Академический Документы
Профессиональный Документы
Культура Документы
WARNING
Failure to adhere to these steps and/or not heed the safety
requirements at each step may lead to shock, injury, and damage
to the hardware.
The MSP430F6736 source code that is described in this application report can be downloaded from
www.ti.com/lit/zip/slaa517.
The MSP430F6736A source code along with the EVM430-F6736 design files that are described in this
application report can be downloaded from www.ti.com/tool/TIDM-1PHMTR-ESD.
1
2
3
4
5
6
7
8
Contents
Introduction ................................................................................................................... 2
System Diagrams ............................................................................................................ 3
Hardware Implementation .................................................................................................. 4
Software Implementation ................................................................................................... 7
Energy Meter Demo........................................................................................................ 14
Results and Calibration .................................................................................................... 20
References .................................................................................................................. 25
Schematics .................................................................................................................. 26
A Simple Capacitive Power Supply for the MSP430 Energy Meter ................................................... 5
10
11
List of Figures
....................................................................
14
Introduction
www.ti.com
12
13
14
15
16
17
18
Meter Status
19
20
21
22
23
24
25
26
27
................................................................................................................
..................................................................................
Meter Calibration Factors .................................................................................................
Measurement Accuracy Across Current.................................................................................
Schematics (1 of 5) ........................................................................................................
Schematics (2 of 5) ........................................................................................................
Schematics (3 of 5) ........................................................................................................
Schematics (4 of 5) ........................................................................................................
Schematics (5 of 5) ........................................................................................................
22
23
24
25
26
27
28
29
30
List of Tables
Introduction
The MSP430F6736(A) device is the latest metering system-on-chip (SoC), that belongs to the
MSP430F67xx family of devices. This family of devices belongs to the powerful 16-bit MSP430F6xxx
platform and includes new features and flexibility to support robust 1-phase, 2-phase, and 3-phase
metrology solutions. This application report, however, discusses the implementation of a 1-phase solution
only. These devices find their application in energy measurement and have the necessary architecture to
support them.
The F6736(A) has a powerful 25-MHz CPU with MSP430CPUX architecture. The analog front end
consists of up to three 24-bit analog-to-digital converters (ADC) based on a second-order sigma-delta
architecture that supports differential inputs. The sigma-delta ADCs (24) operate independently and can
output 24-bit results. They can be grouped together for simultaneous sampling of voltage and currents on
the same trigger. In addition, the ADCs have an integrated gain stage that supports gains up to 128 for
amplification of low-output sensors. A 32-bit x 32-bit hardware multiplier on this chip can be used to further
accelerate math-intensive operations during energy computation. The software supports calculation of
various parameters for 1-phase energy measurement. The key parameters calculated during energy
measurements are: RMS current and voltage, active and reactive power, active and reactive energy,
power factor, and frequency.
Complete metrology source code is provided and can be downloaded from www.ti.com/lit/zip/slaa517 for
the MSP430F6736-based software and from www.ti.com/tool/TIDM-1PHMTR-ESD for the
MSP430F6736A software.
System Diagrams
www.ti.com
System Diagrams
Figure 1 shows typical connections of electronic electricity meters (also called energy meters or e-meters)
in real-life applications. The supported ac voltages and associated currents are 230 V or 120 V at 50 Hz or
60 Hz. The labels LINE and NEUTRAL indicate low-voltage ac coming from the utilities.
Hardware Implementation
www.ti.com
From utility
A
B
N(L)
L(N)
xxxxxx
xxxxxx
xxxxxx
xxxxxx
xxxxxx
xxxxxx
xxxxxx
xxxxxx
xxxxxx
TEST
REAC MAX
kW
kWh
Sx,COMx
VCC
MSP430F6736(A)
RST
VSS
I In
CT
24-bit SD
Analog to
I1+
Digital
PULSE2
PULSE1
I1-
XIN
I2-
I2+
V1+
V In
LOAD
LF Crystal 32kHz
XOUT
Application interfaces
V1-/
V1Vref(O)
Vref(I)
VREF
USCIA0
USCIA1
USCIA2
USCIB0
UART or SPI
UART or SPI
UART or SPI
I2C or SPI
Hardware Implementation
This section describes the hardware for the design of a working 1-phase energy meter using the
F6736(A).
