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Internal Use Only

North/Latin America
Europe/Africa
Asia/Oceania

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OLED TV
SERVICE MANUAL
CHASSIS : OD01J

MODEL : 15EL9500

15EL9500-ZA

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL63267401 (1004-REV00)

Printed in Korea

CONTENTS

CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
BLOCK DIAGRAM...................................................................................14
EXPLODED VIEW .................................................................................. 15
SVC. SHEET ...............................................................................................

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

-2-

LGE Internal Use Only

SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by
in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

Leakage Current Hot Check (See below Figure)


Plug the AC cord directly into the AC outlet.

An isolation Transformer should always be used during the


servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10mm away from PCB.

Do not use a line Isolation Transformer during this check.


Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit


Keep wires away from high voltage or high temperature parts.

AC Volt-meter

Before returning the receiver to the customer,


always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)


With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 M and 5.2 M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

-3-

To Instruments
exposed
METALLIC PARTS

0.15 uF

Good Earth Ground


such as WATER PIPE,
CONDUIT etc.

1.5 Kohm/10W

When 25A is impressed between Earth and 2nd Ground


for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard

LGE Internal Use Only

SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
Copyright 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

2. After removing an electrical assembly equipped with ES


devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

-4-

LGE Internal Use Only

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.

Circuit Board Foil Repair


Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

-5-

LGE Internal Use Only

SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range
This specification is applied to the OLED TV used OD01J chassis.

2. Requirement for Test


Each part is tested as below without special appointment.
1) Temperature: 25 C 5 C(77 F 9 F), CST: 40 C 5 C
2) Relative Humidity : 65 % 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~ 50 / 60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with
BOM.
5) The receiver must be operated for about 5 minutes prior to the adjustment.

3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC:CE, IEC

4. Module specification(General)
No.

Item

Specification

Measurement

Remark

Screen Size

15 inch

Aspect Ratio

16:9

Diagonal

AMOLED

15 inch WXGA AMOLED

Storage Environment

Temp.: -20 deg ~ 60 deg

Input Voltage

-0.3 ~ 14 Vdc

At 25 C

Power Consumption

32 W

Typica (Logic : 6 W, EL= 26 W)

HD

Humidity : 10 % ~ 90 %

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

-6-

LGE Internal Use Only

5. Model General Specification


No.
1.

Item
Market

Specification

Remarks

EU(PAL Market-36Countries)

DTV & Analog (Total 36 countries)


(UK/Italy/Germany/France/Spain/Sweden/Finland/Netherland/Belgium/
Luxemburg/Greece/Denmark/Czech/Austria/Hungary/Switzerland/Croatia
Turkey/Norway/Slovenia/Poland/Portugal/Ireland/Moroco/Latvia/Estonial/
Lithuania/Rumania)
DTV (MPEG2/4, DVB-C) : 2 Countries
Swenden/ Finland
Analog Only - 7 countries
(Russia/Slovakia/Bosnia/Serbia/Bulgaria/Latvia/Albania/Kazakhstan)

2.

Broadcasting system

1) PAL-BG
2) PAL-DK
3) PAL-I/I
4) SECAM L/L
5) DVB-T/C (ID TV)

3.

Receiving system

Analog : Upper Heterodyne

G DBV-T

Digital : COFDM , QAM

- Guard Interval(Bitrate Mbit/s)


1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 4/5, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 4/5, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 4/5, 5/6, 7/8
G DVB-C

- Symbolrate :
4.0Msymbols/s to 7.2Msymbols/s
- Modulation
16QAM, 64-QAM, 128-QAM and 256-QAM
4.

Mini - HDMI Input (1EA)

HDMI1-DTV

5.

USB

DVIX

6.

USB B

For Service

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

Support HDCP

-7-

LGE Internal Use Only

6. Module optical specification


No.

Item

Specification

Min.

Typ.

Max.

1.

Viewing Angle [CR>10]

Right/Left(Up/Down)

2.

Luminance

Luminance (cd/m2)

180

200

Uniformity Variation

70

80

50,000

100,000

3.

Contrast Ratio

CR

4.

CIE Color Coordinates

White

Free

Wx

0.285

Wy

0.299

RED

Rx

0.667

Ry

Typ.

0.333

Typ.

Green

Gx

-0.03

0.230

+0.03

Blue

Remark
Degree

Gy

0.675

Bx

0.145

By

0.065

1) Contrast Ratio(CR) is defined mathematically as :


CR = Surface Luminance at all white pixels / Surface Luminance at all black pixels
It is measured at center 1 point.
2) Surface luminance is determined after the unit has been ON and 3minutes after lighting the module in a dark environment at
25C 2 C. Surface luminance is the luminance value at center 1 point across the AMOLED surface 50 cm from the surface with
all pixels displaying white.
3) The variation in surface luminance , d WHITE is defined as :
- d WHITE(9P) = Minimum(Lon1,Lon2,..., Lon9) / Maximum(Lon1,Lon2..., Lon9)
Where Lon1 to Lon9 are the luminance with all pixels displaying white at 9 locations.
4) Image sticking
When it changes into pattern-B after a 1 hour drive by pattern-A, it disappears within 5 seconds.

7. HDMI Input
(1) DTV Mode
No.

Resolution

H-freq(kHz)

V-freq.(Hz)

Pixel clock(MHz)

Proposed

1.

720*480

31.469 / 31.5

59.94 / 60

27.00 / 27.03

SDTV 480P

2.

720*576

31.25

50

54

SDTV 576P

3.

1280*720

37.500

50

74.25

HDTV 720P

4.

1280*720

44.96 / 45

59.94 /60

74.17 / 74.25

HDTV 720P

5.

1920*1080

33.72 / 33.75

59.94 /60

74.17 / 74.25

HDTV 1080I

6.

1920*1080

28.125

50.00

74.25

HDTV 1080I

7.

1920*1080

26.97 / 27

23.97 / 24

74.17 / 74.25

HDTV 1080P

8.

1920*1080

33.716 / 33.75

29.976 / 30.00

74.25

HDTV 1080P

9.

1920*1080

56.250

50

148.5

HDTV 1080P

10.

1920*1080

67.43 / 67.5

59.94 / 60

148.35/148.50

HDTV 1080P

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

-8-

Remark

LGE Internal Use Only

ADJUSTMENT INSTRUCTION
1. Application Range

(2)

This specification sheet is applied to all of the OLED TV with


OD01J chassis.

(3)

2. Designation
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment: Free Voltage
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 C 5 C
Relative humidity : 65 % 10 %
Input voltage : 220 V, 60 Hz
6) Adjustment equipments: Color Analyzer(CA-210 or CA110), Pattern Generator(MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, service remote control.
7) Push The IN STOP key - For memory initialization.

Please Check the Speed :


To use speed between
from 200KHz to 400KHz

5) Click Auto tab and set as below


6) Click Run.
7) After downloading, check OK message.
(4)

filexxx.bin
(5)

(7)

.OK

(6)

Case1 : Software version up


1. After downloading S/W by USB, TV set will reboot
automatically
2. Push In-stop key
3. Push Power on key
4. Function inspection
5. After function inspection, Push In-stop key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
In-stop key at first.
2. Push Power on key for turning it on.
-> If you push Power on key, TV set will recover
channel information by itself.
3. After function inspection, Push In-stop key.

* USB DOWNLOAD (*.epk file download)


1) Put the USB Stick to the USB socket.
2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didnt work. But your downloaded version is High, USB
data is automatically detecting.
3) Show the message Copying files from memory.

3. Main PCB check process


* APC - After Manual-Insult, executing APC

* Boot file Download


1) Execute ISP program Mstar ISP Utility and then click
Config tab.
2) Set as below, and then click Auto Detect and check OK
message
If Error is displayed, Check connection between
computer, jig, and set.
3) Click Read tab, and then load download file (XXXX.bin)
by clicking Read
(1)
fi lexxx.bin

4) Click Connect tab. If Cant is displayed, check


connection between computer, jig, and set.
Copyright 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

-9-

LGE Internal Use Only

4. Total Assembly line process

4) Updating is staring.

4.1. Adjustment Preparation


W/B Equipment condition
CA210 : CH 17(OLED), Test signal : Inner pattern (85IRE)
Above 30 minutes H/run in the inner pattern. (power on key
of adjust remote control)
Cool

13,000

X=0.269(0.002)

Medium

9,300

X=0.285(0.002)

Warm

6,500

Y=0.273(0.002)
Color
Teperature

Y=0.293(0.002)
X=0.313(0.002)
Y=0.329(0.002)

* Connecting picture of the measuring instrument


(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER ON ->
Enter the mode of White-Balance, the pattern will come out.

Full White Pattern

CA-210
COLOR
ANALYZER
TYPE: CA-210

RS-232C Communication

5) Uploading completed, The TV will restart automatically.


6) If your TV is turned on, check your updated version and
Tool option.(explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didnt
have a DTV/ATV test on production line.

* Auto-control interface and directions


1) Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10 lux).
2) Adhere closely the Color Analyzer (CA210) to the module
less than 10 cm distance, keep it with the surface of the
Module and Color Analyzers prove vertically.(80 ~ 100).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using no signal or full white pattern or the others,
check the back light on.

* After downloading, have to adjust Tool Option again.


1) Push "IN-START" key in service remote controller
2) Select Tool Option 1 and Push OK button.
3) Punch in the number. (Each model hax their number)
Model

Tool option1

Tool option2

Tool option3

Tool option4

15EL9500

59648

512

49312

3328

Auto adjustment Map(RS-232C)


RS-232C COMMAND
[CMD ID DATA]
Wb 00
00
White Balance Start
Wb 00
ff
White Balance End

4) Completed selecting Tool option.

RS-232C COMMAND MIN

3.1. Function Check


* Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART1/SCART2/ CVBS)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60hz)
5) HDMI
6) PC Audio In
* Display and Sound check is executed by Remote control

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

CENTER

[CMD ID DATA]
Cool

Mid

Warm

R Gain

jg

Ja

jd

G Gain

jh

Jb

je

B Gain

ji

Jc

jf

R Cut

MAX

(DEFAULT)
Cool

Mid

Warm

00

172

192

192

192

00

172

192

192

192

00

192

192

172

192

64

64

64

128

G Cut

64

64

64

128

B Cut

64

64

64

128

- 10 -

LGE Internal Use Only

** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)

- Auto Download
After enter Service Mode by pushing ADJ key,
Enter EDID D/L mode.
Enter START by pushing OK key.

* Manual W/B process using adjusts Remote control.


After enter Service Mode by pushing ADJ key,
Enter White Balance by pushing G key at 6. White
Balance.

* Edid data and Model option download (RS232)


* After done all adjustments, Press In-start button and
compare Tool option and Area option value with its BOM, if
it is correctly same then unplug the AC cable. If it is not
same, then correct it same with BOM and unplug AC cable.
For correct it to the models module from factory Jig model.
* Push the IN STOP key after completing the function
inspection. And Mechanical Power Switch must be set
ON.

Item

CMD1 CMD2 Data0

Download

0 When transfer the Mode In,

00 10 Automatically Download

Mode In
Download

Carry the command.

(The use of a internal pattern)

- Manual Download

4.2. DPM operation confirmation


(Only Apply for MNT Model)
Check if Power LED color and Power Consumption operate
as stanard.
Set Input to RGB and connect D-sub cable to set.
Measurement Condition: 100-240V~, 50 / 60 Hz.
Confirm DPM operation at the state of screen without Signal.

4.3. DDC EDID Write (HDMI 256Byte)

* Caution
1) Use the proper signal cable for EDID Download
- Digital EDID : Pin3 exists
2) Never connect HDMI & D-sub Cable at the same time.
3) Use the proper cables below for EDID Writing
4) Download HDMI1, HDMI2, separately because HDMI1 is
different from HDMI2
For HDMI EDID
DVI-D to HDMI or HDMI to HDMI

Connect HDMI Signal Cable to HDMI Jack.


Write EDID Data to EEPROM(24C02) by using DDC2B
protocol.
Check whether written EDID data is correct or not.
* For SVC main Assembly, EDID have to be downloaded to
Insert Process in advance.

4.4. EDID DATA

Item

1) All Data : HEXA Value


2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

- 11 -

Condition

Data(Hex)

Manufacturer ID

GSM

1E6D

Version

Digital : 1

01

Revision

Digital : 3

03

LGE Internal Use Only

1) HD HDMI EDID data


00

00

FF

FF

FF

FF

FF

FF

00

1E

6D

01

03

80

73

41

78

0A

CF

74

A3

57

4C

B0

23

4C

A1

08

00

81

C0

61

40

45

40

31

40

01

01
2C

10

09

48

30

01

01

01

01

01

01

02

3A

80

18

71

38

2D

40

58

40

36

00

7E

8A

42

00

00

1E

01

1D

00

72

51

D0

1E

20

50

6E

28

55

00

7E

8A

42

00

00

1E

00

00

00

FD

00

3A

60

3E

1F

46

10

00

0A

20

20

20

20

20

20

05

14

03

02

02

90

22

A0
B0

80

03

20

F1

4E

15

01

26

80

18

01

f
00

9E

Press Power on key of service remocon.


(Baud rate : 115200 bps)
Connect RS232 Signal Cable to RS-232 Jack.
Write Serial number by use RS-232.
Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).

20

70

5. Model name & Serial number D/L

12

01

20

21

10

1F

84

13

15

07

50

09

57

07

71

1C

16

20

58

2C

25

00

72

8A

42

00

1D

00

80

51

DO

0C

20

40

80

35

00

72

8A

C0

42

00

00

1E

8C

0A

D0

8A

20

E0

2D

10

10

3E

96

00

D0

7E

8A

42

00

00

18

02

3A

80

18

71

38

2D

40

58

2C

E0

45

00

7E

8A

42

00

00

1E

01

1D

80

D0

72

1C

16

20

F0

10

2C

25

80

7E

8A

42

00

00

9E

00

00

00

00

00

F9

5.1. Signal TABLE


* Detail EDID Options are below
Product ID

CMD

Model Name

HEX

EDID Table

DDC Function

HD Model

0000

00 00

Digital

Serial No: Controlled on production line.


