STUDY ON INFLUENCE OF INTEGRATING SPHERE TEST POSITION ON

MEASURING ACCURACY OF OPTICAL PARAMETERS OF LED CHIP

Chen Tengfei 1, Liu Qi 1, and Li Bin 1*
I

State Key Lab of Digital Manufacturing Equipment & Technology, Huazhong University of Science
and Technology, Wuhan 430074, China
*Corresponding Author's Email: libin999 @mail.hust.edu.cn
the whole experiment. A three-axis motorized stage is

ABSTRACT
The development of a system that evaluates optical
parameters of light emitting diodes (LED) in a wafer is
presented, equipped with an integrating sphere on a

constructed to relate the motion between probes and LED

wafer. The XY axes transfer a wafer jig on the planar
direction while the Z axis moves the stage in the vertical

three-dimensional precision platform. The influence of

l1SB

integrating sphere's (IS) position and height relative to

LED

chip

on

measuring

accuracy

is

analyzed

quantitatively. It was found that luminous flux variation

was less than 0.5% within deviation and there was a 20%
reduction with the relative height varying from 9cm to
IIcm.

INTRODUCTION
As a new generation light source,LED is now gaining
wide application, such as illumination, electronic display
screen, backlight and so on. Usually, LED application
appears in the form of LED arrays. Over the years,we put
forward higher requirements on the consistency of optical
parameters of LED. Thus, optical testing becomes an

Fig. 1: Measurement System

important component in LED industry chain. The most

common choice of light collection is an IS, whose

direction. Each axis is composed of a ball screw, a

difference light collection results have a direct effect on

servomotor and linear motion guides. Motion of each axis

analysis and result of optical parameters [1-31. Probes are

needed in a quick test to make contacts to a chip and set up

is independent from the others, and motion command is

generated from a pc.

an electric circuit. It is because of the existence of probes

that a height difference is inevitable between open area of
IS and LED chips. Besides, the planar deviation between
the center of open area of IS and luminescence center of

LED chip causes a loss of light [4-61.

MEASUREMENT SYSTEM
The measurement system consists of two probes, a
spectrometer, a photodiode, a LED tester, an IS and a
wafer jig,as shown in Fig. I. Probes lie above LED wafer,
and are fixed with special jigs. Made of rare metals, they
are used to make contracts to two electrodes of a chip and
set up a test circuit. Two probes should stay at the same
height so that two contracts happen simultaneously. The
open area of IS aims at the measured chip to collect light.
Integrated on a three dimensional precision platform, it
allows three directions of motion. Micro distance of each
direction is performed by relevant micrometer on the
platform,with a travel of 12cm and an increment of 10um.
The IS and the spectrometer are linked by an optical fiber.
The spectrometer measures the spectrum and analyzes the
intensity and wavelength. A jig fixes LED wafer during

EXPERIMENT
A. Planar Deviation Experiment
The experiment was conducted using low power chips

with a size smaller than 8mil X 8mil. 3 LED wafers were

tested and each had 10 chips. The IS had a height
difference of

10mm

from

happened, 20-mA-forward

the chip. After

current

and

contracts

5-V-reverse

voltage were applied to contract points sequentially. After

the test result was achieved, the next test came up. Each
chip was tested for 5 times and the interval was more than
1 second to ensure necessary heat dissipation. Finishing
the test of single test, the XY axes transferred to the
position of the next chip and continued to test. The planar
position of the IS was adjusted only if the whole wafer test
had accomplished. The increment was 0.5mm. The system
was covered by a large piece of lightproof cloth during the
whole experiment to eliminate background light.
B. Height Difference Experiment
Also,this experiment used low power chips. 3 Wafers

were tested and each had IOchips.Both X deviation and Y

variation is less than 0.5% within 50um planar deviation

deviation were adjusted to O. Only height needed to be

according to an additional experiment whose increment

adjusted and the increment was O.lmm. Test procedure

reduces to 10um.

was similar to Experiment A.

Chips in the same wafer always have a similar

variation tendency with different test heights,as shown in
Fig. 3. There is a reduction up to 20% of luminous flux

RESULTS

when the height between open area of the IS and measured

Luminous flux has a relative deviation up to 42.17%

when the X deviation between the center of open area of

chip varied from 9cm to IIcm.Besides, different types of

IS and luminescence center of measured chip varies from

wafer have similar variation tendencies,as shown in Fig. 4.

-6.5cm to 5.5cm, as shown in Fig.2. Luminous flux

550 ,------

t-------------------::-------------------------------

500

400 ------

I;
'"
=
Q

.S 350 +-------------------------------------------------------

,..l

300 +--- -------------------------------------------------N..

250 +--------

-6.5 -6 -5.5 -5 -4.5 -4 -3.5 -3 -2.5 -2 -1.5 -1 -0.5

0.5

1.5

2.5

3.5

4.5

5.5

X deviation between center of open area of sphere and center of LED chip/mm

Fig. 2: Luminousflux with IS in different planar position

700 ,------

--------------------------------------------------------650
600 +------------------------------------------

.
550 +---------------------------------------I;
'"
=

,..l

500

+-------------------------=:-----------------=::j

450 +-----------------------------------------------------------

-8
-9
10
__

400 t---------

9.1

9.2

9.3

9.4

9.5

9.6

9.7

9.8

9.9

10

10.1 10.2 10.3 10.4 10.5 10.6 10.7 10.8 10.9

Height difference between open area of sphere and LED chip/mm

Fig. 3: Luminousflux with IS in different heig ht (data from Wafer C)

11

0.95 +-

-----

""""'

----------------------

'"
=

I;:
a 0 . 9 +-

------------

--------------

:
::
..::
.

WaferA

0.85

<=

+-----------------------"''''=::--------

..

_WaferS
_WaferC

0.8 +-

----------------------------

0.75
9.1

9.2

9.3

9.4

9.5

9.6

9.7

9.8

9.9

10

10.1 10.2 10.3 10.4 10.5 10.6 10.7 10.8 10.9

11

Height difference between open area of sphere and LED chip/mm

Fig. 4: Relative luminous flux variation tendency

[4] Lin C,Chang L and Jeng M.

Reliability,

CONCLUSION
An experiment system was developed to perform a
quick test on LED wafers. [t had a three-dimensional
precision platform with the [So The influence of IS's
position and height relative to LED chip on measuring
accuracy was analyzed by the system. It was found that
light intensity variation was less than 0.5% within 50um
planar deviation and there was a 20% reduction with the
relative height varying from 9cm to [[cm. Meanwhile,
different types of wafer have similar variation tendencies.
A correction method towards the loss of light can be
presented in further work. Furthermore, measurement
system in this work shows good measure efficiency and
accuracy and can also be used in LED wafer testing
equipment.

ACKNOWLEDGEMENTS
This work is supported by research funding from
Huazhong University of Science and Technology since
2010.

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