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Vishay Siliconix
FEATURES
PRODUCT SUMMARY
RDS(on) ()
ID (A)a
0.0095 at VGS = 10 V
35
35
VDS (V)
30
Qg (Typ.)
9.2 nC
PowerPAK SO-8
6.15 mm
APPLICATIONS
5.15 mm
RoHS
COMPLIANT
Rectifier
DC/DC Converters
S
2
Halogen-free available
TrenchFET Power MOSFET
New Low Thermal Resistance PowerPAK
Package with Low 1.07 mm Profile
Optimized for High-Side Synchronous
Operation
100 % Rg Tested
S
3
G
4
D
8
D
7
D
6
D
5
Bottom View
Ordering Information: Si7686DP-T1-E3 (Lead (Pb)-free)
Si7686DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
N-Channel MOSFET
Symbol
VDS
VGS
TC = 25 C
TC = 70 C
TA = 25 C
TA = 70 C
ID
IDM
TC = 25 C
TA = 25 C
IS
L = 0.1 mH
IAS
EAS
TC = 25 C
TC = 70 C
TA = 25 C
TA = 70 C
PD
TJ, Tstg
Limit
30
20
35a
35a
17.9b, c
14.3b, c
50
31.5
4.2b, c
10
5
37.9
24.2
5b, c
3.2b, c
- 55 to 150
260
Unit
V
mJ
t 10 s
Steady State
Symbol
RthJA
RthJC
Typical
21
2.8
Maximum
25
3.3
Unit
C/W
Notes:
a. Package Limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 70 C/W.
Document Number: 73451
S-80440-Rev. C, 03-Mar-08
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1
Si7686DP
Vishay Siliconix
SPECIFICATIONS TJ = 25 C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = 250 A
30
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
VDS/TJ
VGS(th)/TJ
ID = 250 A
VGS(th)
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = 20 V
IDSS
ID(on)
gfs
mV/C
-6
1
100
nA
VDS = 30 V, VGS = 0 V
VDS = 30 V, VGS = 0 V, TJ = 55 C
10
VDS 5 V, VGS = 10 V
RDS(on)
V
31.5
50
A
A
VGS = 10 V, ID = 13.8 A
0.0078
0.0095
0.011
0.014
VDS = 15 V, ID = 13.8 A
56
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Crss
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
1220
VDS = 15 V, VGS = 0 V, f = 1 MHz
230
17
26
9.2
14
98
4.1
f = 1 MHz
0.8
1.2
20
30
VDD = 15 V, RL = 1.5
ID 10 A, VGEN = 4.5 V, Rg = 1
tr
Rise Time
20
30
20
30
tf
15
td(on)
13
20
16
25
23
35
15
td(off)
VDD = 15 V, RL = 1.5
ID 10 A, VGEN = 10 V, Rg = 1
tr
Rise Time
td(off)
tf
Fall Time
nC
2.8
td(on)
pF
ns
Currenta
TC = 25 C
IS
31.5
ISM
50
IS = 2.6 A
VSD
0.8
1.2
trr
25
50
ns
Qrr
15
30
nC
ta
tb
12.5
12.5
ns
Notes:
a. Pulse test; pulse width 300 s, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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2
Si7686DP
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
50
10
VGS = 10 thru 4 V
8
I D - Drain Current (A)
40
30
20
4
TC = 125 C
2
10
25 C
3V
- 55 C
0
0.0
0.4
0.8
1.2
1.6
0
0.0
2.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Output Characteristics
Transfer Characteristics
0.0140
1500
0.0120
1200
VGS = 4.5 V
C - Capacitance (pF)
Ciss
0.0100
VGS = 10 V
0.0080
900
600
Coss
0.0060
300
Crss
0.0040
0
0
10
20
30
40
50
10
15
20
25
Capacitance
10
30
1.8
ID = 13.8 A
1.6
8
VDS = 15 V
6
VDS = 21 V
4
ID = 13.8 A
VGS = 10 V
1.4
(Normalized)
R DS(on) - On-Resistance
VGS = 4.5 V
1.2
1.0
0.8
0
0
12
Gate Charge
Document Number: 73451
S-80440-Rev. C, 03-Mar-08
16
20
0.6
- 50
- 25
25
50
75
100
125
150
Si7686DP
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
0.030
R DS(on) - Drain-to-Source On-Resistance ()
50
TJ = 150 C
10
TJ = 25 C
0.020
TJ = 125 C
0.015
TJ = 25 C
0.010
0.005
1
0.00
ID = 13.8 A
0.025
0.2
0.4
0.6
0.8
1.0
1.2
10
2.6
50
2.4
40
2.0
Power (W)
VGS(th) (V)
2.2
ID = 250 A
1.8
30
20
1.6
1.4
10
1.2
1.0
- 50
- 25
25
50
75
100
125
0
0.01
150
0.1
10
100
TJ - Temperature (C)
Time (s)
Threshold Voltage
600
100
Limited by
RDS(on)*
10
1 ms
10 ms
100 ms
1s
10 s
0.1
DC
0.01
0.001
0.1
TA = 25 C
Single Pulse
1
10
100
Si7686DP
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
60
40
35
50
40
Power (W)
30
30
Package Limited
25
20
15
20
10
10
0
0
25
50
75
100
Current Derating*
125
150
25
50
75
100
125
150
Power Derating
* The power dissipation PD is based on TJ(max) = 150 C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
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5
Si7686DP
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (s)
10
100
600
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
Square Wave Pulse Duration (s)
10-1
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?73451.
