DG535/536

Vishay Siliconix

16-Channel Wideband Video Multiplexers

DESCRIPTION

FEATURES

The DG535/536 are 16-channel multiplexers designed for

routing one of 16 wideband analog or digital input signals to
a single output. They feature low input and output
capacitance, low on-resistance, and n-channel DMOS T
switches, resulting in wide bandwidth, low crosstalk and high
off isolation. In the on state, the switches pass signals in
either direction, allowing them to be used as multiplexers or
as demultiplexers.

On-chip address latches and decode logic simplify

microprocessor interface. Chip Select and Enable inputs
simplify addressing in large matrices. Single-supply
operation and a low 75 W power consumption vastly
reduces power supply requirements.

BENEFITS

Theses devices are built on a proprietary D/CMOS process

which creates low-capacitance DMOS FETs and
high-speed, low-power CMOS logic on the same substrate.
For more information please refer to Vishay Siliconix
Application Note AN501 (FaxBack document number
70608).

Crosstalk: - 100 dB at 5 MHz

300 MHz Bandwidth
Low Input and Output Capacitance
Low Power: 75 W
Low rDS(on): 50
On-Board Address Latches
Disable Output

Pb-free
Available

RoHS*
COMPLIANT

High Video Quality

Reduced Insertion Loss
Reduced Input Buffer Requirements
Minimizes Power Consumption
Simplifies Bus Interface

APPLICATIONS

Video Switching/Routing
High Speed Data Routing
RF Signal Multiplexing
Precision Data Acquisition
Crosspoint Arrays
FLIR Systems

FUNCTIONAL BLOCK DIAGRAM AND PIN CONFIGURATION

28

S9

27

S10

GND

S7

26

S11

6 5 4 3 2

S6

25

S12
DIS

S5

24

S13

39

S6

CS

38

GND

S14

CS

37

S7

EN

10

36

GND

A0

11

35

S8

34

GND

33

S9

22

S15

S2

21

S16

S1

20

DIS

10

19

V+

CS

11

18

ST

CS

12

17

A3

16

A2

15

A1

Latches/Decoders/Drivers
EN

13

A0

14

Top View

GND

GND
S5

GND
S4

S3

GND

S2

GND

Latches/
Decoders/
Drivers

A1

12

A2

13

A3

14

32

GND

ST

15

31

S10

V+

16

30

GND

17

29

S11

18 19 20 21 22 23 24 25 26 27 28
GND

S3

GND
S12

23

1 44 43 42 41 40

S14
GND
S13

S15
GND

S4

PLCC/Cerquad
S1

S8

DG536

DG535

S16
GND

GND

GND

Dual-In-Line
Top View

* Pb containing terminations are not RoHS compliant, exemptions may apply

Document Number: 70070
S-71241Rev. E, 25-Jun-07

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DG535/536
Vishay Siliconix
ORDERING INFORMATION
Temperature Range

Package

Part Number
DG535DJ
DG535DJ-E3

28-Pin Plastic DIP

- 40 to 85 C

DG536DN
DG536DN-E3

44-Pin PLCC

TRUTH TABLE
EN

CS

CS

STa

A3

A2

A1

A0

Channel Selected

Disableb

0
X
X

X
0
X

X
X
1

None

High Z

0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
X

0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
X

0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
X

0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
X

S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
S15
S16
Maintains previous switch condition

X
X
X
Logic "0" = VAL 4.5 V
Logic "1" = VAH 10.5 V
X = Do not Care

Low Z

High Z or Low Z

Notes:
a. Strobe input (ST) is level triggered.
b. Low Z, High Z = impedance of Disable Output to GND. Disable output sinks current when any channel is selected.