3.1
Power Supply
The MSP430 devices are ultra-low-power microcontrollers from Texas Instruments. These devices support
a number of low-power modes and improved power consumption during active mode when the CPU and
other peripherals are active. The low-power features of this device family allow the design of the power
supply to be extremely simple and cheap. The power supply allows the energy meter to be powered
directly from the mains. The following sections describe the various power supply options that are
available to support your designs.
Hardware Implementation
www.ti.com
3.1.1
Figure 3. A Simple Capacitive Power Supply for the MSP430 Energy Meter
Appropriate values of resistor R20 and capacitor C28 are chosen based on the required output current
drive of the power supply. Voltage from mains is directly fed to a RC-based circuit followed by rectification
circuitry to provide a dc voltage for the operation of the MSP430. This dc voltage is regulated to 3.3 V for
full-speed operation of the MSP430. For the circuit in Figure 3, the drive provides approximately 12 mA.
The design equations for the power supply are shown in the Capacitor Power Supplies section of MSP430
Family Mixed-Signal Microcontroller Application Reports (SLAA024). If there is a need to slightly increase
the current drive (up to 20 mA), the capacitor values of C28 can be increased. If drive higher than 20 mA
is required, especially to drive RF technology, additional drive can be used either with an NPN output
buffer or a transformer and switching-based power supply.
3.2
Analog Inputs
The MSP430 analog front end that consists of the ADC is differential and requires that the input
voltages at the pins do not exceed 920 mV (gain = 1). To meet this specification, the current and voltage
inputs need to be divided down. In addition, the SD24 allows a maximum negative voltage of -1 V,
therefore, ac signals from mains can be directly interfaced without the need for level shifters. Section 3.2.1
and Section 3.2.2 describe the analog front end used for voltage and current channels, respectively.
3.2.1
Voltage Inputs
The voltage from the mains is usually 230 V or 110 V and needs to be brought down to a range of 1 V.
The analog front end for voltage consists of spike protection varistors (not shown in this figure) followed by
a simple voltage divider and a RC low-pass filter that acts like an anti-alias filter.
Figure 4 shows the analog front end for the voltage inputs for a mains voltage of 230 V. The voltage is
brought down to approximately 700 mV RMS, which is 990 mV peak and fed to the positive input,
adhering to the MSP430 analog limits. A common-mode voltage of zero can be connected to the
negative input of the . In addition, the has an internal reference voltage of 1.2 V that can be used
externally and also as a common-mode voltage if needed. GND is referenced to the neutral voltage or line
voltage, depending on the placement of the current sensor.
Hardware Implementation
3.0K
www.ti.com
Current Inputs
13ohm
13ohm
The analog front-end for current inputs is a little different from the analog front end for the voltage inputs.
Figure 5 shows the analog front end used for the current channels I1 and I2.
Software Implementation
www.ti.com
Software Implementation
The software for the implementation of 1-phase metrology is discussed in this section. The first subsection
discusses the set up of various peripherals of the MSP430. Subsequently, the entire metrology software is
described as two major processes: foreground process and background process.
4.1
Peripherals Setup
The primary peripherals used for this application are the 24-bit sigma delta (SD24) ADC, clock system,
timer, LCD, and watchdog timer (WDT).
4.1.1
SD24 Setup
The F673x(A) family has up to three independent sigma delta data converters. For a single phase system
at least two s are necessary to independently measure one voltage and current. The code
accompanying this application report addresses the metrology for a 1-phase system with limited
discussion to anti-tampering, however, the code supports the measurement of the neutral current. The
clock to the SD24 (fM ) is derived from the DCO running at 16 MHz. The sampling frequency is defined as
fs =
fm
OSR ,
the OSR is chosen to be 256 and the modulation frequency, fM, is chosen as 1 MHz
(1 048 576 Hz), resulting in a sampling frequency of 4.096 ksps. The SD24s are configured to generate
regular interrupts every sampling instant.
