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EE
GEN FR
ALO
Supervisory Circuits with I2C Serial 2k-bit CMOS EEPROM, Manual Reset
and Watchdog Timer
LE
A D F R E ETM
FEATURES
Precision power supply voltage monitor
WP pin (CAT1021)
1,000,000 Program/Erase cycles
Watchdog timer
400kHz I C bus
3.0V to 5.5V operation
Low power CMOS technology
(3 x 3 mm foot-print) packages
TDFN max height is 0.8mm
Industrial and extended temperature ranges
DESCRIPTION
The CAT1021, CAT1022 and CAT1023 are complete
memory and supervisory solutions for microcontrollerbased systems. A 2k-bit serial EEPROM memory and a
system power supervisor with brown-out protection are
integrated together in low power CMOS technology.
Memory interface is via a 400kHz I2C bus.
BLOCK DIAGRAM
EXTERNAL LOAD
SENSE AMPS
SHIFT REGISTERS
DOUT
ACK
VCC
WORD ADDRESS
BUFFERS
VSS
SDA
COLUMN
DECODERS
START/STOP
LOGIC
-45
4.50
4.75
-42
4.25
4.50
-30
3.00
3.15
-28
2.85
3.00
-25
2.55
2.70
2kbit
EEPROM
XDEC
CONTROL
LOGIC
WP
(CAT1021)
DATA IN STORAGE
HIGH VOLTAGE/
TIMING CONTROL
RESET Controller
Precision
MR
Vcc Monitor
RESET
(CAT1021/23)
RESET
STATE COUNTERS
SCL
SLAVE
ADDRESS
COMPARATORS
WDI
(CAT1023)
PIN CONFIGURATION
DIP Package (P, L)
SOIC Package (J, W)
TSSOP Package (U, Y)
MSOP Package (R, Z)
MR 1
RESET 2
WP 3
8 VCC
CAT1021 7 RESET
6 SCL
5 SDA
VSS 4
(Bottom View)
TDFN Package: 3mm x 3mm
0.8mm maximum height - (RD4, ZD4)
VCC
MR
RESET
RESET
SCL
WP
SDA
VSS
CAT1021
8 VCC
7 NC
VCC
NC
RESET
NC 3
6 SCL
SCL
NC
VSS 4
5 SDA
SDA
VSS
MR 1
8 VCC
7 WDI
MR 1
RESET 2
RESET 2
CAT1022
CAT1023
RESET 3
VSS 4
CAT1022
VCC 8
1 MR
WDI 7
6 SCL
SCL 6
5 SDA
SDA 5
MR
2 RESET
CAT1023
3 RESET
4 V
SS
Maximum
Threshold
PIN DESCRIPTION
RESET/RESET
RESET: RESET OUTPUTS
RESET
(RESET CAT1021/23 Only)
These are open drain pins and RESET can be used as a
manual reset trigger input. By forcing a reset condition on
the pin the device will initiate and maintain a reset condition.
The RESET pin must be connected through a pull-down
resistor, and the RESET pin must be connected through a
pull-up resistor.
SDA: SERIAL DATA ADDRESS
The bidirectional serial data/address pin is used to transfer
all data into and out of the device. The SDA pin is an open
drain output and can be wire-ORed with other open drain
or open collector outputs.
SCL: SERIAL CLOCK
Serial clock input.
MR:
MANUAL RESET INPUT
Manual Reset input is a debounced input that can be
connected to an external source for Manual Reset.
Pulling the MR input low will generate a Reset condition.
Reset outputs are active while MR input is low and for
the reset timeout period after MR returns to high. The
input has an internal pull up resistor.
WP (CAT1021 Only): WRITE PROTECT INPUT
When WP input is tied to VSS or left unconnected write
operations to the entire array are allowed. When tied to
VCC, the entire array is protected. This input has an
internal pull down resistor.
