Figures 3 and 4)


(VGS(off) = 7.0 Vdc)
(VGS(off) = 5.0 Vdc)

MPF4392
MPF4393

ns

tf

ns

ton

ns

toff

ns

TYPICAL SWITCHING CHARACTERISTICS


1000

500
200

RK = RD

TJ = 25C

500

MPF4392 VGS(off) = 7.0 V


MPF4393
= 5.0 V

200
t r , RISE TIME (ns)

t d(on), TURNON DELAY TIME (ns)

1000

100
50
20
10
5.0

RK = 0

50
20
10

5.0 7.0 10
2.0 3.0
ID, DRAIN CURRENT (mA)

20

30

1.0
0.5 0.7 1.0

50

500

200

MPF4392 VGS(off) = 7.0 V


MPF4393
= 5.0 V

200
t f , FALL TIME (ns)

t d(off) , TURNOFF DELAY TIME (ns)

20

30

50

1000
TJ = 25C

100
RK = RD

20
10
RK = 0

RK = RD

TJ = 25C
MPF4392 VGS(off) = 7.0 V
MPF4393
= 5.0 V

100
50
20

RK = 0

10
5.0
2.0

2.0
2.0 3.0
5.0 7.0 10
ID, DRAIN CURRENT (mA)

20

Figure 3. TurnOff Delay Time


4198

5.0 7.0 10
2.0 3.0
ID, DRAIN CURRENT (mA)

Figure 2. Rise Time

500

1.0
0.5 0.7 1.0

RK = 0

2.0

1000

5.0

MPF4392 VGS(off) = 7.0 V


MPF4393
= 5.0 V

100

Figure 1. TurnOn Delay Time

50

TJ = 25C

5.0

2.0
1.0
0.5 0.7 1.0

RK = RD

30

50

1.0
0.5 0.7 1.0

5.0 7.0 10
2.0 3.0
ID, DRAIN CURRENT (mA)

20

30

50

Figure 4. Fall Time


Motorola SmallSignal Transistors, FETs and Diodes Device Data

MPF4392 MPF4393
NOTE 1
The switching characteristics shown above were measured using a
test circuit similar to Figure 5. At the beginning of the switching
interval, the gate voltage is at Gate Supply Voltage (VGG). The
DrainSource Voltage (VDS) is slightly lower than Drain Supply
Voltage (VDD) due to the voltage divider. Thus Reverse Transfer
Capacitance (Crss) or GateDrain Capacitance (Cgd) is charged to
VGG + VDS.
During the turnon interval, GateSource Capacitance (C gs)
discharges through the series combination of RGen and RK. Cgd must
discharge to VDS(on) through RG and RK in series with the parallel
combination of effective load impedance (RD) and DrainSource
Resistance (rds). During the turnoff, this charge flow is reversed.
Predicting turnon time is somewhat difficult as the channel
resistance rds is a function of the gatesource voltage. While Cgs
discharges, VGS approaches zero and rds decreases. Since Cgd
discharges through rds, turnon time is nonlinear. During turnoff,
the situation is reversed with rds increasing as Cgd charges.
The above switching curves show two impedance conditions:
1) RK is equal to RD which simulates the switching behavior of
cascaded stages where the driving source impedance is normally the
load impedance of the previous stage, and 2) RK = 0 (low impedance)
the driving source impedance is that of the generator.

VDD
RD
SET VDS(off) = 10 V
INPUT

RK

RT

RGEN
50

OUTPUT
RGG

50

50

VGG

VGEN
INPUT PULSE
tr 0.25 ns
tf 0.5 ns
PULSE WIDTH = 2.0 s
DUTY CYCLE 2.0%

RGG

& RK

RD = RD(RT + 50)
RD + RT + 50

15

20
MPF4392

10
C, CAPACITANCE (pF)

y fs , FORWARD TRANSFER ADMITTANCE (mmhos)

Figure 5. Switching Time Test Circuit

10
MPF4393
7.0
5.0

Tchannel = 25C
VDS = 15 V

3.0

Cgs
7.0
5.0

Cgd
Tchannel = 25C
(Cds IS NEGLIGIBLE)

3.0
2.0
1.5

2.0
0.5 0.7 1.0

5.0 7.0 10
2.0 3.0
ID, DRAIN CURRENT (mA)

20

30

1.0
0.03 0.05

50

0.1

Figure 6. Typical Forward Transfer Admittance

30

2.0

IDSS
= 10
160 mA

25
mA

50 mA

75 mA 100 mA

125 mA
rds(on) , DRAINSOURCE ONSTATE
RESISTANCE (NORMALIZED)

rds(on) , DRAINSOURCE ONSTATE


RESISTANCE (OHMS)

10

Figure 7. Typical Capacitance

200

120

80

40
Tchannel = 25C
0

0.3 0.5 1.0


3.0 5.0
VR, REVERSE VOLTAGE (VOLTS)

1.0

2.0
3.0
4.0
5.0
6.0
VGS, GATESOURCE VOLTAGE (VOLTS)

7.0

8.0

Figure 8. Effect of GateSource Voltage


On DrainSource Resistance
Motorola SmallSignal Transistors, FETs and Diodes Device Data

1.8

ID = 1.0 mA
VGS = 0

1.6
1.4
1.2
1.0
0.8
0.6
0.4
70

40

110
10
20
50
80
Tchannel, CHANNEL TEMPERATURE (C)

140

170

Figure 9. Effect of Temperature On


DrainSource OnState Resistance
4199

MPF4392 MPF4393
90

10

Tchannel = 25C

80
70

8.0
7.0

rDS(on) @ VGS = 0

60
50

NOTE 2

9.0

6.0
VGS(off)

5.0

40

4.0

30

3.0

20

2.0

10

1.0

0
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
IDSS, ZEROGATE VOLTAGE DRAIN CURRENT (mA)

V GS , GATESOURCE VOLTAGE
(VOLTS)

r ds(on), DRAINSOURCE ONSTATE


RESISTANCE (OHMS)

100

The ZeroGateVoltage Drain Current (IDSS), is the principle


determinant of other JFET characteristics. Figure 10 shows
the relationship of GateSource Off Voltage (VGS(off)) and
DrainSource On Resistance (rds(on)) to IDSS. Most of the
devices will be within 10% of the values shown in Figure 10.
This data will be useful in predicting the characteristic variations
for a given part number.
For example:
Unknown
rds(on) and VGS range for an MPF4392
The electrical characteristics table indicates that an MPF4392
has an IDSS range of 25 to 75 mA. Figure 10 shows rds(on) = 52
Ohms for IDSS = 25 mA and 30 Ohms for IDSS = 75 mA. The
corresponding VGS values are 2.2 volts and 4.8 volts.

Figure 10. Effect of IDSS On DrainSource


Resistance and GateSource Voltage

4200

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Section 5
SmallSignal Tuning
and Switching Diodes

In Brief . . .
Packaging options include plastic DIPs and surface mount
packages. Most SOT23, SC59, SC70/SOT323 and
SOT223 package devices are only available in Tape and
Reel.
NOTE: All SOT-23 package devices have had a T1 suffix
NOTE: added to the device title.

CASE 51-02
(DO-204AA)

CASE 29-04
(TO-226AA)
2

CASE 182-02
(TO-226AC)

3
3
1

4
1

2
2

CASE 318-08
SOT-23 (TO-236AB)

CASE 318D-04
SC-59

CASE 318E-04
SOT-223 (TO-261AA)

3
2

CASE 419-02
SC-70/SOT-323

14

CASE 425-04
SOD-123

CASE 463-01
SC90/SOT-416

16
1

CASE 646-06

CASE 648-08

16

14
1

CASE 751A-03
SO-14

Motorola SmallSignal Transistors, FETs and Diodes Device Data

CASE 751B-05
SO-16

51

EMBOSSED TAPE AND REEL


SOT-23, SC-59, SC-70/SOT-323, SOT-223, SO14 and SO-16 packages are available only in Tape and
Reel. Use the appropriate suffix indicated below to order any of the SOT-23, SC-59, SC-70/SOT-323,
SOT-223, SO14 and SO-16 packages. (See Section 6 on Packaging for additional information).
SOT-23:

available in 8 mm Tape and Reel


Use the device title (which already includes the T1 suffix) to order the 7 inch/3000 unit reel.
Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/10,000 unit reel.

SC-59:

available in 8 mm Tape and Reel


Use the device title (which already includes the T1 suffix) to order the 7 inch/3000 unit reel.
Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/10,000 unit reel.

SC-70/
SOT-323:

available in 8 mm Tape and Reel


Use the device title (which already includes the T1 suffix) to order the 7 inch/3000 unit reel.
Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/10,000 unit reel.

SOT-223:

available in 12 mm Tape and Reel


Use the device title (which already includes the T1 suffix) to order the 7 inch/1000 unit reel.
Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/4000 unit reel.

SO-14:

available in 16 mm Tape and Reel


Add an R1 suffix to the device title to order the 7 inch/500 unit reel.
Add an R2 suffix to the device title to order the 13 inch/2500 unit reel.

SO-16:

available in 16 mm Tape and Reel


Add an R1 suffix to the device title to order the 7 inch/500 unit reel.
Add an R2 suffix to the device title to order the 13 inch/2500 unit reel.

RADIAL TAPE IN FAN FOLD BOX OR REEL


TO-92 packages are available in both bulk shipments and in Radial Tape in Fan Fold Boxes or Reels.
Fan Fold Boxes and Radial Tape Reel are the best methods for capturing devices for automatic insertion in
printed circuit boards.
TO-92:

available in Fan Fold Box


Add an RLR suffix and the appropriate Style code* to the device title to order the Fan Fold box.
available in 365 mm Radial Tape Reel
Add an RLR suffix and the appropriate Style code* to the device title to order the Radial Tape
Reel.

*Refer to Section 6 on Packaging for Style code characters and additional information on ordering
*requirements.

DEVICE MARKINGS/DATE CODE CHARACTERS


SOT-23, SC-59 and the SC-70/SOT-323 packages have a device marking and a date code etched on
the device. The generic example below depicts both the device marking and a representation of the date
code that appears on the SC-70/SOT-323, SC-59 and SOT-23 packages.

ABC D
The D represents a smaller alpha digit Date Code. The Date Code indicates the actual month in which the
part was manufactured.

52

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Silicon Tuning Diodes

1N5148
1N5148A

Designed for electronic tuning and harmonicgeneration applications, and provide


solidstate reliability to replace mechanical tuning methods.
Guaranteed HighFrequency Q
Guaranteed Wide Tuning Range
Standard 10% Capacitance Tolerance
Complete Typical Design Curves

6.8 47 pF EPICAP
VOLTAGEVARIABLE
CAPACITANCE DIODES

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

60

Volts

Forward Current

IF

250

mAdc

RF Power Input(1)

Pin

5.0

Watts

Device Dissipation @ TA = 25C


Derate above 25C

PD

400
2.67

mW
mW/C

Device Dissipation @ TC = 25C


Derate above 25C

PC

2.0
13.3

Watts
mW/C

Junction Temperature

TJ

+175

Tstg

65 to + 200

Storage Temperature Range

CASE 5102
(DO204AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

60

70

Vdc

Reverse Voltage Leakage Current (VR = 55 Vdc, TA = 25C)


Reverse Voltage Leakage Current (VR = 55 Vdc, TA = 150C)

IR

0.02
20

Adc

Series Inductance (f = 250 MHz, L 1/16)

LS

4.0

nH

Case Capacitance (f = 1.0 MHz, L 1/16)

CC

0.17

pF

TCC

200

ppm/C

Reverse Breakdown Voltage (IR = 10 Adc)

Diode Capacitance Temperature Coefficient (VR = 4.0 Vdc, f = 1.0 MHz)


1. The RF power input rating assumes that an adequate heatsink is provided.
CT, Diode Capacitance
VR = 4.0 Vdc, f = 1.0 MHz
pF

Q, Figure of Merit
VR = 4.0 Vdc,
f = 50 MHz

VR = 4.0 Vdc, f = 1.0 MHz

TR, Tuning Ratio


C4/C60
f = 1.0 MHz

Device

Min

Typ

Max

Min

Min

Typ

Min

Typ

1N5148
1N5148A

42.3
44.7

47
47

51.7
49.3

200
200

0.43
0.43

0.45
0.45

3.2
3.2

3.4
3.4

Motorola SmallSignal Transistors, FETs and Diodes Device Data

53

1N5148 1N5148A
PARAMETER TEST METHODS
1. LS, SERIES INDUCTANCE
LS is measured on a shorted package at 250 MHz using
an impedance bridge (Boonton Radio Model 250A RX
Meter). L = lead length.

(Boonton Electronics Model 33AS8).


6. , DIODE CAPACITANCE REVERSE VOLTAGE SLOPE
The diode capacitance, CT (as measured at VR = 4.0 Vdc,
f = 1.0 MHz) is compared to CT (as measured at VR = 60
Vdc, f = 1.0 MHz) by the following equation which defines
.
log CT(4) log CT(60)

2. CC, CASE CAPACITANCE


CC is measured on an open package at 1.0 MHz using a
capacitance bridge (Boonton Electronics Model 75A or
equivalent).

3. CT, DIODE CAPACITANCE


(C T = C C + C J ). C T is measured at 1.0 MHz using a capacitance bridge (Boonton Electronics Model 75A or
equivalent).

CT

+ 2pGfC

TCC

Q, FIGURE OF MERIT

C T , DIODE CAPACITANCE (pF)

10
7.0
5.0
3.0

1.0
1.0

TA = 25C
f = 50 MHz

5.0 7.0 10
3.0
VR, REVERSE VOLTAGE (VOLTS)

300

100

50 60

30

1N5148

1000
700
500

1.0

3.0
5.0 7.0 10
VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Diode Capacitance versus


Reverse Voltage

50 60

140
NORMALIZED Q, FIGURE OF MERIT (%)

NORMALIZED DIODE CAPACITANCE

30

Figure 2. Figure of Merit versus


Reverse Voltage

1.020
1.010
1.000
0.990
0.980

54

3000
1N5148

0.960
100

CT(65C)
106
+ CT () 85C)

85 ) 65
CT(25C)

10000
7000
5000

TA = 25C
f = 1 MHz

30

0.970

+ VKa

7. TCC, DIODE CAPACITANCE TEMPERATURE


COEFFICIENT
TCC is guaranteed by comparing CT at VR = 4.0 Vdc,
f = 1.0 MHz, TA = 65C with CT at VR = 4.0 Vdc, f =
1.0 MHz, TA = +85C in the following equation which defines TCC:

5. Q, FIGURE OF MERIT
Q is calculated by taking the G and C readings of an
admittance bridge at the specified frequency and substituting in the following equations:

100
70
50

log 60 log 4

Note that a CT versus VR law is assumed as shown in the


following equation where CC is included.

4. TR, TUNING RATIO


TR is the ratio of CT measured at 4.0 Vdc divided by CT
measured at 60 Vdc.

NORMALIZED TO C4
VR = 4 Vdc
TA = 25C
75

50

25

+25

+50

+75

+100

130
120
110
100
90
80

PERCENT OF Q @ 25C
VR = 4 Vdc
f = 50 MHz

70
65 50

25

+25

+50

TJ, JUNCTION TEMPERATURE (C)

TJ, JUNCTION TEMPERATURE (C)

Figure 3. Normalized Diode Capacitance


versus Junction Temperature

Figure 4. Normalized Figure of Merit


versus Junction Temperature

+75 +85

Motorola SmallSignal Transistors, FETs and Diodes Device Data

40

2000

32

1000
Q, FIGURE OF MERIT

I R , REVERSE CURRENT (nA)

1N5148 1N5148A

24

16

+ 75C

700

1N5148

500
300

+ 25C
VR = 4 Vdc

0
0

10

40
20
30
VR, REVERSE VOLTAGE (VOLTS)

50

60

Figure 5. Reverse Current versus Reverse


Bias Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

100
10

30
50
f, FREQUENCY (MHz)

70

100

Figure 6. Figure of Merit versus Frequency

55

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Silicon Tuning Diodes

1N5446ARL
1N5448ARL
1N5456A

These are epitaxial passivated abrupt junction tuning diodes designed for electronic
tuning, FM, AFC and harmonicgeneration applications in AM through UHF ranges,
providing solidstate reliability to replace mechanical tuning methods.
Excellent Q Factor at High Frequencies
Guaranteed Capacitance Change 2.0 to 30 V
Capacitance Tolerance 10% and 5.0%

6.8 100 pF
30 VOLTS
VOLTAGEVARIABLE
CAPACITANCE DIODES

Complete Typical Design Curves

CASE 5102
(DO204AA)

MAXIMUM RATINGS(1)
Rating

Symbol

Value

Unit

Reverse Voltage

VR

30

Volts

Device Dissipation @ TA = 25C


Derate above 25C

PD

400
2.67

mW
mW/C

Operating Junction Temperature Range

TJ

+175

Tstg

65 to + 200

Storage Temperature Range

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

30

Vdc

Reverse Voltage Leakage Current (VR = 25 Vdc, TA = 25C)


Reverse Voltage Leakage Current (VR = 25 Vdc, TA = 150C)

IR

0.02
20

Adc

Series Inductance (f = 250 MHz, lead length 1/16)

LS

4.0

nH

Case Capacitance (f = 1.0 MHz, lead length 1/16)

CC

0.17

pF

TCC

300

ppm/C

Reverse Breakdown Voltage (IR = 10 Adc)

Diode Capacitance Temperature Coefficient


(Note 6) (VR = 4.0 Vdc, f = 1.0 MHz)
CT, Diode Capacitance
VR = 4.0 Vdc, f = 1.0 MHz
pF
Device

TR, Tuning Ratio


C2/C30
f = 1.0 MHz

Q, Figure of Merit
VR = 4.0 Vdc,
f = 50 MHz

Min
(Nom 10%)

Nom

Max
(Nom +10%)

Min

Max

Min

16.2
19.8
90

18
22
100

19.8
24.2
110

2.6
2.6
2.7

3.2
3.2
3.3

350
350
175

1N5446ARL
1N5448ARL
1N5456A

1. Indicates JEDEC Registered Data.

(Replaces 1N5441A/D)

56

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1N5446ARL 1N5448ARL 1N5456A


PARAMETER TEST METHODS
1. LS, SERIES INDUCTANCE
LS is measured on a shorted package at 250 MHz using
an impedance bridge (Boonton Radio Model 250A RX
Meter or equivalent).
2. CC, CASE CAPACITANCE
CC is measured on an open package at 1.0 MHz using a
capacitance bridge (Boonton Electronics Model 75A or
equivalent).
3. CT, DIODE CAPACITANCE
(CT = CC + CJ). CT is measured at 1.0 MHz using a capacitance bridge (Boonton Electronics Model 75A or
equivalent).
4. TR, TUNING RATIO
TR is the ratio of CT measured at 2.0 Vdc divided by CT
measured at 30 Vdc.

5. Q, FIGURE OF MERIT
Q is calculated by taking the G and C readings of an admittance bridge at the specified frequency and substituting in the following equations:
Q

+ 2pGfC

(Boonton Electronics Model 33AS8 or equivalent).


7. TCC, DIODE CAPACITANCE TEMPERATURE
COEFFICIENT
TCC is guaranteed by comparing CT at VR = 4.0 Vdc,
f = 1.0 MHz, TA = 65C with CT at VR = 4.0 Vdc, f =
1.0 MHz, TA = +85C in the following equation, which defines TCC:
TCC

CT(65C)
+ CT() 85C)
85 ) 65

106
CT(25C)

Accuracy limited by CT measurement to 0.1 pF.

NORMALIZED DIODE CAPACITANCE

1.046
1.036
VR = 2.0 Vdc

1.026
1.016

VR = 4.0 Vdc

1.006
VR = 30 Vdc
0.996
0.986
0.976
0.966
75

50

25

0
+25
+50
TJ, TEMPERATURE (C)

+75

+100

+125

Figure 1. Normalized Diode Capacitance


versus Junction Temperature

TYPICAL DEVICE PERFORMANCE


1000
C T , DIODE CAPACITANCE (pF)

500

TA = 25C
f = 1.0 MHz

200
100

1N5456A

50
20
10
5.0
2.0
1.0
0.1

0.2

0.5

1.0

2.0

5.0

10

20

30

VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Diode Capacitance versus Reverse Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

57

1N5446ARL 1N5448ARL 1N5456A


10000
TA = 25C
f = 50 MHz

2000
1000
500
1N5456A

500
300
200
100
50
1N5456A

30
20

200
100
1.0

TA = 25C
VR = 4.0 Vdc

1000
Q, FIGURE OF MERIT

Q, FIGURE OF MERIT

5000

3000
2000

10
2.0
3.0
5.0
7.0
VR, REVERSE VOLTAGE (VOLTS)

10
10

20

Figure 3. Figure of Merit versus


Reverse Voltage

V f , FORWARD VOLTAGE (VOLTS)

I R , REVERSE CURRENT (nA)

1.12

TA = 125C

1.06
1.00

2.0
1.0

TA = 75C

0.94

0.50
0.20
0.10
0.05
0.02
0.01
5.0

58

200 250

Figure 4. Figure of Merit versus Frequency

100
50
20
10
5.0

30
50
70
100
f, FREQUENCY (MHz)

20

0.88
1N5456A

0.82

TA = 25C
10

0.76
15

20

25

30

0.70

75

150

225

300

375

425

VR, REVERSE VOLTAGE (VOLTS)

IF, FORWARD CURRENT (mA)

Figure 5. Reverse Current versus Reverse


Bias Voltage

Figure 6. Forward Voltage versus


Forward Current

500

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Diode

BAL99LT1
ANODE
3

CATHODE
2

MAXIMUM RATINGS
3

Rating

Symbol

Value

Unit

Continuous Reverse Voltage

VR

70

Vdc

Peak Forward Current

IF

100

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

1
2

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

CASE 318 08, STYLE 18


SOT 23 (TO 236AB)

DEVICE MARKING
BAL99LT1 = JF

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

2.5
30
50

70

715
855
1000
1250

Unit

OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(VR = 70 Vdc)
(VR = 25 Vdc, TJ = 150C)
(VR = 70 Vdc, TJ = 150C)
Reverse Breakdown Voltage
(IR = 100 Adc)

Adc

IR

V(BR)

Vdc

Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)

VF

Recovery Current
(IF = 10 mAdc, VR = 5.0 Vdc, RL = 500 )

QS

45

pC

Diode Capacitance
(VR = 0, f = 1.0 MHz)

CD

1.5

pF

Reverse Recovery Time


(IF = IR = 10 mAdc, RL = 100 , measured at IR = 1.0 mAdc)

trr

6.0

ns

VFR

1.75

Vdc

Forward Recovery Voltage


(IF = 10 mAdc, tr = 20 ns)

mV

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Motorola SmallSignal Transistors, FETs and Diodes Device Data

59

BAL99LT1
TYPICAL CHARACTERISTICS
100

10

I R, REVERSE CURRENT ( A)

IF, FORWARD CURRENT (mA)

TA = 150C

10
TA = 85C
TA = 25C

1.0

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01

TA = 40C
TA = 25C
0.1
0.2

0.4

0.6

0.8

1.0

0.001

1.2

10

20

30

VF, FORWARD VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Forward Voltage

Figure 2. Leakage Current

40

50

CD , DIODE CAPACITANCE (pF)

0.68

0.64

0.60

0.56

0.52

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Capacitance

510

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Diode

BAS16LT1
3
CATHODE

1
ANODE

Motorola Preferred Device

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Continuous Reverse Voltage

VR

75

Vdc

Peak Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Peak Forward Surge Current

3
1
2

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

DEVICE MARKING
BAS16LT1 = A6

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

1.0
50
30

75

715
855
1000
1250

Unit

OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(VR = 75 Vdc)
(VR = 75 Vdc, TJ = 150C)
(VR = 25 Vdc, TJ = 150C)
Reverse Breakdown Voltage
(IBR = 100 Adc)

Adc

IR

V(BR)

Vdc

Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)

VF

Diode Capacitance
(VR = 0, f = 1.0 MHz)

CD

2.0

pF

Forward Recovery Voltage


(IF = 10 mAdc, tr = 20 ns)

VFR

1.75

Vdc

Reverse Recovery Time


(IF = IR = 10 mAdc, RL = 50 )

trr

6.0

ns

Stored Charge
(IF = 10 mAdc to VR = 5.0 Vdc, RL = 500 )

QS

45

pC

mV

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

511

BAS16LT1
820
+10 V

2.0 k
100 H

tp

tr

0.1 F
IF

IF

trr

10%

0.1 F
90%

D.U.T.
50 INPUT
SAMPLING
OSCILLOSCOPE

50 OUTPUT
PULSE
GENERATOR

iR(REC) = 1.0 mA

IR

VR

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C
TA = 85C
10
TA = 40C

1.0

TA = 25C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

10

1.2

Figure 2. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 3. Leakage Current

CD, DIODE CAPACITANCE (pF)

0.68

0.64

0.60

0.56

0.52

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

512

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Silicon Switching Diode

BAS16WT1
Motorola Preferred Device

3
CATHODE

1
ANODE
3

MAXIMUM RATINGS (TA = 25C)


Symbol

Max

Unit

Continuous Reverse Voltage

VR

75

Recurrent Peak Forward Current

IR

200

mA

IFM(surge)

500

mA

PD

200

mW

1.6

mW/C

55 to +150

Rating

Peak Forward Surge Current


Pulse Width = 10 s
Total Power Dissipation, One Diode Loaded
TA = 25C
Derate above 25C
Mounted on a Ceramic Substrate
(10 x 8 x 0.6 mm)
Operating and Storage Junction
Temperature Range

TJ, Tstg

1
2

CASE 41902, STYLE 2


SC70/SOT323

THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
One Diode Loaded
Mounted on a Ceramic Substrate
(10 x 8 x 0.6 mm)

Symbol

Max

Unit

RJA

0.625

C/mW

DEVICE MARKING
BAS16WT1 = A6

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

715
866
1000
1250

1.0
50
30

CD

2.0

pF

Reverse Recovery Time


(IF = IR = 10 mA, RL = 50 ) (Figure 1)

trr

6.0

ns

Stored Charge
(IF = 10 mA to VR = 6.0 V, RL = 500 ) (Figure 2)

QS

45

PC

Forward Recovery Voltage


(IF = 10 mA, tr = 20 ns) (Figure 3)

VFR

1.75

Forward Voltage
(IF = 1.0 mA)
(IF = 10 mA)
(IF = 50 mA)
(IF = 150 mA)

VF

Reverse Current
(VR = 75 V)
(VR = 75 V, TJ = 150C)
(VR = 25 V, TJ = 150C)

IR

Capacitance
(VR = 0, f = 1.0 MHz)

Unit
mV

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

513

BAS16WT1
1 ns MAX
500

DUT

trr

10%
tif

50
DUTY CYCLE = 2%
90%
VF

Irr
100 ns

Figure 1. Reverse Recovery Time Equivalent Test Circuit

OSCILLOSCOPE
R 10 M
C 7 pF
500

VC

DUT

BAW62

VCM

20 ns MAX

D1

t
10%
VCM

243 pF

100 K

+ QaC
DUTY CYCLE = 2%

90%
Vf
400 ns

Figure 2. Recovery Charge Equivalent Test Circuit

120 ns

450

1 K

V
90%

DUT

Vfr

50

10%

DUTY CYCLE = 2%
2 ns MAX

Figure 3. Forward Recovery Voltage Equivalent Test Circuit

514

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BAS16WT1
10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C

10
TA = 85C
TA = 25C

1.0

TA = 40C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

1.2

10

Figure 4. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 5. Leakage Current

CD, DIODE CAPACITANCE (pF)

0.68

0.64

0.60

0.56

0.52

VR, REVERSE VOLTAGE (VOLTS)

Figure 6. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

515

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Switching Diode


3
CATHODE

BAS21LT1
Motorola Preferred Device

1
ANODE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Continuous Reverse Voltage

VR

250

Vdc

Peak Forward Current

IF

200

mAdc

IFM(surge)

625

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Peak Forward Surge Current

1
2

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BAS21LT1 = JS

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Characteristic

Min

Max

1.0
100

250

1000
1250

Unit

OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(VR = 200 Vdc)
(VR = 200 Vdc, TJ = 150C)

Adc

IR

Reverse Breakdown Voltage


(IBR = 100 Adc)

V(BR)

Vdc

Forward Voltage
(IF = 100 mAdc)
(IF = 200 mAdc)

VF

Diode Capacitance
(VR = 0, f = 1.0 MHz)

CD

5.0

pF

Reverse Recovery Time


(IF = IR = 30 mAdc, RL = 100 )

trr

50

ns

mV

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

516

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BAS21LT1
820
+10 V

2.0 k
100 H

tp

tr

0.1 F
IF

IF
trr

10%

0.1 F
90%

D.U.T.
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

iR(REC) = 3.0 mA

IR

VR
INPUT SIGNAL

OUTPUT PULSE
(IF = IR = 30 mA; MEASURED
at iR(REC) = 3.0 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 30 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 30 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

517

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BAS40LT1

Preliminary Information

Schottky Barrier Diodes

Motorola Preferred Device

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.
40 VOLTS
SCHOTTKY BARRIER DIODES
3
CATHODE

1
ANODE

3
1
2

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

MAXIMUM RATINGS (TJ = 150C unless otherwise noted)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

40

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
225
1.8

mW
mW/C

55 to +150

Operating Junction and Storage Temperature Range

TJ, Tstg

DEVICE MARKING
BAS40LT1 = B1

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Reverse Breakdown Voltage


(IR = 10 A)

V(BR)R

40

Volts

Total Capacitance
(VR = 1.0 V, f = 1.0 MHz)

CT

5.0

pF

Reverse Leakage
(VR = 25 V)

IR

1.0

Adc

Forward Voltage
(IF = 0.1 mAdc)

VF

380

mVdc

Forward Voltage
(IF = 30 mAdc)

VF

500

mVdc

Forward Voltage
(IF = 100 mAdc)

VF

1.0

Vdc

Preferred devices are Motorola recommended choices for future use and best overall value.

518

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BAS40-04LT1

Preliminary Information

Common Anode
Schottky Barrier Diode

Motorola Preferred Device

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.

40 VOLTS
SCHOTTKY BARRIER DIODES

Extremely Fast Switching Speed


Low Forward Voltage 0.50 Volts (Typ) @ IF = 10 mAdc
CATHODE
1

ANODE
3

2
CATHODE

1
2

CASE 318 08, STYLE 12


SOT 23 (TO 236AB)

MAXIMUM RATINGS (TJ = 150C unless otherwise noted)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

40

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
225
1.8

mW
mW/C

55 to +150

Operating Junction and Storage Temperature Range

TJ, Tstg

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

V(BR)R

40

Volts

Total Capacitance (VR = 1.0 V, f = 1.0 MHz)

CT

5.0

pF

Reverse Leakage (VR = 25 V)

IR

1.0

Adc

Forward Voltage (IF = 0.1 mAdc)

VF

380

mVdc

Forward Voltage (IF = 30 mAdc)

VF

500

mVdc

Forward Voltage (IF = 100 mAdc)

VF

1.0

Vdc

Characteristic
Reverse Breakdown Voltage (IR = 10 A)

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

519

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BAS40-06LT1

Preliminary Information

Dual Series Schottky


Barrier Diodes

Motorola Preferred Device

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.

40 VOLTS
SCHOTTKY BARRIER DIODES

Extremely Fast Switching Speed


Low Forward Voltage 0.50 Volts (Typ) @ IF = 10 mAdc
1
ANODE

3
CATHODE/ANODE

2
CATHODE

3
1
2

CASE 318 08, STYLE 11


SOT 23 (TO 236AB)

MAXIMUM RATINGS (TJ = 150C unless otherwise noted)


Symbol

Value

Unit

Reverse Voltage

VR

40

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
225
1.8

mW
mW/C

55 to +150

Rating

Operating Junction and Storage Temperature Range

TJ, Tstg

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

V(BR)R

40

Volts

Total Capacitance (VR = 1.0 V, f = 1.0 MHz)

CT

5.0

pF

Reverse Leakage (VR = 25 V)

IR

1.0

Adc

Forward Voltage (IF = 0.1 mAdc)

VF

380

mVdc

Forward Voltage (IF = 30 mAdc)

VF

500

mVdc

Forward Voltage (IF = 100 mAdc)

VF

1.0

Vdc

Characteristic
Reverse Breakdown Voltage (IR = 10 A)

Preferred devices are Motorola recommended choices for future use and best overall value.

520

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BAS70LT1

Preliminary Information

Schottky Barrier Diodes

Motorola Preferred Device

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.
70 VOLTS
SCHOTTKY BARRIER DIODES

Extremely Fast Switching Speed


Low Forward Voltage 0.75 Volts (Typ) @ IF = 10 mAdc
3
CATHODE

1
ANODE
3
1
2

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

MAXIMUM RATINGS (TJ = 150C unless otherwise noted)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

70

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
225
1.8

mW
mW/C

55 to +150

Operating Junction and Storage Temperature Range

TJ, Tstg

DEVICE MARKING
BAS70LT1 = BE

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Reverse Breakdown Voltage (IR = 10 A)

V(BR)R

70

Volts

Total Capacitance (VR = 0 V, f = 1.0 MHz)

CT

2.0

pF

Reverse Leakage (VR = 50 V)


(VR = 70 V)

IR

0.1
10

Adc

Forward Voltage (IF = 1.0 mAdc)

VF

410

mVdc

Forward Voltage (IF = 10 mAdc)

VF

750

mVdc

Forward Voltage (IF = 15 mAdc)

VF

1.0

Vdc

Characteristic

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

521

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BAS70-04LT1

Preliminary Information

Common Anode
Schottky Barrier Diode

Motorola Preferred Device

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.

70 VOLTS
SCHOTTKY BARRIER DIODES

Extremely Fast Switching Speed


Low Forward Voltage 0.75 Volts (Typ) @ IF = 10 mAdc
CATHODE
1

ANODE
3

2
CATHODE

1
2

CASE 318 08, STYLE 12


SOT 23 (TO 236AB)

MAXIMUM RATINGS (TJ = 150C unless otherwise noted)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

70

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
225
1.8

mW
mW/C

55 to +150

Operating Junction and Storage Temperature Range

TJ, Tstg

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

Reverse Breakdown Voltage (IR = 10 A)

V(BR)R

70

Volts

Total Capacitance (VR = 0 V, f = 1.0 MHz)

CT

2.0

pF

Reverse Leakage (VR = 50 V)


(VR = 70 V)

IR

0.1
10

Adc

Forward Voltage (IF = 1.0 mAdc)

VF

410

mVdc

Forward Voltage (IF = 10 mAdc)

VF

750

mVdc

Forward Voltage (IF = 15 mAdc)

VF

1.0

Vdc

Characteristic

Preferred devices are Motorola recommended choices for future use and best overall value.

522

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BAS116LT1

Switching Diode
This switching diode has the following features:

Motorola Preferred Device

Low Leakage Current Applications


Medium Speed Switching Times
Available in 8 mm Tape and Reel
Use BAS116LT1 to order the 7 inch/3,000 unit reel
Use BAS116LT3 to order the 13 inch/10,000 unit reel

3
1
2

1
ANODE

3
CATHODE

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Symbol

Value

Unit

Continuous Reverse Voltage

Rating

VR

75

Vdc

Peak Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Peak Forward Surge Current

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BAS116LT1 = JV

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)

75

Vdc

Reverse Voltage Leakage Current (VR = 75 Vdc)


Reverse Voltage Leakage Current (VR = 75 Vdc, TJ = 150C)

IR

5.0
80

nAdc

Forward Voltage (IF = 1.0 mAdc)


Forward Voltage (IF = 10 mAdc)
Forward Voltage (IF = 50 mAdc)
Forward Voltage (IF = 150 mAdc)

VF

900
1000
1100
1250

mV

Diode Capacitance (VR = 0 V, f = 1.0 MHz)

CD

2.0

pF

Reverse Recovery Time (IF = IR = 10 mAdc) (Figure 1)

trr

3.0

OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100 Adc)

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

523

BAS116LT1
820
+10 V

2.0 k
100 H

tp

tr

0.1 F
IF

IF
trr

10%

0.1 F
90%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

iR(REC) = 1.0 mA

IR

VR
INPUT SIGNAL

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

524

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Schottky Barrier Diodes

BAT54ALT1

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.

Motorola Preferred Device

Extremely Fast Switching Speed

30 VOLTS
SCHOTTKY BARRIER
DETECTOR AND SWITCHING
DIODES

Low Forward Voltage 0.35 Volts (Typ) @ IF = 10 mAdc


CATHODE
1

ANODE
3

2
CATHODE

3
1
2

CASE 318 08, STYLE 12


SOT 23 (TO 236AB)

MAXIMUM RATINGS (TJ = 125C unless otherwise noted)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

30

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
225
1.8

mW
mW/C

Operating Junction
Temperature Range

TJ

C
55 to +150

Storage Temperature Range

Tstg

55 to +150

DEVICE MARKING
BAT54ALT1 = B6

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

30

Volts

Total Capacitance (VR = 1.0 V, f = 1.0 MHz)

CT

7.6

10

pF

Reverse Leakage (VR = 25 V)

IR

0.5

2.0

Adc

Forward Voltage (IF = 0.1 mAdc)

VF

0.22

0.24

Vdc

Forward Voltage (IF = 30 mAdc)

VF

0.41

0.5

Vdc

Forward Voltage (IF = 100 mAdc)

VF

0.52

1.0

Vdc

Reverse Recovery Time


(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) Figure 1

trr

5.0

ns

Forward Voltage (IF = 1.0 mAdc)

VF

0.29

0.32

Vdc

Forward Voltage (IF = 10 mAdc)

VF

0.35

0.40

Vdc

Reverse Breakdown Voltage (IR = 10 A)

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

525

BAT54ALT1
820
+10 V

2k

0.1 F

tr

IF

100 H

tp

0.1 F

IF

trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

100

1000
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C

1 50C

10

1 25C
1.0
85C
25C

0.1
0.0

40C

100
TA = 125C
10
1.0
TA = 85C
0.1
0.01

55C

TA = 25C
0.001

0.1

0.2

0.3

0.4

0.5

0.6

VF, FORWARD VOLTAGE (VOLTS)

Figure 2. Forward Voltage

10
15
20
VR, REVERSE VOLTAGE (VOLTS)

25

30

Figure 3. Leakage Current

C T , TOTAL CAPACITANCE (pF)

14
12
10
8
6
4
2
0

10

15

20

25

30

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Total Capacitance

526

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Schottky Barrier Diodes

BAT54LT1

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.

Motorola Preferred Device

Extremely Fast Switching Speed

30 VOLTS
SILICON HOTCARRIER
DETECTOR AND SWITCHING
DIODES

Low Forward Voltage 0.35 Volts (Typ) @ IF = 10 mAdc


3
CATHODE

1
ANODE
3
1
2

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

MAXIMUM RATINGS (TJ = 125C unless otherwise noted)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

30

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
200
2.0

mW
mW/C

Operating Junction
Temperature Range

TJ

C
55 to +125

Storage Temperature Range

Tstg

55 to +150

DEVICE MARKING
BAT54LT1 = LV3

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

30

Volts

Total Capacitance (VR = 1.0 V, f = 1.0 MHz)

CT

7.6

10

pF

Reverse Leakage (VR = 25 V)

IR

0.5

2.0

Adc

Forward Voltage (IF = 0.1 mAdc)

VF

0.22

0.24

Vdc

Forward Voltage (IF = 30 mAdc)

VF

0.41

0.5

Vdc

Forward Voltage (IF = 100 mAdc)

VF

0.52

1.0

Vdc

Reverse Recovery Time


(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) Figure 1

trr

5.0

ns

Forward Voltage (IF = 1.0 mAdc)

VF

0.29

0.32

Vdc

Forward Voltage (IF = 10 mAdc)

VF

0.35

0.40

Vdc

Reverse Breakdown Voltage (IR = 10 A)

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

527

BAT54LT1
820
+10 V

2k

0.1 F

tr

IF

100 H

tp

0.1 F

IF

trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit


100

1000
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C

1 50C

10

1 25C
1.0
85C
25C

0.1
0.0

40C

100
TA = 125C
10
1.0
TA = 85C
0.1
0.01

55C

TA = 25C
0.001

0.1

0.2

0.3

0.4

0.5

0.6

VF, FORWARD VOLTAGE (VOLTS)

Figure 2. Forward Voltage

10
15
20
VR, REVERSE VOLTAGE (VOLTS)

25

30

Figure 3. Leakage Current

C T , TOTAL CAPACITANCE (pF)

14
12
10
8
6
4
2
0

10

15

20

25

30

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Total Capacitance

528

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Series Schottky


Barrier Diodes

BAT54SLT1
Motorola Preferred Device

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.