The following are the channels associations:
SD0P0 and SD0N0 Voltage V1
SD1P0 and SD1N0 Current I1
SD2P0 and SD2N0 Current IN (Neutral)
4.2
Foreground Process
The foreground process includes the initial set up of the MSP430 hardware and software immediately after
a device reset. Figure 6 shows the flowchart for this process.
Software Implementation
www.ti.com
RESET
HW setup
Clock, SD24_B, Port pins, Timer,
USCI, LCD
Y
Main Power OFF?
Go to LPM0
Wake-up
N
1 second of Energy
accumulated? Wait for
acknowledgement from
Background process
Y
Calculate RMS values for current,
voltage; Active and Reactive
Power
Formulas
This section briefly describes the formulas used for the voltage, current, and energy calculations.
Software Implementation
www.ti.com
4.2.1.1
As discussed in the previous sections simultaneous voltage and current samples are obtained from three
independent converters at a sampling rate of 4096 Hz. Track of the number of samples that are
present in 1 second is kept and used to obtain the RMS values for voltage and current for each phase.
Sample
count
2
v (n )
n =1
VRMS = Kv *
Sample count
Sample
count
2
i (n )
n =1
IRMS = K i *
Sample count
Power and energy are calculated for a frames worth of active and reactive energy samples. These
samples are phase corrected and passed on to the foreground process that uses the number of samples
(sample count) and use the formulae listed below to calculate total active and reactive powers.
Sample
PACT = K p
count
v (n ) i (n )
n =1
Sample count
Sample
PREACT = K p
count
v 90 (n ) i (n )
n =1
Sample count
For reactive energy, the 90 phase shift approach is used for two reasons:
This allows us to measure the reactive power accurately down to very small currents.
This conforms to international specified measurement method.
Since the frequency of the mains varies, it is important to first measure the mains frequency accurately
and then phase shift the voltage samples accordingly. This is discussed in Section 4.3.3.
The phase shift consists of an integer part and a fractional part, the integer part is realized by providing an
N samples delay. The fractional part is realized by a fractional delay filter (refer to: Phase compensation).
Software Implementation
4.3
www.ti.com
Background Process
The background process uses the interrupt as a trigger to collect voltage and current samples (three
values in total). These samples are further processed and accumulated in dedicated 48-bit registers. The
background function deals mainly with timing critical events in software. Once sufficient samples (1
second worth) have been accumulated then the foreground function is triggered to calculate the final
values of VRMS, IRMS, power and energy. The background process is also wholly responsible for energy
proportional pulses, frequency and power factor calculation for each phase. Figure 7 shows the flow
diagram of the background process.
SD24_B Interrupts @
4096/sec
Read Voltages V1
Read Currents I1, and I2
a. Remove residual DC
b. Accumulate samples for instantaneous Power
c. Accumulate for IRMS for both currents and VRMS
1 second of energy
calculated?
Y
Pulse generation in accordance to
power accumulation
Calculate frequency
Calculate power factor
10
Software Implementation
www.ti.com
The following sections discuss the various elements of electricity measurement in the background
process.
4.3.1
4.3.2
Phase Compensation
The Current Transformer (CT) when used as a sensor and the input circuits passive components together
introduces an additional phase shift between the current and voltage signals that needs compensation.
The converter has built in hardware delay that can be applied to individual samples when grouped.
This can be used to provide the phase compensation required. This value is obtained during calibration
and loaded on to the respective PRELOAD register for each converter. Figure 8 shows the application of
PRELOAD (SD24PREx).
