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CIRCUIT BOARDS
TECHNOLOGY OVERVIEW
Epec has built one of the Industrys leading global supply chain and engineering platforms.
As one of North Americas leading PCB and built-to-print engineered product companies, Epecs annual
capital expenditures are consistently among the highest in the industry.
Our investments are focused on world class engineering design systems, such as EpecDFx, and on
continually improving our global technology platform, to accelerate our customers time to market.
ENGINEERING OVERVIEW
Epec's technical engineering and manufacturing solutions have helped thousands of leading companies
reduce their time to market.
With 24/7 North American engineering support we provide our customers the most in-depth feedback, with
exact accuracy, eliminating delays and quality problems.
Epec can provide complete engineering and design services on all our engineered products, from concept
through production in a quick and efficient time frame. With over sixty years of experience and knowledge
across diverse industries, Epec has the ability to think outside the box and create innovative designs and
solid manufacturing solutions.
Our technical staff will work with you to generate material specifications, product renderings, complete
documentation and prototypes.
1 Day
2 Day
3 Day
5 Day
7 Day
10 Day
1 - 4 Layers
6 - 10 Layers
> 10 Layers
Materials
FR-4 ALL Types
CEM-1 & CEM-3
Heavy Copper
RF and High Speed Materials
Mixed Materials / FR-4 Teflon
Metal Backed Boards
Polyimide
Plating
Conductive Via Fill
Edge Plating
Castellations
Plated Slots
Gold Tabs
Plasma Etch Back
Peelable Solder Mask
MIL-PRF-55110
Sequential Lamination
Net List Compare
Ionic Cleanliness
Free DFx File Check
Advanced
18
.250"
20" x 23"
.006"
11:01
.020" (soldermask between pins)
.003"
Yes
Yes
+/- .003"
1%
26
.287"
20" x 24"
.005"
12:01
.016" (gang masked)
.002"
Yes
Yes
+/- .002
0.75%
4 ounces
6 ounces
4 ounces
8 ounces
+/- 10%
Blind/Buried
Yes
Yes
Yes
Non-Conductive
+/- 5%
Blind/Buried
Yes
Yes
Yes
Conductive
HASL
ENIG
Pb Free HASL
Immersion Tin
Immersion Silver
OSP
Immersion Gold
Electroplated Gold
Teflon
Thermagon
Arlon
Getek
Mechanical
Maximum Layer Count
Maximum Board Thickness
Maximum Board Size
Smallest Hole Size (Finished)
Aspect Ratio
Minimum Component Pitch
Minimum Core Thickness
Jump Scoring
Countersinks/Counterbores
Plated Hole Tolerance
Warpage
Copper Weight
Inner Layers
Outer Layers
Technology
Impedance Control
Via Technology
Laser Drilling (Microvias)
Plasma Etching
Laser Direct Imaging
Via Filling
Materials
Agency Qualifications
UL (File #E86319)
ISO-9001:2008
TS-16949
IPC-6012 Class 3
Standard - Everyday Capability
Advanced - Everyday Capability with a small premium.
PROCESS CAPABILITIES
Standard
Advanced
Annular Ring
Increase pad size accordingly for annular ring requirements greater than .001". Vias may use pad .010" larger than Finished Hole Size
Holes requiring greater than .001" copper (i.e. 1 oz plated to 3 oz Finish) require and additional .004 pad diameter.
.015" Spacing
.012" Spacing
Minimum -.004"
Minimum - .004"
Minimum-.005"
Minimum-.005"
Minimum -.008"
Minimum -.008"
Minimum -.012"
Minimum -.012"
Minimum-.004"
Minimum-.004"
Minimum -.005"
Minimum - .005"
Minimum -.008"
Minimum -.008"
Minimum -.012"
Minimum -.012"
Minimum -.005"
Minimum - .004"
Minimum -.008"
Minimum -.008"
Minimum -.012"
Minimum -.012"
Minimum -.005"
Minimum - .004"
Minimum -.008"
Minimum -.008"
Minimum -.012"
Minimum -.012"
Minimum -.008"
Minimum -.008"
Minimum -.010"
Minimum -.008"
Minimum -.020"
Minimum -.015"
.003" Minimum
.002" Minimum
.005" Minimum
.004" Minimum
Solder Mask
LPI Conductor Overlap
Less than 4 mil web between component pins may result in loss of mask between SMT pads.
