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SMD ASSEMBLY
INPUTS PROCESS STEP OUPUTS
Board Handling (Loading)
JOT Magazine Loader Bare PCB Panel
Unload one panel at a time to the Screen
Bare PCB Panel
Printer
Operator
Solder Paste Printing
MPM AP25 HiE Stencil Printer
Solder Paste Printing Parameters
Screen Printer Operator PCB with Printed Solder Paste
Bare PCB Panel Stencil contaminated with Solder Paste
Print Solder Paste on PCB
Electroformed Stencil Squeegee Blades contaminated with Solder Paste
Stainless Steel Squeegee Blades Reject Solder Paste
MP100 Solder Paste
Inspector
MPM Paste Inspection
MPM AP25 Camera System PCB Panel with correct amount of solder paste
PCB with Solder Paste Inspect the PCB and accept or reject the
print process based on 70% coverage
Operator area
Component Placement
Siemens HS50 Placement System
PCB with printed Solder Paste
Component Feeders
Components on Tape and Reels Automatically Place Components on the
PCB with Printed Solder Paste and Components
Components on Trays (optional) PCBs
Hand Placeable Components
Operator (Hand Placement)
Operator (Reel Changing)
Reflow Soldering
ERSA or BTU Reflow Soldering System (or equivalent)
Inspector PCB with Soldered Components
PCB with Printed Solder Paste and Components PCBs with paste flux residues
Components are soldered to the PCB in
Optimum Reflow Soldering Profile specific to a product a Reflow Oven
PROCESS MAP
SMD ASSEMBLY