SD24GRP0SC
Set by SW
Set by SW
Rest by SW
Channel 0
SD24SCSx=100b
SD24SNGL=0
SD24PREx=00h
Conversion
SD24SC
Channel 0
SD24SCSx=100b
SD24SNGL=1
SD24INTDLYx=11b
SD24PREx=PRE1 SD24SC
Conversion
Co
PRE1
Conversion
Conv
Set by GRP0SC
Reset by GRP0SC
Set by GRP0SC
Conversion
PRE1
Set by GRP0SC
Conversion
Set by SW
Rest by SW
Conversion
Convers
Set by GRP0SC
Auto-clear
Set by SW
Auto-clear
In the current application for input frequency of 60 Hz, OSR of 256 and sampling frequency of 4096, the
resolution for every bit in the preload register is about 0.02 with a maximum of 5.25 (maximum of 255
steps). Since the sampling of the 3 channels are group triggered, an often method used is to apply 128
steps of delay to all channels and then increasing or decreasing from this base value. This allows delay
timing to compensate for phase lead or lag. This puts the practical limit in the current design to 2.62.
When using CTs that provide a larger phase shift than this maximum, an entire sample delay along with
fractional delay must be provided. This phase compensation can also be modified on the fly to
accommodate temperature drifts in CTs.
11
Software Implementation
4.3.3
www.ti.com
good samples
linear interpolation
12
Software Implementation
www.ti.com
SD interrupts @
4096 Hz
Energy
Accumulator+=
Average Power
Y
Energy Accumulator =1KWh threshold?
Generate 1
pulse
Proceed to other
tasks
13
www.ti.com
5.1
EVM Overview
The following figures of the EVM describe the hardware. Figure 11 is the top view of the energy meter.
Figure 12 discuses the location of various pieces of the EVM based on functionality.
Figure 11. Top View of the Single Phase Energy Meter EVM
14
www.ti.com
Figure 12. Top View of the EVM With Blocks and Jumpers
5.1.1
15
www.ti.com
To read active energy pulses for accuracy measurements, there are several options available on the
board. The related pulse rate is 6400 pulses per kWh by default, but is configurable using the energy
library.
Optical output via LED1.
Non-isolated electrical pulse via ACT header. The left pin is the signal, and the right pin is GND.
Isolated pulses through JP7. The opto-isolator that is used closes the circuit between these two pins
on an active pulse.
Figure 13 shows the various connections that need to be made to the test set up for proper functionality of
the EVM.
Figure 13. Top View of the EVM With Test Setup Connections
16
www.ti.com
If a test setup needs to be connected, the connections have to be made according to the EVM design.
Figure 13 shows the connections from the top view. L and N correspond to the voltage inputs from the test
setup. I+ and I- corresponds to one set of current inputs and I+ and I- corresponds to the second set of
current inputs. Although the EVM hardware and software supports measurement for the second current,
the EVM obtained from Texas Instruments do not have the second sensor and any current inputs must be
connected to I+ and I- only. If additional sensor needs to be placed, please use the two bottom left slots
close to terminals I+ and I-. Additional connections need to be made to connect the output of these
sensors to points CUR1+ and CUR1- on the PCB.
5.1.2
Main Functionality
Valid Use-case
Comments
JP1
JP4
JP3
AUX1
AUXVCC1 selection
AUX2
AUXVCC2 selection
AUX3
AUXVCC3 selection
JP2
JP7
JP8
SV1
SV2
TI EMK Headers
RF1 + RF2
ACT
17
www.ti.com
Table 1. Header Names and Jumper Settings on the F6736(A) EVM (continued)
Header Name
REACT
5.2
Main Functionality
Valid Use-case
Comments
Not isolated from ac voltage. Do not connect
external equipment if external isolation is not
present. The left pin is the signal, and the right
pin is GND.
5.2.1
18
www.ti.com
19
www.ti.com
20
www.ti.com
6.1
Viewing Results
Once the meter is turned ON, the results can be easily viewed using this GUI by connecting the RS-232
header to the PC. Run calibrator.exe in the GUI folder.
21
www.ti.com
22
www.ti.com
6.2
6.2.1
Gain Correction
Gain correction for voltage, current and active power can be done simultaneously and the procedure is
discussed below.
