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Internal Use Only

Service Manual

LG-P970

Date: April, 2011 / Issue 1.0

Table Of Contents
1. INTRODUCTION 3
1.1 Purpose3
1.2 Regulatory Information3
1.3 Abbreviations5
2. PERFORMANCE 7
2.1 Product Name7
2.2 Supporting Standard7
2.3 Main Parts : GSM Solution7
2.4 HW Features8
2.5 SW Features 10
2.6 HW SPEC.  14
3. TECHNICAL BRIEF 25
3.1 GENERAL DESCRIPTION 25
3.2 GSM MODE 28
3.3 UMTS MODE 31
3.4 GPS RECEIVER 33
3.5 LO GENERATION and DISTRIBUTION CIRCUIT 37
3.6 OFF-CHIP RF COMPONENTS 39
3.7 Digital Baseband(DBB/MSM7227) 44
3.8 Hardware Architecture 46
3.9 Subsystem (MSM7227) 48
3.10 Power Block 59
3.11 External memory interface 65
3.12 H/W Sub System 66
3.13 Audio and sound 82
3.14 Display 89
3.14 Main (5M pixels) & Sub (2M pixels) Camera 93
3.16 Vibrator 96
3.17 Compass Sensor 97
3.18 Motion Sensor 98
3.19 Gyro Sensor 99
3.20 Proximity Sensor100
3.21 Illumination Sensor101
3.22 Touch Module102
3.23 Main Features103
4. TROUBLE SHOOTING 106
4.1 RF Component106
4.2 SIGNAL PATH107
4.3 Checking TCXO Block109
4.4 Checking GSM TX Module(GSM PAM + FEM) Block111
LGE Internal Use Only

4.5 Checking WCDMA Block114


4.6 Checking GSM Block125
4.7 GPS/WIFI/BT RF components133
4.8 GPS/WIFI/BT SIGNAL PATH135
4.9 Power ON troubleshooting137
4.10 Charger Troubleshooting140
4.11 USB Trouble shooting143
4.12 Audio trouble147
4.13 Camera troubleshooting158
4.14 Main LCD trouble161
4.15 SIM detect Trouble shooting164
4.16 Side Key Trouble shooting168
4.17 Vibrator Troubleshooting170
4.18 Motion sensor troubleshooting173
4.19 Gyro/Compass sensor troubleshooting175
4.20 Proximity Sensor on/off trouble178
4.21 Illumination Sensor on/off trouble180
4.22 Touch trouble182
5. DOWNLOAD 184
6. BLOCK DIAGRAM 203
7. CIRCUIT DIAGRAM 206
8. BGA Pin Map 219
9. PCB LAYOUT 224
10. CALIBRATION 234
10.1 General Description234
10.2 Requirement234
10.3 Setup for RF calibration235
10.4 Tachyon Software Installation235
10.5 Tachyon Start236
10.6 Overview of RF Calibration240
11. HIDDEN MENU 245
12. EXPLODED VIEW & REPLACEMENT PART LIST  253
12.1 EXPLODED VIEW253
12.2 Replacement Parts254
12.3 Accessory295

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Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

1. INTRODUCTION

1.
INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of
this model.

1.2 Regulatory Information


A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons
other than your companys employees, agents, subcontractors, or person working on your companys behalf)
can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated with
your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from
the above case but will prevent unauthorized use of common carrier telecommunication service of facilities
accessed through or connected to it. The manufacturer will not be responsible for any charges that result from
such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair can
be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes
could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone
company is required to give advanced written notice to the user, allowing the user to take appropriate steps to
maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note
that unauthorized alternations or repair may affect the regulatory status of the system and may void any
remaining warranty.

LGE Internal Use Only

--

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

1. INTRODUCTION

E. Notice of Radiated Emissions


This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory
agencies. In accordance with these agencies, you may be required to provide information such as the following
to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices

ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the

sign.

Following information is ESD handling:


Service personnel should ground themselves by using a wrist strap when exchange system boards. When
repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective package as described.

LGE Internal Use Only

--

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

1. INTRODUCTION
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC

Automatic Power Control

BB

Baseband

BER

Bit Error Ratio

CC-CV

Constant Current Constant Voltage

DAC

Digital to Analog Converter

DCS

Digital Communication System

dBm

dB relative to 1 milli watt

DSP

Digital Signal Processing

EEPROM

Electrical Erasable Programmable Read-Only Memory

ESD

Electrostatic Discharge

FPCB

Flexible Printed Circuit Board

GMSK

Gaussian Minimum Shift Keying

GPIB

General Purpose Interface Bus

GSM

Global System for Mobile Communications

IPUI

International Portable User Identity

IF

Intermediate Frequency

LCD

Liquid Crystal Display

LDO

Low Drop Output

LED

Light Emitting Diode

OPLL

Offset Phase Locked Loop

LGE Internal Use Only

6/140

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Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

1. INTRODUCTION

1. INTRODUCTION
PAM

Power Amplifier Module

PCB

Printed Circuit Board

PGA

Programmable Gain Amplifier

PLL

Phase Locked Loop

PSTN

Public Switched Telephone Network

RF

Radio Frequency

RLR

Receiving Loudness Rating

RMS

Root Mean Square

RTC

Real Time Clock

SAW

Surface Acoustic Wave

SIM

Subscriber Identity Module

SLR

Sending Loudness Rating

SRAM

Static Random Access Memory

PSRAM

Pseudo SRAM

STMR

Side Tone Masking Rating

TA

Travel Adapter

TDD

Time Division Duplex

TDMA

Time Division Multiple Access

UART

Universal Asynchronous Receiver/Transmitter

VCO

Voltage Controlled Oscillator

VCTCXO

Voltage Control Temperature Compensated Crystal Oscillator

WAP

Wireless Application Protocol

LGE Internal Use Only

7/140
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Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

2. PERFORMANCE
2. PERFORMANCE

2.1 Product Name


P970 : WCDMA900/1900/2100+EGSM/GSM850/DCS/PCS
(HSUPA 5.7Mbps/HSDPA 7.2Mbps / GPRS Class 12 / EDGE Class 12)

2.2 Supporting Standard


Item
Supporting Standard

Feature

Comment

WCDMA(FDD1,2,8)/EGSM/GSM850/DCS1800/PCS1900
with seamless handover
Phase 2+(include AMR)
SIM Toolkit

Frequency Range

: Class 1, 2, 3, C-E

WCDMA(FDD1) TX : 1920 1980 MHz


WCDMA(FDD1) RX : 2110 2170 MHz
WCDMA(FDD2) TX : 1850 1910 MHz
WCDMA(FDD2) RX : 1930 1990 MHz
WCDMA(FDD8) TX : 880 915 MHz
WCDMA(FDD8) RX : 925 960 MHz
EGSM TX : 880 915 MHz
EGSM RX : 925 960 MHz
GSM850 TX

: 824 849 MHz

GSM850 RX

: 869 894 MHz

DCS1800 TX

: 1710 1785 MHz

DCS1800 RX

: 1805 1880 MHz

PCS1900 TX

: 1850 1910 MHz

PCS1900 RX

: 1930 1990 MHz

Application Standard

2.3 Main Parts : GSM Solution


Item

Part Name

Digital Baseband

PMB9801 : Infineon

Analog Baseband

PMB9801 : Infineon

RF Chip

PMB5703: Infineon

LGE Internal Use Only

Comment

One chip

--

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

2.4 HW Features
Item

Feature

Form Factor

DOP type

Battery

1) Capacity

Comment

Standard : Li-Ion Polymer, 1500mAh


2) Packing Type : Soft Pack
Size

Standard :122 x 64 x 9.2mm

Weight

109g

Volume

TBD

PCB

Any-layer type, 10 Layers , 0.65t

Stand by time

2G Up to 375 hrs

@ Paging Period 9 (2G)

3G Up to 375 hrs

@ DRX 7 (3G)

Charging time

3 hrs

@ Power Off / 1500mAh

Talk time

2G Up to 360 mins

@ Tx=Max(2G)

3G Up to 360 mins

@ Tx = 12dBm (3G)

RX sensitivity

With Battery

WCDMA(FDD1) : -106.7 dBm


WCDMA(FDD2) : -106.7 dBm
WCDMA(FDD8) : -106.7 dBm

TX

EGSM

: -105 dBm

GSM850

: -105 dBm

DCS 1800

: -105 dBm

PCS 1900

: -105 dBm

WCDMA/

WCDMA : 24dBm/3.84MHz,+1/-3dBm

Class3(WCDMA)

output

GSM/

EGSM

: 33dBm

Class4 (EGSM)

power

GPRS

GSM850

: 33 dBm

Class4 (GSM850)

DCS 1800

: 30 dBm

Class1 (PCS)

PCS 1900

: 30 dBm

Class1 (DCS)

EDGE

GSM 900

: 27 dBm

E2 (GSM900)

DCS 1800

: 26 dBm

E2 (PCS)

PCS 1900

: 26 dBm

E2 (DCS)

GPRS compatibility

GPRS Class 12

EDGE compatibility

EDGE Class 12

SIM card type

Plug-In SIM
2.85V /1.8V

LGE Internal Use Only

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Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

Display

Main LCD(WVGA)
TFT Main LCD(4.0 480 x 800)

Built-in Camera

5M Primary CMOS Camera,


2M secondary camera

Status Indicator

No

Keypad

Function Key : 4

Function Key: Home,Back,

Side Key

menu,serach

:4

Side Key : Volume up,down,


power key, Gesture
ANT

Main : LDS(Laser Direct Structure) type


Sub : DPA type(Directed Print Antenna)

System connector

5 Pin Micro USB

Ear Phone Jack

3.5Phi, 4 Pole, Stereo

PC synchronization

Yes

Memory(AP)

eMMC : 2GB
SDRAM : 4Gbit(POP)

Speech coding

FR, EFR, HR, AMR

Data & Fax

Built in Data & Fax support

Vibrator

Built in Vibrator

BlueTooth

V3.0

MIDI(for Buzzer Function)

SW Decoded 72Poly

Music Player

MP3/ WMA/AAC/HE-AAC/eAAC+

Video Player

MPEG4, H.263, H.264, WMV9/VC-1, DiVX

Camcorder

MPEG4, H.264, H.263

Voice Recording

Yes

Speaker Phone mode

Yes

Support
Travel Adapter

Yes

CDROM

No

Stereo Headset

Yes

Data Cable

Yes

T-Flash

Yes

Up to 32GB

(External Memory)
LGE Internal Use Only

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Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

2.5 SW Features
Item

Feature

Comment

RSSI

0 ~ 4 Levels

Battery Charging

0 ~ 6 Levels

Key Volume

0 ~ 7 Level

Audio Volume

1 ~ 15 Level

Time / Date Display

Yes

Multi-Language

Yes

Quick Access Mode

Phone / Contacts / Messaging / Menu

PC Sync

Yes

Speed Dial

Yes

Voice mail center -> 1 key

Profile

Yes

not same with feature phone setting

CLIP / CLIR

Yes

Phone Book

Name / Number / Email / Chat Id /

There is no limitation on the number

Website / Postal addresses /

of items.

Organizations / Groups / BirthdayNotes /

It depends on available memory

Ringtone

amount.

Yes

There is no limitation on the number

Last Dial Number

CZECH , DUTCH , FRENCH , GERMAN ,


GREEK , ITALIAN , PORTUGUESE ,
SPANISH , ARABIC , HEBREW , T
CHINESE TW , S CHINESE ,
ROMANIAN , HUNGARIAN , SLOVAK ,
CROATIAN , BULGARIAN ,
MACEDONIAN , ICELANDIC

of items.
It depends on available memory
amount.
Last Received

Yes

There is no limitation on the number

Number

of items.
It depends on available memory
amount.

Last Missed Number

Yes

There is no limitation on the number


of items.
It depends on available memory
amount.

LGE Internal Use Only

- 10 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

Search by Number

Name / N

/ Name
Group

Yes

There is no limitation on the number


of items.
It depends on available memory
amount.

Fixed Dial Number

Yes

Service Dial Number

No

Own Number

Yes

Read only
(add/edit/delete are not supported)

Voice Memo

Yes

Support voice recorder

Call Reminder

Yes

Missed call popup

Network Selection

Automatic

Mute

Yes

Call Divert

Yes

Call Barring

Yes

Call Charge (AoC)

Yes

Call Duration

Yes

SMS (EMS)

There is no limitation on the number of

EMS does not support.

items.
It depends on available memory
amount.
SMS Over GPRS

No

EMS Melody / Picture

No

Send / Receive / Save

No

MMS MPEG4

Yes

Send / Receive / Save

Yes

Long Message

MAX 459 characters

Cell Broadcast

Yes

Download

Over the Web

Game

Yes

Calendar

Yes

LGE Internal Use Only

SMS 3pages

- 11 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

Memo

Yes

There is no limitation on the number


of items.
It depends on available memory
amount.

World Clock

Yes

Unit Convert

No

Stop Watch

Yes

Wall Paper

Yes

WAP Browser

No

Support only web browser based on


webkit. WAP stack and wml are not
supported.

Download Melody /

Yes

Over web browser

SIM Lock

Yes

Operator Dependent

SIM Toolkit

Class 1, 2, 3, C, D

MMS

Yes

EONS

Yes

CPHS

Yes

ENS

No

Camera

Yes

Wallpaper

V4.2

5M AF /
Digital Zoom : x3

JAVA

No

Voice Dial

No

IrDa

No

Bluetooth

Yes

Android do not support JAVA

Ver. 3.0
(GAP, A2DP, AVRCP) DUN, FTP, GAVDP,
GOEP, HFP, HSP, OPP, SDAP, SPP)

FM radio

Yes

GPRS

Yes

Class 12

EDGE

Yes

Class 12

Hold / Retrieve

Yes

Conference Call

Yes

DTMF

Yes

Memo pad

No

LGE Internal Use Only

Max. 6

- 12 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

TTY

No

AMR

Yes

SyncML

Yes

IM

Yes

Email

Yes

LGE Internal Use Only

Gtalk

- 13 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

2.6 HW SPEC.
1) GSM transceiver specification
Item

Specification
Rms : 5

Phase Error

Peak : 20
GSM : 0.1 ppm

Frequency Error
EMC(Radiated

DCS/PCS : 0.1 ppm


Spurious

Emission

Disturbance)

GSM/DCS : < -28dBm

Transmitter Output power and Burst

GSM : 5dBm 33dBm 3dB

Timing

DCS/PCS : 0dBm 30dBm 3dB

Burst Timing

<3.69us

Spectrum due to modulation out to

200kHz : -36dBm

less than 1800kHz offset

600kHz : -51dBm/-56dBm
GSM :
1800-3000kHz :< -63dBc(-46dBm)

Spectrum due to modulation out to

3000kHz-6000kHz : <-65dBc(-46dBm)

larger than 1800kHz offset to the

6000kHz < : < -71dBc(-46dBm)

edge of the transmit band

DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)

Spectrum due to switching transient


Reference Sensitivity TCH/FS
Usable receiver input level range

400kHz : -19dBm/-22dBm(5/0), -23dBm


600kHz : -21dBm/-24dBm(5/0), -26dBm
Class II(RBER) : -105dBm(2.439%)
0.012(-15 - -40dBm)

Intermodulation rejection Speech

800kHz, 1600kHz

channels

: -98dBm/-96dBm (2.439%)

AM Suppression
T

GSM : -31dBm

DCS : -29dBm

Timing Advance

LGE Internal Use Only

-98dBm/-96dBm (2.439%)

0.5T

- 14 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

WCDMAtransmitter
transmitter specification
specification
2)2)WCDMA
Item
Transmit Frequency

Specification
BD1: 1920MHz ~ 1980 MHz
BD2: 1850~1910 MHz
BD8: 880 MHz ~ 915 MHz

Maximum Output Power

+24 dBm / 3.84 MHz, +1 / -3 dB

Frequency Error

within 0.1 PPM

Open Loop Power Control

Normal Conditions : within 9 dB,


Extreme Conditions : within 12 dB

Minimum Transmit Power

< -50 dBm /3.84 MHz

Occupied Bandwidth

< 5 MHz at 3.84 Mcps (99% of power)

Adjacent Channel Leakage

> 33 dB @ 5 MHz,

Power Ratio (ACLR)

> 43 dB @ 10 MHz

Spurious Emissions

< -36 dBm / 1 kHz RW

|f-fc| > 12.5 MHz

< -36 dBm / 10 kHz RW @ 150 KHz f < 30 MHz

@ 9 kHz f < 150 kHz

< -36 dBm / 100 kHz RW


< -30 dBm / 1 MHz RW

@ 30 MHz f < 1 GHz


@ 1 GHz f < 12.75 GHz

< -60 dBm / 3.84 MHz RW @ 869 MHz f 894 MHz


< -60 dBm / 3.84 MHz RW @ 1930 MHz f 1900 MHz
< -60 dBm / 3.84 MHz RW @ 2110 MHz f 2155 MHz
< -67 dBm / 100 kHz RW @ 925 MHz f 935 MHz

Transmit Intermodulation

< -79 dBm / 100 kHz RW

@ 935 MHz < f 960 GHz

< -71 dBm / 100 kHz RW

@ 1805 MHz f 1880 MHz

< -41 dBm / 300 kHz RW

@ 1884.5 MHz < f < 1919.6 MHz

< -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz


when Interference CW Signal Level = -40 dBc

Error Vector Magnitude

< 17.5 %, when Pout -20 dBm

Peak Code Domain Error

< -15 dB at Pout t -20 dBm

LGE Internal Use Only

- 15 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

3) WCDMA receiver specification


Item
Receive Frequency

Specification
BD1: 2110 MHz ~2170 MHz
BD2: 1850~1910 MHz
BD8: 925 MHz ~ 960 MHz

Reference Sensitivity Level

Band1 : BER < 0.001 when or = -106.7 dBm / 3.84 MHz


Band2 : BER < 0.001 when or = -106.7 dBm / 3.84 MHz
Band8 : BER < 0.001 when or = -106.7 dBm / 3.84 MHz

Maximum Input Level

BER < 0.001 when or = -25 dBm / 3.84 MHz

Adjacent Channel Selectivity

ACS > 33 dB where BER < 0.001 when

(ACS)

or = -92.7 dBm / 3.84 MHz


& Ioac = 52 dBm / 3.84 MHz @ 5 MHz

Blocking Characteristic

BER < 0.001 when or = -103.7 dBm / 3.84 MHz


& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = 10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = 15 MHz

Spurious Response

BER < 0.001 when or = -103.7 dBm / 3.84 MHz


& Iblocking = -44 dBm

Intermodulation

BER < 0.001 when or= -103.7 dBm / 3.84 MHz


& Iouw1 = -46 dBm @ Fuw1(offset) = 10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = 20 MHz

Spurious Emissions

< -57 dBm / 100 kHz BW @ 9 kHz f < 1 GHz


< -47 dBm / 1 MHz BW @ 1 GHz f 12.75 GHz
Adjust output(TPC command)
cmd
+1

Inner Loop Power Control


In Uplink

0
-1

1dB

2dB

+0.5/1.5
-0.5/+0.5
-0.5/-1.5

3dB

+1/3

+1.5/4

-0.5/+0.5

-0.5/+0.5

-1/-3

-1.5/-4

group(10equal command group)


+1

LGE Internal Use Only

+8/+12

- 16 -

+16/+24

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

4) HSDPA transmitter specification


Item

Specification

Transmit Frequency

BD1: 1920MHz ~ 1980 MHz


BD2: 1850~1910 MHz
BD8: 880 MHz ~ 915 MHz

Maximum Output
Power

Sub-Test
1=1/15,
3=13/15
5=15/7
Subtest in
table
C.10.1.4

HS-DPCCH

2=12/15
4=15/8
6=15/0

21~25dBm / 3.84 MHz


20~25dBm / 3.84 MHz
19~25dBm / 3.84 MHz
Transmitter
power step
tolerance
[dB]

Power
step

Power step slot boundary

Power
step size,
P [dB]

Start of Ack/Nack

+/- 2.3

Start of CQI

+/- 0.6

Middle of CQI

+/- 0.6

End of CQI

+/- 2.3

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Spectrum Emission
Mask

Frequency offset from


carrier f

Minimum requirement

Measurement
Bandwidth

2.5 ~ 3.5 MHz

-35-15(f-2.5)dBc

30 kHz

3.5 ~ 7.5 MHz

-35-1(f-3.5)dBc

1 MHz

7.5 ~ 8.5 MHz

-35-10(f-7.5)dBc

1 MHz

8.5 ~ 12.5 MHz

-49dBc

1 MHz

Adjacent Channel
Leakage
Power Ratio (ACLR)

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0


> 33 dB @ 5 MHz
> 43 dB @ 10 MHz

Error
Magnitude

< 17.5 %, when Pout -20 dBm

Vector

LGE Internal Use Only

- 17 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

5) HSDPA receiver specification


Item

Specification

Receive Frequency

BD1: 2110 MHz ~2170 MHz


BD2: 1850~1910 MHz
BD8: 925 MHz ~ 960 MHz

Maximum Input Level

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

(BLER or R), 16QAM Only

BLER < 10%

or R >= 700kbps

6) HSUPA Tx, Rx specification


Item

Specification

Maximum Output
Power

Sub-Test
1=11/15
2=6/15
3=15/9
4=2/15
5=15/15

21~24dBm / 3.84 MHz


19~22dBm / 3.84 MHz
20~23dBm / 3.84 MHz
20~25dBm / 3.84 MHz
19~25dBm / 3.84 MHz

Sub-Test : 1=11/15, 2=6/15, 3=15/9, 4=2/15, 5=15/15

Spectrum Emission
Mask

Adjacent Channel
Leakage
Power Ratio (ACLR)

LGE Internal Use Only

Frequency offset from


carrier f

Minimum requirement

Measurement
Bandwidth

2.5 ~ 3.5 MHz

-35-15(f-2.5)dBc

30 kHz

3.5 ~ 7.5 MHz

-35-1(f-3.5)dBc

1 MHz

7.5 ~ 8.5 MHz

-35-10(f-7.5)dBc

1 MHz

8.5 ~ 12.5 MHz

-49dBc

1 MHz

Sub-Test : 1=11/15, 2=6/15, 3=15/9, 4=2/15, 5=15/15


> 33 dB @ 5 MHz
> 43 dB @ 10 MHz

- 18 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

6) WLAN 802.11b transceiver specification


Item

Specification

Transmit Frequency

2400 MHz ~ 2483.5 MHz ( CH1~CH13 )

Tx Power Level

20dBm under (Europe), 30dBm under (USA)

Frequency Tolerance

within 25 PPM

Chip clock Frequency

within 25 PPM

Tolerance
Spectrum Mask

-30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz


-50 @ f < fc-22MHz and f > fc+22MHz

Power ramp on/off time

2us

Carrier Suppression

-15dB

Modulation Accuracy

35%

(Peak EVM)
Spurious Emissions

< -36 dBm @ 30MHz ~ 1GHz


< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz

Rx Min input Sensitivity

-76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER 8%

Rx Max input Sensitivity

-10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER 8%

Rx Adjacent Channel

35dB @FER 8%,

Rejection

interference input signal -70dBm@fc25MHz(11Mbps)

LGE Internal Use Only

- 19 -

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2. PERFORMANCE

7) WLAN 802.11g transceiver specification


Item

Specification

Transmit Frequency

2400 MHz ~ 2483.5 MHz ( CH1~CH13 )

Tx Power Level

20dBm under (Europe), 30dBm under (USA)

Frequency Tolerance

within 25 PPM

Chip clock Frequency

within 25 PPM

Tolerance
Spectrum Mask

-20 @ 11MHz offset (9Mhz ~ 11MHz)


-28 @ 20MHz offset (11MHz ~ 20Mhz)
-40 @ 30MHz offset (20MHz ~ 30Mhz)

Transmitter constellation error

-5dB@6Mbps, -8dB@9Mbps, -10dB@12Mbps,

(rms EVM)

-13dB@18Mbps, -16dB@24Mbps, -19dB@36Mbps,


-22dB@48Mbps, -25dB@54Mbps

Spurious Emissions

< -36 dBm @ 30MHz ~ 1GHz


< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz

Rx Min input Sensitivity

PER 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps

Rx Max input Sensitivity

-20dBm(6,9,12,18,24,36,48,54Mbps) @ PER 10%

Rx Adjacent Channel

PER 10%,

Rejection

ACR 16dB@6Mbps, ACR 15dB@9Mbps,


ACR 13dB@12Mbps, ACR 11dB@18Mbps,
ACR 8dB@24Mbps, ACR 4dB@36Mbps
ACR 0dB@48Mbps, ACR -1dB@54Mbps
ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent
sensitivity specified in min input sensitivity

LGE Internal Use Only

- 20 -

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Only for training and service purposes

2. PERFORMANCE

8) WLAN 802.11n transceiver specification


Item

Specification

Transmit Frequency

2400 MHz ~ 2483.5 MHz ( CH1~CH13 )

Tx Power Level

20dBm under (Europe), 30dBm under (USA)

Frequency Tolerance

within 25 PPM

Chip clock Frequency

within 25 PPM

Tolerance
Spectrum Mask

-20 @ 11MHz offset (9Mhz ~ 11MHz)


-28 @ 20MHz offset (11MHz ~ 20Mhz)
-45 @ 30MHz offset (20MHz ~ 30Mhz)

Transmitter constellation error

-5dB@6.5Mbps, -10dB@13Mbps, -13dB@19.5Mbps,

(rms EVM)

-16dB@26Mbps, -19dB@39Mbps, -22dB@52Mbps,


-25dB@58.5Mbps, -28dB@65Mbps

Spurious Emissions

< -36 dBm @ 30MHz ~ 1GHz


< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz

Rx Min input Sensitivity

PER 10%
-82dBm@6.5Mbps, -79dBm@13Mbps, -77dBm@19.5Mbps
-74dBm@26Mbps, -70dBm@39Mbps, -66dBm@52Mbps
-65dBm@58.5Mbps, -64dBm@65Mbps

Rx Max input Sensitivity

-20dBm(6.5,13,19.5,26,39,52,58.5,65Mbps) @ PER 10%

Rx Adjacent Channel

PER 10%,

Rejection

ACR 16dB@6.5Mbps, ACR 13dB@13Mbps,


ACR 11dB@19.5Mbps, ACR 8dB@26Mbps,
ACR 4dB@39Mbps, ACR 0dB@52Mbps
ACR -1dB@58.5Mbps, ACR -2dB@65Mbps
ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent
sensitivity specified in min input sensitivity

LGE Internal Use Only

- 21 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

9) GPS receiver specification


Item

Specification

Receive Frequency

1574.42 MHz ~ 1576.42 MHz

Minimum Sensitivity

1 satellite -142dBm, 7 satellites -147dBm at coarse time aiding

10) Current consumption


Stand by
Bluetooth Off

Bluetooth Connected Voice Call

VT

WCDMA

4.0 mA under

7 mA under

350 mA under

NA

Only

(DRX=1.28)

(DRX=1.28)

(Tx=12dBm)

GSM

4.0 mA under

7 mA under

350 mA under

Only

(Paging=5 period)

(Paging=5 period)

(Tx=Max)

11) Battery life time


Stand by

WCDMA

GSM

LGE Internal Use Only

350 hours over


(DRX = 1.28)

Voice Call

VT

250 min over


(TX = 12dBm,

NA

Low Pwr mode)

350 hours over

250 min over

(Paging Period = 9)

(TX Level = Max)

- 22 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

12) Charging hour


3.5hour under ( 1500mAh battery, 1A TA)

LGE Internal Use Only

- 23 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

2. PERFORMANCE

13) RSSI indicator (Based on Cell power)


BAR

WCDMA

GSM/DCS/PCS

Over -902dBm

Over -90 2dBm

43

-90 2dBm

-90 2dBm

32

-96 2dBm

-97 2dBm

21

-102 2dBm

-103 2dBm

10

-110 2dBm

-107 2dBm

14) Battery indicator


Battery Bar

Specification

BAR 6 (Full)

90% over

BAR 6 --> 5

90% 89%

BAR 5 --> 4

70% 69%

BAR 4 --> 3

50% 49%

BAR 3 --> 2

30% 29%

BAR 2 --> 1

15% 14%

BAR 1 --> 0

5% 4%

Low Battery Pop-up

4% ~ 15% : One Time popup (No call)

Critical Low Battery Pop-up

0% ~ 3% : Every Level change popup (No call)

POWER OFF

0%

LGE Internal Use Only

remain%

- 24 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief
3. TECHNICAL
BRIEF BRIEF
3.
TECHNICAL

3.1 GENERAL DESCRIPTION


The LG-P970 supports UMTS-900, UMTS-1900, UMTS-2100, GSM-850, GSM-850, GSM-900, GSM-1800, and GSM1900 based GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF
architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The
quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that
translates the GMSK-modulated or 8-PSK-modulated signal to RF.

rF Block Diagram
FEM
with
GSM

FSY2_CLK

PAM

VCTCXO
26MHz

SKY77529

XO
VCONT

G850/G900

TX_LB
TX_HB

AFC_DAC

DCS/PCS

DET

W900
Duplexer

RXTX_L2

WCDMA
Dual PAM
ACPM-5281

W2100
Duplexer

RXTX_H

CPL

W1900
Duplexer

RXTX_M1

F26M

SYS_CLK

TX2G_L
TX2G_M

W-PAM
ACPM-5202

CPL

WCDMA
TX SAW

TX_3G_L

WCDMA
TX SAW

TX_3G_H

WCDMA
TX SAW

TX_3G_M

DI3_TX_DAT
DI3_TX_DATX

Di3_TX_DAT
Di3_TX_DATX

DI3_RX_DAT
DI3_RX_DATX

Di3_RX_DAT
Di3_RX_DATX

MP-eHM

transceiver

PMB9801

PMB5703

PWR DET

PA_POW_DET

RFIN1
1900

RX SAW

LNA
RFIN4BGA749

RX_M2 ~MnGX`WWG nGX`WW


RX_M2X

2100

RX SAW

RX_H
RX
H
~GYXWW
RX_HX

RFIN5

900

RX SAW

RX_L1
~MnG`WW
RX_L1X

RX SAW

RX_L2
nG_\W
RX_L2X

RFIN2

RX_M2
RX_L1
RX_M3

850
1800

RX SAW

VDD_MAIN
VDD_FSYS

RX_M1 nGX_WW
RX_M1X

VDD_IO

2.85V_RF1
2.85V RF2
2.85V_RF2
1.8V_SD

VRF1
VRF2
VSD2

[Figure 3-1] Block diagram of RF part

LGE Internal Use Only

- 25 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

General
SMARTi UE is a highly integrated UMTS/GSM-transceiver, with all necessary features to enable multi
mode,multi band telephone applications. It incorporates a fully integrated dual mode receiver, multi band TX
outputs,TCVCXO control, a measurement interface, DigRF V3.09 compliant high speed data and control interface,
a multi mode timer unit and all necessary front end signals for the complete RF Engine control. Overall the IC
directly supports RF engines with up to 4 GSM bands and typ. 3 UMTS (can be less or more depending on engine
setup) bands without additional discrete RF path switches.
Receiver Section
For the RX section the IC features 5 RX inputs, 4 of those might be used for multi mode receive, this means they
can be used for GSM and UMTS (the IC can be reconfigured to achieve in spec performance) operation. The band
I input is for UMTS operation only. The multi mode inputs may alternatively be configured to be first LNA (for
GSM) or LNA2 (UMTS) when an additional external LNA and interstage filter is used. The receiver structure is
optimized for compressed mode operation, thus only a single base band chain is used, saving area and
optimizes power consumption.The receiver AGC can be aligned to the UMTS frame structure with the TAS macro
SYNC3G.
Transmitter Section
The TX features 6 RF outputs, which are directly matched to 50 impedance for easy connection to external
power amplifiers, which reduces significantly external component count. 2 outputs are high power, small signal
polar modulated outputs for the GSM system, with low sensitivity to PA harmonics. They are capable to perform
GMSK or 8-PSK modulation signals with excellent noise performance, thus no interstage filter in between
transceiver and PA is required. The low band output covers the 850 and the 900 MHz GSM bands, the mid band
output covers the 1800 and 1900 MHz bands.
The UMTS outputs are vector modulated single ended high output power driver amplifiers, with excellent EVM
and adjacent channel leakage performance. Together with external UMTS power amplifier modules all bands
except band VII can be addressed. There is one driver for all low bands (850 and 900 MHz bands), two drivers for
the mid bands (1700 - 1900 MHz bands) and one driver for the high band (2100 MHz band). Thus many band
combinations can be supported by the transceiver.
The IC features additionally closed loop power control for GSM and for UMTS, thus supporting TRP requirements
in cooperation with the power amplifier and the antenna design. There is one input pin for the power detector
voltage coming from the PA, the complete loop circuits are implemented in the digital domain, which enables a
high reliability of the loop performance for both standards.

LGE Internal Use Only

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3. Technical Brief

Interfaces
The base band is connected via a DigRF V3.09 high speed data interface with a maximum clock frequency of 312
MHz. The pure digital interface enables the digital baseband to shrink efficiently, as all the analog functionality is
within the RFIC. All data and control traffic is multiplexed via the RX and TX interface lines. The IC features a high
level programming model enabling the complete compressed mode operation of the device in an RF engine
environment.It handles RX and TX power control, also incorporating the calibration data. The complete timing is
optimized for compressed mode operation of the transceiver, it controls the front end components of the
engine (PAs, switches, LNAs). Additionally a SPI control bus for front end component control is available in the
IC, which also enables the readback of data from external components, thus the handling of functions like PA
saturation, mismatch detection, overheating (incorporated in the closed loop power control) can be adopted.
AFC Control
The AFC control is maintained by providing a voltage generated by a 12-Bit DAC to the external TCVCXO module,
which means the reference clock is synchronized to the system frequency.

LGE Internal Use Only

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Only for training and service purposes

3. Technical Brief

3.2 GSM MODE


3.2.1 GSM RECEIVER
The GSM-850/GSM-1800, receiver inputs of PMB5703 are connected directly to the transceiver front-end Module.
The GSM-900/GSM-1900 receiver inputs are using the Rx path with WCDMA1900 and WCDMA900 bands. The
GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs use differential configurations to improve
common-mode rejection and second-order non-linearity performance.
Figure 3-2 shows the line-up for the 2G receiver chain for bands serving only GSM. The RX digital front-end (DFE)
contains all digital signal processing. Blue arrows show gain switching inputs of the signal processing stages.
The signal path splits at the mixer input into an in-phase and an identical quadrature path. For simplicity the 2nd
path is not shown in the figure. The quadrature downconverter translates the useful signal directly to baseband
(zero-IF).

switch

RF filter

20 dB
gain step

17 dB
gain step

6 dB
gain step

35 dB
gain range
(1 dB step)

LNA

mixer

analog
baseband filter

buffer

[Figure 3-2] 2G Receiver Line Up-GSM Single Mode Setup

LGE Internal Use Only

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Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

Figure3-3 shows the 2G receiver line-up in a multimode band. Note the gain step given for the external LNA may
vary from the given value. The chain is basically identical to the 3G line-up but many stages in analog and digital
domain are switched into a different operation mode.

16/-7dB

switch

duplexer

LNA1

interstage
filter

LNA2

17 dB
gain step

6 dB
gain step

35 dB
gain range
(1 dB steps)

mixer

analog
baseband filter

buffer

[Figure 3-3] 2G Receiver Line Up-GSM Multi Mode Setup

Since GSM-850, GSM-900, GSM-1800, and GSM-1900 signals are time-division duplex (the handset can only
receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers
this is accomplished in the switch module. The GSM-850, GSM-900, GSM-1800, and GSM-1900 receive signals
are routed to the PMB5703 through band selection filters and matching networks that transform single-ended
50- sources to differential impedances optimized for gain and noise figure. The PMB5703 input uses a
differential configuration to improve second-order intermodulation and common mode rejection performance.
The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having
passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC
offset corrections.

LGE Internal Use Only

- 29 -

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3. Technical Brief

3.2.2 GSM TRANSMITTER


The transmitter takes the modulating symbols sent from baseband via DigRF Interface and converts them into a
RF signal. It is based on a polar modulator architecture where amplitude and phase (or alternatively frequency)
are first handled separately and afterwards are merged in the RF domain.
The signal flow can be understood when you look at Figure 3-4. The digital symbol stream enters either a 8PSK
or a GMSK modulator, depending on the desired mode. The GMSK signal is thereby differentially encoded as
postulated by GSM specification 45.004. If a generator runs out of symbols, it behaves as if an input series of
repeating dummy symbols has been applied. To simplify mode switching between 8PSK and GMSK, the two
generators are synchronized. In 8PSK mode, the output of the internal 8PSK signal generator is given in
Cartesian (I/Q) coordinates. The desired conversion into polar coordinates (amplitude and phase) is executed by
a CORDIC algorithm. For GMSK mode the CORDIC algorithm is not involved - the incoming GMSK symbols
directly determine the modulation frequency of the sigma-delta modulation loop.
In the phase path the phase signal is differentiated to obtain a frequency signal, which is fed into a preemphasis
filter to compensate for narrow PLL bandwidth. Afterwards it is applied to the Sigma-Delta modulation loop. In
this way the Sigma-Delta PLL shifts the phase information into RF domain.
The digital amplitude signal is multiplied with the ramping waveform, converted into an analog voltage and
filtered. After that it is mixed with the purely phase modulated RF carrier to gain an amplitude and phase
modulated output signal. The output power can be influenced directly by a PGA (programmable gain amplifier),
if no power control loop is needed, or by specifying a target output level, if a closed power loop for enhanced
output power accuracyis desired.

[Figure 3-4] 2G Transmitter Line Up

LGE Internal Use Only

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3. Technical Brief

3.3 UMTS MODE


3.3.1 UMTS RECEIVER
Figure 3-5 shows the line-up for the 3G receiver chain. Note that the high gain / low gain figures for external
LNA1 are given as an example. The blue arrows indicate the gain control inputs for the AGC subsystem. The
quadrature path is a simple copy of the chain from mixer to DigRF and is not shown in the diagram.

For band l:
SMARTIUE
other bands:
extemal LNA1

switch

duplexer

LNA1

35 dB
gain range
(1 dB steps)

12 dB
gain step

16 / -7 dB

inter stage
filter

LNA2

mixer

analog
baseband filter

buffer

[Figure 3-5] 3G Receiver Line Up


After quadrature downconversion to baseband(Zero-IF) the signal is fed to the analog baseband filter.
The range and gain step of the following buffer amplifier is actually determined by the needs of the AGC in 3G
mode.

LGE Internal Use Only

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3. Technical Brief

3.3.2 UMTS TRANSMITTER


Figure 3-6 shows a functional overview of the 3G transmitter chain implemented for RF signal processing. The
IQ-chips, which are transferred via the digital interface, are stored in a FIFO. Then it depends on the setting of
three signals how samples are consumed from the FIFO Buffer.
Then the samples are fed into a CORDIC, which is used to shift the phase of the complex signal. The rootraisedcosine (RRC) filter performs the pulse shaping according to 3GPP. As the system clock is no integer
multiple of the UMTS chip rate a fractional sample rate conversion (FSRC) is necessary. In the amplitude
correction / offset correction (AC/OC) block the amplitude and the offset of the IQ-signal are modified.
The final sample rate at the output of the digital front end is achieved in the interpolation / noise shaping block,
where also the word length is reduced in order to fit to the D/A-converter resolution. After the DAC a post-filter
reduces the level of the repetition spectrum and the analog noise in order to supply a clean signal to the IQmodulator. The frequency conversion to the wanted TX-channel is done in a direct-up conversion IQ-modulator
which is followed by a gain stage with a single ended high power output.

Interface

Digital Front End (DFE)

DAC

Postfilter

RF

AD / RET

FIFO

DIG RF 3G

CORDIC

ICMP
12 bh
sign

FSRC
time adj.

RRC

AC / OC

interp
NZsh

LO

QCMP
12 bh
sign

CORDIC
Word

REQ

DC offset comp

EN

[Figure 3-6] 3G Transmitter Line Up

LGE Internal Use Only

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3. Technical Brief

3.4 GPS RECEIVER


The Global Positioning System (GPS) is a space-based global navigation satellite system (GNSS) that provides
reliable location and time information in all weather and at all times and anywhere on or near the Earth when
and where there is an unobstructed line of sight to four or more GPS satellites. The GPS Receiver of P970 built-in
BCM4751 is A-GPS chipset is made by BROADCOM that uses a host based integration architecture that splits
processing functions between the GPS core and the CPU on the Host system. The Broadcom BCM4751 is a
single-chip GPS receiver used for tracking and navigation, primarily in mobile devices. Its massively parallel,
hardware correlator architecture provides signal searches, accurate real-time navigation, improved tracking
sensitivity and low average power consumption.

Fig3.7. Block diagram of BCM4751

The BCM4751 supports additional satellite constellations including the Satellite Based Augmentation System
(SBAS) and the Quasi-Zenith Satellite System (QZSS) for Japanese applications, making as many as twelve
additional satellites available for use in navigation.
The BCM4751 GPS receiver offers 65nm CMOS design featuring a highly-integrated RF and baseband processor
with extremely low power consumption. It also claims smallest complete PCB footprint at 30mm2 including
band-pass filter, TCXO and passives.
BCM4751 GPS receiver includes software that meets international standards bodies such as 3GPP, GERAN and
OMA, which promote the delivery of GPS assistance data over cellular networks. Figure shows block diagram of
BCM4751.
The GPS signal is received by the antenna and amplified by an internal LNA. The differential signal coming out of
the LNA is sent to an I/Q mixer, which uses a local Oscillator to directly down-convert the signal to an IF Near
6MHz.
LGE Internal Use Only

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3. Technical Brief

Fig3.7. Block diagram of BCM4751

The BCM4751 supports additional satellite constellations including the Satellite Based Augmentation System
(SBAS) and the Quasi-Zenith Satellite System (QZSS) for Japanese applications, making as many as twelve
additional satellites available for use in navigation.
The BCM4751 GPS receiver offers 65nm CMOS design featuring a highly-integrated RF and baseband processor
with extremely low power consumption. It also claims smallest complete PCB footprint at 30mm2 including
band-pass filter, TCXO and passives.
BCM4751 GPS receiver includes software that meets international standards bodies such as 3GPP, GERAN and
OMA, which promote the delivery of GPS assistance data over cellular networks. Figure shows block diagram of
BCM4751.
The GPS signal is received by the antenna and amplified by an internal LNA. The differential signal coming out of
the LNA is sent to an I/Q mixer, which uses a local Oscillator to directly down-convert the signal to an IF Near
6MHz.

GPS_2.8V

R801

GPS_2.8V

10
R802
4.7K

0.1u

C804

L801

5
L803

9.1n

C808

CN801

330p

1.8n

CN802
1

C803

47p

S_D

C802

VDD
FIL_OUT

RF_IN
GND

L802

FL801

1575.42 MHz

6.8n

OUT

IN

G3G2G1
L804
100n

U802

C807

5 3 2

L812

2.2n
C816

C806

DNI

DNI

0.5p

1.8p

Fig3.8. The Schematic of GPS RF path circuit of P970

LGE Internal Use Only

- 34 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

Fig3.8. The Schematic of GPS RF path circuit of P970

Figure shows the schematic of GPS RF path circuit of P970, The CN801has connected GPS antenna, GPS signal is
routed from connector (CN801) and antenna, through a dielectric band pass filter (FL801) and then is amplified
by The GPS LNA module(U802).
The GPS LNA module combines low noise amplifier with filter. The LNA module has RF character, that is 18.2dB
gain and 0.95dB noise figure and rejected spurious signal.

FB801
?

C801
2.2u

B5
B3

E4

D4
D3

F2

VDDLNA

E2

VDDIF

VDDPL

SYNC/PPS_OUT
IFVALID
RST_N
REGPU
TM2

AVSS
VSSC1
VSSC2
VSSC3

A6

C3

SCL2/UART_TX
SDA2/UART_RX
UART_nRTS
UART_nCTS

VDD_BAT

C4

REF_CAP

1.8V_VIO

SDA1
SCL1

L803

G1

9.1n

F1
G2
C808
A5

26MHz_GPS_REF
GPS_26MHz
CLK32K_TWL

D1
D5
D2

1.8p

C1
E1

A3
A2

GPS_GSM_CTL
GPS_RESET_N
GPS_PWR_ON

B6
G6
E6

A4
C5

G5

C6

U801

VDD_PRE

G4

GPS_CAL
TCXO/TSXO
LPO_IN
ADCP
VDDADC
ADCN

F6

GPS_UART_RXD
GPS_UART_TXD
GPS_UART_CTS_N
GPS_UART_RTS_N

10n

C810

2.2u

VDD1P2_GRF

F4
B2

C809

D6

B1

RFIP
VSSIF
VSSLNA

VDDC2
VDDC1

E5

VDD_AUX_O
VDD_AUX_IN
HOST_REQ
LNA_EN

VDD1P2_CORE

E3

CAL_REQ/ANT_SEL
VSSADC

B4

C2

AUXOP

F5

A1

VDDIO

G3

F3

GPS_TCXO_1.8V
GPS_2.8V

1.8V_VIO

C811
2.2u

C812
2.2u

C813
2.2u

Fig3.9. The Schematic of GPS main circuit of P970

LGE Internal Use Only

- 35 -

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Only for training and service purposes

3. Technical Brief

The amplified GPS signal due to GPS LNA module, go into RFIP pin of U801 GPS chipset. Figure. shows the
schematic of GPS main circuit of P970. The internal LNA/mixer in U801 down-converts the 1575.42MHz GPS
signal to an intermediate frequency of approximately 6.2 MHz. Setting the IF at around 6MHz reduces the
sensitivity of the GPS RF to flicker noise and DC offset.
The TCXO (X801) makes 26MHz reference clock that drives the frequency synthesizer into U801 that generates
about 1.5GHz LO signal. The frequency synthesizer conations a fraction-N PLL consisting of on-chip
VCO and supports a wide rage of reference frequencies, including all frequencies commonly specified in mobile
phone standards.
The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from the
GPS antenna switch, through a band pass filter and then an impedance transformer circuit that optimally
matches the impedance looking into the GPS LNA. The impedance transformer circuit topology is shown in
Figure 3.10.

[Figure 3.10] GPS Input Network Topology

LGE Internal Use Only

- 36 -

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Only for training and service purposes

3. Technical Brief

3.5 LO GENERATION and DISTRIBUTION CIRCUIT


The PMB 5703 contains two synthesizer blocks (see Figure3-6). Depending on UMTS or GMSK/8-PSK mode
different VCOs, LF and CPs settings are used. In GMSK/8-PSK mode only the TRX PLL loop with the 2G TRX VCO is
working, which is available in the TX synthesizer block (left). In UMTS TX/RX mode, two separate synthesizer
blocks are available. The TX synthesizer is in the UMTS TX block (left), where the loop is working with the 3G TX
VCO. The RX synthesizer is in UMTS RX block working with the 3G RX VCO.

[Figure 3-6] RF Synthesizer (GMSK/8-PSK and UMTS)

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3. Technical Brief

In the PMB 5703 the receiver and the transmitter contain each a complete fractional-N sigma-delta synthesizer
with fast locking. For GMSK/8-PSK RX operation mode a fractional-N sigma-delta synthesizer for the frequency
synthesis is used. For GMSK/8-PSK TX operation mode the fractional-N sigma-delta synthesizer is used as a
Sigma-Delta modulation loop to process the phase/frequency signal.
A 26 MHz reference signal (provided by an internal clock generation block) serves as comparison frequency of
the phase detector. In GMSK/8-PSK mode the divider in the feedback path of the synthesizer is carried out as a
multi-modulus divider (MMD). The GMSK/8-PSK loop filter is fully integrated and the loop bandwidth is about
100 kHz to allow the transfer of the phase modulation during GMSK/8-PSK operation. The open loop gain is
automatically adjusted prior to each GMSK/8-PSK slot . To overcome the statistical spread of the loopfilter
element values an automatic loopfilter adjustment is performed before each GMSK/8-PSK synthesizer startup.
The fully integrated GMSK/8-PSK quad-band VCO is designed for the four GMSK/8-PSK bands (850, 900,
1800,1900 MHz) and operates at double (for GSM1800 and GSM1900 band) or four times (for GSM850 and
GSM900 band) of the transmit or receive frequency. To cover the wide frequency range the VCO is automatically
aligned by a binary automatic band selection before the settling process of the synthesizer starts. In UMTS TX
and RX mode a fractional-N sigma-delta synthesizer for the frequency synthesis is used.
The implemented divider in the feedback path of the synthesizer is carried out as a multi-modulus divider
(MMD). Also the 26 MHz reference signal serves as comparison frequency of the phase detector. The UMTS loop
filter is fully integrated and the loop bandwidth is about 180 kHz. The open loop gain is automatically adjusted
prior each UMTS channel programming.
The two fully integrated UMTS VCOs are designed for the UMTS bands (I, II, III, IV, V, VI, VIII, IX and X) and operates
at double (for bands I, II, III, IV, IX and X) or four times (for bands V, VI and VIII) of the transmit or receive
frequency. To cover the wide frequency range the VCOs are automatically aligned by a binary automatic band
selection before the settling process of the synthesizer starts.

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3. Technical Brief

3.6 OFF-CHIP RF COMPONENTS


3.6.1 UMTS PAM
3.6.1.1 W2100,W900 (U105, ACPM-5281), W1900(U103, ACPM-5202)
The ACPM-5281 is a dual-band PAM (Power Amplifier Module) designed for UMTS Band1 and Band8. The ACPM5281 meets stringent UMTS linearity requirements. The 4mmx5mm form factor 14-pin surface mount package is
self contained, incorporating 50ohm input and output matching networks.
The ACPM-5202 is a fully matched 10-pin surface mount module developed for UMTS Band2. This power
amplifier module operates in the 1850-1910MHz bandwidth. The ACPM-5202 meets stringent UMTS linearity
requirements up to 28dBm output power (Rel99). The 3mmx3mm form factor package is self contained,
incorporating 50ohm input and output matching networks
The ACPM-5281 and ACPM-5202 feature 5th generation of CoolPAM circuit technology which supports 3
modes bypass, mid and high power modes. The CoolPAM is stage bypass technology which enables power
amplifier to lower power consumption. Active bypass feature is added to 5th generation to enhance power
added efficiency at low output range and this technology extends talk time of mobiles more by further saving
power amplifiers current consumption. The power amplifier is manufactured on an advanced InGaP HBT
(hetero-junction Bipolar Transistor) MMIC (microwave monolithic integrated circuit) technology offering stateof-the-art reliability, temperature stability and ruggedness.

[Figure 3-7] ACPM5281 (W2100,W900)

[Figure 3-8] ACPM-5202(W1900)

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amplifier module operates in the 1850-1910MHz bandwidth. The ACPM-5202 meets stringent UMTS linearity
requirements up to 28dBm output power (Rel99). The 3mmx3mm form factor package is self contained,
incorporating 50ohm input and output matching networks
The ACPM-5281 and ACPM-5202 feature 5th generation of CoolPAM circuit technology which supports 3
modes bypass, mid and high power modes. The CoolPAM is stage bypass technology which enables power
3. to
Technical
amplifier to lower power consumption. Active bypass feature is added to 5th generation
enhance powerBrief
added efficiency at low output range and this technology extends talk time of mobiles more by further saving
power amplifiers current consumption. The power amplifier is manufactured on an advanced InGaP HBT
(hetero-junction Bipolar Transistor) MMIC (microwave monolithic integrated circuit) technology offering stateof-the-art reliability, temperature stability and ruggedness.

[Figure 3-7] ACPM5281 (W2100,W900)

[Figure 3-8] ACPM-5202(W1900)

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3. Technical Brief

3.6.2 26MHz VCTCXO (X101, DSA221SCL)


The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference
frequency for all RFIC synthesizers as well as clock generation functions within the PMB5703 IC. The oscillator
frequency is controlled by the PMB5703 ICs.
TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A
two-pole RC lowpass filter is recommended on this control line.
The PM7540 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before
other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the
MSM TCXO_EN line . The PM7540 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is
enabled before most other regulated outputs. Any GSM mode power control circuits within the MSM7227 IC
require a reference voltage for proper operation and sufficient accuracy.
Connecting the PM7540 IC REF_OUT directly to the MSM7227 IC GSM_PA_PWR_CTL_REF provides this reference.
This sensitive analog signal needs a 0.1 F low frequency filter near to MSM side, and isolate from digital logic
and clock traces with ground on both sides, plus ground above and below if routed on internal layers.

