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fully edited. Content may change prior to final publication. Citation information: DOI
10.1109/TIA.2013.2290841, IEEE Transactions on Industry Applications
AbstractThis
works
presents
the
research,
development and design of a BMC intercell bar for copper
electrowining following heavy duty and high-reliability
guidelines. As a result, the configuration ensures a lowmaximum temperature with high-temperature rated
connectors. These properties guarantee the hardness and
integrity of the contacts and consequently its lifetime.
Some key performance indicators include: control and
balance of the cathodic current densities, short circuit
protection and bypass of weak contacts. Further, it has
the unique property of hot-swapability for replacing
impaired connectors. Thus, the Availability of the intercell
bar under typical electrowining operating conditions is
ensured.
I.
Symbol
NOMENCLATURE
Description
Unit
2
(3 )
( )
II.
INTRODUCTION
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This article has been accepted for publication in a future issue of this journal, but has not been fully edited. Content may change prior to final publication. Citation information: DOI
10.1109/TIA.2013.2290841, IEEE Transactions on Industry Applications
[2]) and Current Source (CS, Optibar intercell bar [3]) taking
the advantages from both (See Fig. 1).
III.
1
1
=
=
+
(1)
(2)
(3)
Fig.1. Electric model superimposed over physical diagram of the process: a) VS, b) CS and c) BMC.
Copyright (c) 2013 IEEE. Personal use is permitted. For any other purposes, permission must be obtained from the IEEE by emailing pubs-permissions@ieee.org.
This article has been accepted for publication in a future issue of this journal, but has not been fully edited. Content may change prior to final publication. Citation information: DOI
10.1109/TIA.2013.2290841, IEEE Transactions on Industry Applications
47
26
6
20
70
70
55
21
Physical Properties
Thermal Conductivity
(BTU/ft2-hr)
Thermal Expansion
(per F)
Density (lb per inch3)
Electrical Conductivity
(%IACS)
Modulus of Elasticity
(KSI)
226
187
0.0000098
0.0000098
0.323
0.321
100
80
17,000
17,000
32
116
85
15
Physical Properties
Thermal Conductivity
(BTU/ft2-hr)
Thermal Expansion
(per F)
Density (lb per inch3)
Electrical Conductivity
(-inch)
Modulus of Elasticity (KSI)
IV.
8.7
0.0000072
0.28
31.5
29,000
Copyright (c) 2013 IEEE. Personal use is permitted. For any other purposes, permission must be obtained from the IEEE by emailing pubs-permissions@ieee.org.
This article has been accepted for publication in a future issue of this journal, but has not been fully edited. Content may change prior to final publication. Citation information: DOI
10.1109/TIA.2013.2290841, IEEE Transactions on Industry Applications
150
CHROMIUM COPPER
140
130
ZIRCONUIM COPPER
HARDNESS HV
120
SILVER COPPER
110
100
90
80
70
60
100
200
300
400
500
600
TEMPERATURE (C)
Fig.3. Corrosion resistance of super duplex stainless steel 2507 against other
commercial standard steels [6].
Fig. 4. Pentagonal connector. (a) Upper view of two adjacent EW cells (b)
Close view of intercell connectors (c) Pentagon connector removed.
Copyright (c) 2013 IEEE. Personal use is permitted. For any other purposes, permission must be obtained from the IEEE by emailing pubs-permissions@ieee.org.
This article has been accepted for publication in a future issue of this journal, but has not been fully edited. Content may change prior to final publication. Citation information: DOI
10.1109/TIA.2013.2290841, IEEE Transactions on Industry Applications
(4)
(6)
(7)
(8)
RESULTS
(5)
Copyright (c) 2013 IEEE. Personal use is permitted. For any other purposes, permission must be obtained from the IEEE by emailing pubs-permissions@ieee.org.
This article has been accepted for publication in a future issue of this journal, but has not been fully edited. Content may change prior to final publication. Citation information: DOI
10.1109/TIA.2013.2290841, IEEE Transactions on Industry Applications
A.
VS
CS
BMC
15.2
10.1
10.5
0.42
0.13
0.10
141%
40%
54%
1970
1910
1865
330
360
400
55
55
55
75
160
77
200
85
88
C.
VS
CS
BMC
Efficiency Increment
4%
5%
Contact Rated
Temperature
160C
160C
500C
<6 KSI
<6 KSI
>55 KSI
Maintenance cost
High
High
Very low
MTBF
Low
Low
High
2,000 hrs
2,000 hrs
8hrs
Low
Low
High
2-3 years
2-3 years
8 years
MTTR
Availability
Life Time
(*) with rated efficiency
Copyright (c) 2013 IEEE. Personal use is permitted. For any other purposes, permission must be obtained from the IEEE by emailing pubs-permissions@ieee.org.
This article has been accepted for publication in a future issue of this journal, but has not been fully edited. Content may change prior to final publication. Citation information: DOI
10.1109/TIA.2013.2290841, IEEE Transactions on Industry Applications
Fig. 6. Thermal profile of VS, CS and BMC: a) VS Normal, b) CS Normal, c) BMC Normal, d) VS Weak Contact, e) CS Weak Contact, f) BMC Weak
Contact, g) VS Short Circuit, h) CS Short Circuit, and i) BMC Short Circuit.
VI.
CONCLUSION
REFERENCES
E.P. Wiechmann, A.S. Morales, P.E. Aqueveque, and R.A. MayneNicholls, Reducing Specific Energy to Shrink the Carbon Footprint
in a Copper Electrowinning Facility, IEEE Transactions on Industry
Applications, Vol. 47, No 3, pp. 11751179, 2011.
[2]
[3]
[4]
[5]
[6]
[7]
[8]
URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arn
umber=5729335&isnumber=5768120
Copyright (c) 2013 IEEE. Personal use is permitted. For any other purposes, permission must be obtained from the IEEE by emailing pubs-permissions@ieee.org.