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Internal Use Only

North/Latin America
Europe/Africa
Asia/Oceania

http://aic.lgservice.com
http://eic.lgservice.com
http://biz.lgservice.com

Proporcionado por: Carlos Alexis Ortz Colmenares (Tcnico en Electrnica) San Salvador, El Salvador.

LCD TV
SERVICE MANUAL
CHASSIS : LP91J

MODEL : 26LK310/310Y 26LK310/310Y-TA


MODEL : 26LK311 26LK311-TB
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL62461531 (1104-REV01)

Printed in Korea

CONTENTS

CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION .................................................................9
TROUBLE SHOOTING ............................................................................14
BLOCK DIAGRAM...................................................................................17
EXPLODED VIEW .................................................................................. 18
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-2-

LGE Internal Use Only

SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by
in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

Leakage Current Hot Check (See below Figure)


Plug the AC cord directly into the AC outlet.

General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.

Do not use a line Isolation Transformer during this check.


Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit


Keep wires away from high voltage or high temperature parts.

AC Volt-meter

Before returning the receiver to the customer,


always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)


With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1M and 5.2M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-3-

To Instrument's
exposed
METALLIC PARTS

Good Earth Ground


such as WATER PIPE,
CONDUIT etc.
0.15uF

1.5 Kohm/10W

When 25A is impressed between Earth and 2nd Ground


for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard

LGE Internal Use Only

SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

unit under test.


2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500F to 600F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500F to 600F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500F to 600F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

-4-

LGE Internal Use Only

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.

Circuit Board Foil Repair


Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

-5-

LGE Internal Use Only

SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range

3. Test method

This spec sheet is applied to LCD TV used LP91J chassis.

1) Performance: LGE TV test method followed


2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC

2. Specification
Each part is tested as below without special appointment.
1) Temperature : 255C (779F), CST : 405C
2) Relative Humidity : 6510%
3) Power Voltage: Standard input voltage(100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.

4. Electrical specification
4.1. Model Specification
No

Item

Specification

1.

Market

NON EU

2.

Broadcasting system

Remark

PAL/SECAM B/G/D/K,
PAL I/II, NTSC-M

3.

Available Channel

BAND

PAL

VHF/UHF

E2-C69

2~78

C1~C62

C1~C75

S21~S47

1~71

S1~S41

S2~S44

CATV

NTSC

China(DK) Australia(BG)

4.

Receiving system

Upper Heterodyne

5.

Video Input

PAL, SECAM, NTSC

22LK310/311 : Rear 1EA,


26/32LK310/311 : Rear 1EA, Side 1EA

6.

Component Input

Y/Cb/Cr, Y/ Pb/Pr

Rear

7.

RGB Input

RGB-PC, S/W Upgrade

Rear

8.

HDMI Input

HDMI-DTV, Only PCM MODE

26/32LK310/311 Rear 2EA


22LK310/311 Rear 1EA

9.

Audio Input (4EA)

PC Audio, Component, AV (2EA)

L/R Input (22LK310/311: AV Audio Input 1EA)

10.

RS-232C

Remote control, Commercial control

Rear

11.

USB Input (1EA)

Divx, MP3, JPEG

Only Side

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-6-

LGE Internal Use Only

5. Component Video Input (Y, PB, PR)


Specification

No
Resolution

Remark

H-freq(kHz)

V-freq(Hz)

Pixel Clock(MHz)

720* 480

15.73

59.94

13.500

SDTV, DVD 480I(525I)

720* 480

15.75

60.00

13.514

SDTV, DVD 480I(525I)

720* 576

15.625

50.00

13.500

SDTV, DVD 576I(625I) 50 Hz

720* 480

31.47

59.94

27.000

SDTV 480P

720* 480

31.50

60.00

27.027

SDTV 480P

720* 576

31.25

50.00

27.000

SDTV 576P 50 Hz

1280* 720

44.96

59.94

74.176

HDTV 720P

1280* 720

45.00

60.00

74.250

HDTV 720P

1280* 720

37.50

50.00

74.25

HDTV 720P 50 Hz

10

1920* 1080

28.125

50.00

74.250

HDTV 1080I 50 Hz

11

1920* 1080

33.72

59.94

74.176

HDTV 1080I

12

1920* 1080

33.75

60.00

74.25

HDTV 1080I

13

1920* 1080

56.25

50

148.5

HDTV 1080P

14

1920* 1080

67.432

59.94

148.350

HDTV 1080P

15

1920* 1080

67.5

60.00

148.5

HDTV 1080P

6. RGB
(Analog PC, RGB-DTV - NOT SUPPORT)
Specification

No
Resolution

H-freq(kHz)

V-freq(Hz)

Proposed

Pixel Clock(MHz)

640* 350

31.468

70.09

25.17

EGA

720* 400

31.469

70.09

28.32

DOS

640* 480

31.469

59.94

25.17

VESA( VGA)

800* 600

37.879

60.317

40

VESA( SVGA)

1024* 768

48.363

60.004

65

VESA( XGA)

1280* 768

47.776

59.87

79.5

VESA( WXGA)

1360* 768

47.72

59.799

84.75

VESA( WXGA)

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-7-

Remark

LGE Internal Use Only

7. HDMI input - PC
(Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable)
No

Resolution

H-freq(kHz)

V-freq.(Hz)

Pixel clock(MHz)

640 x 480

31.469

59.94

25.17

VESA( VGA)

Proposed

800 x 600

37.879

60.317

40.00

VESA( SVGA)

1024 x 768

48.363

60.004

65.00

VESA( XGA)

1280 x 768

47.776

59.87

79.5

VESA( WXGA)

1360 x 768

47.72

59.799

84.62

VESA( WXGA)

1366 x 768

47.7

60.00

84.62

WXGA

1280 x 1024

63.595

60.00

108.875

SXGA

1920 x 1080

66.647

59.988

138.625

WUXGA

Remarks

8. HDMI input (DTV)


Specification

No
Resolution

H-freq(kHz)

Proposed

Remarks

V-freq(Hz)

Pixel Clock(MHz)

15.73

59.94

13.500

SDTV, DVD 480I(525I)

Spec. out
but display.

720 x 480

720 x 480

15.75

60.00

13.514

SDTV, DVD 480I(525I)

720 x 576

15.625

50.00

13.500

SDTV, DVD 576I(625I) 50 Hz

720 x 480

31.47

59.94

27

SDTV 480P

720 x 480

31.5

60.00

27.027

SDTV 480P

720 x 576

31.25

50.00

27

SDTV 576P

1280 x 720

44.96

59.94

74.176

HDTV 720P

1280 x 720

45

60.00

74.25

HDTV 720P

1280 x 720

37.5

50.00

74.25

HDTV 720P

10

1920 x 1080

28.125

50.00

74.25

HDTV 1080I

11

1920 x 1080

33.72

59.94

74.176

HDTV 1080I

12

1920 x 1080

33.75

60.00

74.25

HDTV 1080I

13

1920 x 1080

56.25

50.00

148.5

HDTV 1080P

14

1920 x 1080

67.432

59.94

148.350

HDTV 1080P

15

1920 x 1080

67.5

60.00

148.5

HDTV 1080P

16

1920 x 1080

27

24.00

74.25

HDTV 1080P

17

1920 x 1080

33.75

30.00

74.25

HDTV 1080P

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-8-

LGE Internal Use Only

ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV, LP91J
chassis.

(2) Download steps


1) Execute ISP Tool program, the main window(Mstar ISP
utility Vx.x.x) will be opened.
2) Click the Connect button and confirm Dialog Box.

2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 C 5 C of temperature and 65 % 10 % of relative
humidity if there is no specific designation.
4) The input voltage of the receiver must keep 100-220 V,
50/60 Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.

3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.
(3) Download the EDID
- EDID datas are automatically download when adjusting
the Tool Option2
(4) ADC Calibration - RGB / Component
(4) Check SW Version.

3) Click the Config. button and Change speed I2C Speed


setting : 350 Khz ~ 400 Khz.

3.2. SET assembly adjustment items


(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input

4. PCB assembly adjustment method


4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack

4) Read and write bin file.


Click (1)Read tab, and then load download file
(XXXX.bin) by clicking Read.

1

1

Filexxx.bin

Fi

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-9-

LGE Internal Use Only

Filexxx.bin

5) Click (2)Auto tab and set as below.


6) Click (3)Run.
7) After downloading, you can see the (4)Pass message.

(3). Adjustment method


- The input methods are same as other chassis.(Use INSTART key on the Adjust remote control.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value
Caution : Dont Press IN-STOP key after completing the
function inspection.

4.3. EDID Download method


Recommend that dont connect HDMI and RGB(D-SUB) cable
when downloading the EDID. If not possible, recommend that
connect the MSPG equipment.
There are two methods of downloading the EDID data.

4.1.2. Using the Memory Stick


* USB download : Service Mode
1) Insert the USB memory stick to the USB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message Copy the file from the Memory

4.3.1. 1st Method


EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2 seconds.

4) After Finished the Download, Automatically DC Off -> On


4.3.2. 2nd Method
* Caution :
Must be checked that the tool option is right or not.
If tool option is wrong, HDMI EDID data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear OK, then complete.

5) If the TV is turn on, check the updated SW Version and tool


option.

4.2. Input tool option


Adjust tool option refer to the BOM.
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process

4.3.3. RS-232C command Method


(1) Command : AE 00 10

After Input Tool Option and AC off


Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)

* Caution
Dont connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of EDID could be
failed.