Month, Year: Controlled on production line:
ex) Monthly : 02 -> 02
Year : 2009 -> 13
Model Name(Hex):
MODEL
LG TV

00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20

Vendor Specific(HDMI)
HDMI1

65030C001000011D

ADL

DATA_1

...

Data_n

CS

DELAY

No.

Adjust mode

CMD(hex)

LENGTH(hex)

Description

EEPROM WRITE

A0h

84h+n

n-bytes Write (n = 1~16)

* Description
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,
Phase
Data write : Model Name and Serial Number write in
EEPROM,.

Checksum: Changeable by total EDID data.


MODEL NAME(HEX)

ADH

5.2. Command Set

MODEL NAME(HEX)

INPUT

LENGTH

CMD : A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 ++ Data_n
Delay : 20ms

5.3. Method & notice


A. Serial number D/L is using of scan equipment.
B. Setting of scan equipment operated by Manufacturing
Technology Group.
C. Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0.

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

- 12 -

LGE Internal Use Only

* Manual Download (Model Name and Serial Number)


If the TV set is downloaded by OTA or Service man, Sometimes
model name or serial number is initialized.(Not always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the instart key of ADJ remote controller.
2) Go to the menu 5.Model Number D/L like below photo.
3) Input the Factory model name(ex 42LH4000-ZA) or Serial
number like photo.

4) Check the model name Instart menu -> Factory name


displayed (ex 42LH4000-ZA)
5) Check the Diagnostics (DTV country only) -> Buyer model
displayed (ex 42LH4000)

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

- 13 -

LGE Internal Use Only

RS-232C

XC5000
IC600

LNA
IC1002

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

MAX3232CDR
IC701

DRXK
(IC601)

Tuner_SCL I2C

Tuner_SDA I2C

IF_AGC I2S

V_MAIN, SIF

FE_TS_ Data

(LGE3369A)

IC100

- 14 DP, DM

I2S

I2C

Host Address[0:7]

Touch Key

HDMI1

USB

L/R

SERIAL FLASH
IC103

NAND Flash
IC102

DDR2 SDRAM
(512MB)
IC301

Digital amp
(NTP3100-L)
IC700

OLED Panel

EEPROM
(HDCP)IC400

EEPROM
(IC104)

4Ch LVDS (10 bit)

DDR2 SDRAM
(1G)
IC300

IR (light logo)

DDR2 Address[0:12]

DDR2 Data[0:15]

DDR2 Address[0:12]

DDR2 Data[0:15]

FRC
(LGE7329A)
IC901

DDR2 (512MB * 2)
IC1000/1001

BLOCK DIAGRAM

LGE Internal Use Only

EXPLODED VIEW
IMPORTANT SAFETY NOTICE

100

200

400

300

600

500

LV1

A2

700

800

900

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by
in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

Copyright
LG Electronics. Inc. All rights reserved.
Only for training and service purposes

- 15 -

LGE Internal Use Only

IC102
HY27US08121B-TPCB

+3.3V

NAND FLASH MEMORY

+3.3V
001:H28 S6_Reset

NC_8
VCC_1
VSS_1

OPT

+3.3V

R113
1K

NC_9

10K

CLE
/PF_CE1
ALE

OPT
R100
10K

WE
/PF_WE
WP
NC_11

R123
1K

C
Q101
KRC103S

PF_WP

NC_12
NC_13

R99
10K

43

42

41

40

10

39

11

38

12

37

13

36
35

15

34

16

33
32

17

PF_ALE

R108

R103
0

NC_14
NC_15

18

31

19

30

20

29

21

28

22

27

23

26

24

25

AR100
PCM_A[7]

I/O6

PCM_A[6]

I/O5

PCM_A[5]

D4

I/O4

AA15

PCM_A[4]

AC6
Y10

C102
10uF 6.3V

PRE

PCM_A[0-7,10-11]

VCC_2
ISP_RXD_SOC
VSS_2

C103

SCL

0.1uF

NC_22

ISP_TXD_SOC

SDA

NC_20

AR101
PCM_A[3]

I/O2

PCM_A[2]

PCM_D[5]

Y11

PCM_D[6]

Y12

PCM_D[7]

Y13

PCM_A[0]

AB16

PCM_A[1]

AC15

PCM_A[2]

AC14

PCM_A[3]

AB14

PCM_A[4]

NC_21

I/O3

AC12

PCM_A[5]

AB8

PCM_A[6]

AC13

PCM_A[7]

AA9
AB5
AA4

PCM_A[1]

I/O1

PCM_A[10]

V4

PCM_A[11]

Y4

PCM_A[0]

I/O0

AB9

22

NC_19

AA7
+5V_GENERAL

AD6

NC_17
NC_16
/PCM_OE

AR103
/PCM_CE

R189

33

AA14

R190

33

AB18

R191

33

Y5

R192

33

AB15

R193

10K

AA10

R194

10K

AC8

R195

33

AC7

R196

33

AA5

R197

33

W4

R198

33

T4
AE6
AF6

/PF_CE1

+3.3V_ST

AA12

/PF_OE

+24V

3
OPT

1
2

+3.3V_ST

+3.3V_ST

SW101
R146
0

22

AR102

/PF_WE

AA11
AC9

PF_ALE
SWITCH

Y14

PF_WP

AB11

/F_RB
R135
30K
1%

R131
10K

IC105

R158
100

MAX810RTR
VCC

POWER_DET

20pF

PCMD0/CI_D0

E6

PCMD1/CI_D1

EEPROM_SCL
EEPROM_SDA
Q104
2SC3052

SDA0
SCL0

10K

PCMD3/CI_D3

AE11

PCMD4/CI_D4

SPI_DI

PCMD5/CI_D5

SPI_DO

PCMD6/CI_D6

/SPI_CS

PCMD7/CI_D7

SPI_CK

ISP_RXD_SOC

S6_Reset
C106
10uF
6.3V

R159
10K

OPT

ISP_TXD_SOC
DBG_RX

R181
R182

33
33

D11

R183
R184

33

AB21

33

AC21

R178
R179

22

J1

IC103

VCC

SPI_CS

AD11

R16

33

SPI_CK

SPI_DO

USB_DM

PCM_A3/CI_A3

B5

PCM_A4/CI_A4

USB_DP_1

PCM_A5/CI_A5

USB_DM_1

PCM_A6/CI_A6

USB_DM_2

PCM_A7/CI_A7

USB_DP_2

USB

A5
AC10
AB10
+3.3V_ST

PCM_A8/CI_A8

PM GPIO Assignment Recommended by MStar

PCM_A9/CI_A9
10K
R34

PCM_A10/CI_A10
PCM_A11/CI_A11

3.3K
R32

R35

100

PCM_A12/CI_A12

LOGIC_POWER_ONR41

100

R44

PCM_A13/CI_A13

22

J2

R180

22

W5

GPIO_PM1/GPIO135

/PCM_OE

GPIO_PM2/GPIO136

PCM_REG/CI_CLK

GPIO_PM3/GPIO137

PCM_WAIT/CI_WACK

GPIO_PM4/GPIO138

/PCM_IRQA

GPIO_PM5/INT1/GPIO139

/PCM_WE

GPIO_PM6/INT2/GPIO140

PCM_IOWR/CI_WR

GPIO131/LDE/SPI_WPn1

PCM_IOR/CI_RD

GPIO130/LCK
GPIO132/LHSYNC/SPI_WPn

/PF_CE0

GPIO60/PCM2_RESET/RX1

/PF_CE1

GPIO62/PCM2_CD_N/TX1

V5

R45

F5

100

POWER_ON
R46

G5

100

LOGO_LED
R29
100

H5

R42

F6

DBG_RX

100

POWER_DET

G6
Interrupt for ISP Wake up in STB Mode

H6
AC17
AB17

R21

+3.3V

100
100

AF11

R23

AA18

R24

33

AA17

R25

33

Flash_WP_1

+3.3V

SDA1
SCL1

/PF_OE
/PF_WE
PF_ALE

I2C for Tuner_5V

PF_AD15

E7
LHSYNC2/I2S_OUT_MUTE/RX1
LVSYNC/GPIO133

F8

22

DBG_TX
POWER_DET

OPT
GPIO_PM0/GPIO134

PCM_CD/CI_CD

/PCM_CE

100

PANEL_POWER_ON

E5
PCM_RST/CI_RST

UART2_TX/SCKM

GPIO79/LVSYNC2/TX1

UART2_RX/SDAM

UART2_RX/GPIO84

DDCR_DA

UART2_TX/GPIO85
UART1_RX/GPIO86
UART1_TX/GPIO87

DDCA_CLK
DDCA_DA

GPIO42/PCM2_CE_N

UART_TX2

TS0_D2

NCP810 : Open Drain

TS0_D3
TS0_D5

R136
5.1K
1/10W
5%

C6

FE_TUNER_SCL
33

R30

FE_TUNER_SDA

F9
F10

USB_OCD

5V Tolerance

A6
B6
AF5
AF10
AA8

TS0_D0

MAX810 : CMOS

33

R31

AC18

GPIO43/PCM2_IRQA_N

UART_RX2

TS0_D4
16V
0.1uF
C109

SPI_DI

33

USB_DP

TS0_D1

GND

33

R15

PCM_A2/CI_A2

NCP803SN293

R132
OPT

R14

AE12

AF12

PCM_A1/CI_A1

DDCR_CK

R185

DBG_TX

PCM_A0/CI_A0

E
C105
4.7uF
10V

R133

R18

TESTPIN/GND

PCMD2/CI_D2

F_RBZ

22

R164 100
C

R155

RESET

GND

RESET

20pF
C13

A3

PCM_A14/CI_A14

NC_18

/PF_CE0

POWER DETECT

XIN
XOUT

AC16

22

NC_23

B3

HWRESET

+5V_GENERAL

AA16
NC_24

R33
1M

PCM_D[5-7]

I/O7

X12

44

14

NC_10

+3.3V_ST

C12

NC_25

R143
2.7K

0.1uF

C100

R128

OPT

1K

NC_7

45

IC100
LGE3369A (SATURN6 NON RM)

PCM_A[0-7]

NC_26

R142
2.7K

CE

NC_27

R38
15K
OPT

RE
/PF_OE
/PF_CE0

46

OPT

R/B

47

12MHz

3.9K

NC_5
NC_6

R129

1K
R127

/F_RB

NC_4

2
3

ISP FOR BOOT

R37
15K

NC_2
NC_3

48

OPT
R163

/PF_CE0
H : Serial Flash
L : NAND Flash
/PF_CE1
H : 16 bit
L :
8 bit

NC_28

OPT
R160

NC_1

TS0_D6
TS0_D7
TS0_SYNC
TS0_VLD

Y8
Y9
AB7
AA6
AB6
U4
AC5
AC4
AD5
AB4

TS0_CLK
AB19
TS1_D0

Serial FLASH MEMORY


for BOOT

EEPROM

PWM0

AB13

PWM1

AB12
AD12

HOLD#

33
WP#

SCLK

SPI_CK

10 : BOOT 51
11 : BOOT RISC

L101

E1

VCC

C104
0.1uF

R161

WC

Q100
KRC103S

E2

SI

SPI_DI

R134
0 VSS

R175

R176

A4

KEY2

B4
F4
E4

R157

EEPROM_SDA
C107
8pF
50V

C4

R177 OPT 0

+3.3V
PWM0
R162

1K

PWM2

PWM1

BUF_TS_SYN

AC19

BUF_TS_VAL_ERR

AA19

BUF_TS_CLK

C10

PWM3

ET_TXD0

SAR0

ET_TX_CLK

SAR1

ET_RXD0

ET_TXD1

SAR2

ET_RXD1

SAR3

ET_TX_EN

IRIN

ET_MDC

OPT
100
100

B11
A9

R13
R26

C11
OPT

C9
B10

EEPROM_WP

A10
B9

R27

4:S5

FE_RESET

A11

ET_COL
GPIO44

R187

100

R188

D7

TUNER_RESET

R10

E11

LNA_SWITCH_SEL
NTP_MUTE

R48

100

E8

R11

100

E10

AMP_RST
MEMC_RESET

1K

22
C108
R148
8pF
50V

D6

D7

E11

B9

D10

OPT

OPT
R172

4.7K
R174

OPT
R170

R166

OPT
R168

D5

I2C

TS1_CLK

BUF_TS_DATA[0]

AA20

D9

Touch_Test

D6

JTEG

PWM1

AC11

1K
OPT

22
R145

SDA

TS1_VLD

ET_MDIO

SCL

EEPROM_SCL

R199

PWM0

1K

OPT
R156

GND

SB_MUTE

KEY1

IR

0 B

Soft_Reset
+3.3V

E0

OPT

IC104
M24512-WMW6G(REV.B)

OPT
R173

SO

R115

0
OPT

L100

VCC

OPT
R171

1K
R169

R107
10K
R101

R102

Stand-by GPIO(SAR[0-3])

OPT
R167

+3.3V
SPI_DO

AA13

MCU BOOT STRAP

BLM18PG121SN1D
CS#

SPI_CS

+3.3V

R165

Flash_WP_1

+3.3V
IC101
MX25L3205DM2I-12G

0.1uF
C101

R117
4.7K

+3.3V

TS1_SYNC

C5

GPIO96
GPIO88
GPIO90/I2S_OUT_MUTE
GPIO91
GPIO97
GPIO98
GPIO99
GPIO103/I2S_OUT_SD3
GPIO102

+3.3V
R1026
4.7K

+3.3V

10K

4.7K

4.7K

R152

R153

R114
1K

MODEL_OPT_0 (D6) : LCD (H) / PDP (L)


MODEL_OPT_1 (D7) : FRC (H) / NO FRC (L)
R118

R110
10K
OPT

PCM_A[11]

JTINT

R119

PCM_D[5]