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3. Technical Brief

3.6.3 FEM + GSM PAM (U104, SKY77529)


The SKY77529 Tx Front End Module (FEM) is designed in a compact form factor for quad-band cellular handsets
comprising GSM850/900, DCS1800, PCS1900, supporting GMSK and linear EDGE modulation. Class 12 General
Packet Radio Service (GPRS) multi-slot operation is also supported.
The module consists of a GSM850/900 PA block and a DCS1800/PCS1900 PA block, a printed directional coupler
for each block impedance-matching circuitry for 50 input and output impedances, a multifunction power
amplifier control (MFC) block, low pass harmonic rejection filters, and an SP8T Antenna T/R switch. Two separate
Hetero junction Bipolar Transistor (HBT) PA blocks are fabricated onto an InGaP die; one supports the
GSM850/900 bands, the other supports the DCS1800 and PCS1900 bands. The InGaP PA die, the silicon MFC die,
PHEMT switch die, and the passive components are mounted on a multi-layer laminate substrate. The assembly
is encapsulated with plastic overmold.
The FEM incorporates full support for a Serial Peripheral Interface (SPI) bus function. The SPI controller shall
accept SPI telegrams with data fields that support PA and switchplexer-related functions. All FEM operating
modes and switch states shall be determined by the SPI telegram. The Multi-function Control (MFC) provides pin
out for interoperation with a specified transceiver that will establish a closed loop power control mechanism.
The external circuit uses the Linear Detector output to set a fixed bias point for 8PSK (EDGE) mode and a variable
bias point for GMSK (GSM) mode.
The power control loop together with the MFC will reduce sensitivity to antenna load, input drive, temperature,
power supply, and process variation. The combined circuit configures the PA for fixed gain in 8PSK mode while
providing the ability to optimize the PA bias at different power levels to maximize efficiency.

V-Q3_HB
VCMOS
Tx_HB

RxTx-H

Match

VSPI

SERIAL

CLK

PERIPHERAL

DRW

INTERFACE

SS

CONTROL

VDET

LINEAR RF
DETECTOR

VRAMP

POWER
AMP
CONTROL

Rx-M3

BICMOS
MFC

Rx-M2

ANTENNA

RxTx-M1
Rx-L1

Tx_LB

Match

RxTx-L2

V-Q3_LB
Batt

[Figure 3-10] SKY77529 Block Diagram

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3. Technical Brief

[Figure 3-11] SPI Write Programming Truth Table

3.6.4 GPS LNA (U802, ALM1612)


The ALM1612 is a GPS Low Noise Amplifier with an integrated SAW filter at the output. Low noise figure, along
with high gain, achieved by the ALM1612 makes it ideal for GPS recievers requiring high sensitivity. This module
builds upon AVAGO leading edge pHEMT process and integrates input matching and low loss high rejection
SAW filter at the output. This results in high performance and a reduced solution size. The ease of
implementation simplifies the reciever design.
The ALM1612 is packaged in a compact 3.3 mm x 2.1 mm x 1.2 mm package with low external component count
required to achieve the best-in-class performance.

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3. Technical Brief

3.7 Digital Baseband ( OMAP3630 / X-GOLD 616 )


3.7.1 General Description
A. Features (OMAP3630)
The OMAP3630 high-performance, multimedia application device is based on the enhanced OMAP 3
architecture and ins integrated on TI advanced 45-nm process technology
The architecture is designed to provide bes-in-class video, image, and graphics processing sufficient to support
the following
-Streaming video
-2-dimension / 3-dimensionmobile gaming
-High-resolution still image
-Support OS such as Windows CE / Symbian OS / Linux / Android OS
-Microprocessor unit subsystem based on the ARM cortex A8
-Imaging video and audio subsystem with TMS320C64x DSP core
-L3/L4 interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and
external memory controllers and to on-chip peripherals
-120-KB ROM / 64-KB single-access SRAM on-chip memory
-Peripherals
-Universal asynchronous receiver/transmitter , Three general interface & UART + IrDA SIR
-Multichannel buffered serial port, Three general purpose and two audio loopback capable
-Three master/slave inter-integrated circuit(I2C) high speed standard interfaces
-High speed multiport USB host and High speed USB ON-The-Go
-High-speed controller that offers high-speed data transactions on a USB port with embedded DAM
-High speed MMC/SD/SDIO 1/2/3
-General purpose times ( eleven GP timers )
-Two Watchdog timers / 32 kHz clock timer
- Six 32-bit GPIO controllers

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3. Technical Brief

B. Features (X-GOLD 616)


The X-GOLD 616 is GSM/UMTS/GPRS/EDGE/HSDPA/HSUPA baseband controller with integrated mixed signal
audio and measurement subsystem and modem power management unit.
The processing of the upper 2G.3G cellular protocol stack layer are handled by and ARM 1176 embedded
microcontroller
The Key features are following
-Audio : Loudspeaker (stereo) / external chip support / microphone and other audio input / ringtones
-Modem : 3GPP release 6 / HSDPA category 8 / HSUPA category 6 /E-GPRS class 33 etc.
-ARM 11 : operating frequency 416MHz
-Sensors with analog measurement interface
-Memory types : SDRAM / LPDDR1-DRAM / NOR / DDR-NOR / eSD / eMMC / SD / MMC
-High speed interface to SIM & USB 2.0 HS
-Package size : 8 8 0.8 mm, 0.4 mm pitch

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3. Technical Brief

3.8 Hardware Architecture


<System HW Block>
B
project Block Diagram
VT Cam

Camera

2M

5M MIPI

EDGE

26M

PCM UART SDIO

m
nzt
l
wht
t

Bluetooth

transceiver
PMB5703

Wi-Fi FM

Di3 RF I/F

MCP(CP)
Dg x

PCM
X32
SDRC
X16
GPMC

4Gb DDR
SDRAM

I2C2

Address

USIM

I2C

USB DP/DM tWL


|ziGpm
|hy{Gvthw

MUIC

|hy{Gy{

|hy{Gz~

LCD BL Charge Pump

LCD Backlight

Proximity sensor

Motion
eMMC
(2GB)

Driver

GPIO for PWM

HS USB data

GPIO

HS USB data

INT1

DP/DN
PCM

Touch Screen

Hall IC

MMC1

TWL5034

I2C3

Gyro
Compass

Key LED
Driver

I2C1 I2C4
KPD

I2S

I2C2

Touch Driver

AMBIENT

OMAP3630

UART3_TX_IRRX/TX
UART4 (GPMC_WAIT)

16

Touch module

Mounted
M
t d on
OMAP3630

I2C2

LCD 4.0
WVGA (800X480)

I2C2

GPIO
I2C
SPI2
I2C1
I2C2
I2C3

A-GPS

DSS_DAtA

MMC2

1Gb NAND

Battery
(1500mAh)

MCP(AP)

16

512Gb DDR
SDRAM

Charger
IC

GPIO
I2C
USIF3
USIF
USB

PCM

MEM_AD

WCDMA

CC_000

MEM_A

I2C_MODEM 2

wti`_WX
UMTS
PAM

Duplex

UART2 CSI2 I2C3 CAM IF I2C3


UART1
SDIO
NCS

Key
Audio
Subsystem

EAR_MIC

MAX17040

Fuel gauge

Figure. Block Diagram

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3. Technical Brief

<Detail 1 : RF Block>

rF Block Diagram
FEM
with
GSM

FSY2_CLK

PAM

VCTCXO
26MHz

SKY77529

XO
VCONT

G850/G900

TX_LB
TX_HB

AFC_DAC

DCS/PCS

DET

W900
Duplexer

RXTX_L2

WCDMA
Dual PAM
ACPM-5281

W2100
Duplexer

RXTX_H

CPL

W1900
Duplexer

RXTX_M1

F26M

SYS_CLK

TX2G_L
TX2G_M

W-PAM
ACPM-5202

CPL

WCDMA
TX SAW

TX_3G_L

WCDMA
TX SAW

TX_3G_H

WCDMA
TX SAW

TX_3G_M

DI3_TX_DAT
DI3_TX_DATX

Di3_TX_DAT
Di3_TX_DATX

DI3_RX_DAT
DI3_RX_DATX

Di3_RX_DAT
Di3_RX_DATX

MP-eHM

transceiver

PMB9801

PMB5703

PWR DET

PA_POW_DET

RFIN1
1900

RX SAW

LNA
RFIN4BGA749

RX_M2 ~MnGX`WWG nGX`WW


RX_M2X

2100

RX SAW

RX_H
RX
H
~GYXWW
RX_HX

RFIN5

900

RX SAW

RX_L1
~MnG`WW
RX_L1X

RX SAW

RX_L2
nG_\W
RX_L2X

RFIN2

RX_M2
RX_L1
RX_M3

850
1800

LGE Internal Use Only

RX SAW

RX_M1 nGX_WW
RX_M1X

- 47 -

VDD_MAIN
VDD_FSYS
VDD_IO

2.85V_RF1
2.85V RF2
2.85V_RF2
1.8V_SD

VRF1
VRF2
VSD2

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3. Technical Brief

3.9 Subsystem(PMB9801_X-GOLDTM616)
3.9.1 ARM Microprocessor Subsystem
The ARM1176JZ-S incorporates an integer unit that implements the ARM11 ARM architecture v6. The core
supports the 32-bit ARM and 16-bit Thumb instruction sets, Jazelle technology to enable direct execution of Java
byte codes and a range of SIMD DSP instructions that operate on 16-bit or 8bit values in 32-bit registers.

3.9.2 WCDMA Subsystem


The 3.5G cellular modem is implemented as an independent Layer1 subsystem including a separate
microcontroller. The X-GOLDTM616 Modem core acts as a master controlling the 3.5G cellular Modem slave via
the Layer1 host controller interface.
The 3.5G cellular modem consists of a number of superblocks.All higher rate physical layer data connections are
realized by a dedicated bus system using dedicated soft bit RAM (SBRAM) blocks serving as data buffers in
between the inner receiver (IRX) and outer receiver (ORX) peripherals for UMTS and HSDPA demodulation and
channel decoding. The AHB buses are mainly used for configuring the HW peripherals and collection of
measurement results and reportings of the peripherals by the 3G modem controller:
The individual superblocks are:
SB_COM: including
The communication RAM (COMRAM) for HCI command exchange and physical layer data exchange in both
3.5G transmit and receive direction
Buffering of communication flags, implementing the notification mechanism between host and 3G modem
controller based on interrupts in both directions
RLC (radio link control)/MAC (medium access control) accelerators (MACPHY-UL and MACPHY-DL) supporting
the data processing of the Layer 2 protocol stack entities RLC and MAC in both uplink and downlink direction
Access to the crossbar via the 3G_Master interface and the multi master AHB_3G_MASTER bus. The MACPHY
units have master access to the crossbar via the 3G_MASTER master interface. The 3G_Master
interface can also be accessed from the ARM7 via an AHB2AHB bus bridge connected to the AHB_3G_SYS
bus.Simple round robin arbitration of AHB_3G_Master between the three masters is implemented.
Access from the crossbar via the 3G_MACOM slave interface
Access from the 3G modem controller subsystem via the 3G_MEMIF bus

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3. Technical Brief

SB_uC: including
The 3G modem controller subsystem including the AHB_3G_SYS bus, and master interfaces to three
peripheral buses 3G_MEMIF, AHB1_3G_L1 and AHB2_3G_L1
The USIF trace interface
The Mtrace trace interface to the MIPI port
The interrupt control unit ICU
An AHB2AHB bridge connecting the 3G modem controller to the 3G_Master interface via AHB_3G_SYS
SB_TXSR: including
The UMTS cell searcher (SRCH) HW peripheral
The UMTS delay profile estimator (DPE) HW peripheral
The measurement RAM (MRAM) buffering the results of both SRCH and DPE
Access from the 3G modem controller subsystem to MRAM via the 3G_MEMIF bus
Transmit modulator (TxMod) and transmit bit processor (E-TxBitProc) HW peripherals performing transport
channel multiplexing, channel coding and modulation for all uplink data streams. These blocks exchange
data via a dedicated RAM SBRAM-TX
Access to the transport blocks stored in the COMRAM by the E-TxBitProc via the dedicated bus system
Configuration access from the 3G modem controller subsystem via the AHB_3G_L1 AHB bus
SB_RAKE: including
The DSP subsystem performing sub-slot signal processing and control for the Rake and HSDPA-IRX peripherals.
The DSP subsystem is connected to the 3G modem controller via shared memory and interprocess
communication via comunication flags, and to the Rake and HSDPA-IRX peripherals via a dedicated bus
The Rake inner receiver HW peripheral performing demodulation of all UMTS and HSUPA physical channels
Configuration Access from the 3G modem controller subsystem via the AHB_3G_L1 AHB bus
Access to the SBRAM1 performing framewise storage of the demodulated coded composite transport channels
via the dedicated bus system

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3. Technical Brief

SB_ORX: including
The SBRAM1 performing framewise storage of the demodulated coded composite transport channels via the
dedicated bus system
The SBRAM2 performing TTI wise storage of the demodulated transport channels via the dedicated bus system
The R99-ORX (Outer Receiver) HW peripheral performing transport channel demultiplexing, de-rate
matching and channel decoding of all UMTS downlink physical channels
Configuration access from the 3G modem controller subsystem via the AHB_3G_L1 AHB bus
Access to write decoded transport
SB_HSDPA: including
The HSDPA-IRX inner receiver HW peripheral performing demodulation of HS-PDSCH and demodulation and
decoding of HS-SCCH HSDPA physical channels
The SBRAM3 performing framewise storage of the demodulated coded composite transport channels via the
dedicated bus system
The SBRAM4 performing TTI wise storage and HARQ (hybrid ARQ) buffering via the dedicated bus system the
HSDPA-ORX (Outer Receiver) HW peripheral performing transport channel demultiplexing, de-rate matching,
HARQ processing and channel decoding of all UMTS downlink physical channels
Configuration Access from the 3G modem controller subsystem via the AHB_3G_L1 AHB bus
Access to write decoded transport blocks into the COMRAM via the dedicated bus system
SB_DIGRF: including
The DigRF interface (compliant with DigRF Interface V3.09), which is used to transfer the complete 3.5G and
2.5G GSMEDGE data and control information for both receive and transmit direction using the DigRF V3.09
packet structures from X-GOLD618 to suitable RF transceiver ICs
Access from AHB_3G_Shared which is a multi master AHB bus shared between host controller and 3G modem
controller. The access must be shared since both controllers need configuration access e.g. for writing control
sequences, and reading status information from the 2G and 3G RF transceivers. Master access from the 3G
modem controller subsystem is provided via an AHB2AHB bridge. Master access from the ARM11 side is
provided via the 3G_MACOM crossbar interface and an AHB2AHB bridge. Simple round robin arbitration of
AHB_3G_Shared is implemented
Access from the 2G side for 2G data read and write access to and from the RF side

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3. Technical Brief

Several individual blocks on top level: including


The UMTS System Interface (USI), consisting of the the UMTS Timer used for highly accurate interrupt and
trigger generation for the L1 FW, UMTS HW peripherals, AGC, and the Control Sequencer, used to process
more complex trigger and switching sequences (e.g. typical RF control sequences) which are programmed by
firmware into a sequence RAM. A sequence is started manually or via a trigger signal from the UMTS Timer
The 3G Control Unit (3GCU) consisting of System Control Unit (3G-SCU), System Power Control Unit (3GSPCU)
and Clock Generation Unit (3G-CGU) for the 3.5G subsystem.The 3GCU is responsible for the control of the 3G
subsystem. It is tightly coupled to the Master Chip Control Functions of the 2G subsystem in the X-GOLD618.

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3. Technical Brief

WCDMA
3GPP WCDMA FDD Multimode Type II UE Protocol Stack
Configurable for data classes up to 384 Kbit/s
Inter-RAT Handover and Cell Reselection.
Supports two types of Compressed Mode.
Network Assisted Cell Change from UTRAN to GERAN and GERAN to UTRAN.
Conforms with ETSI UICC Specifications.
SIM/USIM support.
A-GPS support.
CS Data (transparent/non transparent up to 64kBit/s; Support for Video Telephony)

Release 5 - HSDPA
High Speed Downlink Packet Access (HSDPA)
Compliant with 3GPP Release 5.
Supporting HSDPA Category 8, up to 7.2Mbps.
IPv6 support.

Release 6 - HSUPA
High Speed Uplink Packet Access (HSUPA)
Compliant with 3GPP Release 6.
Supporting HSUPA category 6, up to 5.8Mps.
Robust Header Compression (RoHC).
Fractional DPCH.
WB-AMR Support.

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3. Technical Brief

3.9.3 GSM Subsystem


The X-GOLDTM616 is suited for mobile stateons operating in the GSM850/900/1800/1900 band. In the receiver
path the antenna input signal is converted to the base band, filtered, and amplified to target level by the RF
transceiver chip set. Tne modem processor performs for both, GMSK and 8-PSK, the complex baseband signal
equalization with soft-output recovery and the channel decoding supported by a Viterbi hardware accelerator.
RMS calculation for field strength measurements (monitoring)
Detection and evaluation of frequency correction bursts (FCB)
Equalization of GMSK and 8PSK normal bursts as well as synchronization bursts with bit-by-bit soft output.
Single Antenna Interference Cancellation (SAIC) for GMSK and 8PSK channels.
Channel encoding and soft-decision channel decoding for all supported GSM/GPRS/EDGE speech,
data and control channels
Synchonization channel (SCH) and control channels including RACH and PRACH
FR, HR, EFR speech channels (TCH/FS, TCH/HS, TCH/EFS)
NAMR/WAMR speech channels over GMSK and 8PSK
Mandatory sub-functions for speech channels:
Discontinous transmission (DTX)
Voice activity detection (VAD)
Background noise calculation
Fullrate and halfrate data channels (F14.4, F9.6, F4.8, F2.4, H4.8, H2.4)
GPRS class 33 support for coding schemes CS1..CS4
Fast USF detection algorithm for MAC layer
EGPRS class 33 support for modulation and coding schemes MSC1..MSC9
Incremental redundancy (ARQ2) for EGPRS
Dual transfer mode (DTM) class 33

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3. Technical Brief

GSM/GPRS/EDGE
Supports GSM, GPRS and EDGE up to Class 33.
EDGE Coding Schemes MCS1 to 9.
CSD
R4 GERAN Feature Package 1
SAIC / DARP
Repeated FACCH and repeated SACCH
A-GPS Support
Support for WB-AMR
GPRS ROHC

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3. Technical Brief

The Equalizer Accelerator is used to speed up the viterbi trellis search in the equalizer
The Channel Decoder Accelerator is used to speed up the viterbi trellis search in the channel decoder
The DigRF RX block is the interface for receiving samples from the RF
The DifRF TX block is the interface for transmitting samples to the RF
The GSM Cipher is used for encrypting and decrypting data in circuit switched calls
The IR memory is needed for storing incremental redundancy data in a EGPRS call
The shared memory is used to exchange data and control information between DSP and ARM
The AFC is used for controlling the (external) VCXO in the frequency control loop
The GSM system interface is used to program the timing of all GSM related signals
The GPRS GEA Kasumi is used for encrypting and decrypting data in packet switched calls
The USIM is the SIM card interface

3.9.4 RF Interface
The RF interface communicates with the mobile stations external RF and analog baseband circuits. Signals to
these circuits control signal gain in the Rx and Tx signal path and maintain The systems frequency reference.

3.9.5 SPI based IPC


The XMM6160 platform supports the serial connection via SPI. The command flow of the IPC is independent
from the HW solution and the IPC protocol. It is implemented using a logical channel multiplexer and AT
commands.
The IPC hardware interface consists of a serial SPI interface and two control signals, and one additional optional
control signal. The SPI is implemented using the USIF2 of the X-GOLD616, with the GPIOs implementing sleep
mode and readiness handling

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3. Technical Brief

3.9.6 Audio function


Audio Processing on ARM Core
The ARM1176 core is mainly in charge of audio application tasks, including audio playback, audio streaming
and audio recording if required. This implies the usage of codec algorithms such as MP3, WMA, AAC etc., which
must be implemented as decoder and/or encoder software on the ARM core. Decoded audio streams are
transmitted as PCM samples to the DSP core via a shared memory. Audio streams to be encoded are transmitted
by the DSP to the ARM core via a shared memory. The ARM can also generate ring tones and service tones to
notify an incoming call, an incoming message or any audio notification of a phones event (warning, error,
confirmation, battery low, etc.). Another activity on the audio side for the ARM is the streaming of compressed
audio data over the UART interface to the Bluetooth chip for A2DP usage (Advanced Audio Distribution Profile:
audio playback over Bluetooth). Via the same interface it communicates with the Bluetooth chip (this is not
restricted to audio activities). The ARM core is managing the configuration of the AFE by sending commands to
the DSP over shared memory to activate various configurations of the AFE. Note that the activities of the ARM
remain purely digital audio processing.

Audio Processing on DSP Core


The DSP core is in charge of speech audio and mixing tasks and its activities remain - as the ARM - purely
digital audio. The DSP can also execute some audio application tasks. It ensures the simultaneous encoding
and decoding of speech audio frames during telephone conversation. It uses different sets of vocoders as
specified by the applicable standards for the ongoing telephone conversation. On the audio out path (i.e.
towards the speaker) it mixes audio application received over shared memory with decoded speech audio. On
this path it can also mix some audio samples coming from the microphone to enable the feedback loop to the
speaker (Sidetone generation, as specified in 3GPP/ TS 43.050, chapter 3.10). On the audio in path (i.e. from the
microphone to the transmission of the encoded audio samples over the air) the DSP can also mix speech audio
samples with any other digital audio source and analogue FM radio as well. The mixing capabilities are
extremely broad as the cases mentioned above are only examples. These mixing capabilities also include the
ability to execute a sample rate conversion to bring all samples to the same rate before
mixing. The DSP also can execute some audio application tasks such as PCM, ADPCM, SB-ADPCM audio playback
and recording. Simple Tone (sine tones, DTMF, key click) can be generated as well.
The next activity of the DSP is transferring data to and from the hardware peripherals (AFE, I2S0 and I2S1).
Asmentioned in Figure 1 a fifo buffer is used to exchange stereo audio samples between the DSP and the AFE
on the microphone path and speaker path. When receiving a command from the ARM the DSP directly
configures the different modes of the AFE. The DSP also manages the I2S interfaces I2S0 and I2S1. I2S0 interface,
configured as master interface, is used to exchange speech audio samples at a rate of 8 or 16 kHz mono on both
directions with the Bluetooth chip in the case of a speech call using a Bluetooth headset. The I2S1 interface can
be used as slave or master interface, enabling the exchange of audio stereo samples at any common rate
between 8 and 48 kHz, potentially asymmetrically between RX and TX. This is to act as an audio bridge with an
external audio chip (application processor, audio processor,etc.). Note that the activities of the DSP - like the
ARM - remain purely digital audio processing. Refer to the document system requirements specification for
more details on the different audio application features supported by the chip.
LGE Internal Use Only

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3. Technical Brief

Audio Processing on Audio Front End


The AFE is used as a playback and capture device, i.e. exchanging digital audio stereo samples on both
directions (from microphone to DSP and from ARM/DSP to speaker). On audio-in path analog to digital
conversion and amplification is executed. On the audio-out path digital to analog conversion and power
amplification is performed. Additionally, the AFE physically selects the correct audio analog paths and is directly
managing the analog inputs and outputs.

3.9.7. Vocoder Subsystem


FR, HR, EFR speech channels (TCH/FS, TCH/HS, TCH/EFS)
NAMR/WAMR speech channels over GMSK and 8PSK
Mandatory sub-functions for speech channels:
Discontinous transmission (DTX)
Voice activity detection (VAD)
Background noise calculation
Fullrate and halfrate data channels (F14.4, F9.6, F4.8, F2.4, H4.8, H2.4)

3.9.8 Memory Subsystem


The X-GOLD616 can use the general term SDRAM as a shortcut for Mobile DDR SDRAM. A total of up to four
external memories is supported, chip selects can be dynamically allocated to one of the two external memory
controllers of X-GOLD616. Only two memory devices can be connected to the SDRAM controller if DDR support
is required.

3.9.9 Battery Management Hardware Configurations


The X-GOLD616 chip has an internal PMU that will provide power supply for the chip itself, memory and the
attached RF. The X-GOLD also holds a measurement unit that can perform all necessary battery measurements
through external HW. This is sufficient for a modem only design where charging is controlled by another chip

3.9.10 General-Purpose Input/Output Interface


The X-GOLD616 chip has an internal PMU that will provide power supply for the chip itself, memory and the
attached RF. The X-GOLD also holds a measurement unit that can perform all necessary battery measurements
through external HW. This is sufficient for a modem only design where charging is controlled by another chip

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3. Technical Brief

3.9.11 Clocking
The clocking system is based on 2 different clocks, a 26 MHz reference clock generated within the RF Engine and
a 32 kHz real-time clock (RTC) generated in the baseband.The 26 MHz clock provided by the RF engine is the
main reference clock for the RF circuit and the X-GOLD616. Also other system components may be supplied
with 26 MHz reference clocks. A 32 kHz oscillator located at the X-GOLD616 supplies the RTC with the reference
clock for the real time clock application, as well as provides a low power standby clock for system sleep mode
operation. This clock is available
also for other system components like GPS.

3.9.12 USB
The XMM6160 platform provides two USB interfaces compliant to the USB2.0 standard:
High speed interface (480 Mbps) for communication with external devices acting both as host or device
Full speed interface (12 Mbps) for communication with the UICC using the IC-USB standard acting as host
The USB solution is based on USB controller hardware IP, which is integrated in the X-GOLD616 baseband chip including
both USB transceivers for high and full speed and the USB Stack software that implements the different USB device classes
and features.
The HS OTG USB component supports the following features:
Modem connection for DialUp Networking and AT command interface (CDC-ACM)
Tracing over USB (CDC-ACM)
Suspend/Resume and Remote Wakeup (for power saving)
Software download
Optional features (not included in the XMM6160 platform):
Support for isochronous transfers
The IC-USB component supports the following features:
UICC-Terminal USB interface according to ETSI TS 102 600 (ICCD only)
Suspend/Resume and Remote Wakeup (for power saving)

LGE Internal Use Only

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3. Technical Brief

3.10 Power Block


3.10.1 General
Since P970 uses two individual chips, XMM6160 (IFX Modem) uses integrated PMIC and OMAP3630 uses
TWL5034 as a main PMIC.

3.10.2 XMM6160 (IFX Modem)


X-GOLD616 is a single integrated circuit UMTS/GPRS/EDGE Baseband Controller with integrated mixed signal
and measurement subsystem and modem power management unit. This system on chip designed in
Poweraudio
Block
Diagram (CP)

Infineons low power 65nm CMOS process technology provides the performance to meet the ever increasing
demands of the cellular subscriber market for feature rich terminals at lowest power consumption and a very
competitive cost position.

PMB9801

vSD1
vSD1 1.3v_Core(450mA)

vDD Core
vDD_Core

(450mA)

1.8v_SD(450mA)
vSD2
vSD2
(4450mA
1.35v_PLL(30mA)
vDD_vPLL)
vANA2
vMiPi
vDD_vrtC
vDD_vUSB

vDD_DiG / MeM
vDD_LvDS

2.5v_ANA2(70mA)

vDD_MiPi_BGC

1.2v_MiPi(60mA)

vDD_MiPi

2.3v_rtC(7mA)

vDD_rtC

3.1v_USB(40mA)

vDD_USB

PMB9801

vrF1
vrF2

2.85v_rF1(180mA)

vDD_MAiN

2.85v_rF2(60mA)

vDD_FSYS
vDD_vAr

PMB5703
vDD_vPMU
vANA1

vDD vSiM
vDD_vSiM

MEMORY

vBAt

(for Infineon)
1G / 512Mb

2 85v SiM
2.85v_SiM

USIM For Infineon

(7mA)

Figure. LGP970 Modem Power Block Diagram

LGE Internal Use Only

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3. Technical Brief

3.10.3 TWL5034
The TWL5034 is an integrated power management for mobile devices that use the OMAPs application
processors (AP), or other similar application processors. The TWL5034 includes three high efficiency step-down
regulators and 17 LDOs to power the application processor, internal Logic, I/O, memory, and system accessories.
An additional the device provides LED driver circuitry to power two LED circuits(LED A,LEDB)
that can illuminate a panel or provide user indicators. The LED A can provide up to 160 mA and the
LED B, 50 mA. Each LED circuit is independently controllable for basic power (on/off) control and
illumination level (using PWM).

OJS<:3#V|vwhp#Eorfn#Gldjudp#+whw,
vDD1_Core [1.4A] 1.2v

vDD1_SW_01~03, vDD1_FB

Backup
BATT

vDDS_CSi2

oMAP3630

1.8v_MMC_eN [100mA]

vMMC2_oUt

26MHz

HF_CLKiN

PMB9801

vDDS_DPLL_Per/DLL

1.8v_CSi2 [100mA]

vAUX4_oUt

[5mA Max]

vDDS_MMC1

1.8v_PLL1 [40mA]

vPLL1_oUt

1.8v_vio

vDD_Core (Max 1.6v)

1.8v_vio [600mA]

vio

BKBAt

vDD_MPU_ivA (Max1.6v)

vDD2_Core [600mA] 1.0v

vDD2_SW_01,02, vDD2_FB

1"$5

LDo

vBAt

(NLSv2t244)

ProXiMitY

2.8v_ProXi [200mA]

vAUX1_oUt

(GP2AP002S00F)

vt_CAM_Drv_2.8v [220mA]

vMMC1_oUt

vt CAM

vt_CAM_io_1.8v [200mA]

vAUX3_oUt
vAUX2_oUt
vDAC_oUt
vBUS

eMMC

(SDiN5D2-2G)

LeveL SHiFter

tWL5034

CSC3M260000BFvrS00

2.3v_rtC

vSiM_oUt
(vPLL2)vSDi_CSi_oUt

3.0v_MotioN [100mA]

LDoA
LDoB
LDoC
LDoD

SUB PMIC
CAM POWER
(LP8720)

SW
LDo3
LDo4

Micro USB

LDo5

SUB

1.8v_WLAN [50mA]

GYro (MPU3050A)

1.8v_AUDioAMP[100mA]

CoMPASS
LeD1~8

vt

Motion (KXtF9)

1.8v_MotioN_vio [65mA]

vBAt

LCD BL
CHG PUMP
(AAT2870)

vt

LCD_BL_oUt[1:8]

SUB

(AK8975C)

SUB

WLAN+Bt+FM CoB

1.8v_LCD_iovCC (300mA)

(BCM43291SKUBG)

4.0 LCD

3.0v_LCD_vCC_vCi (150mA)

WM9093

1.8v_toUCH(150mA)
3.0v_toUCH (150mA)

TOUCH
FLASH LeD Driver

1.2v_5M_vDiG (400mA)

(rt8515)

2.7v_5M_vANA(300mA)

5M CAM

1.8v_5M_vio(300mA)

SUB

DP3t S/W (FSUSB63)

2.8v_5M_vCM (300mA)

LDo1

3.0v_MMC (300mA)

LDo2

3.0v_Motor (300mA)

MiCro SD

SUB

CArD_DeteCt : 1.8v_vio

iNt : 1.8v_vio

Motor Driver

FUeL GAUGe

vBAt

(MAX17043)

(iSA1000)

vCHG

Charging IC
RT9524

USB_vBUS[4.9v, 60mA]

vBAt

MUiC

Battery

iNt : 1.8v_vio

(MAX14526DeeWP)

1500mA/h

CHGSB : 1.8v_vio

Figure. TWL5034 functional block diagram

LGE Internal Use Only

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3. Technical Brief

3.10.3 Charging control


P970 uses individual Charger IC which is RT9524.

Features
28V Maximum Rating for DC Adapter
Internal Integrated Power MOSFETs
Support 4.2V/2.3A Factory Mode
50mA Low Dropout Voltage Regulator
Status Pin Indicator
Programmed Charging Current
Under Voltage Lockout
Over Voltage Protection
Thermal Feedback Optimized Charge Rate
RoHS Compliant and Halogen Free

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3. Technical Brief

3.10.3.2 Constant Current Charging


Battery Pre-Charge Current
During a charge cycle, if the battery voltage is below the pre-charge threshold, the RT9524 enters the Pre-charge
mode. This feature revives deeply discharged cells and protects battery. Under USB100 Mode, the pre-charge
current is internally set to 95mA. When the RT9524 is under USB500 and ISET Mode, the pre-charge current is
20% of fast-charge current set by external resistor RISET.
Battery Fast-Charge Current
ISET Mode
The RT9524 offers ISET pin to program the charge current. The resistor RISET is connected to ISET and GND. The
parameter KISET is specified in the specification table.

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3. Technical Brief

Battery Voltage Regulation (CV Mode)


The battery voltage regulation feedback is through the BATT pin. The RT9524 monitors the battery voltage
between BATT and GND pins. When the battery voltage closes in on the battery regulation voltage threshold,
the voltage regulation phase begins and the charging current begins to taper down. When the charging current
falls below the programmed end-of-charge current threshold, the CHGSB pin goes high to indicate the
termination of charge cycle. The end-of-charge current threshold is set by the IEOC pin. The resistor REOC is
connected to IEOC and GND. The parameters KEOC and IEOC are specified in the specification table.

The current threshold of IEOC (%) is defined as the percentage of fast-charge current set by RISET. After the
CHGSB pin is pulled high, the RT9524 still monitors the battery voltage. Charge current is resumed when the
battery voltage goes to lower than the battery regulation voltage threshold.

3.10.3.3 Constant Voltage Charging


Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant
voltage charging is commonly detected around 240mA from Travel adaptor.

3.10.3.4 LGP970 Charging Specification


-Charging Method : CC & CV (Constant Current & Constant Voltage)
-Maximum Charging Voltage : 4.2V
-Maximum Charging Current : 946mA
-Nominal Battery Capacity : 1500mAh
-Charging time : Max. 3h 30m
- Full charge indication current (icon stop current) : 156mA

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3. Technical Brief

3.10.3.5 LGP970 battery bar icon display


Battery Bar Number

Specification

BAR 6 (Full)

90% over

BAR 6 --> 5

90% 89%

BAR 5 --> 4

70% 69%

BAR 4 --> 3

50% 49%

BAR 3 --> 2

30% 29%

BAR 2 --> 1

15% 14%

BAR 1 --> 0

5% 4%

Low Battery Pop-up

4% ~ 15% : One Time popup

Critical Low Battery Pop-up

0% ~ 3% : Popup at every level change

POWER OFF

0%

Remain %

Table. LGP970 battery bar specification

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3. Technical Brief

3.11 External memory interface


3.11.1 Introduction
Since LGP970 contains communication and application processor, memory is dedicated only for each processor.
XMM6160 (IFX modem) uses MCP (Multi Chip Package) 1Gb nand / 512Mb LPDDR1 and AP20 uses POP (Package
on Package) 512MB LPDDR1 and 2GB eMMC nand memory.

3.11.2 LGP970 XMM6160 (IFX Modem) memory Interface


-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package
-512Mbit Mobile DDR SDRAM / 1Gbit NAND Flash
Interface Spec
Part Name
H8BCS0QG0MMR46M

Product Gr

Maker

Operation Voltage

Speed

NAND

Hynix

1.8V

45ns

1.8V

166MHz

SDRAM

3.11.3 LGP970 OMAP3630 memory Interface


- Package on Package on OMAP3630: LPDDR1 512MB SDRAM
- 8GB eMMC 4.4 version
LPDDR1 SDRAM
Interface Spec
Part Name
H8MBX00U0MER-0EM

Product Gr

Maker

Operation Voltage

Speed

SDRAM

Hynix

1.8V/1.2/1.2/1.2

DDR1 400
(200MHz)

8GB NAND
Interface Spec
Part Name

Product Gr

Maker

Operation Voltage

Speed

SDIN5D2-2G

NAND

Sandisk

3.3V

15MB/s for read


9MB/s for write

3.11.4. External SD card memory Interface


TI OMAP3630 supports external SD card which supports up to 32GB (SDHC compatible)

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3. Technical Brief

3.12 H/W Sub System


3.12.1 RF Interface
The base band is connected via a DigRF high speed data interface with a maximum clock frequency of 312 MHz.
The pure digital interface enables the digital baseband to shrink efficiently, as all the analog functionality is
within the RFIC. All data and control traffic is multiplexed via the RX and TX interface lines. The IC features a high
level programming model enabling the complete compressed mode operation of the device in an RF engine
environment. It handles RX and TX power control, also incorporating the calibration data.
The complete timing is optimized for compressed mode operation of the transceiver, it controls the front end
components of the engine (PAs, switches, LNAs). Additionally a SPI control bus for front end component
control is available in the IC, which also enables the readback of data from external components, thus the
handling of functions like PA saturation, mismatch detection, overheating (incorporated in the closed loop
power control) can be adopted.

3.12.1.1 DigiRF Interface


- RESET_N : RESET Input Signal for master reset
- ALERT_N : 3G PLL Lock Status Output Signal
- SYS_CLK : 3G DigRF System Clock Output
- DI3_TX_DAT, DI3_TX_DATX : 3G DigRF TX Input Data (Positive / Negative)
- DI3_RX_DAT, DI3_RX_DATX : 3G DigRF RX Input Data (Positive / Negative)

3.12.1.2 About Clock


- REF_CLK_EN, SYS_CLK_EN, FSYS2_EN, FSYS3_EN
- AFC_DAC : AFC DAC Output; analog output: 12 bits
- XO_SUP : Supply Voltage Output for TCVCXO
- SYS_CLK : 3G DigRF System Clock Output
- FSYS2, FSYS3, FSYS4 : 26 MHz Reference Clock Output

3.12.1.3 General Control Logic Signals


- PA Control Outputs
PA_EN1, PA_EN2, PA_EN3, PA_EN4 : PA Control Output
PA_BSEL : PA Band Select Control Output
PA_MODE : PA Mode Select Control Output
PA_RAMP : PA Ramping Voltage for GMSK and 8-PSK; analog output: 11 bits
PA_BIAS: PA Bias Voltage PA_POW_DET
- Frontend Control
FE_CTRL1~6 : Front-end Control Output
SPI(SPI_CLK, SPI_SS, SPI_DRW) : FEM Control Interface
- LNA Control
LNA_CTRL1, LNA_CTRL2, LNA_CTRL3, LNA_CTRL4 : LNA Control Output

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3. Technical Brief

rF Block Diagram
FEM
with
GSM

FSY2_CLK

PAM

VCTCXO
26MHz

SKY77529

XO
VCONT

G850/G900

TX_LB
TX_HB

AFC_DAC

DCS/PCS

DET

W900
Duplexer

RXTX_L2

WCDMA
Dual PAM
ACPM-5281

W2100
Duplexer

RXTX_H

CPL

W1900
Duplexer

RXTX_M1

F26M

SYS_CLK

TX2G_L
TX2G_M

W-PAM
ACPM-5202

CPL

WCDMA
TX SAW

TX_3G_L

WCDMA
TX SAW

TX_3G_H

WCDMA
TX SAW

TX_3G_M

DI3_TX_DAT
DI3_TX_DATX

Di3_TX_DAT
Di3_TX_DATX

DI3_RX_DAT
DI3_RX_DATX

Di3_RX_DAT
Di3_RX_DATX

MP-eHM

transceiver

PMB9801

PMB5703

PWR DET

PA_POW_DET

RFIN1
1900

RX SAW

LNA
RFIN4BGA749

RX_M2 ~MnGX`WWG nGX`WW


RX_M2X

2100

RX SAW

RX_H
RX
H
~GYXWW
RX_HX

RFIN5

900

RX SAW

RX_L1
~MnG`WW
RX_L1X

RX SAW

RX_L2
nG_\W
RX_L2X

RFIN2

RX_M2
RX_L1
RX_M3

850
1800

RX SAW

VDD_MAIN
VDD_FSYS

RX_M1 nGX_WW
RX_M1X

VDD_IO

2.85V_RF1
2.85V RF2
2.85V_RF2
1.8V_SD

VRF1
VRF2
VSD2

Figure. RF Interface Block Diagram

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3. Technical Brief

3.12.1.4 BCM43291SKUBG (BT / WiFi / FM module )


3.12.1.4.1 WiFi
* WLAN_CMD : WLAN SDIO Command Line.
* WLAN_CLK : WLAN SDIO Clock Input.
* WLAN_SDIO[3:0] : WLAN SDIO Data Line.
* WLAN_RESET_N : Low asserting reset for WLAN core.
* WLAN_HOST_WAKEUP : WL_HOST_WAKEUP signal output.
3.12.1.4.2 BT
* BT_UART_RXD : Bluetooth UART Serial Input.
* BT_UART_RTS : Bluetooth UART Request to Send. Active-low request.
* BT_UART_CTS : Bluetooth UART Clear to Send. Active-low clear.
* BT_UART_TXD : Bluetooth UART Serial Output.
* BT_PCM_CLK : BT PCM clock, can be PCM-master (output) or PCM-slave (input).
* BT_PCM_DIN : BT PCM data input.
* BT_PCM_SYNC : BT PCM sync signal, can be PCM-master (output) or PCM-slave (input).
* BT_PCM_OUT : BT PCM data output.
* BT_WAKEUP : BT Wakeup Input.
* BT_HOST_WAKEUP : BT Host Wakeup Output
* BT_RESET_N : Low asserting reset for BT core.
3.12.1.4.3 FM Radio
* FM_ANT : FM RF input.
* SLEEP CLK : External reference oscillator input. (32.768KHz)
* FM_R : Right audio line output digital input data.
* FM_L : Left audio line output digital frame synchronization.
* BT_PCMS : Also Using Control of FM Radio
3.12.1.4.4 Common
* WLAN_REG_ON : If low the internal regulators will be disabled.
* SLEEP_CLK : LPO clock (32.768kHz) input. Used for low-power mode timing.
* CLK_IN : Crystal amplifier input or frequency reference input.
* CLK_REQ : Crystal Circuit / Reference Clock Enable (active-high)

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3. Technical Brief

Figure. Wifi/BT/FM Interface Block Diagram

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Only for training and service purposes

3. Technical Brief

3.12.1.5 BCM4751 (GPS module )


- GPS_UART_RXD : Host UART transport data receive
- GPS_UART_TXD : Host UART transport data transmit. (100K pull-up is needed)
- GPS_UART_CTS_N : UART clear to send
- GPS_UART_RTS_N : UART request to send
- 26MHz_GPS_REF : Calibration clock
_ GPS_26MHz : 26MHz TCXO input
_ CLK32K_TWL : Sleep clock
- GPS_GSM_CTL : Transmit blanking signal
_ GPS_RESET_N : Reset
- GPS PWR_ON : Used as a control signal for enabling Deep Sleep mode.

Figure. GPS Interface Block Diagram

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3. Technical Brief

TI Confidential NDA Restrictions

3.12.2 OMAP Sub System

onment

www.ti

3.12.2.1 OMAP environment


Figure 1-1. oMAP3630 High-tier environment
CONNECTOR
JTAG

POP device

SDRC

CDC3S04

NAND SLC/MLC
25ns R/W, 16-bit

Quad Sine-Wave
Clock Buffer

GPMC

NC

AR
Y

DDR
200MHz, 2CS
32bit

Mobile TV

LR 5Mpx
SMIA CCP2

HR 8Mpx
MIPI CSI2

I2C3

LENS
IRIS
MOTOR

CAM ISP

FLASH

CSI2

McSPI2
UART1

CCPV2
or CSI1/2

Camera subsystem

USB3

DV

SDMMC1

OMAP3630

Mass storage media


(eMMC, CE-ATA, JC64)

USB1

EL
IM
IN

LS

3D accelerometer
FingerPrint

TI WL128x
WLAN-BT/FM-GPS

FM 76-108 MHz

SDMMC2

SDMMC3

UART3

Electronic compass

UART2

Cellular
subsystem

HDQ or
UART4
McBSP3

McSPI1

DSS

DSI

I2C2

HSUSB0

CVIDEO

I2C4/SR

McBSP2

I2C1

Main display
WVGA

TWL50xx

S-VIDEO Y/C

TI TSC200x

Touchscreen controller

*
7
4
1

Subdisplay
VGA

0
8
5
2

#
9
6
3

Introduction

PR

Display subsystem

LGE Internal Use Only

intro_177-001

SWPU176A October

- 71 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.12.2.2 Memory
Micro processor unit has a 32 bit address portTI, allowing
it to
a 4 GB space divided into several regions.
Confidential
handle
NDA Restrictions
The Memory map is composed of a memory space and dedicated space Interconnect of the devices and the main
modules and subsystems in the platform.

Introduction

www.ti.com

Figure 2-1. interconnect overview

MPU
subsystem

SGX

IVA2.2
subsystem

Display
subsystem

sDMA

L4

Camera
ISP

L4

L3 interconnect

OCM
ROM

SDRC: SDRAM
memory
controller

Stacked memories

L4 interconnect (peripheral)

USB
HS-OTG

L4

USB
HS-HOST

L4

GPMC: generalpurpose memory


controller

UART3, UART4, McBSP2, McBSP3, McBSP4,


WDT3, GPTIMER2, GPTIMER3,
GPTIMER4,GPTIMER5, GPTIMER6,
GPTIMER7, GPTIMER8, GPTIMER9, GPIO2,
GPIO3, GPIO4, GPIO5, GPIO6

DAP

D2D

L4

L4

L4 interconnect (core)

EL
IM
IN

OCM
RAM

SMS: SDRAM
memory
scheduler /
rotation

AR
Y

External peripherals ports

SCM, CM, display SS, sDMA, USB TLL,


HS USB Host, I2C1, I2C2, I2C3, UART1,
UART2, McBSP1, McBSP5, GPTIMER10,
GPTIMER11, Mailbox, McSPI1,
McSPI2, McSPI3, McSPI4,
MMC/SD/SDIO1, MMC/SD/SDIO2,
MMC/SD/SDIO3, HDQ/1-Wire,
ICR, camera ISP, MODEM, HS USB OTG
INTC, SR1, SR2, MPU INTC

L4 interconnect
(emulation)

Emulation, trace, and


debug modules

External and stacked memories

L4 interconnect (wake-up)
GPTIMER1, WDT2,
GPIO1, 32KTIMER

SWPU176A October 2009

LGE Internal Use Only

PR

External peripherals ports


memmap-001

Memory Mapping

- 72 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

203

3. Technical Brief

3.12.2.3 Power Management


SmarReflex is a power management technique for controlling the operating voltage of a device to reduce its active
power consumption.

Power IC

Device
VDD

SMPS

SR_MPU interrupt
MPU INTC
VP_MPU interrupt

Voltage command
Voltage processor
Acknowledge

Voltage
controller

IC
interface

CLK
DATA

IC
interface

Control

SR_VP interrupt

Error

Interrupt clear

SmartReflex functional clock

SmartReflex

PRM
PRCM

LGE Internal Use Only

- 73 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

TI Confidential NDA Restrictions

3.12.2.4 Camera ISP


The camera ISP is a key component for imaging and video applications such as video preview, video record , and still

Camera ISP Overview

www.ti.com

image capture with or without digital zooming.


Figure 6-1. Camera iSP overview Diagram
Device
cam_hs

AR
Y

cam_vs

Camera
ISP

cam_fld

cam_wen

cam_xclka
cam_xclkb

CPI

cam_pclk

EL
IM
IN

L4
interconnect

CSI2A

MPU
subsystem

CSIPHY2

L3
interconnect

IVA2.2
subsystem

CAM_IRQ1

INTC

CSI1 / CCP2B

CAM_IRQ0

INTC

PR

STANDBY
hardware
handshake

CSI2C

PRCM

CSIPHY1

CAM_MCLK
CAM_ICLK
CAM_FCLK
CSI2_96M__FCLK

cam_d[11:10]

(2)

cam_d[5:2]

(2)

csi2_dx0 / ccpv2_dx0

(1)(2)

csi2_dy0 / ccpv2_dy0

(1)(2)

csi2_dx1 / ccpv2_dx1

(1)(2)

csi2_dy1 / ccpv2_dy1

(1)(2)

csi2_dx2 / cam_d[1]

(1)(2)

csi2_dy2 / cam_d[0]

(1)(2)

csi2_dx0 / ccpv2_dx0 / cam_d[6]

(1)(2)

csi2_dy0 / ccpv2_dy0 / cam_d[7]

(1)(2)

csi2_dx1 / ccpv2_dx1 / cam_d[8]

(1)(2)

csi2_dy1 / ccpv2_dy1 / cam_d[9]

(1)(2)

cam_strobe

cam_global_reset
cam_shutter

Legend:

CPI input when PHYs configured in GPI mode(cam_d signals)


Serial-to-Parallel converted data stream

camisp-001

(1)

The mode for each PHY can be selected from CSI2, CSI1/CCP2B, and GPI at
SCM.CONTROL_CAMERA_PHY_CTRL register. It can also control the connection between one of the
PHY's and CSI1/CCP2B receiver via multiplexing.

(2)

There is no top-level muxmode (padconf SCM register) control bit for the different camera modes supported
by the interfaces. If one or another of the interfaces is enabled, then the camera input signals will be
automatically routed to the corresponding ISP receiver depending on the PHY operating mode settings
(SCM.CONTROL_CAMERA_PHY_CTRL register)

LGE Internal Use Only

- 74 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

TI Confidential NDA Restrictions

3.12.2.5 Display
The display subsystem provides the logic to display a video frame from the memory frame buffer on a liquid crystal
Display Subsystem Overview

www.ti.com
display
panel or TV set.

Figure 7-1. Display Subsystem Highlight


Device

Display subsystem
L4 interconnect

Remote
frame buffer
interface

DSI1_PLL_FCLK
DSI2_PLL_FCLK
DSS_LINE_TRIGGER
DSS_DMA_REQ[3:0]

dss_acbias

DSS_DATA[17:6]

dss_data[17:6]

DSS_IRQ

DSS_DATA[23:18]

Display
controller

EL
IM
IN

dss_data[23:18]

TV out
encoder

TVINT

GPIO2

Composite/Luma

Digital data

IVA2.2
subsystem
interrupt
controller

dss_hsync

DSS_ACBIAS

DSS_L3_ICLK
DSS_L4_ICLK
DSS1_ALWON_FCLK
DSS2_ALWON_FCLK
DSS_96M_FCLK
DSS_TV_FCLK

Pin multiplexing

96-MHz clock
54-MHz clock

MPU
subsystem
interrupt
controller

dss_vsync

AR
Y

L3 clock
L4 clock
Functional clock1
Functional clock2

System DMA
controller
(sDMA)

dss_pclk

DSS_HSYNC

L3 interconnect

PRCM

DSS_PCLK
DSS_VSYNC

24

Chroma

TV syncs

Video DAC
stage

System
control
module

cvideo1_out
cvideo2_out
cvideo1_vfb
cvideo2_vfb
cvideo1_rset

TVACEN

vdda_dac

TVOUTBYPASS

vssa_dac

COMP_EN

Syncs

DSI
protocol
engine

Data

PR

Controls

Note:

DSI
PLL
controller

DSI_DX0
DSI_DY0
DSI_DX1
DSI_DY1
DSI_DX2
DSI_DY2

Status

Pin multiplexing

DSS_DATA[5:0]

DSI
complex I/O

dss_data[0]/dsi_dx0
dss_data[1]/dsi_dy0
dss_data[2]/dsi_dx1
dss_data[3]/dsi_dy1
dss_data[4]/dsi_dx2
dss_data[5]/dsi_dy2
vdds_dsi
vdd_dsi
vss_dsi

DSI PLL

PLL control

HS divider

dss-001

For more information about connecting the LOCK, RECAL, and TVINT signals through the
GPIO2 and GPIO3 modules, see Chapter 25, GPIO.

The display subsystem includes the following main features:


Display controller
Display modes
Programmable pixel display modes (1,
24 bits-per-pixel
[BPP]
LGE Internal Use Only
Copyright
2011 LG Electronics.
Inc.modes)
All right reserved.
- 752,- 4, 8, 12, 16, and
Only for training and service purposes
Programmable display size supported:
XGA - 1024 x 768 VESA timings at 60 fps (pixel clock = 63.5 MHz)

3. Technical Brief

TI Confidential NDA Restrictions

HS I2C Functional Description

www.ti.com

17.4 HS i2C Functional Description


17.4.1
HSI2C
I2C Block Diagram
3.12.2.6

AR
Y

17-21 isfour
a functional
block
of the
HS I2Ccircuit
controllers.
TheFigure
device contains
multimaster
highdiagram
speed inter
integrated
controllers.
Figure 17-21. HS i2C Controllers Functional Block Diagram
Device
L4-Core interconnect

I2Ci
I2Ci_IRQ

FIFOs

I2Ci_FCLK
I2Ci_ICLK

PRCM

i2ci_scl

i2ci_sda
i2ci_sccbe

EL
IM
IN

sDMA I2Ci_DMA_TX
controller
I2Ci_DMA_RX

Master/slave
control

Registers

Internal interface

Test
control

I C and SCCB interface

MPU
INTC

Clock/reset
control

I2Ci_RESET

I2Ci_SWAKEUP

Note:

I2C-021

The i2c1_sccbe and i2c4_sccbe signal is not available. The i2c4 does not have SWAKEUP
request. It also gets its RESET signal from the PRCM reset manager.

PR

The three HS I2C controllers can be configured in F/S I2C mode, in HS I2C mode, or in SCCB mode. The
operation mode is selected by configuring the I2Ci.I2C_CON[13:12] OPMODE bit field. Table 17-10 lists
the available operation modes.
table 17-10. HS i2C operation Mode Selection

operation Mode

i2Ci.i2C_CoN[13:12] oPMoDe Bit Field value

F/S I2C

0x0

HS I2C

0x1

SCCB

0x2

Reserved (not used)

0x3

17.4.2 HS I2C Transmit Mode in I2C Mode


This mode is available for master or slave. The master and slave modes are configurable with the
I2Ci.I2C_CON[10] MST bit (0: slave mode; 1: master mode).
In master mode, the transmit mode is configured by setting the I2Ci.I2C_CON[9] TRX bit to 1. The MPU
subsystem puts the data to transmit in the TX FIFO by writing to the I2Ci.I2C_DATA[7:0] DATA bit field.
Use Only
2862LGE Internal
Multimaster
High-Speed I2C Controller

- 76 -

Copyright 2011 LG Electronics.