WDI (CAT1023 Only): WATCHDOG TIMER INTERRUPT
Watchdog Timer Interrupt Input is used to reset the
watchdog timer. If a transition from high to low or low to
high does not occur every 1.6 seconds, the RESET
outputs will be driven active.
PIN FUNCTIONS
Pin Name
Function
Industrial
-40C to 85C
NC
No Connect
Extended
-40C to 125C
Independent
Auxiliary
Voltage Sense
RESET: Active
High and LOW
RESET
VSS
Ground
SDA
Serial Data/Address
SCL
Clock Input
RESET
VCC
Power Supply
WP
MR
WDI
Manual
Reset
Input Pin
Watchdog
Watchdog
Monitor
Pin
Write
Protection
Pin
EEPROM
CAT1021
SDA
2k
CAT1022
SDA
2k
CAT1023
WDI
2k
CAT1024
2k
CAT1025
2k
CAT1026
2k
CAT1027
WDI
2k
For supervisory circuits with embedded 16k EEPROM, please refer to the CAT1161, CAT1162 and CAT1163
data sheets.
3
Note:
(1) The minimum DC input voltage is 0.5V. During transitions,
inputs may undershoot to
2.0V for periods of less than 20 ns. Maximum DC voltage on
output pins is VCC +0.5V, which may overshoot to VCC +2.0V
for periods of less than 20 ns.
(2) Output shorted for no more than one second. No more than
one output shorted at a time.
DC OPERATING CHARACTERISTICS
VCC = 3.0V to 5.5V and over the recommended temperature conditions unless otherwise specified.
Symbol
Parameter
Test Conditions
Min
ILI
ILO
ICC1
ICC2
Max
Units
-2
10
-10
10
mA
mA
ISB
Standby Current
Vcc = 5.5 V,
VIN = GND or Vcc
60
VIL(1)
-0.5
0.3 x Vcc
VIH(1)
0.7 x Vcc
Vcc + 0.5
VOL
IOL = 3 mA
VCC = 2.7 V
0.4
VOH
IOH = -0.4 mA
VCC = 2.7 V
Vcc 0.75
CAT102x-45
(VCC = 5.0 V)
4.50
4.75
CAT102x-42
(VCC = 5.0 V)
4.25
4.50
CAT102x-30
(VCC = 3.3 V)
3.00
3.15
CAT102x-28
(VCC = 3.3 V)
2.85
3.00
CAT102x-25
(VCC = 3.0 V)
2.55
2.70
Reset Threshold
VTH
Typ
VRVALID
1.00
VRT(2)
15
mV
Notes:
1. VIL min and VIH max are reference values only and are not tested.
2. This parameter is tested initially and after a design or process change that affects the parameter. Not 100% tested.
CAPACITANCE
TA = 25C, f = 1.0 MHz, VCC = 5V
Symbol
COUT
(1)
CIN(1)
Test
Test Conditions
Max
Units
VOUT = 0V
pF
VIN = 0V
pF
Output Capacitance
Input Capacitance
AC CHARACTERISTICS
VCC = 3.0 V to 5.5 V and over the recommended temperature conditions, unless otherwise specified.
Parameter
fSCL
Min
Max
Units
Clock Frequency
400
kHz
tSP
100
ns
tLOW
1.3
tHIGH
0.6
tR(1)
300
ns
tF(1)
300
ns
tHD;STA
0.6
tSU;STA
0.6
tHD;DAT
ns
tSU;DAT
100
ns
tSU;STO
0.6
tAA
tDH
50
ns
tBUF(1)
1.3
tWC(3)
900
ns
ms
Notes:
1. This parameter is characterized initially and after a design or process change that affects the parameter. Not 100% tested.
2. Test Conditions according to AC Test Conditions table.
3. The write cycle time is the time from a valid stop condition of a write sequence to the end of the internal program/erase cycle. During the
write cycle, the bus interface circuits are disabled, SDA is allowed to remain high and the device does not respond to its slave address.