/JTRST

R120 OPT

PCM_D[7]

JTCK

R121 OPT

/PCM_CE

JTMS

R122

/PCM_OE

JTDO

R124

PCM_A[10]

PULL UP is applied on the FRC

MODEL_OPT_2 (E11) : LED NORMAL (H)


+3.3V

NO LED NORMAL (L)


MEMC_SDA

R138

33

MEMC_SCL

R139

33

FE_DEMOD_SDA

R140

33

FE_DEMOD_SCL

R141

33

MODEL_OPT_3 (B9) : FHD (H) / HD (L)

PULL UP is applied on the JACK


OPT
R43
3.3K

R106

R147
2.7K

R144
2.7K

+3.3V

SDA0
SCL0

R47
0

JTDI
EEPROM_SDA

R125

PCM_D[6]

/RST

R111
10K

PANEL_RESET

EEPROM_SCL

A7
GPIO67

R12

100

B8

GPIO68

USB_CTL R39
1K

C
B

Q12
2SC3052

OPT
E

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

OLED
FLASH/GPIO

09.08.31
1

LGE Internal Use Only

+1.26V_VDDC

Audio Mute
C238
0.1uF

C242
0.1uF

C246
0.1uF

C249
0.1uF

C252
0.1uF

C255
0.1uF

C258
0.1uF

C261
0.1uF

C264
0.1uF

C267
0.1uF

C270
0.1uF

C273
0.1uF

C247
0.1uF

C250
0.1uF

C253
0.1uF

C256
0.1uF

C259
0.1uF

C262
0.1uF

C265
0.1uF

C269
0.1uF

C272
0.1uF

C275
10uF

C276
0.1uF

C277
0.1uF

C279
0.1uF

R215

10K

+3.3V_ST

+1.26V_VDDC

D200
ENKMC2838-T112
A1

C235
0.1uF
16V

SB_MUTE

AMP_MUTE
007:Y15

A2

C239
0.1uF

C243
0.1uF

NTP_MUTE

C240
0.1uF

L205
BLM18PG121SN1D

C244
0.1uF

C248
0.1uF

C251
0.1uF

C254
0.1uF

IC100
LGE3369A (SATURN6 NON RM)

C257
0.1uF

C260
0.1uF

C263
0.1uF

C266
0.1uF

C268
0.1uF

C271
0.1uF

C274
10uF

C278
0.1uF

C280
0.1uF

C287
0.1uF

C291
0.1uF

C299
0.1uF

C295
0.1uF

C60
0.1uF

C62
0.1uF

C61
0.1uF

VDDC : 970mA
+1.26V_VDDC

+3.3V

R1027
4.7K

R1028
4.7K

LVA0P

G2 RXA0P
G3 RXA0N

LVA1P

H3 RXA1P
G1 RXA1N

SDA2

R942

SCL2

R943

AE16

F1 RXACKP
F2 RXACKN

H1 RXA2P
H2 RXA2N
A1 DDCD_A_DA
B2 DDCD_A_CK
A2 HOTPLUG_A

LVA0M
LVA1M
LVA2P
LVA2M
LVA3P
LVA3M
LVA4P

AD16
AD15
AF16
AF15
AE15
AD13
AF14
AF13
AE13

LVA4M

D2 RXB1P
D3 RXB1N

LVB1P

E1 DDCD_B_DA
F3 DDCD_B_CK

OPT

E2 HOTPLUG_B

R944
0
CK+_HDMI1
CK-_HDMI1
D0+_HDMI1
D0-_HDMI1
D1+_HDMI1
D1-_HDMI1
D2+_HDMI1
D2-_HDMI1
HDMI_SDA_1
HDMI_SCL_1
HPD1
CEC_REMOTE

LVB1M
LVB2P
LVB2M
LVB3P
LVB3M
LVB4P

RXCCKP

AD8

RXCCKN
RXC0P
RXC0N

AF9

RXC1P

AE9

RXC1N

AE10

RXC2P

AD10

RXC2N

AUL0

AE7

DDCD_C_DA

AF7

AUR1

0
100

DDCD_C_CK

AUL1

R204

100

N2 HSYNC0/SC1_ID
N1 VSYNC0/SC1_FB
P2 RIN0P/SC1_R
R3 GIN0P/SC1_G

47

R209

47
47

R210

C201

OPT
0.047uF
OPT
0.047uF

C202

OPT
0.047uF

C200

002:Z22;009:R28

F7

MEMC_RXE2+

002:Z23;009:R28

L9

MEMC_RXE2-

002:Z23;009:R28

L10

MEMC_RXE3+

002:Z25;009:Q28

L11

MEMC_RXE3-

002:Z25;009:Q28

MEMC_RXE4+

002:Z26;009:Q28

MEMC_RXE4-

002:Z25;009:Q28

AF20
AE19
AD17
AF18
AF17
AE17

R2 GINM

002:Z24;009:Q28

L14

002:Z24;009:R28

L15

R211

47

C203

0.047uF

M1 CVBS4/S-VIDEO_Y
M2 CVBS6/S-VIDEO_C
R213

47

C208

0.047uF

R214

47

C209

0.047uF

R212

100
100

C206

0.047uF

C207

0.047uF

R207

N3 CVBS5
M3 CVBS7
W1 CVBS0/RF_CVBS
Y3 VCOM0
Y2 CVBSOUT0/SC2_MNTOUT
AA2 CVBSOUT1

GND_12

H18

VDDC_7

H19

VDDC_8

H20

VDDC_9

J20

VDDC_10

K20

VDDC_11

L20

VDDC_12

M20

VDDC_13

P7

VDDC_14

R7

VDDC_15

T7

GND_15

MEMC_RXO1+

002:Z18;009:U28

M9

VDDC_16

GND_16

VDDC_17

002:Z18;009:U28

T22

VDDC_18

MEMC_RXO2+

002:Z18;009:U28

M10

GND_17

MEMC_RXO2-

002:Z18;009:U28

M11

VDDC_19

GND_18

MEMC_RXO3+

002:Z20;009:T28

M12

VDDC_20

MEMC_RXO3-

002:Z20;009:T28

M13

MEMC_RXO4+

002:Z21;009:S28

M14

002:Z21;009:T28

M15
M16

MEMC_RXOC+
MEMC_RXOC-

M17

002:Z19;009:T28
002:Z19;009:T28

N9
N10

Y1

N11

AE1

N12

AF3

N13

AE3

N14

GND_19

VDDC_21

GND_20

VDDC_22

GND_21

VDDC_23

GND_22

VDDC_24

GND_23

VDDC_25

GND_24

VDDC_26

N16
N17
N18
P4
P9

SIF0P

W2

0.1uF

C223

0.1uF

R230
R231

47
47

FE_SIF

004:C13

P13
P14

SPDIF_IN

P15

5V_HDMI_1

E9

P16

SPDIF_OUT

P17
P18

VDDP_1

GND_28

VDDP_2

GND_29

VDDP_3

GND_30

VDDP_4

GND_31

VDDP_5

GND_32

VDDP_6
VDDP_7

GND_33

AD1
AD2

R12
R221 OPT
R222 OPT

100

R13

100

I2S_OUT_WS
I2S_OUT_BCK
I2S_OUT_SD

A8

R223

22

B7

R224

22

C7

R225

22

D8

R226

22

C8

R227
100 OPT

I2S_IN_SD

C229
22pF
OPT

+3.3V
K4
VCLAMP
REFP
REFM

C210

C225

H4
J4
G4

REXT

C227
0.1uF

0.1uF

R216

0.1uF
390

AE5
AUCOM
AUVRM
AUVRP
AUVAG

C211

0.1uF

AE4
AF4
AD4

C212

10uF 10V

C213

0.1uF

C214

1uF
4.7uF

C215

C232
22pF
OPT

C237
22pF
OPT

R15

W11
W12
W19
W20
W22
Y22

H11
H12
N20
P20
W9
W10
+3.3V_AVDD

GND_34
GND_35
GND_36

L201
BLM18PG121SN1D

W7

007:K22

R17

MS_LRCK

007:K16

R18

MS_SCK
MS_LRCH

007:K16
007:K17

T5
T9
T10
T11
T12

+1.8V_DDR

GND_38

G12
AVDD_DDR_1
AVDD_DDR_3

GND_40

AVDD_DDR_4

GND_41

AVDD_DDR_5

GND_42

AVDD_DDR_6

GND_43

AVDD_DDR_7

GND_44

AVDD_DDR_8

GND_45

AVDD_DDR_9

GND_46

AVDD_DDR_10

GND_47

AVDD_DDR_11

G13

GND_48

AVDD_MEMPLL_1

GND_49

AVDD_MEMPLL_2

GND_50

T17
T18
U5
W13
Y21
AA23

C297

0.1uF

0.1uF

H13
H14
H15
H16

AVDD_DDR : 18.31mA

W14
W15
W16
W17

AVDD_MEMPLL_3

L202
BLM18PG121SN1D

T20

C284

V20

C289

0.1uF 0.1uF

C293

C51

0.1uF

0.1uF
+3.3V

GND_52
GND_53
GND_54

AVDD_LPLL : 4.69mA

L203
BLM18PG121SN1D

R20
AVDD_LPLL
+3.3V_AVDD_MPLL

GND_56
GND_57

AVDD_MEMPLL : 23.77mA

+3.3V

W18

GND_51

H7
AVDD_MPLL

GND_58

C282

C285
10uF
10V

GND_59
0.1uF

GND_60

C296

C53

0.1uF

0.1uF

AVDD_MPLL : 7.76mA

GND_61

+3.3V

GND_62

GND_64

AVDD_33_2

GND_65

AVDD_33_3

GND_66

AVDD_33_4

GND_67

AVDD_33_5

AVDD_33 : 281mA

L204
BLM18PG121SN1D

J7
AVDD_33_1

T13

T16

C288

H17

GND_63

T14

AVDD_AU : 36.11mA

AVDD_AU

GND_37

GND_55

AUDIO_MASTER_CLK

VDDP : 102.3mA

H10

R16

T15
C226
0.1uF

1%
Check

C231
22pF
OPT

R14

OPT

AC1

AUOUTL2/SC2_LOUT

OPT
R235
22K

AUOUTR2/SC2_ROUT

R11

OPT
C245
0.01uF

AUOUTL1/SC1_LOUT

R10

AD3

OPT
R234
22K

AUOUTR1/SC1_ROUT

R9

AF2

V22

VDDP_8

R4

AF1
AUOUTR0/HP_ROUT

V7

H9

GND_27

P11
P12

SIF0M

U22

+3.3V_VDDP

GND_26

AVDD_DDR_2
C222

U20

VDDC_27

GND_39
W3

U7

GND_25

N15

P10

I2S_OUT_MCK

T1 CVBS3/SIDE_CVBS
T2 VCOM1

GND_11

D20

VDDC_6

L18

J5 VSYNC2

U3 CVBS1/SC1_CVBS
U2 CVBS2/SC2_CVBS

GND_10

D19

VDDC_5

002:Z17;009:V28

C241
0.01uF

U1 BIN2P/COMP_PB+
V3 SOGIN2

GND_9

D18

VDDC_4

MEMC_RXO0-

AUR2
AUL2 AE2
AA1
AUR3
AB1
AUL3
AB2
AUR4
AC2
AUL4
AB3
AUR5
AC3
AUL5

AUOUTL0/HP_LOUT
V1 RIN2P/COMP_PR+
V2 GIN2P/COMP_Y+

GND_7

D17

VDDC_3

GND_13
GND_14

L1 RIN1P/DSUB_R
L3 GIN1P/DSUB_G
K1 BIN1P/DSUB_B
L2 SOGIN1

GND_6

D16

VDDC_2

L17

F11
K3 HSYNC1/DSUB_HSYNC
K2 VSYNC1/DSUB_VSYNC

GND_5

L12

R1 BIN0P/SC1_B
P3 SOGIN0/SC1_CVBS
P1 RINM
T3 BINM

GND_4

VDDC_1

002:Z17;009:U28

MEMC_RXO4-

AD18

GND_3

MEMC_RXO0+

MEMC_RXO1-

AF19

GND_2

GND_8

AA3
AUR0

R203

J3 CEC

MEMC_RXE1-

N4

R201

HOTPLUG_C

E18

M18

R200

R208

AD19

LVBCKM

AF8

AD7

AD20

AE18
LVBCKP

E17

002:Z23;009:R28

L16

LVB4M

AE8
AD9

LVB0M

E16

002:Z22;009:S28

MEMC_RXE1+

MEMC_RXEC-

AE20
LVB0P

002:Z22;009:S28

MEMC_RXE0-

MEMC_RXEC+

AD14

LVACKM

C1 RXB0P
C2 RXB0N

E3 RXB2P
D1 RXB2N

OPT
R945
0

LVACKP

MEMC_RXE0+

L13

AE14
C3 RXBCKP
B1 RXBCKN

TV/MNT

C283
0.1uF

IC100
LGE3369A (SATURN6 NON RM)

HDMI

FE_VMAIN

+3.3V

+3.3V_VDDP

+1.8V_DDR

K7
L7
M7

C292

C294

0.1uF

0.1uF 0.1uF 0.1uF 0.1uF

C298

C50

C55

C52

0.1uF

N7
+3.3V

GND_68
GND_69
GND_70
GND_71
GND_72
GND_73

L206

W8

AVDD_DM : 0.03mA

AVDD_DM

H8

+3.3V
L200
BLM18PG121SN1D

AVDD_OTG : 22.96mA

BLM18PG121SN1D
C56
C54
0.1uF

AVDD_USB
C281
2.2uF
10V

C286

C290

0.1uF

0.1uF

0.1uF

Close to IC
as close as possible

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

OLED
AVIN/LVDS/PWR

09.08.31
2

MSD3368GV

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

DDR2 1.8V By CAP - Place these Caps near Memory

C341

0.1uF

C338

0.1uF

0.1uF

0.1uF
C337

0.1uF
C336

0.1uF
C335

C333

0.1uF
C334

0.1uF

0.1uF
C332

0.1uF
C331

0.1uF
C330

10uF
C328

0.1uF
C329

0.1uF
C327

0.1uF
C326

0.1uF
C325

0.1uF
C324

C322

C321
0.1uF

10uF
C323

0.1uF

0.1uF

C320

0.1uF

C318

0.1uF

C316

0.1uF

C315

0.1uF

C314

0.1uF
C312

10uF
C313

0.1uF

C311

0.1uF

C310

0.1uF

C309

0.1uF

C308

0.1uF

C307

0.1uF

C306

0.1uF

C304

C302

C301

C300
0.1uF

10uF

+1.8V_DDR

PI Result

+1.8V_DDR

H9

SDDR_D[6]