30 VOLTS
DUAL HOTCARRIER
DETECTOR AND SWITCHING
DIODES

Extremely Fast Switching Speed


Low Forward Voltage 0.35 Volts (Typ) @ IF = 10 mAdc

1
ANODE

2
CATHODE

3
CATHODE/ANODE

1
2

CASE 318 08, STYLE 11


SOT 23 (TO 236AB)

MAXIMUM RATINGS (TJ = 125C unless otherwise noted)


Symbol

Value

Unit

Reverse Voltage

VR

30

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
225
1.8

mW
mW/C

Operating Junction
Temperature Range

TJ

Rating

C
55 to +125

Storage Temperature Range

Tstg

55 to +150

DEVICE MARKING
BAT54S = LD3

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Symbol

Min

Typ

Max

Unit

V(BR)R

30

Volts

Total Capacitance (VR = 1.0 V, f = 1.0 MHz)

CT

7.6

10

pF

Reverse Leakage (VR = 25 V)

IR

0.5

2.0

Adc

Forward Voltage (IF = 0.1 mAdc)

VF

0.22

0.24

Vdc

Forward Voltage (IF = 30 mAdc)

VF

0.41

0.5

Vdc

Forward Voltage (IF = 100 mAdc)

VF

0.52

1.0

Vdc

Reverse Recovery Time


(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) Figure 1

trr

5.0

ns

Forward Voltage (IF = 1.0 mAdc)

VF

0.29

0.32

Vdc

Forward Voltage (IF = 10 mAdc)

VF

0.35

0.40

Vdc

Characteristic
Reverse Breakdown Voltage (IR = 10 A)

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

529

BAT54SLT1
820
+10 V

2k

0.1 F

tr

IF

100 H

tp

0.1 F

IF

trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit


100

1000
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C

1 50C

10

1 25C
1.0
85C
25C

0.1
0.0

40C

100
TA = 125C
10
1.0
TA = 85C
0.1
0.01

55C

TA = 25C
0.001

0.1

0.2

0.3

0.4

0.5

0.6

VF, FORWARD VOLTAGE (VOLTS)

Figure 2. Forward Voltage

10
15
20
VR, REVERSE VOLTAGE (VOLTS)

25

30

Figure 3. Leakage Current

C T , TOTAL CAPACITANCE (pF)

14
12
10
8
6
4
2
0

10

15

20

25

30

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Total Capacitance

530

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Series Schottky


Barrier Diodes

BAT54SWT1
Motorola Preferred Device

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.

30 VOLT
DUAL SERIES
SCHOTTKY BARRIER
DIODES

Extremely Fast Switching Speed


Low Forward Voltage 0.35 Volts (Typ) @ IF = 10 mAdc

1
ANODE

2
CATHODE

3
CATHODE/ANODE

1
2

CASE 419 02, STYLE 9


SOT 323 (SC 70)

MAXIMUM RATINGS (TJ = 125C unless otherwise noted)


Symbol

Value

Unit

Reverse Voltage

VR

30

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
200
1.6

mW
mW/C

Operating Junction
Temperature Range

TJ

Rating

C
55 to +150

Storage Temperature Range

Tstg

55 to +150

DEVICE MARKING
BAT54SWT1 = B8

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

30

Volts

Total Capacitance (VR = 1.0 V, f = 1.0 MHz)

CT

7.6

10

pF

Reverse Leakage (VR = 25 V)

IR

0.5

2.0

Adc

Forward Voltage (IF = 0.1 mAdc)

VF

0.22

0.24

Vdc

Forward Voltage (IF = 30 mAdc)

VF

0.41

0.5

Vdc

Forward Voltage (IF = 100 mAdc)

VF

0.52

1.0

Vdc

Reverse Recovery Time


(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) Figure 1

trr

5.0

ns

Forward Voltage (IF = 1.0 mAdc)

VF

0.29

0.32

Vdc

Forward Voltage (IF = 10 mAdc)

VF

0.35

0.40

Vdc

Reverse Breakdown Voltage (IR = 10 A)

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

531

BAT54SWT1
820
+10 V

2k

0.1 F

tr

IF

100 H

tp

0.1 F

IF

trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

100

1000
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C

1 50C

10

1 25C
1.0
85C
25C

0.1
0.0

40C

100
TA = 125C
10
1.0
TA = 85C
0.1
0.01

55C

TA = 25C
0.001

0.1

0.2

0.3

0.4

0.5

0.6

10
15
20
VR, REVERSE VOLTAGE (VOLTS)

VF, FORWARD VOLTAGE (VOLTS)

Figure 2. Forward Voltage

25

30

Figure 3. Leakage Current

C T , TOTAL CAPACITANCE (pF)

14
12
10
8
6
4
2
0

10

15

20

25

30

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Total Capacitance

532

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Schottky Barrier Diode

BAT54T1

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.

Motorola Preferred Device

Extremely Fast Switching Speed

30 VOLT
SCHOTTKY BARRIER
DETECTOR AND SWITCHING
DIODE

Low Forward Voltage 0.35 Volts (Typ) @ IF = 10 mAdc


1
Cathode

2
Anode

2
1

CASE 425 04, STYLE 1


SOD 123

MAXIMUM RATINGS (TJ = 125C unless otherwise noted)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

30

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
400
3.2

mW
mW/C

Operating Junction
Temperature Range

TJ

C
55 to +150

Storage Temperature Range

Tstg

55 to +150

DEVICE MARKING
BAT54T1 = BU

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

30

Volts

Total Capacitance (VR = 1.0 V, f = 1.0 MHz)

CT

7.6

10

pF

Reverse Leakage (VR = 25 V)

IR

0.5

2.0

Adc

Forward Voltage (IF = 0.1 mAdc)

VF

0.22

0.24

Vdc

Forward Voltage (IF = 30 mAdc)

VF

0.41

0.5

Vdc

Forward Voltage (IF = 100 mAdc)

VF

0.52

1.0

Vdc

Reverse Recovery Time


(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) Figure 1

trr

5.0

ns

Forward Voltage (IF = 1.0 mAdc)

VF

0.29

0.32

Vdc

Forward Voltage (IF = 10 mAdc)

VF

0.35

0.40

Vdc

Reverse Breakdown Voltage (IR = 10 A)

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

533

BAT54T1
820
+10 V

2k

0.1 F

tr

IF

100 H

tp

0.1 F

IF

trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit


100

1000
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C

1 50C

10

1 25C
1.0
85C
25C

0.1
0.0

40C

100
TA = 125C
10
1.0
TA = 85C
0.1
0.01

55C

TA = 25C
0.001

0.1

0.2

0.3

0.4

0.5

0.6

VF, FORWARD VOLTAGE (VOLTS)

Figure 2. Forward Voltage

10
15
20
VR, REVERSE VOLTAGE (VOLTS)

25

30

Figure 3. Leakage Current

C T , TOTAL CAPACITANCE (pF)

14
12
10
8
6
4
2
0

10

15

20

25

30

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Total Capacitance

534

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Schottky Barrier Diode

BAT54WT1

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.

Motorola Preferred Device

Extremely Fast Switching Speed

30 VOLTS
SCHOTTKY BARRIER
DETECTOR AND SWITCHING
DIODE

Extremely Low Forward Voltage 0.35 Volts (Typ) @ IF = 10 mAdc

3
CATHODE

1
ANODE
1
2

CASE 419 02, STYLE 2


SOT 323 (SC 70)

MAXIMUM RATINGS (TJ = 125C unless otherwise noted)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

30

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
200
1.6

mW
mW/C

Operating Junction
Temperature Range

TJ

C
55 to +150

Storage Temperature Range

Tstg

55 to +150

DEVICE MARKING
BAT54WT1 = B4

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

30

Volts

Total Capacitance (VR = 1.0 V, f = 1.0 MHz)

CT

7.6

10

pF

Reverse Leakage (VR = 25 V)

IR

0.5

2.0

Adc

Forward Voltage (IF = 0.1 mAdc)

VF

0.22

0.24

Vdc

Forward Voltage (IF = 30 mAdc)

VF

0.41

0.5

Vdc

Forward Voltage (IF = 100 mAdc)

VF

0.52

1.0

Vdc

Reverse Recovery Time


(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) Figure 1

trr

5.0

ns

Forward Voltage (IF = 1.0 mAdc)

VF

0.29

0.32

Vdc

Forward Voltage (IF = 10 mAdc)

VF

0.35

0.40

Vdc

Reverse Breakdown Voltage (IR = 10 A)

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

535

BAT54WT1
820
+10 V

2k

0.1 F

tr

IF

100 H

tp

0.1 F

IF

trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

100

1000
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C

1 50C

10

1 25C
1.0
85C
25C

0.1
0.0

40C

100
TA = 125C
10
1.0
TA = 85C
0.1
0.01

55C

TA = 25C
0.001

0.1

0.2

0.3

0.4

0.5

0.6

VF, FORWARD VOLTAGE (VOLTS)

Figure 2. Forward Voltage

10
15
20
VR, REVERSE VOLTAGE (VOLTS)

25

30

Figure 3. Leakage Current

C T , TOTAL CAPACITANCE (pF)

14
12
10
8
6
4
2
0

10

15

20

25

30

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Total Capacitance

536

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Monolithic Dual Switching Diode


Common Cathode

BAV70LT1
Motorola Preferred Device

ANODE
1
3
CATHODE

2
ANODE

3
1

MAXIMUM RATINGS (EACH DIODE)


Symbol

Value

Unit

Reverse Voltage

VR

70

Vdc

Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Rating

Peak Forward Surge Current

CASE 318 08, STYLE 9


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BAV70LT1 = A4

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Max

Unit

V(BR)

70

Vdc

60
2.5
100

1.5

715
855
1000
1250

6.0

OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR) = 100 Adc)
Reverse Voltage Leakage Current
(VR = 25 Vdc, TJ = 150C)
(VR = 70 Vdc)
(VR = 70 Vdc, TJ = 150C)

IR

Diode Capacitance
(VR = 0, f = 1.0 MHz)

CD

Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)

VF

Reverse Recovery Time


RL = 100
(IF = IR = 10 mAdc, VR = 5.0 Vdc, IR(REC) = 1.0 mAdc) (Figure 1)

trr

Adc

pF
mVdc

ns

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

537

BAV70LT1
820
+10 V

2.0 k
100 H

tp

tr

0.1 F
IF

IF

trr

10%

0.1 F
90%

D.U.T.
50 INPUT
SAMPLING
OSCILLOSCOPE

50 OUTPUT
PULSE
GENERATOR

iR(REC) = 1.0 mA

IR

VR

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

Curves Applicable to Each Anode


10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C
TA = 85C
10
TA = 40C

1.0

TA = 25C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

10

1.2

Figure 2. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 3. Leakage Current

CD, DIODE CAPACITANCE (pF)

1.0

0.9

0.8

0.7

0.6

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

538

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BAV70WT1

Dual Switching Diode


ANODE
1
3
CATHODE

Motorola Preferred Device

2
3

MAXIMUM RATINGS (TA = 25C)


Rating

Symbol

Max

Unit

Reverse Voltage

VR

70

Vdc

Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

200

mW

1.6

mW/C

Thermal Resistance, Junction to Ambient

RqJA

0.625

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Peak Forward Surge Current

1
2

CASE 41902, STYLE 5


SC70/SOT323

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BAV70WT1 = A4

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

V(BR)

70

Vdc

IR1
IR2

5.0
100

Adc
nAdc

Diode Capacitance
(VR = 0, f = 1.0 MHz)

CD

1.5

pF

Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)

VF

715
855
1000
1250

Reverse Recovery Time


(IF = IR = 10 mAdc, RL = 100 , IR(REC) = 1.0 mAdc) (Figure 1)

trr

6.0

ns

VRF

1.75

Characteristic

OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR) = 100 Adc)
Reverse Voltage Leakage Current
(VR = 70 Vdc)
(VR = 50 Vdc)

Forward Recovery Voltage


(IF = 10 mAdc, tr = 20 ns) (Figure 2)

mVdc

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

539

BAV70WT1

BAV70

RS = 50
SAMPLING
OSCILLOSCOPE
RL = 50

IF

tr

tp
I
10%
+IF

trr

10% OF

90%

VR

OUTPUT PULSE

VR
100

INPUT PULSE

Figure 1. Recovery Time Equivalent Test Circuit

450

1 K

RS = 50
SAMPLING
OSCILLOSCOPE
RL = 50

BAV70

I
V
90%

VFR

10%
t
tr

540

tp
INPUT PULSE

Figure 2.

OUTPUT PULSE

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BAV70WT1
10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C

10
TA = 85C
TA = 25C

1.0

TA = 40C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

1.2

10

Figure 3. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 4. Leakage Current

CD, DIODE CAPACITANCE (pF)

1.0

0.9

0.8

0.7

0.6

VR, REVERSE VOLTAGE (VOLTS)

Figure 5. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

541

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Monolithic Dual
Switching Diode

BAV74LT1
ANODE
1
3
CATHODE

2
ANODE

3
1

MAXIMUM RATINGS (EACH DIODE)


Symbol

Value

Unit

Reverse Voltage

VR

50

Vdc

Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Rating

Peak Forward Surge Current

CASE 318 08, STYLE 9


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BAV74LT1 = JA

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Max

Unit

V(BR)

50

Vdc

100
0.1

OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR) = 5.0 Adc)

Adc

Reverse Voltage Leakage Current


(VR = 50 Vdc, TJ = 125C)
(VR = 50 Vdc)

IR

Diode Capacitance
(VR = 0, f = 1.0 MHz)

CD

2.0

pF

Forward Voltage
(IF = 100 mAdc)

VF

1.0

Vdc

Reverse Recovery Time


(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc, measured at IR = 1.0 mA, RL = 100 )

trr

4.0

ns

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

542

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BAV74LT1
Curves Applicable to Each Anode
10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C
TA = 85C
10
TA = 40C

1.0

TA = 25C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

10

1.2

Figure 1. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 2. Leakage Current

CD, DIODE CAPACITANCE (pF)

1.0

0.9

0.8

0.7

0.6

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

543

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Series Switching Diode

BAV99LT1

ANODE
1

Motorola Preferred Device

CATHODE
2
3
CATHODE/ANODE

3
1
2

CASE 318 08, STYLE 11


SOT 23 (TO 236AB)

MAXIMUM RATINGS (EACH DIODE)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

70

Vdc

Forward Current

IF

215

mAdc

Peak Forward Surge Current

IFM(surge)

500

mAdc

Repetitive Peak Reverse Voltage

VRRM

70

Average Rectified Forward Current(1)


(averaged over any 20 ms period)

IF(AV)

715

mA

Repetitive Peak Forward Current

IFRM

450

mA

NonRepetitive Peak Forward Current


t = 1.0 ms
t = 1.0 ms
t = 1.0 S

IFSM

A
2.0
1.0
0.5

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

PD

225

mW

1.8

mW/C

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

65 to +150

Total Device Dissipation


FR5 Board,(1) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Total Device Dissipation
Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BAV99LT1 = A7
1. FR5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina

Preferred devices are Motorola recommended choices for future use and best overall value.

544

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BAV99LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued) (EACH DIODE)
Characteristic

Symbol

Min

Max

Unit

V(BR)

70

Vdc

Reverse Voltage Leakage Current (VR = 70 Vdc)


(VR = 25 Vdc, TJ = 150C)
(VR = 70 Vdc, TJ = 150C)

IR

2.5
30
50

Diode Capacitance
(VR = 0, f = 1.0 MHz)

CD

1.5

pF

Forward Voltage

VF

715
855
1000
1250

mVdc

trr

6.0

ns

VFR

1.75

OFF CHARACTERISTICS
Reverse Breakdown Voltage (I(BR) = 100 A)

(IF = 1.0 mAdc)


(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)

Reverse Recovery Time (IF = IR = 10 mAdc, iR(REC) = 1.0 mAdc) (Figure 1) RL = 100

Forward Recovery Voltage (IF = 10 mA, tr = 20 ns)

mAdc

820
+10 V

2k
100 H

0.1 F

tr

IF

0.1 F

tp

IF
trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR
INPUT SIGNAL

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

545

BAV99LT1
CURVES APPLICABLE TO EACH DIODE
100

10

I R, REVERSE CURRENT ( A)

IF, FORWARD CURRENT (mA)

TA = 150C

10
TA = 85C
TA = 25C

1.0

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01

TA = 40C
TA = 25C
0.1
0.2

0.4

0.6

0.8

1.0

0.001

1.2

10

20

30

VF, FORWARD VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Forward Voltage

Figure 3. Leakage Current

40

50

CD , DIODE CAPACITANCE (pF)

0.68

0.64

0.60

0.56

0.52

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

546

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

BAV99WT1
BAV99RWT1

SC-70/SOT-323 Dual Series


Switching Diode

Motorola Preferred Devices

The BAV99WT1 is a smaller package, equivalent to the BAV99LT1.


Suggested Applications
ESD Protection
Polarity Reversal Protection

Data Line Protection

Inductive Load Protection

Steering Logic

ANODE
1

3
CATHODE/ANODE

MAXIMUM RATINGS (EACH DIODE)


Symbol

Value

Unit

Reverse Voltage

VR

70

Vdc

Forward Current

IF

215

mAdc

IFM(surge)

500

mAdc

Repetitive Peak Reverse Voltage

VRRM

70

Average Rectified Forward Current(1)


(averaged over any 20 ms period)

IF(AV)

715

mA

Repetitive Peak Forward Current

IFRM

450

mA

NonRepetitive Peak Forward Current


t = 1.0 ms
t = 1.0 ms
t = 1.0 S

IFSM

Rating

Peak Forward Surge Current

CATHODE
2

BAV99WT1
CASE 41902, STYLE 9
SC70/SOT323
CATHODE
1

ANODE
2
3
CATHODE/ANODE

BAV99RWT1
CASE 41902, STYLE 10
SC70/SOT323

2.0
1.0
0.5

DEVICE MARKING
BAV99WT1 = A7
BAV99RWT1 = F7

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation
FR5 Board,(1) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Total Device Dissipation
Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature


 

Symbol

Max

Unit

PD

200

mW

1.6

mW/C

RqJA

625

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

65 to +150

1. FR5 = 1.0
0.75
0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

547

BAV99WT1 BAV99RWT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)
Characteristic

Symbol

Min

Max

Unit

V(BR)

70

Vdc

Reverse Voltage Leakage Current (VR = 70 Vdc)


(VR = 25 Vdc, TJ = 150C)
(VR = 70 Vdc, TJ = 150C)

IR

2.5
30
50

Diode Capacitance
(VR = 0, f = 1.0 MHz)

CD

1.5

pF

Forward Voltage

VF

715
855
1000
1250

mVdc

trr

6.0

ns

VFR

1.75

OFF CHARACTERISTICS
Reverse Breakdown Voltage (I(BR) = 100 A)

(IF = 1.0 mAdc)


(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)

Reverse Recovery Time (IF = IR = 10 mAdc, iR(REC) = 1.0 mAdc) (Figure 1) RL = 100

Forward Recovery Voltage (IF = 10 mA, tr = 20 ns)

mAdc

820
+10 V

2k
100 H

0.1 F

tr

IF

0.1 F

tp

IF
trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR
INPUT SIGNAL

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

548

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BAV99WT1 BAV99RWT1
CURVES APPLICABLE TO EACH DIODE
100

10

I R, REVERSE CURRENT ( A)

IF, FORWARD CURRENT (mA)

TA = 150C

10
TA = 85C
TA = 25C

1.0

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01

TA = 40C
TA = 25C
0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

0.001

1.2

10

Figure 2. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 3. Leakage Current

CD , DIODE CAPACITANCE (pF)

0.68

0.64

0.60

0.56

0.52

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

549

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Monolithic Dual Switching Diode


This switching diode has the following features:

BAV170LT1

Low Leakage Current Applications

Motorola Preferred Device

Medium Speed Switching Times


Available in 8 mm Tape and Reel
Use BAV170LT1 to order the 7 inch/3,000 unit reel
Use BAV170LT3 to order the 13 inch/10,000 unit reel

3
1

ANODE
1
3
CATHODE

2
ANODE

CASE 318 08, STYLE 9


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VR

70

Vdc

Reverse Voltage
Forward Current
Peak Forward Surge Current

IF

200

mAdc

IFM(surge)

500

mAdc

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BAV170LT1 = JX

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Max

Unit

V(BR)

70

Vdc

Reverse Voltage Leakage Current (VR = 70 Vdc)


Reverse Voltage Leakage Current (VR = 70 Vdc, TJ = 150C)

IR

5.0
80

nAdc

Diode Capacitance (VR = 0 V, f = 1.0 MHz)

CD

2.0

pF

Forward Voltage (IF = 1.0 mAdc)


Forward Voltage (IF = 10 mAdc)
Forward Voltage (IF = 50 mAdc)
Forward Voltage (IF = 150 mAdc)

VF

900
1000
1100
1250

mVdc

trr

3.0

OFF CHARACTERISTICS
Reverse Breakdown Voltage (I(BR) = 100 Adc)

Reverse Recovery Time


(IF = IR = 10 mAdc) (Figure 1)

RL = 100

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

550

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BAV170LT1
820
+10 V

2.0 k
100 H

tp

tr

0.1 F
IF

IF
trr

10%

0.1 F
90%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

iR(REC) = 1.0 mA

IR

VR
INPUT SIGNAL

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

551

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Series Switching Diode

BAV199LT1

This switching diode has the following features:


Low Leakage Current Applications

Motorola Preferred Device

Medium Speed Switching Times


Available in 8 mm Tape and Reel
Use BAV199LT1 to order the 7 inch/3,000 unit reel
Use BAV199LT3 to order the 13 inch/10,000 unit reel

ANODE
1

CATHODE
2
3
CATHODE/ANODE

CASE 318 08, STYLE 11


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Reverse Voltage

VR

70

Vdc

Forward Current

IF

215

mAdc

IFM(surge)

500

mAdc

Peak Forward Surge Current


Repetitive Peak Reverse Voltage

VRRM

70

Vdc

Average Rectified Forward Current(1) (averaged over any 20 ms period)

IF(AV)

715

mAdc

Repetitive Peak Forward Current

IFRM

450

mAdc

NonRepetitive Peak Forward Current t = 1.0 s


t = 1.0 ms
t = 1.0 A

IFSM

2.0
1.0
0.5

Adc

Symbol

Max

Unit

PD

225
1.8

mW
mW/C

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

65 to +150

THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR 5 Board(1) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BAV199LT1 = JY

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

552

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BAV199LT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)
Characteristic

Symbol

Min

Max

Unit

V(BR)

70

Vdc

5.0
80

2.0

900
1000
1100
1250

3.0

OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR) = 100 Adc)
Reverse Voltage Leakage Current
(VR = 70 Vdc)
(VR = 70 Vdc, TJ = 150C)

IR

Diode Capacitance
(VR = 0 V, f = 1.0 MHz)

CD

Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)

VF

Reverse Recovery Time


(IF = IR = 10 mAdc) (Figure 1)

trr

nAdc

pF
mVdc

820
+10 V

2.0 k
100 H

tp

tr

0.1 F
IF

IF
trr

10%

0.1 F
90%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

iR(REC) = 1.0 mA

IR

VR
INPUT SIGNAL

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

553

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Monolithic Dual Switching Diode


Common Anode
ANODE
3

BAW56LT1
Motorola Preferred Device

CATHODE
1
2
CATHODE

3
1

MAXIMUM RATINGS (EACH DIODE)


Symbol

Value

Unit

Reverse Voltage

VR

70

Vdc

Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Rating

Peak Forward Surge Current

CASE 318 08, STYLE 12


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BAW56LT1 = A1

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Max

Unit

V(BR)

70

Vdc

30
2.5
50

2.0

715
855
1000
1250

6.0

OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR) = 100 Adc)
Reverse Voltage Leakage Current
(VR = 25 Vdc, TJ = 150C)
(VR = 70 Vdc)
(VR = 70 Vdc, TJ = 150C)

IR

Diode Capacitance
(VR = 0, f = 1.0 MHz)

CD

Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)

VF

Reverse Recovery Time


(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) (Figure 1) RL = 100

trr

Adc

pF
mVdc

ns

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

554

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BAW56LT1
820
+10 V

2.0 k
100 H

tp

tr

0.1 F
IF

IF

trr

10%

0.1 F
90%

D.U.T.
50 INPUT
SAMPLING
OSCILLOSCOPE

50 OUTPUT
PULSE
GENERATOR

iR(REC) = 1.0 mA

IR

VR

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

Curves Applicable to Each Cathode


10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C
TA = 85C
10
TA = 40C

1.0

TA = 25C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

10

1.2

Figure 2. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 3. Leakage Current

CD, DIODE CAPACITANCE (pF)

1.75

1.5

1.25

1.0

0.75

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

555

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Switching Diode

BAW56WT1
Motorola Preferred Device

CATHODE
1
3
ANODE

2
3

MAXIMUM RATINGS (TA = 25C)


Symbol

Max

Unit

Reverse Voltage

VR

70

Vdc

Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

200

mW

1.6

mW/C

Thermal Resistance, Junction to Ambient

RqJA

0.625

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Rating

Peak Forward Surge Current

1
2

CASE 41902, STYLE 4


SC70/SOT323

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BAW56WT1 = A1

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)

70

Vdc

30
2.5
50

2.0

715
855
1000
1250

6.0

OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR) = 100 Adc)
Reverse Voltage Leakage Current
(VR = 25 Vdc, TJ = 150C)
(VR = 70 Vdc)
(VR = 70 Vdc, TJ = 150C)

IR

Diode Capacitance
(VR = 0, f = 1.0 MHz)

CD

Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 60 mAdc)
(IF = 150 mAdc)

VF

Reverse Recovery Time


(IF = IR = 10 mAdc, RL = 100 , IR(REC) = 1.0 mAdc) (Figure 1)

trr

Adc

pF
mVdc

ns

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

556

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BAW56WT1
820
+10 V

2.0 k
100 H

tp

tr

0.1 F
IF

IF

trr

10%

0.1 F
90%

DUT
50 INPUT
SAMPLING
OSCILLOSCOPE

50 OUTPUT
PULSE
GENERATOR

iR(REC) = 1.0 mA

IR

VR

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C

10
TA = 85C
TA = 25C
1.0

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01

TA = 40C
TA = 25C
0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

10

1.2

Figure 2. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 3. Leakage Current

CD, DIODE CAPACITANCE (pF)

1.75

1.5

1.25

1.0

0.75

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

557

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Monolithic Dual Switching Diode


This switching diode has the following features:

BAW156LT1

Low Leakage Current Applications

Motorola Preferred Device

Medium Speed Switching Times


Available in 8 mm Tape and Reel
Use BAW156LT1 to order the 7 inch/3,000 unit reel
Use BAW156LT3 to order the 13 inch/10,000 unit reel

3
1

CATHODE
1

ANODE
3

2
CATHODE

CASE 318 08, STYLE 12


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VR

70

Vdc

Reverse Voltage
Forward Current
Peak Forward Surge Current

IF

200

mAdc

IFM(surge)

500

mAdc

THERMAL CHARACTERISTICS
Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

Characteristic

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
BAW156LT1 = JZ

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Max

Unit

OFF CHARACTERISTICS
Reverse Breakdown Voltage (I(BR) = 100 Adc)

V(BR)

70

Vdc

Reverse Voltage Leakage Current (VR = 70 Vdc)


Reverse Voltage Leakage Current (VR = 70 Vdc, TJ = 150C)

IR

5.0
80

nAdc

Diode Capacitance (VR = 0 V, f = 1.0 MHz)

CD

2.0

pF

Forward Voltage (IF = 1.0 mAdc)


Forward Voltage (IF = 10 mAdc)
Forward Voltage (IF = 50 mAdc)
Forward Voltage (IF = 150 mAdc)

VF

900
1000
1100
1250

mVdc

Reverse Recovery Time (IF = IR = 10 mAdc) (Figure 1)

trr

3.0

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

558

Motorola SmallSignal Transistors, FETs and Diodes Device Data

BAW156LT1
820
+10 V

2.0 k
100 H

tp

tr

0.1 F
IF

IF
trr

10%

0.1 F
90%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

iR(REC) = 1.0 mA

IR

VR
INPUT SIGNAL

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

559

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Common Cathode Silicon


Dual Switching Diode

DAN222

This Common Cathode Silicon Epitaxial Planar Dual Diode is designed for use in
ultra high speed switching applications. This device is housed in the SOT416/SC90
package which is designed for low power surface mount applications, where board
space is at a premium.
Fast trr

SOT416/SC90 PACKAGE
COMMON CATHODE
DUAL SWITCHING DIODE
SURFACE MOUNT

Low CD
Available in 8 mm Tape and Reel

3
2
1

CASE 46301, STYLE 4


SOT416/SC90

MAXIMUM RATINGS (TA = 25C)


Rating
Reverse Voltage
Peak Reverse Voltage
Forward Current
Peak Forward Current
Peak Forward Surge Current

Symbol

Value

Unit

VR

80

Vdc

VRM

80

Vdc

IF

100

mAdc

IFM

300

mAdc

IFSM(1)

2.0

Adc

CATHODE
3

DEVICE MARKING

2
ANODE

DAN222 = N9

THERMAL CHARACTERISTICS
Rating

Symbol

Max

Unit

Power Dissipation

PD

150

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ + 150

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic

Symbol

Condition

Min

Max

Unit

Reverse Voltage Leakage Current

IR

VR = 70 V

0.1

Adc

Forward Voltage

VF

IF = 100 mA

1.2

Vdc

Reverse Breakdown Voltage

VR

IR = 100 A

80

Vdc

CD

VR = 6.0 V, f = 1.0 MHz

3.5

pF

trr(2)

IF = 5.0 mA, VR = 6.0 V, RL = 100 , Irr = 0.1 IR

4.0

ns

Diode Capacitance
Reverse Recovery Time
1. t = 1 S
2. trr Test Circuit on following page.

REV 1

560

Motorola SmallSignal Transistors, FETs and Diodes Device Data

DAN222
TYPICAL ELECTRICAL CHARACTERISTICS
10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C
TA = 85C
10
TA = 40C

1.0

TA = 25C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

10

1.2

Figure 1. Forward Voltage

50

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Reverse Current

CD , DIODE CAPACITANCE (pF)

1.0

0.9

0.8

0.7

0.6

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Diode Capacitance

RECOVERY TIME EQUIVALENT TEST CIRCUIT

INPUT PULSE
tr

OUTPUT PULSE

tp

trr
IF

10%

RL

Irr = 0.1 IR
90%
VR

Motorola SmallSignal Transistors, FETs and Diodes Device Data

tp = 2 s
tr = 0.35 ns

IF = 5.0 mA
VR = 6 V
RL = 100

561

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Common Anode Silicon


Dual Switching Diode

DAP222

This Common Anode Silicon Epitaxial Planar Dual Diode is designed for use in ultra
high speed switching applications. This device is housed in the SOT416/SC90
package which is designed for low power surface mount applications, where board
space is at a premium.
Fast trr

SOT416/SC90 PACKAGE
COMMON ANODE
DUAL SWITCHING DIODE
SURFACE MOUNT

Low CD
Available in 8 mm Tape and Reel

3
2
1

CASE 46301, STYLE 4


SOT416/SC90

MAXIMUM RATINGS (TA = 25C)


Rating
Reverse Voltage
Peak Reverse Voltage
Forward Current
Peak Forward Current
Peak Forward Surge Current

Symbol

Value

Unit

VR

80

Vdc

VRM

80

Vdc

IF

100

mAdc

IFM

300

mAdc

IFSM(1)

2.0

Adc

ANODE
3

DEVICE MARKING

2
CATHODE

DAP222 = P9

THERMAL CHARACTERISTICS
Rating

Symbol

Max

Unit

Power Dissipation

PD

150

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ + 150

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic

Symbol

Condition

Min

Max

Unit

Reverse Voltage Leakage Current

IR

VR = 70 V

0.1

Adc

Forward Voltage

VF

IF = 100 mA

1.2

Vdc

Reverse Breakdown Voltage

VR

IR = 100 A

80

Vdc

CD

VR = 6.0 V, f = 1.0 MHz

3.5

pF

trr(2)

IF = 5.0 mA, VR = 6.0 V, RL = 100 , Irr = 0.1 IR

4.0

ns

Diode Capacitance
Reverse Recovery Time
1. t = 1 S
2. trr Test Circuit on following page.

REV 1

562

Motorola SmallSignal Transistors, FETs and Diodes Device Data

DAP222
TYPICAL ELECTRICAL CHARACTERISTICS
10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C
TA = 85C
10
TA = 40C

1.0

TA = 25C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

10

1.2

Figure 1. Forward Voltage

50

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Reverse Current

CD , DIODE CAPACITANCE (pF)

1.75

1.5

1.25

1.0

0.75

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Diode Capacitance

RECOVERY TIME EQUIVALENT TEST CIRCUIT

INPUT PULSE
tr

OUTPUT PULSE

tp

trr
IF

10%

RL

Irr = 0.1 IR
90%
VR

Motorola SmallSignal Transistors, FETs and Diodes Device Data

tp = 2 s
tr = 0.35 ns

IF = 5.0 mA
VR = 6 V
RL = 100

563

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Single Silicon Switching Diode


This Silicon Epitaxial Planar Diode is designed for use in ultra high speed switching
applications. This device is housed in the SC70 package which is designed for low
power surface mount applications.

M1MA141KT1
M1MA142KT1
Motorola Preferred Devices

Fast trr, < 3.0 ns


Low CD, < 2.0 pF
Available in 8 mm Tape and Reel
Use M1MA141/2KT1 to order the 7 inch/3000 unit reel.
Use M1MA141/2KT3 to order the 13 inch/10,000 unit reel.

SC70/SOT323 PACKAGE
SINGLE SILICON
SWITCHING DIODE
40/80 V100 mA
SURFACE MOUNT

CATHODE
3

ANODE NO CONNECTION
1
2

1
2

MAXIMUM RATINGS (TA = 25C)


Rating
Reverse Voltage

Symbol

Value

Unit

VR

40

Vdc

M1MA141KT1
M1MA142KT1

Peak Reverse Voltage

80
VRM

M1MA141KT1

80

Forward Current

Peak Forward Surge Current

Vdc

40

M1MA142KT1

Peak Forward Current

CASE 41902, STYLE 2


SC70/SOT323

IF

100

mAdc

IFM
IFSM(1)

225

mAdc

500

mAdc

Symbol

Max

Unit

PD

150

mW

THERMAL CHARACTERISTICS
Rating
Power Dissipation
Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ + 150

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic
Reverse Voltage Leakage Current

M1MA141KT1

Symbol

Condition

Min

Max

Unit

IR

VR = 35 V

0.1

Adc

VR = 75 V

0.1

VF

IF = 100 mA

1.2

Vdc

VR

IR = 100 A

40

Vdc

80

CD

VR = 0, f = 1.0 MHz

2.0

pF

trr(2)

IF = 10 mA, VR = 6.0 V,
RL = 100 , Irr = 0.1 IR

3.0

ns

M1MA142KT1
Forward Voltage
Reverse Breakdown Voltage

M1MA141KT1
M1MA142KT1

Diode Capacitance
Reverse Recovery Time
1. t = 1 SEC
2. trr Test Circuit

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

564

Motorola SmallSignal Transistors, FETs and Diodes Device Data

M1MA141KT1 M1MA142KT1
RECOVERY TIME EQUIVALENT TEST CIRCUIT

INPUT PULSE
tr

OUTPUT PULSE

tp

trr
IF

t
10%

RL

Irr = 0.1 IR
90%
VR

IF = 10 mA
VR = 6 V
RL = 100

tp = 2 s
tr = 0.35 ns

DEVICE MARKING EXAMPLE


Marking Symbol
Type No.

141K

142K

Symbol

MH

MI

MHX

The X represents a smaller alpha digit Date Code. The Date Code
indicates the actual month in which the part was manufactured.

10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C
TA = 85C
10
TA = 40C

1.0

TA = 25C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

10

1.2

Figure 1. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 2. Reverse Current

CD, DIODE CAPACITANCE (pF)

0.68

0.64

0.6

0.56

0.52

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Diode Capacitance


Motorola SmallSignal Transistors, FETs and Diodes Device Data

565

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Common Anode Silicon


Dual Switching Diode

M1MA141WAT1
M1MA142WAT1

This Common Anode Silicon Epitaxial Planar Dual Diode is designed for use in ultra
high speed switching applications. This device is housed in the SC70 package which
is designed for low power surface mount applications.
Fast trr, < 10 ns

SC70/SOT323 PACKAGE
COMMON ANODE
DUAL SWITCHING DIODE
40/80 V100 mA
SURFACE MOUNT

Low CD, < 15 pF


Available in 8 mm Tape and Reel
Use M1MA141/2WAT1 to order the 7 inch/3000 unit reel.
Use M1MA141/2WAT3 to order the 13 inch/10,000 unit reel.

Motorola Preferred Devices

ANODE
3

CATHODE

MAXIMUM RATINGS (TA = 25C)


Rating
Reverse Voltage

M1MA141WAT1

Symbol

Value

Unit

VR

40

Vdc

M1MA142WAT1
Peak Reverse Voltage

M1MA141WAT1

80
VRM

40

IF

100

M1MA142WAT1
Forward Current

Single

mAdc

150
IFM

Single

mAdc

225

Dual
Peak Forward Surge Current

Vdc

80

Dual
Peak Forward Current

CASE 41902, STYLE 4


SC70/SOT323

340
IFSM(1)

Single

mAdc

500

Dual

750

THERMAL CHARACTERISTICS
Rating
Power Dissipation

Symbol

Max

Unit

PD

150

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ + 150

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic
Reverse Voltage Leakage Current

M1MA141WAT1

Symbol

Condition

Min

Max

Unit

IR

VR = 35 V

0.1

Adc

VR = 75 V

0.1

VF

IF = 100 mA

1.2

Vdc

VR

IR = 100 A

40

Vdc

80

M1MA142WAT1
Forward Voltage
Reverse Breakdown Voltage

M1MA141WAT1
M1MA142WAT1

Diode Capacitance
Reverse Recovery Time

CD

VR = 0, f = 1.0 MHz

15

pF

trr(2)

IF = 10 mA, VR = 6.0 V,
RL = 100 , Irr = 0.1 IR

10

ns

1. t = 1 SEC
2. trr Test Circuit
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

566

Motorola SmallSignal Transistors, FETs and Diodes Device Data

M1MA141WAT1 M1MA142WAT1
RECOVERY TIME EQUIVALENT TEST CIRCUIT

INPUT PULSE
tr

OUTPUT PULSE

tp

trr
IF

t
10%

RL

Irr = 0.1 IR
90%
VR

IF = 10 mA
VR = 6 V
RL = 100

tp = 2 s
tr = 0.35 ns

DEVICE MARKING EXAMPLE


Marking Symbol
Type No.

141WA

142WA

Symbol

MN

MO

MNX

The X represents a smaller alpha digit Date Code. The Date Code
indicates the actual month in which the part was manufactured.

10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C
TA = 85C
10
TA = 40C

1.0

TA = 25C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

10

1.2

Figure 1. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 2. Reverse Current

CD , DIODE CAPACITANCE (pF)

1.75

1.5

1.25

1.0

0.75

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Diode Capacitance


Motorola SmallSignal Transistors, FETs and Diodes Device Data

567

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Common Cathode Silicon


Dual Switching Diode

M1MA141WKT1
M1MA142WKT1

This Common Cathode Silicon Epitaxial Planar Dual Diode is designed for use in
ultra high speed switching applications. This device is housed in the SC70 package
which is designed for low power surface mount applications.
Fast trr, < 3.0 ns

SC70/SOT323 PACKAGE
COMMON CATHODE
DUAL SWITCHING DIODE
40/80 V100 mA
SURFACE MOUNT

Low CD, < 2.0 pF


Available in 8 mm Tape and Reel
Use M1MA141/2WKT1 to order the 7 inch/3000 unit reel.
Use M1MA141/2WKT3 to order the 13 inch/10,000 unit reel.

Motorola Preferred Devices

CATHODE
3

ANODE

MAXIMUM RATINGS (TA = 25C)


Rating
Reverse Voltage

M1MA141WKT1

Symbol

Value

Unit

VR

40

Vdc

M1MA142WKT1
Peak Reverse Voltage

M1MA141WKT1

80
VRM

40

IF

100

M1MA142WKT1
Forward Current

Single

mAdc

150
IFM

Single

mAdc

225

Dual
Peak Forward Surge Current

Vdc

80

Dual
Peak Forward Current

CASE 41902, STYLE 5


SC70/SOT323

340
IFSM(1)

Single

mAdc

500

Dual

750

THERMAL CHARACTERISTICS
Rating
Power Dissipation

Symbol

Max

Unit

PD

150

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 ~ + 150

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic
Reverse Voltage Leakage Current

M1MA141WKT1

Symbol

Condition

Min

Max

Unit

IR

VR = 35 V

0.1

Adc

VR = 75 V

0.1

VF

IF = 100 mA

1.2

Vdc

VR

IR = 100 A

40

Vdc

80

M1MA142WKT1
Forward Voltage
Reverse Breakdown Voltage

M1MA141WKT1
M1MA142WKT1

Diode Capacitance
Reverse Recovery Time

CD

VR = 0, f = 1.0 MHz

2.0

pF

trr(2)

IF = 10 mA, VR = 6.0 V,
RL = 100 , Irr = 0.1 IR

3.0

ns

1. t = 1 SEC
2. trr Test Circuit
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

568

Motorola SmallSignal Transistors, FETs and Diodes Device Data

M1MA141WKT1 M1MA142WKT1
RECOVERY TIME EQUIVALENT TEST CIRCUIT

INPUT PULSE
tr

OUTPUT PULSE

tp

trr
IF

t
10%

RL

Irr = 0.1 IR
90%
VR

IF = 10 mA
VR = 6 V
RL = 100

tp = 2 s
tr = 0.35 ns

DEVICE MARKING EXAMPLE


Marking Symbol
Type No.

141WK

142WK

Symbol

MT

MU

MTX

The X represents a smaller alpha digit Date Code. The Date Code
indicates the actual month in which the part was manufactured.

10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C
TA = 85C
10
TA = 40C

1.0

TA = 25C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

10

1.2

Figure 1. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 2. Reverse Current

CD , DIODE CAPACITANCE (pF)

1.0

0.9

0.8

0.7

0.6

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Diode Capacitance


Motorola SmallSignal Transistors, FETs and Diodes Device Data

569

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Single Silicon Switching Diodes


These Silicon Epitaxial Planar Diodes are designed for use in ultra high speed
switching applications. These devices are housed in the SC59 package which is
designed for low power surface mount applications.