Silkscreen
Silk Screen Ink
Font Height
Distance from Feature (clipping)
If the specifications of a board design fall into the advanced category it may be subject to additional charges.
ITEQ
NAN YA
Dielectric Constant
(1 MHz)
Dielectric Constant
(1 GHz)
Loss Tangent at
(1 MHz)
Loss Tangent at
(1 GHz)
IPC 4101A
Degradation
Temperature by TGA
(Celsius)
ISOLA
Glass Transition
Temperature Tg
(Celsius)
HONG TAI
Type
Flammability UL94
SHENGYI
Product
Electrical Strength
Minimum (volts/mil.)
Vendor
Arc Resistance
Minimum (sec.)
LAMINATE INFORMATION
S1000
/24
100
V-0
175
335
4.8
0.013
S1130
FR4
/21
115
V-0
135
4.6
0.016
S1141
FR4
/21
115
V-0
140
4.5
0.016
S1155
FR4/Halogen
Free
/21
115
V-0
135
4.7
0.01
S1165
FR4/Halogen
Free
/94
127
V-0
170
260
4.8
0.007
S1170
FR4
/24
123
V-0
175
340
4.6
0.012
S1600
/21
126
V-0
135
4.7
0.016
0.008
S1860
FR4
/29
90
V-0
210
3.6
0.008
S1440
FR4/UV Block
/97
125
V-0
140
4.7
0.0015
S2130
CEM-3
115
V-0
132
4.6
0.0016
S3110
CEM-1
118
V-0
110
4.4
0.022
HTE-420
FR4
120
V-0
145
4.2-4.8
0.019
HTE-740
FR4
120
V-0
175
4.2-4.8
0.019
ED130UV
FR4
/21
100
V-0
135
4.7
4.34
0.02
0.016
FR406
FR4
60
1000
170
295
FR408
FR4
/24
120
1400
180
370
3.63
0.013
P95
Polymide
/41
131
1200
V-0
260
4.4
4.2
0.016
0.014
Policlad 370HR
FR4
115
54
V-0
180
350
4.7
4.5
0.016
0.017
Getek
PPO
/25
>60
1200
V-0
175-185
3.6-4.2
.010-.015
IS-410
FR4
129
1100
V-0
180
350
IT140
FR4
/21
60
V-0
135
305
5.4
0.035
IT140G
FR4/Halogen
Free
/21
90
760
V-0
155
365
4.5
0.015
IT158
/24
125
V-0
155
345
4.6
0.016
IT170G
FR4/Halogen
Free
/24
100
V-0
180
380
4.5
0.009
IT180
FR4
/24, /99
60
760
V-0
170
340
4.4
0.016
IT600
/21
60
V-0
140
305
4.8
0.018
NP-140
FR4
/21
V-0
140
311
4.2
0.015
NP-170TL
FR4
/24
V-0
175
312
4.22
0.013
NPG-170
FR4/Halogen
Free
/94
90
V-0
170
355
4.3
0.012
NP-180
FR4
/24
120
V-0
180
359
4.36
0.019
NPG-180
FR4/Halogen
Free
V-0
180
380
4.8
0.016
ROGERS
ARLON
TACONIC
DUPONT
TAIFLEX
210-240
350
3.8
3.7
0.014
210-240
350
3.5
0.009
Loss Tangent at
(1 GHz)
1200
1000
Loss Tangent at
(1 MHz)
123
123
Dielectric Constant
(1 GHz)
/29
/29
Glass Transition
Temperature Tg
(Celsius)
PPE
PPE
IPC 4101A
Flammability UL94
N4000-13
N4000-13 SI
Type
Electrical Strength
Minimum (volts/mil.)
Dielectric Constant
(1 MHz)
NELCO
Product
Arc Resistance
Minimum (sec.)