(1) Profile : Must be changed the option value because being


different with some setting value depend on module
maker, inch and market.
(2) Equipment : adjustment remote control.
Copyright 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 10 -

LGE Internal Use Only

4.3.4. EDID data


(1) Analog(RGB): 128bytes>
0

4.4. ADC Calibration


8

00

FF

FF

FF

FF

FF

FF

00

1E

6D

01

00

01

01

01

01

10

01

15

01

03

08

46

27

78

0A

D9

B0

A3

57

49

9C

25

20

11

49

4B

A1

08

00

45

40

01

01

61

40

01

01

01

01

30

01

01

01

01

01

01

1B

21

50

A0

51

00

1E

30

48

88

40

35

00

BC

88

21

00

00

1C

0E

1F

00

80

51

00

1E

30

50

40

80

37

00

BC

88

21

00

00

18

00

00

00

FC

00

4C

60

47

20

54

56

0A

20

20

20

20

20

20

20

00

00

00

FD

70

00

3A

3F

1C

44

0F

00

0A

20

20

20

20

20

20

00

55

4.4.1. ADC Calibration - Component (Using External pattern)


(1) Required Equipments
- Remote control for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60 Hz 100 % Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )

(2) HDMI 1 : 256Bytes


0

00

FF

FF

FF

FF

FF

FF

00

1E

6D

01

00

01

01

01

01

10

01

15

01

03

80

46

27

78

0A

D9

B0

A3

57

49

9C

25

20

11

49

4B

21

08

00

45

40

01

01

61

40

01

01

01

01

30

01

01

01

01

01

01

01

1D

00

72

51

D0

1E

20

6E

28

40

55

00

C4

8E

21

00

00

1E

1B

21

50

A0

51

00

1E

30

50

48

88

35

00

BC

77

21

00

00

1C

00

00

00

FC

00

4C

60

47

20

54

56

0A

20

20

20

20

20

20

20

00

00

00

FD

70

00

3A

3F

1C

44

0F

00

0A

20

20

20

20

20

20

01

C2

80

02

03

25

F1

4F

84

07

01

16

02

03

11

12

13

14

05

90

20

22

1F

10

23

09

07

07

83

01

00

00

68

03

0C

00

A0

10

00

80

1E

00

01

1D

00

80

51

D0

1C

20

40

80

35

B0

00

BC

88

21

00

00

1E

8C

0A

D0

8A

20

E0

2D

10

10

C0

3E

96

00

13

8E

21

00

00

18

8C

0A

A0

14

51

F0

16

D0

00

26

7C

43

00

C4

8E

21

00

00

98

01

1D

80

18

71

E0

1C

16

20

58

2C

25

00

C4

8E

21

00

00

9E

00

00

00

F0

00

00

00

00

00

00

00

00

00

00

00

00

00

00

00

2A

(3) HDMI 2 : 256Bytes


0

00

FF

FF

FF

FF

FF

FF

00

1E

6D

01

00

01

01

01

01

10

01

15

01

03

80

46

27

78

0A

D9

B0

A3

57

49

9C

25

20

11

49

4B

21

08

00

45

40

01

01

61

40

01

01

01

01

30

01

01

01

01

01

01

01

1D

00

72

51

D0

1E

20

6E

28

40

55

00

C4

8E

21

00

00

1E

1B

21

50

A0

51

00

1E

30

50

48

88

35

00

BC

77

21

00

00

1C

00

00

00

FC

00

4C

60

47

20

54

56

0A

20

20

20

20

20

20

20

00

00

00

FD

70

00

3A

3F

1C

44

0F

00

0A

20

20

20

20

20

20

01

C2

80

02

03

25

F1

4F

84

07

01

16

02

03

11

12

13

14

05

90

20

22

1F

10

23

09

07

07

83

01

00

00

68

03

0C

00

A0

20

00

80

1E

00

01

1D

00

80

51

D0

1C

20

40

80

35

B0

00

BC

88

21

00

00

1E

8C

0A

D0

8A

20

E0

2D

10

10

C0

3E

96

00

13

8E

21

00

00

18

8C

0A

A0

14

51

F0

16

D0

00

26

7C

43

00

C4

8E

21

00

00

98

01

1D

80

18

71

E0

1C

16

20

58

2C

25

00

C4

8E

21

00

00

9E

00

00

00

F0

00

00

00

00

00

00

00

00

00

00

00

00

00

00

00

1A

3) Press ADJ key on Remote control for adjustment.


4) Enter Password number. Password is 0 0 0 0.
5) Select 0. ADC calibration : Component by using D/E
(CH +/-) and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear.
OK

4.4.2. ADC Calibration - RGB


4.4.2.1. Method of Using External pattern
(1) Required Equipments
- Remote control for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60 Hz Horizontal Color Bar
signal into RGB. (MSPG-925F Model: 60 / Pattern: 65 )

3) Press ADJ key on remote control for adjustment.


4) Enter Password number. Password is 0 0 0 0.
5) Select 0. ADC calibration : RGB by using D/E(CH +/-)
and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear.
OK

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 11 -

LGE Internal Use Only

4.4.2.1. Method of Using Internal pattern


(1) Apply model : 22/26/32LK310/311
(2) Process
1) Change the Input to RGB mode..
2) Press ADJ key on remote control for adjustment.
3) Enter Password number. Password is 0 0 0 0.
4) Select 0. ADC calibration : RGB by using D/E(CH +/-)
and press ENTER(A).
5) ADC adjustment is executed automatically .
6) When ADC adjustment is finished, this OSD appear.

5. PCB assembly adjustment method


5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Countrys Language and
signal Condition.
(2) Equipment : Adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use INSTART Key on the Adjust Remote control.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value.

OK

* Caution : No need to connect external input cable.


* Caution : Adjustment result is applied after SET Off/On.

5.2. Adjustment of White Balance


(For Automatic Adjustment)
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm
- Required Equipment
1) Remote control for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product LCD TV(ch : 9)
(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for Auto adjustment)

4.5. Check SW Version


(1) Method
1) Push In-star key on Adjust remote-control.
2) SW Version check
Check SW VER : V3.xx
MODEL :

32LK310

SW VER :
V3.04
Mod e : Hom e Use

ADC CAL.
RGB:
OK
Comp onent SD : OK
Comp onent HD : OK

Tool Option 1
Tool Option 2
Area Option
Option 1

RGB :
HDMI1 :
HDMI2 :

NG
NG
NG

816
4181
40
0

Option 2
System Con trol
System Con tro l 2
Power Off History
Davinci/Auto Test

Area Option
Lang. Group

UTT

5.2.1 Adjustment of White Balance (For automatic adjustment)

ETC
NTSC-ALL

* LP91J Support RS-232C & I2C Interface For ADC/DDC


Adjustment.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heatrun pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(WB 00 FF) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with aging
command (F3, 00, 00)
(4) Release the adjust mode of white balance
- Enter the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 12 -

LGE Internal Use Only

5.2.2. Adjustment of White Balance (for Manual adjustment)


(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing POWER
ON key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push Exit key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter 0000 (Password)
6) Select 3. W/B ADJUST
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on Adjustment remote control.
9) Adjust R/G/B Gain using F / G (VOL +/-) key on
Adjustment remote control.
10) Adjust three modes all (Cool/ Medium/ Warm) : Fix the
one of R/G/B gain and change the others
11) When adjustment is completed, Enter COPY ALL.
12) Exit adjustment mode using EXIT key on Adjustment
remote control.

- To check the Coordinates of White Balance, you have to


measure at the below conditions.
Picture Mode : Select Vivid and change Dynamic Contrast :
Off, Dynamic Colour : Off -> Picture Mode change ->
Vivid(User)
(If you miss the upper condition, the coordinates of W/B can
be lower than the spec.

* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
Coordinate
Mode

Temp

uv

0.273 0.002

13,000 K

0.000

0.285 0.002

0.293 0.002

9,300 K

0.000

0.313 0.002

0.329 0.002

6,500 K

0.003

Cool

0.269 0.002

Medium
Warm

- 22LK310/311(Small size inchs color coordinate is different


from others, so use below table.)
Coordinate
Mode

Temp

uv

Cool

0.285 0.002

0.293 0.002

9,300 K

0.000

Medium

0.295 0.002

0.305 0.002

8,000 K

0.000

Warm

0.313 0.002

0.329 0.002

6,500 K

0.003

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 13 -

LGE Internal Use Only

TROUBLESHOOTING
No power
(LED indicator off)

[A] PROCESS

Fail

Check 24V, 12V, 3.5V


of Power B/D

Check short of Main B/D


or Change Power B/D

Pass

Fail

Check Output of
IC1001, IC1003, IC1007

Check short of IC1001,


IC1003, IC1007

Fail

Re-soldering or Change defect


part of IC1001, IC1003, IC1007

Pass
Pass
Change IC1002, IC1008, Q1003
Fail
Check LED Assembly

Change LED Assembly

Pass

Check P400 Connector

No Raster

[B]: Process

Pass

Check LED status


On Display Unit

Fail

Repeat A PROCESS

Pass

Check Panel Link Cable


Or Module

Fail

Change Panel Link Cable


Or Module

Fail

Change Inverter Connector


Or Inverter

Pass

Check Inverter Connector


Or Inverter
Pass

Check Output of IC802

Fail

Change IC802

Pass
Check LVDS Cable

Fail

Copyright 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

Change Module

- 14 -

LGE Internal Use Only

No Raster on PC Signal
Pass
Check Input source Cable
And Jack
Pass
Check the Input/Output
Of J202

Fail

Re-soldering or
Change the defect part

Pass
Check the Input/Output
Of IC201

Fail

Re-soldering or
Change the defect part,
Check RGB EDID Data

Pass
Check the Input/Output
Of IC800

Fail

Re-soldering or
Change the defect part

Pass
Repeat [A], & [B] Process

No Raster on HDMI Signal

No Raster on COMMPONENT Signal

Pass

Pass

Check Input source


Cable And Jack

Check Input source


Cable And Jack

Pass

Pass
Check The Input/Output
Of JK101

Check the Input/Output


of JK301, JK302
Fail

Re-soldering or
Change the defect part

Check the Input/Output


of IC300, IC301

Fail

Re-soldering or
Change the defect part

Pass

Pass

Check the Input/Output


Of IC800

Fail

Re-soldering or
Change the defect part

Fail

Re-soldering or
Change the defect part
Check HDMI EDID Data
Re-download HDCP

Pass
Check the Input/Output
of IC800

Repeat [A], & [B] Process

Fail

Re-soldering or
Change the defect part

Pass
Repeat [A], & [B] Process

Copyright 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 15 -

LGE Internal Use Only

No Raster On AV (Video, S-Video)Signal

No Signal On TV(RF) Signal

Pass

Pass

Check Input source


Cable And Jack

Check Input source


Cable And Jack

Pass
Pass
Check The Input/Output
of JK102

Fail

Re-soldering or
Change the defect part

Check The Input/Output


Of TU500

Pass
Check the Input/Output
of IC800

Fail

Re-soldering or
Change the defect part

Fail

Re-soldering or
Change the defect part

Pass

Fail

Re-soldering or
Change the defect part

Check the Input/Output


of IC800

Pass

Pass

Repeat [A], & [B] Process

Repeat [A], & [B] Process

No Sound

Check The Input Sourse

Fail

Change The Source Input

Pass

Check The Input/Output


Of IC600

Fail

Re-soldering or
Change the defect part

Pass

Check The Speaker

Fail

Change Speaker

Pass

Check The Speaker Wire

Copyright 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 16 -

LGE Internal Use Only

REAR

HDMI2
(JK302)

HDMI1
(JK301)

USB(SVC)
(JK205)

RS-232C
(JK200)

RGB-PC
(JK202)

PC-SOUND
(JK203)

COMPONENT / AV1
Audio out (JK102)

