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General Description
Applications
Motion Control - Home Appliance / Industrial Motor
Related Resources
AN-9035 - Motion SPM 3 Series Ver.2 Users Guide
Device Marking
Package
Packing Type
Quantity
FSBB30CH60
FSBB30CH60
SPMEA-027
Rail
10
FSBB30CH60 Rev. C6
www.fairchildsemi.com
January 2014
Pin Configuration
13.7
(1) VCC(L)
(2) COM
(3) IN(UL)
(4) IN(VL)
(5) IN(WL)
(6) VFO
(7) CFOD
(8) CSC
(21) NU
(22) NV
19.2
(23) NW
(9) IN(UH)
(10) VCC(UH)
(11) VB(U)
(12) VS(U)
(13) IN(VH)
(14) VCC(VH)
(15) VB(V)
(16) VS(V)
(17) IN(WH)
(18) VCC(WH)
(19) VB(W)
(24) U
(25) V
(26) W
DBC Substrate
(27) P
(20) VS(W)
FSBB30CH60 Rev. C6
www.fairchildsemi.com
Pin Descriptions
Pin Number
Pin Name
VCC(L)
Pin Description
Low-Side Common Bias Voltage for IC and IGBTs Driving
COM
IN(UL)
IN(VL)
IN(WL)
VFO
CFOD
CSC
IN(UH)
10
VCC(UH)
11
VB(U)
12
VS(U)
13
IN(VH)
14
VCC(VH)
15
VB(V)
16
VS(V)
17
IN(WH)
18
VCC(WH)
19
VB(W)
20
VS(W)
21
NU
22
NV
23
NW
24
25
26
27
FSBB30CH60 Rev. C6
www.fairchildsemi.com
(17) IN (W H)
VB
VCC
IN
(20) V S(W )
(15) V B(V)
(14) V CC(VH)
W (26)
VB
VCC
IN
(16) V S(V)
(11) V B(U)
OUT
VS
V (25)
VB
(10) V CC(UH)
VCC
OUT
COM
(9) IN (UH)
IN
(12) V S(U)
(8) C SC
C(SC)
(7) C FO D
VS
U (24)
OUT(W L)
C(FOD)
(6) V FO
N W (23)
VFO
(5) IN (W L)
(3) IN (UL)
VS
COM
(13) IN (VH)
(4) IN (VL)
OUT
COM
IN(W L) OUT(VL)
IN(VL)
N V (22)
IN(UL)
(2) CO M
COM
(1) V CC(L)
VCC
OUT(UL)
V SL
N U (21)
FSBB30CH60 Rev. C6
www.fairchildsemi.com
Inverter Part
Symbol
VPN
VPN(Surge)
VCES
Parameter
Conditions
Supply Voltage
Rating
Unit
450
500
600
IC
TC = 25C
30
ICP
45
PC
Collector Dissipation
TJ
(2nd Note 1)
103
-20 ~ 125
2nd Notes:
1. The maximum junction temperature rating of the power chips integrated within the Motion SPM 3 product is 150C (at TC 100C). However, to insure safe operation of the
Motion SPM 3 product, the average junction temperature should be limited to TJ(ave) 125C (at TC 100C)
Control Part
Symbol
Parameter
Conditions
Rating
Unit
VCC
20
VBS
20
VIN
-0.3 ~ 17
VFO
IFO
VSC
-0.3 ~ VCC+0.3
mA
-0.3 ~ VCC+0.3
Rating
Unit
400
-20 ~ 100
Total System
Symbol
Parameter
Conditions
VPN(PROT)
TC
TSTG
Storage Temperature
VISO
Isolation Voltage
-40 ~ 125
2500
Vrms
Thermal Resistance
Symbol
Rth(j-c)Q
Rth(j-c)F
Parameter
Junction to Case Thermal
Resistance
Condition
Min.
Typ. Max.
Unit
0.97
C/W
1.77
C/W
2nd Notes:
2. For the measurement point of case temperature(TC), please refer to Figure 2.
FSBB30CH60 Rev. C6
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Inverter Part
Symbol
VCE(SAT)
VF
HS
tON
Parameter
Conditions
Min.
