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6 March 2009
Space product
assurance
Manual soldering of high-reliability
electrical connections
ECSS Secretariat
ESA-ESTEC
Requirements & Standards Division
Noordwijk, The Netherlands
ECSSQST7008C
6March2009
Foreword
This Standard is one of the series of ECSS Standards intended to be applied together for the
management, engineering and product assurance in space projects and applications. ECSS is a
cooperative effort of the European Space Agency, national space agencies and European industry
associationsforthepurposeofdevelopingandmaintainingcommonstandards.Requirementsinthis
Standardaredefinedintermsofwhatshallbeaccomplished,ratherthanintermsofhowtoorganize
and perform the necessary work. This allows existing organizational structures and methods to be
appliedwheretheyareeffective,andforthestructuresandmethodstoevolveasnecessarywithout
rewritingthestandards.
This Standard has been prepared by the ECSSQST7008 Working Group, reviewed by the ECSS
ExecutiveSecretariatandapprovedbytheECSSTechnicalAuthority.
Disclaimer
ECSSdoesnotprovideanywarrantywhatsoever,whetherexpressed,implied,orstatutory,including,
butnotlimitedto,anywarrantyofmerchantabilityorfitnessforaparticularpurposeoranywarranty
that the contents of the item are errorfree. In no respect shall ECSS incur any liability for any
damages,including,butnotlimitedto,direct,indirect,special,orconsequentialdamagesarisingout
of, resulting from, or in any way connected to the use of this Standard, whether or not based upon
warranty,businessagreement,tort,orotherwise;whetherornotinjurywassustainedbypersonsor
propertyorotherwise;andwhetherornotlosswassustainedfrom,oraroseoutof,theresultsof,the
item,oranyservicesthatmaybeprovidedbyECSS.
Publishedby:
Copyright:
ESARequirementsandStandardsDivision
ESTEC, P.O. Box 299,
2200 AG Noordwijk
The Netherlands
2009 by the European Space Agency for the members of ECSS
ECSSQST7008C
6March2009
Change log
ECSSQ7008
Firstissue
6August1999
ECSSQST7008C
Secondissue
6March2009
ThesignificantchangesbetweentheECSSQ7008Aandthisversionare:
Theenvironmentalconditionsoftheassemblyareahavebeenmodified.
Thefluxdesignationhasbeencompleted.
Theuseofnewsolventsisallowedsubjecttosuccessfultesting.
Theuseofdeviceswithnonbendableleadshasbeenimplemented.
Thewettingacceptancelimitshavebeenmodified.
Thevibrationlevelshavebeenmodified.
Moreguidancehasbeenincludedoncomponentmountingheightsand
staking.
FlatpackdeviceshavemigratedtoECSSQ7038.
ECSSQST7008C
6March2009
Table of contents
Change log .................................................................................................................3
Introduction..............................................................................................................11
1 Scope.....................................................................................................................12
2 Normative references ...........................................................................................13
3 Terms, definitions and abbreviated terms..........................................................14
3.1
3.2
3.3
Calibration ................................................................................................................24
5.2
5.3
5.4
5.5
5.6
5.5.1
General.......................................................................................................25
5.5.2
5.5.3
5.5.4
General.......................................................................................................27
5.6.2
Brushes ......................................................................................................27
5.6.3
5.6.4
Bending tools..............................................................................................28
5.6.5
5.6.6
5.6.7
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5.6.8
Soldering tools............................................................................................ 31
General.....................................................................................................................32
6.2
Solder .......................................................................................................................32
6.3
6.2.1
Form ...........................................................................................................32
6.2.2
Composition................................................................................................33
Flux...........................................................................................................................33
6.3.1
6.3.2
6.3.3
6.4
Solvents....................................................................................................................35
6.5
6.6
Terminals..................................................................................................................36
6.6.1
Materials .....................................................................................................36
6.6.2
6.6.3
Shape of terminals......................................................................................36
6.7
Wires ........................................................................................................................37
6.8
PCBs ........................................................................................................................37
6.9
6.8.1
Boards ........................................................................................................37
6.8.2
7.2
7.3
General.....................................................................................................................39
7.1.1
Tools...........................................................................................................39
7.1.2
Components ...............................................................................................39
7.2.2
Surfaces to be soldered..............................................................................40
7.2.3
7.2.4
7.2.5
7.2.6
Fit................................................................................................................44
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7.3.2
Maintenance ...............................................................................................44
7.3.3
Plated bits...................................................................................................45
7.3.4
Tip in operation...........................................................................................45
7.4
7.5
7.6
7.7
7.6.1
Components ...............................................................................................45
7.6.2
PCBs ..........................................................................................................46
7.6.3
Process.......................................................................................................46
7.7.2
7.7.3
8 Mounting of components.....................................................................................47
8.1
8.2
General requirements...............................................................................................47
8.1.1
Introduction.................................................................................................47
8.1.2
Heavy components..................................................................................... 47
8.1.3
8.1.4
8.1.5
8.1.6
8.1.7
8.1.8
8.1.9
8.1.10
Location ......................................................................................................52
8.1.11
General.......................................................................................................53
8.2.2
8.3
8.4
General.......................................................................................................55
8.4.2
8.4.3
Stud leads...................................................................................................57
8.4.4
8.4.5
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8.5
8.6
9.2
9.3
9.4
General.....................................................................................................................61
9.1.1
Conductors .................................................................................................61
9.1.2
Terminals....................................................................................................61
9.2.2
Insulation clearance....................................................................................61
9.2.3
9.2.4
Stress relief.................................................................................................62
9.3.2
Bifurcated terminals..................................................................................................63
9.4.1
General.......................................................................................................63
9.4.2
9.4.3
9.4.4
9.4.5
9.4.6
9.5
9.6
Pierced terminals...................................................................................................... 67
9.7
9.8
Insulation sleeving....................................................................................................68
9.9
General.......................................................................................................69
9.9.2
Preparation of wires....................................................................................69
9.9.3
9.9.4
Pre-assembly..............................................................................................70
9.9.5
9.9.6
Cleaning .....................................................................................................71
9.9.7
Inspection ...................................................................................................71
9.9.8
Workmanship..............................................................................................71
9.9.9
Sleeving of interconnections....................................................................... 72
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Securing conductors...................................................................................74
10.1.2
Thermal shunts...........................................................................................74
10.1.3
10.2.2
10.2.3
10.3.2
10.3.3
10.3.4
10.4 Wicking.....................................................................................................................78
10.5 Solder rework ...........................................................................................................78
10.6 Repair and modification............................................................................................ 78
11.3.2
11.3.3
11.3.4
Test method................................................................................................80
13 Verification procedure........................................................................................83
13.1 General.....................................................................................................................83
13.2 Vibration ...................................................................................................................84
13.3 Temperature cycling................................................................................................. 86
13.4 Microsection .............................................................................................................86
14 Quality assurance...............................................................................................87
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14.1 General.....................................................................................................................87
14.2 Data..........................................................................................................................87
14.3 Nonconformance ...................................................................................................... 87
14.4 Calibration ................................................................................................................87
14.5 Traceability ...............................................................................................................88
14.6 Workmanship standards...........................................................................................88
14.7 Inspection .................................................................................................................88
14.8 Operator and inspector training and certification...................................................... 88
15 Workmanship standards....................................................................................90
15.1 Soldered clinched terminals ..................................................................................... 90
15.2 Soldered stud terminals............................................................................................ 91
15.3 Soldered turret terminals ..........................................................................................92
15.4 Solder turret terminals ..............................................................................................93
15.5 Soldered bifurcated terminals...................................................................................94
15.6 Soldered hook terminals........................................................................................... 95
15.7 Soldered cup terminals.............................................................................................96
15.8 Soldered wire to shielded cable interconnections .................................................... 97
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Figure 8-10: Methods of through-hole lapped termination ..................................................... 59
Figure 8-11: Method of stress relieving parts attached to terminals....................................... 59
Figure 9-1: Side- and bottom-route connections to turret terminals ....................................... 63
Figure 9-2: Bottom-route connections to bifurcated terminal ................................................. 64
Figure 9-3: Side-route connection to bifurcated terminal ....................................................... 65
Figure 9-4: Top-route connection to bifurcated terminal ........................................................ 66
Figure 9-5: Connections to hook terminals.............................................................................67
Figure 9-6: Connections to pierced terminals......................................................................... 67
Figure 9-7: Connections to solder cups (connector type)....................................................... 68
Figure 9-8: Methods for securing wires .................................................................................. 71
Figure 9-9: Connection of stranded wires to PCBs ................................................................73
Figure 10-1: High voltage connection.....................................................................................75
Figure 10-2:Minimum acceptable wetting on component side ............................................... 77
Figure 15-1:Soldered clinched terminals................................................................................ 90
Figure 15-2: Soldered stud terminals .....................................................................................91
Figure 15-3: Soldered turret terminals with twin conductors .................................................. 92
Figure 15-4: Soldered turret terminals with single conductors ............................................... 93
Figure 15-5: Soldered bifurcated terminals ............................................................................ 94
Figure 15-6 Soldered hook terminals .................................................................................... 95
Figure 15-7: Soldered cup terminals ......................................................................................96
Figure 15-8: Hand-soldered wire to shielded cable interconnections..................................... 97
Figure 15-9: Hand-soldered wire to shielded wire interconnections....................................... 98
Figure 15-10: Hand-soldered wire interconnections - details of defects .............................. 100
Tables
Table 6-1: Chemical composition of spacecraft solders......................................................... 33
Table 6-2: Fluxes.................................................................................................................... 34
Table 7-1: Clearances for insulation.......................................................................................40
Table 7-2: Solder baths for degolding and pretinning ............................................................ 42
Table 9-1: Dimensions for Figure 9-9..................................................................................... 73
Table 13-1: Sine survey ......................................................................................................... 85
Table 13-2: Minimum severity for sine vibration testing ......................................................... 85
Table 13-3: Minimum severity for random vibration testing for all applications except
launchers .............................................................................................................85
Table 13-4: Minimum severity for random vibration testing for launcher................................ 86
Table B-1 : Guide to choice of solder types .........................................................................105
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Introduction
ThemainpartofthisStandardisbasedonrecommendationsfromtheNational
Aeronautics and Space Administration and European soldering technology
experts. Modifications have been incorporated into the text to provide for the
specificrequirementoflowoutgassingelectricalsystemswhicharerequiredby
scientificandapplicationsatellites.Otheradditionshavebeenmadeinthelight
of recent technological advances and the results of verification test
programmes. The methods and workmanship contained in this document are
consideredtobefullyapprovedfornormalspacecraftrequirements.
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1
Scope
This Standard defines the technical requirements and quality assurance
provisions for the manufacture and verification of manuallysoldered, high
reliabilityelectricalconnections.
The Standard defines acceptance and rejection criteria for high reliability
manufactureofmanuallysolderedelectricalconnectionsintendedtowithstand
normal terrestrial conditions and the vibrational gloads and environment
imposedbyspaceflight.
The proper tools, correct materials, design and workmanship are covered by
thisdocument.Workmanshipstandardsareincludedtopermitdiscrimination
betweenproperandimproperwork.
TheassemblyofsurfacemountdevicesiscoveredinECSSQST7038.
