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Copper Wirebond

Technology
Overview

HIGHLIGHTS
STATS ChipPAC is ready to engage on all wirebond
package types and in all manufacturing locations
QFN, FBGA, FBGA-SD, PBGA, PBGA-H, QFP and
TSOP package types supported
Full turnkey services available
Advanced design rules supported for bond pad
opening (BPO), bond pad pitch (BPP), stacked die
and die-to-die bonding
Advanced assembly processes and materials
including 0.6 mil Cu wire under development
Assembly yields with Pd-coated Cu wire comparable
to Au at >99.9%
Over 450 million units shipped

DESCRIPTION

COST BENEFITS

Copper wire is increasingly becoming the material of choice for


interconnection in wirebond packages. While copper has been used in the
industry as an interconnect material for many years, recent increases in the
price of gold wire have driven a rapid shift away from gold to copper as an
attractive alternative to achieve significant package cost savings. Copper
wire provides similar electrical characteristics and performance to gold wire,
however, it also offers lower resistivity which can be a benefit where lower
bond wire resistance is needed for device performance.

Copper wire offers significant cost savings over gold wire and
a hedge against continued increases in gold prices

Best Value BOM (BVB) available for each package for the most
cost-effective copper wirebond solution

100%

Approximate Copper vs Gold Wire Cost Savings


(Au @ $1250USD/oz)

STATS ChipPAC offers copper wirebond solutions in a wide range of leaded


and laminate packages across all its manufacturing sites.

90%
80%

COPPER WIREBOND CONSIDERATIONS

70%
60%
0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

Wire Diameter

PALLADIUM-COATED COPPER WIRE


Palladium-coated copper wire (Pd-Cu)
recommended for all applications, fab nodes
and development programs

Provides enhanced reliability

Improves corrosion resistance

With significant experience in copper wire conversions, STATS ChipPAC


understands the requirements for successful copper wirebonding. While
the customers existing structure can be successfully utilized in many cases,
STATS ChipPAC recommends the following ideal guidelines:

Thicker aluminum pad (>0.8mm, ideally >1.0mm)

Thick barrier metal layer under pad (Ti or W)

0.4mm larger bond pad vs Au to allow for metal splash
Consult STATS ChipPAC for a review of your design for copper wirebond
readiness at salescontact@statschippac.com.

Pd concentration
(EPMA = Electron Probe Micro Analyzer)

www.statschippac.com

Copper Wirebond
PACKAGE SUPPORT BY SITE

SPECIFICATIONS
Standard Wire Diameter 20mm / 0.8mil
Optional Wire Diameter 18mm / 0.7mil - 50mm / 2.0mil

FBGA
FBGA_SD
PBGA
PBGA-H
QFN
QFNs-st
QFP
TSOP

Contact STATS ChipPAC for site-specific availability


Pd-coated Cu wire recommended

Wafer Nodes

>90nm; non-Low-K, Low-K


90 - 40/45nm; Low-K, Extra Low-K
Both CUP and non-CUP devices

CUP Support

Data

COPPER WIRE CHARACTERISTICS

China

Korea

Malaysia Thailand Singapore

Wire Material

Melting Point
(Deg, oC)

Thermal Cond
(W/m-c)

Electrical Resistance
(ohm-m)

Youngs Modulus
(Gpa)

Tensile Strength
(Mpa)

Hardness @ Ball
(Hv)

Gold (Au)
Copper (Cu)
Pd Coated Copper

1064
1083
1083

315
393
393

2.33x10 -8
1.72 x 10-8
1.80 x 10-8

80
120
120

240
290
290

60-80
80 90
85 95

R Wire / mm (mOhms / mm)


Bondwire
Diameter

Frequency
DC

Frequency 10
MHz

Frequency 25
MHz

0.8 mil
1.0 mil
1.3 mil

72.49
46.48
27.61

72.75
46.77
27.94

73.29
47.44
28.86

Frequency 75 Frequency 500


MHz
MHz
76.08
51.33
34.39

129.37
101.52
76.53

Frequency 1
GHz

Frequency 10
GHz

L Wire
(nH / mm)

C Wire
(pF/mm)

175.50
138.06
105.16

518.58
416.80
324.29

0.82
0.78
0.73

0.06
0.06
0.06

Frequency 1
GHz

Frequency 10
GHz

L Wire
(nH / mm)

C Wire
(pF/mm)

152.55
120.56
92.24

456.54
367.86
287.11

0.82
0.78
0.73

0.06
0.06
0.06

Frequency 1
GHz

Frequency 10
GHz

L Wire
(nH / mm)

C Wire
(pF/mm)

149.06
117.88
90.26

447.20
360.31
281.37

0.82
0.78
0.73

0.06
0.06
0.06

Pd-coated Copper (Conductivity = 5.55 x 10^7 siemens / meter; R Wire / mm (mOhms / mm)
Bondwire
Diameter

Frequency
DC

Frequency 10
MHz

Frequency 25
MHz

0.8 mil
1.0 mil
1.3 mil

56.04
35.95
21.38

56.32
36.26
21.75

56.92
37.04
22.84

Frequency 75 Frequency 500


MHz
MHz
60.31
41.71
29.13

112.46
88.20
66.85

Copper (Conductivity = 5.8 x 10^7 siemens / meter)


Bondwire
Diameter

Frequency
DC

Frequency 10
MHz

Frequency 25
MHz

0.8 mil
1.0 mil
1.3 mil

53.68
34.45
20.48

53.96
34.76
20.86

54.58
35.56
21.98

Frequency 75 Frequency 500


MHz
MHz
58.08
40.36
28.38

109.84
86.17
65.37

RELIABILITY
Item

MRT MSL3

MRT MSL2aA

mHAST

PCT

TCC

HTST

Condition

30C / 60%
192hrs / 260C

85C / 85%
8 hrs / 260C

130C / 85% RH
after MSL3, 168 hrs

121C / 100% RH
after MSL3, 168 hrs

-65C~150C
after MSL3, 1000 cycles

150C
w/o Precon, 1000 hrs

CONTACT US
For more information about STATS ChipPACs copper wirebond services, contact us at salescontact@statschippac.com.

Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
Global Offices
USA 510-979-8000
JAPAN 81-3-3507-5676
CHINA 86-21-5976-5858
MALAYSIA 603-4257-6222
KOREA 82-31-639-8911
TAIWAN 886-3-593-6565
SWITZERLAND 41-22-929-5658
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. Trademark registered in United States. Singapore company registration number 199407932D. All other product names and other company names herein are for identification purposes
only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such
information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right
to change the information at any time and without notice.
Copyright 2011. STATS ChipPAC Ltd. All rights reserved.
August 2011