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Features
Applications
Related Literature
CMRR (dB)
100
80
AV = 1000
60
AV = 100
40
AV = 10
AV = 1
20
0
AV = 0.1
1
10
100
1k
10k
100k
1M
FREQUENCY(Hz)
+5V
TO
+20V
RIN
IN+
VCC
+RIN
+RIN SENSE
-RIN
-RIN SENSE
BRIDGE
EXCITATION
-5V
TO
-20V
RFB
+RFB
+RFB SENSE
VCO
+VFB
ISL28617
VEO
-RFB
SENSE GND
-RFB
V
EE
IN-
R
+VOUT
-VOUT
VCMO
VDD
A-D
CONVERTER
+IN
ISL26132
-IN
-VFB
VREF GND
+5V
VREF
ISL21090
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2012, 2013, 2014. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL28617
Pin Descriptions
ISL28617
(24 LD TSSOP)
TOP VIEW
NC 1
24 IN+
DNC 2
23 IN-
DNC 3
22 DNC
21 +RIN
+RFB 4
+RFB SENSE 5
20 +RIN SENSE
-RFB SENSE 6
19 -RIN SENSE
-RFB 7
18 -RIN
GND 8
17 VCMO
VCC 9
16 VEE
VCO 10
15 VEO
+VFB 11
14 -VFB
13 -VOUT
+VOUT 12
PIN
NAME
PIN NUMBERS
NC
DNC
2, 3, 22
DESCRIPTION
No Internal Connection
For internal use; Do Not Connect.
+RFB
+RFB SENSE
-RFB SENSE
-RFB
GND
VCC
VCO
10
+VFB
11
+VOUT
12
Positive Output
-VOUT
13
Negative Output
-VFB
14
VEO
15
VEE
16
VCMO
17
-RIN
18
-RIN SENSE
19
+RIN SENSE
20
+RIN
21
IN-
23
Negative Input
IN+
24
Positive Input
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
ISL28617FVZ
28617 FVZ
TEMP RANGE
(C)
-40 to +125
PACKAGE
(Pb-Free)
24 Ld TSSOP
PKG.
DWG. #
M24.173
NOTES:
1. Add -T* suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pbfree products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL28617. For more information on MSL please see tech brief TB363.
FN6562.2
November 17, 2014
ISL28617
Simplified Block Diagram
+15V
IN+
ISL28617
VCC
IN+
+RINSENSE
VCO
VCC
+RIN
RIN
-RIN
-RINSENSE
IN-
VEE
+VOUT
IN-
-VOUT
+VFB
+RFBSENSE
+OUT
RL
-OUT
VCMO
VCC
+RFB
RFB
-RFB
-RFBSENSE
-VFB
VEE
VEE
-15V
GND
VEO
GND
FN6562.2
November 17, 2014
ISL28617
Absolute Maximum Ratings
Thermal Information
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5. For JC, the case temp location is taken at the package top center.
Electrical Specifications VCC = VCO = 15V, VEE = VEO = -15V, VCM = 0V, RL = 10kRFB = RIN = 30.1kTA = +25C, unless otherwise
specified. Boldface limits apply over the operating temperature range, -40C to +125C.