- 17 -

TUNER
(TU500)

Copyright 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

TU500

HDMI3
(JK303)

DDC_SCL1/SDA1

DDC_SCL2/SDA2

IC201
EEPROM DSUB_SCL/SDA
24C02

EEPROM
24C02

IC300

EEPROM
24C02

IC301

EEPROM DDC_SCL3/SDA3
24C02

IC302

IR & LED (P201)

M_SCL/SDA

COMPONENT_L/R : 500mVrm s
AV_LIN/RIN : 500mVrm s

Controller
ST3232CDR

IC200

USB
(JK204)

COMPONENT_Y/Pb/Pr : 1/0.7Vpp
AV_VIN : 1Vpp

RXD/TXD

TMDS

AV2
(JK201)

TXCE0
TXCE1
TXCE2
TXCE3
TXCE4
TXCLKE
TXCLKO
TXCO0
TXCO1
TXCO2
TXCO3
TXCO4

DDR2_BA0/1
DDR2_MCLK
DDR2_CKE
DDR2_WEZ
DDR2_ODT
DDR2_DQS0
DDR2_DQS1
DDR2_DQM0/1

TU_MAIN

COMP_Y/Pb/Pr
COMP_LIN/RIN
AV_VIN
AV_LIN/RIN

SIDE_VIN
SIDE_LIN/RIN

(IC800)

(LGE4767A)
PC_AUD_L/R

PC_R/G/B
PC_VS/HS

I2S_MCLK
I2S_SDO
I2S_WS
I2S_SCK

MAIN SCLAER
Matri x

TXD/RXD

USB DN/DP

HDMI_DATA2

HDMI_DATA1

HDMI_DATA0

IC802

RL_ON/IDISP_EN

E-DIM

LIPS

R_CH
L_CH

NTP3200L

IC600

DDR2 SDRAM
(512M Byte)

IC900

EEPROM
(24LC256)

IC801

EEPROM
HDCP
(24WC08)

IC803

Serial Flash
(MX25L64)

PANEL_STATUS

M_SCL/SDA

EEP_SCL/SDA

EEP_SCL/SDA

SPI_CLK/DI

SPI_CZ/DO

FHD LVDS connector


OPC_OUT

SPK_L

SPK_R

P401

P402
P403

HD LVDS conn ector

SIDE

BLOCK DIAGRAM

LGE Internal Use Only

EXPLODED VIEW
IMPORTANT SAFETY NOTICE

910

810

Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 18 -

A5
A2

510

300

A21

500

A10

120

122

200

550

900

530

800

540

LV1

521

400

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by
in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