RequirementsrelatedtoprintedcircuitboardsarecontainedinECSSQST7010
andECSSQST7011.
Verification of manual soldering assemblies which are not described in this
standard are performed by vibration and thermal cycling testing. The
requirementsforverificationaregiveninthisStandard.
ThisstandarddoesnotcoverthequalificationandacceptanceofEQMandFM
equipmentwithhandsolderedconnections.
The qualification and acceptance tests of equipment manufactured in
accordancewiththisStandardarecoveredbyECSSEST1003.
The mounting and supporting of components, terminals and conductors
prescribed herein applies to assemblies designed to operate within the
temperaturelimitsof55Cto+85C.
For temperatures outside this normal range, special design, verification and
qualification testing is performed to ensure the necessary environmental
survivalcapability.
Special thermal heat sinks are applied to devices having high thermal
dissipation(e.g.junctiontemperaturesof110C,powertransistors)inorderto
ensurethatsolderjointsdonotexceed85C.
Thisstandardmaybetailoredforthespecificcharacteristicandconstrainsofa
spaceprojectinconformancewithECSSSST00.
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2
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references,subsequentamendmentsto,orrevisionofanyofthesepublications
donotapply,However,partiestoagreementsbasedonthisECSSStandardare
encouragedtoinvestigatethepossibilityofapplyingthemorerecenteditionsof
the normative documents indicated below. For undated references, the latest
editionofthepublicationreferredtoapplies.
ECSSSST0001
ECSSsystemGlossaryofterms
ECSSQST1009
ECSSQST20
SpaceproductassuranceQualityassurance
ECSSQST7002
SpaceproductassuranceThermalvacuumoutgassing
testforthescreeningofspacematerials
ECSSQST7010
ECSSQST7011
ECSSQST7028
ECSSQST7071
ESCC23500
EN6134051
EN6134052
MILSTD883Rev.G
Testmethodsandproceduresformicroelectronics
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3
Terms, definitions and abbreviated terms
3.1
3.2
approval authority
entitythatreviewsandacceptstheverificationprogramme,evaluatingthetest
resultsandgrantsthefinalapproval
3.2.2
base laminate
seesubstrate
3.2.3
terminal containing a slot or split in which wires or leads are placed before
soldering
3.2.4
bit
removableheatstoreofasolderingiron
3.2.5
blister
delaminationinadistinctlocalareaorareas
3.2.6
bridging
buildupofsolderorconformalcoatingbetweenparts,componentleadsorbase
substrateforminganelevatedpath
NOTE
Seefillet.
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3.2.7
clinched-lead termination
conductororcomponentleadwhichpassesthroughaprintedcircuitboardand
isthenbenttomakecontactwiththeprintedcircuitboardpad
NOTE
3.2.8
Theclinchedportionisnotforcedtolieflaton
the pad and some innate spring back is
desirable before this form of termination is
soldered.
cold flow
movementofinsulation,forexampleTeflon(PTFE),causedbypressure
3.2.9
joint in which the solder has a blocky, wrinkled or piledup appearance and
showssignsofimproperfloworwettingaction
NOTE
3.2.10
component
3.2.11
integrated
circuits,
hybrids,
component lead
solidwirewhichextendsfromandservesasaconnectiontoacomponent
3.2.12
conductor
leadorwire,solidorstranded,orprintedcircuitpatchservingasanelectrical
interconnectionbetweenterminations
3.2.13
conformal coating
3.2.14
connection
electricaltermination
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3.2.15
contact angle
3.2.16
contamination
particles,liquids,gases,materialsandmicroorganismswhichbytheirpresence
candisturbtheperformanceofanitem
3.2.17
corrosion
3.2.18
solderedconnectionwhichhasfracturedorbrokenwithinthesolder
3.2.19
dewetting
condition in a soldered area in which the liquid solder has not adhered
intimately,characterizedbyanabruptboundarybetweensolderandconductor,
orsolderandterminal/terminationarea
NOTE
3.2.20
Thisisoftenseenasadullsurfacewithislands
ofthickershinysolder.
unsatisfactoryconnectionresultingfromrelativemotionbetweentheconductor
andterminationduringsolidificationofthesolder
3.2.21
electrical connection
conductiveconnectioninelectricalorelectroniccircuits
3.2.22
eutectic alloy
alloyoftwoormoremetalsthathasonedistinctmeltingpoint
NOTE
3.2.23
Oneeutecticsolderisatinleadalloycontaining
63%Snand37%Pbwhichmeltsat183C
fillet
smoothconcavebuildupofmaterialbetweentwosurfaces
NOTE
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orafilletofconformalcoatingmaterialbetween
acomponentandprintedcircuitboard
3.2.24
flux
material which, during soldering, removes the oxide film, protects the surface
fromoxidation,andpermitsthesoldertowetthesurfacestobejoined
3.2.25
flux activity
property of a flux which allows the smallest contact angle between molten
solderandasolidsurface
NOTE
3.2.26
Seealsorosin.
glass meniscus
glassfilletofaleadsealwhichoccurswhereanexternalleadleavesthepackage
body
3.2.27
haloing
conditionexistinginthebaselaminateofaprintedcircuitboardintheformofa
lightareaaroundholesorothermachinedareasonorbelowthesurfaceofthe
laminate
3.2.28
hook terminal
terminalformedinahookshape
3.2.29
icicles
seesoldericicle
3.2.30
interfacial connection
3.2.31
Normallyaplatedthroughhole.
lap joint
joiningorfusingoftwooverlappingmetalsurfaceswithsolderwithoutuseof
anyothermechanicalattachmentorsupport
3.2.32
measling/measles
condition existing in the base laminate of printed circuit board in the form of
discrete white spots or crosses below the surface of the base laminate,
reflectingaseparationoffibresintheglassclothattheweaveintersection
NOTE
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3.2.33
3.2.34
Seealsoprintedcircuitboard.
pad
3.2.35
pits
smallholesorsharpdepressionsinthesurfaceofsolder
NOTE
3.2.36
plated-through hole
holeinwhichmetalisdepositedontheinsidesurface
NOTE1 AdaptedfromIECMultilingualdictionary.
NOTE2 Also known as a supported hole. The
configuration is used to provide additional
mechanicalstrengthtothesolderedtermination
ortoprovideanelectricalinterconnectionona
doublesided or multilayer printed circuit
board.
3.2.37
potting compound
3.2.38
productresultingfromtheprocessofselectivelyetchingunwantedcopperfrom
one or both surfaces of a copperclad insulating substrate to form a desired
circuitrypatternwhichissubsequentlysolderorgoldplated
NOTE
3.2.39
resin
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NOTE
3.2.40
resistance soldering
methodofsolderingbypassingacurrentbetweentwoelectrodesthroughthe
areatobesoldered
3.2.41
rosin
natural resin obtained as the residue after removal of turpentine from the
oleoresin of the pine tree, consisting mainly of abietic acid and related resin
acids,theremainderbeingresinacidesters
NOTE
3.2.42
rosin-soldered joint
unsatisfactoryconnectionwhichhasentrappedrosinflux
3.2.43
selective plating
areaofaplatedcircuitboardthatisdesignedtohaveadifferentplatedfinish
thantherestoftheboard
NOTE
3.2.44
shield
3.2.45
solder
nonferrousfusiblemetallicalloyoftwoormoremetals(usuallytinandlead)
used when melted to join or fuse metallic surfaces together and to provide a
lowresistanceelectricalpath
3.2.46
solderability
propertyofasurfacewhichallowsittobewettedbymoltensolder
NOTE
Standardtestsexisttoassessthesolderabilityof
conductors. Surfaces are considered to have a
good solderability if, following the
proceduresofthisstandard,solderwettingcan
be achieved within 3 seconds and dewetting
doesnotoccurbefore8seconds.
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3.2.47
solder coating
surfacecoatedwithathin,uniformlayerofsolder
3.2.48
solder-cup terminal
3.2.49
solder icicle
conicalpeakorsharppointofsolderusuallyformedbytheprematurecooling
andsolidificationofsolderuponremovaloftheheatsources
3.2.50
solder pad
terminationareaonaprintedcircuitconductor
3.2.51
soldering
process of joining metallic surfaces through the use of solder without direct
fusionofthebasemetals
3.2.52
soldering time
timerequiredforasurfacetobewettedbysolderunderspecifiedconditions
3.2.53
stress lines
threeformsofstresslinescanappearonafinishedsolderfillet:
a.
b.
c.
linesrunningcircumferentiallyaroundthemidsectionofthesolderfillet
causedbyshrinkageduringthelaststageofsolidification
3.2.54
stress relief
3.2.55
Generallyintheformofabendorserviceloop
in a component lead, solid or stranded wire to
providerelieffromstressbetweenterminations,
as that caused, for instance by movement or
thermalexpansion
stud termination
uprightconductorterminationthroughaprintedcircuitboard
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3.2.56
substrate
3.2.57
termination/terminal area
3.2.58
thermal shunt
3.2.59
tinning
coatingofasurfacewithauniformlayerofsolderbeforeitisusedinasoldered
connection
3.2.60
tip
applicationsurfaceattheendofthesolderingironbit
3.2.61
turret terminal
round posttype grooved stud around which conductors are fastened before
soldering
3.2.62
wetting
flowandadhesionofaliquidtoasolidsurface,characterizedbysmooth,even
edgesandlowcontactangle
3.2.63
wicking
flowofmoltensolderorcleaningsolutionbycapillaryaction
NOTE
3.2.64
wire
singlemetallicconductorofsolid,orstranded,construction,designedtocarry
current in an electric circuit, but which does not have a metallic covering,
sheathorshield
NOTE
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3.3
Abbreviated terms
ForthepurposeofthisStandard,theabbreviatedtermsfromECSSSST0001
andthefollowingapply:
Abbreviation
Meaning
AWG
Americanwiregauge
ETFE
ethylenetetrafluoroethylene
ESD
electrostaticdischarge
FEP
fluorinatedethylenepropylene
INH1
IEC6119013(2002)fluxdesignation:inorganic,high
activation(>2%halide)
PCB
printedcircuitboard
PSD
powerspectraldensity
PTFE
polytetrafluoroethylene
RF
radiofrequency
Rg
resistancetoground
R s
surfaceresistance
ROH1
IEC6119013(2002)fluxdesignation:rosin,highactivation
(2%halide)
ROL0
IEC6119013(2002)fluxdesignation:rosin,verylow
activation(<0,01%halide)
ROL1
IEC6119013(2002)fluxdesignation:rosin,lowactivation
(<0,15%halide)
r.m.s.
rootmeansquare
SMT
surfacemounttechnology
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4
Principles of reliable soldered connections
The following are the general principles to ensure reliable manuallysoldered
connections:
Materialsareselectedsuchthatthemismatchofthermalexpansion
coefficients is a minimum at the constraint points in the
componentmountingconfiguration.
Theassembledsubstratesaredesignedtoallowinspection.
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5
Preparatory conditions
5.1
5.2
Calibration
a.
b.
Facility cleanliness
a.
Personnelfacilitiesshallbeseparatedfromthesolderingareas.
NOTE
b.
Furnitureshallbearrangedtoallowthoroughcleaningofthefloor.
c.
