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ABSTRACT
The preliminary design and analysis of a meso-scale refrigerator
is presented here. The device is to be designed out of layers of silicon
wafers bonded together and is to be fabricated through the techniques
of microelectronics. The intended application of the device is an
integrated heat removal system for electronics or photonic chips or
modules. The paper presents a functional decomposition of the entire
system, thermodynamic feasibility analysis, alternative configurations
for two of the functions: actuation and compression, and parametric
analysis for two alternative candidates for compressor actuation.
A set of reasonable design requirements is first formulated.
Overall function of the devices is decomposed into nine major subfunctions. Comparison of different alternatives for compression and
actuation suggests that electrostatic actuation integrated with
centrifugal compression is a viable option. Two different ways to
implement electrostatic actuation are considered in details: variable
capacitance motor and electrostatic induction motor. A set of design
relations and criteria needed to obtain the optimal design of each
motor is presented along with a discussion on relative effects of the
main design parameters.
INTRODUCTION
Advances in micro-fabrication capabilities over the last few
decades have ushered a new era in miniaturization of chemical,
environmental,
energy
and
other
engineering
systems.
THERMODYNAMIC ANALYSIS
There are several thermodynamic cycles that can be used for
refrigeration. Some of the possible alternatives are vapor compression
cycle, vapor absorption cycle, reverse Stirling cycle and reverse
Brayton cycle (Moran and Shapiro, 1992). The first two cycles involve
phase change whereas the last two do not. Hence, maintaining a
constant temperature at the evaporator would require a more active
control system for reverse Brayton or reverse Stirling cycle. For this
reason, in this first design iteration, these two cycles are not
considered further.
Vapor compression and vapor absorption cycles are quite similar
to each other. They both involve liquid-vapor phase transition,
evaporation, condensation and throttling. The primary difference is
that vapor compression cycle uses a compressor to convert lowpressure, low-temperature vapor from the evaporator into high
pressure and high temperature, superheated vapor. In a vapor
absorption cycle, vapor from evaporator is absorbed by another
substance, called an absorbent, to form a liquid solution, which is then
pumped to the higher pressure requiring much less work compared to
the compressor of the vapor compression cycle. However, at the
higher pressure the vapor has to be retrieved from the liquid solution,
and this is typically done by providing heat from a relatively hightemperature heat source, such as natural gas or similar fuel, or solar or
geothermal energy. This last feature of a vapor absorption cycle makes
this cycle quite unsuitable for integrated cooling systems for
electronics or photonics, even though this cycle requires less
mechanical work input. For this reason, only vapor compression cycle
is considered is this design process. Figure 1 presents a schematic
layout of a typical vapor compression system along with the associated
thermodynamic states on a T-s diagram.
It should be noted that designs of different components of the
overall system are linked together. However, in order to start
parametric design for each component, several ad hoc assumptions are
needed regarding performance parameters of other components. For
example, if a centrifugal compressor is used for compression, then
isentropic efficiency of the compressor will determine the mechanical
power output required out of the motor, and hence a reasonable value
has to be assumed first for the compressor in order to start design of
the motor. Eventually, these performance parameters have to be
calculated and verified when overall design is complete.
The following ad-hoc assumptions are made in subsequent
thermodynamic analysis.
No pressure drop in evaporator or condenser.
A minimum of 15oC temperature difference between
ambient air and condenser fluid. (This will require
forced convection with an integrated air circulation
system and the heat transfer surface to be enhanced
with microstructures.)
Compressible and expansion processes are adiabatic.
Compressor has isentropic efficiency of 78%.
Vapor at evaporator outlet is saturated and liquid at
condenser outlet is saturated.
DESIGN SPECIFICATIONS
The primary application for which the proposed demonstration
unit is to be designed and fabricated is for cooling of electronics under
hot ambient conditions where cooling without refrigeration is not
possible. For this purpose, the following thermal parameters were
decided.
Evaporating fluid temperature (Te):
12oC (should be held
constant)
Ambient temperature (Ta):
45oC
Cooling load (Qc):
32 W
Refrigerant:
R134a
It should be noted that the temperature of items to be cooled will
be higher than Te and fluid temperature in condenser will be higher
than Ta. R134a is selected as the refrigerant because it is one of the
most prevalent environment-friendly refrigerants.
