Академический Документы
Профессиональный Документы
Культура Документы
DESCRIPTION
APPLICATIONS
BRIDGE AMPLIFIERS
ECG AMPLIFIERS
PRESSURE SENSORS
MEDICAL INSTRUMENTATION
PORTABLE INSTRUMENTATION
WEIGH SCALES
THERMOCOUPLE AMPLIFIERS
RTD SENSOR AMPLIFIERS
DATA ACQUISITION
Sample Request
Click Here
V+
7
VIN-
150kW
150kW
A1
1
A3
RG
VOUT
50kW
8
RFI Filtered Inputs
VIN+
150kW
150kW
A2
REF
G=1+
100kW
RG
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
INA333
SBOS445 JULY 2008 ...................................................................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE-LEAD
PACKAGE DESIGNATOR
MSOP-8
DGK
I333
DFN-8 (2)
DRG
I333A
INA333
(1)
(2)
PACKAGE MARKING
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Available Q4, 2008.
UNIT
+7
Supply voltage
Analog input voltage range (2)
Output short-circuit
(3)
Continuous
40 to +150
65 to +150
+150
4000
1000
200
Junction temperature, TJ
ESD rating
(1)
(2)
(3)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should
be current limited to 10mA or less.
Short-circuit to ground.
PIN CONFIGURATIONS
DGK PACKAGE
MSOP-8
(TOP VIEW)
DRG PACKAGE
DFN-8
(TOP VIEW)
RG
RG
VIN-
V+
VIN+
VOUT
V-
REF
RG
VIN-
VIN+
V-
Exposed
Thermal
Die Pad
on
Underside
RG
V+
VOUT
REF
INA333
INA333
INA333
www.ti.com ...................................................................................................................................................................................................... SBOS445 JULY 2008
TEST CONDITIONS
MIN
TYP
MAX
UNIT
10 25/G
25 75/G
0.1 0.5/G
V/C
5 15/G
V/V
INPUT (1)
Offset voltage, RTI (2)
VOSI
vs Temperature
vs Power supply
PSR
1.8V VS 5.5V
1 5/G
Long-term stability
See note
(3)
Impedance
Differential
ZIN
100 || 3
Common-mode
ZIN
100 || 3
VCM
VO = 0V
CMR
DC to 60Hz
(V) + 0.1
G || pF
G || pF
(V+) 0.1
G=1
80
90
dB
G = 10
100
110
dB
G = 100
100
115
dB
G = 1000
100
115
dB
IB
70
vs Temperature
Input offset current
200
50
vs Temperature
200
pA
pA/C
pA
pA/C
f = 10Hz
50
nV/Hz
f = 100Hz
50
nV/Hz
f = 1kHz
50
nV/Hz
f = 0.1Hz to 10Hz
VPP
100
fA/Hz
pAPP
eNI
G = 100, RS = 0
iN
f = 10Hz
f = 0.1Hz to 10Hz
GAIN
Gain equation
1 + (100k/RG)
Range of gain
Gain error
(1)
(2)
(3)
V/V
1000
V/V
G=1
0.01
0.1
G = 10
0.05
0.25
G = 100
0.07
0.25
G = 1000
0.25
0.5
INA333
SBOS445 JULY 2008 ...................................................................................................................................................................................................... www.ti.com
TEST CONDITIONS
MIN
TYP
MAX
UNIT
GAIN (continued)
Gain vs Temperature
G=1
ppm/C
G > 1 (4)
15
50
ppm/C
Gain nonlinearity
G = 1 to 1000
RL = 10k
10
ppm
OUTPUT
Output voltage swing from rail (5)
VS = 5.5V, RL = 10k
See note
(5)
50
mV
500
pF
40, +5
mA
G=1
150
kHz
G = 10
35
kHz
G = 100
3.5
kHz
G = 1000
350
Hz
G=1
0.16
V/s
G = 100
0.05
V/s
Short-circuit current
ISC
Continuous to common
FREQUENCY RESPONSE
Bandwidth, 3dB
Slew rate
SR
VS = 5V, VO = 4V Step
tS
G=1
VSTEP = 4V
50
G = 100
VSTEP = 4V
400
tS
G=1
VSTEP = 4V
60
G = 100
VSTEP = 4V
500
50% overdrive
75
Overload recovery
REFERENCE INPUT
RIN
300
Voltage range
k
V+
POWER SUPPLY
Voltage range
Single
+1.8
+5.5
Dual
0.9
2.75
75
80
Quiescent current
IQ
VIN = VS/2
50
vs Temperature
TEMPERATURE RANGE
Specified temperature range
40
+125
40
+150
Thermal resistance
(4)
(5)
JA
MSOP
100
C/W
DFN
65
C/W
INA333
www.ti.com ...................................................................................................................................................................................................... SBOS445 JULY 2008
TYPICAL CHARACTERISTICS
At TA = +25C, RL = 10k, VREF = 0, and G = 1, unless otherwise noted.