Areasusedforsolderingshallbekeptfreefromcontaminants.
NOTE
5.3
d.
Working areas shall be kept free from any tools or equipment not used
forthecurrenttask.
e.
f.
g.
Excesslubricantsshallberemovedfromtoolsbeforesolderingstarts.
Environmental conditions
a.
Thesolderingareashallhaveacontrolledenvironmenttolimittheentry
ofcontaminants.
NOTE
Itisgoodpracticetosolderinacleanroom(see
ISO146441).
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5.4
5.5
b.
Areas used for assembly or cleaning of parts and areas where toxic or
volatile vapours are generated or released shall include a local air
extractionsystem.
c.
Theroomtemperatureofthefacilityshallbemaintainedat22C3C.
d.
e.
Thesolderingareashallnotbeexposedtodraughts.
f.
Airshallbesuppliedtotheroomthroughafilteringsystemthatprovides
apositivepressuredifferencewithrespecttoadjacentrooms.
Lighting requirements
a.
Lightingintensityshallbeaminimumof1080luxontheworksurface.
b.
General
a.
b.
Electrostaticsensitivecomponentsshallbeprepared,mounted,soldered
andcleanedinanESDprotectedarea.
c.
d.
ContainersforESDsensitivecomponentsshallbesolabelled.
5.5.2
a.
The working bench shall have a static dissipative top with surface
resistance(Rs)intherange1104to11010.
b.
The working bench shall have a static dissipative top resistance to ESD
protectedareaground(Rg)intherange7,5105to1109.
c.
AwriststraphavingaresistancetoESDprotectedareaground(Rg)inthe
range7,5105to3,5107shallbewornbytheoperator.
d.
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e.
Poweredequipmentattheworkstationshallbegrounded.
NOTE
Thenormalvalueoftheresistancebetweenthe
tip of the soldering system and the ground of
the ESD protected area does not exceed 5 .
The measurement is generally performed at
solderingtemperature.
f.
Agroundfaultcircuitinterruptershallbeinstalled.
g.
Protectiveclothingshallbemadefromstaticdissipativematerial.
h.
Glovesandfingercotsshallbemadefromstaticdissipativematerial.
NOTE
i.
j.
PaperworkshallnotcomeintocontactwithESDsensitivecomponents.
k.
IonisedairinpresenceofhighvoltageorRFshallnotbeused.
NOTE
5.5.3
a.
b.
ESDprotectivepackagingshalldisplayESDwarningsigns.
c.
IfthepackagingisnotESDsafe,itshallbelabelledaccordingly.
NOTE
d.
e.
Thecontainershallprovide:
1.
anoutershellthatprovidesadequatemechanicalprotectionforthe
contents;
2.
3.
ashieldingpackagefortheESDsensitivecontents.
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f.
PinkPolyethylene(pinkpoly)bags,film,bubblewraporfoamnearany
ESDsensitiveitemorwithinanESDprotectedareashallnotbeused.
NOTE
5.5.4
a.
5.6
Shipping popcorn, foam liners and polystyrene foam shall not be used
nearESDsensitiveitemsunlessshieldingoverwrapprotectsthem.
General
Newequipmentsandtoolsshallbeinspectedtoensurethattheyarenot
defectivepriortouse.
5.6.2
Brushes
a.
Mediumstiffnaturalorsyntheticbristle,ESDsafe,brushesshallbeused
forcleaningprovidedthattheydonotdamageanysurfacetobecleaned
oradjacentmaterials.
b.
Brushesshallbecleanedinasolventinaccordancewithclause6.4.
c.
BrushesshallnotbedamagedbythesolventsusedforPCBcleaning.
d.
Wirebrushesshallnotbeused.
5.6.3
a.
CuttingedgeprofilesandcutterusageshallbeinaccordancewithFigure51.
b.
Thecutterusedfortrimmingconductorwireandcomponentleadsshall
shearsharply,producingaclean,flat,smoothcutsurfacealongtheentire
cuttingedge.
NOTE1 These measures minimize the transmission of
mechanicalandshockloadstodelicateparts.
NOTE2 Smooth, longnose pliers or tweezers can be
usedforattachingorremovingconductorwires
andcomponentleads.
c.
Notwistingactionshalloccurduringthecuttingoperation.
d.
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ECSSQST7008C
6March2009
Cutter
Figure51:Profilesofcorrectandincorrectcuttersfortrimmingleads
5.6.4
Bending tools
a.
b.
c.
5.6.5
a.
Clinching tools
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ECSSQST7008C
6March2009
5.6.6
Insulation strippers
5.6.6.1
Thermal strippers
a.
Thetemperatureofthestrippershallnotburn,blisterorcauseexcessive
meltingoftheinsulation.
NOTE1 Thermal insulation strippers can be used for
wireinsulationtypessusceptibletodamageby
mechanicalstrippers.
NOTE2 Itisgoodpracticetoapplythermalstrippersfor
usewithAWG22andsmallerwiresizeswhere
there is a possibility of the wire stretching if a
mechanicalstripperisused.
NOTE3 Local air extraction units can be used during
thermalstripping.
5.6.6.2
a.
Mechanicalstrippersshallbeofthefollowingtypes:
1.
2.
b.
of
Strippingtoolsormachinesshallfitthesizeofthewireconductor.
NOTE
c.
Itisgoodpracticetomaskoffthedieopenings
forwiresizesnotinuse.
The conductor shall not be twisted, ringed, nicked, cut orscoredby the
process.
Figure52Examplesofnonapprovedtypesofmechanicalstrippers
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6March2009
5.6.6.3
a.
Enamel stripping
Theenamelshallberemovedbychemicalorthermalmeans.
NOTE
b.
Theenamelmayberemovedbymechanicalmeansprovidedthatvisual
inspectionusingaminimummagnificationofx40iscarriedouttoensure
thattheconductorisundamaged.
5.6.6.4
a.
Seealso6.7d.
Thermalandmechanicalstrippingtoolsshallbeverifiedbysamplingat
thestartofeachproductionrun.
5.6.7
a.
The size and shape of the soldering iron and bit shall not damage
adjacentareasorconnectionsduringsolderingoperations.
b.
Temperaturecontrolledsolderingironsshallbeused.
NOTE
c.
Filesshallnotbeusedfordressingplatedcoppersolderingirontips.
d.
e.
Thesolderingironorresistanceheatingelectrodeshallheatthejointarea
to the solder liquidus temperature in a time between 1 second and 2
seconds.
f.
g.
h.
i.
Asolderingbittemperaturelowerthan280Cmaybeused.
j.
k.
l.
Asolderingironholdershallbeused.
NOTE
Itisgoodpracticetouseacagetypeholderthat
leavesthesolderingirontipunsupportedwhen
atemperaturecontrolledsolderingironisused.
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6March2009
5.6.8
Soldering tools
5.6.8.1
General
a.
Theleadsshallnotbedamagedduringpreparationandassembly.
5.6.8.2
a.
Holding tools used as soldering aids shall not be wetted by the solder
duringtheassembly.
5.6.8.3
a.
Holding tools
Thermal shunts
b.
The heat sink shall be used when the nonthermal sensitivity of the
devicecannotbedemonstrated.
c.
The thermal shunt shall not disturb the solder joint by mechanical
interference.
d.
5.6.8.4
a.
Anti-wicking tools
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6
Materials selection
6.1
General
a.
MaterialselectionshallbeperformedinaccordancewithECSSQST7071.
b.
c.
Electrical/electroniccomponentsidentifiedashavingplatedormetallized
externalsurfaceswithatinfinishcontainingmorethan97%tinmaybe
pretinnedwithatinleadsolderinaccordancewith6.2.2b.
NOTE
d.
Pretinningshallnotdegradeordamagethecomponent.
NOTE
6.2
Seealso6.1c.
e.
f.
Solder
6.2.1
Form
a.
Forsoldering,ribbon,wireandpreformsshallbeusedprovidedthatthe
alloyandfluxmeettherequirementsofthisstandard.
b.
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6.2.2
a.
Composition
ThesolderalloyshallhaveacompositionspecifiedinTable61.
NOTE1 SeeISO9453forfurtherdetails.
NOTE2 The solder alloy used depends on the
application.SeeAnnexTableB1forguidelines
forthechoiceofsoldertype.
b.
Thesolderalloyusedfordegoldingandpretinningshallbe60tinsolder,
62tinsilverloadedor63tinsolder.
Table61:Chemicalcompositionofspacecraftsolders
Ag
Sn
Pb
In
Sb
Bi
Cu
Fe
Zn
Al
As
Cd
Other
minmax
max
minmax
max
min
max
max
max
max
max
max
max
max
max
63tinsolder
62,563,5
Rem.
0,05
0,10
0,05
0,02
0,001
0,001
0,03
0,002
0,08
62tinsilverloaded
61,562,5
Rem.
0,05
1,82,2
0,10
0,05
0,02
0,001
0,001
0,03
0,002
0,08
60tinsolder
59,561,5
Rem.
0,05
0,10
0,05
0,02
0,001
0,001
0,03
0,002
0,08
96tinsolder
Rem.
0,10
0,05
3,54,0
0,10
0,05
0,02
0,001
0,001
0,03
0,002
0,08
9,010,5
Rem.
0,05
0,10
0,05
0,02
0,001
0,001
0,03
0,002
0,08
ESAdesignation
10tinlead
6.3
Flux
6.3.1
a.
Rosin-based fluxes
FluxesshallbeselectedinaccordancewithTable62.
NOTE
b.
c.
When pretinning with mildly activated rosinbased flux does not give
acceptablewetting,fullyactivatedrosinbasedfluxes(e.g.ROH1)maybe
used.
NOTE
d.
When pretinning with fully activated rosinbased flux does not give
acceptablewetting,INH1corrosive,watersoluble,acidfluxmaybeused
inaccordancewithclause6.3.2.
NOTE
e.
Forassemblythefollowingfluxesshallbeselected:
1.
Fornormalassembly,usepurerosinflux.
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ECSSQST7008C
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NOTE
2.
Whenmildlyactivatedrosinfluxisused,monitortheeffectiveness
ofsubsequentcleaningoperationsinaccordancewithclause11.3.
NOTE
f.
Example:PurerosinfluxROL0.
Example:MildlyactivatedrosinfluxROL1.
Example:FullyactivatedrosinfluxROH1.
Table62:Fluxes
IEC6119013
(2002)
designation
Equivalent
designationfrom
ISO29454(1994)
Nature
Nominal
composition
(Weight%)
Pretinning
Normalwetting
ROL1
1.1.2.WorX
Rosin
<0,15%halide
Difficult
wetting
ROH1
1.1.2.Z
Rosin
2,0%halide
InorganicWater
soluble
>2,0%halide
Verydifficult
wetting
INH1
Assembly
Preferred
ROL0
1.1.1
Rosin
<0,01%halide
Requiring
cleanliness
testing
ROL1
1.1.2.WorX
Rosin
<0,15%halide
6.3.2
a.
INH1fluxresiduesshallberemovedimmediatelyafteruseinaccordance
withclause11,beforeanyfurthersolderingoperations.
b.
