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measurement procedure
M a r S u r f. 3D Measurement System
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Ma rSu rf. 3D Measurement System
M a r S u r f. 3D Measurement System
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Ma rSu rf. 3D Measurement System
MarSurf CWM 100. Application with Confocal and/or Interferometric Sensor System
Wafer analysis and measurement
In the semiconductor industry, precise, fast and reliable quality
assurance is a must.
This applies to the production of wafers.
Fast, automatic inspection of selected areas on a wafer by white
light interferometer or with the confocal mode can provide a perfect analysis of the structures on the wafer.
Due to the flexibility of the CWM 100, finest structures can be analyzed interferometrically and for coarse structures or elements like
dies, bonding structures etc. the confocal mode can do the job.
Bond pads with probe marks
Chip structures
M a r S u r f. 3D Measurement System
h2
R0
h
1 + 1 (1 + k )
R0
+ A2 n h 2 n
n=2
Ro = Radius of curvature
h = Radius of the area of application of the asphere
k = Conical constant
Ai = Aspheric coefficients
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Ma rSu rf. 3D Measurement System
Camera
Measuring range
Over 4 mm
(depending on lens)
Lens
Numerical aperture
Working distance (mm)
Field of view (m x m)
Resolution, lateral (m)
Resolution, axial (nm)
20x
50x
0.4
0.55
4.7
3.4
960 x 720 384 x 288
1.24
0.50
0.1
0.1
Other lenses
(2.5x, 5x, 10x, 100x)
on request.
Object table:
Z-axis:
10x
0.5
1.2
1920 x 1440
2.5
1.2
20x
0.75
1.0
960 x 720
1.24
3
50x
0.8
1.0
384 x 288
0.50
2
100x
0.9
1.0
192 x 144
0.25
1
Lenses ELWD
10x
20x
0.3
0.4
17.3
19.0
1920 x 1440 960 x 720
2.50
1.24
40
20
Other lenses
(also water-dip-lenses)
on request.
50x
0.6
11.0
384 x288
0.50
3
100x
0.9
2.0
192 x 144
0.25
1
3760583-14.01.2016
Measuring principle