Inc. All
right
reserved.
SWPU176A
October
2009
Only for training and service purposes

UART/IrDA/CIR Overview

www.ti.com

3. Technical Brief

19.1 UArt/irDA/Cir overview

AR
Y

The device contains three universal asynchronous receiver/transmitter (UART) devices controlled by the
microprocessor unit (MPU) (see Figure 19-1):
Three UART-only modules, UART1, UART2 and UART4 are pinned out for use as UART devices only.
UART1 and UART2 must be programmed by setting the UARTi.MDR1_REG[2:0] MODE_SELECT field
to one of the three UART operating modes.
UART3, which adds infrared communication support, is pinned out for use as a UART, infrared data
3.12.2.7 association
UART
(IrDA), or consumer infrared (CIR) device, and can be programmed to any available
operating mode.
The device contains three universal asynchronous receiver/transmitter devices.
Figure 19-1. UArt Module
Device

UART1
(UART)

EL
IM
IN

MPUsubsystem
MPUSSINTC

UART1.IRQ

L4-Core

32

sDMA

UART1.DMA_RX/TX

uart1_tx

uart1_rx
uart1_rts
uart1_cts

32

UART2
(UART)

uart2_tx

UART2.DMA_RX/TX

UART2.IRQ

uart2_rx
uart2_rts
uart2_cts

IVA2.2subsystem

UART3
(UART/IrDa)

IVA2.2SSINTC

UART3.IRQ

eDMA

uart3_rx/uart3_rx_irrx

UART3.DMA_RX/TX

L4-Core

32

PR

uart3_tx/uart3_tx_irtx

32

uart3_rts/uart3_rts_sd
uart3_cts/uart3_cts_rctx

UART4
(UART)

UART4.IRQ

uart4_tx

UART4.DMA_RX/TX

uart4_rx

uart-001

19.1.1 UART Features

The UARTs (UART1, UART2, UART3, UART4 when in UART mode) include the following key features:
16C750 compatibility
64-byte FIFO for receiver and 64-byte FIFO for transmitter
Programmable interrupt trigger levels for FIFOs
Baud generation based on programmable divisors N (N = 1 ... 16,384) operating from a fixed functional
2938

SWPU176A October 2009

UART/IrDA/CIR

LGE Internal Use Only

- 77 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

TI Confidential NDA Restrictions


3.12.2.8 McSPI

McSPI Overview

www.ti.com

The multichannel serial port interface is a master/slave synchronous serial bus.


Figure 20-1. Multichannel Modules SPi1, SPi2, SPi3, and SPi4
Device
Multichannel
SPI1 I/F

MPU SS
INT

System
DMA

SPI1_DMA_RX[0,3]

spi1_clk
spi1_simo
spi1_somi
spi1_cs0
spi1_cs1
spi1_cs2
spi1_cs3

SPI1_DMA_TX[0,3]
SPI1_FCLK

SPI1_SWAKEUP

EL
IM
IN

PRCM

SPI1_IRQ

AR
Y

L4 interconnect

L4 interconnect
MPU SS
INT

System DMA

Multichannel
SPIm I/F
m=[2,3]

SPIn_IRQ

spim_clk
spim_simo
spim_somi
spim_cs0
spim_cs1

SPIn_DMA_RX[0,3]

SPIn_DMA_TX[0,3]

PRCM

L4 interconnect

SPIn_FCLK

SPIn_SWAKEUP

Multichannel
SPI4 I/F

MPU SS

PR

INT

System
DMA

PRCM

SPI4_IRQ

spi4_clk
spi4_simo
spi4_somi
spi4_cs0

SPI4_DMA_RX[0]
SPI4_DMA_TX[0]
SPI4_FCLK
SPI4_SWAKEUP

mcspi-001

The McSPI instances include the following main features:


Serial clock with programmable frequency, polarity, and phase for each channel
Wide selection of SPI word lengths ranging from 4 bits to 32 bits
Up to four master channels or single channel in slave mode
LGEInternal
Use Only
Copyright 2011 LG Electronics. Inc. All right reserved.
- 78 Master
multichannel mode:
Only for training and service purposes
Full duplex/half duplex
Transmit-only/receive-only/transmit-and-receive modes

TI Confidential NDA Restrictions

3. Technical Brief

Overview

www.ti.com

overview

AR
Y

The device contains two USB modules:


AUSB
High-Speed USB OTG Controller (see Section 22.1, High-Speed USB OTG Controller)
3.12.2.9
A High-Speed USB Host Subsystem (see Section 22.2, High-Speed USB Host Subsystem)
The device contains two USB modules ( HS USB OTG controller / HS USB host subsystem).

Device
High-Speed USB OTG controller

High-Speed USB host subsystem


USBTLL

12 pins ULPI

Port 1

Channel 0

12 pins ULPI

Port 2

Channel 1

12 pins ULPI

Port 3

EL
IM
IN

High-Speed USB
host controller

Port 0

Figure 22-1. USB Modules overview

Channel 2

12 pins ULPI

PR

usb-035

3280
High-Speed USB Host Subsystem and High-Speed USB OTG Controller
LGE Internal Use Only
- 79 -

SWPU176A October 2009


Copyright 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.12.2.10 MMC/SD/SDIO

TI Confidential NDA Restrictions

The Multimedia card high speed/ SD /SDIO(MMC/SD/SDIO) host controller provides an interface between a local host
such as a microprocessor unit or digital signal processor and either MMC, SD memory cards or SDIO cards and handles
MMC/SD/SDIO Overview

www.ti.com
MMC/SD/SDIO
transactions with minimal local host intervention.

Figure 24-1. MMC/SD/SDio1 and 3 overview


vdds_mmc1

Device

PBIAS0cell

SCM
MMC/SD/SDIO1
controller

vdds_sim
PBIAS1cell

AR
Y

L4
interconnect

MMC1_IRQ

MPUINTC

mmc1_clk

mmc1_cmd

MMC1_FCLK

MMC1_32K
MMC1_SWAKEUP

mmc1_dat[3:0]

MMC1_DMA_RX
MMC1_DMA_TX

PRCM

MMC/SD/SDIO3
controller

EL
IM
IN

L4
interconnect

SystemDMA
controller
(sDMA)

mmc3_clk

MMC3_IRQ

mmc3_cmd

MMC3_DMA_RX
MMC3_DMA_TX

mmc3_dat[7:0]

96MHz
32kHz

MMC3_FCLK

MMC3_32K
MMC3_SWAKEUP

Wakeupfrommmc3_dat1pin(SDIOinterrupt)usingGPIO

Wakeupfrommmc1_dat1pin(SDIOinterrupt)usingGPIO

mmchs-001

PR

GPIO

LGE Internal Use Only

- 80 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

TI Confidential NDA Restrictions

3.12.2.10 General Purpose IO

The general-purpose interface combines six general purpose IO banks Each GPIO module provides 32 dedicated
general purpose pins with input and output capabilities thus, the general purpose interface supports up to 192

General-Purpose Interface Overview

www.ti.com

(6X32) pins.

Figure 25-1. General-Purpose interface overview


Device
General-purpose interface
GPIO1
GPIO1_ICLK
GPIO1_DBCLK

AR
Y

GPIO_[31:0]

L4-Wake-up
interconnect

gpio_[31:0]

GPIO1_MPU_IRQ
GPIO1_IVA2_IRQ
GPIO1_WAKE

L4-Per
interconnect

GPIO6
GPIO5
GPIO4
GPIO3
GPIO2

GPIO_[191:188]
GPIO_[186:160]
_
GPIO_[159:128]

GPIO_[127]

gpio_[191:188]
gpio_[186:160]
gpio_[159:128]
gpio_[127]

Interface clock

GPIO2_ICLK

BANDGAP
TSHUT

GPIO_[126:96]

EL
IM
IN

PRCM
Debounce clock
Wake-up
requests

GPIO2_DBCLK
GPIO2_WAKE

GPIO_[95:64]
GPIO_[63:34]

gpio_[126:96]
gpio_[95:64]

gpio_[63:34]

IVA2.2 subsystem
interrupt
controller

MPU subsystem
interrupt
controller

Interrupt requests

GPIO2_IVA2_IRQ

GPIO_33

Interrupt requests

DAC1
TV_DETECT

GPIO2_MPU_IRQ

other GPIO modules


(GPIO3 to GPIO6)

gpif-001

PR

Each channel in GPIOs has the following features:


The GPIOi.GPIO_OE register controls the output capability for each pin.
The output line level reflects the value written in the GPIOi.GPIO_DATAOUT register through the level
4 (L4) interconnect.
The input line can be fed to GPIO through an optional and configurable debounce cell. (The
debouncing time value is global for all ports of one GPIO module, so up to five different debouncing
time values are possible.)
The input line value is sampled into the GPIOi.GPIO_DATAIN register and can be read through the L4
interconnect.
In active mode, the input line can be used through level and edge detectors to trigger synchronous
interrupts. The edge (rising, falling, or both) or the level (logical 0, logical 1, or both) used can be
configured.
In idle mode, the input line can be used to activate the asynchronous wake-up request (on edge
detection: Rising edge, falling edge, or both).
The module provides an alternative to the atomic test and set operations for the following registers:
GPIOi.GPIO_DATAOUT
LGE Internal Use Only
Copyright 2011 LG Electronics. Inc. All right reserved.
- 81 GPIOi.GPIO_IRQENABLE1
Only for training and service purposes
GPIOi.GPIO_IRQENABLE2
GPIOi.GPIO_WAKEUPENABLE

3. Technical Brief

3.13 Audio and sound


3.13.1 Overview of Audio path

1/#2

69.

z~
$%/


9/
mtGpYz

}tpk
hkjpu^

#WFKQ
5WDU[UVGO

ZU\

Figure. Block diagram of Audio & Sound path

LGE Internal Use Only

- 82 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.13.2 Audio signal processing & interface


3.13.2.1 TWL5034 audio interface
The device audio module contains several audio analog inputs, outputs, and digital microphone inputs. It is
connected to a multimedia processor through the TDM/codec interface (audio interface) and to a 3GPP Modem
through a pulse-code modulation (PCM) interface (voice interface) and Bluetooth interface. The audio module is
controlled by internal registers that can be accessed by the high-speed I2C control interface.

- Feature List Overview


Serial data ports:
Two ports: Port 1 is a voice PCM interface; Port 2 is an audio inter-IC sound (I2S)/time-division
multiplexing (TDM) interface.
No support for McBSP dynamic slot
Both ports are master/slave (In TDM mode, Port2 can act only as a master.)
Tri-state capability on I2S/TDM and PCM
Audio and voice channels:
Voice channel with 8- or 16-kHz sampling modes on MCLK=26MHz
Audio channel with 8-, 11.025-, 12-, 16-, 22.05-, 24-, 32-, 44.1-, or 48-kHz sampling modes, 96 kHz
is supported on the RX path
Audio phase-locked loop (PLL) supports 26-MHz, 19.2-MHz, or 38.4-MHz
Carkit, analog loop mode
Secondary microphone for noise cancellation
Three analog microphone biases and two digital microphone biases
Power and analog mixing
Analog/digital mixing capability (path-mixing capability)
8- stereo class D/class AB (16- headset or 32- earpiece) drivers
Class D output power of 700 mW (8 with VBAT = 4.0 V)
Stereo with or without pseudo-ground headset driver
Eight lines for the uplink path (four differential inputs). FM input is mono or stereo.
Predrivers for external class D or piezoelectric speaker drivers (multiplexed on HS pseudo-ground output)
Left/right paths switch on hands-free speaker and predriver for external class D amplifier.
Differential H-bridge driver for Vibrator.

LGE Internal Use Only

- 83 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

Additional features
Headset detect capability (GPIO)
Digital microphone inputs (four microphone inputs, two clocks, and two supplies for two external
digital microphones). Supplies are the microphone biases referred to in the previous sublist.
Data and clock are multiplexed on the PCM port.
Pop-noise reduction circuitry for all paths
Side-tone function for the voice pathsTI Confidential NDA Restrictions
Data scramble function for I2S data received
www.ti.com
Bass boost functions in one stereo audio RX path

Functional Description

Automatic
gain
control
onconnected
the microphone
The
analog
input
to the paths
analog auxiliary input and the microphones
Independent gains on UL paths
Note:

The modem or the OMAP device Bluetooth, voice, and audio interfaces must use

Programmable gain
onprovider
audio RXasand
the amplifier
same clock
theTX
device.

Wide gain programmable range on the microphone input

Figure 14-4 is an architecture overview of the audio subsystem.

DTMF tone generator

Figure 14-4. Device Audio Subsystem Architectural overview

Device- Audio

BT
voice
serial
port

Voice
DAC

PCM
voice
serial
port

Analog
mixing
VoiceandBluetoothpaths

Digitalmixing
volumecontrol
filters

Analog
drivers

Analog
volume
control

Four
ADCs

Audioandvoicemixeranddrivers
Audio
TDM/I2S
serial
port
interface

Digitalmixing
volumecontrol
filters

Programmable
analogamplifiersfor
themicrophones
Two
ADCs
Digital
microphones
interface

AudioRx/Txandvoice Tx

Inputinterfaces
audio-004

14.4.1 Data Paths

Figure . Device Audio Subsystem Architectural Overview

After the audio submodule is powered up (by the CODECPDZ bit of the CODEC_MODE register, see
Table 14-19), it has two modes of operation:
LGE Internal
Only 1: Four simultaneous multimedia analog
Copyright 2011
LG Electronics. Inc.converters
All right reserved.
Use
Option
(four multimedia
digital-to-analog
- 84channels
Only for training
service purposes
(DACs) and no modem voice path), and two simultaneous analog-to-digital converters
or and
4 channels
coming from digital microphones.
Option 2: A dedicated modem voice path (two multimedia DACs plus the ADC/DAC pair used for the

3. Technical Brief

TI Confidential NDA Restrictions

Functional Description

www.ti.com

Figure 14-7. voice/Audio option2 (oPt_MoDe = 0) Block Diagram


-24 to 12 dB
2-db step + mute
-30 to15 dB
3 dB step

BTDOUT

+
-50 to -10 dB
1 dB step+ mute

BT_PCM_ VDR

BTRXPGA
Coase gain

2nd

M
U
X

BT_ PCM_VDX

HSOL

Voice A
VDL_ GAIN
Analog PGA

BTTXPGA
Coase gain

PCM
interface
8/16 kHz

M
I
X

+
Two output amplifiers
can be driven by an
analog RXPGA amplifier
simultaneously.

M
I

PreDriv_LEFT
or HSOVMID

Ampli_PreD
PreDriv_RIGHT

VDR

M
U
X

PCM _ VDR

VRXPGA
Fine gain

TN
ATT

M
U
X

VSTPGA
voice sidetone

VDXS

TNG3

VRX2 ARX
PGA

DACR1

-42 to 0 dB
6 dB step

Analog PGA

Gain=
1 or 1

I
X

IHF_RIGHT_P
M
U
X

TNG1

Audio AL1

Voice D

ARXL1

M
U
X

ARXR1PGA
finegain
+boost

ARXR1PGA
coarse gain

ARXL1PGA
finegain
+boost

ARXL1PGA
coarse gain

ARXR2PGA
finegain
SDRR2

Audio
Filter R2

Digital mono
SDRM2

Loopbackfunc

I2S
interface

TDM/I2S_ CLK

Audio
DL1

Audio
DR2

DL1

Modulator
2nd

ARXL2PGA
finegain

+
M
U
X

Audio
Filter L2

ARXL2PGA
coarse gain

To USB block
M
I
X

ARXR2

Modulator
2nd

DACR2

Analog PGA

Carkit L

PRECKT_Left

EAR_P

2nd
M
I

-62 to 0 dB 0 dB to 12 dB
1-dB step 6-dB step
+ mute

OCP
interface

DACL2
ARXL2

M
U
X

Ampli_Ear

0 dB, +6 dB, +12 dB

Analog PGA

Audio AL2

EAR_M

Vmid

M
U
X

PWM
generator

ARX2 VTXPGA

VIBRA_P

H-bridge
vibrator

ATX2ARXL_PGA

Digital loop
(test only)

TDM/I2S_ DOUT

Voice stereo path

Digital

AVTXR2PGA
finegain

Mixing

VUL filterR

AVTXL2PGA
fine gain
VUL filterL
Mic
channel 2

Audio filter R1

Mic
channel 1

Audio filter L1

ATXR1PGA
finegain

Voice: 125 Fs
Audio: 80 Fs

ADCL

TX path

VIBRA_M

FM
Radio loop
FMR

FML

.
.

From USB block


DINP
DINM
HSMICP
HSMICM
Ampli_L
MIC_MAIN_P

ALC + AA filter

Audio stereo path

19.2/26/38.4 MHz clock

PRECKT_Right
Carkit preamplifiers

Modulator

Audio
DL2

Register

-24 to 0 dB
6-dB step + mute

Carkit R

Audio AR2

-6 dB, 0 dB, +6 dB

-62 to 0 dB
6-dB step + mute

ATX2ARXR_PGA

M
I
X

M
U
X

RX path

TDM/I2S_ SYNC

TDM/I2S_DIN

SDRL2

ARXR2PGA
coarse gain

IHF_LEFT_M

2nd

Audio

@48 kHz

IHF_LEFT_P
Class-DL

DR1

Digital mixing

24 bits

DACL1

Modulator

M
U

Class-DR
IHF_RIGHT_M

DTMF

Analog PGA

M
U
X

Ampli_HS
HSOR

-15 to 0 dB
1.0 dB step

TNG2

-24 to 0 dB
1 dB step + mute

-50 to -10 dB
1 dB step + mute

ARXR1

filter

-15 to 0 dB
1.0 dB step

Audio AR1

-18 db 0 dB

TNG4

VDL

VDXM

HFCLKIN

Ampli_PreD

X
-42 to 0 dB
6 dB step

-36 to 12 dB
1 dB step + mute

PCM_ VFS

PCM _ VDX

Ampli_HS

-15 to 30 dB
3 dB step

Bluetooth
Sidetone

BTDIN

PCM _ VCK

-6 dB, 0 dB, 6 dB
M
I
X

BTSTPGA
Bluetooth
interface

Cross R / L possible for Predriver D / Driver D outputs

Analog mixing

DAC
voice

Modulator

MIC_MAIN_M

1-dB step(ALC)
ATXL1PGA
finegain

0 to 31 dB
1-dB step

ADCR

PLL audio
+ div voice

..

AUXL/FML

ALC is available only for the Main Mic and the Sub Mic

6-dB step(LINE)

MIC_SUB_P
MIC_SUB_M

Ampli_R
AUXR/FMR

Input amps
DIG_MIC0

Digital micro
interface

DIG_MIC_CLK0

50 Fs

audio-006

Figure. Detailed diagram of TWL5034 audio interface

SWCU051F March 2008 Revised July 2010

LGE Internal Use Only

Audio

- 85 -

671

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

Copyright 20082010, Texas Instruments Incorporated

3. Technical Brief

3.13.2.2 WM9093 audio interface


The WM9093 is a high performance low power audio subsystem, including headphone driver and Class AB/D
earpiece/speaker driver. The Class D speaker driver support 650mV output power at 3.6V, 1%THD.
The unique dual mode charge pump architecture provides ground referenced headphone outputs removing the
requirement for external coupling capacitors. Class G technology is integrated to increase the efficiency and
extend playback time by optimizing the headphone driver supply voltages according to the volume control.
The flexible input configuration allows single ended or differential stereo inputs. Mixers allow highly flexible
routing to the outputs, A voice Bypass path is also available for low-power voice applications.
The WM9093 is controlled using a two-wire I2C interface. An integrated oscillator generates all internal clocks.
Removing the need to provide any external clock.
Separate mixer and volume controls are provided for each headphone and speaker driver. Automatic Gain
control limits the speaker output signal in order to prevent clipping. DC offset correction to less than 1mV
Guarantees a pop/click-free headphone start up.
The WM9093 is available in a 2.0mm 2.5mm 20-bump CSP package.

Figure. Detailed diagram of WM9093 audio interface

LGE Internal Use Only

- 86 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

AUDIO SUBSYSTEM
VBAT

C602

C603

33p

100n

2.2u

B5

B3
B2

CPVDD
A3
CPVSS
A4
CP
A5
CN

SPK_P
SPK_N

C617

2.2u

C618

2.2u

C619

C613

C614

0.1u

0.1u

R601

R602

EAR_L
EAR_R

20

IN3IN3+

SCL
SDA

D3
C3

A2

HPL
A1
HPR

IC601

IN2IN2+

20
R605

D2
D1

R604

47n

HPVDD

47n

C612

FB602

2.2u

B4

470n

IN1IN1+

GND

C609
C611

C2
C1

BIAS

470n

B1

SPK+
SPK-

C608

C4

HSO_R
HSO_L

FB601

C5

OUT+
D5
OUT-

SVDD

D4

C601

I2C2_SCL
I2C2_SDA
2.2u

2.2u

C631

C632

1.8V_AUDIOAMP

R610

EAR_GND

DNI

MIC Switch
VBAT

U610

MIC_P

MIC_SEL

MIC_N

5
6
9

1A

1B0

S1

1B1

2A

2B0

S2

2B1

VCC

GND

10
1
2
3

MIC1P
MIC2P
MIC1N
MIC2N

C690
2.2u

LGE Internal Use Only

- 87 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

EAR DETECTION

(Close to Connector)

Q601
1.8V_VIO

2
1
R609

R608

200K

1M

EAR_SENSE

EAR_DETECT

HOOK
1.8V_VIO

100K

R606

1.8V_VIO

U602
VIN-

5
1

VCC
VIN+

HOOK_ADC

OUT

GND

HOOK_DIG

100K

2
R607

LGE Internal Use Only

- 88 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.14 Display
LCD module is connected to Main PCB with 30-pin connector.
The LCD is controlled by MDDI Interface in OMAP3630
VBAT
3.0V_LCD_VCC_VCI
1.8V_LCD_IOVCC

FL702
1
P1
2
P2
3
P3
4
P4

CN702
30

29

28

27

26

25

24

23

22

10

21

11

20

12

19

13

18

14

17

15

16

INOUT_A2

INOUT_B3

INOUT_A3

INOUT_B4

INOUT_A4

10

G2

INOUT_B2

LCD_PWM

15pF

LCD_BL_OUT4
LCD_BL_OUT3
LCD_BL_OUT2
LCD_BL_OUT1

C720

C715

C714

4.7u

2.2u

2.2u

P5 5

INOUT_A1

LCD_BL_OUT8
LCD_BL_OUT7
LCD_BL_OUT6
LCD_BL_OUT5

P3

P1

P4

P2

1
2

LCD_MIPI_CLK_P
LCD_MIPI_CLK_N

P6

INOUT_B1

G1

LCD_TE
LCD_CS
LCD_RESET_N

FL701

LCD_MIPI_D0_P
LCD_MIPI_D0_N
LCD_MIPI_D1_P
LCD_MIPI_D1_N

9
G1
10
G2

LCD_MAKER_ID

5
P5
6
P6
7
P7
8
P8

FL703

Figure. Schematic of LCD connector (Main Board)

LGE Internal Use Only

- 89 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

Pin No.

Signal

I/O

Function

Drivers Signal Name

MAKER_ID(Low)

Maker ID(Low; GND level)

IOVcc

IO Power (1.8V)

IOVCI

PWMO

PWM output pin of Active Back Light control processir

PWMO

TE

Tearing Effect output pin

CSX

Chip Select pin Note(1)

CSX

RESB

Reset Input pin

RESB

Vci

Analog power supply for reference (2.8V)

SVCI

Vcc

Analog power supply for Analog Circuit (2.8V)

AVCI

NC

NC

10

LEDC_4

GND for LED

11

LEDC_3

GND for LED

12

LEDC_2

GND for LED

13

LEDC_1

GND for LED

14

LED_A

Power supply for LED

15

LED_A

Power supply for LED

16

GND

GND

17

LEDC_5

GND for LED

18

LEDC_6

GND for LED

19

LEDC_7

GND for LED

20

LEDC_8

GND for LED

21

GND

GND

22

MCLK_M

Negative MIPI Clock Input

MCLK_M

23

MCLK_P

Positive MIPI Clock Input

MCLK_P

24

GND

GND

25

MDATA1_M

I/O

Negative MIPI Data2 Input / Output

MDATA1_M

26

MDATA1_P

I/O

Positive MIPI Data2 Input / Output

MDATA1_P

27

GND

28

MDATA0_M

I/O

Negative MIPI Data1 Input / Output

MDATA0_M

29

MDATA0_P

I/O

Positive MIPI Data1 Input / Output

MDATA0_P

30

GND

TE

GND

GND

Table. Interface between LCD Module and MAIN Board

LGE Internal Use Only

- 90 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

Part Name

TX10D10VM0EAA

Module Dimensions

55.54 (W)mm x 95.8 (H)mm x 1.45 (T)mm


(Excluding I/F-FPC and electronic components)

Active Area Dimensions

51.84 (W)mm x 86.4 (H)mm

Pixel pitch

0.108 (W)mm x 0.108(H)mm

Resolution

480 x3 (R,G,B) (W) x 800(H) dots

Color Pixel Arrangement

RGB Vertical Stripe

Display Mode

Transmissive Type, Normally Black Mode, In-Plane Switching Mode

Number of Colors

16,777,216 Colors / 262,144 Colors

Viewing Direction

10

Backlight

Light Emitting Diode (LED), 8 LEDs are parallel connection Backlight


current: 20mA / LED (typ)

11

Weight

12.6g(typ)

12

Power supply Voltage

Vcc=2.8+/-0.1V, Vci=2.8+/-0.1V

13

Interface I/O power supply


Note(1)

IOVcc=1.8+/-0.1V
The same voltage as H level of a customers interface signal must be
supplied to IOVcc.

14

LCD Driver IC

D51E6TA8851A (Source and Power IC: MagnaChip Semiconductor)

15

Interface

MIPI-DSI Command mode (2-Lane)

Note(1): IOVcc is the reference voltage for adjusting the I/O signal level of TA8851A.
IOVcc voltage must be determined according to a customers system.
Table. LCD Module general data

LGE Internal Use Only

- 91 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

7BLOCK DIAGRAM

RGB

G1
LCD

480 x RGB (H) x 800 (V)

G400
Scan direction

G800
S1440

LED Backlight

S1
TA8851A

(8LEDs in parallel)

CN3

CN1

CN2

Notes (1)
LED (Anode: 2,Cathode: 8)
VCC,VCI
IOVCC
PWM0

10
2

MAKERID
TE
GND
MDATAO_P, MDATAO_M
MDATAI_P,MDATAI_M
MCLK_P,MCLK_M
RESB,CSX

5
4

Notes (1) Please connect the resistor (R=200 ohm) for current control between LED (cathode)
and GND in the customer's system.
ILED = 160 mA

Hitachi Displays, Ltd.

LGE Internal Use Only

Date

AN

20 mA

20 mA

20 mA

20 mA

20 mA

20 mA

20 mA

20 mA

CA1
CA2
CA3
CA4
CA5
CA6
CA7
CA8

LCD Sh.
Module
block2607
diagram
Nov. Table.
04, 2010
3284PS
- TX10D10VM0EAA-1
No.
- 92 -

Page

7-1/1

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.15
3.14 Main (5M pixels) & Sub (2M pixels) Camera
LG-P970 supports two cameras. One is 5M pixels, main camera, the other is 2M pixels, sub camera used VT & self
camera scene.
1.2V_5M_VDIG
FL601

1.8V_5M_VIO
CN602

FL602
5
P5
6
P6
7
P7
8
P8
G2
10
G1
9

5M_MIPI_DATA0_N
5M_MIPI_DATA0_P
5M_MIPI_DATA1_N
5M_MIPI_DATA1_P

1
P1
2
P2
3
P3
4
P4

24

23

22

21

20

19

18

17

16

10

15

11

14

12

13

2.8V_5M_VCM

I2C3_SDA
I2C3_SCL

C620

C621

C622

4.7u

1u

0.1u

ZD601

C624

C623

0.1u

0.1u

5M_RESET_N
5M_CAM_VCM_EN

0.1u

G2
10
G1
9

5M_MCLK

2.7V_5M_VANA

1
P1
2
P2
3
P3
4
P4

C625

5
P5
6
P6
7
P7
8
P8

5M_MIPI_CLK_N
5M_MIPI_CLK_P

Figure. Main 8M Camera Schematic

VT_CAM_DRV_2.8V VT_CAM_IO_1.8V

VT_DATA[7]
VT_DATA[6]
VT_DATA[5]
VT_DATA[4]

6
7
8
9

CN103

24

23

22

21

20

19

I2C3_SCL

FL102

G1

G2

10

7.5pF

I2C3_SDA

INOUT_B4

INOUT_A4

INOUT_B3

INOUT_A3

INOUT_B2

INOUT_A2

INOUT_B1

INOUT_A1

4
3
2

VT_VSYNC

VT_DATA[3]
VT_DATA[2]
VT_DATA[1]
VT_DATA[0]

6
7
8
9

INOUT_B4

INOUT_A4

INOUT_B3

INOUT_A3

INOUT_B2

INOUT_A2

INOUT_B1

INOUT_A1

18

17

16

10

15

11

14

12

13

VT_MCLK

FL103

G1

G2

10

7.5pF

VT_HSYNC

VT_PCLK
4
3
2
1

VT_RESET_N
VT_CAM_PWDN

1u

1u

C101

C102

Figure. Sub 2M Camera Schematic


LGE Internal Use Only

- 93 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

VBAT

2.2u

D1

2.2u

10u

FB

LDO1

VIN1

VIN2

VINB

VBATT

E4
D2
E3
D4

B3
C4
C3
D3
E2

CAM_SUBPM_EN

GNDB

IRQ_N

U601

SDA
SCL

LDO3

A3

A1

DVS
EN
LDO4

DEFSEL
IDSEL

LDO5

C1

E1

C626

C627

C628

C629

C630

1u

1u

1u

1u

1u

B1

GND

B2
C2

B4

SW
LDO2

I2C3_SDA
I2C3_SCL

2.7V_5M_VANA

C607

2.2u

A2

C606

2.2u

1.8V_5M_VIO

L601

C605

10u

2.8V_5M_VCM

C610

C604

A4

1.2V_5M_VDIG

3.0V_MOTOR

3.0V_MMC

VBAT line minimum 0.6mm

Figure. 5M Camera PMIC Schematic

VDAC_IN
VAUX12S_IN
VPLLA3R_IN
VINT_IN
VSDI_CSI_OUT
VPLL1_OUT
VDAC_OUT
VSIM_OUT
VMMC2_OUT
VMMC1_OUT
VAUX4_OUT
VAUX3_OUT
VAUX2_OUT
VAUX1_OUT
VINTUSB1P8_OUT
VINTUSB1P5_OUT
VUSB_3P1
VINTDIG_OUT
VRTC_OUT
VINTANA2_OUT_02
VINTANA2_OUT_01
VINTANA1_OUT

K1
L1
H15
K15
J15

1.8V_AUDIOAMP
1.8V_PLL1
1.8V_MOTION_VIO
1.8V_WLAN
1.8V_MMC_EN
VT_CAM_DRV_2.8V
1.8V_CSI2
VT_CAM_IO_1.8V
3.0V_MOTION
2.8V_PROXI

H14
L2
K2
A4
C2
B3
G16
M3
M2
P10

C461

1u

C451 C452 C5019 C454 C5018 C456 C457 C5017 C459

C460

P8

C462

1u

1u

1u

L16

C463

1u

K16

C482

1u

B6

C483

1u

C484

1u

1u

1u

1u

1u

1u

1u

1u

1u

P9

3.1V_VUSB

J2
H3

C485
1u

Figure. 5M Camera PMIC Schematic

LGE Internal Use Only

- 94 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

5M_CLK
2.7v_5M_vANA

sw_^YW

\t

1.8v_5M_vio
2.8v_5M_vCM

1.2v_5M_vDiG

Osnp{P

MiPi_CLK
MiPi_DAtA
reSet_N
i2C3_SDA
i2C3_SCL

i2C3_SDA

vthwZ]ZW

i2C3_SCL

{~s\WZ[

vt_CAM_Drv_2.8v
vt_CAM_io_1.8v

Yt
j
Osnp{P

vt_MCLK
vt_PCLK
vt_DAtA[0:7]
vt_vSYNC
vt_HSYNC

Figure. Camera Block diagram

LGE Internal Use Only

- 95 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.16 Vibrator
The ERM motor, also distinguished as Q-coin Motor creates a certain kind of vibration controlled and defined
uniquely by LG Electronics. The followings are the certain examples of conditions that the users may feel the
vibration from the phone: Incoming Call (in Silence Mode), Google Keys Pressed, Turn-on / -off, Dialing, and Text
Messaging.

3.0V_MOTOR

Q-Motor

DNI

R510

Moter Driver

U504

VDD

GAIN

VDN
NC1

GND

MODE

NC2

PWM

VIB_P

7
6
5

VIB_N
C517
2.2u

R516

11

VDP

NC3

EN

10

VIBE_EN
VIBE_PWM

VB101

VIB_P
VIB_N

1
2

SJMY0007118

C519

1%

10n

DNI

R517

Figure 1 Vibrator Schematic

LGE Internal Use Only

- 96 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.17 Compass Sensor


If a customer buy the application SW, The Sensor provides user with a Electric Compass function.

1.8V_MOTION_VIO

3.0V_MOTION

COM_INT

U105 (AK8975C, SUB-FPCB) IC is interfaced to OMAP3630(U301) using I2C interface.

C116

C1

VSS

TST2

C2

C3

DRDY

TST6

VDD

B3

B1

RSV

SCL/SK

TST1

B4

3.0V_MOTION

U105

SDA/SI

A1

SO

C117
0.1u

A4

D4

I2C3_SDA

CAD1

A3

D2

CAD0

CSB

D1

A2

R117

VID

C4

10K

0.1u

1.8V_MOTION_VIO
I2C3_SCL

C119
0.1u

Figure. Compass Sensor Schematic


3-axis
Hall sensor
Chopper SW

Integrator & ADC

Per- AMP

MUX

OSC1
HE-Drive

SCL/SK
Interface,
Logic
& Register
Timing Control

CSB
SO

Voltage Reference

Magnetic source

SDA/SI

DRDY

POR
FUSE ROM

CAD0

CAD1

TST1

TST2

RSV

TST6

VSS

VDD

VID

Figure. Compass Sensor Block Diagram


LGE Internal Use Only

- 97 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.18 Motion Sensor


The motion sensor can sense gravity & accelerated motion. Therefore according to the direction of cell phone,
the phone screen is rotated automatically. And the motion sensor is connected with a gyro sensor to
supplement each data.
U104(SUB_FPCB) : KXTF9 IC is interfaced to OMAP3630(U301) using I2C interface.

3.0V_MOTION

C123

1.8V_MOTION_VIO

GND
DNC2

DNC3
INT

DNC1

U104

IO_VDD

DNC4
SCL

MOTION_INT

IME_CL

SDA

VDD

0.1u

10

C118
0.1u

IME_DA

Figure. Motion Sensor Schematic

X
Senser

Y
Senser

A/D

Charge Amp

Z
Senser
Vdd 5
Digital
Filter

I2C
Digital Engine

IO Vdd 1
GND 4
7

10

G
Figure. Motion Sensor Block Diagram

LGE Internal Use Only

- 98 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.19 Gyro Sensor


The gyro sensor(MPU3050) can sense angular velocity not gravity and accelerated motion. The gyro sensor
applied in LG- P970 can detect 3-axis rotation force sensing X,Y and Z angular velocity. And the gyro sensor
data is supplemented by the motion sensor data. It make possible user to development application SW using
gyro sensor data like that motion games.
U103(SUB_FPCB): MPU3050 IC is interfaced to OMAP3630(U301) using I2C interface.
1.8V_MOTION_VIO

CLKIN

NC2

NC3

IME_DA

NC 1

CLKOUT
CPOUT
RESV1

25
24

I2C3_SDA
I2C3_SCL

23
22
21
20
19
C115
2.2n

18

17

GND

RESV2

INT
NC8

FSYNC

13

3.0V_MOTION

REGOUT

VD D

GYRO_INT_N

12

SCL

U103

NC7

11

SDA

AD0

16

10

VLOGIC

15

NC4

6
0.1u

NC6

8
C121

NC9

IME_CL

NC5

IME_CL

14

0.1u

IME_DA
C122

C120
0.1u

Figure. Gyro Sensor Schematic

Figure. Gyro Sensor Block Diagram

LGE Internal Use Only

- 99 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.20 Proximity Sensor


When the call is connected and the object close to the proximity sensor,
LCD backlight and Touch screen are disable operation automatically.
U102(VT_CAM FPCB) : GP2AP002S00F IC used I2C interface to OMAP3630

PROXI_VCC

1.8V_VIO

PROXI_LEDA

U102
1

PROX_OUT
C106

C107

4.7u

0.1u

LEDA

SCL

LEDC

SDA

VCC

VIO

VOUT

GND

I2C3_SCL

I2C3_SDA

C105
1u

Figure. Proximity Sensor Schematic

Figure. Proximity Sensor Block Diagram


G

LGE Internal Use Only

- 100 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.21 Illumination Sensor


Illumination Sensor adjusts LCD backlight current by detecting the surrounding brightness.
If user checks the automatic brightness menu, LCD backlight current adjusting is to be enable automatically.
U101(VT_CAM FPCB) : BH1621 IC interface to AAT2870

U101
5

VCC
GND1

GC2

GC1

LSENSOR_BIAS

2
3

IOUT
GND2

LSENSOR_SENS

Figure. Illumination Sensor Schematic

Figure. Illumination Sensor Block Diagram


G

LGE Internal Use Only

- 101 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.22 Touch Module


Touch module is connected to Main PCB with 10-pin connector.
The Touch module is controlled by I2C Interface in OMAP3630

3.0V_TOUCH

1.8V_TOUCH

R703

10K

1.8V_TOUCH

CN701

10

1
2

5
C705

I2C2_TOUCH_SDA

0.1u

TOUCH_INT_N

C707

ZD703

ZD702

ZD701

0.1u

I2C2_TOUCH_SCL

Figure. Schematic of Touch connector (Main Board)

Pin No.

Signal

Description

1.8V TOUCH

Power Supply for Interface I/O

NC

GND

GND

GND

I2C2_TOUCH_SCL

I2C Clock

GND

I2C2_TOUCH_SDA

I2C Data

3.0V TOUCH

Power Supply for Driver IC

10

TOUCH_INT_N

Interrupt

Table. Interface between Touch Module and MAIN Board

LGE Internal Use Only

- 102 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.23 Main Features


3.23.1 LG-P970 Main Features
- DOP Type design
- UMTS 2100 + UMTS 1900 + UMTS900+ GSM 900 + DCS 1800 + PCS 1900 + GSM850 based
GSM/GPRS/EDGE/UMTS(WCDMA, HSDPA, HSUPA)
- HSDPA 7.2Mbps, HSUPA 5.7Mbps
- Main LCD(WVGA)
TFT Main LCD(4.0, 480X800)
- Capacitive/Electrostatic Touch Window
- 5M AF Camera, 2 M secondary camera
- 3.5Phi Stereo Headset & Speaker phone
- Mobile XMF Mobile DLS / Scaleable Polyphony
- MP3/AMR/AAC/AAC/WAV/WMA decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth and HS-USB
- Supports WLAN(802.11b, 802.11g, 802.11n)
- Supports FM Radio
- 1500 mAh (Li-Ion)

LGE Internal Use Only

- 103 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.23.2 LG-P970 Main component (BOTTOM)

Maker P/N: BCM43291SKUBG


Function: Wifi_BT_FM CHIP

Maker P/N: KT32251L38400


Function: TCXO 38.4 Mhz
Maker P/N: PMB9801
Function: Call Processor

Maker P/N: TWL5034


Function: OMAP Power chip

Maker P/N: H8BCS0Q0MR-46M


Function: CP MEMORY

Maker P/N: SDIN502-2G


Function: EMMC-MEMORY

Maker P/N: BD2812


Function: RGB LED DRIVER
Maker P/N: OMAP 3630
Function: Application Processor

LGE Internal Use Only

- 104 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3. Technical Brief

3.23.2 LG-P970 Main component (TOP)

Maker P/N: MAX14526


Function: MUIC

Maker P/N: BGA749N16


Function: LNA
Maker P/N: ACMD7606
Function: Filter

Maker P/N: LP8720


Function: SUB PMIC CAM POWER

Maker P/N: ACPM5202


Function: Power AMP

Maker P/N: PMB5703


Function: Transceiver

Maker P/N: BCM4751


Function: GPS Chip

Maker P/N: ISA1000


Function: LCD B/L charge pump

Maker P/N: SKY77529


Function: QUAD TX Module
Maker P/N: RT9524
Function: Charging IC

Maker P/N: ACPM5281-TR1G


Function: 3G Dual PAM

Maker P/N: MAX17043


Function: Fuel gauge

LGE Internal Use Only

- 105 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING
4. Trouble Shooting

4.1 RF Component

FL104

X101

FL105
FL103
U101
RF Transceiver

FL102
FL101
FL107
FL109

U106
W LNA

FL110

U103
WB 2

FL106

PAM
U105
WB 1/8
PAM

FL108

U102

U104
FEM+GSM PAM

FL111

RF component (WCDMA / GSM)

Reference

Description

Reference

Description

U101
U104
U105
U103
FL111
FL107
FL109
FL110
FL106

PMB5703(Transceiver)
FEM + GSM/EDGE PAM Module
WCDMA Dual (I,VIII) PAM
WCDMA Single (II) PAM
WCDMA (I) TX SAW Filter
WCDMA (II) TX SAW Filter
WCDMA (VIII) TX SAW Filter
WCDMA (I) Duplexer
WCDMA (II) Duplexer

FL108
FL101
FL102
FL103
FL104
FL105
U106
X101
U102

WCDMA (VIII) Duplexer


DCS RX SAW Filter
W1900/PCS RX SAW Filter
W2100 RX SAW Filter
GSM850 RX SAW Filter
W900/EGSM RX SAW Filter
WCDMA (I,II,VIII) LNA
TC-VCXO(26MHz)
WCDMA Power Detector

LGE Internal Use Only

- 106 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.2 SIGNAL PATH


WCDMA / GSM Tx PATH

WCDMA 2100 TX PATH, WCDMA 1900 TX PATH, WCDMA 900 TX PATH


GSM Low Band Tx PATH, GSM Hign Band Tx PATH

LGE Internal Use Only

- 107 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

WCDMA / GSM Rx PATH

WCDMA 2100 RX PATH, WCDMA 1900/PCS RX PATH, WCDMA 900/EGSM TX PATH


DCS Band Rx PATH, GSM 850 Band Rx PATH

LGE Internal Use Only

- 108 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.3 Checking TCXO Block


The output frequency (26MHz) of TCXO (X101) is used as the reference one of PMB5703

LGE Internal Use Only

- 109 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

Check TP1
VCC of TCXO

2.45 VCC 2.6V

No

Check the PMB5703

Yes
Check TP2

26MHz signal

No

Check soldering and components

Yes
TCXO OK

LGE Internal Use Only

- 110 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.4 Checking GSM TX Module(GSM PAM + FEM) Block

VBATT(TP1)

VBAT

tP1

TP1
C151

C152

10n

22p

C170

C171

1.8p

1.8p

23

PA_POW_DET

22

SS
VBAT

21

DRW

20

CLK

19

VSPI
C178
1u

PA_RAMP

C179

0.1u

18
17

C180

16

15p

15
14

15p

ANT

GND_LB

GND1

DET

RX_L1

SS

GND2

DRW

RXTX_L2

U104

CLK
VSPI

GND3
RXTX_H

GND_SPI

GND4

VCMOS

RXTX_M1

VRAMP

GND5

GND_HB
TX_HB

RX_M2

27

DCS_PCS_TX

C185

TX_LB

RX_M3

1
2
3

RX_850

4
5
6
7
8
9
10
11
12

RX_1900
RX_1800

13

24

G_SLUG

25

1.2n

V_Q3_HB

L133

GSM_TX

V_Q3_LB

26

C150
22u

Schematic of the TX Module

LGE Internal Use Only

- 111 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

D0

Band Select

D10

D9

Sensor Configuration

Low band

Current sensor FB Off

High bond

Current sensor FB Off

D1

Mode Select

Current sensor FB Off

GMSK

Current sensor FB Off

SPSK

D2

Tx Enable

D15

FE Bcost Comenter

PA off

Off

PA On

On

D5

D4

D3

Current Sensor

D14

D13

D12

D11

FE Status

0.6A

Off

1.7A

0.7A

Tx-M GMSK ANT1

1.8A

0.8A

Tx-L GMSK ANT1

1.9A

0.9A

Reserved

2.0A

1.0A

Rx-L1

2.1A

1.1A

Rx-M2

2.2A

1.2A

Rx-M3

2.3A

1.3A

Reserved

D8

D7

D6

Not Assigned to Specifiic Runction

Rx/Tx-L2

Defaut

Rx/Tx-M1

Rx/Tx-H

Reserved

Reserved

Tx-M GMSK ANT2

Tx-L GMSK ANT2

Reserved

Mode-GMSDK

Mode-SPSK

1.6A

LGE Internal Use Only

- 112 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

Checking Switch Block Power Source

PAM Vbatt of Check TP1

2.9V < VCC < 5V

No
Replace the GSM Module(U104)

Yes
Check the Logic in each mode

LGE Internal Use Only

- 113 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.5 Checking WCDMA Block


START

1. Check TCXO 26MHz

2. Check FEM Block


Refer to 1.4

3. Check RF Tx Level

4. Check PAM Block


Refer to 1.5.4

5. Check RF Level

6. Ro-download SW & Cal.

LGE Internal Use Only

- 114 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.5.1Checking TCXO Block


Refer to 1.3

4.5.2. Checking FEM Block


Refer to 1.4

4.5.3. Checking RF TX Level

TP2

TP3

TP4

TP1

Test Point (TX Level)

LGE Internal Use Only

- 115 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

ENWY0003901(Hirose)
SW101

SW102

G1
G2

ANT

ANT

COMMON
G3

C142

TP1

33p

G4

L108

L107

DNI

27n

VBAT

C151

C152

10n

22p

C170

C171

1.8p

1.8p

23

PA_POW_DET

22

SS
VBAT

21

DRW

20

CLK

19

VSPI
C178

C179

1u

PA_RAMP

18

0.1u

17
C180

16

15p

15
C185

ANT

GND_LB

GND1

DET

RX_L1

SS

GND2

DRW

RXTX_L2

U104

CLK

GND3

VSPI

RXTX_H

GND_SPI

GND4

VCMOS

RXTX_M1

VRAMP

GND5

GND_HB
TX_HB

RX_M2

27

DCS_PCS_TX

14

15p

TX_LB

V_Q3_HB

24

RX_M3

1
2
3

RX_850

4
5
6
7
8
9
10
11

RX_1900

12

RX_1800

13

25

1.2n

G_SLUG

L133

GSM_TX

V_Q3_LB

26

C150
22u

VBAT

Band2

C148

L117

C146

C147

1n

2.2u

100p

U103

FL106

1.5n

ANT

TP3

RX

33p

TX

L109
8.2n

100p

GND1

GND6

8.2n

GND2

GND5

C157

GND3

GND4

11
10
9
L110
L122

CPL

7
6

DNI

PGND
VCC2

VCC1

RFOUT

RFIN

ISO

VBP

GND

VMODE

CPL

VEN

TP4

FL107 3

1
C154

2
3

33p

PA_MODE
PA_MODE2
PA_EN_1900

4
5

L130

2.7n

G3
1
OUT IN
G2 G1
5 2

L131

2.7n

TX3G_M1_1900
C158
DNI

C107

100p
(0603)
100p
(0603)
100p
(0603)

TP2

C145

DNI

1880MHz

C162

C160

C161

1880,1960MHz

VBAT

ANT

RX
TX

C131

2
4
5

DNI

GND1
GND2
GND3

GND4
GND5
GND6

1
3

TP3
L129

1n

2.2u

14
13

7
8
9

12
C174

L124

0.5p

100p

11

DNI

10
9

CPL

RFIN_LOW

GND3
VCC2
GND2

VMODE

U105

RFOUT_HI
GND1
CPL

VBP
VCC1
VEN_LOW
VEN_HI
RFIN_HI

15

897.5 MHz,942.5 MHz

RFOUT_LOW

Band1
27p L114

TP2

ANT

RX
TX

L123
10n

33p

4
5

OUT

IN

C173

56p

G3 G2 G1

C177
DNI

PA_EN_900
PA_EN_2100

4
2.7n

PA_MODE2
PA_MODE

2
4
5

GND1
GND2
GND3

GND4
GND5
GND6

1
3
7
8
9

TP3
L125

DNI

897.5 MHz

L115
C187

33p

FL111 3
4

2.7n

1.5n

G3
1
OUT IN
G2 G1
5 2

C188

1p

DNI

C104

10p

TP4

TX3G_H_2100

C192

C193
C194

TX3G_L_900

C176

FL110

2.2n

C181

C169

C172

TP4

FL109

L113

1n

C183

TP2

3.9n

C167

C184

L119

C165

100p
(0603)
100p
(0603)
100p
(0603)
100p
(0603)

33p

C164

C182

C153

FL108

PGND

Band8

1950MHz

DNI

DNI

1950MHz, 2140MHz

For testing, Max power output is needed.

LGE Internal Use Only

- 116 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

Check Power Level

Check TP1 Over 21dBm?

Yes

RF Tx Level is OK

No

Check TP2 Over 21dBm?

Yes

Check TX Module

No

Check TP3 Over 21dBm?

Yes

Check Duplexer

No

Check TP4 Over 7dBm?

Yes

Check RTR6285

No
Check PAM Block
Refer to 1.5.4
PMB5703 Maximum output Power = 7 dBm
PMB5703 minimum output Power = -73 dBm

LGE Internal Use Only

- 117 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.5.4 Checking PAM Block


PAM control signal
W_PA_EN (W_900_PA_EN(C182),W_1900_PA_EN(C160) W_2100_PA_EN(C181) : PAM Enable
W_PA_MODE1,2 : PAM Gain Control
W_PA_EN must be HIGH (over 2.6V)
PAM IN/OUT Signal
When PAM is under the operation of high power mode
(WCDW_PA_Mode(C162,C183):Low, WCDMA_PA_Mode2(C161,C184):Low),
PAM OUT power must be over 21 dBm
PAM IN power must be under 10 dBm

LGE Internal Use Only

- 118 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

TP3

TP2

TP1

TP3
C145

C146

C147

1n

2.2u

100p

TP2

TP1

VBAT

U103
11

TP3

10
9
100p

L110
L122

8.2n

CPL

7
6

DNI

VCC2

VCC1

RFOUT

RFIN

ISO

VBP

GND

VMODE

CPL

VEN

TP2 TP2

2
3
4
5

33p

L130

2.7n

3
G3
1
OUT IN
G2 G1
5 2

L131

2.7n

TX3G_M1_1900

C158
DNI

C107
DNI

1880MHz

C162

C160

C161

TP1

FL107
C154

PA_MODE
PA_MODE2
PA_EN_1900

100p
(0603)
100p
(0603)
100p
(0603)

C157

PGND

VBAT

100p

13
12
C174
0.5p

L124

11

DNI

10
9

RFIN_LOW

GND3

VMODE

VCC2

VBP

GND2

U105

RFOUT_HI
GND1
CPL

TP3

L125

VCC1
VEN_LOW
VEN_HI
RFIN_HI

TP2

2
3

TP2

4
5

FL109

L113
C172

33p

4
2.7n

PA_MODE2
PA_MODE

OUT

IN

LGE Internal Use Only

TX3G_L_900

C176

33p

DNI

FL111
4

2.7n

3
G3
1
OUT IN
G2 G1
5 2

C193
1p

TP1

56p

897.5 MHz

L115
C187

1.5n

C194

C173

G3 G2 G1

C177
DNI

PA_EN_900
PA_EN_2100

C181

15

CPL

RFOUT_LOW

C183

14

C184

1n

C167

C182

2.2u

100p
(0603)
100p
(0603)
100p
(0603)
100p
(0603)

L129

C165

1n

PGND

TP3

C164

DNI

C104

1950MHz

C188

TP1

10p

TX3G_H_2100

C192
DNI

DNI

- 119 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

Set the phone Tx is On and


AGC is 700

Check TP3 Over 21dBm?

Yes

RF Tx Level is OK

No

Check TP2 PA_MODE2 0.5V

Yes

Check PMB5703

No

Check TP1 Over 10 dBm?