1. Connect the meter to the test setup with known voltage and currents.
2. Connect GUI to view results for voltage, current, active power, and so forth.
3. Click on Manual cal seen in Figure 18 to give you this screen.
(1)
5. Negative values are accepted in the voltage and current fields and the same procedure is applicable
for other voltages and currents. For voltages, enter in field "Voltage" and for currents, enter in field
Current (low). After these values are entered, click on Update meter.
6. Gain correction for active power is done differently; the accuracy obtained from any test system when
pulses are fed from the meter is the most accurate method.
7. Measure accuracy in the reference meter of the test system. This gives the true accuracy of the meter
for active energy.
8. Enter the "% accuracy" seen as-is in the Active (low) field. Click on update meter to do a gain
correction on Phase A.
6.2.2
Phase Correction
Phase correction has to be done differently and the following is the procedure.
1. Set voltage and current values to the same as Gain correction and introduce a known phase shift
between voltage and current to +60.
2. See % error on the test setup. If errors are not acceptable, enter correction factors in the Phase (low)
field. Only increments and decrements should be entered in this field and preferably start with 1 or -1
to determine the direction of correction. Click "Update meter".
23
www.ti.com
3. Measure error again to see if error has increased or decreased. If error has decreased, continue to
add desired increments until you arrive at an error close to zero, else add decrements.
4. Click on "Update meter" every time a modification is made to this field.
5. Change the phase now to -60 and check if this error is still acceptable. If not, fine tune the values of
Phase (low) again. Ideally, errors should be symmetric for same phase shift on lag and lead conditions.
After the meter has been calibrated, it is possible to see these calibrated values for reference. Click "Meter
calibration factors" to open this screen (sample values only).
24
References
www.ti.com
6.2.3
Metrology Results
In this discussion, metrology results are shown. Current transformers have been used, however, the code
supports shunt resistors as well. Figure 22 shows the results for current that is varied from 50 mA to 100
A exhibiting a 2000:1 dynamic range. Table 2 shows the values for the error at room temperature.
Table 2. Energy Measurement Accuracy With Error in
(%)
Calibrated at 230 V, 15 A, 50 Hz
Current
(Amps)
60
-60
0.05
-0.045
0.058
-0.07
0.1
-0.019
0.083
-0.07
0.25
-0.019
0.0575
-0.0575
0.5
0.006
0.083
-0.045
0.0147
0.0663
-0.0617
-0.007
0.058
-0.07
-0.019
0.0043
0.022
10
-0.007
-0.024
0.003
20
-0.015
-0.0533
0.0493
30
0.0003
-0.079
0.0747
40
-0.0067
-0.096
0.07
50
0.011
-0.106
0.1023
60
0.0006
-0.099
0.1203
70
0.0167
-0.096
0.1187
80
0.0263
-0.098
0.143
90
0.0367
-0.096
0.1563
100
0.0387
-0.0943
0.16
References
1. MSP430 Family Mixed-Signal Microcontroller Application Reports (SLAA024)
2. MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208)
25
Schematics
www.ti.com
Schematics
The following pages show the schematics for the EVM430-F6739.