Since the refrigerator is intended to be fabricated out of several
layers of silicon wafers and since 3 inch diameter wafers are the most
commonly available, the overall system diameter is limited to this size
in this first design iteration.
Outside diameter (D):
75 mm
This size poses a quite modest thermal load of only 0.73 W/cm2
on the evaporator surface. However, since a refrigeration system is
used, this amount of heat can be removed even when the ambient is at
a higher temperature than the desired cooled surface temperature. Heat
removal rate on the condenser rate depends on the coefficient of
Condenser
Expansion
Compressor
Valve
Evaporator
Temperature (T)
2
3
1
4
Actuation Sensing
Compression
Thermal Expansion
insulation
& Control
Evaporation
External
Electromagnetic Levitation
heat
Condensation
Piezo-electric
removal
Shape memory
Centrifugal
Electrostatic
Reciprocating
-VCM
Screw-type
-EIM
Sliding vane
-Linear Comb
Drive
1997): (1) electrostatic forces, (2) electromagnetic forces, (3) piezoelectric effect, and (4) shape memory effect.
Since compression of a vapor or a gas requires a relatively large
amount of mechanical power (within a small volume), such an
actuation unit must be able to provide a large torque and/or large speed
of actuation. For this reason, piezo-electric actuation (Inaba et. al,
1987) and SMA (shape memory alloy) based actuation (Kuribayashi,
1989) do not appear to be suitable for this meso-scale actuation unit,
and hence are not considered further. Moreover, it will be difficult to
incorporate SMA-based actuation within silicon-layer architecture.
Electromagnetic forces do not scale well as the length scale is
reduced, whereas electrostatic forces scale well (Trimmer and Gabriel,
1987). Moreover, an electromagnetic motor requires permanent and/or
electro-magnets, which makes the design complicated. For this reason,
attention is given to electrostatic actuation only at this time.
(c) Alternative Configurations for Compression
Since compression and actuation actions are to be integrated
together, the design for one will also affect the design for the other. In
practice, compression of a vapor or gas is typically achieved by one of
several different methods (Pichot, 1986): (1) centrifugal compressor,
(2) reciprocating compressor, (3) screw-type compressor, and (4)
sliding vane compressor.
The last three types are of the positive displacement type, which
requires a fixed torque that is independent of speed. The main
component in a screw-type compressor is a cylindrical element with
multiple helical grooves that run around the curved cylindrical surface
for the full length of the cylinder. Even though these machines have
LP & LT vapor
liquid mixture
Substrate
with integrated
evaporator
Compressor rotor
Compressor diffuser
Thermal
insulation
layer
Air gap
Fan for cooling air
with integrated
drive
Cooling
air inlet
Condenser layer with
integrated cooling air
and refrigerant ducts
Motor stator
Motor
rotor
Levitation
HP & HT
and bearing
vapor
Cooling
air
outlet
Expansion
valve
process of this rotation when the next set of rotor pads approach the
stator pads, the excitation to the stator pads is switched on again, as
shown in the plot of V vs t in Fig. 4. Thus, rotation and stator
excitation are synchronized in this type of actuation.
The dynamics of this motor can be expressed in terms of the
capacitance between a rotor pad and a stator pad, which is a linear
function of the overlap area between those two pads. Since the amount
of overlap varies with rotation, so does the stator-rotor capacitance.
Typically separation between two neighboring pads is same as the
width of any rotor pad. The stator-rotor capacitance has a saw-tooth
waveform as shown in Fig. 4.
From energy balance of this motor, total electrical power input
must be equal to the sum of mechanical power output and the rate of
increase of potential energy stored in the stator-rotor capacitance. This
energy balance (Ashraf, 1999) provides
1
dC
T = V 2
2
dt
t
T
Stator pad
Rotor pad
Rotor
(1)
Stator
M r 2 (R o2 R i2 )
P = r o
Vo
16
d
4.