Yes

Check PMB5703

No
Change the board

LGE Internal Use Only

- 120 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.5.5 Checking RF Rx Level

TP3

TP4

TP5

Bias

TP2

TP1

Test Point (RF Rx Level)


ENWY0003901(Hirose)
SW101

SW102

G1
G2

ANT

ANT

COMMON
G3
3

TP1
TP1

C142

33p

G4

L108

L107

DNI

27n

VBAT

C151

C152

10n

22p

C170

C171

1.8p

1.8p

23

PA_POW_DET

22

SS
VBAT

21

DRW

20

CLK

19

VSPI
C178
1u

PA_RAMP

C179

0.1u

18
17

C180

16

15p

15
14

15p

LGE Internal Use Only

- 121 -

ANT

GND_LB

GND1

DET

RX_L1

SS

GND2

DRW

RXTX_L2

U104

CLK
VSPI
GND_SPI

GND4

VCMOS

RXTX_M1

VRAMP

GND5

GND_HB
TX_HB

GND3
RXTX_H

RX_M2

27

DCS_PCS_TX

C185

TX_LB

V_Q3_HB

24

RX_M3

1
2
3

RX_850

4
5
6
7
8
9
10
11
12

RX_1900
RX_1800

13

25

1.2n

G_SLUG

L133

GSM_TX

V_Q3_LB

26

C150
22u

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

Band2

TP2

C148

FL106

L117

1.5n

ANT

RX

33p
TX

L109
8.2n

GND1

GND6

GND2

GND5

GND3

GND4

1880,1960MHz

C153

33p

Band8

TP2

L119

3.9n

FL108
6

ANT

RX
TX

C131

2
4
5

DNI

1
3
7

GND1
GND2
GND3

GND4
8
GND5
9
GND6

897.5 MHz,942.5 MHz

Band1

TP2

C169

27p

L114

FL110

2.2n

ANT

RX
TX

L123

2
4
5

10n

1
3
7

GND1
GND2
GND3

GND4
8
GND5
9
GND6

1950MHz, 2140MHz

C101

DCS

2p

RX_1800_M1X

2 3
C102

RX_1800

C103

33p

47p

G1 O1
IN
G2 O2

5 4

L126

L101

FL101

5.6n
C105

2p

C106

2p

RX_1800_M1

8.2n

1842.5MHz

Band2 & PCS

TP4

L127

RX_1900

C5027

DNI

RFOUTM

C5029

33p

C108

2.4n

FL102
47p

TP5

O2
3
IN G1G2 O1
2 5

C110

RX_1900_M2

L102
5.6n
C112

2p

RX_1900_M2X

1p

1960MHz

Band1

C115

RFOUTH

47p

TP4

C116

C114

8.2p

TP5

2 3
47p

G1 O1
IN
G2 O2

5 4

C117

RX_2100_HX

L103

FL103

6.8n

C118

8.2p

C119

8.2p

RX_2100_H

DNI
2140MHz

GSM850

C122

RX_850

22p

L128

6.8n

RX_850_L2X

2 3
1

G1 O1
IN
G2 O2

L104

FL104

5 4
C126

12n

C125

8.2p

C130

8.2p

RX_850_L2

1.5p

881.5MHz

Band8/EGSM

RFOUTL

L106

TP4

4.7n

L132

TP5

2 3
3.3n

C132

G1 O1
IN
G2 O2

5 4

RX_900_L1X

L105
15n

FL105
C133

8.2p

RX_900_L1

DNI
942.5MHz

LGE Internal Use Only

- 122 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

2.85V_RF1

C197

8.2p

2.7p

C196

Bias
TP3

L118

C198

C199

10n

10p

2.7n

LNA_CTRL3

18p

C1002

3.9p

C1001

C5026

DNI

10
11
12
13

RFIN2
RFIN1

VCC

RFOUT1/4

RFGND1/2
RFIN4

RFOUT5
NC

14

L120
2.7n

RREF
RFOUT2

U106
RFIN5

TP3

VON

VGS

9
33p

VEN1

0
C5028

VEN2

R109

15

LNA_CTRL4

RFGND4

DNI

GND

5
4
3
2
1

R106

27K
(1%)

RFOUTM
RFOUTH
RFOUTL

17

16

R110

L121

LNA_CTRL2

18p

C1004

2.7p

C1003

LNA_CTRL1

TP3

8.2n

LGE Internal Use Only

- 123 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

Set the phone Rx is On

Check BIAS over 2.85V

No

Check bias block soldering

Yes

Check TP1 Signal exist?

No

Check RF Switch (M/S)

Yes

Check TP2 Signal exist?

No

Check TX Module Refer 1.4

Yes

Check TP3 Signal exist?

No

Check Duplexer

Yes

Check TP4 Signal exist?

No

Check LNA

Yes

Check TP5 Signal exist?

No

Check PMB5703 and Rx SAW filter

Yes
Change the board

LGE Internal Use Only

- 124 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.6 Checking GSM Block

Start

1. Check TCXO Block

2. Check ANT.SW Module

3. Check RF TRX Level

4. Ro-download SW & Cal.

LGE Internal Use Only

- 125 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

1
3
2

4.6.1 Checking TCXO Block


Refer to 1.3

4.6.2 Checking FEM Block


Refer to 1.4

4.6.3 Checking RF TX level

TP1
TP3

LGE Internal Use Only

- 126 -

TP2

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3
2 4. TROUBLE SHOOTING

4.6.1 Checking TCXO Block


Refer to 1.3

4.6.2 Checking FEM Block


Refer to 1.4

4.6.3 Checking RF TX level

TP1
TP3

TP2

LGE Internal Use Only

- 127 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

ENWY0003901(Hirose)
SW101

G2

TP1

SW102

G1
ANT

ANT

COMMON
G3

C142

33p

G4

L108

L107

DNI

27n

VBAT

C151

C152

10n

22p

25

1.2n

24
C170

C171

1.8p

1.8p

23

PA_POW_DET

22

SS
VBAT

21

DRW

20

CLK

19

VSPI
C178
1u

PA_RAMP

C179

0.1u

18
17

C180

16

15p

15

LGE Internal Use Only

C185

14

15p

TP3

- 128 -

ANT

GND_LB

GND1

DET

RX_L1

SS

GND2

DRW

RXTX_L2

U104

CLK
VSPI

GND3
RXTX_H

GND_SPI

GND4

VCMOS

RXTX_M1

VRAMP

GND5

GND_HB
TX_HB

RX_M2

27

DCS_PCS_TX

TX_LB

V_Q3_HB

L133

RX_M3

1
2
3

RX_850

4
5
6
7
8
9
10
11
12

RX_1900
RX_1800

13

TP2

G_SLUG

GSM_TX

V_Q3_LB

26

C150
22u

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

Schematic of GSM/DCS/PCS Tx Block

START

Check TCXO Block Refer to 1.3


No
Check TP1
If GSM over 31 dBm?
If DCS/PCS over 28 dBm?

Yes

GSM/DCS/PCS Tx is OK
Check other part

No
Check TP2, 3
If GSM(TP2) under 7 dBm?
If DCS/PCS(TP3) over7 dBm?

Yes

Check ANT SW Block (ASM+EDGR PAM)


Refer to 1.4

No

Check PMB5703 & PAD

No Problem
Check soldering and components

Still exist Problem


Change the board

LGE Internal Use Only

- 129 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.6.4 Checking RF Rx Block

TP2
TP1

ENWY0003901(Hirose)

TP1

SW101

SW102

G1
G2

ANT

ANT

COMMON
G3
3

TP1

C142

33p

G4

L108

L107

DNI

27n

VBAT

C151

C152

10n

22p

C170

C171

1.8p

1.8p

23

PA_POW_DET

22

SS
VBAT

21

DRW

20

CLK

19

VSPI
C178
1u

PA_RAMP

C179

0.1u

18
17

C180

16

15p

15
14

15p

LGE Internal Use Only

- 130 -

ANT

GND_LB

GND1

DET

RX_L1

SS

GND2

DRW

RXTX_L2

U104

CLK
VSPI

GND3
RXTX_H

GND_SPI

GND4

VCMOS

RXTX_M1

VRAMP

GND5

GND_HB
TX_HB

RX_M2

27

DCS_PCS_TX

C185

TX_LB

V_Q3_HB

24

RX_M3

1
2
3

RX_850

4
5
6
7
8
9
10
11
12

RX_1900
RX_1800

13

25

1.2n

G_SLUG

L133

GSM_TX

V_Q3_LB

26

C150
22u

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

TP1
C101

DCS

2p

RX_1800_M1X

2 3
C102

RX_1800

C103

33p

47p

G1 O1
IN
G2 O2

L101

FL101

5.6n

5 4

L126

C105

2p

C106

2p

RX_1800_M1

8.2n

1842.5MHz

FL102

Band2 & PCS

L127

RX_1900

C5027

DNI

RFOUTM

C5029

33p

C108

2.4n

47p

2 5

C110

RX_1900_M2

O2
3
IN G1G2 O1

L102
5.6n
C112

2p

RX_1900_M2X

1p

1960MHz

C114

Band1

8.2p

RX_2100_HX

2 3
C115

RFOUTH

47p

C116

47p

G1 O1
IN
G2 O2

5 4

C117

L103

FL103

6.8n

C118

8.2p

C119

8.2p

RX_2100_H

DNI
2140MHz

GSM850

C122

RX_850

22p

L128

6.8n

RX_850_L2X

2 3
1

G1 O1
IN
G2 O2

L104

FL104

5 4
C126

12n

C125

8.2p

C130

8.2p

RX_850_L2

1.5p

881.5MHz

Band8/EGSM

2 3

RFOUTL

L106

4.7n

L132

C132

3.3n

G1 O1
IN
G2 O2

FL105

5 4

RX_900_L1X
L105
15n

C133

8.2p

RX_900_L1

DNI
942.5MHz

LGE Internal Use Only

- 131 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

Set the phone Rx is On

Check TP1 Signal exist?

No

Check RF Switch (M/S)

Yes

Check TP2 Signal exist?

No

Check FEM Block Refer 1.4

Yes
Change the board

LGE Internal Use Only

- 132 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.7 GPS/WIFI/BT RF components


4.7.1 GPS RF Components

FL801
U802

U801

U405

X801

Figure. GPS RF Components on top side of the P970 bear board.

Reference

Description

U801

GPS Chip (BCM4751)

U802

LNA Module (LNA + SAW)

FL801

SAW Filter (1575MHz)

X801

TCXO (26MHz)

U405

LDO (150mA)

LGE Internal Use Only

- 133 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.7.2 Wifi/BT/FM RF Components

U803

U804

FL802

X802

U805

Figure. WiFi /BT /FM Components on bottom side of the P970 bear board.

Reference

Description

U803

WiFi/BT/FM Chip (BCM43291)

U805

FEM Module (SP3T + LNA)

FL802

Dielectric Filter (2450MHz)

X802

TCXO (26MHz)

U804

LDO (150mA)

LGE Internal Use Only

- 134 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.8 GPS/WIFI/BT SIGNAL PATH


4.8.1 GPS Signal Path

hu{G

GPS UART to AP

Figure. RF signal path of GPS on top side of the P970 bear board.

LGE Internal Use Only

- 135 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.8.2 Wifi/BT/FM Signal Path


4.8.2 Wifi/BT/FM Signal Path

Via is
connected to
pad of WiFi /
BT ANT.

FM via is connected to
3.5phi Ear-Jack

Figure. RF signal path of WiFi/BT/FM on top side of the P970 bear board.

LGE Internal Use Only

- 136 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.9 Power ON troubleshooting


The main power source of LGP970 is provided by 2 chips which are TWL5034 and XMM6160 (Communication
processor). Since XMM6160 only powers up normally when OMAP3630 is properly powered therefore, TWL5034
are the actual ones to take look at.
Power ON sequence of LGP970 is,
PWR
gogo
to to
lowlow
(R409(TP1),
TWL5034POWER_ON_SW_
POWER_ON_SW_ pin(A11))
pin(A11)) TWL5034
Power
UpUp

PWRkey
keypress
pressPM_ON_SW_N
PM_ON_SW_N
(R409, TWL5034
TWL5034
Power
REGEN
1.8V_MMC_EN(C456_TP2)
1.8V_CSI2(C454_TP4),
3.0V_MOTION
(C452_TP5), 1.8V_
REGEN
1.8V_MMC_EN(C456)
1.8V_VIO(L404_TP3),
1.8V_VIO(L404), 1.8V_CSI2(C454),
3.0V_MOTION
(C452),
AUDIOAMP(C460_TP6)

VDD1_CORE(L402_TP7)

VDD2_CORE(L403_TP8)

1.8V_VPLL1(C459_TP9)
OMAP_PWR_
1.8V_AUDIOAMP(C460) VDD1_CORE(L402) VDD2_CORE(L403) 1.8V_VPLL1(C459) OMAP_PWR_RESET
RESET
goes high!
goes high!

LGE Internal Use Only

- 137 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

START

Battery voltage higher than


3.70V(OCV)?

No

Change or charging the Battery

Yes
Press PWR Key R409(TP1)
high to low

No

Check the USB FPCB

Yes

Power Key is Damaged?

No

Change USB FPCB

Yes
TP2, TP3, TP4,
TP5, TP6, TP7, TP8, TP9,
Power up?

No

Change the Main board

Yes
is clock OK?
X402: 32.768Khz

No

Change the TCXO and X-tal

Yes
Change the Main board

LGE Internal Use Only

- 138 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

BOTTOM view of LGP970

C456 (TP2)

C454 (TP4)
L402
(TP7)
C459(TP9)
C460 (TP6)

C452 (TP5)
X601

L404
(TP3)

L403
(TP8)

TOP view of LGP970


R409 (TP1)

LGE Internal Use Only

- 139 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.10 Charger Troubleshooting


Since LGP970 micro USB is located at the TOP of the terminal set, charging current flows via USB FPCB.
The charger IC accepts the current and maximum charging current is set around 945mA.

CHARGER IC

uUSB Connector

VCHG

CN101

TP1

USB_VBUS

14

C506

1
2

USB_DM
USB_DP
USB_ID

3
4

11

1u

R505

ISET
GND1
LDO
IEOC

BATT

U502

PGB
CHGSB
GND2
EN_SET

11
10

TP2

9
8

CHG_STATUS_N_OMAP

7
6

CHG_EN_SET_N_OMAP
C511
2.2u

2K

C512

560

15

R504

13

PGND
VIN

100K

1u
R501

12

1.8V_VIO

100K

8
10

VBAT

R506

VCHG

USB

Main
Battery

Close to batt. connector

Check Point
- Connection of TA or USB Cable
- Charging current path(RT9524)
- Battery

Troubleshooting Setup
- Connect TA and battery to the phone

Charging Procedure
- Connect TA or u-USB Cable
- Control the charging current by RT9524 IC
- Charging current flows into the battery

Troubleshooting Procedure
- Check the charger (TA or USB Cable) connector

LGE Internal Use Only

- 140 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

START

Check the pin and battery


Connect terminals of I/O connector

Connection OK?

No

Change I/O connector

Yes
Is the u- USB Cable
voltage 4.8V (or 5.0V)?

No

Change TA (or u-USB cable)

Yes
Is it charging properly
After turning on?

Yes

END

No
Check PMIC SMT status by X-ray
Exchange PMIC or Change the main
board and Retest

LGE Internal Use Only

- 141 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

TOP view of LGP970

C506 (TP1)

C511 (TP2)

U502

LGE Internal Use Only

- 142 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.11 USB Trouble shooting


The sequence of LGP970USB is,
USB connected to LGP970 USB_OUT_5V goes to 5V(FPCB) USB_D+ go to 3.3V USB_DATA is triggered
USB work
Block Diagram of USB & UART connection is shown below

{~s

UART_TX_SW

USB_ID

USB_ID

USB_DP_TWL

t|pj

UART_RX_SW

h
z

USB_DM_TWL

OMAP_U
UART_SW

UART3_R
RX_OMAP

UART3_T
TX_OMAP

US
SIF1_SW

UART1_TX_IPC

UART1_
_RX_IPC

h
w
OvthwP

USB_DM

USB_DM
USB_DP

USB_DP

CN1001
U705

UART_RX

CN904

UART_TX

|ziGmwji
kwZ{Gz
OpjZWXP

USB_DP_IFX
X

USB_DM_IFX
X

USIF1_TX_IFX

USIF1_RX_IFX

U2

p
Tn
Owti`_WXP

tGi

LGE Internal Use Only

- 143 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

START

Cable is inserted?

No

Insert cable

Yes
TP1(C502) is 5V?
Yes
Lower FPCB damaged?

Yes

Change Lower FPCB connector

No
USB_D+ is 3.3V?

No

Check U501

Yes
Change the Main board

LGE Internal Use Only

- 144 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

uUSB Connector

VA903

VA904

ZD904

CN101
6

8
10

USB_DP
USB_DM

12

3
4

P3

P1

P4

P2

13

USB_ID
1

12

11

10

RCV_N

FL902

RCV_P

USB_DM
USB_DP
USB_ID

14

P6

14

CN904

PWR_ON_SW

P5 5

VCHG

3
4
5

FL901
IN

15

MUIC

39p

13

4.7u

ZD902

11

C930

C929

OUT

VCHG

GND1 GND2

VBAT

VCHG
C501
0.1u

C502

90ohm matching !!

D5

1u

TP1

C5

USB_DM
USB_DP

B5
B4

USB_ID
R502

B1

VB

BAT

COMN1

DN1

COMP2

DP2

UID

U501
MAX14526DEEWP

AUD2

SCL

IC

SDA

GND

B2

1u

AUD1

INT

C3

CAP

ISET

A4

USB_DM_TWL
USB_DP_TWL

90ohm matching !!

A5
B3

UART_RX
UART_TX

A3
A1
D4
D3
A2

C2

C513

MIC

C1

C4

U2

RES

2.2K
D1

U1

D2

1.8V_VIO
100K

I2C2_SDA
I2C2_SCL

MUIC_INT_N

R503

90ohm matchingUSB_VBUS
!!

PWR_ON_SW

10K

R409

VBAT

R8
T10

USB_DP_TWL
USB_DM_TWL
3.1V_VUSB

T11
R11
D4

I2C1_SDA
I2C1_SCL
SYS_IRQ_N

D5
F10
F9
A11

PWR_WARM
OMAP_PWR_RESET

B13
A13
C432

1u

N16
C13

VBAT
1.8V_VIO

LGE Internal Use Only

- 145 -

R407
10K
R408

K11
J11
H8

VBUS
DP
DN
ID
I2C_CNTL_SDA
I2C_CNTL_SCL
INT1
INT2
PWRON
NRESWARM
NRESPWRON
VREF
SYSEN
BOOT0
BOOT1
MSECURE

10K

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

C520 (USB_VBUS)

TP1 (C502)

LGE Internal Use Only

- 146 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.12 Audio trouble


4.12.1 Speaker troubleshooting
Speaker control signals are generated by TWL5034 (U402), amplified by WM9093 (IC601), and Power is supplied by
Battery (VBAT).

START

Reconnect ANT. FPCB.


and check the speaker sound.

Spker sound is OK?

Yes

END

No
Change the speaker module

Yes

Check the waveform of TP1.


Waveform is OK?
No
Change the ANT. FPCB.
Speaker sounds OK?

Yes

END

No
Check the waveform of TP2.
Waveform is OK?

Yes

Change the Main PCB

Change the Audio codec IC

Speaker sound OK
END

LGE Internal Use Only

- 147 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

SPK
TP101

SPK_P

TP102

SPK_N

TP1
VA103

VA104

FB601

SPK_P
SPK_N

FB602

LGE Internal Use Only

C613

C614

0.1u

0.1u

20
R605

20

R604

TP2
R601

R602

- 148 -

EAR_L
EAR_R

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4. 12.2 Receiver troubleshooting


Receiver control signals and power are generated by TWL5034 (U402).

START

Reconnect USB FPCB.


and check the speaker sound.

Spker sound is OK?

Yes

END

No
Change the receiver

Yes

Check the waveform of TP1.


Waveform is OK?
No
Check the waveform of TP2.
Waveform is OK?

Yes

Change the USB FPCB

Change the Main PCB

Speaker sound OK
END

LGE Internal Use Only

- 149 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

RCV

CN104

RCV_P

RCV_N

TP1

VA903

CN904

VA904

ZD904

14

PWR_ON_SW
2

13

12

11

10

USB_ID
TP2

RCV_N
RCV_P

LGE Internal Use Only

- 150 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.12.3 Main MIC troubleshooting


Main MIC control signals and power are generated by TWL5034 (U402).

START

Reconnect the ANT. FPCB.


and check the Main MIC.

Voice recording is OK?

Yes

END

No
Change the ANT. FPCB

Yes

Check the TP1.


Bias range 1.8V~2.2V
OK?
No
Change the Main PCB

Voice recording is OK
END

LGE Internal Use Only

- 151 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

Main MIC
O
G2
G1
P

MIC1P
MIC1N

4
3

TP1

MICBIAS

MIC101

VA107

VA108

As close as to MIC, Not in the ANT Carrier

LGE Internal Use Only

- 152 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.12.4 SUB MIC troubleshooting


Sub MIC control signals and power are generated by TWL5034 (U402).

START

Reconnect the VCAM FPCB.


and check the Sub MIC.

Speaker phone call is OK?

Yes

END

No
Check the TP1.
Bias range 1.8V~2.2V
OK?
No
Change the VCAM PCB

Speaker phone call is OK


END

LGE Internal Use Only

- 153 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

L901

47p

R920

FB902
1800

38

37

FB903
1800

36

35

34

33

32

10

31

11

30

12

29

13

28

14

27

15

26

16

25

17

24

18

23

19

22

20

21

R915

C923
4.7u

R919 DNI

39

PROX_OUT

2.8V_PROXI
1.8V_VIO
ZD905

EAR_GND

FB901

EJ_MIC
FM_ANT
EAR_DETECT
C912

40

R916

KEY_LED_HIGH
VT_DATA[7]
VT_DATA[6]
VT_DATA[5]
VT_DATA[4]
VT_DATA[3]
VT_DATA[2]
VT_DATA[1]
VT_DATA[0]

1800

1
10

MIC2N
MIC2P
C922

- 154 -

C921

LSENSOR_SENS

10u

MICBIAS2

TP1
LSENSOR_BIAS

I2C3_SDA
I2C3_SCL
VT_VSYNC
VT_HSYNC
VT_CAM_DRV_2.8V

C924

C925

DNI

DNI

VT_CAM_IO_1.8V

100

R917

R918

VT_MCLK
VT_PCLK

VT_CAM_PWDN
VT_RESET_N

R913
C918
DNI

LGE Internal Use Only

VA906

1u

ZD901

47K

C919
33p

ZD903

47p

100K

47p

R914

0.1u

CN903
6

R911

HOOK_ADC
EAR_L
EAR_R

VA905

C911 C913 C914


4

0.1u

R910

C908

2.2K

4.7u

D901

C926

EAR_MICBIAS

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.12.5 Ear-MIC troubleshooting


Ear MIC control signals are generated by TWL5034 (U402), amplified by WM9093 (IC601). The power is generated by
external LDO (U403) which is controlled by OMAP3630 (U301).

START

Reconnect the VCAM FPCB. and check the Headphone Sound & MIC.

Ear sound is OK?

Yes

No

Yes

Hook detect is OK?

No

Check the TP1.


Bias range 1.6V~2.2V
OK?
No

Ear sound is OK?

Yes

Check the
waveform of TP1.
Waveform is OK?

Yes

END

No
Yes

Check the TP3.


Bias range 1.0~1.4V
OK?

No

Yes

Change the VCAM


FPCB

No

Check the Audio LDO or Audio subsystem IC or Main PCB

All sounds OK
END

LGE Internal Use Only

- 155 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

AUDIO LOD
VBAT

4
3

EAR_MICBIAS_EN

VIN
STBY

VOUT
GND

TP1

1
2

C5031

PGND

U403

1u

EAR_MICBIAS

C5032

C5033

1u

33p

TP2
C912

L901

47p

39

FB902
1800

38

37

FB903
1800

36

35

34

33

32

10

31

11

30

12

29

13

28

14

27

15

26

16

25

17

24

18

23

19

22

20

21

R915

C923
4.7u

R919 DNI

PROX_OUT

2.8V_PROXI
1.8V_VIO
ZD905

EAR_GND

40

FB901

R916

KEY_LED_HIGH
VT_DATA[7]
VT_DATA[6]
VT_DATA[5]
VT_DATA[4]
VT_DATA[3]
VT_DATA[2]
VT_DATA[1]
VT_DATA[0]

1800

1
10

C919
33p

MIC2N
MIC2P
VA906

C922

10u

MICBIAS2

LSENSOR_SENS

LSENSOR_BIAS

I2C3_SDA
I2C3_SCL
VT_VSYNC
VT_HSYNC
VT_CAM_DRV_2.8V

- 156 -

C924

C925

DNI

DNI

VT_CAM_IO_1.8V

100

R917

R918

VT_MCLK
VT_PCLK

VT_CAM_PWDN
VT_RESET_N

R913
C918
DNI

LGE Internal Use Only

C921

1u

ZD901

47K

EJ_MIC
FM_ANT
EAR_DETECT

R920

CN903

47p

ZD903

47p

100K

0.1u

R914

TP3

VA905

C911 C913 C914


6

HOOK_ADC
EAR_L
EAR_R

R911

0.1u

R910

C908

2.2K

4.7u

D901

C926

EAR_MICBIAS

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

TP1_C5032

TP3_C908

TP2_C914

LGE Internal Use Only

- 157 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.13 Camera troubleshooting


5M camera control signals are generated by AP_OMAP3630(U301), and Power is supplied by LP8720(U601)

START

Check the camera conn.


and revonnect thr camera

Camera is OK?

Yes

END

No
No

Check IOVDD(TP1),
DVDD(TP2), AVDD(TP3)
Yes

Change the main board

No

Check the camera signals MCLK(TP4),


MIPI_CLK(TP5), MIPI_DATA(TP6)
Yes
Change the camera

Camera is OK?

LGE Internal Use Only

- 158 -

Yes

END

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

1.2V_5M_VDIG

1.8V_5M_VIO
CN602

FL602

TP6

1
P1
2
P2
3
P3
4
P4
G2
10
G1
9

5M_MIPI_DATA0_N
5M_MIPI_DATA0_P
5M_MIPI_DATA1_N
5M_MIPI_DATA1_P

5
P5
6
P6
7
P7
8
P8

24

23

22

21

20

19

18

17

16

10

15

11

14

12

13

I2C3_SDA
I2C3_SCL

0.1u

5M_RESET_N
5M_CAM_VCM_EN

2.8V_5M_VCM

0.1u

TP4

2.7V_5M_VANA

1
P1
2
P2
3
P3
4
P4

P5
6
P6
7
P7
8
P8

0.1u

5M_MCLK

FL601

G2
10
G1
9

5M_MIPI_CLK_N
5M_MIPI_CLK_P

TP5
5

C622

1u

0.1u

C625

C624

C621

4.7u

ZD601

C623

TP2 TP3 TP1

C620

LGE Internal Use Only

- 159 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.13.1 Sub 2M Camera troubleshooting


2M camera control signals are generated by AP_OMAP3630(U301), and Power is supplied by TWL5034(U402)

VT_CAM_DRV_2.8V VT_CAM_IO_1.8V

VT_DATA[7]
VT_DATA[6]
VT_DATA[5]
VT_DATA[4]

6
7
8
9

CN103

24

23

22

21

20

19

18

17

16

10

15

11

14

12

13

I2C3_SCL

FL102

G1

G2

10

7.5pF

I2C3_SDA

INOUT_B4

INOUT_A4

INOUT_B3

INOUT_A3

INOUT_B2

INOUT_A2

INOUT_B1

INOUT_A1

4
3
2

VT_VSYNC

6
7
8
9

10

VT_MCLK

FL103

G1

G2

VT_DATA[3]
VT_DATA[2]
VT_DATA[1]
VT_DATA[0]

VT_HSYNC
7.5pF

VT_PCLK

INOUT_B4

INOUT_A4

INOUT_B3

INOUT_A3

INOUT_B2

INOUT_A2

INOUT_B1

INOUT_A1

4
3
2
1

VT_RESET_N
VT_CAM_PWDN

TP2

TP1

1u
C101

1u
C102

47K

L901

47p

R920

FB902
1800

38

37

FB903
1800

36

35

34

33

32

10

31

11

30

12

29

13

28

14

27

15

26

16

25

17

24

18

23

19

22

20

21

R915

C923
4.7u

R919 DNI

39

PROX_OUT

2.8V_PROXI
1.8V_VIO
ZD905

EAR_GND

FB901

EJ_MIC
FM_ANT
EAR_DETECT
C912

40

R916

KEY_LED_HIGH
VT_DATA[7]
VT_DATA[6]
VT_DATA[5]
VT_DATA[4]
VT_DATA[3]
VT_DATA[2]
VT_DATA[1]
VT_DATA[0]

1800

1
10

C919
33p

MIC2N
MIC2P
VA906

C922

10u

MICBIAS2

LSENSOR_SENS

LSENSOR_BIAS

I2C3_SDA
I2C3_SCL
VT_VSYNC
VT_HSYNC
VT_CAM_DRV_2.8V

- 160 -

C924

C925

DNI

DNI

R917

VT_CAM_IO_1.8V

R918

VT_CAM_PWDN
VT_RESET_N

R913
C918
DNI

LGE Internal Use Only

C921

1u

ZD901

CN903

47p

ZD903

47p

100

100K

0.1u

TP3
0

VT_MCLK
VT_PCLK

TP4

R914

HOOK_ADC
EAR_L
EAR_R

VA905

C911 C913 C914


6

R911

0.1u

R910

C908

2.2K

4.7u

D901

C926

EAR_MICBIAS

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.14 Main LCD trouble


Main LCD control signals are generated by OMAP3630. Those signals path are : OMAP3630-> LCD Module

START

Press PWR key turn the power On

Is the circuit powered?

No

Follow the Power ON


trouble shooting

Yes
Disconnect and reconnect
LCD connector

LCD display OK?

Yes

No

Change the LCD module

Yes

Check Power
VCC_LCD_1V8
VCC_LCD_2V8
V_POWERALL
No

Yes

Change the Main board

The LCD works

END

LGE Internal Use Only

- 161 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

VBAT

VBAT line minimum 0.6mm


C701
2.2u
C702

2.2u

1.8V_VIO
1u
B5

C2-

FLTR

BL8
LDOA

B3

SBIAS
LDOB

C1

AMB_IN
LDOC

PGND2

E2
F1
A1
B1

1.8V_LCD_IOVCC
3.0V_LCD_VCC_VCI

B2

1.8V_TOUCH

A2

3.0V_TOUCH

F3

PGND1

AGND2

E1

C5

AGND1

2.2u

R706

LDOD

IN_LDO

A3

68n

C713

100K

C712

A4

F2

2.2u

C2

E3

2.2u

BL7

E4

C711

BL6

F4

2.2u

BL5

LCD_BL_OUT1
LCD_BL_OUT2
LCD_BL_OUT3
LCD_BL_OUT4
LCD_BL_OUT5
LCD_BL_OUT6
LCD_BL_OUT7
LCD_BL_OUT8

E5

C710

BL4

U701

BC_M

F5

2.2u

BL3

C709

BL2

SDA
SCL

D1

LSENSOR_SENS

EN

D5

C708

D3

LSENSOR_BIAS

NEG
BL1

C3

LCD_PWM

C2+

B4
R704

IN

D2

LCD_CP_EN
I2C2_SDA
I2C2_SCL

C1-

C1+

100K

A5

C4

C704

1u
D4

C703

VBAT
3.0V_LCD_VCC_VCI
1.8V_LCD_IOVCC

FL702
1
P1
2
P2
3
P3
4
P4

CN702
30

29

28

27

26

25

24

23

22

10

21

11

20

12

19

13

18

14

17

15

16

INOUT_A3

INOUT_B4

INOUT_A4

LCD_PWM

10

15pF

LCD_BL_OUT4
LCD_BL_OUT3
LCD_BL_OUT2
LCD_BL_OUT1

LCD_BL_OUT8
LCD_BL_OUT7
LCD_BL_OUT6
LCD_BL_OUT5

P3

P1

P4

P2

1
2

LCD_MIPI_CLK_P
LCD_MIPI_CLK_N

FL703

TP2

C720

C715

C714

4.7u

2.2u

2.2u

TP3

P5 5

INOUT_A2

INOUT_B3

G2

INOUT_B2

P6

INOUT_A1

G1

INOUT_B1

LCD_TE
LCD_CS
LCD_RESET_N

FL701

LCD_MIPI_D0_P
LCD_MIPI_D0_N
LCD_MIPI_D1_P
LCD_MIPI_D1_N

9
G1
10
G2

LCD_MAKER_ID

5
P5
6
P6
7
P7
8
P8

TP1

A20
NC45
A10
NC40
A17
SDRC_DQS1
A6

NC38

AG22
AH22
AG23
AH23
AG24
AH24
E26
F28
F27
G26
AD28
AD27
AB28
AB27
AA28
AA27
G25

LCD_MIPI_D0_P
LCD_MIPI_D0_N
LCD_MIPI_D1_P
LCD_MIPI_D1_N
LCD_MIPI_CLK_P
LCD_MIPI_CLK_N

LGE Internal Use Only

- 162 -

DSS_DATA0
DSS_DATA1
DSS_DATA2
DSS_DATA3
DSS_DATA4
DSS_DATA5
DSS_DATA6
DSS_DATA7
DSS_DATA8
DSS_DATA9
DSS_DATA10
DSS_DATA11
DSS_DATA12
DSS_DATA13
DSS_DATA14
DSS_DATA15
DSS_DATA16

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

703 702TP2
701 TP3
TP1
signal check
point

LGE Internal Use Only

- 163 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.15 SIM
4.15
SIM detect
detectTrouble
Troubleshooting
shooting
The sequence of detecting LGP970 SIM is,
SIM inserted to LGP970 2.85V_SIM goes to 2.85V(SUB FPCB) Triggers SIM clock, reset and data.
Block Diagram of USB & UART connection is shown below

G
SIM_RSTG
SIM_CLK

CLKG

USIMG

RSTG

SIM_IO

I_OG

CC_CLK

MP-EHMG

CC_RST

CC_IO

XMM6160

zG
START

Re-insert the SIM card


yTGGzptG

~Gf
Work
well?

No

l END

uG

YU_\}zptGf

2.85V_SIM (TP1_C214) runs?


Yes

Yes

Nouv

jGGG

Change the main board

G G

lz

Change
SUB FPCB
jGz|iGmwji

Work
well?
~Gf
No

Yes

l END

uG

jGzptGG
Change SIM card G G G

~Gf

Work well?
No

Yes

END

jGtG

Change Main board

LGE Internal Use Only

- 164 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

PMUMEAS
VDD_LVDS
VANA1
VANA2
VSS_ANA
VDD_VBAT_LDO
VDD_OSD2
VRF2
VDD_VBAT_RF12_1
VRF1
VDD_VBAT_RF12_2
VSS_RF12
VMIPI
VDD_VRTC
VDD_VPLL
VDD_VSIM
VDD_VUSB
VDD_VPMU
DIF_D0
DIF_D1
DIF_D2
DIF_D3
DIF_D4
DIF_D5
DIF_D6
DIF_D7
DIF_D8
DIF_D9
DIF_CS1
DIF_CS2
DIF_CD
DIF_WR
DIF_RD
DIF_HD
DIF_VD
DIF_RESET1
DSI_DP1
DSI_DN1
DSI_CLKP
DSI_CLKN
NC_9
NC_10
NC_11
NC_12
D12
G16
F18
B16
E16
E14
D15
B15
A16
D14
C15
F16
G17
E13
F19
E15
F17
P5
R1
P2
P1
N7
M6
N5
N4
N2
N1
M8
M7
M5
M4
M2
M1
N8
P4
Y13
Y14
Y11
Y12
A1
Y1
A20
Y20

LGE Internal Use Only


1.2V_MIPI
2.3V_RTC 1.35V_PLL 2.85V_SIM 3.1V_USB

C203
C204 C205
C206
C207
C208
C211
C212
C213
C214

100n 10u
C209 C210

220n
220n
1u
C215
C216

1u
100n 10u
220n
0.1u
220n
1u
0.1u
0.1u

- 165 -

R205

1.8V_SD 2.85V_RF2 2.85V_RF1

390K

2.5V_ANA2

220K

VBAT

R206

4. TROUBLE SHOOTING

VBAT

IFX_USB_VBUS

TP1

C202

220n

IPC_MRDY

IPC_SRDY
MODEM_AP_WAKE

MODEM_WAKE
MODEM_PWR_CHK
MODEM_CHK

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

USIM For Infinieon


4.7K

2.85V_SIM

R112

J101
4
5
6

SIM_IO
22p

10

VCC

VPP

RST

IO

CLK

GND5

GND2

GND4

GND3

1
2

SIM_RST
SIM_CLK

3
7
8

D 103

C105

GND1

C106

C107

C108

DNI

0.1u

18p

Main 2 Sub
VBAT

2.85V_SIM

3.0V_MOTION

1.8V_MOTION_VIO
1.8V_VIO

GYRO_INT_N
COM_INT
MOTION_INT
PWR_ON_SW
SIM_RST
SIM_CLK
SIM_IO
I2C3_SCL
I2C3_SDA

40

39

38

37

36

35

34

33

32

10

31

11

30

12

29

13

28

14

27

15

26

16

25

17

24

18

23

19

22

20

21

FLASH_LED_TORCH
FLASH_LED_EN
GSM_TXON_IND
UART_TX_IFX
UART_RX_IFX
MICROSD_CMD
MICROSD_CLK
MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT3
MICROSD_DET_N

LGE Internal Use Only

TDO
TDI
TCK
TMS
TRSTN
TRIG_IN
HW_MON1
HW_MON2
DSP_AUDIO_IN1
26MHz_GPS_REF

SIM_CLK
SIM_RST
SIM_IO

H13
L14
L13
M14
M13
G11
E10
F12
E12
E11
L8
L7
R9
L5
U10
T10
H10
H9
G5
E8
E2
E1
F9

M5
M6
M7
M8
M9
M10
CC_CLK
CC_RST
CC_IO
DPLUS
DMINUS
TDO
TDI
TCK
TMS
TRST_n
TRIG_IN
HW_MON1
HW_MON2
DSP_AUDIO_IN1
CLKOUT0
T_OUT0
T_OUT1

KEY_C[0]
KEY_R[0]
KEY_R[1]
KEY_R[2]

3.0V_MMC

CN101

- 166 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

C214 (2.85V_SIM)

TP1(C214)

LGE Internal Use Only

- 167 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.16 Side Key Trouble shooting


The sequence of detecting LGP970 Side key is,
Side key pressed on LGP970 KEY_R[0](Volume up), KEY_R[1](Volume_down), KEY_R[2](Gesture KEY) goes low
Block Diagram of Side key connection is shown below

KEY_R[0]

KPD_R0

KEY_R[1]

KPD_R1

KEY_R[2]

KPD_R2

KEY_C[0]

KPD_C0

TWL5034

START

Press the key

Side Key is worked?

Yes

END

No
TP1_R111
(SUB FPCB) goes low when
the key is pressed?

END

No
LOWER FPCB damaged?

Yes

Change LOWER FPCB

No
Change the Main board

LGE Internal Use Only

- 168 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

KB1
R108

150

R109

150

R110

150

R111

150

KEY_R[0]

Vol. Up

KEY_R[1]

Vol. Down

KEY_R[2]

Gesture

KB2

KB3

KPD_C7

KPD_C5

H6

G4

KPD_C3

KPD_C4

F4

KPD_C2

F7

G7

KPD_C0

KPD_R7

KPD_C1

G6

H7

KEY_C[0]

G8

KPD_R6

L7

KPD_R4

KPD_R5

J10

K10

KPD_R2

KPD_R3

L9

KPD_R1

L8

K7

KPD_R0

K8

K9

KEY_R[0]
KEY_R[1]
KEY_R[2]

KPD_C6

KEY_C[0]

TP1

TP1

LGE Internal Use Only

- 169 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.17 Vibrator Troubleshooting


Check out the setting menu on the phone. If not, check Test points shown on the pictures.

START

Turn on the phone

Is the circuit powered?

No

Follow the Power ON


trouble shooting

Yes
Check Haptic Feedback on the
setting menu

Vibration OK?

Yes

No
Change the vibrator

Yes

Check TP1(C517)
No
Change the Main board

Vibrator works

END

LGE Internal Use Only

- 170 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

LGE Internal Use Only

- 171 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

DNI

R510

3.0V_MOTOR

U504
GND

MODE

VDD

GAIN

VDN

VIB_P

7
6
5

VIB_N

TP1

C517
2.2u

R516

10

NC3

PWM

11

VDP

NC1

EN

NC2

VIBE_EN
VIBE_PWM

C519

1%

10n

DNI

R517

Q-Motor
VB101
1

VIB_P

VIB_N

SJMY0007118

LGE Internal Use Only

- 172 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.18 Motion sensor troubleshooting


When the motion sensor does not work, the reason is chip problem. If the motion sensor IC is damaged, it will do not
work even thought power is supplied and OMAP3630 controls normally.
Therefore if the motion sensor is damaged, change the motion sensor IC or SUB-FPCB.

START

Motion sensor function check


(Screen rotation function is
Working or not?)

Function is OK?

Yes

END

Change the IC (U104)

Function is OK?

Yes

END

Change the SUB-FPCB

Function is OK?

LGE Internal Use Only

Yes

END

- 173 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

3.0V_MOTION

C123

1
C118
0.1u

GND
DNC2
DNC1

DNC3
INT

U104

IO_VDD

DNC4
SCL

MOTION_INT

IME_CL

SDA

10

1.8V_MOTION_VIO

VDD

0.1u

IME_DA

U104 (KXTF9)
Motion Sensor

LGE Internal Use Only

- 174 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.19 Gyro/Compass sensor troubleshooting


The compass sensor is calibrated by the gyro sensor data using SW algorithm.
Therefore Gyro sensor error makes the compass sensor malfunction.

START

Gyro & compass sensor function check

Gyro & Compass


Function is OK?

Yes

END

No
Yes

Gyro-NG Compass-OK?
No
Gyro-OK
Compass-NG?

Yes

END

No
Change the Compass
sensor IC (U105)

Change the Gyro sensor IC (U103)

Function is OK?

Yes

END

No
Change the Gyro sensor IC (U103)
No
Function is OK?

Yes

END

No
Change the SUB-FPCB

Function is OK?

Yes

END

END

LGE Internal Use Only

- 175 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

1.8V_MOTION_VIO

REGOUT

NC 1

CLKIN

NC2

NC3

CLKOUT
RESV2

INT

CPOUT

13

VDD

3.0V_MOTION

GND

FSYNC

NC8

GYRO_INT_N

U103

RESV1

25
24

I2C3_SDA
I2C3_SCL

23
22
21
20
19
C115
2.2n

18

12

SCL

17

11

SDA

AD0

NC7

10

VLOGIC

16

0.1u

NC9

IME_CL

15

C121

NC4

6
8

NC6

IME_CL

14

NC5

0.1u

IME_DA

C122

IME_DA

C120

1.8V_MOTION_VIO

3.0V_MOTION

COM_INT

0.1u

C116

CAD1

C1

VSS

C2

TST2

C3

TST6

RSV

VDD

A4

SCL/SK
A3

A1

SO

B4

3.0V_MOTION

U105

SDA/SI
TST1

I2C3_SDA

D4

CAD0

CS B

D2

A2

D1

DRDY

C4

VID

R117

10K

0.1u

B3

B1
C117
0.1u

1.8V_MOTION_VIO
I2C3_SCL

C119
0.1u

LGE Internal Use Only

- 176 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

LGE Internal Use Only

- 177 -

Copyright 011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.20 Proximity Sensor on/off trouble


Proximity Sensor is worked as below:
Send Key click Phone number click Call connected Object moved at the sensor
Control the screens on/off operation automatically

START

Send Key click & call connected

Object moved at the Proximity Sensor

Yes

LCD off?
No
Check PROXI_SDA /
SCL output & Prox_out

No

Change the upper FPCB

Yes
Work well?

No

Change the main board

Yes
END

Measurement
PROXI_VCC
1.8V_VIO
PROXI_LEDA
PROX_OUT (TP3)
I2C3_SCL (TP1)
I2C3_SDA (TP2)

LGE Internal Use Only

- 178 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

PROXI_VCC

1.8V_VIO

PROXI_LEDA

U102
1

PROX_OUT

LGE Internal Use Only

C106

TP3
C107

4.7u

0.1u

LEDA

SCL

LEDC

SDA

VCC

VIO

VOUT

GND

- 179 -

TP1

I2C3_SCL

I2C3_SDA

TP2

C105
1u

Copyright 011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.21 Illumination Sensor on/off trouble


Illumination Sensor is worked as below:
Menu Key click Settings click Display click Brightness click Automatic brightness click

START

Automatic brightness click

Hide Illumination sensor by hand

Yes

LCD brightness change?


No
Check TP1,2
(LSENSOR_BIAS/SENS)

No

Change the VT_CAM FPCB

Yes
Work well?

No

Change the main board

Yes
END

Measurement
LSENSOR_BIAS (TP2)
LSENSOR_SENS (TP1)

LGE Internal Use Only

- 180 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

U101

TP1

VCC
GND1

GC2

GC1

1TP2

LSENSOR_BIAS

IOUT
GND2

LSENSOR_SENS

LGE Internal Use Only

- 181 -

Copyright 011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

4.22 Touch trouble


Touch control signals are generated by AP20. Those signals path are : AP20 -> Touch Module

START

Check the touck connector and


reconnect the touck connector

Touch is OK?

Yes

END

No
Check power
3.0V TOUCH (TP1)
1.8V TOUCH (TP2)

No

Change the main board

Yes
Work well?