This flux shall not be used where vapours or residues of spattered flux
cancomeintocontactwithelectricalinsulationmaterial.
c.
INH1fluxshallbestoredseparatelyfrompurerosinfluxesandmildly
activatedrosinfluxes.
NOTE
6.3.3
a.
Application of flux
The quantity of flux used shall be such that the solder joint is in
accordancewithclause12.
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ECSSQST7008C
6March2009
6.4
b.
When fluxcored solder isused, it shallbe positioned such that the flux
flowsandcoversthecomponentstobejoinedasthesoldermelts.
c.
d.
Whenexternalfluxisused,liquidfluxshallbeappliedtothesurfacesto
bejoinedpriortotheapplicationofheat.
Solvents
a.
Solventsfortheremovalofgrease,oil,dirt,fluxandfluxresiduesshallbe
electricallynonconductiveandnoncorrosive.
b.
Solventsshallnotdissolveordegradethequalityofpartsormaterials.
c.
Solventsshallnotremovecomponentidentificationmarkings.
d.
Solventsshallbelabelled.
e.
Solventsshallbemaintainedinanuncontaminatedcondition.
f.
g.
Solventsshallnotbeusedsuchthatdissolvedfluxresiduecontaminates
electricalcontactsurfaces.
NOTE
h.
6.5
Examplesofelectricalcontactsurfacesarethose
inswitches,potentiometersorconnectors.
Thefollowingsolventsshallbeusedforcleaninginsolderingoperations:
1.
ethylalcohol,99,5%pureor95%purebyvolume,
2.
isopropylalcohol,99%pure,
3.
4.
anymixtureof6.4h.1to3.
i.
j.
Waterbasedsolventscontainingsaponifiersshallnotbeused.
k.
Solventsshallbeselectedsuchthattheydrycompletely.
MaterialsshallhavelowoutgassingpropertiesinaccordancewithECSS
QST7002.
b.
ETFE,FEPandPTFE.
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ECSSQST7008C
6March2009
c.
2.
3.
Irradiatedpolyethylene,fluorinatedresinandpolyimide.
PTFEmaterialsshallnotbeheatedabove250C.
NOTE
6.6
Terminals
6.6.1
a.
Materials
Terminalsshallbemadefromoneofthefollowingmaterials:
1.
Bronze(copper/tin)alloys.
NOTE
2.
b.
Itisgoodpracticetousebronzeterminals.
Brass(copper/zinc)alloys.
c.
Terminalsshallbetin/leadcoatedwithanalloycontainingamaximumof
97%tin.
NOTE
d.
Terminalswithcoatingsonthemountingsurfaceshallberejectedifthe
coatingslooseninsubsequentsolderingoperations.
6.6.2
a.
TerminalsonPCBsshallnotbetin,silverorgoldplated.
b.
6.6.3
a.
Shape of terminals
Bifurcatedandturretterminalsshallhaveledgesorgroovestoallowboth
theaccuratelocationofconnectingwiresandtheflowofsolder.
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6March2009
6.7
6.8
Wires
a.
Wireshallbemadefromhighpuritycopperorcopperalloy.
b.
Thewireshallhaveoneofthefollowingfinishes:
Silvercoating.
Wiredrawn,fusedpuretin.
Enamelled.
c.
Wiresshallbestrippedoftheirinsulationinaccordancewithclause7.2.1.
d.
When stripping the ends of enamel wires the complete removal of the
enamelshallbeverifiedbyvisualinspection.
e.
f.
Theenamelshallnotbevisuallycontaminatedbythestrippingprocess.
PCBs
6.8.1
Boards
a.
b.
6.8.2
a.
Goldplatedconductorsshallnotbesoldered.
b.
Degoldingofconductorsshallbeinaccordancewithclause7.2.3.
NOTE
6.9
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ECSSQST7008C
6March2009
Limitedshelflifeitemsshallbestoredandcontrolledinaccordancewith
thematerialmanufacturersrecommendationsorinaccordancewiththe
manufacturers documented procedures for controlling shelf life and
shelflifeextensionswherepermitted.
b.
c.
Theuncured(tack)strengthshallbecapableofholdingdevicesinplace
duringhandlingpriortocure.
d.
e.
f.
g.
h.
Shrinkage of resin during cure and repair shall not degrade the coated
articles.
i.
j.
Adhesives,encapsulantsandconformalcoatingsshallbeselectedonthe
basisoftheirthermalconductivityanddielectricproperties.
NOTE
k.
NOTE2
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ECSSQST7008C
6March2009
7
Preparation for soldering
7.1
General
7.1.1
a.
Operators shall use tools that are fit for the purpose and undamaged
priortouse.
7.1.2
a.
7.2
Tools
Components
Insulation removal
7.2.1.1
Stripping tools
a.
Strippingtoolsormachinesshallbeinaccordancewithclause5.6.6.
7.2.1.2
Damage to insulation
a.
b.
Conductorswithdamagedinsulationshallnotbeused.
NOTE1 Example: Insulation damage includes nicks,
cuts,crushingandcharring.
NOTE2 Theoperationofmechanicalstrippingtoolscan
leaveslightpressuremarkingsintheremaining
conductor insulation. This effect is considered
tobenormal.
c.
Theinsulationmaterialshallnotbecharredbythermalstripping.
NOTE
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ECSSQST7008C
6March2009
7.2.1.3
a.
Damage to conductors
Theconductorshallnotbedamagedbytheinsulationremovalprocess.
NOTE
Example:Conductordamageincludestwisting,
ringing,nicks,cutsorscores.
b.
Part leads and other conductors that are reduced in crosssectional area
bytheinsulationremovalprocessshallnotbeused.
c.
Coatedwireswherethebasematerialisexposedshallnotbeused.
7.2.1.4
Insulation clearance
7.2.1.4.1
Maximum clearance
a.
Themaximuminsulationclearance,measuredfromthesolderjoint,shall
beasstatedinTable71.
b.
7.2.1.4.2
a.
Minimum clearance
b.
c.
The minimum insulation clearance shall not obscure the contour of the
conductorattheterminationendoftheinsulation.
Table71:Clearancesforinsulation
Wirediameter
(AmericanWireGauge)
Conductordiameter,d
(mm)
Insulationclearance
(maximum)
32to24
0,200to0,510
4d
22to12
0,636to2,030
3d
10
2,565
2d
7.2.2
Surfaces to be soldered
7.2.2.1
Cleaning
a.
Beforeassembly,devices,wire,terminalandconnectorcontactsshallbe
visuallyexaminedforcleanliness,absenceofoilfilmsandfreedomfrom
tarnishorcorrosion.
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6March2009
b.
c.
Abrasivesshallnotbeusedforsurfacepreparationexceptinthecaseof
goldplating on substrates and devices in accordance with clause
7.2.3.2.1.
NOTE
7.2.2.2
Wire lay
a.
b.
Restorationofthelayshallbedonewithoutcontaminatingtheconductor.
7.2.2.3
a.
Terminals and solder cup sizes shall be selected to match the size of
conductorsinaccordancewiththemanufacturersdatasheet.
b.
Thesizeofterminalsorsoldercupsshallnotbemodified.
7.2.3
7.2.3.1
General
a.
Tinleadalloysoldersshallnotbeusedtosoldertogold.
7.2.3.2
7.2.3.2.1
a.
RemovalofgoldfromPCBconductorsbymechanicalabrasionshallnot
beusedforremovinggoldplatinggreaterthan1mthick.
b.
Thegoldplatingshallberemovedusingapumiceimpregnatederaser.
c.
RemovalofgoldfromPCBconductorsbymechanicalabrasionshallnot
damagethesubstratematerials.
d.
RemovalofgoldfromPCBconductorsbymechanicalabrasionshallnot
impairthesolderabilityoftheconductor.
e.
RemovalofgoldfromPCBconductorsbymechanicalabrasionshallnot
reducethethicknessofthecopperconductor.
NOTE
ItisgoodpracticetodesignPCBswithselective
plating to avoid the necessity to remove gold
plating,seeclause6.8.2.
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7.2.3.2.2
Solder baths
a.
b.
Surfaceimpuritiesshallberemovedfromthebathsurfacebeforeuse.
c.
2.
d.
e.
Theleadsshallbepretinnedinbath2inaccordancewithclause7.2.6.
f.
Thecomponentleadsshallbeallowedtocoolbeforecleaning.
7.2.3.2.3
a.
Soldershallbemeltedwithinthegoldplatedsoldercup.
NOTE
b.
Theliquidsolderdissolvesthegoldplating.
Theliquidsoldershallbewickedoutusingstrandedwire.
7.2.3.2.4
a.
Soldershallbemeltedontotheconductorusingaheatedsolderingiron.
b.
Soldershallbewickedoutusingstrandedwire.
Table72:Solderbathsfordegoldingandpretinning
Use
Temperaturerange
(C)
Contaminationlimits
(weight%)
7.2.4
Solderbath1
Solderbath2
Golddissolution
Pretinning
250to280
210to280
Au<1
Cu<0,25;Au<0,2;(Cu+Au)<0,3;
Zn,AlandFe:Trace.
a.
b.
Thermalshunts,inaccordancewithclause5.6.8.3,maybeused.
c.
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ECSSQST7008C
6March2009
d.
Liquidsoldershallnotcomeintocontactwiththecomponentbodyorits
glassmeniscus.
e.
The limit of the pretinned coating shall not be less than 0,75 mm from
anyleadtoglasssealofthecomponentpackage.
7.2.5
7.2.5.1
Solder baths
a.
Solderbathsforpretinningshallbeinaccordancewithclause7.2.3.
b.
7.2.5.2
a.
Theinsulationshallberemovedinaccordancewithclause7.2.1.
b.
Purerosinfluxshallbeappliedtotheendofthestrands.
c.
Thefluxedendofthewireshallbedippedintosolderbath2foratime
between2secondsand3seconds.
NOTE
7.2.5.3
Pretinningpromotessolderabilityandprevents
untwistingorseparationstrandedwires.
a.
Soldershallpenetratetotheinnerstrandsofstrandedwire.
b.
Solder shall not obscure the wire contour at the termination end of the
insulation.
c.
Antiwickingtoolsinaccordancewithclause5.6.8.4maybeused.
d.
Pretinningshallnotdegradethecharacteristicsofthewire.
NOTE
Flowofsolder(wicking)beyondtheinsulation
canreducetheflexibilityofthewire.
e.
Theinsulationshallnotbedamagedbythepretinning.
f.
Fluxshallberemovedbymeansofacleaningsolvent,seeclause6.4.
g.
Cleaningsolventshallnotflowundertheconductorinsulation.
NOTE
Applicationusingalintfreeclothcanlimitthe
flowofsolvent.
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ECSSQST7008C
6March2009
7.2.6
7.2.6.1
a.
Solderbathsforpretinningshallbeinaccordancewithclause7.2.3.
b.
1. Componentleadswithunacceptablesolderabilityinaccordancewith
the component procurement specification and solid wires shall be pre
tinnedbydippingintosolderbath2(seeTable72)foraperiodbetween
2secondsand8seconds.
NOTE1 It is good practice to observe an immersion
periodofbetween3secondsand4seconds.
NOTE2 Aslow,verticalandsmoothwithdrawalofthe
component lead from the bath promotes an
evencoating.
c.
d.