PARAMETER
DESCRIPTION
CONDITIONS
MIN
(Note 6)
TYP
MAX
(Note 6)
UNIT
VCC -3V
100
275
INPUT DC SPECIFICATIONS
VCMIRIN
VOSIN
VEE +3V
-100
30
-275
TCVOSIN
IBIN
-2.75
0.3
2.75
V/C
-1
0.2
nA
1.3
nA
0.75
nA
nA
117
-1.3
IOSIN
-0.75
0.2
-1
IRIN
RINCM
CMRR
(Note 7)
87
110
130
102
80
120
dB
107
dB
150
dB
110
dB
FEEDBACK DC SPECIFICATIONS
VCMIRFB
VOSFB
VEE +3V
-1600
400
-3000
IBVFB+,-
VCC -3V
1600
3000
15
nA
OUTPUT DC SPECIFICATIONS
VOL
150
200
mV
200
mV
FN6562.2
November 17, 2014
ISL28617
Electrical Specifications VCC = VCO = 15V, VEE = VEO = -15V, VCM = 0V, RL = 10kRFB = RIN = 30.1kTA = +25C, unless otherwise
specified. Boldface limits apply over the operating temperature range, -40C to +125C. (Continued)
PARAMETER
VOH
ISC
IERR
MIN
(Note 6)
TYP
MAX
(Note 6)
UNIT
150
200
mV
200
mV
RL = 0to GND
45
DESCRIPTION
CONDITIONS
-20
-17
-90
EG
mA
20
mA
17
nA
90
nA
0.003
G = 100
0.004
0.0005
IBVCMO
VEE +3V
-1.3
0.5
-4.75
-0.6
0.2
-1.75
VCC -3V
1.3
mV
4.75
mV
0.6
1.75
2.2
mA
2.85
mA
2.6
mA
2.85
mA
ICO
VCC to VEE
VCO to VEO
RL = OPEN
RL = OPEN
2.25
Dual Supply
20
Single Supply
40
1.5
20
40
Dual Supply
Single Supply
2.05
123
130
118
PSRR VCO to VEO Power Supply Rejection Ratio
110
dB
dB
120
110
dB
dB
AC SPECIFICATIONS
eN
eNrms
iN
iNIERR
iNIERR rms
f = 1kHz
8.6
nV/Hz
f = 0.1 to 10Hz
85
nVrms
f = 1kHz
150
fA/Hz
f = 1kHz
2.6
pA/Hz
f = 0.1 to 10Hz
pArms
FN6562.2
November 17, 2014
ISL28617
Electrical Specifications VCC = VCO = 15V, VEE = VEO = -15V, VCM = 0V, RL = 10kRFB = RIN = 30.1kTA = +25C, unless otherwise
specified. Boldface limits apply over the operating temperature range, -40C to +125C. (Continued)
PARAMETER
-3dB BW
-3dB BW
DESCRIPTION
-3dB Bandwidth vs. Closed Loop Gain,
RFB = 30.1k
SR
Slew Rate
tS
CONDITIONS
MIN
(Note 6)
TYP
MAX
(Note 6)
UNIT
5.5
MHz
2.6
MHz
2.2
MHz
2.0
MHz
0.3
MHz
5.0
MHz
1.4
MHz
0.5
MHz
0.45
MHz
0.4
MHz
V/s
11
NOTES:
6. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
7. Compliance to datasheet limits is assured by Design simulation.
8. VOS,OUT = AV*VOS,IN + VOS,FB + IERR * RFB.
9. Differential Gain(AV) = RFB/RIN.
10. VOUT, clipping ~ IRF*RFB.
FN6562.2
November 17, 2014
ISL28617
Typical Performance Curves
VCC = VCO = 15V, VEE = VEO = -15V, VCM = 0V, RL = Open, unless otherwise specified.
3
10
20
30
40
50
10
20
30
40
50
20
20
15
10
10
Ierr (nA)
Ierr (nA)
5
0
-5
-10
-10
-15
-20
-15
-20
-10
-5
10
15
10
15
VCM (V)
1000
1000
800
800
600
600
400
400
200
0
-200
-600
-800
-800
-1000
-1000
5
10
40
45
50
-600
0
VCM (V)
35
-200
-400
-5
30
200
-400
-10
25
VOSFB (mV)
VOSFB (mV)
-15
20
15
10
15
20
25
30
VSUP (VCC - VEE)
35
40
45
50
FN6562.2
November 17, 2014
ISL28617
Typical Performance Curves
1000
1000
800
800
600
600
400
400
200
200
IOS (pA)
IOS (pA)
VCC = VCO = 15V, VEE = VEO = -15V, VCM = 0V, RL = Open, unless otherwise specified. (Continued)
0
-200
0
-200
-400
-400
-600
-600
-800
-800
-1000
-1000
0
10
15
20
25
30
VSUP (VCC - VEE)
35
40
45
50
15
+IB
600
600
400
200
200
IB (pA)
400
0
-200
-IB
-400
40
45
50
+IB
0
-200
-IB
-400
-600
-600
-800
-800
-10
-5
10
-1000
0
15
10
15
20
25
30