No

Change the touch module

Yes
END

Measurement
3.0V TOUCH (TP1)
1.8V TOUCH (TP2)

LGE Internal Use Only

- 182 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

4. TROUBLE SHOOTING

1.8V_TOUCH
1.8V_TOUCH

R703

10K

3.0V_TOUCH

10

CN701

TP2

TOUCH_INT_N
9

5
C705

I2C2_TOUCH_SDA

0.1u

TP1

LGE Internal Use Only

- 183 -

C707

ZD703

ZD702

ZD701

0.1u

I2C2_TOUCH_SCL

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD

LGE Internal Use Only

- 184 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LG-P970

LG-P970
LG-P970

LG-P970

LG-P970

LG-P970
LG-P970

LGE Internal Use Only

- 185 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LG-P970

LG-P970

LGE Internal Use Only

- 186 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LG-P970

LGE Internal Use Only

- 187 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LG-P970

LG-P970

LG-P970

LG-P970
LG-P970
LG-P970

LGE Internal Use Only

- 188 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LG-P970

LGE Internal Use Only

- 189 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LGE Internal Use Only

- 190 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LGE Internal Use Only

- 191 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LGE Internal Use Only

- 192 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LGE Internal Use Only

- 193 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LGE Internal Use Only

- 194 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LGE Internal Use Only

- 195 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LGE Internal Use Only

- 196 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LGE Internal Use Only

- 197 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LG-P970

LG-P970
LG-P970

LG-P970

LG-P970

LG-P970
LG-P970

LGE Internal Use Only

- 198 -

LG-P970
LG-P970

LG-P970
LG-P970

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LG-P970

LG-P970

LG-P970

LGE Internal Use Only

- 199 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LG-P970

LG-P970

LGE Internal Use Only

- 200 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LG-P970

LG-P970

LG-P970

LG-P970

LG-P970

LGE Internal Use Only

- 201 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

5. DOWNLOAD

LG-P970

LG-P970

LGE Internal Use Only

- 202 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

6. Block Diagram

6.Block diagram

B project Block Diagram


VT Cam

Camera

2M

5M MIPI

EDGE

26M

PCM UART SDIO

m
nzt
l
wht
t

Bluetooth

transceiver
PMB5703

Wi-Fi FM

Di3 RF I/F

WCDMA

MCP(CP)
Dg x

GPIO
I2C
USIF3
USIF
USB

PCM

MEM_AD

MEM_A

CC_000

Duplex

I2C_MODEM 2

wti`_WX
UMTS
PAM

UART2 CSI2 I2C3 CAM IF I2C3


UART1
SDIO
NCS

MCP(AP)

PCM
X32
SDRC
X16
GPMC

4Gb DDR
SDRAM

I2C2

USIM

I2C

USB DP/DM tWL


|ziGpm
|hy{Gvthw

Charger
IC

MUIC

Battery
(1500mAh)

Fuel gauge

|hy{Gy{

HS USB data

GPIO

HS USB data

INT1

|hy{Gz~

DP/DN
PCM

LCD Backlight

Motion

MMC1

eMMC
(2GB)

Driver

TWL5034

I2C3

Gyro
Compass

Key LED
Driver

I2C1 I2C4

I2S

I2C2

LCD BL Charge Pump

Proximity sensor

GPIO for PWM

UART3_TX_IRRX/TX
UART4 (GPMC_WAIT)

16

Touch Screen

Hall IC

OMAP3630

I2C2

Address

Touch Driver

AMBIENT

MMC2

1Gb NAND

Touch module

Mounted
M
t d on
OMAP3630

16

512Gb DDR
SDRAM

LCD 4.0
WVGA (800X480)

DSS_DAtA

I2C2

GPIO
I2C
SPI2
I2C1
I2C2
I2C3

A-GPS

KPD

Key
Audio
Subsystem

EAR_MIC

MAX17040

LGE Internal Use Only

- 203 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

6. Block Diagram

rF Block Diagram
FEM
with
GSM

FSY2_CLK

PAM

VCTCXO
26MHz

SKY77529

XO
VCONT

G850/G900

TX_LB
TX_HB

AFC_DAC

DCS/PCS

DET

W900
Duplexer

RXTX_L2

WCDMA
Dual PAM
ACPM-5281

W2100
Duplexer

RXTX_H

CPL

W1900
Duplexer

RXTX_M1

F26M

SYS_CLK

TX2G_L
TX2G_M

W-PAM
ACPM-5202

CPL

WCDMA
TX SAW

TX_3G_L

WCDMA
TX SAW

TX_3G_H

WCDMA
TX SAW

TX_3G_M

DI3_TX_DAT
DI3_TX_DATX

Di3_TX_DAT
Di3_TX_DATX

DI3_RX_DAT
DI3_RX_DATX

Di3_RX_DAT
Di3_RX_DATX

MP-eHM

transceiver

PMB9801

PMB5703

PWR DET

PA_POW_DET

RFIN1
1900

RX SAW

LNA
RFIN4BGA749

RX_M2 ~MnGX`WWG nGX`WW


RX_M2X

2100

RX SAW

RX_H
RX
H
~GYXWW
RX_HX

RFIN5

900

RX SAW

RX_L1
~MnG`WW
RX_L1X

RX SAW

RX_L2
nG_\W
RX_L2X

RFIN2

RX_M2
RX_L1
RX_M3

850
1800

LGE Internal Use Only

RX SAW

RX_M1 nGX_WW
RX_M1X

- 204 -

VDD_MAIN
VDD_FSYS
VDD_IO

2.85V_RF1
2.85V RF2
2.85V_RF2
1.8V_SD

VRF1
VRF2
VSD2

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

6. Block Diagram

Power Block Diagram


tA (5PiN)
5.1v,700mA

vCHG

TWL5030

USB_vBUS
vBUS
Charger iC USB
vBUS
(rt9524)
vBAt

CP_iN

(40mA)

vAUX4_oUt

1 500 Ah
1,500mAh

(100mA)

vSDi_CSi_oUt

(100mA)

MUiC
tS5USBA33402

vSiM_oUt

(100mA)

vDAC oUt
vDAC_oUt
(70mA)

Analog
g switch for
USIF1

(200mA)

vSD1_1
vSD1
(450mA)

(450mA)

vSD1_1
vSD2

(450mA)
(4450mA

(30mA)

vANA2

(60mA)

vrF1

(180mA)

vrF2
(60mA)

LNA for IFX

1.8v_MotioN_vi
1
8v MotioN vi
o
1.8v_MMC_eN

2 8v ProXi
vAUX1 oUt 2.8v_ProXi
vAUX1_oUt

vDD_vPLL)

PAM

1.8v_WLAN

(200mA)

PMB980
1

vMiPi

(60mA)

vDD_vrt
C
vDD_vUS
B(40mA)

1.3v_Core
1.8v_SD
1 35v PLL
1.35v_PLL
2.5v_ANA2
2.85v_rF1
2.85v_rF2
1.2v_MiPi
2.3v_rtC

vDDS_MMC1

3.0v MMC
3.0v_MMC
3.0v_MMC

SUB PMIC LDo1


(300mA)
CAM POWER
LDo2 3.0v_Motor
(300mA)
vBAt (LP8720)

vDDS_MeM
vDDS_DPLL_Per

SW

AUDIO SUBSYSTEM

WLAN+BT+FM
MOTION / GYRO
COMPASS

2.85v_SiM

- 205 -

(400mA)

1.2v_5M_vDiG
_ _

LDo3

(300mA)

PROXIMITY
SENSOR

5M CAM

LDo4 1.8v_5M_vio

(300mA)

LDo5 2.8v_5M_vCM

(300mA)

310mA

VT 2M CAM

MOTOR
DRIVE IC

2.7v_5M_vANA

eMMC LDO

GPS LDO

3.0v_USer_MeM

GPS_2.8v

USER
MEMORY
eMMC I/F

GPS

150mA

GPS_tCXo_1.8v

TCXO for
GPS

vDD_Core
vDD_DiG / MeM

AUDIO LDO

vDD_LvDS

eAr_MiCBiAS
_

150mA

vDD_MiPi_BGC
LeD1~8

vDD_MAiN
vDD_FSYS

LCD_BL_oUt[1:8]

LDoA 1.8v_LCD_iovCC 4.0


4.0 LCD
LCD BL
(300mA)
CHG PUMP LDoB 3.0v_LCD_vCC_vCi
(AAT2870) (150mA)

vDD_MiPi

LDoC

vDD_USB PMB9801

(150mA)

MEMORY

(150mA)

(for Infineon)
1G / 512Mb

(7mA)

LGE Internal Use Only

Core

vDD_rtC

3.1v_USB

vDD_vPM
vDD
vPM
U
vANA1
vDD_vSiM

OMAP3630

MPU

vDDS_CSi2

1.8v_AUDioAMP

vMMC2_oU
t (100mA)
vMMC1_oU vt_CAM_Drv_2.8
v
t (220mA)
vAUX3_oUt vt_CAM_io_1.8v

Key LED DRIVER

SKY77529

1.8v_CSi2

vAUX2_oUt 3.0v_MotioN

38.4MHz for WLAN

PMB5703

1.8v_PLL1

(50mA)

Flash LED Driver

FUEL GAUGE IC

(600mA)

vPLL1_oUt

Battery

DP3T SWITCH

vDD1_Core
vDD1_Cor
e ((1.1A)) vDD2
vDD2_Core
Core
vDD2_Cor
e (600mA) 1.8v_vio
vio

USIM For
Infineon
LEVEL SHIFTER

LDoD

SBiAS

1.8v_toUCH

3.0v_toUCH
LSeNSor_BiAS

TOUCH
AMBIENT
LIGHT
SENSOR

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

7. CIRCUIT DIAGRAM

47p

G1 O1
IN
G2 O2

2p

RX_1800_M1X
L101

FL101

5.6n

5 4

L126

C105

2p

C106

2p

RX_1800_M1

8.2n

GPS_GSM_CTL
GSM_TXON_IND
DRW
SS
CLK
VSPI

1842.5MHz

FL102

Band2 & PCS

L127

RX_1900

C5027

DNI

RFOUTM

C5029

33p

C108

2.4n

RX_1900_M2

O2
1
3
IN G1G2 O1

47p

L102

2 5

C110

C112

2p

RX_1900_M2X

1p

1960MHz

Band1

PA_MODE2

C114

8.2p

C118

8.2p

PA_MODE

C115

RFOUTH

47p

C116

47p

DNI

R103

R104

DNI

6.8n

RX_2100_H

DNI

C119

GSM850

C122

22p

L128

6.8n

8.2p

PAM

VMODE

For 2 mode CTRL

PA_MODE

NC

For 3 mode CTRL

PA_BIAS1

PA_MODE

VBP

G1 O1
IN
G2 O2

12n

C126

C125

8.2p

C130

8.2p

RX_1800_M1
RX_1800_M1X
RX_1900_M2
RX_1900_M2X
RX_2100_H
RX_2100_HX
RX_900_L1
RX_900_L1X
RX_850_L2
RX_850_L2X

RX_850_L2

881.5MHz
VBAT

RFOUTL

3.3n

G1 O1
IN
G2 O2

FL105

5 4

C132

R105

L105
15n
C133

8.2p

1K

ENWY0003901(Hirose)

PWR Detector

SW101

4
SW102

ANT

ANT

COMMON
G3
3

C142

PA_POW_DET

33p

G4

L108

L107

C143

DNI

27n

U101

E8
E9
D8
A11
A1
L11
L1
K4
ALERT_N_UE
J4
100
H11
close to
G10
F10
G11
F11
SYS_CLK
K11
SYS_CLK_EN
J7
REF_CLK_EN
K10
J8
L9
K9
1.8V_SD 2.85V_RF21.8V_SD
J11
L10
J10
K7
L7
L8
H7
C124
0.1u
K8
L4
G8 Close to U1000 L4-pin
E4
C127
C128
C129
F6
10n
10n
10n
D7
(0603) (0603) (0603)
D5
A6
J3
B7
H4
F3
C3

A3
B2
B3
B4
B6
B8
B9
C2
C4
C5
C6
C7
D2
D3
D4
D6
E2
E3
E5
E6

942.5MHz

G1

TESTPIN3
TESTPIN2
TESTPIN1
CB4
CB3
CB2
CB1
RESET_N
ALERT_N
TESTPIN7
DI3_TX_DATX
DI3_TX_DAT
DI3_RX_DATX
DI3_RX_DAT
SYS_CLK
SYS_CLK_EN
REF_CLK_EN
TESTPIN6
FSYS4
FSYS2_EN
FSYS3
FSYS2
FSYS3_EN
AFC_DAC
XO
XO_SUP
VDD_IO
VDD_FSYS
C_EXT
VDD_VAR
VDD0_MAIN
VDD9_MAIN
VDD8_MAIN
VDD7_MAIN
VDD6_MAIN
VDD5_MAIN
VDD4_MAIN
VDD3_MAIN
VDD2_MAIN
VDD1_MAIN

RESET_N_UE
DI3_TX_DATX
PMB5703
DI3_TX_DAT
DI3_RX_DATX
DI3_RX_DAT
Differential 100ohm

4
C120

C121

10n

2.2p

DSA221SCL

VCC

OUT

VCONT

GND

3
2

X101

Close to X1000 4-pin


26MHz

2.85V_RF1

RX_900_L1

DNI

G2

FE_CTRL6
FE_CTRL5
FE_CTRL4
FE_CTRL3
FE_CTRL2
FE_CTRL1
TX3G_M2
TX3G_M1
TX3G_H
TX3G_L
PA_BIAS2
PA_BIAS1
PA_RAMP
PA_BSEL
PA_MODE
PA_EN4
PA_EN3
PA_EN2
PA_EN1
PA_POW_DET
PA_DC_DET
TX2G_L
TX2G_M
LNA_CTRL4
LNA_CTRL3
LNA_CTRL2
LNA_CTRL1
LNA1INT_CTRL
LNA1_IN
LNA1_OUT
RX_M1
RX_M1X
RX_M2
RX_M2X
RX_H
RX_HX
RX_L2
RX_L2X
RX_L1
RX_L1X
MI2
MI1

GND0
GND1
GND2
GND3
GND4
G N D5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
GND19

Band8/EGSM

RX_900_L1X

2 3
L132

56p

GSM_TX
DCS_PCS_TX
LNA_CTRL4
LNA_CTRL3
LNA_CTRL2
LNA_CTRL1

1.5p

4.7n

10p

C113

L104

FL104

5 4

L106

C111

PA_POW_DET

RX_850_L2X

2 3
1

12p

PA_EN_1900
PA_EN_2100
PA_EN_900

2140MHz

RX_850

C109

PA_RAMP

L103

FL103

5 4

C117

R102

RX_2100_HX

2 3
G1 O1
IN
G2 O2

TX3G_M1_1900
TX3G_H_2100
TX3G_L_900
CPL_EN

5.6n

K6
L6
L5
K5
J5
J6
A7
A8
A9
A10
E11
E10
B11
D11
D10
C8
C9
C11
B10
C10
D9
B5
A5
G3
H3
K3
K2
L3
A4
A2
B1
C1
D1
E1
F1
G1
H1
J1
K1
L2
H10
G9

R101

C103

33p

GND38
GND37
GND36
GND35
GND34
GND33
GND32
GND31
GND30
GND29
GND28
GND27
GND26
GND25
GND24
GND23
GND22
GND21
GND20

C102

RX_1800

J9
J2
H9
H8
H6
H5
H2
G7
G6
G5
G4
G2
F9
F8
F7
F5
F4
F2
E7

C101

2 3

DCS

DNI

U102
GND2

VEN

VDET

PIN

GND3

GND1

C134

C135

C136

C137

C138

C139

C140

C141

10n

10n

10n

1u

10n

10n

10n

1u

CPL_EN

2
3
C144
100p

PGND

VBAT
VBAT

Band2

L117

1.5n

20

CLK

19

VSPI
C178
1u

PA_RAMP

C179

0.1u

18
17

C180

16

15p

15
C185

15p

14

RX_L1

SS

GND2

DRW

RXTX_L2

U104

CLK
VSPI

GND3
RXTX_H

GND_SPI

GND4

VCMOS

RXTX_M1

VRAMP

GND5

GND_HB

RX_M2

TX_HB

27

DCS_PCS_TX

DET

RX_M3

GND4

7
6

DNI

C157

VCC2

VCC1

RFOUT

RFIN

ISO

VBP

GND

VMODE

CPL

VEN

FL107 3

1
C154

2
3

L130

33p

PA_MODE
PA_MODE2
PA_EN_1900

4
5

2.7n

G3
1
OUT IN
G2 G1
5 2

L131

2.7n

TX3G_M1_1900
C158
DNI

C107

100p
(0603)
100p
(0603)
100p
(0603)

GND3

CPL

L122

8.2n

PGND

DNI

1880MHz

RX_850

C153

33p

L119

3.9n

FL108
6

ANT

RX
TX

C131

2
4
5

DNI

GND1
GND2
GND3

C164

C165

1n

2.2u

C167
100p

1
L129

14

12
C174
0.5p

L124

11

DNI

10
9

CPL

897.5 MHz,942.5 MHz


10

Band1

RX_1900

12

C169

RX_1800

27p

L114

RFOUT_LOW

RFIN_LOW

GND3
VCC2
GND2

VMODE

U105

RFOUT_HI
GND1
CPL

ANT

RX
TX

L123

2
4
5

10n

VBP
VCC1
VEN_LOW
VEN_HI
RFIN_HI

C172

1
2

33p

4
2.7n

PA_MODE2
PA_MODE

3
4
5

PA_EN_900
PA_EN_2100

6
7

OUT

IN

C173

56p

G3 G2 G1

C177
DNI

TX3G_L_900
C176

DNI

897.5 MHz

FL110

2.2n

FL109

L113

1n

13

GND4
8
GND5
9
GND6

11

C162

VBAT

Band8

C161

C160

1880,1960MHz

GND1
GND2
GND3

1
3

L125

C184

21

GND6
GND5

C183

22

SS
DRW

GND1

GND1
GND2

L110

100p
(0603)
100p
(0603)
100p
(0603)
100p
(0603)

23

PA_POW_DET

VBAT

ANT

GND_LB

9
100p

15

1.8p

V_Q3_LB

26
1.8p

TX_LB

V_Q3_HB

24
C171

G_SLUG

25

1.2n

10

TX

13

L133

C170

11

RX

L109
8.2n

GSM_TX

U103

ANT

33p

C182

22p

100p

C181

C152

10n

C147

2.2u

PGND

C151

C146

1n

FL106

C148
C150
22u

C145

L115
C187

33p

FL111 3
4

2.7n

1.5n

G3
1
OUT IN
G2 G1
5 2

C188

GND4
8
GND5
9
GND6

C194

DNI

C104

1p

10p

TX3G_H_2100
C192

C193
1950MHz

DNI

DNI

2.85V_RF1

8.2p

C 197

2.7p

C 196

1950MHz, 2140MHz

C198

C199

10n

10p

L118
2.7n

CN10

CN11

CN6

CN9

CN7

CN4

CN1

CN20

CN19

CN18

CN13

CN14

CN15

CN17

C5026

33p
DNI

10
11
12
13

RFIN2
RFIN1

L120
2.7n

VCC

VGS

CN8

RREF
RFOUT2

U106

RFOUT1/4

RFGND1/2
RFIN4

RFOUT5
NC

RFIN5

15

CN5

VON

14

18p

CN12

C 1002

3.9p

CN2

C1001

C5028
CN3

LNA_CTRL3

DNI

RFGND4

VEN1

R109

VEN2

R110

LNA_CTRL4

GND

5
4
3
2
1

R106

27K
(1%)

RFOUTM
RFOUTH
RFOUTL

17

16

TOP Shieldcan Pad

18p

C1004

2.7p

C1003

LNA_CTRL1
LNA_CTRL2

L121
8.2n

LGE Internal Use Only

- 206 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

BASE BAND PROCESSOR(PM9801)

BOOT CONFIGURATION

VBAT

1.8V_SD

VBAT
2.3V_RTC 1.35V_PLL 2.85V_SIM 3.1V_USB

4.7K

R212

220n

C220

C221

22u

22u

RESET1_N
IFX_RESET

3.3u

DSP_AUDIO_IN1 HW_MON1

IPC_SRDY
MODEM_AP_WAKE
MODEM_WAKE
MODEM_PWR_CHK
MODEM_CHK

TP111

HW_MON2

0.1u
0.1u
0.1u
0.1u

U202
A8
C1
G1
G10
L1
N8

TRIG_IN

16-bit NAND boot

Flashless boot

NOR boot

4.7u

C223
C224
C225
C226

B9
C10
D9
E10
F9
H10
J9
K9
L10
M9

1.2V_MIPI
2.5V_ANA2
1.8V_SD

3.1V_USB

MEM_BUSY
MEM_WP

R221

C229
0.1u

C230
0.1u

C231 C232
0.1u 0.1u

C233
0.1u

1.8V_SD

1.3V_CORE

C236
0.1u

C237

2.3V_RTC

220n

X201
1

C238
220n

C239

FC-135
32.768KHz

18p

30K

U201

C240
18p

BT_PCM_SYNC
BT_PCM_DOUT
BT_PCM_DIN
BT_PCM_CLK

UART_TX_SW

USIF1_TX_IFX

USIF1_SW

UART4_RX_IPC

V+
NO1
COM1

10

NO2

NC2

NC1

GND

USIF1_RX_IFX

1.8V_SD

IN2

IN1

UART_RX_SW

COM2

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15

NC27
NC20
NC21
NC9
NC19
NC8
NC11
NC12
NC17
NC18
NC7
NC16
NC25
NC6
NC10
NC5
NC13
NC14
NC4
NC2
NC24
NC22
NC23
NC15
NC3

/CK
CK
CKE
/CS
/RAS
/CAS
/WED
UDQM
LDQM
UDQS
LDQS

MEM_AD0
MEM_AD1
MEM_AD2
MEM_AD3
MEM_AD4
MEM_AD5
MEM_AD6
MEM_AD7
MEM_AD8
MEM_AD9
MEM_AD10
MEM_AD11
MEM_AD12
MEM_AD14
MEM_AD15

K4
K5
K6
K7
J8
K8
J7
J5
E6
C5
D8
C6
C8
C7
B8
B7

MEM_A0
MEM_A1
MEM_A2
MEM_A3
MEM_A4
MEM_A5
MEM_A6
MEM_A7
MEM_A8
MEM_A9
MEM_A10
MEM_A11
MEM_A12
MEM_A13
MEM_A14
MEM_A15

G8
F8
D3
H2
F2
G2
J1
D7
H8
D5
H7

MEM_BFCLKO1
MEM_SDLKO
MEM_CKE
MEM_CS1_N
MEM_RAS_N
MEM_CAS_N
MEM_WR_N
MEM_DQM1
MEM_DQM0
MEM_STROBE1
MEM_STROBE0
R222

C234
C235

A5
M5

0.1u
0.1u

A9
B1
B5
B10
C9
D10
E9
F10
G9
H1
H9
J10
K10
L2
L9
M10
N6
N9

VBAT

IFX_USB_VBUS

USB_VBUS

C228
220n

Q201
1 S1

D1 6

2 G1

G2 5

3 D2

S2 4

VCC1
VCC2

VSS1
VSS4
VSS8
VSSQ5
VSSQ4
VSSQ9
VSSQ8
VSSQ3
VSS2
VSS3
VSSQ10
VSSQ1
VSSQ2
VSS5
VSSQ6
VSSQ7
VSS6
VSS7

IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
IO11
IO12
IO13
IO14
IO15

10K (0603)

/CE
/RE
/WE
CLE
ALE
/WP
R/B

M1
M2
M3
L5
N7
L6
M6
L8
N2
N3
M4
N4
N5
M7
L7
M8

1.8V_SD
MEM_AD0
MEM_AD1
MEM_AD2
MEM_AD3
MEM_AD4
MEM_AD5
MEM_AD6
MEM_AD7
MEM_AD8
MEM_AD9
MEM_AD10
MEM_AD11
MEM_AD12
MEM_AD13
MEM_AD14
MEM_AD15

A6
A3
A7
A4
B4
B3
B6

MEM_CS0_N
MEM_RD_N
MEM_WR_N
MEM_CLE_N
MEM_ALE_N
MEM_WP
MEM_BUSY

1.8V_SD

DUMMY INTERFACE
1.8V_SD

1.8V_VIO

1.8V_VIO

LGE Internal Use Only

- 207 -

27

26

25

24

23

22

10

21

11

20

12

19

13

18

14

17

15

16

JTAG_OMAP_TRST
JTAG_OMAP_TDI
JTAG_OMAP_TMS
JTAG_OMAP_TCK
JTAG_OMAP_RTCK
JTAG_OMAP_TDO
OMAP_PWR_RESET
UART3_TX_OMAP
UART3_RX_OMAP

C241

C242

DNI

DNI

DNI

28

DNI

29

DNI

DNI

DNI
R235

R234

2.3V_RTC
IFX_USB_VBUS

30

R233

OMAP_SEND
MODEM_SEND

R231

R230

USB_DP_IFX
USB_DM_IFX

IFX_USB_VBUS
USIF1_TX_IFX
UART_TX_IFX
UART_RX_IFX
USIF1_RX_IFX
MCSPI2_IPC_DOUT
MCSPI2_IPC_DIN
MCSPI2_IPC_CLK

need to apply 43.2ohm, 1%

TDO
TDI
TCK
TMS
TRSTN
TRIG_IN
HW_MON1
HW_MON2
DSP_AUDIO_IN1
26MHz_GPS_REF

SIM_CLK
SIM_RST
SIM_IO

10K

R236

TRSTN
TDI
TMS
TCK
TRIG_IN
TDO
RESET1_N
UART_TX_IFX
UART_RX_IFX

22K

R232

R227

CN201

PT201

R228

R229

43

K14
J14
J15
M15
J13
K13
H13
L14
L13
M14
M13
G11
E10
F12
E12
E11
L8
L7
R9
L5
U10
T10
H10
H9
G5
E8
E2
E1
F9
G19
G20
M17
L17
H17
H16
J17
J16
K17
K16
N11
N12
N9
P11
P10
K10
L10
A8
A9
A10
B10
B8
B9
H4
J4
K4
K5
K2
K1
L4
L2
L1
B7
A7
A6
A3
A4
A5
A2
B6
B5
B4
B3
C6
V6

SYS_CLK

VDDQ1
VDDQ6
VDDQ5
VDDQ4
VDDQ10
VDDQ9
VDDQ2
VDDQ8
VDDQ7
VDDQ3

J4
K1
K2
K3
B2
C2
D1
C3
D2
C4
J3
E2
E1
H3
J2

100n

MEM_AD15
MEM_AD14
MEM_AD13
MEM_AD12
MEM_AD11
MEM_AD10
MEM_AD9
MEM_AD8
MEM_AD7
MEM_AD6
MEM_AD5
MEM_AD4
MEM_AD3
MEM_AD2
MEM_AD1
MEM_AD0
MEM_A15
MEM_A14
MEM_A13
MEM_A12
MEM_A11
MEM_A10
MEM_A9
MEM_A8
MEM_A7
MEM_A6
MEM_A5
MEM_A4
MEM_A3
MEM_A2
MEM_A1
MEM_A0

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
BA0
BA1

UART4_TX_IPC

C227

IFX_USB_VBUS_EN
(Active high)

VDD1
VDD2
VDD3
VDD5
VDD4
VDD6

A1
A10
N1
N10

MEM_CS1_N
MEM_CS0_N

U203

100K

MEM_WR_N
MEM_RD_N
MEM_ALE_N

VBAT

R220

MEM_CLE_N

Analog switch for USIF1

M0
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
CC_CLK
CC_RST
CC_IO
DPLUS
DMINUS
TDO
TDI
TCK
TMS
TRST_n
TRIG_IN
HW_MON1
HW_MON2
DSP_AUDIO_IN1
CLKOUT0
T_OUT0
T_OUT1
CLK32K
EPN1
EPP1
EPPA1
EPPA2
MICP1
MICN1
AUX1P
AUX1N
AUX2P
AUX2N
MMCI1_CMD
MMCI1_CLK
MMCI1_CD
MMCI1_DAT_0
MMCI1_DAT_1
MMCI1_DAT_2
MMCI1_DAT_3
USB_TEST
USB_DPLUS
USB_DMINUS
USB_TUNE
USB_ID
VBUS1
USIF1_TXD_MTSR
USIF1_RTS_n
USIF1_CTS_n
USIF1_RXD_MRST
USIF3_TXD_MTSR
USIF3_RXD_MRST
USIF3_SCLK
USIF3_RTS_n
USIF3_CTS_n
KP_IN0
KP_IN1
KP_IN2
KP_IN5
KP_IN4
KP_IN3
KP_IN6
KP_OUT0
KP_OUT1
KP_OUT2
KP_OUT3
NC_13
NC_14

4.7K

MEM_SDLKO
MEM_STROBE1
MEM_STROBE0
MEM_DQM1
MEM_DQM0
MEM_CAS_N
MEM_RAS_N

PMIC

Y7
Y8
Y5
Y6
Y9
Y10
R2
T1
T2
T4
T5
U1
U2
V1
V2
W1
W2
W3
Y2
Y3
H7
H5
H8
J7
J8
J1
J2
H1
H2
M19
M20
M18
M16
L16
L19
L20
K19
J20
J18
H19
J19
K20
U8
U7
U6
U5
U4
W6
W5
W4
Y4
U16
P13
P14
N13
T17
R16
N14
R17
P16
R18
P17
N16
N17
P19
N19
N20
Y16
Y15
W16
W17
W18
Y18
W19
Y19
W20
V19
V20
T19
T20
R19
R20
P20

A2
D4
D6
E3
E4
E5
E7
E8
F1
F3
F4
F5
F6
F7
G3
G4
G5
G6
G7
H4
H5
H6
J6
L3
L4

4.7K

PCM_IFX_OMAP_DOUT
PCM_IFX_OMAP_CLK
MEM_CKE
MEM_BFCLKO1

R219

4.7K

R218

4.7K

R217

1.8V_SD

SWIF_TXRX
MMCI3_DAT[3]
MMCI3_DAT[2]
MMCI3_DAT[1]
MMCI3_DAT[0]
MMCI3_CD
MMCI3_CLK
MMCI3_CMD
MMCI2_DAT[3]
MMCI2_DAT[2]
MMCI2_DAT[1]
MMCI2_DAT[0]
MMCI2_CD
MMCI2_CLK
MMCI2_CMD
MEM_CKE
MEM_BFCLKO_1
MEM_BFCLKO_0
MEM_SDCLKO
MEM_BC3_n
MEM_BC2_n
MEM_BC1_n
MEM_BC0_n
MEM_CAS_n
MEM_RAS_n
MEM_WAIT_n
MEM_WR_n
MEM_RD_n
MEM_ADV_n
MEM_CSA0_n
MEM_CS2_n
MEM_CS1_n
MEM_CS0_n
FCDP_RBn
FWP
VDD_FUSE_FS
VDD_FUSE_LS
VDD_USB_HS_PHY
VDD_USB_DIG
VDD_USB
VDD_MIPI_SLAVE
VDD_MIPI_MASTER
VDD_MIPI_BGC
VDD_MIPI_PLL
MIPI_R_EXT
VDDP_MMC
VSS_MAIN_19
VSS_MAIN_18
VSS_MAIN_17
VSS_MAIN_16
VSS_MAIN_15
VSS_MAIN_14
VSS_MAIN_13
VSS_MAIN_12
VSS_MAIN_11
VSS_MAIN_10
VSS_MAIN_9
VSS_MAIN_6
VSS_MAIN_5
VSS_MAIN_4
VSS_MAIN_3
VSS_MAIN_2
VSS_MAIN_1
VDDP_DIG_MS
VDDP_DIG_6
VDDP_DIG_5
VDDP_DIG_4
VDDP_DIG_3
VDDP_DIG_2
VDDP_DIG_1
VDD_CORE_6
VDD_CORE_5
VDD_CORE_4
VDD_CORE_3
VDD_CORE_2
VDD_CORE_1
VSS_RTC
VDD_RTC
OSC32K
F32K
F26M

CSI_CLKN
CSI_CLKP
CSI_DN2
CSI_DP2
CSI_DN1
CSI_DP1
CIF_RESET_GPIO
CIF_PD_GPIO
CLKOUT2
CIF_VSYNC
CIF_HSYNC
CIF_PCLK
CIF_D7
CIF_D6
CIF_D5
CIF_D4
CIF_D3
CIF_D2
CIF_D1
CIF_D0
I2S1_WA0
I2S1_TX
I2S1_RX
I2S1_WA1
I2S1_CLK0
I2C2_SDA
I2C2_SCL
I2C1_SDA
I2C1_SCL
CP2
CP1
VDD_CPN
VUMIC
VMIC
HP_SPK2N
HP_SPK2P
HP_SPK1N
HP_SPK1P
VSS_HF_SPK_2
VSS_HF_SPK_1
VBAT_HF_SPK_2
VBAT_HF_SPK_1
MIPI1_DATA7
MIPI1_DATA6
MIPI1_DATA5
MIPI1_DATA4
MIPI1_DATA3
MIPI1_DATA2
MIPI1_DATA1
MIPI1_DATA0
MIPI1_CLK
MEM_AD15
MEM_AD14
MEM_AD13
MEM_AD12
MEM_AD11
MEM_AD10
MEM_AD9
MEM_AD8
MEM_AD7
MEM_AD6
MEM_AD5
MEM_AD4
MEM_AD3
MEM_AD2
MEM_AD1
MEM_AD0
MEM_A15
MEM_A14
MEM_A13
MEM_A12
MEM_A11
MEM_A10
MEM_A9
MEM_A8
MEM_A7
MEM_A6
MEM_A5
MEM_A4
MEM_A3
MEM_A2
MEM_A1
MEM_A0

R223

PCM_IFX_OMAP_FSYNC
PCM_IFX_OMAP_DIN

J6
D1
D2
C1
C2
D4
B1
B2
E5
D5
D6
D7
G4
E4
D8
U11
W14
U14
W13
Y17
U20
W15
U19
T14
T13
U15
U13
U12
V15
T11
T12
R12
P12
T9
V9
P8
P9
D9
D10
C9
W7
W11
W8
W12
W10
N10
W9
V12
M3
J3
H20
P7
G7
R4
F4
D16
D11
T16
T7
L11
K7
E7
B11
H14
R3
F3
U17
T6
K8
E6
R5
F5
T15
T8
K11
E9
C12
B12
A11
A12
D13

RESET2_N
RESET_CMP
CHRG_EN
I2C_INT
CMP_EN
REF_CLK_EN
FSYSEN
Di3_RX_DAT
Di3_RX_DATX
Di3_TX_DAT
Di3_TX_DATX
SYSCLKEN
XRESET
ALERT_N
VRE F
VDD_VBAT_SD1_1
VDD_VBAT_SD1_2
VSD1_1
VSD1_2
SD1_FB
VSS_SD1_1
VSS_SD1_2
VDD_VBAT_SD2_1
VDD_VBAT_SD2_2
VSD2_1
VSD2_2
SD2_FB
VSS_SD2_1
VSS_SD2_2
ON_OFF1
ON_OFF2
RESET1_N
RESET_PMU_N
PWR_ON_CMP
PMUMEAS
VDD_LVDS
VANA1
VANA2
VSS_ANA
VDD_VBAT_LDO
VDD_OSD2
VRF2
VDD_VBAT_RF12_1
VRF1
VDD_VBAT_RF12_2
VSS_RF12
VMIPI
VDD_VRTC
VDD_VPLL
VDD_VSIM
VDD_VUSB
VDD_VPMU
DIF_D0
DIF_D1
DIF_D2
DIF_D3
DIF_D4
DIF_D5
DIF_D6
DIF_D7
DIF_D8
DIF_D9
DIF_CS1
DIF_CS2
DIF_CD
DIF_WR
DIF_RD
DIF_HD
DIF_VD
DIF_RESET1
DSI_DP1
DSI_DN1
DSI_CLKP
DSI_CLKN
NC_9
NC_10
NC_11
NC_12

U9
G9
J5
G1
G8
G10
F2
B14
B13
A14
A13
F1
G2
H11
A 15
A18
B17
A19
B18
A17
B19
C19
D 17
E 17
B20
C20
E20
D20
D19
G14
G13
G12
F20
H12
E19
D12
G16
F18
B16
E 16
E14
D15
B15
A16
D14
C15
F16
G 17
E13
F19
E15
F17
P5
R1
P2
P1
N7
M6
N5
N4
N2
N1
M8
M7
M5
M4
M2
M1
N8
P4
Y13
Y14
Y 11
Y12
A1
Y1
A20
Y20

TP110

IPC_MRDY

L201

3.3u
L202

DI3_TX_DAT
DI3_TX_DATX
SYS_CLK_EN
RESET_N_UE
ALERT_N_UE

REF_CLK_EN

100

C222

10K (0603)

220n

C219

10K (0603)

C202

1.8V_SD

10K (0603)

R207

R206

INFINEON MEMORY
DSP_AUDIO_IN1
HW_MON1
HW_MON2
TRIG_IN

R226

0.1u

R225

0.1u

R224

C216

NC1
NC26
NC28
NC29

C215

1u

DNI

C214

220n

DNI

C213

0.1u

4.7K

C212

220n

R204

R201
C211

100n 10u

R202

C209 C210

1u

4.7K

C208

1u

R208

C207

220n

R205

C206

100n 10u

10K

R211

DI3_RX_DAT

C204 C205

220n

390K

10u

C203

10n

220K

10u

C201

IFX_PWRON

C218

DI3_RX_DATX

C217

1.8V_SD

4.7K

IFX_USB_VBUS

1.3V_CORE

R203

1.2V_MIPI

DNI

1.8V_SD 2.85V_RF2 2.85V_RF1

R210

2.5V_ANA2

RD2N0I9

1.35V_PLL

VBAT

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

LGE Internal Use Only

CLK32K_TWL

26M_REF

TWL_CLK_REQ

MICROSD_DET_N

1.8V_VIO
OMAP_PWR_RESET
PWR_WARM
SYS_IRQ_N
SYS_OFF_MODE

D NI

10 K

R305

R306

EAR_SENSE

AE17

AG25

SYS_XTALIN
AF17
SYS_XTALOUT
AE25
SYS_32K

SYS_CLKOUT1
AE22
SYS_CLKOUT2
AF25
SYS_CLKREQ

AH25

SYS_NRESPWRON
AF24
SYS_NRESWARM
AF26
SYS_NIRQ
AF22
SYS_OFF_MODE

TV_OUT2
TV_OUT1
TV_VFB1
TV_VFB2
TV_VREF

100K

470

W28
Y28
Y27
W27
W26

100K

R307

J 25

1.8V_VIO

100ohm matching!

HDQ_SIO

BT_WAKEUP
LCD_TE
LCD_CS
LCD_MAKER_ID
VIBE_PWM
VIBE_EN
COM_INT
1.8V_VIO
EAR_MICBIAS_EN
VT_RESET_N
LCD_CP_EN
ONENAND_INT
UART4_TX_IPC
UART4_RX_IPC

AB26
AB25
AA25
AD25

R312
4.7K

BT_UART_CTS_N
BT_UART_RTS_N
BT_UART_TXD
BT_UART_RXD

H18

HOOK_DIG

UART3_CTS_RCTX
GPIO
163
H19
UART3_RTS_SD
GPIO 164
H20

Also connected to TWL 'HOOK_ADC'

UART3_RX_OMAP
UART3_TX_OMAP

UART3_TX_IRRX
H21
UART3_TX_IRTX
AA8

GPS_UART_TXD
GPS_UART_RTS_N
GPS_UART_CTS_N
GPS_UART_RXD

UART1_TX
AA9
UART1_RTS
W8
UART1_CTS
Y8
UART1_RX

1.8V_VIO

DNI

4.7K

4.7K

R316

R317

4.7K

R315

BOOT CONFIGURATION
SYS_BOOT0 SYS_BOOT1 SYS_BOOT2 SYS_BOOT3 SYS_BOOT4 SYS_BOOT5 SYS_BOOT6

4.7K

DNI
R323

OneNAND boot

4.7K

TP303

G4
H3
V8
U8
T8
R8
P8
N8
T4
F4
G2
F3
G3
U3
H1
M8
L8
K8
J8

R321

I2C4_SCL
I2C4_SDA

I2C3_SCL
I2C3_SDA

JTAG_OMAP_TDO
JTAG_OMAP_TRST
JTAG_OMAP_TMS
JTAG_OMAP_TDI
JTAG_OMAP_TCK
JTAG_OMAP_RTCK

JTAG_TDO
JTAG_NTRST
JTAG_TMS_
JTAG_TDI
JTAG_TCK
JTAG_RTCK
JTAG_EMU0
JTAG_ENU1

AA19
AA17
AA18
AA20
AA13
AA12
AA11 R308
AA10 R309

AG19

CSI2_DX0
AH19
CSI2_DY0
AG18
CSI2_DX1
AH18
CSI2_DY1

C25
B26
C27
A 23
A 24
C23
B 23
D25
AG17
AH17
B2 4
C24
D24
A25
K28
L28
K27
L27
B 25
C26

AD26

I2C4_SCL
AE26
I2C4_SDA

CAM_XCLKA
CAM_XCLKB
CAM_PCLK
CAM_VS
CAM_HS
CAM_FLD
CAM_WEN
CAM_STROBE
CAM_D0
CAM_D1
CAM_D2
CAM_D3
CAM_D4
CAM_D5
CAM_D6
CAM_D7
CAM_D8
CAM_D9
CAM_D10
CAM_D11

- 208 -

D6
C6
B6
C8
C9
A7
B9
A9
C14
B14
C15
B16
D17
C17
B17
D18
D11
B10
C11
D12
C12
A11
B13
D14
C18
A19
B19
B20
D20
A21
B21
C21

R322

Fiducial1

GAUGE_INT
MODEM_SEND
MODEM_CHK

U305

I2C2_SCL
I2C2_SDA

UART2_CTS
UART2_RTS
UART2_TX
UART2_RX

4G LPDDR
1

AF14

GPMC_WAIT0

GPIO 63GPMC_WAIT1
GPIO 64GPMC_WAIT2
GPIO 65GPMC_WAIT3

4.7K

MMC2_CLK
MMC2_CMD
MMC2_DAT0
MMC2_DAT1
MMC2_DAT2
MMC2_DAT3
MMC2_DAT4
MMC2_DAT5
MMC2_DAT6
MMC2_DAT7

R314

36

AE2
AG5
AH5
AH4
AG4
AF4
AE4
AH3
AF3
AE3

R318

POP memory

R324

DNI

MMC_CLK
MMC_CMD
MMC_DAT0
MMC_DAT1
MMC_DAT2
MMC_DAT3
MMC_DAT4
MMC_DAT5
MMC_DAT6
MMC_DAT7

DN I

OMAP_SEND
KEY_LED_RESET
MODEM_AP_WAKE

4.7K

CTS

GPMC_CLK
GPMC_NWE
GPMC_NOE
GPMC_NADV_AL

GPIO GPMC_NBE0_CL
60
GPIO 61 GPMC_NBE1
GPIO 62 GPMC_NWP

R320

RTS

MMC1_CLK
MMC1_CMD
MMC1_DAT0
MMC1_DAT1
MMC1_DAT2
MMC1_DAT3
MMC1_DAT4
MMC1_DAT5
MMC1_DAT6
MMC1_DAT7

R319

DSR

N28
M27
N27
N26
N25
P28
P27
P26
R27
R25

R313

NC4

10

SYS_BOOT0
SYS_BOOT1
SYS_BOOT2
SYS_BOOT3
SYS_BOOT4
SYS_BOOT5
SYS_BOOT6

NC3

R311

AH26
AG26
AE14
AF18
AF19
AE21
AF21

NC2

MICROSD_CLK
MICROSD_CMD
MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT3

21
22
23
24
25
26
27
28
29

VBAT

GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD

GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO

ON_SW

52 GPMC_NCS1
53 GPMC_NCS2
54 GPMC_NCS3
55 GPMC_NCS4
56 GPMC_NCS5
57 GPMC_NCS6
58 GPMC_NCS7

LCD_RESET_N
TOUCH_INT_N
VT_CAM_PWDN
CAM_SUBPM_EN
MODEM_PWR_CHK
MODEM_WAKE
MUIC_INT_N
GYRO_INT_N
MOTION_INT
BT_HOST_WAKEUP

TP302

NC1

TP301

TX

GPIO 14
GPIO 15
GPIO 16

RX

ETK_CLK
ETK_CTL
ETK_D0
ETK_D1
ETK_D2
ETK_D3
ETK_D4
ETK_D5
ETK_D6
ETK_D7
ETK_D8
ETK_D9
ETK_D10
ETK_D11
ETK_D12
ETK_D13
ETK_D14
ETK_D15

GND

OMAP_UART_SW
IFX_UART_SW

PWR_ON_SW

MCBSP1_CLKR
MCBSP1_FSR
MCBSP1_DX
MCBSP1_DR
MCBSP1_CLKS
MCBSP1_FSX GPIO 161
MCBSP1_CLKX GPIO 162

1
2
3
4
5
6
7
8
9
10
11
12

UART_RX_IFX
UART_TX_IFX

3G

GPMC_NCS0

Y21
AA21
V21
U21
T21
K26
W21

2.5G

NC43
NC21
NC24
NC7
NC42
NC44
NC41
NC20
SDRC_D8
SDRC_D9
SDRC_D10
SDRC_D11
SDRC_D12
SDRC_D13
SDRC_D14
SDRC_D15
NC18
NC16
NC14
NC1
NC32
NC4
NC5
NC3
NC2
NC33
NC15
NC17
NC25
NC22
NC37
NC34

GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO

PCM_IFX_OMAP_CLK
PCM_IFX_OMAP_FSYNC
PCM_IFX_OMAP_DOUT
PCM_IFX_OMAP_DIN

UAT301

HSUSB0_DATA0
HSUSB0_DATA1
HSUSB0_DATA2
HSUSB0_DATA3
HSUSB0_DATA4
HSUSB0_DATA5
HSUSB0_DATA6
HSUSB0_DATA7
HSUSB0_CLK
HSUSB0_STP
HSUSB0_DIR
HSUSB0_NXT

VBAT VCHG

N4
M4
L4
K4
T3
R3
N3
M3
L3
K3

34 GPMC_A1
35 GPMC_A2
36 GPMC_A3
37 GPMC_A4
38 GPMC_A5
39 GPMC_A6
40 GPMC_A7
41 GPMC_A8
42 GPMC_A9
43 GPMC_A10

U301

T27
U28
U27
U26
U25
V28
V27
V26
T28
T25
R28
T26

MIC_SEL

DSS_DATA0
DSS_DATA1
DSS_DATA2
DSS_DATA3
DSS_DATA4
DSS_DATA5
DSS_DATA6
DSS_DATA7
DSS_DATA8
DSS_DATA9
DSS_DATA10
DSS_DATA11
DSS_DATA12
DSS_DATA13
DSS_DATA14
DSS_DATA15
DSS_DATA16
DSS_DATA17
DSS_DATA18
DSS_DATA19
DSS_DATA20
DSS_DATA21
DSS_DATA22
DSS_DATA23
DSS_PCLK
DSS_HSYNC
DSS_VSYNC
DSS_ACBIAS

USB_D[0]
USB_D[1]
USB_D[2]
USB_D[3]
USB_D[4]
USB_D[5]
USB_D[6]
USB_D[7]
USB_CLK
USB_STP
USB_DIR
USB_NXT

Array TP

AG22
AH22
AG23
AH23
AG24
AH24
E26
F28
F27
G26
AD28
AD27
AB28
AB27
AA28
AA27
G25
H27
H26
H25
E28
J26
AC27
AC28
D28
D26
D27
E27

LCD_MIPI_D0_P
LCD_MIPI_D0_N
LCD_MIPI_D1_P
LCD_MIPI_D1_N
LCD_MIPI_CLK_P
LCD_MIPI_CLK_N

152
153
154

10n

MCBSP4_FSX GPIO 155

IFX_RESET
C303

MCBSP3_FSX

AE 1
MCBSP4_CLKX GPIO
AD1
MCBSP4_DR GPIO
AD2
MCBSP4_DX GPIO
AC1

IFX_PWRON

GPS_PWR_ON
GPS_RESET_N
FLASH_LED_TORCH
FLASH_LED_EN

GND

MCBST2_DX

_OE

AF 6
MCBSP3_DX
AE 6
MCBSP3_DR
AF 5
MCBSP3_CLKX
AE 5

B2

BT_PCM_DOUT
BT_PCM_DIN
BT_PCM_CLK
BT_PCM_SYNC

5 1K

A2

R310

10n

B1

I2S_FSYNC
I2S_CLK
I2S_DIN
I2S_DOUT

VCCB

A1

GPIO 181
GPIO 182

C302

VCCA

MCSPI2_CS1

IFX_RESET_1.8V

100K

R325

IFX_PWRON_1.8V

P21
MCBSP2_FSX
N21
MCBSP2_CLKX
R21
MCBSP2_DR
M21

2.3V_RTC

U302

SDRC_NRAS
SDRC_NCAS
SDRC_NWE
SDRC_CLK
SDRC_NCLK
SDRC_CKE1
SDRC_CKE0
SDRC_NCS1
SDRC_NCS0
NC39
NC27
SDRC_DM1
NC8
NC45
NC40
SDRC_DQS1
NC38

K1
L1
L2
P2
T1
V1
V2
W2
H2
K2
P1
R1
R2
T2
W1
Y1

GPMC_D0
GPMC_D1
GPMC_D2
GPMC_D3
GPMC_D4
GPMC_D5
GPMC_D6
GPMC_D7
GPMC_D8
GPMC_D9
GPMC_D10
GPMC_D11
GPMC_D12
GPMC_D13
GPMC_D14
GPMC_D15

GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO

TP305

H14
H13
H15
A13
A14
H17
H16
H12
H11
C20
B11
A16
B7
A20
A10
A17
A6

NC35
NC9
NC10
NC11
NC12
NC13
NC19
NC29
NC26
NC28
NC30
NC23
NC31
NC36
NC6

MCSPI1_CLK
MCSPI1_SIMO
MCSPI1_SOMI
MCSPI1_CS0
MCSPI1_CS1
MCSPI1_CS2
MCSPI1_CS3

LEVEL SHIFTER
1.8V_VIO

TP309

SDRC_BA0
SDRC_BA1

AB 3
AB 4
AA 4
AC2
AC3
AB 1
AB 2

E1
E2
D1
D2
D3
D4
C1
C2
C3
D5
C4
C5
B3
B4
A4

I2C3_SCL
AG14
I2C3_SDA

K 21

C301

H9
H10

AF15

Internal pull-up at I2C1 and I2C4

I2C2_SCL
AE15
I2C2_SDA

GND

I2C1_SCL
J21
I2C1_SDA

SEL0

TP308

12
3

GPIO 176
GPIO 177

VCC

TP307

AA 3
MCSPI2_CLK
Y2
MCSPI2_SIMO
Y3
MCSPI2_SOMI
Y4
MCSPI2_CS0
V3

SEL1

TP306

UART_RX

TP304

MCSPI2_IPC_CLK
MCSPI2_IPC_DOUT
MCSPI2_IPC_DIN
WLAN_WAKEUP
USIF1_SW

11

D-

1u

HSD2HSD3-

AF10
AE10
AF11
AG12
AH12
AE13
AE11
AH9
AF13
AH14
AF 9
AG9
AE 7
AF 7
AG7
AH7
AG8
AH8

UART_TX

HSD1-

WLAN_CLK
WLAN_CMD
PROX_OUT
CHG_STATUS_N_OMAP
BT_EN
WLAN_SDIO[3]
WLAN_SDIO[0]
WLAN_SDIO[1]
WLAN_SDIO[2]
IPC_SRDY
IPC_MRDY
WLAN_EN
WLAN_HOST_WAKEUP
CHG_EN_SET_N_OMAP
IFX_RESET_1.8V
IFX_PWRON_1.8V
CRADLE_DETECT_N
CARKIT_DETECT_S

HSD3+

R327

D+

R301
R302
R303
R304

HSD2+

IFX_UART_SW

OMAP_UART_SW

HSD1+

8
10

5M_MCLK
VT_MCLK
VT_PCLK
VT_VSYNC
VT_HSYNC
5M_RESET_N
5M_CAM_VCM_EN

IC301
6

UART3_TX_OMAP
UART_TX_SW
USB_DP_IFX
UART3_RX_OMAP
UART_RX_SW
USB_DM_IFX

DNI

DN I

R326

1.8V_VIO

4.7K
4.7K
4.7K
4.7K

I2C1_SCL
I2C1_SDA

1.8V_VIO

5M_MIPI_CLK_P
5M_MIPI_CLK_N
5M_MIPI_DATA0_P
5M_MIPI_DATA0_N

VBAT

VT_DATA[0]
VT_DATA[1]
VT_DATA[2]
VT_DATA[3]
VT_DATA[4]
VT_DATA[5]
VT_DATA[6]
VT_DATA[7]

DP3T SWITCH

5M_MIPI_DATA1_P
100ohm matching!
5M_MIPI_DATA1_N
IFX_USB_VBUS_EN

OMAP3630

eMMC boot

External boot

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

TWL5034

OMAP3x30 Power

Resistane depending on PCB revision


Revision

68kohm / 6.2kohm

Rev.B

68kohm / 10kohm

Rev.C

68kohm / 15kohm

Rev.D

68kohm / 20kohm

Rev.E

68kohm / 24kohm

Rev.F

68kohm / 30kohm

Rev.G

68kohm / 36kohm

A11
B13
A13
C432

1u

N16
C13
K11
J11
H8

T1

P15
P16
N10
G15
F15
F16
H4
J3

BATT_THM_ADC

G3
J9
B1
D8

PCB_VER_ADC
HOOK_ADC

VDD1_CORE

N11
P11
N8
N9
L10

C476 C478 C479 C480

BOOT0

2.2u 1u

0.1u

0.1u

AUDIO LDO

N14

M4

A2

P1 3

GPIO_7

GPIO_2

GPIO_6

GPIO_15

RFID_EN

L4

P1 2

N1 2

GPIO_1

GPIO_0

C5034

0.1u

0.1u

C414

C413
F1

G1

AUXL

C455

C411

C5035
0.1u
MIC_SUB_M

0.1u
G2

D2

H2

0.1u
F2

MIC_MAIN_P

MIC_SUB_P

ICTLAC2
ICTLUSB2

MSECURE

VPRECH
PCHGAC

PCM_VCK

PCHGUSB
VCCS

PCM

PCM_VDX

VBATS

PCM_VFS

VBAT
BCIAUTO

GPIO_17
GPIO_16

BKBAT

I2S_CLK

IO_1P8

I2S_SYNC

I2S

I2S_DIN

VBAT_RIGHT_02

I2S_DOUT

HF SET

JTAG_TCK

VBAT_RIGHT_01
VBAT_LIFT_02
VBAT_LEFT_01

JTAG_TDI
TEST

VMMC2_IN

TESTV2

VMMC1_IN

NC

TESTV1
TEST_RESET

VAUX4_IN
VBAT_USB

32KXOUT

PWR IN

32KXIN
32KCLKOUT

VDAC_IN
VAUX12S_IN
VPLLA3R_IN

LEDB

VINT_IN

LEDA
LEDSYNC

VSDI_CSI_OUT

LEDGND

VPLL1_OUT
VDAC_OUT

ADCIN0

VSIM_OUT

ADCIN1

VMMC2_OUT

ADC

ADCIN2

LDO PWR

START_ADC

VMMC1_OUT
VAUX4_OUT
VAUX3_OUT

UART1_TXD

VAUX2_OUT

UART

UART1_RXD

VAUX1_OUT

RTSO

VINTUSB1P8_OUT

CTSI

VINTUSB1P5_OUT

ADC

TXAF

VUSB_3P1

RXAF

VINTDIG_OUT

MANU

VRTC_OUT

DGND_01

DGND_04

H13

DGND_03

H11

H10

DGND_02
H9

KPD_C7

KPD_C6

KPD_C5

KPD_C4

F4

H6

G4

G7

KPD_C3

F7

KPD_C1

KPD_C2

G6

KPD_C0

VINTANA2_OUT_02
VINTANA2_OUT_01
VINTANA1_OUT

E13

C421

C420

0.1u

10u

C14
D15
D16

L402

1u

VDD1_CORE

B15
C15
C16

C422

C423

0.1u

22u

C426

C427

0.1u

10u

R13
P14
N13
T13
R14

L403

VDD2_CORE

1u

T14
R15

C424

C425

0.1u

10u

P3
R4
N3
R3
T4

L404

1u

1.8V_VIO

C430

R2

C428

C429

0.1u

10u

C431

0.1u

T3

10u

N5
N7
P2
P6

VBAT

P1
N2
N4
N6

C434

P5

1u

C433
4.7u

P4
R5
N1
BAT401

M14
C8

1.8V_VIO

D11
D12

C435

D9

VBAT

C436

1u

D10

1u

A3
C1
B2
R9
K1
L1
H15
K15
J15

1.8V_AUDIOAMP
1.8V_PLL1
1.8V_MOTION_VIO
1.8V_WLAN
1.8V_MMC_EN
VT_CAM_DRV_2.8V
1.8V_CSI2
VT_CAM_IO_1.8V
3.0V_MOTION
2.8V_PROXI

H14
L2
K2
A4
C2
B3
G16
M3
M2
P10

C461

1u

C451 C452 C5019 C454 C5018 C456 C457 C5017 C459

C460

P8

C462

1u

1u

1u

C463

1u

1u

1u

1u

1u

1u

1u

1u

1u

P9
L16
K16

C482

1u

B6

C483

1u

C484

1u

3.1V_VUSB

J2
H3

C485
1u

KEY_C[0]

H7

KPD_R7

KPD_R5

KPD_R3

KPD_R4

KPD_R2

KPD_R1

KPD_R6

L7

G8

K10

J1 0

L9

L8

K8

KPD_R0
C493 C494 C495

2.2u 1u

VAC
ICTLAC1
ICTLUSB1

BOOT1

PCM_VDR

R401

DNI

FM_AUDIO_L
FM_AUDIO_R

SYSEN

K9

VDD2_CORE

C490 C491 C492

MICBIAS2_OUT

C453

VREF

KEY_R[0]
KEY_R[1]
KEY_R[2]

VDD2_CORE

10u 2.2u 1u

MIC_MAIN_M

C415

0.1u

0.1u

0.1u

F3

E2

MICBIAS1_OUT

E4

B8

D1

HSMIC_M

B5

E3

HSMIC_P

B4

B7

VMID

HSOL

HSOR

ADCIN7

VHSMIC_OUT

B12

B11

A7

EAR_P

U402

SYS Boot

NRESPWRON

0.1u 0.1u 0.1u 0.1u

C486 C487 C488 C489


0.1u

EAR_M

NRESWARM

MICBIAS_GND

W13
Y13
W14
J16
K16
J17
K17
W17
Y17
C19
D19
K19
L19
P19
R19
V19
W19
L20
M20
R20
T20
AE20
AF20
D21
C22
W25
Y25
AC25
A26
L26
R26
AC26
B27
G27

A1

KEY_LED_HIGH

VIO_GND_01
VIO_GND_02

AGND

K3

T16

ONENAND_INT

INT2
PWRON

AVSS4

K4

VIO_FB
VIO_SW_01
VIO_SW_02

AVSS3

K6

A16

CLK32K_TWL

INT1

AVSS2

PWR_WARM

VIO_IN2

VIO

I2C_CNTL_SCL

E15

D3

1u

VIO_IN1

I2C_CNTL_SDA

C7

1u

ID

N15

1u

X402

1u

C438 C439 C440 C441

DN

R10

L3

A15

FC-135

32.768KHz

AG13

VDD2_GND_02

M15

T15
R16

B16

POP_RESET_RP_FT
AH16
POP_TQ_TEMP_SENSE_FT
AH13
POP_FLASH_VPP_FT
AH11
POP_INT1_FT
AG11
POP_INT0_FT

DP

AVSS1_5

AH20

VDD2_SW_02

AVSS1_4

T2

VDD2_SW_01
VDD2_GND_01

AVSS1_3

C437

15p

V4

CAP_VDD_SRAM_MPU_IVA
L21
CAP_VDD_SRAM_CORE

I2S_CLK
I2S_FSYNC
I2S_DOUT
I2S_DIN

VDD2_FB

VDD2.CORE

VBUS

J8

R1

C3

AA15

DATA6
DATA7

10K

C5

1.8V_CSI2

VDD2_IN_02

J7

BT_PCM_CLK
BT_PCM_DOUT
BT_PCM_DIN
BT_PCM_SYNC

10K
R408

DATA5

E5

1.8V_VIO

R407

VDDW_IN_01

USB

AVSS1_1

VBAT

1.8V_VIO

DATA4

AVSS1_2

PWR_WARM
OMAP_PWR_RESET

VDD1_GND_01

DATA3

J6

PWR_ON_SW

VDD1_GND_03
VDD1_GND_02

DATA2

E14

1u

F9

DATA0
DATA1

D14

1u

D5

VDD1_SW_01

R6

1u

D4
F10

NXT

J4

1.8V_PLL1

R11

I2C1_SDA
I2C1_SCL
SYS_IRQ_N

VDD1_SW_02

GND_RIGHT_01

AA16

T11

DIR

GND_RIGHT_02

VBAT
3.0V_MMC

K15

R8
T10

VDD1_SW_03

T6

1u

F13

VDD1_FB

VDD1_CORE

VBAT

T7

C 449

F14

VDD1_IN_01
STP

R7

1u

J13

VDD1_IN_02

UCLK

10K

C 448

J14

G13

VDD1_IN_03

CLK256FS

R406

1u

K13

G14

CLKREQ

G9

C447

K14

CP_GND

CLKEN2

I2C4_SDA
SYS_OFF_MODE

P7

1u

L13
M13

CP_CAPM

CLK

CLKEN

C4

C446

L14

CP_CAPP

HFCLKOUT

I2C4_SCL

B14

1u

L15

CP_IN
HFCLKIN

D6

C445

D13

USB_DP_TWL
USB_DM_TWL
3.1V_VUSB

W16

AG20

VDD2_CORE

NSLEEP1

A10
F8

C444

D7

90ohm matchingUSB_VBUS
!!

