GaAlAs-IR-Lumineszenzdiode (880 nm)

GaAlAs Infrared Emitter (880 nm)

Lead (Pb) Free Product - RoHS Compliant

SFH 485 P

Wesentliche Merkmale

Features

GaAlAs-LED mit sehr hohem Wirkungsgrad

Hohe Zuverlssigkeit
Gute spektrale Anpassung an
Si-Fotoempfnger
Gegurtet lieferbar (im Ammo-Pack)
Gruppiert lieferbar

Anwendungen

Applications

IR-Fernsteuerung von Fernseh- und

Rundfunkgerten, Videorecordern,
Lichtdimmern
Gertefernsteuerungen fr Gleich- und
Wechsellichtbetrieb
Sensorik
Diskrete Lichtschranken

IR remote control of hi-fi and TV-sets, video

tape recorders, dimmers
Remote control for steady and varying intensity
Sensor technology
Discrete interrupters

Very highly efficient GaAlAs-LED

High reliability
Spectral match with silicon photodetectors
Available on tape and reel (in Ammopack)
Available in bins

Typ
Type

Bestellnummer
Ordering Code

Gehuse
Package

SFH 485 P

Q62703Q0516

5-mm-LED-Gehuse, plan, klares violettes

Epoxy-Gieharz, Ltspiee im 2.54-mm-Raster (1/10),
Anodenkennzeichnung: krzerer Anschlu
5 mm LED package (T 1 3/4), plane violet-colored
transparent epoxy resin, solder tabs lead spacing
2.54 mm (1/10), anode marking: short lead.

2009-08-21

SFH 485 P
Grenzwerte (TA = 25 C)
Maximum Ratings
Bezeichnung
Parameter

Symbol
Symbol

Wert
Value

Einheit
Unit

Betriebs- und Lagertemperatur

Operating and storage temperature range

Top; Tstg

40 + 100

Sperrspannung
Reverse voltage

VR

Durchlastrom
Forward current

IF

100

mA

Stostrom, 10 s
Surge current

IFSM

2.5

Verlustleistung
Power dissipation

Ptot

200

mW

Wrmewiderstand, freie Beinchenlnge

max. 10 mm
Thermal resistance, lead length between
package bottom and PC-board max. 10 mm

RthJA

375

K/W

Bezeichnung
Parameter

Symbol
Symbol

Wert
Value

Einheit
Unit

Wellenlnge der Strahlung

Wavelength at peak emission
IF = 100 mA

peak

880

nm

Spektrale Bandbreite bei 50% von Imax

IF = 100 mA
Spectral bandwidth at 50% of Imax

80

nm

Abstrahlwinkel
Half angle

40

Grad
deg.

Aktive Chipflche
Active chip area

0.09

mm2

Abmessungen der aktiven Chipflche

Dimension of the active chip area

LB
LW

0.3 0.3

mm

0.5 1

mm

Kennwerte (TA = 25 C)
Characteristics

Abstand Chipoberflche bis Gehusevorderseite H

Distance chip front to case surface

2009-08-21

SFH 485 P
Kennwerte (TA = 25 C)
Characteristics (contd)
Bezeichnung
Parameter

Symbol
Symbol

Wert
Value

Einheit
Unit

Schaltzeiten, Ie von 10% auf 90% und von 90%

auf 10%, bei IF = 50 mA, RL = 50
Switching times, Ie from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50

tr , tf

0.6/0.5

Kapazitt, VR = 0 V, f = 1 MHz
Capacitance

Co

15

pF

VF

1.5 (< 1.8)

3.0 (< 3.8)

Sperrstrom,
Reverse current
VR = 5 V

IR

0.01 ( 1)

Gesamtstrahlungsflu,
Total radiant flux
IF = 100 mA, tp = 20 ms

25

mW

Temperaturkoeffizient von Ie bzw. e,

IF = 100 mA
Temperature coefficient of Ie or e,
IF = 100 mA

TCI

0.5

%/K

Temperaturkoeffizient von VF, IF = 100 mA

Temperature coefficient of VF, IF = 100 mA

TCV

mV/K

Temperaturkoeffizient von , IF = 100 mA

Temperature coefficient of , IF = 100 mA

TC

+ 0.25

nm/K

Durchlaspannung,
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 s

2009-08-21

SFH 485 P
Strahlstrke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of = 0.01 sr
Bezeichnung
Parameter