Typ.
Max.
Unit
Collector - Emitter
Saturation Voltage
VCC = VBS = 15 V
VIN = 5 V
IC =30 A, TJ = 25C
2.75
VIN = 0 V
IC =30 A, TJ = 25C
2.4
Switching Times
0.49
0.34
0.86
0.52
tC(ON)
tOFF
tC(OFF)
0.10
0.68
0.47
0.90
tC(OFF)
0.50
trr
0.10
250
trr
LS
tON
tC(ON)
tOFF
ICES
Collector - Emitter
Leakage Current
VCE = VCES
2nd Notes:
3. tON and tOFF include the propagation delay of the internal drive IC. tC(ON) and tC(OFF) are the switching time of IGBT itself under the given gate driving condition internally. For
the detailed information, please see Figure 4.
100% I C 100% I C
trr
V CE
IC
IC
V CE
V IN
V IN
tON
tOFF
tC(ON)
V IN(ON)
tC(OFF)
V IN(OFF)
10% V CE
10% I C
(b) turn-off
(a) turn-on
FSBB30CH60 Rev. C6
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Control Part
Symbol
IQCCL
Parameter
Conditions
IQCCH
Min.
Typ.
Max.
Unit
VCC = 15 V
IN(UL, VL, WL) = 0 V
VCC(L) - COM
23
mA
VCC = 15 V
IN(UH, VH, WH) = 0 V
100
500
4.5
IQBS
VBS = 15 V
IN(UH, VH, WH) = 0 V
VFOH
0.8
VSC(ref)
0.45
0.50
0.55
UVCCD
10.7
11.9
13.0
UVCCR
11.2
12.4
13.2
UVBSD
Detection Level
10.1
11.3
12.5
UVBSR
Reset Level
10.5
11.7
12.9
VFOL
tFOD
1.0
1.8
ms
VIN(ON)
ON Threshold Voltage
3.0
VIN(OFF)
0.8
2nd Notes:
Parameter
Conditions
Min.
Typ.
Max.
Unit
VPN
Supply Voltage
300
400
VCC
13.5
16.5
VBS
13
18.5
-1
V / s
2.5
20
kHz
fPWM
VSEN
-4
FSBB30CH60 Rev. C6
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Parameter
Mounting Torque
Conditions
Mounting Screw: M3
Device Flatness
Min.
Typ.
Max.
Unit
0.51
0.62
0.72
Nm
+120
15.00
Recommended 0.62 Nm
See Figure 5
Weight
(+)
(+)
FSBB30CH60 Rev. C6
www.fairchildsemi.com
Input Signal
Protection
Circuit State
RESET
SET
RESET
UVCCR
a1
Control
Supply Voltage
a6
UVCCD
a3
a2
a7
a4
Output Current
a5
Input Signal
Protection
Circuit State
RESET
SET
RESET
UVBSR
Control
Supply Voltage
b5
b1
UVBSD
b3
b6
b2
b4
Output Current
High-level (no fault output)
FSBB30CH60 Rev. C6
www.fairchildsemi.com
c6
Protection
Circuit State
SET
Internal IGBT
Gate - Emitter Voltage
Lower Arms
Control Input
c7
RESET
c4
c3
c2
SC
c1
c8
Output Current
SC Reference Voltage
Sensing Voltage
of Shunt Resistance
c5
CR Circuit Time
Constant Delay
FSBB30CH60 Rev. C6
10
www.fairchildsemi.com
+5 V
SPM
RPF = 4.7 k
MCU
VFO
CPF= 1 nF
COM
1. RC coupling at each input (parts shown dotted) might change depending on the PWM control scheme in the application and the wiring impedance of the applications printed
circuit board. The Motion SPM 3 Product input signal section integrates a 3.3 k(typ.) pull-down resistor. Therefore, when using an external filtering resistor, pay attention to
the signal voltage drop at input terminal.