V25

47n 10n 0.1u

NC

GPIO

GND_LEFT_01

AD3
W4
AD4
AE8
AF8
AE16
AF16
AE23
AF23
F25
F26
AG27

VDDA_DAC
Y26
VSSA_DAC

22u 47n 10n 0.1u 0.1u

REGEN
VMODE1
I2C_SR_SCL
I2C_SR_SDA

C443

C6

USB_CLK
USB_STP
USB_DIR
USB_NXT
USB_D[0]
USB_D[1]
USB_D[2]
USB_D[3]
USB_D[4]
USB_D[5]
USB_D[6]
USB_D[7]

VDDS_CSI2
AG16
VSS_CSI2

C470 C471 C472

I2C

C 442

R12

G10

TWL_CLK_REQ

AG21

C464 C465 C466 C467 C468

As close as to TWL5034

MIC

AUDIO

A14

VDDS_DSI
AH21
VSS_DSI

VDD1_CORE

B10

C419

G11

VDD1_CORE

A6

B9

1n

26M_REF
26M_CLK_EN

AF1
AH10
AH15
N1
AA1

H28

CAP_VDD_DSI

C418

R402
24K

NSLEEP2

AE27

CAP_VDD_WKUP

PCB_VER_ADC

AUXR

C407

A15
AF28
J28
M1
AE28

VDDS_CSIB
M28
VSS_CSIB

POP_VSS_FT1
POP_VSS_FT2
POP_VSS_FT3
POP_VSS_FT4
POP_VSS_FT5
POP_VSS_FT6
POP_VSS_FT7
POP_VSS_FT8
POP_VSS_FT9
POP_VSS_FT10

15p

VDDS_SDI
AA26
VSS_SDI

POP_NC_A1
POP_NC_A2
POP_NC_A22
POP_NC_A23
POP_NC_B1
POP_NC_B23
POP_NC_AB1
POP_NC_AB23
POP_NC_AC1
POP_NC_AC2
POP_NC_AC22
POP_NC_AC23

10n

IHF_LEFT_P

OUT

IHF_LEFT_M

VCC

GND

IHF_RIGHT_P

26MHz

TRISTRATE_O

IHF_RIGHT_M

100K

X401

CSC3M260000BFVRS00

K25

VDDS_DPLL_PER

AA14

VDDS_MMC1
P25
VDDS_SIM
VDDS_DPLL_DLL

26M_CLK_EN

C12

VDDS_SRAM

C417

100n

C11

VDDS_1
VDDS_2
VDDS_3
VDDS_4
VDDS_5
VDDS_6
VDDS_7
VDDS_8
VDDS_9
VDDS_10
VDDS_11
VDDS_12

C410
47p
L401

C10

U301

R413 DNI

EJ_MIC
SPK+
SPKHSO_R
HSO_L
RCV_N
RCV_P

1.8V_VIO

2.85V_RF2

10u

EAR_GND

47p

GND_LEFT_02

POP_FLASH_VDD_FT_1
POP_FLASH_VDD_FT_2
POP_FLASH_VDD_FT_3
POP_FLASH_VDD_FT_4
POP_FLASH_VDD_FT_5

R411
C409

K7

VDD_CORE_1
VDD_CORE_2
VDD_CORE_3
VDD_CORE_4
VDD_CORE_5
VDD_CORE_6
VDD_CORE_7
VDD_CORE_8
VDD_CORE_9
VDD_CORE_10
VDD_CORE_11
VDD_CORE_12
VDD_CORE_13
VDD_CORE_14
VDD_CORE_15
VDD_CORE_16
VDD_CORE_17
VDD_CORE_18
VDD_CORE_19
VDD_CORE_20
VDD_CORE_21
VDD_CORE_22
VDD_CORE_23
VDD_CORE_24
VDD_CORE_25
VDD_CORE_26
VDD_CORE_27
VDD_CORE_28
VDD_CORE_29
VDD_CORE_30
VDD_CORE_31
VDD_CORE_32
VDD_CORE_33
VDD_CORE_34

1.8V_VIO

C9

POP_DDR_VDD_FT_1
POP_DDR_VDD_FT_2
POP_DDR_VDD_FT_3
POP_DDR_VDD_FT_4
POP_DDR_VDD_FT_5

F1
J1
U1
F2
J2
R4
A5
B5
AH6
A8
B8
A12
B12
C16
D16
A18
B18
A22
B22
C28
G28

MIC_N
MIC_P

10K

VDDS_WKUP_BG

C402
C401

10u

G1

VSS_34
VSS_35
VSS_36
VSS_37
VSS_38
VSS_39
VSS_40
VSS_41
VSS_42
VSS_43
VSS_44
VSS_45
VSS_46
VSS_47
VSS_48
VSS_49
VSS_50
VSS_51
VSS_52
VSS_53
VSS_54
VSS_55
VSS_56
VSS_57
VSS_58
VSS_59
VSS_60
VSS_61
VSS_62
VSS_63
VSS_64
VSS_65
VSS_66
VSS_67

M2
N2
AA2
AF2
AG10
B15
AG15
M26
J27
AF27

VDDS_MEM_1
VDDS_MEM_2
VDDS_MEM_3
VDDS_MEM_4
VDDS_MEM_5
VDDS_MEM_6
VDDS_MEM_7
VDDS_MEM_8
VDDS_MEM_9
VDDS_MEM_10
VDDS_MEM_11
VDDS_MEM_12
VDDS_MEM_13
VDDS_MEM_14
VDDS_MEM_15
VDDS_MEM_16
VDDS_MEM_17
VDDS_MEM_18
VDDS_MEM_19
VDDS_MEM_20
VDDS_MEM_21

U4

15p

A1
A2
A27
A28
B1
B28
AG1
AG28
AH1
AH2
AH27
AH28

VPP

C450

VDD2_CORE

BG_TESTOUT

R409

H4
J4
AC4
D8
D9
AE9
D15
Y16
J18
K18
W18
Y18
AE18
J19
M19
N19
T19
U19
Y19
AE19
J20
K20
N20
P20
U20
V20
W20
Y20
D22
D23
AE24
E25
L25
M25

VDD_MPU_IVA_1
VDD_MPU_IVA_2
VDD_MPU_IVA_3
VDD_MPU_IVA_4
VDD_MPU_IVA_5
VDD_MPU_IVA_6
VDD_MPU_IVA_7
VDD_MPU_IVA_8
VDD_MPU_IVA_9
VDD_MPU_IVA_10
VDD_MPU_IVA_11
VDD_MPU_IVA_12
VDD_MPU_IVA_13
VDD_MPU_IVA_14
VDD_MPU_IVA_15
VDD_MPU_IVA_16
VDD_MPU_IVA_17
VDD_MPU_IVA_18
VDD_MPU_IVA_19
VDD_MPU_IVA_20
VDD_MPU_IVA_21
VDD_MPU_IVA_22
VDD_MPU_IVA_23
VDD_MPU_IVA_24
VDD_MPU_IVA_25
VDD_MPU_IVA_26
VDD_MPU_IVA_27

R405

J9
L9
M9
R9
T9
W9
Y9
J10
L10
M10
N10
R10
T10
U10
Y10
J11
K11
W11
Y11
W12
K13
J14
K14
Y14
J15
W15
Y15

VDD1_CORE

1u

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSS_13
VSS_14
VSS_15
VSS_16
VSS_17
VSS_18
VSS_19
VSS_20
VSS_21
VSS_22
VSS_23
VSS_24
VSS_25
VSS_26
VSS_27
VSS_28
VSS_29
VSS_30
VSS_31
VSS_32
VSS_33

B2
U2
AG2
A3
E3
J3
P3
W3
AG3
E4
P4
AG6
C7
D7
K9
N9
P9
U9
V9
C10
D10
K10
P10
V 10
W10
J12
K12
Y12
AE12
AF12
C13
D13
J13

MICBIAS MICBIAS2

Resistance

Rev.A

eMMC LDO

GPS LDO

VBAT

VBAT
VBAT

C5014

220n

0.1u

U403

C5016

C5013

0.1u 0.1u

4
3

EAR_MICBIAS_EN
C5031

VIN
STBY

VOUT
GND

1u

LGE Internal Use Only

U405

U404
1
2

- 209 -

EAR_MICBIAS
C5032

C5033

1u

33p

4
3

1.8V_MMC_EN
DNI
R410

C5022
1u

VDD
CE

VOUT
GND

1
2

3.0V_USER_MEM
C5023
1u

4
3

GPS_PWR_ON
C5024
1u

VDD
CE_NC

VOUT
PGND

0.1u

10u 2.2u 1u

C5015

C5012

C5011

1.8V_PLL1

PGND

0.1u

C5010

C5009

C5008

C5007

10u 2.2u 1u

3.0V_MMC

0.1u

C5006

C5005

C5004

10u 2.2u 1u

1.8V_CSI2

PGND

0.1u

1.8V_VIO

10u 2.2u 1u

C5003

C496 C497 C498 C499

1.8V_VIO
C5002

1.8V_VIO
C5001

1.8V_VIO

GND

GPS_2.8V

2
C5025
1u

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

BATTERY CONNECTOR

BATT_THM_ADC

C506

4
C528

1u

1u

CTG
GND

SDA
SCL

2
3

GAUGE_INT
C526

10n

I2C2_SDA
I2C2_SCL

C512
1u

ISET
GND1
LDO
IEOC

BATT

U502

PGB
CHGSB
GND2
EN_SET

11

100K

R501

PGND
VIN

10
9
8

CHG_STATUS_N_OMAP

7
6

CHG_EN_SET_N_OMAP
C511
2.2u

C524

QSTRT
PGND

6
1

100K

VDD
ALRT

R505

CELL

R504

470n

2K

R506

U506

C520

150

R522

100K

1
VA501

1.8V_VIO

VBAT

1u

2
G1

1K

C507
100u

ZD501

R524

3.3p

R521

C510

10p

560

4
C509

VCHG

USB_VBUS
R523

R518

G2

1.8V_VIO

80.6K

VBAT

C508

Close to batt. connector

1.8V_VIO

CN502

100n

CHARGER IC

MAX17043(TEST)

100K

VBAT

FUEL GAUGE IC

Change to 4 Pin type if neccessory

GND pad on the bottom of chip has to be connected to main GND trace through many vias for heat emission.

Hall IC

MUIC

MOTOR DRIVER

VBAT

VCHG
C501
0.1u

DP2

U501
MAX14526DEEWP

AUD1
AUD2

B2

SCL

IC

SDA

GND
INT

C3

1u

CAP

ISET

A5
B3
A3
A1
D4
D3

USB_DM_TWL
USB_DP_TWL

90ohm matching !!

1.8V_VIO
U505

UART_RX
UART_TX

4
3
C521
0.1u

VDD

OUT1

NC

OUT2
GND

5
1
2

CRADLE_DETECT_N
CARKIT_DETECT_S

U504
1

VIBE_EN
VIBE_PWM

2
3
4

A2

C2

C513

MIC

C1

C4

U2

RES

2.2K
D1

U1

EN

VDP

PWM

GND

MODE

VDD

GAIN

VDN
NC1

UID

VIB_P

7
6
5

VIB_N
C517
2.2u

DN1

COMP2

NC3

B1

COMN1

NC2

B4
R502

A4

10

B5

USB_ID

3.0V_MOTOR

D2

11

USB_DM
USB_DP

BAT

DNI

C5

VB

R510

D5

90ohm matching !!

1u

R516

C502

C519

1.8V_VIO
100K

1%

R503

10n

DNI

I2C2_SDA
I2C2_SCL

MUIC_INT_N

R517

SCREW HOLE
OJ501

LGE Internal Use Only

- 210 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

AUDIO SUBSYSTEM

EAR DETECTION
(Close to Connector)

Q601
EAR_SENSE

1.8V_VIO

2
1
R609

200K

R608

1M

MIC Switch

VBAT

VBAT
C601

C602

C603

33p

100n

2.2u

EAR_DETECT

MIC_N

B5

B1

B3
B2

CPVDD
A3
CPVSS
A4
CP
A5
CN

C617
C618
C619

2.2u
2.2u

C613

C614

0.1u

0.1u

EAR_L
EAR_R

1A

1B0

S1

1B1

2A

2B0

S2

2B1

VCC

GND

1
2
3

MIC1P
MIC2P
MIC1N
MIC2N

C690
2.2u

HOOK

2.2u

I2C2_SCL
I2C2_SDA
2.2u
C632

1.8V_VIO

R606

2.2u
C631

1.8V_AUDIOAMP

R610

U602

EAR_GND

DNI

1.8V_VIO

100K

IN3IN3+

SCL
SDA

D3
C3

IN2IN2+

R602

20

47n

R601

A2

HPL
A1
HPR

IC601

20
R605

C612

D2
D1

MIC_P
MIC_SEL

R604

47n

IN1IN1+

HPVDD

C611

C2
C1

GND

470n

BIAS

470n

C609

SPK_P
SPK_N

FB602

10

B4

SPK+
SPK-

C608

C4

HSO_R
HSO_L

FB601

C5

OUT+
D5
OUT-

SVDD

D4

U610
8

VIN-

5
1

VCC
VIN+

HOOK_ADC

OUT

GND

HOOK_DIG

100K

2
R607

SUB PMIC-CAM POWER

5M_MAIN_CAMERA

VBAT

VBAT line minimum 0.6mm


1.2V_5M_VDIG

SCL

U601

LDO3

G2
10
G1
9

DVS
EN

23

22

21

20

19

18

17

16

10

15

11

14

12

13

2.8V_5M_VCM

I2C3_SDA
I2C3_SCL

A1

5M_RESET_N
5M_CAM_VCM_EN
C1

C623

LDO4

DEFSEL
IDSEL

LDO5

E1

C620

C621

C622

4.7u

1u

0.1u

C626

C627

C628

C629

C630

1u

1u

1u

1u

1u

B1

GND

B2
C2

0.1u

SDA

1
P1
2
P2
3
P3
4
P4

0.1u

CAM_SUBPM_EN

IRQ_N

A3

5
P5
6
P6
7
P7
8
P8

0.1u

GNDB

FL602

5M_MIPI_DATA0_N
5M_MIPI_DATA0_P
5M_MIPI_DATA1_N
5M_MIPI_DATA1_P

24

ZD601

I2C3_SDA
I2C3_SCL

2.7V_5M_VANA

3.0V_MMC

SW
LDO2

B3
C4
C3
D3
E2

B4

1.8V_5M_VIO
CN602
1

C625

LDO1

2.7V_5M_VANA

1
P1
2
P2
3
P3
4
P4

C 624

FB

A2

D1

10u

VINB

VIN1

E4
D2
E3
D4

VIN2

2.2u

VBATT

C607

2.2u

5
P5
6
P6
7
P7
8
P8

G2
10
G1
9

2.2u

C606

2.2u

2.8V_5M_VCM

L601

C605

10u

5M_MCLK

1.8V_5M_VIO

C610

C604

A4

1.2V_5M_VDIG

3.0V_MOTOR

FL601

5M_MIPI_CLK_N
5M_MIPI_CLK_P

LGE Internal Use Only

- 211 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

LCD BL CHARGE PUMP

4.0" MIPI LCD

VBAT

VBAT line minimum 0.6mm


VBAT

C701
2.2u

3.0V_LCD_VCC_VCI
C702

2.2u

1.8V_LCD_IOVCC

U701

BC_M

BL6
BL7

FLTR

BL8
LDOA

SBIAS
LDOB
AMB_IN
LDOC

R706

PGND1

PGND2

LDOD

F2
E2
F1
A1

INOUT_A3

INOUT_B4

INOUT_A4

1.8V_LCD_IOVCC

B1

15pF

1.8V_TOUCH

A2

29

28

27

26

25

24

23

22

10

21

11

20

12

19

13

18

14

17

15

16

LCD_BL_OUT4
LCD_BL_OUT3
LCD_BL_OUT2
LCD_BL_OUT1

3.0V_LCD_VCC_VCI

B2

C720

C715

C714

4.7u

2.2u

2.2u

9
G1
10
G2

LCD_PWM

LCD_MIPI_D0_P
LCD_MIPI_D0_N
LCD_MIPI_D1_P
LCD_MIPI_D1_N

P5 5

INOUT_B3

G1

INOUT_A2

5
P5
6
P6
7
P7
8
P8

3
4

LCD_BL_OUT8
LCD_BL_OUT7
LCD_BL_OUT6
LCD_BL_OUT5

P3

P1

P4

P2

1
2

LCD_MIPI_CLK_P
LCD_MIPI_CLK_N

FL703

3.0V_TOUCH

F3

C5

AGND2

AGND1

E1

2.2u

IN_LDO

A3

68 n

C713

100K

C712

A4

E3

INOUT_A1

INOUT_B2

30

P6

BL5

INOUT_B1

G2

BL4

SCL

E4

C2BL3

E5
F4

10

D4

C4

B5
C2+

SDA

LCD_TE
LCD_CS
LCD_RESET_N

LCD_BL_OUT1
LCD_BL_OUT2
LCD_BL_OUT3
LCD_BL_OUT4
LCD_BL_OUT5
LCD_BL_OUT6
LCD_BL_OUT7
LCD_BL_OUT8

2.2u

C1

BL2

F5

2.2u

B3

EN

FL701

D5

C711

C2

LSENSOR_BIAS
LSENSOR_SENS

BL1

2.2u

D1

LCD_PWM

LCD_MAKER_ID
NEG

C710

D3

IN

FL702
1
P1
2
P2
3
P3
4
P4

CN702

2.2u

C3

1u

C709

D2

LCD_CP_EN
I2C2_SDA
I2C2_SCL

C704

1u

C708

R704

A5

C703

C 1-

C1+

100K

B4

1.8V_VIO

RGB LED DRIVER

TOUCH CONNECTOR

C723

C724

1u

1u

GND

I2C2_TOUCH_SDA

I2C2_TOUCH_SCL

ZD703

ZD702

ZD701

100K

R705

LGE Internal Use Only

1u

KEY_LED_RESET
I2C2_SCL
I2C2_SDA

A3

B2
B3

D2
D1

B4
E2
R708
120K

A4

C6

A5

RESETB

U703

R2LED
G2LED
B2LED

SCL
SDA
RGB1CNT
RGB2CNT

RGBGND
CLKIO

ADDSEL
RGBISET

D5

E6
E5
F5

E4
E3
F3

KEY_LED_OUT

KEY_LED_SEARCH
KEY_LED_MENU
KEY_LED_BLUE1
KEY_LED_HOME
KEY_LED_BACK
KEY_LED_BLUE2

F4

C2

INDEX

NC2

NC1

I2C2_SCL

C722

1u

D6

C3

IN1

C721

B1

IN2

VIO

GND1
GND2

COM2

0.1u

COM1

TOUCH_INT_N

C705

NO1

I2C2_TOUCH_SCL

C706

0.1u

10

0.1u

I2C2_SDA

10
NO2

R1LED
G1LED
B1LED

C707

I2C2_TOUCH_SDA

VCC

VOUT
VOUTM

E1

U702
1

VBATCP
VBAT2
VBAT1

CPGND

B5
A2
CN701

C2N
C2P

C1N
C1P

R703

F2

T1
T2
T3
T4

C1

F1

B6

1.8V_VIO

F6

1.8V_TOUCH

A6

3.0V_TOUCH

A1

10K

1.8V_TOUCH

1.8V_VIO

C5

VBAT
1.8V_TOUCH

- 212 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

WIFI/BT/FM COB

GPS

GPS_2.8V

R801

FB801

GPS_2.8V

10

C801
2.2u

R802
4.7K

VDD_AFE

G4

C6

GPS_UART_RXD
GPS_UART_TXD
GPS_UART_CTS_N
GPS_UART_RTS_N

GND: SDIO, NS: SPI

C4
B5
B3

E4

D4
D3

D2

FIL_OUT

GND

FL801
1575.42
MHz

6.8n

OUT

IN

L812

2.2n

G3G2G1
L804
100n

U802

5 3 2

C807

C816

C806

DNI

DNI

0.5p

C1
E1

A3
A2

TCXO for GPS

GPS_GSM_CTL
GPS_RESET_N
GPS_PWR_ON

B6
G6
E6

A4

SDA1
SCL1

C5

GPS_TCXO_1.8V

X801
KT2520F26000ACW18TAK
C811
2.2u

C812
2.2u

C813
2.2u

C815

C814

2.2u

22p

KYOCERA
6
5

C817 close to VDDTF(A12) pin


C820 close to #A1 Pin
C821 close to #D1 Pin

CN802

1
S_D

E2

F2

VDDLNA

VDDIF

VDDPL

L802

1.8V_VIO

VDD_FM

VDD_CORE
VDD_XTAL
SR_AVDD2P5

VDD_PA
1.8V_WLAN

1.8V_WLAN

VDD_PLL

VDD_AFE

VDD_CORE

VDD_RADIO_PLL

RF_IN

1.8p

26MHz_GPS_REF
GPS_26MHz
CLK32K_TWL

D5

1.8V_VIO

VDD_PA

VDD_CORE

VDD_BT
VDD_PA

1.8V_WLAN

CN801

330p

VDD

C808
A5
D1

AVSS
VSSC1
VSSC2
VSSC3

9.1n

G2

SYNC/PPS_OUT
IFVALID
RST_N
REGPU
TM2

A6

C3

C804

L801
1.8n

F1

VSSIF
VSSLNA

SCL2/UART_TX
SDA2/UART_RX
UART_nRTS
UART_nCTS

L803

G1

RFIP

GPS_CAL
TCXO/TSXO
LPO_IN
ADCP
VDDADC
ADCN

U801

REF_CAP

C803
0.1u

G5

600

10n

C810

VDD_PLL

FB805

VDD1P2_GRF

F4

C809
2.2u

600

FB804

B2

C802
47p

VDD_BAT

VDD_BT

VDD_AUX_O
VDD_AUX_IN
HOST_REQ
LNA_EN

VDD_PRE

VDD_RADIO_PLL

CAL_REQ/ANT_SEL
VSSADC

F6

E5
B1

VDD1P2_CORE

E3

VDDC2
VDDC1

C2

VDD_XTAL

B4

600

600

D6

FB802

FB803

VDDIO

A1

AUXOP

F5

G3

F3

GPS_TCXO_1.8V
GPS_2.8V

GPS_26MHz

FB806
600

VCC

GND1

NC2

NC1

OUT

GND2

1
2
3

26MHz

C817
8p

C819
0.1u

C820
C821
1u

4.7u

C822

C823

C824

0.1u

0.1u

10n

C825 C826
0.1u

0.1u

C828

C827

0.1u

0.1u

C859
1u

C829
0.1u

C830

VBAT

R805

10u

L806

3.3u

0
C845 C846
10u

100n
C848

SR_AVDD2P5

220n

C849 1u

R10
T10
T13
R14
P14
R11
T11
R12
N14
N13
T14
P13
R13
T12
N12
P10
P6
T1
T7
R6
R7
T2

WLAN_CMD
WLAN_SDIO[0]
WLAN_SDIO[1]
WLAN_SDIO[2]
WLAN_SDIO[3]
WLAN_CLK
TP816

R2
R4

H13
E13
E10
B14

BT_UART_TXD
BT_UART_RXD
BT_UART_RTS_N
BT_UART_CTS_N

BT_SDA
BT_SCL
BT_RST_N
BT_RFOP
BT_RFON
BT_REG_ON

SDIO_CMD
SDIO_DATA_0
SDIO_DATA_1
SDIO_DATA_2
SDIO_DATA_3
SDIO_CLK

BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK

UART_TX_0
UART_RX_0
TMS
TDO
TDI
TCK
TAP_SEL_0
TAP_SEL_1
JTAG_TRST_L

BT_TM0
BT_TM1
BT_TM3
BT_TM6

BT_GPIO_0
BT_GPIO_1
BT_GPIO_2
BT_GPIO_3
BT_GPIO_4
BT_GPIO_5
BT_GPIO_6
BT_GPIO_7
WL_REG_ON
WL_RST_N
OSCIN
OSCOUT
XTAL_PU

VDD_FM
FM_AUDIO_L
FM_AUDIO_R

TP801

SW_WL_BT_RX
SW_WL_TX
C856

C857

47p

47p

22p

TP803
TP804

8
7

VDD_PA

TP805
10p
15p

L809

1.8n

1
1

C861

2450 MHz

12

0.75p

GND2

TX_WLBG

2
3

2.7n

C847

0.1u

0.1u

BT_EN
TX_BT

BT_WAKEUP
BT_HOST_WAKEUP

LDO for TCXO

WLAN_EN
CLK_IN

38.4MHz TCXO
VDD_TCXO

VBAT

CLK_REQ
U804
4
3

VIN
STBY

VOUT
GND

1
2

VDD_TCXO

4
1

R804
100K

WLBGA,181,R/TP,WiFi(11bgn)+BT+FM(Rx),BT3.0+HS,6.57x5.62x0.55

- 213 -

C854
1u

X802
VCC
GND1

1XTW38400FAA
3
OUT
2
GND2

C852

100p

CLK_IN

384MHZ

CLK_REQ

LGE Internal Use Only

1.8n

C863

BT_PCM_SYNC
BT_PCM_DIN
BT_PCM_DOUT
BT_PCM_CLK
TP807

GND1

GND3

TP823 TP824TP825 TP826

TP806

TX_IN

U805

BT

10p

L811

C851

C_BT

11

10
9

C842

1.8V_WLAN

C850

L805

10p

3.3n

FM_ANT

SW_BT_TX
TX_BT

BT_UART_RXD
BT_UART_TXD
BT_UART_CTS_N
BT_UART_RTS_N

TP802

L10
M9
L11
L14

N9
M5
F14
F13
R1

L810

GND

0.1u

J9
K8
G6
L8

G7
H8
J8
L9
K9
K13
K14
K11

FL802
DEA162450BT-2096A1-H
3
IN
OUT

C_TX

68p

ANT
C860

M13
M14
M12
M11

M7
M8
H9
A11
B11
N8

C862

C858

C_RX

T5
T6
K7
L7
P2
R5
G8
L1
T4
F12
P4

D6
A3
B5
C9
D1
A1
C5
C8
E7
C7
F4
G2
G3

U803
BCM43291SKUBG

J7
M4
P5
C12
A10
D10
D11
K10
L13
K12
J10
E12
D12
F10
G10
G13
F11
P8
P11
P12

L2
M6
N6
L4
N7
P7
L5

SR_PALDO_1
SR_PALDO_2
SR_VDDNLDO
SR_VLX1_1
SR_VLX1_2
SR_VDDBAT3_1
SR_VDDBAT3_2
SR_VDDBAT2
SR_VDDBAT1_1
SR_VDDBAT1_2
SR_VSSPLDO
SR_PVSS_1
SR_PVSS_2
SR_AVDD2P5
SR_TESTSWG
SR_PNPO

LNA_EN

4.7u

C844 220n

47n

100n

VDD

C839

L807
L808

C841

RX_OUT

4.7u

C840

15p

4.7u

VDD_PA

VREF_LDO
VOUT_LNLDO1
VOUT_LDO2
VOUT_CLDO
VDD_LNLDO1
VDD_LNLDO2
VDD_CLDO

10p

PGND

C838

C843

1u

C837

FM_TXADCIN2
FM_TXADCIN1
FM_TXADCVCM
FM_TXP
FM_TXN
FM_RXP
FM_RXN
FM_CVAR
FM_ADOUT2
FM_ADOUT1

CN804

CN803
C835

C855

P9
T9
N11
T8
R9
N10
R8

G14
H14
G11
D13
C13
D14
C14
E14
G12
H12

WLAN_HOST_WAKEUP
WLAN_WAKEUP

TP822

13

VDD_RADIO_PLL
VDD_FM
VDD_CORE

3.3n

EXT_LNA_GAIN

N5
N4
N2
N1
P1

RX_BG

C836

SW_BT_TX
SW_WL_BT_RX
SW_WL_TX

EXT_LNA_GAIN

100p

WL_GPIO_0
WL_GPIO_1
WL_GPIO_2
WL_GPIO_3
WL_GPIO_8

H6
J5
K6
K5
K2
L6
K1
K4
M1
M2

PGND

15K

FM_ANAVDD
FM_VDDVCO
FM_VDDPLL
FM_VDDRX

R803

WRF_RFOUTP_G
WRF_RFOUTP_A
WRF_RFINP_G1
WRF_RFINP_A1
WRF_RFINN_A1_XFMR
WRF_RFINN_G1_XFMR
WRF_RES_EXT
WRF_EXTREFIN
WRF_EXTCOUPLE_AIN
WRF_AFE_TSSI_G
WRF_AFE_TSSI_A

WRF_GNDPAA_3P3_1
WRF_GNDPAA_3P3_2
WRF_GNDPAG_3P3_3
WRF_GNDPAG_3P3_4
WRF_GNDRX_1P2
WRF_GNDTX_1P2_2
WRF_GNDD_1P2
WRF_GNDA_1P2
WRF_GNDCAB_1P2
WRF_GNDVCO_1P2
WRF_GNDLO_1P2
WRF_GNDPFDCP_1P2
WRF_BBPLL_GND_1P2

8p

VDDIO_SD_1
VDDIO_SD_2
VDDIO_RF_1
VDDIO_RF_2
VDDIO1
VDDIO2
VDD1
VDD2
VDD3
VDD_XTAL
OTP_VDD25

C834

E1
C1
A7
A4
A5
A8
B9
E8
D4
E3
H3

WRF_VDDVCO_1P2
WRF_VDDTX_1P2
WRF_VDDRX_1P2
WRF_VDDPFDCP_1P2
WRF_VDDPAG_3P3
WRF_VDDPAA_3P3
WRF_VDDLO_1P2
WRF_VDDD_1P2
WRF_VDDCAB_1P2
WRF_VDDA_1P2
WRF_BBPLL_VDD_1P2_2
WRF_AFE_AVDD_RXADC
WRF_AFE_AVDD_AUX

10p

RF_SW_CTRL_N_0
RF_SW_CTRL_P_0
RF_SW_CTRL_N_1
RF_SW_CTRL_P_1
RF_SW_CTRL_N_3
RF_SW_CTRL_P_3
AMODE_TX_PU
GMODE_TX_PU
AMODE_EXT_LNA_GAIN
GMODE_EXT_LNA_GAIN

A2
C2
D2
E2
B6
C3
B8
D8
A9
E6
D5
D9
H4

CLK32K_TWL

12p

C833

WRF_GPIO_OUT2
WRF_GPIO_OUT1
WRF_AFE_TEST_OP
WRF_AFE_TEST_ON
WRF_AFE_TEST_IP
WRF_AFE_TEST_IN
WRF_AFE_IQADC_VREF
WRF_AFE_AVSS_RXADC

C865

C832

E5
E4
H1
H2
F1
F2
F3
G1

RX_BG

DNI

VSS1
VSS2
VSS3
BT_VSSVCO
BT_VSSRF
BT_VSSIF
BT_VSSIFP
BT_VSSC1
BT_VSSC2
BT_COEX_OUT1
BT_COEX_OUT0
FM_VSSVCO
FM_VSSRX
FM_VSSPLL
FM_BGNDLF
FM_ANAVSS
VSS_XTAL
AVSS_LDO
SR_PAVSS
SR_AVSS

TX_WLBG

C831

BT_VDDVCO
BT_VDDTF
BT_VDDRF
BT_VDDO1
BT_VDDO2
BT_VDDIF
BT_VDDC1
BT_VDDC2

A13
A12
C10
H7
J6
C11
L12
M10

0.1u

C853
1u

DAISHINKU

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

Main 2 Sub

USER MEMORY eMMC I/F

Main 2 ANT Sub


1

2.85V_SIM 1.8V_MOTION_VIO
1.8V_VIO

1.8V_VIO

B13
B14
C1
C3
C5
C7
C8
C9
C10
C11
C12

NC95

NC3

NC96

NC4

NC97

NC5

NC98

NC6

NC99

NC7

NC100

NC8

NC101

NC9

NC102

NC10

NC103

NC11

NC104

NC12

NC105

NC13

NC106

NC14

NC107

NC15

NC108

NC16

NC109

NC17

NC110

NC18

NC111

NC19

NC112

NC20

NC113

NC21

NC114

NC22

NC115

NC23

NC116

NC24

NC117

NC25

NC118

NC26

NC119

NC27

NC120

NC28

NC121

NC29

NC122

NC30

NC123

D1

C 14

35

34

33

32

10

31

11

30

12

29

13

28

14

27

15

26

16

25

17

24

18

23

19

22

20

21

MICBIAS

FLASH_LED_TORCH
FLASH_LED_EN
GSM_TXON_IND
UART_TX_IFX
UART_RX_IFX
MICROSD_CMD
MICROSD_CLK

MIC1N

MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT3
MICROSD_DET_N

MIC1P

100n

VIB_P

C927 C928

C910

33p

0.1u

22u

47p

18

17

16

15

14

13

12

10

11

KEY_LED_SEARCH
KEY_LED_MENU
KEY_LED_BLUE2

SPK_P
SPK_N

G12
G13
G14
H1
H2
H3
H5
H12
H13
H14
J1
J2

Main 2 USB FPCB

J3
J5
J12
J13
J14
K1
K2
K3

EAR_MICBIAS

K5
K6
K7
K10

L1

D901

4.7u

K14

K13

C926

K12

C908

L12

0.1u

2.2K

L3

R 910

L2

L13
L14

R911

HOOK_ADC
EAR_L
EAR_R

M1
M2
M3
M7

VA905

C911 C913 C914


0.1u

47p

M9
M10
M11

C912

M12

L901

M13

C923

N1

4.7u

N3

EAR_GND

N7

R919 DNI

N8
N9

39

FB902
1800

38

37

FB903
1800

36

35

34

33

R915

ZD905

N6

40

PROX_OUT

2.8V_PROXI
1.8V_VIO

47p

M14

N10
N11
N12

33p

FB901

EJ_MIC
FM_ANT
EAR_DETECT

M8

C919

CN903

47p

47K

R916

1800

1
10

KEY_LED_HIGH
VT_DATA[7]
VT_DATA[6]
VT_DATA[5]
VT_DATA[4]
VT_DATA[3]
VT_DATA[2]
VT_DATA[1]
VT_DATA[0]

32

10

31

11

30

12

29

13

28

14

27

15

26

16

25

17

24

18

23

19

22

20

21

MIC2N
MIC2P
C922

VA906

C921

1u

10u

MICBIAS2

LSENSOR_SENS
I2C3_SDA
I2C3_SCL
VT_VSYNC
VT_HSYNC
VT_CAM_DRV_2.8V

LSENSOR_BIAS

C924

C925

DNI

DNI

VT_CAM_IO_1.8V
VT_CAM_PWDN
VT_RESET_N

R913
C918
DNI

N13

100

R917

R918

VT_MCLK
VT_PCLK

N14
P1
P2
P7
P8
P9
P10
P11
P12
P13
P14

VA903

CN904

VA904

ZD904

14

PWR_ON_SW

P5 5
3

P3

P1

P4

P2

P6

USB_DP
USB_DM

13

12

USB_ID
1
2

RCV_N
4

11

10

FL902

RCV_P

FL901

- 214 -

39p

4.7u

C929

C930

ZD902

IN

LGE Internal Use Only

C909

ZD903

NC2

KEY_LED_BACK

19

ZD901

NC94

36

NC1

NC31

C13

NC93

37

R914

B12

NC92

KEY_LED_HOME

100K

B11

NC90
NC91

VSSQ4

100n

L903
VA901 VA902

20

G10

R920

B9
B10

NC89

VSSQ1
VSSQ5

38

NC57

B8

VSSQ2

NC88

NC56

B7

U901

VSS5

NC54

B1

NC87

NC55

A14

VSS4

NC53

A13

NC85
NC86

39

G3

A12

VSS2
VSS3

NC52

A11

NC84

G2

A9
A10

VSSQ3

NC51

A8

NC83

G1

A7

NC82

NC50

A6

NC81

F14

A2

NC80

VCC4

NC48

A1

RESET

VCC3

NC49

P6

VCC1
VCC2

F13

P4

NC78

NC47

N5

VCCQ5

F12

K8
N2

NC77

F10

H10

VCCQ4

NC46

G5

NC76

F3

E7

VCCQ1

NC45

0.1u

NC75

F2

1u

VCCQ2

NC44

C4

NC73
NC74

F1

K9

C904

VDDI
VCCQ3

NC42

F5
J10

C903

NC72

NC43

1n

NC71

E 14

0.1u

E6

CMD

NC41

2.2u

3.0V_USER_MEM

NC70

E13

C907

NC69

E 12

C906

CLK

NC40

C905

P5

NC68

E 10

P3

NC67

NC39

N4

DAT7

E9

M4

NC66

NC38

C6

DAT6

E8

C902

NC65

NC36

DNI

C2

DAT5

NC37

1.8V_VIO

C901

NC64

E5

0.1u

DAT4

E3

M5

MMC_CMD

NC63

NC35

M6

MMC_CLK

DAT3

E2

B6

NC61
NC62

NC34

B5

NC60

E1

B4

NC59
DAT1
DAT2

NC33

B3

NC58

DAT0

D14

B2

INDEX

NC32

A5

D 13

A4

D3

A3

D2

D4

D 12

68K

68K

68K

68K

68K

68 K

6 8K

KEY_C[0]
KEY_R[0]
KEY_R[1]
KEY_R[2]

68K
R909

R907

R906

R908

R905

R904

R903

R902

R901

68K

I2C3_SCL
I2C3_SDA

40

3.0V_MMC

2GB

MMC_DAT0
MMC_DAT1
MMC_DAT2
MMC_DAT3
MMC_DAT4
MMC_DAT5
MMC_DAT6
MMC_DAT7

KEY_LED_BLUE1

CN902

KEY_LED_OUT

CN901

GYRO_INT_N
COM_INT
MOTION_INT
PWR_ON_SW
SIM_RST
SIM_CLK
SIM_IO

L902

VIB_N

3.0V_MOTIONVBAT

OUT

VCHG

GND1 GND2

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

MicroSD Socket

Main 2 Sub

USIM For Infinieon

3.0V_MMC
VBAT

2.85V_SIM

3.0V_MOTION

2.85V_SIM

1.8V_VIO

2.2

10K
R107

16

25

17

24

18

23

19

22

20

21

MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT3
MICROSD_DET_N

Step-Up Current Regulator

17

100K

FLED2

FINH

CT

PGND

RFS

AGND

RTS

GND_SLUG

100K

22p
C105

18p

SW2

C103

C104

0.1u

10u

D101

D102

TP

VOLUME/GESTURE KEY

Flash LED
VA101

KB1

FLASH_P

R108

150

R109

150

R110

150

R111

150

KEY_R[0]

Vol. Up

KEY_R[1]

Vol. Down

KEY_R[2]

Gesture

KB2

LD101

4
10

KB3

TP101

UART_TX_IFX
UART_RX_IFX
PWR_ON_SW
VBAT

TP102
TP103
TP104
TP105

6
7

20K

4.7u

FLED1

ENF

15

C112

R114

ENT

0.1u

12
14

2
3

DNI

10

DNI

1.0 mm

39K
R116

13

R113

VOUT2

R115

16

VOUT1

VBAT

NC1

LX

NC2

14

11

C108

U102
L101 12

1u

FLASH_LED_TORCH
FLASH_LED_EN
GSM_TXON_IND

C107

C124

Flash LED Driver


VBAT

C106

MICROSD_DAT0
MICROSD_DAT1

26

27

15

SIM_RST
SIM_CLK

28

14

GND3

29

13

MICROSD_CLK

GND4

12

FLASH_LED_TORCH
FLASH_LED_EN
GSM_TXON_IND
UART_TX_IFX
UART_RX_IFX
MICROSD_CMD
MICROSD_CLK

GND2

30

CLK

GND5

D103

31

32

33

34

11

10

RST

IO

VCC

VPP

6
10

35

36

GND1

SIM_IO

37

J101
4

11
1

38

KEY_C[0]
KEY_R[0]
KEY_R[1]
KEY_R[2]

MICROSD_DET_N
MICROSD_DAT2
MICROSD_DAT3
MICROSD_CMD

I2C3_SCL
I2C3_SDA

39

3.0V_MMC

GYRO_INT_N
COM_INT
MOTION_INT
PWR_ON_SW
SIM_RST
SIM_CLK
SIM_IO

40

4.7K

10K

R106

CN102
SW113

CN101
1

R112

47K

R105

4 7K

R104

47K

47K

R101

R103

1.8V_VIO

R102

1.8V_MOTION_VIO

C113
3.9n

1.0 mm
C114

FLASH_M

VA104

KEY_C[0]

4.7u

RSV

C117
0.1u

C118
0.1u

IME_CL

CLKIN

NC2

NC3

NC1

CLKOUT

FSYNC

RESV2

INT

CPOUT
GND

3.0V_MOTION

GYRO_INT_N

U103

REGOUT

RESV1

18

MOTION_INT

12

NC8

11

NC4

6
SCL

10

NC7

DNC4

0.1u

SCL

NC6

U104

IO_VDD

C121
6

SDA

AD0

NC5

DNC1

INT

VLOGIC

VDD

B1

DNC3

NC9

IME_CL

14

DNC2

17

VDD

A4

A3

A1

SCL/SK

SDA/SI

B3

GND

VDD

TST6

25
24

I2C3_SDA
I2C3_SCL

23
22
21
20
19
C115
2.2n

SDA

U105

1.8V_MOTION_VIO

IME_CL

10

VSS

TST2

DRDY

V ID
D4

TST1

I2C3_SDA

CAD1

B4

3.0V_MOTION

CSB

D2

CAD0

A2

R117

D1

SO

16

C1

C2

C4

C3

0.1u

IME_DA

C122

0.1u

IME_DA

C123

0.1u
10K

1.8V_MOTION_VIO

3.0V_MOTION

C116

GYRO SENSOR

15

3.0V_MOTION

MOTION SENSOR

13

1.8V_MOTION_VIO

COM_INT

DIGITAL COMPASS

1.8V_MOTION_VIO

IME_DA
C119

C120

I2C3_SCL

0.1u

0.1u

LGE Internal Use Only

- 215 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

VT 2M CAM

VT FPCB

VT_CAM_DRV_2.8V VT_CAM_IO_1.8V

CN102

34

33

32

PROXI_VCC
VT_DATA[7]
VT_DATA[6]
VT_DATA[5]
VT_DATA[4]
VT_DATA[3]
VT_DATA[2]
VT_DATA[1]
VT_DATA[0]

10

31

11

30

12

29

13

28

14

27

15

26

16

25

17

24

18

23

19

22

20

21

VT_DATA[7]
VT_DATA[6]
VT_DATA[5]
VT_DATA[4]

MICBIAS
LSENSOR_SENS
LSENSOR_BIAS
I2C3_SDA
I2C3_SCL
VT_VSYNC
VT_HSYNC
VT_CAM_DRV_2.8V
VT_MCLK
VT_CAM_IO_1.8V
VT_PCLK
VT_CAM_PWDN
VT_RESET_N

6
7
8
9

10

35

CN103

24

23

22

21

20

I2C3_SCL

FL102

G1

36

G2

37

7.5pF

I2C3_SDA

INOUT_B4

INOUT_A4

INOUT_B3

INOUT_A3

INOUT_B2

INOUT_A2

INOUT_B1

INOUT_A1

4
3
2

VT_VSYNC

19

18

17

16

10

15

11

14

12

13

VT_HSYNC
7.5pF

VT_DATA[3]
VT_DATA[2]
VT_DATA[1]
VT_DATA[0]

6
7
8
9

MIC2N
MIC2P

10

38

VT_MCLK

FL103

G1

39

G2

40

EJ_MIC
FM_ANT
EAR_DETECT
PROX_OUT
PROXI_LEDA
1.8V_VIO

EAR_L
EAR_R

VT_PCLK

INOUT_B4

INOUT_A4

INOUT_B3

INOUT_A3

INOUT_B2

INOUT_A2

INOUT_B1

INOUT_A1

4
3
2
1

VT_RESET_N
VT_CAM_PWDN

1u

1u

C101

C102

Sub MIC
O
G2
G1
P

MIC2P
MIC2N

4
3
2

MICBIAS

MIC101

3.5pi Ear Jack Connector


S/W

PROXIMITY SENSOR

AMBIENT LIGHT SENSOR

EAR_SENSE

Close

LOW

Open

HIGH (detect)

PROXI_VCC

1.8V_VIO

PROXI_LEDA

U101

M5-MIC

J101

M4-L

4D
M4-DETECT
1
M1-R
6
M6-GND

PROX_OUT

LGE Internal Use Only

LSENSOR_SENS

U102
1

C106

C107

4.7u

0.1u

LEDA

SCL

LEDC

SDA

VCC

VIO

VOUT

GND

- 216 -

I2C3_SCL

I2C3_SDA

5
4

IOUT

VCC
GND1

GC2

GND2

EAR_DETECT
EAR_R
FM_ANT

GC1

1
2

LSENSOR_BIAS

EJ_MIC
EAR_L

C105
1u

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

Main 2 Lower Sub

Q-Motor

4KEY LED LIGHTING

VB101
1

VIB_P
1

CN101

20

KEY_LED_OUT

VIB_N
2

VIB_N

LD101

KEY_LED_MENU

SJMY0007118

19

LD102

VIB_P
3

18

17

16

15

14

13

12

10

11

KEY_LED_OUT

KEY_LED_BLUE1
KEY_LED_HOME

KEY_LED_BLUE1

KEY_LED_SEARCH

C101
1u

KEY_LED_MENU

KEY_LED_BACK
MICBIAS

MIC1N
MIC1P

LD103

KEY_LED_HOME

KEY_LED_BLUE2

LD104

SPK_P
SPK_N

LD105

KEY_LED_BACK
LD106

KEY_LED_BLUE2

LD107

KEY_LED_SEARCH
LD108

VA105

RF Mobile Switch

Main MIC

SPK

SW101

G2

O
C107

G1

CN102

1.8n

ANT
C105
DNI

C106
DNI

CN103
1

G2
TP101

SPK_P

G1
P

TP102

SPK_N
VA103

MIC1P
MIC1N

4
3
2

MICBIAS

MIC101

VA104

VA107

VA108

As close as to MIC, Not in the ANT Carrier

LGE Internal Use Only

- 217 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

7. CIRCUIT DIAGRAM

uUSB Connector

Main 2 USB FPCB

CN101

VCHG
1

CN102

13

12

11

USB_DP

8
12
14

PWR_ON_SW

USB_ID

USB_DM

USB_DM
USB_DP
USB_ID

RCV_N

3
4
5

RCV_P
5

6
10

14

10

9
11

13
15

VCHG

RCV

PWR ON
KB101

CN104

LGE Internal Use Only

RCV_P

RCV_N

PWR_ON_SW

- 218 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

8. BGA Pin Map


8. BGA Pin Map

8. BGA PIN MAP


-PMB9801

LGE
Internal Use Only

- 219 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

8. BGA Pin Map

-PMB5703

LGE Internal Use Only

- 220 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

8. BGA Pin Map

-H8BCS0QG0MMR-46M
CP Memory (1G+512M)

LGE Internal Use Only

- 221 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

8. BGA Pin Map

-H8MBX00U0MER-0EM
4G LPDDR POP

LGE Internal Use Only

- 222 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

8. BGA Pin Map

-iNAND e.MMC 2G
AP Memory

LGE Internal Use Only

- 223 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

9. PCB LAYOUT

9. PCB LAYOUT
CN904 : Upper FPCB Conn1.
- no Power on
- no USB
- no Reseiver

U501 : MUIC
- no USB/UART

CN903

R917 C925 R918

C924

ZD901

FL801

R914C918R913

ZD903

FL108

U802

L119

C153

C148

L117

C5028

C146
L110

C145

C198

VA501

C812

L129

C174

C132
L132

C117
C116

C110
C108

L126
C103

C184

U105

L130

C167
C182

L125

C194

C119
C125

C130

FL105

C114

FL103

TP110

TP111

C133
C118

C624

X101

C124

C181

C104

C112

FL102

C106
C101

FL101

C105

FL107

C107

U101

C158
C109

C172

C177

L113

FL109

C138

C113

U601

R706
R704

U701

C712

C176

C709
C171

L133

C170

C179

C178

C180

C185

CN18
SW102

C508

FL111

C111

U502

R504
C512

C703
C704

CN8

CN19

C506

C509

CN502

L115

C193

CN13
C510

SW101

C162
C183

L108
C5025

FL104

L128

C160

C809
U405

C199
C147

U103

C623

CN602

FL602

CN15
C126

C161

U801
C520

X801

L109

C5026
C157

C810

ZD904

C513

C1001 C1002

C169

C705

FL902

CN14
L120

R802

C802

R518

C801

C815

L107

C142

U506

C528

R524

R523
35

C922

C921

FB801

CN17

L803

C814

C5024

C150

ZD501

R505

52

VA906

C919

CN20
L801

C803

C808

C813

C811

U104

C143

U102

C144

C165

C164

R501

R506

02

CN801 : GPS Ant. Conn.


- no GPS
CN903 : Upper FPCB Conn2.
- no Ear-jack
- no illumination sensor
- no proximity sensor
- no FM radio
- no VT cam
- no 2nd mic
U104 : FEM & GSM PAM
- no Service
- RF Sensitivity & TX Power

R801

L804

C151

C152

L124

36

VA905

R916

R703

C929

ZD902

R915

C923
C804

L802

L114

FL106

L122

C507

R521

C511

C524

C526

R522

62

FB901

VA904
VA903

C913
FB902
C807

C131

FL110

L123

L118

C196

C197

R109

R110

C187

C188

C192

C708

C710

C711

12

C816

C914

CN904

C930

FB903

CN701

U702

C227
R327

R326

L812

25

R910 C926

D901

L121

C1003

C1004

U106

C154

C173

C141

C140

C139

C129

C127

C702

C713

C701

U801 : GPS chip


- no GPS
X801 : 26Mhz X-tal
- no GPS
SW102 : RF S/W
- no Service
SW101 : Coaxial Conn.
- no Service
CN502 : Battery Conn.
- no power On

CN901
05

04

U105 : PAM(Band1/8)
- no Service
- RF Sensitivity & TX Power

20

61

51

FL701

U103 : PAM(Band2)
- no Service
- RF Sensitivity & TX Power

26

70

C714

C720

U506 : Fuel gauge


- Battery Bar accuracy declined

C911

26

R608

C502

FL901

C501

R106

L131

R516

C5029

C5027

B
11

R502

C102

L101

R517

U501 C

R606

R503

E
D

Q601

5
4

C115

L127

L102

R102 R103 R104

C519

U504

R510

CN7

CN901 : Sub FPCB Conn.


-no SIM
-no T-flash memory
-no Flash LED
-no motion,Gyro,compass
-no volume

C122

J
H

U701 : LCD Backlight charge pump


- no display
U101 : Transceiver
- no Service
- RF Sensitivity & TX Power

R607

L106

L103

R101

R105

C628

C607

C606

C517

L104

L105

C128

C605

U504 : Motor D-IC


- no vibration

U602

ZD601
C136

C137

C135

C134

C121

C120

C629

C627

U601 : Camera PMIC


- no 8M Camera
- no 1.3M Camera

C630

C626

FL601

C625

L601

C604

12

R609

13

50

R911

C806

14

C908

U203

C301

CN801

CN802

IC301

R409

R705

ZD702

C620

C622

C621

CN12

X101 : 26Mhz X-tal


- no Service

C715

CN702

U502 : Charger IC
- no charging
03

FL702

50

FL703

C909

C521

01

11

U505

L903

CN902
02 14

VA902

C910

C927
C928

VA901

L902

CN902 : Lower Conn.


- no LED
- no MIC
- no speaker
- no Vibrator

ZD701

24

C610
R401 R402

CN602 : 5M Camera Conn.


- no 5M camera

U106 : LNA.
- no WCDMA service
- no RF sensitivity

ZD703

C707

CN801 : GPS Ant. Conn.


- no GPS

C706

CN804

CN803

CN803 : WiFi/Bluetooth antenna


- no WiFi/Bluetooth

CN702 : LCD Conn.


