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Stretchable Electronics
- shaping electronic circuits Prof. Stphanie P. Lacour
Lab. For Soft Bioelectronic Interfaces, EPFL
stephanie.lacour@epfl.ch
6/16/14
Outline
Mechanical concepts
Materials
Examples of stretchable circuits
large-area
flexible
brittle
shattered iPhone
Flex circuits
HP Flexible display
6/16/14
Infineon 2011
power electronics on
40m thick wafer
anything thin is flexible
University of Tokyo
2008
Tactile skin
Takao Someya et al.
UIUC 2011
Epidermal
electronics
John Rogers et al.
Samsung 2012
flexible OLED display
UIUC 2012
Transient
electronics
John Rogers et al.
backplane / frontplane
Substrates: Glass
Device materials: thin films
Technology: planar, thin film processing
Applications: Flat Panel Displays (handheld devices,
phones, cameras, monitors, TVs), e-paper
Encapsulation: 1m 1mm thick
LCD, OLED Display layer
TFT layer: 1m thick
Glass carrier: 10m 1mm thick
display cross-section
circuit diagrams
R. Street Adv. Mat. 2009, 21, 1-16
6/16/14
RF ID tag
milFlexCircuit -3M
On curvatures
A
C
Gaussian curvature: K = 12
A saddle shape:
K<0
B cylinder shape:
K = 0 (1 = 0)
C spherical shape: K > 0
foil coating
Electronic tent
Orange
E 10-100 kPa
skin
E 10 GPa
bone
K0
K0
8
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Level of difficulty
Integration of materials with very different properties
Substrates: plastic, elastic
Devices: inorganic and/or organic transistors, diodes, sensors, antennas
Encapsulation: brittle/plastic composites, elastic
need new design rules that are applicable to all materials
9
Pixellated approach
structural and physical mismatch
top view
elastic substrate
device
IC
device
IC
elastic wiring
device
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elastic wiring
elastic wiring
stretches
elastic substrate
no applied strain
2D stretched
11
Stretchable circuits
Stretchable thin-film transistor circuits
Vin#
Imperceptible electronics
2mm#
GND#
S. Wagner
Z. Suo
S. Lacour
T. Someya
load#TFT#
drive#
TFT#
S. Bauer
stretchable#
interconnects#
VDD#
Vout#
Stretchable
microchip
circuits
J. Vanfleteren
12
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13
cone
flat
cylinder
14
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flat
stretched
inflated
15
load
(N / m2 or Pa)
area
Strain
strain ( ) =
change in length
L
=
100%
original length
L
Poisson ratio
=
y
x
=
; 0 < 0 .5
z
z
16
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Mechanical strain
strain ( ) =
change in length
L
=
100%
original length
L
tensile strain
>0
h/2
bend
h
R0
compressive strain
<0
neutral
plane
h
2 R0
17
unload
stress
tensile
strength
linear regime
E=
fracture
(Pa )
Youngs modulus
permanent deformation
strain
18
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SiNx SiOx
Brittle (glass-like) materials
SiNx, SiO2, Si
High stress, low fracture strain
400
350
stress (MPa)
300
stainless steel
250
200
Plastic deformation
metals, stainless steel, polyimide
High stress, higher fracture strain
Si
150
metal
100
polyimide
50
rubber
strain (%)
0
0
0.05
0.1
0.15
0.2
25
19
Mechanical Failure
Brittle behaviour
Ductile behaviour
brittle
Semiconductors
Dielectrics
Metal oxides
ductile
Metals
stress
Crack propagates
Film necks
strain
Z. Suo, Harvard University,
http://www.seas.harvard.edu/suo/
20
10
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Device materials
Brittle materials
Encapsulation Materials
Plastics or elastomers
21
Selection of substrates
Application-dependent
RF ID tag OLED display implantable interface
PARC
flex photosensors
Polyonics
LG Display
GlobalSolar
22
11
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Polymer substrates
