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23/10/2011

Fabrication Techniques

Saturday 21st March


Various fabrication technique
Research in solution doping
Fibre fabrication technique
The Flat Fibre

23/10/2011

Thin film deposition process steps


In all steps, process monitoring is essential

Terminology
Thin film, thick film
Bulk sample

23/10/2011

Terminology
Bulk sample
More than 100s m thick
Notice the cracks

Terminology
Thin film, thick film
Core typically 5m, cladding typically 15-20m thick
Silica-on-silicon

23/10/2011

Deposition techniques
Thermal Oxidation
Sol Gel
Plasma Enhanced Chemical Vapour Deposition
Flame Hydrolysis Deposition

The Process

Deposition
Obtain blank sample

Channel
Definition
Incorporate circuitries/
waveguides
Obtain devices

23/10/2011

Channel definition techniques


Photolithography
Ion exchange
Femtosecond laser writing
Direct UV-writing

Deposition techniques
Thermal Oxidation

23/10/2011

Thermal Oxidation
The oxidation process is achieved by placing silicon wafers into a high
temperature and high pressure oxygen or water vapour environment
Typical operating temperatures vary and are within the regions of 700 1000C
The deposition rate is a function of the substrate temperature, ambient
pressure and reagent flow rate

Thermal Oxidation
The oxidation furnace
Use of silicon wafer stacks

23/10/2011

Thermal Oxidation
The oxidation furnace
Use of silicon wafer stacks

Deposition techniques
Sol Gel

23/10/2011

Sol Gel
This technique is based on the synthesis of glass via solution chemistry
In this case glass is formed not directly at high temperatures from a melt, but
at low temperatures (< 1200C) from suitable compounds by chemical
polymerisation in a liquid phase
In this way a gel is first formed from which glass may be obtained both by
gradual removal of liquid and densification through thermal treatment
(annealing/sintering)

Sol Gel
Its like making a jelly (yummy)

23/10/2011

Sol Gel
Sol gel mixing
Doesnt look so yummy

Sol Gel
Sol gel processing

23/10/2011

Deposition techniques
Plasma Enhanced Chemical Vapour Deposition

PECVD

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PECVD
PECVD utilises energy provided by RF or microwaves to dissociate the
reactants, creating high energy plasma that would then facilitate thin film
deposition
The main advantage of this technique is that depositions can be carried out at
low temperatures due to the additional energy provided by the plasma

PECVD

when oxygen is used:

SiH4 + O2 SiO2 + 2H2

when nitrous oxide is used as the oxygen source:


SiH4 + 2N2O SiO2 + 2H2 + 2N2; or
SiH4 + 4N2O SiO2 + 4N2 + 2H2O

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Deposition techniques
Flame Hydrolysis Deposition

FHD
In flame hydrolysis deposition (FHD), vapour precursors are introduced in a
flame where they undergo chemical reactions to form soot particles which
are then collected on a planar substrate to form a low density porous
layer
The vapour precursor in this case is silicon tetrachloride (SiCl4)
The porous layer is then consolidated to form a dense glassy layer
This is achieved by heating the samples at temperatures exceeding 1200C

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FHD

FHD

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FHD
The chemical reactions taking place during FHD are as follow
Flame temperature 1200C (direct oxidation): SiCl4 + O2 SiO2 + 2Cl2
Flame temperature < 1200C (hydrolysis): SiCl4 + 2H2O SiO2 + 4HCl

Deposition techniques

advantages
Thermal Oxidation
Sol Gel
Plasma Enhanced Chemical Vapour Deposition
Flame Hydrolysis Deposition

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Deposition techniques

disadvantages
Thermal Oxidation
Sol Gel
Plasma Enhanced Chemical Vapour Deposition
Flame Hydrolysis Deposition

Research
Solution doping
To incorporate gain medium into standard glass samples
Monolithic integration

Doping = incorporation

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Deposition

FHD

The solution doping process

Semi-consolidate

Porous layer

Solution doping

Rare-earth/Bismuth

Fully consolidate

amplifier

Deposition

FHD

The solution doping process

Semi-consolidate

Porous layer

Solution doping

Rare-earth/Bismuth

Fully consolidate

amplifier

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23/10/2011

Deposition

FHD

The solution doping process

Semi-consolidate

Porous layer

Solution doping

Rare-earth/Bismuth

Fully consolidate

amplifier

Bulk vs. thin film

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Deposition

FHD

The passive solution doping process


printer

Semi-consolidate

Porous layer

Solution doping

Rare-earth/Bismuth

Fully consolidate

amplifier

Deposition

FHD

The passive solution doping process


printer

Semi-consolidate

Porous layer

Solution doping

Rare-earth/Bismuth

Fully consolidate

amplifier

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Deposition

FHD

The passive solution doping process


sauna box

Semi-consolidate

Porous layer

Solution doping

Rare-earth/Bismuth

Fully consolidate

amplifier

We used potassium permanganate (KMNO4)


Visible
How to control the diffusion

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23/10/2011

Additional findings
Ring effect
Graded index ring resonators

Channel definition techniques


Photolithography
Ion exchange
Femtosecond laser writing
Direct UV-writing

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Channel definition techniques


Putting optical circuitries into the samples

Channel definition techniques


Photolithography

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Photolithography
Multi-step process

Photolithography
UV photomask

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Photolithography
UV mask aligner and contact lithography

Photolithography
Plasma etching of glass
Etching = removal

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Channel definition techniques


Ion exchange

Ion Exchange
The formation of a high refractive index region beneath a glass layer by
electrically induced migration of ions

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Ion Exchange
The formation of a high refractive index region beneath a glass layer by
electrically induced migration of ions

Ion Exchange
Actually a) is the waveguide and b) is waveguide with silver mirror

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Channel definition techniques


Femtosecond laser writing

Femtosecond laser writing


Femtosecond laser writing is a recently-developed direct writing technique
that relies on ablation of the target substrate, causing the creation of
waveguide structures

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Femtosecond laser writing


Femtosecond laser system

Femtosecond laser writing


Femtosecond laser writing ablation profile

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Channel definition techniques


Direct UV-writing

Direct UV writing
Direct UV writing (DUW) is a technique to define wave guiding channels on
photosensitive materials

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Direct UV writing

An illustration of (a) direct UV writing set up; (b) direct grating writing set up; (c) interference
pattern generated by the crossed beam; (d) photo of direct grating writing. (AOM: acoustooptic modulator).

Channel definition techniques advantages


Photolithography
Ion exchange
Femtosecond laser writing
Direct UV-writing

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23/10/2011

Channel definition techniques disadvantages


Photolithography
Ion exchange
Femtosecond laser writing
Direct UV-writing

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