CHAPTER 5

DESIGNING AND PLANNING

The first step in the process of designing any electronic
circuit, is the construction of the layout of that electronic circuit
for the circuit board. This preliminary and for most objective is
necessary to avoid further confusion in the rest of proceeding.
By using above procedure we have to make the circuit most
compact but with designer look we have to most careful while
working with high frequency which is very much existent in out
project because the problem coupling between PCB tracks is very
critical and hence to solve this problem ground tracks between
two signal tracks of a double side PCB whose one side acts as a
ground. This help in decoupling the signal or eliminating the
instability and interfernce.
LAYOUT PLANNING :
The layout of PCB has to in co-operate all possible
information and components on the circuit board, as given
in the circuit diagram. After that one can proceed to artwork
preparation.
LAYOUT SCALE :
Depending upon the accuracy in the layout artwork is done
according to scale selected. Scales selected may be 1:1, 2:1
or4:1 which is four times or sixteen times of the actual
PCB.The layout is best prepared using the same scale.

 LAYOUT PROCEDURE:
While preparing any layout of an electronic circuit the first
rule is to be remembered is not to start the desingning of the
layout unless and until an absolutely clear and is not
available. Another important note is to prepare a before a
hand PCB layout from component side. This minimizes any
further complication. Among the larger ones are placed first
and the space in between is filled with smaller ones. All
components are not necessary if they have to be replaced.
To take distance between terminal leads of each
component.
To take size of the components into consideration.
Smaller components like ICs resistance etc. are placed
in the center of the layout and bigger component like
electronic capacitor are placed in the outskirts. All
components are placed in such a manner that
disordering is possible. This they help in fast testing of
circuit.
LAYOUT SKETCH:
The end product of layout designing is a pencil sketch on
the copper clad sheet and conductor draw in which is
labeled as layout sketch which contain of reluctant
information for preparation of artwork.

ARTWORK PREPARATION:
The preparation of artwork is considered as the first step
in preparation of PCB, different procedure is available to
prepare a good network. Some of them are listed below.

 Use of paint or marker for preparation of artwork.

Use of black tape on transparent base toil.
Use of PCB drifting aid.
Screen-printing.

ETCHING:
After the artwork is prepared on the circuit board,
all excessive copper on the copper clad sheet is to be removed,
only copper tracks remaining on the copper clad. The copper
clad sheets are the once on etching tape of paint is applied.
During the etching process it is understood that the
process happen vertically however practically, the etching
action is always side ways.
ECHENTS:
Among the etchents uses ferric chloride (Fecl3) is the
most common etchents used because of its hygroscopic nonvolatile and good solubility with wafer. The following
reaction takes place during the etching process.
Fecl3 + Cu Fecl2 +cucl
Due to high corrosiveness of fecl3 etching is faster.
RINSING:
After etching is done fecl2 contaminated surface
should be cleaned. The usual practice follow rinsing by wafer

and cleaning by oxalic acid. A vigorous final wafer rinse has to

follow.
DRILLING:
Drilling mechanical holes is also an important
operation. Drilling is done by using drill bits from 0.8mm to
2mm as per components, drilling can be done by using hand
drill or an electric drill. To compensate for the lumination a
drill bit 0.04mm bigger than the hole diameter is chosen.

SOLDERING:
Soldering is the stage for completion of any circuit. It is the
process in which the alloy of tin and lead is heated of about 300
to melt and set itself around the components lead surface.
There are two types of soldering techniques:
Manual Soldering
Wave Soldering
Manual soldering is the technique which is operated by
us for soldering very few components whereas wave soldering is
used to solder mass number of components. Wave soldering is
done by special machines.
Care should be taken that flux or solder paste is
applied to surface where soldering to be done so as to quicken the
process.