Thecomponentshallcoolbeforecleaning.
NOTE
7.2.6.2
a.
7.3
Rapidcoolingbycontactwithcleaningsolvents
cancrackpackagesorglasstometalseals.
Soldering-iron method:
Soldershallbemeltedontotheconductorusingaheatedsolderingiron.
Thebitshallbefittedinaccordancewiththeequipmentmanufacturers
specification.
7.3.2
a.
Fit
Maintenance
Oxidationproductsshallberemovedfromthebit.
NOTE
b.
Platedtipsshallbeexaminedforcracking.
NOTE
c.
d.
Bitswithcrackedplatingsshallberemovedfromthesolderingarea.
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ECSSQST7008C
6March2009
7.3.3
Plated bits
a.
Depositsshallberemovedusingamoistsponge.
b.
Adherentdepositsmayberemovedusingfineabrasivepaper(grainsize
600).
NOTE
7.3.4
a.
Tip in operation
7.4
7.6
Pretinningpreventsoxidationofthebit.
7.5
b.
c.
d.
After final cleaning, personnel working with PCBs shall wear lintfree
glovesorfingercots.
Components
a.
b.
Storageboxesandbagsshallbemadeofmaterialswhichdonotdegrade
thesolderabilityofthecomponents.
c.
Storagematerialsshallnotcontainamines,amides,silicones,sulphuror
polysulphides.
d.
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ECSSQST7008C
6March2009
7.6.2
a.
PCBs
PCBsshallbestoredinaccordancewithECSSQST7011,clause7.1.
7.6.3
a.
Soldersnotinaccordancewithclause6.2shallberemovedfromthework
area.
b.
Activatedfluxesshallbestoredinaccordancewithclause6.3.1f.
NOTE
c.
Corrosiveacidfluxesshallbestoredinaccordancewithclause6.3.2c.
NOTE
d.
Example:INH1flux.
Solvents that do not conform to clause 6.4 shall be removed from the
workarea.
NOTE
7.7
Example:ROH1flux.
Example:
Solvents
contaminated
impuritiessuchasinorganicacids.
with
Process
a.
PCBsshallbeCleanedusingsolventconformingtoclause6.4.
b.
PCBsshallbedemoisturizedinaccordancewithclause7.7.2.
c.
PreparedPCBsshallbestoredinaccordancewithclause7.7.3.
7.7.2
a.
Demoisturization methods
Theoventemperatureshallbebetween90Cand120C.
NOTE
b.
Theprocesstimeshallbeaminimumof4hours.
NOTE1 Long baking periods at higher temperatures
can reduce the solderability of PCB
terminations.
NOTE2 A vacuum bake method can be selected for
temperatureslessthan90C.
7.7.3
a.
b.
Dry nitrogen, dry air, vacuum or desiccants may be used to extend the
storageperiod.
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ECSSQST7008C
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8
Mounting of components
8.1
General requirements
8.1.1
Introduction
a.
Componentsshallbemountedparalleltothemountingsurface.
b.
Componentsshallbemountedincontactwiththemountingsurface.
c.
d.
8.1.2
a.
Heavy components
Componentsweighingmorethan5gshallbesupportedbyeitherofthe
followingmethods:
1.
adhesivecompoundsinaccordancewithclause6.10,or
2.
mechanicalmethods.
NOTE
Forexample:Lacing.
b.
The support method shall not impose stresses that result in functional
degradationordamagetothepartorassembly.
c.
Thesupportmethodshallnotimpairstressreliefdesigns.
8.1.3
a.
Metal-case components
mountedoverprintedconductors;
2.
incontactwithanothermetalcasecomponent;
3.
incontactwithaconductivematerial.
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ECSSQST7008C
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b.
c.
Componentidentificationmarksshallnotbeobscuredbytheinsulation.
NOTE
8.1.4
a.
Glass-encased components
Glassencasedpartsshallbeenclosedwithsleevingwhenepoxymaterial
isusedforstaking,conformalcoatingorencapsulating.
NOTE
b.
8.1.5
a.
Forexampletheserialnumbers.
Heatingandshrinkageofsleevingcandamage
glassencasedcomponents.
Stressreliefshallbeincorporatedinto:
1.
solderedleadsandconductors,
2.
interfacialconnections.
NOTE1 Stressreliefprovidesfreedomofmovementfor
componentleadsorconductorsbetweenpoints
ofconstraint.
NOTE2 Stresses can arise between points of constraint
due to mechanical loading or temperature
variations.
b.
Stress relief methods, shown in Figure 82, Figure 85, Figure 810 and
Figure811,shallapply.
c.
TheassemblyofTO39,TO59andCKR06packagesshallbeperformed
inaccordancewithFigure81whenassembledwithoutstressrelief.
d.
Stressreliefdesignsshallnotdamagetheassembly.
NOTE
e.
f.
Solderfilletsshallnotimpairstressreliefbends.
g.
48
ECSSQST7008C
6March2009
NOTE
h.
TO39andTO59packagesmayhaveanunderfillasshowninFigure81.
Figure81:AssemblyofunderfilledTO39andTO59,andadhesivelystakedCKR06
8.1.6
a.
Stressreliefforcomponentswithnonbendableleadsmountedincontact
withthePCBoradhesivelybondedtothePCBshallusewireextensions,
seeFigure83.
49
ECSSQST7008C
6March2009
NOTE
b.
Inordertoachieveacceptablestandoff,ashim
canbeused.
50
ECSSQST7008C
6March2009
SR
SR
C
(a) Clinched lead
C
Pad
SR
C
(c) Offset lap joint
SR
C
Plated-through hole
SR
C
C
SR
C
SR
C
Figure82:Methodsforincorporatingstressreliefwithcomponentshaving
bendableleads
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ECSSQST7008C
6March2009
Figure83:Methodsforattachingwireextensionstononbendableleads
8.1.7
a.
Clause6.8.1shallapplyforreinforcedplatedthroughholes.
8.1.8
a.
Solderterminationsshallnotbecutafterthesolderingoperation.
NOTE
8.1.9
Componentleadsandwiresarecutandshaped
beforesoldering.
a.
Solidhookupwireshallbesupportedatintervalsnotexceeding30mm.
b.
Thesupportshallbeprovidedbystaking.
8.1.10
a.
Location
8.1.11
a.
Coatingsandcementingcompoundsshallnotbridgestressreliefloopsor
bendsatterminationsincomponentleadsorconnectingwires.
b.
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8.2
General
a.
Duringbending,componentleadsshallbesupportedtoavoidaxialstress
anddamagetosealsorinternalbonds.
b.
The inside radius of a bend shall not be less than the lead diameter or
ribbonthickness.
c.
The distances between the bends and the end seals at either end of an
axialcomponentshallbesimilar.
d.
The minimum distance from the bend to the end seal shall be two lead
diametersforroundleadsand0,50mmforribbonleads.
e.
Wherethecomponentleadisweldedtheminimumdistancetothebend
shallbemeasuredfromtheweldinaccordancewithFigure84.
NOTE
f.
Example:Tantalumcapacitors.
Bendingtoolsshallnotimpingeontheweld.
Figure84:Minimumleadbend
8.2.2
a.
Stressreliefshallbeprovidedinthecomponentleadonbothsidesofthe
PCBinaccordancewithFigure85(a).
b.
Whenasolidhookupwireisusedtointerconnectsolderterminationson
opposite sides of a PCB, stress relief shall be provided in the wire
betweenthetwoterminationsinaccordancewithFigure85(b).
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C
SR
C
SR
SR
(a)
(b)
Figure85:Leadswithsolderterminationonbothsides
8.3
b.
Swagetypeterminalsthataremountedinaplatedthroughholeshallbe
secured to the PCB by an elliptical funnel swage in accordance with
Figure86(b).
NOTE
c.
ThePCBshallnotbedamagedbytheswagingprocess.
d.
e.
f.
Afterswaging,theterminalmayhaveamaximumofthreeradialsplitsor
cracks, provided that the splits or cracks do not extend beyond the
swagedareaoftheterminalandareaminimumof90apart.
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Solder
Conductor
Board
Roll swage
(a) Single sided
Slight reflowed
solder fillet
Conductor
Board
Plated-through
hole
Solder
Elliptical swage
(b) Double sided
Figure86:Typesofterminalswaging
8.4
General
a.
Solderterminationsshallbevisibleforinspectionaftersoldering.
b.
ComponentleadsshallbeterminatedtoPCBsbyclinch,studorlapped
terminations.
8.4.2
Clinched leads
a.
Nonbendableleadsshallnotbeclinched,seealsoclause8.1.6.
b.
c.
The clinched lead shall not extend beyond the edge of the conductor
pattern,seeFigure87andFigure88.
d.
Theleadshallnotbeforcedtolieflatatthebendradius,seeFigure87
andFigure88.
NOTE
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e.
Thesolderedlengthshallcomplywithclauses8.4.4and8.4.5.
f.
Roundedterminationareasshallbesuchthat:
1.
theleadextendsthroughandoverlapthesolderpad,
2.
3.
theareaofthesolderpadpermitsasolderfillettobeformed.
Figure87:Clinchedleadterminationsunsupportedholes
Figure88:Clinchedleadterminationsplatedthroughholes
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8.4.3
Stud leads
a.
Forunsupportedholes,thecutstudleadsshallprotrudebeyondthePCB
surfaceby1,5mm0,8mm,seeFigure89(a).
b.
For platedthrough hole less than 2,2 mm in length, the cut stud leads
shall protrude beyond the PCB surface by 1,5 mm 0,8 mm, see Figure
89(b).
c.
Forcomponentswithshortleadsandplatedthroughholes,greaterthan
orequalto2,2mminlength,theprotrusionmaybezero,providedthat
the outline of the lead is visible, there is wetting between the lead and
padaroundtheentirecircumferenceandthereiscompletepenetrationof
soldertothecomponentside,seeFigure89(c).
d
Unsupported
hole
Functional pad,
0,4 mm min.
Plated-through
hole
Solder pad
0,4 mm min.
(1,5 0,8) mm
(a)
(b)
(1,5 0,8) mm
Zero protrusion
Acceptable
Outline of stud visible
Good wetting
Unacceptable
Outline of stud not visible
(c)
Figure89:Studterminations
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8.4.4
a.
Roundleadsshalloverlapthesolderpad:
1.
Minimum overlap: Either 3,5 times the lead diameter or 1,3 mm,
whicheveristhegreater.
2.
Maximumoverlap:5,5timestheleaddiameter.
b.
The distance from the cut end of the lead to the edge of the solder pad
shallbemorethan0,5timestheleaddiameter.
c.
8.4.5
a.
8.5
Ribbonleadsshalloverlapthesolderpad,seeFigure810(b):
1.
2.
Maximumoverlap:5timestheleadwidth.
b.
c.
The distance from the cut end of the lead to the edge of the solder pad
shallbeatleast0,25mm.
d.
Onesideoftheleadmaybeflushwiththeedgeofthesolderpad.
Componentsshallbemountedinaccordancewithclause8.1.
b.
c.
The lead length between the component and the terminals shall be
similar at both ends, except where component package shapes dictate
staggering.
