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SamuelNascimentoPagliarini
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The cost of an IC
When that product contains or simply is
an IC that cost must be thoroughly
estimated.
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The cost of an IC
Estimating the cost of an IC is just a part of
the problem.
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The cost of an IC
The next slides will present a series of topics
that are part of the cost of an IC.
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The cost of an IC
As in other types of products, the cost of an
IC can be separated into two major
components:
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Cf = Ce + Cm
Fixed cost = engineering cost +
manufacturing cost
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Ce = Cp + Cs
Engineering cost =
personnel cost + support cost
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Some numbers...
Support item
Annual cost
Salary
50-100k
Digital Frontend CAD tools 10k
Analog CAD tools
100k
Digital Backend CAD tools 1M
...
???
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Mask cost
Testing cost
Packaging cost
Cm = Cmk + Ct + Cpk
Manufacturing cost =
mask cost + testing cost + packaging cost
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If a custom package is
required there will be
extra costs for designing
and manufacturing it.
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Variable cost
Variable or recurring costs are those directly
linked with the IC (mass) production.
Cd = die cost
Cdt = die test cost
Cdp = die package cost
y = final yield
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Yield (y)
Final yield is the final percentage of dies that
are fully functional. Both the test and package
steps have a yield percentage associated.
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What now?
As we have seen there are high costs to
make an IC, specially the fixed ones. The key
to obtain success in the IC industry is to dilute
these costs in the volume.
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What else?
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What else?
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Value?
Cost?
Price?
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Q2 - NRE
When it comes to NRE costs, it is well
established that it has a strong dependency
on:
Design complexity
Aggressiveness of the specs
Productivity of the design team
Reuse, automation, IP integration...
Q2 - NRE
Q: Which of the items is more prone to
enable easy cost savings?
A) Design complexity
B) Aggressiveness of the specs
C) Productivity of the design team
D) Reuse, automation, IP integration...
E) All of the above.
A: D
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Q3 - NRE
When it comes to NRE costs, it is well
established that it has a strong dependency
on:
Design complexity
Aggressiveness of the specs
Productivity of the design team
Reuse, automation, IP integration...
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Q3 - NRE
Q: Which of the items is less prone to
enable easy cost savings?
A) Design complexity
B) Aggressiveness of the specs
C) Productivity of the design team
D) Reuse, automation, IP integration...
E) All of the above.
A: C
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Q6 - Yield
Q: What is yield?
A: In Portuguese yield means rendimento.
It is a percentage of the total number of
dies that meet a satisfiability criteria.
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Q7 - Yield
Q: What kinds of yield are present in a final
die yield?
I) Test yield
II) Packaging yield
III) Die cutting yield
A) Only III
C) II and III
E) Only I
B) I and II
D) I, II and III
A: D
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Q8 Variable cost
Q: Why there is no manufacture cost (Cm)
in the variable cost?
A: Because you already have the masks
ready.
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DesignEconomics
Thanks!
*JulioLeofromNSCADPortochip
hascontributedwiththispresentation.
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