M1MA151AT1
M1MA152AT1
Motorola Preferred Devices

Fast trr, < 3.0 ns


Low CD, < 2.0 pF
Available in 8 mm Tape and Reel
Use M1MA151/2AT1 to order the 7 inch/3000 unit reel.
Use M1MA151/2AT3 to order the 13 inch/10,000 unit reel.

SC59 PACKAGE
SINGLE SILICON
SWITCHING DIODES
40/80 V100 mA
SURFACE MOUNT

ANODE
3

3
2

2
1
CATHODE NO CONNECTION

MAXIMUM RATINGS (TA = 25C)


Rating
Reverse Voltage

Symbol

Value

Unit

VR

40

Vdc

M1MA151AT1
M1MA152AT1

Peak Reverse Voltage

80
VRM

M1MA151AT1

80

Forward Current

Peak Forward Surge Current

Vdc

40

M1MA152AT1

Peak Forward Current

CASE 318D03, STYLE 4


SC59

IF

100

mAdc

IFM
IFSM(1)

225

mAdc

500

mAdc

Symbol

Max

Unit

PD

200

mW

THERMAL CHARACTERISTICS
Rating
Power Dissipation
Junction Temperature

TJ

150

Storage Temperature

Tstg

55 to + 150

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic
Reverse Voltage Leakage Current

M1MA151AT1

Symbol

Condition

Min

Max

Unit

IR

VR = 35 V

0.1

Adc

VR = 75 V

0.1

VF

IF = 100 mA

1.2

Vdc

VR

IR = 100 A

40

Vdc

80

CD

VR = 0, f = 1.0 MHz

2.0

pF

trr(2)

IF = 10 mA, VR = 6.0 V,
RL = 100 , Irr = 0.1 IR

3.0

ns

M1MA152AT1
Forward Voltage
Reverse Breakdown Voltage

M1MA151AT1
M1MA152AT1

Diode Capacitance
Reverse Recovery Time
1. t = 1 SEC
2. trr Test Circuit

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

570

Motorola SmallSignal Transistors, FETs and Diodes Device Data

M1MA151AT1 M1MA152AT1
RECOVERY TIME EQUIVALENT TEST CIRCUIT

INPUT PULSE
tr

OUTPUT PULSE

tp

trr
IF

t
10%

RL

Irr = 0.1 IR
90%
VR

tp = 2 s
tr = 0.35 ns

IF = 10 mA
VR = 6 V
RL = 100

DEVICE MARKING
Marking Symbol
Type No.

151A

152A

Symbol

MA

MB

MAX

The X represents a smaller alpha digit Date Code. The Date Code
indicates the actual month in which the part was manufactured.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

571

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Single Silicon Switching Diodes


These Silicon Epitaxial Planar Diodes are designed for use in ultra high speed
switching applications. These devices are housed in the SC59 package which is
designed for low power surface mount applications.

M1MA151KT1
M1MA152KT1
Motorola Preferred Devices

Fast trr, < 3.0 ns


Low CD, < 2.0 pF
Available in 8 mm Tape and Reel
Use M1MA151/2KT1 to order the 7 inch/3000 unit reel.
Use M1MA151/2KT3 to order the 13 inch/10,000 unit reel.

SC59 PACKAGE
SINGLE SILICON
SWITCHING DIODES
40/80 V100 mA
SURFACE MOUNT

CATHODE
3

2
ANODE

1
NO CONNECTION

MAXIMUM RATINGS (TA = 25C)


Rating
Reverse Voltage

Symbol

Value

Unit

VR

40

Vdc

M1MA151KT1
M1MA152KT1

Peak Reverse Voltage

80
VRM

M1MA151KT1

80

Forward Current

Peak Forward Surge Current

Vdc

40

M1MA152KT1

Peak Forward Current

CASE 318D03, STYLE 2


SC59

IF

100

mAdc

IFM
IFSM(1)

225

mAdc

500

mAdc

Symbol

Max

Unit

PD

200

mW

THERMAL CHARACTERISTICS
Rating
Power Dissipation
Junction Temperature

TJ

150

Storage Temperature

Tstg

55 to + 150

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic
Reverse Voltage Leakage Current

M1MA151KT1

Symbol

Condition

Min

Max

Unit

IR

VR = 35 V

0.1

Adc

VR = 75 V

0.1

VF

IF = 100 mA

1.2

Vdc

VR

IR = 100 A

40

Vdc

80

CD

VR = 0, f = 1.0 MHz

2.0

pF

trr(2)

IF = 10 mA, VR = 6.0 V,
RL = 100 , Irr = 0.1 IR

3.0

ns

M1MA152KT1
Forward Voltage
Reverse Breakdown Voltage

M1MA151KT1
M1MA152KT1

Diode Capacitance
Reverse Recovery Time
1. t = 1 SEC
2. trr Test Circuit

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

572

Motorola SmallSignal Transistors, FETs and Diodes Device Data

M1MA151KT1 M1MA152KT1
RECOVERY TIME EQUIVALENT TEST CIRCUIT

INPUT PULSE
tr

OUTPUT PULSE

tp

trr
IF

t
10%

RL

Irr = 0.1 IR
90%
VR

tp = 2 s
tr = 0.35 ns

IF = 10 mA
VR = 6 V
RL = 100

DEVICE MARKING EXAMPLE


Marking Symbol
Type No.

151K

152K

Symbol

MH

MI

MHX

The X represents a smaller alpha digit Date Code. The Date Code
indicates the actual month in which the part was manufactured.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

573

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Common Anode Silicon


Dual Switching Diodes

M1MA151WAT1
M1MA152WAT1

These Common Anode Silicon Epitaxial Planar Dual Diodes are designed for use in
ultra high speed switching applications. These devices are housed in the SC59
package which is designed for low power surface mount applications.
Fast trr, < 10 ns

SC59 PACKAGE
COMMON ANODE
DUAL SWITCHING DIODES
40/80 V100 mA
SURFACE MOUNT

Low CD, < 15 pF


Available in 8 mm Tape and Reel
Use M1MA151/2WAT1 to order the 7 inch/3000 unit reel.
Use M1MA151/2WAT3 to order the 13 inch/10,000 unit reel.

Motorola Preferred Devices

ANODE
3

CATHODE

MAXIMUM RATINGS (TA = 25C)


Rating
Reverse Voltage

M1MA151WAT1

Symbol

Value

Unit

VR

40

Vdc

M1MA152WAT1
Peak Reverse Voltage

M1MA151WAT1

80
VRM

40

IF

100

M1MA152WAT1
Forward Current

Single

mAdc

150
IFM

Single

mAdc

225

Dual
Peak Forward Surge Current

Vdc

80

Dual
Peak Forward Current

CASE 318D03, STYLE 5


SC59

340
IFSM(1)

Single

mAdc

500

Dual

750

THERMAL CHARACTERISTICS
Rating
Power Dissipation

Symbol

Max

Unit

PD

200

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 to + 150

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic
Reverse Voltage Leakage Current

M1MA151WAT1

Symbol

Condition

Min

Max

Unit

IR

VR = 35 V

0.1

Adc

VR = 75 V

0.1

VF

IF = 100 mA

1.2

Vdc

VR

IR = 100 A

40

Vdc

80

M1MA152WAT1
Forward Voltage
Reverse Breakdown Voltage

M1MA151WAT1
M1MA152WAT1

Diode Capacitance
Reverse Recovery Time

CD

VR = 0, f = 1.0 MHz

15

pF

trr(2)

IF = 10 mA, VR = 6.0 V,
RL = 100 , Irr = 0.1 IR

10

ns

1. t = 1 SEC
2. trr Test Circuit
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

574

Motorola SmallSignal Transistors, FETs and Diodes Device Data

M1MA151WAT1 M1MA152WAT1
RECOVERY TIME EQUIVALENT TEST CIRCUIT

INPUT PULSE
tr

OUTPUT PULSE

tp

trr
IF

t
10%

RL

Irr = 0.1 IR
90%
VR

tp = 2 s
tr = 0.35 ns

IF = 10 mA
VR = 6 V
RL = 100

DEVICE MARKING EXAMPLE


Marking Symbol
Type No.

151WA

152WA

Symbol

MN

MO

MNX

The X represents a smaller alpha digit Date Code. The Date Code
indicates the actual month in which the part was manufactured.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

575

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Common Cathode Silicon


Dual Switching Diodes

M1MA151WKT1
M1MA152WKT1

These Common Cathode Silicon Epitaxial Planar Dual Diodes are designed for use
in ultra high speed switching applications. These devices are housed in the SC59
package which is designed for low power surface mount applications.
Fast trr, < 3.0 ns

SC59 PACKAGE
COMMON CATHODE
DUAL SWITCHING DIODES
40/80 V100 mA
SURFACE MOUNT

Low CD, < 2.0 pF


Available in 8 mm Tape and Reel
Use M1MA151/2WKT1 to order the 7 inch/3000 unit reel.
Use M1MA151/2WKT3 to order the 13 inch/10,000 unit reel.

Motorola Preferred Devices

CATHODE
3

3
2

ANODE

MAXIMUM RATINGS (TA = 25C)


Rating
Reverse Voltage

M1MA151WKT1

Symbol

Value

Unit

VR

40

Vdc

M1MA152WKT1
Peak Reverse Voltage

M1MA151WKT1

80
VRM

40

IF

100

M1MA152WKT1
Forward Current

Single

mAdc

150
IFM

Single

mAdc

225

Dual
Peak Forward Surge Current

Vdc

80

Dual
Peak Forward Current

CASE 318D03, STYLE 3


SC59

340
IFSM(1)

Single

mAdc

500

Dual

750

THERMAL CHARACTERISTICS
Rating
Power Dissipation

Symbol

Max

Unit

PD

200

mW

Junction Temperature

TJ

150

Storage Temperature

Tstg

55 to + 150

ELECTRICAL CHARACTERISTICS (TA = 25C)


Characteristic
Reverse Voltage Leakage Current

M1MA151WKT1

Symbol

Condition

Min

Max

Unit

IR

VR = 35 V

0.1

Adc

VR = 75 V

0.1

VF

IF = 100 mA

1.2

Vdc

VR

IR = 100 A

40

Vdc

80

M1MA152WKT1
Forward Voltage
Reverse Breakdown Voltage

M1MA151WKT1
M1MA152WKT1

Diode Capacitance
Reverse Recovery Time

CD

VR = 0, f = 1.0 MHz

2.0

pF

trr(2)

IF = 10 mA, VR = 6.0 V,
RL = 100 , Irr = 0.1 IR

3.0

ns

1. t = 1 SEC
2. trr Test Circuit
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

576

Motorola SmallSignal Transistors, FETs and Diodes Device Data

M1MA151WKT1 M1MA152WKT1
RECOVERY TIME EQUIVALENT TEST CIRCUIT

INPUT PULSE
tr

OUTPUT PULSE

tp

trr
IF

t
10%

RL

Irr = 0.1 IR
90%
VR

tp = 2 s
tr = 0.35 ns

IF = 10 mA
VR = 6 V
RL = 100

DEVICE MARKING EXAMPLE


Marking Symbol
Type No.

151WK

152WK

Symbol

MT

MU

MTX

The X represents a smaller alpha digit Date Code. The Date Code
indicates the actual month in which the part was manufactured.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

577

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MBD54DWT1

Preliminary Information

Dual Schottky Barrier Diodes

Motorola Preferred Device

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.

30 VOLTS
DUAL HOTCARRIER
DETECTOR AND SWITCHING
DIODES

Extremely Fast Switching Speed


Low Forward Voltage 0.35 V @ IF = 10 mAdc
Anode 1

6 Cathode

N/C 2

5 N/C

Cathode 3

4 Anode

CASE 419B 01, STYLE 6


SOT 363

MAXIMUM RATINGS (TJ = 125C unless otherwise noted)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

30

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
150
1.2

mW
mW/C

Operating Junction
Temperature Range

TJ

C
55 to +150

Storage Temperature Range

Tstg

55 to +150

DEVICE MARKING
MBD54DWT1 = BL

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic
Reverse Breakdown Voltage (IR = 10 A)

Symbol

Min

Typ

Max

Unit

V(BR)R

30

Volts

Total Capacitance (VR = 1.0 V, f = 1.0 MHz)

CT

7.6

10

pF

Reverse Leakage (VR = 25 V)

IR

0.5

2.0

Adc

Forward Voltage (IF = 0.1 mAdc)

VF

0.22

0.24

Vdc

Forward Voltage (IF = 30 mAdc)

VF

0.41

0.5

Vdc

Forward Voltage (IF = 100 mAdc)

VF

0.52

1.0

Vdc

Reverse Recovery Time


(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) Figure 1

trr

5.0

ns

Forward Voltage (IF = 1.0 mAdc)

VF

0.29

0.32

Vdc

Forward Voltage (IF = 10 mAdc)

VF

0.35

0.40

Vdc

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

578

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MBD54DWT1
820
+10 V

2k

0.1 F

tr

IF

100 H

tp

0.1 F

IF

trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit


100

1000
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C

1 50C

10

1 25C
1.0
85C
25C

0.1
0.0

40C

100
TA = 125C
10
1.0
TA = 85C
0.1
0.01

55C

TA = 25C
0.001

0.1

0.2

0.3

0.4

0.5

0.6

VF, FORWARD VOLTAGE (VOLTS)

Figure 2. Forward Voltage

10
15
20
VR, REVERSE VOLTAGE (VOLTS)

25

30

Figure 3. Leakage Current

C T , TOTAL CAPACITANCE (pF)

14
12
10
8
6
4
2
0

10

15

20

25

30

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Total Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

579

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MBD101
MMBD101LT1

Schottky Barrier Diodes

Designed primarily for UHF mixer applications but suitable also for use in detector
and ultrafast switching circuits. Supplied in an inexpensive plastic package for
lowcost, highvolume consumer requirements. Also available in Surface Mount
package.

Motorola Preferred Devices

Low Noise Figure 6.0 dB Typ @ 1.0 GHz

SILICON SCHOTTKY
BARRIER DIODES

Very Low Capacitance Less Than 1.0 pF @ Zero Volts


High Forward Conductance 0.5 Volts (Typ) @ IF = 10 mA

2
CATHODE

1
ANODE
1
2

3
CATHODE

CASE 182 02, STYLE 1


(TO226AC)

1
ANODE

MAXIMUM RATINGS
MBD101
Rating

MMBD101LT1

Symbol

Value

Unit

Reverse Voltage

VR

7.0

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF

Junction Temperature

TJ

+150

Tstg

55 to +150

280
2.2

Storage Temperature Range

225
1.8

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

mW
mW/C

DEVICE MARKING
MMBD101LT1 = 4M

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

7.0

10

Volts

Diode Capacitance
(VR = 0, f = 1.0 MHz, Note 1)
Forward Voltage(1)
(IF = 10 mAdc)

CT

0.88

1.0

pF

VF

0.5

0.6

Volts

Reverse Leakage
(VR = 3.0 Vdc)

IR

0.02

0.25

Adc

Reverse Breakdown Voltage


(IR = 10 Adc)

NOTE: MMBD101LT1 is also available in bulk packaging. Use MMBD101L as the device title to order this device in bulk.

Preferred devices are Motorola recommended choices for future use and best overall value.

580

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MBD101 MMBD101LT1
TYPICAL CHARACTERISTICS
(TA = 25C unless noted)
100

0.5

IF, FORWARD CURRENT (mA)

IR, REVERSE LEAKAGE (m A)

1.0
0.7
VR = 3.0 Vdc

0.2
0.1
0.07
0.05

TA = 85C
10

TA = 40C
1.0

TA = 25C

0.02
0.01

0.1
30

40

50

60
70
80
90 100 110
TA, AMBIENT TEMPERATURE (C)

120

0.3

130

0.4

Figure 2. Forward Voltage

Figure 1. Reverse Leakage

1.0

11
10

LOCAL OSCILLATOR FREQUENCY = 1.0 GHz


(TEST CIRCUIT IN FIGURE 5)

9.0

0.9

NF, NOISE FIGURE (dB)

C, CAPACITANCE (pF)

0.5
0.6
0.7
VF, FORWARD VOLTAGE (VOLTS)

0.8

0.7

8.0
7.0
6.0
5.0
4.0
3.0
2.0

0.6

1.0

2.0

3.0

4.0

1.0

0.1

0.2

0.5

1.0

2.0

VR, REVERSE VOLTAGE (VOLTS)

PLO, LOCAL OSCILLATOR POWER (mW)

Figure 3. Capacitance

Figure 4. Noise Figure

LOCAL
OSCILLATOR

UHF
NOISE SOURCE
H.P. 349A

DIODE IN
TUNED
MOUNT

NOISE
FIGURE METER
H.P. 342A

IF AMPLIFIER
NF = 1.5 dB
f = 30 MHz

5.0

10

NOTES ON TESTING AND SPECIFICATIONS


Note 1 CC and CT are measured using a capacitance bridge
(Boonton Electronics Model 75A or equivalent).
Note 2 Noise figure measured with diode under test in tuned
diode mount using UHF noise source and local
oscillator (LO) frequency of 1.0 GHz. The LO power
is adjusted for 1.0 mW. IF amplifier NF = 1.5 dB, f =
30 MHz, see Figure 5.
Note 3 LS is measured on a package having a short instead
of a die, using an impedance bridge (Boonton Radio
Model 250A RX Meter).

Figure 5. Noise Figure Test Circuit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

581

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MBD110DWT1
MBD330DWT1
MBD770DWT1

Dual Schottky Barrier Diodes


Application circuit designs are moving toward the consolidation of device count and
into smaller packages. The new SOT363 package is a solution which simplifies
circuit design, reduces device count, and reduces board space by putting two discrete
devices in one small sixleaded package. The SOT363 is ideal for lowpower
surface mount applications where board space is at a premium, such as portable
products.

Motorola Preferred Devices

Surface Mount Comparisons:

SOT363
Area (mm2)
Max Package PD (mW)
Device Count

4.6
120
2

Space Savings:
Package

SOT363

 SOT23
40%

SOT23

CASE 419B01, STYLE 6


SOT363

7.6
225
1

 SOT23

Anode 1

70%

N/C 2

The MBD110DW, MBD330DW, and MBD770DW devices are spinoffs of our


popular MMBD101LT1, MMBD301LT1, and MMBD701LT1 SOT23 devices. They
are designed for highefficiency UHF and VHF detector applications. Readily
available to many other fast switching RF and digital applications.

Cathode 3

6 Cathode
5 N/C
4 Anode

Extremely Low Minority Carrier Lifetime


Very Low Capacitance
Low Reverse Leakage

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VR

7.0
30
70

Vdc

Forward Power Dissipation


TA = 25C

PF

120

mW

Junction Temperature

TJ

55 to +125

Tstg

55 to +150

Reverse Voltage

MBD110DWT1
MBD330DWT1
MBD770DWT1

Storage Temperature Range

DEVICE MARKING
MBD110DWT1 = M4
MBD330DWT1 = T4
MBD770DWT1 = H5

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

582

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MBD110DWT1 MBD330DWT1 MBD770DWT1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic
Reverse Breakdown Voltage
(IR = 10 A)

Symbol

Typ

Max

7.0
30
70

10

0.88

1.0

0.9
0.5

1.5
1.0

0.02
13
9.0

0.25
200
200

6.0

0.5
0.38
0.52
0.42
0.7

0.6
0.45
0.6
0.5
1.0

V(BR)R
MBD110DWT1
MBD330DWT1
MBD770DWT1

Diode Capacitance
(VR = 0, f = 1.0 MHz, Note 1)

MBD110DWT1

Total Capacitance
(VR = 15 Volts, f = 1.0 MHz)
(VR = 20 Volts, f = 1.0 MHz)

MBD330DWT1
MBD770DWT1

Reverse Leakage
(VR = 3.0 V)
(VR = 25 V)
(VR = 35 V)

MBD110DWT1
MBD330DWT1
MBD770DWT1

Noise Figure
(f = 1.0 GHz, Note 2)

MBD110DWT1

Forward Voltage
(IF = 10 mA)
(IF = 1.0 mAdc)
(IF = 10 mA)
(IF = 1.0 mAdc)
(IF = 10 mA)

Min

Volts

CT

pF

CT

pF

IR

NF

MBD770DWT1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

A
nAdc
nAdc
dB

VF
MBD110DWT1
MBD330DWT1

Unit

Vdc

583

MBD110DWT1 MBD330DWT1 MBD770DWT1


TYPICAL CHARACTERISTICS
MBD110DWT1
100

IF, FORWARD CURRENT (mA)

IR, REVERSE LEAKAGE (m A)

1.0
0.7
0.5
VR = 3.0 Vdc
0.2
0.1
0.07
0.05

10
TA = 85C

TA = 40C

1.0

0.02

TA = 25C

MBD110DWT1
0.01

30

40

50

60
70
80
90 100 110
TA, AMBIENT TEMPERATURE (C)

120

MBD110DWT1
0.1
0.3

130

0.4

Figure 1. Reverse Leakage

0.8

11
LOCAL OSCILLATOR FREQUENCY = 1.0 GHz
(Test Circuit Figure 5)

10
9

0.9

NF, NOISE FIGURE (dB)

C, CAPACITANCE (pF)

0.7

Figure 2. Forward Voltage

1.0

0.8

0.7

8
7
6
5
4
3
2

MBD110DWT1
0.6

0.5
0.6
VF, FORWARD VOLTAGE (VOLTS)

1.0
2.0
3.0
VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Capacitance

4.0

1
0.1

MBD110DWT1
0.2

0.5
1.0
2.0
5.0
PLO, LOCAL OSCILLATOR POWER (mW)

10

Figure 4. Noise Figure

LOCAL
OSCILLATOR

UHF
NOISE SOURCE
H.P. 349A

DIODE IN
TUNED
MOUNT

NOISE
FIGURE METER
H.P. 342A

IF AMPLIFIER
NF = 1.5 dB
f = 30 MHz

NOTES ON TESTING AND SPECIFICATIONS


Note 1 CC and CT are measured using a capacitance
bridge (Boonton Electronics Model 75A or equivalent).
Note 2 Noise figure measured with diode under test in
tuned diode mount using UHF noise source and local oscillator (LO) frequency of 1.0 GHz. The LO
power is adjusted for 1.0 mW. IF amplifier NF = 1.5
dB, f = 30 MHz, see Figure 5.
Note 3 LS is measured on a package having a short instead
of a die, using an impedance bridge (Boonton Radio
Model 250A RX Meter).

Figure 5. Noise Figure Test Circuit

584

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MBD110DWT1 MBD330DWT1 MBD770DWT1


TYPICAL CHARACTERISTICS
MBD330DWT1
2.8

500

t , MINORITY CARRIER LIFETIME (ps)

CT, TOTAL CAPACITANCE (pF)

MBD330DWT1
f = 1.0 MHz

2.4
2.0
1.6
1.2
0.8
0.4
0

MBD330DWT1
400
KRAKAUER METHOD
300

200

100

0
0

3.0

6.0

9.0
12
15
18
21
VR, REVERSE VOLTAGE (VOLTS)

24

27

30

Figure 6. Total Capacitance

20

40
60
30
50
70
IF, FORWARD CURRENT (mA)

80

90

100

Figure 7. Minority Carrier Lifetime

10

100
MBD330DWT1
IF, FORWARD CURRENT (mA)

MBD330DWT1
IR, REVERSE LEAKAGE ( m A)

10

TA = 100C

1.0

TA = 75C
0.1

TA = 85C

1.0

TA = 25C

0.01

TA = 40C
10

0.001

TA = 25C

0.1
0

6.0

12
18
VR, REVERSE VOLTAGE (VOLTS)

24

30

Figure 8. Reverse Leakage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.2

0.4

0.6
0.8
VF, FORWARD VOLTAGE (VOLTS)

1.0

1.2

Figure 9. Forward Voltage

585

MBD110DWT1 MBD330DWT1 MBD770DWT1


TYPICAL CHARACTERISTICS
MBD770DWT1
2.0

500

t , MINORITY CARRIER LIFETIME (ps)

CT, TOTAL CAPACITANCE (pF)

MBD770DWT1
f = 1.0 MHz
1.6

1.2

0.8

0.4

MBD770DWT1
400
KRAKAUER METHOD
300

200

100

0
0

5.0

10

15
20
25
30
35
VR, REVERSE VOLTAGE (VOLTS)

40

45

50

10

Figure 10. Total Capacitance

30
50
70
40
60
IF, FORWARD CURRENT (mA)

80

90

100

Figure 11. Minority Carrier Lifetime

10

100
MBD770DWT1

MBD770DWT1
IF, FORWARD CURRENT (mA)

IR, REVERSE LEAKAGE ( m A)

20

TA = 100C

1.0

TA = 75C
0.1

10
TA = 85C

TA = 40C

1.0

0.01

TA = 25C

0.001

0.1
0

10

20
30
VR, REVERSE VOLTAGE (VOLTS)

Figure 12. Reverse Leakage

586

TA = 25C

40

50

0.2

0.4

0.8
1.2
VF, FORWARD VOLTAGE (VOLTS)

1.6

2.0

Figure 13. Forward Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MBD301
MMBD301LT1

Silicon Hot-Carrier Diodes


Schottky Barrier Diodes

Motorola Preferred Devices

These devices are designed primarily for highefficiency UHF and VHF detector
applications. They are readily adaptable to many other fast switching RF and digital
applications. They are supplied in an inexpensive plastic package for lowcost,
highvolume consumer and industrial/commercial requirements. They are also
available in a Surface Mount package.

30 VOLTS
SILICON HOTCARRIER
DETECTOR AND SWITCHING
DIODES

Extremely Low Minority Carrier Lifetime 15 ps (Typ)


Very Low Capacitance 1.5 pF (Max) @ VR = 15 V
Low Reverse Leakage IR = 13 nAdc (Typ) MBD301, MMBD301

1
2

CASE 182 02, STYLE 1


(TO226AC)

MAXIMUM RATINGS (TJ = 125C unless otherwise noted)


MBD301
Rating

MMBD301LT1

Symbol

Value

Unit

Reverse Voltage

VR

30

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF

Operating Junction
Temperature Range

TJ

280
2.8

200
2.0

2
CATHODE

mW
mW/C

C
55 to +125

Storage Temperature Range

Tstg

1
ANODE

1
2

55 to +150

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

DEVICE MARKING
MMBD301LT1 = 4T

3
CATHODE

1
ANODE

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

V(BR)R

30

Volts

Total Capacitance (VR = 15 V, f = 1.0 MHz) Figure 1

CT

0.9

1.5

pF

Reverse Leakage (VR = 25 V) Figure 3

IR

13

200

nAdc

Forward Voltage (IF = 1.0 mAdc) Figure 4

VF

0.38

0.45

Vdc

Forward Voltage (IF = 10 mAdc) Figure 4

VF

0.52

0.6

Vdc

Characteristic
Reverse Breakdown Voltage (IR = 10 A)

NOTE: MMBD301LT1 is also available in bulk packaging. Use MMBD301L as the device title to order this device in bulk.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

587

MBD301 MMBD301LT1
TYPICAL ELECTRICAL CHARACTERISTICS
500

2.8

t , MINORITY CARRIER LIFETIME (ps)

C T, TOTAL CAPACITANCE (pF)

f = 1.0 MHz
2.4

400

2.0

KRAKAUER METHOD

300

1.6
1.2

200

0.8

100

0.4

0
0

3.0

6.0

9.0
12
15
18
21
VR, REVERSE VOLTAGE (VOLTS)

24

27

30

Figure 1. Total Capacitance

30
40
50
60
70
IF, FORWARD CURRENT (mA)

80

90

100

100

IF, FORWARD CURRENT (mA)

IR, REVERSE LEAKAGE (m A)

20

Figure 2. Minority Carrier Lifetime

10

TA = 100C

1.0

75C

0.1

25C

0.01

0.001

10

10
TA = 40C

TA = 85C

1.0
TA = 25C

0.1
0

6.0

12
18
VR, REVERSE VOLTAGE (VOLTS)

24

0.2

30

Figure 3. Reverse Leakage

IF(PEAK)

0.4

0.6
0.8
VF, FORWARD VOLTAGE (VOLTS)

1.0

1.2

Figure 4. Forward Voltage

CAPACITIVE
CONDUCTION

IR(PEAK)
FORWARD
CONDUCTION

SINUSOIDAL
GENERATOR

BALLAST
NETWORK
(PADS)

STORAGE
CONDUCTION

PADS
DUT

SAMPLING
OSCILLOSCOPE
(50 INPUT)

Figure 5. Krakauer Method of Measuring Lifetime

588

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MBD701
MMBD701LT1

Silicon Hot-Carrier Diodes


Schottky Barrier Diodes

Motorola Preferred Devices

These devices are designed primarily for highefficiency UHF and VHF detector
applications. They are readily adaptable to many other fast switching RF and digital
applications. They are supplied in an inexpensive plastic package for lowcost,
highvolume consumer and industrial/commercial requirements. They are also
available in a Surface Mount package.

70 VOLTS
HIGHVOLTAGE
SILICON HOT CARRIER
DETECTOR AND SWITCHING
DIODES

Extremely Low Minority Carrier Lifetime 15 ps (Typ)


Very Low Capacitance 1.0 pF @ VR = 20 V
High Reverse Voltage to 70 Volts
Low Reverse Leakage 200 nA (Max)

1
2

CASE 182 02, STYLE 1


(TO226AC)

MAXIMUM RATINGS (TJ = 125C unless otherwise noted)


MBD701
Rating

MMBD701LT1

Symbol

Value

Unit

Reverse Voltage

VR

70

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF

Operating Junction
Temperature Range

TJ

280
2.8

200
2.0

2
CATHODE

mW
mW/C

55 to +125

Storage Temperature Range

Tstg

1
ANODE

55 to +150

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

DEVICE MARKING
MMBD701LT1 = 5H

3
CATHODE

1
ANODE

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

Reverse Breakdown Voltage (IR = 10 Adc)

V(BR)R

70

Volts

Total Capacitance (VR = 20 V, f = 1.0 MHz) Figure 1

CT

0.5

1.0

pF

Reverse Leakage (VR = 35 V) Figure 3

IR

9.0

200

nAdc

Forward Voltage (IF = 1.0 mAdc) Figure 4

VF

0.42

0.5

Vdc

Forward Voltage (IF = 10 mAdc) Figure 4

VF

0.7

1.0

Vdc

NOTE: MMBD701LT1 is also available in bulk packaging. Use MMBD701L as the device title to order this device in bulk.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

589

MBD701 MMBD701LT1
TYPICAL ELECTRICAL CHARACTERISTICS
500

2.0

t , MINORITY CARRIER LIFETIME (ps)

C T, TOTAL CAPACITANCE (pF)

f = 1.0 MHz

400

1.6

KRAKAUER METHOD

300

1.2

0.8

200

0.4

100

0
0

5.0

10

15
20
25
30
35
VR, REVERSE VOLTAGE (VOLTS)

40

45

50

10

Figure 1. Total Capacitance

80

90

100

100

IF, FORWARD CURRENT (mA)

IR, REVERSE LEAKAGE (m A)

30
40
50
60
70
IF, FORWARD CURRENT (mA)

Figure 2. Minority Carrier Lifetime

10

TA = 100C

1.0

TA = 75C

0.1

0.01

0.001

20

TA = 25C

10
TA = 40C

TA = 85C

1.0
TA = 25C

0.1
0

10

20
30
VR, REVERSE VOLTAGE (VOLTS)

40

50

Figure 3. Reverse Leakage

IF(PEAK)

0.2

0.4

0.8
1.2
VF, FORWARD VOLTAGE (VOLTS)

1.6

2.0

Figure 4. Forward Voltage

CAPACITIVE
CONDUCTION

IR(PEAK)
FORWARD
CONDUCTION

SINUSOIDAL
GENERATOR

BALLAST
NETWORK
(PADS)

STORAGE
CONDUCTION

PADS
DUT

SAMPLING
OSCILLOSCOPE
(50 INPUT)

Figure 5. Krakauer Method of Measuring Lifetime

590

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MBV109T1
MMBV109LT1*
MV209*

Silicon Epicap Diodes


Designed for general frequency control and tuning applications; providing
solidstate reliability in replacement of mechnaical tuning methods.

* Motorola Preferred Devices

High Q with Guaranteed Minimum Values at VHF Frequencies


Controlled and Uniform Tuning Ratio

2632 pF
VOLTAGE VARIABLE
CAPACITANCE DIODES

Available in Surface Mount Package


3
1
Cathode
Anode
SC70/SOT323
3
Cathode

1
Anode

1
2

SOT23
2
Cathode

TO92

CASE 41902, STYLE 3


SC70/SOT323

1
Anode

3
1
2

MAXIMUM RATINGS
Rating

Symbol

Reverse Voltage

MBV109T1

MMBV109LT1

MV209

VR

30

Vdc

Forward Current

IF

200

mAdc

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PD

Junction Temperature

TJ

+125

Tstg

55 to +150

Storage Temperature Range

280
2.8

200
2.0

200
1.6

CASE 318 08, STYLE 6


SOT 23 (TO 236AB)

Unit

mW
mW/C

1
2

CASE 18202, STYLE 1


TO92 (TO226AC)

DEVICE MARKING
MBV109T1 = J4A, MMBV109LT1 = M4A, MV209 = MV209

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted.)


Characteristic
Reverse Breakdown Voltage (IR = 10 Adc)

Symbol

Min

Typ

Max

Unit

V(BR)R

30

Vdc

IR

0.1

Adc

TCC

300

ppm/C

Reverse Voltage Leakage Current (VR = 25 Vdc)


Diode Capacitance Temperature Coefficient
(VR = 3.0 Vdc, f = 1.0 MHz)

Ct, Diode Capacitance


VR = 3.0 Vdc, f = 1.0 MHz
pF

Q, Figure of Merit
VR = 3.0 Vdc
f = 50 MHz

CR, Capacitance Ratio


C3/C25
f = 1.0 MHz (Note 1)

Device

Min

Nom

Max

Min

Min

Max

MBV109T1, MMBV109LT1, MV209

26

29

32

200

5.0

6.5

1. CR is the ratio of Ct measured at 3 Vdc divided by Ct measured at 25 Vdc.


MMBV109LT1 is also available in bulk packaging. Use MMBV109L as the device title to order this device in bulk.
Preferred devices are Motorola recommended choices for future use and best overall value.

(Replaces MMBV109LT1/D)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

591

MBV109T1 MMBV109LT1 MV209


40

1000

36
Q, FIGURE OF MERIT

CT , CAPACITANCE pF

32
28
24
20
16
12

VR = 3 Vdc
TA = 25C
100

f = 1.0 MHz
TA = 25C

8
4
0

10

30

Figure 1. DIODE CAPACITANCE

Figure 2. FIGURE OF MERIT

C t , DIODE CAPACITANCE (NORMALIZED)

I R , REVERSE CURRENT (nA)

1000

f, FREQUENCY (MHz)

20
10
6.0
VR = 20 Vdc

2.0
1.0
0.6
0.2
0.1
0.06

0.02
0.01
0.006
40

100

10

VR, REVERSE VOLTAGE (VOLTS)

100
60

0.002
0.001
60

10

100

20

+20

+40

+60

+80 +100 +120 +140

1.04
1.03
1.02

VR = 3.0 Vdc
f = 1.0 MHz
Ct Cc + Cj

1.01
1.00
0.99
0.98
0.97
0.96
75

50

25

+25

+50

+75

TA, AMBIENT TEMPERATURE

TA, AMBIENT TEMPERATURE

Figure 3. LEAKAGE CURRENT

Figure 4. DIODE CAPACITANCE

+100

+125

NOTES ON TESTING AND SPECIFICATIONS


1. CR is the ratio of Ct measured at 3.0 Vdc divided by Ct measured at 25 Vdc.

592

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMAD130
MMAD1103
MMAD1105
MMAD1107
MMAD1109

Monolithic Diode Arrays


Surface Mount Diode Arrays

These diode arrays are multiple diode junctions fabricated by a planar process and
mounted in integrated circuit packages for use in highcurrent, fastswitching
coredriver applications. These arrays offer many of the advantages of integrated
circuits such as highdensity packaging and improved reliability. These advantages
result from such factors as fewer glasstometal seals.
Designed for Use in Computers and Peripheral Equipment
Applications Include:
Magnetic Cores
ThinFilm Memories
PlatedWire Memories
Decoding or Encoding Applications

14

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VRM

50

Vdc

SteadyState Reverse Voltage

VR

50

Vdc

Peak Forward Current 25C

IFM

500

mAdc

Continuous Forward Current

IF

400

mAdc

Power Dissipation
Derating Factor

PD

500
4.0

mW
mW/C

Operating Temperature

TA

65 to +150

Tstg

65 to +150

Peak Reverse Voltage

Storage Temperature Range

CASE 751A03
SO14

SO14 PIN DIAGRAM


1

Dual 10 Diode Array

16 Diode Array
3

11

10 13 14

12

2
2

11 12

14
NC Pin 4, 6, 10, 13
MMAD1103

MMAD130

8 Diode Array
(Common Cathode)

Dual 8 Diode Array


8

14

5
2

NC Pin 1, 4, 6, 10, 13
MMAD1105

7 Diode Array
(Independent)

11 12
7

11

12

14

10
7

NC Pin 6, 13
MMAD1107

10 11 12 13

14

MMAD1109

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

593

MMAD130 MMAD1103 MMAD1105 MMAD1107 MMAD1109


Device

Description

Diagram

MMAD130

Dual 10 Diode Array

MMAD1103

16 Diode Array

MMAD1105

8 Diode Array Common Cathode

MMAD1107

Dual 8 Diode Array

MMAD1109

7 Diode Array

ELECTRICAL CHARACTERISTICS (@ 25C FreeAir Temperature)


Limit
Characteristic

Symbol

Reverse Breakdown Voltage(1)


(IR = 10 Adc)

Min

Max

50

0.1

1.2
1.6

5.0

V(BR)

Static Reverse Current


(VR = 40 Vdc)

IR

Static Forward Voltage


(IF = 100 mAdc)
(IF = 500 mAdc)(2)

VF

Peak Forward Voltage(3)


(IF = 500 mAdc)

Unit
Vdc
Adc
Vdc

VFM

Vdc

SWITCHING CHARACTERISTICS (@ 25C FreeAir Temperature)


Characteristic
Forward Recovery Time
(IF = 500 mAdc)
Reverse Recovery Time
(IF = 200 mA, IRM = 200 mA, RL = 100

W, irr = 20 mA)

Symbol

Typical Value

Unit

tfr

20

ns

trr

8.0

ns

NOTES:
1. This parameter must be measured using pulse techniques. PW = 100 s, duty cycle 20%.
2. This parameter is measured using pulse techniques. PW = 300 s, duty cycle 2.0%. Read time is 90 s from the leading edge of the
pulse.
3. The initial instantaneous value is measured using pulse techniques. PW = 150 ns, duty cycle 2.0%, pulse rise time 10 ns. The total
capacitance shunting the diode is 19 pF maximum and the equipment bandwidth is 80 MHz.

IF, FORWARD CURRENT (mA)

1000

100
TA = +25C
10

1.0

0.1

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

VF, FORWARD VOLTAGE (VOLTS)

Figure 1. Typical Characteristics Static


Forward Voltage

594

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMAD130 MMAD1103 MMAD1105 MMAD1107 MMAD1109


TEST PROCEDURE FOR MULTIPLE DIODES
1.0. REVERSE BIAS TESTING

1.1. LEAKAGE
Regardless of device configuration type, when testing any
reverse bias condition, the forcing power supply must be applied only to the uncommon terminal of the pair. As in Figure
1, this would be pins 1 and 14. This can be referred as the
high side of the test circuit. The low side of the test circuit
must be connected to the common terminal of the pair which
in most testers is where the current measurement is taken.
This method is used to eliminate the possibility of degrading
the diode in that pair which is not under test. Diode arrays
with multiple pairs such as the MMAD1103, also have leakage paths in the die between common terminals of the pairs.
To isolate the device under test so that the leakage from the
other pairs in the package do not affect the test result, the
leakage current from the common terminals of the pairs not
under test must be shunted to measurement common.
Figure 1 shows the test configuration for both of these cases.

VR

11

12

14

IF

11

12

11

12

Vmeas
14

IF
+
Vmeas
14

Figure 2
2.1. KELVIN CONNECTION
To achieve the best possible accuracy when testing bias
currents over 10 mA, Kelvin connection to the leads of the
device under test is mandatory. True Kelvin connection dictates that two test connections are made directly to the leads
of the device. One is for power which is the bias supply, and
the other is for sense which is for the measurement circuit.
Kelvin connections are used to eliminate the effects of the
connection resistance between the lead of the device and
the contacts of the test handler and/or hand fixture. Figure 3
is an example of Kelvin connection.

BIAS
A

VR

11

12

TEST
HI

TEST
LO
MEAS

14

Figure 1
Figure 3
1.2. BREAKDOWN
It is not recommended to test breakdown on these devices
due to the possibility of degrading the device. Breakdown
may be checked on a curve tracer but extreme caution
should be used.

2.2. PULSE TESTING


When testing bias currents over 10 mA, pulse testing
should be used to minimize thermal drift of the measured value. The pulse width of a pulse test is approximately 300 s to
380 s.

2.0. FORWARD BIAS TESTING


Diode arrays are designed with the pairs in parallel; therefore, care must be taken to prevent the other diodes in the
array from affecting the measured value of the diode under
test. Figure 2 illustrates the proper technique to measure
only the correct value of the diode under test.

