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DATA SHEET
TDA1557Q
2 x 22 W BTL stereo car radio
power amplifier with speaker
protection
Product specification
File under Integrated Circuits, IC01
May 1992
Philips Semiconductors
Product specification
TDA1557Q
FEATURES
No switch-on/switch-off plop
Flexible leads
Fixed gain
Good ripple rejection
GENERAL DESCRIPTION
Mute/stand-by switch
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
6.0
14.4
18
non-operating
30
load dump
45
IORM
Itot
80
mA
Isb
stand-by current
0.1
100
Isw
switch-on current
60
ZI
input impedance
25
TXTAL
crystal temperature
+150
Stereo application
PO
output power
THD = 10%; 4
22
SVRR
RS = 0; f = 100 Hz to 10 kHz
45
dB
VO
250
mV
channel separation
40
dB
Gv
channel unbalance
dB
Gv
45
46
47
dB
ORDERING INFORMATION
EXTENDED TYPE
NUMBER
TDA1557Q
PACKAGE
PINS
PIN POSITION
MATERIAL
CODE
13
DIL
plastic
SOT141R
Note
1. SOT141-6; 1996 August 23.
May 1992
Philips Semiconductors
Product specification
TDA1557Q
input 1
mute switch
10
POWER
STAGE
VP
CM
VA
output 1A
30 k
183
18.1 k
POWER
STAGE
mute switch
CM
VA
183
output 1B
18.1 k
TDA1557Q
VP
11
input
reference
voltage
stand-by
switch
mute/stand-by
stand-by
reference
voltage
12
VA
mute
switch
15 k
x1
loudspeaker
protection
15 k
mute
reference
voltage
input 2
mute switch
13
POWER
STAGE
CM
VA
output 2B
30 k
183
18.1 k
POWER
STAGE
mute switch
CM
VA
input
reference
voltage
183
18.1 k
5
8
MCD324 - 1
signal ground
power ground
May 1992
output 2A
Philips Semiconductors
Product specification
TDA1557Q
PINNING
SYMBOL
FUNCTIONAL DESCRIPTION
PIN
DESCRIPTION
INP1
input 1
GND1
ground (signal)
VP1
supply voltage 1
OUT1A
output 1A
GND
power ground 1
OUT1B
output 1B
OUT2A
output 2A
mute facility
GND
power ground 2
OUT2B
output 2B
VP2
10
supply voltage 2
M/SS
11
mute/stand-by switch
Vref
12
INP2
13
input 2
a. mute/stand-by switch
low stand-by current
b. loudspeaker protection
when a short circuit to ground is made, which forces a
DC voltage of 1 V across the loudspeaker, a built-in
protection circuit becomes active and limits the DC
voltage across the loudspeaker to 1 V
c. the harmonic distortion at low frequencies can be
decreased by connecting two diodes to ground at pin 12.
handbook, halfpage
INP1
GND1
VP1
OUT1A
GND
OUT1B
OUT2A
GND
OUT2B
TDA1557Q
P2 10
M / SS 11
Vref 12
INP2 13
MCD322 - 1
May 1992
Philips Semiconductors
Product specification
TDA1557Q
LIMITING VALUES
In accordance with the Absolute maximum System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
operating
18
non-operating
30
45
18
VPR
reverse polarity
6.0
200
mJ
IOSM
IORM
VP = 0
Ptot
60
Tstg
55
+150
Tj
junction temperature
+150
THERMAL RESISTANCE
SYMBOL
PARAMETER
THERMAL RESISTANCE
Rth vj-a
40 K/W
Rth vj-c
1.5 K/W
handbook, halfpage
output 1
output 2
virtual
junction
2.8
K/W
2.8
K/W
0.1
K/W
case
MLA382
May 1992
Philips Semiconductors
Product specification
TDA1557Q
DC CHARACTERISTICS
VP = 14.4 V, Tamb = 25 C, unless otherwise specified. See note 1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
IP
quiescent current
VO
DC output voltage
Vos
note 2
6.0
14.4
18
80
160
mA
6.9
250
mV
8.5
3.3
6.4
20
mV
250
mV
2.0
V11 0.5 V
100
500
30
60
5.5
mA
1.0
note 3
Mute/stand-by switch
Vsw
MUTE CONDITION
Vmute
mute voltage
VO
Vos
VI = 1 V max; f = 1 kHz
STAND-BY CONDITION
Vsb
stand-by voltage
Isb
Isw
switch-on current
IP
short-circuit to GND;
note 4
Loudspeaker protection
V4-6, 7-9 DC voltage across RL
May 1992
Philips Semiconductors
Product specification
TDA1557Q
AC CHARACTERISTICS
VP = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; unless otherwise specified. See note 1.
SYMBOL
PO
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
output power
THD = 0.5%
15
17
THD = 10%
20
22
12
17
THD
PO = 1 W
0.1
power bandwidth
THD = 0.5%; PO = 1 dB
20 to
Hz
flow
1 dB; note 5
25
Hz
fhigh
1 dB
20
kHz
Gv
45
46
47
dB
SVRR
34
dB
ON; note 7
38
dB
ON; note 8
45
dB
45
dB
80
dB
25
30
36
ON; RS = 0; note 9
325
500
RS = 10 k; note 9
350
180
with respect to 15 W
ZI
input impedance
Vno
15 000
channel separation
40
dB
Gv
channel unbalance
dB
May 1992
Philips Semiconductors
Product specification
TDA1557Q
mute /
stand-by
+V
100 nF
11
270 nF
input 1
2200 F
10
1
4
R L= 4
30 k
6
ground (signal)
12
reference
voltage
270 nF
input 2
13
9
R L= 4
30 k
7
TDA1557Q
5
May 1992
MCD323 - 1
Philips Semiconductors
Product specification
TDA1557Q
PACKAGE OUTLINE
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
non-concave
Dh
x
D
Eh
A2
B
j
E
A
L3
Q
c
13
e1
Z
e
bp
e2
w M
v M
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A2
bp
D (1)
Dh
E (1)
e1
e2
Eh
L3
Z (1)
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
3.4
1.7
5.08
3.4
3.1
12.4
11.0
2.4
1.6
4.3
2.1
1.8
0.8
0.25
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-03-11
SOT141-6
May 1992
EUROPEAN
PROJECTION
Philips Semiconductors
Product specification
TDA1557Q
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
May 1992
10