LGE Internal Use Only

EAX64045802
LP91J

COMPONENT / AV IN / AV AUDIO OUT

NON_AUDIO_OUT

AUDIO_OUT
JK102

JK101
PPJ238-01

PPJ239-03
6C

[RD1]E-LUG

6H

[RD1]E-LUG

5C

[RD1]O-SPRING

5H

[RD1]O-SPRING_2

4C

[RD1]CONTACT

4H

[RD1]CONTACT_2

5B

[WH1]O-SPRING

5G

[WH1]O-SPRING_2

4A

[YL1]CONTACT

4F

[YL1]CONTACT_1

5A

[YL1]O-SPRING

5F

[YL1]O-SPRING_1

6A
6H

[YL1]E-LUG

[RD2]E-LUG

7F
5E

R116

[RD2]O-SPRING_2

7E

R112
220K

D104
30V

R111
220K

R120
12K

CVBS_LIN

10K

R119
12K

P_12V_SMALL_15V
ZD104
SD05
ZD105
SD05

[YL1]E-LUG-S

GAIN X 4

CVBS_VIN
R110
75

E
C

[RD1]O-SPRING_1

ISA1530AC1
Q101

R105
470

C
E

R123

C101

1K

C103
5600pF
50V

R122
0

10uF
16V

MNT_ROUT

JP101

RT1C3904-T112
Q102
R106
47

MNT_VOUT_T

R101
220

Q104
C
E

[RD1]E-LUG-S
C
E

RT1C3904-T112

R102
402
READY

MUTE_LINE
POP NOISE

R103
68

Q103

4H

[RD2]CONTACT

5G

[WH2]O-SPRING

RT1C3904-T112

5D

[WH1]O-SPRING

R124
ZD107
30V

5F

CVBS_RIN

10K

R115

ZD106
30V

5H

D105
30V

[RD2]O-SPRING_1

6D

C102

1K

C104
5600pF
50V

[WH1]E-LUG

[RD2]E-LUG-S

6N

[RD2]E-LUG

5E

[BL2]O-SPRING

5N

[RD2]O-SPRING_2

MNT_LOUT

Q106
RT1C3904-T112

E
C
E

7F

10uF
16V

R125
0

MUTE_LINE
POP NOISE

B
Q105
RT1C3904-T112

AUDIO_OUT OPTION BLOCK


R113
D100
30V

7E

[BL2]E-LUG-S

4N

R100
220K

10K

COMP2_R
R117
12K

[RD2]CONTACT

JP102
R121

4D

[GN2]CONTACT

5M

75

[WH2]O-SPRING

5D

[GN2]O-SPRING

5L

[RD2]O-SPRING_1

6D

[GN2]E-LUG

7L

[RD2]E-LUG-S

5K

[BL2]O-SPRING

7K

[BL2]E-LUG-S

4J

[GN2]CONTACT

5J

[GN2]O-SPRING

6J

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

Copyright 2011 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

[GN2]E-LUG

R114
D101
30V

R104
220K

ZD100
SD05

R107
75

ZD101
SD05

R108
75

ZD102
SD05
ZD103
SD05

R109
75

10K

COMP2_L
R118
12K

COMP2_PR

COMP2_PB

COMP2_Y

LK310
INPUT1

2010/11/22
1

LGE Internal Use Only

EAX64045802
LP91J

PC

RS-232C

JK202

JK200
SPG09-DB-009

SPG09-DB-010
6630TGA004Q

+3.5V_MST

6
6

IC200
ST3232CDR

C203
0.1uF
16V
C1+

16

VCC

V+

C1-

C2+

15

14

R202

13

C2-

V-

T2OUT

C202
0.1uF
16V

R2IN

12

11

10

11
RED

GND

T1OUT

DDC_DATA

12
8

R203

IR_OUT
T1IN

BLUE

+3.5V_MST

R204
4.7K

R205
4.7K

10

10

RXD
TXD

R208
ZD201
SD05

GND_1

R215
4.7K

68

C211
68pF
50V

PC_VS

SYNC_GND

DDC_CLOCK

15

DSUB_SCL
D209
30V

DDC_GND

16

PC_HS

R213
75

V_SYNC

14

C213
68pF
50V

R214
4.7K

ZD200
SD05

PC_B

D210
30V

NC

R2OUT

R207
68

H_SYNC

13

T2IN

D204
30V

PC_G

R212
75

D208
30V

BLUE_GND

D201
30V

R1OUT

DSUB_SDA

GREEN

R1IN

PC_R

R211
75

D207
30V

GREEN_GND

D200
30V

100

C201
0.1uF
16V

GND_2

1
2

100
C200
0.1uF
16V

RED_GND

SHILED

R200
0

SIDE AVSIDE_AV

JK201
PPJ235-01

+5V_MULTI

PC EDID

[RD]E-LUG

5C

[RD]O-SPRING

4C

SIDE_AV
R225
D205
30V
SIDE_AV

SIDE_RIN

10K

READY

A0

R228
12K
SIDE_AV

R222
220K

A0

A1

SIDE_AV
R224
D206
30V
SIDE_AV

10K

READY

VSS

SIDE_LIN

R226
12K
SIDE_AV

R223
220K

[YL]CONTACT

3A

SIDE_AV

4A

[YL]O-SPRING

5A

[YL]E-LUG

ZD202
5.6B
ZD203
5.6B
SIDE_AV

R219
4.7K

VCC

R220
4.7K

R221
4.7K

C205
0.01uF

WP

R216
100

SCL

R217
100

SDA

R218
100

DDC_WP
DSUB_SCL
DSUB_SDA

WP

SCL
VSS

[WH]O-SPRING

4B

READY

A2
A2

ENKMC2838-T112
D211 A1
C
A2

VCC
A1

[RD]CONTACT

3C

RGB_EEPROM_CATAL
IC201
CAT24C02WI-GT3

RGB_EEPROM_RENESAS
IC201-*1
R1EX24002ASAS0A

SDA

SIDE_V
R227
75
SIDE_AV

PC SOUND
JK203
PEJ027-01
3
6A

**

7A
C214
100uF
16V

0
REAR_USB
JK205
KJA-UB-0-0037

OCP_READY

D213

AC

IC202
AP2191SG-13

USB_DN

USB_DL_N

USB_DP

USB_DL_P

R_SPRING

T_SPRING

PC_AUD_L
R234
10K

7B

B_TERMINAL2

6B

T_TERMINAL2

L200

IN_1

D203
30V
CDS3C30GTH

R232
220K

R236
12K

120OHM

OCP_READY

IN_2

R209
1K

FLG
5

Copyright 2011 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

+3.5V_MULTI
OUT_1

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

R238
510

GND
OCP_READY

OCP_READY

READY
ZD205
30V

R235
12K

OCP_READY

OUT_2

READY
ZD204
30V

R231
220K

R237

500

NC

R230
0
REAR_USB

USB DOWN STREAM

USB_DL_P

B_TERMINAL1

D202
30V
CDS3C30GTH

Non_OCP

L201
C212
220uF
16V

SIDE_USB
KJA-UB-4-0004
JK204

USB_DL_N

R233
10K

+5V_USB

Close to SIDE_USB

C210
10uF
6.3V

REAR_USB
R229
0

PC_AUD_R

T_TERMINAL1

1A Design

Its possibel to 27~47ohm

USB

E_SPRING

OCP_READY

OCP_READY

OCP_READY

R210
4.7K

C208
0.1uF
50V

C209
10uF
16V

EN

LK310
INPUT2

2010/11/22

LGE Internal Use Only

EAX64045802
LP91J

OPTION
HDMI2_EEPROM_RENESAS
IC301-*1
R1EX24002ASAS0A

A2

VCC

WP

A0

SCL

A1

+5V_MULTI
VSS

SDA

+5V_HDMI_2

A2

VSS

+5V_HDMI_2

HPD_MST_2

A0

A1

A2

SHIELD
20

VSS

HPD

VCC

WP

R327

100

SCL

R304

100

SDA

R305

100

R309 R311
10K 10K

R302
1K

C301
0.01uF

R300
10K

DDC_WP

VSS

19

DDC_SDA2
DDC_SCL2

JP300

TMDS2_RX0+
TMDS2_RX1-

6 DATA15 DATA1_SHIELD
4 DATA1+

TMDS2_RX1+
TMDS2_RX2-

3 DATA22 DATA2_SHIELD
1 DATA2+

HPD

TMDS2_RX2+

YKF45-7058V
JK302

A2

VSS

R314

R312

RT1C3904-T112
2SC3875S

VCC

WP

R331

100

SCL

R306

100

SDA

R307

100

R308 R310
10K 10K

C302
0.01uF

DDC_WP

JP302

DDC_SDA1
DDC_SCL1

JP303

CEC
TMDS1_RXCTMDS1_RXC+
TMDS1_RX0TMDS1_RX0+
TMDS1_RX1TMDS1_RX1+
TMDS1_RX2TMDS1_RX2+

WP

+5V_MULTI
SCL

+5V_HDMI_3
SDA

D302
KDS184S
C

HDMI3_EEPROM_CATAL
IC302
CAT24C02WI-GT3

1K

D300
KDS184S

VCC

A2

+5V_HDMI_3

+5V_HDMI_1

A1

A1

JK301
YKF45-7058V

HDMI3_EEPROM_RENESAS
IC302-*1
R1EX24002ASAS0A

16 SDA

3 DATA2DATA2_SHIELD
2
DATA2+
1

A0

SDA

17 DDC/CEC_GND

11 CLK_SHIELD
CLK+
10
DATA09
DATA0_SHIELD
8
DATA0+
7
DATA16
DATA1_SHIELD
5
DATA1+
4

8 DATA0_SHIELD
7 DATA0+

+5V_MULTI

SCL

18 +5V_POWER

13 CEC
12 CLK-

TMDS2_RXC+
TMDS2_RX0-

9 DATA0-

15 SCL
14 NC

CEC
TMDS2_RXC-

10 CLK+

A0

A2

SHIELD

11 CLK_SHIELD

HPD_MST_3

2SC3875S

A1

JP301

12 CLK-

HDMI1_EEPROM_CATAL
IC300
CAT24C02WI-GT3

Q300C

20

14 NC
CEC
13

WP

RT1C3904-T112

18 +5V_POWER
17 DDC/CEC_GND
16 SDA
15 SCL

+5V_HDMI_1

HPD_MST_1
E

19

D301
KDS184S

HDMI2_EEPROM_CATAL
IC301
CAT24C02WI-GT3

1K

R301
10K

VCC

A2

R303

A1

A2

2SC3875S
Q301
RT1C3904-T112

MST_HPD : USE MST HPD

A1

A1

A0

SW_HPD : USE SW HPD (Default)


HDMI1_EEPROM_RENESAS
IC300-*1
R1EX24002ASAS0A

Q302

10K
E

A0

A1

VCC
R319
10K

WP

R329

100

SCL

R317

100

SDA

R318

100

JACK_GND
A2
20

VSS
19

HPD

18

+5V_POWER

17

DDC/CEC_GND

16

SDA

15

SCL

14

NC

13

CEC

12

CLK-

11

CLK_SHIELD

10

CLK+

9 DATA08 DATA0_SHIELD
7 DATA0+
6 DATA15 DATA1_SHIELD
4 DATA1+
3 DATA22 DATA2_SHIELD
1 DATA2+

R320
10K

C300
0.01uF
25V

DDC_WP
+3.3V_MST

R315
68K
READY

JP304

DDC_SDA3
DDC_SCL3

JP305

CEC
TMDS3_RXCTMDS3_RXC+
TMDS3_RX0TMDS3_RX0+
TMDS3_RX1-

Q303
BSS83
READY
G

D
B
S

D303
MMBD301LT1G
30V
READY

R316
56K
READY

CEC_C

R313
0

CEC
D304
CDS3C30GTH
30V READY

TMDS3_RX1+
TMDS3_RX2TMDS3_RX2+

KJA-ET-0-0032
JK303

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

Copyright 2011 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LK310
HDMI

2010/11/22
3

LGE Internal Use Only

EAX64045802
LP91J

PANEL WAFER
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,

+5V_+12V_LCD

51P_FFC_WAFER_FHD
P401
TF05-51S

P402
FF10001-30

P403
FF10001-30

SMALL_NC5
SMALL_NC1
SMALL_NC2
SMALL_OPC_OUT

26_32INCH_HD_WAFER
1

+5V_+12V_LCD

HD_normal

R425 0

19_22INCH

HD_NOT AUO_IPS

R414
0

5
NON_Small CMO
TXCE3-

TXCE3+

R432
0

8
9

R435

10

R436

NON CMO 42FHD

IR
FHD BRIDING
L400
500-ohm
FHD BRIDING
ZD400
5.6B

NON CMO 42FHD

TXCE0+

AUO/SHARP 42FHD

TXCE0-

AUO/SHARP 42FHD

TXCE1+

11

R426

12

R427

0
0

13

SUB_SCL

14

FHD BRIDING
L401
500-ohm

+3.3V_MST

SUB_SDA

FHD BRIDING
ZD401
5.6B

R406
4.7K

R409
4.7K

NON_19_22INCH
L405
120ohm
NON_19_22INCH

NON_19_22INCH

C403
470pF
50V

C400
470pF
50V

26_32INCH

26_32INCH

C407
0.1uF

C408
0.1uF

TXCE2-

TXCLKE+

19

TXCLKE-

20

TXCE3+

21

26

R437

27

R428

28

R429

NON CMO 42FHD

120-ohm

C404
47uF
16V

SDA

TXCO0+

AUO/SHARP 42FHD
AUO/SHARP 42FHD

+3.3V_MULTI_MST
3

R400
10K

KEY1

READY
R404
0

KEY2
C405
100pF
50V

5V_ST

120ohm
C

LED_B/LG_LOGO

10

11

12

GND

ZD402
5.6B

READY
C402
47pF
50V

120ohm

IR

READY
C406
0.1uF
50V
IR-OUT
R412
10K

LED_R/BUZZ

IR-OUT
R407
10K

C
B

13

10K

IR-OUT
R401
.

47K

R420
4.7K

R419

TXCE2+

20

26inch AUO : OPEN


26inch SHARP : Pull down

VESA

21
TXCE1-

22

R415

JEIDA

23

R421
0

24

+5V_+12V_LCD

TXCE1+

TXCE0-

25

25

26

26

27

27

28

28

29

29

SMALL_NC3

30

30

SMALL_NC4

TXCE0+

SMALL_OPC_EN

31

31

SMALL_OPC_EN
SMALL_NC3
SMALL_NC4

+3.3V_MULTI_MST

R438

OPC_ENABLE

R422
470

42
OPC_ENABLE

R417

43

R416

44

IR_OUT

OPC_OUT

E-DIM

READY

C
E

R423
0

R424

OPC_EABLE

OPC_EN

1K

External VBR

45

IR-OUT
2SC3052
Q403

OPC_ENABLE
RT1C3904-T112
Q404 OPC_ENABLE

OPC_OUTPUT

OPC_ENABLE

22

IR-OUT
R410

R418

TXCE2-

19

+3.3V_MULTI_MST

NON CMO 42FHD

IR-OUT
R413

TXCLKE+

18

TXCO4-

41

+3.5V_MST

TXCE0+

TXCO4+

40

+3.5V_MST

ST_3.3V

19

TXCO3-

39
9

TXCE0-

TXCO3+

38

L403

18

TXCLKO-

36

IR

TXCLKE-

17

TXCLKO+

35

GND

37
8

16

34

SUB_SCL

10K

TXCE1+

TXCO2-

33

R405

16

TXCO2+

32

B
Q400
2SC3052

15

24

31

L407
5

TXCE1-

LVDS_SEL

TXCO1-

30

TXCE3+

14

15

HD_normal

TXCO1+

29

GND

TXCE3-

13

TXCE2+

23

TXCO0-

SMALL_OPC_OUT

12

TXCE2-

22

READY
R433
4.7K
NON CMO FHD
R434
0

25

FHD

L406

SCL

SMALL_NC2

11

21

+3.3V_MULTI_MST

TXCE4-

24

+3.5V_MST

10

OPC_ENABLE

TXCE4+

23

12507WR-12L

TXCLKE+

20

TXCE3-

22
P400

10

17

18

KEY2

SMALL_NC1

14

17

KEY1

13

TXCE2+

16

NON_19_22INCH
L404
120ohm

TXCLKE-

12

15

SMALL_NC5

11

TXCE1-

46

C IR-OUT
2SC3052
E Q401

R431

47

+3.3V_MULTI_MST

**OPC_ENABLE : USE LGD Module

+3.3V_MULTI_MST

SHARP 42FHD

48

SHARP 42FHD
R442
4.7K

49

READY

R439

50

R444

51

AUO FHD
R443
0

NON AUO 42FHD

READY
R440
4.7K
READY
R441
0

52

+3.5V_MST
+3.5V_MST

R403
10K
L402
C401
100pF
50V

R411
4.7K

120ohm
C

R408
B

Q402
2SC3052

10K

R434
R443 R421
R423
R444 R431 R442 R420 R416 R417 R418 R438 R429 R428 R437 R433 R427 R426 R436 R435

LED_R

51 47 46 45 44
READY
R402
0

CONTROL KEY
19_22INCH
P404
12507WR-03L
19_22INCH
L408

KEY1

L409

KEY2

KEY1

KEY2
19_22INCH

19_22INCH
C409
100pF
50V

19_22INCH
C410
100pF
50V

GND

43 42 41 28 27 26 25 12 11 10

SHARP 32INCH FHD

X
VESA

R434

IPS 32INCH FHD

X
VESA

R434

SHARP 32INCH FHD

3
4

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

Copyright 2011 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LK310
LVDS,CTR KEY

2010/11/22
4

LGE Internal Use Only

EAX64045802
LP91J

PAL_TUNER

TU500
TAFJ-Z001D

NC_1

NC_2

+B[5V]