3.0. TESTING PROTOCOL


3.1. TEST TYPES
When testing in sequence all of the electrical characteristics, all reverse bias conditions should be tested before the
forward bias conditions are tested.
3.2. BIASING MAGNITUDES
Tests of the same test type should be grouped together
with the bias conditions in ascending order. For example:
VF @ 10 mA < 0.6 V
VF @ 50 mA < 0.8 V
VF @ 100 mA < 1 V
VF @ 500 mA < 1.5 V

Motorola SmallSignal Transistors, FETs and Diodes Device Data

595

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Monolithic Diode Array

MMAD1108

Surface Mount Isolated 8Diode Array


This diode array is a multiple diode junction fabricated by a planar process and
mounted in integrated circuit packages for use in highcurrent, fastswitching
coredriver applications. This array offers the advantages of an integrated circuit with
highdensity packaging and improved reliability. This advantage results from such
factors as fewer connections, more uniform device parameters, smaller size, less
weight and fewer glasstometal seals.

Motorola Preferred Device

Designed for use in Computers and Peripheral Equipment


Applications Include:
Magnetic Cores
ThinFilm Memories
PlatedWire Memories
Decoding or Encoding

16
1

CASE 751B05
SO16

MAXIMUM RATINGS
Rating

PIN CONNECTION DIAGRAM


Symbol

Value

Unit

VRM

50

Vdc

Peak Reverse Voltage


SteadyState Reverse Voltage

VR

50

Vdc

Peak Forward Current 25C

IFM

500

mAdc

Continuous Forward Current

IF

400

mAdc

Power Dissipation
Derating Factor

PD

500
4.0

mW
mW/C

Operating Temperature

TA

65 to +150

Tstg

65 to +150

Storage Temperature Range

16

15 14 13 12 11 10

ELECTRICAL CHARACTERISTICS (@ 25C FreeAir Temperature)


Limit
Characteristic

Symbol

Min

Max

Unit

V(BR)

50

Vdc

Static Reverse Current


(VR = 40 Vdc)

IR

0.1

Adc

Static Forward Voltage


(IF = 100 mAdc)
(IF = 500 mAdc)(2)

VF

1.2
1.6

5.0

Reverse Breakdown Voltage(1)


(IR = 10 Adc)

Peak Forward Voltage(3)


(IF = 500 mAdc)

VFM

Vdc

Vdc

NOTES:
1. This parameter must be measured using pulse techniques. PW = 100 s, duty cycle 20%.
2. This parameter is measured using pulse techniques. PW = 300 s, duty cycle 2.0%. Read time is 90 s from the leading edge of the
pulse.
3. The initial instantaneous value is measured using pulse techniques. PW = 150 ns, duty cycle 2.0%, pulse rise time 10 ns. The total
capacitance shunting the diode is 19 pF maximum and the equipment bandwidth is 80 MHz.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

596

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMAD1108
ELECTRICAL CHARACTERISTICS (@ 25C FreeAir Temperature) (Continued)
Characteristic

Symbol

Typical Value

Unit

tfr

20

ns

trr

8.0

ns

SWITCHING CHARACTERISTICS (@ 25C FreeAir Temperature)


Forward Recovery Time
(IF = 500 mAdc)
Reverse Recovery Time
(IF = 200 mA, IRM = 200 mA, RL = 100

W, irr = 20 mA)

IF, FORWARD CURRENT (mA)

1000

100
TA = +25C
10

1.0

0.1

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

VF, FORWARD VOLTAGE (VOLTS)

Figure 1. Typical Characteristics Static


Forward Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

597

MMAD1108
TEST PROCEDURE FOR MULTIPLE DIODES
1.0. REVERSE BIAS TESTING

1.1. LEAKAGE
Regardless of device configuration type, when testing any
reverse bias condition, the forcing power supply must be applied only to the uncommon terminal of the pair. As in Figure
1, this would be pins 1 and 14. This can be referred as the
high side of the test circuit. The low side of the test circuit
must be connected to the common terminal of the pair which
in most testers is where the current measurement is taken.
This method is used to eliminate the possibility of degrading
the diode in that pair which is not under test. Diode arrays
with multiple pairs such as the MMAD1103, also have leakage paths in the die between common terminals of the pairs.
To isolate the device under test so that the leakage from the
other pairs in the package do not affect the test result, the
leakage current from the common terminals of the pairs not
under test must be shunted to measurement common.
Figure 1 shows the test configuration for both of these cases.

VR

11

12

14

IF

11

12

11

12

Vmeas
14

IF
+
Vmeas
14

Figure 2
2.1. KELVIN CONNECTION
To achieve the best possible accuracy when testing bias
currents over 10 mA, Kelvin connection to the leads of the
device under test is mandatory. True Kelvin connection dictates that two test connections are made directly to the leads
of the device. One is for power which is the bias supply, and
the other is for sense which is for the measurement circuit.
Kelvin connections are used to eliminate the effects of the
connection resistance between the lead of the device and
the contacts of the test handler and/or hand fixture. Figure 3
is an example of Kelvin connection.

BIAS
A

VR

11

12

TEST
HI

TEST
LO
MEAS

14

Figure 1
Figure 3
1.2. BREAKDOWN
It is not recommended to test breakdown on these devices
due to the possibility of degrading the device. Breakdown
may be checked on a curve tracer but extreme caution
should be used.

2.2. PULSE TESTING


When testing bias currents over 10 mA, pulse testing
should be used to minimize thermal drift of the measured value. The pulse width of a pulse test is approximately 300 s to
380 s.

2.0. FORWARD BIAS TESTING


Diode arrays are designed with the pairs in parallel; therefore, care must be taken to prevent the other diodes in the
array from affecting the measured value of the diode under
test. Figure 2 illustrates the proper technique to measure
only the correct value of the diode under test.

3.0. TESTING PROTOCOL


3.1. TEST TYPES
When testing in sequence all of the electrical characteristics, all reverse bias conditions should be tested before the
forward bias conditions are tested.
3.2. BIASING MAGNITUDES
Tests of the same test type should be grouped together
with the bias conditions in ascending order. For example:
VF @ 10 mA < 0.6 V
VF @ 50 mA < 0.8 V
VF @ 100 mA < 1 V
VF @ 500 mA < 1.5 V

598

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Hot Carrier Mixer Diodes


These devices are designed primarily for UHF mixer applications but are suitable
also for use in detector and ultrafast switching circuits.
Very Low Capacitance Less Than 1.0 pF @ Zero Volts

MMBD352LT1
MMBD353LT1
MMBD354LT1
MMBD355LT1

Low Forward Voltage 0.5 Volts (Typ) @ IF = 10 mA

3
1
2

MAXIMUM RATINGS (EACH DIODE)


Rating

Symbol

Value

Unit

VR

7.0

VCC

Continuous Reverse Voltage

1
ANODE

3
CATHODE/ANODE

MMBD352LT1
CASE 318 08, STYLE 11
SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Total Device Dissipation


Alumina Substrate(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

1
CATHODE

3
CATHODE/ANODE

MMBD352LT1 = M5G; MMBD353LT1 = M4F; MMBD354LT1 = M6H; MMBD355LT1 = MJ1

3
CATHODE

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Symbol

Min

Max

Unit

Forward Voltage
(IF = 10 mAdc)

VF

0.60

Reverse Voltage Leakage Current


(VR = 3.0 V)
(VR = 7.0 V)

IR

0.25
10

Capacitance
(VR = 0 V, f = 1.0 MHz)

1.0

OFF CHARACTERISTICS

mA

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

pF

2
ANODE

MMBD353LT1
CASE 318 08, STYLE 19
SOT 23 (TO 236AB)

DEVICE MARKING

Characteristic

2
CATHODE

ANODE
1
2
ANODE

MMBD354LT1
CASE 318 08, STYLE 9
SOT 23 (TO 236AB)

ANODE
3

CATHODE
1

2
CATHODE
MMBD355LT1
CASE 318 08, STYLE 12
SOT 23 (TO 236AB)

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

599

MMBD352LT1 MMBD353LT1 MMBD354LT1 MMBD355LT1


TYPICAL CHARACTERISTICS
1.0

TA = 85C

C, CAPACITANCE (pF)

I F, FORWARD CURRENT (mA)

100

10
TA = 40C

1.0
TA = 25C

0.1

0.9

0.8

0.7

0.6
0.3

5100

0.4

0.5

0.6

0.7

0.8

1.0

2.0

3.0

VF, FORWARD VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Forward Voltage

Figure 2. Capacitance

4.0

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Schottky Barrier Diode

MMBD352WT1

These devices are designed primarily for UHF mixer applications but are suitable
also for use in detector and ultrafast switching circuits.
Very Low Capacitance Less Than 1.0 pF @ Zero Volts
Low Forward Voltage 0.5 Volts (Typ) @ IF = 10 mA
3
1
2

1
ANODE

3
CATHODE/ANODE

MMBD352WT1
CASE 419 02, STYLE 9
SOT 323 (SC 70)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VR

7.0

VCC

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

200

mW

1.6

mW/C

Thermal Resistance, Junction to Ambient

RqJA

625

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Continuous Reverse Voltage

2
CATHODE

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBD352WT1 = M5

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

Forward Voltage
(IF = 10 mAdc)

VF

0.60

Reverse Voltage Leakage Current


(VR = 3.0 V)
(VR = 7.0 V)

IR

0.25
10

Capacitance
(VR = 0 V, f = 1.0 MHz)

1.0

OFF CHARACTERISTICS

mA

pF

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5101

MMBD352WT1
TYPICAL CHARACTERISTICS
1.0

TA = 85C

C, CAPACITANCE (pF)

I F, FORWARD CURRENT (mA)

100

10
TA = 40C

1.0
TA = 25C

0.1

0.9

0.8

0.7

0.6
0.3

5102

0.4

0.5

0.6

0.7

0.8

1.0

2.0

3.0

VF, FORWARD VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Forward Voltage

Figure 2. Capacitance

4.0

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Hot-Carrier Diodes

MMBD452LT1

Schottky Barrier Diodes

Motorola Preferred Devices

These devices are designed primarily for highefficiency UHF and VHF detector
applications. They are readily adaptable to many other fast switching RF and digital
applications. They are supplied in an inexpensive plastic package for lowcost,
highvolume consumer and industrial/commercial requirements.

30 VOLTS
DUAL HOTCARRIER
DETECTOR AND SWITCHING
DIODES

Extremely Low Minority Carrier Lifetime


Very Low Capacitance
Low Reverse Leakage

3
1
2

CASE 318 08, STYLE 11


SOT 23 (TO 236AB)

MAXIMUM RATINGS (TJ = 125C unless otherwise noted)


Symbol

Value

Unit

Reverse Voltage

VR

30

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF

Operating Junction
Temperature Range

TJ

Rating

225
1.8

2
CATHODE

1
ANODE

3
CATHODE/ANODE

mW
mW/C
C

55 to +125

Storage Temperature Range

Tstg

55 to +150

DEVICE MARKING
MMBD452LT1 = 5N

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic
Reverse Breakdown Voltage (IR = 10 A)

Symbol

Min

Typ

Max

Unit

V(BR)R

30

Volts

Total Capacitance (VR = 15 V, f = 1.0 MHz) Figure 1

CT

0.9

1.5

pF

Reverse Leakage (VR = 25 V) Figure 3

IR

13

200

nAdc

Forward Voltage (IF = 1.0 mAdc) Figure 4

VF

0.38

0.45

Vdc

Forward Voltage (IF = 10 mAdc) Figure 4

VF

0.52

0.6

Vdc

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5103

MMBD452LT1
TYPICAL ELECTRICAL CHARACTERISTICS
500

2.8

t , MINORITY CARRIER LIFETIME (ps)

C T, TOTAL CAPACITANCE (pF)

f = 1.0 MHz
2.4

400

2.0

KRAKAUER METHOD

300

1.6
1.2

200

0.8

100

0.4

0
0

3.0

6.0

9.0
12
15
18
21
VR, REVERSE VOLTAGE (VOLTS)

24

27

30

Figure 1. Total Capacitance

30
40
50
60
70
IF, FORWARD CURRENT (mA)

80

90

100

100

IF, FORWARD CURRENT (mA)

IR, REVERSE LEAKAGE (m A)

20

Figure 2. Minority Carrier Lifetime

10

TA = 100C

1.0

75C

0.1

25C

0.01

0.001

10

10
TA = 40C

TA = 85C

1.0
TA = 25C

0.1
0

6.0

12
18
VR, REVERSE VOLTAGE (VOLTS)

24

0.2

30

Figure 3. Reverse Leakage

IF(PEAK)

0.4

0.6
0.8
VF, FORWARD VOLTAGE (VOLTS)

1.0

1.2

Figure 4. Forward Voltage

CAPACITIVE
CONDUCTION

IR(PEAK)
FORWARD
CONDUCTION

SINUSOIDAL
GENERATOR

BALLAST
NETWORK
(PADS)

STORAGE
CONDUCTION

PADS
DUT

SAMPLING
OSCILLOSCOPE
(50 INPUT)

Figure 5. Krakauer Method of Measuring Lifetime

5104

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Common Anode
Schottky Barrier Diodes

MMBD717LT1
Motorola Preferred Device

These Schottky barrier diodes are designed for high speed switching applications,
circuit protection, and voltage clamping. Extremely low forward voltage reduces
conduction loss. Miniature surface mount package is excellent for hand held and
portable applications where space is limited.

20 VOLT
SCHOTTKY BARRIER
DETECTOR AND SWITCHING
DIODES

Extremely Fast Switching Speed


Extremely Low Forward Voltage 0.28 Volts (Typ) @ IF = 1 mAdc

CATHODE
1

ANODE
3

2
CATHODE

CASE 419 02, STYLE 2


SOT 323 (SC 70)

MAXIMUM RATINGS (TJ = 125C unless otherwise noted)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

20

Volts

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PF
200
1.6

mW
mW/C

Operating Junction
Temperature Range

TJ

C
55 to +150

Storage Temperature Range

Tstg

55 to +150

DEVICE MARKING
MMBD717LT1 = B3

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Reverse Breakdown Voltage


(IR = 10 A)

V(BR)R

20

Volts

Total Capacitance
(VR = 1.0 V, f = 1.0 MHz)

CT

2.0

2.5

pF

Reverse Leakage
(VR = 10 V)

IR

0.05

1.0

Adc

Forward Voltage
(IF = 1.0 mAdc)

VF

0.28

0.37

Vdc

Characteristic

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5105

MMBD717LT1
820
+10 V

2k
100 H

0.1 F

tr

IF

0.1 F

tp

IF
trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR
INPUT SIGNAL

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

5106

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High-Speed Switching Diode

MMBD914LT1
Motorola Preferred Device

3
CATHODE

1
ANODE

3
1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Reverse Voltage

VR

100

Vdc

Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Peak Forward Surge Current

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBD914LT1 = 5D

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)

100

Vdc

25
5.0

nAdc
mAdc

OFF CHARACTERISTICS
Reverse Breakdown Voltage
(IR = 100 mAdc)
Reverse Voltage Leakage Current
(VR = 20 Vdc)
(VR = 75 Vdc)

IR

Diode Capacitance
(VR = 0, f = 1.0 MHz)

CT

4.0

pF

Forward Voltage
(IF = 10 mAdc)

VF

1.0

Vdc

Reverse Recovery Time


(IF = IR = 10 mAdc) (Figure 1)

trr

4.0

ns

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5107

MMBD914LT1
820
+10 V

2.0 k
IF

100 H

tp

tr

0.1 F

IF

trr

10%

0.1 F
90%

DUT
50 INPUT
SAMPLING
OSCILLOSCOPE

50 OUTPUT
PULSE
GENERATOR

iR(REC) = 1.0 mA

IR

VR

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit


100

10
TA = 85C

I R , REVERSE CURRENT (m A)

I F, FORWARD CURRENT (mA)

TA = 150C
TA = 40C

10

TA = 25C
1.0

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.1
0.2

0.4

0.6

0.8

1.0

0.001

1.2

10

20

30

VF, FORWARD VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Forward Voltage

Figure 3. Leakage Current

40

50

C D , DIODE CAPACITANCE (pF)

0.68

0.64

0.60

0.56

0.52
0

2.0

4.0

6.0

8.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

5108

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBD1000LT1
MMBD2000T1
MMBD3000T1
MMSD1000T1

Switching Diode
Part of the GreenLine Portfolio of devices with energyconserving traits.
This switching diode has the following features:
Very Low Leakage ( 500 pA) promotes extended battery life by decreasing energy waste

Motorola Preferred Devices

Offered in four Surface Mount package types


Available in 8 mm Tape and Reel in quantities of 3,000
Applications

MMBD1000LT1

ESD Protection

Reverse Polarity Protection


Steering Logic

1
2

MediumSpeed Switching

CASE 318-08, STYLE 8


SOT-23 (TO-236AB)
3
CATHODE

1
ANODE

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Continuous Reverse Voltage

VR

30

Vdc

Peak Forward Current

IF

200

mAdc

IFM
(surge)

500

mA

Peak Forward Surge Current

MMBD2000T1
3
1
2

CASE 419-02, STYLE 2


SC70/SOT323

DEVICE MARKING

3
CATHODE

MMBD1000LT1 = AY
MMBD2000T1 = DH
MMBD3000T1 = XP
MMSD1000T1 = 4K

MMBD3000T1

THERMAL CHARACTERISTICS
Characteristic

Symbol

Total Device Dissipation FR-4 Board (1)


TA = 25C
MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1
Derate above 25C MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1

PD

Thermal Resistance Junction to Ambient


MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1

RJA

Junction and Storage Temperature

1
ANODE

Max

Unit
mW

2
1

225
150
1.8

CASE 318D-04, STYLE 2


SC59
mW/C

1.2

3
CATHODE

2
ANODE

C/W
556

MMSD1000T1

833
TJ, Tstg

55 to +150

(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.

Preferred devices are Motorola recommended choices for future use and best overall value.

C
1

CASE 425-04, STYLE 1


SOD123
1
CATHODE

2
ANODE

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5109

MMBD1000LT1 MMBD2000T1 MMBD3000T1 MMSD1000T1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Max

Unit

V(BR)

30

Reverse Voltage Leakage Current (VR = 75 V)

IR

500

pA

Forward Voltage (IF = 1.0 mA)


Forward Voltage (IF = 10 mA)

VF

850
950

mV

Diode Capacitance (VR = 0 V, f = 1.0 MHz)

CD

2.0

pF

Reverse Recovery Time (IF = IR = 10 mA) (Figure 1)

trr

3.0

OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100 A)

820
+10 V

2k
100 H

0.1 F

tr

IF

0.1 F

tp

IF
trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR
INPUT SIGNAL

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

5110

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBD1005LT1
MMBD2005T1
MMBD3005T1

Switching Diode
Part of the GreenLine Portfolio of devices with energyconserving traits.
This switching diode has the following features:
Very Low Leakage ( 500 pA) promotes extended battery life by decreasing energy waste. Guaranteed leakage limit is for each diode in the pair
contingent upon the other diode being in a nonforwardbiased condition.

Motorola Preferred Devices

Offered in four Surface Mount package types

MMBD1005LT1

Available in 8 mm Tape and Reel in quantities of 3,000


Applications
ESD Protection

ANODE
3

Reverse Polarity Protection

CATHODE
1
2
CATHODE

Steering Logic
MediumSpeed Switching

3
1
2

CASE 318-08, STYLE 12


SOT-23 (TO-236AB)

MMBD2005T1
3

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Continuous Reverse Voltage

VR

30

Vdc

Peak Forward Current

IF

200

mAdc

IFM
(surge)

500

mA

Peak Forward Surge Current

1
2

CASE 419-02, STYLE 4


SC70/SOT323

DEVICE MARKING
MMBD3005T1

MMBD1005LT1 = A3
MMBD2005T1 = DI
MMBD3005T1 = XQ

THERMAL CHARACTERISTICS
Characteristic

Symbol

Total Device Dissipation FR-4 Board (1)


TA = 25C
MMBD1005LT1, MMBD3005T1
MMBD2005T1
Derate above 25C MMBD1005LT1, MMBD3005T1
MMBD2005T1

PD

Thermal Resistance Junction to Ambient


MMBD1005LT1, MMBD3005T1
MMBD2005T1

RJA

Junction and Storage Temperature

Max

2
1

mW
225
150
1.8
1.2

TJ, Tstg

Unit

CASE 318D-04, STYLE 5


SC59
mW/C
C/W

556
833
55 to +150

(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5111

MMBD1005LT1 MMBD2005T1 MMBD3005T1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Max

Unit

OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100 A)

V(BR)

30

Reverse Voltage Leakage Current (VR = 75 V)(2)

IR

500

pA

Forward Voltage (IF = 1.0 mA)


Forward Voltage (IF = 10 mA)

VF

850
950

mV

Diode Capacitance (VR = 0 V, f = 1.0 MHz)

CD

2.0

pF

Reverse Recovery Time (IF = IR = 10 mA) (Figure 1)

trr

3.0

(2) Guaranteed leakage limit is for each diode in the pair contingent upon the other diode being
in a nonforwardbiased condition.

820
+10 V

2k
100 H

0.1 F

tr

IF

0.1 F

tp

IF
trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR
INPUT SIGNAL

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

5112

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBD1010LT1
MMBD2010T1
MMBD3010T1

Switching Diode
Part of the GreenLine Portfolio of devices with energyconserving traits.
This switching diode has the following features:
Very Low Leakage ( 500 pA) promotes extended battery life by decreasing energy waste. Guaranteed leakage limit is for each diode in the pair
contingent upon the other diode being in a nonforwardbiased condition.

Motorola Preferred Devices

Offered in four Surface Mount package types

MMBD1010LT1

Available in 8 mm Tape and Reel in quantities of 3,000


Applications

ANODE
1

ESD Protection
Reverse Polarity Protection

3
CATHODE

Steering Logic
MediumSpeed Switching

2
ANODE

Symbol

Value

CASE 318-08, STYLE 9


SOT-23 (TO-236AB)

Unit

Continuous Reverse Voltage

VR

30

Vdc

Peak Forward Current

IF

200

mAdc

IFM
(surge)

500

mA

Peak Forward Surge Current

MMBD2010T1

MAXIMUM RATINGS
Rating

3
1
2

CASE 419-02, STYLE 5


SC70/SOT323

DEVICE MARKING
MMBD1010LT1 = A5
MMBD2010T1 = DP
MMBD3010T1 = XS

MMBD3010T1

THERMAL CHARACTERISTICS
Characteristic

Symbol

Total Device Dissipation FR-4 Board (1)


TA = 25C
MMBD1010LT1, MMBD3010T1
MMBD2010T1
Derate above 25C MMBD1010LT1, MMBD3010T1
MMBD2010T1

PD

Thermal Resistance Junction to Ambient


MMBD1010LT1, MMBD3010T1
MMBD2010T1

RJA

Junction and Storage Temperature

Max

mW
225
150
1.8
1.2

TJ, Tstg

Unit
2
1

mW/C

CASE 318D-04, STYLE 3


SC59

C/W
556
833
55 to +150

(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5113

MMBD1010LT1 MMBD2010T1 MMBD3010T1


ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic

Symbol

Min

Max

Unit

OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100 A)

V(BR)

30

Reverse Voltage Leakage Current (VR = 75 V)(2)

IR

500

pA

Forward Voltage (IF = 1.0 mA)


Forward Voltage (IF = 10 mA)

VF

850
950

mV

Diode Capacitance (VR = 0 V, f = 1.0 MHz)

CD

2.0

pF

Reverse Recovery Time (IF = IR = 10 mA) (Figure 1)

trr

3.0

(2) Guaranteed leakage limit is for each diode in the pair contingent upon the other diode being
in a nonforwardbiased condition.

820
+10 V

2k
100 H

0.1 F

tr

IF

0.1 F

tp

IF
trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
IR

VR
INPUT SIGNAL

iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

5114

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Monolithic Dual Switching Diodes

MMBD2835LT1
MMBD2836LT1

CATHODE
1

ANODE
3

2
CATHODE

3
1
2

CASE 318 08, STYLE 12


SOT 23 (TO 236AB)

MAXIMUM RATINGS (EACH DIODE)


Rating

Symbol

Value

Unit

VR

35
75

Vdc

IF

100

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Reverse Voltage

MMBD2835LT1
MMBD2836LT1

Forward Current

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBD2835LT1 = A3X; MMBD2836LT1 = A2X

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Max

Unit

V(BR)

35
75

Vdc

IR

OFF CHARACTERISTICS
Reverse Breakdown Voltage (IR = 100 Adc)
Reverse Voltage Leakage Current
(VR = 30 Vdc)
(VR = 50 Vdc)

MMBD2835LT1
MMBD2836LT1
MMBD2835LT1
MMBD2836LT1

nAdc
100
100

Diode Capacitance (VR = 0 V, f = 1.0 MHz)

CT

4.0

pF

Forward Voltage (IF = 10 mAdc)


Forward Voltage (IF = 50 mAdc)
Forward Voltage (IF = 100 mAdc)

VF

1.0
1.0
1.2

Vdc

Reverse Recovery Time (IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) (Figure 1)

trr

4.0

ns

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5115

MMBD2835LT1 MMBD2836LT1
820
+10 V

2.0 k
IF

100 H

tp

tr

0.1 F

IF

trr

10%

0.1 F
90%

DUT
50 INPUT
SAMPLING
OSCILLOSCOPE

50 OUTPUT
PULSE
GENERATOR

iR(REC) = 1.0 mA

IR

VR

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

CURVES APPLICABLE TO EACH CATHODE


100

10
TA = 85C

I R , REVERSE CURRENT (m A)

I F, FORWARD CURRENT (mA)

TA = 150C
TA = 40C

10

TA = 25C
1.0

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.1
0.2

0.4

0.6

0.8

1.0

0.001

1.2

10

20

30

VF, FORWARD VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Forward Voltage

Figure 3. Leakage Current

40

50

C D , DIODE CAPACITANCE (pF)

1.75

1.50

1.25

1.00

0.75
0

2.0

4.0

6.0

8.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

5116

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Monolithic Dual Switching Diodes

MMBD2837LT1
MMBD2838LT1

ANODE
1

3
CATHODE

2
ANODE
3

MAXIMUM RATINGS (EACH DIODE)


Rating

Symbol

Value

Unit

VRM

75

Vdc

VR

30
50

Vdc

IFM

450
300

mAdc

IO

150
100

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

1
2

Peak Reverse Voltage


D.C. Reverse Voltage

MMBD2837LT1
MMBD2838LT1

Peak Forward Current


Average Rectified Current

CASE 318 08, STYLE 9


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBD2837LT1 = A5; MMBD2838LT1 = MA6

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Max

Unit

V(BR)

35
75

Vdc

0.1
0.1

OFF CHARACTERISTICS
Reverse Breakdown Voltage (I(BR) = 100 Adc)
Reverse Voltage Leakage Current
(VR = 30 Vdc)
(VR = 50 Vdc)

MMBD2837LT1
MMBD2838LT1

Adc

IR
MMBD2837LT1
MMBD2838LT1

Diode Capacitance (VR = 0 V, f = 1.0 MHz)

CT

4.0

pF

Forward Voltage (IF = 10 mAdc)


Forward Voltage (IF = 50 mAdc)
Forward Voltage (IF = 100 mAdc)

VF

1.0
1.0
1.2

Vdc

Reverse Recovery Time (IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) (Figure 1)

trr

4.0

ns

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5117

MMBD2837LT1 MMBD2838LT1
820
+10 V

2.0 k
IF

100 H

tp

tr

0.1 F

IF

trr

10%

0.1 F
90%

DUT
50 INPUT
SAMPLING
OSCILLOSCOPE

50 OUTPUT
PULSE
GENERATOR

iR(REC) = 1.0 mA

IR

VR

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

CURVES APPLICABLE TO EACH CATHODE

100

10
TA = 85C

I R , REVERSE CURRENT (m A)

I F, FORWARD CURRENT (mA)

TA = 150C
TA = 40C

10

TA = 25C
1.0

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.1
0.2

0.4

0.6

0.8

1.0

0.001

1.2

10

20

30

VF, FORWARD VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Forward Voltage

Figure 3. Leakage Current

40

50

CD , DIODE CAPACITANCE (pF)

1.0

0.9

0.8

0.7

0.6

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

5118

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Diode

MMBD6050LT1

3
CATHODE

1
ANODE

1
2

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Reverse Voltage

VR

70

Vdc

Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Peak Forward Surge Current

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBD6050LT1 = 5A

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Max

Unit

V(BR)

70

Vdc

Reverse Voltage Leakage Current


(VR = 50 Vdc)

IR

0.1

Adc

Forward Voltage
(IF = 1.0 mAdc)
(IF = 100 mAdc)

VF
0.55
0.85

0.7
1.1

Reverse Recovery Time


(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) (Figure 1)

trr

4.0

ns

Capacitance (VR = 0 V)

2.5

pF

Characteristic

OFF CHARACTERISTICS
Reverse Breakdown Voltage (I(BR) = 100 Adc)

 0.062 in.
  0.024 in. 99.5% alumina.

Vdc

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5119

MMBD6050LT1
820
+10 V

2.0 k
IF

100 H

tp

tr

0.1 F

IF

trr

10%

0.1 F
90%

DUT
50 INPUT
SAMPLING
OSCILLOSCOPE

50 OUTPUT
PULSE
GENERATOR

iR(REC) = 1.0 mA

IR

VR

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

TYPICAL CHARACTERISTICS
100

10
TA = 85C

I R , REVERSE CURRENT (m A)

I F, FORWARD CURRENT (mA)

TA = 150C
TA = 40C

10

TA = 25C
1.0

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.1
0.2

0.4

0.6

0.8

1.0

0.001

1.2

10

20

30

VF, FORWARD VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Forward Voltage

Figure 3. Leakage Current

40

50

C D , DIODE CAPACITANCE (pF)

0.68

0.64

0.60

0.56

0.52
0

2.0

4.0

6.0

8.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

5120

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Monolithic Dual Switching Diode

MMBD6100LT1

ANODE
1

3
CATHODE

2
ANODE
3
1
2

CASE 318 08, STYLE 9


SOT 23 (TO 236AB)

MAXIMUM RATINGS (EACH DIODE)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

70

Vdc

Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Peak Forward Surge Current

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBD6100LT1 = 5BM

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Symbol

Min

Max

Unit

V(BR)

70

Vdc

Reverse Voltage Leakage Current


(VR = 50 Vdc)

IR

0.1

Adc

Forward Voltage
(IF = 1.0 mAdc)
(IF = 100 mAdc)

VF
0.55
0.85

0.7
1.1

Reverse Recovery Time


(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) (Figure 1)

trr

4.0

ns

Capacitance
(VR = 0 V)

2.5

pF

Characteristic

OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR) = 100 Adc)

Vdc

 0.062 in.
  0.024 in. 99.5% alumina.

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5121

MMBD6100LT1
820
+10 V

2.0 k
IF

100 H

tp

tr

0.1 F

IF

trr

10%

0.1 F
90%

DUT
50 INPUT
SAMPLING
OSCILLOSCOPE

50 OUTPUT
PULSE
GENERATOR

iR(REC) = 1.0 mA

IR

VR

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

CURVES APPLICABLE TO EACH CATHODE

100

10
TA = 85C

I R , REVERSE CURRENT (m A)

I F, FORWARD CURRENT (mA)

TA = 150C
TA = 40C

10

TA = 25C
1.0

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.1
0.2

0.4

0.6

0.8

1.0

0.001

1.2

10

20

30

VF, FORWARD VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Forward Voltage

Figure 3. Leakage Current

40

50

CD , DIODE CAPACITANCE (pF)

1.0

0.9

0.8

0.7

0.6

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

5122

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Switching Diode

MMBD7000LT1
Motorola Preferred Device

1
ANODE

3
CATHODE/ANODE

2
CATHODE

3
1
2

MAXIMUM RATINGS (EACH DIODE)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

100

Vdc

Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR 5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance, Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Peak Forward Surge Current

CASE 318 08, STYLE 11


SOT 23 (TO 236AB)

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate,(2) TA = 25C
Derate above 25C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature

DEVICE MARKING
MMBD7000LT1 = M5C

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Max

Unit

V(BR)

100

Vdc

IR
IR2
IR3

1.0
3.0
100

0.55
0.67
0.75

0.7
0.82
1.1

OFF CHARACTERISTICS
Reverse Breakdown Voltage (I(BR) = 100 Adc)
Reverse Voltage Leakage Current
(VR = 50 Vdc)
(VR = 100 Vdc)
(VR = 50 Vdc, 125C)

Adc

Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 100 mAdc)

VF

Reverse Recovery Time


(IF = IR = 10 mAdc) (Figure 1)

trr

4.0

ns

Capacitance (VR = 0 V)

1.5

pF

 0.062 in.
  0.024 in. 99.5% alumina.

Vdc

1. FR 5 = 1.0
0.75
2. Alumina = 0.4
0.3

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5123

MMBD7000LT1
820
+10 V

2.0 k
IF

100 H

tp

tr

0.1 F

IF

trr

10%

0.1 F
90%

DUT
50 INPUT
SAMPLING
OSCILLOSCOPE

50 OUTPUT
PULSE
GENERATOR

iR(REC) = 1.0 mA

IR

VR

OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

CURVES APPLICABLE TO EACH DIODE

100

10
TA = 85C

I R , REVERSE CURRENT (m A)

I F, FORWARD CURRENT (mA)

TA = 150C
TA = 40C

10

TA = 25C
1.0

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.1
0.2

0.4

0.6

0.8

1.0

0.001

1.2

10

20

30

VF, FORWARD VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Forward Voltage

Figure 3. Leakage Current

40

50

C D , DIODE CAPACITANCE (pF)

0.68

0.64

0.60

0.56

0.52
0

2.0

4.0

6.0

8.0

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

5124

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Silicon Tuning Diode

MMBV105GLT1

This device is designed in the Surface Mount package for general frequency control
and tuning applications. It provides solidstate reliability in replacement of mechanical
tuning methods.

Motorola Preferred Device

Controlled and Uniform Tuning Ratio


30 VOLT
VOLTAGE VARIABLE
CAPACITANCE DIODE

3
Cathode

1
Anode

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Symbol

Value

Unit

Reverse Voltage

Rating

VR

30

Vdc

Forward Current

IF

200

mAdc

Device Dissipation @ TA = 25C


Derate above 25C

PD

225
1.8

mW
mW/C

TJ

+125

Tstg

55 to +150

Junction Temperature
Storage Temperature Range

DEVICE MARKING
MMBV105GLT1 = M4E

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic
Reverse Breakdown Voltage
(IR = 10 Adc)

Symbol

Min

Max

Unit

V(BR)R

30

Vdc

IR

50

nAdc

Reverse Voltage Leakage Current


(VR = 28 Vdc)

Device Type

MMBV105GLT1

CT
VR = 25 Vdc, f = 1.0 MHz
pF

Q
VR = 3.0 Vdc
f = 50 MHz

CR
C3/C25
f = 1.0 MHz

Min

Max

Typ

Min

Max

1.5

2.8

250

4.0

6.5

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5125

MMBV105GLT1
TYPICAL CHARACTERISTICS
20

1000

16

Q, FIGURE OF MERIT

CT , DIODE CAPACITANCE (pF)

18

14
12
10
8.0
6.0

f = 1.0 MHz
TA = 25C

4.0

VR = 3 Vdc
TA = 25C
100

2.0
0.5

1.0

2.0 3.0

5.0

10

10

20 30

10

100

VR, REVERSE VOLTAGE (VOLTS)

f, FREQUENCY (MHz)

Figure 1. Diode Capacitance

Figure 2. Figure of Merit

CT , DIODE CAPACITANCE (NORMALIZED)

0
0.3

1000

1.04
1.03

VR = 3.0 Vdc
f = 1.0 MHz

1.02
1.01
1.00
0.99
0.98
0.97
0.96
75

50

25

+25

+50

+75

+100

+125

TA, AMBIENT TEMPERATURE (C)

Figure 3. Diode Capacitance

5126

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBV409LT1
MV409

Silicon Tuning Diodes


These devices are designed for general frequency control and tuning applications.
They provide solidstate reliability in replacement of mechanical tuning methods.

Motorola Preferred Devices

High Q with Guaranteed Minimum Values at VHF Frequencies


Controlled and Uniform Tuning Ratio

VOLTAGE VARIABLE
CAPACITANCE DIODES

Available in Surface Mount Package


3
Cathode

1
Anode
SOT23
3

2
Cathode

TO92

1
Anode

1
2

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Reverse Voltage

MBV409

MMBV409LT1

Unit

VR

20

Vdc

Forward Current

IF

200

mAdc

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PD

Junction Temperature

TJ

+125

Tstg

55 to +150

Storage Temperature Range

1
2

280
2.8

225
1.8

mW
mW/C

CASE 18202, STYLE 1


TO92 (TO226AC)

DEVICE MARKING
MMBV409LT1 = X5, MV409 = MV409

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic
Reverse Breakdown Voltage
(IR = 10 Adc)

Symbol

Min

Typ

Max

Unit

V(BR)R

20

Vdc

IR

0.1

Adc

TCC

300

ppm/C

Reverse Voltage Leakage Current


(VR = 15 Vdc)
Diode Capacitance Temperature Coefficient
(VR = 3.0 Vdc, f = 1.0 MHz)

Ct, Diode Capacitance


VR = 3.0 Vdc, f = 1.0 MHz
pF
Device
MMBV409LT1, MV409

Q, Figure of Merit
VR = 3.0 Vdc
f = 50 MHz

CR, Capacitance Ratio


C3/C8
f = 1.0 MHz(1)

Min

Nom

Max

Min

Min

Max

26

29

32

200

1.5

1.9

1. CR is the ratio of Ct measured at 3 Vdc divided by Ct measured at 8 Vdc.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5127

MMBV409LT1 MV409
TYPICAL CHARACTERISTICS
1000

32

Q, FIGURE OF MERIT

C T, DIODE CAPACITANCE (pF)

40

f = 1.0 MHz
TA = 25C

24

16

100

10

20

30

1000

Figure 1. Diode Capacitance

Figure 2. Figure of Merit

C t , DIODE CAPACITANCE (NORMALIZED)

VR = 15 Vdc

0.2
0.1
0.06

0.02
0.01
0.006
20

+20

+40

+60

+80 +100 +120 +140

TA, AMBIENT TEMPERATURE (C)

Figure 3. Leakage Current

5128

100
f, FREQUENCY (MHz)

2.0
1.0
0.6

40

10

VR, REVERSE VOLTAGE (VOLTS)

20
10
6.0

0.002
0.001
60

10

100

100
60
I R , REVERSE CURRENT (nA)

VR = 3 Vdc
TA = 25C

1.04
1.03

VR = 3.0 Vdc
f = 1.0 MHz

1.02
1.01
1.00
0.99
0.98
0.97
0.96
75

50

25

+25

+50

+75

+100

+125

TA, AMBIENT TEMPERATURE (C)

Figure 4. Diode Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Silicon Tuning Diode

MMBV432LT1

This device is designed for FM tuning, general frequency control and tuning, or any
topoftheline application requiring backtoback diode configuration for minimum
signal distortion and detuning. This device is supplied in the SOT23 plastic package
for high volume, pick and place assembly requirements.

Motorola Preferred Device

High Figure of Merit Q = 150 (Typ) @ VR = 2.0 Vdc, f = 100 MHz

DUAL
VOLTAGE VARIABLE
CAPACITANCE DIODE

Guaranteed Capacitance Range


Dual Diodes Save Space and Reduce Cost
Surface Mount Package
Available in 8 mm Tape and Reel

Monolithic Chip Provides Improved Matching Guaranteed 1.0% (Max)


Over Specified Tuning Range

1
2

CASE 318 08, STYLE 9


SOT 23 (TO 236AB)

2
3

MAXIMUM RATINGS (Each Diode)


Symbol

Value

Unit

Reverse Voltage

Rating

VR

14

Vdc

Forward Current

IF

200

mAdc

Total Power Dissipation @ TA = 25C


Derate above 25C

PD

225
1.8

mW
mW/C

TJ

+125

Tstg

55 to +125

Junction Temperature
Storage Temperature Range

DEVICE MARKING
MMBV432LT1 = M4B

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

14

Vdc

Reverse Voltage Leakage Current


(VR = 9.0 Vdc)

IR

100

nAdc

Diode Capacitance
(VR = 2.0 Vdc, f = 1.0 MHz)

CT

43

48.1

pF

Capacitance Ratio C2/C8


(f = 1.0 MHz)

CR

1.5

2.0

100

150

Reverse Breakdown Voltage


(IR = 10 Adc)

Figure of Merit
(VR = 2.0 Vdc, f = 100 MHz)

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5129

MMBV432LT1
TYPICAL CHARACTERISTICS (Each Diode)
550

70
Q, FIGURE OF MERIT

CT , DIODE CAPACITANCE (pF)

100

50

30
f = 1.0 MHz
TA = 25C

20

350

250
TA = 25C
f = 100 MHz

150

10

50

10

10

Figure 1. Diode Capacitance

Figure 2. Figure of Merit versus Voltage

CT , DIODE CAPACITANCE (NORMALIZED)

VR = 2.0 Vdc
TA = 25C

500

200
100
50

20

VR, REVERSE VOLTAGE (VOLTS)

1000

20
10

VR, REVERSE VOLTAGE (VOLTS)

2000

Q, FIGURE OF MERIT

450

30

50 70 100

1.06

1.04
VR = 2.0 Vdc
1.02
VR = 4.0 Vdc
1.00

0.98

f = 1.0 MHz

0.96
75

200 300

50

25

+25

+50

+75

+100

+125

f, FREQUENCY (MHz)

TJ, JUNCTION TEMPERATURE (C)

Figure 3. Figure of Merit versus Frequency

Figure 4. Diode Capacitance versus Temperature

10
TA = 125C

I R , REVERSE CURRENT (nA)

5
2
1
0.5

TA = 75C

0.2
0.1
0.05
TA = 25C
0.02
0.01

10

12

14

VR, REVERSE VOLTAGE (VOLTS)

Figure 5. Reverse Current versus Reverse Voltage

5130

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Silicon Tuning Diode

MMBV609LT1

This device is designed for FM tuning, general frequency control and tuning, or any
topoftheline application requiring backtoback diode configuration for minimum
signal distortion and detuning. This device is supplied in the SOT23 plastic package
for high volume, pick and place assembly requirements.