(2)
T = r o
M r 2 R o2 R i2
Vo
16
d
(3)
where
= (2N / 60) = rotational angular speed,
r = dielectric constant for gap,
o = 8.85 x 10-12 F / m,
d = gap thickness,
Mr = number of rotor pads,
Ri = inner radius of rotor or stator pads, and
Ro = outer radius of rotor or stator pads
f e = nM s
Discrete
stator pads
(4)
where
fe = excitation frequency in Hz,
Ms = number of stator pads, and
n = number of phases.
Here,
Gs = Stator conductance per phase
Cs = Stator self-capacitance per phase
Cm = Mutual capacitance between the stator and the rotor per
phase
Gr = Rotor conductance per phase
s = Relative velocity of the stator potential wave and the
rotor motion, the slip.
Power delivered across the stator-rotor gap is dissipated in the
conductance Gr/s, which can be separated into two conductances as
shown in Fig. 6. The power dissipated in the conductance (1-s)Gr/s is
equivalent to the electrical power converted to the mechanical power.
Gs and Gr account for the power dissipated in the stator and in the
rotor respectively. All of the above circuit elements can be calculated
from the dimensions and material-properties of the motor. This model
has been used to study EIM performance and its dependencies on
different design parameters.
The output power is quite sensitive to the rotor conductivity. Very
low rotor-conductivity is desirable in the EIM. Conductivity of silicon
is strongly dependent on the deposition process, and is therefore hard
to control, particularly when low conductivities are desired. There are
several ways to reduce the effects of conductivity control. Increasing
the supply frequency can compensate for an increase in conductivity,
but the number of poles in the stator in that case needs to be increased.
Increasing the supply frequency is also limited by the capability of the
control circuitry. The gap between the stator and rotor should be as
small as possible to have high mutual capacitance allowing maximum
power-flow from the stator to the rotor. However, the electric field in
this short gap must be sustained by the chosen refrigerant. The
spinning stability of the rotor needs to be considered also.
CONCLUSION
This paper has explored the design of a meso-scale refrigerator to
be fabricated from layers of silicon wafers through techniques of
microelectronics fabrication. This miniature refrigerator is to be
designed for an application such as an integrated heat removal unit for
electronic or photonic modules. Admittedly, a robust design of the
integrated units of the refrigerator presents a considerable challenge to
all the disciplines involved.
A set of design requirements has been generated based on the
intended application. With consideration for the difficulty in design
and fabrication, the design objectives or requirements have been kept
quite modest in the first design iteration. A thermodynamic analysis
has performed and provided key design parameters for key
components.
Based on a functional decomposition, there are nine major
functions, each of which will provide a challenging design. Only two
of the functions, namely compression and actuation, are considered in
more details in this paper. For theses two functions, different
alternative configurations are compared. Based on this comparison,
electrostatic rotary actuation integrated to a centrifugal compressor is
selected as the most promising candidate and as the first configuration
to be looked at.
Two alternative electrostatic actuation schemes have been
considered for more detailed parametric analysis: VCM (variable
capacitance motor) and EIM (electrostatic induction motor). Design
relations and criteria of both alternatives have been presented. Based
on preliminary calculations, EIM cannot produce the requisite amount
of power at the design speed within the boundaries of design
limitations. Hence, VCM is the only option available for a rotary
electrostatic actuation unit, even though design and fabrication of a
VCM is more complicated. Possible control methodology for electric
excitation is also discussed.
REFERENCES
Ashraf, N, S., 1999, Design Considerations for a Meso-Scale
Heat Pump, MS Thesis, University of Central Florida, Orlando.
Ameel, T. A., R. O. Warrington, R. S. Wegeng, and M. K. Drost,
1996, Miniaturization Technologies Applied to Energy Systems, J.
Energy Conversion and Management, vol. 38, pp. 969-982.
Bart, S. F., and J. H. Lang, 1989, An Analysis of
Electroquasistatic Induction Micromotors," Sensors and Actuators,
vol. 20, pp. 97-106.
Inaba, R., A. Tokushima, O. Kawasaki, Y. Ise, and H. Yoneno,
1987, Piezoelectric Ultrasonic Motor, Proceedings of 1987 IEEE
Ultrasonics Symposium, IEEE press, pp. 747-756.
Japikse, D., 1996, Centrifugal Compressor
Performance, Concepts, ETI, Wilder, VT.
Design
and