INPUT VOLTAGE OFFSET DRIFT
(40C to +125C)
-25.0
-22.5
-20.0
-17.5
-15.0
-12.5
-10.0
-7.5
-5.0
-2.5
0
2.5
5.0
7.5
10.0
12.5
15.0
17.5
20.0
22.5
25.0
-0.10
-0.09
-0.08
-0.07
-0.06
-0.05
-0.04
-0.03
-0.02
-0.01
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
Population
Population
VS = 5.5V
Figure 1.
Figure 2.
VS = 5.5V
-75.0
-67.5
-60.0
-52.5
-45.0
-37.5
-30.0
-22.5
-15.0
-7.5
0
7.5
15.0
22.5
30.0
37.5
45.0
52.5
60.0
67.5
75.0
-0.50
-0.45
-0.40
-0.35
-0.30
-0.25
-0.20
-0.15
-0.10
-0.05
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
Population
Population
VS = 5.5V
Figure 3.
Figure 4.
Gain = 1
VS = 1.8V
-5
Noise (1mV/div)
VOS (mV)
VS = 5V
-10
-15
-20
-25
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Time (1s/div)
VCM (V)
Figure 5.
Figure 6.
INA333
SBOS445 JULY 2008 ...................................................................................................................................................................................................... www.ti.com
Noise (0.5mV/div)
1000
Output Noise
100
100
Current Noise
Input Noise
10
10
2
(Input Noise) +
(Output Noise)
1
0.1
Time (1s/div)
Gain = 100
10
100
1k
10k
Frequency (Hz)
Figure 7.
Figure 8.
NONLINEARITY ERROR
G = 1000
G = 100
G = 10
G=1
0.008
0.012
0.004
0
-0.004
-0.008
-0.012
0
0.5
1.0
1.5
2.0
2.5
3.0 3.5
4.0
4.5
5.0
Time (25ms/div)
5.5
VOUT (V)
Figure 9.
Figure 10.
Gain = 100
Time (100ms/div)
Time (10ms/div)
Figure 11.
Figure 12.
INA333
www.ti.com ...................................................................................................................................................................................................... SBOS445 JULY 2008
Gain = 100
Time (ms)
1000
0.001%
100
0.01%
0.1%
10
Time (100ms/div)
1000
100
10
Gain (V/V)
Figure 13.
Figure 14.
GAIN vs FREQUENCY
80
Gain = 1
G = 1000
Supply
60
40
Gain (dB)
Supply (1V/div)
VOUT (50mV/div)
VOUT
G = 100
G = 10
20
G=1
0
-20
-40
-60
Time (50ms/div)
10
100
10k
1k
100k
1M
Frequency (Hz)
Figure 15.
Figure 16.
VS = 5.5V
VS = 2.75V
G=1
VS = 0.9V
Population
CMRR (mV/V)
6
4
G = 10
2
0
-2
-4
G = 100,
G = 1000
-6
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
100
-8
-10
-50
CMRR (mV/V)
Figure 17.
-25
25
50
75
100
125
150
Temperature (C)
Figure 18.
INA333
SBOS445 JULY 2008 ...................................................................................................................................................................................................... www.ti.com
2.0
2.5
G = 1000
120
CMRR (dB)
160
G = 100
100
80
60
G=1
40
G = 10
20
1.0
All Gains
0
-1.0
-2.0
2.5
-2.5 -2.0
0
10
100k
10k
1k
100
-1.0
2.0
1.0
2.5
Frequency (Hz)
Figure 19.
Figure 20.
0.9
VS = +5V
VREF = 0
VS = 0.9V
VREF = 0
0.7
VS = 2.5V
VREF = 0
3
All Gains
2
0.5
0.3
0.1
All Gains
-0.1
-0.3
-0.5
-0.7
-0.9
-0.9
0
0
-0.3
-0.1
0.1
0.3
Figure 21.
Figure 22.
1.8
0.5
0.7
0.9
VS = +1.8V
VREF = 0
1.6
VS = 5V
140
1.4
120
G = 1000
1.2
1.0
+PSRR (dB)
-0.5
All Gains
0.8
0.6
100
G = 100
80
60
G = 10
40
0.4
G=1
20
0.2
0
0
-0.7
0.2
0.4
0.5
0.8
1.0
1.2
1.4
1.6
1.8
10
100
1k
10k
Frequency (Hz)
Figure 23.
Figure 24.
