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DATA SHEET
book, halfpage
M3D087
1999 Apr 08
Philips Semiconductors
Product specification
FEATURES
PINNING
PIN
DESCRIPTION
base
2, 4
collector
emitter
APPLICATIONS
Audio, telephony and automotive applications
Thick and thin-film circuits.
handbook, halfpage
2, 4
DESCRIPTION
3
1
Top view
MAM288
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCBO
VCEO
PARAMETER
collector-base voltage
CONDITIONS
MIN.
MAX.
UNIT
open emitter
BCP51
45
BCP52
60
BCP53
100
BCP51
45
BCP52
60
BCP53
80
collector-emitter voltage
open base
VEBO
emitter-base voltage
IC
ICM
1.5
IBM
Ptot
Tstg
open collector
0.2
1.3
storage temperature
65
+150
Tj
junction temperature
150
Tamb
65
+150
Tamb 25 C; note 1
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see Thermal considerations for SOT223 in the General Part of associated
Handbook.
1999 Apr 08
Philips Semiconductors
Product specification
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
Rth j-a
Rth j-s
VALUE
note 1
UNIT
95
K/W
14
K/W
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see Thermal considerations for SOT223 in the General Part of associated
Handbook.
CHARACTERISTICS
Tamb = 25 C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
CONDITIONS
IE = 0; VCB = 30 V
100
nA
IE = 0; VCB = 30 V; Tj = 125 C
10
100
nA
IC = 5 mA
40
IC = 150 mA
63
250
IC = 500 mA
25
BCP53-10
63
160
100
250
IEBO
IC = 0; VEB = 5 V
hFE
DC current gain
hFE
MIN.
DC current gain
VCEsat
IC = 500 mA; IB = 50 mA
0.5
VBE
base-emitter voltage
fT
transition frequency
IC = 10 mA; VCE = 5 V;
f = 100 MHz
115
MHz
1999 Apr 08
Philips Semiconductors
Product specification
MBH730
160
VCE = 2 V
hFE
120
80
40
0
101
10
102
1999 Apr 08
103
IC (mA)
104
Philips Semiconductors
Product specification
PACKAGE OUTLINE
Plastic surface mounted package; collector pad for good heat transfer; 4 leads
SOT223
c
y
HE
v M A
b1
Q
A
A1
Lp
bp
e1
w M B
detail X
4 mm
scale
A1
bp
b1
e1
HE
Lp
mm
1.8
1.5
0.10
0.01
0.80
0.60
3.1
2.9
0.32
0.22
6.7
6.3
3.7
3.3
4.6
2.3
7.3
6.7
1.1
0.7
0.95
0.85
0.2
0.1
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
96-11-11
97-02-28
SOT223
1999 Apr 08
EUROPEAN
PROJECTION
Philips Semiconductors
Product specification
DEFINITIONS
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Apr 08
Philips Semiconductors
Product specification
1999 Apr 08
Internet: http://www.semiconductors.philips.com
SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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