Near the pin


READY

C501
0.01uF
50V

RF_AGC

MOPLL_AS

SCL

C508
10uF
16V

C505
100uF
16V

+5V_TUNER

READY

C506
100uF
16V

R500
0

TU500-*1
READY
L500

TAFJ-H001F

120-ohm

R504
47

C502
27pF
50V

7
8

SDA

R505
C500
27pF
50V

47

M_SCL

1
2

M_SDA

NC_3

+5V_TUNER

SIF

10

NC_4

R501
0

MAIN_SIF
C503
0.1uF
50V

R506
220

R507
220

11
12

VIDEO
GND

5
6
READY
C504
50V

TV_MAIN
7

READY
L502
10uH
READY
C507
82pF
50V

R502
4.7K

ISA1530AC1
Q502

B
C

9
10

13

11
12

SHIELD

NC_1
NC_2
+B[5V]
RF_AGC
MOPLL_AS
SCL
SDA
NC_3
SIF
NC_4
VIDEO
GND

13
SHIELD

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

Copyright 2011 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LK310
TUNER

2010/11/22
5

LGE Internal Use Only

EAX64045802
LP91J

+1.8V

L606

+16V_NTP

120-ohm

MLB-201209-0120P-N2
+1.8V_AVDD
0LCML00003B

C615
0.1uF
50V

C642
10uF
35V

L605

C617
0.1uF
50V

C612
68uF
35V

R604
3.3

C640
68uF
35V

P600
SMAW250-H04R

120-ohm

C613
0.01uF
50V

+1.8V_DVDD
MLB-201209-0120P-N2
0LCML00003B

L608
MLB-201209-0120P-N2

R608
12

R611
12

C619
390pF

1S

C621
390pF
R610
12
+3.3V_MST
C611

EAP61008401

C669
0.1uF

R625
3.3
R623
4.7K

C671
0.01uF

SPK_R+

SPK_L-

SPK_L+

L609

SPK_L-

VDR1B

BST1B

PGND1B_1

C632
0.47uF

43

44

45

OUT1B_1

OUT1B_2

PVDD1B_1

PGND1B_2
46

47

48

50

49

PVDD1A_1

PVDD1A_2

OUT1A_1

PVDD1B_2

51

52

53

OUT1A_2
54

PGND1A_1

PGND1A_2
56

Q603
E RT1C3904-T112

55

[EP]GND

C
10KB

R626
3.3

SPK_R-

C618
1uF

R630
10K

R629

R638
12

1F

SPK_L+

C672
0.01uF

R663
4.7K

MLB-201209-0120P-N2

C616
22000pF

22000pF

C637
0.1uF

L603
2S AD-9060 2F

READY

SW_RESET
MULTI_PW_SW

R624
0
R631
47K
READY
R627

BST1A

VDR1A

RESET

42

NC

41

VDR2A

40

BST2A

AUDIO_OUT_OP AMP_BCD
IC601-*1
AS324MTR-E1

READY

C608
1uF

R601 100

C606
1000pF

I2S_MCLK

+3.3V_MULTI_MST

+1.8V_AVDD
C603
1000pF
C601
100pF

C605
0.1uF

+1.8V_AVDD
C600
10uF
16V

C602
0.1uF

OUT1

AD

39

PGND2A_2

DVSS_1

38

PGND2A_1

VSS_IO

37

OUT2A_2

CLK_I

36

OUT2A_1

VDD_IO

35

PVDD2A_2

DGND_PLL

34

PVDD2B_2

32

PVDD2B_1

12

31

OUT2B_2

13

30

OUT2B_1

14

29

PGND2B_2

11

AVDD_PLL
DVDD_PLL

Main AMP

C624
1uF
IN1-

C625
22000pF

IN1+
L610
MLB-201209-0120P-N2
VCC

SPK_R+
R658 R653
12
12
C630
L607
390pF
2S AD-9060 2F

+16V_NTP

PVDD2A_1

33

10

LF

TEST0/GND

IC600
NTP-3200L

AGND_PLL
R600
3.3K

THERMAL
57

C634
390pF
C626
0.1uF

C629
0.1uF

1S

1F

C644
0.1uF

R628
4.7K

R654
12

IN2+

R671
3.3

C673
0.47uF

IN2-

OUT2

EAP61008401
R621
12

C648
0.01uF

C643
0.1uF

R667
4.7K

R635
3.3
C647
0.01uF

14

13

12

11

10

OUT4

IN4-

IN4+

GND

IN3+

IN3-

OUT3

L611

MLB-201209-0120P-N2

SPK_R-

+1.8V_DVDD
C609
10uF 16V

C614
1uF

C610
0.1uF

28

AMP :GAIN X 4

PGND2B_1

26

27
BST2B

VDR2B

25
FAULT

24
MONITOR_2

23
MONITOR_1

21

22
MONITOR_0

SCL

20
SDA

18

17

19
BCK

WCK

SDATA

DVSS_2

15

C607
0.1uF
50V

DVDD

C604
10uF
16V

16

+1.8V_DVDD

C623 22000pF
C620
0.1uF
16V

Q601

100

R602 R603
100 100

MULTI_PW_SW

C622
6800pF
50V

MNT_LOUT
R605
4.7K

1 OUT1

R606
1K

RT1C3904-T112

R678

100
R677

R676

100

R673 0
C651
1000pF
50V

AUDIO_OUT_OP AMP_AUK
IC601

+12V_AUDIO

S324

OUT4 14

R607
10K
C627

33pF
50V

2 INPUT1-

INPUT4- 13

3 INPUT1+

INPUT4+ 12

R609
6.8K
R612
5.6K

I2S_SDO
I2S_WS
I2S_SCK
M_SDA
M_SCL

MNT_L_AMP

+12V_AUDIO

4 VCC

GND 11

C628
0.01uF
50V

C638
33pF
50V
READY

C639
33pF
50V
READY

R613
5.6K

MNT_R_AMP

C635
+12V_AUDIO

5 INPUT2+

INPUT3+ 10

6 INPUT2-

INPUT3- 9

33pF
50V

R614
10K
R615
6.8K

C631
0.1uF
16V

Q602
C
E

RT1C3904-T112

7 OUT2

R617
1K

OUT3 8

MNT_ROUT
R616
4.7K

C633
6800pF
50V

AUDIO_OUT OPTION BLOCK


THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

Copyright 2011 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LK310
AUDIO

2010/11/22
6

LGE Internal Use Only

+3.3V_MULTI_MST

MNT_VOUT_T
C868
C869

0.1uF
0.1uF

SIDE_LIN
SIDE_RIN

C856
C861

2.2uF
2.2uF

MNT_L_AMP
MNT_R_AMP

R882
R881
R846
R847

100
100
100
100

R875
R876

MAIN_SIF

B
E

POWER_DET

R885
+3.5V_MST

R855
10K

MULTI_PW_SW

DDR2_CASZ
DDR2_RASZ
DDR2_ODT

DDR2_BA0

DDR2_BA1
DDR2_WEZ

DDR2_CKE

R867 1K

DDR2_A[11]
DDR2_A[8]

DDR2_A[3]
DDR2_A[7]
DDR2_A[12]
DDR2_A[9]
DDR2_A[5]
DDR2_A[10]
DDR2_A[1]

DDR2_A[6]
DDR2_A[4]
DDR2_A[2]
DDR2_A[0]

0.1uF

1K

0.1uF
C863

C844

AR800
56

AR815
56

AR814
56

AR813
56

56

AR812
56

R868

+3.3V_MULTI_MST

0.1uF

100

C883

R829

100 R8022
100 R8021

0
0 READY
READY

Copyright 2011 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

GND_15

A_MADR[6]

A_MADR[8]

A_MADR[11]

A_WEZ

A_BADR[1]

A_BADR[0]

A_MADR[1]

A_MADR[10]

AVDD_DDR_6

A_MADR[5]

A_MADR[9]

A_MADR[12]

A_MADR[7]

A_MADR[3]

A_MCLKE

VDDC_6

I2S_IN_WS/GPIO67

I2S_IN_BCK/GPIO68

I2S_IN_SD

I2S_OUT_MCK

I2S_OUT_WS

VDDP_5

GND_16

VDDC_7

I2S_OUT_BCK

I2S_OUT_SD

SPDIFO

UART2_RX/I2CM_SDA

UART2_TX/I2CM_SCK

UART1_RX/GPIO86

UART1_TX/GPIO87

GND_17

GND_18

USB0_DM

USB0_DP

SAR0

SAR1

SAR2

SAR3

AVDD_MPLL

XOUT

XIN

GPIO134

GPIO135

GPIO138

GPIO139

GPIO140

IRIN

HSYNC0

VSYNC0

HSYNC1

VSYNC1

CEC

A_MADR[4]
201

202

205

206

207

208

209

210

211

212

213

214

215

216

217

218

219

220

221

222

223

224

225

226

227

228

229

230

231

232

233

234

235

236

237

238

239

240

241

242

243

244

245

246

247

248

249

B_MDATA[7]

186

AVDD_DDR_5

185

B_MDATA[13]

184

B_MDATA[10]

183

GND_13

182

B_MDATA[8]

181

B_MDATA[15]

13

180

AVDD_DDR_4

14

179

B_DDR2_DQSB[1]

15

178

B_DDR2_DQS[1]

16

177

GND_12

17

176

VDDP_4

GND_1

18

175

AVDD_DDR_3

RXA2N

19

RXA0N
RXA0P
RXA1N
RXA1P

174

B_DDR2_DQSB[0]

20

173

B_DDR2_DQS[0]

21

172

GND_11

22

171

B_DDR2_DQM[0]

23

170

B_DDR2_DQM[1]

24

169

AVDD_DDR_2

25

168

B_MDATA[14]

BIN1P

26

167

B_MDATA[9]

27

166

GND_10

RXA2P
REXT
REFP
REFM

28

165

B_MDATA[12]

29

164

B_MDATA[11]

30

163

AVDD_DDR_1

31

162

B_MDATA[6]

32

161

B_MDATA[1]

GIN0P

33

160

GND_9

SOGIN0

34

159

B_MDATA[3]

GIN1P
RIN1P
BINM
BIN0P
GINM

35

158

B_MDATA[4]

36

157

VDDC_5

37

156

VDDP_3

38

155

GPIO58

39

154

GPIO57

GIN2P

40

153

GPIO56

SOGIN2

41

152

GPIO55

RINM
RIN0P
AVDD_33_3
GND_2
BIN2P

42

151

GPIO54

43

150

GPIO53

44

149

GPIO52

45

148

GPIO51

46

147

GND_8

CVBS2

47

146

GPIO152/I2C_OUT_SD3

CVBS1

48

145

GPIO151/I2C_OUT_SD2

RIN2P
CVBS6
CVBS5
CVBS4
CVBS3

49

144

GPIO150/I2C_OUT_MUTE

50

143

VDDC_4

51

142

GND_7

52

141

AVDD_LPLL

53

140

LVB0M

54

139

LVB0P

SIF0P

55

138

LVB1M

SIF0M

56

137

LVB1P

VCOM1
CVBS0
VCOM0
AVDD_33_4
CVBSOUT
GND_3

111

112

113

114

115

116

110
SDO

SCZ

PWM0

PWM1

PWM2

PWM3

LVA4P

102

103

104

105

106

107

109

108
SCK

SDI

RXC2N

RXC2P

AVDD_DM

USB1_DM

USB1_DP

HOTPLUGC

95

96

98

99

97
RXC0N

RXC0P

GND_6

RXC1N

RXC1P

RXCCKP

DDCDC_DA

GPIO20

VDDP_1

VDDC_3

RXCCKN

UART2_RX

UART2_TX

DDCDC_CK

100

LVB4P

101

129
88

64
89

LVB4M

AUOUTR1

90

LVB3P

130
91

LVB3M

131

92

LVBCKP

132

93

LVBCKM

133

94

LVB2P

134

80

LVB2M

135

AUL5
AUR5
AUVRM

81

136

62
63

VDDC_1

82

57
58
59
60
61

AUOUTR2
AUOUTL1

AUOUTL2

MSTAR

250

B_MDATA[0]