Motorola Preferred Device

High Figure of Merit Q = 450 (Typ) @ VR = 3.0 Vdc, f = 50 MHz

DUAL
VOLTAGE VARIABLE
CAPACITANCE DIODE

Guaranteed Capacitance Range


Dual Diodes Save Space and Reduce Cost
Surface Mount Package
Available in 8 mm Tape and Reel

Monolithic Chip Provides Improved Matching


1

Hyper Abrupt Junction Process Provides High Tuning Ratio

CASE 318 08, STYLE 9


SOT 23 (TO 236AB)

MAXIMUM RATINGS (Each Diode)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

20

Vdc

Forward Current

IF

100

mAdc

Total Power Dissipation @ TA = 25C


Derate above 25C

PD

225
1.8

mW
mW/C

Junction Temperature

TJ

+125

Tstg

55 to +125

Storage Temperature Range

DEVICE MARKING
MMBV609LT1 = 5L

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

20

Vdc

Reverse Voltage Leakage Current


(VR = 15 Vdc)

IR

10

nAdc

Diode Capacitance
(VR = 3.0 Vdc, f = 1.0 MHz)

CT

26

32

pF

Capacitance Ratio C3/C8


(f = 1.0 MHz)

CR

1.8

2.4

250

450

Reverse Breakdown Voltage


(IR = 10 Adc)

Figure of Merit
(VR = 3.0 Vdc, f = 50 MHz)

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5131

MMBV609LT1
TYPICAL CHARACTERISTICS
1000

40

f = 1.0 MHz
TA = 25C

Q, FIGURE OF MERIT

CT , DIODE CAPACITANCE (pF)

50

30

20

VR = 3 Vdc
TA = 25C
100

10

10

20

30

10

40

10

100

VR, REVERSE VOLTAGE (VOLTS)

f, FREQUENCY (MHz)

Figure 1. Diode Capacitance

Figure 2. Figure of Merit

CT , DIODE CAPACITANCE (NORMALIZED)

1000

1.04
1.03

VR = 3.0 Vdc
f = 1.0 MHz

1.02
1.01
1.00
0.99
0.98
0.97
0.96
75

50

25

+25

+50

+75

+100

+125

TA, AMBIENT TEMPERATURE (C)

Figure 3. Diode Capacitance

5132

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Silicon Tuning Diode

MMBV809LT1

This device is designed for 900 MHz frequency control and tuning applications. It
provides solidstate reliability in replacement of mechanical tuning methods.

Motorola Preferred Device

Controlled and Uniform Tuning Ratio


Available in Surface Mount Package

4.56.1 pF
VOLTAGE VARIABLE
CAPACITANCE DIODE

Available in 8 mm Tape and Reel

3
CATHODE

1
ANODE

3
1
2

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating
Reverse Voltage

Symbol

Value

Unit

VR

20

Vdc

Forward Current

IF

20

mAdc

Total Power Dissipation(1) @ TA = 25C


Derate above 25C

PD

225
1.8

mW
mW/C

Junction Temperature

TJ

+125

Tstg

55 to +125

Storage Temperature Range


1. FR5 Board 1.0 x 0.75 x 0.62 in.

DEVICE MARKING
MMBV809LT1 = 5K

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic All Types
Reverse Breakdown Voltage
(IR = 10 Adc)
Reverse Voltage Leakage Current
(VR = 15 Vdc)
Ct, Diode Capacitance
VR = 2.0 Vdc, f = 1.0 MHz
pF
Device
MMBV809LT1

Symbol

Min

Typ

Max

Unit

V(BR)R

20

Vdc

IR

50

nAdc

Q, Figure of Merit
VR = 3.0 Vdc
f = 500 MHz

CR, Capacitance Ratio


C2/C8
f = 1.0 MHz(2)

Min

Typ

Max

Typ

Min

Max

4.5

5.3

6.1

75

1.8

2.6

2. CR is the ratio of Ct measured at 2.0 Vdc divided by Ct measured at 8.0 Vdc.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5133

MMBV809LT1
TYPICAL CHARACTERISTICS
10

1000

Q, FIGURE OF MERIT

CT , DIODE CAPACITANCE (pF)

7
6
5
4
3

VR = 3 Vdc
TA = 25C
100

2
1
0
0.5

10

10
0.1

15

Figure 1. Diode Capacitance

Figure 2. Figure of Merit

CT , DIODE CAPACITANCE (NORMALIZED)

R S , SERIES RESISTANCE (MHz)

VR = 3.0 Vdc
f = 1.0 MHz
800

600

400
0.2

0.4

0.6

0.8

f, FREQUENCY (GHz)

Figure 3. Series Resistance

5134

10

f, FREQUENCY (GHz)

1000

1.0

VR, REVERSE VOLTAGE (VOLTS)

1.0

1.2

1.04
1.03

VR = 3.0 Vdc
f = 1.0 MHz

1.02
1.01
1.00
0.99
0.98
0.97
0.96
75

50

25

+25

+50

+75

+100

+125

TA, AMBIENT TEMPERATURE (C)

Figure 4. Diode Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Silicon Tuning Diodes


These devices are designed in the popular PLASTIC PACKAGE for high volume
requirements of FM Radio and TV tuning and AFC, general frequency control and
tuning applications.They provide solidstate reliability in replacement of mechanical
tuning methods. Also available in Surface Mount Package up to 33pF.
High Q
Controlled and Uniform Tuning Ratio
Standard Capacitance Tolerance 10%
Complete Typical Design Curves

3
Cathode

1
Anode
SOT23

2
Cathode

TO92

1
Anode

MMBV2101LT1
MMBV2103LT1
MMBV2105LT1
MMBV2107LT1
MMBV2108LT1
MMBV2109LT1
MV2101 MV2104
MV2105 MV2108
MV2109 MV2111
MV2115
6.8100 pF
30 VOLTS
VOLTAGE VARIABLE
CAPACITANCE DIODES

MAXIMUM RATINGS

Rating

Symbol

MV21xx

MMBV21xxLT1

Unit

Reverse Voltage

VR

30

Vdc

Forward Current

IF

200

mAdc

Forward Power Dissipation


@ TA = 25C
Derate above 25C

PD

Junction Temperature

TJ

+150

Tstg

55 to +150

280
2.8

Storage Temperature Range

225
1.8

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

mW
mW/C

DEVICE MARKING

MMBV2101LT1 = M4G
MMBV2103LT1 = 4H
MMBV2105LT1 = 4U

MMBV2107LT1 = 4W
MMBV2108LT1 = 4X
MMBV2109LT1 = 4J

CASE 18202, STYLE 1


TO92 (TO226AC)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic
Reverse Breakdown Voltage
(IR = 10 Adc)

Symbol

Min

Typ

Max

Unit

V(BR)R

30

Vdc

IR

0.1

Adc

TCC

280

ppm/C

Reverse Voltage Leakage Current


(VR = 25 Vdc, TA = 25C)
Diode Capacitance Temperature Coefficient
(VR = 4.0 Vdc, f = 1.0 MHz)

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5135

MMBV2101LT1 MMBV2103LT1 MMBV2105LT1 MMBV2107LT1 MMBV2108LT1 MMBV2109LT1

CT, Diode Capacitance


VR = 4.0 Vdc, f = 1.0 MHz
pF

Q, Figure of Merit
VR = 4.0 Vdc,
f = 50 MHz

TR, Tuning Ratio


C2/C30
f = 1.0 MHz

Device

Min

Nom

Max

Typ

Min

Typ

Max

MMBV2101LT1/MV2101
MMBV2103LT1
MV2104
MMBV2105LT1/MV2105
MMBV2107LT1
MMBV2108LT1/MV2108
MMBV2109LT1/MV2109

6.1
9.0
10.8
13.5
19.8
24.3
29.7

6.8
10
12
15
22
27
33

7.5
11
13.2
16.5
24.2
29.7
36.3

450
400
400
400
350
300
200

2.5
2.5
2.5
2.5
2.5
2.5
2.5

2.7
2.9
2.9
2.9
2.9
3.0
3.0

3.2
3.2
3.2
3.2
3.2
3.2
3.2

MV2111
MV2115

42.3
90

47
100

51.7
110

150
100

2.5
2.6

3.0
3.0

3.2
3.3

MMBV2101LT1, MMBV2103LT1, MMBV2105LT1, MMBV2107LT1 thru MMBV2109LT1, are also available in bulk. Use the device title and drop
the T1 suffix when ordering any of these devices in bulk.

PARAMETER TEST METHODS


1. CT, DIODE CAPACITANCE
(CT = CC + CJ). CT is measured at 1.0 MHz using a capacitance bridge (Boonton Electronics Model 75A or
equivalent).
2. TR, TUNING RATIO
TR is the ratio of CT measured at 2.0 Vdc divided by CT
measured at 30 Vdc.
3. Q, FIGURE OF MERIT
Q is calculated by taking the G and C readings of an admittance bridge at the specified frequency and substituting in the following equations:
Q

4. TCC, DIODE CAPACITANCE TEMPERATURE


COEFFICIENT
TCC is guaranteed by comparing CT at VR = 4.0 Vdc,
f = 1.0 MHz, TA = 65C with CT at VR = 4.0 Vdc, f =
1.0 MHz, TA = +85C in the following equation, which defines TCC:
TCC

CT(65C)
+ CT() 85C)
85 ) 65

106
CT(25C)

Accuracy limited by measurement of CT to 0.1 pF.

+ 2pGfC

(Boonton Electronics Model 33AS8 or equivalent). Use


Lead Length
1/16.

5136

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBV2101LT1 MMBV2103LT1 MMBV2105LT1 MMBV2107LT1 MMBV2108LT1 MMBV2109LT1


TYPICAL DEVICE CHARACTERISTICS
1000
TA = 25C
f = 1.0 MHz

C T , DIODE CAPACITANCE (pF)

500
MV2115
200
100

MMBV2109LT1/MV2109

50

MMBV2105LT1/MV2105

20

MMBV2101LT1/MV2101

10
5.0
2.0
1.0
0.1

0.2

0.5

0.3

1.0

3.0

2.0

20

10

5.0

30

VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Diode Capacitance versus Reverse Voltage


100
50

VR = 2.0 Vdc

1.030
1.020

VR = 4.0 Vdc

1.010
1.000

VR = 30 Vdc

0.990
NORMALIZED TO CT
at TA = 25C
VR = (CURVE)

0.980
0.970
0.960
75

50

25
0
+25
+50
+75
TJ, JUNCTION TEMPERATURE (C)

I R , REVERSE CURRENT (nA)

NORMALIZED DIODE CAPACITANCE

1.040

TA = 125C

20
10
5.0
2.0
1.0
0.50

TA = 75C

0.20
0.10

TA = 25C

0.05

+100

0.02
0.01

+125

10

15

20

25

30

VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Normalized Diode Capacitance versus


Junction Temperature
5000
3000
2000

5.0

Figure 3. Reverse Current versus Reverse Bias


Voltage
5000
3000
2000

MMBV2101LT1/MV2101

500
300
200

Q, FIGURE OF MERIT

Q, FIGURE OF MERIT

MMBV2109LT1/MV2109
1000

MV2115

100
50
30
20
10
1.0

10
3.0
5.0
7.0
VR, REVERSE VOLTAGE (VOLTS)

20

30

Figure 4. Figure of Merit versus Reverse Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBV2101LT1/MV2101

500
300
200
100
MV2115
50
30
20

TA = 25C
f = 50 MHz
2.0

1000

10
10

TA = 25C
VR = 4.0 Vdc
20

MMBV2109LT1/MV2109

100
30
50
70
f, FREQUENCY (MHz)

200

250

Figure 5. Figure of Merit versus Frequency

5137

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBV3102LT1

Silicon Tuning Diode

Motorola Preferred Device

This device is designed in the Surface Mount package for general frequency control
and tuning applications. It provides solidstate reliability in replacement of mechanical
tuning methods.

22 pF (Nominal)
30 VOLTS
VOLTAGE VARIABLE
CAPACITANCE DIODE

High Q with Guaranteed Minimum Values at VHF Frequencies


Controlled and Uniform Tuning Ratio

3
Cathode

1
Anode

1
2

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Reverse Voltage

VR

30

Vdc

Forward Current

IF

200

mAdc

Device Dissipation @ TA = 25C


Derate above 25C

PD

225
1.8

mW
mW/C

Junction Temperature

TJ

+125

Tstg

55 to +150

Storage Temperature Range

DEVICE MARKING
MMBV3102LT1 = M4C

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic
Reverse Breakdown Voltage
(IR = 10 Adc)
Reverse Voltage Leakage Current
(VR = 25 Vdc, TA = 25C)
Diode Capacitance Temperature Coefficient
(VR = 4.0 Vdc, f = 1.0 MHz)

Symbol

Min

Typ

Max

Unit

V(BR)R

30

Vdc

IR

0.1

Adc

TCC

300

ppm/C

Ct, Diode Capacitance


VR = 3.0 Vdc, f = 1.0 MHz
pF
Device
MMBV3102LT1

Q, Figure of Merit
VR = 3.0 Vdc
f = 50 MHz

CR, Capacitance Ratio


C3/C25
f = 1.0 MHz

Min

Nom

Max

Min

Min

Typ

20

22

25

200

4.5

4.8

Preferred devices are Motorola recommended choices for future use and best overall value.

5138

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBV3102LT1
TYPICAL CHARACTERISTICS
20

40
Q, FIGURE OF MERIT (x 1000)

CT , DIODE CAPACITANCE (pF)

36
32
28
24
20
16
12

f = 1.0 MHz
TA = 25C

8.0

0.5

1.0

1.0

2.0 3.0

5.0

10

0.3
0.2

20 30

3.0

6.0

9.0

12

15

18

21

24

VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Diode Capacitance

Figure 2. Figure of Merit

C T , DIODE CAPACITANCE (NORMALIZED)

I R , REVERSE CURRENT (nA)

3.0
2.0

VR, REVERSE VOLTAGE (VOLTS)

100

10
VR = 20 Vdc
1.0

0.1

0.01

0.001
60

5.0

0.5

4.0
0
0.3

TA = 25C
f = 50 MHz

10

20

+20

+60

+100

+140

27

30

1.04
1.03

VR = 3.0 Vdc
f = 1.0 MHz

1.02
1.01
1.00
0.99
0.98
0.97
0.96
75

50

25

+25

+50

+75

TA, AMBIENT TEMPERATURE (C)

TA, AMBIENT TEMPERATURE (C)

Figure 3. Leakage Current

Figure 4. Diode Capacitance

+100

+125

NOTES ON TESTING AND SPECIFICATIONS


1. CR is the ratio of CT measured at 3.0 Vdc divided by CT measured at 25 Vdc.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5139

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MMBV3401LT1

Silicon Pin Diode

Motorola Preferred Device

This device is designed primarily for VHF band switching applications but is also
suitable for use in generalpurpose switching circuits. Supplied in a Surface Mount
package.

SILICON PIN
SWITCHING DIODE

Rugged PIN Structure Coupled with Wirebond Construction


for Optimum Reliability
Low Capacitance 0.7 pF Typ at VR = 20 Vdc
Very Low Series Resistance at 100 MHz 0.34 Ohms (Typ)
@ IF = 10 mAdc

3
1

3
Cathode

1
Anode

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Reverse Voltage

VR

20

Vdc

Forward Power Dissipation @ TA = 25C


Derate above 25C

PD

200
2.0

mW
mW/C

Junction Temperature

TJ

+125

Tstg

55 to +150

Storage Temperature Range

DEVICE MARKING
MMBV3401LT1 = 4D

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

V(BR)R

35

Vdc

Diode Capacitance
(VR = 20 Vdc)

CT

1.0

pF

Series Resistance (Figure 5)


(IF = 10 mAdc, f = 100 MHz)

RS

0.7

Reverse Leakage Current


(VR = 25 Vdc)

IR

0.1

Adc

Characteristic
Reverse Breakdown Voltage
(IR = 10 Adc)

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

5140

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBV3401LT1
TYPICAL CHARACTERISTICS
50

1.4

I F , FORWARD CURRENT (mA)

R S , SERIES RESISTANCE (OHMS)

1.6

1.2
TA = 25C

1.0
0.8
0.6
0.4

40

30
TA = 25C
20

10

0.2
0

2.0

4.0

6.0

8.0

10

12

14

0
0.5

16

0.6

0.7

0.8

0.9

1.0

+100

+140

IF, FORWARD CURRENT (mA)

VF, FORWARD VOLTAGE (VOLTS)

Figure 1. Series Resistance

Figure 2. Forward Voltage


100

20
I R , REVERSE CURRENT ( A)

C T , DIODE CAPACITANCE (pF)

40
10
7.0
5.0

TA = 25C

2.0
1.0
0.7
0.5

10
4.0

VR = 25 Vdc

1.0
0.4
0.1
0.04
0.01
0.004

0.2
+3.0

3.0 6.0 9.0

12

15

18

21

24

27

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Diode Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.001
60

20

+20

+60

TA, AMBIENT TEMPERATURE (C)

Figure 4. Leakage Current

5141

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

High Voltage Silicon Pin Diodes


These devices are designed primarily for VHF band switching applications but are
also suitable for use in generalpurpose switching circuits. They are supplied in a
costeffective plastic package for economical, highvolume consumer and industrial
requirements. They are also available in surface mount.

MMBV3700LT1
MPN3700
SILICON PIN
SWITCHING DIODES

Long Reverse Recovery Time


trr = 300 ns (Typ)
Rugged PIN Structure Coupled with Wirebond
Construction for Optimum Reliability

Low Series Resistance @ 100 MHz


RS = 0.7 Ohms (Typ) @ IF = 10 mAdc

Reverse Breakdown Voltage = 200 V (Min)

3
Cathode

CASE 318 08, STYLE 8


SOT 23 (TO 236AB)

1
Anode
SOT23

2
Cathode

1
Anode
TO92

1
2

CASE 18202, STYLE 1


TO92 (TO226AC)

MAXIMUM RATINGS
Rating

Symbol

Reverse Voltage

VR

Total Power Dissipation


@ TA = 25C
Derate above 25C

PD

MPN3700

MMBV3700LT1
200

Vdc

280
2.8

Junction Temperature
Storage Temperature Range

Unit

200
2.0

mW
mW/C

TJ

+125

Tstg

55 to +150

DEVICE MARKING
MMBV3700LT1 = 4R

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Reverse Breakdown Voltage


(IR = 10 Adc)

V(BR)R

200

Vdc

Diode Capacitance
(VR = 20 Vdc, f = 1.0 MHz)

CT

1.0

pF

Series Resistance (Figure 5)


(IF = 10 mAdc)

RS

0.7

1.0

Reverse Leakage Current


(VR = 150 Vdc)

IR

0.1

Adc

Reverse Recovery Time


(IF = IR = 10 mAdc)

trr

300

ns

Characteristic

5142

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMBV3700LT1 MPN3700
TYPICAL CHARACTERISTICS
800
700

2.8

I F , FORWARD CURRENT (mA)

R S , SERIES RESISTANCE (OHMS)

3.2
TA = 25C

2.4
2.0
1.6
1.2
0.8

2.0

6.0

4.0

8.0

10

12

14

400

TA = 25C

300
200

16

0.7

0.8

0.9

1.0

IF, FORWARD CURRENT (mA)

VF, FORWARD VOLTAGE (VOLTS)

Figure 1. Series Resistance

Figure 2. Forward Voltage

10
8.0
6.0

100
40

4.0
TA = 25C

2.0
1.0
0.8
0.6
0.4

I R , REVERSE CURRENT ( A)

C T , DIODE CAPACITANCE (pF)

500

100

0.4
0

600

0.2

10
4.0

VR = 15 Vdc

1.0
0.4
0.1
0.04
0.01
0.004

0.1

10

20

30

40

50

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Diode Capacitance

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.001
60

20

+20

+60

+100

+140

TA, AMBIENT TEMPERATURE (C)

Figure 4. Leakage Current

5143

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

SOD-123 Schottky Barrier Diodes

MMSD301T1
MMSD701T1

The MMSD301T1, and MMSD701T1 devices are spinoffs of our popular


MMBD301LT1, and MMBD701LT1 SOT23 devices. They are designed for
highefficiency UHF and VHF detector applications. Readily available to many other
fast switching RF and digital applications.

Motorola Preferred Devices

Extremely Low Minority Carrier Lifetime


Very Low Capacitance
Low Reverse Leakage

1
Cathode

2
Anode

CASE 42504, STYLE 1


SOD123

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

VR

30
70

Vdc

Forward Power Dissipation


TA = 25C

PF

225

mW

Junction Temperature

TJ

55 to +125

Tstg

55 to +150

Reverse Voltage

MMSD301T1
MMSD701T1

Storage Temperature Range

DEVICE MARKING
MMSD301T1 = XT, MMSD701T1 = XH

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic
Reverse Breakdown Voltage
(IR = 10 A)
Diode Capacitance
(VR = 0, f = 1.0 MHz, Note 1)

Symbol

Typ

Max

30
70

0.9
0.5

1.5
1.0

0.9
0.5

1.5
1.0

13
9.0

200
200

0.38
0.52
0.42
0.7

0.45
0.6
0.5
1.0

V(BR)R
MMSD301T1
MMSD701T1

MMSD301T1
MMSD701T1

Reverse Leakage
(VR = 25 V)
(VR = 35 V)

MMSD301T1
MMSD701T1

Unit
Volts

CT
MMSD301T1
MMSD701T1

Total Capacitance
(VR = 15 Volts, f = 1.0 MHz)
(VR = 20 Volts, f = 1.0 MHz)

Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mA)
(IF = 1.0 mAdc)
(IF = 10 mA)

Min

pF

CT

pF

IR

VF
MMSD301T1
MMSD701T1

nAdc
nAdc
Vdc

Preferred devices are Motorola recommended choices for future use and best overall value.

(Replaces MMSD101T1/D)

5144

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MMSD301T1 MMSD701T1
TYPICAL CHARACTERISTICS
MMSD301T1
2.8

500

t , MINORITY CARRIER LIFETIME (ps)

CT, TOTAL CAPACITANCE (pF)

MMSD301T1
f = 1.0 MHz

2.4
2.0
1.6
1.2
0.8
0.4
0

MMSD301T1
400
KRAKAUER METHOD
300

200

100

0
0

3.0

6.0

9.0
12
15
18
21
VR, REVERSE VOLTAGE (VOLTS)

24

27

30

Figure 1. Total Capacitance

20

40
60
30
50
70
IF, FORWARD CURRENT (mA)

80

90

100

Figure 2. Minority Carrier Lifetime

10

100
MMSD301T1
IF, FORWARD CURRENT (mA)

MMSD301T1
IR, REVERSE LEAKAGE ( m A)

10

TA = 100C

1.0

TA = 75C
0.1

TA = 85C

1.0

TA = 25C

0.01

TA = 40C
10

0.001

TA = 25C

0.1
0

6.0

12
18
VR, REVERSE VOLTAGE (VOLTS)

24

30

Figure 3. Reverse Leakage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

0.2

0.4

0.6
0.8
VF, FORWARD VOLTAGE (VOLTS)

1.0

1.2

Figure 4. Forward Voltage

5145

MMSD301T1 MMSD701T1
TYPICAL CHARACTERISTICS
MMSD701T1
2.0

500

t , MINORITY CARRIER LIFETIME (ps)

CT, TOTAL CAPACITANCE (pF)

MMSD701T1
f = 1.0 MHz
1.6

1.2

0.8

0.4

MMSD701T1
400
KRAKAUER METHOD
300

200

100

0
0

5.0

10

15
20
25
30
35
VR, REVERSE VOLTAGE (VOLTS)

40

45

50

10

Figure 5. Total Capacitance

80

90

100

Figure 6. Minority Carrier Lifetime

10

100
MMSD701T1

MMSD701T1
IF, FORWARD CURRENT (mA)

IR, REVERSE LEAKAGE ( m A)

30
50
70
40
60
IF, FORWARD CURRENT (mA)

20

TA = 100C

1.0

TA = 75C
0.1

10
TA = 85C

TA = 40C

1.0

0.01

TA = 25C

0.001

0.1
0

10

20
30
VR, REVERSE VOLTAGE (VOLTS)

Figure 7. Reverse Leakage

5146

TA = 25C

40

50

0.2

0.4

0.8
1.2
VF, FORWARD VOLTAGE (VOLTS)

1.6

2.0

Figure 8. Forward Voltage

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Switching Diode

MMSD914T1

The switching diode has the following features:

Motorola Preferred Device

SOD123 Surface Mount Package


High Breakdown Voltage
Fast Speed Switching Time
1
Cathode

2
Anode
1

CASE 42504, STYLE 1


SOD123

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Continuous Reverse Voltage

VR

100

Vdc

Peak Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Symbol

Max

Unit

Total Device Dissipation FR5 Board(1)


TA = 25C
Derate above 25C

PD

225

mW

1.8

mW/C

Thermal Resistance Junction to Ambient

RqJA

556

C/W

PD

300

mW

2.4

mW/C

RqJA

417

C/W

TJ, Tstg

55 to +150

Peak Forward Surge Current

DEVICE MARKING
MMSD914T1 = 5D

THERMAL CHARACTERISTICS
Characteristic

Total Device Dissipation


Alumina Substrate(2) TA = 25C
Derate above 25C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)

100

Vdc

IR

25
5.0

nAdc
mAdc

Forward Voltage (IF = 10 mAdc)

VF

1000

mVdc

Diode Capacitance (VR = 0 Vdc, f = 1.0 MHz)

CD

4.0

pF

Reverse Recovery Time (IF = IR = 10 mAdc) (Figure 1)

trr

4.0

ns

OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100 Adc)
Reverse Voltage Leakage Current (VR = 20 Vdc)
(VR = 75 Vdc)

1. FR5 = 1.0 x 0.75 x 0.062 in.


2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5147

MMSD914T1
820
+10 V

2k
100 H

0.1 F

tr

IF

0.1 F

tp

IF

trr

10%

DUT
50 OUTPUT
PULSE
GENERATOR

50 INPUT
SAMPLING
OSCILLOSCOPE

90%
iR(REC) = 1 mA

IR

VR

OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)

INPUT SIGNAL

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp trr

Figure 1. Recovery Time Equivalent Test Circuit

100

10

I R, REVERSE CURRENT ( A)

IF, FORWARD CURRENT (mA)

TA = 150C

10
TA = 85C

TA = 40C

1.0
TA = 25C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.1
0.2

0.4

0.6

0.8

1.0

0.001

1.2

10

20

30

VF, FORWARD VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Forward Voltage

Figure 3. Leakage Current

40

50

CD , DIODE CAPACITANCE (pF)

0.68

0.64

0.60

0.56

0.52

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

5148

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Silicon Pin Diode

MPN3404

This device is designed primarily for VHF band switching applications but is also
suitable for use in generalpurpose switching circuits. It is supplied in a costeffective
TO92 type plastic package for economical, highvolume consumer and industrial
requirements.

SILICON PIN
SWITCHING DIODE

Rugged PIN Structure Coupled with Wirebond


Construction for Optimum Reliability
Low Series Resistance @ 100 MHz
RS = 0.7 Ohms (Typ) @ IF = 10 mAdc
Sturdy TO92 Style Package for Handling Ease
1
Anode

2
Cathode

1
2

CASE 18202, STYLE 1


TO92 (TO226AC)

MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Reverse Voltage

VR

20

Vdc

Forward Power Dissipation @ TA = 25C


Derate above 25C

PD

400
4.0

mW
mW/C

Junction Temperature

TJ

+125

Tstg

55 to +150

Storage Temperature Range

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Symbol

Min

Typ

Max

Unit

Reverse Breakdown Voltage


(IR = 10 Adc)

V(BR)R

20

Vdc

Diode Capacitance
(VR = 15 Vdc, f = 1.0 MHz)

CT

1.3

2.0

pF

Series Resistance (Figure 5)


(IF = 10 mAdc)

RS

0.7

0.85

Reverse Leakage Current


(VR = 15 Vdc)

IR

0.1

Adc

Characteristic

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5149

MPN3404
TYPICAL CHARACTERISTICS
50

1.6

I F , FORWARD CURRENT (mA)

R S , SERIES RESISTANCE (OHMS)

1.8

1.4
1.2
1.0
0.8

40

30
TA = 25C
20

10

0.6
0.4

2.0

4.0

6.0

8.0

10

12

0
0.5

14

0.6

0.7

0.9

1.0

+100

+140

0.8

IF, FORWARD CURRENT (mA)

VF, FORWARD VOLTAGE (VOLTS)

Figure 1. Series Resistance

Figure 2. Forward Voltage

10

100

5.0

I R , REVERSE CURRENT ( A)

C T , DIODE CAPACITANCE (pF)

40
7.0
TA = 25C

4.0
3.0
2.0

10
4.0

VR = 15 Vdc

1.0
0.4
0.1
0.04
0.01
0.004

1.0
+3.0

3.0

6.0

9.0

12

15

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Diode Capacitance

5150

18

21

0.001
60

20

+20

+60

TA, AMBIENT TEMPERATURE (C)

Figure 4. Leakage Current

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Switching Diode


Common Cathode

MSD6100

Anode 1

2 Anode
1
2

CASE 2904, STYLE 3


TO92 (TO226AA)

3 Cathode

MAXIMUM RATINGS (EACH DIODE)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

100

Vdc

Recurrent Peak Forward Current

IF

200

mAdc

IFM(surge)

500

mAdc

Power Dissipation @ TA = 25C


Derate above 25C

PD(1)

625
5.0

mW
mW/C

Operating and Storage Junction


Temperature Range

TJ, Tstg(1)

55 to +135

Peak Forward Surge Current


(Pulse Width = 10 sec)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic
Breakdown Voltage
(I(BR) = 100 Adc)

Symbol

Min

Max

Unit

V(BR)

100

Vdc

5.0
0.1
50

0.55
0.67
0.75

0.7
0.82
1.1

Adc

Reverse Current
(VR = 100 Vdc)
(VR = 50 Vdc)
(VR = 50 Vdc, TA = 125C)

IR

Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 100 mAdc)

VF

Capacitance
(VR = 0)

1.5

pF

Reverse Recovery Time


(IF = IR = 10 mAdc, VR = 5.0 Vdc, irr = 1.0 mAdc)

trr

4.0

ns

Vdc

1. Continuous package improvements have enhanced these guaranteed Maximum Ratings as follows: PD = 1.0 W @ TC = 25C,
Derate above 25C 8.0 mW/C, TJ = 65 to +150C, JC = 125C/W.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5151

MSD6100
TYPICAL CHARACTERISTICS
Curves Applicable to Each Anode
10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C
TA = 85C
10
TA = 40C

1.0

TA = 25C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

1.2

10

Figure 1. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 2. Leakage Current

CD, DIODE CAPACITANCE (pF)

1.0

0.9

0.8

0.7

0.6

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Capacitance

5152

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Dual Diode
Common Anode

MSD6150

3 Anode
1
2

CASE 2904, STYLE 4


TO92 (TO226AA)
Cathode 1

2 Cathode

MAXIMUM RATINGS (EACH DIODE)


Rating

Symbol

Value

Unit

Reverse Voltage

VR

70

Vdc

Peak Forward Recurrent Current

IF

200

mAdc

IFM(surge)

500

mAdc

PD(1)

625
5.0

mW
mW/C

TJ, Tstg(1)

55 to +135

Peak Forward Surge Current


(Pulse Width = 10 sec)
Total Device Dissipation @ TA = 25C
Derate above 25C
Operating and Storage Junction
Temperature Range

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)

70

Vdc

Reverse Current
(VR = 50 Vdc)

IR

0.1

Adc

Forward Voltage
(IF = 10 mAdc)

VF

0.80

1.0

Vdc

Capacitance
(VR = 0)

5.0

8.0

pF

Reverse Recovery Time


(IF = IR = 10 mAdc, VR = 5.0 Vdc, irr = 1.0 mAdc)

trr

100

ns

Breakdown Voltage
(I(BR) = 100 Adc)

1. Continuous package improvements have enhanced these guaranteed Maximum Ratings as follows: PD = 1.0 W @ TC = 25C,
Derate above 8.0 mW/C, PD = 10 W @ TC = 25C, Derate above 80 mW/C, TJ, Tstg = 55 to +150C, JC = 12.5C/W, JA = 125C.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5153

MSD6150
TYPICAL CHARACTERISTICS
Curves Applicable to Each Cathode
10

100
IR , REVERSE CURRENT (A)

IF, FORWARD CURRENT (mA)

TA = 150C
TA = 85C
10
TA = 40C

1.0

TA = 25C

TA = 125C

1.0

TA = 85C

0.1

TA = 55C
0.01
TA = 25C

0.001

0.1
0.2

0.4

0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)

1.2

10

Figure 1. Forward Voltage

20
30
40
VR, REVERSE VOLTAGE (VOLTS)

50

Figure 2. Leakage Current

CD, DIODE CAPACITANCE (pF)

1.75

1.5

1.25

1.0

0.75

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Capacitance

5154

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Silicon Tuning Diode

MV104

This device is designed for FM tuning, general frequency control and tuning, or any
topoftheline application requiring backtoback diode configurations for minimum
signal distortion and detuning.

DUAL
VOLTAGE VARIABLE
CAPACITANCE DIODE

High Figure of Merit Q = 140 (Typ) @ VR = 3.0 Vdc, f = 100 MHz


Guaranteed Capacitance Range
3742 pF @ VR = 3.0 Vdc (MV104)
Dual Diodes Save Space and Reduce Cost
Monolithic Chip Provides Near Perfect Matching Guaranteed 1.0%
(Max) Over Specified Tuning Range

1
2

Pin 1
A1

Pin 3
A2
Pin 2

CASE 29 04, STYLE 15


TO92 (TO 226AA)

MAXIMUM RATINGS (EACH DIODE)


Symbol

Value

Unit

Reverse Voltage

Rating

VR

32

Vdc

Forward Current

IF

200

mAdc

Total Power Dissipation @ TA = 25C


Derate above 25C

PD

280
2.8

mW
mW/C

TJ

+125

Tstg

55 to +150

Junction Temperature
Storage Temperature Range

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (EACH DIODE)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

32

Vdc

Reverse Voltage Leakage Current TA = 25C


(VR = 30 Vdc)
TA = 60C

IR

50
500

nAdc

Diode Capacitance Temperature Coefficient


(VR = 4.0 Vdc, f = 1.0 MHz)

TCC

280

ppm/C

Reverse Breakdown Voltage


(IR = 10 Adc)

CT, Diode Capacitance


VR = 3.0 Vdc, f = 1.0 MHz
pF
Device
MV104

Q, Figure of Merit
VR = 3.0 Vdc
f = 100 MHz

CR, Capacitance Ratio


C3/C30
f = 1.0 MHz

Min

Max

Min

Typ

Min

Max

37

42

100

140

2.5

2.8

REV 1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5155

MV104
TYPICAL CHARACTERISTICS (Each Diode)
550

70
Q, FIGURE OF MERIT

CT , DIODE CAPACITANCE (pF)

100

40

20

350

250

TA = 25C
f = 100 MHz

150

10
0.3

0.5

2.0

1.0

3.0

5.0 7.0 10

20

3.0

9.0

6.0

12

15

18

24

21

27

VR, REVERSE VOLTAGE (VOLTS)

VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Diode Capacitance (Each Diode)

Figure 2. Figure of Merit versus Voltage

CT , DIODE CAPACITANCE (NORMALIZED)

1000

VR = 3.0 Vdc
TA = 25C

500

200
100
50
20
10

50

30

2000

Q, FIGURE OF MERIT

450

20

30

50

70

100

1.04
VR = 2.0 V

1.03
1.02

4.0 V
1.01
1.00

30 V

0.99
NORMALIZED to CT
at TA = 25C

0.98
0.97
0.96
75

200 300

30

50

25

+25

+50

+75

+100

+125

f, FREQUENCY (MHz)

TJ, JUNCTION TEMPERATURE (C)

Figure 3. Figure of Merit versus Frequency

Figure 4. Diode Capacitance versus Temperature

100
I R , REVERSE CURRENT (nA)

50

TA = 125C

20
10
5
TA = 75C

2
1
0.5
0.2
0.1

TA = 25C

0.05
0.02
0.01

5.0

10

15

20

25

30

VR, REVERSE VOLTAGE (VOLTS)

Figure 5. Reverse Current versus Reverse Voltage

5156

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Silicon Hyper-Abrupt Tuning Diodes

MV1403
MV1404
MV1405

These devices are designed with high capacitance and a capacitance change of
greater than TEN TIMES for a bias change from 2.0 to 10 volts. They provide tuning
over broad frequency ranges; tune AM radio broadcast band, general AFC and tuning
applications in lower RF frequencies.
High Capacitance: 120250 pF
Large Capacitance Change with Small Bias Change

120 250 pF
12 VOLTS
HIGH TUNING RATIO
VOLTAGEVARIABLE
CAPACITANCE DIODES

Guaranteed High Q
Available in Standard Axial Glass Packages

2
Anode

1
Cathode
2

MAXIMUM RATINGS
Symbol

Value

Unit

Reverse Voltage

Rating

VR

12

Vdc

Forward Current

IF

250

mAdc

Device Dissipation @ TA = 25C


Derate above 25C

PD

400
2.67

mW
mW/C

Junction Temperature

TJ

+125

Tstg

65 to + 200

Storage Temperature Range

CASE 5102
(DO204AA)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

12

Vdc

Reverse Voltage Leakage Current


(VR = 10 Vdc, TA = 25C)

IR

0.1

Adc

Series Inductance
(f = 250 MHz, Lead Length 1/16)

LS

5.0

nH

Case Capacitance
(f = 1.0 MHz, Lead Length 1/16)

CC

0.25

pF

Reverse Breakdown Voltage


(IR = 10 Adc)

Device
MV1403
MV1404
MV1405

CT, Diode Capacitance

Q, Figure of Merit

TR, Tuning Ratio

VR = 2.0 Vdc, f = 1.0 MHz


pF

VR = 2.0 Vdc,
f = 1.0 MHz

C1/C10
f = 1.0 MHz

C2/C10
f = 1.0 MHz

Min

Nom

Max

Min

Min

Min

140
96
200

175
120
250

210
144
300

200
200
200

10
10
10

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5157

MV1403 MV1404 MV1405

500

TA = 25C
f = 1 MHz

300
200

C T , DIODE CAPACITANCE (pF)

C T , DIODE CAPACITANCE (NORMALIZED)

TYPICAL CHARACTERISTICS

100

MV1405
MV1403

50

MV1404

30
20
10
0

8
5
3
4
6
7
VR, REVERSE VOLTAGE (VOLTS)

1.08

1.04

VR = 2 Vdc

1.02
1
0.98
0.96
0.94
0.92
50

10

f = 1.0 MHz

1.06

25

25

50

75

100

125

150

TA, AMBIENT TEMPERATURE (C)

Figure 1. Diode Capacitance versus


Reverse Voltage

Figure 2. Diode Capacitance versus


Ambient Temperature

1000

Q, FIGURE OF MERIT

VR = 4 Vdc

VR = 6 Vdc

VR = 2 Vdc
100

10

20
5
10
f, FREQUENCY (MHz)

50

100

Figure 3. Figure of Merit versus Frequency

5158

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Silicon Tuning Diodes

MV1626 thru
MV1650

These epitaxial passivated tuning diodes are designed for AFC applications in
radio, TV, and general electronictuning.
Maximum Working Voltage of 20 V
Excellent Q Factor at High Frequencies

6.8 100 pF
20 VOLTS
VOLTAGEVARIABLE
CAPACITANCE DIODES

SolidState Reliability to Replace Mechanical Tuning Methods

2
Anode

1
Cathode

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Reverse Voltage

VR

20

Vdc

Forward Current

IF

250

mAdc

Device Dissipation @ TA = 25C


Derate above 25C

PD

400
2.67

mW
mW/C

Junction Temperature

TJ

+175

Tstg

65 to + 200

Storage Temperature Range

CASE 5102
DO204AA (DO7)

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

20

Vdc

Reverse Voltage Leakage Current


(VR = 15 Vdc, TA = 25C)

IR

0.10

Adc

Series Inductance
(f = 250 MHz, Lead Length 1/16)

LS

4.0

nH

Case Capacitance
(f = 1.0 MHz, Lead Length 1/16)

CC

0.17

pF

Reverse Breakdown Voltage


(IR = 10 Adc)

CT, Diode Capacitance


VR = 4.0 Vdc, f = 1.0 MHz
pF
Device
MV1626
MV1628
MV1630
MV1634
MV1638
MV1648
MV1650

Q, Figure of Merit
VR = 4.0 Vdc,
f = 50 MHz

TR, Tuning Ratio


C2/C20
f = 1.0 MHz

Min

Nom

Max

Typ

Min

Max

10.8
13.5
16.2
19.8
29.7
73.8
90.0

12.0
15.0
18.0
22.0
33.0
82.0
100.0

13.2
16.5
19.8
24.2
36.3
90.2
110.0

300
250
250
250
200
150
150

2.0
2.0
2.0
2.0
2.0
2.0
2.0

3.2
3.2
3.2
3.2
3.2
3.2
3.2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5159

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MV7005T1

Silicon Tuning Diode

Motorola Preferred Device

This silicon tuning diode is designed for use in high capacitance, hightuning ratio
applications. The device is housed in the SOT-223 package which is designed for
medium power surface mount applications.
Guaranteed Capacitance Range

SOT223 PACKAGE
HIGH CAPACITANCE
VOLTAGE VARIABLE DIODE
SURFACE MOUNT

The SOT-223 Package can be soldered using wave or reflow.