DQ6

SDDR_D[7]

DQ7

F9

SDDR_D[8]

DQ8

C8

SDDR_D[9]

DQ9

C2

F1

SDDR_D[10]

DQ10

D7

SDDR_D[11]

DQ11

D3

SDDR_D[12]

DQ12

D1

SDDR_D[13]

DQ13

D9

SDDR_D[14]

DQ14
DQ15

B1
B9

A1

VDD4

E1

VDD3

SDDR_A[1]

SDDR_A[1]

SDDR_A[10]

A2

SDDR_A[2]

N2

A3

SDDR_A[3]

N8

A4

SDDR_A[4]

A5

SDDR_A[5]

N7

A6

SDDR_A[6]

P2

A7

SDDR_A[7]

P8

A8

SDDR_A[8]

P3

A9

SDDR_A[9]

M2

A10/AP

SDDR_A[10]

P7

A11

SDDR_A[11]

R2

A12

SDDR_A[12]

L2

BA0

L3

BA1

L1

BA2

J8

CK

SDDR_CK

VDD1

R1

K8

CK

/SDDR_CK

K2

CKE

A9

K9

ODT

VDDQ9

C1

L8

CS

VDDQ8

C3

K7

RAS

VDDQ7

C7

L7

CAS

VDDQ6

C9

K3

WE

ADDR2_A[12]
ADDR2_A[7]
ADDR2_A[0]
ADDR2_A[2]

SDDR_A[2]

ADDR2_A[4]
ADDR2_A[6]

56
R322 56

SDDR_A[11]
SDDR_A[8]

R323

ADDR2_A[4]

A13

ADDR2_A[5]

A23

ADDR2_A[6]

C12

ADDR2_A[7]

B23

ADDR2_A[8]

B12

ADDR2_A[9]

C23

ADDR2_A[11]

ADDR2_A[12] A24

ADDR2_BA[0]

C24

56

R307

ADDR2_BA[1]

B24

R308

ADDR2_BA[2]

D24

56

R309

ADDR2_MCLK

B14

56

SDDR_BA[1]

1%

R347
1K
C22

ADDR2_A[10] B22
ADDR2_A[11] A12

ADDR2_A[8]

56

ADDR2_A[3]

R306

SDDR_BA[0]

1%

R344
1K

C319

1000pF

1K 1%

B13

AR301

SDDR_A[0]

OPT

1%
0.1uF

A22

ADDR2_A[2]

ADDR2_A[9]

SDDR_A[12]

SDDR_CKE

R301

C13

ADDR2_A[1]

SDDR_A[7]

SDDR_A[6]

R303
VDDQ10

ADDR2_A[0]

SDDR_A[4]

J9
M9

ADDR2_A[1]

A_DDR2_A0

B_DDR2_A0

A_DDR2_A1

B_DDR2_A1

A_DDR2_A2

B_DDR2_A2

A_DDR2_A3

B_DDR2_A4

A_DDR2_A5

B_DDR2_A5

A_DDR2_A6

B_DDR2_A6

A_DDR2_A7

B_DDR2_A7

A_DDR2_A8

B_DDR2_A8

A_DDR2_A9

B_DDR2_A9

A_DDR2_A11

B_DDR2_A10
B_DDR2_A11

A_DDR2_A12

B_DDR2_A12

A_DDR2_BA0

B_DDR2_BA0

A_DDR2_BA1
A_DDR2_BA2
A_DDR2_MCLK

22

B_DDR2_A3

A_DDR2_A4

A_DDR2_A10

B_DDR2_BA1
B_DDR2_BA2

T26

BDDR2_A[0]

AF26

BDDR2_A[1]

BDDR2_A[1]

T25

BDDR2_A[2]

BDDR2_A[10]

AF23

BDDR2_A[3]

T24

BDDR2_A[4]

AE23

BDDR2_A[5]

R26

BDDR2_A[6]

AD22

BDDR2_A[7]

R25

BDDR2_A[8]

AC22

BDDR2_A[9]

AD23 BDDR2_A[10]
R24

TDDR_A[9]

BDDR2_A[3]

TDDR_A[0]

A0

M8

TDDR_A[1]

TDDR_A[1]

A1

M3

TDDR_A[10]

TDDR_A[2]

A2

M7

TDDR_A[3]
56
AR311

BDDR2_A[5]

TDDR_A[5]
TDDR_A[12]

BDDR2_A[12]
56

BDDR2_A[7]
BDDR2_A[0]

TDDR_A[2]

BDDR2_A[4]

TDDR_A[4]
56

BDDR2_A[11] R326

AE22 BDDR2_A[12]

TDDR_A[0]

BDDR2_A[2]
BDDR2_A[6]

BDDR2_A[11]

TDDR_A[7]

AR313

BDDR2_A[8]

R327

TDDR_A[8]

56

AC23

BDDR2_BA[0]

R328

56

AC24

BDDR2_BA[1]

R329

56

AB22

BDDR2_BA[2]

R330

BDDR2_MCLK

R331

V25

B_DDR2_MCLK

R310

/ADDR2_MCLK

A14

56

R311

ADDR2_CKE

D23

V24
/A_DDR2_MCLK
A_DDR2_CKE

/B_DDR2_MCLK

AB23

OPT

22

BDDR2_CKE

R333

56
+1.8V_DDR

SDDR_ODT 56

R312

ADDR2_ODT

D14

/SDDR_RAS

56

R313

/ADDR2_RAS

D13

/SDDR_CAS

56

R314

/ADDR2_CAS

D12

/SDDR_WE

56

R315

/ADDR2_WE

D22

A_DDR2_ODT

OPT

/A_DDR2_CAS
/A_DDR2_WE

/B_DDR2_CAS

TDDR_A[5]

A5

N3

A6

N7

TDDR_A[7]

A7

P2

A8

P8

A9

P3

TDDR_A[10]

A10/AP

M2

TDDR_A[11]

A11

P7

TDDR_A[12]

A12

R2

BA0

L2

BA1

L3

NC4

L1

R349
TDDR_MCLK

TDDR_CKE

512M bit

G8

DQ0

TDDR_D[0]

G2

DQ1

TDDR_D[1]

H7

DQ2

TDDR_D[2]

H3

DQ3

TDDR_D[3]

H1

DQ4

H9

DQ5

TDDR_D[5]

F1

DQ6

TDDR_D[6]

F9

DQ7

C8

DQ8

TDDR_D[8]

C2

DQ9

TDDR_D[9]

D7

DQ10

D3

DQ11

D1

DQ12

TDDR_D[12]

D9

DQ13

TDDR_D[13]

B1

DQ14

TDDR_D[14]

B9

DQ15

A1

VDD5

E1

VDD4

J9

VDD3

CK

J8

M9

VDD2

CK

K8

R1

VDD1

CKE

K2

R346

ODT

R334

56

K9

A9

VDDQ10

CS

L8

C1

VDDQ9

U25

/BDDR2_RAS

R335

56

/TDDR_RAS

RAS

K7

C3

VDDQ8

U24

/BDDR2_CAS

R336

56

/TDDR_CAS

CAS

L7

C7

VDDQ7

/BDDR2_WE

R337

56

/TDDR_WE

WE

K3

C9

VDDQ6

AB24

OPT

VDDQ5

E9

E9

VDDQ5

VDDQ4

G1

G1

VDDQ4

VDDQ3

G3

G3

VDDQ3

G7

VDDQ2

G9

VDDQ1

VDDQ1

G9

SDDR_DQS0_P

56

R316

ADDR2_DQS0_P

B18

UDQS

SDDR_DQS1_P

56

R317

ADDR2_DQS1_P

C17

F3

LDM

B3

SDDR_DQM0_P

56

R318

ADDR2_DQM0_P

C18

UDM

SDDR_DQM1_P

56

R319

ADDR2_DQM1_P

A19

SDDR_DQS0_N

56

R320

ADDR2_DQS0_N

A18

SDDR_DQS1_N

56

R321

ADDR2_DQS1_N

B17

VSS5

A3

VSS4

E3

E8

LDQS

VSS3

J3

A8

UDQS

VSS2

N1

VSS1

P9

R3
R7

NC6

A2

NC1

E2

NC2

R8

NC3

ADDR2_D[11]

ADDR2_D[0]

B15

SDDR_D[12]

ADDR2_D[12]

ADDR2_D[1]

A21

ADDR2_D[9]

ADDR2_D[2]

A15

ADDR2_D[14]

ADDR2_D[3]

B21

ADDR2_D[4]

ADDR2_D[4]

C21

SDDR_D[3]

ADDR2_D[3]

ADDR2_D[5]

C14

SDDR_D[1]

ADDR2_D[1]

SDDR_D[9]
56
AR305

SDDR_D[14]

VSSQ10

B2

VSSQ9

B8

VSSQ8

A7

VSSQ7

D2

VSSQ6

D8

VSSQ5

E7

VSSQ4

F2

VSSQ3

F8

VSSQ2

H2

VSSQ1

H8

SDDR_D[4]

SDDR_D[6]
J7

SDDR_D[15]

VSSDL
+1.8V_DDR

56
AR304

ADDR2_D[15]

SDDR_D[8]

ADDR2_D[8]
ADDR2_D[10]

SDDR_D[10]
SDDR_D[13]
J1

VDDL

ADDR2_D[6]

56
AR306

ADDR2_D[13]

ADDR2_D[6]

C20

ADDR2_D[7]

C15

ADDR2_D[8]

C16

C19
ADDR2_D[9]
ADDR2_D[10] B16
ADDR2_D[11] B20

SDDR_D[7]

ADDR2_D[7]

SDDR_D[0]

ADDR2_D[0]

ADDR2_D[12] A20
ADDR2_D[13] A16
ADDR2_D[14] B19

SDDR_D[2]

ADDR2_D[2]

ADDR2_D[15] A17

SDDR_D[5]

ADDR2_D[5]

B_DDR2_DQS1

A_DDR2_DQM0

B_DDR2_DQM0

A_DDR2_DQSB0
A_DDR2_DQSB1

SDDR_D[11]

B_DDR2_DQS0

A_DDR2_DQS1

A_DDR2_DQM1

AR303
NC5

A_DDR2_DQS0

A_DDR2_DQ0
A_DDR2_DQ1

AB26

BDDR2_DQS0_P

R338

56

AA26

BDDR2_DQS1_P

R339

56

AC25

BDDR2_DQM0_P

R340

56

AC26

BDDR2_DQM1_P

R341

56

AB25

BDDR2_DQS0_N

R342

56

AA25

BDDR2_DQS1_N

R343

56

B_DDR2_DQM1

B_DDR2_DQSB0
B_DDR2_DQSB1
B_DDR2_DQ0
B_DDR2_DQ1

A_DDR2_DQ2

B_DDR2_DQ2

A_DDR2_DQ3

B_DDR2_DQ3

A_DDR2_DQ4

B_DDR2_DQ4

A_DDR2_DQ5

B_DDR2_DQ5

A_DDR2_DQ6

B_DDR2_DQ6

A_DDR2_DQ7

B_DDR2_DQ7

A_DDR2_DQ8

B_DDR2_DQ8

A_DDR2_DQ9

B_DDR2_DQ9

A_DDR2_DQ10

B_DDR2_DQ10

A_DDR2_DQ11

B_DDR2_DQ11

A_DDR2_DQ12

B_DDR2_DQ12

A_DDR2_DQ13

B_DDR2_DQ13

A_DDR2_DQ14

B_DDR2_DQ14

A_DDR2_DQ15

B_DDR2_DQ15

BDDR2_D[0]

BDDR2_D[11]

TDDR_D[11]

AE26

BDDR2_D[1]

BDDR2_D[12]

TDDR_D[12]

W24

BDDR2_D[2]

BDDR2_D[9]

AF24

BDDR2_D[3]

BDDR2_D[14]

AF25

BDDR2_D[4]

BDDR2_D[4]

V26

BDDR2_D[5]

AE25

BDDR2_D[6]

W26

BDDR2_D[7]

Y26
AD25
Y25

BDDR2_D[8]
BDDR2_D[9]
BDDR2_D[10]

AE24 BDDR2_D[11]
AD26 BDDR2_D[12]

TDDR_DQM0_P
TDDR_DQM1_P

TDDR_DQS0_N
TDDR_DQS1_N

LDQS

F7

UDQS

B7

LDM

F3

UDM

B3
A3

VSS5

LDQS

E8

E3

VSS4

UDQS

A8

J3

VSS3

N1

VSS2

P9

VSS1

B2

VSSQ10

B8

VSSQ9

A7

VSSQ8

D2

VSSQ7

R3

NC6

R7

NC1

A2

NC2

E2

TDDR_D[14]
AR307

56

TDDR_D[4]

BDDR2_D[3]

TDDR_D[3]

BDDR2_D[1]

TDDR_D[1]

BDDR2_D[6]

56
AR310

BDDR2_D[15]
BDDR2_D[8]

NC3

R8

TDDR_D[6]

D8

TDDR_D[15]
TDDR_D[8]

BDDR2_D[10]

VSSDL

J7

+1.8V_DDR

TDDR_D[10]
TDDR_D[13]

BDDR2_D[13]
AR308

56

TDDR_D[7]

BDDR2_D[7]

AD24 BDDR2_D[14]
AA24 BDDR2_D[15]