Vendor
Degradation
Temperature by TGA
(Celsius)
LAMINATE INFORMATION
N4000-2
FR4
/21
65
1250
V-0
130-140
300
4.4
0.027
N4000-6
/24, /26
65
1300
V-0
170-175
300
4.3
4.1
0.027
N4000-7
FR4
/24
124
1100
V-0
155
317
4.5
0.017
0.017
N5000
BT
/30
118
1200
185-220
334
3.8
3.6
0.014
N7000-1
Polymide
/40, /41
136
1350
V-1
250-260
389
3.9
3.9
0.015
3003
PTFE
V-0
500
0.0013
4003C
Ceramic
650
280
425
3.38
0.0027
4350B
Ceramic
800
V-0
280
390
3.48
0.0037
4450B
Ceramic
1000
V-0
>280
3.54
0.004
TMM3
Ceramic
650
>280
425
3.27
0.002
TMM4
Ceramic
650
>280
425
4.5
0.002
Ultralam 2000
PTFE
185
V-0
2.6
0.0022
25N
Ceramic
/10
260
3.38
0.0025
25FR
Ceramic
/11
V-0
260
3.58
0.0035
85N
Polyimide
/40
260
4.39
0.008
TLC
PTFE
>180
V-0
3.2
0.003
TLE
PTFE
>180
V-0
2.95
0.0028
TLT
PTFE
>180
V-0
2.5
0.0006
TLX
PTFE
>180
V-0
2.5
0.0019
PYRALUX AC
Polyimide
V-0
3.7
0.014
PYRALUX AP
Polyimide
V-0
220
3.4
0.003
2LPSE 1005
Polyimide
V-0
3.65
0.009
THKD050513
Polyimide
V-0
3.65
0.009
www.syst.com.cn
www.isola-group.com
www.iteq.com.tw
www.npc.com.tw
www.parkelectro.com
www.rogerscorp.com
www.arlon-med.com
www.taconic-add.com
www.dupont.com
www.taiflex.com
PCB Software:
PADS
AutoCAD
CADSTAR
ORCAD
Accel
PCAD
Design Service:
Gerber completion in
as few as 5 days
PCB Layout:
Complete assembly
drawings for fabrication
In-Circuit Test Data Generation
Pick and Place
Data Generation
Panelization Drawings
Gerber Editing
Scanning
Accelerates time-to-market
EpecDFx IN ACTION
Typical example of a subtle, yet crucial engineering and design problem discovered before fabrication;
EpecDFx and Epecs engineering team detects and develops must-fix through optimal solutions.
Impact:
EpecDFx
Critical/Must Fix
Suggestion: Reduce plane
clearances for holes to
allow connection.
Result: Netlist integrity is
restored.
EpecDFx Better
Suggestion: Reduce plane
clearances for holes to allow
connection. Plus rotate
thermal relief 45 degrees.
Result: Netlist integrity is
restored, and thermal
properties are improved.
EpecDFx Best
Suggestion: Reduce plane
clearances for holes to allow
connection. Plus rotate
thermal relief 45 degrees and
reduce plane clearance line.
Result: Netlist integrity is
restored, and thermal
properties are maximized.
Experience EpecDFx, and how our engineering support gives customers the most in-depth feedback,
with exact accuracy, available anywhere in the printed circuit board Industry, eliminating delays and
quality problems.
Welding Equipment
Solar Panel Manufacturers
Power Supplies
Automotive
Electrical Power Distribution
Power Converters
Measured in Inches
H oz
1 oz
2 oz
3 oz
4 oz
5 oz
6 oz
0.004
0.005
0.006
0.007
0.008
0.009
0.10
0.004
0.006
0.008
0.012
0.014
0.017
0.020
0.004
0.006
0.008
0.012
0.014
0.017
0.020
0.004
0.006
0.008
0.012
0.014
0.017
0.020
0.006
0.006
0.008
0.009
0.011
0.013
0.014
0.006
0.006
0.008
0.009
0.011
0.013
0.014
0.010
0.010
0.010
0.010
0.010
0.010
0.010
10
11
Our teams of engineers are always available 24/7 to help our customers design and manufacture state of
the art products for their respected industry. Whether you need a quick turn or a prototype order,
design help, or require ITAR or special certifications, we will meet your schedule to get your products
to market faster.
12
Description
Sym.
Capability
1.1
Microvia Diameter at Target Land
100 um
0.004
1.2
Microvia Diameter at Capture Land
125 um
0.005
1.3
Microvia Target Land Size
0.012
1.4
Microvia Target Land Size
450 um
0.0177
2.1
Min. Staggered Via Pitch
Staggered Via Pitch
560 um
0.022
2.2
RCC Thickness
RCC
50 um
0.002
2.3
Blind Via Layers
3.1
Finished Board Thickness
0.012 - 0.250
3.2
Min. Inner Layer Thickness
H1
0.075 mm
0.003
3.3
Min. Dielectric Thickness
H2
0.05 mm
0.002
3.4
Max. Inner Layer Copper
T1
10 oz
3.5
Max. Outer Layer Copper
T2
6 oz
4.1
Warp and Twist (Max.)