Parameter
Test
Conditions
Min
Typ
Max
Units
tPURST
Reset Timeout
Note 2
130
200
270
ms
tRPD
Note 3
tGLITCH
Note 4, 5
30
ns
MR Glitch
Note 1
100
ns
tMRW
MR Pulse Width
Note 1
tMRD
Note 1
tWD
Watchdog Timeout
Note 1
1.0
Test
Conditions
Min
s
1
1.6
2.3
sec
Typ
Max
Units
POWER-UP TIMING5,6
Symbol
Parameter
tPUR
270
ms
tPUW
270
ms
AC TEST CONDITIONS
Parameter
Test Conditions
10 ns
0.5 VCC
Output Load
RELIABILITY CHARACTERISTICS
Symbol
Parameter
NEND(5)
Endurance
Data Retention
100
Years
VZAP(5)
ESD Susceptibility
2000
Volts
ILTH(5)(7)
Latch-Up
JEDEC Standard 17
100
mA
TDR
(5)
Min
Max
Units
Cycles/Byte
Notes:
1. Test Conditions according to AC Test Conditions table.
2. Power-up, Input Reference Voltage VCC = VTH, Reset Output Reference Voltage and Load according to AC Test Conditions Table
3. Power-Down, Input Reference Voltage VCC = VTH, Reset Output Reference Voltage and Load according to AC Test Conditions Table
4. VCC Glitch Reference Voltage = VTHmin; Based on characterization data
5. This parameter is characterized initially and after a design or process change that affects the parameter. Not 100% tested.
6. tPUR and tPUW are the delays required from the time VCC is stable until the specified memory operation can be initiated.
7. Latch-up protection is provided for stresses up to 100 mA on input and output pins from -1 V to VCC + 1 V.
DEVICE OPERATION
Reset Controller Description
The CAT1021/22/23 precision RESET controllers ensure
correct system operation during brownout and power
up/down conditions. They are configured with open
drain RESET outputs.
Watchdog Timer
The Watchdog Timer provides an independent protection
for microcontrollers. During a system failure, CAT1021/
22/23 devices will provide a reset signal after a time-out
interval of 1.6 seconds for a lack of activity. The CAT1023
is designed with the Watchdog timer feature on the WDI
pin. The CAT1021 and CAT1022 monitor the SDA line. If
WDI or SDA does not toggle within a 1.6 second interval,
the reset condition will be generated on the reset outputs.
The watchdog timer is cleared by any transition on a
monitored line.
GLITCH
VTH
VRVALID
t PURST
VCC
t RPD
t PURST
RESET
RESET
t MRW
MR
t MRD
t PURST
RESET
RESET
t RPD
STOP Condition
A LOW to HIGH transition of SDA when SCL is HIGH
determines the STOP condition. All operations must end
with a STOP condition.
DEVICE ADDRESSING
The Master begins a transmission by sending a START
condition. The Master sends the address of the particular
slave device it is requesting. The four most significant
bits of the 8-bit slave address are programmable in metal
and the default is 1010.
START Condition
The START Condition precedes all commands to the
device, and is defined as a HIGH to LOW transition of
tHIGH
tLOW
tR
tLOW
SCL
tSU:STA
tHD:STA
tHD:DAT
tSU:DAT
tSU:STO
SDA IN
tAA
tBUF
tDH
SDA OUT
SCL
SDA
8TH BIT
BYTE n
ACK
tWR
STOP
CONDITION
START
CONDITION
ADDRESS
ACKNOWLEDGE
WRITE OPERATIONS
Byte Write
In the Byte Write mode, the Master device sends the
START condition and the slave address information (with
the R/W bit set to zero) to the Slave device. After the Slave
generates an acknowledge, the Master sends a 8-bit
address that is to be written into the address pointers of
the device. After receiving another acknowledge from the
Slave, the Master device transmits the data to be written
into the addressed memory location. The device
acknowledges once more and the Master generates the
STOP condition. At this time, the device begins an
internal programming cycle to non-volatile memory. While
the cycle is in progress, the device will not respond to any
request from the Master device.