BDDR2_D[0]

TDDR_D[0]

BDDR2_D[2]

TDDR_D[2]

BDDR2_D[5]

NC5

TDDR_D[9]

BDDR2_D[13]

Y24

TDDR_DQS0_P
TDDR_DQS1_P

AR309

W25

BDDR2_D[0-15]

G7

LDQS

B7

ADDR2_D[0-15]

VDDQ2

F7

56

TDDR_D[7]

TDDR_D[10]
TDDR_D[11]

TDDR_D[15]

OPT

BDDR2_ODT

/B_DDR2_WE

TDDR_D[4]

+1.8V_DDR

U26
B_DDR2_ODT
/B_DDR2_RAS

N8

N2

TDDR_A[6]

TDDR_BA[1]
TDDR_BA[2]

R348
/A_DDR2_RAS

A4

R332

+1.8V_DDR

TDDR_A[4]

TDDR_BA[0]

/BDDR2_MCLK

B_DDR2_CKE

A3

TDDR_A[9]

TDDR_A[11]

56

TDDR_A[3]

TDDR_A[8]

TDDR_A[6]

22

22

J2

AR312
BDDR2_A[9]

ADDR2_A[10]

SDDR_A[9]

OPT

VDD2

56

56
AR302

SDDR_BA[2]
R300

1K

R325

SDDR_A[0]

A1

M7

N3

C317

R324

1K 1%

A0

M3

+1.8V_DDR
VDD5

R305 1K 1%

M8

OPT

SDDR_D[15]

1G bit

A_MVREF

ADDR2_A[3]

TDDR_D[0-15]

H1

DQ5

VREF

D15

ADDR2_A[5]

SDDR_A[3]

OPT

H3

DQ4

AR300

SDDR_A[5]

IC301
H5PS5162FFR-S6C

TDDR_A[0-12]

DQ3

SDDR_D[4]

VREF

C339 C340
0.1uF 1000pF

R345
150

SDDR_D[3]
SDDR_D[5]

J2

IC100
LGE3369A (SATURN6 NON RM)

BDDR2_A[0-12]

H7

+1.8V_DDR

ADDR2_A[0-12]

G2

DQ2

SDDR_A[0-12]

G8

DQ1

150
R302

SDDR_D[0-15]

DQ0

SDDR_D[1]
SDDR_D[2]

C305

C303 1000pF

IC300
HY5PS1G1631CFP-S6
SDDR_D[0]

0.1uF

R304

+1.8V_DDR

VDDL

J1

VSSQ6

E7

VSSQ5

F2

VSSQ4

F8

VSSQ3

H2

VSSQ2

H8

VSSQ1

TDDR_D[5]

56

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

OLED
DDR2

09.08.31
3

DDR

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

5V_HDMI_1
C
Q401
2SC3052

BODY_SHIELD
20

18

Reserved

17

SDA

16
15

SCL
CEC

14

DDC/CEC GND

13

TMDS Clock-

12

TMDS Clock+

11

TMDS Clock Shield 10


TMDS Data0-

TMDS Data0+

TMDS Data0 Shield

TMDS Data1-

TMDS Data1+

TMDS Data1 Shield

TMDS Data2-

TMDS Data2+

TMDS Data2 Shield

VDD[+5V]
RESERVED

+5V_GENERAL

R403
1K

HOT_PLUG_DETECT
R401
2K

SDA

R417

R418

Q400
SSM6N15FU
D403

HDMI_SDA_1

R412

SOURCE1

HDMI EDID EEPROM(2Kbit)

ENKMC2838-T112

HDMI_SCL_1
SCL

R427
68K

5V_HDMI_1

C401
0.1uF
16V

CEC_REMOTE

GATE1

HDMI_CEC
CEC
R413

DDC/CEC_GND

C416
0.1uF
16V

0
CK-_HDMI1

R419

TMDS_CLK-

R454
10K

0
CK+_HDMI1

TMDS_CLK_SHIELD

R421

TMDS_DATA0-

R422

R423

R453
100

D0-_HDMI1
1:AO24

EEPROM_WP

1:E32;I9

HDMI_SCL_1

D0+_HDMI1
TMDS_DATA0+
TMDS_DATA0_SHIELD

D1-_HDMI1
R424

TMDS_DATA1-

1:E33;I9

D1+_HDMI1

R456
10K

R457
10K
WP
R459
33

SCL

R460
33

SDA

HDMI_SDA_1

IC400
CAT24WC08W-T

R436
4.7K

A0 1
A1

HDMI_CEC

DRAIN1

A2
VSS

GATE2

R442
4.7K

VCC
WP
SCL

DRAIN2

EEPROM_SCL

22

R443

SDA

C403

IC402
CAT24C02WI-GT3
VCC

TMDS_CLK+

R435
9.1K

D400

+5V Power

+3.3V
+3.3V_HDMI_ST

HPD1
E

19

Hot plug Detect

For CEC

R429
10K

R444

22

EEPROM_SDA

SOURCE2
0.1uF

A0

R416
OPT

A2

HDCP EEPROM

C402
220pF
50V

A1

GND

VSS

TMDS_DATA1+
TMDS_DATA1_SHIELD

R425

TMDS_DATA2-

R426

D2-_HDMI1
D2+_HDMI1
TMDS_DATA2+
TMDS_DATA2_SHIELD

[TOUCH CONTROL]

DC2R019JA3

P402

JK401

12507WS-08L

UI_HW_PORT(TYPE C)

L400
CB3216PA501E

+3.3V_ST

+3.3V_ST

JP11
C408
1000pF
50V

C407
0.1uF
16V

GND

SDA1

JP12
R461
0

SDA1

JP13
SCL1
SCL1

0
R462

KEY1
KEY1

0
R464
0

Touch_Test

[IR & LED]

KEY2

OPT

ENABLE

USB_CTL

C415
10uF
10V

JP22

R455
10K

2
3

C418
1000pF
50V

C417
0.1uF
16V

USB_OCD
R404
100

USB_DM

IR
9:M15
C404
100pF
50V

USB_DP

+5V_ST

C409
0.1uF

+5V_GENERAL

001:AI16

9
.

L615
CB3216PA501E

VIN

GND

R458
47

D401
CDS3C05HDMI1
5.6V

JP18

JP20

L402
MLB-201209-0120P-N2

6
JP25
5.6V

FAULT/

$0.18

180

R451

C414
0.1uF
16V

1
USB DOWN STREAM

UAR27-4K2300
P401

C413
10uF
10V

+5V_EXT
R452
4.7K

ZD401
CDS3C05HDMI1

VOUT

ILIMIT

Touch_Test

R465
4.7K

+3.3V_P
IC401

JP16

KEY2
P400

MIC2009YM6-TR

Soft_Reset

JP17

TF12-9S-0.5SH

L401
MLB-201209-0120P-N2

JP15
OPT
R463

Soft_Reset

USB JACK

JP14

D402
CDS3C05HDMI1
5.6V

JP27
R405
0

LOGO_LED
C405
0.1uF
16V

C406
1000pF
50V

10

OE1

A0

USB +5V Over Current Protection -->

USB Jack

FE_TS_CLK
A1
FE_TS_VAL_ERR
A2
FE_TS_SYNC
A3
FE_TS_SERIAL
R661
10K
R662
10K

A4

A5

A6

A7

GND

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

+3.3V

IC606
74LVC541A(PW)

20

19

18

17

16

15

14

13

12

10

11

VCC
C966
0.1uF
16V

OE2

Y0

AR604
33
1/16W

BUF_TS_CLK
9:M15

Y1

Y2

Y3

9:M15
BUF_TS_VAL_ERR
9:M15
BUF_TS_SYN
9:M15
BUF_TS_DATA[0]