100k
1M
INA333
www.ti.com ...................................................................................................................................................................................................... SBOS445 JULY 2008
G = 1000
-IB
800
100
600
IB (pA)
80
+IB
1000
G = 100
120
-PSRR (dB)
VS = 5V
G = 10
60
400
VS = 0.9V
40
VS = 2.75V
200
G=1
20
0
0
-20
-200
0.1
10
100
1k
10k
100k
1M
-50
25
-25
Frequency (Hz)
Figure 25.
INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE
125
150
45
200
40
VS = 5V
35
150
30
IOS (pA)
IB (pA)
100
Figure 26.
50
25
20
100
VS = 2.75V
50
VS = 1.8V
15
0
VS = 0.9V
10
-50
-100
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
-50
-25
25
75
50
VCM (V)
Temperature (C)
Figure 27.
Figure 28.
100
125
150
(V+)
(V+) - 0.25
(V+) - 0.50
(V+) - 0.75
(V+) - 1.00
(V+) - 1.25
(V+) - 1.50
(V+) - 1.75
VS = 2.75V
70
VS = 0.9V
VS = 5V
60
50
IQ (mA)
VOUT (V)
75
50
Temperature (C)
(V-) + 1.75
(V-) + 1.50
(V-) + 1.25
(V-) + 1.00
(V-) + 0.75
(V-) + 0.50
(V-) + 0.25
(V-)
40
VS = 1.8V
30
20
+125C
+25C
-40C
0
10
20
30
40
50
10
0
60
-50
-25
25
50
75
100
125
150
Temperature (C)
IOUT (mA)
Figure 29.
Figure 30.
INA333
SBOS445 JULY 2008 ...................................................................................................................................................................................................... www.ti.com
IQ (mA)
50
40
VS = 1.8V
30
20
10
0
0
1.0
3.0
2.0
4.0
5.0
VCM (V)
Figure 31.
10
INA333
www.ti.com ...................................................................................................................................................................................................... SBOS445 JULY 2008
APPLICATION INFORMATION
Figure 32 shows the basic connections required for
operation of the INA333. Good layout practice
mandates the use of bypass capacitors placed close
to the device pins as shown.
(1)
V+
0.1mF
VIN-
RFI Filter
150kW
150kW
A1
VO = G (VIN+ - VIN-)
RFI Filter
50kW
RG
G=1+
6
A3
50kW
Load VO
RFI Filter
VIN+
100kW
RG
150kW
150kW
A2
5
Ref
RFI Filter
INA333
4
0.1mF
V-
VO
INA333
Ref
11
INA333
SBOS445 JULY 2008 ...................................................................................................................................................................................................... www.ti.com
(1)
RG ()
NEAREST 1% RG ()
(1)
NC
100k
100k
NC
25k
24.9k
10
11.1k
11k
20
5.26k
5.23k
50
2.04k
2.05
100
1.01k
1k
200
502.5
499
500
200.4
200
1000
100.1
100
NC denotes no connection. When using the SPICE model, the simulation will not converge unless a resistor is connected to the RG pins;
use a very large resistor value.
OFFSET TRIMMING
Most applications require no external offset
adjustment; however, if necessary, adjustments can
be made by applying a voltage to the REF terminal.
Figure 33 shows an optional circuit for trimming the
output offset voltage. The voltage applied to REF
terminal is summed at the output. The op amp buffer
provides low impedance at the REF terminal to
preserve good common-mode rejection.
VIN-
V+
RG
VIN+
INA333
VO
100mA
1/2 REF200
Ref
OPA333
10mV
Adjustment Range
100W
10kW
100W
NOISE PERFORMANCE
The auto-calibration technique used by the INA333
results in reduced low frequency noise, typically only
50nV/Hz, (G = 100). The spectral noise density can
be seen in detail in Figure 8. Low frequency noise of
the INA333 is approximately 1VPP measured from
0.1Hz to 10Hz, (G = 100).
100mA
1/2 REF200
V-
12
INA333
www.ti.com ...................................................................................................................................................................................................... SBOS445 JULY 2008
OPERATING VOLTAGE
Microphone,
Hydrophone,
etc.
INA333
47kW
47kW
INA333
10kW
INA333
SINGLE-SUPPLY OPERATION
13
INA333
SBOS445 JULY 2008 ...................................................................................................................................................................................................... www.ti.com
+3V
3V
2V - DV
RG
300W
VO
INA333
Ref
2V + DV
1.5V
150W
(1)
R1
APPLICATION IDEAS
Additional application ideas are shown in Figure 36 to
Figure 39.