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6
Package Information
www.vishay.com
Vishay Siliconix
E2
K
E4
D4
Z
2
D5
D2
2
D1
D
2
D
3
4
L1
E3
A1
1
D1
D5
D2
Detail Z
K1
2
E1
E
D3 (2x) D4
3
4
Notes
1. Inch will govern.
2 Dimensions exclusive of mold gate burrs.
3. Dimensions exclusive of mold flash and cutting burrs.
E3
Backside View of Dual Pad
MILLIMETERS
DIM.
MIN.
A
0.97
A1
b
0.33
c
0.23
D
5.05
D1
4.80
D2
3.56
D3
1.32
D4
D5
E
6.05
E1
5.79
E2 (for AL product)
3.30
E2 (for other product)
3.48
E3
3.68
E4 (for AL product)
E4 (for other product)
e
K (for AL product)
K (for other product)
K1
0.56
H
0.51
L
0.51
L1
0.06
0
W
0.15
M
ECN: C13-0702-Rev. K, 20-May-13
DWG: 5881
Revison: 20-May-13
D2
INCHES
NOM.
MAX.
MIN.
NOM.
MAX.
1.04
0.41
0.28
5.15
4.90
3.76
1.50
0.57 typ.
3.98 typ.
6.15
5.89
3.48
3.66
3.78
0.58 typ.
0.75 typ.
1.27 BSC
1.45 typ.
1.27 typ.
0.61
0.61
0.13
0.25
0.125 typ.
1.12
0.05
0.51
0.33
5.26
5.00
3.91
1.68
0.038
0
0.013
0.009
0.199
0.189
0.140
0.052
0.044
0.002
0.020
0.013
0.207
0.197
0.154
0.066
6.25
5.99
3.66
3.84
3.91
0.238
0.228
0.130
0.137
0.145
0.71
0.71
0.20
12
0.36
0.022
0.020
0.020
0.002
0
0.006
0.041
0.016
0.011
0.203
0.193
0.148
0.059
0.0225 typ.
0.157 typ.
0.242
0.232
0.137
0.144
0.149
0.023 typ.
0.030 typ.
0.050 BSC
0.057 typ.
0.050 typ.
0.024
0.024
0.005
0.010
0.005 typ.
0.246
0.236
0.144
0.151
0.154
0.028
0.028
0.008
12
0.014
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY SILICONIX
www.vishay.com
Power MOSFETs
Standard SO-8
PowerPAK SO-8
Fig. 2
Fig. 1
Revision: 16-Mai-13
APPLICATION NOTE
This land pattern can be extended to the left, right, and top
of the drawn pattern. This extension will serve to increase
the heat dissipation by decreasing the thermal resistance
from the foot of the PowerPAK to the PC board and
therefore to the ambient. Note that increasing the drain land
area beyond a certain point will yield little decrease
in foot-to-board and foot-to-ambient thermal resistance.
Under specific conditions of board configuration, copper
weight and layer stack, experiments have found that
more than about 0.25 in2 to 0.5 in2 of additional copper
(in addition to the drain land) will yield little improvement in
thermal performance.
Vishay Siliconix
For
the
lead
(Pb)-free
www.vishay.com/doc?73257.
solder
profile,
see
REFLOW SOLDERING
Ramp-Up Rate
+ 3 C /s max.
120 s max.
60 - 150 s
Maximum Temperature
255 + 5/- 0 C
Time at Maximum
Temperature
30 s
Ramp-Down Rate
+ 6 C/s max.
30 s
260 C
3 C(max)
6 C/s (max.)
217 C
150 - 200 C
APPLICATION NOTE
150 s (max.)
60 s (min.)
Pre-Heating Zone
Reflow Zone
Revision: 16-Mai-13
Vishay Siliconix
Thermal
Resistance RthJC
DPAK
PowerPAK
SO-8
Standard
SO-8
1.2 C/W
1 C/W
16 C/W
60
Impedance (C/watts)
APPLICATION NOTE
50
40
Si4874DY
30
51
46
100 %
41
Si7446DP
0%
20
50 %
36
10
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
0.01
100
10000
Vishay Siliconix
1.8
VGS = 10 V
ID = 23 A
1.6
1.2
1.0
CONCLUSIONS
1.4
0.8
0.6
- 50
- 25
25
50
75
100
125
150
PowerPAK SO-8
APPLICATION NOTE
Standard SO-8
107 C
0.8 C/W
148 C
16 C/W
PC Board at 105 C
0.260
(6.61)
0.150
(3.81)
0.050
0.174
(4.42)
0.154
(1.27)
0.026
(0.66)
(3.91)
0.024
(0.61)
0.050
0.032
0.040
(1.27)
(0.82)
(1.02)
APPLICATION NOTE
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15
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
Vishay), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishays knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customers responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customers
technical experts. Product specifications do not expand or otherwise modify Vishays terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Revision: 02-Oct-12