SOT223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering eliminating the possibility of
damage to the die.

2
3

1
ANODE

2, 4
CATHODE

CASE 318E 04, STYLE 2


SOT 223 (TO 261AA)

MAXIMUM RATINGS
Rating
Reverse Voltage

Symbol

Value

Unit

VR

15

Vdc

Forward Current

IF

50

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

800
6.4

mW
mW/C

Junction Temperature

TJ

+125

Tstg

55 to +125

Storage Temperature Range


1. FR-4 board, 0.0625 in2, 2 oz. copper.

DEVICE MARKING
MV7005T1 = V7005

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Max

Unit

V(BR)R

15

Vdc

Reverse Voltage Leakage Current


(VR = 9.0 Vdc)

IR

100

nAdc

Diode Capacitance
(VR = 1.0 Vdc, f = 1.0 MHz)

CT

400

520

pF

Capacitance Ratio C1/C9


(f = 1.0 MHz)

CR

12

150

Reverse Breakdown Voltage


(IR = 10 Adc)

Figure of Merit
(VR = 1.0 Vdc, f = 1.0 MHz)

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

5160

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MV7005T1
TYPICAL CHARACTERISTICS
CT , DIODE CAPACITANCE (NORMALIZED)

CT , DIODE CAPACITANCE (pF)

1000
500

100

f = 1.0 MHz
TA = 25C
10

1.06
VR = 1.0 Vdc
1.04
1.02
1.00
0.98
0.96
0.94
50

VR = 9.0 Vdc

25

+25

+50

+75

+100

VR, REVERSE VOLTAGE (VOLTS)

TA, AMBIENT TEMPERATURE (C)

Figure 1. Diode Capacitance versus


Reverse Voltage

Figure 2. Diode Capacitance versus


Ambient Temperature

+125

Q, FIGURE OF MERIT (x 100)

100
f = 1.0 MHz
TA = 25C

50

10
5
3

10

20

VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Figure of Merit

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5161

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MV7404T1

Silicon Hyper-Abrupt Tuning Diode

Motorola Preferred Device

This silicon tuning diode is designed for high capacitance and a tuning ratio of
greater than 10 times over a bias range of 2.0 to 10 volts. It provides tuning over a
broad frequency range from the AM broadcast band to 100 MHz. The device is
housed in the SOT-223 package which is designed for medium power surface mount
applications.

SOT223 PACKAGE
HIGH TUNING RATIO
VOLTAGE VARIABLE
SURFACE MOUNT
DIODE

High Capacitance
Large Capacitance Change with Small Bias Change
Guaranteed High Q
The SOT-223 Package can be soldered using wave or reflow.

SOT223 package ensures level mounting which results in improved thermal conduction and allows visual inspection of soldered joints. The formed
leads absorb thermal stress during soldering, eliminating the possibility of
damage to the die.
1
ANODE

2
3

CASE 318E 04, STYLE 2


SOT 223 (TO 261AA)

2, 4
CATHODE

MAXIMUM RATINGS (TC = 25C unless otherwise noted)


Symbol

Value

Unit

Reverse Voltage

VR

12

Vdc

Forward Current

IF

250

mAdc

Total Power Dissipation @ TA = 25C(1)


Derate above 25C

PD

800
6.4

mW
mW/C

TJ, Tstg

55 to +125

TL

260
10

C
Sec

Rating

Operating and Storage Temperature Range


Lead Temperature for Soldering Purposes, 1/6 from case
Time in Solder Bath
1. FR-4 board, 0.0625 in2, 2 oz. copper.

DEVICE MARKING
MV7404T1 = V7404

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic

Symbol

Min

Typ

Max

Unit

V(BR)R

12

Vdc

Reverse Voltage Leakage Current


(VR = 10 Vdc, f = 1.0 MHz)

IR

100

nAdc

Diode Capacitance
(VR = 2.0 Vdc, f = 1.0 MHz)

CT

96

120

144

pF

Figure of Merit
(VR = 2.0 Vdc, f = 1.0 MHz)

200

Tuning Ratio C2/C10


(f = 1.0 MHz)

TR

10

Reverse Breakdown Voltage


(IR = 10 Adc)

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

5162

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MV7404T1
TYPICAL CHARACTERISTICS
C T , DIODE CAPACITANCE (NORMALIZED)

C T , DIODE CAPACITANCE (pF)

500
TA = 25C
f = 1 MHz

200
100
50

20
10
5

8
4
6
VR, REVERSE VOLTAGE (VOLTS)

10

1.08

f = 1.0 MHz

1.06
1.04

VR = 2 Vdc

1.02
1
0.98
0.96
0.94
0.92
50

25

25

50

75

100

125

150

TA, AMBIENT TEMPERATURE (C)

Figure 1. Diode Capacitance versus


Reverse Voltage

Figure 2. Diode Capacitance versus


Ambient Temperature

1000

Q, FIGURE OF MERIT

VR = 4 Vdc

VR = 6 Vdc

VR = 2 Vdc
100

10

20
5
10
f, FREQUENCY (MHz)

50

100

Figure 3. Figure of Merit versus Frequency

Motorola SmallSignal Transistors, FETs and Diodes Device Data

5163

5164

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Section 6
Tape and Reel Specifications
and Packaging Specifications

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Tape and Reel Specifications


61

Tape and Reel Specifications


and Packaging Specifications
Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as the
shipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a secure
cavity for the product when sealed with the peelback cover tape.

SOD123, SC59, SC70/SOT323, SC70ML/SOT363,


SOT23, TSOP6, in 8 mm Tape
SOT223 in 12 mm Tape
SO14, SO16 in 16 mm Tape

Two Reel Sizes Available (7 and 13)


Used for Automatic Pick and Place Feed Systems
Minimizes Product Handling
EIA 481, 1, 2

Use the standard device title and add the required suffix as listed in the option table on the following page. Note that the individual
reels have a finite number of devices depending on the type of product contained in the tape. Also note the minimum lot size is
one full reel for each line item, and orders are required to be in increments of the single reel quantity.

SOD123

SC59, SC70/SOT323, SOT23

8 mm

8 mm

SOT223

SC70ML/SOT363, TSOP6
T1 ORIENTATION
8 mm

SO14, 16

12 mm

16 mm

SC70ML/SOT363
T2 ORIENTATION

DIRECTION

8 mm

OF FEED

EMBOSSED TAPE AND REEL ORDERING INFORMATION


Devices Per Reel
and Minimum
Order Quantity

Device
Suffix

(7)

3,000

T1

178
330

(7)
(13)

3,000
10,000

T1
T3

8.0 0.1 (.315 .004)

178
330

(7)
(13)

500
2,500

R1
R2

16
16

8.0 0.1 (.315 .004)

178
330

(7)
(13)

500
2,500

R1
R2

SOD123

8
8

4.0 0.1 (.157 .004)

178
330

(7)
(13)

3,000
10,000

T1
T3

SOT23

8
8

4.0 0.1 (.157 .004)

178
330

(7)
(13)

3,000
10,000

T1
T3

SOT223

12
12

8.0 0.1 (.315 .004)

178
330

(7)
(13)

1,000
4,000

T1
T3

SC70ML/SOT363

8
8

4.0 0.1 (.157 .004)

178
178

(7)
(7)

3,000
3,000

T1
T2

TSOP6

4.0 0.1 (.157 .004)

178

(7)

3,000

T1

Package

Tape Width
(mm)

Pitch
mm
(inch)

SC59

4.0 0.1 (.157 .004)

178

SC70/SOT323

8
8

4.0 0.1 (.157 .004)

SO14

16
16

SO16

Tape and Reel Specifications


62

Reel Size
mm
(inch)

Motorola SmallSignal Transistors, FETs and Diodes Device Data

EMBOSSED TAPE AND REEL DATA FOR DISCRETES


CARRIER TAPE SPECIFICATIONS

P0

P2

10 Pitches Cumulative Tolerance on Tape


0.2 mm
( 0.008)
E

Top Cover
Tape

A0

K0

B1

B0

See
Note 1

For Machine Reference Only


Including Draft and RADII
Concentric Around B0

D1
For Components
2.0 mm x 1.2 mm and Larger

Center Lines
of Cavity

Embossment

User Direction of Feed


* Top Cover Tape
Thickness (t1)
0.10 mm
(.004) Max.

Bar Code Label


R Min
Tape and Components
Shall Pass Around Radius R
Without Damage
Bending Radius
10

Embossed Carrier
100 mm
(3.937)

Maximum Component Rotation

Embossment
1 mm Max

Typical Component
Cavity Center Line
Tape
1 mm
(.039) Max
Typical Component
Center Line

250 mm
(9.843)

Camber (Top View)


Allowable Camber To Be 1 mm/100 mm Nonaccumulative Over 250 mm

DIMENSIONS
Tape
Size

B1 Max

D1

P0

P2

R Min

T Max

W Max

8 mm

4.55 mm
(.179)

1.0 Min
(.039)

1.75 0.1 mm
(.069 .004)

3.5 0.05 mm
(.138 .002)

2.4 mm Max
(.094)

4.0 0.1 mm
(.157 .004)

2.0 0.1 mm
(.079 .002)

25 mm
(.98)

0.6 mm
(.024)

8.3 mm
(.327)

12 mm

8.2 mm
(.323)

1.5 + 0.1 mm
0.0
( 0 9 + .004
004
(.059
0.0)

5.5 0.05 mm
(.217 .002)

6.4 mm Max
(.252)

16 mm

12.1 mm
(.476)

7.5 0.10 mm
(.295 .004)

7.9 mm Max
(.311)

16.3 mm
(.642)

24 mm

20.1 mm
(.791)

11.5 0.1 mm
(.453 .004)

11.9 mm Max
(.468)

24.3 mm
(.957)

1.5 mm Min
(.060)

30 mm
(1.18)

12 .30 mm
(.470 .012)

Metric dimensions govern English are in parentheses for reference only.


NOTE 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within .05 mm min. to .50 mm max.,
NOTE 1: the component cannot rotate more than 10 within the determined cavity.
NOTE 2: If B1 exceeds 4.2 mm (.165) for 8 mm embossed tape, the tape may not feed through all tape feeders.
NOTE 3: Pitch information is contained in the Embossed Tape and Reel Ordering Information on pg. 5.123.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Tape and Reel Specifications


63

EMBOSSED TAPE AND REEL DATA FOR DISCRETES


T Max
Outside Dimension
Measured at Edge

1.5 mm Min
(.06)
A

13.0 mm 0.5 mm
(.512 .002)

20.2 mm Min
(.795)

50 mm Min
(1.969)

Full Radius

Size

A Max

8 mm

330 mm
(12.992)

8.4 mm + 1.5 mm, 0.0


(.33 + .059, 0.00)

14.4 mm
(.56)

12 mm

330 mm
(12.992)

12.4 mm + 2.0 mm, 0.0


(.49 + .079, 0.00)

18.4 mm
(.72)

16 mm

360 mm
(14.173)

16.4 mm + 2.0 mm, 0.0


(.646 + .078, 0.00)

22.4 mm
(.882)

24 mm

360 mm
(14.173)

24.4 mm + 2.0 mm, 0.0


(.961 + .070, 0.00)

30.4 mm
(1.197)

Inside Dimension
Measured Near Hub

T Max

Reel Dimensions
Metric Dimensions Govern English are in parentheses for reference only

Tape and Reel Specifications


64

Motorola SmallSignal Transistors, FETs and Diodes Device Data

TO92 EIA, IEC, EIAJ


Radial Tape in Fan Fold
Box or On Reel

TO92
RADIAL
TAPE IN
FAN FOLD
BOX OR
ON REEL

Radial tape in fan fold box or on reel of the reliable TO92 package are
the best methods of capturing devices for automatic insertion in printed
circuit boards. These methods of taping are compatible with various
equipment for active and passive component insertion.

Available in Fan Fold Box


Available on 365 mm Reels
Accommodates All Standard Inserters
Allows Flexible Circuit Board Layout
2.5 mm Pin Spacing for Soldering
EIA468, IEC 2862, EIAJ RC1008B

Ordering Notes:
When ordering radial tape in fan fold box or on reel, specify the style per
Figures 3 through 8. Add the suffix RLR and Style to the device title, i.e.
MPS3904RLRA. This will be a standard MPS3904 radial taped and
supplied on a reel per Figure 9.
Fan Fold Box Information Order in increments of 2000.
Reel Information Order in increments of 2000.

US/European Suffix Conversions


US

EUROPE

RLRA

RL

RLRE

RL1

RLRM

ZL1

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Packaging Specifications
65

TO92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL


H2A

H2A

H2B

H2B

H
W2
H4 H5

T1
L1

H1
W1 W

T
T2

F1
F2
P2

P2

P1

Figure 1. Device Positioning on Tape

Specification
Inches
Symbol

Item

Millimeter

Min

Max

Min

Max

Tape Feedhole Diameter

0.1496

0.1653

3.8

4.2

D2

Component Lead Thickness Dimension

0.015

0.020

0.38

0.51

Component Lead Pitch

0.0945

0.110

2.4

2.8

.059

.156

1.5

4.0

0.3346

0.3741

8.5

9.5

Deflection Left or Right

0.039

1.0

Deflection Front or Rear

0.051

1.0

Feedhole to Bottom of Component

0.7086

0.768

18

19.5

Feedhole to Seating Plane

0.610

0.649

15.5

16.5

F1, F2
H
H1
H2A
H2B
H4
H5
L

Bottom of Component to Seating Plane


Feedhole Location

Defective Unit Clipped Dimension

0.3346

0.433

8.5

11

L1

Lead Wire Enclosure

0.09842

2.5

Feedhole Pitch

0.4921

0.5079

12.5

12.9

P1

Feedhole Center to Center Lead

0.2342

0.2658

5.95

6.75

P2

First Lead Spacing Dimension

0.1397

0.1556

3.55

3.95

0.06

0.08

0.15

0.20

Adhesive Tape Thickness

T1

Overall Taped Package Thickness

0.0567

1.44

T2

Carrier Strip Thickness

0.014

0.027

0.35

0.65

Carrier Strip Width

0.6889

0.7481

17.5

19

W1

Adhesive Tape Width

0.2165

0.2841

5.5

6.3

W2

Adhesive Tape Position

.0059

0.01968

.15

0.5

NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements established in Figures 5, 6 and 7.
4. Maximum noncumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.

Packaging Specifications
66

Motorola SmallSignal Transistors, FETs and Diodes Device Data

TO92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL


FAN FOLD BOX STYLES

ADHESIVE TAPE ON
TOP SIDE
FLAT SIDE

ADHESIVE TAPE ON
TOP SIDE
ROUNDED SIDE

CARRIER
STRIP

CARRIER
STRIP

Figure 2. Style M

252 mm
9.92

FLAT SIDE OF TRANSISTOR


AND ADHESIVE TAPE VISIBLE.
Style M fan fold box is equivalent to styles E and F of
reel pack dependent on feed orientation from box.

330 mm
13
MAX

ROUNDED SIDE OF TRANSISTOR AND


ADHESIVE TAPE VISIBLE.
Style P fan fold box is equivalent to styles A and B of
reel pack dependent on feed orientation from box.

Figure 3. Style P

MAX

58 mm

2.28
MAX

Figure 4. Fan Fold Box Dimensions

ADHESION PULL TESTS


500 GRAM PULL FORCE

70 GRAM
PULL FORCE

100 GRAM
PULL FORCE
16 mm

16 mm

HOLDING
FIXTURE

The component shall not pull free with a 300 gram


load applied to the leads for 3 1 second.

Figure 5. Test #1

HOLDING
FIXTURE

The component shall not pull free with a 70 gram


load applied to the leads for 3 1 second.

Figure 6. Test #2

Motorola SmallSignal Transistors, FETs and Diodes Device Data

HOLDING
FIXTURE
There shall be no deviation in the leads and
no component leads shall be pulled free of
the tape with a 500 gram load applied to the
component body for 3 1 second.

Figure 7. Test #3

Packaging Specifications
67

TO92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL


REEL STYLES
CORE DIA.
82mm 1mm

ARBOR HOLE DIA.


30.5mm 0.25mm
MARKING NOTE

HUB RECESS
76.2mm 1mm
RECESS DEPTH
9.5mm MIN

365mm + 3, 0mm
38.1mm 1mm

48 mm
MAX

Material used must not cause deterioration of components or degrade lead solderability

Figure 8. Reel Specifications

ADHESIVE TAPE ON REVERSE SIDE


CARRIER STRIP

CARRIER STRIP

ROUNDED
SIDE

FLAT SIDE

ADHESIVE TAPE

FEED

FEED

Rounded side of transistor and adhesive tape visible.

Flat side of transistor and carrier strip visible


(adhesive tape on reverse side).

Figure 9. Style A

Figure 10. Style B

ADHESIVE TAPE ON REVERSE SIDE


CARRIER STRIP

CARRIER STRIP
FLAT SIDE

ROUNDED
SIDE

ADHESIVE TAPE

FEED

FEED

Flat side of transistor and adhesive tape visible.

Figure 11. Style E

Packaging Specifications
68

Rounded side of transistor and carrier strip visible


(adhesive tape on reverse side).

Figure 12. Style F

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Section 7
Surface Mount
Information

In Brief . . .
Surface Mount Technology is now being utilized to offer
answers to many problems that have been created in the use
of insertion technology.
Limitations have been reached with insertion packages
and PC board technology. Surface Mount Technology offers
the opportunity to continue to advance the stateoftheart
designs that cannot be accomplished with insertion technology.
Surface Mount Packages allow more optimum device
performance with the smaller Surface Mount Configuration.
Internal lead lengths, parasitic capacitance and inductance
that placed limitations on chip performance have been
reduced.
The lower profile of Surface Mount Packages allows more
boards to be utilized in a given amount of space. They are
stacked closer together and utilize less total volume than insertion populated PC boards.
Printed circuit costs are lowered with the reduction of the
number of board layers required. The elimination or reduction of the number of plated through holes in the board contribute significantly to lower PC board prices.
Surface Mount assembly does not require the preparation
of components that is common on insertion technology lines.
Surface Mount components are sent directly to the assembly
line, eliminating an intermediate step.
Automatic placement equipment is available that can
place Surface Mount components at the rate of a few thousand per hour to hundreds of thousands of components per
hour.
Surface Mount Technology is cost effective, allowing the
manufacturer the opportunity to produce smaller units and
offer increased functions with the same size product.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Surface Mount Information


79

INFORMATION FOR USING SURFACE MOUNT PACKAGES


RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct
pad geometry, the packages will self align when subjected to
a solder reflow process.

POWER DISSIPATION FOR A SURFACE MOUNT DEVICE

PD =

TJ(max) TA
RJA

The values for the equation are found in the maximum


ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25C, one can
calculate the power dissipation of the device. For example,
for a SOT223 device, PD is calculated as follows.
PD = 150C 25C = 800 milliwatts
156C/W
The 156C/W for the SOT223 package assumes the use
of the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 800 milliwatts. There
are other alternatives to achieving higher power dissipation
from the surface mount packages. One is to increase the
area of the drain/collector pad. By increasing the area of the
drain/collector pad, the power dissipation can be increased.

Although the power dissipation can almost be doubled with


this method, area is taken up on the printed circuit board
which can defeat the purpose of using surface mount
technology. For example, a graph of RJA versus drain pad
area is shown in Figure 1.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
RJA , THERMAL RESISTANCE, JUNCTION
TO AMBIENT (C/W)

The power dissipation for a surface mount device is a function of the drain/collector pad size. These can vary from the
minimum pad size for soldering to a pad size given for
maximum power dissipation. Power dissipation for a surface
mount device is determined by TJ(max), the maximum rated
junction temperature of the die, RJA, the thermal resistance
from the device junction to ambient, and the operating
temperature, TA. Using the values provided on the data
sheet, PD can be calculated as follows:

160

140

Board Material = 0.0625


G10/FR4, 2 oz Copper

TA = 25C

0.8 Watts
120
1.25 Watts*

1.5 Watts

100

80
0.0

*Mounted on the DPAK footprint


0.2

0.4
0.6
A, AREA (SQUARE INCHES)

0.8

1.0

Figure 1. Thermal Resistance versus Drain Pad


Area for the SOT223 Package (Typical)

SOLDER STENCIL GUIDELINES


Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads.
Solder stencils are used to screen the optimum amount.
These stencils are typically 0.008 inches thick and may be
made of brass or stainless steel. For packages such as the

Surface Mount Information


710

SOT23, SC59, SC70/SOT323, SC90/SOT416,


SOD123, SOT223, SOT363, SO14, SO16, and
TSOP6 packages, the stencil opening should be the same
as the pad size or a 1:1 registration.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to minimize the thermal stress to which the devices are subjected.
Always preheat the device.
The delta temperature between the preheat and soldering
should be 100C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10C.

The soldering temperature and time should not exceed


260C for more than 10 seconds.
When shifting from preheating to soldering, the maximum
temperature gradient shall be 5C or less.
After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used since the use of forced
cooling will increase the temperature gradient and will
result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.

TYPICAL SOLDER HEATING PROFILE


For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones and a figure
for belt speed. Taken together, these control settings make
up a heating profile for that particular circuit board. On
machines controlled by a computer, the computer remembers these profiles from one operating session to the next.
Figure 2 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems, but it is a
good starting point. Factors that can affect the profile include
the type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
STEP 1
PREHEAT
ZONE 1
RAMP
200C

STEP 2 STEP 3
VENT
HEATING
SOAK ZONES 2 & 5
RAMP

DESIRED CURVE FOR HIGH


MASS ASSEMBLIES

actual temperature that might be experienced on the surface


of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 189C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.

STEP 4
HEATING
ZONES 3 & 6
SOAK

STEP 5
HEATING
ZONES 4 & 7
SPIKE

STEP 6
VENT

STEP 7
COOLING
205 TO 219C
PEAK AT
SOLDER JOINT

170C
160C

150C
150C

100C

140C

100C

SOLDER IS LIQUID FOR


40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)

DESIRED CURVE FOR LOW


MASS ASSEMBLIES
50C

TIME (3 TO 7 MINUTES TOTAL)

TMAX

Figure 2. Typical Solder Heating Profile

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Surface Mount Information


711

Footprints for Soldering


0.037
0.95

0.037
0.95

0.037
0.95

0.037
0.95

0.094
2.4

0.079
2.0

0.039
1.0

0.035
0.9
inches

0.031
0.8

0.031
0.8

mm

mm

SOT23

0.025
0.025

0.65

0.65

0.075

0.5 min. (3x)

1.9
0.035
0.9
0.028

1.4

inches

0.7

0.5

0.5 min. (3x)

SC59

inches

mm

SC70/SOT323

SOT 416/SC90

0.15
3.8

0.060
1.52

0.079
2.0

0.091
2.3

0.248
6.3

0.091
2.3

0.079
2.0

0.275
7.0

0.155
4.0

0.024
0.6
0.059
1.5

0.059
1.5

0.059
1.5

0.050
1.270

inches
inches

mm

mm

SOT223

Surface Mount Information


712

SO14, SO16

Motorola SmallSignal Transistors, FETs and Diodes Device Data

2.36
0.093
4.19
0.165

1.22
0.048
0.4 mm (min)

0.91
0.036

mm
inches

0.65 mm 0.65 mm

0.5 mm (min)

1.9 mm

SOD123

SOT363
(SC70 6 LEAD)

0.094
2.4

0.037
0.95
0.074
1.9
0.037
0.95
0.028
0.7
0.039
1.0

inches
mm

TSOP6

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Surface Mount Information


713

Surface Mount Information


714

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Section 8
Package Outline
Dimensions

In Brief . . .
The following pages contain information on the various
packages referenced on the individual data sheets.
Information includes: a picture of the package, dimensions in
both millimeters and inches, the various pinout
configurations (styles), a cross reference for case numbers,
old JEDEC TO numbers, the new JEDEC TO designation,
and footprint dimensions for surface mount packages to
assist in board layout.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Package Outline Dimensions


81

Package Outline Dimensions


Dimensions are in inches unless otherwise noted.
A

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.

R
P
L

SEATING
PLANE

DIM
A
B
C
D
F
G
H
J
K
L
N
P
R
V

X X
G

H
V

C
SECTION XX

N
N

STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
STYLE 14:
PIN 1. EMITTER
2. COLLECTOR
3. BASE

STYLE 2:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 15:
PIN 1. ANODE 1
2. CATHODE
3. ANODE 2

STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE

STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE

STYLE 17:
PIN 1. COLLECTOR
2. BASE
3. EMITTER

STYLE 21:
PIN 1. COLLECTOR
2. EMITTER
3. BASE

STYLE 5:
PIN 1. DRAIN
2. SOURCE
3. GATE
STYLE 22:
PIN 1. SOURCE
2. GATE
3. DRAIN

INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.022
0.016
0.019
0.045
0.055
0.095
0.105
0.015
0.020
0.500

0.250

0.080
0.105

0.100
0.115

0.135

MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.41
0.55
0.41
0.48
1.15
1.39
2.42
2.66
0.39
0.50
12.70

6.35

2.04
2.66

2.54
2.93

3.43

STYLE 7:
PIN 1. SOURCE
2. DRAIN
3. GATE
STYLE 30:
PIN 1. DRAIN
2. GATE
3. SOURCE

CASE 02904
(TO226AA) TO92
PLASTIC

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSIONS D AND J APPLY BETWEEN L AND K
MIMIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.

SEATING
PLANE

P
L

X X

DIM
A
B
C
D
F
G
H
J
K
L
N
P
R
V

D
G

V
1 2 3

N C

SECTION XX

STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR

STYLE 14:
PIN 1. EMITTER
2. COLLECTOR
3. BASE

INCHES
MIN
MAX
0.175
0.205
0.290
0.310
0.125
0.165
0.018
0.022
0.016
0.019
0.045
0.055
0.095
0.105
0.018
0.024
0.500

0.250

0.080
0.105

0.100
0.135

0.135

MILLIMETERS
MIN
MAX
4.44
5.21
7.37
7.87
3.18
4.19
0.46
0.56
0.41
0.48
1.15
1.39
2.42
2.66
0.46
0.61
12.70

6.35

2.04
2.66

2.54
3.43

3.43

STYLE 22:
PIN 1. SOURCE
2. GATE
3. DRAIN

CASE 02905
(TO226AE) TO92
1WATT PLASTIC

Package Outline Dimensions


82

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PACKAGE OUTLINE DIMENSIONS (continued)

B
NOTES:
1. PACKAGE CONTOUR OPTIONAL WITHIN DIA B
AND LENGTH A. HEAT SLUGS, IF ANY, SHALL BE
INCLUDED WITHIN THIS CYLINDER, BUT SHALL
NOT BE SUBJECT TO THE MIN LIMIT OF DIA B.
2. LEAD DIA NOT CONTROLLED IN ZONES F, TO
ALLOW FOR FLASH, LEAD FINISH BUILDUP,
AND MINOR IRREGULARITIES OTHER THAN
HEAT SLUGS.

D
K
F
A

DIM
A
B
D
F
K

F
K

MILLIMETERS
MIN
MAX
5.84
7.62
2.16
2.72
0.46
0.56

1.27
25.40
38.10

INCHES
MIN
MAX
0.230
0.300
0.085
0.107
0.018
0.022

0.050
1.000
1.500

All JEDEC dimensions and notes apply.

CASE 5102
(DO204AA)
DO7

SEATING
PLANE

SECTION XX

X X
D
G
H
V

C
N

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND ZONE R IS
UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSIONS D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIM K MINIMUM.
DIM
A
B
C
D
F
G
H
J
K
L
N
P
R
V

INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.022
0.016
0.019
0.050 BSC
0.100 BSC
0.014
0.016
0.500

0.250

0.080
0.105

0.050
0.115

0.135

MILLIMETERS
MIN
MAX
4.45
5.21
4.32
5.33
3.18
4.49
0.41
0.56
0.407
0.482
1.27 BSC
3.54 BSC
0.36
0.41
12.70

6.35

2.03
2.66

1.27
2.93

3.43

STYLE 1:
PIN 1. ANODE
2. CATHODE

CASE 18202
(T0226AC) TO92
PLASTIC

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Package Outline Dimensions


83

PACKAGE OUTLINE DIMENSIONS (continued)

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIUMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.

A
L
3

B S
1

DIM
A
B
C
D
G
H
J
K
L
S
V

G
C
H

STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR

STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE

STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE

STYLE 10:
PIN 1. DRAIN
2. SOURCE
3. GATE

STYLE 9:
PIN 1. ANODE
2. ANODE
3. CATHODE

STYLE 18:
PIN 1. NO CONNECTION
2. CATHODE
3. ANODE

INCHES
MIN
MAX
0.1102 0.1197
0.0472 0.0551
0.0350 0.0440
0.0150 0.0200
0.0701 0.0807
0.0005 0.0040
0.0034 0.0070
0.0140 0.0285
0.0350 0.0401
0.0830 0.1039
0.0177 0.0236

STYLE 19:
PIN 1. CATHODE
2. ANODE
3. CATHODEANODE

MILLIMETERS
MIN
MAX
2.80
3.04
1.20
1.40
0.89
1.11
0.37
0.50
1.78
2.04
0.013
0.100
0.085
0.177
0.35
0.69
0.89
1.02
2.10
2.64
0.45
0.60

STYLE 11:
PIN 1. ANODE
2. CATHODE
3. CATHODEANODE

STYLE 21:
PIN 1. GATE
2. SOURCE
3. DRAIN

CASE 31808
(TO236AB) SOT23
PLASTIC

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.

L
3

S
2

DIM
A
B
C
D
G
H
J
K
L
S

B
1

D
G

C
H

STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR

MILLIMETERS
MIN
MAX
2.70
3.10
1.30
1.70
1.00
1.30
0.35
0.50
1.70
2.10
0.013
0.100
0.09
0.18
0.20
0.60
1.25
1.65
2.50
3.00

INCHES
MIN
MAX
0.1063 0.1220
0.0512 0.0669
0.0394 0.0511
0.0138 0.0196
0.0670 0.0826
0.0005 0.0040
0.0034 0.0070
0.0079 0.0236
0.0493 0.0649
0.0985 0.1181

STYLE 2:
PIN 1. N.C.
2. ANODE
3. CATHODE

STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE

STYLE 4:
PIN 1. N.C.
2. CATHODE
3. ANODE

STYLE 5:
PIN 1. CATHODE
2. CATHODE
3. ANODE

CASE 318D04
SC59

Package Outline Dimensions


84

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PACKAGE OUTLINE DIMENSIONS (continued)

A
F

NOTES:
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.

INCHES
DIM MIN
MAX
A
0.249
0.263
B
0.130
0.145
C
0.060
0.068
D
0.024
0.035
F
0.115
0.126
G
0.087
0.094
H 0.0008 0.0040
J
0.009
0.014
K
0.060
0.078
L
0.033
0.041
M
0_
10 _
S
0.264
0.287

B
1

D
L

G
J
C

0.08 (0003)

MILLIMETERS
MIN
MAX
6.30
6.70
3.30
3.70
1.50
1.75
0.60
0.89
2.90
3.20
2.20
2.40
0.020
0.100
0.24
0.35
1.50
2.00
0.85
1.05
0_
10 _
6.70
7.30

STYLE 1:
PIN 1.
2.
3.
4.

BASE
COLLECTOR
EMITTER
COLLECTOR

STYLE 2:
PIN 1.
2.
3.
4.

ANODE
CATHODE
NC
CATHODE

STYLE 3:
PIN 1.
2.
3.
4.

GATE
DRAIN
SOURCE
DRAIN

CASE 318E04
SOT223

A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.

L
6

S
1

D
G
M
J

0.05 (0.002)
H

DIM
A
B
C
D
G
H
J
K
L
M
S

MILLIMETERS
MIN
MAX
2.90
3.10
1.30
1.70
0.90
1.10
0.25
0.50
0.85
1.05
0.013
0.100
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00

STYLE 1:
PIN 1.
2.
3.
4.
5.
6.

INCHES
MIN
MAX
0.1142 0.1220
0.0512 0.0669
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0610
0_
10 _
0.0985 0.1181

DRAIN
DRAIN
GATE
SOURCE
DRAIN
DRAIN

CASE 318G02
TSOP6
PLASTIC

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Package Outline Dimensions


85

PACKAGE OUTLINE DIMENSIONS (continued)

A
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

S
1

DIM
A
B
C
D
G
H
J
K
L
N
R
S
V

V
G

R N

C
0.05 (0.002)

STYLE 2:
PIN 1. ANODE
2. N.C.
3. CATHODE

STYLE 3:
PIN 1. BASE
2. EMITTER
3. COLLECTOR

STYLE 7:
PIN 1. BASE
2. EMITTER
3. COLLECTOR

STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE

STYLE 9:
PIN 1. ANODE
2. CATHODE
3. CATHODEANODE

INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.035
0.049
0.012
0.016
0.047
0.055
0.000
0.004
0.004
0.010
0.017 REF
0.026 BSC
0.028 REF
0.031
0.039
0.079
0.087
0.012
0.016

MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.90
1.25
0.30
0.40
1.20
1.40
0.00
0.10
0.10
0.25
0.425 REF
0.650 BSC
0.700 REF
0.80
1.00
2.00
2.20
0.30
0.40

STYLE 5:
PIN 1. ANODE
2. ANODE
3. CATHODE

STYLE 10:
PIN 1. CATHODE
2. ANODE
3. ANODECATHODE

CASE 41902
SC70/SOT323

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

G
V

DIM
A
B
C
D
G
H
J
K
N
S
V

D 6 PL

0.2 (0.008)

N
J
C

INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC

0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
0.012
0.016

STYLE 1:
PIN 1.
2.
3.
4.
5.
6.

EMITTER 2
BASE 2
COLLECTOR 1
EMITTER 1
BASE 1
COLLECTOR 2

STYLE 6:
PIN 1.
2.
3.
4.
5.
6.

ANODE 2
N/C
CATHODE 1
ANODE 1
N/C
CATHODE 2

MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC

0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
0.30
0.40

CASE 419B-01
SOT363

Package Outline Dimensions


86

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PACKAGE OUTLINE DIMENSIONS (continued)

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

DIM
A
B
C
D
E
H
J
K

INCHES
MIN
MAX
0.055
0.071
0.100
0.112
0.037
0.053
0.020
0.028
0.004

0.000
0.004

0.006
0.140
0.152

MILLIMETERS
MIN
MAX
1.40
1.80
2.55
2.85
0.95
1.35
0.50
0.70
0.25

0.00
0.10

0.15
3.55
3.85

STYLE 1:
PIN 1. CATHODE
2. ANODE

CASE 42504
SOD123

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.

A
S
2
3

D 3 PL
0.20 (0.008)

G B
1

B
K

0.20 (0.008) A

MILLIMETERS
MIN
MAX
0.70
0.80
1.40
1.80
0.60
0.90
0.15
0.30
1.00 BSC

0.10
0.10
0.25
1.45
1.75
0.10
0.20
0.50 BSC

INCHES
MIN
MAX
0.028
0.031
0.055
0.071
0.024
0.035
0.006
0.012
0.039 BSC

0.004
0.004
0.010
0.057
0.069
0.004
0.008
0.020 BSC

STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR

C
L

DIM
A
B
C
D
G
H
J
K
L
S

STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE

CASE 46301
SOT416/SC90

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Package Outline Dimensions


87

PACKAGE OUTLINE DIMENSIONS (continued)

14

NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.

B
1

A
F

DIM
A
B
C
D
F
G
H
J
K
L
M
N

L
C
J

N
H

SEATING
PLANE

K
M

INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039

MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01

CASE 64606
14PIN DIP
PLASTIC

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.

A
16

S
T

SEATING
PLANE

H
G

16 PL

0.25 (0.010)

T A

DIM
A
B
C
D
F
G
H
J
K
L
M
S

INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040

MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01

CASE 64808
16PIN DIP
PLASTIC

Package Outline Dimensions


88

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PACKAGE OUTLINE DIMENSIONS (continued)

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.

A
14

B
1

P 7 PL
0.25 (0.010)

R X 45 _

T
0.25 (0.010)

D 14 PL

SEATING
PLANE

T B

DIM
A
B
C
D
F
G
J
K
M
P
R

MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50

INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019

CASE 751A03
SO14
PLASTIC

16

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.

8 PL

0.25 (0.010)

X 45 _

C
T

SEATING
PLANE

M
D

16 PL

0.25 (0.010)

T B

DIM
A
B
C
D
F
G
J
K
M
P
R

MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50

INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019

CASE 751B05
SO16
PLASTIC

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Package Outline Dimensions


89

Package Outline Dimensions


810

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Section 9
Reliability and
Quality Assurance

In Brief . . .
This Reliability and Quality Assurance section contains
information on the measurement of outgoing quality,
reliability data analysis, reliability stress test descriptions with
the applicable MILSTD methods, statistical process control
techniques, and quality assurance processing.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Reliability and Quality Assurance


911

OUTGOING QUALITY
The Average Outgoing Quality (AOQ) refers to the number
of devices per million that are outside the specification limits
at the time of shipment. Motorola has established Six Sigma
goals to improve its outgoing quality and will continue its error
free performance focus to achieve its goal of zero parts per
million (PPM) outgoing quality. Motorolas present quality level
has lead to vendor certification programs with many of its
customers. These programs ensure a level of quality which
allows the customer either to reduce or eliminate the need for
incoming inspections.

where:
= failure rate
2 = chisquare function
= (100 confidence level) / 100
d.f. = degrees of freedom = 2r + 2
r = number of failures
t = device hours
Chisquare values for 60% and 90% confidence intervals for
up to 12 failures are shown in Table 11.
Table 11 ChiSquare Table
ChiSquare Distribution Function
60% Confidence Level

AVERAGE OUTGOING QUALITY (AOQ)


CALCULATION
AOQ = (Process Average) D (Probability of Acceptance)
D (106) (PPM)

D Process Average =

Total Projected Reject Devices


Total Number of Devices

D Projected Reject Devices =

Defects in Sample
Sample Size

D Lot Size

D Total Number of Devices = Sum of units in each submitted lot


D Probability of Acceptance = 1

Number of Lots Rejected


Number of Lots Tested

D 106 = Conversion to parts per million (PPM)

RELIABILITY DATA ANALYSIS


Reliability is the probability that a semiconductor device will
perform its specified function in a given environment for a
specified period. In other words, reliability is quality over time
and environmental conditions. The most frequently used
reliability measure for semiconductor devices is the failure
rate ( ). The failure rate is obtained by dividing the number
of failures observed by the product of the number of devices
on test and the interval in hours, usually expressed as percent
per thousand hours or failures per billion device hours (FITS).
This is called a point estimate because it is obtained from
observations on a portion (sample) of the population of
devices.
To project from the sample to the population in general, one
must establish confidence intervals. The application of
confidence intervals is a statement of how confident one is
that the sample failure rate approximates that for the
population. To obtain failure rates at different confidence
levels, it is necessary to make use of specific probability
distributions. The chisquare (2) distribution that relates
observed and expected frequencies of an event is frequently
used to establish confidence intervals. The relationship
between failure rate and the chisquare distribution is as
follows:
2 (, d. f.)
=
2t

Reliability and Quality Assurance


912

90% Confidence Level

No. Fails

2 Quantity

No. Fails

2 Quantity

0
1
2
3
4
5
6
7
8
9
10
11
12

1.833
4.045
6.211
8.351
10.473
12.584
14.685
16.780
18.868
20.951
23.031
25.106
27.179

0
1
2
3
4
5
6
7
8
9
10
11
12

4.605
7.779
10.645
13.362
15.987
18.549
21.064
23.542
25.989
28.412
30.813
33.196
35.563

The failure rate of semiconductor devices is inherently low.


As a result, the industry uses a technique called accelerated
testing to assess the reliability of semiconductors. During
accelerated tests, elevated stresses are used to produce, in
a short period, the same failure mechanisms as would be
observed under normal use conditions. The objective of this
testing is to identify these failure mechanisms and eliminate
them as a cause of failure during the useful life of the product.
Temperature, relative humidity, and voltage are the most
frequently used stresses during accelerated testing. Their
relationship to failure rates has been shown to follow an Eyring
type of equation of the form:
= A exp(kT) exp(B/RH) exp(CE)
Where A, B, C, , and k are constants, more specifically B,
C, and are numbers representing the apparent energy at
which various failure mechanisms occur. These are called
activation energies. T is the temperature, RH is the
relative humidity, and E is the electric field. The most familiar
form of this equation (shown on following page) deals with the
first exponential term that shows an Arrhenius type
relationship of the failure rate versus the junction temperature
of semiconductors. The junction temperature is related to the
ambient temperature through the thermal resistance and
power dissipation. Thus, we can test devices near their
maximum junction temperatures, analyze the failures to
assure that they are the types that are accelerated by
temperature and then by applying known acceleration factors,
estimate the failure rates for lower junction.
The table on the following page shows observed activation
energies with references.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Table 12 Time Dependent Failure Mechanisms in Semiconductor Devices


(Applicable to Discrete and Integrated Circuits)
Device
Association
Silicon Oxide
SiliconSilicon
Oxide Interface

Metallization

Process

Relevant
Factors

Typical
Activation
Energy in eV

Accelerating
Factors

Model

Reference

Surface Charges
Inversion, Accumulation

Mobile Ions
E/V, T

T, V

1.0

Fitch, et al.
Peck

1A
2

Oxide Pinholes

E/V, T

E, T

0.71.0 (Bipolar)
1.0 (Bipolar)

1984 WRS
Hokari, et al.

18
5

Dielectric Breakdown
(TDDB)

E/V, T

E, T

0.30.4 (MOS)
0.3 (MOS)

Domangue, et al.
Crook, D.L.