Y4

Y5

Y6

Y7

OLED
HDMI/IR/USB

09.08.31
4

LGE Internal Use Only

I2C Address : C2
+5V_GENERAL

+3.3V_P

+5V_TUNER

+3.3V_TU

+3.3V_TU

+3.3V_TU_LNA

Analog Supply Max Current(+3.3V/Operating ) : 250mA


(+1.8V/Operating ) : 75mA
Digital Supply Max Current ( +1.8V/Operating ) : 75mA

+3.3V_TU
16V
0.1uF
C639

L621
C689
0.1uF
16V

16V
0.1uF
C626

SDA

C635
0.1uF
16V

SCL

33

VDDD_2

32

EXTREF

XC5000

X600
31.875MHz

ADDRSEL

VDDC_1

10

27

DDI2

GND_4

11

26

VDDC_5

VDDC_2

12

25

DDI1

FE_TS_ERR

5
C660
0.1uF
16V

R627

47

FE_TS_VAL_ERR

R623

FE_TUNER_SCL
C645 C646 R624
18pF 18pF 100
50V 50V

+3.3V_P
+5V_GENERAL
IC602

24

16

23

X2

28

22

29

21

GND_7

VDDA_3

20

30

19

X1

17

31

GND_3
VDDA_2

FE_TUNER_SDA

34

IC600

100

FE_TS_VAL

R629
4.7K

50V
18pF
C644

VI2C

VDDC_6

VREF_N

VREF_P

VDDC_7

VDDC_8

REXT

RESET
37

38

39

40

41

42

GND_9

VDDC_9

VDDA_7

44

45

VDDA_8

35

16V
0.1uF
C619

16V
0.1uF
C623

16V
0.1uF
C621

16V
0.1uF
C625

VDDD_1

TESTMODE

16V
0.1uF
C628

GND_6

VDDA_6

VDDC_4

GND_5

VDDC_3

C975
0.47uF
25V

VDDA_5

SC156515M-1.8TR

+3.3V_TU
+1.8V_TU

VIF

C617
0.1uF
16V

LNA_SWITCH_SEL

48
2

15

C614
0.1uF
16V

IN1

14

OPT

GND_8

C616
0.1uF
16V

R628
4.7K

36

GND_1

+3.3V_TU

+3.3V_TU

IN2
L605
GND_2
1008CS-821XGLC
EXTCHOKE

+3.3V_TU

IC605
NL17SZ08DFT2G

VDDA_1

13

50V
3.9pF
C965

46

C613
1000pF
50V
C695
120pF
50V

20ms

Active Low

16V
0.1uF
C629

R610
4.99K
1%

VAGC

C603
120pF
50V

C612
0.1uF
16V

OUTPUT

L603
0603CS-12NXGLW

C615
0.1uF
16V

12nH

390nH

VOUT

L604
0603CS-R39XGLW

C694
39pF
50V

L607
0603CS-R27XGLW

VM

VCC

270nH

GND
270nH

D600
RCLAMP0502B

L600
0603CS-R27XGLW

RF_IN

C692
0.1uF
16V

C693
56pF
50V

C604
39pF
50V

C601
56pF
50V

INPUT

50V
1000pF
C618

+1.8V_TU

IC1002
TB7601TU

10
R615

16V
0.1uF
C638

+1.8V_TU

16V
0.1uF
C622 C624
16V
0.1uF

47

+3.3V_TU

16V
0.1uF
C620

VDDA_4

+3.3V_TU_LNA

TUNER_RESET
16V
0.1uF
C631

16V
0.1uF
C627

BAP70-02

43

C688
0.1uF
16V

18

C650
0.1uF
16V

SIF

C649
0.1uF
16V

2.7K
R616

500

C643
18pF
50V

L616
BLM18PG121SN1D

C637
0.1uF
16V

L614
BLM18PG121SN1D

+1.8V_TU

L606
LQH32MN2R2K23L

C632
0.1uF
16V

VIN
OPT
R637
1K

C642
0.1uF
16V

C633
0.1uF
16V

R611
1K

EN

VO
R639
ADJ 15K

1%

R640
8.2K

1%

3
C661
22uF
10V

C663
0.1uF
16V

GND

C671
100uF
16V

C673
10uF
10V

C675
0.1uF
16V

IF_AGC

C630 1/16W
0.1uF 5%
16V
+5V_TUNER

+3.3V_DVDD_P
TUNER_SIF_IF_N

+3.3V_TU

1:C9

TUNER_CVBS_IF_P

R608
390

C609
0.1uF
16V

IC604
AP1117E18G-13

IF_N

004:D6

+1.2V_P

XO

XI

VSSAH_OSC

49

VDDAH_OSC

VDDH_4

51
50

52

53

VSSL_4

VDDL_4

TDO

TMS

TCK

TDI

VSSH_4
54

55

56

57

58

59

60

61

I2C_SDA2

48

PDN

C653

0.1uF

47

PDP

C654

0.1uF

46

VDDAL_AFE2

45

VSSAL_AFE2

44

SIF

43

CVBS

42

VDDAH_CVBS

GPIO1

47

MSTRT

47

MERR

VSSH_1

VDDH_1

41

VSSAH_CVBS

40

INP
INN

FE_TS_CLK R644

47

MCLK

R645
R643

47

MVAL

10

39

47

MD0

11

38

VSSAH_AFE1

MD1

12

37

VDDAH_AFE1

MD2

13

36

VDDAL_AFE1

FE_VMAIN

C676
0.1uF
16V

IF_P
IF_N
R660
6.8K

IC603
SC4215ISTRT
+1.2V_P
NC_1

C648
0.027uF

R638
20K

C606
6.8pF
50V

VIN

16V
2.2uF
C662

R658
4.7K

GND

ADJ

VO

R641
20K

R2

R642
10K

R1

V0 = 0.8(R1+R2) / R2
C677
100uF
16V

NC_3

C680
0.1uF
16V

16V
2.2uF
C664

R659

100

+3.3V_DVDD_P
+5V_TUNER

OPT
R654
4.7K

R656
100

C647
0.1uF
16V

R657
100
50V
10pF
C640

R655
4.7K
OPT

R609
390

C610
0.1uF
16V

EN

C666
1uF NC_2
10V

+3.3V_DVDD_P

ISA1530AC1
Q600

C679
22uF
10V

+3.3V_P

2.7uH

+1.8V_TU

IF_AGC

32

31
SAW_SW

30

29

28
VSSL_3

27
VDDL_3

VDDH_3

VSSH_3

I2C_SDA1

MD7

MD6

I2C_SCL1

MD5

VSSH_2

26

RF_AGC

25

33
24

16
23

VDDL_2

22

IF_AGC

21

VSSAL_AFE1

34

20

35

15

19

14

18

MD3
VSSL_2

390
R604
R605

62

IC601
DRX3913K-XK

2
OUT

C652
1000pF
50V

R635

ADJ/GND

GND

0
L601
MLF1608A2R7J R602
680
TUNER_CVBS_IF_P

+3.3V_DVDD_P

VSSL_1

17

+5V_TUNER

004:D6

C657
0.1uF
16V

+1.2V_DVDD_P

VDDL_1

MD4

FE_TS_CLK
FE_TS_VAL
FE_TS_SERIAL

C608
0.1uF
16V

IN

20.25MHz

I2S_WS

VDDH_2

ISA1530AC1
Q601

Rev(9)
C152,155
18pF=>13pF=>15pF

C651
1000pF
50V

R636

FE_TS_SYNC
FE_TS_ERR

63

64
R634
4.7K

390
R606
0
R607

FE_SIF
004:D6

I2C_SCL2

C
+5V_TUNER

C611
0.1uF
16V

C634
15pF
50V

+3.3V_AVDD_P

GPIO2

C607
6.8pF
50V

VSYNC

I2S_CL

2.7uH

C636
15pF
50V
X601

+3.3V_DVDD_P

ISA1530AC1
Q602

TUNER_SIF_IF_N

I2S_DA

004:D6

RSTN

L602
MLF1608A2R7J R603
680

FE_RESET

3.3V Block
+1.0V BLOCK
+3.3V_P

+3.3V_P
50V
10pF
C641

+1.2V_P

+3.3V_AVDD_P

+1.2V_DVDD_P

L610
500

L608
500

+3.3V_DVDD_P

L612
500

IF_P
C655
10uF
10V

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

C658
0.1uF
16V

C659
0.1uF
16V

C668
0.1uF
16V

C667
10uF
10V

C674
10uF
10V

C678
0.1uF
16V

C683
0.1uF
16V

C685
0.1uF
16V

FE_DEMOD_SDA

ISA1530AC1
Q603

FE_DEMOD_SCL

OLED
Chip Tuner

09.08.31
5

Tuner

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

For protect Peak noise

L704
AD-8770
D700
1N4148W
100V
OPT

+24V_AMP
OPT
R714
3.3

C715
22000pF
50V

+3.3V

2S

5.6

SPK_L+

EAP60684501
2F
C747
0.1uF
50V

C737
390pF
50V

1S

C729
10uF
35V

0.01uF
50V

C738
390pF
50V
R719

D701
1N4148W
100V
OPT

R728
4.7K

C745
0.47uF
50V

1F

C733

OPT
C727
0.1uF
50V

C725
0.1uF
50V

R718

P701

007:AA18

C752
0.01uF
50V

SMW200-04

R732
3.3

SPEAKER_L

SPK_R-

007:AG22

SPK_R+

007:AG24

SPK_L-

007:AG19

R733
C748
0.1uF
50V

R729
4.7K

5.6

3.3
C753
0.01uF
50V
SPK_L- 007:AA18

C712
1uF

25V

L701

AD

DVSS_1

VSS_IO

CLK_I

VDD_IO

8
9

AGND_PLL

10

002:V8

MS_LRCK

002:V8

MS_SCK

001:L3;004:Y11

SDA1

001:L3;004:Y11

SCL1

PVDD1B_2

PVDD1B_1

OUT1B_2

OUT1B_1

PGND1B_2

PGND1B_1

BST1B

VDR1B

48

47

46

45

44

43

PVDD1A_1

49

EAN60664001

39

PGND2A_2

38

PGND2A_1

37

OUT2A_2

36

OUT2A_1

35

PVDD2A_2

34

PVDD2A_1

33

PVDD2B_2

11

32

PVDD2B_1

12

31

OUT2B_2

DVDD_PLL

13

30

OUT2B_1

TEST0

14

29

PGND2B_2

NTP-3100L

SPK_R+ 007:AA17

C731
22000pF

L705

D702
1N4148W
100V
OPT

50V

R720

2S

C746
0.47uF
50V

EAP60684501
2F

1S

C740
390pF
50V

D703
1N4148W
100V
OPT

C754

AD-8770

5.6
C739
390pF
50V

LFM

C749

R730

0.1uF
50V

4.7K

0.01uF
50V
R734

SPEAKER_R

3.3
R735

1F

R721
5.6

C750

R731

0.1uF
50V

4.7K

3.3
C755
0.01uF
50V

SPK_R- 007:AA17

R706

100

R704

100

R705

100

R707

100

R708

C711
10uF
10V

28
PGND2B_1

26

27
BST2B

VDR2B

25
FAULT

24
MONITOR_2

23
MONITOR_1

22
MONITOR_0

21
SCL

20
SDA

19
BCK

18
WCK

17

16

+24V_AMP

C705
0.1uF
16V

OPT

MS_LRCH

IC700

C728
25V1uF

AVDD_PLL

+1.8V_AMP

002:V8

PVDD1A_2

BST2A

15

OPT
C704
10uF
6.3V

OUT1A_1

VDR2A

40

DGND_PLL

3.3K

51
50

NC

41

DVDD

100pF
50V

C708
1000pF
50V
R702

OUT1A_2

42

RESET

SDATA

C706

PGND1A_1

VDR1A

DVSS_2

C702
0.1uF
16V

R700
0

MLB-201209-0120P-N2

MLB-201209-0120P-N2
C700
10uF
10V
OPT

L700

C709
0.1uF

C726
1uF
25V

BST1A

+1.8V_AMP
+1.8V_AMP

52

R703
0
002:V8 AUDIO_MASTER_CLK

53

PGND1A_2
56

C707
1000pF
50V

54

100

55

R701
AMP_RST

SPK_L+

007:AG26

001:AA9

C724
22000pF
50V

C723
1uF
25V

C714
0.1uF
16V

C734

C735

0.1uF
50V

0.1uF
50V

C741
10uF
35V

RF_IN&DC POWER
+24V

C730
22000pF
50V

JK800
KCN-ET-2-0104

+3.3V_ST
OPT
C722
33pF
50V

OPT
R711

RF_IN

C713
33pF
50V

R740
22K
S

+24V_AMP

G
R742
27K

DC_GND

R717
10K

Q701

JP31

AO3407A

0
C710
33pF
50V

C761
2.2uF
50V

POWER_DET
0
R710

100

C760
0.1uF
50V

RF_IN

DC_POWER

R726

Q700
2SC3052

R709
33K OPT

AMP_MUTE

R743
10K

JP32

10K
E

RF_SHIELD

002:C25
4
5

MCLK SDATA WCK BCK TP is necessory

C880
0.047uF

L702
CPI2520NHL3R3ME

C
B
Q702

POWER_ON
E

C762
0.01uF
50V

C718
10uF
35V

C721
0.01uF
50V

AO3407A Vgs : 10.8V

SHIELD

Monitor0_1_2 TP is necessory

RS-232C

+5V_ST
L703
BLM18PG121SN1D

C1+

16V
0.33uF
C720

C2+

C2-

V-

DOUT2

RIN2

16

15

14

13

12

11

10

1/10W
5%

P700
DBG_RX

VCC

C736
0.1uF
16V

KJA-UB-0-0020

DBG_TX

USB DOWN STREAM

C1-

1/10W
R716
5%
6.2K

IC701
MAX3232CDR

V+

C719
0.33uF
16V

R715
6.2K

0.33uF

C717
0.047uF
25V

C716

GND
RxD
D704
ADUC30S03010L
30V OPT

DOUT1

RIN1

ROUT1

R713
100
R712
100

50V
220pF
C743

TxD

4
50V
220pF
C744

DIN1
6
DIN2

D705
ADUC30S03010L
30V OPT

ROUT2

USB
Serial Port

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

OLED
AUDIO

09.08.31
6

AUDIO/ADAPTER/232C

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

FROM ADAPTER TO MAIN BOARD


24V->12V

+5V_ST

R1

FB

S2

S3

D8

D7

$0.12
3

D6

FB

22
R895

VIN_1

$0.21

FREQ

R893
200K

GND

1/8W
1%

C808
0.1uF
50V

+5V_ST
PGND

L897
4.7uH

VIN

R955
200K

1/16W 1/16W
1%
1%

AGND

C972
22uF
16V

SP-7850_4.7

C896
10uF
10V

NR8040T3R6N

C974
0.1uF
50V

C897
10uF
10V

10K

Vout=0.8*(1+R1/R2)

FB

10K
R813

+5V_GENERAL

R827
30K
1%

R2

OPT

Placed on SMD-TOP
C837
0.1uF
16V
Cin

C846
22uF
10V
OPT

GND

IN

C843
22uF
10V

BS

+1.8V_DDR

IC807
SC4215ISTRT
NC_1

Q807

L805
500

R803
120K

+3.3V

IC803
MP2212DN

Close to IC

C834
10uF
10V

+1.8V for Saturn6 DDR

R1

C807
0.1uF
16V

C876
22uF
10V

C818 100pF 50V


R826
39K 1%

560
R806
R804
10K

C873
0.1uF
16V

COMP

+1.8V_MEMC for DDR


R832

POWER_ON

EN

Vout=0.8*(1+R1/R2)

+5V_ST

AO3407A

2A

LX_1

C854
2200pF
50V

L814
120-ohm

Q801
2SC3052

L821
3.6uH

LX_2

C898
0.1uF
50V

+5V_GENERAL

C819
10uF
10V
OPT

L894
3.6uH

C973
22uF
16V

FB

Placed on SMD-TOP

NR8040T3R6N
R897
51K

D5

close to IC811

18K
R853

S1

C894
220pF
50V

+5V_EXT

IC810
AOZ1073AIL

C809
3.3uF
50V

1/16W
5%

GND

COMP

1%

18K
R898

1%

BG

IC812
Si4800BDY

C971
1uF
25V

EN

R950
120K

1.6K 6.8K
R952 R951

1%
1/8W

22
R954

5%
1/16W

1%

R854
100K

VIN_2

R856
47K

1%

BST

10

D802

Vout = ((R1+R2)X0.8)/R2

R2

R956
4.7

SW_2

POWER_ON

$0.37
VCC
C970
1uF
50V

real output : 12.3V

R857
5.6K

1%

+24V

1%
1/16W

SW_1

+12V
R953
10K

EN/SYNC

EP_GND

47K
R896

IN

IC893
MP4460DQ-LF-Z

11

Switching noise reducing [MPS recommend]

MBRA340T3G
close to pin

R824
68K

SW

BST

0.1uF

50V

C969
10uF
35V

C967
0.1uF
50V

R858
10K

C879

THERMAL

IC811
MP8670DN-LF-Z

+5V_Normal

+12V

R894
100K

+24V

EN/SYNC

R841
3.3K

+1.8V_MEMC
L809
3.6uH

SW_2

EN

VIN
C859
22uF
10V

SW_1

C863
22uF
10V

Cout

C874
10uF
10V

C855
0.1uF
50V

NC_2
C877
0.47uF
25V

C875
0.1uF
16V

GND

R847
12K
1%

ADJ

VO

NC_3

C888
22uF
10V

R848
9.1K
1%

C892
0.1uF
16V

R1/R2 : 27K / 20K => Vout=1.88


R1/R2 : 15K / 12K => Vout=1.80
R1/R2 : 12K / 9.1K => Vout=1.85

Placed on SMD-TOP

R831
10
1%

OPT

VCC

R830
0

C853
1uF
16V

+1.26V Core for URSA


IC809

+5V_GENERAL

R2

APE8953MP

S6 core 1.26V volt


1.5mA

+5V_GENERAL

EN

+3.3V
+1.8V_MEMC
C869
1uF
16V

470K
R815

+12V

30K
R816

R809
33K
B

+1.26V_VDDC

OPT
R823

R1

10K
1/16W

R825

22K 1%

FB
OPT

R822
75K
1/8W
1%

C822
1000pF
50V

Q806
AO4813

+12V_PANEL

S2

C811
0.1uF
16V

C806
0.01uF
25V

C815
22uF
16V

D2_2

G2

D2_1

S1

D1_2

C829
0.1uF
16V

C IN

C838
22uF
10V

GND

IN

OPT
C842
22uF
10V

BS

3A

R812
10K

EN/SYNC

SW_2

SW_1
C845
22uF
10V

VCC

C839
0.1uF
50V

25V
0.01uF
C885

VOUT_2

C871
10uF
6.3V
R844
1K

C856
0.1uF

+3.3V
Placed on SMD-TOP

+5V_GENERAL

L813
CIC21J501NE

C840
1uF
10V

R839
10K

+3.3V

+3.3V_ST

R811
10K

STAND-BY +3.3V

C821
0.1uF
16V

C810
0.1uF
16V

C841
10uF
10V

ADJ/GND

C844
0.1uF
16V

IC806
MP2212DN

Close to IC
C866
560pF
50V
OPT

C860
0.1uF
16V

IC804
AP1117E33G-13
IN

100pF 50V
R837
R1 56K 1/10W 1%

+3.3V_AVDD_MPLL

18K
R8361/10W
1%

IC801

IN

C816
10uF
10V

C889
10uF
6.3V

Placed on SMD-TOP

Vout=0.8*(1+R1/R2)