2. The logic input works with standard CMOS or LSTTL outputs.
+15 V
RE(H)
RBS
One-Leg Diagram of
Motion SPM 3 Product
DBS
P
0.1 F
22 F
Vcc
VB
IN
HO
COM VS
Inverter
Output
Vcc
1000 F
1 F
IN
OUT
COM VSL
3. It would be recommended that the bootstrap diode, DBS, has soft and fast recovery characteristics.
4. The bootstrap resistor (RBS) should be three times greater than RE(H). The recommended value of RE(H) is 5.6 , but it can be increased up to 20 (maximum) for a slower dv/
dt of high-side.
5. The ceramic capacitor placed between VCC - COM should be over 1 F and mounted as close to the pins of the Motion SPM 3 product as possible.
FSBB30CH60 Rev. C6
11
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RE(VH)
+15 V
RE(UH)
RBS
DBS
(19) VB(W)
(18) VCC(WH)
CBS
Gating WH
CBSC
(17) IN(WH)
(20) VS(W)
RBS
DBS
P (27)
VB
VCC
OUT
COM
IN
(15) VB(V)
(14) VCC(VH)
VB
VCC
CBS
Gating VH
CBSC
(13) IN(VH)
(16) VS(V)
M
C
U
RBS
DBS
(11) VB(U)
(10) VCC(UH)
CBS
Gating UH
W (26)
VS
CBSC
(9) IN(UH)
(12) VS(U)
OUT
COM
IN
VS
V (25)
VB
VCC
CDCS
OUT
COM
IN
Vdc
U (24)
VS
RF
+5 V
(8) CSC
CSC
RPF
(7) CFOD
RS
CFOD
Fault
(6) VFO
(5) IN(WL)
Gating WL
C(SC) OUT(WL)
C(FOD)
NW (23)
IN(WL) OUT(VL)
(4) IN(VL)
Gating VL
RSW
VFO
IN(VL)
NV (22)
RSV
(3) IN(UL)
IN(UL)
Gating UL
(2) COM
CBPF
COM
CPF
(1) VCC(L)
OUT(UL)
VCC
CSP15
VSL
NU (21)
RSU
CSPC15
RFW
W-Phase Current
V-Phase Current
U-Phase Current
RFV
RFU
CFW
CFV
CFU
1. To avoid malfunction, the wiring of each input should be as short as possible (less than 2 - 3 cm).
2. By virtue of integrating an application-specific type of HVIC inside the Motion SPM 3 product, direct coupling to MCU terminals without any optocoupler or transformer isolation is possible.
3. VFO output is open-collector type. This signal line should be pulled up to the positive side of the 5 V power supply with approximately 4.7 k resistance (please refer to Figure
9).
4. CSP15 of around seven times larger than bootstrap capacitor CBS is recommended.
5. VFO output pulse width should be determined by connecting an external capacitor (CFOD) between CFOD (pin 7) and COM (pin 2). (Example : if CFOD = 33 nF, then tFO = ms
(typ.)) Please refer to the 2nd note 5 for calculation method.
6. Input signal is active-HIGH type. There is a 3.3 kresistor inside the IC to pull down each input signal line to GND. When employing RC coupling circuits, set up such RC couple that input signal agree with turn-off / turn-on threshold voltage.
7. To prevent errors of the protection function, the wiring around RF and CSC should be as short as possible.
8. In the short-circuit protection circuit, please select the RFCSC time constant in the range 1.5 ~ 2 s.
9. Each capacitor should be mounted as close to the pins of the Motion SPM 3 product as possible.
10. To prevent surge destruction, the wiring between the smoothing capacitor and the P & GND pins should be as short as possible. The use of a high-frequency non-inductive
capacitor of around 0.1 ~ 0.22 F between the P & GND pins is recommended.
11. Relays are used in almost every systems of electrical equipment in home appliances. In these cases, there should be sufficient distance between the MCU and the relays.
12. CSPC15 should be over 1 F and mounted as close to the pins of the Motion SPM 3 product as possible.
FSBB30CH60 Rev. C6
12
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RE(WH)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or data on the drawing and contact a FairchildSemiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchilds worldwide therm and conditions,
specifically the the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductors online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/MO/MOD27BA.pdf
FSBB30CH60 Rev. C6
13
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FSBB30CH60 Rev. C6
14
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