NOTE
d.
Example:Tophatdiodeswithflanges.
StressreliefshallbeprovidedinaccordancewithFigure811.
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3,5d to3,5d
5,5d
to 5,5d
0,5d
min.
0,5d min.
dd
3d min.
1,5d toto3,0d
1,5d
3,0d
(1,3 mm
(1,3
mmmin.)
min.)
3d min.
(a)(a)
Round
lead
Round
lead
3w to
min.)
3w
to 5w
5w(1,3
(1,3mm
mm
min.)
0,25
mmmin.
min.)
0,25 mm
w ++0,4
min.
W
0,4mm
mm
min.
w
w
2,5 mm
3w
2,5 mm
3w min.
min. min.
min.)
(b) Ribbon
(b) Ribbon
lead
lead
Figure810:Methodsofthroughholelappedtermination
CC
2d min.
min.
SR
SR
CC
2d
min.
2d min.
CC
(a) Offset
(a)
Offsetmounting
mounting
SR
SR
d
In-line mounting
(b)(b)In-line
mounting
SR =SR
Stress
reliefrelief
bendbend
= Stress
C =C
Constraint
point
= Constraint
point
Figure811:Methodofstressrelievingpartsattachedtoterminals
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8.6
Connectorsshallbemountedinaccordancewithclause8.1.
b.
PCBconnectorsshallbesuppliedwitheither:
1.
preformedleadssupportingstressreliefbends,or
2.
straight,epoxybondedleads.
c.
Degoldingandpretinningofleads,inaccordancewithclause7.2.3and
clause7.2.6,shallbeperformedbeforemechanicalfixingofconnectorsto
thePCB.
d.
e.
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9
Attachment of conductors to terminals,
solder cups and cables
9.1
General
9.1.1
a.
Aconductorshallbewrappedontoaterminalinthesamesenseasthe
finalcurvatureofthewire.
9.1.2
9.2
Conductors
Terminals
a.
Goldplated terminals and solder cups shall have the gold removed in
the conductor attachment area and be pretinned in accordance with
clause7.2.3.
b.
Terminalsshallbeselectedtofittheconductors.
Wire termination
9.2.1
a.
9.2.2
Uniformlengthspreventstressconcentrationin
anyonewire.
Insulation clearance
a.
Wherecharacteristicimpedanceorcircuitparametersarenotaffected,the
insulationclearancevaluesstatedinclause7.2.1.4shallapply.
b.
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9.2.3
a.
Solidhookupwireshallbesupportedatintervalsnotexceeding30mm.
b.
Supportshallbeprovidedbystakingorconformalcoating.
9.2.4
Stress relief
a.
b.
Wickingshallbecontrolled.
NOTE
9.3
Side route
a.
SiderouteconnectionsshallbemadeasshowninFigure91(a).
b.
Conductorsshallbewrappedaroundthepost(seeFigure91(c)):
1.
aminimumof1/2turn.
2.
amaximumof3/4turn.
c.
Forturretterminals,allconductorsshallbeconfinedtotheguideslots.
d.
Conductorsshallnotprojectbeyondthebaseoftheterminal.
e.
Wiresshallnotbewrappedoverotherwires.
f.
More than one wire may be installed in a single slot of a terminal post
provided that the combined diameters of the wires are less than the
widthoftheslot.
g.
Wiresterminatingatterminalsthatdonothaveamechanicalshoulderor
turretshallnotbeattachedcloserthanoneconductordiametertothetop
oftheterminal.
9.3.2
a.
Bottom route
Theconductorshallentertheterminalfromthebottom,passthroughthe
sideslotatthetop,andbewrappedasforthesideroute,seeFigure91(b).
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Insulation
clearance
Insulation
clearance
Base
(a)
(b)
turn maximum
turn minimum
(c)
Figure91:Sideandbottomrouteconnectionstoturretterminals
9.4
Bifurcated terminals
9.4.1
General
a.
Top,sideorbottomroutes,orcombinationsthereof,shallbeused.
b.
Toprouteandsiderouteshallnotbeusedtogetheronthesameterminal.
9.4.2
Bottom route
a.
BottomrouteconnectionsshallbeasshowninFigure92.
b.
Conductorsmayprojectbeyondthediameterofthebase,seeFigure92
(c),providedthatclearances,environmentalandelectricalcharacteristics
arenotcompromised.
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Post
Bend
Bend
Shoulder
(b)
(a)
Minimum insulation
clearance
Figure92:Bottomrouteconnectionstobifurcatedterminal
9.4.3
Side route
a.
SiderouteconnectionsshallbeasshowninFigure93.
b.
Theconductorshallenterthemountingslotperpendiculartotheposts.
c.
Whenmorethanoneconductorisconnectedtoaterminal,thedirection
of bend of each additional conductor shall alternate, see Figure 93 (b)
and(d).
d.
Siderouteconnectionsshallnotprojectabovethetopoftheterminal.
e.
Conductorsmayprojectbeyondthediameterofthebase,seeFigure93
(c),providedthatclearances,environmentalandelectricalcharacteristics
arenotcompromised.
f.
Conductorsshallbewrappedaminimumofturn(Figure93(a))toa
maximumofturn(Figure93(c))aroundthepost.
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Insulation
clearance
Insulation
clearance
Point of
entry
Point of entry is
same for upper
conductor
(b)
(a)
Insulation
clearance
Solder to post
and shoulder
(c)
(d)
Figure93:Siderouteconnectiontobifurcatedterminal
9.4.4
Top route
a.
Thetoprouteshallnotbeusedwheresideentryispossible.
b.
ToprouteconnectionsshallbeasshowninFigure94.
c.
d.
Conductorswhichdonotfillthegap,seeFigure94,shallbeeither:
e.
1.
2.
bentdouble,providedthatthecombineddiametersfillthegap.
Thetoprouteandsiderouteshallnotbeusedonthesameterminal.
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Insulation
Insulation
clearance
clearance
filler wire
TinnedTinned
filler wire
(stranded
or solid)
(stranded
or solid)
Figure94:Toprouteconnectiontobifurcatedterminal
9.4.5
a.
The bottom route conductor shall be installed before the top route
conductor.
b.
9.4.6
a.
9.5
The bottom route conductor shall be installed before the side route
conductor.
Hook terminals
a.
ConnectionstohookterminalsshallbeasshowninFigure95.
b.
Thebendtoattachconductorstohookterminalsshallbe:
1.
aminimumof1/2turn,
2.
amaximumof3/4turn.
c.
Protrusionofconductorendsshallnotdamageinsulationsleeving.
d.
Wheremorethanoneconductorisattachedtoaterminal,thedirectionof
bendofeachconductorshallalternate(seeFigure95(b)).
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Figure95:Connectionstohookterminals
9.6
Pierced terminals
a.
ConnectionstopiercedterminalsshallbeasshowninFigure96.
b.
Thebendtoattachconductorstopiercedterminalsshallbe:
c.
1.
aminimumof1/4turn,
2.
amaximumof3/4turn.
Protrusionofconductorendsshallnotdamageinsulationsleeving.
Insulation
Insulation
clearance
clearance
D
Insulation
Insulation
clearance
clearance
Insulation
Insulation
clearance
clearance
One conductor
One conduc
dia. max
entry
SideSide
entry
1/4
turn
turn
(a)(a)
1/2
turn
turn
(b)
(b)
(c) (c)
Figure96:Connectionstopiercedterminals
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9.7
ConductorsshallenterthesoldercupasshowninFigure97.
b.
Conductorsshallbebottomedinthecup.
c.
Conductorsshallbeincontactwiththeinnerwallofthecup.
d.
e.
Fluxshallnotbetrappedwithinthesoldercup.
f.
Conductorsshallnotmisalignfloatingcontacts.
NOTE
Insulation
Insulation
clearance
clearance
Insulation
Insulation
clearance
clearance
Point
of entry
Point
of entry
Conductors
Conductors
shall bottomin
bottomed
cup
in cup
shall
WireWire
bottomed
bottom in cup
in cup
(b)
(b)
(a)
(a)
Figure97:Connectionstosoldercups(connectortype)
9.8
Insulation sleeving
a.
b.
Insulationsleevingshallbetransparentandheatshrinkable.
c.
A component shall not move within the sleeving when the sleeving is
mechanicallysupported.
d.
Heatshrinkingofthesleeveshallnotdamagetheassembly.
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9.9
General
a.
b.
c.
d.
e.
Fluorocarbonsleevesshallnotbeused.
NOTE
9.9.2
Preparation of wires
a.
Wireinsulationshallberemovedusinginsulationstrippersinaccordance
withclause5.6.6.
b.
Wireinsulationclearancesshallbeinaccordancewithclause7.2.1.4.
c.
Pretinningshallbeinaccordancewithclauses7.2.5and7.2.6.
9.9.3
a.
b.
c.
Theareaofexposedshieldshallbeeither:
1.
attheendofthewireorcable(endtermination),or
2.
atanypositionalongthelengthofawireorcable(centresplice).
Theinsulationjacketshallberemovedfor:
1.
aminimumlengthof5mm,
2.
amaximumlengthof12mm.
Theinsulationjacketshallbescoredandremovedusingasharpcutting
tool.
NOTE
Example:Ascalpel.
d.
Thepreparationprocessshallnotdamagetheexposedshieldmaterialin
accordancewithclauses7.2.1.2and7.2.1.3.
e.
Theshieldmaterialshallbeofgoodsolderability.
f.
Theshieldmaterialshallnotbepretinned.
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g.
9.9.4
Pre-assembly
9.9.4.1
Heat-shrinkable sleeving
a.
b.
The sleeving shall be cut to a length that covers the finished soldered
joint and extends over the remaining insulation of each conductor for a
distanceof5mm2mm.
c.
Thecutsleevingshallbethreadedoveroneofthewirestobejoined.
9.9.4.2
a.
Conductors
Conductorsshallbesecuredtopreventdisturbanceduringsolderingand
solidificationusingone,oracombinationof,thefollowingmethods:
1.
2.
Example:Bare,tinnedcopperwire.
3.
4.
Atwistsplicearoundthebraid,seeFigure98(c).
b.
Theconductorstobejoinedshalllieparallelandincontact.
c.
d.
e.
Wiresshallbesplicedusinglapjoints.
f.
g.
Insulation overlap shall not be greater than the diameter of the largest
conductoroftheinterconnection.
9.9.5
Soldering procedures
a.
Thesolderingironshallbeselectedinaccordancewithclause5.6.7.
b.
Thesolderalloyshallbeinaccordancewithclause6.2.
c.
Thefluxshallbeinaccordancewithclause6.3.
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d.
Solderingaidsshallbeusedtorestrictwickingoffluxorsolderunderthe
insulationinaccordancewithclause5.6.8.
e.
f.
5 mm - 12 mm
5 mm - 12 mm
Figure98:Methodsforsecuringwires
9.9.6
a.
Theremovaloffluxandresiduesshallbeinaccordancewithclause11.
9.9.7
a.
Cleaning
Inspection
Interconnectionsshallbeinspectedinaccordancewithclause12.
9.9.8
Workmanship
a.
Jointsshallhaveasmooth,brightappearance.
b.
Theworkmanshipofsolderjointsshallbeinaccordancewithclause15.