AP1117E18G-13
ADJ/GND

C887
10uF
6.3V

C814

IC800

+3.3V_AVDD

OPT
C849
22uF

L810
120-ohm

AP1117E33G-13

C805
10uF
6.3V

1/10W
1%

VOUT_1

10
1/10W
1%

+5V_ST

C802
10uF
6.3V

R1/R2 = 12K/20K => Vout=1.28

C824
1000pF
50V

+3.3V

+5V_GENERAL

OUT

R1
R852
33K

FB

L895
BLM18SG121TN1D

L816
3.6uH

R821

D1_1

Q804
2SC3052

LOGIC_POWER_ON

C801
0.1uF
16V

+1.26V_MEMC

600 mA

+12V_LOGIC

C832
0.1uF
16V

330K
R820

OPT

R810
10K

470K
R819

G1

+3.3V_ST

C800
10uF
10V

Placed on SMD-TOP

NR8040T3R6N

R862

22K 1%

Close to IC

+12V

C868
10uF
6.3V

C891
0.47uF
25V

R2

Placed on SMD-TOP

L801
CB3216UA121

VIN

GND

Vout=0.8*(1+R1/R2)
1%
1/10W
27K
R846

Q800
2SC3052

+12V

IN

POK

VCNTL

Vout=0.8*(1+R1/R2)

R890

IC805
MP2212DN

R805
10K

R801
30K

Replaced Part

CIC21J501NE

Q802
2SC3052

PANEL_POWER_ON

L812

R829
1/10W
10K

C872
0.1uF
16V
OPT

L896
BLM18PG121SN1D

+12V

C899
100pF
50V

2026 mA

1%
1/10W
30K
R845

ADJ/GND
+3.3V_ST

FB

GND

L817
3.6uH

SW_2

+3.3V_HDMI_ST

2
OUT

NR8040T3R6N
IN

L811
120-ohm

SW_1
Placed on SMD-TOP

+1.8V_AMP

OUT

C850
10uF
6.3V
C827
10uF
6.3V

C830
0.1uF
16V

C852
0.1uF
16V

D804
C861
0.1uF
16V

C865
22uF
10V

OPT

BS

VCC

C881
0.1uF
50V

100V
1N4148W_DIODES

C882
10uF
6.3V

C883
0.1uF
16V

C884
22uF
10V

R842
Placed on SMD-TOP

R838
10
1/10W
1%

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

EN/SYNC

R2

0
C878
1uF
10V

OLED
Power

09.08.31
7

POWER

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

LGE Internal Use Only

100

100

R922

R928

100

100

URSA_B-[1]

URSA_B+[1]

URSA_B-[0]

URSA_B+[0]

URSA_ACK-

URSA_A-[3]

R927

URSA_ACK+

R921

URSA_A+[3]

100

URSA_A-[2]

100

+3.3V

URSA_A+[2]

100
R926

URSA_A-[1]

100
R920

P900
TF05-51S
URSA_A+[1]

100
R925

URSA_A-[0]

+3.3V

R924

100
R919

URSA_A+[0]

R918

M_XTALO

C901
20pF

M_XTALI

MEMC_RXO0-

MEMC_RXO0+

MEMC_RXO1-

MEMC_RXO1+

MEMC_RXO2-

MEMC_RXO2+

MEMC_RXOC-

MEMC_RXOC+

MEMC_RXO3-

MEMC_RXO3+

MEMC_RXO4-

MEMC_RXO4+

MEMC_RXE0-

MEMC_RXE0+

MEMC_RXE1-

MEMC_RXE1+

MEMC_RXE2-

MEMC_RXE2+

MEMC_RXEC-

X900
12MHz

MEMC_RXEC+

M_XTALI
C900
20pF

MEMC_RXE3-

M_XTALO

MEMC_RXE3+

1M

MEMC_RXE4-

R905

MEMC_RXE4+

XTAL

+3.3V
1
2

R939
4.7K
1:AO17

PANEL_RESET

C921

LVDS_SEL

C943

C944

1uF

C952

10uF

C957

0.1uF

C953

0.1uF

C956

0.1uF

10
11

LVDS_SEL

820
REXT

LVB1M

LVB1P

LVB0M

LVB0P

GPIO_4

GPIO_6

LVA4M

LVA4P

LVA3M

LVA3P

LVACKM

LVACKP

LVA2M

LVA2P

LVA1M

LVA1P

LVA0M

LVA0P

AVDD_PLL

GND_2

GPIO_8

GPIO_9

GPIO_12

GPIO[25]

SCLM

SDAM

GPIO_1

GPIO_2

XIN

XOUT

GPIO_14

GPIO_13

GND_5

AVDD_LVDS_2

RO0N

RO0P

RO1N

RO1P

RO2N

RO2P

ROCKN

ROCKP

RO3N

RO3P

RO4N

RO4P

GND_6

AVDD_LVDS_1

RE0N

RE0P

RE1N

RE1P

RE2N

RE2P

RECKN

RECKP

RE3N

RE3P

RE4N

LG
(VESA)

URSA_B-[2]

12

URSA_B+[2]

13

D12

C14

C13

A13

B13

D7

D9

B12

A12

C12

C11

A11

B11

B10

A10

C10

C9

A9

B9

G8

F10

D11

D13

E11

N7

D6

D5

A14

B14

D3

D4

K16

K15

H7

G11

B8

A8

C8

C7

A7

B7

B6

A6

C6

C5

A5

B5

H8

F11

B4

A4

C4

C3

A3

B3

B2

A2

C2

GPIO[9]

G1

E3

GPIO_10

GND_14

K8

D2

GPIO_3

VDDC_1

E5

GPIO[10]

E2

GPIO[11]

F2

[E1]
[D1]

17

C15

URSA_B+[2]

B15

LVB2M

URSA_B-[2]

A15

LVBCKP

URSA_BCK+
URSA_BCK-

F3

A16

LVBCKM

GPIO[13]

G2

B16

LVB3P

URSA_B+[3]

GPIO[22]

M4

C16

LVB3M

URSA_B-[3]

GPIO[23]

M5

D15

LVB4P

GPIO[14]

G3

D16

LVB4M

20

23

E15

LVC0P

H4

E16

LVC0M

GPIO[19]

J4

E14

LVC1P

GPIO[20]

K4

F14

LVC1M

GPIO[21]

L4

F16

LVC2P

VDDP_2

J6

F15

LVC2M

GND_7

H9

G15

LVCCKP

GND_15 K9

G16

LVCCKM

URSA_A-[1]

G14

LVC3P

URSA_A+[1]

MDATA[20]

H1

H16

LVC4P

MDATA[19]

H2

H15

LVC4M

J15

LVD0P

J16

LVD0M

J14

LVD1P

K14

LVD1M

GND_3

L14

LVD2P

MDATA[30]

K2

L15

LVD2M

AVDD_DDR_2

K6

L16

LVDCKP

DQM[3]

K3

M16

LVDCKM

DQM[2]

L1

F8

GND_10

J8

M15

LVD3P

C929

URSA_DQSB3
URSA_DQ[31]
URSA_DQ[24]
C925

0.1uF

URSA_DQ[26]
URSA_DQ[29]

LVD4P

AVDD_DDR_4

L6

N15

LVD4M

VDDP_3

L8
H10

H6

VDDC_5

M1

N6

GPIO[24]

DQSB[3]

M2

E12

GPIO[7]

AVDD_DDR_5

L7

D14

GPIO[6]

MDATA[31]

M3

F12

GPIO[5]

MDATA[24]

N1

E13

GPIO[4]

GND_11

J9

F13

GPIO[3]

MDATA[26]

N2

G13

GPIO[2]

MDATA[29]

N3

H13

GPIO[1]

L10

J13

GPIO[0]

K12

PWM0

L12

PWM1

K13

CSZ

M12

SDO

M13

SDI

MDATA[23]

P1

URSA_DQ[16]

MDATA[16]

R1

URSA_DQ[18]

MDATA[18]

T1

URSA_DQ[21]

MDATA[21]

T2

MCLK[0]

R2

MCLKZ[0]

P2

L13

SCK

GND_1

G7

N14

GPIO[30]

L9

N13

N5

N12

[N12]

C949

42
43
JP8
44

L907
120OHM
+3.3V

0.1uF

45
46
C959
0.1uF
16V

C960
1000pF
50V

47
R940

R941

48

SDA2
SCL2

49
50
51
52

GPIO[29]
GPIO[28]

G6

M11

N11

N10

N9

P16

R16

T16

P15

R15

T15

P14

R14

T14

P13

R13

T13

H11

J7

P12

R12

T12

P11

J11

R11

T11

P10

R10

K11

T10

P9

K7

R9

T9

F7

K10

N8

P8

R8

T8

P7

R7

L11

T7

P6

R6

T6

C919

T3

0.1uF

N4

P5

ODT

URSA_ODT

R5

MVREF

T5

AVDD_MEMPLL

P4

0.1uF

J10

C923

R4

URSA_MCLK
URSA_MCLKZ

[L9]
[N4]

41
16V
D809

N16

[N5]

40

+12V_LOGIC
0.8A(Typ)

C964
10uF

L3

URSA_DQ[23]

PI Result

39

C963
1000pF
50V

M14

DQSB[2]

[N13]

38
L908
120OHM

C962
0.1uF
16V

L2

LVD3M

AVDD_DDR_6

37

0.1uF

AVDD_33_1

DQS[2]

DQS[3]

0.1uF

K1

JP1

+12V_PANEL
3.4A[300nit](Typ)

C955
G9

MDATA[25]

URSA_DQS3

35

30V
OPT

LGE7329A

URSA_DQ[30]

GND_8

34

36

J3

URSA_DQ[25]

0.1uF

33

URSA_A+[0]

J2

0.1uF

C926

31
32

D808

MDATA[28]

30

URSA_A-[0]

C961
10uF 16V

MDATA[27]

URSA_DQ[28]

J1

28
29

1K

URSA_DQ[27]

IC901

H3

27

URSA_A+[2]

1K
OPT

MDATA[22]

26
URSA_A-[2]

R934

MDATA[17]

URSA_DQ[22]

25

0.1uF

1K
R936

URSA_DQ[17]

24

URSA_ACK+

1K
R937

URSA_DQ[19]

LVC3M

C954

OPT
R935

URSA_DQ[20]

H14

22

URSA_ACK-

G4

F6

21

URSA_A+[3]

GPIO[18]

VDDC_2

19

URSA_A-[3]

GPIO[17]

C928

18

URSA_B+[0]

0.1uF
16V

C932

16

URSA_B-[0]

LVB2P

AVDD_33_2

15

URSA_B+[1]

GPIO[12]

T4

URSA_DQ[0-31]

C1

E10

GPIO_11

C916

10uF
C911

10V

22uF
C909

0.1uF

0.1uF

C905

C907

GPIO_7

GND_4

URSA_DQS2

0.1uF

GPIO_5

D10

0.1uF 0.1uF

+3.3V

D8

URSA_B-[1]

F9

URSA_DQSB2

C906

DISM
(JEIDA)

10uF

G10

URSA_DQM2

0.1uF

LOW

F4

URSA_DQM3

C902

HIGH

E4

C924

C903

C951

10uF

GPIO[16]

PI Result

Placed on SMD-TOP

10uF

R931

URSA_BCK+

GPIO[15]

L901
BLM18PG121SN1D

D1
F1

P3

10V

C914
0.1uF
16V

E1

R3

+1.8V_MEMC

C910 10uF

+3.3V

1K

C908 10uF

R907

30V
OPT

0.1uF

R906
OPT

1K

URSA_BCK-

GPIO[8]

SCLS

1K

A1

SDAS

C931

R904

0.1uF

C941

C937

0.1uF

0.1uF

10uF
C933

RE4P
R915

100
100

B1

R914

MEMC_SDA
MEMC_SCL

R903
OPT

1K

URSA_B-[3]

14
1K

+3.3V

R911
OPT

Q900
2SC3052

URSA_B+[3]

C950

+3.3V

R938
LVDS_SEL
1:AO32

0.1uF

PI Result

R910

100

100
0.1uF
C934

C927
C917
0.1uF

10uF 10V
C930

10uF
C913

C915 0.1uF

22uF
10V
C912

L903

R929

R923

Placed on SMD-TOP
BLM18PG121SN1D

+3.3V
0.1uF
C945

+1.26V_MEMC

0.1uF

PI Result

VDDC_4

RESET

GND_17

GPIO[27]

GPIO[26]

MCLKZ[1]

MCLK[1]

MDATA[5]

MDATA[2]

MDATA[0]

MDATA[7]

MDATA[13]

MDATA[10]

MDATA[8]

MDATA[15]

DQSB[1]

DQS[1]

VDDP_1

GND_9

DQSB[0]

DQS[0]

DQM[0]

DQM[1]

C948

0.1uF
0.1uF

C947

C946

0.1uF

AVDD_DDR_1

MDATA[14]

MDATA[9]

MDATA[12]

MDATA[11]

AVDD_DDR_3

MDATA[1]

GND_13

MDATA[3]

VDDC_3

MDATA[4]

MDATA[6]

R930
URSA_DQ[5]

URSA_DQ[2]

URSA_DQ[0]

MDS62110207
URSA_DQ[7]

URSA_DQ[13]

URSA_DQ[10]

URSA_DQ[8]

URSA_DQ[15]

URSA_DQ[14]

URSA_DQ[9]

URSA_DQ[12]

URSA_DQ[11]

URSA_DQ[6]

URSA_A[7]

URSA_A[12]

URSA_A[9]

URSA_A[5]

URSA_A[10]

URSA_A[1]

URSA_A[11]

URSA_A[8]

URSA_A[6]

URSA_A[4]

URSA_A[2]

URSA_A[0]

C918

C922
1uF

URSA_A[3]

URSA_DQ[1]

M5
MDS62110207
GPIO8

PWM1

PWM0

I2C

HIGH

LOW

EEPROM

HIGH

HIGH

LOW

SPI

HIGH

HIGH

HIGH

M6
MDS62110207

URSA_DQ[0-31]

M_SPI_DI

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

HIGH

M_SPI_CK

URSA_MCLKZ1

56

URSA_MCLK1

56

R909

URSA_DQSB1

R908

DIO

URSA_DQS1

CLK

URSA_DQSB0

URSA_DQ[3]

M3

HOLD

URSA_RASZ

VCC

URSA_DQS0

WP

GND

URSA_DQM0

10K

URSA_DQM1

R902

MEMC_RESET 1:Z22

M4

URSA_A[0-12]