DGND
AUX1
C1
4.7uF
24
25
DGND
DGND
C16
0.47uF
RS232_RXD
RS232_TXD
C17
LCDCAP
4.7uF RF_VREG_EN
RF_RESETCC
COM0
COM1
COM2
COM3
ACT
REACT
SCL
SDA
RF_CCA
RF_SFD
RF_SOMI
RF_SIMO
RF_CS
RF_CLK
BT2
BT1
IR_SD
S1
3
4
1
2
47K
C15
0.01uF
SD0P0
SD0N0
SD1P0
SD1N0
SD2P0
SD2N0
VREF
AVSS
AVCC
VASYS
NC1
NC2
NC3
P1.0
P1.1
P1.2
P1.3
AUXVCC2
AUXVCC1
VDSYS
DVCC
DVSS
XVCORE
XIN
XOUT
AUX3
DGND
12 1
VDSYS 1
C7
4.7uF
20
VDSYS
21
DVCC
22
DGND
VCORE 23
DGND DGND
32.768
2
C11
C12
0.1uF
C14
0.47uF
R2
DGND
C10
4.7uF
1
V1+
0.1uF
2
V13
I1+
4
I1AGND
5
IN+
AGND
6
IN7
VREF
8
9
AVCC
AVCC
C8
10
VASYS
C5
C13
11
0.1uF 4.7uF
12
0.1uF
13
VSENSE 14
AGND
VTEMP 15
RX0 16
AGND
TX0 17
18
19
AUXVCC1
C6
4.7uF
C9
4.7uF
10 ohm
C3
4.7uF
C4
0.1uF
DGND
DGND
Q1
3
AUX2
DVCC
DGND
AUXVCC2
C2
0.1uF
RESET
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
AUXVCC3
P1.4
P1.5
LCDCAP
P8.4
P8.5
COM0
COM1
COM2
COM3
P1.6
P1.7
P2.0
P2.1
P8.6
P8.7
P9.0
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
P3.0
P3.1
RST/NMI/SBWTDIO
PJ.3/ACLK/TCK
PJ.2/ADC10CLK/TMS
PJ.1/MCLK/TDI/TCLK
PJ.0/SMCLK/TDO
TEST/SBWTCK
P8.3
P8.2
P8.1
P8.0
P7.7
P7.6
P7.5
P7.4
P7.3
P7.2
P7.1
P7.0
P6.7
P6.6
P6.5
P6.4
P6.3
P6.2
P6.1
100
99TCK
98TMS
97TDI
96TDO
95TEST
94 SEG0
93 SEG1
92 SEG2
91 SEG3
90 SEG4
89 SEG5
88 SEG6
87 SEG7
86 SEG8
85 SEG9
84 SEG10
83 SEG11
82 SEG12
81 SEG13
80 SEG14
79 SEG15
78 SEG16
77 SEG17
76 SEG18
R3
JTAG
13
11
9
7
5
3
1
14
12
10
8
6
4
2
3
2
1
JP1
DVSS2
DVSYS
P6.0
P5.7
P5.6
P5.5
P5.4
P5.3
P5.2
P5.1
P5.0
P4.7
P4.6
P4.5
P4.4
P4.3
P4.2
P4.1
P4.0
P3.7
P3.6
P3.5
P3.4
P3.3
P3.2
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
DGND
VDSYS
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
SEG33
SEG34
SEG35
SEG36
SEG37
SEG38
SEG39
RF_GPIO1
RF_GPIO2
DGND
LCD1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
SV1
SV2
DVCC
LED2 100
1
2
3
4
1
2
3
4
R5
REACT
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
LED1 100
DVCC
DGND
R4
ACT
C18
0.1uF
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
COM0
COM1
COM2
COM3
24
23
SEG39
SEG38
SEG37
SEG36
SEG35
SEG34
SEG33
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
COM0
COM1
COM2
COM3
SEG23
SEG22
10K
DVCC
R1
VTEMP
DGND
RTH
10K Thermistor
26
Schematics
www.ti.com
AVCC
AGND
NEUTRAL
S20K275
EXCML20A
L1
L2
13R
330K
C19
R16
330K
I1+
15nF
I1-
IN+
47pF C23
47pF
C20
C21
15nF
IN-
47pF C24
47pF
C22
LINE-VA R11
1K
AGND
R12
1K
R13
R14
1K
R15
1K
AGND
R6
EXCML20A
L3
BLM21BD121SN1D
L4
BLM21BD121SN1D
R7
0R DNP
R9
LINE
1N4148
1N4148
AGND
R8
13R
R10
1 21 2
NEUTRAL
1N4148
L5
BLM21BD121SN1D
L6
BLM21BD121SN1D
1 21 2
D2 D1
1N4148
D4 D3
1N4148
1N4148
JP2
1N4148
2
1
D6 D5
1N4148
D8 D7