187

8
9
10
11
12

RXB2N
RXB2P

SOGIN1

VCLAMP

LK310

251

HWRESET

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

252

B_MDATA[2]

188

RXACKN
RXACKP

HOTPLUGA

[MODE SELECTION]

253

B_MDATA[5]

189

RXB1N
RXB1P

READY
R808
4.7K

254

B_MCLK

190

6
7

RXB0N

3 OUT

255

B_MCLKZ

191

4
5

RXBCKN
RXBCKP

AVDD_33_2

READY
R807
0

256

192

2
3

RXB0P
HOTPLUGB

AVDD_33_1

83

R884
1K
READY

84

R889
1K

Only Divx
IC800-*1

85

R883
1K

86

R811
1K
READY

87

READY
2
GND

+3.3V_MULTI_MST

73

VCC 1
READY
C841
0.22uF
16V

READY
C839
2.2uF 10V
IC804
KIA7427F

SYS_RESET
C814
0.1uF
50V

R864

74

RESET

R887
33K

R863

4.7K

75

100

D803
KDS181

4.7K

M_SDA
M_SCL

R888

10uF 16V
0.1uF
1000pF
4.7uF

C812
4.7uF 10V

C809
C813
C818
C820

+3.5V_MST

Close to IC
with width trace

R852

I2S_WS
I2S_MCLK
PANEL_STATUS

TXD
RXD
EEP_SCL
EEP_SDA
RL_ON
I2S_SDO
I2S_SCK

KEY2
KEY1

C817 20pF

C816 20pF

LED_R
TXD

HDMI_3

+3.3V_MST

JTP-1127WEM

76

+1.2V_VDDC_MST

SW800

77

READY
C8000
2.2uF
16V

RT1C3904-T112
Q803

78

1 3

79

1K

66

C
R853

TXCE3TXCE3+
TXCLKETXCLKE+
TXCE2TXCE2+
TXCE1TXCE1+
TXCE0TXCE0+

67

D802
KDS181

C870
47uF
25V

TXCE4TXCE4+

68

150

0
R8036
20K

0.1uF

69

1K

C842

70

R860

TXCO0+

2.2uF
2.2uF

KDS181
D801

0
R8001

R8000
10K

P_24V_SMALL_15V

P_12V_SMALL_15V

C
B

1K

0.01uF

TXCO0-

71

R861
READY
R800

C855

AUDIO_OUT OPTION BLOCK

TXCO1+

203

2K

22K

TXCO1-

204

R886
ISA1530AC1
Q800

R8009

TXCO2+

72

Q804
RT1C3904-T112

TXCO2-

65

C871
4.7uF
10V

26_32INCH

22K
0.01uF

TXCO3+
TXCLKO+

C823
C824

READY

R8008
C854

TXCO3TXCLKO-

AUL4

33K

TXCO4+

AUR4

R8007

TXCO4-

AUR0

R8037

0.01uF

AUL1

26_32INCH

C850

CVBS_LIN
CVBS_RIN

RL_ON

26_32INCH

47
47

R893 4.7K
OPC_EN

GND_14

0.047uF
0.047uF
0.047uF

AVDD_MEMPLL

1uF

C834
C836
C837

MVREF

C810

47
47
47

A_ODT

TV_MAIN

R831
R857
R830

1K AUDIO_OUT

A_RASZ

CVBS_VIN
SIDE_V

R8038

A_CASZ

COMP2_PR

0.047uF
0.047uF
1000pF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF

117

EEP_SDA

C826
C828
C835
C830
C800
C801
C831
C832

118

22

47
47
470
47
47
47
47
47

119

R8006

R832
R834
R835
R837
R804
R815
R897
R802

120

SDA

0.1uF

COMP2_PB
COMP2_Y

LVA4M

EEP_SCL

LVA3P

22

AUR1

R8005

AUL2

C838
SCL

READY
R809 4.7K
+3.3V_MST
R810 1K AUDIO_OUT
MUTE_LINE R865 4.7K
SUB_SCL
R866 4.7K +3.3V_MULTI_MST
SUB_SDA
R845 4.7K
OLP
READY
PANEL_ON R819
3.3K
DISP_EN/VAVS_ON
SW_RESET
DDC_WP

AUR2

0.1uF

AUL3

C848

A_MADR[0]

0.047uF

A_MADR[2]

C829

193

47

194

R836

WP

AUR3

AUL0

VSS

VCC

AUCOM

A2

DDR2_D[6]
DDR2_D[1]
DDR2_D[3]
DDR2_D[4]

GND_4

A1

AR810
56

195

0.047uF

196

C827

197

47

124

R833

AUVRP

A0

R817
4.7K

AUVAG

R8004
4.7K

DDR2_D[14]
DDR2_D[9]
DDR2_D[12]
DDR2_D[11]

125

PC_R

IC803
CAT24WC08W-T

AR809
56

126

+3.3V_MULTI_MST

LGE4765A (Matrix basic_NON_SRS)

DDR2_DQM0
DDR2_DQM1

127

PC_B
PC_G

DDR2_DQS0M
DDR2_DQS0P

128

390
0.1uF
0.1uF
0.1uF
0.047uF
1000pF
0.047uF
0.047uF
0.047uF

0.1uF

LVA1P

R814
R803
R816
R818
R838

R840
C804
C805
C806
47 C843
470 C846
47 C845
47 C847
47 C825

0.1uF

IC800

C849

LVA1M

10
10

C804/C805/C806:Close to IC
as close as possible

HDCP EEPROM

POWER_SW
R891
R892

LVA0P

C819

TMDS1_RX2TMDS1_RX2+
HPD_MST_1

DDR2_DQS1M
DDR2_DQS1P

LVA0M

EEP_SDA

10
10

DDR2_D[13]
DDR2_D[10]
DDR2_D[8]
DDR2_D[15]

LVA3M

22

R880
R890

AR806
56

GND_5

R813

EEP_SCL

C865
0.01uF

0.1uF

VDDC_2

SDA

22

TMDS1_RX1TMDS1_RX1+

C853

DDCA_CK

R812

C862
0.01uF

VDDP_2

0.1uF

C860
0.01uF

DDR2_D[0-15]

DDR2_MCLKZ
DDR2_MCLK
DDR2_D[5]
DDR2_D[2]
DDR2_D[0]
DDR2_D[7]

DDCA_DA

SCL

R8028
4.7K

C858
0.01uF

AR805
56

AVDD_AU

R8027
4.7K

33
33

DDCDA_CK

C803
0.01uF

WP

R843
R844

DDCDA_DA

10
10
10
10
10
10

192
191
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129

DDCDB_CK

GND

VCC

TMDS2_RX2TMDS2_RX2+
TMDS1_RXCTMDS1_RXC+
TMDS1_RX0TMDS1_RX0+

R869
R871
R872
R873
R874
R879

B_MCLKZ
B_MCLK
B_MDATA[5]
B_MDATA[2]
B_MDATA[0]
B_MDATA[7]
AVDD_DDR_5
B_MDATA[13]
B_MDATA[10]
GND_13
B_MDATA[8]
B_MDATA[15]
AVDD_DDR_4
B_DDR2_DQSB[1]
B_DDR2_DQS[1]
GND_12
VDDP_4
AVDD_DDR_3
B_DDR2_DQSB[0]
B_DDR2_DQS[0]
GND_11
B_DDR2_DQM[0]
B_DDR2_DQM[1]
AVDD_DDR_2
B_MDATA[14]
B_MDATA[9]
GND_10
B_MDATA[12]
B_MDATA[11]
AVDD_DDR_1
B_MDATA[6]
B_MDATA[1]
GND_9
B_MDATA[3]
B_MDATA[4]
VDDC_5
VDDP_3
GPIO58
GPIO57
GPIO56
GPIO55
GPIO54
GPIO53
GPIO52
GPIO51
GND_8
GPIO152/I2C_OUT_SD3
GPIO151/I2C_OUT_SD2
GPIO150/I2C_OUT_MUTE
VDDC_4
GND_7
AVDD_LPLL
LVB0M
LVB0P
LVB1M
LVB1P
LVB2M
LVB2P
LVBCKM
LVBCKP
LVB3M
LVB3P
LVB4M
LVB4P

DDCDB_DA

A2

C879
0.01uF

USB

A1

HDMI_1

A0

10
10

RXBCKN
RXBCKP
RXB0N
RXB0P
HOTPLUGB
RXB1N
RXB1P
AVDD_33_1
RXB2N
RXB2P
RXACKN
RXACKP
RXA0N
RXA0P
AVDD_33_2
RXA1N
RXA1P
GND_1
RXA2N
RXA2P
HOTPLUGA
REXT
VCLAMP
REFP
REFM
BIN1P
SOGIN1
GIN1P
RIN1P
BINM
BIN0P
GINM
GIN0P
SOGIN0
RINM
RIN0P
AVDD_33_3
GND_2
BIN2P
GIN2P
SOGIN2
RIN2P
CVBS6
CVBS5
CVBS4
CVBS3
CVBS2
CVBS1
VCOM1
CVBS0
VCOM0
AVDD_33_4
CVBSOUT
GND_3
SIF0P
SIF0M
VDDC_1
AUL5
AUR5
AUVRM
AUOUTL2
AUOUTR2
AUOUTL1
AUOUTR1

198

C815

+3.3V_MULTI_MST

R859
R862

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64

199

0.1uF

10
10
10
10

200

C833

R851
R854
R856
R858

121

C867
0.1uF

TMDS2_RXCTMDS2_RXC+
TMDS2_RX0TMDS2_RX0+
HPD_MST_2
TMDS2_RX1TMDS2_RX1+

122

C866
10uF

120-ohm

C878
0.01uF

+1.2V_VDDC_MST

123

L800

MAIN_EEPROM_ATMEL
IC801
AT24C256C-SSHL-T

C864
0.01uF

LVA2P

+3.3V_MULTI_MST

EEPROM

L802
120-ohm

LVA2M

Small HD : 19/22/26 Inch


Non Small FHD : Normal(non 100Hz) FHD Model
LGD Joker : LF Series (10BIT FHD, LED ON/OFF)
O/S Joker : LF Series (8BIT FHD, LED ON/OFF)
Small FHD (22"): 8BIT,LED ON/OFF
26" FHD : 10BIT,LED ON/OFF