DO

MDS62110207

100

MDS62110207

URSA_MCLKE

CS

56

URSA_BA0

56

R901

URSA_BA1

R900

M1
MDS62110207
M2

URSA_WEZ

M_SPI_DO

URSA_CASZ

M_SPI_CZ

CONTACT TO MODULE FOR EMI

R932

URSA_DQ[4]

W25X20AVSNIG

M_SPI_CK

10K

0.1uF

0.1uF

C904

IC900

10K
R917

+3.3V

0.1uF

SPI FLASH

M_SPI_DI

R933

C940

C939

C938

C936

C935

10K
R916

0.1uF 0.1uF 0.1uF 0.1uF

M_SPI_DO

+3.3V

0.1uF

GND_16

MCLKE

MADR[3]

C942

MADR[7]

MADR[9]

MADR[12]

MADR[5]

AVDD_DDR_7

MADR[10]

MADR[1]

BADR[0]

BADR[1]

WEZ

MADR[11]

MADR[8]

MADR[6]

GND_12

MADR[4]

MADR[2]

CASZ

RASZ

C920

MADR[0]

M_SPI_CZ
0.1uF

OLED
FRC / LVDS

09.08.31
8

LGE Internal Use Only

resonance Compensation
DDR2 1.8V By CAP - Place these Caps near Memory
+1.8V_MEMC
+1.8V_FRC_DDR
+1.8V_MEMC

+1.8V_FRC_DDR

+1.8V_FRC_DDR

+1.8V_FRC_DDR

C1052

0.1uF

0.1uF

0.1uF
C1051

0.1uF
C1050

C1048

0.1uF
C1049

0.1uF

C1047

0.1uF

C1046

0.1uF

C1045

C1042

0.1uF

0.1uF

0.1uF
C1041

0.1uF
C1040

0.1uF
C1039

C1037

0.1uF
C1038

0.1uF

0.1uF
C1036

0.1uF
C1034

0.1uF
C1035

0.1uF
C1033

10uF
C1032

0.1uF
C1031

0.1uF
C1030

0.1uF
C1029

0.1uF
C1028

10uF
C1027

10V

C1026

C1025

10uF

C1024

0.1uF

0.1uF

C1022

0.1uF

0.1uF

C1020

0.1uF

C1019

0.1uF

C1018

0.1uF

C1017

0.1uF

C1016

10uF
C1015

0.1uF

0.1uF
C1014

C1013

0.1uF

C1012

0.1uF

C1011

0.1uF

C1010

0.1uF

C1009

0.1uF

C1008

0.1uF

C1007

10uF

C1006

10V

C1005

C1004

10uF

0.1uF

C1003

0.1uF

0.1uF

C1002

0.1uF
C1001

C1000

BLM18PG121SN1D
L1000

PI Result

56

DDR_DQ[26]
DDR_DQ[29]
AR1003

URSA_DQ[23]

DDR_DQ[23]
DDR_DQ[16]

URSA_DQ[16]
56

URSA_DQ[21]

DDR_DQ[18]
DDR_DQ[21]

H7

DDR_DQ[19]

DQ3

H3

DDR_DQ[20]

DQ4

H1

DDR_DQ[21]

DQ5

H9

DDR_DQ[22]

DQ6

F1

DDR_DQ[23]

DQ7

F9

DDR_DQ[24]

DQ8

C8

DDR_DQ[25]

DQ9

C2

DDR_DQ[26]

DQ10

D7

DDR_DQ[27]

DQ11

D3

DDR_DQ[28]

DQ12

D1

DDR_DQ[29]

DQ13

D9

DDR_DQ[30]

DQ14

B1

DDR_DQ[31]

DQ15

B9

+1.8V_FRC_DDR

J2

M8

A0

DDRB_A[0]

M3

A1

DDRB_A[1]

M7

A2

DDRB_A[2]

N2

A3

N8

A4

DDRB_A[4]

N3

A5

DDRB_A[5]

N7

A6

DDRB_A[6]

P2

A7

DDRB_A[7]

P8

A8

DDRB_A[8]

P3

A10/AP

DDRB_A[10]

A11

DDRB_A[11]

R2

A12

DDRB_A[12]

L2

BA0

L3

BA1

A1

VDD4

E1

VDD3

J9

J8

CK

VDD2

M9

K8

CK

K2

CKE

VDD1

R1

K9

ODT

VDDQ10

A9

L8

CS

VDDQ9

C1

K7

RAS

VDDQ8

C3

L7

CAS

VDDQ7

C7

K3

WE

VDDQ6
VDDQ5

DDRB_A[1]

URSA_A[1]

22

AR1005

DDRB_A[7]

22

URSA_A[7]

DDRB_A[0]
DDRB_A[4]

AR1006
22

DDRB_A[6]

DDRA_A[3]

22

DDRA_A[1]

DDRA_A[12]

22

DDRA_A[7]

URSA_A[7]

URSA_A[5]

URSA_A[5]

URSA_A[0]

URSA_A[2]

URSA_A[2]

URSA_A[0]

AR1013

DDRA_A[0]

URSA_A[4]

URSA_A[6]

22

DDRA_A[6]

URSA_A[6]

URSA_A[4]

B_URSA_RASZ

URSA_RASZ

URSA_RASZ

B_URSA_CASZ
DDRB_A[11]

URSA_CASZ
URSA_A[11]
URSA_A[8]

URSA_CASZ
URSA_A[8]

DDRB_A[8]

B_URSA_BA1
R1003

R1004

DDRA_A[5]
DDRA_A[2]

AR1010

22

22

URSA_MCLK

URSA_MCLKZ

22

URSA_ODT

22

DDRA_A[11]

009:AB4

URSA_MCLK1

009:AB4

URSA_MCLKZ1

010:Q14;009:J10

R1021

1K 1%

1000pF

C1043

0.1uF
C1044

M8

DDRA_A[1]

A1

M3

DDRA_A[2]

A2

M7

A3

N2

DDRA_A[4]

A4

N8

DDRA_A[5]

A5

N3

DDRA_A[6]

A6

N7

DDRA_A[7]

A7

P2

DDRA_A[8]

A8

P8

A9

P3

DDRA_A[10]

A10/AP

M2

DDRA_A[11]

A11

P7

DDRA_A[12]

A12

R2

DDRA_A[9]

A_URSA_RASZ

010:V9

010:Y14;009:J10

A0

A_URSA_CASZ
DDRA_A[8]

URSA_A[11]

009:J11

J2

DDRA_A[0]

DDRA_A[3]

DDRA_A[4]

A_URSA_BA0

22

009:J10
B_URSA_MCLKE
010:T10
R1005

DDRA_A[9]

URSA_A[12] AR1012

AR1007

B_URSA_BA0

DDRA_A[10]

URSA_A[9]

URSA_A[12]

DDRB_A[5]
DDRB_A[2]

AR1011

URSA_A[1]
URSA_A[10]

URSA_A[3]
URSA_A[9]

DDRB_A[12]

URSA_A[3]

URSA_ODT

R1012

R1013

A_URSA_BA1
22

22

A_URSA_MCLKE

R1014

22

BA0

L2

BA1

L3

G8

DQ0

G2

DQ1

DDR_DQ[1]

H7

DQ2

DDR_DQ[2]

H3

DQ3

DDR_DQ[3]

H1

DQ4

DDR_DQ[4]

H9

DQ5

DDR_DQ[5]

F1

DQ6

DDR_DQ[6]

F9

DQ7

DDR_DQ[7]

C8

DQ8

DDR_DQ[8]

C2

DQ9

D7

DQ10

DDR_DQ[10]

D3

DQ11

DDR_DQ[11]

D1

DQ12

DDR_DQ[12]

D9

DQ13

DDR_DQ[13]

B1

DQ14

DDR_DQ[14]

B9

DQ15

DDR_DQ[15]

A1

VDD5

E1

VDD4

CK

J8

J9

VDD3

CK

K8

M9

VDD2

CKE

K2

R1

VDD1

ODT

K9

CS

L8

A9

VDDQ10

K7

C1

VDDQ9

CAS

L7

C3

VDDQ8

WE

K3

C7

VDDQ7

C9

C9

VDDQ6

E9

E9

VDDQ5

G1

VDDQ4

G3

VDDQ3

G7

VDDQ2

G9

VDDQ1

VDDQ4

G1

VDDQ3

G3

VDDQ2

G7

VDDQ1

G9

F7

LDQS

B7

UDQS

F3

LDM

B3

UDM

B_URSA_RASZ
B_URSA_CASZ
B_URSA_WEZ

R1006
R1007

R1008
R1009

56
56

56
56

VSS5

A3

E8

LDQS

R1010

56

VSS4

E3

A8

UDQS

R1011

56

VSS3

J3

VSS2

N1
P9

VSSQ10

B2

VSSQ9

B8

VSSQ8

A7

VSSQ7

D2

VSSQ6

D8

VSSQ5

E7

VSSQ4

F2

VSSQ3

F8

VSSQ2

H2

VSSQ1

H8

010:R16
010:R16
010:T10

010:X16

A_URSA_RASZ

010:X16

A_URSA_CASZ

010:V8

URSA_DQS2

009:J14

009:X4

URSA_DQS0

URSA_DQS3

009:J13

009:Y4

URSA_DQS1

URSA_DQM2

009:J15

009:X4

URSA_DQM0

URSA_DQM3

009:J15

009:W4

URSA_DQM1

URSA_DQSB2

009:J14

009:X4

URSA_DQSB0

URSA_DQSB3

009:J13

009:Y4

URSA_DQSB1

L1

NC4

R3

NC5

B_URSA_BA0

URSA_BA0

NC6

B_URSA_BA1

A2

NC1

E2

NC2

R8

NC3

010:Q14

B_URSA_MCLKE

010:Q13

B_URSA_WEZ

J1

VDDL

56

LDQS

F7

R1016

56

UDQS

B7

R1017

56

LDM

F3

R1018

56

UDM

B3

R1019

56

LDQS

E8

A3

VSS5

R1020

56

UDQS

A8

E3

VSS4

J3

VSS3

N1

VSS2

P9

VSS1

B2

VSSQ10

B8

VSSQ9

A7

VSSQ8

D2

VSSQ7

NC4
NC5

R3

URSA_BA1

010:T9;009:R4

NC6

R7

URSA_MCLKE

010:T9;009:T4

URSA_WEZ

010:T8;009:R4

NC1

A2

NC2

E2

22

010:V10;009:S4

URSA_BA0

A_URSA_BA0

010:AA15

010:V10;009:R4

URSA_BA1

A_URSA_BA1

010:AA15

010:V10;009:R4

URSA_MCLKE
URSA_WEZ
22

L1

010:T9;009:S4

AR1009

010:V10;009:T4
VSSDL

R1015

AR1008

+1.8V_FRC_DDR
J7

A_URSA_WEZ

A_URSA_MCLKE

010:Z14

A_URSA_WEZ

010:Y13

NC3
+1.8V_FRC_DDR

R8

D8
VSSDL

VDDL

J7

J1

DDR_DQ[0]

DDR_DQ[9]

URSA_DQ[8]

DDR_DQ[10]

URSA_DQ[10]

DDR_DQ[13]

URSA_DQ[13]

DDR_DQ[7]

AR1015

DDR_DQ[0]

56

URSA_DQ[7]
URSA_DQ[0]

DDR_DQ[2]

URSA_DQ[2]

DDR_DQ[5]

URSA_DQ[5]

DDR_DQ[11]

AR1016

URSA_DQ[11]
56

DDR_DQ[12]
DDR_DQ[9]

URSA_DQ[9]

DDR_DQ[14]
DDR_DQ[6]
DDR_DQ[1]

URSA_DQ[12]
URSA_DQ[14]

AR1017

URSA_DQ[6]
56

URSA_DQ[1]

DDR_DQ[3]

URSA_DQ[3]

DDR_DQ[4]

URSA_DQ[4]

+1.8V_FRC_DDR

RAS

R7

Copyright 2010 LG Electronics. Inc. All rights reserved.


Only for training and service purposes

URSA_A[10]

AR1004

DDRB_A[3]
DDRB_A[9]

DDRB_A[9]

M2
P7

VDD5

VSS1

THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.

A9

DDRB_A[3]

DDRB_A[10]

URSA_DQ[15]
56

DDR_DQ[8]

DDR_DQ[0-15]

DDR_DQ[24]

URSA_DQ[29]

URSA_DQ[18]

DDR_DQ[31]

G2

DQ2

R1023
OPT

AR1002

URSA_DQ[24]

DQ1

VREF

150

DDR_DQ[20]

G8

DDR_DQ[17]
DDR_DQ[18]

VREF

DDRA_A[0-12]

DDR_DQ[19]

56

URSA_DQ[31]

AR1014
DDR_DQ[15]

H5PS5162FFR-S6C

DDRB_A[0-12]

DDR_DQ[17]

URSA_DQ[20]

URSA_DQ[26]

DDR_DQ[22]

DQ0

150

AR1001

URSA_DQ[17]

DDR_DQ[16]

OPT
R1000

DDR_DQ[30]

URSA_DQ[22]

URSA_DQ[0-31]

IC1001

DDR_DQ[25]

URSA_DQ[30]

URSA_DQ[19]

H5PS5162FFR-S6C

DDR_DQ[28]
56

DDR_DQ[16-31]

URSA_DQ[25]

1K 1%

1K 1%
1K 1%

URSA_A[0-12]

R1001
R1002

DDR_DQ[27]

URSA_DQ[28]

0.1uF

AR1000
URSA_DQ[27]

C1021

IC1000

1000pF
C1023

URSA_DQ[0-31]

R1022

+1.8V_FRC_DDR

+1.8V_FRC_DDR

VSSQ6

E7

VSSQ5

F2

VSSQ4

F8

VSSQ3

H2

VSSQ2

H8

VSSQ1

OLED
FRC DDR2

09.08.31
9

LGE Internal Use Only

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