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NOTE
9.9.9
Sleeving of interconnections
a.
b.
Thesleevingshallbeshrunkusingheatedgasorradiantenergy.
c.
Heatshallnotbeappliedformorethan8seconds.
d.
Theheatshrinkingtemperatureshallnotbeexceed140C.
StrandedwiresshallbesolderedtoPCBterminationsusinglapjointsor
platedthroughholesinaccordancewithFigure99(a),(b)and(c).
b.
c.
Stressreliefshallbeprovided.
d.
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Figure99:ConnectionofstrandedwirestoPCBs
Table91:DimensionsforFigure99
r2d
=conductordiameter
r12D
=outerwirediameter
1mmH2mm
=insulationclearance
1,5mm0,8mm
LP
=leadprotrusionthroughboard
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10
Soldering to terminals and PCBs
10.1 General
10.1.1
Securing conductors
a.
b.
10.1.2
a.
Thermal shunts
Thermalshuntsshallbeusedtoprotectthermallysensitivecomponents.
NOTE
10.1.3
a.
High-voltage connections
Solderedjointsforcoronasuppressionshallbeperformedintwostages
withanintermediateinspection:
1.
Thefirstsolderingstageproducesastandardsolderedconnection
inaccordancewithclause12;
2.
3.
Thejointthenhasadditionalsolderalloyadded;
4.
Thesecondsolderingstageproducesafinaljoint,seeFigure101,
having:
(a)
smoothconvexfillets,
(b)
nodiscontinuities,
(c)
noseverechangesincontour,
(d)
nosharpedgesorpoints.
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Figure101:Highvoltageconnection
10.2.2
a.
b.
Thecontouroftheconductorshallbevisibleaftersoldering.
c.
Terminalswithmorethanonewireshallhaveeachwireincontactwith,
andsolderedto,theterminal.
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6March2009
10.2.3
a.
Theworkmanshipshallbeinaccordancewithclause15.7.
b.
The solder shall form a fillet between the conductor and the cup entry
slot.
c.
Thefilletshallfollowthecontourofthecupopening.
d.
Solder spillage may be present on the outside surface of the solder cup
provided that it does not interfere with the function or the assembly of
theconnector.
Solder coverage
a.
The molten solder shall flow around the conductor and over the
terminationarea.
b.
c.
d.
Solder shall not obscure the contour of the conductor at the end of the
insulation.
10.3.2
Solder fillets
a.
Solderfilletsshallbeinaccordancewithclause15.1and15.2.
b.
Aconductormountedasalapterminationshallhaveaheelfilletwhereit
bendsawayfromthepad.
c.
Onlapterminationswhereonesideofaconductorisflushwiththeedge
of the termination pad, a fillet of solder shall be present along at least
threeofthefoursidesofthelead.
d.
Thefilletofsolderalongtheleadshallextendupthesideoftheleadtoa
minimumdistanceofhalftheleadthicknessordiameter.
10.3.3
10.3.3.1
a.
Thesolderfilletsshallbeinaccordancewithclause15.1and15.2.
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10.3.3.2
Component side
a.
Onthecomponentside,theterminalpadshallshowsolderflowthrough
andasolderfilletbetweentheleadandthepadforaminimumof25%of
thecircumference,seeFigure102(a).
b.
Absenceofcomponentsidepadwettingmaybeacceptablewhensolder
wettingisvisibleintheplatedthroughhole,seeFigure102(b).
(b)
(a)
Figure102:Minimumacceptablewettingoncomponentside
10.3.4
Solder application
a.
Soldershallbeappliedonlytothesoldersideofaplatedthroughhole.
b.
Thesolderingironbitshallbepretinned.
c.
Theheatedsolderingironbitshallbeappliedtothejoint.
d.
Soldershallbeintroduced:
1.
initiallyatthejunctionofthesolderingironbitandthejoint.
NOTE
2.
e.
onceheattransferhasbeenachieved,onlytothejoint.
Where the rate of heat loss from the joint is too high to allow an
acceptablesolderjointonthecomponentside,additionalheatingshallbe
used.
NOTE1 Example:Highthermalmassesoradjacentheat
sinks.
NOTE2 Heatcanbeappliedtobothsidesoftheplated
throughholesimultaneously.
f.
Additionalheatingshallnotdamagecomponentsormaterials.
g.
Theprocessofadditionalheatingshallbedocumented.
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10.4 Wicking
a.
Solderingaidsshallbeusedtorestrictthewickingoffluxorsolderunder
insulationinaccordancewithclause5.6.8.4.
ReworkofsolderedPCBassembliesshallbedonewhenthesolderjoint
doesnotmeettheacceptancecriteriaofclause12.
b.
Ajointshallnotbereworkedmorethanthreetimes.
NOTE
c.
ToolsandaidsshallbeinaccordancewithECSSQST7028.
AnyrepairsormodificationsshallbeinaccordancewithECSSQST7028.
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11
Cleaning of PCB assemblies
11.1 General
a.
When the solder has solidified and cooled, flux and residue shall be
removed from soldered connections using a solvent in accordance with
clause6.4.
b.
c.
Fluxandresidueshallberemovedwithinamaximumperiodof8hours
aftersolderingoperations.
NOTE
d.
PCBassembliesshallnotbeimmersedincleaningsolventsformorethan
30minutesforeachcleaningoperation.
NOTE
Cleanliness testing
a.
b.
Cleanlinesstestingmaybeomittedforsolderassembliesusingonlypure
rosin(ROL0)fluxes,seeclause6.3.1.
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11.3.2
a.
Testing frequency
Forfluxes,otherthanpurerosin,cleanlinesstestingshallbedone:
1.
atmaximumintervalsofsixmonths;
2.
followingachangeinfluxmaterials;
3.
followingachangeinprocessparameters;
4.
followingactionsaffectingcleanability.
NOTE
b.
Thesuppliershallimplementandmaintainrecordsoftestresults.
NOTE
c.
Test limits
Thesodiumchloride(NaCl)ioniccontaminationequivalencevalueshall
belessthan1,56g/cm2ofPCBsurfacearea.
11.3.4
a.
Whenatestresultisunacceptable,allPCBassembliescleanedsincethe
lastsuccessfultestshallbesubjecttoreviewbytheApprovalauthorityin
accordancewithECSSQST20.
11.3.3
a.
Test method
Useasolutionof75%isopropylalcoholand25%deionizedwater
forthesodiumchloride(NaCl)equivalentioniccontaminationtest.
2.
b.
c.
Thecleanlinesstestvaluesshallbeasfollows:
1.
Startingresistivity:greaterthan20106cm.
2.
Endingvalue:lessthan1,56g/cm2.
NOTE
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12
Final inspection
12.1 General
a.
b.
Inspectionshallbeaidedbymagnificationappropriatetothesizeofthe
connectionsbetween4timesand10times.
c.
Additionalmagnificationshallbeusedtoresolvesuspectedanomaliesor
defects.
d.
Partsandconductorsshallnotbephysicallymovedtoaidinspection.
e.
Acceptablesolderconnectionsshallbecharacterisedby:
1.
aclean,smoothsatintobrightundisturbedsurface,
2.
3.
forsolderfilletsofplatedthroughholeconnections,thecriteriain
clause10.3.3apply,
4.
5.
completewettingasevidencedbyalowcontactanglebetweenthe
solderandthejoinedsurfaces,
6.
7.
absenceofanyofthedefectsmentionedinclauses12.3,
8.
highvoltageconnectionsinaccordancewithclause10.1.3,
9.
stressrelief.
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charred,burnedormeltedinsulationofparts,
2.
conductorpatternseparationfromcircuitboard,
3.
burnsonbasematerials,
4.
continuousdiscolourationbetweentwoconductorpatterns.
NOTE
5.
excessivesolder(includingpeaks,iciclesandbridging),seeclause
15,
6.
7.
fluxresidue,soldersplatter,solderballs,orotherforeignmatteron
circuitry,beneathcomponentsoronadjacentareas,
8.
dewetting,
9.
insufficientsolder,seeclause15,
10.
pits,holesorvoids,orexposedbasemetal(excludingtheendsof
cutleads)inthesolderedconnection,
11.
granularordisturbedsolderjoints,
12.
fracturedorcrackedsolderconnection,
13.
cut,nicked,gougedorscrapedconductorsorconductorpattern,
14.
incorrectconductorlength,
15.
incorrectdirectionofclinchorlapterminationonaPCB,
16.
damagedconductorpattern,
17.
barecopperorbasemetal,excludingtheendsofcutwireorleads
orsidesoftracksandsolderingpadsonsubstrate,
18.
19.
coldsolderjoints,
20.
componentbodyembeddedwithinsolderfillet,
21.
opensolderjoints,
NOTE
Forexampletombstoning.
22.
probemarkspresentonthemetallizationofchipdevicescausedby
electricaltestingafterassembly,
23.
glasssealdoesnotconformtoMILSTD883Method2009.8,
24.
impairedstressrelief.
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13
Verification procedure
13.1 General
a.
b.
Thesuppliershallestablishaverificationprogrammetobeapprovedby
theApprovalauthority.
c.
d.
packagedesignation,
2.
e.
The verification test board shall support at least three devices for each
assemblyconfiguration.
f.
g.
Verificationtestingshallcomprisethefollowing:
1.
Vibrationtestinginaccordancewithclause13.2.
NOTE
2.
200thermalcyclesinaccordancewithclause13.3.
3.
Visualinspectioninaccordancewithclause12.
4.
Microsectioninginaccordancewithclause13.4.
5.
Nocrackedsolderjointsordamagedparts.
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13.2 Vibration
a.
Thetestspecimenshallbevibrationtested.
b.
c.
The test levels and durations shall be derived from the system
requirements.
NOTE1 Thevibrationtestlevelsforlauncherhardwareare
moreseverethanthoseforotherflighthardware.
NOTE2 Vibration testing methodology From the input
levels required by the projects in progress, the
maximumdeformationoftheprintedcircuitboard
at the part level is established for each
configuration (part type, location on the printed
circuit board). The test specimen is representative
of these configurations and covers at least the
maximum deformations previously established,
with a margin either minimum for a specific
project or higher for generic applications.
Nevertheless, in order to take into account test
specimen imperfections, notching can be used to
reduce
nonrepresentative
mechanical
overstresses. The part assembly (mounting
condition) is defined in order to withstand the
vibration levels estimated at the part level. The
successofverificationofthetestspecimenandthe
successfulcompletionofQMqualificationvalidate
the assembly configuration and the implemented
methodology.
d.
e.
The severity of the vibration test shall not be less than that shown in
Table132,Table133,andTable134.
f.
g.
TheresponseaccelerationoftheassembledPCBshallbemonitoredand
recordedduringtesting.
h.