ABSOLUTE MAXIMUM RATINGS

Parameter
V+ to GND
Digital Inputs
VS, VD
Current (any terminal) Continuous
Current (S or D) Pulsed 1 ms 10 % duty cycle
(A Suffix)
Storage Temperature
(D Suffix)
Power Dissipation (Package)a

28-Pin Plastic DIPb

28-Pin Sidebrazec
44-Pin PLCCd
44-Pin Cerquade

Limit
- 0.3 to + 18
(GND - 0.3) to (V+) + 2
or 20 mA, whichever occurs first
(GND - 0.3) to (V+) + 2
or 20 mA, whichever occurs first
20
40
- 65 to 150
- 65 to 125
625
1200
450
825

Unit

mA
C

mW

Notes:
a. All leads soldered or welded to PC board.
b. Derate 8.6 mW/C above 75 C.
c. Derate 16 mW/C above 75 C.
d. Derate 6 mW/C above 75 C.
e. Derate 11 mW/C above 75 C.

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Document Number: 70070

S-71241Rev. E, 25-Jun-07

DG535/536
Vishay Siliconix
SPECIFICATIONSa
Test Conditions
Unless Otherwise Specified
V+ = 15 V, ST, CS = 10.5 V
Parameter
Analog Switch

Symbol

Analog Signal Rangee

Drain-Source
On-Resistance
Resistance Match

VANALOG
rDS(on)
rDS(on)

CS = 4.5 V, VA = 4.5 or 10.5 Vf

Typc

Full
IS = - 1 mA, VD = 3 V, EN = 10.5 V
Sequence Each Switch On

Source Off Leakage Current

IS(off)

VS = 3 V, VD = 0 V, EN = 4.5 V

Drain On Leakage Current

ID(on)

VS = VD = 3 V, EN = 10.5 V

RDISABLE

IDISABLE = 1 mA, EN = 10.5 V

Disable Output

Tempb

Room
Full
Room
Room
Full
Room
Full
Room
Full

A Suffix
- 55 to 125 C

D Suffix
- 40 to 85 C

Minc

Maxc

Minc

10

55

- 10
- 100
- 10
- 1000
100

90
120
9
10
100
10
1000
200
250

- 10
- 100
- 10
- 100

Maxc

Unit

10

90
120
9
10
100
- 10
- 100
200
250

nA

Digital Control
Input Voltage High

VAIH

Full

Input Voltage Low

VAIL

Full
Room
Full
Full

Address Input Current

IAI

Address Input Capacitance

CA

VA = GND or V+

10.5
< 0.01

-1
- 100

10.5
4.5
1
100

-1
- 100

4.5
1
100

V
A
pF

Dynamic Characteristics
On State Input Capacitance

Off State Input Capacitancee

Off State Output

Capacitancee

CS(on)

CS(off)

CD(off)

Multiplexer Switching Time

tTRANS

Break-Before-Make Interval

tOPEN

VD = V S = 3 V

VS = 3 V

VD = 3 V

PLCC

Room

32

Cerquad

Room

35

DIP
PLCC

Room
Room

40
2

Cerquad

Room

DIP

Room

PLCC

Room

Cerquad

Room

12

DIP

Room

45

55
8

55
8
pF

20

Full

See Figure 4

45

20

300

Full

25

300
25

EN, CS, CS, ST, tON

tON

See Figure 2 and 3

Full

300

300

EN, CS, CS, ST, tOFF

tOFF

See Figure 2

Full

150

150

Charge Injection
Single-Channel Crosstalk

Chip Disabled Crosstalk

Adjacent Input Crosstalk

All Hostile Crosstalke

Bandwidth

Document Number: 70070

S-71241Rev. E, 25-Jun-07

Q
XTALK(SC)

XTALK(CD)

XTALK(AI)