2.8kW
LA
RA
RG/2
INA333
VO
Ref
2.8kW
G = 10
390kW
1/2
OPA2333
RL
1/2
OPA2333
10kW
390kW
14
INA333
www.ti.com ...................................................................................................................................................................................................... SBOS445 JULY 2008
+VS
R1
100kW
fLPF = 150Hz
C4
1.06nF
1/2
OPA2333
RA
+VS
R2
100kW
+VS
3
R6
100kW
1/2
OPA2333
7
RG
R8
100kW
+VS
dc
R3
100kW
R12
5kW
+VS
1
4
5
ac
1/2
OPA2333
VOUT
OPA333
C3
1m F
R13
318kW
GOPA = 200
+VS
1/2
OPA2333
Wilson
LA
GINA = 5
6
INA333
8
LL
R14
1MW
GTOT = 1kV/V
R7
100kW
VCENTRAL
C1
47pF
(RA + LA + LL)/3
fHPF = 0.5Hz
(provides ac signal coupling)
1/2 VS
R5
390kW
+VS
R4
100kW
R9
20kW
1/2
OPA2333
RL
Inverted
VCM
+VS
VS = +2.7V to +5.5V
1/2
OPA2333
BW = 0.5Hz to 150Hz
+VS
R10
1MW
1/2 VS
C2
0.64mF
R11
1MW
fO = 0.5Hz
15
INA333
SBOS445 JULY 2008 ...................................................................................................................................................................................................... www.ti.com
TINA-TI
(FREE DOWNLOAD SOFTWARE)
RELATED PRODUCTS
For monolithic logarithmic amplifiers (such as LOG112 or LOG114) see the link in footnote 1.
Vout
VM1
+
7
VCC
VCC
Ref
RG V+
U5 OPA369
Vdiff
Vref+
1/2 of matched
monolithic dual
NPN transistors
(example: MMDT3904)
R8 10k
Out
U1 OPA335
VCC
U1 INA333
VCC
RG V-
C1 1n
+
Vref+
Vref+
Input I 10n
Vref+
R3 14k
VoA2
3
Vref+
uC Vref/2 2.5
1
+
uC Vref/2 2.5
V1 5
U6 OPA369
VCC
Rset 2.5M
(1) The following link launches the TI logarithmic amplifiers web page: Logarithmic Amplifier Products Home Page
Figure 38. Low-Power Log Function Circuit for Portable Battery-Powered Systems
(Example Glucose Meter)
To download a compressed file that contains the TINA-TI simulation file for this circuit, click the following link:
Log Circuit.
16
INA333
www.ti.com ...................................................................................................................................................................................................... SBOS445 JULY 2008
3V
R1
2kW
RWa
3W
EMU21 RTD3
Pt100 RTD
VT+
U2
OPA333
RWb
3W
RTD+
VT 25
2 _
3V
VT-
RTD-
Mon+
RGAIN
100kW
Mon-
U1 INA333
VDIFF
Out
Ref
8
RG V+
RWc
4W
Temp (C)
(Volts = C)
RG V-
RZERO
100W
PGA112
MSP430
+
7
VREF+
3V
VRTD
RWd
3W
RTD Resistance
(Volts = Ohms)
+
A
IREF1
IREF2
3V
U1 REF3212
VREF
3V
VREF
VREF
Use BF861A
EN
In
OUTS
GNDF GNDS
C7
470nF
OUTF
T3 BF256A
OPA3331 OPA333
Use BF861A
3V
T1 BF256A
+
U3
OPA333
3V
-
V4 3
RSET1
2.5kW
RSET2
2.5kW
RWa, RWb, RWc, and RWd simulate wire resistance. These resistors are included to show the four-wire sense technique immunity to line
mismatches. This method assumes the use of a four-wire RTD.
Figure 39. Four-Wire, 3V Conditioner for a PT100 RTD With Programmable Gain Acquisition System
To download a compressed file that contains the TINA-TI simulation file for this circuit, click the following link:
PT100 RTD.
17
15-Jul-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
INA333AIDGKR
ACTIVE
MSOP
DGK
CU NIPDAU
Level-2-260C-1 YEAR
INA333AIDGKT
ACTIVE
MSOP
DGK
250
CU NIPDAU
Level-2-260C-1 YEAR
INA333AIDRGR
PREVIEW
SON
DRG
1000
TBD
Call TI
Call TI
INA333AIDRGT
PREVIEW
SON
DRG
250
TBD
Call TI
Call TI
Lead/Ball Finish
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
28-Jul-2008
Device
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
INA333AIDGKR
MSOP
DGK
2500
330.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
INA333AIDGKT
MSOP
DGK
250
330.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
Pack Materials-Page 1
28-Jul-2008
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
INA333AIDGKR
MSOP
DGK
2500
370.0
355.0
55.0
INA333AIDGKT
MSOP
DGK
250
370.0
355.0
55.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2008, Texas Instruments Incorporated