ECNG 6706 Antennas and Radiation

Homework 1
Due: 29 September 2014, 5:00 PM

Instructions:
1. Suggested reading for this homework would be Chapter 3 in Q. Gu (2005) RF System Design
of Transceivers for Wireless Communications, New York, NY: Springer.
2. Do not delve too much into the details of the chapter, but rather use the HW questions to guide
our reading.
3. You can also use the Internet (e.g., Wikipedia, manufacturer sites, product datasheets, application notes,. . . ).
4. You should leverage available Internet resources to support your discussions. Be
sure to cite all such sources.
5. Homework should be written/typed and should be submitted in class.
Do the following problems:
1. Give brief definitions of the following transceiver building blocks:
a Filters
b Amplifiers
c Frequency converters
d Phase shifters
e Modulators / Demodulators
f Oscillators & Synthesizers
g ADCs / DACs
h Signal Splitters / Combiners / Attenuators / Duplexers /Diplexers / Isolators / Switches
i Power / Voltage detectors
2. Differentiate between the following transceiver building blocks:
a Filters & Amplifiers & Attenuators
b Low-noise Amplifiers (LNAs) & Power Amplifiers (PAs)
c Frequency converters & Phase shifters
1

d Modulators & Demodulators

e Oscillators & Synthesizers
f Signal splitters & Combiners
g Duplexers & Diplexers
h Isolators & Switches
3. What are the similarities and differences between the following radio architectures:
a Superheterodyne
b Homodyne
c Low IF
d Bandpass sampling
e IEEE 802.15.6 Transmitter & Receiver for Human Body Communications (not UWB or Narrowband options)
4. For each of the building block categories in Question 1), which performance parameters are typically used in each case? How about performance parameters for a composite radio architecture
(e.g., those from the previous question)? (You can search the Internet or product manufacturer
sites, to get a bit more insight into this.)
5. Consider a multiradio phone design containing the following chips:
MAX 2769 Universal GPS receiver
http://www.maximintegrated.com/en/products/comms/wireless-rf/MAX2769.html
MAX 2832 2.4GHz to 2.5GHz, IEEE 802.11g (WiFi) Transceiver
http://www.maximintegrated.com/en/products/comms/wireless-rf/MAX2832.html
LMX 5252 Bluetooth Radio
http://www.ti.com/product/lmx5252
At this stage, look ONLY at the architectures of the transceivers without delving into the details
of the products. Looking at the architectures, briefly discuss the following:
a Considering the operating frequencies for the devices, comment on any extra components that
you think would be necessary on the RF side to integrate these into the single phone solution
(Consider both multiantenna & single antenna solutions).
b Considering the chip demodulated outputs, comment on any extra components that you think
would be necessary on the baseband side for integrating these into the single phone solution
(Consider both multibaseband processor & single processor solutions).
c Comment on the tradeoffs for the two solutions in a) and the two solutions in b).

6. Using the Internet obtain specification sheets for the LMS6002D and FMCOMMS4 Transceiver
ICs. Review the functional architectures of the chips. Dont pay too much attention to the
specifications as yet. Considering Question 2, consider the two ICs as alternate solutions for
implementing multiple radios in software, as opposed to the multiple IC approach. This is a
concept known as softwaredefined radio (SDR), which allows for reconfigurability of radios via
changing the software, using the same common hardware.
a Compare and contrast the SDR approach to the multiradio IC approach in terms of relative
price, performance, size, and power consumption.
b The two chips have max frequencies of around 3.8GHz & 6GHz respectively. It is possible
to use these chips to build transceivers that operate at much higher frequencies. Propose a
solution in each case for building transceivers that work at 10.6GHz. Identify any additional
building block components that you feel would be necessary.
c Consider the maximum output power and input sensitivity of the devices. Propose solutions
to increase the output power and input sensitivity. Identify any additional building block
components that you feel would be necessary.
7. MIXIM is one of several suppliers of RF ICs and related products. Go to their website and
peruse the product line for wireless and RF solutions
http://www.maximintegrated.com/en/products/comms/wireless-rf.html.
Within the RF Transceivers, Receivers and Transmitters subgrouping you would notice several
solutions. Discuss the following:
a If there are transceivers which integrate both receivers and transmitters, then why does one
need separate transmitter and receiver ICs?
b Consider the ISM subsubgrouping (As an aside..what is the ISM band?). The solutions allow for customized solutions where you can develop your own protocols (e.g., wireless sensor
nets, medical apps, security apps, etc. . . ).
How can you use transmitters/receivers/transceivers to implement:
i simplex communications?
ii half duplex communications?
iii full duplex communications?