XTALK(AH)
BW

See Figure 5

Room

- 35

Room

- 100

RIN = 75 , RL = 75
f = 5 MHz
See Figure 9

Cerquad

Room

- 93

DIP

Room

- 60

RIN = RL = 75 , f = 5 MHz
EN = 4.5 V
See Figure 8

PLCC

Room

- 85

Cerquad

Room

- 84

RIN = 10 , RL = 10 k
f = 5 MHz
See Figure 10

DIP
PLCC

Room
Room

- 60
- 92

Cerquad

Room

- 87

DIP

Room

- 72

RIN = 10 , RL = 10 k
f = 5 MHz
See Figure 7

PLCC

Room

- 74

Cerquad

Room

- 74

DIP

Room

- 60

Room

500

PLCC

RL = 50 , See Figure 6

ns

pC

dB

- 60

- 60

MHz

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DG535/536
Vishay Siliconix
SPECIFICATIONSa
Test Conditions
Unless Otherwise Specified
V+ = 15 V, ST, CS = 10.5 V
Symbol

CS = 4.5 V, VA = 4.5 or 10.5 Vf

Tempb

Typc

Positive Supply Current

I+
V+

Room
Full
Full

Supply Voltage Range

Any One Channge I Selected with All

Logic Inputs at GND or V+

Parameter
Power Supplies

Minimum Input Timing Requirements

tSW
Strobe Pulse Width
A0, A1, A2, A3 CS, CS, EN
Data Valid to Strobe

tDW

A0, A1, A2, A3 CS, CS, EN

Data Valid after Strobe

tWD

A Suffix
- 55 to 125 C

D Suffix
- 40 to 85 C

Minc

Maxc

Minc

Maxc

10

50
100
16.5

10

50
100
16.5

Full

200

200

Full

100

100

Unit

See Figure 1

A
V

ns
Full

50

50

Notes:
a. Refer to PROCESS OPTION FLOWCHART.
b. Room = 25 C, Full = as determined by the operating temperature suffix.
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
e. Guaranteed by design, not subject to production test.
f. VA = input voltage to perform proper function.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.

TYPICAL CHARACTERISTICS 25 C, unless otherwise noted

300
V+ = +15 V
GND = 0 V

360

r DS(on) Drain-Source On-Resistance ()

r DS(on) Drain-Source On-Resistance ()

400

320
280
240

125 C

200
160
120

25 C

80
- 55 C

40
0

GND = 0 V
TA = 25 C

270
240
210

8V

180
12 V
150

15 V

120
90
60
30
0

VD Drain Voltage (V)

rDS(on) vs. VD and Temperature

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10

10

VD Drain Voltage (V)

rDS(on) vs. VD and Power Supply Voltage

Document Number: 70070

S-71241Rev. E, 25-Jun-07

DG535/536
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
14

10
9

GND = 0 V
TA = 25 C

10

125 C

I+ (A)

V th (V)

GND = 0 V

12

5
4

25 C
6

4
- 55 C

2
2
1
0

0
10

12

14

16

18

10

11

12

V+ Positive Supply (V)

Logic Input Switching Threshold

vs. Supply Voltage (V+)

14

15

16

17

18

Supply Current vs.

Supply Voltage and Temperature

1 A

1 A
V+ = + 15 V
GND = 0 V
VD = V S = 3 V

100 nA

V+ = + 15 V
GND = 0 V

100 nA

10 nA

I S, I D Leakage

I D(on) Leakage

13

V+ Positive Supply (V)

1 nA

100 pA

10 pA

ID(off)

10 nA

IS(off)
1 nA

100 pA

10 pA

1 pA

1 pA
- 55

- 35

- 15

25

45

65

85

105 125

- 55

- 35

- 15

Temperature (C)

25

45

65

85

105 125

Temperature (C)

ID(on) vs. Temperature

Leakage Current vs. Temperature

0

- 120
DG536
RIN = 10

- 100

-4
Insertion Loss (dB)

X TALK(AI) (dB)

DG536
- 80

DG536
RIN = 75

- 60
DG535
RIN = 10

- 40

-8
- 3 dB Points
- 12
Test Circuit
See Figure 6
RL = 50

- 16
- 20

DG535

Test Circuit
See Figure 10
- 20

0
0.1

10

f Frequency (MHz)

