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According to the Bohr's theory, free electrons in an isolated atom have certain definite discrete amount of
energy. If large number of atoms are brought close to one another to form a crystal, they begin to influence each
other. The valence electrons are attracted by the nucleus of the other atoms. This brings about a considerable
modification in the case of energy levels of the electrons in the outer shells. The process of splitting of energy
levels can be understood as follows:
a) If interatomic spacing of atoms is very large i.e., r = d>>a, there is no interatomic separation. Each atom in
the crystal behaves as free atom. Take for example silicon whose electronic configuration is 1s2 2s2 2p6 3s2 3p2.
If N atoms were to be considered in silicon crystal, then there will be 2N electrons filling 2N possible energy
levels in 3s, 6N possible levels in 3p of which only 2N is completely filled.
b) When the spacing is progressively decreased i.e., c<r<d, there is no visible splitting of energy levels.
c) When r = c, the 3s and 3p electrons of neighbouring silicon atoms becomes appreciable. The energy of
electrons of each atom starts changing, whereas the energies of electrons in the inner shell do not change.
d) When r lies between b and c, the energy levels get slightly changed and instead of a single 3s or 3p levels, we
get a large number of closely packed levels. This collection of closely spaced energy levels is called an energy
band.
e) When r = b>a, the gap between 3s and 3p completely disappear and the 8N energy levels are (2N of 3s and
6N of 3p sub shells) continuously distributed. In this stage 4N levels are filled and 4N levels are empty.
f) When r = a i.e., actual spacing in the crystal the 4N filled energy levels are separated from 4N unfilled energy
levels. This gap or separation is called the forbidden gap. E.g., the lower completely filled band is called
valence band and upper unfilled band is called conduction band.
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P-N JUNCTION: - When a P-type crystal is joined with a N-type crystal in such a manner
that crystal structure remains continuous then this structure is called as P-N Junction.
Formation of P-N junction: - Diffusion method is used to form a P-N Junction. In this
method an element of III group (like Boron) is coated on a slice of N-type semiconductor
called wafer or an element of V group (like phosphorus) is coated on P-type
semiconductor. When this semiconductor is heated at a high temperature (about 500C)
the impurity is diffused inside the semiconductor. Diffusion is more at surface and
decreases as the depth increases. The depth up to which the diffusion takes place, a
junction is formed which is called P-N Junction. On the one side of this junction there is Ptype semiconductor and on the other side there is N-type semiconductor.
What happens at the time of formation of P-N Junction (formation of depletion
region and potential barrier): As soon as a junction is formed the holes from p-region
diffuse towards n- region and electron from n- region diffuse towards p-region due to the
high concentration of holes and electron into two different regions. In the vicinity of
junction the
P-Type
N-Type
Potential
Barrier
Electrons
majority carrier
Holes
majority
carrier
Immobile - ve
ions
Depletion
region
Immobile +ve
ions
electrons and holes recombines with each other and vanishes, due to which there is a
excess of immobile +ve ions in n-region and ve ions in p-region. Thus an electric field
and hence a potential difference called potential barrier is developed across the junction
which stops the further diffusion of holes and electrons. The region free form chargecarriers on both side of junction is called depletion region or space charge region.
The thickness of the depletion region is of the order of 10 -6 meter while the potential
barrier is about 0.7 volt. Therefore
P
N
0.7
ElectricField 6 7 10 5 Vm 1
10
Biasing of p-n junction: B
(I)
Forward Bias: - When p-region of a p-n
A
junction is joined to the (+) ve pole of a
battery and n-region to -ve pole then the
junction is said to be forward biased.
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Depletion layer
FORWARD
BIASING
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COMPILLED BY DR. S.K.SINGHAL
(I) forward bias Characteristics-First of all makes the connection according to the
circuit shown in fig.1. By changing the forward voltage with the help of potential divider
note down the corresponding forward current and plot the graph between forward
voltage and forward current. The graphs so obtained are called as forward characteristic
curve of p-n junction.