C877
0.01uF

+1.8V_DDR

LVACKP

**
**
**
**
**
**

READY

C859
0.01uF

+3.3V_MULTI_MST

LVACKM

DDC_WP

R8016
R8017

SPI_DO

8 SO/SIO1 WP#/SIO2 9

R828
C
B
E
10K
Q805 READY
RT1C3904-T112

100
100

GND 10

R824
R825

7 CS#

C857
0.01uF

+1.8V_DDR
X801
12MHz

SPI_CZ

R878
4.7K

R8010 R8011
4.7K
X
4.7K 4.7K
X
4.7K
4.7K
X
4.7K 4.7K
X
4.7K
4.7K
X
4.7K 4.7K
X
4.7K

R839
1M

NC_6 11

I2S_OUT

100
100

6 NC_5

+3.3V_MULTI_MST

R898
X
X
X
4.7K
4.7K
4.7K
4.7K
4.7K
4.7K

+1.8V_DDR

C851
0.1uF

IR
DSUB_SDA
RXD

R896
Small HD
4.7K
Small FHD (22") 4.7K
Non Small HD
4.7K
LGD Joker
4.7K
26" FHD
4.7K
O/S Joker
4.7K
Non Small FHD
X
Apollo
X
100HZ
X

R8003
10K

Closed IC

C811
0.1uF

*H/W OPTION

SPI_DI

+3.3V_MST

R850
R8012

NC_7 12

R8010-*4
4.7K R8011-*4 4.7K
26" FHD
LGD Joker
R8010-*5 4.7K R8011-*5
4.7K
26" FHD
O/S Joker

R8020
10K

0
100
100

5 NC_4

R898-*4 4.7K
26" FHD
R898-*5 4.7K
O/S Joker

+3.3V_MST

Close to IC as close as possible


+1.2V_VDDC_MST

+3.5V_MST

SYS_RESET
CEC_C
PC_VS
PC_HS

SPI_CLK

DDR2_A[0-12]

R8002
R895
R849

NC_8 13

R877
4.7K

R898-*3 4.7K
LGD Joker

R896-*5 4.7K
O/S Joker

NC_9 14

4 NC_3
+3.3V_MULTI_MST

R896-*3 4.7K
LGD Joker

4.7K

100Hz

R8011-*2 4.7K
4.7K
Apollo
Non_Small_FHD
R8010-*3 4.7K R8011-*3 4.7K
Non_Small_HD
Small_FHD

0
0

SCLK 16

SI/SIO0 15

3 NC_2

R8010-*2

R8035
R8034

2 VCC

R898-*2 4.7K
Apollo

R8011-*1

4.7K
Apollo

256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193

1 NC_1/SIO3

R896-*2 4.7K
Small_FHD

R896-*4 4.7K
26" FHD

+3.3V_MULTI_MST

C807
0.01uF

R8010-*1

HDMI_2

SERIAL FLASH 64M

R898-*1 4.7K
100Hz

HWRESET
CEC
VSYNC1
HSYNC1
VSYNC0
HSYNC0
IRIN
GPIO140
GPIO139
GPIO138
GPIO135
GPIO134
XIN
XOUT
AVDD_MPLL
SAR3
SAR2
SAR1
SAR0
USB0_DP
USB0_DM
GND_18
GND_17
UART1_TX/GPIO87
UART1_RX/GPIO86
UART2_TX/I2CM_SCK
UART2_RX/I2CM_SDA
SPDIFO
I2S_OUT_SD
I2S_OUT_BCK
VDDC_7
GND_16
VDDP_5
I2S_OUT_WS
I2S_OUT_MCK
I2S_IN_SD
I2S_IN_BCK/GPIO68
I2S_IN_WS/GPIO67
VDDC_6
A_MCLKE
A_MADR[3]
A_MADR[7]
A_MADR[12]
A_MADR[9]
A_MADR[5]
AVDD_DDR_6
A_MADR[10]
A_MADR[1]
A_BADR[0]
A_BADR[1]
A_WEZ
A_MADR[11]
A_MADR[8]
A_MADR[6]
GND_15
A_MADR[4]
A_MADR[2]
A_MADR[0]
A_CASZ
A_RASZ
A_ODT
MVREF
AVDD_MEMPLL
GND_14

IC802
MX25L6445EMI-10G

R896-*1 4.7K
Non_Small_HD

4.7K R8011
Small_FHD

AUL0
AUR0
AUL1
AUR1
AUL2
AUR2
AUL3
AUR3
AUCOM
AUL4
AUR4
GND_4
AUVRP
AUVAG
AVDD_AU
GND_5
VDDC_2
DDCA_CK
DDCA_DA
DDCDA_CK
DDCDA_DA
DDCDB_CK
DDCDB_DA
GPIO20
VDDP_1
VDDC_3
UART2_RX
UART2_TX
DDCDC_CK
RXCCKN
RXCCKP
DDCDC_DA
RXC0N
RXC0P
GND_6
RXC1N
RXC1P
AVDD_DM
RXC2N
RXC2P
HOTPLUGC
USB1_DM
USB1_DP
SCK
SDI
SDO
SCZ
PWM0
PWM1
PWM2
PWM3
LVA4P
LVA4M
LVA3P
LVA3M
LVACKP
LVACKM
LVA2P
LVA2M
LVA1P
LVA1M
LVA0P
LVA0M
VDDP_2

EAX64045802
LP91J

+3.3V_MULTI_MST

4.7K
R8010
Small_HD

R898
4.7K
Non_Small_FHD

65
66
67
68
C802
2.2uF
69
COMP2_L
C873
2.2uF
70
COMP2_R
C874
2.2uF
71
C875
2.2uF
72
C808
0.1uF
73
C821
2.2uF
74
PC_AUD_L
C822
2.2uF
75
PC_AUD_R
76
77
78
C840
0.01uF
79
L801
80
120-ohm
81
R894
0
82
DSUB_SCL
R899
0
83
DSUB_SDA
R8023
100
84
DDC_SCL1
R8024
100
85
DDC_SDA1
R8025
100
86
DDC_SCL2
R8026
100
87
DDC_SDA2
R8033
0 READY
88
POWER_DET
C882
0.1uF
89
90
R806
0
91
R870
0
92
R8039
HDMI3_SIDE
100
93
DDC_SCL3
R801
10 HDMI3_SIDE
94
TMDS3_RXCR805
10 HDMI3_SIDE
95
TMDS3_RXC+
R8040 100 HDMI3_SIDE
96
DDC_SDA3
HDMI3_SIDE
R820
10
97
TMDS3_RX0R821
10 HDMI3_SIDE
98
TMDS3_RX0+
99
R822
10 HDMI3_SIDE
100
TMDS3_RX1HDMI3_SIDE
R823
10
101
TMDS3_RX1+
C876 0.01uF
102
R841
10 HDMI3_SIDE
103
TMDS3_RX2R848
10 HDMI3_SIDE
104
TMDS3_RX2+
105
HPD_MST_3
R826
0
106
USB_DN
PART USB_DP
R827
0
107
108
SPI_CLK
AR818
109
SPI_DI
33
110
SPI_DO
111
SPI_CZ
112
113
114
I-DIM
115
E-DIM
116
117
118
119
120
121
122
123
124
125
126
127
128

R896
4.7K
Small_HD

2010/11/22
7

LGE Internal Use Only

EAX64045802
LP91J

DDR2
DDR2_D[0-15]

DDR2_D[0-15]

V_REF

1K
R908

1K
R907

+1.8V_DDR

C904
0.01uF

C905
1000pF

C918
0.1uF

C920
2.2uF
16V

V_REF
Close to DDR2 IC

IC900
K4T51163QI-HCF7

DDR2_A[0-12]
VREF

DDR2_A[0]

A0

DDR2_A[1]

J2

M8

A1

DDR2_A[2]

M3

A2

DDR2_A[3]

M7

A3

N2

DDR2_A[4]

A4

DDR2_A[5]

N8

A5

N3

DDR2_A[6]

A6

DDR2_A[7]

N7

A7

DDR2_A[8]

P2

A8

DDR2_A[9]

P8

A9

DDR2_A[10]

P3

A10/AP

DDR2_A[11]

M2

A11

P7

DDR2_A[12]

A12

DDR2_BA0

BA0

L2

BA1

L3

DDR2_BA1
R906
150

DDR2_MCLK
DDR2_MCLKZ
DDR2_CKE

READY

DDR2_ODT
DDR2_RASZ
DDR2_CASZ
DDR2_WEZ
DDR2_DQS0P
DDR2_DQS1P
DDR2_DQM0
DDR2_DQM1

DQ0

DDR2_D[0]

G2

DQ1

DDR2_D[1]

H7

DQ2

DDR2_D[2]

H3

DQ3

DDR2_D[3]

H1

DQ4

DDR2_D[4]

H9

DQ5

DDR2_D[5]

F1

DQ6

DDR2_D[6]

F9

DQ7

DDR2_D[7]

C8

DQ8

C2

DQ9

D7

DQ10

DDR2_D[10]

D3

DQ11

DDR2_D[11]

D1

DQ12

DDR2_D[12]

D9

DQ13

DDR2_D[13]

B1

DQ14

DDR2_D[14]

B9

DQ15

DDR2_D[15]

VDD_5

E1

VDD_4

CK

J8

J9

VDD_3

K8

M9

VDD_2

CKE

K2

R1

VDD_1

ODT

K9

CS

L8

A9

VDDQ_10

RAS

K7

C1

VDDQ_9

CAS

L7

C3

VDDQ_8

WE

K3

C7

VDDQ_7

C9

VDDQ_6

E9

VDDQ_5

G1

VDDQ_4

G3

VDDQ_3

G7

VDDQ_2

G9

VDDQ_1

LDQS

56

UDQS

F7
B7

R902

LDM

56

F3

UDM

B3

R904

LDQS

E8

A3

VSS_5

56

UDQS

A8

E3

VSS_4

J3

VSS_3

N1

VSS_2

P9

VSS_1

B2

VSSQ_10

B8

VSSQ_9

A7

VSSQ_8

D2

VSSQ_7

DDR2_DQS0M
DDR2_DQS1M

R903
56

R905
56

NC_4

L1

NC_5

R3

NC_6

R7

NC_1

A2

NC_2

E2

NC_3

R8

D8

+1.8V_DDR

VSSDL

VDDL
C900
0.01uF
50V

J7

J1

DDR2_D[8]
DDR2_D[9]