Adjacent Input Crosstalk vs. Frequency

Document Number: 70070

S-71241Rev. E, 25-Jun-07

100

10

100

1000

f Frequency (MHz)

- 3 dB Bandwidth Insertion Loss vs. Frequency

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DG535/536
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
- 160

- 160
Test Circuit
See Figure 8

- 140

- 100

DG536
RL = 75

- 80

X TALK(AH) (dB)

X TALK(CD) (dB)

DG536
RIN = 10
RL = 10 k

- 120

- 120

DG536
RL = 50

DG535
RL = 75

- 60

- 100

DG536
RIN = 75
RL = 75

- 80
- 60

- 40

- 40

- 20

- 20

DG535
RIN = 10
RL = 10 k

0
0.1

10

100

0.1

10

100

f Frequency (MHz)

f Frequency (MHz)

Chip Disable Crosstalk vs. Frequency

All Hostile Crosstalk vs. Frequency

- 160

160
Test Circuit
See Figures 2, 3, 4

140

Test Circuit
See Figure 9
RIN = 75
RL = 75

- 140
tON
- 120

100

X TALK(SC) (dB)

120
Switching Time (ns)

Test Circuit
See Figure 7

- 140

tBBM

80
60
tOFF

40

- 100
DG536
- 80
- 60
DG535
- 40
- 20

20

0
- 55 - 35

- 15

25

45

65

85

105 125

0.1

Temperature (C)

10

100

f Frequency (MHz)

Single Channel Crosstalk vs. Frequency

tON, tOFF and Break-Before-Make vs. Temperature

INPUT TIMING REQUIREMENTS

15 V
ST

7.5 V
0V
tSW
tDW

tWD

15 V
10.5 V

10.5 V

4.5 V

4.5 V

CS, A0, A1, A2, A3

CS, EN
0V

Figure 1.

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Document Number: 70070

S-71241Rev. E, 25-Jun-07

DG535/536
Vishay Siliconix
TEST CIRCUITS

+ 15 V

+ 15 V

V+

ST
A0
A1
A2
A3

Logic
Input

Address
Logic Input
tr < 20 ns
tf < 20 ns

CS
15 V
50 %
EN or CS

0V

+3V

S16
S1 - S15

90 %

EN or CS
CS
GND

VO

D
1 k

Signal
Output

35 pF

tON

tOFF

Figure 2. EN, CS, CS, Turn On/Off Time

+ 15 V

+ 15 V

Address
Logic Input
tr < 20 ns
tf < 20 ns

V+
EN, CS
A1, A2, A3

S2 - S15

Address
Input

50 %

0V

+3V

S1

15 V

15 V
0V

A0
ST

Logic
Input

VO

D
GND

CS

1 k

tON(ST)

VOUT

90 %

35 pF
0V

Figure 3. Strobe ST Turn On Time

+ 15 V

+ 15 V

+3V
Address
Logic Input
tr < 20 ns
tf < 20 ns

V+
EN
CS
ST
A0
A1
A2
A3

S1
S16
S2 thru S15

15 V
50 %
0V
Switch
Output

90 %
S16
Turning On

S1
Turning Off
D
GND

VO
tBBM

CS
1 k

35 pF

tTRANS

Figure 4. Transition Time and Break-Before-Make Interval

Document Number: 70070

S-71241Rev. E, 25-Jun-07

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DG535/536
Vishay Siliconix
TEST CIRCUITS
+ 15 V

+ 15 V

+ 15 V
V+

A0, A1, A2, A3

ST
EN
D

S16

+3V
Logic
Input

VO
CL
1000 pF

CS
GND

+ 15 V

+ 15 V

CS
V+
S2 thru S15

EN
CS
ST
CS
S1
Signal
Generator
(75 )

VOUT

VOUT

GND

CS

A0
to
A3

VO
RL
50 W

VOUT is the measured voltage error due to charge injection.