N
If
Vf
Forward Current If
BATTER
Y
R
h
Knee Voltage
From the graph it is clear that initially there is no current. When the applied voltage is
less than the potential barrier, the current flow through the junction is very small. As the
forward voltage increases above the potential barrier,0.4
current
increases approximately
0.6 0.8 1.0
FORWARD
VOLTAGE
V
linearly. When the forward voltage is equal to voltage of
potential
barrier
then the curve
becomes like a knee and called as knee voltage. At this voltage the thickness of
depletion layer becomes negligibility and the diffusion of electrons and holes across the
junction take place easily i.e. the p-n junction offer low resistance when it is forward bias
and the resistance is of the order of 100 ohm.
f
(II) Reverse Characteristic Curve: Make the connection according to the circuit shown in the following figure. Change the
reverse voltage and note the corresponding reverse current. The graph plotted between
reverse voltages and reverse current is called as reverse bias curve. Practically in
reverse bias there is no current if the applied voltage is low but a very small flow due to
minority carriers. On increasing the reverse
REVERSE VOLTAGE
Zener
Voltage
Reverse Current Ir (
Voltage to a very high value, the current increases abruptly, which is clear from graph. It
is due to the fact that at very high voltage, the entire covalent bond near the junction is
broken. Due to which a large number of holes & electrons are liberate and the
corresponding voltage is called as Zener voltage. In reverse bias the thickness of
depletion layer increases due to which the further diffusion of charge carriers stops and
no current flows through the junction. Thus in reverse bias the junction offers very high
resistance.
DYNAMIC RESISTANCE: - The ratio of the small change in voltage to the small change
in the current is called as dynamic or a.c. resistance of the junction diode. It is
Vd
V
I
represented by Vd.
The region of the characteristic curve where dynamic resistance is almost independent
of the applied voltage is called the linear region of junction diode.
Junction diode as Rectifier: - An electronic device, which converts a.c. power in to
D.C. power, is called rectifier.
Half wave Rectifier: - A rectifier, which rectifies only one half of each a.c. input
supply cycle is called half wave rectifier.
Principle: - It is based on the principle that the diode offers low resistance when it is
forward bias and high resistance when it is reversed bias i.e. current can flow through
the diode when it is forward biased.
A p
n
Input
a.c.
voltage
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COMPILLED BY DR. S.K.SINGHAL
C
RL
A.C.
Input
Voltage
Output
D.C.
Voltage
D
D.C.
0utput
Voltage
A
Input
a.c.
voltage
A.C.
Input
Voltage
C
T
RL
B
D2
Output
d.c.
Voltage
D
D.C.
0utput
Voltage
Arrangement:- The a.c. supply is fed across the primary coil P of a step down
transformer. Two two ends of the secondary coil S of the transformer are connected
to the p- regions of the junction diodes D1 and D2 . A load resistance RL is
connected beteen the n-regions of the two diodes and the ncentral tapping of the
secondary coil. The out put d.c. is obtained across the load reistance.
Working:-Suppose that during first half of the input, the upper end A of the secondary is
at + ve pot. and lower end B is at () ve pot. So the diode D 1 gets forward bias and D2
gets reverse bias hence current flows through D1 in load resistance from C to D. During
the next half cycle A becomes ve and B becomes +ve and hence D 1 gets reverse bias
and D2 gets forward bias. Thus the current flows through D 2 from C to D in load
resistance.
Hence the full wave rectifier, rectifies the both halves of a.c. The output d.c. is
continuous but pulsating. To reduce the fluctuations, filter circits are used in output
circits. Electrolytic condenser and zener diodes are use to reduce the fluctuations of d.c.
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COMPILLED BY DR. S.K.SINGHAL
N
UNREGULATE
VOLTAGE (Vi)
SYMBOL OF
ZENER
DIODE
IL
IZ
VO
RL
REGULATED
VOLTAGE (VO)
LIGHT
P
Reverse bias
RL
N
I1
I2
I3
I4
Volts
Photo diode
is
always
I4 > I3 > I2 > I1
A
reverse bias. When no light falls on it, a
small
reverse current flows through the
junction. This current is due to the thermally generated electron-hole pairs and is called
as dark current. When the photodiode is illuminated with light photons of energy h>E g
then it ejects the valence electrons due to which the current increases and becomes
maximum. This current is called as saturation current. On increasing the light intensity,
the saturation current increases.
A photodiode can turn its current ON and OFF in nanoseconds. So it can be used as a
fastest photo detector.
Uses:
RL
1. In detection of optical signals.
2. In demodulation of optical signals
3. In light-operated switches
4. In speed reading of computer punched cards.
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Emitter
Collector
(II)
Collector
B
In a transistor base is lightly doped and very thin. The region, which is lightly doped and
very thin, is called as Base. The region, which is highly doped, is called emitter while the
remaining one is called collector. When a transistor is used in a circuit, base emitter
junction is always forward bias while the collector base junction is reverse bias.