3
4

Charge Loss

E, T

E, T

0.8 (MOS)
EPROM

Gear, G.

11

Electromigration

T, J

J, T

1.0 Large grain Al


(glassivated)

Nanda, et al.

Grain Size

0.5
Small grain Al

Black, J.R.

Doping

0.7 CuAl/CuSiAl
(sputtered)

Black, J.R.

12

Corrosion
Chemical
Galvanic
Electrolytic

Contamination

H, E/V, T

0.60.7
(for electrolysis)
E/V may have
thresholds

Lycoudes, N.E.

Bond and Other


Mechanical Interfaces

Intermetallic
Growth

T, Impurities
Bond Strength

1.0 (Au/Al)

Fitch, W.T

Various Water Fab,


Assembly, and
Silicon Defects

Metal Scratches
Mask Defects, etc.
Silicon Defects

T, V

T, V

0.50.7 eV

Howes, et al.

10

0.5 eV

MMPD

13

V = voltage; E = electric field; T = temperature; J = current density; H = humidity


NO. REFERENCE
1A

1.0 eV activation for leakage type failures.


Fitch, W.T.; Greer, P.; Lycoudes, N.; Data to Support 0.001%/1000
Hours for Plastic I/Cs. Case study on linear product shows 0.914 eV
activation energy which is within experimental error of 0.9 to 1.3 eV
activation energies for reversible leakage (inversion) failures reported
in the literature.

1B

0.7 To 1.0 eV for oxide defect failures for bipolar structures. This is
under investigation subsequent to information obtained from 1984
Wafer Reliability Symposium, especially for bipolar capacitors with
silicon nitride as dielectric.
1.0 eV activation for leakage type failures.

0.65 eV for corrosion mechanism.


Lycoudes, N.E.; The Reliability of Plastic Microcircuits in Moist
Environments, 1978 Solid State Technology.

1.0 eV for open wires or high resistance bonds at the pad bond
due to AuAl intermetallics.
Fitch, W.T.; Operating Life vs Junction Temperatures for Plastic
Encapsulated I/C (1.5 mil Au wire), unpublished report.

0.36 eV for dielectric breakdown for MOS gate structures.


Domangue, E.; Rivera, R.; Shedard, C.; Reliability Prediction Using
Large MOS Capacitors, 1984 Reliability Physics Symposium.

0.5 eV Al, 0.7 eV CuAl small grain (compared to line width).


Black, J.R.; Current Limitation of Thin Film Conductor 1982 Reliability Physics Symposium.

Peck, D.S.; New Concerns About Integrated Circuit Reliability 1978


Reliability Physics Symposium.
3

1.0 eV for large grain AlSi (compared to line width).


Nanda, Vangard, GjP; Black, J.R.; Electromigration of AlSi Alloy
Films, 1978 Reliability Physics Symposium.

10

0.7 eV for assembly related defects.


Howes, M.G.; Morgan, D.V.; Reliability and Degradation, Semiconductor Devices and CIrcuits John Wiley and Sons, 1981.

0.3 eV for dielectric breakdown.


Crook, D.L.; Method of Determining Reliability Screens for Time
Dependent Dielectric Breakdown, 1979 Reliability Physics
Symposium.

11

Gear, G.; FAMOUS PROM Reliability Studies, 1976 Reliability


Physics Symposium.

1.0 eV for dielectric breakdown.

12

Black, J.R.: unpublished report.

Hokari, Y.; et al.; IEDM Technical Digest, 1982.

13

Motorola Memory Products Division; unpublished report.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Reliability and Quality Assurance


913

THERMAL RESISTANCE
Circuit performance and longterm circuit reliabiity are
affected by die temperature. Normally, both are improved by
keeping the junction temperatures low.
Electrical power dissipated in any semiconductor device is
a source of heat. This heat source increases the temperature
of the die about some reference point, normally the ambient
temperature of 25C in still air. The temperature increase,
then, depends on the amount of power dissipated in the circuit
and on the net thermal resistance between the heat source
and the reference point.
The temperature at the junction depends on the packaging
and mounting systems ability to remove heat generated in the
circuit from the junction region to the ambient environment.
The basic formula for converting power dissipation to
estimated junction temperature is:
(1)
TJ = TA + PD (JC + CA)
or
TJ = TA + PD (JA)
(2)
where:
TJ = maximum junction temperature
TA = maximum ambient temperature
PD = calculated maximum power dissipation, including
effects of external loads when applicable
JC = average thermal resistance, junction to case
CA = average thermal resistance, case to ambient
JA = average thermal resistance, junction to ambient
This Motorola recommended formula has been approved
by RADC and DESC for calculating a practical maximum
operating junction temperature for MILM38510 devices.
Only two terms on the right side of equation (1) can be
varied by the user, the ambient temperature and the device
casetoambient thermal resistance, CA. (To some extent
the device power dissipation can also be controlled, but under
recommended use the supply voltage and loading dictate a

Reliability and Quality Assurance


914

fixed power dissipation.) Both system air flow and the package
mounting technique affect the CA thermal resistance term.
JC is essentially independent of air flow and external
mounting method, but is sensitive to package material, die
bonding method, and die area.
For applications where the case is held at essentially a fixed
temperature by mounting on a large or temperature controlled
heat sink, the estimated junction temperature is calculated by:
TJ = TC + PD (JC)
(3)
where TC = maximum case temperature and the other
parameters are as previously defined.

AIR FLOW
Air flow over the packages (due to a decrease in JC)
reduces the thermal resistance of the package, therefore
permitting a corresponding increase in power dissipation
without exceeding the maximum permissible operating
junction temperature.
For thermal resistance values for specific packages, see
the Motorola Data Book or Design Manual for the appropriate
device family or contact your local Motorola sales office.

ACTIVATION ENERGY
Determination of activation energies is accomplished by
testing randomly selected samples from the same population
at various stress levels and comparing failure rates due to the
same failure mechanism. The activation energy is
represented by the slope of the curve relating to the natural
logarithm of the failure rate to the various stress levels.
In calculating failure rates, the comprehensive method is to
use the specific activation energy for each failure mechanism
applicable to the technology and circuit under consideration.
A common alternative method is to use a single activation
energy value for the expected failure mechanism(s) with the
lowest activation energy.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

RELIABILITY STRESS TESTS


The following are brief descriptions of the reliability tests
commonly used in the reliability monitoring program. Not all of
the tests listed are performed by each product division. Other
tests may be performed when appropriate.

AUTOCLAVE (aka, PRESSURE COOKER)


Autoclave is an environmental test which measures device
resistance to moisture penetration and the resultant effect of
galvanic corrosion. Autoclave is a highly accelerated and
destructive test.
Typical Test Conditions: TA = 121C, rh = 100%, p = 1
atmosphere (15 psig), t = 24 to 96 hours
Common Failure Modes: Parametric shifts, high leakage and/or catastrophic
Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing.

HIGH HUMIDITY HIGH TEMPERATURE


BIAS (H3TB, H3TRB, or THB)
This is an environmental test designed to measure the
moisture resistance of plastic encapsulated devices. A bias is
applied to create an electrolytic cell necessary to accelerate
corrosion of the die metallization. With time, this is a
catastrophically destructive test.
Typical Test Conditions: TA = 85C to 95C, rh = 85%
to 95%, Bias = 80% to 100% of Data Book max. rating, t
= 96 to 1750 hours
Common Failure Modes: Parametric shifts, high leakage and/or catastrophic
Common Failure Mechanisms: Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing.

HIGH TEMPERATURE GATE BIAS (HTGB)


This test is designed to electrically stress the gate oxide under
a bias condition at high temperature.
Typical Test Conditions: TA = 150C, Bias = 80% of
Data Book max. rating, t = 120 to 1000 hours
Common Failure Modes: Parametric shifts in gate leakage and gate threshold voltage
Common Failure Mechanisms: Random oxide defects
and ionic contamination
Military Reference: MILSTD750, Method 1042

Motorola SmallSignal Transistors, FETs and Diodes Device Data

HIGH TEMPERATURE REVERSE BIAS


(HTRB)
The purpose of this test is to align mobile ions by means of
temperature and voltage stress to form a highcurrent
leakage path between two or more junctions.
Typical Test Conditions: TA = 85C to 150C, Bias =
80% to 100% of Data Book max. rating, t = 120 to 1000
hours
Common Failure Modes: Parametric shifts in leakage
and gain
Common Failure Mechanisms: Ionic contamination on
the surface or under the metallization of the die
Military Reference: MILSTD750, Method 1039

HIGH TEMPERATURE STORAGE LIFE


(HTSL)
High temperature storage life testing is performed to
accelerate failure mechanisms which are thermally activated
through the application of extreme temperatures
Typical Test Conditions: TA = 70C to 200C, no bias, t
= 24 to 2500 hours
Common Failure Modes: Parametric shifts in leakage
and gain
Common Failure Mechanisms: Bulk die and diffusion
defects
Military Reference: MILSTD750, Method 1032

INTERMITTENT OPERATING LIFE (IOL)


The purpose of this test is the same as SSOL in addition to
checking the integrity of both wire and die bonds by means of
thermal stressing
Typical Test Conditions: TA = 25C, Pd = Data Book
maximum rating, Ton = Toff = D of 50C to 100C, t = 42
to 30000 cycles
Common Failure Modes: Parametric shifts and catastrophic
Common Failure Mechanisms: Foreign material, crack
and bulk die defects, metallization, wire and die bond
defects
Military Reference: MILSTD750, Method 1037

Reliability and Quality Assurance


915

MECHANICAL SHOCK

STEADY STATE OPERATING LIFE (SSOL)

This test is used to determine the ability of the device to


withstand a sudden change in mechanical stress due to abrupt
changes in motion as seen in handling, transportation, or
actual use.
Typical Test Conditions: Acceleration = 1500 gs, Orientation = X1, Y1, Y2 plane, t = 0.5 msec, Blows = 5
Common Failure Modes: Open, short, excessive leakage, mechanical failure
Common Failure Mechanisms: Die and wire bonds,
cracked die, package defects
Military Reference: MILSTD750, Method 2015

The purpose of this test is to evaluate the bulk stability of the


die and to generate defects resulting from manufacturing
aberrations that are manifested as time and
stressdependent failures.
Typical Test Conditions: TA = 25C, PD = Data Book
maximum rating, t = 16 to 1000 hours
Common Failure Modes: Parametric shifts and catastrophic
Common Failure Mechanisms: Foreign material, crack
die, bulk die, metallization, wire and die bond defects
Military Reference: MILSTD750, Method 1026

MOISTURE RESISTANCE

TEMPERATURE CYCLING (AIR TO AIR)

The purpose of this test is to evaluate the moisture resistance


of components under temperature/humidity conditions typical
of tropical environments.
Typical Test Conditions: TA = 10C to 65C, rh = 80%
to 98%, t = 24 hours/cycles, cycle = 10
Common Failure Modes: Parametric shifts in leakage
and mechanical failure
Common Failure Mechanisms: Corrosion or contaminants on or within the package materials. Poor package
sealing
Military Reference: MILSTD750, Method 1021

The purpose of this test is to evaluate the ability of the device


to withstand both exposure to extreme temperatures and
transitions between temperature extremes. This testing will
also expose excessive thermal mismatch between materials.
Typical Test Conditions: TA = 65C to 200C, cycle =
10 to 4000
Common Failure Modes: Parametric shifts and catastrophic
Common Failure Mechanisms: Wire bond, cracked or
lifted die and package failure
Military Reference: MILSTD750, Method 1051

SOLDERABILITY
The purpose of this test is to measure the ability of the device
leads/terminals to be soldered after an extended period of
storage (shelf life).
Typical Test Conditions: Steam aging = 8 hours, Flux =
R, Solder = Sn60, Sn63
Common Failure Modes: Pin holes, dewetting, nonwetting
Common Failure Mechanisms: Poor plating, contaminated leads
Military Reference: MILSTD750, Method 2026

THERMAL SHOCK (LIQUID TO LIQUID)


The purpose of this test is to evaluate the ability of the device
to withstand both exposure to extreme temperatures and
sudden transitions between temperature extremes. This
testing will also expose excessive thermal mismatch between
materials.
Typical Test Conditions: TA = 0C to 100C, cycle = 20
to 300
Common Failure Modes: Parametric shifts and catastrophic
Common Failure Mechanisms: Wire bond, cracked or
lifted die and package failure
Military Reference: MILSTD750, Method 1056

SOLDER HEAT
This test is used to measure the ability of a device to withstand
the temperatures as may be seen in wave soldering
operations. Electrical testing is the endpoint critierion for this
stress.
Typical Test Conditions: Solder Temperature = 260C, t
= 10 seconds
Common Failure Modes: Parameter shifts, mechanical
failure
Common Failure Mechanisms: Poor package design
Military Reference: MILSTD750, Method 2031

Reliability and Quality Assurance


916

VARIABLE FREQUENCY VIBRATION


This test is used to examine the ability of the device to
withstand deterioration due to mechanical resonance.
Typical Test Conditions: Peak acceleration = 20 gs,
Frequency range = 20 Hz to KHz, t = 48 minutes
Common Failure Modes: Open, short, excessive leakage, mechanical failure
Common Failure Mechanisms: Die and wire bonds,
cracked die, package defects
Military Reference: MILSTD750, Method 2056

Motorola SmallSignal Transistors, FETs and Diodes Device Data

STATISTICAL PROCESS CONTROL


Communication Power & Signal Technologies Group
(CPSTG) is continually pursuing new ways to improve product
quality. Initial design improvement is one method that can be
used to produce a superior product. Equally important to
outgoing product quality is the ability to produce product that
consistently conforms to specification. Process variability is
the basic enemy of semiconductor manufacturing since it
leads to product variability. Used in all phases of Motorolas
product manufacturing, STATISTICAL PROCESS CONTROL
(SPC) replaces variability with predictability. The traditional
philosophy in the semiconductor industry has been
adherence to the data sheet specification. Using SPC
methods ensures that the product will meet specific process
requirements throughout the manufacturing cycle. The
emphasis is on defect prevention, not detection. Predictability
through SPC methods requires the manufacturing culture to
focus on constant and permanent improvements. Usually,
these improvements cannot be bought with stateoftheart
equipment or automated factories. With quality in design,
process, and material selection, coupled with manufacturing
predictability, Motorola can produce world class products.
The immediate effect of SPC manufacturing is predictability
through process controls. Product centered and distributed
well within the product specification benefits Motorola with
fewer rejects, improved yields, and lower cost. The direct
benefit to Motorolas customers includes better incoming
quality levels, less inspection time, and shiptostock
capability. Circuit performance is often dependent on the
cumulative effect of component variability. Tightly controlled
component distributions give the customer greater circuit
predictability. Many customers are also converting to
justintime (JIT) delivery programs. These programs require
improvements in cycle time and yield predictability achievable
only through SPC techniques. The benefit derived from SPC
helps the manufacturer meet the customers expectations of
higher quality and lower cost product.
Ultimately, Motorola will have Six Sigma capability on all
products. This means parametric distributions will be centered
within the specification limits, with a product distribution of plus
or minus Six Sigma about mean. Six Sigma capability, shown
graphically in Figure 1, details the benefit in terms of yield and
outgoing quality levels. This compares a centered distribution
versus a 1.5 sigma worst case distribution shift.
New product development at Motorola requires more robust
design features that make them less sensitive to minor
variations in processing. These features make the
implementation of SPC much easier.
A complete commitment to SPC is present throughout
Motorola. All managers, engineers, production operators,
supervisors, and maintenance personnel have received
multiple training courses on SPC techniques. Manufacturing
has identified 22 wafer processing and 8 assembly steps
considered critical to the processing of semiconductor
products. Processes controlled by SPC methods that have
shown significant improvement are in the diffusion,
photolithography, and metallization areas.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

6 5 4 3 2 1 0

2 3 4

5 6

Standard Deviations From Mean


Distribution Centered
At 3 2700 ppm defective
99.73% yield
At 4 63 ppm defective
99.9937% yield

Distribution Shifted 1.5


66810 ppm defective
93.32% yield
6210 ppm defective
99.379% yield

At 5 0.57 ppm defective


99.999943% yield

233 ppm defective


99.9767% yield

At 6 0.002 ppm defective


99.9999998% yield

3.4 ppm defective


99.99966% yield

Figure 1. AOQL and Yield from a Normal


Distribution of Product With 6 Capability
To better understand SPC principles, brief explanations
have been provided. These cover process capability,
implementation, and use.

PROCESS CAPABILITY
One goal of SPC is to ensure a process is CAPABLE.
Process capability is the measurement of a process to
produce products consistently to specification requirements.
The purpose of a process capability study is to separate the
inherent RANDOM VARIABILITY from ASSIGNABLE
CAUSES. Once completed, steps are taken to identify and
eliminate the most significant assignable causes. Random
variability is generally present in the system and does not
fluctuate. Sometimes, the random variability is due to basic
limitations associated with the machinery, materials,
personnel skills, or manufacturing methods. Assignable
cause inconsistencies relate to time variations in yield,
performance, or reliability.
Traditionally, assignable causes appear to be random due
to the lack of close examination or analysis. Figure 2 shows
the impact on predictability that assignable cause can have.
Figure 3 shows the difference between process control and
process capability.
A process capability study involves taking periodic samples
from the process under controlled conditions. The
performance characteristics of these samples are charted
against time. In time, assignable causes can be identified and
engineered out. Careful documentation of the process is the
key to accurate diagnosis and successful removal of the
assignable causes. Sometimes, the assignable causes will
remain unclear, requiring prolonged experimentation.
Elements which measure process variation control and
capability are Cp and Cpk, respectively. Cp is the specification
width divided by the process width or Cp = (specification
width) / 6. Cpk is the absolute value of the closest
specification value to the mean, minus the mean, divided by
half the process width or Cpk = closest specification X/3.

Reliability and Quality Assurance


917

PREDICTION
In control assignable
causes eliminated
TIME
TIME

Out of control
(assignable causes present)

SIZE

Process under control all assignable causes are


removed and future distribution is predictable.

SIZE

? ?
?
? ?

? ?
?

PREDICTION

Lower
Specification Limit

Upper
Specification Limit
TIME

TIME
SIZE

Figure 2. Impact of Assignable Causes


on Process Predictable
At Motorola, for critical parameters, the process capability
is acceptable with a Cpk = 1.50 with continual improvement
our goal. The desired process capability is a Cpk = 2 and the
ideal is a Cpk = 5. Cpk, by definition, shows where the current
production process fits with relationship to the specification
limits. Off center distributions or excessive process variability
will result in less than optimum conditions.

SPC IMPLEMENTATION AND USE


CPSTG uses many parameters that show conformance to
specification. Some parameters are sensitive to process
variations while others remain constant for a given product
line. Often, specific parameters are influenced when changes
to other parameters occur. It is both impractical and
unnecessary to monitor all parameters using SPC methods.
Only critical parameters that are sensitive to process
variability are chosen for SPC monitoring. The process steps
affecting these critical parameters must be identified as well.
It is equally important to find a measurement in these process
steps that correlates with product performance. This
measurement is called a critical process parameter.
Once the critical process parameters are selected, a
sample plan must be determined. The samples used for
measurement are organized into RATIONAL SUBGROUPS
of approximately two to five pieces. The subgroup size should
be such that variation among the samples within the subgroup
remain small. All samples must come from the same source
e.g., the same mold press operator, etc. Subgroup data should

Reliability and Quality Assurance


918

SIZE

In control and capable


(variation from random
variability reduced)

In control but not capable


(variation from random variability
excessive)

Figure 3. Difference Between Process


Control and Process Capability
be collected at appropriate time intervals to detect variations
in the process. As the process begins to show improved
stability, the interval may be increased. The data collected
must be carefully documented and maintained for later
correlation. Examples of common documentation entries are
operator, machine, time, settings, product type, etc.
Once the plan is established, data collection may begin. The
data collected with generate X and R values that are plotted
with respect to time. X refers to the mean of the values within
a given subgroup, while R is the range or greatest value minus
least value. When approximately 20 or more X and R values
have been generated, the average of these values is
computed as follows:
X = (X + X2 + X3 + . . .)/K
R = (R1 + R2 + R2 + . . .)/K
where K = the number of subgroups measured.
The values of X and R are used to create the process control
chart. Control charts are the primary SPC tool used to signal
a problem. Shown in Figure 4, process control charts show X
and R values with respect to time and concerning reference
to upper and lower control limit values. Control limits are
computed as follows:
R upper control limit = UCLR = D4 R
R lower control limit = LCLR = D3 R
X upper control limit = UCLX = X + A2 R
X lower control limit = LCL X = X A2 R

Motorola SmallSignal Transistors, FETs and Diodes Device Data

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
154
153

UCL = 152.8

152
151

X = 150.4

150
149

LCL = 148.0

148
147

UCL = 7.3

7
6
5
4

R = 3.2

3
2
1

LCL = 0

Figure 4. Example of Process Control Chart Showing Oven Temperature Data

Where D4, D3, and A2 are constants varying by sample size,


with values for sample sizes from 2 to 10 shown in the
following partial table:
n

10

D4

3.27

2.57

2.28

2.11

2.00

1.92

1.86

1.82

1.78

D3

0.08

0.14

0.18

0.22

A2
1.88 1.02 0.73 0.58 0.48 0.42 0.37 0.34 0.31
*For sample sizes below 7, the LCLR would technically be a negative number;
in those cases there is no lower control limit; this means that for a subgroup size
6, six identical measurements would not be unreasonable.

Control charts are used to monitor the variability of critical


process parameters. The R chart shows basic problems with
piece to piece variability related to the process. The X chart can
often identify changes in people, machines, methods, etc. The
source of the variability can be difficult to find and may require
experimental design techniques to identify assignable causes.
Some general rules have been established to help determine
when a process is OUTOFCONTROL. Figure 5 shows a
control chart subdivided into zones A, B, and C corresponding
to 3 sigma, 2 sigma, and 1 sigma limits respectively. In Figures
6 through 9 four of the tests that can be used to identify
excessive variability and the presence of assignable causes
are shown. As familiarity with a given process increases, more
subtle tests may be employed successfully.
Once the variability is identified, the cause of the variability
must be determined. Normally, only a few factors have a
significant impact on the total variability of the process. The
importance of correctly identifying these factors is stressed in
the following example. Suppose a process variability depends
on the variance of five factors A, B, C, D, and E. Each has a
variance of 5, 3, 2, 1, and 0.4, respectively.
Since:

Motorola SmallSignal Transistors, FETs and Diodes Device Data

tot =

A2 + B2 + C2 + D2 + E2

tot =

52 + 32 + 22 + 12 +(0.4)2 = 6.3

If only D is identified and eliminated, then:


tot =
52 + 32 + 22 + (0.4)2 = 6.2
This results in less than 2% total variability improvement. If
B, C, and D were eliminated, then:
tot =
52 + (0.4)2 = 5.02
This gives a considerably better improvement of 23%. If
only A is identified and reduced from 5 to 2, then:
tot =
22 + 32 + 22 + 12 + (0.4)2 = 4.3
Identifying and improving the variability from 5 to 2 yields a
total variability improvement of nearly 40%.
Most techniques may be employed to identify the primary
assignable cause(s). Outofcontrol conditions may be
correlated to documented process changes. The product may
be analyzed in detail using best versus worst part comparisons
or Product Analysis Lab equipment. Multivariance analysis
can be used to determine the family of variation (positional,
critical, or temporal). Lastly, experiments may be run to test
theoretical or factorial analysis. Whatever method is used,
assignable causes must be identified and eliminated in the
most expeditious manner possible.
After assignable causes have been eliminated, new control
limits are calculated to provide a more challenging variablility
criteria for the process. As yields and variability improve, it may
become more difficult to detect improvements because they
become much smaller. When all assignable causes have been
eliminated and the points remain within control limits for 25
groups, the process is said to in a state of control.

Reliability and Quality Assurance


919

UCL

UCL

ZONE A (+ 3 SIGMA)

ZONE B (+ 2 SIGMA)

ZONE C (+ 1 SIGMA)

CENTERLINE

ZONE C ( 1 SIGMA)

ZONE B ( 2 SIGMA)

ZONE A ( 3 SIGMA)

LCL

Figure 5. Control Chart Zones

Figure 6. One Point Outside Control Limit


Indicating Excessive Variability
UCL

UCL

LCL

LCL

Figure 7. Two Out of Three Points in Zone A or


Beyond Indicating Excessive Variability

LCL

Figure 8. Four Out of Five Points in Zone B or


Beyond Indicating Excessive Variability
UCL
A
B
C
C
B
A

LCL

Figure 9. Seven Out of Eight Points in Zone C or


Beyond Indicating Excessive Variability

SUMMARY
Motorola is committed to the use of STATISTICAL
PROCESS CONTROLS. These principles, used throughout
manufacturing have already resulted in many significant
improvements to the processes. Continued dedication to the

Reliability and Quality Assurance


920

SPC culture will allow Motorola to reach the Six Sigma and
zero defect capability goals. SPC will further enhance the
commitment to TOTAL CUSTOMER SATISFACTION.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Section 10
Replacement
Devices

In Brief . . .
The Replacement Devices index
provides you with a list of devices which
had been supported with data sheets in
the prior edition of the SmallSignal
Transistors, FETs and Diodes data book
(DL126 Rev 5) but are no longer
supported in this new edition. A direct or
similar replacement part is listed for
those devices which have replacement
parts.

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Replacement Devices
101

REPLACEMENT DEVICES
DEVICE

REPLACEMENT

DEVICE

REPLACEMENT

DEVICE

REPLACEMENT

1N5139
1N5139A
1N5140
1N5140A
1N5141
1N5141A
1N5142
1N5142A
1N5143
1N5143A

MV2101
MV2101
MMBV2103LT1
MMBV2103LT1
MMBV2104LT1
MMBV2104LT1
MMBV2105LT1
MMBV2105LT1
MMBV2105LT1
MMBV2105LT1

2N3053A
2N3244
2N3250
2N3251
2N3251A
2N3467
2N3468
2N3497
2N3500
2N3501

MPSA05
2N4403
2N4403
MPS2907A
MPS2907A
MPSA56
MPSA56
2N5401
2N5551
2N5551

BC560B
BC849ALT1
BC850ALT1
BC857CLT1
BCY70
BCY71
BCY72
BDB01D
BDB02D
BDC02D

BC560C
BC848ALT1
BC848ALT1
BC857ALT1
MPS2222A
MPS2222A
MPS2222A
BDB01C
BDB02C
BDC01D

1N5144
1N5144A
1N5145
1N5145A
1N5146
1N5146A
1N5147
1N5147A
1N5441A
1N5443A

MMBV2107LT1
MMBV2107LT1
MMBV2108LT1
MMBV2108LT1
MMBV2109LT1
MV2109
MV2111
MV2111
MV2101
MV2103

2N3546
2N3634
2N3635
2N3636
2N3637
2N3700
2N3799
2N3947
2N3963
2N3964

MPSH17
2N5401
2N5401
MPSA92
MPSA92
MPSA06
MPSA18
MPS2222A
MPSA18
MPSA18

BDC05
BF244A
BF244B
BF245
BF245A
BF245B
BF245C
BF246A
BF246B
BF247B

MPSW42
2N3819
2N3819
BF245A
BF245A
BF245A
BF245A
BF245A
BF245A
BF245A

1N5444A
1N5445A
1N5449A
1N5450A
1N5451A
1N5452A
1N5453A
1N5455A
2N697
2N718A

MV2104
MV2105
MV2108
MV2109
MV2111
MV2111
MV2111
MV2115
MPSA20
MPSA05

2N4014
2N4032
2N4033
2N4036
2N4037
2N4126
2N4265
2N4405
2N4407
2N4931

MPS2222A
MPS2907A
MPSA56
MPSA56
MPSA56
MPS4126
2N4264
MPS8599
MPS8599
MPSA92

BF256B
BF256C
BF258
BF374
BF391
BF392
BF492
BF493
BFW43
BSP20AT1

BF256A
BF256A
BF422
BC338
MPSA42
MPSA42
MPSA92
MPSA92
2N5401
BF720T1

2N720A
2N930
2N930A
2N956
2N1613
2N1711
2N1893
2N2102
2N2218A
2N2219

MPSA06
MPSA18
MPSA18
MPSA05
2N4410
MPSA05
MPSA06
2N4410
MPS2222A
MPS2222A

2N5086
2N5668
2N5669
2N5670
2N6431
2N6433
2N6516
BA582T1
BC107
BC107A

2N5087
2N3819
2N3819
2N3819
MPSA42
MPSA92
2N6517
MMBV3401LT1
BC237
BC237

BSS71
BSS72
BSS73
BSS74
BSS75
BSS76
BSS89
BSV1610
BSX20
CV12253

MPSA42
MPSA42
MPSA42
MPSA92
MPSA92
MPSA92
BS107
MPS2907A
MPS2369A
MPSA06

2N2219A
2N2222
2N2222A
2N2270
2N2369
2N2369A
2N2484
2N2895
2N2896
2N2904

MPS2222A
MPS2222
MPS2222A
MPSA05
MPS2369
MPS2369A
2N5087
MPSA06
2N5551
MPS2907

BC107B
BC108
BC109C
BC14010
BC14016
BC14110
BC14116
BC16016
BC16116
BC177

BC237
BC3338
MPSW06
MPSW06
MPSW06
MPSW06
MPSW56
MPSW56
BC547

IRFD110
IRFD113
IRFD120
IRFD123
IRFD210
IRFD213
IRFD220
IRFD223
IRFD9120
IRFD9123

BSS123LT1
MMBF170LT1
BSS123LT1
MMBF170LT1
MMFT107T1
MMFT107T1
MMFT107T1
MMFT107T1
BSS123LT1
2N7002LT1

2N2904A
2N2905
2N2905A
2N2906
2N2906A
2N2907
2N2907A
2N3019
2N3020
2N3053

MPS2907A
MPS2907
MPS2907A
MPS2907
MPS2907A
MPS2907
MPS2907A
MPSA06
MPSA06
MPSA20

BC177A
BC177B
BC238
BC309B
BC393
BC394
BC450
BC450A
BC546A
BC559

BC547A
BC547B
BC238B
BC308C
MPSA92
MPSA42
MPSA92
MPSA92
BC546B
BC559B

J111
J113
J203
J300
J305
MAD130P
MAD1103P
MAD1107P
MAD1108P
MAD1109P

J111RLRA
J113RL1
2N5458
2N5486
MMBF5484LT1
BAS16LT1
BAS16LT1
BAS16LT1
BAS16LT1
BAS16LT1

Replacement Devices
102

Motorola SmallSignal Transistors, FETs and Diodes Device Data

REPLACEMENT DEVICES
DEVICE

REPLACEMENT

DEVICE

REPLACEMENT

DEVICE

REPLACEMENT

MM3001
MM3725
MM4001
MMAD1106
MMBF4856LT1
MMBF4860LT1
MMBF5459LT1
MMBF5486LT1
MMBT8599LT1
MMBV2104LT1

2N5551
MPS2222A
2N5401
BAS16LT1
MMBF4391LT1
MMBF5457LT1
MMBF5457LT1
2N5486
MMBT5551LT1
MMBV2103LT1

MPS6530
MPS6531
MPS6562
MPS6568A
MPS6571
MPS6595
MPS8093
MPSA16
MPSH04
MPSH07A

MPS6530RLRM
MPS6530RLRM
MPS6651
MPS918
MPSA18
MPS3563
2N4402
MPSA17
MPSH17
MPSH17

MV2114
MVAM108
MVAM109
MVAM115
MVAM125
PBF259
PBF259S
PBF259RS
PBF493
PBF493R

MV2115
MMBV2109LT1
MMBV2109LT1
MMBV2109LT1
MMBV2109LT1
MMBT6517LT1
MMBT6517LT1
MMBT6517LT1
MMBTA92LT1
MMBTA92LT1

MMPQ3799
MMSV3401T1
MPF970
MPF971
MPF3821
MPF3822
MPF4856
MPF4857
MPF4858
MPF4859

MMPQ3725
MMBV3401LT1
MMBFJ175LT1
MMBFJ175LT1
MMBF5457LT1
MMBF5457LT1
MPF4391RLRA
2N5639
J112
2N5638RLRA

MPSH20
MPSH24
MPSH34
MPSH69
MSA1022BT1
MSB709ST1
MSB710QT1
MSB1218AST1
MSC1621T1
MSC2404CT1

MPSH17
MPSH17
MPSH17
MPSH81
MSA1022CT1
MSB709RT1
MSB710RT1
MSB1218ART1
MSD602RT1
MSC2295CT1

PBF493RS
PBF493S
VN1706L

MMBTA92LT1
MMBTA92LT1
MMFT107T1

MPF4860
MPF4861
MPQ6501
MPS3638
MPS3866
MPS4123
MPS4125
MPS4258
MPS5771
MPS6520

2N5638RLRA
J112
MPQ6502
MPS3638A
BF224
MPS4124
MPS4126
MPS3640
MPS3640
MPS6521

MSD1819AST1
MV1620
MV1624
MV1636
MV1640
MV1642
MV1644
MV2103
MV2107
MV2113

MSD1819ART1
MV2101
MMBV2103LT1
MV2108
MV2109
MV2111
MV2111
MMBV2103LT1
MV2108
MV2111

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Replacement Devices
103

Replacement Devices
104

Motorola SmallSignal Transistors, FETs and Diodes Device Data

Section 11
Alphanumeric Index

Motorola Small-Signal Transistors, FETs and Diodes Device Data

Alphanumeric Index
111

Alphanumeric Index
Device

Page

Device

Page

Page

BC517 . . . . . . . . . . . . . . . . . . . 14, 2111


BC546 . . . . . . . . . . . . . . . . . . 12, 2116
BC546B . . . . . . . . . . . . . . . . . 12, 2116
BC547 . . . . . . . . . . . . . . . . . . 12, 2116
BC547A . . . . . . . . . . . . . . . . . 12, 2116
BC547B . . . . . . . . . . . . . . . . . 12, 2116
BC547C . . . . . . . . . . . . . . . . . 12, 2116
BC548 . . . . . . . . . . . . . . . . . . 12, 2116
BC548A . . . . . . . . . . . . . . . . . 12, 2116
BC548B . . . . . . . . . . . . . . . . . 12, 2116

1N5148 . . . . . . . . . . . . . 123, 124, 53


1N5148A . . . . . . . . . . . . . . . . . . . . . . . 53
1N5446ARL . . . . . . . . . . . . . . 124, 56
1N5448ARL . . . . . . . . . . . . . . 124, 56
1N5456A . . . . . . . . . . . . 123, 124, 56
2N3903 . . . . . . . . . . . . . . . . . . . 12, 23
2N3904 . . . . . . . . . . . . . . . . . . . 12, 23
2N3905 . . . . . . . . . . . . . . . . . . . 12, 29
2N3906 . . . . . . . . . . . . . . . . . . . 12, 29
2N4123 . . . . . . . . . . . . . . . . . . 12, 214

BAT54LT1 . . . . . . . . . . . . . . .
BAT54SLT1 . . . . . . . . . . . . . .
BAT54SWT1 . . . . . . . . . . . . .
BAT54T1 . . . . . . . . . . . . . . . .
BAT54WT1 . . . . . . . . . . . . . .
BAV70LT1 . . . . . . . . . . . . . . .
BAV70WT1 . . . . . . . . . . . . . .
BAV74LT1 . . . . . . . . . . . . . . .
BAV99LT1 . . . . . . . . . . . . . . .
BAV99RWT1 . . . . . . . . . . . .

2N4124
2N4125
2N4264
2N4400
2N4401
2N4402
2N4403
2N4410
2N5087
2N5088

..................
..................
..................
..................
..................
..................
..................
..................
..................
..................

12, 214
12, 218
16, 222
12, 227
12, 227
12, 232
12, 232
12, 237
13, 241
13, 247

BAV99WT1 . . . . . . . . . . . . . . 133, 547


BAV170LT1 . . . . . . . . . . . . . . 134, 550
BAV199LT1 . . . . . . . . . . . . . . 134, 552
BAW56LT1 . . . . . . . . . . . . . . 133, 554
BAW56WT1 . . . . . . . . . . . . . 133, 556
BAW156LT1 . . . . . . . . . . . . . 134, 558
BC182 . . . . . . . . . . . . . . . . . . . 12, 279
BC182A . . . . . . . . . . . . . . . . . . . . . . . 279
BC182B . . . . . . . . . . . . . . . . . . . . . . . 279
BC183 . . . . . . . . . . . . . . . . . . . . . . . . 279

BC548C . . . . . . . . . . . . . . . . .
BC549B . . . . . . . . . . . . . . . . .
BC549C . . . . . . . . . . . . . . . . .
BC550B . . . . . . . . . . . . . . . . .
BC550C . . . . . . . . . . . . . . . . .
BC556 . . . . . . . . . . . . . . . . . .
BC556B . . . . . . . . . . . . . . . . .
BC557 . . . . . . . . . . . . . . . . . .
BC557A . . . . . . . . . . . . . . . . .
BC557B . . . . . . . . . . . . . . . . .

2N5089
2N5209
2N5210
2N5400
2N5401
2N5457
2N5458
2N5460
2N5461
2N5462

. . . . . . . . . . . . . . . . . . 13, 247
. . . . . . . . . . . . . . . . . . . . . . . 251
. . . . . . . . . . . . . . . . . . . . . . . 251
. . . . . . . . . . . . . . . . . . . . . . . 255
. . . . . . . . . . . . . . . . . . 15, 255
. . . . . . . . . . . . . . . . 118, 4110
. . . . . . . . . . . . . . . . . . . . . . . 118
. . . . . . . . . . . . . . . . 118, 4113
. . . . . . . . . . . . . . . . 118, 4113
. . . . . . . . . . . . . . . . 118, 4113

BC184 . . . . . . . . . . . . . . . . . . . . . . . . 279
BC212 . . . . . . . . . . . . . . . . . . . 12, 282
BC212B . . . . . . . . . . . . . . . . . . . . . . . 282
BC213 . . . . . . . . . . . . . . . . . . . . . . . . 282
BC214 . . . . . . . . . . . . . . . . . . . . . . . . 282
BC237 . . . . . . . . . . . . . . . . . . . . . . . . 285
BC237A . . . . . . . . . . . . . . . . . . . . . . . 285
BC237B . . . . . . . . . . . . . . . . . . 12, 285
BC237C . . . . . . . . . . . . . . . . . . . . . . . 285
BC238B . . . . . . . . . . . . . . . . . . . . . . . 285

BC557C . . . . . . . . . . . . . . . . . 12, 2123


BC558B . . . . . . . . . . . . . . . . . 12, 2123
BC559B . . . . . . . . . . . . . . . . . 13, 2128
BC559C . . . . . . . . . . . . . . . . . 13, 2128
BC560C . . . . . . . . . . . . . . . . . 13, 2128
BC618 . . . . . . . . . . . . . . . . . . 14, 2131
BC635 . . . . . . . . . . . . . . . . . . . . . . . 2136
BC636 . . . . . . . . . . . . . . . . . . . . . . . 2139
BC637 . . . . . . . . . . . . . . . . . . . . . . . 2136
BC638 . . . . . . . . . . . . . . . . . . . . . . . 2139

2N5484
2N5485
2N5486
2N5550
2N5551
2N5555
2N5639
2N5640
2N6426
2N6427

. . . . . . . . . . . . . . . . 118, 4116
. . . . . . . . . . . . . . . . . . . . . . . 118
. . . . . . . . . . . . . . . . 118, 4116
. . . . . . . . . . . . . . . . . . . . . . . 259
. . . . . . . . . . . . . . . . . . 15, 259
. . . . . . . . . . . . . . . . 119, 4123
. . . . . . . . . . . . . . . . . . . . . . . 119
. . . . . . . . . . . . . . . . 119, 4130
. . . . . . . . . . . . . . . . . . 14, 264
. . . . . . . . . . . . . . . . . . 14, 264

BC238C . . . . . . . . . . . . . . . . . . . . . . . 285
BC239 . . . . . . . . . . . . . . . . . . . 13, 285
BC239C . . . . . . . . . . . . . . . . . . . . . . . 285
BC307 . . . . . . . . . . . . . . . . . . . . . . . . 288
BC307B . . . . . . . . . . . . . . . . . . 12, 288
BC307C . . . . . . . . . . . . . . . . . . . . . . . 288
BC308C . . . . . . . . . . . . . . . . . . . . . . . 288
BC327 . . . . . . . . . . . . . . . . . . . 12, 291
BC32716 . . . . . . . . . . . . . . . . . . . . . 291
BC32725 . . . . . . . . . . . . . . . . . . . . . 291

BC639 . . . . . . . . . . . . . . . . . . 14, 2136


BC640 . . . . . . . . . . . . . . . . . . 14, 2139
BC80716LT1 . . . . . . . . . . 110, 2142
BC80725LT1 . . . . . . . . . . 110, 2142
BC80740LT1 . . . . . . . . . . 110, 2142
BC80825WT1 . . . . . . . . . . . . . . . . 111
BC80840WT1 . . . . . . . . . . . . . . . . 111
BC81716LT1 . . . . . . . . . . 110, 2144
BC81725LT1 . . . . . . . . . . 110, 2144
BC81740LT1 . . . . . . . . . . 110, 2144

2N6515 . . . . . . . . . . . . . . . . . . . . . . . 269
2N6517 . . . . . . . . . . . . . . . . . . 15, 269
2N6519 . . . . . . . . . . . . . . . . . . 15, 269
2N6520 . . . . . . . . . . . . . . . . . . 15, 269
2N7000 . . . . . . . . . . . . . . . . . . 120, 43
2N7002LT1 . . . . . . . . . . 122, 137, 45
2N7008 . . . . . . . . . . . . . . . . . . . . . . . 120
2SA1774 . . . . . . . . . . . . . . . . 112, 275
2SC4617 . . . . . . . . . . . . . . . . 112, 277
BAL99LT1 . . . . . . . . . . . . . . . . 132, 59

BC328 . . . . . . . . . . . . . . . . . . . 12, 291


BC32816 . . . . . . . . . . . . . . . . . . . . . 291
BC32825 . . . . . . . . . . . . . . . . . . . . . 291
BC337 . . . . . . . . . . . . . . . . . . . 12, 294
BC33716 . . . . . . . . . . . . . . . . . . . . . 294
BC33725 . . . . . . . . . . . . . . . . . . . . . 294
BC33740 . . . . . . . . . . . . . . . . . . . . . 294
BC338 . . . . . . . . . . . . . . . . . . . 12, 294
BC33816 . . . . . . . . . . . . . . . . . . . . . 294
BC33825 . . . . . . . . . . . . . . . . . . . . . 294

BC81825WT1 . . . . . . . . . . . . . . . . 111
BC81840WT1 . . . . . . . . . . . . . . . . 111
BC818WT1 . . . . . . . . . . . . . . . . . . . . 111
BC846ALT1 . . . . . . . . . . . . 110, 2146
BC846AWT1 . . . . . . . . . . . . 111, 2150
BC846BLT1 . . . . . . . . . . . . 110, 2146
BC846BWT1 . . . . . . . . . . . 111, 2150
BC847ALT1 . . . . . . . . . . . . 110, 2146
BC847AWT1 . . . . . . . . . . . . 111, 2150
BC847BLT1 . . . . . . . . . . . . 110, 2146

BAS16LT1 . . . . . . . . . . . . . . .
BAS16WT1 . . . . . . . . . . . . . .
BAS21LT1 . . . . . . . . . . . . . . .
BAS4004LT1 . . . . . . . . . . .
BAS4006LT1 . . . . . . . . . . .
BAS40LT1 . . . . . . . . . . . . . . .
BAS7004LT1 . . . . . . . . . . .
BAS70LT1 . . . . . . . . . . . . . . .
BAS116LT1 . . . . . . . . . . . . . .
BAT54ALT1 . . . . . . . . . . . . . .