- no display

10

LG-P970_MAIN_EAX63969101_1.0_TOP
LGE Internal Use Only

- 224 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

9. PCB LAYOUT

TP822

TP806

TP803

TP801

TP802

TP804

C828

L810

C206

N
L
K

R222

R218
R226
R219

R224

R217

R225

CN2

U202 : CP memory
- no service

10

14

A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
1

C225

C226

C235

U202

J
C223

C234

C723

R223

C224

U703

Q201 : FET
- no CP USB

C721

R310

C5005

CN1

C236

PT201

U302

C487

C5006

R211

U1203 : WiFi+BT+FM Radio Module


- no WiFi connection
- no BT Connection
- no FM Radio
U201 : CP modem
- no service

C221

C231 C232 C230

R220

C5008 R312

C220

C212

R232
C303 C302

C5007

C205

C210

C218

C209

R212

C217

C219

C722

C208

28
C493

C202

C222

C495

C490

C494

C486

C491

C5009

C492

C478 C476

C5010

C467

D
1

C480

R325

C5023

U404

C5022

C465 C472

C5012

C211

C228

C724

C466

C5011

C233

C470

C215

C479

C201

C439 R307

C207

R324

C5014

C904

R311

C903

C464

C426

C427

R410

C431

C430

C906 C907

C213

AH

C203

C216

Q201

AG

C214

C489

R708

U305

AF

X402

L403

C425

C433

CN5

L404

C428

AE

L201
U201

R208

TP307

AD

C237

L202

R202

AC

C229
C488

C204

20

R210

TP306

AB

C240

A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y

R204

C463

C432

U301

TP308

R206

R221

C482

V
W
AA

C905

TP824

R205

TP309

TP304

C437

TP823

TP305

R407

U901

C450

TP825
TP826

TP303

R406

C424

R231

TP302

C407

R201

C238

R207

R230
TP301

C440

C447

C239

R209
R309

C5004

C5002

X201

R203

C842

R308

R301

R302

R306

C441

C5003

C5001

R305

R314

R320

R303

R304

C5015

C5016

C496

C5013

R321

R315

R316

C499

C498

C497

R322

C438

R319

R323

R318

R313

R317

R227

C841

U805

C847

L805
C835

L811

C850

FL802

C843

h1
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T

C831

C832

C820

L809

CN11

C821

C833
C863

C861

C824

C822C826

C825 C827

R803

C823

C865

C851

C830

C817

14

C819

C834

C836

C857

C838

L808

C856

C460

C461

C862

U403

C446

C485

X802

L807

R909

C858

R904

C5031

R908

C852

C853

C901

R901

C837

U803

C860

U402

C462

R919

R902

R903

C436

C442

R920

R906

R907

C435

16

C451

U804

ZD905

R905

C829

FB806

C5032 C5033

C840

C5019 C459

C452

C854

C902

C420

C434

C423

C429

C483

C422

C5017

C614

C414

R605

C413

R602

L402

R411 C5034

C455

R408

C613

C419 C418

A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T

C453

C609

X401

L401

C448

R804

L901
C912

R604

C417

C410 C415

C411

C457

C445

R601

C484

C444

C449

C421

C409

R413
C5035

C443

C5018

C402

U402 : PMIC
- no Booting
- no Power On
- no Service

C454

C456

CN10

U610

C690

C631

R405

C618

C608

C619

C632

C401

C612

IC601

C617
R610

C859

FB802
C611

C844

FB803

C602

C601

IC601 : Audio system


- no sound

C603

C855

C849

FB804

FB601

C845

L806

FB805

CN9

C846

C848

R805

C839

FB602

X401 : 26Mhz X-tal


- no Power On
- no Booting

TP816 TP805

CN6

U403 : EAR LDO


- no Ear-mic

X401 : 26Mhz X-tal


- no Power On
- no Booting

TP807

X802 : 38.4Mhz X-tal


- no WiFi connection
- no BT Connection
- no FM Radio

C471 C468

CN4

CN3

M601 : BackupCap.
- RTC Reset

BAT401

U301 : POP memory(Top)


- no booting

U703 : RGB LED D-IC


- no Key LED
15

16

U305 : DBB(Bottom)
- no booting
- no Power On
- no Servive

CN201

R236
R228

R235

R229
R234

C242

C241

30

R233

LG-P970_MAIN_EAX63969101_1.0_BOT
LGE Internal Use Only

- 225 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

9. PCB LAYOUT

21

20

CN101
40

LG-P970_SUB_EAX63990501_1.0_TOP
LGE Internal Use Only

- 226 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

9. PCB LAYOUT

LD101

C113

C106

D 103

R 112

R114

R 113

C115

U103

U104

C122
C121

C118

C123

C120
D 102

R 101

D 101

R 106

C 1 0 4

C103

J101 : SIM Socket


- no SIM

U102 : Flash LED D-IC


- no Flash

C108

C107

CN102

C 1 1 2

KB1

CN102 : MicroSD Socket


- no MicorSD

U102

VA101

C105

J101

L101

C114

R115

VA104

R116

C117

R 117

U103 : Gyro sensor


- no Gyro sensor
U104 : Motion sensor
- no motion sensor

U105
R 105

R 104

R109
R108

R 102

R 103

R 107

R110

C119
C116

R111

C124

U104 : Motion sensor


- no motion sensor

TP105

TP104

TP103

TP102

TP101

KB2
KB3

LG-P970_SUB_EAX63990501_1.0_BOT
LGE Internal Use Only

- 227 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

9. PCB LAYOUT

J101

50

26

CN102
25

LG-P970_F_VT_CAM_1.0_TOP
LGE Internal Use Only

- 228 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

9. PCB LAYOUT

MIC101
FL102

42

C106

C105

C107

21

31

U101

FL103

CN103

U102

C101

C102

LG-P970_F_VT_CAM_1.0_BOT
LGE Internal Use Only

- 229 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

9. PCB LAYOUT

VB101

LD101

LD103

LD102

LD104

MIC101

LD105

LD107

LD106

LD108

LG-P970_F_ANT_EAX63991001_1.0_TOP
LGE Internal Use Only

- 230 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

9. PCB LAYOUT

11

10

CN101
20

VA104

VA103

VA107

VA108

C101

VA105

TP102

TP101

C105

CN102

C107

SW101

CN103

C 10 6

LG-P970_F_ANT_EAX63991001_1.0_BOT
LGE Internal Use Only

- 231 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

9. PCB LAYOUT

KB101

CN101

14

CN102
7

LG-P970_F_USB_1.0_TOP
LGE Internal Use Only

- 232 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

9. PCB LAYOUT

CN104

LG-P970_F_USB_1.0_BOT
LGE Internal Use Only

- 233 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

10. Calibration
10. CALIBRATION

10. CALIBRATION
10.1 General Description
This document describes how to install and use the RF calibration software (Tachyon) of LG 3G mobile phone
with Infineon Chipsets.

10.2 Requirement
Requirements for RF calibration of LGE mobile phone are outlined in the following sections.

10.2.1 Hardware
Desktop or laptop computer
Agilent 8960 Series 10 (E5515C) Testset
GPIB card and cable for communicating with Agilent 8960 Series 10 Testset
Power Supply, or 4V battery, and power cable for putting power on the mobile phone.
Data(USB or UART) cables for connecting the mobile phone to computers serial port
RF cable

10.2.2 driver
National Instruments GPIB & VISA driver
LGE mobile USB driver
Data cable driver(optional)

10.2.3 System
Windows XP SP2 or better
RAM 512M or grater
HDD 1GB of available space

LGE Internal Use Only

- 234 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

10. Calibration

10.3 Setup for RF calibration

GPIB cable

Power supply

10.4 Tachyon Software Installation


1) Install Tachyon_setup_Eng_xxxxxxxx.exe to C:/LGE/Tachyon directory.
2) Unzip Tachyon_Release_xxxxxxxx.zip, and overwrite all files to the same path.
3) Install OCX_Registration.bat for registering Tachyon Components in C:/LGE/Tachyon/OCX/ directory.

LGE Internal Use Only

- 235 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

10. Calibration

10.5 Tachyon Usage


After hardware setup is completed successfully and Tachyon program is installed ordinarily, RF calibration or
Auto Test can be start in the following procedure.
1)Execute Tachyon.exe in C:/LGE/Tachyon directory.
2)Click login button in the following login dialog window.

3)Click model selection button in toolbar for selecting the appropriate model.
4)Double click the right model - P970/ORF - in model tree, and then click select button.

LGE Internal Use Only

- 236 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

10. Calibration

3)Click model selection button in toolbar for selecting the appropriate model.
4)Double click the right model - P970/ORF - in model tree, and then click select button.

LGE Internal Use Only

- 237 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

10. Calibration

5)Click system option button in toolbar to connect the mobile phone to the Tachyon.

6)Click run option button in toolbar for passing over LGE factory setting.
7)Check PID write and Skip previously Phone PID check

LGE Internal Use Only

- 238 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

10. Calibration

8)Execute Hecaton.exe for setting RF cable loss to Agilent 8960. If not, Tachyon cant run.

9)Click Calibration+Auto Test button in Toolbar. Now RF calibration and autotest will start.
For more information, refer to the manual in C:/LGE/Tachyon/Manual folder.

LGE Internal Use Only

- 239 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

10. Calibration

10.6 Overview of RF Calibration


10.6.1 Supported entry of RF Calibration
As using PMB5803, P970 adopts some of calibrations in those of PMB5803. This is also supporting Quad band
WCDMA and Quad band GSM. Table 1-1 and Table 1-2 describes the information listed for RF calibration items
used by P970.
Calibration
Tx Sweep

WCDMA 2100

WCDMA 1900

WCDMA 900

WCDMA 850

Calibration
Tx Hdet Calibration

description
Tx output power
measurements

HDET ADC measurements


vs Tx power

Tx Comp vs Freq

Calibration

16-channel Tx output
measurements in a certain
PDM

Tx Secondary

Irregular Tx power

Comp vs Freq

measurements in a certain

Calibration

PDM

Tx Lim vs Freq

Calibration
Rx DVGA Gain

in the Target Power

Offset Calibration
Rx DVGA Gain

HDET ADC measurements

Rx DVGA gain
measurements

Offset vs Freq

16-channel RX DVGA gain


measurements

Calibration
Rx LNA Range

Offset Calibration
Rx LNA Range

LNA gain offset


measurements

Offset vs Freq

16-channel LNA gain offset


measurements

Calibration

Table 1-1. The calibration list for WCDMA

LGE Internal Use Only

- 240 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

10. Calibration

Calibration
VCO Calibration

GSM900

GSM850

GSM1800

GSM1900

description
Lowest frequency error- VCO
measurement

Thermistor Calibration

Thermistor max/min ADC


measurement

Tx External Polar Calibration

Tx output power measurements

Polar path delay Calibration

PM and AM signal path delay

Carrier Suppression Calibration

carrier power measurement

Rx Gain Range Calibration

8 or 16 channel Rx Gain
measurements

For more information, refer to XMM6180_RF_parametrical_structure.pdf.


Table 1-2. The calibration list for GSM

LGE Internal Use Only

- 241 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

10. Calibration

10.6.2 Feature of RF calibration


Tachyon configuration is describes in this section. The information indicates the state of the mobile phones will
become a factor.
[1] WCDMA band
Table 1-3 describes the calibration feature of WCDMA band.
Item

Sub Item

Calibration Channel

WCDMA 2100

WCDMA 900

Tx

9883

2863

Rx

10833

3088

22.5

22.5

Tx Target Power(dBm)
PAM gain switching(dBm)
High Gain Mode

High to low gain

11.0

11.0

Low to high gain

14.0

14.0

Max

222

227

Min

160

134

Calibrated PDM Range


PDM step
Measured data of 32 array

26

25

Up threshold

25.0

25.0

Low threshold

6.0

6.0

Max

235

255

Min

80

69

Threshold of Power Range(dBm)


Low Gain Mode

Calibrated PDM Range


PDM step

Measured data of 32 array

27

26

Up threshold

15.0

16.0

Low threshold

-55.0

-53.0

Lower limit

16.5

16.5

Upper limit

24.5

24.5

Threshold of Power Range(dBm)


Allowable power range in HDET range(dBm)
Allowable HDET adc range

Lower limit

50

80

Upper limit

160

175

DVGA Calibration Power(dBm)


DVGA Calibration Range
LNA Calibration Power(dBm)

-74.0

-74.0

Lower limit

130

80

Upper limit

300

300

Range 0-1

-66.0

-68.0

Range 1-2

-42.0

-50.0

Range 2-3

-26.0

-38.0

Range 3-4

-26.0

Table 1-3. Feature of Tx/Rx calibration in WCDMA 2100/900 band

LGE Internal Use Only

- 242 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

10. Calibration

[2] Quad GSM band


Table 1-4 describes the calibration feature of Quad GSM bands.

Item

Sub item

GSM 900

GSM 850

GSM 1800

GSM 1900

F1

975

128

512

512

F2

124

251

885

810

Power range in AMAM/AMPM NVs

Max

34.0

34.0

31.0

31.0

(dBm)

Min

-20.0

-20.0

-20.0

-20.0

Rx Gain Range Calibration Power

Range 0

-80

-80

-80

-80

(dBm)

Range 1

-80

-80

-80

-80

Range 2

-50

-50

-50

-50

Range 3

-50

-50

-50

-50

Range 4

-50

-50

-50

-50

Rx Gain Range Calibration Range

Range 0

1900/2500

1900/2500

1900/2500

1900/2500

(Lower limit/Upper limit)

Range 1

1200/2300

1200/2300

1200/2300

1200/2300

Range 2

1300/1900

1300/1900

1300/1900

1300/1900

Range 3

1200/1800

1200/1800

1200/1800

1200/1800

Range 4

1100/1700

1100/1700

1100/1700

1100/1700

Tx Calibration channel

Tx External Polar calibration

13025,1900,1950,2000,2050,2100,2150,2200,2250,2300,2350,2400,2450,2500,2550,2600,2

PDM table

650,2700,2750,2800,2850,2900,2950,3000,3075,3150,3225,3300,3375,3450,3525,3600,367
5,3750,3825,3900,3975,4050,4125,4200,4275,4350,4425,4500,4575,4650,4725,4800,4875,4
950,5025,5100,5175,5250,5325,5400,5475,5550,5625,5700,5775,5850,5925,6025,6125,622
5,6325,6425,6525,6625,6725,6825,6925,7025,7125,7225,7325,7425,7525,7625,7725,7825,7
925,8025,8125,8225,8325,8425,8525,8625,8725,8825,8925,9025,9125,9225,9325,9425,952
5,9625,9725,9825,9925,10025,10125,10225,10325,10425,10525,10625,10725,10825,10925,
11025,11125,11225,11375,11525,11675,11825,11975,12125,12275,12425,12575,12725,128
75,13025,13175,13325,13475,13625,13775,13925,14075,14225,14375,14525,14675,14825,
14975,15125,15275,15425,15575,15725,15875,16025,16175,16300

Table 1-4. Feature of Tx/Rx calibration in Quad GSM band

LGE Internal Use Only

- 243 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

10. Calibration

[3] Channels of RF Calibration

W2100
9621

9638

9656

9673

9691

9708

9726

9743

9761

9778

9796

9813

9831

9848

9866

9883

W2100

1057

1058

1060

1062

1064

1065

1067

1069

1071

1072

1074

1076

1078

1079

1081

1083

Rx

2712

2722

2733

2743

2754

2765

2776

2787

2796

2806

2815

2825

2834

2844

2853

2863

2937

2947

2958

2968

2979

2990

3001

3012

3021

3031

3040

3050

3059

3069

3078

3088

Tx

W900
Tx
W900
Rx

Table 1-5 Channel of WCDMA

GSM850

12 8

14 5

16 3

180

19 8

215

23 3

251

GSM900

31

62

92

12 4

97 5

10 00

10 23

Table 1-5 Channel of GSM850/GSM900

GSM
512

537

562

587

612

637

662

687

712

737

762

787

812

837

862

885

512

532

552

572

592

612

632

652

672

692

712

732

752

772

792

810

1800
GSM
1900

Table 1-7 Channel of GSM/1800/GSM1900

LGE Internal Use Only

- 244 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

11. HIDDEN MENU

11. HIDDEN MENU


Hidden Menu Start
Start shortcut keys :
3845#*970#

Device Test
List:
Auto all Test: Device
functionality testing at
the factory to use
Auto All Test Result
LCD Test
ALC / Proximity Test
Vibrator Test
Camera Test
Sound Test
RTC Test
Touch Test
External Memory Test
Key / Compass Test
Gesture Test
LED current control
LCD Backlight current
control
Accelerometer Test
Gyroscope Test
Gyro Cal Test
Hall Sensor Test
Reset SD Card

Hidden Menu List


Start the desired menu:
Menu, click

Version Info
Classified Information
representation

Device Test List


Auto All Test :
-> Auto All Test menu
click
-> Continuous
information on the
menu, giving you
ability test

Factory Reset
Format SD card :
External SD Card Data
reset
Factory Rest : Changing
the Factory
Delete Userdata : Delete
Userdata

LGE Internal Use Only

- 245 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

11. HIDDEN MENU

LGE Internal Use Only

Display Check Test

Vibrator Test

Key / SIM / SD Card /


TA / Proximity / ALC /
Compass

Touch Draw Test

Ring Test

Camera Test_1
- Primary Camera

- 246 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

11. HIDDEN MENU

VT Camera Test

LGE Internal Use Only

Camera Test_2
- Primary Camera

Accelerometer Test

Camera Test_3
- Sencondary Camera

Gyroscope test

GPS / BT / WiFi

ELT Test
Automatic Mode : Test
Automatically
Manual Mode : Test
selectivity

- 247 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

11. HIDDEN MENU

LGE Internal Use Only

ELT Test
Automatic Mode : LCD
Automatic on/off test
-> time setting

Port Setting

SW Sanity Test:
FPRI Test
CRC Test: 1. BIN CRC
2. CAL CRC
3. EFS CRC
Detail

Modem Setting
Menu:
Engineering Mode
RRC Version Setting
QCRIL Log On/Off
PDP Setting
HSDPA Category
GSM A5 Algorithm
Protocol Test
GCF Flag
Arm9 Log On/Off
Qos profiles
Preferred networks
CAL Backup / Restore

AP CP USB Switching

Module Test
List:
BT DUT setting
SMS Prefer Set
FOTA Test
LCD Always On
FS_TEST
Hidden Reset
Heap Free Info
Stability Test
Charging Test

- 248 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

11. HIDDEN MENU

SIM Test

Streaming

Browser Utility

Call Test

MMS Test

Aging Test

LGE Internal Use Only

- 249 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

11. HIDDEN MENU

LGE Internal Use Only

SMS Test

WLAN Test
WLAN performance on
SW

GPS Test

Network Mode

GPS Test_HW

KR Setting

- 250 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

11. HIDDEN MENU

LGE Internal Use Only

Contacts Test

ADC Test

OmaDM Test

DRM Test

ERS Menu

DB check

- 251 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

11. HIDDEN MENU

IMEI / BT address

Log Service
Collect Log

VT Test

LGE Internal Use Only

- 252 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

12. EXPLODED VIEW & REPLACEMENT PART LIST


12.1 EXPLODED VIEW
EBD00

MJN01

MJN00

MCQ00

EBR02
MDJ00

MEV02

EAB01

SJMY00

EBR00

EAD00

MAZ00

MJN02

GMEY01

GMZZ00

SUMY00

SVCY00

MEG00

MJN000

EBR01

MEV00

EAJ00

MHK01

MCQ03

EBR03
SVCY01

MEV01

ABM00

MAZ01
MHK02

MCQ06

ABM01

MHK00
EBR04
MJN03
MCQ04
MCQ01

ACQ01

MBL01
MBG00

MBG01

ACQ00

EAC00
MBL00

GMEY00

MCQ05

MCQ02
EAA00
MCQ07
EAB00

LGE Internal Use Only

- 253 -

ACQ02

Location
ACQ00
MBL00
EAA00
EAB00
SVCY00
SJMY00
EBR00
EBR01
EBR02
SUMY00
EBD00
EAJ00
EAD00
EAB01
ACQ01
MBG00
MBG01
MJN000
GMEY01
GMZZ00
MAZ00
MAZ01
MBL01
MCQ00
MCQ01
MCQ02
MCQ03
MCQ04
MCQ05
MCQ06
MCQ07
MDJ00
MEG00
MEV00
MEV01
MEV02
MHK00
MHK01
MHK02
MJN00
MJN01
MJN02
MJN03
EBR03
ABM00
ABM01
SVCY01
EBR04
GMEY00
ACQ02
EAC00

Description
Cover Assembly,Rear
Cap,Receptacle
PIFA Antenna,Multiple
Speaker Module
Camera Module
Motor,DC
PCB Assembly,Flexible
PCB Assembly,Flexible
PCB Assembly,Flexible
Microphone,Condenser
Touch Window Assembly
LCD,Module-TFT
Cable,Assembly
Receiver
Cover Assembly,Front
Button
Button
Tape
Screw,Machine
Screw,Machine
Bracket
Bracket
Cap
Damper,LCD
Damper
Damper
Damper
Damper,LCD
Damper
Damper
Damper,LCD
Filter
Holder
Insulator
Insulator
Insulator
Sheet
Sheet
Sheet
Tape,Window
Tape,Window
Tape
Tape
PCB Assembly,Main
Can Assembly,Shield
Can Assembly,Shield
Camera Module
PCB Assembly,Flexible
Screw,Machine
Cover Assembly,Battery
Rechargeable Battery,Lithium Ion

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 Replacement Parts


<Mechanic component>

Note: This Chapter is used for reference, Part order is


ordered by SBOM standard on GCSC

Level

Location No.

Description

AGQ000000

Phone Assembly

AGQ86489825

LGP970.ADEUTL TL:Titanium Black -

ACQ100400

Cover Assembly,
EMS

ACQ85556326

LGP970.ADEUTL TL:Titanium Black -

ACQ00

Cover Assembly,
Rear

ACQ85429401

LGP970.ADEUZY ZZ:Without Color -

MCQ015704

Damper, Connector

MCQ66564901

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MEZ000900

Label, After Service

MLAB0001102

COMPLEX C2000 CGRSV WA:White C2000


USASV DIA 4.0 PRINTING,

MBL00

Cap, Receptacle

MBL64916901

MOLD PC LGP970.ADEUZY ZZ:Without Color -

MBL049500

Cap, Mobile Switch

MBL64901801

MOLD PC LGP970.ADEUZY ZZ:Without Color -

MCQ000001

Damper

MCQ66719801

COMPLEX LGP970.ADEUZY ZZ:Without Color


110304_sniper_damper_io_conn

MCQ000000

Damper

MCQ66708001

CUTTING SR LGP970.ABYTTL ZZ:Without Color -

EAA030101

PIFA Antenna,
Multiple

EAA62505001

ACB-00105 DUAL -2DB 3:1 Planar Inverted F Type


- MOBITECH CORPORATION

EAA00

PIFA Antenna,
Multiple

EAA62466301

HIL-02A82-0000AA MULTI -2DB 3:1 LDS Type E.M.W CO., LTD.

EAB00

Speaker Module

EAB62291101

SI-B-P Nd-Fe-B 700mW 8OHM 78DB 1.32KHZ


38.65*32.79*6.4 1810*3.0T module PIN BUJEON
ELECTRONICS CO., LTD

MCQ015702

Damper, Connector

MCQ66573301

CUTTING TR 30 LGKU5900.AKTFBK ZZ:Without


Color -

MCQ015701

Damper, Connector

MCQ66573401

CUTTING TR 30 LGKU5900.AKTFBK ZZ:Without


Color -

MCQ015703

Damper, Connector

MCQ66573501

CUTTING TR 30 LGKU5900.AKTFBK ZZ:Without


Color -

MCQ015700

Damper, Connector

MCQ66573601

CUTTING TR 30 LGKU5900.AKTFBK ZZ:Without


Color -

LGE Internal Use Only

PartNumber

Spec

- 254 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

MCQ009400

Damper,
Camera

MCQ66584701

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MCR000000

Decor

MCR64426301

PRESS AL5052 0.3 LGP970.ADEUZY ZZ:Without


Color -

MFB029600

Lens, Flash

MFB62532901

MOLD PC LGP970.ADEUZY ZZ:Without Color -

MJN020800

Tape, Decor

MJN67746901

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MJN061100

Tape, Protect

MJN67751301

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MJN000000

Tape

MJN67756501

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MJN009400

Tape, Camera

MJN67767001

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MKC009400

Window, Camera

MKC63998801

CUTTING PMMA LGP970.ADEUZY ZZ:Without


Color -

MCK063300

Cover, Rear

MCK66685001

MOLD PC LGP970.ADEUZY ZZ:Without Color -

ACQ003400

Cover Assembly,
Bar

ACQ85450201

LGP970.ADEUZY ZZ:Without Color -

SVCY00

Camera Module

SVCY0023801

C2FA-H274A C2FA-H274T 2M FF, Hynix(1/5"),


7x7x4.1t, FPCB, 90degree LG INNOTEK CO.,
LTD

SJMY00

Motor, DC

SJMY0007118

MVMF-A301F 2.0 V, 40 mA, 10*3.0, Q-Coin 12mm


Wire, 3V, - LG INNOTEK CO., LTD

EBR00

PCB Assembly,
Flexible

EBR73418511

LGP970.ABYTTL 1.0 Flexible

EBR070100

PCB Assembly,
Flexible, Insert

EBR73707601

LGP970.ABYTTL 1.0 Flexible

EBR070400

PCB Assembly,
Flexible, SMT

EBR73418602

LGP970.ADEUZY 1.0 Flexible

EAX010700

PCB, Flexible

EAX63990901

LGP970.ADEUZY 1.2 POLYI Multi 3 0.33 Flexible

EBR070200

PCB Assembly,
Flexible,
SMT Bottom

EBR73418702

LGP970.ADEUZY 1.0 Flexible

LGE Internal Use Only

Description

PartNumber

Spec

- 255 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

EBR070300

PCB Assembly,
Flexible,
SMT Top

EBR73418902

LGP970.ADEUZY 1.0 Flexible

EBR01

PCB Assembly,
Flexible

EBR73418510

LGP970.ABYTTL 1.0 Flexible

EBR070400

PCB Assembly,
Flexible, SMT

EBR73418603

LGP970.ADEUZY 1.0 Flexible

EAX010700

PCB, Flexible

EAX64107901

LGP970.ADEUZY 1.0 POLYI SBL 4 0.33 Flexible

EBR070200

PCB Assembly,
Flexible,
SMT Bottom

EBR73418703

LGP970.ADEUZY 1.0 Flexible

MIC101

Microphone,
Condenser

SUMY0010609

SPU0410HR5H -PB SPU0410HR5H -PB, UNIT,


42 dB, 3.76*2.95*1.1, mems smd mic KNOWLES
ACOUSTICS

EBR070300

PCB Assembly,
Flexible,
SMT Top

EBR73418903

LGP970.ADEUZY 1.0 Flexible

EBR070100

PCB Assembly,
Flexible, Insert

EBR73496201

LGP970.AORFTL 1.0 Flexible

MJN000001

Tape

MJN67849401

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MJN000000

Tape

MJN67849501

COMPLEX LGP970.ADEUZY ZZ:Without Color -

EBR02

PCB Assembly,
Flexible

EBR73418505

LGP970.ABYTTL 1.0 Flexible

EBR070100

PCB Assembly,
Flexible, Insert

EBR73495801

LGP970.AORFTL 1.1 Flexible

MJN000001

Tape

MJN67767401

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MJN000002

Tape

MJN67767402

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MJN000000

Tape

MJN67849601

COMPLEX LGP970.ADEUZY ZZ:Without Color -

EBR070400

PCB Assembly,
Flexible, SMT

EBR73418601

LGP970.ADEUZY 1.0 Flexible

EAX010700

PCB, Flexible

EAX63991001

LGP970.ADEUZY 1.1 POLYI SBL 5 0.5 Flexible

LGE Internal Use Only

Description

PartNumber

Spec

- 256 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

EBR070200

PCB Assembly,
Flexible,
SMT Bottom

EBR73418701

LGP970.ADEUZY 1.0 Flexible

EBR070300

PCB Assembly,
Flexible,
SMT Top

EBR73418901

LGP970.ADEUZY 1.0 Flexible

SUMY00

Microphone,
Condenser

SUMY0010609

SPU0410HR5H -PB SPU0410HR5H -PB, UNIT,


42 dB, 3.76*2.95*1.1, mems smd mic KNOWLES
ACOUSTICS

EBD00

Touch Window
Assembly

EBD61045401

TSMC-G402A CAPACITIVE TOUCH G/G


SYNAPTICS T1320 4 Inch B to B - LG INNOTEK.,
LTD.

EAJ00

LCD, Module-TFT

EAJ61772201

TX10D10VM0EAA WVGA 4.0INCH 480X800


700CD COLOR 70% 16/9 1000:1 60Hz Inverter N HITACHI DISPLAYS., LTD

EAD00

Cable, Assembly

EAD61727901

UFL-2LPVHF-04N1TC-A84SLG UFL-LP-066 UFLLP-066 0.084M 2 WHITE none N HIROSE


KOREA CO., LTD

EAB01

Receiver

EAB62293401

BWBR1208L-07B-P 40mW 32OHM 105.5DB


300HZTO3.5HZ WIRE 1208*2.05T wire 10mm
BUJEON ELECTRONICS CO., LTD

ACQ01

Cover Assembly,
Front

ACQ85429501

LGP970.ADEUZY ZZ:Without Color -

MEG000000

Holder

MEG62758601

MOLD NBR LGP970.ADEUZY ZZ:Without Color -

MJN000000

Tape

MJN67747101

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MJN061100

Tape, Protect

MJN67767201

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MDS000002

Gasket

MDS63635101

CUTTING TR 30 LGP970.ADEUZY ZZ:Without


Color -

MDS000000

Gasket

MDS63632601

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MDS000001

Gasket

MDS63615301

COMPLEX LGP970.ADEUZY ZZ:Without Color


CT20XT 0.03t

MJN000002

Tape

MJN67879101

CUTTING TAPE LGP970.ADEUZY ZZ:Without


Color 110323_SNIPER_TAPE_SPEAKER_FPC

MJN000001

Tape

MJN67760201

CUTTING TAPE LGP970.ADEUZY ZZ:Without


Color -

LGE Internal Use Only

Description

PartNumber

Spec

- 257 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

MDS000003

Gasket

MDS63650901

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MJN061101

Tape, Protect

MJN67767301

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MDJ000000

Filter

MDJ63107001

CUTTING BK7 LGP970.ADEUZY ZZ:Without Color


-

MBG00

Button

MBG64222501

MOLD PC LGP970.ADEUZY ZZ:Without Color -

MBG01

Button

MBG64202501

MOLD PC LGP970.ADEUZY ZZ:Without Color -

ADV000000

Frame Assembly

ADV73965501

LGP970.ADEUZY ZZ:Without Color -

MCK032700

Cover, Front

MCK66664601

MOLD PC LGP970.ADEUZY ZZ:Without Color -

MDQ000000

Frame

MDQ62896401

CASTING MG LGP970.ADEUZY ZZ:Without Color


-

MEZ000000

Label

MLAZ0038303

COMPLEX LG-LC3200 WA:White PRINTING,


PPRI PRINTING

MJN000

Tape

MJN67895201

CUTTING TAPE LGP970.ABYTTL ZZ:Without


Color -

GMEY01

Screw, Machine

GMEY0010402

GMEY0010402 BH + 1.4mM 2mM MSWR FZB N SERVEONE CO., LTD.

GMZZ00

Screw, Machine

GMZZ0019007

111111 FH + 1.4mM 1.5mM MSWR FZW N SEAGATE TECHNOLOGY, INC.

MAZ00

Bracket

MAZ63103301

PRESS STS 304 0.3 LGP970.ADEUZY ZZ:Without


Color -

MAZ01

Bracket

MAZ63131101

PRESS STS 304 0.15 LGP970.ADEUZY


ZZ:Without Color -

MBL01

Cap

MBL64897001

MOLD NBR LGP970.ADEUZY ZZ:Without Color -

MCQ00

Damper, LCD

MCQ66584901

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MCQ01

Damper

MCQ66672501

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MCQ02

Damper

MCQ66707801

CUTTING SR LGP970.ABYTTL ZZ:Without Color -

MCQ03

Damper

MCQ66707901

CUTTING SR LGP970.ABYTTL ZZ:Without Color -

LGE Internal Use Only

Description

PartNumber

Spec

- 258 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

MCQ04

Damper, LCD

MCQ66715401

CUTTING SR LGP970.ABYTTL ZZ:Without Color


20110221_P970_DAMPER_LCD2

MCQ05

Damper

MCQ66719901

COMPLEX LGP970.ADEUZY ZZ:Without Color


110304_DAMPER_TOUCH_FPC

MCQ06

Damper

MCQ66721401

COMPLEX LGP970.ADEUZY ZZ:Without Color


110308_damper_earjack3

MCQ07

Damper, LCD

MCQ66726401

COMPLEX LGP970.ADEUZY ZZ:Without Color


110323_damperr_lcd_fpc

MDJ00

Filter

MDJ63085501

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MEG00

Holder

MEG62778601

MOLD NBR LGP970.ADEUZY ZZ:Without Color -

MEV00

Insulator

MEV63879301

COMPLEX LGP970.ADEUZY ZZ:Without Color


110323_SNIPER_TAPE_LCD_MASKING

MEV01

Insulator

MEV63892701

CUTTING TAPE LGP970.ABYTTL ZZ:Without


Color 20110217_P970_INSULATOR_LCD_FPC

MEV02

Insulator

MEV63892801

CUTTING TAPE LGP970.ABYTTL ZZ:Without


Color
2011.02.17_PP70_INSULATOR_TOUCH_WINDO
W

MHK00

Sheet

MHK63409901

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MHK01

Sheet

MHK63425501

CUTTING STEEL SUS301 LGP970.ADEUZY


ZZ:Without Color -

MHK02

Sheet

MHK63511701

PRESS STS . LGP970.ADEUZY ZZ:Without Color -

MJN00

Tape, Window

MJN67747001

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MJN01

Tape, Window

MJN67751201

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MJN02

Tape

MJN67767401

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MJN03

Tape

MJN67775401

CUTTING TAPE LGP970.ADEUZY ZZ:Without


Color -

MJN061100

Tape, Protect

MJN67780701

CUTTING TAPE LGP970.ADEUZY ZZ:Without


Color -

LGE Internal Use Only

Description

PartNumber

Spec

- 259 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

EBR03

PCB Assembly,
Main

EBR72710027

LGP970.ADEUTL 1.0 Main

EBR071500

PCB Assembly,
Main, Insert

EBR73480802

LGP970.ABYTTL 1.1 Main

ABM00

Can Assembly,
Shield

ABM73496701

LGP970.ADEUZY ZZ:Without Color Top Assy

MEV000002

Insulator

MEV63793401

COMPLEX LGP970.ADEUZY ZZ:Without Color


insulator top3

MEV000001

Insulator

MEV63793301

COMPLEX LGP970.ADEUZY ZZ:Without Color


Insulator top2

MEV000000

Insulator

MEV63793201

COMPLEX LGP970.ADEUZY ZZ:Without Color


Top Insulator top 1

MBK070300

Can, Shield

MBK62935401

PRESS STS 0.15 LGP970.ADEUZY ZZ:Without


Color -

MEV000003

Insulator

MEV63793501

COMPLEX LGP970.ADEUZY ZZ:Without Color


insulator top4

MCQ000000

Damper

MCQ66718901

COMPLEX LGP970.ADEUZY ZZ:Without Color -

ABM01

Can Assembly,
Shield

ABM73496801

LGP970.ADEUZY ZZ:Without Color -

MBK070300

Can, Shield

MBK62915501

PRESS STS 0.15 LGP970.ADEUZY ZZ:Without


Color -

MCQ000000

Damper

MCQ66719001

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MEV000000

Insulator

MEV63793601

COMPLEX LGP970.ADEUZY ZZ:Without Color


insulator bottom1

MEV000001

Insulator

MEV63793701

COMPLEX LGP970.ADEUZY ZZ:Without Color


insulator bottom2

MEV000000

Insulator

MEV63854901

COMPLEX LGP970.AGBRBK ZZ:Without Color -

SVCY01

Camera Module

SVCY0022201

C5AA-Y258A CMOS, MEGA, 5M AF Sony(1/4"),


8.5x8.5x5.35t, MIPI, FPCB LG INNOTEK CO., LTD

EBR04

PCB Assembly,
Flexible

EBR73418508

LGP970.ABYTTL 1.0 Flexible

EBR070400

PCB Assembly,
Flexible, SMT

EBR73418604

LGP970.ADEUZY 1.0 Flexible

LGE Internal Use Only

Description

PartNumber

Spec

- 260 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

EAX010700

PCB, Flexible

EAX63990501

LGP970.ADEUZY F POLYI Multi 3 0.21 Flexible

EBR070200

PCB Assembly,
Flexible,
SMT Bottom

EBR73418704

LGP970.ADEUZY 1.0 Flexible

EBR070300

PCB Assembly,
Flexible,
SMT Top

EBR73418904

LGP970.ADEUZY 1.0 Flexible

EBR070100

PCB Assembly,
Flexible, Insert

EBR73529901

LGP970.ABYTTL 1.0 Flexible

MCQ000000

Damper

MCQ66565001

COMPLEX LGP970.ADEUZY ZZ:Without Color -

MJN000000

Tape

MJN67855401

COMPLEX LGP970.AGBRBK ZZ:Without Color -

MEV000001

Insulator

MEV63892301

COMPLEX LGP970.ADEUZY ZZ:Without Color -

RAA050100

Resin, PC

BRAH0001301

UF-1060

EBR071800

PCB Assembly,
Main, SMT

EBR72710128

LGP970.ADEUTL 1.0 Main

EBR071600

PCB Assembly,
Main,
SMT Bottom

EBR72710302

LGP970.ADEUZY 1.0 Main

EAX010000

PCB, Main

EAX63969101

LGP970.ADEUZY 1.0 FR-4 Any Layer 10 0.65


MAIN

MEZ000000

Label

MLAZ0038301

COMPLEX LG-VX6000 ZZ:Without Color PID Label


4 Array PRINTING,

EBR071700

PCB Assembly,
Main, SMT Top

EBR72710201

LGP970.ADEUZY 1.1 MAIN

GMEY00

Screw, Machine

GMEY0011201

GMEY0011201 BH + 1.4mM 3mM MSWR FZB N N


LG ELECTRONICS INC.

MEZ002100

Label, Approval

MLAA0062316

COMPLEX GU280 OREBK ZZ:Without Color


COMPLEX, (empty), , , , ,

AAD000000

Addition Assembly

AAD85771425

LGP970.ADEUTL TL:Titanium Black -

ACQ02

Cover Assembly,
Battery

ACQ85555901

LGP970.ADEUZY ZZ:Without Color -

MCK004100

Cover, Battery

MCK66664801

MOLD PC LGP970.ADEUZY ZZ:Without Color -

LGE Internal Use Only

Description

PartNumber

Spec

- 261 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

MCQ000000

Damper

MCQ66716401

CUTTING SR LGP970.ABYTTL ZZ:Without Color


110224_P970_DAMPER_SIM_CARD

MJN061100

Tape, Protect

MJN67831801

CUTTING TAPE LGP970.ADEUZY ZZ:Without


Color -

AGF000000

Package Assembly

AGF76200904

LGP970.ADEUTL ZZ:Without Color TR11H_LGP970_ENG_ENG STD

MCQ007000

Damper, Box

MPBA0007416

COMPLEX LGP970.ADEUZY ZZ:Without Color


GSP2 Type_Phone Pad_Global SP(P970) Model for
Only

MEZ000000

Label

MLAZ0050901

COMPLEX KU990 GBRBK ZZ:Without Color -

MEZ047200

Label, Master Box

MLAJ0004402

PRINTING CG300 CGR DG ZZ:Without Color


LABEL MASTER BOX(for CGR TDR 2VER.
mbox_label) GSM standard_master box label

MEZ003500

Label, Barcode

MLAC0004541

PRINTING HB620 KPNBK ZZ:Without Color GSM


standard_unit box label_90*40

MHR007000

Sleeve, Box

MHR62133203

BOX SC 120 160 59 5 COLOR LGP970.ADEUTL


ZZ:Without Color GSP2(TR1-1H)_LGP970_ENG_ENG STD

MAY047100

Box, Master

MBEE0059801

COMPLEX KS360 ACNRD ZZ:Without Color -

AGJ000000

PALLET ASSY

APLY0003203

KE500 AREBK BK, ZZ, TDR TR1-1 ORG STD


Palletizing

MBEC00

Box, Carton

MBEC0003001

COMPLEX KU250 TMDBK ZZ:Without Color -

MCCL00

Cap, Box

MCCL0001701

COMPLEX KG270 AREBK ZZ:Without Color -

MPBZ00

Damper

MPBZ0219601

COMPLEX KM500 ROMBB ZZ:Without Color -

MPCY00

Pallet

MPCY0012403

COMPLEX KG800 FRABK DB:DARK BLUE -

MAY084000

Box, Unit

MAY64851007

COMPLEX LGP970.AORATL ZZ:Without Color


GSP2 Type_Global SP Model for Only

LGE Internal Use Only

Description

PartNumber

Spec

- 262 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 Replacement Parts


<Main component>

ordered by SBOM standard on GCSC

Level

Location No.

CN101

Connector, I/O

ENRY0008801

GU073-5P-SD-E1500 GU073-5P-SD-E1500, 5,
mm, ANGLE LS Mtron Ltd.

CN102

Connector, BtoB

ENBY0053101

14-5804-014-000-829+ 14, mm, STRAIGHT,


0.40MM, MALE, KYOCERA ELCO KOREA
SALES CO., LTD.

U101

IC, Ambient Light


Sensor

EUSY0388201

BH1621FVC BH1621FVC, WSOF6, 5, R/TP,


1.6*1.6 - WSOF6 R/TP 5P - ROHM Semiconductor
KOREA CORPORATION

C101,
C102,
C105

Capacitor, Ceramic,
Chip

ECZH0001215

C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION

FL102,
FL103

Filter, EMI/Power

SFEY0013501

EVRC18S03Q015010R ESD/EMI 0HZ 7.5pF 0H


SMD R/TP AMOTECH CO., LTD.

C107

Capacitor, Ceramic,
Chip

ECCH0002001

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P 30TO+85C 1005 R/TP - TDK CORPORATION

U102

IC, Proximity

EUSY0376201

GP2AP002S00F GP2AP002S00F, 8, R/TP SHARP


CORPORATION.

C106

Capacitor, Ceramic,
Chip

ECCH0017601

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

CN103

Connector, BtoB

ENBY0034201

GB042-24S-H10-E3000 24P 0.40MM STRAIGHT


SOCKET SMD R/TP 1M - LS Mtron Ltd.

J101

Jack, Phone

EAG62831701

KJA-PH-3-0176 4P 4P ANGLE R/TP 3.5M BLACK


5P 6.5x12.6x4.0t, Short Detect, All DIP type KSD
CO., LTD

CN102

Connector, BtoB

ENBY0051301

14-5804-040-000-829+ 40P 0.40MM STRAIGHT


MALE SMD R/TP 900mM - KYOCERA ELCO
KOREA SALES CO., LTD.

VA103,
VA104,
VA105,
VA107,
VA108

Varistor

SEVY0010501

IECS0505C040FR 10V 0% 4E-12F 1.0x0.5x0.3


IEC61000-4-1 (ESD) level #4 SMD R/TP
INNOCHIPS TECHNOLOGY

LGE Internal Use Only

Description

Note: This Chapter is used for reference, Part order is

PartNumber

Spec

- 263 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

CN102, CN103

Connector, Terminal
Block

ENZY0018801

25SMT-4442-01 0P A-LOGICS STRAIGHT SMD


R/TP - W.L.GORE & ASSOCIATES INC

C101,
C102,
C105

Capacitor, Ceramic,
Chip

ECZH0001215

C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION

C107

Inductor, Multilayer,
Chip

ELCH0003847

LQG15HS1N8S02D 1.8NH 0.3NH - 300mA


0.1OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP MURATA MANUFACTURING CO., LTD.

SW101

Connector, RF

ENWY0003901

U.FL-R-SMT(10) 1.90MM STRAIGHT SOCKET


SMD T/REEL CU 50OHM 300mDB HIROSE
KOREA CO., LTD

CN101

Connector, BtoB

ENBY0039501

GB042-20P-H10-E3000 20P 0.40MM STRAIGHT


PLUG SMD R/TP 1M - LS Mtron Ltd.

LD102,
LD104,
LD106,
LD108

LED, Chip

EDLH0008501

SSC-HB105-LA BLUE 2.75~3.15 30mA


11~17mCD 462TO469nM 94.5mW 1608 R/TP 2P SEOUL SEMICONDUCTOR CO., LTD

LD101,
LD103,
LD105,
LD107

LED, Chip

EDLH0011901

SSC-TWH104-HL WHITE 2.7~3.1 20mA


100~220mcd X(0.24~0.34) Y(0.25~0.34) 66mW
1608 R/TP 2P - SEOUL SEMICONDUCTOR CO.,
LTD

CN102

Socket, Card

EAG62830201

104031-0811 SD 8P ANGLE SMD R/TP


11.95x11.40x1.42t, Push-pull type MOLEX

U105

IC, Magnetic Sensor

EBD60945201

AK8975C 1.6~3.6 Geomagnetic Sensor - CSP R/TP


14P - ASAHI KASEI CORPORATION

C108

Capacitor, Ceramic,
Chip

ECCH0000113

MCH155A180J 18pF 5% 50V NP0 -55TO+125C


1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

C105

Capacitor, Ceramic,
Chip

ECCH0000115

MCH155A220JK 22pF 5% 50V NP0 -55TO+125C


1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

C115

Capacitor, Ceramic,
Chip

ECCH0000147

MCH155CN222KK 2.2nF 10% 50V X7R 55TO+125C 1005 R/TP - ROHM.

C107

Capacitor, Ceramic,
Chip

ECCH0002001

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P 30TO+85C 1005 R/TP - TDK CORPORATION

C112,
C114

Capacitor, Ceramic,
Chip

ECCH0007802

CL10A475KP8NNNC 4.7uF 10% 10V X5R 55TO+85C 1608 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.

LGE Internal Use Only

Spec

- 264 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

C104

Capacitor, Ceramic,
Chip

ECCH0007803

CL10A106MP8NNNC 10uF 20% 10V X5R 55TO+85C 1608 R/TP 0.8MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

C113

Capacitor, Ceramic,
Chip

ECZH0001120

CC1005X7R1H392KT000F 3.9nF 10% 50V X7R 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

LD101

LED, Chip

EDLM0009701

EHP-C04/NT01A-P01/TR(LM) WHITE 3.35~4.15


1A 100~140lm x, y 6.6W - R/TP 2P - EVERLIGHT
ELECTRONICS CO., LTD.

D101,
D102,
D103

Diode, TVS

EDTY0009801

VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP


6P 5 PROTEK DEVICES INC.

L101

Inductor, Wire
Wound, chip

ELCP0009408

LQM2HPN1R0MG0 LQM2HPN1R0MG0, 1 uH, N,


2X2.5X1.0, R/TP, Chip power MURATA
MANUFACTURING CO., LTD.

J101

Card Socket

ENSY0024301

KP09N-6S-2.54SF SIM 6P ANGLE SMD R/TP HIROSE KOREA CO., LTD

R116

Resistor, Chip

ERHZ0000237

MCR01MZP5F2002 20KOHM 1% 1/16W 1005


R/TP - ROHM.

R115

Resistor, Chip

ERHZ0000279

MCR01MZP5F3902 39KOHM 1% 1/16W 1005


R/TP - ROHM.

R105,
R107,
R117

Resistor, Chip

ERHZ0000405

MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP


- ROHM.

R113,
R114

Resistor, Chip

ERHZ0000406

MCR01MZP5J104 100KOHM 5% 1/16W 1005


R/TP - ROHM.

R108,
R109,
R110,
R111

Resistor, Chip

ERHZ0000420

MCR01MZP5J151 150OHM 5% 1/16W 1005 R/TP


- ROHM.

R106

Resistor, Chip

ERHZ0000456

MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP


- ROHM.

R112

Resistor, Chip

ERHZ0000485

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005


R/TP - ROHM.

R101,
R102,
R103,
R104

Resistor, Chip

ERHZ0000486

MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP


- ROHM.

U102

IC, DC, DC
Converter

EUSY0344406

RT8515 QFN, 16, R/TP, 2X3, IC, DC, DC


ConverterIC, DC, DC Converter RICHTEK
TECHNOLOGY CORP.

LGE Internal Use Only

Spec

- 265 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

U104

U103

PartNumber

Spec

IC, Acceleration
Sensor

EUSY0410101

KXTF9 1.8V to 3.6V 400KHZ 12BIT 1SPS 1W LGA


R/TP 10P Accelerometer Sensor - LGA R/TP 10P KIONIX, INC.

IC, Gyro Sensor

EUSY0434601

MPU3050 1.8~3.6 Gyro Sensor - QFN R/TP 24P INVENSENSE

VA101,
VA104

Varistor

SEVY0004401

ICVL0518400V500FR 18V 0% 40pF 1.0*0.5*0.55


NONE SMD R/TP INNOCHIPS TECHNOLOGY

CN101

Connector, BtoB

ENBY0035901

GB042-40P-H10-E3000 40P 0.4MM STRAIGHT


PLUG SMD R/TP 1M - LS Mtron Ltd.

R323

Resistor, Chip

ERHY0009501

MCR006YZPJ000 0OHM 5% 1/20W 0603 R/TP ROHM.

R301,
R302

Resistor, Chip

ERHY0009306

MCR006YZPF1801 1.8KOHM 1% 1/20W 0603


R/TP - ROHM.

U305

IC, MCP, NAND

EAN61834101

H8MBX00U0MER-0EM 4096MBIT 1.7VTO1.95V


12.0x12.0x0.74 TR 168P DRAM FBGA - HYNIX
SEMICONDUCTOR INC.

R303,
R304

Resistor, Chip

ERHY0009592

MCR006YZPJ202 2KOHM 5% 1/20W 0603 R/TP ROHM.

LGE Internal Use Only

Description

- 266 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

C212,
C215,
C216,
C223,
C224,
C225,
C226,
C229,
C230,
C231,
C232,
C233,
C234,
C235,
C236,
C411,
C413,
C414,
C415,
C453,
C455,
C467,
C468,
C472,
C476,
C478,
C479,
C480,
C489,
C492,
C495,
C499

Capacitor, Ceramic,
Chip

ECCH0009101

LGE Internal Use Only

Spec

remark

C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION

- 267 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

C5004,
C5008,
C5012,
C5014, C5015,
C5016,
C5034,
C5035,
C613,
C614,
C819,
C822,
Capacitor, Ceramic,
C823,
Chip
C825,
C826,
C827,
C828,
C829,
C830,
C847,
C860,
C863,
C901,
C904,
C906

PartNumber

Spec

ECCH0009101

C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION

C841,
C842,
C843

Capacitor, Ceramic,
Chip

ECCH0009514

MCH032A(AN)100DK 10pF 0.5PF 25V X7R 55TO+125C 0603 R/TP - ROHM.

U402

IC, PMIC

EAN61827101

TWL5034 2.1 to 5V adj 1.4W BGA R/TP 209P TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.

C421,
C422,
C424,
C426,
C428,
C430

Capacitor, Ceramic,
Chip

ECZH0003103

GRM36X7R104K10PT 100nF 10% 10V X7R 55TO+125C 1005 R/TP - MURATA


MANUFACTURING CO., LTD.

C465,
C470

Capacitor, Ceramic,
Chip

ECCH0009201

GRM033R60J473KE19D 47nF 10% 6.3V X5R 55TO+85C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

R230,
R231,
R411,
R805,
R920

PCB ASSY, MAIN,


PAD SHORT

SAFP0000401

LG-LU3000 LGTBK, MAIN, A,

X201,
X402

Crystal

EXXY0018701

FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM


12.5PF 32*15 SMD R/TP SEIKO EPSON CORP

LGE Internal Use Only

- 268 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

R601,
R602

Resistor, Chip

ERHZ0000434

MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP ROHM.

C418,
C907

Capacitor, Ceramic,
Chip

ECZH0025920

GRM033R71C102K 1nF 10% 16V X7R 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

R201,
R204,
R208,
R209,
R228,
R229,
R233,
R234,
R235,
R236,
R313,
R315,
R320,
R413,
R610,
R919

PCB ASSY, MAIN,


PAD OPEN

SAFO0000401

AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI

FB802,
FB803,
FB804,
FB805,
FB806

Filter, Bead

SFBH0008101

BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6


ohm 0.3A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.

LGE Internal Use Only

Description

PartNumber

Spec

- 269 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

C207,
C208,
C214,
C407,
C432,
C434,
C438,
C439,
C440,
C441,
C451,
C452,
C454,
C456,
C457,
C459,
C460,
C461,
C462,
C463,
C482,
C483,
C484,
C485,
C488,
C491,
C494,
C498

Capacitor, Ceramic,
Chip

ECCH0017301

CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R 45TO+85C 0603 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.