Action of Transistor: (a) Action of n-p-n Transistor: - The emitter base junction is made forward bias by
using a battery VEE while the collector base junction is made reversed bias by using the
VCC. The ve pole
of battery VEE
N
P
N
repels
the
electrons
in
E
emitter
region
C
(as
majority
IE
IC
Emitter
B
Collector
carrier
in
nIB
region) towards
base. Since the
VEE
VCC
base is very thin
and lightly doped, hence about 95% electrons cross over the base region and entered
the collection region where they are attracted by the +ve pole of the battery V CC. As soon
as an electron enters the +ve pole of the battery V CC, at the same time an electron enters
the emitter region from the ve pole of the battery VEE and this process is carried out
continuously. About 5% electrons recombined with holes in base region. For each
recombination a covalent bond breaks which creates the hole and electron in pair.
Electron enters +ve pole of V EE through B and hence base current I B flows which is very
small.
If IE, IC and IB are the emitter, collector and base current then (According to Kirchhoffs 1st
law)
IE = I B + I C
It may note that in n-p-n transistor current flows due to the flow of electrons in and
outside of transistor.
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COMPILLED BY DR. S.K.SINGHAL
Legends: -
HoleElectron-
IE
Emitter
IB B
VEE
IC
Collector
VCC
Holes
Electrons
B
E
VCC
VBB
mA
+
+
VBE
_
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COMPILLED BY DR. S.K.SINGHAL
VCE
_
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N-P-N Transistor: -The base emitter circuit is made forward biased by using a battery
VBB while the emitter, collector circuit is made reversed bias by using battery V CC. To draw
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COMPILLED BY DR. S.K.SINGHAL
VBE
Rin
I B
VCE
denoted by Rin.
(2) Output characteristics:- The graphs plotted between emitter collector voltage
and the collector current (IC) at different constant values of base current (I B). Following
result may be drawn from the output characteristic curves(I) The collector current changes rapidly in beginning but soon it becomes saturated.
(II) The saturation current increases on increasing the base current.
(III) In audio frequency amplifiers the linear part of the output characteristics is used in
order to obtained undistorted output.
Output resistance :-The radio of the change in emitter collector voltage to the change
VCE
Rout
I C
IB
IB (mA)
(VCE) = 2v
VCE
IB = 250
IB = 200
(VCE) =3v
IB = 150
IC (mA)
IC (m A)
I C
I B
transfer ratio. It is denoted by: -
(VCE) = 3V
IB = 100
IB = 50
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COMPILLED BY DR. S.K.SINGHAL
(VBE)
INPUT
(VCE)
0UTPUT
CHARACTERISTICS
IB (mA)
TRANSFER
CHARACTERIST
ICS
Vout I C Rout
Vin
I B Rin
AV
I C Rout
I B Rin
I c 2 RO
I B 2 Ri
AP
AP 2 resistance gain
> so the power gain in common emitter amplifier is very large as compared to that in
common base amplifier.
Trans conductance:- It is defined as the ratio of the change in the collector current (I C
) to the change in emitter base voltage (V BE) at constant collector voltage. It is denoted
I c
by gm i.e.
gm
VBE
20
gm
VCE
I C
I B
I B
VBE
g m ac
1
Rin
1
I C
I C
1
1
1
1
1
OR Gate
The OR gate is an electronic circuit that gives a high output (1) if one or more of its inputs are high. A plus (+)
is used to show the OR operation.
NOT Gate
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Universal Gates
NAND Gate
This is a NOT-AND gate which is equal to an AND gate followed by a NOT gate. The outputs of all NAND
gates are high if any of the inputs are low. The symbol is an AND gate with a small circle on the output. The
small circle represents inversion.
NOR Gate
This is a NOT-OR gate which is equal to an OR gate followed by a NOT gate. The outputs of all NOR gates
are low if any of the inputs are high. The symbol is an OR gate with a small circle on the output. The small
circle represents inversion.
Combinational Gates
X-OR
Gate
The 'Exclusive-OR' gate is a circuit which will give a high output if either, but not both, of its two inputs are
high. An encircled plus sign () is used to show the X-OR operation.
X-NOR Gate
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Table
1:
Logic
Gate
Symbols
Table 2 is a summary truth table of the input/output combinations for the NOT gate together with all possible input/output combinations
for the other gate functions.
Table 2: Logic gates representationusing the Truthtable
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COMPILLED BY DR. S.K.SINGHAL