35
40
45
50
VCM (V)
100
100
80
80
60
60
40
40
20
VOS IN (mV)
VOS IN (mV)
35
800
800
0
-20
-40
20
0
-20
-40
-60
-60
-80
-80
-100
-15
20
25
30
VSUP (VCC - VEE)
1000
1000
IB (pA)
10
-1000
-15
-10
-5
10
VCM (V)
15
-100
10
15
20
25
30
35
40
45
50
FN6562.2
November 17, 2014
ISL28617
Typical Performance Curves
VCC = VCO = 15V, VEE = VEO = -15V, VCM = 0V, RL = Open, unless otherwise specified. (Continued)
5
15
4
10
3
INPUT VCM (V)
IBVCMO (mA)
2
1
0
-1
-2
-3
0
-5
-10
-4
-5
-15
-10
-5
10
-15
15
-6
-4
-2
0
2
VOUT+ TO VOUT- (V)
VCMO (V)
15
80
10
60
40
VCC = +10V; VEE = -10V
VCO = +3V; VEO = 0V
RFB = 30k; RIN = 30.1
VCMO = 1.5V
0
-5
20
0
AV = 10
AV = 1
AV = 0.1
-15
-40
10
-3
-2
-1
100
80
-20
AV = 1
AV = 0.1
10
100
1k
10k
100k
1M
10M
100M
FREQUENCY (Hz)
10M
100M
120
100
80
AV = 1000
60 A = 100
V
40 AV = 10
20
1M
140
POSITIVE PSRR (dB)
GAIN (dB)
100k
160
RIN = 1.21k
RFB = 121k
AV = 100
AV = 10
10k
AV = 1000
1k
FREQUENCY (Hz)
20
RIN = 301
RFB = 30.1k
AV = 100
-20
40
AV = 1000
-10
60
GAIN (dB)
0
1
AV = 1
AV = 0.1
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FN6562.2
November 17, 2014
ISL28617
Typical Performance Curves
160
160
140
140
120
120
VCC = VCO = 15V, VEE = VEO = -15V, VCM = 0V, RL = Open, unless otherwise specified. (Continued)
100
80
AV = 1000
60
AV = 100
40
AV = 10
20
0
1
AV = 1
AV = 0.1
10
100
1k
10k
100k
100
80
60
AV = 100
40
AV = 10
20
AV = 1
0
1
1M
AV = 1000
AV = 0.1
10
FREQUENCY (Hz)
160
120
140
180
140
100
AV = 1000
AV = 100
40
AV = 10
20
0
1
AV = 1
100
1k
10k
100k
80
60
40
0
1
1M
AV = 1000
AV = 100
AV = 10
AV = 1
AV = 0.1
10
160
180
140
160
200
120
100
80 A = 1000
V
60 AV = 100
40 AV = 10
100k
FREQUENCY (Hz)
10
10k
100k
1M
140
120
100
80
60
40
20
10k
1k
180
1k
100
FREQUENCY (Hz)
100
1M
100
FREQUENCY (Hz)
20 AV = 1
A = 0.1
0 V
1
10
100k
120
20
AV = 0.1
10
10k
160
60
1k
FREQUENCY (Hz)
80
100
1M
0
1
AV = 1000
AV = 100
AV = 10
AV = 1
AV = 0.1
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FN6562.2
November 17, 2014
ISL28617
Typical Performance Curves
160
140
140
120
CMRR RFB = 30.1k (dB)
VCC = VCO = 15V, VEE = VEO = -15V, VCM = 0V, RL = Open, unless otherwise specified. (Continued)
120
100
80
60
AV = 1000
AV = 100
40 A = 10
V
20 AV = 1
AV = 0.1
0
1
10
100
80
60
40
20
100
1k
10k
100k
0
1
1M
AV = 1000
AV = 100
AV = 10
AV = 1
AV = 0.1
10
100
FREQUENCY (Hz)
80
0
1
1M
AV = 1000
AV = 100
AV = 10
AV = 1
AV = 0.1
10
100
1k
10k
FREQUENCY (Hz)
11
100k
1M
10
100
1
iN
10
0.1
eN
1
0.1
10
100
1k
10k
0.01
100k
100
20
100k
1000
120
40
10k
140
60
1k
FREQUENCY (Hz)
FREQUENCY (Hz)
FN6562.2
November 17, 2014
ISL28617
INPUT
FEEDBACK
OUTPUT
STAGE
STAGE
STAGE
VCO
VCC
0.1F
A5
0.1F
I2
I1
IN-
IN+
I3
+VOUT
I1, I3
I2, I4
I4
+
A6
-
VFB-
500
500
-VOUT
+
A1
-
Q1
Q2
+
A2
-
+
A3
-
IS1
VFB+
+
A4
-
VCMO
100A
100A
VEE
Q4
Q3
IS3 IS4
IS2
VEO
0.1F
0.1F
+RIN
RIN
-RIN
-RINSENSE
+RINSENSE
+RFB
-RFBSENSE
RFB
-RFB
GND
+RFBSENSE
12
FN6562.2
November 17, 2014
ISL28617
Applications Information
General Description section: contains the ISL28617 functional
and performance objectives and description of operation.