+1.8V_DDR
A1

CK

R900
R901
56

R2

G8

Close to DDR2 IC
+1.8V_DDR

C901
0.01uF

C902
0.01uF

C903
0.01uF

C906
0.01uF

C907
0.01uF

C908
0.01uF

C909
0.01uF

C910
0.01uF

C911
0.01uF

C912
0.01uF

C913
0.01uF

C914
0.01uF

C915
0.01uF

C916
0.01uF

C917
0.01uF

VSSQ_6

E7

VSSQ_5

F2

VSSQ_4

F8

VSSQ_3

H2

VSSQ_2

H8

VSSQ_1

C919
10uF
10V

DDR2 MEMORY

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

Copyright 2011 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LK310
DDR2

2010/11/22
8

LGE Internal Use Only

EAX64045802
LP91J

500

19_22INCH
R1010

C1046
0.01uF
50V

C1058
0.1uF
50V

C1045
10uF
16V

C1057
0.01uF
50V

C1011
0.01uF
50V

+16V_NTP

L1004

P_3.5V

26_32INCH

120-ohm

IC1001
BD9130EFJ-E2

+3.5V_MST

ADJ

2
26_32INCH
R1000
4.7K

26_32INCH
R1001
4.7K

26_32INCH
P1000
FW20020-24S

READY

R1004

RL_ON

2
10K

P_12V_SMALL_15V

C1075
47uF
25V

C1076
0.01uF
50V

2SC3875S
Q1000

Power on

24V

GND

P_24V_SMALL_15V

GND
3.5V

P_3.5V

P_12V_SMALL_15V

24V

15V

24V

GND

GND

GND

3.5V

10

3.5V

11

GND

13

GND

15V

GND

ITH

12V

17

12V

19

10

12V

21

11

GND/P-Dim2

23

12

3.5V

GND

14

GND

OUT:1.27V

L1002
2.2uH

SW

R1043
12K

GND

R1078
3.3

PGND

C1014
0.1uF
16V

READY

MAX 2A

R1045
2K

R1

R1053
3.3K

C1018
10uF
16V

C1013
10uF
16V

C1055
2200pF
50V

R2

IC1002
AP1117EG-13

P_3.5V

C1015
0.1uF
50V

INVERTER_ON

INV ON

EXCEPT_BIGCMO
R1029
100

PWM_Dim

A-Dim

R1

ADJ/GND

22

P-Dim

NC

24

Error out

2SC3052
Q1002
R1047
B
10K

R1015
0

C1054
0.1uF
50V

DISP_EN/VAVS_ON

IC1007
MP20045DQ-LF-Z

+3.5V_MULTI

EP[GND]

C1070
2.2uF
10V

VIN_2

VOUT_1

10K

C1044
2.2uF
10V

C1068
2.2uF
10V

I-DIM

R1080

1%

R1063
12K

READY
C1069
100pF
50V

VOUT_2

EN

R1066
4.7K

PG

R1073
47K

19_22INCH

READY
R1040
4.7K

NTP,AUDIO DSP

+1.8V
R1077
120

R1022
1

READY

C1073
0.1uF
50V

C1074
1uF
25V

C1051
10uF
6.3V

R1079
56

NTP,AUDIO DSP

POWER_SW

10K

FB
closed IC1007

READY
C1028
100uF
16V

R1067
100K

R1064
10K

READY

BIG_LGD/SHARP FHD
R1035

+1.8V

GND

1%

+3.3V_MULTI_MST
R1084
0

DDR2, Vref

OUT:1.85V
R1

R2

R1081

READY

BIG_AUO
R1034
0

R1072
0

ADJ/GND

READY

+3.5V_MST

BIG_LGD

C1077
10uF
6.3V

READY
R1076
0

VIN_1

R1033

R1055
56

IN 3 MAX 1A 2 OUT

19_22INCH
R1032
0

LD1002
SAM2333

C1022
10uF
6.3V

120-ohm

BIG_CMO
R1031
0

R1005
1.2K

120-ohm

C1037
1uF
25V

IC1008
AP1117EG-13

100

NON_19_22INCH

+3.5V_MULTI

+1.8V_DDR

READY

C1023
0.1uF
50V

R1016

READY
L1010

BIG_CMO
R1030

R1071

R2

L1013

R1054
120

R1046
3.3K

OPT
R1037
6.8K

A_Dim

V0 = 1.25*(1+(R2/R1))

OUT:1.85V

+3.5V_MULTI

OLP

+1.2V_VDDC_MST

C1036
1uF
25V

C1016
10uF
10V

GND

20

C1060
560pF
50V

19_22INCH
R1028
0

18

IN 3 MAX 1A 2 OUT

3.5V

16

V0 = 0.8*(1+(R2/R1))

26_32INCH

LED Block

R1044

PVCC

READY

P_24V_SMALL_15V

12

EN

READY

C1017
10uF
16V

C1059
10uF
16V

P_24V_SMALL_15V

3.5V

OLP

15

+12V_AUDIO

26_32INCH

READY

R1002
10K

+3.5V_MULTI

AUDIO_OUT

SMAW200-12

R1006
100K

+3.5V_MST

AUDIO_OUT

19_22INCH
P1001

R1003

L1012

VCC

120-ohm

0
26_32INCH

10K
AUDIO_OUT

2SC3875S
Q1005

C1043
68uF
35V

THERMAL

+3.5V_MST
3

**5V_MULTI->3.3V->1.2V

L1003

P_24V_SMALL_15V

+3.3V_MULTI_MST
READY
ZD1002
3.6V

C1062
10uF
6.3V

C1063
0.1uF
50V

R8043
470K

PANEL_STATUS

READY

R1082
0

<OS MODULE PIN MAP>


BIG_NON_AUO
R1021

PIN No

LGD

CMO(09)

AUO

SHARP

IPS

SMALL

18

INV_ON

A-DIM

INV_ON

INV_ON

INV_ON

INV_ON

20

V4:VBR-A
V5:VBR-A

0
R1017

**Switch 12V:P12V **Switch 3.5V:3.5.V_MULTI

BIG_AUO/IPS

NC

SHARP HD

Err_out Err_out

Err_out PWM_DIM

R1083
0

R1023
0

OPT
C1008
0.1uF
16V

E-DIM

NON_OPC

R1038
1K

OPT
C1012
1uF
25V

NON_OPC

R1060
6.2K

PWM_DIM PWM_DIM

24

Err_out

INV_ON

NC

PWM_DIM

NC

A-DIM

PWM_DIM

GND

PWM_DIM

NC

R1039
1K

P_12V_SMALL_15V

19_22INCH
L1005
120-ohm

OPC_OUT

HD_OPC

22

+5V_MULTI

HD_OPC

26_32INCH
L1006
120-ohm

R1075
6.2K

26_32INCH
R1065
19_22INCH
33K
R1065-*1

Close to Q1003

R1048

G2

10K

Q1001
E RT1C3904-T112

R1020
10K

*ST 3.5V->3.3V

IC1005
MP20045DQ-LF-Z

S2

S1

P_3.5V

EP[GND]

L1007

D2_2

10K

PANEL_ON

Q1003
AO4813
EBK60706901

C1056
1uF
25V

R1049
33K

READY
C1027
68uF
35V

G1

D2_1

VIN_2

VOUT_1

+3.3V_MST

READY
ZD1000
3.6V

C1053
0.01uF
50V

C1065
2.2uF
10V

C1052
10uF
16V

1%

R1041
12K

READY
C1066
100pF
50V

VOUT_2

GND

FB

R1068

POWER_SW

C1021
0.01uF
50V

R1050
2.2K

R1051
2.2K

C1009
100uF
16V

R1052
2.2K

C1010
0.01uF
50V

READY
C1061
100uF
16V

+3.5V_MULTI

READY
ZD1001
3.6V

C1048
1uF
25V

R1070
22K

PG

C1019
10uF
16V

D1_1

EN

8
9

C1067
2.2uF
10V

READY
L1011
120-ohm

THERMAL

+3.5V_MST

120-ohm

D1_2

R1061
4.7K
VIN_1

+5V_+12V_LCD

C1005
0.1uF
50V

R1069
1.6K
C
RT1C3904-T112
Q1004

10K
E

R1062
100K

1%

R8044
470K

C1033
0.1uF
16V

READY
C1038
1uF
25V

C1040
0.1uF
50V

VIN 2
C1003
0.1uF
50V AGND
3
FB 4

7 LX_1

3A

+3.5V_MULTI
R1013
10K
C1034
0.1uF
16V

6 EN
5 COMP

C1006
10uF
16V

R1014

R1
5%

R1009
1.5K

C1072
0.1uF
16V

C1007
0.1uF
50V

VIN 2
C1032
0.1uF
50V AGND
3
FB 4

R1007
51K

C1050
2200pF

C1020
10uF
16V

C1031
10uF
25V

7 LX_1

3A

5 COMP

C1064
0.1uF
16V

R1058
9.1K

C1004
100pF
50V

1
OUT 2

+5V_TUNER

+3.5V_MULTI
R1057
10K

6 EN

C1024
2200pF

1%

C1047
0.1uF
16V

R1011
24K

R1
5% R1012
51K

R2

C1039
0.1uF
50V

OPT
C1035
100pF
50V

R1018
10K
1%

C1042
100uF
16V

R1019
110

R1027
330

OUT

9.1K

5%

C1071
10uF
16V

C1030
10uF
25V

L1000
500

R1026
330

ADJ/GND

3.6uH

R1025
110

3.6uH

L1008
500

+5V_MULTI
NR8040T3R6N
L1001

8 LX_2

NR8040T3R6N
L1009

8 LX_2

PGND 1

3 IN

C1029
10uF
16V

IC1006
AOZ1073AIL

IC1003
AOZ1073AIL

PGND 1

C1002
10uF
25V

C1026
10uF
16V

P_12V_SMALL_15V

P_12V_SMALL_15V

C1001
10uF
25V

C1025
10uF
16V

ADJ/GND

V0 = 0.8*(1+(R1/R2))

OUT:6.8V

IC1004
AP1117EG-13

**DC-DC CONVERTER
*12V -> 5V_MULTI

V0 = 0.8*(1+(R1/R2))

IC1000
AP1117EG-13

**DC-DC CONVERTER
**12V->TUNER 5V

3 IN

R1042
10K

R2

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

Copyright 2011 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

R1008
10K

READY
C1049
0.1uF
16V

1%

LK310

POWER

+5V_USB
C1041
100uF
16V

2010/11/22

LGE Internal Use Only

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