V1 R17
330K
R19
100
3K
C26
1K 47pF
R20
AGND
R18
AGND
C25
47pF
V1+
C27
15nF
V1-
27
Schematics
www.ti.com
LINE-VA
NEUTRAL
C28
0.22uF/305VAC
R21
560R/3W
R22
D11
1N4728
D12
1N4004
C29
220uF/100V
DGND
DGND
R23
Vsupply
1.8M
2
1
JP3
C30
2.2uF
59k
R24
EXT_VCC
1
2
3
4
5
C31
0.047uF
DGND
R25
C32
0.047uF
DVCC
EXT_VCC 1 JP4
C33
0.047uF
PL_VCC 3
10
9
8
7
6
U1
TPS5401_DGQ_10
PH
BOOT
GND
VIN
COMP
EN
SS/TR VSENSE
RT/CLK PWRGD
332k
332k
R26
C34
0.047uF
DGND
D13
B150
L7
ELLCTV
C35
2.2uF
DGND
R29
R28
R27
5K
R31
R30
5K
Vsupply
51
PL_VCC
VSENSE
316k
DGND
DGND
100k
28
Schematics
www.ti.com
SCL
BT2
6
7
3
2
1
IC2
SCL
WP
A2
A1
A0
VCC
SDA 5
GND
DVCC
0.1uF
C37
10K
C38
0.1uF
SDA
RF_VREG_EN
RF_RESETCC
RF_FIFO
RF_FIFOP
ACT
DVCC
R41
1K
ACT
1
2
GND
0
0
0
0
RF_FIFO
RF_FIFOP
R37
R38
R39
R40
1
3
5
7
9
11
13
15
17
19
DGND
TX0
RX0
IR_SD
0.1uF
C40
1
2
OK1
TIL191
0
0
0
0
0
0
0
0
JP6
2
4
6
8
10
12
14
16
18
20
JP5
RF1
IRDA
VCC2
TXD
RXD
SD
VCC1
GND
4
3
JP7
REACT
DVCC
R50
1K
1 REACT
2
GND
1
2
OK2
TIL191
R52
R51
R53
DVCC
RF_FIFO
RF_FIFOP
RF_CCA
RF_SFD
RF_CS
RF_CLK RF_RESETCC
RF_SIMO
RF_SOMI
RF_GPIO1
RF_SIMO
RF_SOMI
R42
R43
R44
R45
R46
R47
R48
R49
1
3
5
7
9
11
13
15
17
19
RF2
C42
R35
DVCC
GND
DVCC
4.7uF
47
C39
R36
GND
2
4
6
8
10
12
14
16
18
20
0
0
R54
R55
R56
DGND
RF_GPIO2
10uF
JP8
C41
1
2
0.1uF
1
2
24C02CSN
BT1
0.1uF
TX0
DVCC
DGND
RX0
1
2
3
4
5
6
EZ-RF CONNECT
GND
C36
GND
DVCC
R33
EEPROM
Array
SV3
100k
DVCC
R32
29
R34
1
2
3
4
100k
1
2
3
4
8
4
S3
10K
S2
Schematics
www.ti.com
RS232_RXD
RS232_TXD
R57
2.2k
DVCC
R59
2.2k
R60
68
GND
8
7
6
8
7
6
U3
U2
+12V
D14
LL103A
C43
0.1u
R61
DNP
R62
1k
-12V
D15
C44
LL103A
RXD
D16
LL103A
D17
GND1
C45
10u
10u
LL103A
R63
1k
R65
1.5k
R64
PS8802
PS8802
T1
BC860B/BC857B
GND
DVCC
R58
10k
1
2
3
4
5
RS1
220
T2
R66
BC860B/BC857B
G1
6
7
8
9
G2
TXD
30
Revision History
www.ti.com
Revision History
Changes from D Revision (March 2015) to E Revision .................................................................................................. Page
Changed the modulation frequency from "1.1 MHz" to "1 MHz (1 048 576 Hz)" in Section 4.1.1, SD24 Setup
..............
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Revision History
31
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
www.ti.com/automotive
Amplifiers
amplifier.ti.com
www.ti.com/communications
Data Converters
dataconverter.ti.com
www.ti.com/computers
DLP Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
www.ti.com/energy
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
www.ti.com/video
RFID
www.ti-rfid.com
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2015, Texas Instruments Incorporated