Designing with the ISL28617 section: contains the application
circuit design Equations and guidelines for achieving the desired
DC and AC performance levels.
Estimating Amplifier DC and Noise Performance section:
provides Equations for predicting DC offset voltage and noise of
the finished design.
General Description
The ISL28617 Instrumentation Amplifier was developed to
accomplish the following:
Provide a fully differential, rail-to-rail output for optimally
driving ADCs.
(EQ. 1)
(EQ. 2)
Feedback GM Amplifier
The feedback amplifiers A3 and A4 form a differential
transconductance amplifier identical to the input stage. The
input terminals (VFB+, VFB-) connect to the ISL28617 differential
output terminals (+VOUT, -VOUT), so that the output voltage also
appears across the feedback gain resistor RFB.
Operation is the same as the input GM stage and the differential
currents I3 and I4 are given by Equations 3 and 4:
I3 = 100A - {(+VOUT) - (-VOUT)}/RFB
(EQ. 3)
(EQ. 4)
(Figure 31)
Functional Description
Figure 31 shows the functional block diagram for the ISL28617.
Input GM Amplifier
The input stage consists of high performance, wide band
amplifiers A1, A2, GM drive transistors Q1, Q2, and input gain
resistor RIN. Current drive for Q1 and Q2 emitters are provided by
matched pair of 100A current sinks. A unity gain buffer from
each input (IN+, IN-) to the terminals of the input resistor, RIN, is
formed by the connection of the Kelvin resistor sense pins and
drive pins to the terminals of the input resistor, as shown in
Figure 31. In this configuration, the voltage across the input
resistor RIN is equal to the input differential voltage across IN+
and IN-.
The input GM stage operates by creating a current difference in
the collector currents Q1 and Q2 in response to the voltage
difference between the IN+ and IN- pins. When the input voltage
applied to the IN+ and IN- pins is zero, the voltage across the
terminals of the gain resistor RIN, is also zero. Since there is no
current flow through the gain resistor, the transistors Q1 and Q2
collector currents I1 and I2 are equal.
(EQ. 5)
(EQ. 6)
(EQ. 7)
13
FN6562.2
November 17, 2014
ISL28617
Designing with the ISL28617
RIN = RFB/Gain
(EQ. 8)
IN-
500
VCC
IN+
500
+
A1
-
Q1
RIN
Q2
+
A2
ESD
PROTECTION
ESD
PROTECTION
100A
100A
VEE
30
25
20
15
10
5
0
(EQ. 9)
50
100
150
200
250
300
14
350
400
The ISL28617 power supplies are partitioned so that the input stage
and feedback stages are powered from a separate pair of supply
pins (VCC, VEE) than the differential output stage (VCO, VEO). This
partitioning provides the user with the ability to adapt the ISL28617
to a wide variety of input signal power sources that would not be
possible if the supplies were strapped together internally (VCC = VCO
and VEE = VEO). However, powering the input and output supplies
from unequal supplies has restrictions that are described in the next
section.
FN6562.2
November 17, 2014
ISL28617
Powering the Input and Feedback Stages
(VCC, VEE)
The input pins IN+, IN- cannot swing rail-to-rail, but have a
maximum input voltage range given by Equation 10:
VEE+ 3V < (VCMIRIN + VIN) < VCC - 3V;
where VIN = maximum differential voltage IN+ to IN-
(EQ. 10)
This requires the sum of the common mode input voltage and
the differential input voltage to remain within 3V of either the VCC
or VEE rail, otherwise distortion will result.