AB
< 0.75%
5.1
Min. Finish Hole Size
0.005
5.2
Min. Land Size
0.018
5.3
Min. Annual Ring for Via
R1
IPC Class 2
5.4
Min. Annual Ring for Component
R1
0.05 mm
0.002, provided
designed per IPC
4. Warp
5. Pad
13
Description
Sym.
Capability
6.1
Tolerance for PTH Hole
0.08 mm
0.003
6.2
NPTH Hole Tolerance
0.05 mm
0.002
7.1
Registration for S/M to Pattern
S1-S2
0.0024
7.2
Registration for Legend to S/M
NA
0.005
8.1
Registration for Drill to Inner Layer
0.075 mm
0.003
8.2
Registration for Drill to Datum
0.05 mm
0.002
8.3
Registration for First Drill to
Second Drill
NA
0.005
9.1
Layer to Layer for 4 layers
0.08 mm
0.003
9.2
Layer to Layer for 6 layers
0.10 mm
0.004
9.3
Layer to Layer for 8 layers
0.13 mm
0.005
10.1
I/L Min. Width (0.5 oz)
W2
0.003
10.2
O/L Min. Width (0.5 oz)
W1
0.003
6. Drill
14
15
Description
Sym.
Capability
11.1
I/L Min. Space
S2
0.003
11.2
O/L Min. Space (0.5 oz)
0.003
12.1
Max. Aspect Ratio
(Board Thickness 0.063)
H/T
12.0
12.2
Min. Drill Hole Size
(Board Thickness 0.063,
After Plating)
0.0083
13.1
Max. Thickness on Copper
H1
0.025 mm
0.001
13.2
Max. Thickness at Shoulder
H2
0.0075 mm
0.0003
14.1
Min. SMD Space for Dam
W2
0.0078
14.2
Min. Dam Size
W1
0.0003
15.1
Max. Contact Resistance
NA
30 / sq
15.2
Max. Primary Resistance
NA
30
15.3
Min. Thickness
NA
0.0004
15.4
Min. Space
0.015
15.5
Max. Space for Registration
0.007
Description
Sym.
Capability
16.1
Min. PCB Thickness for HAL
H2
0.6 mm
0.0236
16.2
Min. Pad Width/Space for HAL
0.25 mm
0.0098
16.3
HAL Thickness for any point
H1
0.001 mm ~ 0.025 mm
40 micro-inch ~ 0.001
0.015 mm ~ 0.030 mm
0.0006 ~ 0.0012
17.1
Outline Tolerance-Punching
AB
NA
17.2
Outline Tolerance-Routing
AB
0.005
18.1
Beveling Angle
200-600
18.2
Tolerance for Outline of Bevel
+ - 0.005
19.1
V-Cut Angle V-Cut
30
19.2
Range of Board Thickness
0.030 ~ 0.125
19.3
Tolerance of V-Cut Residual
0.05 mm
0.003
19.4
V-Cut Off Line V-Cut
0.125 mm
0.005
16.4
Thickness on QFP Pad
(0.05 Wide Quad)
17. HAL Capability
16
Description
Sym.
Capability
20.1
Voltage
NA
5-500 VDC
20.2
Isolation
NA
500 M
20.3
Continuity
NA
20 ~ 100 K
20.4
Min. SMD PAD Pitch SMD
0.3 mm
0.0118
21.1
Impedance Control > 50
NA
+/- 10%
21.2
Impedance Control < 50
NA
+/- 10%
NA
+/- 10%
NA
+/- 10%
NA
+/- 10%
NA
+/- 10%
22.2
Differential Impedance
Control < 50
22. Coplanar Impedance Capability
22.1
Coplanar Impedance
Control > 50
22.2
Coplanar Impedance
Control < 50
17
pd
VH VM VB VP
bp
d1
bm
Feature
Symbol
1.27mm/
50mils
1.00mm/
0.3937mils
0.8mm/
0.031496
BGA Pad
bp
24
19
14
Must Be Avoided
Should Be Avoided
Should Be Avoided
Must Be Avoided
Must Be Avoided
(Cu defined)
bm
bp+5 (4 min)
bp+5 (4 min)
bp+5 (4 min)
pad+5 (4 min)
pd
70.71
55.67
44.54
Via Pad
VP
22-25
22
20
Via Hole
VH
10-12
10
8-10
VM
VH+5 (4 min)
VH+5 (4 min)
VH+5 (4 min)
14.35-12.35 min
9.33-8.33
7.27-5.27
VB
BGA Mask
Discrete
d1
4 min
d2
10 min
* Based on 0.062 thick board, non solder mask defined BGA pads and plastic BGA packages.