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Table131:Sinesurvey
Levelandfrequency
Amplitude
0,5g0topeak
Frequencyrange
10Hzto2000Hz
Sweeprate
2octaves/minute
Direction
X,Y&Zaxes
Table132:Minimumseverityforsinevibrationtesting
Range(Hz)
PSDLevel
Sweeprate
(0topeak)
(Oct/min)
Spacecraft
25to100
20g
100to200
15g
Duration:1cycleupfrom25Hzto200Hz
Launchers
10to16
10mm
1/3
16to60
10g
1/3
60to70
22,5g
1/3
70to200
22,5g
200to2000
10g
Duration:1cycleupfrom10Hzto2000Hz
Table133:Minimumseverityforrandomvibrationtestingforall
applicationsexceptlaunchers
PerpendiculartoPCB
ParalleltoPCB
Range(Hz)
PSDLevel
Range(Hz)
PSDLevel
20to100
+6dB/oct.
20to100
+6dB/oct.
100to500
1,0g/Hz
100to800
0,5g/Hz
500to2000
6dB/oct.
800to2000
3dB/oct.
Global:28,5gr.m.s.
Global:27,1gr.m.s.
Duration:5minutesperaxis
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Table134:Minimumseverityforrandomvibrationtestingforlauncher
Frequency
PSD
20to60
+3dB/oct.
60to1000
0,27g/Hz
1000to2000
6dB/oct.
Global:20gR.M.S.
Duration:5minutesperaxis
b.
Before the start of the temperature cycling, the test specimen shall be
bakedouttoremovetheinternalhumidity.
c.
Thebakeouttemperatureshallbebetween60Cand80C
d.
Thetemperaturecycleshallbebetween55Cand+100C
e.
The rate of temperature change during the temperature cycle shall not
exceed10Cperminute.
f.
g.
13.4 Microsection
a.
b.
The microsection shall be done on the device having the worst solder
jointappearanceidentifiedduringthevisualinspection.
c.
TheApprovalauthorityshallhaveaccesstothemicrosection.
d.
Themicrosectionshallbestoredforaperiodofatleasttenyears.
NOTE
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14
Quality assurance
14.1 General
a.
QualityassuranceshallbeinaccordancewithECSSQST20.
b.
a.
14.2 Data
NOTE
b.
14.3 Nonconformance
a.
14.4 Calibration
a.
Insulationstrippers,solderingirons,measuringequipmentandreference
standardsshallbecalibrated.
b.
Asuspectedorconfirmedtoolorequipmentfailureshallberecordedasa
projectnonconformance.
NOTE
c.
d.
TheApprovalauthorityshallbenotifiedofthenonconformance.
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14.5 Traceability
a.
ECSSQST20,clause5.4shallapply.
Visualstandardsshallbeprepared.
b.
Thevisualstandardsshallbeavailabletoeachoperatorandinspector.
NOTE
c.
Theworkmanshipstandardsinclause15shallbeincluded.
14.7 Inspection
a.
b.
Inspectionshallbeinaccordancewithclause12.
b.
Atrainingprogrammeshallbedeveloped,maintainedandimplemented
bythesuppliertoprovideexcellenceofworkmanshipandpersonnelskill
inmanualsoldering.
c.
d.
Trainedpersonnelperformingsolderingoperationsandinspectionsshall
becertified.
NOTE
e.
Repeatedqualitynonconformance.
2.
Changeinsolderingtechniques.
3.
Changeinsolderingparameters.
4.
Additionalprocessskills
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f.
g.
Therecordsaregenerallykeptforaperiodofat
leasttenyears.
Operatorsperforminghandsolderingandinspectorsshallbetrainedand
certifiedataschoolauthorizedbytheApprovalauthority.
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15
Workmanship standards
15.1 Soldered clinched terminals
Preferred solder
Unacceptable
Insufficient solder
Acceptable
Minimum solder
Acceptable
Maximum solder
Preferred solder
Unacceptable
Excessive solder
Figure151:Solderedclinchedterminals
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Preferred solder
SeeFigure89andFigure102forotheracceptableconditions.
Figure152:Solderedstudterminals
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Preferred solder
Unacceptable
Insufficient solder
Acceptable
Minimum solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Figure153:Solderedturretterminalswithtwinconductors
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Preferred solder
Unacceptable
Insufficient solder
Acceptable
Minimum solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Figure154:Solderedturretterminalswithsingleconductors
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Unacceptable
Insufficient solder
Acceptable
Minimum solder
Preferred solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Unacceptable
Insufficient solder
Acceptable
Minimum solder
Preferred solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Figure155:Solderedbifurcatedterminals
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Unacceptable
Excessive
solder
Acceptable
Maximum
solder
Preferred
solder
Acceptable
Minimum
solder
Unacceptable
Insufficient
solder
Figure156Solderedhookterminals
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Preferred solder
Unacceptable
Insufficient solder
Acceptable
Minimum solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Figure157:Solderedcupterminals
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Unacceptable
Insufficient solder
Acceptable
Minimum solder
Preferred solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Figure158:Handsolderedwiretoshieldedcableinterconnections
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Unacceptable
Insufficient solder
Insulation overlap too great
Acceptable
Minimum solder
Maximum overlap
Preferred solder
Preferred solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Figure159:Handsolderedwiretoshieldedwireinterconnections
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c)
b
)
a
)
a)Acceptablemaximuminsulationoverlap
b)Acceptablepitinsolderfilletcausedbyweaveofshieldmaterial
c)Unacceptablelackofsolderbetweenconductors
Unacceptable
Unacceptablemoltendielectricinsulation
Uncleanconnection(flux)
Figure1510:Handsolderedwireinterconnectionsdetailsofdefects
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Annex A (normative)
Report on manual soldering of highreliability electrical connections - DRD
A.1
DRD identification
A.1.1
ThisDRDiscalledfromECSSQST7008,requirement14.2b.
A.1.2
A.2
Expected response
A.2.1
<1>
a.
<2>
a.
<3>
b.
The report shall contain the name, organization and address of the
originator.
System/Subsystem
The report shall identify the system/subsystem in which the assembly
under inspection for compliance to manual soldering of highreliability
electricalconnectionsisembedded.
Manufacturer
The report shall identify the manufacturer of the assembly in which
manual soldering techniques for highreliability electrical connections
wereused.
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<4>
a.
Assemblyconfigurationitemlist
The report shall identify or refer to the assembly list detailing all the
elementsconstitutingthisassembly.
NOTE
Elementscanbematerials,processesandparts.
b.
ThereportshallidentifyorrefertotheDMPLoftheassemblyinwhich
manual soldering techniques for highreliability electrical connections
wereused.
c.
The report shall identify or refer to the DML of the assembly in which
manual soldering techniques for highreliability electrical connections
wereused.
d.
The report shall identify or refer to the DPL of the assembly in which
manual soldering techniques for highreliability electrical connections
wereused.
<5>
a.
Engineeringdrawings
The report shall contain or refer to the engineering drawings of the
assembly on which manual soldering of highreliability electrical
connectionshasbeenperformed
<6>
a.
Applicabledocuments
The report shall contain the applicable document list and the reference
documentlistincluding:
1.
Theproblemreportandhandlingofnonconformanceprocedures
tobeapplied.
2.
Thelistofprocedurestobeapplied.
NOTE
3.
Thelistofstandardtocomplywith.
NOTE
<7>
a.
Evidencesofcompliancetomanualsolderingprocesses
The report shall demonstrate evidences that the operations and
associated controls, when performing manual soldering of high
reliabilityelectricalconnectionsaredoneincompliancewithECSSQST
7008 or other customer approved internal standards and procedures,
includingasaminimum:
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1.
2.
3.
4.
<8>
a.
Recordsofcalibrationforalltools,equipmentandfacilities:
Solderingirons,
Ifsolderbittemperaturecontrolled,solderbitiscalibratedat
incominginspection,
Temperaturesofdegoldingandpretinningbaths.
Statementofcompliancefor
Theinternalassemblyprocedures,
Thedesignrulesappliedforthecorrectnessofthesoldering,
Operatorsandinspectorstrainingandcertifications,
CleanlinessofPCBassemblies,
Useofapprovedmethodsfor:
o
Thepreparationofsoldering,
Themountingofcomponents,
Theattachmentsofconductorstoterminals,solder
cupsandcables,
SolderingtoterminalsandPCBs.
ProtectionsagainstESDfor:
storage,assemblyline,inspectionlineandtestingareas,
Gloves,solderingaidsandotherusedtools.
Materialsselection:
Formandcompositionofthesolder,
Characterizationoffluxes,
Solvents,
Flexibleinsulationmaterials,
Chemicalscompositionofterminalsandshapes,
Wires,
PCBs,
Componentsleadfinishes,
Adhesives.
Verificationandtesting
Thereportshallcontainalltheinformationrelatedtotheoperationsand
associated controls performed when verifying or testing manual
soldering of highreliability electrical connections, including as a
minimumthefollowing:
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1.
Photographicevidencesofthemanualsolderingtobeinspected
2.
Visualinspectionfindings
3.
Listoftheacceptancecriterianotmet,
Listofrejectioncriteriasupportingthevisualinspection
findings.
CleanlinessofPCBassemblies(testreport),
thermalcycling(testreport),
mechanicaltesting(vibrationstestreport),
electricaltestingreport.
4.
Listofnonconformancereports.
5.
Preventivesandcorrectivesactionstobemanaged.
A.2.2
Special remarks
None.
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Annex B (informative)
Solder melting temperatures and choice
TableB1:Guidetochoiceofsoldertypes
Soldertype
Meltingrange(C)
Solidus
63tinsolder
(eutectic)
183
Liquidus
Uses
183
Solderingprintedcircuitboardswhere
temperaturelimitationsarecriticalandin
applicationswithanextremelyshortmelting
range.Preferredsolderforsurfacemountdevices.
62tinsilver
loaded
179
190
Solderingofterminationshavingsilverandor
silverpalladiummetallization.Thissolder
compositiondecreasesthescavengingofsilver
surfaces.
60tinsolder
183
188
Solderingelectricalwire/cableharnessesor
terminalconnectionsandforcoatingor
pretinningmetals.
96tinsilver
(eutectic)
221
221
Canbeusedforspecialapplications,suchas
solderingterminalposts.
75indiumlead
145
162
Specialsolderusedforlowtemperaturesoldering
processwhensolderinggoldandgoldplated
finishes.Canbeusedforcryogenicapplications.
70indiumlead
165
175
Forusewhensolderinggoldandgoldplated
finisheswhenimpracticaltodegold.
10tinlead
268
290
Foruseinstepsolderingoperations,toavoid
reflowofinitialsolderonmakingthesecondjoint
(limitedtoconnectionsinternaltodevices).
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Bibliography
ECSSSST00
ECSSsystemDescription,implementationandgeneral
requirements
ECSSEST1003
SpaceengineeringTesting
ESASP1173
Evaluationofconformalcoatingforfuturespacecraft
applications
ESASTM265
Evaluationofthermallyconductiveadhesivesasstaking
compoundsduringtheassemblyofspacecraftelectronics
ESASTM275
EvaluationofcleanlinesstestmethodsforspacecraftPCB
assemblies
ISO9453
SoftsolderalloysChemicalcompositionsandforms
ISO146441
Cleanroomsandcontrolledenvironments
ISO29454
Softsolderingfluxes;classificationandrequirements
IEC6119013(2002)
AttachmentmaterialsforelectronicassemblyPart13:
Requirementsforelectronicgradesolderalloysandfluxedand
nonfluxedsolidsoldersforelectronicsolderingapplications
106