The feedback pins VFB+ and VFB- have the same input common
mode voltage constraint as the input pins IN+ and IN-. The
maximum input voltage range of the feedback pins is given by
Equation 11:
VEE+ 3V < VCMIRFB < VCC - 3V
where VCMIRFB = (+VOUT - -VOUT) +VCMO
(EQ. 11)
15
ISL28617
EXAMPLE 3: GAINS LESS THAN 1
The ISL28617 is configured to a gain of 0.2V/V driving a
rail-to-rail 3V ADC. In this application, the maximum input
dynamic range is 15V.
- VCC = +18V, VEE = -18V
- VCO = +3V, VEO = GND
- VCMO = +1.5V
- VCC, VEE power supply common connects to GND
In this attenuator configuration, the input signal range is 15V,
which requires an additional 3V of input overhead from the
input supplies. Thus, VCC and VEE = 18V.
AC Performance Considerations
The ISL28617 closed loop frequency response is formed by the
feedback GM amplifier and gain resistor RFB and has the
characteristics of a current feedback amplifier. Therefore, the
-3dB gain does not significantly decrease at high gains as is the
case with the constant gain-bandwidth response of the classic
voltage feedback amplifier.
There are four behaviors of current feedback amplifiers that
must be considered:
Frequency response increases with decreasing values of RFB.
A comparison of the G = 100, -3db response (Figures 18, 19)
RFB at 30.1kvs 121kshows almost a 4X decrease from
2MHz to 0.5MHz.
Gain peaking tends to increase with decreasing values of RFB.
Wide band applications at gains less than 1 (Figures 18, 19)
can have high gain peaking resulting in high levels of
overshoot with pulsed input signals.
Parasitic capacitance at the feedback resistor terminals
(+RFB, -RFB) and the Kelvin sense terminals (+RFBSENSE,
-RFBSENSE) will result in increasing levels of peaking and
transient response overshoot.
To minimize peaking external PC parasitic capacitance should be
minimized as much as possible. The ISL28617 is designed to be
stable with PC board parasitic capacitance up to 20pF and
feedback resistor values down to 30.1k. At gains less than 1,
the maximum parasitic capacitance may have to be limited
further to avoid additional compensation.
Uncorrected gain peaking and high overshoot in the feedback
stage can cause loss of feedback loop stability if the transient
causes the feedback voltage to exceed the common mode input
range of the feedback amplifier or the maximum linear range of
the feedback resistor RFB. Corrective actions include increasing
the size of the feedback resistor (see Figure 32) and rescaling
the input gain resistor RIN, or adding input frequency
compensation described in the next section.
The penalty of increasing the RFB (and RIN rescaling) is increased
noise, so this is generally not the corrective action of choice.
AC Compensation Techniques
The input compensation with a low pass filter (Figure 34) can be
an effective way to block high frequency signals from the
differential amplifier inputs. It does not change the gain peaking
behavior of the feedback loop, but it does block signals from
Submit Document Feedback
16
R/2
DIFFERENTIAL
INPUT SIGNAL
IN-
500
IN+
500
C
R/2
COMMON
MODE ERROR
TRACE
CAPACITANCE
GND
Layout Guidelines
The ISL28617 is a high precision device with wide band AC
performance. Maximizing DC precision requires attention to the
layout of the gain resistors. Achieving good AC response requires
attention to parasitic capacitance at the gain resistor terminals,
and CMRR performance over frequency is ensured with
symmetrical component placement and layout of the input
differential signals to the IN+ and IN- terminals.
To ensure the highest DC precision, the location of the gain
resistors and PC trace connections to the Kelvin connections are
most important. Proper Kelvin connections remove trace
resistance errors so that the amplifier gain accuracy, and gain
temperature coefficients are determined by the gain resistor
matching tolerance. Interconnect constraints preclude mounting
the gain resistors next to each other, so they should be located on
either side of the ISL28617 and as close to the device as
possible. The Kelvin connections are formed at the junction of
the sense pins (RINSENSE, RFBSENSE) and the gain resistor
current drive terminals (RIN, RFB) terminals. This junction
should be made at the terminal pads directly under the ends of
each resistor.
