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DATA SHEET
book, halfpage
M3D088
BF862
N-channel junction FET
Product specification
Supersedes data of 1999 Jun 29
2000 Jan 05
NXP Semiconductors
Product specification
BF862
FEATURES
PINNING SOT23
PIN
DESCRIPTION
source
drain
gate
DESCRIPTION
Silicon N-channel symmetrical junction field-effect
transistor in a SOT23 package. Drain and source are
interchangeable.
3
Top view
MAM036
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDS
drain-source voltage
20
VGSoff
0.3
0.8
1.2
IDSS
drain-source current
10
25
mA
Ptot
300
mW
yfs
transfer admittance
35
45
mS
Tj
junction temperature
150
Ts 90 C
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling.
2000 Jan 05
NXP Semiconductors
Product specification
BF862
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDS
drain-source voltage
20
VDG
drain-gate voltage
20
VGS
gate-source voltage
20
IDS
drain-source current
40
mA
IG
10
mA
Ptot
300
mW
Tstg
storage temperature
65
+150
Tj
junction temperature
150
Ts 90 C; note 1
Note
1. Main heat transfer is via the gate lead.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-s
PARAMETER
CONDITIONS
Note
1. Soldering point of the gate lead.
MCD808
400
handbook, halfpage
Ptot
(mW)
300
200
100
0
0
40
80
120
Ts (C)
160
2000 Jan 05
note 1
VALUE
UNIT
200
K/W
NXP Semiconductors
Product specification
BF862
STATIC CHARACTERISTICS
Tj = 25 C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V(BR)GSS
IGS = 1 A; VDS = 0
20
VGS
VDS = 0; IG = 1 mA
VGSoff
VDS = 8 V; ID = 1 A
0.3
0.8
1.2
IGSS
VGS = 15 V; VDS = 0
nA
IDSS
drain-source current
VGS = 0; VDS = 8 V
10
25
mA
DYNAMIC CHARACTERISTICS
Common source; Tamb = 25 C; VGS = 0; VDS = 8 V; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
yfs
Tj = 25 C
gos
Tj = 25 C
Ciss
input capacitance
f = 1 MHz
Crss
f = 1 MHz
en
f = 100 kHz
fT
transition frequency
2000 Jan 05
MIN.
TYP.
MAX.
UNIT
45
180
400
10
pF
1.9
pF
0.8
nV/Hz
715
MHz
35
mS
NXP Semiconductors
Product specification
BF862
MCD809
40
MCD810
300
handbook, halfpage
handbook, halfpage
IDSS
(mA)
gos
(S)
30
200
20
100
10
0.5
VGSoff (V)
1.5
10
20
IDSS (mA)
30
VDS = 8 V; Tj = 25 C.
VDS = 8 V; Tj = 25 C.
Fig.4
Fig.3
MCD811
60
MCD812
60
handbook, halfpage
handbook, halfpage
yfs
(mS)
yfs
(mS)
50
40
40
20
30
20
0
10
20
IDSS (mA)
30
10
VDS = 8 V; Tj = 25 C.
VDS = 8 V; Tj = 25 C.
Fig.5
Fig.6
2000 Jan 05
20
ID (mA)
30
NXP Semiconductors
Product specification
BF862
MCD813
30
MCD814
20
handbook, halfpage
handbook, halfpage
VGS = 0 V
ID
(mA)
ID
(mA)
16
0.1 V
max
20
12
0.2 V
typ
0.3 V
10
min
0.4 V
0.5 V
0.8
0.6
0.4
0.2
VGS (V)
VDS = 8 V; Tj = 25 C.
VDS = 8 V; Tj = 25 C.
Fig.7
Fig.8
MCD815
104
handbook, halfpage
ID = 20 mA
MCD816
handbook, halfpage
1 mA
C
(pF)
0.1 mA
102
12
12
10 mA
IG
(nA)
VDS (V)
102
104
Cis
IGSS
Crs
10
15
0
8
20
25
VDG (V)
VGS (V)
VDS = 8 V; f = 1 MHz; Tj = 25 C.
VDS = 8 V; Tj = 25 C.
Fig.9
2000 Jan 05
NXP Semiconductors
Product specification
BF862
MCD817
102
handbook, halfpage
MCD818
10
handbook, halfpage
yis
(mS)
yrs
yrs
10
rs
(deg)
(mS)
bis
rs
103
102
101
gis
102
101
10
102
f (MHz)
101
101
103
10
102
f (MHz)
10
103
VDS = 5 V; VG2 = 4 V.
ID = 15 mA; Tamb = 25 C.
MCD819
102
handbook, halfpage
yos
(mS)
yfs
fs
(deg)
yfs
(mS)
MCD820
102
handbook, halfpage
102
10
fs
bos
10
10
1
gos
1
101
10
102
f (MHz)
101
101
1
103
10
102
f (MHz)
103
2000 Jan 05
NXP Semiconductors
Product specification
BF862
PACKAGE OUTLINE
Plastic surface-mounted package; 3 leads
SOT23
HE
v M A
Q
A
A1
2
e1
bp
c
w M B
Lp
e
detail X
2 mm
scale
A1
max.
bp
e1
HE
Lp
mm
1.1
0.9
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45
0.15
0.55
0.45
0.2
0.1
OUTLINE
VERSION
SOT23
2000 Jan 05
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
TO-236AB
NXP Semiconductors
Product specification
BF862
PRODUCT
STATUS(2)
DEFINITION
Development
This document contains data from the objective specification for product
development.
Qualification
Production
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
DEFINITIONS
Product specification The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
DISCLAIMERS
Limited warranty and liability Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
2000 Jan 05
NXP Semiconductors
Product specification
BF862
Export control This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
2000 Jan 05
10
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
R77/03/pp11