BC33840 . . . . . . . . . . . . . . . . . . . . . 294
BC368 . . . . . . . . . . . . . . . . . . . 14, 297
BC369 . . . . . . . . . . . . . . . . . . . 14, 297
BC372 . . . . . . . . . . . . . . . . . . . . . . . . 299
BC373 . . . . . . . . . . . . . . . . . . . 14, 299
BC489 . . . . . . . . . . . . . . . . . . 14, 2101
BC489A . . . . . . . . . . . . . . . . . . . . . . 2101
BC489B . . . . . . . . . . . . . . . . . . . . . . 2101
BC490 . . . . . . . . . . . . . . . . . . 14, 2106
BC490A . . . . . . . . . . . . . . . . . . . . . . 2106

BC847BWT1 . . . . . . . . . . . 111, 2150


BC847CLT1 . . . . . . . . . . . . 110, 2146
BC847CWT1 . . . . . . . . . . . 111, 2150
BC848ALT1 . . . . . . . . . . . . 110, 2146
BC848AWT1 . . . . . . . . . . . . 111, 2150
BC848BLT1 . . . . . . . . . . . . 110, 2146
BC848BWT1 . . . . . . . . . . . 111, 2150
BC848CLT1 . . . . . . . . . . . . 110, 2146
BC848CWT1 . . . . . . . . . . . 111, 2150
BC849BLT1 . . . . . . . . . . . . . . . . . . 2146

Alphanumeric Index
112

132, 511
132, 513
132, 516
130, 519
130, 520
130, 518
130, 522
130, 521
133, 523
130, 525

130, 527
130, 529
130, 531
130, 533
130, 535
133, 537
133, 539
133, 542
133, 544
133, 547

Device

12, 2116
13, 2120
13, 2120
13, 2120
13, 2120
12, 2123
12, 2123
12, 2123
12, 2123
12, 2123

Motorola Small-Signal Transistors, FETs and Diodes Device Data

Alphanumeric Index
Device

Page

Device

Page

Device

Page

BC849CLT1 . . . . . . . . . . . . . . . . . . 2146
BC850BLT1 . . . . . . . . . . . . . . . . . . 2146
BC850CLT1 . . . . . . . . . . . . . . . . . . 2146
BC856ALT1 . . . . . . . . . . . . 110, 2154
BC856AWT1 . . . . . . . . . . . . 111, 2159
BC856BLT1 . . . . . . . . . . . . 110, 2154
BC856BWT1 . . . . . . . . . . . 111, 2159
BC857ALT1 . . . . . . . . . . . . 110, 2154
BC857AWT1 . . . . . . . . . . . . 111, 2159
BC857BLT1 . . . . . . . . . . . . 110, 2154

BS107 . . . . . . . . . . . . . . . . . . . 120, 48
BS107A . . . . . . . . . . . . . . . . . . 120, 48
BS170 . . . . . . . . . . . . . . . . . . 120, 411
BSP16T1 . . . . . . . . . . . . . . . 117, 2264
BSP19AT1 . . . . . . . . . . . . . 117, 2266
BSP52T1 . . . . . . . . . . . . . . . 117, 2268
BSP62T1 . . . . . . . . . . . . . . . 117, 2270
BSS63LT1 . . . . . . . . . . . . . . 116, 2273
BSS64LT1 . . . . . . . . . . . . . . 116, 2275
BSS84LT1 . . . . . 122, 137, 32, 413

MGSF1P02ELT1122, 137, 315, 428


MGSF1P02LT1 122, 137, 317, 430
MGSF3441VT1 . . . . . 137, 320, 433
MGSF3441XT1 . . . . . 137, 324, 437
MGSF3442VT1 . . . . . 137, 326, 439
MGSF3442XT1 . . . . . 137, 330, 443
MGSF3454VT1 . . . . . 137, 332, 445
MGSF3454XT1 . . . . . 137, 336, 449
MGSF3455VT1 . . . . . 137, 340, 453
MGSF3455XT1 . . . . . 137, 344, 457

BC857BWT1 . . . . . . . . . . .
BC858ALT1 . . . . . . . . . . . .
BC858AWT1 . . . . . . . . . . . .
BC858BLT1 . . . . . . . . . . . .
BC858BWT1 . . . . . . . . . . .
BC858CLT1 . . . . . . . . . . . .
BC858CWT1 . . . . . . . . . . .
BCP53T1 . . . . . . . . . . . . . .
BCP56T1 . . . . . . . . . . . . . .
BCP68T1 . . . . . . . . . . . . . .

111, 2159
110, 2154
111, 2159
110, 2154
111, 2159
110, 2154
111, 2159
116, 2164
116, 2166
117, 2169

BSS123LT1 . . . . . . . . 122, 137, 416


BSS138LT1 . . . 122, 137, 35, 418
BSV52LT1 . . . . . . . . . . . . . . 114, 2277
DAN222 . . . . . . . . . . . . . . . . . 133, 560
DAP222 . . . . . . . . . . . . . . . . . 133, 562
DTA114YE . . . . . . . . . . . . . 113, 2279
DTA143EE . . . . . . . . . . . . . 113, 2281
DTC114TE . . . . . . . . . . . . . 113, 2282
DTC114YE . . . . . . . . . . . . . 113, 2283
J110 . . . . . . . . . . . . . . . . . . . . . . . . . . 119

MMAD130 . . . . . . . . . . . . . . . 135, 593


MMAD1103 . . . . . . . . . . . . . . 135, 593
MMAD1105 . . . . . . . . . . . . . . 135, 593
MMAD1106 . . . . . . . . . . . . . . . . . . . . 135
MMAD1107 . . . . . . . . . . . . . . 135, 593
MMAD1108 . . . . . . . . . . . . . . 135, 596
MMAD1109 . . . . . . . . . . . . . . 135, 593
MMBD101LT1 . . . . . . 129, 130, 580
MMBD301LT1 . . . . . . 129, 130, 587
MMBD330T1 . . . . . . . . . . . . . . . . . . 130

BCP69T1 . . . . . . . . . . . . . . 117, 2172


BCW29LT1 . . . . . . . . . . . . . . . . . . . 2174
BCW30LT1 . . . . . . . . . . . . . . . . . . . 2174
BCW33LT1 . . . . . . . . . . . . . . . . . . . 2180
BCW60ALT1 . . . . . . . . . . . . . . . . . . 2186
BCW60BLT1 . . . . . . . . . . . . . . . . . . 2186
BCW60DLT1 . . . . . . . . . . . . . . . . . 2186
BCW61BLT1 . . . . . . . . . . . . . . . . . . 2192
BCW61CLT1 . . . . . . . . . . . . . . . . . 2192
BCW61DLT1 . . . . . . . . . . . . . . . . . 2192

J112 . . . . . . . . . . . . . . . . . . . 119, 4138


J202 . . . . . . . . . . . . . . . . . . . 118, 4141
J304 . . . . . . . . . . . . . . . . . . . . . . . . . 4144
J308 . . . . . . . . . . . . . . . . . . . 118, 4151
J309 . . . . . . . . . . . . . . . . . . . 118, 4151
J310 . . . . . . . . . . . . . . . . . . . 118, 4151
M1MA141KT1 . . . . . . . . . . . 132, 564
M1MA141WAT1 . . . . . . . . . . 133, 566
M1MA141WKT1 . . . . . . . . . 133, 568
M1MA142KT1 . . . . . . . . . . . 132, 564

MMBD352LT1 . . . . . . 129, 130, 599


MMBD352WT1 . . . . . . . . . 130, 5101
MMBD353LT1 . . . . . . 129, 130, 599
MMBD354LT1 . . . . . . 129, 130, 599
MMBD355LT1 . . . . . . . . . . . . . . . . . 599
MMBD452LT1 . . . . . . . . . . . . . . . . 5103
MMBD701LT1 . . . . . . 129, 130, 589
MMBD717LT1 . . . . . . . . . . . . . . . . 5105
MMBD770T1 . . . . . . . . . . . . . . . . . . 130
MMBD914LT1 . . . . . . . . . . 132, 5107

BCW65ALT1 . . . . . . . . . . . . . . . . . .
BCW68GLT1 . . . . . . . . . . . . . . . . .
BCW69LT1 . . . . . . . . . . . . . . . . . . .
BCW70LT1 . . . . . . . . . . . . . . . . . . .
BCW72LT1 . . . . . . . . . . . . . . . . . . .
BCX17LT1 . . . . . . . . . . . . . . . . . . .
BCX18LT1 . . . . . . . . . . . . . . . . . . .
BCX19LT1 . . . . . . . . . . . . . . . . . . .
BCX20LT1 . . . . . . . . . . . . . . . . . . .
BCX70GLT1 . . . . . . . . . . . . . . . . . .

2198
2200
2202
2202
2208
2214
2214
2214
2214
2216

M1MA142WAT1 . . . . . . . . . . 133, 566


M1MA142WKT1 . . . . . . . . . 133, 568
M1MA151AT1 . . . . . . . . . . . 132, 570
M1MA151KT1 . . . . . . . . . . . 132, 572
M1MA151WAT1 . . . . . . . . . . 133, 574
M1MA151WKT1 . . . . . . . . . 133, 576
M1MA152AT1 . . . . . . . . . . . . . . . . . 570
M1MA152KT1 . . . . . . . . . . . . . . . . . 572
M1MA152WAT1 . . . . . . . . . . . . . . . . 574
M1MA152WKT1 . . . . . . . . . . . . . . . 576

MMBD1000LT1133, 137, 346, 5109


MMBD1005LT1 134, 137, 348, 5111
MMBD1010LT1134, 137, 350, 5113
MMBD2000T1 133, 137, 346, 5109
MMBD2005T1 134, 137, 348, 5111
MMBD2010T1 134, 137, 350, 5113
MMBD2835LT1 . . . . . . . . . 133, 5115
MMBD2836LT1 . . . . . . . . . 133, 5115
MMBD2837LT1 . . . . . . . . . 133, 5117
MMBD2838LT1 . . . . . . . . . 133, 5117

BCX70JLT1 . . . . . . . . . . . . . . . . . . 2216
BCX70KLT1 . . . . . . . . . . . . . . . . . . 2216
BDB01C . . . . . . . . . . . . . . . . 13, 2222
BDB02C . . . . . . . . . . . . . . . . 13, 2225
BDC01D . . . . . . . . . . . . . . . . 13, 2228
BF199 . . . . . . . . . . . . . . . . . . 16, 2231
BF224 . . . . . . . . . . . . . . . . . . 16, 2235
BF240 . . . . . . . . . . . . . . . . . . . . . . . 2239
BF393 . . . . . . . . . . . . . . . . . . 15, 2242
BF420 . . . . . . . . . . . . . . . . . . 15, 2245

M1MA174T1 . . . . . . . . . . . . . . . . . . . 132
MBD54DWT1 . . . . . . . . . . . . . . . . . . 578
MBD101 . . . . . . . . . . . 129, 130, 580
MBD110DWT1 . . . . . . . . . . . 130, 582
MBD301 . . . . . . . . . . . 129, 130, 587
MBD330DWT1 . . . . . . . . . . . 130, 582
MBD701 . . . . . . . . . . . 129, 130, 589
MBD770DWT1 . . . . . . . . . . . 130, 582
MBF4416DW1T1 . . . . . . . . . . . . . . . 121
MBF5457DW1T1 . . . . . . . . . . . . . . . 121

MMBD3000T1 133, 137, 346, 5109


MMBD3005T1 134, 137, 348, 5111
MMBD3010T1 134, 137, 350, 5113
MMBD6050LT1 . . . . . . . . . 132, 5119
MMBD6100LT1 . . . . . . . . . 133, 5121
MMBD7000LT1 . . . . . . . . . 133, 5123
MMBF170LT1 . . . . . . . . . . . . 122, 459
MMBF0201NLT1122, 137, 352, 461
MMBF0202PLT1122, 137, 356, 465
MMBF2201NT1 122, 137, 360, 469

BF421 . . . . . . . . . . . . . . . . . . 15, 2248


BF422 . . . . . . . . . . . . . . . . . . 15, 2245
BF423 . . . . . . . . . . . . . . . . . . 15, 2248
BF493S . . . . . . . . . . . . . . . . . 15, 2251
BF720T1 . . . . . . . . . . . . . . . 117, 2254
BF721T1 . . . . . . . . . . . . . . . 117, 2256
BF844 . . . . . . . . . . . . . . . . . . 15, 2258
BF959 . . . . . . . . . . . . . . . . . . 16, 2262
BFR30LT1 . . . . . . . . . . . . . . . . . . . . 4134
BFR31LT1 . . . . . . . . . . . . . . . . . . . . 4134

MBT3904DW1T1 . . . . . . . . 111, 2286


MBT3904DW9T1 . . . . . . . . . . . . . . . 111
MBT3906DW1T1 . . . 111, 112, 2286
MBT3906DW9T1 . . . . . . . . . . . . . . . 111
MBT3946DW1T1 . . . . . . . . . . . . . . 2286
MBV109T1 . . . . . . . . . . . . . . 128, 591
MDC3105LT1 . . . . . . . . . . . 138, 2818
MDC5001T1 . . . . . . . . . . . . 138, 2823
MGSF1N02LT1 122, 137, 39, 422
MGSF1N03LT1 122, 137, 312, 425

MMBF2201PT1 . . . . . . . . . . . . . . . . 122
MMBF2202PT1 . . . . . 137, 363, 472
MMBF4391LT1 . . . . . . . . . . 122, 4156
MMBF4392LT1 . . . . . . . . . . 122, 4156
MMBF4393LT1 . . . . . . . . . . 122, 4156
MMBF4416LT1 . . . . . . . . . . 121, 4160
MMBF5457LT1 . . . . . . . . . . 121, 4167
MMBF5460LT1 . . . . . . . . . . 121, 4170
MMBF5484LT1 . . . . . . . . . . 121, 4173
MMBFJ175LT1 . . . . . . . . . . 122, 4180

Motorola Small-Signal Transistors, FETs and Diodes Device Data

Alphanumeric Index
113

Alphanumeric Index
Device

Page

Device

Page

Device

Page

MMBFJ177LT1 . . . . . . . . . . 122, 4181


MMBFJ309LT1 . . . . . . . . . . 121, 4182
MMBFJ310LT1 . . . . . . . . . . 121, 4182
MMBFU310LT1 . . . . . . . . . 121, 4186
MMBT404ALT1 . . . . . . . . . 115, 2296
MMBT918LT1 . . . . . . . . . . . 114, 2298
MMBT1010LT1116, 136, 2300, 367
MMBT2222ALT1 . . . . . . . . 110, 2303
MMBT2222AWT1 . . . . . . . 111, 2301
MMBT2222LT1 . . . . . . . . . . . . . . . . 2303

MMBV2105LT1 . . . . 123, 125, 5135


MMBV2107LT1 . . . . . . . . . 125, 5135
MMBV2108LT1 . . . . . . . . . 125, 5135
MMBV2109LT1 . . . . 123, 125, 5135
MMBV3102LT1 . . . . 127, 128, 5138
MMBV3401LT1 . . . . 131, 132, 5140
MMBV3700LT1 . . . . 131, 132, 5142
MMFT107T1 . . . . . . . . . . . . . 122, 476
MMFT960T1 . . . . . . . . . . . . . 122, 479
MMFT2406T1 . . . . . . . . . . . . 122, 482

MPN3404 . . . . . . . . . 131, 132, 5149


MPN3700 . . . . . . . . . 131, 132, 5142
MPQ2222 . . . . . . . . . . . . . . . . . . . . 2460
MPQ2222A . . . . . . . . . . . . . . 19, 2460
MPQ2369 . . . . . . . . . . . . . . . 19, 2465
MPQ2483 . . . . . . . . . . . . . . . 19, 2469
MPQ2484 . . . . . . . . . . . . . . . 19, 2469
MPQ2906 . . . . . . . . . . . . . . . . . . . . 2471
MPQ2907 . . . . . . . . . . . . . . . . . . . . 2471
MPQ2907A . . . . . . . . . . . . . . 19, 2471

MMBT2369ALT1 . . . . . . . . 114, 2308


MMBT2369LT1 . . . . . . . . . . 114, 2308
MMBT2484LT1 . . . . . . . . . . 115, 2313
MMBT2907ALT1 . . . . . . . . 110, 2319
MMBT2907AWT1 . . . . . . . 111, 2317
MMBT2907LT1 . . . . . . . . . . . . . . . . 2319
MMBT3640LT1 . . . . . . . . . . 114, 2323
MMBT3904LT1 . . . . . . . . . . 110, 2326
MMBT3904WT1 . . . . . . . . . 111, 2332
MMBT3906LT1 . . . . . . . . . . 110, 2341

MMFT6661T1 . . . . . . . . . . . . 122, 484


MMPQ2222 . . . . . . . . . . . . . . . . . . 2428
MMPQ2222A . . . . . . . . . . . . 19, 2428
MMPQ2369 . . . . . . . . . . . . . 19, 2430
MMPQ2907 . . . . . . . . . . . . . . . . . . 2432
MMPQ2907A . . . . . . . . . . . . 19, 2432
MMPQ3467 . . . . . . . . . . . . . 19, 2434
MMPQ3725 . . . . . . . . . . . . . 19, 2436
MMPQ3904 . . . . . . . . . . . . . 19, 2438
MMPQ3906 . . . . . . . . . . . . . 19, 2440

MPQ3467 . . . . . . . . . . . . . . .
MPQ3725 . . . . . . . . . . . . . . .
MPQ3762 . . . . . . . . . . . . . . .
MPQ3798 . . . . . . . . . . . . . . .
MPQ3799 . . . . . . . . . . . . . . .
MPQ3904 . . . . . . . . . . . . . . .
MPQ3906 . . . . . . . . . . . . . . .
MPQ6001 . . . . . . . . . . . . . . .
MPQ6002 . . . . . . . . . . . . . . .
MPQ6100A . . . . . . . . . . . . . .

MMBT3906WT1 . . . . . . . . . 111, 2332


MMBT4401LT1 . . . . . . . . . . 110, 2346
MMBT4403LT1 . . . . . . . . . . 110, 2351
MMBT5087LT1 . . . . . . . . . . 115, 2356
MMBT5088LT1 . . . . . . . . . . . . . . . . 2362
MMBT5089LT1 . . . . . . . . . . 115, 2362
MMBT5401LT1 . . . . . . . . . . 116, 2366
MMBT5550LT1 . . . . . . . . . . . . . . . . 2370
MMBT5551LT1 . . . . . . . . . . 116, 2370
MMBT6427LT1 . . . . . . . . . . . . . . . . 2374

MMPQ6700 . . . . . . . . . . . . . 19, 2442


MMPQ6842 . . . . . . . . . . . . . . . . . . 2443
MMSD71RKT1 . . . . . . . . . . . . . . . . . 132
MMSD101T1 . . . . . . . . . . . . . . . . . . 130
MMSD301T1 . . . . . . . . . . . 130, 5144
MMSD701T1 . . . . . . . . . . . 130, 5144
MMSD914T1 . . . . . . . . . . . 132, 5147
MMSD1000T1 133, 137, 346, 5109
MMUN2111LT1 . . . . . . . . . 112, 2445
MMUN2112LT1 . . . . . . . . . 112, 2445

MPQ6426 . . . . . . . . . . . . . . . 19, 2506


MPQ6502 . . . . . . . . . . . . . . . 19, 2500
MPQ6600A1 . . . . . . . . . . . . . 19, 2503
MPQ6700 . . . . . . . . . . . . . . . 19, 2509
MPQ6842 . . . . . . . . . . . . . . . 19, 2514
MPQ7041 . . . . . . . . . . . . . . . . . . . . 2518
MPQ7042 . . . . . . . . . . . . . . . 19, 2518
MPQ7043 . . . . . . . . . . . . . . . 19, 2518
MPQ7051 . . . . . . . . . . . . . . . 19, 2520
MPQ7091 . . . . . . . . . . . . . . . . . . . . 2523

MMBT6428LT1 . . . . . . . . . . 115, 2379


MMBT6429LT1 . . . . . . . . . . 115, 2379
MMBT6517LT1 . . . . . . . . . . 116, 2383
MMBT6520LT1 . . . . . . . . . . 116, 2388
MMBTA05LT1 . . . . . . . . . . . . . . . . . 2393
MMBTA06LT1 . . . . . . . . . . . 116, 2393
MMBTA13LT1 . . . . . . . . . . . 115, 2395
MMBTA14LT1 . . . . . . . . . . . 115, 2395
MMBTA20LT1 . . . . . . . . . . . . . . . . . 2400
MMBTA42LT1 . . . . . . . . . . . 116, 2406

MMUN2113LT1
MMUN2114LT1
MMUN2115LT1
MMUN2116LT1
MMUN2130LT1
MMUN2131LT1
MMUN2132LT1
MMUN2133LT1
MMUN2134LT1
MMUN2211LT1

.........
.........
.........
.........
.........
.........
.........
.........
.........
.........

112, 2445
112, 2445
112, 2445
112, 2446
112, 2446
112, 2446
112, 2446
112, 2446
112, 2446
112, 2452

MPQ7093 . . . . . . . . . . . . . . . 19, 2523


MPS404A . . . . . . . . . . . . . . . 17, 2525
MPS650 . . . . . . . . . . . . . . . . 14, 2529
MPS651 . . . . . . . . . . . . . . . . 14, 2529
MPS750 . . . . . . . . . . . . . . . . 14, 2529
MPS751 . . . . . . . . . . . . . . . . 14, 2529
MPS918 . . . . . . . . . . . . . . . . 16, 2532
MPS2222 . . . . . . . . . . . . . . . . . . . . 2534
MPS2222A . . . . . . . . . . . . . . 12, 2534
MPS2369 . . . . . . . . . . . . . . . . . . . . 2539

MMBTA43LT1 . . . . . . . . . . . . . . . . . 2406
MMBTA55LT1 . . . . . . . . . . . . . . . . . 2409
MMBTA56LT1 . . . . . . . . . . . 116, 2409
MMBTA63LT1 . . . . . . . . . . . . . . . . . 2410
MMBTA64LT1 . . . . . . . . . . . 115, 2410
MMBTA70LT1 . . . . . . . . . . . . . . . . . 2412
MMBTA92LT1 . . . . . . . . . . . 116, 2417
MMBTA93LT1 . . . . . . . . . . . . . . . . . 2417
MMBTH10LT1 . . . . . . . . . . 114, 2420
MMBTH24LT1 . . . . . . . . . . 114, 2424

MMUN2212LT1
MMUN2213LT1
MMUN2214LT1
MMUN2215LT1
MMUN2216LT1
MMUN2230LT1
MMUN2231LT1
MMUN2232LT1
MMUN2233LT1
MMUN2234LT1

.........
.........
.........
.........
.........
.........
.........
.........
.........
.........

112, 2452
112, 2452
112, 2452
112, 2452
112, 2452
112, 2452
112, 2452
112, 2452
112, 2452
112, 2452

MPS2369A . . . . . . . . . . . . . . 16, 2539


MPS2907 . . . . . . . . . . . . . . . . . . . . 2542
MPS2907A . . . . . . . . . . . . . . 12, 2542
MPS3563 . . . . . . . . . . . . . . . 16, 2532
MPS3638A . . . . . . . . . . . . . . . . . . . 2546
MPS3640 . . . . . . . . . . . . . . . . . . . . 2552
MPS3646 . . . . . . . . . . . . . . . 16, 2555
MPS3904 . . . . . . . . . . . . . . . 13, 2560
MPS3906 . . . . . . . . . . . . . . . 13, 2566
MPS4124 . . . . . . . . . . . . . . . . . . . . 2572

MMBTH69LT1 . . . . . . . . . . 114, 2426


MMBTH81LT1 . . . . . . . . . . 114, 2427
MMBV105GLT1 . . . . 126, 128, 5125
MMBV109LT1 . . . . . . 126, 128, 591
MMBV409LT1 . . . . . 127, 128, 5127
MMBV432LT1 . . . . . 123, 125, 5129
MMBV609LT1 . . . . . 127, 128, 5131
MMBV809LT1 . . . . . 127, 128, 5133
MMBV2101LT1 . . . . 123, 125, 5135
MMBV2103LT1 . . . . . . . . . 125, 5135

MPF102 . . . . . . . . . . . . . . . . 118, 4190


MPF910 . . . . . . . . . . . . . . . . . 120, 487
MPF930 . . . . . . . . . . . . . . . . . 120, 490
MPF960 . . . . . . . . . . . . . . . . . 120, 490
MPF990 . . . . . . . . . . . . . . . . . 120, 490
MPF4392 . . . . . . . . . . . . . . 119, 4197
MPF4393 . . . . . . . . . . . . . . 119, 4197
MPF6659 . . . . . . . . . . . . . . . 120, 493
MPF6660 . . . . . . . . . . . . . . . 120, 493
MPF6661 . . . . . . . . . . . . . . . 120, 493

Alphanumeric Index
114

MPS4126
MPS4250
MPS5179
MPS6428
MPS6507
MPS6521
MPS6523
MPS6560
MPS6601
MPS6602

19, 2476
19, 2479
19, 2483
19, 2486
19, 2486
19, 2489
19, 2495
19, 2500
19, 2500
19, 2503

. . . . . . . . . . . . . . . . . . . . 2574
. . . . . . . . . . . . . . . 13, 2576
. . . . . . . . . . . . . . . 16, 2578
. . . . . . . . . . . . . . . 13, 2580
. . . . . . . . . . . . . . . . . . . . 2582
. . . . . . . . . . . . . . . 13, 2583
. . . . . . . . . . . . . . . 13, 2583
. . . . . . . . . . . . . . . . . . . . 2594
. . . . . . . . . . . . . . . . . . . . 2596
. . . . . . . . . . . . . . . 12, 2596

Motorola Small-Signal Transistors, FETs and Diodes Device Data

Alphanumeric Index
Device

Page

Device

Page

Device

Page

. . . . . . . . . . . . . . . . . . . . 2596
. . . . . . . . . . . . . . . 12, 2596
. . . . . . . . . . . . . . . . . . . . 2602
. . . . . . . . . . . . . . . 14, 2602
. . . . . . . . . . . . . . . 13, 2605
. . . . . . . . . . . . . . . . . . . . 2608
. . . . . . . . . . . . . . . . . . . . 2608
. . . . . . . . . . . . . . . . . . . . 2611
. . . . . . . . . . . . . . . 14, 2611
. . . . . . . . . . . . . . . . . . . . 2614

MSB709RT1 . . . . . . . . . . . 111, 2717


MSB710RT1 . . . . . . . . . . . 111, 2718
MSB1218ART1 . . . . . . . . 111, 2720
MSC2295BT1 . . . . . . . . . 114, 2723
MSC2295CT1 . . . . . . . . . 114, 2723
MSC3130T1 . . . . . . . . . . . . 114, 2724
MSC3930BT1 . . . . . . . . . . . . . . . . 111
MSD601RT1 . . . . . . . . . . 111, 2725
MSD601ST1 . . . . . . . . . . . 111, 2725
MSD602RT1 . . . . . . . . . . 111, 2726

MUN5211DW1T1 . . . . . . . .
MUN5211T1 . . . . . . . . . . . .
MUN5212DW1T1 . . . . . . .
MUN5212T1 . . . . . . . . . . . .
MUN5213DW1T1 . . . . . . .
MUN5213T1 . . . . . . . . . . . .
MUN5214DW1T1 . . . . . . .
MUN5214T1 . . . . . . . . . . . .
MUN5215DW1T1 . . . . . . .
MUN5215T1 . . . . . . . . . . . .

113, 2761
113, 2769
113, 2761
113, 2769
113, 2761
113, 2769
113, 2761
113, 2769
113, 2761
113, 2769

MPS8099 . . . . . . . . . . . . . . . 12, 2614


MPS8598 . . . . . . . . . . . . . . . . . . . . 2614
MPS8599 . . . . . . . . . . . . . . . 12, 2614
MPSA05 . . . . . . . . . . . . . . . . 12, 2619
MPSA06 . . . . . . . . . . . . . . . . 12, 2619
MPSA13 . . . . . . . . . . . . . . . . 14, 2624
MPSA14 . . . . . . . . . . . . . . . . 14, 2624
MPSA17 . . . . . . . . . . . . . . . . 17, 2629
MPSA18 . . . . . . . . . . . . . . . . 13, 2632
MPSA20 . . . . . . . . . . . . . . . . 12, 2636

MSD1010T1 . 116, 136, 2300, 367


MSD1328RT1 . . . . . . . . . 111, 2727
MSD1819ART1 . . . . . . . . 111, 2728
MSD6100 . . . . . . . . . . . . . . . . . . . . 5151
MSD6150 . . . . . . . . . . . . . . . . . . . . 5153
MUN2111T1 . . . . . . . . . . . . 112, 2731
MUN2112T1 . . . . . . . . . . . . 112, 2731
MUN2113T1 . . . . . . . . . . . . 112, 2731
MUN2114T1 . . . . . . . . . . . . 112, 2731
MUN2115T1 . . . . . . . . . . . . 112, 2731

MUN5216DW1T1 . . . . . . .
MUN5216T1 . . . . . . . . . . . .
MUN5230DW1T1 . . . . . . .
MUN5230T1 . . . . . . . . . . . .
MUN5231DW1T1 . . . . . . .
MUN5231T1 . . . . . . . . . . . .
MUN5232DW1T1 . . . . . . .
MUN5232T1 . . . . . . . . . . . .
MUN5233DW1T1 . . . . . . .
MUN5233T1 . . . . . . . . . . . .

113, 2761
113, 2769
113, 2761
113, 2769
113, 2761
113, 2769
113, 2761
113, 2769
113, 2761
113, 2769

MPSA27
MPSA28
MPSA29
MPSA42
MPSA43
MPSA44
MPSA55
MPSA56
MPSA62
MPSA63

. . . . . . . . . . . . . . . . 14, 2642
. . . . . . . . . . . . . . . . . . . . . 2645
. . . . . . . . . . . . . . . . 14, 2645
. . . . . . . . . . . . . . . . 15, 2648
. . . . . . . . . . . . . . . . . . . . . 2648
. . . . . . . . . . . . . . . . 15, 2651
. . . . . . . . . . . . . . . . 12, 2619
. . . . . . . . . . . . . . . . 12, 2619
. . . . . . . . . . . . . . . . . . . . . 2655
. . . . . . . . . . . . . . . . 14, 2655

MUN2116T1
MUN2130T1
MUN2131T1
MUN2132T1
MUN2133T1
MUN2134T1
MUN2211T1
MUN2212T1
MUN2213T1
MUN2214T1

............
............
............
............
............
............
............
............
............
............

112, 2731
112, 2731
112, 2731
112, 2731
112, 2731
112, 2731
112, 2738
112, 2738
112, 2738
112, 2738

MUN5234DW1T1 . . . . . . .
MUN5234T1 . . . . . . . . . . . .
MUN5235DW1T1 . . . . . . .
MUN5311DW1T1 . . . . . . . .
MUN5312DW1T1 . . . . . . .
MUN5313DW1T1 . . . . . . .
MUN5314DW1T1 . . . . . . .
MUN5315DW1T1 . . . . . . .
MUN5316DW1T1 . . . . . . .
MUN5330DW1T1 . . . . . . .

113, 2761
113, 2769
113, 2761
113, 2777
113, 2777
113, 2777
113, 2777
113, 2777
113, 2777
113, 2777

MPSA64
MPSA70
MPSA75
MPSA77
MPSA92
MPSA93
MPSH10
MPSH11
MPSH17
MPSH81

. . . . . . . . . . . . . . . . 14, 2655
. . . . . . . . . . . . . . . . 12, 2658
. . . . . . . . . . . . . . . . 14, 2664
. . . . . . . . . . . . . . . . 14, 2664
. . . . . . . . . . . . . . . . 15, 2666
. . . . . . . . . . . . . . . . . . . . . 2666
. . . . . . . . . . . . . . . . 16, 2669
. . . . . . . . . . . . . . . . 16, 2669
. . . . . . . . . . . . . . . . 16, 2671
. . . . . . . . . . . . . . . . 16, 2673

MUN2215T1 . . . . . . . . . . . .
MUN2216T1 . . . . . . . . . . . .
MUN2230T1 . . . . . . . . . . . .
MUN2231T1 . . . . . . . . . . . .
MUN2232T1 . . . . . . . . . . . .
MUN2233T1 . . . . . . . . . . . .
MUN2234T1 . . . . . . . . . . . .
MUN5111DW1T1 . . . . . . . .
MUN5111T1 . . . . . . . . . . . .
MUN5112DW1T1 . . . . . . . .

112, 2738
112, 2738
112, 2738
112, 2738
112, 2738
112, 2738
112, 2738
113, 2746
113, 2754
113, 2746

MUN5331DW1T1 . . . . . . . 113, 2777


MUN5332DW1T1 . . . . . . . 113, 2777
MUN5333DW1T1 . . . . . . . 113, 2777
MUN5334DW1T1 . . . . . . . 113, 2777
MUN5335DW1T1 . . . . . . . . . . . . . 2777
MV104 . . . . . . . . . . . . 123, 125, 5155
MV209 . . . . . . . . . . . . . 126, 128, 591
MV409 . . . . . . . . . . . . 127, 128, 5127
MV1403 . . . . . . . . . . . 127, 128, 5157
MV1404 . . . . . . . . . . . 127, 128, 5157

MPSL01 . . . . . . . . . . . . . . . . . . . . . 2676
MPSL51 . . . . . . . . . . . . . . . . . . . . . 2680
MPSW01 . . . . . . . . . . . . . . . . . . . . . 2684
MPSW01A . . . . . . . . . . . . . . 14, 2684
MPSW05 . . . . . . . . . . . . . . . . . . . . . 2687
MPSW06 . . . . . . . . . . . . . . . . 13, 2687
MPSW10 . . . . . . . . . . . . . . . . . . . . . 2690
MPSW13 . . . . . . . . . . . . . . . . . . . . . 2693
MPSW14 . . . . . . . . . . . . . . . . . . . . . 2693
MPSW42 . . . . . . . . . . . . . . . . 15, 2696

MUN5112T1 . . . . . . . . . . . .
MUN5113DW1T1 . . . . . . . .
MUN5113T1 . . . . . . . . . . . .
MUN5114DW1T1 . . . . . . . .
MUN5114T1 . . . . . . . . . . . .
MUN5115DW1T1 . . . . . . . .
MUN5115T1 . . . . . . . . . . . .
MUN5116DW1T1 . . . . . . . .
MUN5116T1 . . . . . . . . . . . .
MUN5130DW1T1 . . . . . . .

113, 2754
113, 2746
113, 2754
113, 2746
113, 2754
113, 2746
113, 2754
113, 2746
113, 2754
113, 2746

MV1405
MV1626
MV1628
MV1630
MV1634
MV1638
MV1648
MV1650
MV2101
MV2104

MPSW45 . . . . . . . . . . . . . . . . . . . . . 2699
MPSW45A . . . . . . . . . . . . . . 14, 2699
MPSW51 . . . . . . . . . . . . . . . . . . . . . 2704
MPSW51A . . . . . . . . . . . . . . 14, 2704
MPSW55 . . . . . . . . . . . . . . . . . . . . . 2707
MPSW56 . . . . . . . . . . . . . . . . 13, 2707
MPSW63 . . . . . . . . . . . . . . . . . . . . . 2710
MPSW64 . . . . . . . . . . . . . . . . 14, 2710
MPSW92 . . . . . . . . . . . . . . . . 15, 2713
MSA1022CT1 . . . . . . . . . 114, 2716

MUN5130T1 . . . . . . . . . . . .
MUN5131DW1T1 . . . . . . .
MUN5131T1 . . . . . . . . . . . .
MUN5132DW1T1 . . . . . . .
MUN5132T1 . . . . . . . . . . . .
MUN5133DW1T1 . . . . . . .
MUN5133T1 . . . . . . . . . . . .
MUN5134DW1T1 . . . . . . .
MUN5134T1 . . . . . . . . . . . .
MUN5135DW1T1 . . . . . . .

113, 2754
113, 2746
113, 2754
113, 2746
113, 2754
113, 2746
113, 2754
113, 2746
113, 2754
113, 2746

MV2105 . . . . . . . . . . . 123, 124, 5135


MV2108 . . . . . . . . . . . . . . . . 124, 5135
MV2109 . . . . . . . . . . . 123, 124, 5135
MV2111 . . . . . . . . . . . . . . . . 124, 5135
MV2115 . . . . . . . . . . . 123, 124, 5135
MV7005T1 . . . . . . . . 127, 128, 5160
MV7404T1 . . . . . . . . 127, 128, 5162
P2N2222A . . . . . . . . . . . . . . 17, 2789
P2N2907A . . . . . . . . . . . . . . 17, 2794
PZT651T1 . . . . . . . . . . . . . . 117, 2798

MPS6651
MPS6652
MPS6714
MPS6715
MPS6717
MPS6724
MPS6725
MPS6726
MPS6727
MPS8098

Motorola Small-Signal Transistors, FETs and Diodes Device Data

. . . . . . . . . . . 127, 128, 5157


. . . . . . . . . . . . . . . . 124, 5159
. . . . . . . . . . . 123, 124, 5159
. . . . . . . . . . . . . . . . 124, 5159
. . . . . . . . . . . . . . . . 124, 5159
. . . . . . . . . . . 123, 124, 5159
. . . . . . . . . . . . . . . . 124, 5159
. . . . . . . . . . . 123, 124, 5159
. . . . . . . . . . . 123, 124, 5135
. . . . . . . . . . . . . . . . 124, 5135

Alphanumeric Index
115

Alphanumeric Index
Device
PZT751T1 . . . . . . . . . . . . . .
PZT2222AT1 . . . . . . . . . . .
PZT2907AT1 . . . . . . . . . . .
PZTA14T1 . . . . . . . . . . . . . .
PZTA42T1 . . . . . . . . . . . . . .
PZTA64T1 . . . . . . . . . . . . . .
PZTA92T1 . . . . . . . . . . . . . .

Alphanumeric Index
116

Page
117, 2800
117, 2802
117, 2805
117, 2808
117, 2811
117, 2813
117, 2816

Device

Page

Device

Page

PZTA96T1 . . . . . . . . . . . . . . 117, 2817


VN10LM . . . . . . . . . . . . . . . 120, 4101
VN0300L . . . . . . . . . . . . . . . . 120, 496
VN0610LL . . . . . . . . . . . . . . . 120, 498
VN2222LL . . . . . . . . . . . . . . 120, 4103
VN2406L . . . . . . . . . . . . . . . 120, 4106
VN2410L . . . . . . . . . . . . . . . 120, 4108

Motorola Small-Signal Transistors, FETs and Diodes Device Data

Motorola Small-Signal Transistors, FETs and Diodes Device Data

Selector Guide

Plastic-Encapsulated
Transistors

GreenLine Portfolio
Devices

Small-Signal Field-Effect
Transistors and MOSFETs

Small-Signal Tuning
and Switching Diodes

Tape and Reel Specifications


and Packaging Specifications

Surface Mount
Information

Package Outline
Dimensions

Reliability and
Quality Assurance

10

Replacement
Devices

11

Alphanumeric Index

Motorola Small-Signal Transistors, FETs and Diodes Device Data

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