The charge injection in Coulombs is Q = CL x V OUT

Figure 6. Bandwidth

Figure 5. Charge Injection

All Channels Off

Channel 1 On
S1

S1
S2

S2

S3

S3

RIN

S4

S4

S5

S5

S6

S6

S7

S7

S8

S8

VO

S9

S10

S10
S11

RL

S12
S13

S13

S14

S14

S15

S15

S16

S16
VO
X TALK(AH) = 20 log 10
V

Figure 7. All Hostile Crosstalk

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S11

RL

S12

VO

S9

VO
X TALK(CD) = 20 log10
V

Figure 8. Chip Disabled Crosstalk

Document Number: 70070

S-71241Rev. E, 25-Jun-07

DG535/536
Vishay Siliconix
TEST CIRCUITS
Channel 1 On
S1
S2
RIN

S3
S4
S5
S6
S7
S8

RIN
10

VO

S9

VSn1

S10
S11

Sn1
RL

VSn

S12

Sn

S13
VSn+1

S14
S15

Sn+1

RIN
10

S16

RL
10 k

Notes:
1. Any individual channel between S2 and S16 can be selected
2. X TALK(SC) = 20 log10

VO
V

X TALK(AI) = 20 log10

is scanned sequentially from S 2 to S 16

V Sn 1
V Sn

or 20 log10

V Sn + 1
V Sn

Figure 10. Adjacent Input Crosstalk

Figure 9. Single Channel Crosstalk

PIN DESCRIPTION
Symbol
S1 thru S16
D
DIS
CS, CS, EN
A0 thru A3

Description
Analog inputs/outputs
Multiplexer output/demultiplexer input
Open drain low impedance to analog ground when any channel is selected
Logic inputs to selected desired multiplexer(s) when using several multiplexers in a system
Binary address inputs to determine which channel is selected

ST

Strobe input that latches A0, A1, A2, A3, CS, CS, EN

V+

Positive supply voltage input

GND

Analog signal ground and most negative potential

All ground pins should be connected externally to ensure dynamic performance

Document Number: 70070

S-71241Rev. E, 25-Jun-07

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DG535/536
Vishay Siliconix
DETAILED DESCRIPTION
The DG535/536 are 16-channel single-ended multiplexers
with on-chip address logic and control latches.
The multiplexer connects one of sixteen inputs (S1, S2
through S16) to a common output (D) under the control of a
4-bit binary address (A0 to A3). The specific input channel
selected for each address is given in the Truth Table.
All four address inputs have on-chip data latches which are
controlled by the Strobe (ST) input. These latches are
transparent when Strobe is high but they maintain the
chosen address when Strobe goes low. To facilitate easy
microprocessor control in large matrices a choice of three
independent logic inputs (EN, CS and CS) are provided on
chip. These inputs are gated together (see Figure 11) and
only when EN = CS = 1 and CS = 0 can an output switch be
selected. This necessary logic condition is then latched-in
when Strobe (ST) goes low.

Signal
IN

SW1

Signal
OUT

SW3

SW2

Signal
GND

Figure 12. T Switch Arrangement

The two second level series switches further improve

crosstalk and help to minimize output capacitance.
The DIS output can be used to signal external circuitry. DIS
is a high impedance to GND when no channel is selected
and a low impedance to GND when any one channel is
selected.

CS
Latch

CS

A1
Latch

EN

A2
Latch

Decode Logic

A0
Latch

The DG535/536 have extensive applications where any high

frequency video or digital signals are switched or routed.
Exceptional crosstalk and bandwidth performance is
achieved by using n-channel DMOS FETs for the T and
series switches.

Gate

Drain

Source

A3
Latch
n+

ST

Figure 11. CS, CS, EN, ST Control Logic

n+

p
pSubstrate
GND

Break-before-make switching prevents momentary shorting

when changing from one input to another.
The devices feature a two-level switch arrangement whereby
two banks of eight switches (first level) are connected via two
series switches (second level) to a common DRAIN output.
In order to improve crosstalk all sixteen first level switches
are configured as T switches (see Figure 12).
With this method SW2 operates out of phase with SW1 and
SW3. In the on condition SW1 and SW3 are closed with SW2
open whereas in the off condition SW1 and SW3 are open
and SW2 closed. In the off condition the input to SW3 is
effectively the isolation leakage of SW1 working into the
on-resistance of SW2 (typically 200 ).

