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Institute for Nano Quantum Information Electronics, University of Tokyo, 4-6-1 Komaba, Meguro,
Tokyo 153-8505, Japan
2
Institute of Industrial Science, University of Tokyo, 4-6-1 Komaba, Meguro, Tokyo 153-8505, Japan
(Received 2 February 2012; accepted 23 April 2012; published online 8 May 2012)
Thin-film InAs/GaAs quantum dot (QD) solar cells on mechanically flexible plastic films are
fabricated. A 4.1-lm-thick compound semiconductor photovoltaic layer grown on a GaAs
substrate is transferred onto a plastic film through a low-temperature bonding technique. We also
fabricate thin-film InAs/GaAs quantum dot solar cells on Si substrates, as alternative low-cost,
lightweight, robust substrates. The open-circuit voltages of the thin-film cells on plastic and Si
substrates are equal to that of the as-grown bulk cell on a GaAs substrate, indicating that no
C 2012 American Institute of
material degradation occurs during our bond-and-transfer process. V
Physics. [http://dx.doi.org/10.1063/1.4712597]
Photovoltaic solar cells with semiconductor quantum
dots (QDs) can potentially realize ultrahigh-efficiency solarenergy conversion in single p-n junction structures utilizing
intermediate-level energy bands.1 Among the wide range of
semiconductor materials for QD solar cells currently under
intensive study,2 those using III-V semiconductor compound
InAs/GaAs QDs (i.e., InAs QDs embedded in GaAs matrices) have exhibited the highest efficiencies and robustness.3
However, expensive, heavy, thick, and solid GaAs wafers
have been used as the growth substrates for these QD cells,
hindering their commercialization. Solar-cell modules with
low-cost, lightweight, flexible support substrates are of particular interest for a number of practical applications.4 For
flexible-solar-cell production, the direct growth of photovoltaic semiconductor thin films on plastic films or metallic foils
as substrates would be the most desirable approach. Crystalline semiconductor materials, however, cannot be grown on
noncrystalline substrates; and therefore, this direct growth
scheme would inevitably result in poor-performance amorphous cells. Instead, crystalline cells on such noncrystalline
substrates can be prepared by transferring photovoltaic semiconductor layers grown in advance on proper crystalline substrates onto noncrystalline substrates.58
In this work, we fabricated thin-film InAs/GaAs QD solar cells on flexible plastic film substrates by layer transfer.
A 4.1-lm-thick compound semiconductor photovoltaic layer
was grown on a GaAs substrate, and then transferred onto a
plastic film through a bonding technique. Our bonding
scheme is mediated by a metalepoxy agent for the realization of bonding at low temperatures (below 200 C), enabling
the use of plastic materials as support substrates, as well as
preventing the degradation of the semiconductor photovoltaic layers including QDs. We also fabricated thin-film InAs/
GaAs QD solar cells on Si substrates, as alternative inexpensive, lightweight, robust substrates, using the same layertransfer scheme. Thus, we have demonstrated the validity of
this scheme for the formation of thin-film photovoltaics on
any kind of support plate or film with no degradation of the
semiconductor layers.
a)
E-mail: tanabe@iis.u-tokyo.ac.jp.
0003-6951/2012/100(19)/192102/4/$30.00
Figure 1 shows a schematic flow diagram of our fabrication process for thin-film InAs/GaAs QD solar cells on plastic films. The InAs/GaAs QD solar-cell structure was a p-i-n
GaAs/Al0.4Ga0.6As double heterostructure with a 440-nmthick i-GaAs layer embedding ten layers of self-assembled
InAs QDs. This cell structure was grown inversely as p-on-n
on a GaAs (100) substrate by molecular beam epitaxy with
an Al0.7Ga0.3As etch-stop layer immediately above the GaAs
substrate. This results in an n-on-p configuration in the final
transferred cell structure. Figure 2(a) shows an atomic force
microscope image of the as-grown InAs QDs, which are
seen to be uniformly sized, coalescence-free, high-density
(3.9 1010 cm2) QDs. The sizes of the InAs QDs were
observed as roughly 30 nm in diameter and 10 nm in height.
Figure 2(b) shows a photoluminescence spectrum from the
as-grown inverted cell structure. The photoluminescence
measurement was conducted at room temperature using a
640-nm-wavelength continuous-wave semiconductor laser
diode as the excitation source. The pump laser beam irradiated the sample surface with a spot size of 100 lm and a
power of 3 mW. The photoluminescence spectrum shown
in Figure 2(b) exhibits a peak associated with the groundstate emission of the InAs QDs at 1.28 lm with a full-width
at half-maximum of 25.1 meV.
Next, the QD solar-cell structure was layer-transferred
onto a plastic film through wafer bonding and subsequent removal of the GaAs growth substrate. We used a 130-lmthick polyimide film as the support substrate. A 30-nm-thick
AuGeNi alloy (80:10:10 wt. %) layer followed by a 150-nmthick Au layer were first deposited by electron-beam evaporation onto the bonding surfaces of both the QD cell structure
and the plastic film. In this work, we adopted an epoxy agent
containing Ag nanoparticle clusters to enable electrical contact as well as bonding at low temperatures, in order to avoid
degradation of the bonded materials, particularly the plastic
films. The diced cell wafer piece and plastic film were
brought into contact via the Agepoxy agent and annealed at
150200 C in ambient air for 1 h, with no pressure applied.
No significant difference in cell performance according to
bonding temperature was observed between 150 and 200 C,
except for a slightly higher degree of buckling of the plastic
100, 192102-1
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192102-2
FIG. 2. (a) Atomic force microscope image and (b) room-temperature photoluminescence spectrum of the InAs QDs grown in the InAs/GaAs QD
solar-cell structure.
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192102-3
FIG. 3. (a) Cross-sectional schematic diagram, (b) scanning electron microscope image, and (c) photographs of the fabricated thin-film InAs/GaAs QD
solar cells on plastic films. Inset of (b) is a cross-sectional tunneling electron
microscope image of the InAs QD layers.
10.5%
0.64 V
23.5 mA cm2
0.70
0.673 V
8.45%
0.57 V
24.5 mA cm2
0.61
0.664 V
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192102-4
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