* Cu defined pad infers no mask will be present on the capture pad.
18
ADVANTAGES OF ENEPIG
The key advantages of ENEPIG, combining both excellent solder joint and gold wire bonding reliability can
be summarized in the following points:
"Black Nickel" free no possibility of grain boundary corrosion of nickel surface by immersion gold
Palladium acts as an additional barrier layer to further reduce copper diffusion to surface, thus
ensuring good solderability
Palladium completely dissolves into solder, without leaving an excessively high P% rich interface,
exposing an oxide-free nickel surface allowing reliable formation of Ni/Sn intermetallic
Withstands multiple lead-free reflow soldering cycles
Demonstrates excellent gold wire bondability
Process costs substantially lower than electrolytic nickel gold or electroless nickel electroless gold
Rohm and Haas Electronic Materials LLC is a global supplier of a comprehensive range of final finishes
including pretreatment chemistries, electroless nickel, electroless palladium and immersion gold and tin
products.
19
Immersion Tin
Immersion Silver
Organic Solder Preservatives (OSP)
Electroless Nickel Immersion Gold (ENIG)
20
OSP
ENIG
ENEPIG
Immersion
Silver
Immersion
Tin
< 12 Months
> 12 Months
> 12 Months
< 12 Months
3 6 Months
Must Be Avoided
Should Be Avoided
Should Be Avoided
Must Be Avoided
Must Be Avoided
SMT Land
Surface Planarity
Flat
Flat
Flat
Flat
Flat
Multiple
Soldering Cycles
Fair To Good
Good
Good
Fair To Good
Fair To Good
Pth/Via Fill
Concerns
No Concerns
No Concerns
No Concerns
No Concerns
Characteristics
Shelf Life
(Controlled Conditions)
Handling / Contact
With Soldering
Surfaces
Good Process
Good
Good
Interfacial Microvoid
Concerns
Good
No
No
Yes
No
No
Good
Good
Good
Good
Corrosion Risk
After Assembly
Yes
No
No
No
Yes
Contact Surface
Applications
No
Yes
Yes
No
No
1.0 1.1
Total Coating
Thickness (Micron)
Poor,
> 0.15
u 0.08 0.13
Ni 3.0 6.0
Soldering:
Au 0.03 0.05
Pd 0.05 0.1
Ni 3.0 5.0
Wirebonding:
Au 0.07 0.15
Pd 0.1 0.15
Ni 3.0 5.0
When we consider the final finish performance in a variety of different assembly methods, it can be seen that
ENEPIG is suitable for a wide range of assembly requirements.
21
ELECTRICAL ENGINEERING
We have the experience required to consistently meet the highest standards in the industry. Our experience
spans multiple market segments, including Telecom, Datacom, Computer & Storage, Medical,
Mil/Aero, Industrial, and consumer products.
Our expertise lies in High-Speed Circuitry Design up to 40GHz and Mesh Networking
(Optical: OC-48, OC-192, T1, E1, and Infiniband).
Other capabilities include Thermal Engineering, Signal Integrity Analysis, Software and Firmware Design,
including software integration and API design.
Digital/High-Speed and Analog Design Capabilities Include:
Circuit Design and Analysis
FPGA to ASIC Conversion
Component Analysis & Evaluation
Compliance and Value Engineering
Pulsed Circuits
Analog Circuit Simulation and much more!
Embedded Microprocessors & Chipsets for
Power PC, Intel x86, TI DSP, Mellanox, Broadcom
and various other chipsets used in Server, Telecom,
Industrial, and Commercial market segments
22
MECHANICAL ENGINEERING
Our Engineers have 30 years experience in Mechanical Engineering. We are capable of supporting any part
of the product lifecycle across multiple market segments. We utilize leading CAD platforms such as
AutoCAD Inventor, SolidWorks, and Pro/ENGINEER Wildfire.
Our Capabilities Include:
Packaging, Enclosure, and Industrial Design
Product/System Architecture
Detailed Mechanical Design
Stress Analysis (FEA) Shock/Vibration Simulation
Thermal Simulation
Material and Component Selection
Solid Modeling
PCB Linkage DFM / DFA & Cost reduction
PCB FABRICATION
For over 60 years Epec has been your reliable PCB manufacture. From prototype to production runs our
engineers can support you in all your PCB needs 24/7. Why look elsewhere, from the simplest single sided
PCB to HDI, sequential laminated multilayers with multiple blind and buried vias weve got you covered.