flexible, optical transparency, rolls or spinable
poor thermo-mechanical stability, rough surface, not elastic
Elastomeric substrates
reversible stretchability, spinable, moldable
poor thermal stability thus process compatibility, chemical susceptibility
Biodegradable substrates
stiff enough for manipulation, degrades quickly
cannot process directly of these materials
23
Plastic substrates
PolyEthylene Terephthalate (PET)
Thermoplastic polymer
Widely available
Low cost
Mylar
Teonex
Polyimide (PI)
Thermoplastic
Very good thermal stability
Kapton
24
12
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Elastomeric substrates
Elastic polymers
Long polymer chains cross-link during curing
Covalent cross-linkage
25
Preparation
Casting, spin-coating
Molding
Biocompatible grades
0 .8
0 .7
0 .6
s tre s s (MP a )
0 .5
0 .4
0 .3
0 .2
E=2MPa
0 .1
0 .0
-0 .1
10
15
20
25
30
s tra in (% )
Silicon:
Glass:
Polyimide:
E = 160GPa
E = 70GPa
E = 3GPa
26
13
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Paper as a substrate
Packed cellulose fibers (+fillers)
Thickness range: 0.1mm
Light weight (10s g/m2)
Opaque to translucent
http://www.handprint.com/
Hygroscopic material
Good electrical insulator ( [1010 - 1014.cm]; 1.3-4 @ 1MHz)
Often coated with protective materials
R2R compatibility
Low-cost, recyclable, biodegradable
27
Biodegradable substrate
From the drug-delivery field or natural materials
28
14
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2. Organic materials
3. Newer materials
29
Printing
Inkjet printing
Laser printing
www.spie.org
Contact printing
http://www.aist.go.jp/aist_e/
latest_research/
2008/20080728/20080728.html
30
15
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Silicon
Pentacene
Covalent bond
Molecular bond
Crystal symmetry
Amorphous, polycrystalline
Dimensionality
(electronic prop.)
isotropic
anisotropic
High temperature
High costs (epitaxy, etc.)
RT-low temperature
Low costs (spin-coating, evaporation)
Atomic bonding
Deposition techniques
silicon
a-Si:H
10-6
10-5
10-4
10-3
10-2
10-1
100
polycryst.
101
102
cryst.
103
organics
polycristalline
films
Molecular crystals
31
Thin is Flexible
1-atom thick materials
Carbon Nanotubes CNTs and Graphene
http://ipn2.epfl.ch/CHBU/NTbasics1.htm
32
16
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substrate
33
34
17
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Liquid metals
Electrically conductive metallic fluid encapsulated in
microchannels
(Mercury)
EGaIn: 3.104S/cm
Low melting point: 17C
In elastic conduits
Patternable
Self-healing
35
Electrical Probing
Deported/stiffening contacts
stiffened contact
Contacts do not
deform
stretchable section
R. Carta et al. Sens. Act. A 2009 online
Compliant contacts
stretchable contact pads
5mm
18
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37
Stretchable circuits
-1.2
relaxed!
IDS (A)!
-1
appl = 12.6%"
VGS = -60V!
-0.8
-0.6
-0.4
VGS = -40V!
-0.2
VGS = 0,-20V!
0
-60
stretched!
-50
-40
-30
-20
-10
VDS (V)!
19
6/16/14
PDMS"
stretched PDMS
PDMS" = 20%"
Cross-sections
39
stretch
stretchable substrate
elastic interconnect
device island
before stretching
3 disk
Al2Al
O23Odisk
at 20% strain
after stretching
film
AuAu
film
20
6/16/14
stretch
stretchable substrate
elastic interconnect
device island
before stretching
Al2O
Al3 disk
O disk
2
at 20% strain
after stretching
Au Au
filmfilm
embedded
embedded
SU8
SU8
platform
platform
SU8 in P-PDMS
SU8 in PDMS
UV Cr mask
Optimizing further
sample cross-section
D
100m
50m
S=4D
PDMS
SU8
D
d
100m
50m
S=4D
PDMS
SU8
G=2mm
D
G
100m
50m
S=4D
SU8
P-PDMS
21
6/16/14
44
22
6/16/14
Acknowledgment
23