C5003,
C5007,
C5011,
C5017,
C5018,
C5019,
C5032,
C820,
C849,
C855,
C859

Capacitor, Ceramic,
Chip

ECCH0017301

CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R 45TO+85C 0603 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.

LGE Internal Use Only

- 270 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

R202,
R203,
R207,
R210,
R217,
R218,
R219,
R312,
R314,
R317,
R318,
R319,
R321,
R322

PartNumber

Spec

Resistor, Chip

ERHY0009526

MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP


- ROHM.

C204,
C209,
C602,
C846

Capacitor, Ceramic,
Chip

EAE62286801

CL03A104KP3NNNC 0.0000001F 10% 10V X5R 55TO+85C 0603 R/TP 0.3 SAMSUNG ELECTROMECHANICS CO., LTD.

C487,
C490,
C493,
C497,
C5002,
C5006,
C5010,
C905

Capacitor, Ceramic,
Chip

ECCH0000198

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R 55TO+85C 1005 R/TP . SAMSUNG ELECTROMECHANICS CO., LTD.

C101,
C102,
C105

Capacitor, Ceramic,
Chip

ECZH0001215

C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION

R222,
R224,
R225,
R226,
R306,
R406,
R407,
R408

Resistor, Chip

ERHY0009505

MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP


- ROHM.

R901,
R902,
R903,
R904,
R905,
R906,
R907,
R908,
R909

Resistor, Chip

ERHY0009558

MCR006YZPF6802 68KOHM 1% 1/20W 0603


R/TP - ROHM.

LGE Internal Use Only

Description

- 271 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

C202,
C203,
C206,
C211,
C213,
C219,
C237,
C238,
C5013,
C844

Capacitor, Ceramic,
Chip

ECCH0032801

GRM033R60J224M 0.00000022F 20% 6.3V X5R 55TO+85C 0603 R/TP 0.3MM MURATA
MANUFACTURING CO., LTD.

C220,
C221,
C423,
C464

Capacitor, Ceramic,
Chip

ECCH0017501

CL10A226MQ8NRNE 22uF 20% 6.3V X5R 55TO+85C 1608 R/TP 0.8MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

C419,
C437,
C450

Capacitor, Ceramic,
Chip

ECCH0009520

MCH032A150JK 15pF 5% 25V X7R -55TO+125C


0603 R/TP - ROHM.

FB601,
FB602,
L901

Filter, Bead

EAM62150501

CIC10J601NC_ 600 ohm 1.6X0.8X0.8 25% 0.15


ohm 0.75A SMD R/TP 2P 0 SAMSUNG
ELECTRO-MECHANICS CO., LTD.

R324

Resistor, Chip

ERHY0024501

RC0201JR-0736RL 36OHM 5% 1/20W 0603 R/TP


- YAGEO CORPORATION

C603,
C617,
C618,
C619,
C631,
C632,
C690

Capacitor, Ceramic,
Chip

ECCH0007804

CL05A225MP5NSNC 2.2uF 20% 10V X5R 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

C608,
C609

Capacitor, Ceramic,
Chip

ECZH0001217

GRM155R60J474K 470nF 10% 6.3V X5R 25TO+70C 1005 BK-DUP - MURATA


MANUFACTURING CO., LTD.

R804

Resistor, Chip

ERHZ0000204

MCR01MZP5F1003 100KOHM 1% 1/16W 1005


R/TP - ROHM.

C433

Capacitor, TA,
Conformal

ECTH0004808

TCM1A475M8R 4.7F 20% 10V 500mA -55TO+85C


9OHM - - SMD R/TP - ROHM.

C106

Capacitor, Ceramic,
Chip

ECCH0017601

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

C104

Capacitor, Ceramic,
Chip

ECCH0007803

CL10A106MP8NNNC 10uF 20% 10V X5R 55TO+85C 1608 R/TP 0.8MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

LGE Internal Use Only

- 272 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

U202

PartNumber

Spec

IC, MCP, NAND

EUSY0425901

H8BCS0QG0MMR-46M NAND/1G SDRAM/512M


0VTO0V 8.0x9.0x1.0 TR 130P NAND+DRAM BGA
- HYNIX SEMICONDUCTOR INC.

C201,
C302,
C303,
C417,
C466,
C471,
C824

Capacitor, Ceramic,
Chip

ECCH0009106

C0603X7R1C103KT 10nF 10% 10V X7R 55TO+125C 0603 R/TP - TDK CORPORATION

L805

Inductor, Multilayer,
Chip

ELCH0004709

1005GC2T3N3SLF 3.3NH 0.3NH - 300mA


0.19OHM 4.5GHZ 8 SHIELD NONE
1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS
LTD.

C865

Capacitor, Ceramic,
Chip

ECCH0009103

C0603C0G1H101JT00NN 100pF 5% 50V X7R 55TO+125C 0603 R/TP - TDK CORPORATION

L401

Inductor, Multilayer,
Chip

ELCH0003842

LQG15HSR10J02D 100NH 5% - 150mA 1.25OHM


600MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.

R708

Resistor, Chip

ERHZ0000213

MCR01MZP5F1203 120KOHM 1% 1/16W 1005


R/TP - ROHM.

U404

IC, LDO Voltage


Regulator

EUSY0365101

RP101K302D RP101K302D, PLP1612-4B, 4,


R/TP, LDO RICOH COMPANY, LTD.

PT201

Thermistor, NTC

SETY0006301

NCP15XH103J03RC 10KOHM 5% 0V 0A 3.35KK


SMD P/TP 1005size MURATA
MANUFACTURING CO., LTD.

R307

Resistor, Chip

ERHY0009541

MCR006YZPF4700 470OHM 1% 1/20W 0603


R/TP - ROHM.

R311

Resistor, Chip

ERHY0009502

MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP ROHM.

R221

Resistor, Chip

ERHZ0003001

MCR01MZP5F3002 30KOHM 1% 1/16W 1005


R/TP - ROHM.

U301

IC, Application
Processor

EAN61966001

OMAP3630-Non Package 1.8V TO 3.3V 100mA


27MHz 0 0 515P - BGA R/TP-T 515P TEXAS
INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.

C832

Capacitor, Ceramic,
Chip

ECZH0000816

C1005C0G1H120JT000F 12pF 5% 50V NP0 55TO+125C 1005 R/TP - TDK KOREA


COOPERATION

LGE Internal Use Only

Description

- 273 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

CN1,
CN10,
CN11,
CN2,
CN3,
CN4,
CN5,
CN6,
CN9

Clip

MCGY0003801 COMPLEX LG-KH3900 KTF ZZ:Without Color -

U805

Filter, Separator,
FEM

SMZY0028001

RF5501 - - - RF5501, QFN, 12p, 2.0*2.0*0.5,


SP3T+LNA for BT/WiFi with BCM4325/29/30 RF
MICRO DEVICES INC

U804

IC, LDO Voltage


Regulator

EUSY0407101

BU28TD4WNVX SSON004, 4, R/TP, 2.8V 150mA


Single LDO, IC, LDO Voltage RegulatorIC, LDO
Voltage Regulator ROHM.

R604,
R605

Resistor, Chip

ERHY0009539

MCR006YZPF20R0 20OHM 1% 1/20W 0603 R/TP


- ROHM.

C817,
C834

Capacitor, Ceramic,
Chip

ECZH0025908

GRM0335C1E8R0D 8pF 0.5PF 25V C0G 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

C107

Inductor, Multilayer,
Chip

ELCH0003847

LQG15HS1N8S02D 1.8NH 0.3NH - 300mA


0.1OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP MURATA MANUFACTURING CO., LTD.

X401

Oscillator, Crystal

EXSY0023801

CSC3S260000BFVRS00 26 MHz, 50 PPM, 15 pF,


SMD, 25*20*0.9, VX8560 RGB
Convertor(ANA5603) clock, Pb-Free, 26MHz,
50PPM, 1.8V, 20, 25, 0.9, SMD, R/TP PARTRON
COMPANY LIMITED

C856,
C857

Capacitor, Ceramic,
Chip

ECCH0000122

MCH155A470JK 47pF 5% 50V NP0 -55TO+125C


1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

R310

Resistor, Chip

ERHZ0000493

MCR01MZP5J513 51KOHM 5% 1/16W 1005 R/TP


- ROHM.

C835,
C851

Capacitor, Ceramic,
Chip

ECCH0000112

MCH155C150J 15pF 5% 50V NP0 -55TO+125C


1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

C611,
C612

Capacitor, Ceramic,
Chip

ECCH0000163

C1005X5R473KDT 47nF 10% 10V X5R 55TO+85C 1005 R/TP - NEOTECH CO., LTD

L201,
L202

Inductor, Wire
Wound, Chip

ELCP0008007

MIPS2520D3R3M 3.3UH 30% - 1A 0.12OHM - SHIELD 2.5X2X1MM NONE R/TP FDK


CORPORATION.

LGE Internal Use Only

- 274 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

BAT401

Capacitor Assembly

SMZY0023501

PAS311HR-VG1 3.8 Backup Capacitor 0.03F,


Module Assembly, KOREA TAIYO YUDEN.CO.,
LTD.

C836

Capacitor, Ceramic,
Chip

ECCH0000149

MCH155CN332KK 3.3nF 10% 50V X7R 55TO+125C 1005 R/TP - ROHM Semiconductor
KOREA CORPORATION

C401,
C402

Capacitor, Ceramic,
Chip

ECCH0007805

CL05A106MQ5NUNC 10uF 20% 6.3V X5R 55TO+85C 1005 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.

R205

Resistor, Chip

ERHZ0000477

MCR01MZP5J394 390KOHM 5% 1/16W 1005


R/TP - ROHM.

C409,
C410,
C912

Capacitor, Ceramic,
Chip

ECZH0025917

GRM0335C1E470J 47pF 5% 25V NP0 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

R220,
R308,
R309,
R325,
R405

Resistor, Chip

ERHY0009506

MCR006YZPJ104 100KOHM 5% 1/20W 0603


R/TP - ROHM.

L808

Inductor, Multilayer,
Chip

ELCH0004727

1005GC2TR10JLF 100NH 5% - 100mA 2.3OHM


600MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

L402,
L403,
L404

Inductor, Wire
Wound, chip

ELCP0008009

MIPSA2520D1R0 MIPSA2520D1R0, 1 uH, N,


2.5x2.0x1.2, R/TP, MLCI, power inductor FDK
CORPORATION.

IC, Analog Switch

EUSY0363501

FSA2268UMX_F113 uMLF , 10 , R/TP , 0.4ohm


Audio Analog Switch , ; , IC, Analog Switch
FAIRCHILD SEMICONDUCTOR HONG KONG
LTD.

U610

C5023,
C853,
C903

Capacitor, Ceramic,
Chip

ECCH0004904

GRM155R60J105K 1uF 10% 6.3V X5R 55TO+85C 1005 R/TP - MURATA


MANUFACTURING CO., LTD.

C833,
C850

Capacitor, Ceramic,
Chip

ECCH0000110

MCH155A100D 10pF 0.25PF 50V NP0 55TO+125C 1005 R/TP - ROHM Semiconductor
KOREA CORPORATION

C5033,
C601

Capacitor, Ceramic,
Chip

ECZH0025916

GRM0335C1E330J 33pF 5% 25V NP0 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

R211

Resistor, Chip

ERHY0009303

MCR006YZPF1002 10KOHM 1% 1/20W 0603


R/TP - ROHM.

LGE Internal Use Only

- 275 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

FL802

Filter, Dielectric

SFDY0003201

DEA162450BT-2096A1-H BPF 2.45GHZ 100MHz


SMD R/TP 3P TDK CORPORATION

U403

IC, LDO Voltage


Regulator

EUSY0407501

BU18TD4WNVX SSON004, 4, R/TP, 1.8V 150mA


Single LDO, IC, LDO Voltage RegulatorIC, LDO
Voltage Regulator ROHM.

C228,
C848

Capacitor, Ceramic,
Chip

ECZH0001216

C1005X5R1A224KT000E 220nF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION

U901

IC, MCP, eMMC

EUSY0431101

SDIN5D2-2G-974D 2GBYTE 2.7VTO3.6V,


2.7VTO3.6V, 2.7VTO3.6V 11.5x13.0x1.2 TR 153P
MLC NAND FBGA 2GB eMMC v4.41 (32nm/MLC)
SANDISK CORPORATION

L806

Inductor, Wire
Wound, chip

ELCP0009410

LQM2HPN3R3MG0 LQM2HPN3R3MG0, 3.3 uH,


N, 2x2.5x1.0, R/TP, chip power MURATA
MANUFACTURING CO., LTD.

Q201

FET

EQFP0003601

NTJD4105CT1G P-CHANNEL MOSFET 20V +-12


660mA 0.63OHM 270mW SC70 R/TP 6P ON
SEMICONDUCTOR

R232

Resistor, Chip

ERHY0000132

MCR01MZP5F2202 22KOHM 1% 1/16W 1005


R/TP - ROHM.

R112

Resistor, Chip

ERHZ0000485

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005


R/TP - ROHM.

C239,
C240

Capacitor, Ceramic,
Chip

ECCH0009504

MCH032A180JK 18pF 5% 25V NP0 -55TO+125C


0603 R/TP - ROHM.

X802

Oscillator, TCXO

EXST0002301

1XTW38400FAA 384MHZ 2.5PPM 2.8V


3.2x2.5x0.9MM ; SMD R/TP DAISHINKU
CORPORATION.

R803

Resistor, Chip

ERHY0000128

MCR01MZP5F1502 15KOHM 1% 1/16W 1005


R/TP - ROHM.

C862

Capacitor, Ceramic,
Chip

ECCH0033301

GRM1555C1H680F 68pF 1% 50V C0G 55TO+125C 1005 R/TP - MURATA


MANUFACTURING CO., LTD.

U201

IC, Digital Baseband


EUSY0409401
Processor, 3G

PMB9801 0 0 0 NONE NONE 316P - BGA R/TP


316P INFINEON TECHNOLOGIES (ASIA
PACIFIC) PTE LTD.

C861

Capacitor, Ceramic,
Chip

ECCH0000196

MCH155A0R75C 0.75pF 0.25PF 50V NP0 55TO+125C 1005 R/TP - ROHM Semiconductor
KOREA CORPORATION

IC601

IC, Audio Sub


System

EUSY0403901

WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P


- WOLFSON MICROELECTRONICS PLC

LGE Internal Use Only

Description

PartNumber

Spec

- 276 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

ZD905

Diode, TVS

EDTY0009401

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70


R/TP 6P 5 ROHM.

CN201

Connector, BtoB

ENBY0053801

24-5804-030-000-829+ 30P 0.40MM STRAIGHT


FEMALE SMD R/TP 900mM - KYOCERA ELCO
KOREA SALES CO., LTD.

C427,
C431

Capacitor, Ceramic,
Chip

ECCH0005604

GRM188R60J106M 10000000 pF, 6.3V, M, X5R,


TC, 1608, R/TP, 0.8 mm MURATA
MANUFACTURING CO., LTD.

L811

Inductor, Multilayer,
Chip

ELCH0004109

LLV0603-FH2N7S 2.7NH 0.3NH - 250mA


0.23OHM 6GHZ 5 SHIELD NONE 0.6X0.3X0.3MM
R/TP TOKO, INC.

U302

IC, I/O Support Chip

EUSY0342403

NLSV2T244MUTAG 0.9 To 4.5v 1uA NA 8P UDFN R/TP 8P ON SEMICONDUCTOR

U803

IC Assembly

EUSY0433901

BCM43291SKUBG WLBGA , 181 , R/TP ,


WiFi(11bgn)+BT+FM(Rx), BT3.0+HS,
6.57x5.62x0.55, 182pin, 0.4p , ; , IC Assembly
BROADCOM ASIA DISTRIBUTION PTE LTD

C852

Capacitor, Ceramic,
Chip

ECZH0000813

C1005C0G1H101JT 100pF 5% 50V NP0 55TO+125C 1005 R/TP - TDK KOREA


COOPERATION

R212

Resistor, Chip

ERHY0009301

MCR006YZPF1000 100OHM 1% 1/20W 0603


R/TP - ROHM.

L807

Inductor, Multilayer,
Chip

ELCH0004722

1005GC2T47NJLF 47NH 5% - 200mA 1.3OHM


1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

R227

Resistor, Chip

ERHY0008206

RC1005F430CS 43OHM 1% 1/16W 1005 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

U703

IC, Charge Pump

EAN62028201

BD2812GU 2.7 to 5.5V adj 1.4W CSP R/TP 32P ROHM Semiconductor KOREA CORPORATION

C105

Capacitor, Ceramic,
Chip

ECCH0000115

MCH155A220JK 22pF 5% 50V NP0 -55TO+125C


1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

R206

Resistor, Chip

ERHY0009518

MCR006YZPJ224 220KOHM 5% 1/20W 0603


R/TP - ROHM.

EDTY0010201

ESD9L5.0ST5G ESD9L5.0ST5G, SOD-923, 5 V,


.15 W, R/TP, 0.5pF SCG HONG KONG SAR LTD.

ZD701, ZD702 Diode, TVS

LGE Internal Use Only

- 277 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

C212,
C215,
C216,
C223,
C224,
C225,
C226,
C229,
C230,
C231,
C232,
C233,
C234,
C235,
C236,
C411,
C413,
C414,
C415,
C453,
C455,
C467,
C468,
C472,
C476,
C478,
C479,
C480,
C489,
C492,
C495,
C499

Capacitor, Ceramic,
Chip

ECCH0009101

LGE Internal Use Only

Spec

remark

C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION

- 278 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

C5004,
C5008,
C5012,
C5014,
C5015,
C5016,
C5034,
C5035,
C613,
C614,
C819,
C822,
C823,
C825,
C826,
C827,
C828,
C829,
C830,
C847,
C860,
C863,
C901,
C904,
C906

Capacitor, Ceramic,
Chip

ECCH0009101

C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION

U104

RF Module

SMRH0005501

SKY77529 MHz, MHz, EDGE Quad Tx Module for


IFX Smarti UE. SPI Control, SKYWORKS
SOLUTIONS INC.

C1001

Capacitor, Ceramic,
Chip

ECCH0042008

GRM0335C1E3R9BD01D 3.9 pF, 25V, B, C0G,


TC, 0603, R/TP, 0.0000000000039, 0.1PF, 25V,
C0G, -55TO+125C, 0603, R/TP, 0.3 mm MURATA
MANUFACTURING CO., LTD.

L811

Inductor, Multilayer,
Chip

ELCH0004109

LLV0603-FH2N7S 2.7NH 0.3NH - 250mA


0.23OHM 6GHZ 5 SHIELD NONE 0.6X0.3X0.3MM
R/TP TOKO, INC.

CN1,
CN10,
CN11,
CN2,
CN3,
CN4,
CN5,
CN6,
CN9

Clip

MCGY0003801 COMPLEX LG-KH3900 KTF ZZ:Without Color -

C126

Capacitor, Ceramic,
Chip

ECZH0000822

LGE Internal Use Only

Spec

remark

C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0


-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

- 279 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

C201,
C302,
C303,
C417,
C466,
C471,
C824

Capacitor, Ceramic,
Chip

ECCH0009106

C0603X7R1C103KT 10nF 10% 10V X7R 55TO+125C 0603 R/TP - TDK CORPORATION

L130,
L131

Inductor, Multilayer,
Chip

ELCH0001056

1005GC2T2N7SLF 2.7NH 0.3NH - 300mA


0.17OHM 5.5GHZ 8 SHIELD NONE
1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS
LTD.

C502,
C506

Capacitor, Ceramic,
Chip

ECZH0003503

GRM188R61E105K 1uF 10% 25V X5R 55TO+85C 1608 R/TP - MURATA


MANUFACTURING CO., LTD.

C170,
C171,
C808

Capacitor, Ceramic,
Chip

ECCH0035101

GRM0335C1E1R8C 1.8 pF, 25V, C, C0G, TC,


0603, R/TP, 0.0000000000018, 0.25PF, 25V, C0G,
-55TO+125C, 0603, R/TP, 0.3 mm MURATA
MANUFACTURING CO., LTD.

R201,
R204,
R208,
R209,
R228,
R229,
R233,
R234,
R235,
R236,
R313,
R315,
R320,
R413,
R610,
R919

PCB ASSY, MAIN,


PAD OPEN

SAFO0000401

AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI

C101,
C102,
C105

Capacitor, Ceramic,
Chip

ECZH0001215

C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION

R913

Resistor, Chip

ERHY0009503

MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP


- ROHM.

C856,
C857

Capacitor, Ceramic,
Chip

ECCH0000122

MCH155A470JK 47pF 5% 50V NP0 -55TO+125C


1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

C419,
C437,
C450

Capacitor, Ceramic,
Chip

ECCH0009520

MCH032A150JK 15pF 5% 25V X7R -55TO+125C


0603 R/TP - ROHM.

LGE Internal Use Only

Spec

- 280 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

R220,
R308,
R309,
R325,
R405

Resistor, Chip

ERHY0009506

MCR006YZPJ104 100KOHM 5% 1/20W 0603


R/TP - ROHM.

C865

Capacitor, Ceramic,
Chip

ECCH0009103

C0603C0G1H101JT00NN 100pF 5% 50V X7R 55TO+125C 0603 R/TP - TDK CORPORATION

C603,
C617,
C618,
C619,
C631,
C632,
C690

Capacitor, Ceramic,
Chip

ECCH0007804

CL05A225MP5NSNC 2.2uF 20% 10V X5R 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

C204,
C209,
C602,
C846

Capacitor, Ceramic,
Chip

EAE62286801

CL03A104KP3NNNC 0.0000001F 10% 10V X5R 55TO+85C 0603 R/TP 0.3 SAMSUNG ELECTROMECHANICS CO., LTD.

L123

Inductor, Multilayer,
Chip

ELCH0001048

1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM


2.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

C5033,
C601

Capacitor, Ceramic,
Chip

ECZH0025916

GRM0335C1E330J 33pF 5% 25V NP0 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

L808

Inductor, Multilayer,
Chip

ELCH0004727

1005GC2TR10JLF 100NH 5% - 100mA 2.3OHM


600MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

FL601,
FL602,
FL702

Filter, EMI/Power

SFEY0015901

ICMEF214P101MFR ICMEF214P101MFR, SMD,


ESD Common mode Filter INNOCHIPS
TECHNOLOGY

L117,
L125

Inductor, Multilayer,
Chip

ELCH0004707

1005GC2T1N5SLF 1.5NH 0.3NH - 300mA


0.13OHM 7GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP PILKOR ELECTRONICS LTD.

C102,
C142,
C909

Capacitor, Ceramic,
Chip

ECZH0000830

C1005C0G1H330JT000F 33pF 5% 50V NP0 55TO+125C 1005 R/TP - TDK KOREA


COOPERATION

R230,
R231,
R411,
R805,
R920

PCB ASSY, MAIN,


PAD SHORT

SAFP0000401

LG-LU3000 LGTBK, MAIN, A,

LGE Internal Use Only

Description

PartNumber

Spec

- 281 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

R505

Resistor, Chip

ERHZ0000267

MCR01MZP5F3301 3.3KOHM 1% 1/16W 1005


R/TP - ROHM.

U102

IC, Voltage Detector

EUSY0415801

ADET-5000 , 10, TP, Power detector for IFX SUE,


IC, Voltage DetectorIC, Voltage Detector AVAGO
TECHNOLOGIES INTERNATIONAL SALES PTE.
LIMITED

U601

IC, MM PMIC

EUSY0227205

LP8720TLX 2.7 To 5.5V Adj 1.2W CSP R/TP 20P NATIONAL SEMICONDUCTOR ASIA PACIFIC
PTE. LTD.

R202,
R203,
R207,
R210,
R217,
R218,
R219,
R312,
R314,
R317,
R318,
R319,
R321,
R322

Resistor, Chip

ERHY0009526

MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP


- ROHM.

LGE Internal Use Only

Description

PartNumber

Spec

- 282 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

C207,
C208,
C214,
C407,
C432,
C434,
C438,
C439,
C440,
C441,
C451,
C452,
C454,
C456,
C457,
C459,
C460,
C461,
C462,
C463,
C482,
C483,
C484,
C485,
C488,
C491,
C494,
C498,
C5003,
C5007,
C5011,
C5017,
C5018

Capacitor, Ceramic,
Chip

ECCH0017301

CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R 45TO+85C 0603 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.

C5019,
C5032,
C820,
C849,
C855,
C859

Capacitor, Ceramic,
Chip

ECCH0017301

CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R 45TO+85C 0603 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.

CN903

Connector, BtoB

ENBY0051401

24-5804-040-000-829+ 40P 0.40MM STRAIGHT


FEMALE SMD R/TP 900mM - KYOCERA ELCO
KOREA SALES CO., LTD.

FL102

Filter, Saw

SFSY0038701

SAFEB1G96FN0F00 SAFEB1G96FN0F00, 1960


MHz, 1.4*1.1*0.6, SMD, 1930M~1990M, IL 3.0,
5pin, U-B, 50-200, W-BAND II Rx MURATA
MANUFACTURING CO., LTD.

C418,
C907

Capacitor, Ceramic,
Chip

ECZH0025920

GRM033R71C102K 1nF 10% 16V X7R 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

LGE Internal Use Only

- 283 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

CN102,
CN103

Connector, Terminal
Block

ENZY0018801

25SMT-4442-01 0P A-LOGICS STRAIGHT SMD


R/TP - W.L.GORE & ASSOCIATES INC

ZD601

Diode, TVS

EDTY0009601

Rclamp0521P.TCT 5V 6 5V 4A 100W - R/TP 2P 1


SEMTECH CORPORATION

C1003,
C196

Capacitor, Ceramic,
Chip

ECCH0032901

GRM0335C1H2R7C 2.7pF 0.25PF 50V C0G 55TO+125C 0603 R/TP 0.3MM MURATA
MANUFACTURING CO., LTD.

R911

Resistor, Chip

ERHY0009550

MCR006YZPF4702 47KOHM 1% 1/20W 0603


R/TP - ROHM.

L133

Inductor, Multilayer,
Chip

ELCH0004105

LLV0603-FH1N2S 1.2NH 0.3NH - 300mA


0.14OHM 13GHZ 4 SHIELD NONE
0.6X0.3X0.3MM R/TP TOKO, INC.

C113

Capacitor, Ceramic,
Chip

ECCH0009217

GRM0335C1E560J 56pF 5% 25V X7R 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

C101,
C105,
C106,
C112

Capacitor, Ceramic,
Chip

ECZH0000803

C1005C0G1H020CT000F 2pF 0.25PF 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

C841,
C842,
C843

Capacitor, Ceramic,
Chip

ECCH0009514

MCH032A(AN)100DK 10pF 0.5PF 25V X7R 55TO+125C 0603 R/TP - ROHM.

R608

Resistor, Chip

ERHY0009547

MCR006YZPF2003 200KOHM 1% 1/20W 0603


R/TP - ROHM.

ZD703

Diode, TVS

EDTY0009101

ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528


R/TP 2P 1 ON SEMICONDUCTOR

CN901

Connector, BtoB

ENBY0036001

GB042-40S-H10-E3000 40P 0.4MM STRAIGHT


SOCKET SMD R/TP 1M ENGINEERING PLASTIC
UL94V-0 AU OVER NI LS Mtron Ltd.

SMPY0020101

ACPM-5281-TR1 dBm, %, A, dBc, dB, 4x5, SMD,


3G Dual PAM B1+8. Coupler Integrated, LGA,
R/TP, AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED

U105

IC, Power Amplifier

Spec

FL801

Filter, Saw

SFSY0038901

SAFEB1G57KB0F00 SAFEB1G57KB0F00,
1575.42 MHz, 1.4*1.1*0.6, SMD,
1574.22M~1576.62M, IL 0.8, 5pin, U-U, 50-50,
GPS LOW LOSS MURATA MANUFACTURING
CO., LTD.

R606,
R607

Resistor, Chip

ERHY0009536

MCR006YZPF1003 100KOHM 1% 1/20W 0603


R/TP - ROHM.

LGE Internal Use Only

- 284 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

FB901,
FB902,
FB903

Filter, Bead

SFBH0008105

BLM15BD182SN1D 1800 ohm 1.0X0.5X0.5 25%


1.4 ohm 0.1A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.

CN103

Connector, BtoB

ENBY0034201

GB042-24S-H10-E3000 24P 0.40MM STRAIGHT


SOCKET SMD R/TP 1M - LS Mtron Ltd.

FL104

Filter, Saw

SFSY0030003

SAFEB881MFL0F55 881.5MHz 1.4*1.1*0.6 SMD


R/TP 5P MURATA MANUFACTURING CO., LTD.

FL111

Filter, Saw

SFSY0028101

SAFEB1G95KA0F00 1950 1.4*1.1*0.6 SMD R/TP


5P MURATA MANUFACTURING CO., LTD.

U702

IC, Analog Switch

EUSY0317101

SLAS4717EPMTR2G - - - - WQFN R/TP 10P


1.8*1.4*0.75 ON SEMICONDUCTOR

U801

IC, GPS

EUSY0415301

BCM4751IUB2G , 42, BCM4750 Shrink version


65nm, IC, GPS WLBGA R/TP 42P BROADCOM
CORP

R521

Resistor, Chip

ERHY0009504

MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP ROHM.

VA103,
VA104,
VA105,
VA107,
VA108

Varistor

SEVY0010501

IECS0505C040FR 10V 0% 4E-12F 1.0x0.5x0.3


IEC61000-4-1 (ESD) level #4 SMD R/TP
INNOCHIPS TECHNOLOGY

L103,
L128

Inductor, Multilayer,
Chip

ELCH0001049

1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM


3GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

ZD904

Diode, TVS

EDTY0010101

ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V,


300 mW, R/TP, 15pF SCG HONG KONG SAR
LTD.

C5023,
C853,
C903

Capacitor, Ceramic,
Chip

ECCH0004904

GRM155R60J105K 1uF 10% 6.3V X5R 55TO+85C 1005 R/TP - MURATA


MANUFACTURING CO., LTD.

C409,
C410,
C912

Capacitor, Ceramic,
Chip

ECZH0025917

GRM0335C1E470J 47pF 5% 25V NP0 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

CN701

Connector, BtoB

ENBY0051001

GB042-10S-H10-E3000 10P 0.4MM STRAIGHT


FEMALE SMD R/TP 1M - LS Mtron Ltd.

ZD501,
ZD902

Diode, TVS

EDTY0008602

PSD12-LF 12V 13.3 25.9V 21A 500W SOD323


R/TP 2P 1 PROTEK DEVICES INC.

LGE Internal Use Only

Description

PartNumber

Spec

- 285 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

U501

PartNumber

Spec

IC, MUIC

EUSY0405401

MAX14526DEEWP MUIC , ; , IC, Analog


Multiplexer CSP R/TP 20P MAXIM INTEGRATED
PRODUCTS INC.

L804

Inductor, Multilayer,
Chip

ELCH0001430

LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM


1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.

C138,
C198

Capacitor, Ceramic,
Chip

ECCH0000155

MCH153CN103KK 10nF 10% 16V X7R 55TO+125C 1005 R/TP - ROHM Semiconductor
KOREA CORPORATION

X801

Oscillator, TCXO

EXST0002501

KT2520F26000ACW18TAK 26 MHz, 2 PPM, 10


pF, SMD, 2.5*2.0*0.8, 2ppm, 26, 1.8V, 2.5, 2.0, 0.8,
SMD, R/TP KYOCERA CORP.

C511

Capacitor, Ceramic,
Chip

ECCH0005603

GRM188R61A225K 2.2uF 10% 10V X5R 55TO+85C 1608 R/TP - MURATA


MANUFACTURING CO., LTD.

U505

IC, Hall Effect


Switch

EUSY0418401

BU52014HFV 1.6Vto3.6V Hall IC - HVSOF R/TP


5P - ROHM.

L114,
L812

Inductor, Multilayer,
Chip

ELCH0004721

1005GC2T2N2SLF 2.2NH 0.3NH - 300mA


0.16OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP PILKOR ELECTRONICS LTD.

C105

Capacitor, Ceramic,
Chip

ECCH0000115

MCH155A220JK 22pF 5% 50V NP0 -55TO+125C


1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

FL109

Filter, Saw

SFSY0037501

SAFEB897MAM0F00 897.5MHz 1.4*1.1*0.6 SMD


R/TP 5P MURATA MANUFACTURING CO., LTD.

C110,
C194

Capacitor, Ceramic,
Chip

ECZH0000802

C1005C0G1H010CT 1pF 0.25PF 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

C114,
C118,
C119,
C125,
C130,
C133

Capacitor, Ceramic,
Chip

ECZH0000846

C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0


-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

L101,
L102

Inductor, Multilayer,
Chip

ELCH0004718

1005GC2T5N6SLF 5.6NH 0.3NH - 300mA


0.27OHM 3.2GHZ 8 SHIELD NONE
1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS
LTD.

LGE Internal Use Only

Description

- 286 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

C487,
C490,
C493,
C497,
C5002,
C5006,
C5010,
C905

Capacitor, Ceramic,
Chip

ECCH0000198

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R 55TO+85C 1005 R/TP . SAMSUNG ELECTROMECHANICS CO., LTD.

C157,
L109,
L126

Inductor, Multilayer,
Chip

ELCH0004705

1005GC2T8N2JLF 8.2NH 5% - 250mA 0.37OHM


2.8GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

C929

Capacitor, Ceramic,
Chip

ECCH0009226

GRM0335C1E390J 39pF 5% 25V X7R 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

L802

Inductor, Multilayer,
Chip

ELCH0004713

1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM


3GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

L113,
L115

Inductor, Multilayer,
Chip

ELCH0004708

1005GC2T2N7SLF 2.7NH 0.3NH - 300mA


0.17OHM 5.5GHZ 8 SHIELD NONE
1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS
LTD.

L105

Inductor, Multilayer,
Chip

ELCH0004710

1005GC2T15NJLF 15NH 5% - 250mA 0.53OHM


2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

R211

Resistor, Chip

ERHY0009303

MCR006YZPF1002 10KOHM 1% 1/20W 0603


R/TP - ROHM.

C833,
C850

Capacitor, Ceramic,
Chip

ECCH0000110

MCH155A100D 10pF 0.25PF 50V NP0 55TO+125C 1005 R/TP - ROHM Semiconductor
KOREA CORPORATION

FL107

Filter, Saw

SFSY0034701

SAFEA1G88KB7F00 1880 1.4*1.1*0.5 SMD R/TP


5P MURATA MANUFACTURING CO., LTD.

C605,
C606,
C607

Capacitor, Ceramic,
Chip

ECZH0001511

C1608Y5V1A225ZT000N 2.2uF -20TO+80% 10V


Y5V -30TO+85C 1608 R/TP - TDK KOREA
COOPERATION

D101,
D102,
D103

Diode, TVS

EDTY0009801

VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP


6P 5 PROTEK DEVICES INC.

Q601

FET

EQFP0000101

2SJ347 P-CHANNEL MOSFET -20V -7 -0.05A


40OHM 100mW SSM R/TP 3P TOSHIBA

LGE Internal Use Only

Spec

- 287 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

R402

PartNumber

Spec

Resistor, Chip

ERHY0009519

MCR006YZPJ243 24KOHM 5% 1/20W 0603 R/TP


- ROHM Semiconductor KOREA CORPORATION

C174,
C807

Capacitor, Ceramic,
Chip

ECZH0001002

C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

C910

Capacitor, TA,
Conformal

ECTH0001903

F980J226MMA 22 uF, 6.3V, M, L_ESR, 1608,


R/TP NICHICON CORPORATION, EAST JAPAN
SALES OFFICE

R105

Resistor, Chip

ERHZ0000404

MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP ROHM.

L107

Inductor, Multilayer,
Chip

ELCH0005005

HK1005 27NJ 27NH 5% - 300mA 0.7OHM 1.6GHZ


8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO
YUDEN CO., LTD

C197

Capacitor, Ceramic,
Chip

ECCH0042005

GRM0335C1E8R2BD01D 8.2 pF, 25V, B, C0G,


TC, 0603, R/TP, 0.0000000000082, 0.1PF, 25V,
C0G, -55TO+125C, 0603, R/TP, 0.3 mm MURATA
MANUFACTURING CO., LTD.

ZD905

Diode, TVS

EDTY0009401

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70


R/TP 6P 5 ROHM.

SW102

Connector, RF

ENWY0008701

MS-156C NONE STRAIGHT SOCKET SMD


T/REEL AU 50OHM 400mDB HIROSE KOREA
CO., LTD

C421,
C422,
C424,
C426,
C428,
C430

Capacitor, Ceramic,
Chip

ECZH0003103

GRM36X7R104K10PT 100nF 10% 10V X7R 55TO+125C 1005 R/TP - MURATA


MANUFACTURING CO., LTD.

C106

Capacitor, Ceramic,
Chip

ECCH0017601

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

R504

Resistor, Chip

ERHZ0000298

MCR01MZP5F5600 560OHM 1% 1/16W 1005


R/TP - ROHM.

C112,
C114

Capacitor, Ceramic,
Chip

ECCH0007802

CL10A475KP8NNNC 4.7uF 10% 10V X5R 55TO+85C 1608 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.

FL101

Filter, Saw

SFSY0024302

SAFEB1G84FA0F00 1842.5 1.4*1.1*0.6 SMD


R/TP 5P MURATA MANUFACTURING CO., LTD.

LGE Internal Use Only

Description

- 288 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

L805

Inductor, Multilayer,
Chip

ELCH0004709

1005GC2T3N3SLF 3.3NH 0.3NH - 300mA


0.19OHM 4.5GHZ 8 SHIELD NONE
1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS
LTD.

FL703,
FL902

Filter, EMI/Power

SFEY0016301

ICMEF112P900M COMMON MODE NOISE


FILTER 0HZ 0F 0H SMD R/TP INNOCHIPS
TECHNOLOGY

R916

Resistor, Chip

ERHZ0000206

MCR01MZP5F10R0 10OHM 1% 1/16W 1005


R/TP - ROHM.

EUSY0250501

NCS2200SQ2T2G NCS2200SQ2T2G, SC70, 5


PIN, R/TP, Comparator, pin compatible to
EUSY0077701 - - SC70 R/TP 5P - ON
SEMICONDUCTOR

IC, Power Amplifier

SMPY0020802

ACPM-5202-LR1 dBm, %, A, dBc, dB, 3.0*3.0*1.1,


SMD, WBAND 2, CPL, 3 MODE, BYPASS
CLAMPING, SMD, R/TP, AVAGO
TECHNOLOGIES INTERNATIONAL SALES PTE.
LIMITED

Filter, Bead

EAM62150501

CIC10J601NC_ 600 ohm 1.6X0.8X0.8 25% 0.15


ohm 0.75A SMD R/TP 2P 0 SAMSUNG
ELECTRO-MECHANICS CO., LTD.

U602

IC, Comparator

PartNumber

Spec

U103

FB601,
FB602,
L901

L119

Inductor, Multilayer,
Chip

ELCH0004712

1005GC2T3N9SLF 3.9NH 0.3NH - 300mA


0.22OHM 4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP PILKOR ELECTRONICS LTD.

C109

Capacitor, Ceramic,
Chip

ECZH0025911

GRM0335C1E120J 12pF 5% 25V C0G 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

U101

IC, RF Transceiver,
3G

EUSY0391101

PMB5703 2.68VTO3V 0W WF2SGA R/TP 143P


INFINEON TECHNOLOGIES (ASIA PACIFIC) PTE
LTD.

C121

Capacitor, Ceramic,
Chip

ECZH0025902

GRM0335C1E2R2C 2.2pF 0.25PF 25V C0G 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

R113,
R114

Resistor, Chip

ERHZ0000406

MCR01MZP5J104 100KOHM 5% 1/16W 1005


R/TP - ROHM.

C507

Capacitor, TA,
Conformal

ECTH0002703

TCTAL1A107M8R 0.0001F 20% 10V 50UA 55TO+125C 0OHM 3.2x1.6x1.1 NONE SMD R/TP
ROHM CO., LTD.

C239,
C240

Capacitor, Ceramic,
Chip

ECCH0009504

MCH032A180JK 18pF 5% 25V NP0 -55TO+125C


0603 R/TP - ROHM.

LGE Internal Use Only

- 289 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

EUSY0355601

RP104K281D-TR-F RP104K281D-TR-F,
PLP1010-4, 4 PIN, R/TP, 150mA, 2.8V, Single
LDO, Q Current 1uA Under RICOH COMPANY,
LTD.

C930

Capacitor, Ceramic,
Chip

ECCH0042302

CL21A475KACLRNC 4.7 uF, 25V, K, X5R, HD,


2012, R/TP, 0.0000047, 10%, 25V, X5R, 55TO+85C, 2012, R/TP, 0.85 mm SAMSUNG
ELECTRO-MECHANICS CO., LTD.

CN502

Connector, Terminal
Block

ENZY0030301

04-9254-004-032-868+ 4P 2.50MM ANGLE SMD


R/TP - KYOCERA ELCO KOREA SALES CO.,
LTD.

R105,
R107,
R117

Resistor, Chip

ERHZ0000405

MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP


- ROHM.

C169

Capacitor, Ceramic,
Chip

ECCH0009506

MCH032A270JK 27pF 5% 25V NP0 -55TO+125C


0603 R/TP - ROHM.

R910

Resistor, Chip

ERHY0009586

MCR006YZPF2201 2.2KOHM 1% 1/20W 0603


R/TP - ROHM.

L121

Inductor, Multilayer,
Chip

ELCH0004115

LLV0603-FH8N2J 8.2NH 5% - 220mA 0.2OHM


3GHZ 6 SHIELD NONE 0.6X0.3X0.3MM R/TP
TOKO, INC.

R609

Resistor, Chip

ERHY0009507

MCR006YZPJ105 1MOHM 5% 1/20W 0603 R/TP ROHM.

FL110

Filter, Duplexer, IMT SDMY0003001

B7697 2140000000 2112.4 to 2167.6 1950000000


1922.4 to 1977.6 2.2 1.8 2.5x2.0x0.89 DUAL SMD
R/TP - EPCOS PTE LTD.

R502

Resistor, Chip

ERHY0009516

MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP


- ROHM.

U506

IC, Fuel Gauge

EAN61958601

MAX17043G 2.5 to 4.5V Vbat 0W DFN R/TP 8P MAXIM INTEGRATED PRODUCTS INC.

R212

Resistor, Chip

ERHY0009301

MCR006YZPF1000 100OHM 1% 1/20W 0603


R/TP - ROHM.

C401,
C402

Capacitor, Ceramic,
Chip

ECCH0007805

CL05A106MQ5NUNC 10uF 20% 6.3V X5R 55TO+85C 1005 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.

IC301

IC, Analog Switch

EAN61871401

FSUSB63 2.7~4.3V 400NSEC 45NSEC 0W MLP


R/TP 12P 1 FAIRCHILD SEMICONDUCTOR
HONG KONG LTD.

U405

IC, LDO Voltage


Regulator

LGE Internal Use Only

- 290 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

U802

Module, GPS

SMZY0016502

ALM-1612 2.7VTO3.6V 15mA DFN 12P


2.1x3.3x1.0MM AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED

FL105

Filter, Saw

SFSY0024301

SAFEB942MFL0F00 942.5 1.4*1.1*0.6 SMD R/TP


5P MURATA MANUFACTURING CO., LTD.

U203

IC, Analog Switch

EUSY0347001

DG2735DN-T1-E4 MiniQFN-10L , 10 PIN, R/TP ,


1.8X1.4X0.55, 0.6 Dual SPDT Analog Switch , ; , IC,
Analog Switch VISHAY INTERTECHNOLOGY
ASIA PTE LTD

FL103

Filter, Saw

SFSY0029201

SAFEB2G14FA0F00 2140 1.4*1.1*0.6 SMD R/TP


5P MURATA MANUFACTURING CO., LTD.

U106

IC, RF Amplifier

EUSY0429801

BGA749N16 2.3*2.3*0.39 , 16 , R/TP , Quadband


LNA for IFX , ; , IC, RF Amplifier INFINEON
TECHNOLOGIES (ASIA PACIFIC) PTE LTD.

R106

Resistor, Chip

ERHY0000137

MCR01MZP5F2702 27KOHM 1% 1/16W 1005


R/TP - ROHM.

U504

IC, Motor Driver

EUSY0238306

ISA1000 2.4~3.6V 150mV~300mV 0W DFN R/TP


8P -

U502

IC, Charger

EUSY0410801

RT9524 DFN, 10, R/TP, DFN Cal Test Mode Single


Charger IC for Micro USB, IC, ChargerIC, Charger
RICHTEK TECHNOLOGY CORP.

R522

Resistor, Chip

ERHY0024601

RC0603J151CS 150OHM 5% 1/20W 0603 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

L803

Inductor, Multilayer,
Chip

ELCH0003818

LQG15HS9N1J02D 9.1NH 5% - 300mA 0.26OHM


3.4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.

L801

Inductor, Multilayer,
Chip

ELCH0004107

LLV0603-FH1N8S 1.8NH 0.3NH - 300mA


0.18OHM 8.5KHZ 4.5 SHIELD 0 0.6X0.3X0.3MM
R/TP TOKO, INC.

CN902

Connector, BtoB

ENBY0039601

GB042-20S-H10-E3000 20P 0.4MM STRAIGHT


SOCKET SMD R/TP 1M - LS Mtron Ltd.

C152,
C814

Capacitor, Ceramic,
Chip

ECCH0009216

GRM0335C1E220J 22pF 5% 25V X7R 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

LGE Internal Use Only

Description

PartNumber

Spec

- 291 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

L106

Inductor, Multilayer,
Chip

ELCH0004704

1005GC2T4N7SLF 4.7NH 0.3NH - 300mA


0.23OHM 3.5GHZ 8 SHIELD NONE
1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS
LTD.

L601

Inductor, Wire
Wound, chip

ELCP0008013

MIPSZ2012D2R2 MIPSZ2012D2R2, 2.2 uH, N,


2.0X1.2X1.0, R/TP FDK CORPORATION.

U701

IC, Sub PMIC

EUSY0336503

AAT2870IUW-T1 CSP , 35 , R/TP , 3.1x2.6 , ; , IC,


Sub PMIC Advanced Analogic Technologies HK
Limited

CN702

Connector, BtoB

ENBY0040601

GB042-30P-H10-E3000 - 0.40MM STRAIGHT


MALE SMD R/TP - - LS Mtron Ltd.

C852

Capacitor, Ceramic,
Chip

ECZH0000813

C1005C0G1H101JT 100pF 5% 50V NP0 55TO+125C 1005 R/TP - TDK KOREA


COOPERATION

CN904

Connector, BtoB

ENBY0053201

24-5804-014-000-829+ 14P 0.40MM STRAIGHT


FEMALE SMD R/TP 900mM - KYOCERA ELCO
KOREA SALES CO., LTD.

VA501

Varistor

SEVY0003601

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55


NONE SMD R/TP INNOCHIPS TECHNOLOGY

X101

Oscillator, VCTCXO

EXSK0009601

1XXA26000FAA 26 MHz, 1 PPM, 10 pF, SMD,


2.5*2.0*0.8, Vctl 1.2+/-1.05V, 26, 1PPM, 2.5V, 2.5,
2.0, 0.8, SMD, R/TP DAISHINKU CORPORATION.

C712

Capacitor, Ceramic,
Chip

ECCH0035001

GRM033R60J683K 68 nF, 6.3V, K, X5R, HD,


0603, R/TP, 0.000000068, 10%, 6.3V, X5R, 55TO+85C, 0603, R/TP, 0.3 mm MURATA
MANUFACTURING CO., LTD.

PartNumber

Spec

FL108

Filter, Duplexer, IMT SDMY0003101

ACMD-7606 942500000 925 to 960 897500000


880 to 915 3 2.7 2.5*2.0*0.85 DUAL SMD R/TP AVAGO TECHNOLOGIES INTERNATIONAL
SALES PTE. LIMITED

C173

Capacitor, Ceramic,
Chip

ECZH0000841

C1005C0G1H560JT000F 56pF 5% 50V NP0 55TO+125C 1005 R/TP - TDK KOREA


COOPERATION

FL701

Filter, EMI/Power

SFEY0010501

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H


SMD R/TP INNOCHIPS TECHNOLOGY

L104

Inductor, Multilayer,
Chip

ELCH0004701

1005GC2T12NJLF 12NH 5% - 250mA 0.48OHM


2.1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

LGE Internal Use Only

- 292 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

FL901

PartNumber

Spec

Filter, EMI/Power

SFEY0015301

NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD


R/TP MURATA MANUFACTURING CO., LTD.

R311

Resistor, Chip

ERHY0009502

MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP ROHM.

FL106

Filter, Duplexer,
PCS

SDPY0004701

ACMD-7407 ACMD-7407, 1880 MHz, 1960 MHz,


2.8 dB, 3.2 dB, 55 dB, 50 dB, 2.5*2.0*0.95, SMD,
FBAR, Band2 Rx unbal. AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED

C150

Capacitor, TA,
Conformal

ECTH0006701

298D226X0010M2T 0.000022F 20% 10V 22UA 55TO+85C 8OHM 1.6x0.8x0.9 NONE SMD R/TP
VISHAY INTERTECHNOLOGY ASIA PTE LTD

R518

Resistor, Chip

ERHZ0000318

MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005


R/TP - ROHM.

C804

Capacitor, Ceramic,
Chip

ECCH0009109

C0603X7R1H331KT00NN 330pF 10% 50V X7R 55TO+125C 0603 R/TP - TDK CORPORATION

L129

Inductor, Multilayer,
Chip

ELCH0004703

1005GC2T1N0SLF 1NH 0.3NH - 300mA 0.12OHM


10GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

R915

Resistor, Chip

EBC61835701

RC0402FR-071RL 1OHM 1% 1/16W 1005 R/TP YAGEO CORPORATION

C510

Capacitor, Ceramic,
Chip

ECCH0009211

GRM0335C1E3R3C 3.3pF 0.25PF 25V X7R 55TO+125C 0603 R/TP - MURATA


MANUFACTURING CO., LTD.

C104

Capacitor, Ceramic,
Chip

ECCH0007803

CL10A106MP8NNNC 10uF 20% 10V X5R 55TO+85C 1608 R/TP 0.8MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

SW101

Connector, RF

ENWY0003901

U.FL-R-SMT(10) 1.90MM STRAIGHT SOCKET


SMD T/REEL CU 50OHM 300mDB HIROSE
KOREA CO., LTD

L127

Inductor, Multilayer,
Chip

ELCH0003828

LQG15HS2N4S02D 2.4NH 0.3NH - 300mA


0.15OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP MURATA MANUFACTURING CO., LTD.

C427,
C431

Capacitor, Ceramic,
Chip

ECCH0005604

GRM188R60J106M 10000000 pF, 6.3V, M, X5R,


TC, 1608, R/TP, 0.8 mm MURATA
MANUFACTURING CO., LTD.

LGE Internal Use Only

Description

- 293 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

C520

Capacitor, Ceramic,
Chip

ECZH0001210

LGE Internal Use Only

Spec

remark

C1005Y5V1A474ZT000F 470nF -20TO+80% 10V


Y5V -30TO+85C 1005 R/TP - TDK KOREA
COOPERATION

- 294 -

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.3 Accessory

Note: This Chapter is used for reference, Part order is


ordered by SBOM standard on GCSC

Level

Location No.

Description

EAN060000

Memory Card
Assembly

PartNumber

Spec

EAN62109603

EAN011400

IC, Memory Card,


MICRO SD

EAN61826701

MMAGR02GUECA-2MBTN 2GBYTE 2.7VTO3.6V


MICRO SD CARD 15.0x11.0x1.0MM TR 8P
MicroSD Card 2GB SAMSUNG ELECTRONICS
CO., LTD.

AFN053800

Manual Assembly,
Operation

AFN75472610

LGP970.ADEUTL ZZ:Without Color LGP970


manual assy for DEU

MBM062600

Card, Quick
Reference

MBM63397007

COMPLEX LGP970.ADEUTL ZZ:Without Color


Application service information leaflet LGP970
Germany

MBM087200

Card, Warranty

MCDF0001110

COMPLEX KP202 VDG ZZ:Without Color


PRINTING, (empty),

MFL053800

Manual, Operation

MFL67204204

COMPLEX LGP970.AORATL ZZ:Without Color


LGP970 manual for ORA

EAY060000

Adapters

SSAD0034701

STA-U13ER 90Vac~264Vac 5.1V 1A 5060 CE


NONE NONE - SUNLIN ELECTRONICS CO., LTD

EAB010200

Earphone,
Stereo

SGEY0007612

EMB-LGE013STAC 3mW 16OHM 98DB


65HZTO112HZ 1.08M BLACK 3.5 L TYPE
STEREO 4POLE PLUG - CRESYN CO., LTD

EBX000000

Accessory,
Data Cable

SGDY0018801

KCA-ET-5-0210 , 1.2M, MicroUSB5pin, BLACK, ID


open, KSD CO., LTD

EAC00

Rechargeable
Battery,
Lithium Ion

EAC61518301

BL-44JN PRISMATIC 3.7V 1.5AH 300mAH


61x44x4.4 65x44x4.8 ACE BLACK Bar type, Top
cap Screw joint - LG Chem, LTD.

LGE Internal Use Only

- 295 -

remark

Copyright 2011 LG Electronics. Inc. All right reserved.


Only for training and service purposes