SDA
SCL
START BIT
STOP BIT
DATA OUTPUT
FROM TRANSMITTER
DATA OUTPUT
FROM RECEIVER
ACKNOWLEDGE
START
10
R/W
BUS ACTIVITY:
MASTER
SDA LINE
S
T
A
R
T
SLAVE
ADDRESS
BYTE
ADDRESS
S
T
O
P
DATA
S
A
C
K
A
C
K
A
C
K
BUS ACTIVITY:
MASTER
SDA LINE
S
T
A
R
T
SLAVE
ADDRESS
BYTE
ADDRESS (n)
DATA n
S
T
DATA n+15 O
P
DATA n+1
P
A
C
K
A
C
K
A
C
K
11
A
C
K
A
C
K
Read Operations
The READ operation for the CAT1021/22/23 is initiated
in the same manner as the write operation with one
exception, the R/W bit is set to one. Three different
READ operations are possible: Immediate/Current
Address READ, Selective/Random READ and
Sequential READ.
BUS ACTIVITY:
MASTER
SDA LINE
S
T
A
R
T
S
T
O
P
SLAVE
ADDRESS
P
A
C
K
DATA
N
O
A
C
K
SCL
SDA
8TH BIT
DATA OUT
NO ACK
12
STOP
Sequential Read
Selective/Random Read
Selective/Random READ operations allow the Master
device to select at random any memory location for a
READ operation. The Master device first performs a
dummy write operation by sending the START condition,
slave address and byte addresses of the location it
wishes to read. After the CAT1021/22/23 acknowledges,
the Master device sends the START condition and the
slave address again, this time with the R/W bit set to one.
The CAT1021/22/23 then responds with its acknowledge
and sends the 8-bit byte requested. The master device
does not send an acknowledge but will generate a
STOP condition.
BUS ACTIVITY:
MASTER
SDA LINE
S
T
A
R
T
SLAVE
ADDRESS
S
T
A
R
T
BYTE
ADDRESS (n)
S
T
O
P
SLAVE
ADDRESS
A
C
K
A
C
K
A
C
K
DATA n
N
O
A
C
K
SLAVE
ADDRESS
DATA n
DATA n+1
DATA n+2
S
T
O
P
DATA n+x
SDA LINE
P
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
13
PACKAGE OUTLINES
8-LEAD 300 MIL WIDE PLASTIC DIP (P, L)
0.245 (6.17)
0.295 (7.49)
0.300 (7.62)
0.325 (8.26)
D
0.120 (3.05)
0.150 (3.81) 0.180 (4.57) MAX
0.015 (0.38)
0.110 (2.79)
0.150 (3.81)
0.100 (2.54)
BSC
0.310 (7.87)
0.380 (9.65)
0.045 (1.14)
0.060 (1.52)
0.014 (0.36)
0.022 (0.56)
Dimension D
Pkg
Min
Max
8L
0.355 (9.02)
0.400 (10.16)
Notes:
1. Complies with JEDEC Publication 95 MS001 dimensions; however, some of the dimensions may be more stringent.
2. All linear dimensions are in inches and parenthetically in millimeters.
14
0.1497 (3.80)
0.1574 (4.00)
0.2284 (5.80)
0.2440 (6.20)
D
0.0532 (1.35)
0.0688 (1.75)
0.050 (1.27) BSC
0.0040 (0.10)
0.0098 (0.25)
0.013 (0.33)
0.020 (0.51)
0.0099 (0.25)
X 45
0.0196 (0.50)
0.0075 (0.19)
0.0098 (0.25)
08
0.016 (0.40)
0.050 (1.27)
Dimension D
Pkg
Min
Max
8L
0.1890(4.80)
0.1968(5.00)
Notes:
1. Complies with JEDEC publication 95 MS-012 dimensions; however, some dimensions may be more stringent.
2. All linear dimensions are in inches and parenthetically in millimeters.
3. Lead coplanarity is 0.004" (0.102mm) maximum.
15
16
0.0150
0.0110
0.1970
0.1890
5.00
4.80
0.1220
0.1142
3.10
2.90
0.0374
0.0295
0.0059
0.0020
0.15
0.05
0.95
0.75
0.0150
0.0110
0.38
0.28
WITH PLATING
0.0276
0.0157
0.70
0.40
0.1220
0.1142
3.10
2.90
0.0091
0.0051
0.23
0.13
0.0050 [0.127]
0 - 6
WITH
PLATING
BASE METAL
0.0118 [0.30] REF.
SECTION A - A
Notes:
(1) All dimensions are in mm Angles in degrees.
2 Does not include Mold Flash, Protrusion or Gate Burrs. Mold Flash, Protrusions or Gate Burrs shall not exceed 0.15 mm. per side.
3 Does not include Interlead Flash orProtrusion. Interlead Flash or Protrusion shall not exceed 0.25 mm per side.
4 Does not include Dambar Protrusion, allowable Dambar Protrusion shall be 0.08 mm.
(5) This part is compliant with JEDEC Specification MO-187 Variations AA.
(6) Lead span/stand off height/coplanarity are considered as special characteristics. (S)
(7) Controlling dimensions in inches. [mm]
17
0.75 + 0.05
A
B
3.00 + 0.10
(S)
2X
1
3.00 + 0.10
(S)
0.15 C
2X
0.0 - 0.05
0.15 C
1.50 + 0.10
0.75 + 0.05
2.30 + 0.10
C0.35
0.25 min.
PIN 1 ID
1
0.30 + 0.07 (8x)
1.95 REF. (2x)
NOTE:
1. ALL DIMENSION ARE IN mm. ANGLES IN DEGREES.
2. COPLANARITY SHALL NOT EXCEED 0.08 mm.
3. WARPAGE SHALL NOT EXCEED 0.10 mm.
4. PACKAGE LENGTH / PACKAGE WIDTH ARE CONSIDERED AS SPECIAL CHARACTERISTIC(S)
5. REFER JEDEC MO-229 / WEEC
18
Ordering Information
Prefix
CAT
Optional
Company ID
Device #
Suffix
1021
Product
Number
1021: 2K
1022: 2K
1023: 2K
Temperature Range
I = Industrial (-40C to 85C)
E = Extended (-40C to +125C)
Package
P: PDIP
J: SOIC
R: MSOP
U: TSSOP
RD4: 8-pad TDFN (3x3mm)
L: PDIP (Lead free, Halogen free)
W: SOIC (Lead free, Halogen free)
Y: TSSOP (Lead free, Halogen free)
Z: MSOP (Lead free, Halogen free)
ZD4: TDFN 3x3mm (Lead free, Halogen free)
-30
TE13
Reset Threshold
Voltage
45: 4.5-4.75V
42: 4.25-4.5V
30: 3.0-3.15V
28: 2.85-3.0V
25: 2.55-2.7V
Note:
(1) The device used in the above example is a CAT1021JI-30TE13 (Supervisory circuit with I2C serial 2k CMOS EEPROM, SOIC, Industrial
Temperature, 3.0-3.15V Reset Threshold Voltage, Tape and Reel).
19
REVISION HISTORY
Date
Rev.
Reason
9/25/2003
11/7/2003
4/12/2004
11/1/2004
11/04/04
11/11/04
Update Features
Update Description
Updae DC Operating Characteristic
Update AC Characteristics
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS
PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or
other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a
situation where personal injury or death may occur.
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets
labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate
typical semiconductor applications and may not be complete.
Publication #:
Revison:
Issue date:
Type:
3009
K
11/11/04
Preliminary