Via in pad, silver filled, copper filled, epoxy, conductive, non-conductive via fill, Aluminum, RF, ENEPIG, our
specialty is customer service. As we continue to expand our PCB supply chain we have one goal in mind,
to provide our valued customers what they need when they need it. Supporting domestic 1, 2, 3 day quick
turns, 5 day turns from Asia and our guarantee to satisfy.
PCB FABRICATION
Our SI experts have years of experience in pre-design and post-design verification and analysis. This
experience and expertise, combined with powerful state-of-the-art software, helps ensure your design will
work the way you expect it to the first time and all the time. Although we can customize services to meet
your unique needs, we have included a list below of the services we provide.
Capabilities Include:
Up Front SI Risk Analysis
Pre and Post Route Simulations
Frequency Domain & Time Domain Modeling
3D Via Field Modeling and Optimization
Optimization of AC Coupling Cap Launches
Optimization of Connector Launches
Infiniband, PCIe (Gen 1 & 2), XAUI link Analysis
IEEE 802.3ap KR Compliance to 10 Gbps
StatEye Time Domain Analysis
DDR2 and DDR3 Optimization
Crosstalk and Timing Analysis
Detailed SI CAD Guidelines Generation
Real Time SI Support Throughout the CAD Layout Process
23
ITAR COMPLIANT
What is ITAR?
The International Traffic in Arms Regulations (ITAR) is a set of regulations that govern
the export and re-export of certain controlled commodities, services, and, most
importantly, technologies. In order to be controlled under ITAR as a defense article,
a given component, subcomponent, part, assembly, subassembly, or integrated
system must have been specifically designed, developed, configured, adapted,
or modified for a military application controlled under the United States Munitions List.
It also restricts sensitive information and technologies to only to be shared with US Citizens unless
special approval is granted. In summary, this regulation makes sure that anything to do with US proprietary
defense secrets are not shared with anyone that our government has deemed not authorized to see or be in
possession of. Including non-US citizens in the US.
ITAR Compliance vs. ITAR Registered
ITAR requires that any person (company) who engages in the business of manufacturing defense articles or
furnishing defense services is required to register and keep their registration current with the United States
Department of State. Epec Engineered Technologies is registered with the Department of State.
Many companies claim that they are ITAR compliant, but havent taken the proper steps to register with the
Department of State. If you manage ITAR materials, it is your responsibility to assure that all of your
suppliers have the proper registrations and follow the ITAR procedures. The Department of State interprets
and enforces ITAR. Its goal is to safeguard US national security and further US foreign policy objectives.
Epecs ITAR Commitment
Being a global manufacturer of build to print products, ITAR compliance requires a significant commitment
from management and a substantial investment in systems. Epecs management has committed by
investing in separate and secure IT resources that ensure that all of our ITAR data is stored in a manner that
far exceeds the ITAR requirement.
Epecs ITAR PCB Manufacturing
Because our roots are in PCB manufacturing, we have traditionally focused most of our ITAR work in printed
circuit boards as printed circuit boards fall under Item 14-Category II of the United States Munitions List. Our
factory located in Detroit, MI focuses solely on quick turn, ITAR and military work. This focus has allowed us
to be profitable and to invest in the right equipment and people to allow us to exceed our customers
expectations.
Understanding ITAR & Your Supply Chain
Epec has long been an industry leader in supply chain management and we have used our many years of
experience to develop processes and procedures that assure ITAR compliance today and well into the
future. As a company that deals in ITAR articles it is our responsibility to make sure that all of our
subcontractors, employees, directors and sales representatives understand the compliance is not optional.
Our auditing process allows us to systematically check all of the effected parties to assure compliance. This
is another way that we add value to our customers.
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CONTACT US
Our knowledgeable staff has many years of experience in the industry.
We welcome the opportunity to put our skills to work for you!
Please contact us with any questions or requests.
North American Headquarters
174 Duchaine Blvd.
New Bedford, MA 02745
Toll Free: (888) 995-5171
Tel: (508) 995-5171
Fax: (508) 998-8694
Contact Us By Email:
Sales
sales@epectec.com
Quotes
quoting@epectec.com
Engineering engineering@epectec.com
Quality
quality@epectec.com