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Analysis
A flat vertical plate situated a t a temperature
higher than that of the liquid film falling freely
along the plate under the action of gravity against
the shear resistance a t the wall is considered. Vaporization is supposed to take place at the vapor-liquid
interface under non-nucleating conditions. Very recently Oosthuizen and Cheung"" have conducted experiments with an electrically heated cylinder cooled
by falling water films. They observed that from the
film distributor exit the flow passes through laminar,
wavy-laminar, transitional and fully turbulent regimes. They'l'' concluded that large variations in the
heat transfer rate along the surface arise due to
changes in the type of flow within the film.
The present analysis applies t o fully developed turbulent film flow away from the film forming device.
The shear stress$-distribution a t the interface can
be obtained by a force balance as
T/T,
1-
0 Y+/ '6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
where rw = 6 p ~ g ; @= 1 -
b2 Y+'.
...................................
+ ~ ~ ) d u / d. .Y. . . . . . . . . . . . . . . . . . . . . . . .
= p ~ ( u
. (3)
U+ =
26+ ba
In ( 1
+ bZ Y+2). .......(4)
=
'
Y+
[3+4(+-)
[2
+ +]
+2
(q
J
(5)
(2)
where b = 0.091.
It is relevant to point out that no direct information is available concerning the effect of surface
tension variations on the film-structure parameters"s'.
Nevertheless, Borodin and
employed the eddy
diffusivity expression of Mills and Chung(la' while
analysing the temperature profiles along the flow
direction of the wavy-laminar falling films. Recently
Brumfield and Theofanous"" considered the turbulent
liquid films as being composed of a base film next
732
(1)
(T,L/T,)
Here, p assumes a value of unity for no drag condition a t the interface. For Y +5.30, the eddy diffusivity
expression is
E ~ / V=
530003, India
4Y+6+
36+2 -t 1206+
36+2
- l1n (
Ki
+ 2Y+Z
+ 1800
+ 13.41 + 128.6/6+. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(7)
[J30
0
u+ dY+
*See Appendix.
4- 4 (13.416+ - 258.0 +
....................
(9)
and for S + 1 3 0
17-
1 - In (1
+ b26f2)
+ (bz6+iG1)tan-l(bs+)
. . . . . . . . . . . . . . . . .. . (10)
However, Equation (9) is manipulated to the following explicit form which is very useful in the design calculations for turbulent falling films.
7
5
5
, , , . I
10
1000
100
Y+
Figure 1
3000.
2000
1000 ?
a r , , , , 1
, r r - r r
A
0
100 7
1 9 -
I10
100
1000
Re
10000
. . . . . . . . . . . . . . . . . .(13)
For turbulent flow it is well known that EH =
when P r 2 1.0. Hence, following this assumption we
havecB'
Io5
-e H=
V
0 .?--------
H+
NARAYANAMURTHY 4 SARMA-E0.[16)
-DO-
+x-"-
[I01
EO (11) Ll01
qw =
1111
0 t--*--I-WILKE
Ms ADAMS le3
OF CHUN L SEDAN C31
DATA OF
DATA
K (Tw - [ T y + = 5 )
5
(g6+/~')'/3..
. . . . . . . . . . . . . . .(15)
PRESENT ANALYSIS
0
KJAMS LB]
0 6----Mc
Constant
0.11
103
Re
= -
(18)
733
TABLE
1
TABLE
SHOWING THE AVAILABLE
EQUATIONS
TO PREDICT THE HEATTRANSFER
RATESI N TURBULENT
FALLING
FILMS
s1.
Equation
Remarks
No.
1.
H+
2.
Hi = 0.02007 ReV
3.
Wilke, W.
4.
H+
5.
H+ = 0.0008539 ReO.06
6.
7.
H+
H+
(I1)
0.01 (Re)1/3PrV3
(1962)
_
.
=
=
T Y + = Q O a t Y+ = 30
a t Y+ = fj+
Ty+,a+
Ty+=a+ =
and
we get
4w
0.36 Pr K u*
In (S+/30). .. . . . . . . .(19)
5+-
h f i
6+'/3
. . . . . . . (20)
(tan-' 3 0 b d K - tan-' 5 b d P r )
define
qw
conclusions
=
h (Tw -
TB)
734
of
APPENDIX
Nommlatwre
In a recent paper Mflls and Chung"') derived a n expression for eddy mass diffusivity which includes the
influence of surface tension f orces (Kapitza number)
In falling films the presence of capillary waves gives
riee to surface tension forces. Hence, the purpose of
the present appendix is to test whether the eddy mass
diffusivity expression gives rise to a meaningful relation to predict heat transfer rates in falling films.
Equation ( 1 3 ) can be written as
(183144).
C,
5h
=
=
=
H+
K
K,
q
T
u
u+
or
. (A-1)
u*
Y
Y+
Re
Ku
Pr
a
where
6+
. (A-2)
EM
EH
y
p
2%-
= 6.47
lo-'
6+
[sin-'
(--)
A - 1
2dx-
where A
and
6+
%] . .
, ,
. . .(A-4)
+($)113
=
=
=
=
=
=
=
=
=
=
=
=
Subscribts
=
=
=
interface
liquid
wall
References
Y. and Kaparthl. R., Ind. J. Tech. 1. 377 (1963).
H MacLeod A. A., Monrad. C. C. and Rothfus,
R. R.'AIChE"J. 6. 246 '(1969).
(3) Chun K R. and Sehan R. A., Trans. ASME, J. Heat Transfer
Ser. 'c, '93, 891 1971):
(4) Dukler A. E.. C6em. Eng. Prog. 66 62 (1969).
(6) Dukler: A. E. and Bergelin, 0. P., bhem. Eng. Prog. 48, 667
1) Ahmed, S.
2) Belkin H
(1962).
(6) Garwin, L. and Kelly, E. W.,Ind. Ens. Chem. Fundam. 47.
392 (1966).
(7) Herbert, L. S. and Sterns, U. J., Can. J. Chem. Eng. 46.
401 (1968).
(8) McAdams, W. H.,Drew, T. B. and Bays, G. S., Trans. ASME
62, 627 (1940).
(9) Mizushina, T., Ito. R. and Opine F., Heat Transfer 1970,
A Ku-l ReIeB786+4/3 Pr
=
=
=
=
p
u
= thermal conductivity
=
=
=
=
k o m Ref."*) we have
~ i * ~ /v g
Elsevier
Acknowledgments
Manuscript received
August 7. 1977.
. (A-5)
i.
The authors thank the reviewers for the very constructive comments.
July
14,
1976 ; accepted
* * *
for
publication
735