Symbol

Werte
Values
SFH 485 P-1

SFH 485 P-2

Einheit
Unit

Strahlstrke
Radiant intensity
IF = 100 mA, tp = 20 ms

Ie min
Ie max

3.15
5.5

4.5
-

mW/sr

Strahlstrke
Radiant intensity
IF = 1 A, tp = 100 s

Ie typ.

48

52

mW/sr

1)

Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner als der oben angegebene Bereich /
Only one group in one packing unit (variation lower than the above group)

2009-08-21

SFH 485 P
Relative Spectral Emission
Irel = f ()

Single pulse, tp = 20 s

OHR00877

100

Max. Permissible Forward Current

IF = f (TA)

80

10

60

10 0

100

75

40

10 -1

50

20

10 -2

25

10 -3
800

850

900

950 nm 1000

Forward Current
IF = f (VF), Single pulse, tp = 20 s

10 0

10 1

10 2

10 3 mA 10 4
F

Permissible Pulse Handling

Capability IF = f (), TA = 25 C,duty
cycle D = parameter

OHR00881

10 1

OHR00886

10 4
mA

OHR00880

125

F mA

e (100mA)

0
750

OHR00878

10 2
e

rel

Ie
= f (IF)
Ie 100 mA

Radiant Intensity

20

40

60

80 C 100
T

Forward Current vs. Lead Length

Between the Package Bottom and
the PC-Board IF = f (I), TA = 25 C
OHR00949

120
mA

D = 0.005
0.01
0.02
0.05

10 0

F 100

10 3 0.1
0.2

80

10 -1

60
0.5
10 2

DC

40

10 -2
D=

10 -3

V
VF

tp
T

tp

T
10 1 -5
-4
-3
-2
10 10 10 10 10 -1 10 0

20

10 1 s 10 2
tp

Radiation Characteristics rel = f ()

40

30

20

10

OHR01893

1.0

50
0.8
60

0.6

70

0.4

0.2

80

90

100

1.0

2009-08-21

0.8

0.6

0.4

20

40

60

80

100

120

10

15

20

25 mm 30

SFH 485 P
Mazeichnung
Package Outlines

5.0 (0.197)
4.2 (0.165)

29 (1.142)
27 (1.063)

4.8 (0.189)

5.1 (0.201)

1.8 (0.071)
1.2 (0.047)

5.9 (0.232)
5.5 (0.217)

3.35 (0.132)

Area not flat

0.8 (0.031)
0.4 (0.016)

2.54 (0.100)
spacing

0.6 (0.024)
0.4 (0.016)

3.85 (0.152)
Cathode

1.0 (0.039)

0.6 (0.024)

0.5 (0.020)
Chip position

0.4 (0.016)
GEXY6306

Mae in mm (inch) / Dimensions in mm (inch).

Wellenlten (TTW)

Recommended Solder Pad

TTW Soldering

4.8 (0.189)

Empfohlenes Ltpaddesign

4 (0.157)
OHLPY985

Mae in mm (inch) / Dimensions in mm (inch).

2009-08-21

SFH 485 P
Ltbedingungen
Soldering Conditions
Wellenlten (TTW)
TTW Soldering

(nach CECC 00802)

(acc. to CECC 00802)
OHLY0598

300
C
T

10 s

250

Normalkurve
standard curve

235 C ... 260 C

Grenzkurven
limit curves

2. Welle
2. wave
200
1. Welle
1. wave
150

ca 200 K/s

2 K/s

5 K/s

100 C ... 130 C

100
2 K/s
50

Zwangskhlung
forced cooling

0
0

50

100

150

200

250

Published by
OSRAM Opto Semiconductors GmbH
Leibnizstrasse 4, D-93055 Regensburg
www.osram-os.com
All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1
A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.

2009-08-21

Mouser Electronics
Authorized Distributor

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SFH 485 P