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Figure 13. Cross-Section of a Single

DMOS Switch

It can clearly be seen from Figure 13 that there exists a PN

junction between the substrate and the drain/source
terminals.
Should a signal which is negative with respect to the
substrate (GND pin) be connected to a source or drain
terminal, then the PN junction will become forward biased
and current will flow between the signal source and GND.
This effective shorting of the signal source to GND will not
necessarily cause any damage to the device, provided that
the total current flowing is less than the maximum rating, (i.e.,
20 mA).

Document Number: 70070

S-71241Rev. E, 25-Jun-07

DG535/536
Vishay Siliconix
DETAILED DESCRIPTION
Since no PN junctions exist between the signal path and V+,
positive overvoltages are not a problem, unless the
breakdown voltage of the DMOS drain terminal (see Figure
13) (+ 18 V) is exceeded. Positive overvoltage conditions
must not exceed + 18 V with respect to the GND pin. If this
condition is possible (e.g. transients in the signal), then a
diode or Zener clamp may be used to prevent breakdown.

An alternative method is to offset the supply voltages (see

Figure 15).

The overvoltage conditions described may exist if the

supplies are collapsed while a signal is present on the inputs.
If this condition is unavoidable, then the necessary steps
outlined above should be taken to protect the device

Level shifting of the logic signals may be necessary using

this offset supply arrangement.

Decoupling would have to be applied to the negative supply

to ensure that the substrate is well referenced to signal
ground. Again the capacitors should be of a type offering
good high frequency characteristics.

+ 12 V

DC Biasing
To avoid negative overvoltage conditions and subsequent
distortion of ac analog signals, dc biasing may be necessary.
Biasing is not required, however, in applications where
signals are always positive with respect to the GND or
substrate connection, or in applications involving
multiplexing of low level (up to 200 mV) signals, where
forward biasing of the PN substrate-source/drain terminals
would not occur.
Biasing can be accomplished in a number of ways, the
simplest of which is a resistive potential divider and a few dc
blocking capacitors as shown in Figure 14.

C1

100 F/16 V
Tantalum

R1
+
S

V+

C2
+

R2

DG536
GND

V+

DG536

Analog
Signal
OUT

GND

Decoupling
Capacitors

-3V

Figure 15. DG536 with Offset Supply

TTL to CMOS level shifting is easily obtained by using a

MC14504B.
Circuit Layout

+ 15 V

Analog
Signal
IN

Analog
Signal
IN

Analog
Signal
OUT

Good circuit board layout and extensive shielding is essential

for optimizing the high frequency performance of the DG536.
Stray capacitances on the PC board and/or connecting leads
will considerably degrade the ac performance. Hence, signal
paths must be kept as short as practically possible, with
extensive ground planes separating signal tracks.

100 F/16 V
Tantalum

Figure 14. Simple Bias Circuit

R1 and R2 are chosen to suit the appropriate biasing

requirements. For video applications, approximately 3 V of
bias is required for optimal differential gain and phase
performance. Capacitor C1 blocks the dc bias voltage from
being coupled back to the analog signal source and C2
blocks the dc bias from the output signal. Both C1 and C2
should be tantalum or ceramic disc type capacitors in order
to operate efficiently at high frequencies. Active bias circuits
are recommended if rapid switching time between channels
is required.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?70070.

Document Number: 70070

S-71241Rev. E, 25-Jun-07

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Legal Disclaimer Notice

Vishay

Disclaimer
All product specifications and data are subject to change without notice.
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(collectively, Vishay), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishays terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.

Document Number: 91000

Revision: 18-Jul-08

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