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using PVS
Tobing Soebroto,
Cadence IP Group
Presented at Signoff Summit
Nov 21, 2013
Agenda
1. Cadence IP Factory
2. Signoff Challenges
3. Why PVS for Physical Verification
4. Conclusions
Expansion to
existing Analog
Team
Pre - 2013
Q2 2013
Building a
comprehensi
ve
ecosystem
partners,
customers,
foundries,
design
houses, etc.
Q3+ 2013
Cadence Confidential
Cadence IP Factory
Next Gen SoCs
DRAM
NAND
PCIe
Ethernet
USB
MIPI
AMS
Ctrl.+PHY
Ctrl.+PHY
Ctrl.+PHY
MAC+PCS+PHY
Ctrl.+PHY
Ctrl.+PHY
Analog Mixed
Signal
DDR1/2
ONFi 1/2/3
Gen1
10/100 MAC
USB 2
DSI
ADC/DAC
USB 3
CSI
AFE
USB OTG
SLIMbus
SENSORS
USB Hub
DigRF
PLL/DLL
HSIC
BIF
PVT mon
USB 2 PHY
D-PHY
SERDES
USB 3 PHY
M-PHY
Power
Mgmt
DDR3
1G MAC
Toggle 1/2
Gen2
DDR4
10G MAC
Async
LPDDR1/2
LPDDR3
LPDDR4
SDIO
Device
SD/SDIO
Host
1/2/3/3.2/4
Gen3
Gen3
AVB
MMC/eMMC
HMC
100G MAC
L1 substate
Wide I/O
Wide I/O 2
40G MAC
M-PCIe
4.2/4.4/5.0
UHS I/II
Auto
Ethernet
PCIe PHY
10GKR
HS PHY
Delay line
on DQS
Synthesizable
PHY logic
Per-bit DQ
Delay line
LP PHY
Up to 1600 performance
Lowest power/area, integrated hard controller
DDR2/3/3L LPDDR2/3 support
High volume production
IO Pads
DRAM interface
HS PHY
Cadence IP Group
Be first to market with differentiated IP
Cover a broad range of customer needs
Get as many customers fast
Cadence IP Group
IP products support multiple new foundries
Tools used must support leading edge technologies/process nodes
for example, TSMC 16FF technologies
Must help to improve productivity and achieve fastest time to market
Design impact needs to be understood
Mixed Signal flows
Reduce debugging time
Reduce Iterations/loops to signoff
7
Previously
PVS rule decks were available by request to the foundry
and Cadence foundry team
Now
PVS is available online at selected foundries early with
other signoff tools
Decision:
PVS is our plan of record where decks are available and
has been used on numerous tapeouts
PVS GUI
submission
9
Convert Verilog
to CDL
Merge netlists
10
11
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Conclusion
PVS is the plan of record for Cadence IP group
PVS has many technologies which ease and fasten signoff
time to tapeout
In-design applications which reducing debugging time
Timing aware dummy metal fill
Interactive DRC with IPVS
Advanced node technology support
13