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Institute for Biomaterials Research & Development, Kyungpook National University, Daegu, South Korea
Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, Peoples Republic of China
Department of Dental Biomaterials, College of Dentistry, Kyungpook National University, Daegu, South Korea
Department of Biomedical Engineering, University of Tennessee Health Science Center, Memphis, Tennessee
Abstract: Hydroxyapatite (HA) coatings were deposited on titanium substrates by electrophoretic deposition (EPD) at constant voltage and dynamic voltage, respectively. Various
surface morphologies were observed under different type of voltages. Under a constant voltage
of 20 V, a dense HA coating could be prepared. Under a constant voltage of 200 V, big HA
particles were deposited and the coating was porous. Under a dynamic voltage, a continuous
gradient HA coating could be obtained. HA coatings were characterized with a eld emissionscanning electron microscopy (FE-SEM) and an X-ray diffraction (XRD). XRD indicated no
signicant HA decomposition when the coatings were sintered for 2 h at 800C. 2005 Wiley
Periodicals, Inc. J Biomed Mater Res Part B: Appl Biomater 78B: 373377, 2006
Keywords:
INTRODUCTION
Hydroxyapatite (HA) coatings contribute excellent biocompatibility to implants, while titanium substrates provide favorable mechanical properties to the entire implant.15 To
obtain the maximum benet from such coatings, it is necessary to control the composition, thickness, and microstructures of the deposited HA layers.6 Among alternative coating
techniques, there is a growing interest in electrophoretic
deposition (EPD). EPD presents several advantages such as
ability to control thickness and morphology of the deposited
layer by controlling the electrochemical parameters, ability to
deposit relatively uniform coatings on complex shapes, a
higher deposition rate as compared with most coating process, and the low cost to purchase the equipment.7
The EPD process involves the migration and coagulation
of ceramic particles included in the suspension on the electrode surface by an impressing electric eld.8 Positively
charged particles undergo cataphoresis (deposition on the
cathode), whereas negatively charged particles undergo anophoresis (deposition on the anode).9 Parameters that determine the characteristics of this process are those related to the
suspension and the process, including physical parameters
such as the electrical nature of the electrodes and the electrical conditions (voltage/intensity relationship, deposition
times, etc.).10 Suspension for EPD is a complex system in
which each component has a substantial effect on EPD efciency.11 Once a well-dispersed suspension is prepared, the
applied voltage becomes a critical parameter.
The purpose of this study was to evaluate the effect of
applied voltages on HA coatings, by EPD process. By adjusting applied voltage, we could obtain HA coatings with
different microstructures.
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MENG ET AL.
sions was 0.1%. Polyvinyl alcohol (3%) and N,N-dimethylfrmamide (DMF) (10%) were added to the suspension for
adherence, strength, and crack-proof improvement.
Electrophoretic Deposition
s1. The generator tension is 40.0 kV, and the current is 30.0
mA. At least 5 samples were prepared for measurements, 4
samples for FE-SEM, and 3 for XRD.
RESULTS
Figure 1 shows the surface morphology of the HA coatings
deposited by EPD. Figure 1(a,b) is the representative surface
morphology of coatings deposited at a constant voltage of 20
and 200 V for 10 min, respectively. The HA coatings, obtained at a constant voltage of 20 V, were found to consist of
ne HA particles (150 200 nm in size), with a few large
particles sprinkled on these ne particles. The surface was
found to be uniform. For coatings prepared at a constant
voltage of 200 V, bigger particles (above 400 nm) were
observed. In addition to the big particles, surface porosities
greater than 500 nm in size were also noticed. Figure 1(c)
shows the representative surface morphology of coatings
deposited at dynamic voltage ranging from 0 to 200 V. The
HA coating obtained by dynamic voltage was observed to
consist of 300 400 nm particles and are uniform.
As shown in Figure 2(a c), continuously gradient coatings
were produced by applying dynamic voltage during EPD.
The coating layer closest to the substrate was found to be
dense, whereas the outer layer was found to be porous.
Figure 3 shows the microstructure of the coatings deposited at a constant voltage of 20 and 200 V, and a dynamic
Journal of Biomedical Materials Research Part B: Applied Biomaterials
DOI 10.1002/jbmb
HA COATING OF Ti BY EPD
375
Figure 2. Surface morphology of the coating prepared by the dynamic voltage: (a) is the intermediate
coating nished the rst step, (b) is the intermediate coating nished the second step, (c) is the nal
coating. The magnication is 50,000.
DISCUSSION
Among other variables, during EPD, the electrophoretic velocity () is reported to be related to the applied voltage and
particle size, governed by the following equation:12
QE/4 r
(1)
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MENG ET AL.
Figure 3. Surface morphology by FE-SEM of sintered HA coatings at 800C, obtained by: (a) constant
voltage 20 V, (b) constant voltage 200 V, and (c) dynamic voltage 0 200 V. The magnication is
2000.
CONCLUSIONS
Various microstructures of HA coatings on Ti can be prepared by EPD, using constant applied voltage and dynamic
applied voltage. The HA coating prepared at a constant low
voltage of 20 V consisted of ne HA particles and was dense.
The HA coating prepared at a constant high voltage of 200 V
consisted of big HA particles and was porous. The HA
Journal of Biomedical Materials Research Part B: Applied Biomaterials
DOI 10.1002/jbmb
HA COATING OF Ti BY EPD
coating prepared at a dynamic voltage consisted of continuously gradient particles, with small particles building up the
inner layer while bigger particles forming the outer layer. The
deposits prepared using a dynamic voltage followed by sintering at 800C turned out a high packing of the HA particles.
In addition, coatings retained HA structure after sintering.
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