FN6562.2
November 17, 2014
ISL28617
Reduced trace lengths that maintain DC accuracy are also
important for minimizing the capacitance that can degrade AC
stability. This is especially true at gains less than 1. Layout
techniques for precision applications using larger size precision
gain resistors at very low gains (G = 0.1V/V) include removing a
section of the underlying PC ground plane directly under the gain
resistor terminals and body.
Layout guidelines for high CMRR include matching trace lengths
and symmetrical component placement on the circuit that
connects the signal source to the IN+ and IN- pins. This ensures
matching of the IN+ and IN- input impedances (Figure 34).
(EQ. 14)
(EQ. 16)
NOTE: These results are summarized in Table 1.
The gain resistor ohmic values and ratios are all that is required
to estimate DC offset and noise. The following sections illustrate
methods to calculate DC offset and noise performance. These
estimates are useful for optimizing resistor values for noise and
DC offset.
(EQ. 17)
eN(RTI) = eN(RTO)/AV
(EQ. 18)
(EQ. 13)
RIN
(k)
RFB
(k)
AV x VOS(I)
(V)
(Note 11)
VOS(FB)
(V)
(Note 11)
IERR (5nA)
x RFB
(V)
(Note 11)
VOS(RTO)
(V)
Equation 13
VOS(RTI)
(V)
Equation 15
TYPICAL
VOS(RTO)
(V)
Equation 14
TYPICAL
VOS(RTI)
(V)
Equation 16
AV
VO(LIN)
2.5
30
30
30
400
150
580
428
10
120
120
15
400
600
1015
721
100
2.5
0.3
30
1500
400
150
2000
20
1560
15.6
100
10
1.2
120
1500
400
600
2500
25
1669
16.7
NOTE:
11. Chosen for illustration purposes and does not reflect actual device performance.
17
FN6562.2
November 17, 2014
ISL28617
TABLE 2. 1kHz INPUT NOISE AND THERMAL NOISE CONTRIBUTIONS
eN (RTI)
INPUT
REFERRED
NOISE
(nV/Hz)
eN (RTO)
OUTPUT
REFERRED
NOISE
(nV/Hz)
AV
RIN
(k)
RFB
(k)
AV x eN(I)
(nV/Hz)
2 x AV x iN(I)
x 500
(nV/Hz)
AV x (4kT
x RIN)
(nV/Hz)
(4kT x RFB)
(nV/Hz)
RFB x iN(IERR)
(nV/Hz)
eN(FB)
(nV/Hz)
30
30
8.6
0.15
22.3
22.3
78
8.6
86
120
120
8.6
0.15
44.6
44.6
300
8.6
307
100
0.3
30
860
15
223
22.3
78
8.6
892
8.9
100
1.2
120
860
15
446
44.6
300
8.6
1015
10.15
NOTE:
12. eN and iN values are chosen for illustration purposes and may not reflect actual device performance.
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest Rev.
DATE
REVISION
CHANGE
FN6562.2
Corrected Typo under Recommended Operating Conditions on page 4 from VE+ to VEO.
Removed Important note (All parameters having Min/Max specifications are guaranteed. Typ values are for
information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed
tests, therefore: TJ = TC = TA) on page 4 as Note 6 covers this.
Updated About Intersil verbiage.
FN6562.1
FN6562.0
Initial release.
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support
18
FN6562.2
November 17, 2014
ISL28617
Package Outline Drawing
M24.173
24 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 1, 5/10
A
1
7.80 0.10
SEE DETAIL "X"
13
24
6.40
PIN #1
I.D. MARK
4.40 0.10
2
0.20 C B A
12
0.15 +0.05
-0.06
0.65
TOP VIEW
END VIEW
1.00 REF
H
- 0.05
0.90 +0.15
-0.10
1.20 MAX
GAUGE
PLANE
SEATING PLANE
0.25 +0.05
-0.06
0.10 M C B A
0.10 C
0-8
0.05 MIN
0.15 MAX
SIDE VIEW
0.25
0.60 0.15
DETAIL "X"
(1.45)
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
(5.65)
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
(0.65 TYP)
(0.35 TYP)
is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153.
19
FN6562.2
November 17, 2014